baber/WOPTO huggingface dataset:
Patent TW-202129854-A (TW)
Title: Semiconductor package structure and manufacturing method thereof
Inventor: PAN YU-TANG
IPC: H01L23/495
Filed: 2020-01-21
Abstract: A semiconductor package structure includes a substrate, chip, an encapsulant, a heat dissipation component, and a plurality of conductive terminals. The substrate has a first surface and, a second surface opposite to the first surface. The chip is located on the first surface and is electrically connected to the substrate. The encapsulant encapsulates the chip. The heat dissipation component is located on the second surface and part of the heat dissipation component is embedded in the substrate. The orthographic projection of the chip onto the substrate overlaps the heat dissipation component. The conductive terminals are located on the second surface and are electrically connected to the substrate. The conductive terminals surround the heat dissipation component. A manufacturing method of a semiconductor package structure is also provided.
Patent TW-202100775-A (TW)
Title: Deposition mask group, method for manufacturing electronic device, and electronic device
Inventor: HIGUCHI TAKUYA
IPC: H05B33/10
Filed: 2020-01-31
Abstract: A deposition mask group comprises a first deposition mask which has at least two first through-holes respectively arranged along different two directions, a second deposition mask which has at least two second through-holes respectively arranged along different two directions, and a third deposition mask which has at least two third through-holes. When the first deposition mask, the second deposition mask and the third deposition mask are overlaid on one another, the first through-holes are partially overlapped with the second through-holes or the third through-holes.
Patent TW-202107526-A (TW)
Title: Semiconductor memory device and method of manufacturing semiconductor memory device
Inventor: Yoshimura Naoya
IPC: H01L21/02
Filed: 2020-02-03
Abstract: A semiconductor memory device, comprising: a first conductive layer extending in a first direction within a first layer; a first insulating region extending in the first direction within the first layer and adjacent to the first conductive layer in a second direction intersecting the first direction; and a first pillar extending in a third direction intersecting the first direction and the second direction, dividing the first insulating region, and provided in contact with the first conductive layer; wherein: the first pillar includes a first portion that divides the first insulating region, and a second portion that includes a part isotropic ally extending from the first portion toward the first conductive layer within the first layer; the first portion includes a first semiconductor layer extending in the third direction and a first insulating film provided on a side surface of the first semiconductor layer; the first pillar includes a first region that faces the first portion in the first direction and a second region other than the first region; and the second portion includes a first conductive film that is in contact with the first insulating film and a second insulating film provided between the first conductive film and the first conductive layer, the second insulating film having a first thickness in a fourth direction intersecting the first to third directions within the second region and a second thickness in the second direction within the first region, the first thickness being greater than the second thickness.
Patent TW-202131643-A (TW)
Title: Audio codec circuit
Inventor: CHUANG TSUNG-PENG
IPC: H03G5/00
Filed: 2020-02-06
Abstract: An audio codec circuit includes a voltage-detecting circuit, an output-processing circuit, a digital-to-analog conversion circuit, and an audio-amplifying circuit. The voltage-detecting circuit detects an input voltage of an input power. The output-processing circuit obtains a first output compensation value according to the input voltage, an output circuit parameter and a first output spec. The output-processing circuit processes a digital audio and compensates the processed audio by the first output compensation value. The digital-to-analog conversion circuit converts the compensated audio into an analog audio. The audio-amplifying circuit amplifies the analog audio and outputs the amplified audio.
Patent TW-202105559-A (TW)
Title: Large area metrology and process control for anisotropic chemical etching
Inventor: SREENIVASAN SIDLGATA V
IPC: H01L21/78
Filed: 2020-02-25
Abstract: Various embodiments of the present technology generally relate to semiconductor device architectures and manufacturing techniques. More specifically, some embodiments of the present technology relate to large area metrology and process control for anisotropic chemical etching. Catalyst influenced chemical etching (CICE) can be used to create high aspect ratio semiconductor structures with dimensions in the nanometer to millimeter scale with anisotropic and smooth sidewalls. However, all aspects of the CICE process must be compatible with the equipment used in semiconductor fabrication facilities today, and they must be scalable to enable wafer scale processing with high yield and reliability. This invention relates to metrology and control of etch and CMOS compatible methods of patterning the catalyst and removing it without damaging the etched structures.
Patent TW-202133694-A (TW)
Title: Circuit board
Inventor: FAN CHIA-EN
IPC: H05K1/02
Filed: 2020-02-26
Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test wire. The test wire includes a main part and a branch part which connect with each other, the branch part is provided for touching of a test equipment during electrical test such that breaking of the main part is avoidable.
Patent TW-202135508-A (TW)
Inventor: PO CHAN-PING
IPC: H04L12/28
Filed: 2020-03-03
Abstract: 一種智能工業自動化數據採集裝置及物聯網架設方法。智能工業自動化數據採集裝置包括數個裝置通訊介面、一處理單元及數個服務通訊介面。此些裝置通訊介面用以連線至少一感測裝置。此些裝置通訊介面之通訊型態不完全相同。處理單元連接於此些裝置通訊介面。此些服務通訊介面連接於處理單元。此些服務通訊介面用以連線一後端服務。此些服務通訊介面之通訊型態不完全相同。處理單元依據一裝置通訊設定組態選擇此些裝置通訊介面之其中之一與感測裝置連線。處理單元更依據一服務通訊設定組態選擇此些服務通訊介面之其中之一與後端服務連線。
Patent TW-202111163-A (TW)
Title: Platinum electrodeposition bath and uses thereof
Inventor: CHEUNG WAI KEI
IPC: C25D3/50
Filed: 2020-03-05
Abstract: This invention relates to a platinum electrodeposition bath which is capable of forming platinum deposits having an attractive shiny granular surface like a velvet, which is particularly useful in jewellery manufacturing. The velvet effect can be illustrated by comparing the surface roughness with a bright smooth platinum deposit.
Patent TW-202106831-A (TW)
Title: Adhesive tape
Inventor: SHIOJIMA TARO
IPC: H01L21/683
Filed: 2020-03-23
Abstract: One purpose of the present invention is to provide an adhesive tape which is not separated from an adherend even if used in a process that is accompanied by a high temperature and a load, while being able to be easily separated upon separation, and which is also capable of suppressing deformation of a solder bump. Another purpose of the present invention is to provide a method for producing a semiconductor device, which uses this adhesive tape. The present invention is an adhesive tape which is obtained by sequentially stacking an adhesive layer A, a base material film and an adhesive layer B in this order, wherein: after the adhesive layer A is bonded to a silicon wafer chip, the adhesive layer B is bonded to a glass plate, and the adhesive tape is irradiated with ultraviolet light of 3,000 mJ/cm2 from the adhesive layer B-side surface toward the adhesive layer A and is subjected to a heat treatment at 240 DEG C for 10 minutes, the die shear strength with respect to the silicon wafer chip is 3 N/9 mm2 or more; after the adhesive layer A is bonded to a silicon wafer, and the adhesive tape is irradiated with ultraviolet light of 3,000 mJ/cm2 from the adhesive layer B-side surface toward the adhesive layer A and is subjected to a heat treatment at 200 DEG C for one hour, the 180 DEG peel strength with respect to the silicon wafer is from 0.10 N/inch to 0.30 N/inch (inclusive); and after the adhesive layer B is bonded to a glass plate and the adhesive layer A is irradiated with ultraviolet light of 3,000 mJ/cm2, the horizontal load-bearing strength of a portion from the surface part to the depth of 10 [mu]m of the adhesive layer A as determined by SAICAS measurement is 0.06 N/mm or more.
Patent TW-202043201-A (TW)
Title: Light emitting element, manufacturing method thereof, composition for light emitting element and manufacturing method thereof
Inventor: SASADA TOSHIAKI
IPC: C07D471/04
Filed: 2020-03-24
Abstract: The present invention provides a composition useful for manufacturing a light emitting element having excellent luminous efficiency, and a light emitting element containing the composition. 
 
     A light emitting element comprises an anode, a cathode, and an organic layer provided between the anode and the cathode and containing 
a composition for light emitting element, wherein the composition for light emitting element comprises a thermally activated delayed fluorescent compound (A), and a compound (B) having a condensed heterocyclic skeleton (b); ｜EB-AA｜ is 0.60 eV or less, △E st  (A) of the compound (A) is 0.50 eV or less, and △E st  (B) of the compound (B) is 0.50 eV or less.
Patent TW-202042126-A (TW)
Inventor: KIMURA TETSUYA
IPC: G06Q50/04
Filed: 2020-03-31
Abstract: To output useful indicators for improving the production efficiency of production equipment and support the improvement: the support system 20 for improving production efficiency calculates the operating rate and the cycle time based on the detection result of the operation state of the production equipment 10 and displays a graph. The axis of the cycle time is set in such a way that the cycle time becomes shorter toward the right. The detection result is displayed in a state where the inconsistency can be visually recognized, as shown by point pp1 and point pp2. Since the points pp1 and pp2 are used for different measures to improve production efficiency, they are displayed in different display modes. In addition, points p1 and p2 representing the actual cycle time and the actual operating rate are also displayed as representative values of the detection results. By displaying these indicators in a graph, it is easy to visually recognize how to improve the operating rate and the cycle time, which can effectively support the improvement of production efficiency.
Patent TW-202042895-A (TW)
Title: Gas purification device, marine vessel comprising same, and gas purification method
Inventor: INUI MASAYUKI
IPC: B01D53/50
Filed: 2020-04-01
Abstract: A gas purification device comprising: a housing into which gas is introduced; an absorption unit that is provided in a channel for the gas in the interior of the housing and that is for removing material to be removed contained in the gas by way of gas-liquid contact between the gas and an absorption liquid; a liquid reservoir that is provided under the absorption unit inside the housing and that is for storing the absorption liquid dropping from the absorption unit; and an absorption liquid receiver that is provided under the absorption unit and above the liquid reservoir so as to at least partially cover the liquid reservoir.
Patent TW-202044521-A (TW)
Inventor: GEROUSIS VASSILIOS CONSTANTINOS
IPC: H01L23/50
Filed: 2020-04-17
Abstract: A tap cell configured to enable electrical connection from a buried power rail of an integrated circuit to a power distribution network includes. The tap cell may include a buried power rail layer including a VDD power supply rail and a VSS power supply rail, a plurality of via layers and a plurality of interconnection layers alternately arranged on the buried power rail layer, a VDD power supply metal interconnection and a VSS power supply metal interconnection in a power supply interconnection layer of the plurality of interconnection layers, a VDD power supply structure electrically connecting the VDD power supply rail to the VDD power supply metal interconnection, and a VSS power supply structure electrically connecting the VSS power supply rail to the VSS power supply metal interconnection. The tap cell is free of any active semiconductor devices.
Patent TW-202043403-A (TW)
Title: Glass machining tape
Inventor: MATSUBARA YUKIHIRO
IPC: C03B33/10
Filed: 2020-05-28
Abstract: Provided is glass machining tape that can be sufficiently heat-shrunk in a short length of time, and that is capable of maintaining cuff width. Glass machining tape 10 according to the present invention is characterized by comprising adhesive tape 15 having a base film 11 and an adhesive agent layer 12 formed on at least one surface side of the base film 11; the sum of the average value of the derivative of the rate of thermal deformation of the adhesive tape 15 in the machine direction per 1 DEG C in a range from 40 DEG C to 80 DEG C as measured by a thermomechanical properties tester during heating and the average value of the derivative of the rate of thermal deformation thereof in the transverse direction per 1 DEG C in a range from 40 DEG C to 80 DEG C as measured by a thermomechanical properties tester during heating is a negative value; and the machining tape is used in glass machining including an expansion step for expanding the adhesive tape 15.
Patent TW-202146932-A (TW)
Inventor: CHEN SHANG-HUI
IPC: G01R31/74
Filed: 2020-06-02
Abstract: 電子系統的備用電源的操作方法，該備用電源包括一保險絲，該操作方法包括：預估一讀取電壓誤差值與該保險絲的一電阻值；讀取一即時電池放電電流；讀取與計算該保險絲的一兩端電壓差；以及根據該保險絲的該兩端電壓差、該讀取電壓誤差值、該保險絲的該電阻值與該即時電池放電電流，判斷是否發出一更換保險絲訊息給該電子系統。
Patent TW-202110951-A (TW)
Title: Curable resin composition, cured film, layered product, method for producing cured film, and semiconductor device
Inventor: NOZAKI ATSUYASU
IPC: H01L23/522
Filed: 2020-06-22
Abstract: A curable resin composition which comprises at least one resin selected from the group consisting of polyimide precursors, poly(amide-imide) precursors, and polybenzoxazole precursors, anions having a structure represented by formula (1-1) or (1-2), and organic cations; a cured film obtained by curing the curable resin composition; a layered product including the cured film; a method for producing the cured film; and a semiconductor device including the cured film or the layered product.
Patent TW-202107962-A (TW)
Title: Electronic device and display thereof
Inventor: HSU KAI-CHIEH
IPC: H05K7/14
Filed: 2020-07-07
Abstract: An electronic device and a display thereof are disclosed. The electronic device includes the display and a supporting device. The display includes a display panel, a back cover, and a connecting member. The back cover includes an inside surface, an outside surface opposite to the inside surface, and an assembling hole extending through the inside surface and the outside surface. The inside surface face to the display panel. The assembling hole is placed at a central region of the back cover. The connecting member is disposed at the inside surface corresponding to the assembling hole and includes a screw hole. The supporting device includes a detachable accessory. The detachable accessory is connected to the screw hole.
Patent TW-202203868-A (TW)
Title: 人工水晶體與人工眼球
Inventor: Chen bo-jun
IPC: A61F2/14
Filed: 2020-07-16
Abstract: 一種人工水晶體，用以置於一動物或一機器人的一眼球中。人工水晶體包括一第一透光膜、一第二透光膜、一透光液體以及一液體注入及抽出模組。第一透光膜設於眼球的鞏膜所圍成的空間中。第二透光膜位於第一透光膜與眼球的角膜之間。透光液體填充於第一透光膜與第二透光膜之間。液體注入及抽出模組用以藉由一管體將透光液體的一部分注入及抽出第一透光膜與第二透光膜之間的空間，以達到改變焦距的效果。角膜與第二透光膜之間填充有房水。一種人工眼球亦被提出。
Patent TW-202120180-A (TW)
Title: New bed material for thermolytic fragmentation of sugars
Inventor: OSMUNDSEN CHRISTIAN MARUP
IPC: C07C27/00
Filed: 2020-08-12
Abstract: The present invention relates to a process for thermolytic fragmentation of a sugar into a composition comprising C1-C3 oxygenates. In particular, it relates to the use of heat carrying particles providing improved yields of C1-C3 oxygenates and improved fluidization characteristics making it suitable for industrial scale production of e.g. glycolaldehyde. It also regards a circulating fluidized bed system comprising the heat carrying particles.
Patent TW-202116196-A (TW)
Title: Garment
Inventor: KATSUTA HIROO
IPC: A41D1/00
Filed: 2020-08-28
Abstract: In order to provide a garment that can limit sensations of sweltering and heat inside the garment and maintain a comfortable environment inside the garment, that is comfortable when worn and has excellent designability, and that can be used suitably in a variety of garment-wearing settings in which comfort is required such as high temperature and/or high humidity environments, office, and home, the present invention is a garment that is made of a fabric with an air permeability of 50-500 cm3/cm2/s and is characterized in being equipped with a blower fan unit and also equipped with, on the inside of the garment, a flow channel-forming part for imparting a direction to the breeze inside the garment.
Patent TW-202211500-A (TW)
Title: Vertical light-emitting diode structure with a metal layer having sidewall for testing and protection including a light-emitting diode element, a Passivation (sidewall insulating layer), a welding electrode, and a metal protection layer
Inventor: CHEN FU-BANG
IPC: H01L33/52
Filed: 2020-08-31
Abstract: The present invention is a vertical light-emitting diode structure with a metal layer that can test and protect the sidewall, which includes a light-emitting diode element, a Passivation (sidewall insulating layer), a welding electrode, and a metal protection layer. Mainly, the metal protection layer is electrically connected to the welding electrode, and the metal protection layer covers and protects a die side edge and a carrier side edge of the light-emitting diode element through the Passivation (sidewall insulating layer). Therefore, the coating protection of the metal protection layer can solve the potential failure problem of the Passivation (sidewall insulating layer) in the electroplating or electroless plating process and other harsh environments of the light-emitting diode element, and the metal protection layer can provide test contacts, hence, the quality of the Passivation (sidewall insulating layer) is evaluated by detecting the forward bias voltage (Vf) and the reverse leakage current (Ir) of the light-emitting diode element.
Patent TW-202046399-A (TW)
Title: Substrate processing method, substrate processing apparatus, and computer readable recording medium
Inventor: MORII TOSHIKI
IPC: H01L21/304
Filed: 2019-05-09
Abstract: In the present invention, one processing section is selected from among a plurality of processing sections on the basis of the final section usage time. The final section usage time is the latest of the final unit usage times for a plurality of processing units belonging to the same processing section, or the corrected final unit usage times. The corrected unit final use time is the time obtained by substracting the transport time from the final unit usage time. Also, one processing unit is selected from among the plurality of processing units belonging to a selected processing section. Thereafter, a substrate is transported by a substrate transport system from a carrier on a load port to the selected processing unit.
Patent TW-202210290-A (TW)
Inventor: NOGI NAOYASU
IPC: G02F1/1335
Filed: 2020-09-07
Abstract: A reflective polarizing film module and a display device using the same are provided. The reflective polarizing film module includes a plurality of reflective polarizing films and at least one adhesive layer. The reflective polarizing films are superimposed on each other, and each reflective polarizing film has a transmission axis. Adjacent two reflective polarizing films are adhered with an adhesive layer. The transmission axes of the reflective polarizing films are roughly or substantially parallel.
Patent TW-202210217-A (TW)
Title: Seamed waterproof flux-cored welding wire and manufacturing method thereof which can indeed have good moisture and corrosion resistance and is suitable for the fields like port machinery, offshore platforms, ships, bridges, offshore wind power and marine machinery
Inventor: Zhou zhi-cheng
IPC: B23K35/24
Filed: 2020-09-07
Abstract: This invention relates to a seamed waterproof flux-cored welding wire, comprising a welding skin, a flux core, and a sealing object. The welding skin comprises an inner tube space located at the inner side ,and an outer tube seam located at the outer side. The flux core is filled in the inner tube space of the welding skin. The sealing object is formed in the outer tube seam of the welding skin. The manufacturing method of the seamed waterproof flux-cored welding wire comprises a welding skin rolling step, a flux core filling step, and a sealing object caulking step. The sealing object caulking step is to simultaneously form a sealing object to the outer tube seam of the welding skin during the welding skin rolling step. The design of sealing the outer tube seam by the sealing object can indeed have good moisture and corrosion resistance and is suitable for the fields such as port machinery, offshore platforms, ships, bridges, offshore wind power marine machinery and the like.
Patent TW-202127882-A (TW)
Title: Inter-layer reference picture signaling in video coding
Inventor: SEREGIN VADIM
IPC: H04N19/103
Filed: 2020-09-22
Abstract: An example of encoding video data includes determining a number of actual dependent layers of video data for a current layer, the actual dependent layers being a subset of layers having a layer identification value less than a layer identification value of the current layer, the actual dependent layers being available for inter-layer coding a block in a current picture in the current layer, wherein the number of actual dependent layers is fewer than a number of layers having the layer identification value less than the layer identification value of the current layer, determining a layer, other than the current layer, that includes an inter-layer reference picture for inter-predicting the block in the current picture in the current layer, and signaling information indicative of a layer index value to identify the layer other than the current layer based on the determined number of actual dependent layers for the current layer.
Patent TW-202128197-A (TW)
Inventor: SOKAL ETIENNE
IPC: A61P9/00
Filed: 2020-10-08
Abstract: 本發明涉及肝前驅或幹細胞、其溶胞產物、及/或可藉由在培養基中培養肝前驅或幹細胞獲得的條件培養基，供用於治療因為血管通透性增加所致的疾病及/或病況，或用於在個體發炎及/或感染之後於該個體體內回復細胞和組織的血管完整性。更具體地，本發明是有關於肝前驅或幹細胞、或可藉由在培養基中培養肝前驅或幹細胞獲得的條件培養基於敗血症和敗血症引起的疾病中的治療用途，敗血症和敗血症引起的疾病為諸如心肌水腫，急性腎損傷和肺臟敗血症。
Patent TW-202145173-A (TW)
Title: Display device
Inventor: TAI Ming-Jou
IPC: G09G3/30
Filed: 2020-10-13
Abstract: A display device includes a substrate, a scan line, a first signal line, a first insulating layer, a second signal line, a transistor and a pixel electrode. The scan line is disposed on the substrate. The first signal line is disposed on the substrate. The first insulating layer is disposed on the first signal line and has an opening. The second signal line is disposed on the first insulating layer. The second signal line is electrically connected to the first signal line through the opening. The transistor is electrically connected to the scan line and the first signal line. The pixel electrode is electrically connected to the transistor and has a first side adjacent to the scan line and a second side opposite to the first side. The opening is adjacent to the second side and away from the first side.