Patent GB-1112604-A (GB)
Title: Method of making contact to semiconductor arrangements
IPC: H01L23/48
Filed: 1965-08-11
Abstract: 1,112,604. Semi-conductor devices. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 11 Aug., 1965 [14 Aug., 1964; 12 June, 1965; 24 June, 1965], No. 34353/65. Heading H1K. A contact arrangement for a semi-conductor device comprises a number of strips formed integrally from a metal sheet, the semi-conductor body and the electrodes of the device each being connected to one of the strips which are then separated by removing portions of the metal sheet. As shown, Fig. 5, pairs of strips are provided between two stringers for each one of a plurality of planar transistors 7. One of the strips is divided into two parts 4, 5 which are provided with double bends to separate the cut ends of the strip. The transistor 7 is mounted on one part 5 of the cut strip, its emitter electrode is connected by a fine wire 8 to the other part 4 of the cut strip, and its base electrode is connected by wire 9 to the second strip 6. The stringers are then cut to separate the individual transistors each of which is mounted on a header (12), Fig. 6 (not shown), by bonding the strips to the flat ends of lead-in wires and removing the remaining parts of the stringers. In a modification, Figs. 1 to 4 (not shown), three strips (4, 5, 6) are provided between the stringers (2, 3) for each transistor (7). The centre strip (5) has an enlarged portion on which the transistor (7) is mounted, and the two outer strips are connected by fine wires (8, 9) to the emitter and base contacts of the transistor. One stringer (2) is removed and the transistors and their connections are embedded in casting resin (11). Two of the strips may be separated from the remaining stringer (3) to allow the transistors to be tested. The remaining stringer (3) is divided to separate the individual transistors which are mounted on a header (12) by bending two of the strips at right angles, soldering the strips to lead-in wires (13, 14, 15), removing the remaining part (21) of stringer (3) and fixing a cap to header (12). In another embodiment, Figs. 7 and 8 (not shown), three strips are formed as the teeth of a comb, the transistor (7) being mounted on the centre strip and connected by wires (8 and 9) to the outer strips. The transistor and its connections are embedded in casting resin (11), lead-in wires (18, 19, 20) are welded or soldered to the free ends of the strips and the sheet is then cut along line (A-B) to separate the strips from one another. In a modification, Fig. 9 (not shown), the transistor is mounted on one of the outer strips, the strips being suitably shaped to accommodate it. In a further embodiment, Fig. 10 (not shown),  the strips are formed as projections towards the interior of an opening formed in the centre of a metal sheet, integrated circuits (7) are mounted on the strips and their electrodes connected to other strips by fine wires, the system is embedded in a casting resin (11) and the strips are separated from one another by cutting along line (A-B). The metal sheet may be of nickel, molybdenum, or " Kovar " (Registered Trade Mark), and may be gold plated after forming the strips by stamping. A gold-antimony foil may be welded to the strip where the semi-conductor device is to be mounted to form an ohmic contact to the body of the device.