baber/WOPTO huggingface dataset:
Patent TW-I236501-B (TW)
Title: Process for extracting soluble collagen from animal tissue and products containing soluble collagen prepared therefrom
Inventor: BAI RUNG-CHANG
IPC: C12P21/00
Filed: 2003-10-01
Granted: 2005-07-21
Abstract: This invention discloses a process for extracting soluble collagen from collagen-enriched animal tissue, in a step of which thermolysin is used to allow soluble collagen to be released from the treated animal tissue and harvested.
Patent TW-I248061-B (TW)
Title: Keyboard instrument having pedal mechanism
Inventor: PU WENJUN
IPC: G10C1/02
Filed: 2003-11-20
Granted: 2006-01-21
Abstract: A keyboard instrument (e.g., an electronic piano) has a keyboard (10) including numerous actions (50) interlocked with numerous keys (11) arranged on a keybed (101), and at least one pedal (e.g., damper pedal (27)) arranged on a base board (28) of a housing (100) thereof, wherein it is equipped with a pedal link mechanism including a pedal lever (20). A keybed reinforcing member (15) is attached to the lower surface of the keybed and is arranged to pivotally support the pedal lever thereunder, wherein a plurality of tapered spacers (17) are put into the space between the keybed and the keybed reinforcing member, which are thus integrally fixed together using screws (18). One end of the pedal lever is interconnected with the pedal via a hanging bolt (21), and the other end is interconnected with a vertical link (22) interlocked with at least one action.
Patent TW-I242968-B (TW)
Title: System for establishing and regulating connectivity from a user's computer
Inventor: MASTRIANNI STEVEN J
IPC: H04L29/06
Filed: 2003-12-02
Granted: 2005-11-01
Abstract: The system disclosed uses policy directives to establish and regulate connectivity on a computer system. A policy profile is applied to the computer system that determines how and when connections can be made, and the devices on which the connections can be made.
Patent TW-I259033-B (TW)
Title: A multiple light tubes driving device
Inventor: CHEN JEN-GANG
IPC: H05B41/14
Filed: 2003-12-02
Granted: 2006-07-21
Abstract: A multiple light tubes driving device includes a transformer, a driving circuit, and at least a balance inductor. The transformer has a magnetic core consisting of a first side pole, a second side pole, and at least a central pole with primary and secondary windings surrounding around the first and second side poles. The light tube is driven to emit light by drive circuits supplying magnetization excitement power to the transformer and the energy transforming effect of the transformer. The central pole, serve to guide opposite magnetic flux induced by a load current when the transformer is driving multiple light tubes and power transformation performed by the transformer will not be affected by the opposite magnetic flux whereby high temperature caused by excessive load current of the transformer can be reduced and shorting protection of the transformer is realized.
Patent TW-I227659-B (TW)
Title: Manufacturing method for heat sink
Inventor: HSU YU-CHANG
IPC: H05K7/20
Filed: 2003-12-26
Granted: 2005-02-01
Abstract: The present invention relates to a manufacturing method for heat sink. The method includes following steps. Copper posts and aluminum posts are fixed on the processing machines respectively. The corresponding ends of the copper post and aluminum post are connected with each other and then being rotated. By the high temperature raised from rotation, the copper posts and aluminum posts are integrated with each other. Finally, the integrated copper and aluminum posts are cut by cutting tools to form heat sinks. The heat sink includes an aluminum rectangular body and a copper base on the bottom thereof. The copper and aluminum material are integrated by means of friction welding so that there is no substance between the body and the base of the heat sink. Therefore, the heat dissipation efficiency of the heat sink is improved significantly.
Patent TW-I244001-B (TW)
Title: An arbiter and the method thereof
Inventor: CHOU CHENG-YA
IPC: G06F13/38
Filed: 2004-01-09
Granted: 2005-11-21
Abstract: The present invention is related to an arbiter that can arbitrate the data traffic on the bus. The arbiter includes a forward and a reverse arbitration devices. The forward arbitration device includes a second layer arbitration mode, in which the bus requests from minor master devices will be arbitrated and a candidate minor master device will be chosen, and a first layer arbitration mode, in which the bus requests from the candidate minor master device and the major master devices will be arbitrated and a granted master device will be chosen to send data to the slave devices via the bus. The reverse arbitration device arbitrates the bus requests from major slave devices and chooses a granted slave device to send back the data to the major master device via the bus.
Patent TW-I230886-B (TW)
Title: System and method of monitoring, predicting and optimizing production yields in a liquid crystal display (LCD) manufacturing process
Inventor: CHUNG KYO YOUNG
IPC: G06F19/00
Filed: 2004-01-30
Granted: 2005-04-11
Abstract: A system and method of monitoring LCD production yields, predicting the effects of different testing methodologies on LCD production yields, optimizing production yields, and detecting defects in TFT-array panels is provided that compares the effect of different testing methodologies on the yields at various stages in the LCD testing and assembly process. The present invention can also be used to predict the effect of different testing methodologies on user-defined parameters, such as profit. The present invention can also detect defects in TFT-array panels with improved defect detection accuracy.
Patent TW-I242670-B (TW)
Title: Light source unit and projection display device applied with the light source unit
Inventor: OMODA MANABU
IPC: H01L33/56
Filed: 2004-02-16
Granted: 2005-11-01
Abstract: To secure uniformity in in-plane luminance of light emitted from a semiconductor light emitting device array. A light source unit 10A is provided with a semiconductor light emitting device array 13 wherein a plurality of semiconductor light emitting devices 13R, 13G, 13B are arrayed on a substrate 12 in a two-dimensional manner, a condenser lens 14 for condensing light emitted from the semiconductor light emitting device array 13, and a light guide 11 in which mirror surfaces 11am, 11bm, 11cm are formed along with an inner wall surface from a light incidence port to a light emission port, the semiconductor light emitting device array 13 and the condenser lens 14 are disposed in order toward the light emission port internally on the side of the light incidence port, for emitting the light condensed by the condenser lens 14 from the light emission port while narrowing down a part of the inner wall surface approximately along with a condensing angle theta1 of the condenser lens 14.
Patent TW-I259375-B (TW)
Title: Method and related apparatus for controlling a peripheral device to transfer data to a bus
Inventor: LAI JIIN
IPC: G06F3/00
Filed: 2004-03-25
Granted: 2006-08-01
Abstract: A method and related apparatus used for controlling a peripheral device to transfer data to a bus. The peripheral device has a bus interface circuit and a controller unit. Store data outputted from the controller unit into a first storage block of the bus interface circuit. Utilize the bus interface circuit to simultaneously control the first storage block to output its stored data to the bus and control a second storage block of the bus interface circuit to store data outputted from the controller unit. Then, utilize the bus interface circuit to control the second storage block to output its stored data to the bus.
Patent TW-I240977-B (TW)
Title: Structure and formation method for conductive bump
Inventor: HUANG MIN-LUNG
IPC: H01L21/60
Filed: 2004-07-23
Granted: 2005-10-01
Abstract: A method and structure for a conductive bump are provided herein. A conductive surface is provided on a wafer. A conductive barrier and a conductive wetting layer, on a part of the conductive surface, have a bottom and a sidewall and further reach up a top surface. The conductive wetting and barrier layers constitute inside and outside sidewalls, respectively. A conductive seed layer overlays the conductive wetting layer and the top surface. Another conductive barrier and conductive bump are subsequently formed on the conductive seed layer.
Patent TW-I239116-B (TW)
Title: Dual-band bandpass filter
Inventor: CHEN CHENG-CHUNG
IPC: H04B1/00
Filed: 2004-09-01
Granted: 2005-09-01
Abstract: A dual-band bandpass filter, has a first pass band corresponding to a first frequency and a second pass band corresponding to a second pass band. The dual-band bandpass filter includes a first pair of resonators, a second pair of resonators, and a first coupling element. The first pair of resonators includes a first resonator and a second resonator. The first resonator and the second resonator share a first grounding transmission line, and are connected to ground through the first grounding transmission line. The first resonator and the second resonator generate coupling by the first grounding transmission line. The second pair of resonators includes a third resonator and a fourth resonator. The third resonator and the fourth resonator share a second grounding transmission line, and are connected to ground through the second grounding transmission line. The third resonator and the fourth resonator generate coupling by the second grounding transmission line. The first coupling element connected between the first pair of resonators and the second pair of resonators makes the first pair of resonators and the second pair of resonators to produce coupling. By using the first coupling element, the dual-band bandpass filter has the first pass band and the second pass band.
Patent TW-I250260-B (TW)
Title: Method for adjusting color temperature of lamp
Inventor: KUO SHU-SHOUNG
IPC: F21S10/00
Filed: 2004-12-03
Granted: 2006-03-01
Abstract: The present invention provides a method for adjusting color temperature of a lamp. The main objective of the invention is to use a reflective color plate to adjust the color phase of light illuminated from a lamp tube, followed by using a reflective plate to reflect the light to the outside of the lamp, in which the reflective plate has a light color and planar light properties. Therefore, the original strong light is adjusted into a soft light uniform in illumination and saturation. The reflective color plate is formed by connecting continuous multi-color reflective plates. The light emitted from a lamp tube is adjusted of its color phase by the reflective color plate, and a driving mechanism turns the reflective color plate so as to adjust the reflective color plate to a different color.
Patent TW-I290084-B (TW)
Title: Fine tilting adjustment mechanism for grinding machine
Inventor: CHEN SHR-CHANG
IPC: B24B41/02
Filed: 2004-12-21
Granted: 2007-11-21
Abstract: This invention is related to a fine tilting adjustment mechanism for grinding machine. Provided is a grinding machine comprising a spindle unit mounted on the carrier. A V-shaped groove is across the top of the carrier and fastening units including fixed screws and round-headed adjustable screws are installed in the spindle unit at either side of the V-shaped groove. By adjusting the amount of extrusion from round-headed adjustable screw, fine tilting adjustment of the spindle unit to the left or to the right can be made. Besides, fastening units including fixed screws and round-headed adjustable screws are also installed in the spindle unit at either side of the front panel of the carrier. By adjusting the amount of extrusion from round-headed adjustable screw, fine tilting adjustment of the spindle unit to the front or to the rear can also be made. In view of the above, the fine tilting adjustment mechanism between the spindle unit and the carrier allows fine tilting feasible and provides an easy adjustment through a simple mechanism.
Patent TW-I253689-B (TW)
Title: Process for producing a semiconductor wafer
Inventor: KANN GUNTHER
IPC: B24B49/03
Filed: 2005-01-27
Granted: 2006-04-21
Abstract: The invention relates to a process for producing a semiconductor wafer by simultaneous polishing of a front surface and back surface of the semiconductor wafer between rotating polishing plates, with a polishing fluid being supplied, during a polishing run which lasts for a polishing time, the semiconductor wafer being located in a cutout in a carrier and being held on a defined geometric path, and the carrier having a defined carrier thickness, and the semiconductor wafer having a starting thickness prior to polishing and a final thickness after polishing. The polishing time for the polishing run is calculated from data which include the starting thickness of the semiconductor wafer and the carrier thickness as well as the starting thickness and final thickness and the flatness of a semiconductor wafer which was polished during the last polishing run before the present polishing run.
Patent TW-I280729-B (TW)
Title: A configurable voltage generator
Inventor: CHENG TUNG-SHUAN
IPC: G11C5/14
Filed: 2005-02-04
Granted: 2007-05-01
Abstract: A configurable voltage generator is disclosed for generating multiple levels of output. It includes an oscillator module for generating a pumping signal, a digital to analog (D/A) converter coupled to the oscillator for generating one or more analog signals of a predetermined voltage level based on the pumping signal as configured by a set of inputs thereof, and a charge pump coupled to the D/A converter for producing a direct current (DC) output based on the analog signals generated by the D/A converter.
Patent TW-I268786-B (TW)
Title: Injector having drawing back force
Inventor: SHIU MING-JENG
IPC: A61M5/20
Filed: 2005-06-13
Granted: 2006-12-21
Abstract: An injector having drawing back force comprises an injection tube, a needle seat component, a stopping unit, a push rod and a drawing back device. The needle seat component is wedged in the injection tube and has a protective tube, a needle seat passing through the protective tube, and a needle body fixing with the needle seat and passing through the injection tube. The stopping unit is wedged in the injection tube disassembly for locating the needle seat component. The push rod is slipped among the injection tube and can lift the location between the stopping unit and the needle seat component. The drawing back device has a plug unit for fixing with the needle seat and a reciprocating unit for producing drawing back force. Accordingly, the plug unit is driven to drive the needle seat and the needle body moving along the protective tube and hiding in the push rod.
Patent TW-I256445-B (TW)
Title: Securing structure between crank and shaft
Inventor: CHEN JIUN-SHENG
IPC: F16B3/06
Filed: 2005-06-17
Granted: 2006-06-11
Abstract: A securing structure between crank and shaft comprises a spacer ring, a bushing, a shaft and a crank, and a securing bolt, wherein the bushing or the shaft is provided with slope or tapering, or alternatively, the shaft and the bushing are formed as shaped bar and shaped blocks, and shaped bar and the shaped blocks are formed with slope or tapering, the shaped blocks being connected by flexible members, to thereby effect efficient securing and tight positioning. The novel securing structure for crank and shaft is applicable to single-side or double-side assembling crank structure to effect the above mentioned functions.
Patent TW-I415286-B (TW)
Title: Package for semiconductor light emitting device
Inventor: EPSTEIN HOWARD C
IPC: H01L33/00
Filed: 2005-07-29
Granted: 2013-11-11
Abstract: A packaged light emitting device includes a frame, a cover, and a light emitting device. The light emitting device is disposed between the cover and the frame. A portion of the cover is flexible and a portion of the cover is rigid. The cover includes a flange and is attached to the frame by positioning the rigid portion of the cover to maintain the flange in a nest formed in the frame. In some embodiments, a stake is disposed over the sunken surface that forms the nest in the frame, and the cover is held in place by positioning the flange between the sunken surface and the stake. In some embodiments, the flange is the same material as the flexible portion and the rigid portion is a ring that extends into the flange.
Patent TW-I289111-B (TW)
Title: Ribbon transportation device capable of fastening ribbon
Inventor: LIN YUEH-CHENG
IPC: B41J35/06
Filed: 2005-08-01
Granted: 2007-11-01
Abstract: A ribbon transportation device capable of fastening ribbon is provided. The claimed ribbon transportation device comprises a ribbon cassette, two spools, and two fasteners. The two spools are rotatably disposed above the ribbon cassette for transporting the ribbon. The two fasteners are disposed respectively at two sides of one of the two spools for fastening the position of the ribbon. The ribbon transportation device of the present invention is capable of avoiding the obliquity of the ribbon on the spools in a transportation process of the thermal transfer printer or the ribbon transportation device itself. Hence the problem of wrinkles due to the obliquity is released accordingly.
Patent TW-I289649-B (TW)
Title: Filling apparatus for filling working fluid in a heat pipe
Inventor: SHEN TSUNG-LIN
IPC: F28D15/02
Filed: 2005-08-16
Granted: 2007-11-11
Abstract: A fluids stuffed with heat pipe device mainly includes a valve body, an operating post, a heat-pipe fitting mechanism, a fluid filling connector and an air cleaning mechanism. The valve body has a fluid passage and an air-removal passage, the operating post controls opening and closing between the fluid passage and the air-removal passage. The heat-pipe fitting mechanism and the fluid filling connector are respectively connected to the two ends of the fluid passage. The air cleaning mechanism is mounted to the fluid filling connector for cleaning the valve body inside.
Patent TW-I281789-B (TW)
Title: Phase lock loop device
Inventor: YEH TSE-HSIEN
IPC: H03L7/08
Filed: 2005-11-14
Granted: 2007-05-21
Abstract: A phase lock loop device comprises a probability shaping device provided between a phase detection device and charge pump and loop filter (CPLF) device. The probability shaping device operates to reducing the frequency of outputting up-index or down index, or the expectation of up-index or down-index; thereby shaping probability distribution to reduce degradation due to mismatch of the CPLF device.
Patent TW-I276181-B (TW)
Title: Semiconductor device employing an extension spacer and method of forming the same
Inventor: CHEN KUANG-HSIN
IPC: H01L21/336
Filed: 2005-11-15
Granted: 2007-03-11
Abstract: A semiconductor device formed on a semiconductor substrate and a method of forming the same. In one embodiment, the semiconductor device includes a gate over the semiconductor substrate and a dielectric liner on a sidewall of the gate. The semiconductor device also includes an extension spacer adjacent and extending laterally beyond the dielectric liner along the semiconductor substrate. The semiconductor device further includes a source/drain located below an upper surface of the semiconductor substrate and adjacent a channel region under the gate. The source/drain extends under the dielectric liner and the extension spacer. The semiconductor device still further includes a silicide region over a portion of the source/drain and extending laterally beyond the extension spacer along the semiconductor substrate. Thus, the extension spacer is interposed between the dielectric liner and the silicide region located over a portion of the source/drain.
Patent TW-I276739-B (TW)
Title: Fuel feeding unit
Inventor: MITSUDOU HIDEO
IPC: F02M37/10
Filed: 2005-11-22
Granted: 2007-03-21
Abstract: A fuel feeding unit feeds fuel in a normal state even under the conditions of posture being changed such as inclination of a vehicle in the state of a small amount of remaining fuel to enable effective use of fuel. A fuel feeding unit (100) includes a sub tank (20) and a fuel pump (10) fixed in said sub tank (20), and is fixedly mounted in a fuel tank (50) of a vehicle to feed a fuel having flowed in from said fuel tank (50) to said sub tank (20) to an engine with said fuel pump (10). A filter chamber (22), in which a filter (30) is packed and which includes a fuel inflow port (22a), is fixed to a lower end portion of the sub tank (20), and an inlet (11) of the fuel pump (10) is connected to the filter chamber (22).
Patent TW-I289920-B (TW)
Title: Packages, methods for fabricating the same, anisotropic conductive films, and conductive particles utilized therein
Inventor: SU CHAO-YUAN
IPC: H01L21/60
Filed: 2006-01-11
Granted: 2007-11-11
Abstract: Packages, methods for fabricating the same, anisotropic conductive films, and conductive particles utilized therein. One embodiment of the package includes a substrate, a chip, and an anisotropic conductive film. The substrate comprises an external terminal. The chip comprises a conductive bump overlying the external terminal of the substrate. The anisotropic conductive film is disposed between the substrate and the chip and comprises an adhesive binder and conductive particles distributed therein. Conductive particles comprise a conductive core surrounded by an insulating shell. At least one of the conductive particles is disposed between the conductive bump and the external terminal, and the insulating shell thereof fractures to expose the conductive core thereof, electrically connecting the conductive bump and the external terminal.
Patent TW-I286829-B (TW)
Title: Chip package
Inventor: HO KWUN-YAO
IPC: H01L23/48
Filed: 2006-01-17
Granted: 2007-09-11
Abstract: A chip package including a die, a package substrate, and multiple bumps is provided. The die has an active surface, multiple die pads, and a first passivation layer. The die pads are disposed on the active surface. The first passivation layer is disposed on the active surface and has multiple first openings exposing the die pads respectively. The package substrate has a substrate surface, multiple substrate pads, and a second passivation layer. The substrate pads are disposed on the substrate surface. The second passivation layer is disposed on the substrate surface and has a second opening exposing the substrate pads and part of the substrate surface. The bumps are disposed on the die pads respectively. Each bump is connected to one of the substrate pads by a compression bonding process. The die is electrically connected to the package substrate via the bumps. The distance from the first passivation layer to the substrate pads is smaller than 50 micrometer.
Patent TW-I289916-B (TW)
Title: Chip package and package process thereof
Inventor: WENG GWO-LIANG
IPC: H01L23/28
Filed: 2006-03-24
Granted: 2007-11-11
Abstract: A chip package including a package substrate, a chip, multiple bonding wires, a flash-resisting ring, and a molding compound is provided. The package substrate has a carrying surface and multiple contacts disposed thereon. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate has an active region and multiple bonding pads disposed outside the active region. The bonding wires are connected between the bonding pads and the contacts. The flash-resisting ring around the active region is disposed on the chip and located between the bonding pads and the active region. The flash-resisting ring has at least one buffer groove also around the active region. The molding compound is disposed on the package substrate and chip, wherein the molding compound at least encapsulates the bonding pads, the contacts, and the bonding wires and exposes the active region.