baber/WOPTO huggingface dataset:
Patent TW-340213-B (TW)
Title: Method of forming barrier ribs of display panel and substrate for forming the barrier ribs
Inventor: KOSAKA TADAYOSHI
IPC: H01J11/34
Filed: 1996-10-23
Granted: 1998-09-11
Abstract: A sort of method of forming display panel barrier ribs, having: a plurality of barrier ribs and substrate for forming the barrier ribs each having an elongate configuration in plan and extending in the same direction within a display area for fabrication of a display panel, comprizing the method the steps of forming a mask for cutting having a masking pattern corresponding to the plurality of barrier ribs on a rib material layer, and removing portions of the rib material layer by jetting a cutting medium thereto, wherein the masking pattern is configured such that a plurality of elongate portions corresponding to the respective barrier ribs each extend across the display area to the outside of the display area and a spacing between adjacent end portions of elongate portions is smaller than a spacing between adjacent elongare portions within the display area.
Patent TW-338707-B (TW)
Title: Pyridylacetic acid derivative with its manufacturing method and the intermediate as well as the use
Inventor: BERND MULLER
IPC: C07D213/61
Filed: 1996-11-01
Granted: 1998-08-21
Abstract: A pyridylacetic acid derivative or salt of the formula I where the substituents and the index have the following meanings: X is NOCH1; Y is oxygen or Nra; Ra is hydrogen; R1 is C1-C4-alkyl; R2 and R3 independently of one another are C1-C4-alkyl; R4 is phenyl, phenyl substituted by halogen, or a group CRd=NORe; Rd is phenyl or phenyl substituted by halogen; Ra is C1-C4-alkyl.
Patent TW-340257-B (TW)
Title: Semiconductor device and process thereof
Inventor: ISHII HIDEMOTO
IPC: H01L25/10
Filed: 1996-11-07
Granted: 1998-09-11
Abstract: A sort of semiconductor device, having: semiconductor chip, and wiring board for mounting of said semiconductor chip on a square main plate, and a package for covering said semiconductor chip, the semiconductor in said square main plate of said wiring board, the other square main plate of said wiring board protruding from the package.
Patent TW-332832-B (TW)
Title: Crack resistant valve plate assembly
Inventor: RICHARD FRANCOIS NOEL
IPC: C21B9/12
Filed: 1996-11-09
Granted: 1998-06-01
Abstract: A crack resistant valve plate assembly is provided for use in a slide gate valve . The valve plate assembly includes a refractory valve plate having an orifice positioned along its longitudinal center line , and truncated corners for focusing a clamping force toward the center line in the vicinity of the orifice to prevent the formation and spreading of cracks . The angular orientation of each of the truncated corners varies with respect to the position of the orifice along the longitudinal center line .
Patent TW-355898-B (TW)
Title: Intelligent telephone programming and redial system
Inventor: JANG JING-SUNG
IPC: H04M1/26
Filed: 1996-11-13
Granted: 1999-04-11
Abstract: An intelligent telephone recording and redial system, comprising: a control signal storage device for storing system control signal; a audio frequency input device for inputting speech signals; a plurality of shortcut control signal input device for inputting the shortcut control signal so as to control the programming, replaying, automatic playing setting and editing of the shortcut; a shortcut storage device for storing shortcut information; a display device for inputting an input signal to produce display information; a telephone interface device for receiving external telephone signals and outputting internal telephone signals; and a processing device for inputting the said system control signals, speech signals, shortcut control signals, shortcut information, and external telephone signals so as to control the system actions, and generate the internal telephone signals and display signals.
Patent TW-449462-B (TW)
Title: Pyrimidin-4-one derivatives, the preparation thereof and the use as fungicides
Inventor: WALTER HARALD
IPC: C07D487/04
Filed: 1997-03-10
Granted: 2001-08-11
Abstract: Novel pyrimidin-4-one derivatives of formula I, wherein R1=C1-C8alkyl which is unsubstituted or substituted by halophenoxyphenyl or naphthyl; or cyclopropyl; R2=OR5, SR6; R3 and R4 are each independently of the other hydrogen, halogen, C1-C4alkyl, Si-(C1-C4)3 or SR6; R5 and R6 are each independently of the other C1-C6alkyl or C2-C6alkynyl each of which is unsubstituted or substituted by halogen; and A is a 5-membered unsaturated heterocyclic ring and which may contain one or two hetero atoms O, S, and/or N, each in the free form or in salt form. The novel compounds have plant-protective properties and are suitable for protecting plants against infestation by phytopathogenic microorganisms, in particular fungi.
Patent TW-335524-B (TW)
Title: Molded flexible ball grip array and method of making
Inventor: BRUCE J FREYMAN
IPC: H01L23/12
Filed: 1997-06-20
Granted: 1998-07-01
Abstract: A method of making molded flexible ball grip array, including: provision of a stretched carrier strip having a series of intermittently disposed and in longitudinal extension along the strip; provision of a flexible film having crystal chip adhering region and metallized film, including at least the connection pad of the first face of at least 1 film, and the contact pad on the other side of the film, for forming of flexible general circuit; allocation of the flexible general circuit in the substrates; adhering the edge of the substrate onto the carrier strip based on a strip opening for disposition of the substrates; installation of the IC having IC transmission pads onto the chip adhering region of the film; adhering the lead glue from the chip transmission pad to the film adhering pad; wrapping the chip, the chip transmission pad and a part of the film in overlapping with least one opening; provision of the metallized protruding par to the film and removal from the carrier strip the formed lattice array, including the film and the wrapped chip.
Patent TW-363923-B (TW)
Title: An uninterrupted moving device in safety tread of tire
Inventor: ZHANG DONG-SHUN
IPC: B60C17/04
Filed: 1997-04-28
Granted: 1999-07-11
Abstract: The present invention relates to an uninterrupted moving device in safety tread of tire which is comprised of a predetermined number of main structures. These main structures are symmetrical, identical, and serially interconnected that can be mass produced by means of mould. From the standpoint of industrial scale, it offers the convenience of modularized production and automated production. The fast assembly also enhances production efficiency, lowers production cost and boosts competitiveness of the product. In order to accommodate wheels of different sizes and brands, the bottom of each main structure is adjusted using a top holding piece and adapts to the various conditions at the right ground surface of the wheel. On the other hand, a pad is used to make up for the various conditions at the left ground surface of the wheel. As such, the present invention can accommodate wheels having ground surface of various shapes and structures with minimal modification. There are two-point contact between the base of each main construction and the ground surface of the wheel to add to the elastic contact between them and minimize the damage brought about by the impact when the tire passes through pits on the road. The two open ends of the serially interconnected main structures are pulled tight together with a locking device which is free from the possibility of dislodging and adds to the safety of the present invention.
Patent TW-509985-B (TW)
Title: Device for production of compound semiconductor
Inventor: KATAMIME TOSHIHISA
IPC: C23C16/455
Filed: 1997-05-09
Granted: 2002-11-11
Abstract: A device for production of a compound semiconductor by means of a metal organic vapor phase epitaxy method, which has a structure that a metallic member is used at a part brought into contact with a gas at an upstream side of a flow of a raw material gas than a part for growing a compound semiconductor, and the metallic member is cooled to not higher than 300 DEG C. The present invention provides a device for production of a compound semiconductor with high productivity, which is suitable for the production of the compound semiconductor, using a metallic material wherein the processing precision is high and the risk of breakage is low.
Patent TW-328601-B (TW)
Title: Power line noise prevention circuit for semiconductor memory device
Inventor: YONG KI KIM
IPC: G11C5/14
Filed: 1997-06-03
Granted: 1998-03-21
Abstract: A power line noise prevention circuit for semiconductor memory device comprises: (1) High voltage generating means for generating a high voltage to make a word line enable; (2) Pre-high voltage generating means for generating a pre-high voltage to supplement decreased quantity of a supply voltage; (3) First switching means for transferring high voltage from the high voltage generating means to a pre-high voltage output end of the pre-high voltage generating means when a row address strobe precharge signal is enable; (4) At least a second switching means connected between pre-high voltage output end of the pre-high voltage generating means and a supplying voltage line; (5) Pulse generating means for power stabilizing for controlling the second switching means when a row address strobe signal is enable; (6) De-coupling electrostatic capacitor means for decreasing noise on internal circuit by using coupling effect between supply voltage and a ground voltage.
Patent TW-374770-B (TW)
Title: Method for depositing substituted fluorocarbon polymeric layers
Inventor: LOGAN MARK A
IPC: C23C14/12
Filed: 1997-07-01
Granted: 1999-11-21
Abstract: In accordance with the invention, a method of depositing substituted fluorocarbon polymeric layers exhibiting a high degree of cross-linking is presented. Formation of a substituted fluorocarbon polymeric layer includes placing a substrate into a reactor and, while maintaining the reactor pressure below 100 torr, introducing a process gas into the reactor. Optionally, the substrate is biased. The process gas is then ionized thereby depositing the substituted fluorocarbon polymeric layer on the substrate.
Patent TW-389004-B (TW)
Title: Multifocus reflector antenna
Inventor: ROTHE LUTZ HOBIL DR-ING
IPC: H01Q5/45
Filed: 1997-08-19
Granted: 2000-05-01
Abstract: A reflector antenna is disclosed for simultaneously receiving the radiation fields of n.ge.2 satellites positioned on orbit at azimuthally offset positions with respect to one another. The reflector antenna has a reflector (1), in particular a parabolic reflector, and an n number of radiation exciters (3; 3.1; 3.2) arranged in a line in the focal area of the reflector (1) to receive polarized radiation. The radiation exciters (3; 3.1; 3.2) are arranged in the focal area at fixed geometrical distances A to each other, so that each radiation exciter (3; 3.1; 3.2) is associated with one radiation source of a satellite, the distance A between the radiation exciters (3; 3.1; 3.2) corresponding to the in particular azimuthally offset positioningof the radiation sources of the satellites to be received. A planar excitation network (8) decouples two orthogonal and linearly polarized wave fields from each radiation exciter (3; 3.1; 3.2). A coupling network (9) switches the decoupled wave fields to the input of respective noise-adapted input signal amplifiers (16.1; 16.2; 16.3; 16.4). The output signal of an input signal amplifier (16) can be selectively supplied to a low-noise converter (21) by means of one or several switches or by means of the input signal amplifiers (16; 17), which in this case can be switched between an amplifying mode and a locking mode.
Patent TW-473394-B (TW)
Title: Pharmaceutical composition comprising a smaller oral dosage form of valsartan
Inventor: WAGNER ROBERT FRANK
IPC: A61K31/41
Filed: 1997-09-09
Granted: 2002-01-21
Abstract: The present invention is concerned with solid oral dosage forms of comprising (a) an active agent selected from valsartan and optionally HCTZ, and (b) pharmaceutically acceptable additives suitable for the preparation of solid oral dosage forms by compression methods.
Patent TW-423099-B (TW)
Title: Manufacturing method of integrated circuit capacitor
Inventor: LI YU-HUA
IPC: H01L21/70
Filed: 1997-12-19
Granted: 2001-02-21
Abstract: This invention is about the manufacturing method of integrated circuit capacitor. The utilization of poly silicon plug in the conventionally used capacitor is saved and the bottom electrode plate of the capacitor is made to directly connect with substrate so as to raise the conductivity of capacitor and decrease the damage caused by the capacitor misalignment. The processing procedure of this invention can save one process step of depositing polysilicon plug compared with the conventional processing procedure. So the processing time can be reduced to increase the production volume, reduce the production cost and enhance the production yield.
Patent TW-364220-B (TW)
Title: Sealed lead-acid cells and batteries
Inventor: MATTAN EDWARD M
IPC: H02J7/00
Filed: 1998-01-19
Granted: 1999-07-11
Abstract: Sealed lead-acid cells are disclosed which include an internal cell restraint contacting the interior surface of the cover and positioned between the positive plates and the cover, the internal cell restraint cooperates with an external cell restraint, such as a coated metal face plate, to direct positive plate growth which occurs in service away from the cover, the features disclosed allowing plastic-to-plastic terminal post-cover seals to be used and allow cells of capacities of up to 2,000 Ampere Hours or more to be provided.
Patent TW-389869-B (TW)
Title: Grey controller
Inventor: SHIU YAN-JENG
IPC: G06F9/00
Filed: 1998-01-21
Granted: 2000-05-11
Abstract: The grey controller of this invention uses 12-bit with fixed-point format as input and selects sample data limited in a finite range and predicts or restores the desired data. The input interface of the fixed point format not only simplifies the complexity of circuit and speeds up the operations, but also readily enable the use along with analog-to-digital converter or micro controller. The dedicated hardware structure of this invention is designed for aiming at the grey prediction method, wherein the pipe-line hardware structure can effectively execute the construction of grey model and restoring functions and predicting functions. Based on the applications consideration, the specifications of the structure already remove unnecessary design so as to reduce the cost of system and to speed up the processing speed of operation unit. It greatly reduces the operating load of co-processor and CPU to adapt the grey control model for being used in real-time system, and further accelerate the pace to gain the enterprise acceptance toward the grey control.
Patent TW-379439-B (TW)
Title: Method of forming a capacitor structure on a silicon substrate in an MOS process
Inventor: FRERICHS HEINZ-PETER
IPC: H01L21/02
Filed: 1998-04-08
Granted: 2000-01-11
Abstract: A method is disclosed for forming a capacitor structure on a silicon substrate in an MOS process. The method is simplified by depositing on a first polysilicon layer (7) an insulating layer (8) and then a second polysilicon layer (9) for forming a capacitor structure (18), patterning the second polysilicon layer (9) and the insulating layer (8) to form a first capacitor plate (11) and a dielectric (12) of the capacitor structure (18), then patterning the first polysilicon layer (7) and the gate oxide layer (6) to form a second capacitor plate (14) of the capacitor structure (18) and the gate regions of MOS transistor, and subsequently producing the MOS transistors.
Patent TW-406052-B (TW)
Title: Master cylinder with dynamic reaction regulated by a difference in cross section
Inventor: SIMON BACARDIT JUAN
IPC: B60T13/565
Filed: 1998-05-07
Granted: 2000-09-21
Abstract: The invention relates to a master cylinder with hydraulic reaction for a pneumatic brake booster, comprising a main piston (12) receiving a boost force and hydraulic reaction means which are mounted so that they can slide in this main piston, including a push rod (3) and receiving an actuating force. According to the invention, the hydraulic reaction means further comprise a central shut-off piston (4), a stepped and hollow reaction piston (5), a ratio-change piston (6) and three springs (71, 72, 73), the assembly as a whole being arranged in such a way that the push rod (3) receives, if the actuating force is applied rapidly, a reaction force which is only proportional to the difference between an internal cross section (51) and an external cross section (53) of the reaction piston (5).
Patent TW-391056-B (TW)
Title: Thin heat spreader for IC packaging
Inventor: JAU JUNG-SHING
IPC: H01L23/00
Filed: 1998-05-14
Granted: 2000-05-21
Abstract: The invention discloses a heat spreader technology in which a thin metal planar heat tube is attached on top of the chip in the plastic packaging IC. In the technology, one side of the thin metal planar heat tube is contacted with IC and, the other side is exposed to the outside of the plastic packaging and directly contacted with the heat sink. The heat dissipation property of chip can be greatly improved by using the design stated above so as to make the plastic packaging applicable for IC products.
Patent TW-406416-B (TW)
Title: Semiconductor method device and method for manufacturing the same
Inventor: KIM JAE-KAP
IPC: H01L21/8242
Filed: 1998-06-22
Granted: 2000-09-21
Abstract: In DRAM comprising a read pass transistor, a write pass transistor and a storage transistor, a depletion transistor is connected to a source of the storage. On a par of the source and drain of the depletion, by forming an impurity region of the same conductivity as that of the substrate on which the transistors are formed, a substrate voltage applied to the substrate is supplied to the storage transistor through the depletion transistor. An additional metal wire for connecting the source of the storage transistor to Vss voltage (ground voltage or substrate voltage) terminal and a contact hole area for such metal wire aren't required. Accordingly, a high integration of the semiconductor can be accomplished and a reduction of reliability thereof can be decreased.
Patent TW-418587-B (TW)
Title: Method and apparatus of raising scan resolution
Inventor: HUANG YING-JIUN
IPC: H04N1/04
Filed: 1998-07-07
Granted: 2001-01-11
Abstract: This invention is about the method and apparatus of increasing scan resolution, wherein without increasing the resolution of the image sensor and with increasing part of the length of the image sensor, the image pixels are rearranged so as to greatly increase the resolution of scan apparatus. The apparatus for increasing the scan resolution disclosed in this invention includes the followings: an image taken apparatus, in which each scan line is formed by the image points with discontinuous positions; a buffer apparatus, which controls the output of scanned point from the image taken apparatus; an image arrangement apparatus which executes the rearrangement action of the image point. For the method of increasing scan resolution disclosed in this invention, the scan line is cut into plural image pixels after the scan line is scanned in such that the image output is generated after the image pixels are rearranged.
Patent TW-417264-B (TW)
Title: Apparatus having trim punches with air inflow route for trimming gate scrap
Inventor: KIM SANG-KI
IPC: H01L21/56
Filed: 1998-07-09
Granted: 2001-01-01
Abstract: There is disclosed an apparatus having trim punches with an air inflow route for trimming gate scrap. The trimming apparatus comprises a scrap trim die disposed on a lower surface of a lead frame on which the package bodies are formed and comprising outlets and first projections, and a scrap punch die disposed on an upper surface of the lead frame and comprising trim punches and second projections. An air inflow route is formed in and on the trim punch so that the air is continuously injected from the outside into the inside of the outlet, and thereby the trimmed gate scrap is easily discharged and removed via the outlet. The trimming apparatus further comprises a dambar trim die for trimming dambars and a dambar punch die corresponding to the dambar trim die. The trimming apparatus of the present invention has some advantages in that the trimmed gate scrap is easily discharged and removed through the outlet, for the air is continuously injected from the outside into the inside of the outlet via the air inflow route.
Patent TW-406479-B (TW)
Title: Differential pair-based folding interpolator circuit for an analog-to-digital converter
Inventor: FLYNN MICHAEL P
IPC: H03M1/36
Filed: 1998-10-08
Granted: 2000-09-21
Abstract: A current folding and interpolating circuit (80) in an analog-to-digital converter(10, 152) has L folders, each of them includes M differential pairs(82, 84), each having N first transistors (86-89, 100-103) biased by a input voltage and N second transistors (90-93, 96-99) biased by a reference voltage, and a current source (110, 112) couple to the source terminal of first and second transistors. The second transistors of different differential pairs are biased with different reference voltages. Selected drain terminals of the first transistors (89) of one folder (82) are coupled to selected drain terminals of the first transistors (100) of at least one other folder(84), and selected drain terminals of the second transistors (93) of one folder (82) are coupled to selected drain terminals of the second transistors (96) of at least one other folder(84). More than one interpolated signals may be generated between two folders.
Patent TW-408259-B (TW)
Title: Conversion circuit with duty cycle correction for small swing signals, and associated method
Inventor: PORTMANN CLEMENZ
IPC: H03K5/156
Filed: 1998-09-04
Granted: 2000-10-11
Abstract: A duty cycle correcting amplifier includes a first differential transistor pair with a pair of input nodes for receiving a differential input signal to be amplified. The first differential transistor pair has a first common node and a first pair of output nodes carrying differential output signals. A first current source is connected between the first common node and a first supply voltage. A second differential transistor pair has a pair of input nodes for receiving differential error input signals. The second differential transistor pair has a second common node and a second pair of output nodes coupled to the first pair of output nodes. The second differential transistor pair alters the common mode levels of each of the first pair of output nodes based on the differential error input signals to affect the duty cycle of the differential output signals. A second current source is connected between the second common node and the first supply voltage. A load circuit is connected between the first pair of output nodes and a second supply voltage. The load circuit provides a high impedance load between each node of the first pair of output nodes and a low impedance between each node of the first pair of output nodes and the second supply voltage. Capacitive circuitry is connected to each node of the first pair of output nodes. A converting amplifier has a pair of inputs for receiving the differential output signals. The converting amplifier amplifies and converts the differential output signals to a single ended signal constituting the output of the duty cycle correcting amplifier.