baber/WOPTO huggingface dataset:
Patent JP-2017209296-A (JP)
Title: Measurement device and evaluation method for eye surface friction coefficient/eyelid friction coefficient
Inventor: OKAMOTO SHINGO
IPC: A61B3/10
Filed: 2016-05-25
Abstract: PROBLEM TO BE SOLVED: To provide a measurement device for an eye surface friction coefficient/an eyelid friction coefficient capable of properly measuring an eye surface friction coefficient/an eyelid friction coefficient, and an evaluation method for an eye surface friction coefficient/an eyelid friction coefficient.SOLUTION: The measurement device for an eye surface friction coefficient/an eyelid friction coefficient is a device for estimating a friction coefficient μ of an eye surface and or of/an eyelid and comprises: a measurement unit 20 comprising a contact unit 22 having a contactor 23 being brought into contact with the eye surface or the eyelid, and a biasing mechanism 25 for biasing the contact unit 22 toward the tip of the contactor 23; a movement mechanism 10 for moving the measurement unit 20 along the direction intersecting with the direction in which the biasing mechanism 25 biases the contactor 23; and a friction coefficient estimation unit 30 for estimating the friction coefficient μ of the eye surface and/or the eyelid. The movement mechanism 10 comprises an encoder 16 for measuring a movement speed V of the measurement unit 20. The friction coefficient estimation unit 30 has a function for estimating the friction coefficient μ of the eye surface and/or the eyelid based on the biasing force generated by a spring 26 and the movement speed V of the measurement unit 20 detected by the encoder 16.SELECTED DRAWING: Figure 2
Patent JP-2017212154-A (JP)
Title: Heater unit
Inventor: KITABAYASHI KEIJI
IPC: H05B3/10
Filed: 2016-05-27
Abstract: PROBLEM TO BE SOLVED: To provide a heater for water heating which can quickly stabilize a temperature of a wafer to a changed temperature even when a setting temperature of wafer heating is changed.SOLUTION: A heater unit has: a placement base 1 including a wafer placement surface 1a for placing a semiconductor wafer which is a processed product; a support plate 2 supporting the placement base 1; and a film-like heating unit 3 sandwiched between the placement base 1 and the support plate 2. It is preferable to provide a movable cooling plate 60 which can reciprocate between a contact position and a separation position relative to a surface of the support plate 2 which is opposite to a facing surface facing the heating unit 3. A temperature measuring sensor 4 is attached to the heating unit 3.SELECTED DRAWING: Figure 1
Patent JP-2017209947-A (JP)
Title: Liquid injection device
Inventor: TOYA AKIHIRO
IPC: B41J2/175
Filed: 2016-05-27
Abstract: PROBLEM TO BE SOLVED: To provide a liquid injection device capable of reducing a height of the device.SOLUTION: A liquid injection device 11 comprises: a liquid injection head 32 injecting liquid supplied from a liquid supply body 60 toward a medium S; a container 70 into which the liquid supply body 60 is put; and an attachment section 13 to which the container 70 and the liquid supply body 60 put into the containers 70 are detachably attached. In the container 70, a length of a width is longer than that of a height out of individual lengths of the height, a depth and the width in an attachment attitude thereof when being attached to the attachment section 13. A plurality of containers 70 having different widths can be attached to the attachment section 13 in a mode in which the plurality of containers 70 are arranged side-by-side in a width direction.SELECTED DRAWING: Figure 2
Patent JP-2017210843-A (JP)
Title: Sash fitting bracket
Inventor: SUGIURA IKKYO
IPC: E06B1/56
Filed: 2016-05-27
Abstract: PROBLEM TO BE SOLVED: To provide a sash fitting bracket capable of adequately fixing a sash frame with a depth portion that is wider than a substrate member to the substrate member.SOLUTION: A pair of tripod plates 54 protrude from a base substance 50A of a base part 50 of a metal fitting 48 and a support plate 52 extends from a metal fitting. The metal fitting 48 is disposed between a jamb 40 and the substrate material 34 of the sash frame 36, and the pair of tripod plates 54 are engaged with and fixed to the substrate material 34 by being engaged between flange 34A of the substrate material 34. The support plate 52 faces the jamb 40 protruding from the substrate material 34 toward indoor side. As the indoor side of the jamb 40 is fixed to the support plate 52, which causes the indoor side of the jamb 40 to be fixed to the substrate material 34 through the metal fitting 48, the sash frame 36 is adequately fixed to the substrate material 34 even if the depth D of the jamb 40 is larger than the width dimension C of the substrate material 34.SELECTED DRAWING: Figure 1
Patent JP-2017213930-A (JP)
Title: Air bag device and folding method of air bag
Inventor: HASHIMOTO KAZUSHIGE
IPC: B60R21/237
Filed: 2016-05-30
Abstract: PROBLEM TO BE SOLVED: To provide an air bag device and a folding method of air bag capable of surely expanding the air bag between a lower limb part of an occupant and a panel.SOLUTION: A first folding part 51 is formed by folding a tip side of an air bag 10 toward a base end side. A second folding part 53 is formed by folding the air bag 10 so as to wrap the first folding part 51 in a U-shape opening toward the base end side. A third folding part 54 is formed by folding the air bag 10 so that at least one part is located opposing to an opening side of the second folding part 53. First, the third folding part 54 quickly inflates and expands and pushes the first folding part 51 out of a case 21 together with the second folding part 53, and the second folding part 53 inflates and expands and pushes the first folding part 51 upward, and then, the first folding part 51 expands. The air bag 10 can be surely expanded between a lower limb part A of an occupant and a panel 14.SELECTED DRAWING: Figure 1
Patent JP-2017220579-A (JP)
Title: Wafer processing system
Inventor: TOGASHI KEN
IPC: B23K26/53
Filed: 2016-06-08
Abstract: PROBLEM TO BE SOLVED: To provide a wafer processing system capable of suppressing reduction in quality of a device chip to be manufactured by suppressing damage in a wafer at the time of transferring the wafer.SOLUTION: A wafer processing system comprises: a laser processing device; a grinding device; a tape sticking device; a first cassette mounting unit; a second cassette mounting unit; a transfer unit for transferring a wafer; and control means for controlling respective components. The control means comprises: a first processing program instruction unit that transfers a wafer exported from a first cassette to the laser processing device, the grinding device, the tape sticking device, and the second cassette in this order to sequentially apply processing by the respective devices to this single wafer; and a second processing program instruction unit that transfers a wafer exported from the first cassette to the grinding device, the laser processing device, the tape sticking device, and the second cassette in this order to sequentially apply processing by the respective devices to this single wafer.SELECTED DRAWING: Figure 3
Patent JP-2017220600-A (JP)
Title: Component mounting apparatus
Inventor: IKEDA KOJI
IPC: H05K3/34
Filed: 2016-06-09
Abstract: PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of preventing a discharged paste from splashing to a part other than an applying object when applying the paste to an electronic component.SOLUTION: The component mounting apparatus is for mounting an electronic component 19 as a first component held by the mounting head 9 onto a substrate 3 as a second component. The component mounting apparatus includes a discharge part 6a to eject a paste P to the electronic component 19 held by the mounting head 9 to apply the same. The mounting head 9 is provided with a splash prevention cover 17 as a paste receiver for capturing the paste which is discharged from a discharge part 6a which does not reach to the electronic component 19. With this, the discharged and splashed paste can be captured on the lower face of the splash prevention cover 17.SELECTED DRAWING: Figure 4
Patent JP-2016166248-A (JP)
Title: Ophthalmic compositions for silicone hydrogel contact lenses
Inventor: FUKUSHIMA KAZUHIRO
IPC: A61P27/02
Filed: 2016-06-13
Abstract: PROBLEM TO BE SOLVED: To provide ophthalmic compositions for silicone hydrogel contact lenses, the ophthalmic compositions being able to inhibit the lipid adsorption to the surfaces of nonionic silicone hydrogel contact lenses or inhibit the adsorption of pollen proteins to ionic silicone hydrogel contact lenses.SOLUTION: The ophthalmic composition for silicone hydrogel contact lenses is prepared using (A) at least one selected from the group consisting of polyhexanide and a salt thereof in combination with (B) at least one selected from the group consisting of chlorpheniramine, cromoglycate, pranoprofen, glycyrrhizinic acid, neostigmine, and salts thereof.SELECTED DRAWING: None
Patent JP-2017057546-A (JP)
Title: Working glove
Inventor: TAKEKITA TAKAFUMI
IPC: A41D19/015
Filed: 2016-06-13
Abstract: PROBLEM TO BE SOLVED: To provide a working glove having an excellent protectivity and workability which is suitable for a water jet work and the like.SOLUTION: A working glove suitable for a water jet work has a finger cover including: elastic first, second, and third fabric parts 31-33 divided at joints of a finger: first, second, and third protector pieces 31a-33a inserted into the first, second, and third fabric parts; an elastic fourth fabric part 34 provided inside a divided part of the first and second fabric parts and covering a first joint; and a fourth protector piece inserted into the fourth fabric part. The first, second, third, and fourth fabric parts are elastically joined with the fabric parts adjacent to each other. A back-hand cover 4 includes an elastic fifth fabric part 41 divided at a third joint of a finger base and a fifth protector piece inserted into the fifth fabric part. The fifth fabric part 41 is elastically joined with the third fabric part 33.SELECTED DRAWING: Figure 1
Patent JP-2017221278-A (JP)
Title: Game machine
Inventor: KIMATA KENJI
IPC: A63F7/02
Filed: 2016-06-13
Abstract: PROBLEM TO BE SOLVED: To provide a game machine capable of having at low costs a configuration that prevents abnormal voltage from being supplied for electrical components when power source higher than rated voltage is supplied.SOLUTION: A power supply board includes a first overvoltage protection circuit 80 between a power supply circuit 79 and a power supply switch 78. The first overvoltage protection circuit 80 is provided with a relay contact 81 opening/closing a first power source line L1 in the first power source line L1 that connects the power supply switch 78 and the power supply circuit 79. The first overvoltage protection circuit 80 is provided with a voltage monitoring circuit 83 for opening/closing the relay contact 81. The first overvoltage protection circuit 80 allows supply of source voltage for the power supply circuit 79 by putting the relay contact 81 in a closed state when the source voltage applied to the voltage monitoring circuit 83 is below threshold voltage, and interrupts supply of the source voltage for the power supply circuit 79 by putting the relay contact 81 in an open state when the source voltage applied to the voltage monitoring circuit 83 is threshold voltage or larger.SELECTED DRAWING: Figure 4
Patent JP-2017223858-A (JP)
Title: Carrier for electrostatic latent image development and production method of the same
Inventor: KURANO YUSUKE
IPC: G03G9/113
Filed: 2016-06-16
Abstract: PROBLEM TO BE SOLVED: To prevent occurrence of carrier development and fogging and to maintain high developability even in continuous printing.SOLUTION: A carrier particle 40 includes a carrier core 41 having a recess on a surface thereof, and a first coating layer 42 and a second coating layer 43 covering the surface of the carrier core 41. The first coating layer 42 and the second coating layer 43 have a layered structure of, successively from the surface of the carrier core 41, the first coating layer 42 and the second coating layer 43. The first coating layer 42 comprises a first resin, while the second coating layer 43 comprises a second resin. At least the second coating layer 43 in the first coating layer 42 and the second coating layer 43 contains a conducting agent. The electric resistance of the second coating layer 43 is lower than the electric resistance of the first coating layer 42. The first coating layer 42 covers the entire surface of the carrier core 41. The second coating layer 43 selectively covers a portion corresponding to the recess on the surface of the carrier core 41 in the surface region of the first coating layer 42.SELECTED DRAWING: Figure 1
Patent JP-2017226603-A (JP)
Title: Multilayer-type cosmetic
Inventor: HAYASE MOTOI
IPC: A61K8/34
Filed: 2016-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer-type cosmetic which comprises a mannosylerythritol lipid, has good dispersibility in a uniformly dispersed state when shaken, is clearly separated into two or more layers at the interface when left to stand and has also excellent sense of use without stickiness pr the like.SOLUTION: There is provided a multilayer-type cosmetic which comprises the following components (A) to (C), where the content mass ratio ((B)/(C)) of the component (B) to the component (C) is 0.07 or more and 8 or less and the content mass ratio (water/[(A)+(B)]) of water to the total of the components (A) and (B) is 0.1 or less: (A) a mannosylerythritol lipid, (B) a polyhydric alcohol other than the component (A) and (C) a liquid oil composed of an oily agent having an IOB value of 0 or more and 0.18 or less.SELECTED DRAWING: None
Patent JP-2017227065-A (JP)
Title: Parameter leading method for new bulkhead
Inventor: KATAOKA YASUTO
IPC: E02B3/06
Filed: 2016-06-24
Abstract: PROBLEM TO BE SOLVED: To reduce cost and time required for leading of parameters relating to design for new bulkhead.SOLUTION: A parameter leading method includes: a relational formula leading step where a relational formula showing correlation between a pocket area ratio as a ratio of pocket area of a new bulkhead 1 relatively to pocket area of an existing bulkhead 100 and an overtop wave flow rate ratio as a ratio of an overtop wave flow rate of the new bulkhead 1 relatively to the overtop wave flow rate of the existing bulkhead 100; a flow rate ratio leading step where the overtop wave flow rate ratio corresponding to the pocket area ratio of the new bulkhead 1 is led out from the relational formula; and a parameter leading step where another value is led out from existing correlation, which corresponds to water depth/wave height ratio of a value equivalent to a ratio of water depth relatively to designed wave height of the new bulkhead 1 and corresponds to one value of the overtop wave flow rate or top edge height/wave height ratio, and on the basis of the value, either of a set value of the top edge height for the new bulkhead 1 or an expected value of the overtop wave flow rate is led our as a parameter. The parameter leading step includes a conversion step where the value of the overtop wave flow rate associating with leading of the another value with the existing correlation is converted with the overtop wave flow rate ratio.SELECTED DRAWING: Figure 1
Patent JP-2017226585-A (JP)
Title: Silicon carbide powder
Inventor: ISHIDA HIRONORI
IPC: B24C11/00
Filed: 2016-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a silicon carbide powder which can be repeatedly used for blasting as an abrasive grain without significantly changing the surface roughness of the processed surface.SOLUTION: There is provided a silicon carbide powder having a Ti content of less than 0.5 ppm and a tap bulk density of 1.5 g/cmor more and 1.8 g/cmor less. There is provided a silicon carbide powder which is an abrasive grain for blasting.SELECTED DRAWING: None
Patent JP-2016169236-A (JP)
Title: Method for producing high-purity urea water
Inventor: KUWAKI TAKUYA
IPC: C07C273/16
Filed: 2016-06-27
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing high-purity urea water, in which the biuret concentration of the urea water can be reduced by using the inexpensively-produced urea and by an inexpensive method.SOLUTION: The method for producing high-purity urea water for a urea SCR system, which urea water is obtained by treating an urea water undiluted solution having 2,500 ppm or higher biuret concentration with activated carbon and has the reduced biuret concentration, comprises: a biuret adsorbing/removing step of treating the urea water undiluted solution of 100 ml with the activated carbon of 1.0-3.0 g; and a biuret desorbing/removing step of desorbing the biuret from the biuret-adsorbed activated carbon. At the moment that the biuret concentration exceeds a regulation value of 2,400 ppm when the biuret adsorbing/removing step is carried out, the biuret desorbing/removing step is carried out.SELECTED DRAWING: None
Patent JP-2018005999-A (JP)
Title: Ceramic heater
Inventor: FUKAZAWA KENICHI
IPC: H05B3/10
Filed: 2016-06-27
Abstract: PROBLEM TO BE SOLVED: To provide a ceramic heater in which base material temperature can be equalized.SOLUTION: A lower exothermic resistor 30 is constituted of: a first lower exothermic resistance element 31 connected with a lower terminal 60; second lower exothermic resistance elements 32a and 32b that are provided at an outer side from the outermost periphery of an upper exothermic resistor 20 in a top view, are connected with the lower exothermic resistance element 31, and are arranged respectively in lower annular areas which are separated from each other to overlap and surround the first lower exothermic resistance element 31; and a third lower exothermic resistance element 33 that connects both of the second lower exothermic resistance elements 32a and 32b arranged in the adjacent lower annular areas. The first lower exothermic resistance element 31 is a region positioned in an inner side from the outermost periphery of the upper exothermic resistance element 20 in the top view, and is arranged in the region having an area exceeding the area of the region linearly connecting the lower terminal 60 and the second lower exothermic resistance element 32a in a width of the third lower exothermic resistance element 33.SELECTED DRAWING: Figure 3
Patent JP-2018004960-A (JP)
Title: Image forming apparatus
Inventor: KURIBAYASHI MASATAKA
IPC: G03G15/08
Filed: 2016-07-01
Abstract: PROBLEM TO BE SOLVED: To provide an image forming apparatus that can suppress the occurrence of image deletion in a high-temperature and high-humidity environment.SOLUTION: An image forming apparatus comprises: electrophotographic photoreceptors that each include a surface protective layer; developing means that each store a developer including toner particles, where the toner particle contains a binder resin containing a crystalline polyester resin, colorant, and mold release agent, has an average circularity of 0.955 or more and 0.971 or less, has an abundance ratio of the toner particle having a particle diameter of 4.5 μm or more and less than 7.5 μm and a circularity of 0.980 or more of 16 number% or more and 40 number% or less, and has an abundance ratio of the toner particle having a particle diameter of 7.5 μm or more and less than 15 μm and a circularity of 0.900 or more and less than 0.940 of 3 number% or less; and cleaning means that each include a cleaning blade.SELECTED DRAWING: None
Patent JP-2018003977-A (JP)
Title: Oscillation isolation device
Inventor: HARADA YOICHI
IPC: F16F15/08
Filed: 2016-07-04
Abstract: PROBLEM TO BE SOLVED: To provide an oscillation isolation device capable of certainly attenuating and absorbing inputted oscillation regardless of oscillation input directions.SOLUTION: An oscillation isolation device comprises: an outside member 11 attached to any one of a vibration generating part and a vibration receive part and a cylindrical member attached to the other; and an elastic body 30 that connects the outside member 11 to the cylindrical member. The outside member 11 includes a frame shape member 11 having a rectangular shape as viewed from the top; and the elastic body 30 is formed rectangular parallelepiped having a rectangular shape as viewed from the top. The cylindrical member is disposed inside the frame shape member 11 in a top view; and the center axis O2 of the cylindrical member extends in a narrow side direction Y. The lower edge of a long side part of a rectangular parallelepiped shape in a top view in the frame shape member 11 is located inside from the upper end edge of the long side part in the narrow side direction Y. The long side part of the elastic body 30 is bonded on the inner peripheral surface of the long side part of the frame shape member 11; and the narrow side part of the elastic body 30 contacts the outside member 11 in a non-adhesion state.SELECTED DRAWING: Figure 1
Patent JP-2018003979-A (JP)
Title: Hydraulic circuit for hydraulic cylinder
Inventor: ARITA KAKUYA
IPC: F15B11/024
Filed: 2016-07-04
Abstract: PROBLEM TO BE SOLVED: To provide a hydraulic circuit for a hydraulic cylinder capable of automatically changing-over between a differential circuit and a non-differential circuit by a simple configuration and capable of stabilizing a moving speed of a cylinder rod during establishment of the differential circuit.SOLUTION: A hydraulic circuit of this invention comprises a hydraulic fluid conduit line for connecting a hydraulic power source with a second oil chamber; a direction selector valve for changing-over between a communicating state and a non-communicating state in the hydraulic fluid conduit line; a differential conduit line connected to the hydraulic fluid conduit line between the direction selector valve and the hydraulic power source to merge the hydraulic fluid in a first oil chamber with the hydraulic fluid conduit line; a check valve arranged at the differential conduit line; a differential releasing conduit line formed to be branched from the differential conduit line to discharge the hydraulic fluid in the first oil chamber to a hydraulic fluid tank; an external pilot type sequence valve configured to enable the communicated state and the non-communicated state at the differential releasing conduit line; and a differential releasing pilot conduit line for acting a pressure of the hydraulic fluid at the second oil chamber against the external pilot type sequence valve.SELECTED DRAWING: Figure 1
Patent JP-2018005064-A (JP)
Title: Radiation-sensitive resin composition, method for forming resist pattern, polymer and compound
Inventor: KINOSHITA NATSUKO
IPC: C08F20/28
Filed: 2016-07-05
Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in LWR performance, CDU performance, resolution, rectangularity of a cross-sectional shape, depth of focus, MEEF performance, and suppressibility of film shrinkage.SOLUTION: The radiation-sensitive resin composition comprises a first polymer having a first structural unit including a group represented by the formula (1) below, a radiation-sensitive acid generator, and a solvent. In the formula (1), R, R, and Reach independently represent a monovalent organic group having 1 to 20 carbon atoms; Rand Reach independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and L represents a single bond or a divalent organic group having 1 to 20 carbon atoms. In Rto Rand L, two or more of them may be joined to form a cyclic structure having 3 to 20 membered rings together with atomic chains bonded to them. Preferably, Rand Rin the formula (1) are organic groups; and these organic groups are preferably substituted or unsubstituted monovalent hydrocarbon groups having 1 to 16 carbon atoms.SELECTED DRAWING: None