baber/WOPTO huggingface dataset:
Patent TW-578251-B (TW)
Title: Apparatus and method for conveying substrate
Inventor: SAGA KOICHIRO
IPC: B65G49/00
Filed: 2000-12-29
Granted: 2004-03-01
Abstract: The purpose of the present invention is to provide a substrate conveying apparatus capable of forming an integrated airtight space between a normal substrate processing apparatus, which is not assembled in the substrate conveying unit, and a substrate-conveying container. The substrate conveying apparatus comprises a frame-shape main body 11 for accommodating the substrate W; the an upper opening (the first opening) 12 disposed on the main body 11, which maintains an airtight condition with outside and connects to the bottom opening (substrate conveying opening) 32 of the container 3; a sidewall opening (the second opening) 13 disposed on the main body 11, which maintains an airtight condition with outside and connects to the substrate conveying opening 52 of the substrate processing apparatus 5; an exhaust tube 15 connected to the main body 11; an opening/closing mechanism 16, which performs opening and closing onto the bottom cap 33 of the bottom opening 32 under the state of connecting the upper opening 12 to the bottom opening 32 of the container 3; and conveying mechanisms 17, 18 disposed inside the main body 11 for conveying the substrate W.
Patent TW-498001-B (TW)
Title: System and method for forming sheet metal using a reconfigurable tool
Inventor: PAPAZIAN JOHN M
IPC: B21D37/02
Filed: 2001-01-16
Granted: 2002-08-11
Abstract: A system for forming sheet metal (118) is disclosed. The system comprises a support plate (102) that is coupled to a base (108) and has at least one side plate (104) adjacent thereto. A clamping mechanism (200) fixes the side plate (104) to the support plate (102) so sheet metal (118) can be formed.
Patent TW-569309-B (TW)
Title: Process and apparatus for forming semiconductor thin film
Inventor: HIRAOKA KENZO
IPC: C23C16/452
Filed: 2001-03-16
Granted: 2004-01-01
Abstract: A substrate M having a thin film on its surface is supported on a support 4. A gas discharge opening 12A of hydrogen radicals which faces the thin film on the substrate is provided. A semiconductor thin film is deposited on the substrate M by supplying the thin film with hydrogen radicals H from the gas discharge opening 12A while the substrate M is cooled via to 40 K or less through heat conduction via the support 4 by means of refrigerator 3.
Patent TW-504665-B (TW)
Title: Programmable speech processing system
Inventor: JENG TIAN-YAU
IPC: G06F17/00
Filed: 2001-04-19
Granted: 2002-10-01
Abstract: A programmable speech processing system is disclosed for solving the cost problem of using the 6-bit digital signal processor (DSP) and the problem of tedious computation in the traditional speech decompression algorithm, speech compression algorithm and speech recognition algorithm. Only 8-bit microprocessor as the basic structure and a 16-bit algorithm coprocessor are required by the present invention for achieving the purpose of speech processing, so that not only the quality is not affected, but the cost also can be reduced.
Patent TW-512097-B (TW)
Title: Ink, image recording process, ink cartridge, recording unit, ink set, crust-preventing method and image forming apparatus
Inventor: WATANABE TOMONARI
IPC: C09D11/00
Filed: 2001-06-21
Granted: 2002-12-01
Abstract: An ink comprises a coloring material and an aqueous medium wherein the coloring material contains a self-dispersing type carbon black, in which self-dispersing carbon black a hydrophilic group combines with the surface of a carbon black directly or through another atomic group, and which ink contains potassium ion in an amount of 0.6% or more of the weight of the carbon black.
Patent TW-495465-B (TW)
Title: Swing arm type suspension for vehicles
Inventor: GOGO KAZUHIKO
IPC: B62K25/20
Filed: 2001-07-18
Granted: 2002-07-21
Abstract: One end of a swing arm (32) is swingably mounted on a pivotal shaft (31) mounted on a power unit (16), a rear wheel is rotatably mounted on the other end of the swing arm (32), the upper end of the cushion unit (34) is mounted on the switch arm (32), and a lower end of the cushion unit (34) is connected to the power unit (16) by a power unit swing shaft (55) located at a lower part with respect to the pivotal shaft (31), through a link mechanism (37). To improve the driving performance and the productivity of a vehicle by mounting fixtures together such as the electrical equipment on a car body frame without mounting an upper end of a cushion unit to the car body frame such as a seat frame or the like, to minimize the vehicle, and to increase a degree of freedom in the design of the car body frame.
Patent TW-579397-B (TW)
Title: Side cutter for sewing machine
Inventor: NISHI SABURO
IPC: D05B37/06
Filed: 2001-08-07
Granted: 2004-03-11
Abstract: A side cutter for a sewing machine enables the sewing machine to carry out sewing and cutting of cloth irrespective of its thickness and can be attached and detached to and from the sewing machine body easily and speedily. The side cutter 50 for a sewing machine has a holder coupling section 69 formed behind a presser foot 53 located under a frame body 52, and a link frame 56 is attached to the frame body 52 to transmit a vertical movement of a sewing machine needle to movable blade 55. The movable blade 55 is fixed to a lower front end portion of the link frame 56 through a spring washer 70.
Patent TW-507056-B (TW)
Title: A seal
Inventor: SHANNON ROD
IPC: F16L21/035
Filed: 2001-08-15
Granted: 2002-10-21
Abstract: In a first aspect, the invention provides a seal (1) for sealing first and second components in an assembly. The seal includes a base (2), a first sealing portion (3) and a second sealing portion (4). The seal is adapted to be located by the base (2) on the first component with the first sealing portion (3) protruding beyond the second sealing portion (4). Rims (5, 6) are relatively disposed and interconnected such that engagement of the second component with the seal (1) compresses the first portion (3) to form a first seal with the first rim (5) and said compression urges the second rim (6) into engagement with the second component, to form a second seal between the first and second components. In a second aspect, the invention provides a pipe system including a first pipe section (51) having a male end (52) and a second pipe section (53) having a complementary female end (54). The male and female ends (52, 54) are adapted for connection in overlapping relationship to join the pipe sections together. The male end (52) or the female end (54) incorporate a first circumferential recessed channel (60) disposed to permit a limited extent of relative radial displacement of the female end (54) in response to axial misalignment between the pipe sections, thereby to accommodate a limited degree of relative rotational displacement about an axis normal to the axes of the adjoining pipe sections.
Patent TW-508283-B (TW)
Title: Method and device for assembling Ti alloy enclosure component for notebook computer
Inventor: LIAN HAN-BIN
IPC: B23K9/16
Filed: 2001-08-23
Granted: 2002-11-01
Abstract: The present invention relates to a method and a device for assembling a Ti alloy enclosure component for a notebook computer, which mainly uses a shape-copying mold and an argon welding technique to weld a combination seat and an enclosure body into an integral body. The main objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component for a notebook computer, which simplifies the formation procedure of a Ti alloy enclosure and reduces the technical complexity in producing an enclosure. A second objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component of a notebook computer, which can use an automatic control technique to achieve an automated operation to increase the production speed of a Ti alloy enclosure. Another objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component of a notebook computer, which increase the production rate and quality stability of the Ti alloy enclosure to reduce the production cost.
Patent TW-I237637-B (TW)
Title: 5-trityloxymethyl-oxazolidinones and process for the preparation thereof
Inventor: HOLLWGSWORTH RAWLE I
IPC: C07D263/24
Filed: 2001-09-19
Granted: 2005-08-11
Abstract: A method for preparing protected, preferably chiral, 5-trityloxymethyl-oxazolidinone in one step directly from optically active 3-hydroxy-4-trityloxy butyramide is described. Oxazolidinones are an important class of molecules in the pharmaceutical industry especially in the areas of antimicrobials and behavioral disorders.
Patent TW-I224094-B (TW)
Title: Stabilizing rhodium catalysts for the hydroformylation of olefins
Inventor: ROTTGER DIRK DR
IPC: C07B61/00
Filed: 2001-09-25
Granted: 2004-11-21
Abstract: The invention relates to a process for manufacturing aldehydes having 3 to 21 carbon atoms by hydroformylation of the corresponding olefins with rhodium catalysts, characterized in that the discharge of the hydroformylation reactor (a) is separated into a gaseous phase and a liquid phase, (b) the liquid phase is separated into a top fraction containing unconverted olefins and aldehydes and a bottom fraction containing the rhodium catalyst, and (c) the bottom fraction is cooled below the temperature of the discharge of the hydroformylation reactor and a gas containing carbon monoxide is fed in.
Patent TW-I225514-B (TW)
Title: Shelf stable haze free liquids of overbased alkaline earth metal salts, processes and stabilizing halogen-containing polymers therewith
Inventor: REDDY JAMES E
IPC: C07C57/12
Filed: 2001-10-30
Granted: 2004-12-21
Abstract: Shelf stable haze free liquids of overbased alkaline earth metal salts are obtained by reacting metal base with fatty acids in the presence of liquid hydrocarbon and aliphatic alcohols having at least 8 carbon atoms to provide overbased liquids essentially free of a phenol or a phenolic derivative. Stabilizer compositions containing the overbased liquids and mixed metal stabilizers of zinc, cadmium and tin are provided for stabilizing halogen-containing polymers.
Patent TW-510858-B (TW)
Title: Fluid injection head structure and method thereof
Inventor: HUANG TSUNG-WEI
IPC: B41J2/16
Filed: 2001-11-08
Granted: 2002-11-21
Abstract: A fluid injection head structure is provided. The fluid injection head structure formed on a substrate has a manifold, at least two rows of chambers adjacent to the manifold in flow communication with the manifold, at least one bubble generator, and a conductive wire disposed on a top surface of the substrate. A portion of the conductive wire disposed between the two rows of the chambers is used to drive the bubble generator.
Patent TW-505818-B (TW)
Title: Single sensor chip digital stereo camera
Inventor: SILVERSTEIN D AMNON
IPC: H04N13/239
Filed: 2001-11-14
Granted: 2002-10-11
Abstract: A digital stereo camera (10) using a single sensor array (20) to take both left and right images for stereo (three-dimensional) image capture. In one embodiment, a micro-lens array (16) is used to focus, at a first instant in time, light (""left light"") from a left lens system (12) onto a sensor array (20) for left image capture. Then, the micro-lens array (16) is moved to focus light (""right light"") from a right lens system (14) onto the sensor array (20) for right image capture. In another embodiment, a portion of the left light (the portion having a first polarized direction) and a portion of the right light (the portion having a second polarized direction) are directed to a sensor array (52); the second polarized direction being orthogonal to the first polarized direction. To capture the left image, a polarization filter (56) is used to allow the left light (having the first polarized direction) to pass toward the sensor array (52) while preventing the right light (having the second polarized direction) from reaching the sensor array (52). To capture the right image, polarization direction of the polarization filter (58) is switched to allow only the right light (having the second polarized direction) to reach the sensor array (52).
Patent TW-I237412-B (TW)
Title: Method for manufacturing semiconductor wafer
Inventor: QU WEI-FEIG
IPC: H01L21/762
Filed: 2001-11-26
Granted: 2005-08-01
Abstract: A method for manufacturing a semiconductor wafer wherein a semiconductor wafer having a sufficient lattice strain to enhance electron mobility and having an Si layer of less crystal defect despite of a relatively simple laminate structure is manufactured by a simple process. This manufacturing method comprises the step of epitaxial growth of an SiGe layer on the surface of a first silicon single crystal wafer, the step of coupling the surface of the SiGe layer with the surface of a second wafer with an oxide film in between, and the step of thinning off the first silicon single crystal wafer coupled with the second wafer to expose the Si layer with involved lattice strain.
Patent TW-520558-B (TW)
Title: Wafer level chip scale packaging process
Inventor: HUANG CHUAN-DE
IPC: H01L23/28
Filed: 2001-12-07
Granted: 2003-02-11
Abstract: A kind of wafer level chip scale packaging (WLCSP) process is disclosed in the present invention. In the invention, after completing bond pad redistribution trace, by using the lamination encapsulation method, an organic dielectric encapsulation film is laminated. An opening filled with metal pillar is formed on the dielectric encapsulation film by using laser drill technique. Because the molding process of the conventional packaging technique is not required when performing the encapsulation of the wafer surface in the present invention, expensive cost expended for the molding equipment can be saved and additionally, the tape cost required in the molding process can also be saved. Furthermore, the formation of hole due to the bubble trapped in the encapsulation film when performing the encapsulation of the molding process can be avoided. Therefore, the process yield can be increased.
Patent TW-541500-B (TW)
Title: Pressure sensitive pen
Inventor: CHAO CHING-CHUAN
IPC: G06F3/041
Filed: 2001-12-26
Granted: 2003-07-11
Abstract: A pressure sensitive pen is provided. The pressure sensitive pen comprises a core body, an elastic element, a first magnetic body having one coil formed of at least one wire wound around, a second magnetic body, a sliding member, a hollow cylindrical body with an annular element formed therein and an inductance-capacitance type resonance circuit. The resonance circuit is electrically connected with the first magnetic body having one coil formed of at least one wire wound around. When a force is upward applied on the core body, the force is further applied on the sliding member through the core body such that the sliding member in conjugation with the second magnetic body move upward and make the elastic element deformed, and changing a predetermined distance between the first magnetic body and the second magnetic body, thereby changing an inductance generated by the coil, and the resonance frequency of the resonance circuit is thus changed.
Patent TW-I234580-B (TW)
Title: Acrylic adhesive compositions for polarizing film and polarizer film using the same
Inventor: CHANG SUK-KY
IPC: C09J7/02
Filed: 2001-12-28
Granted: 2005-06-21
Abstract: The present invention provides an acrylic pressure sensitive adhesive composition having an element with a positive stress optical coefficient for a polarizing film and a polarizing film using the same.
Patent TW-I280630-B (TW)
Title: Semiconductor substrate jig and method of manufacturing a semiconductor device
Inventor: TESHIROGI KAZUO
IPC: H01L21/00
Filed: 2002-03-20
Granted: 2007-05-01
Abstract: The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
Patent TW-I248438-B (TW)
Title: Derivatives of heterocycles with 5 members, their preparation and their use as medicaments
Inventor: HARNETT JERMIAH
IPC: C07D263/32
Filed: 2002-03-26
Granted: 2006-02-01
Abstract: The invention relates to derivatives of thiazoles, oxazoles or imidazoles having at least one of the following pharmacological activities: inhibition of monoamine oxidases (MAO's); inhibition of lipidic peroxidation; modulation of sodium channels. These compounds include for example: 2,6-ditert-butyl-4-{2-[2-(methylamino)ethyl]-1,3-thiazol-4-yl}phenol; and 4-methylpentyl 2-[4-(1,1'-biphenyl-4-yl)-1H-imidazol-2-yl]ethylcarbamate. As a result of their pharmacological properties, said compounds can in particular be used to treat one of the following disorders or diseases: Parkinson's disease, senile dementia, Aizheimer's disease, Huntington's chorea, amyotrophic lateral sclerosis, schizophrenia, depressions, psychoses, migraine or pains and in particular neuropathic pains.
Patent TW-564628-B (TW)
Title: Voice conference system on Internet and the method thereof
Inventor: SHIUE DE-HUEI
IPC: H04L12/00
Filed: 2002-04-09
Granted: 2003-12-01
Abstract: The present invention discloses a voice conference system and method comprising a plurality of voice over packet processors (VOPP), which employs the voice application on Internet, that is voice over Internet protocol (VoIP), to proceed the conference, and uses a transmission interface to connect with at least one input/output port on each VOPP in the system to conduct the transmission or exchange of voice signals between different VOPPs. Thus, it can effectively use the resources on each VOPP, enhance the efficiency for each channel in each VOPP, and further mix the voice signals on the plurality of VOPPs to achieve the conference function.
Patent TW-533496-B (TW)
Title: Etching method of controlling contact hole critical dimension
Inventor: JU BEI-HUNG
IPC: H01L21/302
Filed: 2002-05-20
Granted: 2003-05-21
Abstract: This invention discloses an etching method of controlling contact hole critical dimension. Firstly, on a substrate surface, a dielectric layer, a buffer layer and a photoresist pattern layer are deposited sequentially, in which there is a first opening in the photoresist pattern layer exposing the surface of the buffer layer. Then, a first etching process is carried out on the surface of the buffer layer to form a second opening underneath the first opening to expose the surface of the dielectric layer, in which the bottom width of the second opening is smaller than its top width and smaller than the width of the first opening. Finally, a second etching process is performed on the surface of the dielectric layer to form a contact hole exposing the surface of the substrate, in which width of the contact hole is approximately the same as that of the first opening. The above-mentioned first etching process uses a gas mixture of fluorocarbon gas and oxygen as an etching gas, in which flow rate of the fluorocarbon is 40-60 sccm and flow rate of oxygen is 2-6 sccm.
Patent TW-571497-B (TW)
Title: Power converter
Inventor: JANSEN ARIAN M
IPC: H02M3/28
Filed: 2002-06-04
Granted: 2004-01-11
Abstract: The invention is a power converter having a transformer with a primary side winding and a secondary side winding. Both the primary side and the secondary side have switches which are switched on and off alternately. When the primary master switch is switched on, the transformer charges. When the primary master switch is switched off, the intrinsic capacitance of the secondary slave switch discharges generating the zero voltage switching condition for the secondary slave switch. The secondary slave switch is switched on at a time determined in accordance with the waveform generated by the transformer. When the secondary slave switch is switched on, the transformer discharges and ultimately the charge from an output capacitor flows into the transformer as a backflow which charges the transformer. The secondary slave switch is switched off at a time determined in accordance with a current flowing through said secondary switch. The intrinsic capacitance of primary master switch discharges generating the zero voltage switching condition for primary master switch which is then switched on and the cycle repeats.
Patent TW-I278640-B (TW)
Title: Circuit pattern inspection device, circuit pattern inspection method, and recording medium
Inventor: YAMAOKA SHUJI
IPC: G01R31/304
Filed: 2002-06-11
Granted: 2007-04-11
Abstract: The invention is to provide a circuit inspection device capable of surely and easily detecting defects of a circuit board. Disclosed is a circuit-pattern inspection apparatus comprising a power supply element 30 adapted to be capacitively coupled with a parallel array of conductive patterns 20 to supply an inspection signal to one end of each of the conductible patterns, an open sensor 40 adapted to be capacitively coupled with all of the other ends of the conductive patterns to detect the inspection signal, and a short sensor 50 arranged at a position displaced from the power supply element 30 and adapted to be capacitively coupled with two lines of the conductive patterns to detect the inspection signal. The quality of the conductive pattern is inspected such that the presence of disconnection is determined when the detect signal from the open sensor 40 is largely reduced, and the presence of short is determined when the detect signal from the short sensor 50 largely rises and then falls. The circuit-pattern inspection apparatus can detect defects in a circuit board reliably and readily.
Patent TW-586000-B (TW)
Title: Temperature detection circuit and method
Inventor: PAI CHUNG-LUNG
IPC: G05F3/26
Filed: 2002-07-25
Granted: 2004-05-01
Abstract: The present invention discloses a temperature detection circuit and method capable of generating a signal when temperature reaches a target temperature. The temperature detection circuit includes the serially connected first current source and the second current source. The first current source generates the first current that is proportional to the absolute temperature. The second current source is provided with a temperature-independent reference voltage for generating the second current that is proportional to the reference voltage. The first and the second currents are the first reference current and the second reference, respectively, at a reference temperature. The first and the second current sources are designed to make the ratio of the second reference current to the first reference current proportional to the ratio of the target temperature to the reference temperature.