baber/WOPTO huggingface dataset:
Patent JP-2004171280-A (JP)
Title: Control system and its program
Inventor: URAKAWA KENJI
IPC: G06F3/048
Filed: 2002-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a control system compatible with an improvement in safety and an improvement in operability.  <P>SOLUTION: When a unit image screen of a project file includes a display area of storage date, a disclosing file generating part 33 generates a disclosing file for displaying an area for accepting display indication of the storage data in a display area of the storage data. A client device 6 operates by referring to the disclosing file, and starts the storage data display application being the application separate from a browser 63 and a virtual machine 62 when accepting the display indication. The client device 6 controls so that an initial image screen when starting the storage data display application becomes an image screen for displaying the storage data of a kind displayed on the display area of the storage data of a programmable display 64 by a display method displayed in the display area.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004167435-A (JP)
Title: Ultrasonic horn for bonding and bonding device provided with the same
Inventor: NAKAJIMA NORIHIKO
IPC: B06B1/08
Filed: 2002-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultrasonic horn for bonding capable of attachment to a bonding head without restraining vibrations generated in a support for the horn, controlling variation in the impedance of the horn and ensuring good bonding.  <P>SOLUTION: The horn has a vibrator 4 generating ultrasonic vibrations, a vibration transmitting member 2 transmitting the vibrations of the vibrator 4 to a bonding tool and the support member 3 arranged at a node position of the transmitting member 2. The support member 3 consists of a free end portion 3a disposed vertically in the vibrating direction of the transmitting member 3, a connecting portion 3C integrated with the free end portion 3a and disposed horizontally in the vibrating direction of the transmitting member 2, a fixed end portion 3b disposed at the tip of the connecting member 3c and a fixed portion 3d integrated with the fixed end portion 3b.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003199129-A (JP)
Title: Line interface for combining voice band signal and xdsl signal on twisted-pair copper line
Inventor: LARI FERDINANDO
IPC: H04Q3/42
Filed: 2002-11-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a line interface (30) operated at a low feed voltage that couples a broadband XDSL signal and a voice band telephone signal on a twisted-pair copper line.  <P>SOLUTION: In the line interface (30) where the voice-band signal carries a DC feed for a user telephone and also a voice signal, a ring signal, the XDSL signal, and the voice signal are coupled to at least one primary winding of a line transformer, and at least a secondary winding (40) pilots a twisted-pair telephone line (41), the secondary winding (40) is DC-coupled with the line (41) and the ring and feed signals are injected into the telephone line (41) by a circuit (43) arranged in parallel with the secondary winding (40).  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004175487-A (JP)
Title: Card reversing conveying mechanism
Inventor: YOKOZAWA MITSUO
IPC: B65H5/06
Filed: 2002-11-26
Abstract: <P>PROBLEM TO BE SOLVED: To take out a card not only in the card conveying direction but also in the direction vertical to the card conveying direction.  <P>SOLUTION: This card reversing conveying mechanism is constituted to reverse the card conveyed on a conveying passage. This mechanism comprises a rotatable drive transmitting shaft 9 journaled by a base frame 1, a rotating body 6 mounted coaxially with the drive transmitting shaft 9 and rotatable independently from the drive transmitting shaft 9, a reversing member 7 fixed to the rotating body 6 and supported in a cantilevered state, a conveying roller 23 driven by the drive transmitting shaft 9 and rotated on the reversing member 7, a conveying driving source for rotating the conveying roller 23 through the drive transmitting shaft 9, and a reversing driving source for rotating the reversing member 7 through the rotating body 6. The reversing member 7 holds the card 30 which is left open at its non-supporting side, in a state that the card can be taken out to the opened side. Further the conveying roller 23 conveys the card 30 in the direction vertical to the drive transmitting shaft 9 while pressing the card to the opened side with the force to allow the card to be taken.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004177087-A (JP)
Title: Spherical ice making vessel
Inventor: WATANABE AKIHIKO
IPC: F25C1/24
Filed: 2002-11-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a spherical ice making vessel permitting easily and quickly taking out a spherical ice after completion.  <P>SOLUTION: In this spherical ice making vessel, the lower surface of an outer collar circumferential piece is abutted against the upper end face of an outer cup, and an air layer surrounding the side face and bottom of an inner cup is formed with the inner cup stored inside the outer cup. In the spherical ice making vessel, a first ice making chamber is formed inside a spherical shell, and the spherical shell is stored inside the upper part of the inner cup body with the lower surface of a lower flange is abutted against the upper end face of a sheath cylinder. In the spherical ice making vessel, a second ice making chamber is formed by the inner cup and a lower semi-spherical shell, and the corner part of an upper flange is a pull-out knob piece with the corner part of the upper flange shifted in position from the corner part of the lower flange.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004184673-A (JP)
Title: Method for manufacturing functional film with pressure sensitive adhesive
Inventor: MIWA NORIHIRO
IPC: G02B5/30
Filed: 2002-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture a functional film with a pressure sensitive adhesive which is layered over the whole functional film.  <P>SOLUTION: The functional film with the pressure sensitive adhesive is manufactured through the following steps. A 1st step film 11 of width a is overlayed with a functional film 20 of width b (a > b). A pressure sensitive adhesive layer 31 of width d is formed on a 2nd step film 12 of width c (c ≥ d, a ≥ d > b). The surface of the pressure sensitive adhesive layer 31 is subjecte to surface-active treatment. The functional film 20 laminated on the 1st step film 11 and the pressure sensitive adhesive layer 31 subjected to surface-active treatment on the 2nd step film 12 are stuck together, and at that time they are pressed so that the exposed surface of the pressure sensitive adhesive layer 31 comes in contact with the 1st step film 11. Next, the 1st step film 11 is removed from the functional film 20.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004181362-A (JP)
Title: Septic tank and sewage treatment method
Inventor: TAKAHASHI KEI
IPC: C02F3/30
Filed: 2002-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a septic tank construction technology which can prevent a trouble, such as an increase in a treatment load due to inflow of precipitated sludge staying on the bottom of the septic tank to an anaerobic treatment tank, as much as possible.  <P>SOLUTION: The septic tank 101 has a foreign matter removing tank 121 and the anaerobic treatment tank 123 disposed on the downstream side of the foreign matter removing tank 121. The septic tank 101 has a means for controlling the feed of the precipitated sludge A, B staying in at least one of the lower parts of the foreign matter removing tank 121 and the anaerobic treatment tank 123 to the anaerobic treatment tank 123 together with water to be treated 103 transferred from the foreign matter removing tank 121 to the anaerobic treatment tank 123.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004186016-A (JP)
Title: Glass bulb and lighting device
Inventor: SAITO HIROYUKI
IPC: F21Y101/00
Filed: 2002-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a glass bulb in which there is no possibility that a crack or the like is formed at the end part of a glass ball of the glass bulb by inserting a leading-in wire between the base and the end part of the glass ball.  <P>SOLUTION: When the glass bulb L is connected and fixed to the base 10 provided with a base shell 1 at the end part of glass 60, the end part of the glass 60 is contacted with the base shell 1 at least at one position, and its objective is to make a gap of 0.5 mm or more from the base shell 1 to become 30-50% of the whole circumference. By doing that way, because an appropriate gap is provided between the end part of the glass bulb and the base 10, when mounting the leading-in wire 4a and the base shell 1, the possibility is reduced that the crack or the like is formed at the end part of the glass bulb 60 by pressure of the lead-in wire 4a.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004186494-A (JP)
Title: Manufacturing method of laminated semiconductor device
Inventor: IGUCHI TOMOHIRO
IPC: H01L25/10
Filed: 2002-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated semiconductor device with higher precision by suppressing displacement amount between connection lands, among substrates, when a semiconductor package is laminated.  <P>SOLUTION: A plurality of wiring boards 2 provided with a semiconductor element region Ga mounted with a semiconductor chip 10 and an interlayer connection region Gb where a connection land 4 and a through hole 7 are formed, and a plurality of intermediate substrates 13 provided with a bump 8 for aligning with an open part S in which the semiconductor chip can be inserted, are prepared between a base board 14 and a ceiling board 15. In a first process, an adhesive layer is formed on the surface of the intermediate substrate. In a second process, the alignment bump of the intermediate substrate is aligned with the through hole of the wiring board while displacing to the base board, for mutual lamination, and the ceiling board is aligned with the top part for lamination. In a third process, the laminate is thermally press-bonded to thermally cure the adhesive of the adhesive layer, forming a laminated semiconductor device.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004190429-A (JP)
Title: Water depth adjuster and water depth adjusting device of swimming pool
Inventor: SHIMIZU HIROSUKE
IPC: E04H4/06
Filed: 2002-12-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a water depth adjuster and a water depth adjusting method of a swimming pool for easily adjusting the depth of water, and requiring no lifting device.  <P>SOLUTION: This water depth adjuster has a water depth adjusting bag body formed of a watertight-flexible film material, a water filling port and a drain port arranged in the bag body and a positioning means for preventing floating from a bottom surface by positioning the bag body on the bottom surface of a pool, a river, a lake and marsh, and a pond, and is characterized in that the bag body is inflated by inject water from the water filling port in use, and the bag body is positioned on the bottom surface by the positioning means, and is constituted so as to drain water in the bag body from the drain port in nonuse.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004193521-A (JP)
Title: Film carrier tape for mounting electronic component, its manufacturing method, and plating device
Inventor: FUJIMOTO AKIRA
IPC: H01L21/48
Filed: 2002-12-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component which has a tin/bismuth alloy layer formed on its terminal and wherein bismuth is homogeneously contained in the alloy layer.  <P>SOLUTION: In the film carrier tape for mounting the electronic component, the tin/bismuth alloy plated layer has a substantially uniform bismuth content in its thickness direction. The layer can be manufactured by plating at least part of a wiring pattern with the tin/bismuth alloy and then cleaning the plated alloy layer within 6 seconds with water ejected from a water cleaning nozzle. A plating device used herein has such a nozzle that can water-clean a film carrier taken out from a plating bath within 6 seconds. Using the equipment, metal tin in the surface of the tin/bismuth alloy plated layer is replaced by bismuth contained in a plating solution. Consequently, the alloy plated layer can be stably bonded without fluctuating the metal composition of the surface of the alloy plated layer.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003229563-A (JP)
Title: Solid-state image sensor array for correcting curve distortion of camera lens system
Inventor: GORDON GARY B
IPC: H04N5/357
Filed: 2002-12-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solid-state image sensor array for correcting curve distortion of a camera lens system which increase efficiency and is suitable for mass-production, and to provide an effective manufacturing method of the image sensor array.  <P>SOLUTION: The solid-state image sensor array for correcting curve distortion and the manufacturing method of the image sensor array use straight line segments (606, 608) which approximate curvature of curve distortion which defines a structure of the image sensor array. By using the straight line segments, photoelectric elements distributed in an ununiformed pattern can be obtained wherein curve distortion such as barrel type distortion and spool type distortion is compensated. Further, efficiency of the photoelectric elements is increased by maximizing surface areas of the photoelectric elements by using the straight line segments. Since the structure of the image sensor array is defined by the straight line segments, design of the image sensor array becomes suitable for the conventional mass-production process.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004197388-A (JP)
Title: Flat slab structure
Inventor: OKI KOJI
IPC: E04B5/43
Filed: 2002-12-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a flat slab for easily jointing a steel pipe column to a floor (slab).  <P>SOLUTION: A steel beam laid between the adjacent steel pipe columns is arranged in a concrete slab so as to be embedded in floor concrete, and the steel beam is bolt-connected to a diaphragm of the steel pipe column and a bracket having a shear plate. The diaphragm is provided with an upper diaphragm and a lower diaphragm corresponding to upper and lower flanges of the steel beam if necessary, and the area of the lower diaphragm is made larger than that of the upper diaphragm. Upper end reinforcements and lower end reinforcements are not connected to the steel pipe column, but the upper end reinforcements are arranged above the steel beam while the lower end reinforcements are arranged in the concrete slab. The lower end reinforcements orthogonal to the beam are inserted through reinforcement insertion holes formed in the web of the steel beam, and the upper end reinforcements orthogonal to the beam are arranged above the steel beam.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004200371-A (JP)
Title: Electrical connection structure of power module
Inventor: TAKENAKA KUNIHIRO
IPC: H01L23/48
Filed: 2002-12-18
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an electrical connection structure of a power module which can certainly attain both electrical connection and fixed holding and ensures less assembling steps and high reliability.  <P>SOLUTION: The electrical connection structure is intended to electrically connect the power module 3 including a plurality of terminals 4 and the substrate 2 to control such power module with a contact 1. For this purpose, the contact includes a projected conductive contact surface 6 and is also provided with a contact 1a having a plurality of point contacts and a fixing portion 1b for fixing the substrate. Moreover, the fixing portion may be formed as a projected portion projected from a resin frame which is integrally provided around the circumference of the contact or may be formed as a projected portion projected from the power module. In addition, the contact is provided with a holding portion extended from the contact surface thereof to provide the spring property. This holding portion is engaged with a recessed portion of the power module.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004196984-A (JP)
Title: Polyurethane compound and photosensitive resin compound containing the same
Inventor: TANAKA RYUTARO
IPC: G03F7/027
Filed: 2002-12-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a polyurethane compound soluble in an alkali water solution, excellent in photosensitivity to active energy, capable of forming a pattern by development by a diluted alkali aqueous solution and having sufficient flexibility of a cured film obtained by thermally curing it in a post cure step, having high insulating property and excellent in adhesion, resistance to gold plating, resistance to electroless gold plating, resistance to tin plating and suitable for solder resist ink, and a resin composition containing the polyurethane compound.  <P>SOLUTION: The polyurethane compound (F) which is soluble in an aqueous solution of alkali is obtained by reacting (A) an epoxycarboxylate compound obtained by reacting an epoxy compound (a) having two epoxy groups in the molecule with a monocarboxylic acid compound (b) having an ethylenic unsaturated group in the molecule with (B) a diisocyanate compound, (C) a carboxylic acid compound having two hydroxy groups in the molecule, (D) an epoxy compound having an ethylenically unsaturated group in the molecule and (E) a diol compound other than the compound (A) and the compound (C) as an arbitrary component.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004205731-A (JP)
Title: Photosensitive transfer material and method for manufacturing color filter
Inventor: ITO HIDEAKI
IPC: G03F7/004
Filed: 2002-12-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a photosensitive transfer material having a low surface potential of a peeled surface when the peeling interface exists between a thermoplastic resin layer and an intermediate layer, and to provide a method for manufacturing a color filter by using the above photosensitive transfer material.  <P>SOLUTION: The photosensitive transfer material comprises a thermoplastic resin layer, an alkali-soluble intermediate layer and an alkali-soluble photosensitive resin layer containing a pigment layered in this order on a temporary supporting body. When the thermoplastic resin layer is peeled off from the intermediate layer at 1 m/minute peeling speed in an atmosphere of 25°C and 30% RH, both of the surface potential of the peeled thermoplastic resin layer and the surface potential of the peeled intermediate layer are ≤5 kV in absolute values. A color filter is manufactured by using this photosensitive transfer material.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004202830-A (JP)
Title: Saw handle
Inventor: MITSUKAWA DAIZO
IPC: B27B21/04
Filed: 2002-12-25
Abstract: <P>PROBLEM TO BE SOLVED: To improve the operability of a saw in a cutting work by improving the overall weight balance including a saw handle and a saw blade in a manual saw such as a double-edged saw.  <P>SOLUTION: This saw handle has a weight 4 fitted to the rear part of a saw handle of a bar-like saw handle main body 6, to the tip part of which a saw blade 1 is fitted. The saw blade 1 is heavier than the saw handle main body, so that the center of gravity of the entire saw is located forward of the saw handle. By fitting the weight 4 to the rear part of the handle, the center of gravity of the entire saw shifts to the rear part and consequently, the weight balance of the entire saw is improved. A flat metallic sheet with a through hole 5 perforated at a part of the sheet, is used as the weight 4 and a cut-off part 7 is formed on the side, of the saw handle main body, with which the through hole 5 part coincides. In addition, the through hole 5 can be utilized as a holding hole for hanging by pushing out the through hole 5 part into the saw handle main body.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004204987-A (JP)
Title: Supporting tool for piping heat insulating material and heat insulating method of piping using the same
Inventor: NISHIKAWA ISAMU
IPC: F16L59/16
Filed: 2002-12-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a supporting tool for a piping heat insulating material and a heat insulating method of a piping using the same, capable of preventing the displacement of the heat insulating material by preventing the damage of a heat insulating material end part of a flange joint part in disassembling and maintaining pipings and equipment, completely coping with disassembling and restoring the heat insulation simultaneously with the maintenance of the pipings and equipment, and inexpensively restoring a heat insulating function.  <P>SOLUTION: This supporting tool 1 for the piping heat insulating material composed of half-divided collars 5a, 5b having leg parts 6a, 6b along the outer face of a piping is mounted on a piping P with a bolt mounting/demounting space for a piping joint part, and a heat insulating cylinder end face is closely adhered to a collar face, and extended to a piping part for heat insulation on the piping part. The heat insulating material is applied to the connection bolt mounting/demounting space on the joint side of the supporting tool 1 for the heat insulation of the flange part 31, an unshaped heat insulating material 14 is packed around the piping and equipment mounted to the joint by a flange diameter, and the heat insulating material is projected from the supporting tool in a direction opposite to the joint direction by a predetermined heat insulating length and applied to a heat insulating cylinder 15 of a large diameter to achieve the heat insulation.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004209699-A (JP)
Title: Manufacturing method for inkjet head
Inventor: NOJIRI HIDEAKI
IPC: B41J2/16
Filed: 2002-12-27
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture an inkjet head which operates well with a good reliability by joining a diaphragm which is to be displaced by an electromechanical conversion element, onto a substrate where grooves for constituting channels are formed.  <P>SOLUTION: The groove of a predetermined pattern to be the channel 12 is formed on the substrate 1 as shown in Figs. (a) to (e). The diaphragm 7 is joined onto the substrate 1 as shown in Fig. (f). The joining is executed by anodic joining in an He gas atmosphere. After the joining, the diaphragm 7 is mechanically polished as shown in Fig. (g). After the mechanical polishing, a heat treatment is carried out to the substrate 1. Finally, the electromechanical conversion element 9 is joined onto an outer face of the diaphragm 7 at a predetermined position above the channel 12 as shown in Fig. (h).  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004212633-A (JP)
Title: Presentation device
Inventor: MATSUURA YASUKI
IPC: H04N7/18
Filed: 2002-12-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a presentation device that enables a user to easily photograph a display plate without paying attention to a photographing method even when various protection devices are used.  <P>SOLUTION: The presentation device 1 used for a presentation system through which an image is projected on a writable whiteboard 100 by a projection device 2 for presentation is equipped with an output means of outputting the image to be projected on the whiteboard 100 to the projection device 2, a photography part 6 for photographing the whiteboard, an installation distance calculating means of calculating the distance between the white board 100 and photography part 6 as an installation distance, and a photography control means of deciding whether the whiteboard 100 is to be photographed as a whole or divisionally according to the installation distance calculated by the installation distance calculating means and controls the photography part 6 according to the decision result to photograph the whiteboard 100.  <P>COPYRIGHT: (C)2004,JPO&NCIPI