Patent SG-11201901352X-A (SG)
Title: Chemical mechanical polishing smart ring
Inventor: HUANG ZUBIN
IPC: H01L21/306
Filed: 2017-09-08
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111111111111111111010111111111111111111H11111111111111111111111111111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\"\" WO 2018/052816 Al 22 March 2018 (22.03.2018) WIP0 I PCT (51) International Patent Classification: (72) Inventors: HUANG, Zubin; 3320 Scott Blvd., Santa B24B 37/32 (2012.01) B24B 57/02 (2006.01) Clara, California 95054 (US). WELLS, Stephen A.; 29 B24B 37/005 (2012.01) HO1L 21/306 (2006.01) Manorsfield, Roffey, West Sussex, Horsham Sussex RH13 B24B 49/00 (2006.01) (GB). GOPALAN, Ramesh; 38765 Adcock Drive, Fre- mont, California 94536 (US). SHEELAVANT, Gangad- (21) International Application Number: PCT/US2017/050822 har; 1353A, Ward No. 3, Sheelavant Street, Karnataka, Guledgudd 587203 (IN). YAVELBERG, Simon; 10355 (22) International Filing Date: Plumtree Lane, Cupertino, California 95014 (US). 08 September 2017 (08.09.2017) (74) Agent: PATTERSON, B., Todd et al.; Patterson & Sheri- (25) Filing Language: English dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, Texas 77046 (US). (26) Publication Language: English (81) Designated States (unless otherwise indicated, for every (30) Priority Data: kind of national protection available): AE, AG, AL, AM, 201641031439 15 September 2016 (15.09.2016) IN AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, (71) Applicant: APPLIED MATERIALS, INC. [US/US]; CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, 3050 Bowers Avenue, Santa Clara, California 95054 (US). DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, (54) Title: CHEMICAL MECHANICAL POLISHING SMART RING = = FIG. 1 x- 114 120 -...‘ 122 100 126 — _ 124 _ 119 , 108 I 101 ? 111 = I 128 112 kil 109 116 - - -, i 5 Iiimrskei l blihmeambil _ _ 7 4 ' S in = = 110 103 102 = = = Z = L x N _ X104 1-1 (57) : Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one Il pc embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor N 1 assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly 0 11.1 n includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled —. to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect GO , 1 vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head. 0 ei O [Continued on next page] WO 2018/052816 Al MIDEDIMOMOIDEIREEMOOMMEIHROIROMEEN MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))