Patent SG-11201807643Q-A (SG)
Title: Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
Inventor: NEOH DIN-GHEE
IPC: H01L21/48
Filed: 2017-03-10
Abstract: 00 300 lap 110 10 140 170 W O 20 17 / 15 35 90 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/153590 Al 14 September 2017 (14.09.2017) WIPO I PCT 111111111111110111011111111111010111110 0111101101111111111101111111111111110111111 (51) International Patent Classification: H01L 23/495 (2006.01) C23C 18/54 (2006.01) H01L 21/48 (2006.01) H01L 23/31 (2006.01) C25D 5/02 (2006.01) C25D 3/46 (2006.01) C25D 5/34 (2006.01) C23C 18/18 (2006.01) C25D 5/48 (2006.01) C23C 18/42 (2006.01) C23C 18/16 (2006.01) (21) International Application Number: PCT/EP2017/055726 (22) International Filing Date: 10 March 2017 (10.03.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 16159880.0 11 March 2016 (11.03.2016) EP (71) Applicant: ATOTECH DEUTSCHLAND GMBH [DE/DE]; ErasmusstraBe 20, 10553 Berlin (DE). (72) Inventors: NEOH, Din-Ghee; c/o Atotech Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 Ber- lin (DE). BARTHELMES, Jurgen; c/o Atotech Deutsch- land GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). (74) Agent: SCHULZ, Hendrik; c/o Atotech Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 Ber- lin (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) (54) Title: LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME Fi g.1 (57) : In order to provide a more reliable and cost-efficient way of producing lead-frames or lead- frames structures which expose treated silver surfaces as well as to provide surface mount electronic devices using such lead-frames or lead-frames struc - tures, a method comprising the following method steps carried out in this order is provided: (a) providing a lead-frame body struc - ture having two main sides, said lead-frame body structure exclusively exposing a copper surface on each one of said main sides; (b) depositing a silver coating on at least one of said main sides, so that said at least one of said main sides at least partially exposes an untreated silver surface; and (c) electrolytically treating said untreated silver surface on said at least one of said main sides generated in method step (b) with a treatment solution containing at least one hydroxide compound selected from alkali metal hydroxides, al- kaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead-frame body structure is a cathode, thereby producing a lead-frame structure which comprises at least two lead-frame entities each one having two faces and at least par - tially exposing said treated silver surface; wherein said at least one of said two faces of at least one of said lead-frame entities either exclusively exposes said treated silver surface or wherein said at least one of said two faces of said at least one of said lead-frame en- tities partially exposes said treated silver surface and partially exposes said copper surface, wherein, on each one of said two faces of each one of said lead-frame entities which partially exposes said treated silver surface, the area of said copper surface is smaller than the area of said treated silver surface.