baber/WOPTO huggingface dataset:
Patent JP-2004098681-A (JP)
Title: Pigment transfer printer and method for preventing creasing on donorweb in pigment transfer printer
Inventor: FISHER TERRENCE L
IPC: B41J35/08
Filed: 2003-08-29
Abstract: <P>PROBLEM TO BE SOLVED: To prevent a line defect from being printed on a dye receiver.  <P>SOLUTION: The pigment transfer printer uses a pigment donorweb and when a tension is applied in the longitudinal direction to the donorweb advancing from a print head in the printer through a web guide onto a web take-up spool, the donorweb may be corrugated or rippled transversely to cause creasing. The web guide is located to extend across the donorweb and bent to impart a curvature to the donorweb in proportion to the longitudinal web tension in order to urge the donorweb to spread substantially in the widthwise direction thus reducing the possibility of corrugating or rippling the donorweb. When the pigment transfer area under use is prevented from being corrugated or rippled, next not-yet-used transfer area is not creased.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005079462-A (JP)
Title: Semiconductor device and method for manufacturing the same
Inventor: OKUDA SHUICHI
IPC: H01L27/088
Filed: 2003-09-02
Abstract: <P>PROBLEM TO BE SOLVED: To prevent deterioration of a characteristic of a semiconductor device having a power transistor.  <P>SOLUTION: A barrier conductor film 22 as a TiW film and a seed film 23 as a Ni film are sequentially formed on an insulating film 16 having contact grooves 17 to 19 therein, a conductive film 25 is formed by depositing a Ni film by plating using a mask on the seed film 23, and areas of the seed film 23 and the barrier conductor film 22 having the conductive film 25 not present thereon are sequentially etched to form wiring films 26 to 28. Subsequently, silicon nitride film 31 and a polyimide resin film 32 are sequentially deposited on a semiconductor substrate 1, an opening 33 is made in the wiring film 28, and the opening 33 is buried by solder past printing to form a bump electrode 41 to be electrically connected with the wiring layer 28. Thereafter, A strap electrode 42 having a width of about 1 mm or more in a direction crossing a current path during driving operation of a power MISFET is connected to the bump electrode 41.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005076831-A (JP)
Title: Emergency braking system, and brake controller
Inventor: FUJIMOTO TSUGUFUMI
IPC: B60T8/00
Filed: 2003-09-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an emergency braking system, and a brake controller having an alternative means for reducing speed to a safe speed even when there is communication anomaly in a brake control system.  <P>SOLUTION: The emergency braking system is provided with a gear controller 3 controlling a position of a transmission gear of a vehicle, a brake manipulated variable detector 1 detecting a manipulated variable of a brake, and the brake controller 2 communicably connected to the brake manipulated variable detector 1, and controlling braking force of the brake in response to the manipulated variable detected by the brake manipulated variable detector 1. It is provided with a means for detecting an anomaly of communication between the brake controller 2 and the brake manipulated variable detector 1, and a means for sending a downshift signal indicating lowering of the position of the transmission gear to a low position to the gear controller 3 when the means detects an anomaly of communication.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005080258-A (JP)
Title: Cmos latch circuit and cmos-dff circuit
Inventor: FUKUDA HIDEKI
IPC: H03K3/037
Filed: 2003-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a CMOS latch circuit capable of being manufactured by an inexpensive ordinary CMOS process and corresponding to a signed-digit number indicating less power consumption.  <P>SOLUTION: An output signal OUT 11 of an inverter INV1 connected to an input terminal IN1 is fed to gates of an output transistor MP2 and a transistor MN1 of a path circuit PATH1 through power sources VDD 2 and VDD1. An output signal OUT12 of an inverter INV2 connected to the input terminal IN1 is fed to gates of an output transistor MN2 and a transistor MP1 of the path circuit PATH1 through power sources VDD1 and VDD0.A transfer gate G 1 is connected to the input terminal IN1.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005086244-A (JP)
Title: Rf id coating tool
Inventor: ISHIGURO TAKEO
IPC: H04B1/59
Filed: 2003-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To prevent communication of an RF ID tag unintended by a user and enable communication only if required.  <P>SOLUTION: The RF ID coating tool is includes: a coating part made of a raw material having an electromagnetic shielding property to shield the RF ID tag from a radio wave by covering the whole RF ID tag; and a tag exposure part that exposes the RF ID tag from the coating part to bring the RF ID tag into a wirelessly communicable state and retracts again the exposed RF ID tag into a coated state, and the RF ID coating tool covers the RF ID tag and shields the radio wave from an external field.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005084245-A (JP)
Title: Display device
Inventor: KAWAMURA HIROSHI
IPC: G09G5/00
Filed: 2003-09-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a display device capable of displaying a beautiful image which is less distorted even for a reader who obliquely reads it.  <P>SOLUTION: The display device 100 displays a 1st image and a 2nd image which are different images at the same time in a 1st direction and a 2nd direction which are different display directions. Consequently, a reader who reads one of the images views the image at an angle θ corresponding to the display direction to the right-angle direction of the display device 100 and the length W of the image is shortened to Wcosθ of the length W of the original image. The display device 100, therefore, expands the original image by 1/cosθ times in a slanting direction according to the angle θ corresponding to the display direction and displays the image.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005081229-A (JP)
Title: Deodorization apparatus
Inventor: NIHATA YASUSHI
IPC: B01D53/86
Filed: 2003-09-08
Abstract: <P>PROBLEM TO BE SOLVED: To reduce running cost by improving heating efficiency of gas by using a heater.  <P>SOLUTION: A deodorizing part 11 is equipped with: a cylindrical honeycomb structure body 40 on which a deodorizing catalyst like a platinum catalyst is deposited; a pair of containers 12 formed in a rectangular column and containing the honeycomb structure body 40 therein; and a case 41 containing the pair of the containers 12 therein. A collar part 42 is provided to the bottom face of the case 41 of the deodorizing part 11. Provision of the collar part 42 at the bottom face of the case 41 makes the distance from a peeling part X to an end face of the deodorizing part 11, where an opening of the taking-in port 41a is formed, longer compared to that of a conventional type. This allows nearly uniform temperature distribution of the gas taken in from the taking-in port 41a in a plane orthogonal to the axial direction of the deodorizing part 11, thereby improving the heating efficiency of the gas by the heater 10 and resulting in reduction of the running cost.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005083061-A (JP)
Title: Accretion removal device for removing accretion from wire rope, and construction method for foundation work using it
Inventor: MATSUI MICHIO
IPC: E21B11/04
Filed: 2003-09-09
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem of scattering of muddy water and the like, which are produced in foundation work (excavation work) using wet excavation.  <P>SOLUTION: An accretion removal device 1 comprises a tubular device body 10, and elastic plates 41-46 for rubbing off accretion such as the muddy water, which adheres to a wire rope 105. The elastic plates 41-46 are attached to the device body 10, so as to be brought into contact with the wire rope 105 which is connected to excavating equipment, while the wire rope 105 is wound up. When wound up so as to pull up the excavating equipment, the wire rope 105 is moved relatively to the device body 10, and the elastic plates 41-46 rub off the accretion adhering to the wire rope 105. Consequently, when the wire rope 105 is wound up, private houses, vehicles and the like around a job site can be prevented from being contaminated by the muddy water and the like, scattering from the wire rope.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004127279-A (JP)
Title: Non-contact ic chip mounting body and its display unit
Inventor: HASHIBA HIDETOSHI
IPC: B42D15/10
Filed: 2003-09-09
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate bad influence such as deflection of a resonance frequency due to electromagnetic connection between an electrode or a conductive layer, which is used in a display part capable of rewriting information display by impression of voltage, and an antenna of an RFID.  <P>SOLUTION: This non-contact IC chip mounting body is provided with a display unit 1 having a display part 2, which can rewrite the information display by impression of a voltage, and an RFID unit 6 having a circuit part including an antenna circuit 7. Since the display part 2 and the circuit part are arranged not to be overlapped by each other, no bad influence occurs.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005081325-A (JP)
Title: Method and apparatus for sterilizing drinking water
Inventor: SUZUKI SEIJI
IPC: C02F1/28
Filed: 2003-09-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for conveniently performing sterilization of drinking water.  <P>SOLUTION: The method and the apparatus for sterilizing drinking water comprises a fixed bed or a fluidized bed having a filter material made by mixing porous ceramic and particulate activated carbon and a drinking water passing means which allows drinking water to pass at a prescribed flow rate. Particle size of the porous ceramic fixed by the fixing bed is distributed in the range of 1 to 15 mm and particle size of the particulate activated carbon is distributed in the range of 0.1 to 2 mm. Either of particle size of the porous ceramic or the particulate activated carbon fixed by the fluidized bed is distributed in the range of 0.1 to 3 mm. The flow rate on a drinking water fixed filter material passing means falls in the range of 0.5 to 6 mm/sec. The flow rate on a drinking water fluidized filter material passing means falls in the range of 3 to 10 mm/sec. As to the drinking water passing means, a pump, a head or a tap water pressure is used.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005090266-A (JP)
Title: V-type engine for motorcycle
Inventor: ICHI SOKEN
IPC: F02B75/22
Filed: 2003-09-12
Abstract: <P>PROBLEM TO BE SOLVED: To make an intake air flow smoothly, and enhance an intake ability by ensuring an intake passage length preferable for an engine for a motorcycle.  <P>SOLUTION: In this V-type engine E provided in the motorcycle 1, a bank space 12 is arranged between cylinders 6 and 7, and intake passages 71 and 72 of the respective cylinders 6 and 7 are extended to a side part through the bank space 12. The intake passage 71 is constituted of an intake port 73, an intake pipe 77, a throttle body 80, and delivery duct 113, and is constituted such that radius of curvature 71R at a part in which the radius of curvature is smallest becomes larger than a passage diameter 71r. The intake passage 72 has structure similar to the intake passage 71.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005091065-A (JP)
Title: Apparatus and method for supplying semiconductor device with operating voltage
Inventor: WATANABE SHINOBU
IPC: H01L21/66
Filed: 2003-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To enable a power terminal of a semiconductor device to be applied with accurate voltage in a test of the semiconductor device, even in the case contact resistance between a voltage applying probe and the power terminal of the semiconductor device is increased.  <P>SOLUTION: The voltage applying probe 54 and a voltage measuring probe 56 are connected to a voltage input pad 74 and a voltage measurement pad 76, respectively, which are disposed on the semiconductor device 70 to be tested. The voltage input pad 74 is connected to the voltage measurement pad 76 by a conductor 78, and voltage applied on the voltage input pad 74 is measured through the voltage measuring probe 56. A voltage compensation circuit 14 in a voltage generating apparatus 10 operates so that the voltage applied on the voltage input pad 74 becomes equal to set voltage which is previously set in the voltage generating apparatus 10. Therefore, the set voltage is accurately applied on the voltage input pad 74, even in the case the contact resistance between the voltage applying probe 54 and the voltage input pad 74 is increased.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005087373-A (JP)
Title: Drive control device and drive control program of sewing machine
Inventor: YAMAGUCHI MINORU
IPC: D05B3/04
Filed: 2003-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To enable the reproduction of an operating state of an effector driven by a sewing machine motor during a sewing time in detail and with high fidelity by manual operation of a hand pulley like a former mechanically driven sewing machine.  <P>SOLUTION: During an actual sewing of a seaming pattern selected in an information preparation mode of a phase angle and a driving position, a rotation phase angle θ is made to correspond to an X feeding count value XP of a rotation driving position of an X feeding motor 23 and a Y feeding count value YP of a rotation driving position of a Y feeding motor 24 in each rotation of a sewing machine spindle for a predetermined minute angle (2°) and stored in an information memory of the phase angle and the driving position to set a manual operation mode, and when an operator rotates the hand pulley by the manual operation (S21), the X feeding count value XP and the Y feeding count value YP corresponding to the rotation phase angle θ of the rotary sewing machine spindle are read out from the information memory of the phase angle and the driving position (S23), and the X feeding motor and the Y feeding motor 24 are driven on the basis of the count values XP and YP (S24 and S25).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005093608-A (JP)
Title: Substrate treatment equipment
Inventor: NAKAMURA IWAO
IPC: H01L21/22
Filed: 2003-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wafer supporting section capable of preventing the occurrence of a slip.  <P>SOLUTION: A curvature radius R of a semi-spherical projection 28 formed at the center of the holding surface 26 of a holding recess 25 of a boat for holding a wafer as a wafer supporting portion which supports the wafer in a contact state is set as follows: From a degree of adhesion between the wafer 1 and the projection 28 based on a relationship between a depth h and a diameter (a) of a flaw, a degree of engagement Dp=h/a that makes the flaw generated in the wafer 1 by the projection 28 brought into contact with the wafer 1 a plow-like one which does not cause the occurrence of the slip S is determined. The curvature radius R of the projection 28 is determined from the degree of engagement Dp and a true contact area A=L/σ calculated from a load L and yield stress σ of the wafer 1. Furthermore, the degree of engagement Dp of the projection 28 is set to Dp<0.1.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005094930-A (JP)
Title: Current control device for interior light wire
Inventor: NAI TAKESHI
IPC: H02J3/00
Filed: 2003-09-17
Abstract: <P>PROBLEM TO BE SOLVED: To solve the following problem: even if the rated capacity of a distribution board is slightly exceeded for a short time, a service interruption occurs by an instant interruption caused by strict compliance to the rated capacity of the board, and electrical machinery or apparatus cannot be used even though they are well within the rated capacity in control on the electrical machinery and apparatus based on the maximum working current.  <P>SOLUTION: The current of a circuit breaker is detected, and soft switches provided in Internet-connected home appliances are utilized. A master circuit breaker or a branch circuit breaker is not instantly operated under an overload of several tens of percent for a certain period of time, resulting from the use of a dryer or a microwave oven. A signal is transmitted from a current control device to stop a preselected individual device such as an air conditioner. After confirming by detecting that the current of the circuit breaker is completed and a time in which the cause of the overload is expected to vanish has passed, the stopped individual device is restarted.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005089117-A (JP)
Title: Paper feeder and image formation device mounted with the same
Inventor: SHIBAYAMA KOHEI
IPC: B65H11/00
Filed: 2003-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To suppress paper from sticking to a tray without making a paper feeder and an image formation device large in size and generating inconvenience in use of the tray.  <P>SOLUTION: A rib 30 is provided on a paper placement surface 12 of the tray 10 of a manual insertion paper feed part 1, i.e., the paper feeder. The rib 30 can be projected/retreated from the paper placement surface 12 through an opening 14 provided on the paper placement surface 12 and is urged to a projection direction by a spring 33 provided in the tray 10. Further, the rib 30 is provided such that it is overlapped to a movement area of a base part 21 of a cursor 20 moving on the paper placement surface 12. Further, a flat surface making inclination with the movement direction of the cursor 20 is provided on a side surface of the rib 30 contacting with the cursor 20. The rib 30 is retreated into the tray 10 by slope action between the flat surface and the cursor 20.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005093820-A (JP)
Title: Chip type capacitor, its manufacturing method, lead frame therefor and chip capacitor
Inventor: HENMI HIDEYUKI
IPC: H01L23/48
Filed: 2003-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lead frame for chip type capacitor which can flexibly cope with the variations in the connection height with the anode lead wire of a capacitor element and at the same time, to which connection can be performed surely and easily, and to provide a method of manufacturing the lead frame and the chip type capacitor.  <P>SOLUTION: The capacitor element 1 is provided with the anode lead wire 3 protrudes from the central part of one end and mounted on a cathode lead frame 31. The anode lead frame 32 of the element 1 is provided with a surface-mounting section 32a, and a connecting piece 32b which is connected to the side face of the surface-mounting section 32a and formed in a horizontal belt-like shape, with respect to the side face. The connecting piece 32b is bent twice by 90° from its root and, after the piece 32b is bent, the front end-side portion of the piece 32b is provided on the surface-mounting section 32a from the direction perpendicular to the anode lead wire 3. The anode lead wire 3 is connected a part located close to the front end-side portion of the connecting piece 32b by welding.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005089679-A (JP)
Title: Treating liquid for rubber/fiber bonding and method for producing fiber material for rubber-reinforcement
Inventor: TOKI TERU
IPC: C09J175/04
Filed: 2003-09-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a treating liquid for rubber/fiber bonding use having small depression of the bonding performance with time.  <P>SOLUTION: The treating liquid for rubber/fiber bonding use contains a blocked polyisocyanate, a rubber latex and a thermoplastic elastomer reactive with isocyanate. Preferably, the thermoplastic elastomer has at least one group selected from a phenol group, hydroxy group and amino group on the hard segment or is a copolymer of a polybutadiene and a polyurethane.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005088073-A (JP)
Title: Solder tank, solder heater and surface treatment method of base metal
Inventor: KATAOKA YOSHIO
IPC: B23K3/06
Filed: 2003-09-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solder tank, a solder heater and a surface treatment method of a base metal in which cracks and separation are less liable to occur in the surface even when thermal stresses act, and secularly consistent corrosion resistance is ensured for a tin alloy such as lead-free solder.  <P>SOLUTION: An intermediate metal layer 21 to cover a surface of a base metal in contact with a tin alloy such as lead-free solder for a solder pot and a solder heater and a surface protective layer 20 consisting of ceramics are successively formed by thermal spraying.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005096553-A (JP)
Title: Speedometer control system and speedometer control method
Inventor: TSURUHARA RYUZO
IPC: B60Q1/00
Filed: 2003-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To carry out display of vehicle speed by a speedometer even if a signal corresponding to the vehicle speed determined based on a detection signal from a vehicle speed sensor is not obtained.  <P>SOLUTION: In the speedometer control system provided with not only the vehicle speed sensor 2 but also wheel speed sensors 1a-1d, the vehicle speed is determined by both PCM4 and brake ECU3. Further, when the signal corresponding to the vehicle speed is basically obtained from PCM4 and the signal corresponding to the vehicle speed is not normally obtained from PCM4, the signal corresponding to the vehicle speed is obtained from the brake ECU3. Thereby, even when the signal corresponding to the vehicle speed is not normally obtained from PCM4, the signal corresponding to the vehicle speed can be obtained by the brake ECU3 and it becomes possible that the display of vehicle speed is carried out by the speedometer 5.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005099401-A (JP)
Title: Semiconductor laser
Inventor: MONMA SUSUMU
IPC: G02B6/42
Filed: 2003-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor laser in which the deterioration of a coupling efficiency due to chromatic aberration does not occur regardless the wavelength of the semiconductor laser.  <P>SOLUTION: The laser beam emitted from a light emitting part of the semiconductor laser is reflected and converged on the reflection face of a concave mirror and is made incident on the incident end face of an optical fiber. The reflection face of the concave mirror composes a part of an aspherical face expressed by Eq. (1), the light emitting part of the semiconductor laser is substantially located at (z, r)=(-(a<SP>2</SP>-b<SP>2</SP>)<SP>0.5</SP>+a, 0), and the incident end face of the optical fiber is substantially located at (z, r)=((a<SP>2</SP>-b<SP>2</SP>)<SP>0.5</SP>+a, 0), respectively.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005108921-A (JP)
Title: Resin-encapsulated semiconductor element
Inventor: OKA KENJI
IPC: H01L23/31
Filed: 2003-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor element of high reliability which can reduce the stress on resin for sealing at the curing contracting of the resin, without using polyimide resin or silicon resin for a surface protection film, and can surely prevent strike slip of the wiring layer.  <P>SOLUTION: In the resin encapsulated semiconductor element 1, a ground insulating film 3 which consists of silicon oxide is formed on a semiconductor substrate 2 in which an integrated circuit is formed, thereon a wiring layer 4 is formed which is constituted of aluminum and connected with the integrated circuit, and a cover insulating film 5, constituted of silicon nitride, is formed on the wiring layer 4. On the cover insulating film 5, a metal film 6 of stripe shape is formed so as to be positioned between each of the wiring layers 4, and resin 7 for encapsulation constituted of epoxy resin is formed on the metal film 6.  <P>COPYRIGHT: (C)2005,JPO&NCIPI