baber/WOPTO huggingface dataset:
Patent JP-2010018507-A (JP)
Title: Method for producing high-strength vitreous balloon
Inventor: HIGASHI KAZURO
IPC: C04B33/22
Filed: 2008-07-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a vitreous balloon, by which a product having high strength and high sphericity can be obtained without controlling the firing conditions every particle diameter of raw materials and lowering yield in the case when perlite, obsidian or pitchstone is used as a raw material.  <P>SOLUTION: A raw material mineral selected from perlite, obsidian and pitchstone is pulverized and dried at a high temperature of 350-500°C to prepare a powder having a high temperature water content of 0.8-1.8 mass% and an average particle diameter of 15-100 μm. Thereafter, the powder is fired in a temperature range of 1,090-1,145°C. As a result, a high strength vitreous balloon having pressure-resistant strength corresponding to a hydrostatic flotation ratio of ≥50% after hydrostatic pressure of 8 MPa is applied for one minute is produced.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010027748-A (JP)
Title: Ultraviolet sensor
Inventor: HATAUCHI TAKASHI
IPC: H01L31/0264
Filed: 2008-07-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultraviolet sensor of a wide sensitive area, capable of detecting ultraviolet rays over a wide band.  <P>SOLUTION: The ultraviolet sensor has an ultraviolet sensing part, and the ultraviolet sensing part includes a mixture containing a zinc oxide and a sensing wavelength band extension material having a band gap wider than the band gap of the zinc oxide. Thus, the ultraviolet sensor of the wide sensitivity region, capable of detecting the ultraviolet rays over the wide band is achieved.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010024673-A (JP)
Title: Composite heat-insulating material
Inventor: OZAKI HITOSHI
IPC: E04B1/76
Filed: 2008-07-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a composite heat-insulating material which is excellent in heat insulation properties and dispenses with an adhesive.  <P>SOLUTION: In this composite heat-insulating material 101, a single core material-type vacuum heat-insulating material 102 is wholly coated with foamed polyurethane 103. The foamed polyurethane 103 is a polyurethane resin which is formed by chemically reacting polyol and polyisocyanate having cyclopentane premixed as a foaming agent. Additionally, when water coexists, the water and the polyisocyanate cause ureapoiesis reactions, simultaneously, a carbon dioxide is produced, and the polyurethane resin is foamed. A supercritical carbon dioxide is supplied from the outside immediately before the chemical reactions. The supercritical carbon dioxide which is excellent in the property of diffusion into a polyurethane resin material is uniformly dispersed in a short period of time. This enables the composition of the different heat-insulating materials at low manufacturing cost without the need for an adhesive, and enables reduction in a coefficient of thermal conductivity by emission and convection in an air bubble. Thus, the heat insulation properties can be improved.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010025723-A (JP)
Title: X-ray reflector
Inventor: MITSUDA KAZUHISA
IPC: G02B5/10
Filed: 2008-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an X-ray reflecting mirror or the like, which has a highly smooth reflecting surface and high and stable image formation (reflection) performance, and whose total weight is reduced.  <P>SOLUTION: The X-ray reflecting mirror where the curved surface contour of the reflecting surface is stable is provided by deforming a silicon substrate thermoplastically. A silicon wafer is deformed into free contours by applying pressure to it in a hydrogen atmosphere at a high temperature of around 1,300°C. The roughness of the silicon surface is further lowered, and the reflectance is improved by performing hydrogen annealing on the substrate.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010023877-A (JP)
Title: Content-pouring structure, connection structure, electronic instrument and vessel
Inventor: OGAWA KAZUYA
IPC: F23K5/02
Filed: 2008-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To pour a content in a vessel to the outside when the vessel is connected to an instrument side even if a non-pressurized content is accommodated in the vessel.  <P>SOLUTION: The content-pouring structure 10 includes a pouring pipe 11 having a pouring opening 15 and a hollow having an opening in the pouring opening 15, an elastic movable plug 12 engaged in the hollow to clog the hollow of the pouring pipe 11 contacting with and separating from the pouring opening 15 of the pouring pipe 11, and an elastic member 13 urging the movable plug 12 to the pouring opening 15 of the pouring pipe 11. A cut 17 penetrates the movable plug 12 from the pouring opening 15 of the pouring pipe 11 to the opposite side, and the cut 17 is closed by the elastic force of the movable plug 12.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010027396-A (JP)
Title: Automatic switch with heat ray sensor
Inventor: TOYODA ICHIRO
IPC: H01H35/00
Filed: 2008-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an automatic switch with heat ray sensor can improve workability at the time of assembly of a lens block and prevent false operation of the heat ray sensor.  <P>SOLUTION: The automatic switch with heat-ray sensor is provided with a heat ray sensor TP, a relay SW, and a lens block 3 which houses the heat ray sensor TP and has a condensing lens 30 to condense heat rays from a detection range to a light receiving part of the heat ray sensor TP, and the lens block 3 is provided with a rotating frame which is made by mutually joining the open faces of a first frame 31 and a second frame 32 of which one face is respectively opened and a substrate P3 which is housed in the rotating frame and on which the heat ray sensor TP is mounted. The substrate P3 is fixed to the second frame 32 and the condensing lens 30 is arranged in the first frame 31. Cut-outs 32e from which lead wires L from the heat ray sensor TP are respectively led out are formed at positions of point symmetry with respect to the center of the rotating frame in the second frame 32, and a rib 31c which closes either one of the cut-outs 32e is provided in the first frame 31.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010030647-A (JP)
Title: Bag mouth part folding machine
Inventor: KATO MASAKIMI
IPC: B65B51/00
Filed: 2008-07-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a bag mouth part folding machine efficiently folding a bag mouth part when bagging coins or the like, allowing the fold of the bag mouth part to be hardly loosened by correctly folding the bag mouth part, and perfectly sealing a bag.  <P>SOLUTION: The bag mouth part folding machine comprises: a center folding claw 34 as an advancing/retracting pressing means for pressing a center portion of a bag 1 while a mouth part 2 of the bag 1 is erected; and a pair of holding means which are reciprocatably operated in the direction orthogonal to the advancing direction of the pressing means. The holding means repeatedly fold the mouth part 2 by holding the mouth part 2 from both sides and folding and superposing the mouth part 2, and folding the mouth part 2 alternately by the pair of folding claws 36 and a pair of folding claws 43. The holding means for executing the holding for the next step to hold the mouth part 2 folded from the outside while releasing the holding by the holding means in the previous step after completing the holding of the previous step.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009055019-A (JP)
Title: Multi-layered substrate, package substrate for semiconductor integrated circuit, and printed wiring board for semiconductor integrated circuit packaging
Inventor: YAMAGISHI KEITARO
IPC: H01L23/12
Filed: 2008-07-30
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a multilayer substrate including a structure which realizes impedance matching between a longitudinal signal transmission path between an external terminal and a signaling wiring conductor formed on each layer and a ground surrounding it.  <P>SOLUTION: A coil structure 110 having inductance which offsets or eases influence of a parasitic capacitance generated around a parasitic capacitance generating part in the longitudinal signal transmission path between a signaling solder ball 1S3 that is an external connection terminal and a signaling wiring conductor 1S51 disposed on a layer other than the layer on which the external connection terminal 1S3 is disposed. The coil structure 110 comprises combinations of a plurality of vias 112 to 119 which connect adjacent two layers and signaling wiring conductors 1S53 and 1S54 disposed on respective layers and connected to the vias through via lands 1S23 and 1S24, for example.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010040234-A (JP)
Title: Backlight unit, electro-optical device, and electronic equipment
Inventor: NAKANISHI DAISUKE
IPC: F21S2/00
Filed: 2008-08-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a backlight unit capable of enhancing optical characteristics with a light volume made uniform for a whole irradiation area.  <P>SOLUTION: The backlight unit 10 of a downright type is provided with an arrangement face 3a arranging a plurality of light sources 2a to 2e, and a plurality of reflecting faces 4a to 7a erected from a plurality of end sides of the arrangement face 3a. Each reflecting face 4a to 7a is formed with an inclined angle smaller than right angles against an extended face having the arrangement face extended toward outside the reflecting face concerned. Each reflecting face 4a to 7a is provided with large-inclination areas 4a2, 5a2, 6a2, 7a2 with large inclined angles, and small-inclination areas 4a1, 5a1, 6a1, 7a1 with small inclined angles. As seen from an irradiation area Ar side in plane view, light sources 2a to 2d arranged in adjacency to the large-inclination areas are arranged nearer to outer edges of the irradiation areas than the light source 2e arranged in adjacency to the small-inclination areas.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010012206-A (JP)
Title: Pattern selection type lot
Inventor: HASUMI SADAO
IPC: A63F3/06
Filed: 2008-07-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pattern selection type lot of store participation type, which can be issued, sold, and used at an agency.  <P>SOLUTION: In purchase of an article, at the point of connection to a communication network, when a game machine is used, since the lot sold at an outlet store can be used at an affiliate store, and the outlet store of a pattern of the article winning the prize, an area is activated, an economic effect is raised to contribute to the area by advertising the article to be the prize, and the store.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010039114-A (JP)
Title: Image forming apparatus, scanning beam pitch deviation correction method, computer program, and recording medium
Inventor: AKAMATSU SHUSUKE
IPC: B41J2/44
Filed: 2008-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high quality image the pitch of which is always uniform by detecting pattern densities and hence a pitch deviation and then adjusting a beam pitch based on the detected amount.  <P>SOLUTION: An image forming apparatus for forming an image by deflecting and scanning a plurality of beams with a polygon mirror and carrying out optical writing performs the following steps: forming a pair of patterns for a beam pitch correction by using the plurality of beams (S101 to S103); calculating the densities of the pair of patterns and a density difference between the pair of patterns, and calculating an amount of correction of a pitch interval in a sub-scanning direction of the plurality of beams from the calculated density difference (S104 to S107); and correcting the pitch of the plurality of beams in the sub-scanning direction based on the calculated amount of correction of the pitch interval (S108 to S109).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010036429-A (JP)
Title: Metallic mold for blade for oa
Inventor: GOTO YASUHEI
IPC: B29C45/14
Filed: 2008-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a metallic mold for a blade for OA suitable for manufacturing the blade for the OA provided with a properly shaped elastic member free from an unfilled part.  <P>SOLUTION: The metallic mold 5 is used for manufacturing the blade 1 for OA which has the elastic member 3 provided on a long hard plate 2 along the longitudinal direction. The metallic mold 5 has a cavity CA formed into a shape corresponding to the elastic member and a gate 14 through which a material MA to become the elastic member is injected to the cavity CA from the outside, wherein the diameter of the gate is set to be 0.5-0.8 mm. Since the diameter of the gate is set to be narrower than that of a conventional cavity, the optimum filling rate of the material is secured in the cavity and the occurrence of unfilling or the like is suppressed.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010041411-A (JP)
Title: Communication system
Inventor: KAWAMURA DAISUKE
IPC: H04L9/32
Filed: 2008-08-05
Abstract: <P>PROBLEM TO BE SOLVED: To prevent, even if information exchanged between devices that implement authentication is intercepted, illegal authentication using the information in a communication system where a common encryption key is shared between the devices and a result encrypting random number information using the encryption key is exchanged as authentication information to perform authentication.  <P>SOLUTION: A verification control device 31 generates a vehicle-side rolling code Cc1 corresponding to the number of authentication times of an electronic key 12. At the same time, a control circuit 21 of the electronic key 12 generates a key-side rolling code Ck1 corresponding to the number of reception times of a challenge code Cch. The verification control device 31 authenticates the electronic key 12 on the basis of an encryption result obtained by encrypting a result obtained by adding the rolling code Ck1, Cc1, that varies each time the authentication is implemented between the verification control device 31 and the electronic key 12, to the challenge code Cch exchanged between them, while using a common encryption key.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010038759-A (JP)
Title: Surface flaw inspecting method, surface flaw inspecting device, steel plate manufacturing method and steel plate manufacturing apparatus
Inventor: NAKADA TAKEO
IPC: G01N21/892
Filed: 2008-08-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a surface flaw inspecting method which enables the obtaining of a result near to a visual inspection result at the time of the inspection of a surface flaw, a surface flaw inspecting device, a steel plate manufacturing method and a steel plate manufacturing apparatus.  <P>SOLUTION: In the method for inspecting the surface flaw of a surface to be inspected by projecting illumination light on the surface to be inspected to image the surface to be inspected, the image obtained by imaging is divided into a large number of longitudinally and laterally arranged pixels and the surface flaw is detected by calculating a color difference with respect to all of the respective pixels. The color difference is calculated only from the brightness of a region containing the target pixel and the brightness of a region separated from the target pixel by predetermined distance.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010040859-A (JP)
Title: Defect inspection device, defect inspection system, and defect inspection method
Inventor: FUKUNAGA YUJI
IPC: H01L21/66
Filed: 2008-08-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a defect inspection device, a defect inspection system and a defect inspection method that use defect data for analysis without lowering the number of samples of a defect with a high killer rate.  <P>SOLUTION: Defect data on a defect on a semiconductor wafer 111 is acquired by an inspection unit 110 of the defect inspection device 100 and stored in a storage unit 122, and the obtained defect data are classified into a defect kind by a classification determination unit 123 on the basis of a predetermined classification standard previously stored in the storage unit 122. A processing arithmetic operation unit 124 generates a first data list of objects to be reviewed for detailed observation for the classified defect data and a second data list obtained by adding defect data which are not included in the objects to be reviewed, but need to be analyzed to the first data list, and the fist and second data lists are put together with a data list acquired in another inspection stage to specify the cause of occurrence of a defect which is not included in the objects to be re viewed, but needs to be analyzed and the occurrence process thereof.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010036329-A (JP)
Title: Workpiece holding mechanism and machine tool
Inventor: YANAGISHIMA KEIGO
IPC: B23B31/117
Filed: 2008-08-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a workpiece holding mechanism which can hold a workpiece having a small outer diameter and a workpiece formed of a fragile material by satisfactory holding force.  <P>SOLUTION: The workpiece holding mechanism 1 comprises a holding member 3 comprising a holding part 3a for holding a workpiece 2. The holding part 3a is formed in a spiral form and holds the workpiece 2 on the inner peripheral side of the holding part 3a. Accordingly, in the workpiece holding mechanism 1, the inner diameter of the spiral holding part 3a can be varied so that the workpiece 2 can be held by satisfactory holding force even when the workpiece 2 has a small outer diameter. Further, in the workpiece holding mechanism 1, when the length of the holding part 3a is increased to increase the contact area between the holding part 3a and the workpiece 2, the pressure of contact between the holding part 3a and the workpiece 2 can be lowered while maintaining the satisfactory holding force of the workpiece 2. Accordingly, the workpiece 2 can be held by satisfactory holding force even when the workpiece 2 is formed of a fragile material.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010035974-A (JP)
Title: Deodorization device
Inventor: NISHINA HIDEO
IPC: B01F23/10
Filed: 2008-08-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a deodorization device which allows more effective deodorization of odor air and facilitates cleaning after use, in the vaporization-based deodorization device.  <P>SOLUTION: The device includes: a lower case 4 having a bottom and an opening top, in which a deodorant solvent can be retained on the bottom, and an intake vent 8 is formed in its sidewall; an upper case 3 which is detachably installed on an upper part of the lower case 4 for closing the top opening of the lower case 4 and in which an exhaust vent 7 is formed and a fan 5 is detachably installed; a vaporization sheet 9 which is installed in the lower case 4 so that its one part is placed in the deodorant solvent retained on the bottom of the lower case 4 and the intake vent 8 is closed; and a plurality of stirring plates 10 installed in the lower case 4. The stirring plates 10 includes an attachment part 1001 fixed to an inner wall of the lower case 4 and a stirring part 1002 which is connected with the attachment part 1001 toward an inner periphery of the lower case 4.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2008270846-A (JP)
Title: Method for manufacturing semiconductor device
Inventor: IKEDA YOSHINARI
IPC: H01L21/60
Filed: 2008-08-11
Abstract: <P>PROBLEM TO BE SOLVED: To improve the reliability of a solder joint between a semiconductor chip and the other composition member, and the reliability of a solder joint between composition materials other than the semiconductor chip.  <P>SOLUTION: A solder joint layer 5 is heated and melted in a state that a filler thinner than the solder joint layer 5 before melted is placed on the solder joint layer 5 before melting, and then the solder joint layer 5 is cooled and hardened in a state that the filler drips into the melted solder joint layer 5. This can set the thickness of the solder joint layer 5 with which a heat sink 6 and an insulating substrate 3 are joined to a desired thickness, and makes the filler as a spacer, to reduce distortion generated in the solder joint layer 5. Furthermore, in a similar way in a solder joint between the semiconductor chip and a lead frame and in a solder joint between the insulating substrate 3 and the semiconductor chip, this makes the fillers as spacers in solder joint layers which connect them to each other, to reduce distortion generated in the solder joint layers.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010043926-A (JP)
Title: Acceleration sensing unit and acceleration sensor
Inventor: ICHIKAWA SO
IPC: G01P15/08
Filed: 2008-08-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide an acceleration sensing unit and an acceleration sensor having reduced size, and improved accuracy for detecting acceleration.  <P>SOLUTION: The acceleration sensing unit includes: a fixed member 6 prevented from being displaced by applying the acceleration; a crystalline element supporting member 5 provided with a movable member 8 supported in the fixed member by a beam 7; and a crystalline stress sensitive element 11 having a stress sensitive section, and fixed ends integrated with both ends of the stress sensitive section. The stress sensing element is an acceleration sensing unit having fixed both ends supported by the fixed member and the movable member. A notch for indicating an orientation of a crystal axis of a crystal or a first alignment index 9 having a marking are asymmetrically disposed in a proper place in the element supporting member. A second alignment index 16 for indicating the orientation of the crystal axis of the crystal is asymmetrically disposed in a proper place in the stress sensitive element.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009065970-A (JP)
Title: Method for producing chemical by continuous fermentation
Inventor: RA KEISHU
IPC: C12R1/865
Filed: 2008-08-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a chemical by a continuous fermentation method, in which high productivity can be kept stably over a long time, under simple operating conditions.  <P>SOLUTION: In the method for producing chemicals by continuous fermentation, in which a fermentation culture solution is separated into a filtrate and an unfiltered liquid and the chemical which is a desired fermentation product from the filtrate is recovered, and the unfiltered liquid is retained or refluxed in the fermentation culture solution, filtering treatment of the fermentation culture solution is carried out, by using a porous membrane having high permeability and high cell-preventing ratio and hardly causing occlusion as the separation membrane and continuous fermentation can stably be carried out, by pulling out a part of fermentation culture solution containing microorganisms or culture cells from the fermentation culture solution to the outside of the system.  <P>COPYRIGHT: (C)2009,JPO&INPIT