baber/WOPTO huggingface dataset:
Patent TW-201629853-A (TW)
Title: Controlling method for barcode scanner and the barcode scanner
Inventor: LEE HUNG-CHE
IPC: G06K19/06
Filed: 2015-02-03
Abstract: A controlling method for a barcode scanner includes the following steps. Start a barcode reading process and turn on an image sensor. The image sensor sends the captured images to the processor and the processor carries out a face detection process to determine whether a face exists in the images. The processor turns off or prohibits turning on the laser positioning device when detecting a face appearing in the images. In contrast, the processor turns on or allows turning on the laser positioning device when detecting no face in the images. Finally, determine whether end the barcode reading process or return the face detecting process. As a result, diminish the chance of hurting human eye from the laser positioning device.
Patent TW-201534298-A (TW)
Title: FPR1 antagonist derivatives and use thereof (2)
Inventor: HWANG TSONG-LONG
IPC: C07D209/20
Filed: 2013-10-09
Abstract: Binding of fomyl peptide receptor 1 (FPR1) by N-formyl peptides can induce neutrophil activation and may represent a new therapeutic target in either sterile or septic inflammation. In present application, a series of new dipeptide derivatives as shown general formula (I) is provided. Of these, each of R1 and R4 is one selected from a group consisting of hydrogen atom, hydroxyl group, C1-C4 alkyl, C1-C4 alkoxyl and glycin-nitrile amide group; each of R2 and R3 is one selected from a group consisting of hydrogen atom, hydroxyl group, pyridinyl group, phenyl group, pyridinyl group, C1-C4 alkoxyl substitute on the ester group, and a hydroxyl group, halogen group, C1-C4 alkoxyl group, C1-C4 alkyl group substitute on the aromatic ring of benzoyl group. Additionally, the configurations of two amino acids are S and R configurations, respectively.
Patent TW-201612327-A (TW)
Title: Copper alloy material and method for manufacturing the same
Inventor: SHIOMI WATARU
IPC: C22C9/05
Filed: 2015-02-26
Abstract: A copper alloy material of the invention contains copper (Cu) and 7.0 mass% or more and 20.0 mass% or less of manganese(Mn), and has a Vickers hardness of 150 HV or more, and an absolute value of temperature coefficient of resistance (TCR) at 20 DEG C or more and 150 DEG C or less is 50 ppm/K or less. Therefore, the copper alloy material of the invention is suitable for, for example, a metal plate resistor used in a resistor and so on. A wrinkle or fold is hardly generated during a manufacturing step and an operation thereafter, and the copper alloy material of the invention can have TCR in a wide temperature range of 20 DEG C to 150 DEG C. In addition, the copper alloy material of the invention can be manufactured by a manufacturing method which includes a heat treatment step that is performed in a nonoxidizing atmosphere after a rolling step and has a holding temperature of 200 DEG C or more and 400 DEG C or less.
Patent TW-201610043-A (TW)
Title: Photocatalyst coating liquid and photocatalyst film using same
Inventor: FUJII TAKAHARU
IPC: C09D175/04
Filed: 2015-03-03
Abstract: The present invention is to provide a photocatalyst coating liquid capable of obtaining sufficient photocatalytic activity, and being able to form a photocatalyst film by coating one liquid without complicated process under certain conditions. The photocatalyst coating liquid comprises nano-sized photocatalyst particles, negatively charged substance with a Zate potentialbetween -30mV and -70mV that is repulsive with the photocatalyst particles in a solution containing the photocatalyst particles, and resin in a non-solidified state, and the photocatalyst is to be located upon the surface after coating.
Patent TW-201607748-A (TW)
Title: Adhesive sheet
Inventor: KATO KIICHIRO
IPC: C09J7/10
Filed: 2015-04-02
Abstract: Provided is an adhesive sheet having, on a base member or a release member, a resin layer comprising a multi-layer structure of at least three layers including a microparticle-containing layer containing at least 15 mass% of microparticles, at least the surface ([alpha]) of the resin layer at the reverse side from the side provided to the base member or release member having adhesive properties, wherein the microparticle-containing layer is not formed at the outermost layer of the resin layer, concavities are present on the surface ([alpha]), and the shape of the concavities is non-uniform. The adhesive sheet has favorable adhesive properties and blistering resistance, and has superior air release properties such that air collections that can arise when the adhesive sheet is pasted to an adhesion subject can be easily eliminated.
Patent TW-201543559-A (TW)
Title: Chip spacing maintaining device and chip spacing maintaining method
Inventor: UEKI ATSUSHI
IPC: H01L21/301
Filed: 2015-04-08
Abstract: The subject of this invention is to substantially eliminate the relaxation of an expansion sheet in a short time while the expansion sheet has been expanded. The solution is a chip spacing maintaining device, which is a device for keeping the spacing of a plurality of chips of processed objects at an expanded status in which the objects are supported by a circular frame through an expansion sheet, and equipped with a working table, a frame maintaining mechanism, an expansion mechanism, a heating mechanism and a push-pressing mechanism. The working table is used for sucking and maintaining the processed objects. The frame maintaining mechanism maintains the circular frame around the working table. The expansion mechanism enables the relative movement of the maintaining table and the frame maintaining mechanism in the vertical direction to expand the expansion sheet for forming the spacing between the chips of the processed objects. The heating mechanism is used for irradiating heat on the protrusions generated around the processed objects due to the removal of the expansion of an expansion tape. The push-pressing mechanism is used to push the irradiation position of the heat generated by the heating mechanism set above the expansion sheet from the underneath.
Patent TW-201602106-A (TW)
Title: Compound, organic optoelectric device and display device
Inventor: KIM BYUNG-KU
IPC: H01L51/50
Filed: 2015-04-29
Abstract: A compound represented by Chemical Formula 1, an organic optoelectric device including the same, and a display device including the organic optoelectric device are provided. Chemical Formula 1 is the same as defined in the detailed description.
Patent TW-201602305-A (TW)
Title: Sheet-like resin composition and method for producing semiconductor device
Inventor: HANAZONO HIROYUKI
IPC: C09J7/10
Filed: 2015-05-11
Abstract: Provided are a sheet-like resin composition with which it possible to easily carry out alignment for mounting of a semiconductor element without changing an existing process, and a method for producing a semiconductor device using said sheet-like resin composition. The present invention is a sheet-like resin composition for filling a space between an adherent and a semiconductor element which is electrically connected to the adherent, said composition having a parallel transmittance of 10% or more. The haze of the sheet-like resin composition is preferably 80% or less. The transmittance of the sheet-like resin composition at a wavelength of 580 nm is preferably 15% or more.
Patent TW-201605595-A (TW)
Title: Thin end effector with ability to hold wafer during motion
Inventor: MAZZOCCO JOHN
IPC: H01L21/677
Filed: 2015-05-22
Abstract: Embodiments of the invention include methods and apparatuses for removing a carrier ring assembly from a carrier that includes tightly pitched slots. Embodiments include a robot arm that comprises an end effector wrist, an end effector that has a maximum thickness less than approximately 3.0 mm and a gripping device for securing a carrier ring assembly to the end effector. According to an embodiment, the gripping device may be a clamping member. One or more actuators may be used to displace the clamping member in a direction relative to the end effector. In an additional embodiment, the gripping device may be an electromagnetic device that includes a plurality of electromagnets that are inserted into atop surface of the end effector. Embodiments further include a vacuum gripping device that includes openings in atop surface of the end effector that are coupled to a vacuum controller by air-lines.
Patent TW-201605669-A (TW)
Title: Vehicle seat
Inventor: MOCHIZUKI HARUKI
IPC: B60N2/36
Filed: 2015-05-25
Abstract: Provided is a vehicle seat in which a seat cushion has a cushion body and a movable side section, the movable side section being supported by the cushion body so as to be movable between an upright position and a tilted-down position. A seat is provided with an operation input section into which an operation input can be arbitrarily applied. After an operation input is applied to the operation input section while the movable side section of the seat is held in an upright position, the movable side section tilts down from the upright position in response to a predetermined downward load being applied to the movable side section. That is, after an operation input is applied to the operation input section while the movable side section is held in the upright position, even if a hand is released from the operation input section, the movable side section can be held in the upright position in such a manner that the movable section can tilt down as needed, and consequently, operability is increased.
Patent TW-201617140-A (TW)
Title: Pattern forming method, substrate having transparent conductive film, device and electronic equipment
Inventor: NIIZUMA Naoto
IPC: H01B13/00
Filed: 2015-06-25
Abstract: The purpose of the present invention is to provide: a pattern formation method with which it is possible to improve the degree of freedom in the direction of pattern formation on a substrate without losing productivity; a substrate provided with a transparent film, obtained by said method; a device; and an electronic instrument. The purpose is achieved by ejecting droplets comprising a liquid that contains a functional material onto a substrate (1) from a plurality of nozzles (72a-72f) of a droplet ejection device (7) while moving the droplet ejection device (7) relative to the substrate (1), during which process: at least one group of adjacent droplets that are to be merged on the substrate (1) is arranged so as to be spaced apart in either a relative movement direction (D) or a direction orthogonal to the relative movement direction (D); one or both of the liquid volume and the spacing of the droplets is adjusted so that the droplets merge; and a line of liquid (2) formed by merging of the droplets is dried, thereby depositing the functional material at the edge of the line of liquid (2), and forming a pattern that includes the functional material.
Patent TW-201605554-A (TW)
Title: Cleaning of chamber components with solid carbon dioxide particles
Inventor: SUH SONG-MOON
IPC: C23C16/00
Filed: 2015-07-03
Abstract: Disclosed herein are systems and methods for cleaning a ceramic article using a stream of solid carbon dioxide (CO2) particles. A method includes flowing liquid CO2 into a spray nozzle, and directing a first stream of solid CO2 particles from the spray nozzle toward a ceramic article for a first time duration to clean the ceramic article. The liquid CO2 is converted into the first stream of solid CO2 particles upon exiting the spray nozzle. The first stream of solid CO2 particles causes a layer of solid CO2 to be formed on the ceramic article. After the layer of solid CO2 has sublimated, a second stream of solid CO2 particles is directed from the spray nozzle toward the ceramic article for at least one of the first time duration or a second time duration to further clean the ceramic article.
Patent TW-201613586-A (TW)
Title: Pharmaceutical dosage forms
Inventor: BEATO STEFANIA
IPC: A61K31/45
Filed: 2015-07-06
Abstract: The present invention relates to pharmaceutical dosage forms for oral administration comprising the drug substance 4-[(5R)-6,7-dihydro-5H-pyrrolo[1,2-c]imidazol-5-yl]-3-fluorobenzonitrile or any pharmaceutically acceptable salt thereof and to processes of making said solid pharmaceutical dosage forms.
Patent TW-201704727-A (TW)
Title: Method for testing a lens
Inventor: Li chang-yuan
IPC: G01M11/02
Filed: 2015-07-20
Abstract: A method for testing a lens is provided which has the function of dynamically correcting image distortion and comprises the following steps of obtaining a second image corresponding to an edge pattern and calculating the change amount between the first view field and the second view field of the lens by using the first part of the second image; and calculating the corrected MTF value at a predetermined angle by using a first part of the second image and the change amount between the first view field and the second view field.
Patent TW-201633571-A (TW)
Title: Semiconductor light-emitting device
Inventor: TOMIZAWA HIDEYUKI
IPC: H01L33/58
Filed: 2015-08-06
Abstract: According to one embodiment, the semiconductor light-emitting device has a semiconductor layer, p-side electrode, insulation film, n-side electrode, p-side wiring part, and n-side wiring part. The semiconductor layer has the first semiconductor layer, the second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first semiconductor layer has the first n-side region surrounded by the lamination film comprising the light-emitting layer and the second semiconductor layer. The p-side electrode is provided on the second semiconductor layer. The insulating film is provided on the p-side electrode. The n-side electrode includes a first portion, a second portion, and a third portion. The first portion is provided on a side face of the first semiconductor layer. The second portion is provided in the first n-side region. The third portion overlaps the p-side electrode via the insulating film, and connects the first portion to the second portion. The p-side wiring part is provided on the insulation film. The n-side wiring part is provided on the insulation film.
Patent TW-201709239-A (TW)
Title: Keyswitch and keyboard thereof
Inventor: LIAO PEN-HUI
IPC: H01H13/70
Filed: 2015-08-25
Abstract: A keyswitch and a keyboard capable of preventing electrostatic discharge include a base, a keycap, a lift support device and a circuit board. The circuit board is disposed on the base. A breach is formed on the circuit board, and a light emitting unit is disposed on the base corresponding to the breach. The circuit board includes an upper thin film, a lower thin film, a spacer, a first conductive layer and a second conductive layer. The first conductive layer is located between the lower thin film and the spacer. A part of the first conductive layer is not sheltered by the upper thin film and the lower thin film and adjacent to the breach. The second conductive layer is located between the upper thin film and the lower thin film to contact an arm of the base, and is electrically connected to the first conductive layer via a wire.
Patent TW-201615389-A (TW)
Title: Printed chemical mechanical polishing pad
Inventor: ORILALL MAHENDRA C
IPC: B29C67/02
Filed: 2015-09-25
Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.
Patent TW-201623170-A (TW)
Title: Cutting method and processing device of brittle material substrate
Inventor: TAKEDA MASAKAZU
IPC: B28D5/04
Filed: 2015-10-06
Abstract: The present invention is to inhibit the decrease of processing quality when a plurality of markings is formed by the narrower spacing or crossing during cutting of the glass substrate. The method comprises the first step and the second step. The first step is to make one face of the scribing wheel press onto one face of the surface of glass substrate for moving by the specific load to form the cutting groove along the cutting default line. The second step is to exert the cutting force to the cutting groove formed in the first step to cut off the glass substrate. Moreover, the pressing load of the scribing wheel on the glass substrate in the first step will not generate the ribbing pattern when the groove is formed in the first step, and form the load with the size of perpendicular cracks right beneath the groove.
Patent TW-201716175-A (TW)
Title: Floating-type clamping mechanism
Inventor: CHUANG HSU-PIN
IPC: B23Q3/06
Filed: 2015-11-13
Abstract: The invention relates to a floating-type clamping mechanism. It comprises a working table and a chuck. The working table is provided with a clamping rod on the bottom thereof. The chuck can be released or clamped to be connected to the clamping rod of the working table, wherein the chuck includes a base having an accommodation chamber in the center thereof. The base is locked with a top seat at its opening end, and the accommodation chamber of the base is disposed with a piston seat. A plurality of elastic members is annularly provided between the piston seat and the top seat, and a movable seat is arranged in the center of the piston seat. An annular inclined surface is provided at an outside of the top of the movable seat and is stopped at the opening of the top seat. Furthermore, a movable clamping member which can be moved horizontally is provided at the periphery of the movable seat, and a bottom body is disposed at the bottom of the piston seat. Thereby the clamping rod of the working table can be embedded into the movable seat and moved inwardly through the movable clamping member. Meanwhile the movable seat can be moved upwardly and pressed downwardly to stably clamp the clamping through the opening between the annular inclined surface of the movable seat and the top seat to achieve zero clamping effect between the working table and the chuck.
Patent TW-201701359-A (TW)
Title: Semiconductor device and method of fabrication thereof
Inventor: CHING KUO-CHENG
IPC: H01L29/772
Filed: 2015-11-19
Abstract: A method of semiconductor device fabrication is described that includes forming a fin extending from a substrate and having a source/drain region and a channel region. The fin includes a first epitaxial layer having a first composition and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer having a second composition. The second epitaxial layer is removed from the source/drain region of the fin to form a gap. The gap is filled with a dielectric material. Another epitaxial material is formed on at least two surfaces of the first epitaxial layer to form a source/drain feature.
Patent TW-201717823-A (TW)
Title: Tea drink preparation method capable of avoiding deterioration in color and flavor and maintaining a good hygiene condition
Inventor: LIN JIAN-HONG
IPC: A47J31/44
Filed: 2015-11-24
Abstract: The present invention relates to a tea drink preparation method, which comprises: putting powdered tea leaf into a high-temperature and high-pressure brewing machine using the high temperature and high pressure manner to brew a hot tea drink; and using a beverage cooling device to cool down the hot tea drink into a cold tea drink and, at the same time, using a vessel to contain the cooled cold tea drink, thereby completing the preparation of tea drink. Because the hot tea drink is cooled down by using the beverage cooling device, the contact time between the hot tea drink and the external air can be shortened, thereby avoiding deterioration in color and flavor due to oxidation caused by the hot tea drink contacting the external air for a long time, and reducing the possibility of contacting external contaminants to maintain a good hygiene condition. In addition, there is no need to add ice cubes for cooling as the hot tea drink is cooled down by using the beverage cooling device, so as to avoid contacting external contaminants contacted to the ice cubes in the process of manufacture and delivery, thereby further maintaining the tea drink in a good hygiene condition.
Patent TW-201626098-A (TW)
Title: Materials, components, and methods for use with extreme ultraviolet radiation in lithography and other applications
Inventor: JAISWAL SUPRIYA
IPC: B82Y40/00
Filed: 2015-11-26
Abstract: Nanostructured photonic materials, and associated components for use in devices and systems operating at ultraviolet (UV), extreme ultraviolet (EUV), and/or soft Xray wavelengths are described. Such a material may be fabricated with nanoscale features tailored for a selected wavelength range, such as at particular UV, EUV, or soft Xray wavelengths or wavelength ranges. Such a material may be used to make components such as mirrors, lenses or other optics, panels, lightsources, masks, photoresists, or other components for use in applications such as lithography, wafer patterning, astronomical and space applications, biomedical applications, biotech or other applications.
Patent TW-201620777-A (TW)
Title: A multiple bicycle sprocket assembly
Inventor: TOKUYAMA KOJI
IPC: B62M9/10
Filed: 2015-11-30
Abstract: It is an object of the present invention to provide a multiple bicycle sprocket assembly capable of constituting a gear ratio in a wide range. The multiple bicycle sprocket assembly includes a first sprocket and a second sprocket. The first sprocket includes a first tooth number that is less than or equal to ten. The second sprocket includes a second tooth number that is more than or equal to forty-four.
Patent TW-201636283-A (TW)
Title: Solder balls container and package for storing solder balls
Inventor: SATO ISAMU
IPC: B65D85/00
Filed: 2015-12-29
Abstract: This invention provides a solder balls container capable of preventing the solder balls from being crushed. The solder balls container 10 has a cylindrical container body 20 having a bottom and a cover portion 40 having a planar part 41 covering an opening 23 of the container body 20, and a side part 42 covering at least a portion of an outer peripheral surface of the container body 20, and an inner plug portion 50 disposed in the interior of the cover portion 40. The planar portion 41 has ribs 45, 46 disposed along the outer periphery of the planar portion 41. The inner plug portion 50 is so configured that, when the container body 20 is closed by the cover portion 40, the inner plug 50 is pinched between the rib portions 45, 46 and an edge portion 24 and is deformed into a convex shape protruding towards the opening 23 of the container body 20.
Patent TW-201614763-A (TW)
Title: Devices for methodologies for debonding and handling semiconductor wafers
Inventor: CANALE STEVE
IPC: H01L21/683
Filed: 2011-06-07
Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates and handling of debonded wafers. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force or a shear force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. Also disclosed are various devices and methodologies for handling and processing wafers that have been debonded from their carriers.