Patent SG-11201906425R-A (SG)
Title: System and method for measuring substrate and film thickness distribution
Inventor: CHEN DENGPENG
IPC: G01B11/30
Filed: 2018-02-07
Abstract: CONTROLLER 1108 ;PROCESSOR 110 MEMORY 1 PROCESS 1 TOOL 1112 USER INTERFACE (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 16 August 2018 (16.08.2018) WIP0 1 PCT omit Ill °nolo VIII oimIE (10) International Publication Number WO 2018/148303 Al (51) International Patent Classification: G01B 11/30 (2006.01) G01B 9/02 (2006.01) G01B 11/06 (2006.01) (21) International Application Number: PCT/US2018/017255 (22) International Filing Date: 07 February 2018 (07.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/456,651 08 February 2017 (08.02.2017) US 15/622,629 14 June 2017 (14.06.2017) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, CA 95035 (US). (72) Inventors: CHEN, Dengpeng; BLK 101, Clementi St. 14, #11-143, Singapore 120101 (SG). ZENG, Andrew; 134 Leal Way, Fremont, CA 94539 (US). (74) Agent: MCANDREWS, Kevin et al.; Kla-Tencor Corpo- ration, Legal Department, One Technology Drive, Milpitas, CA 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: SYSTEM AND METHOD FOR MEASURING SUBSTRATE AND FILM THICKNESS DISTRIBUTION 100 102 - DUAL INTERFEROMETER SUB-SYSTEM 101Th 104 MASS SENSOR 1-1 O co 00 O C FIG.1 (57) : The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processor are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor. [Continued on next page] WO 2018/148303 Al MIDEDIMOMOIDEIREEMOMMIUMNIMOIMEMOIS (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))