Patent SG-11201902750W-A (SG)
Title: Methods and systems for chucking a warped wafer
Inventor: BALAN AVIV
IPC: H01L21/02
Filed: 2017-10-18
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -C.-- -.` 111111111111 0110101011111 01101 0 111110 11101100 1111111110 111111111111 Organization International Bureau (10) International Publication Number 03 (43) International Publication Date ......\"' WO 2018/075675 Al 26 April 2018 (26.04.2018) WIP0 I PCT (51) International Patent Classification: (72) Inventors: BALAN, Aviv; 2557 Mardell Way, Mountain HO1L 21/683 (2006.01) H01L 21/02 (2006.01) View, California 94043 (US). HUANG, Luping; 5586 (21) International Application Number: N. Dublin Ranch Drive, Dublin, California 94568 (US). CHANDAN, Savita; 6956 Claywood Way, San Jose, Cal- PCT/US2017/057244 ifornia 95120 (US). CHEN, Chia-Chu Galen; 1609 Stan- (22) International Filing Date: wich Road, San Jose, California 95131 (US). MERIAM, 18 October 2017 (18.10.2017) Teck; 1489 Maria Way, San Jose, California 95117 (US). (25) Filing Language: English (74) Agent: MCANDREWS, Kevin et al.; KLA-TENCOR CORPORATION, Legal Department, One Technology Dri- (26) Publication Language: English ve, Milpitas, California 95035 (US). (30) Priority Data: (81) Designated States (unless otherwise indicated, for every 62/409,880 19 October 2016 (19.10.2016) US kind of national protection available): AE, AG, AL, AM, 15/383,207 19 December 2016 (19.12.2016) US AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, (71) Applicant: KLA-TENCOR CORPORATION [US/US]; CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, Legal Department, One Technology Drive, Milpitas, Cali- DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, fornia 95035 (US). HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, _ (54) Title: METHODS AND SYSTEMS FOR CHUCKING A WARPED WAFER = = 161 COMPUTING SYSTEM 163 = 160 166 167 = 4 = 103 109 164 111 ,.„, 44 , 165 i fr• 62 111 102 110 1 1111=1111 _ = 101 • 112 = 104 i p 100 106 = 105 III = *A = 107 107 — lye ii r A = FIG. 7 ,-, (57) : Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum ir) chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows I N seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred in micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. IN As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck --.., © body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element GC collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body. 1-1 0 ei o [Continued on next page] WO 2018/075675 Al MIDEDIMOMOIDEIREIDIONOMMOMOMOVOIMIE MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))