Patent SG-11201906159X-A (SG)
Title: Socket side thermal system
Inventor: TUSTANIWSKYJ JERRY
IPC: G01R31/28
Filed: 2018-01-08
Abstract: DUT108 -1 e„. .109 120 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 July 2018 (12.07.2018) WIP0 1 PCT Iiiimmomiolollmonolomomommomlloonomoun (10) International Publication Number WO 2018/129439 A2 (51) International Patent Classification: G01R 1/04 (2006.01) GO1R 31/28 (2006.01) (21) International Application Number: PCT/US2018/012763 (22) International Filing Date: 08 January 2018 (08.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/444,092 09 January 2017 (09.01.2017) US 15/416,510 26 January 2017 (26.01.2017) US (71) Applicant: DELTA DESIGN, INC. [US/US]; 12367 Crosthwaite Circle, Poway, CA 92064 (US). (72) Inventor: TUSTANIWSKYJ, Jerry, Ihor; C/o Delta De- sign, Inc., 13267 Crosthwaite Circle, Poway, CA 92064 (US). (74) Agent: BECK, George et al.; Foley & Lardner LLP, 3000 K Street Nw, Suite 600, Washington, DC 20007-5109 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, (54) Title: SOCKET SIDE THERMAL SYSTEM FIG. IA 00 O C (57) : An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace. [Continued on next page] WO 2018/129439 A2 IMIOHOM0101011M0E10130HOIROMIIHNOMOMMIE MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(11)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: without international search report and to be republished upon receipt of that report (Rule 48.2(g))