baber/WOPTO huggingface dataset:
Patent TW-200502857-A (TW)
Title: Operation method of portable computer's warning capability
Inventor: LEE RONG-JUNG
IPC: H04L9/00
Filed: 2003-07-10
Abstract: An operation method of portable computer's warning capability. This invention employs one element or one capability to be the key, which of the external device or the portable computer, and then to make the embedded controller to get know that if the portable computer's is closed. When the embedded controller gets know that the portable computer's is closed, the embedded controller will enable the prevention external invasion system. Moreover, if the embedded controller had got know the invasion of external or attempt, it will enable the warning capability and to proceed the correlation steps. Therefore, this invention can make the portable computer to have the warning capability to achieve the secrecy purpose of the portable computer.
Patent TW-200504317-A (TW)
Title: A way for producing a light stove made by soil
Inventor: HSIAO JEN-TE
Filed: 2003-07-28
Abstract: This invention relates to a way for producing a light stove made by soil. A light stove is made of foamed calcium carbonate powder containing air. A stove is light because of using formed calcium carbonate reducing weight and enlarging volume of aforementioned stove.
Patent TW-200413833-A (TW)
Title: Digital camera
Inventor: ENOMOTO SHIGEO
IPC: G03B7/08
Filed: 2003-08-20
Abstract: A digital camera comprises a solid state imaging device provided with an optical low-pass filter. A photographing optical system forms an object image on a light receiving surface of a CCD through the optical low-pass filter. An electronic-charge accumulation-time control program is stored in a ROM of a system control circuit to determine optimum exposure parameters according to which a photography is performed. The electronic-charge accumulation-time control program has a program diagram showing a relationship between an electronic-charge accumulation-time and an aperture value and/or an ISO speed.
Patent TW-200405497-A (TW)
Title: Method for making a circuit device
Inventor: IGARASHI YUSUKE
IPC: H01L23/50
Filed: 2003-09-03
Abstract: A laminated substrate (10) contains a first conductive film (11), a second conductive film (12) and a third conductive film (13) in between the first conductive film (11) and the second conductive film (12). A conductive pattern layer (11A) is formed by etching the first conductive film (11). The third conductive film (13) is over-etched by using the conductive pattern (11A) as a mask, to form an anchor portion (15), where a packaging resin layer (22) is hooked so that the bonding between the packaging resin layer (22) and the conductive pattern layer (11A) is enhanced.
Patent TW-200512111-A (TW)
Title: Manufacturing device for a filter for use of an air bag and manufacturing method therefor
Inventor: HUANG CHENG-I
IPC: B60R21/16
Filed: 2003-09-30
Abstract: A manufacturing device for a filter for use of an air bag comprises a wire-shaping machine, a 2-D wire-winding machine, and a wire-pressing machine. The wire-shaping machine has a first guiding member for guiding a wire, a shaping gear for zigzagging the wire, and a second guiding member for transporting the zigzagged wire. The 2-D wire-winding machine has a third laterally-guiding member for horizontally guiding the zigzagged wire, a main turntable for turning the zigzagged wire with respect to a vertical axis, and a pair of driving shaft for turning the zigzagged wire with respect to a horizontal axis. The main turntable is used to rotate for winding the zigzagged wire on a pair of mounting posts, and has a pair of bearing seats for rotably supporting a pair of spindles which are connected with the mounting posts. The driving shaft can drive to rotate the spindles for winding the zigzagged wire on the mounting posts with respect to a horizontal axis when the zigzagged wire is reciprocally guided by the third laterally-guiding member so as to form a spiral wire. The wire-pressing machine includes a mold assembly adapted to press the spiral wire to constitute the filter.
Patent TW-200421647-A (TW)
Title: Organic semiconductor device
Inventor: TANABE TAKAHISA
IPC: H01L27/092
Filed: 2003-10-24
Abstract: An organic semiconductor device includes at least p-type and n-type channel organic semiconductor elements. Each organic semiconductor element includes a pair of a source electrode and a drain electrode which are facing each other, an organic semiconductor layer deposited between the source electrode and the drain electrode such that a channel can be formed therebetween, and a gate electrode which applies a voltage through a gate insulating layer to the organic semiconductor layer provided between the source electrode and the drain electrode. The source electrode and the drain electrode of the p-type channel organic semiconductor element are made of materials having values of work function higher than those of the source electrode and the drain electrode of the n-type channel organic semiconductor element respectively.
Patent TW-200415940-A (TW)
Title: Test apparatus, testing method, liquid drop discharge apparatus, liquid drop discharge method, device, and electronic apparatus
Inventor: KAMIYAMA NOBUAKI
IPC: B41J2/01
Filed: 2003-10-24
Abstract: A detection apparatus includes a light emitter for emitting a detection light, a receiver for receiving the detection light, and a moving device for moving a discharge head in a direction to intersect the optical path of the detection light. When D is the diameter of a beam of the detection light, d is the diameter of the droplets, L is the distance between the discharge nozzles in the direction of movement of the discharge head, and H is the relative distance that the discharge head moves from when a discharge nozzle discharges one droplet to when the discharge nozzle discharges the next droplet, settings are adjusted so as to satisfy the conditions: D/2+d/2≤L, and H≤D.
Patent TW-200411809-A (TW)
Title: Semiconductor integrated device and manufacturing method thereof
Inventor: SUZUKI NOBUHIRO
IPC: H01L21/768
Filed: 2003-11-11
Abstract: A semiconductor integrated device and its manufacturing method are provided. The method includes: forming an integrated circuit device on a semiconductor substrate (10); forming an internal layout (26); exposing a part of the internal layout (26) along the scribe lines on the backside of the semiconductor chip to form a slit; covering at least the slit to form a metal film; patterning the metal film to form an external layout (18) and removing the metal film at the bottom of the slit; covering the external layout (18) and the bottom of the slit (18) to form a passivation film (34); and dicing the semiconductor chip (10) along the scribe lines. With this structure, the external layout at the side of the device can be prevented from corroding.
Patent TW-200418496-A (TW)
Title: A composition for repairing injured skin
Inventor: NISHIMURA MASAHIRO
IPC: A61K33/18
Filed: 2003-11-11
Abstract: The present invention provides a composition for repairing injured skin containing saccharide and povidone-iodine of the present invention having characteristics of suppressing time-dependent increase of consistency, easy to use, soft preparation, and superior applicability to a deep wounded lesion and a granulation tissue. The composition for repairing injured skin comprises 50 to 90% by weight of saccharide, 0.5 to 10% by weight of povidone-iodine, 0.1 to 20% by weight of water and 0.01 to 10% by weight of phospholipid.
Patent TW-200415579-A (TW)
Title: Vibration absorber, photodisk device and method for determining the corresponding number of vibration absorber
Inventor: SAITO TOSHIO
IPC: G11B33/08
Filed: 2003-11-21
Abstract: Provided is a vibration absorber and a photodisk device using the same of which the parts number will not increase and the cost may be lowered. Disk device 10 comprises a frame 11 for supporting entire disk device 10, a base chassis 12 on which a spindle motor 21 for turning disk is mounted, a vibration absorber element 13 for absorbing the vibration of base chassis 12, and a plurality of elastomers 14a to 14d for sustaining the frame 11, base chassis 12 and vibration absorber element 13 one another, the elastomer 14a to 14d sustaining the frame 11, base chassis 12 and vibration absorber element 13 by means of a common elastomer.
Patent TW-200518192-A (TW)
Title: Method of selectively etching HSG layer in deep trench capacitor fabrication
Inventor: WU YUNG-HSIEN
IPC: H01L21/311
Filed: 2003-11-25
Abstract: The invention provides a method of selectively etching hemispherical silicon grain (HSG) layer in deep trench capacitor fabrication. A substrate having a pad structure and a deep trench is provided. A buried oxide layer is formed on the upper sidewall of the deep trench and a HSG layer and an ASG layer are formed in the deep trench sequentially. A mask layer is filled into the deep trench and recessed; the exposed ASG layer is then removed. The HSG layer is doped to form a plasma doping layer on the upper portion of the deep trench, which is removed without consuming the silicon substrate. After the mask layer is removed, a cap oxide layer is formed on the deep trench, and the substrate is subjected to a thermal treatment to form a buried plate.
Patent TW-200411445-A (TW)
Title: Apparatus and method for executing applet
Inventor: CHUNG HYUN-KWON
IPC: G06F9/455
Filed: 2003-12-03
Abstract: An apparatus and a method of executing an applet in an apparatus reproducing interactive contents. The method involves receiving a request for executing an applet from a browser, determining whether the applet is a bound applet or an unbound applet, and loading the applet into a virtual machine. If the loaded applet is an unbound applet, predetermined commands to the virtual machine are issued, so that the applet can fall into an 'initiate' state and into a 'start' state, respectively.
Patent TW-200524131-A (TW)
Title: Structure of electrostatic discharge suppressor and method of stacking package with semiconductor devices
Inventor: WU TSUNG-CHIEH
IPC: H01L23/60
Filed: 2004-01-13
Abstract: The present invention relates to an overlap cascaded package structure of a semiconductor device and a static over-voltage and surge protection circuit. The semiconductor device chip such as a light emitted diode (LED) or an integrated circuit (IC)is overlap cascaded package on a static over-voltage and surge protection circuit. The front side of the static over-voltage protection chip is equipped with two isolated metal layer electrodes. The trenches also cut the semiconductor device into two devices with opposite polarity devices in cascaded. The trenches also act as scribed lines to scribe the wafer into chips. The semiconductor device chip is overlap cascaded die bond on the static over-voltage protection chip.
Patent TW-200525718-A (TW)
Title: Semiconductor package and method for manufacturing the same
Inventor: LU YI-TSAI
IPC: H01L23/31
Filed: 2004-01-29
Abstract: A semiconductor package includes a substrate, a first chip, at least two second chips and a heat sink. The substrate has a central portion and at least two side portions bent upwards. The first chip is disposed on an upper surface of the central portion of the substrate, and the second chips are respectively disposed on a first surface of one of the side portions of the substrate. The heat sink has a central portion disposed above the central portion of the substrate and two side portions respectively attaching on a second surface of one of the side portions of the substrate. The present invention further provides a method for manufacturing the semiconductor package.
Patent TW-200423320-A (TW)
Title: IC package product having wire filled by cement material
Inventor: Huang lu-zhen
IPC: H01L23/18
Filed: 2004-05-05
Abstract: An IC package product having wire filled by adhesive material, especially using a cement material to fill in the copper or any metal conductor and as an IC substrate to support wires is introduced. The said metal conductor surface is deposited a gold, nickel or silver layer for protection, and soldering or surface mounting used. Since direct bonding is used, no matter it is flipping chip assembling or wire soldering on the metal carrier, the strength and joint are good. On the other hand, the filling cement is adjusted to achieve the product package specification according to the electrical and heating characteristics of the IC products. This package process also has bottom-sealing function to prevent glue overflow to contaminate the bottom metal pad during glue filling. The cutting blade doesn't touch the metal wire, so there is no blade consumption. The electrical test can measure the whole wafer before dicing because each individual is not connected electrically.
Patent TW-200522769-A (TW)
Title: Organic electroluminescent display device and method of fabricating the same
Inventor: PARK JAE-YONG
IPC: G09F9/30
Filed: 2004-05-25
Abstract: An organic electoluminescent (EL) display device and methodology of fabricating the same includes a first array substrate having an anode electrode, a cathode electrode and an organic layer between the anode electrode and the cathode electrode; a second array substrate having at least one driving thin film transistor formed thereon, the at least one driving thin film transistor to supply a driving signal to either one of the anode electrode and the cathode electrode; a first spacer made of conductive material to supply the driving signal to either one of the anode electrode and the cathode electrode, the first spacer being formed between the first and the second array substrates; and a second spacer made of an adhesive material to fix together the first and the second array substrates, the second spacer being formed between the first and the second array substrates.
Patent TW-200601049-A (TW)
Title: Multiplex transmission mechanism of single print port and its electrical interface
Inventor: JOU JIUN-YU
IPC: G06F13/00
Filed: 2004-06-28
Abstract: Disclosed is a multiplex transmission mechanism, which is coupled with the print port of a data device by connecting a plurality of electrical interfaces capable of cascading in sequence, thereby enabling the data device to make the external devices connected with the electrical interfaces operate individually or together through the external device of each electrical interface. Accordingly, it is able to eliminate the specification limit in that the transmission between the conventional external device and the data device is restricted by the capability of expansion slot.
Patent TW-200504247-A (TW)
Title: Apparatus and method for molten salt electrolytic bath control
Inventor: TOJO TETSURO
IPC: C25B15/02
Filed: 2004-06-29
Abstract: This invention provides an apparatus for controlling a molten salt electrolyzer, in which an electrolytic bath in a solid form a contained in the electrolyzer is melted to automatically attain a state allowing electrolysis, which apparatus comprises detecting means for detecting the changes in state of the electrolyzer by means of detectors fitted to the electrolyzer, and adjusting means for adjusting, after using the detecting means, the liquid electrolytic bath levels to a state allowing electrolysis.
Patent TW-200603681-A (TW)
Title: A cold cathode fluorescent lamp digital driving system
Inventor: HSIEH KUAN-HONG
Filed: 2004-07-09
Abstract: A cold cathode fluorescent Lamp (CCFL) digital driving system for regulating an AC voltage supplied to the CCFL, includes an AC voltage supplying circuit, a feedback loop, a pulse width modulated (PWM) signal generator and a controller. The PWM signal generator generates a PWM signal. The AC voltage supplying circuit is controlled by the PWM signal and provides the AC voltage to the CCFL. The feedback loop is adapted to generate a feedback signal, which is an analog signal, for sensing the current flowing through the CCFL. The controller is an integrated circuit and includes a signal processing circuit for receiving the analog signal and converting the analog signal into a corresponding digital signal, and a signal controlling circuit for varying the width of the PWM signal based at least in part on the digital signal so as to regulate the AC voltage.
Patent TW-200602109-A (TW)
Title: Manufacturing method for a golf club head
Inventor: HUANG CHUN-YUNG
IPC: A63B53/04
Filed: 2004-07-12
Abstract: A manufacturing method for a golf club head comprises the following steps: forming a main-body wax pattern having a first connecting portion and an accessory wax pattern having a second connecting portion; initially combining the first connecting portion of the main-body wax pattern with the second connecting portion of the accessory wax pattern, and defining a filling gap between the first connecting portion and the second connecting portion; filling a low-viscous volatilizable solvent into the filling gap for melting the wax material that adheres the accessory wax pattern to the main-body wax pattern to form a club-head wax pattern; sinking the club-head wax pattern into a slurry to form a ceramic shell, and then heating the ceramic shell to melt the wax pattern and discharge it from the ceramic shell; and injecting melting alloy into the ceramic shell to integrally form a golf club head.
Patent TW-200510625-A (TW)
Title: Microcircuit cooling for a turbine blade
Inventor: CUNHA FRANK J
IPC: F01D5/18
Filed: 2004-08-05
Abstract: A turbine blade is provided comprising an internal cavity into which cooling air is flowable, an external wall and a first, second and third cooling circuits embedded with the wall. The cooling circuits include inlets that connect each respective cooling circuit with cavity to provide a cooling air flow path into the respective cooling circuit. The cooling circuits also include an exit aperture that provides a cooling air flow path out of the respective cooling circuits. The cooling circuits are configured to increase the temperature of the cooling air as it travels from the inlet to the exit aperture. In the exemplary embodiment, the inlets are aligned with the direction of counter-rotating flow circulations experienced by the inner surface of the wall caused by Coriolis flow effects on the cooling air flowing inside the cavity.
Patent TW-200539849-A (TW)
Title: Sauna oven
Inventor: Chen jing-song
IPC: A61H33/06
Filed: 2004-08-12
Abstract: The invention relates to a sauna oven with a chest body and several heating mats; wherein the chest body have an inner surface to define oven. The heating mats, containing heating body that produces power, are spread on the inner surface of the oven; two insulator covering heating body and distributing heat; and the cardboard like heating mat is less than 1/25in(1mm) thick. Thereof using the evenly scattered heating mat to maintain a constant temperature in the oven, and the arrangement for large areas enables keeping an endurable heat temperature to prevent user from burned and enhances user security. The heating mats are very thin, which simplifies oven manufacturing procedure without occupying the inner space of oven, and enhances the simplicity of installing heating mats.
Patent TW-200510733-A (TW)
Title: AC current sensor using triac and method thereof
Inventor: KIM BYOUNG-HEE
IPC: G01R15/14
Filed: 2004-09-06
Abstract: An AC current sensor using a triac and a method thereof are disclosed. The AC current sensor includes a triac coupled between conductors through which an AC current flows, a voltage sensing unit for sensing a voltage applied between terminals T1 and T2 of the triac, and a control unit for converting a value of the voltage inputted from the voltage sensing unit into a current value using a current versus voltage characteristic of the triac. Since the AC current sensor uses the triac, it can be small-sized and has a simple circuit construction with the manufacturing cost reduced.
Patent TW-200518884-A (TW)
Title: Tensionless power ratchet wrench assembly
Inventor: HORVATH JOHN
IPC: B25B21/00
Filed: 2004-09-09
Abstract: A power ratchet wrench assembly laving a tensionless head wherein operation of the ratchet mechanism does not require a tensioning means for applying a frictional force against the ratchet mechanism to inhibit rotational movement of the ratchet mechanism. In one embodiment, the invention provides a first gear, a second gear, and a ratchet mechanism having a drive body; wherein the drive body is alternately: coupled to the first gear and ratcheting with the second gear, and coupled to the second gear and ratcheting with the first gear.
Patent TW-200609568-A (TW)
Title: In plane switching liquid crystal display
Inventor: LIN TZE-MIN
IPC: G02F1/133
Filed: 2004-09-10
Abstract: The present invention provides an in plane switching liquid crystal display, which comprises an upper substrate and an opposing lower substrate, a twisted nematic liquid crystal layer disposed between the upper substrate and the lower substrate, an upper polarizer and a lower polarizer disposed on the upper substrate and the lower substrate respectively, a plurality of pixel electrodes and common electrodes disposed on the lower substrate and an upper alignment film and a lower alignment film disposed on inner sides of the upper substrate and the lower substrate, respectively.
Patent TW-200520181-A (TW)
Title: Seal structure for substrate treatment apparatuses and substrate treatment apparatus and method
Inventor: YAGI YASUSHI
IPC: B08B13/00
Filed: 2004-10-15
Abstract: The present invention provides a seal structure for a substrate treatment apparatus of a seal member formed of a frame and an elastic material installed at the ends of the frame. The inner wall of the frame and the inner wall of the seal member are installed having no difference in level.
Patent TW-200615729-A (TW)
Title: Linear regulator power-supply circuit
Inventor: HUANG YONG-ZHAO
IPC: G05F1/10
Filed: 2004-11-12
Abstract: A kind of linear regulator power-supply circuit comprises a voltage control circuit, an adjusting circuit, a load circuit, and a degenerative reactive circuit. The voltage control circuit is composed of a resistor R7 and a resistor R8 connected in series. A first terminal of the resistor R7 is connected to a first terminal of the resistor R8. A second terminal of the resistor R8 is connected to ground. The adjusting circuit is composed of a regulator and its driving circuit for adjusting the load current. A first terminal of the regulator is connected to an electrical source and a second terminal of the regulator is connected to a second terminal of the resistor R7. A first terminal of the load circuit is connected to the second terminal of the resistor R7 and a second terminal of the load circuit is connected to ground. The degenerative reactive circuit comprises an adjustable three terminal shunt voltage regulator, a cathode of which is connected to a third terminal of the regulator and the connecting point is connected to an electrical source. A reference terminal of the adjustable three terminal shunt voltage regulator is connected to connecting point of the resistor R7 and R8 and its anode terminal is connected to ground.