baber/WOPTO huggingface dataset:
Patent TW-201229426-A (TW)
Title: LED-based replacement for fluorescent light source
Inventor: HASNAIN GHULAM
IPC: F21V29/00
Filed: 2011-09-21
Abstract: A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.
Patent TW-201314472-A (TW)
Title: Repetitive learning control method adopting empirical mode decomposition technique and repetitive learning controller
Inventor: Cai meng-xun
IPC: G06F17/00
Filed: 2011-09-29
Abstract: The present invention relates to a repetitive learning control method adopting an empirical mode decomposition technique and a repetitive learning controller, which is mainly used in highly repetitive motion systems, such as systems for repeating path-related motion in industrial components processing and products detection, to promote the command tracking performance. For the practical application, this method employs an empirical mode decomposition (EMD) technique to decompose the output tracking error signal generated by the repetitive learning controller to determine the error signal components needed to be filtered out, and, in resuming the learning process, the error signal components that must be filtered out and are contained in the tracking error signal are removed. Thereafter, high accuracy correction magnitude required by the repetitive learning controller can be created, which promotes the system's better command tracking performance.
Patent TW-201223365-A (TW)
Title: Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method
Inventor: YOSHIKAWA KAZUHIRO
IPC: H05K3/26
Filed: 2011-10-07
Abstract: The objective of the present invention is to provide a method of manufacturing a printed circuit board having a good adhesion characteristic between faces of an insulation resin layer and a solder resist layer, even when the surface roughness of the insulation resin layer exposed between circuits is not so rough. In order to achieve this objective, a method of manufacturing a printed circuit board using a copper-clad laminate having non-roughened copper foils pasted together is adopted. The method of manufacturing a printed circuit board is characterized in forming circuits by etching the non-roughened copper foils with copper-etching liquid, then implementing cleanup processing on insulation resin surfaces exposed between the circuits, and characterized, upon conducting a semi-quantitative analysis of surface-treatment metal components of the non-roughened copper foils remaining on the insulation resin surfaces that had cleanup processing implemented thereupon, with an XPS analysis apparatus (X-ray source: A1(Ka), acceleration voltage: 15 kV, beam diameter: 50 μm), in making the amount of each of the surface-treatment metal components to be not more than the detection limit.
Patent TW-201318665-A (TW)
Title: Foldable 3D mask
Inventor: JIAN CHENG-YUAN
IPC: A62B9/06
Filed: 2011-11-03
Abstract: The present invention provides a foldable 3D mask, including a mask body and at least a fixing band. The mask body has an upper part, a lower part and a central part between the upper part and the lower part. The central part has a central region, an upper invagination area between the central region and the upper part or a lower invagination area between the central region and the lower part. Through design of the upper invagination area or the lower invagination area, the mask body will avoid being dragged down by the chin and the central region will not deform easily when a wearer's mouth makes a broadly opening or closing action, thus preventing the foldable mask from the generation of a problem of worse fitting with the wearer's face, reducing the leak rate in order to obtain a high protection efficiency.
Patent TW-201321721-A (TW)
Title: Method and apparatus for determining location offset information
Inventor: CUDALBU CIPRIAN
IPC: G01C25/00
Filed: 2011-11-22
Abstract: An approach is provided for determining location offset information. A correction manager determines to present, at a device, a location-based display including one or more representations of one or more location-based features. Next, the correction manager receives an input for specifying offset information for at least one of the one or more representations with respect to the location-based display. Then, the correction manager determines to present the one or more representations in the location-based display based, at least in part, on the offset information.
Patent TW-201324800-A (TW)
Title: Thin film solar cell module and manufacturing method thereof
Inventor: WU CHING-IN
IPC: H01L31/18
Filed: 2011-12-07
Abstract: A thin film solar cell includes a first substrate, a first electrode layer, a photovoltaic conversion layer and a second electrode layer. The photovoltaic conversion layer includes a P-type semiconductor layer, an I-type semiconductor layer, a first N-type semiconductor layer and a second N-type semiconductor layer, wherein the second N-type semiconductor layer is disposed between the first N-type semiconductor layer and the second electrode layer, the doping concentration of the second N-type semiconductor layer is greater than that of the first N-type semiconductor layer, the thickness of the second N-type semiconductor layer is less than or equal to that of the first N-type semiconductor layer. Owing to the high doping concentration and thin thickness of the second N-type semiconductor layer, the built-in electric field of the thin film solar cell is increased, and the trap level of the thin film solar cell is reduced, thereby increasing the transport number of the carriers.
Patent TW-201251175-A (TW)
Title: Battery management system
Inventor: KROGH ROSS G
IPC: H01M10/44
Filed: 2011-12-12
Abstract: A battery management system is provided for one or more batteries. The system includes a display unit, and a controller coupled to the display unit and programmed to determine when a healthcare delivery system is coupled to the one or more batteries, to control the display unit to display an initial number corresponding to a time remaining on battery (TROB) when the healthcare delivery system is coupled to the one or more batteries, to determine if the TROB is within a reserve range extending up to a reserve range maximum, the reserve range maximum being less than a maximum TROB, to change the TROB according to an operational state of the healthcare delivery system if the TROB is greater than the reserve range maximum, and to decrease the TROB without regard for the operational state of the healthcare delivery system if the TROB is less than the reserve range maximum.
Patent TW-201242467-A (TW)
Title: Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
Inventor: LIN YAO-JIAN
IPC: H01L23/52
Filed: 2011-12-16
Abstract: A semiconductor device has a first semiconductor die. A first inductor is formed over the first semiconductor die. A second inductor is formed over the first inductor and aligned with the first inductor. An insulating layer is formed over the first semiconductor die and the first and second inductors. A conductive bridge is formed over the insulating layer and electrically connected between the second inductor and the first semiconductor die. In one embodiment, the semiconductor device has a second semiconductor die and a conductive layer is formed between the first and second semiconductor die. In another embodiment, a capacitor is formed over the first semiconductor die. In another embodiment, the insulating layer has a first thickness over a footprint of the first semiconductor die and a second thickness less than the first thickness outside the footprint of the first semiconductor die.
Patent TW-201328052-A (TW)
Title: Mounting module for chip card and electronic device using same
Inventor: GAO YAN-LING
IPC: H05K7/12
Filed: 2012-01-11
Abstract: A chip card mounting module includes a body and a tray for fixing a chip card. The body defines a chamber retaining the tray. The chip card mounting module further includes an elastic member. The elastic member is clamped between the body and the tray to exert an elastic force to the tray. The tray includes a tray body for retaining the chip card and a button fixed on the tray body. The body defines a through hole, in which the button is detachably latched, thereby remaining the tray in the chamber by operating the button. After the button is detached, the elastic force is released to drive the tray body out of the chamber. The invention further provides an electronic device using the chip card mounting module.
Patent TW-201251316-A (TW)
Title: Anode junction device, packaging body manufacturing method, piezoelectric vibrator, oscillator, electronic machine and electric wave clock
Inventor: NUMATA MASASHI
IPC: H03H9/21
Filed: 2012-02-08
Abstract: The subject of the present invention is to provide an anode junction device capable of assuring a high vacuum level in a packaging body, a packaging body manufacturing method using the anode junction device, a piezoelectric vibrator made by the packaging body manufacturing method, an oscillator with the piezoelectric vibrator, an electronic machine, and an electric wave clock. To solve the problem, the anode junction device is characterized by comprising: a first intermediate component (75) which is heat-conductive and bendable, and is disposed between the top (50a) (the outside) of a cap substrate oriented wafer (50) and a first heater (71); and a second intermediate component (76) which is electricity-conductive, heat-conductive and bendable, and is disposed between the bottom L (the outside) of a base substrate oriented wafer (40) and a second heater (72). The first intermediate component (75) is formed such that the shape of a central part (75c) is protruded toward the base substrate oriented wafer (40) beyond a peripheral part (75d), and the second intermediate component (76) is formed such that the shape of a central part (76c) is protruded toward the cap substrate oriented wafer (50) beyond a peripheral part (76d), wherein the first intermediate component (75) and the second intermediate component (76) are deformed to be flat.
Patent TW-201250692-A (TW)
Title: Sense operation in a stacked memory array device
Inventor: GODA AKIRA
IPC: G11C16/06
Filed: 2012-03-07
Abstract: Methods for sensing and memory devices are disclosed. One such method for sensing includes changing a sense condition of a particular layer responsive to a programming rate of that particular layer (e.g., relative to other layers).
Patent TW-201246438-A (TW)
Title: Systems and methods for inhibiting oxide growth in substrate handler vacuum chambers
Inventor: KHOSLA MUKUL
IPC: H01L21/677
Filed: 2012-03-23
Abstract: A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effecter is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effecter and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.
Patent TW-201250962-A (TW)
Title: Semiconductor device and method for manufacturing semiconductor device
Inventor: KIMURA AKIHIRO
IPC: H01L23/538
Filed: 2012-04-03
Abstract: This method for manufacturing a semiconductor device is provided with the steps of preparing lead frames that include a plurality of die pads (11), and a plurality of semiconductor chips (41), positioning each semiconductor chip (41) on any one of the plurality of die pads (11), forming an encapsulating resin (7) that covers the plurality of die pads (11) and the plurality of semiconductor chips (41), and, after forming the encapsulating resin (7), joining a heat sink (6) to the plurality of die pads (11) by sandwiching a resin sheet (862), which is an adhesion layer, and pressing the heat sink (6) against the plurality of die pads (11).
Patent TW-201341713-A (TW)
Title: Lamp
Inventor: HORNG ALEX
IPC: F21Y101/02
Filed: 2012-04-11
Abstract: A lamp including a housing, a cooling module, a light emitting element and a circuit board is disclosed. The housing has a receiving room inside, wherein an opening is formed at an end of the housing, a base is formed at another end of the housing, and a lateral wall of the housing between the opening and the base is sealed. The cooling module has a cooling fan mounted in the receiving room, and at least one air passage is formed between the cooling module and an inner surface of the receiving room. The light emitting element is mounted on the cooling module. The circuit board electrically connects with the base of the housing and the light emitting element, wherein the circuit board has a supporting surface supporting a plurality of electrical elements, and at least one of the plural electrical elements is arranged in the air passage.
Patent TW-201343913-A (TW)
Title: DNA vaccine against multitypes of avian influenza viruses and the composition thereof
Inventor: WU SUH-CHIN
IPC: C12N15/40
Filed: 2012-04-17
Abstract: A DNA vaccine comprising hyperglycosylated mutant HA gene, which is derived from avian influenza virus, is provided. A DNA vaccine composition comprising: (a) the DNA vaccine; and (b) a booster is also provided. A method for eliciting an immune response against a plurality of avian influenza virus subtypes in a subject, comprising delivering the DNA vaccine or the DNA vaccine composition to tissue of the subject is further provided.
Patent TW-201347665-A (TW)
Title: Excrement-collection bag dispenser
Inventor: LAI YIN-WU
IPC: A01K23/00
Filed: 2012-05-18
Abstract: The invention relates to an excrement-collection bag dispenser, which is mainly configured with an excrement-collection bag accommodating zone utilized for filling and collecting an excrement-collection bag, a drawing port utilized for accessing the excrement-collection bag, a lamp member utilized for illumination, and a switch button utilized for actuating the lamp member. The excrement-collection bag dispenser formed of an animal style is characterized in that main structural features of animal body are to form into a product with particular functions. Besides using to collect the excrement-collection bag for pets and serving as a collection dispenser for the excrement-collection bag, beneficial for a pet owner to clean and collect pet excrement when going out, the excrement-collection bag dispenser also can be used as a nighttime lighting device.
Patent TW-201307644-A (TW)
Title: Wooden framework building
Inventor: NAKATA SHINJI
IPC: E04B2/90
Filed: 2012-07-19
Abstract: A wooden framework building is a building which, when a displacement occurs in the building due to an earthquake or the like, can fully adapt to the displacement, and is provided with curtain walls attached to a lower beam and an upper beam.
Patent TW-201349811-A (TW)
Title: Method for dynamically controlling data path, MTC gateway and network device using the same
Inventor: GLEIXNER STEPHAN
IPC: H04L45/74
Filed: 2012-07-24
Abstract: Method for dynamically controlling data paths of Machine-type-communication (MTC) local access device(s) are proposed along with a MTC gateway and a network device using the same method. In one embodiment, the proposed method may include following: a network device, receiving and storing capillary network information and MTC gateway interconnection information from at least one MTC server; combining the access network information with the capillary network information and the MTC gateway interconnection information to build an aggregated topology map; generating enhanced policy rules according to the aggregated topology map related to at least one capillary network; and respectively transmitting the enhanced policy rules to the interconnected MTC gateways.
Patent TW-201407078-A (TW)
Title: Exhaust gas processing conduit, manufacturing apparatus and gas flow guiding method thereof
Inventor: HSU CHIN-MING
IPC: F17D1/04
Filed: 2012-08-10
Abstract: An exhaust gas processing conduit includes a main pipe and a purge pipe. The main pipe has a first sidewall and a connecting port formed on the first sidewall. The purge pipe has one end connected to the first sidewall via the connecting port. The purge pipe has a second sidewall in contact with the first sidewall at an oblique angle. A gas provided by the purge pipe is injected along the first sidewall and into the main pipe so as to guide the gas flowing along a spiral route at the oblique angle. In addition, a manufacturing apparatus and a gas flow guiding method thereof are also disclosed in the invention.
Patent TW-201316478-A (TW)
Title: Signal distribution and radiation in a wireless enabled integrated circuit (IC)
Inventor: BOERS MICHAEL
IPC: H01L23/58
Filed: 2012-08-31
Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
Patent TW-201410769-A (TW)
Title: Rust-removal and decontamination eraser
Inventor: Chen yin-can
IPC: C08L21/00
Filed: 2012-09-07
Abstract: A rust-removal and decontamination eraser is a reaction product of a mixture containing the artificial rubber and the carborundum, wherein the amount of usage of the artificial rubber, based on the weight percentage, ranges from 5 wt% to 90 wt%, and the amount of usage of the carborundum, based on the weight percentage, ranges from 10 wt% to 90 wt%. Through the formation method, a rust-removal and decontamination eraser with utility and cost benefits can be obtained.
Patent TW-201412221-A (TW)
Title: Connecting module
Inventor: HUANG YU-CHENG
IPC: H05K5/00
Filed: 2012-09-13
Abstract: A connecting module including a first casing and a second casing is provided. The first casing includes a first body, a space, a track connected through the space, and a pushing member. A depth of the track along an axis is larger than that of the space. The pushing member is fixed inside the space. The second casing includes a second body, a linking member, a gear set and a connecting arm. The linking member includes a first rack, and the connecting arm includes a second rack. The first rack and the second rack are engaged with the gear set. When the second casing is inserted into the space, the pushing member pushes the linking member, the first rack moves and drives the gear set to rotate, the second rack is moved accordingly and inserts the connecting arm into the track.
Patent TW-201330719-A (TW)
Title: Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil
Inventor: KOHIKI MICHIYA
IPC: H05K3/38
Filed: 2012-09-24
Abstract: An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 mum. Provided is the electrolytic copper foil capable of, without deteriorating various characteristics of the electrolytic copper foil, improving a roughening treatment layer on the copper foil and enhancing the adhesion strength between the copper foil and a resin substrate, especially, capable of obtaining a stronger peeling strength in comparison with a general-purpose epoxy resin substrate (FR-4, etc.) when used in combination with a semiconductor package substrate having a generally low adhesion with a copper foil and a liquid crystal polymer substrate, and also provided is a method for manufacturing the electrolytic copper foil. The present invention addresses the problem of providing the electrolytic copper foil useful as an electrolytic copper foil to be used for a printed wiring board or a battery (LiB, etc.) negative electrode material.
Patent TW-201329251-A (TW)
Title: High-strength galvannealed steel sheet of high bake hardenability, high-strength alloyed galvannealed steel sheet, and method for manufacturing same
Inventor: KAWATA HIROYUKI
IPC: C21D8/02
Filed: 2012-09-28
Abstract: The present invention relates to a steel which contains C, Si, Mn, P, S, Al, N, and O each, a remainder of which is formed of Fe and inevitable impurities. In a range between a 1/8 thickness around a 1/4 plate thickness from a surface of a base material steel sheet to a 3/8 thickness around the 1/4 plate thickness from the surface, a formation of the base material contains a residual austenite aspect with a volume fraction of 3% or higher, a ferrite phase of 50% or lower, and a hard aspect of 40% or higher. An average dislocation density is 51013/m2 or higher, and the solution C amount contained in the residual austenite aspect is from 0.70 wt% to 1.00 wt%. A random strength ratio of an X ray of an FCC iron of an aggregate structure of the residual austenite aspect is 3.0 or below. A ratio of a particle diameter with respect to a rolling direction of the residual austenite aspect to a particle diameter with respect to a plate width direction is from 0.75 to 1.33. A galvannealed layer is formed at a surface of the base material. The plate thickness is from 0.6 mm to 5.0 mm.
Patent TW-201331951-A (TW)
Title: Energy efficient memory with reconfigurable decoding
Inventor: RAO HARI M
IPC: G11C7/18
Filed: 2012-10-04
Abstract: A sacrificial memory bank is added to a block of regular banks in a memory to reduce dynamic power consumption of the memory. The sacrificial bank is accessed by a set of bit lines that is substantially shorter than corresponding bit lines extending through all of the regular memory banks. Memory read and write operations, which are addressed to one of the regular banks, are deliberately redirected to the sacrificial bank having the short bit lines. Tracking circuitry identifies the regular bank that was addressed for each location in the sacrificial bank. Data is moved from the sacrificial bank to a regular bank only when a new write operation does not match the bank of the previous write operation. Dynamic power is reduced because locality of reference causes access to the sacrificial bank without having to access a regular bank for most memory read and write operations.
Patent TW-201317516-A (TW)
Title: Lighting assembly
Inventor: MCCOLLUM TIMOTHY A
IPC: F21V8/00
Filed: 2012-10-16
Abstract: A lighting assembly includes alight guide in which light propagates by total internal reflection between opposed major surfaces. The light guide is edge lit by a light source the inputs light of a first spectrum to the light guide. Light of a second spectrum is mixed with the light of the first spectrum so that light output by the lighting assembly has a spectrum that is a combination of the first spectrum and the second spectrum.