baber/WOPTO huggingface dataset:
Patent JP-H03120781-A (JP)
Title: Manufacture of printed-wiring board with through-hole
Inventor: KO MASAHIKO
IPC: C25D13/22
Filed: 1989-10-03
Abstract: PURPOSE:To enable a uniform light-sensitive resist film with needed thickness to be formed also within a through-hole by providing a height difference in a liquid pressure of left and right electrodeposition bathes of a printed-circuit board having the through-hole where the inside is copper-plated and by forming the light-sensitive film within the through-hole while allowing the electrodeposition liquid to flow within the through-hole. CONSTITUTION:Electrodeposition bathes 3a and 3b are connected through a pump P and an electrodeposition liquid within the electrodeposition bath 3a is forced to flow into the electrodeposition bath 3b in the arrow direction r. Thus, a liquid surface 9b within the electrodeposition bath 3b is located at the upper part from a liquid surface 9a within the electrodeposition bath 3b, thus producing height difference in the left and right liquid pressure of a printed-circuit board 6. As a result, the electrodeposition liquid flows within the through-hole 6a in the direction marked by an arrow s. In this state, DC voltage is applied from a DC power supply 8 and electrodeposition painting is performed. Then, the electrodeposition liquid flows through the through-hole 6a so that the electrodeposition liquid reaches all over the through-hole 6a, thus obtaining a printed-wiring board with the through-hole where a uniform light-sensitive resist film with a needed thickness.
Patent JP-H03122049-A (JP)
Title: Piezoelectric material
Inventor: ISAKI NOBORU
IPC: C04B35/49
Filed: 1989-10-03
Abstract: PURPOSE:To improve electromechanical coupling coefficient in radial direction, dielectric constant and piezoelectric constant by adding Sn, Zn and/or Bi to a specific ceramic composition. CONSTITUTION:A mixture is produced by mixing PbO, ZrO2, TiO2, MgO, Mb2O3, NiO and Ta2O5 at ratios to satisfy the formula (10<=a+b<=55; 30<=c<=50; 2.5<=d<=60; 0.01<=b/a<=2.0; a+b+c+d=100; a, b, c and d are mol%). The mixture is incorporated with 0.1-5 atom% of one or more kinds of metals selected from Sn, Zn and Bi and calcined at 900-1,100 deg.C. The calcination product is crushed, mixed with an organic binder, formed and baked at 1,200-1,300 deg.C.
Patent JP-H04135369-A (JP)
Title: Picture recorder
Inventor: HANEDA SATORU
IPC: H04N1/113
Filed: 1990-09-27
Abstract: PURPOSE:To prevent synchronizing nonuniformity from standing out by setting the number of light emitting parts and the number of faces in a rotary polygon mirror in specified relation. CONSTITUTION:A semiconductor laser array 11 is oscillated by a signal modulated by a picture density data and after laser beams are made parallel by a collimator lens 12, they are polarized by a polygon mirror 14 turning at fixed speed, turned to fine spots by an ftheta lens 15 and a cylindrical lens 16 and scans the peripheral surface of a uniformly charged photosensitive drum 21 as a recording medium. A number nb of the semiconductor lasers and a number nm of phases in the rotary polygon mirror 14 are set in the relation of nb=(i)Xnm [(i) is a natural number]. Thus, cycle nonuniformity can be prevented from standing out by interference between the inclination angle of the polygon mirror and a write cycle due to the laser array.
Patent JP-H02105542-A (JP)
Title: Manufacture of resin-sealed semiconductor device
Inventor: KAMI SUKEYUKI
IPC: H01L21/56
Filed: 1988-10-14
Abstract: PURPOSE:To increase moisture resistance by improving close contact property between a chip side surface and resin by placing a paste material on a die pad section, placing and scribing a semiconductor device on said die pad section, and applying a paste material on a die pad side surface and a chip side surface. CONSTITUTION:A 100-200mum paste material 5 is applied on a die pad 6, and a semiconductor device 4 is place on said die pad 6 and scribed. Hereby, the paste material 5 is applied also on the side surfaces of the semiconductor device 4 and of the side pad 6. The resulting sample, after hardened by heat-treatment, is electrically connected through a bonding wire 3 and sealed with molding resin 2 to or a semiconductor device. Hereby, internal stress is prevented from concentrating on the edge of the die pad section 6 and on the edge of the chip 4, which concentration might be produced by thermal shock upon mounting, and hence any package crack is prevented from occurring, to improve moisture resistance.
Patent JP-H0599009-A (JP)
Title: Control device for internal combustion engine provided with automatic transmission
Inventor: SEKIGUCHI HIDEKI
IPC: F16H61/10
Filed: 1991-10-07
Abstract: PURPOSE:To reduce transmission shock at the time of torque down controlling in the transmitting time. CONSTITUTION:Sampling 19 of a torque waveform of a transmission 2 is carried out (S1), judgment whether it is under a torque down controlling or not (S2), and an output shaft torque Tr obtained from the torque waveform executed under the sampling 19 is compared to a slice level SL (S3). In case that Tr is not larger than SL, a flag F0bit is set to be one (S5), while in case that Tr is larger than SL, a flag F1bit is set to be one (S6). Judgment wheter the flag F0bit is set to be one or not is carried out (S4). When it is set to be one, a set value GR0 of a gear ratio with which the torque down control is completed is changed (S7). Judgment whether the flag F0bit is set to be one or not is carried out (S9). When it is set to be one, a set value GR of the gear ratio which the torque down control is complete is changed (S10).
Patent JP-2001083858-A (JP)
Title: Process cartridge
Inventor: ENOKI SHIGEKAZU
IPC: G03G21/16
Filed: 1999-09-13
Abstract: PROBLEM TO BE SOLVED: To prevent the occurrence of image failure by preventing a photoreceptive drum and a developing roller from being excessively brought into press-contact even though the expansion and deformation of a constituting part due to heat are caused in a process cartridge constituted of connecting a drum unit and a developing unit. SOLUTION: The side plate 100 of the drum unit 10 is plurally divided in a direction orthogonal with a plate thickness direction, and side plate elements 100a and 100b are connected with each other through a flexible member 200 consisting of a rubber elastic body. In the case that the expansion and deformation of a processing cartridge constituting part due to heat generation in accordance with the operation of an image forming device are caused, the member 200 constituting the side plate 10 of the drum unit 10 is elastically deformed, so that an interval change between the photoreceptive drum 12 and a devel oping roller 18 is absorbed. Since the side plate 100 itself has elasticity, the need of separately securing a space for providing the flexible member is eliminated.  The member 200 has a structure by which it is fitted in the elements 100a and 100b so as to be pulled out and inserted in the plate thickness direction and not to be pulled out and inserted in the direction orthogonal with the plate thickness direction.
Patent JP-H04137671-A (JP)
Title: Manufacture of semiconductor acceleration sensor
Inventor: SAITO TOSHIO
IPC: G01P15/18
Filed: 1990-09-28
Abstract: PURPOSE:To obtain a three-dimensional acceleration sensor durable for practical use by using a normal photolithography technique by previously forming an etching pattern to be necessary in later steps, a diffused layer, a pad, etc., before a beam to be elastically deformed is formed upon reception of an acceleration. CONSTITUTION:Pad leading diffused layers 5a, 5b, a connecting diffused layer 4a, and bonding pads 6a, 6b are formed on an Si semiconductor substrate 20 by using a normal photolithography technique. Then, after a silicon nitride film (Si3N4) film 22 is formed on the rear surface, it is patterned, and an opening 23 for etching the substrate is provided. Then, SiO2 mask layers are formed on the front and rear surfaces of the substrate patterned in a predetermined shape, the part of the silicon surface is exposed to form a patterned part 26. Thereafter, the substrate is etched, and a cantilever beam structure of an acceleration sensor is formed. Subsequently, the SiO2 films of the front and rear surfaces are also used as diffusion masks, the sidewall of the beam is diffused, and side resistors 31a, 31b (piezo resistors R1, R2) are formed.
Patent JP-S62123072-A (JP)
Inventor: MIYAHARA KENICHIRO
IPC: C04B35/58
Filed: 1985-11-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H08125179-A (JP)
Title: Vertical fet and fabrication thereof
Inventor: SHINOHARA MAMORU
IPC: H01L29/78
Filed: 1994-10-25
Abstract: PURPOSE: To obtain a vertical FET for constituting an integrated circuit having high current capacity and good characteristics through a simple process by providing a channel region in the vertical direction on the inner surface layer of side wall at a vertical level difference on the surface of a semiconductor substrate and forming one source-drain diffusion region on the upper surface at the level difference while forming the other source-drain diffusion region on the lower surface thereof. CONSTITUTION: A protrusion 3 having vertical side wall 5 is formed on the surface of a semiconductor substrate 2 to provide a protruding plane 3a and a recessed plane 2a separated by the side wall 5. The semiconductor substrate 2 having level difference is then implanted vertically with n type impurities and n type impurity implanted layers 20a, 21a are formed. Impurities are implanted simultaneously into the protruding and recessed planes 3a, 2a to form a source-drain diffusion region at once. Subsequently, the impurities are activated through heat treatment and diffused to form a source diffusion region 20 and a drain diffusion region 21. The effective channel length depends on the amount of heat treatment and the amount of level difference. Finally, the channel region 22 is connected electrically with the semiconductor substrate 2.
Patent JP-H01102851-A (JP)
Title: Electrode for secondary battery
Inventor: SEKIGUCHI YOITSU
IPC: H01M4/137
Filed: 1987-10-15
Abstract: PURPOSE:To make a plastic battery light in weight by forming an electricity collecting plate from a carbonaceous conductive material. CONSTITUTION:An electricity collecting plate is used, which consists of a carbonaceous conductive material. This carbonaceous conductive material shall be electroconductive and contain carbon as main component-for ex., graphite, resin impregnated graphite, carbon, porous graphite, etc. The apparent density of the carbonaceous conductive material shall normally range 0.5-1.8g/cm<2>, which is much less than the values of Ni plate and NESA glass plate amounting to 8.8 and 2.4g/cm<2>, respectively. Thereby the weight is decreased to 75-95% from the case with the electrode using metal to electricity collecting plate. Also the weight is decreased to 20-80% from the case with the electrode using NESA glass plate to electricity collecting plate.
Patent JP-H11100495-A (JP)
Title: Resin composition
Inventor: HIRONAKA KATSUHIKO
IPC: C08K3/00
Filed: 1997-09-25
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition improved in molding processability while retaining the heat resistance inherent in PEN resin. SOLUTION: This resin composition comprises 100 pts.wt. of a polyester resin blend prepared by compounding (A) polyethylene-2,6- naphthalenedicarboxylate with (B) polytetramethylene-2,6- naphthalenedicarboxylate so as to be 50-80 wt.% in the proportion of the component A based on a total of 100 wt.% of the components A and B, (C) 1-10 pts.wt. of a polyalkylene glycol or a derivative thereof wherein at least one end thereof is a carboxylic ester and/or alkyl ether, (D) 5-60 pts.wt. of a fibrous reinforcing material, and (E) 0.01-10 pts.wt. of a crystal nucleating agent.
Patent JP-H07115248-A (JP)
Title: Semiconductor laser
Inventor: SAITO TETSUYA
IPC: H01S5/00
Filed: 1993-10-19
Abstract: PURPOSE:To detect the wavelength fluctuation of oscillation of a semiconductor laser without using an external measuring instrument. CONSTITUTION:A laser beam 4 is turned by a ball lens 5 into an approximately parallel beam of light which are deflected. A light deflecting device 6 which can change this deflecting angle by the wavelength of an incident laser beam, and a position detecting device 7, in which the deflected parallel beam of light enter and an ouptut changes differentially depending on the position of incident beam, are provided on a laser diode 1 which impresses current on an electrode 1 and emits laser beams 3 and 4 from openings on both sides. From the differential output of the position detecting device, the wavelength fluctuation of the laser diode 1 is detected and the oscillation strength of the laser diode 1 is detected from the sum of both outputs of the position detecting device.
Patent JP-H03120819-A (JP)
Title: Laser cvd equipment
Inventor: YOSHINO YOICHI
IPC: H01L21/3205
Filed: 1989-10-04
Abstract: PURPOSE:To locally form an insulating film at a part subjected to laser CVD and protect the part, by installing an insulating material supplying source and a nozzle for spreading an insulating film on the surface of a specimen, irradiating and heating the spread insulating film with laser light, and drying and solidifying it. CONSTITUTION:An equipment forming a thin metal film on a specimen substrate 17 by irradiating the specimen substrate 17 coming into contact with metal compound vapor and thermally decomposing the metal compound vapor is constituted in a manner in which an insulating material supplying source 23 and a nozzle 21 for spreading an insulating film on the surface of the specimen 17 are installed, and the spread insulating film is dried and solidified by irradiating and heating the film with the above mentioned laser light. For example, the insulating material supplying source 23 is filled with liquid type insulating material, and in case of need, a specified amount of the insulating material can be supplied to the specimen from the nozzle 21. In the spreading process of the insulating film, the desired insulating material is dripped on the part subjected to laser CVD, and a spread insulating film 35 is formed. By using the laser light outputted from a laser light source 2, the above-mentioned spread insulating film part is subjected to convergent irradiation, and is heated, dried, and solidified.
Patent JP-S60194190-A (JP)
Inventor: JIEEMUZU IISUTON HENDORITSUKUS
IPC: D06P5/00
Filed: 1984-12-10
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09180144-A (JP)
Title: Method for seeking center of reference burst
Inventor: ANDORIYUU BII MIRAADO JIYUNIA
IPC: G11B21/10
Filed: 1996-10-01
Abstract: PROBLEM TO BE SOLVED: To provide a method digitally detecting the center of a reference burst and making it possible to precisely position a magnetic tape head to any one of plural track positions. SOLUTION: The magnetic head 10 is stepped downward from an initial position 34 above whole reference bursts 24, 26 until a forward direction reference burst signal 24 is detected by a digital detector. Then, the head 10 is stepped back to the initial position 34, and then, is stepped downward until traversing the forward direction reference burst 24. The center of the detected reference burst 24 is decided by adding a step position existing on the detected reference burst 24 and calculating a mean position. The center of the detected backward direction reference burst 26 is detected by a similar manner excepting that the necessity that the head 10 is stepped back upward toward the peak part edge 14 of the tape after the backward reference burst 26 is detected first is eliminated.
Patent JP-H0687619-A (JP)
Title: Production of glass lens
Inventor: NAGAO SHUICHI
IPC: C03B11/00
Filed: 1992-09-02
Abstract: PURPOSE:To surely leave a formed lens in either a lower mold or an upper mold when a forming glass material is heated and pressed to form the lens between 1st and 2nd molds by making to have a specified relationship between the thermal expansion coefficients of each mold and glass material according to the case of being formed from either the projected face or recessed face. CONSTITUTION:An upper mold 11 and a lower mold 13 each are formed of heat resistant ceramics, super hard material, metal, etc. In the figure, a transferring face 11a of the upper face 11 is a recessed face. As a result, a protruded face is formed on a formed lens 21. Here when the protruded face is formed, the relations, alpha1<alpha0 and (alpha0-alpha2)<(alpha0-alpha1)(alpha1 is thermal expansion coefficient of upper mold, alpha2 is thermal expansion coefficient of lower mold, alpha0 is thermal expansion coefficient of forming glass material at opening temperature of upper and lower molds), are satisfied. When a protruded face is formed on the formed lens 21 by a transferring face 13a of the lower mold 13, the relation, alpha1<alpha2<alpha3, is preferable. Contrary, when a recessed face is formed, the relations, alpha1>alpha0 and (alpha1-alpha0)>(alpha2-alpha0), are satisfied.
Patent JP-H02107735-A (JP)
Title: Ni-fe alloy
Inventor: SHISHIDO HIROSHI
IPC: C22C19/05
Filed: 1988-10-18
Abstract: PURPOSE:To reduce subscales in the title alloy at the time of hot treatment and to improve its yield by specifying Ni, C, Cr, Al, Mn, S and Fe. CONSTITUTION:The Ni-Fe alloy is formed with the compsn. constituted of, by weight, 35 to 85% Ni, <=0.01% C, 0.5 to 3% Cr, 0.05 to 1.5% Al, <=3% Mn and <=0.005% S as well as >=100Mn/S and the balance Fe. In the above alloy, subscales at the time of hot treatment are reduced and yield is improved. Furthermore, application of an oxidation preventing treatment agent or the like are eliminated.
Patent JP-H07114730-A (JP)
Title: Production of magnetic recording medium
Inventor: KUREMATSU MICHIO
IPC: G11B5/842
Filed: 1993-10-19
Abstract: PURPOSE:To provide a magnetic recording medium capable of accurately recording and reproducing a digital signal and excellent in durability. CONSTITUTION:A compsn. based on ferromagnetic powder, a binder and 40-70 pts.wt. abrasive material basing on 100 pts.wt. of the ferro-magnetic powder is kneaded and diluted with a solvent and then dispersed to prepare a magnetic coating material and a magnetic recording medium is produced by coating a nonmagnetic substrate with the coating material. In this method, the total amt. of binders added at the time of the kneading and dilution is regulated to 90-100wt.% of the total amt. of the binders in the coating material.
Patent JP-S61138192-A (JP)
Title: Photoelectric switch
Inventor: SAMUZAWA AKIRA
IPC: G01V8/12
Filed: 1984-12-10
Abstract: PURPOSE:To obtain a photoelectric switch of a pulse modulation type without spoiling the ease of handling and without being affected by the other photoelectric switch in proximity thereto by outputting the pulse which has the same frequency as the frequency of the pulse signal based on interference pulse light and is synchronized with the pulse signal and applying such output to a PLL. CONSTITUTION:A pulse sepn. circuit 16 separates the pulse having the same frequency as the frequency of the pulse signal based on the reception of the interference pulse light and synchronized with the pulse signal from the detection signal of a photodetector 12 and inputs said pulse to the PLL consisting of binary frequency dividing circuits 17a, 17b, a phase detecting circuit 18, an LPF19 and a voltage control type pulse oscillator 20. The phase control of the output from the oscillator 20 is thereupon executed so that the oscillation frequency of the oscillator 20 is made coincident with the period of the interference pulse light and that the projection timing of the self-projection light does not overlap on the projection timing of the interference pulse light. A light emitting element 11 is driven by the oscillation output of the oscillator 20 and a synchronizing gate circuit 15 to which the detection signal of the photodetector 12 is applied is controlled.
Patent JP-S63116019-A (JP)
Title: Hot water supplier
Inventor: KATSUHARA HIROTOSHI
IPC: F23N5/14
Filed: 1986-10-31
Abstract: PURPOSE:To attempt to reduce noises by fan by burning a burner during supplying hot water, and at the same time rotating a fan to supply combustion air to the burner, and driving the fan when the stopping of the hot water supply is detected, until the water temperature at the outlet port section of a heat exchanger falls to a set temperature. CONSTITUTION:If a switch 3 for both start and stop is turned ON during supplying hot water, electric current is passed through a self-holding type solenoid 27 through a water plug control circuit 30 to open a pilot valve 25 and also open a water plug 17. Then a fan 29 is rotated by a combustion control circuit 34 and then an ignition device 33 is operated, and at the same time a solenoid valve 15 is opened to supply gas to a gas burner 10 for combustion. This ignition is detected by a flame detection circuit 31, and the operation of the ignition device 33 is stopped, and hot water is discharged from a hot water discharge pipe 38. For stopping the hot water discharge, a switch 3 is operated and electric current is passed through a solenoid 27 by a water plug control circuit 30 to close the water plug 17. Then, the output of a hot water temperature sensor 35 and a set temperature which has been set beforehand are compared by a comparison circuit 35 and if the former is below the set temperature, then the air supply fan 29 is stopped.
Patent JP-H06112669-A (JP)
Title: Method of assembling electronic equipment
Inventor: YONE RYUICHI
IPC: H01R4/48
Filed: 1992-09-30
Abstract: PURPOSE:To easily perform the connection between a speaker and a printed board. CONSTITUTION:A chassis 5 is arranged on a speaker 3 which has contacts 13 and 14. Conductive coil springs 6 and 7 are inserted into the spring insertion holes 21 and 22 provided at the chassis 5, and the bottoms of the coil springs 6 and 7 are brought into contact with the contacts 13 and 14 of the speaker 3. A printed board 4 is arranged on the chassis 5, and the contacts 15 and 16 provided on the printed board 4 are brought into contact with the tops of the coil springs 6 and 7.
Patent JP-S63115160-A (JP)
Title: Silver halide photographic sensitive material
Inventor: YOSHIDA KAZUHIRO
IPC: G03C1/12
Filed: 1986-10-31
Abstract: PURPOSE:To enhance sensitivity to infrared rays and dot quality by using a combination of 2 kinds of infrared sensitizing dyes for a photosensitive silver halide emulsion layer. CONSTITUTION:The photosensitive silver halide emulsion layer formed on a support contains a combination of the sensitizing dye having a maximum spectral sensitization wavelength of >=780nm and the sensitizing dye having that of <=780nm, and silver chlorobromide or chloroiodide grains containing at least >=50mol% silver chloride are used as silver halide grains, thus permitting the obtained photographic sensitive material to be not liable to be affected by variance of laser beam wavelength, and to have high sensitivity to infrared rays and high dot quality.