baber/WOPTO huggingface dataset:
Patent TW-201921584-A (TW)
Title: Substrate support for reduced damage substrate backside
Inventor: HUSTON JOEL M
IPC: H01L21/02
Filed: 2018-09-12
Abstract: Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating back-side wafer damage are also disclosed.
Patent TW-202012809-A (TW)
Inventor: WU JIAN-SYUN
IPC: F16H1/32
Filed: 2018-09-21
Abstract: 本發明是一種具導油環的諧波減速機，藉由在諧波減速機模組的撓性外齒齒輪原有容置空間內設置有導油環，且該導油環套固在該諧波減速機模組的聯軸件且位於該諧波減速機模組的第一殼體與撓性軸承之間，因此，油脂透過該第一殼體的注油孔注入後，該油脂會由該導油環的各進油孔進入該儲油環槽內，當波產生器旋轉時，在儲油環槽內的油脂藉由其環槽壁面導引至波產生器的撓性軸承上，藉此潤滑撓性軸承，據此，本發明在有效潤滑的基礎下避免因潤滑不足造成磨耗而產生異物雜質，同時不需變更原有減速機外型尺寸。
Patent TW-201928113-A (TW)
Title: Semiconductor substrate and manufacturing method thereof
Inventor: WATANABE TAKUTO
IPC: H01L23/485
Filed: 2018-11-07
Abstract: An embodiment of the present invention aims to provide a semiconductor substrate having an Au electrode pad and excellent productivity, and a manufacturing method thereof. The semiconductor substrate according to the embodiment of the present invention is a semiconductor substrate having an electroless Ni plating film/ electroless Pd plating film/ electroless Au plating film or electroless Ni plating film/ electroless Au plating film on the Au electrode pad. In the method of manufacturing a semiconductor substrate according to the embodiment of the present invention, an electroless Ni plating film/ electroless Pd plating film/ electroless Au plating film, or an electroless Ni plating film/ electroless Au plating film is formed on the Au electrode pad by the following steps (1) to (6), which include (1) degreasing step, (2) etching step, (3) pre-dipping step, (4) Pd catalyst applying step, (5) electroless Ni plating step, (6) electroless Pd plating step and electroless Au plating step, or electroless Au plating step.
Patent TW-201926442-A (TW)
Title: Wafer processing method
Inventor: UEKI ATSUSHI
IPC: B23K26/00
Filed: 2018-11-23
Abstract: A wafer processing method includes a modified layer forming step of forming a modified layer along a planned dividing line within a wafer and a dividing step of dividing the wafer along the planned dividing line with the modified layer as a starting point by applying a force to the wafer. The modified layer forming step includes a forward path modified layer forming step, a backward path modified layer forming step, and a phase shift mask reversing step of reversing a phase shift mask so as to reverse phase distribution of a laser beam applied to the wafer in an X-axis direction after the forward path modified layer forming step and before the backward path modified layer forming step, or after the backward path modified layer forming step and before the forward path modified layer forming step.
Patent TW-201936321-A (TW)
Title: Single side polishing method for wafer
Inventor: SUGIMORI KATSUHISA
IPC: H01L21/304
Filed: 2019-01-07
Abstract: A single side polishing method for a wafer is provided, and the method is capable of obtaining a wafer having the desired ESFQD precisely. In the present invention, the polishing method for a wafer includes: a first step (step S10) of calculating the protruding amount of a wafer (=central thickness of the wafer - thickness of retainer ring); a second step (step S20) of determining the concentration of water-soluble polymer contained in the polishing slurry based on the protruding amount; a third step (step S30) of causing rotation plate and polishing head to rotate relatively, and polishing the single side of the wafer while supplying the polishing slurry having the concentration of water-soluble polymer determined in the second step.
Patent TW-201934063-A (TW)
Title: Cleaner
Inventor: LEE SANG-IK
IPC: A47L9/10
Filed: 2019-02-18
Abstract: A cleaner including: a main body having a first connection flow path which is formed in an outside thereof; and a nozzle having a suction port through which air is introduced, wherein the nozzle comprises: a case in which the suction port and a second connection flow path are formed, the second connection flow path which is hooked to the first connection flow path, a push button able to linearly move through one surface of the case in a predetermined pressing direction; and a detachment unit mounted in the case to be rotated about a rotating shaft positioned in a direction parallel to the pressing direction, and interlocked with the push button to release hook coupling of the first connection flow path and the second connection flow path when rotating.
Patent TW-202014571-A (TW)
Title: Detergent machine including a tank, a tank tray and a remaining amount detecting means
Inventor: IMANARI MASAO
IPC: G01F23/62
Filed: 2019-02-25
Abstract: The invention is to provide a detergent machine capable of stably detecting a liquid level without being influenced by variations of a liquid level to be detected. [Solution] The invention includes a tank for storing a detergentdetergent liquid; a tank tray for accommodating the tank; and a remaining amount detecting means for detecting the remaining amount of the detergentdetergent liquid. The remaining amount detecting means includes a buoy with a magnet, and a magnetic sensor arranged in the bottom of the tank and at the bottom of the tank tray. The magnetic sensor is configured to detect the magnet and the remaining amount of the detergentdetergent liquid in a non-contact manner. The buoy can be moved along with the liquid level of the detergentdetergent liquid by a pivot connected to the tank. The magnet is set so that a magnetic pole of the magnet is arranged opposite to the magnetic sensor in a state that the buoy is positioned at the lowest position of the movable range.
Patent TW-202010251-A (TW)
Inventor: KANAZAWA LAURA
IPC: H03K3/013
Filed: 2019-02-25
Abstract: 本發明之課題在於提供一種可一舉地減低在噪音等中所包含有之複數個優勢頻率之音壓的主動式雜音控制系統。  
     本發明之主動式雜音控制系統係具有：控制器3，其製作並輸出控制音AS，該控制音AS係減低以麥克風2所觀測到之包含有3個既定之優勢頻率a'~c'的控制對象音S；及揚聲器4，其放出控制音；且控制器係具備有：帶通濾波器5，其使全優勢頻率透過；控制音信號製作手段6b、6c，其等以自該濾波器之帶通信號sp而抵消2個優勢頻率之方式串列地設置有2個，進行優勢頻率之反相位之控制音信號sb、sc之製作及朝向帶通信號的重疊；最終控制音信號製作手段6a，其串列地被設置於控制音信號製作手段，且製作與帶通信號中之剩餘1個優勢頻率反相位的控制音信號sa；及重疊手段7，其對控制音信號製作手段之控制音信號進行重疊而製作並輸出控制音。
Patent TW-202033211-A (TW)
Inventor: LI CHING-FU
IPC: A61K36/9068
Filed: 2019-03-13
Abstract: 本發明係提供一種基於輔助關節活化之活化液，其包含下列重量百分比之原料：辣椒15～20％、薑5～10％、香茅1～2％、薄荷0.5～1％及乙醇67～78.5％；其中，將所述之辣椒、薑及香茅及薄荷混合後進行搗攪，並取其搗攪後所產生之汁液；將所述汁液加入所述乙醇後形成混合液，並將所述混合液予以密封發酵，藉以形成所述活化液；藉之，本發明係可用以塗佈於關節疼痛之皮膚表面，藉以於皮膚表面產生溫熱感，藉可緩解疼痛感，本發明並可經皮膚吸收而由毛孔進入關節軟骨，配合適當的運動，藉以促進軟骨間之關節液增生，以達致輔助關節活化之功效者。
Patent TW-202035837-A (TW)
Title: Beam and slab structure and construction method
Inventor: Chen zong-long
IPC: E04G11/36
Filed: 2019-03-20
Abstract: A beam and slab structure and a construction method. The beam and slab structure includes a beam bottom support unit and a beam side forming unit. The beam bottom support unit includes at least one support frame, a base set, and a beam bottom template. The base set includes a base on the support frame, and two resisting parts. The resisting parts respectively extend upward from the side end of the base. The beam bottom template is arranged on the base of the base set and is located between and space from the resisting parts. The beam side forming unit is detachably arranged on two sides of the beam bottom template and defines a beam forming space together with the beam bottom template.
Patent TW-202036268-A (TW)
Inventor: YU TENG-HSIANG
IPC: G10L19/00
Filed: 2019-03-21
Abstract: An audio processing method and an audio processing system are provided. The audio processing system includes a classification module, a transform module, a panning module, a broader module and an inverse transform module. In the audio processing method, at first, an audio signal is provided. Then, plural classes are provided. Then, 
a classification step is performed on the audio signal in accordance with the classes. Thereafter, a transform step is performed on the audio signal to convert the audio signal into a frequency domain. Then, a panning step and a summing step are performed on amplitude signals of the audio signal to obtain a total amplitude signal. Thereafter, a separation step and a summing step are performed on phase signals of the audio signal to obtain a total phase signal. Then, an inverse transform step is performed on the total amplitude signal and the total phase signal to obtain an optimized audio signal in a time domain.
Patent TW-202013727-A (TW)
Title: Gate-all-around quantum well complementary inverter and method of making the same
Inventor: Xiao de-yuan
IPC: H01L21/28
Filed: 2019-04-30
Abstract: The present invention provides a gate-all-around quantum well complementary inverter comprises a first and a second field effect transistor (FET). Channels of the first and second FETs, each of which is surrounded by a gap area, are juxtaposed transversely. A source area and a drain area are positioned at a side of the channel. The channel comprises a semiconductor nano-sheet, a first semiconductor layer fully surrounding semiconductor nano-sheet and a second semiconductor layer fully surrounding the first semiconductor layer. The first semiconductor layer provides holes a quantum well, and the second semiconductor layer provides electrons a quantum well. A common gate electrode fully surrounds the gate layer of the first FET and the gate layer of the second FET. The structure of the disclosed device is compact enough to increase the density and improve the performance and simple enough to produce.
Patent TW-201941441-A (TW)
Title: Semiconductor device and method for manufacturing the same
Inventor: YAMAZAKI SHUNPEI
IPC: H01L29/786
Filed: 2010-05-11
Abstract: Homogeneity and stability of electric characteristics of a thin film transistor included in a circuit are critical for the performance of a display device including said circuit. An object of the invention is to provide an oxide semiconductor film with low hydrogen content and which is used in an inverted staggered thin film transistor having well defined electric characteristics. In order to achieve the object, a gate insulating film, an oxide semiconductor layer, and a channel protective film are successively formed with a sputtering method without being exposed to air. The oxide semiconductor layer is formed so as to limit hydrogen contamination, in an atmosphere including a proportion of oxygen. In addition, layers provided over and under a channel formation region of the oxide semiconductor layer are formed using compounds of silicon, oxygen and/or nitrogen.
Patent TW-201936842-A (TW)
Title: Thermal release adhesive tape
Inventor: SOEJIMA KAZUKI
IPC: C09J133/06
Filed: 2015-09-14
Abstract: The present invention provides a thermal release adhesive tape which is an adhesive tape suitable for use in processing electronic parts and materials and providing sufficient fixity to objects to be adhered not only with a smooth surface but also with a concave and convex surface. The thermal release adhesive tape of the present invention is provided with an adhesive agent layer and comprises an antistatic material. The adhesive agent layer comprises an adhesive agent and thermally-expandable microspheres, in which the adhesive agent is composed of a basic polymer comprising a structural unit A derived from side-chain (meth) acrylic acid alkyl ester containing branched chain structures. The amount of the structural unit A in the basic polymer is more than 20% by weight.
Patent TW-202046259-A (TW)
Title: Method for locating vehicle, electronic device, vehicle, and storage medium
Inventor: WANG HON-DA
IPC: G05D1/12
Filed: 2019-06-28
Abstract: The present invention provides a method for locating vehicle, an electronic device, a vehicle, and a storage medium. The method includes generating a first data package containing information of a target vehicle, and broadcasting the first data package to other vehicles, the first data package being configured to be received and stored by the other vehicles. The method further includes generating a second data package when the electronic device is separated from the target vehicle, and sending the second data package to the other vehicles within a preset range. The method further includes locating the target vehicle according to the first data package and the second data package through the other vehicles, and receiving predetermined information of a navigation path. Implementing the present invention can automatically plan and direct the driver from the current location to the location of the target car in the parking lot.
Patent TW-202030043-A (TW)
Inventor: ZHOU ZHI-DONG
IPC: H02G1/12
Filed: 2019-07-02
Abstract: The invention relates to a technical filed of cable processing equipment and discloses a cutting device and method. The cutting device includes: a positioning mechanism including a positioning member, the positioning member being configured to penetrate an end of a cable to press an everting protective layer to make the protective layer and an outer layer of the cable attach to each other, the cable being electrically connected to a workpiece, the positioning member being connected to the workpiece; and a laser cutting mechanism located at a side of the positioning mechanism, the laser cutting mechanism being capable of cutting the protective layer at a side of the positioning member. The cutting device is stable and universal and improves the quality of products and the efficiency of production. Meanwhile, by the positioning member connected to the workpiece, the positioning member is for fixing the cable to the workpiece to ensure the stability of structure between the cable and the workpiece.
Patent TW-202013512-A (TW)
Title: Semiconductor device and method of manufacture the same
Inventor: HUANG PIN-CHI
IPC: H01L21/314
Filed: 2019-08-30
Abstract: A semiconductor device includes a gate structure on a substrate and a dielectric film stack over the gate structure and the substrate, where the dielectric film stack includes a first inter layer dielectric (ILD) over the substrate and the gate structure, a barrier layer over the first ILD, a second ILD over the barrier layer, and a contact extending through the dielectric film stack. An upper portion of a contact sidewall has a first slope, a lower portion of the contact sidewall has a second slope different from the first slope, and a transition from the first slope to the second slope occurs at a portion of the contact extending through the barrier layer.
Patent TW-202014369-A (TW)
Title: Yarn winding device and yarn winding method
Inventor: BANDO SHIRO
IPC: B65H54/70
Filed: 2019-09-06
Abstract: The present invention suppresses fluctuations in winding ratio and prevents the surface shape of a package from being disturbed, even if creeping is performed during the execution of precision winding. The yarn winding machine comprises a guide driving unit that reciprocatingly drives a traverse guide and that can change the reversal position of the traverse guide during a yarn winding operation, and a control device. The control device can perform: a first reversing control wherein the traverse guide, which is traveling outward at a predetermined speed in the traversal direction, is decelerated, then reversed so as to travel inward at a first reversal position, and then re-accelerated to a predetermined speed; and a second reversing control wherein, the traverse guide, which is traveling outward at a predetermined speed in the traversal direction, is decelerated, then reversed so as to travel inward at a second reversal position further inward than the first reversal position, and then re-accelerated to a predetermined speed. The control device makes second reverse time (Trb) in the second reversing control longer than first reverse time (Tra) in the first reversing control during the execution of the precision winding.
Patent TW-202020563-A (TW)
Title: Photosensitive resin composition capable of reducing a small diameter through-hole peeling residue
Inventor: IINO RYO
IPC: B32B27/30
Filed: 2019-09-20
Abstract: A problem to be solved by the present invention is to provide a photosensitive resin composition for wet lamination capable of reducing a small diameter through-hole peeling residue, a photoresist pattern forming method using the same, or a conductor pattern manufacturing method. The photosensitive resin composition for wet lamination includes 51 mass% or more of an alkali-soluble polymer and a compound having an ethylenically unsaturated double bond. The compound having the ethylenically unsaturated double bond contains a monomer containing an ethylene oxide (EO) unit, and the mass ratio of the monomer containing 30 moles or more of the EO unit to the monomer containing less than or equal to 29 moles of the EO unit is 37% or less.
Patent TW-202019687-A (TW)
Title: Laminated film
Inventor: GOTO TAKAMICHI
IPC: B65D81/24
Filed: 2019-09-27
Abstract: To provide a laminated film suitable for packaging such as retort food that can reduce the amount of packaging material, having excellent resistance to bag breakage, and can keep standing when used as a standing pouch.
A laminated film comprising at least a base material layer and a sealant layer, wherein (a) the base material layer is a biaxially stretched polyester film having a thickness of 9 μm to 25 μm, containing 70% by mass or more of polybutylene terephthalate, (b) the piercing strength of the laminated film is 9.0N or more, and (c) the loop stiffness value X (mN / 25 mm) of the laminated film is 80 or more, and (e) the total thickness is 59 to 160 μm.
Patent TW-202114880-A (TW)
Title: Printed product having anti-counterfeiting function capable of hiding anti-counterfeiting design but easy to be identified
Inventor: Yao ming-xian
IPC: B44F1/02
Filed: 2019-10-07
Abstract: The present invention relates to a printed product, which includes a bottom layer and a surface layer, wherein at least one anti-counterfeiting sign is located between the bottom layer and the surface layer. The surface layer and the anti-counterfeiting sign are formed by ink printing. The printed product has anti-counterfeiting function and may be recognized as genuine or fake by the disposed anti-counterfeiting sign. The anti-counterfeiting sign is hidden in the printed product and may not be easily found. While irradiating light onto the printed product, the anti-counterfeiting sign will be appeared on the printed product.
Patent TW-202017182-A (TW)
Title: Integrated circuit and method manufacturing the same
Inventor: Shen yu-yang
IPC: H01L29/36
Filed: 2019-10-24
Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a first through substrate via (TSV) within a first semiconductor substrate. The first semiconductor substrate has a front-side surface and a back-side surface respectively on opposite sides of the first semiconductor substrate. The first semiconductor substrate includes a first doped channel region extending from the front-side surface to the back-side surface. The first through substrate via (TSV) is defined at least by the first doped channel region. A first interconnect structure is on the front-side surface of the first semiconductor substrate. The first interconnect structure includes a plurality of first conductive wires and a plurality of first conductive vias, and the first conductive wires and the first conductive vias define a conductive path to the first TSV.
Patent TW-202036013-A (TW)
Title: Inspection system
Inventor: WATANABE SHINJIRO
IPC: G01R31/26
Filed: 2019-11-13
Abstract: The present invention provides a technique capable of increasing an alignment success rate in an inspection device system with a plurality of inspection devices. According to an embodiment of the present invention, the inspection device system comprises a plurality of inspection devices and a data processing device capable of communicating with the plurality of inspection devices. The data processing device includes: a storage unit to store a model for determining a causal relationship of index data obtained when operating the inspection device and a device parameter related to setting of the inspection devices; a collection unit to collect the device parameter and the index data from any inspection device among the plurality of inspection devices; a determination unit to determine whether the index data collected by the collection unit are included in a predetermined allowed range; and a calculation unit to calculate an adjustment amount to adjust the device parameter based on the model stored in the storage unit and the device parameter and the index data collected by the collection unit if it is determined that the index data are not included in the allowed range by the determination unit.
Patent TW-202031854-A (TW)
Title: Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate
Inventor: MORIYA SHUNSUKE
IPC: H01L21/683
Filed: 2019-11-27
Abstract: This adhesive agent composition is for forming an adhesive layer that provides, in a releasable manner, adhesion between a first base body comprising a semiconductor forming substrate and a second base body comprising a support substrate, and that contains a component (A) that is cured by a hydrosilylation reaction, and a release component (B) containing components including an epoxy modified polyorganosiloxane. The component (A) includes a polysiloxane (A1) including a siloxane unit (Q unit) represented by SiO2, etc., and a platinum group metal catalyst (A2). The polysiloxane (A1) includes a polyorganosiloxane (a1) including a siloxane unit (Q' unit) represented by SiO2, etc., and a polyorganosiloxane (a2) which includes a siloxane unit (Q'' unit) represented by SiO2, etc., and in which the amount of a functional group (Si-H) is 5.0 mol/kg or more.
Patent TW-202101704-A (TW)
Inventor: CHEN MING-FA
IPC: H01L21/50
Filed: 2019-12-16
Abstract: 一種封裝結構包括多個堆疊式晶粒單元及絕緣密封體。所述多個堆疊式晶粒單元彼此上下堆疊，其中所述多個堆疊式晶粒單元中的每一者包括第一半導體晶粒、第一結合晶片。所述第一半導體晶粒具有多個第一結合墊。所述第一結合晶片堆疊在所述第一半導體晶粒上且具有多個第一結合結構。所述多個第一結合結構透過混合結合而結合到所述多個第一結合墊。所述絕緣密封體包封所述多個堆疊式晶粒單元。
Patent TW-202127176-A (TW)
Inventor: HUANG YU-CHIN
IPC: G06F1/16
Filed: 2019-12-31
Abstract: 一種可攜式電子裝置，包括殼體、攝像模組、驅動組件、旋轉件、遮蓋、連桿以及第一彈簧。攝像模組設置於殼體內。驅動組件可移動地設置於殼體內。旋轉件可旋轉地設置於殼體內且位於驅動組件的移動路徑上。遮蓋可移動地設置於殼體內的軌道。連桿的第一端可移動地樞接旋轉件，連桿的第二端樞接遮蓋。第一彈簧設置於連桿且抵接在旋轉件與遮蓋之間。驅動組件藉由旋轉件與遮蓋而變形第一彈簧以蓄積彈力，且藉由彈力驅動該遮蓋移動以遮蔽或暴露攝像模組。
Patent TW-202044455-A (TW)
Title: Apparatus for processing a wafer, and method of controlling such an apparatus
Inventor: BRIEN DANIEL
IPC: H01L21/67
Filed: 2020-01-20
Abstract: An apparatus for processing a wafer comprises: a rotatable chuck adapted to receive a wafer; a heating assembly comprising an array of light-emitting heating elements arranged to illuminate a wafer received by the rotatable chuck to heat the wafer; and one or more light sensors arranged to detect light emitted by the array of light-emitting heating elements.
Patent TW-202129345-A (TW)
Title: Six-piece optical lens system
Inventor: KE SIAN-CHIH
IPC: G02B13/00
Filed: 2020-01-21
Abstract: A six-piece optical lens system includes, in order from the object side to the image side: a stop, a first lens element with a positive refractive power, a second lens element with a negative refractive power, a third lens element with a refractive power, a fourth lens element with a negative refractive power, a fifth lens element with a positive refractive power, and a sixth lens element with a negative refractive power. Such arrangements can provide a miniaturized six-piece optical lens system having a big stop and high image quality.