Patent TW-202031118-A (TW)
Title: Method for manufacturing shielded printed wiring board and shielded printed wiring board for fully bonding a printed wiring board and adhesive layers of an electromagnetic wave shielding film that are adhered on opposite sides of the printed wiring board
Inventor: YAMAUCHI SIROU
IPC: H05K9/00
Filed: 2019-12-11
Abstract: The invention provides a method for manufacturing shielded printed wiring board, which can fully bond a printed wiring board, an adhesive layer of an electromagnetic wave shielding film adhered on one side of the printed wiring board, and an adhesive layer of the electromagnetic wave shielding film adhered on the other side of the printed wiring board. The method for manufacturing shielded printed wiring board of the invention is characterized by including a printed wiring board preparation step of preparing a printed wiring board having a base film, a printed circuit formed on the base film, and a cover film covering the printed circuit; a first electromagnetic wave shielding film preparation step of preparing a first electromagnetic wave shielding film having a first protective film, a first insulating layer and a first adhesive layer, all of which are arranged in order; a second electromagnetic wave shielding film preparation step of preparing a second electromagnetic wave shielding film having a second protective film, a second insulating layer and a second adhesive layer, all of which are arranged in order; a first electromagnetic wave shielding film arrangement step of arranging the first electromagnetic wave shielding film on the printed wiring board in such a way that the first adhesive layer is in contact with one surface of the printed wiring board, and positioning a portion of the first adhesive layer further outside an end of the printed wiring board as a first extended end; a second electromagnetic wave shielding film arrangement step of arranging the second electromagnetic wave shielding film on the printed wiring board in such a way that the second adhesive layer is in contact with the other surface of the printed wiring board, and positioning a portion of the second adhesive layer further outside the end of the printed wiring board as a second extended end; an overlapping step of overlapping the first extended end and the second extended end in such a way that a gap is formed in a portion between the first extended end and the second extended end so as to manufacture a temporarily pre-pressed shielded printed wiring board; a temporary pressing step of pressing/heating the temporarily pre-pressed shielded printed wiring board before the temporary pressing in such a way that the first adhesive layer and the second adhesive layer are not completely cured to manufacture a temporarily post-pressed shielded printed wiring board; a protective film peeling step of peeling off the first protective film and the second protective film from the temporarily post-pressed shielded printed wiring board to manufacture a formally pre-pressed shielded printed wiring board; and a formal pressing step of pressing/heating the formally pre-pressed shielded printed wiring board to cure the first adhesive layer and the second adhesive layer so as to form a shielded printed wiring board.