baber/WOPTO huggingface dataset:
Patent TW-201808615-A (TW)
Title: Film structure and method for manufacturing same
Inventor: KIJIMA TAKESHI
IPC: B32B7/02
Filed: 2017-04-17
Abstract: A film structure, having: a substrate; a piezoelectric film which is formed on the substrate and which includes a first composite oxide represented by the composition formula Pb(Zr1-xTix)O3; and a piezoelectric film which is formed on the piezoelectric film and which includes a second composite oxide represented by the composition formula Pb(Zr1-yTiy)O3. x satisfies 0.10 < x ≤ 0.20, y satisfies 0.35 ≤ y ≤ 0.55, the piezoelectric film (14) has tensile stress, and the piezoelectric film (15) has compressive stress.
Patent TW-201839371-A (TW)
Title: Fluid sampling system and fluid sensing device thereof
Inventor: CIOU PU-DE
IPC: G01N21/17
Filed: 2017-04-19
Abstract: A fluid sensing device is provided, including a main body and a light sensing unit. The main body includes a housing and a rotary member. A chamber is formed in the housing. The rotary member is rotatably disposed in the housing, and the rotary member has at least one transparent portion. A fluid flows into the chamber to drive the rotary member rotating around a central axis. The light sensing unit includes a first and a second light transceiver modules disposed near the main body in an asymmetrical manner with respect to the central axis to transmit and receive the light passing through the translucent portion.
Patent TW-201805440-A (TW)
Title: High reliability lead-free solder alloy
Inventor: RIBAS MORGANA DE AVILA
IPC: C22C13/00
Filed: 2017-05-04
Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150 DEG C, for example up to 175 DEG C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn-Ag-Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderable material such as a copper ribbon.
Patent TW-201843599-A (TW)
Title: Grouped cloud smart home appliance monitoring system
Inventor: HWANG CHING-SHINE
IPC: G05B19/048
Filed: 2017-05-08
Abstract: The invention relates to a grouped cloud smart home appliance monitoring system. Primarily, a monitored end device and a smart terminal device are registered on a cloud service server. The registered data is uploaded to the cloud service server. A user utilizes the smart terminal device to execute Apps (applications) to link and login the cloud service server, and the registered data of the monitored end device is divided into different groups to be monitored. When the monitored end device is stolen and transported, a signal can't be transmitted to the cloud service server by the monitored end device normally, and the cloud service server will transmit the signal to the smart terminal device which is used to monitor the groups to issue a warning message to allow the user to learn that the monitored end device is stolen and transported. Moreover, when the monitored end device is combined with home appliances, it can further be used to remote control and set the home appliances to achieve the home automatic control through Internet of Things.
Patent TW-201809980-A (TW)
Title: Stylus pen and coordinate input device
Inventor: ODA YASUO
IPC: G06F3/0354
Filed: 2017-05-10
Abstract: The purpose of the present invention is to provide a stylus pen which may be used universally with a plurality of tablets which have differing waveforms of received and processed signals. Provided is a stylus pen, comprising: a signal emission circuit which receives a supply of a power source voltage from a power source unit, generates a first signal and a second signal which have different waveforms, and selectively supplies either the first signal or the second signal to a conductive core body-side member; an input acceptance unit which accepts a designation input which designates whether to supply the first signal or the second signal from the signal emission circuit to the core body-side member; and a control unit which controls the signal emission circuit to supply either the first signal or the second signal to the core body-side member, on the basis of the designation input which has been accepted by the input acceptance unit.
Patent TW-201817011-A (TW)
Title: Backside contact resistance reduction for semiconductor devices with metallization on both sides
Inventor: GLASS GLENN A
IPC: H01L21/8234
Filed: 2017-05-23
Abstract: Techniques are disclosed for backside contact resistance reduction for semiconductor devices with metallization on both sides (MOBS). In some embodiments, the techniques described herein provide methods to recover low contact resistance that would otherwise be present with making backside contacts, thereby reducing or eliminating parasitic external resistance that degrades transistor performance. In some embodiments, the techniques include adding an epitaxial deposition of very highly doped crystalline semiconductor material in backside contact trenches to provide enhanced ohmic contact properties. In some cases, a backside source/drain (S/D) etch-stop layer may be formed below the replacement S/D regions of the one or more transistors formed on the transfer wafer (during frontside processing), such that when backside contact trenches are being formed, the backside S/D etch-stop layer may help stop the backside contact etch process before consuming a portion or all of the S/D material. Other embodiments may be described and/or disclosed.
Patent TW-201804377-A (TW)
Title: Electronic device
Inventor: AZUMA YOSHIHIRO
IPC: G06K19/07
Filed: 2017-06-20
Abstract: This electronic device is provided with: a non-contact IC reading unit 5 which is configured integrally with a casing and which reads a non-contact IC card, and an adjacent structure 31 which is adjacent to the non-contact IC reading unit 5 and contains a metal component. The non-contact IC reading unit 5 comprises an antenna 51 which generates lines of magnetic force, an antenna substrate 52 in which the antenna 51 is mounted, and a magnetic shield member 53 which is arranged on the side of the antenna substrate 52 where the lines of magnetic force are to be blocked. The adjacent structure 31 and the antenna substrate 52 are adjacent in an adjacency direction D5, and with respect to the antenna 51, the magnetic shield member 53 is arranged unevenly towards the adjacent structure 31 in the adjacency direction D5.
Patent TW-201804776-A (TW)
Title: Compatible channel bonding service management
Inventor: WALKER GORDON KENT
IPC: H04L29/08
Filed: 2017-07-10
Abstract: A method is described for defining service metadata for multiple RF channel services with no impact to the currently defined service metadata for single tuner receiving devices. One example may include receiving first service layer metadata from a first communication channel and second service layer metadata from a second communication channel; and determining a plurality of services available from the first and second communication channels based on the first and second service layer metadata, wherein at least one of the plurality of services is a multiple channel service that comprises data in a pooled set of the first and second communication channels, wherein the multiple channel service is identified by matching a first service from the first service layer metadata and a second service from the second service layer metadata to identify the at least one of the plurality of service in the pooled set.
Patent TW-201911471-A (TW)
Title: Semiconductor structures and methods for fabricating the same
Inventor: KAO CHIH-MING
IPC: H01L21/763
Filed: 2017-07-26
Abstract: A method of fabricating a semiconductor structure includes providing a semiconductor substate, forming a trench in the semiconductor substate, filling the trench with a first semiconductor material which has no dopant, forming a second semiconductor material on the first semiconductor material, wherein the second semiconductor material has a dopant, and performing a heat treatment so that the dopant in the second semiconductor material is diffused into the first semiconductor material to form a doped third semiconductor material in the trench.
Patent TW-201911998-A (TW)
Inventor: LAI KUN-HUI
IPC: H05K7/14
Filed: 2017-07-31
Abstract: A lockable door module includes a casing and a door main body. The casing includes a casing seal flange and a casing fixation flange. The door main body is attached to the casing fixation flange of the casing and is in close contact with the casing seal flange. In addition, the casing fixation flange includes a fixation surface having an inclination angle so as to increase the seal tightness of the door main body and the casing.
Patent TW-201811896-A (TW)
Title: Flame retardant resin composition, insulated wire, metal cable, optical fiber cable and molded article using the same
Inventor: TAIRA SEIICHI
IPC: H01B7/29
Filed: 2017-08-10
Abstract: Disclosed is a flame-retardant resin composition which contains: a base resin configured from polyethylene and an acid-modified polyolefin; calcium carbonate; aluminum hydroxide; a silicone compound; and a fatty acid-containing compound. Therein: the polyethylene density is more than 912.4 kg/m3 and less than 940.0 kg/m3; the polyethylene content in the base resin constitutes 75-99 mass%, inclusive; the acid-modified polyolefin content in the base resin constitutes 1-25 mass%, inclusive; the calcium carbonate is formulated in a proportion constituting 5-130 parts by mass, inclusive, relative to 100 parts by mass of the base resin; the aluminum hydroxide is formulated in a proportion constituting 5-150 parts by mass, inclusive, relative to 100 parts by mass of the base resin; the silicone compound is formulated in a proportion constituting 1.5-10 parts by mass, inclusive, relative to 100 parts by mass of the base resin; and the fatty acid-containing compound is formulated in a proportion constituting 5-20 parts by mass, inclusive, relative to 100 parts by mass of the base resin.
Patent TW-201913552-A (TW)
Title: Automatic classification and dispatching system and automatic classification and dispatching method
Inventor: CHEN WEN-CHI
IPC: G06Q50/28
Filed: 2017-08-21
Abstract: The instant disclosure provides an automatic classification and dispatching system and an automatic classification and dispatching method. The system includes an equipment automatic program unit, a warehouse management unit, an automatic dispatching unit, an equipment control unit and an automatic transporting unit. The warehouse management unit is used for providing a classification information and the automatic dispatching unit is used for providing a dispatching information. The equipment automatic program unit is used for transferring information between the warehouse management unit, automatic dispatching unit and the equipment control unit, and the automatic transporting unit is controlled by the equipment control unit for executing at least one of the classification information and the dispatching information. The system provided by the instant disclosure can increase the efficiency of the classification, the storage and the shipment of the products with complicated species and reduce the labor cost.
Patent TW-201743459-A (TW)
Title: Photodiode array
Inventor: YAMAMOTO KOEI
IPC: H01L31/109
Filed: 2013-10-17
Abstract: The objective is to provide a photodiode array having high temporal resolution. A light-receiving region contains a plurality of light detection units (10), and each light detection unit (10) is provided with: a first semiconductor region (12) of a first conductivity type; a second semiconductor region (13, 14) of a second conductivity type configuring a p-n junction with the first semiconductor region (12); a first contact electrode (3A) that contacts the second semiconductor region; a second contact electrode (4A) that is provided with a material differing from that of the first contact electrode (3A), is disposed at a position overlapping the first contact electrode (3A), and contacts the first contact electrode; and a resistor layer (4B) that is contiguous with the second contact electrode (4A).
Patent TW-201915738-A (TW)
Title: Data management method for memory and memory apparatus
Inventor: LI YUNG-CHUN
IPC: G06F12/08
Filed: 2017-09-15
Abstract: A data management method for memory and a memory apparatus are provided. The memory includes a number of memory pages. Each of the memory pages includes multiple memory cells. Each of the memory cells includes a first bit and a second bit. Each of the memory cells has a first logical state, a second logical state, a third logical state, and a fourth logical state. The data management method for memory includes the following steps. A data update command corresponding to a logical address is received. The logical address corresponds to a physical address before receiving the data update command. A sanitizing voltage is applied to a target memory cell of the memory page located at the physical address. The logical state of the target memory cell of the memory page is changed.
Patent TW-201819175-A (TW)
Title: Dicing die bonding tape and fabrication method of semiconductor device capable of dividing an adhesive layer with high precision
Inventor: KIMURA YUTA
IPC: B32B7/12
Filed: 2017-09-27
Abstract: The purpose of the present invention is to provide a dicing die bonding tape capable of dividing an adhesive layer with high precision. The present invention relates to a dicing die-bonding tape comprising: an isolation film and a film including an adhesive layer and a substrate layer. The adhesive layer is located between the isolation film and the substrate layer. Two surfaces of the substrate layer are defined as a first main surface contacting the adhesive layer and a second main surface. In the wafer-fixing region of the film, the 90 degree peeling force at 23 DEG C between the adhesive layer and the substrate layer is 0.02 N/20 mm to 0.5 N/20 mm. In the wafer-fixing region, the 90 degree peeling force at -15 DEG C between the adhesive layer and the substrate layer is 0.1 N/20 mm or more. In the wafer-fixing region, the surface free energy of the first main surface of the substrate layer is 32 to 39 mN/m.
Patent TW-201823351-A (TW)
Title: Composition containing fluorinated polymer, and method for producing substrate having fluorinated polymer film coated thereon
Inventor: TSUJI TAMAMI
IPC: C08K5/05
Filed: 2017-10-03
Abstract: Provided are: a composition which contains a fluorinated polymer having an aliphatic ring and can be formed into a film having excellent in-plane uniformity and small surface roughness with an electrospraying device; and a method for producing a substrate having a film coated thereon by using the composition. A composition comprising a fluorinated polymer having an aliphatic ring and a solvent, said composition being characterized in that the solvent comprises at least one high-boiling-point solvent having a boiling point of 150 DEG C or higher and the specific dielectric constant of the solvent is 5 or more. A method for producing a substrate having a film coated thereon, comprising applying the composition onto a substrate with an electrospraying device to form a film containing the fluorinated polymer.
Patent TW-201829599-A (TW)
Title: Composite resin material and molded article
Inventor: YAMAMOTO HIROKAZU
IPC: H01B5/16
Filed: 2017-10-06
Abstract: Provided is a composite resin material that gives a resin molded article that has a low volume resistivity, is resistant to an increase in volume resistivity even when subjected to, for instance, a cleaning treatment using ozonated water, and has an excellent electrical conductivity and/or an excellent antistatic performance. The composite resin material contains polychlorotrifluoroethylene and carbon nanotubes and has an average particle diameter of not more than 500 [mu]m.
Patent TW-201816400-A (TW)
Title: Probe card module
Inventor: LAI HUNG-WEI
IPC: G01R1/06
Filed: 2017-10-13
Abstract: This disclosure provides a probe card module, which includes: a first driving unit with a first output terminal connected to a first resistor; a second driving unit with a second output terminal connected to a second resistor; an amplifier unit with a non-inverting input terminal connected to the first resistor and the second resistor, an inverting input terminal, and a third output terminal connected to the inverting input terminal; and a conductive probe connected to the third output terminal of the amplifier unit.
Patent TW-201825574-A (TW)
Title: Masterbatch
Inventor: MURAKAMI SHINYA
IPC: C08L21/00
Filed: 2017-10-19
Abstract: Kneading workability and mechanical property of a rubber product are improved by a masterbatch comprising a sulfide compound (A) and silica (B), wherein the sulfide compound (A) is a compound represented by formula (I): [In formula (I), D represents an oxygen atom or a direct bond, and x represents 3 or 4.] wherein the silica (B) satisfies following conditions that: BET specific surface area is 0.1 to 50 m2/g and DBP oil absorption is 150 to 200 ml/100g.
Patent TW-201916276-A (TW)
Title: Semiconductor package and manufacturing method thereof
Inventor: HSU CHING-MING
IPC: H01L23/31
Filed: 2017-10-25
Abstract: A semiconductor package including a first semiconductor chip, a plurality of first conductors, a first conductive pattern electrically connected to the first conductors, a second semiconductor chip disposed on the first semiconductor chip, and an encapsulant on the first conductive pattern and laterally encapsulating the second semiconductor chip. The first semiconductor chip electrically connected to the first conductors includes a sensing area on a first active surface, a first back surface and a plurality of through holes extending form the first back surface towards the first active surface. The second semiconductor chip including a second active surface facing towards the first back surface electrically connects the first semiconductor chip through the first conductors in the through holes and the first conductive pattern on the first back surface. A manufacturing method of a semiconductor package is also provided.
Patent TW-201821514-A (TW)
Title: Protective film, polarizer and display device comprising same
Inventor: HEO YOUNG-MIN
IPC: C08L27/08
Filed: 2017-10-27
Abstract: The present invention relates to a protective film, a polarizer, and a display device comprising the same. The protective film for a polarizing plate according to the present invention comprises a mixed resin obtained by blending a fluorine-based resin and an acrylic resin at a certain ratio, which not only improves breakage (i.e., processability) in the preparation of a sheet and a film due to an improved elongation, but also generates no mura due to a low in-plane retardation (Ro) and a low thickness direction retardation in (Rth).
Patent TW-201830012-A (TW)
Title: Arrays of acoustic transducers for physical analysis of batteries
Inventor: HSIEH ANDREW GAHEEM
IPC: G01R31/36
Filed: 2017-11-02
Abstract: Systems and methods for analyzing physical characteristics of a battery include arrangements of two or more transducers coupled to the battery. A control module controls one or more of the two or more transducers to transmit acoustic signals through at least a portion of the battery, and one or more of the two or more transducers to receive response acoustic signals. Distribution of physical properties of the battery is determined based at least on the transmitted acoustic signals and the response acoustic signals.
Patent TW-201820456-A (TW)
Title: In-situ hydroxylation apparatus
Inventor: CHOI KENRIC
IPC: H01L21/306
Filed: 2012-02-01
Abstract: Described are apparatuses and methods for the hydroxylation of a substrate surface using ammonia and water vapor.
Patent TW-201927513-A (TW)
Title: Feeding device and injection molding equipment having the same, and method of feeding liquid material to an injection molding machine
Inventor: SUNG CHENG-YU
IPC: B29C45/18
Filed: 2017-12-25
Abstract: A feeding device includes a material storage mechanism, and a driving mechanism. The material storage mechanism includes a carrying assembly, a storage container is detachably assembled positioning in the carrying assembly, and a piston. The storage container is disposable and formed with a storage space, and a through hole communicating with the storage space. The storage space is used for containing a liquid material. The piston is movably disposed in the storage space. The driving mechanism is used for pushing the piston to move toward the through hole so that the piston extrudes the liquid material through the through hole. Thus, cleaning time and cost can be saved, and can provide the mixed uniform liquid material to an injection molding machine.
Patent TW-201926537-A (TW)
Title: Lift pin unit and unit for supporting substrate for preventing vibration during vacuuming processing chamber
Inventor: PARK JONG-BUM
IPC: H01L21/02
Filed: 2017-12-25
Abstract: The present invention provides a substrate support unit for supporting a substrate. According to one embodiment of the present invention, the substrate support unit comprises: a carrying device for supporting the substrate, which is formed with pin holes along the vertical direction; lift pins capable of moving up and down along the pin holes; a supporting portion for supporting the lift pins; and a driving portion capable of causing the supporting portion to move along the vertical direction; wherein, the lift pins are provided with air discharge channels for exhausting the air inside the pin holes to the outside.
Patent TW-201831254-A (TW)
Title: Laser processing device capable of maintaining a processing direction and a dispersion direction of a laser beam in a predetermined relationship by a polygon mirror even with a simple configuration
Inventor: NOMARU KEIJI
IPC: B23K26/08
Filed: 2018-01-10
Abstract: The subject of this invention is to provide a laser processing device which can maintain a processing direction and a dispersion direction of a laser beam in a predetermined relationship by a polygon mirror even with a simple configuration. A laser processing device (2) provided according to this invention at least comprises a holding means (6) for holding the workpiece; a laser beam irradiation means (24) for irradiating the laser beam to the workpiece (wafer 10) held by the holding means (6); a X direction moving means for processingly feeding the holding means (6) and the laser beam irradiation means (24) relatively along the X direction; and a Y direction moving means for processingly feeding the holding means (6) and the laser beam irradiation means (24) relatively along the Y direction orthogonal to the X direction. The laser beam irradiation means (24) at least comprises a laser oscillator (242) for oscillating the laser beam; a polygon mirror (245) for dispersively scanning the laser beam oscillated by the laser oscillator (242) from a specified dispersion angle along the X direction; a condenser (241) for condensing the laser beam scanned along the X direction to the workpiece (wafer 10) held by the holding means (6); and an inverter (246) disposed between the polygon mirror (245) and the condenser (241) for inverting the scanning direction of the laser beam.