KOMMISSION DER EUROPÄISCHEN GEMEINSCHAFTEN 
Brüssel, den 05.03.1997 
KOM(97)96 endg. 
97/0082 (ACC) 
97/0083 (ACC) 
Vorschlag fur einen 
BESCHLUSS DES RATES 
über die Beseitigung der Zölle auf Waren der Informationstechnologie 
Vorschlag für einen 
BESCHLUSS DES RATES 
über die Beseitigung der Zölle auf bestimmte Spirituosen 
(von der Kommission vorgelegt) 

BEGRÜNDUNG 
Aufseiner Sondertagung am 13. Dezember 1996 in Singapur billigte der Rat zum einen 
eine Ministererklärung über den Handel mit Waren der Informationstechnologie und 
begrüßte zum anderen die mit den Vereinigten Staaten von Amerika erzielte bilaterale 
Vereinbarung (unter Genehmigungsvorbehalt), der zufolge die Zölle auf sogenannte 
"braune" Spirituosen schneller abgebaut werden sollen, als dies in der Uruguay-Runde 
vereinbart wurde, und auch die Zölle auf andere Spirituosen beseitigt werden sollen. 
Im Zusammenhang mit dem Übereinkommen über die Informationstechnologie (ITA) 
ist daran zu erinnern, daß am 3. Dezember 1995 auf dem Gipfeltreffen EU-USA eine 
Neue Transatlantische Agenda unterzeichnet wurde, in der beide Seiten unter anderem 
erklärten: " Angesichts der Bedeutung der Informationsgesellschaft leiten wir eine 
spezifische Maßnahme in die Wege, um zu versuchen, ein Übereinkommen über die 
Informationstechnologie zu schließen. " Auf der parallelen Tagung des Transatlantischen 
Unternehmerdialogs wurde diese politische Verpflichtung bekräftigt, indem die 
Teilnehmer feststellten: "Die überwältigende Mehrheit ist der Ansicht, daß das ITA-Paket 
die Verpflichtung beinhalten sollte, alle Zölle spätestens bis zum Januar 2000 zu 
beseitigen". 
Nach Sondierungsgesprächen mit mehreren Drittländern und Erörterungen im Ausschuß 
nach Artikel 113 EG-Vertrag schlug die Kommission dem Rat am 22. Oktober 1996 die 
Annahme eines Beschlusses vor, um Verhandlungen mit Drittländern über den Abschluß 
eines Übereinkommens über die Informationstechnologie aufzunehmen. Der Rat faßte den 
entsprechenden Beschluß am 15. November 1996. 
Die plurilateralen Verhandlungen führten am 13. Dezember 1996 in Singapur zur 
Annahme einer Ministererklärung, in der 15 WTO-Mitglieder bzw. beitrittswillige 
Staaten/Zollgebiete (Australien, Kanada, Taiwan, Europäische Gemeinschaften, 
Hongkong, Island, Indonesien, Japan, Korea, Liechtenstein, Norwegen, Singapur, 
Schweiz, Türkei, Vereinigte Staaten von Amerika) die Beseitigung der Zölle auf die in 
den Anlagen genannten Waren der Informationstechnologie bis zum Jahr 2000 (in vier 
gleichen Raten) vereinbarten. In diesem Zusammenhang ist insbesondere auf Absatz 4 der 
Modalitäten im Anhang zur Erklärung hinzuweisen: 
"4. Die Teilnehmer kommen so bald wie möglich und in jedem Fall spätestens am 1. April 1997 
zusammen, um die eingegangenen Annahmeerklärungen zu überprüfen und die daraus zu 
ziehenden Schlüsse zu beurteilen. Die Teilnehmer setzen die in der Erklärung vorgesehenen 
Aktionen um, sofern bis dahin so viele Länder ihre Annahme notifiziert haben, daß ungefähr 90 % 
des Welthandels1 mit Waren der Informationstechnologie erfaßt werden und sofern die Abfolge der 
Senkungen zur Zufriedenheit der Teilnehmer vereinbart wurde. Bei der Prüfung der Frage, ob die 
in der Erklärung vorgesehenen Aktionen auch dann umzusetzen sind, wenn der Anteil der 
Teilnehmer am Welthandel mit Waren der Informationstechnologie leicht unter 90 % liegt, 
können die Teilnehmer auch berücksichtigen, in welchem Maße Staaten oder gesonderte 
Zollgebiete teilnehmen, mit denen sie den wesentlichen Anteil ihres Handels mit diesen Waren 
abwickeln. Auf dieser Tagung legen die Teilnehmer fest, ob diese Kriterien erfüllt sind." 
Am 31. Januar 1997 wurden die im Rahmen der Ministererklärung vorgesehenen 
plurilateralen technischen Gespräche abgeschlossen. Zwar wurde die Liste der 
einzubeziehenden Waren erörtert, doch wurden die ursprünglichen Anlagen zur 
Ministererklärung nicht geändert. Die Gesprächsteilnehmer kamen überein, die erste 
Runde von Konsultationen über die Einbeziehung weiterer Waren am 1. Oktober 1997 
aufzunehmen; gleichzeitig wurde (unter Genehmigungsvorbehalt) Einvernehmen über die 
von einigen ursprünglichen Unterzeichnern der Ministererklärung beantragte "zeitliche 
Streckung" der Zollsenkungen erzielt. Dies betraf Indonesien, Korea und Taiwan. 
Außerdem wurde die Ministererklärung auch von Neuseeland (das keine "besondere 
Abfolge der Zollsenkungen" beantragte) und Costa Rica (dessen Antrag auf "besondere 
Abfolge der Zollsenkungen" zuvor von den übrigen Teilnehmern gebilligt wurde) 
angenommen. 
Gemäß den Schlußfolgerungen des Rates auf der Sondertagung vom 13. Dezember 1996 
in Singapur muß vor der Prüfung der Unterlagen der Teilnehmer, die spätestens bis zum 1. 
April 1997 abzuschließen ist, ein Ratsbeschluß ergehen, um das Übereinkommen 
endgültig und rechtsverbindlich für die Gemeinschaft zu genehmigen. Dieser Beschluß 
hängt davon ab, daß der vereinbarte Prozentsatz des Welthandels mit Waren der 
Informationstechnologie vom Übereinkommen erfaßt wird und Einvernehmen über die 
1 Dieser Prozentsatz wird vom WTO-Sckretariat auf der Grundlage der zum Zeitpunkt des 
Treffens neuesten Daten ermittelt. 
4> 
"zeitliche Abfolge" der Zollsenkungen erzielt wird. Bei dem beiliegenden Beschlußentwurf 
wird davon ausgegangen, daß beide Kriterien erfüllt werden. Sollte dies bis Ende März 
nicht der Fall sein, müßte die Angelegenheit überprüft werden. 
Im Bereich der Spirituosen verbessert die Vereinbarung mit den Vereinigten Staaten von 
Amerika nach Auffassung der Kommission spürbar die Exportchancen der EU. Die 
Kommission wird sich weiterhin darum bemühen, auch andere Parteien in diese 
Vereinbarung einzubeziehen. 
Auf dieser Grundlage übermittelt die Kommission dem Rat die beiliegenden zwei 
Beschlußentwürfe. 
«* 
Vorschlag 
Beschluß des Rates 97/0082 (ACC) 
über die Beseitigung der Zölle auf Waren der Informationstechnologie 
DER RAT DER EUROPÄISCHEN UNION -
gestützt auf den Vertrag zur Gründung der Europäischen Gemeinschaft, insbesondere auf 
Artikel 113 in Verbindung mit Artikel 228 Absatz 2 Satz 1, 
auf Vorschlag der Kommission, 
in Erwägung nachstehender Gründe: 
In der Neuen Transatlantischen Agenda, die auf dem Gipfeltreffen EU-USA am 13. 
Dezember 1995 in Madrid angenommen wurde, vereinbarten beide Seiten zu versuchen, 
ein Übereinkommen über die Informationstechnologie zu schließen. 
Nach Berichten der Kommission über ihre Sondierungsgespräche mit Drittländern 
beschloß der Rat am 16. November 1996 die Aufnahme von Verhandlungen mit 
Drittländern über den Abschluß eines Übereinkommens über die Informationstechnologie. 
Am 13. Dezember 1996 billigte die Europäische Gemeinschaft in Singapur die 
Ministererklärung über den Handel mit Waren der Informationstechnologie. In dieser 
Erklärung sind bestimmte Voraussetzungen für die Beseitigung der Zölle auf Waren der 
Informationstechnologie festgelegt. Diese Voraussetzungen sind erfüllt -
BESCHLIESST: 
Artikel I 
Das Übereinkommen in Form der am 13. Dezember 1996 in Singapur abgegebenen 
Ministererklärung über den Handel mit Waren der Informationstechnologie wird im 
Namen der Gemeinschaft genehmigt. 
Der Wortlaut des Übereinkommens ist diesem Beschluß beigefügt. 
Artikel 2 
Gemäß Absatz 4 des Anhangs zur Ministererklärung: 
(i) nimmt der Rat zur Kenntnis, daß Teilnehmer, auf die ungefähr 90 % des Welthandels 
mit Waren der Informationstechnologie entfallen, ihre Annahme notifiziert haben, und 
(ii) genehmigt im Namen der Gemeinschaft die von bestimmten Teilnehmern beantragte 
Abfolge der Zollsenkungen. 
Artikel 3 
Der Rat ermächtigt die Kommission, der Welthandelsorganisation die im Anhang 
beigefügten Änderungen der Liste der Europäischen Gemeinschaft zu übermitteln, um die 
betreffenden Zölle im Einklang mit der Ministererklärung zu binden und zu beseitigen. 
Artikel 4 
Der Präsident des Rates wird ermächtigt, die Person zu bestellen, die befugt ist, das 
Übereinkommen/Protokoll rechtsverbindlich für die Gemeinschaft zu unterzeichnen. 
Geschehen zu Brüssel 
Im Namen des Rates 
Der Präsident 
5 
MINISTERERKLARUNG ÜBER DEN HANDEL MIT WAREN 
DER INFORMATIONSTECHNOLOGIE 
13.12.1996 
Die Minister -
in Vertretung der folgenden Mitglieder der Welthandelsorganisation (WTO) und 
der Staaten und gesonderten Zollgebiete auf dem Weg des Beitritts zur WTO, die in 
Singapur die weltweite Ausweitung des Handels mit Waren der Informationstechnologie 
vereinbart haben und die weit mehr als [80] Prozent des weltweiten Handels mit diesen 
Waren auf sich vereinen (im folgenden "Vertragsparteien" genannt): 
Australien Japan 
Kanada Korea 
Taiwan Norwegen 
Europäische Gemeinschaften Singapur 
Hongkong Schweiz1 
Island Türkei 
Indonesien Vereinigte Staaten 
in Anbetracht der wesentlichen Rolle des Handels mit Waren der 
Informationstechnologie für die Entwicklung der Informationsindustrie und für das 
dynamische Wachstum der Weltwirtschaft; 
in Anerkennung des Ziels, den Lebensstandard zu erhöhen und die Produktion von 
Waren sowie den Handel mit ihnen auszuweiten; 
in dem Wunsch, die größtmögliche Freiheit im Handel mit Waren der 
Informationstechnologie zu erreichen; 
in dem Wunsch, die technische Entwicklung der Informationsindustrie weltweit zu 
fördern; 
eingedenk des positiven Beitrags der Informationstechnologie zum weltweiten 
Wirtschaftswachstum und Wohlergehen; 
einig in dem Entschluß, die Ergebnisse dieser Verhandlungen umzusetzen, die 
zusätzliche Zugeständnisse zu denjenigen in den Listen umfassen, die dem Protokoll von 
Marrakesch zum Allgemeinen Zoll- und Handelsabkommen 1994 als Anlage beigefügt 
sind; 
in der Erkenntnis, daß die Ergebnisse dieser Verhandlungen auch gewisse 
Zugeständnisse umfassen, die in den Verhandlungen gemacht wurden, die zu der 
Aufstellung der Listen geführt haben, die dem Protokoll von Marrakesch beigefügt sind -
Für die Zollunion Schweiz und Liechtenstein. 
erklären: 
1. Die Handelsregelungen einer jeden Vertragspartei sollten sich so entwickeln, daß 
der Marktzugang für Waren der Informationstechnologie verbessert wird. 
2. Gemäß den im Anhang dieser Erklärung ausgeführten Modalitäten bindet und 
beseitigt jede Vertragspartei die Zölle und die anderen Abgaben und Belastungen jeder 
Art im Sinne des Artikels II Absatz 1 Buchstabe b) des Allgemeinen Zoll- und 
Handelsabkommens 1994 für folgende Waren: 
(a) alle Waren, die gemäß dem Harmonisierten System (1996) ("HS") in die 
Positionen eingereiht oder einzureihen sind, die in der Anlage A zum 
Anhang dieser Erklärung aufgeführt sind; 
(b) alle in der Anlage B zum Anhang dieser Erklärung aufgeführten Waren, 
unabhängig davon, ob sie in der Anlage A aufgeführt sind oder nicht; 
dies erfolgt durch Senkung der Zollsätze in gleichen Raten in den Jahren 1997 bis 2000; 
wobei es unter bestimmten Umständen erforderlich sein kann, die Abfolge der Senkungen 
zeitlich zu strecken und, vor der Umsetzung, den Geltungsbereich zu erweitern. 
3. Die Minister geben ihrer Genugtuung über den umfassenden Geltungsbereich der 
Anlagen zum Anhang dieser Erklärung Ausdruck. Sie weisen ihre jeweiligen Beamten an, 
sich nach Kräften dafür einzusetzen, daß die plurilateralen technischen Gespräche in Genf 
auf der Grundlage dieser Modalitäten bis zum 31. Januar 1997 abgeschlossen werden, 
damit möglichst viele Teilnehmer diese Erklärung umsetzen. 
4. Die Minister ersuchen die Minister der anderen WTO-Mitglieder und die Staaten 
oder gesonderten Zollgebiete auf dem Weg des Beitritts zur WTO, ihren jeweiligen 
Beamten ähnliche Anweisungen zu geben, so daß sie an den in Absatz 3 genannten 
technischen Gesprächen teilnehmen und an der Ausweitung des weltweiten Handels mit 
Waren der Informationstechnologie in vollem Umfang teilhaben können 
Anhang: Modalitäten und Geltungsbereich 
Anlage A: Liste der HS-Positionen 
Anlage B: Warenliste 
7 
ANHANG 
Modalitäten und Geltungsbereich 
Jedes Mitglied der Welthandelsorganisation und jeder Staat oder jedes gesonderte 
Zollgebiet auf dem Weg des Beitritts zur WTO kann gemäß den folgenden Modalitäten an 
der Ausweitung des weltweiten Handels mit Waren der Informationstechnologie 
teilnehmen: 
1. Jeder Teilnehmer nimmt die in Absatz 2 der Erklärung beschriebenen Maßnahmen 
in seine Liste der Zugeständnisse zum Allgemeinen Zoll- und Handelsabkommen 1994 auf 
und zusätzlich entweder in seinen eigenen amtlichen Zolltarif oder in irgendeine andere 
veröffentlichte Fassung des Zolltarifs, je nachdem, welcher normalerweise von den 
Einführern und den Ausführern verwendet wird, entweder unter den entsprechenden 
Positionen des eigenen Zolltarifs oder unter den sechsstelligen Codes des Harmonisierten 
Systems (1996) ("HS"). Die Teilnehmer, die nicht WTO-Mitglieder sind, setzen diese 
Maßnahmen, solange ihr WTO-Beitritt aussteht, autonom um und nehmen sie in ihre 
WTO-Zugeständnisliste für den Marktzugang auf. 
2. Zu diesem Zweck übermittelt jeder Teilnehmer allen anderen Teilnehmern so bald 
wie möglich und in jedem Fall bis zum 1. März 1997 Unterlagen mit (a) Erläuterungen zur 
genauen Anwendung der entsprechenden Zölle im Rahmen seiner WTO-Zugeständnisliste 
und (b) einer Liste mit den genauen HS-Positionen der in der Anlage B aufgeführten 
Waren. Diese Unterlagen werden bis spätestens 1. April 1997 geprüft und durch Konsens 
genehmigt. Sobald diese Prüfung abgeschlossen ist, werden die betreffenden Unterlagen 
als Änderung der Liste des betreffenden Teilnehmers gemäß dem Beschluß über die 
Verfahren zur Änderung und Berichtigung der Listen der Zugeständnisse vom 26. März 
1980 (BISD 27S/25) eingereicht. 
(a) Durch die von jedem Teilnehmer zur Änderung seiner Liste 
vorzuschlagenden Zugeständnisse sind alle Zölle und andere Abgaben und 
Belastungen jeder Art auf Waren der Informationstechnologie wie folgt zu 
binden und zu beseitigen: 
(i) Sofern von den Teilnehmern kein anderes Verfahren vereinbart 
wird, werden diese Zölle durch Senkung der Zollsätze in gleichen 
Raten stufenweise beseitigt. Sofern von den Teilnehmern nicht 
anders vereinbart, bindet jeder Teilnehmer alle Zölle auf die in den 
Anhängen aufgeführten Artikel spätestens zum 1. Juli 1997 und 
nimmt die erste Senkung spätestens am 1. Juli 1997, die zweite 
Senkung spätestens am 1. Januar 1998 und die dritte Senkung 
spätestens am 1. Januar 1999 vor, so daß die Zölle spätestens am 1. 
Januar 2000 vollständig beseitigt sind. Die Teilnehmer kommen 
überein, unabhängig davon eine Beseitigung der Zölle schon vor 
diesen Zeitpunkten zu fördern Der gesenkte Zollsatz ist bei jeder 
Rate auf die erste Dezimalstelle abzurunden; 
H 
(ii) die Beseitigung dieser Zölle und Abgaben jeder Art im Sinne des 
Artikels II Absatz 1 Buchstabe b) des Allgemeinen Abkommens 
soll bis spätestens 1. Juli 1997 abgeschlossen sein, außer in 
Ausnahmefällen, die von dem betreffenden Teilnehmer in den 
Unterlagen darzulegen sind, die den anderen Teilnehmern zur 
Prüfung vorgelegt werden. 
(b) Mit den Änderungen, die ein Teilnehmer zur Bindung und Beseitigung 
seiner Zollsätze auf Waren der Informationstechnologie vorschlägt, soll 
folgendes Ergebnis erzielt werden: 
(i) Im Falle der in der Anlage A genannten HS-Positionen werden, 
soweit angebracht, Unterpositionen in seiner Liste entsprechend 
den Unterpositionen des nationalen Zolltarifs geschaffen; 
(ii) im Falle der in der Anlage B aufgeführten Waren wird seiner Liste 
ein Anhang beigefügt, der für alle Waren der Anlage B die genauen 
HS-Positionen entweder in Form der entsprechenden Zollinie des 
nationalen Zolltarifs oder des entsprechenden sechsstelligen HS-
Codes angibt. 
Sobald die vorgeschlagenen Änderungen in Kraft getreten sind, ändert jeder 
Teilnehmer unverzüglich seine nationale Zugeständnisliste. 
3. Die Teilnehmer kommen unter der Schirmherrschaft des Rates für Warenverkehr 
regelmäßig zusammen, um den Geltungsbereich der Anhänge zu überprüfen und durch 
Konsens zu beschließen, ob die Anhänge aufgrund der technischen Entwicklung, der 
Erfahrungen bei der Anwendung der Zollzugeständnisse oder der Änderungen der HS-
Nomenklatur geändert und durch neue Waren ergänzt werden sollten, und um über die 
nichttarifären Handelshemmnisse bei Waren der Informationstechnologie Konsultationen 
zu führen. Diese Konsultationen berühren nicht die Rechte und Pflichten im Rahmen des 
WTO-Übereinkommens 
4. Die Teilnehmer kommen so bald wie möglich und in jedem Fall spätestens am 1. 
April 1997 zusammen, um die eingegangenen Annahmeerklärungen zu überprüfen und die 
daraus zu ziehenden Schlüsse zu beurteilen. Die Teilnehmer setzen die in der Erklärung 
vorgesehenen Aktionen um, sofern bis dahin so viele Länder ihre Annahme notifiziert 
haben, daß ungefähr 90 % des Welthandels2 mit Waren der Informationstechnologie 
erfaßt werden und sofern die Abfolge der Senkungen zur Zufriedenheit der Teilnehmer 
vereinbart wurde. Bei der Prüfung der Frage, ob die in der Erklärung vorgesehenen 
Aktionen auch dann umzusetzen sind, wenn der Anteil der Teilnehmer am Welthandel mit 
Waren der Informationstechnologie leicht unter 90 % Hegt, können die Teilnehmer auch 
berücksichtigen, in welchem Maße Staaten oder gesonderte Zollgebieten teilnehmen, mit 
denen sie den wesentlichen Anteil ihres Handels mit diesen Waren abwickeln. Auf dieser 
Tagung legen die Teilnehmer fest, ob diese Kriterien erfüllt sind. 
2 Dieser Prozentsatz wird vom WTO-Sekretariat auf der Grundlage der zum Zeitpunkt des Treffens 
neuesten Daten ermittelt. 
<) 
5. Die Teilnehmer kommen so oft wie notwendig und spätestens am 30. September 
1997 zusammen, um alle Meinungsverschiedenheiten bei der Einreihung der Waren der 
Informationstechnologie, angefangen von den in der Anlage B aufgeführten Waren, zu 
prüfen. Die Teilnehmer kommen überein, daß es ihr gemeinsames Ziel ist, soweit 
angebracht, unter Berücksichtigung der Auslegungen und Entscheidungen des Rates fur 
die Zusammenarbeit auf dem Gebiet des Zoliwesens (auch bekannt als WCO -
Weltzollorganisation) eine gemeinsame Einreihung dieser Waren in der bestehenden HS-
Nomenklatur zu erreichen. Sollten Meinungsverschiedenheiten über die Einreihung 
fortbestehen, prüfen die Teilnehmer, ob der WCO ein gemeinsamer Vorschlag zur 
Überarbeitung der HS-Nomenklatur oder zur Lösung des Problems durch eine 
entsprechende Auslegung der HS-Nomenklatur vorzulegen ist. 
6. Die Teilnehmer gehen davon aus. daß Artikel XXIII des Allgemeinen Abkommens 
für den Fall anwendbar ist, daß Vorteile, die sich mittelbar oder unmittelbar aus der 
Umsetzung dieser Erklärung für ein teilnehmendes WTO-Mitglied ergeben, aufgrund der 
Anwendung einer Maßnahme durch ein anderes teilnehmendes WTO-Mitglied zunichte 
gemacht oder geschmälert werden, unabhängig davon, ob diese Maßnahme mit den 
Bestimmungen des Allgemeinen Abkommens kollidiert oder nicht. 
7. Jeder Teilnehmer prüft Anträge anderer Teilnehmer auf Konsultationen über die 
oben ausgeführten Verpflichtungen wohlwollend. Diese Konsultationen berühren nicht die 
Rechte und Pflichten im Rahmen des WTO-Übereinkommens. 
8. Die Teilnehmer, die unter der Schirmherrschaft des Rates für Warenverkehr 
handeln, unterrichten die anderen WTO-Mitglieder sowie die Staaten oder gesonderten 
Zollgebiete auf dem Weg des Beitritts zur WTO über diese Modalitäten und leiten 
Konsultationen ein, um deren Teilnahme an der Ausweitung des Handels mit Waren der 
Informationstechnologie auf der Grundlage dieser Erklärung zu erleichtern. 
9. Im Sinne der vorliegenden Modalitäten bezeichnet der Ausdruck "Teilnehmer" 
jene WTO-Mitglieder und Staaten oder gesonderte Zollgebiete auf dem Weg des Beitritts 
zur WTO, die die in Absatz 2 genannten Unterlagen bis spätestens 1. März 1997 
einreichen. 
10. Dieser Anhang steht allen WTO-Mitgliedern und jedem Staat oder gesonderten 
Zollgebiet auf dem Weg des Beitritts zur WTO zur Annahme offen. Die Annahme ist dem 
Generaldirektor schriftlich zu notifizieren, der seinerseits alle Teilnehmer hiervon 
unterrichtet. 
1 
JL 
Page 6 
There are two attachments to the Annex. 
Attachment A lists the HS headings or parts thereof to be covered. 
Attachment B lists specific products to be covered by an ITA wherever they are classified in the 
HS . 
Attachment A, Section 1 
ex HS96 
3818 
8469 
8470 
8470 
8470 
8470 
8470 
8470 
8470 
8470 
8471 
8471 
8471 
8471 
8471 
8471 
8471 
8471 
8471 
8471 
8472 
8473 
8473 
8473 11 
10 
21 
29 
30 
40 
50 
90 
10 
30 
41 
49 
50 
60 
70 
80 
90 
90 
21 
29 
30 HS description 
Chemical elements doped for use in electronics, in form of discs, wafers or similar 
forms; chemical compounds doped for use in electronics 
Word processing machines 
Calculating machines and pocket-size data recording, reproducing and displaying 
machines with a calculating function; accounting machines, postage franking machines, 
ticket-issuing machines and similar machines, incorporating a calculating devices; cash 
registers: 
Electronic calculators capable of operating without an external source of electric power and 
pocket size data recording, reproducing and displaying machines with calculating functions 
Other electronic calculating machines incorporating a printing device 
Other • 
Other calculating machines 
Accounting machines 
Cash registers 
Other 
Automatic data processing machines and units thereof; magnetic or optical readers, 
machines for transcribing data onto data media in coded form and machines for 
processing such data, not elsewhere specified or included: 
Analogue or hybrid automatic data processing machines 
Portable digital automatic data processing machines, weighing no more than 10 kg, 
consisting of at least a central processing unit, a keyboard and a display 
Other digital automatic data processing machines comprising in the same housing at least a 
central processing unit and an input and output unit, whether or not combined 
Other digital automatic data processing machines presented in the form of systems 
Digital processing units other than those of subheading 8471 41 and 8471 49, whether or 
not in the same housing one or two of the following types of units : storage units, input 
units, output units 
Input or output units, whether or not containing storage units in the same housing 
Storage units, including centra! storage units, optical disk storage units, hard disk drives and 
magnetic tape storage units 
Other units of automatic data processing machines 
Other 
Automatic teller machines 
Parts and accessories of the machines of heading No 8470 of the electronic calculating 
machines of subheading 8470 10, 8470 21 and 8470 29 
Parts and accessories of the machines of heading No 8470 other than the electronic 
calculating machines of subheading 8470 10, 8470 21 and 8470 29 
Parts and accessories of the machines of heading No 8471 
11 
Page 7 
ex 
ex 
ex 
ex 
ex 
ex 
ex 
ex 
ex 
ex 
ex 8473 
8504 
8504 
8517 
8517 
8517 
8517 
8517 
8517 
8517 
8517 
8517 
8518 
8518 
8518 
8520 
8523 
8523 
8523 
8523 
8523 
8524 
8524 
8524 
8524 
8424 
8525 
8525 
8525 
8527 
8529 50 
40 
50 
11 
19 
21 
22 
30 
50 
80 
90 
10 
30 
29 
20 
11 
12 
13 
20 
90 
31 
39 
46 
91 
99 
10 
20 
40 
90 
10 Parts and accessories equally suitable for use with machines of two or more of the 
headings Nos. 8469 to 8472 
Static converters for automatic data processing machines and units thereof, and 
telecommunication apparatus 
Other inductors for power supplies for automatic data processing machines and units 
thereof, and telecommunication apparatus 
Electrical apparatus for line telephony or line telegraphy, including line telephone sets 
with cordless handsets and telecommunication apparatus for carrier-current line 
systems or for digital line systems; videophones: 
Line telephone sets with cordless handsets 
Other telephone sets and videophones 
Facsimile machines 
Teleprinters 
Telephonic or telegraphic switching apparatus 
Other apparatus, for carrier-current line systems or for digital line systems 
Other apparatus including entry-phone systems 
Parts of apparatus of heading 8517 
Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not 
exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use 
Line telephone handsets 
Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a 
diameter of not exceeding 50 mm, for telecommunication use 
Telephone answering machines 
Magnetic tapes of a width not exceeding 4 mm 
Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm 
Magnetic tapes of a width exceeding 6,5 mm 
Magnetic discs 
Other 
Discs for laser reading systems for reproducing phenomena other than sound or image 
Other : 
- for reproducing representations of instructions, data, sound, and image, recorded in 
a machine readable binary form, and capable of being manipulated or providing 
interactivity to a user, by means of an automatic data processing machine 
Magnetic tapes for reproducing phenomena other than sound or image 
Media for reproducing phenomena other than sound or image 
Other : 
- for reproducing representations of instructions, data, sound, and image, recorded in 
a machine readable binary form, and capable of being manipulated or providing 
interactivity to a user, by means of an automatic data processing machine 
Transmission apparatus other than apparatus for radio-broadcasting or television 
Transmission apparatus incorporating reception apparatus 
Digital still image video cameras 
Portable receivers for calling, alerting or paging 
Aerials or antennae of a kind used with apparatus for radio-telephony and 
radio-telegraphy 
-4 
1 
Page 8 
ex 
ex 
ex 
ex 
ex 
ex 
ex 8529 
8531 
8531 
8532 
8532 
8532 
8532 
8532 
8532 
8532 
8532 
îmr~" 
8532 
8533 
8533 
8533 
8533 
8533 
8533 
8533 
8533 
8534 
8536 
§5^6 
8536 
8536 
8536 
8541 
8541 
8541 
8541 90 
20 
90 
10 
21 
22 
23 
24 
25 
29 
30 
90 
10 
21 
29 
31 
39 
40 
90 
50 
50 
50 
69 
90 
10 
21 
29 Parts of: 
transmission apparatus other than apparatus for radio-broadcasting or television 
transmission apparatus incorporating reception apparatus 
digital still image video cameras, 
portable receivers for calling, alerting or paging 
Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes 
(LED) 
Parts of apparatus of subheading 8531 20 
Electrical capacitors, fixed, variable or adjustable (pre-set): 
Fixed capacitofTcfesigned for use in 50/60 Hz circuits and having a reactive power handling 
capacity of not less than 0,5 kvar (power capacitors) 
Tantalum fixed capacitors 
Aluminium electrolytic fixed capacitors 
Ceramic dielectric, single layer fixed capacitors 
Ceramic dielectric, multilayer nxed capacitors 
Dielectric fixed" capacitors of paper or plasties 
OtherTïxeS capacitors 
Variable or adjustable (pre-set) capacitors 
Parts 
Electrical resistors (including rheostats and potentiometers), other than heating 
resistors: 
Fixed" carbon resistors, composition or film types 
Other fixed resistors~Tor a power hanclling capacity not exceeding 20 W 
Other fixed resistors Tor a powerTandling capacity of 20 W or more 
Wirewound variable resistors, including rheostats and potentiometers, for a power handling 
capacity not exceeding 20 W 
Wirewound variable resistors, including rheostats and potentiometers, for a power handling 
capacity of 20 W or more 
Ötner variable resistors, including rheostats and potentiometers 
Pans 
Printed circuits 
Electronic AC switches consisting of optically coupled input and output circuits 
(Insulated thyristor AC switches) 
Electronic switches, including temperature protected electronic switches, consisting of a 
transistor and a logic chip (chip-on-chip technology) for a voltage not exceeding 1000 
volts 
Electromechanical snap-action switches for a current not exceeding 11 amps 
Plugs and sockets for co-axiai cables and printed circuits 
Connection and contact elements lor wires and cables 
Diodes, transistors and similar semiconductor devices; photosensitive semiconductor 
devices, including photovoltaic cells whether or not assembled in modules or made up 
into panels; light-emitting diodes; mounted piezo-electric crystals: 
Diodes, other than photosensitive or light-emitting diodes 
Transistors, other than photosensitive transistors, with a dissipation rate of less than 1 W 
Transistors, other tri an photosensitive transistors, with a dissipation rate of 1 W or more 
-* «' I'I 
Page 9 
ex 
ex 
ex 
ex 
ex 8541 
8541 
8541 
8541 
8541 
8542 
8542 
8542 
8542 
8542 
8542 
8542 
8542 
8542 
8543 
8543 
8544 
8544 
8544 
8544 
9009 
9009 
9009 
9026 
9026 
9026 
9026 
9026 
9027 
9027 
9027 
9027 
9027 30 
40 
50 
60 
90 
12 
13 
14 
19 
30 
40 
50 
90 
81 
89 
41 
49 
51 
70 
11 
21 
90 
10 
20 
80 
90 
20 
30 
50 
80 
90 Thyristors, diacs and trîacs, other than photosensitive devices 
Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled 
in modules or made up into panels; light emitting diodes 
Other semiconductor devices 
Mounted piezo-electnc crystals 
Pans' 
Electronic integrated circuits and microassemblies 
Cards incorporating an electronic integrated circuit ('smart' cards) 
"Metaloxicle semiconductors (MOS technology) 
Circuits obtainedTy""bïpoTar technology 
Other monolithic digital in'egrated circuits, including circuits obtained by a combination of 
bipolar and MOS technologies (B1MOS technology) 
Other monolithic integrated circuits 
Hybrid integratea circuits 
Electronic microassemblies 
Part 
Proximity cards and tags 
Electrical machines with translation or dictionary functions 
Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a 
kind used for telecommunications 
Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors, 
of a kind used for telecommunications 
Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V, 
fitted with connectors, of a kind used for telecommunications 
Optical fibre cables 
Electrostatic photocopying apparatus, operating by reproducing the original image 
directly onto the copy (direct process)! 
Other photocopying apparatus, incorporating an optical system 
Parts and accessories 
Instruments and apparatus tor measuring or checking the flow, level, pressure or other 
variables of liquids or gases (for example, flow meters, level gauges, manometers, heat 
meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032: 
Instruments for measuring or checking the flow or level of liquids 
Instruments and apparatus for measuring or checking pressure 
Other instruments and apparatus for measuring or checking of heading 9026 
Parts and accessories of instruments and apparatus of heading 9026 
Chromatograph* and electrophoresis instruments 
Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, 
visible, IR) 
Other instruments and apparatus using optical radiations (UV, visible, IR) of heading 
No 9027 
Other instruments and apparatus of heading No 9027 (other than those of heading No 
9027 10) 
Parts and accessories of products of heading 9027, other than for gas or smoke 
analysis apparatus and microtomes 
u 
Page 10 
9030 40 Instruments and apparatus for measuring and checking, specially designed for 
telecommunications (for example, cross-talk meters, gain measuring instruments, 
distorsion factor meters, psophometers) 
1 f ) 
Page 11 
Attachment A, Section 2 
Semiconductor manufacturing and testing equipment and parts thereof 
HS Code Description 
"Quartz" reactor tubes and holders designed for insertion into diffusion and 
oxidation furnaces for production of semiconductor wafers Comments 
ex 7017 10 For Attachment B 
Chemical vapor deposition apparatus for semiconductor production ex 8419 89 For Attachment B 
Parts of chemical vapor deposition apparatus for semiconductor 
production ex 8419 90 For Attachment B 
Spin dryers for semiconductor wafer processing 8421 19 
Parts of spin dryers for semiconductor wafer processing 8421 9! 
8424 89 Deflash machines for cleaning and removing contaminants from the 
metal leads of semiconductor packages prior to the electroplating process 
8424 89 Spraying appliances for etching, stripping or cleaning semiconductor 
wafers ex 
Pans of spraying appliances for etching, stripping or cleaning 
semiconductor wafers 8424 90 
Machines lor working any material by removal of material, by laser or 
other light or photo beam in the production of semiconductor wafers 156 10 
Apparatus for stripping or cleaning semiconductor wafers ex 8456 91 For Attachment B 
Machines for dry-etching patterns on semiconductor materials 8456 91 
ex 8456 99 Focused ion beam milling machines to produce or repair masks and 
reticles for Dattems on semiconductor devices 
ex 8456 99 Lasercutters for cutting contacting tracks in semiconductor production by 
laser beam For Attachment B 
8464 10 Machines for sawing monocrystal semiconductor boules into slices, or 
wafers into chips For Attachment B 
Grinding, polishing and lapping machines for processing of semiconductor 
wafers 8464 20 
Dicing machines for scribing or scoring semiconductor wafers ex 
ex 8464 90 
Parts for machines for sawing "monocrystal semiconductor boules into 
slices, or wafers into chips For Attachment B 
For Attachment B 8466 91 
Parts of dicing machines Tor scribing or scoring semiconductor wafers ex 
ex 8466 91 
Parts of grinding" polishing and lapping machines for processing of 8466 91 
semiconductor wafers 
Parts of focused ion beam milling machines to produce or repair masks 
and reticles for patterns on semiconductor devices ex 8466 93 
8466 93 Parts of lasercutters for cutting contacting tracks in semiconductor 
production by laser beam For Attachment B 
8466 93 Parts of machines for working any material by removal of material, by 
laser or other light or photo beam in the production of semiconductor 
wafers 
ex 
ex 8456 93 "Parts of apparatus for stripping or cleaning semiconductor wafers 
Parts of machines for dry-ctcriTng patterns on semiconductor materials For Attachment B 
8466 93 
ex 
ex 8477 10 Encapsulation equipment forassembly of semiconductor: For Attachment B 
Tor Attachment B 8477 90 Parts ot encapsulation equipment 
4 
1 
Page 12 
ex 8479 50 Automated machines for transport, handling and storage of semiconductor" 
wafers, wafer cassettes, wafer boxes and other material for semiconductor 
devices 
Apparatus for growing or pulling monocrystal semiconductor boules 
Apparatus for physical deposition by sputtering on semiconductor wafers For Attachment B 
ex 
ex 8479 89 
8479 89 For Attachment B" 
Apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays ex 8479 89 For Attachment B 
Die attach apparatus, tape automated bonders, and wire bonders for 
assembly of semiconductors ex 8479 89 For Attachment B 
Encapsulation equipment for assembly of semiconductors 
Epitaxial deposition machines for semiconductor wafers ex 
ex 
ex 
ex 
ex 
ex 8479 89 For Attachment B 
8479 89 
Machines for bending, folding and straightening semiconductor leads 8479 89 
Physical deposition apparatus for for semiconductor production For Attachment B 
For Attachment B 8479 89 
Spinners for coating photographic emulsions on semiconductor wafers 
Part of apparatus for physical deposition by sputtering on semiconductor 8479 89 For Attachment 
For Attachment B 8479 90 
wafers 
Parts for die attach apparatus, tape automated bonders, and wire bonders 
for assembly of semiconductors ex 8479 90 For Attachment B 
Parts for spinners for coating photographuTemulsions on semiconductor 
wafers ex 8479 90 For Attachment B 
Parts of apparatus for growing or pulling monocrystal semiconductor 
boules ex 8479 90 
Parts of apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays ex 8479 90 For Attachment B 
Pans of automated rnacTiines~for transport, handling and storage of 
semiconductor wafers, wafer cassettes, wafer boxes and other material for 
semiconductor devices For Attachment B 8479 90 
"Parts of encapsulation equipment for assembly of semiconductors 
Parts of epitaxial aeposnionmachines for semiconductor wafers 8479 90 For Attachment B 
8479 90 
8479 90 
8479 90 Pans of machines for benomg, folding and straightening semiconductor 
leads 
Parts ofphysica! deposition apparatus for for semiconductor production 
Injection and compression moulds for the manufacture of semiconductor For Attachment B 
For Attachment B ex 
ex 8480 7: 
devices 
Resistance heated furnaces and ovens for the manufacture of 
semiconductor devices on semiconductor wafers ex 8514 10 
Inductance or dielectric furnaces and ovens for the manufacture of 
semiconductor devices on semiconductors wafers ex 8514 20 
8514 30 Apparatus for rapid heating of semiconductor wafers 
Parts of resistance heated furnaces and ovens for the manufacture of 
semiconductor devices on semiconductor wafers For Attachment B 
ex 8514 30 
For Attachment B ex 
ex 
ex 8514 90 Parts of apparatus for rapid heating of wafers 
Pans of furnaces and ovens o( Headings No 8514 10 to No 8514 30 8514 90 
8536 90 Wafer probers For Attachment B 
8543 11 Ion implanters for doping semiconductor materials 
Apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays For Attachment B ex 8543 30 
-if rn 
1 / 
Page 13 
Parts of apparatus for~wet etching, developing, stripping oF cleaning 
semiconductor wafers and flat panel displays ex 8543 90 For Attachment B 
ex 8543 90 Parts ofion implanters for doping semiconductor materials 
Apparatus tor projection, drawing or plating circuit patterns on sensitized 
semiconductor materials and flat panel displays 9010 41 to 
9010 49 
Tarts and accessories of the apparatus of Pleadings No 9010 4! to 9010 49 ex 
ex 9010 90 
Optical stereoTcopTTmlcroscopes fitted with equipment"specifically" 
designed for the handling and transport of semiconductor wafers or 
reticles 9011 10 For Attachment B 
Photomicrographic microscopes fitted with equipment specifically 
designed for the handling and transport of semiconductor wafers or 
reticles 9011 20 For Attachment B 
Parts and accessories of optical stereoscopic microscopes fitted with 
equipment specifically designed for the handling and transport of 
semiconductor wafers or reticles 9011 90 For Attachment B 
Parts and accessories of photomicrographic microscopes fitted with 
equipment specifically designed for the handling and transport of 
semiconductor wafers or reticles ex 9011 90 For Attachment B 
Electron beam microscopes fated with equipment specifically designed for 
the handling and transport of semiconductor wafers or reticles 9012 10 
Pans and accessories" of electron beam microscopes fitted with equipment 
specifically designed for the handling and transport of semiconductor 
wafers or reticles For Attachment B 
9012 90 For Attachment B 
Pattern generating apparatus of a kind used for producing masks or 
reticles from photoresist coated substrates 9017 20 For Attachment B 
Parts and accessories for pattern generating apparatus of a kind used for 
producing masks or reticles from photoresist coated substrates For Attachment B 
For Attachment B 9017 90 
Parts of such pattern generating apparatus 
Instruments and apparatus tor measuring or checking semiconductor 9017 90 
9030 82 
wafers or devices 
Parts and^cessoru:s"oTinstruments and apparatus for measuring or 
checking semiconductor wafers or devices 9030 90 
Parts of instruments and appliances for measuring or checking 
semiconductor wafers or devices 9030 90 
Optical instruments and" appliances for inspecting semiconductor wafers 
or devices or for inspecting masks, photomasks or reticles used in 
manufacturing semiconductor devices 9031 41 
ex 9031 49 optical instrument's and appliances for measuring surface particulate 
contamination on semiconductor wafers 
ex 9031 90 Pans and accessories ofoptical instruments and appliances for inspecting 
semiconductor wafers or devices or for inspecting masks, photomasks or 
reticles used in manufacturing semiconductor devices 
ex 9031 90 Parts and accessories of optical instruments and appliances for measuring 
surface particulate contamination on semiconductor wafers 
m 
Page 14 
Attachment B 
Positive list of specific products to be covered by this agreement wherever they are 
classified in the HS. 
Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to 
Section XVI and Chapter 90, respectively. 
Computers: automatic data processing machines capable of 1) storing the processing program or programs and at 
least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance 
with the requirements of the user; 3) performing arithmetical computations specified by the user; and 4) executing 
without human intervention, a processing program which requires them to modify their execution, by logical 
decision during the processing run. 
The agreement covers such automatic data processing machines whether or not they are able to receive and process 
with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally 
processed audio or video signals. Machines performing a specific function other than data processing, or 
incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified 
under Attachment A or B, are not covered by this agreement. 
Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts 
thereof 
Flat panel displays (including LCD, Electro Luminescence,"Plasma and other technologies) for products falling 
within this agreement, and pans thereof. 
Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those 
products dedicated for use solely or principally to permit the interconnection of automatic data processing machines 
and units thereof for a network that is used primarily for the sharing of resources such as central processor units, 
data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators, 
bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing 
machines and units thereof. 
Monitors : display units of automatic data pTocessing machines"with a cathode ray tube with a dot screen pitch 
smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally 
processed audio or video signals without assistance of a central processing unit of a computer as defined in this 
agreement. 
The agreement does not, therefore, cover televisions, including high definition televisions. 
Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives), whether 
or not having the capability of writing/recording as well as reading, whether or not in their own housings. 
Paging alert devices, and parts thereof . 
Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 
9017. 
Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external 
connections such as cards that conform to the PCMCIA standard. 
Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active 
elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors, and 
similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro 
assemblies of heading 8542. 
Projection type flat panel display units used with automatic data processing machines which can display digital 
information generated by the central processing unit. 
3 Participants will conduct a review of this product description in January 1999 under the consultation 
provisions of paragraph 3 of the Declaration 
i.! 
Page 15 
Proprietary format storage devices including media therefor for automatic data processing machines, with or 
without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or 
Zipdrive cartridge storage units. 
Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, 
consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP 
machines and units thereof to process audio signals (sound cards). 
Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for 
gaining access to the Internet, and having a function of interactive information exchange 
*>; 
EC - ITA - Schedule CXL 
CN 97 
3X1X nu 
IXIX (Ml 10 
38IX oo 90 
7020 00 
7020 00 05 
702" 00 10 
702-') oo 30 
7020 00 X0 
8419 
8419 89 
841989 10 
841989 15 
8419 89 20 
8419 89 25 
8419 89 30 
8419 89 95 
8419 90 
8419 90 10 
8419 90 20 Label Base Rate 
( hcmical elements doped lor use m elcelromes. mine formol 
(.lises, waters or similar lornis. ehemie.il compounds doped lor 
use in electronics 
I )oped silicon 6 9 
Other 6 9 
( )thcr articles ol glass 
Quart/ reactor tubes and holders designed lor insertion into 4 
diffusion and oxidation lurn.ices lor production ol semiconductor 
wafers 
Ol fused quart/ or other fused silica 
Of glass ha\ing a linear coefficient of expansion not exceeding 5 
x 10-6 per Kelvin within a temperature range of (I r'C to 300 °C 
Other 
Machiner., plant or laboratory equipment, whether or not 
eleeiricallv healed, for the treatment of materials b\ a process 
involving a change of temperature such as heating, cooking. 
roasting, distilling, rectifying, sterili/ing. pasteurizing, steaming. 
drying, evaporating, vapouri/.ing. condensing or cooling, other 
than machinery or plant of a kind used for domestic purposes: 
instantaneous or storage water heaters, non-electric : 
Other 
Cooling towers and similar plant for direct cooling (without a 
separating wall) by means of recirculated water 
Apparatus for rapid heating of semiconductor wafers free 
Apparatus for chemical vapour deposition on semiconductor free 
wafers 
Apparatus for phvsical vapour deposition b> electronic beam or free 
evaporation on semiconductor wafers 
Vacuum-vapour plant for the deposition of metal 
Other 
l'art s 
Of heat exchange units, for use in civil aircraft 
OfsubheadineX4|9 2()00 Final Bound 
Rate 
free 
free 
free Jul. 1997 
5.2 
5.2 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
3.0 3.5 
3.5 
2.0 I.7 
I.7 
I.O free 
free 
free 
free 
free 
free free 
free 
free free 
free 
free free 
free 
free free 
free 
free 
2\ ** vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 1 of 33 
CN97 
XI 19 90 10 
84 19 91) XI» 
XI2 I 
X42I 19 
X42I 19 10 
X42I 19 91 
84 21 19 93 
XI2 I 19 95 
X42I 19 97 
8421 91 10 
8421 91 <H) 
8421 99 00 
8424 
8424 89 
8424 89 20 
8424 89 30 
8424 89 80 
8424 90 
8424 90 10 
8424 90 90 
84 2 X Label 
I or apparatus ,.I'subheading X 1 I 9 X9 I s )(, X 119X9 2> 
Oilier 
( 'enlri luges including i cuir i lug al di \ er s 11 lier in L' or pun I v ing 
maclnncrv and apparatus, lor liquids or gases 
( Jihcr 
1 or use in civil .lirer.itl 
Other 
( entriluges t\\ a kind used m laboratories 
Ccntnlugcs ol a kind used m the inanulacturing ol 
semiconduciors w .iters 
Spinners lor coatine photographic emulsions on semieonduclor 
waters 
( Mlicr 
Other 
Parts 
Of centrifuges, including centrifugal drxers 
for apparatus of subheading 8421 19 93 and 8421 1995 
Other 
Other 
Mechanical appliances (whether or not hand-operated) lor 
projecting, dispersing or sprav ing liquids or powders; fire 
extinguishers, whether or not charged; sprav guns and similar 
appliances, steam or sand blasting machines and similar jet 
projecting machines : 
Other 
Sprav ing appliances for etching, stripping or cleaning 
semiconductor wafers 
Deflash machines for cleaning and removing contaminants from 
the metal leads of semiconductor packages prior to the 
electroplating process 
Other 
Parts 
Of apparatus of heading 8424 89 20 
Other 
Other lifting, handling, loading or unloading machineiv (for 
example, litis, escalators, coin ev ors. teleferics) Base Rate Final Bound 
Rate 
free 
15 
2.5 
free 
2.8 
*c vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj free-
free 
free 
free 
free Jul. 1997 
2.0 
! I 
1.9 
free 
2.1 
2 I Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
! -4 0.7 "" free 
free 
0.8 
1.3 
free 
1.4 
1.4 free 
0.4 
0.6 
0.7 free 
free 
free 
free free 
0.7 free 
free 
Page 2 of 33 
CN97 
X42X V) 
X42X 19 lo 
XI2X 3*>9| 
X42X 39 91 
X42X 39 9X 
X431 
843 I 39 
84 31 19 ID 
8431 39 20 
843 I 19X0 
X456 
8456 10 
8456 10 10 
8456 10 90 
8456 91 00 
8456 99 
8456 99 10 
8456 99 30 
8456 99 90 
8462 
8462 21 Label 
l Uhcr 
I or use m c i\ tl aire t all 
Other 
Roller coin ev ors 
\utoinaled material handling mac limes lor transport, handling 
and storage ol semiconductor walcrs. water cassettes, waler 
boxes and other in.tleual lor semiconductor dev ices 
( )lher 
Parts suitable for use solelv or pruuipallv with the maclnncrv of 
heading Nos XI2^ to XlKi 
Other 
( M rolling-mill machmerv ,-| subheading X I2X 90 3d 
Of machinerx ol heading X42X 39 93 
Other 
Machine-tools for working anv material bv removal of material, 
bv laser or other light or photon beam, ultrasonic electro-
discharge, electro-chemical, electron beam, ionic-beam or plasma 
arc processes 
Operated h\ laser or other light or photon beam processes 
Of a kind used in the manufacturing of semiconductor wafers or 
dev ices 
Other 
For dry-etching patterns on semiconductor materials 
Other 
Focused ion beam miling machines for producing or repairing 
masks and reticles for patterns on semiconductor dev ices 
Apparatus for stripping or cleaning semiconductor wafers 
Other 
Machine-tools (including presses) for working metal by forging, 
hammering or die-stamping; machine-tools (including presses) 
for working metal by bending, folding, straightening, flattening, 
shearing, punching or notching; presses for working metal or 
metal carbides, not specified above : 
Bending, folding, straightening or flattening machines (including 
presses) 
Numerical I v controlled Base Rate 
( ret 
1.6 
4.7 
free 
free 
free Final Bound 
Rate 
free 
free 
free 
free 
free 
free Jul. 1997 
free 
1.2 
3.5 
free 
free 
free Implementation 
Jan. 1998 Jan. 1999 
free 
0.8 
2.4 
free 
free 
free free 
free 
1.2 
free 
free 
free Jan. 2000 
free 
free 
free 
free 
free 
free 
rc vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 3 of 33 
CN97 
8462 2) 05 
X462 21 10 
8462 21 80 
8462 29 
X462 29 05 
8462 29 10 
8462 29 91 
8462 29 99 
8464 
8464 10 
8464 Id 10 
8464 10 90 
8464 20 
8464 20 05 
8464 20 11 
8464 20 19 
8464 20 80 
8464 90 
8464 90 10 
8464 90 90 
8466 
8466 91 
8466 91 15 
8466 91 20 
8466 91 95 Label 
of a kind used in ni.iniilat luring semiconductors leads 
I or working Hal products 
Other 
( )ther 
I or bending, folding and sir.lightening semicoiuliiclor leads 
l'or working Hal products 
Other 
I Iv draulic 
Other 
Machine-tools lor working sione. ceramics, concrete asbesios-
cemenl or like mineral materials or lor cold working glass 
Saw ing machines 
I or saw ing monocrv sial semiconductor boules into slices, or 
wafers into chips 
( )lher 
(irmdmg or polishing machines 
I or working semiconductor wafers 
lor working glass 
Optical glass 
Other 
Other 
Other 
For scribing or scoring semiconductor wafers 
Other 
Parts and accessories suitable for use soielv or principally with 
the machines of heading Nos 8456 to 8465. including work or 
tool holders, self-opening dieheads. dividing heads and other 
special attachments for machine-tools; tool holders (or any type 
of tool for working in the hand 
Other 
1 or machines of heading No 8464 
I or machines of subheadings 8464 10 10. 8464 20 05 or 8464 90 
10 
Of cast iron or cast steel 
Other Base Rate 
1 2 
17 
free 
free 
1.9 Final Bound 
Rate 
free 
free-
free 
free Jul. 1997 
2 4 
1.3 
free 
free 
free 
1.4 Implementation 
Jan. 1998 Jan. 1999 
1.6 0.8 
0.8 
free 
free 
free 
0.9 0.4 
free 
free 
free 
0.5 Jan.2000 
free 
free 
free 
free 
free 
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 4 of 33 
CN97 
8466 93 
X466 91 15 
X466 91 20 
8466 93 95 
8466 94 
8166 94 10 
8466 94 90 
8469 I I 00 
8470 
8470 10 
8470 10 10 
8470 10 90 
8470 21 00 
8470 29 00 
8470 30 00 
8470 40 00 
8470 50 00 
8470 90 00 
8471 
8471 10 
8471 10 10 
8471 10 90 Label Base Rate 
1 or machines o! heading \<- Xlv, to X16I 
I or machines M\,] .ipp.ir.üi^ ol subheadings X 156 Id Id X I5f> 9| | 9 
Oil. X I.Vi o>) |n ,,t s lso >>>/ lu 
t >l cast non or ca-l Meet 
< Ulier 
I or machines ol heading No X lo2 or X IM 
I or machines o| subheading X lo2 21 Os ,,r X 152 29 1)5 19 
Other 
Automatic typewriters and word-processing machines 
Word-processing machines 3.2 
Calculating machines and pocket-si/e data recording, reproducing 
and displaving machines with calculating functions; accounting 
machines, postage-franking machines, ticket- issuing machines 
and similar machines, incorporating a calculating device; cash 
registers : 
l.lectronic calculators capable of operation without an external 
source of electric power and pocket-si/e data recording. 
reproducing and dispUiv ing machines with calculating functions 
l.lectronic calculators capable of operation without an external 8.4 
source of electric power 
Pocket-size data recording, reproducing and displaying machines 5.0 
with calculating functions 
Other electronic calculating machines 
Incorporating a printing dev ice 8.4 
Other 8.4 
Other calculating machines 2.8 
Accounting machines 2.8 
Cash registers 2.8 
Other 2.8 
Automatic data-processing machines and units thereof; magnetic 
or optical readers, machines for transcribing data onto data media 
in coded form and machines for processing such data, not 
elsewhere specified or included ; 
Analogue or hvbrid automatic data-processing machines 
For use in civil aircraft free 
Other 3.5 Final Bound 
Rate 
tree 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj free 
free 
free 
free 
free 
free 
free 
free 
free 
free-
free Jul. 1997 
I 4 
1.4 
2.4 
6.3 
3.8 
6.3 
6.3 
2.1 
2.1 
2.1 
2.1 
free 
2.6 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
09 
09 
1.6 
4.2 
2.5 
4.2 
4.2 
1.4 
1.4 
1.4 
I.4 
free 
1.8 0.5 
0.5 
0.8 
2.1 
1.3 
2.1 
2.1 
0.7 
0.7 
0.7 
0.7 
free 
0.9 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free-
Page 5 of 33 
CN 97 
8471 10 00 
8 171 II 
84-1 41 10 
84^1 41 90 
84" I 49 
8471 49 10 
84" I 49 90 
84"! 50 
84" I 50 10 
84"! 50 90 
84"! 60 
8471 60 10 
8471 60 40 
8471 60 50 
8471 60 90 
8471 70 
8471 70 10 
84"! 70 40 
84" 1 70 51 
8471 70 53 
84" 1 "0 59 
84" I "0 60 Label 
Portable digital automatic data-processing machines weighing 
not more than Id kg. UHMVÜIII: ol al least a central processing 
unit, a kev board and a displav 
Oilier digital automatic data-processing machines 
(Umprising m the same housing at leasi a central processing unit 
and an input and output uni' whether or not combined 
I or use m civ il ancral't 
Other 
Other, presented in the form ol s\ sienis 
lor use m civ il aircrall 
Other 
Digital processing units oilier than those ol subheadings No 847| 
41 and 8471 49. whether or not containing in the same housing 
one or two of the follow mg iv pes ol unit storage units, input 
units, output units 
For use in civ il aircrall 
Other 
Input or output units, whether or not containing storage units in 
the same housing 
For use in civ il aircraft 
Other 
Printers 
Kev boards 
Other 
Storage units 
For use in civil aircraft 
Other 
Centra! storage units 
Other 
Disk storage units 
Optical, including magneto-optical 
Other 
I lard disk drives 
Other 
Magnetic tape storage units Base Rate Final Bound 
Rate 
free 
3 5 
free 
3 5 
free 
15 
2 
2 
2 
free free 
free-
free 
free-
free 
free-
free 
free 
free 
free 
free 
free-
free 
tree 
free Jul. 1997 
2.6 
Iree 
2.6 
free 
2.6 
free 
2.6 
free 
1.5 
1.5 
1.5 
free 
1.5 
1.5 
1.2 
15 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
18 0.9 free 
free 
1.8 
free 
1.8 
free 
free 
1.0 
1.0 
1.0 
free 
1.0 
0.8 
1.0 
10 free 
0.9 
free 
0.9 
free 
0.9 
free 
free 
free 
free 
free 
free 
free 
fret-
free 
free-free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
i\£ vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 6 of 33 
CN97 
8 171 70 9(1 
8471 X0 
8-171 80 10 
8471 80 90 
8471 90 00 
8472 
8472 90 
8472 90 10 
8472 90 30 
8472 90X0 
84 73 
8473 10 
8473 21 
8473 21 10 
8473 21 90 
8473 29 
8473 29 10 
8473 29 90 
8473 30 
8473 30 10 
8473 30 90 
8473 50 
8473 50 It) 
8473 50 90 
8477 
847" 10 Label 
( »her 
< lllier Minis (>| automatic data-processing machines 
Peripheral units 
I )ther 
Other 
( Mhcr office machines ( tor example, hectograph or stencil 
duplicating machines, addressing machines, automatic banknote 
dispensers, coin-sotting machines com- counling or wrapping 
machines, pencil-sharpening machines, perforating or stapling 
machines) 
Other 
Com-sorimg. coin-counling or coin-wrapping machines 
Automatic teller machines 
Other 
Pans and accessories (other than covers, carry ing cases and the 
iike) suitable for use soielv or principally with machines of 
heading Nos 8469 to 8472 : 
Parts and accessories of the machines of heading No 8470 
Of the electronic calculating machines of subheading 8470 10. 
8470 21 or 8470 29 
Fleclronic assemblies 
Other 
Other 
Electronic assemblies 
Other 
Parts and accessories of the machines of heading No 8471 
Electronic assemblies 
Other 
Parts and accessories equally suitable for use with machines of 
two or more of the headings Nos 8469 to 8472 
Fleclronic assemblies 
Other 
Machinerv for working rubber or plastics or for the manufacture 
of products from these materials, not specified or included 
elsewhere in this chapter : 
Injection-moulding machines Base Rate 
3.1 
4.3 
2.5 
3.4 
1.6 
3.3 
1.6 
3.4 
1.6 Final Bound 
Rate 
free-
free 
free-
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj frei 
free 
free 
free 
free 
free 
free-
free 
free Jul. 1997 
15 
15 
15 
15 
2.3 
3.2 
1.9 
2.5 
1.2 
2.5 
1.2 
2.5 
1.2 Implementation 
Jan. 1998 Jan. 1999 
1.0 free 
I.O 
l.O 
I.O 
1.6 
2.1 
1.3 
1.7 
0.8 
1.6 
0.8 
1.7 
0.8 tree 
free 
free 
0.8 
ll 
free 
0.8 
free 
0.8 
free 
0.8 
free Jan.2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
Page 7 of 33 
M 
<? 
CN 97 
817"? 10 Hi 
XP7 IO 90 
8477 5') 
8477 59 05 
8477 50 m 
8477 59 90 
8477 90 
84 7 7 90 04 
X 17"1 90 !(! 
84 7" 9!) 80 
84 "9 
XI "9 89 
84 "9 89 j!) 
8479 89 30 
8479 89 60 
8479 89 65 
8479 89 70 
8479 89 75 
8479 89 76 
8479 89 77 
8479 89 79 
8479 89 95 
8479 90 
8479 9ft |() Label 
I ncapsiilation cqiupincul lor a-.scmhl \ ol semiconductors 
I llher 
( Hher 
I ncapsulation equiprneni lor assembb o! seiniconduclors 
I 'r esses 
< Ulier 
Parts 
! or machines ol subheadings XI"" |o in and 8 I "7 59 05 
f M cas! iron or east steel 
( )iher 
Machines an..! mechanic a I appliances U.w mg mdi\ uiu.u I une lions. 
nul speeilied c included eUewhcre HI this eiiapter 
( )lhcr 
i he follow mg goods. !or use m civ i! ancra! i !;- dropneumatic 
baitencs. Mechanical acluators for thrust reversers; loilet units 
specially designed. Air humidifiers and dehumidillers; Servo-
mechanisms, nc.n-electric. Non-e!eclric Marier motors Pneumatic 
starters for lurbo-jets. turbo-jets, turbo-propellers and other gas 
turbines. Windscreen wipers, non-electric; Propelier regulators, 
non-electric 
Other 
Mobile hydraulic powered mine roof supports 
Central greasing systems 
Apparatus for growing or pulling monocrystal semiconductor 
boules 
Apparatus for epitaxial deposition on semiconductor wafers 
Apparatus for wet etching, developing, stripping or cleaning 
semiconduclor wafers 
Apparatus for wet etching, developing, stripping or cleaning 
liquid cry lal display substrates 
Die attach apparatus and tape automated bonders for the assembly 
of semiconductors 
Encapsulation equipment for assembly of semiconductors 
Other 
Parts 
I or use in civ il aircraft Base Rate 
Iree 
free 
2.8 
2.8 
2.8 Final Bound 
Rate 
Iree 
fret 
free 
free 
free 
frei Jul. 1997 
2.1 
free 
free 
free 
2.1 
2.1 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
E4 0.7 free 
1.4 
free 
free 
free 
1.4 
1.4 
1.4 free 
free 
free 
0.7 
0.7 
0.7 free 
free 
free 
free 
free 
free 
free 
> ^ vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 8 of 33 
CN 97 Label Base Rate 
( Mlier 
X479905H --- ( H machines ol sulmeadmgs XI"1» X'M-5 SI"') X9 "(i Xl"" X9 2X 
"5 X4"9 89 "(, X l~9 S'l " ,w X l"W X9 "9 
8479 91192 — Of casi iron or cast steel 
X479 90 9X — Oilier 
84X1) Moulding boxes lor metal foundry. mouKI bases, moulding 
pallerns. moulds lor meta! (ollier than ingot moulds), metal 
carbides, glass, mineral materials, rubber or plastic-« 
Moulds for rubber or plasties 
X4X0 7I -- Injection or compression t». pes 
X4X0 7I III --- of a kind used in ihc inaiiul.icluniig ol semiconductor dev ices 2 5 
X4Xd 71 9(1 — other 
8504 I leclncal iraiislormers. staue conveners (for example, rectifiers) 
and inductors 
8504 4(1 - Static converters 
8504 40 10 - For use in civ il aircraft 
( Mher 
Ol a kind used with telecommunication apparatus and automatic 
data-processing machines and units thereof : 
8504 40 30 — Power supply unils of a kind used with automatic data-processing 2 
machines 
8504 40 35 —- Other 4.6 
8504 40 50 — Poly crystalline semiconductors 
Other 
8504 40 93 — Accumulator chargers 
Other 
8504 40 94 Rectifiers 
Inverters 
8504 40 96 I laving a power handling capacity not exceeding 7.5 kVA 
8504 40 97 Having a power handling capacity exceeding 7.5 kVA 
8504 40 99 Other 
8504 50 - Other inductors 
8504 50 10 - lor use in civil aircraft 
Other Final Bound 
Rate 
free 
free 
free Jul. 1997 
2 I 
1.9 
1.5 
3.4 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
1.4 
1.3 
I.O 
2.3 0.7 
0.6 free 
free 
free free 
II free 
Ï«^ vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 9 of 33 
CN97 
8504 5() 10 
8504 50 80 
8514 
8514 10 
8514 10 05 
8514 10 10 
85)4 10 90 
85 14 20 
8514 20 05 
8514 20 10 
8514 20 90 
8514 30 
8514 30 11 
8514 30 19 
85143091 
8514 30 99 
8514 90 
8514 90 10 
8514 90 90 
8515 Label 
Ol ,i kind used lor télécommunication appâtai us and power 
supplies lor automatic data processing machines and unils ilieteol 
Other 
Industrial or lahoralorv electric (including induction or dielectric) 
furnaces and ovens, oihci iiuiiisiri.il or laboialorv induction or 
dielectric heating equipment 
Resistance healed furnaces and ovens 
For the manulaclure ol semiconductor devices on semiconductors 
wafers 
Other 
Hakery and biseuil o\ ens 
( )lher 
Induction or dielectric furnaces and ovens 
I or the manulaclure of semiconductor dev ices on semiconductors 
waters 
Other 
Induction furnaces and ovens 
Dielectric furnaces and ovens 
Other furnaces and ovens 
infra-red radiation ovens 
For the manufacture of semiconductor devices on semiconductor 
wafers 
Other 
Other 
For the manufacture of semiconductor dev ices on semiconductor 
wafers 
Other 
Pans 
Of apparatus o\' subheading 8514 10 05. 8514 20 05. 8514 30 
1 lor 85 14 30 91 
Other 
Electric (including electrically heated gas), laser or other light or 
photon beam, ultrasonic, electron beam, magnetic pulse or plasma 
arc soldering, bra/mg or welding machines and apparatus, 
whether or not capable of cutting; electric machines and apparatus 
for hot spray mg of metals or cermets Base Rate Final Bound 
Rate 
4 8 
free-
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj free 
free 
free-
free 
free 
free Jul. 1997 
3 6 
2.3 
2.3 
free 
free 
2.3 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.4 1.2 free 
1.5 
1.5 
free 
free 
15 0.8 
0.8 
free 
free 
0.8 free 
free 
free 
free 
free 
Page 10 of 33 
CN97 
8515 1 1 dl) 
X515 1901) 
X5I5 21 Od 
X5I5 29 
X5I5 29 10 
X5|_5 29 90 
X5I5 31 00 
X515 39 
8515 39 13 
8515 39 18 
8515 39 90 
8515 80 
8515 80 05 
8515 80 II 
8515 80 19 
8515 80 91 
8515 80 99 
8515 90 
8515 90 10 
8515 90 90 
8517 Label 
lUa/mg or soldering machines and apparatus 
Soldering nuns ,\t\A guns 
f )lher 
Machines and app.ualus lor resistance welding ol mclal 
I ully or paid«, automatic 
( Ither 
For butt welding 
Other 
Machines and apparatus for arc (including plasma arc) welding ol 
mêlais 
I ully or partly automatic 
Other 
For manual welding with coated electrodes, complete with 
welding or cutting devices, and consigned with 
1 ransformcrs 
(ieneralors or rotary converters or static converters, rectifiers or 
rectify ing apparatus 
Other 
Other machines and apparatus 
Wire bcmders of a kind used for manufacturing wafers or devices 
Other 
For treating metals 
For welding 
Other 
Other 
For resistance welding of plastics 
Other 
Parts 
For machines of subheading 8515 80 05 
Other 
Electrical apparatus for line telephony or line telegraphy. 
including line telephone sels with cordless handsets and 
telecommunication apparatus for carrier -current line systems or 
for digital line systems; v ideophones : 
1 elephone sets; v ideophones Base Rate Final Bound 
Rate 
3.7 
3.7 Jul. 1997 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.8 1.9 0.9 free 
free 28 1.9 0.9 free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 11 of 33 
WW 
•rat 
CN97 
X5I7 II 00 
X5I7 19 
8517 19 10 
X5I7 19 90 
8517 21 00 
8517 22 00 
8517 30 00 
X5I7 50 
851 7 50 10 
X5I7 50 90 
8517 X() 
8517 80 10 
8517 80 90 
8517 90 
85 i 7 90 11 
851790 19 
8517 90 82 
8517 90 88 
8518 
8518 10 
8518 10 10 
8518 1020 
8518 10 80 
8518 29 
8518 29 10 Label 
I me telephone sels with cordless handsets 
Other 
Videophones 
Olhcr 
Facsimile machines and teleprinters 
Facsimile machines 
I eleprinlers 
I elcplionic or telegraphic sw ik lung apparatus 
Olhcr apparatus, lor caruer-euueni line s\ stems oi tor digital line 
sy stems 
I or carrier-current line systems 
( )lher 
Oilier apparatus 
Entry -phone sy stems 
Other 
Pans 
Of apparatus for carrier-current line systems of subheading 8517 
50 10 
Electronic assemblies 
Other 
Other 
P'lectronic assemblies 
Other 
Microphones and stands therefor; loudspeakers, whether or not 
mounted in their enclosures; headphones, earphones and 
combined microphone speaker sets; audio- frequency electric 
amplifiers; electric sound amplifier sets ; 
Microphones and stands therefor 
For use in civil aircraft 
Other 
Microphones liav ing a frequency range of 300 11/ to 3.4 KHz 
with a diameter not exceeding 3 mm. for telecommunications use 
Other 
Other 
For use in civil aircraft Base Rate 
7 5 
14 
7.5 
7.5 
7.5 
7 5 
4.6 
7.5 
7.5 
7.5 
3.6 
3.6 
4.8 
4 8 
3.5 Final Bound 
Rate 
free 
free 
free 
free 
free-
free 
free 
free 
free 
free 
free-
free 
free 
free 
free Jul. 1997 
5 6 
I0.5 
5.6 
5.6 
5.6 
5.6 
3.4 
5.6 
5.6 
5.6 Implementation 
Jan. 1998 Jan. 1999 
2.7 
2.7 
3.6 
3.6 
2.6 3.8 
7.0 
3.8 
3.8 
3.8 
3.8 
2.3 
3.8 
3.8 
3.8 
1.8 
2.4 
2.4 1.9 
3.5 
1.9 
1.9 
1.9 
1.9 
1.1 
1.9 
1.9 
1.9 
0.9 
0.9 
1.2 
1.2 
0.9 Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
vendredi, 28. février 1997 
CO European Commission 
Delegation in Geneva - aj Page 12 of 33 
CN97 
8518 29 20 
8518 29X0 
X5IX 30 
8518 30 10 
8518 30 20 
85 IX 30X0 
X520 
8520 20 00 
8521 
8521 10 
8521 10 10 
8521 10 30 
8521 10 80 
8521 90 
8521 90 10 
8521 90 90 
8523 
8523 11 00 
8523 12 00 
8523 13 00 
8523 20 
8523 20 11 
8523 20 19 
8523 20 90 
8523 90 00 Label 
I oudspeakers hav mg a IIC«|UCIK v ol Idd 11/ lo 1 4 Kl 1/ w ith a 
diameter ol not exceeding Id mm and a hcighi not exceeding 1 
mm. lot Iclccoiiiiiiuiiic.liions use 
( Ulier 
Headphones, earphones and combined microphone speaker sets 
I or use in civ il aircrall 
I me telephone handsels 
Other 
Magnetic lape recorders and oilier sound recording apparatus. 
whether or not incorporating a sound reproducing device 
I elephone answering mac limes 
Video recording or reproducing apparatus, whether or not 
incorporating a video tuner 
Magnetic tape-ty pe 
I or use in civ il aircraft 
Other 
Of a width not exceeding 1.3 cm and allowing recording or 
reproduction at a tape speed not exceeding 50 mm per second 
Other 
Other 
Apparatus as defined in Note 5 E to Chapter 84 
Other 
Prepared unrecorded media for sound recording or similar 
recording of other phenomena, other than producls of Chapter 37 
Magnetic tapes 
Of a width not exceeding 4 mm 
Of a width exceeding 4 mm but not exceeding 6.5 mm 
Of a width exceeding 6.5 mm 
Magnetic discs 
Rigid 
With a thin film melaliic coaling, hav ing a coercivity exceeding 
600 Oersted and an external diameter not exceeding 23 I mm 
Other 
Other 
Other Base Rate Final Bound 
Rate 
3 X 
14 
3.2 
4.1 
4 1 
4.1 
4.1 
4.1 Iree 
free 
free-
free 
free 
free-
free 
free 
free-
free 
free Jul. 1997 
2.8 
3.0 
3.9 
10.5 
2.4 
3.1 
3.1 
1.5 
3.1 
3.1 
3.1 Implementation 
Jan. 1998 Jan. 1999 
1.9 0.9 
2.0 
2.6 
7.0 
1.6 
2.0 
2.0 
I.O 
2.0 
2.0 
20 1.3 
3.5 
0.8 
I.O 
I.O 
free 
I.O 
I.O 
I.O Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
CO 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 13 of 33 
CN97 
8524 
X524 31 00 
8524 32 00 
X524 39 
X524 39 10 
8524 39 90 
8524 40 
8524 40 10 
8524 40 91 
8524 40 99 
8524 91 
8524 91 10 
8524 91 90 
8524 99 
8524 99 10 
8524 99 90 
8525 
8525 10 Label 
Records lapes MtA oilier recorded media lor sound or olhcr 
similarlv recorded phenomena, including matrices and masters lor 
llie production ol records but excluding products of Chapter 17 
I )ises lor laser reading sy stems 
I or reproducing- phenomena olhcr than sound or image 
! or reproducing sound onlv 
Olhcr 
for reproducing representations ol instructions, data, sound and 
im.ige recorded in a machine re.ul.ible binary lonn. and capable of 
being man i pu la! cd or providing inlcractiv ny to the user, by means 
ol an automatic data processing machine 
( )llier 
Magnetic tapes lor reproducing phenomena olhcr than sound or 
image 
hearing data or instructions ol a kind used in automatic data-
processing machines 
( )ther 
Of a width exceeding 4 mm but not exceeding 6.5 mm 
Other 
Other 
For reproducing phenomena other than sound or image-
Bearing data or instructions of a kind used in automatic dala-
processing machines 
Other 
Other 
for reproducing representations of instructions, data, sound and 
image recorded in a machine readable binary form, and capable of 
being m.mipulaled or providing interactivity to the user, by means 
of an automatic data processing machine 
Other 
'transmission apparatus for radio-telephony, radio-telegraphy, 
radio-broadcasting or television, whether or not incorporating 
reception apparatus or sound recording or reproducing apparatus; 
television cameras; still image video cameras and other video 
camera recorders 
Transmission apparatus 
Radio-telegraphic or radio-telephonic apparatus Base Rate Final Bound 
Rate 
Jul. 1997 
4 l 
3 6 
4.1 
4.1 
41 
(J^Jrendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj free 
free 
free-
free 
free-
free 
free 
free 3.1 
3.1 
1.5 
2.7 
3.1 
E5 
3.1 
3.1 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.0 
2.0 
I.O 
1.8 
2.0 
I.O 
2.0 
2.0 I.O 
I.O 
free 
0.9 
I.O 
free 
I.O 
I.O free 
free 
free 
free 
free 
free 
free 
free 
Page 14 of 33 
CN97 
8525 Hi in 
8525 10 50 
8525 10X0 
X525 20 
X525 20 H) 
X525 20 9| 
X525 20 99 
X525 40 
X525 40 I I 
X525 40 19 
X525 40 9I 
8525 40 99 
8527 
8527 90 
8527 90 10 
8527 90 92 
8527 90 98 
852X 
8528 12 
8528 12 10 
£** vendredi, 28. 
W v. Label 
lor use in civil aire tall 
( Ulier 
R.ivlio-ielcgrapliie or i.idio-iclcphonic apparatus 
( »liter 
1 rarisinission apparatus incorporating reception apparatus 
Kadio-lclccraphi«. or radio-iclcphonic app.ir.tlus. lor use in civil 
aircrall 
< Hher 
I or cellular nelwoiks unohilc lelephone>i 
< l-.her 
still image v ideo cameras and oilier v ideo camera recorders 
Mill image v ideo cameras 
Digital 
( Mhcr 
( )lher v ideo camera recorders 
Only able lo record sound and images taken by the television 
camera 
Olhcr 
Reception apparatus for radio-telephony, radio-telegraphs or 
radio-broadcasting, whether or not combined, in the same-
housing, with sound recording or reproducing apparatus or a 
clock 
Other apparatus 
For radio-telephony or radio-telegraphy, for use in civil aircraft 
Other 
Portable receivers for calling, alerting or paging 
Other 
Reception apparatus for teles ision. whether or not incorporating 
radio-broadcast receivers or sound or video recording or 
reproducing apparatus: s ideo monitors and video projectors : 
Reception apparatus for telev ision. whether or not incorporating 
radio-broadcast receivers or sound or v ideo recording or 
reproducing apparatus 
Colour 
Apparatus as defined in Note 5 I to Chapter 84 
Other Base Rate 
I l 
6 5 
6 5 
4 9 
9.6 
14 Final Bound 
Rate 
Ira 
février 1997 European Commission 
Delegation in Geneva - aj free-
Ire e 
free-
free 
free 
free Jul. 1997 
3.1 
free 
4.9 
49 
3.7 
7.2 
I0.5 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.0 
free 
3.3 
3.3 
2.5 
4.8 
7.0 free 
1.6 
1.6 
2.4 
3.5 free 
free 
free 
free 
free 
free 
free 
Page 15 of 33 
CIS! 97 Label Base Rate Final Bound 
Rate 
Jul. 1997 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
— lelevision proiection equipment 
X52X 12 14 \\ uli scanning parameters not exceeding fi2 5 lines 
\\ ith scanning parameters exceeding 62 5 lines 
X52X I 2 16 With a vertical resolution ol less than 700 lines 
X52X 12 IX With a vertical resolution o! 700 lines or more 
— Apparatus incorporating a video recorder or reproducer 
852X I 2 22 \\ nil a screen widih height raiio less than 1.5 
X52X 12 28 Other 
Other 
Willi integral lube 
\\ ith a screen w ulth height ratio less than 1.5. w itli a diagonal 
measurement of the screen 
8528 I 2 52 Not exceeding 42 cm 
X528 I 2 54 Exceeding 42 cm but not exceeding 52 cm 
8528 12 56 Exceeding 52 cm but not exceeding 72 cm 
8528 12 58 Pxcccding 72 cm 
Other 
With scanning parameters not exceeding 625 lines, with a 
diagonal measurement of the screen 
8528 12 62 Not exceeding 75 cm 
8528 12 66 Exceeding 75 cm 
Willi scanning parameters not exceeding 625 lines 
8528 12 72 Wiih a vertical resolution of less than 700 lines 
8528 12 76 With a vertical resolution of 700 lines or more 
Other 
With screen 
8528 12 81 With a screen width height ratio less than 1.5 
8528 12X9 Olhcr 
Without screen 
8528 12 91 Video tuners 
8528 12 98 Other 
8528 13 -- Black and white or other monochrome 
8528 13 10 — Apparatus as defined in Note 5 E to Chapter 84 
X52X 13 90 — Other 
8528 30 - \ ideo projectors 6.8 free 5.1 3.4 1.7 free 
* « vendredi. 28 
Wv février 1997 European Commission 
Delegation in Geneva - aj Page 16 of 33 
CO CN97 
X52X 30 05 
X52X 10 20 
8528 3d 90 
8529 
8529 Id 
8529 10 10 
8529 10 15 
8529 10 20 
8529 10 31 
8529 10 39 
8529 10 40 
8529 10 50 
8529 10 70 
8529 10 80 
8529 90 
8529 90 10 
8529 90 40 
8529 90 51 
8529 90 59 
8529 90 70 Label 
ol a kind used with an .IMI.^'MIK .lala pioccssine machines 
( iiher 
( olour 
Hl.uk and while or other monochrome 
Parts suitable lor use sole!- or principal!« with the apparatus ol 
heading Nos 8525 (ll x.^X 
\enals and aerial rcllcctors ol all kinds, pails suitable for n«c 
iherew itli 
I or use m civ il aircrall 
Olhcr 
\erials 
Aerials ol a kind used with apparatus for radio-telephony and 
radio-telegraphic 
I elescopic and whip-type aerials for portable apparatus or for 
apparatus for filling in motor vehicles 
Outside aerials for radio or television broadcast receivers 
For reception via satellite 
Olhcr 
Inside aerials for radio or television broadcast receivers, including 
built-in ty pes 
Other 
Aerial filters and separators 
Other 
Other 
Assemblies and sub-assemblies consisting of two or more parts or 
pieces fastened or joined together, for apparatus falling within 
subheadings 8526 10 10. 8526 91 11.8526 91 19 and 8526 92 
10. for use in civil aircraft 
Other 
Parts of apparatusfalling within subheadings 8525 10 50. X525 20 
99. 8525 40 31. 8525 90 91 or 8527 90 91 
Cabinets and cases 
( )f w ood 
Of oilier materials 
Electronic assemblies 
Other Base Rate Final Bound 
Rate 
14 
4.7 free 
free 
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Jul. 1997 
I05 
3.8 
3.5 implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
7 0 3.5 free 
2.5 
2.4 1.3 
1.2 free 
free 
Page 17 of 33 
CN97 
8529 90 XI 
8529 90 89 
8531 
8531 20 
8531 20 10 
8531 20 .10 
8531 20 51 
8531 20 59 
853 I 20 80 
8531 80 
8531 80 10 
8531 80 30 
8531 80 80 
8531 90 
8531 90 10 
853 I 90 30 
8531 90 80 
8532 
8532 10 00 
8532 21 00 
8532 22 00 
8532 23 00 
8532 24 00 Label Base Rate 
! or telev i su in cameras ol su I« I leading 852 5 lo ,ind apparatus o| 
heading Nos 8.527 and X.52X 
Other 
I leclrie sound or v isual signalling apparatus ( for example, bells. 
sirens indicator panels burglar or liie alarms), olhcr llian those 
ol heading No X5(2 or 85 «n 
Indicator panels incorporating liquid cry stal dev ices (I CD) or 
light emitting diodes (I I I )) 
I or use in civ il aircraft 
Other 
Incorporating light emitting diodes il I D) 4 2 
Incorporating liquid cry stal dev ices 11 (_ D) 
Incorporating active matrix liquid cry stal dev ices (ECD) 
Colour 4 2 
Hlack and while or other monochrome 4 2 
Other 4.2 
Olhcr apparatus 
For use in civ il aircrall 
Other 
Flat panel devices of a kind used m automatic data processing 3.1 
machines and telecommunications apparatus 
Other 
Parts 
Of apparatus of subheading 853 I 20 4.2 
Of apparatus of subheading 8531 80 30 4.2 
Other 
Electrical capacitors, fixed, variable or adjustable (pre-set) ; 
Fixed capacitors designed for use in 50/60 11/. circuits and having 3.6 
a reactive power handling capacity of not less than 0.5 kvar 
(power capacitors) 
Other fixed capacitors 
tantalum 5 
Aluminium electrolytic 5 
Ceramic dielectric, single layer 3.6 
Ceramic dielectric, mullilaver 3 6 Final Bound 
Rate 
Jul. 1997 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
Iree 
free 
free-
free 
free 
free 
free 
free 
free 
free 
free 3.2 
3.2 
3.2 
3.2 
2.3 
3.2 
3.2 
2.7 
3.8 
3.8 
2.7 
2.7 2.1 
2.1 
2.1 
2.1 
16 
2.1 
2.1 
2.5 
2.5 
1.8 
1.8 1.1 
II 
1.1 
El 
0.8 
1.1 
II 
0.9 
1.3 
1.3 
0.9 
0.9 free 
free 
free 
free-
free 
free 
free 
free 
free 
free 
free 
free 
CO vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 18 of 33 
CN97 
8532 25 no 
8.5 12 29 (id 
8532 3d (id 
X532 90 0(1 
X513 
X533 10 oo 
85V3 21 00 
8513 29 oo 
8533 31 oo 
8533 39 00 
8533 40 
8533 40 10 
8533 40 90 
8533 90 00 
8534 00 
8534 00 11 
8534 00 19 
8534 00 90 
8536 
8536 50 
8536 50 03 
8536 50 05 
8536 50 07 
W,X vendredi, 28. Label 
Dielectric ol paper or pl.isiu-, 
( >lhcr 
Variable or ,ulinstable (pre-sgl I cap.u ilors 
Paris 
I leelrical resistors (including rheostats and potentiometers), other 
than healing resistors 
I ixed carbon resistors, composition or Film ivpes 
( )ther \'\\L\\ resistors 
For a power handling cap.uiiv not exceeding 2d W 
Olhcr 
\\ ircwound variable resistors including rheostats and 
polenliomelcrs 
1 or a power handling capacity not exceeding 20 W 
Other 
Other variable resistors, including rheostats and potentiometers 
For a power handling capacity not exceeding 20 W 
Other 
Pans 
Printed circuits 
Consisting only of conductor elements and contacts 
Multiple circuits 
Other 
With other passive elements 
Electrical apparatus for switching or protecting electrical circuits, 
or for making connections to or in electrical circuits (for example, 
switches, relays, fuses, surge suppressors, plugs, sockets, lamp-
holders, junction boxes). Ibr a voltage not exceeding I 000 V : 
Other switches 
Electronic AC switches consisting of optically coupled input and 
output circuits (Insulated thyrislor AC switchs) 
Electronic switches, including temperature protected electronic 
switches, consisting of a transistor and a logic chip (chip-on-chip 
technology ) for a voltage not exceding 1000 volts 
Electromechanical snap-acion switches for a current not 
exceeding I 1 amps 
Other Base Rate 
1 6 
1 f. 
4 7 
3.7 
3.7 
3 7 
3 7 
3.7 
3.7 
3.7 
3.7 
5.2 
5.2 
5.2 
3.2 
3 2 
3.2 Final Bound 
Rate 
free-
free 
free 
free 
free-
free 
Iree 
free-
free 
free-
free 
free-
free 
free 
free 
free-
free 
free Jul. 1997 
2.7 
2 7 
3 8 
3.5 
2.8 
2.8 
2.8 
2.8 
28 
2.8 
2.8 
2.8 Implementation 
Jan. 1998 Jan. 1999 
3.9 
3.9 
3.9 
2.4 
2.4 
2.4 1.8 
2.5 
2.4 
1.9 
1.9 
E9 
1.9 
1.9 
1.9 
1.9 
1.9 
2.6 
2.6 
2.6 
1.6 
1.6 
1.6 0.9 
0.9 
1.3 
1.2 
0.9 
0.9 
0.9 
0.9 
0.9 
0.9 
0.9 
0.9 
E3 
E3 
1.3 
0.8 
0.8 
0.8 Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
février 1997 European Commission 
Delegation in Geneva - aj Page 19 of 33 
CN97 
8536 50 I I 
8536 50 15 
8536 50 19 
X.516 50 90 
85 Ui 69 
8516 69 05 
8516 69 10 
8536 69 .10 
8536 69 90 
8536 90 
8536 90 01 
8536 90 10 
8536 90 20 
8536 90 85 
8541 
8541 10 
8541 10 10 
8541 1091 
8541 10 99 
8541 21 
8541 21 10 
8541 21 90 
8541 29 
8541 29 10 
854 I 29 20 
8541 29 30 
8541 29 80 
854 1 30 Label 
I or a voltage not exceeding '<(> V 
I'lisli-button su iiches 
Rotary «» itches 
< )ther 
( liher 
Other 
Plugs and sockets lor co-axial cables and printed circuits 
Oilier 
I or co-axial cables 
I or pruned circuits 
Other 
( llher apparatus 
Prefabricated elements for electrical circuits 
Connections and conlacl elements for wire and cables 
Wafer probers 
Other 
Diodes, transistors and similar semiconductor dev ices; 
photosensitive semi- con- doctor devices, including photovoltaic 
cells whether or not assembled in modules or made up into 
panels; lighl-emilting diodes; mounted pie/o-electric crystals : 
Diodes, other than photosensitive or light-emitting diodes 
Wafers not yet cut into chips 
Other 
Power rectifier diodes 
Other 
Transistors, other than photosensitive transistors 
With a dissipation rate of less than I W 
Wafers not yet cut into chips 
Other 
Other 
Wafers not yet cut into chips 
PowcrMOS field effective transistors 
Insulated gate bipolar iransisiors (Kill Is) 
Other 
Thyristor«;, diacs and triacs. other than photosensitive devices Base Rate Final Bound 
Rate Implementation 
1 2 
3.2 
free-free 
free-
free 
free 
free 
free-
free 
free 
free-
free 
free 
*-* vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Jul. 1997 
2.4 
2.4 
free 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 Jan. 1998 
E6 
I 6 
free 
1.8 
I 8 
I 8 
1.8 Jan. 1999 
0.8 
0.8 
free 
free 
free 
free 
fret-
free 
free 
free 
free 
free Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
Page 20 of 33 
CN97 
X5»l lo lo 
85 H 3d')d 
854 1 Id 
8541 40 I I 
X54I 40 19 
8511 40 91 Label 
\v aters urn «. el cut into chips 
< nhet 
Phoioseusitue semiconductor devices, including photovoltaic 
cells whether or nol assenibled in modules or made up mlo 
panels liglii-einiilmg diodes 
I ighl-einitiing diodes 
I aser diodes 
( llher 
Other 
Solar cells w hether or noi assembled m modules or nude up into 
panels 
Pholoiiiodcs phmoiransis|,irs. pholoihy rMors or photocouplcs 
( )ther 
< )ther semiconduclor dev ices 
Wafers nol y el cut into chips 
Other 
Mounted pie/o-eleclric crystals Base Rate Final Bound 
Rate 
7 free 
? free Jul. 1997 
3.5 
3.5 Implementation 
Jan. 1998 Jan. 1999 
free 
free Jan. 2000 
free 
free 
X54I 40 91 
X54I 40 99 
854 1 50 
8541 50 If) 
854 I 50 90 
854 I 60 00 
85-11 90 00 
8542 Electronic integrated circuits and microassemblies : 
Monolithic digital integrated circuits 
8542 12 00 — Cards incorporating an electronic integrated circuit («smart» 
cards) 
8542 13 — Metal oxide semiconductors (MOS technology ) 
8542 13 01 — Wafers not yet cut into chips 
8542 13 05 — Chips 
Other 
— Memories 
Dvnamie random-access memories (D-RAMs) 
8542 13 11 With a storage capacity not exceeding 4 Mbits 
8542 13 13 With a storage capacity exceeding 4 Mbils bul not exceeding 16 
Mbits 
8542 13 15 With a storage capacity exceeding 16 Mbits but nol exceeding 64 
Mbits 
8542 13 17 With a storage capacity exceeding 64 Mbits 7 
7 
3.2 
18 
18 
5.6 
4.1 
14 free-
free 
free-
free 
free 
free 
free 
free 
free-
free 
free 
free 
Iree 
free-
free 
free 3.5 
3.5 
1.6 
0.9 
09 
3.5 
3.5 
2.8 
2.0 
7.0 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 1.8 
0.8 
0.5 
0.5 
1.4 
1.0 
3.5 
1.8 
1.8 
1.8 
18 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
«^ vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 21 of 33 
CN 97 Label Base Rate Final Bound 
Rate 
Jul. 1997 
Static random-access memories (S-K.\\|s). including cache 
random-access memories (eaehc-KAMs) 
8542 I 3 22 \\ nh a storage capacity not exceeding 256 Kbits Iree free free 
8542 I 3 25 Willi a storage capacity exceeding 256 Kbits but not exceeding I free free free 
Mbit 
8542 13 27 Willi a storage capacity exceeding I Mbit free free Iree 
I A'erasable, programmable, readonly memories ( I PKOMs) 
8542 13 32 With a sioragc capacity not exceeding I Mbu free free free 
8542 13 35 With a storage cap.u it- exceeding I Mbu but not exceeding 4 free free free 
Mbits 
8542 13 37 Willi a storage cap ui:;. exceeding I Mhiis jrcc free free 
I Icctricallv erasable, programmable, read only memories 
(I.TROMs). including I I \S|| l.'PROMs 
II ASH I PKOMs 
8542 13 41 Willi a storage capacity nol exceeding I Mbil Iree free free 
8542 13 43 V> Uli a storage capaci'.y exceeding I Mbil but not exceeding 4 free free free 
Mbits 
8542 13 45 With a storage capacity exceeding 4 Mhits but nol exceeding 16 free free free 
Mbits 
8542 13 47 With a storage capacity exceeding 16 Mbits free free free 
8542 13 49 —— Oilier Iree free free 
8542 13 51 Readonly memories, non-programmable (ROMs); content free free free 
addressable memories (CAMs); flrst-in. first-out readAvrite 
memories (FIFOs), last-in first-out read write memories (FIFOs); 
ferroelectric memories 
8542 13 53 Other memories 7 free 3.5 
8542 13 55 — Microprocessors free free free 
— Microcontrollers and microcomputers 
8542 1.3 61 With a processing capacity not exceeding 4 bits 5 6 free 2 8 
8542 13 6.3 With a processing capacity exceeding 4 bits but nol exceeding 8 7 free 3.5 
bits 
8542 13 65 With a processing capacity exceeding 8 bits but not exceeding 16 7 free 3.5 
bits 
8542 13 67 With a processing capacity exceeding ! 6 bits but no! exceeding 7 free 3.5 
32 biis 
8542 13 69 Willi a processing capac'.y exceeding 32 bits ~ free 3.5 
European Commission 
vendredi, 28. février 1997 Delegation in Geneva - aj Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
free 
free-
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
1.8 
free 
E4 
1.8 
E8 
1.8 
I 8 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free-
free 
free 
free 
free-free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free-
Page 22 of 33 
CN 97 Label 
I »iher 
8542 13 70 Micropcriplierals 
Other 
85-12 13 72 I ull custom logic circuits 
8542 13 74 (me arras s 
8542 13 76 standard cells 
8542 13X2 Programmable logic circuits 
8542 13 84 Vandaid logic circuits 
( Mlier 
8542 13 9| Control circiiils. interlace c iKuits mlcit.uc circuits capable of 
performing control IniKiioris 
13 99 Other 
14 -- Circuits obtained by bipolar technology 
14 01 --- Wafers not yet cut into chips 
14 05 — Chips 
Other 
— Memories 
14 10 I)y namic random-access memories (D-RAMs) 
14 15 Sialic random-access memories (S-RAMs). including cache 
random-access memories (cache-RAMs); read only memories, 
non-programmable (ROMs); content addressable memories 
(CAMs); first-in/first-out read write memories (FIFOs); last-
in first-oul read/write memories (FIFOs); ferroelectric memories 
8542 14 20 Electrically erasable, programmable, read only memories 
(ETROMs). including I FAS! I E-T'ROMs 
8542 14 22 t A' erasable, programmable, read only memories (EPROMs) 
8542 14 29 Other memories 
8542 14 30 — Microprocessors 
Microcontrollers and microcomputers 
8542 14 42 \s ith a processing capacity not exceeding 4 bits 
8542 14 44 With a processing capacity exceeding 4 bits 
Other 
8542 14 50 Micropcriplierals 
Other 
8542 14 6t) Full custom Ionic circuits Base Rate 
854 2 
X542 
854 2 
8542 
8542 
8542 7 
7 
7 
5.6 
5.6 
7 
7 
7 
7 
free-
free 
free 
7 
free 
5.6 
7 
5 6 
7 Final Bound 
Rate 
Iree 
free-
free 
free-
free 
free-
free 
free 
free-
free 
free 
free-
free 
free 
free-
free 
free-
free 
free Jul. 1997 
2.8 
3.5 
3.5 
3.5 
2.8 
28 
3.5 
3.5 
3 5 
3.5 
3.5 
free 
free 
free 
3.5 
free 
28 
3.5 
2.8 
3.5 Implementation 
Jan. 1998 Jan. 1999 
1.4 
I 8 
I 8 
I 4 
1.4 
free 
free 
free 
I 8 
free 
1.4 
E8 
1.4 
I.8 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
£* vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 23 of 33 
CN97 Label 
8542 14 65 Cue arrays 
8542 II 70 Standard cells 
8542 14 75 Programmable logic circuits 
8542 14X1) Standard logic circuits 
Olhcr 
8542 14 91 Conlrol circuils. interlace circuils. inter lace circuits capable ol 
performing control hinclions 
8542 14 99 other 
8542 19 -- Other, including circuits obtained by a combination of bipolar 
and MOS technologies iBIMUS technology) 
8542 1901 --- Wafers not y ei etil into chips 
8542 19 05 — Chips 
Olhcr 
— Memories 
8542 19 15 Dy nannc r.iiHlom-aecess memories (D-R.AMs) 
Static random-access memories (S-R.AMs). including cache 
random-access memories (cachc-RAMs) 
8542 19 22 Wilh a storage capacity nol exceeding 256 Kbits 
8542 19 25 --— With a storage capacity exceeding 256 Kbits but nol exceeding I 
Mbit 
8542 19 27 With a storage capacity exceeding I Mbil 
8542 19 31 FA'erasable, programmable, read only memories (EPROMs) 
8542 19 35 Electrically erasable, programmable, read only memories 
(E:PROMs). including FLASH E2PROMs 
8542 19 41 Read only memories, non-programmable (ROMs): content 
addressable memories (CAMs); first-in/first-out read/write 
memories (FIFOs): last-in first-oul read/write memories (FIFOs); 
ferroelectric memories 
8542 19 49 Other memories 
8542 19 55 — Microprocessors 
— Microcontrollers and microcomputers 
8542 19 62 With a processing capacity not exceeding 4 bits 
8542 19 68 W ith a processing capacity exceeding 4 bits 
Other 
8542 19 71 Microperipherals 
Other Base Rate 
7 
7 
5 6 
5 6 
7 
7 
free-
free 
free 
free 
free 
free 
7 
free 
5.6 
7 
5.6 Final Bound 
Rate 
free-
Ire e 
free-
free 
free-
free 
free-
free 
free 
free-
free 
free 
free 
free 
free 
free-
free 
free 
free Jul. 1997 
3 5 
3.5 
2 8 
2.8 
3.5 
3.5 
3.5 
3.5 Implementation 
Jan. 1998 Jan. 1999 
3.5 
free 
free 
free 
free 
free 
free 
3.5 
free 
2.8 
3.5 18 
18 
1.4 
1.4 
free 
free 
free 
free 
free 
free 
1.8 
free 
1.4 
14 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free-Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
~* 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 24 of 33 
CN97 Label 
X542 19 72 I ul! ciisiom logic ciuuiis 
8542 19 74 dale arravs 
8.5 12 19 76 standard cells 
8542 19X2 Programmable logic circuils 
8542 19 84 Standard logic circuils 
( »liier 
854 2 19 92 (ontrol circuits, inlerlace circuits m lei l.ue circuits capable of 
pcrtorming control (unctions 
8542 19 98 O'her 
8542 30 - Oiher monolithic mtegiaied circuits 
8542 10 10 -- W ale's not y el cut into chips 
8542 10 20 - C !-;ps 
Oihc--
8542 30 10 — Amplifiers 
8542 30 5(i ... Voltage and current regulators 
Control circuits 
8542 30 61 — Smanpower circuits 
Other 
8542 30 65 Mixed analogue-digital circuils 
8542 30 69 Olhcr 
8542 30 70 — interface circuits, interface circuits capable of performing control 
functions 
Other 
8542 30 91 — Smanpower circuits 
Other 
8542 30 95 Mixed analogue-digital circuits 
854 2 30 99 Other 
8542 40 - I ly brid integrated circuits 
8542 40 10 — Microprocessors, microcontrollers and microeompulers 
854 2 40 30 - Converters 
8542 40 50 -- Amplifiers 
S542 4O90 - Oiher 
S542 5OO0 - Electronic microassemblies 
S542 l)0 00 - Paris Base Rate Final Bound 
Rate 
Iree 
free-
free 
free-
free 5 6 
5 6 
free-
free 
free 
free-
free 
free 
free 
free 
free 
free 
t ret­
iree 
free 
free 
free 
free Jul. 1997 
3 5 
3.5 
3 5 
2.8 
2.8 
3.5 
3.5 
3 5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
3.5 
20 Implementation 
Jan. 1998 Jan. 1999 
1.8 
1.8 
1.8 
1.4 
1.4 
1.8 
1.8 
E8 
I.8 
1.8 
1.8 
I.O free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 25 of 33 
CN 97 
85 r« 
854.1 I I HÜ 
854.1 in 
85 Jl ;'; I'» 
854.1 lo 2'i 
854i in wo 
8.54 1 XI no 
854 3 S<> 
854 3 X1' lo 
X54 3 X9 15 
X5-Ü 89 |7 
8543 89 20 
8543 89 51 
8543 89 55 
8543 89 59 
8543 89 70 
8543 89 72 
8541 89 "I 
8543 S')" 
854.1 89 '9 Label 
I leclncal mai. lunes and apparatus, having uuliv idual I unci ions. 
nol spec 11 ied or uu haled eEew here in I In s ( ha pier 
Parliele accelerators 
Ion implanleis lor doping semiconductor nialciiah 
Machines and apparatus lor electroplating, eleelioly sis or 
eleclrophorcsis 
Apparatus for \«ct etching, developing, stripping or cleaning 
semiconductor walcia 
Apparatus lor wcl etching developing stripping or cleaning 
liquid ervstal diplav substrates 
( liher 
( Jlhcr machines and appar.ilus 
Proximity cards and lags 
( )ther 
Flight recorders, for use in civil aircraft 
I leclncal machines wilh translation or dictionary functions 
Apparatus as defined in no! 5 I to Chapter 84 
.Aerial amplifiers 
Sunbeds. sunlamps and similar sunt.innmg equipment 
For fluorescent tubes using ulirav lolet A rays 
Wilh a maximum lube length of 100 cm 
Other 
Other 
Apparatus lor physical deposition on semiconductors wafers. 
by sputtering on semiconductor wafers 
Other 
I ncapsulation equipment lor assembly ol semiconductors 
Set top boxes, hav ing a communication Iunelion. microprocessor 
based dev ice inorporating a modem for gaming access to the 
Inlernet, and having a function of interactive information 
exchange 
Multimedia upgrade kits, lor automatic data processing machines 
and units thereof, put up for retail sale, consisting of. at least. 
speakers and or microphones.and a printed circuit assembly that 
enables the automatic data processing and units thereof to process 
audio signals (sound cardsi Base Rate Final Bound 
Rate 
Iree 
free-
free 
5 
vendredi. 28. février 1997 European Commission 
Delegation in Geneva - aj free 
free-
free 
I ret­
iree 
free 
free 
free 
free 
free Jul. 1997 
free 
3 8 
3.8 
3.8 
free 
3.8 
3 8 
3 8 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
fret-
free 
free 
2.5 
2.5 
2.5 
free 
2.5 
2.5 
2.5 free 
free 
free 
13 
1.3 
1.3 
free 
1.3 
1.3 
1.3 
13 free 
free 
free 
free 
free 
fret-
free 
free 
fret-
free 
free 
Page 26 of 33 
CN 97 
854 1 89 n<i 
8511 l><i 
8541 90 lu 
854.1 9i) 2l> 
854 3 9(i ;«(i 
854 1 9(1 oo 
854 I 
8544 41 
8544 41 10 
8544 4 1 90 
8544 49 
8544 49 20 
8544 49 80 
8544 51 
8544 5110 
8544 51 90 
8544 70 00 
9006 
9006 10 
9006 10 10 
9006 10 90 
9006 91 o i Label 
( )lher 
Paris 
Assemblies and snb-.issemblies consoling n| tu(> ()r nioie parts or 
pieces Listened or loined together tor flighl recorders, lor use m 
civil aircrall 
Ol apparatus ol suhc.idings X5 |t II nu. 85 |1 lo |o s5 11 89 70 
or X5|l 10 Id 
Of apparatus ol subheading X5J1 X'» '2 and X5 |1 ,X9 "1 
Other 
Insulated I uu hiding enamelled or .modised I w ire. cable 
(including coasial c.ihlei and oilier insulated eleclric conductors. 
whether or not lined w nh c ounce lor s. optical fibre cables, made 
up ol indiv idually sheathed libres, w helher or not assembled w nh 
electric conductors or fitted with connectors : 
Other eleclric conductors, lor a voltage not exceeding X0 V 
filled w nh connectors 
Of a kind used for telecommunications 
Other 
Other 
Of a kind used for telecommunications 
Other 
Other eleclric conductors, tor a voltage exceeding X0 soils but not 
exceeding I 000 \ oils 
Fitted with connectors 
Of a kind used for telecommunications 
Other 
Optical fibre cables 
Photographic (olhcr than cinematographic) cameras. 
photographic flashlight apparatus and flashbulbs other than 
discharge lamps of heading No X539 : 
Cameras of a kind used tor preparing pruning plates or cy linders 
Pattern generating apparatus of a kind used for producing masks 
or reticles from photoresist coated substrates 
Other 
Parts and accessories: 
For cameras Base Rate Final Bound 
Rate 
4 6 
4 8 
4.6 
6 3 
fret-
vendredi, 28. février 1997 
i4à European Commission 
Delegation in Geneva - aj free 
free-
free 
fret-
free 
free 
free Jul. 1997 
3 8 
3.8 
3.4 
3.6 
3.4 
4.7 
free Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.5 
2.5 
2.3 
2.4 
2.3 
3.1 
free E3 
1.3 
1.2 
El 
E6 free 
free 
free 
free 
free 
free 
free 
Page 27 of 33 
CN97 
9006 99 10 
9006 99 90 
9009 
9009 I 1 00 
9009 21 00 
9009 90 
9009 90 III 
9009 90 90 
901(1 
9010 41 00 
9010 42 00 
9010 49 00 
9010 90 
9010 90 10 
9010 90 90 
901 I 
901 I 10 
9011 10 10 
90! I 10 90 
901 I 20 Label 
>lhcr 
of apparatus of subheading 9d(iri |(l III 
< )iher 
Photocopy ing apparatus incorporating an optical sy stem or of the 
coniacl type and ihcrino-copv mg apparaius 
I lectroslaiic photocopv ing apparatus 
( )peraling by reproducing lhe original image directly onto the 
copy (direct process) 
( )ther photocopy ing apparatus 
Incorporating an optical s«. stem 
Pans and accessories 
( M electrosiaiic phoiocop«. mg apparaius or other photocopv mg 
apparatus incorporating an optical system 
Other 
Apparatus and equipment lor photographic (including 
cinematographic) laboratories (including apparatus for the 
projection of circuit palierns on scnsitivcd semi-conductor 
material I. not specified or included elsewhere in this chapter. 
negatoscopes, projection screens 
Apparatus for the projection or draw mg of circuit patterns on 
sensili/cd semiconductor materials 
Direct write-on-wafcr apparatus 
Step and repeat aligners 
Other 
Parts and accessories 
Of the apparatus of subheadings N° 9010 41 00. 9010 42 00 and 
9010 49 00 
Other 
Compound optical microscopes, including those for 
photomicrography, cine-photomicrography or mieroprojeclion 
Stereoscopic microscopes 
lined with equipment specifically designed for the handling and 
Iransport of semiconductor wafers or reticles 
( )ther 
Oilier microscopes, lor plioioniicrographv. cinephotomicrograpliv 
or micro-projection Base Rate Final Bound 
Rate 
Ire« 
6 5 
6 5 
6 5 
3 X 
fret-
free 
free 
3 6 free 
free 
free 
fret-
free 
free 
fret-
free 
free 
JA vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Jul. 1997 
3.0 
4.9 
4.9 
4.9 
2.8 
free 
free 
free 
2.7 
6.0 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
2.0 
3.3 
3.3 
3.3 
I.9 
free 
free 
free 
4.0 .0 
1.6 
1.6 
I.6 
0.9 
free 
free 
free 
0.9 
2.0 free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
Page 28 of 33 
CN97 
901 I 20 10 
901 I 20 90 
901 I 90 
901 I 90 10 
901 I 90 90 
9012 
9012 10 
9012 10 |0 
9012 10 90 
9012 90 
9012 90 |() 
9012 90 90 
901 3 
9013 80 
9013 80 II 
9013 80 19 
9013 80 30 
9013 80 90 
901.3 90 
9013 90 10 
9013 90 90 Label 
lilted \« nh equipment spec ilu ally designed lor the handling and 
liatisp.-ri o! semiconductor waters or reticles 
( Xlier 
Parts A^A accessories 
( H app.nains ol subheadings \ wn| I III |U or Will | 2<l 10 
Other 
Microsvopcs oiher than opiical microscopes, dilfraclio 
microscopes 
Microscopes other than optical microscopes and diffraction 
apparat,^ 
I icc'.rou beam microscopes lined with cquipnienl specifically 
désignes! lor the handling and transport ol semiconductor waters 
or ret cics 
( )lher 
Parts a:id accessories 
Of apparatus of subheading \" 9012 10 00 
Other 
I iqirJ cy stal dev ices not consistuling articles prov ided for more 
specifically in oilier headings; lasers, oiher than laser diodes; 
other optical appliances and instruments, not specified or 
included elsewhere in this Chapter 
Other dev ices, appliances and instruments 
Liquid crystal devices 
Active matrix liquid crystal devices 
Colour 
Black and white or other monochrome 
Other 
Other 
Parts and accessories 
Olhcr 
For liquid cry stal des ices (ICD) 
Other Base Rate Final Bound 
Rate 
X I ret­
iree 
4 5 
4 5 
6.5 
6.5 
6.5 
6.5 free 
t ret-
free 
free 
free Jul. 1997 
6.0 
6.0 
3.4 
3.4 
4.9 
4.9 
4.9 
4.9 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
4.0 2.0 free 
4.0 
2.3 
2.3 
3.3 
3.3 
3.3 
3.3 2.0 
l.l 
1.6 
1.6 
1.6 
1.6 free 
free 
free 
free 
free 
free 
free 
^ vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 29 of 33 
CN97 
9017 
9017 10 
9017 10 10 
9017 10 90 
9017 20 
9017 20 05 
9017 20 1 1 
9017 20 19 
9017 20 31 
9017 20 39 
9017 20 90 
9017 90 
9017 90 10 
9017 90 90 
9026 
9026 10 
9026 10 10 
9026 10 51 
9026 10 59 Label 
Drawing, niarking-out or mathematical calculating instruments 
(for example, dialling machines, pantographs, protractors, 
drawing sets, slide rules disc calcul.ilois). instruments lor 
measuring length, lor use in ihe hand ( lor example, measuring 
rods and lapes, micrometers, callipers), not specified or included 
eKe- w here in ilus ehapier 
Drafting tables and machines, whether or nol automatic 
Plotters 
Other 
< Mher draw ing. marking-out or maihemalical calculating 
instruments 
I )raw mg instruments 
Plotters 
Draw mg sets 
Older 
Mark ing-oul instruments 
Pattern generating apparatus of a kind used for producing masks 
or rendes from photoresist coated substrates 
Olhcr 
Mathematical calculating instruments (including slide rules, disc-
calculators and the like) 
Parts and accessories 
For apparatus of subheading 9017 20 31 
Other 
Instruments and apparatus for measuring or checking the flow, 
level, pressure or other variables of liquids or gases (for example, 
How ineters. level gauges, mano- meters, heat meters), excluding 
instruments and apparatus ol heading No 9014. 9015. 902X or 
9032 : 
For measuring or checking the floss or level of liquids 
For use in civ il aircraft 
Other 
Electronic 
Flow meters 
Other 
Other Base Rate 
3.7 
3 7 
frei 
3.7 
4.8 
4 8 Final Bound 
Rate 
free-
Ire«. 
fret-
free 
free-
free 
free Jul. 1997 
2.8 
28 
fret-
free 
3.6 
3.6 Implementation 
Jan. 1998 Jan. 1999 Jan. 2000 
19 
free 
1.9 
free 
2.4 
2.4 0.9 
0.9 
free 
0.9 
free 
1.2 
1.2 free 
free 
free 
free 
free 
free 
CJTvendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 30 of 33 
CN97 
91126 |0 9| 
9026 III 99 
9026 20 
9026 20 10 
9026 20 30 
9026 20 51 
9026 20 59 
9026 20 90 
9026 80 
9026 XO 10 
9026 80 91 
9026 80 99 
9026 90 
9026 90 10 
9026 90 90 
9027 
9027 20 
9027 20 10 
9027 20 90 
9027 30 00 
9027 50 00 
9027 80 
CT? 
1*> Label 
I low meters 
< Mher 
I or measuring or checking pressure 
i or use in civil aircrall 
Other 
I lectronic 
Other 
Spiral or melal diaphragm type pressure gauge's 
Appliances lor measuring .\\\d non-.miom.dually regul.ilmg Iv re-
pressure 
Olhcr 
Other 
Olhcr instruments or apparatus 
I or use in civ il aircraft 
Oiher 
Fleclronic 
Other 
Parts and accessories 
For use in civil a ire rait 
Other 
Instruments and apparatus for physical or chemical analysis (for 
example. Polarimeters, refractomelers. spectrometers, gas or 
smoke analysis apparatus); instruments and apparatus for 
measuring or checking viscosity, porosity, expansion, surface 
tension or the like; instruments and apparatus for measuring or 
checking quantities of heat, sound or light ( including exposure 
meters); microtomes : 
Chromatographs and electrophoresis instruments 
Chromatographs 
Electrophoresis instruments 
Spectrometers, spectrophotometers and spectrographs using 
optical radiations (UV. visible. IR) 
Other instruments and apparatus using optical radiations (UV. 
visible. IR) 
Other instruments and apparatus 
Electronic Base Rate 
1 6 
3 U 
free 
4 X 
3 3 
3 3 
free 
4.8 
3 6 
free 
3.3 
3.5 
4.4 
3.5 
4 4 Final Bound 
Rate 
I "ret­
iree 
tree 
free-
free 
free 
fret-
free 
free 
free-
free 
free 
free 
fret-
free Jul. 1997 
2.7 
2.7 
free 
3.6 
2.5 
2.5 
2.5 
free 
3 6 
2.7 
free 
2.5 Implementation 
Jan. 1998 Jan. 1999 
2.6 
3.3 
2.6 
3.3 1.8 
1.8 
free 
2.4 
1.6 
E6 
1.6 
free 
2.4 
1.8 
free 
1.6 
2.2 
1.8 
2.2 0.9 
0.9 
free 
1.2 
0.8 
0.8 
0.8 
free 
1.2 
0.9 
free 
0.8 
0.9 
El 
0.9 
El Jan. 2000 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 31 of 33 
CN97 
9027 X0 I I 
9027 XO I 5 
9027 XO IX 
9027 X0 9I 
9027 80 95 
9027 80 98 
9027 90 
9027 9o 10 
9027 90 50 
9027 90 80 
9030 
9030 40 
9030 40 10 
90.10 40 90 
9030 82 00 
9030 90 
9030 90 10 
9030 90 20 
9030 90 80 Label Base Rate 
pi I meters, r I f meters and other apparaius lor measuring 1 I 
condiutiv itv 
\pparaliis lor performing measurements ol the phv sied tree 
properties o! semiconductor materials or associated insulating and 
eonducling lav ers during ihc semiconductor vy.ilcr production 
process 
Older 4 4 
Other 
Viscometers, porosunetcrs and expansion meters 4 
Apparatus lor pel forming measurements o! the phv sua! free 
properties ol semiconductor materials or associated insulating and 
eonducling lay ers during the semiconductor water production 
process 
Other 4 
Microlomes, paris and accessories 
Microtomes 
Part and accessories ol apparaius of heading N ; 9027 20 to 9027 4 4 
80 
Parts and accessories of microtomes or o! gas or smake anaiy sis 
apparatus 
Oscilloscopes, spectrum analysers and other instruments and 
apparatus for measuring or checking electrical quantities, 
excluding meters of heading No 9028; instruments and apparatus 
for measuring or detecting alpha, beta, gamma. X-ray. cosmic or 
other ioni/ing radiations : 
Olhcr instruments and apparatus, specially designed for 
telecommunications (for example, cross-talk meters, gain 
measuring instruments, distortion factor meters, psophometers) 
For use in civil aircraft free 
Other 5.5 
Other instruments and apparatus 
I or measuring or checking semiconductor wafers or dev ices fret-
Parts and accessories 
For use in civ il aircraft 
For apparatus of subheading Nc 90.10 82 00 4.4 
Other Final Bound 
Rate 
free 
fret-
free 
fret-
free 
free 
l ree 
tree Jul. 1997 
3.3 
free 
3.3 
3.0 
free 
3.0 
3.3 
free 
4 I Implementation 
Jan. 1998 Jan. 1999 
2.2 El 
free 
2.2 
2.0 
free 
2.0 
free 
2.8 
free free 
I.O 
free 
El 
free 
1.4 
free Jan.2000 
free 
free 
free 
free 
free 
free 
free 
3.3 free 
free 
free 
free 
* -? vendredi, 28. février 1997 European Commission 
Delegation in Geneva - aj Page 32 of 33 
European Commission 
Delegation in Geneva - aj Page 33 of 33 vendredi, 28. février 1997 CN 97 
wm i 
won 11 DO 
wo; | IW 
WO.; I 4W ID 
wo; i iw wo 
wo* | wo 
wo;i wo ID 
wo; I wo 2D 
wo; i wo wo Label 
VliMMirmj.' i»r «.!K\ kmu i'i-';;iiiu-nh .ippIi.iiKes .nul m.n. Inno*- not 
•.pe*. II'K.I or i iK I (i.l v-il ii\'A!i'i>' m Mus Ji.ipkT pi H file pn>|i.Kti>rv 
> MIHI I'plK.ll lll^lt liltl>.-lll -. .ill.l ippll.HK (."N 
I or m^pet me .oiiio'iiiluiii'i u.11v-r^ or do KO or lor Mispei-lme. 
pill»! « M11, l-.^-. or K'tK !i> lhi\l !l! 111.111 II I.K till IIIL! sein KOIKIIK lor 
llC\ ILI'N 
Other 
1 or mc.iMiruiL' Mirt.iu' p.iriuul.sie <.• <11t.111iKi.1tion on 
sCIHKOIKllKlor \\ .it <.•!•. 
( )IIKT 
l'art*, .nul .K u'«i'ik'. 
( )| instrument v .ipplian«. e*- inj ULK In no ol MihlK'.ulmu WO ; I KO. 
lor use in civil ain.ralt 
lor apparatus ol subheadings \ W0.3I 11 00 and WO.; 1 4W ID 
Other Base Rate 
Iree 
Iree 
4 6 Final Bound 
Rate 
Iree 
free 
free Jul. 1997 
tree 
free 
3 4 Implementation 
Jan. 1998 
free 
free 
2.3 Jan. 1999 
free 
free 
II Jan. 2000 
free 
free 
free 
EC - ITA - Schedule CXL - Attachment A, Section 2 
Description HS 97 Headings 
* Quartz reactor tubes and holders designed for insertion into diffusion 70200005 
and oxidation furnaces for production of semiconductor wafers 
* Chemical vapor deposition apparatus for semiconductor production 84198920 
* Parts of chemical vapor deposition apparatus for semiconductor 84199030 
production 
* Spin dryers for semiconductor wafer processing 84211995 
* Parts of spin dryers for semiconductor wafer processing 84219110 
* Deflash machines for cleaning and removing contaminants from the 84248930 
metal leads of semiconductor packages prior to the electroplating 
process 
* Spraying appliances for etching, stripping or cleaning semiconductor 84248920 
wafers 
* Parts of spraying appliances for etching, stripping or cleaning 84249010 
semiconductor wafers 
* Machines for working any material by removal of material, by laser or 84561010 
other light or photo beam in the production of semiconductor wafers 
* Apparatus for stripping or cleaning semiconductor wafers 84569930 
* Machines for dry-etching patterns on semiconductor materials 84569100 
* Focused ion beam milling machines to produce or repair masks and 84569910 
reticles for patterns on semiconductor devices 
* Lasercutters for cutting contacting tracks in semiconductor production 84561010 
by laser beam 
* Machines for sawing monocrystal semiconductor boules into slices, or 84641010 
wafers into chips 
* Grinding, polishing and lapping machines for processing of 84642005 
semiconductor wafers 
* Dicing machines for scribing or scoring semiconductor wafers 84649010 
* Parts for machines for sawing monocrystal semiconductor boules into 84669115 
slices, or wafers into chips 
* Parts of dicing machines for scribing or scoring semiconductor wafers 84669115 
Parts of grinding, polishing and lapping machines for processing of 
semiconductor wafers 
Parts of focused ion beam milling machines to produce or repair masks 
and reticles for patterns on semiconductor devices 
Parts of lasercutters for cutting contacting tracks in semiconductor 
production by laser beam 
Parts of machines for working any material by removal of material, by 
laser or other light or photo beam in the production of semiconductor 
wafers 
Parts of apparatus for stripping or cleaning semiconductor wafers 
Parts of machines for dry-etching patterns on semiconductor materials 
Encapsulation equipment for assembly of semiconductors 
Parts of encapsulation equipment 84669115 
84669315 
84669315 
84669315 
84669315 
84669315 
84771010, 84775905 
84779004 
vendredi, 2H. février 1997 Page / of J 
Description HS 97 Headings 
* Automated machines for transport, handling and storage of 
semiconductor wafers, wafer cassettes, wafer boxes and other material 
for semiconductor devices 
* Apparatus for growing or pulling monocrystal semiconductor boules 
* Apparatus for physical deposition by sputtering on semiconductor 
wafers 
* Apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays 
* Die attach apparatus, tape automated bonders, and wire bonders for 
assembly of semiconductors 
* Encapsulation equipment for assembly of semiconductors 
* Epitaxial deposition machines for semiconductor wafers 
* Machines for bending, folding and straightening semiconductor leads 
* Physical deposition apparatus for semiconductor production 
* Spinners for coating photographic emulsions on semiconductor wafers 
* Part of apparatus for physical deposition by sputtering on 
semiconductor wafers 
* Parts for die attach apparatus, tape automated bonders, and wire 
bonders for assembly of semiconductors 
* Parts for spinners for coating photographic emulsions on 
semiconductor wafers 
* Parts of apparatus for growing or pulling monocrystal semiconductor 
boules 
* Parts of apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays 
* Parts of automated machines for transport, handling and storage of 
semiconductor wafers, wafer cassettes, wafer boxes and other material 
for semiconductor devices 
* Parts of encapsulation equipment for assembly of semiconductors 
* Parts of epitaxial deposition machines for semiconductor wafers 
* Parts of machines for bending, folding and straightening semiconductor 
leads 84283993 
84798965 
84198925, 85438970 
84798975, 84798976 
84798977,85158005, 
85159010 
84798979, 8S438973 
84798970 
84622105, 84622905 
85438972 
84211993 
85439020 
84799050 
84219110 
84799050 
84799050, 85439020 
84313920 
84799050, 85439030 
84799050 
84669410 
Parts of physical deposition apparatus for semiconductor production 84199030, 85439030 
Injection and compression moulds for the manufacture of 
semiconductor devices 
Resistance heated furnaces and ovens for the manufacture of 
semiconductor devices on semiconductor wafers 
inductance or dielectric furnaces and ovens for the manufacture of 
semiconductor devices on semiconductors wafers 
Apparatus for rapid heating of semiconductor wafers 
Parts of resistance heated furnaces and ovens for the manufacture of 
semiconductor devices on semiconductor wafers 
Parts of apparatus for rapid heating of wafers 
Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30 
Wafer probers 
Ion implanters for doping semiconductor materials 
Apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays 84807110 
85141005, 85143011, 
85143091 
85142005 
84198915, 85143091 
85149010 
84199030, 85149010 
85149010 
85369020 
85431100 
84798975, 84798976, 
85433010,85433020 
vendredi. 2 H. février 1997 Page 2 of 3 
i»5 
Description HS 97 Headings 
Parts of apparatus for wet etching, developing, stripping or cleaning 
semiconductor wafers and flat panel displays 
Parts of ion implanters for doping semiconductor materials 
Apparatus for projection, drawing or plating circuit patterns on 
sensitized semiconductor materials and flat panel displays 
Parts and accessories of the apparatus of Headings No 9010 41 to 9010 
49 
Optical stereoscopic microscopes fitted with equipment specifically 
designed for the handling and transport of semiconductor wafers or 
reticles 
Photomicrographic microscopes fitted with equipment specifically 
designed for the handling and transport of semiconductor wafers or 
reticles 
Parts and accessories of optical stereoscopic microscopes fitted with 
equipment specifically designed for the handling and transport of 
semiconductor wafers or reticles 
Parts and accessories of photomicrographic microscopes fitted with 
equipment specifically designed for the handling and transport of 
semiconductor wafers or reticles 
Electron beam microscopes fitted with equipment specifically designed 
for the handling ana transport of semiconductor wafers or reticles 
Parts and accessories of electron beam microscopes fitted with 
equipment specifically designed for the handling and transport of 
semiconductor wafers or reticles 
Pattern generating apparatus of a kind used for producing masks or 
reticles from photoresist coated substrates 
Parts and accessories for pattern generating apparatus of a kind used 
for producing masks or reticles from photoresist coated substrates 
Parts of such pattern generating apparatus 
Instruments and apparatus for measuring or checking semiconductor 
wafers or devices 
Parts and accessories of instruments and apparatus for measuring or 
checking semiconductor wafers or devices 
Parts of instruments and appliances for measuring or checking 
semiconductor wafers or devices 
Optical instruments and appliances for inspecting semiconductor 
wafers or devices or for inspecting masks, photomasks or reticles used 
in manufacturing semiconductor devices 
Optical instruments and appliances for measuring surface particulate 
contamination on semiconductor wafers 
Parts and accessories of optical instruments and appliances for 
inspecting semiconductor wafers or devices or for inspecting masks, 
photomasks or reticles used in manufacturing semiconductor devices 
Parts and accessories of optical instruments and appliances for 
measuring surface particulate contamination on semiconductor wafers 84799050, 85439020 
85439020 
90104100, 90104200, 
90104900 
90109010 
90111010 
90112010 
90119010 
90119010 
90121010 
90129010 
90061010,90172031 
90069910,90179010 
90179010 
90308200 
90309020 
90309020 
90314100 
90314910 
90319020 
90319020 
vendredi. 2H. février 199', Page J of 3 
r-on 
EC - ITA - Schedule CXL » Attachment B 
Description HS 97 Headings 
Computers: automatic data processing machines capable of 
1) storing the processing program or programs and at least the data 
immediately necessary for the execution of the program; 
2) being freely programmed in accordance with the requirements of the 
user; 
3) performing arithmetical computations specified by the user; 
4) executing without human intervention, a processing program which 
requires them to rnodifiy teir execution, by logical decision during the 
processing run. 
The agreement covers automatic data processing machines whether or 
not they are able to receive and process with assistance of central 
processing unit telephony signals, television signals, or other analogue 
or digitally processed audio or video signals. Machines performing a 
specific function other than data processing, or incorporating or working 
in conjunction with an automatic data processing machine, and not 
otherwise specified under Attachement A or B, are not covered by this 
agreement 84711090.84713000. 
84714190, 84714990, 
84715090,85219010, 
85281210,85281310, 
85438917 
The agreement covers such automatic data processing machines 
whether or not they are able to receive and process with the assistance 
of the central processing unit telephony signals, television signals, or 
other analogue or digitally processed audio or video signals. 
However, machines performing a specific function other than data 
processing, or incorporating or working in conjunction with an automatic 
data processing machines, and not referred to under part A or B, are 
excluded from the product coverage of this agreement. 
Electric amplifiers when used as repeaters in line telephony products 
falling within this agreement, and parts thereof. 
Flat panel displays (including LCD, Electro Luminescence, Plasma and 
other technologies) for products falling within this agreement, and parts 
thereof. 
Network equipment; Local Area Network (LAN) and Wide Area Network 
(WAN) apparatus, including those products dedicated for use solely or 
principally to permit the interconnection of automatic data processing 
machines and units thereof for a network that is used primarily for the 
sharing of resources such as central processor units, data storage 
devices and input or output units - including adapters, hubs, in-line 
repeaters, converters, concentrators, bridges and routers, and printed 
circuit assemblies for physical incorporation into automatic data 
processing machines and units thereof 
Monitors: display units of automatic data processing machines with a 
cathode ray tube with a dot screen pitch smaller than 0.4 mm not 
capable of receiving and processing television signals or other analogue 
or digittally processed audio or video signals without assistance of a 
central processing unit of a computer as defined I this agreement. 
The agreement does not. therefore, cover televisions, including high 
definition televisions(l) 
(1) Participants will conduct a review of this product description in 
January 1999 under the consultation of paragraph 3 of the Declaration. 
Optical disc storage units for automatic data processing machines 
(including CD drives and DVD-drives), whether or not having the 
capability of writing/recording as well as reading, whether or not in their 
own housings. 
Paging alert devices and parts thereof. 85175010,85178090 
85312030,85312051, 
85312059.85312080, 
85318030,85319010, 
85319030,90138011, 
90138019,90138030, 
90139010 
84715090, 84716090, 
85175090 
84716090 
84717051 
85279092, 85299040 
vendredi. 2H. février 1997 Page I of 2 
o / 
Description HS 97 Headings 
Plotters whether input or output units of HS heading No 8471 or drawing 
or drafting machines of HS heading No 9017. 
Printed Circuit Assemblies for products falling within this agreement, 
including such assemblies for external connections such as cards that 
conform to the PCMCIA standard. 
Such printed circuit assemblies consist of one or more printed circuits of 
heading 8534 with one or more active elements assembled thereon, with 
or without passive elements "Active elements" means diodes, transistors 
and similar semiconductor devices, whether or not photosensitive, of 
heading 8541, and integrated circuits and micro assemblies of heading 
8542. 
Proprietary format storage devices including media therefor for 
automatic data processing machines, with or without removable media 
and whether magnetic, optical or other technology, including Bernoulli 
Box, Syquest, Zipdrive cartridge storage units. 
Multimedia upgrade kits for automatic data processing machines, and 
units thereof, put up for retail sale, consisting of, at feast, speakers 
and/or microphones, as well as a printed circuit assembly that enables 
the ADP machine and units thereof to process audio signals (sound 
cards). 
Set top boxes which have communication function a microprocessor-
based device incorporating a modem for gaining access to the Internet, 
and having a function of interactive information exchange. 84716090, 84718090, 
90171010, 90172005 
84732110, 84732910, 
84733010, 84735010, 
85175090. 85179082, 
85299040 
84717051.84717053. 
84717059, 84717060. 
84717090.85232011. 
85232019.85232090, 
85244091.85244099. 
85249190 
85438979 
85175090. 85438977 
vendredi. 2ff. février 1997 Page 2 of 2 
Vorschlag 
Beschluß des Rates 97/0083 (ACC) 
über die Beseitigung der Zölle auf bestimmte Spirituosen 
DER RAT DER EUROPÄISCHEN UNION -
gestützt auf den Vertrag zur Gründung der Europäischen Gemeinschaft, insbesondere auf 
Artikel 113 in Verbindung mit Artikel 228 Absatz 2 Satz Î, 
auf Vorschlag der Kommission, 
in der Erwägung, daß die Beseitigung der Zölle durch die Vereinigten Staaten von 
Amerika und die Europäische Gemeinschaft im allgemeinen Interesse liegen dürfte -
BESCHLIESST: 
Artikel 1 
Das Abkommen in Form einer Vereinbarung zwischen der Europäischen Gemeinschaft 
und den Vereinigten Staaten von Amerika über Spirituosen wird im Namen der 
Gemeinschaft genehmigt. 
Der Wortlaut des Abkommens ist diesem Beschluß beigefügt. 
Artikel 2 
Der Rat ermächtigt die Kommission, der Welthandelsorganisation die im Anhang 
beigefugte Änderung der Liste der Europäischen Gemeinschaft zu übermitteln, um die 
Zölle auf die betreffenden Spirituosen zu binden und zu beseitigen. 
Artikel 3 
<J«Ï 
Der Präsident des Rates wird ermächtigt, die Person zu bestellen, die befugt ist, das 
Abkommen/Protokoll rechtsverbindlich für die Gemeinschaft zu unterzeichnen. 
Geschehen zu Brüssel 
Im Namen des Rates 
Der Präsident 
KO 
VEREINBARUNG 
ex 2208 Branntwein, Likör und andere Spirituosen 
Wir haben, wie in Singapur vereinbart, eingehende Verhandlungen über den Abbau der 
Zölle auf bestimmte Spirituosen gefuhrt. 
Vorbehaltlich des Abschlusses der jeweiligen internen Verfahren senken die Europäische 
Gemeinschaft und die Vereinigten Staaten von Amerika ihre am 1. Juli 1997 geltenden 
Zölle auf die Waren der nachstehenden Positionen des Harmonisierten Systems 1996 in 
vier gleichen Raten am 1. Juli 1997, am 1. Januar 1998, am 1. Januar 1999 und am 
1. Januar 2000 bis zum vollständigen Zollabbau. Davon ausgenommen ist Rum (Position 
2208 40), fur den die im Anhang niedergelegten besonderen Bestimmungen gelten. 
HS 96 
2208 20 Branntwein aus Wein oder Traubentrester 
2208 30 Whisky 
2208 50 Gin und Genever 
2208 60 Wodka 
2008 70 Likör 
ex 2208 90 andere als Ethylalkohol mit einem Alkoholgehalt von weniger als 80 % vol, 
unvergällt (Positionen 2208 90 91 und 2208 90 99 in der Europäischen 
Gemeinschaft und Position 2208 90 80 in den Vereinigten Staaten von 
Amerika) 
Gl 
ANHANG 
Betreff: 2208 40 - Rum und Taffia 
EG Zölle 
1. Die Zölle auf Rum mit einem Gehalt an anderen flüchtigen Stoffen als Ethyl- und 
Methylalkohol von 225 Gramm je Hektoliter reinen Alkohols oder mehr 
(Toleranzschwelle von 10 %) werden wie folgt gesenkt: 
In Behältnissen mit einem Inhalt von In Behältnissen mit einem Inhalt von 
2 Litern oder weniger mehr als 2 Litern 
Ausgangszollsatz 0,8 Ecu/%vol/hl + 0,8 Ecu/ %vol/hl 
4,1 Ecu/hl 
1. Juli 1997 0,8Ecu/%vol/hl + 4,l 0,8 Ecu/ %vol/hl 
Ecu/hl 
1. Juli 1998 0,7 Ecu/ %vol/hl +3,8 0,7 Ecu/ %vol/hl 
Ecu/hl 
1. Juli 1999 0,65 Ecu/VovoÜh\+3^ 0,65 Ecu/%vol/hl 
Ecu/hl 
1. Juli 2000 0,6 Ecu %vol/hl + 3,2 0,6 Ecu/%vol/hl 
Ecu/hl 
Für Rum und Taffia mit dem in der nachstehenden Tabelle angegebenen Wert, die 
nicht unter die Warenbezeichnung in Absatz 1 fallen, gelten in der EG im Rahmen 
der nachstehenden Zollkontingente die jeweils angegebenen ermäßigten Zollsätze, bis 
am 1. Januar 2003 Zollfreiheit gewährt wird. Die Zollkontingente gelten fur Rum in 
Behältnissen beliebiger Größe. 
1. Juli 1997 
I.Januar 1998 
1. Januar 1999 
1. Januar 2000 
1. Januar 2001 
1. Januar 2002 
Ab 1. Januar 2003 Zollsatz 
In Behältnissen 
mit einem Inhalt 
von 2 Litern 
oder weniger 
und mit einem 
Wert von mehr 
als 7,9 Ecu je 
Liter reinen 
Alkohols 
0,7 Ecu/ %vol/hl 
+3,5 Ecu/hl 
0,6 Ecu/ %vol/hl 
+ 2,9 Ecu/hl 
0,5 Ecu/%vol/hl 
+ 2,3 Ecu/hl 
0,4 Ecu/ %vol/hl 
+ 1,8 Ecu/hl 
0,3 Ecu/ %vol/hl 
+1,2 Ecu/hl 
0,2 Ecu/ %vol/hl 
+0,6 Ecu/hl 
frei In Behältnissen 
mit einem Inhalt 
von mehr als 2 
Litern 
und mit einem 
Wert von mehr 
als 2,0 Ecu je 
Liter reinen 
Alkohols 
0,7 Ecu/%vol/hl 
0,6 Ecu/%vol/hl 
0,5 Ecu/%vol/hl 
0,4 Ecu/%vol/hl 
0,3 Ecu/%vol/hi 
0,2 Ecu/%vol/hl 
frei Zollkontingent 
Liter reinen 
Alkohols 
890 000 
1 950 000 
2 145 000 
2 359 500 
2 595 450 
2 854 995 
unbegrenzt 
Für Rum und Taffia unterhalb der obengenannten Wertgrenze sowie für Rum und 
Taffia, die nicht unter die Zollkontingente fallen, gelten die in Absatz 1 genannten 
Zollsätze. 
Die Europäische Gemeinschaft notifiziert den Vereinigten Staaten von Amerika 
unverzüglich alle zwischen dem 1. Januar 2000 und dem 1. Januar 2003 
eintretenden Änderungen bei der Präferenzbehandlung ihrer Rumeinfuhren. Die 
Europäische Gemeinschaft nimmt auf Antrag unverzüglich Konsultationen mit den 
Vereinigten Staaten von Amerika über Angelegenheiten im Zusammenhang mit 
den unter Absatz 2 fallenden Rumausfuhren der Vereinigten Staaten von Amerika 
in die Gemeinschaft auf, um eine für beide Seiten zufriedenstellende Lösung fiir 
alle bei den Konsultationen angesprochenen Fragen zu finden. 
i) vi 
B. Zölle der Vereinigten Staaten von Amerika 
5. Die Zölle auf Rum und Taffia werden wie folgt gesenkt: 
Rum und Taffia Rum und Taffia 
(a) in Behältnissen mit (a) in Behältnissen mit 
einem Inhalt von 4 Litern einem Inhalt von 4 Litern 
oder weniger und mit einem oder weniger und einem 
Wert von mehr als 3,00 Wert von 3,00 USD je 
USD je "Proof-Liter; und "Proof-Liter oder weniger; 
und 
su\ • D u u • * (b) in Behältnissen mit 
(b) in Behaltnissen mit V _ , , 
• _ T u u u i A einem Inhalt von mehr als 4 
einem Inhalt von mehr als 4 x. 
Litern und einem Wert von Litern und einem Wert von 
mehr als 69 Cents je 69A Cents Je Proof "Llter 
"Proof-Liter oder weniger 
1. Juli 1997 26,1 Cents/"Proof-Liter 30,4 CentsTProof '-Liter 
1. Januar 1998 21,7 CentsTProof -Liter 28,1 Cents/"Proof-Liter 
1. Januar 1999 17,4 Cents/"Proof -Liter 25,9 Cents/"Proof'-Liter 
1. Januar 2000 13,0 Cents/"Proof-Liter 23,7 Cents/^'Proof-Liter 
1. Januar 2001 8,7 Cents/"Proof -Liter 23,7 Cents/"Proof-Liter 
1. Januar 2002 4,3 Cents/"Proof-Liter 23,7 Cents/"Proof-Liter 
I.Januar 2003 frei 23,7 Cents/"Proof-Liter 
u ' v 
EC - SPIRITS - Schedule CXL 
CN 97 Label Base Final Bound Implementation 
Rate Rate Jul. 97 Jan. 93 Jan. 99 Jan. 2000 
2208 
2208 20 
2208 20 12 
2208 20 14 
2208 20 26 — 
2208 20 27 
2208 20 29 — 
2208 20 40 — 
2208 20 62 
220S 20 64 
1208 20 86 
2208 20 87 Undenatured ethyl alcohol of an alcoholic strength by volume of 
less than 80 % vol; spirits, liqueurs and other spirituous beverages 
Spirits obtained by distilling grape wine or grape marc 
In containers holding 2 litres or less 
Cognac 
Armagnac 
Grappa 
Brandy de Jerez 
Other 
In containers holding more than 2 litres 
Raw distillate 
Other 
Cognac 
Armagnac 
Grappa 
Brandy de Jerez 1.12 Ecu/% 
vol/hl + 7 
Ecu/hl 
1.12 Ecu/% 
vol/hl + 7 
Ecu/hl 
1.12 Ecu/% 
vol/hl + 7 
Ecu/Id 
1.12 Ecu/% 
vol/hl + 7 
Ecu/hl 
i. 12 Ecu/% 
vol/hl + 7 
Ecu/hl 
12 Ecu/% 
vol/hl 
12 Ecu/% 
vol/hl 
1 2 Ecu/% 
vol/hl 
12 Ecu/% 
vol/hl 
. 12 Ecu/% 
vol/hl fret 
tree 
free 
free 
free 
free 0.84 Ecu/% 
vol/hl + 5.3 
Ecu/hl 
0.84 Ecu/% 
vol/hl+ 5.3 
Ecu/Til 
0.84 Ecu/% 
vol/hl + 5.3 
Ecu/hl 
0.84 Ecu/% 
vol/hl+5.3 
Ecu/hl 
0.84 Ecu/% 
vol/hl'+5.3 
Ecu/hl 
0.84 Ecu/% 
vol/hl / 
0.84 Ecu/% 
vol/hl 
0.84 Ecu/% 
vol/hl 
0.84 Ecu/% 
vol/hl 
0.84 Ecu/% 
vol/hl 0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 
0.56 Ecu/% 
vol/hl+ 3.5 
Ecu/hl 
0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 
0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 
0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 
0.56 Ecu/% 
vol/hl 
0.56 Ecu/% 
vol/hl 
0.56 Ecu/% 
vol/hl 
0.56 Ecu/% 
vol/hl 
0.56 Ecu/% 
vol/hl 0.28 Ecu/% 
vol/hl + 1,8 
Ecu/hl 
0.28 Ecu/% 
vol/hl+1.8 
Ecu/hl 
0.28 Ecu/% 
vol/hl+1.8 
Ecu/hl 
0.28 Ecu/% 
vol/hl+1.8 
Ecu/hl 
0.28 Ecu/% 
vol/hl + 1.8 
Ecu/hl 
0.28 Ecu/% 
vol/hl 
0.28 Ecu/% 
vol/hl 
0.28 Ecu/% 
vol/hl 
0.28 Ecu/% 
vol/hl 
0.28 Ecu/% 
. vol/hl free 
free 
free 
free 
free 
free 
free 
free 
free 
free 
lundi 17 février 1997 European Commission 
Delegation in Geneva - aj Page 1 
EC - SPIRITS - Schedule CXL 
CN 97 Label Base 
Rate Final Bound 
Rate Jul. 97 Implementation 
Jan. 9& Jan. 99 Jan.2000 
2208 20 89 — Other 
2208 30 
2208 30 11 
2208 30 19 Whiskies 
Bourbon whiskey, in containers holding 
2 litres or less 
More than 2 litres 12 Ecu/% 
vol/hl 
0.2 Ecu/% 
vol/hl + 1.5 
Ecu/hl 
0.2 Ecu/% 
vol/hl free 
free 
free 0.84 Ecu/% 
vol/hl 
0.15 Ecu/% 
vol/hl + 1.13 
Ecu/hl 
0.15 Ecu/% 
vol/hl 0.56 Ecu/% 
vol/hl 
0.1 Ecu/% vol/hl 
+ 0.8 Ecu/hl 
0.1 Ecu/% vol/hl 0.28 Ecu/% 
vol/hl 
0.05 Ecu/% 
vol/hl + 0.8 
Ecu/hl 
0.05 Ecu/% 
vol/hl tree 
free 
free 
2208 30 32 — Scotch whisky 
Malt whisky, in containers holding 
2 litres or less 
2208 30 38 — More than 2 litres 0.28 Ecu/% 
vol/hl+ 2.1 
Ecu/hl 
0.28 Ecu/% 
vol/hl free 
free 0.21 Ecu/% 
vol/hl + 1.6 
Ecu/hl 
0.21 Ecu/% 
vol/hl 0.14 Ecu/% 
vol/hl +1.1 
Ecu/hl 
0.14 Ecu/% 
vol/hl 0.07 Ecu/% 
vol/hl + 0.5 
Ecu/hl 
0.07 Ecu/% 
vol/hl free 
free 
2208 30 52 — Blended whisky, in containers holding 
— 2 litres or less 
2208 30 58 — More than 2 litres 
2208 30 72 Other, in containers holding 
2 litres or less 0.28 Ecu/% 
vol/hl+ 2.1 
Ecu/hl 
0.28 Ecu/% 
vol/hl 
0.28 Ecu/% 
vol/hl + 2.1 
Ecu/hl free 
free 
free 0.21 Ecu/% 
vol/hl + 1.6 
Ecu/hl 
0.21 Ecu/°,y 
vol/hl / 
0.21 Ecu/% 
vol/hl +1.6 
Ecu/hl 0.14 Ecu/% 
vol/hl +1.1 
Ecu/hl 
0.14 Ecu/% 
vol/hl 
0.14 Ecu/% 
vol/hl + 1.1 
Ecu/hl 0.07 Ecu/% 
vol/hl + 0.5 
Ecu/hl 
0.07 Ecu/% 
vol/hl 
0.07 Ecu/% 
vol/hl + 0.5 
Ecu/hl free 
free 
free 
2208 30 78 — More than 2 litres 28 Ecu/% 
vol/hl free 0.21 Ecu/% 
vol/hl 0.14 Ecu/% 
vol/hl 0.07 Ecu/% 
vol/hl free 
2208 30 82 Other, in containers holding 
2 litres or less 
lundi 17 février 1997 0.28 Ecu/% 
vol/hl + 2.1 
European Commission 
Delegation in Geneva - aj 0.21 Ecu/% 
vol/hl + 1.6 0.14 Ecu/% 
vol/hl+1.1 0.07 Ecu/% 
vol/hl + 0.5 free 
CN 97 EC - SPIRITS - Schedule CXL 
Label Base Final Bound Implementation 
Rate Rate Jul. 97 Jan. 99 Jan. 99 
Ecu/hl Ecu/hl Ecu/hi Ecu/hl Jan. 2000 
2208 30 More than 2 litres 0 28 Ecu/% 
vol/lil free 0.21 Ecu/% 
vol/hl 0.14 Ecu/% 
vol/hl 0.07 Ecu/% 
vol/hl free 
2208 40 - . Rum and taffia: 
2208 40 10 -- In containers holding 2 litres or less 
— Ex : Rum with a content of volatile substances other than ethyl 
and methyl alcohol equal to or exceedmg 225 grajns per hectolitre 
of pure alcohol with a 10% tolerance. 
-- Ex : Other U 8 r.cu/% 
vol/hl 
+ 4.1 Ecu/lil 
0.8 Ecu/% 
vol/lil 
+ 4.1 Ecu/hl 
2208 40 90 
2208 50 In containers holding more than 2 litres 
Ex ' Rum with a content of volatile substances other than ethyl 
and methyl alcohol equal to or exceeding 225 grams per hectolitre 
of pure alcohol with a 10% tolerance 
Ex : Other 
Gin and geneva: 0.8 ECU/% 
vol/hl 
0.8 Ecu/% 
vol/hl 
2208 50 Gin, in containers holding 
2 litres or less 0 8 Ecu/% 
vol/hl 
+4 1 Ecu/hl Iree 0.6 Ecu/% 
vol/hl 
+ 3.1 Ecu/hl 0.4 Ecu/% 
vol/hl 
+ 2.1 Ecu/hi 0.2 Ecu/% 
vol/hl 
+ 1.0 Ecu/hl free 
2208 50 19 More than 2 litres 0 8 Ecu/% 
vol/lil 0.6 Ecu/%, 
vol/hl 0.4 Ecu/% 0.2 Ecu/% 
vol/hl iree 
2208 50 91 Geneva, m containers holding 
2 litres or less ! 3 lxu/% 
vol/hl 
+ 82 Ecu/li! free 1.0 Ecu/% 
vol/hl 
6.2 Ecum! 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
vol/hl 
+2.1 Ecu/hl free 
2208 50 99 More than 2 litres 3 Ecu/% 
vol/hl tree 0 Ecu/% 
vol/hl 0.7 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl tree 
Sts> *• 2208 60 
2208 60 11 
lundi 17 février 1997 Vodka 
Of an alcoholic strength by volume of 45 4% vol or less m containers holding 
2 litres or less I i Ecu/% 
European Commission 
Delegation in Geneva - aj tree 0.8 Ecu/% 0.6 Ecu/% 0.3 Ecu/% free 
Paae 3 
EC - SPIRITS - Schedule CXL i 7-
C; CN 97 
2208 40 
2208 40 10 
2208 40 90 Label 
- Rum and taffia 
in containers holding 2 litres or 
less 
— Ex: Rum with a content of 
volatile substances other than 
ethyl and methyl alcohol equal 
to or exceeding 225 grams per 
hectolitre of pure alcohol with a 
10% tolerance 
— Ex Other: 
— Valued over Ecu 7.9 per litre 
of 100% alcohol* 
—- Other 
In containers holding 2 litres or 
less 
— Ex: Rum with a content of 
volatile substances other than 
ethyl and methyl alcohol equal 
to or exceeding 225 grams per 
hectolitre of pure alcohol with a 
10% tolerance 
— Ex Other: 
— Valued over Ecu 2.0 per litre 
of 100% alcohol* 
—- Other Base Rate 
0.8 
Ecu/%vol/hl + 
4.1 Ecu/hl 
0.8 
Ecu/%vo!/hl T 
4.1 Ecu/h! 
0.8 
Ecu/%vol/h! + 
4.1 Ecu/hl 
0.8 
Ecu/%vol/hl 
0.8 
Ecu/%vol/hl 
0.8 
Ecu/%vol/hl Final Bound 
rate 
0.6 
Bcu/%vot/hl + 
3.2 Ecu/hl 
Free 
0.6 
Ecu/%voi/hl + 
3.2 Ecu/h! 
0.6 
Ecu/%vol/hl 
Free 
0.6 
Ecu/%vol/hl Implementation 
July 1997 
0.8 
Ecu/%vol/hl + 
4.1 Ecu/hl 
July 1997 
07 
Ecu/%vol/hl -* 
3 5 Ecu/hl* 
July 1997 
0.8 
Ecu/%voi'hl + 
4 1 Ecu/hl 
July 1997 
0 8 
Ecu/%voi/hl 
July 1997 
07 
l;Cu/%vol Til* 
July 1997 
08 
Ecu/%vol/hl July 1998 
07 
Ecu/%vol/hl + 
3.8 Ecu/hl 
Jan 1998 
0.6 
Ecu/%voi/hl + 
2 9 Ecu/hl* 
July 1998 
0.7 
Ecu/%vol/hl + 
3.8 Ecu/hl 
July 1998 
0.7 
Ecu/%vol/hl* 
Jan 1998 
0.6 
Ecu/%vol/hl* 
July 1998 
07 
Ecu/%voi/hi 
i July 1999 
0.65 
Ecu/%vol/h! + 
3.5 Ecu/hl 
Jan 1999 
0.5 
Ecu/%vo!/hl + 
2.3 Ecu/hl* 
July 1999 
0.65 
Ecu/%vo!/h! + 
3.5 Ecu/hl 
July 1999 
0.65 
Ecu/%vol/hI 
Jan 1999 
05 
Ecu/%vol/hl* 
July 1999 
0.65 
Ecu/%vol/hl July 2000 
0.6 
Ecu/%vol/hl + 
3.2 Ecu/hl 
Jan 2000 
0.4 
Ecu/% vol/hl + 
1.8 Ecu/hl* 
July 2000 
0.6 
Ecu/%vol/hl + 
3.2 Ecu'hl 
July2000 
0.6 
Ecu/%vol/hi 
Jan 2000 
0.4 
Ecu/%vol/hl* 
July 2000 
0.6 
Ecu/% vol/hl Jan 2001 
0.3 
Ecu/%vol/h! + 
1.2 Ecu/hl* 
Jan 2001 
0.3 
Ecu/%vol/hl* Jan 2002 
0.2 
Ecu/%vol/hl + 
0 6 Ecu/hi* 
Jan 2002 
0.2 
Ecu/%vol/hl* Jan 2003 
Free 
Jan 2003 
Free 
* Note: In the periûd 1 July 1997 to 31 December 2002 these concessions shall be limited by the tariff quota amounts indicated below within which rum and taffia in whatever size of container can be imported at the 
duty rates indicated. From 1 January 2003 there will be no tariff quota limitation: 
Tariff Quota Litres of 100% alcohol Tariff Quota Lures of 100% alcohol Tariff Quota Litres of 100% alcohol 
Period 1 July 1997 - 3! December 1997 890.000 1 Jan 1999 - 3! December 1999 2,145,000 I Jan 2001 -3! December 2001 2,595,450 
J Jan 1998-31 December 1998 1,950,000 - I Jan 2000 - 31 December 2000 2,359,500 1 Jan 2002 - 31 December 2002 2,854,995 6 À)/j 
EC - SPIRITS - Schedule CXL 
CN97 Label Base Final Bound Implementation 
Rate Rate Jul. 97 Jan. 9g Jan. 99 Jan.2000 
vol/hl 
+4.1 Ecu/hl vol/hl 
+3.1 Ecu/hl vol/hl 
+2.1 Ecu/hl vol/hl 
+1.0 Ecu/hl 
2208 60 19 More than 2 litres 1.1 Ecu/% 
vol/hl free 0.8 Ecu/% 
vol/hl 0.6 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
2208 60 91 Of an alcoholic strength by volume of more than 45.4% vol in containers holding: 
2 litres or less 1.3 Ecu/% 
vol/hl 
+8.2 Ecu/hl free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
vol/hl 
+2.1 Ecu/hl free 
2208 60 99 More than 2 litres .3 Ecu/% 
vol/hl free 1.0 Ecu/% 
vol/hl 0.7 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
2208 70 - Liqueurs and cordials in containers holding: 
2208 70 10 - 2 litres or less 1.3 Ecu/% 
vol/hl 
+8.2 Ecu/nl free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
. vol/hl 
+2.1 Ecu/hl free 
2208 70 90 More than 2 litres 1.3 Ecu/% 
vol/hl free 1.0 Ecu/% 
vol/hl 0.7 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
2208 90 - Other 
— Arrack, in containers holding: 
2208 90 11 — 2 litres or less 0.8 Ecu/% 
vol/hl 
+4.1 Ecu/hl free 0.6 Ecu/% 
vol/hl 
+3.1 Ecu/hl 0.4 Ecu/% 
vol/hl 
+2.1 Ecu/hl 0.2 Ecu/% 
vol/hl 
+1.0 Ecu/hl free 
2208 90 19 — More than 2 litres 0.8 Ecu/% 
vol/hl free 0.6 Ecu/%/ 
vol/hl ; 0.4 Ecu/% 
vol/hl 0.2 Ecu/% 
vol/hl free 
2208 90 33 Plum, pear or cherry spirit (excluding liqueurs), in containers 
holding 
2 litres or less 0.91 Ecu/% 
vol/hl + 3.5 
Ecu/hl free 0.68 Ecu/% 
vol/hl + 2.6 
Ecu/hl 0.46 Ecu/%) 
vol/hl + 1.8 
Ecu/hl 0.22 Ecu/% 
vol/hl + 0.9 
Ecu/hl free 
2208 90 38 More than 2 litres 1 Ecu/% 
vol/hl free 0.8 Ecu/% 
vol/hl 0.6 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
Other spirits, and other spirituous beverages, in containers holding 
2 litres or less 
lundi 17 février 1997 European Commission 
Delegation in Geneva - aj Page 4 
EC - SPIRITS - Schedule CXL 
CN97 Label Base 
Rate Final Bound 
Rate Jul. 97 Implementation 
Jan. 9fi Jan. 99 Jan. 2000 
2208 90 41 
2208 90 45 Ouzo 
Other 
•Spirits (excluding liqueurs) 
- Distilled from fruit 
— Calvados 1.3 Ecu/% 
vol/hl 
-8 2 Ecu/hl 
1.12 Ecu/% 
vol/hl + 7 
Ecu/hl free 
free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 
0.84 Ecu/%) 
vol/hl + 5.3 
Ecu/hl 0.7 Ecu/% 0.3 Ecu/% 
vol/hl vol/hl 
+4.1 Ecu/hl +2.1 Ecu/hi 
0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 0.28 Ecu/% 
vol/hl + 1.8 
Ecu/hl free 
free 
2208 90 48 —-- Other 1.12 Ecu/% 
vol/hl + 7 
Ecu/hl free 0.84 Ecu/% 
vol/hl + 5.3 
Ecu/hl 0.56 Ecu/% 
vol/hl + 3.5 
Ecu/hl 0.28 Ecu/% 
vol/hl+1.8 
Ecu/hl free 
Other 
2208 90 52 Korn 1.3 Ecu/%o 
vol/hl 
+8.2 Ecu/hl free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
vol/hl 
+2.1 Ecu/hl free 
2208 90 57 Other 1.3 Ecu/% 
vol/hl 
+8.2 Ecu/hl free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
vol/hl 
+2.1 Ecu/hl free 
2208 90 69 Other spiritual beverages 1.3 Ecu/% 
vol/hl 
+8.2 Ecu/hl free 1.0 Ecu/% 
vol/hl 
+6.2 Ecu/hl 0.7 Ecu/% 
vol/hl 
+4.1 Ecu/hl 0.3 Ecu/% 
vol/hl 
+2.1 Ecu/hl free 
2208 90 71 More than 2 litres 
Spirits (excluding liqueurs) 
•Distilled from fruit ! 2 Ecu/% 
vol/hl free 0.84 Ecu/% 
vol/hl 0.56 Ecu/% 
vol/hl 0.28 Ecu/% 
vol/hl free 
2208 90 74 Other 3 Ecu/% 
vol/hl tree 1.0 Ecu/% 
vol/hl 0.7 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
2208 90 78 — Other spiritual beverages 1.3 Ecu/% 
vol/hl free 1.0 Ecu/% 
vol/hl 0.7 Ecu/% 
vol/hl 0.3 Ecu/% 
vol/hl free 
lundi 17 février 1997 European Commission 
Delegation in Geneva - aj Page 5 
FINANZBOGEN 
1. Vorschlag fur einen BescWuß des Rates über die Beseitigung der Zölle auf Waren der 
Informationstechnologie und auf bestimmte Spirituosen 
2. Haushaltslinie: Kapitel 12/Artikel 120 
3. Rechtsgrundlage: Artikel 113 
4. Beschreibung der Maßnahme: Der Vorschlag geht zurück auf den Beschluß des Rates 
über die Aufnahme von Verhandlungen mit Drittländern über den Abschluß eines 
Übereinkommens über die Informationstechnologie und auf die politische 
Verpflichtung, die die Minister am 13. Dezember 1996 auf der Ministerkonferenz in 
Singapur eingegangen sind. 
Er betrifft die Beseitigung der Zölle auf Waren der Informationstechnologie und auf 
bestimmte Spirituosen bis zum Jahr 2000. 
5. Art der Einnahmeverluste: Zölle auf Einfuhren aus Drittländern 
6. Änderung der Höhe der Einnahmen: Die Einfuhrzölle auf Waren der 
Informationstechnologie sollen in vier gleichen Raten vom 1. Juli 1997 bis zum 1. 
Januar 2000 beseitigt werden. Die Einnahmeverluste wurden anhand der Differenz 
zwischen den in der Uruguay-Runde vereinbarten Zollsätzen (für die jeweiligen 
Kalenderjahre) und den im Rahmen des ITA vereinbarten Zollsätzen (für die 
entsprechenden Kalenderjahre) berechnet, wobei das Einführvolumen des Jahres 1995 
zugrunde gelegt wurde (siehe Anhang). Die Einnahmeverluste entsprechen also 
lediglich den zusätzlichen Mindereinnahmen. Auf dieser Grundlage ergeben sich 
folgenden Einnahmeverluste: 
1.7.97: 242,6 MECU 
1.1.98: 643,3 MECU 
1.1.99: 891, 3 MECU 
1.1.2000: 1.241,8 MECU 
Im Falle der Spirituosen ergeben sich ausgehend von den Einführen in die 
Fünfzehnergemeinschaft im Jahre 1995 und unter Zugrundelegung der Wertäquivalente 
7 •* 
für alle Einführen aus den Ländern mit Meistbegünstigungsstatus in diesem Jahr 
folgende Zollmindereinnahmen: 
1.7.97: 0,5 MECU 
1.1.98: 1,6 MECU 
1.1.99: 2 MECU 
1.1.2000: 2,5 MECU 
1.1.2001: 1,9 MECU 
1.1.2002: 1,2 MECU 
1.1.2003: 0,7 MECU 
Die durchschnittlichen jährlichen Einnahmeverluste belaufen sich auf 1,625 MECU und 
insgesamt auf 10,5 MECU (über einen Zeitraum von 6,5 Jahren). 
Die Einnahmeverluste bei den traditionellen Eigenmitteln werden durch zusätzliche 
BSP-Eigenmittel finanziert. 
7 f-> 
European 
Commission ITA DUTY LOSS 1997-2000 Directorate General 
External Relations 
HS-97 
3818 00 Total 
8469 11 Total 
8470 10 Total 
8470 21 Total" 
8470 29 Total 
8470 30 Total 
8470 40 totalT 
8470 50 Total 
8470 90 Total 
8471 10 Total 
8471 30 Total 
8471 41 Total 
8471 49 Total 
8471 50 Total 
8471 60 Total 
8471 70 Total 
8471 80 Total 
8471 90 Total 
8472 90 Total 
8473 21 Total 
8473 29 Total 
8473 30 Total 
8473 50 Total 
8504 40 Total 
8504 50 Total 
8517 11 Total 
8517 19 Total 
8517 21 Total 
8517 22 Total 
8517 30 Total 
8517 50 Total 
8517 80 Total' 
8517 90 Total 
8518 10 Total 
8518 29 Total 
8518 30 Total ~ 
8520 20 Total 
8523 11 Total 
8523 12 Total 
8523 13 Total 
8523 20 Total 
8523 90 Total 
8524 31 Total 
8524 32Totaï 
8524 39 Total 
8524 40 Total 
8524 91 Total 
8524 99 Total 
8525 10 Total 
"" 8525 20 Total 
8525 40 Total 
8527 90 Total 
8529 10 Total 
8529 90 Total 
8531 20 Total 
85311 90 Total 
~ 8532 To" Total ' 
8532' 21 total' 
8532 22 total"" 
8532 23 Total 
8532 24 Total 
8532 25 Total 
8532 29 Total EU imports 
95 (kecu) 
170 531 
29 929 
" 410~719 
59 114 
11 975 
2 786 
11 834 
166 942 
32 651 
83 905 
2 956 157 
344 694 
2 308 652 
538 257 
4 769150 
5 495 373 
538 415 
287 733 
22 038 
4 654 
33 008 
3 352 385 
3 632 303 
250 682 
10 903 
375 826 
1058 182 
859 052 
1 334 
152 286 
673 096 
'443 858 
1 17 {'807 
4 132 
"9796 
'"' ""41032 
126 869 
100 846 
" 62 554 
437 681 
239 0181 
80 320 
"~" 89 984"" 
89984 
80 986 
" ' 145407" 
989196 
18 630 
24608 
388 830 
94 861 
34 958 
149 579 
817789 
822 421 
12 931 
0 
131 340 
251 381 
50 047 
22^2 137 
24 091 
21420 Total duty 
loss 
ITA 
26 432 
T"616 
43 622 
" 8 394 
" ~1 701 
130 
550 
7 763 
1 518 
2317 
175 892 
20134 
136 826 
31 692 
19 070 
20 234 
2154 
1 151 
1 146 
101 
644 
159 348 
182 332 
1 003 
949 
1 879 
228 762 
71 731 
111 
12716 
57 152 
37 063 
81 855 
"~ 246 
705 
1 949 
11 862 
4 639 
5 223 
36 546 
14 039 
6 707 
7514 
7514 
6 762 
3 878 
5 603 
1 556 
2 129 
58145 
11 146 
6 572 
12 639 
57 245 
79 301 
1 248 
0 
11 492 
21996 
3 253 
14 439 
1 566 
ï~392 Duty loss 97 
4 steps 
1 535 
120 
3304 
650 
132 
~10" 
41 
584 
114 
175 
13 303 
1 523 
10348 
2 397 
14 303 
15611 
1 615 
863 
88 
19 
87 
12910 
13 563 
752 
65 
1 504 
13445 
5 584 
9 
990 
4 138 
2 885 
6781 
19 
49 
~ 226 
825 
403 
344 
2 407 
1 128 
442 
495" 
495 
445 
" ' 54 r 
"""3019 
1Ö3 
135 
3178^ 
419 
972 
4 907 
4519 
"71 
26 
854 
1 634"" 
250 
1 110 
120 
ToY Duty loss 98 
4 steps 
5 628 
359 
9 495 
1 833 
371 
28 
118 
1 669 
327 
506 
38 430 
4 399 
29 895 
6 924 
4 767 
4 623 
538 
288 
243 
23 
125 
34 748 
37 785 
251 
207 
376 
48140 
15 463 
24 
2 741 
12 353 
7 990 
17 828 
54 
157 
451 
2 537 
1 008 
1 126 
7 878 
3 036 
1 446 
1 620 
1 620 
""" 1 458" 
851 
1 34Ï 
336" 
468 
12 339 
2 372 
1 398 
2 692 
12 266 
17 257 
272 
" " " 73" 
2 495 
4 776" 
701 
3110 
337 
300 Duty loss 99 
4 steps 
8 185 
449 
12 383 
2 365 
479 
36 
154 
2 170 
424 
662 
50 255 
5 752 
39 093 
9 055 
0 
0 
0 
0 
331 
24 
183 
49 640 
55 417 
0 
273 
0 
71 647 
19 759 
31 
3 503 
16 429 
10 209 
"22094 
70 
206 
451 
3 425 
1 210 
1 564 
10 942 
4114 
2 008 
2 250 
2 250 
2 025 
1 034 
"518 
466 
640 
18322 
3510 
1 958 
3 590 
15 538 
24 653 
388 ...... _^ 
3 284 
6285 
951" 
4 221 
458 
407" Duty loss 00 
4 steps 
11 085 
689 
"18 440 
3 547 
719 
56 
237 
3 339 
653 
974 
73 904 
8 460 
57 490 
13316 
0 
0 
0 
0 
485 
36 
250 
62 050 
75 568 
0 
403 
0 
95 530 
30 926 
48 
5 482 
24 232 
15 979 
"35 153 
"103 
294 
_ 821 
5 075 
2017 
2 189 
15319 
5 760 
2811 
3 149 
3 149 
2 834 
1 450 
725 
652 
886 
24305 
4 648 
2 797 
5 386 
24 534 
32 871 
517 
140 
4 860 
9301 
1 351 
5 998 
650 
578 ?;* 
Pug« 1 
European 
Commission ITA DUTY LOSS 1997-2000 Directorate General 
External Relations 
HS-97 
8532 30 Total 
8532 90 Total 
8533 10 Total 
8533 21 Total 
8533 29 Total 
8533 31 Total 
8533 39 Total 
8533 40 Total 
8533 90 Total 
8534 00 Total 
8536 50 Total 
8536 90 Total 
8541 10 Total 
8541 21 Total 
8541 29 Total 
8541 30 Total 
8541 40 Total 
8541 50 Total 
8541 60 Total 
8541 90 Total 
8542 12 Total 
8542 13 Total 
8542 14 Total 
8542 19 Total 
8542 30 Total 
8542 40 Total 
8542 50 Total 
8542 90 Total 
8543 81 Total 
8543 89 Total 
8544 41 Total 
8544 49 Total 
8544 51 Total 
8544 70 Total 
9001 10 Total 
9009 12 Total 
9009 21 Total 
9009 90 Total 
9026 10 Total 
9026 20 Total 
9026 80 Total 
9026 90 Total 
9Ö27' 20 Total " 
9027 "30 "total" 
"902~7 'SOTotaT 
~9027~8Ö Total 
9027 90 total 
9030 40 "total" 
Grand Total EU imports 
95 (kecu) 
22 797 
6 070 
50 255 
158 855 
26 522 
18 333 
8 032 
101 626 
17 264 
593 219 
31 476 
527 614 
214 276 
117 862 
223 342 
27 227 
283 283 
16154 
328 696 
41 665 
86 358 
3 297 950 
216 715 
3 518 982 
896 423 
150 154 
174 530 
88 672 
269 728 
13 486 
57 694 
47 339 
7 101 
44 147 
53 088 
399 100 
169 827 
933 748 
74 446 
106 025 
75 851 
106 653 
62103 
170 639 
159 177 
"324 106 
205 974 
"82925 
50 430 563 Total duty 
loss 
ITA 
1 995 
534 
3 216 
"TO 167 
1 697 
1 173 
514 
6504 
1 105 
62 584 
1 700 
28 491 
35 784 
19 683 
37 296 
4 547 
21 013 
2 698 
30 569 
2 854 
28 714 
191 806 
25 841 
218 368 
149 704 
25 076 
29 147 
6 074 
23 601 
1 180 
4 442 
4118 
547 
5 474 
3 610 
56 872 
24 200 
131 854 
4 006 
6314 
4 284 
4 940 
3 485 
9300 
9 391 
16 654 
12 152 
8 362 
3 018 930 Duty loss 97 
4 steps 
148 
36 
"251 
794 
133 
92 
"40 
508 
86 
3 856 
126 
2110 
1 928 
1 061 
2010 
245 
1 495 
145 
2 301 
229 
1 511 
13 183 
1 640 
14 862 
8 068 
1350 
1 571 
488 
1 753 
88 
346 
284 
43 
353 
319 
3 392 
"~" 1 444" 
7 877 
344 
532 
369 
449 
313" 
768 
955 
1 659 
1 236 
580 
242 676 Duty loss 98 
4 steps 
433 
115 
704 
2 224 
37l" 
257 
112 
1 423 
242 
13 051 
378 
6 331 
7500 
4 126 
7 817 
953 
4 456 
565 
6 574 
625 
6045 
39 569 
5 361 
45 080 
31 374 
5 255 
6 109 
1 330 
5 125 
256J 
923 
899 
114 
1 192 
796 
11 973 
5 095 
27 773" 
869 
1 378 
930 
1 098 
608 
1365 
2 069 
3 663 
2 678 
1 904 
643 351 Duty loss 99 
4 steps 
570 
1581 
905' 
"T859 
4771 
330 
145 
1 830 
311 
18 983 
473 
7 914 
11 357 
6 246 
11 837 
1 443 
6 465 
856 
8 546 
792 
9068 
59 918 
8119 
68 266 
47 510 
7 958 
9 250 
1 685 
6 743 
337 
1 269 
1 183 
156 
1 633 
956 
17 560 
7 472 
40 692 
1 072 
1 692 
1 146 
1 297 
1 012 
2 901 
2 388 
4 290 
3 090 
2 401 
891 396 Duty loss 00 
4 steps 
844 
225 
1 357 
4 289 
716 
495 
217 
2 744 
466 
26 695 
724 
12135 
15000 
8 250 
15 633 
1 906 
8 597 
1 131 
13148 
1 208 
12 090 
79 137 
10 723 
90 161 
62 750 
10510 
12217 
2 571 
9 980 
499 
1 904 
1 752 
234 
2 296 
1 540 
23 946 
10190 
55 513 
1 718 
2715 
1 838 
2 096 
1 552 
4 266 
3 979 
7043 
5149 
3 477 
1 241 843 
Pn«.- 2 

ISSN 0254-1467 
KOM(97) 96 endg. 
DOKUMENTE 
DE 02 03 15 
Katalognummer : CB-CO-97-090-DE-C 
ISBN 92-78-16669-3 
Amt für amtliche Veröffentlichungen der Europäischen Gemeinschaften 
L-2985 Luxemburg 
/;»