baber/WOPTO huggingface dataset:
Patent TW-201501014-A (TW)
Title: System and method for reducing and rearranging the user interface
Inventor: KUO SAN-HSIN
IPC: G06F3/14
Filed: 2013-06-24
Abstract: The present invention provides a method for reducing and rearranging the user interface. The method includes the following steps: starting three-axis acceleration sensor and detecting the gesture when users grip the large-screen touchable mobile phone; calculating the screen size according to the screen resolution and then calculating the reduction ratio; determining the displayed position on the screen according to the users' gesture; reducing the size of the user interface by the reduction ratio and rearranging the reduced user interface. A related system is also disclosed.
Patent TW-201409711-A (TW)
Title: Integrated circuit device and method for fabricating the same
Inventor: HONG MIN-HAO
IPC: H01L21/336
Filed: 2013-07-26
Abstract: An integrated circuit device and a method for fabricating the same are provided. The integrated circuit device including a substrate having a trench formed therein, a first layer of isolation material occupying the trench, a second layer of isolation material formed over the first layer of isolation material, an epitaxially-grown silicon layer on the substrate and horizontally adjacent the second layer of isolation material, and a gate structure formed on the epitaxially-grown silicon, the gate structure defining a channel.
Patent TW-201423920-A (TW)
Title: Heat radiation component and method for manufacturing heat radiation component
Inventor: KAWAMURA KENJI
IPC: H01L23/373
Filed: 2013-07-30
Abstract: A heat radiation component includes a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate.
Patent TW-201425570-A (TW)
Title: Cleaning solution producing apparatus, cleaning solution producing method, and substrate cleaning apparatus
Inventor: MIYAZAKI KUNIHIRO
IPC: C11D17/00
Filed: 2013-08-06
Abstract: An cleaning solution producing apparatus according to an embodiment includes: a mixing unit configured to produce a liquid mixture by mixing a hydrogen peroxide solution into an acidic or alkaline liquid, and to raise the pressure of the produced liquid mixture by use of an oxygen gas produced through the decomposition of the hydrogen peroxide solution, or by use of vapor produced by heat of the reaction; and a bubble producing unit configured to produce multiple fine bubbles in the liquid mixture by releasing the pressure of the liquid mixture which is raised by the mixing unit.
Patent TW-201506143-A (TW)
Title: Thermally conductive composite material
Inventor: Huang shu-lang
IPC: C09K5/14
Filed: 2013-08-12
Abstract: A thermally conductive composite material comprises a binder and a filler, wherein the binder comprises silicate and silica sol. The filler is selected from copper, copper oxide, iron, iron oxide, aluminum, aluminum oxide, silver, gold, graphite, aluminum nitride, boron nitride, silicon carbide and a combination thereof. Based on 100wt% of the thermally conductive composite material, the weight percent of the silicate is 5 to 50 wt%, the weight percent of the silica sol is 10 to 50 wt% and the weight percent of the filler is 2 to 50 wt%. With the use of the aforesaid ingredients and the ratio formulation, the adhesion property and conductivity of the thermally conductive composite material can be enhanced so as to increase thermal conductivity.
Patent TW-201509165-A (TW)
Title: Network equipment and method for selecting communication path
Inventor: HUANG JIA-XUAN
IPC: H04L45/24
Filed: 2013-08-29
Abstract: The present invention discloses a method for selecting multi-path of network communication which includes the following steps: opening a primary path to send data, and starting to time in accordance with a pre-set retransmission timeout(RTO); if the RTO arrives, switching to a secondary path to send data; transmitting a heartbeat packet to the primary path and the secondary path by a stream control transmission protocol(SCTP); receiving parameters corresponding to the heartbeat response packet from the primary path and the secondary path; if a primary first time is less than a secondary first time, a primary second time is less than a secondary second time and a primary path capacity is more than a secondary path capacity, switching to the primary path to send data.
Patent TW-201428929-A (TW)
Title: Semiconductor device
Inventor: KITAJIMA YUICHIRO
IPC: H01L23/60
Filed: 2013-09-06
Abstract: This semiconductor device has the following configuration so that a current path can be shut down effectively upon reverse connection when a power source is connected reversely to the semiconductor device. An NMOS transistor (14) has a gate connected to a power source terminal (11), a source and a back gate connected to an internal ground node (17), and a drain connected to a ground terminal (12). An NMOS transistor (15) has a gate connected to the ground terminal (12), a source and a back gate connected to the internal ground node (17), and a drain connected to the power source terminal (11). An internal circuit (13) has a power source terminal connected to the power source terminal (11), and has a ground terminal connected to the internal ground node (17).
Patent TW-201511496-A (TW)
Title: Amplitude modulation interference avoidance method, device, and amplitude modulation receiver
Inventor: KUO CHIEN-LIANG
IPC: H04H40/72
Filed: 2013-09-09
Abstract: An exemplary embodiment of the present disclosure provides a amplitude modulation interference avoidance method used in an amplitude modulation receiver. Firstly, an operation mode is determined, wherein the operation mode determines a range of a frequency dividing number. Then, a frequency of a local oscillating signal is divided according to the frequency dividing number to generate a pulse width modulation frame rate, wherein the local oscillating signal is mixed with a radio frequency signal received by the amplitude modulation receiver. Then, whether the frequency dividing number should be adjusted and whether a signal with information of the pulse width modulation frame rate is determined according to the frequency of the local oscillating signal or the pulse width modulation frame rate.
Patent TW-201513650-A (TW)
Title: Digital television, television chip and display method
Inventor: LEE MING-LIN
IPC: H04N21/434
Filed: 2013-09-24
Abstract: A digital television (TV), a TV chip and a display method are disclosed. The digital TV comprises a display terminal, a TV chip and an image driving circuit. The display terminal comprises adjacent rows of pixels. The TV chip comprises a digital TV decoder, a data stream decoder, a scaler and a color space converting circuit. The digital TV decoder outputs a data stream and an index signal according to an interlace TV signal. The data stream decoder decodes the data stream to output an interlace image. The scaler outputs a scaled image according to the interlace image. The color space converting circuit outputs color pixel data according to the scaled image. The image driving circuit turns on the rows of the pixels at the same time, and writes the color pixel data to the rows of the pixels to display a de-interlace image.
Patent TW-201514904-A (TW)
Title: Online test system and method
Inventor: HUANG DE-FENG
IPC: G06Q50/20
Filed: 2013-10-11
Abstract: The present invention provides an online test system and a method, which is linked to a database through a host computer. A tested end is linked to an online test system through Internet, and is then verified through a login module. After completion of login, a test paper can be selected and printed through a printing device for being written at the tested end. The finished test paper can be scanned through a scanner for conversion into an electronic test paper file, and can be further uploaded to a database of the online test system for storage. The database then issues a message to a reviewing end, and the reviewing end logs in the online test system for reviewing the test paper online. The review-completed test paper is stored in the database, and the database issues a message to the tested end. As such, users of the tested end and the correct end may have good interaction and learning effect.
Patent TW-201423269-A (TW)
Title: Photosensitive resin composition, pattern cured film and method for producing the same, semiconductor element and electronic device
Inventor: AOKI YU
IPC: H01L21/027
Filed: 2013-10-24
Abstract: The invention discloses a photosensitive resin composition including: (A) an alkali soluble resin having a structure unit represented by General Formula (1) below, (B) a compound which generates an acid by light, (C) a thermal crosslinking agent, and (D) an acrylic resin having a structure unit represented by General Formula (2) below. [In General Formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents an alkyl group etc. having a carbon quantity from 1 to 10, a represents an integer from 0 to 3, b represents an integer from 1 to 3. A total amount of a and b is 5 or less.] [In General Formula (2), R3 represents a hydrogen atom or a methyl group, R4 represents a hydroxyalkyl group having a carbon quantity from 2 to 20.]
Patent TW-201436936-A (TW)
Title: Polishing apparatus and polishing method
Inventor: UMEMOTO MASAO
IPC: H01L21/304
Filed: 2013-10-30
Abstract: The objective of the present invention is to provide a polishing apparatus which prevents polishing solution, which is scattered around a polishing table in processing a substrate, from being attached and dried to the surface of various components which are arranged around the polishing table. A polishing apparatus according to the present invention comprises a polishing table (12) for supporting a polishing pad (10) having a polishing surface (10a), a top ring head (16) having a top ring (14), a top head cover (24) which surrounds the top head (16), a dresser head (22) having a dresser (20), dresser head covers (30a,30b,30c) which surround the dresser head (22), spraying nozzles (58, 60, 62) which spray cleaning solution to the upper surface of the top ring (14) and the outer surface of the head cover (24) when the top ring (14) is located in a substrate transfer position, and spraying nozzles (62, 64, 66) which spray a cleansing solution to the outer surface of the dresser head covers (30a, 30b, 30c) when the dresser (20) is located in a retreating position.
Patent TW-201519508-A (TW)
Title: Electronic package
Inventor: CHIU CHIH-HSIEN
IPC: H01Q1/38
Filed: 2013-11-05
Abstract: A electronic package, comprising a subtract, an encapsulation gel, an electrical contact pad, and an antenna structure, wherein the antenna structure has a first extension portion and a second extension portion providing on the opposing two surface of the subtract, and a connecting portion is interposed between the first extension portion and the second extension portion, the electrical contact pad is electrically connected to the second extension portion. By the using of the electrical contact pad for tuning the resonance frequency of the antenna, the tuning of the resonance frequency is available under the system condition or the platform.
Patent TW-201422338-A (TW)
Title: Operating method of hot chamber diecasting machine
Inventor: UMEKI TAKEHIRO
IPC: B22D17/04
Filed: 2013-11-25
Abstract: An operating method of hot chamber diecasting machine is provided to produce products without forming bubbles and is capable of performing inject-molding in short time so that reliability is acquired and the size of a setting space can be set freely. The method includes moving a plunger 7 till reaching an end position to perform the inject-molding, moving the plunger 7 to a supply position and then moving the plunger 7 to a setting position after wait for a set time at the supply position, thereby a nozzle 8 and a runner 6 connect with each other to form a space 10. The method further inclues moving the plunger 7 till reaching the end position to fill the space 10 with molten metal, opening a mold 9 to take out the product 11 and then moving the plunger 7 till reaching a forming-start position, thereby a space 10 is formed in a set size. The method further includes closing the mold and moving the plunger 7 till reaching an end position.
Patent TW-201448142-A (TW)
Title: Package substrates and methods of fabricating the same
Inventor: SEO HYUN-CHUL
IPC: H01L21/28
Filed: 2013-11-25
Abstract: Package substrates are provided. The package substrate includes a core layer having a first surface defining trench portions and ridge portions between the trench portions, at least one first trace on a bottom surface of each of the trench portions, and second traces on respective ones of top surfaces of the ridge portions. Related methods are also provided.
Patent TW-201426722-A (TW)
Title: Method of controlling polarity of data voltage and liquid crystal display using the same
Inventor: CHO CHANG-HUN
IPC: G09G3/36
Filed: 2013-12-06
Abstract: Disclosed herein is a method of controlling polarity of a data voltage and a liquid crystal display using the same, the method including calculating a direct current DC value of the data from each group which data to be output through I-channels adjacent to each other in a source drive IC belong; accumulating the DC value; comparing an absolute value of the accumulation DC value of the n-th group obtained by adding the accumulation DC value of the n-1-th group accumulated up to the n-1-th group to the DC value of the n-th group (n is positive integer) with a predetermined threshold value; and changing a group polarity data when the absolute value of the accumulation DC value of the n-th group exceeds the threshold value.
Patent TW-201515084-A (TW)
Title: Method for forming through wafer vias in semiconductor devices
Inventor: CHEN CHIA-HAO
IPC: H01L21/306
Filed: 2013-12-13
Abstract: A method for forming a through wafer via hole in a semiconductor device, wherein the semiconductor device comprises a wafer having a SiC substrate with a front side and a backside, a GaN-based layer formed on the front side of the SiC substrate, and a mask structure formed on the backside of the SiC substrate defining an etching area. The etching area is first descummed. A through substrate via hole is formed by etching the etching area through the SiC substrate. The mask structure is removed and the inner surface of the through substrate via hole is cleaned. The inner surface of the through substrate via hole is then descummed. A through wafer via hole is formed by etching through the GaN layer in the through substrate via hole. And lastly the inner surface of the through wafer via hole is cleaned.
Patent TW-201428424-A (TW)
Title: Resist composition, method of forming resist pattern and compound
Inventor: KAWAUE AKIYA
IPC: C07C381/12
Filed: 2013-12-20
Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a photo-decomposable quencher (D0) containing a compound represented by general formula (d0) shown below. In the formula, R represents a hydrocarbon group of 4 to 20 carbon atoms which may have a substituent; Y1 represents a single bond or a divalent linking group; R2 and R3 each independently represents a substituent of 0 to 20 carbon atoms other than a fluorine atom; one of R2 and R3 may form a ring with Y1; Mm+ represents an organic cation having a valency of m; and m represents an integer of 1 or more.
Patent TW-201526257-A (TW)
Title: Solar cell, solar cell set, solar cell module, and method of assembling the solar cell set
Inventor: CHEN LIANG-PIN
IPC: H01L31/0224
Filed: 2013-12-30
Abstract: A solar cell, a solar cell set, a solar cell module, and a method of assembling the solar cell set are provided. The solar cell set comprises a solar cell and an electric power transmission unit. The solar cell comprises a dielectric layer having a plurality of first and second holes, a plurality of first electrodes respectively disposed in the first holes, and a plurality of second electrodes respectively disposed in the second holes. The electric power transmission unit includes an insulation film having a plurality of first and second openings, and first and second metal layers covered by the insulation film. The first metal layer extends through the first openings to contact the first electrodes. The second metal layer extends through the second openings to contact the second electrodes. The design of the present invention can reduce the consumption of a conductive paste of the solar cell and the manufacturing costs of the solar cell, and improve the current collecting effect of the solar cell set and the service life of the solar cell set.
Patent TW-201526124-A (TW)
Title: Conducting packaging structure and manufacturing method thereof
Inventor: HUANG YU-TONG
IPC: H01L21/28
Filed: 2013-12-31
Abstract: A conducting packaging structure comprises a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected on the substrate and a relatively second surface which is of patterned.
Patent TW-201502293-A (TW)
Title: Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, conductive component for electronic/electric device, and terminal
Inventor: MAKI KAZUNARI
IPC: H01R13/03
Filed: 2014-02-20
Abstract: One aspect of this copper alloy for an electronic/electric device includes: Zn: more than 2.0 mass% to 36.5 mass% or less; Sn: 0.10 mass% or more to 0.90 mass% or less; Ni: 0.15 mass% or more to less than 1.00 mass%; P: 0.005 mass% or more to 0.100 mass% or less; and the balance of Cu and inevitable impurities, wherein atomic ratios of elemental contents fulfill 3.0 < Ni/P < 100.0 and 0.10 < Sn/Ni < 2.90, and a Vickers hardness of a surface of an [alpha] phase containing Cu, Zn, and Sn is in a range of 100 or more.
Patent TW-201532786-A (TW)
Title: Pasting method of adhesive tape with electronic elements for preventing gas bubble formation
Inventor: SHI JUN-LIANG
IPC: B29C63/20
Filed: 2014-02-24
Abstract: The present invention provides a pasting method of adhesive tape with electronic elements for preventing gas bubble formation. A carrier board is first aligned and adhered to an adhesive tape, and a first vacuum adsorption device evacuates the first chamber of a first base to adsorb to the non-sticky face of the adhesive tape. Next, electronic elements are placed in the second chamber of a second base to move the first and the second bases to be aligned and moved oppositely by using a movement device, so that the first chamber and the second chamber on opposite sides of the adhesive tape are in a gas tight state. While the second vacuum adsorption device is used to evacuate the second chamber of the second base, the vacuum adsorption state of the adhesive tape by the first vacuum adsorption device is lifted at the same time to make the sticky face of the adhesive tape automatically move and stick to the electronic elements, so that the adhesion process between the adhesive tape and the electronic elements will not produce gas bubble, thereby facilitating the subsequent process.
Patent TW-201445875-A (TW)
Title: Apparatus for matching impedance in radio frequency amplifier
Inventor: MA RUI
IPC: H03F3/189
Filed: 2014-03-18
Abstract: An impedance matching network for a radio frequency (RF) amplifier includes multiple stages connected to each other in a first to last order. A first stage produces an RF output signal, and a last stage receives an RF input signal. Each stage includes a first inductor connected to produce an output signal, a second inductor connected to receive an input signal from a next stage, a capacitor connected between the first and second inductors and a ground. In addition, each stage other than the first stage further includes a first switch to by-pass the first and second inductors, a second switch connected between the first and second inductors and the ground, and a controller for controlling the first and second switches to select a particular power level of a set of power levels.
Patent TW-201443145-A (TW)
Title: Diene/dienophile couples and thermosetting resin compositions having reworkability
Inventor: CHAMPAGNE TIMOTHY M
IPC: H01L23/29
Filed: 2014-03-18
Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (''CSPs''), ball grid arrays (''BGAs''), land grid arrays (''LGAs'') and the like (collectively, ''subcomponents''), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
Patent TW-201447321-A (TW)
Title: Leakage current calculating device and leakage current calculating method
Inventor: MATSUSHITA KENYA
IPC: G01R31/02
Filed: 2014-03-24
Abstract: Provided is a leakage current calculating device that could precisely calculate the leakage current with diminished effect resulted from noises. The device comprises: a ground voltage detecting means, detecting ground voltages input to each phase of a three-phase motor during a predetermined duration; a zero-phase-sequence current detecting means, detecting the zero-phase-sequence currents which are ground leakage currents flowing via the three-phase motor during a predetermined duration; a basic AC waveform extracting means, extracting basic AC voltage waveforms having a frequency of the same phase as the ground voltage of the corresponding phase from the ground voltage; a frequency component extracting means, extracting the zero-phase-sequence current component of the frequency band from the frequency bands comprising the freguency of the basic AC voltage waveform; and a leakage current calculating means, integrating the zero-phase-sequence current component of the frequency band within a duration corresponding with the zero crossing of the basic AC voltage waveform, so as to calculate the leakage current I0cos θ flowing through the earth resistance component of the three-phase motor except for the earth capacity component among the ground leakage current.
Patent TW-201445616-A (TW)
Title: Lithography cluster, method and control unit for automatic rework of exposed substrates
Inventor: MULKENS JOHANNES CATHARINUS HUBERTUS
IPC: G03F7/20
Filed: 2014-03-28
Abstract: A lithography cluster comprises a track unit, a lithography apparatus, a metrology unit, a control unit and a strip unit. The track unit is for applying a layer on a substrate for lithographic exposure. The lithography apparatus is for exposing the layer according to a pattern. The metrology unit is for measuring a property of the exposed pattern in the layer. The control unit is for controlling an automatic substrate flow between the track unit, the lithography apparatus, and the metrology unit. The strip unit is for removing the layer from the substrate. The control unit is constructed and arranged for controlling the automatic substrate flow on the basis of the measured property such that the substrate is directed to the strip unit for removing the layer if a measured property of its pattern falls outside a pre-determined quality range.