baber/WOPTO huggingface dataset:
Patent JP-2007302512-A (JP)
Title: Active carbon and electric double layer capacitor using the same
Inventor: IGAI KEIZO
IPC: C01B32/336
Filed: 2006-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a durable active carbon and a durable electric double layer capacitor using the same.  <P>SOLUTION: An active carbon obtained by subjecting an easily-graphitized carbon to activation treatment by an alkali metal hydroxide is further subjected to dry treatment in an inert gas atmosphere of an oxygen concentration of 2,000 volume ppm or less to obtain an active carbon having a total amount of acid groups per unit weight of 0.2-1.2 mmol/g. There is also provided an electric double layer capacitor using the same.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007302797-A (JP)
Title: Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate
Inventor: SHINTANI TOSHIAKI
IPC: H01L21/683
Filed: 2006-05-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for processing semiconductor wafers or semiconductor substrates, which is excellent in followingness to fine unevenness such as marks printed by the irradiation of laser beams and having a depth of about 0.4 to 40 μm, develops sufficient adhesive force, and can be peeled without leaving a paste, after achieving an adhesive purpose.  <P>SOLUTION: This pressure-sensitive adhesive sheet which is used for processing the semiconductor wafers or semiconductor substrates and on whose substrate a pressure-sensitive adhesive layer polymerized and cured with energy rays is disposed is characterized in that the pressure-sensitive adhesive layer comprises a base polymer, an energy ray-polymerizable carbon-carbon double bond-having multi-functional acrylic oligomer having a mol. wt. of 1,000 to 2,500, and an energy ray-polymerizable carbon-carbon double bond-having multi-functional acrylic compound having a mol. wt. of 200 to 700.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2006323390-A (JP)
Title: Variable focus lens
Inventor: OH BYUNG DO
IPC: G02B3/12
Filed: 2006-05-16
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a variable focus lens capable of preventing performance degradation due to air bubbles by forming a protrusion at one end of a chamber.  <P>SOLUTION: The variable focus lens includes: a fluid chamber having a protrusion formed at one opened end thereof as a cylindrically shaped body to house first and second non-miscible fluids which have different refractive indices respectively; a transparent plate hermetically coupled with one end of the chamber with a predetermined gap from the protrusion of the chamber; and first electrode disposed inside the chamber to act on the first fluid and a second electrode insulated from the first fluid.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007308655-A (JP)
Title: Method for producing light fraction and method for treatment of plastic
Inventor: TAKENAKA JOICHI
IPC: C10G1/10
Filed: 2006-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a light fraction free from chlorine from a chlorine-containing plastic material and provide a method for the treatment of plastic.  <P>SOLUTION: The method for producing a light fraction comprises a dissolution step to heat a mixture containing chlorine, a plastic and a solvent to dissolve the plastic material and obtain a dissolved plastic material, a hydrocracking step to react the dissolved plastic material with hydrogen in the presence of a catalyst to obtain a hydrocracked product, a first separation step to separate the hydrocracked product and obtain the first light fraction, a dechlorination step to add an aromatic magnesium halide compound to the first light fraction and eliminate chlorine in the first light fraction to obtain the second light fraction, and the second separation step to separate and remove chlorine from the second light fraction to obtain a chlorine-free third light fraction.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007310809-A (JP)
Title: Paper sheet processing device, excluded slip accumulating device, and excluded slip accumulating method
Inventor: MUKAI KAZUHIRO
IPC: G07D9/00
Filed: 2006-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a paper sheet processing device which is provided with a separator of one-stage structure to lighten its own weight and surely classifies excluded slips for each processing unit, and also provide an excluded slip accumulating device and an excluded slip accumulating method.  <P>SOLUTION: At first, one section card PC1 is fed to an accumulation vane wheel 33A from a section card feeding part 35. The section card PC1 is accumulated on a mini-shutter 33C and 33C, and the following excluded slips Pr are accumulated on the section card. When processing for one bundle is finished, the mini-shutter is opened, and the excluded paper sheets 1 thus accumulated are accumulated on a backup plate 33D, and, at the same time, a separator 34 is inserted into the mini-shutter. The mini-shutter is closed, and a section card Pc2 for the next bundle is fed and accumulated on the separator. Then, the separator goes down, and inserted shutters 33F and 33F push the excluded paper sheets 1 into a cassette 33E.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007313041-A (JP)
Title: Joint structure and ankle foot orthosis
Inventor: OZAWA RYUTA
IPC: A61F2/66
Filed: 2006-05-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a joint structure which is excellent in durability and which reduces costs for manufacturing, and to provide an ankle foot orthosis using the joint structure where a reaction imparting tool is attached and detached easily and which has high affinity with a living body.  <P>SOLUTION: In the joint structure 1, two joint members 2 and 3 are connected rotatably with a shaft, and the reaction imparting tool 4 imparts reaction force to rotation between the joint members 2 and 3. The reaction imparting tool 4 is provided with: thin pieces 6 connected in the direction of thickness; a first holding body 7 which loosely fits a group of the thin pieces 6 arranged side by side in the direction of thickness movably in the direction of the thickness and holds it; a second holding body 7 which loosely fits another group of the thin pieces 6 arranged side by side in the direction of thickness movably in the direction of the thickness and holds it; and a flexible surrounding body 8 which surrounds the thin pieces 6 to restrict the movable range of the thin pieces 6. The shrinkage of a space S surrounding the thin pieces 6 imparts reaction variably, and the two joint members 2 and 3 are detachably fixed to the first and second holding bodies 7 respectively.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007254258-A (JP)
Title: Nitride semiconductor substrate and method for producing the same
Inventor: UEMATSU KOJI
IPC: C30B29/38
Filed: 2006-05-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a nitride semiconductor substrate and the substrate in which dislocations are not released again from the parts where dislocations are accumulated, while parts other than the accumulated dislocation region are of low dislocation density, so that the area of the low dislocation density can be widen.  <P>SOLUTION: This nitride semiconductor substrate is produced by the steps of attaching a mask the covered parts ϒ of which form a closed loop on an undersubstrate, growing a nitride semiconductor in a vapor phase, forming convex facet hills surrounded with facets on exposed parts Π, forming the covered parts ϒ outlining the exposed parts Π in concavities, growing crystals while maintaining the facet hills of the exposed parts Π and concavities of the covered parts ϒ, excluding dislocations to outside by the action of facets to accumulate on the outlining covered parts ϒ, forming a defect accumulating region H on the covered parts ϒ, and forming low defect density single crystal region Z under the upper facets of the exposed parts Π. After the production of a device, the defect accumulation region H is dissolved by heated KOH or NaOH to separate polygonal chips.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007324330-A (JP)
Title: Circuit board
Inventor: NAKANO SHINYA
IPC: H05K1/02
Filed: 2006-05-31
Abstract: <P>PROBLEM TO BE SOLVED: To restrain lowering of reliability caused by heat generation from a circuit element by raising heat dissipation of a circuit board.  <P>SOLUTION: The circuit board has a wiring layer 20 consisting of a plurality of insulation layers 2, 4 and conductive layers 3, 5 on a metal plate 1, a solder resist layer 7 provided to partially cover the wiring layer 20, an LSI chip 9 provided on the solder resist layer 7 via an adhesion layer 8, and a plurality of metal protrusions 6a provided through the solder resist layer 7 and the adhesion layer 8 in a region below the LSI chip 9. The wiring layer 20 in a region below the LSI chip 9 is provided with a thermal via hole 3a of the conductive layer 3 and the thermal via hole 5a of the conductive layer 5. A plurality of metal protrusions 6a are provided to corresponding positions each on the thermal via hole 5a. The LSI chip 9 is thermally coupled to the metal plate 1 via the plurality of metal protrusions 6a and the thermal via holes 3a, 5a.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007319971-A (JP)
Title: Threading method and machine tool
Inventor: OZAWA SATORU
IPC: B23B1/00
Filed: 2006-05-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a threading method which achieves shortening of a threading time by shortening a threading cycle time, and also to provide a machine tool.  <P>SOLUTION: Threading in the peripheral surface of a workpiece 21 is carried out by successively moving a tool 24 to a machining starting position P1 corresponding to the peripheral surface of the workpiece 21, to a machining feeding starting position P2, to a machining feeding completion position P3, and to a threading receding position P4 while the workpiece 21 is rotated about an axis. In the process of the threading, when the motion of the tool 24 is converted at the machining feeding starting position P2, at the machining feeding completion position P3, and at the threading receding position P4, motions of the tool 24 in a Z-axis direction and in an X-axis direction are simultaneously carried out.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007321426-A (JP)
Title: Lid body for fireproof device, and fireproof container
Inventor: JINNO TAKEO
IPC: E05G1/024
Filed: 2006-05-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lid body for a fireproof container, which can reduce heat conducted from an opening section through a wall surface and penetrated into the interior of the fireproof container, and to provide the fireproof container which can reduce heat penetrated therein.  <P>SOLUTION: The lid body 4 for blocking the opening section 3 of the fireproof container 1 has secured therein a cooling space 18 for storing a medium which vaporizes at a constant temperature, and a vapor channel 20 communicating between the cooling space 18 and the outside of the fireproof container 1, and an external wall 16 of the cooling space 18 makes intimate contact with the internal wall of the opening section 3.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007324406-A (JP)
Title: Substrate treatment method and manufacturing method for semiconductor device
Inventor: HATANO MASAKI
IPC: H01L23/12
Filed: 2006-06-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for supporting a substrate capable of properly supporting the substrate without using an adhesive requiring a temporary fixing property and peeling performance, and capable of properly removing even a support substrate and a manufacturing method for a semiconductor device.  <P>SOLUTION: The support substrate 29 and a wafer (substrate to be treated) W are joined by solid-phase junction between metallic layers 28 (28A and 28B) formed on each joint surface, and the support substrate 29 is removed by polishing the support substrate 29. Accordingly, since an organic adhesive having the temporary fixing property and the peeling performance which have been required in a conventional device is not needed, and a machining process can be carried out to the wafer W without receiving the constraint of a heat-resistant temperature and the chemical resistance of the adhesive, the formation of an insulating film having excellent adhesion and the stable pattern processing of a terminal surface are enabled.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007321967-A (JP)
Title: Wall communicating tube for wall penetration hole, and wall structure using the wall communicating tube
Inventor: ARAI AKIO
IPC: F16L5/00
Filed: 2006-06-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wall communicating tube mountable to hold airtightness in a wall even in through-holes not aligned in the center positions on the external wall material side and internal wall material side of the wall.  <P>SOLUTION: The wall communicating tube 1 is integrally formed in cylindrical shape in whole using flexible and resilient synthetic resin to be fitted through the penetration holes 14, 12 in the wall comprising the external wall material 13 and the internal wall material 11 with a space. The wall communicating tube 1 is formed, at its center, with an extensible part 2 of bellows shape with an outer peripheral diameter L larger than the diameter A of the penetration holes, with a length longer than the space W of the external wall material and internal wall material and with a restorable thickness. A cylindrical internal wall fitting part 3 with a length equal to the thickness B of the internal wall material 12 is formed at one end of the extensible part 2, and a flange part 4 is formed at the tip of the internal wall fitting part 3. A cylindrical external wall fitting part 6 with a length equal to the thickness of the external wall material 13 is formed at the other end of the extensible part 2, and a cylindrical insertion guide part 6 whose length with the length of the external wall fitting part 5 added thereto is longer than the space W between the external wall material 13 and the internal wall material 11 is formed at the tip of the external wall fitting part 5.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007319842-A (JP)
Title: Method for removing odor of effluent and apparatus therefor
Inventor: KOHAMA FUMIO
IPC: D21C11/08
Filed: 2006-06-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for removing an odor of an effluent and an apparatus therefor capable of reducing the odor of the kraft pulp effluent.  <P>SOLUTION: The method enables the removal of the odor of the kraft pulp effluent produced in a pulp mill 1 using an apparatus 2 for treating the effluent. The method comprises a stripping step for obtaining stripping-treated effluent by an air-stripping treatment of the kraft pulp effluent in a deodorizing column 9, an anaerobic treatment step for obtaining anaerobically treated effluent by the anaerobic treatment of the stripping-treated effluent in an anaerobic treatment tank 13, and an aerobic treatment step for obtaining aerobically treated effluent by an aerobic treatment of the anaerobically treated effluent in an activated sludge treatment apparatus 17.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007329575-A (JP)
Title: Mobile terminal
Inventor: SUGAWARA MARIKO
IPC: H04W12/12
Filed: 2006-06-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mobile terminal capable of ensuring stronger security for a possessor of the mobile terminal by countermeasuring an act of interfering with supply of power.  <P>SOLUTION: When a battery cover is opened, a battery removal detection section detects it (S11), discriminates a state of a state storage section (S12), when the discrimination indicates a battery removal inhibit state, positional information of the mobile terminal is acquired from positional information storage section (S14), and a preset notice mail transmission destination is acquired from a setting section (S15). The mobile terminal attaches an address of the preset mail transmission destination to a mail principal text including a message of informing that the battery of the mobile terminal is illegitimately removed and the acquired positional information (S16) and transmits the resulting mail (S18).  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007327667-A (JP)
Title: Hot water storage type water heater
Inventor: HAYASHI SHINICHIRO
IPC: F24H1/00
Filed: 2006-06-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hot water storage type water heater of low costs having a bath reheating function.  <P>SOLUTION: This hot water storage type water heater 100 comprising a hot water storage tank 6 for storing heated hot water of high temperature, a tank circulation circuit 4 comprising a tank circulation pump 5 and circulating hot water of the hot water storage tank 6 through a tank circuit 3B of a heat exchanger 3, and a bathtub circulation circuit 12 for circulating hot water of a bathtub 11 through a bathtub circuit 3A of the heat exchanger 3, and heating and reheating the hot water of the bathtub 11 by the hot water of the hot water storage tank 6, a tank circulation pump 5 is a discharge rate variable pump, and a control portion 16 is disposed to control a discharge rate of the discharge quantity variable pump 5 on the basis of the difference between an outlet hot water temperature T2 and an inlet hot water temperature T1 of the bathtub circuit 3A of the heat exchanger 3, and the difference between the outlet hot water temperature T2 and a target reheating temperature T0 of the bathtub to make the outlet hot water temperature T2 close to the target reheating temperature T0 of the bathtub.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007326116-A (JP)
Title: Continuous casting method for preventing intrusion of contamination source into tundish
Inventor: KITADE SHINICHI
IPC: B22D1/00
Filed: 2006-06-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a continuous casting method by which, when molten steel is poured from a ladle into a tundish through a long nozzle, a process substituted for the conventional preliminary cutting is adopted, thus the intrusion of nonmetallic inclusions into the tundish is prevented, and clean steel is continuously cast.  <P>SOLUTION: When molten steel is poured from the ladle 1 having a sliding nozzle 2 composed of the long nozzle 2a into a tundish, a discard molten steel pot 5 is beforehand arranged at the inside of the tundish 4, padding composed of chromium sand 6 in the long nozzle 2a is opened, thereafter, molten steel comprising the padding composed of the chromium sand 6 is received into the discard molten steel pot 5 from the sliding nozzle 2 in the tundish 4, thereafter, the sliding nozzle 4 is temporarily closed, subsequently, the discard molten steel pot 5 having received the molten steel comprising the padding composed of the chromium sand is removed from the tundish 4, then, the sliding nozzle 2 is opened once more, the molten steel is poured into the tundish 4, and clean steel is continuously cast.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007327378-A (JP)
Title: Mounting structure for spark plug tube
Inventor: TAKEMOTO KAZUHISA
IPC: F02P13/00
Filed: 2006-06-07
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the cost of a tubular member of a spark plug tube and to provide mounting structure for a spark plug tube of simple structure with a small number of components.  <P>SOLUTION: In a mounting structure for the spark plug tube 62 mounted between a cylinder head cover 5 and a spark plug insertion hole 60 formed on the cylinder head 4 of an internal combustion engine, the spark plug tube 62 comprises the tubular member, a seal member 65 formed out of a soft member fitting in the cylinder head cover 5 is installed between the cylinder head cover 5 and the spark plug tube 62, and the spark plug tube 62 is fixed and supported.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007332483-A (JP)
Title: Recycle method for producing fibers from melted wastes
Inventor: HU YAU-JUNG
IPC: B09B3/00
Filed: 2006-06-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a recycle method for recycling melted wastes into fibers, which enables the effective treatment of the wastes, having a more excellent environment-protecting effect and a higher economical efficiency.  <P>SOLUTION: This recycle method for producing the melted wastes into the fibers comprises a process for heating the wastes in a melting oven at a high temperature to melt the wastes into a high temperature liquid state melted liquid, a process for making the heated high temperature melted liquid flow to the position of a fiber-producing machine, and making the high temperature melted liquid flow from the melting oven, and a treatment process for forming the non-solidified high temperature melted liquid into solid fibers by a fiber-producing apparatus, thus producing the fibers from the melted liquid.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007331188-A (JP)
Title: Surface material for hard urethane board and its manufacturing method
Inventor: SEGI YASUHIRO
IPC: B29C63/02
Filed: 2006-06-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a surface material which prevents the occurrence of a pinhole while considering production costs, a method for producing the surface material, and a hard polyurethane board using the surface material.  <P>SOLUTION: The surface material 100 for the hard urethane board is set on the surface of the hard urethane board 102. The surface material 100 is formed by at least laminating a resin film material 100b and a paper material 100a while the film material 100b is brought into contact with a hard urethane foam body 101.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007336696-A (JP)
Title: Overhead earth-wire replacing method by slinger method making use of cable in stop state
Inventor: ONO YOSHIO
IPC: H02G1/02
Filed: 2006-06-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an overhead wire replacing method which allows a user to easily perform replacement between an existing overhead wire using a hanging sheave and a new overhead wire in such a state that only a one-sided circuit is stopped.  <P>SOLUTION: This method comprises a derrick installation process A which arranges a derrick 31a on the side of an upper wire arm tower on a stopped circuit side, a shifting process B which reduces tension by shifting the existing overhead wire P to the sheave 36 for the wire extension of the derrick 31a installed at the top of each tower, a derrick tilting process C which brings the existing overhead wire P near the side of an overhead transmission line R in a stopped circuit state by tilting the derrick 31a, a hanging sheave attaching process D which lashes down a sheave rope to the upper-phase cable of the overhead transmission line R in a circuit stopped state after attaching the sheave to the existing overhead wire P and moving it to the arrangment planned position of the sheave, an exchange process E which removes the existing overhead wire P and concurrently extends the new overhed wire Q, and a recovery process F which recovers the sheave 21 after the completion of the extension of the new overhead wire Q.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007332074-A (JP)
Title: Tablet quickly disintegrable in oral cavity and method for producing the same
Inventor: SEKIKAWA FUJIO
IPC: A61K47/36
Filed: 2006-06-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide tablets quickly disintegrable in the oral cavity, producible relatively easily without using any special equipment and/or technology, and also having such hardness as to be resistant to breakage under production, transportation, storage, etc.  <P>SOLUTION: The tablets each comprise starch, crystalline cellulose and/or powdery cellulose and an active ingredient in the mass ratio of the starch to the crystalline cellulose and/or powdery cellulose of (90:10) to (50:50), wherein the total content of the starch and the crystalline cellulose and/or powdery cellulose is 60 mass% or greater. In producing the tablets, it is preferable that compression molding be carried out after granulating at least the starch to obtain the final tablets.  <P>COPYRIGHT: (C)2008,JPO&INPIT