baber/WOPTO huggingface dataset:
Patent TW-I231357-B (TW)
Title: Method for measuring defect-distribution in silicon monocrystal ingot
Inventor: KURITA KAZUNARI
IPC: C30B15/00
Filed: 2003-10-17
Granted: 2005-04-21
Abstract: A silicon monocrystal ingot is sliced axially so as to include the central axis thereof into a measuring sample including domains [V], [Pv], [Pi], and [I]. The sample is divided symmetrically about the central axis into a first and a second samples. The surface of the first sample is contaminated with a first transition metal and the surface of the second sample is contaminated with a second transition metal different from the first transition metal. The contaminated first and second samples are heat-treated so that the first and second transition metals can be dispersed into the samples, respectively. Each recombination life-time in the whole part of the first and second samples is measured, followed by the vertical measurements of the first sample are put over those of the second sample. According to the overlapped results, a boundary between domains [Pi] and [I], and a boundary between domains [V] and [Pv] are defined, respectively.
Patent TW-I223896-B (TW)
Title: Multi-finger transistor
Inventor: CHENG JYH-NAN
IPC: H01L23/60
Filed: 2003-10-20
Granted: 2004-11-11
Abstract: A multi-finger transistor is described, including multiple parallel transistors. Each transistor includes a gate dielectric layer, a gate, a source/drain region, and a drift region in the peripheral substrate of the source/drain region separating the source/drain region and the channel region under the gate. The width of the drift region extending from the side boundary of the source/drain region increases stepwise from the edge portions of the multi-finger transistor toward the central portion of the same.
Patent TW-I234213-B (TW)
Title: Chip package structure and process for fabricating the same
Inventor: CHEN KAI-CHI
IPC: H01L21/60
Filed: 2003-10-24
Granted: 2005-06-11
Abstract: A chip package structure and process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. The process for fabricating the chip package mainly comprises steps of: (a) providing a carrier and a plurality of chips. Each of chips has an active surface respectively and a plurality of bumps is disposed on least one of the active surfaces, (b) electrically connecting the chips and the carrier, (c) forming a encapsulating material layer, which is filled between the chips and the carrier and covers the chips and the carrier. The portion of encapsulating material layer between the chips and the carrier has a first thickness and the portion of encapsulating material layer over the chips has a second thickness, the second thickness is between half and double of the first thickness.
Patent TW-I266478-B (TW)
Title: Input buffer circuit
Inventor: LEE JAE-JIN
IPC: H03K19/0175
Filed: 2003-10-29
Granted: 2006-11-11
Abstract: Disclosed in an input apparatus used in a SSTL interface, which comprises a differential buffer for comparing an external input signal with a reference potential inputted from an external, and a CMOS buffer for buffering the external input signal. In the input apparatus, the CMOS buffer operates when a command signal or an address signal is not inputted from an external, and when a predetermined operation such as a refresh operation is performed, thereby reducing the power consumption in a standby mode. Further, in order to prevent the input apparatus from abnormally operating when the reference potential is not maintained in the normal operation range, a reference potential level detecting circuit is further included in the input apparatus, so that the CMOS buffer operates when the reference potential deviates from a predetermined normal operation range. Furthermore, in order to enable an input buffer to operate as the CMOS when an input signal fully swings, a circuit for detecting a potential of an input signal inputted from an external is further included in the input apparatus.
Patent TW-I240150-B (TW)
Title: Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
Inventor: JEANS ALBERT H
IPC: G03F7/20
Filed: 2003-11-28
Granted: 2005-09-21
Abstract: An apparatus 200 for embossing a flexible substrate 101 with an optically transparent compliant media 70 is disclosed. The complaint media 70 includes an optically transparent imprint stamp 20t with an imprint pattern 20q therein. The flexible substrate 101 is coated with a photopolymer material 301. The compliant media 70 can be connected with an optically transparent belt material 81 to form an embossing belt 100 or connected with an optically transparent cylinder 69 to from an embossing drum 90. A coated side 101c of the flexible substrate 101 is urged into contact with the imprint stamp 20t and the imprint pattern 20q is embossed in the photopolymer material 301 and an ultraviolet light L passing through the compliant media 70 contemporaneously cures the photopolymer material 301 during the embossing.
Patent TW-I230260-B (TW)
Title: Battery storage checking device of portable computer device and checking method thereof
Inventor: HU SHENG-SHIUNG
IPC: G01R27/00
Filed: 2003-12-12
Granted: 2005-04-01
Abstract: The present invention relates to a battery storage detecting device used for detecting the voltage level in a portable computer device, comprising a voltage source, an analog-to-digital converter and a computing unit. The voltage source and the battery electrically connect to the two input ends of the analog-to-digital converter respectively to transform the two voltage levels into battery storage signal and baseline signal separately. The computing unit accesses the battery storage signal and the baseline signal aforementioned and computes the value of voltage level of the battery according to the proportional relationship of the two signals.
Patent TW-I261235-B (TW)
Title: Track slipping protection device and method for track jumping control of DVD-RAM drive
Inventor: LUO JEN-SHING
IPC: G11B7/085
Filed: 2003-12-16
Granted: 2006-09-01
Abstract: The present invention provides a track slipping protection device and method for track jumping control of DVD-RAM drive, which comprises a track slipping end-speed controller, a track re-jumping controller, and a track slipping detector, wherein the track slipping end-speed controller is used to provide a first control signal to the driver for controlling the track slipping end speed during track jumping of the optical pickup, the track re-jumping controller is used to provide a second control signal to the track jumping controller to make the track jumping controller control a driver to drive the optical pickup for re-jumping; and, the track slipping detector is used to receive tracking error signal outputted from a pre-amplifier so as to detect if occurring track slipping during track jumping of the optical pickup and to switch the signal input of the driver.
Patent TW-I235129-B (TW)
Title: Method of drawing and rolling scroll and containing structure thereof
Inventor: LIN CHAO-JEN
IPC: B65D3/04
Filed: 2003-12-16
Granted: 2005-07-01
Abstract: The present invention relates to a method of drawing and rolling scroll and containing structure thereof. The reelable dispenser includes a tube having a lateral opening and a cavity, a central shaft disposed inside the cavity, a set of spring for shaft with one end inserted and fixed on the central shaft while the other end is connected with the beginning end of the flexible piece for fixing it. The spring set for shaft rotates in accordance with the central shaft and can release the flexible piece through the lateral opening or furl the flexible piece back to the cavity. The spring set for shaft pushes the flexible piece outwards. An annular leafspring set for the paper roll is installed between the reel tube and the spring set for shaft for pushes against the flexible piece inwards so as to make the flexible piece curled closely. Thus the flexible piece can be released or turned back smoothly and repeatedly according to users' need.
Patent TW-I257696-B (TW)
Title: Post CMP porogen burn out process
Inventor: CHEN SHYNG-TSONG
IPC: H01L23/48
Filed: 2004-01-02
Granted: 2006-07-01
Abstract: A method and structure for forming an integrated circuit structure is disclosed that forms at least one first layer comprising logical and functional devices and forms at least one interconnection layer above the first layer. The interconnection layer is adapted to form electrical connections between the logical and functional devices. The interconnection layer is made by first forming a dielectric layer. The dielectric layer includes a first material and a second material, wherein the second material is less stable at manufacturing environmental conditions (e.g., the processing conditions discussed below) than the first material. The ""second material"" comprises a porogen and the ""first material"" comprises a matrix polymer. The invention then forms conductive features in the dielectric layer and removes (e.g., by heating) the second material from the dielectric layer to create air pockets in the interconnection layer where the second material was positioned.
Patent TW-I229613-B (TW)
Title: Dual function assembly toy
Inventor: HUANG CHONG-XIN
IPC: A63H33/00
Filed: 2004-01-16
Granted: 2005-03-21
Abstract: The invention is to provide a dual function assembly toy. After the assembly toy is completed assembly, the assembly toy can be played as a top or as a wheel.
Patent TW-I233983-B (TW)
Title: Level device
Inventor: CHEN CHIEN-JEN
IPC: G01C5/00
Filed: 2004-01-20
Granted: 2005-06-11
Abstract: The present invention provides a level device, which includes a light source and a cone-shaped reflecting element for reflecting light beams from the light source to forma level plane The light source is positioned adjacent to a peak of the reflecting element and on the center line of the reflecting element.
Patent TW-I257914-B (TW)
Title: Micro-fluid controller and method of making the same
Inventor: LEE GWO-BIN
IPC: B81B7/02
Filed: 2004-03-01
Granted: 2006-07-11
Abstract: A micro-fluid controller includes a base, a micro channel unit which is hollowly formed in the base, and an electrode unit positioned next to the micro channel unit. The micro channel unit includes a feeding channel and a control channel in communication with each other. The feeding channel includes a first section extending inwards from a side of the base, and the first section forms a first inlet end for the micro-fluid flowing on the side face. One side of the control channel communicates an inner end of the first second and extends to another side of the base to form an outlet end for the micro-fluid flowing on the other side. The electrode unit includes two electrodes that are positioned at opposing sides of the control channel of the micro-channel unit so that an electroosmosis flow field of the micro-fluid in the control channel may be varied by supplying voltages to the electrodes.
Patent TW-I224810-B (TW)
Title: A method and system for generating test pulses to test electronic elements
Inventor: CHANG SHIH-BAU
IPC: G01R31/28
Filed: 2004-03-19
Granted: 2004-12-01
Abstract: A method and system for generating test pulses to test electronic elements are disclosed. After determining a transmission clock, which is smaller than a test clock, and a serial predicted pulses, the serial data bits corresponding to the serial predicted pulses can be generated. Then the serial data bits can be transformed into a serial data stream for transmission. By transmitting the serial data stream according to the transmission clock, the serial predicted pulses corresponding to the test clock can be generated.
Patent TW-I260877-B (TW)
Title: Method and apparatus for periodic signal detection in OFDM/DMT systems
Inventor: CHEN TSUNG-LIANG
IPC: H04J11/00
Filed: 2004-04-02
Granted: 2006-08-21
Abstract: A method for detecting a periodic signal in a communication system. The method includes converting a time domain digitized signal to obtain a corresponding frequency domain digitized signal, quantizing at least two symbols of the frequency domain digitized signal to obtain quantization information, utilizing the quantization information to compute a detection metric for periodic signal detection, and determining that a periodic signal is detected if the detection metric is greater than a predetermined threshold.
Patent TW-I232571-B (TW)
Title: Wafer structure and method for forming a redistribution layer therein
Inventor: HUANG MIN-LUNG
IPC: H01L23/485
Filed: 2004-04-09
Granted: 2005-05-11
Abstract: The present invention relates to a method for forming a redistribution layer in a wafer structure comprising: (a) providing a wafer which has a plurality of conductive structures and a first passivation layer thereof, wherein the first passivation layer covers the wafer and exposes a surface of the conductive structure; (b) forming a second passivation layer over the first passivation layer; (c) selectively removing part of the second passivation layer, so that the second passivation layer having a plurality of grooves corresponding to the predetermined circuit, wherein the grooves exposes the surface of the conductive structure; (d) forming a redistribution layer in the grooves; and (e) forming a third passivation layer over the second passivation layer, whereby the redistribution layer is ""embedded"" in the second passivation layer so as to avoid the delamination of the redistribution layer.
Patent TW-I246176-B (TW)
Title: Electrostatic discharge protection apparatus for high voltage device, and the manufacturing method thereof
Inventor: GAU RUNG-JENG
IPC: H01L23/60
Filed: 2004-04-12
Granted: 2005-12-21
Abstract: The present invention provides an electrostatic discharge protection apparatus for high voltage device, and the manufacturing method thereof, which is to configure a N-type diffusion protection ring in the N-type well in the semiconductor substrate, a P-type diffusion protection ring in the P-type well, and forming a N-type buried diffusion area between the N-type well and the semiconductor substrate as the protection ring for the semiconductor substrate; thus, the present invention could prevent the latch-up effect on the electrostatic discharge protection apparatus for high voltage device under normal operation voltage, and further solve the problem in prior art of easily occurring latch-up effect under normal operation.
Patent TW-I285943-B (TW)
Title: Trench capacitor DRAM cell using buried oxide as array top oxide
Inventor: CHIDAMBARRAO DURESETI
IPC: H01L21/461
Filed: 2004-05-27
Granted: 2007-08-21
Abstract: A trench capacitor DRAM cell in an SOI wafer uses the silicon device layer in the array as part of passing wordlines, stripping the silicon device layer in the array outside the wordlines and uses the BOX layer as the array top oxide separating the passing wordlines from the substrate.
Patent TW-I234309-B (TW)
Title: Transient start and temperature adjustment apparatus of humidifying module for fuel cell
Inventor: SHIU YAU-SHENG
IPC: H01M8/04
Filed: 2004-06-28
Granted: 2005-06-11
Abstract: A transient start and temperature adjustment apparatus of humidifying module for fuel cell is disclosed in the present invention. A humidifier is connected between the air source and the air-inlet of the fuel cell set. The humidifier is used to supply the reaction gas, which is undergone with the adjustment process of appropriate humidity and temperature, to the fuel cell. The humidifier is provided with at least one heating plate. One control apparatus is used to control the heating action of the heating plate based on the predetermined parameter condition when the fuel cell set starts to operate. The control apparatus includes at least one temperature sensor for measuring the temperature condition of the humidifier and sending out a temperature signal. A micro-controller is used to receive the temperature signal generated by the temperature sensor and to control the heating plate according to the temperature signal. A storage unit of reference temperature value is used to store and provide a reference temperature signal to the micro controller. A time setting value storage unit is used to provide a time signal to the control apparatus.
Patent TW-I266626-B (TW)
Title: Steam cooker
Inventor: ANDOH YUHJI
IPC: A21B3/04
Filed: 2004-07-30
Granted: 2006-11-21
Abstract: A steam cooker, wherein a sub-cavity incorporating a steam heating heater is formed at the center of the ceiling part of a heating chamber. Steam in the heating chamber is sucked into an air blow device through a suction port and force-fed into the sub-cavity through an external circulating passage. Gas passed through the external circulation passage sucks steam from a steam generator midway in the external circulation passage and enters from the external circulation passage into the sub-cavity. The steam, heated by the steam heating heater until it is brought into a superheated state, is jetted downward from a plurality of upper gas jetting holes formed in the bottom panel of the sub-cavity by such a force that makes the steam reach the bottom of the heating chamber so that the steam can be collided with a heated matter. The steam is raised on the outside of downward airflow and the convection of steam occurs in the heating chamber.
Patent TW-I267615-B (TW)
Title: Constant temperature liquid circulating apparatus
Inventor: SAKAGUCHI TETSUO
IPC: F25D17/02
Filed: 2004-08-10
Granted: 2006-12-01
Abstract: The present invention provides a constant temperature fluid circulation device capable of reducing manufacturing cost by making the whole device compact and light as a tank can do away with a heat insulating material by maintaining temperature of constant temperature fluid kept in a tank while adjusted in temperature and adjusting fluid level by utilizing a same gap formed around the tank. An entire main tank 2 for keeping the constant temperature fluid 1 of which temperature is adjusted by a temperature adjusting means 8 is supported in a sub-tank 3 with the gap 9 as heat insulating layer around the main tank 2 and the constant temperature fluid 1 is supplied and discharged between inside of the main tank 2 and the gap 9 formed in the sub-tank 3 by a fluid level adjustment mechanism. Thus, temperature of the constant temperature fluid 1 kept in the main tank 2 is maintained and the fluid level is adjusted by utilizing the same gap 9 formed in the sub-tank 3.
Patent TW-I262228-B (TW)
Title: Grouting equipment and grouting method
Inventor: SHIMADA SHUNSUKE
IPC: E02D3/12
Filed: 2004-08-10
Granted: 2006-09-21
Abstract: The object of the present invention is to provide grouting equipment and a grouting method, which enable a large consolidated body to be formed on each injection stage by means of grout with a long gelation time even if an interval between injection holes is made long, which at least twice more rapidly progress a grouting process, which enable optimum grouting to be performed depending on ground conditions and the purpose of the grouting, and which make grouting liquids horizontally restrain one another so as to permeate in parallel, even if the interval between the grouting holes and an interval between upper and lower grouting and ejection ports are made longer. To realize the object, the solution of the present invention is that an outer pipe 7 with a plurality of outer pipe ejection ports 17 is inserted into a drilled hole 2 in ground 1; an inner pipe 10, which has an expansion/contraction packer 8 and inside which an independent grouting liquid channel 12 and an independent packer channel 13 are formed, is inserted into the outer pipe 7; the grouting liquid is injected into the ground 1 via an in-pipe space 15 and the ejection ports 17. Subsequently, after the packer 8 is contracted for the movement of a grouting stage, the packer 8 is re-expanded. The similar processes are repeated so that the grouting liquid can be injected into the ground 1.
Patent TW-I246130-B (TW)
Title: Stable package method for miniaturized transistor
Inventor: TZ JUNG-SHING
IPC: H01L21/56
Filed: 2004-08-12
Granted: 2005-12-21
Abstract: A table package method for miniaturized transistor is provided. It comprises the following steps. (A) Wafer dicing: use wafer dicer to split the chips. (B) Combining screen: let the chip face that is intended to install the package resin layer be adhered to a screen, and each through hole of the screen corresponds to each chip. (C) Forming package resin layer: let the package resin pass the through hole of the screen to coat the designated side of each chip. Each chip bottom has a package resin structure. (D) Coating adhesive material layer: install an adhesive material layer on the bottom surface of the package resin layer. (E) Pressing/bonding lead frame: adhere the chip on the lead frame by the adhesive material layer. (F) Soldering and packaging: connect the signal terminals of the selected chip with the lead of the lead frame by metal wires. Then conduct package step of the metal wires. Therefore, the stable package method for miniaturized transistor is achieved.
Patent TW-I272247-B (TW)
Title: Nano carbon manufacturing device and nano carbon manufacturing method
Inventor: AZAMI TAKESHI
IPC: C01B31/02
Filed: 2004-08-19
Granted: 2007-02-01
Abstract: The invention provides a nano carbon manufacturing device including a laser light source (111) for radiating light on the surface of a graphite rod (101) and a nano carbon collecting chamber (119) for collecting carbon vapor as nano carbon which evaporates from the graphite rod (101) by light radiation. The nano carbon manufacturing device comprises a holding roller (131) for holding and making the graphite rod (101) movable by friction force between the contact surface that contacts with the graphite rod (101) and the surface of the graphite rod (101) so as to spin and move the graphite rod (101). The holding roller (131) is driven to have the radiation positions of the surface of the graphite rod (101) cover almost the whole area of the surface of the graphite rod (101).
Patent TW-I255661-B (TW)
Title: Headset switch
Inventor: CHEN SHIAN-DA
IPC: H04R1/02
Filed: 2004-09-15
Granted: 2006-05-21
Abstract: This invention relates to a headset switch. It is particularly suitable for headset switch that is simple in structure, and convenient for operation. Further, it prevents headset from power consumption. The headset switch comprises two sounders. The sounder connects with a headband of a clip-on ear style headset. The headband has a hollow-out slot at its center. The adjusting knob is provided at the center. A spring leaf for pressing the adjust knob is built in the hollow-out slot over one side of the adjusting knob. When user slides the two sounders to clip on ears, the headband is subjected to force and is expanded. Therefore, the spring leaf in one side of the hollow-out slot is forced to squeeze the adjusting knob and activate a headset circuit. When user takes off the headset, the headband restores to its original shape. The spring leaf will be released from the pressed state of the adjust knob to disconnect the headset circuit. Eventually, it prevents unnecessary power consumption.
Patent TW-I235511-B (TW)
Title: Method of manufacturing light emitting diode package and structure of the same
Inventor: LIU JOHN
IPC: H01L33/00
Filed: 2004-11-03
Granted: 2005-07-01
Abstract: A method of manufacturing light emitting diode (LED) package is disclosed. A plurality of LED chips mount on a upper surface of a substrate. Each LED chip has a light-emitting surface. A passivation layer is formed on the upper surface of the substrate and covered the LED chips. Partial passivation layer is removed to expose the light-emitting surfaces of the LED chips and form a plurality of sidewalls surrounding the light-emitting surfaces of the LED chips. A reflecting layer is formed on the sidewalls to improve brightness of the LED packages.