baber/WOPTO huggingface dataset:
Patent KR-20070015058-A (KR)
Title: Vehicular headlamp
Inventor: WATANABE SHIGEYUKI
IPC: F21W107/10
Filed: 2006-07-28
Abstract: A vehicular head lamp is provided to secure back light accuracy of each optical unit by integrating a resin lens and a resin shade. A vehicular head lamp includes a plurality of light source units(50) using light emitting diodes(54) as light sources. The plurality of light source units are installed in a metallic bracket(20). Irradiation light patterns of the light source units are synthesized to form predetermined back lights. Each of the light source units includes a shade(58) and a resin lens(52). The shade is coupled with the bracket in order to be disposed in front of the light emitting diodes. The resin lens is connected with the shade. A part of the shade coupled with the bracket is formed of a metallic material.
Patent KR-20080010839-A (KR)
Title: Combination structure of water temp sensor forair conditioner
Inventor: SEO JEONG HUN
IPC: B60H1/08
Filed: 2006-07-28
Abstract: A coupling structure of a water sensor of an air conditioner is provided to install a sensor receiving part in a heat shielding cover surrounding a heater core pipe exposed to the outside surface of an air conditioning case and to fix the water sensor into the sensor receiving part. An air conditioner includes an air conditioning case(10) and a heat shielding cover(40) surrounding a heater core pipe(32) exposed to the outside surface of the air conditioning case. The heat shielding cover is provided with a sensor receiving part(41). A water sensor(50) and a fixture clip(60) are fixed to the sensor receiving part. A contact part of the water sensor has a curved surface identical to the outer surface of a heater core pipe. The water sensor sticks to the heater core pipe by the fixture clip.
Patent KR-20080010931-A (KR)
Title: Pcb mounting type terminal and connector having thereof
Inventor: SHIN EUN SU
IPC: H01R12/57
Filed: 2006-07-28
Abstract: A PCB(Printed Circuit Board) mounting type terminal and a connector with the same are provided to insert the connector between both edges of a cut portion of a PCB through guide ribs of a housing but not to mount the connector on the PCB, thereby reducing the thickness of a unit including the PCB. A PCB mounting type connector comprises a housing(21) having guide ribs(27) formed at both sides thereof, wherein the guide ribs are protruded from both sides of the housing so that the housing is inserted into a PCB(14) having a cut side. A plurality of terminals(30) is inserted into the housing, and soldered on the PCB. A joining hook is formed at a portion of the housing corresponding to a space between the guide ribs so that the connector is fixed to the PCB.
Patent KR-20080014461-A (KR)
Title: Cosmetic transdermal patch
Inventor: KANG SEONG IL
IPC: A61K8/02
Filed: 2006-08-11
Abstract: A cosmetic transdermal patch is provided to supply active ingredients to the skin, improve convenience of adhesion to and release from the skin having a curved surface, and moisturize the skin, so that the patch is useful for improvement of the skin. A cosmetic transdermal patch comprises a support layer, an adhesive layer containing skin-activating ingredients and an adhesive agent, and a heteromorphy layer, wherein the support layer is selected from polyester film, polyurethane film, polyolefin, polyethylenevinylacetate, aluminum film, polyvinylalcohol film, polystyrene film, accumulated film or blended film and has thickness of 10-2000 mum; the adhesive agent is acryl-based adhesive agent, silicon-based adhesive agent or rubber-based adhesive agent; the skin-activating ingredients include anti-wrinkle agent, radical scavenger, slimming agent, whitening agent, anti-acne agent, moisturizer, anti-seborrhoeic agent, anti-aging agent, keratolytic agent, anti-bacterial agent, anti-fungal agent, anti-perspirant, cicatrizing agent, deodorant, immunoregulator, vascular protector or polyelectrolyte; and the heteromorphy layer is polyethylenetherephthalate film or polyolefinpolypropylene and has thickness of 10-2000 mum. Further, an air-contacted area of the adhesive layer is less than 5% of a whole area of the adhesive layer.
Patent KR-20080015992-A (KR)
Title: Apparatus and method for providing timeshift having bookmark function
Inventor: LEE SEUNG HUN
IPC: H04N5/93
Filed: 2006-08-17
Abstract: A timeshift providing apparatus and method having a bookmark function are provided to generate the checksum of record data stored in prestored record position addresses and reproduce data from a specific position which a user selects if the generated checksum of record data matches prestored checksum. A timeshift providing apparatus comprises a storage unit(17) and a control unit(13). The storage unit stores record position addresses selected as bookmarks and the checksum of record data. The control unit generates the checksum of the record data stored in the stored record position addresses to generate record data if the generated check sum of the stored record data matches prestored checksum when the reproduction of a bookmark is requested.
Patent KR-20080018002-A (KR)
Title: Non-needleworks panty and making equipment and production method thereof
Inventor: KIM KYUNG SOO
IPC: A41B9/00
Filed: 2006-08-23
Abstract: A method of making non-sewing underwear by forming a protecting member according to a standard frame, attaching a lining cloth and an adhesive tape to a forming plate and cutting it and its making apparatus are provided to automatically manufacture underwear with good wearing comfort without manual processing by automation of all processes. Non-sewing underwear is manufactured by the steps of: forming a protecting member at any one part of a fabric(60), attaching a lining cloth(62) to a waistband and an adhesive tape(63) to an adhesion part; placing a setting plate in four directions of the fabric and making a hole; fixing the perforated fabric to a setting pin of a forming plate(80); turning the forming plate upside down (180degree) and coupling to a mold(91) of a cutting and forming device(90); cutting the waistband, adhesion part and edge of the fabric along a cutting line(92) of the mold by driving an irradiation device of a fabric cutting device; and adhering the adhesive tape. The forming plate is formed by a setting pin(82) and has the space(81) with the same shape as a standard frame. A cutting point(93) is formed at regular intervals at a cutting groove(94) to guide the travel path of the irradiation device.
Patent KR-20080019855-A (KR)
Title: Inconel robot welding method for cylinder cover injection valve hole of the marine diesel engine
Inventor: LEE HYO JAE
IPC: B23K9/04
Filed: 2006-08-29
Abstract: An overlay welding method of a surface hole is provided to perform overlay welding perfectly by programming a robot such that the robot performs welding on a section with a constant curvature in case of lateral welding and performs welding on a straight line section in case of longitudinal welding, thereby constantly maintaining a surface of a cylinder cover. In a method for overlay welding of a cylinder cover using a robot, an inconel robot welding method for a cylinder cover injection valve hole of a marine diesel engine comprises: a first layer-hole welding step of welding a lower portion of the hole such that an inner part of an inclined hole is horizontal to fill a hole formed in an initial weldment; a second layer-hole welding step of welding on other portion of the hole in accordance with a slope of the inclined hole after finishing welding in the first layer-hole welding step; and a third layer-hole welding step of welding another portion of the holes such that the welded-another portion of the holes is finished after performing welding of the second layer-hole welding step.
Patent KR-20070043597-A (KR)
Inventor: NOBE TAKASHI
IPC: H01L21/304
Filed: 2006-09-05
Abstract: 본딩 장치의 칩의 픽업에 대하여 그 이물질 제거를 더 충분히 행하는 것을 가능하게 하는 것이다.  
     본딩 장치(10)는 복수의 칩(8)이 배열되어 유지되는 웨이퍼 링(12)과, 칩을 흡인 유지하여 반송하는 콜릿(20)과, 웨이퍼 링(12)과 콜릿(20) 등의 주위에 이온화된 가스를 공급하는 제전기(30)와, 칩(8)에 이온화된 가스를 분사하는 분사부(40)와, 이온화된 가스를 흡인하는 덕트부(50)를 포함하여 구성된다.  여기서, 웨이퍼 링(12)의 하부에는 콜릿(20)의 바로 아래에서 칩(8)을 밀어올리는 푸시업 핀(18)을 갖는 푸시업 스테이지(16)가 배치된다.  분사부(40)는 푸시업 타이밍의 직전에만 칩에 대하여 이온화된 가스를 분사한다.  
       
     익스팬드 필름, 웨이퍼, 웨이퍼 링, 푸시업 핀, 푸시업 스테이지, 플랫 콜릿, 제전기, 이온화된 가스, 본딩 장치, 분사 수단
Patent KR-20080031546-A (KR)
Title: Microbiological degradation of endosulfan and endosulfan sulfate on contaminated soil
Inventor: KWON GI SEOK
IPC: C12N1/20
Filed: 2006-10-04
Abstract: A microbiological degradation method of agricultural chemicals in contaminated soil is provided to degrade endosulfan as a high toxic agricultural chemical of organic chlorine and endosulfan sulfate as a toxic metabolite of endosulfan, so that secondary contamination is prevented. A microbial agent for degrading remaining agricultural chemicals comprises Klebsiella oxytoca KE-8(KCTC 10551BP) and Pseudomonas KS-2P(KCTC 10874BP) which are cultured in a minimal medium containing 1.7g of KH2PO4, 4.3g of K2HPO4, 1g of ammonium nitrate, 0.2g of magnesium sulfate, 0.05g of manganese sulfate, 0.01g of ion sulfate and 0.1% of glucose. The agricultural chemicals endosulfan and endosulfan sulfate in contaminated soil are degraded by treating the contaminated soil with the microbial agent without changes of pH and environments of the soil. Further, the soil in which the endosulfan is 7ppm or less is treated by the microbial agent for degrading remaining agricultural chemicals.
Patent KR-20080034634-A (KR)
Title: Thin film transistor substrate and method of manufacturing the same, and liquid crystal display having the same
Inventor: JUNG YOUNG BAE
IPC: G02F1/136
Filed: 2006-10-17
Abstract: A TFT(Thin Film Transistor) substrate, a manufacturing method thereof, and an LCD having the same are provided to form a light blocking film on the TFT substrate as forming a gate line, thereby forming a small black matrix and accordingly improving an aperture ratio. A TFT substrate comprises the followings. A gate line(121) is prolonged in one direction at a predetermined area of an upper part of a substrate. A light blocking film(126) is prolonged in the other direction at a predetermined area of the upper part of the substrate. A data line(141) is prolonged in a direction of crossing the gate line. A pixel electrode(151) is formed in a pixel area defined by the gate line and the data line. The light blocking film is formed in a direction vertical to the gate line so as not to be connected with the gate line. The light blocking film is formed in a direction parallel to the data line and formed in both sides of the data line.
Patent KR-20080016396-A (KR)
Title: Antibacterial nano-fibers containing silver nano-particles and preparation method thereof
Inventor: KIM CHAN
IPC: D01F1/10
Filed: 2006-10-19
Abstract: An antibacterial nano-fiber containing silver nano-particles and a preparation method thereof are provided to mix silver nano precursor materials into the spun solution and to remove the remaining organic solvent completely. A fiber forming high polymer and silver metal salt are dissolved in the solvent so that the spinning solution is manufactured. The spinning solution is electrically spun. The electrically spun fiber is annealed at the air atmosphere so that an insoluble fiber is manufactured. Thereafter, the insoluble nano-fiber is annealed at the inner gas atmosphere as a carbonation process. As an activation process, at the steam atmosphere, the insoluble nano-fiber is also annealed. The silver metal salt is silver nitrate, sliver sulfate or silver chloride. The annealing temperature at the insoluble process is below 350°C. The annealing temperature at the carbonation process or the activation process is below 1000°C. Further, the spinning solution additionally consists of a photocatalyst.
Patent KR-20080037777-A (KR)
Title: Sputtering apparatus
Inventor: AHN YU KYEONG
IPC: H01L21/203
Filed: 2006-10-27
Abstract: A sputtering apparatus is provided to simplify a sputtering process by cleaning a chamber at a vacuum condition, when a target material is re-deposited on an upper portion of a target. A vacuum condition is maintained in a chamber(300). An air ejection hole(213) is arranged on one side of the chamber and maintains the vacuum condition in the chamber. A first gas injection hole(211) is arranged on one side of the chamber and injects inertia gas into the chamber. A substrate transfer unit(209) is arranged in the chamber and transfers a substrate. A backing plate(203) is arranged in the chamber and calibrates a target, which is a thin film material deposited on the substrate. A cathode plate(205) is arranged at a rear surface of the backing plate. A DC voltage is applied on the cathode plate. A second gas injection hole(231) injects cleaning gas into the chamber, such that the target is cleaned.
Patent KR-20070081737-A (KR)
Title: Floor slab bridge structure
Inventor: TOKUNO MITSUHIRO
IPC: E01D19/12
Filed: 2006-10-30
Abstract: A slab bridge structure is provided to prevent the expansion and contraction, deflection or distortion of a bridge girder effectively by increasing the rigid joining strength of a bridge girder and a concrete pier and to prevent the fall of a bridge against a strong earthquake by increasing the strength of connection concrete against the expansion and contraction, deflection or distortion of the bridge girder. The slab bridge structure is composed of a rigid joining structure formed by placing slab concrete(3) in the longitudinal direction of a bridge girder between sides of each bridge girder(1,1') supported on concrete piers(2) and lined up in the widthwise direction of a bridge, forming a slab(4) with a composite structure of a bridge girder and slab concrete, and placing connection concrete(11) on bridge seats(10) of the concrete piers supporting the bridge girders to bury the bridge girders supported to the bridge seats partially, and connecting the slab concrete and the concrete pier by the connection concrete.
Patent KR-20070049971-A (KR)
Inventor: KUROSAWA TETSUYA
IPC: H01L21/301
Filed: 2006-11-08
Abstract: 생산성의 저하를 초래하지 않고서 반도체 웨이퍼를 분할할 때의 기점의 안정화와 고정밀도화를 꾀할 수 있어, 제조 수율을 향상시킬 수 있는 반도체 장치의 제조 방법을 제공하는 것을 목적으로 하고 있다.  이를 위해, 반도체 웨이퍼(11)의 주 표면에 소자를 형성하고, 상기 반도체 웨이퍼의 이면에, 다이싱 라인 또는 칩 분할 라인을 따라, 기계적 또는 화학적인 방법으로 홈(17)을 형성한다.  그 후, 상기 홈 내에 레이저를 조사해서 개질층(20)을 형성하고, 상기 개질층을 기점으로 해서 상기 반도체 웨이퍼를 분할한다.  그리고, 상기 반도체 웨이퍼의 이면을, 적어도 상기 홈의 깊이까지 제거한다.   
       
     반도체 장치, 반도체 웨이퍼, 레이저 조사, 개질층, 다이싱 블레이드
Patent KR-20080043662-A (KR)
Title: Hydraulic control system for automatic transmission
Inventor: LIM KI BEEN
IPC: F16H61/00
Filed: 2006-11-14
Abstract: A hydraulic control device for an automatic transmission is provided to improve a fuel efficiency by variably controlling pressure of a torque converter control valve in accordance with revolutions of an engine. Hydraulic pressure is supplied from an oil pump(2) to a regulator valve(4), and then the hydraulic pressure supplied to the regulator valve is controlled as a line pressure suitable for vehicle driving conditions by a seventh solenoid valve(S7). A part of the line pressure is supplied to a torque converter control valve(6) as torque converter and lubrication. Pressure of the torque converter control valve is controlled by using the solenoid valve. A part of hydraulic pressure supplied to a second port(32) acts on a first land(30), and resilient force of a resilient member(36) and control pressure of the solenoid valve act on a third land(34).
Patent KR-20080044674-A (KR)
Title: Plasma display panel
Inventor: HONG CHONG GI
IPC: H01J11/22
Filed: 2006-11-17
Abstract: A plasma display panel is provided to decrease the reflective brightness by using a first electrode layer and a second electrode layer which are colored by complementary colors. A front substrate(15) and a rear substrate are opposite to each other at a desired interval. Address electrodes are extended in a first direction on the rear substrate, and display electrodes(16) are formed on the front substrate in a second direction crossing the first direction. Barrier ribs(13) are interposed between the front and rear substrates to define plural discharge cells therebetween. A phosphor layer(14) is formed in each discharge cell. The display electrode includes a bus electrode composed of a first electrode layer(16ca) colored by a first color and a second electrode layer(16cd) colored by a second color which is subtractively mixed with the first color.
Patent KR-20070054127-A (KR)
Title: Mounting for an optical apparatus
Inventor: VOGT PHILIPPE
IPC: G03B17/56
Filed: 2006-11-22
Abstract: Retaining bracket has a joint sphere (1) and a mounting device for the optical device. A means is provided for fixing of mounting device at the joint sphere. The mounting device has two rings (6,7) which are movable to each other and movably arranged at joint sphere. A fixing device is arranged between the rings and connects the whole thing in such a manner that the rings are moved together and at same time and together.
Patent KR-20080052897-A (KR)
Title: Resin composition for anisotropic conductive adhesive comprising core-shell rubber
Inventor: CHOI JUNG SIK
IPC: C09J163/00
Filed: 2006-12-08
Abstract: A resin composition for an anisotropically conductive adhesive is provided to produce an anisotropically conductive adhesive having excellent dimensional stability, reliability, and insulating properties. A resin composition for an anisotropically conductive adhesive includes (a) an epoxy resin, (b) a latent hardener, (c) conductive particles, and (d) rubbers of core-shell structure. The composition further comprises 0.01-5wt% of a solvent. The epoxy resin is a molecule having a aliphatic, alicyclic, aromatic cyclic or linear main chain having a molecular weight of 300 or more, which is a polyfunctional epoxy resin having at least two glycidyl groups in the molecule. The latent hardener is a powdery hardener or capsule-like hardener.
Patent KR-20080053120-A (KR)
Title: Universal package test board assembly
Inventor: KIM BYONG SEOK
IPC: H01L21/66
Filed: 2006-12-08
Abstract: A universal package test board assembly is provided to reduce a manufacture cost of a device interface board and a package test cost by using a universal package test board connected to a tester. A semi socket(40a) is connected to a general socket(50) on which a chip(20) is placed. A universal package test board(10) is connected to the semi socket and a tester to test the characteristics of the chip being placed on the general socket. The universal package test board has a structure of which upper and lower surfaces are simultaneously connected to the semi socket. The number of universal package test boards is two or four. Using the universal package test board reduces a manufacture cost of a device interface board and a package test cost.
Patent KR-20080055192-A (KR)
Title: In-plane switching liquid crystal display device
Inventor: KIM WON JOUNG
IPC: G02F1/1345
Filed: 2006-12-14
Abstract: An in-plane switching LCD(Liquid Crystal Display) device is provided to reduce the outer wire resistance by half by connecting the outer wire of each common electrode in a row with a conduction seal so as to improve the afterimage lag and picture quality. The first substrate(110) is formed by arranging the gate line and the data line vertically and horizontally. Multiple common electrode wires(115) are formed in mutually parallel to gate line on the first substrate. A first common electrode outer wire(119) is electrically connected to both ends of the common electrode wire, and is formed by one outer block having horizontality to the gate line and by both outer block having horizontality to the data line. A second substrate(230) is bonded for facing with the first substrate. A second common electrode outer wire(235) is electrically connected to the first common electrode outer wire so as to have mutual symmetry and correspondence on the second substrate. A contact part applies common voltage to at least one end of the first common electrode outer wire of the common electrode wire.
Patent KR-20070070069-A (KR)
Title: Circuit board testing apparatus and method
Inventor: KAIDA MICHIO
IPC: G01R1/073
Filed: 2006-12-20
Abstract: A circuit board inspection device and a method thereof are provided to measure four terminals with high-density wiring patterns such as the surface of a flip chip and to simplify wiring between an inspection probe and an inspection device. A circuit board inspection device(23) is composed of plural inspection probes(20-1,20-2,20-n,26) contacted to each inspection point of wires(28) of a circuit board to calculate resistance values of the wires and composed of first and second probes, wherein one of the first and second probes is used as voltage measuring probes(20S1,20S2,20Sn,26S) and the other is used as current supply probes(20F,26F); a current supply unit for supplying current to the current supply probe; a voltage measuring unit measuring voltage between the voltage measuring probes; a processing unit calculating the resistance value of the wire by using a current value sent from the current supply unit and a voltage value measured by the voltage measuring unit; and a conductive connecting member connecting plural current supply probes with the current supply unit to apply current and electrically coupling plural current supply probes to each other.
Patent KR-20080059853-A (KR)
Title: The greening material for artificial ground and manufacturing method thererof
Inventor: YOO YEONG SEOK
IPC: B09C1/00
Filed: 2006-12-26
Abstract: A greening material for artificial ground is provided to enable plants to grow on the greening material by synthesizing zeolite on a surface of the greening material and forming a carbide in the greening material using a high temperature molten salt and sewage sludge, thereby allowing micropores formed in the greening material to perform an adsorption process, and a preparing method of the greening material for artificial ground is provided. A preparing method of a greening material for artificial ground comprises the steps of: (i) manufacturing a molding using a sewage sludge dried powder; (ii) preparing a coating composition comprising a water glass, a high temperature molten salt, and a zeolite seed; (iii) coating the molding manufactured in the step(i) with the coating composition prepared in the step(ii); and (iv) firing the coated molding. The step(ii) is performed by preparing a coating composition comprising 20 to 50 weight parts of a water glass, 80 to 50 weight parts of a high temperature molten salt, and 20 to 60 weight parts of a zeolite seed with respect to 100 weight parts of the high temperature molten salt. The coating composition further comprises a mineralizer. The mineralizer is at least one selected from the group consisting of NaOH, KOH, and NH4F. The coating composition further comprises 10 to 20 weight parts of a mineralizer with respect to 100 weight parts of the high temperature molten salt. The high temperature molten salt is at least one selected from the group consisting of KCl, KF, KI, NaCl, NaI, Na2CO3, Na2SO4, CaCl2, CaI2, MgCl2, and MgI2. The firing process is conducted at 900 to 1100 deg.C for 9 to 15 hours in the step(iv).