baber/WOPTO huggingface dataset:
Patent TW-201351892-A (TW)
Title: Memory controller
Inventor: CHUNG MING-HAN
IPC: H03M13/11
Filed: 2013-04-29
Abstract: A memory controller is provided, the memory controller includes a memory interface and a coding module. The memory interface connects to a memory chip. The coding module is coupled to the memory interface, and includes a sharing memory and a parity module. The parity module is coupled to the sharing memory, and configured to read at least one basic vector from the sharing memory, determine the dimension of the at least one basic vector, generate a generation matrix according to the at least one basic vector, transmit raw data to a codeword through the generation matrix and store the codeword into the memory chip through the memory interface.
Patent TW-201400503-A (TW)
Title: Target-tissue-specific antigen-binding molecule
Inventor: IGAWA TOMOYUKI
IPC: A61K39/395
Filed: 2013-05-30
Abstract: The inventors of the present invention have invented an antigen-binding molecule, which contains an antigen-binding domain in which binding activity with respect to antigens changes depending on the concentration of a target-tissue-specific compound. Using the present antigen-binding molecule enables various diseases stemming from target tissues to be treated in a target-tissue-specific manner.
Patent TW-201448163-A (TW)
Title: Semiconductor package and method of manufacture
Inventor: LIU HUNG-WEN
IPC: H01L25/04
Filed: 2013-06-06
Abstract: Disclosed is a semiconductor package, including a first semiconductor chip, a second semiconductor chip, an encapsulant, a wire bonding pad, a first sub-solder wire, a second sub-solder wire, a first buildup structure and a second buildup structure, the first semiconductor chip having opposing first active and non-active surfaces; the second semiconductor chip having opposing second active and non-active surfaces, and the second semiconductor chip being disposed on the first non-active surface via the second non-active surface thereof; the encapsulant encapsulating the first and second semiconductor chips; the first and second sub-solder wires being embedded in the encapsulant and respectively connected to a second electrode pad and the wire bonding pad; and the first and second buildup structures being respectively formed on the two surfaces, thereby effectively reducing the plane dimensions of the package and increasing good yield. The invention further provides a method of manufacturing the semiconductor package as described above.
Patent TW-201402208-A (TW)
Title: Improved resid hydrotreating catalyst containing titania
Inventor: HE RONG
IPC: B01J21/06
Filed: 2013-06-11
Abstract: Improved catalyst supports, supported catalyst, and method of preparing and using the catalysts for the hydrodesulfurization of a residuum hydrocarbon feedstock are disclosed. The catalyst supports comprise titania alumina having 5 wt % or less titania and have greater than 70% of their pore volume in pores having a diameter between 70 and 130 Å and less than 2% in pores having a diameter above 1000 Å. Catalysts prepared from the supports contain Groups 6, 9 and 10 metals or metal compounds, and optionally phosphorus, supported on the titania alumina supports. Catalysts in accordance with the invention exhibit improved sulfur and MCR conversion during a hydrotreating process.
Patent TW-201417940-A (TW)
Title: Precision machine tool
Inventor: YAMANISHI NORIO
IPC: B23Q11/12
Filed: 2013-06-27
Abstract: In a precision machine tool wherein a spindle head 20 that is movable in the up and down direction is disposed on a column 14 disposed on a bed 10 and a water storage space for storing temperature-regulated cooling water is formed inside the column 14, the column 14 has, in a lower part thereof, intake ports 38a and 38b through which cooling water is led into the water storage space, the column 14 has, in an upper part thereof, a drain opening 40 through which a cooling water is led outside, and an air vent hole 49 through which air in the column is discharged is formed at a position higher than the drain opening 40.
Patent TW-201408670-A (TW)
Title: Organic thin film transistor, organic semiconductor thin film, organic semiconductor materials, material for organic thin film transistor, coating solution for nonemissive organic semiconductor device and compound
Inventor: KITAMURA TETSU
IPC: C07D493/04
Filed: 2013-08-14
Abstract: An organic film transistor with a compound represented by the following formula (1) in a semiconductor active layer has a high carrier mobility and little variation in a threshold voltage after repeated driving (R1 to R10 are each a hydrogen atom or a substituent; any adjacent two among R1 to R4 and R6 to R9 bond with each other to form a substituted or unsubstituted benzene ring).
Patent TW-201423400-A (TW)
Title: System and methods for DIMM-targeted power saving for hypervisor systems
Inventor: ISCI CANTURK
IPC: G06F1/32
Filed: 2013-08-20
Abstract: A method of saving power in a computing system having a plurality of dual in-line memory modules (DIMMs) and employing a suspend-to-RAM sleep mode includes, when entering suspend-to-RAM sleep mode, consolidating selected information into a subset of DIMMs, and turning off power to all other DIMMs. A DIMM power rail may be coupled to each of the DIMMs, the DIMM power rail being configured to selectively have power being supplied to respective DIMMs turned off in response to enable/disable logic signals.
Patent TW-201510437-A (TW)
Title: Lens device and light source module using the same
Inventor: HUANG CHIH-MIN
IPC: F21V7/00
Filed: 2013-09-04
Abstract: A lens device and a light source module using the same are provided. The lens device comprises a lens and a pattern light shielding layer. The lens has a middle light-emitting surface and an edge light-emitting surface surrounding the middle light-emitting surface. The pattern light shielding layer is formed on the edge light-emitting surface of the lens.
Patent TW-201411849-A (TW)
Title: Semiconductor device and method for manufacturing semiconductor device
Inventor: MASUOKA FUJIO
IPC: H01L21/28
Filed: 2013-09-05
Abstract: A semiconductor device including a columnar silicon layer (121), floating gates (133, 134) and a control gate line (147) is provided. The columnar silicon layer (121) has a first diffusion layer (156), a channel region (211) and a second diffusion layer (150) formed in sequence from a side of a silicon substrate (101). The floating gates (133, 134) with the columnar silicon layer placed therebetween are disposed along two directions that are symmetrical, respectively. The control gate line (147) with the columnar silicon layer placed therebetween are disposed along two directions other than above directions, that are symmetrical to each other, respectively. A tunnel insulating film (127) is formed between the columnar silicon layer and the floating gates. The control gate line is disposed by surrounding the floating gates and the columnar silicon layer with an inter-poly insulating film (145) formed therebetween.
Patent TW-201414823-A (TW)
Title: Compositions comprising Z-1,1,1,4,4,4-hexafluoro-2-butene and 2,2-dichloro-1,1,1-trifluoroethane and methods of use thereof
Inventor: KONTOMARIS KONSTANTINOS
IPC: C07C21/18
Filed: 2013-09-17
Abstract: In accordance with the present invention a composition is provided. The composition comprises Z-1, 1, 1, 4, 4, 4-hexafluoro-2-butene (Z-HFO-1336mzz) and 2, 2-dichloro-1, 1, 1-trifluoroethane (HCFC-123). Also in accordance with the present invention a method is provided for topping-off or replenishing a refrigerant charge. The method comprises adding a second refrigerant to a refrigeration, air conditioning, heat pump or power cycle system containing HCFC-123 as a first refrigerant, wherein said second refrigerant comprises Z-HFO-1336mzz and optionally HCFC-123, thus producing a refrigerant composition comprising the first refrigerant and the second refrigerant. Also in accordance with the present invention another method is provided. The method comprises replacing HCFC-123 in a refrigeration, air conditioning, heat pump or power cycle system with a refrigerant composition comprising Z-HFO-1336mzz and optionally HCFC-123.
Patent TW-201515336-A (TW)
Title: Portable electronic device using torsion spring for automatic connection plug receiving
Inventor: Ma tian-qi
IPC: H01R13/24
Filed: 2013-10-09
Abstract: The present invention provides a portable electronic device using torsion spring for automatic connection plug receiving, which comprises a shell, a core element, a torsion spring, and a sliding member. In which, the core element is disposed within the shell. A connection plug may be extended outside the shell or received within the shell. A heart-shaped rail is disposed at a position near the rear end of the core element. The heart-shaped rail comprises a start portion, a positioning portion, and a recovery portion, wherein one end of the start portion is connected with one end of the recovery portion, and the other end is connected with one end of the positioning portion. The torsion spring is positioned at the rear end of the shell, and engaged with one end of the sliding member. The other end of the sliding member is extended toward the heart-shaped rail, and bent to form an engagement column. The engagement column may be extended into the heart-shaped rail and capable of sliding in the heart-shaped rail. Therefore, when a user pushes the connection plug outside the shell, the engagement column will be moved into the positioning portion from the start portion to fix the connection plug outside the shell. Thus, when a user finished using the portable electronic device, he only needs to pull out the portable electronic device and the engagement column will be automatically disengaged from the positioning portion, so that the torsion spring may force the engagement column to slide in the recovery portion and thus the connection plug may be automatically received back into the housing, so as to enhance the usage convenience for users.
Patent TW-201518650-A (TW)
Title: Lamp structure
Inventor: LIAO CHUN-HSIUNG
IPC: F21V17/10
Filed: 2013-11-01
Abstract: A lamp structure includes a plastic base seat, a light source, and a plastic light cover. The plastic base seat includes a mounting part and a heat-dissipation part. The mounting part has two outer surfaces, two locking grooves, and a bearing surface. Two locking grooves locate on the two outer surfaces. Every locking groove has a limit surface. The two extend planes of two limit surfaces intersect each other and have a first angle. The first angle is smaller than 180 degree. The light source disposes on the bearing surface. The plastic light cover has a cover part and two locking part connecting with the opposite two sides of the cover part. Two locking parts have an outer lateral surface respectively. Two locking parts dispose in the two locking grooves, and two outer lateral surfaces face to two limit surfaces. The cover part covers the light source.
Patent TW-201519732-A (TW)
Title: Protective device of portable mobile device
Inventor: HUANG CHENG-SU
IPC: H05K5/02
Filed: 2013-11-01
Abstract: A protective device for protecting a portable device includes a housing configured to cover at least one side of the portable device and a covering board fastened to the housing and configured to be disposed on a touch panel of the portable device. A surface of the covering board in contact with the touch panel includes a plurality of protrusions evenly distributed.
Patent TW-201419523-A (TW)
Title: Environmental sensitive electronic device package
Inventor: SHIH PING-I
IPC: G02F1/1339
Filed: 2013-11-05
Abstract: An environmental sensitive electronic device package including first substrate, second substrate, environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate, wherein the side wall barrier structure surrounds the environmental sensitive electronic device. The side wall barrier structure extends along a path, and the height of the side wall barrier structure varies along the path. The filler layer is disposed between the first substrate and the second substrate and covers the environmental sensitive electronic device and the side wall barrier structure.
Patent TW-201523789-A (TW)
Title: Wafer holder
Inventor: CHEN PO-TING
IPC: H01L21/687
Filed: 2013-12-04
Abstract: A wafer holder includes a first clamping member and a second clamping member is provided. The first clamping member includes a first plate body. The second clamping member sited at a side of the first clamping member and includes a second plate body. The first clamping member and the second clamping member are adapted to move related to each other to clamp or release a wafer. When the first clamping member and the second clamping member approach to each other, the first jaw and the second jaw clamp a lateral of the wafer, and a perpendicular projection of the first plate body and the second plate body formed on the wafer covers at least an area whose shape is substantially a circle in the center of the wafer.
Patent TW-201436173-A (TW)
Title: Methods of removing gate cap layers in CMOS applications
Inventor: JAVORKA PETER
IPC: H01L21/28
Filed: 2013-12-04
Abstract: One illustrative method disclosed herein includes the steps of forming a masking layer that covers a P-type transistor and exposes at least a gate cap layer of an N-type transistor, performing a first etching process through the masking layer to remove a portion of the gate cap of the N-type transistor so as to thereby define a reduced thickness gate cap layer for the N-type transistor, removing the masking layer, and performing a common second etching process on the P-type transistor and the N-type transistor that removes a gate cap layer of the P-type transistor and the reduced thickness gate cap of the N-type transistor.
Patent TW-201503227-A (TW)
Title: Substrate liquid processing apparatus, and substrate liquid processing method
Inventor: FUKUDA MASAHIRO
IPC: H01L21/304
Filed: 2013-12-06
Abstract: To shorten a time required for a drying step without elongating a processing time of the drying step of liquid processing to a substrate and without causing a failure state in the vicinity of a notch part on a substrate A substrate liquid processing apparatus comprises: a rear face purge nozzle (15) that has a slit-like opening (15a) arranged between a chuck (13) freely rotatably holding a wafer and a lower part of a rear face side of a peripheral edge part in a wafer radial direction, and extending in the wafer radial direction, and that is configured so that a gap where the opening and the wafer rear face are opposed to each other is widened as it approaches from an outer end side of the wafer toward a center part side, and that sprays a gas in a straight line toward the rear face of the wafer; and a peripheral purge nozzle (16) that is provided in a region between an end part of the rear face purge nozzle at an outer side of the wafer and the rear face at an inner side of the wafer from the end surface of the peripheral edge part, and that sprays a gas to the rear face of the wafer. A gas is sprayed to the rear face of the wafer from the rear face purge nozzle and the peripheral purge nozzle while a controller (H) controls a rotation drive motor (M) to rotate the wafer at a low speed which gives a weak centrifugal force.
Patent TW-201522276-A (TW)
Title: Humidity adjustable porous ceramic sintered by waste glass fiber and waste catalyst
Inventor: LEE KAE-LONG
IPC: C04B35/622
Filed: 2013-12-11
Abstract: A humidity adjustable porous ceramic sintered by waste glass fiber and waste catalyst, which utilizes the waste glass fiber as a base material and the addition of 0-40% waste catalyst as a substituted material to form the humidity adjustable porous ceramic with high strength and good humidity adjustment performance by the preforming and sintering technology under the sintering temperature of 750 to 900 degrees, thus achieving the object of recycling the waste glass fiber and waste catalyst.
Patent TW-201428975-A (TW)
Title: Semiconductor device, method of forming the same and FinFET diode
Inventor: FAN HSUEH-SHIH
IPC: H01L21/28
Filed: 2013-12-12
Abstract: Disclosed are a FinFET diode of high efficiency, designed to resolve the degradation problem with a conventional FinFET diode arising from reduced active area, and a method of fabrication. The FinFET diode has a doped substrate, two spaced-apart groups of substantially parallel, equally-spaced, elongated semiconductor fin structures, dielectric layers formed between the two groups and among the fin structures for insulation, a plurality of substantially equal-spaced and parallel elongated gate structures perpendicularly traversing both groups of the fin structures, and two groups of semiconductor strips respectively formed lengthwise upon the two groups of the fin structures. The two groups of semiconductor strips are doped to have opposite conductivity types, p-type and n-type. The FinFET diode further has metal contacts formed upon the semiconductor strips. In an embodiment, the semiconductor strips may be integrally formed with the fin structures by epitaxial growth and in-situ doped.
Patent TW-201428428-A (TW)
Title: Photosensitive resin composition and photosensitive film using same
Inventor: UEDA SATOKO
IPC: G03F7/039
Filed: 2013-12-12
Abstract: The present invention relates to a positive photosensitive resin composition comprising (A) a modified novolac-type phenolic resin comprising an unsaturated hydrocarbon group, (B) a novolac-type phenolic resin obtained from meta-cresol and para-cresol, (C) a novolac-type phenolic resin obtained from ortho-cresol, (D) a compound that generates an acid from light, and (E) a polybasic acid or a polybasic acid anhydride. The content of the (E) component is less than 40 parts by mass relative to a total amount of 100 parts by mass of the (A) component, the (B) component, the (C) component, and the (D) component.
Patent TW-201434811-A (TW)
Title: Dehydrocyclodimerization using UZM-44 aluminosilicate zeolite
Inventor: NICHOLAS CHRISTOPHER P
IPC: B01J29/70
Filed: 2013-12-12
Abstract: A process for dehydrocyclodimerization using a catalytic composite comprising at least one of a new family of aluminosilicate zeolites designated UZM-44 has been developed. These zeolites are represented by the empirical formula. NanMmk+TtAl1-xExSiyOz where ''n'' is the mole ratio of Na to (Al + E), M represents a metal or metals from zinc, Group 1, Group 2, Group 3 and or the lanthanide series of the periodic table, ''m'' is the mole ratio of M to (Al + E), ''k'' is the average charge of the metal or metals M, T is the organic structure directing agent or agents, and E is a framework element such as gallium. UZM-44 has catalytic properties for carrying processes involving contacting at least one aliphatic hydrocarbon having from 2 to 6 carbon atoms per molecule with the UZM-44 to produce at least one aromatic hydrocarbon.
Patent TW-201526178-A (TW)
Title: Chip package structure
Inventor: LIAO TSUNG-JEN
IPC: H01L23/34
Filed: 2013-12-16
Abstract: A chip package structure is provided. The chip package structure includes a chip, at least one inducting coil, a molding compound and a redistribution layer. The chip includes an active surface, a back surface opposite to the active surface. The inducting coil is disposed around a periphery region of the chip. The molding compound covers the chip and the periphery region and exposes the active surface. The inducting coil is disposed at the molding compound. The redistribution layer covers the active surface, part of the molding compound and part of the inducting coil, and electronically connects the chip.
Patent TW-201443090-A (TW)
Title: High molecular weight polymeric dispersions
Inventor: BROCHER MARKUS
IPC: C08J3/03
Filed: 2014-01-10
Abstract: The invention relates to polymer dispersions, methods for their preparation and their use. The polymer dispersions are prepared in a radical polymerization reaction which is initiated by a combination of different initiators. The polymer dispersions are useful inter alia as flocculants, dewatering (drainage) aids and retention aids in papermaking.
Patent TW-201436323-A (TW)
Title: Resistive random access memory (RRAM) structure and method for fabricating the same
Inventor: YANG CHIN-CHIEH
IPC: H01L21/8239
Filed: 2014-01-10
Abstract: The present disclosure provides one embodiment of a resistive random access memory (RRAM) structure. The RRAM structure includes a resistive memory element formed on a semiconductor substrate and designed for data storage; and a field effect transistor (FET) formed on the semiconductor substrate and coupled with the resistive memory element. The FET includes asymmetric source and drain. The resistive element includes a resistive material layer and further includes first and second electrodes interposed by the resistive material layer.
Patent TW-201440101-A (TW)
Title: Capacitor and manufacturing method therefor
Inventor: HARASHIMA YUTAKA
IPC: H01G9/008
Filed: 2014-01-17
Abstract: A capacitor in which a capacitor element to which a lead terminal is connected is covered by a resin. Said lead terminal, which extends from a resin layer that covers the capacitor element, is provided with the following: a clearance section (stretch section) that is exposed from the outer surface of the resin layer; a thin section (notch); and step sections that form the boundaries between the clearance section and the thin section. The thin section is bent towards the step sections such that the lead terminal is positioned on the resin-layer side, the step sections overlap the thin section, and the thin section is positioned so as to surround the clearance section. This improves the bending precision of the lead terminal.
Patent TW-201435655-A (TW)
Title: Method and device for rotating original image, system on chip, application processor and mobile device
Inventor: SONG MIN-WOO
IPC: G06F3/01
Filed: 2014-01-28
Abstract: A method of rotating an original image includes performing a self-learning using addresses related to at least one page miss and generating address generation rules using a result of the self-learning. The method includes pre-fetching the original image from a memory device based on the address generation rules to obtain a pre-fetched image and generating a rotated image using the pre-fetched image.
Patent TW-201529340-A (TW)
Title: Transmission structure of transmission belt for use in circuit board printing
Inventor: Huang wen-qing
IPC: H05K3/00
Filed: 2014-01-29
Abstract: This invention relates to a transmission structure of transmission belt for use in circuit board printing. The transmission device is to perform panel transmission, positioning and alignment while printing the panel. The characteristics of the transmission belt transmission structure for use in circuit board printing comprise a transmission structure disposed with two rotary rollers, two transmission rollers and an alignment part, wherein one end of the two transmission rollers has a driving structure, and the two driving structures are driven by a transmission belt installed therebetween to rotate synchronously; a e transmission belt fit on the exteriors of the two rotary rollers and the two transmission rollers of the transmission structure to rotate around and to conduct transmission.