baber/WOPTO huggingface dataset:
Patent JP-2014185534-A (JP)
Title: Control device of spark ignition type internal combustion engine
Inventor: OI HIROO
IPC: F02P17/00
Filed: 2013-03-22
Abstract: PROBLEM TO BE SOLVED: To suitably control electric power to be charged into a combustion chamber in an internal combustion engine that performs ignition by emitting a radiofrequency field into the combustion chamber together with spark discharge.SOLUTION: A high frequency, which is generated by applying a drive voltage to a high-frequency generating circuit, is input into an antenna facing the inside of a combustion chamber of a cylinder, after being boosted by a step-up transformer. The drive voltage is adjusted so that magnitude of an electric current flowing through the high-frequency generating circuit can fall within a range higher than or equal to a low threshold and lower than or equal to a high threshold.
Patent JP-2014185547-A (JP)
Title: Valve gear for engine
Inventor: NAKAHARA KOJI
IPC: F01L13/00
Filed: 2013-03-22
Abstract: PROBLEM TO BE SOLVED: To improve an assembly characteristic of a valve gear having a hydraulic pressure type valve control mechanism capable of stopping a valve opening motion.SOLUTION: A hydraulic pressure type valve control mechanism 14 comprises: a pivot mechanism 30; an outer cylinder 20 for storing the pivot mechanism 30 therein in such a way that it can be protruded or retracted; a lock means 37 for connecting or separating the pivot mechanism 30 and the outer cylinder 20; and a ring member 40 for preventing the pivot mechanism 30 from being pulled out of the outer cylinder 20. The ring member 40 is formed with a pair of holding parts 42, 42 protruded from the outer cylinder 20 in a radial direction under a state in which it is installed at the outer cylinder 20. A rotational direction position setting pin 25 arranged at the lower part of the outer cylinder 20 is fitted into a pin fitting hole 71 punched at the bottom part of an installing hole 70 to set a position in a rotational direction. Under this state, wall parts 72b having substantially the same height as upper end surfaces 42a of a pair of holding parts 42, 42 are formed at both sides of the pair of holding parts 42, 42, on a cylinder head 1.
Patent JP-2014184460-A (JP)
Title: Knurling method of bar-shaped part
Inventor: TEJIMA MASAKAZU
IPC: B21J5/12
Filed: 2013-03-22
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a bar-shaped part with a knurl.SOLUTION: In a knurling method of a bar-shaped part, a steel wire cut in a predetermined length is inserted into a hollow hole of a first die, and by pushing out the steel wire forward by a punch pin and performing drawing work, a shaft part and a head part of the bar-shaped part are preliminarily formed. The preliminarily formed bar-shaped part is inserted into a hollow hole of a second die. In the hollow hole of the second die, a longitudinal groove is formed in advance on the inner peripheral surface of the hollow hole of the second die, and the preliminarily formed bar-shaped part is pushed out forward by the punch pin to perform drawing work of the head part of the bar-shaped part, and thus, a knurl is applied to the heat part outer periphery of the bar-shaped part. Head part forming and knurl forming of the bar-shaped part can be performed in the same process by the method.
Patent JP-2014191037-A (JP)
Title: Optical module, optical communication equipment, and optical transmission device
Inventor: YASUDA HIRONORI
IPC: H01L31/0232
Filed: 2013-03-26
Abstract: PROBLEM TO BE SOLVED: To provide an optical module which can be made more compact, and to provide optical communication equipment and an optical transmission device.SOLUTION: An optical module includes; a circuit board 2; an optical element 3 and a semiconductor circuit element 4 mounted on a front surface S of the circuit board 2; an optical connector member 14 which is formed on a back surface R of the circuit board 2 and has an optical fiber accommodating groove 6 for accommodating a tip portion of an optical fiber 5 introduced from a base-end side of the circuit board 2; and a pressing plate 8 which is provided on an optical waveguide 7 on a side opposite to the circuit board 2 to fix the optical fiber 5 in a state of being accommodated in the optical fiber accommodating groove 6. The semiconductor circuit element 4 is mounted more on a base end side of the circuit board 2 than the optical element 3, and is structured such that the circuit board 2, the optical connector member 14, and the tip portion of the optical fiber 5 are sandwiched between the semiconductor circuit element 4 and the pressing plate 8, and a plurality of electrodes 12 to be electrically connected to a circuit board 21 on the equipment side of a connection target, are formed in an array on a tip-end portion of the back surface R of the circuit board 2.
Patent JP-2014188410-A (JP)
Title: Coating device and coating method
Inventor: OHARA YUJI
IPC: B05C1/08
Filed: 2013-03-26
Abstract: PROBLEM TO BE SOLVED: To provide a coating device and method in which the occurrence of a creeping phenomenon can effectively be prevented even to substrates having different widths in a coating system using an impression cylinder and also the operation defects hardly generate even in a long-run operation.SOLUTION: A coating device is provided with a conveyance mechanism for conveying the film-like substrates, a rotatable gravure roller for applying a liquid to the substrate during conveyance, and a rotatable impression cylinder for contacting the substrate during conveyance with the gravure roller. The length of the impression cylinder in an axial direction is shorter than the width of the substrate, and the substrate is conveyed in such a positional relation that both side edges thereof protrude outside from both ends in the axial direction of the impression cylinder. A suction mechanism for floating both side edges of the substrate to an impression cylinder side is provided in the contact area of the substrate with the impression cylinder.
Patent JP-2014189619-A (JP)
Title: Fuel oil composition
Inventor: HAMANO JUNYA
IPC: C10L1/04
Filed: 2013-03-27
Abstract: PROBLEM TO BE SOLVED: To provide a fuel oil composition having excellent low temperature fluidity without decreasing a cetane index.SOLUTION: Provided is a fuel oil composition having a residual carbon content of 0.2 to 1.0 mass% in 10% residual oil. The composition comprises, based on the fuel oil composition: 75 to 99 vol.% of a fuel oil base oil containing 10 to 70 vol.% of a desulfurized gas oil having a sulfur content of 10 mass ppm or less; 0.1 to 1.0 vol.% of a residual carbon adjusting material comprising at least one hydrocarbon oil selected from the group consisting of an ordinary pressure residual oil, a vacuum residual oil, a desulfurized residual oil, a slurry oil, and an extract; 0.8 to 25 vol.% of an unsaturated hydrocarbon having side chains and having 15 to 40 carbon atoms; and 1.0 to 1000 volume ppm of a flow improver.
Patent JP-2014188845-A (JP)
Title: Lipophilic laminate, method for manufacturing the same, object, and method for manufacturing the same
Inventor: MIZUNO MOTOHISA
IPC: G02B1/10
Filed: 2013-03-27
Abstract: PROBLEM TO BE SOLVED: To provide a lipophilic laminate, etc. exhibiting an excellent fingerprint resistance even if fingerprint wipe-off cycles are repeatedly invoked thereon.SOLUTION: The provided lipophilic laminate includes a made-of-resin substrate and a lipophilic resin layer formed atop the made-of-resin substrate. The lipophilic resin layer possesses either fine surface protrusions or depressions. The oleic acid contact angle of the surface of the lipophilic resin layer is 10° or less.
Patent JP-2014190469-A (JP)
Title: Solenoid valve
Inventor: YOSHIDA HIDEFUMI
IPC: F16K31/06
Filed: 2013-03-27
Abstract: PROBLEM TO BE SOLVED: To provide a solenoid coil capable of easily forming a resin case by insert molding, and being disposed in air-intake/exhaust passages, and a fuel passage of an internal combustion engine without problems.SOLUTION: A solenoid valve 1 includes a resin case 23, and a resin case assembly composed of an electromagnetic coil 2, an electric connecting portion, and a coil bobbin 3 accommodated in the resin case. The resin case assembly is held and fixed between a yoke member 8 and a fixing member 5. A mounting portion 17b of a flow channel formation member 17 forming a flow channel 13 is held between a flange portion 27 of the fixing member 5 and a flange portion 31a of a mounting member 31, and both flange portions 27, 31a are fastened by a shoulder bolt 16, thus the flow channel formation member 17 and the mounting member 31 are mounted.
Patent JP-2014189529-A (JP)
Title: Ermonin
Inventor: ISHIBASHI MASAMI
IPC: C07D493/10
Filed: 2013-03-28
Abstract: PROBLEM TO BE SOLVED: To provide a new chemical substance as a resource.SOLUTION: Provided is ermonin represented by the following formula.
Patent JP-2014192108-A (JP)
Title: Holder, charged particle beam device, and vacuum device
Inventor: YUASA SHUICHI
IPC: H01J37/20
Filed: 2013-03-28
Abstract: PROBLEM TO BE SOLVED: To provide a holder capable of inhibiting drift.SOLUTION: A holder 100 includes: a cylinder 10 having a first opening 12 and a second opening 14; a first shaft part 20 which is disposed at the first opening 12 side and enables linear motion in the cylinder 10; a second shaft part 30 which is disposed at the second opening 14 side and enables rotary motion in the cylinder 10; a conversion part 40 which converts the rotary motion of the second shaft part 30 into the liner motion to transmit the linear motion to the first shaft part 20; a holding part 50 which is provided at the first shaft part 20 and may hold an object; and a seal part 60 which hermetically seals a space between the second shaft part 30 and the cylinder 10.
Patent JP-2014192485-A (JP)
Title: Semiconductor device manufacturing method, substrate processing method and substrate processing apparatus
Inventor: NAKAISO NAOHARU
IPC: H01L21/205
Filed: 2013-03-28
Abstract: PROBLEM TO BE SOLVED: To provide an art of depositing a non-doped Si film having excellent uniformity in wafer in-plane film thickness and excellent uniformity in wafer inter-wafer surface film thickness.SOLUTION: A semiconductor device manufacturing method comprises: a process of transporting a substrate to a processing chamber; a first gas supply process of supplying a B-atom containing gas into the processing chamber; a first purge process of purging the inside of the processing chamber under an atmosphere of the B-atom containing gas supplied in the first gas supply process; a second gas supply process of supplying an Si-atom containing gas into the processing chamber after the first purge process to form a non-doped Si film on the substrate; and a second purge process of purging the inside of the processing chamber under an Si-atom containing gas atmosphere.
Patent JP-2014189778-A (JP)
Title: Double-sided tacky sheet and coiled body
Inventor: KUROKAWA ATSUSHI
IPC: C09J201/00
Filed: 2013-03-28
Abstract: PROBLEM TO BE SOLVED: To provide: a double-sided tacky sheet capable, when coiled and stored in the form of a roll, of preventing the generation of multiple fine valleys and peaks on the tackifier layer surface; and a coiled body obtained by coiling the double-sided tacky sheet.SOLUTION: The double-sided tacky sheet of the present invention includes a tackifier layer, a first release film, and a second release film, the peel force of the second release film from the tackifier layer is less than the peel force of the first release film from the tackifier layer, the tackifier layer is formed by using a tackifier including an active energy ray-curable resin, the gel content of the tackifier layer immediately after the formation thereof is at least 70%, in a case where the gel content of the tackifier layer immediately after the formation thereof is defined as X [%] and where the gel content of the tackifier layer seven days after the formation of the tackifier layer is defined as Y [%], the relation of X/Y≥0.9 is satisfied, and the ratio occupied, on first and second surfaces of the tackifier layer, by valleys and peaks beyond a range of ±200 nm from the reference plane is 20% or less.
Patent JP-2014199079-A (JP)
Title: Wheel loader
Inventor: KINUGAWA RYOSUKE
IPC: F16H61/4192
Filed: 2013-03-29
Abstract: PROBLEM TO BE SOLVED: To enable a wheel loader (traveling machine body) to travel even if abnormality occurs to a mounted device.SOLUTION: A wheel loader comprises: a traveling drive device 40 for driving a traveling machine body 1A to travel; and a controller 20 outputting a control signal to the traveling drive device 1A on the basis of an input signal from a device mounted in the traveling machine body 1A. The controller 20 includes: an abnormality detection unit 70 detecting abnormality in the device mounted in the traveling machine body 1A; a first processing unit 71 outputting a control signal to the traveling drive device 40 on the basis of an input signal if the abnormality detection unit 70 does not detect abnormality in the device; and a second processing unit 72 outputting a control signal specified for emergency travel to the traveling drive device 40 if the abnormality detection unit 70 detects the abnormality in the device.
Patent JP-2014199994-A (JP)
Title: Optical transmission device
Inventor: YOSHIKANE NOBORU
IPC: H04J14/04
Filed: 2013-03-29
Abstract: PROBLEM TO BE SOLVED: To provide a technique enabling a target link to be protection and improving utilization efficiency of the link in an optical transmission device capable of controlling a transmission speed of a line side I/F.SOLUTION: An optical transmission device 100, on detecting fault occurrence on a first link (link 151), controls the transmission speed of a line side I/F 112 so that a client signal accommodated in a line signal transmitted/received on the first link can be accommodated in a line signal transmitted/received on a second link (link 152). Further, the optical transmission device 100 switches the line side I/F for processing the client signal from the line side I/F 111 to the line side I/F 112 so that the client signal is accommodated in the line signal transmitted/received through the line side I/F 112.
Patent JP-2014199765-A (JP)
Title: Fuel cell system
Inventor: KATO TAKESHI
IPC: H01M8/04
Filed: 2013-03-29
Abstract: PROBLEM TO BE SOLVED: To provide a fuel cell system capable of downsizing the system and also effectively utilizing hydrazine.SOLUTION: A fuel cell system 2 comprises: a fuel cell 3 for generating power by a reaction for consuming hydrazine and generating water in that reaction; a fuel tank 15 for storing a liquid fuel containing hydrazine; a fuel supply pipe 17 for transporting the liquid fuel stored in the fuel tank 15 from the fuel tank 15 to the fuel cell 3; a fuel recirculation pipe 16 for transporting the liquid fuel discharged from the fuel cell from the fuel cell 3 to the fuel tank 15; a hydrazine separation tank 56, connected to the fuel recirculation pipe 16, for accommodating an immobilization unit 58 for immobilize or desorb hydrazine; and an evaporation tank 57 connected to the hydrazine separation tank 56 and connected to the fuel tank 15 and having a heater 54 configured to evaporate water.
Patent JP-2014201118-A (JP)
Title: Pedal device and vehicle control device
Inventor: KATO YASUYUKI
IPC: B60K7/00
Filed: 2013-04-02
Abstract: PROBLEM TO BE SOLVED: To provide a pedal device and a vehicle control device capable of improving turning performance according to turning intention of a driver.SOLUTION: An ECU 50 applies brake force according to an operation amount Δ1 of a driver with respect to a brake pedal 31 for right foot to a right side wheel (right front wheel 11 and right rear wheel 15) of a vehicle 1, and applies brake force according to an operation amount Δ2 of the driver with respect to a brake pedal 33 for left foot to a left side wheel (left front wheel 13 and left rear wheel 17) of the vehicle 1.
Patent JP-2013168374-A (JP)
Title: Lamp socket
Inventor: KANEDA TAKAKIMI
IPC: H01R33/05
Filed: 2013-04-03
Abstract: PROBLEM TO BE SOLVED: To provide a straight-tube type lamp socket which has a pin installed in a projected manner on one of the bases and a pin on power feeding side installed in a projected manner on the another base, and which can be installed even if a pin hole is not opened at a lower end of the socket.SOLUTION: A lamp socket S1 is composed of: a socket body consisting of a socket body 10 and a socket cover 1 installed on the socket main body; and a socket receiving potrion 20 which is housed in the socket body together with an energizing means in the contact direction to a lamp base and in which a contact part to the lamp base is exposed from a window part opened in front of the socket cover. A pin insertion hole 21 into which a pin P1 at one end of a straight-tube type lamp L to be installed is inserted is provided at the socket receiving portion, and a means is provided which enables the socket receiving portion to slide in the socket body along a front and rear direction of the socket, when a base P2 on power supply side of the straight-tube type lamp is pressed against the lamp socket S2 on the power supply side.
Patent JP-2013138262-A (JP)
Title: Resin mold, surface mounting type light emitting device, and manufacturing methods of resin mold and surface mounting type light emitting device
Inventor: KURAMOTO MASAFUMI
IPC: H01L33/48
Filed: 2013-04-08
Abstract: PROBLEM TO BE SOLVED: To provide a surface mounting type light emitting device which achieves long life and is excellent in mass productivity, and to provide a mold used for the surface mounting type light emitting device.SOLUTION: A surface mounting type light emitting device includes: a light emitting element 100; a first resin mold 40 formed by integrally molding a base 10 where the light emitting element 100 is placed with a first lead 20 and a second lead 30 which are electrically connected with the light emitting element 100; and a second resin mold 50 covering the light emitting element 100. A recessed part 40c, having a bottom surface 40a and a side surface 40b, is formed in the first resin mold 40, and the first lead 20 and the second lead 30 are exposed from the bottom surface 40a of the recessed part 40c of the first resin mold 40. The first resin mold 40 and the second resin mold 50 are thermosetting resins.
Patent JP-2013144358-A (JP)
Title: Blasting device
Inventor: TOCHISHITA YOSHIKI
IPC: B24C3/28
Filed: 2013-04-08
Abstract: PROBLEM TO BE SOLVED: To provide a blasting device superior in the processing efficiency of an object to be processed, and capable of restraining the generation of a crack and the chipping of the object to be processed.SOLUTION: In a first blasting device, projection nozzles are arranged so that a projection material is projected to the object to be processed from the outside of a cylindrical barrel formed of a mesh for storing the object to be processed freely rotatable around an axis. In a second blasting device, cylindrical barrels formed of a mesh for storing the object to be processed are revolvingly supported outside in the peripheral direction of the axis of a support member freely rotatable around the axis, the cylindrical barrel makes a revolving motion around the axis of the support member by rotating the support member, and projection nozzles are arranged so that the projection material is projected to the object to be processed from the outside of the cylindrical barrel for performing the revolving motion.
Patent JP-2013179317-A (JP)
Title: Manufacturing method of semiconductor chip with adhesive film, adhesive film for semiconductor used in manufacturing method and semiconductor device manufacturing method
Inventor: HATAKEYAMA KEIICHI
IPC: H01L21/52
Filed: 2013-04-08
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor which enables production of a semiconductor chip with an adhesive film with good yield and satisfies both of assemblability and reliability.SOLUTION: A divided semiconductor wafer is obtained by forming, on one surface of a semiconductor wafer 7, cuts for demarcating the semiconductor wafer 7 into a plurality of semiconductor chips and each having a depth smaller than a thickness of the semiconductor wafer 7 and by grinding another surface of the semiconductor wafer 7 until reaching the cuts. The divided semiconductor wafer, an adhesive film 8 for semiconductor, and a dicing tap 3 are laminated. The adhesive film 5 for semiconductor has a thickness of within a range of 1-15 μm, a tensile elongation at break of less than 5%, and the tensile elongation at break less then 110% of elongation at the maximum load. The adhesive film 8 for semiconductor is picked up in a lamination direction of a laminate 20 to be divided to obtain a semiconductor chip with an adhesive film.
Patent JP-2014205173-A (JP)
Title: Steel tape meander control device and method
Inventor: KIRINO TAKASHI
IPC: B21C47/02
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To suppress meander of a steel tape surely without generating defect.SOLUTION: When starting take-up of a steel tape 19, an eccentric mechanism is used for disposing central axial angles of wrapper rolls 13a, 13b into an inverted-V shape so that contact surface pressure of the wrapper rolls 13a, 13b on a width direction central part of the steel tape 19 becomes larger than contact surface pressure on width direction end parts. More particularly, the eccentric mechanism is used for making distance between end parts of the width direction central part side of the wrapper rolls 13a, 13b and the steel tape 19 smaller than distance between the end parts of the width direction end parts side and the steel tape 19. In such a state, even meander of the steel tape 19 is generated from a working side toward a driving side, or from the driving side toward the working side of a mandrel 15, force F22 or force F21 act as opposite force with respect to a direction of the meander force, so that deviation of take-up is suppressed.
Patent JP-2014205895-A (JP)
Title: Blast furnace operation method
Inventor: YOKOYAMA KOICHI
IPC: C21B5/00
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To provide a high-efficiency blast furnace operation method, in particular, with use of ferrocokes for preventing an adverse effect of use of bulky ore in a blast furnace.SOLUTION: A mixture of an iron raw material 3 having a softening initiation temperature lower than that of sintered ore 1 and ferrocokes 4 is fed into a blast furnace. The blending mass ratio of the iron raw material to the ferrocokes 4 in the mixture is preferably in the range of 90:10 to 70:30. The proximity arrangement of the iron raw material 3 with a softening initiation temperature lower than that of the sintered ore 1 and the ferrocokes 4 improves the reducibility of the iron raw material 3. The ferrocokes 4 has maximal reducibility improvement effect on the iron raw material 3. The reduction material ratio (fuel ratio) is thus remarkably improved with use of the ferrocokes 4.