baber/WOPTO huggingface dataset:
Patent TW-441171-B (TW)
Title: Learning method and apparatus for adaptive digital filter
Inventor: CHEN HEN-JOU
IPC: H03H21/00
Filed: 1999-09-16
Granted: 2001-06-16
Abstract: This invention is about the learning method of an adaptive digital filter. In this method, at first, a signal input source is provided and is used to generate an input signal. An environment system is used to generate a corresponding real output signal based on this input signal. A digital filter is used to generate a corresponding simulated signal based on the input signal and an adjustable signal response. Plural memories are used to memorize the input signal and the real output signal during the period from the predetermined time in the past to the present time. For the execution process of this method, the input signal memorized in the memory is first used to generate a pre-estimated input signal that is used to represent the possible magnitude of this input signal after a predetermined time. In addition, the real output signal memorized in the memory is used to generate a pre-estimated output signal that is used to represent the possible magnitude of this real output signal after a predetermined time. Finally, the signal response of the digital filter is adjusted according to the input signal, pre-estimated input signal, real output signal, and pre-estimated output signal so that the simulated signal can approach the real output signal.
Patent TW-411295-B (TW)
Title: Chemical mechanical polishing a substrate having a filler layer and a stop layer
Inventor: JIN RAYMOND R
IPC: B24B37/04
Filed: 1999-09-22
Granted: 2000-11-11
Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
Patent TW-432906-B (TW)
Title: Electronic circuit board and processing film forming method therefor
Inventor: MUKAISONO YOSHINOBU
IPC: H05K3/06
Filed: 1999-09-23
Granted: 2001-05-01
Abstract: To adjust the thickness of a film and uniform the thickness, by changing the pulling-up speed under the condition that the lower part of a board is in liquid and by giving liquid adhering to the board surface an acceleration. A circulatory conveying route 1 has several device for circulator conveying which convey many grasping tools 3 in an arrow mark A direction in order. An electronic circuit board 4 is conveyed in an arrow mark B direction on an one directional conveying route 2. Confluence sections p1 to p2 include by-pass sections p3 to p4 and a section between a by-pass starting point p3 and a by-pass end point p4 becomes a shuttle section. The circulatory conveying route 1 has a waiting point p5, a stopper is provided at the waiting point p5 and the grasping tools 3 are made to wait on the conveying route after the stopper. The electronic circuit board 4 is moved to the confluence point p1 on an importing part 2A while the posture of the board 4 is changed from a horizontal one to a vertical one. The posture is changed from the vertical one to the horizontal one while the board 4 is moved from the branching point p2 to the next step at the delivery part 2B. The board speed is practically controlled to near zero during board travel by a meniscus between the liquid surface just before the board is lifted up from the surface.
Patent TW-510979-B (TW)
Title: An optical fiber having an expanded mode field diameter and method of expanding the mode field diameter of an optical fiber
Inventor: SRIKANT V
IPC: G02B6/34
Filed: 1999-09-26
Granted: 2002-11-21
Abstract: The present invention is directed to a generally small mode field diameter optical fiber having a core bounded by a cladding, a cleaved end, and an expanded mode field diameter. The expanded MFD is formed by thermally diffusing one or more dopants in the core of the small MFD optical fiber using a highly localized heat source. The resulting adiabatic taper has an expanded MFD that is optimized for connection to another optical fiber having a large MFD. The adiabatic taper is formed in the smaller MFD optical fiber by aligning and abutting the cleaved ends of two fibers having different MFD's to form a splice seam. The splice seam is offset a predetermined distance from the center of the region heated a heat source to splice the fibers and expand the mode field diameters. As the mode field diameters expand, the splice loss across the splice is monitored. When the splice loss is at or sufficiently close to a target loss, heating is terminated, and the spliced optical fiber is cleaved where the MFD of the smaller MFD fiber portion of the spliced optical fiber is optically expanded to match the MFD of another optical fiber.
Patent TW-I222433-B (TW)
Title: Method for production of halogen-containing aromatic compound
Inventor: TESHIMA SEIICHI
IPC: C07C17/18
Filed: 1999-10-14
Granted: 2004-10-21
Abstract: A method for producing inexpensively in a high yield a halogen-containing aromatic compound, particularly a halogen-containing aromatic compound incorporating therein a bromodifluoroalkyl group, and a halogen-containing naphthalene compound useful as a raw material for a resin excelling in heat resistance, chemical resistance and water repellency, and having a low dielectric constant and a low refractivity are provided. This invention relates to a method for the production of an aromatic compound (II) having a (CH2)nCX2Br group (wherein X represents a fluorine or chlorine atom and the X's may be same or different, and n is an integer in the range of 0 to 4) by the reaction of photo-bromination of an aromatic compound (I) having a (CH2)nCX2H group (wherein X and n are as defined above) with a brominating agent, wherein the photo-bromination reaction is carried out while removing hydrogen bromide generated in the reaction system and/or in an atmosphere of a low oxygen content, and a halogen-containing naphthalene compound represented by the following formula (1), wherein Y represents -CF2H, -CF2Br, or -CHO group, Z1 and Z2 independently represent a halogen atom, and p and q independently are an integer in the range of 0 to 3.
Patent TW-477852-B (TW)
Title: Integrated hydrologic circuits
Inventor: HSU KENNETH J
IPC: E02B11/00
Filed: 1999-10-21
Granted: 2002-03-01
Abstract: Covered or underground water reservoirs are formed of a porous medium to minimize evaporative loss and to allow use of the overlying ground surface for other purposes. The level of water in the sub-surface reservoirs can be controlled through the use of reserve reservoirs which can supplement the covered reservoirs during dry seasons and remove excess water from the covered reservoirs during rainy seasons. Water level regulators may be formed as porous boreholes formed in the reservoirs to take and receive water from the reservoirs so as to control their level. Boreholes and tunnels can be drilled or dug into the water table to recharge groundwater, and also to reduce the threat of flooding.
Patent TW-435054-B (TW)
Title: Color electroluminescent display device
Inventor: YOKOYAMA RYOICHI
IPC: H05B33/12
Filed: 1999-10-26
Granted: 2001-05-16
Abstract: The present invention is a color electroluminescent display device to be more delicate by highly integration of pixels, and also to keep good color purity by preventing the luminescent layers emitting different colors due to manufacturing errors from being mixed. A first TFT 4, a capacitor 5, a second TFT 6, and an EL element 7 are sequentially arranged in a pixel of the device such that the capacitor 5 functions as a wiring for connecting a source of the first TFT 4 and a gate of the second TFT 6, whereby a dense configuration is formed within the pixel. Further, due to the above-mentioned order of arrangement, error tolerance space can be provided between pixels of the EL elements 7 in the vertical direction. Therefore, even though the alignment accuracy of metal mask is low at the time of forming the light-emitting layer, different colors won't mix with each other to maintain good color purity.
Patent TW-546391-B (TW)
Title: Method of manufacturing metallic products such as sheet by cold working and flash annealing
Inventor: HAJALIGOL MOHAMMAD R
IPC: C23C4/18
Filed: 2000-02-09
Granted: 2003-08-11
Abstract: A metallic alloy composition is manufactured into products such as press formed or stamped products or rolled products such as sheet, strip, rod, wire or band by one or more cold working steps with intermediate or final flash annealing. The method can include cold rolling an iron, nickel or titanium aluminide alloy and annealing the cold worked product in a furnace by infrared heating. The flash annealing is preferably carried out by rapidly heating the cold worked product to an elevated temperature for less than one minute. The flash annealing is effective to reduce surface hardness of the cold worked product sufficiently to allow further cold working. The product to be cold worked can be prepared by casting the alloy or by a powder metallurgical technique such as tape casting a mixture of metal powder and a binder, roll compacting a mixture of the powder and a binder or plasma spraying the powder onto a substrate. In the case of tape casting or roll compaction, the initial powder product can be heated to a temperature sufficient to remove volatile components. The method can be used to form a cold rolled sheet which is formed into an electrical resistance heating element capable of heating to 900 DEG C in less than 1 second when a voltage up to 10 volts and up to 6 amps is passed through the heating element.
Patent TW-500665-B (TW)
Title: Moldable composite article
Inventor: COPPERWHEAT STEPHEN D
IPC: B32B5/26
Filed: 2000-05-15
Granted: 2002-09-01
Abstract: A moldable composite article which includes a layer of formable fabric of the type which when subjected to molding under heat and/or pressure possesses a high degree of stiffness. A layer of variable compression fabric capable of assuming variable thickness when subjected to molding under heat and/or pressure being bonded to the surface of the formable fabric, with said layers are made of the same thermoformable polymeric chemical substance.
Patent TW-553877-B (TW)
Title: Equipment to process wafers
Inventor: KLAEBSCH ROLF-ANNO
IPC: H01L21/677
Filed: 2000-07-29
Granted: 2003-09-21
Abstract: This invention relates to an equipment to process wafers in at least one clean-room (3) with an arrangement of production-units (1) to carry out each production-step and/or measurement-units to control the production-steps, these units are connected to supply and to transport out the wafers through a transport-system. These wafers are combined into several variable batch-sizes, said batch-sizes are adaptive to the capacities of the production-units (1), measurement-units (2) and/or the transport-system.
Patent TW-I270530-B (TW)
Title: Use of multifunctional Si-based oligomer/polymer for the surface modification of nanoporous silica films
Inventor: WU HUI-JUNG
Filed: 2000-06-07
Granted: 2007-01-11
Abstract: A process for treating a silica film on a substrate, which includes reacting a suitable silica film with an effective amount of a surface modification agent, wherein the silica film is present on a substrate. The reaction is conducted under suitable conditions and for a period of time sufficient for the surface modification agent to form a hydrophobic coating on the film. The surface modification agent includes at least one type of oligomer or polymer reactive with silanols on the silica film. Dielectric films and integrated circuits including such films are also disclosed.
Patent TW-522056-B (TW)
Title: Method and plant for rolling multiple billets fed from a billet-heating furnace set upstream of a roll train
Inventor: POMETTO VIRGINIO
IPC: B21B1/02
Filed: 2000-06-29
Granted: 2003-03-01
Abstract: The invention regards a method for rolling billets fed from a billet-heating furnace (10) set upstream of a roll train, in which, between the furnace (10) and a first stand (11) of the roll train is provided a space for transfer of the billets coming out of the furnace. In the space between the furnace (10) and the stand (11) at least two billets (15, 14) are welded together and subsequently introduced into said stand (11).
Patent TW-451349-B (TW)
Title: Planarization process of film layer in semiconductor process
Inventor: LI TZ-LIANG
IPC: H01L21/306
Filed: 2000-07-18
Granted: 2001-08-21
Abstract: A planarization process of film layer on semiconductor substrate is disclosed. By putting the semiconductor substrate on the spin etcher and proceeding spin etching procedure to the film layer, wherein reactive etching solution containing abrasive particles is sprayed on the spinning semiconductor substrate, the planarization of film layer can be achieved. The reactive etching solution can proceed the etching and polishing effect in the way of chemical reaction, and the abrasive particle doped inside it can collide with the surface of the film layer through the spinning speed to generate etching effect in the vertical direction. Since the semiconductor substrate is spinning, the abrasive particles are acted by the centrifugal force to proceed polishing along the upper surface of the film layer in the horizontal direction at the same time.
Patent TW-509623-B (TW)
Title: Method and device for producing hidden zipper free of core line
Inventor: YANG JIN-SHUEI
IPC: D05B35/06
Filed: 2000-08-16
Granted: 2002-11-11
Abstract: The present invention relates to a method and a device for producing a hidden zipper free of core line. The method comprises directly and reversely feeding an individual and separate zipper teeth chain in a relaxed state after forming into the needle seat of a machine; simultaneously feeding a to-be-sewn cloth belt into the dial of the machine in order to sew the zipper teeth chain on the cloth belt such that the teeth chains on the two sides of the hidden zipper free of core line do not need to be separated by a separation rod of the zipper teeth chain prior being fed to the needle seat. Meanwhile, the gap between the zipper teeth chains can be prevented from deformation due to stretching in order to prevent the formation of a crimped product with uneven sides, as well as the occurrence of shrunk-teeth, detached teeth, latching, etc.
Patent TW-567131-B (TW)
Title: Heat-insulating material
Inventor: NISHIDA ISAMU
IPC: F16L59/12
Filed: 2000-09-21
Granted: 2003-12-21
Abstract: To provide a heat-insulating material (A) which can be freely cut and installed conveniently to a necessary area. The heat-insulating material (A) consists of a heat-insulating sheet (1) capable of elastic deformation and cutting and a magnet sheet (2) pasted to one side of the heat-insulting sheet (1). While being used, the magnet sheet (2) side of the heat-insulting material (A) is installed in a detachable manner onto the metal heat-radiation plane requiring heat insulation.
Patent TW-521095-B (TW)
Title: High strength hot-dip galvanized steel sheet having excellent formability and galvanizing property, and a method for producing thereof
Inventor: OSAWA KAZUNORI
IPC: C22C38/16
Filed: 2000-10-20
Granted: 2003-02-21
Abstract: A hot-dip galvanized high-strength steel sheet having superior workability and galvanizability containing: 0.01% to 0.20% by weight of C; 1.0% by weight or less of Si; more than 1.5% to 3.0% by weight of Mn; 0.10% by weight or less of P; 0.05% by weight or less of S; 0.10% by weight or less of Al; 0.010% by weight or less of N; 0.010% to 1.0% by weight in total of at least one element selected from the group consisting of Ti, Nb, and V; and the balance being Fe and incidental impurities; in which the steel sheet has the metal structure in which the areal rate of the ferrite phase is 50% or more, the ferrite phase has an average grain diameter of 10 μm or less, and the thickness of a band-like structure composed of the second phase satisfies the relationship Tb/T ≤ 0.005, where Tb is the average thickness in the sheet thickness direction of the band-like structure and T is the thickness of the steel sheet, and a method for producing the same. To provide a method for producing a hot-dip galvanized high-strength steel sheet in which superior workability and high strength are obtained and moreover satisfactory galvanizability is obtained when galvanizing is performed using facilities such as a continuous galvanizing line.
Patent TW-483296-B (TW)
Title: Composition for preventing creeping of a flux for soldering and use thereof
Inventor: ODAKA SYUNJI
IPC: H05K3/34
Filed: 2000-11-01
Granted: 2002-04-11
Abstract: A composition for preventing creeping of a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment is provided. The composition comprising a polymer (A) containing the polymer units (a1) derived from an unsaturated ester containing a polyfluoroalkyl group and the polymer units (b1) derived from a compound containing a silicon atom and an unsaturated group, and an aqueous medium (B), further optionally including a fluorine type surfactant (C).
Patent TW-514875-B (TW)
Title: Commercial skip and chapter delineation feature on DVD recordable media
Inventor: CHRISTOPHER LAUREN ANN
IPC: H04N21/2387
Filed: 2000-11-10
Granted: 2002-12-21
Abstract: A method and apparatus for controlling an MPEG video media recording device to automatically identify and selectively skip segments of a video signal, such as commercial advertisements, during a recording session. During an MPEG video data recording session the system continuously monitors the video data being recorded to detect a scene change occurring over one or more image fields. In response to a detected scene change, the system stores in a file a time and record location on the media corresponding to the occurrence of the scene change. Depending upon the time interval between several of the detected scene changes, the system identifies a corresponding video segment as either a commercial advertisement or a chapter boundary. By identifying the segments in this way, the playback presentation can then be selectively controlled.
Patent TW-465004-B (TW)
Title: Method and apparatus for yield enhancement of back-thinned wafers
Inventor: LIN GUANG-PENG
IPC: H01L21/66
Filed: 2000-12-05
Granted: 2001-11-21
Abstract: The present invention provides a yield enhancement apparatus for back-thinned wafers which comprises: (1) a thickness calibration wafer composed of oxide; (2) a wafer attacher using water as adhesive to attach the back side of the back-thinned wafer to the thickness calibration wafer and to increase the thickness of the back-thinned semiconductor wafers, so that it is possible for a wafer defect inspection device to perform defect inspection on back-thinned semiconductor wafers. The wafer attacher includes: (1) a stage for placing the thickness calibration wafer; (2) a pair of slide bars located on the stage, allowing the back-thinned semiconductor wafer to slide thereon, wherein the distance between two slide bars is the same as the diameter of the back-thinned semiconductor wafer; (3) at least one stopper located on the stage to stop the calibration part of the back-thinned semiconductor wafer thereon.
Patent TW-510870-B (TW)
Title: Rail-truck system
Inventor: KAWAGUCHI MASATOMI
IPC: B65G1/04
Filed: 2001-01-09
Granted: 2002-11-21
Abstract: This invention provides a rail-truck system, where lead-in tracks 6 and 7 from main tracks 4 and 5 of this rail truck system are provided on upper parts of racks 24 of automated warehouses 20. Articles are directly transferred between stacker cranes 22 and ground-primary linear carrying truck 14. This invention prevents a linear carrying truck in course of transferring articles from/to an automated warehouse from blocking a main track and to allow outrunning by using a lead-in track as a refuge track.
Patent TW-I255809-B (TW)
Title: Aryl and heteroarylcylopropyl oxime ethers and their use as fungicides and insecticides
Inventor: ROSS RONALD JR
IPC: C07C251/06
Filed: 2001-01-20
Granted: 2006-06-01
Abstract: Certain cyclopropyl oxime ethers substituted by aryl and heterocyclic moieties possess broad spectrum fungicidal and insecticidal properties. These compounds are disclosed along with compositions containing these compounds and methods for controlling fungi and insects by the use of a fungitoxic or insecticidal amount of these compounds.
Patent TW-501358-B (TW)
Title: High speed scanner using multiple sensing devices
Inventor: BOHN DAVID D
IPC: H04N1/191
Filed: 2001-02-16
Granted: 2002-09-01
Abstract: An apparatus for increasing the speed at which an object can be optically scanned. First and second optical signals [351, 352] from first and second areas [361, 362] of an object [110] are focused respectively onto first and second optical sensor arrays [381, 382]. Image data signals 1385386] from first and second optical sensor arrays [381, 382] are interlaced in a detection circuit [390] to form a composite image of the object [110]. By exposing the first area [361] during the time that the optical signal [352] from exposure of the second area [362] is being clocked out and by exposing the second area [362] during the time that the optical signal [351] from exposure of the first area [361] is being clocked out, the object [110] can be scanned at a faster rate. Specialized image sensors do not need to be developed. Commercially available image sensors [381, 382] can be used. In particular, increased scan speed could result from placing two relatively inexpensive, commercially available charge coupled devices (CCD's) or complementary metal-oxide-semiconductor (CMOS) image sensors [381, 382] parallel to each other and alternatively exposing near-by areas [361, 362] of the object.
Patent TW-I220544-B (TW)
Title: Flip-chip type semiconductor device and method of manufacturing the same
Inventor: HONDA HIROKAZU
IPC: H01L21/60
Filed: 2001-02-20
Granted: 2004-08-21
Abstract: In a flip-chip type semiconductor device, a pad electrode and a passivation film are formed on a semiconductor substrate. An insulating resin layer is formed on the passivation film, and an opening is formed above the electrode. A pad electrode adhesive metal film is formed on the substrate like a re-wiring pattern, and a plating feed layer metal film and a Cu plating layer are sequentially formed on the metal film to form a wiring layer. A metal post electrode is formed on the wiring layer. A solder bump is formed on the post electrodes, a support plate in which holes each having a diameter larger than the diameter of the solder bump are formed at positions adjusted to the solder bumps is arranged, and an insulating resin layer is formed between the support plate and the semiconductor substrate. Therefore, a stress acting on the solder bump is moderated.
Patent TW-584888-B (TW)
Title: Organic electroluminescent display and manufacturing method thereof
Inventor: JUNG JIA-TING
IPC: H01L21/00
Filed: 2001-03-22
Granted: 2004-04-21
Abstract: An organic electroluminescent display and manufacturing method thereof are disclosed. The organic electroluminescent display comprises: a substrate with at least a trench thereon; a metal film disposed inside the trench; an anode conduction layer covering the surface of the substrate and the metal film; a hole transport layer covering the surface of the anode conduction layer; an organic light-emitting layer covering the surface of the hole transport layer; and a cathode metal layer covering the surface of the luminescent layer, wherein the resistance of the metal film is lower than that of the anode conduction layer.