baber/WOPTO huggingface dataset:
Patent JP-H10101842-A (JP)
Title: Halogen-containing flame-retardant and resin composition containing the flame-retardant
Inventor: CHIN TOSHIHIKO
IPC: C08G59/30
Filed: 1996-09-30
Abstract: PROBLEM TO BE SOLVED: To obtain a halogen-containing flame-retardant represented by a specific formula, high in flame retardancy, excellent in light resistance, heat resistance, hydrolysis resistance and flowability, and giving resin compositions not adhered to the metal parts, such as screws, cylinders and molds, of injection molding machines and extruders. SOLUTION: This halogen-containing flame-retardant is represented by formula I [X, Y are each a group of formula II or III (R is a 1-8C alkyl only, or the mixture of 1-79% of a 1-8C alkyl with 79-1% of tribromophenyl wherein their total amount is <=80%); the content of the compound wherein X and Y are each the group of formula II is 1-40%; the content of the component wherein X is the group of formula II and Y is the group of formula III is 30-70%, and the content of the compound wherein X and Y are each the group of formula III is <=80%; (n) is >=0; the content of the compound wherein (n) is 0 is <=60%]. A flame retardant thermoplastic resin composition contains the halogen- containing flame retardant, and is useful for the parts and housings of OA equipments and household electric appliances, the parts of automobiles, etc.
Patent JP-H11100699-A (JP)
Title: Method for recycling plating chemicals in plating processing and apparatus therefor
Inventor: IWANAGA AKIRA
IPC: C25D21/16
Filed: 1997-09-24
Abstract: PROBLEM TO BE SOLVED: To recycle plating chemicals by lessening the ladling up of the plating chemicals out of a plating tank and/or chemical tank and decreasing the sludge of a waste water treatment. SOLUTION: The plating chemicals sticking to a work W at the time of pulling up the work from the plating tank 3 are washed with water and are returned by a spray washing device 5 in the upper part of the plating tank 3. The waste liquid flowing over from the plating tank 3 is discharged into a liquid management tank 59 and is heated in the liquid management tank 59. The heated liquid is sprayed like mists from spray nozzles 91 in the upper part of the packing materials 93 in a thickening column 87 existing above the liquid management tank 59 by a first circulating pump 103. The mist-like liquid is sucked into the outdoor air of low humidity from an outdoor intake port 95 in the lower part of the thickening column 87 and is thickened. The thickened liquid is cooled by the packing materials 93 and dropped into the lower liquid management tank 59 where the liquid circulates. The air in a satd. state by absorbing the liquid is released into the atm. The waste liquid in the liquid management tank 59 is added with additives and is subjected to liquid management at all times. The liquid is supplied as a plating liquid for replenishment to the plating tank 3.
Patent JP-H02125019-A (JP)
Title: Boring machine
Inventor: NISHIUCHI HIDEO
IPC: E02D7/00
Filed: 1988-10-13
Abstract: PURPOSE:To smooth the driving so as to shorten the time for boring by cutting the bottom end of a large diameter tubular body diagonally to make it sharp pointed as well as jointing a small diameter tubular body at an upper part so as to form a step part at a joint part, and inserting an impact tube loosely in the vertically movable state around the small diameter tube body as an axis core. CONSTITUTION:The lower end part of a large diameter tubular body 1 at a lower part is cut diagonally so as to form a sharp point part 2, the lower end part of a small diameter tubular body 3 at an upper part is jointed to the tubular body 1, a step part 4 is formed at a joint part, an impact tube 5 is loosely fitted to the small diameter tube 3 in the vertically movable state, and a locking wheel 6 is fixed at the lower end part. When the sharp point part 2 is vertically erected at the place to be bored and the small diameter tubular body 3 is lifted being held firmly by hands and moved vertically, the impact tube descends to the step part 4, and by its weight, the gravitational acceleration is provided to the sharp point part 2 at the lower part so as to bore a hole. As the sharp point part 2 advances into the earth, the soil is pressed into the tube 1, so that the advance resistance is decreased and the descent becomes smooth. As a result, the curtailment of labor is promoted.
Patent JP-S62118528-A (JP)
Title: Processing of semiconductor device
Inventor: FURUTA KOJI
IPC: H01L21/316
Filed: 1985-11-19
Abstract: PURPOSE:To enable even drying up process to be performed while cutting water film evenly from the end of a wafer by a method wherein, in the cleaning process before sir-knife drying process, an oxide film is formed by chemical processing on an exposed substrate surface to be etched while leaving the oxide film. CONSTITUTION:When an MOS capacitor is formed, a LOCOS (SiO2) separating the capacitor and a pattern on an exposed Si substrate surface to be a capacitor coexist together on one main surface of a wafer. This wafer is cleaned up for the minutes in a cleaning solution with mixing ratio of e.g. NH4OH:H2O2:H2 O=1:2:7. An oxide film around 1mum thick is formed on Si by this cleaning process. After sufficient washing, the oxide film is immersed in a solution with mixing ratio of e.g. H2O:HF=500:1 to be etched by around 0.5mum leaving it by around 0.5nm. After sufficient washing, the oxide film is airknife-dried up later to form a capacitor SiO2 and then a polysilicon electrode is formed to form an MOS capacitor.
Patent JP-H09102365-A (JP)
Title: Power plug with decorative electric lamp
Inventor: TAKASAKI HIROSHI
IPC: H01R13/719
Filed: 1995-10-05
Abstract: PROBLEM TO BE SOLVED: To prevent electric noises from flowing to the outside by connecting a fuse and a capacitor in series in this order between terminal boards, arranging the capacitor behind the inner ends of the terminal boards, and molding a plug main body with a resin. SOLUTION: A fuse and a capacitor 9 are connected in series in this order between terminal boards 2, 3. The capacitor 9 is arranged behind the inner sides 2a, 3a of the terminal boards 2, 3. The inner sides 2a, 3a of the terminal boards 2, 3, part of electric wires 4, 5, a fuse 8, and a capacitor 9 are inserted into a die. Part of the terminal boards 1, 3 and all of the fuse 8 and the capacitor 9 are covered and integrally molded with a resin to form a plug main body 6.
Patent JP-H0790056-A (JP)
Title: Producrion of curing agent for agent for epoxy resin adhesive and epoxy adhesive
Inventor: IMAI YOSHIO
IPC: C08L63/00
Filed: 1993-09-22
Abstract: PURPOSE:To provide production process for a recycled liquid product easily preproducible from hard polyurethane foam in no need of recovery and purifica tion processes and an epoxy resin adhesive of high heat resistance using the tact recycled liquid product as a curing agent. CONSTITUTION:Diethylenetriamine (40g) is heated under stirring and 80g of particles of rigid polyurethane foam used in molding and panel (the maximum length of particle size: about size: about 5 to 10mm) are added thereto in potions under stirring, when the temperature reaches 170 deg.C and the reaction is continued at the same temperature for 70 minutes to give the recycled liquid product. The product is added is added to the conventional bisphenol-A epoxy resin in an amount of 30 to 40 pts.wt., based on 100 pts.wt. of the epoxy resin, further, a silicone coupling agent is added thereto in an amount of 1.3 to 1.4 pts.wt., to give the objective epoxy adhesive.
Patent JP-S61137573-A (JP)
Inventor: NARITA MASAO
IPC: A63B69/00
Filed: 1984-12-10
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H05102225-A (JP)
Title: Semiconductor manufacturing device
Inventor: TANIGUCHI JUN
IPC: H01L21/60
Filed: 1991-10-07
Abstract: PURPOSE:To prevent wire-to-wire contact and the sagging of wires by a method wherein the wires are made longer with the increase in number of electrode pads and external connection terminals resulted from the multifunctioning and high functioning of a semiconductor integrated circuit. CONSTITUTION:Grooves are provided on the position directly under a wire between a semiconductor integral circuit 3 and an external connection terminal 2 leaving the interval same as the wire with which each electrode pad 4 and the external connection terminal 2 are connected.
Patent JP-S63112137-A (JP)
Title: Controlling device of injection molder
Inventor: MIYAHARA MASAAKI
IPC: G05D7/06
Filed: 1986-10-30
Abstract: PURPOSE:To prevent pressure shock from developing and consequently contrive to stabilize the controlling of a molder and to prevent from defective product from generating by providing a joining circuit, which is formed by connecting discharge sides of a plurality of proportional electromagnetic pressure and flow rate controlling variable pumps with each other through non-return valves, and a controller to give control signals, which allot the discharge rates of respective pumps at a certain fixed ratio, to the respective pumps. CONSTITUTION:The discharge rates and pressures of respective pumps 4 and 5 are controlled by changing the tilting angle of a swash plate with control signals sent from a controller 3. The discharge ports of the pumps 4 and 5 are respectively connected to non-return valves 6 and 7. The efflux sides of the non-return valves 6 and 7 are joined and, after that, connected to various actuators 8. The controller 3 computes discharge rates necessary for maintaining the speeds and pressures set by setters 15 and allots the discharge rate to a certain fixed ratio in accordance with the number and capacities of the pumps. Thus, the discharge rates in a joining circuit 2 can be controlled only by electrical control signals issued from the controller 3.
Patent JP-H02107932-A (JP)
Title: Stress measurement
Inventor: SENBA TAKUYA
IPC: G01N29/00
Filed: 1988-10-17
Abstract: PURPOSE:To enable a stress measurement using an ultrasonic wave by a method wherein a phase difference-stress characteristic is prepared beforehand and a characteris tic curve is determined by actual measurement for an object to be measured to obtain a cyclic deviation in the characteristic curve as phase difference of a reference wave. CONSTITUTION:A characteristic curve A1 is determined to indicate a size of a reflected ultrasonic wave with respect to a position of an ultrasonic wave when the ultrasonic wave is radiated to a specified object and a reference stress works thereon and a characteristic curve A2 as obtained when other stresses work thereon under the same condition is determined by a theoretical analysis or a model actual measurement. Then, the cycles of the curves A1 and A2 are compared using a reference wave A3 with a specified frequency as reference to determine a cycle deviation between points P1 and P2 as phase difference of the reference wave A3 thereby preparing a phase difference-stress characteristic. Then, a characteristic curve of an object is measured actually when an unknown stress works and a cyclic deviation of an actual measure ment curve from the cycle of the characteristic curve A1 determined by the theoretical analysis is obtained as a phase difference of the reference wave A3. This enables the determination of a stress based on the phase difference-stress characteristic previous ly made from the phase difference.
Patent JP-H01102117-A (JP)
Title: Collection of floating substance in river or the like
Inventor: HABUNO HITOSHI
IPC: E02B5/00
Filed: 1987-10-16
Abstract: PURPOSE:To collect floating substances such as wood chips, dust, oil, etc., or soil deposits by providing a hook-shaped stagnating corner in the river or river mouth. CONSTITUTION:A number of hook-shaped stagnating corners A are formed in the river or its mouth by using sheet pile, caisson revetment, float fence, etc. Wood chips, dust, oil, etc., as floating substances or soil deposits flowing down the stream of river water can thus be collected into the corners by means of swirl flow formed by the stagnating corners A.
Patent JP-H07114899-A (JP)
Title: Method and device for fine working sample surface
Inventor: KUSUMOTO OSAMU
IPC: H01J37/28
Filed: 1993-10-18
Abstract: PURPOSE:To perform working a fine region of a sample surface in good repeatability. CONSTITUTION:While applying a current between the point end part of a probe 1 and the surface of a sample 10, the point end part of the probe 1 is brought into contact with the surface of the sample 10, and a temperature of a fine region in the surface of the sample 10 is locally increased to perform fine working. A voltage source 12 having a function of limiting the current is used, to limit the current, flowing between the point end part of the probe 1 and the fine region in the surface of the sample 10, to a prescribed value or less, and melting the probe 1 and its deformation due to this melting by the excessive current are extremely decreased.
Patent JP-S63115657-A (JP)
Title: Continuous casting method for steel containing silicon
Inventor: MIYAHARA SHINOBU
IPC: B22D11/124
Filed: 1986-10-31
Abstract: PURPOSE:To enable the continuous casting of high Si steel and to improve the productivity by specifying cooling velocity and temp. of cast slab surface at the time of solidifying at the prescribed depth from the cast slab surface. CONSTITUTION:At the time of continuously casting the steel containing 4-7 wt.% silicon, the cast slat is cooled, so as to become >= 1 deg.C/sec cooling velocity at the time of solidification for the cast slab surface layer part, which is <=10 mm from the surface of cast slab, and held to >= 600 deg.C the surface temp. of cast slab. At the time of continuously casting the cast slab under this condition, the ferritic crystal grain size of the cast slat surface layer part is made to <= 10mum, and in case of impressing bending and straightening stresses, the surface cracking is not developed.
Patent JP-S62121472-A (JP)
Title: Developing device for electronic copying machine
Inventor: TSURUTA HIRONORI
IPC: G03G15/08
Filed: 1985-11-21
Abstract: PURPOSE:To uniformly let toner fall in a developing device housing by forming a long-sized toner falling hole crossing the formation direction of a spiral for conveyance which is formed in an auger. CONSTITUTION:The auger 24 for toner conveyance is arranged in a guide groove 22 formed in a sleeve 18 for toner conveyance and its shaft part 24a is coupled with a rotary transmission mechanism. The auger 24 rotates by the driving of a developing device 10 to send toner T put in a hopper 26 as shown by an arrow while mixing and dispersion it in the direction of the spiral 24b formed in the outer periphery of the auger 24, so that the toner T falls successively in the housing 14 from plural toner falling holes 28 arrayed in the bottom part of the guide groove 22. The toner falling holes 28 are formed in a long-size shape and arrayed regularly at specific intervals while crossing the direction of the spiral 24b at a specific angle theta of intersection.
Patent JP-H02112437-A (JP)
Title: Pily cloth
Inventor: KANBARA YOICHI
IPC: D03D27/00
Filed: 1988-10-14
Abstract: PURPOSE:To provide the title cloth freed from poor appearance due to fluff falling in forms therefrom, comprising raised part consisting of polyester and polyamide fibers and raise-supporting part consisting of a specific synthetic fiber. CONSTITUTION:The objective cloth comprising (A) raised part consisting of polyester fiber (made from polyethylene terephthalate or a copolyester made up of ethylene terephthalate unit and other recurring unit) and polyamide fiber (66 nylon fiber or other copolyamide fiber) and (B) raise-supporting part (ground part) consisting of a synthetic fiber 135-165 (pref. 135-155) deg.C in maximum shrink temperature (e.g., polyvinyl chloride fiber).
Patent JP-2000091466-A (JP)
Title: Semiconductor package
Inventor: TANAKA HIROBUMI
IPC: H01L23/12
Filed: 1998-09-14
Abstract: PROBLEM TO BE SOLVED: To obtain a PGA package having superior high frequency signal transmission characteristics and high reliability and containing superior mass production property, by a method wherein a semiconductor element mounting face is sealed airtightly with a metal can. SOLUTION: A semiconductor element mounting semiconductor package has a microstrip structure formed with a copper wiring via an insulation layer. Then, a semiconductor element mounting face 4 is sealed airtightly with a metal can 9. In this way, the microstrip structure enables control of the characteristic impedance of a package. Furthermore, since the semiconductor element is mounted on the metal substrate 3 having a superior heat diffusion, it is hard for heat to be accumulated in the package. Furthermore, since, after the semiconductor element is mounted, it is sealed airtightly with the metal can 9, high frequency signal transmission characteristics of the package are enhanced and also dampproof effects are enhanced. Moreover, since miss-match of thermal expansion does not occur, it is possible to attain satisfactory temperature cycle property.
Patent JP-H1197603-A (JP)
Title: Lead cutter
Inventor: IKURA JIYUNJI
IPC: B21D28/00
Filed: 1997-09-25
Abstract: PROBLEM TO BE SOLVED: To prevent production of defective products due to residue clogging by forming a taper for bending unwanted leads to be cut at the opening top of a die, and forming cutting blades at the sides of a punch and die where outer leads are cut and left. SOLUTION: A die 2 has a taper 2A for bending unwanted leads to be cut at the top of opening 3. A punch 4 and the die 2 have cutting blades at the sides where outer leads are cut and left. A lead frame having a package 10 contg. a sealed semiconductor pellet is set in a pad 1 and the die 2, upper die is lowered to fix the lead frame with the pad 1, a punch 4 is lowered to cut leads of a product with leaving outer leads 5A and depress and bend down unwanted leads 5B of the frame. This permits tests to be executed at later steps, without producing dust from cutting.
Patent JP-H01102612-A (JP)
Title: Clock control system
Inventor: SUZUKI SHINOBU
IPC: G06F1/06
Filed: 1987-10-14
Abstract: PURPOSE:To improve the designing freedom degree of a mask pattern and to realize the stable working of a clock control system by supplying the output of a circuit which detects the superposition of clocks to a clock width control circuit for deletion of the superposition of waveforms of a multi-phase clock. CONSTITUTION:A clock is supplied to a clock generating circuit 1 and the output of the circuit 1 is supplied to a clock width control circuit 2 for outputting clocks 1 and 2. Both clocks 1 and 2 are supplied to a detecting circuit 3 through wirings. If the waveforms of both clocks overlap each other, the circuit 3 changes the output of the mask signal to a high level from a low level. Then the circuit 2 using the mask signal as an input receives the change of the mask signal and changes the waveforms of both clocks 1 and 2 to eliminate the superposition of waveforms of both clocks. As a result, the designing freedom degree is improved for a mask pattern together with no malfunction secured for an IC.
Patent JP-H03209210-A (JP)
Title: Head-up display, wedge type front glass and assembly of wedge type front glass
Inventor: RONARUDO SUMISU
IPC: B32B17/10
Filed: 1990-09-28
Abstract: PURPOSE: To eliminate ghost by projecting the beam of image light toward a front glass so that it is reflected to a preliminarily determined visual area or sight in an automobile. CONSTITUTION: A PVB(polyvinyl butyral) layer having certain thickness is arranged between two front grass singlets and this assembly is laminated in a front glass autoclave to produce a front glass 40'. When the PVB formed to a wedge is used to make the front glass 40' laminated, the wedge is accurately selected for an HUD(head-up display) system so that images reflected by an inside surface 42' and an outside surface 44' accurately coincide with each other. Thus, a ghost image is eliminated.
Patent JP-H0679250-A (JP)
Title: Compressing method for paper cut by shredder
Inventor: KATONO SATORU
IPC: B02C18/06
Filed: 1992-09-04
Abstract: PURPOSE:To provide the method for compressing paper cut by a shredder which can compress the cut paper discharged from the shredder to a compact lump having a small restoration rate and extremely facilitates a discarding treatment. CONSTITUTION:Water or water mixed with a surfactant is poured onto the paper cut by the shredder to fine band shapes. The paper which is cut by the shredder and is poured with the water is wound and rolled around a take-up shaft 10. The take-up shaft 10 is removed from the roll and the roll is compressed by a pusher 40.
Patent JP-H02150259-A (JP)
Title: Meat dumpling like food
Inventor: HOASHI CHIKAKO
IPC: A23L35/00
Filed: 1989-10-05
Abstract: PURPOSE:To obtain a meat dumpling like food capable of cooking so as to sufficiently roast while retaining beautiful appearance and flavor of ingredients regardless of the degree of skill of a cook by wrapping ingredients wrapped with an edible film in a wheat flour sheet. CONSTITUTION:Ingredients 2 such as meats, vegetables, etc., are wrapped with an edible film (preferably collagen film) 3 and further with wheat flour sheet 4 to provide the meat dumpling like food 1.
Patent JP-H10339666-A (JP)
Title: Pyroelectric infrared detector
Inventor: TAKADA YUJI
IPC: G01J1/44
Filed: 1997-09-25
Abstract: PROBLEM TO BE SOLVED: To enhance the S/N ratio while reducing the size of a detector by connecting a pyroelectric element with an operational amplifier additionally connected with an AC feedback circuit and a DC feedback circuit thereby constituting a current/voltage conversion circuit and constituting the AC feedback circuit of another pyroelectric element. SOLUTION: A first pyroelectric element 1 is grounded at one end and connected, at the other end thereof, with the inverted input terminal of an operational amplifier 2. A second pyroelectric element 1' is connected, as a feedback capacitor Cf, between the input and output terminals of the operational amplifier 2 in order to constitute an AC feedback circuit. A DC feedback circuit 3 for stabilizing the circuit operation in the low band is also connected between the input and output terminals of the operational amplifier 2 and the output therefrom is fed back through an input resistor Ri. According to the arrangement, the S/N ratio is enhanced by a factor of about 2 as compared with a case employing an FET buffer and noise reduction can be attained with same element sensitivity.
Patent JP-H07112406-A (JP)
Title: Excess adhesive removing method at wood joint
Inventor: NAKAHARA SHIGEYA
IPC: B27D1/10
Filed: 1993-10-19
Abstract: PURPOSE:To remove the hindrance in the following process by rapidly removing excess adhesive by a method wherein the excess adhesive, which overflows from the joint at the pressure bonding of the end of one wood to the end of another wood through adhesive, is scraped off. CONSTITUTION:When one wood 5, which is pressed with a press frame against the bearer of a wood jointing machine or concretely has a finger at its end, is engaged with another wood 5, which is fed next and has a finger at the tip coated with adhesive, so as to be press against each other, excess adhesive overflows from the periphery of the joint part together with joining. The excess adhesive is removed with the adhesive remover 20 provided close to the wood jointing machine. The adhesive remover 20 consists of upper and lower scraper rollers 19 such as brush rollers, rollers having a plurality of scraping blades or the like rotating in the directions indicated by the arrows, a heating means consisting of heating rollers 21 arranged in vertical pairs and driving means 24. When bonded woods 5 are fed in the device concerned, excess adhesive is scraped off with the scraper rollers 19 and, in succession, further scraped off and heated with the heating rollers 21 so as to be dried.