Talk:Thermal paste

message: This is almost entirely historical, now, but it may be worth mentioning the Beryllium-based compounds and the associated health risks.  This is worthy of note to anybody about to dismantle something particularly old, or possibly some modern high-performance equipment.  This might also be the right place to clear up some of the confusion about the hazards of different types of heatsink compound.  Research would have to be done into the pervasiveness. --ToobMug 02:12, 3 March 2006 (UTC)
replies: text: Separate section or in an existing section? Any idea what Beryllium compound looks like or what the risks are? I knew someone who was convinced Zinc compounds were carcinogenic (worried the hell out of me, as an electronics professional who deals with zinc compound daily), until I read otherwise.  —Preceding unsigned comment added by Jp adelaide (talk • contribs) 13:20, 30 September 2007 (UTC)

text: On that note, can't find any references to beryllium compound, only washers used to electrically insulate high performance transistors and its use in heatsink copper alloys. Need some info on this subject because google came up wit zip  —Preceding unsigned comment added by Jp adelaide (talk • contribs) 18:31, 30 September 2007 (UTC)
replies: text: I too have only ever heard of solid beryllium insulators - never a paste. If there is a paste, a note on toxicity would be welcome. If there isn't, well, it probably shouldn't be mentioned then. Snakeburger (talk) 22:41, 10 July 2012 (UTC)
thread_title: Berylium

message: The thermal conductivity of 132 W/m*K of sodium fluoride seems much to high and there's no reference.
The related Sodium chloride has a thermal conductivity of 6.5 W/m*K @ 20°C, so I think the given value is way off.  — Preceding unsigned comment added by 84.226.237.70 (talk) 16:36, 14 January 2013 (UTC)
thread_title: Sodium Fluoride

message: Thermal greases are definitely a type of thermal interface material (TIM), and I believe that Thermal Grease should be integrated with this topic.
Further, TIMs and Heat sinks are subsets of the category of Thermal Management of Microelectronics and Optoelectronics.
CarlZweben 22:01, 5 March 2007 (UTC)
replies: text: I'm inclined to agree that the pages should be merged.  I would guess that the other page happened because the author couldn't find this one (I very nearly started a page for the same reason).  Thermal grease has the the longer edit history and so I would suggest that it be the target of the merger, even if it is then renamed to "thermal interface material" (I have no preference on the name).  The procedure is documented at Wikipedia:Merging_and_moving_pages#Proposing_a_merger, but it seems to imply that if I put the tags in then I'd end up being responsible for the merger.  I'm too lazy for that.  --ToobMug 10:51, 1 July 2007 (UTC)

text: I will also agree to the merger. I thought it would be a good idea awhile back. I'll have to mull this over, as I now have more Wikipedia experience under my belt, (but still short of mastering the art). I regularly run into thermal grease and other thermal interface materials (pads) used almost interchangeably. Further, I see grease and foil used together. My gut feelings run against doing anything merge wise with the heat sink article; though I'm open to hearing any ideas. I was involved in the x86-64, AMD 64, Intel 64 merge. Anyone can place the merge tags and anyone can do the merge, you you just want to get enough voices heard so that the merge is not reverted. Even with the higher profile of x86-64, it was hard to get people to comment in the volume I thought it deserved, and after several months we had to "just do it". --Charles Gaudette 19:36, 1 July 2007 (UTC)
replies: text:  while heat sink compound is used with computers, it's most common use continues to be in electronics. Focussing entirely on CPU use might miss some important information.  —Preceding unsigned comment added by 58.167.197.212 (talk) 11:40, 27 September 2007 (UTC)
replies: text:  Well, merge then! 5 months is a long time to decide what to do! Meanwhile I've updated the best I can the English and meaning to avoid focus on CPU use and make clearer and easier to read (and more graceful) various parts of this article which should be tagged something to indicate poor quality.  —Preceding unsigned comment added by Jp adelaide (talk • contribs) 13:32, 30 September 2007 (UTC)
thread_title: Merge with [[thermal interface material]]

message: Very simplistic and misleading and presents itself as a pivotal key to understanding of thermal compounds and doesn't provide references. Removed bit about AMD recommending avoidance of wax based compounds: AMD's aging Athlon XP engineering guide recommends against all non-drying (ie silicone based) compounds. With the large area metal 'heat spreader' type chips this is no longer a problem brought up by manufacturers and, frankly, who knows what they will recommend in a few years time. Should this be a general guide or a specific one kept up to minute in regard to emerging technology & trends?
As to liquid metals: provide a reference and, verily, it shalt be very good and go in, possibly as a 4th category if we HAVE to separate categories of compound.  —Preceding unsigned comment added by Jp adelaide (talk • contribs) 13:42, 30 September 2007 (UTC)
thread_title:  Basic types needs revising 

message: :Image:IBMxenon.jpg is being used on this article. I notice the image page specifies that the image is being used under fair use but there is no explanation or rationale as to why its use in this Wikipedia article constitutes fair use. In addition to the boilerplate fair use template, you must also write out on the image description page a specific explanation or rationale for why using this image in each article is consistent with fair use.
Please go to the image description page and edit it to include a fair use rationale. Using one of the templates at Wikipedia:Fair use rationale guideline is an easy way to insure that your image is in compliance with Wikipedia policy, but remember that you must complete the template. Do not simply insert a blank template on an image page.
If there is  other fair use media, consider checking that you have specified the fair use rationale on the other images used on this page.  Note that any fair use images lacking such an explanation can be deleted one week after being tagged, as described on criteria for speedy deletion. If you have any questions please ask them at the Media copyright questions page. Thank you.
BetacommandBot (talk) 18:48, 2 January 2008 (UTC)
thread_title: Fair use rationale for Image:IBMxenon.jpg

message: Is it just me, or does anyone else think the external references "AI Technology Cool Silver Thermal Interface Material by Shane Higgins" and "Latest Thermal Compound Faceoff by Joe Anderson" both look like the same paid endorsement? Granted, the competitor Arctic Silver was gently warned for blatant advertising, but that's still no excuse.
74.248.228.204 (talk) 02:12, 3 June 2008 (UTC)
thread_title:  Ad-like? 

message: "High temperatures cause semiconductors to change their switpoint of failure..."
This doesn't appear to be correct...but what should it be?  Seems to have been in there forever, but the only place you can find this word in google is in a reference to this article!
--199.126.14.213 (talk) 06:11, 29 October 2008 (UTC)
thread_title:  Switpoint? 

message: "Because thermal grease's thermal conductivity is poorer than the metals they couple, it is important to use no more than is necessary to exclude air gaps."
This sentence from the article seems completely unverified. Especially since heatsinks are attached with some pressure. It seems rather unlikely that fresh thermal grease would some how force the heatsink and CPU apart rather than getting extruded out the sides. My conjecture would be that keeping the layer thin helps avoid dreaded bubbles. That said, I couldn't find any tests on the subject. 203.184.31.43 (talk) 18:06, 4 January 2009 (UTC)
thread_title:  Use sparingly? 

message: This section has claims of a test conducted with ointment, but has no references to it. I only post this in the Discussion section because I couldn't find the [citation needed] option in the Edit window.  —Preceding unsigned comment added by Munozdj (talk • contribs) 16:21, 10 August 2010 (UTC)
thread_title:  Practical Use 

message: The thermal conductivities of liquids are notably low relative to solids.  The thermal conductivity of water (0.6) is higher than almost all other ordinary liquids, and almost any additions to water (salt etc) lower the thermal conductivity.  Why?
These two references have tables and relevant practical discussions:
The Best Heat Transfer Fluids for Liquid Cooling
An Overview of Liquid Coolants for Electronics Cooling
-96.237.79.6 (talk) 03:27, 27 September 2010 (UTC)
thread_title:  Liquids 

message: The symbol W/mK could mean "watts per millikelvin" or "watts per metre kelvin". Could the symbol be changed to make it clear what the which meaning is intended?  — Preceding unsigned comment added by 129.215.139.65 (talk) 15:01, 9 January 2012 (UTC)
replies: text: Done.  The correct units are watt per meter kelvin or W/(K·m) since thermal conductivity is a measure of the quantity of heat that passes through a given material thickness per unit time. --BBUCommander (talk) 21:01, 26 March 2013 (UTC)
thread_title:  Units of thermal conductivity 

message: The concept of having a section on "metal-free" thermal paste seems silly. If you're going to have this section, at least specify what category its under. Ceramics already are metal free, so odds are the citation at the end of the "metal-free" blurb was just a ceramic thermal paste. Random2001 (talk) 21:04, 22 January 2013 (UTC)
thread_title:  Metal-Free 

message: There is still a lot of debate on whether a thermal paste should be reapplied after every few years or not. Some say that pastes dry up while others argue that it is not a lubricant that is supposed to stay wet. As long as the source and heat sink never separate or move, the paste would last for even 10-15 years. Can someone clarify? With newer materials being created, it differs on the thermal paste. The term lifespan can be replaced by; shelf life.— Preceding unsigned comment added by 122.172.165.252 (talk) 08:41, 1 October 2016 (UTC)
thread_title:  Longevity 

message: I'm finding a lot of statements on heat sink compounds regarding environmental hazards. For example, superlube silicone heat sink compound is zinc oxide filled, and supposedly it IS the zinc oxide that makes it hazardous. Even though it's the active ingredient in diaper cream and sunscreen. Is there a missing component here? What's the deal on this? I also heard rumors that ALL of this stuff is potentially nasty. And that some of the old stuff was potentially nutrive for fungus (heat sink rott?)  I'm not qualified to write this in to the article, but surely there's more information? Bad or not, it's definitely making it in to landfills. 
* Aquatic Chronic 3 H412 Harmful to aquatic life with long lasting effects.
* H412 Harmful to aquatic life with long lasting effects.
 CAS: 1314-13-2
 EINECS: 215-222-5
 Index number: 030-013-00-7
 zinc oxide
 < 2,5%
* Aquatic Acute 1, H400; Aquatic Chronic 1, H410
 CAS: 25322-69-4
 NLP: 500-039-8
 Poly(proylene glycol) < 2,5%''
Last I knew zinc oxide and glycol were relatively benign.
--98.148.84.86 (talk) 19:14, 6 June 2018 (UTC)
thread_title:  Environmental Hazards 

message: The following Wikimedia Commons file used on this page or its Wikidata item has been nominated for speedy deletion:
* 
You can see the reason for deletion at the file description page linked above. —Community Tech bot (talk) 13:22, 6 March 2020 (UTC)
thread_title:  A Commons file used on this page or its Wikidata item has been nominated for speedy deletion