baber/WOPTO huggingface dataset:
Patent TW-201523401-A (TW)
Title: Touch panel and manufacturing method
Inventor: CHEN WEI-CHUAN
IPC: G06F3/044
Filed: 2013-12-12
Abstract: Disclosed is a touch panel including a first flexible transparent substrate, an upper sensing structure and a lower sensing structure. The upper sensing structure is disposed at the first flexible transparent substrate and has a plurality of upper transparent sensing patterns and a plurality of upper peripheral circuits electrically coupled to the plurality of upper transparent sensing patterns respectively, and the upper transparent sensing patterns are arranged adjacent to one another, and the surface of the upper transparent sensing patterns has a plurality of upper metal grids, and the upper transparent sensing patterns and the upper metal grids are extended in a first direction. The lower sensing structure is disposed at the first flexible transparent substrate and has a plurality of lower transparent sensing patterns and a plurality of lower peripheral circuits electrically coupled to the plurality of lower transparent sensing pattern respectively, and the lower transparent sensing patterns are arranged adjacent to one another, and the surface of the lower transparent sensing patterns has a plurality of lower metal grids, and the lower transparent sensing patterns and the lower metal grids are extended in a second direction, and the second direction is intersected with the first second direction.
Patent TW-201435101-A (TW)
Title: Copper alloy for electronic/electric device, plate formed by the same, conductive component for electronic/electric device, and terminal
Inventor: MAKI KAZUNARI
IPC: C22C9/04
Filed: 2013-12-26
Abstract: The present invention relates to a copper alloy for electronic/electric device, a plate formed by the same, a conductive component for electronic/electric device, and a terminal. The alloy comprises more than 2.0 mass% and less than 23.0 mass% of Zn, 0.10 to 0.90 mass% of Sn, 0.05 mass% or more and less than 1.00 mass% of Ni, 0.001 mass% or more and less than 0.100 mass% of Fe, 0.005 to 0.100 mass% of P, and the balance Cu and inevitable impurities. In the alloy, 0.002 ≤ Fe/Ni < 1.500, 3.0 < (Ni+Fe)/P < 100.0, and 0.10 < Sn/(Ni+Fe) < 5.0 are satisfied in the atomic ratio. In the alloy, H content is equal to or less than 10 massppm, O content is equal to or less than 100 massppm, S content is equal to or less than 50 massppm, and C content is equal to or less than 10 massppm.
Patent TW-201440598-A (TW)
Title: Masking substrates for application of protective coatings
Inventor: ASTLE DAVID JAMES
IPC: H05K3/28
Filed: 2014-01-08
Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.
Patent TW-201502253-A (TW)
Title: Liquid crystal display device
Inventor: KURIYAMA TAKESHI
IPC: G02F1/1335
Filed: 2014-01-15
Abstract: The present invention relates to a liquid crystal display device using a specific liquid crystal composition and having a color filter of a specific inclination parameter representing the agglomeration degree of organic dye. This invention provides a liquid crystal display device preventing poor display problems such as hollowness, non-uniform orientation and after-image caused by the lowered voltage holding rate (VHR) of liquid crystal layer and the increased ion density (ID). The liquid crystal display device of this invention is characterized by preventing reduction of voltage holding rate (VHR) of liquid crystal layer and the increase of ion density (ID) and inhibiting the generation of poor display such as after-image, thereby making this invention particularly useful for IPS mode and FFS mode liquid crystal display devices with active matrix drive, and applicable to liquid crystal display devices such as liquid crystal TV, monitors, mobile phones, and smart phones.
Patent TW-201440466-A (TW)
Title: Switching communication devices between different communication media
Inventor: KATAR SRINIVAS
IPC: B60L11/18
Filed: 2014-01-23
Abstract: A service provider device of a local communication network communicates a first frame with an electric vehicle via a first communication medium to associate with the electric vehicle, establish a communication link with the electric vehicle, and to add the electric vehicle to the local communication network. After an association process between the electric vehicle and the service provider device is successfully completed, the electric vehicle and/or the service provider device can execute operations that extend the utility of their respective communication devices by switching to a new communication medium. By switching to the new communication medium, the electric vehicle and/or the service provider device can connect to a remote communication network. The service provider device communicates a second frame with at least a network device of the remote communication network via the new communication medium.
Patent TW-201448060-A (TW)
Title: Method for manufacturing semiconductor device
Inventor: ISHIZAKA TSUYOSHI
IPC: H01L21/56
Filed: 2014-02-07
Abstract: In the present invention, a method for manufacturing a semiconductor device comprises a step A, a step B, a step C, and a step D. In step A, a laminate having a metal layer, a thermosetting insulating resin layer, a lead frame and a semiconductor chip laminated in the stated order is prepared. In step B, a thermoset resin sheet is arranged on a surface on which the semiconductor chip of the laminate appears. In step C, the semiconductor chip is implanted at least in the thermosetting resin sheet. In step D, the insulating resin layer and the thermosetting resin sheet are thermally cured.
Patent TW-201436821-A (TW)
Title: Method for preparing Panax quinque folium L. wall-breaking dosage form
Inventor: Cheng jin-le
IPC: A61K125/00
Filed: 2014-03-19
Abstract: The present invention relates to a method for preparing Chinese medicine dosage form and relates specifically to a Panax quinque folium L. wall-breaking dosage form. The present invention pulverizes Panax quinque folium L. into wall-broken powder, which is subjected to an alcohol-water wetting process to form granulation through quality control of alcohol solution and the wall-broken powder and is also subjected to extrusion forming under a predetermined rotational speed and then dried. The granulation rate of the present inventive process is high and the Panax quinque folium L. wall-breaking dosage form so manufactured has an increased bioavailability and the doesage form has improved stability and good disintegrability. The method comprises the following steps: (1) performing ultrafine wall-breaking pulverization to Panax quinque folium L. to obtain ultrafine wall-broken powder; (2) mixing alcohol-water solution and the ultrafine wall-broken powder at a weight ratio of 0.3-0.8:1 to form a soft material; and (3) extruding to form wet granules, which is then dried to form the dosage form.
Patent TW-201538377-A (TW)
Title: Heat dissipative seat cushion device
Inventor: Zhang shi-ying
IPC: B62J1/18
Filed: 2014-04-01
Abstract: The present invention provides a heat dissipative seat cushion device, which comprises a cover body, a foamed metal layer, and a plurality of heat dissipation fins. The cover comprises a first recess and the foamed metal layer comprises a second recess formed therein to correspond to the first recess. The cover is connected by means of the first recess and the second recess so as to cover on the foamed metal layer. The heat dissipation fins are connected to a bottom of the foamed metal layer. The foamed metal layer and the heat dissipation fins comprise a plurality of air bubbles therein. In addition to the air bubbles, the heat dissipation fins further comprise a plurality of air channels formed on surfaces thereof such that the structural arrangement helps enlarge the contact area between air and the heat dissipative seat cushion device and also improves air permeability of the heat dissipative seat cushion thereby to improve the heat dissipation performance and conformableness of the seat cushion device.
Patent TW-201539813-A (TW)
Title: Sensing device
Inventor: KUO CHIH-CHE
IPC: H01L43/06
Filed: 2014-04-01
Abstract: A sensing device is provided. The sensing device includes a semiconductor layer, a first electrode and a second electrode, a first detection electrode and a second detection electrode, and at least one conductive pattern. The first electrodes and the second electrodes are disposed at opposite ends of the semiconductor layer. The first detection electrode and the second detection electrode are disposed at the other opposite ends of the semiconductor layer, wherein a virtual connection line is between the first detection electrode and the second detection electrode. The at least one conductive pattern is disposed on the semiconductor layer, wherein the conductive pattern does not overlap with the virtual connection line.
Patent TW-201500458-A (TW)
Title: Polyamide resin composition and molded body using same
Inventor: SATO KAZUYA
IPC: B29K77/00
Filed: 2014-04-08
Abstract: The present invention provides a polyamide resin composition containing: a polyamide resin (A) in which the diamine structural units include a structural unit derived from xylylenediamine (a-1) and the dicarboxylic acid structural units include a structural unit derived from an α,ω-linear aliphatic dicarboxylic acid (a-2) with a carbon number of 4 to 20, and a polyether polyamide (B) in which the diamine structural units include structural units derived from a polyether diamine compound (b-1) represented by a specific structural formula and xylylenediamine (b-2), and the dicarboxylic acid structural units include a structural unit derived from an α,ω-linear aliphatic dicarboxylic acid (b-3) with a carbon number of 4 to 20.
Patent TW-201503766-A (TW)
Title: Self-cleaning radio frequency plasma source
Inventor: BASSOM NEIL J
IPC: H05H1/46
Filed: 2014-04-29
Abstract: A self-cleaning radio frequency (RF) plasma source for a semiconductor manufacturing process is described. Various examples provide an RF plasma source comprising an RF antenna and a rotatable dielectric sleeve disposed around the RF antenna. The dielectric is positioned between a process chamber and cleaning chamber such that portions of the surface of the dielectric may be exposed to either the process chamber or the cleaning chamber. As material is deposited on the outer surface of the dielectric in the process chamber, the dielectric sleeve is rotated so that the portion containing the buildup is exposed to the cleaning chamber. A sputtering process in the cleaning chamber removes the buildup from the surface of the sleeve. The dielectric sleeve is then rotated so that it exposed to the process chamber. Other embodiments are disclosed and claimed.
Patent TW-201438050-A (TW)
Title: Secure lock for a low voltage switch
Inventor: CHU YEN-SEN
IPC: H01H73/02
Filed: 2014-04-29
Abstract: A secure lock for a low voltage switch is provided, for assembling to the low-voltage switch. The low-voltage switch includes a body and a switching member which is disposed on the body and operable from outside to switch an internal circuit in the body. The body is formed with a clamping portion on the outside of the body. The secure lock includes a main body, a transmission assembly, a driving member and a rotating member. The main body includes an abutting wall and a stopping portion for preventing the switching member from being switched. The transmission assembly is pivotally disposed on the main body. The driving member is unrotatably connected with one end of the transmission assembly. The driving member is able to drive the transmission assembly to rotate. The rotating member is fixed to the other end of the transmission assembly and rotatable around an axis. A circumferential direction is defined relative to the axis. The rotating member includes a circumferential wall facing the abutting wall. The circumferential wall includes a plurality of different radial distances along the circumferential direction relative to the axis. The abutting wall and the circumferential wall are for clamping the clamping portion.
Patent TW-201519336-A (TW)
Title: Semiconductor package and method for manufacturing the same
Inventor: BAE JIN-HO
IPC: H01L21/58
Filed: 2014-04-30
Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.
Patent TW-201443076-A (TW)
Title: Recombinant bacteria recognizing protein and uses thereof
Inventor: CHANG MARGARET DAH-TSYR
IPC: G01N33/68
Filed: 2014-05-14
Abstract: The present invention relates to a recombinant protein comprising SEQ ID NO: 1 and a bacteria recognizing lectin. The present invention also relates to uses of the recombinant protein comprising detecting pathogens, removing endotoxins, determining the presence of an endotoxin or endotoxin-like material, and determining the presence of pathogen-associated molecular pattern (PAMP) comprising rhamnose-rhamnose (Rha-Rha), rhamnose-N-acetyl-mannosamine (Rha-ManNAc), N-acetyl-mannosamine-rhamnose (ManNAc-Rha), rhamnose-galatose (Rha-Gal), or galatose-rhamnose (Gal-Rha) in a sample, and use as a medicament, a disinfectant, a decontaminant, a surfactant or a diagnostic means.
Patent TW-201544059-A (TW)
Title: Deep frying device and residue discharging method for deep frying device
Inventor: TAKA KAZUO
IPC: A47J37/12
Filed: 2014-05-22
Abstract: The present invention provides a deep frying device and a residue discharging method for the deep frying device. An out-guiding port is formed at one side wall of the cooking tank and located above the water level of the cooking tank. An out-guiding pipe is erected at the outside of one side wall of the cooking tank with the lower end thereof communicated with the out-guiding port. The upper end of the out-guiding pipe is connected to a descending pipe. By discharging water from the water-discharging port located below the out-guiding port and/or from the water-discharging port located at the side wall opposite to the out-guiding port, water is flowed to guide the floating deep-fried residues at the interface between the water layer and the oil layer to the out-guiding port to make them automatically discharge from the descending pipe.
Patent TW-201521227-A (TW)
Title: High-efficiency AlGaInP light-emitting diode grown directly on transparent substrate and manufacturing method thereof
Inventor: LEE HYUNG-JOO
IPC: H01L33/12
Filed: 2014-05-23
Abstract: The present invention relates to a high-efficiency AlGaInP light-emitting diode directly grown on a transparent substrate and a method of manufacturing the same, and, more particularly, to a high-efficiency AlGaInP light-emitting diode grown on a sapphire substrate and a method of manufacturing the same. According to the present invention, an AlGaInP light-emitting diode is manufactured using an inexpensive sapphire substrate having high transmittance to ultraviolet rays, infrared rays and visible rays. The AlGaInP light-emitting diode according to the present invention can emit light with high efficiency because a lower substrate does not absorb light, and can be effectively manufactured because a process of removing a GaAs or a process of bonding a sapphire substrate is not conducted.
Patent TW-201600186-A (TW)
Title: A resourced processing system of waste of metalliferous PCB
Inventor: SHIH PAI-HAUNG
IPC: B09B3/00
Filed: 2014-06-27
Abstract: A resourced processing system of waste of metalliferous PCB comprises a collecting step, a shattering step, a magnetic separating step, a grinding step and a sorting step. The waste is gathered and shattered into granules by the collecting and shattering steps. The magnetic separating step is executed for separating the magnetic granules from the nonmagnetic granules. The nonmagnetic granules are ground into powder and sieved with respect to specific weight itself for dividing metal cuttings, for example, cooper, and glassfiber resin powder. Whereby the metal cuttings and the glassfiber resin powder can offer for following uses and resources are saved effectively. Besides, a modified step can be executed on the glassfiber resin powder continually by adding an addictive therein and mixing, thereby making the glassfiber resin powder to be formed into tiny granules and dissolving the cooper material dissolved by the glassfiber resin powder. Accordingly, the glassfiber resin powder can be applied widely.
Patent TW-201519125-A (TW)
Title: Method for improving safety of electronic payment and system thereof
Inventor: LI WEI
IPC: G06F21/31
Filed: 2014-07-03
Abstract: A method for improving the safety of electronic payment comprises the steps of: monitoring whether application programs for the electronic payment in a terminal system start running; checking whether the keywords of other running programs in the terminal system exist in a predetermined non-essential program list when the application programs for the electronic payment starting to run is monitored; and closing the keywords existing in the non-essential program list and other running programs. More, the present invention provides a system for improving the safety of electronic payment. Therefore, aforesaid method for improving the safety of electronic payment and system are capable of improving the safety of electronic payment.
Patent TW-201515136-A (TW)
Title: Device and method for bonding substrates
Inventor: WIMPLINGER MARKUS
IPC: H01L21/67
Filed: 2014-07-15
Abstract: The invention relates to a device as well as a corresponding method for producing an electrically conductive direct bond between a bonding side of a first substrate (1) and a bonding side of a second substrate (14) with the following features: - a workspace (22) that can be closed, gas-tight, against the environment and can be supplied with a vacuum, - the workspace (22) comprises: a) at least one plasma chamber (4) for modifying at least one of the bonding sides and at least one bonding chamber (5) for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber (20) for modifying at least one of the bonding sides and for bonding the bonding sides.
Patent TW-201509666-A (TW)
Title: Release film, method for manufacturing molded article, semiconductor component, and reflector component
Inventor: KASAMATSU CHIKA
IPC: B29C33/38
Filed: 2014-09-01
Abstract: This release film has a thermal shrinkage of at least 5% in the MD direction and in the TD direction at 120 DEG C.
Patent TW-201514628-A (TW)
Title: Method for producing resist composition
Inventor: OGIHARA TSUTOMU
IPC: G03F7/16
Filed: 2014-09-02
Abstract: The present invention provides a method for producing a resist composition used in a process for producing a semiconductor apparatus, the method including the steps of: cleaning an apparatus for producing the resist composition with a cleaning liquid; applying the cleaning liquid on an evaluation substrate by spin-coating after removing the cleaning liquid from the apparatus for producing the resist composition; repeating the step of cleaning and the step of applying until the change in the density of defects having a size of 100nm or more on the evaluation substrate between before and after the application of the cleaning liquid becomes 0.2/cm2 or less; and producing the resist composition by using the apparatus for producing the resist composition after the step of repeating. There can be provided a method for producing a resist composition capable of producing a resist composition whose coating defects are reduced.
Patent TW-201611690-A (TW)
Title: Assembling jig for circuit boards, assembling apparatus for circuit boards and assembling method of circuit boards
Inventor: HUNG YING-MING
IPC: H05K3/26
Filed: 2014-09-04
Abstract: A jig for assembling a pair of circuit boards is provided. The jig includes a pair of frames and a plurality of buckles. The frames are stacked with each other and the circuit boards are clamped between the frames. Each of the buckles includes a base, a sliding block, and an elastic piece. The base disposed on one of the frames has a sliding chute where the sliding block slidably disposed therein. The elastic piece is assembled to the sliding block and located on the base. The elastic piece is moved with the sliding block relative to the base to press the other frame and locks the frames, of the elastic piece is moved with the sliding block relative to the base to leave the other frame and releases the frames. An assembling apparatus for circuit boards and an assembling method of circuit boards are also provided.
Patent TW-201518797-A (TW)
Title: Optical waveguide component, manufacturing method therefor, and optical waveguide device
Inventor: SUGAMA AKIO
IPC: G02B6/122
Filed: 2014-09-05
Abstract: An optical waveguide component includes: an optical fiber mounting substrate provided with optical fiber alignment grooves having either, for alignment of optical fibers, V-grooves or inverted trapezoidal grooves in which inverted top sections of the V-grooves are truncated; an optical waveguide substrate in which optical waveguides are formed; a resin layer that is aligned and fixed in a state in which the optical fiber mounting substrate and the optical waveguide substrate are flush or have a predetermined amount of offset; and a transparent resin that is filled in a gap in which the optical fiber mounting substrate and the optical waveguide substrate face each other.
Patent TW-201517579-A (TW)
Title: Redundant ring node, network node, and method for implementing redundant node supporting ring protection protocol
Inventor: NAHLOUS SIMON PAUL
IPC: H04L45/18
Filed: 2014-09-11
Abstract: Systems and methods are disclosed for providing redundancy in a network node implementing a ring protection protocol. Each of the two ring ports connecting the node to other nodes in a ring supporting the protocol may be maintained by a separate line card. Should one line card fail, traffic passing through the node may be redirected through the remaining ring port under the control of the surviving state machine. The two state machines may be coordinated over the backplane of the node to maintain a common state, making them transparent to other nodes. Additionally, the backplane link between the state machines may be monitored for failures that may be addressed with messages used to respond to general ring failures and by assigning one state machine to block a ring port upon recovery to prevent a loop within the ring until the ring protection link can be blocked.