baber/WOPTO huggingface dataset:
Patent TW-I262523-B (TW)
Title: Electric circuit control protector
Inventor: YU TSUNG-MOU
IPC: H01H71/16
Filed: 2004-05-20
Granted: 2006-09-21
Abstract: This invention relates to electric circuit control protector (5). By means of pressing a button to swing, a gearing component group is caused to move synchronously to push contactor to bobble, such that the circuit-loop forms the circular turning ON or turning OFF condition. The characteristic of this invention is that: A button pivots connecting with a gearing component group, and the gearing component group contains a tension bar and an actuator. Using the hook of tension bar actively hooks with the contactor. The actuator can bend-gyration at the pivot connecting part. When in circuit-loop turning OFF state, the actuator of gearing component group is limited and can not bend-gyrate, and the end portion of actuator is pointed to the contactor, such that the end portion of actuator can contact and push the contactor. When in the circuit turning ON state, the actuator of gearing component group is not limited and able to bend-gyrate. When the current is overloaded, the contactor is heated and distorted, and reversely escapes for displacement. The contactor can push and urge the end portion of actuator in a tilt angle to make the actuator gyrate and bend to provides contactor a section of freedoms and escaping spaces, but it cannot obstruct contactor from the distortion bounces, so that contactor can smoothly distort and reversely escape to form the circuit-loop turning OFF condition, which assures the safety use of electric power.
Patent TW-I239752-B (TW)
Title: Module of controlling chord light for an incoming phone and control method thereof
Inventor: HO DAVID
IPC: H04M1/22
Filed: 2004-06-30
Granted: 2005-09-11
Abstract: A module of controlling chord light for an incoming phone is provided, mainly comprising a central processing module, a chord music module, and a keyboard backlight module. When the central processing module receives an incoming phone message, it transmits a message to the chord music module, and the central processing module controls the chord music module to make up music. At the same time, according to the synchronism message from the chord music, the central processing module controls the keyboard backlight module, and makes it to produce the synchronous effects of lighting. According to the chord music, the lighting function of the keyboard backlight module will become various effects of lighting, and will bring the users the enjoyment of vision.
Patent TW-I311084-B (TW)
Title: Method for manufacturing a medical needle
Inventor: FIECHTER ADRIAN
IPC: B21G1/08
Filed: 2004-08-02
Granted: 2009-06-21
Abstract: The method involves soldering portions (2, 3) of a needle (1) under the impact of a laser pulse beam. The portion (3) has an end through which a suture thread is inserted. The thread is placed at interior of a blind hole (8). The portions are rotated with respect to each other. The speed of rotational movement is adjusted such that complete turning is carried out during the duration of beam impulsion.
Patent TW-I245358-B (TW)
Title: Surface porosity metal heat block
Inventor: CHUANG CHIA-MIN
IPC: H01L21/68
Filed: 2004-09-23
Granted: 2005-12-11
Abstract: The present invention relates to a surface porosity metal heat block, and particularly to a surface porosity metal heat block providing the support for a carrier bonded with chip and the purpose adsorption fixture and heat conduction, applied to perform chip and lead frame wiring and bonding in packaging process of semiconductor device. The metal heat block is mainly formed a porous surface of predetermined bumpy surface on the upper surface of a defined unit carriage area, an air-extracting trench formed on the periphery of the unit carriage area, and air-extracting apertures formed on the bottom of the air-extracting trench and extended to the bottom of the heat block; by utilizing the bumpy part of the porous surface to provide excellent efficacy of vacuum adsorption for the carrying pad on the carrier, the wire-bonding process can be properly carried out and the production cost of the metal heat block can be reduced.
Patent TW-I253142-B (TW)
Title: Method for processing a semiconductor device comprising a silicon-oxy-nitride dielectric layer
Inventor: VENEZIA VINCENT CHARLES
IPC: H01L29/78
Filed: 2004-10-05
Granted: 2006-04-11
Abstract: The present invention provides a method for processing a semiconductor device which comprises a dielectric layer that is partially converted into a silicon-oxy-nitride by means of incorporation of nitrogen atoms in the dielectric layer comprising a silicon oxide. According to the invention, before the introduction of the nitrogen atoms into the dielectric layer of a silicon oxide, the dielectric layer is provided as a silicon oxide in which the atomic silicon to oxygen ration is chosen to be larger than 1/2. In this way in particular MOS transistors are obtained with a high quality of the interface between dielectric region and semiconductor substrate, a dielectric region which is impermeable for impurity atoms from the gate region and with a thickness which is substantially equal to the dielectric layer as deposited.
Patent TW-I250487-B (TW)
Title: Pixel arrangement in a display and display employing the same
Inventor: HU SHUO-HSIU
IPC: H05B33/00
Filed: 2004-11-02
Granted: 2006-03-01
Abstract: A pixel array comprises a plurality of display elements, wherein each of the display elements comprises a luminous region and a non-luminous region. Two non-luminous regions within two adjacent display elements are interlaced to dispose along the corresponding scan line so as to reduce the visual appearance of the dark lines created by dark areas between two adjacent rows of pixels.
Patent TW-I256453-B (TW)
Title: LED lamp
Inventor: LAI KUO-YEN
IPC: F21V13/04
Filed: 2004-11-08
Granted: 2006-06-11
Abstract: Light emitting diode sheds light on the roughened inner surface of a transparent tube or bulb to produce random light. Partly of the random light transmits the transparent wall to form a lighting device. Flat surfaces can be added on part of the roughed surface to reflect light to other points to increase the uniformity of the emission.
Patent TW-I264601-B (TW)
Title: Light guide plate and backlight module using the same
Inventor: CHO HUNG-SHENG
IPC: G02F1/1335
Filed: 2004-11-19
Granted: 2006-10-21
Abstract: The present invention relates to a light guide plate and a backlight module using the light guide plate. The light guide plate includes a bottom surface, at least one incident surface and a plurality of light guiding elements. The light guide elements are disposed along the direction away from the incident surface of the light guide plate. A refractive index of each light guiding element is different from that of adjacent light guiding elements. The light guide plate can improve efficiency of light utilization.
Patent TW-I248667-B (TW)
Title: Semiconductor package having heat pipes
Inventor: LEE CHANG-CHI
IPC: H01L23/34
Filed: 2004-11-25
Granted: 2006-02-01
Abstract: A semiconductor package includes a substrate, a chip, a thermally conductive adhesive, a heat spreader and at least one heat pipe. The chip is disposed on the substrate and has an active surface and a back surface opposite to the active surface, wherein the active surface is electrically connected to the substrate. The thermally conductive adhesive is used for mounting the back surface of the chip to the substrate. The heat spreader is mounted on the substrate. The heat pipe is mounted on the substrate and has an evaporator end and a condenser end, wherein the evaporator end is thermally coupled to the back surface of the chip and the condenser end is connected to the heat spreader.
Patent TW-I285851-B (TW)
Title: Visual and graphical data processing using a multi-threaded architecture
Inventor: JIANG HONG
IPC: G06T15/06
Filed: 2004-12-24
Granted: 2007-08-21
Abstract: Active and/or proactive semaphore mechanisms and thread synchronization techniques can be applied to various visual and graphical processing techniques.
Patent TW-I281476-B (TW)
Title: The synthesis method of blend polyvinyl alcohol with polyacrylic acid polymer for electrolyte polymer membrane and the electrolyte polymer membrane thereof
Inventor: YANG CHUN-CHEN
IPC: C08F261/04
Filed: 2005-01-13
Granted: 2007-05-21
Abstract: This invention is proposed a novel method for the preparation of an ultrahigh ionic conductivity polymer membrane by a solution casting technique. At first, we choose the hydrophilic polymer of polyvinyl alcohol (PVA) as a major matrix, and also use polyacrylic acid (PAA) as a secondary base polymer. Those polymers show excellent hydrophilic property and the film formation ability in aqueous solution system. The crosslinker such as triallyl amine or N,N-dimethyl acrylamide was added into the PVA polymer solution, then mixed well in the reactor. The resulting polymer solution was mixed with the specific initiators, which cab be ammonium persulfates or potassium persulfates. The free radical polymerization was carried out on between the PVA polymer solution and the monomers of PAA. A uniform and homogeneous blend polymer solution can be obtained through the premixing of the PVA polymer solution with the monomers powders of PAA. After polymerization, the viscous homogeneous blend polymer solution was poured on the PTFE plate to form a wet membrane, then dried at a constant of temperature and RH%. After drying, the free standing blend polymer electrolyte membrane was obtained. It was found that the absorption capability of PVA/PAA blend polymer membrane was at a range of 50 to 600 g g<-1> for various types of the solutions of NaOH, KOH, H2SO4, CH3OH, and Na2SO4 electrolytes. It was observed that the ionic conductivities of PVA/PAA blend polymer membranes in the basic, neutral, and acidic solutions were in the order of 0.05 to 0.4 S cm<-1> at ambient temperature. Specifically, the excellent ionic conductivities (i.e., sigmamax=0.4 S cm<-1> with the KOH electrolyte solution) and electrochemical properties for the PVA/PAA blend polymer membrane as a solid polymer electrolyte can be potentially applied for many electrochemical storage systems such as the battery, fuel cell, capacitors, etc.
Patent TW-I309849-B (TW)
Inventor: MASANORI TAMAKI
IPC: H01L23/12
Filed: 2005-02-24
Granted: 2009-05-11
Abstract: A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30. When the IC chip 70 generates heat, since pads 41 are positioned away from the center, a large shearing stress is applied to the portions at which pads 41 are joined to the interposer 60 in comparison to the portions at which pads 43 are joined to the interposer 60. Here, pads 41 are formed at substantially flat wiring portions and thus when joined to the interposer 60 by means of solder bumps 51, voids and angled portions, at which stress tends to concentrate, are not formed in the interiors of solder bumps 51. The joining reliability is thus high.
Patent TW-I258222-B (TW)
Title: Compound semiconductor device and method of manufacturing the same
Inventor: ASANO TETSURO
IPC: H01L21/768
Filed: 2005-04-12
Granted: 2006-07-11
Abstract: A gate metallic layer is provided under a pad electrode in a conventional compound semiconductor device. The gate metallic layer under the pad electrode, however, is hardened when an embedded gate electrode is formed, resulting in occurrence of defect during wire bonding. In the compound semiconductor device of this invention, a gate metallic layer is not provided in a HEMT, but only using a pad metallic layer to form a pad electrode. Moreover, a high concentration impurity region is provided under a pad electrode and the pad electrode is directly fixed to a substrate. Accordingly, as a specified isolation can be assured by the high concentration impurity region, a structure of eliminating a nitride film the same as before can be employed as well as the occurrence of defect caused by the hardening of the gate metallic layer during wire bonding can be avoided. Therefore, the improvement in reliability and yield can be realized even an embedded gate electrode structure which can improve the characteristics of the HEMT is employed.
Patent TW-I373506-B (TW)
Title: Light-emitting element material and light-emitting material
Inventor: MURASE SEIICHIRO
IPC: C07D405/04
Filed: 2005-05-18
Granted: 2012-10-01
Abstract: The present invention relates to a light emitting device material comprising an anthracene compound represented by the following general formula (3)   
(wherein R19 to R37 each may be the same or different and are selected from among a hydrogen atom, alkyl group, cycloalkyl group, heterocyclic group, alkoxy group, alkylthio group, arylether group, arylthioether group, phenyl group, alkyl substituted phenyl group, alkoxy substituted phenyl group, aryl substituted phenyl group, naphtyl group, alkyl substituted naphtyl group, alkoxy substituted naphtyl group, aryl substituted naphtyl group, phenanthryl group, alkyl substituted phenanthryl group, alkoxy substituted phenanthryl group, aryl substituted phenanthryl group, heteroaryl group and silyl group. n is 1 or 2. A is a heteroarylene group or arylene group with a carbon number of 6 or more to 12 or less. Any one of the R 19  to R 27  and any one of the R 36  or R 37  are used for linking with A.).
Patent TW-I268671-B (TW)
Title: Common control channel uplink power control for adaptive modulation and coding techniques
Inventor: TERRY STEPHEN E
IPC: H04B7/005
Filed: 2002-05-10
Granted: 2006-12-11
Abstract: In a wireless digital communication system employing code-division multiple access (CDMA) technology, a method in which adaptive modulation and coding (AM&C) is utilized in order to achieve improved radio resource utilization and provide increased data rates for user services in which the base station measures up link interference on all time slots received from mobile terminals (UEs) and determines the need for uplink control channel; the base station transmitting to the UE the allocation of specific uplink control channels indicating uplink interference in the time slot and potentially the quality margin; the UE determining appropriate uplink power level based on a path loss determination made by the UE, uplink interference and the quality margin; the UE initiating an uplink common control transmission responsive to these determinations.
Patent TW-I284953-B (TW)
Title: A liquid-based gravity-driven etching-stop technique for controlling structure dimension
Inventor: LIN WEI-CHIN
IPC: H01L21/66
Filed: 2005-05-20
Granted: 2007-08-01
Abstract: A liquid-based gravity-driven etching-stop technique used for microstructure dimension control of device on the wafer level is disclosed. The technique makes use of the opposite etching trenches or the depth rulers to control the dimension of microstructure at first. A pair of opposite trenches surrounds several devices on both sides of the wafer to form device chips. The trench depth on the microstructure front-side is equal to the design dimension of microstructure. In the final step of the fabrication process, the backside of wafer is etched by enchants to form the device handles. The device chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated device chips therefore fall into the etch-stop solution beneath the etchant and the wet etching of the device stops automatically.
Patent TW-I376205-B (TW)
Title: Calcium stable high acyl gellan gum for enhanced colloidal stability in beverages
Inventor: YUAN C RONNIE
IPC: A23L29/269
Filed: 2005-05-26
Granted: 2012-11-11
Abstract: A low calcium sensitive (calcium stable) high acyl gellan gum is prepared for enhanced colloidal stability in beverages. The low calcium sensitive high acyl gellan gum has superior suspension performance for colloidal stability compared to other high acyl gellan gums. The low calcium sensitive high acyl gellan gum is prepared by adjusting the pH of a gellan fermentation broth (polymer solution) prior to pasteurization and reducing the pasteurization hold time compared to conventional pH levels and hold times.
Patent TW-I377223-B (TW)
Title: Biaxial film iii
Inventor: PARRI OWAIN LLYR
IPC: G02B5/30
Filed: 2005-07-06
Granted: 2012-11-21
Abstract: The invention relates to an optically biaxial film comprising an anisotropic material with deformed helically twisted structure and locally varying birefringence, to methods and materials for its preparation, to its uses as retardation or compensation film in optical devices like liquid crystal displays, and to compensators and liquid crystal displays comprising such a biaxial film.
Patent TW-I274876-B (TW)
Title: Multistage examination method for a biosensor test piece
Inventor: WANG SHIOU-JEN
IPC: G01N33/50
Filed: 2005-07-15
Granted: 2007-03-01
Abstract: This invention relates to a multistage examination method for a biosensor test piece. It promotes the operation of biosensor, the convenience, the simplicity, and the accuracy of measuring. Especially, it aims at the liquid sample of some micro volumes. Via the design of equipment and the fixed enzyme adhesive agent characteristic, it rapidly absorbs the sample that required test and analysis into the biochemistry reaction zone. Further, it carries on a succession of biochemistry response. The electronic closed-loop design method executes the multistage detecting and logic interpreting. Eventually, it improves the precision and the accuracy of the biosensor.
Patent TW-I382112-B (TW)
Title: Polyster fiber having excellent lightshielding and flame retardanct characteristic and textile goods using the same
Inventor: YANG SEUNG CHEOL
IPC: D06M13/282
Filed: 2005-07-21
Granted: 2013-01-11
Abstract: Disclosed herein is a Polyester Fiber Having Excellent Light-Shielding and Flame Retardant Characteristic. The Polyester Fiber comprises: phosphorus-based flame retardant 0.05˜5% by weight, based on phosphorus atom; and inorganic particles having 0.05˜1 μm average particle size 1-5% by weight, based on fiber weight. Further disclosed is Textile Goods prepared from the Polyester Fiber. The polyester fiber according to the present invention is prepared from polyester polymer having Intrinsic viscosity of 0.55˜0.75 dl/g and the Intrinsic viscosity difference of between the fiber and polymer (IV drop) is within 0.03 dl/g and it exhibits the excellent flame retardant and light shielding characteristic. Therefore, the polyester fiber can be applied to fiber for clothes, light shielding curtain for a car and blackout curtain for a house and theater.
Patent TW-I284771-B (TW)
Title: Backlight device and liquid crystal display apparatus of using the same
Inventor: TAJIRI TOMOHISA
IPC: G02F1/13357
Filed: 2005-10-17
Granted: 2007-08-01
Abstract: In a direct type backlight device for large-size LCD device, the shape of fluorescent tube holder must be such that following defects can be prevented or reduced, such as uneven luminance caused by the sagging and deforming of a fluorescent tube due to its own weight and longer length, the damages of the fluorescent tube caused by vibration and impact, the heat conduction from the fluorescent tube to the fluorescent tube holder leading to the temperature of the fluorescent tube being lower than surrounding temperature and the unevenness of luminance caused by degradation of luminance level around the contacting portion of the fluorescent tube. To achieve to the aforementioned purposes, the invention discloses a fluorescent tube holder having a polygon clamping shape to hold the fluorescent tube at specific position and to reduce a contacting area with the fluorescent tube for minimizing luminance unevenness caused by heat conduction.
Patent TW-I267170-B (TW)
Title: Method for forming non-volatile memory with inlaid floating gate
Inventor: WU CHUN-PEI
IPC: H01L21/8247
Filed: 2005-11-18
Granted: 2006-11-21
Abstract: A method for forming a non-volatile memory with inlaid floating gate is disclosed. The method comprises the following steps. A substrate having a pad dielectric layer and a first dielectric layer thereon is provided. Then a buried diffusion region is formed in the substrate. Next a second dielectric layer is conformally formed over the substrate and the second dielectric layer and the pad oxide layer are then etched back to expose the buried diffusion region and the first dielectric layer. Then a shallow trench isolation is formed into the expose the buried diffusion region and the substrate. Next a floating gate pattern is transferred into the first and second dielectric layers. Next the first dielectric layer is removed to expose the pad oxide layer. Then the exposed pad dielectric layer is removed to expose the substrate. Next a tunnel dielectric layer is formed on the exposed substrate. Next a first conductive layer is conformally formed over the substrate and is planarized to expose the shallow trench isolation. Finally an inter gate dielectric layer is formed over the first conductive layer and the shallow trench isolation. Finally a second conductive layer is formed over the inter gate dielectric layer.
Patent TW-I262997-B (TW)
Title: Magnetic spacer
Inventor: CHEN YAN-YU
IPC: F16H25/22
Filed: 2005-12-23
Granted: 2006-10-01
Abstract: A magnetic spacer contains magnetic containing objects, which is disposed between magnetic conductivity balls. The magnetic containing objects and the balls can be produced indirect magnetic attraction force; thereby the spacer will not be overturned by the influence of gravity or centrifugal force but be attracted to the balls indirectly by the magnetic containing objects when the large space have produced between each ball and ball. Therefore, this present invention is really fit in with the requirements of the market.
Patent TW-I286375-B (TW)
Title: Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for fabricating the same
Inventor: LIN HUNG-TSUN
IPC: H01L21/48
Filed: 2006-03-24
Granted: 2007-09-01
Abstract: A leadless semiconductor package with an electroplated layer embedded in an encapsulant and its fabricating method are disclosed. The package mainly includes a half-etching leadframe, a chip, an encapsulant, and an electroplated layer. The leadframe has a plurality of leads and a plurality of outer pads connected by the leads. The encapsulant encapsulates the chip and the leads and has a plurality of recessed holes aligned with the outer pads so that the electroplated layer attached to the outer pads can be embedded in the recessed holes. Accordingly, the package has advantages of low cost and high thermal dissipation to replace conventional wiring substrate and solder resist layer with leadframe and encapsulant. In addition, the electroplated layer will not be damaged when transferring and storage of the semiconductor package. Furthermore, the leads can be fixed in the encapsulant firmly. The disclosed fabricating processes includes two half-etching steps, wherein the second half-etching step is performed next to the encapsulating step and prior to the formation of the electroplating step.