baber/WOPTO huggingface dataset:
Patent JP-H10161023-A (JP)
Title: Zoom lens having camera shake correcting function
Inventor: KONNO KENJI
IPC: G02B15/16
Filed: 1996-11-28
Abstract: PROBLEM TO BE SOLVED: To obtain excellent optical performance though large camera shake is caused by lightening a load imposed on a camera shake correction driving system by means of setting a lens group which is light in weight as a camera shake correcting group by performing camera shake correction by decentering the rear group of a second group in parallel and also satisfying a specified condition. SOLUTION: As for a zoom lens including a negative first group Gr1 and a positive second group Gr2 in order from the side of an object; the second group Gr2 is constituted of a positive front group Gr2F and a positive rear group Gr2R in order from the side of the object, and the camera shake correction is made by decentering the rear group Gr2R in parallel. Also, the condition of 0<ϕ2F/ϕ2R<1.0 is satisfied. In an expression, ϕ2F means the refracting power of the front group Gr2F of the second group, and ϕ2R means the refracting power of the rear group Gr2R of the second group. Also, the rear group Gr2R of the second group is constituted of one positive lens or one positive cemented lens.
Patent JP-H06163955-A (JP)
Title: Solar cell substrate and solar cell
Inventor: HIGUCHI HIROSHI
IPC: H01L31/073
Filed: 1992-11-27
Abstract: PURPOSE:To prevent impurities in a substrate from diffusing in a solar cell, and restrain deterioration of characteristics, enable using glass whose cost is lower, decrease the surface resistance of N-type semiconductor as the window material of the solar cell, increase its optical transmittance, and improve photoelectric conversion efficiency. CONSTITUTION:An insulator layer 2 containing at least titanium oxide, N-type semiconductor 3, and P-type semiconductor 4 are formed in this order on the surface of a substrate 1 composed of insulator, thereby forming a solar cell. Impurities in the substrate can be prevented from diffusing in the solar cell by the insulator layer 2, so that the deterioration of characteristics is restrained. By the effect of the insulator layer 2, the N-type semiconductor 3 wherein adhesion to the substrate is improved, air gaps in the inside are not present, the surface resistance is low, and the optical transmittance is high can be formed, and the conversion efficiency of a solar cell is improved.
Patent JP-2000131735-A (JP)
Title: Real image finder
Inventor: KOYAMA TAKASHI
IPC: G02B25/00
Filed: 1998-10-21
Abstract: PROBLEM TO BE SOLVED: To obtain a simple, compact real image finder using a roof reflection surface by constituting the finder so that a reflecting means for reflecting a luminous flux from an objective lens system is provided with a roof surface. SOLUTION: The luminous flux transmitted through the objective lens system 10 is bent by a roof mirror 11 so as to form an obtuse angle, then, the luminous flux is made incident on a transmission prism 12 through an incident surface 12a which is nearly vertical to the bent optical axis. The image forming surface of the objective lens system 10 is positioned near the incident surface 12a of the transmission prism 12, and a visual field frame 14 is placed. The luminous flux made incident on the prism 12 is emitted from an exit surface 12b planted oblique to the optical axis.  Thereafter, the luminous flux made incident on a reflection prism 13 through ?an incident surface 13a arranged nearly parallel and adjacent to the exit surface 12b is reflected by a vapor deposition mirror surface 13b at a prescribed acute angle (α), then totally reflected by the incident surface 13a, and emitted from an exit surface 13c toward an eyepiece 17 so as to be nearly parallel to the optical axis L not bent yet by the roof mirror 11 of the objective lens system 10.
Patent JP-H07212194-A (JP)
Title: Data transmission device between two different rooms
Inventor: LEYTEN LUKAS
IPC: H04B10/114
Filed: 1994-12-21
Abstract: PURPOSE: To easily perform information transmission of both or one of an audio and a video sets installed at the both sides of a partition or a wall, or control signal in a room by using both or one of an inductive transmitting device and a capacitive transmitting device. CONSTITUTION: A coil 2 and a coil 3 are set at the both sides of a wall 1. The coil 2 is connected through a cable 4 with the output terminal of an audio amplifier 5, and the coil 3 is connected through a cable 6 with the input terminal of an audio amplifier 7. In the same way, the cables 4 and 6 can be replaced with an infrared receiving diode 8 and an infrared transmission diode 9 respectively. Then, the amplifier 5 includes an infrared transmitting diode 10 for transmitting an audio signal, and the amplifier 7 includes an infrared receiving diode 11 for receiving the audio signal. Moreover, known devices 12 and 13 are used for both or one of amplification and another processing.
Patent JP-H06164349-A (JP)
Title: Reset signal generating circuit
Inventor: MORIMOTO YOSHIHIDE
IPC: G06F15/78
Filed: 1992-11-27
Abstract: PURPOSE:To obtain an optimum reset signal and to efficiently start the operation of a microcomputer, etc., by reset-resetting a certain time later since a sufficient operating voltage is obtained by starting constant-voltage operation. CONSTITUTION:When a source voltage VB rises sufficiently and a constant voltage output Vcc reaches a specific voltage at a point T2 of time, the constant voltage operation is started. Namely, the output voltage of a driving circuit 3 rises so as to make the bias of a transistor(TR) 1 shallow and becomes higher than the voltage of the constant output Vcc, so a TR 4 turns OFF and further a TR 5 turns OFF. The collector voltage of the TR 5, therefore, reaches Vcc, i.e., a level H and the output of a NAND gate 8 varies to a level L. Consequently, a TR 9 turns OFF to start charging a capacitor 10 through a resistance 11 and after a delay time determined by the time constant of the capacitor 10 and resistance 11 is elapsed, a reset signal *RES goes up to the level H at a point T3 of time, thereby resetting the resetting.
Patent JP-H07171630-A (JP)
Title: Press bending method
Inventor: NAKAZAWA YASUSHI
IPC: B21D7/06
Filed: 1993-12-17
Abstract: PURPOSE:To provide a press bending method which restricts generating defective surface roughness, surface bulge or recess caused on bending and can surely keep the flatness without finish cutting. CONSTITUTION:In a press bending method to bend a work 1 along a die shape by pressing a press bending die 5 onto a metal work 1, a part of the work 1 is crushed with a die 5 and its wall thickness is reduced in the time of pressing the die 5. Desirably, its the reduction of wall thickness is set in 0.05 to 0.5 mm.
Patent JP-H10171948-A (JP)
Title: Sim card reader
Inventor: BRAUN GERHARD
IPC: G06K7/00
Filed: 1997-11-05
Abstract: PROBLEM TO BE SOLVED: To provide an SIM(subscriber identification module) card reader which is thin and compact. SOLUTION: This SIM card reader is provided with a contact support 11, a cover 12 and two bearing units 13a and 13b. The support 11 has contact elements 6. The cover 12 accommodates an SIM card 1 that has two longitudinal side edge parts 5a and 5b which are separately placed and front and rear edge parts 2 and 4 which are separately placed. The units 13a and 13b are mounted on the contact support and the cover and allow main shaft motion between the cover 12 and the contact support. Each of bearing units 14 has a bearing part that is provided on the support 11 and a bearing part that is provided on the cover 12. The bearing part that is provided on the contact support is located within the range of the periphery of the SIM card which is inserted into the SIM card reader.
Patent JP-H08153844-A (JP)
Title: Semiconductor device
Inventor: SHIBATA KAZUTAKA
IPC: H01L23/50
Filed: 1994-11-28
Abstract: PURPOSE: To provide a semiconductor device of a structure wherein a heat sink can be coupled with tabs on a lead frame with comparatively ease and moreover, with high accuracy and reliably. CONSTITUTION: A semiconductor device is formed into a structure wherein a heat sink 2 is coupled with step-shaped tabs 6b on a lead frame 6 to support the tabs 6b, a semiconductor element 1 is secured on the surface on one side of the surfaces of the heat sink 2, the element 1 and lead terminals 4 of the lead frame 6 are electrically connected with each other via metal thin wires 3 and the heat sink 2 is incorporated in a package main body 5 by a resin molding die, and the tabs 6b formed on the lead frame 6 are coupled with the heat sink 2 by an ultrasonic bonding.
Patent JP-H07147274-A (JP)
Title: Control of low-temperature processing device
Inventor: KITAMURA MASAYUKI
IPC: H01L21/3065
Filed: 1993-11-24
Abstract: PURPOSE:To treat a material to be treated at a desired temperature by a method wherein heat transfer gas is fed to the contact surface of the material to be treated with an electrostatic chuck means and after an elapse of a prescribed time, process gas introduced in a treating chamber is brought into a plasma state. CONSTITUTION:A semiconductor wafer W is housed in a treating chamber 36 by a transfer arm and is placed on an electrostatic chuck sheet 4 provided on the placement surface of a susceptor 6. Then, with a DC voltage applied from a high-voltage DC source 92 to the sheet 4, He gas 11 is introduced in the chamber 36 and plasma is applied to the sheet 4 by a short time to make sufficient an adsorption to the semiconductor wafer W. In that state, back clean gas is fed from a gas source 13 to the rear of the wafer W via a pipeline 15. Thereby, an low-temperature etching, which is superior in anisotropic etching characteristics from the first of a treatment, can be performed.
Patent JP-H04188304-A (JP)
Title: Sequencer circuit
Inventor: TANIGUCHI MASAHARU
IPC: G05B19/05
Filed: 1990-11-22
Abstract: PURPOSE:To enlarge an operation margin by enlarging the ratio of either at 'H' side or a 'L' side in one period of a basic clock to operate a sequencer circuit. CONSTITUTION:A basic clock generation circuit 4 is provided, and the duty of the 'H' side of the basic clock is made smaller. In this case, since immediately after the output of a state hold circuit 2 settled, a clock CK' falls from 'H' to 'L', time till a second combination circuit 3 executes processing is shortened, and the time of a shortened portion is added to the set-up time of data till the state hold circuit 2 takes in a next state. Accordingly, the operation margin of a circuit is made larger, and it can be operated at high frequency, and besides, even if the combination circuits 1,3 are constituted of the complicated circuits, they can be operated normally. Thus, the sequencer circuit whose degree of freedom of design is high can be obtained.
Patent JP-H04188309-A (JP)
Title: Gimbal control circuit
Inventor: SAWARA HIROKAZU
IPC: G01C17/18
Filed: 1990-11-22
Abstract: PURPOSE:To automatically and highly precisely correct the drift of a gimbal angle by outputting a reset signal to an integrator from a comparator, and outputting a switching signal to a switching unit from the comparator when an acceleration signal from an acceleration sensor becomes over a reference value set beforehand in the comparator. CONSTITUTION:The comparator 2 compares a reference signal 10 set beforehand at a definite value and the acceleration signal 9 with each other, and when the acceleration signal 9 becomes over the level of the reference signal 10, it outputs the reset signal 11 for the integrator 3 and the switching signal 7 for the switching unit 4. In this case, the integrator 3 integrates a rate signal from the point of time of the input of the reset signal 11, that is, the point of time of the impression of acceleration over the definite value, and outputs an arithmetic angle signal 12. Further, since the switching signal 7 is outputted simultaneously with the start of integration, the switching unit 4 is switched so as to output the arithmetic angle signal 12 from the integrator 3 as a control signal 8, and outputs this signal to a servo amplifier. Thus, the influence of disturbance torque caused by the impression of the acceleration can be corrected through the servo amplifier.
Patent JP-H09162199-A (JP)
Title: Fabrication of semiconductor device
Inventor: SEKI AKINORI
IPC: H01L21/203
Filed: 1995-12-07
Abstract: PROBLEM TO BE SOLVED: To simplify the fabrication process of a gate electrode having short gate length in a field-effect transistor. SOLUTION: A terminated basic material layer 14 of specified thickness is formed on the surface of a semiconductor substrate 10 while exposing a part thereof. A conductor layer 15 is then formed entirely on the surface of the semiconductor substrate 10 and terminated basic material layer 14. Subsequently, the semiconductor substrate 10 is subjected to anisotropic etching obliquely from above to leave a part of the conductor layer 15 contiguous to the end part of terminated basic material layer 14 thus forming a first electrode 15a before removing other conductor layer.
Patent JP-H07173674-A (JP)
Title: Production of electrogalvanized steel sheet
Inventor: SHIRAI HIDENOBU
IPC: C25D5/26
Filed: 1993-12-20
Abstract: PURPOSE:To prevent the lowering of the adhesion of a plating metal to the end of a steel sheet by electroplating the surface of a steel sheet with Zn or Zn alloy and then blowing a high-temp. reducing gas against the end of the steel sheet to reduce the Zn hydroxide in the plating film to Zn. CONSTITUTION:When the surface of a cold-rolled steel sheet is electroplated with Zn or Zn alloy, the plating current is concentrated on the end of the sheet, hydrogen ion is converted to gaseous hydrogen due to the high current density, the hydrogen ion concn. in the plating soln. is decreased, Zn(OH)2 is formed in the plating film at the end, and the adhesion of the plating film is lowered. Accordingly, a high-temp. inert gas such as nitrogen contg. a reducing gas such as CO is blown against the end of the plated steel sheet to reduce the Zn(OH)2 to Zn, hence the adhesion of the plating film to the end is not lowered, and the plating film is never peeled off.
Patent JP-H06280537-A (JP)
Title: Internal combustion engine with oil filter
Inventor: BUIRUHERUMU ARUDESU
IPC: F01M11/03
Filed: 1993-12-20
Abstract: PURPOSE: To improve the independence of the structure of an internal combustion engine from the structure of an oil filter, and to reduce the manufacturing cost by mounting the oil filter having a filter socket and a sealing plate on a connection flange of the internal combustion engine. CONSTITUTION: A housing 1 provided with a connection flange 10 having a sealing frame member is provided on an internal combustion engine. An oil filter 4 having a filter socket 4' is mounted on the connection flange 10 through a sealing plate 3. The sealing plate 3 is provided with a through hole 302 to flow the lubricating oil to the filter socket 4' from a feed oil passage 101 of the connection flange 10. A through hole to flow the lubricating oil coming from the oil filter 4 to a return oil passage of the connection flange 10 from the filter socket 4' is provided. The filter socket 4' is provided with a lubricating oil flow passage which is formed along the surface of its flange 40 and surrounded by a sealing frame member 41. The manufacturing cost can thus be reduced.
Patent JP-H04187432-A (JP)
Title: Manufacture of laminated sheet
Inventor: SATO TOMOARI
IPC: B32B15/082
Filed: 1990-11-21
Abstract: PURPOSE:To improve the bonding properties of an aluminum plate and a thermoplastic resin and to enhance humidity resistance by a method wherein a thermoplastic resin film is thermally welded and subsequently again heat-treated at temp. equal to or higher than the m.p. in the case of a crystalline thermoplastic resin and heat-treated at temp. equal to or higher than a glass transition point in the case of an amorphous thermoplastic resin. CONSTITUTION:As a thermoplastic resin, a crystalline resin having an m.p. of 200 deg.C or higher or an amorphous resin having heat-deformation temp. of 150 deg.C or higher is pref. and, for example, as the crystalline one, polyether ether ketone or a tetrafluoroethylene/tetrafluoropropylene copolymer is designated and, as the amorphous one, polyether sulfone is designated. A laminated sheet of an aluminum plate and a thermoplastic resin is necessarily again heat-treated at temp. equal to or higher than the m.p. of the resin in the case of the crystalline resin and at temp. equal to or higher than the glass transition point of the resin in the case of the amorphous resin and, pref., re-heating treatment temp. is within the range of the m.p. - the m.p. +50 deg.C in the case of the crystalline thermoplastic resin and within the range of the glass transition point - the glass transition point +100 deg.C in the case of the amorphous thermoplastic resin.
Patent JP-H03179443-A (JP)
Title: Processing method for silver halide color photographic sensitive material
Inventor: KOJIMA TETSUO
IPC: G03C7/42
Filed: 1989-12-08
Abstract: PURPOSE:To improve desilverability, especially desilvering speed and to remove void by adding a specified amt. of bromide ions to a bleach-fixing soln. and specified components to a processing soln. behind a bath having fixing ability. CONSTITUTION:Bromide ions are added to a bleach-fixing soln. by 1X10<-3>-2.0mol/l and at least one kind of compd. selected among hydrogen- sulfites, sulfites and metahydrogensulfites and at least one of compds. represented by formula I-IV and/or at least one of adducts of compds. represented by the formulae I-IV to hydrogensulfites is added to a processing soln. behind a bath having fixing ability. In the formula I, each of R1 and R2 is H, alkyl, etc., and R1 and R2 may bond to each other to form a ring but are not simultaneously H. In the formula II, each of R3-R5 is H, alkyl, etc., R6 is an electron withdrawing group and R3 and R4, R4 and R5, R5 and R6 or R6 and R3 may bond to each other to form a ring. Desilverability, especially desilvering speed and void can be improved.
Patent JP-H01161798-A (JP)
Title: Manufacture of multilayered circuit substrate
Inventor: TANI KOJI
IPC: H05K3/46
Filed: 1987-12-17
Abstract: PURPOSE:To enable checking such electric characteristics as resistance value and capacitance value etc., of a circuit at every layer and adjusting the characteristics as well if necessary, and thereby to enable obtaining a high density multilayered circuit substrate with good characteristics as designed, by forming a required circuit with paste applied and baked on a heat-resistant film one layer by one, for example. CONSTITUTION:After required circuit elements 2, 3 are formed by applying and baking paste on a heat-resistant film 1, the above-mentioned circuit elements 2, 3 formed on the heat-resistant film 1 are covered with an insulating material 5, and a required circuit element 7, 8 is formed by applying and baking paste on that insulating material 5. Then, the heat-resistant film 1 with the multilayer circuit obtained through these processes, is sealed inside a forming mold, and after the inside of the forming mold is filled with a molten resin, the resin hardens and makes a supporting body 10. Afterwards, the heat-resistant film 1 is parted. For example, the resistor 2 is made by printing resistor paste on a polyimide film 1 and baking it. Next, conductor paste is printed and baked to make the electrode 3. Applying and baking insulator paste follows this to form the insulating layer 5. Likewise, the electrode 7 and the resistor 8 are formed.
Patent JP-2000109985-A (JP)
Title: Formation of pore finer than the sheet thickness by etching means
Inventor: OKAMURA TAKASHI
IPC: C23F1/00
Filed: 1998-10-05
Abstract: PROBLEM TO BE SOLVED: To provide the method for forming pores finer than the sheet thickness by an etching means by which fine pores irrespective of the sheet thickness of a metallic sheet are formed of the metallic sheet, and to provide a translucent metallic thick plate. SOLUTION: The positions of plural fine pores of plural metallic thin sheets 1 in which plural fine pores with the minimum diameter which is restricted by the sheet thickness in the metallic thin sheets 1 are closely formed on the whole face in the prescribed region by an etching means are matched with each other and the plural metallic thin sheets are integrated, by which a metallic plate having fine pores 2 with the diameter remarkably smaller than the sheet thickness of the metallic plate can be obtd.
Patent JP-H11145072-A (JP)
Title: Heat treatment equipment
Inventor: SHIMAZU TOMOHISA
IPC: H01L21/324
Filed: 1997-11-06
Abstract: PROBLEM TO BE SOLVED: To improve air tightness in a temperature detection port and to reduce or dissolve degassing and metal corrosion. SOLUTION: In a heat treatment equipment, a temperature detection pipe 6 is inserted and provided into a treatment chamber storing a substrate to be treated and heat-treating it at a temperature reduction atmosphere from a temperature detection port 7. At least the inner face of the temperature detection port 7 is formed by nonmetal and an abutting body 27 having an insertion hole 26 into which the temperature detection pipe 6 is inserted is air-tightly abutted on the opening end of the temperature detection port 7 so as to connect them. A pair of O rings 28a and 28b are arranged in an insertion hole 26 of an abutting body 27 at a prescribed interval along the axial direction of the temperature detection pipe 6 so as to fasten it. A pressure reduction exhaust part 29 is provided between the O rings 28a and 28b.
Patent JP-H02289165-A (JP)
Title: Apparatus for applying adhesive to elastic string
Inventor: HENINGU IYOTSUTO KURAASEN
IPC: D06B1/08
Filed: 1989-12-07
Abstract: PURPOSE: To provide the subject apparatus capable of saving an adhesive by installing guide channels for each elastic yarn at the tip part of application and opening an outlet for an adhesive on each guide channel. CONSTITUTION: Guide channels 22a,... for each elastic yarn 18 are arranged at the tip part 20 of application and at least one outlet 26a for adhesive is opened at each guide channel. The elastic yarns are accurately guided and positioned until the application of an adhesive. An adhesive 28 is applied only to the yarns and is not applied to facial parts between the individual yarns and 30-40% adhesive can be saved.
Patent JP-H11141968-A (JP)
Title: Ceiling cassette type air conditioner and casing thereof
Inventor: SAKAINO KAZUAKI
IPC: F24F13/20
Filed: 1997-11-06
Abstract: PROBLEM TO BE SOLVED: To increase the capacity of a unit through simple structure by providing a plurality of unit structures each incorporating a heat exchanger and a fan, an outer plate body containing the plurality of unit structures and installed in the ceiling, and a decoration panel having air inlet and outlet. SOLUTION: Each unit structure 5 has a casing 3 containing a fan comprising a fan motor 24 and a turbo fan 26, a substantially rectangular heat exchanger 38 surrounding the fan, and an electric box. The casing 3 comprises two angle members (jointing members) 51, and an outer plate body secured to the angle members 51 while surrounding the outer circumference and ceiling of each unit structure 5. A decoration panel is fixed to the lower surface of an indoor unit 1.