Patent TW-201246240-A (TW)
Title: Method for fabricating a carrier with three-dimensional inductor and structure thereof
Inventor: KUO CHIH-MING
IPC: H01F27/06
Filed: 2011-05-09
Abstract: Method for fabricating a carrier with three-dimensional inductor comprises the steps: proving a substrate having a surface, at least one first pad and a protective layer, the protective layer has at least one first pad opening, a first connector disposing zone and a plurality of first inductor part disposing zones. The first pad is exposed by the pad opening locating at the first connector disposing zone; forming a first photoresist layer to the protective layer; patterning the first photoresist layer to form a first opening and a plurality of first inductor part holes, the first connector disposing zone is exposed by the first opening, the first inductor part disposing zones are exposed by the first inductor part holes; forming a first metal layer onto the first opening and the first inductor part holesand the first metal layer has a first connector pad and a plurality of firstinductor part, each of the firstinductor part has a first connecting end and a second connecting end and the firstinductor part has a first height; removing the first photoresist layer; forming a first dielectric layer onto the protective layer and covering the first metal layer, the first dielectric layer has s first connector pad opening, a plurality of first connecting end opening and a plurality of second connecting end opening, the first connector pad is exposed by the first connector pad opening, each of the first connecting end is exposed by the first connecting end opening, each of thesecond connecting end is exposed by the second connecting end opening; forming a second photoresist layer onto the first dielectric layer; patterning the second photoresist layer to form a plurality of second inductor part disposing holes, a plurality of third inductor part disposing holes and a plurality of forth inductor part disposing holes. The first connector pad is exposed by the second inductor part disposing holes, each of the first connecting end is exposed by the second inductor part disposing holes, each of the second connecting end is exposed by the forth inductor part disposing holes; forming a second metal onto the second inductor part disposing holes, the third inductor part disposing holes and the forth inductor part disposing holes to make the second metal layer have the second inductor part, the third inductor part and the forth inductor part. The second inductor part is connected to the first connector pad and the second inductor part has s first top surface and a second height, each of the third inductor partis connected to the and the forth inductor part, the third inductor partis connected to second connecting end and the third inductor part has a second top surface and a third, and the forth inductor part. The forth inductor part is connected to thefirst connecting end and the forth inductor part is connected to the third top surface and a forth height, the second height, the three height and the forth height is higher than first height; removing the second photoresist layer; forming a second dielectric layer onto the first dielectric layer and covering the second metal layer, the second dielectric layer has a second inductor part exposing hole, a plurality ofthird inductor part exposing hole and a plurality offorth inductor part exposing hole. The first top surface is exposed by the second inductor part exposing hole, each of the second top surface is exposed by the third inductor part exposing hole, each of the third top surface is exposed by the forth inductor part exposing hole; forming a third photoresist layer onto the second dielectric layer; patterning the third photoresist layer to form a fifth inductor part disposing hole and a plurality ofsixth inductor part disposing holes. The first top surface and the second top surface are exposed by the fifth inductor part disposing hole, each of the second top surface and the third top surface are exposed by the sixth inductor part disposing hole; forming a third metal layer onto the fifth ind