baber/WOPTO huggingface dataset:
Patent TW-201419769-A (TW)
Title: Current digital to analog coverter with common mode feedback circuit
Inventor: LIN JIN-FU
IPC: H03M1/66
Filed: 2012-11-15
Abstract: The present invention discloses a current digital to analog converter (current DAC) with common mode feedback (CMFB) circuit. The current DAC may comprise a DAC module and a CMFB module. The DAC module may comprise a differential output end. The differential output end may comprise a first end and a second end. The CMFB module may comprise an operational amplifier (OP). The OP's inverting end is connected to a common mode voltage source; the OP's non-inverting end is respectively connected to the first end and the second end via a resistor. With the CMFB module and via the OP and negative feedback mechanism, the common voltage of the first and the second end can be equal to the common mode voltage source. The DAC module may be controlled by different digital input signals to generate desired voltage signals. With the new circuit design, the DAC's current and die area can be reduced and the desired signal swing can be achieved.
Patent TW-201334931-A (TW)
Title: Device and methods for picking and placing hot 3D glass
Inventor: AMSDEN JEFFERY MICHAEL
IPC: B25J15/12
Filed: 2012-11-30
Abstract: A system for picking and placing glass articles from a first location to a second location, the second location including a thermal reforming apparatus for transforming the glass articles from 2D glass articles to 3D glass articles includes a robot having an end effector, the end effector including a compliance assembly having at least six degrees of freedom. The compliance assembly is in fluid communication with both an open pneumatic system and a closed pneumatic system, the open pneumatic system providing a partial vacuum to a portion of the compliance assembly for grabbing the glass article, and the closed pneumatic system for activating a centering function for a portion of the compliance assembly.
Patent TW-201329179-A (TW)
Title: Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
Inventor: SHIN KYOUNG-HUN
IPC: C09J7/20
Filed: 2012-12-07
Abstract: Anisotropic conductive film composition including ethylene-vinyl acetate copolymer, polyurethane resin and organic fine particles, and a film including the composition are disclosed. More particularly, the present invention provides anisotropic conductive film composition and a film including the composition, wherein the anisotropic conductive film composition includes ethylene-vinyl acetate copolymer, polyurethane resin and organic fine particles together to have good flowability, thereby providing smooth filling of the film composition, suppressing thermal deformation by contraction and expansion to have fewer bubbles generated, and exhibiting excellent adhesion.
Patent TW-201423726-A (TW)
Title: System to compare voice operation signal for loading instruction and method thereof
Inventor: LI KRISTY
IPC: G10L15/08
Filed: 2012-12-11
Abstract: A system to compare voice operation signal for loading instruction and a method thereof are provided. By receiving a voice operation signal, and loading an instruction corresponding to an identification data being consistent the voice operation signal when the identification data exists in voice database, the system and the method can replace high complexity sentence by low complexity sentence, and can achieve the effect of enhancing quality of recognizing voice and protecting private data.
Patent TW-201347102-A (TW)
Title: Assembly and semiconductor module
Inventor: SAWAI YUICHI
IPC: H01L23/02
Filed: 2012-12-19
Abstract: To improve adhesion and thermal conductivity of an assembly in which a metal, a ceramic or a semiconductor is bonded. An assembly, which is obtained by bonding a second member with a first member that is a metal, a ceramic or a semiconductor, and wherein; the second member is bonded via an adhesive member that is provided on a surface of the first member; and the adhesive member contains V2O5-containing glass and metal particles. A semiconductor module, which is provided with a base metal, a ceramic substrate, a metal wiring line and a semiconductor chip, and wherein: the ceramic substrate is bonded via a first adhesive member that is provided on a surface of the base metal; the metal wiring line is bonded via a second adhesive member that is provided on a surface of the ceramic substrate; the semiconductor chip is bonded via a third adhesive member that is provided on a surface of the metal wiring line; and the first adhesive member, the second adhesive member and the third adhesive member contain V2O5-containing glass and metal particles.
Patent TW-201405402-A (TW)
Title: Detecting method and device for touch screen
Inventor: CHANG CHIN-FU
IPC: G06F3/044
Filed: 2012-12-28
Abstract: Each driving electrodes of a touch screen corresponds to a delay phase separately. Whenever a driving signal is provided on one driving electrode or one set of driving electrodes, signals on sensing electrodes of the touch screen are detected after the correspondent delay phase of the driving electrode or driving electrodes provided the driving electrode separately.
Patent TW-201341591-A (TW)
Title: Silver surface treatment agent, and light-emitting device
Inventor: HIGASHIUCHI Tomoko
IPC: C09D7/48
Filed: 2013-01-16
Abstract: This silver surface treatment agent includes a layered silicate compound. Furthermore, this light-emitting device is provided with: a substrate having a silver plating layer; a light-emitting diode mounted on the substrate; and a layered silicate compound-containing film provided to a surface of the silver plating layer.
Patent TW-201426376-A (TW)
Title: Method and apparatus for verifying debugging of integrated circuit designs
Inventor: ZHANG DAVID GUOQING
IPC: G06F17/50
Filed: 2013-01-22
Abstract: Method and apparatus for verifying debugging aspects of integrated circuit (IC) designs. In one aspect, an IP provider(s) can use the same process that isolated IP defect(s) to demonstrate to the customer (whether an IC designer or an IP consumer such as a smartphone manufacturer) that the debugging was successful, and that errors in operation will not recur. In another aspect, the invention provides a facility that enables the IP provider to demonstrate to an IP consumer that a repaired IP component will work under a sufficiently broad set of circumstances, without that demonstration revealing the provider's proprietary IP to the consumer.
Patent TW-201329722-A (TW)
Title: PCI express enhancements and extensions
Inventor: AJANOVIC JASMIN
IPC: G06F13/14
Filed: 2007-10-25
Abstract: A method and apparatus for enhancing/extending a serial point-to-point interconnect architecture, such as Peripheral Component Interconnect Express (PCIe) is herein described. Temporal and locality caching hints and prefetching hints are provided to improve system wide caching and prefetching. Message codes for atomic operations to arbitrate ownership between system devices/resources are included to allow efficient access/ownership of shared data. Loose transaction ordering provided for while maintaining corresponding transaction priority to memory locations to ensure data integrity and efficient memory access. Active power sub-states and setting thereof is included to allow for more efficient power management. And, caching of device local memory in a host address space, as well as caching of system memory in a device local memory address space is provided for to improve bandwidth and latency for memory accesses.
Patent TW-201338104-A (TW)
Title: Apparatus, hybrid laminated body, method, and materials for temporary substrate support
Inventor: DRONEN BLAKE RICHARD
IPC: H01L23/14
Filed: 2013-01-29
Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.
Patent TW-201336945-A (TW)
Title: Fluorine-containing ether compound, fluorine-containing ether composition and coating fluid, and substrate having surface-treated layer and method for producing said substrate
Inventor: MUROTANI EISUKE
IPC: C09D5/16
Filed: 2013-02-07
Abstract: Provided is a fluorine-containing ether compound with which a surface-treated layer can be formed having high initial water and oil repellent properties, as well as good rub resistance and easy removal of fingerprints. Also provided are a fluorine-containing ether composition and coating fluid, as well as a substrate having a surface-treated layer and a method for producing said substrate. A fluorine-containing ether compound having a poly(oxyperfluoroalkylene) chain ((alphabeta)n) that is obtained by linking two or more units (alphabeta), and having a hydrolyzable silyl group on at least one terminal of the chain ((alphabeta)n) via a linking group, where the unit (alphabeta) is a poly(oxyperfluoroalkylene) group having one to three groups (alpha) comprising at least one C1-2 oxyperfluoroalkylene group, and having one to three groups (beta) comprising at least one C3-6 oxyperfluoroalkylene group.
Patent TW-201438546-A (TW)
Title: Electronic device
Inventor: MA SONG
IPC: H05K7/12
Filed: 2013-02-19
Abstract: An electronic device includes a motherboard defining a plurality of through holes, a bottom wall forming a plurality of poles, and a fixing member. Each through hole includes a big hole and a small hole communicated with the big hole. Each pole includes a supporting portion, a head, and a neck. The fixing member includes a base mounted to the bottom wall and a movable portion slidably mounted to the base. The base forms a protrusion on a top surface thereof. The movable portion includes a main body and a latch. The latch includes a connecting portion connected to the main body and defining an engaging slot in a bottom surface of the connecting portion. The heads are respectively extended through the big holes. The motherboard is then slid to allow the necks abutting against ends bounding the corresponding small holes and away from the corresponding big holes, therefore, the motherboard is sandwiched between the heads and the supporting portions. The movable portion is slid toward the motherboard; therefore, the protrusion is engaged in the engaging slot, an end of the main body resist against an end of the motherboard adjacent to the small holes.
Patent TW-201351120-A (TW)
Title: Methods and apparatus for communicating available battery power
Inventor: JI GANG
IPC: G06F1/28
Filed: 2013-02-26
Abstract: Systems and methods of enabling a battery system to intelligently provide its current support capability include logic to determine current battery power status information. The current battery power status information may be compared with a set of programmed battery power status information to determine a match. There may be logic to indicate the current battery power status information based on the match.
Patent TW-201351263-A (TW)
Title: Efficient tomographic processing for touch determination
Inventor: CHRISTIANSSON TOMAS
IPC: G06F3/0488
Filed: 2013-03-07
Abstract: Touch sensitivity is enabled using a touch system that comprises a panel configured to conduct signals, e.g. by TIR, along detection lines across a touch surface. A signal processor operates to generate data samples indicative of transmitted signal energy on parallel detection lines at a number of different angles across the touch surface; process the data samples for generation of interpolated Fourier coefficients ( f ) at grid points in a regular grid in a Fourier domain; and operate a two-dimensional inverse Fourier transform on the interpolated Fourier coefficients ( f ) so as to generate an interaction pattern for the touch surface. The interpolated Fourier coefficients ( f ) are generated sequentially for individual groups of grid points. Each individual group comprises grid points that have equal distance to an origin in the regular grid, e.g. grid points that are mapped onto each other by one or more lines of symmetry (L1-L4) in the regular grid. The group-based processing may improve processing speed and/or reduce the need for data storage.
Patent TW-201447112-A (TW)
Title: Fan bracket assembly
Inventor: TIAN BO
IPC: F04D29/60
Filed: 2013-04-17
Abstract: A fan bracket assembly includes a bottom plate and a fan bracket attached to the bottom plate. Two protrusions protrude from the bottom plate. Each protrusion defines a hooking slot. The fan bracket includes a resilient body and an engaging portion opposite to the resilient body, corresponding to each protrusion. A latch extends from each resilient body toward the corresponding engaging portion. Each protrusion is sandwiched between the corresponding resilient body and engaging portion. Each latch engages in the hooking slot of the corresponding protrusion. Each resilient body is deformable away from the corresponding engaging portion, to allow the latch to disengage from the hooking slot.
Patent TW-201441275-A (TW)
Title: Organic semiconductor material and thin-film transistor
Inventor: HSU CHAIN-SHU
IPC: C08G61/12
Filed: 2013-04-19
Abstract: An organic semiconductor material is provided. The organic semiconductor material includes a compound represented by formula (1): wherein r and s represent independently an integer of 1 to 20; n represents an integer of 2 to 10000; X1, X2 and X3 represent independently O, S, Se, Te, NR, RCR, RSiR, RGeR or RSnR; Y1 and Y2 represent independently H, F, Cl, CF3, haloalkyl, CN, R, OR, SR, COOR or COR; and Z1, Z2, Z3 and Z4 represent independently H, F, Cl, CF3, haloalkyl, CN, R, OR, SR, COOR or COR, wherein R represents alkyl group.
Patent TW-201350836-A (TW)
Title: Optimization of unknown defect rejection for automatic defect classification
Inventor: SHLAIN VLADIMIR
IPC: G06V10/764
Filed: 2013-04-19
Abstract: A method for defect classification includes storing, in a computer system, a definition of a region in a feature space. The definition is associated with a class of defects and comprises a kernel function comprising a parameter. The parameter determines a shape of the region. A confidence threshold for automatic classification of at least one defect associated with the class is received. A value of the parameter associated with the confidence threshold is selected. Inspection data for a plurality of defects detected in one or more samples under inspection is received. The plurality of defects for the class are automatically classified using the kernel function and the selected value of the parameter.
Patent TW-201401713-A (TW)
Title: Methods, systems and devices for adjusting working state of battery pack
Inventor: GUAN QIANG
IPC: H02J7/00
Filed: 2013-05-01
Abstract: A method for adjusting working state of a battery pack that includes obtaining a signal indicating an external condition of the battery pack, wherein the external condition including an external air pressure or an actual elevation; determining a control parameter according to the signal; and adjusting a working state of the battery pack according to the control parameter.
Patent TW-201350423-A (TW)
Title: Elastic reticular structure with excellent silence and hardness
Inventor: WAKUI HIROYUKI
IPC: B68G1/00
Filed: 2013-05-03
Abstract: The object of the present invention is to provide an elastic reticular structure having excellent cushioning property and can reducing the sound while compressing and recovering. The solution of the present invention is a reticular structure formed from a three dimensional random joining structure which is formed by forming random loops zigzagging a continuous striatum produced by a thermoplastic resin, making the loops to be contacted each other under molten condition, and fusing the most of a contact part. The reticular structure is characterized in that (a) the apparent density of the random loop joining structure are 0.05 to 0.200 g/cm<SP>3</SP>, and (b) joining points of each unit weight of the random loop joining structure are 500 to 1200 pieces/g.
Patent TW-201347092-A (TW)
Title: Semiconductor device and fabricating method thereof
Inventor: KIM JU-YOUN
IPC: H01L29/78
Filed: 2013-05-09
Abstract: A semiconductor device includes an interlayer insulating film formed on a substrate and including a trench, a gate insulating film formed in the trench, a work function adjusting film formed on the gate insulating film in the trench along sidewalls and a bottom surface of the trench, and including an inclined surface having an acute angle with respect to the sidewalls of the trench, and a metal gate pattern formed on the work function adjusting film in the trench to fill up the trench.
Patent TW-201405242-A (TW)
Title: Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, and electronic device
Inventor: ITO JUNICHI
IPC: G03F7/039
Filed: 2013-05-22
Abstract: There is provided a pattern forming method comprising (i) a step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition; (ii)a step of exposing the film; and (iii) a step of performing development by using a developer containing an organic solvent to form a negative pattern, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin capable of increasing the polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin having a repeating unit having a fluorine atom and not having a CF3 partial structure.
Patent TW-201402611-A (TW)
Title: Incretin receptor ligand polypeptide Fc-region fusion polypeptides and conjugates with altered Fc-effector function
Inventor: HOFFMANN EIKE
IPC: A61P35/00
Filed: 2013-06-18
Abstract: Herein is reported an Fc-region fusion polypeptide or Fc-region conjugate comprising one to four incretin receptor ligand polypeptides and a variant human Fc-region with a mutation of the amino acid residue at position 329 and at least one further mutation of at least one amino acid selected from the group comprising amino acid residues at position 228, 233, 234, 235, 236, 237, 297, 318, 320, 322 and 331 to a different residue, wherein the residues in the Fc-region are numbered according to the EU index of Kabat and its use as a medicament.
Patent TW-201418306-A (TW)
Title: Process for producing a multilayer dielectric polyurethane film system
Inventor: KRAUSE JENS
IPC: C08G18/42
Filed: 2013-07-02
Abstract: The present invention relates to a process for producing a multilayer dielectric polyurethane film system, having the following process steps: (I) producing a mixture comprising (a) a compound containing isocyanate groups and having a content of isocyanate groups of > 10% by weight and ≤ 50% by weight, (b) a compound containing isocyanate-reactive groups and having an OH number of ≥ 20 and ≤ 150, where the sum of the number-average functionalities of isocyanate groups and of isocyanate-reactive groups in the compounds (a) and (b) is ≥ 2.6 and ≤ 6, (II) applying the mixture immediately after production thereof in the form of a wet film to a carrier, (III) curing the wet film to form the polyurethane film and (IV) applying an electrode layer to the almost completely dried film, (V) repeating steps (I)-(IV) to obtain a multilayer system. The invention further relates to a multilayer dielectric polyurethane film system, and to an electromechanical transducer.
Patent TW-201412897-A (TW)
Title: Anti-slip coating and preparation, application method thereof
Inventor: SUN MEI-RU
IPC: C09D7/42
Filed: 2013-08-05
Abstract: The present invention relates to anti-slip coatings comprising resin, diluent, PMU particles and photo-initiator. The present invention also relates to the preparation of anti-slip coatings, methods for applying anti-slip coatings, and substrates coated with such anti-slip coatings.
Patent TW-201408664-A (TW)
Title: Process for the preparation of c-Fms kinase inhibitors
Inventor: KOLODZIEJCZYK KRZYSZTOF
IPC: C07D309/30
Filed: 2013-08-06
Abstract: The present invention is directed to a process for the preparation of heterocyclic derivatives of formula I wherein J, X, Z, and R2 are as defined herein. Such compounds are useful as protein tyrosine kinase inhibitors, more particularly inhibitors of c-fms kinase.
Patent TW-201422623-A (TW)
Title: Organic semiconductor solution and organic semiconductor film
Inventor: IKEDA YOSHINORI
IPC: C07D495/04
Filed: 2013-08-15
Abstract: The present invention provides an organic semiconductor solution that can produce an organic semiconductor film having acceptable semiconductor properties while endowed with improved film-forming properties due to substantial polymer content. This organic semiconductor solution contains an organic solvent as well as a polymer and an organic semiconductor precursor dissolved in the organic solvent. The proportion of the polymer in relation to the total of the polymer and the organic semiconductor precursor is equal to or greater than 3 mass%. The organic semiconductor precursor has a structure in which a dienophile-type alkene is eliminably bonded through a double bond thereof to the benzene ring of an organic semiconductor compound represented by formula (I) (where A1 to A8 and E1 to E4 are independently selected from the group consisting of hydrogen atoms, halogen atoms, C1 to C20 alkyl groups, and the like; and Y represents sulfur or selenium).
Patent TW-201416018-A (TW)
Title: Molded component for slide fasteners and slide fastener provided therewith
Inventor: MIZUMOTO KAZUYA
IPC: A44B19/26
Filed: 2013-08-20
Abstract: Provided is a molded component for slide fasteners, said molded component having high color reproducibility while maintaining high strength and high rigidity. The molded component for slide fasteners is formed of a polyamide resin composition which contains a polyamide resin having a melting point of 210 DEG C or higher and lower than 310 DEG C, 0.5 mass% or more and less than 5 mass% of a pigment having a Mohs' hardness of 4 or lower and a refractive index of 2 or higher, and a reinforcing fiber.
Patent TW-201508895-A (TW)
Title: Package module with offset stack components
Inventor: CHEN SHIH-CHI
IPC: H01L23/48
Filed: 2013-08-28
Abstract: A Package Module with Offset Stack Components, including: a group of stack components, a loader and a substrate. A plurality of components offset-stack each other to be the group of stack components and the group of stack components is placed in the loader. The substrate is placed under the loader. There are contactors on the area of the substrate which contact with the loader. There are outside-conductors on the other side of the substrate and they are conducted with the contactors. A plurality of metallic spots on the stack components and a plurality of welding spot on the loader contact with each others. The metallic spots stretch to the downside of the loader to be other metallic spots. Those metallic spots on the downside of the loader contact with the conductors on the substrate.