Patent GB-1483577-A (GB)
Title: Heat sink assemblies for mounting one or more electric circuits
IPC: H01R43/00
Filed: 1973-08-02
Abstract: 1483577 Heat sink assembly ARD ANSTALT 31 July 1974 [2 Aug 1973 10 Aug 1973 24 Aug 1973 20 Sept 1973] 36803/73 37961/73 40263/73 and 44227/73 Heading H1R A heat sink assembly for mounting an electric circuit element and an electric circuit board; the assembly comprising a first pair of parallel spaced metal plates and a second pair of parallel spaced metal plates at right angles to the first pair; each of the latter being in good thermal contact with at least one of the second pair; the electrical circuit board being spacedly supported intermediately of and parallel to the first pair; and means on one of the first pair of plates and the circuit board for mounting a circuit element within the volume defined by the second pair of plates, the circuit board, and the said one plate of the first pair of plates. The structure members may be of blackened aluminium extrusion or other metal, with added ribs and flanges; and is adapted to high fidelity amplifiers, power units, and selector control elements. In the assembly (Figs. 1, 2 and 3) parallel extrusions 2, 4 have upper and lower inwardly facing flanges 3, 5 and outwardly facing flanges 7, 9 with plural heat dissipation ridges. The flanges support longitudinal extrusions 10 with downwardly extending flanges 11, 13. Control and selector circuit elements A are secured to the latter flanges, and at the base of the channel between extrusions 2, 4 are positioned printed circuit boards B having sockets C engaging elements A. A further extrusion 20 overlies extrusion 10 with dependent flanges 21, 23 engaging the edges of extrusions 2, 4 and providing a web accommodating push buttons and control knobs (not shown). The extrusion may extend laterally with dependent flanges 25, 27 and engage a wood panel D. A base extrusion 30 has an inwardly directed flange 31 supporting flange 9, and a further inwardly directed flange 33 carrying circuit boards B. External flanges 35, 37 support the base extrusion on a support. Flange 7 supports extrusion 10 suspending amplifier element E engaging socket F of board B and shielded by U-shaped extrusion 40 spaced from board B for airflow. High power transistors may be mounted on the exposed web of extrusion 10 for cooling, and the several extrusions are secured together by studs. Plural amplifier elements E are locatable on the sides of extrusions 2, 4, e.g. in stereophonic equipment, and a power supply unit in adjacent extrusions, e.g. 2, 4 linked by a channel extrusion 48 (Fig. 3). A modified modular enclosure (Fig. 4, not shown) comprises outer side extrusions with inwardly directed upper and lower flanges and cooling ribs and inner extrusions with upper and lower flanges extending on each side; a circuit board being horizontally supported from the lower flanges and enclosed by an underlying channel extrusion engaging the outer side extrusions by flanges and internal ridges; external ridges being provided for cooling. The upper flanges are engaged by T-shaped closure extrusions with downwardly extending locating shoulders and intermediate flanges supporting circuit boards engaging connecting blocks of the horizontal circuit board. Cooling ribs are externally provided on the closure extrusions. The several modules may be plugged into a master connection board.