baber/WOPTO huggingface dataset:
Patent TW-575501-B (TW)
Title: Polyester film for releasing a polarizing plate
Inventor: MIZUTANI KEI
IPC: C09J7/29
Filed: 2001-12-31
Granted: 2004-02-11
Abstract: A film for releasing a polarizing plate, which has excellent transparency, silicone adhesion and processing work efficiency, and a small orientation angle, contains little optical foreign matter and is hardly scratched. This film comprises a coextruded polyester film comprising at least two layers and a silicone adhesive layer. The coextruded polyester film has a haze value of 4% or less and an orientation angle of 10 DEG C or less and contains 5 or less flyspecks having a long diameter of 90 mum or more per 0.3 m<2>.
Patent TW-I255007-B (TW)
Title: Method of fabricating a semiconductor device having reduced contact resistance
Inventor: SHIN DONG-SUK
IPC: H01L23/52
Filed: 2001-12-31
Granted: 2006-05-11
Abstract: The present invention relates to a method of fabricating a semiconductor device having the steps of forming an isolation layer in a silicon substrate to define an active region and a device isolation region; forming a junction region in the active region of the silicon substrate; forming an interlayer dielectric layer on the silicon substrate; forming a contact hole exposing the junction region by selectively removing the interlayer dielectric layer; selectively removing an exposed portion of the junction region under the contact hole; sequentially forming a thin metal layer and a buffer layer on the resultant structure including over the selectively removed portion of the junction region; and forming a metal silicide layer in the selectively removed portion of the junction region by performing a heat treatment.
Patent TW-522614-B (TW)
Title: Connector device for card
Inventor: KURODA YOSHIMASA
IPC: H01R13/635
Filed: 2002-02-20
Granted: 2003-03-01
Abstract: The present invention provides a connector device of a card in which a long SD card provided with an antenna circuit or the like can be selectively attached at desired positions with different insertion amounts and which is convenient in handling. A movement mechanism is provided to selectively attached an SD card to a first attachment position with a small insertion amount and to a second attachment position with a large insertion amount, and move the SD card in the ejection direction. Therefore, it is convenient to use. When, for example, being carried, a long SD card 60 can be deeply inserted to be stored in the second attachment position, while when using an antenna circuit or the like, the SD card 60 can be pushed forward by the movement mechanism to be attached to the first attachment position. If a slide member 26, a heart-shaped cam groove 12, an engagement pin 27, an energizing member 29, etc., are provided at this movement mechanism, the long SD card 60 can be easily and smoothly changed from one attachment position to the other attachment position.
Patent TW-583657-B (TW)
Title: Driving structure of optical head
Inventor: LAN YUNG-SUNG
IPC: G11B7/085
Filed: 2002-04-03
Granted: 2004-04-11
Abstract: The driving structure of optical head proposed in the present invention is disposed on the substrate of CDROM drive where a pair of guiding rods is disposed on the substrate to support the optical module. The optical module is contacted with the driving structure and is provided with optical head. The driving mechanism performs multiple reflections onto the self-generated mechanical wave so to drive the optical module on the substrate to move along the guiding rods.
Patent TW-I237460-B (TW)
Title: Method and apparatus for time-aligning transmissions from multiple base stations in a CDMA communication system
Inventor: GRILLI FRANCESCO
IPC: H04B1/707
Filed: 2002-07-09
Granted: 2005-08-01
Abstract: Schemes to time-align transmissions from multiple base stations to a terminal. To achieve time-alignment, differences between the arrival times of transmissions from the base stations, as observed at the terminal, are determined and provided to the system and used to adjust the timing at the base stations such that terminal-specific radio frames arrive at the terminal within a particular time window. In one scheme, a time difference between two base stations is partitioned into a frame-level time difference and a chip-level time difference. Whenever requested to perform and report time difference measurements, the terminal measures the chip-level timing for each candidate base station relative to a reference base station. Additionally, the terminal also measures the frame-level timing and includes this information in the time difference measurement only if required. Otherwise, the terminal sets the frame-level part to a predetermined value (e.g., zero).
Patent TW-557405-B (TW)
Title: Camera
Inventor: MIKAMI YUJI
IPC: G03B17/02
Filed: 2002-08-02
Granted: 2003-10-11
Abstract: The purpose of this invention is to let the assembly and disassembly of a camera easy, and the re-use and the recycle property are enhanced. In the lens unit 11, a diaphragm is switched by means of whether the arm 40b is actuated or not. In the strobe-unit 12, in addition to a synchro-switch 52 and a light-test switch 53, a diaphragm-switch-lever 56 etc. which actuates said arm 40b is also mounted. During assembly, each unit 11 to 13 is only mounted at a given position respectively, the synchro-switch 52 is positioned in the move-path of the press-section 71c of the shutter-piece 71, the light-test switch 53 is positioned in the move-path of a press-pin moved in response to the press operation of the shutter-button, and said diaphragm-switch-lever 56 is positioned in the same plain as the move-path of said arm 40b. Therefore, in taking a photograph, in response to the press operation of the shutter-button at first the diaphragm is switched, then the shutter is released and simultaneously the strobe emits light. During disassembly, only by means of detaching the engagement of the engaging-paw, each unit 11 to 13 can be detached each time.
Patent TW-I278002-B (TW)
Title: Fluorescent lamp with reduced sputtering
Inventor: GARNER RICHARD C
IPC: H01J61/04
Filed: 2002-08-16
Granted: 2007-04-01
Abstract: A mount for a fluorescent lamp that comprises a glass base with spaced-apart lead-in wires extending from therefrom. A longitudinal electrode coil containing an emitter material is mounted upon and extends between the lead-in wires. A coating of zinc oxide is provided on the ends of the electrode coil and upon the lead-in wires at least in the area where the electrode coil is mounted.
Patent TW-I280519-B (TW)
Title: Flame detection device
Inventor: MATSUKUMA HIDENARI
IPC: G08B17/00
Filed: 2002-09-05
Granted: 2007-05-01
Abstract: A flame detection device for detecting a flame caused by a fire, including a light attenuation filter for attenuating 90% or greater of light with wavelengths in a visible to near-infrared band radiated from the flame. The flame detection device further includes an imager for photographing an image of the attenuated light incident thereon, and a processing section for deciding the flame from the image obtained by the imager.
Patent TW-583800-B (TW)
Title: Switchgear
Inventor: ITOU SHUNJI
IPC: H02B5/06
Filed: 2002-10-15
Granted: 2004-04-11
Abstract: The present invention relates to a switchgear. The object of the invention is to provide a gas-insulated switchgear which can eliminate wasteful space and reduce the installation area thereof. To achieve the object, a connection part, to which a transmission side branch bus-bar container of a circuit breaker container is connected, and a connection part, to which a receiving side branch bus-bar container of the circuit breaker container is connected, are arranged vertically in the same direction. One of the transmission side branch bus-bar container and the receiving side bus-bar container is connected to the upper side connection part and the other one of the transmission side branch bus-bar container, and the receiving side branch bus-bar container is connected to the lower side connection part. Further, a transmission side power cable terminal container and a receiving side power cable terminal container are placed at positions which are shifted vertically from the axes of the transmission side branch bus-bar container or the receiving side branch bus-bar container, respectively.
Patent TW-577978-B (TW)
Title: Doppler-type ultrasonic flowmeter
Inventor: TAKEDA YASUSHI
IPC: G01F1/66
Filed: 2002-10-24
Granted: 2004-03-01
Abstract: The Doppler-type ultrasonic flow meter of the present invention is composed of: an ultrasonic transmitting means which injects ultrasonic wave pulses into a fluid pipe from an ultrasonic transducer; a means for measuring the distribution of fluid velocity which receives the ultrasonic echoes reflected from a measuring region in the fluid pipe and measures the distribution of fluid velocity of the fluid to be measured; a means for calculating the flow rate of fluid which calculates the flow rate from the distribution of fluid velocity of the fluid to be measured; and a setting means for selecting the frequency which automatically selects the basic frequency of the ultrasonic wave causing a resonating/transmitting phenomenon from the ultrasonic transducer. The setting means for selecting the frequency controls and drives the ultrasonic transmitting means, so that the ultrasonic wave with an optimal frequency selected is transmitted from the ultrasonic transducer. According to the constitution of the present invention, a highly versatile Doppler-type ultrasonic flow meter is provided, which can easily and accurately measure the flow rate of fluid to be measured flowing inside various kinds of fluid piping without contact.
Patent TW-593715-B (TW)
Title: Sputtering method
Inventor: SUESHIRO SEISUKE
IPC: H01L21/68
Filed: 2002-10-24
Granted: 2004-06-21
Abstract: This invention is to provide a technique of continuously performing sputtering. During a film is formed on the surface of a substrate 5a held by a holding plate 12 by keeping the holding plate 12 inside a treatment chamber in an erected position and sputtering a target 26, an untreated substrate 5b is mounted on the hand 43 of a substrate conveying robot in a conveying chamber, the pressure in the conveying chamber is adjusted to a value substantially equal to the pressure in the treatment chamber, and the substrate 5b is conveyed into the treatment chamber and is mounted on the holding plate 12 kept in a horizontal position. The conveying time does not add any additional time because the untreated substrate can be conveyed into the treatment chamber during sputtering.
Patent TW-I226727-B (TW)
Title: Device for deterring cable displacement
Inventor: KATO JUNICHI
IPC: H01R13/52
Filed: 2002-10-31
Granted: 2005-01-11
Abstract: A device for deterring displacement of a cable (301) is effectuated in an embodiment of the invention by an enclosure (302) that envelops the cable (301), in which the cable (301) is oriented within an assembly such that the enclosure (302) contacts a feature internal to the assembly.
Patent TW-I283473-B (TW)
Title: Stack package structure and electrically-connected board for stack package
Inventor: JENG BO-REN
IPC: H01L23/52
Filed: 2002-11-08
Granted: 2007-07-01
Abstract: The present invention relates to an electrically-connected board for stack package, which is disposed between the first package and the second package for electrically connecting with the first package and the second package. The electrically-connected board for stack package comprises: a top surface, a bottom surface, plural upper bonding pads and plural lower bonding pads. The upper bonding pads are formed on the top surface, and the surface of each upper bonding pad has a tin-lead metal layer. Each upper bonding pad is electrically connected to the bonding pad of the first package disposed on the top surface of the electrically-connected board through a soldering contact. The surface of the lower bonding pad has a tin-lead metal layer, and each lower bonding pad is electrically connected to the bonding pad of the second package disposed on the bottom surface of the electrically-connected board through a soldering contact. Therefore, there is no gold-tin-nickel metal layer formed on the electrically-connected board of the present invention, the lifetime of the soldering contact is increased, and the electrical characteristics are better.
Patent TW-I228369-B (TW)
Title: System for near-simultaneous capture of multiple camera images
Inventor: ZIEMKOWSKI THEODORE B
IPC: H04N5/235
Filed: 2002-11-25
Granted: 2005-02-21
Abstract: A system for synchronizing the exposure of an image by a master camera 101(1) with the exposure of an image by one or more slave cameras 101(n), each of which is located at a different position relative to a common subject 201 to be photographed. Exposure synchronization is accomplished via an optical sensing system 108 on a slave camera 101(n) that detects a light pulse 205 (e.g., a flash or strobe) from the master camera emitted simultaneously with the initiation of the exposure of the subject 201, causing the slave camera 101(n) to trigger an exposure of the subject 201, if the detected light pulse 205 is within the parameters of the image capture mode manually selected for a given camera 101(n).
Patent TW-I257899-B (TW)
Title: Multilayer sheet
Inventor: GORNY RUDIGER
IPC: B32B27/08
Filed: 2002-12-09
Granted: 2006-07-11
Abstract: The present invention relates to a multilayer product containing three layers A, B and C. In this connection layer A contains a base material selected from the group comprising a transparent thermoplastic material and a lacquer. In addition layer A contains a UV absorber. Layer B contains a transparent thermoplastic material and at least one colourant. Layer C contains a transparent thermoplastic material optionally with less colourant than B.
Patent TW-I229396-B (TW)
Title: Semiconductor device and assembling method of the semiconductor device
Inventor: SAKAI TADAHIKO
IPC: H01L23/02
Filed: 2003-04-15
Granted: 2005-03-11
Abstract: The object of this invention is, in a semiconductor device having a thinned semiconductor element, to provide a semiconductor that can prevent damage of the semiconductor element occurring adjacent to the outer periphery to ensure reliability. To this end, the semiconductor device of this invention is formed with a plurality of external connection terminals on the surface, and on the back side of the thinned semiconductor element (2), adheres a plate (4) having a rigidity greater than that of the semiconductor element (2) by means of a resin (5). That is, the outline of the plate (4) is made larger than the outline of the semiconductor element (2), and the side face (2b) of the semiconductor element (2) is covered by the resin (5), thereby forming a reinforcement member (5a) for reinforcing the edge of the semiconductor element (2).
Patent TW-I221759-B (TW)
Title: Enhancement of current-carrying capacity of a multilayer circuit
Inventor: KONDO KOJI
IPC: H05K3/40
Filed: 2003-05-13
Granted: 2004-10-01
Abstract: A multilayer circuit board (100), in which a plurality of insulating layers (23) and a plurality of conductive layers, each of which includes a conductive pattern (22, 22a), have been laminated, includes an insulating layer (23), a conductive compound (51), and a conductive pattern (22a). The insulating layer (23) has a trench (24a). The conductive compound (51) is located in the trench (24a). The conductive pattern (22a) adjoins the trench (24a) and is electrically connected to the conductive compound (51). The conductive pattern (22a) and the conductive compound (51) make up a conductive wire that has a higher current-carrying capacity than the conductive pattern (22a).
Patent TW-594841-B (TW)
Title: Apparatus and method for preventing contamination of substrate from condensate liquid
Inventor: HUNG JIAN-SHIUNG
IPC: G03F7/42
Filed: 2003-05-28
Granted: 2004-06-21
Abstract: This invention relates to a kind of apparatus for preventing contamination of substrate from the condensating liquid, which is working with a substrate and comprises: a reaction chamber for accommodating the substrate and a processing fluid for a processing step, in which the reaction chamber has an input/output port on its one side for transferring the substrate in and out of the reaction chamber; a transferring unit which is used to transfer the substrate in and out of the reaction chamber through the input/output port; a first gas spray unit which is located along the transferring path of the transferring unit outside of the reaction chamber and used to spray gas onto the substrate on the transferring unit; and a second gas spray unit which is located on one side of the input/output port outside of the reaction chamber and used to spray gas onto the input/output port. This invention further provides a method for preventing contamination of substrate from the condensating liquid.
Patent TW-I250906-B (TW)
Title: Circular saw blade for cutting ferrous materials
Inventor: JOHNSON DAVID N
IPC: B23D61/04
Filed: 2003-06-19
Granted: 2006-03-11
Abstract: A saw blade having an annular body constructed of a first material having a perimeter with a plurality of teeth formed therein. A plurality of carbide inserts are affixed to a respective tooth. The carbide inserts include a cutting edge including a first edge surface which is generally parallel to an axis of rotation of the blade and a second angled edge surface which is angled relative to the axis of rotation of the blade and shorter than the first edge surface.
Patent TW-I243033-B (TW)
Title: Slide fastener
Inventor: SEGAWA KIYOMASA
IPC: H05K9/00
Filed: 2003-06-20
Granted: 2005-11-11
Abstract: The present invention is characterized by fitting a fastener element (3) to one edge part (12) of a fastener tape (2), and sewing a sewing thread (6) extending in a longitudinal direction of the fastener tape to the fastener tape (2) near an installation part (5) where the fastener element (3) is installed. A shield coating (7) by plating or fire-resistant additive is simply coated on the fastener tape (2), whereby an electromagnetic wave shield performance and a fire-resistant performance can be provided to the fastener tape (2).
Patent TW-I255280-B (TW)
Title: Improved polymer composition and process for the preparation thereof
Inventor: AMICK DAVID RICHARD
IPC: C08L33/00
Filed: 2003-07-16
Granted: 2006-05-21
Abstract: An aqueous composition including a polymer having polymerized ethylenically unsaturated acid monomer is disclosed. The aqueous composition is prepared in the presence of select organic compounds. As provided is a process to prepare the aqueous composition. The aqueous composition is useful as a dispersant for inorganic particles, a thickener or rheology modifiers for various aqueous formulations, and as a dispersing resin.
Patent TW-I269072-B (TW)
Title: Use of polymerisable diketopyrrolopyrroles in colour filters
Inventor: ADAM JEAN-MARIE
IPC: G02B5/20
Filed: 2003-07-21
Granted: 2006-12-21
Abstract: The present invention relates to the use of polymerisable diketopyrrolopyrroles in colour filters, which can themselves be used for example in electro-optical systems such as TV screens, liquid crystal displays, charge coupled devices, plasma displays or electroluminescent displays and the like. In contrast to conventional pigments the polymerisable diketopyrrolopyrroles do not tend to aggregate and, hence, show very good dispersibility. Color filters prepared by using the polymerisable diketopyrrolopyrroles have high transparence and pure hue. In addition, they facilitate adjustment of color points and enable a large choice of shades.
Patent TW-I228768-B (TW)
Title: Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
Inventor: SHIHO HIROSHI
IPC: C09C1/68
Filed: 2003-08-07
Granted: 2005-03-01
Abstract: The purpose of the present invention is to provide processing method of polishing pad for semiconductor wafer, in which the trench, recesses and through hole with inner surface roughness smaller than 20 mum, high precision and uniform cross-section shape are formed, and the polishing pad for semiconductor wafer. In the invented processing method, a cutting process is used to process the polishing face of the polishing pad that has water non-dissolved base material containing linked polymer and water-dissolved particles dispersed in water non-dissolved base material. In addition, when performing the processing, the polishing pad is placed on one face side of the processing disc having the attraction holes. Moreover, it is better for the pad to be absorbed by the attraction of the other face side of the processing disc so as to form the trench after it is fixed on one face side of the processing disc.
Patent TW-I222325-B (TW)
Title: Interface circuitry for display chip
Inventor: SMITH STERLING
IPC: G06F3/033
Filed: 2003-09-16
Granted: 2004-10-11
Abstract: The present invention provides an interface circuitry of a display chip. According to the present invention, the interface circuitry comprises an input node, a filter and a clamping circuit. The input node is used for receiving an analog image signal. The filter is utilized for processing the analog image signal and providing a processed image signal at an internal node. The clamping circuit is connected between the internal node and a reference level. The clamping circuit is used to clamp the processed image signal by the reference level during a clamping interval.
Patent TW-I230263-B (TW)
Title: Method for quantifying uniformity patterns and including expert knowledge for tool development and control
Inventor: BAILEY ANDREW D III
IPC: H01L21/66
Filed: 2003-09-26
Granted: 2005-04-01
Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.
Patent TW-I225740-B (TW)
Title: High-speed separating H.323 packet method
Inventor: WU JIAN-SHENG
IPC: H04L29/06
Filed: 2003-10-06
Granted: 2004-12-21
Abstract: The present invention is related to a high-speed separating H.323 packet method. After building H.225 protocol connection and before transmitting physical connection of the audio/image multi-medium data at the caller and the called site, network address port transformer (NAPT) is used to change the connection port number of H.245 protocol control packet between the caller and the called site, in which the unique transmission connection number selected by the NAPT is used to change the original connection number in the H.245 protocol control packet so as to provide new connection port number as the index value of the memory for conducting new addition or elimination operation. In addition, new connection port number is used as the index value when performing the searching operation, and high-speed comparison is conducted directly in the memory address so as to increase the separating speed of H.323 packet.