baber/WOPTO huggingface dataset:
Patent JP-2006301863-A (JP)
Title: Memory module
Inventor: IKEDA HIROAKI
IPC: H01L25/18
Filed: 2005-04-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a memory module which can switch operations according to the model of a memory chip.  <P>SOLUTION: This memory module has memory core chips 10a-10d which have a relay wiring for electrically connecting an interface chip and an interposer chip and are placed between the interface chip and the interposer chip, the interposer chip 40 which sends out model information of the memory core chip to the interface chip through the relay wiring, and the interface chip 30 which controls the memory core chip in response to the model information received from the interposer chip.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006298183-A (JP)
Title: Vehicle seat
Inventor: ISSHIKI KAZUHISA
IPC: B60N2/30
Filed: 2005-04-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vehicle seat capable of rapidly storing a seat body in one single operation.  <P>SOLUTION: In the vehicle seat, one side of a seat body S is turnably and pivotably supported by an inner wall of a vehicle, and a leg body 2 to support the other side of the seat body S is attachably/detachably coupled with a vehicle floor F by engagement means 21, 3, engaging operations of the engagement means 21, 3 are eliminated while a seatback S1 is tilted onto a seat cushion S2, and the seat body S is stored in a horizontal spring manner. The vehicle seat has an urging means to turn and urge the seat body S in the horizontal spring direction, interlocking means 51, 53, 54 to interlock the tiltation of the seatback S1 with elimination of the engaging operations of the engagement means 21, 3, and a pull-in means 24 to pull in the leg body 2 to the bottom surface direction of the seat cushion S2 as the seat body S is turned.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006296819-A (JP)
Title: Method and apparatus for separating needle tube of injection needle device
Inventor: ETO TETSUTARO
IPC: A61G12/00
Filed: 2005-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for separating a needle tube of an injection needle device, which enable the needle tube to be pulled out and separated from a syringe over a very short period of time without contact with the needle tube, soon after use, and which enable the heat sterilization to be applied to the needle tube.  <P>SOLUTION: The needle tube of the injection needle device is held in the state of being sandwiched by a pair of needle tube sandwiching parts. A definite period of time has passed after the needle tube is heated or generates heat, and the needle tube is pulled out from a needle-tube supporting part when the needle-tube supporting part, made of a thermoplastic resin, of the disposal type injection needle device is pulled into a thermally-plasticized or molten state. Thus, the needle tube is held in a sandwiched state and heated in the state of being subjected to heat transfer, or generates the heat by an electrical method, so as to be pulled out by putting a needle-tube supporting surface of the syringe into a plasticized state or a molten state by the heat transferred from the needle tube. Consequently, the needle tube can be pulled out from the syringe, to which the needle tube is firmly fixed, over a very short period of time, without a touch with the needle tube after use; the heat sterilization can be applied to the needle tube; and safe disposal can be performed in such a manner that the needle tube is separated from the thermoplastic resin for the syringe, a piston, etc. Additionally, since the molten resin of the syringe does not adhere to the needle tube, a top surface of a case and the needle-tube sandwiching part can be kept clean without making the molten resin of the syringe accumulated by adhering to a needle-tube pull-out device even if high-volume processing is performed.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006302062-A (JP)
Title: Process management device
Inventor: YAMADA JUNJI
IPC: G06Q10/00
Filed: 2005-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technology for managing, not sensuously but in an engineering manner, the progress of a whole part, each iteration, each sub-system and each individual in a Unified Process, and for visually expressing inter-data relevancy including measurement data such as an NCSS.  <P>SOLUTION: In the process management system for managing a repetitive software development process while managing the risk of a Unified Process or the like is characterized in that corresponding items (for example, the transition of the mounting progress value of a scenario progress corresponding to the transition of an NCSS) can be highlighted.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006299995-A (JP)
Title: Knocking determining device for internal combustion engine
Inventor: KANEKO MASATO
IPC: F02D45/00
Filed: 2005-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To precisely determine whether knocking occurs.  <P>SOLUTION: An engine ECU executes a program which includes steps of: (S102) of calculating such a value (an integrated value) that a value showing the strength of vibration is integrated for every crank angle of 5° on the basis of each frequency band for detecting a vibration waveform; (S104) discriminating whether the vibration of each frequency band includes vibration of noise components; (S106) combining vibration waveforms of other frequency bands than the frequency band including the vibration of noise components and knocking waveform models; (S114) calculating knocking strength N in accordance with the result of comparing the combined vibration waveforms with the combined knocking waveform models; and (S118) determining that knocking occurs when the knocking strength N is greater than a predetermined value (YES in S116).  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006303356-A (JP)
Title: Packaging method of electronic component
Inventor: KOBAYASHI TAKESHI
IPC: H05K3/34
Filed: 2005-04-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a packaging method of an electronic component in which burnt deposit of a substrate material and bonding failure can be suppressed while suppressing gap in bonding position of an electronic component and a wiring board.  <P>SOLUTION: The packaging method comprises a step for mounting an electronic component 200 having a plurality of electrodes 200a for bonding to a plurality of electrode pads 3 on a mother board 1, i. e. a wiring board, having a substrate 2 composed of a laser light transparent material and the plurality of electrodes pads 3 formed on the surface of the substrate such that corresponding electrodes overlap through solder paste 6, and a step for bonding both electrodes by irradiating the substrate 2 with YAG laser light L from the rear surface side and irradiating the rear surface of the electrode pad 3 with YAG laser light L transmitted the substrate 2 from the rear surface side to the surface side thereby melting solder grins in solder paste 6 wherein the mother board 1 is provided with a through hole 3a in the electrode pad 3.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006310334-A (JP)
Title: Flipchip mounting method
Inventor: NAKATANI NAOTO
IPC: H01L21/60
Filed: 2005-04-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a flipchip mounting method having high connection reliability.  <P>SOLUTION: This flipchip mounting method is provided with (a) a process of forming an electrode on a wiring board; (b) process of forming a gold bump on the electrode of a semiconductor chip; (c) process of forming a tin film of a previously decided film thickness on a transfer plate; (d) process of processing the tin film formed in the process c into a previously decided size with the position of the gold bump formed in the process b; (e) process of transferring the processed tin film acquired in the process d on the gold bump acquired in the process b, and formed on the electrode of the semiconductor chip; and process (f) of joining the gold bump of the semiconductor chip acquired in the process e on which the tin film is transferred, on the electrode of the wiring board formed in the process a.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2005236328-A (JP)
Title: Semiconductor element and method for forming semiconductor layer
Inventor: HATA MASAYUKI
IPC: H01S5/347
Filed: 2005-04-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for forming a ZnO semiconductor layer and a semiconductor element, by which an appropriate orientation can be selected from a plurality of crystal orientations and an element region can be arranged.  <P>SOLUTION: The method comprises a process of forming a plurality of mask layers separated at a predetermined interval on the upper surface of a substrate, and a process of forming the ZnO semiconductor layer using the mask layers as a selection growth mask. In this way, the ZnO semiconductor layer having a low dislocation propagating to the vertical direction is formed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006304978-A (JP)
Title: Teapot
Inventor: MORI KAZUO
IPC: A47J31/06
Filed: 2005-04-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a teapot, wherein used tea leaves can be removed easily from a teapot main body without being caught by a lid-receiving shelf, and a tea strainer is washed easily when it is used and a mesh of the used tea strainer is hardly clogged with the used tea leaves.  <P>SOLUTION: The teapot 1 is provided with a teapot body 2 having an opening part 5 for supplying the tea leaves and a liquid from outside, and a spout 4 for pouring the liquid to outside; and a lid body 3 for covering the opening part 5 of the teapot body 2. The lid receiving shelf 6 consists of a lid-receiving surface 7 for receiving the lid 3 horizontally in the case of placing the teapot body 2 on a horizontal surface, and an opening side face 8 which is connected with an inner surface 9 extended downward nearly vertically or smoothly in the state of a curved surface from the lid-receiving surface 7 to form the opening part 5 and forming the internal space 14 of the teapot body 2 without becoming parallel to the lid-receiving surface 7 is formed at the opening part 5 of the teapot body 2.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006283538-A (JP)
Title: Multi-safety bedding
Inventor: NAGAKUBO ICHIRO
IPC: E04H1/12
Filed: 2005-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide multi-safety bedding superior in comfortableness and safety in earthquake country Japan having an interior trim and a facility higher than the highest class automobile in a home, by enclosing the outside of the multi-safety bedding for the home in a double layer with titanium or strengthened light metal, and enclosing the inside with asbestos and incombustible cloth or titanium or a thin material of light metal.  <P>SOLUTION: This bedding is formed for protecting oneself by self-responsibility as the final bedding for protecting oneself from falling-in of a building and a dropping object by enclosing the outside of the bedding with a material of doubly forming the light metal such as titanium, protecting oneself from a fire by enclosing the inside with the thin material of titanium by a thermal insulation material such as asbestos, and further removing anxiety such as an earthquake, pollen, bacteria and health by applying a facility higher than the highest class automobile; and its form may be both a circular shape and a quadrangular shape. A couple type can also be formed, and its form may be large. A power source for a home is normally used, and is switched to a battery in an emergency.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006305477-A (JP)
Title: Pulverizer
Inventor: ASAKURA TAKAYUKI
IPC: B02C18/12
Filed: 2005-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pulverizer in which an object can be repeatedly and efficiently brought into impact-contact with a rotary pulverizing knife several times necessary and sufficient for pulverizing the object.  <P>SOLUTION: A pulverizing chamber which has a bottom face and is cylindrical and has a charging port at an upper part and an openable and closable discharging port at a lower part, is provided on a stand. The blade-shaped pulverizing knife rotating around the center of the pulverizing chamber is provided at the inner bottom part of the pulverizing chamber in a shape of a diameter. The pulverizing knife is characterized by being provided with a gentle slope section of an ascending shape formed at one end part, a gentle slope section of a descending shape formed at the other end part and a horizontal part joining the respective gentle slope sections to each other.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006305482-A (JP)
Title: Adsorption element
Inventor: OSHIMA KAZUNORI
IPC: B01J20/18
Filed: 2005-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an improved adsorption element of the rotor structure, which can be manufactured at lower costs, and further exert a higher adsorbability.  <P>SOLUTION: The adsorption element (1A) is a cylindrical element comprised by allowing a cylindrical honeycomb structure (1a) in which many cells (4) for ventilation are provided on the periphery to hold an adsorbent, and the honeycomb structure (1a) is provided with a structure that only substantially corrugated plate type sheets (31) are stacked along the circumference, by which the opening shape of each cell (4) is formed substantially in a hexagon. Further, the cylindrical adsorption element is constituted by allowing the cylindrical honeycomb structure in which many cells for ventilation are provided on the end to hold the adsorbent, the honeycomb structure is provided with the structure that only the substantially corrugated plate type sheets are stacked along the circumference, and the opening shape of each cell is formed substantially in a hexagon.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006307307-A (JP)
Title: Wiring cable for moving part in robot
Inventor: KUROKI KAZUMA
IPC: B25J19/00
Filed: 2005-05-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring cable for moving part in a robot which satisfies high tensile strength, high buckling resistance and high electric conductivity and has good productivity.  <P>SOLUTION: The wiring cable 10 for moving part in the robot related to this invention comprises an insulating layer around the cable conducting body 11, and the cable conducting body 11 is constituted with a copper alloy material containing 0.25-1.0 wt.% ratio of the total of Sn and In in the copper based material containing 0.001-0.1 wt.% (10-1000 wt.ppm) oxygen.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006312466-A (JP)
Title: Work guide
Inventor: SAHASHI TETSUHIRO
IPC: B65D19/38
Filed: 2005-05-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a work guide which does not need to process a slit for fixing the work guide in a manner to be position-adjustable on a plate material, and can be manufactured by a minimum welding even when welding is performed.  <P>SOLUTION: This work guide 11 is equipped with a fixing section 12 for fixing the work guide 11 to a supporting member, a strut 13 which extends upward from the fixing section 12, and a guide section 14 which is provided on the upper end of the strut 13. The work guide 11 is formed by bending one round bar made of a steel. The fixing section 12 is formed into an oval shape, and is fixed to the supporting member with a plurality of bolts which are passed through the fixing section 12 in a manner to be position-adjustable.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006317992-A (JP)
Title: Personal information management system, personal information management server and personal information management program
Inventor: URA SEIJI
IPC: G06F21/31
Filed: 2005-05-10
Abstract: <P>PROBLEM TO BE SOLVED: To surely prevent careless outflow or leak of personal information, illicit use of personal information and the like to protect personal information by preventing careless transmission of a content seemed unnecessary for a user.  <P>SOLUTION: A filter for regulating, for each user accessible from a client terminal 20, personal information elements usable by the user is set in a personal information capsule. Upon receipt of an access request to the personal information capsule from a user, filtering processing of personal information elements within the personal information capsule is performed using the filter set to the user concerned to extract the personal information elements usable by this user from the personal information capsule, and the extracted personal information elements are transmitted as a personal information file to the client terminal 20.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006319008-A (JP)
Title: Heat sink
Inventor: SHIGETOMI MASAYUKI
IPC: H01L23/36
Filed: 2005-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat sink which offers superior reliability and versatility.  <P>SOLUTION: The heat sink radiates heat to cool a semiconductor device. The heat sink comprises a leg which covers the semiconductor device and has a vertically penetrating female screw formed at the center of a covered face; a heat sink body which has an upper face on which heat-radiating fins are formed and a lower face at the center of which a male screw is formed, which male screw projects vertically downward with a flat front end face to screw down on the female screw; and a heat conductive buffering material which is so interposed between the front end face of the male screw and the upper face of the semiconductor device that the front end face and the upper face stick closely together.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006316547-A (JP)
Title: Beam structure
Inventor: SAITO HIDETO
IPC: E04B1/20
Filed: 2005-05-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a beam structure for improving working efficiency of bar arrangement work of a beam main reinforcement material, and capable of preventing separation of cover concrete of an end part of an expansion part.  <P>SOLUTION: This beam structure forms the whole of a structure having at least a reinforcement 4 and concrete 3, and forms the expansion part 5 formed in a larger cross section than the other part in its part and having an end surface 5a existing in a plane vertical to the beam axis direction. An end part of the beam main reinforcement material 12 is projected from the end surface 5a of the expansion part 5, and a fixture 15 for fixing the beam main reinforcement material 12 by the end surface 5a of the expansion part 5, is arranged in an end part of this bream main reinforcement material 12.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006003884-A (JP)
Title: Manufacturing method for photoreceptor drum
Inventor: MURAYAMA MASAKATSU
IPC: C23G5/00
Filed: 2005-05-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a photoreceptor drum designed such that soil on its support can be removed.  <P>SOLUTION: The support 12 is soaked in a washing liquid such that the upper end of the support 12 sticks beyond the liquid surface W of the washing liquid. Some of soil 50, separated from the circumferential face of the support 12, is moved upward against a descending current B, follows a lateral current A, and is led to a washing tank 18. The remaining soil 50 follows a descending current B and is led out of the washing tank 18 from the bottom of the washing tank 18. The soil 50 thus separated is stored in the support 12 since the washing liquid flows into the support 12 from the lower end of the support 12. Further, the support 12 is sunk below the liquid surface W of the washing liquid at such a speed that the soil stored in the support 12 together with the washing liquid filling the support 12 is not discharged above the liquid surface W of the washing liquid. When the entire support 12 is soaked in the washing liquid, a descending current B of the washing liquid is created within the support 12. Thereafter, the support 12 is sunk into the washing liquid at the speed equal to or lower than that of the descending current B.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006320953-A (JP)
Title: Body joined by welding dissimilar metal members made of ferrous alloy and aluminum alloy
Inventor: OKA KOICHIRO
IPC: B23K26/21
Filed: 2005-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a body joined by welding dissimilar metal members, which body can get merits, such as excellent joining strength and high productivity substantially equal to those of a body joined by welding similar property members, by completely eliminating disadvantages and problems in prior arts for joining a ferrous alloy member and an aluminum alloy member, such as conventional steel and 5000 series aluminum alloy.  <P>SOLUTION: In the body joined by welding dissimilar metal members, the ferrous alloy member 1 and the aluminum alloy member 2 are welded by the heat input from the side of the ferrous alloy member 1. The body joined by welding the dissimilar metal members comprises a welded and solidified portion which has been continuously and integrally composed of a melted and solidified ferrous alloy portion B melted and solidified in the ferrous alloy member 1, a melted and solidified ferrous alloy portion A melted and solidified in the aluminum alloy member 2, and a melted and solidified aluminum alloy portion G melted and solidified in the aluminum alloy member 2, wherein the melted and solidified aluminum alloy portion G is composed of crystal grains having a grain size of 3 μm or less.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006325672-A (JP)
Title: Endoscope apparatus
Inventor: TAKEMURA TAKASHI
IPC: G02B23/24
Filed: 2005-05-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an endoscope apparatus providing a good fluorescent observation image.  <P>SOLUTION: The endoscope apparatus comprises an endoscope having an imaging unit for imaging a predetermined subject image containing at least an image of a color balance adjusting device and for outputting the image as an image signal, an image processing device for carrying out color balance adjustment with regard to the image signal, and a display device for displaying the subject image underwent color balance adjustment. The image processing device calculates a first correction value used for color balance adjustment on the basis of the luminosity value of the image of the color balance adjusting device taken by the image unit and also on the basis of a second correction value which is based on characteristic variances generated at the color balance adjusting device.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006327957-A (JP)
Title: Mite repellent
Inventor: ISHIDA HIROHIKO
IPC: A01N25/00
Filed: 2005-05-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mite repellent capable of being safely used in a room, capable of effectively acting even inside a carpet, a sofa, a padded mattress, etc., and having an excellent repellent effect on a mite living in the room.  <P>SOLUTION: This mite repellent contains one or more kinds selected from 6-12C straight-chain aliphatic aldehydes as active ingredients.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006332242-A (JP)
Title: Wafer conveyance device and grinding-etching system of wafer
Inventor: NISHIKAWA KOTARO
IPC: H01L21/677
Filed: 2005-05-25
Abstract: <P>PROBLEM TO BE SOLVED: To enable it to irradiate efficiently with ultraviolet rays the ultraviolet ray curing type masking tape currently stuck on the front surface at the time of rear surface grinding of a wafer, and to enable it to convey the wafer after ultraviolet-rays irradiation to a plasma etching device certainly.  <P>SOLUTION: A wafer conveyance device 4 for conveying a wafer W between a grinding device 2 for grinding the rear surface of the wafer W to which an ultraviolet curing tape is stuck on the surface and a plasma etching device 5 for carrying out plasma etching of the rear surface after grinding comprises a holder 40 for holding a wafer; and a support 41 for supporting the holder which makes the holder 40 move between the grinding device 2 and the plasma etching device 5. An ultraviolet-rays irradiator 43 is provided for irradiating ultraviolet rays to the curing tape stuck on the wafer in the move course of the holder 40. In this way, ultraviolet rays can be efficiently irradiated in the middle of movement.  <P>COPYRIGHT: (C)2007,JPO&INPIT