Patent SG-11201808547U-A (SG)
Title: Transfer system for flipping and multiple checking of electronic devices
Inventor: NEO SIONG HUAT
IPC: H01L21/67
Filed: 2016-04-27
Abstract: FIG70 50 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 02 November 2017 (02.11.2017) WIP0 I PCT omit VIII Hot 0 HE Eno iflo oimIE (10) International Publication Number WO 2017/188889 Al (51) International Patent Classification: HO1L 21/67 (2006.01) B65G 47/84 (2006.01) (21) International Application Number: PCT/SG2016/050196 (22) International Filing Date: 27 April 2016 (27.04.2016) (25) Filing Language: English (26) Publication Language: English (71) Applicant: MANUFACTURING INTEGRATION TECHNOLOGY LTD [SG/SG]; Blk 5004, Ang Mo Kio Ave 5, #03-12, TECHplace II, Singapore 569872 (SG). (72) Inventors: NEO, Siong Huat; 64C Eng Neo Avenue, Sin- gapore 289544 (SG). KWONG, Kim Mone; 227 Ponggol 17th Avenue, Northshore Bungalows, Singapore 829694 (SG). LIM, Kok Yeow; 130 Hillview Avenue, #08-01, Sin- gapore 669596 (SG). MAO, Zhi Qiang; Blk 511 Jurong West Street 52, #08-70, Singapore 640511 (SG). (74) Agent: NG, Kim Tean; NANYANG LAW LLC, P.O. Box 1861, Robinson Road Post Office, Singapore 903711 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (54) Title: TRANSFER SYSTEM FOR FLIPPING AND MULTIPLE CHECKING OF ELECTRONIC DEVICES (57) : The present invention includes a transfer system for flipping and checking electronic devices. A first rotary device has a plurality of transfer heads configured to pick electronic devices from a wafer table and place the electronic devices on a transfer head of a second rotary device. Check stations can be positioned around the first and second rotary devices and configured to inspect or check the electronic devices during the flipping process. The transfer system can further include an imaging device to inspect the accuracy of picking and placing of the electronic devices during the flipping process. The wafer table and the first rotary device are inclined to increase the operation space. The system accurately picks, flips and transfers chips at a high operation speed. [Continued on next page] WO 2017/188889 Al MIDEDIMOMOIDEIROIDEMOMMUMMEHOMEMOIMIE GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3))