baber/WOPTO huggingface dataset:
Patent TW-202230888-A (TW)
Title: Antenna system
Inventor: TSAI YI-CHE
IPC: H01Q21/00
Filed: 2021-01-15
Abstract: An antenna system includes a tunable impedance circuit, a power splitter, a first phase shifter, a second phase shifter, a third phase shifter, a fourth phase shifter, a first antenna element, a second antenna element, a third antenna element, a fourth antenna element, a first switch element, a second switch element, a third switch element, and a fourth switch element. The first switch element selectively couples the first antenna element through the first phase shifter to the power splitter. The second switch element selectively couples the second antenna element through the second phase shifter to the power splitter. The third switch element selectively couples the third antenna element through the third phase shifter to the power splitter. The fourth switch element selectively couples the fourth antenna element through the fourth phase shifter to the power splitter.
Patent TW-202136561-A (TW)
Inventor: KNISLEY THOMAS
IPC: C23C16/44
Filed: 2021-01-26
Abstract: 描述用於在基板上沉積含碲膜之方法。將基板曝露於碲前驅物與反應物，以形成含碲膜（例如，元素碲、氧化碲、碳化碲、矽化碲、碲化鍺、碲化銻、碲化鍺銻）。該等曝露可以是依序或同時的。
Patent TW-202231398-A (TW)
Title: Copper oxide paste and method for producing electronic parts capable of bonding a chip component and a substrate more firmly
Inventor: KOIKE JUNICHI
IPC: B23K35/30
Filed: 2021-02-02
Abstract: The present invention provides a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material with high thermal conductivity. The copper oxide paste of the present invention includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu2O and CuO. The total amount of the copper element constituting Cu2O and the copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D50) of more than 0.20 [mu]m and less than 5.0 [mu]m inclusive. The 50% cumulative particle size (D50) and the 10% cumulative particle size (D10) satisfy 1.3≤D50/D10≤4.9, the 50% cumulative particle size (D50) and the 90% cumulative particle size (D90) satisfy 1.2≤D90/D50≤3.7, and the BET specific surface area of the copper-containing particles is more than 1.0 m2/g and less than 8.0 m2/g.
Patent TW-202136477-A (TW)
Title: Method for treating object to be treated and treating liquid
Inventor: MIZUTANI ATSUSHI
IPC: H01L21/306
Filed: 2021-02-05
Abstract: The present invention addresses the problem of providing a treatment method whereby the flatness of an object of interest having a metal layer can become superior when the method is applied to the object of interest. The present invention also addresses the problem of providing a treatment solution for an object of interest. The method for treating an object of interest according to the present invention comprises step A for subjecting an object of interest having a metal layer to an oxidation treatment to form a metal oxide layer and step B for bringing the object of interest obtained in step A into contact with a treatment solution to dissolve and remove the metal oxide layer, in which the treatment solution comprises an organic solvent and an acidic compound and the content of the organic solvent is 50% by mass or more relative to the whole mass of the treatment solution.
Patent TW-202129851-A (TW)
Title: Through electrode substrate and mounting substrate
Inventor: MAEKAWA SHINJI
IPC: H05K3/46
Filed: 2017-08-04
Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.
Patent TW-202145840-A (TW)
Title: Wiring circuit board assembly sheet
Inventor: SHIBATA SHUSAKU
IPC: H05K3/06
Filed: 2021-03-12
Abstract: An assembly sheet (X) as a wiring circuit board assembly sheet comprises a metal base material (10), a wiring circuit structure portion (20), and a dummy structure portion (30). The metal base material (10) includes a product region (R1) and a frame region (R2) adjacent thereto. The wiring circuit structure portion (20) is disposed in the product region (R1) on one side in a thickness direction of the metal base material (10), and includes a terminal portion (20B). The dummy structure portion (30) is disposed in the frame region (R2) on one side in the thickness direction of the metal base material (10), includes a plurality of conductor layers (32, 33) arranged in the thickness direction, and has a height greater than the terminal portion (20B) on the metal base material (10).
Patent TW-202201478-A (TW)
Inventor: BEN MOHAMED NADIA
IPC: H01L21/02
Filed: 2021-03-16
Abstract: 本發明係關於一種用於製備薄層(1)之方法，該方法包括：弱化步驟(S2)，其旨在於供體基板(2)之中央部分(2c)中形成弱化區(3)，該弱化區(3)未延伸至該供體基板(2)之周邊部分(2p)中；接合步驟(S3)，其將該供體基板(2)之主面(2a)接合至受體基板(5)以形成待分裂總成；及分離步驟(S4)，其分離該待分裂總成，該分離步驟包括導致僅在該供體基板(2)之該中央部分(2c)處自該供體基板(2)釋放該薄層(1)之熱處理。該方法亦包括在該分離步驟之後之拆離步驟(S6)，該拆離步驟(S6)包括處理該待分裂總成以自該受體基板(5)拆離該供體基板(2)之該周邊部分。
Patent TW-202200197-A (TW)
Title: Temperature-responsive virus storage system
Inventor: HASSINEN MINNA
IPC: A61K47/40
Filed: 2021-03-19
Abstract: A temperature-responsive virus storage system that allows virus to be stored, such as a non-frozen liquid, and maintain infectivity is described.
Patent TW-202139790-A (TW)
Inventor: SUBRAMANI ANANTHA K
IPC: H05H1/46
Filed: 2017-01-24
Abstract: 描述一種電漿源組件，包含具有RF熱電極的殼體，RF熱電極具有主體與複數個源電極，複數個源電極從RF熱電極朝向殼體的前沿面中的開口垂直延伸。亦描述一種結合電漿源組件的處理腔室以及使用電漿源組件的方法。
Patent TW-202145465-A (TW)
Inventor: GANDHI JASPREET SINGH
IPC: H01L23/28
Filed: 2021-05-12
Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.
Patent TW-202244372-A (TW)
Title: Adjustable trim structure on top and bottom of building formwork characterized in simlpified structure and convenient construction
Inventor: Zhang wen-tong
IPC: E04G17/00
Filed: 2021-05-14
Abstract: The present invention relates an adjustable trim structure on top and bottom of a building formwork, which includes: a metal formwork element, two fixing screw elements, a metal boundary formwork element and two fixing nut elements. The metal formwork element has two symmetrical elongated track holes. With the elongated track hole, the fixing screw element is allowed to slide and adjust to a required spacing, and a screw head portion of the fixing screw element abuts against the elongated track hole of the metal formwork element. The fixing screw element has a screw head portion and an external screw thread portion. The external screw thread portion passes through the elongated track hole of the metal formwork element, a hole of the metal boundary formwork element and a screw hole of the fixing nut element for fixing.
Patent TW-202200328-A (TW)
Title: Control device and robot hand system
Inventor: IWATA SHUNSUKE
IPC: B25J15/06
Filed: 2021-05-25
Abstract: Provided are a control device and a robot hand system with which it is possible to improve the usability of an actuator. A control device 14A is connectable to an actuator 12 using a negative pressure as a power source, and comprises: a vacuum ejector 52 having an inflow port 60, a discharge port 62, and a suction port 64; inflow piping 54A that can connect the inflow port 60 and a pump 66; suction piping 58A that can connect the suction port 64 and the actuator 12; and a first valve 56 provided in a path 65 passing through the discharge port 62, the vacuum ejector 52, the suction port 64, and the suction piping 58A.
Patent TW-202203439-A (TW)
Inventor: KIMURA HAJIME
IPC: H01L21/336
Filed: 2009-05-07
Abstract: An object is to provide a semiconductor device with high aperture ratio or a manufacturing method thereof. Another object is to provide semiconductor device with low power consumption or a manufacturing method thereof. A light-transmitting conductive layer which functions as a gate electrode, a gate insulating film formed over the light-transmitting conductive layer, a semiconductor layer formed over the light-transmitting conductive layer which functions as the gate electrode with the gate insulating film interposed therebetween, and a light-transmitting conductive layer which is electrically connected to the semiconductor layer and functions as source and drain electrodes are included.
Patent TW-202248561-A (TW)
Title: A lubricating can
Inventor: WANG KUN-WANG
IPC: F16C33/66
Filed: 2021-06-01
Abstract: The present invention discloses a lubricating can, comprising a grease cup, a screw, a piston, a pressing base, a bearing placement portion and a rotation driving component. The grease cup has a cup bottom, an open cup mouth and a cylindrical inner wall. The fixed end of the screw is fixed on the cup bottom of the grease cup. The piston is housed inside the lubricating trough. The piston has a pressing surface, a bearing surface and a lateral ring surface that is tightly fitted on and can slide along the cylindrical inner wall. The center of the piston is formed with a through hole and a plurality of lubricating guide holes. The through hole is sheathed on the screw. The lower end pressing portion of the pressing base has a screw hole to fit the screw. The bearing placement portion is defined and formed by the space between the lower end pressing portion and the bearing surface of the piston. The rotation driving component is configured on the upper end bearing portion of the pressing base.
Patent TW-202137211-A (TW)
Title: Storage device, semiconductor device, electronic component, and electronic device
Inventor: MAEDA SHUHEI
IPC: G11C5/02
Filed: 2018-01-12
Abstract: To reduce the area of a memory cell having a backup function. A storage device includes a cell array, and a row circuit and a column circuit that drive the cell array. The cell array includes a first power supply line, a second power supply line, a word line, a pair of bit lines, a memory cell, and a backup circuit. The cell array is located in a power domain where power gating can be performed. In the power gating sequence of the cell array, data in the memory cell is backed up to the backup circuit. The backup circuit is stacked over a region where the memory cell is formed. A plurality of wiring layers are provided between the backup circuit and the memory cell. The first power supply line, the second power supply line, the word line, and the pair of bit lines are located in different wiring layers.
Patent TW-202204203-A (TW)
Title: Saddle-riding vehicle
Inventor: KAWAMURA AKIHITO
IPC: B62J11/00
Filed: 2021-06-18
Abstract: This motorcycle (1) comprises: an engine (40); a power generator (43) that generates power by using the output of the engine (40); a plurality of control units (60) that control the engine (40) and the power generator (43); and a wire harness (70) connected to the plurality of control units (60). The plurality of control units (60) include an FI-ECU (61) and an ACG-ECU (62). The FI-ECU (61) and the ACG-ECU (62) are disposed offset in the front-rear direction of a vehicle body.
Patent TW-202205563-A (TW)
Title: Semiconductor material resin composition
Inventor: NIWA TAKAAKI
IPC: B32B27/00
Filed: 2021-06-22
Abstract: A semiconductor material resin composition containing: (A) at least one resin selected from the group consisting of a polyamide resin, a polyamide-imide resin, and a polyimide resin; (B) a silicone filler; (C) a pigment; (D) a solvent; and (E) a coupling agent, the content of the silicone filler (B) being 0.5-30 mass% in relation to the total mass of the solid content.
Patent TW-202231936-A (TW)
Title: Anodization apparatus and anodization method
Inventor: MATSUO MIE
IPC: C25D11/02
Filed: 2021-06-24
Abstract: According to one embodiment, an anodization apparatus includes: a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank. The holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte. The anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.
Patent TW-202300972-A (TW)
Title: Optical image capturing system
Inventor: CHANG YEONG-MING
IPC: G02B9/34
Filed: 2021-06-25
Abstract: The invention discloses a four-piece optical lens for capturing image and a five-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens with positive refractive power; a second lens with refractive power; a third lens with refractive power; and a fourth lens with refractive power; and at least one of the image-side surface and object-side surface of each of the four lens elements are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras.
Patent TW-202210257-A (TW)
Title: Method for producing a relief-type decoration on a surface of a ceramic printing medium
Inventor: OBERHUBER DENNIS
IPC: B33Y10/00
Filed: 2021-06-30
Abstract: The invention relates to a method for producing a relief-type decoration on a surface of a ceramic printing medium, comprising the steps of: a) providing a ceramic printing medium; b) discharging, by means of a plurality of nozzles of a first inkjet printer, drops of a first glaze suspension which comprises, in the form of particles, at least one glaze material containing frit onto part of the surface and confining the drops deposited on the part such that at least partially confined glaze material forms semi-cylindrical elevations, wherein, while the drops are being discharged, a continuous unidirectional relative movement between the nozzles and the printing medium occurs; and c) firing the ceramic printing medium in order to produce the relief-type decoration on the surface of the printing medium; wherein the drops are discharged and confined in step (b) such that a first glaze layer comprising immediately adjacent semi-cylindrical elevations each having a base and a lateral face is formed, each of the longitudinal axes of said elevations extending in a first direction, wherein the bases and the lateral faces of said elevations overlap over part of the surface.
Patent TW-202205382-A (TW)
Inventor: HUANG WEN-SHEH
IPC: H01L21/20
Filed: 2021-06-30
Abstract: A method includes forming a transistor over a front side of a substrate, in which the transistor comprises a channel region, a gate region over the channel region, and source/drain regions on opposite sides of the gate region; forming a front-side interconnect structure over the transistor, wherein the front-side interconnect structure includes a dielectric layer and conductive features; and bonding the front-side interconnect structure to a carrier substrate via a bonding layer, in which the bonding layer is between the front-side interconnect structure and the carrier substrate, and the bonding layer has a higher thermal conductivity than the dielectric layer of the front-side interconnect structure.
Patent TW-202213667-A (TW)
Inventor: KANG TING-CIH
IPC: H01L23/48
Filed: 2021-07-01
Abstract: The present disclosure provides a semiconductor structure and a method for preparing the semiconductor structure. The semiconductor structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first conductive pad and a second conductive pad. The first conductive pad is disposed on the first semiconductor substrate. The second conductive pad is disposed on the first conductive pad. The second semiconductor device is disposed on the first semiconductor device and comprises a second semiconductor substrate and a via structure. The via structure is disposed in the second semiconductor substrate and contacts the second conductive pad. Chemical reactivity of the second conductive pad is less than chemical reactivity of the first conductive pad.
Patent TW-202140977-A (TW)
Title: Flow channel structure of liquid-cooled pump chamber and liquid-cooled pump for achieving excellent diversion effect and better liquid smoothness, and capable of improving the working efficiency of the liquid pump
Inventor: HUANG TSUNG-HSIEN
IPC: F28D1/06
Filed: 2021-07-16
Abstract: The present invention discloses a flow channel structure of the liquid-cooled pump chamber and a liquid-cooled pump. The flow channel structure of a liquid-cooled pump chamber includes a liquid pump installation chamber. The bottom of the liquid pump installation chamber is provided with a liquid inlet hole. The circumferential side of the liquid pump installation chamber is provided with a liquid outlet hole. The inner circumferential side wall of the liquid pump installation chamber is convexly provided with a liquid blocking boss on one side corresponding to the liquid outlet hole, and a diversion groove being concavely provided on the other side corresponding to the liquid outlet hole. The liquid blocking boss is arranged in a gradually thick to thin manner along the rotating circumferential direction of the impeller, and the diversion groove is arranged in a gradually shallow to deep manner along the rotating circumferential direction of the impeller to penetrate the liquid outlet hole. As a result, the flow channel structure of the liquid-cooled pump chamber of the present invention can be applied as a liquid-cooled pump, which achieves the purposes of having excellent diversion effect and better liquid smoothness, and is beneficial to improving the working efficiency of the liquid pump.
Patent TW-202215663-A (TW)
Title: Semiconductor device
Inventor: Su zi-ang
IPC: H01L29/12
Filed: 2021-08-06
Abstract: The present disclosure provides embodiments of semiconductor devices, such as complementary bipolar junction transistor (CBJT) structures. In one embodiment, the semiconductor deviceincludes a dielectric layer and a fin-shaped structure disposed over the dielectric layer. The fin-shaped structure includes a first p-type doped region, a second p-type doped region, and a third p-type doped region, and a first n-type doped region, a second n-type doped region, and a third n-type doped region interleaving the first p-type doped region, the second p-type doped region, and the third p-type doped region. The first p-type doped region, the third p-type doped region and the third n-type doped region are electrically coupled to a first potential. The second p-type doped region, the first n-type doped region and the second n-type doped region are electrically coupled to a second potential different from the first potential.
Patent TW-202214615-A (TW)
Inventor: YANG FEI
IPC: A61K31/5377
Filed: 2021-08-09
Abstract: The invention relates to an EGFR inhibitor and a preparation method therefor and application thereof. In particular, the present invention relates to an EGFR inhibitor having a structure of formula (I), a preparation method therefor, a pharmaceutical composition containing the same, and its use as an EGFR inhibitor and in the preparation of a medicament for treating and/or preventing cancer, tumor or metastatic diseases at least partly related with EGFR exon 20 insertion, deletion or other mutation, especially in the preparation of a medicament for treating and/or preventing hyperproliferative diseases and diseases caused by cell death-inducing disorders. Each substituent of formula (I) is the same as defined in the description.
Patent TW-202219354-A (TW)
Inventor: SCHUPP JENS
IPC: E02D27/52
Filed: 2021-08-10
Abstract: 一種用於結構(7)的基座(1)，包括具有側表面(11)和用於插入土壤(2)的遠端(10)的主體(8)，該側表面(11)的至少一個區域形成第一電極，一個或多個第二電極(9)設置在該主體(8)上並且與該側表面(11)齊平或凸出於該側表面(11)，每個第二電極(9)圍繞該側表面(11)橫向延伸並且透過設置在對應的該第二電極和該側表面之間的絕緣條(12)與其電絕緣。在安裝過程中，可在該電極之間施加電壓以引發電滲透效應以降低安裝電阻。
Patent TW-202307687-A (TW)
Inventor: LIN YU-CHEN
IPC: G06F15/163
Filed: 2021-08-10
Abstract: 一種遠端體溫量測監控系統，包含：一量測裝置及一監控應用模組，該監控應用模組安裝於一主控裝置中，該量測裝置具有一量測模組、一訊號傳輸模組、一供電模組及一控制模組，該控制模組分別與該量測模組、該訊號傳輸模組及該供電模組電性連接，並用以控制該量測裝置執行狀態，該監控應用模組透過該主控裝置與該量測裝置電性連接並具有一接收模組、一分析模組、一警示模組、一上傳模組、一功能模組及一設定模組。透過本發明之遠端體溫量測監控系統可以利用該量測裝置貼在受測者身上量測體溫，並將量測數據傳輸至該監控應用模組，透過該監控應用模組分析體溫數據並給予受測者建議報告。
Patent TW-202249035-A (TW)
Inventor: WANG PEI-YU
IPC: G16Y40/00
Filed: 2021-08-11
Abstract: 本申請提供一種工業互聯網的雲邊協同處理方法、電子裝置及存儲介質，所述方法包括：接收電子裝置的網關採集並發送的工業設備的現場消息；根據預設規則判斷所述現場消息是否具有優先順序；在所述現場消息具有優先順序時，將所述現場消息轉換為待處理事件；根據優先順序分配資源對所述待處理事件進行分析，確定所述待處理事件對應的處理措施；根據所述待處理事件對應的處理措施對所述工業設備進行回饋控制；在所述現場消息不具有優先順序時，將所述現場消息傳送至雲平臺進行處理。
Patent TW-202214579-A (TW)
Title: Compound, additive for synthetic resin, additive composition for synthetic resin, resin composition, and molded article of same
Inventor: MUTO TAKASHI
IPC: C08K5/01
Filed: 2021-08-20
Abstract: Provided are: a compound capable of improving the properties of a synthetic resin; an additive for a synthetic resin; an additive composition for a synthetic resin; a resin composition; and a molded article of the same. According to the present invention, a compound containing a monovalent group, represented by general formula (1), makes it possible to improve the properties of a synthetic resin. In general formula (1): X represents a divalent group; each of Ar1 and Ar2 independently represents an unsubstituted phenyl group or a phenyl group having a substituent; and * represents a moiety that binds to other atoms.
Patent TW-202304072-A (TW)
Title: Electric connector
Inventor: Li hua-bing
IPC: H01R13/6581
Filed: 2021-08-20
Abstract: An electrical connector includes an insulating body and a terminal module. The terminal module includes a first terminal module, a second terminal module, and a shielding piece. The first terminal module includes a number of first conductive terminals. Each first conductive terminal includes a first elastic contact arm and a first tail portion. The second terminal module includes a number of second conductive terminals. Each second conductive terminal includes a second elastic contact arm and a second tail portion. The shielding piece includes a connecting portion and a number of ground terminals. The ground terminals include a number of first ground elastic arms arranged in a same row as the first elastic contact arms and a number of second ground elastic 
arms arranged in a same row as the second elastic contact arms. As a result, the shielding performance of the electrical connector is improved.