baber/WOPTO huggingface dataset:
Patent TW-513684-B (TW)
Title: Liquid crystal display device driving method
Inventor: JINDA AKIHITO
IPC: G09G3/20
Filed: 2001-08-02
Granted: 2002-12-11
Abstract: While image data is written into either one of first, second, third frame memories 1, 2 and 3, image data are repetitively read two times from the remaining two memories in one vertical synchronization interval and transferred to an arithmetic unit 4, and this operation is executed with the frame memories changed sequentially. An arithmetic unit 4 refers to a look-up table on the basis of two inputted data values and, when the data value of the current image signal is greater than the data value of the previous image signal, the unit 4 transfers image data of a value greater than the data value of the current image signal to a liquid crystal display device 5. Thus, the step response characteristic is improved for the improvement of the dynamic image display quality.
Patent TW-516297-B (TW)
Title: A data expansion storage device of mobile phone
Inventor: ZHU YI-MIN
IPC: H04M1/21
Filed: 2001-08-17
Granted: 2003-01-01
Abstract: A data expansion storage device of mobile phone is used to provide data access for mobile phone with an interface port. The device comprises an external connector used to connect with the interface port of the mobile phone and a data storage part coupled to the external connector for providing data access of the mobile phone.
Patent TW-499297-B (TW)
Title: Deodorizing device
Inventor: HATTORI TAKAO
IPC: F25D23/00
Filed: 2001-09-11
Granted: 2002-08-21
Abstract: The object of the present invention is to make a deodorizing device to efficiently remove an odorous component contained in a gas even in a closed space in which the gas is not circulated. This deodorizing device is constituted by providing a DC discharge mechanism 27, a photocatalyst module 28, and an ozonolysis catalyst filter 29 in a duct 26. The discharging mechanism 27 is constituted of a wire-like ignition electrode 30 and a pair of counter electrodes 31. The ignition electrode 30 is arranged by shifting the electrode 30 leftward from the lateral center line A of the counter electrodes 31. When a DC high-voltage potential is impressed upon the electrode 30, high-voltage discharge occurs between the electrodes 30 and 31 and an ion wind is generated, resulting in the generation of an air current flowing in the direction expressed by the arrow B in the duct 26. Consequently, the cold air in a refrigerator flows in the duct 26 from an inlet port 26a, is deodorized when the cold air passes through the photocatalyst module 28 and ozonolysis catalyst filter 29, and is discharged into the refrigerator from an outlet port 26b.
Patent TW-I275389-B (TW)
Title: blood
Inventor: OHSAWA TSUNEOKI
IPC: A61K31/525
Filed: 2001-10-22
Granted: 2007-03-11
Abstract: This invention relates to a composition for decreasing total cholesterols in blood, which comprises pravastatin and more than one vitamin selected from a group of riboflavins, d-alpha-tocopherols, ascorbic acids and inositol-hexa-nicotinato.
Patent TW-543023-B (TW)
Title: Display device
Inventor: YAMASAKI NOBUO
IPC: G02F1/133
Filed: 2001-11-20
Granted: 2003-07-21
Abstract: Disclosed is a technology of further reducing power consumption while a display device having an SRAM built therein is being driven based on data held in the SRAM. A power source voltage control circuit is provided in a power source voltage generation portion for supplying a power source voltage to a signal line driver and a scan line driver of the display device. During the period when the graphic data stored in the SRAM is supplied to a pixel for conducting a display, the supply of power source voltage from the power source voltage control circuit is stopped such that operations of the signal line driver and the scan line driver are stopped.
Patent TW-499352-B (TW)
Title: Method for producing 3-D dense board with decorative sheet
Inventor: KE WU-NAN
IPC: B27N3/06
Filed: 2001-12-31
Granted: 2002-08-21
Abstract: The present invention relates to a method for producing a 3-D dense board with a decorative sheet, which provides a novel processing method so that the dense board has a 3-D cosmetic effect; furthermore, the combination between the decorative sheet (skin) and the dense board is sturdier in order to achieve a better effect; the method mainly comprises: applying a edge-sewing processing and cutting the periphery of the front and back of the dense board to form a slant rough face with a broad area; cutting the adjacent edges of the four corners into a conical angle face so that the periphery of the front and back of the dense board forms a frame-like adhesion reinforcing part; furthermore, when binding the thin wood sheet, the dense board is heated so that the dense board is thermally expanded and generates a slight loosening. therefore, the binder can seep into the wood powder material of the dense board better; together with the conical angle of the rough face and the adhesion reinforcement part, a better binding can be achieved and a better binding stability between the thin wood sheet and the dense board can be resulted; moreover, the conical angle face can generate a ""shrinking"" like effect so as to reinforce the bonding of the periphery; therefore, the present invention can obtain a beautiful and study dense board bonded with a decorative sheet, thereby achieving an excellent industrial application.
Patent TW-I256059-B (TW)
Title: Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
Inventor: ITOU NOBUYUKI
IPC: C04B35/00
Filed: 2002-01-28
Granted: 2006-06-01
Abstract: A composition for forming a dielectric substance, characterized in that it comprises (A) composite particles for a dielectric substance comprising inorganic particles having a permittivity of 30 or more and an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance which covers a part or the whole of the surface of the above inorganic particles, and (B) a resin component comprising at least one of a polymerizable compound and a polymer; or in that it comprises ultramicroparticulate composite resin particles comprising (J) inorganic ultramicroparticles having an average particle diameter of 0.1 mum or less and (B) a resin component comprising at least one of a polymerizable compound and a polymer, wherein a part or the whole of the surface of the above inorganic ultramicroparticles (J) is covered by the above resin component (B) and the above inorganic ultramicroparticles (J) is contained in an amount of 20 wt% or more, and inorganic particles having an average particle diameter of 0.1 mum or less and having a permittivity of 30 or more, or inorganic composite particles comprising these inorganic particles and, adhered to a part or the whole of the surface thereof, an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance.
Patent TW-550625-B (TW)
Title: Rework method for chip on film process
Inventor: LI JEN-CHIEH
IPC: H01J9/02
Filed: 2002-03-12
Granted: 2003-09-01
Abstract: The present invention provides a rework method for chip on film process, which uses less number of steps to perform a precise alignment on a wrinkled film and then bond the film to a transparent substrate again. The method comprises: placing the re-bonded film between a transparent substrate and a lower knife head, using the lower knife head as a supporting platform for the film, and downwardly pressing the film to be flat from the transparent substrate; using an image sensor device to align the film and the transparent substrate for calibrating the position of the film; after aligning the film, using an upper knife head to downwardly pressing the transparent substrate, thereby making the film be pressed by the transparent substrate and the lower knife head so as to bond the film and the transparent substrate.
Patent TW-536758-B (TW)
Title: Semiconductor integrated circuit having a plurality of circuit regions where different power supply voltages are used and method of manufacturing the same
Inventor: MIZUMASA TATSUHIRO
IPC: H01L27/04
Filed: 2002-03-21
Granted: 2003-06-11
Abstract: A semiconductor integrated circuit has a first circuit region using a first power supply voltage and a second circuit region using a second power supply voltage different from the first power supply voltage. The first circuit region is manufactured by a first design rule in accordance with the first power supply voltage, and the second circuit region is manufactured by a second design rule in accordance with the second power supply voltage.
Patent TW-564174-B (TW)
Title: Male function assisting ring
Inventor: KOBAYASHI KATSUYOSHI
IPC: A61H23/02
Filed: 2002-04-08
Granted: 2003-12-01
Abstract: The object of the present invention is to provide a male function assisting ring that can assist or promote a male function and give a sexual feeling also to a woman. The solution of the present invention is that a cavity hole for detachably containing a small vibrator is formed in a ring body formed of soft copolymerized rubber, swelling elastomer rubber or silicone rubber and formed with an insertion hole for elastically strangling the virilia. The ring body is integrally provided with a projecting part projecting in the center axis direction of the insertion hole. The vibration of the small vibrator built in the cavity part moderately stimulates the virilia to guide it into the erect state and to maintain the erect state and furthermore can guide the virilia to ejaculation. The vibration of the small vibrator is transmitted also to the woman and can give both man and woman a sexual feeling.
Patent TW-552616-B (TW)
Title: Apparatus and method for accelerating process stability of high temperature vacuum processes after chamber cleaning
Inventor: TRAN TRUC
IPC: H01J37/32
Filed: 2002-04-08
Granted: 2003-09-11
Abstract: A structure and method which substantially reduce the number of run-in substrates that have to be used in a high temperature (550 DEG C or greater) processing environment is presented. A barrier to conductive heat transfer is provided between a process gas distribution faceplate and its process chamber support. This allows me gas distribution faceplate to thermally float and substantially reduces the temperature transients in the faceplate, which can cause thermal (temperature) transients when wafer processing is begun. The present configuration uses a thermal separation assembly to substantially block conductive heat transfer to the cold processing chamber, by using a Vespel gasket or stainless steel washers and thereby reduces the thermal gradient experienced by the gas distribution faceplate. As a result of the improved thermal uniformity, the number of run-in wafer chat need to be used is reduced by 80 to 95%.
Patent TW-567074-B (TW)
Title: Method for destruction of infectious prion proteins
Inventor: SHIH JASON C H
IPC: A61L2/16
Filed: 2002-04-09
Granted: 2003-12-21
Abstract: A method and composition for destruction of infectious prion proteins associated with transmissible spongiform encephalopathy (TSE) and/or other prion protein-mediated diseases, by thermal/enzymatic treatment of the infectious prion proteins with a prion-destructive protease. The method and composition are applicable to treatment of tissue containing or contaminated with infectious prion protein strains, or disinfection or sterilization of prion-contaminated articles, such as surgical instruments, kitchen utensils, laboratory tools, etc.
Patent TW-533180-B (TW)
Title: Method for thermally releasing adherend and apparatus for thermally releasing adherend
Inventor: IZUTANI SEIJI
IPC: C09J7/38
Filed: 2002-04-25
Granted: 2003-05-21
Abstract: The invention provides a method for thermally releasing an adherend, which comprises selectively releasing one or some of a plurality of substances adhered on a thermally releasable pressure-sensitive adhesive sheet having a thermally expandable layer containing therein thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet using a heating unit capable of partly heating the pressure-sensitive adhesive sheet. This thermally releasing method may further involve a step of cutting the substance adhered to the pressure-sensitive adhesive sheet. In this occasion, the heating unit has a heating portion of a shape in conformity with the shape of the adherend to be released, and may be provided on at lease one of the side to which the adherend is adhered and the opposite side thereto of the pressure-sensitive adhesive sheet.
Patent TW-I221968-B (TW)
Title: System having an apparatus for controlling use of a communication bus and method for controlling use of a communication bus in a system
Inventor: MOYER WILLIAM C
IPC: G06F13/32
Filed: 2002-05-28
Granted: 2004-10-11
Abstract: A bus arbiter (34) monitors characteristics associated with the type of information that is transferred via a global data bus (12) during burst transactions of information. A user-controlled arbitration policy register (56) may be programmed with values that are decoded to control whether interruption by a requesting bus master are permitted. Various factors can be used to determine interrupt permissions. Examples of such factors include the type of requesting device, whether a burst transaction is bounded or unbounded, whether a transaction is a read or a write of a system memory and the identity of the particular device requesting bus mastership.
Patent TW-591946-B (TW)
Title: Packet identification mechanism at the transmitter and receiver for an enhanced ATSC 8-VSB system
Inventor: GADDAM VASANTH R
IPC: H04N21/438
Filed: 2002-06-04
Granted: 2004-06-11
Abstract: A flexible digital transmission system that improves upon the ATSC A/53 HDTV signal transmission standard. The system includes a digital signal transmitter for generating a first advanced television systems committee (ATSC) standard encoded 8-VSB bit stream and, for generating an encoded new robust bit stream for transmitting high priority information bits, wherein symbols of the new bit stream are capable of being transmitted according to a transmission mode including: a 2-VSB mode and a 4-VSB transmission mode. The standard 8-VSB bit stream and new bit stream may be simultaneously transmitted over a terrestrial channel according to a broadcaster defined bit-rate ratio. The transmission system includes a control mechanism for generating information needed for encoding robust packets at a transmitter device. It also includes a mechanism for encoding control parameters and multiplexes the generated information with the standard and robust bit-streams for transmission. A receiver architecture is additionally provided to decode standard and robust bit-streams transmitted by the transmitter device.
Patent TW-546831-B (TW)
Title: Nonvolatile semiconductor memory device
Inventor: NAKATANI YASUO
IPC: H01L27/115
Filed: 2002-06-17
Granted: 2003-08-11
Abstract: Disclosed is a nonvolatile semiconductor memory device in which a disturbance phenomenon can be prevented. A nonvolatile semiconductor memory device has a semiconductor substrate, and a floating gate electrode formed on the semiconductor substrate via a gate insulating film. The floating gate electrode includes a lower conductive layer formed on the gate insulating film and having a first width W1 in a channel width direction, and an upper conductive layer formed on the lower conductive layer and having a second width W2 wider than the first width W1 in the channel width direction.
Patent TW-554357-B (TW)
Title: The materials of micro-pores structure and the micro-pores-monolithic structure high frequency capacitors and its process
Inventor: HSU CHABY
IPC: H01G4/30
Filed: 2002-06-26
Granted: 2003-09-21
Abstract: This invention is about a material with micro-pores structure, it's used to manufacture the micro-pores monolithic structure with high frequency capacitors. The main theory is of microchemistry-liquidated transformation, meaning that liquid phase transformation pretexts the non-even-disperse slurry gel to form the sub-micro-meter ceramic powder in macro-cell structure. When a mixture of macro-cell structure powder with aqueous solution binder, this material will turn as micro-pores structures. When this power is used in manufacturing capacitors, by utilize the dielectric ceramic micro-pores monolithic structure (air mediums) will enhance the frequency characteristic of the capacitors.
Patent TW-565477-B (TW)
Title: Method and apparatus for forming wave shape surface
Inventor: YOSHIDA KATSUTOSHI
IPC: B21D15/00
Filed: 2002-07-03
Granted: 2003-12-11
Abstract: A plurality of independent circular ring connected into a wave shape, or a spiral shape groove is formed on a round tube. The wave shape surface is formed by the method including the steps of: feeding a round tube 1 to be worked in an axial direction, pressing wave shape forming gears 73A, 73B... or a wave shape forming die 9 in an axial direction against the round tube 1, the gears being disposed on at least one place, preferable a plurality of the places in equal distance along the circuference on the outer surface of the round tube 1, and apart from each other an appropriate distance L in an axial direction, the distance L including zero, each gear being capable of rotating about its own axis and having teeth of same pitch with the teeth of another gear, driving the gears 73A, 73B... to rotate about the axis of the round table 1 in the case that the gears73A, 73B... are provided, and holding a working protrusion 91 at a predetermined angle theta in the case that the wave shape forming die 9 is provided. The device is adapted to perform these steps.
Patent TW-534827-B (TW)
Title: Manufacturing method for the club head shell of composite material
Inventor: CHEN CHING-CHI
IPC: A63B53/04
Filed: 2002-08-05
Granted: 2003-06-01
Abstract: This invention relates to a manufacturing method for the club head shell, comprising the steps of: driving two base molds closing, each mold having an concave facing each other, each of the concave having a concave mold portion therein, and the concave of at least one mold having a channel extending from a surface to the concave mold portion so that the two molds join together to form a hole extending inwards from the surface; placing an appropriate amount of dough material into the hole and driving a compressing mold into the hole through the channel to a pre-determined depth. The compressing mold includes a convex mold portion at the front end and a plunger portion at the rear side, which the plunger portion can fill and seal the channel and a mold cavity is formed between the convex mold portion and the concave mold portion of the two molds, so that the dough material is compressed and filled in the mold cavity. After the dough material is cured, the two molds and the pressing mold are separated from each other to obtain a shell having a shape corresponding to the cavity.
Patent TW-I245792-B (TW)
Title: Polyurethane resin water dispersion and aqueous polyurethane adhesive
Inventor: SHIMIZU HYOUE
IPC: C08G18/00
Filed: 2002-08-16
Granted: 2005-12-21
Abstract: Polyurethane resin water dispersion being good in storage stability and excellent in initial adhesion and resistance to moist heat, and aqueous polyurethane adhesive employing the polyurethane resin water dispersion. The polyurethane resin water dispersion is produced in the manner that polyisocyanate is allowed to react with polycaprolactone polyol comprising polycaprolactone polyol having a number average molecular weight of 3500-4500 and polycaprolactone polyol having a number average molecular weight of not more than 2500, and active-hydrogen-group-containing compound having anionic group, to synthesize isocyanate terminated prepolymer, first, and, then, the isocyanate terminated prepolymer thus produced is allowed to react with polyamine in water. The use of the polyurethane resin water dispersion can produce the aqueous polyurethane adhesive having improved storage stability, initial adhesion and resistance to moist heat.
Patent TW-571200-B (TW)
Title: Computer audio CD playing method loaded with no operating system
Inventor: LIN JACKY
IPC: G06F9/445
Filed: 2002-08-26
Granted: 2004-01-11
Abstract: A computer audio CD playing method loaded with no operating system (OS) first goes through BIOS component to determine if system bootup is activated by audio playing bootup key or normal computer bootup key. When the bootup is activated by the audio playing bootup button, initialize part of components of main board and partial peripherals, in which main board comprises audio effect chip but peripheral components only include CD player and keyboard. Consumer is allowed to set up the keys of keyboard, use preset key to operate CD player for CD data access and play audios by external speaker connecting to audio effect chip. As such, consumer requires no purchase of particular keyboard and only uses regular keyboard for related setup and operation.
Patent TW-559948-B (TW)
Title: Semiconductor device
Inventor: SHIMIZU IPPEI
IPC: H01L21/311
Filed: 2002-09-02
Granted: 2003-11-01
Abstract: A semiconductor device is provided which is capable of reducing the number of masking processes in forming contact holes. The semiconductor device comprises a semiconductor substrate (1), a gate structure (9), a stopper film (11), an interlayer insulation film (12), a contact hole (17) extending from the upper surface (13) of the interlayer insulation film (12) to the semiconductor substrate (1), a metal material (18) buried in the contact hole (17), a first metal wiring layer (19), an interlayer insulation film (20), a contact hole (23) extending from the upper surface (21) of the interlayer insulation film (20) to the first metal wiring layer (19), and a contact hole (24) extending from the upper surface (21) of the interlayer insulation film (20) to a gate electrode (7) of the gate structure (9). The contact hole (24) is formed at the same time as the contact hole (23).
Patent TW-I282158-B (TW)
Title: Semiconductor package with ground-enhancing chip and fabrication method thereof
Inventor: WANG JIN-FA
IPC: H01L21/60
Filed: 2002-10-11
Granted: 2007-06-01
Abstract: A semiconductor package with a ground-enhancing chip and a fabrication method of the semiconductor package are provided, in which a ground pad formed on a chip can be electrically connected to a ground plane formed on a substrate by means of a conductive wall applied on a side surface of the chip and a conductive adhesive for attaching the chip to the substrate. As a result, a subsequent wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires bonded to the ground pads for electrical connection purposes. This benefit allows a reduced number of bonding wires to be utilized in the wire-bonding process and helps simplify wire arrangement or routability to thereby reduce costs and complexity of fabrication processes. Moreover, a grounding path from the chip through the conductive wall and conductive adhesive to the substrate is shorter than the conventional one of using ground wires; this can reduce ground-bouncing effect and improve electrical performances and reliability of the semiconductor package.