baber/WOPTO huggingface dataset:
Patent TW-202144736-A (TW)
Title: Method, system and apparatus for uniformed surface measurement
Inventor: CHEN CHAO-CHANG
IPC: G01B21/30
Filed: 2020-05-29
Abstract: This invention discloses a system and a method for uniformed surface measurement, in which a sensor is disposed to measure a carrier member of a polishing machine, and by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine to adjust a measurement trajectory of the sensor on the surface of the carrier member to achieve uniformed surface measurement of the carrier member and timely construction of the surface topography, and to achieve timely monitoring of the polishing state of the carrier member, thereby reducing the cost of replacing the carrier member in the polishing 
process. This invention also discloses a sensor apparatus for uniformed surface measurement.
Patent TW-202107542-A (TW)
Title: Heat treatment method
Inventor: KAWARAZAKI HIKARU
IPC: H01L21/265
Filed: 2020-06-02
Abstract: A semiconductor wafer is heated by a flash of light emitted from a flash lamp after being preheated by a halogen lamp. Temperature of the semiconductor wafer immediately before the flash of light is emitted is measured by a lower radiation thermometer. At the time of irradiation with a flash of light, an upper radiation thermometer measures temperature increase of a front surface of the semiconductor wafer. This enables accurate measurement of front surface temperature of a substrate at the time of irradiation with a flash of light. The first radiation thermometer preferably has a light receiving angle of 60 DEG or more and 89 DEG or less with respect to the substrate. This enables more accurate measurement of front surface temperature of a substrate at the time of irradiation with a flash of light by measuring accurately temperature of the back surface of the substrate with the first radiation thermometer regardless of a type of film on the back surface. Front surface temperature of the semiconductor wafer is calculated by adding the temperature increase of the front surface of the semiconductor wafer at the time of irradiation with a flash of light measured by the upper radiation thermometer to the back surface temperature of the semiconductor wafer measured by the lower radiation thermometer.
Patent TW-202201424-A (TW)
Title: Medicine placement and photography apparatus, medicine identification apparatus, and medicine identification system
Inventor: SU MU-CHUN
IPC: G06K9/62
Filed: 2020-06-17
Abstract: The medicine placement and photography apparatus includes a housing, a medicine placement layer, a first camera module, a second camera module, a single board computer, and an output unit. The medicine placement layer, the first camera module, and the second camera module are arranged in the housing. The medicine placement layer has a top surface and a bottom surface. The first camera module faces the top surface, and the second camera module faces the bottom surface. When at least one 
medicine is placed on the medicine placement layer, the first camera module captures a first image of the at least one medicine and the second camera module captures a second image of the at least one medicine. The medicine identification apparatus receives the first image and the second image and inputs them into a machine learning model to determine an identify result of the least one medicine.
Patent TW-202114178-A (TW)
Title: Semiconductor memory device and method of manufacturing semiconductor memory device
Inventor: KIKUSHIMA FUMIE
IPC: H01L27/11551
Filed: 2020-07-09
Abstract: A semiconductor memory device includes a substrate, a plurality of first conductive layers, a second conductive layer, a first pillar, and a second pillar. The plurality of first conductive layers are stacked over the substrate in a first direction. The second conductive layer is disposed over the plurality of first conductive layers. The first pillar extends inside the plurality of first conductive layers in the first direction. The first pillar includes a first semiconductor portion including a first semiconductor of single-crystal. The second pillar extends inside the second conductive layer in the first direction. The second pillar includes an insulating portion serving as an axis including an insulator and a second semiconductor portion which is disposed on an outer circumference of the insulating portion in view of the first direction. The second semiconductor portion is in contact with the first semiconductor portion and includes a second semiconductor of poly-crystal.
Patent TW-202041704-A (TW)
Inventor: PORE VILJAMI J
IPC: C23C16/455
Filed: 2016-10-06
Abstract: Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.
Patent TW-202109706-A (TW)
Title: Multi-zone heater model-based control in semiconductor manufacturing
Inventor: CIMINO MAURO
IPC: H05B3/06
Filed: 2020-07-17
Abstract: A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.
Patent TW-202145527-A (TW)
Title: Memory element and method for forming the same
Inventor: Sun zhong-wang
IPC: H01L27/11517
Filed: 2020-07-17
Abstract: The memory element includes a bottom select gate (BSG) structure including a slit on the substrate which vertically passes through the BSG structure. A cell layer structure is formed on the BSG structure. The gate line slip is formed vertically through the cell layer structure and the BSG structure, and enters the substrate and is arranged along the first lateral direction to divide digital regions. The first gate line slip is between the first digital region and the second digital region, and includes a gate line sub-slip. The first digital region is divided into a first string region and a second string region by the first slit, a first slit is formed in the first digital region along the second lateral direction, and further extends along the first lateral direction to at least the second digital region. At least one BSG limited by the first slit is located in at least the second digital region to be connected to the cell string in the first string region through an intermediate portion between adjacent gate line sub-slits.
Patent TW-202112823-A (TW)
Title: Antibodies binding to gprc5d
Inventor: BUJOTZEK ALEXANDER
IPC: A61P35/00
Filed: 2020-07-29
Abstract: The present invention generally relates to antibodies that bind to GPRC5D, including bispecific antigen binding molecules e.g. for activating In addition, the present invention relates to polynucleotides encoding such antibodies, and vectors and host cells comprising such polynucleotides. The invention further relates to methods for producing the antibodies, and to methods of using them in the treatment of disease.
Patent TW-202113222-A (TW)
Title: Gas turbine combustion control device, combustion control method, and program
Inventor: TAKAKI KAZUSHIGE
IPC: F02C9/46
Filed: 2020-08-11
Abstract: This combustion control device is a combustion control device for a gas turbine in which compressed air is supplied to a combustor, said compressed air being from a compressor and having flowed into a casing. The combustion control device comprises: a bleed valve control unit that controls a bleed valve provided to bleed piping bleeding a portion of the compressed air that has flowed into the casing such that said portion will not be used as air for combustion in the combustor; a fuel control unit that controls a fuel adjustment valve adjusting the fuel flow rate of a fuel supplied to the combustor; and a temperature acquisition unit that acquires the flame temperature of a flame produced by the combustion of the fuel within the combustor. If a load cutoff signal cutting off a load from the gas turbine is received, the bleed valve control unit controls the valve openness of the bleed valve to change from a condition of being closed to a condition of being open to a stipulated openness, and the fuel control unit controls the fuel adjustment valve so as to keep the acquired flame temperature within a prescribed temperature range defined by a minimum value and a maximum value.
Patent TW-202106570-A (TW)
Title: Glue bottle and sealing cover thereof
Inventor: Jin dong-min
IPC: B65D53/02
Filed: 2020-08-12
Abstract: A glue bottle is in the making up field. The glue bottle includes a bottle body and a sealing cover cooperated with each other. A housing is disposed on a periphery of the bottle body. An upper portion of bottle body is disposed through the housing and cooperated with the sealing cover. A lower portion of the bottle body is disposed in the housing. The housing has an opening at the top end of the housing. The diameter of the opening is smaller than the maximum diameter of the bottle body. The housing further has a guiding hole at the top end of the housing and connected to the opening. The bottle body has a guiding bar at the upper portion of the bottle body and cooperated with the guiding hole. The housing is made of elastic material. The housing further has a protrusion in the housing and in contact with the bottle body. The housing further has at least recess. When the protrusion is forced to press against the bottle body, the bottle body is deformed, such that two opposite edges of housing located in the recess are in contact with each other along the outer surface of the bottle body.
Patent TW-202117833-A (TW)
Title: Semiconductor structures having reduced thermally induced bow
Inventor: TYHACH MATTHEW C
IPC: H01L21/36
Filed: 2020-09-10
Abstract: A Monolithic Microwave Integrated Circuit (MMIC) structure having a thermally conductive substrate; a semiconductor layer disposed on a first portion of an upper surface of the substrate; an active mesa-shaped semiconductor device layer disposed on the semiconductor layer; and a passive electrical device disposed directly on a second portion of the upper surface of the substrate.
Patent TW-202117081-A (TW)
Title: Substrate processing method and substrate processing device
Inventor: MURAKAMI HIROKI
IPC: C23F4/00
Filed: 2020-09-16
Abstract: An object of the invention is to provide technology that can prevent the inhibition of etching caused by RuO 2 
production, and can improve the surface roughness introduced to a ruthenium film by etching.
A substrate processing method of the invention performs a plurality of repetitions of a cycle that includes a step of supplying a hydrogen-containing gas to a substrate that includes a ruthenium film, thereby reducing the oxides on the ruthenium film, and a step of supplying an oxygen-containing gas to the substrate to oxidize and etch the ruthenium film.
Patent TW-202116962-A (TW)
Title: Pressure sensitive adhesive article
Inventor: PUJARI SASWATI
IPC: B32B7/12
Filed: 2020-09-16
Abstract: Provided is a pressure sensitive adhesive article comprising
(a) a substrate (Sa)
(b) in contact with the substrate (Sa), a layer (Lb) of a presure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20°C or lower, and
(c) in contact with the layer (Lb), a layer (Lc) that comprises,
(i) one or more acrylic polymer (POLc1) having Tg of 20°C or lower, and
(ii) one or more acrylic tackifier polymer having Tg of -10°C or higher.
Also provided are a method of making the pressure sensitive adhesive article and a bonded article made by using the pressure sensitive adhesive article.
Patent TW-202116837-A (TW)
Title: Conjugated diene graft polymer and method for producing same
Inventor: UENO YOSHIKAZU
IPC: C08L51/06
Filed: 2020-09-18
Abstract: The present invention provides a conjugated diene graft polymer which exhibits high stability, while having excellent affinity for a polar material. A conjugated diene graft polymer wherein side chains (b), each of which is composed of a polymer that contains at least one monomer unit selected from the group consisting of a conjugated diene unit and an aromatic vinyl compound unit, are bonded to a main chain (a), which is composed of a polymer that contains a conjugated diene unit, respectively via one heteroatom which serves as a branch point, while having a valence of 3 or more. With respect to this conjugated diene graft polymer, the main chain (a) is bonded to the branch points directly or via a linking chain; the side chains (b) are bonded to the branch points directly; the heteroatom is at least one atom selected from the group consisting of Si, Sn, Ge, Pb, P, B and Al; at least one functional group (c), which is selected from the group consisting of an alkoxy group and a hydroxyl group, is directly bonded to at least one of the branch points; if N is the valence of the heteroatom, B is the average number of the side chains (b) directly bonded to one branch point and C is the average number of the functional groups (c) bonded to one branch point, N, B and C satisfy a specific relationship; and if X is the average number of the functional groups (c) directly bonded to the branch points per one molecule of the conjugated diene graft polymer and Y is the average number of branch points per one molecule of the conjugated diene graft polymer, X and Y satisfy the relational expression 0 < (X/Y) < 1.
Patent TW-202212842-A (TW)
Inventor: LI TZU-WEI
IPC: G01R31/01
Filed: 2020-09-28
Abstract: The present invention reveals a modularized testing apparatus, including a supporting unit, a testing unit, and a pressing unit. The supporting unit has a supporter for slidably supporting the testing unit. The testing unit has a base plate assembled with plural testers thereon. The testers are adapted for holding and testing electronic components. The pressing unit has a detachable frame disposed on the supporter. Plural pressers are disposed to the detachable frame, aiming the testers for pressing on the electronic components above the testers. Therefore, the modularized testing apparatus can be maintained easily, and the testing unit can be slidden out for batch processing. Equipment capacity and efficiency can be enhanced.
Patent TW-202136923-A (TW)
Title: Reticle in an apparatus for extreme ultraviolet exposure
Inventor: KANG MAN-KYU
IPC: G03F7/20
Filed: 2020-09-30
Abstract: A reticle for an apparatus for EUV exposure and a method of manufacturing a reticle, the reticle including a substrate including an edge region and a main region; a multi-layer structure on the main region and the edge region, a sidewall of the multi-layer structure overlying the edge region; a capping layer covering an upper surface and the sidewall of the multi-layer structure and at least a portion of the edge region of the substrate; and an absorber layer on the capping layer, the absorber layer covering an entire upper surface of the capping layer on the edge region of the substrate, wherein a stacked structure of the capping layer and the absorber layer is on an upper surface of the edge region of the substrate, and a sidewall of the stacked structure of the capping layer and the absorber layer is perpendicular to an upper surface of the substrate.
Patent TW-202216027-A (TW)
Title: Grip-type anti-scalding clip
Inventor: CHANG HUI-CHIN
IPC: A47J45/10
Filed: 2020-10-19
Abstract: A grip-type anti-scalding clip device comprises a handle locking screw, a force-applying handle, a return spring, an adapter plate, a force transmission pin, a rotating support pin, a connecting rod, a connecting rod fixing pin, a base plate, a return spring positioning pin, a fixed handle, a fixed handle locking screw, a clamping jaw, a center column, a fixed bottom plate, a non-slip silicone sheet, a fixed bottom plate locking screw and a center column locking screw. A user can use the device by applying a grip force between the force-applying handle and the fixed handle with one hand to cause a relative movement between the force-applying handle and the fixed handle, thereby driving the fixed bottom plate to rise to covert the applied grip force to a clamping force applied by two clamping jaws through an action of the connecting rod for easily and firmly clamping an object. Compared with the traditional way of using a clip, the user's fingers must be tightly clasped on a horizontal bar of the clamping jaws on both sides to control opening and closing operations of the two jaws by release and press actions made by the four fingers and the thumb. The device not only greatly improves the way of use and the applied clamping force, but also avoids possibilities that the traditional clip may slip due to greases on the fingers, resulting in the possibility of the clamped object being fallen.
Patent TW-202142363-A (TW)
Inventor: HU WEN-CAI
IPC: B24B41/06
Filed: 2020-10-21
Abstract: The present invention provides an edge polishing apparatus and a cleansing method for a vacuum polishing pad. The edge polishing apparatus comprises a vacuum polishing chuck, a vacuum polishing pad mounting on the vacuum polishing chuck, a robot manipulator for removing a polished wafer from the vacuum polishing pad and a cleansing device for cleansing the vacuum polishing pad after polishing the polished wafer. The cleansing device comprises a cleansing unit for cleansing the vacuum polishing pad with rinsing and scrubbing, and a moving unit connected with the cleansing unit for moving the cleansing unit to different positions on the vacuum polishing pad. The present invention may decrease accumulation of slurry on the vacuum polishing pad to prevent from imperfections such as craters on a back-side surface of the wafer generated during edge-polishing process that may cause yield decline.
Patent TW-202214338-A (TW)
Title: 成套型大氣污染淨化系統
Inventor: SHIN DONG-JUN
IPC: B01D53/00
Filed: 2020-11-17
Abstract: 本發明係一種成套型大氣污染淨化系統，尤其，在去除和排出室內發生的VOC及惡臭物質的同時可提供清新的空氣，透過熱源的再利用，不但可以明顯提高處理效率，而且在濃縮氣部的脫除部可順利地脫除有害物質，可提高淨化效率。
Patent TW-202125118-A (TW)
Inventor: PNINI BOAZ
IPC: G02B7/182
Filed: 2020-11-24
Abstract: 本發明揭示一種用於微影光學成像裝置(101)的配置，特別是用於極紫外線 (EUV，Extreme Ultraviolet)範圍內的光，其包括一光學單元(109)和一用於支撐該光學單元(109)的支撐結構(110)，其中該光學單元(109)包括至少一光學元件(112)、一用於承載至少一光學元件(112)的載體結構(113)、及一主動致動裝置(114)。該光學元件(112)通過該主動致動裝置(114)支撐在該載體結構(113)上。該主動致動裝置(114)構造成在該光學成像裝置(101)的正常操作期間，相對於指定給該成像裝置(101)的一第一參考(115)，在最大移動範圍內調整該光學元件(112)，該最大移動範圍由該光學成像裝置(101)的正常操作預先定義。該主動致動裝置(114)構造成使得所述最大移動範圍由該主動致動裝置(114)的致動運動完全覆蓋，其致動精度由該光學成像裝置(101)的正常操作預先定義。該光學單元(109)通過該支撐結構(110)的一介面裝置(116)支撐在該支撐結構(110)上。此外，提供一調整裝置(117)，特別是該介面裝置(116)包括該調整裝置(117)，其中該調整裝置(117)構造成在該光學成像裝置(101)已組裝狀態下，相對於該第一參考(115)以N個自由度來調整指定給該光學單元(109)，特別是該光學元件(112)的一第二參考(118.1；112.1；113.1)之位置及/或定向。
Patent TW-202220853-A (TW)
Title: Compound type printing roller surface cleaning mechanism capable of combining wheel brush and water mist nozzle to remove sticky substance adhered to the roller surface
Inventor: Cai song-lin
IPC: B41F35/02
Filed: 2020-11-27
Abstract: This invention relates to a compound type printing roller surface cleaning mechanism, comprising a wheel brush disposed at a position corresponding to a roller and driven to rotate by a wheel brush motor; and a water mist nozzle disposed at a position facing the roller surface of the roller and spaced from the wheel surface with a distance. The wheel brush and the water mist nozzle are supported on a bearing seat. A lifting mechanism can drive the bearing seat at a descending position or an ascending position. When the bearing seat is at the ascending position, the brush surface of the wheel brush is in contact with the roller surface of the roller and is driven to rotate by the wheel brush motor, while the water mist nozzle generates a high-pressure micro-mist sprayed toward the roller surface of the roller, so as to remove sticky substance adhered to the roller surface.
Patent TW-202137553-A (TW)
Title: Lateral double-diffused metal oxide semiconductor transistor and n-channel lateral double-diffused metal oxide semiconductor transistor
Inventor: COYNE EDWARD JOHN
IPC: H01L29/06
Filed: 2020-12-09
Abstract: A modified structure of a lateral n-channel LDMOS transistor is provided to avoid the rupturing of the gate-oxide which occurs during the operation of the transistor. The LDMOS transistor comprises a dielectric isolation structure which physically isolates the region comprising a parasitic NPN transistor from the region generating a hole current due to weak-impact ionisation, that is, the extended drain region of the LDMOS transistor. According to an embodiment of the disclosure, this can be achieved using a vertical trench between the two regions. Further embodiments are also proposed to enable a reduction in the gain of the parasitic NPN transistor and in the backgate resistance in order to further improve the robustness of the LDMOS transistor.
Patent TW-202224264-A (TW)
Title: Anti-interference structure of millimeter wave antenna capable of effectively reducing an interference caused by opposite noises while increasing the gain
Inventor: ZHU WEI
IPC: H01Q1/52
Filed: 2020-12-10
Abstract: Provided is an anti-interference structure of a millimeter wave antenna, which comprises a transmission array antenna and/or a receiving array antenna formed of at least one comb-like antenna element. The comb-like antenna element comprises an antenna main body in the form of an elongate strip and a micro-strip line radiation assembly. The antenna main body has an end in connection with a millimeter wave circuit that is capable of generating a millimeter wave. The micro-strip line radiation assembly is formed of a plurality of intermediate micro-strip line radiation units that are arranged at intervals on an intermediate section of the antenna main body, and an end micro-strip line radiation unit that is arranged on a tailing end of the antenna main body. Each of the intermediate micro-strip line radiation units and the end micro-strip line radiation unit are arranged on the antenna main body at intervals in the same oblique direction so as to reduce an interference phenomenon caused by opposite noises.
Patent TW-202218501-A (TW)
Inventor: Zheng xiao-feng
IPC: H05K1/11
Filed: 2020-12-16
Abstract: 本發明提出一種印刷線路板連接結構的製作方法，包括以下步驟：提供第一印刷線路板，包括第一介質層、多個第二介質層以及第一導電線路層；提供第二印刷線路板，包括第三介質層、多個第四介質層以及第二導電線路層；以及連接所述第一印刷線路板及所述第二印刷線路板，從而得到所述印刷線路板連接結構。本發明的製作方法能夠提高第一印刷線路板和第二印刷線路板連接結構區域的平整度。本發明還提供一種由所述方法製備的印刷線路板連接結構。
Patent TW-202230339-A (TW)
Title: Echo cancellation device and echo cancellation method thereof applied in communication device
Inventor: CHAN CHIA-JUNG
IPC: H04M9/08
Filed: 2020-12-28
Abstract: The invention provides an echo cancellation device and an echo cancellation method thereof applied in a communication device. The echo cancellation device includes an echo canceller and a combine circuit. The echo canceller obtains multiple delayed signals from the local signal of the communication device, which are divided into multiple delayed signal groups. The echo canceller selectively ignores at least one of the delayed signal groups, and the echo canceller uses other of the delayed signal groups to generate the echo cancellation signal. The combine circuit is coupled to an interface circuit of the communication device to receive the received signal. The combine circuit uses the echo cancellation signal to cancel the echo component of the received signal to generate a canceled signal.