Talk:Thermal management (electronics)

message: I disagree with deleting this article. Where else will you put stuff on heatsinking and fan cooling of electronic equpt etc. If you can come up with an alternative page title, I'm willing to listen . Otherwise, please leave this page alone.--Light current 01:19, 23 March 2006 (UTC)
thread_title: Untitled

message: I really do think this stuff doesn't belong here. Where it does belong is a matter of opinion. 8-(--Light current 02:51, 7 January 2007 (UTC)
thread_title:  REmoved from page, pending rewriting and severe editing 

message: Against — perhaps Electronics needs weeding and an article named "Thermal management of electronic devices and systems" makes sense (maybe), but merging Heat sink here is "biting off your nose to spite your face"! See also: WP:NOSE. The heat sink article is about the objects: heat sinks; the same way we have the article Arrow and the article Hunting. A closer match is this article and Computer cooling, but that is not a merge suggestion on my part, just a note-worth observation. --Charles Gaudette 09:29, 7 January 2007 (UTC)
thread_title:  "Heat sink" to "Thermal management of electronic devices and systems" merge discussion 

message: Given the response here I have moved the merge template to the "Use in electronics" section, please discuss! - Zephyris Talk 16:00, 6 March 2007 (UTC)
thread_title: [[Heatsink#Use in electronics]]

message: This article fails to discuss managing heat by not generating it in the first place.  This can be acheived by controlling the clock rate (if appropriate), lowering operating voltage, and changing the fabrication parameters and techniques.  I think that some modern computers have a variety of dynamic down-clocking and fallback clocking systems to avoid overheating.  I don't know if it's better to rename or to expand the article.  If I can find an appropriate clean-up tag that doesn't prescribe an action then I'll add it here. --ToobMug 09:42, 1 July 2007 (UTC)
thread_title:  Content is more specialised than page title 

message: Whoever did this merge on 14 September 2007 should log-in and be accountable. This is not right. Heat sink is a topic that stands on its own. --Charles Gaudette 08:03, 22 September 2007 (UTC)
thread_title:  Disappointed that an anonymous person merged the "Heat sink" article into this namespace 

message: Convective air cooling and forced air cooling do not appear to be accurate. 
From what I can tell, convective air cooling refers to the natural convective cooling of a device. The heading should read "Natural convection cooling", and the language edited to clarify it.
Forced air cooling does not sound remotely accurate. It sounds more like a ventilation practice than forced convection. Tjcognata (talk) 01:22, 30 April 2008 (UTC)
thread_title:  Convective/forced air cooling 

message: A Thermal Interface Material or Mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.[citation needed]
I'm want to flag gaps filled with air.
I don't know about you, but every gap between a processor and heatsink I have seen has some form of thermal paste; not air. This isn't only found in custom built PC's and I would consider it industry standard. Someone might want to verify this and apply wiki standards on it.  — Preceding unsigned comment added by 131.238.51.159 (talk) 14:24, 10 January 2012 (UTC)
thread_title:  These gaps are normally filled with air which is a very poor conductor 

message: The first picture: "courtesy of NCI." Is this an encyclopedia or a sponsored news article?  — Preceding unsigned comment added by 208.85.168.103 (talk) 09:04, 7 July 2015 (UTC)
thread_title:  Sponsor? 

message: Compared to other Wikipedia pages, the title of this one is unusually long. Couldn't this more simply be titled "Thermal Management"? Then, of course, clarify what thermal management means and that this article is about thermal management of electronic devices and systems. 
Apspowerengineer (talk) 18:46, 19 January 2016 (UTC)
replies: text: I agree it's long, but Thermal management already exists as a disambiguation page for all topics about thermal management of things. And as it's not the only page on thermal management, I guess it shouldn't be moved there. Joseph2302 (talk) 18:01, 25 January 2016 (UTC)
thread_title:  Change title name 

message: In section "Methodologies", subsection "Construction and materials", second paragraph the heat conductivities of boron arsenide and boron phosphide are specified in "W/mK", which would read "Watts per Millikelvin". This is wrong and should be replaced by "W/(m*K)", the unit used in case of copper and silver earlier in the same paragraph. — Preceding unsigned comment added by Tadaa3x (talk • contribs) 15 November 2018 (UTC)
: Done The previous notation wasn't exactly wrong, but it was definitely confusing and your proposal clears that up. —KuyaBriBriTalk 14:50, 15 November 2018 (UTC)
thread_title: Please correct units

message: Most electric cars have thermal management systems for their batteries, not just "some." That is why Nissan has much higher battery degradation than the competition: they have chosen to go against the industry norm. Please edit this to reflect the reality of the issue. We could also link to the Leaf issues. B5429671 (talk) 08:37, 10 August 2019 (UTC)
thread_title:  Most EVs have thermal management, not "some" 

message: Heat dissipation does not apply to electronics alone. See also Talk:Heat dissipation Peter Horn User talk 22:05, 29 March 2021 (UTC)
thread_title:  Bad redirect 

message: Overheating (electricity)  — Preceding unsigned comment added by 2001:14BA:9C36:5100:0:0:0:97B (talk) 00:58, 6 December 2021 (UTC)
thread_title:  link to