Patent SG-11201407954V-A (SG)
Title: Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw
Inventor: IKEUCHI MASAHIKO
IPC: C09J161/06
Filed: 2012-07-02
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi (43) m&'&m a 2013^12^ 5 0(05.12.2013) WIPOIPCT (10) WO 2013/179498 A1 (51) C09J161/06 (2006.01) B24B 27/06 (2006.01) B24D 3/20 (2006.01) (21) (22) g&ttHQ: (25) B24D 11/00 (2006.01) B28D 5/04 (2006.01) C09J11/06 (2006.01) PCT/JP2012/066871 2012 ^7^ 2 0(02.07.2012) (26) @(g&M©Wl§: H*f§ (30) fiBfcftf '— 1 £: 4#Jg| 2012-126091 2012 ^6^ 1 0 (01.06.2012) JP (71) T K X (TKX Corporation) [JP/JP]; T 5430011 X TK^HT 5 # 1 6 -»§• Osaka (JP). (72) (75) fgBJ^/ttllA (^HICO^T®^): jftfi IEjt (IKEUCHI, Masahiko) [JP/JP]; T 5430011 K5m^I^E;f7K«BT5#1 6-^ tt5££ttT __ K X Osaka (JP). jH [JP/JP]; T 5430011 ^|Z;f7K# P3T 5 # 1 6 TKXrt Osaka (JP). (74) ftIIA: ^S(KUSUMOTO, Takayoshi); T 5200832 }& MRBj 4 # 7 jSb:^5 F fit^TFirFSfllFjT Shiga (JP). (81) (84) (ENDO, Tadashi) IS ft nJ f b ): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3- — V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, [mn%] (54) Title: ADHESIVE COMPOSITION FOR RESIN-BONDED WIRE SAW AND METHOD FOR PRODUCING RESIN-BON- DED WIRE SAW (54)#^a>«ffc : UV>7K> K9-T-V—V— [04] 4. 86 1000 500 20 25 30 00 o\ •t o\ l> i-H en i-H o CJ o & (57) Abstract: [Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains smooth a wafer in which the thickness of a damaged layer on the wafer surface caused by cutting is small; and an adhesive composition for resin-bonded wire saws that is suitable for said method. [Solution] This method for producing a resin-bonded wire saw comprises: a step of applying, to the surface of metal core wire, paste including a a an adhesive composition, abrasive grains, and a solvent for dissolving the adhesive composition, said adhesive composition being used for producing res­ in-bonded wire saws in which abrasive grains are firmly fixed to the surface of metal a core wire by means of a resin bond, said ad - hesive composition for resin-bonded wire saws including, as essential components, 100 parts by weight of novolac-type phenolic a resin, 10-30 parts by weight of resol-type a phenolic resin, and 0.1-5 parts by weight of an amine-based silane coupling agent; and a heating step of heating the applied paste with infrared rays including near-infrared rays, and causing said adhesive composition to undergo cross-linking reaction. a (57) mm-' fn WO 2013/179498 A1 GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI _ 21 ft(3)) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). V>TK> K9-<-v—7 —< Mmit t > UV>TK> K9-<-V— V— IcffifitfUv>#> K£ttLTHg$*iT £3 Uv>#> K9-<-V—7—©fiitlcm^bflStro^fcoT, 7 / #7 x / 10 OSiS 1 0~3 0iis o. 1 ~ 5 iisp uv>#> K7-re-v-ffla)g^ijffljsti'efey, r j m mt, h^jKEfsasi-^u t~ T|?> K9-r J e-v-o)Sii^}4'efe-So