baber/WOPTO huggingface dataset:
Patent JP-2004281584-A (JP)
Title: Surface-mounting electronic apparatus
Inventor: SUZUKI YASUYOSHI
IPC: H05K3/46
Filed: 2003-03-13
Abstract: <P>PROBLEM TO BE SOLVED: To obtain the substrate structure of a surface-mounting electronic apparatus in which a via hole land is not exposed to the bottom of the surface-mounting electronic apparatus, and to provide a method for manufacturing the same.  <P>SOLUTION: The surface mounted electronic apparatus 18 has the structure that a multilayer substrate 19 is hermetically sealed by a shield cap 3 made of a metal. A ground electrode pattern is formed over the entire surface of the intermediate layer of the multilayer substrate 19. The ground pattern brought into contact with the projection part 5 of the shield cap 3 provided on the upper surface of the multilayer substrate 19, and the ground electrode pattern provided on the intermediate layer of the multilayer substrate, are electrically connected at the shortest distance by the via holes 20. The ground electrode pattern formed on the intermediate layer of the multilayer substrate 19 is connected to the ground external connection terminal 23 provided at the external connection terminal 22 via a side face electrode 21. A scraped stepped part 24 is formed by an NC router, or a laser, etc. at the periphery of the via hole land exposed to the bottom of the multilayer substrate 19 which is necessary only at the via hole forming time and which becomes unnecessary after the via hole is formed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004276694-A (JP)
Title: Impact buffer
Inventor: ISHIKAWA YUKITAKE
IPC: B60R19/48
Filed: 2003-03-14
Abstract: <P>PROBLEM TO BE SOLVED: To increase the flexibility of the routing design of harness and facilitate the diversion of the harness.  <P>SOLUTION: A bumper 1 comprises a bumper face 2, a plurality of auxiliary devices 3a and 3b fitted to the bumper face 2, flat harness 4 connecting the auxiliary devices 3a and 3b to each other, and an absorber 5 disposed on the rear surface side of the bumper face 2, and is supported on a reinforcement not shown. Harness slack absorption parts 5a and 5b comprising recessed parts are formed at the portions of the absorber 5 corresponding to the auxiliary devices 3a and 3b. The slack parts of the flat harness 4 at portions connecting the auxiliary devices 3a and 3b to each other are stored in the harness slack absorption parts 5a and 5b. Thus, the harness of common specification having an allowance in the length of the harness can be applied to different impact buffers, and the flexibility of harness design and routing design can be increased.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004281604-A (JP)
Title: Semiconductor device and its manufacturing method
Inventor: ASAKAWA TSUTOMU
IPC: H01L21/28
Filed: 2003-03-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a wiring structure for performing a low contact resistance while maintaining the reliability of a barrier nature, and to provide a method for manufacturing the same.  <P>SOLUTION: A contact hole 14 reaching the surface of the silicide layer 12 of a diffusion layer 11 is formed on an interlayer insulating film 13 made of an SiO<SB>2</SB>film on an Si semiconductor substrate. A silicide film 15 of TiSi<SB>2</SB>made by C54 phase is formed at least at the bottom of the contact hole 14. In Figure, this silicide film 15 of the TiSi<SB>2</SB>exists continuously up to the interlayer insulating film 13 including the inner wall of the contact hole 14. A TiN film 16 as a reaction barrier is formed on this silicide film 15. A wiring member 17 is formed on the TiN film 16. The wiring member 17 embeds in the contact hole 14 and operates as a main wiring layer.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004280435-A (JP)
Title: Content creation device, content display unit, and data processor
Inventor: SAIKA HISAFUMI
IPC: G06F17/21
Filed: 2003-03-14
Abstract: <P>PROBLEM TO BE SOLVED: To create content using a character set desired by a creator.  <P>SOLUTION: When content data is created, a conversion part 411 analyzes/inspects that a character included in descriptive content data in a descriptive content data memory 408 is included in a character set being a subset of a universal set of character codes indicated by a character set content information memory 409 and a character set information memory 410, thereby preventing inclusion of a character unintended by the content creator in the content. In addition, a content display unit inspects whether identification information on the character set included in the descriptive content data matches identification information on a character set of installed external fonts to decide whether the character set can be displayed, thereby preventing transformed characters or the like during display.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004277827-A (JP)
Title: Hydrogen-occluding alloy powder, its production method, hydrogen-occluding alloy electrode, and nickel-hydrogen storage battery
Inventor: FURUKAWA KENGO
IPC: H01M10/30
Filed: 2003-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hydrogen-occluding alloy electrode excellent in high-rate discharge characteristics and cycle characteristic and a nickel-hydrogen storage battery, and to simplify formation of the nickel-hydrogen storage battery.  <P>SOLUTION: A hydrogen-occluding alloy powder used for the hydrogen-occluding alloy electrode mainly comprises at least one rare-earth element including La, transition metal elements comprising Ni, Co, and Mn, and Al. The powder has a layer which contains 100 mol% Ni, ≥5 mol% La, and ≤5 mol% total of Mn and Al, has a thickness of 50-400 nm, and formed on the outer surface of a mother layer mainly comprising the rare-earth element, the transition metal elements, and Al.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004278739-A (JP)
Title: Continuously variable transmission for vehicle having improved manual speed change characteristic in high-speed drive
Inventor: ITO YOSHIO
IPC: F16H61/00
Filed: 2003-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To maintain delicate speed change setting properties over an entire region in high-speed drive from low-speed drive so that a manual operation end effectively work over the entire region of the travel width even in high-speed drive when performing the manual speed change control of a continuously variable transmission for vehicles.  <P>SOLUTION: A manual speed change control means performs setting so that a lower limit value becomes higher in high-speed drive than that in low-speed drive according to a vehicle speed, and allows the operation of an operation end to constantly correspond to the rotational speed of an input member equal to or more than the lower limit value corresponding to the vehicle speed at that time when setting the lower limit value of the rotational speed of the input member in a continuously variable mechanism.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004243067-A (JP)
Title: Scissors provided with knocking boss with adjustable length
Inventor: MATSUMOTO TOKUNARI
IPC: B26B13/00
Filed: 2003-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide scissors allowing smooth cutting without hesitation when paper or cloth having a length longer than blades of the scissors is cut by continuously meshing the blades.  <P>SOLUTION: The scissor provided with the knocking boss with adjustable length is provided with the knocking boss 2 of which length is adjustable on a handle 1 of the scissor. When the scissors are used with the boss extended longer, the distance between the contact points of the bosses of two handles becomes short so that the two blades stop engaging to a nearer side away from the tips of the blades and are kept a little open.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004285834-A (JP)
Title: Device and method for fuel injection correction at warming-up of air-cooled type internal combustion engine
Inventor: KOKUBU SHIRO
IPC: F02D41/14
Filed: 2003-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To appropriately perform the warming-up loading correction processing of an air-cooled type internal combustion engine.  <P>SOLUTION: In this air-cooled type internal combustion engine provided with an electronic controlled fuel injection device, at the warming-up loading correction processing, an oil temperature Te and an intake air temperature Ti are detected. A correction coefficient Kd×Ke is controlled such that the lower the detected oil temperature Te is and the bigger a difference between the detected oil temperature Te and the detected intake air temperature Ti is, the more a fuel injection amount is increased. By taking into account not only the oil temperature Te which is considered to be an engine temperature but also the intake air temperature Ti, more appropriate warming-up loading correction processing can be performed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004284396-A (JP)
Title: Installment structure of sensor unit in wheel state detection device
Inventor: NORIMATSU HIDEAKI
IPC: G01L17/00
Filed: 2003-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an installment structure of a sensor unit capable of certainly receiving a transmission signal of the sensor unit by a receiver in at least a stopping state.  <P>SOLUTION: When the sensor unit 15 is positioned at an upper part of a tire, an antenna of the receiver is arranged so as to receive radio from the sensor unit 15. An outer ring 13 slipping against an inner ring 11 is provided on the outside of the inner ring 11 fixed to a rim of the wheel. The outer ring 13 has a weight 13a at a part and the sensor unit 15 is fixed to the outer ring 13 becoming point symmetrical to a position of the weight 13a of the outer ring 13 making a rotation axis O of the wheel as a center. Since the weight 13a of the outer ring 13 is positioned at the lower end of the outer ring 13 by gravity, the sensor unit 15 is positioned at the upper part of the tire and the receiver can certainly receive the radio from the sensor unit.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004288721-A (JP)
Title: Semiconductor device, its manufacturing method, circuit board, and electronic equipment
Inventor: MIZUNO SHINJI
IPC: H01L21/60
Filed: 2003-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is prevented from causing troubles due to voids by preventing voids from being left at the time of using the three-dimensional mounting technique for laminating semiconductor devices upon another for, particularly, increasing the mounting density, and to provide a method of manufacturing the device, a circuit board equipped with the device, and electronic equipment.  <P>SOLUTION: The semiconductor device 1 is provided with connecting electrodes 34 on at least one of its front and rear surfaces. The device 1 has a through hole 11 formed through the device 1 from one surface to the other surface.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004284606-A (JP)
Title: Pouch for liquid food
Inventor: YAMAGUCHI MADOKA
IPC: B65D33/00
Filed: 2003-03-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pouch for liquid food in which an opening part for water replenishment for diluting contents in the pouch or for cleaning a retention line before and after the pouch for liquid food is used is formed in an upper part of the pouch without using any separate member, and the opening part is folded in a lid-closing condition when liquid food is given.  <P>SOLUTION: The pouch for liquid food is formed by heat-sealing a peripheral edge of a body material formed of a plurality of plastic films, and fitting a content ejector to a lower peripheral edge. The pouch for liquid food has a barrel branched from a pouch barrel, a hanging means is formed on an upper heat-seal part of the pouch barrel, a tearable, planned opening part is formed in the branched barrel, and the barrel is foldable at a barrel branch part.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004006730-A (JP)
Title: Semiconductor memory element and semiconductor memory
Inventor: KATO KIYOSHI
IPC: H01L29/792
Filed: 2003-03-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor memory capable of a high speed operation by fabricating TFTs and semiconductor elements on a substrate having an insulating surface.  <P>SOLUTION: Strain or stress incident to crystallization can be concentrated to a region other than a recess by depositing a semiconductor film on an insulating film provided with a linear recess and irradiating the semiconductor film with a laser beam thereby pouring molten semiconductor into the recess. When the surface of crystalline semiconductor film is removed by etching, a crystalline semiconductor film having a side face covered with the sidewall of the recess and not containing a crystal grain boundary other than a twin is formed in the recess region. Since it can be employed as a channel region of a semiconductor element or a TFT, a highly reliable semiconductor element and a TFT exhibiting a high field effect mobility can be fabricated while suppressing variation in characteristics resulting in a highly reliable semiconductor memory capable of high speed operation.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004284225-A (JP)
Title: Manufacturing method of resin molded article, manufacturing method of metal structure, and chip
Inventor: NISHI TAIJI
IPC: B29C67/00
Filed: 2003-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a precise and inexpensive resin molded article.  <P>SOLUTION: The manufacturing method of the resin molded article comprises a resist pattern forming step at which a desired resist pattern is formed by performing formation of a first resist layer on a substrate, alignment of the substrate with a mask (A), exposure of the first resist layer by using the mask (A), heat treatment of the first resist layer, formation of a second resist layer on the first resist layer, alignment of the substrate with a mask (B), exposure of the second resist layer by using the mask (B), heat treatment of the second resist layer and development of the resist layers. Furthermore, the resin molded article is manufactured by a metal structure forming step at which a metal structure is deposited on the substrate by plating according to the resist pattern and by a molded article forming step at which the resin molded article is formed with the metal structure used as a mold.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005180921-A (JP)
Title: Surface of biosensor chip for carrying polyethylene glycol modified nanoparticles
Inventor: KATAOKA KAZUNORI
IPC: G01N33/532
Filed: 2003-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a biosensor system having high sensitivity and reduced in the unspecific adsorption of impurities.  <P>SOLUTION: The biosensor assay system to immobilize or capable of immobilizing polyethylene glycol modified nanoparticles on the surface of a biosensor is provided.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004287974-A (JP)
Title: Terminal device for document preparation, document preparation system and program for document preparation
Inventor: FUJISAWA KAZUMASA
IPC: G06F17/22
Filed: 2003-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a terminal device for document preparation capable of easily preparing and transmitting a document such as a postcard at the place where a user is away from home and to provide a document preparation system and a program for document preparation.  <P>SOLUTION: This terminal device is provided with a document editing means 22 which selects destination data 24 that is information showing a document destination and is preregistered in a server, acquires the destination data 24 through a network 1, automatically narrows down a message group among message groups registered in the server apart from the destination data 24 and to be included in a document according to a characteristic of the destination data registered with the destination data 24 and the nature of a designated document, displays the narrowed-down message group as a candidate for selection and automatically generates a new document including the destination data.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004285988-A (JP)
Title: Cooling fan device
Inventor: KASAI TADASHI
IPC: F01P5/04
Filed: 2003-03-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cooling fan device which can be employed without significantly changing an engine layout and the like mounted on a vehicle and controls the rotation speed of a cooling fan.  <P>SOLUTION: This cooling fan device driving a cooling fan 3 cooling an engine 1 comprises a sun gear 11 connected with a rotary shaft of the cooling fan 3, a planet gear 13 meshed with the sun gear 11, a carrier 14 rotatably supporting the rotary shaft of the planet gear 13 and connected with the engine output shaft 4, a ring gear 12 meshed with the planet gear 13 and rotating coaxially with the sun gear 11 for constituting a planetary gear mechanism 10, a speed adjusting gear 15 meshed with the ring gear 12, a hydraulic motor 21 rotary driving the speed adjusting gear 15, and a brake 17 braking rotation of the ring gear 12.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004291001-A (JP)
Title: Welding method of component for shift lever
Inventor: KATO TOSHIAKI
IPC: F16H61/36
Filed: 2003-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a welding method by which accuracy of a joining position at the time of welding each portion of a component for a shift lever is improved.  <P>SOLUTION: A pin 6 to press-fit a long hole 2b of a component main body 2 and a boss guide hole 7 into which a boss member 3 is press-inserted are formed on a main body 5 of a welding holder 4 for fixing the component main body 2 of a component 1 for the shift lever. The component main body 2 is positioned on the welding holder 4 by the long hole 2b and, when two boss members 3 are inserted into the boss fixing hole 2a of each component main body 2 to press-fit the boss guide hole 7, a clearance having a prescribed width is formed between an internal diameter surface of each boss fixing hole 2a and an external diameter surface of the boss member 3 so that the clearance absorbs heat deformation at the time of welding the boss member 3. Thus, the joining position of each boss member 3 is not easily misaligned from the target position.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004293864-A (JP)
Title: Ventilating device
Inventor: TAGUCHI SHOJI
IPC: F24F7/10
Filed: 2003-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a ventilating device capable of reducing the noise.  <P>SOLUTION: This ventilating device comprises a grill 13 having the shape to be mounted on an outer periphery of a frame part 4 of a main body 8, closed by a panel 9 at its front face, and provided with air holes 12 on its left and right side faces 10 and upper face 11, and shutters 14 mounted on the air holes 12. When the shutters 14 are closed, the air holes 12 are closed to be along a frame face of the grill 13, and when the shutters 14 are opened, they are movable approximately vertically to the frame face of the grill 13 to open the air holes 12, whereby the supplied air flow can be straightened, and the noise can be reduced.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004271491-A (JP)
Title: Gas sampling adapter
Inventor: KOBAYASHI HISAYOSHI
IPC: G01N1/22
Filed: 2003-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gas sampling adapter capable of increasing an air permeable area as much as possible and facilitating the replacement of a water-repellent permeable sheet.  <P>SOLUTION: This gas sampling adapter comprises a circularly sectional bottomed frame body 1 having pores on the circumferential surface, a lid body 2 engageable with the opening 1b of the frame body 1, a winding plate 3 with pores 3a on the circumferential surface, which can be housed in the frame body 1 and wound by taper parts 4 and 5 formed on the frame body 1 and the lid body 2 so as to reduce the diameter, and a water-repellent permeable sheet 7 wound on the winding plate 3. A suction port is formed in the bottom of the lid body 2 or the frame body 1, and a negative pressure is worked on the inner surface side of the permeable sheet 7 to execute a sampling.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004006763-A (JP)
Title: Processing method of wafer and ion implanter
Inventor: SEKI HIROBUMI
IPC: H01J37/317
Filed: 2003-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a processing method of a wafer for forming very thin SOI and thick BOX with implantation by a low acceleration voltage, by implanting oxygen ion beams different in energy to the same silicon wafer.  <P>SOLUTION: The oxygen ion beams of different energy are implanted to the same wafer, and the SIMOX wafer of SOI and BOX, which have equal thickness, can be manufactured with the acceleration voltage of about half degree by the method. Thus, an implanter can be made inexpensive.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004303761-A (JP)
Title: Method for manufacturing thin film transistor device, and thin film transistor device
Inventor: KUROSAWA NORIO
IPC: H01L27/08
Filed: 2003-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a TFT device integrated with a peripheral circuit in which both low cost and high characteristics are reconciled with each other.  <P>SOLUTION: After a semiconductor layer is formed on a substrate (step S1), a first insulating film and a first gate electrode are formed in regions for forming low voltage P type and N type TFTs (step S2) and then a second insulating film and a second gate electrode are formed in regions for forming high voltage P type and N type TFTs (step S3). After an N type LDD region is formed by implanting N type impurities into the semiconductor layer using the first and second gate electrodes as masks (step S6), the N type LDD region is inverted into a P type high concentration impurity layer by implanting P type impurities into the region for forming the P type TFT using the first and second gate electrodes as masks (step S7).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004298980-A (JP)
Title: Scribing device and scribing method
Inventor: KAWAMURA NOBUHIRO
IPC: B25H7/04
Filed: 2003-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To realize a scribing device to efficiently draw a scribed line on a base plate.  <P>SOLUTION: This scribing device is constituted of a base plate holding part 5 to hold the base plate 12, a scribing blade part 23 to draw the scribed line on the base plate 12 and a driving motor 3 and a driving rail 4 connected to either of the scribing blade part 23 and the base plate holding part 5 and to work in a specified direction. The scribing device to draw the scribed line on the base plate is provided with pressurizing means 27, 28 to apply pressure in the base plate direction on the scribing blade part 23 so that the the scribing blade part 23 makes flexibly contact with a scribing surface of the base plate 12 by actuating the base plate holding part 5 holding the base plate 12 or the scribing blade part 23 by the driving motor 3 and the driving rail 4.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004302095-A (JP)
Title: Image pickup device
Inventor: KONO HIROYUKI
IPC: H04N5/372
Filed: 2003-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image pickup device which allows a microlens array to be arranged on the light receiving surface of an image sensor and allows aberrations of an imaging optical system such as curvature of field to be easily improved.  <P>SOLUTION: The image pickup device is provided with an aperture part 1, a condenser lens 2, a cover member 3 made of a transparent material, an image sensor 5, and a sensor package 7. Light emitted from a subject being in the front of the image pickup device passes the aperture part 1 and impinges on the condenser lens 2 and is transmitted through the condenser lens 2 and then is condensed on a light receiving surface 5a of the image sensor 5 through the cover member 3. The cover member 3 and the image sensor 5 are arranged closely to each other with such a space between them that the microlens array can be arranged between them. In the cover member 3, a concave lens 3a for compensating curvature of field, is formed integrally therewith.  <P>COPYRIGHT: (C)2005,JPO&NCIPI