Patent SG-11201408661W-A (SG)
Title: Microetching agent for copper, replenishment solution thereof, and method for producing wiring board
Inventor: KURII MASAYO
IPC: C23F1/18
Filed: 2013-03-04
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi (43) m&'&m a 2014^1 R 30 0(30.01.2014) WIPOIPCT (10) WO 2014/017115 A1 (51) C23F1/18 (2006.01) (21) (22) g&ttHQ: (25) (26) 4>§fl(£> s In: H05K3/38 (2006.01) PCT/JP2013/055843 2013 ^3^ 4 0(04.03.2013) (30) fiBfefix — $: 4#Jg| 2012-164006 2012 ^ 7 M 24 0(24.07.2012) JP (71) tti H A V > 7 ^ ^ tt (MEC COMPANY LTD.) [JP/JP]; T 6600832 SET 1 #±fe Hyogo (JP). (72) Stft(KURII, Masayo); T 6600832 ^ J¥»J§«SmSS]ftBri #±te Hyogo (JP). H# jf^(TAI, Kiyoto); T 6600832 ^ J¥»J§«SmSS]ftBri #±te > y*tt5££art Hyogo (JP). ^ fa li (NAKAMURA, Mami); T 6600832 1 #±fe ^ V b Hyogo (JP). (74) ftHA: |JT^ IT? A, ^(SHINTAKU, Masato cl al.); T 5410054 5 -7 mEifju Osaka (JP). (8i) Jt^ia (^ro&i^PBy, IS ^ pj f £): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). mm-' fn (54) Title: MICROETCHING AGENT FOR COPPER, REPLENISHMENT SOLUTION THEREOF, AND METHOD FOR PRO- DUCING WIRING BOARD (57) Abstract: Provided are: a microetching agent; a replenishment solution for the micro- etching agent; and a method for producing a wiring board using the microetching agent. A microetching agent of the present invention is composed of an aqueous solution that con­ tains cupric ions, an organic acid, halide ions, an amino group-containing compound having a molecular weight of 17-400, and a polymer. The polymer is a water-soluble polymer that has a polyamine chain and/or a cationic group, while having a weight average mo­ lecular weight of 1,000 or more. With respect to this microetching agent, if A (wt%) is the concentration of the amino group-containing compound and B (wt%) is the concentration of the polymer, the value of A/B is 50-6,000. According to the present invention, adhesion between copper and a resin or the like can be maintained even if the amount of etching is small. •H i-H l> © T? i-H o CJ O £ (57)®$: U -7-r <7 • fflEHSte o) m ^11 7~4 0 0©7 5/Sttlt U TK ') -7 - £ 1 1?7k m%l fr b fc & o flu IB TK U -7 - li > TK U 7 5 >$£%. XS/R li ± A/B0i^'5O~ L> 1 0 0 0 Jil±C07K;itt7KU -?—Vfo£ c 5/AII% t u TKU-?-a>;iJt£Bi 6000fWo *f§BJI::£*il£\ fix*:/? 1 wo 2014/017115 AI i inn nil ii mil mi mil in mi i ii ill mil mi inn mi mi mi mill mi 111 mi - (^$^21^(3))