baber/WOPTO huggingface dataset:
Patent TW-I259205-B (TW)
Title: Polynucleotides having ABC1 promoter activity, recombinant vectors, host cells and kits comprising the same, and method for screening a test compound of ABC1 expression modulating activity
Inventor: LAWN RICHARD M
IPC: A61P3/10
Filed: 2000-08-25
Granted: 2006-08-01
Abstract: The present invention relates to novel ABC1 polypeptides and nucleic acid molecules encoding the same. The invention provides recombinant vectors, host cells, and pharmaceutical compositions comprising ABC1 polynucleotides, as well as methods for producing ABC1 polypeptides. The invention also provides methods for the diagnosis, treatment, amelioration, and/or prevention of diseases associated with decreased cholesterol efflux and/or low HDL. The present invention further provides methods for identifying compounds that modulate the expression of ABC1 and methods for detecting the level of ABC1 polypeptides and polynucleotides in a mammalian subject. The present invention also provides kits and compositions suitable for screening compounds to determine the ABC1 expression modulating activity of the compound, as well as kits and compositions suitable to determine whether the compound modulates ABC1-dependent cholesterol efflux.
Patent TW-526253-B (TW)
Title: Fluorescent material
Inventor: SUDA YORIKO
IPC: C09K11/66
Filed: 2000-08-09
Granted: 2003-04-01
Abstract: This invention relates to a fluorescent material, which is characterized in both high luminance efficiency and long life, emits light by electron excitation and exhibits various kinds of luminous colors depending on selection of a dopant element. 0.6 g of ZnO was mixed with 3 g of Ga2S3 in an alumina boat; then, the mixture was heated to 1180 DEG C. or more in a tubular oven for 3 hours while keeping ammonia at a flow rate of 350 ml/min therein. This permitted a white GaN powder to be produced. The obtained columnar crystal was observed by means of an SEM (scanning electron microscope). GaN of a hexagonal system was identified by X-ray diffraction analysis. The half band width of 2 θ=34 DEG related to conventional round particulate GaN:Zn fluorescent material was 0.22. The columnar crystal GaN of the present invention was less than 0.2, resulting in crystallinity being highly improved. Also, the columnar crystal GaN of the present invention had a ratio of thickness to length of 1:1.5 or more. The fluorescent material of the present invention is blue in luminous color and has luminous intensity about 11 times as much as that of conventional fluorescent material.
Patent TW-456032-B (TW)
Title: Method for fabricating 4F2 memory cells with improved gate conductor structure
Inventor: PARK YOUNG-JIN
IPC: H01L27/108
Filed: 2000-08-24
Granted: 2001-09-21
Abstract: In accordance with the present invention, a method for forming gate conductors in 4F2 area stacked capacitor memory cells includes the steps of forming a buried bit line (104) in a substrate (102), forming an active area (112) above and in contact with the buried bit line and separating portions of the active area by forming a dielectric material (108) in trenches around the portions of the active area. Portions of the dielectric material are removed adjacent to and selective to the portions of the active area. A first portion (117) of a gate conductor (114) is formed in locations from which the portion of dielectric material is removed, and a second portion (115) of the gate conductor (114) is formed on a top surface of the dielectric material and in contact with the first portion of the gate conductor. Stacked capacitors (126) are formed such that the gate conductor activates an access transistor (129) formed in the portions of the active area.
Patent TW-497286-B (TW)
Title: Rechargeable lithium battery and process for the production thereof
Inventor: KAWAKAMI SOICHIRO
IPC: H01M50/528
Filed: 2000-09-29
Granted: 2002-08-01
Abstract: A thin type rechargeable lithium battery which comprises a battery main body enclosed between a pair of a sealing member (a) and a sealing member (b), at least said sealing member (a) having a concave portion such that said concave portion is extended to either side of said sealing member (a) from a central position of said sealing member (a) so as to have a peripheral collar portion (a-i) which surrounds said concave portion, said sealing member (b) having a peripheral collar portion (b-i) at a region thereof corresponding to said collar portion (a-i) of said sealing member (a) and said two sealing members (a) and (b) being arranged to oppose to each other such that the face of said concave portion of said sealing member (a) is faced to said sealing member (b) through said battery main body, wherein said collar portion (a-i) and said collar portion (b-i) are mutually welded, and either said sealing member (a) or said sealing member (b) is provided with a power output terminal having an electrical continuity with said battery main body and an insulating portion for insulating said power output terminal.
Patent TW-554084-B (TW)
Title: Electroplating of copper from alkanesulfonate electrolytes
Inventor: MARTYAK NICHOLAS M
IPC: C25D5/56
Filed: 2000-10-13
Granted: 2003-09-21
Abstract: Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or submicron dimensioned trenches or vias.
Patent TW-484279-B (TW)
Title: Method and apparatus for selective network access
Inventor: ENEBORG MATS
IPC: H04L12/56
Filed: 2000-10-16
Granted: 2002-04-21
Abstract: A method and apparatus for providing selective access to a network, between an end device and a network such as the Internet through one or more access network terminating devices includes determining an access capability for each access network terminating device and comparing the access capability with a preferred access capability associated with a user preference. Best access is determined based on a comparison of the capabilities of the access network terminating devices and the preferred capabilities. Once a match is found, one of the access network terminating devices is selected based on the comparison and the end device is configured according to the access capability of the selected one of the access network terminating devices. Access capabilities include, for example, cost of access, coverage area, and QoS. While communicating with the network the end device continues to detect if new access network terminating devices are available. The access capability for each of the new access network terminating devices is determined and compared with the preferred access capability and/or the current access capabilities being provided to the end device. One of the new access network terminating devices can be selected based on the comparison and the end device configured according the access capability of the new access network terminating device.
Patent TW-572843-B (TW)
Title: Storage container with gripping handle sidewall
Inventor: LILLELUND STIG
IPC: B65D77/02
Filed: 2000-10-20
Granted: 2004-01-21
Abstract: A storage container with gripping handle sidewall. The container includes a sidewall, top wall and bottom wall. The sidewall is formed with a peripheral shape which permits grasping by the user. At two spaced points the sidewall thickness is reduced to form areas of increased flexibility. The portion between the areas remains at the original strength. The user grips the container by placing the palm over the area of original strength, with the fingers and thumb, respectively, on the spaced areas of increased flexibility. Exerting gripping pressure deforms the sidewall at the spaced areas, creating the impression of a handle in the container sidewall, and improving the reliability of the grip on the container.
Patent TW-555590-B (TW)
Title: Method for decomposing chlorine-containing organic compound contained in exhaust gas and catalyst used for the method
Inventor: KATO YASUYOSHI
IPC: B01J23/28
Filed: 2000-11-10
Granted: 2003-10-01
Abstract: The invention is to provide (1) a method for decomposing chlorine containing organic compounds (DXNs) contained in an exhaust gas in which method a high decomposition ratio of the DXNs can be obtained even at a low temperature and the effects by SOx can be repressed to a minimum and (2) a method for treating a used catalyst; the method for decomposing DXNs contained in an exhaust gas comprises contacting the DXNs contained in the exhaust gas with nitrogen dioxide (NO2) which is contained in the exhaust gas or added from the outside into the exhaust gas at 100 to 450 DEG C in the presence of a catalyst comprising a titanium oxide, molybdenum oxide, and vanadium oxide, the contents of Ti, Mo, and V in which catalyst being in the range of 99 to 70/0.5 to 15/0.5 to 15 in terms of atomic ratio, respectively, to oxidatively decompose the DXNs with the nitrogen dioxide; and acccording to the method for treating a used catalyst, the DXNs adhered to the catalyst can be made innoxious by contacting the used catalyst with a gas containing NO2 to oxidatively decompose the DXN2 adhered to the catalyst, with the NO2.
Patent TW-496095-B (TW)
Title: PSP matching in GPRS-136HS
Inventor: CARLSSON HANS
IPC: H04W36/14
Filed: 2000-12-04
Granted: 2002-07-21
Abstract: A mobile station of a non-public wireless system is described for communicating in a mobile public voice and data network having a. circuit side for communicating voice and circuit data and a packet side for communicating packet data. The mobile station includes a memory storing information relating to select channels in at least one of the circuit side and the packet side and select channels of the non-public system. A comparator is operable when the mobile station is communicating on a given channel on the packet side for comparing the given channel to the stored information to determine a matched or non-matched condition. A communication control is operable if a matched condition exists to scan for channels of the non-public system, and if a non-matched condition exists to communicate on the packet side.
Patent TW-498029-B (TW)
Title: Cover member and method of making same
Inventor: MELLET YANN J
IPC: B60C11/04
Filed: 2000-12-27
Granted: 2002-08-11
Abstract: A cover for a tire. The tire includes a base with an outer circumferential surface and a tread pattern on the outer circumferential surface. The tread pattern includes a plurality of spaced tread members extending radially outwardly from the outer circumferential surface. The cover is a continuous loop for engagement with the outer circumferential surface between the tread members and has a generally radially outwardly directed external surface. The cover includes a plurality of openings extending therethrough, whereby at least some of the tread members are positioned within the openings.
Patent TW-557569-B (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: FUJISAWA TOMOTAKA
IPC: H01L29/94
Filed: 2001-01-18
Granted: 2003-10-11
Abstract: The present invention relates to a semiconductor device having MIS capacitors with a high capacitance value and a low capacitance value, and the manufacturing method thereof. The semiconductor device of the present invention has a first MIS capacitor formed on the substrate; and the second MIS capacitor whose capacitance is larger than that of the first MIS capacitor. In the device of the present invention, the first MIS capacitor consists of: a lower conductive material region formed on the substrate; a multilayer dielectric film formed by the second insulation film; and the upper conductive film. The second insulating film comprises: a first insulating film using both interlayer insulating film and the dielectric film; and the dielectric film of the second MIS capacitor. The capacitance of the first MIS capacitor is determined by the area of the dielectric film formed by the second insulating film. In the manufacturing method, a first conductive material region and a second conductive material region are formed by doping a semiconductor substrate with impurities; the first insulating film, serving as both the interlayer insulating film and the dielectric film, is formed on the first and second conductive material regions; an opening portion of the first insulating film on the second conductive material region is formed; the second insulating film, serving as a part of the dielectric film of the first MIS capacitor and the dielectric film of the second MIS capacitor, is formed on the first insulating film and in the opening portion; a conductive material film, serving as an upper electrode of the first MIS capacitor and an upper electrode of the second MIS capacitor, is formed on the second insulating film; and the capacitance of the first MIS capacitor is determined by the formation area of the conductive material film. By doing so, the semiconductor device provided by the present invention comprises: the first MIS capacitor having a capacitance value of 100 fF or less; and the second MIS capacitor having a capacitance value exceeding 100 fF.
Patent TW-490823-B (TW)
Title: Bump manufacture process of chip scale package
Inventor: FANG REN-GUANG
IPC: H01L21/60
Filed: 2001-01-20
Granted: 2002-06-11
Abstract: This invention provides a bump manufacture process of chip scale package, which includes: providing a wafer having an active surface which possesses many bonding pads; performing a bump manufacture process to form an under bump metallurgy and then a bump high in lead content, in which the high lead content bump consists of tin and lead, and the lead content is greater than 85%; forming a thermosetting plastic layer on the active area covering the high lead content bump; and polishing the thermosetting plastic surface to expose the high lead content bump.
Patent TW-494039-B (TW)
Title: Corrosion-resistant clad steel plate and its manufacturing method
Inventor: JUNG JU-YONG
IPC: B32B15/18
Filed: 2001-01-30
Granted: 2002-07-11
Abstract: Disclosed are a corrosion-resistant clad steel plate and its manufacturing method. The corrosion-resistant clad steel plate having excellent mechanical bonding force in heterogeneous metals can be manufactured by tack-welding a thin strip of Fe-based amorphous alloy as a binder onto one side or both sides of a carbon steel plate and seam-welding a corrosion-resistant metal plate such as an alloy of nickel or titanium onto the binder to produce a corrosion-resistant clad steel plate; or alternatively, produced by tack-welding a thin strip of Fe-based amorphous alloy as a first binder onto one side or both sides of a carbon steel plate, tack-welding a thin strip of an alloy of nickel or stainless steel and copper as a second binder onto the thin strip and seam-welding a corrosion-resistant metal plate such as an alloy of nickel or titanium onto the binder.
Patent TW-550414-B (TW)
Title: Electro-optical apparatus and method of driving the same
Inventor: TSUDA ATSUNARI
IPC: G09G3/20
Filed: 2001-01-31
Granted: 2003-09-01
Abstract: In providing an electro-optical apparatus with an improved visibility of image in the peripheral region of the active display area, and a method of driving the same, a mask signal generating circuit 12 constantly outputs a mask signal for displaying white. A mask controlling circuit 16 usually outputs a control signal MS for turning on an analog switch 14 and turning off an analog switch 13. Thus, a display signal VS on a terminal 10 is supplied to a display signal line 5 via the analog switch 14, whereby an image is displayed on a display panel 1. Also, the mask controlling circuit 16, based on a data line driving signal and a scanning line driving signal supplied from a timing pulse generating circuit 7, detects the timing for driving each of predetermined pixels in the peripheral region of the display panel 1, and outputs at the timing a control signal MS for turning off the analog switch 14 and turning on the analog switch 13. Thus, white is displayed in the peripheral region of the active display area.
Patent TW-I231151-B (TW)
Title: High efficiency transparent organic light emitting devices
Inventor: PARTHASARATHY GAUTAM
IPC: H01L51/50
Filed: 2001-03-09
Granted: 2005-04-11
Abstract: A highly transparent non-metallic cathode is disclosed that comprises a metal-doped organic electron injection layer that is in direct contact with a transparent non-metallic electron injecting cathode layer, such as indium tin oxide (ITO), wherein the metal-doped organic electron injection layer also functions as an exciton blocking or hole blocking layer. The metal-doped organic electron injection layer is created by diffusing an ultra-thin layer of about 5-10 Å of a highly electropositive metal such as Li throughout the layer. A representative embodiment of the highly transparent non-metallic cathode comprises a layer of ITO, a layer of 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP), which acts as an electron injection, exciton blocking, and hole blocking layer, and an ultra-thin layer of lithium, which degenerately dopes the layer of BCP, improving the electron injecting properties of the BCP layer. This cathode is demonstrated for use in an OLED having a transparency of about 90% or higher combined with a device external quantum efficiency of about 1% or higher.
Patent TW-508687-B (TW)
Title: Local area alloying for preventing dishing of copper during chemical-mechanical polishing(CMP)
Inventor: MISRA SUDHANSHU
IPC: H01L23/52
Filed: 2001-04-11
Granted: 2002-11-01
Abstract: According to the present invention, the dishing of copper during chemical mechanical polishing (CMP) process can be significantly reduced, and in most instances eliminated, by the use of electroplated alloys of copper whereas the alloying metal forms a continuous solid solution with the copper. By forming electroplated alloys of copper with metals that form continuous solid solutions therewith, a deposition layer of such an alloy on the surface of a barrier metal layer allows for lowering the selectivity of the slurry polish used during the CMP process towards the alloy. The alloys of copper with metals that form a continuous solid solution in an electroplating process changes the oxidation characteristics, mechanical properties, electrical properties, stiffness parameters and hardness parameters of the copper. The change in these properties allows the alloy layer and barrier layer to be polished at an equivalent rate until the entire barrier layer has been polished. In this manner, dishing of the copper in the trenches of a wafer from the CMP process can be avoided.
Patent TW-I281721-B (TW)
Title: Method of planning production schedule in semiconductor foundry
Inventor: KE HENG-AN
IPC: H01L21/66
Filed: 2001-05-30
Granted: 2007-05-21
Abstract: This invention relates to a method of planning production schedule in semiconductor foundry. When a sales order whose product does not need to be subjected to the backend process is entered, the planning system goes to search for the supplied amount of the product which can be provided from the semiconductor foundry. The demand of the sales order is compared with the supplied amount of the product that can be provided from the foundry and the smaller one is taken as the supply for the sales order. When a sales order whose product does need to be subjected to the backend process is entered, the planning system subtracts the available amount of the product in the warehouse from the demand of the sales order so as to obtain a balance amount of the product which is still required. Then the system searches for the supplied amount of the product that can be provided from the foundry and the capable to promise (CTP) capacity available for the backend process. The supplied amount is compared with the CTP capacity, and the smaller one is taken as the balanced amount of the product. The available amount of the product in the warehouse is added to the balanced amount of the product for obtaining a total amount of the product as the supply for the sales order.
Patent TW-539986-B (TW)
Title: Multi-functional expansion box for computer
Inventor: HUANG CHING-CHI
IPC: G06F1/18
Filed: 2001-06-13
Granted: 2003-07-01
Abstract: The present invention is a multi-functional expansion box for the computer, which is used to connect to a faceplate of a desktop computer, so that a first input/output (I/O) card and a second I/O card in the desktop computer can be directly connected to the faceplate. The bodies are configured in the desktop computer, and one surface of the body is exposed on the faceplate of the desktop computer, wherein the first I/O slot is configured on the surface of the body for accommodating the first I/O card. When the first input/output card is inserted into the first I/O slot, it can proceed the signal transmission with the desktop computer. The second I/O slot is configured on the surface of the body for accommodating the second I/O card. When the second I/O card is inserted into the second I/O slot, it can proceed the signal transmission with the desktop computer.
Patent TW-502417-B (TW)
Title: Chip-embedded-type semiconductor package with high heat dissipation
Inventor: CHEN YING-JIE
IPC: H01L25/065
Filed: 2001-06-26
Granted: 2002-09-11
Abstract: A chip-embedded-type semiconductor package with high heat dissipation comprises a chip support device having an aperture for mounting of a semiconductor chip; and a heat dissipating structure connected to the chip support device. The heat dissipation structure located on the aperture of the chip support is installed with at least a chip-mounting cavity having an exposed opening. A plurality of through holes are formed between the mounting cavity and the chip support aperture. Two semiconductor chips are separately mounted on the chip cavity and the surface of the heat dissipation structure in the chip support aperture. Any heat generated by an operating chip can be rapidly dissipated by the heat dissipating structure connected thereto. Meanwhile, a more effective integration in the encapsulation space can be provided through the electrical connection between a plurality of wires of a semiconductor chip in the crystal cavity via the through holes and another semiconductor chip in the aperture of the chip supporter. Such an encapsulation can provide a more efficient integration and a smaller encapsulation volume to meet the demands of electric products.
Patent TW-498139-B (TW)
Title: Weld structure and pump device
Inventor: NAKASONE TAKESHI
IPC: B29C65/00
Filed: 2001-07-04
Granted: 2002-08-11
Abstract: The purpose of this invention is to provide a weld structure for preventing the discharge of weld burr generated at the time of welding to the inside and outside of a case body, not exerting adverse effects on the rotary operation of an impeller and the appearance of the case body and generating no deviation even in dimensional accuracy, and a pump device. In the weld structure for integrating a plurality of case members 1, 2 to form the case body 10 having an internal space, a fitting groove 13 is formed to the opposed region of the first case member 1 with the second case member 2 and the projected part 23 fitted in the fitting groove 13 is formed to the opposed region of the second case member 2 with the first case member 1 and, when the projected part 23 is fitted in the fitting groove 13, a predetermined gap 5 is formed in the inside and outside direction of the case members and a positioning part 26 coming into contact with the inner or outer peripheral sides of the first case member 1 to position the first case member 1 in the inside and outside direction of the case members with respect to the second case member 2 is provided to the second case member 2.