baber/WOPTO huggingface dataset:
Patent TW-201540676-A (TW)
Title: Food industry combined wastewater treatment method
Inventor: KIN KON-TSU
IPC: C02F9/14
Filed: 2014-04-23
Abstract: The present invention provides a method for treating complex combined wastewater which is collected from various sources in the food industry. The combined wastewater contains impurities of suspended solids, organic substance, ammonia nitrogen, and total nitrogen, and may further contain total phosphorus; however, it basically contains no or little grease that will not interfere with microbial treatment. First of all, the combined wastewater is subjected to a treatment for removing suspended solids; next, conducting a decomposition treatment with anaerobic microorganisms to make the contained organic impurities partly decompose; then, conducting a decomposition treatment by combining oxygen-free or aerobic microorganisms to make the residual organic substance, ammonia nitrogen, total nitrogen and possibly existing total phosphorus further removed, followed by using a thin film for solid-liquid separation to obtain treated water capable of discharging safely or recycling. This invention further includes steps for individual treatment of grease-containing wastewater and an integration of this individually treated wastewater into the combined wastewater treatment method. This invention also provides a method for treating combined wastewater containing large amount of grease, in which an air-floatation and grease-removing means is further incorporated.
Patent TW-201500218-A (TW)
Title: Adhesive tape for semiconductor wafer protection
Inventor: OKURA MASATO
IPC: C09J7/29
Filed: 2014-04-25
Abstract: Provided is an adhesive tape for semiconductor wafer protection, which has heat resistance and thermal shrinkage resistance, and which is not fusion-bonded to a chuck table or is not excessively shrunk even if exposed to high heat during a gas etching step or a plasma dicing step. An adhesive tape for semiconductor wafer protection, which is characterized by comprising a base film and an adhesive layer that is formed on one surface of the base film, and which is also characterized in that the base film has a cast film layer that contains a cured resin and serves as the outermost layer on a side on which the adhesive layer is not formed, and that the cast film layer has a tackiness of 100 kPa or less at 200 DEG C, is used. Alternatively, an adhesive tape for semiconductor wafer protection, wherein the base film is formed only of the cast film layer, may be used.
Patent TW-201506654-A (TW)
Title: Rules visualization using an expression tree
Inventor: DESHPANDE AMOL B
IPC: G06F9/40
Filed: 2014-04-25
Abstract: Representing a business rule by: (i) determining an expression tree corresponding to the business rule; and (ii) displaying the expression tree. The business rule is a business rule used in one or more OLAP cubes and can be debugged and/or edited through an OLAP utility.
Patent TW-201541151-A (TW)
Title: Display panel
Inventor: HUANG I-HUA
IPC: G02F1/1333
Filed: 2014-04-29
Abstract: A display panel is disclosed, which comprises: a first substrate; a second substrate opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a shielding pattern disposed on the second substrate and comprising an opening region and a shielding region; and a first aggregation layer disposed on a side of the first substrate facing to the second substrate, wherein a roughness of the first aggregation layer corresponding to the opening region of the shielding pattern is larger than that corresponding to the shielding region thereof.
Patent TW-201517111-A (TW)
Title: Ion milling device
Inventor: KANEKO ASAKO
IPC: H01J37/31
Filed: 2014-05-15
Abstract: The present invention relates to an ion milling device that conducts processing by irradiating a sample with an ion beam, an objective of the current invention being to provide an ion milling device that is capable of highly precisely controlling the temperature of a sample regardless of deformations or the like in the sample during irradiation by the ion beam. Proposed is, for example, an ion milling device provided with at least one of: a shielding material support member that supports a shielding material that shields one part of the sample from the ion beam while the sample is exposed to the ion beam; a movement mechanism that, during irradiation with the ion beam, moves a contact surface of a sample platform with the sample in accordance with the deformation of the sample, the movement mechanism having a temperature control mechanism that controls the temperature of the shielding material support member and/or the sample platform; and a sample support member that is disposed between the shielding material and the sample and that, during irradiation with the ion beam, is deformed in accordance with the deformation of the sample.
Patent TW-201515157-A (TW)
Title: Method for reducing growth of non-uniformities and autodoping during column III-V growth into dielectric windows
Inventor: LAROCHE JEFFREY R
IPC: H01L21/86
Filed: 2014-06-27
Abstract: A method for depositing a column III-V material over a selected portion of a substrate through a window formed in a dielectric layer disposed over the selected portion of the substrate. The method includes forming a single crystal layer or polycrystalline layer over a field region of the dielectric layer adjacent to the window; and, growing, by MOCVD, a column III-V material over the single crystal layer or polycrystalline layer and through the window over the selected portion of the substrate.
Patent TW-201509813-A (TW)
Title: Process for obtaining precipitated calcium carbonate
Inventor: MAURER MARC
IPC: C01F11/18
Filed: 2014-07-18
Abstract: The present invention provides a process for preparing a precipitated calcium carbonate product comprising the steps of: (a) preparing an aqueous suspension of precipitated calcium carbonate seeds by carbonating a suspension of Ca(OH)2 in the presence of 0.005 to 0.030 moles of Sr, in the form of Sr(OH)2, per mole of Ca(OH)2, (b) dewatering and dispersing the precipitated calcium carbonate seeds prepared in step (a) to obtain an aqueous suspension of precipitated calcium carbonate seeds having a d50 of less than or equal to 0.1 to 0.3 [mu]m and a BET specific surface area of 10 to 30 m2/g, and (c) forming an aqueous suspension of a precipitated calcium carbonate product by carbonating a slurry of Ca(OH)2 in the presence of 0.5 to 5 % by dry weight of the precipitated calcium carbonate seeds obtained in step (b), wherein the precipitated calcium carbonate seeds have a d50 that is less than the d50 of the precipitated calcium carbonate product and the precipitated calcium carbonate seeds have an aragonitic polymorph content greater than or equal to the precipitated calcium carbonate product obtained in step (c) characterized in that the dewatering of step (b) is carried out by the use of a tube press.
Patent TW-201519353-A (TW)
Title: Substrate processing apparatus
Inventor: KWAK JAE-CHAN
IPC: H01L21/67
Filed: 2014-07-30
Abstract: A Disclosed is a substrate processing apparatus which is capable of improving uniformity of thin film to be deposited onto a substrate, and also freely adjusting productivity, wherein the substrate processing apparatus may include a process chamber for providing a process space; a substrate supporter, which is rotatably provided in the process space, for supporting at least one substrate; a chamber lid confronting the substrate supporter, the chamber lid for covering an upper side of the process chamber; and a gas distributing part for spatially separating the process space into first and second reaction spaces, and inducing the different kinds of deposition reactions in the respective first and second reaction spaces, wherein the gas distributing part is provided in the chamber lid.
Patent TW-201530843-A (TW)
Title: Device and method for stacking units for secondary battery
Inventor: MIN KI-HONG
IPC: H01M10/04
Filed: 2014-08-11
Abstract: Provided is a unit stacking device for a secondary battery, which stacks one or more first radical units having a first size and one or more second radical units having a second size greater than the first size and includes a stack jig, which includes a first inner space having a size corresponding to the first size and a second inner space disposed above the first inner space and communicating with the first inner space and having a size corresponding to the second size. The first radical units are stacked in the first inner space through the second inner space, and then, the second radical units are stacked in the second inner space.
Patent TW-201608929-A (TW)
Title: Light emitting diode lamp with burnable function and lamp string and system for the same
Inventor: PENG WEN-CHI
IPC: H05B33/08
Filed: 2014-08-29
Abstract: A light emitting diode lamp includes at least a light emitting diode and a light emitting diode driving apparatus electrically connected to the light emitting diode. The light emitting diode driving apparatus includes a positive contact and a negative contact. The light emitting diode driving apparatus receives a burn start signal sent through the positive contact and a burn address data sent through the positive contact. The light emitting diode driving apparatus is configured to burn the burn address data into the light emitting diode driving apparatus after the light emitting diode driving apparatus receives the burn start signal.
Patent TW-201529901-A (TW)
Title: Electrolytic copper foil, flexible circuit board and battery
Inventor: SAITO TAKAHIRO
IPC: C25D7/06
Filed: 2014-09-09
Abstract: Provided is an electrolytic copper foil having flexibility and strength appropriate for a circuit board or a battery. The present invention relates to an electrolytic copper foil used for a circuit board or a battery wherein a peak value of nitrogen (N), sulfur (S), or chlorine (Cl) existing at a position of a depth dp[[mu]m] satisfying 0.3x ≥ dp ≥ 0.7x exists in each strength profile of N, S, or Cl shown in secondary ion mass spectrometry (SIMS) measured in the thickness direction from an S surface or an M surface of the electrolytic copper foil of the thickness x[[mu]m]. Preferably, if the strength (number of counts) refers to I(dp), and the strengths deviated by x/8 from the thickness dp representing the peak value refers to I(dp-x/8) and I(dp+x/8), the electrolytic copper foil satisfies I(dp) ≥ 100, I(dp-x/16) ≥ 1.5 x I(dp-x/8), I(dp+x/16) ≥ 1.5 x I(dp+x/8), I(dp) ≥ 1.5 x I(dp-x/8), I(dp) ≥ 1.5 x I(dp+x/8).
Patent TW-201601743-A (TW)
Title: Peripheral KAPPA opioid receptor agonists for preventing, inhibiting or treating nausea and vomiting
Inventor: CHALMERS DEREK T
IPC: A61K38/07
Filed: 2014-10-28
Abstract: A method for preventing, inhibiting or treating nausea and/or vomiting in a mammalian subject, the method comprising administering an effective amount of a peripherally-restricted kappa opioid receptor agonist to the subject. The nausea and/or vomiting can be associated with use of an opioid, such as morphine or fentanyl. The peripherally-restricted kappa opioid receptor agonist can be an L-amino acid-containing peptide, a D-amino acid-containing peptide, or a synthetic peptide amide, such as for instance, D-Phe-D-Phe-D-Leu-D-Lys-[[omega](4-aminopiperidine-4-carboxylic acid)]-OH (CR845).
Patent TW-201616993-A (TW)
Title: Shoe and sole structure thereof
Inventor: CHEN TE-SHENG
IPC: A43B13/14
Filed: 2014-11-07
Abstract: A sole structure includes a forefoot portion and a heel portion. The heel portion connects the forefoot portion. The extending surface of the bottom side of the forefoot portion and the heel portion collectively define an angle which is larger than 10 degrees. The present invention further provides a shoe including the sole structure.
Patent TW-201541500-A (TW)
Title: Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program
Inventor: KANEKO SATOSHI
IPC: H01L21/683
Filed: 2014-11-25
Abstract: The present invention relates to a substrate processing apparatus capable of excellently processing a substrate by increasing uniformity of temperature if the substrate is processed with processing fluid with a temperature different from the temperature of a surface of a substrate. According to the present invention, a first nozzle (24), while moving to an outer side of the substrate (3) toward a predetermined position (an entire area finishing treatment position (P5)) of an outer circumferential portion of a substrate (3) from a predetermined position, an entire area treatment starting position (P2), of a central portion of the substrate (3), processes the substrate (3) by discharging processing fluid with a temperature different from the temperature of a surface of the substrate (3). After the first nozzle (24) is moved to an inner circumferential side of the substrate (3) toward a predetermined position, an outer circumferential area treatment starting position (P6) of an outer circumferential side from the entire area treatment starting position (P2), while the first nozzle (24) moves to an outer circumferential side of the substrate (3) toward a predetermined position (an outer circumferential area treatment stop position (P7)) of the substrate (3) from the outer circumferential area treatment starting position (P6), a substrate outer circumferential area treatment for processing the substrate (3) is performed by discharging processing fluid toward the substrate (3) from the first nozzle (24).
Patent TW-201533332-A (TW)
Title: Expansion anchor having anti-rotation means
Inventor: DIJKHUIS ARJEN DETMER
IPC: F16B13/06
Filed: 2014-12-09
Abstract: The invention relates to an expansion anchor comprising a bolt and an expansion sleeve surrounding the bolt, said bolt having: an expansion cone in the region of the front end of the bolt, which expansion cone radially enlarges the expansion sleeve when moved into same; a threaded section for introducing tensile forces into the bolt; a shoulder that limits a movement of the expansion sleeve away from the expansion cone; and at least one anti-rotation protrusion for inhibiting a rotation of the expansion sleeve in relation to the bolt, said protrusion originating at the shoulder and protruding radially outwards on the bolt. According to the invention, the axial length of the anti-rotation protrusion is smaller than the pitch of the threaded section arranged on the bolt.
Patent TW-201530259-A (TW)
Title: Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device and electronic device
Inventor: KATO KEITA
IPC: G03F7/004
Filed: 2015-01-06
Abstract: The invention relates to a pattern forming method. The pattern forming method includes a step of forming a film by using an actinic ray-sensitive or a radiation-sensitive resin composition, wherein the actinic ray-sensitive or the radiation-sensitive resin composition contains a resin (A) which exhibits an increased polarity and a decreased solubility in a developer containing an organic solvent by an action of an acid, a compound (B) which generates an acid by irradiation of a specific actinic ray or radiation; and a solvent (C); a step of exposing the film; and a step of developing the exposed film by using a developer containing an organic solvent, wherein the resin (A) has a structure in which a polar group is protected by a leaving group which decomposes and leaves by an action of an acid, and the leaving group is represented by the following formula (I).
Patent TW-201526830-A (TW)
Title: Continuous fastener chain length measuring device
Inventor: KUSE KAZUKI
IPC: A44B19/42
Filed: 2015-01-07
Abstract: A continuous fastener chain length measuring device is provided, which applies fixed tension so that length measuring accuracy can be stabilized. The continuous fastener chain length measuring device 20 includes: a length measuring portion 30 configured to measure distance of transporting length of a continuous fastener chain C1; a tension applying portion 40 configured to apply tension to the continuous fastener chain C1; and a tension detecting portion 50 configured to detect tension applied to the continuous fastener chain C1. The tension applying portion 40 controls the tension applied to the continuous fastener chain C1 to be fixed according to the tension detected by the tension detecting portion 50.
Patent TW-201627188-A (TW)
Title: Chassis and vehicle using same
Inventor: WU E-IN
IPC: B62D21/15
Filed: 2015-01-19
Abstract: A chassis for a vehicle includes a chassis body and a protective device. A sliding rail is formed in the chassis body. The sliding rail includes a base body and a bending portion extending from one end of the base body. The bending portion is positioned adjacent to a head of the vehicle. The protective device includes a protective board. The protective board is coupled with the bending portion. The protective device is capable of moving relative to the chassis body when collided by an object. The disclosure also supplies a vehicle using the chassis.
Patent TW-201630005-A (TW)
Title: Joining method of iron core of transformer and a fixture and a product thereof
Inventor: CHIOU YUANG-CHERNG
IPC: H01F27/26
Filed: 2015-02-13
Abstract: A joining method of the iron core in the transformer is used to remain a strong joint in the long term. The joining method of this invent includes the following steps: the faying surface of the iron cores is in contact with each other; these iron cores are heated to a preheating temperature; a metal part is used to rub the faying surfaces in these cores, so that the friction surface of this metal part is formed a semisolid state; and then separate this metal part and these cores, so that part of semisolid metal remains on the faying surface of the cores to join these cores; wherein the difference between the preheating temperature of the iron cores and the semisolid temperature of the metal part is less than or equal to 200 DEG C. Joining method for the implementation of the core bonding fixture is also disclosed.
Patent TW-201546947-A (TW)
Title: Wafer-handling end effectors
Inventor: INGRAM-GOBLE ROBBIE
IPC: H01L21/683
Filed: 2015-03-03
Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors, are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.
Patent TW-201633687-A (TW)
Title: Control circuit and method of flyback power converter
Inventor: CHEN YU-CHANG
IPC: H02M3/335
Filed: 2015-03-09
Abstract: A control circuit of flyback converter adaptively adjusts the minimum conducting time of the power switch according to at least one information of input voltage and an output voltage, preventing the flyback converter from generating a phenomenon of extremely high output voltage or losing control due to feedback control failure during light load.
Patent TW-201640977-A (TW)
Title: Build-up multilayer laminate
Inventor: HUANG TANG-JIE
IPC: H05K3/46
Filed: 2015-05-15
Abstract: A build-up multilayer laminate comprises a core layer structure, a first polyimide photoresist layer through light curing, and a first build-up structure. The core layer structure comprises an insulation layer and at least one first conductive layer formed on the insulation layer. The first conductive layer has a plurality of first conductive wires separated from each other. The first polyimide photoresist layer through light curing is formed on the first conductive layer and formed by the lithography with polyimide photoresist, and comprises at least one photosensitive opening for exposing corresponded first conductive wire. The first build-up structure comprises a first build-up sheet formed on the polyimide photoresist layer after light curing and a second conductive layer formed on the first build-up sheet.
Patent TW-201628154-A (TW)
Title: Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the same
Inventor: KIM SEUNG-JEE
IPC: H01L23/488
Filed: 2015-05-25
Abstract: A package substrate includes a core layer, first external interconnection lines on a top surface of the core layer, and internal interconnection lines. The first external interconnection lines include a first outermost external interconnection line on an edge of the core layer, and the internal interconnection lines include an outermost internal interconnection line in the edge of the core layer. A first bonding pad is disposed on the first outermost external interconnection line and exposed in a first bonding region of the core layer. A second bonding pad is disposed on the outermost internal interconnection line and exposed in a second bonding region of the core layer. The first bonding region is spaced apart from a chip attachment region by a first distance, and the second bonding region is spaced apart from the chip attachment region by a second distance greater than the first distance.
Patent TW-201606614-A (TW)
Title: Touch sensor substrate, touch panel, display device, and method for manufacturing touch sensor substrate
Inventor: GOTO HIROKI
IPC: H01B13/00
Filed: 2015-06-23
Abstract: A touch sensor substrate is equipped with: a base material having a first electrode placement surface, which is one example of a first surface; and first electrodes, which are one example of multiple electrodes positioned on the first surface. Each of the multiple first electrodes is equipped with a bottom surface in contact with the first surface, a top surface exposed from the first surface and facing the bottom surface, and side surfaces exposed from the first surface and connecting the bottom surface and the top surface, with the side surfaces and the bottom surface or top surface forming a blackening layer (BL).
Patent TW-201703075-A (TW)
Title: Manufacturing method of ceramic disc capacitor electrode capable of providing better voltage endurance capability and achieving mass production, cost reduction, product service life extension and expansion of application scope
Inventor: SUN SZU-LUNG
IPC: H01G4/002
Filed: 2015-07-01
Abstract: The present invention relates to an electrode manufacturing method for a sheet-shaped ceramic capacitor. The manufacturing method includes the steps of using a dielectric ceramic material to form a dielectric ceramic blank; printing conductive material in an entire surface manner on an upper surface and a lower surface of the dielectric ceramic blank respectively to form electrode layers; using a machining tool to form the dielectric ceramic blank and the two electrode layers into at least two semi-finished products with predetermined shapes; and, performing degreasing and sintering operations. Thus, the present invention may produce a large amount of semi-finished products of ceramic capacitors by a single operation process, and the two outer side walls of electrodes of the semi-finished products after sintering are aligned with the outer wall of the dielectric ceramic body, such that the sheet-shaped ceramic capacitor manufactured therewith may have better voltage endurance capability and further achieve the purposes of mass production, cost reduction, extending product service life, and expanding application scope.