baber/WOPTO huggingface dataset:
Patent TW-200913762-A (TW)
Title: Dimmer and dimming control circuit
Inventor: TAKIMURA WATARU
IPC: H05B3/02
Filed: 2008-07-08
Abstract: A dimming control circuit includes a triac connected to an alternating current power source through a lamp load, wherein the triac is provided with a gate and is turned on by a trigger signal inputted to the gate and a first variable resistor having an adjustable resistance value, wherein the brightness of the lamp load is adjusted by varying the resistance value of the first variable resistor, changing a phase of the trigger signal with respect to an alternating current voltage waveform, lengthening or shortening a turned-on period of the triac and then changing an electric current supplied to the lamp load. The dimming control circuit further includes a second variable resistor for changing the phase of the trigger signal independently of the first variable resistor.
Patent TW-201004377-A (TW)
Title: Headphone and mobile phone system
Inventor: DAI LUNG
IPC: H04M11/10
Filed: 2008-07-11
Abstract: A headphone for a mobile phone, includes an operation unit and a display. The operation unit is used for generating message editing commands based on instructions from users. The message editing commands are transmitted to the mobile phone, so as to generate short messages. The display is used for displaying the short messages transmitted from the mobile phone. The operation unit is further used for generating transmission commands based on instructions from users. The transmission commands are transmitted to the mobile phone, so as to transmit the short messages that have been edited. A related mobile phone system is also provided.
Patent TW-200915906-A (TW)
Title: Organic electroluminescent device and fabricating method thereof
Inventor: ITO NORIHITO
IPC: H05B33/04
Filed: 2008-07-29
Abstract: The object of this invention is to obtain an organic EL device with excellent light resistance and a fabricating method thereof. The organic EL device of this invention includes: a first substrate as a support substrate; a first electrode disposed on the first substrate; an organic layer at least containing an organic light emitting layer disposed on the first electrode; a second electrode disposed on the organic layer; a resin layer disposed to cover the first substrate that includes an upper surface of the second electrode and with at least an area above the organic layer that includes ultraviolet absorbing agent to absorb ultraviolet; and a second substrate disposed on the resin layer to isolate the organic layer from an external gas.
Patent TW-200920773-A (TW)
Title: Flame retardants suitable for use in viscoelastic polyurethane foams
Inventor: GERARD ERIC-JACK
IPC: C09K21/14
Filed: 2008-08-05
Abstract: The present invention relates to viscoelastic polyurethane foam formulations, viscoelastic polyurethane foams formed from such formulations, and products formed from the viscoelastic polyurethane foams.
Patent TW-201009531-A (TW)
Title: Level shift circuit
Inventor: HSU KUO-JEN
IPC: G05F1/46
Filed: 2008-08-25
Abstract: The present invention provides a level shift circuit capable of operating at low input voltage. The level shift circuit comprises: a first switch element coupled to a first output terminal, a second switch element coupled to a second output terminal, a third switch element coupled to the second output terminal and the first output terminal, a fourth switch element coupled to the first output terminal and the second output terminal, a first current source module for let a current passing through the third switch element smaller than a current passing through the first switch element when the first switch element and the third switch element are conducted, and a second current source module for let a current passing through the fourth switch element smaller than a current passing through the second switch element when the second switch element and the fourth switch element are conducted.
Patent TW-201009961-A (TW)
Title: Method for packaging a light-emitting diode
Inventor: YEH SHU-LING
IPC: H01L21/56
Filed: 2008-08-25
Abstract: The disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of acrylic ester, 0.1 to 30 parts by weight of hydrogen bond monomer, and 0.1 to 70 parts by weight of bulky monomer. The copolymer has a transparency greater than 90%, a thermal resistance greater than 130 DEG C, a moisture absorption less than 0.5wt%, such that the copolymer is adapted to be applied in packaging material for light emitting device.
Patent TW-200939323-A (TW)
Title: Multi-region processing system and heads
Inventor: ENDO RICK
IPC: H01L21/20
Filed: 2008-09-05
Abstract: The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.
Patent TW-201014507-A (TW)
Title: Foldable electronic device and pivot mechanism thereof
Inventor: LIN SAN-FENG
IPC: G06F1/16
Filed: 2008-09-19
Abstract: A pivot mechanism for connecting a host and a display includes a rotary bearing, a connecting plate, a pivot component, a linkage and a hook. The rotary bearing has a first part for being embedded in the host and a second part having a rotary shaft and capable of being rotated relative to the first part. The rotary shaft is rotatably embedded in a first edge of the connecting plate. The pivot component is pivoted between a rear surface of the display and a second edge of the connecting plate. The first linkage is glidingly disposed to the connecting plate and has a locking hole. The hook is disposed to the rear surface, passing through the connecting plate and glidingly disposed in the locking hole. The hook can limit the display to be rotated about the pivot component relative to the connecting plate by interfering with the connecting plate.
Patent TW-201014076-A (TW)
Title: Electronic device assembly
Inventor: CHIU CHIH-CHUNG
IPC: H01R13/64
Filed: 2008-09-25
Abstract: An electronic device assembly includes an electronic device and a mini connector. The electronic device has a first housing which has an assembling opening, a first connecting terminal set located in the assembling opening, and a first fixing portion near the assembling opening. The mini connector used to connect with the electronic device includes a second housing, a connecting wire and a second connecting terminal set. The second housing has a second fixing portion. The shape of the second fixing portion is complementary to that of the first fixing portion. The connecting wire crossing the second housing is electrically connected to the second connecting terminal set. The second fixing portion is located at one side of the second connecting terminal set, which is deposed in the second housing. The mini connector is specifically connected to the electronic device by the complementation of the second fixed portion and the first fixed portion.
Patent TW-201012659-A (TW)
Title: Ink absorbing device and method for cleaning inkjet head
Inventor: CHENG CHEN-HSING
IPC: B41J2/14
Filed: 2008-09-26
Abstract: An ink absorbing device includes a main body, a groove defined in a surface of the main body, a first holes defined in a bottom surface of the groove. The ink absorbing device further includes an inclined surface inclined to the surface of the main body, a plurality of second holes and a vacuum path. The inclined surface is positioned between the bottom surface of the groove and the surface of the main body. The plurality of second holes are defined in the inclined surface and in communication with the vacuum path. An inkjet head cleaning method applying the ink absorbing device is also provided in the present invention.
Patent TW-201015348-A (TW)
Title: Detecting name entities and new words
Inventor: WU JUN
IPC: G06F17/27
Filed: 2008-10-09
Abstract: Various aspects can be implemented for detecting name entities and/or new words from input entries. In general, one aspect can be a method that includes receiving an input entry comprising a text string. The method also includes identifying segmentation information from the input entry. The method further includes generating a candidate text string from the text string of the input entry based on the segmentation information. Other implementations of this aspect include corresponding systems, apparatus, and computer program products.
Patent TW-200937022-A (TW)
Title: Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
Inventor: KASUKABE SUSUMU
IPC: G01R1/073
Filed: 2008-10-13
Abstract: A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.
Patent TW-200922018-A (TW)
Title: Electrical connector
Inventor: CHUNG WEI-TE
Filed: 2008-10-28
Abstract: An electrical connector includes an insulating housing defining a front mating cavity and a mating tongue extending into the front mating cavity and defining thereon first and second mating faces opposite to each other. Said mating tongue is dividing said mating cavity into a first mating space confronting the first mating face for mating with a first complementary connector, and a second mating space confronting the second mating face for mutually exclusively mating with second and third complementary connector. A plurality of first type contacts are disposed on the first mating face for connecting with the first complementary connector, a plurality of second type contacts are disposed on the second mating face for connecting with the second complementary connector, and a plurality of third type contacts are located between the first type contacts and the second type contacts with front ends of the third type contacts exposed to the second mating space.
Patent TW-200931264-A (TW)
Title: Dynamic logical data channel assignment using channel bitmap
Inventor: MADRUGA JOAQUIN
IPC: G06F13/28
Filed: 2008-11-10
Abstract: A method, system and program are provided for dynamically allocating DMA channel identifiers by virtualizing DMA transfer requests into available DMA channel identifiers using a channel bitmap listing of available DMA channels to select and an allocated DMA channel identifier. Once an input value associated with DMA transfer request is mapped to the selected DMA channel identifier, the DMA transfer is performed using the selected DMA channel identifier, which is then deallocated in the channel bitmap upon completion of the DMA transfer. When there is a request to wait for completion of the data transfer, the same input value is used with the mapping to wait on the appropriate logical channel. With this method, all available logical channels can be utilized with reduced instances of false-sharing.
Patent TW-201021285-A (TW)
Title: Electronic component, ceramic antenna and electronic device using the same
Inventor: HSU YU-LANG
IPC: H01Q1/22
Filed: 2008-11-20
Abstract: An electronic component used for being assembled on a circuit board includes a body and an elastic component. The body has a signal transmission port. The elastic component having a first end and a second end is used for being electrically connected to the body and the circuit board. The first end of the elastic component is fixed at the body and touches the signal transmission port, and the second end of the elastic component touches the circuit board.
Patent TW-201020738-A (TW)
Title: Heat dissipation module
Inventor: HUANG TING-CHIANG
IPC: G06F1/20
Filed: 2008-11-27
Abstract: A heat dissipation module suitable for a heating element includes a heat dissipation unit and a cooling unit. The heat dissipation unit includes a main part suitable for be contacted with the heating element and heat dissipation fins connected to the main part. The heat dissipation unit includes a cooling surface and a heating surface, and is disposed on the heat dissipation fins by the cooling surface.
Patent TW-201003675-A (TW)
Title: Silver coated flaky material filled conductive curable composition and the application in die attach
Inventor: KONG HAO
IPC: C09J9/02
Filed: 2008-12-10
Abstract: The present invention is to provide a semiconductor packaging applicable conductive composition using silver coated material flakes as a conductive filler, curable epoxy, acrylate, bismaleimide chemical, or the like or their combination as organic resin, and the method for preparing the same. The composition is capable of showing desired workability as dispensable die attach adhesive with right range of rheology, viscosity and physical stability in storing, being excellent in reliability of conductivity or corrosion resistance, and reducing the amount of high price silver in composition.
Patent TW-200938015-A (TW)
Title: Circuit board, method of manufacturing a circuit board, and cover lay film
Inventor: MITOMI MASATOSI
IPC: H05K9/00
Filed: 2008-12-11
Abstract: The present invention relates to a circuit board 300, comprising a circuit substrate 130 composed of a substrate 201 and a conductive circuit 203 formed on at least one surface of the substrate 201, and a cover lay film 100 for use as an insulating cover layer of the conductive circuit 203. The cover lay film 100 is composed of a resin film 101 and an adhesive layer 105, and a conductive layer 103 is provided between the resin film 101 and the adhesive layer 105. The conductive layer 103 and the conductive circuit 203 are in an electrical connection state. Accordingly, the flexibility and reliability of the circuit board 300 are enhanced.
Patent TW-201024911-A (TW)
Title: Testing apparatus for voice coil motor
Inventor: YU HSIANG-CHIEH
IPC: G03B9/00
Filed: 2008-12-26
Abstract: A testing apparatus for voice coil motor includes a base, at least one fixing part, at least one probe base and at least one elastic element. The base includes an installing part. The installing part defines a plurality of receiving cavities for receiving voice coil motors. The at least one installing part is fixed on one side of the base. The probes are fixed on probe base. The elastic element is attached to the fixing part and the probe base such that the probe base is resiliently sustained on the fixing part, thereby rendering the probes are in contact with the electrodes of the voice coil motor.
Patent TW-201020379-A (TW)
Title: Fall prevention device for preventing fall of displacement correction device from erection piece
Inventor: OKADA SHINJI
IPC: E04B1/24
Filed: 2008-12-29
Abstract: The present invention provides a fall prevention device for preventing a displacement correction device from falling from an erection piece, which can surely prevent the fall of the displacement correction device from a lower end side erection piece of the displacement correction device in the case that an upward external force acts upon the displacement correction device. The displacement correction device is fixed to an upper end side erection piece attached to a lower steel and a lower end side erection piece attached to an upper steel which is to be disposed onto the lower steel thereby to correct the displacement of the upper steel with respect to the lower steel. The fall prevention device prevents the fall of the displacement correction device form the lower end side erection piece when the displacement correction device having a ring-shaped frame is suspended to the lower end erection piece and the upper steel is lifted. The fall prevention device includes a first through hole provided in the lower side erection piece, a bracket provided on each side of the frame, a second through hole provided in the bracket and a holding means inserted into the first and second trough holes to hold the displacement correction device.
Patent TW-200946707-A (TW)
Title: Twin-type coating device with improved separating plate
Inventor: WOLF HANS
IPC: C23C16/54
Filed: 2009-01-23
Abstract: The present invention refers to a coating device for coating of substrates comprising at least two process chambers (1, 2, 3, 4) being disposed adjacent to each other, a separating plate (9) between the two adjacent process chambers, and pumping means (12, 13) for evacuating the process chambers, wherein the separating plate (9) comprises a conduit having at least two ends, one end of which is connected with the pumping means and the other end has at least one suction opening for at least one of the process chambers.
Patent TW-200946689-A (TW)
Title: Device for hardening of rails
Inventor: KOECK NORBERT
IPC: C21D1/18
Filed: 2009-02-04
Abstract: The invention relates to a device for hardening of rails, in particular profiled track rails, each optionally having a different cross-sectional shape and a length of more tha n 50 meters, by cooling at least a portion of the respective rail cross section over the entire length of the rail in a coolant, comprising transverse shunting means in the area of a roller gear, straightening means and manipulation grippers for conveying the rail in the device, at least one positioning means, each with a basin and/or trough with coolant and cooling bed. To create a device with which high quality rails can be manufactured economically with a high throughput and with a great reliability, it is proposed according to the present invention that the manipulation gripper should be formed from a plurality of identically shaped aligned tongs (30) that can be operated to have the same movement, each having gripper arms (31 , 31') which are shaped with centering parts (312, 312') for an axial alignment of the head (12) of the rail and with gripper parts (311, 311') for a cross-sectionally aligned holding of th e rail base, and a precision introduction of the rail (1) into the positioning means (4) and securing of same therein are made possible and/or the positioning means (4) has a plurality of holdin g components (40) aligned horizontally with supporting rigs (41) for the base (11) of a rail ( 1) introduced in a hanging position, said base (11) being securable on the supporting rigs (41) by releasable chucking elements (42) and/or hold-down devices so that it is secured from distortion in the axial rail (1) and/or at least basins (5) are arranged horizontally at the same height side-by-side so they are axially parallel with positioning means (4), and the part of the coolant (50) that can be used for rail hardening in the basin (5) has a depth which exceeds the height of the largest rail profile by at least 10% and/or the basin (5) and the supporting rigs (41) and the releasable chucking means (42) for the base (11) of the hanging rail (1) of all the components o f the positioning means (4) can be moved in a controlled manner relative to one another vertically at the same time for introducing the rail into the coolant, and a respective vertical holding position and duration of same are adjustable.
Patent TW-201030911-A (TW)
Title: Package substrate and fabrication method thereof
Inventor: CHIANG JEN-HUNG
IPC: H01L23/48
Filed: 2009-02-05
Abstract: A package substrate is disclosed, including a core board having first and second circuit layers formed on the first and second surfaces thereof respectively; a first dielectric layer connected to the first surface and having the first circuit layer embedded therein; a primary circuit layer embedded in the surface exposed from the first dielectric layer and having electrical connecting pads formed thereon; a first conductive blind via disposed in the core board electrically connecting to first and second circuit layers and the primary circuit layer; and a first solder mask layer formed on the surface exposed from the first dielectric layer and the primary circuit layer and with a first opening for exposing the electrical connecting pad therefrom, thereby using the conductive blind via as conductive circuits between layers to facilitate fabrication of fine-pitched circuits. The invention further provides a method for fabricating the package substrate as described above.
Patent TW-201032081-A (TW)
Title: Method of making plant layout using computer aided approach
Inventor: Zhang jia-han
IPC: G06F17/50
Filed: 2009-02-20
Abstract: A computer aided approach that includes the following steps: (1) A plant that has more than one rectangular or non-rectangular departments (2) Develop a SuDoKu matrix and overlap the plant and the matrix together (3) Dope the SuDoKu matrix (4) Assign each department a unique number less than the cardinal number of a SuDoKu matrix, sort the department with a predescribed rule, and process the sorted department list one at a time into the SuDoKu matrix (5) Take the Kth department in process for example: Count the number of K(s) that coincides SuDoKu maxtrix's number K inside the shape of the Kth department, Locate the department where the identical number counting system gives the maximum count.
Patent TW-200944372-A (TW)
Title: Resin-coated steel sheet having excellent anti-scratch properties
Inventor: WATASE TAKESHI
IPC: B05D5/08
Filed: 2009-02-24
Abstract: The invention relates to a resin coated steel sheet with excellent flaw resistance; a resin coating with a thickness of 12 [mu]m or below is formed on the surface of cold-rolled steel sheets or alloying melted galvanized steel sheets, the vitrification temperature Tg of the coating being in the range of 10 DEG C below zero to 32 DEG C. According to the formation, flaws are prevented in each procedure of the production process, extrusion process, assembly process after processing, and transfer process. The invention is suitable for law resistance with strict standard.
Patent TW-201032254-A (TW)
Title: Push LED digital switch module
Inventor: CHOU YU-YU
IPC: H01H13/84
Filed: 2009-02-25
Abstract: A small button device, it can be used as ''switch device'' or can be linked as electronics switch device, it uses LED table body as press medium, the identity design can adjust the LED light, the signal occurred after pressing and touching the PCB board, it will have 3 kinds of setting mode throughout MCU, it is a button switch module device which can transfer the digital output signal totally.
Patent TW-200946551-A (TW)
Title: Polyurethane resins containing cycloaliphatic and/or aromatic component and phase difference films using them
Inventor: KAMEI SHUICHI
IPC: G02B1/04
Filed: 2009-03-13
Abstract: The present invention provides a polyurethane resin for using in phase difference film, and a phase difference film which exhibits no heat deterioration even experienced the extension process at the temperature above glass transition temperature (Tg), and the phase difference of the extended film will not be decreased as used in summer's high temperature. The polyurethane resin of present invention is characterized in comprising cycloaliphatic and/or aromatic components, and particularly with a glass transition temperature higher than 100 DEG C and lower than 200 DEG C.