baber/WOPTO huggingface dataset:
Patent TW-355805-B (TW)
Title: Multilayer capacitor
Inventor: NAITO YASUYUKI
IPC: H05K3/34
Filed: 1998-03-11
Granted: 1999-04-11
Abstract: A multilayer capacitor whose equivalent series inductance is reduced includes a capacitor main body having a generally rectangular parallelpiped shape with two principal surfaces in a face-to-face relationship with each other and four side surfaces connecting the principal surfaces; a capacitor unit is formed in the capacitor main body by a respective pair of first and second internal electrodes disposed in the main body in a face-to-face relationship with a dielectric material layer interposed therebetween; at least three first external electrodes are located on respective ones of the side surfaces of the capacitor main body, with at least one of the first external electrodes being located on each of at least three of the side surfaces; the first internal electrode has at least three first lead electrodes, each of which extends to and is electrically coupled to a respective one of the first external electrodes; a plurality of second external electrodes are located on respective side surfaces of the capacitor main body and the second internal electrode has an equal plurality of second lead electrodes, each extending to and being electrically coupled to a respective one of the second external electrodes.
Patent TW-434053-B (TW)
Title: Assembly for insertion of a draw line a conduit
Inventor: CASELLA DAVID WAYNE
IPC: H02G1/08
Filed: 1998-04-17
Granted: 2001-05-16
Abstract: An assembly for providing air assisted insertion of a draw line such as a string line or the like through a conduit or network of conduits; the assembly comprising; a pneumatic gun including a housing having an internal chamber with an entrance and an exit, a handle attached to or integral with said housing and having a bore therethrough in communication with said internal chamber, and at an entrance to said bore means to facilitate receipt of pressurised air from a pressurised air source; a spool unit integrally or detachably connected directly or indirectly to said pneumatic gun and which receives and retains therein a line spool or cartridge, said spool unit including a chamber which terminates in an opening in communication with the internal chamber of said pneumatic gun and through which a line on said line spool travels; wherein, upon actuation of a trigger on the pneumatic gun, pressurised air from the air source urges the draw line through the gun and upon exiting said internal chamber into the conduit or network of conduits.
Patent TW-513442-B (TW)
Title: Olefinic polymer
Inventor: TATSUMI TOMIO
IPC: C08F10/06
Filed: 1998-06-04
Granted: 2002-12-11
Abstract: Long-chain, branched, propylene-based polymers, of which the melt index and the molecular weight distribution and the melt tension and the limiting viscosity both satisfy specific requirements, have good physical properties that are comparable to or better than those of conventional propylene-based polymers. They have good melt workability and are favorable to large-size blow molding and extrusion foaming. They are favorably used as miscibility improvers for propylene homopolymers and propylene-based copolymers.
Patent TW-357094-B (TW)
Title: Multi-purpose safe and automatic vein serum needle
Inventor: LIU WEN-NENG
IPC: A61M5/32
Filed: 1998-06-12
Granted: 1999-05-01
Abstract: A sort of multi-purpose safe and automatic vein serum needle, including: a universal connector, having the tube body, for forming the hollowed first connector on the upper section of the hollowed tube, which has the lower section for forming the hollowed second connector, having the first, second connector being aligned along the center axial line of the tube and the end of the second connector have a rubber cap, the first connector and the second connector of the tube body protruding beyond the third connector, for connection with the connector of the serum tube; soft needle, having a seat of which the bottom recess has a cavity for engagement on the first connector of the universal connector, and the top end of the needle seat be connected to the soft needle; and steel needle, having the seat, and inserted slidingly into the sleeve, of which the top is engaged into the second connector of the universal connector and the top of the seat axially protruding on top of the rubber cap, having the stud piercing the air vent and n top of the protruding post longitudinally connecting the needle upward, and having the air vent and the needle central hole in connection, sliding the needle operationally into the soft nail of the soft needle, and the seat having a latch, for operational sliding for contact with the latch of the sleeve, for full withdrawal of the needle from the soft needle and being incorporated firmely in the sleeve, for connection of the connector of the serum to the third connector of the universal connector, for feeding medicament liquid through the needle into the body of the patient.
Patent TW-473550-B (TW)
Title: Zirconium niobium tin alloys for nuclear fuel rods and structural parts for high burnup
Inventor: VAN SWAM LEONARD F P DR
IPC: C22C16/00
Filed: 1998-08-20
Granted: 2002-01-21
Abstract: Zirconium alloys for use in an aqueous environment subject to high fluence of a water reactor and characterized by improved corrosion resistance, consisting essentially of from 0.5 to 3.25 weight percent niobium, from 0.3 to 1.8 weight percent tin, the balance of alloys being essentially nuclear grade zirconium with incidental impurities and having a microstructure of beta niobium second phase precipitates distributed uniformly intragranularly and intergranularly to form radiation resistant second phase precipitates in the alloy matrix.
Patent TW-463220-B (TW)
Title: Automatic clean trap apparatus
Inventor: SHIE TZU-SHENG
IPC: H01L21/00
Filed: 1998-09-03
Granted: 2001-11-11
Abstract: This invention provides an automatic clean trap apparatus to remove deposits from reactants. Two branch pipes are connected to the pump to receive the reactants and equipped with trap devices to separate the deposits, and automatic cleaner to perform corresponding clean function is designed. While a trap device is operating, another trap device performs clean function with in-situ closing of the branch pipe and supplying clean liquid. The invented apparatus is capable of cleaning in automatic control mode without the need to stop operation for disassembly and cleaning to prevent the occurrence of over-deposition situation necessary to be handled, and also to reduce manpower.
Patent TW-396466-B (TW)
Title: Semiconductor device and wire bonding method
Inventor: NISHIURA SHINICHI
IPC: H01L21/60
Filed: 1998-09-29
Granted: 2000-07-01
Abstract: The object of the present invention is to achieve a stable and a high shape-keeping wire loop pattern. To achieve the object, a wire loop pattern is obtained by wire connection between the first bonding point A and the second bonding point G, which is constituted of a neck height part 31. Height part 31 extends vertically from the first bonding point A. The first lateral wire part 35 extends from the neck height part 31 by a tilted way, with the front side higher than the back in transverse direction. The second lateral wire part 36 extends horizontally from the first lateral wire part 35. The third lateral wire part 37 extends from the second lateral wire part 36 by a tilted so that front side is higher than the back in transverse direction. An inclined part 38 extends to the second bonding part G from the third lateral wire part 37.
Patent TW-406387-B (TW)
Title: The manufacture method of dual damascene
Inventor: LIAU KUAN-YANG
IPC: H01L23/50
Filed: 1998-10-13
Granted: 2000-09-21
Abstract: A manufacture method of dual damascene providing a semiconductor substrate and depositing a dielectric player on the substrate; then form the trench and via opening on the dielectric layers. Then, form a conformal barrier layer; then, form the metal layer to cover the barrier layer, and fill up the trench and the via opening. Next, remove part of the metal layer until the surface of the barrier layer is exposed so that the metal layer in the trench is slightly lower than the barrier layer. Form the cap layer to cover the barrier layer, and fill up the trench. Remove part of the cap layer and part of the barrier layer until the surface of the dielectrics is exposed.
Patent TW-396494-B (TW)
Title: Vertical processing unit
Inventor: WU SHENG-HAU
IPC: H01L21/22
Filed: 1998-10-27
Granted: 2000-07-01
Abstract: A vertical processing unit 10 for semiconductor wafers has; a cylindrical processing chamber 2 having an opening 18 in an inside of an annular bottom surface, and a disk-shaped cap 6 having an annular abutting-surface 32 abutting on the annular bottom surface of the chamber. A mounting- surface 6p formed on the inside of the annular abutting-surface 32. A wafer-boat 8 for holding a wafer W to be processed is mounted on the mounting-surface 6p of the cap 6. The abutting-surface 32 has an annular groove 34A formed therein. An inert gas supply passageway 38 is provided in communication with the annular groove 34A for supplying an inert gas into the annular groove 34A through a header 16. An ejection opening 36 for ejecting an inert gas is provided on the inner side of the annular groove 34A for communicating the annular groove 34A and the interior of the processing chamber 2. Owing to the active leaking of the nitrogen (N2) gas into the interior of the processing chamber 2 through the ejection opening 36, the corrosive gas as a processing gas in the processing chamber 2 does not leak out, so that corrosion or rusting of the equipment around the processing chamber 2 is prevented.
Patent TW-463028-B (TW)
Title: Working robot for heat exchangers and operating method thereof
Inventor: KOMADA SHUJI
IPC: B62D57/02
Filed: 1999-04-12
Granted: 2001-11-11
Abstract: A robot body (21) is carried into the water chamber (2A) of a condenser (1) and disposed on a tube sheet (4) through which a number of narrow tubes open. Inner nozzles (23) are inserted into narrow tubes (3) from working devices (24) installed on the front ends of four combined-use arms (22A through 22D) to position and fix the robot body (21). And the arm turning motors (25) and arm extending and contracting cylinder devices (26) of the combined-use arms (22A through 22D) are driven to move the robot body (21). Further, a cleaning brush (12) and a flaw detection probe (13) are inserted into a narrow tube (3) from each working device (24) and moved along the narrow tube (3) by means of cleaning water, whereby cleaning and inspection are performed. With three of the combined-use arms (22A through 22D) fixed to the narrow tubes (3), the inner nozzle (23) is extracted from the narrow tube (3) and the working device is moved to the next narrow tube (3).
Patent TW-421809-B (TW)
Title: Composite operation type electrical part
Inventor: MIZOBUCHI SHINICHI
IPC: H01H25/06
Filed: 1999-04-27
Granted: 2001-02-11
Abstract: In addition to a first rotary electric part D4, the conventional composite operation type electrical part requires a click mechanism K formed by two shells 61 and 64, a click member 63, and a rotating body 62. The number of parts is large, and thus the manufacturing cost is high and production yield is low. Further, the axial dimension is large. To eliminate the problem, the composite operation type electrical part in accordance with the present invention has a click member 11 arranged between an insulating base 9 used as a part to form a first rotary electric part D1 and a second rotating member 12 used as a part to form a second rotary electric part D2. Therefore, the axial dimension can be decreased and a miniaturized composite operation type electrical part can be provided.
Patent TW-440526-B (TW)
Title: Method of cutting an elastomeric component, tire component, and tire
Inventor: BENZING JAMES ALFRED II
IPC: B29C65/00
Filed: 1999-08-18
Granted: 2001-06-16
Abstract: A tread (10) has a first end (12) that is cut at an angle θ. The surface created by the cutting of the tread (10) is the splice surface (20). The surface created by the cutting of the tread (10) is called the splice surface (20) of the first end (12). The tread (10) has a tread thickness TT. The angle at which the tread (10) was cut is called the splice angle θ. Expressed algebraically, θ equals: SL= (TT)/(cosine θ). The application of the invention is especially helpful in tires having thinner treads such as are commonly used in high performance tires where tread thicknesses can be as small as 1 cm (0.25 inches). The preferred embodiment of the invention is a tread with θ equal to 82 DEG.
Patent TW-I239461-B (TW)
Title: Method and system for managing collaboration within and between enterprises
Inventor: NOTANI RANJIT N
IPC: G06Q10/06
Filed: 1999-06-03
Granted: 2005-09-11
Abstract: A computer implemented process for enterprise collaboration is provided. The process includes storing a set of predefined functions for a work flow to be performed at a plurality of distributed nodes. The process automatically interacts with the work flow at each of the distributed nodes to perform the predefined functions.
Patent TW-429209-B (TW)
Title: Method for forming rubber
Inventor: JIANG LING-JU
IPC: B29C39/00
Filed: 1999-07-06
Granted: 2001-04-11
Abstract: Disclosed is a method for forming rubber, comprising placing rubber materials into a melting chamber of an teeming machine to melt the rubber into a molten state, filling the molten rubber into mold cavity, and then hot pressing to form. Therefore, different amount of material can be put into different location of the mold cavity so as to not only conserve time and enhance precision but also obtain a consistent product. If a mold having mold cavities of different dimensions and configurations or different operator is replaced, consistent products can also be obtained only by adjusting the settings so as to greatly improve production efficiency.
Patent TW-592698-B (TW)
Title: Remedy with antidepressant effects
Inventor: MAJ JERZY
IPC: A61K31/425
Filed: 1999-07-06
Granted: 2004-06-21
Abstract: The present invention relates to the use of 2-amino-4,5,6,7-tetrahydro-6-propylamino-benzothiazole (pramipexole), the (-)- enantiomer thereof or one of the pharmacologically acceptable salts thereof in conjunction with sertraline for the improved treatment of depression and depressive states.
Patent TW-442981-B (TW)
Title: Method for manufacturing a semiconductor light emitting element
Inventor: TSUTSUI TSUYOSHI
IPC: H01L21/28
Filed: 1999-07-30
Granted: 2001-06-23
Abstract: The present invention provides a method for manufacturing semiconductor light emitting device, wherein the heat treatment for activating the p-type layer of the laminated semiconductor layers comprising gallium nitride based compound semiconductor can be performed in a short time, and moreover can be used to reliably perform activation. The method is to have a gallium nitride based compound semiconductor layers which include at least an n-type layer 3 and p-type layer 5 on a substrate 1, and which are laminated to form a light emitting layer, and when the heat treatment is performed for activation of the p-type layer 5 of the laminated semiconductor layers, it is characterized that the heat treatment is performed under an atmosphere including oxygen.
Patent TW-429452-B (TW)
Title: A method to make semiconductor gate
Inventor: TAU HUNG-YUAN
IPC: H01L21/28
Filed: 1999-10-28
Granted: 2001-04-11
Abstract: This invention is a method to define a semiconductor gate electrode layer without using a patterned mask. First a doped polysilicon layer is formed on a semiconductor substrate, then a silicon nitro-oxide layer and a silicon dioxide layer are deposited. Then a patterned photoresist layer is deposited on the dielectric layer. The photoresist layer can be dry etched and reconditioned for a reduced line width and roughness. Then, the patterned photoresist layer is used as a mask to etch the two dielectric layers and then the remaining photoresist layer is removed using dry and wet etching. The etched silicon dioxide and silicon nitro-oxide layer are used as a hard mask for etching the doped polysilicon layer using hydrogen bromide as the reactive gas. The polymer and remained dielectric layer are removed after etching, then the successive gate processes, such as forming spacer, metal silicide, doping source/drain and so on, can be proceeded. Using the dielectric layer as the hard mask for etching gate electrode layer cannot only achieve etching with even smaller line width, but also the reliability of the process can be effectively increased.
Patent TW-429624-B (TW)
Title: The multiple microlens photodetector
Inventor: PAN RUEI-SHIANG
IPC: H01L27/14
Filed: 1999-11-16
Granted: 2001-04-11
Abstract: The present invention provides a multiple microlens photodetector which includes at least two microlenses on top of the reactive region which absorbs photon to generate electron-hole pairs. The same as the traditional photodetector, the first microlens is located above the color filter layer. The second microlens is located between the color filter layer and the reactive region. In addition, the second microlens is a concave lens and is formed by combining the transparent layer/passivation layer/transparent layer, wherein the concave-lens-like structure can be formed by adjusting the shape of the passivation layer on the reactive region. Therefore, the projection region above the reactive region can be maximized by adjusting two microlenses to improve the disadvantage that it is difficult to control the focal length of the traditional photodetector.
Patent TW-457807-B (TW)
Title: Scanner with multiple reference marks
Inventor: DOWEY JACKLYN M
IPC: G06K9/32
Filed: 2000-01-12
Granted: 2001-10-01
Abstract: A document (11) to be scanned is corner referenced on a transparent platen (12), with the document's image facing down. The platen defines an X-Y coordinate system. A moving line of light (24) extends in the X direction and illuminates the document's image, line by line, as the line of light moves in the Y direction. The line of light that is thus reflected from the document is sensed by a linear CCD sensor array (27) having a large number of individual sensor cells (28) arranged in a line that extends in the X direction and coincides with the line of light. Multiple reference marks embodied in one or more reflection targets (54, 68) are located at a known position relative to the platen and/or its document referencing corner (58), to be scanned prior to scanning the document. Sensing of the reference marks enables (1) the X direction physical position of the CCD sensor array relative to the referencing corner to be accurately determined, (2) the Y direction physical position of the line of light relative to the referencing corner to be accurately determined, and (3) the platen's orientation with respect to the CCD array and line of light to be accurately determined. A determination of the platen's orientation can include a determination of the platen's skew with respect to the CCD array and line of light, as well as a determination of the platen's orthogonality with respect to the direction of travel of a carriage (15) which supports the CCD array and line of light.
Patent TW-432496-B (TW)
Title: Method of fabricating self-align-contact
Inventor: KUO CHIEN-LI
IPC: H01L21/22
Filed: 2000-01-21
Granted: 2001-05-01
Abstract: The present invention provides a method of fabricating a self-align-contact on a semiconductor chip. The surface of the semiconductor chip comprises a substrate, two adjacent gates on a predetermined region on the surface of the substrate, a doped region on the substrate between the two gates; and a plurality of spacers with a shape of thin top and thick bottom on the periphery of the sidewalls of the two gates. The method according to the present invention comprises performing a plasma enhanced chemical vapor phase deposition (PECVD) with 200 to 300 mTorr pressure and 50 to 100 W to form a protective layer with a shape of thick top and thin bottom covering the two gates and the surface of each spacer; forming a dielectric layer on the protective layer, and using a self-align-contact etching process to form a contact in the dielectric layer through the dielectric layer until the surface of the doped region, thereby completing the production of the self-align-contact.
Patent TW-444416-B (TW)
Title: Photo-detector device and the fabrication method thereof
Inventor: LIN MING-DE
IPC: H01L33/00
Filed: 2000-01-29
Granted: 2001-07-01
Abstract: The present invention relates to a photo-detector device and the fabrication method thereof, especially to a photo-detector device using the planar light emitting diode as the light emitter, wherein the photo-emitter is directly fixed on the front surface of the envelop in which a photo-receiver is wrapped by using the characteristic that both of the positive and negative electrodes of the planar light emitting diode are located on the same plane, and its fixed position is located at the longitudinal extension position of the photo-receiver. When the light emitter emits light, the light emitted from its light source on the back can transmit through the substrate and the envelop and is absorbed directly by the front face of the photo-receiver, thereby executing the functions set afterwards. Therefore, it not only can avoid the disadvantage in that the connecting wires may be contacted mutually by mistake and be damaged, but also can increase the effective light receiving area of the photo-receiver to execute its function rapidly and correctly.
Patent TW-451436-B (TW)
Title: Manufacturing method for wafer-scale semiconductor packaging structure
Inventor: LI JIUN-JE
IPC: H01L21/56
Filed: 2000-02-21
Granted: 2001-08-21
Abstract: A manufacturing method for wafer-scale semiconductor packaging structure includes the following steps: allocating a wafer on the top surface of a retractable film; dicing the wafer into a plurality of dies, each having a plurality of raised electrodes; extending the retractable film to keep a predetermined interval between each diced die; encapsulating each diced die so that the encapsulating plastic can completely cover the raised electrodes on each die and the edges of each die; polishing the encapsulated dies to expose the raised electrodes from the encapsulating plastic; and, dicing the encapsulated die into separated semiconductor packaging structure unit. The present invention can make the wafer-scale semiconductor packaging structure in mass production to reduce the manufacturing cost of wafer-scale semiconductor packaging structure. Moreover, the wafer-scale semiconductor packaging structure has better water isolation effect to prevent the damage to semiconductor chip.
Patent TW-445604-B (TW)
Title: Micro thin film packaging for semiconductor
Inventor: SHIE WEN-LE
IPC: H01L23/28
Filed: 2000-02-29
Granted: 2001-07-11
Abstract: The present invention relates to a micro thin film packaging for semiconductor which is to bond the die on a substrate; and, connecting with the wire bonds with the die through the bumps on the substrate surface; molding with synthetic resin; and, conducting etching process to remove the substrate to leave a micro thin film packaging in extra-thin packaging dimension. By the inventive processing, it can eliminate the limitation for using the leadframe specification from a specific manufacturer and further reducing the processing time, and also obtaining a thinner packaging thickness.