baber/WOPTO huggingface dataset:
Patent TW-I234814-B (TW)
Title: Method of manufacturing a semiconductor device
Inventor: SEGAWA YUJI
IPC: C23C18/16
Filed: 2003-06-25
Granted: 2005-06-21
Abstract: The purpose of the present invention is to provide a method of manufacturing a semiconductor device that permits the manufacture of a high quality and reliable semiconductor device suitable for high-speed operation. In the method of manufacturing a semiconductor device, a barrier layer having a copper diffusion preventing function is formed on a metal wiring containing copper. The metal wiring, which contains catalyst metal, is formed by performing electrolytic plating through the use of an electrolytic plating liquid doped with the catalyst metal. The barrier film having a copper diffusion preventing function is formed on the metal wiring by performing electroless plating through the use of the catalyst metal exposed on the surface of the metal wiring as a catalyst.
Patent TW-I256805-B (TW)
Title: Method for data transmission between modules
Inventor: LU JUNG-JR
IPC: H04L12/46
Filed: 2003-08-08
Granted: 2006-06-11
Abstract: The present invention provides a method for data transmission between modules, especially a data-transmission method between a main module and individual modules inside a network management media converter, in which the main module communicates with the individual module through Ethernet frames, and a pay load space of Ethernet frame is disposed in a modified SNMP message. By using the method of the present invention for the data transmission between the main module and the individual modules, the correctness and reliability of the data transmission between the main module and the individual modules can be ensured, and the transmission distance can be increased.
Patent TW-I245422-B (TW)
Title: Method for improving mobility of vertical transistor channel
Inventor: LIN SHIAN-JYH
IPC: H01L29/732
Filed: 2003-08-22
Granted: 2005-12-11
Abstract: This invention provides a method of improving mobility of vertical transistor channel, which includes of: providing a semiconductor substrate formed with trench; forming a trench capacitor on the lower half portion of the trench; forming a conductor structure on the trench capacitor; forming a strained Si layer on Si-Ge layer thereon on the exposed sidewall of the trench and the conductor structure as a channel; forming a trench top dielectric layer on the conductor structure; forming a gate oxide layer on the sidewall of the trench; filling conducting material in the trench to form one gate conducting layer; form a dielectric gap wall on the sidewall protruded beyond the trench; and filling a conducting material in the trench to form an conducting layer.
Patent TW-I264425-B (TW)
Title: Light fireproof, heat-insulating and anti-corrosive ceramics formula, method of producing it and its device
Inventor: JIANG TSAN-YU
IPC: C04B35/00
Filed: 2003-09-09
Granted: 2006-10-21
Abstract: The present invention relates to a light fireproof, heat-insulating and anti-corrosive ceramics formula, a method of producing it and its device. The formula of the present invention is made by mixing 20-50% of recycled glass, 10-30% of recycled ceramics, 20-40% low-temperature kibushi-clay and 20-50% of sodium silicate with the addition of water 50% of the total proportion and grinding the composition into slurry and forming dried powder by spraying, such that the dried powder is bonded into manufacture by die-molding. Because the manufacture has pores formed by the melting sodium and aluminum inside and is magnetized on its surface by bonding, the light fireproof, heat-insulating and anti-corrosive ceramics formula can be obtained.
Patent TW-I231755-B (TW)
Title: An interpositional articular implant and the method for making the same
Inventor: LANG PHILIPP
IPC: A61B17/00
Filed: 2003-10-07
Granted: 2005-05-01
Abstract: This invention is directed to orthopedic implants and systems. The invention also relates to methods of implant design, manufacture, modeling and implantation as well as to surgical tools and kits used therewith. The implants are designed by analyzing the articular surface to be corrected and creating a device with an anatomic or near anatomic fit; or selecting a pre-designed implant having characteristics that give the implant the best fit to the existing defect.
Patent TW-I227311-B (TW)
Title: Chemical supply system and valve box
Inventor: HUNG SHI-KUN
IPC: F17D1/00
Filed: 2003-10-16
Granted: 2005-02-01
Abstract: A chemical supply system comprising a first chemical supply device, several main pipelines and a second chemical supply device is provided. Wherein the first chemical supply device having a control unit therein is located at a first floor. The main pipelines are connected with the first chemical supply device, and one of the main pipelines is used to transport chemical reagents or gases to point of uses at the first floor. The second chemical supply device is located at a second floor, and another main pipeline is connected to the second chemical supply device for transport the chemical reagents or gases to point of uses at the second floor from the first floor. Since the chemical supply system has several main pipelines to transport the chemical reagents or gases, the flow limitation problem can be resolved.
Patent TW-I255994-B (TW)
Title: Integrated circuit having multiple modes of operation
Inventor: ATALLAH DEIF
IPC: A61B5/03
Filed: 2003-11-12
Granted: 2006-06-01
Abstract: A method according to one embodiment may include operating an integrated circuit in a selected mode of operation. The integrated circuit may include first circuitry and second circuitry. The first circuitry may be capable of performing at least one operation including, at least in part, generating check data based at least in part upon other data, regenerating the other data based at least in part upon the check data, and/or determining locations of the check data and the other data in storage. The second circuitry may be capable of controlling, at least in part, at least one interface to transmit from and/or receive at the integrated circuit the check data and/or the other data. Depending at least in part upon the selected mode of operation, the first circuitry may be either enabled to perform or disabled from performing the at least one operation.
Patent TW-I227582-B (TW)
Title: External cavity tunable laser system formed from MEMS corner mirror array element
Inventor: HUANG LONG-SUN
IPC: H01S3/00
Filed: 2003-11-28
Granted: 2005-02-01
Abstract: A tunable laser system having a light source, a grating, a corner mirror array, and a receiver is provided. In which, the light source emits a light, and the light is reflected by the grating located in front of the light source to the corner mirror array disposed in front of the grating. Then, the receiver receives the light reflected from the corner mirror array and outputs the received light. Since the corner mirror array of the tunable laser system of the present invention has the optical feedback function and the optical switching function, the tunable laser system has the functions of adjusting the output wavelength and selecting the numbers of the output channels accordingly.
Patent TW-I238400-B (TW)
Title: Data slice generation method and apparatus for optical disk drive
Inventor: WANG HAO-YUNG
IPC: G11B7/007
Filed: 2003-12-10
Granted: 2005-08-21
Abstract: A data slice signal generation method of an optical disk drive and a device thereof are disclosed, in which a disk including header areas and data areas of different materials is used. The data slice signal generation method includes the following steps. First, a data slice signal is generated according to the RF signal read by the optical pickup head of the optical disk drive, and the data slice values, reflecting the central levels of the RF signal, of the data slice signal at the beginnings of the header area and data area are preset. Secondly, when the optical pickup head of the optical disk drive enters a header area or a data area, the data slice signal takes the preset data slice value of the header area or data area, respectively. Then, the data slice signal is adjusted to approach the central levels of the RF signal.
Patent TW-I257422-B (TW)
Title: Polishing composition
Inventor: KITAYAMA HIROAKI
IPC: C09K3/14
Filed: 2003-12-19
Granted: 2006-07-01
Abstract: A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.
Patent TW-I229462-B (TW)
Title: Improved method of white light LED
Inventor: CHEN HSING
IPC: H01L33/50
Filed: 2003-12-22
Granted: 2005-03-11
Abstract: Now the white light LED is mainly formed by blue light LED die added with YAG yellow fluorescent powder to generate white light through blue-yellow complementary color. By this method of formation, the white light wavelength has only blue light and yellow light wavelengths. The shortcomings is that signal is very weak in red light wave band, and especially when used as light source, there are drawbacks such as color-bias and less brightness for colors. The invention has improved the above shortcomings, and especially in addition to adding yellow fluorescent powder into blue light LED die, a portion of red fluorescent powder is further added to improve the defect of poor color at present in white light LED.
Patent TW-I310230-B (TW)
Title: Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
Inventor: HORIGOME KATSUHIKO
IPC: C09J7/29
Filed: 2004-01-20
Granted: 2009-05-21
Abstract: An object of the present invention is to provide a pressure sensitive adhesive sheet that does not adhere to other apparatuses and the like, even when it is applied to a manufacturing including heat treatment or treatment involving heat generation. It is a further object of the present invention to provide a pressure sensitive adhesive sheet for semiconductor wafer processing or the like having unprecedented high-temperature heat resistance, which can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as protective function of a circuit surface or expanding properties. A pressure sensitive adhesive sheet according to the present invention is characterized by comprising a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material.
Patent TW-I244329-B (TW)
Title: Improved image sensor light shield
Inventor: RHODES HOWARD E
IPC: H01L31/0232
Filed: 2004-04-09
Granted: 2005-11-21
Abstract: An improved imager pixel arrangement having a light shield over the pixel circuitry, but below the conductive interconnect layers of the pixel. The light shield can be a thin film of opaque (or nearly-opaque) material with openings for contacts to the underlying circuitry. An aperture in the light shield exposes the active region of the pixel's photoconversion device.
Patent TW-I239615-B (TW)
Title: Semiconductor die package with increased thermal conduction
Inventor: PETTY-WEEKS SANDRA L
IPC: H01L23/053
Filed: 2004-04-19
Granted: 2005-09-11
Abstract: In one exemplary embodiment, a structure comprises a substrate having a core, a top surface and a bottom surface. A substrate die pad is situated on the top surface of the substrate and is capable of receiving a die, and a heat spreader is situated on the bottom surface of the substrate. The substrate further comprises a first metal cap, at least one buried via, and a second metal cap. The first metal cap is situated below and is thermally coupled to the substrate die pad. The at least one buried via is situated below the first metal cap within the core of the substrate. The second metal cap is situated below the at least one buried via and is thermally coupled to the second metal cap.
Patent TW-I287048-B (TW)
Title: Equipment for cathode-sputtering
Inventor: FUCHS FRANK
IPC: H01J37/34
Filed: 2004-05-27
Granted: 2007-09-21
Abstract: This invention relates to an equipment for cathode-sputtering (8) for the coating of substrates (17) in vacuum, it includes a pipe-shaped carrier for the sputtering material (2), which can rotate around its longitudinal axis; a cooling system, which is suitable to circulate a cooling medium in the pipe-shaped carrier (2) in connection with a cooling device arranged at the outside of the carrier (2); a device to connect with an electrical power supply; and a device for the rotation-drive of the pipe-shaped carrier around its longitudinal axis. In addition, said equipment uses a magnet-system, which extends along the axis, to magnetically include a plasma, which is provided near a target composed of the sputtering material, where the magnet-system includes pole-shoes (9, 10) and magnet-yokes (12, 13) composed of magnetic permeable metal and magnetizing medium (5), which are suitable to generate a magnetic flux in the magnet-system, where the magnet-poles of one polarity of the magnet-system are arranged outside the pipe-shaped target-carrier (2) and enclose it in a frame-shape, and the magnetic opposite poles are provided in the pipe-shaped rotatable target-carrier (2).
Patent TW-I231769-B (TW)
Title: Pin retention mechanism for swing arm of toy vehicle
Inventor: LAI CHUEN-LIN
IPC: A63H17/26
Filed: 2004-05-28
Granted: 2005-05-01
Abstract: A pin retention mechanism for a swing arm of a toy vehicle comprises a front frame, a rear frame, two pins, and four movable joints. The movable joints are rotatably mounted in sockets defined in the front and rear frames respectively. By the arbitrary orientation variation feature provided by the movable joints, angle of the two pins can be freely adjusted.
Patent TW-I245417-B (TW)
Title: Flip-chip type image sensor chip
Inventor: CHAO YEONG-CHING
IPC: H01L27/146
Filed: 2004-06-02
Granted: 2005-12-11
Abstract: A flip-chip type image sensor chip includes a transplant substrate with a component-forming surface. A first patterned metal layer and a planarization layer are formed on the component-forming surface of the transplant substrate. The planarization layer covers the first patterned metal layer. A plurality of MOS transistor, a, plurality of photo diodes and a field oxide film are formed on the planarization layer, which are provided as sensing terminals of the image sensor chip. The sensing terminals are toward the component-forming surface of the transplant substrate.
Patent TW-I237516-B (TW)
Title: Pixel device of electroluminescence device
Inventor: SU WEIN-TOWN
IPC: H05B33/00
Filed: 2004-06-11
Granted: 2005-08-01
Abstract: A pixel device of an electroluminescence device that comprises a voltage signal having a first state and a second state, a current signal, a first circuit further comprising a first transistor, a second transistor and a capacitor, the capacitor including a first terminal coupled to a power supply, the first transistor including a gate electrode coupled to a second terminal of the capacitor, and the second transistor including a gate electrode receiving the voltage signal, wherein the first circuit provides a voltage level across the capacitor in response to the first state of the voltage signal, and maintains the voltage level in response to the second state of the voltage signal, and a second circuit further comprising a third transistor and fourth transistor, the third transistor including a gate electrode coupled to a gate electrode of the fourth transistor, wherein the second circuit provides a current proportional to the magnitude of the current signal in response to the first state of the voltage signal, and the first circuit provides a sum current of the proportional current and the current signal.
Patent TW-I243420-B (TW)
Title: Semiconductor wafer cleaning method and apparatus
Inventor: ARAKI TAKUMI
IPC: H01L21/302
Filed: 2004-07-02
Granted: 2005-11-11
Abstract: To provide a device for cleaning a semiconductor wafer that is highly effective in cleaning and can save an operating cost and to seek for a cleaning method therefor. A movable cap provided with a spray nozzle lowers and covers a wafer to spray and clean it, then the movable cap is lifted up from the wafer, and the wafer is transferred to a next station. Single or a plurality of individual stations are provided in each of units in a cleaning step, a rinsing step and a drying step, and wafers are simultaneously transferred at a specified tact time. The wafer is dried by jetting a dry air and spinning at high speed. A splash of a washing liquid and a rinsing liquid is liquefied and reused in each station.
Patent TW-I232636-B (TW)
Title: Phase locked loop with nonlinear phase-error response characteristic
Inventor: CHOU YU-PIN
IPC: H03L7/06
Filed: 2004-07-13
Granted: 2005-05-11
Abstract: A phase-locked loop has a phase/frequency detector for generating phase error signal according to a reference signal and an input signal, a charge pump for outputting a voltage signal according to the phase error signal, a voltage-controlled oscillator for outputting an output signal corresponding to the phase error signal according to the voltage signal, an adaptive adjusting unit for outputting a control signal according to the phase error signal, so as to form a nonlinear between the output signal and the phase error signal.
Patent TW-I289667-B (TW)
Title: High G-value impact test system and test method
Inventor: SHIUNG LE-CHIUN
IPC: G01P15/08
Filed: 2004-07-30
Granted: 2007-11-11
Abstract: The present invention provides a high G-value impact test system and a high G-value impact test method. The high G-value impact test system includes an acceleration providing device for accelerating; an acceleration sensing device for sensing an acceleration value generated by an object; an acceleration transmission device for transferring an acceleration provided by the acceleration to an object to be tested, in which the object to be tested is fixed in the acceleration transferring device; and a data acquiring and analyzing device for acquiring and analyzing information of the acceleration sensing device. The present invention employs the concept that equivalent impact effect and equivalent acceleration are resulted from relative motion of objects to measure the capability of object enduring high G value, so as to provide an economical and effective high G-value impact test system and test method.
Patent TW-I280963-B (TW)
Title: Manufacture method for penicillanic acid compounds
Inventor: TOKUMARU YOSHIHISA
IPC: C07D499/86
Filed: 2004-09-02
Granted: 2007-05-11
Abstract: This invention provides a manufacture method for penicillanic acid compounds represented by formula (2), which is to react a penicillanic acid compounds represented by formula (1) with (b) a metal having a standard oxidation reduction potential (ORP) lower than that of bismuth, in the presence of a bismuth metal or bismuth compound, (wherein, X and Y represent hydrogen, halogen atoms, provided not a hydrogen at the same time, n represents an integer of 0 to 2, R represents a carboxyl protecting group) (wherein, n and R are same as above).
Patent TW-I239061-B (TW)
Title: Bump structure, bumping process, and flip chip package
Inventor: HU CHIEH-CHIA
IPC: H01L21/60
Filed: 2004-10-28
Granted: 2005-09-01
Abstract: A bump structure is provided. The bump structure is suitable for disposing on a chip, wherein the chip has an active surface and a plurality of bonding pads disposed thereon. The bump structure comprises a plurality of conductive bumps disposed on the bonding pads and a sintered metal covering the conductive bumps. Wherein the sintered metal is formed from a plurality of nano-scale metal particles by sintering under a sintering temperature below the melting point of the conductive bumps. The bump structure has higher structural strength and the manufacturing cost is reduced. Furthermore, reliability of flip chip package is improved.
Patent TW-I258680-B (TW)
Title: Double-layered initial search pattern for fast motion estimation method (DLISP)
Inventor: TAI SHEN-CHIUAN
IPC: H04N9/79
Filed: 2004-12-22
Granted: 2006-07-21
Abstract: Double-layered initial search pattern for fast motion estimation method (DLISP), having an initial search pattern consisted of an outer large diamond with 4 searching points and an inner small diamond with 5 searching points, if the minimum block distortion measurement point is the center point of the small diamond, then fetching the point to be motion vector, if the minimum block distortion measurement point is one point of the outer large diamond, then proceeding the 3SS algorithm, and if the minimum block distortion measurement point does not falls on the outer layer, then search continues with normal iterative small diamond search pattern till the minimum block distortion measurement point is the center point of the small diamond, or the new small diamond exceed the search window, then fetching the latest minimum block distortion measurement point to be motion vector.
Patent TW-I279189-B (TW)
Title: Feeding apparatus using venturi tube
Inventor: LEE GYEONG-YONG
IPC: B65G53/16
Filed: 2004-12-24
Granted: 2007-04-21
Abstract: Disclosed herein is a feeding apparatus, constructed to supply material using air fed from an air generating unit through a Venturi tube. The feeding apparatus includes a small-diameter plate which is integrally provided at a central position in a longitudinal direction of a large-diameter pipe that defines an external appearance of the Venturi tube, and generates pressure of a stream of fluid, an outer circumference of the small-diameter plate being in contact with an inner circumference of the large-diameter pipe. An outlet pipe is provided in front of the small-diameter plate to communicate with the large-diameter pipe and is coupled to a hermetic reservoir. An inlet pipe is coupled to an outlet of the reservoir communicating with the outlet pipe and is provided behind the small-diameter plate to communicate with the large-diameter pipe.
Patent TW-I275726-B (TW)
Title: Compression unit
Inventor: KREUTZ TOMAS
IPC: F16L5/02
Filed: 2005-01-27
Granted: 2007-03-11
Abstract: The present invention concerns a compression unit (1) to be used in a sealing system. The sealing system further includes a frame (14-16) receiving compressible units (20) for pipe penetration and/or cable entry in addition to the compression unit (1). Depending of the placing of the compression unit (1) it will abut either two inner corners (17, 18) or two walls of the frame (14-16). Further two supplemental parts (12) are furnished for optional used. The supplemental parts (12) are placed between the compression unit (1) and the frame (14-16) if the compression unit (1) is to abut against an inner corner (17) having a straight form or against walls of the frame (14-16).