baber/WOPTO huggingface dataset:
Patent JP-H05125732-A (JP)
Title: Traveling device of excavator
Inventor: SAKUMA KATSUMI
IPC: E02F5/02
Filed: 1991-11-06
Abstract: PURPOSE:To lessen the minimum rotary radius during traveling an excavator to minimize the radius of curvature of rail as little as possible. CONSTITUTION:A plurality of carriages 7, 8 provided with wheels 9 rotating on rails 10, 11 are placed at both sides of the right and left lower parts of a base frame 1. The respective carriages 7, 8 are connected to the base frame 1 to relatively rotate against each other around the vertical axis X. In this way, the respective carriages 7, 8 are automatically steered in the part of the curvature of rails in the direction along the rails 10, 11.
Patent JP-H10156498-A (JP)
Title: Device for removing burr for continuous casting apparatus
Inventor: LOTZ HORST KARL
IPC: B22D11/126
Filed: 1997-10-22
Abstract: PROBLEM TO BE SOLVED: To obtain a burr removing device of the cut burr developed at slab edges in the result of a torch cutting off of a strand in a continuous casting equipment. SOLUTION: In the burr removing device of the cutting-off burr 1 developed at the slab edges in the result of the torch cuttingoff of the strand 2, a burr removing body 3 supports a burr removing piston 4 and the burr removing piston pushes the slab 2 with comressed air containing lubricator and the burr removing piston itself is formed as a burr removing cap 6 or chiesel simply changeable. A burr removing tool has cutting edges 8 at the front side and the rear side and the rotation of the burr removing piston can be executed with the chip surface 10 extended downward and the side surface extended downward or stopped.  The shape of the burr removing piston in the cutting edge range is formed as round shape in the working direction and diagonally cut or combined with the round shape, diagonally cutting and straight line, and the cutting edge is cooled or lubricated with the invasion of the air near the burr removing piston.
Patent JP-S62149238-A (JP)
Title: Relay line selection system
Inventor: MIZUSAKO HIROAKI
IPC: H04M3/00
Filed: 1985-12-23
Abstract: PURPOSE:To facilitate the selection of a relay line having high confidentiality to information by adopting a random selection means using a random number for the selection of the relay line in a relay line selection system of a packet exchange. CONSTITUTION:When a packet exchange sends a data to other packet exchange, the data is inputted to a relay line selection input means 10, where it is in the state of processing standby. Then the data is inputted to a relay line selection means 12 and a request of relay line selection is given to a random selection means 21. The means 21 decides a relay line to be selected by using a random number from a random number generating means 20 and a processing table of a fixed bypass circuit selection and decision means 11. Suppose that a relay line 2a, then the relay line 2a selected by the preceding processing references an area storing the information to discriminate a faulty state, and when no fault exists, the data is sent to a destination packet exchange through a relay line output means 15a, a memory 16a and the relay line 2a.
Patent JP-S62148077-A (JP)
Title: Adhesive method and solder
Inventor: YOSHINAGA AKITOSHI
IPC: B23K1/00
Filed: 1985-12-23
Abstract: PURPOSE:To improve the adhesion fixing accuracy and to save the power consumption by placing an insulation-covered resistor and solder in an adhesive part, also making the resistor conduct electrically, and sticking two members by melting the solder. CONSTITUTION:When two members 2, 3 which have been brought to plating, etc., are stuck in a state that the axes have been allowed to coincide, a resistance wire 1 is wound in advance to the part to be stuck and fixed of the members 2, 3 by the number of windings, for instance, two windings, etc. As for the resistance wire 1, that which has covered a nichrome wire with a heat resisting inorganic adhesive as an electric insulating film is used. In this state, a pasty solder is applied to the outside periphery of the adhesive part from on the resistance wire 1, the solder is melted by energizing the resistance wire and it is cooled naturally by disconnecting a current. In this method, the members 2, 3 are stuck and fixed, therefore, the adhesion is executed exactly and equally in a short time. Accordingly, the adhesion fixing accuracy is improved, and also the power consumption can be saved.
Patent JP-H11127391-A (JP)
Title: High clamp circuit
Inventor: HARADA KOICHI
IPC: H04N5/335
Filed: 1997-10-23
Abstract: PROBLEM TO BE SOLVED: To provide a clamp circuit capable of accurately clamping the high level of a transfer clock pulse to a 0 V level. SOLUTION: By the use of a condition that the vertical transfer clock pulses ϕV1, ϕV3 of 1st and 3rd phases and the vertical transfer clock pulses ϕV2, ϕV4 of 2nd and 4th phases are not respectively simultaneously turned to low levels, the high levels of the clock pulses ϕV3, ϕV4 are respectively clamped by the low levels of the clock pulses ϕV1, ϕV2 and the high levels of the clock pulses ϕV1, ϕV2 are respectively clamped by the low levels of the clock pulses ϕV3, ϕV4.
Patent JP-S62152318-A (JP)
Inventor: KURATANI KOICHI
IPC: H02G9/06
Filed: 1985-12-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H08133719-A (JP)
Title: High purity synthetic cristobalite powder, its production and silica glass
Inventor: YAMAGATA SHIGERU
IPC: H01L21/673
Filed: 1994-11-01
Abstract: PURPOSE: To obtain high purity synthetic cristobalite powder having low alkali metal and alkaline earth metal contents, having high viscosity at high temp. and excellent in heat resistance by treating high purity synthetic silica glass powder together with high purity water in an autoclave. CONSTITUTION: High purity synthetic silica glass powder and water of >=99.999wt.% purity are charged into an autoclave and treated in the temp. range of 300-1,000 deg.C and the pressure range of 100-2,000kgf/cm<2> to obtain the objective cristobalite powder. This cristobalite powder is synthetic one obtd. by treating high purity synthetic silica glass powder at high temp. and pressure in an atmosphere of steam and contg. Li, Na and K as alkali metals and Ca and Mg as alkaline earth metals at <=100wt.ppb concn. each and Ti, Cr, Fe, Ni and Cu as transition metals at <=50wt.ppb concn. each. This cristobalite powder is used as the material of a jig for heat treatment of a semiconductor.
Patent JP-H10133223-A (JP)
Title: Laminated type liquid crystal cell and its manufacture
Inventor: SASAYA TAKUYA
IPC: G02F1/1347
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal cell and its manufacture capable of thinning an insulation layer between both liquid crystal layers containing two color property dystuff different from each other to an extent hardly causing a parallax. SOLUTION: A laminated body having an insulation film 40 and respective electrodes 41, 42 formed on respective surfaces of this insulation film, and another laminated body having the insulation film 60 and respective electrodes 61, 62 formed on respective surfaces of this insulation film are provided between both electrode substrates 10, 20 opposite to each other. Further, respective liquid crystal layers 30, 50, 70 containing the two color property dystuff different from each other are respectively provided between these laminated bodies and between these respective laminated bodies and respective both electrode substrates. At this time, respective insulation films 40, 60 are formed thin to the extent hardly causing the parallax.
Patent JP-S63144758-A (JP)
Title: Electromagnetic driving device
Inventor: YAMAMOTO HIROE
IPC: H02K41/025
Filed: 1986-12-08
Abstract: PURPOSE:To improve working efficiency of apparatus by forming insulators each equipped with a feeder-rail arranging groove into an integral body and dividing said integral body into semicircular insulating outer casings and by butting said outer casings together to form a dividable and removable built-up structure. CONSTITUTION:An electromagnetic driver 1 is composed of an outer casing 2 for storage, a molded insulator 3, first-second feeder rails 4a-4b, a driver 5, a storage cover 6 and others. Further, the inner periphery of said outer casing 2 is provided with a guide 7 for guiding and fixing said molded insulator 3 and with insulating guides 8a, 8b for insulating and fixing both rails 4a-4b. Likewise, the molded insulator 3 is provided with a rail arranging groove 11 fitted with the first-second feeder rails 4a-4b and others, and with guide grooves 12a-12b for the guide 7. Thus, there is formed a high accuracy, remov able built-up structure, from which the outer casing 2, molded insulator 3, first-second feeder rails 4a-4b and others are removable.
Patent JP-H09115445-A (JP)
Title: Used cry scrapping and processing method
Inventor: KANEHIRA KOJI
IPC: H01J9/227
Filed: 1995-10-13
Abstract: PROBLEM TO BE SOLVED: To easily take a fluorescence out of a CRT for reuse by separating the panel portion of the used CRT from the funnel portion and scraping the phosphor on the fluorescent screen of the panel portion. SOLUTION: A panel portion 112 of a used CRT is separated from the panel portion along a joint area to carry the panel portion 112 to a phosphor collecting machine 62. A fluorescent screen is greatly exposed to the inner face of the panel portion 112. A phosphor deposited on the inner face of the panel portion 112 is scraped by the rotation brush 308 of a phosphor scraping means 202. The scraped phosphor 116 is absorbed by a vacuum 307 and collected. The panel portion 112 is rotated to change the position of the panel portion 112 against the brush 308 and put the brush 308 in contact with the whole inner face of the panel portion 112 for collecting almost all phosphor 116 deposited on the inner face of the panel portion 112.
Patent JP-H11125130-A (JP)
Title: Fuel injection control device
Inventor: NIHONGI SHIGERU
IPC: F02D29/00
Filed: 1997-10-23
Abstract: PROBLEM TO BE SOLVED: To safely restrict a vehicle speed even if a vehicle speed signal falls into an abnormal condition by finding the vehicle speed from an engine speed and the maximum gear ratio when an abnormality is detected in the vehicle speed signal, and sending a fuel injection signal on the basis of a position of an accelerator pedal under the restriction of the vehicle speed at time other than the low speed gear ratio. SOLUTION: The maximum gear ratio is set, and is stored in a RAM (S1), and an engine speed from an engine speed sensor and a vehicle speed from a vehicle speed sensor are inputted (S2 and S3), and the gear ratio = an engine speed/a vehicle speed is found (S4). When the gear ratio is not more than the maximum gear ratio under vehicle speed restricting control (S5), and when judged that there is an obstacle in a signal from the vehicle speed sensor (S7), a vehicle speed = an engine speed/the maximum gear ratio is found (S8). The present gear ratio is judged from a gear ratio detecting switch (S9), and only at the time of high speed gear ratio, fuel injection control by a vehicle speed is performed (S10).  Therefore, even if input from the vehicle speed sensor is put in an abnormal condition by trouble, a present vehicle speed is found, and vehicle speed restricting control can be performed.
Patent JP-H06236958-A (JP)
Title: Module for electronic equipment of flat structure style
Inventor: KAARU NIKURAUSU
IPC: H01L21/56
Filed: 1993-11-19
Abstract: PURPOSE: To realize resistance against bending stress and pressing stress by directing, in a system carrier, one slit isolating a chip island from an external contactor with a particular inclination angle with respect to the edge of a square or a rectangular chip. CONSTITUTION: At the center of a system carrier 20, a square chip island 22 is provided, this chip island 22 is defined with a slit 23, and is then held at both sides with a bridging section 25. Extending portions 26, 27 which extend over a web 28 are formed to the bridging section 25 and an external contactor 21. The slit 23, isolating the chip island 22 from the external contactor 21, is set in the angle of about 45 degrees for the edge of the rectangular chip 1. Thereby, a resistance for the bending stress and pressing stress may be used effectively, when the extending portions 26, 27 are raised and bent along the line in the region of the web 28 and a window.
Patent JP-H02136924-A (JP)
Title: Microprogram controller
Inventor: MIZOGUCHI YUTAKA
IPC: G06F9/22
Filed: 1988-11-17
Abstract: PURPOSE:To attain an arithmetic process at a high speed by effectively making use of the idle time of an arithmetic logic unit ALU in an instruction cycle and executing plural microinstructions in a single instruction cycle if possible. CONSTITUTION:When the execution is instructed for such machine instructions as a multiplication/division instruction, a barrel shift instruction, etc., an address generating part 7 produces the head address of the corresponding microprogram stored in a microprogram instruction store memory 1. Then a microinstruction 2 positioned at the head address is read out of the memory 1 and set at a pipeline register 3. In this case, the executing frequency of the microinstruction 2 that can be completed by only the processes carried out in an ALU is set in an executing frequency control field 2a so that plural microinstructions 2 can be executed in a single instruction cycle if possible. Thus it is possible to shorten the processing time of a microprogram for such machine instructions as a multiplication/division instruction, a barrel instruction, etc., and to perform an arithmetic process at a high speed.
Patent JP-2001110840-A (JP)
Title: Wire-bonding device and method
Inventor: HARADA TOSHIFUMI
IPC: H01L21/60
Filed: 1999-10-13
Abstract: PROBLEM TO BE SOLVED: To efficiently perform a heating and a cooling of a member to be connected at the time of a wire bonding. SOLUTION: A member 124 to be connected is transferred on a bonding stage 140 and in a state that the member 124 is positioned and mounted at a prescribed position on the stage 140, a controller 146 opens a control valve 148 for heating and the hot air using a heater 150 heated at a temperature previously set in a temperature setter 144 is fed from the point of a hot air feeding nozzle 142 to the surface of the member 124. After an elapse of a prescribed time, the controller 146 shuts the valve 148 and the heating of the heater 150 is ended. Then a connecting material 110 is bonded to a prescribed position on the member 124 by the operations of a capillary 112, a spool 114, an X-stage 116 and a Y-stage 118.  Then after the connection of the material 110 with the member 124 is ended, the controller 146 opens a control valve 154 for cooling and the air for cooling from an air feeding unit for cooling is fed from the point of a cooling air feeding nozzle 152 to the surface of the member 124.
Patent JP-H06116915-A (JP)
Title: Car driver's eye guidance method and guidance facility
Inventor: TOKUDA HITOSHI
IPC: E01F9/576
Filed: 1992-10-06
Abstract: PURPOSE:To enhance guide efficiency and reduce cost by coating steel gratings which cover a side ditch of a road and a cross ditch with eye guidance paint or mounting a reflector thereto and reflecting the light of a headlamp of a running car. CONSTITUTION:Glance guidance paint is entirely applied to each vertical material 1a and each horizonatl material 1b of steel-made gratings 1 which cover a road side ditch (G) and a cross ditch (D) or the like or partially applied to the side gratings on the front and read sides of tread surface or a reflector is mounted to the gratings. The light of headlamps (L) of a car (M) illuminates the both gratings 1. As for the gratings 1 on the side ditch, the upper part of the vertical materials 1a are illuminated while the norizontal materials 1b are illuminated as for the gratings on the cross ditch. The reflected light guides the eye of the driver who is driving a car on the road. This construction makes it possible to save equipment cost dramatically since the gratings installed during road work serve as an eye guidance facility and minimize the potentiality of damage and serve for a long time.
Patent JP-H10134476-A (JP)
Title: Contact type magnetic head device and its manufacture
Inventor: NAKAYAMA MASAYUKI
IPC: G11B17/32
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To efficiently manufacture a contact type magnetic head device of high reliability capable of using a large capacity floppy disk to be rotated at high speed. SOLUTION: With regard to a lower priority specification magnetic head device 20 of high reliability for an object of a lower priority specification disk DL to be rotated at low speed, a pressure P to be generated in a gap G is evaluated by a Reynolds equation from an outline specification and a using condition of this device, and this pressure P is substituted in an equation of motion of a disk D to obtain a disk displacement amt. ULmax. With regard to an upper priority specification magnetic head device 1 capable of interchangeably using an upper priority specification disk DU to be rotated at high speed, a pressure P to be generated in a gap G is evaluated again by the Reynolds equation from an outline specification and a using condition of this device, and this pressure is substituted in the equation of motion of the disk D to obtain a disk replacement amt. UUmax.  The outline specification of the upper priority specification magnetic head device 1 is decided to satisfy ULmax-UUmax>0.
Patent JP-S62148804-A (JP)
Title: Inspecting instrument for surface comparison
Inventor: KINOSHITA TAKESHI
IPC: G01N21/93
Filed: 1985-12-23
Abstract: PURPOSE:To eliminate to the need for stable real image information or a sensitivity adjusting function of the real image information to be compared by including a means to calculate a difference with surface shape information to be compared from interference light intensity and reflected light intensity. CONSTITUTION:A reflection mirror 12 is vibrated by a vibrator 13 according to the surface shape information to be compared on a data disk 14. The interference light intensity, a wavelength of light, the laser light intensity for inspection, the laser light intensity for reference, an optical path difference from the inspection surface, the reference surface and a beam splitter 7 are denoted as I, lambda, I1, I2 and X, respectively, 1 is equal to I1+I2+2X(I1.I2)<1/2>cos(4piX1//lambda). Here, since the reflection mirror 12 for reference is moved according to the surface shape information to be compared, in case a shape of the inspection surface on a sample 1 is equal to the comparison information, I is not changed. In case I is changed, it is detected that a defect exist there. Further, in case the reflectivity of the sample is changed according to a location, the correction can be performed by considering a change of I2 from a photomultiplier 5b.
Patent JP-H02137337-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: HOJO SAKAE
IPC: H01L29/812
Filed: 1988-11-18
Abstract: PURPOSE:To suppress a stress concentration near the edges of a gate and an insulating film by forming a gate electrode in an integral structure of upper and lower stages in such a manner that the lower stage is thinner than the upper stage, the side face of the upper stage is vertical, and the side face of the lower stage is wider toward a substrate and narrower away from the substrate in an oblique shape. CONSTITUTION:An operating layer 2 is provided on a semi-insulating GaAs substrate 1, and a gate electrode 4 made of tungsten silicide is provided thereon. The electrode 4 is formed of an integral 2-stage structure of upper and lower stages 4a and 4b in such a manner that the shape of a section perpendicular to its longitudinal direction at the lower stage 4b is finer than that of the upper stage 4a, the side face of the stage 4a is perpendicular to the substrate 1, and the side face of the lower stage is wider toward the substrate 1 and narrower away from the substrate 1 in an oblique face. In this case, when the gate side face of the side in contact with the substrate 1 is formed in a flared triangular shape, a stress concentration generated near the edges of the gate electrode film and an insulating film 6 and piezo charge are reduced as compared with that the sectional shape of the part in contact with the substrate 1 of the electrode 4 is rectangular, thereby obtaining a semiconductor device having high reliability.
Patent JP-H11125675-A (JP)
Title: Automatic collision prevention aiding device
Inventor: ARIMURA NOBUO
IPC: G01S7/22
Filed: 1997-10-23
Abstract: PROBLEM TO BE SOLVED: To provide strong aid to a pilot of ship, by utilizing the detected or input lengths and moving directions of other ship and self-ship, estimating the size of sidestepping region, and determining danger region in accordance with the cruising situation. SOLUTION: In an automatic collision prevention aiding device loaded on a ship together with a radar device, an ARPA target detection circuit 18 detects a target from an image obtained with a radar processor 12, a tracking target is identified with a target selection circuit 20 from the target, and the relative motion information is obtained with a target tracking circuit 24. A target course operation circuit 26 obtains the course and the true velocity of the tracking target from this relative motion information and such information as course and velocity of self-ship. These and such information as the length of the tracking target obtained with a target length operation circuit 8 are supplied to a danger region operation circuit, and danger region indication data are formed.  Images of danger region based on these data are indicated on a display 16 together with the motion information of the tracking target overlapping the radar images.
Patent JP-S63144234-A (JP)
Title: Method for deciding mold parting force of synthetic resin molding material
Inventor: OOTSUKI TOMOHITO
IPC: G01N11/00
Filed: 1986-12-09
Abstract: PURPOSE:To permit simple and quantitative measurement of the mold parting property of a synthetic resin molding material by molding the synthetic resin by using several kinds of pulling metal fittings and flat metal plates which vary with surface conditions and shapes and detaching the molding and the pulling metal fitting by a pulling force detector after molding. CONSTITUTION:Applicable molding materials are all thermosetting resins such as, for example, phenolic resins and epoxy resins and all thermoplastic resins such as polycarbonate and polyphenyl sulfide. Molding methods may be any of compression molding, transfer molding and injection molding methods. Various kinds of the pulling metal fittings 3 are prepd. according to the surface conditions of the fittings, for example, a rough surface, mirror surface, and the presence or absence of plating on the surface, etc. The pulling metal fitting 3 with the molding 4 and the flat metal plate 5 are taken out of the mold right after molding and while the mold temp. is maintained, the pulling metal fitting 3 is detached by the pulling force detector, prescribed push-pull gage by which the mold parting force of the molding is decided.