baber/WOPTO huggingface dataset:
Patent JP-H0389782-A (JP)
Title: Classified storage device for image data by field of view
Inventor: TSUJI NOBUHIKO
IPC: H04N5/378
Filed: 1989-09-01
Abstract: PURPOSE:To use a microcomputer exclusively for optional measurement and arithmetic operation classified by a field of view, and to speed up a processing function by putting image data in order classified by the field of view without necessitating the control and the decision of the microcomputer, and storing it in a well-ordered storage circuit. CONSTITUTION:Delay circuits 12, 13, a process circuit (sequential signal generation circuit) 14 consisting of a counter and a decoder, etc., an area generation circuit 15, a gate circuit group 16, selection circuits 17, 20, a synthesis circuit 18, and a number of pieces measurement circuit group 19 are provided. Then, the device is constituted so that the image data can be stored in the well-ordered storage circuit 9 directly not through the control and the decision of the microcomputer 8 and in addition, as being put in order classified by the field of view. Accordingly, the microcomputer 8 can be used exclusively for the measurement and the arithmetic operation classified by the field of view. Thus, the output delay or the omission of measured data are removed, and processing speed and the processing function of inspection in the production line of a factory to which the device is applied can be speeded up.
Patent JP-H0949081-A (JP)
Title: Formation of film of group viii element and stock compound used for the same
Inventor: TAZAKI YUZO
IPC: C30B25/00
Filed: 1995-08-10
Abstract: PROBLEM TO BE SOLVED: To obtain a stock compd. suitable for use in the production of a thin film of a group VIII element such as Ru or Ir useful as a ferroelectric electrode material, a circuit material of LSI, etc., by a CVD method and to produce a high quality thin film of the element with high operability. SOLUTION: A group VIII element of the Periodic Table or a compd. contg. the element is deposited on a substrate by a chemical vapor deposition method using a β-diketone-contg. org. metallic complex consisting of the group VIII element and 2,2,6-trimethyl-3,5-heptane-dione or 2,6-dimethyl-3,5-heptanedione as a stock compd. to form the objective film.
Patent JP-H0274000-A (JP)
Title: Method and apparatus for plating printed board with copper
Inventor: SHIMAMUNE TAKAYUKI
IPC: H05K3/24
Filed: 1988-09-09
Abstract: PURPOSE:To form plating layers of the same thickness on both sides of a printed board with a small-sized plating vessel by regulating the interval between a pair of anodes placed at both sides of the board as the cathode so as to equalize the quantities of electric currents flowing in the anodes. CONSTITUTION:A pair of anodes 3, 3' are placed opposite to each other in an electrolytic soln. 6 contg. Cu ions in the plating vessel 1 of a Cu plating apparatus, a printed board 2 as the cathode is interposed between the anodes 3, 3' and electrolytic current is supplied between the electrodes from a DC power source 7 to plate both sides of the board 2 and the through holes with Cu. In the plating apparatus, the quantities of currents flowing in the anodes 3, 3' are measured and the anode 3' is moved in an arrow direction nearly perpendicular to the board 2 with a control circuit 8 through a driving mechanism 5 in accordance with the difference between the measured values to nearly equalize the quantities of currents flowing in the anodes 3, 3'. Cu plating layers of the nearly same thickness can be formed on both sides of the board 2.
Patent JP-H04106945-A (JP)
Title: Semiconductor device
Inventor: YOSHIDA SATOSHI
IPC: H01L21/66
Filed: 1990-08-27
Abstract: PURPOSE:To make it possible to obtain a device with minimum characteristic variations and enhance the yield by installing an evaluation device, electrically evaluating the presence of a thin oxide film, and carrying out process control. CONSTITUTION:A first electrode 9 is formed as an evaluation device in the lower part of a semiconductor substrate 1. After the formation of a thin oxide film on the electrode 9, this oxide film is etched and processed. During etching removal of this oxide film, a thin oxide film 8, which can not be completely eliminated, is sandwiched and formed on the electrode 9 as an upper part electrode 10 whose area is smaller than that of the electrode 9. The application of this evaluation device makes it possible to detect the presence of the film 8 and accordingly carry out process control either during process or after the formation of products by applying constant voltage between the electrode 9 and the electrode 10 and measuring the current flowing between the electrode 9 and 10. This construction makes it possible to evaluate the presence of a thin oxide film, which is an etching remainder, obtain a device with minimum characteristic variations by controlling the etching process, and enhance the yield.
Patent JP-S61102616-A (JP)
Title: Jig and method for fixing optical device
Inventor: WATANABE SHIGEKI
IPC: G02B7/00
Filed: 1984-10-25
Abstract: PURPOSE:To eliminate the inflection of lines of magnetic force, to eliminate damage to respective optical components, and to facilitate attachment and detachment by using a fixing jig made of nonmagnetic metal and fixing the optical components with the elastic force of the elastic body of the fixing jig. CONSTITUTION:Incidence and projection surfaces of a magneto-optic crystal body 1 and optical components 2 and 3 are pressed into contact with the elastic forces of elastic bodies stuck on both surfaces of a vertical member 22 and fixed. Further, there is none of the vertical member 22, elastic member 22, and elastic bodies 25 and 26 at the part of an optical path 4 where light is projected. Thus, a pressure plate 20 is mounted on the fixing jig body 16, which is inserted into the rectangular hole of a magnet 5 while the magneto-optic crystal body 1 and optical components 2 and 3 are fixed. Namely, the reverse surface of a bottom plate 17 is placed on the bottom surface of the rectangular hole and inserted into the rectangular hole as shown by an arrow P. Consequently, the elastic bodies 23 and 24 stuck on a horizontal member 21 deform elastically and are compressed to fix the fixing jig at a specific position in the rectangular hole. Consequently, none of optical components damages, so the attachment and detachment are facilitated.
Patent JP-H0274670-A (JP)
Title: Oxidation-resistant carbon fiber-reinforced material and production thereof
Inventor: HASEGAWA KAZUHIRO
IPC: D06M11/00
Filed: 1988-09-08
Abstract: PURPOSE:To obtain the title material resistant to rapid heat cycle without impairing the characteristics inherent in the base material by forming, under specified conditions, an inner layer of porous silicon carbide film on the surface of a carbon fiber-reinforced carbonaceous material base form followed by forming thereon a porous metal silicide film by a specific metal spray coating. CONSTITUTION:An inner layer of porous silicon carbide film 45-800mum thick is formed on the surface of a carbon fiber-reinforced carbonaceous material base form by treatment in an inert gas atmosphere at 1500-1700 deg.C for 30-60min using a silicon carbide-contg. gas and/or liquid. Thence, a metal selected from barium, titanium, zirconium, vanadium, tantalum, molybdenum and manganese is put to plasma spray coating on the resultant inner layer film to form, as an outer layer, a porous metal silicide film 200-1000mum thick.
Patent JP-H0650113-A (JP)
Title: Engine valve and manufacture thereof
Inventor: NAKANE IWAO
IPC: F01L3/02
Filed: 1992-07-31
Abstract: PURPOSE:To provide an engine valve whose abrasion resistance in a valve face part is excellent, and a manufacturing method thereof. CONSTITUTION:An annular rear face edge part 4 formed in the rear face of a valve head part 3 of a metallic valve body is coated with a ceramic material to form a ceramic coating film 7 and a deposit metal material is fused thereon to form a fused deposit metal layer 8. The ceramic coating film 7 suppresses disffusion of a valve material into the fused deposit metal layer 8 and most part thereof is dispersed as fragments 9 to be arranged in a solidified deposit metal part 10 in a dispersion state.
Patent JP-S6197400-A (JP)
Title: Production of oiling agent of leather or fur
Inventor: HANSU HERUBERUTO FURIIZE
IPC: C14C9/02
Filed: 1985-10-11
Abstract: A process for the sulfonation of certain fat and oil mixtures, the product of such process, and a method for using such product as a leather tanning stuffing agent, the certain fat and oil mixtures comprising (A) 20-80% by weight of at least one C8-24-fatty acid glycerol ester having an iodine number above 20, and (B) the balance q.s. to 100% by weight of at least one C1-4-aliphatic monoalcohol ester of a C8-24-fatty acid having an iodine number of 50-100.
Patent JP-H0546959-A (JP)
Title: Method and device for detecting misalignment of magnetic detecting section
Inventor: TAYAMA HARUZO
IPC: G11B5/58
Filed: 1991-08-09
Abstract: PURPOSE:To adjust the relative misalignment between magnetic detecting sections by detecting the phase difference between the magnetic detecting sections in the direction of the movement of a magnetic tape. CONSTITUTION:Phase comparing sections 23 and 28 detect the relative phase lead or lag between each signal read out from a magnetic tape through a plurality of gaps 27a and 27b formed on a magnetic head 27. An output section 25 outputs a positive or negative voltage in accordance with the lead or lag of detected phase. The misalignment of the gaps 27a and 27b relative to the direction of the movement the magnetic tape can be detected from the polarity, positive or negative, and value of the voltage.
Patent JP-S6285491-A (JP)
Inventor: HATA KANJI
IPC: B23P19/04
Filed: 1985-10-09
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S61103297-A (JP)
Inventor: SUZUKI TAKANOBU
IPC: G08C25/00
Filed: 1984-10-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S59116899-A (JP)
Inventor: NAKAMURA YASUJI
IPC: G08G1/054
Filed: 1982-12-22
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6284490-A (JP)
Title: Semiconductor memory device
Inventor: HORIGUCHI FUMIO
IPC: G11C11/404
Filed: 1985-10-09
Abstract: PURPOSE:To stabilize a cell plate potential without increasing power consumption by allowing a cell plate potential setting circuit to variably controlling the output impedance according as a memory array is acting or standing by. CONSTITUTION:When a memory is standing by, an external clock phi0 and those of phi1 and phi2 are held at H and L, respectively. MOSFETs T5 and T3 are turned on, while nodes N1 and N2 are at L. MOSFETs T1 and T2 at an output stage are turned off, and the output is held in a high impedance state decided by resistances R1 and R2. When the memory enters an action operation, the clock phi0 comes to L, and the node N2 becomes floating. When the clock phi1 comes to H, the node N1 becomes H. When the clock phi2 comes to H, the node N1 is boosted more than a power source voltage due to a capacity across the source and gate of the T4. As soon as the node N2 comes to H, the T4 is turned off, while the T1 and T2 are turned on. Then the output impedance of the cell plate potential setting circuit CPG drops. Accordingly, even if a cell plate CP develops the potential fluctuation, it recovers more quickly than the T1 and T2.
Patent JP-S6379351-A (JP)
Title: Semiconductor device
Inventor: NOGUCHI SHOZO
IPC: H01L23/04
Filed: 1986-09-22
Abstract: PURPOSE:To make bonding of fine metallic wires and outer leads excellent, by protruding glass seal parts for the outer leads from the upper surface of a metallic stem base, and shortening the distance from the glass sealing part of each outer lead to the bonding part of the fine metallic wire. CONSTITUTION:Outer leads 102 are sealed with glass 103 at step parts 108, which protrude from the upper surface of a metallic stem base 101. Then, a distance from the tip part of each outer lead 102, which is bonded to a fine metallic wire 106 to the sealing part, can be made short. Therefore, when the fine wire 106 is bonded to each lead 102 by ultrasonic bonding, absorption of ultrasonic energy into the lead 102 is suppressed. Thus the excellent and stable bonding between the fine wire 106 and the lead 102 can be obtained.
Patent JP-H0972713-A (JP)
Title: Three-dimensional position attitude measuring apparatus
Inventor: TOMONAKA TETSUYA
IPC: G06T7/00
Filed: 1995-09-01
Abstract: PROBLEM TO BE SOLVED: To calculate the three-dimensional position of a characteristic point and the normal vector of a flat surface without calculating the three-dimensional positions of many points on a plurality of slits. SOLUTION: A vertical slit light is made to irradiate the flat surface of a three-dimensional object by a vertical slit light projector 2, and a lateral slit light is made to irradiate by a lateral slit light projector 3. An image camera 1 images the picture of the flat surface of the object. A characteristic point measuring unit 4 measures the two-dimensional coordinates of the characteristic point of an area having different brightness existing on the flat surface of the picture. A vertical slit measuring unit 5 measures the equation of the two-dimensional straight line of the vertical slit light on the picture, and a lateral slit measuring unit 6 measures equation of the two-dimensional straight line of the lateral slit light on the picture.  A three-dimensional position attitude calculator 7 calculates the three-dimensional position of the characteristic point and the normal vector of the flat surface from the position on the picture of the point and the equation of the straight line on the picture of the vertical and lateral slits projected to the flat surface including the point.
Patent JP-H0966370-A (JP)
Title: Electrode for resistance spot welding to aluminum material to be welded and resistance spot welding method
Inventor: TAKAHASHI KAZUNORI
IPC: B23K103/10
Filed: 1995-09-01
Abstract: PROBLEM TO BE SOLVED: To obtain continuous spot weldability and appearance quality in a welded part which is equivalent to a steal sheet by permitting to keep a contacting end-diameter of the electrode constant and permitting to keep a current density constant during welding, in the continuous spots at the time of a resistance spot welding to Al alloy. SOLUTION: In the range of a temp. near the end part of the electrode during passing a welding current, a high temp. hardness characteristic fitting into a softening characteristic of Al alloy material to be welded i.e., a soften characteristic within a specified temp. zone is provided to the electrode 1. Specifically, with respect to the electrode 1 used in the resistance spot welding to the Al alloy material to be welded, the electrode is composed of the material having the high temp. hardness characteristic which is softened from >=Hv80 to <=Hv30 in the Vickers hardness at 200 deg.C-400 deg.C so as to be >=971ACS% in the electric conductivity of the electrode, >=Hv80 at <=200 deg.C and <=Hv30 at >=400 deg.C in the Vickers hardness. The resistance spot welding is performed by using this electrode for the resistance spot welding to the Al material to be welded.
Patent JP-H0939978-A (JP)
Title: Packaging film container
Inventor: WADA TAMOTSU
IPC: B65H35/00
Filed: 1995-08-01
Abstract: PROBLEM TO BE SOLVED: To extremely easily pull out a packaging film again after the packaging film is cut by a method wherein in the vicinity of a film cutting position for the packaging film, a space is formed between the vicinity of a film cutting part and a container for the packaging film. SOLUTION: In the vicinity 2 of a film cutting position of a container 1 for a packaging film, an incision 6 is placed. Then, this part is bent to the outside of the container 1 for the packaging film, and a lifting member 7 to lift the packaging film is formed. A space 4 is formed between a film cutting part 3 and the container 1 for the packaging film by the lifting member 7 and an opening 8, and as a result, the film can be easily gripped in the vicinity of the film cutting part 3. When a lid 9 of the container is closed after a usage, the lifting member 7 is also closed, and there is no fear that dust and dirt, etc., may enter the container 1 for the packaging film.
Patent JP-H04107814-A (JP)
Title: Resist film forming method
Inventor: MURAKAMI MASAAKI
IPC: H01L21/027
Filed: 1990-08-28
Abstract: PURPOSE:To prevent rising at the end, when unnecessary part of resist film is removed(peripheral removal), by controlling the time to be elapsed before establishing a predetermined flow fate of rinse liquid at the time of rinse liquid supply. CONSTITUTION:Under a state where a liquid chamber 8a is filled with rinse liquid, rise liquid is fed or delivered. Accelerating rinse liquid delivery interval before reaching a steady flow rate of 15cc/min measured by a flow meter 1.0, i.e., the interval in which delivery of rinse liquid increases, is set as long as 5-10sec, for example, by controlling the pressure of air fed into an air chamber 8b. When a resist film 20 is trimmed with the rinse liquid during the accelerating delivery interval in which the rinse liquid flow increases gradually, rapid delivery of rinse liquid can be avoided. Consequently, rising at the end of the resist film 20 is prevented and the resist film 20 can be made uniform even after trimming thereof.
Patent JP-H0273456-A (JP)
Title: Preparation system for additional parts slip
Inventor: KOMAI YOSHIO
IPC: G06Q50/04
Filed: 1988-09-08
Abstract: PURPOSE:To reduce the time and the labor of a person in charge by showing automatically the necessary addition and its quantity to the revised edition of production for the printed matters to which the contents of an additional parts file are outputted. CONSTITUTION:When the design revised edition information JSK is received from a host device 25, the contents of a reference table 19 are updated and therefore the table 19 is always kept in its latest state. While the production order information JSD received from the device 25 is added to a progress file 17 as a new code. In this case, a production command number is automatically added to the record based on the diagram number designated by the information JSD. Then the production order diagram registered newly into the file 17 is collated with a diagram number of the table 19. In the case the coincidence is obtained between both diagram numbers, the present revised edition is collated with the updated revised edition. As a result, the additional quantity is calculated from an equation I for the parts specifications where the present revised edition is larger than the updated revised edition in terms of the using frequency. Thus it is possible to obtain an additional parts record where the result of calculation is written into the additional quantity item of an additional parts file 18.
Patent JP-S6284761-A (JP)
Inventor: SHIBA DAISUKE
IPC: A61F13/15
Filed: 1985-10-11
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H1052304-A (JP)
Title: Light emitting umbrealla
Inventor: ISHII KOJI
IPC: A45B3/04
Filed: 1996-08-09
Abstract: PROBLEM TO BE SOLVED: To make a light emitting umbrealla conspicuous at dark time and bad visibility time such as nighttime by running plural optical fibers along respective ribs by branching them off by taking them outside from a shaft in an upper part of the shaft, fixing edge parts of these respective optical fibers to tip parts of the respective ribs, and arranging transparent bulbs to diverge the light of a light emitting body transmitted to the respective edge parts of these optical fibers. SOLUTION: A battery 6, a light emitting body 8 and an externally operable switch 7 to open and close an electric circuit are arrange inside a hollow handle 1 of an umbrella. One edge parts 10A of plural optical fibers 9 are bundled together, and are fixed to a lower end part in a hollow shaft 2 of the umbrella in an upper position of this light emitting body 8, and are formed so that the light irradiated from the light emitting body 8 is transmitted after being made incident from one edge part 10A of the optical fibers 9. These plural optical fibers 9 are run along respective ribs 3 through inside of the hollow shaft 2 by branching them off by taking them outside from the shaft 2 in an upper part of the shaft 2, and are extended up to tip parts of the respective ribs 3, and the other respective edge parts 10B of the respective optical fibers 9 are fixed.  Transparent bulbs 12 to diverge the transmitted light are arranged in the edge parts 10B of these optical fibers 9.
Patent JP-S60116492-A (JP)
Title: Thermal transfer medium
Inventor: TAKIGAWA NOBUHIRO
IPC: B41M5/52
Filed: 1983-11-30
Abstract: PURPOSE:To obtain a medium capable of transferring a stable image with high density while consuming a minute quantity of thermal energy, by incorporating a specified phenol compound and a porous filler having a specified oil absorption into a receiving layer, in a thermal transfer medium comprising a leuco dye in a transfer layer. CONSTITUTION:A transfer sheet has a construction wherein a transfer layer comprising a conventional leuco dye as a main constituent is provided on a base such as a paper and a plastic film. On the other hand, a receiving sheet has a construction wherein a receiving layer comprising a phenol compound of the formula, wherein R is an alkylene group, and X is a hydrogen atom or a halogen, ordinarily, chlorine atom, and a porous filler having an oil absorption of not less than 50ml/100g together with a color developer for the leuco dye as main constituents is provided on a base such a paper and a plastic film. In the receiving layer, 0.3-30pts.wt. of the phenol compound and 0.05-10pts.wt. of the porous filter are used per 1pts.wt. of the color developer. An appropriate amount of a heat-fusible substance may be incorporated in the receiving layer and the transfer layer.
Patent JP-2001053193-A (JP)
Title: Semiconductor device and manufacturing method thereof
Inventor: SAWADA KANAKO
IPC: H01L23/12
Filed: 1999-08-10
Abstract: PROBLEM TO BE SOLVED: To miniaturize a semiconductor device, using no interposers and pre vent fatigue breakdowns of I/O terminals under a temperature cycle environ ment, when a device is mounted on a mounting board. SOLUTION: This semiconductor device consists of a semiconductor element 10, having a plurality of electrodes 12 on the main surface, a film 20 bonded to the main surface of the semiconductor element 10 the film of has a plurality of thin wires 21 formed separately in a binder 22, and a plurality of I/O terminals 60 formed so as to be connected electrically with one end portions of the plurality of thin wires 21 exposed from a second surface of the film 20. Both end portions of the respective thin wires 21 are exposed from a first surface of the film 20 and the second surface facing the first surface. The other end portions of the thin wires 21 exposed from the first surface are connected electrically with the electrodes 12 of the semiconductor 10.