baber/WOPTO huggingface dataset:
Patent TW-201921406-A (TW)
Title: Systems and methods for compensating dispersion of a beam separator in a single-beam or multi-beam apparatus
Inventor: REN WEI-MING
IPC: H01L21/66
Filed: 2018-07-25
Abstract: Systems and methods are provided for compensating dispersion of a beam separator in a single-beam or multi-beam apparatus. Embodiments of the present disclosure provide a dispersion device comprising an electrostatic deflector and a magnetic deflector configured to induce a beam dispersion set to cancel the dispersion generated by the beam separator. The combination of the electrostatic deflector and the magnetic deflector can be used to keep the deflection angle due to the dispersion device unchanged when the induced beam dispersion is changed to compensate for a change in the dispersion generated by the beam separator. In some embodiments, the deflection angle due to the dispersion device can be controlled to be zero and there is no change in primary beam axis due to the dispersion device.
Patent TW-201921661-A (TW)
Title: Solid-state imaging device and electronic apparatus
Inventor: YOKOGAWA SOZO
IPC: H01L27/146
Filed: 2018-08-07
Abstract: An imaging device includes a first photoelectric conversion region receiving light within a first range of wavelengths, a second photoelectric conversion region receiving light within a second range of wavelengths, and a third photoelectric conversion region receiving light within a third range of wavelengths. At least a portion of a light-receiving surface of the first photoelectric conversion region has a first concave-convex structure, and a light-receiving surface of the second photoelectric conversion region has a different structure than the first concave-convex structure.
Patent TW-202010107-A (TW)
Title: Semiconductor device and method for manufacturing same
Inventor: SUZUKI KAZUTAKA
IPC: H01L27/11551
Filed: 2018-09-06
Abstract: To provide a semiconductor device in which a plug can be suitably formed on a line, and a method for manufacturing the same. According to an embodiment, a semiconductor device is provided with a first insulating film and a plurality of lines provided inside the first insulating film. The device is further provided with: a second insulating film provided on the first insulating film and the plurality of lines; and a conductor provided on a first line among the plurality of lines and having an upwardly protruding shape with respect to the first line inside the second insulating film. The device is further provided with a plug provided on the first line through the conductor. The device is further provided with a first pad provided above the plug and electrically connected to the plug. The device is further provided with a second pad provided on the first pad and electrically connected to the first pad.
Patent TW-201915002-A (TW)
Title: Inhibitor of influenza virus replication and use thereof capable of not only excellently inhibiting influenza virus but also having lower cytotoxicity and superior in-vivo pharmacokinetics properties
Inventor: Tang chang-hua
IPC: C07D491/22
Filed: 2018-09-18
Abstract: The present invention relates to the field of medicines and, more particularly, to a novel compound serving as an inhibitor of influenza virus replication, a preparation method thereof, a pharmaceutical composition comprising the compound, and the use of the compound and the pharmaceutical composition thereof for treating influenza. The compound of the present invention is a compound represented by formula (I) or a stereoisomer, tautomer, nitrogen oxide, solvate, metabolite, pharmaceutically acceptable salt or their pro-drugs of the compound represented by formula (I). The compound of the present invention not only excellently inhibits influenza virus, but also has lower cytotoxicity, superior in-vivo pharmacokinetics properties and in-vivo pharmacodynamic (PD) properties.
Patent TW-201923368-A (TW)
Title: Real time monitoring of a multi zone vertical oven with early detection of a heating zone failure
Inventor: GRUBER SVEN
IPC: H01L21/67
Filed: 2018-09-20
Abstract: The aim of the invention is to help avoid wafer losses in thermal treatment. Wafers have values of up to 150,000 euros per batch. Therefore, unplanned failure of the thermal device for treating the wafers should be avoided. The method according to the invention for monitoring the thermal device(s) (100) for receiving and controlling the temperature of wafer lots or batches of wafers uses a continuously applied measurement of a resistance value (R1) in at least one heating zone (1') of a plurality of heating zones (1', 2', 3', 4', 5') of the thermal device. The currently measured value (R1(i)) of the resistance (1) in the associated heating zone (1') is compared with a previously measured value (R1(i-1)) of the same resistance (1). A warning or an alarm (90) for the thermal device (100) is already generated when a deviation ([Delta]Ri) of the two resistance values from the same heating zone (1') is detected by means of the comparison, said warning or alarm occurring temporally before a failure of a whole heating zone (1) of the thermal device (100). Improved ability to plan resources is a further goal.
Patent TW-201930716-A (TW)
Title: An offshore wind farm and substation
Inventor: HOSPERS ALEXANDER
IPC: F03D9/30
Filed: 2018-09-28
Abstract: An offshore wind farm (1) comprising a number of wind turbine generator arrays (5). Each wind turbine generator array (5) comprises an array transformer (8) and a number of wind turbine generators (6) connected, in use, electrically to the array transformer (8). The array transformer (8) is associated with one wind turbine generator (6) among said number of wind turbine generators (6) and each array transformer (8) is, in use, electrically connected a bus bar (17) on the offshore substation (4). The bus bar (17) on the offshore substation is, in use, directly connected electrically to an export cable (3) or an HVDC converter (18).
Patent TW-201927514-A (TW)
Title: Resin molding device and manufacturing method of resin molded product capable of constituting a molding die with a small number of parts
Inventor: ARAKI KOICHI
IPC: B29C45/73
Filed: 2018-10-05
Abstract: The present invention provides a resin molding device capable of constituting a molding die with a small number of parts. The resin molding device of the present invention is characterized by: comprising a molding die (1000), a temperature rising stage (S1), a resin molding stage (S2), and a discharging stage (S4). The molding die (1000) includes one mold (200) and the other mold (100), which is capable of demolding a resin molded product (1b), after the resin is molded, from the other mold (100) while being fixed to one mold (200). At least one of the mold (200) and the other mold (100) can be mounted and disassembled with respect to each of the stages, and can be moved among the respective stages at the same time. The temperature of the molding die (1000) is increased in the temperature rising stage (S1), the resin is molded in the resin molding stage (S2), the resin molded product (1b) is demolded from the molding die (1000) in the discharging stage (S4).
Patent TW-201924083-A (TW)
Title: Light emitting diode and light emitting display device including the same
Inventor: LEE TAE-YANG
IPC: H01L33/02
Filed: 2018-10-12
Abstract: A light emitting diode and a light emitting display device are disclosed. The light emitting diode includes a first electrode and a second electrode facing each other; and a hole transporting layer between the first electrode and the second electrode, wherein the hole transporting layer includes an inorganic compound of a chemical formula 1, A:M1:M2, where the A is a semiconductor nano particle or a nano inorganic particle selected from a metal oxide group, and the M1 and M2 are different from each other and metal positive ions which the A is doped with.
Patent TW-202017210-A (TW)
Title: Wafer level light-emitting diode packaging method and structure thereof capable of reducing cost and improving speed of process production by means of printed circuits
Inventor: HUANG KUO-HSIN
IPC: H01L33/52
Filed: 2018-10-23
Abstract: The method of the present invention is used to package a plurality of light-emitting diode chips on a wafer protective film. The method includes the following steps: forming a package surface layer on first electrodes of the light-emitting diode chips; forming a leading electrode electrically connected to the first electrode on the package surface layer; cutting the light-emitting diode chips, and sorting, testing and regrouping the light-emitting diode chips; covering sides of the light-emitting diode chips with a package layer; drilling and filling a conductive material on the package layer to form a plurality of common electrodes; printing a plurality of common electrical circuits, and electrically connecting each of the common electrical circuits to one of the common electrodes and the plurality of leading electrodes; and finally covering with a circuit protection layer to complete the process. Accordingly, the present invention directly performs packaging on the wafer protective film without using a package substrate, and the costs can be reduced and the speed of process production can be improved by means of the printed circuits.
Patent TW-202020167-A (TW)
Title: Bottom blowing double tube for converter
Inventor: LIN CHANG-SHENG
IPC: C21C5/48
Filed: 2018-11-19
Abstract: A bottom blowing double tube for a converter is described. The bottom blowing double tube for the converter includes an outer tube and an inner tube. The outer tube has a pipeline and an inner side surface. The inner tube is disposed within the pipeline, in which the inner tube has a first gas channel and an outer side surface. The inner tube includes various ribs disposed on the outer side surface of the inner tube, and a second gas channel is formed between every two adjacent ribs, the inner 
side surface of the outer tube, and the outer side surface of the inner tube.
Patent TW-201933335-A (TW)
Title: Application processor supporting low power echo cancellation, electronic device including the same and method of operating the same
Inventor: KIM SUN-KYU
IPC: G10L17/22
Filed: 2018-11-23
Abstract: An application processor is provided. The application processor includes a system bus, a host processor, a voice trigger system and an audio subsystem that are electrically connected to the system bus. The voice trigger system performs a voice trigger operation and issues a trigger event based on a trigger input signal that is provided through a trigger interface. The audio subsystem processes audio streams through an audio interface. While an audio replay is performed through the audio interface, the application processor performs an echo cancellation with respect to microphone data received from a microphone to generate compensated data and the voice trigger system performs the voice trigger operation based on the compensated data.
Patent TW-202022185-A (TW)
Title: Thread breaking protection device of circular loom capable of avoiding the rotation of the reel when the weft thread is broken
Inventor: Wu zhen-kun
IPC: D04B35/14
Filed: 2018-12-07
Abstract: Provided is a thread breaking protection device of circular loom. The circular loom includes a shuttle frame, and is suitable for a reel wound with a weft thread. The thread breaking protection device includes a base fixed on the shuttle frame; a rotating member provided on the base; a resetting member provided on the base; and a probe arm having one end pivotally connected to the base and the other end through which the weft thread passes. When the circular loom is running, the probe arm is pulled by the weft thread so that the probe arm does not trigger a stop mechanism thereby outputting the weft thread and driving the reel to rotate. When the weft thread is broken, instead of being driven by the tension of the weft thread, the probe arm is reversely driven by the elastic force of the resetting member to lock the stop mechanism and stop the rotation of the rotating member, thereby avoiding the rotation of the reel to prevent the weft thread from incontrollable knotting and shuttle hitting.
Patent TW-201931465-A (TW)
Title: Plasma etching method and plasma etching apparatus
Inventor: YATSUDA KOICHI
IPC: H01L21/3065
Filed: 2018-12-14
Abstract: This plasma etching method comprises: a physical adsorption step wherein an adsorbate based on a first processing gas is caused to physically adsorb onto an etching object film, while cooling an object to be processed on which the etching object film is formed; and an etching step wherein the etching object film is etched by causing the adsorbate and the etching object film to react with each other by means of a plasma of a second processing gas.
Patent TW-201932525-A (TW)
Title: Crosslinked molding and method for manufacturing same
Inventor: SAKAI TATSUYA
IPC: C08K5/05
Filed: 2018-12-17
Abstract: The present invention addresses the problem of providing a crosslinked molding in which permanent compression set is further reduced, and a method for manufacturing a crosslinked molding that us suitable for obtaining a crosslinked molding in which permanent compression set is further reduced, and whereby a single cycle of injection molding can be shortened when a crosslinked molding is obtained by compression molding. The present invention pertains to a method for manufacturing a crosslinked molding, characterized by comprising melt-kneading a composition including a polymer having a terminal double bond, a hydrosilyl-group-containing compound (Y) having at least two hydrosilyl groups in each molecule thereof, a platinum-based catalyst (Z) for hydrosilicon crosslinking, and a reaction inhibitor (D), performing injection molding in a die, performing primary crosslinking in the die, and extracting the primary-crosslinked molding from the die, and then performing secondary crosslinking in a heating medium.
Patent TW-202004742-A (TW)
Inventor: YEH PING-SHENG
IPC: G11B33/04
Filed: 2018-05-30
Abstract: A detachable carrier can include a substrate, a first supporter and a second supporter. The substrate has a first region and a second region adjacent to each other. The first region is connected to a first side of the substrate. The second region is laterally adjacent to the first region and connected to a second side of the substrate opposite to the first side, and located on an upper half section of the second side. The first supporter is detachably disposed on the first region and located by the first side. The second supporter is disposed adjacent to the first supporter and detachably disposed on the second region, so as to locate by the upper half section of the second side. The first supporter and the second supporter are utilized to support several electronic devices.
Patent TW-201919505-A (TW)
Title: Method and system for positioning shoe parts in an automated manner during a shoe-manufacturing process
Inventor: REGAN PATRICK CONALL
IPC: A43D999/00
Filed: 2012-11-16
Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by automated placement of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated in an automated manner.
Patent TW-201941962-A (TW)
Title: Laminate film
Inventor: YAMASHITA YASUHIRO
IPC: B32B9/00
Filed: 2019-03-22
Abstract: The present invention addresses the problem of providing a laminate film having excellent heat resistance. The present invention relates to a laminate film comprising a second primer layer, a flexible base material, a first primer layer, a first organic layer, and a first inorganic thin film layer in this order. Each of the first primer layer and the second primer layer has a softening temperature of 130 DEG C or more. When the laminate film is heated while being pulled under conditions of a tensile load of 29.4 mN and a temperature rising rate of 20 DEG C per minute, the relationship dA/dT > 0 is satisfied at all times with T in the range of 50 to 200 DEG C, where A ([mu]m) is the amount of thermal expansion displacement in the MD direction and T (DEG C) is the heating temperature. A dimensional change ratio in the MD direction when the laminate film is heated from 25 DEG C to 200 DEG C and then cooled to 25 DEG C after being left for 20 minutes at 200 DEG C is -0.3 to 0.5%.
Patent TW-201945273-A (TW)
Title: Sensor device and manufacturing method thereof
Inventor: YANG CHEN-HSIUNG
IPC: H04R31/00
Filed: 2019-03-28
Abstract: A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.
Patent TW-201942169-A (TW)
Title: Block copolymer, method for producing same, rubber composition using said block copolymer, and tire
Inventor: KODA DAISUKE
IPC: C08K3/36
Filed: 2019-03-29
Abstract: A block copolymer which contains: a polymer block A that contains a monomer unit (a1) derived from a farnesene; and a random copolymer block B that contains a monomer unit (b1) derived from a conjugated diene having 12 or less carbon atoms and a monomer unit (b2) derived from an aromatic vinyl compound. This block copolymer is configured such that: the mass ratio (A/B) of the polymer block A to the random copolymer block B in this block copolymer is from 30/70 to 0.5/99.5; the content of the monomer unit (b2) derived from an aromatic vinyl compound in the random copolymer block B is 1-50% by mass; and the weight average molecular weight (Mw) of this block copolymer is from 100,000 to 5,000,000.
Patent TW-201943421-A (TW)
Title: Method for analyzing and identifying active ingredients in traditional Chinese medicine characterized by overcoming some of key deficiencies of traditional Chinese medicines and the disadvantages of requiring long time and high cost to develop western medicines
Inventor: Zhang jian-yi
IPC: G01N33/15
Filed: 2019-04-09
Abstract: The present invention discloses a method for analyzing and identifying active ingredients in traditional Chinese medicine. Based on doctors' experiences or reports, the method includes: selecting traditional Chinese medicine combinations for certain diseases; extracting compounds therefrom, separating the compounds by chromatography and then performing combination and concentration; selecting an appropriate animal or microbial model to perform animal or microbiological experiments with different compound combinations; removing the compounds having no treatment effects in the experiment; and repeating said procedures until no compounds can be removed. The discovered compounds can be prepared to be medicines in various forms to treat patients, or the discovered compounds is mixed with other compounds to be medicines in various forms for treating patients. The present method of analyzing and identifying active ingredient in traditional Chinese medicines has all advantages of traditional Chinese medicines and overcomes some of key deficiencies of traditional Chinese medicines and the disadvantages of requiring long time and high cost to develop western medicines.
Patent TW-202040167-A (TW)
Title: Optical lens with laser-induced periodic surface microstructure can control shape and interval of microstructure through proper laser machining parameter to satisfy hydrophilicity or hydrophobicity
Inventor: WU SHENG-CHE
IPC: B82Y20/00
Filed: 2019-04-15
Abstract: An optical lens with laser-induced periodic surface microstructure comprises an optical lens which is an integral material and having a surface and a curved surface on an opposite surface. The curved surface of the optical lens is induced by laser so that the curved surface of the optical lens is formed into a laser-induced periodic surface microstructure. The structure arrangement includes a plurality of structures arranged periodically. The structure dimension is that each structure is spaced 50nm to 1000nm from another structure while a height is 50nm to 500nm.
Patent TW-202004320-A (TW)
Title: Imaging apparatus
Inventor: FURUYA YOSHIO
IPC: H04N5/225
Filed: 2019-04-22
Abstract: In order to excellently capture an image of the inner circumferential surface of a hole in a short time, the present invention is provided with: a light source that emits illumination light for illuminating the inner circumferential surface of a hole that is formed in a hole forming direction from a surface of an image-capture subject; a head part that has a plurality of folding mirrors, and that rotates about a rotation axis parallel with the hole forming direction in a state of being inserted in the hole such that the plurality of folding mirrors guide the illumination light to regions, of the inner circumferential surface, different with respect to the hole forming direction and reflection light beams having been reflected by the regions are taken out from the hole; an image rotation correcting unit that keeps the orientation of an image captured by an image capture unit constant, by guiding, toward the image capture unit, a plurality of the reflection light beams taken out by the head part, while rotating about the rotation axis such that the rotation angle of the image rotation correcting unit per unit time becomes equal to one half of the rotation angle of the head part; and an optical path length difference correcting unit that guides the reflection light beams emitted from the image rotation correcting unit to the image capture unit while adjusting, for each of the reflection light beams, the optical length of the reflection light beam from the image rotation correcting unit to the image-capture unit according to the optical length difference among the plurality of reflection light beams in the head part.
Patent TW-201945968-A (TW)
Title: Electronic device with fingerprint verification function and operation method thereof
Inventor: CHU SHU-HSIEN
IPC: G06K9/00
Filed: 2019-04-25
Abstract: The invention provides an electronic device with a fingerprint verification function and an operation method thereof, including a first fingerprint sensor and a second fingerprint sensor. The first fingerprint sensor is used to verify the first fingerprint. The second fingerprint sensor is used to verify the second fingerprint. When the one of the first fingerprint and the second fingerprint is successfully verified, the electronic device logs into an operation system. When the first fingerprint and the second fingerprint are successfully verified at the same time and the first fingerprint is different from the second fingerprint, the electronic device executes an application.
Patent TW-202042568-A (TW)
Inventor: TU PO-JEN
IPC: H04S7/00
Filed: 2019-05-07
Abstract: A speaker adjustment method applicable to an electronic device including two microphones and two speakers is provided. The speaker adjustment method includes the following steps: obtaining two first frequency responses corresponding the two speakers by using one microphone, and obtaining two second frequency responses corresponding the two speakers by using another microphone; calculating a sensitivity difference between the two microphones according to the two first frequency responses and the two second frequency responses, where a distance ratio of distances from the two microphones to one speaker equals to a distance ratio of distances from the two microphones to another speaker; and adjusting outputs of the two speakers according to the sensitivity, at least one of the first frequency responses and at least one of the second frequency responses. In addition, an electronic device using the speaker adjustment method is also provided.