baber/WOPTO huggingface dataset:
Patent JP-H0987770-A (JP)
Title: Method for molding half-molten metal
Inventor: SASAKI HIROTO
IPC: B22D17/00
Filed: 1995-09-27
Abstract: PROBLEM TO BE SOLVED: To produce a half-molten metal for press molding having spherical primary crystals by hermetically closing the front surface of a thermal insulating vessel with a thermal insulating cap at the time of crystallizing primary crystals from a liquid alloy of a liquidus temp. or above having crystal nuclei in this thermal insulating vessel. SOLUTION: The metal M of the perfect liquid put into a ladle 10 is poured via a cooling jig 20 into the thermal insulating vessel 30 to obtain the alloy M right below the liquidus contg. the many crystal nuclei. The front surface of the thermal insulating vessel 30 is hermetically closed with the thermal insulating cap 40 to shut off the vessel from the outdoor air. While the alloy M is cooled down to the molding temp. at which the alloy exhibits the prescribed liquid phase ratio, the alloy is held in the half-molten state for 5 seconds to 60 minutes. During this time, the fine non-dendrite primary crystals are formed from the introduced crystal nuclei and are grown as the spherical primary crystals with an increase in the solid phase ratio accompanying the temp. fall of the m.p.  As a result, the half-molten metal M having the primary crystals and the temp. uniform over the entire part is simply and easily obtd. After this metal is inserted into an injection sleeve 50 for die casting, the metal is press- molded in the die cavity 60a of a die casting machine to obtain the molded goods are obtd.
Patent JP-H0192328-A (JP)
Title: Manufacture of aluminum powder metallurgical alloy
Inventor: KOTANI YUSUKE
IPC: C22C1/04
Filed: 1987-10-02
Abstract: PURPOSE:To safely and easily manufacture an Al alloy having excellent mechanical characteristics by subjecting the Al alloy powder obtd. by a molten metal atomizing method in the inert gas or in nitrogen contg. specific amounts of oxygen or water to hot pressing or plastic working. CONSTITUTION:The Al alloy powder is manufactured by a molten metal atomizing method in inert gas contg. 0.1-1.5vol.% O2 and 0.01-0.2% H2O, N2 gas or the mixed gas therebetween. In this case, the cooling ratio at the solidifying of the Al alloy powder is preferably regulated to >=10<3> deg.C/sec and the volume of the obtd. Al alloy powder to <=0.065mm<3>. The Al alloy powder obtd. by this method is solidified by hot pressurizing or hot plastic working in the temp. range of 300-500 deg.C. In this way, the titled alloy having excellent characteristics such as strength, toughness and ductility is safely and easily obtd.
Patent JP-H0192613-A (JP)
Title: Encoder
Inventor: KIKUKAWA YOICHI
IPC: G01D5/36
Filed: 1987-10-02
Abstract: PURPOSE:To obtain a rotational angle signal thetasig of large amplitude with a low source voltage and to extract a high-S/N output signal by providing a reference voltage supplying means which supplies different reference voltages to a current/voltage converting circuit and the operational amplifier of an adding circuit. CONSTITUTION:Output current of photodiodes 51-58 vary from 0 to (i) according to the quantity of detected light. A shift register 63 turns on four out of eight switches 621-628 at the same time and shifts switches which are turned on according to a CLK signal. Here, when the reference voltages VS1 and VS2 of amplifiers A (A1-A8) and U are made different and then the output voltage of a signal processing circuit 6 can be expanded fully to the output voltage range of the amplifier U by selecting values R1 and R2, and VS1 and VV1 as the maximum and minimum value of the rotation angle signal thetasig.
Patent JP-H1098217-A (JP)
Title: Method for forming josephson junction
Inventor: AOYANAGI MASAHIRO
IPC: H01L39/24
Filed: 1996-09-20
Abstract: PROBLEM TO BE SOLVED: To enable improvement of the production yield, even with a micromachined Josephson junction area by deeply cutting out by the electron cyclotron resonance(ECR) plasma etching an upper superconductor layer into a specified plane shape until a tunnel barrier layer is reached. SOLUTION: A laminate structure (21+22+23) (Fig. A) is formed with a preetched sample 10, i.e., resist 27 disposed thereon for defining the junction area. An ECR plasma etching step 101 follows, to etch deeply an upper superconductor layer 23 until reaching a tunnel barrier layer 22, thus obtaining an etched sample 11 by cutting out the superconductor layer 23 into a specified plane shape (Fig. C). This sample 11 has improved characteristics with the generation of residues reduced.
Patent JP-H03110523-A (JP)
Title: Production of transparent electrode substrate
Inventor: GAMO SHUSUKE
IPC: H01L21/3205
Filed: 1989-09-26
Abstract: PURPOSE:To contrive a cost reduction by removing the ITO film in the part no irradiated with an electron beam by a chemical etching method by utilizing the difference in the rate of the chemical etching between the part of the ITO film irradiated with the electron beam and the part not irradiated with the electron beam, thereby forming transparent electrode patterns. CONSTITUTION:The ITO (Indium-Tin-Oxide) film 5 is formed on a transparent substrate 1 by the low-temp. sputtering method to be executed at <=150 deg.C temp. of the transparent substrate 1 at the time of film formation by sputtering. Partial annealing is executed by scanning the electron beam 4 at the time of executing the annealing by the irradiation with the electron beam 4. The ITO film 5 of only the part 2 not irradiated with the electron beam is removed by the selective etching using the chemical etching method for which the difference in the rate of the chemical etching between the irradiated part 3 and the non- irradiated 3 is utilized, by which the transparent electrode patterns are formed. The need for a photolithography stage is eliminated at all in this way. The simplification of the stage and the improvement in the reliability, productivity and yield are contrived in this way and the cost reduction is attained.
Patent JP-2000077532-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: YAMAMOTO FUMIHISA
IPC: H01L21/336
Filed: 1998-09-03
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and method for manufacturing it, wherein the threshold voltage of a DMOS transistor is easily controlled while a bi-polar transistor is readily speeded up. SOLUTION: A gate electrode layer 6 faces, across a gate insulating layer 5, a p-type back gate region 1 which is sandwiched between an n-type source region 2 and an n-type epitaxial region 44, and a sidewall insulating layer 7 is so formed as to cover its sidewall. The p-type back gate region 1 comprises a p-type diffusion region 1a which is relatively shallow and a p-type diffusion region 1b which is relatively deep. The p-type diffusion region 1B overlaps with the p-type diffusion region 1a, with an end part Sa at a substrate surface positioned directly below the sidewall insulating layer 7.
Patent JP-S61128587-A (JP)
Title: Manufacture of semiconductor laser
Inventor: ISHITANI AKIYASU
IPC: H01L21/301
Filed: 1984-11-27
Abstract: PURPOSE:To avoid trouble such as an interference by half-dicing each region, which is to be cloven, in the directions rectangular to the directions of the projection of laser beams from several laser diode from the back side of a semiconductor substrate to form a groove and cleaving the substrate in the regions, which is to be cloven. CONSTITUTION:A groove 17 is shaped through half dicing along each region to be striped in the direction rectangular to a striped region 16 in the back of a wafer-shaped semiconductor substrate 10. The wafer-shaped semiconductor substrate 10 is cloven by several groove 17 and divided into bar shapes, and striped and pelletized along lines 20 to be striped in the same direction as the direction of the projection of laser beams. Since dicing surfaces 18 are made extremely rougher than cleavage planes 19, upper beams Lc projected to the diciding surfaces 18 are reflected irregularly by the surfaces 18. Accordingly, upper beams Lc fed back to a semiconductor laser return to an optical path in an optical type head by re-reflection, thus avoiding the generation of an interference.
Patent JP-H08113741-A (JP)
Title: Ink jet recording ink
Inventor: WATANABE KAZUAKI
IPC: C09D11/03
Filed: 1994-10-14
Abstract: PURPOSE: To obtain an ink jet recording ink intended to make its preservability with ink print quality. CONSTITUTION: This ink contains carbon black of high blackness with a roughness factor of >=1.6, perf. >=3, more pref. >=5 and 10-40 (pref. 10-25)wt.%, based on the carbon black, of an anionic resin dispersant for the carbon black. With the above composition, this ink is high in color depth despite low concentration of the coloring material and in dispersion stability, causing no blur even if used on regenerated paper, therefore being highly compatible with paper.
Patent JP-H0992975-A (JP)
Title: Manufacture of multilayer board
Inventor: TAKIZAWA HIDEO
IPC: H05K3/46
Filed: 1995-09-28
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for obtaining multilayer boards finished well externally without forming of spots in internal-layer patterns by arranging a plurality of boards for internal layers having acid-proof processed internal-layer patterns, laminating prepregs, and forming multilayer boards by applying heat and pressure. SOLUTION: The thickness (e) of superfluous resin obtained by the following equation (A), of a prepreg touching an internal-layer pattern is 5-15μm. e=(v-p-d)÷s...(A) (In the equation, e is the thickness of superfluous resin, v the volume of resin that a prepreg contains, p the volume of the air gap between an internal-layer pattern and another one formed on a surface touching the prepreg of a board for an internal layer, d the volume of an air gap obtained by subtracting the volume of a cloth from a volume surrounded by a contact surface linking each apex of the protrusions of one surface of the cloth forming the prepreg, and a contact surface linking each apex of the protrusions of the other surface of the cloth, and s the area.)
Patent JP-S6490706-A (JP)
Title: Cutting method for semiconductor wafer
Inventor: ETO KEIKI
IPC: H01L21/78
Filed: 1987-10-02
Abstract: PURPOSE:To reduce wear or damage of a grindstone without generating incomplete cutting, by setting up a quantity of depth of cut into an adhesive sheet by controlling a relative position according to cutting resistance to be applied to the grindstone of a dicing saw. CONSTITUTION:The number of revolutions of a rotary shaft 4 of a spindle, which is turning a grindstone 3 under a state where the grindstone 3 cuts a semiconductor wafer 1 deeply into the surface of the same down to an adhesive sheet 2, is measured by a tachometer 5. Then when it becomes a state where the grindstone 3 does not cut deeply into the adhesive sheet 2 any more, cutting resistance to be applied to the grindstone 3 becomes low and the number of revolutions increase. A position control signal of a spindle, therefore, is generated through a driver 6 by detecting a variation of the number of revolutions and a position of the grindstone 3 at the tip of the spindle is dropped at the fixed rate. As a relative positional relation between the grindstone 3 and semiconductor wafer 1 is corrected and the optimum condition can be held, complete cutting becomes possible always. Moreover, as the grindstone 3 and a dicing saw do not come into contact with each other, damage does not occur.
Patent JP-H04129169-A (JP)
Title: Manufacture of incandescent lamp
Inventor: SUZUKI SHINJI
IPC: H01K3/00
Filed: 1990-09-19
Abstract: PURPOSE:To eliminate a limitation to the number and thickness of film layers and thickness, and restriction due to a bulb shape 1 causing thermal. decomposition or chemical reaction in a vacuum electric furnace having the specific degree of vacuum and temperature for alternately laminating a plurality of two types of specific metal oxide films on bulb surface. CONSTITUTION:An incandescent lamp 10 is mounted to a bulb support fitting 12 in a vacuum electric furnace 7 and sealed. Furnace temperature is kept within the range of 350 to 900 deg.C, while the degree of vacuum is kept at 10Torr or less. In this state, the cock 8 of a carburetor 1 for titanium oxide is first opened, and TPT 2 is introduced in the furnace 7, together with argon A. At the same time, a cock 13 is opened to cause a flow of nitrogen B, and the degree of vacuum in the furnace 7 is adjusted at 0.5Torr. As a result, a titanium oxide film of 940Angstrom  thickness is formed in 4 minutes and 30 seconds. Thereafter, the cock 8 is closed an the cock 9 of a carburetor 3 for silicon oxide is opened and TEOS 4 is similarly introduced to form a silicon oxide film. The aforesaid film formation processes are alternately repeated, and multi-layer comprising a titanium oxide film and a silicon oxide film can be formed without any limitation to the layer number and thickness and without any restriction by a glass bulb shape.
Patent JP-H0193799-A (JP)
Title: Voice pitch conversion
Inventor: TSUGI TORU
IPC: G10L21/04
Filed: 1987-10-06
Abstract: PURPOSE: To control the level, accent, etc., of a voice without lossing the naturality of voice by extending/shortening the pitch period of an waveform in a voiced sound section and continuously connecting the waveform. CONSTITUTION: An analysis part 2 extracts a voiced sound section from an A/D converted voice, obtains a linear prediction coefficient and a residual waveform by the linear prediction analysis of the voice waveform, determines one pitch section, and executes linear prediction analysis again by using an intersection point of the pitch section as the center of an analytical window. Then a pitch frequency control part 4 applies a required change to each of a series of pitch periods, newly calculates a pitch period string and extends/ shortens the waveform of each pitch corresponding to the new pitch period to adjust normalization power.  An waveform connection part 6 compares speaking time length and continuously connects the waveform and a distortion correcting part 8 finds out the square sum of M sample data, calculates respective linear prediction coefficients, finds out a spectrum envelope, and obtains the envelope of the original sound.
Patent JP-2001078426-A (JP)
Title: Eddy current decelerator
Inventor: KUWABARA TORU
IPC: H02K49/02
Filed: 1999-09-03
Abstract: PROBLEM TO BE SOLVED: To provide an eddy current decelerator with high strength and a low cost outer cylinder part by a method, where the outer cylinder part is made of cast steel which is a ferromagnetic material, ferromagnetic parts of the outer cylinder corresponding to ferromagnetic plates are left as they are, and the nonmagnetic parts are austenitized by casting and diffusing nickel into those parts. SOLUTION: An eddy current decelerator comprises a brake drum 7 connected to a rotary shaft 1, a guide cylinder 10 which is placed in the brake drum, is attached to a nonrotary part such as a body, etc., has a hollow part 13 with a rectangular cross section and is made of a nonmagnetic material, a magnet support cylinder 14 which is housed in the hollow part 13 of the guide cylinder 10 to have at least its one side movable, a large number of magnets 24 arranged on the outer circumferential surface of the magnet support cylinder 14 in the circumferential direction at the same intervals and the outer cylinder part 10a of the guide cylinder 10, which has ferromagnetic parts 15 facing the respective magnets 24 and nonmagnetic parts which do not face the magnets 24. A braking force is generated in the brake drum 7 by eddy currents induced by magnetic fields from the magnets 24.  The outer cylinder part 10a is made of cast steel, which is a ferromagnetic material, and the phase of the nonmagnetic parts are turned into an austenite phase by casting and diffusing nickel into those parts.
Patent JP-H03111876-A (JP)
Title: Fixing device
Inventor: NAKAMURA TOSHIYUKI
IPC: G03G15/20
Filed: 1989-09-26
Abstract: PURPOSE:To prevent irregularity in a toner image by providing a rotor which suppresses the jump of the trailing edge of a paper on the upstream side of a fixing means and a driving means which detects the leading edge of the paper and allows the rotor to advance and retreat on the downstream side of the fixing means. CONSTITUTION:The fixing device has the fixing means 1 and an entrance 2a and an exit 2b for the paper on the upstream side and the downstream side of the fixing means 1 and is provided with a casing 2 housing the fixing means 1 inside. A driving means 3 detects the leading edge of the paper fixed by the fixing means 1 on the downstream side and allows the rotor to advance and retreat between a pair of guiding plates 21 and 22 for guiding the paper to the fixing means 1 provided in the entrance 2a of the casing 2. Thus, the paper is introduced in the fixing means 1 in a state where the rotor 4 is retreated from the guiding plates 21 and 22. After the leading edge of the paper passes the fixing means 1, the jump of the trailing edge of the paper which advances between the guiding plates 21 and 22 is suppressed. Therefore, the paper to which fixation is not performed yet is prevented from coming in contact with the guiding plate.
Patent JP-H10173404-A (JP)
Title: Method for turning high q-filter and its system
Inventor: SHANTHI-PAVAN YENDLURI
IPC: H01F7/02
Filed: 1997-09-16
Abstract: PROBLEM TO BE SOLVED: To approved a method for turning a band-pass filter having a high Q value. SOLUTION: An excitation signal 204 is supplied to a filter 102 to create ringing, and generates an output oscillation waveform 206. The zero-crossing 208 of the oscillation waveform is converted into a pulse train, and in that pulse train, a prescribed number of pieces (n) is counted by a digital counter 112. The output of the counter 214 is copperas with a correct time signal 216 which has the equivalent time length to a time for (n) pieces of pulses at the time when the filter is correctly turned. The output of a comparator 118 is supplied to an integrator 112, and a control signal Vo to tune the filter is generated. Thus, the problem of turning at high frequency is converted into the problem in time domain at low frequency easy to realize.
Patent JP-H0196410-A (JP)
Title: Cam shaft provided with oil separator mechanism
Inventor: ISOMOTO ATSUSHI
IPC: F01M13/00
Filed: 1987-10-07
Abstract: PURPOSE:To eliminate a buffer chamber from a rocker cover by separating oil component in blow-by gas fed into a dynamic valve chamber through utilization of a cam shaft. CONSTITUTION:A path 1c having opposite ends opening respectively to the circumferential face near the front end and to the rear end face is made in the core of a cam shaft 1, and an oil slinger 13 is formed at the rear end. Oil escape paths 3a, 3c for discharging oil which is dispersed from the oil slinger 1e and collected into a dynamic valve chamber 4 are formed in a bearing 3 for bearing the rear end of the cam shaft 1, and a fitting 8 surrounding the rear end of the cam shaft 1 and communicating the path 1c with a suction system is mounted at the rear end of the bearing 3. Blow-by gas led from a crank case into the dynamic valve chamber 4 is sucked into the path 1c of the cam shaft 1 where oil component is separated centrifugally, then the gas is discharged through escape paths 3a, 3c into the dynamic valve chamber 4 so as to recirculate only the blow-by gas to the suction system.
Patent JP-H1086753-A (JP)
Title: Mounting structure for door mirror
Inventor: KOSAKA MOTOSHI
IPC: B60R1/06
Filed: 1997-09-17
Abstract: PROBLEM TO BE SOLVED: To improve a vehicle diagonal forward/sideward direct visual field and indirect rearward visual field, prevent a mirror from obstructing when the visual field is moved from the forward visual field to the sideward visual field, and attain improvement of visibility. SOLUTION: This automobile is constituted so as to provide a front side door 2 liftably arranging a front side window glass 5 in an upper part of a door main unit 3 having a belt line 8 in an upper edge, rear side window 6 having a belt line 9 of height almost equal to the belt line 8 in a rear part of the front side window glass 5 and a front window glass 7. Here, in a front/ rear part 8a, 8b of the belt line 8, a step difference part 13 is provided, the rear part 8b is formed in a position of height almost equal to the belt line 9 of the rear side window 6, the front part 8a is formed in a position of height decreased lower than the rear part 8b, in an end of the front part 8a of the belt line 8, a corner bracket 14 mounting a door mirror 15 is provided.
Patent JP-H1182824-A (JP)
Title: Manufacture of multilayer pipe
Inventor: BAKU KENHEI
IPC: F02M35/10
Filed: 1997-09-17
Abstract: PROBLEM TO BE SOLVED: To manufacture an ideal multilayer pipe by preventing bending and inclination of a small diameter pipe part and the occurrence of a crack. SOLUTION: A multilayer pipe manufacturing method consists of a pipe contracting process of applying pipe contracting machining to a part of a base pipe to form a base pipe part 1, a tapered part 2 and a small diameter pipe part 3 in a continuous state, a rounding process making the roundness of a boundary part 1a between the base pipe part 1 and the tapered part 2 larger than that of a boundary part 3a between the small diameter pipe part 3 and the tapered part 2, and a buckling process of pressing the base pipe part 1 and the small diameter pipe part 3 in the mutually approaching direction so as to gradually buckle the tapered part 2.
Patent JP-H0298876-A (JP)
Title: Magnetic tape processor
Inventor: AOKI YOSHITAKA
IPC: G11B20/18
Filed: 1988-10-05
Abstract: PURPOSE:To improve data processing efficiency by adding a write order number to each data block and deciding whether or not the number of a data block read out right before a data block where an uncorrectable error is detected succeeds to a next data block number. CONSTITUTION:A block number adding circuit 2 generates block numbers by data blocks written on a magnetic tape device 8 according to control information from a main control part 4 which is inputted through a signal line 104 and transfers the block numbers to a write data modulating circuit 3 through a signal line 102. When an uncorrectable error in a data block is detected, the data block following the data block is read out and it is decided whether their block numbers succeed or not. Consequently, even when a write defect is not detected by a check in writing, error recovery processing is performed without interrupting the processing and the data processing efficiency is improved.
Patent JP-H0995522-A (JP)
Title: Epoxy resin composition
Inventor: MOGI NAOKI
IPC: C08G59/24
Filed: 1995-09-28
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing markedly improved in the soldering stress resistance of a semiconductor package in mounting components on a substrate. SOLUTION: This resin composition for semiconductor sealing essentially consists of an aromatic compound having two or more epoxy groups, a resin curing agent containing 30-100wt.%, based on the total resin curing agent, dihydroxybenzene resin curing agent represented by the formula, an inorganic filler and a cure accelerator.
Patent JP-2000061113-A (JP)
Title: Mechanism plate for pachinko machine
Inventor: SATO HISAYOSHI
IPC: A63F7/02
Filed: 1998-08-20
Abstract: PROBLEM TO BE SOLVED: To open/close a cover body to which a control circuit board is attached, without disconnecting wiring. SOLUTION: Concerning a mechanism plate 18 for a pachinko machine provided with plural ball passages so as to cover the rear opening of the ball passages with a freely opening/closing cover body 37, a control circuit board is attached to the cover body 37 and wiring 47 pulled out of various electronic components is connected from the axis supporting side of the cover body 37 to the control circuit board.