baber/WOPTO huggingface dataset:
Patent TW-370613-B (TW)
Title: Vibration type level detector
Inventor: KAWAKATSU HIROSHI
IPC: G01F23/296
Filed: 1999-02-05
Granted: 1999-09-21
Abstract: A vibration type level detector, which the base of the detecting pipe is fixed, and one end of the vibration sheet is fixed at close part and the other end is installed a permanent magnet. An electric magnet is tightly connected into the detecting pipe in a direction relative to the axial direction of the permanent magnet to form a reflective single side supporting girder. The detector detects the vibration with the inclined detecting element and amplifies the output by the amplifying circuit to drive the electric magnet and makes the detecting pipe, the close part and the vibration sheet vibrate reciprocally.
Patent TW-417113-B (TW)
Title: Detection of nuclear fuel rod failure
Inventor: MCCLELLAND RICHARD G
IPC: G01N29/04
Filed: 1999-02-08
Granted: 2001-01-01
Abstract: Method and apparatus for ultrasonic inspection of a nuclear fuel rod having an inner core of nuclear fuel surrounded by a cladding tube having a wall thickness into which is transmitted ultrasonic guided waves which leak into the interior of the fuel rod and from which is detected a reflected ultrasonic wave which is indicative of a failed fuel rod.
Patent TW-445247-B (TW)
Title: Apparatus for manufacturing cement
Inventor: YAMAMOTO YASUSHI
IPC: C04B7/36
Filed: 1999-02-24
Granted: 2001-07-11
Abstract: The invention provides an apparatus for manufacturing cement capable of converting the harmful substances in the waste to be harmless and using the waste as a cement manufacturing material, comprising a pretreating means A for removing the ferrous piece and the water in the waste prior to drying treatment, a pulverizing means B for grinding the waste and the composition adjuster, a blended means C for mixing the blending waste and the composition adjuster, a roasting and cooling means D for burning the blended material to become a cement clinker, a grinding means E for mixing and crushing the clinker and the gypsum, and simutansously adding the binder to produce cement, an exhaust treating means F for chilling the exhaust gas from the roasting and cooling means so as to restraint the recomposition of dioxins and to convert the exhaust gas to be harmless, and a dioxins decomposing means G for heating and decomposing the deoxins in the dust generated in the roasting and cooling means D.
Patent TW-407452-B (TW)
Title: Method for manufacturing three dimensional circuit board
Inventor: HUANG CHIOU-YUNG
IPC: H05K3/36
Filed: 1999-02-25
Granted: 2000-10-01
Abstract: This invention provides a method for manufacturing three dimensional circuit board, which comprises pre-forming an conductor for the required circuit; then, disposing the conductor inside the mold for forming the shell body, so that when the shell body is formed by injecting, the whole conductor body could be fixed inside the bottom face of the shell body; then, filling an insulator onto the peripheral of the conductor on the bottom face of the shell body; and adhering conductive material on the top face of the conductor, so as to form the conductive circuit on the top face of the conductor. Therefore, the electric component is able to connect directly to the conductive circuit on the bottom facet of the shell body to avoid the inconvenience and disturbance of the present skill which requires additional circuit board to be assembled, thereby saving the space inside the shell body effectively.
Patent TW-452856-B (TW)
Title: Microstructure producing method capable of controlling growth position of minute particle or thin line and semiconductor device employing the microstructure
Inventor: UEDA TOHRU
IPC: H01L29/792
Filed: 1999-03-30
Granted: 2001-09-01
Abstract: There is provided a microstructure producing method capable of achieving satisfactory uniformity and reproducibility of the growth position, size and density of a minute particle or thin line and materializing a semiconductor device which can reduce the cost through simple processes without using any special microfabrication technique and has superior characteristics appropriate for mass-production with high yield and high productivity as well as a semiconductor device employing the microstructure. An oxide film 12 having a region 12a of a great film thickness and a region 12b of a small film thickness are formed on the surface of a semiconductor substrate 11. Next, a microstructure that is a thin line 15 made of silicon Si is selectively formed only on the surface of the small-film-thickness region 12b of the oxide film 12.
Patent TW-405179-B (TW)
Title: Metal etch process
Inventor: GUO WEN-BIN
IPC: H01L21/306
Filed: 1999-05-07
Granted: 2000-09-11
Abstract: A kind of metal etch process comprises the following steps, (1) Provide a substrate with adhesion barrier layer, metal layer and anti-reflective layer. (2) Proceed three stages etch steps: (a) break through firstly, (b) adhesion barrier layer patterning and (c) the main etch step to etch the metal layer with the etch gas including Cl2, BCl3 and CHF3. Where the CHF3 enhances the polymer generation in etch process so that the outlook of the metal layer is in about inclination shape. (4) Proceed the over etching step to ensure the insulation between neighboring wires.
Patent TW-417259-B (TW)
Title: Substrate for mounting semiconductor chip
Inventor: MURAYAMA KEI
IPC: H01L21/60
Filed: 1999-06-15
Granted: 2001-01-01
Abstract: A substrate is used for mounting a semiconductor chip which is to be bonded to a surface of the substrate via a resin adhesive, such as an anisotropic conductive film. The substrate comprises: a substrate body having a semiconductor chip mounting surface and a plurality of conductive lines arranged on the surface so as to extend in a lengthwise direction and spaced substantially in parallel to one another by a predetermined pitch. Each of the conductive lines defines, by a part thereof, a pad portion, a width of which is larger than that of the conductive line, to which respective electrode of the semiconductor chip is to be electrically connected. The pad portion has one and the other ends thereof with respect to a lengthwise direction thereof. The plurality of pad portions are arranged in such a manner that one end of one pad portion and the other end of an adjacent pad portion are arranged in the vicinity of each other in a widthwise direction.
Patent TW-446690-B (TW)
Title: Refractories for casting a rare-earth alloy, their production method, and method for casting an rare-earth alloy
Inventor: HASEGAWA HIROSHI
IPC: C04B35/48
Filed: 1999-06-21
Granted: 2001-07-21
Abstract: In the case of casting a rare-earth alloy into a sheet using a tundish, a preliminary heating to improve the flow of motten metal is made unnecessary by using refractories which: essentially consist of 70 wt% or more of Al2O3 and 30 wt% or less of SiO2; or essentially consist of 70 wt% or more of ZrO2 and 30 wt% or less of one or more of Y2O3, Ce2O3, CaO, MgO, Al2O3, TiO2 or SiO2. The refractories have l g/cm<SP>3</SP> or less of bulk density, 0.5 Kcal (mh DEG C) or less of heat conductivity in a temperature range of from 1200 to 1400 DEG C and 0.5 wt% or less of ignition weight loss under the heating condition of 1400 DEG C, 1 hour.
Patent TW-402669-B (TW)
Title: Positioner and its setting method
Inventor: IROKAWA KENJI
IPC: G05D16/20
Filed: 1999-07-12
Granted: 2000-08-21
Abstract: A minimum input signal (amin) is inputted from an input unit (52) of a positioner (10) and a minimum command (bmin) corresponding to the minimum input signal (amin) is inputted from a key entry unit (18). Subsequently, a maximum input signal (amax) is inputted and a maximum command (bmax) corresponding to the maximum input signal (amax) is inputted. In a command operation unit (54), a command (bn) is computed. An input signal (an) is inputted from the input unit (52) and the command (bn) is altered by the key entry unit (18) and stored in a memory unit (56).
Patent TW-499593-B (TW)
Title: Integrated resistor for measuring touch position in a liquid crystal display device
Inventor: COLGAN EVAN GEORGE
IPC: G02F1/1333
Filed: 1999-07-28
Granted: 2002-08-21
Abstract: The present invention provides for a liquid crystal display device with a signal layer integrated onto a substrate. Circuitry derives touch position based upon response to signals applied to the signal layer. At least one resistor is integrated onto the substrate. The resistor is coupled between the signal layer and the circuitry. The resistor is formed in conjunction with the signal layer. Preferably, the resistor is part of a resistor network for linearizing resistance of the signal layer in a vertical direction and horizontal direction.
Patent TW-424246-B (TW)
Title: Fluid pressure driving apparatus of breaker
Inventor: YAMAZAKI MASARU
IPC: F15B20/00
Filed: 1999-08-10
Granted: 2001-03-01
Abstract: This invention is about the fluid pressure driving apparatus of breaker that can prevent the repeated pumping operation of contact-device switch so as to obtain small, cheap mechanism with excellent controllability of anti-pumping. The solutions include the followings: the piston 5, which is used for the switching contact device 1, 2; and the control valve mechanism, which is used to make the piston 5 operate. The control valve mechanism has the switching valve 13 and the switching control valve. The switching valve 13 can be connected with the cylinde operation room 7 of the piston 5 used for the contact device switch to perform pressure switching. The switching control valve serves as a fluid pressure driving device of a breaker having a switching control valve for closing 39 and a switching control valve for opening 37, an anti-pumping piston 42 performing an operation to close a check valve 41 is provided in it, and a halfway spot of a duct line connecting to a fluid return side from a spot between the secondary side of the switching control valve for closing 39 and the primary side of the check valve 41 is connected to an anti-pumping piston operating compartment 44.
Patent TW-479034-B (TW)
Title: Apparatus and method for transporting cargo with a two-wheeled vehicle
Inventor: EVANS ROSS N
IPC: B62J7/04
Filed: 1999-08-11
Granted: 2002-03-11
Abstract: A cargo transport system (10) which increases the cargo-carrying capacity of standard two-wheeled vehicles, such as a bicycle (12). The system (10) includes a cargo support device (40) having a base extension frame (42) that is mounted to a bottom bracket (18) or detachably mounted at three connection points to the bottom bracket (18) or chainstays (20) and rear wheel dropouts (26) of the two-wheeled vehicle. The rear wheel assembly (22) is transferred from its original dropouts to new dropouts located on the base extension frame (42). The original chain (30), rear brakes (32) and gear accessories are extended to accommodate the displacement of the rear wheel assembly (22). The device (40) further includes a support frame (70) with or without fold-down racks and at least one bag, vessel, container, lockable bin, or box-type attachment, or a long-load carrier, or a child seat, or a heavy-duty box-type compartment, which are attached to the base extension frame (42).
Patent TW-424032-B (TW)
Title: Differential temperature control in a chemical mechanical polishing process for the manufacture of semiconductor integrated circuits and an apparatus used therein
Inventor: EASTER WILLIAM GRAHAM
IPC: B24B37/30
Filed: 1999-08-11
Granted: 2001-03-01
Abstract: The specification describes a method and apparatus for chemical-mechanical polishing (CMP) to produce planar layered semiconductor structures. Non-uniformities in polishing behavior due to radial temperature variations across the semiconductor wafer are compensated by locally controlling the temperature of the wafer. Heating/cooling is implemented by installing temperature controlling coils in the head of the wafer carrier.
Patent TW-419751-B (TW)
Title: Metallization process for manufacturing semiconductor devices and system used in the same
Inventor: CHOI BAIK-SOON
IPC: H01L21/302
Filed: 1999-08-20
Granted: 2001-01-21
Abstract: There are provided a metallization process for manufacturing semiconductor devices, and a system used in the same for allowing to minimize corrosion failures generated in aluminum patterns. The process for the metal pattern formation is carried out by loading a semiconductor wafer to an etching chamber, the semiconductor wafer having a certain photoresist pattern formed over a metal material layer, stabilizing the environment inside the etching chamber, supplying an etching gas containing chlorine (Cl2) into the etching chamber so as to main-etch the metal material layer to the etch end point by using the photoresist pattern as an etch mask, over-etching the metal material layer for a certain time over the etch end point so as to form metal patterns, purging the etching chamber after the over-etching chamber after the over-etching step, and unloading the wafer with the etching process completed out of the etching chamber. The pressure in the transfer module is optimized, and the lock chamber is continuously purged.
Patent TW-429403-B (TW)
Title: Method for improving the optical quality of a 45 DEG micro-mirror device
Inventor: CHANG HUNG-LU
IPC: H01S5/022
Filed: 1999-10-07
Granted: 2001-04-11
Abstract: This invention discloses a method for improving the optical quality of a 45 DEG micro-mirror device. The method is: prepare an alkaline aqueous solution as the etchant, control the temperature in the range of 55 DEG C to 95 DEG C and proceed the etching with the stir and vibration means, then form a micro-mirror on the 111 plane with an angle of 45 DEG relative to the silicon substrate. This method can improve the optical quality of a 45 DEG micro-mirror device. By incorporating a laser diode and other optical sensors onto a silicon substrate, the micro-mirror can be applied to a thin optical pick-up head.
Patent TW-477850-B (TW)
Title: Dispersing dye microemulsion agent for textile jet ink prinking
Inventor: JENG KUEN-LIN
IPC: D06P1/16
Filed: 1999-10-22
Granted: 2002-03-01
Abstract: The present invention relates to a dispersing dye microemulsion agent for textile jet ink printing, which uses dispersing agents such as sodium polynaphthalene formaldehyde sulfonates, surfactants such as POE NP ether, and silicone derivative emulsion-type defoaming agents and bactericidal fungicidal agents specific for jet ink CMYK four-color dispersing dyes, and then forming a stable dye microemulsion through microjetting homogenization emulsifier. This invention focuses on the dispersing dyes suitable for polyester fibers and applying a low-cost environmentally protective microemulsion agent in the ink production technology so that the O/W model becomes a stable and homogenized system. This gives the dispersing dye microemulsion agent with a dye particle diameter below 300 nm and high storage stability, rinse, and sublimation fastness over 4, and light illumination over 4.
Patent TW-429507-B (TW)
Title: Detecting method for robot stability and the circuit thereof
Inventor: JANG YUNG-MING
IPC: H01L21/68
Filed: 1999-11-02
Granted: 2001-04-11
Abstract: The present invention discloses a detecting method for robot stability and the circuit thereof which employs two photo-sensors and a wafer positioning detection circuit to detect the position of semiconductor wafer transmitted by the robot on the semiconductor processing machine. The invention discloses three detection methods which are the wafer outer edge positioning detection method, the wafer peripheral positioning detection method and the wafer outer edge/peripheral positioning detection method. When the position of the semiconductor wafer transmitted by the robot is exceptional, the beeper will send out the alarm and the interlocks will lock the processing machine.
Patent TW-444459-B (TW)
Title: Network system
Inventor: DOI TOSHIO
IPC: H04L12/28
Filed: 1999-11-02
Granted: 2001-07-01
Abstract: A LAN (101) on a device side and a LAN (109) on the factory side, which form a focused ion beam device, are separated by a separation means (110) connected with a common data storage (118) accessible from both the LAN (101) and the LAN (109). The LAN (101) on the device side is connected with a service center through a leased line (120) to allow remote maintenance of the LAN (101) while providing security of the LAN (109) on the factory side.
Patent TW-427045-B (TW)
Title: Vertical cavity surface emitting lasers with consistent slope efficiencies
Inventor: SCOTT JEFFREY W
IPC: H01S5/028
Filed: 1999-11-11
Granted: 2001-03-21
Abstract: A vertical cavity surface emitting laser (VCSEL) with variable tuning layer for adjusting the slope of the laser and method for manufacturing the same are disclosed. In practice, a VCSEL wafer is grown by any conventional technique, and fabricated into discrete lasers while maintained in wafer form. The initial lasers are then tested to determine characteristics, such as the slope efficiency distribution. A variable thickness dielectric layer is then deposited which is calculated to tune the slope efficiency distribution to within a target specification by altering the phase of the top facet reflectivity of the initial lasers. The resulting change in transmission directly changes the laser slope in a predictable fashion. The tuning step may be repeated, if necessary, to further refine the slope to the desired value. The method produces VCSELs with similar or consistent slopes from a plurality of wafers. Also disclosed are an optical subassembly and optical transceiver incorporating the improved VCSELs.
Patent TW-420841-B (TW)
Title: Method and system for removing the water mark from the surface of a semiconductor substrate
Inventor: GU SHAU-YAN
IPC: H01L21/30
Filed: 1999-11-15
Granted: 2001-02-01
Abstract: The present invention provides a method and system for avoiding the generation of water mark on the surface of a semiconductor substrate. The method of the present invention comprises the steps of: processing the surface of a semiconductor substrate by water vapor; performing a first dry step for removing most of water on the surface of the semiconductor substrate; processing the surface of the semiconductor substrate by organic solvent vapor; and performing a second dry step to remove water and organic solvent remained on the surface of the semiconductor substrate. The system of the present invention comprises: a reaction chamber for accommodating the semiconductor substrate, and the reaction chamber having a dry mechanism; a water vapor generator for generating water vapor so as to process the surface of the semiconductor substrate; and an organic solvent vapor generator for generating organic solvent vapor so as to process the surface of the semiconductor substrate that has been processed by the water vapor.
Patent TW-499746-B (TW)
Title: Chip scale surface mount package for semiconductor device and process of fabricating the same
Inventor: ZANDMAN FELIX
IPC: H01L23/31
Filed: 2000-01-07
Granted: 2002-08-21
Abstract: A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate). Since no wire bonds are required, the resulting package is rugged and provides a low-resistance electrical connection between the back and front sides of the dice.
Patent TW-428080-B (TW)
Title: Pedometer
Inventor: PYLES NATHAN
IPC: G01C22/00
Filed: 1999-11-20
Granted: 2001-04-01
Abstract: The pedometer having improved accuracy by calculating actual stride lengths of a user based on relative stride rates. The pedometer includes a waist or leg mounted stride counter, a transmitter for transmitting data to a wrist-mounted display unit, and a data processor for calculating necessary base unit and actual stride rates and lengths. The pedometer can also interact with a heart monitoring device.
Patent TW-475033-B (TW)
Title: A vane pump
Inventor: YAMAMORI MOTOYASU
IPC: F04C2/344
Filed: 1999-12-08
Granted: 2002-02-01
Abstract: A vane pump is composed of a rotor that is rotatably disposed in a cam ring attached to a housing, a plurality of vanes that are slidably disposed in corresponding slits formed in the rotor in which the vane is projected from the slit upon rotation of the rotor, a pair of sidewall members that close both side portions of the cam ring to form a cavity defined by the cam ring and said sidewall members, a plurality of annular backpressure grooves that is depressively formed on contact surfaces of the sidewall members with the rotor in which adjacent two of the backpressure grooves are communicated with each other through a communication passage to introduce discharged pressure into an inside end portion of each of the slits, and depressions that are formed on at least one of the contact surfaces of the sidewall members with the rotor in which the depressions are not contacted with a part of side surface of each of the vanes.
Patent TW-432648-B (TW)
Title: Flip chip glue injection method and device
Inventor: SHEN CHI-JR
IPC: H01L23/28
Filed: 2000-01-04
Granted: 2001-05-01
Abstract: The present invention relates to a flip chip glue injection method and device for semiconductor packaging, which is to form at least a set of venting holes on the predetermined chip locations on the substrate, and pre-configure non-linear curved venting channel on the lower mold of glue injection mold. While placing the substrate after chip mounting in the mold for conducting glue injection, the lower mold can use the venting channel to start venting. At this point, the glue will be influenced by the pressure difference between the inside and the outside of the mold and being entered rapidly through the clearance between each solder balls at the chip bottom and rapidly filling up the clearance between the chip and the substrate to reduce the void occurrence. Because the venting channel in the lower mold uses a curved design, after completing the glue injection, the residual glue spilling in front of the venting channel will remain at the substrate bottom or gel in the venting hole of the substrate so as to prevent the residual glue on the lower mold to cause the mold clearing problem. Furthermore, the design can improve the processing efficiency of glue injection.
Patent TW-I225876-B (TW)
Title: In situ preparation of A bis-(benzothiazolesulfen) amide in a polymeric matrix
Inventor: STIEBER JOSEPH F
IPC: B60C1/00
Filed: 2000-01-04
Granted: 2005-01-01
Abstract: A process is disclosed for preparing an N-hydrocarbyl-bis-benzothiazolesulfenamide comprising reacting an N-hydrocarbyl-2-benzothiazolesulfenamide with a cyclic organic acid anhydride in situ in a polymeric matrix at elevated temperature.