Patent GB-1444406-A (GB)
Title: Apparatus for soldering integrated circuit chips to a printed circuit board
IPC: H01L21/00
Filed: 1973-11-06
Abstract: 1444406 Securing components to circuit boards; soldering; punching COMPAGNIE HONEYWELL BULL 6 Nov 1973 [9 Nov 1972] 51534/73 Headings B3A B3R and B3W Apparatus for use in soldering an integrated circuit chip previously mounted in an opening in a plastics film with conductors extending towards the centre of the opening and bonded to the chip, to a printed circuit board, comprises a support for the board, a soldering head having a heating bit with a location to receive the chip, means for displacing the head and a die in the path of movement of the head so that the head may pass through the die to cut the chip conductors and carry the chip to the board where the remaining portions of the conductors bonded to the chip are soldered to the board. In an embodiment a casing is formed by interconnected plates 30, 31, Figs. 3, 4, and within the casing is located a carriage 33 forming a support for a board 20. The carriage comprises a plate 49 slidably mounted on a horizontal rod 50 for movement along the rod and comprises a plate 51 movable by a belt drive 53 on the plate 49 in a direction at right angles to the rod 50. Two vertical guides 34, 35 mounted on the plate 31 provide a slideway for a plate 36 which carries at its lower end a soldering head 37. The head comprises two metal members 60, 61, Fig. 5, attached to an insulating block 62 and welded at their lower ends to a square heating bit 65 having a recess 66. A duct 67 enters the recess 66 and is connected to a suction device. A motor driven rack arid pinion device 42, 43 is attached to the plate 36 to effect vertical movement on the head. Two guides 38, 39 are provided on the plate 31 at right angles to the rod 50, and aperture 48 of dimensions similar to that of the bit 65 being provided in the plate 31 beneath the head and between the guides 38, 39. A spring pressed bar 70 is provided on the plate 36 and has a hole through which the bit 65 may pass. In operation a film 10, Fig. 1, of plastics material carrying in openings at intervals along its length integrated circuit chips P1, P2 &c. soldered to conductive fingers 13 is located on the plate 31 between the guides 38, 39 and advanced step by step by a device 40 so that when stationary one chip is over the centre of the aperture 48 and a printed circuit board having terminals to which severed portions of the fingers 13 may be soldered is located on the plate 51 of the carriage 33. The head is lowered by the rack and pinion device so that the bar 70 clamps the plastics film and the bit passes through the aperture 48 to sever the ends of the fingers 13 soldered to the wafer from the remainder of the fingers, the wafer and severed finger portions, coated with solder, being retained in the recess 66 by suction. The head continues downwardly and the electrically heated bit pressing against the severed finger portions solders these portions to the printed circuit board terminals. Air is supplied through the duct 90 to cool the bit. Circuitry controlled by switches CH, CB operated by the movement of the rack 43 automatically controls the described operations.