baber/WOPTO huggingface dataset:
Patent TW-201606676-A (TW)
Title: Method and computer program product of deciding internet group buying price by means of on-line auction
Inventor: CHEN CHUI-CHENG
IPC: G06Q30/06
Filed: 2014-08-14
Abstract: The present invention relates to a method and a computer program product of deciding internet group buying price by means of on-line auction. The method includes: (1) uploading, by a seller, a product information, a selling price, an acceptable selling price and a discount amount of a product to a server; (2) accessing, by a buyer, the product information and the selling price of the product from the server; (3) inputting, by the buyer, a desired buying price into the server so that the server can compare the desired buying price with the acceptable selling price in which, when the desired buying price is lower than the acceptable selling price, a new selling price will be equal to the selling price minus the discount amount; and (4) setting the new selling price as the group buying price once the desired buying price input by the buyer is not lower than the acceptable selling price.
Patent TW-201515160-A (TW)
Title: Apparatus and method for bonding a plurality of semiconductor chips onto a substrate
Inventor: SEN AMLAN
IPC: H01L23/12
Filed: 2014-08-14
Abstract: An apparatus and a method for bonding semiconductor a plurality of semiconductor chips to a substrate are provided. The apparatus comprises a frame; a plurality of bond heads coupled to the frame, each bond head being operable to obtain and release a chip; and a bond stage coupled to the frame and operable to receive a substrate; each bond head of the plurality of bond heads being relatively moveable with respect to the bond stage and operable to contact a chip obtained by the bond head with a substrate received on the bond stage and to release the chip to bond the chip to the substrate.
Patent TW-201606236-A (TW)
Title: Knockdown optical component structure
Inventor: WU CHIEN-JUNG
IPC: F21V8/00
Filed: 2014-08-15
Abstract: A knockdown optical component structure provides the functions of changing the optical lens assembling mode and optical emission effect and modifying the light source illumination or configuration patterns (or shapes) according to the light source wattage, size or area. The knockdown optical component structure includes a light guide base body and at least one light guide body assembled therewith. A connection part is disposed at a circumferential section of the light guide main body. A predetermined section of the light guide body is formed with a perforation (or a depression) on which an assembling part is formed. The connection part is relatively pivoted to the assembling part, whereby the light guide substrate body is detachably received in the perforation (or the depression) of the light guide body to form an integrated optical component assembly. The present invention solves the problem that requires respectively manufacturing and providing corresponding optical components according to different light sources in the prior art, and prevents less optical variability.
Patent TW-201612459-A (TW)
Title: LED heat dissipation substrate manufacturing process and structure thereof
Inventor: HUANG WEI-JIA
IPC: F21V29/50
Filed: 2014-09-18
Abstract: The present invention relates to a LED heat dissipation substrate manufacturing process and a structure thereof. The method mainly includes: performing a first-time cutout on a flexible substrate and defining a first conducting plate, a second conducting plate, and third conducting plates connected to each other; arranging a cover film on a surface of the flexible substrate for partially covering each of adjacent first cutout areas; forming a plurality of second cutout areas on the cover film and simultaneously performing a second-time cutout on the flexible substrate so as to allow the first conducting plate, the second conducting plate and the third conducting plates not to be connected to each other; connecting each LED die between each of the third conducting plates; and using a first conducting section and a second conducting section to connect the first conducting plate, the second conducting plate and the third conducting plates in series, and respectively connecting a positive wire and a negative wire to the first conducting plate and the second conducting plate for energizing and exciting the LED dies. Accordingly, the present invention can be flexible, have unlimited length, and be manufactured continuously without conventional plating and etching processes during the manufacturing process. Therefore, it does not need any washing and generate any waste water and thereby achieves the purpose of environmental protection.
Patent TW-201611742-A (TW)
Title: Method for manufacturing sole that is combined with tacks synchronously and the sole structure with tacks
Inventor: YANG TENG-JEN
IPC: A43B13/14
Filed: 2014-09-24
Abstract: A method for manufacturing sole that is combined with tacks synchronously and the sole structure with tacks, which includes the following steps: performing tacks, placing the tacks in an injection molding mould, placing sole material after heating and melting in the mould, coating the sole material on inner and outer surfaces of the tacks, and curing the sole material to the sole after cooling and combining the sole with the tacks, thus forming the sole with tacks.
Patent TW-201514984-A (TW)
Title: Bottom rail and data storage system using the same
Inventor: LO MAO-YUAN
IPC: G11B33/04
Filed: 2014-09-26
Abstract: The present invention provides a bottom rail, including: an outer railand an inner rail slidably provided within the outer rail. The outer rail includes a base plate; two sidewalls; two top plates; and two rotating devices each having a center through hole and two attaching pieces each having a shaft potion, where the shaft portion passes through the through hole so as to rotationally attach the rotating devices respectively on the opposite sidewalls. The inner rail includes a plurality of slider portion for sliding between the top plates and the rotating device of the outer rail. The bottom rail may further include a protection mechanism for protecting the shaft portions of the attaching pieces from rupture. The present invention also provides a data storage system using the bottom rail.
Patent TW-201616757-A (TW)
Title: Motor control circuit having interference signal suppression
Inventor: TU BAN WEN-BIN
IPC: H02H7/09
Filed: 2014-10-20
Abstract: A motor control circuit having interference signal suppression is connected electrically with a motor module having a signal terminal and a power terminal. The motor control circuit includes a control module, a first transient voltage suppression component and a second transient voltage suppression component. The control module includes a signal terminal connecting electrically with the signal terminal of the motor module and a power terminal connecting electrically with the power terminal of the motor module. The first transient voltage suppression component connects electrically between the signal terminal of the control module and the ground terminal; the second transient voltage suppression component connects electrically between power terminal of the control module and ground terminal. Accordingly, the interference signals with positive and negative high pulses are provided simultaneously to the flow path of the ground terminal to avoid misjudgment and abnormal operation of the motor control circuit or to prevent inner components of the motor control circuit from damages due to high pressure.
Patent TW-201531548-A (TW)
Title: Electrically conductive adhesive tapes
Inventor: BRODD JONATHAN ALTON
IPC: H01B13/00
Filed: 2014-10-24
Abstract: A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.
Patent TW-201536591-A (TW)
Title: Transfer film and transfer molded article produced using same
Inventor: HIZUME YUMI
IPC: B44C1/17
Filed: 2014-11-11
Abstract: Provided are: a transfer film which is prevented from deformation by heating and drying during a printing/coating process without deteriorating the thermal moldability of a thermoplastic resin, and which is imparted with solvent resistance; and a transfer molded article which is produced using this transfer film. A transfer film (6) according to the present invention is provided with a base film (1), shape stabilizing layers (2) that are formed on both surfaces of the base film (1), and a transfer layer (3) that is formed on the surface of one of the shape stabilizing layers (2) and is obtained by sequentially laminating at least a surface protective layer (4) and an adhesive layer (5) in this order from the shape stabilizing layer (2) side.
Patent TW-201527324-A (TW)
Title: Modified antigen binding molecules with altered cell signaling activity
Inventor: UMANA PABLO
IPC: A61K39/395
Filed: 2006-08-25
Abstract: The present invention relates to modified antigen binding molecules (ABMs). In particular embodiments, the present invention relates to recombinant monoclonal antibodies or fragments, including chimeric, primatized or humanized antibodies or fragments, having altered ability to mediate cell signaling activity by a target antigen, and/or altered ability to mediate cross-linking of one or more target antigens. In addition, the present invention relates to nucleic acid molecules encoding such modfied ABMs, and vectors and host cells comprising such nucleic acid molecules. The invention further relates to methods for producing the modified ABMs of the invention, and to methods of using these modified ABMs in treatment of disease. In addition, the present invention relates to modified ABMs with modified glycosylation having improved therapeutic properties, including antibodies with increased Fc receptor binding and increased effector function.
Patent TW-201528328-A (TW)
Title: Endpoint detection system and method of plasma degumming technology
Inventor: YANG PING
IPC: H01L21/67
Filed: 2014-12-03
Abstract: The present invention provides an endpoint detection system and method of plasma degumming technology. The detection method comprises: to generate preset light in which said preset light can be absorbed by the specific gas or particles in a reaction chamber and said specific gas or particles are the gas or particles generated or consumed in the plasma degumming technology; to obtain the incident intensity of the preset light before the preset light enters the reaction chamber; to obtain the exit intensity of the preset light after the preset light passes through the reaction chamber and exits from said reaction chamber; to compare said incident intensity of the preset light with said exit intensity of the preset light, so as to determine if the result of comparison is not less than a preset threshold value, in which if the determination says yes, the degumming technology of plasma is determined to reach the endpoint, wherein said threshold value is, when the plasma degumming technology is not carried out in the reaction chamber, the result of comparison between the incident intensity I0 of the preset light before it enters the reaction chamber and the exit intensity Imin of the preset light after it passes through the reaction chamber and exits from the reaction chamber.
Patent TW-201620571-A (TW)
Title: Pet resuscitator
Inventor: LIANG XIAN-JI
IPC: A61M16/06
Filed: 2014-12-12
Abstract: The present invention provides a pet resuscitator for assisting a user carrying out artificial respiration to a pet, which comprises a mask body, a sealing member, a first convex portion, and a sensor. The mask body is fitted onto the nose and mouth of a pet, and has an air inlet for introducing air to the nose. The sealing member is connected within the mask body, so the interior of the mask body may be formed as sealed while fitting on the pet. The first convex portion is connected within the mask body to keep the mouth in a sealed state. The sensor is disposed on the mask body corresponding to the nose for detecting if there is any air flowing out of the nose. Thus, the present invention enables a user quickly and correctly carrying out artificial respiration for the pet to avoid directly contacting with the pet to cause virus infection and easy to use.
Patent TW-201529444-A (TW)
Title: Wafer boat and apparatus for treating semiconductor wafers
Inventor: REICHART ANDREAS
IPC: B65D85/90
Filed: 2014-12-19
Abstract: A wafer boat for receiving wafers, in particular semiconductor wafers is described. The wafer boat comprises at least two elongated receiving elements made of quartz, each receiving element having a plurality of parallel receiving slots, which extend transverse to the longitudinal extension of the receiving elements, and two end plates, between which the receiving elements are arranged and attached such that the receiving slots of the receiving elements are aligned. For increasing the stability, the wafer boat comprises a plurality of attachment pieces, via which the receiving elements are attached to the end plates, wherein each attachment piece has a circumference which is at least 1.5 times as large as the circumference of a receiving section of the receiving elements comprising the receiving slots, and wherein each attachment piece is welded or bonded to at least one of the following: an end plate and a receiving element.
Patent TW-201623888-A (TW)
Title: Full sun light concentration type solar heater
Inventor: JIANG MING-TAN
IPC: F24S23/74
Filed: 2014-12-24
Abstract: The present invention provides a full sun light concentration type solar heater, which comprises a heat collector, a light concentrating body and a de-focusing structure. The solar heater can perform a movement for being focused or de-focused depending on the sunshine season. The heat collector includes one end concavely formed thereon a bowl-shaped surface and another end extended therefrom a connection part, so that the connection part can be attached to and detached from a carrier capable of storing water. The light concentrating body is positioned at a first position in a range of the bowl-shaped surface of the heat collector, and controls the distances between the respective points of the bowl-shaped surface and the center of the concentrating body to be equal to the focus distance of the light concentrating body, so that the bowl-shaped surface can be focused to receive a multiple of solar energy applied to the light concentrating body from any sunshine angles. The de-focusing structure is located between the heat collector and the light concentrating body so that, when the temperature of the heat collector rises up and reaches a predetermined temperature, the de-focusing structure can drive the light concentrating body to be positioned at the second position with a thermal expansion part, so as to enable the focus distance of the light concentrating body to depart from the bowl-shaped surface. Thus, the heating efficiency of the bowl-shaped surface applied to the heat collector can be greatly lowered for controlling the temperature of the liquid inside the carrier within a specific range.
Patent TW-201539116-A (TW)
Title: Method and structure for lithography processes with focus monitoring and control
Inventor: WANG JHIH-YU
IPC: G03F1/70
Filed: 2014-12-26
Abstract: A method for lithography exposing process is provided. The method includes performing a first lithography exposing process to a resist layer using a mask having a focus-sensitive pattern and an energy-sensitive pattern; measuring critical dimensions (CDs) of transferred focus-sensitive pattern and transferred energy-sensitive pattern on the resist layer; extracting Bossung curves from the CDs; and determining slops of the Bossung curves.
Patent TW-201514121-A (TW)
Title: Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same
Inventor: SAWAI YUICHI
IPC: C03C3/21
Filed: 2012-06-14
Abstract: A purpose of the present invention is to provide a lead-free glass composition which can be softened and flowed at a firing temperature that is the same as or lower than the firing temperatures of conventional low-melting lead-containing glasses. Another purpose of the invention is to provide a lead-free glass composition which has satisfactory thermal stability and satisfactory chemical stability besides that property. The lead-free glass compositions according to the invention are characterized by comprising Ag2O, V2O5, and TeO2 when the components are expressed by oxides, the total content of Ag2O, V2O5, and TeO2 being 75 mass% or higher. Preferably, each composition comprises 10-60 mass% Ag2O, 5-65 mass% V2O5, and 15-50 mass% TeO2.
Patent TW-201542804-A (TW)
Title: Viscosity index improver concentrates for lubricating oil compositions
Inventor: TARIBAGIL RAJIV R
IPC: C10M143/12
Filed: 2014-12-31
Abstract: Concentrates of linear, block copolymers having a polymer block derived from a monoalkenyl arene, covalently linked to one or more blocks of a hydrogenated derivative of a conjugated diene copolymer, dissolved in highly saturated diluent oil, wherein the size of the monoalkenyl arene block is controlled to provide an optimized level of incompatibility of the block copolymer in the selected diluent.
Patent TW-201546903-A (TW)
Title: Semiconductor light-emitting element and method for manufacturing same
Inventor: SUGIYAMA TORU
IPC: H01L33/38
Filed: 2015-01-06
Abstract: To realize a semiconductor light-emitting element that further improves light extraction efficiency while ensuring an adequate spread, in the horizontal direction, of a current flowing through an active layer. This method for manufacturing a semiconductor light-emitting element has: (a) a step for forming a semiconductor layer containing the active layer on the upper layer of a growth substrate; (b) a step for forming a first metal layer on the upper surface of the semiconductor layer; (c) a step for forming a second metal layer on a part of the upper surface of the first metal layer without performing annealing after step (b), and (d) a step for performing an annealing process after step (c).
Patent TW-201627901-A (TW)
Title: RFID access control method and system combining face recognition based on secret splitting and RFID tag used therein
Inventor: Lin wen-hui
IPC: G07C9/00
Filed: 2015-01-20
Abstract: The present invention discloses a RFID access method and system combining face recognition based on secret splitting and a RFID tag used therein. The system includes a RFID tag for storing registered low-frequency facial information, a database for storing a plurality of registered high-frequency facial encoding information and an access recognition device. The access recognition device decomposes an facial image into to-be-recognized low-frequency facial information and to-be-recognized high-frequency facial information, encodes the to-be-recognized high-frequency facial information, obtains the registered low-frequency facial information from the verified RFID tag, compares the to-be-recognized low-frequency facial information to see if it complies with the registered low-frequency facial information, then extracts the corresponding registered high-frequency facial encoding information, and compares the to-be-recognized high-frequency facial encoding information to see if it complies with the registered high-frequency facial encoding information.
Patent TW-201608496-A (TW)
Title: Processing method, device, and system for interactive information
Inventor: ZHENG YONG
IPC: G06Q20/02
Filed: 2015-01-27
Abstract: Disclosed are a processing method, device, and system for interactive information. The method comprises: a third-party authorization terminal is started up to receive an authorization request provided by a data requesting terminal; the third-party authorization terminal generates an authorization information update instruction on the basis of the authorization request; the third-party authorization terminal updates, on the basis of the update instruction, authorization information of the data requesting terminal stored on a request processing server in a way that the data requesting terminal is provided with a permission to process the authorization request, thus allowing the data requesting terminal to acquire a data request result corresponding to data request information. The present application solves the technical problem of the complexity of a process for processing a data request provided by an internet terminal in the prior art of customized information.
Patent TW-201631721-A (TW)
Title: Packaged semiconductor devices
Inventor: HUANG CHUN-FU
IPC: H01L23/488
Filed: 2015-02-17
Abstract: The present disclosure is related to packaged semiconductor devices. The packaged semiconductor device includes a substrate, wherein the substrate includes a pad. A passivation layer is located on the substrate, wherein the passivation layer partially covers the pad. The packaged semiconductor device further includes an under bump metallization (UBM) located on the substrate, wherein the UBM is coupled with the pad; a metal bump located on the UBM; and a solder ball located on the metal bump. The metal bump includes a pillar connected with the UBM; and a hat located on a top of the pillar. The hat includes a cross-sectional area at a bottom portion greater than a cross-sectional area of the pillar. A space is located between the bottom portion of the hat and a top surface of the passivation layer.
Patent TW-201618292-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: HONGO SATOSHI
IPC: H01L27/146
Filed: 2015-02-25
Abstract: A semiconductor device such as, for example an imaging sensor, includes a semiconductor layer in which, for example, a photodiode may be formed. An insulation film is disposed on a surface of the semiconductor layer. The insulation film includes one or more wirings or wiring layers formed therein. A semiconductor support substrate is disposed on the insulation film. The semiconductor support substrate includes a first layer (or region) and a second layer (or region) that is between the insulation film and the first layer. The first layer has a bulk micro defect density that is higher than a bulk micro defect density of the second layer.
Patent TW-201541577-A (TW)
Title: Manufacturing method of electronic component package
Inventor: IINO CHIE
IPC: H01L23/28
Filed: 2015-02-26
Abstract: There is provided a manufacturing method of an electronic component package capable of manufacturing a highly-reliable electronic component package with a favorable yield by preventing the generation of voids after the sealing of an electronic component with a resin. The present invention is a manufacturing method of an electronic component package including Step A and Step B. In Step A, an adherend including multiple electronic components arranged thereon is prepared. In Step B, a sealing resin sheet is laminated on the adherend under pressurization so as to implant the electronic components. In Step B, the pressurization of the sealing resin sheet is carried out using a pressure-dispersing material.