baber/WOPTO huggingface dataset:
Patent TW-201215665-A (TW)
Title: Silicophosphate phosphors
Inventor: WINKLER HOLGER
IPC: C09K11/81
Filed: 2011-09-13
Abstract: The invention relates to compounds of the general formula I (Ba1-a-bSraEub)2+x(Lu1-c-dYcGdd)2-x(PO4)2+x(SiO4)1-x (I) where b stands for a value from the range 0< b ≤ 0.2 a, c, d stand, independently of one another, for a value from the range from 0 to 1 x stands for a value from the range from 0 to 0.8, and to a process for the preparation of these phosphors and to the use thereof as conversion phos-phors or in lamps.
Patent TW-201314455-A (TW)
Title: Memory storage device, memory controller, and temperature management method
Inventor: CHU CHIEN-HUA
IPC: G06F1/20
Filed: 2011-09-22
Abstract: A temperature management method suitable for a memory storage device having a rewritable non-volatile memory module and a memory controller used for controlling the rewritable non-volatile memory module is provided. The temperature management method includes detecting and determining whether the hot-spot temperature of the memory storage device is higher than a predetermined temperature; and if yes, making the memory controller execute a cooling process, so as to reduce the temperature of the memory storage device. Accordingly, the problem of accumulating heat of the (rewritable non-volatile) memory storage device can be mitigated, and then the problems of data loss and ageing of the (rewritable non-volatile) memory storage device also can be mitigated.
Patent TW-201314545-A (TW)
Title: A dual mode tablet and the method of the signal detect and the switch mode
Inventor: WU WEN-TAI
IPC: G06F3/033
Filed: 2011-09-23
Abstract: A dual mode tablet and the method of the signal detect and the switch mode applies to the tablet that has an electromagnetic induction module and an touch sensitive module. The method comprises of the steps. The antenna module couples to the electromagnetic induction module. The micro-processor receives an electromagnetic signal via the electromagnetic induction module. After the electromagnetic induction module receives the electromagnetic signal, the touch sensitive module couples to the antenna module. When the tablet receives the touch signal, the antenna module couples to the electromagnetic induction module or the touch sensitive module by sequence. When the micro-processor detects the electromagnetic signal, the antenna module couples to the electromagnetic induction module and the micro-processor receives the electromagnetic signal until the electromagnetic signal has been finish.
Patent TW-201227798-A (TW)
Title: Discharge lamp
Inventor: SHIMIZU YASUO
IPC: H01J61/073
Filed: 2011-11-03
Abstract: Disclosed is a discharge lamp which is provided with: a pair of electrodes that are arranged so as to face each other in a discharge tube; and a pair of electrode supporting rods that support the electrodes. The discharge lamp is configured such that at least one electrode or one electrode supporting rod comprises a heat transferring body, which is molded from a material that has a higher thermal conductivity than metals and is composed of particulate or fibrous carbon, and the heat transferring body integrally constitutes at least a part of the electrode or electrode supporting rod.
Patent TW-201319808-A (TW)
Title: Read and encryption mechanism for IC
Inventor: LIN CHIEN-LIANG
IPC: G06F12/14
Filed: 2011-11-04
Abstract: An IC read mechanism and encryption mechanism thereof. The mechanism includes determine a check-code according to a source code of an IC and a rule, wherein said check-code has a predetermine length; and compare a data of an external device and the check-code, wherein, the IC dumps the source code to the external device if the part of the data consists with the check-code.
Patent TW-201219602-A (TW)
Title: Method for manfacturing positive electrode collector for non-aqueous electrolyte secondary battery and method for manfacturing positive electrode for non-aqueous electrolyte secondary battery
Inventor: AKIYAMA DAISAKU
IPC: C23F1/36
Filed: 2011-11-11
Abstract: The present invention provides a method for manufacturing a positive electrode collector, for a non-aqueous electrolyte secondary battery, capable of enhancing electron conductivity between an active material and the collector, and a method for manufacturing a positive electrode for a non-aqueous electrolyte secondary battery. The method for manufacturing a positive electrode collector for a non-aqueous electrolyte secondary battery of the present invention is a method for manufacturing a positive electrode collector for a non-aqueous electrolyte secondary battery, wherein a surface of a collector substrate made by an aluminum is subjected to a roughening treatment by an etchant. The method of the present invention is characterized in that the etchant is selected from one or more kinds of an alkali aqueous solution etchant comprising an alkali source and an amphoteric metal ion, and a ferric ion aqueous solution etchant comprising of a ferric ion source, a cupric ion source, a manganese ion source and an inorganic acid.
Patent TW-201321929-A (TW)
Title: Manufacturing method of cover
Inventor: HUANG HUI-WEN
IPC: G06F3/041
Filed: 2011-11-23
Abstract: A manufacturing method of cover includes following steps. First, a substrate is provided and a first cutting process is proceeded to define a cover predetermined area on the substrate, wherein a boundary of the cover predetermined area includes a cut part and an uncut part. After that, a strengthening process for the substrate is proceeded, and then a patterned film is formed on the cover predetermined area. Afterwards, a second cutting process is proceeded to cut the uncut part of the cover predetermined area.
Patent TW-201324843-A (TW)
Title: Manufacturing method of LED
Inventor: LIN CHUNG-HSIN
IPC: H01L33/02
Filed: 2011-12-09
Abstract: A manufacturing method of LED (light emitting diode) includes the steps of forming an epitaxial structure on a first side of an epitaxial substrate, forming a reflective layer on the epitaxial structure, forming a first bonding layer on the reflective layer, providing a conductive substrate, forming a second bonding layer on the conductive substrate and bonding the conductive substrate on the reflective layer due to the first bonding layer and the second bonding layer, removing part of the epitaxial substrate and the epitaxial structure from a second side of the epitaxial substrate to form at least one groove, separating the epitaxial substrate and the epitaxial structure and forming an isolated trench between the epitaxial structure and the reflective layer is exposed by the isolated trench.
Patent TW-201238007-A (TW)
Title: Nonvolatile semiconductor memory device
Inventor: TAKASU HIROAKI
IPC: H01L21/8247
Filed: 2011-12-15
Abstract: Provided is an electrically erasable and programmable nonvolatile semiconductor memory device whose tunnel region formed in the drain region has the second conductivity-type low-impurity-concentration region with the first tunnel insulating film for solely injecting electrons disposed thereon, and the first conductivity-type low-impurity-concentration region with the second tunnel insulating film for solely ejecting electrons disposed thereon, both regions fixed to the same potential as the drain region and having a lower impurity concentration than that of the drain region.
Patent TW-201318550-A (TW)
Title: High-power high-voltage inverter power unit
Inventor: TONG AI-XING
IPC: H02M5/04
Filed: 2012-01-04
Abstract: The present invention provides a high voltage inverter power unit, which comprises: a rectifier module, for rectifying the three-phase AC input voltage to get a DC voltage; a IGBT inverter, connected to a capacitor, for converting the DC voltage into an AC voltage having an adjustable frequency, amplitude and phase; a bypass module, connected to the IGBT inverter, for providing the bypass function when the IGBT inverter works in abnormal state; and a heat pipe sink having a heat dissipation substrate, both sides of which are power elements of the high voltage inverter.
Patent TW-201302414-A (TW)
Title: Tire vulcanizer
Inventor: AGAWA JIRO
IPC: B29C35/02
Filed: 2012-01-31
Abstract: The objective is to provide a tire vulcanizer capable of securing the position of an upper die attachment member or a lower die attachment member, while the height of the upper die attachment member or the lower die attachment member is adjusted with a simple structure. A tire vulcanizer (2) is provided with: a guide frame (5) to support an upper die attachment member (21) and a base frame (26); a securing side rack (6) comprising a plurality of teeth and provided on the guide frame (5) in the height direction of a die (23) comprising an upper die (4) set on the upper die attachment member (21) and a lower die (35) set on the base frame (26); a movable side rack (7) provided on the upper die attachment member (21) and comprising a plurality of teeth which mesh with the securing side rack (6); and an air cylinder to move the movable side rack (7) in the height direction of the die (23) relative to the upper die attachment member (21) while the height of the upper die attachment member (21) is maintained to be constant.
Patent TW-201332757-A (TW)
Title: Punch power devices
Inventor: TSAI HIS-NAO
IPC: B30B7/00
Filed: 2012-02-06
Abstract: The invention more than punching power devices, the main advantage of continuous output kinetic energy punch the remainder can be utilized for small friction rotation, driven generator re-use purposes, by the motor, pulleys, shafts, pinions, gear, crank shaft, connecting rod, slide the upper die, lower die, bed sets, clutch, and brake components, which set the slider lever, pressing the side group of high lead screw to drive it on the set of generators connected when the slider on the lower lever action to suppress the high lead screw group, the purpose of access to electricity generators.
Patent TW-201241937-A (TW)
Title: Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
Inventor: SADAKA MARIAM
IPC: H01L21/50
Filed: 2012-03-14
Abstract: Methods of bonding together semiconductor structures include annealing metal of a feature on a semiconductor structure prior to directly bonding the feature to a metal feature of another semiconductor structure to form a bonded metal structure, and annealing the bonded metal structure after the bonding process. The thermal budget of the first annealing process may be at least as high as a thermal budget of a later annealing process. Additional methods involve forming a void in a metal feature, and annealing the metal feature to expand the metal of the feature into the void. Bonded semiconductor structures and intermediate structures are formed using such methods.
Patent TW-201342496-A (TW)
Title: Casting mold device for packaging semiconductor elements
Inventor: TSAI WEN-SHAN
IPC: H01L21/56
Filed: 2012-04-06
Abstract: The invention provides a casting mold device for use in packaging semiconductor elements, comprising a first mold, a second mold and a column plunger, wherein the first mold has an encapsulant-filling cavity formed on the opposing two sides respectively as well as multiple first mold cavities, and an opening formed in the first mold with its top and bottom interconnecting with the glue-filling cavities and the multiple first mold cavities. As the opening is formed between the encapsulant-filling cavities and multiple first mold cavities, a minimal gap exists between each of the first mold cavities to enable the encapsulant to be filled therein at the same time, thereby fully encapsulating semiconductor elements therein and thus increasing the packaging quality.
Patent TW-201247173-A (TW)
Title: System and method of measuring a physiological parameter therein
Inventor: CHEN CHIEH-HSING
IPC: G01N33/92
Filed: 2012-04-23
Abstract: A system and method for measuring a physiological parameter with a measurement system including a test strip, an auxiliary measurement device and an electronic device embedded with an application program and furnished with an analog/digital converter unit. The method comprises the following steps: (a) coupling the auxiliary measurement device between the test strip and the electronic device to form a loop; (b) providing a first analog signal according to the application program; (c) applying a voltage to the test strip based on the first analog signal, so as to have the test strip generate a second analog signal; (d) according to an instruction of the application program, transferring the second analog signal into a digital signal; and (e) performing a calculation based on the digital signal to estimate the physiological parameter, so as to measure the physiological parameter.
Patent TW-201345069-A (TW)
Title: Magnetic force self-alignment electric connector assembly
Inventor: PENG SHENG-WEN
IPC: H01R31/06
Filed: 2012-04-27
Abstract: An electrical connector assembly has a first electrical connector and a second electrical connector both of which can be aligned by magnetic force for providing power and/or signal to an electronic device. The first electrical connector has a first magnet, a second magnet and a plurality of contacts, the first and the second magnets being disposed at a first connecting surface to have the magnetic pole of the magnets opposed to each other. The second electrical connector has a plurality of contacts and a positioning magnet, the positioning magnetic being disposed at a connecting surface of the second electrical connector to have the magnetic pole of the positioning magnet oriented identical to that of either the first magnet or the second magnet. In this connection, the positioning magnet can move close to either the first magnet or the second magnet by magnetic force when the first electrical connector and the second electrical connector are connected for an electrical connection.
Patent TW-201348555-A (TW)
Title: Z-shaped steel sheet pile and steel sheet pile wall formed with same
Inventor: USAMI SHUNSUKE
IPC: E02D5/04
Filed: 2012-05-18
Abstract: A Z-shaped steel sheet pile 1 according to the present invention comprises a first flange portion 3 provided with a first joint portion 5 at a front end thereof, and a second flange portion 7 provided with a second joint section 9 at a front end thereof. The Z-shaped steel sheet piles 1 are arranged adjacent to each other and the first joint portion 5 and the second joint portion 9 are set in engagement with each other for connection, thereby forming a steel sheet pile wall 27, characterized in that the first joint portion 5 is provided with a double claw-type joint having a main claw 13 that has a bulge portion 11 and arranged at an inner side of the steel sheet pile and a subsidiary claw 15 that is formed opposite to the main claw 13 and disposed at an outer side of the steel sheet pile. The second joint portion 9 is provided with a double claw-type joint having a main claw 13 that has a bulge portion 11 and arranged at an outer side of the steel sheet pile and a subsidiary claw 15 that is formed opposite to the main claw 13 and disposed at an inner side of the steel sheet pile.
Patent TW-201302598-A (TW)
Title: Device for measuring environmental forces and method of fabricating the same
Inventor: GAMAGE SISIRA KANKANAM
IPC: B81B7/02
Filed: 2012-05-23
Abstract: A device for measuring environmental forces, and a method for fabricating the same, is disclosed that comprises a device wafer (50), the device wafer (50) comprising a first device layer (100) separated from a second device layer (200) by a first insulation layer (150). The first device wafer (50) is bonded to an etched substrate wafer (600) to create a suspended diaphragm (500) and boss (550), the flexure of which is determined by an embedded sensing element (850).
Patent TW-201304601-A (TW)
Title: LED driver circuit
Inventor: KIM HYOUNG-KYU
IPC: H05B44/00
Filed: 2012-06-05
Abstract: An LED driving circuit is disclosed. The LED driving circuit includes an input unit which receives a dimming signal for driving an LED array, a power transistor which performs a switching operation, a DC-DC converter which provides an output voltage to an LED array by a switching operation of the power transistor, a PWM signal generating unit which provides a PWM for adjusting power of the LED array to the power transistor, an LED driving unit which drives the LED array using the dimming signal, and a sensing unit which senses degradation of the power transistor.
Patent TW-201305299-A (TW)
Title: Adhesive, adhesive sheet and laminated body for touch panel
Inventor: KUDO Ryota
IPC: C09J7/00
Filed: 2012-06-25
Abstract: The present invention provides an adhesive for a touch panel, which is formed of metal or metal oxide, has excellent heat resistance, heat and humidity resistance stability, uneven-following capability, and has no corrosivity to the metal or metal oxide, an adhesive sheet and a laminated body use the same. The present adhesive includes: an acrylic copolymer (A), 0.1 to 5 parts by weight of an aliphatic isocyanate cross-link agent (B) with respect to 100 parts by weight of the acrylic copolymer (A), The acrylic copolymer (A) substantially has no acidic groups and has a weight average molecular weight more than or equal to 50, 000 and less than 400, 000, which is obtained by copolymerizing monomers containing the following components (a-1) an alkoxy (meth)acrylate 20 to 99.9 wt%, and (a-2) 0.1 to 10 wt% of a monomer having cross-linkable functional groups.
Patent TW-201401798-A (TW)
Title: Client dynamic multi-route power feed system of an FTTx optical terminal device
Inventor: YE LI-JIA
IPC: H04B10/25
Filed: 2012-06-28
Abstract: Provided is a client dynamic multi-route power feed system of an FTTx optical terminal device. The client dynamic multi-route power feed system of an FTTx optical terminal device integrates Ethernet power supply technology, multi-route dynamic power feed technology, and power management technology, and feeds power from a client home network to the FTTx optical terminal device in order to satisfy power supply requirements of the FTTx optical terminal device outside a machine room, and greatly save construction cost of the FTTx network power supply outside the machine room, thereby achieving the purpose of significantly increasing the broadband service covering range. The system comprises: (1) a network signal processing and DC power supply module of a home network gateway, which feeds power via wires at a network side interface in order to provide remote FTTx optical terminal device power; and (2) a network signal processing and DC power reception module of the FTTx optical terminal device, which provides multi-route power supply input and dynamic load balance from multiple home network gateways.
Patent TW-201306504-A (TW)
Title: Method and apparatus for reducing co-channel interference
Inventor: LINDOFF BENGT
IPC: H04B15/02
Filed: 2012-06-29
Abstract: A method for providing co-channel interference information by a network node includes receiving information for at least one user equipment (UE) connected to an adjacent network node, determining a co-channel interference list for user equipment (UE) connected to the network node wherein the co-channel interference list is based on the received information and transmitting the co-channel interference list to a UE connected to the network node.
Patent TW-201308154-A (TW)
Title: Touch sensor for curved or flexible surfaces
Inventor: YILMAZ ESAT
IPC: G06F3/041
Filed: 2012-07-02
Abstract: The subject application relates to a touch sensor for curved or flexible surfaces. In one embodiment, an apparatus includes a substantially flexible substrate configured to bend at an edge between a first surface and a second surface of a device. The edge has an angle of deviation between the first and second surfaces of at least approximately 45 DEG. The apparatus includes a touch sensor disposed on the substantially flexible substrate and configured to bend with the substantially flexible substrate at the edge between the first and second surfaces. The touch sensor includes drive or sense electrodes made of flexible conductive material configured to bend with the substantially flexible substrate at the edge between the first and second surfaces. The touch sensor has at least one active area on each of the first and second surfaces.
Patent TW-201315030-A (TW)
Title: An electrical connector
Inventor: Qiao yun-long
IPC: H01R12/70
Filed: 2012-07-16
Abstract: An electrical contact comprises a first arm extending along a first direction from a joint to a terminal end, the first arm having a straight inner edge and a constant thickness from the joint to the terminal end; and a resilient second arm extending along a second direction not parallel to the first direction from the joint to a contact end for electrical coupling with a mating electrical contact, the first arm and the resilient second arm each having a flat configuration disposed in a common plane, the resilient second arm being configured to flex along the common plane when the electrical contact is coupled with a mating electrical contact, the resilient second arm having a straight inner edge and a constant thickness from the joint to the contact end, and an outer edge that tapers from the joint towards the contact end.
Patent TW-201318778-A (TW)
Title: Method for producing a coated abrasive; coated abrasive; and use of a coated abrasive
Inventor: SCHOCH ADRIAN
IPC: B24D11/00
Filed: 2012-07-23
Abstract: The invention relates to a method for producing a coated abrasive, which comprises the following steps: (a) producing or providing an intermediate abrasive product, comprising a backing, a multiplicity of abrasive grains, which are bonded to the backing, and also at least one layer of an uncured size coat, which at least partly covers the abrasive grains, the uppermost size coat being uncured; (b) applying at least one grinding aid to the uppermost, uncured size coat; (c) curing the uppermost size coat. In accordance with the invention the grinding aid is applied in step (b) in dry form. Further disclosed are a coated abrasive and also the use of a coated abrasive for working a surface.
Patent TW-201408144-A (TW)
Title: Circuit structure and manufacturing method thereof
Inventor: HUANG SHANG-FENG
IPC: H05K1/11
Filed: 2012-08-08
Abstract: A circuit structure includes an inner circuit layer, a first dielectric layer, a first conductive material layer, a second conductive layer, a second dielectric layer, a second conductive material layer and a third conductive layer. The first dielectric layer covers a first conductive layer of the inner circuit layer and has a first surface and a plurality of first circuit grooves. The first conductive material layer is disposed inside the first circuit grooves. The second conductive layer is disposed on the first surface and includes a signal trace and at least two reference traces. The second dielectric layer covers the first surface and the second conductive layer and has a second surface and a plurality of second circuit grooves. A width of each first circuit groove and a width of each second circuit groove are smaller than a line width of each reference trace. The second conductive material layer is disposed inside the second circuit grooves. The third conductive layer is disposed on the second surface.