Patent SG-11201804855S-A (SG)
Title: Methods and apparatus for processing a substrate
Inventor: WANG RONGJUN
IPC: H01L45/00
Filed: 2016-12-12
Abstract: 12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/112439 Al 29 June 2017 (29.06.2017) WIPO I PCT 11111111111111011101111111111101011111011101110111010111110111110111111111110111111 100 (51) International Patent Classification: H01L 21/02 (2006.01) HOlL 43/12 (2006.01) H01L 45/00 (2006.01) (21) International Application Number: PCT/US2016/066080 (22) International Filing Date: 12 December 2016 (12.12.2016) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 14/975,793 20 December 2015 (20.12.2015) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: WANG, Rongjun; 5139 Hinsdale Court, Dub- lin, California 94568 (US). SUBRAMANI, Anantha K.; 4245 Merlot Court, San Jose, California 95135 (US). CHING, Chi Hong; 2805 Barcells Avenue, Santa Clara, California 95051 (US). TANG, Xianmin; 7044 Anjon Creek Circle, San Jose, California 95120 (US). (74) Agents: TABOADA, Alan et al.; Moser Taboada, 1030 Broad Street, Suite 203, Shrewsbury, New Jersey 07702 (Us). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, [Continued on next page] (54) Title: METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE (57) : Methods and apparatus for processing a substrate are dis- closed herein. In some embodiments, a process chamber includes: a chamber body defining an interior volume; a substrate support to support a substrate within the interior volume; a plurality of cathodes coupled to the chamber body and having a corresponding plurality of targets to be sputtered onto the substrate; and a shield rotatably coupled to an upper portion of the chamber body and having at least one hole to expose at least one of the plurality of tar- W O 20 17 / 112439 Al gets to be sputtered and at least one pocket disposed in a backside of the shield to accommodate and cover at least another one of the plurality of tar- gets not to be sputtered, wherein the shield is configured to rotate about and linearly move along a central axis of the process chamber. 138 FIG. 1 WO 2017/112439 All#110H01101DION01010M01011010111110H0111111VOIS SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, Published: GW, KM, ML, MR, NE, SN, TD, TG). — with international search report (Art. 21(3))