baber/WOPTO huggingface dataset:
Patent TW-411595-B (TW)
Title: Heat structure for semiconductor package device
Inventor: LAI JENG-YUAN
IPC: H01L23/433
Filed: 1999-03-20
Granted: 2000-11-11
Abstract: A heat structure used for semiconductor package device is provided. The heat structure includes a heat sink having a first surface and a second surface. The first surface of the heat sink is exposed outside the package body of the semiconductor package device. The heat sink includes a padding plate having an upper surface and a bottom surface, wherein the upper surface of the padding plate connects the second surface of the heat sink. The padding plate is made of heat conducting material, and the expansion coefficients of the heat conducting material and the wafer of the semiconductor package device are about the same. The bottom surface of the padding plate adheres to the wafer surface of the semiconductor package device by an elastic glue layer, so that the heat generated by the semiconductor wafer can be transferred to the heat sink, and be diffused to the atmosphere. The padding plate acts as a buffer material between the semiconductor wafer and the heat sink during the process of increasing and reducing temperature, since the expansion coefficients of the padding plate and the semiconductor wafer are about the same. Thus, the thermal stress of the heat sink connecting the padding plate generated during cooling and shrinking will not directly perform on the semiconductor wafer so that wafer damage can be avoided.
Patent TW-423129-B (TW)
Title: Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
Inventor: LEIGHTON LARRY C
IPC: H01L23/40
Filed: 1999-04-01
Granted: 2001-02-21
Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The leads are electrically coupled with the conductive areas by respective tie-down screws fastened through dielectric isolating washers. The screws are tightened sufficiently against the isolating washers so as to press the respective package leads into solid electrical contact with the conductive areas. Portions of the respective leads and conductive areas surrounding the tie-down screws are cut-away to prevent electrical contact, in order to avoid shorting the leads and/or conductive areas to the heat sink via the tie-down screws. Alternately, respective ends of a retaining spring used to secure the IC package to the heat sink mounting flange are also secured by the package lead tie-down screws, such that the screws both secure the package against the heat sink and press the package leads into solid electrical contact with the respective conductive areas.
Patent TW-518320-B (TW)
Title: Preparation of mixtures of 1,4-butanediol, tetrahydrofuran and γ-butyrolactone
Inventor: FISCHER ROLF
IPC: C07B61/00
Filed: 1999-04-22
Granted: 2003-01-21
Abstract: In a process for preparing 1,4-butanediol, tetrahydrofuran and γ-butyrolactone by oxidation of butane to give a product stream comprising maleic anhydride, absorption of maleic anhydride from the product stream using a high-boiling alcohol to give a liquid absorption product comprising monoesters and diesters of maleic acid and also high-boiling alcohol, after-esterification of the liquid absorption product and subsequent hydrogenation of the after-esterified product in the liquid phase, the high-boiling alcohol is a polyhydric alcohol having a boiling point at atmospheric pressure of above 233 DEG C and the after-esterified product has an acid number of less than 30 mg KOH/g and a water content of less than 1% by weight.
Patent TW-490454-B (TW)
Title: Triaminopentaacetic acid compound and paramagnetic metal complex prepared from using the compound as ligand
Inventor: WANG YUN-MING
IPC: C07C229/16
Filed: 1999-04-23
Granted: 2002-06-11
Abstract: The present invention synthesizes a series of organic ligands and contrast agents for magnetic resonance imaging (MRI) by forming metal complexes with paramagnetic metal ions. This type of organic ligand is prepared by using a different branched triamine compound as an initiator to react with a tertiarybutyl bromoacetic acid, followed by an acidifying reaction and a purification by an anionic exchange resin to obtain different branched secondary methyl triaminopentaacetic acid compound, which can further react with a gadolinium metal ion to form a metal complex thereof. After studies on physical and chemical properties and animal tests, the results indicate that this type of paramagnetic metal complex can be used as a good contrast agent for magnetic resonance imaging (MRI).
Patent TW-450954-B (TW)
Title: Phenylsulfonamide-phenylethylamines useful as dopamine receptors
Inventor: ROMERO ARTHUR GLENN
IPC: A61P25/16
Filed: 1999-04-26
Granted: 2001-08-21
Abstract: Compounds of formula I and their pharmaceutically acceptable salts having selective dopamine D3 receptor activity suitable for treating central nervous system disorders. Formula I, R1 is independently H or a C1-C8 alkyl including isomeric forms thereof; R2 is H, C1-C3 alkyl, a halogen, OCH3, OCF3, CF3, CN, SCH3 or NHCOCH3; and R3 is H, C1-C3 alkyl, a halogen, OCH3, OCF3, CF3, SCH3 or NHCOCH3.
Patent TW-454344-B (TW)
Title: A split gate flash memory cell with self-aligned process
Inventor: LEU LEN-YI
IPC: H01L27/115
Filed: 1999-05-12
Granted: 2001-09-11
Abstract: A method for fabricating split-gate flash memory cells is disclosed. In this method, the field oxide is formed after the formation of the poly-1 stripes, which eventually become the floating gates, by oxide growth, thus, the misalignment problems often encountered in the prior art processes between the floating gates and the filed oxide layers are eliminated or at least minimized. The method also includes the step of forming a dummy CVD dielectric sidewall spacer with a predetermined thickness before the formation of the poly-2 layer, which eventually become the control gates; this greatly eliminates or at least minimizes the disparity in the peripheral control gate lengths between mirror (adjacent) cells. Both of these improvements can significantly contribute to the reduction of cell size without involving expensive upgrades in processing equipment.
Patent TW-412891-B (TW)
Title: Reliable modular production quality narrow-band high rep rate F2 laser
Inventor: HOFMANN THOMAS
IPC: H01S3/101
Filed: 1999-06-11
Granted: 2000-11-21
Abstract: The present invention provides a reliable modular production quality excimner laser capable of producing 10 mJ laser pulses in the range of 1000 Hz to 2000 Hz or greater. Replaceable modules include a laser chamber; a pulse power system comprised of tree modules; an optical resonator comprised of a line narrowing module and an output coupler module a wavemeter module,an electrical control module, a cooling water module and a gas control module. Important improvements have been provided in the pulse power Unit to produce taster rise time and improved pulse energy control These improvements include an increased capacity high voltage power supply with a voltage bleed-down circuit for precise voltage trimming, an improved commutation module that generates a high voltage pulse form the capacitors charged by the high voltage power supply and amplifies the pulse voltage 23 times with a very fast voltage transformer having a secondary winding consisting of a single four-segment stainless steel rod. A novel design for the compression head saturable inductor greatly reduces the quantity of transformer oil required and virtually eliminates the possibility of oil leakage which in The past has posed a hazard.
Patent TW-436507-B (TW)
Title: Thermoplastic resin composition, process for producing the same, and biaxially oriented film comprising the composition
Inventor: KUDO TAKAFUMI
IPC: C08K9/06
Filed: 1999-06-25
Granted: 2001-05-28
Abstract: A thermoplastic resin composition containing inorganic particles, in which (i) the inorganic particles have a pore volume of 0.1 to 3 ml/g and (ii) the surface of the inorganic particles are treated at the surfaces with a hydrophilic polyester of 0.05 to 10 times to the weight of the inorganic particles or with a silicon-containing organic compound. This composition can be obtained by feeding a dispersion of the abovementioned surface-treated inorganic particles into a vented double-axes knead-and-extrudsion machine to mix it with a thermoplastic resin.
Patent TW-469709-B (TW)
Title: Method and apparatus for transmitting and receiving high speed data using code division multiple access channels
Inventor: TIEDEMANN EDWARD G JR
IPC: H04B1/707
Filed: 2000-07-25
Granted: 2001-12-21
Abstract: The present invention describes a spread spectrum communication system wherein the frequency of carriers and the code channels of the carriers or both for transmission to a given remote station user vary in time. This provides for a direct sequence spectrum communications system which changes frequency or code channel according to a predetermined pattern. The code channels and frequencies can be determined in accordance with a deterministic function or based upon a subset of the data to be transmitted. A receiver structure is also described for receiving the same.
Patent TW-393294-B (TW)
Title: Detachable grip for a fishing and fishing rod with same
Inventor: IWABUCHI MASAKAZU
IPC: A01K87/08
Filed: 1999-08-13
Granted: 2000-06-11
Abstract: A removable grip for a fishing rod may be attached and removed from the fishing rod. The removable grip includes a cylindrical main body that is formed by a pair of semi-cylindrical half shells that when joined together define the cylindrical main body of the grip. The two half shells are each formed with an elongated recess that together define a central bore of the main body for receiving a portion of the fishing rod. The central bore is lined with an anti-skid material that engages the fishing rod such that the grip and the rod are not likely to move with respect to one another. The half shells are secured to one another by any of a variety of securing means, such as Velcro<TM> strap members, elastic cap members that are fixed to opposite ends of the mail body, wedge members that fit into recesses formed in each half shell, or a strap that wraps around the outer circumference of the main body.
Patent TW-452774-B (TW)
Title: Disk chucking mechanism
Inventor: SAKAGUCHI TAKAHIRO
IPC: G11B17/028
Filed: 1999-09-16
Granted: 2001-09-01
Abstract: A disk chucking mechanism for selectively chucking floppy disks onto a turntable has a strong neodym first magnet provided on an inner periphery of the turntable so as to attract a first hub and a second hub, and a weaker ferrite second magnet positioned low on an outer periphery of the turntable opposite a projection formed on the second hub and attracting only this second hub. By using these two magnets a satisfactory clamping of the floppy disks to the turntable can be achieved even when both lower grade (ordinary) and upper grade (high-density) floppy disks are loaded and driven.
Patent TW-419765-B (TW)
Title: Manufacturing method of flip chip solder bumps
Inventor: TSAI MING-HSING
IPC: H01L21/60
Filed: 1999-09-30
Granted: 2001-01-21
Abstract: The present invention provides a manufacturing method of flip chip solder bumps, comprising: first form an insulating passivation layer on the surface of the chip which has an opening to expose the above mentioned metal lead, then form a bottom metal bump and one seed crystal layer sequentially on the surface of the above mentioned insulating passivation layer. Then, remove the seed crystal layer other than the above mentioned opening region until the surface of the above mentioned bottom metal bump is exposed and leave a seed crystal pad on the above mentioned opening. And then use ECD method to grow a solder bump along the above mentioned seed crystal pad. Based on the manufacturing method of the present invention, the well-known problem of difficult to form the photoresist pattern can be resolved, and the performance and the productivity of the product can be increased.
Patent TW-452877-B (TW)
Title: Semiconductor device and manufacture thereof
Inventor: HOMMA YOSHIO
IPC: H01L21/50
Filed: 1999-10-04
Granted: 2001-09-01
Abstract: The objective of the present invention is to suppress dishing on a copper alloy layer, etc., caused by polishing, by formation of an embedded wiring of copper alloy in the groove of an insulating film. When an upper-layer metal layer 13 as a wiring layer, and a underneath metal layer 12 as a barrier layer are polished, the polishing speed of the underneath metal layer is at least 5 times faster than its etching speed, while that of an insulating layer is significantly slower than that of the underneath metal layer. Thus, a damascene wiring, wherein the erosion of the insulating layer and dishing of the metal layer are significantly reduced, is formed.
Patent TW-500955-B (TW)
Title: Liquid crystal display device
Inventor: TSUJITA YOSHIYUKI
IPC: G09F9/00
Filed: 1999-11-18
Granted: 2002-09-01
Abstract: A liquid crystal display device capable of avoiding the occurrence of an electrical short circuit between adjacent bumps of a driver IC. In the liquid crystal display device on which a driver IC is mounted with an anisotropic conductive film interposed therebetween, the space width between one of the bumps of the driver IC and another bump to which the one of the bumps is adjacent becomes larger toward the central side of the driver IC.
Patent TW-434639-B (TW)
Title: Electric lamp
Inventor: HELBIG PETER
IPC: F21Y101/00
Filed: 1999-11-29
Granted: 2001-05-16
Abstract: The invention relates to an electric lamp, provided with a metal-plastic cap, for a motor vehicle headlight, which has a pressing-on spring (100) which is arranged laterally on the lamp cap and serves to mount the lamp in the reflector opening, constructed as lamp holder, of the headlight. The lamp cap has a metal holder part for the lamp bulb, a metal annular carrier sleeve (14b) connected thereto, and a plastic cap part (15) in which the carrier sleeve (14b) is anchored. According to the invention, the annular carrier sleeve (14b) has two inwardly angled lugs (14d) between which the pressing-on spring (100) is arranged with a clamping fit, and which are crossed with the ends (104a) of the pressing-on spring (100).
Patent TW-457156-B (TW)
Title: Automatic exchange system of electrode tubes storage for a fine-hole electric discharge machine
Inventor: LIN DUNG-HAN
IPC: B23H1/00
Filed: 1999-11-26
Granted: 2001-10-01
Abstract: An automatic exchange system of electrode tubes storage for fine-hole electric discharge machine consists of an exchange method of electrode tubes, electrode frames, a measurement device of an electrode length, an electrode tubes guiding disk, and a device of electrode tubes storage. The exchange method of electrode tubes includes clamping the electrode tubes and storing at the electrode frames by the movement of x, y, and z axes of the fine-hole electric discharge machine and by the rotation or reversal of the fixed axis of the clamping head with some suitable electrode frames, in which a flexible member and a depositing member and a restricting member of the clamping head are set up; the electrode frames are placed at or deliver to a location that can be approached by the movement of x, y, and z axes of the device of electrode tubes storage; loading and unloading the clamping head and taking out and back the electrode tubes by the rotation or reversal of the fixed axis of the clamping head. The method and device of measurement of the electrode length is to sense and to measure the length when the electrode tube is taken out or back by a sensor and signal processing with a microprocessor. The guiding disk of electrode tubes set under the bottom of z-axis with some suitable electrode rings of different specifications rotates and makes the electrode ring of the suitable electrode tube face to the central axis of the clamping head.
Patent TW-498087-B (TW)
Title: Process for the preparation of highly-branched polyols based on glycidol
Inventor: SUNDER ALEXANDER
IPC: C08G18/48
Filed: 1999-12-20
Granted: 2002-08-11
Abstract: The invention relates to a process for the preparation of highly-branched polyols by polymerization of glycidol in the presence of a hydrogen-active starter compound with basic catalysis, wherein glycidol is added in dilute solution and the solvent used for the dilution is continuously distilled off. The polyols thus prepared are colourless, contain as the core unit solyly the starter compound used and have polydispersities of less than 1.7.
Patent TW-434684-B (TW)
Title: Planarization method for semiconductor device
Inventor: LEE TAE-YOUNG
IPC: H01L21/316
Filed: 1999-12-28
Granted: 2001-05-16
Abstract: This invention discloses a planarization method for semiconductor device. The planarization method includes the steps of: providing a semiconductor substrate in which metal patterns are formed with various pattern densities; depositing a porous oxide layer over the semiconductor substrate so as to cover the metal patterns; plasma-treating surface of the porous oxide layer; and polishing the plasma-treated porous oxide layer by chemical mechanical polishing.
Patent TW-439160-B (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: KUWABARA OSAMU
IPC: H01L21/56
Filed: 2000-02-01
Granted: 2001-06-07
Abstract: A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The semiconductor device is mounted to another circuit substrate via the bump electrodes. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on the lower surface of the base film, on the bump electrodes, followed by allowing the bump electrodes to project through the sealing film under pressure and heat. The thickness of the sealing film is smaller than the height of the bump electrode, and thus the bump electrode projects through the sealing film. The stress derived from the difference in thermal expansion coefficient between the semiconductor substrate and the circuit substrate is absorbed by the projecting portion of the bump electrode. In forming the sealing film, particles for lowering the thermal expansion coefficient are dispersed in the sealing film to allow the sealing layers to exhibit a thermal expansion coefficient differing in its thickness direction such that the thermal expansion coefficient in the layer which is close to the semiconductor substrate is close to that of the semiconductor substrate so as to absorb the stress derived from the difference in thermal expansion coefficient between the semiconductor substrate and the sealing film. By absorbing the stress derived from the difference in thermal expansion coefficient between the semiconductor substrate and the circuit substrate and between the semiconductor substrate and the sealing film, a defective connection can be prevented so as to improve the reliability.
Patent TW-516072-B (TW)
Title: Interface apparatus, method for processing wafers in a semiconductor fabrication environment, method for seating wafers in a container, robotic arm, and method for manufacturing integrated circuits, interface apparatus control unit
Inventor: LEWIS PAUL E
IPC: H01L21/677
Filed: 2000-02-15
Granted: 2003-01-01
Abstract: A method and apparatus for automated interfacing with a processing tool in a manufacturing environment having a tilt mechanism and a rotation mechanism. In one embodiment, semiconductor wafers in a cassette are presented to a processing tool by tilting the cassette during movement towards the tool. The tilt mechanism provides a means for seating the wafers in the cassette. The rotation mechanism allows the cassette to be adjusted to meet a robotic arm which extracts wafers from the cassette. Where the cassette is part of a standard mechanical interface (SMIF) system, the pod is placed onto the interface apparatus, where the pod cover is removed to allow processing of the wafers. A bellows is provided to cover the exposed cassette, thus creating an extended mini-environment including the interface apparatus, tool, and pod cover. In one embodiment, the interface apparatus includes robotic arms and a lift mechanism. Operation of the lift mechanism to open a container effects the positioning of the robotic arms to transfer the container to the tool. In one embodiment, semiconductor wafers in a cassette are ionized as the robotic arms position to grip the cassette. A gripping mechanism is adapted to grip a variety of containers in a variety of positions. A base receiver accepts containers in a first and a second orientation. A main controller provides control to a plurality of motors and functional blocks within the interface apparatus.
Patent TW-442420-B (TW)
Title: Speed change pedal attaching structure of motor scooter type vehicle
Inventor: YAGISAWA KATSUICHI
IPC: B62K23/08
Filed: 2000-02-25
Granted: 2001-06-23
Abstract: To provide a speed change pedal attaching structure of a motor- scooter type vehicle in which the operation of the speed change pedal is transmitted to a change lever accurately and the attaching work of the speed change pedal is easy. A speed change pedal attaching structure of motor-scooter type vehicle is a motor-scooter type vehicle having a low-floor type floor on which an internal combustion engine is arranged. A speed change gear is stored in an engine case 25b with the internal combustion engine. A stay 92 is established in the engine case 25b in this device. A speed change pedal 95 pivoted on the stay 92 possible to swing freely is arranged at required upper position on the floor 36. Speed change operation parts 96, 97 of the speed change gear are connected to the speed change pedal 95 through a link member 98.
Patent TW-462165-B (TW)
Title: Entertainment system, data, communication network system, entertainment apparatus, and portable information
Inventor: CHATANI MASAYUKI
IPC: A63F13/73
Filed: 2000-04-13
Granted: 2001-11-01
Abstract: A database communication network system has an entertainment system (12) comprising an entertainment apparatus (102) to which a portable information communication terminal (32) is detachably connected. An individual identification code (individual PDA ID) of the portable information communication terminal (32) and a service request are transmitted from the entertainment system (12) via a bidirectional communication network (16) to a computer system (20) having a server function. The computer system (20) transmits a command representing the individual PDA ID and the service request via a link (22) in the form of a LAN to a computer system (24) having a database. The computer system (24) searches a database to extract information corresponding to a service request, and transmits (broadcasts) the extracted information together with the individual PDA ID via a wireless unidirectional communication network (28) and a link (30) to the portable information communication terminal (32). Only the portable information communication terminal (32) with the individual PDA ID is capable of reproducing the received data.
Patent TW-590997-B (TW)
Title: Process and composition for the production of hydrophobic layers on fluoride layers
Inventor: ANTHES UWE
IPC: G02B1/10
Filed: 2000-05-10
Granted: 2004-06-11
Abstract: Process for the production of hydrophobic layers on optical substrates which have an alkaline earth metal fluoride or alkali metal fluoride layer as the outermost layer or consist of alkaline earth metal fluorides or alkali metal fluorides, by thermal vapour deposition with polyfluorohydrocarbons in a high vacuum.