baber/WOPTO huggingface dataset:
Patent TW-I368623-B (TW)
Title: Functional layers for optical uses based on polythiophenes
Inventor: ELSCHNER ANDREAS
IPC: H01L21/00
Filed: 2005-03-01
Granted: 2012-07-21
Abstract: Transparent functional layers of conductive polymers, their production and their use in optical constructions.
Patent TW-I272735-B (TW)
Title: Piezoelectric ceramic composition
Inventor: HIROSE MASAKAZU
IPC: C04B35/495
Filed: 2005-03-03
Granted: 2007-02-01
Abstract: Disclosed is a piezoelectric ceramic composition which is excellent in electrical characteristic Qmax, heat resistance and temperature characteristics of resonant frequency. This piezoelectric ceramic composition is characterized by comprising a phase mainly containing a lead zirconate titanate having a perovskite structure and an Al-containing phase. It is preferable for the main component of this piezoelectric ceramic composition to contain Mn and Pb and to have a chemical composition represented by Pbalpha[(Mn1/3Nb2/3)xTiyZrz]O3 (wherein 0.97 <= alpha <= 1.01, 0.04 <= x <= 0.16, 0.48 <= y <= 0.58, 0.32 <= z <= 0.41).
Patent TW-I274529-B (TW)
Title: Touch board with single-layer PCB structure
Inventor: LII JIA-YIH
IPC: H05K3/00
Filed: 2005-03-11
Granted: 2007-02-21
Abstract: A touch board with single-layer PCB structure is disclosed. It includes a PCB, wherein an interaction region and a component region around the interaction region are placed in the lower layer of the PCB. The interaction region includes interaction lines respectively in a first direction and in a second direction to directly connect with the component region. The unconnected interaction lines in a first direction or in a second direction in the interaction region are connected with carbon-film wires.
Patent TW-I292714-B (TW)
Inventor: AOKI HIROBUMI
IPC: A61Q19/10
Filed: 2005-03-22
Granted: 2008-01-21
Abstract: The present invention discloses a skin external preparation which contains an inositol derivative in which an inositol and a saccharide are combined. The invention aims to provide the external preparation for skin that can be spread over skin without causing grain feeling and has excellent effects of giving sufficient moist feeling and keeping the skin healthy.
Patent TW-I271422-B (TW)
Title: composition of a wide breadth silicone rubber sheet
Inventor: LIN YU-CHIH
Filed: 2005-03-25
Granted: 2007-01-21
Abstract: The composition and production method of a wide breadth silicone rubber sheet is disclosed. By using this method, no specific mold is needed for a product of special size and therefore production cost is reduced. The silicone rubber sheet of this invention contains no glass fiber. The thickness discrepancies among different production species are small.
Patent TW-I257167-B (TW)
Title: Distributed loop components
Inventor: KENNEDY JOSEPH
IPC: H03L7/081
Filed: 2005-04-11
Granted: 2006-06-21
Abstract: In some embodiments, a chip includes a chip interface to accept a delay control signal from outside the chip. The chip also includes a controllable delay line to delay an input signal responsive to the delay control signal to provide an output signal with a particular phase relationship to the input signal. Other embodiments are described and claimed.
Patent TW-I263518-B (TW)
Title: Manufacturing method for golf club head and wax pattern thereof
Inventor: HUANG CHUN-YUNG
IPC: A63B102/32
Filed: 2005-05-16
Granted: 2006-10-11
Abstract: A manufacturing method for a golf club head and wax pattern thereof comprises the following steps: pre-fabricating a first wax pattern to have a connecting portion by a first mold; positioning the first wax pattern in a first mold cavity of a second mold, the first mold cavity substantially being configured a first portion of a golf club head; injecting liquid wax into a second mold cavity of the second mold, the second mold cavity substantially being configured a second portion of the golf club head; and cooling the liquid wax in the second mold cavity to form a second wax pattern integrally connecting to the connecting portion of the first wax pattern. Thus, the first and second wax pattern integrally form a club head wax pattern for manufacturing a club head cast by precision casting process.
Patent TW-I285845-B (TW)
Title: Mounting structure of IC tag and IC chip for mounting the same
Inventor: TAKEUCHI SHUICHI
IPC: G06K19/07
Filed: 2005-05-27
Granted: 2007-08-21
Abstract: A mounting structure for an IC tag where an IC chip (10) for mounting purpose is mounted electrically connected with antenna patterns (44a, 44b). The structure facilitates assembling work where the IC chip (10) is mounted on the antenna patterns (44a, 44b), reducing production costs of the IC tag. In the IC chip (10), conductive wires (12a, 12b) are wound around an IC chip (20), with the IC chip (10) being mechanically in contact with and electrically connected to electrodes formed on the IC chip (20), so as to circle the outer surfaces between opposite sides of the IC chip (20), and the IC chip (10) is joined to the antenna patterns (44a, 44b) via the conductive wires (12a, 12b).
Patent TW-I281334-B (TW)
Title: A method of communicating with a wireless device using two air interfaces, an apparatus for use in a wireless network and a system for communicating in a wireless network
Inventor: SADOWSKY JOHN S
IPC: H04W88/10
Filed: 2005-06-17
Granted: 2007-05-11
Abstract: Methods and systems for communicating in a wireless network include usage based switching between two or more different types of air interfaces. In example implementations, a first air interface for wireless wide area networks (WWAN) may be used for low bandwidth data transfers and a second interface for wireless local area networks (WLAN) or wireless metropolitan area networks (WMAN) may be used for higher bandwidth data transfers. Various specific embodiments and variations are also disclosed.
Patent TW-I287275-B (TW)
Title: Semiconductor package without chip carrier and fabrication method thereof
Inventor: HUANG CHIEN-PING
IPC: H01L23/04
Filed: 2005-07-19
Granted: 2007-09-21
Abstract: A semiconductor package without chip carrier includes an insulating structure having an opening; a die pad layer provided in the opening; a chip adhered to the die pad layer by a thermally conductive adhesive; a plurality of electrical contacts provided around the die pad layer, wherein at least one of the electrical contacts is provided on a top surface of the insulating structure; a plurality of electrical connection members for electrically connecting the chip to the electrical contacts; and an encapsulant for encapsulating the chip, the insulating structure, the electrical connection members and the electrical contacts, wherein a bottom surface of the insulating structure, a bottom surface of the die pad layer, and bottom surfaces of the electrical contacts except the least one electrical contact provided on the top surface of the insulating structure are exposed from the encapsulant and are flush with a bottom surface of the encapsulant. The present invention also provides a fabrication method of the semiconductor package.
Patent TW-I281679-B (TW)
Title: Solid electrolytic capacitor, stacked capacitor using the same, and fabrication method thereof
Inventor: SAITO TAKESHI
IPC: H01G9/04
Filed: 2005-07-21
Granted: 2007-05-21
Abstract: On a surface-roughened aluminum foil (1), an aluminum oxide film (2) as an anodic oxide film is formed. Then, a conductive polymer layer (3) as a solid electrolyte is formed thereon and thereafter a first metal plating layer (I) (5a) is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer (II) (6a) is formed on the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film (4), to thereby form an anode portion. Third metal plating layers (III) (7) are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together by applying a conductive paste before formation of the third metal plating layers or by fusion after formation of the third metal plating layers.
Patent TW-I267600-B (TW)
Title: Transmission controller for continuously variable transmission system
Inventor: TSUKADA YOSHIAKI
IPC: F16H9/18
Filed: 2005-07-25
Granted: 2006-12-01
Abstract: A transmission controller for a continuously variable transmission system steadily returns a gear ratio toward the low-ratio range, even after a driving pulley has stopped during sudden deceleration. A control unit is provided which drives an actuator to move a driving-pulley movable half part to a position in the low-ratio range when a vehicle speed sensor detects the sudden deceleration of a body, a pulley number-of-revolution sensor detects stopping of the driving pulley, and then a gear ratio sensor detects that the gear ratio of the continuously variable transmission system has not returned to the low-ratio range where a sufficient acceleration is obtainable at the time of restart. Upon detecting a restart, the control unit presses the driving-pulley movable half part onto a V-belt to prevent sliding therebetween and thereby reduce a loss in the transmission of a driving force at the time of restart.
Patent TW-I262258-B (TW)
Title: Anti-theft fastening device includes a knob, a screw and a ferrule
Inventor: WU MING-DE
IPC: F16B5/02
Filed: 2005-08-03
Granted: 2006-09-21
Abstract: An anti-theft fastening device includes a knob, a screw and a ferrule. The screw extending through a central hole of the knob has a driving head, a fastening portion and a neck formed therebetween. The ferrule is disposed within a bottom portion of the knob. The invention is characterized in that the knob further comprises an annular flange extending from the bottom portion of the knob toward an axis of the central hole. The ferrule defines a driving hole through which the fastening portion of the screw is inserted under a rotating state, with the driving head resisting against the flange. The ferrule further includes a compressible portion inwardly extending from a top thereof to form a stopper. The stopper defines a space which is adapted to prevent the screw from being disengaged from the knob.
Patent TW-I272124-B (TW)
Title: Pyrolytic boron nitride and manufacturing method thereof
Inventor: KIMURA NOBORU
Filed: 2005-08-15
Granted: 2007-02-01
Abstract: This invention provides a durable PBN (pyrolytic boron nitride) container which is formed by laminating an electroconductive membrane on a surface of a main body formed by PBN lamination, and also a manufacturing method of the PBN container. A PBN container formed by laminating an electroconductive membrane on a surface of a main body formed by PBN lamination, is characterized in that at least a layer section of the main body and at least one wall surface contacting the layer section form an intersection angle ranging from 20 to 80 degrees. Also, a manufacturing method of a PBN container is characterized by at least laminating PBN to form a main body, and processing the main body so as to make an angle formed between a layer section of thus formed main body and at least one wall surface contacting the layer section to be 20 to 80 degrees, and further coating an electroconductive membrane on the surface of the processed main body.
Patent TW-I270109-B (TW)
Title: Semiconductor processing components and semiconductor processing utilizing same
Inventor: NARENDAR YESHWANTH
IPC: H01L21/00
Filed: 2005-08-24
Granted: 2007-01-01
Abstract: A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReAyO1.5+2y, where Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si1-aGea), 0.25 <= y <= 1.2, and 0 <= a <= 1.
Patent TW-I274248-B (TW)
Title: Portable electronic device
Inventor: LI TSUNG-HSIEN
IPC: G06F1/32
Filed: 2005-09-09
Granted: 2007-02-21
Abstract: A portable electronic device applied in a car is provided. The device includes a power switch, a vibration sensor and a controller. The power switch is for providing a first power at a first state. The power switch is for providing a second power at a second state. The first power is larger than the second power. The vibration sensor is for sensing the vibration of the car and then outputting a vibration signal. The sensor is for stopping outputting the vibration signal when the vibration sensor doesn't sense the vibration of the car. The controller is electrically connected to the vibration sensor and the power switch. The controller is for receiving the vibration signal and then enabling the power switch to provide the first power at the first state. The controller is for enabling the power switch to provide the second power at the second state when the controller doesn't receive the vibration signal.
Patent TW-I284966-B (TW)
Title: Method for wafer level package and fabricating cap structures
Inventor: SHAO SHIH-FENG
IPC: H01L23/31
Filed: 2006-01-12
Granted: 2007-08-01
Abstract: A cap wafer with a plurality of cavities and a patterned photoresist thereon is etched through parts not covered by the patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer by the surface having the cavities and is segmented around the cavities to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetical windows on the devices.
Patent TW-I277803-B (TW)
Title: Package structure of light-emitting diode and application thereof
Inventor: PAI WEI-MING
IPC: H01L33/00
Filed: 2006-01-25
Granted: 2007-04-01
Abstract: A package structure of a light-emitting diode and an application thereof are described. The package structure of the light-emitting diode comprises a carrier, two light-emitting diode chips deposed on a surface of the carrier, and an encapsulant body covering on the light-emitting diode chips. The light-emitting diode chips have different sizes to provide a light source of predetermined color temperature by the light-emitting diode chips with substantially maximum use efficiency.
Patent TW-I286022-B (TW)
Title: Automatic sorting managing method of communication data and its electronic apparatus
Inventor: LAI CHENG-SHING
IPC: G06F17/30
Filed: 2006-01-27
Granted: 2007-08-21
Abstract: The present invention is related to an automatic sorting managing method of communication data and its electronic apparatus. A storage module is disposed on an electronic apparatus. Inside the storage module, a sorting management procedure, a first communication database, and a second communication database are stored. The first communication database is used to store at least one communication data and is provided for users to search. The sorting management procedure is executed and a sorting-setting time is set. Whether there is communication data or not inside the first communication database that is not selected in the period that elapses from the sorting-setting time to the start of executing the sorting management procedure is judged; and if there is, then the un-read communication data is moved to inside of the second communication database. Thus, it is capable of directly conducting the searching step onto the commonly used communication data.
Patent TW-I308782-B (TW)
Title: Backside method and system for fabricating semiconductor components with conductive interconnects
Inventor: WOOD ALAN G
IPC: H01L23/28
Filed: 2006-05-09
Granted: 2009-04-11
Abstract: A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked semiconductor component includes multiple semiconductor components in a stacked array having bonded connections between conductive interconnects on adjacent components. An image sensor semiconductor component includes a semiconductor substrate having light detecting elements on the circuit side, and conductive interconnects on the backside.
Patent TW-I306300-B (TW)
Title: Lead-on-chip package with warpage resistance
Inventor: FAN WEN JENG
IPC: H01L23/48
Filed: 2006-09-26
Granted: 2009-02-11
Abstract: A lead-on-chip package with warpage resistance, mainly including a plurality of leads of a lead-on-chip (LOC) leadframe, a chip, a plurality of bonding wires electrically connecting the chip to the leads, at least a warpage-resistant component and a molding compound. As a "pick and place" method for chip attachment, the warpage-resistant component is attached to the lower surfaces of the leads. The molding compound encapsulates the chip, the bonding wires, inner portions of the leads, and the warpage-resistant component. Especially, the warpage-resistant component is located inside and adjacent two short sides of the molding compound. By the warpage-resistant component, the package warpage caused by curing shrinkage of the molding compound will be lessened. In one embodiment, the warpage-resistant component may be a dummy chip.
Patent TW-I404072-B (TW)
Title: Charge loss compensation methods and apparatus
Inventor: MOSCHIANO VIOLANTE
IPC: G11C29/52
Filed: 2008-08-21
Granted: 2013-08-01
Abstract: Methods and apparatus for compensating for charge loss in memories include tracking a specific block of the main memory array and determining charge loss compensation by comparing pre-cycled and post-cycled mean threshold voltages for the tracking block; or tracking each block of the main memory and determining charge loss and compensation on a block by block basis.
Patent TW-I410323-B (TW)
Title: Vacuum adsorbing control structure system, film attaching device and display device
Inventor: HIDEKI KODERA
IPC: B29C65/78
Filed: 2008-08-28
Granted: 2013-10-01
Abstract: An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a bonding head including a space defined therein, a plurality of suction holes attracting a film, the plurality of suction holes extending from a surface of the bonding head to the space defined in the bonding head, a movable piece partitioning the space into two regions, the movable piece being movable relative to the bonding head within the space in contact with the suction holes, and a connection portion connectable to a decompression source, the connection portion being provided in a first region of the two regions.
Patent TW-I408994-B (TW)
Title: Method of manufacturing organic light emitting display device
Inventor: KWON DO-HYUN
IPC: H05B33/26
Filed: 2009-03-26
Granted: 2013-09-11
Abstract: A organic light emitting display device includes a thin film transistor (TFT) having a gate electrode (230), a source electrode (250) and a drain electrode (250) which are insulated from the gate electrode (230), and a semiconductor layer (210) which is insulated from the gate electrode (230) and which contacts each of the source electrode (250) and the drain electrode (250); and a pixel electrode (310) electrically connected to one of the source electrode (250) and the drain electrode (250). The gate electrode (230) is made up of a first conductive layer (231) and a second conductive layer (232) on the first conductive layer (231), and the pixel electrode (310) is formed of the same material as the first conductive layer (231) of the gate electrode (230) and situated on the same layer (110) as the first conductive layer (231) of the gate electrode (230).
Patent TW-I410629-B (TW)
IPC: G01N3/46
Filed: 2009-03-30
Granted: 2013-10-01
Abstract: A coating elastic modulus measuring method is disclosed. The coating is formed on a surface of a flat plate. A steel ball is placed on the coating for providing a load, so that the steel ball would push against the coating to define a contact radius and the contact radius would be measured. In this invention, because the thickness of the coating itself, the Poisson's ratio, the radius of the steel ball and the loading force are all known standard parameters, the elastic modulus of the coating can be calculated by further associating with the measured contact radius. The whole calculation process does not involve with or create any experience curve, and thus the present invention can effectively overcome statistical errors of the experience curve, so as to increase calculation convenience. Further, because the hardness of the coating is less than that of the flat plate or the steel ball, the elastic modulus of the coating would have a higher accuracy without being influenced by the Poisson's ratio and the elastic modului of the flat plate and the steel ball.
Patent TW-I416707-B (TW)
Title: Memory circuits and routing of conductive layers thereof
Inventor: LIAW JHON JHY
IPC: H01L27/10
Filed: 2010-01-15
Granted: 2013-11-21
Abstract: A memory circuit includes at least one memory cell for storing a datum. The memory cell is coupled with a word line, a bit line, a bit line bar, a first voltage line, and a second voltage line. The memory circuit includes a first conductive layer, a second conductive layer coupled with the first conductive layer, a third conductive layer coupled with the second conductive layer. The third conductive layer is routed for the word line and is free from including the bit line, the bit line bar, the first voltage line, and the second voltage line within the memory cell.
Patent TW-I408949-B (TW)
Title: A video system for displaying 2d&3d images
Inventor: CHEN CHEN TAI
IPC: G02B27/22
Filed: 2010-10-11
Granted: 2013-09-11
Abstract: A video system for displaying 2D & 3D images comprises a channel control apparatus. The channel control apparatus comprises several channels, a signal processing device. The signal processing device processing the image of 2D/3D channels and formed a communication protocol, and The communication protocol consists of several different control signal. A monitor played the processing image of 2D/3D channels, and a transmit signal equipment, to transmit a communication protocol to several 3D glasses. The communication protocol can control the 3D glasses to open the flash lenses.
Patent GB-2483180-B (GB)
Title: Integrated circuit package having security feature and method of manufacturing same
Inventor: BHATE DHRUV P
IPC: B23K26/00
Filed: 2010-04-01
Granted: 2013-11-06
Abstract: An integrated circuit package comprises a package substrate (210, 410), an electrically insulating material (220, 420) adjacent to the package substrate, and a mark (230, 420) on the electrically insulating material. The mark is such that a visual contrast between the mark and the electrically insulating material is maximized when the mark and the electrically insulating material are exposed to coaxial illumination. In one embodiment the electrically insulating material over the package substrate has a first surface roughness and a mark on the solder resist material has a second surface roughness that is no more than approximately twenty times greater than the first surface roughness.
Patent GR-11140-B (GR)
Title: Λωρις εδρων επαφων (bank strip).
Filed: 1946-07-10
Abstract: ,τι αξιούται είναι:
1. Λωρίς επαφών περιλαμβάνουσα σκελετόν (πλαίσιον) εκ μονωτικής ύλης και πληθόνστελεχών ακροδεκτών κεχωνευμένων εντός του ειρημένου πλαισίου και κειμένων σταυροειδών επ' αυτού και προεκτινομένων έξω εκατέρωθεν αυτού.
Patent GR-12518-B (GR)
Title: Τελειοποιησεις εις η εν σχεσει προς ειδος δια τηνεπικαλυψιν επιφανειων.
Filed: 1949-12-16
Abstract: ίδος επικαλύψεως επιφανειών περιλαμβάνον εν γένι επίπεδον ημιάκαμπτον μέλος επικαλύψεως επιφανειών,σχετικώς παχείαν συγκολλητικήν στρώσιν επί μιας πλευράς του ρηθέντος μέλους, και δυνάμενον να απομακρυνθή σφραγίζον ή προστατευτικόν φύλλον επί της ρηθείσης συγκολητικής στρώσεως.