Patent SG-11201903502W-A (SG)
Title: Apparatus and method for wet process on semiconductor substrate
Inventor: WANG HUI
IPC: H01L21/67
Filed: 2016-10-25
Abstract: 1012a 1016 1014 1007 1003 1002 1001 1004 HG 1005 - 40Z , XnUWRZUWW ,,,PWRZGUWWW , P7V 1017 1020 1008a N O 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 03 May 2018 (03.05.2018) WIP0 I PCT IiiimmoimiolollmonolooloimEmonumiflovoimIE (10) International Publication Number WO 2018/076151 Al (51) International Patent Classification: HOlL 21/67 (2006.01) B05C 5/00 (2006.01) (21) International Application Number: PCT/CN2016/103150 (22) International Filing Date: 25 October 2016 (25.10.2016) (25) Filing Language: English (26) Publication Language: English (71) Applicant: ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- Tech Park, Shanghai 201203 (CN). (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). WANG, Xi; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). CHENG, Cheng; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). WU, Jun; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). (74) Agent: SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: APPARATUS AND METHOD FOR WET PROCESS ON SEMICONDUCTOR SUBSTRATE (57) : An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism(1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber. [Continued on next page] WO 2018/076151 Al MIDEDIMOM0101011EFIO101111111111111HOIEHO111110110111111 TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))