baber/WOPTO huggingface dataset:
Patent TW-I227720-B (TW)
Title: Chlorinated vinyl resin/cellulosic blends: compositions, processes, composites, and articles therefrom
Inventor: PATTERSON JOHN ROBERT
IPC: B29C48/03
Filed: 2000-09-22
Granted: 2005-02-11
Abstract: Compositions and processes for preparing extrudable powder blends containing at least one vinyl chloride resin and a cellulosic material are provided. More specifically, compositions and processes for preparing extrudable free-flowing powder blends containing PVC and wood flour (WF) are also provided for preparing foamed or nonfoamed extrudates. The processes provided herein incorporate components which may contain up to a total of 25 weight percent water. Processes for preparing foamed extrudates are also provided wherein a cooling fluid is used to increase the expansion ratio of the foam. Finally provided are composites having an extrudable thermoplastic substrate and at least one capstock layer disposed thereon containing a PVC/WF composition.
Patent TW-550249-B (TW)
Title: Process for cleaning bisphenol pre-reactor
Inventor: CARE HENDRIK HERMAN
IPC: C07C39/16
Filed: 2000-09-28
Granted: 2003-09-01
Abstract: In a semicontinuous method for manufacturing bisphenols, reduced fouling in the pre-reactor is achieved by using two or more prereactors are used to continuously condense the dihydric phenol and the ketone or aldehyde to produce a partial reaction product in which the reaction of the dihydric phenol and the ketone or aldehyde is 10 to 70% complete. This partial reaction product is continuously removed from the pre-reactors, combined and introduced to a batchwise completion reactor. A stream of water or aqueous hydrochloric acid is added in alternating intervals to the pre-reactors, such that one is being cleaned by shifting the solubility of the bisphenol product at the same time that the other(s) continue to product a normal product stream which includes seed crystals for enhancing the performance of the batchwise completion reactor.
Patent TW-557417-B (TW)
Title: Method of striping a photoresist
Inventor: CHANG YI
IPC: G03F7/039
Filed: 2000-10-12
Granted: 2003-10-11
Abstract: A method of striping a photoresist on a surface of an OLED panel comprises steps of: providing a stripping agent unit to remove the photoresist on the OLED panel; spaying a cleaning agent by a cleaning unit to remove the residual stripping agent; providing a drying machine to dry the OLED panel; providing a delivering unit for carrying the OLED to the stripping unit, the cleaning unit and the drying machine; and providing a control unit for controlling the order and the time to deliver so as to control the treating period of each OLED panel precisely.
Patent TW-471198-B (TW)
Title: Connector for flexible printed board
Inventor: MIURA KAZUTO
IPC: H01R12/77
Filed: 2000-10-23
Granted: 2002-01-01
Abstract: A connector for flexible printed board has a housing with an opening, and a cover that is rotatable about a predetermined pivotal axis for opening or closing the opening. The free end of a resilient piece for a fork-shaped contact has the first and the second branches. The second branch includes a contact point coming into contact with a flexible printed board inserted in an insertion space. One edge of the cover is provided with a regulating portion interposed between the first and the second branches. The regulating portion restricts bi-directional displacements of the free end of the resilient piece within a predetermined range.
Patent TW-457754-B (TW)
Title: Mold for automatically assembling conductive terminal and the process thereof
Inventor: JANG JENG-KUAN
IPC: H01R43/00
Filed: 2000-11-01
Granted: 2001-10-01
Abstract: The present invention is a mold to automatically assemble conductive terminal automatically and the process thereof. When the adhesive material and the conductive band material are sent to the assembly terminal of the upper mold and the bottom mold, one side of the conductive band material has a tilting angle with the adhesive material by bending the upper mold, the other side of the conductive band material has a tilting angle with the adhesive material by cutting and bending the bottom mold. When the adhesive material and the conductive band material enter the bottom stand of the bottom mold synchronously, the adhesive material is pressed at the same time through the positioning of the pressing component of the upper mold on the adhesive material, so that the adhesive material, the conductive band material and the bottom stand are pressed downward synchronously to embed both sides of the conductive band material into the adhesive material, and bounce back upward the formed product after it is embedded through the bottom stand, thereby the adhesive material and the conductive band material can complete the assembling operation of the formed product, so as to increase the timing and competitiveness during the manufacturing operation, and greatly save the working hours and labor.
Patent TW-530017-B (TW)
Title: Multi-gear hub for a bicycle
Inventor: STEUER WERNER
IPC: B62M11/16
Filed: 2000-12-21
Granted: 2003-05-01
Abstract: The present invention relates to a multi-gear hub for a bicycle, containing a hub axis, a driver rotatably installed in the hub, a shift drive having at least two gear stages, a hub bushing, a shift device to switch the gear stages in the shift driver, wherein a rotation element contains curve rail, which in case of gear shift acts in cooperation with an adjusting element so as to change its own position, wherein the adjusting element to switch from one gear stage into another gear stage can be brought through the shift device to a rotation number different to the rotation number of the rotation element. Therefore, the curve rail of the rotation element can conduct on the protrusion of the adjusting element and through the axial position switch of the rotation elements can release its coupling connection with the driver-parts. The advantage in the above-mentioned auxiliary support disconnection of the paw coupling lies in its cost saving manufacturing, in the possibility to arrange several such auxiliary support shift device and in the possibility to install over-load-protection without the requirement of a lager space.
Patent TW-471147-B (TW)
Title: Bonding pad structure and process of chip
Inventor: LIN JIAN-SHING
IPC: H01L23/488
Filed: 2001-03-07
Granted: 2002-01-01
Abstract: A bonding pad structure of chip is disclosed, wherein the bottom copper damascene metal layer is allocated on the device region and the bonding pad region in the layout of copper wire, the rest copper damascene metal layer is allocated in the device region only, the dielectric layer of the bonding pad region form an opening to expose part of the bottom copper damascene metal layer, and form a bonding pad in the opening, which is electrically connected with the bottom copper damascene metal layer.
Patent TW-576798-B (TW)
Title: Method of manufacturing ink supplying channels in an inkjet printing chip
Inventor: MO TZ-JR
IPC: B41J2/135
Filed: 2001-03-15
Granted: 2004-02-21
Abstract: This invention relates to a method of manufacturing ink supplying channels in an inkjet printing chip, wherein during formation of the ink supplying channels in the process of making the inkjet printing chip, the channels are made by multi-staged slits, so as to reduce the cracking of the chip along the longitudinal direction due to excessive forces. Because the ink supplying channels are in the form of multi-staged slits, the strength of the structure is enhanced to reduce the cracking of the chip along the longitudinal direction due to thermal expansion and shrinking the subsequent manufacturing processes so as to improve the ink supplying efficiency.
Patent TW-I238770-B (TW)
Title: Method for injection-compression molding and a clamp pressure control method for same
Inventor: YUYA HIROSHI
IPC: B29C45/56
Filed: 2001-03-30
Granted: 2005-09-01
Abstract: According to an invented injection-compression molding, the mold locking control is carried out simultaneously for measuring the mold locking force. And the measured value is used to perform a feedback speed control of the mold locking force, and used to measure the position of the mobile mold in order to control the position.
Patent TW-492227-B (TW)
Title: Electrical contact and method of crimping electrical contact to wire
Inventor: SUZUKI MITSURU
IPC: H01R43/04
Filed: 2001-05-07
Granted: 2002-06-21
Abstract: The invention provides an electrical contact and method of crimping electrical contact to wire, capable of increasing the wire crimping force of contact and complying with the down-scale requirement of electrical contact. In accordance with the invention, when pressure-contacting pieces 12a, 12b are crimped onto an electric wire 50, the opposing edges 38a, 38b for each piece mutually abut and, as shown with arrow heads M, M', move to the reverse direction while mutually slide-contacting through being pressed. Because the pressure-contacting pieces 12a, 12b taper from their end parts 40a, 40b to their bases, the pressure-contacting pieces 12 mutually move to the opposite direction along the shaft line of the electric wire 50 with the end parts 40a, 40b drawing a part of a spiral trace while mutually slide-contacting. As a result, the pressure-contacting pieces 12 are integrated and strongly press-fitted and fixed onto the electric wire 50.
Patent TW-514864-B (TW)
Title: Active matrix type self-luminous display device and active matrix type organic EL display device
Inventor: KOMIYA NAOAKI
IPC: G09F9/30
Filed: 2001-07-27
Granted: 2002-12-21
Abstract: The present provides a self-luminous display device, such as an organic EL display device, capable of reducing power consumption and manufacturing costs. The device comprises a selective TFT 4 of which the gate is connected with a gate line 1 and the drain is connected with a data line 2, and a driving TFT 6 of which the gate is connected with the source of the selective TFT 4, a positive power source PV, the driving TFT 6, an organic EL light emitting element 7, and a negative power source CV are connected in series. Since a shift voltage for shifting a gate signal-luminous brightness correlation curve is applied to the negative power source CV, it is not needed to provide a voltage not contributing to gradation display for a data signal. Therefore, the power consumption is reduced, and also the data signal can be produced by an ordinary CMOS process, and the production costs can be reduced.
Patent TW-515150-B (TW)
Title: Gain control in Raman amplifiers
Inventor: EVANS ALAN FRANK
IPC: H04B10/17
Filed: 2001-08-18
Granted: 2002-12-21
Abstract: A Raman fiber amplifier includes: a transmission fiber; at least one optical pump providing optical pump power to the transmission fiber; and at least one pump power detector; at least one signal detector detecting signal power propagating through the transmission fiber. The Raman fiber amplifier also includes a controller that adjusts the pump power provided by the pump to adjust, gain, or signal power provided by this Raman fiber amplifier.
Patent TW-501236-B (TW)
Title: Method of fabricating a MOS transistor using a self-aligned silicide technique
Inventor: KWON HYUNG-SHIN
IPC: H01L21/28
Filed: 2001-08-27
Granted: 2002-09-01
Abstract: A method of fabricating a MOS transistor using a self-aligned silicide technique is provided. The method includes forming a gate electrode and a silicidation resistant layer pattern that are sequentially stacked on a predetermined region of a semiconductor substrate. Spacer is formed on a sidewall of a gate pattern consisting of the gate electrode and the silicidation resistant layer pattern. Impurities are implanted into the semiconductor substrate using the gate pattern and the spacer as ion-implantation masks to form a high concentration source/drain region. A first metal silicide layer is selectively formed on the surface of the high concentration source/drain region. The silicidation resistant layer pattern is then removed to expose the gate electrode. A second metal silicide layer is selectively formed on the exposed gate electrode. Consequently, the first metal silicide layer can be formed of a metal silicide layer having superior tolerence with respect to a junction spiking. Also, the second metal silicide layer can be formed of another metal silicide layer having low resistance dependence on a change of line width. Therefore, it is possible to fabricate a high performance MOS transistor suitable for a highly integrated semiconductor device.
Patent TW-I232282-B (TW)
Title: A method of firebox temperature control for achieving carbon monoxide emission compliance in industrial furnaces with minimal energy consumption
Inventor: COCHRAN MAYRA RODRIGUEZ
IPC: G01N30/88
Filed: 2001-09-04
Granted: 2005-05-11
Abstract: The present invention provides a novel method of controlling the incineration temperature of industrial waste incineration processes such that the incineration emissions products comply with governmental regulations and operating and capital costs are minimal. Modifying the incineration temperature in response to changes in the emission products and the waste streams results in optimal and reliable control of the incineration process and the resultant incineration emissions. Capital and operating costs are reduced significantly as a result.
Patent TW-502079-B (TW)
Title: Ditch cleaning system
Inventor: JANG CHI-AN
IPC: E03F9/00
Filed: 2001-09-26
Granted: 2002-09-11
Abstract: This invention of a ditch cleaning system at least includes: (1) water sucking device composed of a sucking pump, a sucking pipe, and a conveying pipe; (2) flush device composed of a flush pump, a flush pipe, and a conveying pipe; (3) storage device composed of a screen net and an outlet exit; (4) separating device with at least a pair of partition boards to isolate a clean section. This could be easily operated, high efficient, easily maintained, and low-cost cleaning system applies waste water in the ditch to do recycling flushing and suck the sewage out to ensure smooth flow of the dirt.
Patent TW-I220477-B (TW)
Title: System on a chip having system bus, external bus, and bus arbiter with programmable priorities for both buses, software, and method for assigning programmable priorities
Inventor: KIM YOUNG-SIK
IPC: G06F13/362
Filed: 2001-10-02
Granted: 2004-08-21
Abstract: A system on a chip has functional blocks accommodated by at least one system bus, and an external bus for accommodating communication with external blocks. A single multi-jurisdictional bus arbiter has programmable rankings for assigning priorities to requests from blocks that are masters for either one of the both buses. Software and methods are also provided for assigning the priorities. The requests are analyzed with respect to which of the buses they require, and then priorities are assigned to maximize bus utilization, with increased speed for a system on a chip. In addition, a multi-jurisdictional multi-channel direct memory access block can be a master block for the system bus or the external bus.
Patent TW-517359-B (TW)
Title: Enhanced die-up ball grid array packages and method for making the same
Inventor: ZHAO SAM ZIQUN
IPC: H01L23/373
Filed: 2001-12-03
Granted: 2003-01-11
Abstract: An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
Patent TW-I233507-B (TW)
Title: Melting-connection device and melting-connection method
Inventor: HATTORI KAZUNARI
IPC: G02B6/38
Filed: 2001-12-05
Granted: 2005-06-01
Abstract: The purpose of the present invention is to provide a method and device which can discriminate all kinds of the optical fibers and carry out the melting-connection using the connection conditions suitable to the various optical fibers. The present invention is the melting-connection device which melt-connects through the discharge by pressing near the end portion of the optical fiber, and it is provided with: the image observation mechanism (1) which observes the end portion of the optical fiber; the image treatment department (2), which measures the parameter data of the illumination distribution waveform of the optical fiber cross section based on the image taken; the fuzzy-calculation-department (4) which identifies the optical fiber categories through the correlations obtained by fuzzy-calculating the fuzzy-calculation data by registering the measured parameter data in the registration department (3) in advance; the cross-reference department (6) which cross-references the identified optical fiber category to the optical fiber category melting-conditions registered in the melting-connection-condition-registration-department (5) prepared in advance; the display device (7) which displays the results of the cross-references; the melting-connection mechanism (9); and the control department (8).
Patent TW-583174-B (TW)
Title: Process for producing carbonic acid diaryl ester
Inventor: ALEWELT WOLFGANG
IPC: C07C68/02
Filed: 2001-12-17
Granted: 2004-04-11
Abstract: An improvement to the interfacial boundary process for producing carbonic acid diaryl esters is disclosed. In the two-stage process that entails phosgene and monophenols reaction in an inert solvent, in the presence of alkali and in the presence of a nitrogen base catalyst, the improvement comprising maintaining a temperature below 50 DEG C in the first and second stages.
Patent TW-516249-B (TW)
Title: Metal bonded light emitting diode with non-single crystal intermediate layer
Inventor: SHIE MING-SHIUN
IPC: H01L33/00
Filed: 2001-12-27
Granted: 2003-01-01
Abstract: A metal bonded light emitting diode with non-single crystal intermediate layer and method of manufacturing such diode are disclosed. A semiconductor laminate is formed on a first substrate. A non-single crystal intermediate layer and a metal bonding layer constitute a first laminate structure. A second substrate is chosen and is bonded with the first laminate structure to form a second laminate structure. The first substrate is then removed.
Patent TW-526528-B (TW)
Title: Liquid crystal display device and liquid crystal orientation method
Inventor: TAKEDA ARIHIRO
IPC: G02F1/1333
Filed: 2002-01-15
Granted: 2003-04-01
Abstract: A slit pattern, which is an orientation control element extending in an oblique direction relative to an edge of a pixel electrode on a surface of a TFT substrate, is formed in the pixel electrode to extend in a substantially parallel direction to an extending direction of a bank-shaped pattern. Furthermore, as an orientation control element, fine slit patterns (concave portions in the pixel electrode) are formed locally in a part near the edge of the pixel electrode except in the pixel electrode to extend in an oblique direction relative to an extending direction of the edge.
Patent TW-I285497-B (TW)
Title: Light source color modulation device and method
Inventor: CHEN BI-JENG
IPC: G03F3/08
Filed: 2002-03-18
Granted: 2007-08-11
Abstract: The invention provides a light source color modulation device and method. A reflector with the desired color is added to the light source of the scanning module, a coated film with desired color is formed on the lens or the lens is dyed into the desired color. Therefore, inconsistent output strength of the RGB three primary colors of the final CCD due to different brightness of the light source, different lens wavelength transmittances and variations of photosensitivity of CCD can be improved.
Patent TW-I225937-B (TW)
Title: Manufacturing method for oriented film, polarizing film, polarizing plate, and visual display
Inventor: KONDO SEIJI
IPC: G02B1/14
Filed: 2002-03-25
Granted: 2005-01-01
Abstract: An oriented film of polyvinyl alcohol derived film that demonstrates a small dimensional change under a heated or humidified condition is obtained by a manufacturing method for an oriented film comprising the steps of; stretching in two to six times a non-stretched film with moisture percentage adjusted to no more than 10% comprising polyvinyl alcohols or derivatives by heating at no less than 70 DEG C; and subsequently annealing by heating again at no less than 70 DEG C after once cooling at no more than 40 DEG C.
Patent TW-568942-B (TW)
Title: Composition for thermosetting powder coating
Inventor: MOENS LUC
IPC: C09D133/06
Filed: 2002-05-21
Granted: 2004-01-01
Abstract: The present invention relates to a composition for thermosetting powder coating having excellent low temperature curability and good storage stability, being capable of giving a coating with good appearance, flexibility and solvent resistance. The powder coating composition comprises a blend of two different glycidyl group containing acrylic copolymers and a polycarboxylic acid curing agent.
Patent TW-541586-B (TW)
Title: Substrate table, production method therefor and plasma treating device
Inventor: MUTO SHINJI
IPC: C23C4/02
Filed: 2002-05-23
Granted: 2003-07-11
Abstract: The susceptor (10) of a plasma treating device, or the electrostatic chuck (12) of a substrate table is formed by ceramic spraying. A ceramic spay layer (12A) is pore-sealed by methacrylic resin (12D). Resin raw material comprising methyl methacrylate is applied to and impregnated into the ceramic spray layer and then is cured to thereby fill pores among ceramic particles in the ceramic spray layer with methcrylic resin. Methacrylic resin raw material solution, which does not produce pores at curing, can complete perfect pore-sealing.
Patent TW-544898-B (TW)
Title: Electrostatic discharge protection network used in flip chip package
Inventor: WU JAU-NENG
IPC: H01L23/60
Filed: 2002-06-07
Granted: 2003-08-01
Abstract: A kind of flip chip package structure includes a semiconductor chip, in which plural pads, electrostatic discharge (ESD) devices, and layout pattern of contact pad are provided on the upper surface of the semiconductor chip. One terminal of plural pads is directly connected to each function device, and the other terminal is connected to plural contact pads through the corresponding ESD device. The flip chip package structure also includes a flip chip substrate provide with plural conducting pads, which can be respectively connected to the pad when covering on the semiconductor chip, on its lower surface. In addition, the ESD network layout pattern is fabricated on the lower surface of the flip chip substrate; and plural contacts in the ESD network will respectively correspond to the contact pad on the semiconductor chip. When the flip chip substrate is used to cover on the semiconductor chip, plural contacts are electrically connected with the contact pads so as to generate electric coupling with the corresponding pad on the semiconductor chip. Therefore, high electrostatic voltage on the pad can be transmitted to the ESD network through the ESD device and the contact pad.