baber/WOPTO huggingface dataset:
Patent TW-541543-B (TW)
Title: Method and apparatus for a flexible controller including an improved output arrangement for a dram generator system
Inventor: WEINFURTNER OLIVER
IPC: G11C5/14
Filed: 2001-04-03
Granted: 2003-07-11
Abstract: In a controller (100) for controlling a generator system on a memory chip. the controller operates as a state machine in accordance with a state diagram including a plurality of X states. A state storage device (106) is responsive to input signals indicating a change in the state diagram from a current state to a next state for generating a revised plurality of X state output signals comprising a true State signal and a complementary true State signal for the next state of the plurality of X states. An output arrangement (108) is responsive to the true State signal and the complementary true State signal in the revised plurality of X state output signals from the state storage device for generating separate predetermined ones of M output signals associated with said next state for controlling the generator system while providing substantially zero current consumption when the state diagram reaches a final state of the plurality of X states.
Patent TW-514861-B (TW)
Title: A driving scheme for liquid crystal displays
Inventor: YEUNG STEVEN WAI-LEUNG
IPC: G09G3/20
Filed: 2001-03-27
Granted: 2002-12-21
Abstract: The invention relates to a m-column/n-row/m x n-pixel inversion driving method for a liquid crystal display where m can be any integer from two to the number of scan lines and n can be any integer of two to the number of column lines. Such a driving method greatly reduces total fringe field effect on display to maintain contrast whilst minimising perception of flickering. Moreover, the number of inversions can be adjusted to strike a balance between contrast and perceptibility of flickering. The n-row inversion method can be applied to passively and actively driven liquid crystal displays where n can be any integer from two to the number of scan lines. The m-column inversion driving method can be applied to an actively driven LCD where m can be any integer from two to the number of column lines while the n x m-pixel inversion method can be applied to an actively driven LCD where n can be any integer from two to the number of scan lines and m can be any integer from two to the number of column lines. This inversion method is particularly useful in actively driven miniature TFT and reflective liquid crystal on silicone displays in contrast to the effect on fringe field if a conventional single row/column/pixel inversion method is used.
Patent TW-541463-B (TW)
Title: Method of bilinear texture filtering
Inventor: HSIAO CHIEN-CHUNG
IPC: G06T1/00
Filed: 2001-04-02
Granted: 2003-07-11
Abstract: A method of bilinear texture filtering is proposed. The method requires only a pair of texels to compute the color value of each pixel to save the memory bandwidth and can achieve better results. The method first calculates the texture coordinate of each pixel and chooses a pair of texels nearest the texture coordinate. Then, the method reads in the data of the pair of texels and calculates the color value according to the data of the pair of texels and the floating-point of the texture coordinate. The pair of texels can also be chose by the shape of the pixel.
Patent TW-513672-B (TW)
Title: A process for manufacturing a contactless smart card with an antenna support made of fibrous material
Inventor: KAYANAKIS GEORGES
IPC: B42D15/10
Filed: 2001-05-30
Granted: 2002-12-11
Abstract: The present invention relates to a contactless smart card manufacturing process and more specifically to a manufacturing process for a contactless smart card for which the antenna is on a fibrous material such as paper. This process includes a manufacturing step to screen print the antenna onto the support, a step to bond the contacts of the chip onto the antenna support using conductive glue, and a step designed to laminate the card body onto the antenna support by hot press molding. Cutouts made in the corners of the antenna support prior to the lamination step enable the card bodies to be bonded together. The card thus obtained allows a posteriori viewing of any mechanical misuse to which it may have been subjected (extreme bending).
Patent TW-503561-B (TW)
Title: Semiconductor integrated circuit
Inventor: TAKABAYASHI TSUTOMU
IPC: H01L21/82
Filed: 2001-07-31
Granted: 2002-09-21
Abstract: Bump areas for signals are spread on the upper and lower positions with respect to the Vdd and Vss lines in the I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread into two directions. Greater number of I/O buffers can be disposed without increasing the size of the semiconductor integrated circuit.
Patent TW-498112-B (TW)
Title: Method for removing copper, stannous and zinc ions from peeled-tin or peeled-tin lead waste solution
Inventor: CHEN GUO-JIN
IPC: C25C1/12
Filed: 2001-08-01
Granted: 2002-08-11
Abstract: The present invention relates to a method for recycling peeled-tin or peeled-tin lead waste solution used in the electronic industry, e.g. lead frame or printed circuit board. The method comprises using a low temperature electrolysis reduction of copper ions into metal copper and a high temperature electrolysis oxidation of stannous ions and zinc ions to form a precipitants of oxides and hydroxides of zinc an tin, thereby removing copper ions, stannous ions and zinc ions from the waste solution, making the waste solution, after removal of these cations, suitable to prepare fresh peeled-tin or peeled-tin lead solution, and thereby achieving complete recycling of the waste solution.
Patent TW-494508-B (TW)
Title: Device and method of semiconductor die package
Inventor: TZU JOHNSON C H
IPC: H01L21/58
Filed: 2001-08-24
Granted: 2002-07-11
Abstract: This invention provides a device and a method of semiconductor die package. The device of semiconductor chip package consists of: a leadframe attached with a semiconductor die using a full adhesive tape to adhere onto the above-mentioned leadframe, in which the full adhesive tape is an adhesive material; a covering object formed on the semiconductor die and part of the leadframe at the periphery exposed, in which the leadframe having a wire to connect to the die; and a plural number of metal bumps connecting to the bottom of the leadframe. The inventive method of semiconductor die includes: providing a leadframe having a specific pattern; stamping a material onto a plural number of semiconductor dies using an adhesive tape; placing the semiconductor dies onto the leadframe; using a wire to connect the dies and the leadframe; performing first molding of the dies and part of the leadframe to expose part of the leadframe, in which the resin is a compound; performing second individual molding of the dies, in which the resin is a compound; connecting a plural number of metal bumps onto the bottom of the leadframe to obtain individual die packages; and dicing apart the individual die packages to obtain the complete die packages.
Patent TW-522538-B (TW)
Title: Semiconductor device and method of manufacturing the semiconductor device
Inventor: ISHIMARU KAZUNARI
IPC: H01L21/82
Filed: 2001-09-27
Granted: 2003-03-01
Abstract: A semiconductor device has a fuse to be blown with an energy beam. The semiconductor device has copper wiring levels formed on a semiconductor substrate on which semiconductor elements are formed, an uppermost wiring level formed on said copper wiring levels and including a refractory metal film connected to a top one of the copper wiring levels, the fuse formed from a part of the uppermost wiring level, and a surface protective film formed on the uppermost wiring level.
Patent TW-518822-B (TW)
Title: Voltage stabilized low level driver
Inventor: ANDERSON ALMA
IPC: H03K19/003
Filed: 2001-10-16
Granted: 2003-01-21
Abstract: The invention provides a voltage stabilized low level driver. The driver includes a switched op-amp that controls the output of the driver to match an internal reference voltage when it is switched on. When it is switched off, the op-amp turns off the output of the driver and allows the output to be pulled up by an external device. The driver also includes a slew rate control circuit for limiting the slew rate of the high-to-low transition at the output. The driver may be used for I2C applications.
Patent TW-508677-B (TW)
Title: Transistor with W/Tin gate fabricated
Inventor: TSENG HORNG-HUEI
IPC: H01L21/28
Filed: 2001-11-06
Granted: 2002-11-01
Abstract: A method to fabricate transistor with W/Tin gate is disclosed, which comprises forming an insulating layer on the semiconductor substrate, forming an opening on the insulator and exposing the substrate; then forming a gate oxide layer on the substrate and on the bottom of opening, forming barrier metal along the opening; forming a conductive layer on the barrier metal; planarizing the conductive layer and the barrier metal, removing the insulating layer to form the gate structure; removing the barrier metal on the sidewall, then forming a lightly-doped drain on the substrate by the gate; and forming the sidewall spacer on the sidewall of gate, forming the drain and source on the substrate and by the side of lightly-doped drain.
Patent TW-563197-B (TW)
Title: Use of endpoint system to match individual processing stations within a tool
Inventor: PASADYN ALEXANDER J
IPC: H01L21/02
Filed: 2001-12-19
Granted: 2003-11-21
Abstract: A technique for processing a wafer in a semiconductor manufacturing process are disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool. The collected processing rate data is then communicated to a controller that autonomously compares the processing rate data to determine whether to adjust a process parameter. The method then adjusts the process parameter for at least one station to match the process endpoint for the at least one station.
Patent TW-521557-B (TW)
Title: Manufacturing method of electronic device, and its panel, casing and keypad
Inventor: KAO HSIANG-LUNG
IPC: H05K7/00
Filed: 2002-01-31
Granted: 2003-02-21
Abstract: The present invention provides a Manufacturing method of electronic device, and its panel, casing and keypad. The manufacturing method of the panel and keypad of the electronic device includes the steps of: first providing a flat plate printed thereon a pattern; next, punching holes on the flat plate to obtain a panel having a plurality of key holes, and using material dropping from the flat plate as the keys of the keypad; and finally, combining the keypad with the panel by corresponding the keys to the key holes, respectively. Accordingly, when the keypad is combined with the panel, the pattern on the key and the pattern on the panel are continuous and integral. The electronic device includes a panel and a plurality of keys. The panel has a plurality of key holes, and a base pattern is formed on the panel. The plurality of keys is combined with the panel by corresponding to the key holes, respectively. Matching patterns are formed on the keys, respectively, wherein the keys are dropped when manufacturing the key holes on the panel. Accordingly, when the keys are combined with the panel, the matching pattern on the key and the base pattern on the panel are continuous and integral.
Patent TW-527645-B (TW)
Title: Method for broadening active semiconductor area
Inventor: WICH-GLASEN ANDREAS
IPC: H01L21/762
Filed: 2002-02-18
Granted: 2003-04-11
Abstract: The invention relates to a method for broadening active semiconductor area (2) on a semiconductor substrate (1) that has at least one trench isolation (3). The method is composed of the following steps: deposition of a pad-oxide layer (5) on a surface (4) of the semiconductor substrate (1); deposition of a pad-nitride layer (6) on the pad-oxide layer (5); changing the structure of the pad-nitride layer (6) to create at least one opening on the pad-nitride layer (6); and etching the pad oxide layer (5) and one part of the semiconductor substrate (1) to form at least one shallow trench isolation (3). The aim of the invention is to adjust the broadening of the structures of active semiconductor areas in a simple and cost-effective manner that is substantially independent of other process steps during the production of the component. The invented method is characterized by selectively depositing an extension layer (7) with a predetermined thickness on the semiconductor structure and by oxidizing the surface (4) of the semiconductor substrate (1) to form a thin oxide layer (9) having passivation effect.
Patent TW-523429-B (TW)
Title: Method and device for controlling part feeder
Inventor: TAKASE HIROTO
IPC: B65G27/32
Filed: 2002-03-29
Granted: 2003-03-11
Abstract: The present invention comprises a vibration element 16 vibrating at a prescribed frequency and a vibration device 14 fitted with the element 16. A driving circuit 20 for driving the vibration element 16, and a control part 22 which sends a driving signal to the driving circuit 20 for a prescribed vibration of the circuit 20 are provided. A signal detecting means which drives the vibration element 16 temporarily at a frequency different from an ordinary driving frequency every prescribed driving frequency of the vibration element 16 and detects a signal waveform obtained from the element 16 during the vibration period is provided in the control part 22. The control part 22 has a phase difference detecting means for detecting the phase difference between a vibration signal waveform and the driving signal waveform of the circuit 20 and a vibration controlling means for controlling the vibration of the element 16 based on the obtained phase difference.
Patent TW-567334-B (TW)
Title: Searching and notification system
Inventor: GUO JIUN-JE
IPC: G01S1/00
Filed: 2002-04-12
Granted: 2003-12-21
Abstract: The present invention is a searching and notification system, which uses the GPS positioning system and wireless transmission for the master unit to track the positions and distances of multiple slave units' users. Furthermore, if the slave unit keeps static for a period of time, it will immediately and automatically call the owner of the master unit. Alternatively, if the measured temperature approaches the default lowest temperature, it will immediately and automatically call the owner of the master unit. For emergency, the user can directly press the emergency button on the unit to call for help from the owner of the master unit, so that the system can respond in real time and effectively notify the position and distance.
Patent TW-533564-B (TW)
Title: Lead-frame adapted to size reduction of integrated circuits
Inventor: LEE SHOU-LUNG
IPC: H01L23/48
Filed: 2002-04-17
Granted: 2003-05-21
Abstract: Conventional configuration of a lead frame, particularly a lead frame in a Lead-on-Chip package, is substituted by one having inward ends of leads thereof arranged in unprecedented ways, resulting in bigger gap between any two adjacent inward ends of inner leads, leading to bigger Inner Lead Pitch of a lead frame in which the space available is always limited. It is by the new configuration that an IC packaging process can be immunized against the difficulty resulting from too small Inner Lead Pitch of a lead frame, and the bottle neck of packaging an IC to meet the tendency of minimizing the size of an IC can thus be overcome.
Patent TW-580840-B (TW)
Title: Portable computer having woofer
Inventor: WENG SHR-LUNG
IPC: H04R27/00
Filed: 2002-04-22
Granted: 2004-03-21
Abstract: The present invention provides a portable computer having woofer, which comprises computer main-body, a speaker box, a porting part, a moveable part and an elastic member. The speaker is installed inside the computer main-body and comprises a box body and a single woofer, and the speaker box has a through hole. The porting part has a resonant cavity connected to the internal space of the speaker box. The porting part is installed outside the computer main-body, and is attached to the computer main-body in the way of rotating with respect to the computer main-body. The porting part has a driving part. The moveable part is installed to surround the porting part and is moveable with respect to the porting part, and the moveable part has a moved part corresponding to the driving part. One end of the moveable part has a buffer part abutted to the circumference of the through hole on the box in the way of being separated with the box. The elastic member is abutted to the other end of the moveable part, which provides the elastic force toward the direction of through hole. Thus, when the porting part begins to rotate from the first position toward the second position with respect to the computer body, or begins to rotate from the second position toward the first position, the driving part is matched with the moved part, so that the moveable part moves in the direction away from the through hole, and separates the buffer part from the box. When the porting part rotates with respect to the computer body and reaches the first or second positions, the moveable part moves in the direction toward the through hole, so that the buffer part is abutted to the box.
Patent TW-536804-B (TW)
Title: Apparatus and method for improved power bus ESD protection
Inventor: LIN SHI-TRON
IPC: H01L23/60
Filed: 2002-06-28
Granted: 2003-06-11
Abstract: A number of different arrangements of island structures are utilized for improved ESD protection. The MOSFET structure provides islands that are selectively positioned among a group of ESD protection devices for protecting the power-bus, input pins, output pins and I/O pins to achieve ESD improvement in a manner which improves overall ESD protection strength while reducing the complexity of IC simulation and modeling.
Patent TW-539880-B (TW)
Title: Heat-compensation fiber grating package structure
Inventor: JANG HUNG-CHI
IPC: G02B6/34
Filed: 2002-07-02
Granted: 2003-07-01
Abstract: A heat-compensation fiber grating package structure is disclosed, which comprises: an optical fiber having a grating on it; a substrate having a base and two arms, one end of each arm being extended from the base, the other end of the arm being connected to the fiber respectively, so as to dispose the grating between the two arms, the substrate having the first thermal expansion coefficient; at least a top material having one end connected to the base, and the other end connected to one of the two arms from the opposite side of the position where the grating locates. The top material has the second thermal expansion coefficient at the end close to the top material. The second thermal expansion coefficient is greater than the first thermal expansion coefficient.
Patent TW-I258512-B (TW)
Title: Duplex stainless steel
Inventor: BERGSTROM DAVID S
IPC: C22C38/54
Filed: 2002-06-30
Granted: 2006-07-21
Abstract: A duplex stainless steel including, in weight percent, up to 0.06 percent carbon, 15 up to less than 25 percent chromium, greater than 3 up to 6 percent nickel, up to 3.75 percent manganese, 0.14 up to 0.35 percent nitrogen, up to 2 percent silicon, greater than 1.4 up to less than 2.5 percent molybdenum, up to less than 0.5 percent copper, up to less than 0.2 percent cobalt, up to 0.05 percent phosphorous, up to 0.005 percent sulfur, and 0.001 up to 0.0035 percent boron, with the remainder being iron and incidental impurities is disclosed. The duplex stainless steel may be included in an article of manufacture, such as a strip, bar, plate, sheet, casting, tubing or piping. A method for making such a duplex stainless steel is also disclosed.
Patent TW-585011-B (TW)
Title: Mask and method of manufacturing the same, and method of manufacturing electro-luminescence (EL) device
Inventor: YOTSUYA SHINICHI
IPC: C23C14/04
Filed: 2002-09-25
Granted: 2004-04-21
Abstract: The subject of the present invention is to provide a mask which can be cooled effectively and method of manufacturing the same, and method of manufacturing electro-luminescence (EL) device. The method of manufacturing a mask includes: attaching a second substrate 20 having a plurality of penetrating holes 22 to a first substrate 10 having an opening 12. The second substrate 20 is attached such that the penetrating holes 22 are positioned within the opening 12. A groove 14 is formed on a surface of the first substrate 10 facing the second substrate 20. The groove 14 is utilized to form a flow path between the first and second substrates 10, 20.
Patent TW-561306-B (TW)
Title: LCD projection system and illumination device thereof
Inventor: LI KUO-YUIN
IPC: H04N9/31
Filed: 2002-10-17
Granted: 2003-11-11
Abstract: The present invention relates to an illumination device of LCD projection system. The illumination device mainly comprises a light source, a quarter-wave retardation and a wire grid polarizer. The light source is used for providing light. The quarter-wave retardation is disposed near the light source. The wire grid polarizer is parallel to the quarter-wave retardation, and is used with the quarter-wave retardation to polarize the light from the light source. P-wave can pass through the wire grid polarizer. S-wave cannot pass through the wire grid polarizer, and is reflected to the quarter-wave retardation being a circularly polarized light. The circularly polarized light is reflected by a parabolic surface of the light source and pass through the quarter-wave retardation again to convert to p-wave. The converted p-wave can pass through the wire grid polarizer. Therefore, the illumination device of the invention can provide with p-wave. The illumination device can achieve high polarization conversion efficiency, and can be manufactured easily to reduce cost.
Patent TW-583484-B (TW)
Title: Liquid crystal display
Inventor: LEE SEOK-LYUL
IPC: G02F1/1333
Filed: 2002-12-16
Granted: 2004-04-11
Abstract: A liquid crystal display includes a first substrate comprising a first electrode; a second substrate having a switching element disposing thereon a second electrode having a plurality of sub-electrodes and at least one elongate hole having a longitudinal direction and facing to the first electrode, a third electrode positioned under the at least one hole and between the second electrode and the second substrate, connected to a gate electrode or an independent electrode, and having at least one notch disposed on an edge thereof and a longitudinal direction perpendicular to the longitudinal direction of the elongate hole; a liquid crystal layer having a plurality of liquid crystal molecules and interposed between the first substrate and the second substrate. The liquid crystal molecules positioned above and in a vicinity to the hole are aligned to the longitudinal direction of the hole, and the liquid crystal molecules above and in a vicinity to the notch are pointed to a valley of the notch in the presence of a sufficient electric field across the first substrate and the second substrate.
Patent TW-581992-B (TW)
Title: Display apparatus and electronic machine
Inventor: NAKANISHI HAYATO
IPC: H01L27/32
Filed: 2002-12-17
Granted: 2004-04-01
Abstract: The purpose of the present invention is to provide a display apparatus capable of normally conducting picture display and the electronic machine having the display apparatus. The display apparatus 1 in accordance with the invention includes the followings: the first electrode region, in which the first electrode 111 connected to the switch device 123 is disposed and formed on the substrate to have a matrix shape; power source wiring 103 for light emission, which is disposed at the periphery of the first electrode region and is connected to the first electrode 111; and a function layer 110, which is formed on top of the first electrode 111. In addition, at least one part of the second electrode 12 is formed on top of the function layer 110; and the first electrostatic capacitor C1 is formed between the power source wiring 103 for light emission and the second electrode 12.