baber/WOPTO huggingface dataset:
Patent JP-2006305737-A (JP)
Title: Gripping member and method for manufacturing gripping member
Inventor: ITAKURA ATSUHIKO
IPC: B43K3/00
Filed: 2005-04-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gripping member which is hardly smoothly slidable to the hand and gives a less sticky and comfortable gripping feel.  <P>SOLUTION: This gripping member 10 is manufactured through the following processes: a through hole forming process to form a through hole 14 in a closed-cell foam; a shaft forcing process to force a shaft of a specified crosssectional shape and a larger diameter than the through hole 14 into the through hole 14 of the closed-cell foam and deform the inner peripheral surface of the through hole 14 of the foam in accordance with the outer peripheral shape of the shaft; an outer periphery working process to cut the outer periphery of the closed-cell foam into which the shaft is forced, to the cylindrical shape and thereby, make the outer peripheral surface of the foam a cellular section; and a shaft removing process to remove the shaft from the through hole 14 of the closed-cell foam whose outer periphery is worked by cutting.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2005317542-A (JP)
Title: Field emission element
Inventor: LEE JEONG-HEE
IPC: H01J3/02
Filed: 2005-04-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a field emission element effectively protecting emission points of CNT and therefore, capable of stably performing stable electron emission.  <P>SOLUTION: The field emission element, formed on a cathode electrode 20, provided with an electron emission matter 50 containing the CNT, and a gate electrode 40 extracting electron from the electron emission matter 50, has RuOx or PdOx51 coated for protecting CNT50a and stabilizing electron emission from the CNT50a on the field emission matter 50. With this, through coating of a stabilizing matter 51 for stabilizing an electron emission structure ad protecting an emission end on the surface of a CNT emitter 50 of the field emission element or on the surface of the CNT50a as its main component, and especially at the emission end of the same, overcurrent or abrasion of the CNT50a generated during electron emission is restrained. Therefore, life of the CNT50a is elongated through restraint of such abrasion. Such stabilization and elongation of life of the CNT greatly heightens reliability and a commercial value of the field emission element.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006306209-A (JP)
Title: Engine start method for hybrid drive unit
Inventor: KISHI DAIGO
IPC: B60W10/04
Filed: 2005-04-27
Abstract: <P>PROBLEM TO BE SOLVED: To prevent an excessive load in a transmission clutch, and to prevent a problem wherein centrifugal oil pressure is generated in the transmission clutch to make a transmission torque get unstable, when slip-engaging the transmission side clutch under a travel in an electric vehicle travelling (EV travel) mode to start an engine, in a one-motor and two-clutch type of hybrid drive unit drive-connected in series with the engine of an internal combustion engine, an engine side clutch, a motor/generator, the transmission side clutch and a transmission, in this order.  <P>SOLUTION: When starting the engine 3, a tightening capacity of the transmission side clutch 9 is controlled to transmit a torque necessary for the travel (step S2), a tightening capacity of the engine side clutch 8 is controlled to transmit a torque necessary for the start of the engine from the motor/generator 7 to the engine 3 (step S8), and a release command is output to the engine side clutch 8 to make an initial explosion torque maximum, in self-standing of the engine (step S8).  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006310500-A (JP)
Title: Wiring board, piezoelectric ceramic element and their manufacturing methods
Inventor: MATSUSHITA KODAI
IPC: H01L41/23
Filed: 2005-04-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring board which can improve the adhesiveness of a polyparaxylene protective film and is excellent in reliability.  <P>SOLUTION: The wiring board has a wiring electrode 101 on a substrate 100, and has a protective film 103 made of the polyparaxylene or its derivative to insulate an electrode front surface from an exterior on the wiring electrode 101. It has a compound layer 102 in the electrode front surface at the opposite side to the side in contact with the substrate 100 of the wiring electrode 101 provided on the substrate 100 containing a methacrylic acid derivative structure or a vinyl group structure at one end and a structure including a sulfur atom at the other ends.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006282387-A (JP)
Title: Heavy load support unit
Inventor: TOYODA EIJIRO
IPC: B66F19/00
Filed: 2005-04-01
Abstract: <P>PROBLEM TO BE SOLVED: To solve problems wherein an incompressible hydraulic device is used for a main cylinder of a load support unit of a device for moving heavy load in case of a disaster, but it is difficult to reduce the capacity of a hydraulic pump corresponding to required cylinder speed, and the weight of the hydraulic device including a hydraulic valve makes it difficult to carry the support unit by human power, and furthermore use in a difficult place of electric power supply is desired.  <P>SOLUTION: Incompressibility is demanded as a pressure medium only when the main cylinder supports load. A pneumatic-hydraulic circuit as shown in Figure 1 is constituted to use speedy pneumatic driving for the motion of the main cylinder and to carry out pressurization by automatically switching to driving of the hydraulic pump of small capacity at a point of time when supporting load. The weight of a hydraulic system can thereby be considerably reduced, and the hydraulic pump is usable in a place without power supply by pneumatic driving.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006313791-A (JP)
Title: Collective printed wiring board and soldering method
Inventor: HARIGAYA KOICHI
IPC: H05K3/00
Filed: 2005-05-06
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the occurrence of a solder bridge by providing a solder reservoir land.  <P>SOLUTION: A series of lands 5 are formed close to each other in individual substrates 2a and 3b. A land 5c at one end is provided close to a perforation 3 to an adjoining individual substrate 3b. A solder reservoir land 7 is provided close to the land 5c at one end through the perforation 3 in the adjoining individual substrate 2b.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2005228754-A (JP)
Title: Plasma display panel
Inventor: NAKANO TAKASHI
IPC: H01J11/22
Filed: 2005-05-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a plasma display panel improved in reliability.  <P>SOLUTION: The plasma display panel has: a sealing layer sealing a peripheral edge part of a glass substrate of a display face side and a glass substrate of a rear face side; and first barrier ribs zoning discharge spaces of a display area between the display face side glass substrate and the rear face side glass substrate. The panel is also provided with second barrier ribs in contact with the display face side glass substrate and the rear face side glass substrate at a non-display area at an inner periphery side of the sealing layer at an outer periphery side of the display face side glass substrate, and space parts communicating with the discharge areas between the second barrier ribs and the sealing layer, and between the second barrier ribs and the display area.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006313831-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: SATO SHINGO
IPC: H01L21/301
Filed: 2005-05-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a high reliability semiconductor device.  <P>SOLUTION: The method comprises a step of forming trenches 26 in a first surface 24 of a semiconductor substrate 2 having a plurality of integrated circuit elements 10 without overlapping with the plurality of integrated circuit elements 10, pasting a holder 32 onto the first surface 24 of the substrate 2, and cutting the semiconductor substrate 2 by a blade 30 so that the blade 30 pierces trenches 26 from a second surface 38 opposite to the first surface 24 but not reaches the first surface 24 without touching the holder 32.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006311960-A (JP)
Title: Game machine
Inventor: KOIWA TATSUAKI
IPC: A63F7/02
Filed: 2005-05-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a game machine for facilitating an inspection work in manufacturing concerning the game machine having an operation means for performance.  <P>SOLUTION: When power is supplied in a pachinko game machine, the start of a main control board is delayed for a delay time T3 from the start of an integrated control board. Then an operation valid period T7 for validating the operation of a performance switch 25 is set till the main control board 27 is started (initial setting is terminated) from the start of the integrated control board 28 (the initial setting is terminated). When the performance switch 25 is operated during the operation valid period T7, The operation of the performance switch 25 is notified by turning on a game board lamp 17.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006317590-A (JP)
Title: Splicing loss reduction processing method, optical fiber splicing method, and heat treatment apparatus for splicing loss reduction
Inventor: YOSHIDA TAKESHI
IPC: G02B6/02
Filed: 2005-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a splicing method for different kinds of optical fibers by which variation is suppressed and splicing loss is reduced when the splicing loss is reduced by making the mode filed diameters of both optical fibers closer or coincident by a heating process when splicing the optical fibers having different mode field diameters.  <P>SOLUTION: The splicing loss reduction processing method is characterized in that the position of the fused and spliced part of the optical fibers is confirmed with a camera when the optical fibers having different field mode diameters are fused and spliced, then a heating source is moved to the position of the fused and spliced position confirmed with the camera, light is made incident from one side of the optical fibers, the power of transmitted light is measured at the other side to monitor the splicing loss of the fused and spliced part, the fused and spliced part is heated with the heat source, and the splicing loss is reduced to a set value by making the mode field diameters of both optical fibers closer or coincident.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006285168-A (JP)
Title: Image forming method
Inventor: MIURA MASAHARU
IPC: G03G21/10
Filed: 2005-05-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming method capable of supporting a long service life, a high image quality and a low running cost, by maintaining a stable cleaning performance over a prolonged period without causing an image deletion phenomenon on a photoreceptor of high durability (high strength and high abrasion resistance).  <P>SOLUTION: The invention provides an image forming method for an image bearing member having a universal surface hardness HU (N/mm<SP>2</SP>) of 150 to 220 and an elastic deformation ratio We (%) of 40 to 65, and for a crossing angle θ (°) between the rotary axes of, respectively, the contact charging roller and the image bearing member, for a ratio A (mass%) of transfer residual toner to abrasive particles and for a contact pressure B (g/cm) of a cleaning blade, parameters HU, We, A, B and θ satisfying the following number relations (I), (II) and (III): (1/6000)×HU×We≤A×B, A/B≤θ, and 10≤B≤50.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006318287-A (JP)
Title: Multimodal control device and method for controlling multimodal
Inventor: SASAKI KAZUO
IPC: G06F15/00
Filed: 2005-05-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multimodal control device and a multimodal controlling method capable of realizing synchronization with fine grain size by using an existing browser while utilizing the obviousness of a GUI.  <P>SOLUTION: The multimodal control device is provided with an input focus management means for managing an input focus item in document data, a contents generation means for generating contents in a data input item range including the input focus item from document data in accordance with the sort of modality and a contents transmission means for transmitting the generated contents to a corresponding browser.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006322136-A (JP)
Title: Foaming synthetic resin embedded body used for hollow concrete slab construction method
Inventor: SUZUKI OSAMU
IPC: E04B5/32
Filed: 2005-05-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a foaming synthetic resin embedded body without leaving a foaming trace on a concrete slab surface.  <P>SOLUTION: This foaming synthetic resin embedded body is used for a hollow concrete slab construction method for forming a hollow concrete slab by placing concrete from above its embedded body, by positioning the foaming synthetic resin embedded body between upper side bar arrangement and lower side bar arrangement for joining main reinforcements in a grating shape. A synthetic resin layer 2 having airtightness is formed in an upper part of the foaming synthetic resin embedded body 1.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006320785-A (JP)
Title: Method for manufacturing multilayer-coated metallic sheet
Inventor: FURUKAWA HIROYASU
IPC: C23C26/00
Filed: 2005-05-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer-coated metallic sheet, in which uncured multilayer coating films can be prevented from being mixed with one another and the interlayer movement of a reactive substance such as a monomer of a resin can also be prevented when uncured multilayer coating films are dried simultaneously.  <P>SOLUTION: This method for manufacturing the multilayer-coated metallic sheet comprises: a multilayer-coating step of coating at lest one surface of a metallic sheet successively or simultaneously with a surface layer coating film and a lower layer coating film containing an ultraviolet curing resin in wet states; an ultraviolet irradiation step of irradiating the lower layer coating film with ultraviolet rays through the surface layer coating film; and a drying step of drying the surface layer coating film and the lower layer coating film simultaneously.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006320812-A (JP)
Title: Disintegrator
Inventor: SUGA MASANOBU
IPC: B02C18/14
Filed: 2005-05-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a disintegrator of which the crushing blade is easily replaced.  <P>SOLUTION: The disintegrator 1 is provided with a first disintegrating unit 8 and a second disintegrating unit 9 which is replaceably installed to the disintegrator main body. The first disintegrating unit 8 is provided with a casing 11, bearings 14a, 14b mounted on the casing 11, a rotary shaft 12 supported by the bearings 14a, 14 b and a rotation blade 13 fitted to the rotary shaft 12. The casing 11 is detachably fixed to the base part 7 with a bolt 62. The rotary shaft 12 is detachably connected to a motor shaft 74 of the device itself with a chain coupling 80. The first disintegrating unit 8 is integrally removed.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006325008-A (JP)
Title: Image pickup device
Inventor: ISHII RITSUKO
IPC: G06F3/0481
Filed: 2005-05-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image pickup device with an icon generation function and to allow processing contents to be easily confirmed by displaying an icon when executing prescribed processing.  <P>SOLUTION: An image pickup device 1 stores processing contents for which icons should be generated, and a device program 20 defining display forms etc. of icons, in a first mounted memory and stores image data of generated icons 22 in an empty area of a second mounted memory 18 wherein management information in the time of recording a picked-up image onto an optical disk D is recorded for backup. Each generated icon 22 is associated with some processing which the image pickup device 1 executes. When processing is executed, an icon associated with this processing is displayed on a display panel 8, and a display form of the icon is changed in accordance with an execution condition of the processing.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006322256-A (JP)
Title: Calculation method of extraction resistance force of pile with node using bearing force and shearing force acting on inclined face of expanded diameter part, calculation method of pushing-in resistance force, design method of pile with node and pile with node
Inventor: SEKI TAKAO
IPC: E02D5/22
Filed: 2005-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a further highly accurate calculation method of the extraction resistance force of a expanded diameter part for reducing cost and securing safety.  <P>SOLUTION: This method calculates the extraction resistance force of the pile 1 with a node having the expanded diameter parts 3 and 4 including an upper side inclined face 8 inclined so that a diameter becomes large toward the lower side; and calculates a limit extraction resistance force shared by the upper side inclined face 8 on the basis of the sum of a downward component in the vertical direction of the limit shearing resistance force acting on the upper side inclined face 8 and a downward component in the vertical direction of the limit bearing force acting on the upper side inclined face 8.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006332096-A (JP)
Title: Semiconductor device
Inventor: KITAHARA TAKASHI
IPC: H01L21/60
Filed: 2005-05-23
Abstract: <P>PROBLEM TO BE SOLVED: To enhance the flexibility in packaging layout on a packaging substrate, in a semiconductor device having a chip mounted on the packaging substrate through wire bonding.  <P>SOLUTION: On the major surface of a chip 14, two arrays of bonding pads 15A located relatively on the outer circumferential side of the chip 14 and an array of bonding pads 15B located relatively on the central side of the chip 14 are arranged along the outer circumference of the chip 14, wherein these bonding pads 15A and 15B are staggered in the direction along the outer circumference of the chip 14. On a wiring board 11, an array of bonding pads 16A located relatively close to the outer circumference of the chip 14 and two arrays of bonding pads 16B located relatively remote from the outer circumference of the chip 14 are arranged along one side and on the opposite side of the outer circumference of the chip 14 wherein these bonding pads 16A and 16B are made to stagger in the direction along the outer circumference of the chip 14.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006331538-A (JP)
Title: Magnetic recording medium
Inventor: HINOUE TATSUYA
IPC: G11B5/66
Filed: 2005-05-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an in-plane magnetic recording medium having a high medium S/N ratio, having no problem in overwriting characteristics, having an excellent bit error rate, and sufficient stability to thermal fluctuation.  <P>SOLUTION: The magnetic recording medium has a substrate 10, an underlayer formed at the upper part of the substrate, a magnetic film wherein a first magnetic layer 14, a second magnetic layer 15, a third magnetic layer 16, a non-magnetic intermediate layer 17 and a fourth magnetic layer 18 which are laminated at the upper part of the underlayer, and a protective layer 19 formed at the upper part of the magnetic film. Each magnetic layer of the magnetic film is a cobalt based alloy containing chromium, the first magnetic layer 14 has the minimum thickness among the plurality of magnetic layers, the second, the third and the fourth magnetic layers further contain platinum and boron, the second magnetic layer has a Brt (a product of residual magnetization Br and film thickness t) smaller than that of the third magnetic layer, the third magnetic layer has a Brt smaller than that of the fourth magnetic layer and the Brt of the fourth magnetic layer has 40 to 55% occupation rate in the Brt of the total magnetic layers.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006326649-A (JP)
Title: Electrode for resistance welding
Inventor: NISHIKI KOICHI
IPC: B23K11/30
Filed: 2005-05-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrode for resistance welding with which the defect in working caused by sparks can be reduced.  <P>SOLUTION: Regarding the electrodes 100 (110, 120) for resistance welding with which, under a state where a plurality of members 201, 202 are contacted, electric current is fed, so as to perform welding, holding faces 111a, 112a for holding at least one 201 in the plurality of members 201, 202 are provided, and a shape where the whole faces of the holding faces 111a, 112a are compactly allowed to abut against the member 201 to be held is made. For preventing the slippage of welding position, though at least one 201 in the plurality of members 201, 202 is held by the electrode 100 (110) for resistance welding, there is no gap between the whole faces of the holding faces 11a, 112a in the electrode 110 for resistance welding and the member 201 to be held. Further, the contact area (current path) between the holding faces 111a, 112a and the member 201 to be held is more increased than the conventional case. Thus, the defect in working caused by sparks can be reduced.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006333156-A (JP)
Title: Electronic camera, zoom area displaying method, and program
Inventor: SHIBUYA ATSUSHI
IPC: H04N101/00
Filed: 2005-05-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic camera, a zoom area displaying method and a program capable of preventing the deterioration of image quality during photographing by enabling a user to previously recognize a zoom area where the image quality deteriorates.  <P>SOLUTION: The zoom area 50 is constituted of a zoom area in which image quality deterioration by a zooming operation does not occur, that is, a zoom area 51 in which the number of pixels outputted from an imaging part does not deteriorate more than a selected recording size by a digital zooming operation, and a deteriorating area 52 in which the number of pixels outputted from the imaging part is not larger than the selected recording size to cause deterioration. In addition, in the zoom area 52 that does not deteriorate, an optical zoom area 56 in which a zooming operation is performed by an optical zooming operation and a digital zoom area 57 in which a zooming operation is performed by digital zooming and which does not deteriorate are set. Thus, it is possible to obtain an image whose image quality does not deteriorate by the zooming operation.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006328492-A (JP)
Title: Damping sintered alloy
Inventor: TOKUNO MAKOTO
IPC: C22C1/05
Filed: 2005-05-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an aluminum sintered alloy having excellent damping performance.  <P>SOLUTION: The damping sintered alloy is characterized in that graphite grains are dispersed into an Al based matrix comprising Cu, Mg and Si.  <P>COPYRIGHT: (C)2007,JPO&INPIT