baber/WOPTO huggingface dataset:
Patent JP-2010230296-A (JP)
Title: Floor heating panel
Inventor: INOUE TAKAO
IPC: F24D13/02
Filed: 2009-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a floor heating panel capable of preventing the generation of floor rasping noise generated by the irregular contact of a connector side face with a sidewall of a connector reception recess.  <P>SOLUTION: In the floor heating panel 10X, a horizontal width of a movable-side connector reception recess 24 is wider than a fixed-side connector reception recess 22, and the fixed-side connector reception recess 22 is formed in a position deflected to a side-edge 25 side at one side of the movable-side connector reception recess 24. Thus the floor heating panels 10X can be connected to each other in a state that a center line L1 of the movable-side connector 32 and a center line L2 of the fixed-side connector 31 at a position where the internal stress of a leading margin 41 of a power wire 40 is released, can be matched in advance, and the fixed-side connector 31 is prevented from moving to a side to be brought into contact with the sidewall of the fixed-side connector reception recess 22 after construction. Thus the generation of floor rasping noise caused by contact can be prevented.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010238367-A (JP)
Title: High-efficiency diamond electron gun
Inventor: UEDA AKIHIKO
IPC: H01J37/073
Filed: 2009-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electron gun capable of obtaining an electron beam with high luminance and high stability used for an electron beam and an electron beam apparatus or a vacuum tube, especially, electronic optical apparatuses such as an electron microscope and an electron beam drawing apparatus.  <P>SOLUTION: The electron gun is used for electronic optical apparatuses and its electron emitting portion is made of diamond, while solving the above problem, wherein a total amount of electron emitting current of the gun is 50 μA or less, a current of electron emission within a solid angle region of 0.0002 sr is 0.025% or more of the total amount of electron emitting current.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010234400-A (JP)
Title: Square wire conductor bending tool
Inventor: IKEMOTO MASAYUKI
IPC: H02K15/04
Filed: 2009-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a square wire conductor bending tool capable of suppressing the width of a bending part of a square wire conductor from becoming wide in the direction of a pair of sides, thereby eliminating the need of applying a correction process or the like to the square wire conductor.  <P>SOLUTION: The square wire conductor bending tool 1 has: a first tool part 2 provided with a first guide surface 21; and a second tool part 5 provided with a second guide surface 51. The first tool part 2 is provided with: an inside bending projection 3 which faces the inner side of the square wire conductor 8; and an outside facing projection 4 which faces the outer side of the square wire conductor 8. The second tool part 5 is relatively rotatable to the first tool part 2 centering around a corner part 31 which forms a bending starting point. The second tool part 5 is provided with an outside bending projection 6 which faces the outer side of the square wire conductor 8. In a process of performing bending, the first guide surface 21 constrains one side of a bending part of the square wire conductor 8, and the second guide surface 51 constrains the other side of the bending part of the square wiring conductor 8.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010238923-A (JP)
Title: Module with built-in electronic component
Inventor: TERASAKI SAYURI
IPC: H01L25/00
Filed: 2009-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a module with a built-in electronic component, capable of having sufficient mechanical strength and thermal strength in a portion where the electronic component is mounted, and thereby improving reliability and environment resistance of a product.  <P>SOLUTION: This module 1 with the built-in electronic component includes an opening portion 23 formed in a substrate 2A having the electronic component built-in, the rectangular or almost rectangular electronic component 4 contained in the opening portion 23, and passive components 81, 82 placed on the substrate 2A having the built-in electronic component built-in. The passive component 81 strides over a major axis or a minor axis passing through the center of the electronic component 4, and the bonded portion of the passive component 81 electrically bonded to the substrate 2A having the electronic component built-in is disposed outside the region of the opening portion 23.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010237485-A (JP)
Title: Method of manufacturing thin film transistor array, and display device
Inventor: OGAWA KENICHI
IPC: H01L21/288
Filed: 2009-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide: a thin film transistor array of which source electrode and drain electrode are manufactured uniformly and efficiently and which does not decrease the semiconductor property of a thin film transistor; and a method of manufacturing the thin film transistor array.  <P>SOLUTION: The method of manufacturing the thin film transistor array includes: a process to form a scan line 2 on a substrate 1: a process to form an insulating layer 2 on regions other than an opening 11 for external connection; a process to form at least the source electrode 4s and the drain electrode 4d by etching a coating type electrode material after coating and burning the material on the entire surface to form a coating electrode layer; a process to form a semiconductor layer 5 crossing the source electrode 4s and the drain electrode 4d; a process to form a sealing layer 6 to prevent it from forming on at least the scan line 2a exposing to the opening 11 for external connection; and a process to form a display electrode 8 by etching a display electrode layer 8 after forming it on the sealing layer 6. In this case, by etching at the time when forming the display electrode, the excess coating electrode layer left on the scan line 11 exposing to opening 11 for external connection is removed.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010235197-A (JP)
Title: Liquid container
Inventor: TAKETSUTSUMI TOSHINORI
IPC: B65D77/06
Filed: 2009-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid container having a packaging bag reliably filled with a predetermined amount of liquid.  <P>SOLUTION: The liquid container includes: an external container that is hollow inside and has an opening in an upper part thereof; and the packaging bag 10 with an outlet/inlet 11, which can be accommodated in the external container via the opening. The bag portion 12 of the packaging bag 10 has sheetlike first surface 13 and second surface 14, and the outlet/inlet 11 is joined to the upper sides 15 of these surfaces. In the initial state before the accommodation, the surfaces 13 and 14 of the bag portion 12 are slackened by a predetermined length L from base lines 13a and 14a parallel to the upper sides 15 of the surfaces and of the bag portion, respectively, thereby extending tongue portions 13b and 14b. Then, these tongue portions are folded downward. Thereafter, while maintaining these folded states, the bag portion 12 is accommodated inside the external container via the opening. Consequently, after the bag portion is accommodated in the container, the surfaces 13 and 14 of the tongue portions 13b and 14b naturally separate from each other and a space is left between them. This improves the percentage of the liquid filled in the external container.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010245808-A (JP)
Title: Independent type electronic apparatus, control program therefor and control method therefor
Inventor: HOSHIMURA YAYOI
IPC: H04N1/00
Filed: 2009-04-06
Abstract: <P>PROBLEM TO BE SOLVED: To automatically repeat a specific operation in an independent type electronic apparatus by the independent type electronic apparatus without using a client computer.  <P>SOLUTION: The independent type electronic apparatus includes: an operation means to receive an optional operation; a recording means that, after the predetermined recording start operation is received, records the history of a plurality of optional operations to be received until the timing when the predetermined recording end operation is received; and a repeating means that starts processing according to the history of operation when the predetermined repeating operation is received.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009170933-A (JP)
Title: Substrate holder, stack boat, semiconductor fabricating device, and method of fabricating semiconductor device
Inventor: SHIMADA TOMOHARU
IPC: H01L21/00
Filed: 2009-04-06
Abstract: <P>PROBLEM TO BE SOLVED: To stably hold a substrate holder in a boat and to improve uniformity of a heat treatment by reducing a temperature difference in a surface of a substrate to be treated.  <P>SOLUTION: The substrate holder 1 is supported by a boat pole of the stack boat, a support portion 2 of the substrate holder 1 is formed in a circular shape to mount a wafer 4; and an edge of the wafer 4 is supported on the support portion 2, which is made larger than the external diameter of the wafer 4 and made thin and linear at a portion which comes into contact with the boat pole of the support portion 2. A plurality of substrate holders 1 are provided to the boat pole such that top and reverse sides of the substrate holders 1 are opposed to each other at prescribed intervals.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009294200-A (JP)
Title: Differentiation method for tight junction function restoring agent
Inventor: KURASAWA MASUMI
IPC: C12N5/071
Filed: 2009-04-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a differentiation method for visually differentiating how a constituent restores the function of a damaged tight junction, the constituent being used for improving a skin barrier function lowered by incompleteness in a tight junction function.  <P>SOLUTION: A tight junction damaged-skin model made by damage-treating a tight junction of a skin or a culture skin three-dimensional model and tight junction function tracers are used to visually differentiate how the function of the tight junction is restored from a change in the distribution of tracers.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010246629-A (JP)
Title: Cooking utensil lid
Inventor: KOMATSU MITSUAKI
IPC: A47J36/06
Filed: 2009-04-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cooking utensil lid capable of preventing oil spray from scattering to outside, and capable of effectively discharging extra steam to outside.  <P>SOLUTION: The cooking utensil lid 1 includes a plurality of vents 11 in a dome-shaped lid body 10 which swells upward and whose lower end forms an opening 12, and a tongue piece 20 projecting inward into the lid body 10 from the lower edge 21 of each vent 11 is formed. The cooking utensil lid 1 is put on a cooking utensil for cooking. The lid body 10 is approximately hemispherically formed. The tongue piece 20 is horizontally provided, and configured to block the vent 11 as the lid body 10 is seen from the top and the bottom. The shape and size of the tongue piece 20 approximately match the shape and size of the vent 11, and the disposition and number of the tongue pieces 20 match the disposition and number of the vents 11.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010253685-A (JP)
Title: Inkjet recording head and method of manufacturing the same
Inventor: OSAMI TADANOBU
IPC: B41J2/05
Filed: 2009-04-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inkjet recording head having structure capable of easing peeling stress caused on a bonded surface between a substrate and a nozzle forming member due to swell of the nozzle forming member.  <P>SOLUTION: The inkjet recording head has rib-like protrusion structure just above an ink supply port on the inner surface of the nozzle forming member. In the rib-like protrusion structure, a groove is formed from the surface side of the nozzle forming member. By such constitution, the peeling stress caused by the swell of the ink forming member by ink or the like is eased to suppress peeling of the substrate and the nozzle forming member.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010253696-A (JP)
Title: Thermoplastic resin sheet for emboss transfer, thermoplastic resin embossed sheet and method for manufacturing thermoplastic resin embossed sheet
Inventor: FUNAKI AKIRA
IPC: B32B3/30
Filed: 2009-04-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin sheet for emboss transfer, which can manufacture a thermoplastic resin embossed sheet with high coefficient of transfer.  <P>SOLUTION: The thermoplastic resin sheet 11 for emboss transfer includes a laminar structure with the base material layer 11A of a thermoplastic resin and a transfer surface layer 11B to be laminated on the base material layer 11A. The transfer surface layer 11B is structured at least, with either a glass transition point (Tg) showing at least 1°C lower than the glass transition point (Tg) of the base material layer 11A or with the addition of an easy lubricative additive. The base material layer 11A has a glass transition point (Tg) of 50°C to 200°C. The thermoplastic resin embossed sheet 11 is manufactured by transferring an embossed pattern to the surface of a transfer layer 11B.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010255681-A (JP)
Title: Sealed vessel
Inventor: KOIDE TOORU
IPC: F16J15/00
Filed: 2009-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sealed vessel capable of excellently separating annular packing stuck to a door or a sealed vessel body, when opening the door of the sealed vessel.  <P>SOLUTION: A sterilizing device 1 in this embodiment includes a can body 2, a controller 19, a fluid line 20 for a packing groove, an inner can drain discharge line 40, an outer can drain discharge line 50, an inner can steam supply line 70 and an outer can stream supply line 80. The can body 2 includes an inner can 3, an outer can 4, a guide rail 8 and the door 18. An annular packing groove 10 is formed around the opening 7 of the can body 2, and annular packing 15 is stored in the annular packing groove 10. The controller 19 controls so as to successively execute first decompressing/processing for decompressing the inside of the annular packing groove 10, resting processing for stopping decompression in the annular packing groove 10 and second decompressing processing for decompressing the inside of the annular packing groove 10, at packing pulling-in time for pulling the annular packing 15 in the annular packing groove 10 before opening the door 18.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010256469-A (JP)
Title: Optical fiber cable
Inventor: TAKEDA DAIKI
IPC: G02B6/44
Filed: 2009-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical fiber cable in which collapse of an optical fiber is prevented and taking-out job of the optical fiber is excellent.  <P>SOLUTION: The optical fiber cable is provided with: a coated optical fiber 2; a buffer layer 4 disposed so as to cover the outer circumference of the coated optical fiber 2; a tension member 3 disposed in parallel to the coated optical fiber 2 covered by the buffer layer 4; and an outer coat 5 which covers the outer circumferences of the buffer layer 4 and the tension member 3. The adhesion strength between the outer coat 5 and the buffer layer 4 is larger than the adhesion strength between the buffer layer 4 and the outermost layer of the coated optical fiber 2. The buffer layer 4 has tensile module elasticity of 20 MPa to 400 MPa and thickness between the coated optical fiber 2 and the surface of 5 μm to 500 μm, and the outermost layer of the coated optical fiber 2 contains 0.5 wt.% to 20 wt.% skid, thus the adhesion strength between the outer coat 5 and the buffer layer 4 is larger than the adhesion strength between the buffer layer 4 and the outermost layer of the coated optical fiber 2.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010253730-A (JP)
Title: Heat dissipation material, printed board, and method for manufacturing printed board
Inventor: KAWAI CHIHIRO
IPC: B32B7/02
Filed: 2009-04-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat dissipation material with improved heat dissipation properties, a printed board, and a method for manufacturing the printed board.  <P>SOLUTION: The heat dissipation material includes an insulating substrate 11 and a heat dissipation layer 12. The insulating substrate 11 includes a surface 11a. The heat dissipation layer 12 is formed on the insulating substrate 11 and includes a first layer 16 having a graphene structure whose vertical direction to the surface 11a of the insulating substrate 11 is c axis and a second layer 17 whose lengthwise direction is oriented in a direction vertical to the surface 11a of the insulating substrate 11, having a nano-tube shape.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010256170-A (JP)
Title: Measurement unit and transportation system
Inventor: MATSUBA KATSUMI
IPC: G01N35/00
Filed: 2009-04-24
Abstract: <P>PROBLEM TO BE SOLVED: To add state data of a unit to measurement data even if environment data are measured by transporting the measurement unit by a carrying device lacking a communication means with the measurement unit, and to take out measurement data from the measurement unit even in the absence of a communication path capable of utilizing a measurement unit, such as a radio LAN.  <P>SOLUTION: The measurement unit mounts an environment sensor and can freely be transported by a transportation device, and also stores measurement data from the environment sensor while the measurement data are freely associated with the state of the measurement unit. Association for example allows measurement data to be associated with the state data of the measurement unit obtained from the transportation device, or the like by time data, or the like, and the association method itself is optional.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010255977-A (JP)
Title: Decompression type drying device of powder material, and decompression type drying method of powder material
Inventor: HANAOKA KAZUNARI
IPC: F26B21/12
Filed: 2009-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a decompression type drying device and a decompression type drying method for improving heating/drying efficiency of powder material and a cleaning property of a hopper.  <P>SOLUTION: The decompression type drying device 1 includes a heating gas introduction means 4 having an introduction gas heating part for introducing heated gas into the hopper 20 and a flow rate adjustment part for adjusting flow rate of the introduced gas, a control part 80 for controlling the heating gas introduction means, and a detection means 25 for detecting a predetermined control factor for indicating a state of heating/drying processing of the powder material m in the hopper 20. The control part decreases the gas flow rate while decompressing inside of the hopper, when a detected value of the detection means is larger than a predetermined threshold value set beforehand. The control part controls the flow rate adjustment part to increase the gas flow rate and controls the introduction gas heating part so that temperature of the gas introduced into the hopper is a predetermined temperature set beforehand, when the detected value is smaller than the threshold value.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009283933-A (JP)
Title: Ac light-emitting diode module, light source apparatus adapting it, and its production process
Inventor: CHOU HSI YAN
IPC: H01L33/00
Filed: 2009-05-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide an AC light-emitting diode module containing a substrate and two or more light emitting diodes.  <P>SOLUTION: The substrate includes two or more circular recessed grooves arranged in matrix on the surface thereof, and further the substrate has wire structure of a bridge rectifier circuit. Two or more electric connection points in the wire structure are installed inside the circular recessed grooves according to the matrix arrangement. Each light emitting diode is welded to the electric connection point of the wire structure, respectively to complete the connection of the bridge rectifier circuit. In this way, while receiving AC, the bridge rectifier circuit performs function of emitting light by changing AC into DC through the light emitting diode. Then, the purpose of reducing the number of manufacturing steps and raising a yield of product is achieved.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010263754-A (JP)
Title: Method and device for estimating state of power distribution system
Inventor: TSUBONE KOJI
IPC: H02J3/00
Filed: 2009-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To easily and precisely estimate a sate of a power distribution system.  <P>SOLUTION: In processing for estimating a power distribution system state, a processing unit 101 first calculates an evaluation value by creating a utilization rate of each node and an initial solution of a power factor, obtaining calculated values of a voltage, passing active power and passing reactive power, acquiring measured values from measurable nodes, and substituting each calculated value and each measured value into an objective function f(x) (S400), and then calculates the evaluation value from the objective function f(x) (S403) by creating 100 kinds of near loads (S401), and calculating the passing active power P, the passing reactive power Q, and a voltage drop V of each node (S402). The processing unit also stores the near load of the highest evaluation in a taboo list (S404). When the highest evaluation value is smaller than the evaluation value of the present optimal solution (S405:YES), it rewrites the present optimal solution with the near load of the highest evaluation (S406). When the searching number is not achieved (S407:NO), its processing is returned to S401, and when the searching number is achieved (S407:YES), its processing is completed.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010261278-A (JP)
Title: Guard fence
Inventor: NAKAMURA SACHIO
IPC: E01F7/04
Filed: 2009-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a guard fence which can prevent a support from being directly applied by an impact force and can absorb impact energy mainly by horizontal rope members.  <P>SOLUTION: In the guard fence where a plurality of supports 2, 2... are provided at predetermined intervals and support side horizontal rope members 3 are provided between the supports 2, 2..., mountain side horizontal rope members 5 are provided on the mountain side of the support side horizontal members 3, and a load transmission structure 7 is provided between the support side horizontal members 3 and the mountain side horizontal rope members 5 and between the supports 2, 2. The mountain side horizontal rope members 5 receive the impact force of a rock falling to the support 2, and the impact force received by the mountain side horizontal rope members 5 is distributed and absorbed into the support side horizontal members 3 and the support 2 by the load transmission structure 7, whereby impact force of a falling rock and the like is not directly applied to the support 2.  <P>COPYRIGHT: (C)2011,JPO&INPIT