baber/WOPTO huggingface dataset:
Patent JP-2007247403-A (JP)
Title: Connection mechanism of hanging rod for ceiling board
Inventor: OKUMURA MASAHIRO
IPC: E04B9/14
Filed: 2007-07-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connection mechanism of a hanging rod for a ceiling board, easy in the connection, improving manufacturing efficiency of the hanging rod, reducing manufacturing cost, and improving strength.  <P>SOLUTION: First of all, a vertically long insertion hole 10 is formed on a side surface of a main plate part 4 of the hanging rod 1 for one ceiling board. A base board part 21 having the edge abutting on the side surface of the main plate part 4 of the one hanging rod 1, is projected from an end part of the hanging rod 1 for the other ceiling board, and a connecting projection part 22 is also projected forward from the base board part 21. A U-shaped cut and raised part 24 is also arranged in the connecting projection part 22. A reinforcing swelling projection part 31 is formed in this U-shaped cut and raised part 24 for improving the strength. The connecting projection part 22 is pressed in the insertion hole 10, and the connecting projection part 22 is nonseparably connected from the insertion hole 10. Such a constitution does not require skill for installation. Since a pre-process such as bending is not required by forming and caulking the U-shaped cut and raised part 24, a manufacturing process of the hanging rod is simplified, and the manufacturing efficiency is improved, and the manufacturing cost can be reduced.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008016855-A (JP)
Title: Semiconductor device with laminated chip and method for manufacturing it
Inventor: SIMON JUERGEN
IPC: H01L25/18
Filed: 2007-07-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element with a laminated chip in which productivity in manufacturing process is excellent.  <P>SOLUTION: The method for manufacturing the semiconductor element consists of: a process of preparing a first semiconductor wafer 8 having a first contact pad 5 in an upper part side; a process of disposing a convex-like contact bump 12 the contact pad 5 of the first semiconductor element 8; a process of preparing a second semiconductor element 15 in which a through hole extends to a lower part from a contact pad 18; and a process of setting the second semiconductor element 15 to be adjacent to the first semiconductor element and arranging the convex-like contact bump 12 in the through hole to be electrically connected to the contact pad 18 of the second semiconductor element 15.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009018601-A (JP)
Title: Speed change operation apparatus for vehicle
Inventor: ISHIZU AKIMICHI
IPC: B60K20/02
Filed: 2007-07-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a speed change operation apparatus for vehicle which can both suppress the operation noise of a push knob and keep necessary strength and rigidity of the push knob.  <P>SOLUTION: The speed change operation apparatus for the vehicle includes an operating lever 1 for performing speed change operation of a transmission of the vehicle by pivotal operation of the operating lever 1, an operating knob 2 secured on the tip end of the operating lever 1 and adapted to be gripped by a driver of vehicle, and the push knob 3 mounted on the operation knob 2 and adapted to be actuated by the driver to descent a lock-pin rod 4 arranged within the operating lever 1. The push knob 3 is outsert-molded by soft resin 6 at its first portion 6a abutting the lock-pin rod 4 when the push knob 3 is actuated or at its second portion 6b abutting the operating knob 2 after the actuation of the push knob 3.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009065993-A (JP)
Title: Simple bath and its assembling method
Inventor: NAKAJIMA HIROSHI
IPC: A47K3/06
Filed: 2007-07-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a simple bath which is inexpensive and light enough to be carried, and nonetheless has a wider bathing space in the bath than conventional examples, is easy to use, and has a long life.  <P>SOLUTION: The simple bath 100 enabling a care receiver to take a bath while sitting on a chair 2, is equipped with a freely foldable water-resistant bag body 1 with its top part open to the air, a square bottom board 3 placed on the bottom in the bag body 1 and enabling the chair 2 to be placed thereon, and a column support 4 established at the four corners of the bottom board 3 and locked at a certain height according to the body size of the care receiver when the bag body 1 is extended.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009020947-A (JP)
Title: Heat-assisted magnetic recording device and heat-assisted magnetic recording method
Inventor: NAKAMURA KIMIO
IPC: G11B5/65
Filed: 2007-07-11
Abstract: <P>PROBLEM TO BE SOLVED: To perform heating power control in heat-assisted magnetic recording that uses a pattern medium.  <P>SOLUTION: Test writing is performed, while continuously changing heating power strength for a pattern column of a plurality of test writing regions provided on a recording medium; and from the reproduced signal of the test writing, the minimum heating power of recording being a boundary power of recording and un-recording and the maximum power of recording which is a boundary power of recording and heating power erasing recorded information of an adjacent pattern are determined, then, optimum recording power is determined.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009019258-A (JP)
Title: Hot dip galvannealed high strength steel sheet having tensile strength of >=700 mpa and excellent corrosion resistance, hole expansibility and ductility, and method for producing the same
Inventor: FURUSAKO SEIJI
IPC: C23C2/28
Filed: 2007-07-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hot dip galvannealed high strength steel sheet having a tensile strength of ≥700 MPa, and jointly having corrosion resistance, hole expansibility and high ductility, and to provide a method for producing the same.  <P>SOLUTION: Disclosed is a steel sheet obtained by applying hot dip galvannealing to a steel sheet having a composition comprising, by mass, 0.01 to 0.2% C, 0.001 to 0.200% Si, 1.0 to 3.0% Mn, 0.01 to 1.0% Al, 0.001 to 0.3% P, 0.0001 to 0.1% S, 0.0005 to 0.01% N and 0.01 to 0.5% Mo, and the balance Fe with inevitable impurities. The steel has a microstructure comprising, by area ratio, 30 to 90% tempered martensite, 5 to 50% ferrite and ≤50% bainite, an in which the ratio (Hv)<SB>1</SB>/(Hv)<SB>2</SB>between the hardness (Hv)<SB>1</SB>of the tempered martensite and the hardness (Hv)<SB>2</SB>of the ferrite lies in the range of 1.3 to 2.4 times.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009023417-A (JP)
Title: Fluid machinery using parallel rotary wings
Inventor: TSUCHIYA TAKANORI
IPC: B64C33/02
Filed: 2007-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an airplane in which parallel rotary wings converting bird's wing-flapping motion into rotary motion are used.  <P>SOLUTION: Processes of bird's flapping motion are broken down and each process is transposed into a plurality of element wings, which are arranged at equal intervals using a ridgeline on a cylindrical surface, one end of which is a rotary disk, as a swinging shaft and rotated. In that case, each element wing is returned by the same rotating angle with the rotating angle of the wing rotated by the rotation of the disk by a gear mechanism incorporated in the rotary disk and, in principle, rotated in parallel keeping a setting angle. In addition, each element wing is swung periodically during one rotation. To the condition causing excessive negative angle of attack to the element wings, the setting angle of the rotary wings is adjusted to a negative angle, and the inclination angle of an eccentric shaft to a positive angle. Thus, control can be achieved is made which increases the angle of attack of swinging-up strokes at a certain rate, compared with swinging-down strokes.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009022185-A (JP)
Title: Seed disinfector
Inventor: MUTA HIROICHI
IPC: A01C1/08
Filed: 2007-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the running cost in a seed disinfector that immerses seeds in warm water and disinfects them.  <P>SOLUTION: The seed disinfector is equipped with a warm water disinfection tank 1 for storing warm water; a cooling tank 10 for storing cooling water; a water supply means 18 for supplying cooling water to the cooling tank 10; a recovery tank 36 for recovering overflowing cooling water via a cooling water overflow pathway 35, when cooling water in the cooling tank 10 reaches a fixed amount or more; a switching valve 27 to which water from the recovery tank 36 is supplied via a water supply pathway 37; a warm water supply pathway 28, to which water from the switching valve 27 is supplied and which supplies the water to the warm water disinfection tank 1; a heater 30 for heating water flowing in the warm water pathway 28; and a return pathway 26 for supplying warm water, from the warm water disinfection tank 1 to the switching valve 27. The switching valve 27 is changed from a state of supplying water from the water supply pathway 37 to the warm water pathway 28, to a state of supplying warm water from the return pathway 26 to the warm water supply pathway 28.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009026926-A (JP)
Title: Package for housing electronic component
Inventor: KAWAKAMI TAKESHI
IPC: H01L23/04
Filed: 2007-07-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a package for housing electronic components with which an electronic device can be manufactured such that whether a bonding material makes a correct connection between a connection pad and an external electric circuit can be inspected in side surface packaging.  <P>SOLUTION: Disclosed is the package for housing electronic components, which has a mount portion 1a for the electronic components on a top surface of an insulating base 1, and has a wiring conductor 2 formed from the mount portion 1a to one side surface and a frame-shaped metal member 4, enclosing the mount portion 1a and bonding a lid body, fitted onto a top surface such that the wiring conductor 2 formed on the one side surface is bonded to the external electric circuit through the bonding material. On the top surface of the insulating base 1, a projection portion 3 is formed at an outer peripheral portion along the one side surface to have its external surface in level with the one side surface, and the wiring conductor 2 formed on the one side surface is extended to the external side surface of the projection portion 3. The bonding material is extended to the external side surface of the projection portion 3 to bond the wiring conductor, so the state of the bonding material can easily and securely be inspected from above.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007306026-A (JP)
Title: Cooling system for electronic device and electronic device with cooling system
Inventor: KUROKAWA KENJU
IPC: H05K7/20
Filed: 2007-07-19
Abstract: <P>PROBLEM TO BE SOLVED: To facilitate a cooling pipe piping work, to prevent leakage of a liquid refrigerant, and to enhance operation efficiency while the heat exchange capacity of a heat exchanger unit is controlled to prevent dewing and freezing, in a cooling system for an electronic device and the electronic device with the cooling system.  <P>SOLUTION: A part of a cooling pipe 10 is flattened, and the flat part 4 is contacted with respective electronic parts to cool them and to facilitate piping work. Piping connection parts are reduced to prevent the leakage of the liquid refrigerant, and the operation efficiency is enhanced while the heat exchange capacity of the heat exchanger unit in the cooling system is controlled to prevent the dewing and the freezing, in response to an outside air temperature, a temperature in the electronic device and a liquid refrigerant temperature. In the electronic device having two electronic systems, the common of a liquid refrigerant tank in respective cooling systems of the two electronic systems allows preventing the dewing and the freezing of the cooling systems in the pause side electronic system.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009027473-A (JP)
Title: Download terminal, content server, content download method and content distribution method
Inventor: TAMANO HIROKAZU
IPC: H04N21/258
Filed: 2007-07-19
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem that, in the case that a user views and then deletes contents of a first story in a series program, if the series program is additionally purchased, download processing may be forcibly performed on the contents of the first story, contents that the user does not intend may become a download target and downloading or viewing of contents of second and following stories may be delayed.  <P>SOLUTION: In a download terminal 300, a download determination section judges downloading of a series program and confirms a download history of contents 411 (S114). Since the download history of the contents 411 is registered in a download history, it is confirmed to a user whether to perform downloading (S115). Next, a download history of contents 412 is confirmed (S117). In the case that there is no matched content reference ID in the download history, downloading of the contents 412 is performed (S119, S120).  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009026659-A (JP)
Title: Positive electrode material and solid oxide type fuel cell
Inventor: HIRATA YOSHIHIRO
IPC: H01M4/88
Filed: 2007-07-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high-performance positive electrode material for a solid oxide type fuel cell using an electrolyte of rare earth solid solution ceria.  <P>SOLUTION: In the solid oxide type fuel cell using the electrolyte of the rare earth solid solution ceria, the positive electrode material contains SrRuO<SB>3</SB>which is less liable to chemical reaction with the electrolyte, highly electron-conductive and highly reactive with oxygen. This actualizes higher output performance than conventional one while suppressing the performance deterioration of the positive electrode.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009024970-A (JP)
Title: Steam cooker
Inventor: OKAMOTO YOSHIHIRO
IPC: F24C1/00
Filed: 2007-07-23
Abstract: <P>PROBLEM TO BE SOLVED: To achieve a water level detector of a water supply tank, reducing the quantity of water discharged when the water supply tank is detached, and achieving space-saving.  <P>SOLUTION: In this steam cooker, static capacitance type sensors 99, 100, 101 are provided at the tips of three plate springs 93, 94, 95 whose tips enter a dent of the water supply tank 30 through openings 96, 97, 98 of a tank storing case 91 to fix the water supply tank 30. When the tips of the plate springs 93, 94, 95 enter the dent of the water supply tank 30 to fix the water supply tank 30, the water level of the water supply tank 30 is detected by the static capacitance type sensors 99, 100, 101. Thus, the water level detector, dispensing with an auxiliary tank and a tank detecting switch and achieving space-saving is provided. The water discharged into the tank storing case 91 in detaching the water supply tank 30 from the tank storing case 91 is only the water in a first water supply pipe 31, a second water supply pipe 32 and a third water supply pipe to reduce the quantity of discharged water.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009029904-A (JP)
Title: Resin composition for sealing semiconductor and resin-sealed semiconductor device
Inventor: MAYAMA TOSHIO
IPC: C08L63/00
Filed: 2007-07-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing semiconductors that can be ejected in a liquid state in a sealing operation, gives a cured product exhibiting good reflow resistance at a high temperature and good moisture resistance reliability, and permits the manufacture by resin-sealing therewith of a semiconductor element as a sealed article hardly suffering from warpage, which is an important performance in an after-process.  <P>SOLUTION: The resin composition for sealing semiconductors comprises as essential ingredients (A) an epoxy resin comprising a biphenyl type liquid epoxy resin, (B) a curing agent bearing at least two phenolic hydroxy groups for epoxy resins, (C) a curing catalyst for epoxy resins and (D) an inorganic filler, where the resin composition can be liquefied at 40-80°C and can ejected in a liquid state and thus is suitable for sealing semiconductors.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009030708-A (JP)
Title: Rotating force transmission device
Inventor: YAMANAKA KAZUYA
IPC: F16D11/04
Filed: 2007-07-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a rotating force transmission device having high reliability on the motion of connection to the input shaft of a conversion mechanism which converts the rotating motion of a carrying vehicle with a lifting function into vertically linear motion.  <P>SOLUTION: The rotating force transmission device wherein a driven rotary disc 12 connected to the input shaft 20 is provided at the side end of a base body 3 of the carrying vehicle 1 with the lifting function, comprises: a shaft body 10 arranged at a predetermined position on a carrying passage with a rotational center axis B of the driven rotary disc 12 in an approximate axial-center direction, and supported movably forward/backward in the axial-center direction; a driving rotary disc 11 mounted at the front end of the shaft body 10 in opposition to the driven rotary disc 12; a forward/backward moving actuator 7 for moving forward/backward the shaft body 10 in the axial-center direction; and a rotating actuator for rotating the shaft body 10 around a rotational center axis A. An engaging hole is formed in the driven rotary disc 12 distantly from the rotational center axis B in the radial direction, and an engaging pin 21 is provided on the driving rotary disc 11 for loosely fitting the engaging hole.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009032891-A (JP)
Title: Manufacturing method of nitride-based semiconductor element
Inventor: MIYAKE YASUHITO
IPC: H01L21/205
Filed: 2007-07-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a nitride-based semiconductor element which can be sufficiently improved in element characteristic and yield.  <P>SOLUTION: A defect concentration region 1b of a GaN substrate 1 is etched through wet etching using a hydrochloric-acid-based etchant to form a striped groove 10 having a projection 13 on its bottom surface 12. Then nitride-based semiconductor layers 20 and 20a are formed on the GaN substrate 1, and an element structure portion 22 is formed in the nitride-based semiconductor layer 20 on a low-defect region 1a.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008100506-A (JP)
Title: Inkjet recording apparatus and method
Inventor: YAMANOBE ATSUSHI
IPC: B41J2/01
Filed: 2007-07-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inkjet recording apparatus and a method whereby images of a good image quality can be recorded.  <P>SOLUTION: In the inkjet recording apparatus 10 which records the images to both front and rear surfaces of a recording sheet 12, when a time after the ink is hit to a region of the front surface side of the recording sheet 12 before the ink is hit to a corresponding region of the rear surface side is made ΔT1 [sec], a time after the ink is hit to a region of the front surface side of the recording sheet 12 before the region comes in contact with a member is made ΔT2 [sec], and viscosity of the ink is made η [mPa×sec], the formula (1): ΔT1<0.45×η and the formula (2): ΔT2>1 are satisfied. A shape of the ink hit to the rear surface can be prevented from being broken from a perfect circle, and also the image quality can be prevented from being degraded as a result of that the ink hit to the front surface comes in contact with the member before being dried.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009037660-A (JP)
Title: Optical information recording medium
Inventor: SHIMIZU HIROO
IPC: G11B7/24079
Filed: 2007-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical information recording medium in which data can be recorded only by a dedicated recorder and read by a versatile read and reproduction device by preventing illegal copying.  <P>SOLUTION: The optical information recording medium 1 has a disk-like light-transmission substrate 2 which has a wobbled spiral groove WB and a land LN between adjacent grooves WB, an optical absorption layer 3 formed on the light transmission substrate 2, and a light reflection layer 4 formed on the optical absorption layer 3. The depth Ds of the groove WB is 140 nm≤Ds≤155 nm; the depth Dd of the recess part of the optical absorption layer 3 on the groove WB is 95 nm≤Dd≤105 nm; and the value of a push-pull signal during non-recording is not larger than 0.3.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008074089-A (JP)
Title: Ink-jet printer and printing method utilizing the same
Inventor: SOHN DONG-KEE
IPC: B41J2/01
Filed: 2007-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ink-jet printer and a printing method utilizing the same.  <P>SOLUTION: The ink-jet printer forms one image by executing a plurality of times of printing operations onto paper P. The ink-jet printer is provided with a print head 120, which executes the printing operations onto paper that is transferred while being fixedly installed, and a paper rotating member for horizontally rotating the paper P, printed by the print head 120, by 90 degrees. The paper P, printed after being fed from a first direction to the print head 120, is horizontally rotated by 90 degrees with the paper rotating member. Then, the rotated paper P is fed from a second direction, reverse to the first direction, to the print head 120 so as to be repeatedly printed.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009035055-A (JP)
Title: Airbag and airbag device
Inventor: ABE KAZUHIRO
IPC: B60R21/276
Filed: 2007-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an airbag and airbag device having an on-off type vent hole opening or largely opening, even if an object such as a child seat comes into contact with a lower portion of the inflated airbag.  <P>SOLUTION: This airbag 10 has the first on-off type vent hole 11 opened and closed by a first lid 21 and a second on-off type vent hole 12 opened and closed by a second lid 22. The first lid 21 is connected to an occupant-facing surface 10f of the airbag 10 by a first tether 31. The second lid 22 is connected to the lower portion 10b of the airbag 10 by a second tether 32. When the object comes into contact with the lower portion 10b of the inflated airbag 10, the second tether 32 is loosened, the second lid 22 is separated from the second on-off type vent hole 12 by gas pressure in the airbag 10. As a result, the second on-off type vent hole 12 is opened.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009038203-A (JP)
Title: Semiconductor device
Inventor: UEMICHI YUSUKE
IPC: H01L23/12
Filed: 2007-08-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which an inductive element and a capacitive element are formed on a semiconductor substrate, capable of miniaturizing the device by effectively using a limited area and can curtail a manufacturing process and cost.  <P>SOLUTION: The semiconductor device 1 at least comprises: semiconductor substrate 2 having an electrode and an integrated circuit formed on at least one surface; a first insulating resin layer 5 provided covering the one surface of the semiconductor substrate; an inductive element 8a formed on the first insulating resin layer and electrically connected to the electrode; and a capacitive element 9 formed on the one surface of the semiconductor substrate. It is characterized in that the inductive element comprises a conductor part formed in spiral, one end of the capacitive element is electrically connected to an inner edge of the conductor part, and the other end of the capacitive element is electrically connected to the integrated circuit or an external circuit.  <P>COPYRIGHT: (C)2009,JPO&INPIT