Patent SG-11201810919U-A (SG)
Title: Engineered substrate structure for power and rf applications
Inventor: ODNOBLYUDOV VLADIMIR
IPC: H01L21/30
Filed: 2017-06-13
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 21 December 2017 (21.12.2017) WIPO I PCT IiiimmolioloiollmolommiololimiolimomovoimIE (10) International Publication Number WO 2017/218536 Al (51) International Patent Classification: C3OB 25/14 (2006.01) H01L 29/16 (2006.01) H01L 21/30 (2006.01) H01L 29/20 (2006.01) H01L 21/8234 (2006.01) H01L 29/267 (2006.01) (21) International Application Number: PCT/US2017/037252 (22) International Filing Date: 13 June 2017 (13.06.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/350,084 14 June 2016 (14.06.2016) US 62/350,077 14 June 2016 (14.06.2016) US (71) Applicant: QUORA TECHNOLOGY, INC. [US/US]; 2306 Walsh Avenue, Santa Clara, California 95051 (US). (72) Inventors: ODNOBLYUDOV, Vladimir; c/o Quora Technology, Inc., 2306 Walsh Avenue, Santa Clara, Cali- fornia 95032 (US). BASCERI, Cem; c/o Quora Technolo- gy, Inc., 2306 Walsh Avenue, Santa Clara, California 95051 (US). FARRENS, Shari; c/o Quora Technology, Inc., 2306 Walsh Avenue, Santa Clara, California 95051 (US). (74) Agent: LIU, Rong et al.; KILPATRICK TOWNSEND & STOCKTON LLP, Mailstop: IP Docketing-22, 1100 Peachtree Street, Suite 2800, Atlanta, Georgia 30309 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: ENGINEERED SUBSTRATE STRUCTURE FOR POWER AND RF APPLICATIONS 100 122 120 cc N O C FIG. (57) : A substrate includes a support structure comprising: a polycrystalline ceramic core; a first adhesion layer coupled to the polycrystalline ceramic core; a conductive layer coupled to the first adhesion layer; a second adhesion layer coupled to the conductive layer; and a barrier layer coupled to the second adhesion layer. The substrate also includes a silicon oxide layer coupled to the support structure, a substantially single crystalline silicon layer coupled to the silicon oxide layer, and an epitaxial III-V layer coupled to the substantially single crystalline silicon layer. [Continued on next page] WO 2017/218536 Al MIDEDIMOMOIDEIRMEM00111HEINIERVOIMIE (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))