baber/WOPTO huggingface dataset:
Patent TW-200636907-A (TW)
Title: Semiconductor device and manufacturing method thereof, and semiconductor integrated circuit
Inventor: KANAMOTO TOSHIKI
Filed: 2006-01-18
Abstract: An FTI structure is employed in an isolation region making contact in a Y direction with a P-type impurity layer P13 serving as a drain region of a PMOS transistor QP1. N-type impurity layers N14, N15 and N16 serving as body regions are connected to a high potential line VDL via N-type impurity layers N17, N18 and N19, respectively, and further via an N-type impurity layer NL. N-type impurity layers N17, N18 and N19 are provided between an insulating layer of an SOI substrate and an element isolation insulating film in a PTI region.
Patent TW-200731112-A (TW)
Title: Method for utilizing a digital media adapter for controlling a display device to display information of multimedia data stored in a plurality of multimedia sources
Inventor: CHEN SHU-YI
IPC: G06F17/40
Filed: 2006-02-08
Abstract: A method for utilizing a media adapter for controlling a display device to display information of multimedia data stored in a plurality of multimedia sources includes: (a) the plurality of multimedia sources transmits file information of the multimedia data stored in the plurality of multimedia sources to the media adapter respectively; (b) the media adapter classifies the multimedia data according to the file information of the multimedia data received in step (a); (c) the media adapter outputs the classified result in step (b) to the display device; and (d) the display device displays a frame corresponding to the classified result.
Patent TW-200733835-A (TW)
Title: Joint structure for passive component
Inventor: LIU CHIEN
IPC: H05K3/34
Filed: 2006-02-24
Abstract: A joint structure for a passive component, comprises a substrate and a passive component. The substrate has a concave and a plurality of solder pads which are disposed on the bottom of the concave and have a solder layer on its surface. The passive component has as many electrodes as the number of the solder pads. The passive component is inserted into the concave and connected to the solder pads with electrodes, wherein the passive component is welded on the substrate by a reflow process and the displacement of the passive component is confined by the concave.
Patent TW-200733891-A (TW)
Title: Jelly product
Inventor: TSAI ENG-MENG
IPC: A23L21/10
Filed: 2006-03-02
Abstract: The present invention relates to a jelly product, comprising an external box having an opening at one side and a cap for sealing the opening of the external box, in which the external box comprising: at least a closed container containing jelly therein; at least a sealed bag containing seasoning powder therein; and a utensil for reaching the jelly if necessary. The present invention also relates to a method for manufacturing the jelly product.
Patent TW-200734851-A (TW)
Title: Apparatus for error compensation of self calibrating current source
Inventor: HSIEH JIN-SHENG
IPC: G05F3/26
Filed: 2006-03-08
Abstract: An apparatus and a method for error compensating of self calibrating current source adapted for compensating error of at least a self calibrating current source. The apparatus includes a copy of the self calibrating current source, a current source reference apparatus, and an error compensation apparatus. The copy of the self calibrating current source is used to simulating the structure of the self calibrating current source to generate an error bias signal as the error of the self calibrating current source. The current source reference signal apparatus is used to generating an idea bias signal. The error compensation apparatus generates a compensation bias signal to compensating error of the self calibrating current source according to difference of the error bias signal and the idea bias signal.
Patent TW-200702494-A (TW)
Title: Surface treatment method for copper and copper
Inventor: YAMASHITA TOMOAKI
IPC: C25D11/34
Filed: 2006-03-10
Abstract: To provide a surface treatment method for copper by which adhesive strength between a copper surface and insulating layer is secured without forming ruggedness of > 1 μm on the copper surface, and insulation reliability between wiring therefore can be improved, and to provide copper. The surface treatment method for copper comprises: a step where a metal nobler than copper is formed on a copper surface; and a step where the copper surface is subjected to oxidation treatment.
Patent TW-200702500-A (TW)
Title: Seventy five millimeter silicon carbide wafer with low warp, bow, and TTV
Inventor: POWELL ADRIAN
IPC: C30B23/00
Filed: 2006-04-07
Abstract: A high quality single crystal wafer of SiC is disclosed. The wafer has a diameter of at least about 3 inches, a warp of less than about 5 μm, a bow less than about 5 μm, and a total thickness variation of less than about 2.0 μm.
Patent TW-200704660-A (TW)
Title: New organic bottom antireflective polymer compositions
Inventor: YAO HUI-RONG
IPC: G03F7/11
Filed: 2006-04-11
Abstract: The present invention relates to bottom antireflective coating compositions, polymers useful in making such compositions, and their use in image processing by forming a thin layer between a reflective substrate and a photoresist coating.
Patent TW-200743018-A (TW)
Title: Data grouping processing method
Inventor: TSAI CHENG-FA
IPC: G06F7/16
Filed: 2006-05-12
Abstract: A data grouping processing method is disclosed, at least comprising the following steps: firstly, dividing data cubes of an original data group into unit data cubes according to a specific interval length, setting a threshold for evaluating a density of the unit data cubes, building a data cube diagram based on the density, and searching a graphical data structure by means of an artificial intelligence searching way so as to explore all unit data cubes; next, finding out a density attractor in the data cub diagram, determining whether the density is greater than the threshold, if so, close unit data cubes would be arranged as the same group during a grouping procedure, otherwise the close unit data cubes would be regarded as an edge of the group for the following step to perform minor adjustment; then, equally dividing dimensions of the unit data cubes of the edge of the group into three parts, dividing into a plurality of sub-cubes, assigning the sub-cubes close to a group to the close group, while the sub-cubes without a direct connection would be regarded as noise.
Patent TW-200801384-A (TW)
Title: Gas supply unit and gas supply system
Inventor: MORIYA SHUJI
IPC: H01L21/306
Filed: 2006-06-02
Abstract: This invention provides a gas supply unit and a gas supply system that are small-sized and inexpensive. The gas supply unit (11A) is installed on operation gas conveyance pipeline and has fluid control devices (2-6, 9) communicated via flow path blocks (12-17) and controlling operation gas. The gas supply unit has the first flow path block (14), to one side of which an inlet open/close valve (4) included in the fluid control devices is attached, and also has the second flow path block (17), to one side of which a purge valve (9) included in the fluid control devices is attached. The first flow path block (14) and the second flow path block (17) are layered in the direction perpendicular to the conveyance direction of the operation gas. The inlet open/close valve (4) and the purge valve (9) are arranged between a mass flow controller (5) installed on the operation gas conveyance pipeline and an installation surface where the unit (11A) is installed.
Patent TW-200746365-A (TW)
Title: Dynamic random access memory and method of fabricating trench capacitor
Inventor: WANG CHIEN-KUO
IPC: H01L21/8242
Filed: 2006-06-07
Abstract: A dynamic random access memory including a substrate, an isolation structure, two transistors, two trench capacitors and two passing gates is described. The isolation structure is disposed in the substrate and including a first isolation structure and a second isolation structure. The second isolation structure is disposed in the substrate on the first isolation structure. The bottom surface of the second isolation structure is lower than the top surface of the substrate. The boundary of the second isolation structure is outside that of the first isolation structure. The transistors are disposed on the substrate located on the two sides of the isolation structure respectively. The trench capacitors are disposed between each transistor and the isolation structure respectively, and aportion of the second isolation structure is disposed in each trench capacitors. The passing gates are totally disposed on the second isolation structure.
Patent TW-200800747-A (TW)
Title: Generating box of a reagent
Inventor: Li yi-long
IPC: A61J1/00
Filed: 2006-06-15
Abstract: A generating box of a reagent comprises: a box, which at least has a containing trough for containing the liquid of a regent; at least a fixed bed of filters, which forms filter holes and liquid discharge holes, these holes are passed through the top and bottom of the fixed bed of filters, the outside surface of the fixed bed of filters forms a locking surface, the fixed bed of filters are placed into the container trough, and the locking surface closely touches the wall of the container trough; at least a liquid discharge film, which forms an open, when the open is acted by the predetermined external force, the open will be in the open status, but when the open is not acted by the predetermined external force, the open will be in the closed status, the liquid discharge film is placed into the filter hole of the fixed bed of filters; at least a filter, which forms a plurality of filter holes with predetermined size, the filter is placed in the filter hole of the fixed bed of filters, the bottom of the filter touches the top of the liquid discharge film. Therefore, when the liquid discharge film is acted by the external force, the liquid of a reagent is discharged from the filter hole through the open to the liquid discharge hole.
Patent TW-200802272-A (TW)
Title: Pixel circuit
Inventor: HUANG JIUNN-YAU
IPC: G09G3/30
Filed: 2006-06-27
Abstract: A pixel circuit is disclosed. The pixel circuit includes a LED, a first switch, a second switch, a first transistor, a second transistor and a capacitor. The LED has a first terminal receiving a first supply voltage. The first switch has a first terminal receiving a data signal and a control terminal receiving a scan signal. The second switch has a first terminal coupled to a second terminal of the first switch and a control terminal receiving the scan signal. The first transistor has a drain coupled to a second terminal of the second switch, a source receiving a second supply voltage and a gate coupled to the second terminal of the first switch. The second transistor has a drain coupled to a second terminal of the LED, a source receiving the second supply voltage and a gate coupled to the gate of the first transistor. The capacitor has a first terminal coupled to the gate of the second transistor and a second terminal receiving the second supply voltage.
Patent TW-200714820-A (TW)
Title: Roller screw and method of manufacturing the same
Inventor: UESUGI MASAKAZU
IPC: F16H25/24
Filed: 2006-06-29
Abstract: The present invention relates to a roller screw capable of carrying loads in both directions along the axis of the screw and having less interferences between end surfaces of the rollers and the roller rolling grooves. There are at least two roller rolling paths (3a, 3b) arranged between the roller rolling surfaces (1a, 1b) of the screw (1) and the roller rolling surfaces (2a, 2b) of the nut (2). A plurality of rollers (4a) is arranged in parallel in one roller rolling path (3a), and a plurality of rollers (4b) is also arranged in parallel in the other roller rolling path (3b) The plurality of rollers (4a) arranged in the one roller rolling path (3a) can carry the load in one direction (1) along the axis of the screw (1), and the plurality of rollers (4b) arranged in the other roller rolling path (3b) can carry the load in the opposite direction (2) along the axis of the screw (1).
Patent TW-200709836-A (TW)
Title: Oil and water separating method and oil and water separating device
Inventor: TSUKAHARA SATOSHI
IPC: B01D17/035
Filed: 2006-07-12
Abstract: This invention relates to an oil and water separating method and oil and water separating device. More particularly, the oil and water separating method and the oil and water separating device are for floating the oil component contained in a liquid to be treated together with bubbles to separate oil and water by supplying the bubbles into the liquid to be treated stored in a treating tank. In this invention, air is mixed with the liquid to be treated taken out from the lower part of the treating tank 11, the pressure of the liquid is raised by a circulation pump 31 to be jetted from a nozzle 33 provided at the lower part of the treating tank 11 to return and circulate the liquid to be treated to the treating tank 11, and an untreated liquid to be treated is supplied to a circulation pipeline of the liquid to be treated or to the lower part of the treating tank 11. A small amount of a calcium chloride, a hydrochloric acid and a sodium hydroxide are added to this line to promote agglomeration of the oil in order to improve the oil separating performance.
Patent TW-200721289-A (TW)
Title: Loading device of chemical methanical polishing equipment for semiconductor wafers
Inventor: NA YOUNG-MIN
IPC: H01L21/304
Filed: 2006-08-11
Abstract: A loading device of chemical mechanical polishing (CMP) equipment for semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate so as to be capable of absorbing shock and seating the wafer; a driving device and a driving shaft horizontally pivoting and vertically moving the loading cup between a platen of a polishing apparatus and a spindle; and an arm connecting between the loading cup and the driving shaft. At least one through hole is formed at one or more mutually corresponding positions of the bath and cup plate and the loading plate of the loading cup. At least one probe assembly for optically detecting a polished thickness at a polished point on the wafer is inserted and installed into each through hole at the corresponding position of the loading cup. An optical thickness detection device capable of applying light onto a layer on the wafer to detect reflected spectrum wavelengths, and detecting a layer thickness of the wafer by change in a physical quantity extracted from a spectrum interference signal between the detected reflected spectrum wavelengths is provided at one side of the driving device. An optical fiber cable connecting each of the probe assemblies and the thickness detection device is disposed in the arm. Thereby, the thickness of a layer on the wafer can be measured by at least one loading device installed in the CMP equipment for a single-step or multi-step polishing process, after a polishing process is performed on a previously input wafer and just before it is performed on a subsequently input wafer, or before a subsequent polishing process is performed on the same previously input wafer, thereby more rapidly transmitting and reflecting information useful for polishing of the subsequent wafer, and improving wafer polishing precision as well as simplifying a structure of the CMP equipment.
Patent TW-200812329-A (TW)
Title: Time-synchronous system to support multiple network equipments
Inventor: XIE KUN-CANG
IPC: H04L7/04
Filed: 2006-08-24
Abstract: A time-synchronization system to support multiple network equipments is disclosed, which is formed of an UTC time-analyzing module, a network equipment counter, a time-driving control logic, and a time-synchronization computation module. The UTC time-analyzing module of each host machine mainly sends the time-calibration request to the GPS receiver at the certain fixed time regularly. The GPS receiver sends the querying-time request to the GPS satellite, and receives the UTC time signal from the GPS satellite. Then, the UTC time-analyzing module analyzes the UTC time signal. The time-synchronization computation module sends a time-synchronization query signal through the PCI operation environment. The time-driving control logic of the network equipment immediately informs the other network equipment 34 to store the value of the network equipment counter at that time.
Patent TW-200712102-A (TW)
Title: Method and apparatus for underwater pelletizing polymer biomaterial composites with reduced moisture content
Inventor: MARTIN J WAYNE
IPC: B29C48/255
Filed: 2006-08-30
Abstract: A process for preparing low moisture content polymer biomaterial composites and expandable polymer biomaterial composites by extrusion and underwater pelletizing. Polyolefins or condensation polymers are melt blended with a solid or semi-solid biomaterial component, such as polysaccharides, including cellulosics and starches, or proteinaceous materials, including polypeptides, and are extruded, pelletized underwater, and processed with accelerated drying to achieve moisture levels as low as one percent (1%) or less.
Patent TW-200727333-A (TW)
Title: Slit nozzle
Inventor: TAKASE SHINJI
IPC: H01L21/02
Filed: 2006-09-27
Abstract: To provide a slit nozzle the width of whose discharge throat is made uniform in the longitudinal direction and in which a coating distribution can hardly be affected by the stress to be transmitted directly from a bolt. The end of a through-hole 11 or 12, into which the bolt 31 is inserted, is opened to a groove 16 or 17 extending to the longitudinal direction without pushing the end of the through-hole directly against the opposed surface of another half body 2 so that the stress to be generated when the bolt 31 is fastened is deconcentrated uniformly in the longitudinal direction of the slit nozzle without being concentrated on the open rim of the through-hole 11 or 12. As a result, the width of the slit discharge throat 14 can be made uniform.
Patent TW-200733214-A (TW)
Title: Substrate treating method and apparatus
Inventor: TAKAHASHI HIROAKI
IPC: H01L21/302
Filed: 2006-11-20
Abstract: A substrate treating method includes heating a substrate having an ion-implanted film formed on a surface thereof in an oxygen environment, and removing the film from the surface of the substrate by supplying a treating solution containing sulfuric acid and hydrogen peroxide solution or a treating solution containing ozone to the substrate after the heating step.
Patent TW-200823020-A (TW)
Title: An assembly for an adapter
Inventor: CHEN BO-SHEN
IPC: B25D17/08
Filed: 2006-11-27
Abstract: An adapter comprises an assembly of a base and a transferring structure wherein a receiving passage formed inside of the main body, and a groove mouth defined at the surface of the main body communicating with the receiving passage. An elastic locking assembly mounted on an outer periphery of the main body has an engaging section for lodging in the groove mouth and corresponding to the receiving passage. A sliding element is axially mounted with a moving passage for insertion of the main body and the elastic locking assembly, and a pushing protruding flange formed in an inner surface of the moving passage and corresponding to the elastic locking assembly. When one end of a chisel is inserted into the adapter, the engaging section is right be pressed on the surface of a handle of the chisel so as to push the sliding element that the pushing protruding flange drives the engaging portion out of the groove month. Thereby, the chisel can be disengaged with the main body easily.
Patent TW-200826696-A (TW)
Title: Digital signal processing system and complex signal connector thereof
Inventor: LEE CHIA-HSIEN
IPC: H04N7/26
Filed: 2006-12-13
Abstract: A complex signal connector includes a first tuner, a first demodulator, a first radio frequency pin, a first ground pin and a plurality of digital pins, and the first radio frequency pin is used for conveying a first radio frequency signal. The first tuner receives the first radio frequency signal and outputs a first digital signal. The first demodulator receives the first digital signal and outputs an MPEG signal through the digital pins. The ground pin is disposed between the first radio frequency pin and the digital pins, so as to block interferences between the first radio frequency signal and the MPEG signal. A digital signal processing system is also disclosed.
Patent TW-200806290-A (TW)
Title: Substituted biaryl compounds for inflammation and immune-related uses
Inventor: CHEN SHOUJUN
IPC: A61P37/00
Filed: 2007-01-25
Abstract: The invention relates to compounds of structural formula (I): or a pharmaceutically acceptable salt, solvate, clathrate, or prodrug thereof, wherein A, Y, L, R1, W1 and W2 are defined herein. These compounds are useful as immunosuppressive agents and for treating and preventing inflammatory conditions, allergic disorders, and immune disorders.
Patent TW-200740944-A (TW)
Title: Use of nanoparticles for the preparation of water-based dispersion adhesives
Inventor: GLENDE DAVID CHRISTOPHER
IPC: C09J11/00
Filed: 2007-01-25
Abstract: The present invention relates to the use of nanoparticles for the preparation of water-based dispersion adhesives, and especially the use of finely divided barium sulphate therein. The nanoparticles can be used with or without chemical modification. Adhesives of this kind feature improved properties, examples being improved cohesion in conjunction with comparable adhesion and higher heat resistance. Preference is given to dispersion adhesives based on polyacrylate, polyurethane, and epoxy resin.
Patent TW-200737371-A (TW)
Title: Resin sealing/molding apparatus
Inventor: URAGAMI HIROSHI
IPC: B29C39/42
Filed: 2007-01-30
Abstract: Resin molding apparatus (1) includes in unit (4), press unit (7) and out unit (9). The in unit (4) transfers not only pre-molding substrate (17) but also resin material (18). The press unit (7) includes multiple mold assemblies (5). The out unit (9) transfers molded substrate (20) having been resin-sealed within the mold assemblies (5). Further, the resin sealing/molding apparatus (1) includes not only carrier rail (10) but also demounting means (12) and supply means (11) traveling along the carrier rail (10). Furthermore, multiple press units (7) in the state of being linked with each other are disposed between the in unit (4) and the out unit (9).
Patent TW-200831795-A (TW)
Title: Forming method of linear slide rail and device thereof
Inventor: WU LE-RUI
IPC: F16C29/02
Filed: 2007-01-31
Abstract: A forming method of a linear slide rail and a device thereof are disclosed. A metal material is placed in a slide base mold which has the same external shape of the slide base to be shaped. A punch which has the same external shape of the slide base mold is inserted into the slide base mold for being extruded outward to flow to the inner wall of the slide base mold so as to form an initial slide base by characteristic of the metal. A needle at the bottom is employed to push out the initial slide base, and the initial slide base is placed in a forming mold which has the same shape of the initial slide base. Then, a slide rail punch with the shape of the slide rail required by the slide base is employed to punch the initial slide base from the center of the forming mold. By the characteristic of the metal, the initial slide base is punched to produce the shape of the slide rail. Therefore, the punched metal material is pressed to the surrounding. The initial slide base extends upward along the slide rail punch to form a needed length of the slide base. The bottom of the forming slide rail that is punched keeps a remained board material from punching. Then, a needle is used to push the forming slide base, so as to push out a second forming slide base. Finally, a punch shaft which has the same shape of the slide rail is used to remove the board material, so as to form a finished produce of slide base thereby achieving the effect of decreasing the manufacturing steps and quick formation.