baber/WOPTO huggingface dataset:
Patent TW-454323-B (TW)
Title: Image sensor package structure and substrate thereof
Inventor: LIN UINCENT
IPC: H01J5/02
Filed: 2000-08-10
Granted: 2001-09-11
Abstract: An image sensor package structure is disclosed, which mainly comprises a mainbody and an image sensor chip and is directly disposed on the surface of the chip loading member formed integrally with the mainbody through an adhesive layer. The image sensor chip electrically connects to a lead frame formed integrally with the mainbody. The mainbody has a wall erected on the periphery of the image sensor chip, the height of the wall is larger than the height of the image sensor chip. An optically transparent lid seals the top of the wall of mainbody. The image sensor chip can contact the object to be detected by optical principles.
Patent TW-472157-B (TW)
Title: Automatic focusing method and device
Inventor: HUANG JR-WEN
IPC: G02B26/10
Filed: 2000-08-29
Granted: 2002-01-11
Abstract: The present invention is an automatic focusing method and device to be used inside a scanner, wherein two sets of transmission motors and transmission devices are used to pull two movable platforms. The two platforms are loaded with a first lens set and a second lens set respectively, and the first lens set and the second lens set are driven by a motor, so as to adjust the distance between the first lens set and the second lens set, which not only has the function of automatic and accurate focusing, but also can simplify the focusing mechanism inside the scanner.
Patent TW-499664-B (TW)
Title: Drive circuit of liquid crystal display panel and liquid crystal display
Inventor: SU FENG-JENG
IPC: G09G3/20
Filed: 2000-10-31
Granted: 2002-08-21
Abstract: A kind of drive circuit for liquid crystal display (LCD) panel includes gate driver for sending scan signal, data driver for sending video signal, a switching circuit and a temperature sensor. The temperature sensor detects the operation temperature of LCD panel so as to determine whether it is over the switching temperature or not and generate a selection signal. The switching circuit selects either 1-line dot inversion control signal or 2-line dot inversion control signal according to the selection signal and outputs the polarity control signal of data driver so as to control the polarity selection way of its output video signal.
Patent TW-525337-B (TW)
Title: Method to start a switching power-supply and said switching power-supply with a starting-circuit
Inventor: FELDTKELLER MARTIN
IPC: H02M3/335
Filed: 2001-01-30
Granted: 2003-03-21
Abstract: In order to energy-savingly start a switching power-supply, the energy that is stored by means of the so-called Y-capacitors (C2, C4) is transmitted through the diode (D2) to a capacitor (C1) located at the 2nd side. If the voltage on the capacitor (C1) arrives at a 1st pre-determined smallest-value, the voltage is applied as a supply-voltage to an impulse-generator (PS), which turns on the switching power-supply. If the voltage on the other capacitor (C6) located at the 2nd side arrives at a 2nd pre-determined smallest-value, the voltage on the capacitor (C1) is applied as a supply-voltage to a control-unit, preferably a micro-processor (μp), which controls the impulse-generator (PS).
Patent TW-540041-B (TW)
Title: Decoding system for disk and the method thereof
Inventor: SHIE JIA-HUNG
IPC: G11B7/00
Filed: 2001-02-02
Granted: 2003-07-01
Abstract: The present invention provides a decoding system for disk and the method thereof, which is used to receive the message data on the disk and execute the decoding operation. The present invention only needs to slightly change the structure of the decoding system to reduce the accessing number to the data buffer by each module in the decoding system without having to increase the clock of the decoding system and the width of the bus. Thus, the present invention can increase the parallel processing capability of the decoding system, so as to increase the speed of the decoding system, and further achieve the effect of high-speed compact disk.
Patent TW-550146-B (TW)
Title: Structure for nose section of nailing machine
Inventor: YAMAMOTO HIRONORI
IPC: B25C1/00
Filed: 2001-03-30
Granted: 2003-09-01
Abstract: The objective of this invention is to provide a structure of a nose section 2 of a nailing machine capable of always keeping normal attitudes of a top nail 5a supplied to the nose section 2 regardless of the shape of a connection band 6 at an impact time. The solution of the present invention is that in nose section 2 of the nailing machine that is disposed at the tip of a nailing machine body 1 and used for hitting out the top nail 5a of connected nails 7 supplied from a magazine 3, the front wall inside the nose section 2 is provided with an upper groove 8a for guiding the heads of the top nail 5a, an intermediate groove 8b for preventing the top nail 5a from interfering with the connection band 6, and a lower groove 8c for guiding the lower tip of the top nail 5a. Opening widths of the grooves are the same, and the intermediate groove 8b is deeper than the upper groove 8a and the lower groove 8c.
Patent TW-593968-B (TW)
Title: Knife-stab-resistant ballistic article
Inventor: CHIOU MINSHON J
IPC: A41D31/00
Filed: 2001-05-25
Granted: 2004-06-21
Abstract: A combination of layered structures is disclosed for protection from both knife stab and ballistic threats wherein the outer face is the knife stab strike face and includes layers of loosely woven fabrics and the inner face includes ballistic layers.
Patent TW-502373-B (TW)
Title: Semiconductor device, designing method and designing device thereof
Inventor: ITOH NIICHI
IPC: H01L23/544
Filed: 2001-07-17
Granted: 2002-09-11
Abstract: A semiconductor device is provided with dummy patterns at an originally thinner portion of each of layers, and each of these dummy patterns is electrically connected to a reference wire that is either a power-supply wire or a ground wire.
Patent TW-521439-B (TW)
Title: Method for making a thin film structure
Inventor: OKUMURA MIKA
IPC: H01L21/768
Filed: 2001-08-02
Granted: 2003-02-21
Abstract: This invention provide a method for manufacturing a thin-film structure which enables removal of a sacrificial film without removing the other insulating films. Two etching steps are adopted for the sacrificial film (51) to form an anchor hole (52) which opens in the surface of a wiring (45). In the first etching step, with the sacrificial film (51) left, the sacrificial film (51) is partially removed by anisotropic etching above the wiring (45). In the second etching step, the left sacrificial film (51) is removed by isotropic wet etching above the wiring (45).
Patent TW-541501-B (TW)
Title: Pc adapter cards and method of manufacturing the same
Inventor: SANEMITSU YOSHIKADO
IPC: B42D15/10
Filed: 2001-08-06
Granted: 2003-07-11
Abstract: A method of manufacturing a mini-card with a semiconductor memory device includes the steps of (a) providing an array of substrates including a plurality of individual substrates; (b) mounting a semiconductor memory device on each of the individual substrates forming the substrate array; (c) covering the individual substrates with respective cases; and (d) dividing the substrate array to provide encased individual substrates each completing a mini-card having the semiconductor memory device embedded therein.
Patent TW-550769-B (TW)
Title: Wafer level package and its manufacturing method
Inventor: LAI SZ-YU
IPC: H01L21/56
Filed: 2001-12-21
Granted: 2003-09-01
Abstract: This invention relates to a wafer level package and its manufacturing method. Especially, a kind of package can overcome variables resulted from CTE mismatch between the substrate and the die. After completing the last metal layer, an elastomer is coated or plated on the surface of the pad metal layer functioning as contact, in which the elastomer can be made from a conductive material or non-conductive material, a thin conductor is disposed on the top surface of the elastomer and a conductor connecting to the substrate is formed on the top surface of the thin conductor. Therefore, the amount of deformation between the substrate and the die can be overcome. Meanwhile, high transmission speed, high density connection and low coat benefit can be achieved and also production yield is improved.
Patent TW-559661-B (TW)
Title: Chemical or biological attack detection and mitigation system
Inventor: KREICHAUF RUTH D
IPC: G08B21/12
Filed: 2001-12-21
Granted: 2003-11-01
Abstract: Systems and methods for monitoring buildings to detect harmful chemical or biological agents. Self-propelled harmful agent detectors (100) are provided that can propel themselves using motors (118) and self-contained power sources (120). On-board harmful agent sensors (104) can detect the presence of harmful agents and transmit information (114) for reception by a receiving unit (306). Some sensors can identify the type of agent and transmit the agent type. Some detectors can measure the intensity or concentration of the harmful agent presence and transmit that intensity. Some systems include locating devices for determining positions of the roaming detectors (100), as well as mapping software to map the location of the individual moving detectors (100). Systems may include software for plotting the relative concentrations of agents detected to locate the origination of the source within the building. The moving detectors (100) can have motors (118) coupled to wheels (116), tracks (139), capstans (182), pulleys (226) and winches to move the devices (100, 130, 160, 180, 200, 220, 240) along floors, air ducts, and suspended or hanging wires (181, 232, 234).
Patent TW-527712-B (TW)
Title: Thin film transistor with vertical structure
Inventor: DAI YUAN-DUNG
IPC: H01L27/00
Filed: 2002-01-11
Granted: 2003-04-11
Abstract: This invention provides a method for fabricating a thin film transistor with a vertical lightly-doped drain structure, which comprises: forming a buffer layer on an insulative transparent substrate, forming a polysilicon layer containing source/drain regions on the buffer layer, forming an insulative layer on the polysilicon layer, forming a gate electrode on the insulative layer, forming an interlayer dielectric layer on the above-mentioned gate electrode, buffer layer and polysilicon layer, forming a via hole penetrating the above-mentioned interlayer dielectric layer to expose a portion of the source/drain region, forming an intrinsic silicon layer on the sidewall and bottom of the via hole; forming a heavily-doped silicon layer on the surface of the undoped silicon layer and covering the heavily-doped silicon layer with a metal layer.
Patent TW-I270157-B (TW)
Title: Measurement arrangement
Inventor: ABRAHAM MICHAEL
IPC: H01L21/677
Filed: 2002-01-18
Granted: 2007-01-01
Abstract: A measurement device (1), i.e. a metrology tool, and a vehicle (2) are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit (3), for, e.g., FOUPs in semiconductor manufacturing, an electronic control system (5) with, e.g., a PC, monitor and keyboard and optionally a vacuum pump (9) is also provided in module frames of the vehicle (2). The measurement arrangement particularly reduces bottleneck situations in equipment qualifying of processing tools (40) during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool (40). With the possible exception of power supply or operator control, the measurement arrangement can operate fully autonomous.
Patent TW-578172-B (TW)
Title: System comprising a transformer, printed circuit board, charger device, user device, and electronic apparatus
Inventor: PEELS WILHELMUS GERARDUS MARIA
IPC: H05K3/46
Filed: 2002-02-22
Granted: 2004-03-01
Abstract: A printed circuit board (10) including a layered transformer (1) has a stack of layers of a first magnetic layer (2), a first transformer coil (4), an insulating body (7), a second transformer coil (5) and a second magnetic layer (3), wherein each of the transformer coils (4, 5) is embodied as a two-dimensional pattern of conductive tracks. The insulating body may comprise one of more channels (8, 18, 28) containing a magnetic material. Instead of one printed circuit board (10), the transformer (1) may be embodied in two printed circuit boards (60) as well, each comprising a magnetic layer (2) and a transformer coil (4). Said printed circuit boards may be included in a charger device (71) and a user device (72).
Patent TW-I292922-B (TW)
Inventor: TOYODA HIROSHI
IPC: H01L21/28
Filed: 2002-03-01
Granted: 2008-01-21
Abstract: A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.
Patent TW-I237925-B (TW)
Title: High-frequency semiconductor device
Inventor: AOKI YOSHIO
IPC: H01Q9/04
Filed: 2002-03-14
Granted: 2005-08-11
Abstract: A structure for eliminating the influence of an antenna line connected to the patch electrode on the antenna characteristics of a patch antenna built in an MMIC is disclosed. A through-hole is formed in the antenna ground plane which is provided under the patch electrode with an interlayer insulation film therebetween, the antenna line is provided in the side opposite to the patch electrode with respect to the antenna ground plane, and the patch electrode and antenna line are connected to each other with a conductor passing through the trough-hole.
Patent TW-567594-B (TW)
Title: Method of packaging microchip devices, the interposer used therefor and the microchip device packaged thereby
Inventor: WANG CHUEN KHIANG
IPC: H01L23/48
Filed: 2002-04-09
Granted: 2003-12-21
Abstract: A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer (7) is placed on microchip devices (1). The interposer (7) comprises an aperture (11) which extends from the interposer surface where external electrical contacts (9) are located to the surface of the microchip devices (1). Electrical contacts (3) on the microchip device surface are accessible through the aperture (11) in order to electrically connect the electrical contacts (3) with the external electrical contacts (9) of the interposer (7). The interposer (7) comprises separate openings or aperture regions, in particular separated by a bridge (19), which extend from the interposer surface where the external contacts (9) are located into the interposer (7). This facilitates the handling of the finalised package and allows for satisfactory filling of the aperture (11) with filling material.
Patent TW-541633-B (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: IZUMITANI JUNKO
IPC: H01L23/485
Filed: 2002-04-25
Granted: 2003-07-11
Abstract: A semiconductor device and its manufacturing method are obtained in which, in a semiconductor device having a multilayer interconnection structure using copper interconnections, a bonding wire can be bonded to a bonding pad with enhanced connecting reliability and stability. Third-layer interconnections (17) and a bonding pad (71), both made of an aluminum alloy, are formed partially on a second interlayer insulating film (14). An opening (74) whose bottom is defined by the bonding pad (71) is partially formed in a third interlayer insulating film (63), a fourth interlayer insulating film (67), a protective insulating film (72), and a buffer coat film (73). A bonding wire (75) is inserted in the opening (74) and bonded to the bonding pad (71).
Patent TW-I281131-B (TW)
Title: Dual status magnetic field EAS device
Inventor: BELKA ANTHONY MICHAEL
IPC: G08B13/24
Filed: 2002-04-30
Granted: 2007-05-11
Abstract: A device is disclosed for activating and deactivating magnetic electronic article surveillance (EAS) markers. In one embodiment, the device includes control circuitry comprising a coil, such as a solenoid-type coil, that provides a magnetic field in one direction and another coil that provides a magnetic field in a substantially perpendicular direction, so that EAS markers that pass through the device are positioned generally in the plane defined by the first and second directions.
Patent TW-526687-B (TW)
Title: Printed circuit board carrier
Inventor: TAN LE-NEIN
IPC: H05K13/00
Filed: 2002-05-09
Granted: 2003-04-01
Abstract: A printed circuit board carrier for carrying a plurality of printed circuit boards comprises a main frame, a plurality of supporting members, a slidable rod, and a fixed rod. The main frame is a substantial rectangle in shape and has a plurality of notches and two slots on the opposite sides thereof. The supporting members can be fit in the plurality of notches. The slidable rod is slidable within the slots for abut against one end of the printed circuit board. The fixed rod abuts against the other end of the printed circuit board.
Patent TW-591278-B (TW)
Title: Fringe field switching liquid crystal display device and method for manufacturing the same
Inventor: NOH JEONG-DONG
IPC: G02F1/1362
Filed: 2002-05-24
Granted: 2004-06-11
Abstract: The present invention comprises an upper substrate; a data bus line and a storage capacitance bus line on a lower substrate; a gate bus line at the position of bisecting the unit pixel; a thin film transistor on the gate bus line; a counter electrode; and a pixel electrode. The pixel electrode comprises a frame shaped body unit formed on the edge in counter electrode and a plurality of slant slits arranged with a regular distance to divide the body unit into several parts, forming a predetermined angle with the gate bus line. The angle of slant slits in he pixel electrode is symmetric with respect to the gate bus line. The storage capacitance bus line is partially overlapped with both the upper edge of pixel electrode in one unit pixel and the lower edge of pixel electrode in the closest unit pixel. According to the present invention, the black matrix area is reduced by eliminating or minimizing the light leakage through modifying the pixel structure, thereby improving the aperture ration and transmittance.
Patent TW-I260317-B (TW)
Title: Purification method of cyclohexanone-oxime
Inventor: FUKAO MASAMI
IPC: C07C251/44
Filed: 2002-06-25
Granted: 2006-08-21
Abstract: The invention relates to a purification method of cyclo-hexanone-oxime in a solution of solvents immiscible with water, which consists in washing said solutions with water or with an aqueous solution of a base having a pK < 5 or in passing the solutions of cyclohexanone-oxime through a weakly alkaline ion exchange resin and, optionally, also through a weakly acid ion exchange resin.
Patent TW-I239737-B (TW)
Title: Non-server type voice packet communication method and device
Inventor: WU WEI-EN
IPC: H04L29/02
Filed: 2002-06-28
Granted: 2005-09-11
Abstract: A non-server type voice packet communication method, including an IP address-inquiring step, an IP address analyzing-step, an IP address-receiving step, and a voice packet-transmitting step. According to the method, the IP address-inquiring step firstly transmits an IP address-inquiring signal to a non-server type voice packet communication device through a PSTN. Then, the IP address-analyzing step determines weather an IP address data transmitted from the non-server type voice packet communication device using digital modulation signal or not. When the non-server type voice packet communication device using digital modulation signal, the IP address-receiving step receives the IP address data. Finally, the voice packet-transmitting step transmits voice packets to the non-server type voice packet communication device according to the IP address data through digital network. This invention also discloses a non-server type voice packet communication device for carrying out the mentioned method.
Patent TW-I227266-B (TW)
Title: Hydrogenated substance of copolymer, method for producing the same and hot-melt adhesive composition using the same
Inventor: MINE TOSHIHIRO
IPC: C08F8/04
Filed: 2002-07-01
Granted: 2005-02-01
Abstract: This invention provides a hydrogenated substance of a copolymer having a softening point within the range of 45-55 DEG C measured by a ball and ring method, a hydrogenated substance of the copolymer having 85-95 DEG C softening point measured by the ball and ring method and a hot-melt adhesive composition comprises the hydrogenated substances of the copolymer. The invented hydrogenated substance of the copolymer has a small weight loss ratio when heated and a good hue after heating and a hot-melt adhesive composition containing thereof has excellent fluidity during heating, a small heating weight loss and a small change in heated hue and excellent thermal stability.
Patent TW-564264-B (TW)
Title: Manufacturing process of composite vacuum vapor-deposition material wire and wire manufactured thereby
Inventor: FURUICHI SHINJI
IPC: B21C37/04
Filed: 2002-08-20
Granted: 2003-12-01
Abstract: Disclosed is a process for manufacturing a long composite vacuum vapor-deposition material wire in which an outer periphery of a core wire of iron, nickel, cobalt or an alloy of these metals is coated or sheathed with an aluminum or aluminum alloy. The outer periphery of the core wire is coated or sheathed with aluminum etc. by plastic working, thereby to form a primary composite wire so as not to form a macroscopic space between the core wire and the aluminum coating. By performing a cold wire drawing of this primary composite wire, the core material and the coating material are integrally drawn and firmly bonded together by the self-heat generation or frictional heat during plastic deformation. It is possible to obtain a composite vacuum vapor-deposition material wire which has a weight ratio of core portion of 8 to 45 wt.%, a uniform composition distribution in length and a length of more than 100 m.
Patent TW-561549-B (TW)
Title: Thin film forming apparatus and thin film forming method
Inventor: VEYAMA TSUTOMU
IPC: H05K3/20
Filed: 2002-09-03
Granted: 2003-11-11
Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.
Patent TW-I222918-B (TW)
Title: Impact piston retention mechanism of compressed air driven impacting tool
Inventor: KAMIYA TOMOHIDE
IPC: B25C1/04
Filed: 2002-11-19
Granted: 2004-11-01
Abstract: The object of the present invention is to retain the impact piston 4 at the upper dead center until the pressure of the compressed air inside an impact cylinder 2 reaches a sufficient high level regardless of the operation speed of the main valve. The solution of the present invention is that a tubular section 14 is arranged at a top portion of the impact cylinder 2 and facing downwards and a piston stop 6 is formed as a recessed section 15 in the tubular section 14. A raised section 16 that is formed on a top surface of the impact piston 4 is received in the recessed section 15 with a bottom surface of tubular section 14 tightly abutting against the top surface of the impact piston 4 to isolate an outer peripheral side and an interior of the tubular section 14, such that the compressed air supplied to the impact cylinder 2 acts upon the outer peripheral side of the tubular section 14 so as to retain the raised section 16 inside the recessed section 15.