Talk:Tape-out

message: A plausibly looking myth ... preserved here for interest
* this was not a myth -- see below MFago 00:40, 19 September 2007 (UTC)
thread_title:  Myth 

message: I agree with this history; one would first do a sketch and a schematic design, and then proceed to do a "tape out" with colored transparent adhesive tape onto clear plastic sheets.  In this sense, the tapeout was the layout phase, while now it refers to the end generation of the tape (or more recently, transmitted datafile), after layout had been complete.
Steve P. —The preceding unsigned comment was added by 71.141.253.203 (talk) 07:45, 20 March 2007 (UTC)
thread_title:  taping out a chip 

message: * I'm not sure about IC's, but circuit boards used to be "taped out" by laying down adhesive tape onto clear plastic sheets. I've done it (sad but true).
So if this was also true for chips, isn't the article false?!
MFago 23:47, 18 September 2007 (UTC)
thread_title:  taping out: disputed/unreferenced 

message: Tapeouts are some of the most stressful deadlines possible since so many people are involved and a single mask set costs over a million dollars. Because of this, divorce rates are much higher during tapeouts.  —Preceding unsigned comment added by Quanticles (talk • contribs) 14:03, 9 October 2008 (UTC)
thread_title:  tapeout's toll on engineers 

message: This page no longer says what was disputed - maybe this: I always thought "tape out" was the act of plotting the CIF file or whatever from the data tapes (as was done decades ago) to generate mask artwork for photographic reduction. While the adhesive tape explanation makes possibly more sense, I've designed a lot of PCBs in my time and never ever heard the corresponding process (as described here and in the references) referred to as "tape-out". Maybe I'm too young, but unlikely because I remember using "tape and donuts"! In fact the process (including design which was integral with artwork creation) was known as "layout" (as it is now for the CAD design stage), presumably because of "laying out" the tape (but it could just as easily be from working out the "layout" of the design as in printing etc). Maybe bigger jobs (which would have included ICs) separated this into layout and tapeout. Maybe it's a country thing (I'm in NZ), but AFAIK "layout" is an internationally used term and "tapeout" only really applies to IC design? The reference(s) seem to be written by someone with similar experience to me, so might be just an opinion too. I guess it doesn't really matter, but I did come here to learn the origin of the term, and I'm leaving with more questions than answers. I could have just read a novel (but being an engineer I'm unlikely to ever do that!). --Adx (talk) 15:15, 13 February 2011 (UTC)
thread_title:  computer tape? 

message: At IBM a tape-out is called a RIT (release interface tape), RIT-A for the non-metallic structure and RIT-B for the metal layers. Even though it is internal use it can be found on the web quite a bit, in papers, patents and lectures---and IBM represents a significant share of the industry. Not sure if that makes it relevant enough to be mentioned. --EnOreg (talk) 15:28, 6 February 2014 (UTC)
thread_title:  RIT 

message: The following Wikimedia Commons file used on this page has been nominated for deletion:
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Participate in the deletion discussion at the nomination page. —Community Tech bot (talk) 15:52, 14 June 2019 (UTC)
thread_title:  A Commons file used on this page has been nominated for deletion 

message: There are other descriptions about the use of rubylith, rather credible: in these stories the rubylith was not "taped", but instead on the large rybylith sheet the non-conductor areas were mad transparent by scraping off the light-blockinmg red layer of rubylith reaving the tranparent bottom layer. So the etymology of "tape out" must be scrutinized further. The History of the Semiconductor Photomask: From Rubylith to EUV. (And in fact this in written in our "photomask" article. - Altenmann >talk 05:49, 16 October 2023 (UTC)
thread_title: Rubylith