baber/WOPTO huggingface dataset:
Patent JP-2011061034-A (JP)
Title: Substrate processing device
Inventor: IMAI MASAYOSHI
IPC: H01L21/027
Filed: 2009-09-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a substrate processing device capable of removing an unnecessary film from a substrate while suppressing or preventing damage of the substrate.  <P>SOLUTION: This substrate processing device 1 includes: a spin chuck 7 for holding a wafer W; a chemical supply unit 22 for supplying a processing liquid containing a photoactivation component activated by being irradiated with light to the wafer W held to the spin chuck 7; and an irradiation unit 4 for irradiating the processing liquid containing the photoactivation component to be supplied to the wafer W held to the spin chuck 7 with light.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011061078-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: OZAKI SHIRO
IPC: H01L21/60
Filed: 2009-09-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device using a COF tape, capable of sufficiently stabilizing the shape of a wiring by forming it using down-set processing, wherein the wiring constitutes a connection terminal to be connected to an Au bump of a semiconductor element by means of gold-tin eutectic bonding.  <P>SOLUTION: In the method, a semiconductor element 3 is mounted on a wiring board 2 composed of a COF tape with no device hole after the steps of: connecting an Au bump 4 of the semiconductor element 3 and a Sn plated connection terminal 6 of a wiring 5 of the wiring board 2 by means of gold-tin eutectic bonding, by heating them while contacting and pressing them with a heating tool 7; providing a high-rigidity metal foil 14 on a surface of the wiring board 2 facing to the wiring 5; and forming the wiring 5 on the wiring board 2 by means of down-set processing so as to be kept away from the connection part together with the metal foil 14.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011057524-A (JP)
Title: Method for producing lithium manganate and manganese dioxide used for the same
Inventor: FUJII YASUHIRO
IPC: C01G45/12
Filed: 2009-09-14
Abstract: <P>PROBLEM TO BE SOLVED: To solve such a problem that the charge and discharge cycle characteristic of a secondary battery is not sufficient in the case that electrolytic manganese dioxide is used as the raw material of lithium manganate being a positive electrode active material for the secondary battery.  <P>SOLUTION: Lithium manganate is obtained by mixing the electrolytic manganese dioxide having a sulfur concentration of 2,000 ppm or more and 3,500 ppm or less, a sodium concentration of 100 ppm or more and 500 ppm or less, a BET specific surface area of 30 m<SP>2</SP>/g or more and 60 m<SP>2</SP>/g or less with a lithium compound, and baking. The electrolytic manganese dioxide electrolyzed at a current density of more than 0.6 A/dm<SP>2</SP>and 1.1 A/dm<SP>2</SP>or less and a weight ratio Mn<SP>2+</SP>/H<SB>2</SB>SO<SB>4</SB>in an electrolyte composition of 1.0 or more and 4.0 or less, crushed and washed is used.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011065312-A (JP)
Title: Attached file retrieval system in mail monitoring system
Inventor: HORIGUCHI TAKASHI
IPC: H04L12/58
Filed: 2009-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mail monitoring system for notifying a constant supervisor of mail which tries to slip through constant monitoring, and for displaying the list of mail which seems illegal information to the constant supervisor, and for reducing the costs of the constant monitoring.  <P>SOLUTION: The mail monitoring system is configured of: a mail management server for storing mail to be transmitted/received; an attached file storage server for storing the attached file of the mail; and an attached file analysis server for analyzing the attached file of the mail. The attached file analysis server includes a means to confirm the presence/absence of the attached file from the mail storage server, and to perform access to the attached file storage server, and to analyze whether significant information is stored by the attached file and when the significant information is stored, adding it to the monitoring object mail list to the destination of the constant supervisor and distribute it.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009302576-A (JP)
Title: Nitride semiconductor element and method of manufacturing the same
Inventor: TANIYASU YOSHITAKA
IPC: H01L33/32
Filed: 2009-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high-output electronic element using n-type AlN.  <P>SOLUTION: A semiconductor element which has a structure having an undoped AlN layer and an n-type AlN layer laminated in order on a semiconductor or an insulator substrate is a Schottky diode having a Schottky electrode and an ohmic electrode formed on an n-type AlN layer or a field-effect transistor having a source electrode, a gate electrode, and a drain electrode formed on an n-type AlN layer. On the semiconductor or the semiconductor insulator substrate, the undoped AlN layer and the n-type AlN layer are formed by epitaxial growth and then the n-type AlN layer which has extremely superior electric conductivity because of the less-defect undoped AlN layer is obtained, so that a Schttoky barrier height and an insulation breakdown voltage can be greatly increased. Consequently, the high-output electronic element using n-type AlN is manufactured.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011071730-A (JP)
Title: Black level adjusting device and black level adjusting method
Inventor: OGATA MAKI
IPC: H04N5/335
Filed: 2009-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a black level adjusting device and black level adjusting method, capable of performing black level adjustment at a high speed by accurately calculating a correction range to be used for black level correction even when a variation in circuit characteristics exists.  <P>SOLUTION: A clamp parameter generation circuit 15 and a VREF generation circuit 17 generate a clamp parameter on the basis of an OB value and a black level reference value, perform feedback of clamp voltage corresponding to the clamp parameter to an A/D conversion circuit 11, and use a linear relation between the clamp parameter and the OB value, to update the clamp parameter.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011071062-A (JP)
Title: Direct oxidation type fuel cell
Inventor: AKIYAMA TAKASHI
IPC: H01M8/10
Filed: 2009-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a fuel cell which is superior in fuel utilization efficiency and power generation performance such as power generation voltage and power generation efficiency.  <P>SOLUTION: The fuel cell includes at least one unit cell equipped with a membrane-electrode assembly including an anode, a cathode, and an electrolyte membrane arranged between them, an anode-side separator in contact with the anode, and a cathode-side separator in contact with the cathode. The anode-side separator has fuel flow passages in order to supply fuel to the anode, and the anode includes an anode catalyst layer in contact with the electrolyte membrane, and an anode diffusion layer in contact with the anode-side separator. The anode catalyst layer contains an anode catalyst and a polyelectrolyte. The volume expansion coefficient of the polyelectrolyte on the upstream side is larger than that on the downstream of the fuel flow passages in the anode catalyst layer.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011077162-A (JP)
Title: Heat dissipation base, and method of manufacturing heat dissipation base
Inventor: KAWAI CHIHIRO
IPC: H01L23/14
Filed: 2009-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat dissipation base capable of suppressing a decrease in heat dissipation, and to provide a method of manufacturing the heat dissipation base.  <P>SOLUTION: The heat dissipation base 10 includes a metal base 11, an insulating material 12, and a metal matrix composite 13. The metal base 11 has a surface 11a. The insulating material 12 is formed on the surface 11a of the metal base 11. The metal matrix composite 13 is formed at a periphery of the insulating material 12. The metal matrix composite 13 has a coefficient of thermal expansion between coefficients of thermal expansion of the metal base 11 and insulating material 12.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011076288-A (JP)
Title: Authentication device
Inventor: USUI TSUTOMU
IPC: G06F21/32
Filed: 2009-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an authentication device that prevents an increase in processing time for authentication or re-authentication to equipment when using personal authentication technologies and improving security of the equipment, in modern society, where information including personal information is frequently processed and a personal authentication means for identifying a person is essential in a variety of fields.  <P>SOLUTION: The authentication device has: an input/output device which performs authentication using biometric information for user authentication processing; and an authentication processing part which authenticates a user using his or her biometric information. At the start of user authentication with the input/output device, preparation for processing desired by the user is started in background.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011080382-A (JP)
Title: Exhaust system of internal combustion engine
Inventor: TAKAGAKI NAKAYA
IPC: F01N13/08
Filed: 2009-10-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an exhaust system of an internal combustion engine which suppresses increase in sound pressure level due to the air column resonance of a tail pipe without need for complex control with a simple constitution while suppressing increase in weight and production costs.  <P>SOLUTION: The exhaust system of the internal combustion engine includes a first swing plate 41 and a second swing plate 61 which are swung by the exhaust gas flow in a tail pipe 28. The first swing plate 41 is formed with a plate opening 41f through which exhaust gas is allowed to pass. The second swing plate 61 is provided so as to close the plate opening 41f at air column resonance and open the plate opening 41f when an exhaust gas flow rate is less than a flow rate that causes air column resonance, whereby increases in the weight and production costs of the exhaust system can be suppressed, then increase in a sound pressure level due to air column resonance can be suppressed without adding complex control with simple constitution, increase in the back pressure of exhaust gas can be suppressed, and the occurrence of air flow sound can be inhibited.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011079472-A (JP)
Title: Motor rotational torque transmission mechanism and vehicle seat having the same
Inventor: NONOMIYA MASAAKI
IPC: B60N2/90
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a motor rotational torque transmission mechanism for a vehicle seat in which a motor is shared and an increase in weight due to the sharing is suppressed and also provide a vehicle seat having the motor rotational torque transmission mechanism.  <P>SOLUTION: The motor rotational torque transmission mechanism includes a motor 44, a clutch unit 46 for transmitting the rotational torque of the motor to a plurality of driven parts of the vehicle seat to be cut out, and a switch unit 48 for selectively switching the transmission of the rotational torque to either of the driven parts. The switch unit 48 includes an axially extending movable shaft 50 having peripheral grooves in the direction generally orthogonal to the axial direction and in the circumferential direction of the outer surface 62. The clutch unit 46 includes a plurality of input shafts fitted coaxially onto the movable shaft 50 to be rotatable about the axis. One of the input shafts is connected to the rotating shaft of the motor, and the other input shaft adjacent to that shaft in the axial direction are connected to each other while the end faces thereof face each other for transmitting the rotational torque.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011080000-A (JP)
Title: Thermoplastic resin composition
Inventor: TAI TOSHIHIRO
IPC: C08L83/04
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition capable of obtaining a molding, which has good mechanical strength and chemical resistance and hardly occurs shrinkage, by incorporating an extremely small amount of silicone oil therein.  <P>SOLUTION: The thermoplastic resin composition contains (A) 15-40 mass% of a polyamide resin, (B) 85-60 mass% of a styrene-based resin containing a rubber-containing styrene-based resin, (C) a compatibilizer in an amount of 1-70 pts.mass based on 100 pts.mass of the total of the (A) and (B) components, and (D) silicone oil in an amount of 0.002-0.2 pts.mass based on 100 pts.mass of the total of the (A) and (B) components.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011082106-A (JP)
Title: Terminal device
Inventor: NAKAMOTO ATSUSHI
IPC: H01R4/48
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a terminal device capable of easily carrying out mounting and dismounting works of a case to and from a distribution board without the need of such a tool as a screwdriver.  <P>SOLUTION: The terminal device 1 is provided with a case 2, a quick connection terminal 3 (not shown in Fig.1), a retention block 4, and an engaging part 5 as well as an engaged part 6 as an engagement means, and is mounted in the distribution board not shown. The case 2, formed in a box shape, has one or a plurality of insertion holes 23 set in penetration and has the engaging part 5 arranged. The quick insertion terminal 3 is arranged inside the case 2 each in opposition to each insertion hole 23, and locks and connects wires (not shown) entering the case 2 through each insertion hole 23. The retention block 4, formed in nearly a strip plate shape, is attached to a bottom plate inside the distribution board and retains the case 2 in free disengagement. The engaged part 6 is arranged at the retention block 4 to get engaged with the engaging part 5, and at the same time, supports the engaging part 5 in free sliding along a length direction of the retention block 4 between a position where the engaging part 5 gets engaged and a position where it does not.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011081882-A (JP)
Title: Laminated semiconductor device
Inventor: IDE AKIRA
IPC: H01L21/82
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To share through-electrode switching information among a plurality of laminated semiconductor chips.  <P>SOLUTION: In the laminated semiconductor device which shares a plurality of through-electrodes for transferring data among the plurality of semiconductor chips, a first semiconductor chip IF included in the plurality of semiconductor chips holds the through-electrode switching information SW specifying a through-electrode for transferring the data among the plurality of through-electrodes and transfers the through-electrode switching information SW to second semiconductor chips CC0 to CC7 included in the plurality of semiconductor chips. No circuit for storing the through-electrode switching information SW in a non-volatile manner is required in the second semiconductor chips, since the through-electrode switching information SW is transferred to the second semiconductor chips CC0 to CC7 from the first semiconductor chip IF. Thus, the chip area of the second semiconductor chips can be reduced.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011080022-A (JP)
Title: Rubber composition for tire, and pneumatic tire
Inventor: FUJIKURA KEITARO
IPC: C08L91/06
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a rubber composition for tires which can maintain weather resistance for a long time without losing external appearance of a tire, can reduce the amount of petroleum resources to be used and can be made from raw material which is readily available, and to provide a pneumatic tire using the same.  <P>SOLUTION: The rubber composition for tires includes a rubber component, synthetic wax derived from biomass, and natural wax derived from biomass.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011085652-A (JP)
Title: Image acquisition system
Inventor: HIRAIDE SHUZO
IPC: H04N5/225
Filed: 2009-10-13
Abstract: <P>PROBLEM TO BE SOLVED: To suppress an error in an image acquisition position due to a driving state of a stage.  <P>SOLUTION: The image acquisition system includes: the stage 102 that has mounted and fixed thereon a glass slide 101 on which at least one sample is placed and that circulates in an endless-track shape; a line sensor 103 that scans only part of the sample; an imaging drive unit 106 that moves a relative position of the line sensor 103 and the stage 102 in a direction substantially perpendicular to a scanning direction of the line sensor 103; and an optical system 104 that focuses an image of the sample on the line sensor.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011085663-A (JP)
Title: Driving circuit and display device
Inventor: OCHIAI TAKAHIRO
IPC: G09G3/20
Filed: 2009-10-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a driving circuit capable of more stably controlling a voltage for driving the transistor of a display device.  <P>SOLUTION: When a clock signal V<SB>i</SB>becomes high, a transistor T5 is made conductive by an output G<SB>i-4</SB>, thereby setting a potential of one electrode of a capacity C1 high. Hence, a gate potential of the transistor T5 which is the other electrode side is increased by bootstrap, and an output G<SB>i</SB>becomes high. Then, during a writing period after the passage of three horizontal synchronous periods, data signal voltages based on gradation values of respective pixels are applied to data signal lines D<SB>1</SB>to D<SB>m</SB>, and the output G<SB>i</SB>falls to hold the applied voltages based on the gradation values in the pixels.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011084423-A (JP)
Title: Thermal stress-cutting device and thermal stress-cutting method
Inventor: MOTOMURA FUMITAKA
IPC: C03B33/09
Filed: 2009-10-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermal stress-cutting device and a thermal stress-cutting method which need no previous formation of an initial crack by another process and has a reduced working process.  <P>SOLUTION: The thermal stress-cutting device 10 is structured of a local heat source 11, stress generating members 13a, 13b, and support parts 15a, 15b. The local heat source 11 is for heating locally a desired region along a predetermined cutting line 17 on a first main face side of a work 12 constituted of the first main face and a second main face formed opposite to the first main face. The stress generating members 13a, 13b are arranged with a contact face on an edge containing the predetermined position for initiating a crack of the work 12. The support parts 15a, 15b interpose the work and the stress generating members from the direction perpendicular to the contact face between the work 12 and the stress generating members 13a, 13b, and support the work 12 and the stress generating members 13a, 13b while pressing these to the direction perpendicular to the contact face S.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010015181-A (JP)
Title: Optical fiber fusion splicer
Inventor: TANABE AKIO
IPC: G02B6/38
Filed: 2009-10-19
Abstract: <P>PROBLEM TO BE SOLVED: To facilitate grasp of fusion splicing situation between optical fibers.  <P>SOLUTION: The optical fiber fusion splicer includes: a fusion splicing mechanism for fusion splicing optical fibers to each other; a display mechanism for displaying a splicing condition and other pieces of information; and a controller for controlling the fusion splicing mechanism and the display mechanism. The fusion splicing mechanism includes two holders for clamping and positioning optical fibers to be spliced, a discharge electrode rod arranged between the two holders, and a heat source controller for controlling a heating quantity by varying a discharge current rate for feeding the discharge electrode rod. The display mechanism includes a TV camera arranged in a position that enables optical fibers clamped by the holders to be photographed, an image processor for processing an image photographed by the TV camera, and a display monitor for displaying an image outputted from the image processor and an superimposed image with desired information inserted in the outputted image. The image processor is able to switch and output in the display monitor the photographed image and the superimposed image or the image where only the superimposed image is rotated in 180°.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011091576-A (JP)
Title: Coding apparatus and method
Inventor: FUKUHARA TAKAHIRO
IPC: H03M7/30
Filed: 2009-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a coding apparatus for coding at a higher speed.  <P>SOLUTION: A CU pass section 124 executes calculation in which a result of RLC is zero (0) in step S141, calculation in which a result of RLC is one (1) in step S142, calculation of first UNIFORM encode in step S143, and calculation of second UNIFORM encode in step S144. An MQ coding section 112 MQ-encodes a value 0 with an RLC context in step S145, MQ-encodes a value 1 with the RLC context in step S146, executes first-time MQ coding with a UNIFORM context in step S147, and executes second-time MQ-coding with the UNIFORM context in step S148. This apparatus is applicable to, for example, an image coding apparatus.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011088381-A (JP)
Title: Method for injection-molding liquid addition curing type silicone rubber composition
Inventor: SHUTO SHIGEKI
IPC: B29C45/27
Filed: 2009-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To contribute to improvement of productivity by molding a silicone rubber molded article without poor molding in injection molding.  <P>SOLUTION: In the method for injection-molding the silicone rubber composition or injecting a liquid addition curing type silicone rubber composition having flowability showing a ratio (a/b) at 23°C of a viscosity (a) under a shear rate of 10 s<SP>-1</SP>to a viscosity (b) under a shear rate of 100 s<SP>-1</SP>of ≥2.5 in an open gate type mold and curing the same to manufacture the silicone rubber molded article, the diameter of the tip end of the gate of the mold is ≤0.25 mm.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011088382-A (JP)
Title: Breaking device and breaking method
Inventor: MAEKAWA KAZUYA
IPC: B28D5/00
Filed: 2009-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a breaking device breaking a substrate with a break load smaller than before.  <P>SOLUTION: The breaking device includes a table 12 on which a brittle material substrate is placed, a roller head 40 which rotatably supports a roller 32 brought into surface-contact with the substrate, and includes a vibration actuator 38 for applying vibrations in a pressure-contact direction in the pressure-contact state of the roller with the substrate, and a moving mechanism 22 for relatively moving the roller head along a substrate surface. The roller is set in a pressure-contact state along a pressure-contact schedule line positioned on the direct backside of the scribing line of a second surface which becomes a backside of a first surface, and moved, while applying vibrations in a pressure-contact direction, relatively to the brittle material substrate having a scribing line S formed in the first surface.  <P>COPYRIGHT: (C)2011,JPO&INPIT