baber/WOPTO huggingface dataset:
Patent JP-S6149502-A (JP)
Title: Antenna for automobile
Inventor: KAMIYA TORU
IPC: H01Q5/00
Filed: 1984-08-17
Abstract: PURPOSE:To allow one antenna to be shared and to prevent the number of antenna elements from increasing by operating the antenna as a Franklin antenna and a rod antenna for different frequency ranges. CONSTITUTION:Antenna elements 1 operate as a 4-stage stack Franklin antenna for a frequency band of personal radio and also operates as a rod antenna for a frequency range of FM radio broadcasting because the overall length is a quarter as long as that for FM radio broadcasting. The phase composition coil 1c of the elements 1 is necessary for the Franklin antenna for personal radio and not necessary for the rod antenna for FM radio broadcasting, but the mean wavelength of FM radio broadcasting is >=10 times as long as the mean wavelength of personal radio transmission and the coil 1c exerts no evil influence upon the reception of FM radio broadcasting. Therefore, the elements 1 has a sufficient gain as the rod antenna for FM radio broadcasting.
Patent JP-2000012589-A (JP)
Title: Bump electrode forming method
Inventor: TAKATANI HIDESHI
IPC: H01L21/60
Filed: 1998-06-18
Abstract: PROBLEM TO BE SOLVED: To prevent peeling of bump electrodes and make the heights of the bump electrodes uniform. SOLUTION: In this forming method, an underlying electrode 12a is formed, a first insulating layer 13 covering the electrode 12a is formed, and a second insulating layer 14 whose etching rate is lower than the first insulating layer 13 is formed so as to cover the first insulating layer 13. A photoresist layer covering the second insulating layer 14 is formed, an aperture part is formed on the photoresist layer, the first and the second insulating layers 13, 14 are etched from the aperture part by using the photoresist layer as a mask, and the electrode 12a is exposed. After the photoresist layer is eliminated, a bump electrode 17 is formed so as to cover the electrode 12a and extrude to the outside of the first and the second insulating layers 13, 14.
Patent JP-H05338297-A (JP)
Title: Sheet feeder for printer
Inventor: NAKAMURA SHIGEO
IPC: B41J13/02
Filed: 1992-06-05
Abstract: PURPOSE:To remarkably reduce a distance between sheet conveying means of an upstream side and sheet conveying means of a downstream side, reduce a limit in size of a sheet to be handled, provide an effective function of a sheet guide and prevent a malfunction such as a sheet jam, etc., by reducing the guide near the sheet conveying means of the downstream side of a print head with respect to a sheet feeding direction of a printer. CONSTITUTION:A feed roller 10a and a pinch roller 10b are rotatably arranged at a downstream side of a print head 6 in a sheet feeding direction. A sheet guide 20 is positioned to be held at a pinch roller shaft through a bearing at bent parts of both sides. Positions of the roller 10b and the guide 20 can be moved with respect to the roller 10b through a cam 34, a driven lever 30 and a stationary member 33 by controlling the rotation of a drive motor 36.
Patent JP-S6232491-A (JP)
Inventor: MOCHIDA ATSUO
IPC: G06F3/14
Filed: 1985-08-06
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001005592-A (JP)
Title: Keyboard to be used with liquid crystal display
Inventor: YAMADA SHIYUUDO
IPC: G06F3/02
Filed: 1999-06-18
Abstract: PROBLEM TO BE SOLVED: To provide a keyboard to be used with a liquid crystal display capable of sufficiently securing a space on a desk, and performing a key operation even when the key board is housed. SOLUTION: The keyboard 2 is used together with a liquid crystal display 1 constituted of a display part 1a and a pedestal part 1c on which the display part is mounted through a stay 1b. In this case, a space part G in which the pedestal part of the liquid crystal display is housed is formed on the lower face of the side, opposite to the side to which an operator is faces, of a keyboard main body 2a.
Patent JP-S6063531-A (JP)
Title: Exposing device
Inventor: ANZAI AKIRA
IPC: G03B27/54
Filed: 1983-09-17
Abstract: PURPOSE:To compensate a magnification error caused by exposing energy, by keeping the energy of an exposing wavelength which is made incident to a projecting optical system in a unit time constant. CONSTITUTION:A light which is made incident to a collimator lens 6 through a rotary shutter 4 attains to a parallel luminous flux, and many secondary light source images are formed by an optical integrator 8 formed by a fly-eye lens, and the light illuminates superposingly on a reticle 11 through a condenser lens 10. Subsequently, the pattern image on the reticle 11 is formed on a wafer 15 by a reducing and projecting lens 14, and a printing exposure is executed. On the other hand, the luminous flux which is reflected by a sector of the rotary shutter 4 and made incident to a relay lens 33 of an alignment optical system is condensed to the incident side end face of an optical fiber 30, led to the second relay lens 29 by the fiber 30, and the light source image is formed on a diaphragm 27.
Patent JP-H0338080-A (JP)
Title: Semiconductor light-emitting element and its manufacture
Inventor: HOSHINA JUNICHI
IPC: H01L21/205
Filed: 1989-07-05
Abstract: PURPOSE:To make it possible to obtain a semiconductor light-emitting element, which is stably actuated in a basic transverse mode up to a high output, by a method wherein clad layers doped selectively into a first conductivity type and an active layer are formed by superposition only on one side of the surface of a substrate and clad layers doped selectively into a second conductivity type are formed only on the sides opposite to the clad layers on the substrate. CONSTITUTION:An n-type Ga0.3Al0.7As clad layer 2 is formed on one side of the surface of an n-type GaAs substrate 1, a non-doped high-resistance Ga0.3Al0.7As clad layer 3 is formed on the side opposite to the layer 2, a non-doped Ga0.9Al0.1As active layer 4 is formed on the layers 2 and 3 and moreover, a non doped high-resistance Ga0.3Al0.7As clad layer 5 is formed on one side of the surface of the layer 4, a p-type Ga0.3Al0.7As clad layer 6 is formed on the side opposite to the layer 5 and a p-type GaAs contact layer 7 is formed by superposition on the layers 5 and 6. Moreover, electrons and holes, which are injected in the layer 4 through the layers 2 and 4, are injected so as to form a recombination region 10 at the center line part of the layer 4. Accordingly, a current can be narrowed without providing a current constricting layer and moreover, carriers can be injected in a narrow distribution. Thereby, a semiconductor light-emitting element, which is stably actuated in a basic transverse mode up to a high output, can be obtained.
Patent JP-H11320066-A (JP)
Title: Injection sleeve for die casting machine
Inventor: SAWADA SHOJI
IPC: B22D17/20
Filed: 1998-05-14
Abstract: PROBLEM TO BE SOLVED: To restrain the thermal deformation, wearing, cracking, erosion, etc., developed caused by passing-through of molten metal, to extend the durable service life and to reduce the total cost by arranging a build-up layer on the inner surface of or a part of the sleeve in an injection cylinder having the pouring-in hole and the discharging hole for molten metal. SOLUTION: The build-up layer 2 is formed on the whole inner surface at the base material side 1 of the sleeve body or near the pouring-in hole 3 for molten metal thereof. As powdery material for build-up raw material, mixed powder of the steel material series of carbon steel series, high nickel chromium steel, etc., further alumina, silicon oxide, yttrium oxide, etc., and sialon, is used and build-in thermal-spraying is executed. When attaching importance to the heat resistance of the build-up layer 2, the powdery material of alloy steel series or ceramic seried is better and the hardness based on HRC is desirable to generally be >=40.  Since the plasma powdery build-up welding is executed to the inner surface at the base material side 1 of the sleeve body, galling with the tip 4 caused by the deformation with thermal expansion difference between the base material 1 of the sleeve body and the inner surface thereof, is little unless the fuild-up thickness is made extremely ununiform, and the fuild-up thickness may be about 0.5-10 mm.
Patent JP-H0460022-A (JP)
Title: Sheathing method and sheathing pile therefor
Inventor: FUKASHIMA SADAO
IPC: E02D17/04
Filed: 1990-06-28
Abstract: PURPOSE:To perform precise and firm construction with good working efficiency by boring long holes in the peripheral ground of an excavation area, building sheathing sheet piles having reinforcements protruded followed by reburying, excavating the excavation area, and throwing sheathing sheet piles between the sheathing piles. CONSTITUTION:In the peripheral ground of an excavation area 1, long holes 3, 3 long in the inner and outer directions of the excavation area 1 are bored deeper than a planned excavation depth every determined space along the excavation area l. Sheathing piles 4 having reinforcements 4b horizontally protruding on the lower end parts of vertical pile materials 4a integrally protruded are built in the long holes 3, 3, and then the long holes 3, 3 are reburied. Then, sheathing sheet piles 6, 6 are thrown between the sheathing piles 4 exposed by excavation while excavating the ground in the excavation area 1.
Patent JP-2001003164-A (JP)
Title: Sputtering target for forming high dielectric film free from generation of cracking even in the case of high speed film formation
Inventor: MORI AKIRA
IPC: H01L21/203
Filed: 1999-06-18
Abstract: PROBLEM TO BE SOLVED: To prevent cracking at the time of high speed film formation by controlling the thickness of a target to a specified range. SOLUTION: The target is the one with a disk shape composed of a multiple oxide sintered body of Ba and Ti, a multiple oxide sintered body of Sr and Ti or a multiple oxide sintered body of Ba, Sr and Ti, arid its thickness is controlled to 0.4 to 3 mm. In the case the thickness exceeds 3 mm, cracking is generated in the process of high speed sputtering, and in the case of <0.4 mm, the ratio of the breakage of the target in the process of machining and in the process of handling increases, and it is unpreferable. The target of 0.4 to 3 mm thickness can be made into the one having a large diameter in the range of 250 to 500 mm. Moreover, in this target, even in the case of >=95% density ratio, cracking is not generated.  The target is produced by grinding a sintered body of >=95% density ratio obtd. by subjecting BST multiple oxide powder to hot pressing under prescribed conditions to a thickness of 0.4 to 3 mm by grindstones and thereafter executing chemical mechanical grinding using prescribed diamond slurry.
Patent JP-S5873770-A (JP)
Title: Ion plating device of high efficiency utilizing magnetic field of magnet and coil
Inventor: URAMOTO JIYOUSHIN
IPC: C23C14/32
Filed: 1981-10-28
Abstract: PURPOSE:To converge plasma beams to a hearth simultaneously with bending of the same and to decrease the losses of plasma on the wall of a vacuum vessel by disposing magnets under the hearth and near the wall of said vessel. CONSTITUTION:Plasma beams 14 are formed in a vacuum vessel 6 by an introducing port 1 for gaseous Ar, a new type cathode 2, the 1st intermediate electrode and an annular permanent magnet 3, the 2nd intermediate electrode, an air core electromagnetic coil 4, and a discharge electric power source 5. Here, if a powerful barlike permanent magnet 8 is placed under an anode 7 serving also as a hearth and a strong magnetic field is created locally by the same, the beams 14 can be bent and at the same time the beams can be converged to the hearth 7. Permanent magnets 13 are disposed near the wall of the vessel to create locally strong magnetic fields, whereby the losses of plasma on the wall of the vessel are reduced.
Patent JP-H0619676-A (JP)
Title: Picture display device
Inventor: HAMADA TAKASHI
IPC: G06T1/60
Filed: 1992-06-30
Abstract: PURPOSE:To realize the display corresponding to the interactive high-speed picture editing processing in work stations or the like. CONSTITUTION:The picture display device is provided with a picture processing section 2 having two-system memory access paths. A display memory 3 and a picture memory 4 are provided on respective memory access paths of the section 2. Thus, the access to the source picture and the access to the destination picture can be performed independently, and the display corresponding to the interactive high-speed picture editing processing can be realized.
Patent JP-S6416548-A (JP)
Title: Pie confectionary
Inventor: TAKEUMA KAZUO
IPC: A21D8/06
Filed: 1987-07-10
Abstract: PURPOSE: To provide plain, aromatic and crispy pie pastry provided with a new taste further formed by holding molded pie dough by two heating plates and baking it. CONSTITUTION: The pie dough 6 for which strong flour, soft flour almond powder, common salt, butter and water, for instance, are mixed and molded is held between the heating plate 3 on a lower side provided with a partition wall 1 and a vent 2 and the heating plate 5 on an upper side provided with the vent 4 and baked for two minutes at 200 deg.C and the objective pastry is obtained.
Patent JP-H1113359-A (JP)
Title: Fireproof glass plate
Inventor: MURAKAMI TAKAHIRO
IPC: E06B5/16
Filed: 1997-06-27
Abstract: PROBLEM TO BE SOLVED: To reduce cost, and to improve optical quality by installing a resin increasing edge strength at the edge section of a glass plate. SOLUTION: The glass plate resists stress generated at the time of the generation of a fire by mounting a resin increasing edge strength at the edge section of the glass plate, and fire protecting performance is displayed without the breaking of the glass plate. A soda-lime glass plate, a borosilicate glass plate, a glass plate obtained by tempering and working these glass plates or the like is used as the glass plate. A material improving the strength of the edge section is preferable as the resin set up to the edge section, and a silicone resin is, for example, employed preferably.  Since the strength of the edge section is increased by applying the resin, cost can be reduced because special beveling which has been executed in a conventional fireproof glass plate is made unnecessary, or optical quality can be enhanced because heat treatment is made unnecessary or dependency to heat treatment can be decreased.
Patent JP-S5895268-A (JP)
Inventor: BUERUNAA HEENE
IPC: G01R19/25
Filed: 1982-09-30
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0837400-A (JP)
Title: Clip attaching jig
Inventor: HOSODA TADAYUKI
IPC: H05K13/06
Filed: 1994-07-25
Abstract: PURPOSE:To provide a chip attaching jig that enables a wire harness to be easily removed from a wiring rack without hindering the removal. CONSTITUTION:A chip attaching jig for attaching a clip 27 for the attachment of a body at the predetermined position of a wire harness W that is wire harnessed on a wiring rack comprises a socket jig body 25 fixed on a wiring rack 1 and a clip socket part 29 that is supported by the socket jig body 25. The clip socket part 29 is provided turnably between a clip attaching position where the clip 27 is positioned near the wire harness and a wire harness removing position where the wire harness is moved off the removal path through which the wire harness the wire harness from the wiring rack removed from the wiring rack.
Patent JP-H112573-A (JP)
Title: Method and device for compensating age-based error of force detector
Inventor: SON KENSHIN
IPC: G01D3/00
Filed: 1997-06-13
Abstract: PROBLEM TO BE SOLVED: To enable high-accuracy metering even in the case of continuously metering plural times by compensating a creep error of a metering signal and a creep recovery error. SOLUTION: A metering unit 1 converts displacement δ(t) corresponding to the load produced in a metering table by deflection of a deflective body 50 to an analog metering signal f(t) by a displacement signal converting unit 3. This is converted to a digital metering signal f(nt) by an A/D converter 4. When it is discriminated by a signal discriminator 11 in a compensating device 10 that the metering signal f(nt) includes a creep error, a compensating operation device 12 operates an inverse transfer function H1 (Z) of a transfer function G1 (Z) for generating the metering signal f(nT), and an accurate metering signal y(nT) where a creep error is compensated is output. When it is discriminated that a creep recovery error is included, similarly that creep recovery error is compensated to output an accurate metering signal y(nT) showing no load.  Thus, the creep recovery error is removed so that the next material to be metered can be accurately metered after the creep error is compensated.
Patent JP-S5980966-A (JP)
Inventor: PIEERU BURANSHIYAARU
IPC: H01L31/0216
Filed: 1983-09-19
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H1173799-A (JP)
Title: Semiconductor memory device
Inventor: NAGATOMO MASAHIKO
IPC: G11C29/24
Filed: 1998-06-19
Abstract: PROBLEM TO BE SOLVED: To detect the short conditions between neighboring word lines or bit lines by providing testing memory cell arrays composed of plural testing memory cells installed for each main bit line and testing word lines that simultaneously select this memory cell. SOLUTION: The bit line testing memory cell array 120 is provided with bit line testing memory cells BM(0)-BM(n) composed from n+1 MOS transistors and the gate of each transistor is connected to respective bit line testing word lines WLET. The drains corresponding to odd number memory cells are connected to the main bit lines and the drains for even number memory cells are floating. By the input of a testing signal WSBT, the odd number bit lines become conducting to be brought to a low level and even number bit lines reach a high level. When short exists between neighboring bit lines, these bit lines are brought to a low level.
Patent JP-H0724174-A (JP)
Title: Detecting device for bobbin case installed state in sewing machine
Inventor: TAKASE AKIO
IPC: D05B57/26
Filed: 1993-07-13
Abstract: PURPOSE:To provide a detecting device for an installed state of a bobbin case, which can detect surely whether the bobbin case is installed in a proper state with respect to a shuttle of the sewing machine or not. CONSTITUTION:In the sewing machine constituted so that a bobbin case supplied to an opposed position to a sewing machine shuttle 1 is installed in the sewing machine shuttle by pressing it by a carrier shaft 21, a probe 26 is provided so as to be opposed to a supporting shaft 4 provided projectingly in the sewing machine shuttle 1 in the carrier shaft 21, and an electrical circuit is formed by this probe, the sewing machine shuttle, a sewing machine frame and a power source E. Moreover, this device is constituted so that this electrical circuit becomes a closed circuit by joining the probe 26 and the supporting shaft, and also, whether or not a current flowing to the prove 26 or the sewing machine frame exists is detected by a current detecting means D3.
Patent JP-H11851-A (JP)
Title: Tool breakage detecting device
Inventor: YAMAMOTO NOBORU
IPC: B23Q11/00
Filed: 1997-06-13
Abstract: PROBLEM TO BE SOLVED: To detect the breakage of a tool in a short time by eliminating the transfer of a tool length to a numerical controller. SOLUTION: A tool breakage detecting device 12 mounted on and used for a machining center controlled by a numerical controller 6 has a communication line 26 connected to the numerical controller 6 for a machine tool, a tool length measuring means to measure the tool lengths L of a tool before and after mounted on the spindle of the machine tool and used for machining, a breakage judgement part 20 to compute a difference between the tool lengths before and after machining from the tool lengths measured by the tool length measuring means, before and after used for machining, and to output a breakage signal S4, if the difference between the tool lengths is equal to a preset value or more, and a communication control part 21 to output the breakage signal from the breakage judgement part 20 to the communication line 26.
Patent JP-H117800-A (JP)
Title: Semiconductor device and its monitoring burn-in method
Inventor: SAITO MIKIO
IPC: G06F11/34
Filed: 1997-06-13
Abstract: PROBLEM TO BE SOLVED: To obtain a monitoring burn-in method in which an instruction stored in a built-in read-only memory(ROM) is executed during a burn-in test(BT), in which the whole content of the built-in ROM is swept out to one terminal, in which more integrated circuits (IC's) are tested by one test, and in which the content of the built-in ROM is monitored and checked during the BT. SOLUTION: A program counter(PC) 107 is fixed to a simple increment operation by a test-mode signal 103. The read operation of instructions is executed sequentially from the front address of a ROM 110. At the same time, they are fetched to a bit selection circuit 114, and bits are selected properly so as to be swept out to a terminal 119. When the address of the ROM 110 to be read out and the bits selected by the bit selection circuit 114 are combined, the whole content of the ROM 110 can be swept out to the terminal 119. During a BT, the content which is swept out is collated with an expected value which is prepared in advance, and whether the content of the ROM 110 is corrected or not is checked.
Patent JP-H0817905-A (JP)
Title: Auxiliary jig for inserting and extracting wafers
Inventor: TAKAYAMA KATSUYOSHI
IPC: H01L21/673
Filed: 1994-07-04
Abstract: PURPOSE:To extend trenches a little upward in the inner surface of a carrier, by digging the trenches having the direction and the pitch which coincide with those of trenches in the main side surface of the carrier main body. CONSTITUTION:The jig has a trunk part constituted of a lower end portion 3 along the form of an aperture of a carrier main body 7, a main trunk part 5 reaching an upper end portion 2 from the lower end portion 3, and a side trunk part 5. The form is a ring which coincides with the upper form of the carrier main body. Trenches 4 whose pitch and direction coincide with those of wafer retaining trenches 4 inside the main side surface are made in the inner wall of the main trunk part 5 positioned on the main side surface 11 of the carrier main body 7. Thereby the action wherein the trenches in the carrier are stretched a little upward is obtained. Fixing mechanism to the carrier is not specially provided, but the jig is only mounted on the carrier main body. The height of the trunk part of the jig is about 1/3 the diameter of a wafer to be accommodated. When the interval between the peaks of the trenches 4 is reduced, swing of the wafer can be regulated, and workability is improved.
Patent JP-S5797638-A (JP)
Title: Substrate for test of semiconductor chip
Inventor: YABE KATSUMI
IPC: G01R1/073
Filed: 1980-12-10
Abstract: PURPOSE:To enable to make matching of characteristic impedance on the cable side and on the substrate side of a substrate for test of semiconductor chip when signal lines of the cable are to be connected to conductor patterns on the surface of the ceramic substrate and an earth line of the cable is to be connected to an earth layer on the back of the substrate by a method wherein permittivity and size thereof are regulated. CONSTITUTION:A window 16 is formed in an alumina substrate material (green sheet) 17 being not yet sintered, and pads 13 corresponding to input/output pads of a glass substrate to be received in the window 16, input/output terminals 12 to be connected to a tester, conductor patterns 11 to connect the pads 13 and the terminals 12 radially are provided. Then the green sheets are laminated and are sintered to form the ceramic substrate 10, and characteristic impedance thereof is controlled by regulating breadth of the pattern conductors 11 and the thickness of the green sheets 17.