Patent SG-11201811611W-A (SG)
Title: Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
Inventor: NEMANI SRINIVAS D
IPC: H01L21/683
Filed: 2017-06-01
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 11111111111111111111111111111111111111111111111111111111111111111111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\" WO 2018/017192 Al 25 January 2018 (25.01.2018) WI P0 I P C T (51) International Patent Classification: SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, HO1L 21/683 (2006.01) H01L 21/02 (2006.01) TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (21) International Application Number: (84) Designated States (unless otherwise indicated, for every PCT/US2017/035529 kind of regional protection available): ARIPO (BW, GH, (22) International Filing Date: GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, 01 June 2017 (01.06.2017) UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, (25) Filing Language: English EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, (26) Publication Language: English MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, (30) Priority Data: KM, ML, MR, NE, SN, TD, TG). 15/217,328 22 July 2016 (22.07.2016) US Published: (71) Applicant: APPLIED MATERIALS, INC. [US/US]; — with international search report (Art. 21(3)) 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: NEMANI, Srinivas D.; 504 Fern Ridge Court, Sunnyvale, California 94087 (US). ROY, Shambhu N.; 2799 Barrington Terrace, Fremont, California 94536 (US). PISHARODY, Gautam; 39953 Cedar Boulevard, Unit _ 223, Newark, California 94560 (US). BUCHBERGER, — JR., Douglas A.; 2076 Vintage Lane, Livermore, California = 94550 (US). YIEH, Ellie Y.; 5888 Pistoia Way, San Jose, California 95138 (US). HUA, Zhong Qiang; 18026 King = Court, Saratoga, California 95070 (US). (74) Agent: BERNADICOU, Michael A. et al.; BLAKELY = = SOKOLOFF TAYLOR & ZAFMAN LLP, 1279 Oakmead Parkway, Sunnyvale, California 94085 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, = = AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, = HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, = KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, — MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, = PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, = = (54) Title: PROCESSED WAFER AS TOP PLATE OF A WORKPIECE CARRIER IN SEMICONDUCTOR AND MECHANICAL — PROCESSING = = FIG. I _ ,-1 .4 -\----- 12 N / /iff/ A 01 1-1 el IN 1-1 0 1 4 --.... 00 1-1 © (57) : A processed wafer is described that may be used as a workpiece carrier in semiconductor ei In some examples, the workpiece carrier includes a substrate, an electrode formed on the substrate to carry an electric charge to grip O a workpiece, a through hole through the substrate and connected to the electrode, and a dielectric layer over the substrate to isolate 13 the electrode from the workpiece. -- . 1 0 and mechanical processing.