baber/WOPTO huggingface dataset:
Patent JP-2011043262-A (JP)
Title: Refrigerator
Inventor: ISHIBASHI IKUO
IPC: F25D23/00
Filed: 2009-08-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a refrigerator designed to hardly splash water on a body side electrode part to improve safety in constitution of installing a power receiving unit having a power receiving part to which high voltage is applied, detachably in a refrigerator body.  <P>SOLUTION: An atomizing unit 32 (the power receiving unit) of an electrostatic atomizer 30 is detachably installed in a unit storage part 35 provided at a partition plate 8 of a bottom part of a refrigerating chamber 3. A body side electrode part 61 and an electric connection part 55 at the rear part of the atomizing unit 32 are connected by inserting the electric connection part 55 horizontally to the body side electrode part 61 while placing the body side electrode 61 to face forward and the electric connection part 55 to face backward.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011031230-A (JP)
Title: Liquefied co2 offshore dumping platform
Inventor: HAGA GUNJI
IPC: C01B32/50
Filed: 2009-07-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technology of a liquefied CO2 offshore dumping platform which is capable of performing the submarine treatment of CO2 gas by recovering liquefied CO2 which is generated at a thermal power plant or an iron mill, subjected to the liquefaction treatment and accumulated in a storage tank for the exclusive use with a liquefied CO2 tank transport ship and connecting the same with a floating dock to emit the liquefied CO2 in the transport ship into deep sea of 50 barometer pressure at one stretch.  <P>SOLUTION: The technology of the liquefied CO2 offshore dumping platform is comprised of the thermal power plant or the iron mill, the CO2 liquefaction treatment facility, the tank for the storage of liquefied CO2, the sea surface 4, the liquefied CO2 tank transport ship 5, the seabed 6 of a continental shelf and the floating dock 7 (liquefied CO2 offshore dumping platform), a pipe 8 extended even under the interface 9 of the depth of water of 500 M and the hydraulic pressure of 50 barometric pressure, the outlet 10 of the liquefied CO2, and the deep ocean floor 11.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011042102-A (JP)
Title: Piezoelectric actuator, liquid ejection head, and method for manufacturing piezoelectric actuator
Inventor: KUWAJIMA HIDEKI
IPC: B41J2/045
Filed: 2009-08-21
Abstract: <P>PROBLEM TO BE SOLVED: To achieve a long size while suppressing variation in the arrangement of piezoelectric element parts 2b in a piezoelectric actuator including a plurality of piezoelectric element parts 2b arranged at the predetermined pitch in a predetermined direction.  <P>SOLUTION: The piezoelectric actuator 2 includes n piezoelectric actuator plates 18 constituted by sintering laminates including alternately laminated piezoelectric sheets 3 and fixed parts 4 and disposing the piezoelectric element parts 2b at the predetermined pitch in a laminating direction; space adjusting members 17 interposed between the n piezoelectric actuator plates 18 arranged in the laminating direction; and dimension regulating parts 50 arranging the piezoelectric element parts 2b at the predetermined pitch straddling the plurality of piezoelectric actuator plates 18 by regulating a length from the first piezoelectric actuator plate 18 to the n-th piezoelectric actuator plate 18 to a predetermined length.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011043119-A (JP)
Title: Nozzle vane and turbocharger
Inventor: SAKAI YASUTAKA
IPC: F01D17/16
Filed: 2009-08-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a nozzle vane and a turbocharger suppressing manufacturing labors and costs.  <P>SOLUTION: The nozzle vane 8 includes: a vane 64; and a nozzle shaft 66 projecting from an end face 64b of the vane 64. The nozzle vane has: a press-fit part 86 provided on the nozzle shaft 66 and formed in a press-fit dimension; and a non-press-fit part 87 having a shape in which at least a part of the press-fit part 86 is omitted.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011043731-A (JP)
Title: Method of forming photoresist pattern, method of manufacturing probe using method thereof, and probe for inspecting electronic device
Inventor: TAWARA TAKESHI
IPC: G01R1/067
Filed: 2009-08-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of forming a photoresist pattern, capable of improving efficiency of manufacture and thus reducing costs, along with a method of manufacturing a probe using the method, and a probe for inspecting an electronic device.  <P>SOLUTION: The method of forming the photoresist pattern includes: a lower resist layer laminating step of laminating a first resist material on a substrate; a first exposure step of exposing the lower resist layer with a first pattern; an upper resist layer laminating step of laminating a second resist material on the lower resist layer following the first exposure step; a second exposure step of exposing the upper resist layer with a second pattern which overlaps at least partly with the first pattern used for exposing the lower resist layer; and a developing step of removing unnecessary resist and forming a resist layer having an opening.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011044073-A (JP)
Title: Device, method and program for high order composition
Inventor: MIYAZAKI SHINYA
IPC: G06F17/50
Filed: 2009-08-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high order composition device or the like, which allows sharing of a memory by modules of a size such that operation composition cannot be performed by one module, or sharing of the memory by modules differed in function which operate exclusively.  <P>SOLUTION: The high order composition device configured to input an operation description, perform high order composition processing and output an HDL description includes: a means for detecting an operation description to be converted to a memory; a means for extracting the detected operation description; a means for analyzing the size and connection information of the extracted operation description; and a means for converting the operation description into the memory based on the analysis result and further converting into a protocol based on the connection information.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011054803-A (JP)
Title: Semiconductor device, and power supply method thereto
Inventor: MURAHASHI SHUNICHI
IPC: H01L21/822
Filed: 2009-09-02
Abstract: <P>PROBLEM TO BE SOLVED: To suppress heat generation in an integrated circuit (semiconductor element), with respect to a semiconductor device fabricated by mounting the integrated circuit on a substrate.  <P>SOLUTION: In a liquid crystal driver having a plurality of output cells 101, an operational amplifier 105 being a component of an output cell 101 is connected to power supply wiring 109a formed in the liquid crystal driver being a semiconductor element. Further, bypass wiring 201 is formed on the substrate on which the semiconductor element is mounted, and the bypass wiring 201 is connected to the power supply wiring 109a through a bump 203 for each of operational amplifiers 105 of all the output cells.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011051074-A (JP)
Title: Holding pad
Inventor: KAWAMURA YOSHIHIDE
IPC: H01L21/304
Filed: 2009-09-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a holding pad capable of improving accuracy of flatness of a holding surface and improving in-plane uniformity of an object to be ground.  <P>SOLUTION: The holding pad 10 includes a urethane sheet 2 formed by wet solidification and having the holding surface Sh. The urethane sheet 2 has a skin layer 2a formed, and numerous foams 4 are formed inside the skin layer 2a. The foams 4 have a size expanding approximately entirely over a thickness of the urethane sheet 2. The foams 4 have a pore size formed larger in a lower layer Pr of the urethane sheet 2 than that in an upper layer Ph. The foams 4 are formed so that a foam formation direction in the upper layer Ph is uniformly inclined in a predetermined direction with respect to the thickness direction and that the foam formation direction in the lower layer Pr extends along the thickness direction. Stress to the object to be ground is equalized by compression in grinding.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011052498-A (JP)
Title: Latch lock for double swinging door and double swinging door structure
Inventor: SAWA KAZU
IPC: E05C1/08
Filed: 2009-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To achieve use in a double swinging door without having door stops, and to securely retain a closed state of the double swinging door even in a closing operation from either the front direction or the rear direction.  <P>SOLUTION: The latch lock for the double swinging door includes a latch body 10 to which a latch bolt 11 provided in a retractable manner, and a latch-receiving member 20 having a receiving hole 21 for the latch bolt 11. A vertical plate 12 is formed roughly at the center of the tip of the latch bolt 11, and a horizontal plate 13 orthogonal to the vertical plate is formed so that the vertical plate 12 can be positioned roughly at the center. A slide contact surface 131 of the horizontal plate 13, which is positioned on both sides of the vertical plate 12 and can be brought into slide contact with the latch-receiving member 20, is made either an inclined surface which narrows toward the tip of the horizontal plate 13 or an arc-shaped curved surface which is convexed outward, whereas the shape of the receiving hole 21 almost matches the shape formed by the vertical plate 12 and the horizontal plate 13 of the tip of the latch bolt 11, so that the tip of the projecting latch bolt 11 is nearly engaged with the receiving hole 21.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009286132-A (JP)
Title: Inkjet printer
Inventor: ITO KOJI
IPC: B41J2/045
Filed: 2009-09-07
Abstract: <P>PROBLEM TO BE SOLVED: To suppress deterioration of an ink ejection characteristic and poor ejection, and to attain power saving and cost reduction.  <P>SOLUTION: An inkjet head has: an actuator unit which holds a piezoelectric sheet between individual electrodes, related to pressure chambers corresponding to nozzles, and a grand electrode; and a driver IC which selectively outputs ejection waveforms and flushing ejection waveforms of a shorter pulse period than that of the ejection waveforms. A power supply device 16 which supplies the power to the driver IC has a current limiting circuit 85 which limits a current supplied by the power supply device 16 when the power supply device 16 is going to supply the current, not lower than an upper limit current, that exceeds a current which should be supplied when the driver IC outputs the ejection waveform to all of the individual electrodes and that is smaller than a current which should be supplied when the driver IC outputs the flushing ejection waveform to all of the individual electrodes.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011059775-A (JP)
Title: Image display method, program, image display device, and image pickup device
Inventor: MOTOYOSHI SHUJI
IPC: H04N5/225
Filed: 2009-09-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image display method for extracting a region of interest to a human being from a digital image and displaying each of a plurality of digital images so as not to overlap the region of interest, and to provide a program, an image display device and an image pickup device.  <P>SOLUTION: The image display device 2 is provided with: a storage part 15 storing image data which are grouped into a plurality of image units based on attribute information; and an image generation part 17 for reading a digital image from the storage part 15, detecting the region of interest from each digital image for each image unit group based on the attribute information, arranging the image data on a template 70 so that the region of interest may not overlap the other image data, generating a slide show, and displaying the slide show in a display part 14.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011058413-A (JP)
Title: Centrifugal fan, molding die, and fluid feeding device
Inventor: OTSUKA MASAO
IPC: F04D29/02
Filed: 2009-09-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a centrifugal fan exhibiting satisfactory air blowing capacity, a molding die used for manufacturing the centrifugal fan, and a fluid feeding device including the centrifugal fan.  <P>SOLUTION: This centrifugal fan includes a plurality of fan blades 21 provided at intervals in a peripheral direction. Each of the fan blades 21 has a leading edge 26 guiding air inflow and a trailing edge 27 guiding the air outflow, and is formed with a wing surface 23 extending between the leading edge 26 and trailing edge 27. The wing surface 23 is composed of a positive pressure surface 25 arranged on a side in the rotating direction of the centrifugal fan and a vacuum surface 24 arranged on the back side of the positive pressure surface 25. The fan blade 21 has a blade cross-sectional shape with a recessed portion 56 and a recessed portion 57 respectively formed on the positive pressure surface 25 and vacuum surface 24 when the fan blade is cut by a plane perpendicular to the rotating shaft of the centrifugal fan.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011057382-A (JP)
Title: Waste disposal apparatus
Inventor: ONISHI ICHIRO
IPC: B65F1/00
Filed: 2009-09-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a waste disposal apparatus which disposes of a waste material such as a diaper for a baby, has a lock mechanism for preventing erroneous opening by the baby, and easily opened/closed by one hand.  <P>SOLUTION: This waste disposal apparatus 11 includes a lid body lock mechanism 24 for locking a connecting state of a lid body 23 and a storage body upper part 19, and a body lock mechanism 25 for locking a connecting state of the storage body upper part 19 and a storage body lower part 17. The waste disposal apparatus 11 also has a lid body unlocking mechanism in which the direction of unlocking operation by the lid body lock mechanism 24 is different from that of opening operation of the lid body 23, and a body unlocking mechanism in which the direction of unlocking operation by the body block mechanism 25 is different from that of opening operation of the storage body upper part 19.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010256320-A (JP)
Title: Device for measurement of light wave interference
Inventor: KATSURA SOUTO
IPC: G01B11/24
Filed: 2009-09-11
Abstract: <P>PROBLEM TO BE SOLVED: To accurately measure two shapes of test surfaces including a planar large test surface and a parallel planar test object in a short time.  <P>SOLUTION: The test surface 80 is structured rotatably around a rotation axis R, and an interferometer main unit 1 is structured to be movable with respect to the test surface 80 so that an area to be observed is moved on the test surface 80 which is rotating. While the area to be observed is moved within the test surface, an interfering light beam is sequentially captured by a one-dimensional image sensor. Straight belt-like observation-position-specific interference fringes formed by the interfering light beam are sequentially imaged, and shape information of the test surface 80 is obtained on the basis of the respective imaged observation-position-specific interference fringes.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011056871-A (JP)
Title: Printer, printing control method, printing control program, and recording medium
Inventor: USUKI FUTOSHI
IPC: G06F3/12
Filed: 2009-09-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printer, printing control method, printing control program and recording medium, which print an image on a continuous sheet of paper perforated at every constant interval.  <P>SOLUTION: The printer 1 performs computation of the last page margin ranging from the last-image rear end position up to the following perforation when printing the last image of last page of the printing data on the continuous sheet of paper P with a printing control unit 5 at least, from the logic page length of printing data and the paper page length of a continuous sheet of paper P which has the perforation at every interval according to a paper class, and carries out an empty feed of the continuous sheet of paper on which the last image is printed with a printing mechanism 3 only by the last page margin. Even when the logic page length of printing data and the paper page length of continuous sheet of paper are not equal, the printing data of different jobs are prevented from being printed on the same paper page and then the printing data are divided through the perforation.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011060188-A (JP)
Title: Circuit block diagram creation device, circuit block diagram creation method, and method for manufacturing semiconductor integrated circuit
Inventor: TSUKAMOTO YASUTAKA
IPC: G06F17/50
Filed: 2009-09-14
Abstract: <P>PROBLEM TO BE SOLVED: To facilitate changes, such as hierarchical movement of a RAM and a change from non-sharing to sharing of a RAM or a change from sharing to non-sharing of a RAM in LSI design, and to reduce the design man-hours and design mistakes.  <P>SOLUTION: A circuit block diagram creation device includes a RAM selection means (12) for determining the selection of a RAM for sharing from data of RAMs disposed in a circuit block; a RAM moving means (13) for moving the data of the RAM whose selection has been confirmed to another block; a RAM interface circuit creation means (14) for automatically creating a RAM interface circuit required according to the movement of the RAM data; and circuit description source code creation means (15) for automatically creating a circuit description source code (16) in which the operation of the circuit is described.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011059580-A (JP)
Title: Method of manufacturing wafer-level lens array, wafer-level lens array, lens module and imaging unit
Inventor: YAMADA DAISUKE
IPC: G02B7/02
Filed: 2009-09-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer-level lens array, a wafer-level lens array, a lens module and an imaging unit that can prevent the influence due to, for example, the shrinkage of a forming material, prevent the positional deviation between lenses, when the wafer-level lens arrays overlap each other or when the wafer-level lens array overlaps an imaging element array, and be easily designed.  <P>SOLUTION: The method of manufacturing the wafer-level lens array including a substrate part and a plurality of lens parts that are arranged on the substrate part includes integrally forming the lens parts that are made of a resin, having substantially the same optical characteristics as a material forming the substrate part with the substrate part formed in advance.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011062787-A (JP)
Title: Head exchange type cutting tool
Inventor: AZEGAMI TAKAYUKI
IPC: B23B31/11
Filed: 2009-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To easily detach and exchange a cutting head even when the cutting head is strongly screwed to a holder or strongly fastened to an attaching hole.  <P>SOLUTION: In the cutting head 1 having a cutting edge 3 provided in an end part, a rear end part of the cutting head 1 is inserted into an opening part of one end of the attaching hole 11 passing through the holder 10. A screw part 6 formed in the rear end part is screwed to an intermediate member 14 accommodated in the other end than the opening part of the one end of the attaching hole 11 so as to be detachable. An outer peripheral surface of the rear end part of the cutting head 1 and an inner peripheral surface of the opening part of one end of the attaching hole 11 are formed in a conical surface shape on a central axis O of the attaching hole the diameters of which are gradually reduced as they go to the other end of the attaching hole 11 so as to come close to each other. The intermediate member 14 freely moves forward and backward in the direction of the central axis O of the attaching hole 11 and restricts a rotation on the central axis O of the attaching hole 11 to screw an attaching bolt 15 having a head part 15B inserted from the other end of the attaching hole 11 to the intermediate member 14.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011062447-A (JP)
Title: Nose hair trimmer
Inventor: OGAWA HITOSHI
IPC: A45D26/00
Filed: 2009-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a nose hair trimmer that can be washed with a washing liquid without removing a blade unit from the trimmer while improving the washability of the nose hair trimmer.  <P>SOLUTION: A body case 15 of the nose hair trimmer 10 includes an interior cavity X, which accommodates a rotational inner blade body 23 supporting an inner blade 24 and collects nose hair clippings, and a disposal port 15e, which communicates the cavity X with the exterior. The rotational inner blade body includes an inner blade base 25 supporting inner blades 24 and having a pair of holding pieces 25a functioning as water flow fans. Rotation of the rotational inner blade body 23 rotates the holding pieces 25a (water flow fan) and produces a flow of washing liquid directed from slits 21a in an outer blade 21 via the interior cavity X and toward the disposal port 15e. A side guide wall 15f facing toward the flow of liquid efficiently discharges the washing liquid arcuately flowing around the interior cavity X together with foreign matter such as nose hair clippings from the disposal port 15e.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009302581-A (JP)
Title: Multilayer wiring board
Inventor: HAYASHI KATSURA
IPC: H05K3/20
Filed: 2009-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board and the method of forming the same, in which the influence of the surface roughness of the wiring circuit is eliminated, and the manufacturing step of an organic multilayer wiring board is simplified.  <P>SOLUTION: The method of manufacturing the multilayer wiring board having a wiring circuit formed on the surface of an insulation layer having a via hole formed therethrough includes steps of: forming an opening in an insulation layer and filling a conductor therein to forme a via hole; applying a metal foil on the surface of a transfer sheet and forming wiring pattern of resist thereon to form a wiring circuit by etching; stacking the wiring circuit on a soft insulation layer with the via hole formed therein, pressing and fitting the wiring circuit into the insulation layer, and connecting the via hole with the wiring circuit; and removing the transfer sheet. Thus the multilayer wiring substrate where the wiring circuit to be connected to the via hole is press fitted into the surface of the insulation layer, is provided.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009301065-A (JP)
Title: Manufacturing apparatus of optical fiber structure
Inventor: MURAYAMA MANABU
IPC: G02B6/26
Filed: 2009-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of an optical fiber structure in which an optical fiber is easily fusion-welded with a block-shaped chip to enhance productivity.  <P>SOLUTION: The manufacturing apparatus 20 of the optical fiber structure 10 in which a block-shaped chip 12 is connected to an optical fiber 11a includes: a chip holding part 23; a fiber holding part 22; a moving parts 24 to 26 which relatively move the block-shaped chip 12 held by the chip holding part 23 and the optical fiber 11a held by the fiber holding part 22 so that they contact on the same axis; a heating part 27 which heats the block-shaped chip 12 and the optical fiber 11a; and an axial position relation observation part 31 which observes the axial position relation from the chip end opposed to the chip end of the side connected to the fiber of the block-shaped chip 12 to the chip end of the side connected to the fiber of the block-shaped chip 12 and the fiber end of the optical fiber 11a.  <P>COPYRIGHT: (C)2010,JPO&INPIT