baber/WOPTO huggingface dataset:
Patent TW-I253313-B (TW)
Title: Embedded multi-layer capacitors of a printed circuit board and manufacturing method therefor
Inventor: LEE YI-JEN
IPC: H05K1/16
Filed: 2004-07-28
Granted: 2006-04-11
Abstract: A manufacturing method for embedded multi-layer capacitors of a printed circuit board comprises the following steps: forming a first conductive layer on a substrate, and patterning the first conductive layer to form a first capacitor electrode; coating a first capacitor material and a second conductive layer on the first capacitor electrode; patterning the second conductive layer to form a second capacitor electrode, and using the first capacitor material to form a first capacitor material layer; forming at least one second capacitor material layer and at least one third capacitor electrode by using the same build-up manner; embedding all of capacitor electrodes and all of capacitor material layers with at least one dielectric layer and at least one circuit layer to construct a printed circuit board; forming a first conductive via to electrically connect some of the capacitor electrodes, and forming a second conductive via to electrically connect the other capacitor electrodes. Thus, all of capacitor electrodes are parallel-connected and piled up each other to form the embedded multi-layer capacitor.
Patent TW-I284681-B (TW)
Title: Non-electrolytic copper plating solution
Inventor: YABE ATSUSHI
IPC: H01L21/288
Filed: 2004-09-22
Granted: 2007-08-01
Abstract: This invention provides a non-electrolytic copper plating solution, which can form an even plating film at lower temperature on mirror planes of semiconductor wafer which is not easy to induce plating reaction during the application of non-electrolytic copper plating. The non-electrolytic plating solution of this invention use first reducing agent as reducing agent with second reducing agent by using hypophosphorous acid or hypophosphorous acid salts, and furthers a stabilizer to inhibit the copper separation. First reducing comprises such as formalin, glyoxylic acid and the like; hypophosphorous acid salts comprises sodium hypophosphorous acid, potassium hypophosphorous acid ammonium hypophosphorous acid and the like. Stabilizer for inhibiting copper separation comprises such as 2,2'-bipyridine, imidazole, nicotinic acid, thiourea, 2-mercaptobenzothiazole, sodium cyanate, thioglycolic acid and the like.
Patent TW-I260536-B (TW)
Title: Storage medium storing program management information, and reproducing method and apparatus
Inventor: KIM KWANG-MIN
IPC: H04N5/781
Filed: 2004-10-28
Granted: 2006-08-21
Abstract: A storage medium storing program applications to provide additional functions using moving-images and management information needed to manage the program applications. The storage medium includes reproduction mode data reproducing moving-image data, program data including a plurality of program applications providing additional functions using the moving-image data, system data controlling the execution of the reproduction mode data and the program data, and management information managing the execution of the program applications in unit of title. The program applications providing additional functions can be managed in unit of title and loaded to a system memory in advance to be executed.
Patent TW-I280632-B (TW)
Title: Method of forming insulation film, system of forming insulation film and method of manufacturing semiconductor device
Inventor: MIYOSHI HIDENORI
IPC: H01L21/76
Filed: 2004-11-29
Granted: 2007-05-01
Abstract: emiconductor wafer (W) by a heater, supplying 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) thereto and conducting a heat treatment without applying a high-frequency voltage. Then, in the same CVD apparatus (111), an insulating film with high density and high hardness is formed on the porous low dielectric constant film by heating the semiconductor wafer (W), introducing TMCTS and applying a high-frequency voltage thereto, thereby generating a plasma of a gas containing TMCTS.
Patent TW-I254393-B (TW)
Title: Nickel-gold electroplating process for golden finger of chip package substrate and contact pad
Inventor: FANG JAU-SHIAN
IPC: H01L21/60
Filed: 2004-12-15
Granted: 2006-05-01
Abstract: This invention provides a manufacturing process of a primary level package. It is suitable for a substrate with different metal finish applications on both sides thereof (e.g. package of memory module card). The main characteristic is that: firstly, it forms circuit on the top surface of a substrate by using acid etching. Secondly, it utilizes a second image transfer to the bottom surface of the substrate to define a golden finger portion that requiring electroplated. Further, it coats a nickel-gold layer on the golden finger with an electroplating method. Furthermore, it coats a nickel-gold layer on the contact pad with the electroplating method. The manufacturing method is that: it coats a nickel-gold layer on he contact pad and golden finger by an electrodeless lead plating and an electroplating method. Therefore, it increases the effective wiring area of a substrate surface. Eventually, it simultaneously avoids the noise interference resulting from distributed electroplated lead wires.
Patent TW-I244758-B (TW)
Title: Substrate optical waveguides having fiber-like shape and methods of making the same
Inventor: YOKOUCHI KISHIO
IPC: G02B6/30
Filed: 2004-12-16
Granted: 2005-12-01
Abstract: Substrate optical waveguides having curved major surfaces and methods for making the same are disclosed. In one exemplary embodiment, a photosensitive cladding layer is pattern exposed to actinic radiation through a first gray-scale mask and subsequently developed to define a groove therein having a curved major bottom surface. A layer of photosensitive core material is thereafter formed over the groove, pattern exposed to actinic radiation through a second gray-scale mask, and subsequently developed to define a core element. The core element is disposed within the groove and has a curved major bottom surface and a curved major top surface.
Patent TW-I255639-B (TW)
Title: VoIP phone system capable of showing the images from phone caller's end
Inventor: TIN HSIAO-WEN
IPC: H04M3/56
Filed: 2004-12-24
Granted: 2006-05-21
Abstract: A VoIP phone system for showing pictures or videos that represent a phone caller is disclosed. Unlike VoIP phone audio services, the pictures or videos are transmitted through a different communication system comparing to IP network and stored into a content server. When receiving an incoming call, the local VoIP phone communicates to the content server for downloading the relative image files of the phone caller and displays them on the LCD panel. Because the image files are not stored in VoIP phone, the requirements for storage devices of VoIP phone are decreased, thereby reducing the cost.
Patent TW-I280894-B (TW)
Title: Synthesis of noble metal sulphide catalysts in a sulphide ion-free aqueous environment
Inventor: ALLEN ROBERT J
IPC: C25B11/03
Filed: 2005-01-28
Granted: 2007-05-11
Abstract: The invention is relative to a catalyst, in particular to a noble metal sulphide electrocatalyst, obtained by reacting the precursor of at least one noble metal with a thionic species in an aqueous environment essentially free of sulphide ions, and to a method for producing the same.
Patent TW-I262742-B (TW)
Title: Method for manufacturing organic electroluminescence device and electronic apparatus
Inventor: SAKAI HIROFUMI
IPC: H01L51/00
Filed: 2005-04-18
Granted: 2006-09-21
Abstract: A method for manufacturing an organic electroluminescence device, including: forming partitions sandwiching a film-forming area above a substrate; forming a boundary section in the proximity of said partitions; and ejecting droplets containing an electrode forming material into said film-forming area defined by said partitions and said boundary section.
Patent TW-I279924-B (TW)
Title: Dual band reflective thermal imaging system
Inventor: LEE TZONG-SHENG
IPC: H01L31/00
Filed: 2005-05-17
Granted: 2007-04-21
Abstract: A dual band reflective thermal imaging system is described. The dual band reflective thermal imaging system includes a reflective infrared thermal imager and a refractive visible light video camera. The refractive visible light video camera is configured in the central axis of the reflective infrared thermal imager so that the refractive visible light video camera and the reflective infrared thermal imager can synchronously record the image in the same axis. The reflective infrared thermal imager further includes a reflective lens module and an infrared imaging sensor. The infrared images are focused on the infrared imaging sensor by way of the reflective lens module.
Patent TW-I288816-B (TW)
Title: A sealing method for heat pipe
Inventor: JENG JIAN-DIH
IPC: B23P15/26
Filed: 2005-06-09
Granted: 2007-10-21
Abstract: This invention regards a coarctation method to seal the heat pipe. There are number 1 and number 2 molds with multiple convex and concave surfaces on them. The opening end of the heat pipe is placed between the top and bottom molds for coarctation operation such that the metal material of the heat pipe is deformed to match with those multiple convex and concave surfaces on molds and sealed with the strength reinforced and stress even distributed. The mold design holds the structure strength of the sealed part by keeping the material ductility and getting rid of the stress concentration after the coarctation process.
Patent TW-I260039-B (TW)
Title: Wafer and single chip with circuit rearranged structure and method for fabricating the same
Inventor: HU CHU-CHIN
IPC: H01L21/02
Filed: 2005-06-17
Granted: 2006-08-11
Abstract: A wafer and single chip with circuit rearranged structure and method for fabricating the same the same are proposed. A wafer with a plurality of chips thereon is provided, and the single chip has an active surface with a plurality of electrode pads formed thereon. A dielectric layer is formed on the active surface of the wafer. The dielectric layer is thinned to expose the electrode pads of the wafer. A conducting layer is formed on the surface of the dielectric layer and the electrode pads. A first metal layer is formed on the conductive layer by electroplating. A patterned second metal layer is formed on the surface of first metal layer by printing. Using the second metal layer as a protecting layer, the first metal layer and the conducting layer are etched and the portions uncovered by the second metal layer are removed. The second and the remaining first metal layer are formed a circuit structure and electrically connected to the electrical pads of the wafer. Furthermore, the process above can be repeated to form a build-up circuit structure on the wafer. Thus, the circuit rearranged structure are formed on the surface of wafer and a supporting component is omitted, thereby reduce the package size.
Patent TW-I255594-B (TW)
Title: Adapter kit for memory card
Inventor: CHIN RUEI-SHIANG
IPC: H01R13/62
Filed: 2005-07-07
Granted: 2006-05-21
Abstract: Disclosed is an adapter kit for memory cards, which is meant to the kit body. The kit body at least comprises a rabbet capable to provide the accommodation and fixing of the dual interface memory card. After the memory card is fixed at the rabbet, the interfacing side of the USB to the memory card is exposed out for immediate contact. In addition, the total thickness of the interfacing side of the USB and the kit body is equal to the height of the USB interface port slot which enables the interfacing side of the USB of the memory card to be inserted into the electronic device equipped with USB interface.
Patent TW-I268621-B (TW)
Title: Thin film etching method
Inventor: HSU CHIA-CHE
IPC: H01L29/786
Filed: 2005-12-21
Granted: 2006-12-11
Abstract: A thin film etching method is disclosed, which is used for manufacturing semiconductor device or thin film transistor (TFT) array and through which no undercut may be presented or a good after-etching shape may be achieved with respect to a thin film thus etched. The thin film etching method is performed in a two-stage manner by an etchant and between the two stages a photoresist removing process is inserted where another etchant is used. With execution of the photoresist removing process, the thin film may have an increased contact area with the etchant. As such, any undercut or undesired after-etching shape existed in the thin film etched by the prior art may be eliminated or improved.
Patent TW-I279121-B (TW)
Title: Multi-directional sliding module and application thereof
Inventor: SHIH CHIN-CHUNG
IPC: H04M1/02
Filed: 2005-12-30
Granted: 2007-04-11
Abstract: A multi-directional sliding module on a single surface for a portable device is described. The multi-directional sliding module includes a slide, a first sliding track, and a second sliding track. The first sliding track and the second sliding track are disposed on a single surface and formed a predetermined included angle to allow a first sliding electronic module of a portable device sliding along at least two directions on a second sliding electronic module thereof. For example, when the first sliding electronic module is slid out along the first sliding track, the portable device is under a cell phone mode. When the first sliding electronic module is slid out along the second sliding track, the display of the portable device is under a transverse display mode, similar to a computer display. The multi-directional sliding module further includes a dynamic sliding module having a slide coupling to the track in a partial stroke.
Patent TW-I285720-B (TW)
Title: Light emitting diode multiphase driver circuit and method
Inventor: HUYNH KIMLONG
IPC: H05B44/00
Filed: 2006-01-27
Granted: 2007-08-21
Abstract: A method and a circuit for driving light emitting diodes (LEDs) in multiphase are provided. A string of LEDs divided into groups connected to each other in series is provided. Each group is coupled to ground through separate conductive paths. A phase switch is provided in each conductive path. Increasing the input voltage turn on the string of LEDs, group by group in the sequence downstream the string. To reduce power dissipation, the phase switch of an upstream group is turned off when next downstream group is turned on.
Patent TW-I274729-B (TW)
Title: Substrate transfer apparatus
Inventor: CHUNG HWA-JUN
IPC: B65G49/07
Filed: 2006-01-27
Granted: 2007-03-01
Abstract: The invention provides a substrate transfer device, which can steadily transfers a substrate in order to ensure the uniformity of the substrate. The substrate transfer device includes a substrate support portion, which has a plate that support the substrate; a rail portion, which extends in the specific transferring direction of the substrate and support the substrate support portion movably, and a driving portion, which makes the substrate support portion move along the rail portion and transfer the substrate.
Patent TW-I403595-B (TW)
Title: Method for producing an internal combustion engine valve and valve obtained in this manner
Inventor: MONTAGNON JACQUES
IPC: F01L15/18
Filed: 2007-01-23
Granted: 2013-08-01
Abstract: The invention concerns a method for making a unitary spark ignition valve, characterized in that it consists in preparing and casting a steel made up in wt. % of: 0.45%<=C 0.55%; 12%<=Cr<=18%; 1%<=Si<=2.5%; traces<=Mn<=2%; 0.2%<=V<=0.5%; traces<=Mo<=0.5%; 0.05%<=N<=0.15% with 0.55%<=C+N<=0.70%; traces<=Ni<=1%; traces<=Cu<=0.25%; or Cu<=0.5 Ni if Cu>0.25%; traces<=Co<=1%; traces<=W<=0.2%; traces<=Nb<=0.15%; traces<=AI<=0.025%; traces<=Ti<=0.010%; traces<=S<=0.030%; traces<=P<=0.040%; traces<=B<=0.0050%; the balance being iron and impurities resulting from the preparation; in transforming by hot thermomechanical process, for example, by rolling and/or forging between 1000 and 1200° C.; optionally soft annealing, between 650 and 900° C. for 2 to 8 hours followed by air or furnace cooling; and performing the final thermal or thermomechanical treatments which will impart to the valve its shape and its final properties, including hot-shaping by forging or extrusion, and in a final manufacturing step a localized surface quenching, such as a high-frequency quenching, a plasma or a laser shock quenching, performed on certain parts of the valve. The invention also concerns a unitary spark ignition engine valve obtained by said method.
Patent TW-I406871-B (TW)
Title: Anti-tat226 antibodies and immunoconjugates
Inventor: LIANG WEI CHING
IPC: A61K47/48
Filed: 2007-03-16
Granted: 2013-09-01
Abstract: Anti-TAT226 antibodies and immunoconjugates thereof are provided. Methods of using anti-TAT226 antibodies and immunoconjugates thereof are provided.
Patent TW-I373958-B (TW)
Title: Surface-emission laser array, optical scanning apparatus and image forming apparatus
Inventor: SATO SHUNICHI
IPC: H01S3/10
Filed: 2007-04-27
Granted: 2012-10-01
Abstract: A surface-emission laser array comprises a plurality of surface-emission laser diode elements arranged in the form of a two-dimensional array, wherein a plurality of straight lines drawn perpendicularly to a straight line extending in a first direction from respective centers of the plurality of surface emission laser diode elements aligned in a second direction perpendicular to the first direction, are formed with generally equal interval in the first direction, the plurality of surface-emission laser diode elements are aligned in the first direction with an interval set to a reference value, and wherein the number of the surface-emission laser diode elements aligned in the first direction is smaller than the number of the surface-emission laser diode elements aligned in the second direction.
Patent TW-I354286-B (TW)
Inventor: INOUE KOHJI
IPC: G11C13/00
Filed: 2007-11-20
Granted: 2011-12-11
Abstract: Provided is a nonvolatile semiconductor device capable of performing writing operations of different resistance changes for memory cells having variable resistive elements whose resistive characteristics are changed by voltage applications, individually and simultaneously. The device includes: a load resistive characteristic variable circuit for each bit line connected commonly with the memory cells on the same column for selecting one of two load resistive characteristics according to a first writing operation where the resistive characteristics of the variable resistive element to be written transit from a low resistance state to a high resistance state or a second writing operation where they transit reversely; and a writing voltage pulse application circuit for applying a first voltage pulse in a first writing operation and a second voltage pulse in a second writing operation to the memory cells to be written through the load resistive characteristic variable circuits and the bit limes.
Patent TW-I412451-B (TW)
Title: Method of manufacturing mold fixing structure and mold sleeve thereof
Inventor: CHANG KENG MING
IPC: B29C45/36
Filed: 2008-05-09
Granted: 2013-10-21
Abstract: A method of manufacturing a mold sleeve includes the following steps: providing two semi-manufactured mold sleeves, one of the semi-manufactured mold sleeves protruding out a protrusion, and the other one of the semi-manufactured mold sleeves defining a groove; providing two clamps each defining a chamber and a manufacturing aperture communicating with the chamber; placing the two semi-manufactured mold sleeves into the chambers of the two clamps respectively, with the protrusion of the semi-manufactured mold sleeve aligned with and inserted into the other semi-manufactured mold sleeve, fixing the two clamps; broaching a mold cavity in each semi-manufactured mold sleeve along an axial direction thereof via the manufacturing aperture of each clamp; and obtain the mold sleeve. The present invention also relates to a method of manufacturing a mold fixing structure using the mold sleeve.
Patent TW-I411718-B (TW)
Title: Sizing agent for fiber
Inventor: INOUE MASAHITO
IPC: C08J5/24
Filed: 2008-05-21
Granted: 2013-10-11
Abstract: A sizing agent for fibers is provided, which contains a polyester resin, and is capable of improving the emulsification stability and the sizing property while maintaining adhesive property with a matrix resin. The sizing agent for fibers is an aqueous solution or an aqueous emulsion, which contains a polyester resin (A) that satisfies all the following conditions (i)-(iv) and an aqueous medium: 
(i) that the polyester resin (A) is made from a dicarboxylic acid or its anhydride (a) and diols (b); 
(ii) that at least one of the diols (b) is diol (b1) that has an average 4.5-60 contiguous oxyethylene groups; 
(iii) that the weight percentage of the average 4.5-60 contiguous oxyethylene groups in the polyester resin (A) is 25-50 wt%; and 
(iv) that a mixture of 10 parts by weight of the polyester resin (A) and 90 parts by weight of water forms an uniform transparent solution or an uniform emulsion at 25°C.
Patent TW-I449462-B (TW)
Title: Illumination system comprising a light source and a control unit and an illumination control system for controlling a light source by multiple user interface surfaces
Inventor: VAN DOORNE HUBERT JOHAN MARIE ROBERT
IPC: H05B37/02
Filed: 2009-02-13
Granted: 2014-08-11
Abstract: An Illumination system comprising a light source (1010) and a control unit (CU1) for controlling the light source is described. The control unit is arranged to operate in a first state to control a first illumination parameter of the light source and in a second state to control a second illumination parameter, a transition from the first state to the second state is obtained by providing a pulling force to a control element of the control unit.
Patent TW-I486495-B (TW)
Title: Circular knitting machine with a rotatably disposed dial
Inventor: TRAENKLE DIETMAR
IPC: D04B15/94
Filed: 2009-03-10
Granted: 2015-06-01
Abstract: The circular knitting machine has a frame, a rotatable ribbed disk (16), and a rib lock carrier (8) mounted in the frame, on which a rib lock (18) is fastened. A ribbed disk shaft (11) is rotatably and coaxially supported in the rib lock carrier for driving the ribbed disk. The ribbed disk is rotatably and coaxially supported on the rib lock carrier by a bearing (26) with adjustable bearing play. The ribbed disk is coaxially connected with the ribbed disk shaft by a spring steel sheet (20).
Patent TW-I410172-B (TW)
Title: Driving circuit of backlight module
Inventor: CHANG SHIH MENG
IPC: H05B37/02
Filed: 2009-04-16
Granted: 2013-09-21
Abstract: A driving circuit of a backlight module is provided. The driving circuit has a dimming unit used for transmitting signals, wherein the dimming unit can adjust a current flowing through a light-emitting diode (LED) according a pulse width modulation signal and an enable signal, so as to adjust a light-emitting intensity of the LED. In the present invention, fewer devices are used to implement the dimming unit, and a transmission gate is replaced by a N-type transistor and a P-type transistor, such that a chip area and a circuit cost of the driving circuit are reduced.
Patent TW-I403513-B (TW)
Title: Pyrrolopyrazinyl urea kinase inhibitors
Inventor: BAMBERG JOE TIMOTHY
IPC: A61P35/00
Filed: 2009-12-02
Granted: 2013-08-01
Abstract: The present invention relates to the use of novel pyrrolopyrazinyl urea derivatives of Formula I, wherein the variables R1, R2, R3, R4, and R5 are defined as described herein, which inhibit JAK and are useful for the treatment of auto-immune and inflammatory diseases.
Patent TW-I404607-B (TW)
Title: Valve and its gasket
Inventor: LIU CHIENAN
IPC: F16K1/42
Filed: 2010-04-08
Granted: 2013-08-11
Abstract: A valve is disclosed. The valve includes a tube, a gasket, a disc, and a stem. The gasket is disposed on the tube. The gasket is defined an upper side and a lower side along the axial direction. The gasket includes a sealing portion and a frame. The sealing portion is located on the upper side. The frame includes an axial portion and a radial portion. The axial portion is located under the sealing portion. The radial portion is inserted into the gasket. The disc fits the sealing portion for sealing the tube. The stem is connected to the disc for controlling the disc to open or seal the tube.