baber/WOPTO huggingface dataset:
Patent JP-2010084498-A (JP)
Title: Support structure of drainage vertical pipe
Inventor: NAKAMURA KOJI
IPC: E03C1/122
Filed: 2008-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a support structure of a drainage vertical pipe, which allows easy fixation of the drainage vertical pipe to the lower surface of a slab with good working efficiency, and which can be easily manufactured.  <P>SOLUTION: The support structure includes a pair of supports 3 and 3 which holds the drainage vertical pipe 2 from both sides; a clip 4 which is engaged with both the supports 3 and 3 with the pipe 2 being held by the support bodies 3 and 3 to retain the holding state; and a substantially bar-like suspension tool 6 mounted on the lower surface of the slab 5 to be suspended, and the lower part of which is connected to the support 3.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010092116-A (JP)
Title: Content visualization device and content visualization method
Inventor: KOMAKI AKINORI
IPC: G06F3/048
Filed: 2008-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a content visualization device for visualizing the relevance ratio among contents.  <P>SOLUTION: This content visualization device classifies and calculates a plurality of content operation histories for each content from the event information (content utilization time, access number of times, mouse/keyboard utilization number of times, or the like) of applications or OS generated, when a user operates content; integrates the content operation history in content whose operation types are different; calculates the integrated operation ratio (utilization quantity of content) for all the content; dynamically calculates the relevance ratios among the content from the proximity of the operation quantity in each content by using the operation ratio and the proximity of time accessed to the content, and visualizes the relevance ratios among the contents.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010015121-A (JP)
Title: Cmos compatible integrated dielectric optical waveguide coupler and fabrication method
Inventor: ASSEFA SOLOMON
IPC: G02B6/13
Filed: 2008-10-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a CMOS compatible integrated dielectric optical waveguide coupler and a fabrication method therefor.  <P>SOLUTION: An optoelectronic circuit fabrication method and an integrated circuit manufacturing apparatus fabricated therewith are provided. Integrated circuits are fabricated with an integral optical coupling transition to efficiently couple optical energy from an optical fiber to an integrated optical waveguide on the integrated circuit. Layers of specific materials are deposited onto a semiconductor circuit to support etching of a trench to receive an optical coupler that performs proper impedance matching between an optical fiber and an on-circuit optical waveguide that extends part way into the transition channel. A silicon based dielectric that includes at least a portion with an refractive index substantially equal to a section of the optical fiber is deposited into the etched trench to create the optical coupler. Silicon based dielectrics with graded indices are also able to be used. Chemical mechanical polishing is used to finalize preparation of the optical transition and integrated circuit.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010092362-A (JP)
Title: Monitoring system and information providing method
Inventor: YANO KAZUNORI
IPC: G06Q50/16
Filed: 2008-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a monitoring system, which can continuously provide, to the outside, information created on the basis of measurement data of various devices in a facility, in response to a request from the outside of the facility such as a building.  <P>SOLUTION: In the monitoring system 10 having a server 21 capable of providing information via a network 30, in response to a request from a computer 31 via the network 30, the server 21 extracts measurement data accumulated in a database 16 of a system 10 to creates information in a designated format and provides the created information. At that time, the server 21 stores the created information, and if the information can be reused as subsequently requested information, executes information processing treatment of the stored information and provides the resultant.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010093165-A (JP)
Title: Manufacturing method of electrode, and thin film transistor element and organic electroluminescent element using the same
Inventor: KOFUCHI REIKO
IPC: H01L21/288
Filed: 2008-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a transparent conductive film which has a lower resistance than before and a sufficient surface smoothness in a method for forming a gate electrode by applying a fluid material containing transparent conductive particulate.  <P>SOLUTION: A thin film 104" containing metal oxide particulate (indium tin oxide) and a metal oxide precursor is applied onto a glass substrate 106. By irradiating the thin film with microwaves, the precursor serves as a heating element and it is baked so that a conductive thin film is formed. This film is patterned to be a gate electrode 104. Then, a gate insulating film 105 is formed and a semiconductor precursor is applied to it and it is then dried, so that a semiconductor precursor material thin film 101' is obtained. By irradiating it with microwaves, the gate electrode generates heat and the semiconductor precursor material thin film is heated accordingly and is converted to an oxide semiconductor film, so that a semiconductor layer 101 is formed. By evaporation of gold through a mask, source/drain electrodes 102, 103 are formed and thus a thin film transistor is obtained.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010093214-A (JP)
Title: Solid-state imaging element, imaging device, and image signal processing system
Inventor: OGASAWARA HIDEHIKO
IPC: H04N5/378
Filed: 2008-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To reduce reflection of a signal under an influence of mismatching etc., of characteristic impedance and to achieve signal transmission with small signal deterioration when a transmission line for signals is simplified and signals are communicated at a high speed.  <P>SOLUTION: A first circuit portion 103 is provided on a predetermined surface of a substrate 102, a second circuit portion 104 is provided on the opposite surface of the substrate 102 from the predetermined surface, and the first circuit portion 103 and second circuit portion 104 are connected through a connection electrode 10 provided in the substrate 102 and made of the same material. Consequently, a transmission line between the first circuit portion 103 and second circuit portion 104 is made shorter than before, and when signals are communicated at a high speed, reflection of signals under an influence of mismatching etc., of characteristic impedance is reducible to achieve signal transmission with small signal deterioration.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010063864-A (JP)
Title: Tool for supporting conveyance
Inventor: MATSUTANI TOKO
IPC: A45C13/38
Filed: 2008-09-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tool for supporting conveyance in which transportation for broad, long length, and weight things like a surfboard can be easily carried out in a state of holding under one's arm by a rod and a shoulder string, and load by goods can be supported by dispersion.  <P>SOLUTION: In the tool for supporting conveyance, the rod which has a suitable length to the length of a conveyance object and the shoulder string connected with both the ends of the rod are prepared, the shoulder string hung on the hand, with which the rod is held, and the shoulder is slackened between the hand and the body, and transportation is carried out by putting the goods on the sag part.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010094867-A (JP)
Title: Injection molding die for cylindrical molding, injection molding method, and molding
Inventor: HATANO SHIGERU
IPC: B29C45/26
Filed: 2008-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an injection molding die capable of obtaining a cylindrical molding with satisfactory dimensional precision.  <P>SOLUTION: This injection molding die has a fixed side molding die and a movable side molding die, at least one of the fixed side molding die and the movable side molding die has a core pin for forming an inner face of a molding, and a full length of the core pin is 10-80% of a thickness of the molding die in a side having the core pin. The present invention provides also a molding die of which the core pin is constituted of a material having heat conductivity lower by 10-99% than a material constituting other member for forming a cavity, and also a molding die of which the core pin has a heat insulation portion.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010098487-A (JP)
Title: Harmonic removing filter
Inventor: TOMIZAWA FUMIHIRO
IPC: H01P1/212
Filed: 2008-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a harmonic removing filter that removes second and third harmonics, reduces loss of a fundamental wave and reduces a mounting space.  <P>SOLUTION: The harmonic removing filter 10 for removing second and third harmonics is inserted into one branch point in the middle of the distribution constant line pattern 4 of a main signal transmission line between a high power amplifier 1 and an output connector 5. The harmonic removing filter 10 has a first distribution constant line pattern 13 having one end connected to the distribution constant line pattern 4 and having an electric length equal to a half wavelength of the third harmonic wave, a second distribution constant line pattern 14 connected to the other end of the first distribution constant line pattern 13 and used for phase matching of the fundamental wave and double wave, and a third distribution constant line pattern 15 connected to the other end of the first distribution constant line pattern 13 and used for phase matching of the third harmonic wave. A capacitor 11 or a coil 12 is inserted into the second and third distribution constant line patterns 14 and 15.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010097805-A (JP)
Title: Ion generator
Inventor: KOTSUJI KAZUO
IPC: H01T19/04
Filed: 2008-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ion generator, capable of controlling balance between positive and negative ions by controlling positive and negative voltages to be applied to a discharge electrode by a simple circuit structure.  <P>SOLUTION: In the ion generator, the discharge electrode 3 is capacitively-coupled to the secondary side of a transformer T1 to the primary side of which alternating voltage is applied by a capacitor C1, diodes D1 and D2 are connected in parallel, and the quantities of positive and negative ions are controlled by opening and closing switches SW1 and SW2 serially connected to the diodes. A voltage shifted to the negative electrode side is applied to the discharge electrode 3 by closing the switch SW1 and opening the switch SW2, whereby negative ions are generated. Reversely, a voltage shifted to the positive electrode side is applied to the discharge electrode 3 reversely by closing the switch SW2 and opening the switch SW1, whereby positive ions are generated.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010097415-A (JP)
Title: Information processing apparatus and information processing method
Inventor: SHIMIZU TAKAYUKI
IPC: G06F3/12
Filed: 2008-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide an information processing apparatus which can display print setting candidates corresponding to printing target data and easily print the print target data by print setting desired by a user, and an information processing method.  <P>SOLUTION: The information processing apparatus configured so as to be communicable with a printer and output data of an application program to the printer includes: a means for acquiring data setting information of application data used in the application program in use; a means for setting user's print setting which is print setting desired by the user; a means for generating print setting information which can be applied to the application data on the basis of the acquired data setting information and the set user's print setting; and a means for displaying a printing icon on the application program so that the user can input a print instruction for executing the printing of the application data in accordance with the generated print setting information.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010094720-A (JP)
Title: Apparatus and method for successive molding
Inventor: ISHITA HIROSHI
IPC: B21H1/00
Filed: 2008-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for successive molding which can hold a large molding load by a molding roller and can improve the productivity of molded components.  <P>SOLUTION: An apparatus 1 for successive molding plastically deforms a component 2 to be molded to successively mold a molded component having a rotationary symmetrical shape. The apparatus 1 includes a molding roller 5 comprising one shaft part 50 disposed at a position perpendicular to a rotating shaft S1 in the component 2 to be molded, and a pair of rollers 51, 51, through which the shaft part 50 is extended along an axial line direction and which are supported rotatably and pivotably around the shaft part 50. The molding roller 5 and the component 2 to be molded are relatively rotated in such a state that the component 2 to be molded is in press contact with the rollers 51, 51.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010103133-A (JP)
Title: Wiring board and method of manufacturing the same
Inventor: SAKAGUCHI HIDEAKI
IPC: H05K1/02
Filed: 2008-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring board for preventing heat when a second electronic component of heat generation in an operation larger than that of a first electronic component generates the heat from being conducted to the first electronic component, and a method of manufacturing it.  <P>SOLUTION: The wiring board 11 includes a substrate 21 comprising a semiconductor material, a pad 28 where an electronic component 12 is mounted, a pad 29 where an electronic component 13 of the heat generation in the operation larger than that of the electronic component 12 is mounted, a through electrode 25 electrically connected to the pad 28, and a through electrode 26 electrically connected to the pad 29. The wiring board includes a heat interrupting member 32 passing through the substrate 21 at a part positioned between a first mounting area where the electronic component 12 is mounted and a second mounting area where the electronic component 13 is mounted.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010102838-A (JP)
Title: Plasma display panel
Inventor: SAWA RYOSUKE
IPC: H01J11/36
Filed: 2008-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a plasma display panel with degradation of a protective layer or a phosphor prevented through substantial removal of water remaining inside, and such impurity gas as hydrocarbon.  <P>SOLUTION: The plasma display panel is provided with a dielectric layer 4 having display electrodes consisting of scanning electrodes 2 and sustaining electrodes 3 aligned in several columns formed so as to cover the display electrodes, a front substrate 1 having a protective layer 5 formed on it, and a rear-face substrate 6 set in opposition to the front substrate 1 and having a plurality of data electrodes formed in a direction crossing the display electrodes with a discharge cell 11 formed at each crossing point. Moreover, it has a hydrogen-absorbing material 13 formed containing palladium inside with a specific surface area of 50m<SP>2</SP>/g. Impurity gas is released from the protective layer 5 or the like by discharge and is decomposed, hydrogen generated with this is absorbed by the hydrogen-absorbing material 13, so that water molecules and hydrocarbon molecules can be drastically decreased.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010100353-A (JP)
Title: Temporary lifting fixture for drum pallet
Inventor: YAMAGUCHI TAKESHI
IPC: B66F9/18
Filed: 2008-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a temporary lifting fixture for a drum pallet for temporarily lifting up the pallet where the drum is loaded, and facilitating correction of positions of the drums located at a collapse risk area.  <P>SOLUTION: Claw parts 15a, 15b to be attached to a lift bracket are provided at an attachment part 13 of the suspending fixture body 12 detachably attached to the lift bracket instead of a fork of the fork lift, and an insertion flat plate 14 protruding forward for temporarily lifting up the pallet on which the drum is loaded when the suspending fixture body 12 is attached to the lift bracket is provided on the opposite side to the attachment part 13 of the suspending fixture body 12.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010103288-A (JP)
Title: Semiconductor device, and method of manufacturing the same
Inventor: TANABE AKITO
IPC: H01L29/47
Filed: 2008-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein a carrier does not enter a gate insulating film in an impact ionization region; and to provide a method of manufacturing the same.  <P>SOLUTION: The semiconductor device includes a transistor part 22 and a diode part 23. The transistor part 22 includes a channel forming region 6 which is a first conductive type or intrinsic semiconductor region, a gate insulating film 7 which is in contact with the channel forming region 6, a gate electrode 8 for forming a channel, a drain region 4 which is a second conductive type one, is in contact with the channel forming region 6, and is supplied with a drain voltage, and a source region 5 which is a second conductive type one, is opposite to the drain region 4 through the channel forming region 6, and is supplied with a drain voltage through the channel forming region 6 when the channel is formed on the channel forming region 6. The diode part 23 is electrically connected to the source region 5, and includes a region where an impact ionization phenomenon is generated when the drain voltage is supplied to the source region 5.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010103749-A (JP)
Title: Crystal oscillator for surface mounting
Inventor: MURASE SHIGEYOSHI
IPC: H03B5/32
Filed: 2008-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a surface mounted oscillator that can measure vibration characteristics of a crystal vibrator and can be securely mounted on a set substrate without causing malfunction.  <P>SOLUTION: A crystal oscillator for surface mounting houses a crystal piece 3 and an IC chip 2 to be electrically connected to the crystal piece 3 to form an oscillation circuit into a container body 1 with a hollowed shape to be provided with a bottom wall 1a and a frame walls 1b and 1c, hermetically encloses the crystal piece 3 and the IC chip 2 by joining a cover 4 to the container body 1, and in the crystal oscillator for surface mounting, mounting terminals 7 to be electrically connected on an external bottom surface of the container body 1 by respective terminals of the IC chip 2 is formed. The crystal oscillator for surface mounting includes a crystal inspection terminal 11 which is previously formed on the external bottom surface of the container body 1 and covered or removed after vibration characteristics of the crystal piece 3 are measured.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010108953-A (JP)
Title: Semiconductor device, and method of manufacturing the same
Inventor: NOGUCHI JUNJI
IPC: H01L21/314
Filed: 2008-10-28
Abstract: <P>PROBLEM TO BE SOLVED: To make capacitance and capacitance variances less than those of a conventional air gap structure.  <P>SOLUTION: Wiring 26 containing copper as a principal component is formed on an insulating film 17 on a substrate. Then insulating films 21 and 22 for a reserver pattern and a barrier insulating film 29 are formed, and an insulating film 31 having a function of suppressing or preventing diffusion of copper is formed on an upper surface and a side surface of the wiring 26 and on the insulating film 17 and insulating film 29. At this time, the film thickness of the insulating film 17 in a narrow inter-wiring space bottom part is made less than the film thickness of the insulating film 31 on the wiring 26 to efficiently reduce the wiring capacitance of a thin line pitch. Then an insulating film 36 and an insulating film 37 are formed which have low dielectric constant. At this time, the insulating film 36 is formed between adjacent wiring lines of the wiring 26 so as to have a higher deposition speed above opposite wiring side surfaces than below them, thereby forming an air gap. Lastly, the insulating film 37 is flattened by inter-layer CMP.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010106698-A (JP)
Title: Engine generator
Inventor: SAITO EIKICHI
IPC: F02B77/00
Filed: 2008-10-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an engine generator facilitating maintenance work of an air cleaner while miniaturizing a casing.  <P>SOLUTION: The air cleaner 8 is arranged to oppose to a control box 31 which is an exterior member of a control device at an upper side of an inside of the casing 10 with a longitudinal direction thereof set in an up-and-down direction. A part at an opposing side of the control box 31 which is the external member is formed to be hollowed to an inside of the control device, and at least a part of the air cleaner 8 is disposed at the hollow part (recess 33).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010107444-A (JP)
Title: Ultrasonic flowmeter
Inventor: SEKINE YOSHIHIRO
IPC: G01F1/66
Filed: 2008-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultrasonic flowmeter which can shorten an approach run region ahead of a transceiver vibrator, and can be composed simply, while enabling a stable flow measurement with a wide measuring range using the transceiver vibrator, by taking into consideration of a flow velocity distribution characteristics in height direction at a straight line flow channel for the measurement and an intensity characteristics of the ultrasonic wave beam of the transceiver vibrator.  <P>SOLUTION: In the straight line intermediate flow channel 21a, two partition walls 40 consisting of two sheets are arranged in parallel along with direction of flow. In each of partition walls 40, one communication hole 41 is formed at cross direction corresponding to a measuring line position O2 of the ultrasonic wave beam. At each communication hole 41, a mesh 42 consisting of the plate or sheet like mesh made of a mesh material is laminated, so as to penetrate the ultrasonic wave beam with predetermined transmittance. The mesh 42 is formed with a plurality of sections in the height direction (direction of short side S) of the straight line intermediate flow channel 21a. Thereby, the mesh 42 has different transmittance corresponding to the flow velocity distribution characteristics in the height direction of the straight line intermediate flow channel 21a.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010114192-A (JP)
Title: Hollow sealing method of electronic component, hollow sealing resin, and manufacturing method thereof
Inventor: NAGASAWA MASATO
IPC: H01L23/08
Filed: 2008-11-05
Abstract: <P>PROBLEM TO BE SOLVED: To miniaturize packaging of an electronic component requiring hollow sealing, with simplified manufacture and lower cost.  <P>SOLUTION: A preliminary molding resin 20 molded preliminarily in predetermined shape using a thermo-setting resin that sets at a predetermined temperature as material is prepared. A stamper member 22 heated to a predetermined temperature or higher is pushed into the preliminary molding resin 20, to form a recess 24. Only the vicinity of the recess 24 is thermally set by the heat that the stamper member 22 has, forming a thermo-setting part 24A. An electronic component is arranged to correspond to the recess 24, and the electronic component is compression-sealed by applying a predetermined pressure to the preliminary molding resin 20.  <P>COPYRIGHT: (C)2010,JPO&INPIT