baber/WOPTO huggingface dataset:
Patent TW-583770-B (TW)
Title: Thin film transistor
Inventor: KORENARI TAKAHIRO
IPC: G02F1/1368
Filed: 2003-01-15
Granted: 2004-04-11
Abstract: A thin film transistor comprises a Si semiconductor layer 4 formed on a glass substrate 2 via a base insulation film 3 formed by a SiO2 film, a source region 8 and a drain region 9 provided inside the semiconductor layer 4 on both sides, a channel region 10 between the source region 8 and the drain region 9 inside the semiconductor layer 4, and a gate electrode 7 formed above the channel region 10 via a gate insulation film 6 formed by a SiO2 film, wherein the end parts in the channel width direction of at least the channel region 10 covered by the gate electrode 7 are tapered at an angle above 60 degrees. A thin film transistor with a structure like this can suppress an irregularity in characteristics.
Patent TW-578246-B (TW)
Title: Electronic component bonder and bonding tool
Inventor: TAKAHASHI SEIJI
IPC: H01L21/60
Filed: 2003-01-20
Granted: 2004-03-01
Abstract: A bonding tool for bonding electronic components by ultrasonic vibration. The bonding tool includes a horn supported by two ribs from both sides, and a transducer is attached to an end of this horn. A protrusion protruding downward from the center between the ribs is provided on the horn, and a tip of the protrusion is a bonding portion which contacts the electronic component. The transducer is driven to apply vertical vibration to the horn. A phase of vertical expansion and compression vibration on the horn generated by this vertical vibration is set to have the same phase as that of bending vibration on the protrusion. Accordingly, displacement by expansion and vertical vibration at side ends of the bonding portion is canceled out by displacement caused by bending vibration.
Patent TW-I229939-B (TW)
Title: Semiconductor device, solid state photographing device and its manufacturing method
Inventor: ABE HIDESHI
IPC: H01L31/10
Filed: 2003-01-23
Granted: 2005-03-21
Abstract: In the invention, the first P-type well region formed in the deep portion of the substrate is not influenced by high temperature treatment of epitaxial growth steps. In the invention, a silicon epitaxial layer (the second substrate) 111 with the concentration below 1E14, in which the impurity concentration is lower than that of the silicon substrate 110 region, is formed on N-type silicon substrate (the first substrate) 110 so as to complete the silicon epitaxial layer (the second substrate) 111. Then, an oxide film is formed on the substrate surface and is followed by using photoresist (PR) to form the region opening of the first P-type well 170 where boron ion implantation with implantation energy 3MeV to 10MeV and implantation flux 5E10 to 3E11 is conducted from top of the region opening so as to form the first P-type well region 170 at a depth approximately 4 mum to 12 mum. After that, on the layer below the region having light-receiving portion 120, N-type ions with concentration ~1E12 are implanted to form the second N-type doped region 120C.
Patent TW-589212-B (TW)
Title: Golf club head and method for producing the same
Inventor: CHEN JIAN-TUNG
IPC: A63B53/04
Filed: 2003-03-20
Granted: 2004-06-01
Abstract: Disclosed is a golf club head and a method for producing the same. The method comprises combining an enclosure with a striking faceplate with a first joint face formed on the enclosure and a second joint face formed on the striking faceplate engaging each other. The striking faceplate has a body and a plurality of protrusions extending outwards at an interval from the outer periphery of the body. Each protrusion, after butting the enclosure and the striking faceplate, is protruded from the enclosure. Each protrusion defines a space for housing solder with the enclosure. The melting point of the solder is lower than the melting points of the enclosure and the striking faceplate. In an environment having a temperature higher than the melting point of the solder and lower than the melting points of the enclosure and the striking faceplate, the molten solder flows into the gap between the first and second joint faces by capillary, thereby eliminating overflow of the solder and providing a stable connection between the enclosure and the striking faceplate. Furthermore, since the housing space is directly used for the solder, the accuracy and efficiency of assembly can be increased.
Patent TW-594741-B (TW)
Title: Semiconductor memory device and operation thereof and semiconductor memory array
Inventor: HWANG JIUNN-REN
IPC: G11C16/34
Filed: 2003-04-17
Granted: 2004-06-21
Abstract: A semiconductor memory device is provided, including one or more bit lines, one or more word lines, and a dummy word line, which is coupled to a positive bias. A memory cell and dummy cell are coupled to a bit line and may be coupled to a word line and dummy word line respectively. Coupling the dummy word line to a positive bias at least during an erase operation prevents the dummy cells from being over-erased, which occurs when the dummy word line is coupled to ground.
Patent TW-I226920-B (TW)
Title: Asymmetric porting for multi-rotor screw compressor
Inventor: HOLDEN STEVEN JAMES
IPC: F04C28/02
Filed: 2003-04-21
Granted: 2005-01-21
Abstract: A multi-rotor screw compressor includes a compressor housing defining at least three parallel rotor housing sections, each rotor housing section containing a rotor, and adjacent rotors defining at least two compressor pairs, the housing further including a suction port and a discharge port for each of the compressor pairs, and further including at least two additional ports selected from the group consisting of first closed lobe ports, last closed lobe ports, and economizer ports, wherein at least one of the additional ports is communicated with a first pair of the at least two pairs, and another of the additional ports is communicated with a second pair of the at least two pairs whereby interaction between the additional ports is reduced. In accordance with a further aspect of the invention, a first compressor pair is communicated with an economizer port and has a first discharge port, and a second compressor pair is not communicated with the economizer port and has a second discharge port, and the first and second discharge ports are selectively sized so as to provide the first discharge port with a lower volume index ratio (Vi) than the second discharge port. In accordance with a further aspect of the invention, a first compressor pair is communicated with an economizer port and has a first discharge port, and a second compressor pair is not communicated with the economizer port and has a second discharge port, and the first and second discharge ports are selectively sized so as to provide the first discharge port with a lower volume index ratio (Vi) than the second discharge port.
Patent TW-I220815-B (TW)
Title: Method and apparatus for handling abnormal transmission status in acknowledged mode and non-acknowledged mode
Inventor: JIANG SAM SHAW-SHIANG
IPC: H04L1/18
Filed: 2003-05-02
Granted: 2004-09-01
Abstract: Whenever the receiver of this invention receives an AMD PDU or a UMD PDU with its ""length indicator"" having an invalid or a reserved value, the receiver discards such a PDU and treats it as never been received. The receiver may report its receiving status accordingly if a report is required. This invention avoids invoking unnecessary RLC reset procedures and reduces the chance of losing HFN synchronization during AM or UM data transmissions.
Patent TW-I233499-B (TW)
Title: An innovative fabrication method for color filter
Inventor: LIN DHEI-JHAI
IPC: G02B1/10
Filed: 2003-06-16
Granted: 2005-06-01
Abstract: An innovative fabrication method for color filter, characterized by a new patterning method for the deposition of colored films on a transparent substrate, by first pressing the transparent substrate to a mold which carries patterned cavity, and the space confined by the substrate surface and the cavity has excess to outside of the mold through connecting tunnels in the mold, then a colored photopolymer solution is introduced into and fill the cavity, and then expose the photopolymer solution to UV radiation from the back side of the transparent substrate, and precipitate the solid content of the colored photopolymer solution on the transparent substrate surface to make colored film pattern.
Patent TW-I342150-B (TW)
Title: System and method for providing messages on a wireless device connecting to an application server
Inventor: BRIAN MINEAR
IPC: G06Q30/02
Filed: 2003-09-01
Granted: 2011-05-11
Abstract: A system and method for providing a message on the graphic display of a wireless device while the wireless device is connecting to an application download server across a wireless network. When the wireless device attempts to communicate with an application download server or changes files while navigating an application download server, a message is transmitted across the wireless network to the computer platform of the wireless device and displayed to the user of the wireless device. The message can be transmitted to the wireless device from the same application download server that the wireless device is attempting to connect to or navigate, or alternately, the message can be transmitted from another server on the wireless network.
Patent TW-594109-B (TW)
Title: Wavelength converter with wideband four-wave-mixing
Inventor: LEE SAN-LIANG
IPC: G02F1/39
Filed: 2003-09-18
Granted: 2004-06-21
Abstract: The present invention provides a wideband wavelength converter with four-wave-mixing, which includes a modulated laser diode, a modulator, a first and second polarized controller, a first, second and third tunable lasers, a optical coupler, a SOA wavelength converter and a multiplexer. The present invention utilizes an assisted beam that could improve the recovery rate and the saturation power of the SOA wavelength converter. While the SOA wavelength converter is operated at a bias close to the transparent condition for the assisted beam, it doesn't influence the gain of the SOA wavelength converter.
Patent TW-I237167-B (TW)
Title: Electronic load apparatus
Inventor: NITADORI KENJI
IPC: G01R31/00
Filed: 2003-09-29
Granted: 2005-08-01
Abstract: The present invention is provided to improve the frequency response characteristics of the load current for the tested power device of an electronic load apparatus. In the invention, impedance L1 is connected in series and attached to the source of transistor Q1 for load current control. In addition to improving the frequency response characteristic of the electronic load control loop and the electronic load transient response characteristics at the starting of the power supply to be tested, a better load current control characteristic is obtained in a wide load current range by providing a circuit device of a non-linear element between the input and output of an operational amplifier for the driving transistor of the controlling circuit.
Patent TW-I224920-B (TW)
Title: Automatic test system for interactive phone breakdown
Inventor: CHEN CHING-FENG
IPC: H04M3/42
Filed: 2003-10-17
Granted: 2004-12-01
Abstract: An automatic test system for interactive phone breakdown comprises a PBX, distribution equipment, phone equipment, access equipment, routing equipment, test equipment, a controller 1, a controller 2 and a test operation unit. When field personnel for checking, installing, pay phone check, circuit, etc. are installing phone, moving phone, disconnecting phone, changing number, and meanwhile, dialing 115 to request the personnel of line test frame located in the telecommunication room to work with field test. The personnel on duty at the line test frame finish the works of installation, troubleshooting, circuit test, maintenance, etc. for subscribers by virtue of the coordination of the testing equipment, routing equipment and related controller of the line test frame to secure the instantaneity and correctness for subscriber to install, move, disconnect, change number, etc. services.
Patent TW-I228749-B (TW)
Title: Method for manufacturing semiconductor device
Inventor: ORYOJI MICHIO
IPC: H01L21/768
Filed: 2003-10-30
Granted: 2005-03-01
Abstract: A via hole is first formed, and an embedded material is embedded in the via hole. A height of the embedded material is adjusted so that a surface thereof is between an upper surface of an SiOC film and that of an SiC film. After this, an SiN film, a TEOS film, and the SiOC film are etched by using a resist mask as a mask. However, etching of the SiOC film is stopped when a bottom of a trench formed in the SiOC film is lower than an upper surface of the embedded material and higher than that of the SiC film. Then, the resist mask and the embedded material are removed. The SiOC film is etched again by using the SiN film as a mask, and the SiN film and an exposed part of the SiC film are removed.
Patent TW-I255625-B (TW)
Title: VoIP network bandwidth design system and method thereof
Inventor: TANG CHUNG-SHR
IPC: H04L29/02
Filed: 2003-11-11
Granted: 2006-05-21
Abstract: A VoIP network bandwidth design system and a method thereof are disclosed, wherein under the existing VoIP network architecture, utilization rate of each chain in the VoIP network is obtained with bandwidth conversion for electrical lines that enter an IP network via media gateways, IP load distribution method, and IP network routing mechanism for determining if a bottleneck facility or chain in the VoIP network. Design of bandwidth of a chain between any two point in the entire VoIP network can be obtained through evaluation of load requirement by an IP load distribution module.
Patent TW-I276485-B (TW)
Title: Method for manufacturing ultrafine pure-metal powder and ultrafine alloy powder
Inventor: YONEHANA YASUNORI
IPC: B22F9/00
Filed: 2003-11-12
Granted: 2007-03-21
Abstract: The present invention is to provide a method for manufacturing ultrafine pure-metal powder and ultrafine alloy powder for which a cheap raw material can be used and which is efficiently manufactured. In the method for manufacturing the ultrafine pure-metal powder by heating a raw material containing metal chloride and reducing the resultant metal-chloride vapor by gaseous hydrogen, an elementary substance of metal constituting the metal chloride is mixed into the raw material containing the metal chloride, and further, among metal chlorides of >= 2 valence, those of higher valence are used as the above metal chloride. Moreover, in the method for manufacturing the ultrafine alloy powder, as the above raw material, metal chloride is used for alloy components ranging in number from one to (the total number of the alloy components - 1) among the alloy components and an elementary substance of metal is used for the other alloy component.
Patent TW-I247839-B (TW)
Title: Drain socket and flush toilet
Inventor: ICHIKI TOMOYASU
IPC: F16L55/24
Filed: 2003-11-21
Granted: 2006-01-21
Abstract: A flush toilet and a drain socket capable of preventing piping from being clogged by orderly arranging the direction of dirt passing the inside of a drain trap without obstructing a drain discharge capacity by a siphon action, the drain socket connecting the outlet (7) of the trap drain passage of a flush toilet body (5) to a drain pipe (2) disposed on the outside of the flush toilet body characterized by comprising a drain socket body (3) having an inlet connected to the trap drain passage and an outlet connected to the drain pipe, a siphon inducing portion (11) formed on the inner wall surface of the drain socket body for inducing the siphon action, and a straightening board (4) installed on the upstream side of the siphon inducing portion of the drain socket body so as to extend from the inner wall surface toward the inside of a flow passage.
Patent TW-I240847-B (TW)
Title: Method for forming self-synthesizing conductive membrane and application
Inventor: HSIEH KUO-HUANG
IPC: G03F7/004
Filed: 2003-11-28
Granted: 2005-10-01
Abstract: The present invention discloses a method for forming self-synthesizing conductive membrane and its application. First of all, at least one photoresist layer with a first functional group and a specific pattern is formed, so that the first functional group can bond a second functional group of a conductive polymer unit, whereby a conductive membrane with specific pattern is formed. Furthermore, this invention can be applied for forming emitting membranes, especially for forming emitting layers of OLED (organic light emitting diode) elements.
Patent TW-I234026-B (TW)
Title: Substrate bonding apparatus and liquid crystal display panel
Inventor: MASUDA HIROKAZU
IPC: G02F1/1339
Filed: 2003-12-03
Granted: 2005-06-11
Abstract: The substrate bonding apparatus of this invention applies sealing agent to one of two substrates forming a frame shape, and bonding the substrates by the sealing agent. The substrate bonding apparatus comprises: a first holding table having a holding face for holding a first substrate; a second holding table arranged to oppose the first holding table and having a holding face for holding a second substrate; a non-adhesive resilient member disposed at least one of the holding faces of the first and second holding tables; and first and second driving sources for driving the first holding table and the second holding table relative to one another in upward and downward directions in order to bonding a pair of substrates held on the holding faces of the holding tables by means of the sealing agent.
Patent TW-I229818-B (TW)
Title: Method and device for updating firmware
Inventor: TSENG WEI-SHENG
IPC: G06F9/445
Filed: 2003-12-15
Granted: 2005-03-21
Abstract: The present invention provides a method and device for updating the firmware. The method includes the following steps: breaking the associated links between the firmware of the keyboard control chip and the operating system; issuing a system call by the basic input and output system (BIOS) to notify the firmware of the keyboard control chip for opening the update routine for updating firmware; next, issuing a control command by the BIOS to remove the write protection for the firmware of the keyboard control chip; then, setting the two specific pins of a peripheral control chip as high voltage to remove the write protection of BIOS; next, conducting the firmware updating of the keyboard control chip; and, when completing the firmware updating, reactivating the write protection of the firmware of the keyboard control chip and the BIOS and rebooting the operating system.
Patent TW-I229393-B (TW)
Title: Fabricating method of low temperature poly-silicon film
Inventor: CHANG SHIH-CHANG
IPC: H01L21/477
Filed: 2003-12-17
Granted: 2005-03-11
Abstract: A fabricating method of low temperature poly-silicon film is described. An amorphous silicon layer is formed on a substrate, and then a laser anneal step is performed on the amorphous silicon layer for forming a poly-silicon layer from the amorphous silicon layer. Usually, mounds are formed on the surface of the polysilicon layer. A surface planarization treatment step is performed. Since the surface planarization treatment step is performed after a laser anneal step, irregularity problem caused by the mounds formed on the grain boundary can be resolved.
Patent TW-I233294-B (TW)
Title: Sheet-fed scanning device capable of detecting a document edge
Inventor: SHENG THOMAS
IPC: H04N1/12
Filed: 2003-12-26
Granted: 2005-05-21
Abstract: A sheet-fed scanning device capable of detecting a document edge includes a scanning module and an automatic document feeder. The scanning module outputs a light ray to scan a document. The automatic document feeder feeds the document through a scanning region on a sheet passageway and the scanning module may scan the document in the scanning region. In this invention, the sheet passageway corresponding to the scanning region is formed with a concave portion, wherein the document passing through the scanning region is located between the concave portion and the scanning module, such that a first brightness of the concave portion sensed by the scanning module is far smaller than a second brightness of the document sensed by the scanning module to support the document edge detection and the document skew correction.
Patent TW-I229620-B (TW)
Title: Component testing and screening machine
Inventor: GAU MIN
IPC: B07B13/00
Filed: 2004-01-02
Granted: 2005-03-21
Abstract: Disclosed is a component testing and screening machine, including: a material feeding set, having a hopper for receiving components to be tested and separated, a material feeding tube extending from an end of the hopper, the material feeding tube being formed at an end thereof with a positioning rack; a rotary disk, provided at its periphery thereof with plural channel openings, for receiving and conveying each of the components on the positioning rack to be tested one by one; a testing system mechanism, for testing each of the components to be tested in each of the channel opening one by one, performing analysis and comparison of the predetermined RF testing and calibration items with the stored calibrated values, and classifying the components according to the tested items and predetermined attributes of the tested values; and a material receiving tube rack, having plural sets of receiving zones, for receiving the components that have been classified and tested.
Patent TW-I228770-B (TW)
Title: All-in-one polishing process for a semiconductor wafer
Inventor: LIAO MU-LIANG
IPC: H01L21/304
Filed: 2004-01-19
Granted: 2005-03-01
Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the rim surface and the top surface, and the semiconductor wafer is dried thereafter.
Patent TW-I243292-B (TW)
Title: Toner container and image forming method and apparatus using the same
Inventor: SEIJI TERAZAWA
IPC: G03G15/08
Filed: 1999-12-17
Granted: 2005-11-11
Abstract: In an image forming apparatus, a toner container removably set on the apparatus and a developing section included in the apparatus are communicated to each other by a delivery passage. Toner can be delivered from the toner container to the developing section via the delivery passage by a stream of air even when the container and developing section are located at remote positions.
Patent TW-I280784-B (TW)
Title: Image processor, image processing method, and image processing program
Inventor: MURAI KIYOAKI
IPC: G06T7/20
Filed: 2004-03-05
Granted: 2007-05-01
Abstract: The present invention relates to an image processor, an image processing method, and an image processing program and aims to minimize the broken images by means of a simple structure. An image processor (100) has a statistic calculating part (10), a correction parameter calculating part (20), and an image correcting part (30). The statistic calculating part (10) is used for generating statistic data (10A). Corresponding to the extend of the scene changes, the correction parameter calculating part (20) uses a low-pass filter, which can change the constant in accordance with a control signal, to smooth the statistic data (10A) and generate the correction parameters before generating a check list in accordance with the correction parameters.