baber/WOPTO huggingface dataset:
Patent TW-445674-B (TW)
Title: Integrated socket with chip carrier
Inventor: BHARDWAJ VINOD K
IPC: H01R24/00
Filed: 1999-10-05
Granted: 2001-07-11
Abstract: An integrated module (100) incorporates not only a cable socket (102), but also a chip carrier (104) for an integrated circuit (122, 124) and a daughter card (106) for discrete components (204-216). The module can be mounted on any printed circuit board, within a switch, router, hub or other network device. A network socket, one or more integrated circuits and all discrete components (resistors, capacitors, coil, etc.) are contained within the module. The functionality of a transceiver and a media access controller are split into a digital portion and an analog portion. Each of the digital and analog functionality is implemented on a separate integrated circuit and both integrated circuits (122, 124) are placed next to one another in the chip carrier (104) within the integrated module (100). Shielding (152) around the socket is extended to surround the entire integrated module. The metal shielding extends underneath the integrated module and contacts the copper base of the chip carrier (104) to serve as a heat sink. Any number of integrated modules are ganged together (100a, b, c, d) and a single electromagnetic shield (150) placed around all of the integrated modules. A light pipe (114, 116) is used in conjunction with the socket instead of traditional light-emitting diodes. A chip carrier by itself has pins bent both downward to interface to a particular device such as computer board, network switch, hub, router, etc., and pins bent upward to attach to an above daughter card (figures 17-21). A chip carrier (104) also contains one or more integrated circuits (122, 124) and a daughter card (106) mounted on top of the chip carrier.
Patent TW-447223-B (TW)
Title: Apparatus and method for synthesizing pseudo-stereophonic outputs from a monophonic input
Inventor: KRAEMER ALAN D
IPC: H04S5/00
Filed: 1999-11-08
Granted: 2001-07-21
Abstract: A sound enhancement system (synthesizer) disclosed. The enhancement system synthesizes pseudo-stereophonic left (L) and right (R) output channels output from a monophonic input channel (220). The monophonic input signal (220) is applied to a perspective filter (504) that produces a differential-mode signal and to an equalizer filter (506) that produces a common-mode signal. The perspective filter (504) attenuates signal components in a frequency range corresponding to the human voice. The equalizer filter (506) attenuates signal components in a frequency range outside the frequency range of the human voice. The equalizer filter (506) also provides a 90 degree phase shift. The differential-mode and the common-mode signals are combined to produce the output channels (L, R). The pseudo-stereo output (L, R) provided by the synthesizer has relatively less ambience in the frequency range corresponding to the human voice and relatively more ambience in frequency ranges that do not correspond to the human voice.
Patent TW-511322-B (TW)
Title: Electrical card connector with mixed latching means
Inventor: HUANG WAYNE
IPC: H01R13/627
Filed: 1999-10-29
Granted: 2002-11-21
Abstract: An electrical card connector for electrically coupling with an external plug, includes an insulative housing that receives a plurality of contacts and a pair of mixed latching means therein. Each mixed latching means consists of a spring bar with a protrusion extending integrally with the housing, and a metallic spring buffer disposed inside the housing. Each spring buffer includes a spring arm portion preloaded by the spring bar at a first supporting section thereof, a second supporting section formed at a free end of the spring arm portion and spaced apart from a second supporting section formed at a free end of the spring arm portion and spaced apart from a stopper wall formed on the housing thereby constructing the spring arm portion as a cantilevered beam. After the spring bar is progressively deformed to reach a specific deformation due to the coupling between the plug and connector, the second supporting section of the spring arm portion can abut against the stopper wall to transform the spring arm portion as a simple support beam. Therefore, a maximum resilient force is exercised by the spring arm portion on the spring arm to have the protrusion suddenly snap with a notch formed on the plug so as to create a resounding audio effect to inspect the locking status between the mated connector and plug.
Patent TW-463368-B (TW)
Title: Semiconductor memory device and method of producing same
Inventor: OHNO KEIICHI
IPC: H01L21/768
Filed: 1999-11-23
Granted: 2001-11-11
Abstract: A semiconductor memory device having a high quality storage node electrode preventing for example connection failure between a contact plug and the storage node electrode, including first insulating films formed on a substrate, storage node contact holes formed in the first insulating films, storage node contact plugs buried in the storage node contact holes, a storage node electrode formed connected to the storage node contact plug, and a second insulating film formed above the first insulating film at a gap of the storage node electrode, the storage node electrode and the storage node contact plug being connected at least at part of the top surface and the side surface of the storage node contact plug or the storage node electrode and the second inter-layer insulating film being in contact at least at part of the top surface and the side surface of the second insulating film, and a method for producing the same.
Patent TW-459144-B (TW)
Title: Illuminator and projection display
Inventor: YAJIMA AKITAKA
IPC: G02B27/14
Filed: 1999-12-18
Granted: 2001-10-11
Abstract: An illuminator and projection display is disclosed, which reduces the chrominance nonuniformities of a projected image and improves the contrast. A projector has an illumination device that illuminates a modulation device modulating light according to the image information. The illumination device includes: a light source that emits a light beam along the optical axis of a light source; a first lens array having a plurality of small lenses which divide the light beam emitted from the light source into a plurality of partial light beams; a superimposing lens that superimposes the plurality of partial light beams emitted from the first lens array on the optical modulation device such that the light intensity distribution is substantially uniform on the optical modulation device; and an entrance angle reducing device disposed between the superimposing lens and the optical modulation device. The entrance angle reducing device reduces an entrance angle of light rays, which are emitted from the superimposing lens and enter the optical modulation device, compared with an illumination device without the entrance angle reducing device.
Patent TW-460927-B (TW)
Title: Semiconductor device, mounting method for semiconductor device and manufacturing method for semiconductor device
Inventor: KOSHIO YASUHIRO
IPC: H01L23/48
Filed: 2000-01-13
Granted: 2001-10-21
Abstract: The present invention is a semiconductor device, a mounting method for semiconductor device and a manufacturing method for semiconductor device which comprises a flexible substrate with a plurality of metal wires formed on the main surface; and the flexible semiconductor chips configured on the flexible substrate having a plurality of bonding pads for connection; and, the connection metal for electrically connecting the plurality of bonding pads for connection with the plurality of metal wires respectively; and, the flexible package which is formed by packaging sealing component between the flexible substrate and the flexible semiconductor chip; and, the flexible semiconductor chip can have less thickness than the conventional semiconductor chip and low-rigidity; furthermore, by making less thickness of each components of the package, such as the flexible substrate, the total rigidity of the package is lowered; also, by packaging the sealing component between the flexible substrate and the flexible semiconductor chip, the smoothness of the product for flexible package can be substantially ensured; and, during the preparation to form a plurality of mounting wires on the main surface of the mounting substrate and electrically connecting the plurality of mounting wires and a plurality of metal wires, it can constitute a highly reliable packaging body; furthermore, when stacking a plurality of flexible packages, it can constitute a multi-layer chip module with reduced thickness in total.
Patent TW-444381-B (TW)
Title: Semiconductor device
Inventor: ITOH NIICHI
IPC: H01L27/108
Filed: 2000-01-21
Granted: 2001-07-01
Abstract: Provided is a semiconductor memory having a layout structure in which a memory cell has excellent patterning controllability. A pattern of element components (active regions 10 to 15 and 21 to 23 and polysilicon regions 31 to 42) of a memory cell for one memory cell unit of a memory cell array region 1 is identical to that of a dummy cell of a peripheral dummy cell region 3, and both patterns present a line symmetrical relationship with respect to a boundary line BC1. In addition, a pattern of the memory cell for one memory cell unit of the memory cell array region 1 is identical to that of a dummy cell of a power wiring region 2, and both patterns present a line symmetrical relationship with respect to a boundary line BC2.
Patent TW-487641-B (TW)
Title: Tube core and holders for stencil sheet roll
Inventor: OSHIMA KENJI
IPC: B65H75/02
Filed: 2000-02-10
Granted: 2002-05-21
Abstract: There is provided a tube core for a stencil sheet roll, and holders fitted to the tube core, which is simple in construction and low in cost, and capable of preventing the roll from being erroneously mounted in an irrelevant machine without fail. The tube core for the stencil sheet roll R has two ends in which the holders (H, H'') are installed. The holders have a guide plate (21) and a projection (22, 23) projecting therefrom. The tube core has openings (14, 16) at the ends into which the projections (22, 23) are inserted. The openings are different in inner dimension from each other such that the projections different in dimension from each other are fitted therein respectively. The tube core is formed of the first tube (11). The end opening (14) of the tube core is formed by one of the openings of the first tube (11), while the other opening (16) of the tube core is equal to an opening (16) of the second tube (15) which is nested in the first tube at a location neighboring to the other end opening of the tube (11). The tube (15) may be internally spaced a predetermined distance away from the end of the tube (11), to form a step portion (17), and the holder (H'') may have a shoulder portion (24) so as to be housed in the step portion.
Patent TW-518733-B (TW)
Title: Attaching method of heat sink for chip package
Inventor: LIAO KUAN-NENG
IPC: H01L21/56
Filed: 2000-04-08
Granted: 2003-01-21
Abstract: There is provided an attaching method of heat sink for chip package, which comprises first providing a substrate, in which a plurality of semiconductor integrated circuit devices are adhered on the surface of the substrate in a matrix manner; next, placing a heat sink and the substrate in a mold, respectively; then, injecting molding material in the mold to encapsulate the semiconductor integrated circuit devices on the substrate, thereby forming a matrix type package with a heat sink attached; then, taking the matrix type package with the heat sink attached from the mold, and dicing the matrix type package with the heat sink attached, thereby forming a plurality of packaged semiconductor integrated circuit devices. The present invention is to first form a large area of heat sink and matrix type package by pasting or attaching, and then perform a dicing process for shaping. Therefore, it is able to avoid the heat dissipating problem and decrease the manufacturing complexity thereby increasing the productivity.
Patent TW-477761-B (TW)
Title: Scooter-type vehicle
Inventor: NIIMURA HIROYUKI
IPC: B62J25/00
Filed: 2000-06-05
Granted: 2002-03-01
Abstract: To provide a scooter-type vehicle including a body frame composed of a head pipe for steerably supporting a front wheel, a down frame extending rearwardly, downwardly from the head pipe, and floor supporting frames extending rearwardly from the lower end of the down frame, wherein the body frame is covered with a synthetic resin made body cover formed to cover the floor supporting frames for allowing the feet of a driver sitting on a seat to be rested thereon, and a radiator is disposed on the right or left side of a water-cooled type engine supported by the body frame under the seat, which vehicle is capable of guarding the radiator while avoiding an increase in weight of the body frame and a rise in cost of the body frame, preventing the lowering of the resting characteristic of the driver's feet, and enhancing the general-purpose properties. Reinforcing ribs 154 allowed to be brought into contact with a body frame F are projectingly provided on the inner surface of the right or left side, on which a radiator 69 is disposed, of a step floor 140; and the radiator 69 is disposed inwardly from the outer surface of the right or left side of the step floor 140.
Patent TW-499373-B (TW)
Title: Process for the manufacture of a high-transverse-curvature tyre, in particular for motorcycle wheels and tyre for motorcycle wheels
Inventor: VILLANI CLAUDIO
IPC: B60C9/18
Filed: 1995-12-20
Granted: 2002-08-21
Abstract: In a tyre for motor-vehicles, an auxiliary support element (9) is interposed between the carcass ply (3) and belt structure (6), which element is employed during the manufacturing step of the belt structure (6) in order to stably retain, on the sectors of a comb drum (10), the coils (7a) consecutively formed by winding of an inextensible cord (7). The auxiliary support element (9) is made in the form of an elastomeric sheet containing short aramid fibres in an amount included between 1 and 10 phr, to increase the stretchability of said element without impairing the adhesiveness features of same. The instruction of the short aramid fibres in the blend enables the thickness of the auxiliary support element (9) to be reduced until values of 0. 075 mm.
Patent TW-491904-B (TW)
Title: A method of non-ferrous casting using a tool steel and casting components made from the tool steel
Inventor: SERA TOMOAKI
IPC: B22D18/04
Filed: 2000-08-11
Granted: 2002-06-21
Abstract: A method of casting non-ferrous metals such as aluminum, magnesium, or zinc alloys uses casting components made from a tool steel comprising effective amounts of carbon, silicon, manganese, chromium, molybdenum, and vanadium, optional amounts of cobalt and increased level of molybdenum. Using the tool steel as a casting component, particularly as a mold, provides improvements in corrosion resistance, oxidation resistance, softening resistance, degradation resistance and deformation resistance. The tool steel casting component has a chromium oxide layer which is formed, in one mode, during the casting operation, to enhance the life and durability of the casting component and improve its casting performance.
Patent TW-464937-B (TW)
Title: Device for processing substrate
Inventor: NAKAMORI MITSUNORI
IPC: B08B3/02
Filed: 2000-12-01
Granted: 2001-11-21
Abstract: This substrate processing device is identical to a wafer cleaning device 5 for cleaning a wafer W, which includes a supply nozzle 34 for supplying APM and the pure water, a spin chuck 31 for carrying the wafer W and a container 31 for accommodating the spin chuck 31. The container 30 includes an inner processing chamber 42 and an outer processing chamber 43 and is constructed so as to be movable up and down to the spin chuck 31. A first drainage line 50 is connected to the inner processing chamber 42 to discharge APM and the interior atmosphere, while a second drainage line 51 is connected to the outer processing chamber 43 to discharge pure water and the interior atmosphere. With the connection of the first drainage line 50, the wafer cleaning device 5 is adapted so that the supply nozzle 34 supplies APM to a surface of the wafer W again. Therefore, it is possible to reuse this processing liquid advantageously and additionally, an exhaust displacement can be reduced.
Patent TW-I225521-B (TW)
Title: Sputtering target and method of manufacture
Inventor: ISHIZUKA KEIICHI
IPC: C23C14/34
Filed: 2000-12-08
Granted: 2004-12-21
Abstract: To provide an indium zinc oxide (IZO) sputtering target capable of improving target density, uniformizing and refining crystal grain size, increasing deflective strength, stabilizing electric discharge at sputtering, and stably forming a transparent conductive film with superior reproducibility, with a view to carrying out improvement without losing the characteristics of an IZO transparent conductive film composed essentially of an indium zinc oxide, and its manufacturing method. The sputtering target composed of an indium zinc oxide has a two-phase structure consisting of an In-enriched phase where Zn is allowed or not allowed to enter into solid solution in an indium oxide crystal and a Zn-enriched phase where In is allowed or not allowed to enter into solid solution in a zinc oxide crystal.
Patent TW-I286566-B (TW)
Title: Pressure-sensitive adhesive compositions and adhesive films
Inventor: KISHIOKA HIROAKI
IPC: C09J7/02
Filed: 2001-02-02
Granted: 2007-09-11
Abstract: A pressure-sensitive adhesive composition comprising an acrylic polymer as a base polymer and a crosslinking agent, characterized in that said acrylic polymer has a weight-average molecular weight of 1,500,000 or above and the proportion of materials having a molecular weight of 100,000 or below in said acrylic polymer is 10% or less, and that the storage modulus at 80 DEG C of said composition after forming a cross-linked structure is from 5x10<4> Pa to 5x10<5> Pa inclusive, which composition is capable of forming an adhesive layer having excellent weather resistance.
Patent TW-491922-B (TW)
Title: A light weight building material
Inventor: NG HONG LIANG
IPC: E04C2/08
Filed: 2001-05-04
Granted: 2002-06-21
Abstract: The present invention relates to a light weight building material (1) for structural work. The light weight building material (1) comprises at least three walls, a first wall (11), a second wall (12) and a third wall (13) formed from a single piece of galvanized iron sheet to form a triangular-section. However, a circular section may also be used while a rectangular section is preferred. The galvanized iron sheet is cut and cold-rolled to form the light weight building material (1).
Patent TW-516190-B (TW)
Title: Flash memory cell with contactless bit line, and process of fabrication
Inventor: CHEN CHIOU-FENG
IPC: H01L21/8247
Filed: 2001-05-18
Granted: 2003-01-01
Abstract: Memory cell array and process of fabrication in which a floating gate is formed on a substrate for each of a plurality of memory cells, a control gate is formed above and in vertical alignment with each of the floating gates, source regions are formed in the substrate between and partially overlapped by first edge portions of the floating gates in adjacent ones of the cells, bit lines are formed in the substrate midway between second edge portions of the floating gates in adjacent ones of the cells, and a select gate is formed across the control gates, the floating gates, the bit lines and the source regions.
Patent TW-540060-B (TW)
Title: Power saving on the fly during reading of data from a memory device
Inventor: AL-SHAMMA ALI K
IPC: G11C7/10
Filed: 2001-06-06
Granted: 2003-07-01
Abstract: Power saving on the fly improves both the speed and power consumed in reading data from a core memory. Present data is selected from the core memory and clocked into the power saving arrangement. The present data is compared with previously selected data to determine whether the majority of data presently selected has changed from the previously selected data. In addition, the present selected data is also delayed and then subjected to a logical XOR function with the majority determination above. Finally, the data subjected to the logical XOR function and the majority determination are driven separately to external elements requesting the present data. Power is saved as the state of the majority of the data being driven from one data set to the next remains unchanged. Speed is increased as the data, once clocked into the arrangement, is driven in less than a clock pulse.
Patent TW-591396-B (TW)
Title: Network server for assisting scanning task of computer
Inventor: HUANG HSI-HSUN
IPC: G06F17/00
Filed: 2001-06-07
Granted: 2004-06-11
Abstract: The invention provides a network server, which can assisting user to scan a document at a user end. The user end comprises a computer electrically connected with the network, a web browser installed in the computer and a scanner electrically connected with the computer. The server comprises a database, comprising multiple scanner drivers, a driver selection system for providing user to choose driver capable of driving the scanner from the database and a transmission system used to transmit the driver to the computer for providing the computer to execute the driver. User employs the browser and the driver selection system to choose the driver of the scanner and then the transmission system will forward the driver to the computer, allowing the computer to drive the scanner for document scanning using the driver, and the data generated by scanning the document will be stored in a pre-defined position.
Patent TW-583249-B (TW)
Title: Crosslinkable rubber composition and sealing materials, potting materials, coating materials and adhesives using the same
Inventor: HAKUTA TAKASHI
IPC: C08L83/00
Filed: 2001-06-19
Granted: 2004-04-11
Abstract: The crosslinkable rubber composition is crosslinkable at room temperature, has a gelation time at room temperature of 30 days or less, and can prepare a crosslinked rubber sheet by crosslinking the composition at room temperature, wherein the crosslinked rubber sheet has a tensile elongation of 20% or more, and is free of cracks after treatment at 40 DEG C in a 50 pphm ozone concentration for 96 hr. Specifically, it comprises an ethylene/alpha-olefin/non-conjugated polyene random copolymer rubber comprising a norbornene compound having a specific vinyl end group, an SiH group-containing compound, which has at least two SiH groups in one molecule, and optionally a platinum catalyst, a reaction inhibitor and/or a silane-coupling agent. The sealing, potting and coating materials and adhesives of the present invention comprise the above rubber composition. The rubber composition has a high crosslinking rate at room temperature and excellent productivity, and can prepare crosslinked rubber molded products (including foamed products) having excellent weathering resistance, ozone resistance, heat aging resistance and compression set at low cost. Further, it is suitable for use of electric and electronic parts, transportation machines, civil engineering and construction materials, medical appliances and goods for leisure activities.
Patent TW-I283635-B (TW)
Title: 2-in-1 shoe component
Inventor: O'HARE KIERAN
IPC: D04H1/00
Filed: 2001-07-06
Granted: 2007-07-11
Abstract: A laminate of a thermally pointbonded nonwoven base fabric and a coating of polyurethane or polyvinyl chloride on at least one surface of the base fabric, and a footwear upper made from the laminate and wherein the upper functions additionally as a lining for the footwear.