Talk:Whisker (metallurgy)

message: Material from Tin whisker contributed by 68.163.158.93 merged  — PhilHibbs | talk 10:51, 10 Jan 2005 (UTC)
thread_title: Tin whiskers

message: Unlike zinc whiskers, tin whiskers don't have to be airborne to damage equipment, as they are typically already growing in an environment where they can produce short circuits.
:Implies that zinc whiskers have to be airborne to cause short circuits. This is wrong; while zinc whiskers may certainly move around via air currents, they cause short circuits only when embedded in electrical circuits. Also, air currents aren't the only way that zinc whiskers move around. I'm really surprised that you (Christopher Thomas) forced this issue to the talk page. It's a very simple point. The article is more clear without this sentence, it is not needed and should be omitted for clarity. --Duk 16:46, 6 January 2006 (UTC)
thread_title:  delete this sentence, it is wrong and not needed 

message: Are they related in any way to Ice Spikes? --82.36.20.32 00:20, 20 March 2006 (UTC)
replies: text: From what I understand, no, not really. Ice spikes are non-crystalline projections caused by mechanical stresses and failure during the freezing process. Tin and zinc whiskers seem to be single-crystal growths forming after the freezing process by diffusion at room temperature. However, the impression I get from the articles is that metal whisker growth is poorly understood, so it's possible that I'm wrong about some of the details. --Christopher Thomas 18:52, 14 April 2006 (UTC)
thread_title: Ice spikes

message: Germanium whiskers may be worth noting here too. --Trɔpʏliʊm • blah 15:23, 3 September 2009 (UTC)
thread_title:  Germanium 

message: Does potting a circuit in wax or polymer reduce or prevent whisker growth from the circuit traces? Or can the crystalline growths "burrow" through potting?
In the case of raised floors releasing airborne whisker fragments, even a simple spray coating of polyurethane on circuit boards to insulate them would prevent shorting due to Zinc whiskers. The fibers might blow into equipment but would rest on top of the insulating polyurethane layer.
Alternately, the underside of metal raised-floor tiles might be spray coated with poly or simply covered with adhesive plastic to prevent whisker separation from the tile. They may grow under the plastic but cannot become airborne.
Potting and coating does make circuit repair and modification much more difficult, but usually with manufactured devices it tends to be more common for a design to be frozen in place permanently.
DMahalko (talk) 11:06, 16 September 2009 (UTC)
thread_title:  Effect of circuit potting and spray-coating? 

message: http://nepp.nasa.gov/WHISKER/photos/pom/2004april.htm seems to suggest that even lead can not prevent but only mitigate the problem. Conversely, galvanic soldering seems to make things much worse and hot dip soldering can largely prevent whiskers even without lead. This article reads much differently than the German one which suggests to me that at least one of them is politically charged and playing the problem up/down. --Mudd1 (talk) 22:02, 10 July 2012 (UTC)
thread_title:  Mitigation and limits 

message: The photo shown in the article appears to be dendrites due to their branching structure similar to the copper ones shown here: http://nepp.nasa.gov/whisker/dendrite/index.html and not whiskers as shown here: http://nepp.nasa.gov/whisker/background/index.htm --108.72.214.22 (talk) 05:16, 14 October 2012 (UTC)
thread_title:  Possibly inaccurate photo 

message: I don't have time to "do it right" but recent research needs to be incorporated into the article, preferably by someone who knows something about the phenomenon.  Some useful links: USC doctoral student unravels 'tin whisker' mystery, Evaluation of local strain evolution from metallic whisker formation (abstract/paywalled). davidwr/(talk)/(contribs)/(e-mail) 04:54, 19 December 2012 (UTC)
replies: text: Unpaywalled copy of the paper is available here http://sti.srs.gov/fulltext/SRNL-STI-2011-00284.pdf --Nessunome (talk) 00:06, 20 September 2013 (UTC)
thread_title:  New research 

message: Please resist contributing to the misinformation surrounding Toyota Camry unintended acceleration recalls. Tin whiskers were *not* responsible for failures despite a few at NASA attempting to find otherwise. NHTSA, NASA, and Toyota all concur on this. Thanks! Prosecreator (talk) 21:51, 11 April 2014 (UTC)
thread_title:  Toyota Unintended Acceleration Myth 

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thread_title:  External links modified 

message: With the long and relatively trouble-free record of tin-lead alloy solder in the electronics industry, why isn't there any mention of the mitigating effect of a two metal (or more) solid solution versus a polycrystalline single metal? 2600:100B:B13C:9AD7:0:C:51D0:D01 (talk) 22:23, 19 April 2024 (UTC)
thread_title:  Alloy whiskers