baber/WOPTO huggingface dataset:
Patent TW-201222108-A (TW)
Title: Substrate bonding apparatus and susbtrate bonding method
Inventor: HWANG JAE-SEOK
IPC: G02F1/1339
Filed: 2011-07-26
Abstract: A substrate bonding apparatus includes: a chamber; an upper surface plate which is arranged inside the chamber and includes an adhesive member for adhering an upper substrate thereto and a diaphragm expanded for separating the upper substrate from the adhesive member; a lower surface plate which is arranged inside the chamber, opposite to the upper surface plate, and supports a low substrate to be bonded to the upper substrate; a lifting driver which drives the lower surface plate to move up and down; and a controller which controls the lifting driver to move toward the upper surface plate for bonding the upper substrate and the lower substrate and controls the lifting driver when the diaphragm expands such that moving-down speed of the lower surface plate can be stepwise changed. Thus, when the substrate adhered to an adhesive chuck is separated from the adhesive chuck, speed of separating the upper substrate adhered to the adhesive chuck is controlled to stably maintain a bonding position of the upper substrate, thereby enhancing substrate bonding efficiency.
Patent TW-201214436-A (TW)
Title: Generating a non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction
Inventor: RAO HARI M
IPC: G11C11/15
Filed: 2011-08-03
Abstract: A method of generating a non-reversible state at a bitcell having a first magnetic tunnel junction (MTJ) and a second MTJ includes applying a program voltage to the first MTJ of the bitcell without applying the program voltage to the second MTJ of the bitcell. A memory device includes a bitcell having a first MTJ and a second MTJ and programming circuitry configured to generate a non-reversible state at the bitcell by applying a program signal to a selected one of the first MTJ and the second MTJ of the bitcell.
Patent TW-201307120-A (TW)
Title: Device and method to detect the Engine flame-out of auxiliary operation equipment for engine
Inventor: LIN JUN-ZHI
IPC: B60W10/06
Filed: 2011-08-05
Abstract: This invention relates to a device and method to detect the Engine flame-out of auxiliary operation equipment for engine. The auxiliary operation equipment for engine comprises engine carbon deposit cleaning equipment and engine efficiency assisting equipment which are equipments need to be linked to the engine operation. The engine carbon deposit cleaning equipment is to input hydrogen into the interior of the engine to enhance the combustion effect of the engine by hydrogen, so as to achieve the efficacy of cleaning the carbon deposit inside engine. The engine efficiency assisting equipment utilizes suitable amount of introduced hydrogen to enhance the combustion efficiency of the internal combustion engine. This invention specially has an electric potential detection control device to determine whether the engine is under the normal operation status or the flame-off status when performing the auxiliary operation of engine by real-time monitoring of the voltage change of the battery. If the engine is flame-off accidentally, the auxiliary operation is automatically commanded to stop immediately to maintain safety. This invention provides a detection device and method capable of reliably and quickly judging the flame-off status of engine to ensure that the engine operation equipment can be operated safely and properly, thereby satisfying the requirement of the engine using various auxiliary operation equipments.
Patent TW-201307490-A (TW)
Title: Fingerprint-displaying spray and method utilizing spray to display fingerprint
Inventor: Wu shi-yu
IPC: A61B5/1172
Filed: 2011-08-05
Abstract: The present invention is to provide a fingerprint-displaying spray, which comprises based on the total weight of (A), (B), and (C): (A) 1~10 weight parts of an amino acid reacting agent; (B) 5~30 weight parts of a dispersing agent; and (C) 50~150 weight parts of a propellant. By means of comprising the dispersing agent and the propellant, the present invention can be made to have convenience and excellent fingerprint displaying effect, reduce the use of toxic chemical substances which contaminate the environment, and achieve the purposes of low costs and sample contamination prevention, being applicable to the technological field of latent fingerprint detection.
Patent TW-201309019-A (TW)
Title: Display apparatus and the universal setting method thereof
Inventor: Lv shao-qing
IPC: H04N7/01
Filed: 2011-08-11
Abstract: A display apparatus and the universal setting method thereof are suitable for co-operating a display system and a portable memory module. The display system comprises a display, a controller, a memory and a transmitter; the controller is electrically connected to each device for displaying an OSD menu on display when receiving trigger of a manipulation command. The OSD menu has multiple setting options for being executed by inputting different manipulation command; the memory is electrically connected to the controller for recording related parameters of the setting options in a universal profile matched universal format; the transmitter is electrically connected to the controller for transmitting the universal profile matched universal format to the portable memory module.
Patent TW-201221743-A (TW)
Title: Guide fitting
Inventor: MONTECCHIO ANDREAS
IPC: E05D15/06
Filed: 2011-08-18
Abstract: The invention relates to a guide fitting of a sliding door furniture piece (1) comprising at least one sliding door (2, 3) that can be guided along a profiled guide (7) and a running rail (6), said guide fitting having a fitting housing (101, 201, 301) which is arranged on the sliding door (2, 3) and on which a guide bolt (51), which can be guided in the profiled guide (7), and a driver (52), which is coupled to a damping unit (54) and/or a self-retracting unit, are arranged, wherein at least the guide bolt (51) and the driver (52) can be reversibly moved from an installation position in which the sliding door (2, 3) can be pivoted unhindered under the profiled guide (7), into an operating position in which the guide bolt (51) and the driver (52) project into the profiled guide (7), and can be latched in the operating position.
Patent TW-201312222-A (TW)
Title: Display panel module and heat dissipation assembly for display panel module
Inventor: TSAI HUNG-YUAN
IPC: G02F1/13357
Filed: 2011-09-07
Abstract: A heat dissipation assembly for a display panel module includes a main bracket, at least one heat conduction block and at least one high-performance heat conduction device. The heat conduction block is mounted on the main bracket, and one side of the heat conduction block is adapted to touch a back plate of a backlight module. On end of the high-performance heat conduction device is connected with the heat conduction block, and another end of the high-performance heat conduction device extends away from the heat conduction block and spreads on different regions of the main bracket.
Patent TW-201218317-A (TW)
Title: Method of multi-chip stacking for decreasing void between chips
Inventor: LEE KUO-YUAN
IPC: H01L21/56
Filed: 2011-09-21
Abstract: Disclosed is a method of multi-chip stacking for decreasing void between chips. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip, and a FOW (film over wire) adhesive are attached onto a back surface of the second chip. The FOW adhesive encapsulates some portions of the first bonding wires and attaches to the active surface of the first chip. Then, the substrate is placed in a pressure chamber in which a positive pressure higher than one atmospheric pressure is provided during the FOW adhesive is cured by pressure and heat. A plurality of second bonding wires are formed by wire bonding to electrically connect the second chip and the substrate. Accordingly, there can be decreased void between chips during the multi-chip stacked process to avoid the problems of weak adhesion and popcorn.
Patent TW-201215976-A (TW)
Title: Liquid crystal display device
Inventor: SONG IN-HYUK
IPC: G02F1/1343
Filed: 2011-10-07
Abstract: A liquid crystal display device is disclosed, which comprises first and second substrates; gate and data lines arranged to cross each other on the first substrate to define a pixel region; a pixel electrode formed in the pixel region; a common electrode forming an electric field together with the pixel electrode and sensing a touch of a user; a light shielding layer formed on the second substrate to shield light leakage to a region other than the pixel region; column spacers formed on the light shielding layer to maintain a cell gap; and a sensing line formed on the column spacers and electrically connected with the common electrode. Since the common electrode used to form an electric field for driving a liquid crystal is used as a sensing electrode for sensing a touch of a user, a separate touch screen on the liquid crystal panel is not required unlike the related art, whereby the overall thickness of the liquid crystal display device is reduced, fabricating process steps are simplified, and the fabricating cost is reduced.
Patent TW-201316915-A (TW)
Title: A methods of improving the functions of footwear sole
Inventor: HUANG YING-CHUN
IPC: A43B21/47
Filed: 2011-10-22
Abstract: A methods of improving the functions of footwear sole, including a ground-engaging part with substantially round shape. The stud and receptacle are adapted to be secured together by a threaded connection comprising a screw-threaded spigot on one of the components adapted to be inserted with rotation into a screw-threaded socket on the other component. A tightening up means of the components is arranged to become inter engaged at least when the spigot is fully inserted into the socket to resist unscrewing of the components. The tightening up means comprises at least one tightening up assembly by counter-clock rotation, the arrangement is deployed around the outside of rear portion of sole such that the replaceable studs create a stable function for the sole. Said assembly further composited with a hollow shape midsole, an excellent energy returned achieved by a compression created from the deformation between said studs and midsole. The torque which created from the inertial force for tightening up the studs will improving the mechanism of operating the tightening up as well as loosing the studs from the receptacle.
Patent TW-201234550-A (TW)
Title: Chip package
Inventor: CHIU HSIN-CHIH
IPC: H01L23/488
Filed: 2011-10-25
Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a passivation layer formed overlying the second surface of the substrate, the passivation layer having an opening; a light shielding layer formed overlying the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening; a conducting bump disposed overlying the second surface of the substrate and filled into the opening of the passivation layer; and a conducting layer formed between the substrate and the passivation layer, wherein the conducting layer electrically connects the optoelectronic device and the conducting bump.
Patent TW-201317355-A (TW)
Title: The method for improving efficiency of mono-sugar fermentation
Inventor: LIN TING-HSIANG
IPC: C12P7/10
Filed: 2011-10-27
Abstract: This innovation is related to a method for improving efficiency of mono-sugar fermentation. This method is conducted by adding lignocellulosic material into bioreactor for cultivation. After cultivation, the inoculum is poured into bioreactor filled with liquid prepared for fermentation. After fermentation, product can be purified by applying separation and purification. By using method which is related to adding well-processed lignocellulosic material into bioreactor for cultivation, the efficiency of fermentation can be improved effectively.
Patent TW-201320855-A (TW)
Title: Supporting device
Inventor: HUANG RI-DONG
IPC: H05K5/02
Filed: 2011-11-09
Abstract: A supporting device is provided for supporting an electronic device. The supporting device includes a base, a supporting member, an inserting member, a latching member, and an operating member. A bottom of the supporting member is fixed on the base, and a top of the supporting member is detachably assembled on the electronic device. The inserting member is slidably attached to the supporting member, along a first direction. The latching member and the operating member are slidably attached to the inserting member, along a second direction perpendicular to the first direction. A first protrusion and a second protrusion protrude on a sidewall of the inserting member, and a slope is formed on each protrusion. Two engaging blocks extend from the latching member and the operating member respectively, and a slope is formed on each engaging block. An inserting hole is defined in the electronic device. An inserting post extends up from the inserting member, to engage into the inserting hole. The latching member is slid for allowing the slope of the latching member to abut against the slope of the first protrusion of the inserting member, and the inserting post is disengaged from the inserting hole and the first protrusion is latched to the engaging block of the inserting member.
Patent TW-201230262-A (TW)
Title: Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
Inventor: LIN CHARLES W C
IPC: H01L23/34
Filed: 2011-11-16
Abstract: A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device.
Patent TW-201230643-A (TW)
Title: Switch converter circuit and power converting method
Inventor: LI XIAO-MING
IPC: H02M3/157
Filed: 2011-11-25
Abstract: The embodiments of the present invention disclose an internal slope compensation for digital COT Converter and a control method thereof. The converter comprises an input terminal, an output terminal, a feedback circuit feeding back the output voltage and configured to provide a feedback signal, a signal generator having a digital controller, a comparison circuit configured to provide a comparison signal by comparing the feedback signal with a reference signal, an on-time control circuit configured to provide an on-time signal, a driving circuit configured to generate a driving signal and a switching circuit controlled by driving signal.
Patent TW-201321951-A (TW)
Title: Power distribution method and server system using the same
Inventor: WANG HUANG-CHING
IPC: G06F1/26
Filed: 2011-11-30
Abstract: A power distribution method is provided that is suitable for a server system. Firstly in the method, respectively supplying an average power to activated motherboards; and respectively reading an expected power of each of activated motherboards, and comparing the expected power and the average power wherein if the expected power is greater than the average power then to define as a first state, and if the expected power is less than the average power then to define as a second state; and then calculating the expected power of the motherboard defined as the second state and the average power, and to obtain a first remaining power; and then distributing the first remaining power averagely to the motherboards which are defined as the first state. This method can allocate the power dynamically according to the needs of each of the motherboards, and it can provide sufficient power of operating to the motherboards.
Patent TW-201304682-A (TW)
Title: Synergistic fungicidal interactions of aminopyrimidines and other fungicides
Inventor: LOSBACH BETH
IPC: A01N55/02
Filed: 2011-12-15
Abstract: A fungicidal composition containing a fungicidally effective amount of (a) a compound of Formula I and (b) at least one fungicide selected from the group consisting of myclobutanil, fenbuconazole, difenoconazole, trifloxystrobin, penthiopyrad, fluopyram, boscalid, mancozeb, pyrimethanil, and bixafen provides synergistic control of selected fungi.
Patent TW-201329421-A (TW)
Title: Map capable of directing direction
Inventor: Hong xin-fu
IPC: G01C21/30
Filed: 2012-01-13
Abstract: A map capable of directing directions includes a shell and a magnetic part. The shell includes a cover and a base. A lens is disposed at the top of the cover. Direction marks and patterns (e.g., maps and attraction spots) are printed on an inner wall of the base. A magnetic pointer having a map appearance or printed map pattern is disposed at the magnetic part, and the magnetic pointer is printed with a map. A top nail is disposed on a through hole at the center of the magnetic pointer. The lower edge of the top nail is pivotally coupled to a pivoting base of the base. The upper edge of the top nail is pivotally coupled at a ball. The ball is fixed on an inner wall of the lens. When in use, the magnetic pointer can point north based on the earth magnetic field, such that the map on the magnetic pointer can show the relative position of different directions on the direction marks.
Patent TW-201309664-A (TW)
Title: Bicyclic compound and use thereof for medical purposes
Inventor: KAMBE TOHRU
IPC: A61P27/06
Filed: 2012-01-30
Abstract: The purpose of the present invention is to provide a compound having a potent and sustained activity of decreasing an intraocular pressure and having no adverse side effect on eyes. A compound represented by general formula (I) (wherein the definition of each group is as in the description), a salt of the compound, a solvate of the compound or the salt, or a prodrug of the compound, the salt or the solvate, which has a potent and sustained activity of decreasing an intraocular pressure and has no adverse side effect on eyes, such as the irritation to eyes (e.g., ocular hyperaemia, corneal opacity) and the increase in aqueous humor proteins, and therefore can be used as a highly safe and excellent prophylactic and/or therapeutic agent for glaucoma or the like.
Patent TW-201242005-A (TW)
Title: Surface light-emitting object
Inventor: NAGASE JUNICHI
IPC: H01L51/50
Filed: 2012-02-08
Abstract: Provided is a surface light-emitting object which can be mass-produced at low cost and is reduced in luminance unevenness. This surface light-emitting object comprises a base, a plurality of ribbon-shaped organic electroluminescent elements disposed side by side on the base, and a lenticular sheet which has been applied to the base and the ribbon-shaped organic electroluminescent elements through an adhesion layer and which has a plurality of convex cylindrical lenses disposed side by side, wherein the direction in which the convex cylindrical lenses extend is substantially parallel to the direction in which the ribbon-shaped organic electroluminescent elements extend.
Patent TW-201338039-A (TW)
Title: Patterned structure of semiconductor device and fabricating method thereof
Inventor: WANG CHIH-JUNG
IPC: H01L21/311
Filed: 2012-03-09
Abstract: A method for fabricating a patterned structure in a semiconductor device is provided. First, a substrate with a first region and a second region is provided. Next, a plurality of sacrificial patterns is respectively formed within the first region and the second region. A first spacer is then formed on the sidewall of each of the sacrificial patterns followed by forming a mask layer to cover the sacrificial patterns located within the first region. Finally, the first spacer exposed from the mask layer is trimmed to be a second spacer and the mask layer is then removed.
Patent TW-201334047-A (TW)
Title: Die ejecting method, die ejecting unit, die pick-up method, and die pick-up apparatus
Inventor: HEO KWANG-CHUL
IPC: H01L21/304
Filed: 2012-03-22
Abstract: Provided are a die ejecting method, a die ejecting unit, a die pick-up method, and a die pick-up apparatus. In the die ejecting method, a dicing tape to which a wafer divided into at least one die having an edge area and a central area is attached may be vacuum-absorbed downward on the whole, and a first area of the dicing tape corresponding to the edge area may be relatively elevated with respect to the other area. Then, air is blown onto a second area of the dicing tape corresponding to the central area using an air flow to separate the die from the dicing tape.
Patent TW-201342709-A (TW)
Title: Communication device
Inventor: WONG KIN-LU
IPC: H01Q5/10
Filed: 2012-04-02
Abstract: A communication device with an upper cover and a lower cover including a conductive housing and an antenna element is provided. The conductive housing includes a first conductive surface and a second conductive surface. The first conductive surface is disposed on a surface of the upper cover. The second conductive surface is disposed on a surface of the lower cover. The first conductive surface and the second conductive surface are electrically coupled to each other, and a first edge of the first conductive surface is adjacent to a second edge of the second conductive surface. The antenna element is substantially located between the the first edge and the second edge, and is excited to form a first band and a second band. The antenna element includes a ground element, a first radiating element, and a second radiating element. The ground element is electrically coupled to the second conductive surface. One end of the second radiating element is a starting terminal, which is electrically coupled to a signal source and the first radiating element. The other end of the second radiating element is a grounding terminal, which is electrically coupled to the ground element.
Patent TW-201341639-A (TW)
Title: Chip key lock head cover and lock set
Inventor: LU JI-FENG
IPC: E05B65/00
Filed: 2012-04-03
Abstract: The present invention provides a chip key lock head cover and a lock set. The chip key lock head cover comprises an outer cover, a connection member, and a coil. The outer cover comprises a plurality of tenons formed on an inside surface thereof to retain the outer cover on the connection member. The connection member comprises a receiving slot. The coil is formed by winding a metal wire. The coil is received in the receiving slot of the connection member. Two ends of the metal wire respectively penetrates through the connection member to connect to a lock head. The chip key lock head cover is sleeved onto a lock head and fixed with a screw. The means of fixation includes a disposable type and a replaceable type. The replaceable type is to thread the screw through the connection member for fixation on the lock head, while the disposable type is to thread the screw through the outer cover and the connection member for fixation on the lock head.