baber/WOPTO huggingface dataset:
Patent TW-201234243-A (TW)
Title: Projective capacitive touch sensor structure and fabricating method thereof
Inventor: YAU BAO-SHUN
IPC: G06F3/044
Filed: 2011-06-09
Abstract: A projective capacitive touch sensor structure includes following elements. A first transparent patterned electrode is disposed on a substrate. Two second transparent patterned electrodes are disposed on the substrate and located at two sides of the first transparent patterned electrode. A bridging wire strides over the first transparent patterned electrode and electrically bridges the second transparent patterned electrodes located at the two sides of the first transparent patterned electrode to form a conducting wire. A transparent dielectric pad is disposed between the bridging wire and the first transparent patterned electrode. A dielectric portion of the transparent dielectric pad located above the first transparent patterned electrode and the second transparent patterned electrodes includes an upper surface, a lower surface and an inclined side surface connecting the upper surface and the lower surface, an area of the upper surface is 70% - 95% of an area of the lower surface, and an included angle between the inclined side surface and the lower surface is an acute angle.
Patent TW-201217010-A (TW)
Title: Apparatus and method for modifying pressure-flow characteristics of a pump
Inventor: REICHENBACH STEVEN H
IPC: A61M1/10
Filed: 2011-06-22
Abstract: A method for modifying a pump of a ventricular assist device includes the step of modifying pressure-flow characteristics of a pump of a ventricular assist device to simulate different pressure-flow characteristics or to make the flow rate of the pump more responsive to changes in the pressure differential of the pump. The step of modifying the pressure-flow characteristics of the pump may includes one or both of the steps of (1) estimating a flow rate of the pump from the speed of an electric motor of the ventricular assist device and from the current or power consumption of the electric motor, wherein the electric motor drives the pump, and (2) adjusting the speed of the electric motor as a function of the estimated flow rate of the pump and a set speed of the electric motor to simulate the different pressure-flow characteristics or to make the flow rate of the pump more responsive to changes in the pressure differential of the pump.
Patent TW-201205646-A (TW)
Title: Manufacturing method of semiconductor film, manufacturing method of semiconductor device, and manufacturing method of photoelectric conversion device
Inventor: TANAKA TETSUHIRO
IPC: H01L21/205
Filed: 2011-06-23
Abstract: A method for forming an amorphous semiconductor which contains an impurity element and has low resistivity and a method for manufacturing a semiconductor device with excellent electrical characteristics with high yield are provided. In the method for forming an amorphous semiconductor containing an impurity element, which utilizes a plasma CVD method, pulse-modulated discharge inception voltage is applied to electrodes under the pressure and electrode distance with which the minimum discharge inception voltage according to Paschen's Law can be obtained, whereby the amorphous semiconductor which contains an impurity element and has low resistivity is formed.
Patent TW-201301932-A (TW)
Title: System with wireless network device and method for processing wireless network setting
Inventor: HUANG WEI-CHENG
IPC: H04W12/04
Filed: 2011-06-24
Abstract: A system with a wireless network device includes a wireless network device and an electrical device. A storage unit of the electrical device stores a wireless network setting. A second processing unit of the electrical device detects if there is the wireless network device connected to the electrical device. When there is the wireless network device connected to the electrical device detected, the second processing unit of the electrical device transmits the wireless network setting to the wireless network device. When the wireless network device obtains the wireless network setting, a first processing unit of the wireless network device drives a first wireless network unit of the wireless network device to transmit data wirelessly according to the wireless network setting.
Patent TW-201221538-A (TW)
Title: Di-tin fused thiophene compounds and polymers and methods of making
Inventor: HE MINGQIAN
IPC: C08G61/12
Filed: 2011-07-25
Abstract: Di-tin fused thiophene (FT) compounds, FT polymers, such as of the formula -{-(FTx)-(Ar)m-}n-, FT polymer containing articles or devices, and methods for making and using the FT compounds and polymers thereof of the formulas, as defined herein.
Patent TW-201311366-A (TW)
Title: Ultrasonic machining device
Inventor: QIU ZHENG-XIONG
IPC: B06B1/04
Filed: 2011-09-13
Abstract: An ultrasonic machining device comprises a stationary unit, a rotation unit, and a vibration unit. The stationary unit comprises a shaft seat and at least one carbon brush mounted in the shaft seat. The rotation unit comprises a sleeve that is rotatably mounted in the shaft seat. The vibration unit comprises a connecting seat that is mounted in the sleeve of the rotation unit, an ultrasonic head that is mounted in the connecting seat of the vibration unit, and a conductive ring that is mounted on the connecting seat of the vibration unit and electrically connected with the carbon brush of the stationary unit, in which the ultrasonic head is provided with a constricted small-diameter section, and the conductive ring is sleeved on a periphery of the small-diameter section of the ultrasonic head and is rotatably contacted with the carbon brush of the stationary unit, to thereby be electrified to make the ultrasonic head vibrate. The above-described design can reduce the diameter of the conductive ring of the vibration unit to lessen wear formed between the conductive ring and the carbon brush, thereby extending the service life.
Patent TW-201222624-A (TW)
Title: Tape for wafer processing and production method for same
Inventor: MARUYAMA HIROMITSU
IPC: C09J7/22
Filed: 2011-10-06
Abstract: Provided are a tape for wafer processing which maintains satisfactory sensor detectability even when the adhesive agent layer is thin (10μm or less, and particularly 5μm or less), and provides satisfactory productivity and testing accuracy; and the production method for the tape. The tape (10) for wafer processing is provided with a long release film (11), an adhesive agent layer 12 (22), and an adhesive film (13)(23a, 23b). A circular first perforated section (26) is formed along the circumference of the label-shaped adhesive agent layer (22) on a surface (11a) of the release film (11). The first perforated section (26) is formed so that, with respect to the laminated area in which the release film (11) and the adhesive film (13)(23a) are laminated, if (A%) represents the transmittance of wavelengths between 600 and 700nm occurring at laminated parts (27b) corresponding to positions where the first perforated section (26) is present, and (B%) represents the transmittance of wavelengths between 600 and 700nm, occurring at laminated parts (27a) corresponding to positions where the first perforated section (26) is not present, the difference (C) between the transmittances is at least 0.1%.
Patent TW-201315510-A (TW)
Title: Flame arrester for flange leakage protection
Inventor: CHANG RON-HSIN
IPC: A62C4/00
Filed: 2011-10-07
Abstract: This invention provides a novel flame arrester, for flange leakage protection on a gas pipeline, which comprises of two pieces of clamp apparatus, punched plates and wire screen with opening less than the MESG of gases in the pipeline. The flame arrester is installed on the said gas pipeline in such a manner that a flame front traveling to the said pipeline when the leakage from the said flanges occurred, impinges upon the surface of the punched plate and the wire screen of the clamp apparatus where the flame is extinguished and does not propagate to the inside of pipeline through the flanges.
Patent TW-201318861-A (TW)
Title: De-top method for wafer level optical lens
Inventor: CHOU CHEN-HSIEN
IPC: G02B1/10
Filed: 2011-11-15
Abstract: A de-top method for wafer level optical lenses is provided. The de-top method includes following steps. A wafer level optical lens substrate is provided. The wafer level optical lens substrate has a plurality of wafer level optical lenses thereon. The top of each wafer level optical lens is covered by a protection film. A de-top tool is provided. The de-top tool is connected with the wafer level optical lenses. The de-top tool is separated from the wafer level optical lenses to de-top the protection films from the wafer level optical lenses.
Patent TW-201248938-A (TW)
Title: Silicone composition for sealing semiconductor
Inventor: MOCHIZUKI KIKUO
IPC: H01L33/56
Filed: 2011-11-29
Abstract: A silicone composition for sealing a semiconductor, characterized by comprising: (A) 100 parts by weight of a polyorganosiloxane having one or more alkenyl groups, on average, per molecule, said polyorganosiloxane being obtained by reacting 60-99 parts by weight of an organosiloxane (a1), which at least contains a trifunctional siloxane unit represented by the formula R1SiO3/2 (wherein R1 represents an alkyl group or an aryl group) and does not participate in a hydrosilyl reaction, with 40-1 parts by weight of an organosiloxane (a2) which contains an alkenyl group-containing functional siloxane unit and/or a monofunctional siloxane unit; (B) a polyorganohydrogen siloxane, which has two or more hydrogen atoms bonded to a silicon atom per molecule and has a viscosity at 25oC of 1-1000 mPas, in such an amount as to give 0.5-3.0 mol of hydrogen atoms per mol of the alkenyl group in component (A); and (C) a platinum-based catalyst, and a cured product of said silicone composition showing a decrease in storage modulus of 40% or greater when temperature rises from 25oC to 50oC. The silicone composition forms a cured product having an appropriate modulus and enables a large decrease in the modulus of the cured product upon heating.
Patent TW-201323573-A (TW)
Title: Light-emitting diode for plant growth
Inventor: CHEN XING
IPC: H01L33/00
Filed: 2011-12-13
Abstract: This invention relates to a light-emitting diode for plant growth, comprising: a blue LED die with a wavelength of 440-460 nm; a fluorescent powder composition of at least two different colors, wherein one must be the red fluorescent powder; and a silicone mixed with the fluorescent powder composition and coated on the blue LED die, the excitation spectrum thereof being similar to the photosynthesis plot of plant. Therefore, by using the excitation spectrum similar to the photosynthesis plot of plant, the optimal plant growth effect can be achieved.
Patent TW-201240748-A (TW)
Title: Device and process for horizontal casting of metal strips
Inventor: FRANZ ROLF
IPC: B22D11/10
Filed: 2011-12-13
Abstract: The invention relates to a device (100) for the horizontal casting of a metal strip (3), comprising a substantially horizontally aligned solidifying region (4) for receiving the molten metal discharged from a metallurgical vessel (1), and at least one measuring device (2, 2') for measuring the thickness profile of the metal strip (3), wherein aligning means (8-8''''') are provided for changing the horizontal alignment of the solidifying region.
Patent TW-201250341-A (TW)
Title: Extendable display device
Inventor: YANG MING-HUAN
IPC: G02F1/167
Filed: 2011-12-23
Abstract: An extendable display device including an extendable substrate, and microcapsule display film. The microcell display film is located on the extendable substrate. The microcapsule display film includes a microcell display material and a plasticizer.
Patent TW-201225116-A (TW)
Title: Coil-type electronic component and its manufacturing method
Inventor: OGAWA HIDEKI
IPC: H01F1/22
Filed: 2011-04-22
Abstract: A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.
Patent TW-201239003-A (TW)
Title: Master batch and method FOR producing polyamide resin formation making using the same master batch
Inventor: YAMAMOTO TAKASHI
IPC: C08G69/28
Filed: 2012-02-24
Abstract: The present invention provides [1] Master batch comprising polyamide (X) that contains a diamine unit including over 70 mol% of meta-xylylene diamine and a dicarboxylic acid unit, and alkali compound (A), wherein the average particle size of alkali compound (A) included in the master batch is under 50 μ m, and the number of particles having a size over 80 μ m included in a 5 mm<SP>2</SP> cross-sectional area of the master batch is under 1.5, and the sum of values which are obtained by multiplying the mole concentrations of alkali metal atoms and alkali earth metal atoms included in the master batch 1(g) by respective valence numbers is over 60 μ mol/g and under 1710 μ mol/g; and [2] a method for producing polyamide resin composition making use of the master batch recited in the item [1]. By making use of the master batch according to the present invention, it is possible to provide polyamide resin composition having good appearance and color tone and generates little gel upon being produced.
Patent TW-201338413-A (TW)
Title: Driving circuit and transmitting data method thereof
Inventor: LO YU-LUNG
IPC: H03K19/0175
Filed: 2012-03-13
Abstract: A driving circuit and a transmitting data method thereof are disclosed, wherein the method includes: according to an input control signal selectively transmitting a plurality digital data to a plurality of corresponding channels. The channels include a first channel and a second channel, and the first channel and the second channel respectively have a negative conversion unit and a positive conversion unit; by means of the negative conversion unit or the positive conversion unit converting the digital data into a plurality of negative analog data or a plurality of positive analog data; and according to a switching control signal, by means of a switching unit selectively switching the negative analog data or the positive analog data from a corresponding channel to another channel.
Patent TW-201338182-A (TW)
Title: Preparation method for sodium-containing insulation blocking layer applied to flexible board
Inventor: HU SONG-CHENG
IPC: H01L31/042
Filed: 2012-03-15
Abstract: A preparation method for sodium-containing insulation blocking layer applied to flexible board comprises steps: obtaining a rotary mechanism, and disposing a substrate to be processed on the rotary mechanism, mixing sodium chloride solution with insulation coating solution to form a sodium-containing insulation solution, afterward initiating rotary mechanism and spin-coating the sodium-containing insulation solution on the substrate, and finally heating the substrate through a heating mechanism so that the sodium-containing insulation solution on the substrate is heated and solidified to be sintered into a sodium-containing insulation blocking layer. Accordingly, with a manner of spin-coating to form the sodium-containing insulation blocking layer on the substrate, thereby achieving efficacies of minimizing manufacturing process, reducing costs, and preventing raw materials from being wasted.
Patent TW-201302879-A (TW)
Title: Thermoplastic resin composition, resin molding, and process for producing resin molding having plating layer attached thereto
Inventor: TAKANO TAKAHIRO
IPC: C23C18/16
Filed: 2012-03-16
Abstract: Provided is a thermoplastic resin molding, which has excellent bending strength, bending elastic modulus and Charpy impact strength, and on the surface of which a plating can be formed properly. A thermoplastic resin composition for laser direct structuring, which comprises 100 parts by weight of a thermoplastic resin, 10-150 parts by weight of inorganic fibers and 1-30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises at least one component selected from copper, antimony and tin and the Mohs's hardness of the laser direct structuring additive is 1.5 or more smaller than that of the inorganic fibers.
Patent TW-201244006-A (TW)
Title: Process for damascene structure with reduced low-k damage
Inventor: NAIK MEHUL B
IPC: H01L21/768
Filed: 2012-03-26
Abstract: Embodiments described herein generally provide methods for reducing undesired low-k damages during a damascene process using a sacrificial dielectric material and optionally a barrier/capping layer. In one embodiment, a damascene structure is formed through a sacrificial dielectric material deposited over a dielectric base layer. The damascene structure is filled with a suitable metal such as copper. The sacrificial dielectric material filled in trench areas between the copper damascene is then removed, followed by a barrier/cap layer which conformally or selectively covers exposed surfaces of the copper damascene structure. Ultra low-k dielectric materials may then fill the trench areas that were previously filled with sacrificial dielectric material. The invention prevents the ultra low-k material between the metal lines from exposing to various damaging processes during a damascene process such as etching, stripping, wet cleaning, pre-metal cleaning or CMP process.
Patent TW-201342544-A (TW)
Title: Manufacturing method of electronic packaging
Inventor: LU RU-MEI
IPC: H01L23/31
Filed: 2012-04-12
Abstract: A manufacturing method of electronic packaging, the steps of this method are to prepare a metallic plate having a plurality of array-like arrangement cover portions, then weld the metallic plate on a circuit board with a plurality of encapsulated areas corresponding with the cover portions, and do a cutting process to complete a plurality of electronic packaging. The advantages of this method are low cost and high efficiency.
Patent TW-201342631-A (TW)
Title: Enhanced light absorption thin film used in solar cell, solar cell structure and its manufacturing method
Inventor: CHOU CHING-CHUAN
IPC: H01L31/042
Filed: 2012-04-13
Abstract: An enhanced light absorption thin film used in solar cell, solar cell structure and its manufacturing method. The enhanced light absorption thin film used in solar cell is made of CIS based or CIGS-based direct-energy-gap type semiconductor material. When it is utilized in a solar cell, it is placed on the top surface or bottom surface of the intrinsic silicon crystal thin film, to increase the range of optical absorption spectrum, light transmittance, and conductivity of the solar cell, hereby simplifying the manufacturing process of the solar cell.
Patent TW-201341079-A (TW)
Title: Method for manufacturing closed structure parts and apparatus for the same
Inventor: HIGAI KAZUHIKO
IPC: B29C43/14
Filed: 2012-04-13
Abstract: The invention provides the method of manufacturing a closed structure parts by forming a closed structure with a bottom portion B1 bended along a length direction from a plate-shape process material B. The method includes: a first forming step of forming a plurality of first out-of-plane deformation portions 10, including a concave-shape or a convex-shape respectively, along the length direction of at least the bottom portion B1 of the process material B, forming a bending portion B4, and a second forming step of pressing a punch 3 into a die 5 in a condition that a pad 4 and the punch 3 clamp the bottom portion B1 of the process material B, in order to crush and bend the first out-of-plane deformation portions 10 and form the bending portion.
Patent TW-201247842-A (TW)
Title: Improved polycrystalline texturing composition and method
Inventor: BARR ROBERT K
IPC: H01L31/0352
Filed: 2012-04-20
Abstract: An aqueous acidic composition which includes alkaline compounds, fluoride ions and oxidizing agents is provided for texturing polycrystalline semiconductors. Methods for texturing are also disclosed. The textured polycrystalline semiconductors have reduced reflectance of light incidence.
Patent TW-201351215-A (TW)
Title: Method of simulating the touch screen operation by mouse
Inventor: CHEN GUAN-TING
IPC: G06F9/455
Filed: 2012-06-06
Abstract: A method of simulating the touch screen operation by mouse is provided and particularly makes the mouse work in a computer operating system with a screen touch function. The mouse comprises at least a simulation touch trigger button and a touch signal converter unit. When the simulation touch trigger button is pressed, the mouse starts to execute the touch mode. The touch signal converter unit intercepts a pressed button signal of the mouse and converts it into a screen touch signal for executing touch functions of single-finger or multi-finger slide. The mouse is further provided with a fixed-point button, and when the fixed-point button is pressed, where the mouse is corresponding to the screen, a finger press is simulated. The pressed position is fixed and does not move, and another button of the mouse is pressed to operate for executing zoom-in, zoom-out, and rotation of screen frames.
Patent TW-201307463-A (TW)
Title: Aqueous emulsion, method for forming coating film and coating film
Inventor: YOSHIDA YUKIO
IPC: C09D123/00
Filed: 2012-06-08
Abstract: Provided is an aqueous emulsion having excellent emulsion dispersity and stability. The aqueous emulsion comprises (A) at least two kinds of the surfactant represented by the following formula (I), (B) thermoplastic resin and (C) water. (wherein, X represents hydrogen atom or -SO3M(M is hydrogen atom, NH4 or alkali metal), n represents an integer of 1 to 3, m represents an integer of 1 to 100.)
Patent TW-201304396-A (TW)
Title: Temperature control circuit of oven-controlled crystal oscillator
Inventor: ARAI JUNICHI
IPC: H03B5/04
Filed: 2012-07-06
Abstract: A temperature control circuit of oven-controlled crystal oscillator includes a heater resistor, a first resistor, a thermistor, a second resistor, a third resistor, a differential amplifier, a PNP-type power transistor, and a PNP-type current-limiting transistor. The thermistor outputs a voltage depending on a temperature. The differential amplifier amplifies a difference between the voltage received by the one input terminal and the voltage received by the other and output as a control voltage. The PNP-type power transistor includes an emitter where the other end of the heater resistor is connected, a base that receives an output of the differential amplifier, and a grounded collector. The PNP-type current-limiting transistor has an emitter where a power voltage is supplied, a base that receives a voltage between the other end of the heater resistor and the emitter of the power transistor, and a collector connected to the base of the power transistor.