Talk:Ball grid array

message: When is the industry going to recognize this? THIS COST CUTTING BS IS BAD.  There are way too many failures and lifespan issues with this stupid technology.  I hope there is alternative.  Why can't pins be made just like for CPU's? Go back to pins. BGA is awful and a backward  anachronism.--65.26.30.35 (talk) 07:55, 19 May 2018 (UTC)
thread_title:  UNRELIABLE,TOO MANY DISADVANTAGES AND FAILURES. WE NEED ALTERNATIVE.

message: I put some sample instructions for re-balling and it has been removed! It is useful and relevant information. Please justify.
I just added an xray photo of the BGA joints - does that help? DJGB 09:29, 11 October 2006 (UTC)
thread_title: Untitled

message: Does anybody knows, whether it is possible to test a BGA housing (contacting the balls) and afterwards to solder it normally to a PCB. Or is the BGA destroyed by testing, which would be a disadvantage as it would not be possible to do a final product verification of a BGA packaged device. Michilans (talk) 16:30, 2 December 2008 (UTC)
thread_title:  Do not touch the balls? 

message: There is a much sharper X-ray image at http://upload.wikimedia.org/wikipedia/commons/6/61/X-Ray_USB-Stick_Intenso_High-Speed_32GB_broken.jpg It is still unclear (to me at least) how the bond wires reach the balls. 69.239.104.44 (talk) 13:50, 18 June 2010 (UTC)
thread_title:  Sharper X-ray 

message: If someone knows and have a bit to tell about the development of the BGA package. Please add it & references. Electron9 (talk) 20:40, 22 March 2008 (UTC)
thread_title:  History? 

message: What about these?
For example, what's the exact difference between BGA & uBGA ?
Like, if pitch is bigger than 0.5mm it's BGA, but if it's 0.5mm or smaller it's uBGA, or what?
If you remove the solder, from a BGA chip, are there bumps, or just pads ? Like a PCB has it's pads flat against the board substrate.
--DaveDodgy (talk) 14:05, 23 April 2008 (UTC)
thread_title:  uBGA/μBGA/micro BGA/TinyBGA(TM) 

message: What's the finest pitch a (μ)BGA chip has been made ? As in, the width of the pad & the spacing between pads (centres, not edge to edge).--DaveDodgy (talk) 18:25, 10 May 2008 (UTC)
thread_title:  Finest pitch 

message: Article: "BGAs do not have this problem, because the solder is sometimes factory-applied to the package in exactly the right amount." So, do they sometimes not have the problem because sometimes this is done and sometimes for other reasons? Or do they sometimes have the problem because the factory didn't apply the solder?
--128.197.11.28 (talk) 14:51, 4 August 2008 (UTC)
thread_title:  Sometimes? 

message: * Some external links is useless for article. Need cleanup...--Berserkerus (talk) 16:05, 15 November 2008 (UTC)
thread_title:  External links 

message: The first sentence of the Discussion section is "The BGA is descended from the pin grid array (PGA)". I disagree. Soldering and inserting pins into sockets are two different ways of making electrical connections, but one is not a descendant of another anymore than a car is a descendant of a horse (two different means of transportation).
Additionally, the grammar is incorrect: "is descended" should be changed either to "is a descendant" or to just "descended".  —Preceding unsigned comment added by 74.96.187.144 (talk) 18:51, 14 November 2009 (UTC)
thread_title:  BGA lineage 

message: The Balls are numbered in the following way ... (Sorry I don't have any idea ...)  — Preceding unsigned comment added by 2A02:1205:5019:C900:1D3F:3BA4:61B6:30CC (talk) 02:03, 6 December 2016 (UTC)
thread_title:  Ball Numbering System 

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thread_title:  External links modified