baber/WOPTO huggingface dataset:
Patent TW-462906-B (TW)
Title: Chemical mechanical planarization or polishing pad with sections having varied groove patterns
Inventor: JENSEN ALAN J
IPC: B24B37/26
Filed: 2000-06-05
Granted: 2001-11-11
Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.
Patent TW-457551-B (TW)
Title: Mask for electron beam exposure and method of manufacturing semiconductor device using the same
Inventor: MIYASAKA MAMI
IPC: G03F1/20
Filed: 2000-05-26
Granted: 2001-10-01
Abstract: A mask for electron beam exposure used in a process for exposing a wafer with predetermined patterns for a chip by an EB projection lithography system. The mask comprises: a grillage area; a plurality of thin film areas surrounded by the grillage area and having a thickness thinner than that of the grillage area; and a plurality of mask pattern areas each of which is formed within respective one of the thin film areas. Each of the mask pattern areas has mask patterns corresponding to patterns of a subfield obtained by dividing the patterns for a chip into a plurality of areas having substantially the same shape and size. The wafer is exposed with predetermined patterns for a chip by performing, for each of the mask pattern areas, a step of irradiating an electron beam onto the mask for electron beam exposure such that the center of an area irradiated by the electron beam coincides with the center of each of the mask pattern areas.
Patent TW-504578-B (TW)
Title: Apparatus for electrical testing of a substrate having a plurality of terminals
Inventor: COLBY PAUL C
IPC: G01R31/26
Filed: 2000-07-10
Granted: 2002-10-01
Abstract: According to one aspect of the invention apparatus is provided for electrical testing of a substrate having a plurality of terminals. The apparatus includes a frame, a probe card, a translation device, an alignment device, and a holder. The probe card includes a probe card backing member and a plurality of probes extending from the probe card backing member and is secured to the frame. The translation device is secured to the frame. The alignment device is located on the translation device. The holder is capable of holding a substrate and is secured to the alignment device. The alignment device is operable to cause alignment movement of the holder past the probe card so that selected ones of the terminals are brought into alignment with selected ones of the probes. The translation device is operable to cause translational movement, transverse to the alignment movement, of the alignment device with the holder towards the probe card. A respective one of the terminals is so brought into contact with a respective contact region of a respective one of the probes.
Patent TW-504582-B (TW)
Title: Objective lens for pickup and light pickup apparatus
Inventor: OTA KOHEI
IPC: G11B7/135
Filed: 2000-08-25
Granted: 2002-10-01
Abstract: An objective lens for use in an optical pickup apparatus to record or reproduce information in an optical information recording medium, comprises an aspheric surface, wherein the following conditional formula is satisfied: 1.1 ≤ d1/f ≤ 3 where d1 represents axial lens thickness and f represents a focal length.
Patent TW-473582-B (TW)
Title: Quick changing device of excavator bucket
Inventor: HUANG BING-WEN
IPC: E02F3/40
Filed: 2000-09-30
Granted: 2002-01-21
Abstract: This invention of a quick changing device of excavator bucket is mainly of installing a bucket-changing device between the excavator moving arm and the bucket. The bucket-changing device is pin connected to the end of the moving arm and the end of the ordinate driving rod, with a fixed hook set on one side of its bottom rim, a movable hook set on the other side of its bottom rim. Moreover, some related mechanisms control the pin connection of the movable hook in order to hook up or release pin hole of the top rim of the bucket easily and quickly.
Patent TW-446795-B (TW)
Title: Method for optimizing industrial gas turbine operation subject to emissions controls
Inventor: GEOFFROY DAVID P
IPC: F02C7/143
Filed: 2000-10-27
Granted: 2001-07-21
Abstract: A process is described for achieving a reduction in regulated emissions of combustion products from power generation apparatus including an industrial gas turbine or turbines, while at the same time providing a desired level of power production from such apparatus, comprising displacing an increment of power generated by such apparatus with at least an equivalent increment of power provided by the application of wet compression in one or more of said gas turbines.
Patent TW-I232231-B (TW)
Title: Propylene polymer composition
Inventor: SEHANOBISH KALYAN
IPC: C08L23/12
Filed: 2000-11-24
Granted: 2005-05-11
Abstract: Disclosed are propylene polymer compositions comprising a high crystalline propylene polymer, a substantially linear ethylene polymer, linear ethylene polymer or combinations thereof, an optional filter and an optional additional polymer. Said propylene polymer compositions have improved processability with a good balance of stiffness and toughness which demonstrates improved scratch resistance in injection molded articles.
Patent TW-490822-B (TW)
Title: Integrated circuit package formed at a wafer level
Inventor: LAM KEN M
IPC: H01L23/485
Filed: 2000-12-13
Granted: 2002-06-11
Abstract: An integrated circuit package that is formed at the wafer level. The integrated circuit package occupies a minimum amount of space on an end-use printed circuit board. A pre-fabricated interposer substrate, made of metal circuitry and a dielectric base, has a plurality of metallized openings which are aligned with metallized wirebond pads on the top surface of a silicon wafer. Solder, or conductive adhesive, is deposited through the metallized openings to form the electrical connection between the circuitry on the interposer layer and the circuitry on the wafer. Solder balls are then placed on the metal pad openings on the interposer substrate and are reflowed to form a wafer-level BGA structure. The wafer-level BGA structure is then cut into individual BGA chip packages.
Patent TW-487920-B (TW)
Title: Apparatus for testing memories with redundant storage elements
Inventor: ARKIN BRIAN J
IPC: G11C29/24
Filed: 2001-01-15
Granted: 2002-05-21
Abstract: A memory tester tests a random access memory device under test (DUT) comprising addressable rows and columns of memory cells, and provides a host computer with enough information to determine how to efficiently allocate spare rows and columns for replacing rows and columns containing defective memory cells. During a test the memory tester writes a bit into each address of an error capture memory (ECM) to indicate whether a correspondingly addressed memory cell of the DUT is defective. The tester also counts of the number of memory cells of each row and column that are defective. After the test the counts are supplied to the host computer. When the host computer is unable to determine how to allocate the spare rows and columns from the counts alone, it requests the tester to process the data in the ECM to determine and supply the host computer with addresses of the defective memory cells.
Patent TW-503322-B (TW)
Title: Electrical circuit and method to test a circuit-component of the electrical circuit
Inventor: TAUBER ANDREAS
IPC: G01R31/28
Filed: 2001-01-20
Granted: 2002-09-21
Abstract: The electrical circuit has many circuit-components connected through a bus. Where at least one of the circuit-component can be tested independent of other circuit-components. The testable circuit-component and the method to test it is characterized in that the testable circuit-component during the test outputs no data to the bus and/or outputs other data to the bus instead of the data, which are to be outputted in normal operation to the bus.
Patent TW-548628-B (TW)
Title: Method for arranging phonemes for cymbalo and structure thereof
Inventor: JANG SHR-NENG
IPC: G10D1/00
Filed: 2001-04-06
Granted: 2003-08-21
Abstract: The present invention relates to a method for arranging phonemes for a cymbalo and a structure thereof, particular a method for arranging phonemes between bridges of a cymbalo and a structural design of the number of Chyn-Maa of the bridges thereof. Such that the phoneme interval between the left and right sides of the leftmost treble doublestop bridge is a semitone, and each column interval of the bridge is a whole tone (i.e. major second); and the phoneme interval between the two rightmost undertone monophonic bridges is a semitone, and each column interval is a whole tone. Thus, one or more bridges can be installed between the leftmost treble doublestop bridge and the two rightmost undertone monophonic bridges, such that the phoneme thereof is spaced with the left/right phoneme of the bridges is five intervals, while maintaining the Chyn-Maa of all bridges to be more than 13 columns (13 Maa). Through such a method for arrangement of phoneme and a structure design of Chyn-Maa of more than 13 Maa, a user can use two fixed skills to complete 12 strikings. As a result, a cymbalo is easier to be played, and a user can easily play difficult skills.
Patent TW-576966-B (TW)
Title: Non-volatile cache integrated with mass storage device
Inventor: COULSON RICHARD L
IPC: G06F12/08
Filed: 2001-04-09
Granted: 2004-02-21
Abstract: A method of processing a request for data, the method comprising: receiving a request for a first set of data stored in a non-volatile mass storage device; determining that the first set of data is stored in a non-volatile cache of the non-volatile mass storage device; reading the first set of data from the non-volatile cache; and sending the first set of data.
Patent TW-I234589-B (TW)
Title: Deep-hole hardening treatment in a vacuum furnace
Inventor: CHEN FAN-SHIUNG
IPC: C22C38/20
Filed: 2001-05-02
Granted: 2005-06-21
Abstract: A hardening treatment in a vacuum furnace using a tubing for transferring hardening-gases into a deep hole of a device is disclosed. A pressure-difference generated in a vacuum process chamber results in forced-convection of processed gases. With these hardening-gases at a suitable process temperature, hardening treatments, such as carburization, carbonitriding nitrocarburizing, gas nitriding in blind-hole specimens, through-hole specimens, circular-stepped channel specimens, and manifold specimens can be performed.
Patent TW-555614-B (TW)
Title: ELID mirror polishing device and method for the work of large diameter
Inventor: OHMORI HITOSHI
IPC: B24D5/02
Filed: 2001-05-11
Granted: 2003-10-01
Abstract: An ELID mirror polishing device for work of large diameter comprises a work rotating/driving device (12) for horizontally rotating and driving a flat work (5), a cylindrical conductive polishing wheel (14) having an outer peripheral surface contacting with a work surface, a polishing wheel rotating/driving device (16) for rotating and driving the polishing wheel about its axial center, a polishing wheel reciprocating device (18) for reciprocating the polishing wheel in a direction normal to the rotation axis of the work, an axial line holding device (20) for holding the axial line of the polishing wheel at a predetermined angle with respect to the horizontal axis, and an ELID device (22) for electrolytically dressing the outer peripheral surface of the polishing wheel. The axial line X of the polishing wheel is held at the predetermined angle theta with respect to the horizontal axis, and simultaneously the outer peripheral surface of the polishing wheel is electrolytically dressed. This invention provides a device and a method of polishing an ELID mirror surface of a large diameter work capable of polishing the surface of a large diameter wafer without using a large polishing wheel, keeping less deflection of the polishing wheel and high machining accuracy, speedily and easily performing truing, performing electrolysis dressing with a small power supply facility, and machining a cross section shape (for example, a recessed shape) other than a plane.
Patent TW-589477-B (TW)
Title: Optoelectronic device, manufacturing method thereof, light transmission body, liquid crystal device manufacturing method thereof, and electronic equipment
Inventor: IMAEDA CHIAKI
IPC: G02B6/00
Filed: 2001-06-08
Granted: 2004-06-01
Abstract: To provide an optoelectronic device permitting reduction insize and weight, a light transmission body, and electronic equipment provided therewith. The liquid crystal device 100 comprises a liquid crystal panel 110 and a holding member 120. On a projecting part 111T of the liquid crystal panel 110, an IC 115 for driving the liquid crystal and a chip 116 are packaged. The holding member 120 is provided with a recessed housing part 122a for housing the above IC 115 for driving liquid crystal, and a recessed housing part 122b for housing the above chip part 116 on a projecting counter part 122.
Patent TW-503197-B (TW)
Title: Rod holding device
Inventor: KIKUCHI TOSHIAKI
IPC: F16B5/06
Filed: 2001-07-17
Granted: 2002-09-21
Abstract: The present invention relates to a rod holding device to improve installability to a panel side and to increase the degree of freedom of design by devising a rod holding tool. The rod holding device for rotatably installing a rod 5 to a panel 1 is constituted of a base member 10 fixed to an installing hole 1e of the panel 1A, and a holding member 20 assembled to the base member 10 and for installing the base end 5a of the rod 5. The base member 10 is provided with a plate part 11A abutting against the panel 1A, and a approximately cylindrical leg part 12 provided on the plate part 11A and to be engaged with the attaching hole 1e. The holding member is provided with an engaging shaft part 21 inserted in the cylinder of the leg part 12 and prevented from slipping off, and a connecting part 23 projecting on the engaging shaft part 21 for hooking the base end 5a of the rod 5. The rod 5 is rotated in relation to the panel 1A in the approximately vertical direction by taking the base end 5a hooked on the connecting part 23 as a fulcrum, and it is rotated in the approximately horizontal direction through the engagement of the engaging shaft part 21 and the leg part 12.
Patent TW-I278046-B (TW)
Title: Structure and process for reducing die corner and edge stresses in microelectronic packages
Inventor: MA QING
IPC: H01L23/367
Filed: 2001-09-28
Granted: 2007-04-01
Abstract: A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.
Patent TW-I242868-B (TW)
Title: Solder terminal and fabricating method thereof
Inventor: KIM JONG-HEON
IPC: H01L23/488
Filed: 2001-10-23
Granted: 2005-11-01
Abstract: A solder terminal and a fabrication method thereof in accordance with the present invention having a adhesion metal layer of Al or Al alloy material, which are formed on an electrode pad of a semiconductor device, a thermal diffusion barrier of TiW or Ti alloy material, a solder bonding layer of NiV or Ni alloy material, and a solder bump which is melted and attached to the upper portion of the solder bonding layer has an advantage that it can prevent the characteristic deterioration caused by the probe mark generated on the electrode pad and at the same time, minimize material movement at the layers of the electrode pad, the solder bonding layer and the adhesion metal layer in case of conducting a wafer test through the thermal diffusion barrier of TiW or Ti alloy material. Also, by having the thermal diffusion barrier act as a solder dam (a layer to limit the melted solder area preventing the solder from being wetted) deposition of an additional metal layer or an additional etching process can be omitted.
Patent TW-568804-B (TW)
Title: Device for producing die cast metal parts, in particular from non-ferrous metals
Inventor: FINK ROLAND
IPC: B22D17/20
Filed: 2001-10-23
Granted: 2004-01-01
Abstract: Disclosed is a device for producing metal die cast parts, in particular from nonferrous metals, in which a hot-duct gate system (13) is disposed in mold cavities (16)(16a)(16b), by means of which hot-duct gate system, it is possible to guide the hot molten metal to shortly in front of the mold cavities (16)(16a)(16b) and to maintain it in the liquid condition until the next shot. As a result, solidified overflows or runner ducts or pressing residues are avoided. The new device can therefore operate in a very economical and precise manner.
Patent TW-496819-B (TW)
Title: Method for producing water-resistant dry-type environmentally friendly flower pot or dining utensils
Inventor: HUANG JENG-JUNG
IPC: B27N3/00
Filed: 2001-11-16
Granted: 2002-08-01
Abstract: The present invention relates to a method for producing water-resistant dry-type environmentally friendly flower pot or dining utensils which can be decomposed into a fertilizer and have a longer water resistance, a longer durable time, and a longer service life. The method mainly comprises: pulverizing plant fibers into powder and molding the powder into a product. Particularly, the fiber powder is dried and added with a carboxymethyl cellulose to form a dry blending and then is molded by a mold at 140 to 200 DEG C. The carboxymethyl cellulose is processed by the high temperature to form a binding property through thermal decomposition, and further molded into a shape. The non-water-addition dry blending can greatly reduce the water absorbency of the product, thereby obtaining a product that is not easy to be dissolved while maintaining a decomposable property after a certain period of time.
Patent TW-592644-B (TW)
Title: Brassieres
Inventor: HUANG GUOXIAN
IPC: A41C3/10
Filed: 2002-02-15
Granted: 2004-06-21
Abstract: A brassiere includes cups formed of thin plastics material in which each cup is formed with an inner layer and an outer layer that each extend over the surface area of the cup and are joined together around at least substantially the whole periphery of the cup. An elongate strengthener extends across a lower edge of the cup, and an uplifting pad is entrapped between the inner and outer layers. The layers are joined together without stitching adjacent the periphery of the cup to hold the strengthener in position.
Patent TW-571595-B (TW)
Title: Interactive teleconferencing display system
Inventor: VLAHOS PAUL
IPC: G03B21/00
Filed: 2002-02-18
Granted: 2004-01-11
Abstract: A teleconferencing system in which the video image of a subject in front of a selected background scene is extracted from that scene and transmitted to other locations where selected backgrounds are stored. By compositing the subject and background images at each remote location, both image elements, being originals, will show no loss of detail when projected. For a front projection screen, the projector is inhibited from illuminating a presenter.
Patent TW-I251759-B (TW)
Title: Automated system for issuing and managing offence tickets
Inventor: GRISON PAUL
IPC: G06F15/02
Filed: 2002-03-26
Granted: 2006-03-21
Abstract: A system for issuing and managing offence tickets comprising a portable input device (12) provided to the police officer (10), an information medium of unalterable tamper-resistant contactless smart card type (14) adapted to be presented in front of the input device so as to record vehicle-related data, clipping means enabling the police officer to clip the medium onto the windshield wiper arm such that the medium is not damaged by rain and cannot be easily removed after it has been clipped, a viewing device (18) enabling the vehicle owner to read and print the information relative to the offence, a processing center (22) containing the information relative to all registered vehicles, and access means via microwave link (20) so as to enable the police officer to obtain information about the contravening vehicle from the processing center.
Patent TW-559971-B (TW)
Title: Test fixture for semiconductor package and test method of using the same
Inventor: SU HUAN-PING
IPC: H01R13/22
Filed: 2002-04-08
Granted: 2003-11-01
Abstract: A test fixture for semiconductor packages and a test method of using the test fixture are proposed. The test fixture is composed of a first circuit board, a second circuit board, an interposer and a covering member. The first and second circuit boards are used to accommodate semiconductor packages and electrically connect the semiconductor packages to a test device, in a manner that the second circuit board is interposed between the semiconductor packages and the first circuit board, wherein a surface of the second circuit board abuts against I/O (input/output) connections of the semiconductor packages, and an opposed surface of the second circuit board is in contact with contact terminals of the first circuit board. The interposer is mounted on the second circuit board, and formed with through holes for receiving the semiconductor packages therein. The covering member is attached onto the interposer, and provided with elastic mechanisms for holding the semiconductor packages in position. By virtue of point-to-surface contact between the semiconductor packages and the second circuit board, and between the first and second circuit boards, the semiconductor packages can be firmly assured in electrical connection to the first and second circuit boards and in turn to the test device where functional tests are performed.
Patent TW-I241296-B (TW)
Title: Process for preparing triazolopyrimidine derivatives
Inventor: CHEN CHIEN-HSING
IPC: C07D255/04
Filed: 2002-04-24
Granted: 2005-10-11
Abstract: This invention relates to a novel process for preparing triazolopyrimidine derivatives of the formula (I), wherein R1 represents a hydrogen or an alkyl radical of one to ten carbon atoms, or a cycloalkyl radical of three to six carbon atoms, or an alkenyl radical of up to four carbon atoms; R2 represents a hydrogen, a halogen atoms, a hydroxyalkyl or alkyl radical of one to ten carbon atoms; R3 represents a hydrogen, a hydroxyalkyl or alkyl radical of one to four carbon atoms.
Patent TW-548762-B (TW)
Title: SMIF load port interface including smart port door
Inventor: ROSENQUIST FREDERICK T
IPC: H01L21/677
Filed: 2002-07-01
Granted: 2003-08-21
Abstract: A SMIF load port assembly is disclosed including a port door position compensation assembly capable of dynamically adjusting a relative spacing between a front surface of a port door and a front surface of a pod door loaded onto the load port assembly so as to compensate for any improper positioning of the front surface of the pod. The position compensation assembly includes a plunger translationally mounted in the port door, and a sensor for detecting a position of the plunger. As a pod is loaded onto the load port assembly is advanced toward the port door, the front surface of the pod door contacts the plunger at which point the position compensation assembly in combination with an overall controller can identify the exact position of the pod door. From this identification, the position of the port and/or pod doors may be adjusted to compensate for any improper positioning of the front surface of the pod door on the load port assembly.