baber/WOPTO huggingface dataset:
Patent TW-I228453-B (TW)
Title: Resin-containing metal foil and multilayer printed circuit board
Inventor: ONOZUKA IJI
IPC: H05K1/03
Filed: 2002-07-12
Granted: 2005-03-01
Abstract: The present invention provides a resin-containing metal foil with small thickness variation among insulating resin layers, and a multilayer printed circuit boards. The said resin-containing metal foil is characterized by having a metal foil layer (esp. copper foil layer) and two or more layers of insulating layers made from an insulating resin composition containing benzocyclo-butenes. The present invention also provides a multilayer printed circuit board characterized by laminating the said resin-containing metal foil to one side or both sides of the interlayer printed circuit boards through heating and pressing.
Patent TW-577098-B (TW)
Title: Waterproof type micro switch apparatus
Inventor: WATANABE HISASHI
IPC: H01H13/00
Filed: 2002-07-25
Granted: 2004-02-21
Abstract: To provide a waterproof type micro switch apparatus preferable for using a fluid such as a liquid, a gaseous mixture, a vapor or the like, and a high temperature fluid for a long period, comprising a fixed contact point, a movable contact point opposing thereto, a movable piece switching the contact points and a push button (2) operating the movable piece due to an application of an external force, within a switch case (1), a detecting rod is movably supported by a center portion of a flexible member (6), an outer peripheral portion of which is gripped by an opposing surfaces of one side casing (8) and another side casing (9) movably receiving the detecting rod (5). The front end (5A) of the detecting rod (5) is arranged so as to face to an operating body (3) arranged within an operating body case (4), and the rear end (5B) of the detecting rod (5) is arranged so as to be brought into contact with the push button (2) of the micro switch (M).
Patent TW-557514-B (TW)
Title: Method for processing a substrate and material for electronic devices
Inventor: SUGAWARA TAKUYA
IPC: H01L21/28
Filed: 2002-08-02
Granted: 2003-10-11
Abstract: A method for processing a substrate including: (a) a nitridation process for providing nitrogen radicals to a surface of the substrate for an electronic device to form a nitride film on the surface; and (b) a hydrogenation process step for providing hydrogen radicals to the substrate for the electronic device, thereby recovering electric characteristic deterioration of the insulating film resulted from turnaround phenomenon occurred when performing the nitridation process to a Si substrate or the like.
Patent TW-593518-B (TW)
Title: Modified polymeric composition
Inventor: RIMMER JOHN WAYNE
IPC: C08L35/00
Filed: 2002-09-18
Granted: 2004-06-21
Abstract: A polymeric composition including: (1) an addition polymer including at least 20 wt%, based on dry addition polymer weight, copolymerized vinyl ester monomer, (2) a protective colloid, and (3) 0.1 to 3.0 wt%, based on dry composition weight, olefin/maleic anhydride copolymer having an olefin/maleic anhydride molar ratio of 30/70 to 70/30, the composition in pulverulent or aqueous form, the composition optionally including a hydraulic substance such as cement. The invention also relates to a method for improving the water resistance of a dry or cured composition by using the composition.
Patent TW-I221789-B (TW)
Title: Split die groove maker
Inventor: CRUTCHLEY DEREK
IPC: B21K1/60
Filed: 2002-10-28
Granted: 2004-10-11
Abstract: A method of forming a radially expandable externally grooved tubular fastener from metal, comprising the steps of providing a suitable tubular blank having a tubular wall and squeezing the tubular wall between an internal member with a surface which engages the internal tubular wall face of the blank and a plurality of external members provided with suitably shaped surfaces engaging the external tubular wall face of the blank thereby to form grooves on the external tubular wall face of the blank.
Patent TW-584911-B (TW)
Title: Dicing method using cleaved wafer
Inventor: TAKYU SHINYA
IPC: H01L21/301
Filed: 2002-11-29
Granted: 2004-04-21
Abstract: There is provided a method of manufacturing a semiconductor device, which comprises: forming notches in an element formed surface of a wafer on which semiconductor elements have been formed; sticking a surface protect tape to the element formed surface of the wafer; cleaving the wafer along a crystal orientation using the notches as starting points; and grinding a back surface of the wafer.
Patent TW-591198-B (TW)
Title: Position detection method, position detection device and positioning method of printed circuit board
Inventor: FUKUSHIMA MASATO
IPC: G01B11/00
Filed: 2003-02-25
Granted: 2004-06-11
Abstract: The present invention provides a position detection method, position detection device and positioning method of printed circuit board to proceed photographing to plural reference portions allocated with minute spacing and to detect the coordinate of each reference portion in a short time with high precision without interfering plural photographing devices. It has an optical guiding device (10) and photographing device (20). The optical guiding device (10) divides the image of at least two reference portions into plural images corresponding to each reference portion, and divide the images of at least two reference portions (31a) incident into the entrance opening (11a) into plural images corresponding to each reference portion, guide these images to the exit opening (11b). Proceed image processing to the plural photographing data obtained from plural photographing devices (20), so as to detect the coordinate of each reference portion (31a).
Patent TW-592008-B (TW)
Title: A standard hole perforating machine
Inventor: ARAKI MASATOSHI
IPC: H05K3/46
Filed: 2003-02-25
Granted: 2004-06-11
Abstract: A standard hole is formed in a position where a fraction defective can be more reduced. From coordinate values of machine coordinate system which have been obtained by observing plural guide marks PDi (i =1 to n) formed in conductor layers of plural multilayer printed wiring boards by a standard hole perforating machine, an origin coordinate and a coordinate axis angle of a 1st coordinate system are found by applying a method of least squares with a center-of-gravity point being made a fixed point, and arrangements (origin coordinate values and angles of coordinate axis) of a design coordinate system in which there are described patterns, hole positions, guide marks, standard holes and the like which have been formed in the conductor layers of the multilayer printed wiring boards are computed. Next, an individual error of an observed value of each guide mark is found, two guide marks each of whose error is maximum and minimum are selected for every coordinate axis, a 2nd coordinate system is computed by the similar procedures with an arithmetic mean of the coordinate values being made an origin and, from the 1st and 2nd coordinate systems, the coordinate system whose error is smaller is adopted.
Patent TW-589715-B (TW)
Title: Method of manufacturing embedded memory
Inventor: TU KUO-CHI
IPC: H01L21/8239
Filed: 2003-03-03
Granted: 2004-06-01
Abstract: A method of manufacturing embedded memory is disclosed, for integrating logic and memory cells. Bottom electrodes of capacitors are formed first on the substrate in memory regions, wherein the bottom of the bottom electrodes is extended to be in shallow trench isolations, for increasing electrode areas. A thin dielectric layer is formed over the bottom electrodes to serve as the interelectrode layer and concurrently on the device areas in the logic and memory regions for the FETs gate oxide. Another conductive layer is deposited and patterned to form the capacitor top electrodes and concurrently to form the FETs gate electrodes. Next, the lightly doped source/drain, spacers, and source/drain are from, wherein the spacers are located at the sidewalls of FETs and the capacitor top electrode.
Patent TW-581671-B (TW)
Title: Method and device for detecting ""yin"" and ""yang""
Inventor: GUO BO-JAU
IPC: A61B5/352
Filed: 2003-03-11
Granted: 2004-04-01
Abstract: The present invention discloses a method and a device for detecting yin and yang according to the heart rate variability (HRV) so that an analysis of the HRV, which is difficult to be carried out traditionally, can be performed clearly in order to assist the clinical diagnosis of a physician or a Chinese herbal doctor. The detection method comprises the following steps: (1) grabbing electrocardio signals of an individual; (2) performing a Fourier transform on the electrocardio signals to provide a heart rate-power density spectrum; (3) separately calculating the lower frequency power and the high frequency power of the heart rate-power density spectrum; (4) using the low frequency power and the high frequency power to obtain a ""yin"" parameter, a ""yang"" parameter, and a ""qi"" parameter; and (5) separately calculating the standard scores of the ""yin"" parameter, the ""yang"" parameter, and the ""qi"" parameter to be used as the ""yin"" index, the ""yang"" index, and the ""qi"" index of the individual for determining the ""yin"" and ""yang"" status of the individual.
Patent TW-595132-B (TW)
Title: Converter structure for use in universal LNB
Inventor: SUGA HIROYUKI
IPC: H01Q1/24
Filed: 2003-03-17
Granted: 2004-06-21
Abstract: A converter main body is formed from composite material wherein reinforcing material comprising carbon fiber is combined with plastic material comprising ABS resin in an amount that is 30 wt% thereof. The coefficient of linear expansion of that composite material is made to be less than or equal to the coefficient of linear expansion of aluminum die cast alloy.
Patent TW-588437-B (TW)
Title: Method for manufacturing a semiconductor device having a layered gate electrode
Inventor: HAYAKAWA TSUTOMU
IPC: H01L21/28
Filed: 2003-04-04
Granted: 2004-05-21
Abstract: A method for manufacturing a DRAM includes the steps of forming a gate oxide film, a polysilicon film and a tungsten silicide film consecutively on a silicon substrate, selective etching the tungsten silicide film, covering exposed side surfaces of the tungsten silicide film by a polysilicon side-wall film, selectively etching the polysilicon film, oxidizing the polysilicon side-wall film and exposed surfaces of the polysilicon film, and forming a gate electrode including the polysilicon film and the tungsten silicide film. The resultant DRAM has lower leakage current and excellent refresh characteristics due to less contamination of diffused regions by the tungsten particles.
Patent TW-I285894-B (TW)
Title: Generation device of the refresh clock varied with the capacitance of memory capacitor and method thereof
Inventor: SU YUAN-MOU
IPC: G11C11/406
Filed: 2003-04-17
Granted: 2007-08-21
Abstract: The present invention proposes a generation device of the clock refresh in DRAM chip. The DRAM chip comprises plural memory cells, each memory cell comprises a memory capacitance. The generation method comprises: (1) providing a dummy capacitor, the dummy capacitor is positively correlated to the memory capacitor; and (2) generating a refresh clock according to the dummy capacitor. The refresh interval of the refresh clock is about proportional to capacitance value of the dummy capacitor. The present invention can save the electrical energy consumed by the refresh operation.
Patent TW-I259013-B (TW)
Title: Method and system for reducing message instances
Inventor: TERRY STEPHEN E
IPC: H04W4/06
Filed: 2003-05-02
Granted: 2006-07-21
Abstract: A method and system for transmitting data with reduced message instances is disclosed. A wireless message network uses destination identifiers and message pointers to direct message data to multiple mobile units and avoid duplication of messages. In order to provide increased efficiency in the case of duplicate messages, a pointer to a message may be associated with multiple destination identifiers.
Patent TW-569662-B (TW)
Title: Manufacturing method of heat sink base
Inventor: SHIU SHIUNG-MING
IPC: G06F1/20
Filed: 2003-05-06
Granted: 2004-01-01
Abstract: The present invention relates to a manufacturing method of heat sink base, which is mainly made by forming a long-stripe like substrate in the way of pressing. The bottom plate is made of metal material with high heat-conduction coefficient. The substrate and the bottom plate can be embedded tightly in the axial direction. Its head segment is cut to form a narrow portion, and the narrow portion can exactly penetrate through the forming mold having a converging opening. A clamping tool clamps the narrow portion, and pulls the substrates mutually embedded tightly and the bottom plate to pass through the converging opening of the forming mold, so that the substrate and the bottom plate are compressed to associate together. A desired length is provided by cutting according to the required specification, thereby forming a base. The heat sink fin is implanted on the base to complete the heat sink. Thus, the method of the present invention can simplify the formation of the bottom plate of heat sink, increase the production efficiency and provide a better heat sink performance.
Patent TW-I228638-B (TW)
Title: Method for and apparatus for bonding patterned imprint to a substrate by adhering means
Inventor: JENG RUEI-TING
IPC: G03F7/00
Filed: 2003-06-10
Granted: 2005-03-01
Abstract: The present invention relates to a method and an apparatus for bonding a patterned imprint to a substrate from a mold core by adhering means. The invented method for bonding a patterned imprint by transferring comprises: providing a top module having a mold core substrate, a mold core layer and a patterned anastatic layer, in which the surface of the patterned anastatic layer is coated with a release agent to form a release layer, and providing a base module having a substrate and being coated with a bonding layer thereon; filling a transfer layer material into the recess which is located between the patterned anastatic layer, and contacting and bonding the contact face on the top end of the transfer layer of the top module with the bonding layer of the base module, and applying a foreign force or an external action to form a strong adhesion between the transfer layer and the bonding layer; and removing the base module having a transfer layer after demolding, thereby completing the transfer printing of a patterned imprint.
Patent TW-I286619-B (TW)
Title: Optical switch
Inventor: SUNAGA TAKAHIRO
IPC: H04Q11/00
Filed: 2003-07-10
Granted: 2007-09-11
Abstract: There is disclosed an optical switch for switching between a plurality of main light emitters respectively emitting light components having wavelengths different from each other and a backup light emitter adapted to replace any of the main light emitters, a light emitter switching method for switching from one failed main light emitter to a backup light emitter by using the optical switch the above switch and a light receiver switching method for switching from one failed main light receiver to a backup light receiver by using the above.
Patent TW-I246543-B (TW)
Title: High resistant silicon wafer and manufacturing method thereof
Inventor: SADAMITSU SHINSUKE
IPC: H01L21/324
Filed: 2003-07-16
Granted: 2006-01-01
Abstract: The disclosure relates to a method for manufacturing a high resistant silicon wafer which has a preferable gettering function and economy and can effectively suppress generation of gas donors in a thermal process implemented in factory for forming a circuit. For achieving this, a silicon wafer with high resistance having relative resistance of 100 Omegacm above and concentration of doped carbon at 5x10<15> to 5x10<17> atoms/cm<3> is performed by high temperature process at 1100 DEG C above to allow its remaining concentration of oxygen to be 6.5x10<17> atoms/cm<3> that is measured according to Old-ASTM (Test Criterion of American Association for Testing Materials). However, such a high temperature process can be replaced by the following process step: OD step for forming DZ layer on surface layer of the silicon wafer, high temperature annealing step for removing COP of the surface layer, or high temperature thermal step for forming BOX layer in the manufacturing process of SIMOX silicon wafer.
Patent TW-I268895-B (TW)
Title: Mouth tube portion of synthetic resin bottle body
Inventor: OZAWA TOMOYUKI
IPC: B65D1/02
Filed: 2003-08-11
Granted: 2006-12-21
Abstract: A gas-venting groove as a path for gas along the up/down direction is formed on a thread provided on the outer periphery of a tube wall of a mouth tube portion with part of the thread left without forming the groove. When the entire tube mouth portion is whitened by thermal crystallization with abnormal deformation caused by unevenness of fluidity of resin prevented from occurring, a highly safe mouth tube portion broadly adaptable for products including heat resistant containers, pressure resistant containers, and heat/pressure resistant containers is obtained.
Patent TW-I225323-B (TW)
Title: Connector
Inventor: HASHIMOTO SHUNSUKE
IPC: H01R13/405
Filed: 2003-09-12
Granted: 2004-12-11
Abstract: In a connector configured by a minute socket 1 and a minute header 2 which are used for a mobile equipment such as a flip phone or a digital camera, a contact 4 disposed in the socket 1 has a contacting convex portion 44 which will slidably contact with a post 6 disposed on the header 2 and a plate spring portion 42 for generating contacting pressure when the contacting convex portion 44 contacts the post 6. Furthermore, the post 6 has a contacting portion 61 on which the contacting convex portion 44 of the contact 4 slidably contacts when the socket 1 and the header 2 are connected and a concave portion 63 in a manner so that at least a part of it is included in the contacting portion 61. Even when a foreign subject is adhered on the contacting convex portion 44 of the contact 4 of the socket 1 or the contacting portion 61 of the post 2 of the header 2, the foreign subject will be fallen in the concave portion 63 while the contacting convex portion 44 slides on the contacting portion 61, so that the possibility that the foreign subject is interleaved between the contacting convex portion 44 and the contacting portion 61 is largely reduced.
Patent TW-I246257-B (TW)
Title: Method and apparatus for interfacing an analog radio module to a digital module
Inventor: STUFFLET ALFRED
IPC: H04B1/04
Filed: 2003-09-24
Granted: 2005-12-21
Abstract: Through the use of a serial bus processor coupled to memory-mapped registers of a programmable radio interface processor (RIP), the novel radio interface of the present invention overcomes the problem of disparate interface between the digital section and the analog section of a wireless communications system. The serial bus processor receives data from a plurality of lookup tables which, in turn, are indexed by data received from the analog section. The serial bus processor then uses data values retrieved from the lookup tables to generate processed control data for controlling the digital module. The lookup tables are programmed with data so to compensate for nonlinearities which may be present in the analog section, but are not accounted for in the digital section.
Patent TW-I250201-B (TW)
Title: Oil-barrier composition
Inventor: FUKATSU YUTAKA
IPC: C09K3/32
Filed: 2003-10-09
Granted: 2006-03-01
Abstract: This invention discloses a kind of water-base oil-barrier composition employing an aqueous medium. The invented oil-barrier composition is characterized in that it comprises a polymer (A) containing the following monomer units (a1), a surfactant (B), and an aqueous medium (C), and that the surfactant (B) comprises at least 50 wt% fluorochemical surfactant (B1) based on the total amount of the surfactant (B). Monomer units (a1) are monomer units derived from an unsaturated ester containing a polyfluoroalkyl group or monomer units derived from an unsaturated ester containing a polyfluoroalkyl group having an etheric oxygen atom inserted in a carbon-carbon bond.
Patent TW-I227394-B (TW)
Title: Error correction coding apparatus and method
Inventor: KIM KI-HYUN
IPC: H03M13/09
Filed: 2003-10-13
Granted: 2005-02-01
Abstract: An error correction coding apparatus includes a parity check matrix generation unit which generates a parity check matrix having a number of elements having a value of 1 in each row thereof, having a predetermined number of elements having a value of 1 in each column thereof, and having the other elements having a value of 0; a parity check matrix adjustment unit which receives the parity check matrix from the parity check matrix generation unit, searches the parity check matrix for a cycle forming group of four elements positioned at respective vertexes of a rectangle and having a value of 1, and when there is at least one cycle forming group, replaces the value of 1 of at least one element of the cycle forming group with the value 0 of another element, to output an adjusted parity check matrix without a cycle forming group therein; and an LDPC coding unit which receives the adjusted parity check matrix from the parity check matrix adjustment unit and receives an m-bit message word to perform LDPC coding.
Patent TW-I230143-B (TW)
Title: Method for processing copper-containing heavy metal sludge
Inventor: CHEN GUO-JIN
IPC: C02F11/14
Filed: 2003-10-24
Granted: 2005-04-01
Abstract: A method for processing copper-containing heavy metal sludge which integrates leaching and smelting to recover selected metal values from the copper-containing heavy metal sludge and produce copper, brass or bronze and aluminum chloride solution while free of secondary pollution problem. The present invention leaches a clearer copper-containing sludge by hydrochloric acid and subsequently proceeds with activated carbon desorption and aluminum lamina displacement to produce copper powder and aluminum chloride solution; after drying and burning the mixture of acid sludge and activated carbon sludge produced, adds appropriate amount of sodium carbonate and coke and, if needed, zinc oxide or tin dioxide and smelts under high temperature to produce crude copper, brass or bronze.
Patent TW-593687-B (TW)
Title: Method and device for recycling blackened exhaust by metallic thermal treatment
Inventor: TZENG BO-HUA
IPC: C21D1/00
Filed: 2003-11-12
Granted: 2004-06-21
Abstract: The present invention relates to a method and a device for recycling blackened exhaust by metallic thermal treatment. The recycling method comprises subjecting CO and CO2 etc. formed in a quenching stage of a blackening treatment process to a recycling treatment; and guiding the gas to the inside of a tempering furnace for assisting an oxidation reaction with a metal component during its tempering stage in order to form a crystalline film of Fe3O4 on the surface thereof. The recycling device has a hollow tube in communication with the discharge tube of the quenching furnace and the connection tube of the tempering furnace so that the gas generated by the quenching furnace is capable of being smoothly introduced to the tempering furnace. Thus, the recycled gas can be used as an oxidation gas needed by the blackening treatment operation performed on the surface of a metal component, thereby reducing the formation of exhaust, ensuring the air quality in the working environment, and reducing the cost for a gas generation device.