Patent SG-11201807741S-A (SG)
Title: Conductive structures, systems and devices including conductive structures and related methods
Inventor: TESSARIOL PAOLO
IPC: H01L21/768
Filed: 2017-03-02
Abstract: W O 20 171557 / 8 4 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/155784 Al 14 September 2017 (14.09.2017) WIPO I PCT (51) International Patent Classification: HO1L 21/768 (2006.01) (21) International Application Number: PCT/US2017/020456 (22) International Filing Date: 2 March 2017 (02.03.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/068,329 11 March 2016 (11.03.2016) US (71) Applicant: MICRON TECHNOLOGY, INC. [US/US]; 8000 South Federal Way Mailstop 525, Boise, Idaho 83707 (US). (72) Inventors: TESSARIOL, Paolo; Via Gazie 56, 31044 Montebelluna (IT). WOLSTENHOLME, Graham R.; 2945 East Rivernest Court, Boise, Idaho 83706 (US). YIP, Aaron; 254 Vista de Sierra, Los Gatos, California 95030 (US). (74) Agents: BAKER, Gregory C. et al.; 230 South 500 East, Suite 300, Salt Lake City, Utah 84102 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.1700) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: with international search report (Art. 21(3)) (54) Title: CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RE- LATED METHODS 111111111111110111011111111111010111110111011111111111111111111101111111111111110111111 FIG. 2 (57) : Conductive structures include stair step structures positioned along a length of the conductive structure and at least one landing comprising at least one via extending through the conductive structure. The at least one landing is positioned between a first stair step structure of the stair step structures and a second stair step structure of the stair step structures. Devices may include such conductive structures. Systems may include a semiconductor device and stair step structures separated by at least one landing having at least one via formed in the at least one landing. Methods of forming conductive structures include forming at least one via through a landing positioned between stair step structures.