baber/WOPTO huggingface dataset:
Patent JP-S5551576-A (JP)
Title: Printing mechanism
Inventor: KOTANINO TAKANOBU
IPC: B41J27/20
Filed: 1978-10-06
Abstract: PURPOSE: To provide a simply-constructed, of small-size, durable, easy-in-maintenance printing mechanism provided with an ink supply member for supplying ink to a ink transfer member and a transcribing member for impregnating a character printer head with ink.  
     CONSTITUTION: While transferring in parallel to an ink transfer member 21, a printer head 22 follows the printing instruction from the control circuit of a printer to let a wire 23 come out of standby position to beat the ink transfer memeber 21 via printing paper 24. Then, the ink contained in the ink transfer section 21 attaches to the surface A of the printing paper 24 to make printing. The wire 23 is reset in standby position by a spring for example. Ink is supplied to the ink transfer member 21 through the contacting surface of an ink supply member 20 constantly, and to an ink pad section 202 by direct dripping or by replacing the ink pad section 202. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-H07333446-A (JP)
Title: Optical multiplexer/demultiplexer
Inventor: YAMADA HIROAKI
IPC: G02F1/01
Filed: 1994-06-06
Abstract: PURPOSE:To provide an array waveguide diffraction type optical frequency multiplexer/demultiplexer which is improved in side lobe suppression ratio. CONSTITUTION:This waveguide diffraction type optical frequency multiplexer/ demultiplexer is formed by successively connecting an input waveguide 2, a first slab waveguide 3, plural channel waveguides 4 varying in length, a second slab waveguide 5 and an output waveguide 6 on a substrate 1. The multiplexer/ demultiplexer described above has a thermooptical phase shifter 11 for discretely controlling the phases of the plural channel waveguides 4 to discretely control the phases in such a manner that the errors of the phase change rates in the respective channel waveguides are kept constant. As a result, the errors of the phase change rates in the channel waveguides induced by a fluctuation in refractive index at the time of forming the waveguides are decreased and the side lobe suppression ratio is improved.
Patent JP-H02304968-A (JP)
Title: Semiconductor memory device and manufacture thereof
Inventor: TAKASE SHUNJI
IPC: H01L27/108
Filed: 1989-05-19
Abstract: PURPOSE:To enable the length in short-side direction between cells per bit to be reduced further by using a lead-out electrode by a wiring layer which is different from a bit wire for connecting the bit wire and a diffusion layer of a switching transistor and by forming a bit contact on a field. CONSTITUTION:A take-out electrode 36 by a wiring layer which is different from a bit wire 39 is used for connecting the bit wire 39 and a diffusion layer of a switching transistor to form a bit contact on a field, thus enabling the take-out electrode 36 and the bit wire 39 to be overlapped each other. This permitted overlapping contributes to reduce a length A in short-side direction between cells and eliminates the bit-wire-contact margin at the field side, thus enabling the length A in short-side direction between cells up to l1 (gap between bit wires) + l2 (bit wire -bit contact margin) + l3 (bit contact dimensions).
Patent JP-H08296697-A (JP)
Title: Torsional damper
Inventor: TAKANO KAZUYA
IPC: F16F15/126
Filed: 1995-04-25
Abstract: PURPOSE: To improve durability of an elastic body by arranging cooling fins on a cylindrical part and a connection part, and thereby escaping self-heat generated when the vibration is absorbed. CONSTITUTION: A torsional damper is composed of a pulley body 10 made up of a boss 2 installed on a rotary shaft, a cylindrical part 3 located on a diametral outer side of the boss 2, and a connection part 4 therebetween, and a damper mass 6 prepared by concentrically winding a power transmission belt on an outer peripheral surface of the cylindrical part 3 through an elastic body 5, the cylindrical part 3 being integrated with the connection part 4 both made of synthetic resin. Cooling fins 7 are arranged on the cylindrical part 3 and the connection part 4. A thermal conduction rate of the synthetic resin is small compared to that of metal member, so that self-heat generated when the elastic body of the damper absorbs vibration is less apt to escape. The heat is efficiently scattered by the cooling fins 7.
Patent JP-H02303843-A (JP)
Title: Recorder and recording method
Inventor: YAMASHITA TOMIO
IPC: B41J2/01
Filed: 1989-05-19
Abstract: PURPOSE:To execute good recording by a method wherein an adhesive characteristic of ink on a surface of a recording material is improved by a just before printing treatment and then, ink jet recording is performed. CONSTITUTION:A thermal transfer head 22 of which a recording dot size is larger than a font to be ink jet recorded, an ink ribbon which is wound round between this head and recording paper, an ink ribbon feed reel, an ink ribbon winding reel, and an ink jet recording head are mounted on a carriage. Through the ink jet head is fitted to a position which is more delayed by N dots in a printing direction than the thermal transfer head 22, printing is so controlled than the ink jet head records an ink dot by a same printing data printed with the thermal transfer head at a point of time when the carriage is moved by N dots, and records by ink jet over again on a pretreatment pattern 21. Consequently an ink drop 23 is adhered onto the pattern 21 which was transferred as pretreatment on recording paper 20 with the thermal transfer head by ink jet recording.
Patent JP-2000284887-A (JP)
Title: Finger tool for supporting keyboard operation
Inventor: SUWA SHUNSUKE
IPC: G06F3/02
Filed: 1999-03-29
Abstract: PROBLEM TO BE SOLVED: To operate keys without being obstructed by long nails by providing a ring part so as to mount to a finger via a finger supporting part made of synthetic resin mounted with a key operating part made of soft resin at a lower part. SOLUTION: A finger tool A for supporting keyboard operation has a finger supporting part 2, which is fitted with a key operating part 1 (soft resin such as foaming body) for obtaining a height between the finger and a key on a keyboard at the lower part of a tip and is made of synthetic resin (such as ABC resin) in the shape of a circular ark to be fitted to the finger, and is provided with a ring part 3 given a crevice for adjusting the thickness of the finger at the upper part of its terminal. When operated by using this tool A, since the height is obtained between the finger and the key on the keyboard, a user can operate the key without being obstructed by his/her long nail. In addition, it is possible to provide the supporting part of the key operating part at the lower part of the tip of the part 2 so as to exchange the part 1.
Patent JP-H08316505-A (JP)
Title: Simple sealing part for optical semiconductor device
Inventor: HIBINO YOSHINORI
IPC: H01L23/28
Filed: 1995-05-24
Abstract: PURPOSE: To entirely avert the effect of humidity to the title photosemiconductor device for improving the reliability upon the title photosemiconductor device by covering the photosemiconductor device loaded on a carrier with double- structured protective cap. CONSTITUTION: The title simple sealing part for the sealing the device by covering the whole body of the optical semiconductor device fixed on a carrier downward by a protective cap to be adhesion-fixed to the carrier is composed of an inside protective cap 14 for covering the whole body to be bonded onto the carrier 11 as well as an outside protective cap 16 for sealing the inside protective cap 14 with the bonding part of the carrier 11.
Patent JP-H06316706-A (JP)
Title: Production of high strength w-ni-fe alloy sintered body
Inventor: MURAI MASAMITSU
IPC: C22C1/04
Filed: 1993-04-30
Abstract: PURPOSE:To obtain a high strength sintered body in which only the surface layer part is partially softened and given high toughness, at the time of producing the sintered body of a W-Ni-Fe alloy having a specified compsn. by rapidly heating the sintered body to a specified temp. after post-heat treatment and thereafter rapidly cooling it. CONSTITUTION:A compacted body contg., by weight, 85 to 98% W, and the balance essential Ni and Fe is sintered, is subjected to work strengthening and is, moreover, subjected to heat treatment to produce the high strength W-Ni-Fe alloy sintered body. In this method, after the post-sintering, the sintered body 1 is inserted, e.g. into high frequency heating coil 2 and ring-shaped water- cooled jackets 3 on both sides, which is gradually moved in the axial direction of the sintered body. Then, the sintered body 1 is rapidly heated to >=1000 deg.C, to 1000 to 1300 deg.C, e.g. at >=30 deg.C/sec temp. rising rate and is thereafter subjected to surface heat treatment by executing rapid cooling, e.g. at >=30 deg.C/sec cooling rate. By this method, the influence of heat to the inside of the sintered body can extremely be reduced, and only the surface layer part is partially softened and given high toughness while the strength and toughness at the inside are maintained.
Patent JP-H08316254-A (JP)
Title: Pressure contact-type semiconductor device
Inventor: MORITA TOSHIAKI
IPC: H01L21/52
Filed: 1995-05-24
Abstract: PURPOSE: To obtain a pressure contact-type semiconductor device which reduces a thermal stress, which obtains high reliability and which obtains an excellent electric characteristic by a method wherein thermal buffer electrode plates whose surface roughness is substantially at a specific value or lower are formed between electrodes formed on both main faces of a semiconductor element substrate and one pair of external electrodes. CONSTITUTION: A pressure contact-type semiconductor device is provided with a semiconductor element substrate 1 which comprises at least one P-N junction and with electrodes 2, 6 formed respectively on both main faces of the semiconductor element substrate 1. In addition, the pressure contact-type semiconductor device is provided with thermal buffer electrode plates 3, 7 which are connected to the electrodes 2, 6 and whose surface roughness Ra is substantially at 0.15 or lower and with one pair of external electrodes 4, 8 which bring both main faces of the semiconductor element substrate 1 into pressure contact via the thermal buffer electrode plates 3, 7.  For example, thermal buffer electrode plates 3, 7 which are constituted respectively of molybdenum are bonded, via porous bonding layers 5, 9 which are constituted of gold, a gold alloy, silver or a silver alloy, to the outside of a cathode electrode 2, an anode electrode 6 and a gate electrode 10 which are constituted of aluminum.
Patent JP-H01293366-A (JP)
Title: Image processing device
Inventor: NAKATANI KEIJI
IPC: G03G15/00
Filed: 1988-05-20
Abstract: PURPOSE:To detect the size of an original automatically by calculating it from the position of the original's edge detected with digital data obtained by preliminary scan performed prior to regular scan. CONSTITUTION:When a digital optical system is selected by a CPU 1, a second scan signal is generated to be transmitted to a CPU 2 controlling optical systems. In the CPU 2, a scanning process is initiated responding to this signal. When a timing signal of ON edge is detected, an image sampling by a CCD is started. At this time, from which photodetector of the CCD receives strong light is detected and the edge of the original is found in that direction so as to determine the size of the original. The preliminary scan is thus performed and the size of the original is calculated prior to the regular scan. As a result, efficiency for use is improved.
Patent JP-H10301076-A (JP)
Title: Lighting test device of liquid crystal panel
Inventor: KOSHIO YOSHIHIRO
IPC: G09F9/00
Filed: 1997-04-30
Abstract: PROBLEM TO BE SOLVED: To greatly simplify the constitution of the contact unit for the lighting test of a liquid crystal panel and to inexpensively manufacture the device by providing the IC chips, which are actually mounted on the panel, on the contact unit that is freely attachable and detachable to the transparent substrate of the panel. SOLUTION: The contact unit provided to a contact section is used as a lifting means and a supporting plate is provided in a freely lifting and lowering manner. A substrate holder 44 is mounted on the plate, an input control circuit substrate 15 is clamped in a freely attachable and detachable manner, a cushion member 45 is abutted and chip holders 46, whose total number corresponds to the number of IC chips 14 that are mounted on each edge of a liquid crystal panel 10, are connected. Cushion members 47 such as rubber and mounting plates 47a are fixed to the holders 46. The chips 14 are mounted on the plates 47a by adhesive means in a freely attachable and detachable manner. The plate, on which the holder 44 and the holders 46 are mounted, is moved in the up and down directions.
Patent JP-S5826709-A (JP)
Title: Method of constructing bucket elevator
Inventor: SAKAMOTO AKIRA
IPC: E04H7/22
Filed: 1981-08-11
Abstract: PURPOSE:To obtain a method of constructing a bucket elevator wherein a centering operation is not required, all of the casing assembling operation can be carried out on the ground, and operations at an elevated position is not required. CONSTITUTION:First, a head part 4 is placed on top of a silo 1 using a crane or other means. Then wires 10 are allowed to depend from a casing connection part 40 of the head 4, and a first casing 3a is suspended. The connection of the wires 10 with the casing 3a is effected using a suitable clamping device 10'. With the first casing 3a suspended, a next casing 3b is joined, the wires 10 are pulled up, and in this manner casings 3 are successively joined. After all of the casings 3 are joined, a boot 2 is attached, and finally the first casing 3a and the head part 4 are joined to complete the operation.
Patent JP-H0661439-A (JP)
Title: Semiconductor integrated circuit device
Inventor: ITO RIEKO
IPC: H01L27/04
Filed: 1992-05-18
Abstract: PURPOSE:To reduce the chip size by improving a layout in a CMOS output circuit provided with a protective circuit. CONSTITUTION:A P<+> type diffused layer 13 connected to a VSS line 7 is formed to face in parallel with, an N<+> type drain 12 for an N-ch transistor 3, and a protective diode 5 is constituted. An N<+> type diffused layer 23 is formed so as to face in parallel with, a P<+> type drain 22 for a P-ch transistor 4, and a protective diode 6 is constituted.
Patent JP-S615125-A (JP)
Title: Foundation of building
Inventor: RIKITAKE SHIYOUNOSUKE
IPC: E02D3/12
Filed: 1984-06-18
Abstract: PURPOSE:To obtain a low-cost foundation structure with good efficiency by a method in which ground-improving piles are continuously provided at a given depth under underground beams, and the upper parts of the foundation piles at the pile positions are connected in a wall form. CONSTITUTION:Foundation piles 1 are driven in the positions of piles 7 until they reach the bearing stratum where given bearing capacity could be obtained. Smaller diameter and shorter ground-improving piles than the foundation pile 1 are continuously provided between the foundation piles 1, and underground beams 3 are provided on the upper end of the ground-improving piles row of a wall form. The piles 2 are provided on the peripheral position and main places of a building and ground-improving piles 2' made of only soil cement without reinforcing bars are set at a given interval in the other portions. The horizontal displacement amount of building during the earthquake can thus be reduced. Also, since the soil below the building can be restricted for every small section, this method can be effectively applicable for measures against the liquefaction of the ground.
Patent JP-2000315721-A (JP)
Title: Identification structure of substrate housing container and identification method thereof
Inventor: HOSOI MASATO
IPC: B65D85/86
Filed: 1999-04-30
Abstract: PROBLEM TO BE SOLVED: To contrive a suppression of the investment amount of a metal mold or the like and the simplification of a control of a product, to make it possible to easily grasp information on a substrate housing container, and also to make it possible to simply mount the container. SOLUTION: This structure is provided with a bottom plate 15 hinged on the bottom of a container main body for housing wafers in an alignment with each other, a through hole 18C perforated in an identification region of the plate 15, and identification bodies 19 selectively fitted into a plurality of the through holes 18C. The identification body 19 is formed as a bottomed cylindrical body 20, and flange parts 21 and 23 engaged with the peripheral edge parts of the hole 18C from one end part of the bottomed cylindrical body 2 and all the outer periphery of the other end of an aperture in the cylindrical body 20 are extruded outward, respectively.  A slant insertion surface 24, which gradually narrows as the insertion surface 24 turns from the direction of the one end part to the direction of the other end part of the aperture, is formed on the flange part 23 on the other end part of the aperture, and it is enabled to fit the cylindrical body 20 into the hole 18C even from either of the upper and lower parts of the plate 15. Information on a substrate housing container is known by identification on the basis of the inserted structure of the cylindrical body 20.
Patent JP-S63290679-A (JP)
Inventor: JIYANNKUROODO DORIATO
IPC: B22D27/15
Filed: 1987-05-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6146071-A (JP)
Inventor: JIEEMUSU ANTONII BENJIYAMIN
IPC: H01L29/78
Filed: 1985-06-08
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S5650753-A (JP)
Title: Block assembling mold
Inventor: OKAMOTO SETSUO
IPC: B22C7/00
Filed: 1979-09-28
Abstract: PURPOSE: To considerably improve the life of a mold for casting a longitudinally short steel ingot and make possible the changing of the mold size simply by exchanging seqments by forming at least one of the segments constituting the long and short sides of the mold into split dies by block assembling.  
     CONSTITUTION: A block assembling mold 21 is constituted by segments 22W25 and corners 26W29 and the respective segments are bolted suitably to the respective corners from the outer side of the mold at, for example, 4 positions of top, bottom, right and left. The segments may be made by a casting method in the same manner as for the corners but it is equally well to make them by machining. It is desirable that the corners 28 and the segments 24 are fixed by means of bolts 32 via the plates 31 fitted into grooves. The butt faces 33 of the corners and segments are subjected to shaper finishing to prevent the leakage or oozing of molten metal during pouring. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H11314771-A (JP)
Title: Photosensitive form plate feeder and form plate packaging box
Inventor: USUI TAKAYUKI
IPC: G03F7/00
Filed: 1998-05-07
Abstract: PROBLEM TO BE SOLVED: To dispense with work to open the packing material of a photosensitive plate, and simultaneously to do the loading operations of this photosensitive plate under bright surroundings. SOLUTION: In the case where an on-off cover 48 is separated from its own box 46, a driving part 60 is shifted from a standby position to be shown by a full line to a suction position to be shown by a two-dot chain line, and then a suction pump 68 piped to a suction cup 74 is driven. With this, the suction cup 74 is sucked to the on-off cover 48. After the on-off cover 48 is sucked by the suction cup 74, when the driving part 60 is shifted toward the standby position, the on-off cover 48 is separated from the its own box 46 together with the driving part 60 whereby an upper opening of the box 46 is made into a state of being opened. In addition, when the on-off cover 48 is shifted to the suction position of the driving part 60 held in the standby position, the cover 48 is covered on the box 46 and thereby the upper opening of the box 46 is made into a state of being closed.
Patent JP-H01295307-A (JP)
Title: Controller for magnification/reduction of pattern
Inventor: MIYATA MITSUTO
IPC: G05B19/4061
Filed: 1988-05-23
Abstract: PURPOSE:To easily check the complicated form of working parts by magnifying/ reducing simultaneously the optional parts of plural patterns displayed on a single screen, and displaying them after after changing each part into an optional magnifying power of each graphic unit. CONSTITUTION:An operator selects the patterns 2 and 3 to undergo the magnification control out of plural patterns displayed on a screen 1, then designates the ranges 4 and 5 to be magnified for both patterns 2 and 3 respectively by means of a cursor. Then the operator designates the magnifying power. Based on this magnifying power, a numerical controller reads out the picture memories within said ranges 4 and 5. For example, a pattern 6 is obtained by magnifying a pattern of the range 4 by a designated magnifying power and displayed at the right side on the screen 1. While a pattern 6 obtained by magnifying a pattern of the range 5 by a designated magnifying power is shown at the left side on the screen 1 respectively. In such a way, the optional parts 4 and 5 of both patterns 2 and 3 displayed on a single screen are changed into the different magnifying powers for each pattern unit respectively and displayed at one time. Thus the operator can easily perform the comparison and reference among those patterns displayed on a single screen.
Patent JP-S5825693-A (JP)
Inventor: WATANABE TSUNEYA
IPC: G09G5/02
Filed: 1981-08-08
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S62283069-A (JP)
Title: Four-wheel steering device
Inventor: UNOSAKI YOSHIHIDE
IPC: B62D7/14
Filed: 1986-05-29
Abstract: PURPOSE:To enable rear wheels to be steered quickly and positively close to a target steering angle so as to be suspended smoothly at the time of quick steering by providing a partition number correction means which makes a digital partition number corresponding to an unit rear wheel steering angle vary in inverse proportion to the steering speed of front wheels. CONSTITUTION:When front wheel steering speed is high, an angle corresponding to one pulse as an input rear wheel steering angle information for a feedback control is four times as much as that of low speed steering. And a motor 21 is controlled in such a way that an actual rear wheel steering angle information thetar of a certain width to be detected corresponds with a target rear wheel steering angle deltar. Namely, if a steering angle deltar is out of an angular width meant by the information thetar, the rotational direction of the motor 21 is determined for outputting a rotational output signal to a circuit 21b whereby the motor 21 is suspended by a hold signal as soon as the angle deltar falls within the angular width of the information thetar. By the aforesaid constitution, when rear wheels are steered quickly and extensively, even if a rear wheel steering mechanism 10 somewhat overruns by inertia after the hold signal has been outputted, the steering angle deltar does not come out of the angular width of the information thetar whereby the rear wheel steering mechanism is suspended smoothly.