baber/WOPTO huggingface dataset:
Patent TW-436941-B (TW)
Title: Apparatus and method for deciding bump bonding, and manufacturing apparatus and method for semiconductor component
Inventor: MINAMITANI SHOZO
IPC: H01L21/66
Filed: 1999-08-31
Granted: 2001-05-28
Abstract: When electrodes 13 on an electronic component 150 and electrode portions 21 on a circuit board 20 are bonded via bumps 11, 12 with the electronic component and the circuit board vibrated relatively, a vibration-attenuation detecting device 140 detects a vibration-attenuation caused by proceeding of a bonding between the bumps and electrode portions and a deciding device 141 determines a pass/fail of the bonding based on the vibration-attenuation. The deciding device may determine the pass/fail by comparing a waveform of a pass item with a waveform of a impedance of an ultrasonic oscillator 133, a movement of a nozzle 93, or a feed current to a voice coil motor 121 during the bonding. According to the above constructions, the pass/fail of the bonding of the electronic component and the circuit board can be determined during the bonding. Further, when a bonding condition becomes bad during the bonding, the bonding condition can be changed. Thus an occurrence of a defective can be prevented and an improvement of yields can be achieved.
Patent TW-541171-B (TW)
Title: Methods of fabrication for fibrillar matrices
Inventor: MA PETER
IPC: A61L27/50
Filed: 1999-09-28
Granted: 2003-07-11
Abstract: Methods and compositions are described that provide three-dimensional fibrillar matrices useful as, among other things, structural prosthetics and scaffolds for cells. The porous fibrillar matrices of the present invention have desirable mechanical properties suitable to a variety of applications, including platforms for in vitro cell cultivation, implants for tissue and organ engineering, implants as tendon and facia prosthetics, and product packaging.
Patent TW-468237-B (TW)
Title: Improving method for peeling issue in the integrated circuit processing
Inventor: LEE TZUNG-HAN
IPC: H01L21/76
Filed: 1999-09-28
Granted: 2001-12-11
Abstract: A method for forming integrated circuit is disclosed which can improve the peeling issue in the integrated circuit processing. The peeling issue often occurs at the integrated circuit area near the periphery region. The method for forming the integrated circuit first provides: a substrate on which has a high packing density region and a low packing density region and the high packing density region is adjacent to the low packing density region; and, forming a pattern layer on the low packing density region; then, forming a dielectric on the high packing density region and the pattern layer; finally, planarizing the dielectric.
Patent TW-428326-B (TW)
Title: Semiconductor memory apparatus and its fabricating method
Inventor: TANAKA KAZUO
IPC: H01L27/11
Filed: 1999-10-27
Granted: 2001-04-01
Abstract: The semiconductor memory apparatus (static random access memory: SRAM) includes two load transistors, two driving transistors and two memory grids for transmitting transistor. The SRAM grid includes the followings: semiconductor substrate, on which each transistor is formed; the first inter-layer insulation layer, which is formed on semiconductor substrate; the first contact portion which is formed on the first inter-layer insulation layer; the first wiring layer (node wiring layer, pad layer), which is formed on top of the first inter-layer insulation layer. The first contact portion and the first wiring layer are the metal layer which is composed of metal with high melting point, and the nitride layer of metal with high melting point. According to this invention, high density of wiring and fineness of semiconductor memory apparatus can be obtained.
Patent TW-494026-B (TW)
Title: Stopper rod
Inventor: HANSE ERIC
IPC: B22D41/18
Filed: 1999-11-18
Granted: 2002-07-11
Abstract: The present invention concerns a stopper rod whose gas tightness and rigidity are improved. In particular, the stopper rod of the present invention has means for maintaining the compression of the sealing gasket in contact with the annular sealing surface of the body of refractory material when the stopper rod is brought to a high temperature. According to one embodiment of the invention, these means are furnished by a sleeve comprised of a material with a high coefficient of thermal expansion, the dilatation of which maintains the sealing gasket under compression when the stopper rod is brought to a high temperature.
Patent TW-460269-B (TW)
Title: Seedling raising sheet and seedling transplanter
Inventor: FUKUZUMI YASUYOSHI
IPC: A01C11/02
Filed: 1999-12-09
Granted: 2001-10-21
Abstract: In a seedling raising sheet, a seedling raising and retaining layer 111 formed into a right-angled quadrilateral shape from material having open cells is bonded to a surface of a support film 121 formed into a right-angled quadrilateral shape, and a plurality of accommodating areas 13 capable of accommodating seedling seeds are provided in the seedling raising and retaining layer 111. Thus, the seedling raising sheet can be produced in such a design that a conventional seedling transplanting device is remodeled to a small extent, while alleviating the labor load during transportation of seedlings and avoiding a limitation applied to the suitable transplanting time.
Patent TW-546563-B (TW)
Title: Calculator power-saving indication apparatus and method
Inventor: YANG FENG
IPC: G06F11/30
Filed: 1999-12-17
Granted: 2003-08-11
Abstract: A kind of calculator power-saving indication apparatus and method are disclosed in the present invention. The calculator power saving indication apparatus includes a power mode indication circuit, the first optoelectronic converter and the second optoelectronic converter. The first optoelectronic converter is used to convert the photo energy into a testing electric energy. The second optoelectronic converter is used to convert the photo energy into an operation electric energy. A predetermined value is stored inside the power mode indication circuit in advance, and is capable of receiving the testing electric energy such that a power mode indication signal is outputted according to the comparison result between the testing electric energy and the predetermined value. In the calculator power-saving indication method, a predetermined value is defined at first, and the predetermined value is compared with the testing electric energy obtained from the photo energy conversion. If the testing electric energy is larger than the predetermined value, the indication of power saving is obtained; while if the testing electric energy is smaller than the predetermined value, the indication of no power saving is obtained.
Patent TW-449890-B (TW)
Title: Process for forming cone shaped solder for chip interconnection
Inventor: BROFMAN PETER JEFFREY
IPC: H01L23/485
Filed: 2000-01-03
Granted: 2001-08-11
Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.
Patent TW-I244434-B (TW)
Title: Bonding preparation of composite structured article
Inventor: JUANG YU-HUEI
IPC: B29C70/00
Filed: 2000-01-21
Granted: 2005-12-01
Abstract: A bonding preparation of composite structured article, in which penetration aperture is pre-reserved in the formed structured article. After positioned by the positioner, the fiber in one un-formed structured article is made passed through the penetration aperture to bond the formed structured article and un-formed structured article. After wrapped by an encapsulating package and cured by glue-infused formation, two structured articles can be easily and strongly bonded with structure strength close to that of the streamlined structured article.
Patent TW-507047-B (TW)
Title: Magnetic actuator
Inventor: CLARK RICHARD EDWARD
IPC: H02K33/00
Filed: 2000-02-10
Granted: 2002-10-21
Abstract: The magnetic actuator for reciprocating motion of a compressor diaphragm, piston or the like. The actuator comprises a stator with stator poles 3a, 3b, 3c, excitation windings 6 and a backing plate 7. Non-magnetic support arms 4a, 4b carry arced magnet poles 2a, 2b and actuate a pair of compressed diaphragms 5a, 5b. With the introduction of coil current magnet poles 2a, 2b attracted to the central stator pole 3b and repulsed by outer poles 3a, 3c. A torque about pivot 11 results and hence movement of arms 4a, 4b with consequential actuation of the diaphragms 5a, 5b. Improves performance by increasing the flux produced by the electromagnet thereby reducing flux leakage and fringing.
Patent TW-461220-B (TW)
Title: System and method for merging multiple audio streams
Inventor: ANDERSON RICHARD EUGENE
IPC: G10L19/02
Filed: 2000-02-22
Granted: 2001-10-21
Abstract: A device and method are provided for merging one or more secondary audio channels, received from either a streaming application or from memory, with a primary stream of audio data output from a main audio decoder. In addition to the audio decoder, the device/method employs a controller for processing received secondary audio data in a streaming application, and retrieving from system memory audio PCM data once stored. An audio playback device is provided for formatting the PCM data for mixing with the primary stream of audio data output from the audio decoder. Multiple digital-to-analog converters convert the multiple streams of audio data into analog signals which are then mixed into a single merged audio signal for presentation.
Patent TW-432462-B (TW)
Title: Method for improving oxide quality of split-gate flash memory
Inventor: HUANG JR-MU
IPC: H01L21/00
Filed: 2000-03-09
Granted: 2001-05-01
Abstract: A method for improving oxide quality of split-gate flash memory is introduced. It comprises the following steps. First, provide a substrate and form tunnel oxide, floating gate and polysilicon oxide on the substrate. Second, proceed a thermal oxidation step to form oxide spacer on the sidewall of floating gate and also thicken the poly oxide and tunnel oxide. Thickened tunnel oxide is used as gate oxide of peripheral high voltage device. Third, form a nitride spacer on the sidewall of oxide spacer, then use the nitride spacer as mask to remove the thick oxide that is not covered by nitride spacer, and expose the substrate. Then form a thick oxide again on the exposed substrate. Finally form a control gate on the poly oxide.
Patent TW-461070-B (TW)
Title: Mixed fuse technologies
Inventor: NARAYAN CHANDRASEKHAR
IPC: H01L21/66
Filed: 2000-03-30
Granted: 2001-10-21
Abstract: A plurality of fuses of different types, each type of fuse serving a specific purpose are positioned on a semiconductor integrated circuit wafer, wherein activating one type of fuse does not incapacitate fuses of a different type. Fuses of the first type, e.g., laser activated fuses, are primarily used for repairing defects at the wafer level, whereas fuses of the second type, e.g., electrically activated fuses, are used for repairing defects found after mounting the IC chips on a module and stressing the module at burn-in test. Defects at the module level typically are single cell failures which are cured by the electrically programmed fuses to activate module level redundancies.
Patent TW-466385-B (TW)
Title: Universal robust filterning process
Inventor: LIN CHING-FANG
IPC: G05B13/02
Filed: 2000-04-20
Granted: 2001-12-01
Abstract: A universal robust filtering process is adapted for eliminating the need of prediscretizing a continuous-time differential model into a discrete-time difference model. It provides a universal robust solution to the most general formulation, in the sense that the system dynamics are described by nonlinear continuous-time differential equations, and the nonlinear measurements are taken at intermittent discrete times randomly spaced. The universal robust filtering process includes the procedures of validating the measurement using fuzzy logic, and incorporating factorized forward filtering and backward smoothing to guarantee numerical stability. It provides users a reliable and convenient solution to extracting internal dynamic system state estimates from noisy measurements, with wider applications, better accuracy, better stability, easier design, and easier implementation.
Patent TW-445591-B (TW)
Title: Method for complementary oxide transistor fabrication
Inventor: MAISUUICCHI JAMES A
IPC: H01L21/8238
Filed: 2000-05-03
Granted: 2001-07-11
Abstract: A method of manufacturing an integrated circuit device includes forming a laminated structure having a first side and a second side, the first side includes a first type Mott channel layer and the second side includes a second type Mott channel layer. A first source region and a first drain region is formed on the first side, a second source region and a second drain region is formed on the second side, a first gate region is formed on the second side, opposite the first source region and the first drain region and a second gate region is formed on the first side, opposite the second source region and the second drain region. The first source, the first drain and the first gate comprise a first type field effect transistor and the second source, the second drain and the second gate comprise a second type field effect transistor.
Patent TW-539771-B (TW)
Title: A method and device for simultaneous arc processing and chemical etching
Inventor: YANG JING-TANG
IPC: C23F1/00
Filed: 2000-11-02
Granted: 2003-07-01
Abstract: The present invention relates to an arc processing method and device with simultaneous chemical etching wherein the device comprises a conductive electrode, being the cathode, an auxiliary electrode, being the anode, an conductive fluid, and an non-conductive work piece for processing. Processing, and precision processing in particular, of non-conductive materials is obtained by simultaneous arc discharge and etching that are brought about by chemical reactions associated with cathode and anode. Moreover, the present invention discloses simultaneous arc processing and chemical etching that offers improved processing efficiency over conventional arc processing.
Patent TW-462034-B (TW)
Title: Module for reflection type liquid crystal display device, method of manufacturing the same, and reflection type liquid crystal display device
Inventor: OKUDA SHOJI
IPC: G02F1/1333
Filed: 2000-11-20
Granted: 2001-11-01
Abstract: A MOS transistor, an insulating film and a connecting plug are formed on a silicon substrate, and a surface of the insulating film undergoes a CMP polishing, followed by formation of reflectors. Thereafter, a SiN film is formed as a cover film on the reflectors. Next, SOG is coated onto the cover film, and gaps between the reflectors are buried by the SOG. Subsequently, an SOG film undergoes a CMP polishing using the cover film as a stopper, and a surface thereof is flattened.
Patent TW-581940-B (TW)
Title: Composition and method for releasing organic coating
Inventor: FUJIMOTO HIDEKI
IPC: G03F7/039
Filed: 2000-12-19
Granted: 2004-04-01
Abstract: To provide a composition for releasing an organic coating which can be used broadly, which comprises a releasing solution that can be used in a releasing treatment of organic coating with hardly producing a solvent vapor so that the composing ratio of solvent is hardly changed during operation at a low temperature of nearby 60 to 70 DEG C, and to provide a composition for releasing an organic coating which is useful in the safety of fire without dissolving glass matrix. To provide a composition for releasing an organic coating comprising 5 to 90% by weight of a polar solvent, and 0.01 to 30% by weight of tertiary ammonium compounds, and further optionally 0.1 to 90% by weight of ethylene amine. Because of using said composition for releasing an organic coating, the releasing treatment of an organic coating can be operated at a low temperature of nearby 50 to 70 DEG C, and also suitable for using in the recovery of a glass substrate being used for a crystal displayer.
Patent TW-I280101-B (TW)
Title: Method of filtration of a dairy stream
Inventor: ROTH STEPHEN A
IPC: A23P1/00
Filed: 2001-03-13
Granted: 2007-05-01
Abstract: This invention relates to a method of processing a dairy stream and uses thereof, wherein the method comprises hydrolyzing a lactose component of a dairy stream comprising lactose and a sialyloligosaccharide, and isolating a sialyloligosaccharide component.
Patent TW-I282305-B (TW)
Title: Soft resin pellet and manufacture method thereof
Inventor: MORIYA SATORU
IPC: C08L23/14
Filed: 2001-04-19
Granted: 2007-06-11
Abstract: A soft resin pellet of the present invention comprises at least one liquid having a kinematic viscosity at 25 DEG C ranging from 0.5 to 100,000 cSt and a surface tension at 25 DEG C ranging from 10 to 50 dyn/cm, for example dimethylpolysiloxane, and at least one kind of fine powder of an average particle diameter of not more than 50 mum, for example calcium stearate, which adhere to the surface of pellets of at least one soft resin (A) selected from the group consisting of the resins (i)-(v) below and having a tensile modulus not higher than 1600 MPa with. The above-mentioned soft resin includes (i) specified ethylene/alpha-olefin copolymers, (ii) specified propylene/alpha-olefin copolymers, (iii) unsaturated olefin copolymers constituted of ethylene, an alpha-olefin of 3-20 carbon atoms, and a (non)conjugated polyene monomer, (iv) ethylene/vinyl acetate copolymers containing vinyl acetate at a content ranging from 5 to 40% by weight, and (v) cycloolefin resins. According to the present invention, the soft resin pellets which are much less sticky and excellent in appearance and handling properties in comparison with conventional pelletized soft resin such as olefin copolymer rubbers can be obtained.
Patent TW-523926-B (TW)
Title: High voltage power MOSFET having low on-resistance
Inventor: BLANCHARD RICHARD A
IPC: H01L21/66
Filed: 2001-05-31
Granted: 2003-03-11
Abstract: A power MOSFET is provided that includes a substrate of a first conductivity type. An epitaxial layer also of the first conductivity type is deposited on the substrate. First and second body regions are located in the epitaxial layer and define a drift region between them. The body regions have a second conductivity type. First and second source regions of the first conductivity type are respectively located in the first and second body regions. A plurality of trenches are located below the body regions in the drift region of the epitaxial layer. The trenches, which extend toward the substrate from the first and second body regions, are filled with an epitaxially layered material that includes a dopant of the second conductivity type. The dopant is diffused from the trenches into portions of the epitaxial layer adjacent the trenches.
Patent TW-I231026-B (TW)
Title: Planarized plastic package modules for integrated circuits
Inventor: CALETKA DAVID V
IPC: H01L21/56
Filed: 2001-06-22
Granted: 2005-04-11
Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing 5a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
Patent TW-556427-B (TW)
Title: Video telephone answering machine
Inventor: CHANG STEVEN
IPC: H04M1/00
Filed: 2001-09-19
Granted: 2003-10-01
Abstract: The present invention is a video telephone answering machine, which provides the asynchronous communication between local and remote users in both video and audio signals; wherein, the local user inputs the message through the input device, and stores in the storage device after processing by the signal processing device; when the remote user makes the call and not responded by the local user, the message of the local user will be transmitted to the video phone of the remote user through the telephone interface device; also, the telephone interface device can receive the message transmitted by the remote user using the video phone, and store in the storage device after the processing of the signal processing device, so as to be provided for the local user to listen through the output device.
Patent TW-526564-B (TW)
Title: Method of fabricating semiconductor side wall fin
Inventor: ADKISSON JAMES W
IPC: H01L21/336
Filed: 2001-10-15
Granted: 2003-04-01
Abstract: A double gated silicon-on-insulator (SOI) MOSFET is fabricated by forming epitaxially grown channels, followed by a damascene gate. The double gated MOSFET features narrow channels, which increases current drive per layout width and provides low out conductance.
Patent TW-I276188-B (TW)
Title: Wafer shape evaluating method and device producing method, wafer and wafer selecting method
Inventor: KOBAYASHI MAKOTO
IPC: H01L21/66
Filed: 2001-11-16
Granted: 2007-03-11
Abstract: There are provided a method and an apparatus for evaluating a wafer configuration which can accurately evaluate a peripheral portion of a wafer as compared with the conventional SFQR or the like, which comprises: measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer; providing a first region (W1) within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration; calculating a reference line (10a) or a reference plane (10b) in the first region (W1); providing a second region (W2) to be evaluated outside the first region; extrapolating the reference line (10a) or reference plane (10b) to the second region (W2); analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and calculating the analyzed difference as surface characteristics.
Patent TW-582998-B (TW)
Title: New pyridine-substituted pyrazolopyridine derivatives
Inventor: STASCH JOHANNES-PETER
IPC: A61K31/506
Filed: 2001-11-20
Granted: 2004-04-11
Abstract: The present invention relates to new pyrazolopyridine derivatives of the formula (I), in which R1 represents 4-pyridinyl or 3-pyridinyl; R2 represents H, NH2 or halogen; and salts, isomers and hydrates thereof as stimulators of soluble guanylate cyclase and for use as agents for the treatment of cardiovascular disorders, hypertension, of thromboembolic disorders and ischaemia, sexual dysfunction or inflammation, and for the treatment of disorders of the central nervous system.