baber/WOPTO huggingface dataset:
Patent TW-455908-B (TW)
Title: Lighting system
Inventor: HARBERS GERARD
IPC: F21K9/64
Filed: 2000-02-02
Granted: 2001-09-21
Abstract: The lighting system comprises a body (1) to emit visible light and an envelope (5) which is transparent to light. The invention is characterized in that the lighting system comprises at least one opto-electronic element (2, 2') to emit light in a first wavelength range, in that the body (1) is provided with conversion means (3) for absorbing light emitted by the opto-electronic element (2, 2') and re-emitting light in a second wavelength range, and in that the envelope (5) is provided with a coating (6) reflecting light of the first wavelength range. In a preferred embodiment, the opto-electronic elements (2, 2') are light-emitting diodes, which preferably emit blue light. Preferably, the conversion means (3) consist of a luminescent material and can be excited, preferably, by light originating from the wavelength range of 400 to 500 nm. Preferably, the coating (6) comprises a mulitlayer optical filter and is, preferably, provided on an inside surface of the envelope (5). In operation, the luminous flux of the opto-electronic element is preferably equal to or higher than 5 lm. The body (1) may assume various shapes, such as a spiral-shaped coil, so that the lighting system resembles a carbon filament lamp. The lighting system according to the invention has a comparatively high luminous efficacy and a relatively long service life.
Patent TW-531642-B (TW)
Title: Probe for testing wafers, method for making the same
Inventor: TAKEMOTO MEGUMI
IPC: G01R1/067
Filed: 2000-02-25
Granted: 2003-05-11
Abstract: The present invention provides a probe for testing wafers and method for making the same, which has an enlarged actual contact area of probe and electrode pad to reduce the sliding distance of probe to obtain a substantial electrical contact and high productivity. The tip portion of the probe of the present invention is urged against an electrode pad of a semiconductor integrated circuit to establish an electrical contact of the said tip portion against the electrode pad for testing functions of the semiconductor integrated circuit, wherein the probe is formed of the side surface portion and the tip portion, the tip portion is a spherical surface which has a radius of curvature r, t is the thickness of the electrode pad, their relationship is: 6t <= r <= 30t.
Patent TW-421602-B (TW)
Title: Method of making faceplate of head of golf club and structure thereof
Inventor: GUO TANG-SAN
IPC: A63B53/00
Filed: 2000-03-21
Granted: 2001-02-11
Abstract: The present invention relates to a method of making a faceplate of the head of a golf club and a structure thereof. The method comprises forming a round hole in the middle while molding the striking faceplate; mounting a glass round plate, which is made of a material different from that of the faceplate, in the round hole; placing the striking faceplate mounted with the glass round plate on a platform; while under pressure, heating the faceplate to a melting temperature so that the joint part between the metal faceplate and the glass round plate is molten into an integral body; after cooling to a normal temperature, injecting the body to form the head of a golf club.
Patent TW-457528-B (TW)
Title: Semiconductor device having an external connection electrode extending through a through hole formed in a substrate
Inventor: TAKASHIMA AKIRA
IPC: H01L23/12
Filed: 2000-03-22
Granted: 2001-10-01
Abstract: External connection electrodes can be positively mounted on a substrate when the pitch between the external connection electrodes is reduced and the diameter of each through hole formed in the substrate is reduced. A semiconductor chip is mounted on a first surface of a tape substrate. Electrode films are formed on the first surface of the tape substrate, each of the electrode films electrically connected to the semiconductor chip. External connection electrodes are provided on a second surface of the tape substrate, each of the external connection electrodes connected to a respective one of the electrode films via a through hole formed in the tape substrate. The external connection electrodes are formed on the electrode films by plating. A diameter S1 of a portion of each of the external connection electrodes protruding from the second surface of the tape substrate and a diameter S2 of the through hole satisfy a relationship S1 ≤ S2.
Patent TW-471956-B (TW)
Title: Digital blood pressure measuring method and device thereof
Inventor: WU SHU-MEI
IPC: A61B5/021
Filed: 2000-09-01
Granted: 2002-01-11
Abstract: The present invention relates to a digital blood pressure measuring method and a device thereof. The method mainly comprises obtaining the diastolic pressure and the mean artery pressure (MAP) during the pressurization process. A blood pressure measuring device according to this measuring method uses the MAP as a basis. Therefore, the cuff filling pressure during the pressurization process can be reduced, thereby obtaining the effects of comfortable, fast, power-saving, and accurate in the blood pressure measurement.
Patent TW-561115-B (TW)
Title: Optical information recording medium
Inventor: SAITO NAOKI
IPC: G11B7/246
Filed: 2000-09-07
Granted: 2003-11-11
Abstract: An optical information recording medium composed of a substrate and a recording layer having a dye compound of the formula (I): R1R2C=L1-L2=L3-NR3R4, in which each of R1 and R2 is an electron-attracting group having a Hammett's substituent constant sigmap in the range of 0.2 to 0.9; each of L1, L2, and L3 is a methine group which can have a substituent under such condition that two or three of L1, L2, and L3 can form a ring structure together with the substituent; and each of R3 and R4 is a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, or a heterocyclic group, provided that each set of R1 and R2, R2 and a substituent of L1, R2 and a substituent of L2, R2 and a substituent of L3, a substituent of L1 and R3, a substituent of L2 and R3, a substituent of L3 and R3, and R3 and R4 can be connected to each other to form a ring structure, is advantageously employed for recording information utilizing a laser beam having a wavelength of 550 nm or shorter.
Patent TW-490639-B (TW)
Title: A software component-container framework for dynamic deployment of business logic components in a distributed object environment
Inventor: TILDEN MARK D
IPC: G06F9/46
Filed: 2000-09-28
Granted: 2002-06-11
Abstract: This application pertains to multi-tiered, distributed computing systems and, more specifically, is directed to a component container middleware framework for dynamic deployment of business logic software components on a CORBA distributed object infrastructure. Each server container includes a configuration file which is read upon initializing the container. The container process loads software components as specified in the configuration file, and the configuration file includes information on names and locations of components creators, and defines relationships among components. The configuration file, expressed in XML syntax, makes it easy to deploy or update business logic components without exposing system source code, while maintaining a robust, scalable distributed system for demanding applications like supporting travel web sites.
Patent TW-526224-B (TW)
Title: High char yield benzoxazine compositions
Inventor: DETTLOFF MARVIN L
IPC: C07D265/16
Filed: 2000-11-04
Granted: 2003-04-01
Abstract: A polybenzoxazine comprised of the reaction product of a mixture comprised of (i) a benzoxazine compound, (ii) a furan compound, (iii) a benzoxazine-furan compound or (iv) combinations thereof, wherein the mixture has a furan ring to benzoxazine ring ratio of at least 0.001 to at most 10. Said mixture forming a polybenzoxazine by heating the mixture for a sufficient time to form the polybenzoxazine.
Patent TW-469562-B (TW)
Title: Pellet picking method and pellet picking apparatus
Inventor: NAKATSU AKIRA
IPC: H01L21/52
Filed: 2000-11-09
Granted: 2001-12-21
Abstract: A pellet picking apparatus for separating a pellet adhered on an adhesive sheet from the sheet and picking the pellet thus separated is provided, which prevents the pellet from being damaged during the pellet picking process without lowering the productivity. This apparatus comprises (a) a stage having a surface with which a lower face of the adhesive sheet is contacted; the pellet being adhered on an upper face of the sheet; the stage having a suction hole that pulls down the sheet; the suction hole having a suction end to be contacted with the sheet on the surface of the stage; the stage being movable in a horizontal plane with respect to a specific reference position; and (b) a collet for holding the pellet by a suction force; the collet having a suction end to be contacted with pellet; the collet being capable of holding the pellet by the suction force at the suction end. When the sheet is placed on the surface of the stage in such a way that the pellet on the sheet is located at the reference position, the collet is controlled to hold the pellet by the suction force at the suction end and at the same time, the stage is controlled to hold the sheet at the suction end of the suction hole and to be moved in the horizontal plane with respect to the reference position to thereby detach the sheet from the pellet. The collet is controlled to pick the pellet thus detached from the sheet.
Patent TW-580625-B (TW)
Title: Electronic map search linking method
Inventor: JENG WEN-HUNG
IPC: G06F17/30
Filed: 2001-01-05
Granted: 2004-03-21
Abstract: The invention relates to an electronic map search linking method. Web user can regularly browse in internet; when there's search action to search engine on demand, the screen with search results will not only show the link list of web sites but display the link icon for electronic map in the bottom. If intending to see the relevant map information of the web site, just pick the link icon and the link icon together with the attached identification code data will link to the electronic map website; after server verifies the identification code with correction, the relevant electronic map data will be transmitted to the computer screen of user. Besides, it is possible to go through the search result screen for connecting to any independent website; then further select the electronic map link icon of the independent website; likewise, it is possible to retrieve the related electronic map information of the website so that internet user can use shorter path and less time to find the most useful information during search of electronic map data.
Patent TW-593586-B (TW)
Title: Coating compositions containing substituted and unsubstituted exomethylene lactone or lactam monomers
Inventor: BRANDENBURG CHARLES
IPC: C09D167/04
Filed: 2001-02-09
Granted: 2004-06-21
Abstract: This invention is directed to a coating composition used for original equipment manufacturing or refinishing uses in the automotive industry, which coating composition utilizes an acrylic polymer which contains substituted or unsubstituted exomethylene lactones or lactams as a comonomer.
Patent TW-530356-B (TW)
Title: Method for fabricating electronic circuit devices
Inventor: IWAHASHI SHINJI
IPC: H01L21/607
Filed: 2001-02-13
Granted: 2003-05-01
Abstract: The purpose of the present invention is to provide a method for fabricating electronic circuit devices capable of ensuring the bonding strength and bonding bumps without occurrence of cratering or other mechanical damages. The solution is to provide a method for fabricating electric circuit devices wherein a semiconductor device 1 having a plurality of bumps formed in an approximate polygonal shape or others on a semiconductor chip is mounted on a mounting board 2, so as to be connected with the circuit pattern of a semiconductor chip. The mounting board 2 includes electrodes 21 formed on a board 20 made of glass-epoxy based or other materials. The method comprises the steps of, first, aligning the bump electrodes 12 with the electrodes 21 and placing the semiconductor device 1 on the mounting board 2; then while pressing from the upside of the semiconductor device 1 to make the bump electrodes 12 and electrodes 21 contact closely, applying an ultrasonic vibration to the semiconductor device with the application direction Dv to be the direction of a diagonal of the semiconductor chip or a direction not parallel with any side of the approximate polygon formed by the arranged bump electrodes; and fusing the bump electrodes 12 and electrodes 21 by the generated heat.
Patent TW-494567-B (TW)
Title: Nonvolatile semiconductor memory device
Inventor: MIKAMI NOBORU
IPC: G11C11/56
Filed: 2001-02-14
Granted: 2002-07-11
Abstract: The inventive nonvolatile semiconductor memory device, rewriting stored information with the quantity of charges of a dielectric material, comprises a ferroelectric film having a hysteresis characteristic in a dependency of an electric field density and an electric field and a nonlinear element electrically connected with the ferroelectric film. In this nonlinear element, the quantity of increase of a positive electric flux density with respect to an electric field is small in a low field region and large in a high field region in a dependency of the electric flux density and the electric field. Thus, it is possible to obtain a nonvolatile semiconductor memory device capable of suppressing dispersion in coercive filed and preventing reduction of voltage resistance without increasing the chip area.
Patent TW-I285217-B (TW)
Title: Vacuum ultraviolet ray-excited light-emitting phosphor
Inventor: ONO KEIJI
IPC: C09K11/80
Filed: 2001-03-20
Granted: 2007-08-11
Abstract: A vacuum ultraviolet ray-excited light-emitting phosphor comprising a compound represented by formula (BaxM1-x)1-0.25yMg1-yAl10+yO17+0.25y as a substrate, and Eu as an activator, wherein M represents Ca, Sr, or Ca and Sr, x and y satisfy the following relations, 0.5 <= x <= 1, and 0.05 <= y <= 0.15.
Patent TW-492170-B (TW)
Title: Thin type IC chip package
Inventor: CHIOU WEN-WEN
IPC: H01L23/28
Filed: 2001-03-26
Granted: 2002-06-21
Abstract: The present invention relates to a thin type IC chip package, which comprises: a carrying plate having a top surface and a bottom surface, the top surface has plural solder pads; at least a chip fixed on the top surface of the carrying plate, the top surface of the chip has plural solder pads and each solder pad has a protruded body respectively; plural solder wires, one end of each solder wire is electrically connected to the solder pad of the carrying plate, the other end of the solder wire is electrically connected to the protruded body in an approximately horizontal way; an adhesion object disposed on the periphery of the top surface of the chip; a lid having an inner surface, the inner surface is adhered to the adhesion object; thereby the lid can cover and be disposed on the top surface of the carrying plate in the manner almost adhering to the chip, so as to achieve the effect of thin type IC chip package.
Patent TW-502189-B (TW)
Title: Inventory allotment managing method and inventory allotment managing system
Inventor: FURIHATA EIICHIRO
IPC: G06Q30/06
Filed: 2001-03-28
Granted: 2002-09-11
Abstract: The present invention creates an order parts list 31 based on the order information 15 to record on a memory storage 21 of computer after allocating the parts existing in an inventory list 32. After the order is confirmed, it also determines whether parts in the order parts list 31 exist in the latest inventory list, and refers to the priority order information 33 indicating the shipment priority order for each part listed on the latest inventory list 32 to create a confirmed parts list 34 reallocating the above parts having the highest priority. In accordance with the construction described above, this invention optimizes the processing to reallocate parts allocated at the time of ordering after the order is confirmed.
Patent TW-540242-B (TW)
Title: Jitter detecting circuit for detecting cycle-to-cycle jitter
Inventor: URUSHIYAMA KENJI
IPC: H04N5/95
Filed: 2001-04-20
Granted: 2003-07-01
Abstract: A jitter detecting circuit firstly compares a target signal (CA/CB) with a reference clock signal (CB/CA) to see whether or not a phase difference takes place between the target signal (CA/CB) and the reference clock signal (CB/CA), and, thereafter, the phase difference in each clock cycle is compared with the phase difference in the previous clock cycle for producing a detecting signal (A/B) representative of cycle-to-cycle jitter when the phase difference is varied.
Patent TW-483800-B (TW)
Title: Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow
Inventor: CLEVENGER LAWRENCE A
IPC: H01L21/308
Filed: 2001-06-04
Granted: 2002-04-21
Abstract: A method of using diamond or a diamond-like carbon layer as a polish-stop for patterning a metal level into an inter-level dielectric substrate using a damascene process flow. The diamond or a diamond-like carbon layer is deposited onto the surface of the substrate before patterning the metal level. A protective layer is then deposited over the diamond or diamond-like carbon polish-stop layer, wherein such protective layer may act as an additional polish-stop layer. Together, the diamond or diamond-like carbon polish-stop layer and the protective layer are used as a hard-mask for patterning the trenches that will become the metal features, wherein such protective layer protects the diamond or diamond-like carbon polish-stop layer during the patterning process. After deposition of a conductive metal layer, the dielectric substrate is polished to remove excess conductive material, as well as topography. In the polishing process, the diamond or diamond-like carbon polish-stop layer and any remaining protective layer are used as polish-stop layers. The diamond or diamond-like carbon polish-stop layer allows for an improved planar surface, thereby resulting in an sufficient decrease in topography at the surface of the inter-level dielectric.
Patent TW-I288424-B (TW)
Title: Inspection apparatus and inspection method
Inventor: NAKASUJI MAMORU
IPC: H01J37/29
Filed: 2001-06-27
Granted: 2007-10-11
Abstract: This invention provides an inspection apparatus and inspection method for inspecting a semiconductor device. The inspection apparatus is adapted for inspecting a test piece such as a wafer, for defectsiAfeature dimension, and surface potential. Charged particles are irradiated from a primary optical system to a test pieceiAand secondary charged particles released from the test piece are separated from the primary optical system and are directed to a detector through a secondary optical system. The irradiation of the charged particles is performed while the test piece is moving. The points of irradiation of the charged particles are so arranged in N rows along the direction of moving of the test piece, and in M columns in the direction perpendicular to the moving direction. Each row of the irradiation points of the charged particles is sequentially offset a given amount in the direction perpendicular to the moving direction of the test piece.
Patent TW-I221999-B (TW)
Title: Medical information system, terminal device for patient, medium
Inventor: IWANO KENJI
IPC: A61B5/00
Filed: 2001-07-13
Granted: 2004-10-11
Abstract: In the past, system for easily reading the data of the bio-information of a patient and so on has not been developed. In a medical information system of the present invention, client (201), servo (203) and host (202) are connected to a network. The host (202) has a sensor for determination of the information as an index of the health condition of a patient, and means for transferring the bio-information from the sensor to the servo (203). The servo (203) has means for statistically storing and arranging the bio-information from the client (201). The host (202) has means for reading the bio-information stored and arranged in the servo (203).
Patent TW-494458-B (TW)
Title: Method and apparatus for manufacturing semiconductor device
Inventor: OZEKI KATSUNARI
IPC: H01L23/522
Filed: 2001-07-18
Granted: 2002-07-11
Abstract: A method for manufacturing a semiconductor device in which a wafer (W) is loaded in a chamber (2) of a CVD apparatus (1), an SiH4 gas, a PH3 gas, and an NF3 gas are supplied into the chamber (2), and a high-density plasma is produced in the chamber (2) by application of high frequency from RF generators (14a, 14b) to form a PSG film. Fluorine radicals originated from the NF3 gas acts as an etchant to suppress overhang in a recess. Therefore the filling ability of a recess of large aspect ratio that a wafer (W) has is improved while maintaining the growth deposition rate of a PSG film.
Patent TW-571132-B (TW)
Title: Bulk internal Bragg gratings and optical device
Inventor: BHAGAVATULA VENKATA ADISESHAIA
IPC: G02B6/34
Filed: 2001-07-31
Granted: 2004-01-11
Abstract: The present invention provides photonic devices utilized in optical telecommunications. The photonic devices include photosensitive bulk glass bodies which contain Bragg gratings, particularly with the ultraviolet photosensitive bulk glass bodies directing optical telecommunications wavelength range bands. Preferably the ultraviolet photosensitive bulk glass bodies are batch meltable alkali boro-alumino-silicate bulk glass bodies. The invention includes an optical communications wavelength device for use with wavelength range bands, with the device comprising an input optical waveguide collimator for collimating an input light beam out of an optical waveguide to provide an unguided input light beam including at least one reflective wavelength range band lambdaR and at least one wavelengths range band lambdan; an internal bulk Bragg grating including a transparent photosensitive bulk optical grating medium with an internal modulated refractive index grating with a grating pattern for reflecting the at least one wavelength range band lambdaR; at least one output coupler for outputting an at least one output wavelength range band; and a substrate structure for securing said bulk Bragg grating relative to the input collimator and the output coupler, with the bulk Bragg grating disposed in the unguided input light beam wherein the at least one wavelengths range band lambdan is transmitted through the bulk Bragg grating and the at least one wavelength range band lambdaR is reflected by the bulk Bragg grating.
Patent TW-I240352-B (TW)
Title: Integrated circuit device of high Q MIM capacitor and manufacturing process thereof
Inventor: LIOU PING
IPC: H01L21/70
Filed: 2001-08-03
Granted: 2005-09-21
Abstract: The present invention provides an integrated circuit device of high Q MIM (metal-insulator-metal) capacitor and manufacturing process thereof. The integrated circuit device containing MIM thin film capacitor of the present invention is characterized in that the thin dielectric layer of the MIM capacitor is composed of a material having relatively high dielectric constant and being an anti-reflection coating (ARC). Thus, while conducting the process of electrode plate for patterning MIM capacitor, depositing an anti-reflection layer on the metal layer won't be necessary, and the thin dielectric layer of the MIM capacitor is used as the anti-reflection layer to save the step of depositing an anti-reflection layer on the metal layer.
Patent TW-I232356-B (TW)
Title: Lithographic projection apparatus, device manufacturing method and device manufactured thereby
Inventor: BANINE VADIM YEVGENYEVICH
IPC: G03F7/22
Filed: 2001-08-24
Granted: 2005-05-11
Abstract: A lithographic projection apparatus comprising a radiation system for supplying a projection beam of radiation, a mask table for holding a mask, a substrate table for holding a substrate and a projection system for imaging an irradiated portion of the mask onto a target portion of the substrate. Either or both of the radiation system and the projection system is supplied with an inert gas at a pressure of from 0.1 to 10 Pa in order to suppress contamination, for example by hydrocarbon molecules, of any optical components in the system(s).