baber/WOPTO huggingface dataset:
Patent JP-2011150831-A (JP)
Title: Induction cooking device
Inventor: NAKAJIMA KOJI
IPC: H05B6/12
Filed: 2010-01-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an induction cooking device with a plurality of heating coils and a plurality of power modules to control a high frequency current flowing in the heating coils, in which heating fins for cooling the power modules and a cooling face are miniaturized.  <P>SOLUTION: A power module 1 includes arms A1-1 to A1-3 and a power module 2 includes arms A2-1 to A2-3. A series resonance circuit 101 is connected between the arm A1-1 and the arm A2-1, a series resonance circuit 102 is connected between the arm A1-2 and the arm A2-2, and the series resonance circuit 103 is connected between the arm A1-3 and the arm A2-3. A control circuit 70 drives switching elements provided on the arm A1-1 to A1-3 and the arm 2-1 to A2-3 so that a sum of input power into the series resonance circuits 101, 102, 103 may become smaller than a sum of maximum power capable of being input into each of the series resonance circuits 101, 102, 103.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011151304-A (JP)
Title: Device formed with hybrid member and having internal surface made of quartz
Inventor: TAKAHASHI ICHIRO
IPC: C23C16/44
Filed: 2010-01-25
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture a film formation chamber by a high-purity member excelling in mechanical strength, in a film formation device for a semiconductor thin film or the like.  <P>SOLUTION: A film formation chamber is manufactured using a hybrid member with a quartz plate material and a metal member integrated with each other. The hybrid member is made by subjecting the quartz plate material to vacuum suction to the metal member, and the film formation chamber is assembled so that the quartz plate material side of the hybrid member becomes the inner surface of the film formation chamber. The inner surface of the film formation chamber in contact with a material gas becomes a quartz surface, and a metal surface covered with the quartz plate material is isolated from the inside of the film formation chamber, whereby influence of a gas discharged from the metal member can be suppressed. The outer shell of the film formation chamber is formed with the metal member, thereby excelling in mechanical strength. Since the assembly or the like of the film formation chamber can be performed in the state where the quartz plate material is integrated with the metal member, the risk of breakage of the quartz plate material can be reduced.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011153885-A (JP)
Title: Reference device and coordinates measuring instrument
Inventor: KIMURA TOSHIO
IPC: G01B5/00
Filed: 2010-01-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a reference device which can be installed at an arbitrary position of a surface plate and enables the reduction of the manufacturing cost of a coordinates measuring instrument.  <P>SOLUTION: The reference device includes a reference device body measured by a three-dimensional measuring instrument and a pedestal 4 supporting the reference device body. The pedestal 4 is formed in the shape of a disk having a contact face 421 in contact with the plane 11A of the surface plate 11. A recess 422 having a ring-shaped section is formed in the contact face 421 while an intake hole 423 for taking in air is formed in the recess 422. Besides, the pedestal 4 has an intake channel 43 which communicates with the intake hole 423 and can be sucked to the surface plate 11 by the air being taken in from the intake hole 423 through the intake channel 43.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010121932-A (JP)
Title: Slush hydrogen manufacturing device
Inventor: NAKAMICHI KENJI
IPC: F25C1/14
Filed: 2010-02-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a slush hydrogen manufacturing device capable of improving a solidification rate of slush hydrogen.  <P>SOLUTION: The slush hydrogen manufacturing device 10 is equipped with: a heat exchanger 13 disposed in liquid hydrogen L held in a liquid hydrogen container 11 and having a heat transfer face 12; and an auger 14 having blades 14a scraping off solid hydrogen produced on a surface of the heat transfer face 12. A plurality of the blades 14a are provided on a surface of the auger 14 facing the heat transfer face 12 along a height of the auger 14, the auger 14 is connected to a reciprocating actuator or an ultrasonic transducer 19 via a rod 18, and the auger 14 is vibrated in the same way following vibration of the reciprocating actuator or the ultrasonic transducer 19.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011155941-A (JP)
Title: Bread crumb improving agent, bread crumb improving method, bread crumb production method, and bread crumb
Inventor: YAMADA SHIGERU
IPC: A23L7/157
Filed: 2010-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide bread crumbs excellent in crisp texture and solubility in a mouth and capable of maintaining the texture even after preservation for a long period of time, and to provide a bread crumb production method, a bread crumb improving agent, and a bread crumb improving method used for the bread crumb production method.  <P>SOLUTION: The bread crumb improving agent contains at least either one of a culture solution of Lactobacillus plantarum (FERM P-21534) and a processed product thereof.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010232637-A (JP)
Title: Substrate processing apparatus, and method of manufacturing semiconductor device
Inventor: HARADA KOICHIRO
IPC: H01L21/31
Filed: 2010-02-04
Abstract: <P>PROBLEM TO BE SOLVED: To prevent deterioration of a sealing member due to thermal radiation from a heater.  <P>SOLUTION: This substrate processing apparatus includes: a processing container; a substrate mounting portion which is arranged in the processing container, and on which a substrate is mounted; the heater arranged in the substrate mounting portion and configured to heat the substrate; a thermal radiation attenuation portion adjacent to the processing container; and a gas supply pipe connected to a gas introduction portion through a sealing member for supplying a processing gas to the inside of the processing container therethrough, wherein the thermal radiation attenuation portion is arranged on a line connecting the heater and the sealing member.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011039480-A (JP)
Title: Image forming apparatus
Inventor: FURUYA SEIJI
IPC: G03G15/16
Filed: 2010-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus that can eliminate the possibility that minute voids where discharge phenomenon occurs are formed between a transfer material conveyer belt and a transfer material and that can deter outputting of an abnormal image caused by the discharge phenomenon.  <P>SOLUTION: An intermediate transfer belt 9 that carries and conveys a toner image transferred from a second photoreceptor 6 and the transfer material conveyer belt 10, that conveys the transfer material are arranged so that a transfer material conveyer side of the transfer material conveyer belt 10 can bend at the intermediate transfer belt 9 and configured so that the toner image can be transferred from the intermediate transfer belt 9 to the transfer material on the transfer material conveyer belt 10; and a first photoreceptor 11 that forms the toner image and the transfer material conveyer belt 10 are arranged so that the transfer material conveyer side of the transfer material conveyer belt 10 can bend at the first photoreceptor 11 and configured so that the toner image can be transferred from the first photoreceptor 11 to the transfer material on the transfer material conveyer belt 10, and by moving the transfer material along the bent transfer material conveyer belt 10, the transfer material is made to firmly attach to the transfer material conveyer belt by a restoring force due to the rigidity of the transfer material itself.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010202869-A (JP)
Title: Aqueous coating system based on physically drying urethane acrylate
Inventor: SOMMER STEFAN
IPC: C09J175/14
Filed: 2010-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a radiation-curable coating system which produces a very hard film which permits rapid physical drying, has high blocking resistance after drying and having high resistance to chemicals after radiation curing.  <P>SOLUTION: A radiation-curable, aqueous dispersion is based on a polyurethane acrylate (i) comprising as structural components (A) an oligomeric or polymeric compound comprising an NCO-reactive group and a radically copolymerizable group; (B) a monomeric compound other than (A) comprising an OH functional group and a (meth)acrylate group; (C) a polyesterpolyol obtained from (C1) an aliphatic diol and/or an aliphatic triol, and (C2) an aromatic di- and/or tri-carboxylic acid; (D) a polyol other than (A), (B), and (C); (E) a compound comprising an NCO-reactive group and a non-ionic group, an ionic group, or a group formable of an ionic group, wherein the compound has a dispersing action; (F) an organic polyisocyanate; (G) a compound other than (A), (B), (C), (D), and (E) comprising an NCO-reactive group.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011166080-A (JP)
Title: Semiconductor device
Inventor: KOJIMA KAZUAKI
IPC: H04N5/225
Filed: 2010-02-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an imaging apparatus 1 wherein characteristics of a solid-state image sensor 13 are stabilized.  <P>SOLUTION: A semiconductor device includes: a device chip 10 having a solid-state image sensor 13 formed on a first principal surface 11 and an external terminal 17 of the solid-state image sensor 13, which is formed on a second principal surface 12; a wiring board 30 which includes a distal end 31 having a connecting pad 36, a bent portion 32 bent at an angle being ≥90° and an extension 33 and has a wiring layer 35 extending from the distal end 31 through the bent portion 32 to the extension 33; an adhesive layer 16 adhering the distal end 31 to the second principal surface 12; and wire-bonding wiring 40 electrically connecting the external terminal 17 and the connecting pad 36. The wiring board 30 is positioned within a space 10S right above the second principal surface of the device chip 10.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011169804-A (JP)
Title: Methods of measuring and predicting creep rupture life under fixed strain of thermoplastic resin molding
Inventor: Osuga Harunobu
IPC: G01N3/08
Filed: 2010-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of measuring a creep rupture life under fixed strain precisely, and to provide a method of precisely predicting a creep rupture life of a thermoplastic resin molding from the actually measured amount of strain of the thermoplastic resin molding by precisely acquiring data on a relationship between the amount of strain and the creep rupture life and hence deriving a life curve relating to the creep rupture easily and precisely without performing any complex computation.  <P>SOLUTION: A creep rupture test under fixed strain is performed by a test piece of a thermoplastic resin including notches; a life curve relating to a correlation between the amount of strain and creep rupture time is derived from data on the acquired amount of strain and the creep rupture time; and the amount of strain of the thermoplastic resin molding is actually measured, thus predicting the creep rupture life of the thermoplastic resin molding from the life curve.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011167428-A (JP)
Title: Clothes dryer
Inventor: KYO MASAHITO
IPC: D06F58/02
Filed: 2010-02-22
Abstract: <P>PROBLEM TO BE SOLVED: To reduce noise generated by high voltage and high speed and provide a large air volume with a single blower fan, whereby reducing clothes wrinkles using the dryer in low power consumption.  <P>SOLUTION: The clothes dryer includes a blower 50 which blows drying air into a drum 1, wherein the blower 50 includes: a casing; a blower fan 52 which is freely rotatably arranged in the casing; and a fan motor 53 which rotatably drives the fan 52. The fan 52 includes multiple blades clamped between a main plate and a shroud plate. An exit angle on the edge of the blades at the shroud plate side is smaller than that on the edge of the blades at the main plate side.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011174867-A (JP)
Title: Pipe inspection device
Inventor: MORI ISATO
IPC: G01N29/26
Filed: 2010-02-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pipe inspection device for improving the flaw detection accuracy.  <P>SOLUTION: This pipe inspection device is equipped with: a guide rail 5 attached to the outer peripheral side of a branch pipe 2; a circumferentially moving mechanism 7 that has running wheels 43, 46a and 46b travelling on the outer peripheral surface of the guide rail 5 and two pairs of guide rollers 50A-50D travelling on the inner peripheral surface and moves a first frame 6 to the guide rail 5; an axially moving mechanism 9 for moving a second frame 8 to the first frame 6; and a radially moving mechanism 11 for moving an ultrasonic probe 4 to the second frame 8. The guide rail 5 has a track similar to an elliptical weld line 3a. The pipe inspection device is constituted so that the positions of the guide rollers 50A and 50B to the first frame 6 are movable, and that the moving directions and moving ranges of the guide rollers 50A and 50B are line-symmetric to a reference line D (ultrasonic transmission direction line A2), and the device has extension springs 53A and 53B that pull guide rollers 50A and 50B to a substantially radial outside of the branch pipe 2.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011175937-A (JP)
Title: Sealed battery
Inventor: YOSHIDA SOJI
IPC: H01M2/04
Filed: 2010-02-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sealed battery with a safety mechanism in which no leakage of an electrolyte solution is caused by a shock of falling or the like.  <P>SOLUTION: In the sealed battery provided with a safety mechanism in which a valve is crushed to discharge the gas inside the battery out of the battery, when a battery inner pressure rises, the valve is arranged on a sealing port plate for sealing an outer can bottom or an opening of the outer can, and the thickness of the valve is thinner than the thickness of the outer can bottom or the sealing port plate and moreover the valve has a crushing groove to open the valve, and a chamfering part of which the corners are chamfered are formed on at least part of a battery outside face of the body in an interface between the valve and the can bottom of the outer can where the valve is arranged or the body of the sealing port plate.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011182149-A (JP)
Title: Semiconductor integrated circuit, and information processing device with semiconductor integrated circuit
Inventor: KUBOTA SHUJI
IPC: G01R31/28
Filed: 2010-03-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which makes performance evaluation of an ADC efficient without excessively increasing a scale of the semiconductor integrated circuit, and to provide an information processing device with the semiconductor integrated circuit.  <P>SOLUTION: The semiconductor integrated circuit has an analog-digital conversion circuit which converts an analog signal into a digital signal, and includes a test circuit which performs evaluation processing of the analog-digital conversion circuit using an output signal of the analog-digital conversion circuit, wherein the test circuit includes a spectrum power calculation unit for calculating a spectrum power value of the output signal of the analog-digital conversion circuit.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011178513-A (JP)
Title: Method of evaluating buckling of float transported substrate
Inventor: ISHIZUKA NAOKO
IPC: B65G51/03
Filed: 2010-03-01
Abstract: <P>PROBLEM TO BE SOLVED: To reliably evaluate the occurrence of the buckling of a substrate when the substrate is float transported so that, when there is an element for which the substrate requires design change, the element can be specified.  <P>SOLUTION: The occurrence of the buckling of the substrate W is evaluated during float transportation while changing error factors 5, 6 other than the transport acceleration (error factor 7) of the substrate W, and then the occurrence of the buckling is evaluated while changing the transport acceleration (error factor 7). Error factors 5, 6 are selected from the errors of the peripheral surface positions from the design values of respective reference rollers 31 which constitute a reference roller group 31G, the errors of the pressures of the compressed airs jetted from the nozzles 27 of respective floating units 25 from the design values, and the initial irregularity of the shape of the substrate W (the error of the shape of the substrate W from the design value). Thereby, the error of the substrate W during float transportation is performed for each error factor while preferring the error factors 5, 6 other than the transport acceleration (error factor 7) which is liable to be affected by a variation in the parameter values of the other error factors over the transport acceleration (error factor 7).  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011179966-A (JP)
Title: Sound sensitivity measuring apparatus
Inventor: ICHIKAWA KEI
IPC: G01H17/00
Filed: 2010-03-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sound sensitivity measuring apparatus for preventing the accuracy from being degraded by the directivity of a sound source, and correctly measuring the sound sensitivity in an intermediate frequency band.  <P>SOLUTION: The sound sensitivity measuring apparatus includes the sound source attached to a rotatable fixing member disposed within a cab, and rotated along with the rotated fixing member; a sound pressure sensor for detecting sound pressure by a sound emitted from the sound source; an acceleration sensor provided on the surface of the cab and detecting an acceleration by the sound; and a sound sensitivity calculation means for calculating the sound sensitivity from the sound pressure and the acceleration. The sound sensitivity calculation means calculates the sound sensitivity from the sound pressure and the acceleration obtained by the sound emitted from the sound source at each rotation position.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010160511-A (JP)
Title: Imaging apparatus
Inventor: TOMATSU AKIRA
IPC: G03B17/14
Filed: 2010-03-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of improving operability when performing manual focusing.  <P>SOLUTION: The imaging apparatus 1 includes a mount part Mt to which attachable/detachable photographic lens 3 is mounted, a body side coupling member CP1, and a load applying means 60. When the photographic lens 3 is mounted to the mount part Mt, the body side coupling member CP1 is coupled with a lens side coupling member CP2 of the photographic lens 3, and rotates interlocked with moving operation of a focus lens in the photographic lens 3. The load applying means 60 applies damping load to the body side coupling member CP1.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011187589-A (JP)
Title: Solid-state imaging element and imaging apparatus
Inventor: SAKAMOTO TOMOHIRO
IPC: H04N5/3728
Filed: 2010-03-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solid-state imaging element that reduces a false signal generated by electric charges generated on the surface of a photoelectric conversion part.  <P>SOLUTION: At the right side of an array comprising a plurality of photoelectric conversion parts arrayed in a column direction Y, a charge transfer path 3 is arranged correspondingly. A charge read region 4 is formed between a photoelectric conversion part 2 and a charge transfer path 3 corresponding to the photoelectric conversion part 2, and a PD-VCCD element isolation region 5 is formed in a region except for the charge read region 4 out of a region between the photoelectric conversion part 2 and the charge transfer path 3 at a side thereof. A light shielding film 9 which shields the charge transfer path 3 from light is formed at the upper part of a semiconductor substrate, and a power supply terminal is connected to the light shielding film 9. Furthermore, the light shielding film 9 has a connection part 9a which is electrically connected to the PD-VCCD element isolation region 5.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011185693-A (JP)
Title: Rotation sensor and stirring defoaming device
Inventor: DOBASHI YUTAKA
IPC: B01F29/90
Filed: 2010-03-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a rotation sensor allowing to accurately grasp a vessel behavior (especially rotation number) in a rotation/revolution type stirring defoaming device.  <P>SOLUTION: The rotation sensor 220 is used for a device for stirring and defoaming a material (stirring defoaming device 1) by rotating with revolving a container 100 containing a predetermined material M, and the rotation number of the container is directly detected.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011150269-A (JP)
Title: Developing device
Inventor: MORI HIROKI
IPC: G03G15/08
Filed: 2010-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a developing device capable of improving the positioning precision of a blade with respect to an outer circumferential surface of a developer carrier.  <P>SOLUTION: In a developing cartridge 16, a layer thickness regulating member 24 includes: a blade 100 configured to regulate a layer thickness of toner on the outer circumferential surface of a developing roller 22; a support member 101 supporting the blade 100; and a reinforcement member 102 reinforcing the blade 100. The support member 101 includes: a first support part 105 to which the blade 100 is fixed; a second support part 106 which is connected to the reinforcement member 102; and protrusions 108 which are attached to a developing frame 40. When projected from a width direction, the first support part 105 and the protrusions 108 are disposed on the same plane Y. Therefore, it is possible to dispose the first support part 105 (blade 100) at a desired position with high precision when the protrusions 108 are attached to the developing frame 40 with high precision.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010219530-A (JP)
Title: Organic thin-film transistor, method of manufacturing the same, and gate-insulating layer used for it
Inventor: CHEN SHENG-WEI
IPC: H01L29/49
Filed: 2010-03-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an organic thin-film transistor (OTFT) in which an azole-metal complex compound is used for a gate-insulating layer.  <P>SOLUTION: The method for manufacturing a self-organized gate-insulating layer is performed on the basis of an aqueous processing method, in which the azole-metal complex compound is self-organized on a patterned gate electrode in an aqueous solution, and it can act as the gate-insulating layer. The organic thin-film transistor can be put to a mass production with a simple, rapid and easy form at a low cost, because it contains the azole-metal complex compound used for the gate-insulating layer.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011192737-A (JP)
Title: Electronic component and method of manufacturing the same
Inventor: KAWABATA TOSHIO
IPC: H01F41/04
Filed: 2010-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic component that suppresses a decrease in impedance of a coil, and to provide a method of manufacturing the same.  <P>SOLUTION: A laminate 12 is formed by laminating a plurality of insulator layers 16. The coil L comprises a coil conductor 18 provided on the insulator layers 16. The coil conductor 18 has regions 19 and 20, arranged side by side in a direction orthogonal to a z-axial direction, in a cross section orthogonal to an extending direction of the coil conductor 18. A gap is present between the region 19 and the insulator layers 16 adjoining each other in the z-axial direction of the coil conductor 18. No gap is present between the region 20 and the insulator layers 16 adjoining each other in the z-axial direction of the coil conductor 18.  <P>COPYRIGHT: (C)2011,JPO&INPIT