baber/WOPTO huggingface dataset:
Patent JP-2006090591-A (JP)
Title: Crucible for producing inorganic particle, and method of producing inorganic particle
Inventor: KITAHARA NOBUYUKI
IPC: F27B14/18
Filed: 2004-09-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a crucible for stably producing inorganic particles of high crystallinity at a low cost.  <P>SOLUTION: The crucible 1 for producing inorganic particles is provided with a nozzle part 3 for discharging a melt 4 of inorganic substance into a granular state; an inner crucible 2a formed of material with a melting temperature higher than the melting point of the inorganic substance, and holding the melt 4 together with the nozzle part 3; and an outer crucible 2b formed of material with the melting temperature higher than that of the inner crucible 2a, and holding the inner crucible 2a and the nozzle part 3. The strength of the crucible 1 can be ensured, the thermal stability of the crucible 1 is increased, assembling accuracy is improved, and the crucible 1 can be used a plurality of times. Since the melt 4 of the inorganic substance is discharged from the nozzle part 3 of the crucible 1 and dropped in the granular state and the granular melt 5 is coagulated during the drop to produce the inorganic particles, the occurrence of defects caused by the condensation of impurity elements and influence on the material property of the inorganic substance can be suppressed to obtain the inorganic particles of high quality.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005025935-A (JP)
Title: Encoding apparatus
Inventor: MAENO KENJI
IPC: H03M7/14
Filed: 2004-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide an encoding apparatus which can widen a notch of a frequency spectrum of code data.  <P>SOLUTION: The encoding apparatus conducts an extraction of sine and cosine components of each of N frequencies on two kinds of (m+1)-bit data strings to which 1 bits of "0" or "1" is added at intervals of m bits, selects from the two kinds of data strings one data string in which frequency components increase or decrease with a greater degree, using at least the extracted components, and outputs the selected data string. The encoding apparatus is provided with sine wave generation circuits 29 and 39 with weighting factors and cosine wave generation circuits 34 and 44 with weighting factors for adding a weight factor to at least one of the extracted since and cosine components. By using the result thereof, one of the two kinds of data strings with a greater degree of increase/decrease of a frequency component is selected and outputted.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006061654-A (JP)
Title: Combination bag or shoulder bag and chair for sitting with knees bent and toes directly beneath body
Inventor: MUNEMURA YASUKO
IPC: A45C9/00
Filed: 2004-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a combination bag or shoulder bag and chair for sitting with the knees bent and the toes directly beneath the body, ordinarily storing various articles such as cosmetics and a wallet for use as a bag or a shoulder bag, and occasionally used as a chair for sitting with the knees bent and the toes directly beneath the body with the articles still in the bag when sitting in that manner.  <P>SOLUTION: This combination bag or shoulder bag and chair for sitting with the knees bent and with toes directly beneath the body includes: a container having rigidity, dimensions and shape to be used as a chair for sitting with the knees bent and with toes directly beneath the body when it is placed under the buttocks with the bottom up, and with the opening part down; an inner body having the bottom and the opening part freely opened and closed; and a bag or shoulder bag body, wherein the container is stored with the bottom thereof coming into contact with the inner bag.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006101594-A (JP)
Title: Power output unit and vehicle equipped therewith
Inventor: OYOBE HICHIROSAI
IPC: H02P27/06
Filed: 2004-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a power output unit capable of generating a desired alternating-current voltage even when an alternating-current output of such a voltage level that it cannot be supplemented for by a preset system voltage is requested.  <P>SOLUTION: The power output device 100 is capable of generating alternating-current voltage between the neutral points of motor generators MG1 and MG2 and outputting it. In this power output device, system voltage Vdc is allotted to a drive control portion and an alternating-current voltage allotted portion in each of the motor generators MG1 and MG2. When the alternating-current voltage allotted portion becomes insufficient because of a high-voltage alternating current output request, the power output unit 100 ensures the alternating-current voltage allotted portion to generate a desired alternating-current voltage. For this purpose, it carries out field weakening control on the motor generator MG1.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006097937-A (JP)
Title: Ceiling embedded type air conditioner
Inventor: GAKA KENJI
IPC: F24F13/32
Filed: 2004-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a ceiling embedded type air conditioner enlarging strength of a drain pan, and contributing to reduction of the number of components, reduction of manhours, and reduction of costs.  <P>SOLUTION: The ceiling embedded type air conditioner is provided with a casing 1 partitioned into two chambers 7A and 7B in a width direction by a partition plate 6, a heat exchanger 9 and the drain pan 10 arranged in one chamber, a blower 8 arranged in the other chamber, a communication hole 6a provided on the partition plate to guide air blown from the blower to the heat exchanger, and a decorative panel 2 fit on a casing lower face opening, and provided with a blowout opening 15 exposed to a room and facing the heat exchanger, and a suction opening 12 facing the blower. The blowout opening is opened throughout a longitudinal length of the decorative panel, the drain pan is a synthetic resin foamed product arranged along a substantially whole longitudinal length of the casing, a reinforcing fitting 17 is embedded throughout a longitudinal direction of the drain pan, both side ends of the reinforcing fitting is protruded from both drain pan side parts and fixed to the casing, and the partition plate is provided with a latch part 20 for fitting in a side part (a) of the drain pan.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006098235-A (JP)
Title: Rotation angle sensor
Inventor: KAGEYAMA EMI
IPC: G01D5/245
Filed: 2004-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a rotation angle sensor small-sized as compared with conventional one.  <P>SOLUTION: This rotation angle sensor 1 is provided with detecting gears 5, 6 provided in a surface side of a substrate 7 and rotated interlocked with a steering shaft, opening parts 8, 9 provided on a surface of the substrate 7, magnetic sensors 10, 11 provided in the opening parts 8, 9 to detect absolute angles of the detecting gears 5, 6, and a computing device for calculating an absolute angle of the steering shaft, based on detection results by the magnetic sensors 10, 11.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006095952-A (JP)
Title: Method for manufacturing inkjet recording head
Inventor: MUKAI HIROSHI
IPC: B41J2/16
Filed: 2004-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an inkjet recording head which does not erode members in a recording head, can uniformly perform a highly durable surface treatment even at ordinary temperature and can efficiently remove air bubbles.  <P>SOLUTION: The method for manufacturing the inkjet recording head for a water-based ink equipped with an electrostatic actuator providing a silicon nozzle plate on which a coating film of silicon oxide is formed and a silicon substrate on which an ink flow path is formed on a glass substrate, comprises a process performing a surface treatment of the inner wall of the ink flow path in the recording head by filling a treating liquid comprising at least a specified compound, a water-soluble organic solvent, a dye and water and having a solution viscosity of ≤2.0 mPa sec into the recording head at ordinary temperature and then, discharging the treating liquid.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006101460-A (JP)
Title: Network repeater
Inventor: NORIZUKI AKIRA
IPC: H04L12/42
Filed: 2004-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To attain miniaturization and reduction in cost, further to speedily start up a system and to reduce power consumption to an irreducible minimum.  <P>SOLUTION: When it is detected by any shunt circuit 22, 23, 24 whether an electronic apparatus is connected; and when it is detected by any shunt circuit 22, 23, 24 that the electronic apparatus is connected, a power source, corresponding to the electronic apparatus, is supplied by a multiplexer 25. If it is detected by any one of short circuits 22, 23, 24 that the electronic apparatus is not connected, an output from an OR circuit 26 goes into "L"; and an analog switch 27 is conducted (closed), so that an electronic apparatus connecting path is bypassed, thereby dispensing with a circuit for outputting a "Status" signal, indicating the connection or non-connection or for converting an optical signal into an electrical signal, in comparison with a repeater employing optical signals.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006102950-A (JP)
Title: Manufacturing method of rolled paper for foamed wallpaper containing calcium carbonate
Inventor: OKAMOTO MASARU
IPC: B32B5/20
Filed: 2004-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of rolled paper for foamed wallpaper constituted so as to laminate a non-foamed resin layer on a paper base material by a T-die extrusion method, having high productivity even in a case containing calcium carbonate in an amount for holding good cutting quality by a cutter of the foamed wallpaper and hard to produce a fisheye or the like in a subsequent printing process.  <P>SOLUTION: In the manufacturing method of the rolled paper for the foamed wallpaper constituted by laminating the non-foamed resin layer on the paper base material by the extrusion molding of a composition for forming the non-foamed resin layer on the paper base material using a T-die extruder, (1) the composition contains an electron beam-curable resin, a thermal decomposition type foaming agent and calcium carbonate, (2) the content of calcium carbonate is 20-60 pts.wt. with respect to 100 pts.wt. of electron beam-curable resin and (3) the particle size distribution of calcium carbonate is set so that 70 wt.% or above of all particles are contained within a range of 1-100 μm.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006104228-A (JP)
Title: Hydrate production apparatus
Inventor: MIYATA JUNYA
IPC: C10L3/06
Filed: 2004-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hydrate production apparatus which is capable of producing a hydrate with a stable amount of production and conversion ratio.  <P>SOLUTION: The hydrate production apparatus produces the hydrate by feeding water and a hydrate-forming gas into a tank and circulating and bubbling the hydrate-forming gas in water in the tank under a prescribed pressure. The apparatus has a gas line equipped with a temperature detection means which detects the temperature of the hydrate-forming gas, a pressure detection means which detects the pressure of the hydrate-forming gas and a temperature-adjusting means which adjusts the temperature of the gas by cooling or heating the hydrate-forming gas. The temperature of the hydrate-forming gas inside the gas line is maintained at an equilibrium temperature Teq+α of the hydrate to block the hydrate production inside the gas line and prevent occlusion of the line.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006108216-A (JP)
Title: Led device
Inventor: SUGIURA RYOJI
IPC: H01L33/64
Filed: 2004-10-01
Abstract: <P>PROBLEM TO BE SOLVED: To improve the strength of the LED chip mounting portion of an LED device by considering the heat radiating property of the device.  <P>SOLUTION: A first insulating substrate 3 is provided with a through hole 5 housing the LED chip 30 and a terminal 21 to which thin metallic wires 31 are electrically connected. On the surface of a second insulating substrate 11 laminated upon the rear surface of the first insulating substrate 3, a chip mounting section 17 which is formed of a plated film for mounting the LED chip 30 is provided. Below the chip mounting section 17, a non-through hole 24 is provided with a second plated film 24a which is electrically connected to the chip mounting section 17. In addition, on the lower end edge of the non-through hole 24, a third plated film 25 is provided which is electrically connected to the second plated film 24a.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005123610-A (JP)
Title: Method for manufacturing thin-film transistor array substrate
Inventor: YOO SOON SUNG
IPC: H01L21/768
Filed: 2004-10-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin-film transistor array substrate which simplifies a substrate structure and a manufacturing process to be made simple.  <P>SOLUTION: The method includes a step of forming a gate pattern on a substrate; a step of forming a gate insulating film on the substrate having the gate pattern formed thereon; a step of forming a source/drain pattern on the gate insulating film, and forming a semiconductor pattern thereunder; a step of forming a protective film on an entire surface of the substrate; a step of forming a photoresist pattern on the protective film; a step of patterning the protective film to form a protective film pattern, having a width smaller than the line width of the photoresist pattern; and a step of forming a pattern of a transparent electrode which includes pixel electrodes connected to the thin-film transistor, upper electrodes 56 for gate pads connected to lower electrodes for the data pads, and upper electrodes for data pads connected to lower electrodes for the gate pads, and is formed in a region, except for the protective film pattern, which is extended from the sides of the protective film pattern.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006110469-A (JP)
Title: Food trash bag breaking and sorting machine
Inventor: AKIYASU YASUSHI
IPC: B02C18/22
Filed: 2004-10-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a food trash bag breaking and sorting machine which can efficiently break and sort a bag by suppressing stay and sticking of food trash inside the bag breaking and sorting machine in the food trash bag breaking and sorting machine which breaks food trash-housing bag and sorts the food trash from the trash bag.  <P>SOLUTION: A food trash charging port 2 which is provided at one end side of an upper casing 1 constituting a drum body of the bag breaking and sorting machine is opened at a position approaching to a rotation direction side of an impeller from an axis line X-X of the drum body.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006112559-A (JP)
Title: Tapered roller bearing
Inventor: UEHORI YASUHIRO
IPC: F16C19/36
Filed: 2004-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tapered roller bearing ensuring a long durability life even with foreign matter getting inside and having less torque loss and heat generation caused by friction.  <P>SOLUTION: Carbonitrided layers 10a, 20a, 30a having a carbon content of 0.80 wt.% or more and Rockwell hardness of HRC 58 or more are formed on respective part surfaces of an inner ring 10, an outer ring 20 and tapered rollers 30 formed of cemented bearing steel. A curvature radius R of large end faces 32 of the tapered rollers 30 is set within a range of R/R<SB>BASE</SB>=0.75 to 0.87 when a distance from an apex of a cone angle of the tapered rollers 30 to a cone back face rib surface 18 of the inner ring 10 is represented as R<SB>BASE</SB>. Side run-out with outside surface at the large end faces 32 of the tapered rollers 30 is set at 3 μm or less.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006113901-A (JP)
Title: Rfid batch reading device, and article manufacturing system
Inventor: SATO HIDEKAZU
IPC: G06Q50/00
Filed: 2004-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an RFID batch reading device suitable for a process for managing the number of pieces in a factory, etc.  <P>SOLUTION: The reading device includes a holder 601 integrally housing a plurality of RFIDs 103 with the data indicating articles stored thereon; an antenna 602 receiving data of the plurality of the RFIDs 103 housed in the holder 601; and an alarm device 603 detecting the data received by the antenna 602 to check whether the number of the RFIDs 103 is a predetermined number or not and alarming if the number is not the predetermined number.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006109796-A (JP)
Title: Cooked food for health maintenance and method for cooking the same
Inventor: NAKAMOTO CHIZURU
IPC: A23L33/00
Filed: 2004-10-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide cooked food offered by an eating place, a retail shop, accommodations or delivery service, suppressing excessive calorie intake and salinity intake and suitable for maintaining health.  <P>SOLUTION: The cooked food for health maintenance offered by an eating place, a retail shop, accommodations or delivery service is cooked through adding/using no sugar, no salt and no oil and fat and using a natural food material as the substitute food material. The food is cooked using a protein-containing food material so as to efficiently ingest protein.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006110701-A (JP)
Title: Carbon fiber body, member having it, and their manufacturing method
Inventor: ANDO HISAHIRO
IPC: B82Y99/00
Filed: 2004-10-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a carbon fiber body, which can be applied to various kinds of electrode materials, etc., and further to provide a member having the same and their manufacturing method.  <P>SOLUTION: In the carbon fiber body, one end side of a plurality of carbon fibers is connected to the body portion of a carbon body elongated in one direction in the state that the carbon fibers are arranged in parallel. Such carbon fiber body can be manufactured by heating a catalyst in a liquid material in two steps. As for the materials, the material composed of a kind of liquid alcohol at an ordinary temperature and ordinary pressure, and a kind of hydrocarbon can be used. Furthermore particularly, a substrate having a catalyst on its surface is heated in the liquid material in two steps. By this manufacturing method, the member having the carbon fibers grown from the catalyst existing on the substrate can be obtained. This member can be used as various electrode materials without requiring any other treatments.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006121823-A (JP)
Title: Supporting member and internal instrument supporting frame
Inventor: MAEDA FUMIO
IPC: H02B1/42
Filed: 2004-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a supporting member for inner machine that makes it possible to carry such an internal instrument as a distribution switchboard into a site with an adequate margin ensured and an internal instrument supporting frame constructed of the supporting member.  <P>SOLUTION: The supporting member 10, 20, 30 is for installing an internal instrument and is fabricated by machining a plate member and is in such a shape that it is extended in the direction of length. The shape of its sections orthogonal to the direction of length includes: a first mounting face 11, 21, 31; a recess formed in U shape in the center of the first mounting face 11, 21, 31; a second mounting face 13, 23, 33 that forms the recess and is in parallel with the first mounting face 11, 21, 31; and perpendicular wall faces 14 that are formed on both sides of the second mounting face 13, 23, 33, forming the recess, in the direction of width. A large number of mounting holes 11a and 13a are formed in the first mounting face 11, 21, 31 and the second mounting face 13, 23, 33 in the direction of length.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006120973-A (JP)
Title: Circuit board and manufacturing method thereof
Inventor: TERASONO HIROBUMI
IPC: H05K3/38
Filed: 2004-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a circuit board which hardly generates defects and a circuit board using it which is excellent in heat dissipation property, and has high junction strength and is excellent in junction reliability.  <P>SOLUTION: An adhesive 3 which comprises metallic fine particle having an average particle diameter of 1 to 100 nm and at least one kind of active metal selected from Ti, Zr, Hf and Nb is interposed between an insulating substrate 1 and a metallic plate 5. The method has a junction process for joining the insulating substrate 1 and the metallic plate 5 by heating a lamination body to a junction temperature less than a melting point of the metallic fine particle.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005130510-A (JP)
Title: Apparatus and method for canceling multiple signal interference in mobile communication system
Inventor: JUNG JI-YAN
IPC: H04B1/707
Filed: 2004-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus and method for canceling multiple signal interference, in a mobile communication system.  <P>SOLUTION: A method for removing signals for other fingers from a signal received at a particular finger, in a mobile communication system where a signal transmitted on a radio channel is received at one fingers, and each of the fingers receives a signal including signals supposed to be received at other fingers, includes a step in which correlations between a signal supposed to be received at the finger and signals, which should to be received at other fingers are reduced in an input signal of the finger, and a step in which the be the signals supposed to be received at the other fingers with the reduced correlations are removed from the input signal of the finger.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006128488-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: YUZAWA HIDEKI
IPC: H01L21/60
Filed: 2004-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method whereby the seals using both resins can be performed certainly and no crack of leads can be generated in their temperature cycling test, when the method is so used as to connect electrically with each other the leads and the bumps of a chip formed on a substrate comprising a synthetic-resin film, and as to seal with both the different resins respectively the space between the chip and the substrate and the space between the side surface of the chip and the peripheral substrate-surface of the chip.  <P>SOLUTION: A first sealing resin 4 is so fed to the space between a chip 5 and a substrate 1 comprising a polyimide film as to expand the resin 4 outward beyond the whole outline 51 of the chip in its plan view. Thereafter, the space between the side surface of the chip 5 and the substrate 1 is sealed with a second sealing resin 7 having a linear expansion coefficient smaller than the first sealing resin 4.  <P>COPYRIGHT: (C)2006,JPO&NCIPI