baber/WOPTO huggingface dataset:
Patent TW-200731330-A (TW)
Title: Coating and developing apparatus
Inventor: MATSUOKA NOBUAKI
IPC: G03F7/16
Filed: 2006-03-10
Abstract: After conveying the substrate carried in to the career block to a processing block and forming an coating film, the coating and developing apparatus convey the substrate to the exposure equipment through an interface block, carry out development processing of the substrate after the exposure which has returned through the interface block by the processing block, and are conveyed to the career block. The coating and developing apparatus comprises the conveyance means which is stacked on the block for the coating film formation and the block for development, and carries out direct conveyance of the substrate on which the coating film was formed from the career block side to the interface block side. Since the substrate for inspection can be conveyed to exposure equipment even if the block for coating film formation and the block for development are maintaining with constituting, the state of exposure equipment can be inspected.
Patent TW-200700436-A (TW)
Title: Production of water-absorbing polymeric particles
Inventor: RIEGEL ULRICH
IPC: C08J3/12
Filed: 2006-03-30
Abstract: The present invention relates to a process for producing water-absorbing polymeric particles by polymerizing a monomer solution, which comprises removing the polymer gel from the reactor when the gel temperature is at least 50 DEG C and the monomer conversion is not more than 90 mol%, and also to a process for producing hygiene articles.
Patent TW-200737109-A (TW)
Title: Display module
Inventor: LIU PO-YUAN
IPC: G09G3/36
Filed: 2006-03-30
Abstract: A display module is disclosed, which has a printed circuit board, a display panel, a plurality of data driver chips and a scan driver circuit. The display panel has a substrate, a plurality of scan lines, and a plurality of data lines. The scan lines are disposed on the substrate, and the data lines perpendicular to the scan lines are disposed on the substrate. The data driver chips, which are cascaded and mounted on the substrate, are electrically connected to the data lines and the printed circuit board. The scan driver circuit is formed on the substrate and electrically connected to the scan lines and the printed circuit board.
Patent TW-200644234-A (TW)
Title: Method for making a semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction
Inventor: MEARS ROBERT J
IPC: H01L29/10
Filed: 2006-03-30
Abstract: A method for making a semiconductor device may include forming a superlattice comprising a plurality of stacked groups of layers. Each group of layers of the superlattice may include a plurality of stacked base silicon monolayers defining a base silicon portion and an energy band-modifying layer thereon. The energy band-modifying layer may include at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions. The method may further include forming a semiconductor layer adjacent the superlattice and comprising at least one first region therein including a first conductivity type dopant. At least one second region may be formed in the superlattice including a second conductivity type dopant to define, with the at least one first region, at least one semiconductor junction.
Patent TW-200735846-A (TW)
Title: Data process electronic device with dual CPU
Inventor: LIN HAN-XIN
IPC: G06F15/00
Filed: 2006-03-31
Abstract: The present invention is a data process electronic device with dual CPU, comprising a primary CPU and a secondary CPU. The primary CPU is connected with the secondary CPU. The primary CPU is a low power CPU which is used for operating primary process needed long time. The secondary CPU is a more powerful CPU in calculation than primary CPU, and the secondary CPU is used for operating the secondary process needed fast calculation. The primary CPU can transmit an interception signal to the secondary CPU for driving the secondary CPU to operate the secondary process. The secondary CPU can transmit an interception signal to primary CPU for driving the primary CPU to operate the transmission of the data processed by the primary process.
Patent TW-200738986-A (TW)
Title: Discharge head sealable instantaneously
Inventor: YANG JIN-ZHEN
IPC: F16K11/06
Filed: 2006-04-06
Abstract: The present invention relates to a discharge head sealable instantaneously, comprising discharge pipe connected to a discharge device such as a faucet; a lining tube disposed in the discharge pipe; and a switch valve axially disposed in the discharge pipe and the lining tube. The switch valve further comprises a slidable pole having a valve piece leaning against an enclosed lining tube and a resilient spring for ejecting the valve block from an enclosed channel; with the design of the resilient spring, the valve block may be immediately ejected from the lining tube so that water is discharged from the discharge pipe when the discharge is to be stopped, effectively increasing the safety of the discharge head and reducing the waste of water.
Patent TW-200702550-A (TW)
Title: A driven mechanism
Inventor: TSUKADA YOSHIAKI
IPC: F02B77/14
Filed: 2006-05-08
Abstract: To prevent impulsive force from acting on a gear engaging surface of a gear-type transmission method, when the operation at a predetermined operation position of a driven member is regulated, without affecting the operation controllability of the driven member, in a driving device that includes the gear-type transmission means provided between the driven member, which is supported so as to be freely operated on a casing, on which an electric motor is mounted, and the electric motor, and an operation position regulation method provided on the casing to regulate the operation position of the driven member. The operation position regulation method 82 comprises a stopper 83 that abuts against the driven member 71 at its predetermined operating position of the driven member 71 is supported in a floating state to a casing 68 with an elastic member 84, provided between the stopper and the casing 68.
Patent TW-200706172-A (TW)
Title: Closure system and method of enclosing a liquid material in a vial
Inventor: THILLY JACQUES
IPC: A61J1/06
Filed: 2006-05-15
Abstract: A closure system for a vial comprising: an elastic closure part to engage the mouth opening, a clamp part to hold the closure part in a closing relationship with the mouth opening, the clamp part defining an upper aperture through which a region of the upper surface of the closure part is exposed when the clamp part is engaged with the vial, a cover part to engage the clamp part to cover exposed region, the cover part engaging with the closure part to provide two or more concentric ring-shaped seals, at least part of the cover part being removable from the vial to allow access to the closure.
Patent TW-200803698-A (TW)
Title: Heat-dissipating device
Inventor: ZHOU HE-KANG
IPC: H05K7/20
Filed: 2006-06-02
Abstract: The present invention relates to a heat-dissipating device. The heat-dissipating device includes at least one heat-dissipating fin. A plurality of holes is disposed on the heat-dissipating fin. The hole's inner area is larger than the end-section's area. The invention can effectively dissipate heat by increasing the heat-dissipating area and speedup the air's flow, which also can make the device small.
Patent TW-200735227-A (TW)
Title: Method for manufacturing electronic devices integrated in a semiconductor substrate and corresponding devices
Inventor: FRISINA FERRUCCIO
IPC: H01L21/336
Filed: 2006-06-22
Abstract: Method for manufacturing electronic devices on a semiconductor substrate (1, 1a; 10, 11) with forbidden wide band comprising the steps of: forming a screening structure (3a, 20) on said semiconductor substrate (1, 1a; 10, 11) comprising at least a dielectric layer (2, 20) which leaves a plurality of areas of said semiconductor substrate (1, 1a; 10, 11) exposed, carrying out at least a ion implantation of a first type of dopant in said semiconductor substrate (1, 1a; 10, 11) to form at least a first implanted region (4, 40), carrying out at least a ion implantation of a second type of dopant in said semiconductor substrate (1, 1a; 10, 11) to form at least a second implanted region (6, 6c; 60, 61) inside said at least a first implanted region (4, 40), carrying out an activation thermal process of the first type and second type of dopant with low thermal budget suitable to complete said formation of said at least first and second implanted regions (4, 40; 6, 60).
Patent TW-200707051-A (TW)
Title: Array substrate, method of manufacturing the same and liquid crystal display panel having the same
Inventor: MOON YEON-KYU
IPC: H01L29/786
Filed: 2006-06-30
Abstract: An array substrate includes a display region having a plurality of pixel parts and a peripheral region surrounding the display region. The array substrate also includes a switching element, a pixel element, a metal pattern, a pixel electrode pattern and an alignment layer. The switching element is in each of the pixel parts. The switching element is electrically connected to gate and source lines. The pixel electrode is electrically connected to the switching element. The metal pattern part is in the peripheral region. The pixel electrode pattern part is on the metal pattern part. The alignment layer is on the pixel electrode and the pixel electrode pattern part. Therefore, the array substrate may be securely combined with an alignment substrate to improve an impact resistance of a display device.
Patent TW-200715792-A (TW)
Title: Method to determine a scheduling priority value for a user data connection based on a quality of service requirement
Inventor: WANG FAN
IPC: H04L29/08
Filed: 2006-07-18
Abstract: A method to provide a nominal best effort data rate based on a Quality of Service (QoS) requirement of a user data connection, the method comprising assigning (105) a service priority based on the QoS requirement, and assigning (110) the nominal best effort data rate for the service priority using a predetermined function. Further, it comprises of a method to determine a scheduling priority value for a user data connection by providing a relative fairness. Furthermore, the method comprises a method to satisfy a delay requirement for a delay sensitive data connection through a scheduling.
Patent TW-200740849-A (TW)
Title: Dual variable domain immunoglobulin and uses thereof
Inventor: WU CHENG-BIN
IPC: A61K49/00
Filed: 2006-08-18
Abstract: The present invention relates to engineered multivalent and multispecific binding proteins, methods of making, and specifically to their uses in the prevention and/or treatment of acute and chronic inflammatory and other diseases.
Patent TW-200803761-A (TW)
Title: Dietary supplement energy-providing to skeletal muscles
Inventor: GAETANI FRANCO
IPC: A23L33/15
Filed: 2006-08-21
Abstract: Dietary supplements - providing energy and strengthening skeletal muscles and facilitating skeletal muscles ability to sustain prolonged periods of physical activity - containing propionyl-L-carnitine or one of its salts, coenzyme Q10, nicotinamide, riboflavin, pantothenic acid and optionally other components such as amino acids and creatines.
Patent TW-200718008-A (TW)
Title: Adjusted frequency temperature coefficient resonator
Inventor: RUBY RICHARD C
IPC: H03H9/19
Filed: 2006-08-30
Abstract: A temperature compensated pair of resonators. The temperature compensated pair of resonators comprises a first resonator configured to resonate at a first frequency and having a first frequency temperature coefficient and a second resonator configured to resonate at a second frequency and having a second frequency temperature coefficient. The second frequency is greater than the first frequency; the second frequency temperature coefficient is less than the first frequency temperature coefficient; and the first and the second resonators are fabricated on a common substrate.
Patent TW-200710841-A (TW)
Title: Compatible optical pickup and optical recording and/or reproducing apparatus employing the same
Inventor: YOO JANG-HOON
IPC: G11B7/12
Filed: 2006-09-01
Abstract: An optical pickup and an optical recording and/or reproducing apparatus include a light source which emits light having a first wavelength, an objective lens that focuses incident light on an information storage medium, a polarization changer which changes the light with the first wavelength incident from the light source into light beams with first and second polarizations that are orthogonal to each other, a polarization hologram element which has a varying refractive power according to the polarization of the light with the first wavelength that passes through the polarization changer, a photodetector which receives light after the light has been emitted from the light source, focused on the information storage medium by the objective lens, and reflected by the information storage medium, and an optical path changer which guides the light reflected by the information storage medium toward the photodetector, wherein the optical pickup can compatibly adopt the first information storage medium and a second information storage medium which has a different thickness from the first information storage medium.
Patent TW-200813152-A (TW)
Title: Epoxy resin composite and die bonding agent containing the same
Inventor: HONDA TSUYOSHI
IPC: C08L63/00
Filed: 2006-09-12
Abstract: An epoxy resin composite and a die bonding agent for semiconductor containing the epoxy resin composite are provided in the present invention. The epoxy resin composite can form a stable B stage and provide a cured product without void. The epoxy resin composite includes: (A) epoxy resin; (B) epoxy resin curing agent, wherein the ratio of a reactive group equivalent of the epoxy resin curing agent and the epoxy group equivalent of the epoxy resin is 0.8-1.25; (C) thermoplastic resin particle which is solid at 25 DEG C;, wherein the content of the thermoplastic resin particle is 3 mass part-60 mass part when the sum of (A) epoxy resin and (B) epoxy resin curing agent is 100 mass part; and (D) epoxy resin curing accelerator, wherein the content of the epoxy resin curing accelerator is 0.1 mass part~10 mass part when the sum of (A) epoxy resin and (B) epoxy resin curing agent is 100 mass part.
Patent TW-200725116-A (TW)
Title: Direct type back-light device
Inventor: TSUKADA KEISUKE
IPC: G02F1/1335
Filed: 2006-09-15
Abstract: A direct type back-light device comprising: a reflector, liner light sources which are set in the parallel, and a light diffusion plate in the state that they are disposed in turn, in which the light diffusion plate has arranged concave or convex structure units composed of three slopes or more on at least one main surface thereof, the main surface having the structure units has maximum surface roughness Rz of 1000 μm or less, and in which the light diffusion plate comprises a portion that (1) two or more of lines having dip Xn (unit is [DEG]; n is suffix designating each slope) different from each other, in which the line shows the each slope n of the structure unit, are in cross section of the light diffusion plate at cut line in the orthogonal direction to lengthwise of the liner light source and in right above area of the light diffusion plate corresponding to area between center axes of the adjoining liner light sources, and (2) all of the dip Xn relate to average interval aL between the center axes of the adjoining liner light source and minimum distance bL between center axis of the liner light source and main surface proximal to the liner light source of the light diffusion plate as the formula: 12.5-10 x (bL / aL) < Xn< 85 - 25 x (bL / aL).
Patent TW-200816430-A (TW)
Title: Lead-on-chip package with warpage resistance
Inventor: FAN WEN-JENG
IPC: H01L23/48
Filed: 2006-09-26
Abstract: A lead-on-chip package with warpage resistance, mainly including a plurality of leads of a lead-on-chip (LOC) leadframe, a chip, a plurality of bonding wires electrically connecting the chip to the leads, at least a warpage-resistant component and a molding compound. As a "pick and place" method for chip attachment, the warpage-resistant component is attached to the lower surfaces of the leads. The molding compound encapsulates the chip, the bonding wires, inner portions of the leads, and the warpage-resistant component. Especially, the warpage-resistant component is located inside and adjacent two short sides of the molding compound. By the warpage-resistant component, the package warpage caused by curing shrinkage of the molding compound will be lessened. In one embodiment, the warpage-resistant component may be a dummy chip.
Patent TW-200717820-A (TW)
Title: Array substrate for a display panel, method of manufacturing the same, display panel having the same and liquid crystal display device having the same
Inventor: SHIN WON-SUK
IPC: H01L29/786
Filed: 2006-09-27
Abstract: An array substrate for a display panel includes a base substrate, a signal-applying module, a first electrode, a second electrode, and a protective layer. The signal-applying module is disposed on the base substrate and includes an output terminal to output a data signal. The first electrode is disposed on the base substrate and electrically connected to the output terminal. The second electrode includes silver (Ag), and is disposed on and electrically connected to the first electrode. The protective layer is disposed on the second electrode to cover a portion of the second electrode. Thus, adhesion of the second electrode to a lower layer may be improved, and yellowishness of the second electrode may be prevented.
Patent TW-200800214-A (TW)
Title: Novel pyrazolopyrimidines as cyclin dependent kinase inhibitors
Inventor: PARUCH KAMIL
IPC: A61K31/519
Filed: 2006-10-04
Abstract: In its many embodiments, the present invention provides a class of pyrazolo[1,5-a]pyrimidine compounds as inhibitors of cyclin dependent kinases (CDKs), methods of preparing such compounds, pharmaceutical compositions containing one or more such compounds, methods of preparing pharmaceutical formulations comprising one or more such compounds, and methods of treatment, prevention, inhibition, or amelioration of one or more diseases associated with the CDKs using such compounds or pharmaceutical compositions.
Patent TW-200820010-A (TW)
Title: Remote firmware updating system and the method thereof
Inventor: KUO MING-I
IPC: G06F9/445
Filed: 2006-10-16
Abstract: Remote firmware updating system and method are used to provide a remote computer to control a local computer to execute firmware update through network communication. The remote computer stores firmware update data files. A trigger module gives the remote computer a firmware update instruction and orders it to deliver the instruction and firmware update data file to a local computer via network communication. Then, a control module lets the local computer respond the firmware update instruction and receive the firmware update data file and further controls the local computer to execute the update operation. Therefore, a simple and safe firmware update way is provided.
Patent TW-200720602-A (TW)
Title: Hot runner nozzle heater and methods of manufacture thereof
Inventor: RUSSEGGER ELIAS
IPC: F24H8/00
Filed: 2006-10-16
Abstract: A hot runner nozzle heater is provided that includes a sleeve defining a slot extending along a length of the sleeve. A first dielectric layer is disposed over an outer surface of the sleeve, and a resistive element layer is disposed over the first dielectric layer, wherein the resistive element layer defines a resistive circuit pattern that is preferably formed by a laser trimming process. A pair of terminal leads are secured to a portion of the resistive element layer thus defining a termination area, and the termination area is positioned proximate the slot and away from the proximal end and the distal end of the sleeve. A second dielectric layer is disposed over the resistive element layer but not over the termination area, a third dielectric layer is disposed over the termination area, and a protective layer disposed over the second dielectric layer and the third dielectric layer.
Patent TW-200819369-A (TW)
Title: Continuous conveying device
Inventor: Qiu hong-ru
IPC: B65G13/00
Filed: 2006-10-20
Abstract: The present invention relates to a continuous conveying device, comprising a plurality of first rollers and a second roller, wherein the second roller is arranged in front of or behind the plurality of the first roller and the first rollers and the second roller are of different rotational speeds. As such, the first rollers and the second roller are provided with different rotational speeds to enhance smoothness of conveyance of work pieces by the continuous conveying device. Or alternatively, the present invention may comprise, in sequence, a first conveying device, a second conveying device, and a third conveying device, wherein the first conveying device and the second conveying device are of different conveying speeds. Due to the second conveying device that is of a different conveying speed, smoothness of conveyance of work pieces by the continuous conveying device can be enhanced.
Patent TW-200739753-A (TW)
Title: Apparatus for preventing collision of chip ejector
Inventor: LEE MIN-HYUNG
IPC: H01L21/50
Filed: 2006-11-09
Abstract: An apparatus for preventing collision of a chip ejector in a wafer table in which are included a wafer having chips thereon may be mounted, a table driving assembly for driving the wafer table, and an ejector positioned in the wafer table, for supporting chips arranged on a wafer ring frame when being picked-up, includes a stopping unit positioned in the wafer table, for stopping the table driving assembly when contacting the ejector. When the wafer table is moved to a position out of a preset range due to a software error occurrence or a data input error occurrence, collision between the wafer table and the ejector is prevented. Accordingly, each component including the wafer table and the ejector is prevented from being damaged, and thus the reliability of the apparatus is enhanced.
Patent TW-200822550-A (TW)
Title: Design of applying intelligent algorithm to filter and equalizer
Inventor: SU TE-JEN
IPC: H03H17/02
Filed: 2006-11-15
Abstract: This invention relates to the design of applying an intelligent algorithm to a filter and an equalizer, more particularly, to a method of applying an intelligent filter and equalizer to the elimination of digital signal noise. The filter and equalizer are designed based on the optimization characteristic of an intelligent algorithm (e.g., an Artificial Immune Algorithm) in combination with other conventional methods. In the design of the filter, the frequency sampling method is utilized in combination with the intelligent algorithm (e.g., an Artificial Immune Algorithm) to optimize the selection of the frequency sampling points in the transition band, such that the attenuation amount between the pass band and the stop band is maximum. In the design of the equalizer, the constant coefficient modulation principle is utilized in combination with the intelligent algorithm (e.g., an Artificial Immune Algorithm) to optimize the adjustment of the transfer function coefficients of the equalizer, such that the equalizer is able to compensate for the interference of unknown channels to the transmission signals.