baber/WOPTO huggingface dataset:
Patent TW-364185-B (TW)
Title: Process for dual metal damascene of single mask using phase shift mask
Inventor: DAI CHANG-MING
IPC: H01L21/768
Filed: 1998-03-13
Granted: 1999-07-11
Abstract: A method of using phase shift mask in combination with single photoresist process to form dual damascene pattern is disclosed. First, a completely opaque region, completely transparent region and semi-transparent region of a phase shift metal mask are formed on a quartz substrate. For a dual damascene pattern, completely transparent region is the window pattern, and semi-transparent region is lead pattern. Then, a dual damascene structure is formed by using a phase shift mask, comprising by forming a photoresist on a silicon substrate having three insulating layers, the window pattern and lead pattern are simultaneously formed on the photoresist through phase shift mask, then, these patterns are continuously transferred to the top and bottom of the insulating layers by way of etching. After a vertical window of local interconnection and a lead trench are formed, metal is deposited on the patterns. Then, excess metals on the surface of insulating layers are removed by using chemical mechanical polishing to form the dual damascene structure.
Patent TW-450941-B (TW)
Title: Process for the preparation of an ultrapure solution of hydrogen peroxide by ion exchange with recycling
Inventor: DEVOS CHRISTINE
IPC: B01J47/02
Filed: 1998-05-21
Granted: 2001-08-21
Abstract: Process for the preparation of an ultrapure hydrogen peroxide solution, characterized in that it comprises at least one sequence which includes passing the solution to be purified through successively at least one bed of anion-exchange adsorbents (AEA) and at least one bed of cation-exchange adsorbents (CEA) and characterized in that a non-zero proportion of the solution exiting from a bed is recycled either upstream of this bed or upstream of one of the preceding beds or upstream of the first bed of the first passing sequence. Plant for the implementation of the process.
Patent TW-430599-B (TW)
Title: Removable memory device to store robotic application and configuration data
Inventor: BEAULIEU DAVID R
IPC: B25J9/16
Filed: 1998-06-12
Granted: 2001-04-21
Abstract: Operating and configuration parameters of a robot drive at an installation location are stored in an easily removable storage device on the drive or nearby so that special data, such as that associated with arm design and system layout, including taught stations, can remain associated with the robot drive and installation whereby the drive system can be installed or replaced in minimal time since the storage device does not need reprogramming. This removable storage device, in the form of a static memory or Master Key, may be embodied by a Dallas Key or E Prom or the like, and be affixed to the robot body or off board nearby. It may store arm design parameters, programmed while on the robot body or off-line, and becomes a unique part structured for manufacturing with respect to the arm set design. Further, nominal system layout parameters can be prestored in the Key, so that when this Key is affixed to the robot drive, the robot automatically has the information regarding both arm design and system layout, which will help avoid collisions and provide a starting point for the fine teaching of the transfer stations. Additionally, the fine location parameters for each transfer station may be stored in the Key when the robot is installed, so that the Key contains all the information needed to make a robot unique to a unique system. Thus, when a robot drive is replaced, by affixing the original Key to the new robot or nearby, it will assume all of the parameters of the initial robot.
Patent TW-442374-B (TW)
Title: Apparatus for producing a melt-extruded article composed of a conductive polymer and method of making an article composed of a conductive polymer
Inventor: CHU EDWARD F
IPC: B29C48/38
Filed: 1998-10-01
Granted: 2001-06-23
Abstract: Processes and apparatus for melt extrusion of polymeric compositions, particularly conductive polymers, in which a gear pump delivers molten polymeric composition to an extrusion orifice. Overfeeding of the composition due to pressure variations is avoided by means of a polymer relief means, preferably a second, smaller gear pump, which removes a portion of the molten composition when the pressure exceeds a selected level.
Patent TW-524873-B (TW)
Title: Improved substrate supporting apparatus and processing chamber
Inventor: SHERSTINSKY SEMYON
IPC: H01L21/683
Filed: 1998-07-27
Granted: 2003-03-21
Abstract: A support member for supporting a substrate in a process chamber, the support member having an upper surface 32, an outer raised portion 40 of the upper surface extends about its periphery and defines an inner, recessed portion 42 of the upper surface. A plurality of raised support areas are disposed within the inner recessed portion 42. Thus, a substrate 20 placed upon the upper surface 32 rests upon the outer, raised portion and the support areas in spaced relation to the inner, recessed areas creating a cavity between the substrate 20 and the inner, recessed portion 42. A vacuum supply 50 in fluid communication with the inner, recessed portion 42 supplies a vacuum thereto creating a pressure differential between the cavity and the process chamber housing the support member. Thereby, the substrate is chucked to the support member. The transitions from the raised portions to the recessed portions are tapered to eliminate the formation of ridges of material on the upper surface.
Patent TW-426758-B (TW)
Title: Heat shield assembly and method of growing vacancy rich single crystal silicon
Inventor: KIM KYONG-MIN
IPC: C30B15/00
Filed: 1998-08-19
Granted: 2001-03-21
Abstract: A heat shield assembly is used in a Czochralski crystal puller for selectively shielding a monocrystalline ingot of semiconductor material to control the type and number density of agglomerated defects in the crystal structure of the ingot. The heat shield assembly has an upper heat shield connected to a lower heat shield. The upper and lower heat shields are connected to each other and slidingly connected to an intermediate heat shield. The lower heat shield is able to telescope up into the intermediate heat shield to minimize the profile of the heat shield assembly located within a crystal growth chamber of the crystal puller. However when needed to control formation of the monocrystalline ingot, the lower heat shield may be extended from the intermediate heat shield and project downwardly into the crystal puller crucible in close proximity to an upper surface of molten semiconductor source material in the crucible. A method employing the heat shield assembly is also disclosed.
Patent TW-405158-B (TW)
Title: Plating apparatus for semiconductor wafer processing
Inventor: HONGO AKIHISA
IPC: H01L21/768
Filed: 1998-09-16
Granted: 2000-09-11
Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit being combined into a single unitary arrangement.
Patent TW-434898-B (TW)
Title: Method of forming a semiconductor image sensor and structure
Inventor: GUIDASH ROBERT M
IPC: H01L21/265
Filed: 1998-10-21
Granted: 2001-05-16
Abstract: An image sensor (10) has an image sensing element that includes an N-type conducting region (26) and a P-type pinned layer (37). The two regions form two P-N junctions at different depths that increase the efficiency of charge carrier collection at different frequencies of light. The conducting region (26) is formed by an angle implant that ensures that a portion of the conducting region (26) can function as a source of an MOS transistor (32).
Patent TW-402753-B (TW)
Title: Mask blank and method of producing mask
Inventor: HIEDA KATSUHIKO
IPC: G03F1/00
Filed: 1998-11-25
Granted: 2000-08-21
Abstract: A shading film (13) of chrome is formed entirely on one surface of a circular substrate (12) of quartz. The substrate (12) is rotated and resist is applied to the shading film (13). Since the substrate (12) is shaped in a circle, the resist spreads uniformly on the entire surface of the shading film (13) by the centrifugal force. Therefore, the resist has a substantially uniform film thickness over almost the entire surface of the shading film (13). This resist is patterned to form a resist pattern. By etching the shading film (13) with the resist pattern used as a mask, a pattern preferable in accuracy of dimensions can be formed.
Patent TW-409264-B (TW)
Title: Method for manufacturing resistors
Inventor: YAMADA HIROYUKI
IPC: H01C17/06
Filed: 1999-01-08
Granted: 2000-10-21
Abstract: A method for manufacturing resistors comprising the steps of forming a top electrode layer on a top face of a substrate, a resistance pattern connected to the top electrode layer, a protective layer covering the resistance pattern, a thin metal film side electrode layer on a side face of the substrate which is electrically connected to the top electrode layer, and a concavity by removing a part of the side electrode layer and substrate.
Patent TW-401725-B (TW)
Title: Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
Inventor: TAKE MORIO
IPC: H05K1/00
Filed: 1999-01-28
Granted: 2000-08-11
Abstract: A semiconductor plastic package having a structure in which a metal sheet having a size nearly equal to the size of a printed wiring board is disposed nearly in the middle of the thickness direction of the printed wiring board, at least one semiconductor chip is fixed on one surface of the printed wiring board with a thermally conductive adhesive, the metal sheet is insulated from circuits on the front and reverse surfaces of the printed wiring board with a thermosetting resin composition, a circuit conductor formed on the surface of the printed wiring board and the semiconductor chip are connected with each other by wire bonding, a signal propagation circuit conductor on the surface of the printed wiring board and a circuit conductor formed on the reverse surface of the printed wiring board or a circuit conductor pad formed for connection to an external portion of said package with solder balls are at least connected with a through hole conductor insulated from the metal sheet with a resin composition, at least one through hole forms a direct junction with the metal sheet disposed as an inner layer, and at least the semiconductor chip, the bonding wire and the bonding pad are encapsulated, wherein a plurality of protrusions having the form of a cone or a frustum of a cone each are formed on that portion of at least one surface of the metal sheet which is within an area where the semiconductor chip is mounted, and tops of said metal protrusion are in contact with the thermally conductive adhesive or a metal foil.
Patent TW-474868-B (TW)
Title: Absorbent materials for distributing aqueous liquids
Inventor: DESMARAIS THOMAS ALLEN
IPC: C08F2/32
Filed: 1999-09-09
Granted: 2002-02-01
Abstract: Disclosed are materials capable of distributing and releasing aqueous fluids, e.g., urine, to a storage material. These fluid distribution materials have: (A) a ratio of capillary desorption height (i.e., height at 50% capacity) to capillary absorption height (i.e., height at 50% capacity) of not more than about 1.8:1; (B) a capillary desorption height of not more than about 50 cm; (C) the ability to wick synthetic urine at 31 DEG C to a height of 15 cm in not more than about 25 minutes; and (D) a vertical wicking capacity at 15 cm of at least about 6 g/g. Also disclosed are absorbent articles comprising such a distribution material. These absorbent articles, which are especially suitable for absorbing and retaining aqueous body fluids, comprise: (I) a backing sheet; (II) an absorbent core associated with the backing sheet such that the absorbent core is positioned between the backing sheet and the fluid discharge region of the wearer of the article, the absorbent core comprising a distribution material of the present invention; and (III) optionally, a topsheet positioned such that the absorbent core is located between the backing sheet and the topsheet.
Patent TW-420911-B (TW)
Title: Mixed mode transceiver digital control network and collision-free communication method
Inventor: HUANG GENT
IPC: H04B3/54
Filed: 1999-03-15
Granted: 2001-02-01
Abstract: A mixed mode transceiver digital control network system is disclosed as including at least two nodes/transceivers connected with a DC power source and a cored inductor via a bus, in which each transceiver includes a current mode transmitter and a voltage mode receiver. A bi-directional voltage clamp is connected in parallel to the cored inductor. Electric current from the DC power source flows through the cored inductor and the bi-directional clamp into the bus. By reason of the flow of the electric current through the voltage clamp, a electric voltage pulse is generated and transmitted into the bus. The electric voltage pulse so transmitted into the bus is received by the voltage mode receiver and subsequently inputted into a micro-controller or processor of the node. There is also disclosed a method of setting one of a plurality of priority levels to each node forming the system, so that a node to which a higher priority level has a higher chance of transmitting its data packets. There is further disclosed a method of avoiding collision when two or more nodes/transceivers transmit their respective data packets at the same time.
Patent TW-445428-B (TW)
Title: Merged sorting apparatus with comparison nodes connected in tournament tree shape
Inventor: AZUMA SHINSUKE
IPC: G06F7/24
Filed: 1999-06-04
Granted: 2001-07-11
Abstract: A merged sorting apparatus comprises a comparison tournament circuit including comparison nodes, and a comparison control circuit for supplying to the corresponding comparison nodes validity flag information concerning the input data to each of the comparison nodes determined based on comparison results from the comparison nodes. The comparison control circuit comprises comparison result registers for retaining the comparison results, validity flag registers for retaining the validity flag information, and merge member registers for retaining information as to whether or not the input data to each of the input registers corresponding to respective path ways should be the object of comparison in the following data comparison processing. With this arrangement, contending readouts of record arrays from a memory can be reduced and the necessity to initialize each register is eliminated, thereby speeding merged sorting.
Patent TW-429446-B (TW)
Title: Fabricating method of gate
Inventor: LI DUNG-SHING
IPC: H01L21/28
Filed: 1999-08-03
Granted: 2001-04-11
Abstract: This invention is about the fabricating method of gate. In this method, spacer is formed on sidewall of the virtual gate after the virtual gate is formed on the substrate. The insulation layer which is at the same level as the upper surface of virtual gate is formed on the other regions. After that, the virtual gate is stripped off and an opening is formed in this region. The conformal conduction layer is formed in the opening. This U-shaped conduction layer is the gate such that the surface area of gate can be increased. After stripping off the insulation layer, the self-aligned metal silicide process is then performed.
Patent TW-435042-B (TW)
Title: Circuit for compensating a brightness level of a video display apparatus
Inventor: BANG JEONG-KO
IPC: H04N5/57
Filed: 1999-09-22
Granted: 2001-05-16
Abstract: A circuit for compensating a brightness level of a video display apparatus capable of simplifying a circuit configuration and reducing a cost of production by placing a brightness level compensation circuit for the video display apparatus is disclosed. Microprocessor memorizes a predetermined data for a brightness level compensation and outputs a data signal and a clock signal based on the data for the brightness level compensation. Video pre-amplifier receives a video signal and horizontal/vertical fly-back pulse signals from an outside and compensates a contrast level and a brightness level of the video signal in accordance with the data signal and the clock signal to output a compensated video signal. Accordingly, the design of the brightness level compensation circuit is simplified and the size of the printed circuit board is reduced. In addition, the cost of production decreases and the productivity of products increases by reducing a number of components of the brightness level compensation circuit.
Patent TW-457335-B (TW)
Title: Insulative shield, particularly for automotive exhaust components
Inventor: FELDMAN RUBIN
IPC: B01D53/94
Filed: 1999-10-08
Granted: 2001-10-01
Abstract: A heat shield (1) for an exhaust system (10) of a vehicle includes a resinified spaced layer fabric (20) having at least one inner layer (21), at least one outer layer (22), and at least one spacer (23) between the inner layer or layers and the outer layer or layers to form one or more insulative spaces. The heat shield includes an emissivity reducing material. The insulative space is between about one and about eight millimeters thick, to reduce convective heat transfer.
Patent TW-422688-B (TW)
Title: Measuring method of hair total quality parameters
Inventor: AMORNSIRIPANITCH SOMNUK
IPC: A61B5/107
Filed: 1999-10-12
Granted: 2001-02-21
Abstract: A hair quality measuring method which measures the density, size, and length of hair in a designated area. The equipment includes one enlarging CCD camera for catching the picture of hair; one vision catching device to save the picture from the camera; one calculating software and hardware for saving and measuring the length and size of each hair piece, that including specific software to do the statistic analysis from the data obtained from the above method. This invention includes a dyeing technology and a few key steps for measuring every stage of hair growing cycle. Finally, we can get the statistic data of the ratio of growing hairs to non-growing hairs of average hair growth rate and all the other data such as the maximum and minimum growth rate, standard error, and deviation, etc.It can prove and collect the in-and-out stop stage of the hair number, hair growing time from an empty follicular unit, and the total time of a growing hair until it stops growing. Then such information can give a conclusion of the hair quality of the designated area roughly related to the hair density, hair diameter, growth rate, and total growing time and length. This invention can extend the comparison of the data of the measured area or person to know and unknown control factors. Similar applications can be used to observe the influence of many subjects, such as food, medicine, special activity or hobby and product and so on to obtain a conclusion or suggestion of positive or passive effect to the hair.
Patent TW-451194-B (TW)
Title: Memory data bus architecture and method of configuring multi-wide word memories
Inventor: PANTELAKIS DIMITRIS C
IPC: G11C7/10
Filed: 1999-12-03
Granted: 2001-08-21
Abstract: A memory device (50) contains a first array of memory (12) and a second array of memory (14). The arrays (12 and 14) are coupled to four segmented current data buses (iGDLs) (16, 18, 20, and 22). When in a x36 word mode of operation, the current data buses (16, 18, 20, and 22) are wired to communicate directly with output buffers (56-59) through several current-to-voltage converters (24-31). When in a x18 word mode of operation, the current data buses (16, 18, 20, and 22) are wired to communicate through the converts (24-31), through a voltage bus (52 and 54, see also FIG. 3), to the output buffers (56-59). The change in wiring for x36 word mode versus x18 word mode is done either by a top-level metal option in fabrication or by user software programming whereby the device (50) is easily wired into one of two configurations while maintaining an advantageous speed/power product.
Patent TW-437062-B (TW)
Title: Manufacturing method for DRAM
Inventor: LI JENG-HUNG
IPC: H01L27/10
Filed: 1999-12-08
Granted: 2001-05-28
Abstract: A manufacturing method for DRAM comprises firstly forming a conductive layer and a barrier on the substrate having shallow trench isolation structure and active region definition; and, forming a bit line contact and the node contact to expose part of the active region and the shallow trench; also,defining the portion of the word line on the active region; after forming the source/drain in the active region, forming the bit line plug in the bit line contact and forming the landing pad in the node contact; after forming the oxide on the surface of the bit line plug and the landing pad, conducting the word line definition process to completely define the word line structure; then, sequentially forming a first dielectric, a bit line structure connected with the bit line plug, a second dielectric and a capacitor connected with the landing pad.
Patent TW-454111-B (TW)
Title: Boost converter with reduced switching loss
Inventor: SYMONDS NEIL S
IPC: H02M3/156
Filed: 1999-12-21
Granted: 2001-09-11
Abstract: A low power loss boost converter of the discontinuous conduction type includes an inductor coupled between the boost converter input and a junction, a current rectifier coupled between the junction and the converter output, a switch coupled between the junction and common, and switch capacitor coupled in parallel with the switch the inductor and an energy storage capacitance associated with the input. The switch is alternately opened and closed in switching cycles which alternately energize the inductor and transfer the energy to the output load. Power losses are reduced by providing switch closure at a near zero voltage and current switch conditions produced by a circuit resonance. The capacitor reduces voltage across the switch during the switch open transient condition.
Patent TW-421694-B (TW)
Title: Sheet shutter
Inventor: IWASAKI HIROSHI
IPC: E06B9/17
Filed: 2000-02-14
Granted: 2001-02-11
Abstract: This is an invention of a sheet shutter which can cope with overloading by the flexible mechanism that allow the ends of shutters to detach from the rail while overloading and easily be relocated back to rail. The sheet shutter includes: sheet-like shutters (4), numerous guiding blocks (13) vertically arranged at intervals along the shutter widthwise, and flexible guiding rails (5) erected at both right and left sides of room door available for the guiding block (13) to go upward and downward. The guiding rails (5) will deform to allow the guiding block (13) to detach from the guiding rails (5) when the shutter is overloaded.