baber/WOPTO huggingface dataset:
Patent JP-2016039257-A (JP)
Title: Ultraviolet light irradiation device, and ultraviolet light irradiation processing device
Inventor: ARIKAWA KAZUKI
IPC: H01L21/31
Filed: 2014-08-07
Abstract: PROBLEM TO BE SOLVED: To provide an ultraviolet light irradiation device which enables the materialization of UV curing of an object to be processed using a light source activated with a relatively low power consumption; especially, provide the device capable of reducing UV irradiation of a wavelength of 190 nm or less.SOLUTION: An ultraviolet light irradiation device comprises: a lamp which radiates ultraviolet light; a lamp house which contains the lamp, and is provided with a light extraction part; a first window member disposed in the light extraction part, and having ultraviolet light permeability; and a second window member disposed outside the first window member to be spaced part therefrom by a predetermined space, and having ultraviolet light permeability. The lamp is a fluorescent lamp including: an arc tube filled with a discharge gas and having ultraviolet light permeability; and a fluorescent material which radiates ultraviolet light of a wavelength of 190 nm or longer using, as an excitation light, ultraviolet light of a vacuum ultraviolet region radiated by light emission by the discharge gas. The ultraviolet light irradiation device has a space containing a vacuum-ultraviolet light absorbing gas between the first and second window members.SELECTED DRAWING: Figure 1
Patent JP-2016039051-A (JP)
Title: Electrical connector
Inventor: ONO NAOYUKI
IPC: H01R24/60
Filed: 2014-08-08
Abstract: PROBLEM TO BE SOLVED: To provide an electrical connector that can prevent occurrence of an electrical defect even when a foreign matter or liquid intervenes between a metal plate and a contact in a case where the metal plate is fixed to a housing, and can be downsized and made high in density.SOLUTION: An electrical connector 1 has a contact support portion 12 which has a metal plate 50 having an insulation portion 60a and an insulation portion 60b, a hole portion 13 extending in the plate thickness direction, the upper end of the hole portion 13 being blocked by a connection portion 31, and the insulation portion 60a being exposed to the lower end of the hole portion 13 whereas the metal plate 50 is not exposed to the lower end, and a hole portion 14 extending in the plate thickness direction, the lower portion of the hole portion 14 being opened to the outer surface 18 and blocked by a connection portion 41, and the insulation portion 60b being exposed to the upper end of the hole portion 14 whereas the metal plate 50 is not exposed to the upper end of the hole portion 14.SELECTED DRAWING: Figure 2
Patent JP-2016042410-A (JP)
Title: Lithium ion secondary battery
Inventor: TANAKA HIDEYASU
IPC: H01M4/36
Filed: 2014-08-13
Abstract: PROBLEM TO BE SOLVED: To provide a lithium ion secondary battery having a high capacity and a high rate property.SOLUTION: A lithium ion secondary battery comprises: a positive electrode; a negative electrode; and a nonaqueous electrolytic solution. The positive electrode has a positive electrode mixture layer including, as a positive electrode active material, a lithium-containing metal oxide expressed by LiMnM'O{where M' represents at least one metal element other than Mn and Li, and x and α satisfy the following conditions: 0≤x<1; and 0≤α<1} and having a lamellar crystal structure in which Li is arrayed in a layer. The nonaqueous electrolytic solution contains an electrolyte salt, a cyclic carbonate and a chain carbonate, each of which consists of at least one kind thereof. The concentration of the electrolyte salt in the nonaqueous electrolytic solution is between 1.2 and 2.0 mol/L, exclusive. The ratio β represented by the following formula falls in a range given by 3<β<5: Total volume of the chain carbonate/Total volume of the cyclic carbonate=β.SELECTED DRAWING: None
Patent JP-2016046538-A (JP)
Title: Information processing device, control data transmission method, and information processing system
Inventor: SUWA YOSHIHIKO
IPC: G06F13/00
Filed: 2014-08-19
Abstract: PROBLEM TO BE SOLVED: To provide a technique for effectively realizing the sharing of content images.SOLUTION: A content execution unit 170a executes a game program and a sharing processing unit 140a manages the operation right of a content. A distribution processing unit 180 transmits content image data to another information processing unit. The sharing processing unit 140a includes: an information acquisition unit 142a that obtains operation information of a controller from the other information processing device; an operation data providing unit 158 that provides the obtained operation information to a game program; a control data acquisition unit 166 that obtains control data for a controlled unit of the controller from the game program; and a control data providing unit 168 that provides the control data to a controller of the other information processing device.SELECTED DRAWING: Figure 5
Patent JP-2016044692-A (JP)
Title: Mechanical brake operation device for drum brake
Inventor: TATSUMI YOSHIHIRO
IPC: F16D65/22
Filed: 2014-08-19
Abstract: PROBLEM TO BE SOLVED: To provide a mechanical brake operation device for a drum brake showing a high position setting effect for an operation lever by restricting an operation lever rotating toward a cable drawing direction when external force acts against the operation lever during transportation of the drum brake or during connecting work of the brake cable.SOLUTION: This invention relates to a mechanical brake operation device in which when an operation lever 24 is placed at a position where a work for connecting three members of a brake cable 41, the operation lever 24 and a connecting pin 43 can be carried out, it can be held in a bridge part 23a at a first position against the bridge part 23a of a strat 23 and when the operation lever 24 is placed at a position where a work for connecting three members cannot be carried out, a clip 30 for restricting a rotation toward a counter-cable drawing direction at a second position in respect to the bridge part 23a is movably attached to the bridge part 23a of the strat 23, and when the clip 30 is placed at the first position, the operation lever 24 is held at a position where three members can be connected.SELECTED DRAWING: Figure 4
Patent JP-2016043372-A (JP)
Title: Method and device for detecting transverse crack of continuously cast slab and method and device for manufacturing the continuously cast slab using the detection method
Inventor: ODAGAKI TOMOYA
IPC: B22D11/053
Filed: 2014-08-21
Abstract: PROBLEM TO BE SOLVED: To precisely detect a transverse crack produced on a cast slab 3 in manufacture of a continuously cast slab, and to provide a method and a device for manufacturing a high quality cast slab without the transverse crack on the basis of the detection.SOLUTION: A method for detecting a transverse crack of a continuously cast slab is characterized in that a friction force produced between a casting mold 1 and a cast slab 3 is calculated on the basis of time-discrete data of a load in casting mold oscillation during on-line and during off-line and, when a friction force variation coefficient (=standard deviation/average value of friction force×100[%]) operated from the calculated friction force exceeds a preset threshold, it is detected that there is a risk of occurrence of the transverse crack.SELECTED DRAWING: Figure 1
Patent JP-2016045375-A (JP)
Title: Image forming apparatus
Inventor: SATO SHOGO
IPC: G03G15/00
Filed: 2014-08-22
Abstract: PROBLEM TO BE SOLVED: To provide an image forming apparatus that can achieve a reduction in size and suppress the occurrence of unevenness in print images.SOLUTION: In a printer 1 including an apparatus body 2 and a process cartridge 3 having a photoreceptor drum 13, a drum driving gear 41, which rotates a body coupling 38 capable of engaging or disengaging with/from a drum coupling 72 of the process cartridge 3, is formed larger than the photoreceptor drum 13 to be overlapped with a paper ejection tray 10 when seen from the transverse direction.SELECTED DRAWING: Figure 2
Patent JP-2016046458-A (JP)
Title: Chip resistor and packaging structure therefor
Inventor: HIRASAWA KOICHI
IPC: H01C7/00
Filed: 2014-08-26
Abstract: PROBLEM TO BE SOLVED: To provide a wire bonding connection type chip resistor which improves heat dissipation and surge resistance, and a packaging structure therefor.SOLUTION: A chip resistor 1 includes: an insulation substrate 2 in a rectangular parallelepiped shape; a pair of front-side electrodes 3 and 4 which are formed along sides 2a and 2b opposing each other on a front face of the insulation substrate 2; and a resistive element 5 which is formed to be connected to the front-side electrodes 3 and 4. A planar shape of the pair of front-side electrodes 3 and 4 is formed in a trapezoidal shape that occupies one side (2a or 2b) of the insulation substrate 2, and inclined side parts 3a and 4a of the front-side electrodes 3 and 4 are disposed oppositely in parallel with each other while interposing the resistive element 5 therebetween. In a portion where an interval between the sides 2a and 2b of the insulation substrate 2 and the inclined side parts 3a and 4a becomes substantially maximum in the front-side electrodes 3 and 4, two parts which are positioned on a diagonal on the front face of the insulation substrate 2 are defined as connection parts C for a bonding wire, respectively.SELECTED DRAWING: Figure 1
Patent JP-2016045449-A (JP)
Title: Silver halide photosensitive material and production method of conductive film
Inventor: FUKUDA MASAHARU
IPC: G03C1/04
Filed: 2014-08-26
Abstract: PROBLEM TO BE SOLVED: To provide a silver halide photosensitive material having good physical properties of a film, from which a conductive film having an improved resistance value can be formed, and a production method of a conductive film having an improved resistance value and suppressing breakage in a patterned conductive part.SOLUTION: The silver halide photosensitive material includes a photosensitive silver halide emulsion layer on at least one surface of a support body. The photosensitive silver halide emulsion layer comprises at least photosensitive silver halide particles and a binder component comprising natural polymeric polysaccharide derived from red algae and a water-soluble polymer containing no nitrogen atom, in which the total content of the natural polymeric polysaccharide derived from red algae and the water-soluble polymer containing no nitrogen atom is 90 mass% or more with respect to the total content of the binder component.SELECTED DRAWING: Figure 1
Patent JP-2016047760-A (JP)
Title: Paper sheet conveyance path
Inventor: TANAAMI TOMOHIKO
IPC: B65H5/38
Filed: 2014-08-28
Abstract: PROBLEM TO BE SOLVED: To convey paper sheets reliably without increasing manufacturing cost significantly.SOLUTION: A paper sheet conveyance path is provided with a conveyance guide 30 made of a resin material, which is disposed so that conveyance surfaces 32 face a conveyance chain 20 traveling along a conveyance direction of a paper sheet, and conveys the paper sheet using the conveyance guide 30 as a guide when the conveyance chain 20 is driven. In the paper sheet conveyance path, guide ribs 33 extending along the conveyance direction of the paper sheet are formed on the conveyance surfaces 32 of the conveyance guide 30. Satin finishing is applied only to the conveyance surfaces 32 of the conveyance guide 30 so that the surface roughness of the conveyance surface 32 is greater than the surface roughness of the guide rib 33.SELECTED DRAWING: Figure 3
Patent JP-2016050326-A (JP)
Title: Copper alloy for electronic and electric device, copper alloy thin sheet for electronic and electric device, component and terminal for electronic and electric device
Inventor: MAKI KAZUMASA
IPC: C22C9/00
Filed: 2014-08-29
Abstract: PROBLEM TO BE SOLVED: To provide a copper alloy for electronic and electric device excellent surely and sufficiently in flexure processability, stress relaxation resistance and shear processability, and excellent in strength and conductivity.SOLUTION: A copper alloy for electronic and electric device has a composition containing Ni of 1.0 mass% to 5.0 mass%, Si of 0.1 mass% to 1.5 mass% and the balance Cu with inevitable impurities and having Ni/Si (mass ratio) in a range of 2.0 to 6.0, a crystal grain boundary set between measurement points having direction difference between neighboring measurement of over 15° by measuring measurement area of 1000 μmor more by EBSD method with measurement interval of 0.1 μm and analyzing it with excluding the measurement point having CI value analyzed by a data analysis soft OIM of 0.1 or less, special grain boundary ratio (Lσ/L) which is a ratio of the sum of each boundary length of Σ3, Σ9, Σ27a, Σ27b to all crystal grain boundary length of 10% or more and less than 60% and Vickers hardness of a surface of 120 or more.SELECTED DRAWING: None
Patent JP-2016050340-A (JP)
Title: Vapor deposition apparatus and vapor deposition method
Inventor: KOISHIZAKI TSUYOSHI
IPC: C23C14/24
Filed: 2014-08-29
Abstract: PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method, enabling the film thickness of a vapor-deposited film to be measured with higher accuracy and a higher responsibility.SOLUTION: There is provided the vapor deposition apparatus for vapor-depositing a gasified material 8 on the surface of a substrate 4 arranged in a vacuum chamber 1. The vapor deposition apparatus comprises: a vapor deposition source for gasifying a material; optical concentration measuring means 100 for optically measuring the concentration of the material 8 gasified by an evaporation source 3; and a valve 6 for adjusting the flow rate of the gasified material. The optical concentration measuring means 100 is arranged between the valve 6 for adjusting the flow rate and an aperture.SELECTED DRAWING: Figure 1
Patent JP-2016050439-A (JP)
Title: Pile foundation
Inventor: MIYAZAKI MITSUO
IPC: E02D27/34
Filed: 2014-09-01
Abstract: PROBLEM TO BE SOLVED: To provide a pile foundation that supports one unit with a plurality of piles, the pile foundation allowing economically efficient design of a footing that connects pile heads, and keeping resisting force, rigidity, and pile head fixation degree to withstand horizontal force constant in all directions.SOLUTION: A pile foundation supports, with a plurality of piles, a vertical load of one column of a base-isolated structure or an aseismic structure or one unit of seismic isolator. A distance has been secured between a tip part of adjacent piles, in a bearing layer of a ground around the piles, that equals to or is greater than a necessary separation distance determined in accordance with a pile diameter or a pile tip part diameter. A pile head is disposed in a range that satisfies an equation 1.0Do<Dtc≤1.5Do, where Dtc is a distance between a center line of adjacent piles and Do is a pile head diameter, and the pile is a slightly inclined pile inclined slightly from a vertical axis in a range that satisfies an equation 0<θ≤1/10(rad), where θ is an angle of inclination of a pile axis from the vertical axis.SELECTED DRAWING: Figure 4
Patent JP-2016054339-A (JP)
Title: Solid-state imaging device
Inventor: KANEMITSU SHIROSHI
IPC: H04N5/357
Filed: 2014-09-02
Abstract: PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of reducing a circuit scale and power consumption.SOLUTION: According to the embodiment, a solid-state imaging device comprises: a line memory 22 as a delay circuit; a flaw correction circuit 23 as a correction circuit; and a noise reduction circuit 24. In the correction circuit, a first pixel data is input from the delay circuit. The first pixel data corresponds to a pixel block. Pixels are arranged into the pixel block in a matrix configuration. The correction circuit performs flaw correction to an image signal. A noise reduction circuit performs a noise reduction processing to the image signal from the correction circuit. The correction circuit performs the flaw correction based on the first pixel data. The correction circuit outputs the pixel data of which the flaw is corrected. The noise reduction circuit performs the noise reduction processing based on a second pixel data obtained by delaying the pixel data from the correction circuit in each pixel.SELECTED DRAWING: Figure 3
Patent JP-2016058509-A (JP)
Title: Method of manufacturing flexible printed wiring board with reinforcing plate and flexible printed wiring board intermediate
Inventor: HAPPOYA AKIHIKO
IPC: H05K1/02
Filed: 2014-09-09
Abstract: PROBLEM TO BE SOLVED: To manufacture a flexible printed wiring board with a reinforcing plate conveniently and efficiently.SOLUTION: A method of manufacturing a flexible printed wiring board with a reinforcing plate includes a step for applying a curable adhesive to a reinforcing part of the flexible printed wiring board, by ink jet print system. The adhesive thus applied is semi-cured, the reinforcing plate is mounted on the layer of adhesive thus cured, the reinforcing plate and flexible printed wiring board are hot pressed, thus curing the adhesive and bonding the reinforcing plate and flexible printed wiring board.SELECTED DRAWING: Figure 1
Patent JP-2016057801-A (JP)
Title: Charging processing system
Inventor: TAKUHARA MASAHITO
IPC: G08G1/09
Filed: 2014-09-09
Abstract: PROBLEM TO BE SOLVED: To provide a system capable of performing charging to a vehicle at an arbitrary position by using a method for collating observation images which can be acquired from a vehicle during traveling with preliminarily stored reference images.SOLUTION: A charging processing system 1 for performing charging processing when a user vehicle 30 travels on a road includes: a reference image database for storing reference images preliminarily acquired in association with a plurality of charging positions set on the road; an observation image acquisition part 31 installed in the user vehicle 30 for acquiring observation images by photographing landscapes around the road on which the user vehicle 30 travels; a data processing part 33 for performing image matching between the stored reference images and the newly acquired observation images; and a charging processing part 35 for performing charging processing to the user vehicle 30 on the basis of the result of the image matching by the data processing part 33.SELECTED DRAWING: Figure 4
Patent JP-2016056472-A (JP)
Title: Wire bending auxiliary tool
Inventor: IKEGAMI MAKOTO
IPC: F16G11/00
Filed: 2014-09-09
Abstract: PROBLEM TO BE SOLVED: To provide a wire bending auxiliary tool which can suppress variations in the bent lengths of strands after the leading end parts of the strands are bent, without marking each of the strands.SOLUTION: A wire bending auxiliary tool includes: a plurality of wire bending parts 10 each of which is a cylindrical member allowing an individual strand 1a to be inserted therein and removed therefrom; and a support part 20 for holding a state in which the plurality of wire bending parts 10 are radially arranged while, with respect to the center axial direction of a wire rope, being inclined in such a way that their respective distances from the center axis of the wire rope continuously increase from one end parts 10a put together toward the other end parts 10b serving as bending fulcrums. The plurality of wire bending parts 10 have all the same length.SELECTED DRAWING: Figure 6
Patent JP-2015079947-A (JP)
Title: Semiconductor device and manufacturing method of the same
Inventor: YAMAZAKI SHUNPEI
IPC: H01L21/8242
Filed: 2014-09-09
Abstract: PROBLEM TO BE SOLVED: To provide a transistor having high electron-field effect mobility; or provide a transistor having stable electrical characteristics; or provide a transistor using less current during an off period (non-conductive period); or provide a semiconductor device having the transistor.SOLUTION: A semiconductor device comprises: a first insulation film; an oxide semiconductor film on the first insulation film; a second insulation film on the oxide semiconductor film; and a conductive film which overlaps the oxide semiconductor film via the first insulation film or the second insulation film. A composition of the oxide semiconductor film continuously changes between the first insulation film and the second insulation film.
Patent JP-2016058662-A (JP)
Title: Light emission device, mounting board and luminaire
Inventor: YAMAGUCHI HIROSHI
IPC: H01L33/00
Filed: 2014-09-11
Abstract: PROBLEM TO BE SOLVED: To provide a mounting board, a light emission device, etc. that can implement a combination of plural circuit patterns.SOLUTION: A light emission device has a substrate 10, a high voltage side power supply unit 21 having plural high voltage side power supply terminals 21a, 21b formed on the substrate 10, a low voltage side power supply unit 22 having plural low voltage side power supply terminals 22a, 22b formed on the substrate 10, a wire 30 which is patterned in a predetermined shape as a current path between the high voltage side power supply unit 21 and the low voltage side power supply unit 22 on the substrate 10, and a light source member 40 which is electrically connected to the wire 30 and mounted on the substrate 10. The light source member 40 is at least one of a first light source member 41 and a second light source member 42 which are different in characteristic, and the wire 30 has connection portions 33 and 34 for electrically connecting at least one group of the plural high voltage side power supply terminals and the plural low voltage side power supply terminals.SELECTED DRAWING: Figure 2A
Patent JP-2016059017-A (JP)
Title: Communication system
Inventor: OSAKI YOSHIAKI
IPC: H04B3/54
Filed: 2014-09-12
Abstract: PROBLEM TO BE SOLVED: To provide a communication system capable of, when a gap is generated in an assumed state, reducing the gap in communication between communication devices using a PLC.SOLUTION: In a communication system including a transmission side communication device 21 and a reception side communication device 22 which communicate with each other by using a power line carrier communication system, the transmission side communication device 21 includes: a data transmission part 26; a frequency/modulation system setting part 27; and a selection information reception part 28. Also, the communication system includes: a retransmission monitoring part 43; a transmission analysis part 44 for receiving the instruction information of a transmission method from the reception side communication device 22 received by the selection information reception part 28 and the information of a modulation system/frequency band determined for transmission by the frequency/modulation system setting part 27, and for analyzing a method for the next transmission; and a correction processing part 45 for calculating correction information as well as the information of the past history data on the basis of the analysis result as a transmission side correction system part 41.SELECTED DRAWING: Figure 3