baber/WOPTO huggingface dataset:
Patent TW-462001-B (TW)
Title: Method for applying common address to allow data sharing between application programs and using application programs to make access of peripheral machines easy
Inventor: YOSHIDA TAKASHI
IPC: G06F12/02
Filed: 2000-04-15
Granted: 2001-11-01
Abstract: The present invention provides a method by which peripheral apparatuses or memories are accessed from the application program of a computer as if ordinary addresses are read/written, and a computer-readable recording medium in which software for realizing the method is recorded. In details, the present invention is realized as follows: a continuous memory space is secured independently of the management of an operating system; shared address names are allocated to respective constant-width blocks of the memory space; selection can be made as to whether the respective blocks are used at least as memory regions as they are or used for accessing peripheral apparatuses; and data as the contents of the memories are written in those blocks used as memory regions and the information of the peripheral apparatuses which are accessed are written in those blocks used for accessing the peripheral apparatuses.
Patent TW-544835-B (TW)
Title: Bonding pad design
Inventor: HAN TZUNG-LI
IPC: H01L21/68
Filed: 2000-05-04
Granted: 2003-08-01
Abstract: A kind of bonding pad design is disclosed in the present invention. In addition to the original bonding pad connected to the bump, the bonding pad of testing for contact with the probe when conducting the test is added. A conduction wire is connected between the test bonding-pad and the bonding pad connected to the bump. Thus, it is capable of preventing the bonding pad connected to the bump from being scratched by the probe and avoiding damage of the bump.
Patent TW-I241187-B (TW)
Title: Levodopa/carbidopa/entacapone pharmaceutical composition
Inventor: KALLIOINEN SARI
IPC: A61K47/44
Filed: 2000-05-26
Granted: 2005-10-11
Abstract: The present invention relates to a pharmaceutical composition, especially to an oral solid composition, comprising pharmaceutically effective amounts of entacapone, levodopa and carbidopa or their pharmaceutically acceptable salts or hydrates and a pharmaceutically acceptable excipient, wherein the excipient is a sugar alcohol or starch, or a sugar alcohol and starch. Entacapone, levodopa and carbidopa are useful for treating Parkinson's disease.
Patent TW-459350-B (TW)
Title: Semiconductor device with repair fuses and laser trimming method used therefor
Inventor: FUJII HIDEKI
IPC: H01L23/525
Filed: 2000-06-07
Granted: 2001-10-11
Abstract: A semiconductor device with repair fuses is provided, which decrease the fuse pitch and the fuse occupation area without short circuit among the adjoining repair fuses and damage to the semiconductor device itself. The device comprises (a) a semiconductor substrate; (b) elongated repair fuses having an equal width b formed on the substrate; the fuses being arranged in substantially parallel to each other at a pitch a; (c) a layer formed to cover the fuses; the layer having an opening that exposes the fuses and that allows the fuses to receive a laser beam from the outside; the beam having a placement tolerance h for each fuse; the beam being designed to form an irradiation area with a diameter d for each fuse in the opening; the irradiation area for each fuse being arranged along a virtual zigzag shape in the opening; and (d) a relationship of d ≥ a ≥ (b+d/2 + h) is established. Preferably, each fuse has a reference point at a middle point of its exposed part from the opening. Each area is located in such a way that a center of the area has an offset distance e from the reference point of the corresponding fuse. The offset distance e satisfies the relationship of 2e ≥ (d<SP>2</SP>-a<SP>2</SP>)1/2. It is preferred that the opening is substantially rectangular.
Patent TW-482850-B (TW)
Title: Buckling restrained braces and damping steel structures
Inventor: TAKEUCHI TORU
IPC: E04B2/56
Filed: 2000-06-29
Granted: 2002-04-11
Abstract: The present invention relates to a buckling restrained brace capable of absorbing vibration energy produced by an earthquake, wind power and the like, in a building and a steel structure. The buckling restrained brace of the present invention is accomplished by a buckling restrained brace 1 wherein a steel-made center axial member 3 is passed through a buckling-constraining concrete member 2 reinforced with a steel member 6, and an adhesion-preventive film 4 is provided to the interface between the steel-made center axial member and buckling-constraining concrete 5, the adhesion-preventive film showing a secant modulus in the thickness direction of at least 0.1 N/mm<SP>2</SP> between a point which shows a compressive strain of 0% and a point which shows a compressive strain of 50%, and up to 21,000 N/mm<SP>2</SP> between a point which shows a compressive strain of 50% and a point which shows a compressive strain of 75%, and having a thickness dt in the plate thickness direction of the steel-made center axial member and a thickness dw in the plate width direction thereof from at least 0.5 to 10% of the plate thickness t and from at least 0.5 to 10% of the plate width w, respectively, and by the application of the buckling restrained brace to a damping steel structure.
Patent TW-I235667-B (TW)
Title: Erythropoietin derivatives
Inventor: BAILON PASCAL SEBASTIAN
IPC: A61K47/48
Filed: 2000-06-30
Granted: 2005-07-11
Abstract: The present invention refers to conjugates of erythropoietin with poly(ethylene glycol) comprising an erythropoietin glycoprotein having at least one free amino group and having the in vivo biological activity of causing bone marrow cells to increase production of reticulocytes and red blood cells and selected from the group consisting of human erythropoietin and analogs thereof which have sequence of human erythropoietin modified by the addition of from 1 to 6 glycosylation sites or a rearrangement of at least one glycosylation site; said glycoprotein being covalently linked to ""n"" poly(ethylene glycol) groups of the formula -CO-(CH2)x(OCH2CH2)m-OR with the carbonyl of each poly(ethylene glycol) group forming an amide bond with one of said amino groups; wherein R is lower alkyl; x is 2 or 3; m is about 450 to about 900; n is from 1 to 3; and n and m are chosen so that the molecular weight of the conjugate minus the erythropoietin glycoprotein is from 20 kilodaltons to 100 kilodaltons.
Patent TW-I256976-B (TW)
Title: Method of patterning an ITO layer
Inventor: PENG CHIH-YU
IPC: C23C14/04
Filed: 2000-08-04
Granted: 2006-06-21
Abstract: A method of patterning an indium tin oxide (ITO) layer is performed on a glass substrate. First, using sputtering, an amorphous ITO layer is deposited on the glass substrate. Then, using excimer laser annealing (ELA), the amorphous ITO layer within a predetermined pattern is turned into a crystalline ITO layer. Finally, using an etch solution, the amorphous ITO layer outside the predetermine pattern is removed.
Patent TW-445540-B (TW)
Title: Bundle concentrating type multi-chamber plasma reacting system
Inventor: CHEN CHING-AN
IPC: C23C16/507
Filed: 2000-08-07
Granted: 2001-07-11
Abstract: An inductance coupling type plasma reacting system includes a specially configured sensing coil disposed on the via of the reacting chamber. The sensing coil is formed by multiple hollow alumni rings and coil units arranged in parallel with the hollow alumni rings respectively. The adjacent coil units have currents flown through in opposite directions. The sensing coil is helpful in reducing the coupled capacitance between the sensing coil and the plasma, thereby decreasing the sheath voltage and the damage to the device in the plasma process. The specially designed bundle concentrating type multi-chamber plasma reacting system is also provided. A plurality of working platens are formed on the chip pad. With electrostatic suction, it is able to process multiple small-sized chips at the same time. Therefore, the present invention is particularly suitable for the semiconductor etching and chemical depositing processes.
Patent TW-I285550-B (TW)
Title: s for combating menopausal hot flushes Use of CGRP antagonists and CGRP release inhibitor
Inventor: KLAUS RUDOLF
IPC: A61P5/30
Filed: 2000-08-08
Granted: 2007-08-21
Abstract: The invention relates to the use of CGRP antagonists and CGRP release inhibitors for treating menopausal hot flushes as well as corresponding pharmaceutical compositions containing as active substance one or more CGRP antagonists and/or CGRP release inhibitors, and the preparation thereof.
Patent TW-517354-B (TW)
Title: Wiring board and electronics
Inventor: KONNO TOSHIKAZU
IPC: H01L23/538
Filed: 2000-08-29
Granted: 2003-01-11
Abstract: To provide a wiring board conducting high-speed memory control when plural D-RDRAM and the like are mounted as main memories. Chip mounting parts 31a and 31b are provided with the signal pads P of third, fifth, eights and tenth columns, to which the respective terminals of a signal terminal string are connected; through holes T and repeating through holes M which are arranged in accordance with the signal pads P; wiring patterns Q1 to Q4 connecting the signal pads P and the through hole T; the wiring patterns Q5 and Q6 of fifth and sixth columns, which connect the signal pads P of the fifth and eighth columns and the ends of the first layer 20-side of the repeating through holes M in the fifth and eights columns; and the wiring patterns Q7 and Q8 of the seventh and eights columns, which connect the through hole strings T of the second and fourth columns and the ends of the second layer 60-side of the repeating through holes M in the second and fourth columns.
Patent TW-465134-B (TW)
Title: External packaging method and external packaging label wrapping jig
Inventor: HASHIMOTO MASAHIKO
IPC: B65D85/88
Filed: 2000-09-21
Granted: 2001-11-21
Abstract: The external packaging label material 2 having the optional external packaging display face 2a is wrapped around an external peripheral surface of the cylindrical battery 1. The external packaging label material 2 is wrapped around the cylindrical battery 1 through a process of printing the external packaging display face 2a on seal-form printout paper, a process of die-cutting the printout paper on which the external packaging display face 2a is printed to a specified size, and a process of sticking the external packaging label material 2 onto the external peripheral surface of the cylindrical battery by using the external packaging label wrapping jig 11. The external packaging label wrapping jig 11 comprises the base 12, the positioning recess 13 which is formed on one principal plane of the base 12 and positions the external packaging label material 2, and the stopper 14 which is freely rotatively provided on the base 12, works as a reference for battery positioning, and has the bar 14a for pressing the external packaging label material 2 positioned in the positioning recess.
Patent TW-504560-B (TW)
Title: Refrigerator
Inventor: TAGO MASATO
IPC: F25D17/06
Filed: 2000-09-22
Granted: 2002-10-01
Abstract: The present invention relates to a refrigerator capable of performing accurate control on the circulation of coolant as well as reducing the influence of response delay come from coolant by providing a refrigerator equipped with a R evaporator and a F evaporator. At the time of transferring from F mode to R mode, the measure of present invention is to block on one hand the coolant flow into the F evaporator 24 and to continue on the other hand the operation of the compressor at the end of F evaporation, while operates C fan 32 to recycle coolant from the F evaporator 24 and then pass the recycled coolant to the condenser 13 for recycle operation, thereafter conducts the R evaporation process.
Patent TW-I237190-B (TW)
Title: Word-query method via Internet, and its equipment
Inventor: YE HAU-MING
IPC: G06F40/00
Filed: 2000-09-30
Granted: 2005-08-01
Abstract: This invention relates to a word-query method and its equipment via Internet. Its main function is to accomplish the word-query operation between the Internet client and the server. Wherein, the client has a word display, and uses cursor to select a word. When the user uses cursor to select a word, the word-query request of the client is sent to the server through Internet. The word-query translating program is installed in the server. It receives the word-query request of the client via Internet. It translates the request into word or speech information corresponding to the other language. The word or speech information is then sent to the client via Internet. After the client receiving the information from the server, these characters are displayed on the monitor. The speech is broadcasting sound through a sounder.
Patent TW-530124-B (TW)
Title: Screw compressor
Inventor: HIOKI YASUHIRO
IPC: F04C29/00
Filed: 2000-12-08
Granted: 2003-05-01
Abstract: To prevent a decrease in capacity of a compressor, and to decrease the quantity of oil contained in discharged gas, and to decrease the quantity of oil discharged to an outside of the compressor. In a screw compressor in which a screw rotor is supported by a low-pressure side bearing and a high-pressure side bearing in a rotor casing and the screw rotor and a driving motor are connected to each other by a coupling, and a drain oil passage is provided to return oil having lubricated the high-pressure side bearing to a low-pressure gas suction side through a through hole formed in a center of the screw rotor, a throttle mechanism is provided in the drain oil passage to inject the oil.
Patent TW-550832-B (TW)
Title: Light-emitting device and method of manufacturing the same
Inventor: FUKUNAGA TAKESHI
IPC: H01L21/77
Filed: 2001-02-02
Granted: 2003-09-01
Abstract: To provide a bright and highly reliable light-emitting device. An anode (102), an EL layer (103), a cathode (104), and an auxiliary electrode (105) are formed sequentially in lamination on a reflecting electrode (101). Further, the anode (102), the cathode (104), and the auxiliary electrode (105) are either transparent or semi-transparent with respect to visible radiation. In such a structure, lights generated in the EL layer (103) are almost all irradiated to the side of the cathode (104), whereby an effect light emitting area of a pixel is drastically enhanced.
Patent TW-490687-B (TW)
Title: Multilayer inductor
Inventor: SAKATA KEIJI
IPC: H01F27/28
Filed: 2001-02-08
Granted: 2002-06-11
Abstract: The present invention provides a multilayer inductor in which a DC resistance is small so that a high direct current can be applied thereto. The above multilayer inductor has a structure in which a plurality of magnetic layers is stacked and coil conductor patterns are formed between the magnetic layers. The coil conductor patterns are spirally connected to each other via through-holes formed on the magnetic layers. The coil conductor patterns are formed in such a manner that the areas of projected planes of the coil conductor patterns on main surfaces of the magnetic layers are set to be in a range from 35% to 75% of the areas of the main surfaces of the magnetic layers.
Patent TW-522715-B (TW)
Title: Image processing method and contactless image input apparatus utilizing the method
Inventor: ABE YUICHI
IPC: G06T3/00
Filed: 2001-02-27
Granted: 2003-03-01
Abstract: The present invention provides an image processing method to easily obtain the image captured by the front photograph, even for reading the images of three-dimensional surfaces, like folded bills or thick books. The original draft read by the camera will be abstracted with the profile, and detecting the apex information from the profile information. From the apex information and the known distance between the camera for measuring the original draft shape information, the distance information and the apex information can be used to conduct the correction of planar development for the folded original draft information.
Patent TW-498627-B (TW)
Title: Architecture for cordless telephones
Inventor: RIEDL WILHELM ERNST
IPC: H04B1/40
Filed: 2001-03-12
Granted: 2002-08-11
Abstract: An analog cordless telephone has a handset and a base. The handset and/or the base of the telephone may include the following components. A phase locked loop (PLL) and a voltage controlled oscillator (VCO), adapted to be shared between a receive path and a transmit path. A first analog gate is adapted to gate a received audio signal on and off, in response to a clock signal. A second analog gate is adapted to gate a transmit audio signal on and off, in response to an inverted version of the clock signal. The transmit audio signal is enabled when the received audio signal is gated off, and the VCO is further adapted to be modulated by the enabled transmit audio signal to output a modulated RF signal.
Patent TW-514760-B (TW)
Title: Thin film transistor and its manufacturing method
Inventor: CHEN SHIN-MING
IPC: G02F1/1362
Filed: 2001-03-30
Granted: 2002-12-21
Abstract: There is provided a liquid crystal display using thin film transistors as active devices, which includes: a plurality of gate lines arranged in parallel with each other and extended along a first direction; a plurality of data lines arranged in parallel with each other, extended along a second direction, and vertically interlaced with the plurality of gate lines; and a plurality of pixel areas which are rectangular areas arranged in a matrix constructed by the plurality of gate lines and the plurality data lines; wherein each pixel area includes a pixel electrode covering on the rectangular area, a thin film transistor arranged on the first area of the gate line, a capacitor formed on the second area of the gate line, and a metal shielding layer arranged on the intersection of the gate line and the data line.
Patent TW-498485-B (TW)
Title: Method to improve the adhesion of low-k material layer
Inventor: TSAI CHENG-YUAN
IPC: H01L21/76
Filed: 2001-04-23
Granted: 2002-08-11
Abstract: The present invention provides a method to improve the adhesion of low-k material layer. Firstly, a semiconductor device is provided and a cap layer is formed on the semiconductor device. Then an adhesion promoter is coated on the cap layer, and form a low-k layer is formed on the adhesion promoter. Furthermore, an HMDS film is deposited on the low-k layer, in which the HMDS layer can provide organic and inorganic bonds. Finally, an etching stop layer is formed on the HMDS film.
Patent TW-495872-B (TW)
Title: Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
Inventor: IGUCHI MANABU
IPC: H01L21/304
Filed: 2001-04-24
Granted: 2002-07-21
Abstract: An insulating layer is formed on a whole surface of a wafer. Recesses such as wiring grooves are formed in the insulating layer. A part of the insulating layer is removed on a region whose distance from the peripheral edge of the wafer is a predetermined value x or less. After a conductive film of copper or the like is formed on the whole surface of the wafer, a part of the conductive film is removed on a region whose distance from the peripheral edge of the wafer is a predetermined value y (y < x) or less. Chemical mechanical polishing is carried out to remove a part of the conductive in a region except the recesses. Thereafter, a part of the conductive film is removed by wet etching or the like on a region whose distance from the peripheral edge of the wafer is a predetermined value z (x < z) or less. Subsequently, an interlayer insulating film is formed on the whole surface of the wafer. The region for the removal of the conductive film is larger than a peripheral exposure region. The insulating film of a wiring layer consists of a silicon oxide film in the vicinity of the peripheral edge of the wafer, and an HSQ (hydrogen silises quioxane) film on the other region.
Patent TW-493210-B (TW)
Title: Semiconductor manufacturing method
Inventor: FUKUSHIMA YASUMORI
IPC: H01L21/336
Filed: 2001-05-07
Granted: 2002-07-01
Abstract: There is provided a semiconductor manufacturing method capable of sufficiently reducing catalytic element in a crystalline silicon film and also increasing the area of the crystalline silicon film to be left on the substrate. A catalytic element for accelerating the crystallization is introduced into an amorphous silicon film on a substrate, and a first heat treatment is performed to crystallize the amorphous silicon film into a crystalline silicon film. A mask layer is provided on the surface of the crystalline silicon film, the mask layer having an opening passing thicknesswise through the mask layer. Further thereon, a sacrifice film is formed so as to continuously cover the surface of the mask layer and an opening-correspondent portion of the crystalline silicon film. A getter element for gettering the catalytic element is introduced into the sacrifice film and the opening-correspondent portion of the crystalline silicon film. A second heat treatment is performed, by which the catalytic element is gettered from the crystalline silicon film to the sacrifice film through the opening.
Patent TW-486793-B (TW)
Title: Packaging method for preventing a low viscosity encapsulant from flashing
Inventor: HUANG JIAN-PING
IPC: H01L21/56
Filed: 2001-05-29
Granted: 2002-05-11
Abstract: A packaging method for preventing a low viscosity encapsulant from flashing includes placing at least a semiconductor chip onto a substrate with a plurality of solder bumps such that a cavity exists between the chip and the substrate; then it is put into a packaging mold to proceed a molded underfill process in which the mold has a mold cavity provided for the semiconductor chip, a plurality of lower portions near the corners in the mold cavity in altitude lower than other portions, and a plurality of air vents provided for the lower portions to connect to the ambient environment; and injecting a low viscosity encapsulant containing fine filler particles into the mold cavity such that the semiconductor chip is covered and underfilled. When the encapsulant flows through the lower portions, the lower portions can rapidly absorb the heat due to the lower altitudes such that the viscosity of the encapsulant can be increased to decrease the flow velocity of the mold flow. As a consequence, the encapsulant can be trapped in the lower portions to effectively prevent the encapsulant from flashing around the exits of the air vents.
Patent TW-I259381-B (TW)
Title: Integrated device of simulation circuit and processor
Inventor: YAO STEVE
IPC: G06F11/36
Filed: 2001-05-29
Granted: 2006-08-01
Abstract: The present invention relates to an integration device of simulation circuit and processor, which is disposed in a circuit and includes a processor and a simulation circuit. Thus, the integration device simulates operations of the processor and generates a simulating function of the processor in accordance with a command to verify the correctness of a circuit system which is electrically connected with the processor; while verifying correctly, the processor directly controls the circuit system instead. The device can further utilize a serial means via an integration method to communicate with the simulation circuit and can be further expanded to an integrated system in terms of the application in order to issue commands and receive simulation results through a computer.
Patent TW-548539-B (TW)
Title: Docking apparatus for assembling and disassembling peripheral devices in and from a computer
Inventor: KIM TAE-WOAN
IPC: G06F1/16
Filed: 2001-07-03
Granted: 2003-08-21
Abstract: A docking apparatus for use in assembling and disassembling peripheral devices from a computer, disposed in a housing of the computer, including a unit for releasing a locking state, a unit for separating a connector of the peripheral device from a mating connector in the housing, and a unit for pushing out the peripheral device to an easily separable or removable position. The docking apparatus releases a locking state of the docking apparatus and pushes out automatically the peripheral devices to an easily separable or removable position by a single switching operation.