baber/WOPTO huggingface dataset:
Patent JP-H05340348-A (JP)
Title: Micropiston
Inventor: MIZUNO TOMOKIMI
IPC: B81B3/00
Filed: 1992-06-11
Abstract: PURPOSE:To achieve reduction of sliding friction by forming one part in high wettability and the other part in low wettability of the peripheral surface of a rod reciprocated in a cylinder, so as to micronize a piston-cylinder mechanism. CONSTITUTION:A metal of high wettability and large plasticity relating to fluid is used as a rod 3, and an A part in the rod point end is left to apply coating to a B part except this A part. In the coating, a material of low wettability relating to the fluid is used. This rod 3 is inserted into a cylinder 2, and when the cylinder inside is filled with fluid, the fluid is positioned in the A part of high wettability of the rod 3. When the rod 3 is reciprocated relating to the cylinder 2, the fluid always adheres to the A part of the rod 3, to function as a piston head 1 of the rod 3. Accordingly, when a pressure in one chamber 2a of the cylinder 2 is increased, the rod 3 is moved in a right direction with the fluid piston head 1. When the rod 3 is intruded in a left direction, operating fluid in the inside is extruded.
Patent JP-2000346540-A (JP)
Title: Door structure for refrigerator and manufacture of door
Inventor: UMAKI ATSUSHI
IPC: F25D23/02
Filed: 1999-05-31
Abstract: PROBLEM TO BE SOLVED: To easily manufacture a door structure of a refrigerator by arranging a transparent plate on a front surface of a door surface material, engaging upper and lower caps with upper and lower portions of them to integrate the door surface material with the plate, and mounting a door inside plate on a rear surface of the door surface material. SOLUTION: A transparent plate 28 made of an acrylic resin is arranged on a front surface of a door 14, and side supports 30 each for performing a role of a packing are engaged with both sides of the plate 28. In order to integrally fix the supports 30, the plate 28 and a door surface material, an upper cap 46 and a lower cap 48 are engaged from upward and downward directions of the surface material. Thereafter, window frame members 50 are mounted at four sides of a window 42 of the surface material, and further a door inside plate 56 is arranged on rear portions of these members. Thus, the plate 28 can be easily fixed to the front surface of the door, an edge of the end face of the plate 28 can be protected, and a gap step difference of the surface material can be absorbed.
Patent JP-S5776360-A (JP)
Title: Method of controlling speed shifting operation of automatic transmission
Inventor: ITOU HIROSHI
IPC: F16H61/04
Filed: 1980-10-31
Abstract: PURPOSE:To prevent the feeling of ride from deteriorating due to the sharp return to an accelerator pedal, by keeping a high gear clutch unengaged for a prescribed period from the time when the return speed of the accelerator pedal has exceeded a prescribed level. CONSTITUTION:While the speed of a vehicle is not lower than a predetermined level, a high gear clutch 7 is kept engaged. When the return speed of an accelerator pedal 46 detected by a potentiomter 45 is higher than a prescribed level during that period, the high gear clutch 7 is immediately disengaged and a timer starts operating. Throughout the operation of the timer, the high gear clutch 7 is kept unengaged and the flucutuation in the transmitted torque of a driving system is absorbed by a fluid-type converter 1 to prevent the jolt of the vehicle body which would deteriorate the feeling of ride.
Patent JP-S6043470-A (JP)
Title: Low-alloy steel for shaft of turbo-electric generator
Inventor: UCHIDA KIYOSHI
IPC: C22C38/00
Filed: 1983-08-19
Abstract: PURPOSE:To obtain at low cost the titled low-alloy steel with superior strength and toughness by adding specified percentages of C, Si, Mn, P, Cr, Ni, Mo, V, Al and N to Fe. CONSTITUTION:A molten steel consisting of, by weight, 0.15-0.30% C, <=0.10% Si, 0.80-2.50% Mn, <=0.010% P, 0.30-2.00% Cr, <=0.20% Ni, 0.10-0.50% Mo, 0.05-0.15% V, 0.003-0.030% Al, 0.0050-0.0150% N and the balance Fe with inevitable impurities is refined and cast into an ingot. This ingot is hot forged, annealed, and refined by hardening and tempering to obtain an inexpensive low- alloy steel for the shaft of a turbo-electric generator.
Patent JP-H08319395-A (JP)
Title: Thickening of emulsion
Inventor: YANAKA TETSUO
IPC: C08F18/02
Filed: 1995-05-25
Abstract: PURPOSE: To effectively thicken an emulsion to a emulsion excellent in viscosity characteristics such as thixotropy and leaving stability and useful for various kinds of uses by adding a specific acetoacetic acid ester group-containing polyvinyl alcohol-based resin thereto. CONSTITUTION: (A) An acetoacetic acid ester group-containing polyvinyl alcohol containing (A1 ) <=2wt.%, especially <=0.5wt.% acetic acid salt of an alkali metal and (A2 ) <=5wt.%, especially <=2wt.% acetic acid and having 0.01-100, especially 0.01-10 weight ratio of A1 /A2 is added to (B) an emulsion having 30-60wt.% concentration of a resin content (B1 ), preferably in an amount of the component A of 0.02-50 pts.wt. based on 100 pts.wt. of the component B1 .
Patent JP-H11329664-A (JP)
Title: Surge absorbing element and its manufacture
Inventor: SAITO KAZUHIRO
IPC: H01T21/00
Filed: 1998-05-15
Abstract: PROBLEM TO BE SOLVED: To provide a surge absorbing element, capable of being reduced in size and being changed into an SMD, and easy in manufacture, and its manufacturing method. SOLUTION: In this surge absorbing element, gaps between coil rings formed into a spiral shape out of a conductive film on an inner surface of a cylindrical insulator layer 2 and insulated from neighboring coil rings, serve as discharge gaps. This surge absorbing element is manufactured by a means to cut a thread in a double-structured cylinder having an insulator layer 2 around a conductor layer 1, or a means to form a conductor layer and an insulator layer on a spiral core in order on concentric circles.
Patent JP-H04351369-A (JP)
Title: Shifting control device for automatic transmission of car
Inventor: TABATA ATSUSHI
IPC: F16H61/02
Filed: 1991-05-28
Abstract: PURPOSE:To improve the rate of fuel consumption associate with shift control by altering the shift position setting so that the low speed position as easy to execute the half-lock control is used frequently in the car running condition where half-lock control of lockup clutch is admissible. CONSTITUTION:When the car running condition lies within a certain specified range, half-lock control of a lockup clutch is executed. In this shift control device, a means A judges whether the current running condition is such that the half-lock control is admissible. If yes, the low speed position as easy to execute the half-lock control shall be used frequently-if situation is such that the half-lock control is restricted, the high speed position is used frequently. This is made by changing their shift position settings by a means B. That is, the half-lock control is used frequently in the low speed position which gives better rate of fuel consumption.
Patent JP-S635956-A (JP)
Title: Electrode fixing member for electrode head
Inventor: OTANI MITSUHIRO
IPC: B41J2/425
Filed: 1986-06-27
Abstract: PURPOSE:To provide electrode needles with a high density to conduct a high- accuracy recording, by a method wherein an electrode fixing member for an electrode head consists of lublicating inorganic powder and silicone resin. CONSTITUTION:An electrode fixing member for an electrode head consists of lublicating inorganic powder and silicone resin. The inorganic powder in sue has a flat particle structure and preferably has, a 1-3 low Mohs hardness in the light of the lublicating properties and wearability; particularly, hexagonal boron nitride and talc are most preferably used for the heat stability in the air and the lublicating properties and wearability. The mixture of the lublicating inorganic powder and the silicone resin set at a baking temperature of 380 deg.C or higher. The fixing member has appropriate wearability and a good heat resistance and flexural strength, thus enabling a good print recording properties without damaging the discharge breakdown recording paper. Therefore, an electrode head of the type wherein an electrode needles 11 is projected but exposed from fixing portions 12, 13, i.e. from the electrode head, can be provided; in this manner, the recording needles 11 can be provided with a high density to enable a high-accuracy recording.
Patent JP-H05340992-A (JP)
Title: Integrated circuit device
Inventor: IWAMOTO HIROMI
IPC: G01R31/26
Filed: 1992-06-11
Abstract: PURPOSE:To facilitate the measurement of characteristics of a check transistor both in chip state and can sealed state. CONSTITUTION:A check transistor 1 is connected, at one end thereof, with VDD terminal 4 and, at the other end thereof, with GND terminal 5. An I/O terminal 2 is then switched, based on a switching signal 13 applied on a test terminal 3, from circuits 7, 8 to the control electrode of the check transistor by means of electronic switches 6, 6a. A test voltage is then applied on the I/O terminal 2 and current or voltage appearing between the VDD terminal 4 and the GND terminal 5 is measured. Since a terminal (pad) being employed in the measurement of transistor characteristics has wide area, probe can be connected easily and measurement can be made even after can sealing.
Patent JP-S6130762-A (JP)
Title: Ultrasonic flaw detection method and apparatus
Inventor: HIRASAWA TAIJI
IPC: G01N29/11
Filed: 1984-07-23
Abstract: PURPOSE:To enable to detect the presence of a surface defect at the joint part, by transmitting an ultrasonic wave to and receiving it from the joint part of a central flange from various angles on both sides tops of a base section of an object to be inspected to obtain echo information while positional information is found at transmitting and receiving points. CONSTITUTION:An ultrasonic beam BA1 is radiated to a groove 4 from an ultrasonic vibrator of an ultrasonic probe 13 at the axial position PA1 and the circumferential position QA1 at a distance lA1 from the center of a web 2 at a key groove section (corresponding to the flange joint part at the base section) 4 and the reflected beam BB1 received from a defect 5 with an ultrasonic vibrator of an ultrasonic probe 18 located at the position PB1 and QB1 to obtain peak values and beam course data while position data (lA1+lB1)/2 is obtained from a probe position detector. The probes 13 and 18 are also moved to the positions PA1, PAn, PB1 and PBn and QA1, QAn, QB1 and QBn respectively to obtain similar data while circumferential and axial sectional images are displayed on a CRT.
Patent JP-H09327395-A (JP)
Title: Heat insulating cooking vessel
Inventor: HATSUMOTO KUNIO
IPC: A47J39/00
Filed: 1996-06-13
Abstract: PROBLEM TO BE SOLVED: To provide a heat insulating cooking vessel which can be carried with one hand and is convenient for a carry and by which looseness and positional dislocation in an engaging part of a lock mechanism can be reduced and whose cover is reliably locked in a closed condition even at carrying time and cooking pot is housed in a heat insulating vessel in a stable condition. SOLUTION: A lock member is protrusively formed on at least a single member of a heat insulating vessel cover 37, a cooking pot main body, a cooking pot grip 43 or a cooking pot cover, and a lock engaging part to press the lock member by engaging with this lock member is arranged in a heat insulating vessel grip 38. An engaging part 44 to engage with at least a single part of this heat insulating vessel 32, the heat insulating vessel cover 37 or the heat insulating vessel grip 38 when the heat insulating vessel cover 37 is closed after this cooking pot is housed in the heat insulating vessel 32, is arranged in a part of a cooking pot, and a heat insulating cooking vessel is constituted.
Patent JP-H113968-A (JP)
Title: Multilayered structured lsi
Inventor: UCHIDA KOICHI
IPC: H01L25/065
Filed: 1997-06-11
Abstract: PROBLEM TO BE SOLVED: To form an LSI into an LSI, which is good in packaging efficiency, by a method wherein first and second semiconductor chips laminated in such a way that the fellow electrode pads of the chips are electrically connected with each other are encapsulated in a single integrated package. SOLUTION: A first LSI chip 6 is mounted on an island 5 and, moreover, a second LSI chip 7 is mounted on the island 5 in such a way as to opposite to the chip 6. Moreover, external pads provided on the chip 7 are electrically connected with external terminals 2 to encapsulate these chips in a plastic mold 1. That is, the chips 6 and 7 laminated in such a way that the fellow electrode pads of the chips 6 and 7 are electrically connected with each other are encapsulated in the single integrated package. In such a way, the chip 7 is mounted on the chip 6, and the fellow internal pads of the chips 6 and 7 are electrically connected with each other to constitute an LSI into a two-step structure.
Patent JP-H11346330-A (JP)
Title: Image pickup device
Inventor: HAYASHI YOSHIHIKO
IPC: G03B41/00
Filed: 1998-06-02
Abstract: PROBLEM TO BE SOLVED: To provide an image pickup device that corrects the sensitivity easily and efficiently without making the device complicated. SOLUTION: A light collection optical section 21 that has a plurality of pixels and receives an external light with a plurality of the pixels, a dome 12 that covers surrounding of the light collection optical section 21 and a plurality of sensitivity correction faces 14a, 14b are placed on an inner face of the dome 12 and have different emission rates. The light collection optical section 21 is directed to the sensitivity correction faces 14a, 14b to correct outputs of the pixels in the sensitivity correction faces 14a, 14b by matching the outputs.
Patent JP-H07335678-A (JP)
Title: Mold of element
Inventor: JIYOOJI JIEI SHIEBUITSUKU
IPC: H01L31/0203
Filed: 1995-05-29
Abstract: PURPOSE: To prevent leak of mold compound from circumference of mold cavity, by forming a seal to the vicinity of lead with a deformable material arranged at a recess of the mold. CONSTITUTION: In order to determine a molding volume filled with a mold compound, a first and a second mold sections are arranged at the surface provided opposed respectively to the integrated circuit chips 12, 13 and lead frame 15. The boundary region of both molding sections is formed of the isolated surfaces of both molding sections at the opposed surface of a plurality of isolated leads 31, and one of both molding sections has recesses 20 to 23 extending along the boundary lead. Moreover, the deformable materials 26 to 29 which are arranged to the recesses 20 to 23 and extending therefrom in the predetermined amount are also provided. When both molding sections are pushed with each other, the deformable materials 26 to 29 are deformed to form the seal in the vicinity of the isolated leads 31.
Patent JP-S5485487-A (JP)
Title: Method of positioning a billet
Inventor: ENDOU TOSHIO
IPC: B21B25/00
Filed: 1977-12-21
Abstract: PURPOSE: To determine the center position of a guide hole in a billet so that the pipe thickness becomes even in all directions irrespective of the unevenness of deformation resistance determined from the surface temperatures and the material of the billet.  
     CONSTITUTION: Thermomenters 21W24 are arranged around a billet 1 so as to measure the surface temperatures thereof at two places or more. An arithmetic unit 3 determines the position of a guide hole in the billet 1 section on a basis of deformation resistances determined by the surface temperatures observed and the material of the billet 1. The position of the said guide hole is calculated by the said arithmetic unit 3 so that the thickness of a pipe prepared from the said billet 1 by piercing from the said hole by means of a piercing machine becomes even corresponding to the deformation resistance at the said temperature-measuring points. The calculated values are sent to a billet-positioning unit 4 so as to position the billet, and the billet being pierced at even thickness irrespective of uneven temperature distribution. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S5580344-A (JP)
Title: Manufacture of semiconductor integrated circuit
Inventor: FURUKAWA AKIHIKO
IPC: H01L21/331
Filed: 1978-12-13
Abstract: PURPOSE:To obtain a high dielectric strength by the structure such that a dielectric film is provided on the I<2>L forming region of a semiconductor substrate, an epitaxial layer is grown on the entire surface, a dielectric film is provided on a linear transistor forming region, an epitaxial layer is grown again, and different functional elements are produced by different levels of layers. CONSTITUTION:Two n<+>-type buried-in regions 4 are formed by diffusion on p- type Si substrate 1, and epitaxial n-type layer 2a is grown on the entire surface. On one region 4, SiO2 film 14 is provided on the surface of the I<2>L forming region only. Next, epitaxial n-type layer 2b is grown on the entire surface again. On the other region 4, the linear transistor forming region is covered with SiO2 film 15, n-type impurity ions are injected into exposed layer 2b, and n-type layer 16 is formed. Subsequently, film 15 is removed, and the surface where there are level differences is coated with SiO2 film 18 again, and openings are made at specified places. In this way, an IC is formed in which I<2>L and a linear transistor, with p<+>-type separation region 3, n-type collector region 13 of linear transistor, and deep I<2>L region 13.
Patent JP-H01319952-A (JP)
Title: Heat block for wire bonding device
Inventor: OMAE SEIZO
IPC: H01L21/60
Filed: 1988-06-20
Abstract: PURPOSE:To heat a die pad section and an inner lead section at an optimum temperature by separately forming a heater block body heating the die pad section and inner lead section of a lead frame and interposing a thermal insulation plate between both heat blocks. CONSTITUTION:First and second heat block bodies 11, 12 are juxtaposed so that heat transfer surfaces 11a, 12a are arranged onto the same plane. A thermal insulation plate 13 is interposed between the main bodies 11, 12 so that the heat of one main body 11 is not conducted to the other main body 12. The main body 11 is heated at an optimum temperature required for connecting electrodes on semiconductor dies 3 and metallic small-gage wires 4, and the main body 12 is heated at an optimum temperature needed for bonding stitch leads 1b and the small-gage wires 4, thus heating the electrodes on the dies 3 and the leads 1b at respectively optimum bonding temperatures. Accordingly, die pad sections 1a and inner lead sections are heated at an optimum temperature.
Patent JP-S6043177-A (JP)
Inventor: RAN TEURA TEURIN
IPC: F02P5/15
Filed: 1984-07-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S5580846-A (JP)
Title: Magnetic recorder/reproducer
Inventor: ONO NATSUMI
IPC: G11B15/66
Filed: 1978-12-11
Abstract: PURPOSE: To facilitate an easy loading of the tape as well as to avoid occurrence of the hunting by providing the shaft of tape guide to the tip of the tension arm and then fixing the tension arm through rotation of the cam when the shaft is pressed by the rotatable cam provided separately.  
     CONSTITUTION: Tape 9 passes through the surface of tape guide 4a at the tip of tension arm 3a from reel 1 and is then guided to take-up reel 20 via tape guide 12a, pitch roller 13a, tape shifter 25a and reversing roller 17 each, Tension arm 3b features the same structure of arm 3a. While the tape is running, arm 3b is guided to axle 2b provided to substrate 26. On the other hand, projections 21b and 22b of cam 7b which rotates centering on axle 6b are pressed by plate spring 10. To fix arm 3a, arm 3a is pressed by hand. Thus cam 7a rotates to make projections 22a and 23a hit spring 10, and then axle 4a is fitted to V-shaped notch 24a of cam 7a to be fixed. As a result, the hunting can be avioded for arm 3a. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S6131025-A (JP)
Inventor: IKUMOTO MINORU
IPC: A01G9/00
Filed: 1984-07-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H05339925-A (JP)
Title: Power generation facility by use of cross-flow type water wheel
Inventor: NIIHAMA HITOSHI
IPC: E02B9/00
Filed: 1992-06-12
Abstract: PURPOSE:To reduce noises, by providing a sound-insulation wall separating the space above the water level of the cross-flow water wheel side from the space of the discharge opening side in the delivery bank. CONSTITUTION:The delivery pipe 3 of a cross-flow water wheel 2 is positioned at the higher level than the water level WL of a delivery bank 4. A soundinsulation wall 9 is extended downwards along the full width of the delivery bank 4 from the ceiling 8 of the bank 4. The sound-insulation wall 9 is submerged at the lower end thereof to cut off the connection of the space 6 above the water level WL, at the cross-flow water wheel side. Accordingly, even if noises are brought about when operating the water wheel 2, as the noises are enclosed into the space 5 at the water wheel side by the sound- insulation wall 9, the noises generating from the discharge opening 7 can be reduced.
Patent JP-2000342214-A (JP)
Title: Sour agent with improved taste
Inventor: TAMIYA TOSHITOMO
IPC: A23L27/00
Filed: 1999-06-01
Abstract: PROBLEM TO BE SOLVED: To obtain a sour agent widely applicable to food as a result of improved taste, and to provide a new use of raffinose formulated in this sour agent. SOLUTION: This sour agent is obtained by formulating a sour agent with raffinose as a kind of oligosaccharides. Thereby the taste peculiar to the original sour agent can be mitigated, and this sour agent thus obtained is improved in taste so significantly as not to affect the fanciness (deliciousness and gustatoriness) of a food when applied to the food.
Patent JP-H1062819-A (JP)
Title: Liquid crystal display device and its production
Inventor: HON GIYU KIMU
IPC: G02F1/1343
Filed: 1997-06-11
Abstract: PROBLEM TO BE SOLVED: To improve an opening rate by providing the display device with gate electrodes which are disposed between the source regions and drain regions of first semiconductor layers and come into contact with respective gate lines, common electrode lines which come into contact with second semiconductor layers, are disposed in the lower parts of the respective data lines and are used for storage capacitor electrodes and pixel electrodes which come into contact with the drain regions of the first semiconductor layers and are disposed in the respective pixel regions. SOLUTION: The first semiconductor layers 41a having the source regions and the drain regions and the second semiconductor layers 41b which are used as the electrodes of the storage capacitors are formed in island patterns in the respective pixel regions on a substrate formed with the gate lines 49 and the data lines 51. The gate electrodes 44a which come into contact with the gate lines 49 and the common electrode lines 44b which come into contact with the second semiconductor layers 41b in the lower parts of the data lines 52 are formed between the source regions and drain regions of the first semiconductor layers 41a. The common electrode lines 44b overlap on the data lines 52. Further, the pixel electrodes 46 in contact with the drain regions of the first semiconductor layers 41a are formed in the pixel regions.