Patent DE-102008048239-A1 (DE)
Title: Verifying soldering results, comprises placing a contact element on a surface of a carrier, melting a soldering material, and characterizing the soldering result under the formation of quality results after completing the soldering process
Inventor: AYDIN OEMER
IPC: B23K1/00
Filed: 2008-09-16
Abstract: The method comprises placing a contact element (20, 30) on a surface of a carrier (40), melting a soldering material, characterizing the soldering result under the formation of quality results after completing the soldering process, and removing the contact element from the carrier surface section after completing the soldering process. The carrier has an unwetted carrier surface section and the contact element is placed on the unwetted carrier surface section of the carrier. The soldering material remained on the contact element is characterized under the formation of the quality results. The method comprises placing a contact element (20, 30) on a surface of a carrier (40), melting a soldering material, characterizing the soldering result under the formation of quality results after completing the soldering process, and removing the contact element from the carrier surface section after completing the soldering process. The carrier has an unwetted carrier surface section and the contact element is placed on the unwetted carrier surface section of the carrier. The soldering material remained on the contact element is characterized under the formation of the quality results. Before placing the contact element on the carrier, a solder paste (95) containing the soldering material is coated on the carrier surface section in a section-wise manner. The contact element has a wetted carrier surface section and is placed on the coated carrier surface section with the wetted carrier surface section. The local distribution of the solder material remained on the wetted carrier surface section of the contact element is determined and is absorbed with an image recording device in a two- or three-dimensional manner. The absorbed distribution is stored in an image processing device, which provides the quality results. The local distribution of the remained solder material is compared with a predetermined actual distribution and the quality result is determined under the consideration of the comparison results. A wetting angle of the wetting of the wetted surface section of the contact element is measured and the measured wetting angle is considered during the determination of the quality results. A surface of the contact element wetted with the soldering material is measured and the measured wetted surface is considered during the determination of the quality results. A ratio between the parameter of the actually wetted surface of the contact element and the parameter of the wettable surface section of the contact element is determined and the quality result is formed under the consideration of the determined ratios. A quality value is displayed as the quality result and directly or indirectly specifies the respective ratio. A binary value is given as the quality value and specifies but the ratio of a predetermined minimum value attains or exceeds. The measurement of the wetted surface of the contact element and/or the measurement of the wetting angle are carried out in the frame of the image formation of the image processing device.