baber/WOPTO huggingface dataset:
Patent TW-I224545-B (TW)
Title: Method for making clamp band
Inventor: SHR JAU-CHIN
IPC: B26D7/01
Filed: 2002-09-25
Granted: 2004-12-01
Abstract: The present invention provides a method for making clamp band, comprising the following steps: placing a thin plate in a die set for punching guide holes, moving the thin plate forward the same distance for more than one time to allow the die set to simultaneously punch another row of guide holes and several serration holes, further moving the thin plate forward the same distance for more than one time to allow the die set to simultaneously punch another row of guide holes, another row of serration holes, connection portions and edge slots, and finally, further moving the thin plate forward the same distance for several times to allow the die set to simultaneously punch another row of guide holes, another row of serration holes, another row of connection portions, and edge slots and to form a circular configuration by rolling and to cut off. As such, the thin plate, after being processed with the same set of dies, can be bent into circular band while being cut off.
Patent TW-561509-B (TW)
Title: Method for controlling electron flood
Inventor: LEE MING-HSING
IPC: H01L21/00
Filed: 2002-09-27
Granted: 2003-11-11
Abstract: A method for controlling electron flood is disclosed, which controls the amount; of electron flood carried on ion bean by reducing the emission current of ion bean in a guide tube. The present method further utilizes a plurality of apparatuses to control the amount of electron flood emitted from a plasma flood gun system (PFS), and the apparatuses include: an aperture plate having an adjustable aperture deposed on the PFS system, which controls the amount of electron flood passing through the adjustable aperture; and a probe to provide charge to electron flood to increase or reduce the amount of electron flood, wherein a part of the probe deposed in the guide tube, and a end of the part of the probe extends into the adjustable aperture of the PF 5 system which is opposite to the opening, and the end can provide charges to electron flood, so as to control the amount of electron flood passing through the aperture.
Patent TW-579650-B (TW)
Title: A device of glove-form image catch
Inventor: CHEN CHIEN-HSU
IPC: H04N5/225
Filed: 2002-10-22
Granted: 2004-03-11
Abstract: This invention is a kind of device about glove-form image catch. It includes: (1) a device of touch off, (2) a device of image catch, (3) a device of power system, (4) a device of image display, and (5) a device of output. When users wear this device and look at display, they can decide an image what they want. When the thumb and the forefinger touch, it will lead a device of touch off and control the image catch system. And thus complete the action of phototaking.
Patent TW-567567-B (TW)
Title: Apparatus for wire bonding
Inventor: HAYATA SHIGERU
IPC: H01L21/00
Filed: 2002-10-24
Granted: 2003-12-21
Abstract: The subject of the present invention is to prevent deterioration in acquired image quality even if a light source for illumination through a lens pipe of a position-detecting camera is turned on. An apparatus of the present invention comprises a tool 4 for conducting wire bonding onto the wire bonding parts; a position-detecting camera 7, which has the lens pipe 8 for picking up the images of the bonding parts; a light source 14 for illumination through the lens pipe 8 downwards; and an optical path changing means 20 for leading the images close to a lower part of the tool 4 to the lens pipe 8. The optical path changing means 20 is provided with a filter 30 for wavelength selection, by which the light from the light source 14 is passed and the light from the lighting means 25 is not passed, above a mirror 22 for reflecting the images close to the lower part of the tool 4 upward.
Patent TW-561586-B (TW)
Title: Semiconductor device and fabrication method thereof
Inventor: KAO HSUAN-LIN
IPC: H01L21/768
Filed: 2002-10-25
Granted: 2003-11-11
Abstract: A polysilicon self-alignment contact and a polysilicon common source line. A cell array formed on a semiconductor substrate has a second cell adjacent to a first cell in a Y-axis orientation, and a third cell adjacent to the first cell in an X-axis orientation. Each cell comprises a first gate structure and a second gate structure, a source region formed in the semiconductor substrate adjacent to the first gate structure and the second gate structure, and an opening formed between the first gate structure and the second gate structure to expose the source region. A drain region is formed in the semiconductor substrate adjacent to the second gate structure of the first cell and the first gate structure of the second cell. A contact hole is formed between the first cell and the second cell to expose the drain region. A polysilicon layer is formed in the contact hole to serve as a polysilicon self-aligned contact. Also, the polysilicon layer is formed in the opening to electrically connect source regions in an X-axis orientation to serve as a common source line.
Patent TW-I226046-B (TW)
Title: Cassette for accommodating recording medium
Inventor: INOUE NAOKI
IPC: G11B23/03
Filed: 2002-11-04
Granted: 2005-01-01
Abstract: The present invention discloses a cassette for accommodating recording medium, wherein the cassette can be loaded with different sizes of optical disks, and can be loaded with different sizes of optical disks in the record regeneration device of the disk cassette by treating the disk as a single unit. The cassette comprises: a cassette body (2) by oppositely connecting the lower case (7) configured with an opening (24) for record regeneration and the upper case (6) configured with an insertion (2a) for the first optical disk (3a); an opening (44) configured on the main surface corresponding to the opening (24), and a middle case (4) accommodated in the cassette body (2) as a rotatable state; and, the shutter members (5a)(5b), configured on the middle case (4) at the side of the lower case (7), for opening the opening (24) and the opening (44) when rotating the middle case (4) to make the consistency for the opening (24) and the opening (44). And, the disk accommodation portion (11a) is configured with a disk holding portion (11b) for keeping the first optical disk (3a) at a rotatable state, and the disk holding portion (11c) for keeping the second optical disk (3c) with smaller diameter in a rotatable state.
Patent TW-I227096-B (TW)
Title: Charging IC circuit of camera strobe
Inventor: LIN JING-KUEN
IPC: H05B41/32
Filed: 2002-12-19
Granted: 2005-01-21
Abstract: The present invention relates to a charging IC circuit of camera strobe, which includes: a single-strike unit for providing a square wave signal; a R-S latch connected to the single-strike circuit; a pulse width modulation control circuit composed of a reference voltage source, an oscillator, a pulse width modulation comparator, a boosting comparator and a current source; and a ready control unit composed of a field effect transistor having a source connected to the output of the R-S latch. Strobe is charged and controlled by IC circuit to enable miniaturization and easy integration, and to provide advantages of controlling charging current, increasing the charging speed and automatic recharging.
Patent TW-I224157-B (TW)
Title: Method for increasing the field density of sands at shallow depths by disk shearing
Inventor: FENG TAO-WEI
IPC: E02D3/02
Filed: 2003-01-27
Granted: 2004-11-21
Abstract: This invention is about using disk shearing to increase the density of sands at shallow depths. A disk is statically pressing the ground surface and in the mean time cyclic rotated. This causes the sand particles underneath the plate to rearrange their positions, so as to develop a denser fabric. The conventional method of increasing the density of sands from ground surface is vibratory compaction. However, the vibratory compaction is ineffective in increasing the density of sands at shallow depth. On the other hand, the disk shearing is highly effective in comparison to the vibratory compaction. This is due the difference in principles between them. The disk shearing can be used in civil engineering practice, thus, it is a new, advanced, and industry applicable method.
Patent TW-565473-B (TW)
Title: Cleaning device
Inventor: TAKEMATSU HARUMI
IPC: G02F1/13
Filed: 2003-02-10
Granted: 2003-12-11
Abstract: The present invention is to provide a cleaning device which can absolutely remove a cleaning liquid from a substrate material, so that quality of circuit boards can be higher, and that the cleaning device has excellence in installation cost and the production cost, and is practical application. The cleaning device 1 of the present invention is to clean, through a cleaning liquid E, the substrate material C whose surface is formed with circuits and is treated through a treating liquid D. With respect to the substrate material C that is conveyed in a horizontal direction manner, there are sequentially provided with cleaning nozzles 9 which inject a cleaning liquid E, with reverse nozzles 10 which inject the cleaning liquid E toward upstream, and with air nozzles 11 which inject an air G, in which the cleaning nozzles are respectively arranged in front, rear, left and right sides for injecting water cleaning liquid or other cleaning liquids, the reverse nozzles 10 are relatively arranged in a manner that is opposite to conveying direction, and inject the cleaning liquid E, and the air nozzles 11 are relatively arranged for injecting the air G.
Patent TW-584557-B (TW)
Title: Bio-implant material with an active composite layer containing Ca, P and O and method for producing the same
Inventor: SAY WEN-CHING
IPC: A61F2/30
Filed: 2003-02-25
Granted: 2004-04-21
Abstract: The present invention uses a thermal activation technique to enable Ca, P and O elements to diffuse into the surface layer of a metallic substrate in order to form a bio-implant material with an active composite layer. In the active composite layer of the bio-implant material according to the present invention, P, Ca and O elements are effectively diffused into the oxide film layer on the surface of a metal substrate and into the lattice interstice in the structure of the oxide film layer to form a strong bonding.
Patent TW-594950-B (TW)
Title: Light emitting diode and package scheme and method thereof
Inventor: WANG PAI-HSIANG
IPC: H01L31/0203
Filed: 2003-03-18
Granted: 2004-06-21
Abstract: A package scheme of a light emitting diode includes a substrate structure, a connecting layer, and at least one conduction hole. The substrate structure sequentially includes a conduction board, an insulating layer, and a conductivity layer. The insulating layer is configured to electrically insulate the conduction board and the conductivity layer, and also to insulate a first and a second portions of the conduction boards. The substrate structure has an opening to expose the conduction board. The connecting layer configured to carry and electrically couple to a first electrode of the light emitting diode (LED) is disposed in the opening. The reflecting layer is also configured to electrically couple to the conduction board and to electrically insulate from at least one portion of the conductivity layer, which is coupled to a second electrode of the LED. The conduction hole electrically couples the second portion of the conduction board and the portion of conductivity layer, which is insulated from the connecting layer.
Patent TW-587333-B (TW)
Title: Semiconductor device with reduced parasitic capacitance between impurity diffusion regions
Inventor: ASANO YUJI
IPC: H01L31/06
Filed: 2003-03-18
Granted: 2004-05-11
Abstract: A first layer is formed on an underlying substrate having a surface layer made of semiconductor of a first conductivity type. The first layer is made of semiconductor having a resistance higher than that of the surface layer. A first impurity diffusion region of a second conductivity type is formed in a partial surface region of the first layer. The first impurity diffusion region does not reach the surface of the underlying substrate. A second impurity diffusion region of the first conductivity type is disposed in the first layer and spaced apart from the first impurity diffusion region. The second impurity diffusion region reaches the surface of the underlying substrate. A separation region is disposed between the first and second impurity diffusion regions. The separation region comprises a trench formed in the first layer and dielectric material disposed at least in a partial internal region of the trench.
Patent TW-I293476-B (TW)
Title: Method and apparatus for performing rule-based gate shrink utilizing dipole illumination
Inventor: DUAN-FU STEPHEN HSU
IPC: H01L21/027
Filed: 2003-03-25
Granted: 2008-02-11
Abstract: A method of printing a gate pattern on a substrate comprising the steps of: identifying at least one area in the pattern in which one of the gate features overlays one of the active regions; reducing a width dimension of the one of the gate features at the location which the one of the gate features overlays the one of the active regions; extracting the gates features from the pattern; decomposing the gate features into a vertical component mask and a horizontal component mask; and illuminating the vertical component mask and the horizontal component mask utilizing dipole illumination. <IMAGE>
Patent TW-I257260-B (TW)
Title: Low layer paging indicator processing system and method for multi-layer communication equipment used in a wireless communication system
Inventor: KEARNEY KENNETH P
IPC: H04L29/02
Filed: 2003-03-28
Granted: 2006-06-21
Abstract: A wireless communication system implements wireless communications between a base station and a plurality of user equipments (Ues) including paging of Ues by initially processing paging indicator information. A first embodiment involves a UE's physical layer L1 being configured for interpreting a paging indicator (PI) to activate a preset decoding configuration to process paging data in a pre-specified paging channel (PCH). A second embodiment involves the physical layer control of a next higher level, L2, interpreting the paging indicator and configuring the physical layer L1 to process paging data in a pre-specified PCH.
Patent TW-I222267-B (TW)
Title: Linear micro/nano-meter movement shift type electromagnetic actuator having flexible mechanism
Inventor: WANG YUNG-LIAN
IPC: H02N2/02
Filed: 2003-04-30
Granted: 2004-10-11
Abstract: The present invention is a linear micro/nano-meter movement shift type electromagnetic actuator having flexible mechanism. The flexible mechanism has the advantages of integrated formation, no gap, no friction, no wear-out, reduced element numbers and no assembly error. The flexible mechanism has plural link rods to determine the main body of the flexible mechanism. It also has a wound electromagnetic coil designed with rectangular coil without iron core. The design of coil diameter, length/width/height can reduce the heat generation, so as to reduce the deformation of actuator, and increase the precision of micro/nano-meter movement. By using the above design, a low-cost, high-price micro/nano-meter movement electromagnetic actuator is realized in the present invention.
Patent TW-I221964-B (TW)
Title: Method for controlling the propagation of metadata items
Inventor: SCHILLER HARALD
IPC: G11B20/00
Filed: 2003-05-29
Granted: 2004-10-11
Abstract: The present invention relates to propagation of metadata items to recording media 1, 2 and/or to devices 3, 4 for reading from and/or writing to recording media. It is an object of the invention to propose a method for enabling and controlling automatic propagation of metadata items The method comprises the steps of: providing metadata items with a propagation property, the propagation property defining to which recording media 1, 2 and/or to which devices 3, 4 the metadata items shall propagate, and on which recording media 1, 2 and/or in which devices 3, 4 the metadata items shall be stored, and automatically propagating and storing the metadata items in accordance with the propagation property at least when a recording medium 1, 2 is inserted into or removed from a device 3, 4, or when the device 3, 4 is powered up or down.
Patent TW-I236095-B (TW)
Title: Pattern and method for testing interconnects
Inventor: YAO CHIH-HSIANG
IPC: H01L21/768
Filed: 2003-06-06
Granted: 2005-07-11
Abstract: Pattern and method for testing interconnects are provided. The pattern for testing interconnects including several testing via plugs in a dielectric layer of a wafer. These testing via plugs connect with a metal layer of the wafer, and they surround a tested via plug to define a predictive area. After providing a testing condition to the wafer, then electrical properties of the tested via plug are measured to diagnose if the via plug of the wafer is open.
Patent TW-I327449-B (TW)
Title: Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board
Inventor: MASATOSHI AKAGAWA
IPC: H05K3/46
Filed: 2003-07-02
Granted: 2010-07-11
Abstract: An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23. <IMAGE>
Patent TW-I254010-B (TW)
Title: Lighting apparatus support device of motorcycle
Inventor: SAKAKI HIDEO
IPC: B62K19/40
Filed: 2003-07-22
Granted: 2006-05-01
Abstract: The subject of the present invention is: to provide a lighting apparatus support device of motorcycle, which can substantially and firmly support the tail lamp or the like by a simple structure, wherein the rear fork to support the rear wheel axially is linked to the rear portion of the frame of motorcycle body in a vertically swinging fashion, and the rear fork is hung on the frame of motorcycle body through the rear shock absorber. The solution of the present invention comprises: fixing the base portion of the support bracket (ST) onto the rear portion of the rear fork (FR), extending the support bracket (ST) across the back baffle plate (29) covering the rear wheel (WR), and fixing the lighting apparatus (40) of the tail lamp (38) onto its top (47).
Patent TW-I245308-B (TW)
Title: Non-evaporable getter compositions which can be reactivated at low temperature after exposure to reactive gases at a higher temperature
Inventor: GALLITOGNOTTA ALESSANDRO
IPC: C01B3/00
Filed: 2003-08-27
Granted: 2005-12-11
Abstract: Compositions containing non-evaporable getter alloys are described which, after having lost their functionality in consequence of the exposure to reactive gases at a first temperature, can then be reactivated through a thermal treatment at a second temperature that is lower than the first one.
Patent TW-I239618-B (TW)
Title: Method for mounting a semiconductor package onto PCB
Inventor: LIU PAI-CHOU
IPC: B23K31/02
Filed: 2003-09-19
Granted: 2005-09-11
Abstract: A method for mounting a semiconductor package onto PCB is disclosed. Firstly, a semiconductor package is provided, which comprises a plurality of outer terminals exposed from a molding compound. Then a PCB is provided and has a surface with a plurality of contact pads, a plurality of first pre-solders and a plurality of second pre-solders. The first pre-solders and the second pre-solders partially cover on corresponding contact pads, so that each contact pad has an exposed surface area between the first pre-solder and the second pre-solder. Then the semiconductor package is mounted on the PCB. When the outer terminals connect with the contact pads, the first pre-solders and the second pre-solders flow over toward the exposed surface areas without spreading to short-bridge pre-solder on adjacent contact pad.
Patent TW-I260884-B (TW)
Title: Method for handling a triggered reset when an RLC is stopped in a wireless communications system
Inventor: WU CHI-HSIANG
IPC: H04B7/26
Filed: 2003-09-29
Granted: 2006-08-21
Abstract: A method for handling a triggered reset of a radio link control (RLC) entity in a wireless communications system includes the RLC entity initiating an RLC reset procedure by causing a reset protocol data unit (RESET PDU) to be transmitted and starting a Timer_RST timer, an upper layer stopping the RLC entity prior to the RLC entity receiving a RESET ACK PDU in response to the reset procedure, delaying a triggered reset of the RLC entity caused by expiration of the Timer_RST timer until after the RLC entity has been continued by the upper layer, and the RLC entity processing the triggered reset after the RLC entity is continued by the upper layer.
Patent TW-I220131-B (TW)
Title: Chip structure for injection nozzle
Inventor: LION JIAN-CHIUN
IPC: B41J2/14
Filed: 2003-10-07
Granted: 2004-08-11
Abstract: Disclosed is a chip structure for an injection nozzle, which consists of a fluid structure and a bearing substrate. The fluid structure includes: a liquid spraying chamber, a spraying opening and a heat-resistance member. The heat-resistance member is engaged with the liquid spraying chamber to control the liquid injection from the spraying opening. The bearing substrate is connected with the fluid structure. The bearing substrate is thinned in order to form concave grooves serving as a heat-insulation chamber, the heat-insulation chamber corresponding to the heat-resistance member with respect to the bearing substrate, so as to reduce the dissipation of heat energy through the substrate, to reduce driving voltage power and then to enhance operation frequency and printing speed.