Patent MX-2014010010-A (MX)
Title: Method for carrying out solder connections in a technologically optimized manner.
Inventor: JENRICH ANDRÉ
IPC: B23K1/00
Filed: 2013-02-21
Abstract: The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners. The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners. The invention relates to a high current contact (2, 5, 20) for a switching device (1) in particular for high current technology. The high current contact has a contact location (6, 7, 21) and an arc base trap (16) which is located at least at one side (S) of the contact location. The arc base trap comprises a projection (22) which extends away from the contact location (6, 7, 21) and which tapers in the direction away from the contact location (6, 7, 21). The invention further relates to a switching device (1) having such a high current contact as a fixed contact (2) or switch contact (5). Owing to the tapering projection, a switching arc (13) is fixed at the arc base trap. The high current contact is preferably a flat punched component. The projection tapers in the direction of a Lorentz force (F), which acts on the switching arc and which is produced by an extinguishing magnet arrangement (9), and preferably has a tip (24).