baber/WOPTO huggingface dataset:
Patent TW-201117188-A (TW)
Title: Direction of arrival estimation error reduction based on directivity pattern analysis with the adaptive cascaded separators and the neural network
Inventor: WANG JHING-FA
IPC: G10L11/00
Filed: 2009-11-12
Abstract: Direction of arrival (DoA) estimation via directivity pattern analysis has been proposed to locate the source signals for years. It uses the directional nulls existing in the directivity patterns to approximate the angles. However, traditional directivity pattern analysis often causes bias estimation resulting from ambiguous patterns. In this work, we present a system composed of the adaptive cascaded separators and the neural network, trying to minimize the effects of the obscure directional nulls. Besides, we also employ an adaptive algorithm to collect the refinement information generated from the neural network and update the separators iteratively. The results show that the system can take advantage of pattern recognition processing to eliminate curves, which may cause inappropriate directivity patterns.
Patent TW-201121030-A (TW)
Title: Packaging method for LED components with driver IC chips.
Inventor: PENG CHANG-YI
IPC: H01L25/16
Filed: 2009-12-04
Abstract: A packaging method for LED components with driver IC chips is provided. Electrically interconnected drive IC chips and at least a light-emitting diode chip are supported on the packaging surface side of the packaging base. After the driver IC chips and the in-out contacts are electrically connected, plastic body packaging at the packaging surface side proceeds, wherein the plastic body is to take the transparent polydimethylsiloxane auxiliary plastic of standard refractive index (Methyl Type) to add in the high refractive index (Phenyl Type) transparent polymethylphenylsiloxane main plastic to uniformly mix and stir into atomized plastic. Then, the atomized plastic is evacuated, injected into the syringe for another evacuation, and then poured into the packaging surface side of the packaging base. Finally, a baking process is carried out to make the atomized plastic cure to form an atomized plastic body. The atomized plastic body will produce a misted effect by the light penetration, thus preventing or reducing the driver IC chips to absorb the light emitting from the LED. In this case, the light generated from the LED chips does not detract, and the light distribution curve in the mixing of differently colored lights can be in regular order and stable.
Patent TW-201121078-A (TW)
Title: Solar wafer manufacturing process using new material to effectively reduce surface recombination rate.
Inventor: CHEN JING-HUA
IPC: H01L31/042
Filed: 2009-12-10
Abstract: Disclosed is a solar wafer manufacturing process by using new material to effectively reduce surface recombination rate, particularly when applying to the solar wafer manufacturing process, which proceeds, after removal of phosphate silicate glass, by the steps of epi-intrinsic silicon deposition followed by silicon nitride deposition. In this way, the addition of epi-intrinsic silicon can prolong the life of minority, provide excellent surface passivation of solar cells, effectively reduce surface recombination rate and dramatically increase the open- circuit voltage (VOC), thereby improving the solar cell characteristics.
Patent TW-201037265-A (TW)
Title: Method and apparatus for determining sheet position during production and handling
Inventor: CHEN XIN
IPC: G01B11/00
Filed: 2009-12-14
Abstract: A method for determining a position of a selected area of a sheet of material relative to a reference plane includes launching a first incident light beam at the selected area of the sheet of material such that the first incident light beam strikes the selected area at a first position and a first angle, thereby producing a first reflected light beam. A second incident light beam is launched at the selected area of the sheet of material such that the second incident light beam strikes the selected area at a second position and a second angle, thereby producing a second reflected light beam. The second position and second angle are different from the first position and first angle, respectively. The first reflected light beam and the second reflected light beam are intercepted at the reference plane. Information related to positions at which the reflected light beams were intercepted and angles at which the incident light beams were launched were received and correlated to the position of the selected area relative to the reference plane.
Patent TW-201038699-A (TW)
Title: Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
Inventor: SUGIURA YOSHIFUMI
IPC: C09J163/00
Filed: 2010-03-12
Abstract: Disclosed is a resin paste for die bonding, which has excellent adhesion strength to chips in a wide temperature range in the process of delivering the resin paste in a 13-stage and also has excellent die shear strength under high temperatures in a solder reflow process. The resin paste for die bonding comprises: (A) a polymer produced by reacting (al) a polymer of butadi. ene having a carboxyl group with (am a compound having an epoxy groups; (B) a thermosetting resin; and (C) a filler.
Patent TW-201132529-A (TW)
Title: Air injector, air injecting system and motor vehicle
Inventor: CONG YANG
IPC: F01D15/00
Filed: 2010-03-31
Abstract: The present invention relates an air injector comprising an air injecting body. The air injecting body has a cavity penetrating through an axial, and a heater disposed on the air injecting body. Furthermore, the heater is an electric heating filament wrapping around the air injecting body. The present invention also discloses an air injecting system with above air injector and a motor vehicle. If the air injector of the present invention is operated for along time, the air injector is not condensed and even frozen at very low temperatures. Thus, the air injector, a compression air engine and the motor vehicle could be stably activated
Patent TW-201135083-A (TW)
Title: Structure of screw
Inventor: Xu guo-tai
IPC: F16B25/02
Filed: 2010-04-13
Abstract: The present invention provides a structure of screw, which mainly is consisted of a head portion, a bar portion, a number of threads formed on the bar portion and axially extended, in which the rotation end on the tip of bar portion is thereon formed with a number of cutting teeth and a longitudinally-oriented debris-collection groove. Furthermore, a number of inter-threads teeth base portions rearwardly extended from the rotation end are annularly formed with slant protrusion ribs. Moreover, the rear ends of threads are formed with longitudinal protrusion ribs. Finally, the lower bottom of head portion is formed with a reverse slant grain reversely oriented with the slant protrusion ribs. The two sides of above-mentioned debris-collection groove are formed with a cutting face for receiving and collecting a large amount of wood debris from the rotation end and, through the leading of slant protrusion ribs, guiding excess wood debris to the longitudinal protrusion ribs to be discharged, thereby forming a screw with the advantages of power-saving drilling, rapid cutting, excellent discharge of debris, etc.
Patent TW-201137240-A (TW)
Title: Fan rotation speed control architecture
Inventor: LEE ANDREW
IPC: F04D27/00
Filed: 2010-04-20
Abstract: A fan rotation speed control architecture uses a power source to supply electricity required by fan operation and is used to control the rotation speed of a fan. The rotation speed control architecture comprises a connector connected with the power source and a switch device connected with the connector and the fan. The power source uses the connector to output at least a first drive electricity and a second drive electricity of different potentials, and the switch device acquires the first drive electricity and the second drive electricity and determines one drive electricity therefrom as output to the fan; as such, users can switch between the first drive electricity and the second drive electricity according to the cooling demand to adjust the rotation speed of the fan and simplify the complexity of conventional rotation speed adjustment circuits as well as reduce production costs.
Patent TW-201103880-A (TW)
Title: Electronic device and method of manufacturing the same
Inventor: OHMI TADAHIRO
IPC: H01B5/14
Filed: 2010-04-21
Abstract: It has been found out that, among various transparent conductive layers, a zinc oxide layer has a function of preventing diffusion of sodium. An electronic device is provided in which the zinc oxide layer is used as an electrode of the electronic device and as a diffusion prevention layer for preventing diffusion of sodium from a glass substrate.
Patent TW-201137758-A (TW)
Title: Encoding structure for dot pattern, its decoding method and electronic device
Inventor: WEI SHOU-TE
IPC: G06K7/10
Filed: 2010-04-27
Abstract: An encoding structure for a dot pattern is provided herein. The present invention includes at least a pattern unit which includes a unit identifier having a plurality of first dot patterns and a plurality first virtual lines and second virtual lines to pass through those first dot patterns, wherein those first dot patterns are partially or totally colinear and equidistant; and a data portion having a plurality of coding areas formed by those virtual lines intersecting and a start portion, wherein a second dot set on one quadrant, the first virtual line or the second virtual line at the coding area and the pattern arrangement of the start portion differs from that of each coding area. A decoding method and an electronic device for the above-mentioned encoding structure are also provided herein.
Patent TW-201110783-A (TW)
Title: Method of handling radio resource control connection and related communication device
Inventor: JEN YU-CHIH
IPC: H04W76/02
Filed: 2010-05-14
Abstract: A method of handling a radio resource control (RRC) connection for a network in a wireless communication system is provided. The method includes receiving from a mobile device in a RRC_CONNECTED mode a RRC connection reestablishment request message for requesting reestablishment of a RRC connection of the mobile device, and sending to the mobile device a message for rejecting the reestablishment request, whereby the mobile device does not enter a RRC_IDLE mode from the RRC_CONNECTED mode.
Patent TW-201107197-A (TW)
Title: Cover for vitreous silica crucible, vitreous silica crucible and handling method thereof
Inventor: SATO MASARU
IPC: C03B20/00
Filed: 2010-06-02
Abstract: Present invention provides means to avoid the entry of crucible precursor powder to crucible inner surface. Using such means surely avoids the entry of contaminants to vitreous silica crucible until its usage. Therefore, handling of crucible can be performed in non-polluted conditions. Present invention is a cover 3 mountable to an opening 2 of vitreous silica crucible 1, wherein the cover 3 has a flange part 4 adhering to outer periphery edge 2a of the opening 2.
Patent TW-201144649-A (TW)
Title: Clamping device of tablet computer
Inventor: HUANG WEN-HONG
IPC: F16M11/00
Filed: 2010-06-03
Abstract: A clamping device of tablet computer comprises a clamp element, which is composed of a front clamp seat and a rear clamp seat; a hanger element, which comprises corner coupler units and grating wires, and an adjusting section, which comprises an adjusting unit and a locking unit. The adjusting section is coupled to the corner coupler unit of the hanger element and the adjusting unit of the adjusting section is fit into the clamp element, and then the locking unit of the adjusting section is applied to secure the clamp element, the hanger element, and a tablet computer together for hanging on any wall surface. The clamping device of tablet computer allows a user to use the grating and the clamping function to easily clamp and fix tablet computers of various thicknesses and also to hang the tablet computer at any suitable angle and height.
Patent TW-201203584-A (TW)
Title: Rapid thermal process heating system and method thereof
Inventor: HUANG SHIEZEN
IPC: H01L31/18
Filed: 2010-07-02
Abstract: The present invention relates to a rapid thermal process (RTP) heating system and a method thereof. The present invention is for heating an intermediate product of a photovoltaic component. The intermediate product of the photovoltaic component includes a glass substrate, a molybdenum layer, and a forming light-absorbing layer. The heating system includes a chamber, a supporting platform arranged inside the chamber for heating a lower surface of the intermediate product of the photovoltaic component, at least one heating component arranged inside the chamber to emit infrared light for heating, most of the infrared light is reflected by the molybdenum layer in order to reduce heating of the glass substrate; a plurality of temperature sensors for sensing heat generated by the heating component and the supporting platform; and a temperature control device for controlling heat generated by the heating component and the supporting platform. According to the above arrangement, an upper surface and a lower surface of the intermediate product of the photovoltaic component can be heated in different temperatures respectively, such that the glass substrate arranged under the intermediate product of the photovoltaic component will not be deformed, and the molybdenum layer can be utilized for forming the light-absorbing layer.
Patent TW-201133763-A (TW)
Title: Techniques providing fiducial markers for failure analysis
Inventor: LAISNE MICHAEL
IPC: H01L23/544
Filed: 2010-07-08
Abstract: A semiconductor die includes a group of spacer cells within the semiconductor die. The spacer cells include fiducial markings therein. The fiducial markings can be located within a metal layer, a diffusion layer, a polysilicon layer, and/or a Shallow Trench Isolation (STI) structure.
Patent TW-201204205-A (TW)
Title: Carrier substrate amd method for making the same
Inventor: HUANG SHIH-JUNG
IPC: H05K3/32
Filed: 2010-07-12
Abstract: A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
Patent TW-201203705-A (TW)
Title: Multiband antenna and multiband antenna array having the same
Inventor: YAMAGUCHI TAIICHI
IPC: H01Q5/15
Filed: 2010-07-13
Abstract: A multiband antenna includes a ground element and a feeding element. The feeding element can resonate at first frequency band. The multiband further includes a parasitic radiation element operated at second frequency band and separated from the feeding element, and a parasitic element corresponding to the second frequency band being disposed between the feeding element and the parasitic radiation element.
Patent TW-201202521-A (TW)
Title: Fire-enduring steel plate
Inventor: SU MAO-HSUAN
IPC: E04C2/38
Filed: 2010-07-13
Abstract: A fire-enduring steel plate includes a first steel frame, a first steel plate, a supporting member, a second frame, a second plate and a complex plate. The first steel frame is fixed on a beam in a cross condition, and the beam may be an RC beam or a SRC beam of steel concrete structure. The first steel plate is provided with plural projected sections and placed on the first steel frame in a cross condition. The supporting member has its lower end tightly connected with the first steel frame and the first steel plate. The second steel frame is fixed with the upper end of the supporting member, and positioned in a cross condition with the first steel plate, and situated in the same direction with the first steel frame. The second steel frame has a longer length than or a same length as the first steel frame. The complex plate is placed on the second steel frame, having a fire-enduring layer to be connected with a steel plate thereon. Then a heat dissipating space is formed between the first steel plate and the second steel frame by means of the supporting element, possible to naturally dissipate heat the fire-enduring steel plate takes in, so that a building built with the fire-enduring steel plates can prevent outer heat from flowing into the building. In case of a fire, the heat of the first steel plate can be swiftly dissipated and reduce the heat that can be transmitted to the second steel frame. In this way, the first steel plate can be postponed in sagging down, enabling the building to avoid quick collapse and people and equipment in the building to escape serious damage.
Patent TW-201119959-A (TW)
Title: Glass ribbon and fabricating method thereof
Inventor: WADA MASANORI
IPC: C03B23/037
Filed: 2010-07-26
Abstract: A glass ribbon characterized in that the glass ribbon has a thickness of 100 μ m or less and a side of the glass ribbon has a protruded curved surface. The glass ribbon of this invention is made by heating and extending a base glass having a thickness of 2mm or less to form the glass ribbon having a thickness of 100 μ m or less.
Patent TW-201209543-A (TW)
Title: Computer enclosure
Inventor: CHEN YUN-LUNG
IPC: G06F1/16
Filed: 2010-08-16
Abstract: A computer enclosure includes a chassis and a power supply unit. The chassis includes a rear plate which defines an opening. A plurality of arc edges is formed on peripheral contour of the power supply unit. Corners of opening are chamfered into round corners. The power supply unit is moved from an outside of the power supply unit into the opening for the arc edges engaging with the round corners.
Patent TW-201115902-A (TW)
Title: Multiple induction electric motor and vehicle
Inventor: ROSS ROBERT
IPC: B60L50/12
Filed: 2010-08-31
Abstract: A novel multiple induction electric motor and vehicle that stores electrical power; provides a first and second direct current power input from the stored electrical power; separately produces first and second synchronized variable frequency alternating current control signal from the first and second direct current power inputs, respectively; produces first and second synchronized rotating magnetic fields responsive to the first and second variable frequency alternating current control signals, respectively; induces a first induced magnetic field around a conductor in a first inductive rotor responsive to the first rotating magnetic field; induces a second induced magnetic field around a conductor in a second inductive rotor responsive to the second rotating magnetic field; applies first and second rotational forces between the first and second rotating magnetic fields and the first and second induced magnetic fields to the shaft; and transmits the first and second rotational forces to a drive wheel.
Patent TW-201211560-A (TW)
Title: Fully on-chip temperature, process, and voltage sensor
Inventor: Chen shi-wen
IPC: G01R31/303
Filed: 2010-09-01
Abstract: The present invention provides a fully on-chip temperature, process, and voltage sensor, which includes a voltage sensor, a process sensor and a temperature sensor. The temperature sensor includes a bias current generator, a ring oscillator, a fixed pulse generator, an AND gate, and a first counter. The bias current generator generates an output current related to temperature according to the operating voltage of chip. The ring oscillator generates an oscillation signal according to the output current. The fixed pulse generator generates a fixed pulse signal. The AND gate is connected to the ring oscillator and the fixed pulse generator for performing a logic AND operation on the oscillation signal and the fixed pulse signal, and generating a temperature sensor signal.
Patent TW-201212405-A (TW)
Title: Motherboard and a receptacle for the same
Inventor: LU TUNG-KE
IPC: H01R13/62
Filed: 2010-09-06
Abstract: A receptacle for reception of a board includes a body, a first fastener and a second fastener. The first and second fasteners are pivoted at opposite ends of the body and constructed to fasten the opposite edges of the board respectively. In addition, the first and second fasteners are arranged in a staggered manner so that when the receptacle is in line with another identical receptacle and mounted on the motherboard, the two receptacles are relatively closer to each other.
Patent TW-201116649-A (TW)
Title: Metal copper film and fabricating method thereof, metal copper pattern and conductor wiring using the same, metal copper bump, heat conducting path, bonding material, and liquid composition
Inventor: NAKAKO HIDEO
IPC: H05K3/32
Filed: 2010-09-15
Abstract: A metal copper film excellent in adhesiveness to a substrate, low volume resistivity and metallicity in the deep section is provided. A method for fabricating a metal copper film is provided, in which the metal copper film is fabricated without damaging the substrate and is reduced till the deep section. The metal copper film is characterized by treating a copper particle stacked layer with gaseous formic acid and/or formaldehyde heated to above 120 DEG C, wherein the copper particle stacked layer is formed by containing both copper oxide and metallic transition metal or alloy or metallic element-containing transition metal complex. The copper oxide is preferably cuprous oxide and/or cupric oxide. The transition metal, alloy or metal complex is preferably metal selected from the groups consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, or alloy containing the said metal, or complex containing the said metallic element.
Patent TW-201133563-A (TW)
Title: Power devices with super junctions and associated methods of manufacturing
Inventor: DISNEY DONALD R
IPC: H01L29/06
Filed: 2010-09-30
Abstract: Power devices with super junctions and associated methods of manufacturing are disclosed herein. In one embodiment, a method for forming a power device includes forming an epitaxial layer on a substrate material and forming a trench in the epitaxial layer. The trench has a first sidewall, a second sidewall, and a bottom between the first and second sidewalls. The method also includes forming an insulation material on at least one of the first and second sidewalls of the trench and diffusing a dopant into the epitaxial layer via at least one of the first and second sidewalls of the trench via the insulation material.
Patent TW-201216577-A (TW)
Title: Electrical connector and plug and socket thereof
Inventor: DING YOU-XIANG
IPC: H01R24/20
Filed: 2010-10-07
Abstract: The present invention provides an electrical connector. The electrical connector includes a socket and a corresponding plug. The socket includes a first main body, and the plug includes a second main body. The first main body defines a first receiving space along the axis of the first main body. The sidewall of the first receiving space defines a helix groove. The helix groove includes at least one entrance formed on an end of the first receiving space. The plug further includes a positioning assembly mounted in the outer sidewall of the second main body. The diameter of the second main body is equal to that of the first receiving space. The positioning assembly includes a positioning ball rotatably connected to the second main body and partially extends out of the second main body. The extended part of the positioning ball can be placed into the helix groove through the entrance and can slide in the helix groove. The present invention further provides a related socket and a plug.