baber/WOPTO huggingface dataset:
Patent TW-201640734-A (TW)
Title: Miniature band-pass filter
Inventor: Wang yu-kai
IPC: H01P1/203
Filed: 2015-05-15
Abstract: A miniature band-pass filter, comprising a substrate, a first signal transmission section, a second signal transmission section, and a resonance structure, the resonance structure comprises a plurality of microstrip lines, the band-pass filter function can be achieved through a miniature area by bending the first signal transmission section, the second signal transmission section, and the resonance structure.
Patent TW-201641996-A (TW)
Title: Display
Inventor: CHAN CHIH-HSIANG
IPC: G02F1/1333
Filed: 2015-05-29
Abstract: A display including a carrier board, a plurality of light emitting elements and a driving module is provided. The carrier board has a predetermined center. The light emitting elements are bonded to a first surface of the carrier board, and each light emitting element emits a display light to form a display image directly. The light emitting elements arranged along a plurality of arrangement tracks are grouped into a plurality of light emitting element groups. When the X-axis and Y-axis are defined as two axes perpendicular to each other, at least one of the arrangement tracks is neither parallel to the X-axis nor parallel to the Y-axis. The driving module is connected to the carrier board to drive the light emitting elements.
Patent TW-201610292-A (TW)
Title: Wind turbine with optical pressure sensors and method for operating a wind turbine
Inventor: ALTMIKUS ANDREE
IPC: F03D1/06
Filed: 2015-06-04
Abstract: Wind turbine with at least one rotor blade 108 and at least one optical pressure sensor 18 arranged on the rotor blade 108, and method for operating the wind turbine.
Patent TW-201612236-A (TW)
Title: Laser activatable polymer composition
Inventor: YUNG PAUL C
IPC: C08K3/22
Filed: 2015-06-16
Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.
Patent TW-201631791-A (TW)
Title: Light emitting diode and manufacturing method thereof
Inventor: TING SHAO-YING
IPC: H01L33/00
Filed: 2015-07-23
Abstract: A light-emitting diode (LED) and a method for manufacturing the same are provided. The method includes following steps. An LED wafer is fixed on a crafting table and is processed such that a substrate of the LED wafer has a thickness smaller than or equal to 100 [mu]m. A fixing piece is pasted on the LED wafer surface. The LED wafer is detached from the crafting table. The LED wafer together with the fixing piece are cut and broken, such that the LED wafer forms a plurality of LEDs. The fixing piece is removed. Before the LED wafer is detached from the crafting table, the fixing piece is pasted on the LED wafer to provide a supporting force to the LED wafer to maintain the flatness of the wafer and avoid the wafer being warped or the substrate being broken or damaged, such that product quality and reliability can be improved.
Patent TW-201623510-A (TW)
Title: Protection of new electro-conductors based on nano-sized metals using direct bonding with optically clear adhesives
Inventor: ZHANG YING
IPC: C09J11/06
Filed: 2015-09-01
Abstract: The present invention is an adhesive composition for stabilizing an electrical conductor. The adhesive composition includes a base polymer and an additive for absorbing UV light, such as a benzotriazole or a benzophenone. When the adhesive composition is in contact with the electrical conductor, the electrical conductor has less than about a 20% change in electrical resistance over a period of about 500 hours.
Patent TW-201622102-A (TW)
Title: Microled display & assembly
Inventor: CHANG PETER L
IPC: H01L33/62
Filed: 2015-09-10
Abstract: Crystalline (micro)LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro)LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.
Patent TW-201714032-A (TW)
Title: Two path maximum power point tracking off-grid solar inverter apparatus and control method thereof
Inventor: LU YU-CHENG
IPC: G05F1/67
Filed: 2015-10-02
Abstract: A two path maximum power point tracking off-grid solar inverter apparatus is provided. The apparatus comprises a first MPPT unit, a second MPPT unit and an inverter main-control unit. The first MPPT unit and the second MPPT unit respectively generates electrical energy from its solar panel unit and by using competition mechanism made of a combination of hardware and software, for being a first slave device and a second slave device. The inverter main-control unit is coupled to the first MPPT unit and the second MPPT unit, for controlling the first MPPT unit and the second MPPT unit to convert solar power to a DC power to charge a battery. The inverter main-control unit converts the solar power and the electricity of the battery to an AC power for providing to a load. The inverter main-control unit controls the redundancy of the first MPPT unit and the second MPPT unit, and dominates the output power of the first MPT unit and the second MPPT unit according to the loading and the charging current set by a user, so as to meet the requirements of charging and the loading.
Patent TW-201623767-A (TW)
Title: Improvements in the deformation resistance of timber frame partitions
Inventor: SPARKES JOANNA
IPC: E06B1/06
Filed: 2015-10-08
Abstract: A partition for a building structure comprises a support frame and a plasterboard affixed to the support frame. The support frame comprises a plurality of elongate timber members. The plasterboard comprises a gypsum matrix having fibres embedded therein in an amount of at least 1 wt% relative to the gypsum, as well as a polymeric additive that is present in an amount of at least 1 wt% relative to the gypsum.
Patent TW-201715297-A (TW)
Title: Positive photosensitive resin composition and application thereof
Inventor: LIU CHI-MING
IPC: H01L27/12
Filed: 2015-10-20
Abstract: The present invention relates to a positive photosensitive resin composition and an application thereof. The aforementioned positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D), and a water content of the positive photosensitive resin composition is not more than 0.7 weight percentage. The positive photosensitive resin composition can be utilized to form a pattern, and the positive photosensitive resin composition has excellent ageing stability.
Patent TW-201624497-A (TW)
Title: Ion conductor and method for producing same
Inventor: NOGAMI GENKI
IPC: H01B1/02
Filed: 2015-10-28
Abstract: According to one embodiment of the present invention, provided is an ion conductor which contains lithium (Li), a borohydride (BH4-), phosphorus (P), and sulfur (S), and which has, in X-Ray diffraction analysis (CuK[alpha]: [lambda] = 1.5405 AA), at least diffraction peaks at 2[Theta] values of 14.4 ± 1.0 deg, 15.0 ± 1.0 deg, 24.9 ± 1.0 deg, 29.2 ± 1.5 deg, 30.3 ± 1.5 deg, 51.1 ± 2.5 deg and 53.5 ± 2.5 deg.
Patent TW-201630357-A (TW)
Title: Envelope tracking path delay fine tuning and calibration
Inventor: PILGRAM BERNDT
IPC: H03F1/32
Filed: 2015-11-04
Abstract: A power amplifier of an envelope tracking system is configured to generate an output power with a variable supply voltage that is generated in an envelope tracking path. A signal generation/processing path receives an input signal and processes the input signal to the power amplifier in a main signal processing path. A delay component is configured to generate a delay to the envelope tracking path with respect to the signal generation path. A feedback path is configured to generate a feedback signal from the output of the power amplifier and adjust the delay component or the delay of the delay component during an active transmission or an active transmission mode.
Patent TW-201628033-A (TW)
Title: Through-type multilayer ceramic capacitor
Inventor: ZAIMA TOMOHIKO
IPC: H01G4/12
Filed: 2015-11-06
Abstract: In an embodiment, a through-type multilayer ceramic capacitor 10-1 has a first external electrode 12 provided on one end of the capacitor body 11 in the length direction, and a second external electrode 13 provided on the other end of the capacitor body 11 in the length direction, and it also has a third external electrode 14 of quadrangular cylinder shape provided at the center of the capacitor body 11 in a manner continuously covering parts of both sides in the height direction, and parts of both sides in the width direction, of the capacitor body 11, in a state not contacting the first external electrode 12 and second external electrode 13. The through-type multilayer ceramic capacitor can offer improved strength at the time of installation on a circuit board.
Patent TW-201624557-A (TW)
Title: Wafer processing method
Inventor: NAKAMURA MASARU
IPC: H01L21/304
Filed: 2015-11-10
Abstract: The present invention provides a wafer processing method, which is to adhere a protection tape on the surface of a wafer continuously formed with a modification layer along the predetermined scribe lines and hold the protection tape on the chuck table to supply the grinding liquid to the back of the wafer and simultaneously grind the wafer to a predetermined thickness, and also will not damage the circumference of the water while dividing the wafer into individual devices. The wafer processing method is to divide the wafer along the predetermined scribe lines into individual die devices and includes: a modification layer forming step for positioning the light concentrating point of laser beam with wavelength for transmitting through the wafer inside the wafer and irradiating along the predetermined scribe lines and forming the modification layer inside the wafer along the predetermined scribe lines; and, a back grinding step for supplying the grinding liquid to the back of the wafer and simultaneously grinding to a predetermined thickness and dividing the wafer into individual die devices along the predetermined scribe lines having the modification layer as the breaking start point. Before performing the back grinding step, a protection tape adhering step and an adhesive layer curing step will be performed; wherein, the protection tape adhering step is to irradiate ultraviolet light to cure the adhesive layer of the protection tape to be adhered onto the wafer surface; and, the adhesive layer curing step is to irradiate ultraviolet light on the protection tape adhered on the wafer surface to cure the adhesive layer.
Patent TW-201605422-A (TW)
Title: Package body for absorbent article
Inventor: HAYASHI TOSHIHISA
IPC: A61F13/47
Filed: 2012-05-18
Abstract: The subject of the present invention is to provide a package body for an absorbent article, capable of improving the texture by applying three-dimensional decoration to a package sheet while inhibiting undesirable occurrences such as position shift between the absorbent article and the package sheet. To solve the problem, the package body for the absorbent article according to the present invention comprises: an absorbent article including a liquid permeable surface sheet, a liquid impermeable back sheet, and an absorbent member disposed between the surface sheet and the back sheet; and a package body of absorbent article with a package sheet for individually packaging the absorbent article, wherein the back sheet and a dressing side of the absorbent article are coated with adhesives. At least one portion of said package sheet is provided with a first colored area which is colored with a first color, a first non-colored area which is not colored with the first color, and a second colored area which is colored with a second color. The shape of the second colored area is identical or similar to the shape of the first non-colored area, and is disposed on said package sheet to overlap with one part of the first non-colored area. The package sheet is provided with an overlapping area that overlaps the first colored area and the second colored area, and the overlapping area is arranged along the contour of the second colored area.
Patent TW-201719168-A (TW)
Title: Gas sensing unit
Inventor: LAI CHAO-SUNG
IPC: G01N33/497
Filed: 2015-11-20
Abstract: This invention provides a gas sensing unit and the producing method thereof. The gas sensing unit comprises a substrate, and a nano-pillar layer thereon. Furthermore, a detective layer is formed on the nano-pillar layer that causes a significant increase of the sensitivity and the recovery ability of the gas sensor, especially for sensing low concentration gas.
Patent TW-201721613-A (TW)
Title: Flag-fluttering type signboard structure including a signboard body, two fixed frame bodies, an upper pillar and a lower pillar
Inventor: Lin jin-quan
IPC: G09F7/22
Filed: 2015-12-15
Abstract: The present invention is to provide a flag-fluttering type signboard structure, which comprises a signboard body that is composed of a frame, an upper cover, a lower cover, two rotating illumination devices, and two driving devices; two fixed frame bodies, the fixed frames being respectively provided on a linking member of the upper cover and a linking member of the lower cover; an upper pillar, one end of the upper pillar being fixed to one of the fixed frame bodies and the other end being fixed to a working face to be installed; and a lower pillar, one end of the lower pillar being fixed to the other fixed frame body and the other end being fixed to the working face to be installed.
Patent TW-201723861-A (TW)
Title: Communication system with multiple serial ports for automatically identifying device types and communication protocols and method thereof
Inventor: JIANG SHYH-BIAU
IPC: G06F13/10
Filed: 2015-12-18
Abstract: A communication system with multiple serial ports for automatically identifying device types and communication protocols and method thereof are described. The communication system and method are capable of automatically identifying device types and communication protocols of the interface apparatuses with different device numbers which are disposed in the multiple serial port architecture. Furthermore, the driving functions utilize the multiple serial port architecture to correspondingly perform the serial communication based on the device types and communication protocols in order to reduce the cost. Moreover, the application program module of the user provide device number and data control information so that software program is generated without hardware circuits and manufacturing technique of the interface apparatuses for completing the automatic control and monitoring tasks to increase the utilization convenience.
Patent TW-201635418-A (TW)
Title: Method and apparatus for mounting semiconductor wafer
Inventor: YAMAMOTO MASAYUKI
IPC: H01L21/68
Filed: 2015-12-21
Abstract: Supportive adhesive tape is accurately attached in a range of a rear face and a cycle frame of a semiconductor wafer in which an annulus convex part is formed at the rear of the semiconductor wafer. In condition of making an adhesive tape T, that is attached at a cycle frame f, and the rear of a wafer W be close to and opposite to each other, the semiconductor wafer W is stored and held in one of a pair of housings and a chamber is formed by using two housings to bring in the adhesive tape T. Differential pressure between two spaces in the chamber separated by the adhesive tape T is generated. Adhesive tape T is heated so that it is recessed and bended to be attached to the rear of the wafer W. After dissolution of the differential pressure and the heating, the adhesive tape T is heated again while the adhesive tape T is attached to the wafer W.
Patent TW-201633352-A (TW)
Title: Fuse element and circuit module
Inventor: FURUUCHI YUJI
IPC: H01H85/175
Filed: 2016-01-19
Abstract: This fuse element is provided with an opening for releasing internal pressure, and maintains both the strength of adhesion with an insulating substrate and the insulation property after an electric current path is blocked. The fuse element is provided with: an insulating substrate 10; a plurality of electrodes 11, 12 formed on a surface 10a of the insulating substrate 10; a soluble conductor 13 that is connected to the area between the electrodes 11, 12, and that, by blowing out, blocks the area between the electrodes 11, 12; and a case 20 that has a side surface 21, which is adhered on the surface 10a of the insulating substrate 10 to which the soluble conductor 13 is provided, and a top surface 22 covering the surface 10a of the insulating substrate 10. The case 20 is provided with an opening 23 that penetrates into the case 20 at a position other than the lower part of the side surface 21 that is connected to the surface 10a of the insulating substrate 10.
Patent TW-201636440-A (TW)
Title: A wire rod for non-heat treated mechanical parts, a steel wire for non-heat treated mechanical parts, and a non-heat treated mechanical part
Inventor: OKONOGI MAKOTO
IPC: B21F17/00
Filed: 2016-01-27
Abstract: A steel wire for non-heat treated mechanical parts includes required amounts of C, Si, Mn, Cr, Mo, Ti, Al, B, Nb, and V, limited amount of P, S, N, and O, and a remainder of Fe and impurities. When the amount of C by mass% is set to [C%], a metal structure includes 75*[C%]+25 or more of bainite by volume% and the remainder of the structure consists of one or more of ferrite and perlite. When an average aspect ratio of a bainite block in a second surface layer of the steel wire is set to R1, the R1 is 1.2 or more. When an average size of the bainite block in a third surface layer of the steel wire is set to PS3 [mu]m and an average size of the bainite block in a third center area of the steel wire is set to PC3 [mu]m, the PS3 satisfies the following equation (c) and the relationship between the PS3 and the PC3 satisfies the following equation (d). The standard deviation of the size of the bainite block in the structure is 8.0 [mu]m or less, and the tensile strength is 800 MPa to 1600 MPa.
Patent TW-201728489-A (TW)
Title: Bicycle integrated frame assembly assisting motor located in the motor mounting space of the tube under the frame, so that the assisting motor to be able to get hidden effect
Inventor: ZHUO JIANG-ZE
IPC: B62K19/30
Filed: 2016-02-05
Abstract: A bicycle integrated frame assembly comprises a frame and an assisting motor. The tube under the frame has a motor mounting space. The assisting motor is located in the motor mounting space of the tube under the frame so that the assisting motor can get a hidden effect. As a result, the integrated frame assembly of the invention cannot perceive the setting of the assisting motor from the outside; thereby the appearance of the overall structure can be improved.
Patent TW-201730244-A (TW)
Title: Liquid crystal alignment agent and uses thereof
Inventor: CHIOU SHIN-RONG
IPC: C08G77/38
Filed: 2016-02-26
Abstract: The invention relates to a liquid crystal alignment agent comprising a photo alignment polysiloxane (A) and a solvent (B); wherein the photo alignment polysiloxane (A) is obtained by reacting a polysiloxane (a-1) containing an epoxy group and a cinnamic acid derivative (a-2). The liquid crystal alignment agent is capable of forming a liquid crystal alignment film with excellent reliability and pre-tilt angle stability. Besides, the invention also provides a liquid crystal alignment film made by the liquid crystal alignment agent as mentioned above and a liquid crystal display element comprising the liquid crystal alignment film.
Patent TW-201643195-A (TW)
Title: Monoclonal antigen-binding proteins to intracellular oncogene products
Inventor: SCHEINBERG DAVID A
IPC: C07H21/04
Filed: 2016-03-21
Abstract: Antigen binding proteins specific for an HLA-A2 restricted Ras peptide are disclosed. The antigen binding proteins encompass antibodies in a variety of forms, including full-length antibodies, substantially intact antibodies, Fab fragments, F(ab')2 fragments, and single chain Fv fragments. Fusion proteins, such as scFv fusions with immunoglobulin or T-cell receptor domains, and bispecific antibodies incorporating the specificity of the antigen binding region for each peptide are also contemplated by the disclosure. Furthermore, immunoconjugates may include antibodies to which is linked a radioisotope, fluorescent or other detectable marker, cytotoxin, or other molecule are also encompassed by the disclosure. Among other things, immunoconjugates can be used for delivery of an agent to elicit a therapeutic effect or to facilitate an immune effector function.
Patent TW-201642869-A (TW)
Title: Pharmaceutical compositions for combination therapy
Inventor: PRUZANSKI MARK
IPC: A61K38/26
Filed: 2016-04-07
Abstract: The present application relates to a pharmaceutical composition comprising a combination of an FXR agonist and at least one additional therapeutic agent that lowers the glucose level in the blood, stimulates insulin secretion, and/or increases insulin sensitivity. The present application relates to use of the pharmaceutical composition for the treatment or prevention of a FXR mediated disease or condition, such as NAFLD and NASH, a disease or condition related to an elevated level of glucose in the blood, decreased secretion of insulin, and/or decreased insulin sensitivity such as hyperglycemia, diabetes, obesity, and insulin resistance, or for lowering the glucose level in the blood, stimulating insulin secretion, and/or increasing insulin sensitivity.
Patent TW-201707003-A (TW)
Title: Non-volatile semiconductor memory device and erase method thereof
Inventor: YANO MASARU
IPC: G11C16/14
Filed: 2016-04-20
Abstract: Provide an erase method for non-volatile semiconductor memory device to compensate characteristics variation of a memory cell in proportion to numbers of rewriting data to the memory cell. The erase method has an erase step to erase charges of a charge accumulation layer, and a soft-program step to perform soft-programming to the charges in the accumulation layer by virtue of applying a weak soft-program voltage which is less than a program voltage when programming the memory cell after applying the erase voltage. The erase voltage is increased step by step when it is repeatedly applied. The weak soft-program voltage is decreased step by step when it is repeatedly applied.
Patent TW-201701368-A (TW)
Title: Semiconductor packages including interposer and methods of manufacturing the same
Inventor: OH TAC-KEUN
IPC: H01L23/535
Filed: 2016-04-20
Abstract: A semiconductor package may include a semiconductor die mounted on a first surface of an interposer die so that a die connection portion of the semiconductor die faces to the first surface of the interposer die, a protection portion may be disposed on the first surface of the interposer die to cover the semiconductor die, and an interconnection structure disposed in and on the interposer die. The interconnection structure may include an external connection portion that is located on a second surface of the interposer die opposite to the semiconductor die, a through electrode portion that penetrates the interposer die to have an end portion combined with the die connection portion, and an extension portion that connects the through electrode portion to the external connection portion. Related methods are also provided.