baber/WOPTO huggingface dataset:
Patent TW-578319-B (TW)
Title: Light emitting diode having anti-reflection layer and method of making the same
Inventor: CHEN SHI-MING
IPC: H01L21/31
Filed: 2003-01-23
Granted: 2004-03-01
Abstract: A light emitting diode (LED) having an anti-reflection layer and a method of making the same are disclosed. The present invention features in that an anti-reflection layer is formed on a window layer of the LED, thereby reducing the chance that the photons generated by the LED are totally reflected at the interface between the window layer and the air. Moreover, the process by which the anti-reflection layer is formed is such as plasma enhanced chemical vapor deposition (PECVD), sputtering, thermal evaporation, or electron-beam evaporation, etc. Furthermore, the refractive index of the aforementioned anti-reflection layer is between 3 and 1.5, and the material of the anti-reflection layer is such as silicon nitride or ZnSe, etc.
Patent TW-577142-B (TW)
Title: Pad layout on sawing street
Inventor: LIANG MING-SHUOH
IPC: H01L21/76
Filed: 2003-02-12
Granted: 2004-02-21
Abstract: A pad layout on a sawing street is disclosed. In the pad layout, a plurality of slots are formed on the middle area of the pad, the number of vias is decreased, and a plurality of buffer areas are formed on the edges of the pad along the sawing direction. Forming the slots on the middle of the pad and decreasing the number of vias both can reduce the structure intensity, and forming the buffer areas on the edges of the pad can release the material stress resulted from sawing the pad.
Patent TW-586160-B (TW)
Title: Method of fabricating semiconductor device having low dielectric constant insulator film
Inventor: YAMAOKA YOSHIKAZU
IPC: H01L21/312
Filed: 2003-02-24
Granted: 2004-05-01
Abstract: The present invention provides a method of fabricating a semiconductor device that is capable of enhancing selecting ratio between a low dielectric constant insulator film and an etching mask layer, such as an etching stop film, etc., without increasing a thickness of the etching mask layer, wherein the method comprises a step of forming a first insulator film including a polymer film having C and H, a step of forming a first etching mask layer including Si onto a given area within the first insulator film, a step of plasma etching the first insulator film with nitrogen-contained etching gas and ion energy, which is single-colored and has a narrow energy width, by adopting the first etching mask layer as a mask.
Patent TW-I261872-B (TW)
Title: Method of depositing CVD thin film
Inventor: YAMOTO HISAYOSH
IPC: C23C16/40
Filed: 2003-03-18
Granted: 2006-09-11
Abstract: This invention provides a method of depositing a CVD thin film that can be used without clogging or the like for a prolonged period of time, and that enables stable supply of raw materials to a reaction zone. A method of depositing a CVD thin film, comprising passing a solution of CVD raw material and a gas through a vaporizer into a CVD chamber for an appropriate period of time so as to form a given CVD thin film, is characterized in that, after the passage of the period, the gas from an outlet of the vaporizer is switched to an exhaust side while only a solvent capable of dissolving attachments to the vaporizer is passed through the vaporizer.
Patent TW-I256218-B (TW)
Title: Method and apparatus for transmit processing using receiver functions
Inventor: OZLUTURK FATIH M
IPC: H04L27/34
Filed: 2003-03-28
Granted: 2006-06-01
Abstract: Data is to be transmitted in a code division multiple access communication system. A channel response is provided as a channel response matrix H approximating a channel that the data will experience after transmission. The data is spread and the spread data is processed with the channel response matrix H. The spread and processed data is transmitted. The data is received and recovered from the transmitted spread and processed data.
Patent TW-I224144-B (TW)
Title: Heat treating device, heat treating method, recording medium recording heat treating program and steel product
Inventor: IIJIMA YOSHITSUGU
IPC: B23K35/32
Filed: 2003-04-07
Granted: 2004-11-21
Abstract: A heat treating device is provided, comprising a plurality sets of induction heating device (6) for heating a steel product (1), a correcting device (5) for correcting a steel product, a computing device (14) for computing power to be supplied to the induction heating device based on the conveying speed of a steel product, its target heating temperature, and its estimated temperature in a pre-stage in the induction heating device, and a power supply device (12) for supplying to the induction heating device a schedule power computed by the computing device, in which the computing device computes power for uniformly heat-treating a steel product or power for surface-heat-treating a steel product.
Patent TW-I291176-B (TW)
Title: Methods and apparatus for delay circuit
Inventor: LIN FENG
IPC: H03K5/135
Filed: 2003-06-12
Granted: 2007-12-11
Abstract: The present invention provides apparatus and methods relating to delay circuits. An electronic system includes a deskewing circuit configured to measure a delay and generate a synchronized signal according to the measured delay. The deskewing circuit may configured to detect an overflow condition and respond accordingly, for example by asserting an overflow signal. Further, the deskewing circuit may be additionally or alternatively configured to detect successful measurement of the delay and respond, for example by executing a power saving and/or noise reducing procedure.
Patent TW-I225436-B (TW)
Title: A loop-pin attaching device
Inventor: UENO HIDEYUKI
IPC: B65C9/00
Filed: 2003-07-03
Granted: 2004-12-21
Abstract: The present invention is to provide a loop-pin attaching device 20 which has a configuration that can easily deal with any troubles which would be occurred in the device 20 such as a malfunction or damage on the device 20 as well as that can flexibly use for any kinds of good to attach a tag thereto, can be provided and in order to attain the above-mentioned object, a loop-pin attaching device 20 of the present invention is provided with a grip lever 22, a first feeding pin 34 and a second feeding pin 42, and wherein the loop-pin attaching device 20 being further provided with a first hollow guide member 43 having a curved configuration and a second hollow guide member 21 having a front end portion 35 directing to a tip end portion 44 of the first hollow guide member 43, both of the first and second hollow guide member 43, 21 being provided on a front end surface of the device, and further wherein the first hollow guide member 43 or the second hollow guide member being attached to the front end surface of the main body 33 of the device 20, detachably.
Patent TW-I226126-B (TW)
Title: Package structure and process of digital image capturing module
Inventor: SHI JIA
IPC: H01L21/8238
Filed: 2003-07-14
Granted: 2005-01-01
Abstract: A package structure and process of digital image capturing module is disclosed, in which a printed circuit board having the image sensing function is assembled onto a lens base to make a digital image capturing module. The feature of the package technology for the digital image capturing module is to install a ladder-like protrusion part at the side of the bottom of each positioning pillar, so that the image-sensing printed circuit board is positioned on the lens base. A gap is formed between the image-sensing printed circuit board and the lens base, thereby the subsequent dispensing can flow by itself into and fill the gap, and form a sealed encapsulation layer after solidification, so as to provide the sealing effect without light passing-through. With the feature, manual labor is not required for supplementing encapsulant in the assembling procedure, and therefore the working difficulty is reduced and productivity is increased.
Patent TW-I239039-B (TW)
Title: Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed
Inventor: NATSUHARA MASUHIRO
IPC: H01L21/683
Filed: 2003-07-17
Granted: 2005-09-01
Abstract: Wafer holder for semiconductor manufacturing and semiconductor manufacturing device in which the holder is installed, the wafer holder having a wafer-carrying surface whose wafer-retaining face has an enhanced isothermal rating. In the wafer holder having a wafer-carrying surface, multiple nubs having a flat portion are formed on the wafer-carrying surface; and by making the surface area of the flats on the nubs 70 mm<2> or less per nub, distribution in obverse-surface temperature of a wafer set in place on the wafer holder can be brought within ±1.0%. If moreover the per-nub flat surface area is 30 mm<2> or less, the temperature can be brought within ±0.5%. In addition, the total surface area of the flats on the nubs preferably is 40% or less of the wafer surface area, inasmuch as the incidence of trouble when de-chucking the wafers can be kept under control.
Patent TW-I260117-B (TW)
Title: Box adaptor with a revolvable socket dome
Inventor: CHIANG YI-TE
IPC: H01R35/04
Filed: 2003-08-15
Granted: 2006-08-11
Abstract: A box adaptor with a revolvable socket dome is introduced to have a housing and at least a dome structure. The housing further include a bracket plate. The dome structure further includes a collar shaft at one end for forming a revolvable pair with the bracket plate and a dome surface at another end. At least a socket is constructed to a rim of the dome surface, with a facing direction perpendicular to the dome surface. By providing the engagement of the collar shaft and the bracket plate, the socket can change its facing direction as the respective dome structure revolves about the bracket plate.
Patent TW-I259021-B (TW)
Title: Display device and method for fabricating the same
Inventor: SAKAMOTO YOSHIAKI
IPC: H05B33/14
Filed: 2003-09-15
Granted: 2006-07-21
Abstract: This invention provides a display device. It comprises a first substrate, an organic EL element, an inorganic insulating film, and a second substrate. The organic EL element forms upon the first substrate. It possesses a first electrode. The organic EL layer forms upon the first electrode. The second electrode forms upon the organic EL layer. The inorganic insulating film forms on the organic EL element and sealing the organic EL layer. The second substrate forms upon the inorganic insulating film. Wherein, the materials and thicknesses of the first and second substrates are set, such that the neutral axis is located near the interface of the inorganic insulating film and the second substrate when a bending stress is applied. Since the inorganic insulating film is protected against cracking, and the organic EL element can be isolated effectively from moisture and oxygen. Eventually, it enhances the reliability of the display.
Patent TW-I237286-B (TW)
Title: Compact fluorescent lamp package
Inventor: RIBARICH THOMAS J
IPC: H01J61/36
Filed: 2003-10-03
Granted: 2005-08-01
Abstract: A compact fluorescent lamp package is devised to have the same appearance and dimensions as a conventional incandescent light bulb. The compact fluorescent lamp package includes a base, a fluorescent lamp, a ballast circuit contained entirely in the base, and a diffuser cover.
Patent TW-I269149-B (TW)
Title: Power supply device for computer device
Inventor: TSAI KENNY
IPC: G06F1/26
Filed: 2003-10-27
Granted: 2006-12-21
Abstract: A power supply device for a computer device mainly comprises a DC to DC converter used to receive and convert an outside DC power supply to a variety of DC voltages needed for a computer device and an up/down regulator connected to the DC to DC converter and used to stabilize an output. Here, the up/down regulator is installed before the +12V voltage input end of the computer device. Whereby, the +12 voltage can be stabilized and the work loss of the power supply for the computer can be lowered down.
Patent TW-I227600-B (TW)
Title: System for real-time detecting moving object status and the method thereof
Inventor: LUO LI-SHENG
IPC: G01S11/16
Filed: 2003-12-15
Granted: 2005-02-01
Abstract: The present invention relates to a system for real-time detecting moving object status and the method thereof, which is used to detect the moving information between the first object and the second object in relative motion; wherein, the first object sequentially transmits a plurality of signal pairs in continuous time spots, and each signal pair includes a first signal and a second signal corresponding to the first signal, and the traveling speed of the first signal is quicker than the traveling speed of the second signal. The second object received at least one first signal and the corresponding second signal early or late, and obtained a time difference. The time difference is the time period lapsed from receiving the first signal to receiving the second signal. The second object can calculate the motion information for the first object and the second object based on the time difference.
Patent TW-I241018-B (TW)
Title: Method for manufacturing wafer level image sensor package with chip on glass configuration and structure of the same
Inventor: CHAO YEONG-CHING
IPC: H01L27/14
Filed: 2003-12-19
Granted: 2005-10-01
Abstract: A method for manufacturing wafer level image sensor package with chip on glass configuration is disclosed. At first, the method is providing a wafer with a plurality of image sensing chips. Each image sensing chip forms a sensing area and a plurality of bumps on its active area. Then, the method is providing a glass substrate with a plurality of substrate units which are defined by a plurality of cutting lines. Each substrate unit has a plurality of through holes which are corresponding to the bumps. The glass substrate is formed a sealing layer which is covering the through holes and the cutting lines. Then, the glass substrate and the wafer are attached together so that the bumps of the image sensing chips are electrically connecting with the through holes of the substrate units. Then, the glass substrate and the wafer are cut to finish the wafer level image sensor package.
Patent TW-I228017-B (TW)
Title: Organic electroluminescent device
Inventor: LIANG WEN-JIE
IPC: C07C211/54
Filed: 2003-12-31
Granted: 2005-02-11
Abstract: The present invention relates to an organic electroluminescent device, comprising a first electrode, an organic luminescent layer and a second electrode which disposed over a substrate. The organic electroluminescent layer comprises compound of formula (I) compound, wherein that Ar1-Ar6 are individual hydrogen, substituted or unsubstituted C1-6 alkyl, substituted or unsubstituted C3-6 cycloalkyl, substituted or unsubstituted C3-10 alkenyl, substituted or unsubstituted C6-40 aromatic amino, substituted or unsubstituted C6-40 aromatic, substituted or unsubstituted C6-40 poly cyclic aromatic, or substituted or unsubstituted C6-40 aralkyl.
Patent TW-I254748-B (TW)
Title: Sputtering target and process for producing the same
Inventor: HOSONO HIDEO
IPC: C04B35/645
Filed: 2004-02-05
Granted: 2006-05-11
Abstract: A process for producing a sputtering target composed mainly of oxychalcogenides containing La and Cu through sintering of as a raw material at least one powder selected from among constituent elements per se and oxides and chalcogenides thereof, characterized in that the process comprises a reaction step of maintaining 850 DEG C or below for 1 hr or more during sintering operation and, performed after the reaction step, pressurized sintering at a temperature equal to or higher than the temperature of the reaction step. This process is to not only attain increasing of the density of target for P type transparent conductive material composed mainly of oxychalcogenides containing La and Cu, increasing of target size and production thereof at low cost but also achieve elimination of the presence of unreacted matter in the target and inhibiting of target cracking to thereby improve product yield, and further is to enhance the quality of film formed by sputtering with the use of the target.
Patent TW-I269176-B (TW)
Title: Access device with a multi-channel transmission
Inventor: HUANG HUAI-JUNG
IPC: G06F13/14
Filed: 2004-02-13
Granted: 2006-12-21
Abstract: This invention relates to an access device with a multi-channel transmission, including: a connection interface, a processing unit, a bus controller and memories, where the bus controller is provided on a USB interface and connected to plural host equipments, and the connection interface is connected to plural peripheral equipments (such as thumb drives, external storage devices). The host equipments connected to this invention are able to connected to each other for data transmission and have access to the plural peripheral equipments via the data exchange processing performed by the processing unit and the memories, thereby achieving the object of allowing multi-channel transmission provided by this invention.
Patent TW-I261198-B (TW)
Title: Simultaneous multi-threading processor circuits and computer program products configured to operate at different performance levels based on a number of operating threads and methods of operating
Inventor: PARK GI-HO
IPC: G06F9/318
Filed: 2004-02-17
Granted: 2006-09-01
Abstract: Processing circuits that are associated with the operation of the threads in an SMT processor can be configured to operate at different performance levels based on a number of threads currently operated by the SMT processor. For example, in some embodiments according to the invention, processing circuits, such as a floating point unit or a data cache, that are associated with the operation of a thread in the SMT processor can operate in one of a high power mode or a low power mode based on the number of threads currently operated by the SMT processor. Furthermore, as the number of threads operated by the SMT operator increases, the performance levels of the processing circuits can be decreased, thereby providing the architectural benefits of the SMT processor while allowing a reduction in the amount of power consumed by the processing circuits associated with the threads. Related computer program products and methods are also disclosed.
Patent TW-I240040-B (TW)
Title: Overhead cam engine
Inventor: TANAKA HIROYUKI
IPC: F01L1/12
Filed: 2004-03-01
Granted: 2005-09-21
Abstract: To compact a combustion chamber and downsize a cylinder head in an overhead cam engine, wherein a cam shaft is provided between intake and exhaust valve springs and is rotatably supported by the cylinder head; and wherein the cam shaft is provided with a first cam to drive one of an intake valve and an exhaust valve and is provided with a second cam to drive the other of the intake valve and the exhaust valve. A cylinder head 16F supports a cam shaft 131 with its axis line approximately disposed above a cylinder axis line. A second cam 143 is disposed between intake and exhaust valve springs 129 and 130 and is formed to be smaller than a first cam 142. The first cam 142 is disposed farther from the position between the intake and exhaust valve springs 129 and 130 along the direction of the axis line of the cam shaft 131.
Patent TW-I279691-B (TW)
Title: Apparatus and method for controlling resource transfers in a logically partitioned computer system
Inventor: ARMSTRONG TROY DAVID
IPC: G06F12/00
Filed: 2004-03-01
Granted: 2007-04-21
Abstract: A resource and partition manager of the preferred embodiments includes a lock mechanism that operates on a plurality of locks that control access to individual hardware resources. The resource and partition manager uses the lock mechanism to obtain a lock on a hardware resource when transferring control of the hardware resource to a logical partition that is powering on and when removing the hardware resource from a logical partition that is powering off. The resource and partition manager uses the lock mechanism to remove control of a hardware resource from, or return control to, an operating logical partition in order to facilitate hardware service operations on that hardware resource or on the physical enclosure in which it is contained. The preferred embodiments also include methods for releasing system resources and address bindings allocated to a hardware resource when control the hardware resource is removed from a logical partition, and methods for allocating and initializing system resources when control of a hardware resource is transferred to a logical partition. In addition, the preferred embodiments include the use of the locks and related mechanisms to transfer hardware resources from the logical partitions to the resource and partition manager, and later back to the logical partitions, for the purpose of performing hardware service operations on a hardware resource or the components of a physical enclosure containing these hardware resources.
Patent TW-I244363-B (TW)
Title: Pattern forming method, pattern forming apparatus and manufacturing method thereof, conductive film wiring, opto-electronic device, and electronic machine
Inventor: HIRAI TOSHIMITSU
IPC: H05K3/00
Filed: 2004-03-15
Granted: 2005-11-21
Abstract: The present invention aims to provide a pattern forming method that can avoid any line width inconsistency of film patterns or any speckle in pattern appearance. The pattern forming method is to apply drops of a liquid material on a substrate (11) to form the required film patterns (W1-W3) and includes the following steps: (1) set multiple pattern-forming areas (R1-R3) for forming film patterns on the substrate (11). (2) Apply multiple drops in each of the multiple pattern-forming areas according to their respective order to form the required film patterns (W1-W3). The drop applying sequence in each pattern forming area should be roughly the same as that in other pattern-forming areas (R1-R3).
Patent TW-I248799-B (TW)
Title: Slide fastener tape and slide fastener stringer using the same tape
Inventor: MATSUDA YOSHIO
IPC: A44B19/56
Filed: 2004-04-28
Granted: 2006-02-11
Abstract: This invention provides a fastener tape and a stinger for a slide fastener constituted of a warp knitting or weaving structure and including a tape main portion (A) and a fastener element attaching portion (B), wherein a warp (1, 2, 11, 21) and a weft (3, 12, 13, 22), which are composition yarns of the fastener tape, are composed of multifilament yarns and a size of a composition filament of the warp (1, 2, 11, 21) is 1.0 to 2.0 dTex, and a size of that of the weft (3, 12, 13, 22) is 2.0 to 5.0 dTex, these sizes of the single filaments being not larger than 1/4 of the conventional composition filament, thereby achieving advantages that they adapt well to a fabric when and after a slide fastener is sewed to a thin fabric having flexibility and excellent drape performance and secure tape strength and coupling strength required as a slide fastener, the fastener tape and stringer ensuring flexibility and soft feeling.
Patent TW-I247571-B (TW)
Title: Height adjustment apparatus
Inventor: YANG HUANG-KUANG
IPC: G03B21/00
Filed: 2004-05-18
Granted: 2006-01-11
Abstract: A height adjustment apparatus is described. The height adjustment apparatus is utilized to adjust an angle of elevation of equipment, for example, a projector. The height adjustment apparatus includes a stage, an adjusting bar, a fixing device, and an operating arm. Therefore, the height adjustment apparatus can be operated in a small operational stroke and a small operational force to adjust the length thereof. The height adjustment apparatus further utilizes guiding cams and guiding fillisters to improve a tremble problem and enhance stability thereof.