baber/WOPTO huggingface dataset:
Patent TW-I224416-B (TW)
Title: Fan speed control circuit
Inventor: LIN YU-LIANG
IPC: H02P6/26
Filed: 2003-08-21
Granted: 2004-11-21
Abstract: A fan speed control circuit includes a driving circuit, a voltage division circuit and a speed modulator. The driving circuit outputs a pulse to produce magnetic field in a motor coil, and the voltage division circuit, including a transistor and a plurality of resistors, is connected with a voltage source and the driving circuit. the speed modulator, composed of a transistor and a plurality of resistors in parallel, connected with the voltage division circuit and the driving circuit. The current flow path for the fan speed control circuit is changed under different source voltages and, while the current flow through the parallel resistors, the conduction current passed through the driving circuit can be adjusted and thereby changing the fan speed to achieve a desired value.
Patent TW-I227302-B (TW)
Title: A method of increasing efficiency in engine ignition for motorcycles
Inventor: LEE TSOU-JEN
IPC: F02D41/00
Filed: 2003-08-28
Granted: 2005-02-01
Abstract: A method of increasing efficiency in engine ignition for motorcycles comprises an electronic control unit (ECU) is added to the engine of carburetor to check signals of rotational speed and load of engine so as to choose an optimum igniting angle, then command a capacitance discharge ignition (CDI) to proceed discharged ignition, thereby increasing efficiency for ignition.
Patent TW-I227199-B (TW)
Title: Flexo print plate, flexo print device, producing method of flexo print plate, and producing method of printed matter
Inventor: SAAI YUJI
IPC: B41M1/04
Filed: 2003-09-19
Granted: 2005-02-01
Abstract: The subject invention relates to a flexo print plate which comprises a convex portion (2) for printing a print material to a to-be-printed object, said convex portion (2) having a top face and a side face forming an angle of above 90 DEG and below 105 DEG. An angle of above 95 DEG and below 100 DEG formed by said top face and said side face is preferred. A flexo printing device is equipped with said flexo print plate.
Patent TW-I223157-B (TW)
Title: Packet forwarding device and method
Inventor: JOU YOU-RUNG
IPC: G06F3/00
Filed: 2003-10-03
Granted: 2004-11-01
Abstract: The invention provides a packet forwarding device and method, which set up a virtual port code for each peripheral interface respectively and further recognizes and processes the packets sending from or forwarding to the virtual port via the direct packet forwarding function inside the forwarding device. Accordingly, the similar method regularly processing the packets in and out of the physical port can be used to process the packets sending from or forwarding to peripheral interfaces and the connected network device.
Patent TW-I226934-B (TW)
Title: System of nanoimprint with mold deformation detector and method of monitoring the same
Inventor: HOCHENG HONG
IPC: B29C43/58
Filed: 2003-11-27
Granted: 2005-01-21
Abstract: A system and method for nanoimprint with mold deformation detector is provided, adapted to function in real time monitoring the deformation of mold intellectually. An embedded electrostatic plate capacitor is comprised by at least two metal film electrodes which manufactured by silicon micromachining process on both sides of mold. During imprinting, mold sustains an external force and deformations occur, which inducing the change of relative distance between both metal film electrodes and resulting in capacitance variance of capacitor. The quantity for deformation of mold is determined by comparing capacitance variance with a reference value. The nanoimprint mold system and intellectual real time detecting and monitoring method are consisted of mold system, detecting and monitoring device.
Patent TW-I239124-B (TW)
Title: Electrical connector
Inventor: FUKUDA MASAHIKO
IPC: B62J11/19
Filed: 2003-12-05
Granted: 2005-09-01
Abstract: Various electrically controlled devices of a bicycle are electrically coupled together by multi-conductor electrical cords. Preferably, the ends of the electrical cords have an electrical connector that mates with a corresponding electrical connector of an electrically controlled device. The electrical connectors are designed to be coupled together by a snap fit. Each electrical connector attached to the end of the electrical cord has an electrical contact housing with electrical contacts and an outer casing molded about the electrical contact housing to form a tubular portion radially spaced from the outer end of the electrical contact housing. A retaining ring is located in an annular groove formed in an exterior surface of the outer casing to provide an additional coupling force. Preferably, an annular sealing member formed of a resilient and compressible material is located in an annular space formed between the tubular portion and the electrical contact housing.
Patent TW-I228675-B (TW)
Title: Method and system for coordinating enterprise to concurrent operation in product life cycle
Inventor: WU CHIUAN-YOU
Filed: 2003-12-17
Granted: 2005-03-01
Abstract: A method for coordinating enterprise to concurrent operation in product life cycle and system thereof can establish a system engineering service platform among customer, key manufacturers and suppliers. The platform at least includes a message service server, at least a web server, a system engineering service platform server, at least a product life cycle management application system server and an enterprise portal server to establish a system integration environment among client, key manufacturers and suppliers for providing a cooperation coordination platform among enterprises. Ranging from product conception, specification requirement, product design, product development, product manufacture to end of life of product, information can be exchanged in the integrated system environment on real-time basis throughout the entire product life cycle to provide a system integration method and environment for attaining the collaboration in terms of management, R&D, manufacture and marketing among enterprise, suppliers and consumers.
Patent TW-I224202-B (TW)
Title: Composite optical film and fabrication method thereof
Inventor: HUANG CHI-CHOU
IPC: G02B1/10
Filed: 2003-12-26
Granted: 2004-11-21
Abstract: The present invention provides a composite optical film and fabrication method thereof. The composite optical film comprises a substrate; a hard coat layer comprising nano-scale SiO2 particles on the substrate; an anti-smudge layer on the hard coat layer, the anti-smudge layer comprising a compound with a silane terminal group facing the interface between the hard coat layer and the anti-smudge layer, and an F-terminal group facing the upper surface of the anti-smudge layer. When forming the anti-smudge layer, due to the molecular interaction between the nano-scale SiO2 particles and the silane terminal group, the F-terminal group faces the upper surface of the anti-smudge layer surface automatically. The above micro-structure not only increases the transmittance and decreases the refraction of the composite optical film, but also increases the contact angle of the anti-smudge layer, achieving perpetual anti-smudge effect.
Patent TW-I276963-B (TW)
Title: The keyboard video mouse switch for multiply chaining and the method thereof
Inventor: CHEN SUN-CHUNG
IPC: G06F13/12
Filed: 2004-03-01
Granted: 2007-03-21
Abstract: When destinations of local electrical signals are local computers, the local electrical signals are transmitted to the corresponding destination local computers via the keyboard video mouse (KVM) switch directly. When the destinations of the local electrical signals are remote computers, at least one network packet having multiple data sections for correspondingly storing the local electrical signals is generated by the current KVM switch referring to the local electrical signals. A communication is established between a plurality of the KVM switches with network protocol, for communicating the network packets thereof. At least one remote electrical signal is obtained from another network packet transmitted by another KVM switch, and then is transmitted to corresponding destination local computer.
Patent TW-I236075-B (TW)
Title: Method for forming die protecting layer
Inventor: WU BOR-JEN
IPC: H01L21/56
Filed: 2004-03-12
Granted: 2005-07-11
Abstract: A method for forming a die protecting layer is disclosed. The method comprises the following steps: providing a wafer with numerous dies on a first surface and a second surface, forming a transparent protecting layer on the second surface of the wafer. Clearly, the transparent protecting layer is directly formed on the backside or the front side of the wafer.
Patent TW-I239686-B (TW)
Title: Connection structure of printed wiring board
Inventor: UCHIDA SHINJI
IPC: H05K3/36
Filed: 2004-04-06
Granted: 2005-09-11
Abstract: Disclosed is a structure of a printed wiring board which is connected electrically with an FPC. The FPC comprises a long basic material and a conductor part stacked on the surface of the basic material. The conductor part comprises a plurality of conductors extending along the axial direction of the basic material, and resiliently deformable first contact terminals extending from the surfaces of respective conductors toward the base end side of the FPC. The printed wiring board has an insertion port provided on one end face thereof and receiving the front end of the FPC, and a plurality of line connection terminals formed on the inner wall face of the insertion port and extending along the inserting direction of the FPC. When the front end of the FPC is inserted into the insertion port of the printed wiring board, the front end of the first contact terminal of the FPC touches and presses the line connection terminal in the insertion port. According to the said invention, a connector structure being connected with the FPC is provided in the printed wiring board, so the circuit elements can be mounted at a high density and the degree of freedom can be enhanced in the design of a wiring pattern.
Patent TW-I244202-B (TW)
Title: Semiconductor light receiving device and manufacturing method for the same
Inventor: YAMAUCHI HIROSHI
IPC: H01L27/148
Filed: 2004-04-06
Granted: 2005-11-21
Abstract: An object of the present invention is to provide a highly sensitive semiconductor light receiving device wherein the efficiency of light convergence into the light receiving region has been increased. The semiconductor light receiving device includes a light receiving region (4) formed on a semiconductor substrate (1), and an electrode (8) formed in a peripheral portion of the light receiving region (4) on the semiconductor substrate (1) for transferring a charge generated through photoelectric conversion in the light receiving region (4) to the outside of the light receiving region, wherein a part of or the entirety of the peripheral portion of the electrode (8) is processed so as to recede toward the center of the electrode (8) as the electrode (8) is away from the semiconductor substrate (1). In addition, two types of etching of isotropic etching and anisotropic etching are used at the time of the pattern formation of the electrode (8) at least once, respectively.
Patent TW-I237733-B (TW)
Title: Laser produced plasma radiation system with foil trap
Inventor: BAKKER LEVINUS PIETER
IPC: G03F7/20
Filed: 2004-06-23
Granted: 2005-08-11
Abstract: A radiation system is presented with a foil trap between a collector, such as a Normal Incidence collector, and a (plasma) light source, such that radiation coming from the light source passes the foil trap twice. Once before hitting the collector, and the second time, after reflection by the collector. This configuration was believed not to be possible in the past. Since the foil trap comprises lamellas that are parallel to both the radiation coming from the light source, and to the radiation reflected by the collector, the radiation is not obstructed by the foil trap. In this way, a Normal Incidence collector which is used with a plasma produced source, can be protected from debris coming from a EUV source.
Patent TW-I341901-B (TW)
Title: Apparatus for generating power and hybrid fuel vaporization system therefor
Inventor: PELLIZZARI ROBERTO O
IPC: B05B15/02
Filed: 2004-07-01
Granted: 2011-05-11
Abstract: A hybrid fuel vaporization system and an apparatus for producing power from a source of liquid fuel. The hybrid fuel vaporizing system comprises: (a) at least one capillary flow passage, said at least one capillary flow passage having an inlet end and an outlet end, said inlet end in fluid communication with the source of liquid fuel; (b) a heat source arranged along said at least one capillary flow passage, said heat source operable to heat the liquid fuel in said at least one capillary flow passage to a level sufficient to change at least a portion thereof from a liquid state to a vapor state; and (c) a vaporizing member having a first surface and a second surface, said first surface exposed to heat produced by the apparatus for combusting fuel, said vaporizing member positioned so that fuel exiting said outlet end of said at least one capillary flow passage impinges on said second surface whereby a stream of substantially vaporized fuel is delivered for combustion.
Patent TW-I238710-B (TW)
Title: Disposable diaper
Inventor: MINATO HIRONAO
IPC: A61F13/66
Filed: 2004-07-29
Granted: 2005-09-01
Abstract: The present invention aims to provide the disposable diaper improved so as to prevent the diaper from slipping down during its use and to give the wearer no uncomfortable feeling of local oppression around the wearer's waist. A disposable diaper (1A) is provided with elastically stretchable waist areas (10) extending in a transverse direction along respective end portions (8) of front and rear waist regions (5, 7) and a pair of elastically stretchable wing areas (11) extending outward in the transverse direction from the side edge portions (9) of the rear waist region (7). In this diaper 1A, the side edge portions (9) of the rear waist region (7) are respectively interposed between the stretchable waist area (10) and the stretchable wing areas (11). The stretchable wing areas (11) have a transverse stretch stress higher than a transverse stretch stress of the stretchable waist area (10), so the tensile force exerted on the stretchable wing areas (11) is segmentalized and restrained by the side edge portions (9) of the rear waist region (7).
Patent TW-I234304-B (TW)
Title: Process of increasing carrier mobility of organic semiconductor
Inventor: HU TARNG-SHIANG
IPC: H01L51/00
Filed: 2004-09-03
Granted: 2005-06-11
Abstract: A process of increasing carrier mobility of organic semiconductor is disclosed in the present invention. The invention includes the following steps: forming a gate on a substrate; forming an insulation layer on the substrate and the gate; coating the polyimide to form an interlayer on the insulation layer; forming an active layer on the interlayer; and forming a source and a drain. The method of coating the polyimide to form an interlayer on the insulation layer can be completed by the spin coating method, the inject-printing method, the contact printing method, or the plasma etching.
Patent TW-I328867-B (TW)
Title: Integrated structure and method for fabricating the same
Inventor: POGGE H BERNHARD
IPC: H01L23/24
Filed: 2004-09-01
Granted: 2010-08-11
Abstract: A method is described for forming an integrated structure, including a semiconductor device and connectors for connecting to a motherboard. A first layer is formed on a plate transparent to ablating radiation, and a second layer on the semiconductor device. The first layer has a first set of conductors connecting to bonding pads, which are spaced with a first spacing distance in accordance with a required spacing of connections to the motherboard. The second layer has a second set of conductors connecting to the semiconductor device. The first layer and second layer are connected using a stud/via connectors having spacing less than that of the bonding pads. The semiconductor device is thus attached to the first layer, and the first set and second set of conductors are connected through the studs. The interface between the first layer and the plate is ablated by ablating radiation transmitted through the plate, thereby detaching the plate. The connector structures are then attached to the bonding pads. This method permits fabrication of a high-density packaged device with reduced cost.
Patent TW-I268592-B (TW)
Title: Semiconductor device
Inventor: HORIMOTO MASASHI
IPC: H01L23/48
Filed: 2004-09-10
Granted: 2006-12-11
Abstract: A BGA type semiconductor device provided with a power transistor, in which external electrodes are arranged in matrix, is provided, wherein loss can be reduced and controlling characteristic of the power transistor can be improved since resistance of wirings connected to the power transistor is reduced. The semiconductor device includes an IC chip containing the power transistor, and a BGA type substrate having a plurality of external electrodes arranged in matrix, wherein the external electrodes penetrate a plurality of through-holes of an insulating base material from one side to the other side and project on the other side thereof respectively. A power pad in the IC-side pads of the IC chip is connected with a substrate-side pad connected to the outermost external electrode of the substrate such that the length of the wiring is shortened.
Patent TW-I255527-B (TW)
Title: Damascene method capable of avoiding copper extrusion
Inventor: WANG MIN-CHIH
IPC: H01L21/768
Filed: 2004-09-15
Granted: 2006-05-21
Abstract: A method for avoiding copper extrusion during a damascene process is disclosed. A semiconductor wafer including a substrate with at least one copper wire on that is provided. A dielectric layer on the copper wire is formed. A damascene structure having an opening to expose a portion of the copper wire is formed by using of the dielectric layer. A degas process to make gas escape from the dielectric layer is performed. A barrier layer overlying the surface of the portion of the copper wire and the damascene structure is formed. A conductive layer overlying the barrier layer is formed.
Patent TW-I319903-B (TW)
Title: Adjustable self-aligned air gap dielectric for low capacitance wiring
Inventor: GEFFKEN ROBERT M
IPC: H01L21/768
Filed: 2004-09-20
Granted: 2010-01-21
Abstract: An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interconnects. The air gap extends above an upper surface of at least one of the first and second interconnects and below a lower surface of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
Patent TW-I258271-B (TW)
Title: Receiving device
Inventor: UMEWAKA MASAHIRO
IPC: H04B17/40
Filed: 2004-09-27
Granted: 2006-07-11
Abstract: The present invention provides a receiving device for eliminating the power consumption. The receiving device comprises: a plurality of receiving system circuits connecting with the antennas, and a signal selection portion for selecting any one of receiving system circuits as the main processing circuit with the receiving potential the same as or higher than the determined threshold. By configuring at least one portion of the receiving system circuit other than the selected receiving system circuit as the non-operational status, the power consumption is inhibited.
Patent TW-I244690-B (TW)
Title: Facility with multi-storied process chamber for cleaning substrates and method for cleaning substrates using the facility
Inventor: LIM JOUNG-HYEON
IPC: H01L21/677
Filed: 2004-10-08
Granted: 2005-12-01
Abstract: A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chambers, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.
Patent TW-I242902-B (TW)
Title: Thin-film varistor with Nano-composite structure and microwave switch using the same
Inventor: LU JONG-HONG
IPC: H01L49/02
Filed: 2004-12-29
Granted: 2005-11-01
Abstract: The present invention relates to a thin-film varistor with nano-composite structure, including a substrate; a heterogeneous nano-structure containing a plurality of metal and/or semi-metal cores and semiconductor and/or insulator material covered by the metal and/or semi-metal cores, wherein: the plural metal and/or semi-metal cores covered with semiconductor and/or insulator material, under the imposition of a specific bias in the heterogeneous nano-structure, having a distribution of promptly decreased resistance and vastly increased current.
Patent TW-I246209-B (TW)
Title: Manufacturing method for leadframe of light emitting diode and the structure thereof
Inventor: TSAI WEN-JENG
IPC: H01L33/00
Filed: 2005-01-07
Granted: 2005-12-21
Abstract: The present invention provides a design regarding to light emitting diode, and especially to a leadframe of light emitting diode with thermal conductive base, which is to press on the substrate material with different thicknesses to form the polarized pins, fixed pins, and lead block of heat sink base on the substrate; wherein, the heat sink base is made of thicker material on the substrate; then, pressing to bend the polarized pins; finally, using injection molding for plastic insulative material on the lead block to compose a plurality of leadframes on the substrate, and the thicker heat sink base could form the thermal conductive base on the product after following chip fixing, wire bonding, and packaging.