Patent SG-11201900139R-A (SG)
Title: Thermally optimized rings
Inventor: SHEELAVANT GANGADHAR
IPC: H01J37/32
Filed: 2017-07-18
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property MD HIM 0 11101 010 11111 01 II 0 0111E011H 010 IRMO 11110 ill 011 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\"1 WO 2018/031200 Al 15 February 2018 (15.02.2018) WIP0 I PCT (51) International Patent Classification: (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- HOM 37/32 (2006.01) C23C 14/34 (2006.01) dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, C23C 14/56 (2006.01) Texas 77046 (US). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/US2017/042493 kind of national protection available): AE, AG, AL, AM, (22) International Filing Date: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 18 July 2017 (18.07.2017) CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (25) Filing Language: English HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, (26) Publication Language: English KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (30) Priority Data: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, 15/233,613 10 August 2016 (10.08.2016) US SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (72) Inventors: SHEELAVANT, Gangadhar; 1353A, Ward GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, No. 3, Sheelavant Street, Guledgudd 587203 (IN). BADU- UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, VAMANDA, Cariappa Achappa; #103, Sunshine Apart-TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, ments, East End D Main Road, 9th Block, Jayanagar, Ban- EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, galore 560069 (IN). VASANTHA, Bopanna Ichettira; MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, = #15, 3rd Cross, 4th Block, Kumara Park West, Bangalore — TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, 560020 (IN). KM, ML, MR, NE, SN, TD, TG). = (54) Title: THERMALLY OPTIMIZED RINGS (57) : A process kit ring for use in a plasma processing system = loo 134 \ --, 131 is disclosed herein. The process kit ring includes an annular body and one \ or more hollow inner cavities. The annular body is formed from a plasma 110 The body has an outer diameter I resistant material. annular greater than = \\\\\\\\\\\\\ 200 mm. The annular body includes a top surface and a bottom surface. — 136 ---\".- = ' The top is to face a plasma processing region of a — — = _ _ = —, 4., \ = 132 --- le ) 128 154 112 / --150 156 101 126 Ti — ' \ ---104 surface configured process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. 106 The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged = , 130 — = IS -- r - 71 \ in a circle within the annular body. — 2 10 = 152 ' ;r . '\" 180 . 1'\"A : i / *k X Vc-ri 122 kr r ,' — 11 71 20 124 111 114 118 . \ 116 W8 144 X /1 / / / / 142 © t. © ei 140 GO ,-1 M O_ FIG. 1 1-1 0 ei O [Continued on next page] WO 2018/031200 Al MIDEDIMOMMIDEFIEHEIDEMIDIONIMOVOIS Published: — with international search report (Art. 21(3))