baber/WOPTO huggingface dataset:
Patent TW-591378-B (TW)
Title: Memory test method, information recording medium and semiconductor integrated circuit
Inventor: KAMEI TATSUYA
IPC: G06F11/267
Filed: 2002-01-29
Granted: 2004-06-11
Abstract: The purpose of the present invention is to provide a kind of method capable of testing on-chip memory with excellent efficiency. The invented method for testing memory of semiconductor integrated circuit (IC) is provided with the followings: CPU (102), which has command queue; memories (107, 108); and bus (105) for connecting CPU and memory. The test program is stored in the command queue, and the test program is executed in the CPU to access the memory through the bus. After the test program is stored in the command queue, once the test program is fetched, it is conducted repeatedly from the command queue but not from the bus. Since the same test program can be repeatedly executed by using the loop queue action of the command queue, no branching command is required. Only the test program, which is repeatedly executed, is repeatedly fetched from the command queue; and the memory read/write access for testing memory and the memory access for fetching the command do not compete on the bus. Thus, it is capable of increasing the on-chip memory test efficiency of semiconductor IC.
Patent TW-515749-B (TW)
Title: Screw element for co-rotating multiscrew extruders
Inventor: UPHUS REINHARD
IPC: B29C48/595
Filed: 2002-03-06
Granted: 2003-01-01
Abstract: The invention relates to a screw element with an outer radius Ra and a core radius Ri for multiscrew extruders with co-rotating and intermeshing screw shafts, in particular for twinscrew extruders, which has in axial cross section through its longitudinal axis (10) a profile which has at each of the two axial end faces (front end face 8, rear end face 8') only a screw flight (1, 1') corresponding to a conventional single-start screw element for intermeshing screw shafts. In this case, the width (flight land angle φ) of the screw flight (1) and conversely, in a corresponding way, the width (flight land angle φ) of the screw flight (1') are formed in a special way and a shearing flight (7) with a constant shearing flight radius Rs, which is greater than Ri and less than Ra is provided.
Patent TW-561721-B (TW)
Title: Optical network system and controller
Inventor: KATSUYAMA YUTAKA
IPC: H04B10/275
Filed: 2002-05-28
Granted: 2003-11-11
Abstract: Nodes (4A, 4B, 4C, 4D) take the optical signals with different wavelengths from network fiber (3) and at the same time send out the optical signals with different wavelengths to network fiber (3). Controller (5) converts optical signal into optical signal with wavelength allocated by destination node in accordance with the destination address data for data forwarding contained in received optical signal, and outputs the converted optical signal to network fiber (3).
Patent TW-544527-B (TW)
Title: Radiofrequency signal receiver with means for correcting the effects of multipath signals, and method for activating the receiver
Inventor: OESCH YVES
IPC: H04B1/10
Filed: 2002-05-30
Granted: 2003-08-01
Abstract: The receiver (1) for radio-frequency signals (SV1, SV2, SV3, SV4), modulated by specific codes of transmitting sources, such as satellites (S1, S2, S3, S4), includes receiving and shaping means with frequency conversion for the radio-frequency signals for generating intermediate signals, a correlation stage formed of several correlation channels for receiving the intermediate signals and microprocessor means connected to the correlation stage in order to process the extracted data after correlation. Each channel includes a correlator in which the intermediate signals are correlated with at least two early and late replicas of the specific code of a visible transmitting source to be searched and tracked. The correlator further includes integration means for the correlated signals to provide a first amplitude value of the auto-correlation function of the early signals and a second amplitude value for the late signals. When multipath signals (SV1', SV3') are detected in the first operating channel, at least a second unused channel is configured, via the microprocessor means, and connected in parallel to the first channel. The second channel has the task of searching the maximum amplitude value between the two amplitude values of the first operating channel. The receiver, in particular of the GPS type, can be mounted in the case of a watch and powered by the energy accumulator or battery of said watch.
Patent TW-544955-B (TW)
Title: Organic electroluminescence device and fabricating method thereof
Inventor: CHENG STEVE
IPC: H01L51/50
Filed: 2002-06-13
Granted: 2003-08-01
Abstract: An organic electroluminescence device comprises a substrate, an anode located on the substrate, an emitting layer located on the anode, a cathode located on the emitting layer, and an ion doping layer located between the cathode and the emitting layer. The ion doping layer comprises 0.1% to 10% LiC104 or other ion compound doped in Alq3.
Patent TW-I243436-B (TW)
Title: Semiconductor package and fabrication method of the same
Inventor: PARK KYEI-CHAN
IPC: H01L25/18
Filed: 2002-06-13
Granted: 2005-11-11
Abstract: Disclosed is a semiconductor package capable of realizing a smaller and more compact size and improving reliability of package product and a fabrication method thereof. The disclosed invention comprises: a main semiconductor chip operating as a lead frame or a substrate and having a plurality of main chip pads on the outer peripheral part thereof; one or more sub semiconductor chips adhered to a predetermined part of the main semiconductor chip and having a plurality of sub chip pads on the outer peripheral part thereof; an insulating layer formed on the main semiconductor chip in a shape surrounding the sub semiconductor chip to expose the main chip pads and the sub chip pads; a plurality of metal patterns electrically connecting the exposed main chip pad to the sub chip pad or one sub chip pad to another sub chip pad; and a plurality of solder lands formed on a predetermined part of the plurality of metal patterns.
Patent TW-I243295-B (TW)
Title: Computer peripheral system for interconnection with pocketable personal articles
Inventor: TIROSH AMIR
IPC: G11B33/02
Filed: 2002-06-25
Granted: 2005-11-11
Abstract: A pocket-size computer peripheral system includes a computer peripheral device made up of at least two separable portions and an attachment bracket. The attachment bracket forms a sliding interconnection between the system and pocketable personal articles. Additionally, or alternatively, the attachment bracket selectively assumes one of two different attachment states with the separable portions of the device.
Patent TW-558810-B (TW)
Title: Semiconductor package with lead frame as chip carrier and fabrication method thereof
Inventor: CHEN HOLMAN
IPC: H01L23/495
Filed: 2002-07-05
Granted: 2003-10-21
Abstract: A semiconductor package with a lead frame as a chip carrier and a fabrication method thereof are provided. The semiconductor package includes: a lead frame having a plurality of first leads and a plurality of second leads, each lead having an upper surface and a lower surface opposed to the upper surface, wherein each of the first leads is formed with an extending portion smaller in thickness than the corresponding one of the first leads in a manner that, an upper surface of the extending portion is flush with the upper surface of the corresponding first lead, and a lower surface of the extending portion is elevated in position with respect to the lower surface of the corresponding first lead by a predetermined height difference; at least a chip, such as a multi-media card (MMC) chip, mounted on the upper surfaces of the extending portions; a plurality of bonding wires for electrically connecting the chip to the first and second leads; an encapsulant for encapsulating the upper surfaces of the first and second leads, the upper surfaces of the extending portions, the chip and the bonding wires; and a non-conductive material applied over the lower surfaces of the extending portions, with the lower surfaces of the first and second leads being exposed to outside of the non-conductive material; wherein the non-conductive material can be the same as or different from a material for making the encapsulant. The above package structure achieves desirable planarity of the lead frame or leads, and thereby prevents resin flash over exposed lead surfaces during a molding process, such that electrical connection quality and reliability of fabricated products can be assured.
Patent TW-539795-B (TW)
Title: Method and apparatus for the disinfestation of buildings and parts of buildings
Inventor: HANS HOFMEIR
IPC: A01M1/20
Filed: 2002-07-11
Granted: 2003-07-01
Abstract: It is known that to eliminate pests from buildings and parts of buildings, heating devices with blowers to generate currents of hot air can be used, by means of which the interior spaces of the building including equipment installed therein are warmed to a temperature at which harmful insects and mites die. To simplify and improve the disinfestations process, it is proposed to provide at least two air-conducting devices, which can be adjusted independently of one another and are so constructed as to be movable, so that currents of hot air can be directed towards at least two entrance regions of channels or channel systems in parts of the interior space or installed equipment, in order to generate an above-ambient pressure within the channels or channel systems. By this means it is possible more effectively and rapidly to heat up the building or parts of the building, together with the furnishings and equipment contained therein.
Patent TW-540138-B (TW)
Title: Method of fabricating contact
Inventor: CHANG PING-YI
IPC: H01L21/768
Filed: 2002-07-19
Granted: 2003-07-01
Abstract: A method of fabricating contact is provided. A dielectric layer is formed on a substrate. A cap layer is then formed on the dielectric layer, wherein the cap layer is a low dielectric constant, hydrophobic, and C species material, and the dielectric constant of the cap layer is lower than that of the dielectric layer. The cap layer and the dielectric layer are patterned to form a contact opening. A conductor layer is then deposited on the substrate to fill the contact opening. A chemical mechanical polish process is performed by using the cap layer as a stop layer.
Patent TW-556275-B (TW)
Title: Semiconductor device
Inventor: TERADA TAKASHI
IPC: H01L21/336
Filed: 2002-08-14
Granted: 2003-10-01
Abstract: A semiconductor device comprises a gate insulating film formed on a semiconductor substrate, a layer insulting film formed over the gate insulating film and provided with an opening, and a gate electrode formed on the gate insulating film in the opening of the interlayer insulating film. The gate electrode has a metal film, and a poly-Si film formed on the side surfaces of the metal film. The poly-Si film coating the side surfaces of the metal film reduces stresses that may be induced in the interlayer insulating film and the metal film.
Patent TW-I220231-B (TW)
Title: Data scanning method and system thereof
Inventor: LU WILLIAM
IPC: G06K9/00
Filed: 2002-09-04
Granted: 2004-08-11
Abstract: The invention relates to a data scanning method and system thereof, which are applied to a server. The procedures of the method comprises to define an inspection period, use a preset scanning method for scanning data stored in the server by user, proceed a data mapping procedure on the data for accumulating a user's credit information and proceed a re-adjustment procedure to reset the scanning method when the inspection period expires.
Patent TW-559892-B (TW)
Title: Lens barrel, exposure device, and method of manufacturing device
Inventor: HATASAWA MASATO
IPC: G03F7/20
Filed: 2002-09-13
Granted: 2003-11-01
Abstract: The present invention provides a lens barrel which can isolate the internal space from the atmosphere with high precision, and a highly integrated exposure device, and the method of manufacturing the exposure device with good efficiency. An annular grooves 65 are formed in the end faces 60a of a washer 60 opposed to the adjacent end faces 59a of a lens barrel unit 59, and the annular grooves 65 are connected to an exhaust device with a vacuum pump and a change over valve through exhaust holes 66 disposed in the annular grooves 65. When the exposure light passes through the insides of the lens barrel units 59, the annular grooves 65 are allowed to communicate with the vacuum pump through the change over valve, the projection airtight chamber 45 inside the projection system lens barrel 27 is isolated from the atmosphere. On the other hand, when the relative position of the lens element 44 in the projection airtight chamber 45 is adjusted, the said vacuum is vented, and the annular grooves 65 is connected to the cleaning gas supplying system through the said change over valve. The cleaning gas is supplied to the location between the end faces 60a of a washer 60 and the adjacent end faces 59a of a lens barrel unit 59.
Patent TW-559936-B (TW)
Title: Method for cleaning alignment mark and post-CMP cleaning process
Inventor: CHEN CHIH-JUNG
IPC: H01L21/304
Filed: 2002-10-14
Granted: 2003-11-01
Abstract: A method for cleaning an alignment mark is suitable for cleaning the residue materials on the alignment mark of a wafer, and comprises: removing the residue materials on a wafer by contacting the wafer with a strong acid solution or an oxygen plasma. The wafer mainly is a chip with an alignment mark adhered with residues after a chemical mechanical polishing (CMP) process.
Patent TW-559606-B (TW)
Title: Vibration-proof structure on vehicular hollow pipe
Inventor: YAMAMOTO KAZUO
IPC: B62K11/02
Filed: 2002-10-30
Granted: 2003-11-01
Abstract: A hollow pipe (27) formed by extruding of an alloy is provided on an inner surface thereof with integral ribs (31), which run in longitudinal direction of the hollow pipe (27). A vibration fuse element (30) for the restriction of the vibration of the hollow pipe (27) is inserted into the hollow pipe (27), so that its position is held in the hollow pipe (26) in a direction orthogonal for longitudinal direction by the ribs (31).
Patent TW-571254-B (TW)
Title: Method for displaying black-and-white image in colors
Inventor: SHI XIN-KE
IPC: G06T5/20
Filed: 2002-10-31
Granted: 2004-01-11
Abstract: The present invention provides a method for converting black-and-white image to color display, which comprises the steps of: block-dividing a binary black-and-white image or a binary black-and-white image with gray-level effect; performing a statistic analysis to obtain the color bit values of the black-and-white image blocks; performing a layer-dividing mapping to obtain the color bit values of the black-and-white image layers; assigning different colors to different black-and-white image layers; and comparing the black-and-white image layers with each other, and assigning the black-and-white image block with a color corresponding to the black-and-white image layer, thereby completing the color display procedure.
Patent TW-I227183-B (TW)
Title: Porous abrasive tool and method for making the same
Inventor: RAMANATH SRINIVASAN
IPC: C08J5/14
Filed: 2002-11-13
Granted: 2005-02-01
Abstract: An abrasive article including from about 40 to about 80 volume percent interconnected porosity, the article being useful as a segment for a segmented grinding wheel, and a method for fabricating the same. The method includes blending a mixture of abrasive grain, bond material and dispersoid particles, the mixture including from about 40 to about 80 volume percent dispersoid particles. In one embodiment the mixture includes from about 50 to about 80 volume percent dispersoid particles. In another embodiment the mixture includes an organic bond material and from about 40 to about 80 volume percent dispersoid particles. The powder mixture is then pressed into an abrasive laden composite and thermally processed. After cooling the composite is immersed into a solvent, which dissolves substantially all of the dispersoid particles, leaving a highly porous, bonded abrasive article.
Patent TW-I227826-B (TW)
Title: Error-tolerance design method of hardware password module
Inventor: SHIUNG TZ-JIE
IPC: G06F11/07
Filed: 2002-12-17
Granted: 2005-02-11
Abstract: The present invention provides an error-tolerance design method of hardware password module. Generally, enterprise clients use servers to store/manage their keys and certificates, and a server application program interface is used to write the related application program required by their own enterprise. Users can proceed key management and password computation by a hardware password module. Users can also select a certain password module arbitrarily to proceed the required work. Before proceeding the computation of hardware password module, the system will test the condition of each password module to determineif there is any damage, which is so-called password module test. During the testing process, the system will display the related usage condition of all password modules on the server window, and inform the damage condition of the password module to the user. However, even if part of the password module is damaged, the system can still operate normally, and the part of damaged password modules is isolated, so that the normal operation of the other password modules is not affected. The testingsystem comprises the self-testing of hardware module during booting, overall testing of system, testing during server operation, manual testing by server manager, and system error testing when the related server operates and does not operate.
Patent TW-I239794-B (TW)
Title: Plasma processing apparatus and method
Inventor: NAKANO AKIRA
IPC: H01J37/32
Filed: 2003-01-08
Granted: 2005-09-11
Abstract: The object of the present invention is to provide a plasma processing apparatus that includes current-detecting means for measuring a discharge current flowing in the gap between an electrode pair during plasma discharge, which can control the excitation power, and which can stabilize the plasma processing. To achieve the object, a plasma processing apparatus includes: an impedance matching circuit 2A placed between an RF generator and a plasma excitation electrode, magnetic probes placed symmetrically for detecting a magnetic field generated at a slit in a sidewall of the chassis, and a feedback circuit for feeding back to a high frequency power source or a matching circuit so that a current detected by a current-detecting means maintains a predetermined value.
Patent TW-I252232-B (TW)
Title: Organosilane-containing material for insulation film, method for producing the same, and semiconductor device
Inventor: HARA DAIJI
IPC: H01L21/312
Filed: 2003-01-29
Granted: 2006-04-01
Abstract: The present invention provides a material for forming an insulation film as interlayer insulation on a semiconductor device and produced by directly bonding a secondary hydrocarbonyl or tertiary hydrocarbonyl on the silicon atom of a silane, followed by a chemical vapor deposition, an insulation film formed by the material, and a semiconductor device using the insulation film. A material for forming an insulation film is produced from an organic silane with a formula (1) by a chemical vapor deposition. The material enables an organic halide reacting with a metal lithium to obtain an organic lithium where a tertiary carbon atom bonds directly with lithium; next, the resulting compound reacts with a halogenated alkoxy silane or a tetra-alkoxy silane (in which R1, R2, and R3 represent C1-C20 hydrocarbonyl, R1, R2, and R3 are capable of mutually forming a cyclic structure, R4 represents C1-C10 hydrocarbonyl or hydrogen, and n represents an integer of 1 to 3).
Patent TW-I246450-B (TW)
Title: Improved structure of head-rotatable wrench
Inventor: LIN JIAN-SHING
IPC: B25B13/46
Filed: 2003-01-28
Granted: 2006-01-01
Abstract: This invention provides an improved structure of a head-rotatable wrench, including: a driving head having a first end and a second head. The first end serves to drive fasteners. The second end is provided with pivot portion. The pivot portion includes a first section, a second section and a third section. The first section is formed with teeth. The second section includes an arcuate face that is located at a level beneath the roots of the teeth. The third section includes an arcuate face that is located at a level above dedendum of the teeth. A handgrip includes first end and second ends. The first end is provided with a retaining portion having two jaws. An opening is formed between the two jaws. The opening serves to receive the pivot portion of the second end of the driving head in a pivotal manner. The first end is axially formed with a retaining opening open towards an open edge. The retaining opening receives a steel ball and a resilient body. The second end serves to be gripped by a user. A retaining member is provided between the driving head and the handgrip. The retaining member is provided at a side thereof with teeth. The dedendum of the teeth are located at a level above left and right end faces thereof. By sliding the retaining member in the retaining portion of the handgrip, the relative pivotal relationship between the driving head and the handgrip may be selectively limited.
Patent TW-I277174-B (TW)
Title: Semiconductor device having different metal silicide portions and method for fabricating the semiconductor device
Inventor: WIECZOREK KARSTEN
IPC: H01L29/49
Filed: 2003-02-27
Granted: 2007-03-21
Abstract: A method is disclosed in which differing metal layers are sequentially deposited on silicon-containing regions so that the type and thickness of the metal layers may be adapted to specific characteristics of the underlying silicon-containing regions. Subsequently, a heat treatment is performed to convert the metals into metal silicides so as to improve the electrical conductivity of the silicon-containing regions. In this way, silicide portions may be formed that are individually adapted to specific silicon-containing regions so that device performance of individual semiconductor elements or the overall performance of a plurality of semiconductor elements may be significantly improved. Moreover, a semiconductor device is disclosed comprising at least two silicon-containing regions having formed therein differing silicide portions, wherein at least one silicide portion comprises a noble metal.
Patent TW-I226147-B (TW)
Title: Robust current loop controller applied in servo system
Inventor: TSAI CHIN-SHIONG
IPC: H02P29/00
Filed: 2003-03-03
Granted: 2005-01-01
Abstract: The present invention provides a kind of current loop controller applied in a servo system. The current loop controller contains a reference mode controller and a current controller. The reference mode controller uses one current command reference signal of the servo system to generate the first current command signal through the reference mode controller, and the first current command signal is compared with one feedback speed command signal of the servo system to generate the second current command signal. The current controller uses the second current command signal, the current command reference signal and one current feedback signal to generate one controlling signal to drive the servo system.