Complex sentence: Formation of cracks and growth of intermetallics in die attachment materials may lead to formation of voids and delamination, impairing the heat transfer from the chip die to the substrate and heatsink, and cause a thermal-related failure.
Split into simpler sentences: Formation of cracks and growth of intermetallics in die attachment materials may lead to formation of voids and delamination. This impairs heat transfer from the chip die to the substrate and heatsink, causing a thermal-related failure.