Patent SG-11201805848V-A (SG)
Title: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
Inventor: SIROCKA NATHAN
IPC: H01L25/07
Filed: 2017-01-05
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, Organization IIIM141101110101011111 HO 111110111011101111001111111011111110111011111 International Bureau ... .... ..Yjd (10) International Publication Number ..... ...,/ (43) International Publication Date WO 2017/123456 Al 20 July 2017 (20.07.2017) WIPO I PCT (51) International Patent Classification: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, H01L 25/065 (2006.01) HO1L 23/538 (2006.01) BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, H01L 25/07 (2006.01) H01L 23/00 (2006.01) DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, (21) International Application Number: KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, PCT/US2017/012383 MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, (22) International Filing Date: NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, 5 January 2017 (05.01.2017) RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, (25) Filing Language: English ZA, ZM, ZW. (26) Publication Language: English (84) Designated States (unless otherwise indicated, for every (30) Priority Data: kind of regional protection available): ARIPO (BW, GH, 14/995,925 14 January 2016 (14.01.2016) US GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, (71) Applicant: MICRON TECHNOLOGY, INC. [US/US]; TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006 DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, (US). LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, (72) Inventors: SIROCKA, Nathan, J.; 10755 Sunrise Ridge SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, Circle, Auburn, CA 95603 (US). TANADI, Trismardawi; GW, KM, ML, MR, NE, SN, TD, TG). 9542 Harvest View Way, Sacramento, CA 95827 (US). Published: PROESCHOLDT, Andrew, D.; 11205 Platte River — with international search report (Art. 21(3)) — Court, Rancho Cordova, CA 95670 (US). — — before the expiration of the time limit for amending the = (74) Agents: PARKER, Paul, T. et al.; Perkins Coie LLP, P.O. claims and to be republished in the event of receipt of = Box 1247, Seattle, WA 98111-1247 (US). amendments (Rule 48.2(h)) for every (81) Designated States (unless otherwise indicated, kind AE, of national protection available): AG, AL, AM, DUPLICATED DIE BOND PADS AND ASSOCIATED DEVICE PACKAGES (54) Title: SEMICONDUCTOR DEVICES WITH — AND METHODS OF MANUFACTURE = = 210 -Th 214 --? 4 - --2141, ,,,. Da 1 3, = KJ- = DO5 63- - ---_ . ; 2 1 12..J--...._477 - = 250 2 -----, 225 I 1 - -2126 = w _ DQ4} (06 DDJ- = INTEGRATED CIRCUIT _ D292 C6 — NaJ DC171 232 Nt2- —la- - 232 { DO6 o---..,___ 22 . v.) ___,...--227 DO7 02- - --,_, 26 FYI 224--- ----E' 224 -- -- \"' -e' k n ii- = DM 231 227 --- --11 227-- -- IV ' 4 (SE9 '----- 2/40 Fig. 2 214d M L I (57) : Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semicon- ductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads C having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably N coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond en. ) pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.