baber/WOPTO huggingface dataset:
Patent TW-200819516-A (TW)
Title: Adhesive composition and method for temporarily fixing member by using the same
Inventor: KURIMURA HIROYUKI
IPC: C09J4/02
Filed: 2007-07-25
Abstract: Disclosed is a method for temporarily fixing a member which is suitable for processing an optical member. Also disclosed is an adhesive composition suitably used for such a method. Specifically disclosed is an adhesive composition containing a polyfunctional (meth)acrylate (A), a monofunctional (meth)acrylate (B) and a photopolymerization initiator (C). This adhesive composition is characterized in that a cured product obtained therefrom has a glass transition temperature of from -50 DEG C to 40 DEG C. Also specifically disclosed is a method for temporarily fixing a member which is characterized in that the member is temporarily fixed by being bonded with the adhesive composition, and after processing the temporarily fixed member, the processed member is immersed into warm water at a temperature of not more than 90 DEG C for removing the cured product of the adhesive composition from the processed member.
Patent TW-200813594-A (TW)
Title: Manufacturable micropositioning system
Inventor: WESTERWEEK LOTHAR
IPC: G03B13/32
Filed: 2007-08-06
Abstract: Embodiments of the present invention relate to systems and methods of position sensing that use a sensing target with a pattern of features thereupon, and to positioning modules and systems that position functional elements using such position sensing systems. A position sensing system includes an encoding module and a processing module. The encoding module has an active encoding region through which the sensing target is configured to move. Further, the encoding module is configured to generate a signal based on a portion of the sensing target within the active encoding region. The active encoding region has a dimension greater than the average critical dimension of the pattern of features. The processing module is configured to convert the signal generated into a position data based on an input range condition and an initial position condition.
Patent TW-200819926-A (TW)
Title: Poly(cyanoalkyl)ethyleneamine composition for removing resist and method of removing resist using the composition
Inventor: HARA YASUSHI
IPC: G03F7/42
Filed: 2007-08-16
Abstract: To provide composition for removing resist having excellent property of removing resist which gives little damage to materials for semiconductors and flat panel displays, and method of removing resist using the composition. The composition for removing resist includes poly (cyanoalkyl) ethyleneamine, and it is preferable to contain at least one of N, N'-bis(2-cyanoethyl)-ethylenediamine, N, N, N'-tris(2-cyanoethyl)ethyleneiamine, N, N, N', N',-tetrakis(2-cyanoethyl)ethylenediamine, N, N'-bis(2-cyanoethyl)piperazine, N, N'-bis(2-cyanoethyl)-N''-(2-aminoethyl)piperazine, N, N', N'-tris(2-cyanoethyl)-N''-(2-aminoethyl)piperazine, and so forth as poly(cyanoalkyl) ethyleneamine.
Patent TW-200840461-A (TW)
Title: Electronic device and protection cover thereof
Inventor: OU CHUNG-YUAN
IPC: H04M1/02
Filed: 2007-09-11
Abstract: An electronic device and a protection cover thereof are provided. The electronic device includes a cap body, a main body, a flexible printed circuits board (FPC), and a protection cover. The protection cover includes a receiving portion and a combining portion. One end of the receiving portion is coupled to an upper surface of the main body, and the other end of the receiving portion is connected with the combining portion. After the cap body moves from a first position on the main body to a second position on the main body, the combining portion is coupled to a bottom surface of the cap body, so that the cap body rotates in the second position along with the protection cover, and the protection cover covers the FPC to prevent the FPC from being damaged.
Patent TW-200839347-A (TW)
Title: Electro-optic waveguide polarisation modulator
Inventor: FINLAYSON EWAN DAVID
IPC: G02F1/025
Filed: 2007-09-12
Abstract: An electro-optic waveguide polaristation modulator 20 comprising a waveguide core 4 having first and second faces defining a waveguide core plane, a plurality of primary electrodes 22, 24 arranged at a first side of the waveguide core plane and out of said plane, and at least one secondary electrode 26 arranged at a second side of the waveguide core plane and out of said plane, wherein the electrodes 22, 24, 26 are adapted in use to provide an electric field having field components 13, 15 in two substantially perpendicular directions within the waveguide core 4 so as modulate the refractive index thereof such that electromagnetic radiation propagating through the core 4 is converted from a first polarisation state to a second polarisation state.
Patent TW-200821433-A (TW)
Title: Toilet tank connector assembly
Inventor: HALLORAN DANIEL N
IPC: E03D11/00
Filed: 2007-09-19
Abstract: Disclosed are "two piece" toilets where a toilet tank outlet valve links the tank water with a bowl. A nut and gasket structure are provided to provide an essentially ball and socket type joint between the tank and bowl to permit correction for out of plumb conditions without significantly compromising seal integrity. The gasket has an outward lower curvature and is supported from the inside by the nut. Preferably the lower end of the nut is cut away or curved such that in some configurations the gasket can flex inwardly, while being otherwise supported by the nut.
Patent TW-200915940-A (TW)
Title: Layout of circuit board
Inventor: HSU TI-MING
IPC: H05K13/06
Filed: 2007-09-20
Abstract: A layout of a circuit board has a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is stacked below the first and second signal layers with the second signal layer being between the first and third signal layers. The third signal layer is electrically connected to the second signal layer, and both of the second and third signal layers are both ground layers or power layers. An orthogonal projection of a segment of the transmission line on the third signal layer is overlapped with that of the opening on the third signal layer. Therefore, an equivalent resistance of the segment of the transmission line referring to the second and third signal layers can be increased or decreased.
Patent TW-200831663-A (TW)
Title: Lubricant for compression refrigerating machine and refrigerating apparatus using the same
Inventor: KANEKO MASATO
IPC: C10N20/02
Filed: 2007-09-28
Abstract: Disclosed is a lubricant for compression refrigerating machines characterized by containing a polyvinyl ether compound which contains an alkylene glycol unit or polyoxyalkylene glycol unit and a vinyl ether unit in a molecule, while having a molecular weight of 300-3,000, and a dehydrating agent. This lubricant for compression refrigerating machines exhibits good compatibility in a carbon dioxide atmosphere, while having high viscosity index and excellent stability. In addition, this lubricant for compression refrigerating machines does not deteriorate due to hydrolysis.
Patent TW-200914229-A (TW)
Title: Step for flattening arc-shaped bamboo remaining bamboo outer and inner surface layer, flattening method using the same step and flattening device
Inventor: Wu yong-wei
IPC: B27J1/00
Filed: 2007-09-29
Abstract: The present invention discloses process and apparatus for flattening arc bamboo sheet. During flattening arc bamboo sheet, radial force is applied while dispersed crack-preventing holes are formed in the yellow layer of the arc bamboo sheet. The process of flattening arc bamboo sheet includes the first heating to soften bamboo material, and the subsequent flattening. The apparatus for flattening arc bamboo sheet includes one or several pairs of axially parallel rolls, and each roll pair includes one smooth roll and one nailed roll with dispersed lugs in the surface. The present invention has the advantages of less reduction of the strength of bamboo material, high utilization rate of bamboo resource and no cracking caused by flattening.
Patent TW-200838925-A (TW)
Title: Polyacetal resin composition and molded article thereof
Inventor: HASE HIROYUKI
IPC: C08K5/098
Filed: 2007-10-29
Abstract: To provide a polyacetal resin composition which has excellent processability and stability, significantly suppresses the generation of formaldehyde from the molded article, and prevents exudation of components. To 100 parts by weight of (A) a polyacetal copolymer having 1.0 mmol/kg or less of hemiformal terminal group, 0.5 mmol/kg or less of formyl terminal group, and 0.5% by weight or less of instable terminal group, there are blended: 0.01 to 3 parts by weight of (B) a hindered phenol-based antioxidant; 0.05 to 1 part by weight of c a compound of at least one of guanamine compound and triazine compound; and 0.01 to 1 part by weight of (D) a compound selected from the group consisting of an isocyanate compound, an isothiocyanate compound, and their modified compound.
Patent TW-200921213-A (TW)
Title: Backlight module and application thereof
Inventor: HSIEH HUNG-SHENG
IPC: G02F1/1335
Filed: 2007-11-15
Abstract: A backlight module and an application thereof are described. The backlight module comprises: a rear plate; a light source disposed in the rear plate; and at least one optical plate disposed on the rear plate, wherein the at least one optical plate comprises a substrate and at least one transparent coating film coated on a light-incident surface of the substrate, so as to make light emitted toward the light-incident surface of the substrate of the at least one optical plate by the light source form constructive interference when the light passes through the at least one transparent coating film.
Patent TW-200922860-A (TW)
Title: A package structure for MEMS type microphone and method therefor
Inventor: CHEN JUNG-TAI
IPC: H04R19/01
Filed: 2007-11-21
Abstract: A package structure for MEMS type microphone and method therefor are provided. The package structure is implemented by adjust the thickness of a transparent cover plate which is temporarily disposed on the conventional plastic package structure. After the mold for plastic protector is formed, a UV ray is utilized to irradiate the mold to reduce the adherence on the cover plate and the back surface of the MEMS acoustic wave sensing chip. Then, the cover plate is removed, and the space left after removing the cover plate will be the source for the back-volume of MEMS type microphone. Finally, a tag plate is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned method, the size of back-volume is the same as the size of the MEMS type microphone. In addition, the back-volume can be easily defined.
Patent TW-200834890-A (TW)
Title: Barrier region for memory devices
Inventor: SINHA SHANKAR
IPC: H01L21/8247
Filed: 2007-11-27
Abstract: One embodiment of the present invention relates to a memory cell (100). The memory cell (100) comprises a substrate (103) and a stacked gate structure (102) disposed on the substrate (103), wherein the stacked gate structure (102) comprises a charge trapping dielectric layer (106) that is adapted to store at least one bit of data. The memory cell (100) further includes a source (105) and drain (107) in the substrate (103), wherein the source (105) and drain (107) are disposed at opposite sides of the stacked gate structure (102). A barrier region (109) is disposed substantially beneath the source (105) or the drain (107) and comprises an inert species. Other embodiments are also disclosed.
Patent TW-200900246-A (TW)
Title: Screen printing device and bump forming method
Inventor: MUKAI NORIAKI
IPC: B41F15/08
Filed: 2007-12-10
Abstract: To solve a problem in the method for filling a predetermined aperture with a solder ball by swaying or vibrating a mask in formation of a bump electrode that the aperture cannot be filled because particles are in close contact with each other due to reduction in diameter of solder ball particle and because a close contact force between particles becomes larger than the self-weight of particles in the case where the hole diameter of the mask is under 1.3 times the diameter of particle, and also to solve the similar problem on the occasion of filling the aperture with the solder ball by utilizing squeegee and parallel advancing motion of brushes or the like. A printer for filling of solder balls has been developed, on the basis of a low price and high precision screen printing technology used in the printing method, to achieve high-speed and highly accurate filling and printing of fine particles of solder balls for assuring stable height of bumps. Moreover, it has been achieved that the solder balls are used for filling and printing while the solder balls are held in the closed state in order to effectively use the fine particles of solder balls.
Patent TW-200928777-A (TW)
Title: Data processing method and apparatus based on cluster
Inventor: YAU JIAN-DUNG
IPC: G06F15/177
Filed: 2007-12-21
Abstract: The invention discloses a data processing method based on clusters and a device thereof. The method comprises the steps that a first data comprising a control identifier is sent to an exterior; the control identifier comprises a sole identifier and control information corresponding to the first data; load balancing equipment receives a second data returned by the exterior; the second data comprises the control identifier; the second data is routed according to control information corresponding to the second data, thereby avoiding the problems that a great deal of server resource is occupied and performance is degraded in the prior art which keeps network connection with an external server to transmit data by the clusters.
Patent TW-200842981-A (TW)
Title: Method for forming a wiring film, transistor, and electronic device
Inventor: TAKASAWA SATORU
IPC: H01L21/285
Filed: 2007-12-28
Abstract: A wiring film having excellent adhesion and low resistance is formed. An oxygen gas is introduced into a vacuum tank (2), in which a film formation object (21) is disposed, to sputter a pure copper target (11) and thus to form a barrier film (22) composed mainly of copper and containing oxygen on a surface of the film formation object (21). Thereafter, the introduction of the oxygen gas is stopped, and the pure copper target (11) is sputtered to form a low-resistance film (23) of pure copper. Since the barrier film (22) and the low-resistance film (23) are composed mainly of copper, patterning can be carried out at a time. The low-resistance film (23) has a lower resistance than the barrier film (22), and, thus, the resistance of the whole wiring film (25) is also low. The barrier film (22) has high adhesion to glass and silicon, and, thus, the adhesion of the whole wiring film (25) is also high.
Patent TW-200930140-A (TW)
Title: Brightness improvement structure of fluorescence/phosphorescence surface luminous element of optical thin film
Inventor: MIE JEN-WEI
IPC: H05B33/14
Filed: 2007-12-31
Abstract: The present invention provides a brightness improvement structure of a fluorescence/phosphorescence surface luminous element of an optical thin film, which disposes a luminous portion inside a transparent casing to emit ultra-violet or blue rays. The transparent casing has a first wall and a second wall where a corresponding first inside wall and a corresponding second inside wall are formed inside and a first outside wall and a second outside wall are formed outside. The first wall is coated with a partial or whole optical film coating, and the optical thin film can reflect at least the ultra-violet or blue rays which stimulates fluorescence/phosphorescence and pass visible light. The second wall is coated with a visible layer or a visible layer and a light-reflection layer. The luminous portion is disposed at a predetermined position away from the casing to be applicable to small incident angle for a normal optical thin film, so as to increase the radiation of visible light source and the brightness of the luminous element.
Patent TW-200931210-A (TW)
Title: Belt tension providing apparatus of image forming device
Inventor: LIU DEAN
IPC: G03G15/00
Filed: 2008-01-02
Abstract: A belt tension mechanism includes a tension roller disposed on a side of a photoconductive belt for pressing the photoconductive belt so as to provide tension to the photoconductive belt, a first elastic component connected to the tension roller for providing the elastic force to the tension roller so that the tension roller is capable of pressing the photoconductive belt, and a releasing device disposed on the other side of the photoconductive belt. The releasing device includes a actuating component for moving in a first direction and separating from the tension roller when powered on so that the first elastic component can drive the tension roller to a position where the tension roller can press the photoconductive belt, and a second elastic component connected to the actuating component for driving the actuating component to a second direction opposite to the first direction when the actuating component is powered off so that the actuating component can drive the tension roller to a position where the tension roller can not press the photoconductive belt.
Patent TW-200846032-A (TW)
Title: Sustained-release tablet formulations of piperazine-piperidine antagonists and agonists of the 5-HT1A receptor having enhanced intestinal dissolution
Inventor: WEN HONG
IPC: A61K31/4709
Filed: 2008-02-15
Abstract: The present invention relates to sustained-release tablet formulations of piperazine-piperidine compounds, which can be useful in treating central nervous system disorders; to processes for their preparation; and to methods of using them.
Patent TW-200904102-A (TW)
Title: Method and system for orchestration of content processing in mobile delivery frameworks
Inventor: SHENFIELD MICHAEL
IPC: H04N21/235
Filed: 2008-02-18
Abstract: A method and system for coordinating content processing in a mobile delivery framework, the method having the steps of embedding, within a metadata envelope associated with content, external references to external enablers; and inserting content processing coordination rules into the metadata envelope.
Patent TW-200936676-A (TW)
Title: Transparent acrylic composition having flame retardancy and preparing method thereof
Inventor: YEN FU-SAN
IPC: C08K5/51
Filed: 2008-02-29
Abstract: This invention provides a transparent acrylic composition having flame retardancy comprising at least one acrylic resin liquid, a plurality of flame retardant inorganic oxide particles of which the average particle diameter is not greater than 300 nanometer, at least one organic compound containing phosphorus, and at least one compound containing functional group. The functional group is selected from carboxylic acid group, sulfonic acid group, phosphoric acid group, boric acid group, amino group, hydroxyl group, and ether group. The flame retardant inorganic oxide particle is prepared by a sol-gel technique and is added with few and dispersed in the acrylic resin liquid to allow the acrylic to achieve the flame retardancy effectiveness, to prevent the original hardness and mechanical strength of the acrylic from being influenced and to maintain the transparency of the acrylic. Further, the weight of phosphorus is greater than 0.01 times of the weight of the acrylic resin liquid in the transparent acrylic composition having flame retardancy.
Patent TW-200841164-A (TW)
Title: Cooling system with flexible heat transport element
Inventor: LEV JEFFREY A
IPC: G06F1/20
Filed: 2008-03-12
Abstract: A computing device cooling system (12) comprising a heat transport element (14) for transferring heat from a heat generating component (40, 42) of a computing device (10) to a heat dissipation element (48) of the computing device (10), the heat transport element (14) having at least one flexible section to facilitate bending of the heat transport element (14).
Patent TW-200847678-A (TW)
Title: Method for processing radio protocol in mobile telecommunications system and transmitter of mobile telecommunications
Inventor: YI SEUNG-JUNE
IPC: H04L29/06
Filed: 2008-03-19
Abstract: An apparatus and method for performing procedures (protocols) of a PDCP (Packet Data Convergence Protocol) layer and an RLC (Radio layer in an E-UMTS (Evolved Universal Mobile Telecommunications System) which has evolved from UMTS, among radio protocols of a mobile communication system. The PDCP layer performs ciphering on data (i.e., PDCP SDU) received from an upper layer, generates an indicator discriminating ciphered data and non-ciphered data (i.e., an ROHC feedback packet directly generated by the PDCP layer), and transmits the same to a lower layer (i.e., MAC layer). A PDCP SN (Sequence Number) is defined as an algorithm for ciphering the data in the PDCP layer to perform ciphering in the PDCP layer.
Patent TW-200943496-A (TW)
Title: Support substrate structure for supporting electronic component thereon and manufacturing method thereof
Inventor: KAN MING-CHI
IPC: H01L23/00
Filed: 2008-04-03
Abstract: A support substrate structure for supporting an electronic component thereon comprises a thermal conductive substrate, a first ceramic layer, an insulating thermal conductive layer and a conductive pattern. The thermal conductive substrate having an upper layer and a lower layer, the first ceramic layer is disposed on the thermal conductive substrate, the insulating thermal conductive layer disposed on the ceramic layer, and the conductive pattern is formed on a surface of the insulating thermal conductive layer. The present invention also discloses a method for manufacturing a support substrate structure mention above.
Patent TW-200904866-A (TW)
Title: Surface processing method of polyimide resin and manufacturing method of metal clad laminated body
Inventor: SHINTA RYUZO
IPC: C08J7/12
Filed: 2008-04-21
Abstract: An objective of the present invention is to provide a surface processing method of polyimide resin layer capable of significantly increasing adhesion force of polyimide resin layer by a simple surface processing and also increasing adhesion force even for a low roughness copper foil appropriate for formation of fine pitches, and a manufacturing method of metal clad laminated body used in high density printed wire board. For attaining the above-described objective, the present invention provides a surface processing method of polyimide resin layer including a contact processing step of performing a contact processing to a layer in a surface side of a polyimide resin layer, with an organic processing agent having at least two amine groups represented by H2N-CH2-A-CH2-NH2 (wherein, A indicates divalent group, and the number of carbon atom contained in A is 2 to 18) as functional group, to from a surface contact processing layer, and a modified-imidized layer forming step of heat-processing this surface contact processing layer to from a modified imidized layer.
Patent TW-200901413-A (TW)
Title: Solder bump interconnect for improved mechanical and thermo mechanical performance
Inventor: ALVARADO REYNANTE
IPC: H01L23/488
Filed: 2008-04-23
Abstract: An apparatus and method for a semiconductor package including a bump on input-output (IO) structure are disclosed involving. a device pad, an under bump metal pad (UBM), a polymer, and a passivation layer. The shortest distance from the center of the device pad to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0. 5: 1 to 0. 95: 1. Also, the shortest distance from the center of the polymer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0. 35: 1 to 0. 85: 1. Additionally, the shortest distance from the center of the passivation layer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0. 35: 1 to 0. 80: 1.