baber/WOPTO huggingface dataset:
Patent TW-476994-B (TW)
Title: Semiconductor manufacturing system having a vaporizer which efficiently vaporizes a liquid material
Inventor: KOJIMA YASUHIKO
IPC: F16K31/06
Filed: 2000-09-08
Granted: 2002-02-21
Abstract: A vaporizer can efficiently vaporize a liquid material under a depressurized atmosphere. The liquid material is temporarily stored in a liquid storing chamber, and is supplied to a vaporizing chamber set in the depressurized atmosphere via a small aperture. An inlet of the liquid storing chamber is opened or closed by a valve body, which is moved by an actuator controlling a degree of opening of the valve body.
Patent TW-I236372-B (TW)
Title: Formulation of substituted benzimidazoles
Inventor: BRULLS MIKAEL
IPC: A61K47/30
Filed: 2000-10-09
Granted: 2005-07-21
Abstract: The present invention relates to stable liquid formulations that comprise a water free or almost water free, polyethylene glycol solution of sodium or potassium salt of a H<+>, K<+>-ATPase inhibitor of formula I or a sodium or potassium salt of one single enantiomer thereof. Alternatively, the sodium or potassium salt of the H<+>, K<+>-ATPase inhibitor may be formed in situ in the polyethylene glycol solution by adding sodium or potassium hydroxide together and the active compound. The invention is also directed to the preparation of the claimed formulation, use of the stable liquid formulations in medicine and in the treatment of gastrointestinal diseases.
Patent TW-465106-B (TW)
Title: Methods for fabricating a multilevel interconnection for an integrated circuit device utilizing a selective overlayer
Inventor: LYTLE STEVEN ALAN
IPC: H01L21/768
Filed: 2000-11-27
Granted: 2001-11-21
Abstract: The present invention utilizes a selective overlayer to provide more efficient fabrication of a dual damascene multilevel interconnect structure. The selective overlayer serves as a protective mask which prevents the upper layer of the composite layer from being eroded during the formation of the mutli-level interconnects. The present invention also solves some of the problems associated with the full-via first and partial-via first fabrication methods because the selective overlayer enables an efficient, deep partial via to be formed while preventing the deposite of undeveloped photoresist in subsequent fabrication steps. The present invention also provides advantages during the planarization and polishing of the dual damascene structure after the deposition of the conductive layer because the selective overlayer allows for efficient planarization without loss of trench depth control.
Patent TW-I250194-B (TW)
Title: Aqueous glittering ink composition
Inventor: YOSHIMURA YASUYUKI
IPC: C09D11/00
Filed: 2000-12-16
Granted: 2006-03-01
Abstract: The glittering ink of the present invention contains scaly glittering particles, a water-soluble resin, a water-soluble organic solvent, colorant and water. The scaly glittering particles have a median diameter of at least 10 mum, a ratio of smoothness on the particle surface to a median diameter of not greater than 0.011, and a surface coating ratio of the colorant in a written mark of not greater than 80% in a state of a dried written mark. In addition, the aqueous glittering ink of the present invention has the thixotropy index (T.I. value) of not less than 1.3, represented by the ratio of V0.5 to V1.0 (V0.5/V1.0), in which V0.5 is the viscosity with the rotation speed of 0.5 rpm and V1.0 is the viscosity with the rotation speed of 1.0 rpm when the ink is measured by an ELD-typed viscometer (3 DEG R14 cone, at the temperature of 20 DEG C) and the ink has the V0.5, the viscosity with the rotation speed of 0.5 rpm, of 1000 to 15000 mPa.s.
Patent TW-498403-B (TW)
Title: Semiconductor device and method for the fabrication thereof
Inventor: WATASE KAZUMI
IPC: H01L23/498
Filed: 2001-02-02
Granted: 2002-08-11
Abstract: Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.
Patent TW-494526-B (TW)
Title: Semiconductor device and its manufacturing method
Inventor: NAKAMURA KATSUMI
IPC: H01L29/76
Filed: 2001-02-06
Granted: 2002-07-11
Abstract: The semiconductor device of the present invention comprises a semiconductor substrate having a first main face and second main face disposed in opposite directions, an insulated gate structure provided in said first main face side, and a power device which the main current is flow between said first and second main faces. The thickness (t1) of said semiconductor substrate is between 50 μm to 250 μm, an insulated gate MOS transistor structure which can realize a low ON voltage and a high ability of damage resistance is provided on said first main face. Accordingly the present invention can achieve a low voltage and ensure a high ability to prevent damage, as well as to minimize the switch loss of the low voltage side.
Patent TW-581835-B (TW)
Title: Process for producing yarn bundle for use as carpet or textile face yarn, apparatus for making textile effect yarn bundle from one carpet denier singles yarn and one oriented textile denier singles yarn, and textile effect yarn bundle
Inventor: RASNICK LAWRENCE E JR
IPC: D02G3/04
Filed: 2001-02-21
Granted: 2004-04-01
Abstract: A process for combining dyed or melt pigmented textile denier accent yarns in small yarn sizes, into a small building block carpet denier bundle to achieve a face yarn bundle having a wide range of special color effects and appearance, not attainable by manufacture of multi-colored carpets from carpet denier fibers alone. The carpet denier singles yarns are drawn, textured and air-jet entangled. At least one textile denier singles yarns, which is preferably a yarn having some degree of orientation, is then entangled with the carpet denier singles yarn, and the bundle is then wound up. The final yarn bundle may contain one or more fiber types, as well as at least one anti-static filament. The two types of singles yarn, i.e., the carpet denier and textile denier types, optionally have the same or different fiber cross-sections.
Patent TW-488062-B (TW)
Title: Semiconductor integrated circuit and process for manufacturing semiconductor integrated circuit
Inventor: SEKIGUCHI NOBORU
IPC: H01L23/544
Filed: 2001-03-29
Granted: 2002-05-21
Abstract: If a packaged IC chip is judged to be defective during inspection just before its shipment, then, optimum correction information is calculated from the results of the electric characteristics of the IC chip. The calculated correction information is written in a nonvolatile memory for correction in the semiconductor chip to correct the electric characteristics of the semiconductor chip. The characteristics corrected IC chip is then inspected again.
Patent TW-502161-B (TW)
Title: Method of automatically updating time to a local time when reaching a new time zone
Inventor: CHEN KUEN-HUEI
IPC: G06F12/00
Filed: 2001-04-24
Granted: 2002-09-11
Abstract: The present invention relates to a method of automatically updating the time to a local time when reaching a new time zone. In the memory of a mobile phone, there is set a database including the dates and times of various places in the world. The database includes a matching table of the time differences and telephone systems of various places in the world. When the CPU of the mobile phone determines that the connected telephone system is different from the original telephone system, the mobile phone reads the corresponding time difference and zone from the pre-stored time database of the memory based on the connected telephone system. Then, based on the time difference, the originally set time is updated to be the time of the zone, which is displayed via the display of the mobile phone. Accordingly, by using the CPU to recognize the telephone systems of different zones (countries), the time of the mobile phone can be automatically updated to the local time with the time zone crossed when the mobile phone is performing an international roaming.
Patent TW-557302-B (TW)
Title: A mixed polymer, the production and use thereof
Inventor: BERNETH HORST
IPC: C08F120/00
Filed: 2001-05-28
Granted: 2003-10-11
Abstract: The present invention relates to a mixed polymer, to a process for producing it and, to the use thereof. A mixed polymer, characterized in that it consists of at least one polymer (A) having at least 10 repeat units with the general formula (CI), where R100 represents hydrogen or methyl and R701 represents -O-R801, where R801 stands for hydrogen or C1-C8 linear or branched-chain alkyl without photoisomerisable groups, at least one polymer (B) having at least 3 repeat units with the general formula (CII), where R702 represents hydrogen or methyl and R103 for [-S-T-Q-P] and where P represents A and/or M, where however a polymer (B) is always contained in which P represents A, where the side-chains branching off from the main chain, of the formula S-T-Q-P with P=A (dye group), M (mesogen), are governed by the following definitions: S-T-Q-P=S1-T1-Q1-A, S-T-Q-P=S2-T2-Q2-M, where S1, S2 signify independently of one another the atoms O, S or the group NR1, R1 signifies hydrogen or C1-C4 alkyl, T1, T2 signify independently of one another the group (CH2)n, which may optionally be interrupted by -O-, -NR1- or -OSiR12O- and/or substituted by methyl or ethyl, n signifies the numbers 2, 3 or 4, Q1, Q2 a divalent group, A a unit which may absorb electromagnetic radiation and M a polerisable aromatic group having at least 12pi-electrons.
Patent TW-498573-B (TW)
Title: Connector excellent in reliability of contact
Inventor: TAKAGI OSAMU
IPC: H01R13/24
Filed: 2001-06-19
Granted: 2002-08-11
Abstract: In a connector in which a conductive contacting portion (33) is supported by a spring portion (26) to be elastically movable in a first direction (28) and a second direction (29) perpendicular to the first direction, the contacting portion has a contact point (27) maintained in a specific condition such that the contact point is offset from a predetermined position in the second direction. The contact point is formed at its one end to be brought into contact with a mating object (17) in the first direction at the predetermined position. When the contacting portion is moved in a direction opposite to the first direction, the specific condition is released.
Patent TW-583181-B (TW)
Title: Process for the preparation of propylene oxide
Inventor: TELES JOAQUIM HENRIQUE
IPC: C07D301/12
Filed: 2001-07-06
Granted: 2004-04-11
Abstract: A process for the preparation of propylene oxide in which (i) propene is reacted with hydrogen peroxide in the presence of methanol to give propylene oxide, giving a mixture (Gi) comprising propylene oxide, methanol, water and unreacted hydrogen peroxide, (ii) a mixture (Gii) comprising methanol, water and hydrogen peroxide is separated off from the mixture (Gi), giving a mixture (Ga) comprising propylene oxide, and (iii) water is separated off from the mixture (Gii), giving a mixture (Giii) comprising methanol and methyl formate.
Patent TW-507059-B (TW)
Title: Method for servicing and maintaining heat supply equipment
Inventor: KAYAHARA TOSHIHIRO
IPC: G06Q50/00
Filed: 2001-07-10
Granted: 2002-10-21
Abstract: In heat supply equipment provided with a plurality of maintenance object units, secure and prompt servicing and maintenance is implemented and a burden on a person in charge of managing the heat supply equipment is decreased. In a method for servicing and maintaining heat supply equipment based on a servicing and maintenance contract to perform specified servicing and maintenance of a maintenance object unit in heat supply equipment, which includes making a supervisory center for mediating request information from the heat supply equipment communicatable with the heat supply equipment via communication means, while making the supervisory center communicatable with service suppliers who perform the servicing and maintenance via the communication means, the method includes the steps of: receiving request information automatically transmitted from the heat supply equipment in the supervisory center; determining necessary servicing and maintenance works based on the request information received; selecting service suppliers who can perform the servicing and maintenance works; transmitting necessary information from the supervisory center to the service suppliers; and instructing the service suppliers to take measures based on the transmitted information.
Patent TW-514925-B (TW)
Title: Fuse circuit
Inventor: IROAGA ECHERE
IPC: H01L27/04
Filed: 2001-07-12
Granted: 2002-12-21
Abstract: The present invention provides an apparatus and method of fuse trimming for a variable mode circuit. The apparatus comprises a circuit which includes two trim fuses connectable to a power supply, a first circuit portion, and a variable voltage fuse interpreter. The first circuit portion is adapted to control the passing of a diffuse current through the trim fuses and is adapted to control the passing of a margin and unmargin test current through the trim fuses. The variable voltage fuse interpreter determines the status of each fuse (i.e., blown or unblown) corresponding to the margin and unmargin test currents and provides a digital output as a predetermined function of the fuse status for each of the test currents.
Patent TW-498563-B (TW)
Title: Optical multiple-member, especially to use with light-emitting-diode
Inventor: BACHL BERNHARD
IPC: G09F9/33
Filed: 2001-07-17
Granted: 2002-08-11
Abstract: The present invention relates to an optical multiple-member (1), especially to use with light-emitting-diodes (23), and comprising a plurality of optical single-members (2), which transmits or reflects lights, and which is preferably connected through the set-crack (3) to from with each other the optical multi-numbers; and which can be separated from each other under the formation of the optical members (11) comprising one or more optical single-members (2). The optical multiple-member (1) is suitable for mass production, and due to its modular design it enables a flexible adjustment on the shape and the size of the designed illumination device, for example commercial lights or safety lighting.
Patent TW-513577-B (TW)
Title: Method for inspecting voice amplification circuit
Inventor: CHEN YI-LANG
IPC: G01R21/00
Filed: 2001-08-06
Granted: 2002-12-11
Abstract: A kind of method for inspecting voice amplification circuit, which is formed by connecting an encoder/decoder with a signal amplifier, is disclosed in the invention. The invention includes the signal input terminal, the signal output terminal, the external signal input terminal and the external signal output terminal. The encoder/decoder is provided with a signal adjustment amount. The executing steps of the inspecting method are described in the following: connecting the signal output terminal of the voice amplification circuit with the external signal input terminal; adjusting the signal adjustment amount of the encoder/decoder to the maximum value; inputting a testing signal from the signal input terminal; extracting an external output signal from the external signal output terminal; and finally checking whether the external output signal is within a tolerable range or not.
Patent TW-495844-B (TW)
Title: Method for preventing overlay shift from occurring to device deposited with epitaxial silicon
Inventor: LI KUEN-YI
IPC: H01L21/027
Filed: 2001-08-24
Granted: 2002-07-21
Abstract: A method to precisely aligning plural photo-lithographic patterns on a wafer during photolithography process is disclosed. A first alignment mark is defined on the surface of a wafer. The wafer is then subject to a first photolithography process with reference to the first alignment mark to define a first photo-lithographic pattern. Next, epitaxial silicon layer is deposited on the surface of the wafer. The first alignment mark is replicated upward and transferred to the surface of the epitaxial silicon layer as a second alignment mark. Subsequent photolithography processes are continued with reference to the second alignment mark. Specifically before conducting each photolithography process, the material layer on top of the second alignment mark is removed to expose directly the second alignment mark.
Patent TW-522370-B (TW)
Title: Multi-format active matrix displays
Inventor: CAIRNS GRAHAM ANDREW
IPC: G09G3/36
Filed: 2001-09-05
Granted: 2003-03-01
Abstract: Multi-format sampling registers, digital to analogue converters, data drivers and active matrix displays are provided which provide power saving in lower resolution formats by disabling circuitry which is not required in those formats.
Patent TW-498529-B (TW)
Title: Flip chip packaging and the processing thereof
Inventor: LIN MAU-SHIUNG
IPC: H01L23/52
Filed: 2001-09-19
Granted: 2002-08-11
Abstract: A flip chip packaging, which comprises: a chip, with an active surface, in which top layer of the active surface has a plurality of pads; a substrate, with a substrate surface, in which the substrate surface has a welding mask layer and a plurality of contacts, and the welding mask layer has at least an opening, and the contacts are located in the area of the opening of the welding mask layer; and, the substrate has a chip placement area, in which the chip is placed in the chip placement area, and the opening is located in the chip placement area; a plurality of bumps, which are fixed between the pads of the chip and the contacts of the substrate, in which each bump has a metal post and a bump, each metal post is electrically bonded with each bump, the metal post is located near one end of the chip, and the bump is located near one end of the substrate; and, a filler, which is located between the chip and the substrate, and used to encapsulate the bump.
Patent TW-554104-B (TW)
Title: Knitting support system for knitted product and knitting support server system
Inventor: HAYASHI GAKUYUKI
IPC: D04B35/00
Filed: 2001-09-19
Granted: 2003-09-21
Abstract: A knitting support system of the invention includes knitting machine adjusting data storing means (28) for storing the knitting machine adjusting data for many fabrics; search information storing means (22) in which various kinds of parameters of the fabrics are stored as search information for searching fabrics similar to that of a knitted product to be knitted from among the stored knitting machine adjusting data; searching means (24) for inputting parameters of the knitted product to be knitted as searching conditions and searching similar fabrics from among the search information stored in the search information storing means (22) in accordance with the inputted searching conditions; and output means (30) for reading and outputting the knitting machine adjusting data for the fabrics corresponding to the searched result of the searching means (24) from the knitting machine adjusting data storing means (28).
Patent TW-571329-B (TW)
Title: Method and installation for manufacturing a piece comprising at least one tubular section
Inventor: REYAL JEAN-PIERRE
IPC: B21D5/04
Filed: 2001-09-25
Granted: 2004-01-11
Abstract: This method consists in pre-bending a metal plate along at least two longitudinal edges (12-13), then in bending this plate along at least one edge (12-13) by means of a bending member (103-104) by exerting, during bending (F1, F3,), a retaining/securing effort (F7, F8,) of a part (23-24) of the plate with respect to the bending member (103-104). This retaining/securing effort (F7, F8) may be substantially directed towards the edge (12, 13). The installation comprises at least one member (103-104) for bending the metal plate along a longitudinal edge (12-13) of a tubular section of the frame. The bending member (103-104) is equipped with means 103f-104f for exerting on a part (23, 24) of the plate a retaining/securing effort (F7, F8) for blocking slide of a part (23, 24) of the plate along the bending member (103, 104). The bending member is articulated about a virtual geometrical axis (a, c) located inside the corresponding tubular section of the piece to be manufactured.
Patent TW-501237-B (TW)
Title: Memory stacked package method and its structure
Inventor: HUANG WEN-KUEI
IPC: H01L21/8242
Filed: 2001-10-16
Granted: 2002-09-01
Abstract: A memory stacked package method and its structure are introduced. A substrate having two surfaces mounted with metal balls is connected with a memory chip and a logic control chip to construct a stacked memory structure. The memory chip and the logic control chip are produced by the corresponding processes, respectively, so that they possess the features of low leakage current and high-speed operation respectively. By employing a substrate for connecting with both, it can simplify the memory process and produce high density and high performance memory as well as reduce the cost.
Patent TW-545017-B (TW)
Title: Method and apparatus for determining a data rate in a high rate packet data wireless communications system
Inventor: LUNDBY STEIN A
IPC: H04L12/56
Filed: 2001-10-25
Granted: 2003-08-01
Abstract: In a wireless communication system (50) a method for combination transmission of packet data and low delay data. In one embodiment a parallel signaling channel provides a message to receivers (56, 58, 60) indicating a target recipient of packet data. The message also identifies the transmission channel used for packet data transmissions. Each receiver may then selectively decode only packets where the message identifies the receiver as a target recipient. The data packets stored in a buffer are ignored if the target recipient is another mobile unit. In one embodiment, the message is sent concurrently with the data packet on a parallel channel. In one embodiment, the message is punctured into the high rate packet data transmission.
Patent TW-522251-B (TW)
Title: Test plate dividing device for semiconductor testing device
Inventor: CHEN WEN-CHI
IPC: G01R31/303
Filed: 2001-11-02
Granted: 2003-03-01
Abstract: A test plate dividing device for a semiconductor testing device comprises: a test plate divided with more than one regions, and more than one device-under-tests (DUTs). The DUTs are mounted on the corresponding region of the test plate and have locations thereof, such that the noises can be reduced when carrying out a test, thereby increasing the accuracy of the semiconductor test device during a test
Patent TW-548582-B (TW)
Title: Multi-function peripheral storage device buffer system
Inventor: BASSETT STEPHEN J
IPC: G06F12/00
Filed: 2001-11-13
Granted: 2003-08-21
Abstract: The present invention provides a multi-function buffer system for use in a peripheral storage device system, as well as a peripheral storage device system having a multi-function buffer system. The buffer system comprises a multi-purpose memory component which may be adapted for use as scratchpad and/or instruction storage accessible by a controller processor, as well as for buffering information being transferred between the peripheral storage device and a host computer system.