Patent DE-102008048459-A1 (DE)
Title: Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
Inventor: PUTSCH PETER
IPC: H05K7/02
Filed: 2008-09-23
Abstract: Producing conductive structures on the surface of no or only slightly conductive polymer molded bodies, comprises: (a) providing a polymer molded body from at least one polymer phase containing carbon nanotubes; and (b) thermally treating at least one surface of the polymer molded body to produce the conductive structures on the surface of the polymer molded body, where the thermal treatment comprises heating at a temperature, which corresponds to at least the melting temperature of at least one polymer phase. Independent claims are included for: (1) the polymer molded body with conductive structures on the surface, produced by the above process, preferably comprising at least one polymer phase with carbon nanotubes, where the polymer molded body exhibits electrically or thermally conductive structure on the surface and the concentration of carbon nanotubes in the area of the electrically conductive surface structure is higher than in the non-electrically conductive surface area, and the non-electrically conductive surface area contains carbon nanotubes; (2) a printed circuit board-arrangement comprising at least one printed circuit board, which is preferably a polymer molded body, with at least one electrically conductive trace pitch, where the printed circuit board contains the polymer molded body with 0.1-10 wt.% of carbon nanotubes, relative to the mass of the polymer phase, and at least one electrically conductive trace pitch comprises a metal layer, preferably a copper layer, and/or at least one electronic component, which is bonded by an organic adhesive composition comprising 0.05-10 wt.% of carbon nanotubes, relative to the mass of the adhesive composition, and/or by a bond comprising the carbon nanotubes containing material, preferably one or more carbon nanotubes containing polymer phases, and/or by a solder connection with at least one electrically conductive trace pitch of the printed circuit board; (3) a process for producing the printed circuit board arrangement, comprising the steps (a) and (b), (c) galvanizing the electrically conductive structure with a metal, preferably copper, and/or (d) providing at least one electronic component, and (e) connecting, preferably thermally and/or electrically conductive connections, the electronic component having at least one electrically conductive trace pitch or at least an electrically conductive area using the adhesive composition, by producing a bond and/or by a solder connection; (4) use of an adhesive composition comprising carbon nanotubes for electrically conductive connecting of an electronic component with another electrically conductive component or molded part, preferably an electrically conductive trace pitch or an electrically conductive area on a trace pitch; and (5) use of a device for producing conductive structures on the surface of a polymer molded body of at least one polymer phase, where the device has an energy source with at least one electrode, which is provided to lose an energy with which the body to be processed is at least partially heated.