baber/WOPTO huggingface dataset:
Patent TW-202043750-A (TW)
Inventor: LEVINSKI VLADIMIR
IPC: G01N21/93
Filed: 2020-03-16
Abstract: 一種參數穩定之錯位測量改善系統及方法包含：提供選自意欲相同之一批晶圓之一晶圓，包含形成於其上之複數個多層半導體裝置；使用一錯位計量工具來使用複數個測量參數集在該晶圓之至少一第一層與一第二層之間之多個位點處測量錯位，藉此針對該等測量參數集之各者產生經測量錯位資料；針對該等測量參數集之各者自該晶圓之該經測量錯位資料識別及移除一參數相依部分及一平均誤差部分，藉此產生該晶圓之經改善參數穩定之經改善錯位資料。
Patent TW-202040709-A (TW)
Title: Capillary guide device and wire bonding device
Inventor: UCHIDA YOHEI
IPC: H01L21/334
Filed: 2020-03-17
Abstract: A capillary guide device 40 comprises a guide body part 41 that can contact a capillary 8 held by a hole 7h, and a drive part 42 that, by moving the guide body part 41 along an X-axis direction, disposes the guide body part 41 to a position at which the guide body part 41 can contact the capillary 8. The drive part 42 has a table 46 connected to the guide body part 41, a drive shaft 47b extending in the X-axis direction and exhibiting a friction resistance force with the table 46, and an ultrasonic element 47a fixed to an end of the drive shaft 47b and providing an ultrasonic wave to the drive shaft 47b.
Patent TW-202039934-A (TW)
Inventor: LEE MYUNG-HAN
IPC: H01L27/12
Filed: 2020-03-19
Abstract: The present invention relates to an etching composition which includes hydrogen peroxide, an organic acid having at least two carboxylic acid groups, an etching inhibitor, a fluorine compound, an undercut inhibitor, an amine compound, a pH adjusting agent and water as the remaining component, and an etching method of a metal film using the same. In detail, the present invention provides an etching composition that improves etching characteristics of a single metal film or multiple metal films, an etching method of a metal film using the same, and a semiconducting component manufacturing method including a manufacturing process performed by using the etching composition.
Patent TW-202105472-A (TW)
Title: Multiple spacer patterning schemes
Inventor: YANG TZU-SHUN
IPC: H01L21/033
Filed: 2020-04-09
Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a mandrel layer on a substrate, conformally forming a spacer layer on the mandrel layer, wherein the spacer layer is a doped silicon material, and patterning the spacer layer. In another embodiment, a method for forming features on a substrate includes conformally forming a spacer layer on a mandrel layer on a substrate, wherein the spacer layer is a doped silicon material, selectively removing a portion of the spacer layer using a first gas mixture, and selectively removing the mandrel layer using a second gas mixture different from the first gas mixture.
Patent TW-202104530-A (TW)
Title: Thermal storage member
Inventor: MITSUI TETSURO
IPC: B01J13/08
Filed: 2020-04-16
Abstract: The present invention provides a heat storage member having excellent heat storage properties and suppressed color change over time. This heat storage member has: a heat storage sheet, which includes a microcapsule encapsulating a heat storage material; and a colored layer.
Patent TW-202101565-A (TW)
Title: Substrate processing method, semiconductor manufacturing method, and substrate processing apparatus
Inventor: KOBAYASHI KENJI
IPC: H01L21/304
Filed: 2020-04-24
Abstract: In a substrate processing method, a substrate (W) is processed that has on a surface thereof a pattern (PT) including a plurality of structures (W2). The substrate processing method includes (S2) supplying a process liquid to the surface of the substrate (W), (S3) supplying a rinsing liquid for washing out the process liquid to the surface of the substrate (W), and (S4) drying the surface of the substrate (W) by irradiating the surface of the substrate (W) with atmospheric pressure plasma after (S3) the supplying a rinsing liquid to the surface of the substrate (W).
Patent TW-202046429-A (TW)
Title: Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline silicon rod cutting device
Inventor: SAKAI JUNYA
IPC: H01L21/67
Filed: 2020-04-30
Abstract: The present invention realizes a method which prevents metal contamination when cutting a polycrystalline silicon rod. The present invention pertains to a method, for cutting a polycrystalline silicon rod (S), that includes a cutting step for cutting the polycrystalline silicon rod (S) via a cutting tool (133), wherein, during the cutting step, a liquid (L1) is supplied from a first nozzle (14) to a cutting position of the polycrystalline silicon rod (S), and a liquid (L2) is supplied from a second nozzle (15) to a surface of the polycrystalline silicon rod (S).
Patent TW-202104453-A (TW)
Title: Xanthene-based pigment, coloring composition containing the pigment, colorant for color filter and color filter wherein the xanthene-based pigment is represented by the general formula (1)
Inventor: KANDA DAIZO
IPC: C09D7/41
Filed: 2020-05-20
Abstract: The present invention provides a xanthene-based pigment excellent in heat resistance, a coloring composition containing the pigment, a colorant for the color filter containing the coloring composition, and a color filter. The present invention provides a xanthene-based pigment represented by the following general formula (1). [In the formula, each of R1-R9 independently represents a group such as an alkyl group; n is an integer of 1-4; when n is more than 2, the plurality of R9 can be the same or different, and can be bonded to each other through or not through hetero atoms or the like to form a ring; X represents -O-, -S- or -Se-; An represents anion; a is an integer of 1-3, and b represents an integer of 0-3, wherein, the general formula (1) is charge neutral as a whole.].
Patent TW-202145264-A (TW)
Inventor: Du guo-qiang
IPC: H01B5/14
Filed: 2020-05-22
Abstract: 本發明揭示一種傳輸訊號排線結構包含複數接地導體，彼此呈平行設置，相鄰的二接地導體並間隔一適當間距；複數訊號線組彼此呈平行排列，每一該訊號線組包含二條訊號線且設置於相鄰的二該接地導體的該間距之中；一導體層環繞包覆該複數接地導體與該複數訊號線組的組合，並且密切地與該複數接地導體及該複數訊號線組的外表面相接觸。藉此可使傳輸訊號排線整體的體積更輕巧並降低製造成本。
Patent TW-202137333-A (TW)
Title: Power device having lateral insulated gate bipolar transistor (ligbt) and manufacturing method thereof
Inventor: HUANG CHIH-FENG
IPC: H01L21/332
Filed: 2020-05-27
Abstract: The present invention provides a power device which is formed on a semiconductor substrate. The power device includes: plural lateral insulated gate bipolar transistors (LIGBTs) and a forward conductive unit . The plural LIGBTs are connected in parallel each other. The forward conductive unit is connected to the plural LIGBTs in parallel. The forward conductive unit is formed by a PN diode and a Schottky diode connected in parallel, wherein the PN diode and the Schottky diode share a same N-type region in an epitaxial layer, a reverse terminal, an N-type extension region, an field oxide region, a gate, and a P-type well in an epitaxial layer. The N-type region and the P-type well form a PN junction, wherein the PN junction has a staggered comb-teeth interface from a top view. A metal line extends on and along the staggered comb-teeth interface, and staggered contacts the N-type region and the P-type well.
Patent TW-202103556-A (TW)
Title: Aquaculture filtration systems
Inventor: LANDSMAN ANGELA KAYE
IPC: A01K63/04
Filed: 2020-06-19
Abstract: Embodiments of the present disclosure describe aquaculture filtration systems, methods of operating aquaculture filtration systems, and the like.
Patent TW-202201028-A (TW)
Title: Circuit board electrical property test method capable of reducing the testing time of electrical properties of a circuit board
Inventor: WANG GUANG-SHIAH
IPC: G01R31/304
Filed: 2020-06-22
Abstract: A circuit board electrical property test method includes analyzing image files of a plurality of to-be-tested circuit traces of a plurality of to-be-tested circuit boards to calculate the linear distance between the to-be-tested circuit traces, and to establish a short circuit test distance, the to-be-tested circuit traces whose linear distance is not greater than the short-circuit test distance is measured to obtain the short-circuit condition between the to-be-tested circuit traces within the short-circuit test distance, wherein the linear distance between the to-be-tested circuit traces has a maximum distance and the short-circuit test distance is shorter than the maximum distance.
Patent TW-202111037-A (TW)
Title: Optical fiber ribbon and optical fiber cable
Inventor: IWAGUCHI NORIAKI
IPC: G02B6/44
Filed: 2020-06-30
Abstract: This optical fiber ribbon comprises multiple optical fibers covered by a ribbon resin, wherein the ribbon resin is the cured product of a resin composition which contains a base resin and inorganic oxide particles, the base resin containing oligomers, monomers and a photopolymerization initiator.
Patent TW-202120185-A (TW)
Title: Grinding device
Inventor: MISUMI MASARU
IPC: A47J42/10
Filed: 2020-07-30
Abstract: A grinding device comprising a guiding unit. The guiding member includes at least two guiding plates; each of the at least two guiding plates has an inclined surface inclined with respect to the horizontal plane at a designated angle; and the heights from the center of the inclined surfaces on the at least two guiding plates to the horizontal plane of the inlet are different.
Patent TW-202121520-A (TW)
Title: Substrate liquid-treatment method, substrate liquid-treatment device, and computer-readable recording medium
Inventor: IWAI Kazutoshi
IPC: H01L21/67
Filed: 2020-08-13
Abstract: This substrate liquid-treatment method includes: a step of preparing a substrate having a surface including a recess in which a seed layer is layered; a step of supplying an electroless plating liquid to the surface of the substrate to form a liquid film of the electroless plating liquid on the surface while filling the recess with the electroless plating liquid; and a step of adjusting the temperature of the liquid film from a first temperature for depositing metal on the seed layer to a second temperature lower than the first temperature and causing the recess to be buried by the metal from the bottom side so that no voids are formed.
Patent TW-202118365-A (TW)
Title: Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
Inventor: OZKOK AKIF
IPC: H05K3/46
Filed: 2020-08-19
Abstract: The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper.
Patent TW-202102618-A (TW)
Title: Infrared-light-transmitting ink of dark color, and infrared-light-reflecting sheet obtained using same
Inventor: YAMANAKA NAOTO
IPC: C09B47/04
Filed: 2015-09-30
Abstract: In order to satisfy the demand of consumers regarding design attractiveness, an infrared-light-transmitting dark color ink is provided, the ink having a black appearance and attaining high design attractiveness and, despite this, having sufficient infrared-light-transmitting property. The infrared-light-transmitting dark color ink transmits near infrared light having wavelengths of 750-1,500 nm, and comprises a resin component and a pigment component that comprises both a brown pigment, e.g., a benzimidazolone pigment, and a phthalocyanine pigment.
Patent TW-202119659-A (TW)
Title: Superconducting compound quantum computing circuit including a circuit board, first ground electrodes, second ground electrodes, a control signal wiring, and biasing members
Inventor: NAKAMURA YASUNOBU
IPC: H03K19/195
Filed: 2019-10-31
Abstract: A superconducting compound quantum computing circuit includes: a circuit board in which a wiring pattern of circuit elements, which includes quantum bits and observation electrodes for observing the states of the quantum bits, and a ground pattern, which is a ground potential, are formed on a circuit board surface, said circuit board being provided with through-electrodes that connect, within the circuit board, a ground pattern formed on a first surface among the surfaces of the circuit board and a ground pattern formed on a second surface, which is the rear surface of the first surface; first ground electrodes provided with first contact portions that are in contact with the ground pattern formed on the first surface of the circuit board, and first non-contact portions having a shape corresponding to the shape of the wiring pattern formed on the first surface; second ground electrodes provided with second contact portions that are in contact with the ground pattern formed on the second surface of the circuit board; a control signal wiring that is provided with contact spring pins at the tip, said contact spring pins being in contact with a position corresponding to the quantum bits so as to press the first surface of the circuit board against the first ground electrodes, or press the second surface of the circuit board against the second ground electrodes; and biasing members that press the first ground electrodes against the first surface of the circuit board, or press the second ground electrodes against the second surface of the circuit board. The first ground electrodes are in contact with the ground pattern via first extension portions that are formed by superconductors having higher extensibility than the extensibility of the ground pattern. The second ground electrodes are in contact with the ground pattern via second extension portions that are formed by superconductors having higher extensibility than the extensibility of the ground pattern.
Patent TW-202211607-A (TW)
Title: Hybrid-type dc converter
Inventor: OU SHENG-YUAN
IPC: H02M1/10
Filed: 2020-09-09
Abstract: A hybrid-type DC converter includes a main switch unit, a first resonant unit, a second resonant unit, a first transformer, a second transformer, a first rectifying unit, a second rectifying unit, a first filter inductor, a first filter capacitor, a second filter capacitor, an auxiliary switch unit, a current sensor, and a control unit. The control unit operates between a light load mode, a medium load mode, and a heavy load mode according to the magnitude of a DC output current flowing through a load detected by the current sensor, and by controlling the main switch unit and the auxiliary switch unit enable the hybrid-type DC converter to operate as a half-bridge LLC resonant converter, a phase-shifted full-bridge converter, and the half-bridge LLC resonant converter and the phase-shifted full-bridge converter, respectively.
Patent TW-202209992-A (TW)
Title: Safety helmet neck bush capable of adjusting wearing suitability
Inventor: CHEN CHENG-DING
IPC: A42B3/10
Filed: 2020-09-09
Abstract: A safety helmet neck bush capable of adjusting wearing suitability comprises a sleeve body which is provided with an inner side face used for being in contact with the head of a human body and an outer side face opposite to the inner side face; the interlayer bag is arranged on the outer side face of the sleeve body; and the elastic cushion body is suitable for being arranged in the interlayer bag. A user can put the elastic cushion body with proper thickness into the interlayer bag at a preset position according to the head shape and size, then the neck bush is worn on the head, and then the safety helmet is worn, so that a gap between the head and the inner wall of the safety helmet is corrected, and the safety helmet can be worn more properly, tightly and safely.
Patent TW-202127238-A (TW)
Title: Compiler flow logic for reconfigurable architectures
Inventor: KOEPLINGER DAVID ALAN
IPC: G06F12/02
Filed: 2020-09-10
Abstract: The technology disclosed partitions a dataflow graph of a high-level program into memory allocations and execution fragments. The memory allocations represent creation of logical memory spaces in on-processor and/or off-processor memories for data required to implement the dataflow graph. The execution fragments represent operations on the data. The technology disclosed designates the memory allocations to virtual memory units and the execution fragments to virtual compute units. The technology disclosed partitions the execution fragments into memory fragments and compute fragments, and assigns the memory fragments to the virtual memory units and the compute fragments to the virtual compute units. The technology disclosed then allocates the virtual memory units to physical memory units and the virtual compute units to physical compute units. It then places the physical memory units and the physical compute units onto positions in the array of configurable units and routes data and control networks between the placed positions.
Patent TW-202125674-A (TW)
Title: Station and method for cleaning a transport enclosure for the conveying and atmospheric storage of semiconductor substrates
Inventor: BELLET BERTRAND
IPC: H01L21/67
Filed: 2020-09-11
Abstract: A cleaning station (2) for a transport enclosure (3) comprises an articulated robot arm (10) bearing at least one injector (11) and a control unit (12) configured to control the driving of the articulated robot arm (10) to introduce the at least one injector (11) into the rigid casing (4) coupled to the loading port (8) whose door (6) has been previously removed, and to displace the at least one injector (11) by following a predefined trajectory while sweeping the interior of the rigid casing (4) with the cleaning fluid simultaneously with the displacement of the articulated robot arm (10) in the rigid casing (4).
Patent TW-202214100-A (TW)
Title: Production method for purification hermetia illucens oil
Inventor: WU MENG-KUN
IPC: A01K67/033
Filed: 2020-10-07
Abstract: The present invention relates to a method for producing hermetia illucens oil, including: washing hermetia illucens larvae; placing the washed hermetia illucens larvae in a drying space, of which the temperature is between 26 DEG C and 30 DEG C, for 40 to 45 minutes; placing the dried hermetia illucens larvae into a screw oil press machine so that the hermetia illucens larvae is compressed to release hermetia illucens larvae oil; placing the hermetia illucens larvae oil into a supercritical extraction machine for 35 to 45 minutes to obtain a purified hermetia illucens larvae oil, wherein the working pressure is between 14.7 psi and 3600 psi, and the working temperature is between 35 DEG C and 45 DEG C. By means of the screw oil press machine and the supercritical extraction machine, the production time is reduced, which avoids denaturation of extracted material due to high temperature; also, the use of organic solvents is reduced, and the production yield is increased to 95%.
Patent TW-202118685-A (TW)
Title: Hydraulic hose attachment assembly
Inventor: KAMIYA MITSURU
IPC: B62L3/02
Filed: 2020-11-05
Abstract: A hydraulic hose attachment assembly is provided for attaching a hydraulic hose to a hydraulic component for a human-powered vehicle. The hydraulic hose attachment assembly basically includes a hose fastening fitting and a tubular bushing. The hose fastening fitting has an internal passage for receiving the hydraulic hose and a thread portion for screwing to the hydraulic component. The tubular bushing has a hose receiving passage for receiving the hydraulic hose and an outer surface. At least one of the hose fastening fitting and the tubular bushing includes a bypass structure provided to define a hydraulic fluid bypass route for diverting hydraulic fluid disposed around the outer surface of the tubular bushing towards the internal passage of the hose fastening fitting.
Patent TW-202111800-A (TW)
Title: Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
Inventor: NISHIYAMA KOJI
IPC: H01L21/683
Filed: 2016-12-22
Abstract: An outer peripheral end of the substrate is held with a plurality of chuck pins provided at a spin plate abutting against a plurality of portions of the outer peripheral end of the substrate, and the spin plate is rotated about a rotation axis. A cleaning head is moved by a head moving mechanism while being pressed against a back surface of the substrate held by the plurality of chuck pins by the head moving mechanism, and foreign matter on the back surface of the substrate is removed by polishing with the cleaning head. A reaction force against a load applied to the back surface of the substrate by the cleaning head is generated in the substrate by auxiliary pins. Alternatively, the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning head, is further cleaned by a cleaning brush.
Patent TW-202128227-A (TW)
Title: Anti-claudin antibody-drug conjugate and pharmaceutical use thereof
Inventor: YANG YANG
IPC: A61K47/68
Filed: 2020-12-11
Abstract: The present disclosure relates to anti-claudin antibody-drug conjugate and pharmaceutical use thereof. Specifically, the present invention relates to a ligand-drug conjugate shown as formula (Pc-L-Y-D), wherein Pc is anti-Claudin18.2 antibody or antigen-binding fragment thereof, and L, Y and n are as defined in the description.
Patent TW-202204174-A (TW)
Title: 刮刮卡用之刮削器具
Inventor: LIN HSIANG
IPC: B01J2/24
Filed: 2020-12-23
Abstract: 一種刮刮卡用之刮削器具，用以刮除一刮刮卡之一彌封塗層，包含一第一刮板及一第二刮板。第一刮板具有一第一刮削邊緣。第二刮板與第一刮板相疊並固定，並具有一刮刀部。刮刀部具有一第二刮削邊緣。其中，第二刮削邊緣與第一刮削邊緣錯位，且第一刮削邊緣與刮刮卡之彌封塗層接觸之長度小於第二刮削邊緣與刮刮卡之彌封塗層接觸的長度。
Patent TW-202139404-A (TW)
Title: Semiconductor structure and method of making the same
Inventor: PENG SHIH-WEI
IPC: H01L23/522
Filed: 2021-01-14
Abstract: A semiconductor structure includes: a buried power rail disposed between a first fin structure and a second fin structure on a substrate extending in a first direction in a horizontal plane, the first fin structure located in a first cell, the second fin structure located in a second cell abutting the first cell at a boundary line extending in the first direction, the buried power rail providing a first voltage; and a metal one (M1) metal track disposed in a M1 layer extending in a second direction in the horizontal plane. At an intersection of the buried power rail and the M1 metal track, the semiconductor structure further includes an electrically conductive path to provide the first voltage to the M1 metal track, the electrically conductive path having a first metal zero (M0) metal track extending in the first direction over the boundary line.
Patent TW-202209544-A (TW)
Inventor: CHENG WEN-HAO
IPC: H01L21/20
Filed: 2021-01-29
Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.
Patent TW-202147021-A (TW)
Title: Pellicle frame, pellicle, exposure original plate with pellicle and exposure method, and method for manufacturing semiconductor device or liquid crystal display board
Inventor: YANASE YU
IPC: G03F1/64
Filed: 2021-02-02
Abstract: The present invention provides a frame-shaped pellicle frame having an upper end surface on which a pellicle film is provided and a lower end surface facing a photomask, characterized in that the inner surface of the pellicle frame has a region where a roughness curve kurtosis (Rku) is 3.0 or less, and also provides a pellicle, an exposure original plate with a pellicle and an exposure method, and a method for manufacturing a semiconductor device or a liquid crystal display board. The present invention can provide a pellicle frame that prevents scattered light derived from the frame and facilitates inspection of foreign matter adhered to the frame surface, and can also provide a pellicle using the pellicle frame.