Patent SG-11201900803Y-A (SG)
Title: Surface defect inspection with large particle monitoring and laser power control
Inventor: CUI STEVE YIFENG
IPC: H01L21/67
Filed: 2017-08-03
Abstract: WO 18/0 27 0 10 Al 133 WAFER POSITIONING SYSTEM 125 FIG. 1 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 08 February 2018 (08.02.2018) WIP0 I PCT omit VIII °nolo omoiolomollm m1111E11 oimIE (10) International Publication Number WO 2018/027010 Al (51) International Patent Classification: HOlL 21/66 (2006.01) HOlL 21/67 (2006.01) (21) International Application Number: PCT/US2017/045261 (22) International Filing Date: 03 August 2017 (03.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/230,330 05 August 2016 (05.08.2016) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: CUI, Steve Yifeng; 5415 Ontario Common, Fremont, California 94555 (US). HUANG, Jay (Chun- sheng); 6951 Grandwood Way, San Jose, California 95120 (US). WANG, Chunhai; 5026 Blackbird Way, Pleasanton, California 94566 (US). WOLTERS, Chris- tian; 5073 Shady Avenue, San Jose, California 95129 (US). WHITESIDE, Bret; 680 Epic Way #241, San Jose, California 95134 (US). ROMANOVSKY, Anatoly; 1044 Amarillo Avenue, Palo Alto, California 94303 (US). HUANG, Chuanyong; 9000 Hostetter Road, San Jose, Cal- ifornia 95132 (US). PETTIBONE, Donald; 4805 McCoy Avenue, San Jose, California 95130 (US). (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: SURFACE DEFECT INSPECTION WITH LARGE PARTICLE MONITORING AND LASER POWER CONTROL (57) : Methods and systems for reducing illumination in- tensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large parti- cle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imag- ing based collection design spatially separates the image of the lead- ing measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced pow- er time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced. [Continued on next page] WO 2018/027010 Al MIDEDIMOMOIDEIREIDIDOMMEIROMIONVOIS TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))