baber/WOPTO huggingface dataset:
Patent JP-S63284225-A (JP)
Title: Aqueous dispersion of cationic polymer and use thereof
Inventor: OMAE TADAYUKI
IPC: C08L23/26
Filed: 1987-11-09
Abstract: PURPOSE:To provide the title aqueous dispersion which gives a semiconductive laminate excellent in antistatic properties and low in temperature-dependancy of the recording density, by effecting addition reaction of a quaternary salt of a specific ethylene copolymer and an epihalohydrin compound. CONSTITUTION:40-80wt.% ethylene and 60-20 aminoalkylacrylamide comonomer of the formula (wherein R1 is H or methyl; R2-3 are each H or 1-4C alkyl; and n is 2-4) are reacted under a pressure of 500-3,000kg/cm<2> at 100-300 deg.C to produce an ethylene copolymer having an MI (JIS K-6760) of 10-1,000g/10min. Then, 100mol. parts amino group in the copolymer and 50-200mol. parts hydrochloric acid are reacted in water at 600-100 deg.C for 30-120min to obtain the quaternary hydrochloride of the copolymer. Thereafter, 100mol. parts amino group in the copolymer and 50-200mol. parts epihalohydrin compound (e.g., epichlorohydrin) are reacted at 20-100 deg.C for 30-300.
Patent JP-H09184078-A (JP)
Title: Plating treating jig and plating treatment by using the plating treating jig
Inventor: IKEDA TOMOHIRO
IPC: C23C18/16
Filed: 1996-10-25
Abstract: PROBLEM TO BE SOLVED: To improve the productivity in electroless plating of a corrugated tube, to improve quality and to reduce a manufacturing cost by preventing air pooling and scooping out of a plating liquid and making one-time of long- sized plating treatment possible. SOLUTION: The plating treating jig of the corrugated tube is provided with a rectilinear central rod 23, circumferential rods 25 which are formed spirally around this central rod 23 as a central axis, supporting rods 27 which are fixed at their base ends to the central rod 23 and are extended at their front ends in the radial direction of the circumferential rod 25 and hanging rods 29 which are disposed at the front ends of these supplying rods 27, are extended in the same direction as the central rod 23 and are connected to the outer peripheral surface on one end side of the circumferential rod 25.
Patent JP-H04161579-A (JP)
Title: Latch for door locking device of vehicle
Inventor: FUJIWARA YOSHIHIKO
IPC: E05B77/40
Filed: 1990-10-22
Abstract: PURPOSE:To make small an expensive metal latch without damaging the strength thereof, to reduce a cost and to make lightweight by forming an interlocking side among interlocking grooves of a latch body of the metal latch, and forming the end side of a synthetic resin latch only. CONSTITUTION:An interlocking side 9 to require strength among U-shaped interlocking grooves 4 is formed of a metal latch 7 of chrome molybdenum steel, and the end side 10 to simply rotate the latch body 1 only is formed of a synthetic resin latch 8 of polyester elastomer. The entirety of the interlocking side 9 and a shaft-hole 2 are formed of the metal latch 7, and the end side 10 of the remainder of approximate 1/3, the front end 13 thereof and the periphery of the metal latch 7 are formed of the resin latch 8. According to the constitution, unpleasant sounds in the case a door is closed are reduced and, at the same time, costs can be reduced.
Patent JP-H07231846-A (JP)
Title: Package for preservation and microwave heating of food and composite material for matching impedance and for shielding microwave energy
Inventor: CHIYAARUZU SHII HABEGAA JIYUNI
IPC: A23L5/10
Filed: 1994-10-25
Abstract: PURPOSE: To uniformly increase food temperature without directly losing microwave energy in microwave oven heating. CONSTITUTION: A food package 10 for food preservation and microwave heating has a top panel 16 forming a food receiving cavity 14, side panels 18 and a bottom panel 20. An impedance matching member 22 is provided on at least one panel to impedance match the microwave energy entering the package. The impedance matching member 22 is preferably a continuous film of thin flake material embedded in an inductive binder whose size and shape are decided according to food. The flake material has an aspect ratio of at least 1,000, and the impedance matching member 22 provided by this has an effective dielectric constant of at least 4,000.
Patent JP-2000109791-A (JP)
Title: Production of sealing component using rtv-1 silicone sealant and curable rtv-1 organopolysiloxane sealant composition
Inventor: DAVIS TIMOTHY D
IPC: C09K3/10
Filed: 1999-10-05
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a seal component using an RTV-1 silicone sealant and to obtain a curable RTV-1 organopolysiloxane. SOLUTION: In this method for producing a seal component using an RTV-1 silicone sealant, a sealant produced by curing a sealant composition obtained from components comprising (A) about 10-about 90% of an organopolysiloxane component mostly composed of one or more silanol functional organopolysiloxanes, (B) an amino functional crosslinking agent in an amount effective for curing the sealant composition in the presence of water, (C) about 5-about 50% of iron oxide and (D) about 2-about 50% of magnesium oxide and resistant to an aggressive functional liquid is selected as the sealant. The sealant has excellent heat stability of the silicone sealant and yet resistance to aggressive liquid.
Patent JP-S63137955-A (JP)
Title: Polyamide resin for molding
Inventor: NOMURA ISAO
IPC: C08L77/06
Filed: 1986-12-01
Abstract: PURPOSE:To obtain a molding composition having short molding cycle time in injection molding and excellent mechanical strength, etc., by compounding a poly-m-xylylene sebacamide resin with other crystalline polyamide resin having higher melting point than that of the sebacamide resin. CONSTITUTION:The objective molding resin can be produced by compounding (A) 100pts.wt. of a poly-m-xylylene sebacamide synthesized from m- xylylenediamine and sebacic acid with (B) 1-20pts.wt., preferably 1-10pts.wt. of other crystalline polyamide resin having a melting point higher than the melting point of the component A (193 deg.C) by 5-50 deg.C, preferably nylon 612 (m.p.=215 deg.C) or nylon 610 (m.p.=220 deg.C) and, if necessary, (C) additives such as antioxidant, plasticizer, flame-retardant, etc.
Patent JP-H03144284-A (JP)
Title: Assembling device for grain drying machine
Inventor: UEJI HITOSHI
IPC: F26B17/14
Filed: 1989-10-30
Abstract: PURPOSE:To permit the safe and easy piling and assembling of box frames by a method wherein the hanging devices of respective box flames are lifted by employing a lift provided detachably at the upper part of the hanging device. CONSTITUTION:An assembling worker lifts a box frame 3 to the upper side of the box frame 2 of a drying box frame 1, divided into up-and-down plurality of stages, and assembles them by lifting and piling and, thereafter, a grain elevating machine 7, equipped with a hanging device 6, is attached to these box frames 2, 3. A box frame 4 is set to the hanging device 6 under the condition of hanging and the box frame 4 is hung by the hanging device 6 to pile it on the upper side of the box frame 3 to assemble them and, thereafter, the piling and assembling of the next box frame is effected in the same manner to assemble a grain drying machine. According to this method, the assembling of the grain drying machine may be facilitated and, at the same time, the assembling work becomes not dangerous. On the other hand, when the title device is constituted by attaching the hanging device 6 to the grain elevating machine 7, which is an already existing part, the composite parts become inexpensive.
Patent JP-H05121474-A (JP)
Title: Method of sealing semiconductor chip
Inventor: YOSHIMOTO YUZO
IPC: H01L21/56
Filed: 1991-10-30
Abstract: PURPOSE:To prevent that mutually adjacent bonding wires come into contact with each other in a resin-molding process by a method wherein bridges are between a plurality of bonding wires by using an insulating resin and, after that, a semiconductor chip is sealed with a resin. CONSTITUTION:Many bonding pads 12 arranged on a semiconductor chip 10 are connected, by using respective bonding wires 16, to many lead frames arranged so as to be adjacent to the semiconductor chip 10. Then, bridges 20b which are formed between a plurality of bonding wires 16 are formed of an insulating resin; after that, the semiconductor chip 10 is sealed with a resin. For example, parts near peaks of connected bonding wires 16 are dipped in a polyimide liquid 20 a whose viscosity has been adjusted in advance; after that, the bonding wires 16 are pulled up from the liquid 20a; bridges 20b are formed. After that, a resin is poured into a mold, and the whole of a semiconductor chip 10 is resin-molded.
Patent JP-H02129538-A (JP)
Title: Steam dryness meter
Inventor: WATANABE KENICHI
IPC: G01N25/60
Filed: 1988-11-09
Abstract: PURPOSE:To measure the dryness of low-pressure wet steam and steam of low dryness by providing a reducing valve, heat receiving or radiating means and temp. sensor. CONSTITUTION:The pressure of the steam to be measured in a steam main pipe 1 is read by a pressure gage 8 and the temp. of the superheated steam after adiabatic expansion through the reducing valve 3 is read by a temp. sensor 6. The dryness is approximately determined from these read values and Mollier diagrams. The dryness is easily measured as well by supplying or consuming the quantity of heat by the heat receiving or radiating means 4 even in the case of the wet steam which cannot be superheated and evaporated in spite of the pressure drop by the reducing valve 3 and a vacuum pump 7.
Patent JP-H11109651-A (JP)
Title: Method for hardening resist film
Inventor: ONO JIRO
IPC: C23F1/00
Filed: 1997-09-30
Abstract: PROBLEM TO BE SOLVED: To prevent uneven hardening of a resist film contg. casein and a dichromate and to keep fine holes formed in large numbers in the surface of the film uniform in diameter by specifying the concn. of chromic anhydride in a hardening soln. for hardening the resist film. SOLUTION: A hardening soln. contg. 0.2-0.4% chromic anhydride is fed to a metallic sheet with a resist film contg. casein and a dichromate and having a prescribed pattern formed on the principal surface to harden the resist film. When the resist film contains PVA and a dichromate, the concn. of chromic anhydride in the hardening soln. is regulated to 0.8 to <1.0%. Whether the pattern is a high definition pattern or not, a high quality resist film is obtd. The amt. of the dichromate used is reduced and load on the environment is reduced.
Patent JP-H10135068-A (JP)
Title: Manufacture of laminated ceramic electronic part
Inventor: IKEDA MASAO
IPC: H01G4/30
Filed: 1996-10-28
Abstract: PROBLEM TO BE SOLVED: To restrain misregistration of an inside circuit element and decrease height differences of bumps which are easily generated, especially when a hydrostatic press is used. SOLUTION: A motor block is put on an expand film 14 and is cut before being pressed for obtaining a plurality of cut blocks 15. Then, the expand film 14 is expanded in a surface direction, and a clearance 17 is formed between the cut blocks 15. It is charged with filler, formed by mixing powder and liquid and liquid is vaporized to become set filler. Thereafter, the cut block 15 is pressed together with filler. Then, filler is removed and the cut block 15 which becomes a green chip is unloaded.
Patent JP-H02128835-A (JP)
Title: Manufacture of foamed sheet
Inventor: KAWAKAMI HAJIME
IPC: B32B3/26
Filed: 1988-11-09
Abstract: PURPOSE:To obtain a beautiful gas filled foamed sheet having a smooth surface free from wrinkles by stretching a backing film to hold welding temp. and welding the stretched film to a cap film in a welding stage to form the foamed sheet and further heating said foamed sheet in a thermal shrinkage stage. CONSTITUTION:If necessary, one of or both of a supplied cap film 1 and a supplied backing film 2 are stretched and oriented on this side of a thermal shrinkage stage 73. In a stretching and orientation means, the peripheral speed of a heating roll 84 is made faster than that of a cooling roll 83 and the backing film 2 is stretched and oriented in a cooling/reheating process. A plurality of the cooling rolls 83 and the heating rolls 84 may be used. The stretched cap film 1 having protruding parts imparted thereto and the stretched backing film 2 are welded in a welding stage consisting of a molding roll 85 and a pressure roller 86 to form a foamed sheet 6. Further, the cap film 1 and/or the backing film 2 are shrunk in a thermal shrinkage stage 73 having a heater 91 built therein to obtain an air filled foamed sheet 6a.
Patent JP-H01127821-A (JP)
Title: Hot and cold water mixing device
Inventor: TSUTSUI OSAMU
IPC: F24D17/00
Filed: 1987-11-10
Abstract: PURPOSE:To make it possible to adjust the opening of a hot and cold water mixing valve accurately for the very slow drop in the hot water temperature by providing a valve control judgement device which outputs an instruction to make the hot and cold water mixing valve drive speed low when the supply hot water is stopped. CONSTITUTION:When the instruction to stop hot water supply is inputted by the operation of an operating device 5, a valve control judgement device 9 makes the drive speed of a hot and cold water mixing valve 1 slow through a valve speed calculator 12 and valve drive device 13 and closes a flow regulating valve 3 by means of a flow regulating valve drive device 14 and at the same time continues the temperature control as it is at the low speed so as to bring the temperature at which the hot water is formed by the hot and cold water mixing valve 1 to a temperature set by a temperature setting device 8. After this the temperature data TM of a temperature memory 10 and the temperature T detected from a temperature sensor 4 are respectively read and whether or not the condition T<=TM is satisfied is judged. If the temperature T is in this range, it is judged whether or not the hot water supply was restarted, and when the supply of hot water is restarted, the flew regulating valve is opened and the temperature control is returned to the normal routine of temperature control.
Patent JP-H05246496-A (JP)
Title: Automatic liquid selecting apparatus
Inventor: OBARA MASATO
IPC: G01G17/06
Filed: 1991-10-30
Abstract: PURPOSE:To provide an automatic liquid blending apparatus, wherein costs are reduced, maintenance check can be easily done, and accuracy of weight can be obtained, by simplifying the mechanism of an apparatus. CONSTITUTION:An automatic liquid blending apparatus is composed of a plurality of nozzle devices 10 for extracting a great amount of liquid, which is radially arranged, and wherein extracting valves are provided on each tip, a nozzle selecting-pulling device 20 for pulling the nozzle arranged at the center of radial nozzle and selected into the center of the extracting position, a valve opening device 30 for opening the extracting valve of the nozzle pulled in at a set opening, a weighting apparatus 70 for injecting liquid extracted from the nozzle into a container 50 after weighting.
Patent JP-H04159694-A (JP)
Title: Nonvolatile semiconductor memory
Inventor: TERADA YASUSHI
IPC: H01L27/10
Filed: 1990-10-22
Abstract: PURPOSE:To read at a high speed without adverse influence on an erasing operation having a verifying function by detecting the potential of a dummy transistor by a differential amplifier in a normal reading operation, and detecting a reading operation in a verifying operation at the time of erasing by a current sense type sense amplifier. CONSTITUTION:A normal reading operation is performed by applying voltage outputs of current/voltage converters 51, 52 to a differential amplifier 53, and applying the output of the amplifier 53 to an input/output buffer 10. In this case, even if a potential difference of the voltage outputs of the converters 51, 52 is about 100mV, it is immediately amplified to 'H', 'L' level. On the other hand, the amplifier 53 is nonactivated by a verifying operation at the time of erasing, and the output of the converter 51 is applied to an erasure controller 7 through an amplifier 54. Thus, the normal reading operation is accelerated, and the verifying operation at the time of erasing is accurately conducted.
Patent JP-H03145731-A (JP)
Title: Manufacture of semiconductor integrated circuit
Inventor: UMEMOTO TOSHIAKI
IPC: H01L23/52
Filed: 1989-10-31
Abstract: PURPOSE:To improve the step coverage without inducing a shortcircuit etc., in a metallic wiring layer by a method wherein a silicon nitride film and a silicone oxide film on the surface of an insulating film are selectively removed to make contact holes down to lower wiring layers; next, tungsten layers are formed on the whole surface; and after removing the tungsten layers in the other regions leaving the tungsten layers inside the contact holes, the silicon oxide film on the surface is removed. CONSTITUTION:A silicon nitride film 6 is formed on the surface of an insulating film 5 and then a silicon oxide film 7 is formed on the surface of the film 6. Next, the insulating film 5, the silicon nitride film 6 and the silicon oxide film 7 are selectively removed to make contact holes 8 down to the lower wiring layers of a diffused layer 2 and a polycrystal silicon layer 4. Next, a tungsten silicide layer 13 is formed on the whole surface and then a CVD tungsten layer 9 is further formed on the layer 13. Next, the CVD tungsten layer 9 in the other regions is removed leaving the tungsten layers 10 comprising the tungsten silicide layer 13 and the CVD tungsten layer 9 inside the contact holes 8. Finally, the silicon oxide film 7 is removed.
Patent JP-H03294149-A (JP)
Title: Tool abnormality detecting device
Inventor: TAKAGI SHIGEYOSHI
IPC: B23Q17/09
Filed: 1990-10-22
Abstract: PURPOSE:To precisely detect the abnormality of a tool by comparing a threshold with the output value of a working load detecting means within a set detection time by use of the detection data to a working tool pulled out from a memory means to judge the abnormality of the tool. CONSTITUTION:When a tool exchange or a work change is conducted, the tool number of the toll or the work number is outputted from a NC device 10 to a CPU 3, and the CPU 3 designates the tool number or work number to the stroke number data file 6 of a memory means 4 to select the corresponding stroke number, and designates the stroke number to a detecting information data file 7 to read out the corresponding detecting data, which is then stored in a memory part 8. In each stage, the CPU 3 executes the comparison of the working power with a threshold set by the time data until T2 hour passes after the lapse of T1 hour from the point of time when the working power detected by a working load detecting means 2 is inputted.
Patent JP-H05124051-A (JP)
Title: Formation of molding method for interior part
Inventor: TSUCHIYA KOICHI
IPC: B29K105/12
Filed: 1991-10-31
Abstract: PURPOSE:To reduce the manufacturing cost of an interior component by cementing through pressing without interposing a bonding agent. CONSTITUTION:A sheet material composed of thermoplastic resin containing fiber is heat softened and expanded to manufacture an expanded sheet material 2, and the expanded sheet material 2 and a skin material 3 provided with a foamed layer 3b on its rear face are overlapped and pressed by means of a molding tool 4 to manufacture an interior component composed of a base 5 with a skin 6 cemented on the surface of the base.
Patent JP-H03151363-A (JP)
Title: Butenone compound and its preparation and use as agricultural chemicals
Inventor: ANTONIO MEETE
IPC: C07D277/20
Filed: 1990-10-25
Abstract: NEW MATERIAL: A butenone compound of formula I (R 1  is pyridyl or thiazolyl, substd. independently by one or more substituents selected from halogen, alkyl, alkoxy, alkylthio, haloalkyl, cyano, alkoxycarbonyl, alkylamino and dialkylamino; R 2  is H, alkyl or alkylcarbonyl; R 3  is alkyl; R 4  is haloalky; X is S or N-R 5 ; R 5  is H, alkyl or alkylcarbonyl; n is 0 or 1).  
     EXAMPLE: 1-Dimethylamino1-methylthio-4,4,4trifluoro-1buten-3-one.  
     USE: Useful as agrochemicals, especially pesticides.  
     PROCESS: A compound of formula II is reacted with a compound of formula III (R 6  is alkyl; R 7  is alkyl) to give a compound of formula I when R 3  is R 7 . 
     COPYRIGHT: (C)1991,JPO
Patent JP-H11191629-A (JP)
Title: Semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L21/336
Filed: 1998-10-08
Abstract: PROBLEM TO BE SOLVED: To provide a technique for obtaining a crystalline silicon film which has high crystallinity on a substrate having an insulated surface. SOLUTION: A semiconductor device is constituted into a structure such that a semiconductor layer consisting of a silicon film is provided on the insulated surface of a substrate, this semiconductor layer comprises a pattern, which substantially has no crystal grain-boundary and substantially is constituted of a single-crystal grain, and S-value of the layer has a valve of 0.12 V/Dec or less. Moreover, a semiconductor device is constituted into such a structure that a semiconductor layer consisting of a silicon film is provided on the insulated surface of a substrate, this semiconductor layer comprises a pattern, which substantially has no crystal grain-boundary and substantially is constituted of a single-crystal grain, and nickel elements are not distributed with bias in this semiconductor layer.  It is desirable that the semiconductor devices be a thin-film transistor, even in the case of either of the devices.
Patent JP-H09100507-A (JP)
Title: Asphalt pavement road and construction method thereof
Inventor: KONO JUNICHI
IPC: E01C11/26
Filed: 1995-10-09
Abstract: PROBLEM TO BE SOLVED: To prevent softened deformation of pipe during construction time and facilitate bending work by providing a specific coating layer on a road heating pipe. SOLUTION: Leveling asphalt is placed on a grading ground 7, thereby developing a base 8. A fixing metal net 9 is placed thereon. A desired area of a road heating pipe A (B) is bent so as to form a zigzag pipe where the pipe is fixed with the fixing metal net 9 and heating asphalt is placed, thereby developing an asphalt surface layer 10 where the pipe A (B) is buried. The pipe A (B) forms a heat resistant coating layer formed on the outer peripheral surface of a knitted or finely knitted crosslinking polyethylene pipe. Therefore, this coating layer prevents soften deformation attributable to the heating asphalt during construction time and relives restrictions against bending and does not obstruct heat transfer effect to an extreme extent.
Patent JP-H02136590-A (JP)
Title: Screw pump
Inventor: KUIOKA KIYOSHI
IPC: E02F3/88
Filed: 1988-11-15
Abstract: PURPOSE:To suppress the generation of the closing trouble by increasing the discharge pressure of transported substance by gradually increasing the diameter of a screw towards the downstream side between a take-in port and a discharge port which are formed at the both edges of a screw pump. CONSTITUTION:The title screw pump 1 is constituted of a screw conveyor 2 having a take-in port 6 at the lower edge, pump 3 in the discharge part connected with the screw conveyor 2, and a hydraulic motor 4 as driving part. The screw conveyor 2 is constituted of a screw 8 which is installed onto a screw shaft 7 integrally formed with the shaft 3b of the blade 3a in the pump part 3 and whose diameter is gradually increased towards the discharge side from the take-in port 6, casing 5 for accommodating the screw 8, and a bearing 9 for bearing supporting the screw shaft 7 at the lower edge. Further, the pump part 3 has a blade 3a whose inner diameter is increased towards the discharge side, casing 3c having an annular part expanded on the downstream side, and a discharge port 15.