baber/WOPTO huggingface dataset:
Patent JP-2014067951-A (JP)
Title: Photoelectric conversion element, photoelectric conversion element manufacturing method and electronic apparatus
Inventor: HATTORI YASUNORI
IPC: H01L31/10
Filed: 2012-09-27
Abstract: PROBLEM TO BE SOLVED: To provide a photoelectric conversion element which inhibits film peeling.SOLUTION: A photoelectric conversion element manufacturing method comprises: a circuit part formation process of forming a flattened film; and a photoelectric conversion part formation process of forming a photoelectric conversion element. The photoelectric conversion part formation process includes: a first electrode film formation process of forming a first electrode film including molybdenum in connection with the flattened film; a metal film formation process of forming a metal selenide film on the first electrode film to form an intermediate film on the first electrode film; a first patterning process of forming the metal film into a predetermined shape; a second patterning process of forming the first electrode film into a predetermined shape; a buffer film formation process of forming a buffer film on the metal film; a semiconductor film formation process of forming a semiconductor film on the buffer film; an interlayer insulation film formation process of forming an interlayer insulation film corresponding to the flattened film by exposing a part of the semiconductor film; and a second electrode film formation process of forming a second electrode film in connection with the semiconductor film and the interlayer insulation film.
Patent JP-2014068300-A (JP)
Title: Line controller
Inventor: KIMOTO TAICHIRO
IPC: H04M1/00
Filed: 2012-09-27
Abstract: PROBLEM TO BE SOLVED: To provide a line controller capable of reducing a communication charge.SOLUTION: A distributed configuration multi-functional peripheral device comprises a MFP, a slave apparatus, and a BOX. The BOX stores a partner destination telephone number for identifying a voice call destination of the slave apparatus; makes an EEPROM store transmission data on the basis of reception of the transmission data and a FAX telephone number from the MFP; determines whether or not the voice call destination corresponds with a data transmission destination, in the case of receiving the transmission data and FAX telephone number in a period when a voice call is performed in the slave apparatus; performs transmission of the transmission data, subject to detection of completion of the voice call in the slave apparatus, while keeping a connection state of a line connecting with the voice call destination, when it is determined that the voice call destination corresponds with the data transmission destination; and performs transmission of the transmission data after newly establishing a line connection in response to the detection of completion of the voice call in the slave apparatus, when it is determined that the voice call destination does not correspond with the data transmission destination.
Patent JP-2012256424-A (JP)
Title: Glass substrate for magnetic recording medium
Inventor: SHIDA NORIHITO
IPC: C03C3/083
Filed: 2012-09-28
Abstract: PROBLEM TO BE SOLVED: To provide a glass substrate for a magnetic recording medium excellent in mechanical characteristics and excellent in surface roughness of a principal plane and in-plane uniformity thereof.SOLUTION: The glass substrate for a magnetic recording medium is made of aluminosilicate glass having a Young's modulus of 68 GPa or more and having a specific modulus of 27 MNm/kg or more, and is a disk-shaped glass substrate having a circular hole in the center thereof. A standard deviation of surface roughness is less than 0.5 nm, measured by an optical surface observation machine using laser light on an area on 3.5 mm or more outer peripheral side from an inner peripheral edge surface and on 3.5 mm or more outer peripheral side from an outer peripheral edge surface of the principal plane of the glass substrate for the magnetic recording medium.
Patent JP-2014071741-A (JP)
Title: Internal state calculation device and method for expressing artificial emotion and recording medium
Inventor: AHN HO SEOK
IPC: B25J13/08
Filed: 2012-09-28
Abstract: PROBLEM TO BE SOLVED: To provide an internal state calculation device and method for artificial emotion learning.SOLUTION: The internal state calculation method includes a first step for multiplying an input value acquired from a sensor by a first personality set by at least one or more lower elements included in at least one or more higher elements of NEO PI-R (Revised NEO Personality Inventory); a second step for calculating a personality factor value in five factor models (Five Factor Model) of a personality by adding the product results thereof; and a third step for calculating an internal state by multiplying the personality factor value by a second personality. According to the internal state calculation method and device, internal states of various aspects needed to express various emotions can be provided. Consequently, a robot can express more delicate and realistic emotions like a person.
Patent JP-2014070861-A (JP)
Title: Outdoor unit of air conditioner
Inventor: MIWA MASAAKI
IPC: F24F1/56
Filed: 2012-10-01
Abstract: PROBLEM TO BE SOLVED: To provide an outdoor unit of an air conditioner capable of easily positioning a front panel and restricting scar at a design surface exposed after assembling of casing.SOLUTION: There is provided a casing 10. The casing 10 has one side surface part of the casing 10, a left side surface panel 4 constituting a part of a front surface part of the casing 10 adjacent to the side surface part, a front surface left side panel 2 constituting a front surface part of the casing 10 together with the left side surface panel 4, and a top surface panel 7 constituting the top surface part of the casing 10, an upper end part of the front surface left side panel 2 is provided with temporary fixing claws 2a protruded at a rear surface side of the casing 10, an upper end part at a front surface side of the left side surface panel 4 is provided with temporary fixing rectangular holes 4a into which the temporary fixing claws 2a are inserted, the left side surface panel 4 and the front surface left side panel 2 are fixed at a front surface side of the casing 10, the temporary fixing claws 2a and the temporary fixing rectangular holes 4a are covered by the top surface panel 7.
Patent JP-2014073536-A (JP)
Title: Electric tool
Inventor: KUMAGAI TATSUNOSUKE
IPC: B25F5/00
Filed: 2012-10-02
Abstract: PROBLEM TO BE SOLVED: To provide an electric tool having an electric motor installed inside a halved housing, which ensures a coil-winding amount sufficient for rotation driving force generated by a driving motor and reduces size of the housing covering the exterior of the electric tool so as to reduce the entire size of the electric tool.SOLUTION: Positions of intermediate screwing parts 45 and 46 for fixing with a screw a left housing 201 to a right housing 202 are set between a front protruding coil 281 and a rear protruding coil 282. In other words, the protruding coil portions 281 and 282 are arranged in at least either one of a front side or a rear side relative to the positions of the intermediate screwing parts 45 and 46 for fixing with a screw the left housing 201 to the right housing 202. This allows a dead space easily, formed easily between the front protruding coil portion 281 and the rear protruding coil portion 282, to be effectively utilized.
Patent JP-2014074541-A (JP)
Title: Induction heating and drying device
Inventor: HASEGAWA KAORI
IPC: H05B6/10
Filed: 2012-10-04
Abstract: PROBLEM TO BE SOLVED: To provide an induction heating and drying device capable of uniformly heating a wide range of portion of a vehicle body.SOLUTION: An induction heating and drying device 1 comprises: a first induction heating coil group 2A in which plural first induction heating coils 21A formed into a spiral shape are aligned; and a second induction heating coil group 2B in which plural second induction heating coils 21B formed into a spiral shape are overlaid and aligned almost in parallel to the first induction heating coil group 2A. A portion of the first induction heating coil group 2A at which a strong magnetic force line is generated is displaced from a portion of the second induction heating coil group 2B at which a strong magnetic force line is generated in a planar direction. The induction heating and drying device 1 repeatedly applies a current to the plural first induction heating coils 21A and the plural second induction heating coils 21B alternately at different current-applying timing.
Patent JP-2014078833-A (JP)
Title: Call control apparatus, call control method, and call control program
Inventor: SUGIYAMA KARIN
IPC: H04M3/00
Filed: 2012-10-10
Abstract: PROBLEM TO BE SOLVED: To appropriately process whether call establishment continues or not when an error response or no response is returned from an application server.SOLUTION: From a transmission source device, when a call establishment request is received, application server identification information is referenced, application server which can provide additional service is selected, and service provision is requested to the application server. When an error response or no response is received from the application server which requests service provision, it is determined whether processing to establish a call continues or not on the basis of call continuous information which is set for each application server. When it is determined that the processing to establish a call continues, the additional service is not added but the call establishment request to establish the call is transmitted to a destination device which receives an incoming call.
Patent JP-2014081005-A (JP)
Title: Resin gear
Inventor: YAMANARI KENJI
IPC: F16H55/06
Filed: 2012-10-15
Abstract: PROBLEM TO BE SOLVED: To provide a resin gear capable of suppressing occurrence of cracking on dedendum even when a sufficient size from an inner circumferential part of a gear part to the root is not taken.SOLUTION: A resin gear 10 includes a metal insert 1 and a resin gear part 2 surrounding the insert 1 in the circumferential direction. Therein, protrusions 11 are formed at regular intervals in the circumferential direction on the outer circumferential part of the insert 1, teeth 21 are formed at regular intervals in the circumferential direction on a peripheral part of the gear part 2 and the protrusions 11 are embedded into the gear part 2 so as to connect the insert part 1 and the gear part 2. Further, number of the protrusions 11 is equal to number of the teeth 21, the protrusions 11 are protruded toward dedendum 21a on the teeth 21 and are formed so as to be tapered toward the radiation outer side, and the maximum diameter dof the insert 1 containing the protrusions 11 is formed so as to be smaller than a root circle diameter don the gear part 2.
Patent JP-2014085129-A (JP)
Title: Parasitic sensor and radio sensor network using the same
Inventor: AOYANAGI SEIJI
IPC: G08C17/00
Filed: 2012-10-19
Abstract: PROBLEM TO BE SOLVED: To detect speed or acceleration speed without requiring power supply from the outside.SOLUTION: A parasitic sensor 10 includes: a first electrode 12; a second electrode 16; an electret 13 formed on the first electrode 12; a dielectric body 15 formed opposite to the electret 13 on the second electrode 16; and an elastic member 17 displaceably supporting one of the first electrode 12 and the second electrode 16 so that a gap distance d between the electret 13 and the dielectric body 15 varies according to vibration applied from the outside. The parasitic sensor generates a sensor signal from a current flowing between the first electrode 12 and the second electrode 16 according to variation of the gap distance d, and outputs the sensor signal.
Patent JP-2014086563-A (JP)
Title: Electronic component
Inventor: HARADA HIROYUKI
IPC: H01G11/00
Filed: 2012-10-24
Abstract: PROBLEM TO BE SOLVED: To solve such a problem that a portion of an insulation may be melted or the insulation may be cracked when giving a molten solder to an external terminal member, in an electronic component including an external terminal member, and the insulation in contact with the external terminal member while exposing a predetermined side of the external terminal member.SOLUTION: An exposed part 27 of an external terminal member 23 is given by a base plating film 32 composed of a nickel-based metal, and an outer layer plating film 33 formed on the base plating film 32 and composed of a gold or tin-based metal. The outer layer plating film 33 is formed so that a relatively thin region 36 surrounds a relatively thick region 37. In the thin region 36, the amount of metal itself having excellent solder wettability is small, and the base plating film 32 is susceptible to oxidation. As a result, solder wettability is reduced in the peripheral edge of the exposed part 27 of an external terminal member 23, and wet spreading of solder can be suppressed.
Patent JP-2014085067-A (JP)
Title: Solar heat utilization system
Inventor: IMAI SEISHI
IPC: F24H1/00
Filed: 2012-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a technology for a solar heat utilization system that enables reduction in the number of components and manufacturing cost.SOLUTION: The solar heat utilization system of the present invention comprises: a solar heat collector for heating a heat medium by utilizing solar heat; a heat exchanger for exchanging heat between the heat medium and water; a hot water storage tank for storing water heated by the heat exchanger; a heat collection circulation route for the heat medium to circulate between the solar heat collector and the heat exchanger; an auxiliary heat source machine for heating the heat medium; a heat apparatus that utilizes heat radiation from the heat medium; a heat radiation circulation route partially integrated with the heat collection circulation route for the heat medium to circulate between the auxiliary heat source machine and the heat apparatus; and a circulation pump disposed in an integral portion of the heat collection circulation route and the heat radiation circulation route for circulating the heat medium.
Patent JP-2014083281-A (JP)
Title: Ultrasonic measuring device, head unit, probe, and diagnostic system
Inventor: ENDO KATSUMA
IPC: A61B8/00
Filed: 2012-10-25
Abstract: PROBLEM TO BE SOLVED: To provide an ultrasonic measuring device which can achieve miniaturization of a device, a head unit, a probe, a diagnostic system, etc.SOLUTION: An ultrasonic measuring device includes: an ultrasonic transducer device 200; a flexible board 130 in which a plurality of signal lines LT1-LT64 are formed along a first direction D1; and an integrated circuit device 110 mounted on the flexible board 130 so that its long side direction is along a second direction D2. Any one of the plurality of the signal lines LT1-LT64 is connected to each signal terminal of a plurality of signal terminals. The integrated circuit device 110 has a plurality of terminals arranged along the second direction D2, and a transmission circuit provided to each of the plurality of the terminals. Each terminal of the plurality of the terminals of the integrated circuit device 110 is connected to any one of the plurality of the signal lines LT1-LT64 of the flexible board 130. A plurality of the transmission circuits are arranged along the second direction D2.
Patent JP-2014086629-A (JP)
Title: Multiple chip resistor
Inventor: MAEDA YUKINORI
IPC: H01C17/22
Filed: 2012-10-25
Abstract: PROBLEM TO BE SOLVED: To provide a multiple chip resistor suitable for high breakdown voltage.SOLUTION: A first resistor 6 and a second resistor 7 are formed while being distributed to the upper and lower surfaces of an insulating base 2. A first extension 6a extending between the electrodes (front electrodes 3) of the second resistor 7 on the lower surface side is formed in the first resistor 6 on the upper surface side. A second extension 7a extending between the electrodes (back electrodes 4) of the first resistor 6 on the upper surface side is formed in the second resistor 7 on the lower surface side.
Patent JP-2014083298-A (JP)
Title: Heating cooker
Inventor: OHORI SHINICHI
IPC: A47J27/00
Filed: 2012-10-25
Abstract: PROBLEM TO BE SOLVED: To provide a heating cooker capable of promoting water absorption into rice, suppressing unevenness of cooked rice, and preventing occurrence of trouble such as sticky feeling or burnt deposit in doneness of cooked rice.SOLUTION: In a water absorption and heating process in which rice and water are heated to rise to a set temperature from a normal temperature, driving input means (320) of a speed controlling part (32) makes a drive input value for driving a motor (21) during a period in which the temperature rises to a first temperature from the normal temperature, larger than a drive input value for driving the motor (21) during a period in which the temperature rises to the set temperature from the first temperature.
Patent JP-2014090281-A (JP)
Title: Luminaire and image reader using this luminaire
Inventor: ENOMOTO SHINNOSUKE
IPC: H04N1/04
Filed: 2012-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a luminaire configured to keep the LEDs at a required temperature or below by suppressing temperature rise of a heat dissipation member in a limited volume, and to provide an image reader equipped with the luminaire.SOLUTION: In order to dissipate the heat generated in LEDs from a substrate mounting the LEDs, a first heat dissipation plate 43 and a second heat dissipation plate 47 are provided on both sides of a mounting substrate. On a second frame 40 for supporting the mounting substrate, the first heat dissipation plate 43 and the second heat dissipation plate 47, the second heat dissipation plate 47, the mounting substrate and the first heat dissipation plate 43 are installed while being stacked in this order, and blower means is disposed on the first heat dissipation plate 43 side. When viewing the second frame 40 in a direction perpendicular to the longitudinal direction, the cross-section of the second heat dissipation plate 47 has a contour including a region protruding for the contour of cross-section of the first heat dissipation plate 43, so that the wind from the blower means hits the first heat dissipation plate 43 and the second heat dissipation plate 47 positively.
Patent JP-2013018707-A (JP)
Title: Method and apparatus for manufacturing glass substrate
Inventor: MAEDA NOBUHIRO
IPC: C03B17/06
Filed: 2012-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate capable of achieving improvement of a production amount of a glass substrate and improvement of warpage quality.SOLUTION: This method for manufacturing a glass substrate is a method that manufactures glass substrates using the downdraw method. In the downdraw method, melted glass is made to overflow from a mold to form sheet glass, and the sheet glass is cooled while stretched in the downstream direction. In this method for manufacturing a glass substrate, after the sheet glass is separated from the mold, while the temperature of the sheet glass is in the temperature range from above the softening point to near the annealing point and while applying tension towards the side sections of the sheet glass, the sheet glass is cooled with the viscosity of the side sections maintained within the range of 10-10poise.
Patent JP-2014093335-A (JP)
Title: Electronic component mounting system
Inventor: YAMAZAKI TAKUYA
IPC: H05K13/04
Filed: 2012-11-01
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component mounting system capable of restoring a piece of component information including operation parameters to a proper state.SOLUTION: The electronic component mounting system includes an electronic component mounting operation unit 10 that mounts plural kinds of electronic components onto a board. A component information modification history storage 21 stores a piece of component information and a modification history of the component information including operation parameters which define the operation mode of the electronic component mounting operation unit 10 using numerical values. The electronic component mounting system detects a mounting failure which occurs during electronic component mounting operation and records a piece of mounting failure information concerning the occurrence situations of the mounting failure and displays a transition of the mounting failure on a screen of a display section 18; and further, reads out a piece of past component information at the time of the day based on a specified day and time to display the same on the screen. Therefore, since the correlation between a change of the component information and the mounting failure can be easily confirmed, the component information including the operation parameters can be restored to a proper state.
Patent JP-2014093148-A (JP)
Title: Semiconductor type light source of vehicle lamp fitting and vehicle lamp fitting
Inventor: TAKESAWA HATSUO
IPC: F21V29/00
Filed: 2012-11-01
Abstract: PROBLEM TO BE SOLVED: To efficiently radiate heat generated in an LED chip to the exterior.SOLUTION: The invention includes: an LED chip 3; a package member 4 on which the LED chip 3 is mounted; a power feeding member 5 which supplies a current to the LED chip 3; and a heat radiation member 6 to which the package member 4 is fixed, and radiates heat generated in the LED chip 3 to the exterior. The package member 4 is formed by a metal substrate 40. The LED chip 3 is joined to the metal substrate 40 through a metal joining material 7. As a result, the invention efficiently radiates the heat generated in the LED chip 3 to the exterior.
Patent JP-2013034011-A (JP)
Title: Semiconductor wafer processing method
Inventor: OHASHI HITOSHI
IPC: H01L21/683
Filed: 2012-11-05
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing method having high thickness accuracy, which can stably hold a semiconductor wafer when transferring the semiconductor wafer or when performing processing such as backgrinding, and which can detach the semiconductor wafer without damage after required processing is performed.SOLUTION: A semiconductor wafer processing method according to the present invention comprises: a process of detachably fixing a semiconductor wafer on a flexible glass substrate having a thickness of 300-1000 μm, and a compressive stress layer chemically strengthened by ion exchange treatment by one or more kinds of ions selected from Na ions and K ions, and a maximum bending angle of 30 degrees or larger; a process of performing processing on the semiconductor wafer; a process of fixing the semiconductor wafer side by support means; and a process of curving the flexible glass substrate and detaching it from the semiconductor wafer.
Patent JP-2014096658-A (JP)
Title: Radio resource allocation device, radio resource allocation method, and computer program
Inventor: TODA KAZUHIDE
IPC: H04J11/00
Filed: 2012-11-08
Abstract: PROBLEM TO BE SOLVED: To flexibly utilize EPDCCHset also for PDSCH.SOLUTION: A radio resource allocation device includes: a required number of PRB estimation part 12 for calculating an estimation value for a number of required PRB for EPDCCH, multiplexed with PDSCH on radio resource domains within one sub-frame; an EPDCCHset selection part 13 for selecting an EPDCCHset within a plurality of predetermined EPDCCHsets within the radio resource domains, so as to satisfy the calculated estimation value of the number of required PRB; and a PDSCH allocation part 14 for allocating a radio resource for PDSCH from the resource domains other than the radio resource domain selected for the EPDCCHset.