baber/WOPTO huggingface dataset:
Patent JP-H06169368-A (JP)
Title: Facsimile equipment
Inventor: OANA MASAO
IPC: B41J3/60
Filed: 1992-11-30
Abstract: PURPOSE:To provide the facsimile equipment which provides both-surface printing by increasing the number of sheets printed per unit time. CONSTITUTION:This facsimile equipment consists of a paper feeding means 19 which feeds a form to the upstream side of a recording paper conveyance path 18 passing a printing part 20, a paper discharge part 6 which is connected to the downstream side of the recording paper conveyance path 18, a recording paper storage part 7 where recording paper discharged from the printing part 20 is temporarily stored, a paper refeeding means 35 which conveys the recording paper from the recording paper storage part 7 to the upstream side of the recording paper conveyance path 18 with the reverse side of the printed surface opposite the printing part 20, a page memory which stores received data in page units, a paper feeding control means which alternately performs the paper feeding operation by the paper feeding means 19 and the paper refeeding operation by the paper refeeding means 35 according to the number of pages of data stored in the page memory, and a data output control means which transfers data from the page memory to the printing part 20 corresponding to the paper feeding operation by the paper feeding means 19 and the paper refeeding operation by the paper refeeding means 35.
Patent JP-H09155550-A (JP)
Title: End crack preventing method in high speed one side submerged arc welding
Inventor: YUKIMURA MASAHARU
IPC: B23K9/18
Filed: 1995-12-08
Abstract: PROBLEM TO BE SOLVED: To prevent a weld joint part from end crack so as to form a good weld joint part. SOLUTION: Plates 63a, 63b to be welded are arranged in the same plane while butting each end face subjected to edge preparation. A rectangular tab plate 61 is arranged so as to be abutted to end faces of the plate 63a, 63b to be welded including an end part 65 in the longitudinal direction of the joint part. A pair of slits 62a, 62b are arranged at both sides of extended line of the joint in parallel with the extended line. In the tab, plate 61, retaining parts 61a, 61b for plate to be welded are tack-welded to the plate 63a, 63b to be welded respectively.  Further, the joint part is subjected to one side submerged welding with using three or four piece multi-electrodes under conditions of a wire diameter of a first electrode of 4.0 to 4.8mm, a wire diameter of a second electrode and thereafter of 4.8 to 6.4mm, a distance between a first and second electrodes of 20 to 70mm a distance between a second and third electrodes of 150 to 250mm and a welding speed of 90-200mm/min.
Patent JP-2000224925-A (JP)
Title: Article for raising plant
Inventor: INOUE MASAHIRO
IPC: A01N25/34
Filed: 1999-11-11
Abstract: PROBLEM TO BE SOLVED: To provide a plant-raising article for improving the growth of a plant. SOLUTION: This article for raising a plant is used in a pot 2 for raising the plant 1, and is obtained by forming a support 3 having an air-permeable property, arranging carbon members 4 formed from a carbon-containing material on the support 3 t a distance, and attaching copper 5 on the carbon members 4, respectively.
Patent JP-H11152314-A (JP)
Title: Ethylene/alpha-olefin copolymer for biaxially oriented film and biaxially oriented film made therefrom
Inventor: ICHIMURA KOJI
IPC: B29L7/00
Filed: 1997-11-21
Abstract: PROBLEM TO BE SOLVED: To produce a copolymer desirable in the production of biaxially oriented films having excellent stretchability, formability, and productivity and a low hot slip coefficient by producing an ethylene/α-olefin copolymer having specified characteristics values such as density by using a single-site catalyst. SOLUTION: The ethylene/α-olefin copolymer having a density of 0.880-0.950 g/cm<3> , a melt flow rate (at 190 deg.C under a load of 2.16 kg) (MFR2.16 ) of 5.0 g/10 min or below, a ratio, (MFR10.0 )/(MFR2.16 ), of 3.0-8.0 wherein (MFR10.0 ) is a melt flow rate (at 190 deg.C under a load of 10.0 kg), a molecular weight distribution (Mw/Mn) of 2.0-4.0, a standard deviation Σ of eluate amounts to elution temperatures of <=17 as obtained by a temperature raising elution fractionation(TREF), and having an at least bimodal differential elution curve obtained by TREF, is provided. It is desirable that the biaxially orientation temperature of this copolymer is above 85 deg.C to below 115 deg.C.
Patent JP-H01162595-A (JP)
Title: Aluminum alloy brazing filler metal for vacuum brazing
Inventor: TOMA KEN
IPC: B23K35/28
Filed: 1987-12-18
Abstract: PURPOSE:To fit a thick fin excellent in brazing property without polluting a furnace at brazing time by composing an Al-Si alloy brazing filler metal by specified component composition and structure. CONSTITUTION:The Al molten metal contg. 5.0-12.0% Si in wt.% is refined a crucible. The molten metal thereof is faced to the surface of a water colling roll made of copper rotated at specified speed provided at the lower part of the crucible, flowed out through the slit provided on the lower face of the crucible and by blowing by an inert gas the molten metal is rapidly cooled at specified solidifying speed. The brazing filler metal of Al-Si alloy of the eutectic structure composed of the fine particle of <=5mum is thus obtd. This brazing filler metal 2 is stuck on the surface of a tubular body 1, the fin stock 3 worked in a corrugated shape is tacked and the assembly body is adjusted. The brazing of the fin is performed by heating the assembly body at specified temp. in a vacuum furnace.
Patent JP-H02167144-A (JP)
Title: Ultrasonic diagnostic apparatus
Inventor: IIDA TAKETOSHI
IPC: G01N29/22
Filed: 1988-12-20
Abstract: PURPOSE:To detect the presence of the abnormality of leak voltage by inputting leak voltage from a common output terminal as the split leak voltage split by the first and second resistors corresponding to a pulser during the driving of a vibrator and comparing the same with a predetermined value. CONSTITUTION:If DC leak voltage is generated in receiving signal lines L1-Ln, positive polarity leak voltage subjects, for example, a resistor R1 and a diode D1a to ON-operation by a detection circuit 21, and other resistors R1 and diodes D1b-D1n become an inverse bias state with respect to the diode D1a. Even when the DC output impedances of respective pulsers 11b-11n are low, leak voltage is split by the first and second resistors R1, R2 without being affected by the DC output impedances of the pulsers 11b-11n to obtain split voltage of R1/(R1+R2). As a result, the leak voltage inputted to a comparator becomes extremely large and, therefore, said voltage can be easily compared with a predetermined value and the presence of the abnormality of leak voltage can be detected.
Patent JP-H08158522-A (JP)
Title: Connection structure for connection bar member in supporting frame of roof or the like and frame unit
Inventor: USUI ATSUSHIGE
IPC: E04B7/08
Filed: 1994-12-01
Abstract: PURPOSE: To surely connect plate-shaped joints by a method wherein when the plate-shaped joints on the opposite ends of a connection bar member are connected to adjacent plate-shaped joints of frame units, the plate-shaped joints on the opposite ends of the bar member, the joints being oriented perpendicularly to each other, are utilized to align the bar member with the frame unit. CONSTITUTION: One of plate-shaped joints 6 of a connection bar member 5 is superposed on one of plate-shaped joints 8 of an adjacent frame unit 2. And the joints 8, 6 are temporarily connected, leaving a clearance therebetween. Next, the other joint 6a of the member 5 is superposed on the plate-shaped joint 8a and the bar member 5 is slightly oscillated horizontally or oscillated vertically within the range of the clearance to stack the joint 6a on the joint 8a, following which the joints 8a, 6a are temporarily tightened to uniformize the clearances on the opposite ends and nuts 9, 10, 9a, 10a are tightened. Thus residual stress produced in the member 5 becomes almost negligible. As a result, desired strength, as a supporting frame, can be sufficiently obtained.
Patent JP-H01198578-A (JP)
Title: Prize winning ball device for pinball machine
Inventor: KUBODERA MASAO
IPC: A63F7/02
Filed: 1988-12-19
Abstract: PURPOSE:To prevent various troubles accompanying collisions of driven-in balls with the outer peripheral edge of a mounting base plate by forming slant portions of the outer peripheral edge of the mounting base plate at least on sides of said edge opposed to the dropped driven-in ball side except for mounting portions such that the more the slant portions are spaced from a game board, the more it is inclined inward of the mounting base plate. CONSTITUTION:In proper portions of the periphery of a mounting base plate 31 are bored holes 315 for mounting mounts to screw the mounting base plates 31 to a game board 12, and at least on portions of the outer peripheral edge of the mounting base plate 31 sides opposed to dropped driven-in balls except for the mounts are formed slant portions 800 such that the more the slant portions are spaced from the game board, the more the slant portions are inclined inward of the mounting base plate. Thus, the driven-in balls smoothly drop without colliding with the outer peripheral edge of mounting base plate. Further, since the slant portions are not formed on portions in which the mounts for fixedly mounting the mounting base plate on the surface of game board are formed, the strength for fixedly mounting the mounting base plate to the game board is not degraded.
Patent JP-2001144105-A (JP)
Title: Manufacturing method for semiconductor device
Inventor: NAKAMURA YASUNOBU
IPC: H01L29/812
Filed: 1999-11-11
Abstract: PROBLEM TO BE SOLVED: To reduce junction capacitance in an FET on a semiconductor substrate. SOLUTION: Implantation depth of N++ ion is formed shallower in a portion of a drain region 3A and a source region 3B in an N-channel junction field effect transsistor(JEFT), and a junction region is reduced between the gate and the drain and between the gate and the source. As a result, the capacitance in the p-n junction is reduced between the gate/drain and between the gate/ source. For the purpose of shallowing depth in a portion of N++ impurity on the gate region 9 side of the drain region 3A and the source region 3B, the thickness of Si3N4 films 2, 5 for reducing damage on ion implantation grows thicker locally, resulting in shallow ion implantation. For example, by forming the Si3N4 layers 3, 4 in two stages, the thickness of the Si3N4 films for protecting damage of ion implantation can grow thicker locally.
Patent JP-H03184736-A (JP)
Title: Exchange of tool in machine tool
Inventor: TANAKA TOSHIHIRO
IPC: B23Q3/155
Filed: 1989-12-11
Abstract: PURPOSE:To prevent the suspension of a work processing by automatically performing the replacement of a tool placed between a magazine and an arrangement station while delaying the call of the succeeding tool up to immediately before the processing completion of the tool under processing based on the processing time of each tool calculated in advance. CONSTITUTION:In case of the command of an NC control unit being a succeeding tool calling command, the work processing time T1 of the spindle tool fitted to a machine spindle 14 is read from the internal part of the NC control unit or the memory data of an external part device. The time capable of replacing is then calculated based on the read processing time T1 of the spindle. The number N capable of replacing the tools within a replacable time is then calculated. A replaceable number N of pieces is then decided, the succeeding tool calling process is shifted to by omitting the medium in case of N being <=1 and the tool necessary for replacement of a tool magazine 10 inside is decided in case of N being >=1. the shifting is executed by omitting the medium in case of there being no tool necessary for replacement and if any, transmission is performed to an ATC 12 and each driving devices of the indexing of the magazine 10 and the carrier and tool arrangement station 11 indexing, and the tools of the magazine 10 and station 11 are replaced.
Patent JP-H10163385-A (JP)
Title: Ic attaching/detaching device and its attaching/detaching head
Inventor: ARAKAWA ISAO
IPC: H05K13/04
Filed: 1996-12-02
Abstract: PROBLEM TO BE SOLVED: To improve the working efficiency of IC attaching/detaching work by making the complete exchange of an attaching/detaching head unnecessary even when the kind of the objective IC is changed. SOLUTION: A centering unit 27 has first and second centering jigs 48 and 49 with which socket holders 48b and 49b and recesses 48a and 49a for centering are integrally formed, respectively. The centering unit 27 is detachably attached to a head main body 63 so that the unit 27 can be exchanged to another centering unit 27 when the size of the objective IC is changed.
Patent JP-H10160794-A (JP)
Title: Ic-attaching/detaching device and its attaching/detaching head
Inventor: ARAKAWA ISAO
IPC: H05K13/04
Filed: 1996-12-02
Abstract: PROBLEM TO BE SOLVED: To eliminate the need for exchange of an attaching/detaching head due to the change in the size of an IC by detachably mounting a centering tool to an attaching/detaching head. SOLUTION: When an operation is initiated, a tray-carrying device 17 carries a tray 4 to a tray catch 15 and two substrates 1 are carried onto a substrate table 20. Then, an attaching/detaching head 25 is moved onto the substrate 1, sucks an IC 13 after testing, and carries it to a tentative-placement table 31. Then, it moves onto the tray 4, sucks the IC 13 before testing, connects it to an empty socket 1A, and carries the IC 13 on the same substrate 1 to the tray 4. This procedure is repeated. After the IC 13 before testing is connected 16 all sockets 1A of the substrate 1, the IC 13 is exchanged with the IC 13 before testing after the testing of the next substrate 1 by inverting the substrate table 20.  In this case, when the size of the IC 13 is changed, the attaching/detaching head 25 moves onto a centering tool stocker 28 since the centering tool 27 is detachably mounted to the attaching/detaching head 25 and the centering tool 27 is exchanged automatically to cope with the size of the IC 13.
Patent JP-H06167139-A (JP)
Title: Earthquake isolating device
Inventor: NISHIMURA ISAO
IPC: E04B1/36
Filed: 1992-12-01
Abstract: PURPOSE:To increase the period of an upper structure supported by a lamination rubber bearing and to ensure high load support capacity. CONSTITUTION:An earthquake isolating device comprises upper and lower flanges 2 and 3: a peripheral part lamination rubber 4 in a hollow shape in cross section arranged between the upper and lower flanges 3 and 2: and a central part lamination rubber 5 in a solid shape in cross section arranged at the central part of the peripheral lamination rubber 4. Since the peripheral part lamination rubber 4 to support an upper structure 6 is hollow, horizontal rigidity is low and the period of the upper structure 6 can be increased. By previously axially exerting a tensile force on the central part lamination rubber 5, instability of the peripheral part lamination rubber 4 occurring when a vertical load is high is prevented from occurring and high vertical load support capacity is ensured.
Patent JP-H06177562-A (JP)
Title: Printed board device and distant-monitor and control device
Inventor: NAKAYAMA KATSUYOSHI
IPC: H05K5/02
Filed: 1992-12-01
Abstract: PURPOSE:To enable a cylindrical case where square printed boards are arranged to be enhanced in mounting efficiency and improved in airtightness retaining properties. CONSTITUTION:Printed boards 4 and 5 mounted inside a cylindrical case 1 are arranged non-parallel with each other, each printed board is demarcated into parts basing their electrical functions, and component parts are made to be located on the outer side of the printed board. The cylindrical case 1 is screwed down to a floor plate outside an O ring 9, and an O ring guide is provided inside the O ring 9. By this setup, printed boards are arranged not in parallel with each other and components are mounted on the outer surface of the board, so that a device of this design can be enhanced in mounting efficiency, noise-resistant properties, maintainability, antivibration properties, and cooling effect, lessened in number of component parts, shortened in an assembly and wiring process, and improved in airtightness and simplified in floor plate structure due to that a cylindrical case is screwed down to a floor plate outside an O ring.
Patent JP-H07232305-A (JP)
Title: Moisture-resistant composite plate
Inventor: NOMURA YUKIO
IPC: B32B21/06
Filed: 1994-12-26
Abstract: PURPOSE:To improve a moisture resistance of a composite plate used for a wall material, a surface material for furniture or a door, an external wall material, or a water-related shelf board and further used for a building material, a fixture material, and the like to be folded for use. CONSTITUTION:A three-layer sheet 3 formed by fusing paper 31 to both surfaces of a thermoplastic resin sheet 32 is attached to each surface of a wood-based substrate 2, such as a fibreboard, a particle board, or a plywood. In this manner, the thermoplastic resin sheet 32 fused between the two sheets of paper 31, 31 interrupts water or moisture from the external and imparts a moisture resistance. At the same time, the paper 31 easily adheres to the wood-based substrate 2 and also to another member in the application for manufacturing furniture or the like.
Patent JP-H01163346-A (JP)
Title: Sheathing board and mounting frame
Inventor: MORIYAMA HIDEHIKO
IPC: E04D3/36
Filed: 1987-12-18
Abstract: PURPOSE: To simplify the fitting execution of an exterior board by providing fitting tools having press sections pressing the inside upper sections of recesses of the exterior board at prescribed intervals on a grade applying base by forming a fitting frame for fitting the exterior board to a structural member. CONSTITUTION: An exterior board 3 provided with ridge sections 4, each having arc-like bulge sections 5 on the right and left of an apex and arc-like constricted recesses 6 continued to the bulge sections 5, is fitted to the structural member 7 of a building 1 via a fitting frame 10. A plurality of fitting tools 20, having press sections 23 pressing the inside upper sections of the recesses 6 of the exterior board 3, are provided at prescribed intervals on a grade applying base 30 to form the fitting frame 10. The exterior board 3 can be easily fitted with the prescribed fitting grade.
Patent JP-H11144516-A (JP)
Title: Globe mounting device
Inventor: SAIJO ATSUHIRO
IPC: F21V17/00
Filed: 1997-11-05
Abstract: PROBLEM TO BE SOLVED: To provide a globe mounting device whose productivity can be enhanced. SOLUTION: In a device for mounting a globe 2 made of a synthetic resin on the lower surface of a metallic circular body 1, a downwardly curved piece 3 is formed on the edge of the body 1, and inwardly projecting parts 4 are formed at plural portions of the curved piece 3. The projecting parts 4 are each in the form of a metal pin, secured to the curved piece 3 by caulking. Locked parts 5 integrally outwardly extended and locked to the projecting parts 4 are formed at plural portions of the edge of a circular opening in the globe 2, and a plurality of protrusions 6, 7 over which the projecting parts 4 can pass while being resisted when moving back and forth relative to the locked parts 5 are formed at one end of each locked part 5 at intervals, while a stopper 8 preventing the entrance of the projecting parts 4 is formed at the other end of each locked part 5.  The globe 2 can be integrally molded by pressure-vacuum molding while including the locked parts 5, the protrusions 6, 7, and the stopper 8 in addition to its principal parts.
Patent JP-H08174693-A (JP)
Title: Method and apparatus for manufacturing hook-and-loop fastener
Inventor: MURAZAKI RYUICHI
IPC: B29C48/30
Filed: 1994-12-26
Abstract: PURPOSE: To develop a method and an apparatus for manufacturing a hook-and- loop fastener of high quality by obtaining productivity and incorporating uniform states in both a base sheet and an engaging element. CONSTITUTION: Molten resin is extruded from an extrusion nozzle 1 by a predetermined width to extrude the resin toward the periphery of a die wheel 2 rotating in one direction, thereby integral molding a flat platelike base sheet 4a made of the resin with an engaging element on the surface of the wheel 2. In this case, quasi-engaging elements are molded at both right and left side edges of the sheet 4a together with the elements. When a moldings hook-and- loop fastener 10 is separated from the wheel 2 the tensile force can be operated uniformly in the lateral direction of the sheet 4a due to the presence of the quasi-engaging elements, thereby obtaining the fastener of high quality.
Patent JP-H06143146-A (JP)
Title: Cutting processing method for rigid brittle material
Inventor: NOZAKI SHIGERU
IPC: B23P17/00
Filed: 1992-11-09
Abstract: PURPOSE:To prevent the occurrence of rupture of the surface of a work and cavitation damage of the back thereof by a method wherein a pressure at which piercing is effected is reduced to a value lower than a pressure during cutting when the piercing is made on a starting point except a peripheral edge part. CONSTITUTION:Piercing is carried out from the stop state of the jet 3 of an abrasive water jet through a nozzle unit 2' by opening and closing a valve for ON/OFF through a nozzle side switching system. During the piercing work, the valve for ON/OFF is opened, and a pressure reducing valve is in a closed state. Compared with a high pressure during cutting, a pressure is low, namely, the jet 3 is injected at a pressure low enough to prevent the occurrent of rupture 4 to the surface side of a work 1 and the occurrence of a cavitation damage 5 to the back thereof and desired piercing is executed. After the piercing is completed, the valve for ON/OFF and the pressure reducing valve are brought into a closed state to stop injection of the jet 3 once. After a lapse of a given time DELTAt, cutting ix executed such that the valve the ON/OFF and the pressure reducing valve are brought into an opened state to operatie the nozzle unit 2.
Patent JP-H11139100-A (JP)
Title: Cultural assets preservation method
Inventor: KITAMURA AKIRA
IPC: B44D7/00
Filed: 1997-11-06
Abstract: PROBLEM TO BE SOLVED: To provide a cultural assets preservation method by which a preservation/storage is easy, and in addition, an analysis-investigation is possible later. SOLUTION: After affixing of a transparent film 13 having an adhesive on a colored picture 12 painted on the surface of a carrier 11, the film 13 is peeled, and thus, the colored picture 12 is transferred to the film 13 from the carrier 11. Then, on the colored picture adhered surface, a second film is affixed, and a laminated film where the colored picture 12 is pinched, is made. Also, after the colored picture 12 is transferred to the film 13, and before the second film is affixed, a transparent resin liquid for fixation such as a water-soluble acrylic emulsion may be applied or sprayed to increase the preservation property of the colored picture 12.