Patent SG-11201900340Q-A (SG)
Title: Land grid based multi size pad package
Inventor: KAKADE Manoj
IPC: H01L21/60
Filed: 2017-07-25
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 11111111111111E1010 III 011111010011111101111111111011111111011111011110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/038848 Al 01 March 2018 (01.03.2018) WIP01 PCT (51) International Patent Classification: PORATED, 5775 Morehouse Drive, San Diego, California H01L 21/60 (2006.01) 92121-1714 (US). ZANG, Ruey Kae; QUALCOMM IN- CORPORATED, 5775 Morehouse Drive, San Diego, Cali- (21) International Application Number: PCT/US2017/04366forma foa 92121-1714 (US). LI, Yue; QUALCOMM INCOR- PORATED, 5775 Morehouse Drive, San Diego, Califor- (22) International Filing Date: nia 92121-1714 (US). ZHANG, Xiaonan; QUALCOMM 25 July 2017 (25.07.2017) INCORPORATED, 5775 Morehouse Drive, San Diego, (25) Filing Language: English California 92121-1714 (US). HAU-RIEGE, Christine; QUALCOMM INCORPORATED, 5775 Morehouse Drive, (26) Publication Language: English San Diego, California 92121-1714 (US). (30) Priority Data: (74) Agent: OLDS, Mark E. et al.; Muncy, Geissler, Olds & 15/243,923 22 August 2016 (22.08.2016) US Lowe, P.C., 4000 Legato Road, Suite 310, Fairfax, Virginia 22033 (US). (71) Applicant: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration, 5775 Morehouse (81) Designated States (unless otherwise indicated, for every Drive, San Diego, California 92121-1714 (US). kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, (72) Inventors: KAKADE, Manoj; QUALCOMM INCORPO- CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, RATED, 5775 Morehouse Drive, San Diego, California DZ, EC, EE, EG, ES, FL GB, GD, GE, GH, GM, GT, HN, 92121-1714 (US). XU Hai yong; QUALCOMM INCOR- , HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, = (54) Title: LAND GRID BASED MULTI SIZE PAD PACKAGE 730 710 Air-700 740 ..v .--701 750 / 731-1 — 00 0000000000 751 0 00 n DO= 731-2 0000000000000 DODD DODD 733-1 02000000000000 753 100000 1:100000 ,,-0000000000000 I I qqqqqqqqqq g 733-2 0000000000000 I I q oop0000pocii 0000000000000 755 I I q 00000000 El 735-2 735-3 735 - 1- - 000000000000 0 0 0 0 0 OP 000000000000 0 0 0 0 0 ---737-2 737-1 00000p I 0 0 0 00000 0 0 00E10 pp 0 9 0000006 - Ooo 0 ----737-4 0000000 0000 0000000 00000737-3 0000000 00000 01:1000001:1000 0000 0000 000 000000000000 000 00 00000 757 739 759 FIG. 7 1-1 GC 7r Ot (57) : The present disclosure provides packages and methods for fabricating packages. A package (701) may comprise a wafer- = level package (WLP) layer comprising first and second WLP contacts and first and second conductive pillars disposed on the first and C second WLP contacts. Each conductive pillar comprises a surface opposite the WLP contact that forms an array pad (750-759). The ---, array pads have different sizes. The package further comprises a mold (740) over the WLP layer and at least partially surrounding 0 1-1 0 the conductive pillars, wherein the mold compound and the first array pads form a substantially planar LGA contact surface that is © configured to couple the package to a land grid array. ei O [Continued on next page] WO 2018/038848 Al MIDEDIMOMOIDEIREIHNIOMBEIEHMEHOIS KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(ii)) — as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: — with international search report (Art. 21(3)) — before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))