baber/WOPTO huggingface dataset:
Patent JP-2003223425-A (JP)
Title: Content data storage system and program
Inventor: ADACHI YOSUKE
IPC: H04N21/2747
Filed: 2002-10-08
Abstract: <P>PROBLEM TO BE SOLVED: To remotely operate a remote timer-controlled recording system to make the system program the recording of TV programs, movies, radio programs and the like in place of a user, while protecting the copyrights of existing contents data distributors, and to store and copy these contents data and copy them onto other RAMs or transmit them to other information terminals.  <P>SOLUTION: A contents data proxy storage server SV having a number of information storage devices SS1 for storing information and a number of tuners T of various configurations capable of receiving contents data distributed by a contents distributor is installed between the contents data distributor and each individual client (terminals TA and TB). The server accepts registration for recording TV programs, movies, radio programs and the like through remote control. The contents distributed by the contents data distributor are stored in the information storage devices SS1; when it is desired to use the data, the data are transmitted to the information terminals TA and TB as needed.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004134652-A (JP)
Title: Method for packaging electronic part and multilayer printed board
Inventor: OGISO HARUHIKO
IPC: H05K3/46
Filed: 2002-10-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multilayer printed board in which recyclability is enhanced.  <P>SOLUTION: When an electronic part 5 is embedded in the multilayer printed board 1 and packaged, the wiring of the part 5 is formed by bypassing one surface 5a side of the part 5. The part 5 is removed from the one surface 5a side in which the wiring of the part 5 is not formed, and the part 5 for possibly disturbing the recyclability of the board 1 can be easily removed from the board 1. Accordingly, the recyclability of the board 1 can be enhanced.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004130375-A (JP)
Title: Method and equipment for manufacturing hot-rolled steel strip
Inventor: MIYAKE MASARU
IPC: B21D1/05
Filed: 2002-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and equipment for manufacturing a hot-rolled steel strip which enable a hot-rolled steel strip having superfine ferritic structure to be manufactured.  <P>SOLUTION: By the method for manufacturing the hot-rolled steel strip, rolling is performed in the hot finish rolling of a steel strip using a finishing mill composed of a plurality of rolling stands by setting each draft at one rolling stand or two or more adjacent rolling stands including the final rolling stand of the finishing mill to be ≥ 40% and also shape straightening is applied to the hot-rolled steel strip with levelers arranged on the outlet side of each rolling stand which performs rolling with a draft of 40% or more.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003125794-A (JP)
Title: Method for preparing endotoxin-binding protein
Inventor: GRINNA LYNN S
IPC: C07K1/18
Filed: 2002-10-15
Abstract: PROBLEM TO BE SOLVED: To improve the yield of a recombinant endotoxin-binding protein such as a bactericidal/permeability-increasing protein and a lipopolysaccharide- binding protein by improving a method for isolating the endotoxin-binding protein which is secreted by transfected host cells in an appropriate cell culture medium. SOLUTION: This method comprises addition of a cation exchange material to the medium as the means of increasing the yield of the recombinant endotoxin-binding protein such as the bactericidal/permeability-increasing protein and the lipopolysaccharide-binding protein.
Patent JP-2004138390-A (JP)
Title: Oscillator support structure
Inventor: ISHIKAWA SEIJI
IPC: G01C19/56
Filed: 2002-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide oscillator support structures provided with both an oscillator made of a piezoelectric material and having oscillator-side electrodes and a support substrate having substrate-side electrodes, to stably support the oscillator on the support substrate without resonance of a bonding wire, and to electrically connect the oscillator-side electrodes to the substrate-side electrodes.  <P>SOLUTION: The support structures 20A and 20B are made of a piezoelectric material and comprises both the oscillator 7A having the oscillator-side electrodes 11A and 11B and the support substrate 10 having the substrate-side electrodes 12A and 12B. The conductive joining materials 13A and 13B join and support oscillator 7A to the support substrate 10. The oscillator-side electrodes 11A and 11B and the substrate-side electrodes 12A and 12B are electrically connected to each other by the conductive materials 13A and 13B.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004136615-A (JP)
Title: Connecting structure for barrel, and writing utensil using the connecting structure for barrel
Inventor: ONUKI SOJI
IPC: B43K21/16
Filed: 2002-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate the problems wherein although a mechanical pencil main body and a letting out device can be connected at an always fixed location, since a triangular protruding part or a notched part is exposed, a seal or a transfer printing cannot be applied to that part, and the fact becomes a restriction in designing.  <P>SOLUTION: For this connecting structure for a barrel cylinder, a rotation constraining unit which constrains a relative rotation, and a fitting part which keeps the mutual connecting state are provided. A distance between the rotation constraining unit and the fitting part is formed to be shorter than a distance between a fitting part of the other barrel and a barrel end part. At the same time, the rotation constraining unit is formed on the internal surface of the barrel.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003201232-A (JP)
Title: Molding and method for producing the same
Inventor: OZEKI YUICHI
IPC: B30B11/02
Filed: 2002-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a molding having increased recognizability of a letter and/or a figure and to provide a method for producing the same in a realistically usable form.  <P>SOLUTION: This molding comprising a central molding part and an outside molding part having a color different from that of the central molding part in which the letter and/or the figure shown by the central molding part and/or the outside molding part is recognized by difference in color of the central molding part recognized through the outside molding part is contrived. The molding comprises an upper punch composed of double structure of a central punch and an outer punch surrounding the outer periphery of the central punch. The molding has a projecting part forming the letter and/or the figure on the surface of the tip part of at least one of the upper and a lower punches or the shape of the tip part of the central punch which forms the letter and/or the figure. Both the central and the outer punches are produced by using a compression molding means to be slid and compressed.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004146445-A (JP)
Title: Method of manufacturing connector substrate
Inventor: COORAY NAWALAGE FLORENCE
IPC: H01L23/32
Filed: 2002-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connector substrate which is applicable in manufacturing an interposer equipped with a passive device formed of high dielectric material, such as BST or the like that requires a high-temperature process.  <P>SOLUTION: First of all, a capacitor 15 using BST as a dielectric material is formed on a silicon wafer 10. Then, an SiO<SB>2</SB>film 18 is formed on all the surface of the wafer 10 after a groove 10a is cut in the wafer 10. Thereafter, the groove 10a is filled with polybutane as a filling material 19a, and a resist film 20 is formed so as to protect the filling material 19a. Then, the SiO<SB>2</SB>film 18 is etched through the resist film 20 as a mask, and the SiO<SB>2</SB>film 18 is left only in the groove 10a. Thereafter, the filling material 19a inside the groove 10a is gasified by heating the wafer 10 after the resist film 20 is removed. Then, the groove 10a is filled with a conductor, and the conductor is exposed by polishing it from the backside of the wafer 10.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004141309-A (JP)
Title: Dishwasher
Inventor: INUI HIROAKI
IPC: A47L15/50
Filed: 2002-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To constitute a dish basket to correspond to individual meals and shows an excellent performance in loading dishes.  <P>SOLUTION: Each dish basket 23, 30 is divided into a plurality of regions, and a plurality of washing regions have the same configuration so that the same kind and the same number of the dishes are loaded onto each region.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004146512-A (JP)
Title: Semiconductor device and its manufacturing method
Inventor: IGARASHI KAZUHIRO
IPC: H01L23/40
Filed: 2002-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein heat dissipation of a semiconductor element can be made uniform to a surface direction of the semiconductor element, and to provide a method for manufacturing the device.  <P>SOLUTION: A metal plating layer 60 which spreads in a surface is formed on the surface 10a of a power semiconductor element 10 which surface is to be bonded with a substrate. The metal plating layer is bonded with an insulating substrate 20 by using a solder layer 30 which spreads in a surface. By interposing the metal plating layer 60 excellent in thermal conductivity between the semiconductor element 10 and the solder layer 30, heat from the semiconductor element 10 positioned above a void K can be transmitted excellently to the substrate 20, when the unexpected void k is formed in a part of the solder layer 30. As a result, heat dissipation of the semiconductor element 10 is made uniform in a surface direction.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004141752-A (JP)
Title: Humic material adsorbing agent and method of removing humic material
Inventor: MORIGUCHI TAKESHI
IPC: C02F1/28
Filed: 2002-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an adsorbing agent which can remove humic materials effectively, and a method for removing the humic materials.  <P>SOLUTION: The humic material adsorbing agent is mainly composed of a metal-supporting silicagel made by carrying one or more kinds of metals selected from among group II-metal elements and transition metal elements on silicagel. The humic material adsorbing agent and water containing humic materials are subjected to contact treatment to adsorb the humic materials by the humic material adsorbing agent, thereby removing the humic materials from the water. A humic adsorbing agent of 20 mg prepared by mixing and drying 36% FeCl<SB>3</SB>aqueous solution of 75g and spherical silicagel of 75g, and a humic acid aqueous solution (7.6 mg/l) of 10 ml are put into a container, and then the container is capped. After vigorously shaking the container, the content is filtered to obtain filtrate. The humic acid adsorption rate (%) measured from the filtrate reaches 97%.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004141910-A (JP)
Title: Lead-free solder alloy
Inventor: AMAMI MASAZUMI
IPC: H05K3/34
Filed: 2002-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having excellent impact resistance and heat cycle resistance of bumps by solving such a problem that the conventional Sn-Ag type lead-free solder has not satisfactory impact resistance and heat cycle resistance in a microscopic part of solder bump etc. with respect to the debonding of a soldered part of a mobile electronic appliance due to the shock on the falling of the electronic mobile often encountered during use or conveyance and the heat-cycling of the electronic appliance that, in use, the temperature of the soldered part is raised due to the heat generation of coils and resistors etc. inside the appliance and, in nonuse, it is cooled.  <P>SOLUTION: The lead-free solder alloy consists of Sb 0.01∼1wt.%, Ni 0.01∼0.5wt.% and remainder of Sn. Further, Ag and/or Cu is preferably added to the solder alloy and, furthermore, P, Ge, Ga and Co are preferably added thereto.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004144970-A (JP)
Title: Laminated film for display
Inventor: SASAKI NOBORU
IPC: G09F9/30
Filed: 2002-10-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laminated film for display, which film simultaneously satisfies three functions; high-level gas barrier properties, UV shieldability and electrical conductivity, required as a substrate surface for display.  <P>SOLUTION: A thin-film layer consisting of a metal oxide having the UV shieldability, a gas barrier type intermediate layer containing at least a water-soluble polymer and a thin-film layer consisting of a metal oxide having the electrical conductivity are successively laminated on at least one side of a plastic film. The metal oxide having the UV shieldability is a zinc oxide. The gas barrier type intermediate layer is a layer obtained by coating application of an aqueous solution containing the water-soluble polymer and one or more metal alkoxides or the hydrolyzates thereof or a solution mixture composed of water and alcohol.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004144630-A (JP)
Title: Organic molecule detection element and organic molecule detection apparatus
Inventor: YAGI TAKESHI
IPC: G01N27/414
Filed: 2002-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organic molecule detection element and an organic molecule detection apparatus for achieving improvement of working efficiency and miniaturization and simplification of the detection apparatus and improving detection sensitivity.  <P>SOLUTION: A pair of electrode regions 21, 22 is provide on a main face of a semiconductor substrate 11, and includes insulative films 12, 13 formed on the main face of the semiconductor substrate, a metal film 17 formed and covering a predetermined region 11a on the main face between the electrode regions through the insulative films and a fixing region 19 of an organic molecule disposed on a surface of the metal film. A current path is formed in the predetermined region 11a based on a charge of the fixed organic molecule when the organic molecule is fixed to the fixing region 19 at least.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004145093-A (JP)
Title: Method for manufacturing electro-optic panel, electro-optic panel, electro-optic device equipped with electro-optic panel, and electronic appliance
Inventor: MOMOSE YOICHI
IPC: G09F9/30
Filed: 2002-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To accurately arrange spacers on a specified position on an electro-optic panel substrate.  <P>SOLUTION: First, a surface modifier is attached to a black matrix (between pixels) formed on the electro-optic panel substrate with a liquid drop jet device (a step S101). A fluorine containing silane coupling agent is used as the surface modifier. After the surface modifier is attached to the black matrix, alcohol, which is a solvent for the surface modifier, is vaporized by heating the substrate at a specified temperature (step S102). Next, a spacer dispersion liquid is attached to the black matrix of the substrate by discharging the spacer dispersion liquid containing the spacers dispersed in a solvent for dispersing the spacers with the liquid drop jet device (step S103). Then, by vaporizing the solvent for dispersing the spacers (step 104) arrangement of the spacers 20 is completed.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004146675-A (JP)
Title: Non-linear voltage resistor porcelain composition, electronic component, and laminated chip varistor
Inventor: MATSUOKA MASARU
IPC: H01C7/10
Filed: 2002-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a non-linear voltage resistor porcelain composition allowed to be sufficiently sintered and capable of reducing electrostatic capacity even when circuit voltage is dropped and to provide an electronic component such as a laminated chip varistor using the porcelain composition.  <P>SOLUTION: In the non-linear voltage resistor porcelain composition comprising a main component containing zinc oxide, a 1st sub-component containing a rare earth element, and a 2nd sub-component containing silicon oxide; the ratio of the 2nd sub-component to 100 mol of the main component is 1 atomic %<2nd sub-component<30 atomic % in the conversion of Si.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003229602-A (JP)
Title: Light emitting element driving device and insulation transmission device
Inventor: IKEDA MASAHARU
IPC: H04B10/80
Filed: 2002-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To enable rapid follow-up to a fast input current, high speed light luminance modulation and high speed signal transmission, and realize simple and small-sized constitution, low cost and low consumption power.  <P>SOLUTION: A light emitting element driving circuit 100 is so constituted that a base of a transistor 120 for driving a light emitting diode 111 and the other end of the light emitting diode 111 are connected in parallel with a current path of a photo transistor 112 optically coupled with a photo transistor 113. The base of the transistor 120 is made an input end, and an optical output of the light emitting diode 111 is made an output end. This insulation transmission device is constituted of the driving circuit 100 and a circuit in which a collector of the photo transistor 113 is made an output end.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004150177-A (JP)
Title: Bathroom floor material and method of producing the same
Inventor: KAGEYAMA NORIHIKO
IPC: E04F15/10
Filed: 2002-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a bathroom floor material which enhances the adhesion of a hydrophilic paint to a base material and the durability of the hydrophilic paint, and fully exhibits hydrophilic property by virtue of the hydrophilic paint.  <P>SOLUTION: The bathroom floor material 10 is formed of the predetermined base material 11, a primer layer 12 formed by applying a primer paint to the base material 11, and a top coat layer 13 formed by applying the hydrophilic paint to the primer layer 12. Herein the primer paint has a hydrophilic material such as hydrophilic silica and/or a hydrophilic agent added thereto. The hydrophilic agent functions to produce a hydrophilic group such as Si-OH group on a surface of the paint, to thereby form the primer paint into a hydrophilic structure.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003234262-A (JP)
Title: Ceramic substrate for semiconductor manufacturing and for testing device
Inventor: HIRAMATSU YASUJI
IPC: H05B3/10
Filed: 2002-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a ceramic substrate for achieving the practically uniform distribution of temperature on the face of the ceramic substrate where a semiconductor wafer is treated.  <P>SOLUTION: The ceramic substrate has a conductive body on the surface or the inside thereof. The ceramic substrate that contains oxygen has a disk shape with a diameter more than 250 mm and a thickness of 25 mm or below.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004162934-A (JP)
Title: Heat exchange coil
Inventor: AKITA SHUZO
IPC: F24F13/30
Filed: 2002-11-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat exchange coil capable of easily and reliably connecting a plurality of separate coil parts to unify the parts.  <P>SOLUTION: The heat exchange coil 8 has a casing 22 for supporting a heat medium tube 21, a heat medium entry header 23, and a heat medium exit header 24. The heat exchange coil 8 is divided into a plurality of divided coil parts 25, 26, by dividing the casing 22 and the heat medium tube 21. Joint plates 27, 28 are placed in the divided coil parts 25, 26, respectively, and the open ends of the heat medium tubes 21 of the divided coil parts 25, 26 in the divided portion are inserted into thorough-holes formed on the joint plates 27, 28 and attached thereto. A packing 32 is placed between the joint plates 27, 28 of the divided coil parts 25, 26, and the joint plates 27 and 28 are jointed together by bolts and nuts 34, 35, thereby connecting the divided coil parts 25 and 26.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004164067-A (JP)
Title: Receiver
Inventor: FUJIMAKI YUTAKA
IPC: G06F13/24
Filed: 2002-11-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a receiver capable of increasing the processing efficiency of a whole system while reducing a CPU side load.  <P>SOLUTION: When a reception data number counter 16-1 measures the number of reception data corresponding to header length information stored in a header length register 16-2, a control part 16-4 is made to generate interruption through a comparator 16-6. Afterwards, it is switched by a switcher 16-5, and when the reception data number counter 16-1 measures the number of reception data corresponding to data length information stored in a data length register 16-3, the control part 16-4 is made to generate interruption through the comparator 16-6.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004160917-A (JP)
Title: Hopper for mixing synthetic resin pellet or powder
Inventor: HASEGAWA HIDEAKI
IPC: B29C31/02
Filed: 2002-11-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hopper for mixing synthetic resin pellets or powder, which is excellent in its workability and can make it possible to mix two kinds of synthetic resin pellets or powder with each other or mix synthetic resin pellets or powder with other material quantitatively with the use of a simple machine and to supply the resultant to the desired process wherein a stable molding article can be produced.  <P>SOLUTION: The hopper comprises a main hopper for supplying synthetic resin pellets or powder and a sub hopper installed with a supplying tube at the bottom site thereof, wherein the sub hopper is positioned at the upper site of the main hopper and the bottom part of the supplying tube of the sub hopper is positioned near the bottom part of the main hopper.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004160943-A (JP)
Title: Plate discharging device in printing equipment and plate discharging method of printing equipment
Inventor: WATANABE TATSURO
IPC: B41L13/16
Filed: 2002-11-15
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate the development of the variation in the amount of stored discharged plate due to the difference between the width sizes of a master and, at the same time, increase the amount of the stored discharged plate.  <P>SOLUTION: A controlling means 20 has a controlling function for controlling a stepping motor 11 through a motor driving circuit 12 so as to change the peripheral speed of a plate discharging roller based on master width size detecting signals (signals concerning either one between two kinds or a broad master 3a and a narrow master 3b) sent from a master width size detecting sensor group 23.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004172162-A (JP)
Title: Semiconductor device and method of manufacturing the same
Inventor: ITO FUMITO
IPC: H01L25/18
Filed: 2002-11-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a chip stacked semiconductor device suppressing damage on a semiconductor chip in the wire bonding process to realize high performance, reduction in size, and thinning.  <P>SOLUTION: The semiconductor device comprises a first semiconductor chip (3) mounted on a wiring substrate (1) with a flip-chip, a second semiconductor chip (4) mounted thereon with the face-up method, and a third semiconductor chip (5) which is smaller than the second semiconductor chip (4) and mounted with the face-up method on the second semiconductor chip (4) in the size larger than the external circumference of the first semiconductor chip (3). The electrodes (8, 15) on the second wiring substrate of the wiring substrate (1) and the electrodes (6, 17) on the semiconductor chip of the second semiconductor chip (4) and the third semiconductor chip (5) are connected for electrical conductivity with the metal wires (12, 14). Thereafter, the entire part on the wiring substrate (1) is protected with the sealing resin (13) and a ball (2) is mounted.  <P>COPYRIGHT: (C)2004,JPO