baber/WOPTO huggingface dataset:
Patent JP-2009024871-A (JP)
Title: Suspension and straddle type vehicle
Inventor: KAMIOKA TAKAMASA
IPC: F16F9/54
Filed: 2008-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a suspension and a straddle type vehicle, capable of improving strength with a simple structure.  <P>SOLUTION: A front suspension 20 has a wheel side tube for supporting a front wheel, a car body side tube 22 attached with an under bracket 17 arranged in a car body, supported by the under bracket 17 and connected to the wheel side tube, and a reinforcing tube 23 shorter than the car body side tube. A cylindrical part 23a of the reinforcing tube 23 is arranged inside the car body side tube so as to be positioned in an installation position of the bracket. The reinforcing tube 23 also has tapered parts 23b and 23c, and the tapered parts 23b and 23c are respectively formed so that rigidity reduces toward an upper end part 23e and a lower end part 23f.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009212060-A (JP)
Title: External illuminating lamp for aircraft
Inventor: MUKAI TOMOYUKI
IPC: F21W107/30
Filed: 2008-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a compact external illuminating lamp for an aircraft having waterproofness secured, and using a discharge bulb for a light source.  <P>SOLUTION: This external illuminating lamp for the aircraft includes: a vessel-like reflector 10 doubling as a lamp body; a front cover 16 attached to a front opening of the reflector 10; the discharge bulb 20 inserted in a bulb insertion hole 12 formed on the reflector 10; and a power-feeding socket 40 attached to the back side of the reflector 10 to cover a peripheral part 13 of the bulb insertion hole 12, and thereby ensured in electrical connection to the discharge bulb 20 by being fitted to a plug part 30 of the discharge bulb 20 projecting rearward from the bulb insertion hole 12. The power-feeding socket 40 is formed into a structure where a bulb starting circuit 58 is incorporated therein, and a socket body 50 with a plug part fitting hole 55 formed on the front side is covered with a resin mold layer 60. The illuminating lamp is made compact, and assembly of the illuminating lamp is facilitated because of a small number of components constituting the illuminating lamp. The illuminating lamp hardly interferes with other members as the illuminating lamp is made compact, and the degree of freedom of the installation location is increased.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009213969-A (JP)
Title: Catalyst for unsaturated carboxylic acid synthesis, method for manufacturing the same, and method for manufacturing unsaturated carboxylic acid using this catalyst
Inventor: FUJITA TSUTOMU
IPC: C07C51/235
Filed: 2008-03-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a catalyst with high yield of unsaturated carboxylic acid used when unsaturated aldehyde is catalytically oxidated with molecular oxygen in a vapor phase to synthesize unsaturated carboxylic acid, and a method for manufacturing the same.  <P>SOLUTION: The method is provided for manufacturing a catalyst for synthesizing unsaturated carboxylic acid when unsaturated aldehyde is catalytically oxidated with molecular oxygen in a vapor phase to synthesize unsaturated carboxylic acid, wherein the solution is sintered at the maximum temperature of 300°C or more and 700°C or less while circulating the gas of 1.5 l/h or more and 4.0 l/h or less per 1 g of a catalyst precursor containing ammonium radicals or a nitrogen-containing organic compound.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008252087-A (JP)
Title: Structure of semiconductor device package and method of the same
Inventor: YANG WEN-KUN
IPC: H01L25/18
Filed: 2008-03-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device package with good CTE performance and a contraction size providing board-level reliability having satisfactory temperature cycle.  <P>SOLUTION: The semiconductor device package comprises a substrate 102 with a pre-formed die receiving cavity 105 and a terminal contact metal pad 112 formed within an upper surface. At lease a first die 104 is disposed within the die receiving cavity. A first dielectric layer 110 is formed on the first die and the substrate, and refilled into a gap between the first die and the substrate to absorb thermal mechanical stress there between. A first re-distribution layer (RDL) 114 is formed on the first dielectric layer and coupled to the first die. A second dielectric layer 116 is formed on the first RDL, and then a second die 120 is disposed on the second dielectric layer and surrounded by core pastes 124 having through holes 126 thereon. A second re-distribution layer (RDL) 128 is formed on the core pastes to fill the through holes, and then a third dielectric layer 130 is formed on the second RDL.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009213608-A (JP)
Title: Automatic bread machine
Inventor: SHIRAI YOSHINARI
IPC: A47J36/02
Filed: 2008-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an automatic bread machine capable of providing bread with favorable finished state by improving a heating efficiency in a baking process of breadmaking.  <P>SOLUTION: This automatic bread machine 1 is provided with a bread container 5 in which breadmaking materials are put, and a breadmaking body 2 formed by having a baking chamber 3 which has a heater 34 as a heating means and can detachably store the bread container 5, wherein the bread container 5 has a black film 5b on its outer face. This constitution can uniformize the heat absorptivity of the whole bread container 5, improve an absorption and improve the absorption of far-infrared light. This constitution can optimize the finishing state of the baked bread such as improving crunchiness of its surface, favorably browning it and improving the texture and aesthetic appearance of the bread.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009214523-A (JP)
Title: Method for manufacturing nozzle head, and liquid injection head
Inventor: AKATSU TATSUO
IPC: B41J2/135
Filed: 2008-03-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a nozzle plate, wherein even when a metal plate thicker than a conventional plate is used, a punch is broken with difficulty, and hole shape failures are hardly caused.  <P>SOLUTION: The method for manufacturing the nozzle plate includes a first lower hole forming step of forming a quasi-lower hole 40 having a bottom in a metal plate by implanting a first punch 36 from one surface to the other surface of the metal plate 31 in the plate thickness direction of the metal plate, a second lower hold forming step of forming a lower hole 42 deeper than the quasi-lower hole and a bulged part 55 in the other surface by implanting a second punch 50 from one surface of the metal plate having the quasi-lower hole into the quasi-lower hole deeper than the first punch, and a penetration step of grinding the other surface of the metal plate having the lower hole and eliminating the bulged part to penetrate the lower hole, thereby forming a nozzle opening.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009221156-A (JP)
Title: alpha-PHENYLSTILBENE COMPOUND AND METHOD FOR PRODUCING THE SAME
Inventor: SASAKI MASAOMI
IPC: C07C211/54
Filed: 2008-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide an α-phenylstilbene compound useful as a photoelectric transducer material having high hole transporting property and excellent matching property with a charge generating material and a light-emitting element material having excellent light emitting characteristics and excellent durability.  <P>SOLUTION: The α-phenylstilbene compound is represented by general formula (I) (wherein R<SB>1</SB>, R<SB>2</SB>, R<SB>3</SB>and R<SB>4</SB>are each an alkyl group, a substituted or nonsubstituted aryl group; Ar<SB>1</SB>is a substituted or nonsubstituted arylene group; and R<SB>5</SB>is a hydrogen atom, an alkyl group, an alkoxy group or a substituted or nonsubstituted aryl group).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009224576-A (JP)
Title: Wiring board, and inspection method of wiring board
Inventor: OKUNO SHIGERU
IPC: G01R31/02
Filed: 2008-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To simplify connection inspection of an electronic component mounted on a principal surface of an insulation board or in the inside thereof, in a wiring board having a wiring pattern on a principal surface of an insulation board or in the inside thereof.  <P>SOLUTION: This wiring board is provided with: the insulation board; a first land pattern formed on a principal surface of the insulation board or in the inside thereof for being connected to a first power terminal possessed by a first electronic component; a second land pattern formed on the principal surface of the insulation board and in the inside thereof for being connected to a second power terminal possessed by a second electronic component; a first power lead part arranged by being electrically connected to the first land pattern, and having at least a part present on the principal surface; and a second power lead part arranged by being electrically connected to the second land pattern, having a part present on the principal surface, and present by being electrically separated from the first power lead part.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009197314-A (JP)
Title: Component for machine structure
Inventor: HAYASHI TORU
IPC: C22C38/00
Filed: 2008-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To concretely give a way for realizing the improvement of fatigue properties by retained austenite.  <P>SOLUTION: The component for a machine structure has a componential composition comprising, by mass, 0.3 to 0.7% C, ≤0.80% Si, 1.0 to 3.0% Mn, ≤0.25% Al, 0.005 to 0.1% Ti, 0.05 to 0.6% Mo, 0.0003 to 0.006% B, ≤0.06% S, ≤0.020% P, ≤1.0% Cu and ≤3.5% Ni, and the balance Fe with inevitable impurities, and in which the average size of old austenite grains in a hardened layer subjected to quenching is controlled to ≤10 μm, and also, the amount of retained austenite in the hardened layer is controlled to 7 to 22%.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009224247-A (JP)
Title: Plasma display panel and method of manufacturing the same
Inventor: AKIYAMA KOJI
IPC: H01J11/34
Filed: 2008-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a plasma display panel which has a sufficient strength of a glass substrate and gets a limited occurrence of a panel breakage.  <P>SOLUTION: The plasma display panel is a PDP in which a plural pairs of electrodes and a dielectric layer on a substrate are provided, and a residual stress on a surface on a side of the substrate where the dielectric layer is not provided is within a range of 0.8-2.4 MPa. Furthermore, it is also acceptable that a substrate thickness is 2.8 mm±0.5 mm and the residual stress on a surface on a side of the substrate where the dielectric layer is not provided is within a range of 1.3-2.4 MPa.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009228249-A (JP)
Title: Interference prevention device for working machine
Inventor: TOKUDA SHUJI
IPC: E02F9/24
Filed: 2008-03-21
Abstract: <P>PROBLEM TO BE SOLVED: To enable an operator to arbitrarily set an interference prevention area depending on the width or narrowness of a job site, variation of an attachment, etc., when an interference prevention device for regulating the intrusion of the attachment into the interference prevention area is installed.  <P>SOLUTION: An interference prevention control device 16 is provided with an arbitrary interference prevention area setting section 25 which enables the interference prevention area to be arbitrarily set on the basis of the movement of the attachment 9 to a position desired to be set as outside border lines LA and LB of the interference prevention areas (an intrusion prohibiting area A and an speed reducing area B) by the operator.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009228589-A (JP)
Title: Exhaust emission control system and its control device for exhaust emission control
Inventor: NODA YOSHIHIRO
IPC: F01N3/24
Filed: 2008-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide an exhaust emission control system and its control device for exhaust emission control determining which causes exhaust gas temperature rise defect, abnormality of fuel addition valve or abnormality of oxidation catalyst.  <P>SOLUTION: This control device for exhaust emission control commands a fuel addition valve to add fuel to an exhaust gas passage (S302) when regeneration of DPF is demanded (S300: Yes), and determines that the oxidation catalyst and the fuel addition valve are normal (S306, S308) if catalyst exhaust gas temperature of the oxidation catalyst rises higher than a prescribed value (S304: Yes). The control device for exhaust emission control commands a fuel injection valve to execute post injection (S312) when catalyst exhaust gas temperature is not higher than a prescribed value (S304: No). The control device for exhaust emission control determines that the oxidation catalyst is abnormal (S316) when catalyst exhaust gas temperature is not greater than the prescribed value (S314: No), and determines that the oxidation catalyst is normal (S318) and that the fuel addition valve is abnormal (S320) when catalyst exhaust gas temperature rises higher than the prescribed value (S314: Yes).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009228849-A (JP)
Title: Flange connection structure
Inventor: KITAGUCHI YOSHINORI
IPC: F16J15/10
Filed: 2008-03-25
Abstract: <P>PROBLEM TO BE SOLVED: To improve sealability in a flange by using liquid.  <P>SOLUTION: In this flange connection structure, a flange 102 of a pipe 101 and a flange 104 of a pipe 103 are connected by a flange, and an annular seal groove 105 is formed on a flange surface 104a of the flange 104. A sealing liquid is injected and filled into this seal groove 105 via an injection passage 106 from a sealing liquid injection part 110. Thus, the sealability is improved by constituting a liquid seal structure by the sealing liquid filled in the seal groove 105. The sealing liquid is also filled in a discharge passage 107 and a discharge pipe 121. When gas in the pipes 101 and 103 enters the seal groove 105, this gas is discharged from a discharge device 120, and is detected by a gas detecting sensor 123, and safety measures can be taken.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009231238-A (JP)
Title: Recycling method for exhaust electrolyte
Inventor: SHIMIZU KOJI
IPC: H01M50/77
Filed: 2008-03-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a recycling method for an exhaust electrolyte discharged in a manufacturing process of an alkaline secondary battery.  <P>SOLUTION: The recycling method for the exhaust electrolyte discharged in the manufacturing process of the alkaline secondary battery uses an electrodialyzer 1 forming a positive electrode-side chamber 17 where a positive electrode 15 side is partitioned by the bipolar film 13 and a negative electrode 14 side is partitioned by the cation exchange membrane 11, and a negative electrode-side chamber 16 where a positive electrode 15 side is partitioned by the cation exchange membrane 11 and a negative electrode 14 side is partitioned by the bipolar film 13, by arranging bipolar films 12, 13 and a cation exchange membrane 11 between a positive electrode 15 and a negative electrode 14, and performs electrodialysis by supplying the exhaust electrolyte to the positive electrode-side chamber 17 (arrow head R) and by supplying a collected medium liquid to the negative electrode-side chamber 16 (arrow head S), and collects an alkaline solution from the negative electrode-side chamber 16 (arrow head T).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009234032-A (JP)
Title: Pipe material
Inventor: TANAKA KAZUYA
IPC: F16L11/04
Filed: 2008-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pipe material having adhesiveness and chlorine water resistance.  <P>SOLUTION: The pipe material is formed by laminating an inner layer, an intermediate layer, an adhesive layer and an outer layer. The inner layer is resin containing fluoroethylenic resin A as a principal component, the intermediate layer is resin containing polyamide resin B as a principal component, the adhesive layer is resin containing an adhesive resin C as a principal component, and the outer layer is resin containing polyolefinic resin D as a principal component. The adhesive resin C is preferably at least one of resin selected among a group of a copolymer of at least one selected among a group of vinyl acetate, acrylic acid, (met)acrylic acid, ethyl (met)acrylate, methyl (met)acrylic acid, maleic anhydride and glycidyl (met)acrylate with ethylene, modified polystyrene resin, and modified polyolefinic resins.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009242125-A (JP)
Title: Inorganic material for fertilizer
Inventor: SHIMAMURA TETSUYA
IPC: C05D11/00
Filed: 2008-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inorganic material for fertilizers having no restrictions for fertilizing effect components in the inorganic material useful as the fertilizers, having no necessity for melting treatment at a high temperature and having an excellent fertilizing effect.  <P>SOLUTION: The inorganic material for the fertilizers is obtained by pulverizing inorganic matter added with a pulverizing auxiliary agent containing 30 wt.% or more of a substance having a Mohs hardness of 7 or more or a substance having a product of Mohs hardness and specific gravity of 20 or more.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2008235914-A (JP)
Title: Semiconductor package and method of manufacturing the same
Inventor: SONG YOUNG-HEE
IPC: H01L21/822
Filed: 2008-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an integrated circuit chip which is capable of overcoming the limitation of bond pad size and bond pad pitch reduction.  <P>SOLUTION: An integrated circuit chip 10 includes a semiconductor substrate 11 which has a peripheral region A<SB>peri</SB>between an A<SB>cell2</SB>and a cell region A<SB>cell1</SB>, where an integrated circuit by a center pad type chip design is formed, and a bond pad wiring pattern 12 which is connected with the integrated circuit on the semiconductor substrate 11. The bond pad wiring pattern 12 is formed in a line form having a predetermined pattern in a layer where an conventional bond pad is formed, and one end of it is located in the peripheral region A<SB>peri</SB>. The width of the peripheral region A<SB>peri</SB>is narrower than the conventional width because the bond pad region is not secured but only a part of the bond pad wiring pattern 12 which is in a line form is present. Thereby, the semiconductor substrate 11 has the whole width which is reduced by the width necessary for the bond pad region.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009253443-A (JP)
Title: Information processor, information processing method, and program
Inventor: YASUMA KENSUKE
IPC: H04L12/46
Filed: 2008-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To limit access with respect to a specified function.  <P>SOLUTION: A logical network control apparatus 103a obtains access destination information indicating the access destination of the function provided in a service providing apparatus 104, and generates filter information for limiting the access to the function, base on the access destination information. The logical network control apparatus 103a limits the access to the function, based on the filter information when the access is performed to the function.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009252495-A (JP)
Title: Terminal fittings
Inventor: SHIMIZU TORU
IPC: H01R13/11
Filed: 2008-04-04
Abstract: <P>PROBLEM TO BE SOLVED: To achieve lowering a height of terminal fittings.  <P>SOLUTION: The terminal fittings T are formed by bending a metal plate material Ta punched out into a predetermined shape, and a facing surface 15S of a resilient contact piece 15 facing a male tab M and a facing surface 20S of a receiving plate 20 facing the male tab M are partially recessed within the range of the thickness of the metal plate material Ta. Thus, thick portions 28A, 29A, 28B, 29B and thin portions 27A, 27B are arranged alternately in a width direction perpendicular to an inserting direction of the male tab M. Parts of the male tab M are held in contact with the thick portions 28A, 29A, 28B, 29B in the width direction.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009252528-A (JP)
Title: Male terminal and connector having this
Inventor: NAGAMINE AKIRA
IPC: H01R13/04
Filed: 2008-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a male terminal in which a resistance force at the time of connection can be reduced with a simple structure and a connector.  <P>SOLUTION: The male terminal 5 has a connection part 5c including a contact portion 52 to contact a female terminal. Further, four projection parts 51 are formed at the connection part 5c. Thereby, the contact area between the male terminal 5 and a mating housing or the female terminal becomes small, and a friction force caused at the time of insertion of the male terminal 5 is reduced. Thus, resistance force at the time of connection can be reduced with the simple structure.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2008173508-A (JP)
Title: Dressing including main part and handle part
Inventor: HANSEN GRAZYNA
IPC: A61F13/02
Filed: 2008-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a dressing, eliminating the problem of removing a tab from the dressing to easily handle the dressing without touching an adhesive.  <P>SOLUTION: This dressing includes a main part 2 and a handle part, wherein the main part 2 includes an adhesive layer 13, a release liner 14 and a carrier layer 12 optionally covered with a protective layer (not shown). The handle part includes at least one tab member 3, 4, and the tab member 3, 4 is designed to apply the dressing to the skin without touching the adhesive surface of the main part 2. The tab member 3, 4 includes one or more layers and has at least one layer in common with the main part 2 of the dressing. Further, the length of an intermediate zone 7, 8 between the handle part and the main part is less than 20% of the length of the periphery of the main part. At least one cutout part 5, 6 is formed in the intermediate zone 7, 8 between the handle part and the main part 2.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009250212-A (JP)
Title: Apparatus and method for determining knocking of internal combustion engine
Inventor: MAEMURA JUN
IPC: F02D45/00
Filed: 2008-04-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus and method for determining knocking, which restrains the knocking from being erroneously determined.  <P>SOLUTION: An engine ECU executes a program including steps of: acquiring a vibration intensity of each cylinder (S100); setting a gain (S102); calculating a correction value (S104); calculating a standard deviation (S106); calculating a coefficient u (S108); calculating an average value of a median of frequency distribution of each cylinder (S110); weakening an update restriction (S114) when an engine is in a transient state (YES in S112); strengthening the update restriction (S116) unless the engine is in the transient state (NO in S112); calculating a knocking determination value (S118); and determining whether the calculated knocking determination value is smaller than the correction value (S120).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2008272831-A (JP)
Title: Machine for processing unprocessed material
Inventor: KOCK BERNHARD
IPC: B30B9/32
Filed: 2008-04-11
Abstract: <P>PROBLEM TO BE SOLVED: To improve the supply of oil with respect to a machine for processing an unprocessed material.  <P>SOLUTION: The invention relates to the machine for processing the unprocessed material, comprising: at least one actuator which acts, mechanically upon the unprocessed material; and at least a portion of the surface of which is movable relative to a corresponding surface of an adjacent component of the machine.  <P>COPYRIGHT: (C)2009,JPO&INPIT