baber/WOPTO huggingface dataset:
Patent TW-529086-B (TW)
Title: Chemical vapor deposition method
Inventor: KO SANG-TAE
IPC: C23C16/455
Filed: 2002-02-08
Granted: 2003-04-21
Abstract: This invention is intended to provide a chemical vapor deposition (CVD) method mainly suited to mass production of oxide films for gate having excellent characteristics. The inside of the vacuum container of the CVD system is separated into a plasma generating space and a film forming space by a conductive partition wall having plural penetration holes, exciting radicals produced in the plasma generating space are introduced into the film forming space only through the penetration holes, supplying material gas from outside into the inner space of the partition wall, which is separated from the plasma generating space and communicating with the film forming space through plural diffusion holes, and introducing the material gas into the film forming space through the diffusion holes, and a film is formed on the substrate by the exciting radicals and material gas thus introduced into the film forming space. The object is achieved by adopting the process comprising a first step of forming a film on the substrate as the before described, and a second step of emitting exciting radicals to the film formed in the first step to promote oxidation reaction.
Patent TW-594802-B (TW)
Title: A method for manufacturing thin-film chip resistors
Inventor: KUHL REINER WILHELM
IPC: H01C17/00
Filed: 2002-02-26
Granted: 2004-06-21
Abstract: A method for manufacturing thin-film chip resistors, in which method a resistor layer (14) and a contact layer (15, 16) are applied onto the upper surface of a substrate (10) and structured using laser light so as to form on said substrate (10) a plurality of adjacent, separate resistor lands (24) having a predetermined approximate resistance value, allows the simplified and cheap manufacturing by performing the electrical insulation of the resistor elements (24) and the structuring of the individual resistor lands (24) for the entire resistor land simultaneously by means of a laser-lithographic direct exposure method.
Patent TW-593730-B (TW)
Title: Process of direct low-temperature growth of carbon nanotubes on a substrate
Inventor: HWANG CHIEN-LIANG
IPC: C01B31/02
Filed: 2002-03-25
Granted: 2004-06-21
Abstract: Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a low-temperature thermal chemical vapor deposition, which can be used as an electron emission source for field emission displays. The three layers include a layer of an active metal catalyst sandwiched between a thick metal support layer formed on the substrate and a bonding metal layer. The active metal catalyst is iron, cobalt, nickel or an alloy thereof; the metal support and the bonding metal independently are Au, Ag, Cu, Pd, Pt or an alloy thereof; and they can be formed by sputtering, chemical vapor deposition, physical vapor deposition, screen printing or electroplating.
Patent TW-541578-B (TW)
Title: Wafer standard mechanical interface system
Inventor: CHEN WEN-MING
IPC: H01L21/00
Filed: 2002-04-15
Granted: 2003-07-11
Abstract: The present invention provides a wafer standard mechanical interface system capable of transferring wafers to a semiconductor machine, which includes: an interface body and a pressure inlet device. The interface body is provided for carrying a wafer box so as to transfer a plurality of wafers in the wafer box to the semiconductor machine. When the wafer in the wafer box is transferred to the semiconductor machine, the interface body starts the pressure inlet device to inject nitrogen into the wafer box for cleaning the wafer box. In addition, when the wafer is taken back from the semiconductor machine and put into the wafer box, the interface body starts the pressure inlet device to also inject nitrogen into the wafer box for preventing the wafer from aging.
Patent TW-524936-B (TW)
Title: Door braking fixture
Inventor: ARAKI MINORU
IPC: F16F9/12
Filed: 2002-04-29
Granted: 2003-03-21
Abstract: This invention provides a door braking fixture capable of minimizing the variation of the braking force of a rotary damper, assuring a smooth closing operation of the door, and assisting the swing movement of the door and the braking of the door with an urging member. The fixture includes a rotary damper 11 containing a viscous fluid 14 which brakes the movement of the door 5 with a viscous resistance while door 5 swings in a vertical direction with respect to a supporting shaft 4 disposed horizontally. The rotary damper 11 contains a coil spring 16 having one end fixed onto a housing 12 and another end fixed onto a rotor 13, while the door 5 has a center of gravity G positioned on an approximately vertical line of the axis of the supporting shaft 4 in that state that the urgent force of the coil spring 16 is relieved.
Patent TW-594774-B (TW)
Title: The method for testing a data memory
Inventor: HERMANN ROBERT
IPC: G11C29/44
Filed: 2002-05-16
Granted: 2004-06-21
Abstract: A test method for testing a data memory, having an integrated test data compression circuit (16), the data memory (1) having a memory cell array (10) having a large number of addressable memory cells, read/write amplifiers (12) for writing data into and reading data from the memory cells via an internal data bus (12) of the data memory (1), and a test data compression circuit (16) which compresses test data sequences, which are read out serially from the memory cell array (10) in each case, together with stored reference test data sequences to generate an item of indicator data in each case, which indicates whether at least on data error has occurred in the test data sequence read out.
Patent TW-559817-B (TW)
Title: Non-volatile semiconductor memory device and information apparatus
Inventor: MORI YASUMICHI
IPC: G11C16/02
Filed: 2002-06-28
Granted: 2003-11-01
Abstract: A non-volatile semiconductor memory device, comprises a plurality of memory banks each including a plurality of memory cells, a command recognition section for identifying an externally input command signal and outputting an identification signal, an internal control section for generating a control signal for executing a command designated by the identification signal, an address control section for generating an internal address signal to a memory region including an arbitrary combination of the plurality of memory banks to be accessed, based on the externally input address signal, and a first address inversion section for inverting or non-inverting the logical values of at least a specific bit of the input address signal and outputting the resultant input address signal to the address control section. Predetermined memory cells are accessed based on the control signal and the internal address signal.
Patent TW-578425-B (TW)
Title: Selective information storage system and method
Inventor: CHEN FRED
IPC: H04L29/02
Filed: 2002-08-02
Granted: 2004-03-01
Abstract: The present invention is an information storage system and method, which is applied on a mobile communication device. The present invention includes at least a wireless information receiving module, an analysis module, a storage module, and a configuration module. In the process from receiving the information to storage, the user can directly select the wireless information to be received directly from the receiving host; and, the information storage system can make special records for the selection of the user. When processing the wireless information, the method can refer to the selection records of the user to store the wireless information selected to be received by the subscriber.
Patent TW-I237236-B (TW)
Title: Disk ejection device
Inventor: CHANG YEN-JEN
IPC: G11B17/04
Filed: 2002-09-18
Granted: 2005-08-01
Abstract: The present invention relates to a disk ejection device to urgently eject a tray that holds a disk from a housing of a disk data access apparatus. The disk ejection device includes a first bar, a second bar, and a first protrusion. The first bar and the second bar rotatably connect with the tray respectively. One end of the first bar sticks out from a panel of the disk data access apparatus, and the other end corresponds to an end of the second bar. The second bar has a first latch, and the first latch corresponds to the first protrusion connected with the housing. A user may move the stick-out end of the first bar to eject the tray from the housing.
Patent TW-561557-B (TW)
Title: Heat-processing apparatus and method for semiconductor process
Inventor: ISHII KATSUTOSHI
IPC: C23C16/44
Filed: 2002-09-18
Granted: 2003-11-11
Abstract: A supplying system of a heat-processing apparatus for semiconductor process comprises a burner (12), a heater (13) and a gas distributor (14). The burner (12) has a burning chamber (59) arranged outside a processing chamber (21). The burner (12) is provided for reacting hydrogen gas and oxygen gas in the burning chamber (59) in order to produce steam that is in turn supplied to the processing chamber (21). The heater (13) has a heating chamber (61) arranged outside the processing chamber (21). The heater (13) is provided for heating selectively the gas that does not pass through the burning chamber (59) in the heating chamber (61) to a temperature above an activation temperature and then supply the gas to the processing chamber (21). The gas distributor (14) is provided for supplying selectively hydrogen gas and oxygen gas to the burning chamber (59) and supplying selectively reactive gas and inert gas to the heating chamber (61).
Patent TW-I267958-B (TW)
Title: Semiconductor package with stilts for supporting dice
Inventor: HUANG JUNG-PIN
IPC: H01L23/495
Filed: 2002-11-21
Granted: 2006-12-01
Abstract: A semiconductor package with stilts for supporting dice is provided, which includes: a lead frame with at least a die pad and a plurality of leads; at least one die stilt mounted on the die pad, which has a first surface and a second surface and the heights of the die stilts are the same. In a manner that, the first surface of the die stilts are coplanar as the second surface of the die stilt had been attached on the die pad, allowing a semiconductor die to be mounted on the first surface of the die stilt, so as to interpose the die stilt between the die and the die pad. Accordingly, molding compound for enclosing the die and the die stilt is capable of flowing into gap between the die and the die pad, and then reducing void formation to assure quality of the semiconductor package.
Patent TW-589829-B (TW)
Title: Wireless audio/video signal transmitting apparatus and method
Inventor: LEE CHANG-HUNG
IPC: H04N17/00
Filed: 2002-11-26
Granted: 2004-06-01
Abstract: The present invention is a wireless audio/video signal (AV signal) transmitting apparatus for transmitting audio/video signals in a wireless local area network (WLAN). Before transmitting AV signals, the transmitting apparatus has to determine a total transmitting rate of AV signals. The wireless audio/video signal transmitting apparatus has at least one pre-determined compressed styles. When there is at least one AV signals inputted the wireless audio/video signal transmitting apparatus, the apparatus determines the compressing ratio of the each AV signals at first, then using the predetermined compressed style to compress the each AV signals according to the compressing ratio of the each AV signals. Finally, the apparatus transmits the at least one AV signal with the total transmitting rate.
Patent TW-583759-B (TW)
Title: Under bump metallurgy and flip chip
Inventor: HUANG MIN-LUNG
IPC: H01L23/485
Filed: 2003-03-20
Granted: 2004-04-11
Abstract: An under bump metallurgy mainly comprised adhesion layer, a barrier layer and a wetting-barrier layer is provided. The adhesion layer is disposed on a pad of a chip, the barrier layer is disposed on the adhesion layer, the wetting-barrier layer is disposed between the barrier layer and a bump. The wetting-barrier layer includes nickel for improving the contacting ability between the pad and the bump. In addition, a flip chip mainly comprised a chip, a plurality of bumps and the under bump metallurgy mentioned above is provided. The chip has an active surface, a passivation layer and a plurality of pads. The passivation layer is disposed on the active surface exposing the pads, the under bump metallurgy is disposed between the pads and the bumps.
Patent TW-I233020-B (TW)
Title: A computer system with multi-specification transmission channel compatible
Inventor: HSU THOMAS
IPC: G06F13/16
Filed: 2003-03-28
Granted: 2005-05-21
Abstract: A computer system which adopts a memory bus with a plurality of specifications of transmission channel, and that system includes a CPU, a north bridge chip, which connects to the CPU with FSB, a system memory, which connects to the north bridge chip with multi-specification transmission channel, a VGA module, which connects to the north bridge chip with AGP bus, a south bridge, which connects a plurality of communication ports. The system memory mentioned above is compatible with a plurality of specifications.
Patent TW-I227533-B (TW)
Title: A detection method for metal contamination and micro-particles of a fabrication device
Inventor: YU WEN-GUANG
IPC: H01L21/66
Filed: 2003-04-14
Granted: 2005-02-01
Abstract: A detection method for metal contamination and micro-particles of a fabrication device is described. Providing a wafer and put it inside of a fabrication device. A process treatment is performed for the wafer the same as normal operation. Then, depositing a silicon material layer on the wafer, and determining the metal contamination and micro-particles on the wafer with an analytical instrument.
Patent TW-592898-B (TW)
Title: Third-point securing and clamping assembly for jig
Inventor: HUANG MU-YI
IPC: B25B11/00
Filed: 2003-04-25
Granted: 2004-06-21
Abstract: This invention provides a third-point securing and clamping assembly for a jig, including: a support provided with an open first receiving compartment, closed second and third receiving compartments, a push rod provided between the second and third receiving compartments, the first receiving compartment being in communication with the second and third receiving compartments via two passageways, the support being provided with two oil ports at opposing sides thereof, for charging oil into the jig through the oil ports alternatively so as to drive displacement of the push rod and the control whether communication is formed between the second and third receiving compartments, thereby adjusting the oil amount being charged into the first receiving compartment; a stopping device for sealing the first receiving compartment; a sliding device, having a slide rod inserting into the stopping device, the axial displacement of the sliding rod being controlled by the oil amount in the first receiving compartment thereby driving displacement of the slide device. Accordingly when two supports are provided in a symmetrical manner, the amount of oil to be charged may be controlled for driving the slide device, to provide a steady force to clamp a workpiece between the two supports.
Patent TW-I220092-B (TW)
Title: Image acquisition device providing wireless transmission function
Inventor: CHEN MICHAEL YEN-CHENG
IPC: H04L29/08
Filed: 2003-05-14
Granted: 2004-08-01
Abstract: An image acquisition device providing wireless transmission function comprises a scan unit, wireless scan operation unit, control unit and first wireless transmission unit. The scan unit is used to scan a document to be scanned and output a scanned image accordingly. The wireless scan operation unit is to be triggered, so as to output a signal for activating the wireless scan function. The control unit is used to receive the signal for activating the wireless scan function and control the scan unit to scan the document to be scanned. The first wireless transmission unit is used to receive the scanned image and transmit the scanned image wirelessly to the portable electronic device.
Patent TW-I220932-B (TW)
Title: Modular probe head
Inventor: JENG SHR-JIA
IPC: G01R31/26
Filed: 2003-05-22
Granted: 2004-09-11
Abstract: A modular probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having a probing surface and a mounting surface. A plurality of electrical vias in grid array are formed between the probing surface and the mounting surface, which have silica layers in the via laterals. The probing surface forms a plurality of contact elements. The mounting surface forms a plurality of connect terminals. The connect terminals are electrically connected to the contact elements by the electrical vias, so that the mounting surface of the probe head enables to be modularly mounted and electrically connected to an interface board of the probe card.
Patent TW-I224642-B (TW)
Title: Slab bridge
Inventor: TAKAGI MASAHIDE
IPC: E01D19/12
Filed: 2003-05-29
Granted: 2004-12-01
Abstract: The present invention provides a slab bridge that can be constructed by joining a plurality of square steel tubes, without using bolt joining, which includes welding, drilling and splice plates, which mainly cause destruction, and that can reduce labor for construction. The slab bridge is composed by arranging a plurality of square steel tubes 1, arranged in parallel with each other and in parallel with the axis of the bridge, and arranged adjacent to each other in a direction at a right angle relative to the axis of the bridge, providing openings 6 at the side surfaces of the square steel pipes 1, inserting bar-shaped members 7, such as a steel tube, a steel bar or a reinforcing bar, into the openings 6 to form a shear key which supports vertical load of the bridge, and integrating the square steel pipes 1 and the bar-shaped members 7 by filling a material which becomes hard over a period of time into the crossing portions thereof.
Patent TW-I228931-B (TW)
Title: Personal family digital video recorder system having program searching function and method of the same
Inventor: WENG SHIH-HSIUNG
IPC: H04N7/18
Filed: 2003-05-30
Granted: 2005-03-01
Abstract: The present invention is related to personal family digital video recorder system having program searching function and method of the same. The input receiving-module receives the searching manner and the searching content inputted by the user. The searching module searches the database of the remote program-providing terminal to find the program matching with the searching content based on the searching manner. The searched program name and the associated program content are shown through the display module. At last, the storage module stores the corresponding program name and the program content based on the selection of the user.
Patent TW-592864-B (TW)
Title: Laser repairing device and method
Inventor: OH SEOK-CHANG
IPC: G09F9/00
Filed: 2003-07-15
Granted: 2004-06-21
Abstract: The present invention provides a laser repairing device and method, which comprises: a laser oscillator for irradiating a laser beam on an electrode plate, a spotlight mechanism arranged between the laser oscillator and the electrode plate for concentrating the irradiating laser beam on one side of the electrode plate, an illuminating mechanism for illuminating visual light on the electrode plate, a splitter allowing the laser beam to pass through and reflecting the visual light reflected from the electrode plate, a total reflection mirror for totally reflecting the visual light reflected from the electrode plate, an observing mechanism for observing the electrode plate via the visual light reflected by the splitter or the total reflection mirror, and a switching mechanism for selectively placing the splitter or the total reflection mirror on an irradiating line of the laser beam. With such a structure, when the amount of light reflected from the splitter is insufficient for observing the image outputted to the observing mechanism, it can be easily switched to the total reflection mirror that is superior in reflectivity for easier observation of the electrode plate.
Patent TW-I242591-B (TW)
Title: Phenolic adhesives for bonding peroxide-cured elastomers
Inventor: MOWREY DOUGLAS H
IPC: C09J11/02
Filed: 2003-08-15
Granted: 2005-11-01
Abstract: What is disclosed are bonded articles of a peroxide cured elastomer and a substrate which an adhesive composition that exhibits substantial environmental resistance and rubber tearing bonds. The invention is also directed to adhesives consisting essentially of water, a phenol-aldehyde condensate, an etherified bis phenol aldehyde adduct and PVOH colloid protectant, optional polymeric film former, acid scavenger and precipitated silica. The present invention is further directed to a method of bonding peroxide-curable elastomers to metallic surfaces whereby the substrate is coated with the adhesive composition, drying the adhesive composition coating, applying a peroxide-cured elastomer to the adhesive composition coating, and curing the assembly with heat and/or pressure.
Patent TW-I295833-B (TW)
Title: Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom
Inventor: BRUNO GHYSELEN
IPC: H01L21/762
Filed: 2003-08-25
Granted: 2008-04-11
Abstract: Recycling a donor wafer after having taken at least one useful layer of material chosen from semiconductor materials, comprises removal of substance on side of wafer where taking-off took place. Substance is removed by mechanical means so that, after removal, at least part of buffer structure remains, this part capable of being reused as buffer structure during subsequent useful layer taking-off. Recycling a donor wafer (10) after having taken at least one useful layer of a material chosen from semiconductor materials, the donor wafer comprising successively a substrate (1), a buffer structure and, before taking-off, a useful layer, comprises removal of substance on the side of the donor wafer where the taking-off took place. The removal of substance comprises employing mechanical means so that, after removal of substance, at least part of the buffer structure remains, this at least part of the buffer structure capable of being reused as a buffer structure during a subsequent useful layer taking-off. Independent claims are also included for the following: (a) production of a donor wafer intended to provide a useful layer by taking-off and capable of being recycled after taking-off, comprising: formation of a first part of a buffer structure on a substrate; formation of a protective layer on the first part of the buffer structure, in a material chosen from crystalline materials; formation on the protective layer of the second part of the buffer structure, such that it has a lattice parameter in the vicinity of the protective layer the same as that of the first part of the buffer structure in the vicinity of the protective layer; (b) taking off a useful layer on a donor wafer to be transferred to a receiving substrate, comprising: bonding the donor wafer to the receiving substrate; detaching a useful layer bonded to the receiving substrate from the donor wafer; and recycling the donor wafer complying with the method of recycling; (c) application of the method of cyclically taking-off for producing a structure comprising the receiving substrate and the useful layer, the useful layer comprising at least one of the following materials: silicon-germanium (SiGe), strained Si, Ge, an alloy belonging to the IU-V family, the composition of which is respectively chosen from the possible (aluminum, gallium, indium)-(nitrogen-phosphorus-arsenic) (Al,Ga,In)-(N,P,As) combinations; and (d) a donor wafer having supplied a useful layer by taking-off and capable of being recycled complying with the method of recycling, comprising a substrate and a remaining part of the buffer structure.