baber/WOPTO huggingface dataset:
Patent TW-201503789-A (TW)
Title: Method for manufacturing component-embedded wiring board and semiconductor device
Inventor: NAKAMURA SHIGEO
IPC: H05K3/46
Filed: 2014-01-21
Abstract: Provided is a method of manufacturing a component embedded wiring board, capable of realizing a high accuracy of component alignment by preventing a board from bending while restricting a position variation (dislocation) of the components. The method of manufacturing a component embedded wiring board includes the following processes (A), (B), (C) and (D) in sequence: (A) vacuum laminating a first bonding film including a first supporting member on an inner layer substrate, on which a component is temporarily adhered, including an inner layer substrate having a first surface, a second surface and a cavity formed through the first surface and the second surface, a temporary adhesion material bonded to the second surface of the inner surface substrate and the component temporarily adhered by the temporary adhesion material in the cavity of the inner layer substrate, and a first thermal curable composition layer bonded to the first supporting member in such a manner that the first thermal curable composition layer is bonded to the first surface of the inner layer substrate; (B) applying heat to the first thermal curable resin composition so that the component is not displaced in the subsequent process (C), in which the heating process is performed in a range sufficient for preventing the substrate from being bent; (C) vacuum laminating a second bonding film including a second supporting member and a second curable resin composition bonded to the second supporting member in such a manner that the second curable resin composition layer is bonded to the second surface of the inner layer substrate after the temporary material is delaminated from the second surface of the inner layer substrate; and (D) forming an insulation layer by thermally curing the first thermal curable resin composition layer and the second thermal curable resin composition layer.
Patent TW-201441116-A (TW)
Title: Bottle with insulative body
Inventor: KISELA DAVID
IPC: B65D1/02
Filed: 2014-02-05
Abstract: A bottle (120, 220, 320, 420) includes a base (122), a neck (128), and a body (124) extending axially between the base and the neck, and including at least one radially outwardly facing first surface (134a, 134b), a radially outwardly facing second surface (146, 346, 446) radially smaller than the first surface, a radially outwardly facing third surface (150, 250, 350, 450) radially larger than the second surface and established collectively by radially outwardly facing projection surfaces (154, 254, 354, 454) of a plurality of projections (152, 252, 352, 452) that project radially outwardly from the third surface. A label (160) may be carried by the body over at least a portion of the third surface. Axial and circumferential space may be established between the label and the second surface.
Patent TW-201501305-A (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: NOBUTO HIDEKAZU
IPC: H01L21/28
Filed: 2014-02-07
Abstract: This invention provides a semiconductor device capable of forming a barrier metal into a thin film, assuring adhesion between the barrier metal and a metal electrode, and enabling control and management of a film thickness of the barrier metal as the thin film. The semiconductor device includes an active region on a semiconductor substrate, a trench formed in the active region and having a lower part and an upper part, a gate insulating film covering an inner wall surface of the trench, a first barrier metal covering the lower part of the trench via the gate insulating film, a second barrier metal covering the first barrier metal, a metal electrode covering the second barrier metal and filling the lower part of the trench, and a cap insulating film filling the upper part of the trench. The second barrier metal has a thickness smaller than that of the first barrier metal.
Patent TW-201532206-A (TW)
Title: Semiconductor package and method thereof
Inventor: CHOU SHIH-WEN
IPC: H01L23/12
Filed: 2014-02-14
Abstract: A semiconductor package and manufacturing method thereof are disclosed. The semiconductor package includes a package carrier, a chip, a film, a first shielding metal plate and an encapsulating material. The package carrier has at least one conductive component. The chip has an active surface and a corresponding back surface. The back surface of the chip is attached to the package carrier. At least one contact point is disposed on the active surface, and electrically coupled to the conductive component by a wire. The film is disposed on the active surface and covers a portion of the wire. The first shielding metal plate is disposed on the film. The encapsulating material covers the chip, the wire, at least portion of the package carrier, the film and at least portion of the first shielding metal plate.
Patent TW-201443251-A (TW)
Title: Copper alloy sputtering target
Inventor: OTSUKI TOMIO
IPC: C22C9/01
Filed: 2014-03-04
Abstract: A copper alloy sputtering target having a chemical composition comprising 1.0 to 5.0 at% of Mn, 0.1 to 4.0 at% of Al and a remainder made up by Cu and unavoidable impurities, said copper alloy sputtering target being characterized in that the distribution of the chemical composition in the surface of the sputtering target is 20% or less. The present invention addresses the problem of providing: a material for a wiring in a semiconductor element, particularly a copper alloy sputtering target which does not undergo aggregation during cupper electroplating, enables the formation of a stable and uniform seed layer, and has excellent sputtering film formation properties; and a semiconductor element wiring which is formed using the target.
Patent TW-201501648-A (TW)
Title: Powder emulsifying agent composition and method for producing same
Inventor: TAKATOYA HARUKI
IPC: A23L29/10
Filed: 2014-03-17
Abstract: Provided are: a powder emulsifying agent composition which has improved dispersibility and is capable of providing food with excellent texture; and a production method by which this powder emulsifying agent composition can be obtained easily. An emulsifying agent composition that contains (A) a saccharide, (B) a glycerol fatty acid monoester and (C) a lecithin, in which the phospholipid content is 90% by mass or more and the total content of phosphatidic acid and a hydrogenated product thereof is 5-30% by mass, is used. This emulsifying agent composition is obtained by spray drying an aqueous dispersion that contains the components (A)-(C).
Patent TW-201448067-A (TW)
Title: Mounting method and mounting device
Inventor: TERADA KATSUMI
IPC: H01L21/58
Filed: 2014-03-27
Abstract: The purpose of the present invention is to mount and fully pressure-bond chip components with high-speed and high-accuracy onto a plurality of circuit patterns formed on a circuit board. Specifically, in a process of mounting a chip component onto a wafer (W) with a plurality of bonding heads (21a, 21b), a chip component is preliminarily mounted on a prescribed location on a wafer (W), and then fully pressure-bonded while being heated for a predetermined time. While the chip component is being mounted and fully pressure-bonded on the wafer (W) with either one of the bonding heads (21a, 21b), the other bonding head together with a heater embedded therein is cooled down to a prescribed temperature. When the preliminary mounting of the chip component using the bonding head is completed, the chip component is mounted at a prescribed location of the wafer (W) by the other bonding head, and then fully pressure-bonded while being heated for predetermined time.
Patent TW-201511190-A (TW)
Title: Integrated circuit package assemblies including a glass solder mask layer
Inventor: HU CHUAN
IPC: H01L23/12
Filed: 2014-04-01
Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for integrated circuit package assemblies including a glass solder mask layer and/or bridge. In one embodiment, an apparatus includes one or more build-up layers having electrical routing features and a solder mask layer composed of a glass material, the solder mask layer being coupled with the one or more build-up layers and having openings disposed in the solder mask layer to allow coupling of package-level interconnect structures with the electrical routing features through the one or more openings. Other embodiments may be described and/or claimed.
Patent TW-201510642-A (TW)
Title: Photosensitive resin composition and electronic device
Inventor: IKEDA HARUO
IPC: G03F7/004
Filed: 2014-04-03
Abstract: The present invention provides a photosensitive resin composition exhibiting an excellent balance between chemical resistance and other characteristics demanded for a photosensitive resin composition, and an electronic device having the photosensitive resin composition. The photosensitive resin composition of the present invention comprises a polymer (first polymer) expressed by formula (1) shown below, a first crosslinking agent that crosslinks with the polymer, an acrylic resin as a second crosslinking agent having a reactive group that crosslinks with the polymer or the first crosslinking agent, and a photosensitizer. In formula (1), l and m represent molar content rates in the polymer, l+m=1, and n is 0, 1 or 2; R1, R2, R3 and R4 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms, and A is a structural unit represented by the below formula (2a), (2b), (2c) or (2d). (In formulae (2a) and (2b), R5, R6 and R7 each independently represent an organic group having 1 to 18 carbon atoms)
Patent TW-201500603-A (TW)
Title: Silicon epitaxial wafer and method for manufacturing silicon epitaxial wafer
Inventor: SAKURADA MASAHIRO
IPC: C30B15/04
Filed: 2014-04-07
Abstract: The present invention is a silicon epitaxial wafer having a second intermediate epitaxial layer (22) and a dopant-doped first intermediate epitaxial layer (21) on a silicon substrate (10) manufactured by cutting out a silicon single-crystal rod grown by a CZ process so as to have a carbon concentration of 3×10<SP>16</SP> to 2×10<SP>17</SP> atoms/cm<SP>3</SP>, an epitaxial layer (30) which is a region in which an element is formed being layered on the first intermediate epitaxial layer (21), and a method for manufacturing the silicon epitaxial wafer. There are thereby provided an industrially exceptional silicon epitaxial wafer used for a semiconductor device substrate such as a memory, a logic, or a solid-state image-capturing element, the silicon epitaxial wafer having a carbon-doped silicon substrate as a material, and a method for manufacturing the silicon epitaxial wafer.
Patent TW-201505808-A (TW)
Title: High throughput die for polyamide strand synthesis
Inventor: KELMAN CHARLES R
IPC: B29C48/05
Filed: 2014-04-10
Abstract: The application relates to an improved polyamide strand formation unit that includes an improved strand die, as well as to methods of using such an improved polyamide strand formation unit.
Patent TW-201507392-A (TW)
Title: Method and apparatus for time-based fast ACK/NACK response operation with enhanced general packet radio service 2 uplink
Inventor: AGHILI BEHROUZ
IPC: H04L1/16
Filed: 2008-09-30
Abstract: A method and apparatus for time-based fast positive acknowledgement (ACK)/negative acknowledgement (NACK) reporting (FANR) operation with enhanced general packet radio service 2 uplink (HUGE) are disclosed. A wireless transmit/receive unit (WTRU) configures downlink FANR operation and EGPRS-2 mode uplink transmission not to be in conflict. A modulation and coding scheme (MCS) for the EGPRS-2 mode may be limited to an MCS containing at most two RLC data blocks. Alternatively, three or more piggybacked ACK/NACK (PAN) bits may be used for a time-based FANR operation if an EGPRS-2 mode is configured. Alternatively, at least one PAN bit may indicate an ACK/NACK for a group of RLC data blocks. The number of PAN bits for a time-based FANR operation may be configured by the network. The downlink FANR operation may be dynamically switched between time-based and SSN-based.
Patent TW-201543013-A (TW)
Title: Temperature detecting device and temperature detecting panel thereof
Inventor: HSIEH HAO-CHUN
IPC: H05K3/34
Filed: 2014-05-06
Abstract: The present invention relates to a temperature detecting device and a temperature detecting panel thereof. The temperature detecting panel is adapted to be received in a reflow oven for detecting the oven temperature. The temperature detecting panel includes a modularized board and a thermal compensation unit. The modularized board has a plurality of board units that are assembled together. The compensation unit has at least a detected member that is fixed on a selected position of the modularized board. Each board unit has at least a first fixing structure and a second fixing structure that is securely engageable with the first fixing structure of another board unit. The number of the board units used to form the modularized board depends on a desired shape and dimensions of the modularized board. The modularized board can simulate various types of PCBs for temperature detection.
Patent TW-201542393-A (TW)
Title: Calendar arrangement and application thereof
Inventor: QIU YING-XUAN
IPC: B42D5/06
Filed: 2014-05-14
Abstract: This invention relates to a calendar arrangement and application thereof, which comprises a hanging structure and a plurality of pages of calendar paper, its main feature is that the hanging structure has a fixing part; and the calendar paper comprises a date unit, an information unit, and an attachment unit, wherein the attachment unit is provided for attaching the documents which can be drawn out away..
Patent TW-201448248-A (TW)
Title: Solar equipment
Inventor: HUANG SU CHANG
IPC: H01L31/052
Filed: 2014-05-20
Abstract: It is a kind of Solar equipment, by using the irradiation of the reflected light and refracted light energy for achieving doubling the light-receiving surface area without increasing the own settled land area to convert from solar energy into electrical energy increasing a significant solar power capacity.
Patent TW-201510503-A (TW)
Title: Method for the off-line determination of intrinsic reactivity of reactants in polycondensation reactions
Inventor: SEOANE CARLOS GODINEZ
IPC: G01N21/35
Filed: 2014-05-22
Abstract: Disclosed herein are methods and systems for determining intrinsic reactivity of polycondensation reactants using near infrared spectroscopy and high throughput screening. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
Patent TW-201511858-A (TW)
Title: Rolling mill laying head
Inventor: WOJTKOWSKI JR
IPC: B21C47/14
Filed: 2014-06-17
Abstract: Aspects of the present invention relate to a rolling mill laying head. The rolling mill laying head comprises a quill rotatable about a central axis, said quill being equipped with a guide pathway configured and arranged to form a longitudinally moving product into a continuous series of rings; a stationary support structure; and axially spaced radial bearings supporting said quill for rotation about said axis, one of said bearings comprising a hydrostatic oil film bearing having an internal diameter of at least about 500 mm, and having a L/D ratio less than 0.25.
Patent TW-201601143-A (TW)
Title: A multiple concentric circle sound-absorbing system and its adjustment method
Inventor: CHIU MIN-CHIE
IPC: G10K11/16
Filed: 2014-06-19
Abstract: The present invention discloses a multiple concentric circle sound-absorbing system and its adjustment method. Based on a theoretical acoustic model, a four-pole transfer matrix is deduced. The design parameters of concentrically circular perforated tubes, sound-absorbing material and channels are also investigated. Various optimization algorithms linked to the proposed mathematical model are adopted in finding optimally shaped concentric circle sound-absorbing system. Thus, the presented noise suppression system is able to achieve a compact shape with higher acoustical performance.
Patent TW-201600466-A (TW)
Title: Light shielding material, light shielding structure and fabrication method thereof
Inventor: LU HORNG-HWA
IPC: C01B32/949
Filed: 2014-06-24
Abstract: A light shielding material, light shielding structure and fabrication method thereof is provided. The light shielding structure includes a transparent substrate and a thin film. The thin film is coated on the transparent substrate, and having a plurality of dispersions. The dispersions are the complex of carbon-doped tungsten oxide as shown of chemical structure formula (I): MxWCyOz of formula (I). Wherein M is a dopant, the dopant includes at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0 < x ≤ 1,0 < y ≤ 1,0 < z ≤ 3. By the light shielding structure, a plurality of dispersions can be distributed in the thin film, and thus has a good transparency to visible light, and shielding infrared light.
Patent TW-201604903-A (TW)
Title: Integrated transformer
Inventor: YEN HSIAO-TSUNG
IPC: H01F19/00
Filed: 2014-07-17
Abstract: An integrated transformer includes a primary inductor and a secondary inductor. The primary inductor includes an B turns spiral wiring formed by a first metal layer and a A turns wiring formed by a second metal layer, where the A turns wiring formed by the second metal layer is stacked on most inner A turns of the B turns spiral wiring formed by the first metal layer. The secondary inductor includes a C turns wiring formed by the second metal layer, where the K turns wiring formed by the second metal layer is stacked on a portion of the B turns spiral wiring formed by the first metal layer of the primary inductor, where A is not greater than B, and A is not greater than C.
Patent TW-201511286-A (TW)
Title: Field-effect transistor and method for producing field-effect transistor
Inventor: MATSUMOTO SHINJI
IPC: H01L21/28
Filed: 2014-07-29
Abstract: To provide a field-effect transistor, containing: a gate electrode configured to apply gate voltage; a source electrode and a drain electrode, both of which are configured to take out electric current; an active layer formed of a n-type oxide semiconductor, provided in contact with the source electrode and the drain electrode; and a gate insulating layer provided between the gate electrode and the active layer, wherein work function of the source electrode and drain electrode is 4.90eV or greater, and wherein an electron carrier density of the n-type oxide semiconductor is 4.0 x 10<SP>17</SP>cm-3 or greater.
Patent TW-201608410-A (TW)
Title: A wireless process system and method for the file encrypt/decrypt
Inventor: LIN MING-LING
IPC: G06F21/60
Filed: 2014-08-21
Abstract: A wireless process system and method for the file encrypt/decrypt, the system comprises of a first computer, a second computer and a wireless device. The wireless device connects to the first computer and the second computer in turns. The wireless device sends the live information and the identification information to the said computers. And the wireless device receives the confirm information from the said computers. After the first period, the first computer does not connect to the wireless device and the first computer encrypts the first data and sends the alarm. After the first period, the second computer does not connect to the wireless device and the second computer encrypts the second data and sends the alarm.
Patent TW-201523602-A (TW)
Title: Semiconductor memory device
Inventor: SHIMIZU NAOKI
IPC: G11C11/16
Filed: 2014-09-04
Abstract: A semiconductor memory device is capable of executing a first mode having a first latency and a second mode having a second latency longer than the first latency. The semiconductor memory device includes: a pad unit configured to receive an address and a command from an outside; a first delay circuit configured to delay the address by a time corresponding to the first latency; a second delay circuit including shift registers connected in series and configured to delay the address by a time corresponding to a difference between the first latency and the second latency; and a controller configured to use the first delay circuit and the second delay circuit when executing the second mode.
Patent TW-201528885-A (TW)
Title: Substrate for organic electronic device
Inventor: KIM JI-HEE
IPC: H05K1/03
Filed: 2014-09-30
Abstract: Provided are a substrate for an OED and a use thereof. The substrate may be applied to manufacture a flexible device exhibiting a suitable haze to have an excellent physical property such as transmittance, and also have excellent physical properties such as surface smoothness and refractive index when needed.
Patent TW-201519267-A (TW)
Title: Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device
Inventor: Masuda shotaro
IPC: H05K1/03
Filed: 2014-10-01
Abstract: This soft magnetic particle powder is a soft magnetic particle powder comprising flat soft magnetic particles, wherein kurtosis of the soft magnetic particles exceeds -0.35.
Patent TW-201617245-A (TW)
Title: Rearview mirror structure
Inventor: CHIEN LIANG-YI
IPC: B60R1/04
Filed: 2014-11-14
Abstract: A rearview mirror structure includes a first housing which has a first housing inner side with a plurality of first buckling members; a second housing having a shape corresponding to the first housing and having a second housing inner side with a plurality of second buckling members corresponding to the first buckling members in a way that when the first buckling members and the second buckling members are buckled together, the first housing and the second housing are combined by covering; a plurality of supporting members, each having a groove facing the second housing and being fixed to an area of the first housing inner side whose perimeter has no first buckling members installed thereon, and being perpendicular to the first housing; and a plurality of soft pads installed on the grooves of the supporting members. When the first housing and the second housing are combined by covering, the supporting members directly contact a lens through the soft pads, also, the thicknesses of the soft pads are reduced due to squeezing.
Patent TW-201519940-A (TW)
Title: Punching training device
Inventor: CHEN YI-LIN
IPC: A63B69/34
Filed: 2014-11-28
Abstract: A punching training device of the present invention includes a base, a barrel, and a punching member. The base includes an upper shell and a lower shell made of soft material. The base is formed with a cavity and defines a vertical central axis wherein the cavity is located at the central axis. The lower shell has a convex chambered face at the bottom thereof. The upper shell has a connecting portion at the top thereof. The barrel has a shape corresponding to the cavity and is received in the cavity. The punching member is disposed on the connecting portion and extends upward.
Patent TW-201539781-A (TW)
Title: A method and structure of promoting positive efficiency aging and stablization of quantum dot light-emitting diode
Inventor: YANG YIXING
IPC: H01L33/04
Filed: 2014-12-11
Abstract: A method for synthesizing a quantum dot light emitting diode by providing a glass substrate. A QD-LED stack is formed upon the glass substrate. This QD-LED stack is diffused with an active reagent. The QD-LED stack is encapsulated with a curable resin. The curable resin is cured with UV light.