Patent SG-11201407031V-A (SG)
Title: Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
Inventor: IWANO TOMOHIRO
IPC: C09K3/14
Filed: 2013-03-26
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» allium 2013^11 £ 28 0(28.11.2013) W j\"^| PCT (10) WO 2013/175857 A1 (51) H01L 21/304 (2006.01) B24B 37/00 (2012.01) (21) (22) (25) g|@ttii0>Wi§: (26) @(8&M©Wl§: (30) fiBfcftf '— 1 £: 2012-116863 2012 ^5^ 22 0(22.05.2012) JP (71) tiJSIA: 0lIlbJ$^^£tt(HITACHI CHEMICAL COMPANY, LTD.) [JP/JP]; T 1006606 — Tl 9§2-^ Tokyo (JP). (72) Sir Si;¥(IWANOTomohiro); T 3178555 0 ililTjflBTEIT g 1 1 3 # Sil'fbjS S # |±_l^ Ibaraki (JP). M Ck ft (MINAMI Hisataka); T 3178555 0 ±L rfT M. WP3 T g 1 3# 1 0 Ibaraki (JP). P5J#. ;t ?IJ BJ (AKUTSU Toshiaki); T 3178555 1S|0 AimKBTEaT g 13#1^ 0 1*1 Ibaraki (JP). H llgf f] (FUJISAKI Koji); T 1858601 — Tl 280 Tokyo (JP). (74) 5? fit, ^-(HASEGAWA Yoshiki cl al.); T 1000005 jgifvflW-tH EAtf) fa ~ T g 1 # 1-^*L0>A MY PLAZA 9® Tokyo (JP). (8i) (^ro&i^PBy, IS ft nJ f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3- — V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, [&£%] C09K 3/14 (2006.01) PCT/JP2013/058784 2013 ^ 3 M 26 0(26.03.2013) 0*1S 0*1S (54) Title: SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE (54)fg0jco:g^ : 'J — „ EJF!l;$-t? V V , ffigljflu [HI] PVA °o o o o„ l> 00 i> i-H cn i-H o CJ O £ o ° °o-Cbo°0 0 o o o o J^o P ,g-\ oJL^ 3 0 r°° (57) Abstract: A polishing solution containing abrasive grains, an additive, and water. Said abrasive grains contain a hydroxide of a tetravalent metal, and an aqueous dispersion containing said abrasive grains in the amount of 1.0 mass% exhibits an absorbance of at least 1.00 with respect to light having wavelength a of 400 nm, and an optical transmittance of at least 50%/cm with respect to light having wavelength of 500 a nm. Furthermore, the difference between the NOs~ concentration of an aqueous dispersion containing the abrasive grains in the amount of 1.0 mass% and the NOs~ concentration after said aqueous dispersion is held at 60°C for 72 hours is at most 200 ppm. (57) mm-' fn WO 2013/175857 A11 lllll llllllll II llllll III lllll lllll lllll III III III lllll lllll lllll lllll llll lllllll llll llll llll NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI 1 . OSCM%l::HSLfc7K^Ml^fc^T$A4 0 0 n mCDftlcft LTPS^JS 1.00 , K-O, 1 . 0||m%l::ilSLfc7K^Ml::fc^T;j£;ft5 0 0 n mCDftlcft LTftM$5 0 %/c m JiL± *-g> t CD\"? fo U , luIB5£®^ 1 . Of M°/olCiiS LtzJkAWli&(DN y O i%JkAWli&$: y 6 0°ce 7 2 L tz file felt & N O 3-;I JS<t<£>ll^2 0 0 p p mJiJ.T\"Cfe-S) > 5Jfl§®o