baber/WOPTO huggingface dataset:
Patent JP-H05107242-A (JP)
Title: Pigment for detecting gas leakage and its manufacturing method
Inventor: SAKAMOTO MASASHI
IPC: C09C3/06
Filed: 1991-10-14
Abstract: PURPOSE:To enable gas leakage of a flammable gas to be detected properly and simply by allowing a platinum group compound to be present on a surface of a substrate particle and a metal compound such as aluminum to be present on it as a surface-cladding treatment agent. CONSTITUTION:At least one type of oxide, hydroxide, and hydrous oxide of a platinum group metal is present on a surface of a substrate particle and at least one type of oxide, hydroxide, and hydrous oxide of a metal of aluminum, etc., is present on it as a surface-cladding treatment agent, thus obtaining a pigment for detection. A pigment particle which is blended to a general paint which is coated on a surface of an outer wall and a piping of a reaction device, etc., can be used as a substrate but titanium dioxide with an average particle diameter of 0.01-0.5mum is desirable as the white pigment. An amount of cladding of platinum group compound is 0.5-10wt.% for a substrate weight after converted to an oxide of platinum group metal and then an amount of surface-cladding treatment agent is 1-10wt.% for the substrate weight when expressed by a total amount of weight which is converted to oxide. Gas leakage can be detected easily by discoloration of a detection paint which is coated.
Patent JP-H08213541-A (JP)
Title: Semiconductor device
Inventor: WATANABE MASAYUKI
IPC: H01L25/11
Filed: 1995-11-13
Abstract: PURPOSE: To enhance semiconductor chips provided on a module board in mounting density by a method wherein bump electrodes of different functions are provided so as not to confront each other, and the semiconductor chips connected to different leads are formed into groups. CONSTITUTION: Eight semiconductor chips 4A and 4B and eight semiconductor chips 4C and 4D are mounted on the front and rear of a module board 1 respectively. The semiconductor chips 4A to 4D are made to form an SRAM, and the surfaces of the semiconductor chips where semiconductor elements or wirings are provided are molded with silicone rubber or resin 7. Bump electrodes 6 of solder, Au or the like are provided on the semiconductor chips 4A to 4D respectively, and leads 5A to 5D are connected to the bump electrodes 6 through a TAB method. The semiconductor chip 4A is stacked on the semiconductor chip 4B, the leads 5A and 5B of them of the same function are connected together with solder. On the rear side of the module board 1, the semiconductor chips 4C and 4D and leads 5C and 5D are disposed the same as above.  A semiconductor chip of different function from the other semiconductor chips is a decoder 3, and one selected out of eight semiconductor chips is made to serve as a decoder on both the front and rear of a module board.
Patent JP-S62150822-A (JP)
Title: Manufacture of thin film
Inventor: HOSOKI KENJI
IPC: H01L21/28
Filed: 1985-12-25
Abstract: PURPOSE:To form a thin film having no defect by independently applying a DC voltage to two high melting point metal silicide targets having different composition ratios to obtain a thin high melting point silicide film having arbitrary composition. CONSTITUTION:Ar gas is introduced into a vacuum vessel 1, a negative DC voltage is applied from a variable power source 4 to a WSi target 6 and a WSiz target 7 to execute sputtering. At this time, supplied power is regulated to deposit a thin WSix film having object composition ratio on a wafer 5 which laterally moves. Since the Si or W film is not solely bonded to any position of the inner wall of the vessel 1, the bonded film is not separated fro a long period to obtain the WSix film having no defect.
Patent JP-H05135397-A (JP)
Title: Optical disk device
Inventor: ISHIBASHI KENZO
IPC: G11B7/125
Filed: 1991-11-11
Abstract: PURPOSE:To reduce the number of parts without lowering a protective' function by emitting a laser light beam by means by a synchronizing signal generating when an optical disk is loaded normally and arrives at a prescribed r.p.m. and constituting so as not to emit the beam in a defective time when a cartridge is unloaded. CONSTITUTION:When a cartridge 1 is loaded, a switch 7 is turned on and a device is started by a CPU 21 through a detection circuit 20 and a disk motor 3 is rotated by a disk motor driving circuit 14. When the optical disk 2 is loaded normally and arrives at a prescribed r.p.m., the laser light beam is emitted from an optical head 8 through a laser driving circuit 9 by the CPU 21 receiving the synchronizing signal 21c outputted from the circuit 14. Then, the switch 7 and the circuit 14 carry out the role of a safety interlocking protection device and the laser light beam is not emitted when the cartridge 1 is unloaded even when only one of them is defective. Thus, one switch is reduced without lowering the protective function, and the device is miniaturized and has a low cost.
Patent JP-H04167140-A (JP)
Title: Monitor controller
Inventor: YOSHIMURA FUYUE
IPC: G06F9/445
Filed: 1990-10-31
Abstract: PURPOSE:To change the contents of a program and the data without loading/ unloading a ROM by providing a main loader which loads a load module file to a main memory or an input/output processing part based on the contents of a configuration file. CONSTITUTION:A central processing part 1, an external storage part 5, and an input/output processing part 8 are connected to each other with an input/ output bus 20. A configuration file 7 contained in the part 5 consists of a load command, a loading destination ID, and a load module file name. Thus a load module file can be loaded to the part 8 from the part 1 and therefore no replacement is required for the ROM contained in the part 8 despite the change of the contents of a program and the data. Then the jobs required for exchange of the contents of the program and the data can be omitted. Furthermore the loading/unloading operations of the ROM is not required at the part 8. Thus the occurrence of defects is reduced.
Patent JP-H0245031-A (JP)
Title: Endoscope device
Inventor: MIYAZAKI AKIHIKO
IPC: H04N7/18
Filed: 1988-11-21
Abstract: PURPOSE:To correctly display the center of a fiberscope side at a prescribed position on a monitoring screen by inputting a signal photoelectrically converted in a CCD to a signal processing part while inputting the above-mentioned signal to a (image formed center) position detecting part and detecting the center position in the image of an object. CONSTITUTION:An illuminated object 34 is image-formed on the incident edge surface of an image guide 24 by an objective lens 35 fitted to the tip part of an inserting part 28. A digital luminance signal Y converted by an A/D converter 47a is inputted to an image formed position detecting circuit 54. This image formed position detecting circuit 54 detects the center position of an image formed position based on the signal to be outputted from a CCD37 and informs a timing generating circuit 48 of an address signal corresponding to the center position when a white balance switch 46 is turned on. Even when the center of the emitting edge of the image guide 24 and either the center of an image guide fitting part 25A or the center position of the image forming surface of the CCD37 are relatively dislocated, body the center positions can be made into a coincident state with each other and color-displayed at the prescribed display position on the monitoring screen by the correction of a read address clock.
Patent JP-H06145402-A (JP)
Title: Flame-retardant foam and its production
Inventor: IMAI KAZUTO
IPC: C08K3/22
Filed: 1992-11-02
Abstract: PURPOSE:To provide a polyolefin flame-retardant foam of high expansion ratio highly filled with inorganic matter without limiting to that of ethylene-vinyl acetate copolymer composition and a process for producing the foam. CONSTITUTION:A composition is prepared by incorporating (A) 100 pts.wt. of a polyolefin resin with (B) 60-250 pts.wt. of inorganic powder, (C) 1-40 pts.wt. of an azodicarbonamide foaming agent and (D) 0.1-3 pts.wt. of zinc oxide, and this composition is crosslinked using an electron beam irradiator followed by heating the resultant composition to a temperature higher than the decomposition temperature of the foaming agent to effect expansion of the composition.
Patent JP-S62152466-A (JP)
Inventor: HIDAKA TAKASHI
IPC: A61L9/01
Filed: 1985-12-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000124006-A (JP)
Title: Laminated thermistor
Inventor: NOZOE KENJI
IPC: H01C7/04
Filed: 1998-10-16
Abstract: PROBLEM TO BE SOLVED: To provide a laminated thermistor, the resistance value of which can be designed easily and which can be manufactured at high yield and has a superior moisture resistance. SOLUTION: A laminated thermistor is provided with a pair of external electrodes 4a and 4b and at least one or more pairs of internal electrodes 2a and 2b connected electrically to the external electrodes 4a and 4b, and the outermost layers of the thermistor are constituted of ceramic layers 3a and 3b having resistivity higher than that of the thermistor layer 1 between the internal electrodes 2a and 2b. The composition of the thermistor is adjusted so that the thermistor layer 1 and ceramic layers 3a and 3b are sintered at the same temperature.
Patent JP-S62145677-A (JP)
Inventor: MISHIERU JIYAN KUROODO MONIE
IPC: H01R12/04
Filed: 1986-12-12
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H02140607-A (JP)
Title: Molded ic lead illuminator
Inventor: TERAJIMA SEIJI
IPC: H01L21/66
Filed: 1988-11-22
Abstract: PURPOSE:To make it possible to view a lead as a transmitted image even if height difference between the lower surface of a mold and that of the reed is about <=0.15mm by using a translucent plate provided with a projecting part below the molded IC. CONSTITUTION:An illuminator is constituted of a light source 3, a housing 4 and the translucent plate 1. A QFP(Quad Flat Package) 5 as a work is placed on the translucent plate 1. On the translucent plate 1, the projecting part 2 is formed in a gap part between the lead part 6 of the QFP 5 and the plate 1. The projecting part 2 is formed in a square shape corresponding to the QFP 5 on the translucent plate 1. Light emitted from the light source 3 becomes the transmitted light for the lead part 6 of the QFP 5 through the translucent plate 1 and also the projecting part 2 to be emitted to the outside. The lead part 6 can be surely viewed as the image in such a state. The image is displayed on a television monitor 8, for example, through a CCD camera 7.
Patent JP-H03158843-A (JP)
Title: Photosensitive halogenated silver photographic material
Inventor: RUIGI SEROONE
IPC: G03C1/035
Filed: 1990-10-31
Abstract: PURPOSE: To suppress fogging without reducing sensitivity by incorporating an m-dihydroxybenzene compd. into a silver halide emulsion layer contg. flat platy silver halide particles. CONSTITUTION: Flat platy silver halide particles and at least one kind of m- dihydroxybenzene compd. enough to suppress fogging are incorporated into at one silver halide emulsion layer. The m-dihydroxybenzene compd. is represented by the formula (where X is selected from among sulfo represented by -SO3 H, its water-soluble salt, carboxy represented by -COOH, its water-soluble salt and H) and the pref. concn. of the compd. is about 5-10mmol per 1mol silver halide in the emulsion layer. At least 40% of the silver halide particles in the emulsion layer are preferably flat platy particles having at least 3:1 as the ratio between average diameter and thickness.
Patent JP-H01138091-A (JP)
Title: Filler metal
Inventor: KUNIYA TSUTOMU
IPC: B23K35/30
Filed: 1987-11-25
Abstract: PURPOSE:To obtain a repaired or welded part having mechanical characteristics comparable to those of the parent metal by adding one or more kinds of metals selected among groups of specified metals to Cr as a principal component to produce a filler metal used. CONSTITUTION:A filler metal is composed of 0.01-10wt.% one or more among Ti, Zr, Hf and Al belonging to the groups IVa and IIIb of the periodic table, 0.01-8wt.% one or more among Mn, Re, Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu, Ag and Au belonging to the groups VIIa, VIII and Ib and the balance essentially Cr. When a Cr-based parent metal is subjected to high temp. treatment with the filler metal such as repair or welding, the parent metal is not hardened during the treatment, the mechanical properties of the treated part are not deteriorated and quality comparable to that of the parent metal can be maintained.
Patent JP-H04170173-A (JP)
Title: Image pickup device
Inventor: SUGA AKIRA
IPC: H04N5/345
Filed: 1990-11-02
Abstract: PURPOSE:To enable the image pickup device to cope with television systems of different scanning ranges through the use of one solid-state image pickup element by employing a switch means selecting any of plural television systems so as to skip reading of undesired picture elements of the image pickup element when a television system whose scanning range is narrower is selected. CONSTITUTION:This device is provided with an image pickup element 121 covering picture element numbers in horizontal and vertical directions for a television system requiring a maximum scanning range among plural televisions handled by the element and a switch means 112 selecting the plural television systems. The switch means 112 is used to read undesired picture elements of the image pickup element 121 at a high speed or to skip reading them when a television system whose scanning range is narrower is selected. Thus, the image pickup device is realized, in which one image pickup element is enough to cover the television systems whose scanning range differs from each other by employing the image pickup element provided with picture element numbers in horizontal and vertical directions to cover a television system requiring a maximum scanning range among plural televisions handled by the element and devising to read undesired picture elements of the image pickup element 121 at a high speed or to skip reading them when a television system whose scanning range is narrower is selected in this way.
Patent JP-2000118353-A (JP)
Title: Vehicle key and onboad key device
Inventor: YOSHIZAWA TAKASHI
IPC: B60R25/24
Filed: 1998-10-16
Abstract: PROBLEM TO BE SOLVED: To eliminate the need for replacing a battery built into an on board key. SOLUTION: Electric power induced in a first coil L1 by mutual induction is stored in a capacitor C1, and the electric power accumulated is supplied to either first transmission circuits 11, 12 or second transmission circuits B1, 1a-1c, 13-16. A battery B1 for the second transmission circuits B1, 1a-1c, 13-16 is charged with the electric power stored in the capacitor C1. The need for battery replacement can thus be eliminated and maintainability can be enhanced.
Patent JP-H02142153-A (JP)
Title: Method of connecting semiconductor element
Inventor: ONO TADASHI
IPC: H01L21/60
Filed: 1988-11-22
Abstract: PURPOSE:To dispense with wire bonding work and to facilitate connecting work between a semiconductor element and an extraction electrode by coating the surface of the semiconductor element with a light sensitive resin, performing chemical etching for the light sensitive resin after exposure, exposing the electrode of the semiconductor element, and electrically connecting the electrode of the semiconductor element and the extraction electrode. CONSTITUTION:A copper layer 12 and an extraction electrode 13 are formed on a substrate 11. A semiconductor element 14 is fixed. A liquid light sensitive resin 16 is applied on the part from the upper surface of a semiconductor element 15 to a part on the extraction electrode 13. After the light sensitive resin 16 is dried, a positive mask 19 is mounted thereon. The device is exposed to a plurality of ultraviolet-ray sources 20. A non-polymerized hardened part 21 is treated by chemical etching, and the electrode 15 of the element 14 is exposed. A granular copper material 22 is housed in a recess part 16b on the electrode 15. The granular copper material 22 is used to alleviate the step between a surface 16a of the light sensitive resin 16 and the electrode 15. Copper paste is printed in a pattern by a screen printing method. The paste is dried and baked to form a connecting layer 18.
Patent JP-H09136857-A (JP)
Title: Beat-diketone compound and its metal complex
Inventor: KUBOTA NAOHIRO
IPC: C23C16/18
Filed: 1995-11-14
Abstract: PROBLEM TO BE SOLVED: To provide a new β-diketone compound having an alkyl ether structure capable of forming a metal complex having excellent sustained stability of evaporation characteristics, etc., and useful as a CVD material, etc. SOLUTION: The objective β-diketone compound is expressed by the formula I (R<1> is a 1-6C alkyl; R<2> is a 2-3C alkylene; R<3> is a 1-10C alkylene; R<4> is a 1-18C alkyl, etc.; (n) is an integer of 1-10), e.g. the compound of the formula of the formula II. The compound can be produced by reacting an aliphatic carboxylic acid ester substituted with an alkyloxyalkylenxy group, etc., such as methyl methoxyethylenoxyacetate with pinacolin, etc.
Patent JP-H07146568-A (JP)
Title: Electrophotographic photoreceptor
Inventor: SAITO SAKAE
IPC: G03G5/05
Filed: 1993-11-25
Abstract: PURPOSE:To obtain an electrophotographic photoreceptor excellent in repetitive characteristics by incorporating a specified N,N-diphenylpiperazine compd. into a photosensitive layer. CONSTITUTION:A photosensitive layer contg. an electric charge generating material, an electric charge transferring material and an N,N-diphenylpiperazine compd. represented by the formula is formed on an electric conductive substrate to obtain the objective electrophotographic photoreceptor. In the formula, each of R1 and R2 is H, halogen, 1-5C alkyl which may have one or more substituents, alkoxy, aryl or aralkyl.
Patent JP-H10125408-A (JP)
Title: Connector device
Inventor: KOZAI KAZUYUKI
IPC: H01R13/658
Filed: 1996-10-17
Abstract: PROBLEM TO BE SOLVED: To prevent generation of cross talk by providing a shield plate in at least one space between adjacent contacts. SOLUTION: A shield plate 60 is fitted to the inside of a housing 20. With this structure, adjacent contacts, which are respectively installed in a pair of contact installation holes 22 in right and left, are separated from each other for shielding by a shield piece 61a at parts having knife-shaped grooves 51, 51a. A bent leg part 62 of the shield plate 60 is bent to a contact 50 side provided with the groove 51a, into which a drain wire made of bare wire is to be pressed, and the groove 51a, into which one (grounding side) of a pair of power source cores is pressed, and the leg part 62 is extended so as to secure the elastic contact with the contact 50. Consequently, the whole of the shield plate 60 is grounded so as to obtain the excellent shielding function.  Consequently, even in the case where a cable, which is formed of each pair of signal cores for approach route and return route, is used for contact with a connector 100, generation of cross talk can be effectively restricted.
Patent JP-H05238723-A (JP)
Title: Method for manufacturing pillared phyllosilicate clay
Inventor: JIYOSEFU SAMIYUERU SHIYUBEIMA
IPC: C08F2/00
Filed: 1992-11-05
Abstract: A process for preparing pillared chromium phyllosilicate clay  alpha -olefin catalysts is disclosed This process utilizes palygorskite and sepiolite clays. The pillaring of said clays comprise the steps of: (a) preparing a hydrolyzed first solution by dissolving a chromium salt and a base in water, heating said first solution to a temperature in the range of about 20 DEG C to about 100 DEG C while stirring continuously until the solution reaches a pH in the range of about 1.5 to about 2.5 and thereby producing a master batch; (b) diluting said master batch with water to produce a diluted second solution and heating said diluted second solution to produce a heated second solution; (c) adding a solid clay selected from the group consisting of sepiolites and palagorskites to said heated second solution, and continuing heating; (d) recovering said pillared chain silicate clay; (e) drying said pillared chain silicate clay to form first product; The activation of said clays comprise the steps of: (a) heating said first product at a temperature in the range of about 150 DEG C to about 500 DEG C and for a time period in the range of about 30 minutes to about 10 hours in an inert atmosphere; (b) thereafter reheating said first product at a temperature in the range of about 500 DEG C to about 900 DEG C and for a time period in the range of about 1 hour to about 50 hours in an oxidizing atmosphere and recovering said catalyst composition. This results in clay catalysts which polymerize  alpha -olefins.
Patent JP-H04168727-A (JP)
Title: Manufacture of semiconductor device
Inventor: YAMAGUCHI JUNICHI
IPC: H01L21/3213
Filed: 1990-11-01
Abstract: PURPOSE:To grow an insulating film for protecting a surface uniformly, and to improve quality by continuously repeating the formation and patterning of an aluminum film at least twice and forming an aluminum wiring. CONSTITUTION:A first Al film 2A is formed onto a semiconductor substrate 1 through an evaporation method, and a photo-resist 3 is applied and patterned. The film 2A not masked with the resist 3 is etched through dipping in chemicals, Al is evaporated on the whole surfaces of the films 2A again, and a second Al film 2B is shaped. A mask composed of the photo-resist is formed, but the left and the right of the mask are made thinner than the previously used mask by approximately 0.1mum, and an Al wiring 4A consisting of films 2A, 2B is formed through etching by the mask. Since the wirings 4A have inclined side face shapes, the wirings 4A can be covered uniformly with a surface protective film 5. Accordingly, the intrusion of impurities and foreign matters from a broken section as seen conventional devices can be prevented, thus manufacturing a semiconductor device having high quality.
Patent JP-H07152574-A (JP)
Title: Program loading system
Inventor: TAKANO NAOMI
IPC: G06F9/445
Filed: 1993-11-26
Abstract: PURPOSE:To shorten the program loading time by performing prepaging in parallel with execution of pages of a program at the time of executing the program on a virtual space in a virtual storage system. CONSTITUTION:All pages of the program are loaded into a processor 1 from a secondary storage device 2, and the program is executed, and pages referred to at this time are stored. The program after execution is paged out to a page file 3. When the program paged out to the page file 3 is loaded, one page of the program is paged in to the processor 1, and several pages near this page which are referred to before are paged in during this execution because the probability that these pages are next executed is high. Since the wait for page-in at the time of program execution is reduced at the time of program loading from the page file to the processor, the program execution time is shortened.
Patent JP-H06123285-A (JP)
Title: Diaphragm pump
Inventor: HISHIDA YUJI
IPC: F04B43/02
Filed: 1992-10-07
Abstract: PURPOSE:To prevent excessive deformation and damage of a diaphragm in abnormality of a feed pump. CONSTITUTION:The inside of a pump body 27 is divided into an oil chamber 6 and a pump chamber 10 by a diaphragm 9. A plunger 1 is inserted into a cylinder 2 of the oil chamber 6, in such a manner as being capable of reciprocating motion. A suction side piping 14 and a discharge side piping 18 are made to communicate with the pump chamber 10. A feed pump 13 is provided at the suction side piping 14. An oil supplementing path is made to communicate with the oil chamber 6. A piping for pressure accumulation having an accumulator 17 is made to communicate with the pump chamber 10. A control valve 11 is provided at the piping for pressure accumulation. An action detection sensor 21 is provided in the feed pump 13. A controller 23 judges abnormality at the feed pump based on a detection signal from the action detection sensor 21 and puts out a valve opening signal to the control valve 11.