baber/WOPTO huggingface dataset:
Patent JP-2008070602-A (JP)
Title: Operation type optical filter and display element
Inventor: KAWADA YASUSHI
IPC: G02F1/167
Filed: 2006-09-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electric dimming filter by which a high contrast can be obtained with a simple configuration.  <P>SOLUTION: An electric signal is applied by a power source 16 to a laminar first high molecular gel 4 dispersed with minute particles 18 having black absorptivity to control the amount of the charges getting into and out from the first high molecular gel 4 from and into a second high molecular gel 5 so as to change the volumetric density of the first high molecular gel 4, thereby change the mutual distance of the minute particles 18. The amount of light passage can be varied by the mutual distance of the minute particles 18, and the high contrast can be obtained with the simple configuration without using, for example, a polarizing plate or the like.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008069421-A (JP)
Title: Magnesium alloy for wrought product, sheet material for press forming made of the alloy, and its production method
Inventor: YOSHIMOTO TAKASHI
IPC: C22C23/02
Filed: 2006-09-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a magnesium alloy sheet material whose press formability is improved, to provide a magnesium alloy for extension therefor, and to provide its production method.  <P>SOLUTION: The sheet material for press forming is made of a magnesium alloy comprising aluminum and manganese, and further admixed with zirconium. The sheet material has an alloy structure with the average crystal grain size of ≤10 μm, has a thickness of ≤1 mm, and has a width of ≥150 mm. The sheet material is formed by forming a slab or a sheet bar by subjecting a melted magnesium alloy to continuous casting or extrusion, heating the same at 300 to 400°C, so as to be subjected to homogenizing treatment, next heating the same at 300 to 400°C, subjecting the same to hot rough rolling at the total draft of 90 to 95%, so as to be formed into the rolled sheet with a thickness of 4 to 7 mm, and thereafter performing warm rolling at a heating temperature of 250 to 320°C at a draft of 10 to 30% per heating every time and at one pass-one heat.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008069919-A (JP)
Title: Vibration isolating system
Inventor: OKAZAKI TORU
IPC: F16F15/03
Filed: 2006-09-15
Abstract: <P>PROBLEM TO BE SOLVED: To block vibrations transmitted from a vibrating body to a vibration isolator by using an electromagnetic means, and to provide vibration resistance of the vibration isolator.  <P>SOLUTION: A vibration isolating system comprises the vibrator, the vibration isolator arranged at an upper part of the vibrator, a primary coil fixed on one of the vibrator and vibration isolator and connected with a power supply, and a secondary coil which is fixed on the other of the vibrator and vibration isolator and is a closed circuit by connecting both ends of a superconducting wire. Both ends of the primary coil and secondary coil are oppositely and separably arranged in the axial direction, a magnetic flux for repelling a magnetic flux generated on the primary coil at the time of current-conduction to the primary coil is generated on the secondary coil, and the vibration isolator is floated so as not to transmit vibrations of the vibrator by repelling force.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008076435-A (JP)
Title: Electrophotographic apparatus
Inventor: KAMI HIDETOSHI
IPC: G03G15/01
Filed: 2006-09-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tandem system full-color electrophotographic apparatus which suppresses background stain and can produce a high-quality printed image.  <P>SOLUTION: The full-color electrophotographic apparatus has development stations for two or more colors, adopts a tandem system and allows repetitive image formation using polymerized toners, wherein the value of passage rate (T) expressing a deposit passing through a cleaning blade defined by the expression 1: (passage rate; T)=Σ(image area ratio)×(image density) is in the range of 2-50.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008077697-A (JP)
Title: Semiconductor memory
Inventor: YOSHIHARA MASAHIRO
IPC: G11C11/407
Filed: 2006-09-19
Abstract: <P>PROBLEM TO BE SOLVED: To control the GIDL current by preventing degrading in the reliability of the gate oxide film due to the voltage stress between the gate and source of the P channel transistor when the memory is in a standby state or specific one of the memory cell arrays is inactive.  <P>SOLUTION: This memory has a P-channel transistor PT11 with a gate to receive the output signal bRDOUT from the row decoder, and an N-channel transistor NT11 with a drain connected to the word-line, a source connected to the second word-line potential supply line VWLL supplying a low level potential to the word-line, and a gate connected to the gate of the P-channel transistor. When the word-line drive circuit is inactive by the output signal from the row decoder, the potential of the output signal is lower than the high-level of the word-line and higher than its low level.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008078252-A (JP)
Title: Substrate processor and substrate processing method
Inventor: GODAIIN HIRONORI
IPC: H01L21/3065
Filed: 2006-09-20
Abstract: <P>PROBLEM TO BE SOLVED: To stabilize the state inside a chamber, starting from the beginning of a process to the end in a substrate processor that uses plasma.  <P>SOLUTION: The substrate processor 1 is provided with a chamber 2, where a wafer 10 which is an object of a processing is arranged in the inside, a reactant gas inlet 3 for introducing reactant gas into the chamber 2, a plasma generation device 4 for generating a plasma in the chamber 2, in a state where reactant gas is introduced into the chamber 2 by the reactant gas inlet 3 and a process stabilizing member 20 which is arranged in the chamber 2 and is formed of a material similar to the material generated, when the wafer 10 is etched by plasma generated by the plasma generating device 4 and reactant gas.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008078855-A (JP)
Title: Light guide, lighting system, reading device, and image processor
Inventor: KAWAMURA SATOSHI
IPC: H04N1/04
Filed: 2006-09-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a light guide which can emit the light from an incident plane through a projection plane efficiently.  <P>SOLUTION: The light guide countering an incident plane and a projection plane comprises: a first inner plane arranged so as to incline; a second inner plane arranged so as to be directed reversely to the first inner plane; and a prism which leads light from the incident plane to the projection plane. The angle of gradient to the projection plane of the first inner plane is smaller than the angle of gradient to the projection plane of the second inner plane.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007043186-A (JP)
Title: Printed wiring board and its manufacturing method
Inventor: SATO TSUTOMU
IPC: H05K3/38
Filed: 2006-09-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which a metal plating film in a through hole is not peeled from an electrical insulating material charged in the through hole so that infiltration of humidity is prevented, and a method for manufacturing it.  <P>SOLUTION: The metal plating film 3 is applied to the surface of an insulating substrate 9 and an inner wall of the through hole 90. A roughened surface layer 30 is formed on the surface of the metal plating film 3. The inside of the through hole 90 and the peripheral part of an opening thereof are filled with the electrical insulating material 1 acting as a filling material, and it is cured, and then the electrical insulating material 1 protruded from the surface of the insulating substrate 9 and the roughened surface layer 30 are polished to remove. Then pattern circuits 61 and 62 are formed on the surface of the insulating substrate 9, thereby the printed wiring board 10 is acquired.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008076263-A (JP)
Title: Compound sensor
Inventor: ASHIMORI YOHEI
IPC: G01C19/5628
Filed: 2006-09-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a compound sensor which is miniaturized by reducing the mounted area at the time of detecting angular velocity or acceleration.  <P>SOLUTION: The compound sensor comprises: an angular velocity detection element 10 for detecting the angular velocity; an acceleration detection element 12 for detecting the acceleration; an IC 14 for processing the signal outputted from the acceleration detection element 12 or angular velocity detection element 10; a package 16 for storing the angular velocity detection element 10, the acceleration detection element 12 and the IC 14 which is fixedly arranged therein. The acceleration detection element 12 is arranged on the angular velocity detection element 10, connecting parts 17 are provided in the angular velocity detection element 10 for connecting the angular velocity detection element 10 and the package 16 through the connection parts 17 constituted as elastic means.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008077454-A (JP)
Title: Title extraction device, image reading device, title extraction method, and title extraction program
Inventor: IKEUCHI TAKENOBU
IPC: G06F17/30
Filed: 2006-09-22
Abstract: <P>PROBLEM TO BE SOLVED: To precisely extract a character string having no exterior features on a document image as a title.  <P>SOLUTION: A title extraction device includes an extraction requirement acquisition part 31 for acquiring a keyword character string described near a title character string on a document image and relative location information of the title character string corresponding to the keyword character string, a character recognition part 33 for recognizing each character in a region including the title character string and the keyword character string in the document image, a keyword retrieving part 34 for retrieving the keyword character string from the recognition result to acquire the location, a title location acquisition part 35 for acquiring a location of the title character string from the acquired location of the keyword character string and the relative location of the title character string corresponding to the keyword character string, and a title output part 36 for outputting title character string data from the acquired location of the title character string.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008078591-A (JP)
Title: Semiconductor wafer polishing method and apparatus
Inventor: KURAMOCHI SHINICHI
IPC: B24B37/07
Filed: 2006-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing method and a semiconductor wafer polishing apparatus that can surely detect the polishing end point.  <P>SOLUTION: A spindle 6 holds a semiconductor wafer W on which a pattern 50 having a periodicity is formed at the polishing end point of a layer to be polished, and a rotating table 2 is provided with a polishing pad 4 on a surface thereof. A polishing method polishes the semiconductor wafer W by bringing the layer to be polished into contact with the polishing pad 4 while rotating the spindle 6 and the rotating table 2 respectively. The periodicity of the pattern 50 is determined so as to produce resonance by adding oscillations that occur when the pattern 50 reaches the polishing pad 4 to oscillations that occur when the spindle 6 and the rotating table 2 are rotating.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008083915-A (JP)
Title: Image output system, server, image output device, and program
Inventor: IDEUSHI YASUKO
IPC: G06Q30/06
Filed: 2006-09-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image output system for enabling a customer to conveniently and validly use a coupon, and for promoting the reuse of the customer.  <P>SOLUTION: A user(customer) holds a portable telephone 107 or a receipt 109 on a two-dimensional code reader 309. A control part 501 of an image output device 105 transmits coupon data 327 read from the two-dimensional code reader 309 to a server 101 (step S21). A control part 201 of the server 101 collates coupon data 327 with customer information data 800 (step S22), and when they are matched (step S23: Yes), the image output device 105 performs image data processing (step S27).  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007098948-A (JP)
Title: Rapid prototyping and manufacturing system and method
Inventor: WAHLSTROM BEN
IPC: B29C67/00
Filed: 2006-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To enhance the precision of constructed matter by keeping a recoater parallel to the surface of a resin in a stereolithography apparatus equipped with the recoater extending in a longitudinal direction and the carrier for the recoater.  <P>SOLUTION: The recoater has a blade 42 having the front, the back, the top and the base, a flat base 60, which is a leg part 56 for detecting a blade gap at each of the end parts of the blade 42, extends from the front laterally or outwardly and has the same height as the base of the blade 42, and the leg part 56 which has a tapered top surface 58 provided to its terminal from the blade 42 to the thin blade interval detection part of the top surface 58 of the leg part 56. The distance from the surface 112 of a liquid resin to the top surface 58 of the leg part 56 can be detected by the sensor 56 connected to the detection part of the leg part 56.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008087560-A (JP)
Title: Maintenance structure of lamp
Inventor: MARUYAMA TOMOKAZU
IPC: B62J23/00
Filed: 2006-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an opening for maintenance of a bulb of a headlight capable of securing degree of freedom in design, improving maintenance performance.  <P>SOLUTION: A left and a right separate lamp units 25A and 25B are respectively provided with a bulb 51 for a headlight, a bulb 52 for a position light and a bulb 53 for a blinker, and a vertical wall part 120 of a leg shield 22 in rear of each lamp is provided with a left and a right maintenance holes 145 and 147, and a decorative panel 30 is provided to cover all of them. An opening 134 is provided on a left side of the left maintenance hole 145, and a housing portion 133 is fitted to the opening 134 for reinforcement. A key cylinder 125 is provided near the right maintenance hole 147 as a common opening for maintenance.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007053392-A (JP)
Title: Method of manufacturing mis field effect transistor and method of manufacturing semiconductor memory device
Inventor: YAMAGUCHI TAKESHI
IPC: H01L21/316
Filed: 2006-10-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an MIS field effect transistor using a metal oxide the defect of which is hardly caused and which has high resistance to hydrogen and water as a gate insulating film.  <P>SOLUTION: A method of manufacturing an MIS field effect transistor comprises processes of: forming a metal oxide film on a silicon substrate; forming a gate electrode on the metal oxide film; and introducing fluorine into the metal oxide film. A Hf oxide or an Al oxide is used as the metal oxide film. For example, an introduction of fluorine into the metal oxide film is performed by introducing fluorine or ions including fluorine into the silicon substrate prior to formation of the metal oxide film on the silicon substrate, and then by heat-treating the silicon substrate after forming the metal oxide film in order to diffuse fluorine from the silicon substrate into the metal oxide film.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008091714-A (JP)
Title: Semiconductor device
Inventor: HAGA MOTOHARU
IPC: H01L23/36
Filed: 2006-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of efficiently radiating heat generated from a semiconductor chip to the outside.  <P>SOLUTION: The semiconductor device 1 is provided with an insulating substrate 5 composed of insulating resin. An island 6 composed of a metallic material having heat conductivity is formed on one surface 5A of the insulating substrate 5. The rear face of a semiconductor chip 3 is joined with the island 6. A thermal pad 9 composed of the same metallic material as that of the island 6 is formed on the other surface 5B of the insulating substrate 5. A thermal via 11 for heat-conductively connecting the island 6 and the thermal pad 9 is formed between the island 6 and the thermal pad 9 on the insulating substrate 5. A solder resist 18 having a radiating aperture part 21 is formed on the other surface 5B of the insulating substrate 5 and the thermal pad 9 is exposed from the radiating aperture part 21.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007043196-A (JP)
Title: Electronic circuit device
Inventor: KAWAKAMI KAZUHIKO
IPC: H01L25/18
Filed: 2006-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an on-vehicle electronic circuit device free from thermally stressed boundary separation of a molding resin, from a circuit board, a base, and a lead frame, and free from cracking in the resin and low in cost.  <P>SOLUTION: The electronic circuit device is provided with: an electronic circuit assembly (5) having an electronic circuit element (6) including a semiconductor chip, and the circuit board (7) on which the electronic circuit element is mounted and a circuit pattern is formed; a base (2) to which the electronic circuit assembly is adhered, and a flange portion (2d) is prepared outside the mounting region of the electronic circuit assembly; and a lead terminal (3a) which is connected electrically to the electronic circuit assembly, and formed of a material having a higher coefficient of thermal expansion than that of the base. The electronic circuit assembly, the base and the lead terminal are integrally molded by the molding resin (4), with the exception of a part of the flange portion and the lead terminal.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008098564-A (JP)
Title: Manufacturing method of electronic device, and semiconductor device
Inventor: ITO HARUKI
IPC: H01L21/60
Filed: 2006-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide an efficient manufacturing method of an electronic device with high reliability, and to provide a semiconductor device excellent in mounting capability.  <P>SOLUTION: The method of manufacturing an electronic device comprises: a process for preparing a semiconductor device 1 having a semiconductor chip 10 wherein an electrode 14 is formed, two or more first portions 21 formed in the surface 15 of the semiconductor chip 10, a resin projection 20 which is arranged between the first portions 21 and includes second portions 22 whose height is lower than that of the first portion 21, and wiring 40 which has an electric connection area 42 arranged on the first portion 21; a process for preparing a wiring substrate 50 having a base substrate 52 and a wiring pattern 54; and a process for mounting the semiconductor device 1 in the wiring substrate 50 and for carrying out electric connection by bringing the electric connection area and the wiring pattern in to contact. In the process for mounting the semiconductor device in the wiring substrate, the second portion 22 is brought into contact with the wiring substrate 50, after bringing the electric connection area and the wiring pattern into contact.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007150268-A (JP)
Title: Light emitting device
Inventor: SUEHIRO YOSHINOBU
IPC: F21V29/00
Filed: 2006-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a light emitting device that can cope with high power and is equipped with a radiator excellent in radiation property.  <P>SOLUTION: The device is excellent in productivity in the radiator 3, because it forms a portion with a certain thickness by laminating sheets, by integrating a radiation plate 30 formed of a plate material of high thermal conductivity at a caulked section 31. In addition, the radiator 3 having a proper radiation property in accordance with the number of use of LED's 20 and calorific value can be manufactured, because the number of the radiation plates 30 can be increased or decreased and the shape of a radiation can be changed easily in accordance with desired radiation characteristics.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008102619-A (JP)
Title: Circuit generation system, circuit generation method and circuit generation program
Inventor: AOYAMA TETSUYA
IPC: G06F17/50
Filed: 2006-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a circuit generation device for automatically generating a power control circuit.  <P>SOLUTION: This circuit generation system is provided with an operation compounding means (111) for generating composite accessary information and RT level circuit information based on operation level description information in which information relating to a circuit is described in program language and a power control circuit generation means (112) for generating a power control circuit based on the composite accessary information, and for connecting the generated power control circuit to the RT level circuit of the RT level circuit information.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008101954-A (JP)
Title: Magnetic sensor element
Inventor: OSADA SEIICHI
IPC: G01R33/09
Filed: 2006-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a small-sized magnetic sensor element capable of outputting a plurality of periodic signals indicating a relative displacement, based on the relative displacement with respect to a magnetic field generating member.  <P>SOLUTION: This magnetic sensor element 22 is provided with a plurality of magnetoresistant elements 26 comprising a pair of thin film yokes 30, 32 fixed onto a common substrate 28, comprising a soft magnetic material and arranged with a prescribed space, and a GMR film 34 formed to connect electrically the paired thin film yokes 30, 32 in a space between the paired thin film yokes 30, 32. The plurality of the magnetoresistant elements 26 are not required to be provided with a ferromagnetic layer (fixed layer) for imparting preliminarily magnetization directions different individually. The plurality of the magnetoresistant elements 26 are integrally constituted thereby with the thin film yokes 30, 32, the GMR film 34 and an electric wire, on the common substrate 28, using common thin film formation and photolithography, to reduce the size by the integration.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008101959-A (JP)
Title: Substrate jig board and substrate test-use jig unit embedding the same
Inventor: NAKAJIMA KENTARO
IPC: G01R31/28
Filed: 2006-10-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a substrate jig board which simultaneously fixes a plurality of substrates to be tested, brings them to suitably respond to an in-line automatic conveyance, and prevents them from breaking even when a test head contacts therewith, and to provide a substrate test-use jig unit embedding the same.  <P>SOLUTION: The substrate jig board 11 is composed of: a board main body 12 having a plurality of test-use aperture sections 13 aligned in its column direction in order to mount the substrate to be tested 101 so as to be positioned separately; and a substrate fixing mechanism 22 disposed at the board main body 12 so as to simultaneously press corner 102 sides of the substrate to be tested 101 mounted on the test-use aperture sections 13. Furthermore, the substrate test-use jig unit is composed of: the substrate jig board 11; and a substrate holder having an aperture section which contacts with a portion area side to be tested this time in the substrate to be tested 101 and exposes it.  <P>COPYRIGHT: (C)2008,JPO&INPIT