baber/WOPTO huggingface dataset:
Patent TW-202235552-A (TW)
Title: 包含交聯氟聚合物及氟聚合物粒子之電子電信物品、組成物、及方法
Inventor: JING NAIYONG
IPC: H01Q1/38
Filed: 2021-12-02
Abstract: 描述了電子電信物品，其包含一交聯氟聚合物層，該交聯氟聚合物層包含具有大於1微米之粒徑的氟聚合物粒子。在一般實施例中，該交聯氟聚合物層係一基材、圖案化(例如光阻)層、絕緣層、鈍化層、包覆層、保護層、或其組合。亦描述製造一電子電信物品之方法及形成一圖案化氟聚合物層之方法。該氟聚合物較佳地包含至少80、85、或90重量%的全氟化單體聚合單元及選自腈、碘、溴、及氯的固化部位。說明性電子電信物品包括積體電路、印刷電路板、天線、及光纖電纜。亦描述氟聚合物組成物。
Patent TW-202212422-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: HIRATA TATSUYA
IPC: C08G73/10
Filed: 2019-12-25
Abstract: The object of the present invention is to provide a semiconductor device having excellent adhesion between an interlayer insulating film in a rewiring layer and a packaging material and excellent electrical characteristics, and a manufacturing method thereof. The semiconductor device (1) of the present invention is characterized in that: the device is provided with a semiconductor chip (2), a packaging material (3) covering the semiconductor chip, and a rewiring layer (4) having an area larger than the aforementioned semiconductor chip when viewed from above; and the weight loss rate of the interlayer insulating film (6) of the rewiring layer, after heated to 700 DEG C in a speed of 10 DEG C/min in an air atmosphere is 5-95% by weight. According to the present invention, the semiconductor device having excellent adhesion between the interlayer insulating film in the rewiring layer and the packaging material and excellent electrical characteristics, and the manufacturing method thereof can be provided.
Patent TW-202228488-A (TW)
Title: Electronic device
Inventor: YEH CHEN-LIN
IPC: H05K3/36
Filed: 2021-12-24
Abstract: An electronic device including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element is provided. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.
Patent TW-202245407-A (TW)
Title: Piezoelectric oscillation device
Inventor: KOJO TAKUYA
IPC: H03B5/32
Filed: 2021-12-28
Abstract: The piezoelectric oscillation device is equipped with at least a core (5). The core (5) includes: a crystal oscillator (50) which has a three-layer structure and in which an oscillation part (11) is hermetically sealed; and a heater IC (52) that serves as a heating element. The entirety of a second main surface (302) of at least a second sealing member (30) of the crystal oscillator (50) is thermally coupled to the heater IC (52).
Patent TW-202246500-A (TW)
Title: Enhanced oligonucleotides for inhibiting rtel1 expression
Inventor: FUNDER ERIK
IPC: C12N15/113
Filed: 2022-01-28
Abstract: The present invention relates to enhanced antisense oligonucleotides targeting Regulator of telomere elongation helicase 1 (RTEL1), leading to modulation of the expression of RTEL1 or modulation of RTEL1 activity. The invention, in particular, relates to the use of enhanced antisense oligonucleotides targeting RTEL1 for use in treating and/or preventing a hepatitis B virus (HBV) infection, in particular a chronic HBV infection. The invention, in particular, relates to the use of the enhanced antisense oligonucleotides targeting RTEL1 for destabilizing cccDNA, such as HBV cccDNA. Also comprised in the present invention is a pharmaceutical composition and its use in the treatment and/or prevention of a HBV infection.
Patent TW-202301636-A (TW)
Title: Semiconductor memory device
Inventor: KIM EUN-JUNG
IPC: H01L27/105
Filed: 2022-02-09
Abstract: Provided is a semiconductor memory device comprising a device isolation pattern in a substrate and defining first and second active sections spaced apart from each other, wherein a center of the first active section is adjacent to an end of the second active section, a bit line that crosses over the center of the first active section, a bit-line contact between the bit line and the first active section, and a first storage node pad on the end of the second active section. The first storage node pad includes a first pad sidewall and a second pad sidewall. The first pad sidewall is adjacent to the bit-line contact. The second pad sidewall is opposite to the first pad sidewall. When viewed in plan, the second pad sidewall is convex in a direction away from the bit-line contact.
Patent TW-202246319-A (TW)
Title: Complement c3 antigen binding proteins
Inventor: BORRAS LEONARDO
IPC: C07K16/18
Filed: 2022-02-11
Abstract: Antigen-binding proteins with specificity to complement C3 and C3b are provided. Methods of treating complement C3-mediated diseases and disorders, methods of inhibiting the activity of the complement Classical pathway (CP), Lectin pathway (LP), and/or Alternative pathway (AP), and methods of inhibiting the activity of choroidal-localized complement C3 are also provided.
Patent TW-202334321-A (TW)
Title: Nylon composite material with low isotropic shrinkage rate and processed products thereof including a nylon base material and a mica mineral fiber that are fused together
Inventor: LAI DE-LUN
IPC: C08L101/12
Filed: 2022-02-15
Abstract: A nylon composite material having a low isotropic shrinkage rate includes a nylon base material and a mica mineral fiber that are fused together. A length dimension and a thickness dimension of the mica mineral fiber are measured by a scanning electron microscope, and the ratio value of the length dimension to the thickness dimension is at least 50 or more. The present invention further provides a processed product having a low isotropic shrinkage rate made of the nylon composite material, wherein the processed product having a low isotropic shrinkage rate has a first shrinkage rate in the horizontal direction, and the processed product having a low isotropic shrinkage rate has a second shrinkage rate in the vertical direction. The ratio of the first shrinkage rate to the second shrinkage rate is between 1:1.15 and 1:1.3; as such, the processed product of the present invention has a low isotropic shrinkage rate to provide a high-precision dimension effect.
Patent TW-202235400-A (TW)
Title: Cordierite sintered body and method for producing same
Inventor: OGAWA SHUHEI
IPC: C04B35/63
Filed: 2022-03-02
Abstract: The present invention pertains to a cordierite sintered body which contains all elements belonging to an element group M1 comprising calcium, magnesium, aluminum, and silicon, and in which, in terms of oxides, the contained amount of the calcium is 0.06-3.40 mass%, the contained amount of the magnesium is 12.9 mass% or more, the contained amount of an element M2 which is a metal element other than the elements belonging to the element group M1 is 1.5 mass% or less, the degree of porosity is 3.0 vol% or less, the 4-point flexural strength is 170 MPa or more, and the Weibull modulus is 9.5 or more.
Patent TW-202335767-A (TW)
Title: Improved structure of back processing side-milling seat can prevent the spindle from tilting when the spindle is adjusted
Inventor: GUO TIAN-KUN
IPC: B23C9/00
Filed: 2022-03-03
Abstract: An improved structure of a back processing side-milling seat comprises a body and a spindle assembly. The mounting portion of the body is formed with a first layer body, a second layer body and a third layer body that are spaced apart from each other. The spindle assembly is coupled to the mounting portion. The second layer body is provided with a split groove along the second direction, and the split groove divides the second layer body into two blocks that are spaced apart from each other. When the two blocks are exerted with a force to be approached each other, the two blocks can fasten the spindle assembly. Accordingly, when a user adjusts the position of the spindle assembly, the first layer body and the third layer body can retain the spindle assembly with two positions to prevent the spindle assembly from tilting or deflecting. It can effectively improve the problems of the prior art, enhance processing accuracy, and maintain good transmission effects.
Patent TW-202306651-A (TW)
Title: Substrate conveying device, coating processing device, and substrate conveying method
Inventor: MINE YOUSUKE
IPC: B05C5/00
Filed: 2022-03-17
Abstract: This substrate conveying device is provided with a pair of guide rails, a pair of movement units, a plurality of main holding units, and auxiliary holding units. The pair of guide rails extend in a substrate conveying direction. The pair of movement units move respectively along the pair of guide rails. The plurality of main holding units are each provided on the pair of movement units, to hold the substrate from below the substrate. Each auxiliary holding unit is provided between the main holding units that are adjacent to one another on each movement unit, to hold the substrate from below the substrate. Each of the plurality of main holding units includes a first suction attachment unit for suction-attaching the substrate, and an adjusting unit for adjusting the position of the first suction attachment unit. Each auxiliary holding unit includes a second suction attachment unit for suction-attaching the substrate, and a tracking unit for adjusting the position of the second suction attachment unit by tracking the movement of the substrate based on the adjustments of the positions of the first suction attachment units.
Patent TW-202312488-A (TW)
Title: 半導體結構
Inventor: TSAI HSING-I
IPC: H01L29/78
Filed: 2022-04-08
Abstract: 根據本發明的一些實施例，一種半導體結構包含一閘極結構、一源極區、一汲極區，及一隔離結構。該閘極結構包含一第一部分、一第二部分，及一第三部分。該第一部分在一第一方向上延伸，且該第二部分及該第三部分在一第二方向上延伸。該第二部分及該第三部分經放置於該第一部分之對置端處。該源極區及該汲極區被該閘極結構分開。該隔離結構環繞該閘極結構、該源極區及該汲極區。該第一部分具有一第一側壁，該第二部分具有一第二側壁，且該第三部分具有一第三側壁。該第一側壁、該第二側壁及該第三側壁係平行於該第一方向且彼此對準以形成一直線。
Patent TW-202247983-A (TW)
Title: Compression molding device
Inventor: YANAGISAWA MAKOTO
IPC: B29C31/04
Filed: 2022-05-24
Abstract: A compression molding device (1) compression molds a resin (R) to a workpiece (10) in which a plurality of components (12) are mounted on a carrier (11) via a plurality of connection members, and produces a plurality of packages each having at least one of the components (12) resin sealed therein. The compression molding device (1) comprises: a measuring unit (110) that measures the weight of the workpiece (10); a calculation unit (120) that calculates the supply quantity of the resin (R) on the basis of the weight of the workpiece (10) measured by the measuring unit (110); a supply unit (130) that supplies the resin (R) in the supply quantity calculated by the calculation unit (120); and a molding die (190) that is used for compression molding, to the workpiece (10), the resin (R) supplied by the supply unit (130). The calculation unit (120) calculates the total volume of a plurality of mounted articles including the plurality of components (12) and the plurality of connection members on the basis of the weight of the workpiece (10) and calculates the supply quantity of the resin on the basis of the total volume of the plurality of mounted articles.
Patent TW-202238090-A (TW)
Inventor: NICHOLS GEOFF
IPC: G01L3/24
Filed: 2020-12-08
Abstract: An axle assembly for a bicycle includes an axle having an inner wall extending along a length of the axle between a first end and a second end of the axle. The inner wall at least partially defines a first volume and a second volume within the axle. The first volume has a first diameter, and the second volume has a second diameter that is greater than the first diameter. The first volume is closer than the second volume to the first end of the axle. The axle assembly also includes a sensor attached to the inner wall of the axle within the second volume of the axle.
Patent TW-202237673-A (TW)
Title: Resin composition, adhesive, sealing material, dam agent, and semiconductor device
Inventor: IWAYA KAZUKI
IPC: H01L23/28
Filed: 2017-09-11
Abstract: To provide a photocurable and thermosetting resin composition which has high adhesive strength (in particular, high peel strength) after curing, and can suppress reduction in adhesive strength after humidity test after curing. A resin composition contains (A) an acrylic resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4), in which at least one of R1, R2, R3 and R4 each independently hydrogen or C3H6SH, and at least one of R1, R2, R3 and R4 is C3H6SH, and (C) a latent curing accelerator.
Patent TW-202308957-A (TW)
Title: Glass composition for glass fibers, glass fiber, and glass fiber-reinforced resin molded product
Inventor: NUKUI YOSUKE
IPC: D04H1/4218
Filed: 2022-06-23
Abstract: Provided is a glass composition that is for glass fibers and that can suppress variability in the fiber diameters of the glass fibers. This glass composition for glass fibers contains, with respect to the total amount thereof, 45.60-59.00 mass% of SiO2, 10.00-16.00 mass% of Al2O3, 17.00-25.00 mass% of CaO, 0.01-9.50 mass% of TiO2, 0.03-7.00 mass% of P2O5, 0.00-9.50 mass% of ZnO and 0.00-2.00 mass% of SO3 but the total of ZnO and SO3 being 0.01-11.50 mass%, and 0.00-2.00 mass% of the total of Na2O, K2O, and Li2O. When SI represents the percentage content of SiO2, A represents the percentage content of Al2O3, C represents the percentage content of CaO, T represents the percentage content of TiO2, P represents the percentage content of P2O5, Z represents the percentage content of ZnO, and SO represents the percentage content of SO3, formula (1) is satisfied. (1): 15.0 ≤ (SI/C)2*(A/T)*{P/(SO+Z)}1/4 ≤ 690.1.
Patent TW-202310835-A (TW)
Inventor: ASHCRAFT LUKE W
IPC: A61P3/00
Filed: 2022-07-11
Abstract: 提供一種式(I)化合物，
         ，
        或其立體異構物或互變異構物、或前述中任一者之醫藥上可接受之鹽，其中A、B、X
         1 、X
         2 、X
         3 及X
         4 係如本文所定義。
        亦提供一種醫藥上可接受之組合物，其包含式(I)化合物、或其立體異構物或互變異構物、或前述中任一者之醫藥上可接受之鹽。
        亦提供使用式(I)化合物、或其立體異構物或互變異構物、或前述中任一者之醫藥上可接受之鹽之方法。
Patent TW-202315767-A (TW)
Inventor: Zhang da-liang
IPC: B60N2/26
Filed: 2022-09-22
Abstract: 一種接合結構，包括：固定座，連接到第一物件，具有一筒狀的固定座側壁，固定座側壁具有相對設置的一開放端和一容置端；插座，連接到第二物件，具有一筒狀的插座側壁，能夠通過開放端沿著一插入方向被插入套設到固定座側壁中；封孔件，設置在固定座側壁內部，位於固定座的容置端與插座之間，且能在開放端與容置端之間移動，封孔件在鄰近開放端處具有一封孔板，封孔板的形狀對應於固定座側壁在開放端處的截面形狀；第一彈性件，對封孔件施加偏壓向開放端的力；當插座未被插入到固定座中時，封孔件被第一彈性件偏壓到開放端處；當插座被插入到固定座中時，封孔件被插座推向容置端而離開開放端。
Patent TW-202323594-A (TW)
Title: Roughened copper foil, copper-clad laminate, and method for manufacturing printed wiring board
Inventor: KATO TSUBASA
IPC: C25D1/04
Filed: 2022-09-30
Abstract: Provided is a roughened copper foil with which it is possible to obtain excellent transmission characteristics when used in a copper-clad laminate or a printed wiring board. This roughened copper foil has a roughened surface on at least one side thereof. The roughened surface has a developed interfacial area ratio Sdr, measured in accordance with ISO25178 and under 200x magnification, no S-filter, and a 5 [mu]m L-filter conditions, of 70.0% or below. In the surface on the opposite side from the roughened surface, the average value of L/S, this being the ratio of the grain boundary length L relative to the occupied area S calculated for each crystal grain in which the deviation angle from the (111) plane is 20 DEG or below in an observation field-of-view when analyzed by electron backscatter diffraction (EBSD) after being heated for one hour at 180 DEG C, is 13.0 [mu]m/[mu]m2 or below.
Patent TW-202303695-A (TW)
Title: Bonding system and bonding method
Inventor: OTSUKA YOSHITAKA
IPC: B23K20/00
Filed: 2019-01-09
Abstract: This bonding system is equipped with: an alignment unit, which is provided with a first holding unit and a second holding unit, said first holding unit and second holding unit being disposed by being separated from each other in the vertical direction, and which aligns a first substrate held by the first holding unit, and a second substrate held by the second holding unit with each other in the horizontal direction by relatively moving the first holding unit and the second holding unit; a pressing unit that presses the first substrate held by the first holding unit, and the second substrate held by the second holding unit to each other; a measuring unit that measures a positional displacement between an alignment mark of the first substrate, and an alignment mark of the second substrate, said first substrate and second substrate being bonded by means of the pressing unit; and an alignment control unit that controls, on the basis of the positional displacement occurred in past bonding, the horizontal-direction alignment in the bonding being performed.
Patent TW-202323418-A (TW)
Title: Flux and solder paste
Inventor: KAWANAGO TOMOHISA
IPC: C08K5/34
Filed: 2022-10-06
Abstract: A flux containing a compound (AZ1) having a benzotriazole skeleton, an organic acid (AC1) and a solvent (S1) is adopted. AC1 has a weight reduction rate of 20% by mass or less when held at 140℃. for 15 minutes. S1 has a weight reduction ratio of 50 mass % or less when held at 140℃. for 15 minutes.
Patent TW-202334320-A (TW)
Title: Thermally conductive composition, thermally conductive sheet, and method for manufacturing same
Inventor: SUZUMURA KATSUYUKI
IPC: C08L101/00
Filed: 2022-10-12
Abstract: This thermally conductive composition contains a curing polyorganosiloxane (A) and a thermally conductive inorganic filler (B), wherein: 500-5000 parts by mass of the thermally conductive inorganic filler (B) is contained relative to 100 parts by mass of the curing polyorganosiloxane (A); the thermally conductive inorganic filler (B) contains spherical alumina (B1) having an average particle diameter of 1 [mu]m or more and less than 10 [mu]m, and crushed alumina (B2) having an average particle diameter of 0.01 [mu]m or more and less than 1 [mu]m; and the ratio of the spherical alumina (B1) having an average particle diameter of 1 [mu]m or more and less than 10 [mu]m relative to 100 parts by mass of the curing polyorganosiloxane (A) is more than 0 parts by mass and 1500 parts by mass or less, and the ratio of the crushed alumina (B2) having an average particle diameter of 0.01 [mu]m or more and less than 1 [mu]m is more than 0 parts by mass and 1000 parts by mass or less.
Patent TW-202325156-A (TW)
Inventor: YASUDA HIROMU
IPC: A01K89/017
Filed: 2022-10-21
Abstract: A fishing reel comprises: a circuit board; a plurality of electrical components electrically connected to the circuit board; an external-device connection unit electrically connected to the circuit board; and a watertight structure to accommodate the circuit board inside. The external-device connection unit comprises: an external connection part disposed outside of the watertight structure, the external connection part being designed to electrically connect to a connector of an external device; an internal connection part disposed inside of the watertight structure, the internal connection part being designed to electrically connect to the circuit board and the external connection part; an internal waterproof part to make a gap between the external connection part and the internal connection part waterproof; a housing to hold the external connection part, the internal connection part, and the internal waterproof part; and an external waterproof part to make a gap between the housing and the watertight structure waterproof.
Patent TW-202308874-A (TW)
Inventor: XIAO XIAO-HONG
IPC: B60N2/26
Filed: 2021-10-12
Abstract: 本發明公開了一種頂篷鎖定組件，其適於安裝於嬰幼兒載具上，嬰幼兒載具包括握把及頂篷機構，頂篷鎖定組件包括鎖定件與配鎖件，該鎖定件可轉動地安裝於該握把與該頂篷機構中的一者上，該配鎖件安裝於該握把與該頂篷機構中的另一者上，鎖定件在頂篷機構由折疊狀態切換至展開狀態時相對配鎖件轉動而與該配鎖件鎖合，頂篷機構在鎖定件與配鎖件鎖合時恆保持於展開狀態。本發明的頂篷鎖定組件能令使用時的頂篷機構恆保持展開，避免意外收折。另，本發明還公開了一種嬰幼兒載具。
Patent TW-202334306-A (TW)
Inventor: SARVI ALI
IPC: C08L23/08
Filed: 2022-11-16
Abstract: 本發明關於一種水性密封組成物，其在水性載體中包含聚合物聚(乙烯醇)同元聚合物或聚(乙烯醇-共聚-乙烯)共聚物與聚胺甲酸酯、導電填料、及水溶性醚的組合。該水性密封組成物可被用於在具有包含(a)複數個被填充帶電粒子與非極性流體之微胞，及(b)密封膜之電光材料層之電光裝置中形成密封膜，其中該電光材料層被配置在二電極層之間。該裝置呈現良好的電光性能。
Patent TW-202315027-A (TW)
Title: A semiconductor image reception device
Inventor: FUJII NOBUTOSHI
IPC: H01L23/535
Filed: 2012-05-17
Abstract: To provide a semiconductor device including a junction interface with higher reliability. A first semiconductor device includes: a first wiring layer including a first interlayer insulating film, a first electrode pad, and a first dummy electrode, the first electrode pad being embedded in the first interlayer insulating film and having one surface located on same plane as one surface of the first interlayer insulating film, and the first dummy electrode being embedded in the first interlayer insulating film, having one surface located on same plane as the one surface of the first interlayer insulating film, and being disposed around the first electrode pad; and a second wiring layer including a second interlayer insulating film, a second electrode pad, and a second dummy electrode, the second electrode pad being embedded in the second interlayer insulating film, having one surface located on same surface as one surface of the second interlayer insulating film, and being bonded to the first electrode pad, and the second dummy electrode having one surface located on same plane as the surface located closer to the first interlayer insulating film of the second interlayer insulating film, being disposed around the second electrode pad, and being bonded to the first dummy electrode. A second semiconductor device includes: a first semiconductor section including a first electrode, the first electrode being formed on a surface located closer to a bonding interface and extending in a first direction; and a second semiconductor section including a second electrode and disposed to be bonded to the first semiconductor section at the bonding interface, the second electrode being bonded to the first electrode and extending in a second direction that intersects with the first direction.
Patent TW-202332272-A (TW)
Title: Block-level reference pictures adaptation for video coding
Inventor: HUANG HAN
IPC: H04N19/176
Filed: 2022-12-21
Abstract: A video decoder may be configured to generate a first ordering of reference pictures in a reference picture list for a first block of a slice, wherein generating the first ordering of the reference pictures for the first block comprises assigning indexes to the reference pictures; and generate a second ordering of the reference pictures in the reference picture list for a second block of the slice based on an adaptive reference picture reordering process, wherein the first ordering is different than the second ordering and generating the second ordering of reference pictures for the second block comprises assigning at least some of the indexes to different reference pictures than in the first ordering; decode the first block using the first ordering of the reference pictures; and decode the second block using the second ordering of the reference pictures.
Patent TW-202332690-A (TW)
Inventor: BAEUERLE PATRICK
IPC: C07K14/725
Filed: 2017-10-11
Abstract: Provided herein are T-cell receptor (TCR) fusion proteins (TFPs), T-cells engineered to express one or more TFPs, and methods of use thereof for the treatment of diseases, including cancer.
Patent TW-202328928-A (TW)
Title: Remote current sense compensation in multiphase voltage regulators
Inventor: GRISAMORE ROBERT THOMAS
IPC: G06F13/00
Filed: 2022-12-29
Abstract: Methods and systems for performing current sense compensation for one or more power stages in a multiphase voltage regulator are described. A controller can be connected to a plurality of power stages through a communication interface. The controller can generate a data packet including a command to obtain temperature information and an address that identifies a specific power stage among the plurality of power stages. The controller can send the data packet to the plurality of power stages using the communication interface. The controller can receive temperature information of the specific power stage from the specific power stage through the communication interface. The controller can compensate a sensed current of the specific power stage based on the received temperature information of the specific power stage.