baber/WOPTO huggingface dataset:
Patent TW-I254822-B (TW)
Title: Backlight module and liquid crystal display using the same
Inventor: FANG WU-HONG
IPC: G02F1/1335
Filed: 2004-12-31
Granted: 2006-05-11
Abstract: The present invention relates to a backlight module and a liquid crystal display using the same. The backlight module includes a light guide plate and a light emitting diode, the light guide plate includes a light incident surface, the light emitting diode is opposite to the light incident surface. The midlines of the light emitting diodes and the light incident surface are in a same plane.
Patent TW-I403853-B (TW)
Inventor: NAGASAKA HIROYUKI
IPC: H01L21/027
Filed: 2005-01-05
Granted: 2013-08-01
Abstract: An exposure apparatus (EX) in which a substrate (P) is exposed by radiating an exposure light beam (EL) onto the substrate through liquid (LQ) in a liquid immersion area (AR2) locally formed on an upper surface of the substrate, the exposure apparatus comprising: a substrate stage (PST) which is configured for holding the substrate, and on which an optical sensor (400, 500) is arranged, a liquid supply mechanism (10) configured for supplying liquid to form the liquid immersion area through a first supply port (13A) arranged in a lower surface (70A) of a flow passage-forming member (70), the lower surface being arranged, in use, opposite to the surface of the substrate; a liquid recovery mechanism (20) configured for recovering liquid to form the liquid immersion area through a first recovery port (23A) arranged in the lower surface of the flow passage-forming member; a projection optical system (PL) having an optical element (2); and a mechanism configured for supplying liquid through a second supply port (97C, 97D) of the flow passage-forming member, wherein the flow passage-forming member is provided to surround the optical element, the second supply port of the flow passage-forming member is arranged opposite to a side surface (2T) of the optical element, the second supply port supplies the liquid to a gap (G) between the optical element and the flow passage-forming member during the exposure of the substrate, and the recovery port recovers the liquid supplied via the first and second supply ports to the liquid immersion area during the exposure of the substrate.
Patent TW-I262215-B (TW)
Title: Method of manufacturing porous metallic substance
Inventor: GUO DUNG-YUE
IPC: C22C1/08
Filed: 2005-01-06
Granted: 2006-09-21
Abstract: The present invention relates to a method of manufacturing porous metallic substance, comprising: choosing a foaming material as a substrate; adding conductive material directly into the foaming material during the foaming process; adhering a layer of metal by coating so as to form a metallic thin film on the surface of the foaming material; and obtaining the foaming substrate by a dissolving solution or by high temperature heating so as to form a structure of hollow metallic substance. By the process aforementioned, the fabrication of the light-weight metallic substance to various shapes can by performed easily; in addition, by the property of metallic conductivity and large surface due to the hollow structure, a variety of application purposes, such as light weight requirements, heat-dissipating properties, and electricity storage, can be realized.
Patent TW-I251286-B (TW)
Title: Method for reducing lead precipitation during wafer processing
Inventor: TSAO PEI-HAW
IPC: H01L21/60
Filed: 2005-03-24
Granted: 2006-03-11
Abstract: Disclosed herein is a bonding pad formed on a TIC chip for electrically coupling the IC chip to another device or component, and associated methods of manufacturing the bonding pad. In one embodiment, the bonding pad comprises a bonding portion having a bonding surface configured to receive an electrical connector. The bonding pad further comprises a probing portion having a probing surface adjacent and electrically coupled to the bonding surface, and configured to receive a probe tip for testing to the operation of the integrated circuit chip. In this embodiment, the bonding pad comprises a first planar dimension measured across the bonding portion and the adjacent probing portion, where the bonding portion further comprises a second planar dimension measured substantially perpendicular to the first planar dimension, and the probing portion comprises a third planar dimension measured substantially perpendicular to the first planar dimension and being less than the second planar dimension.
Patent TW-I280060-B (TW)
Title: Video encoder and method for detecting and encoding noise
Inventor: YANKILEVICH ITZIK
IPC: H04N7/26
Filed: 2005-04-27
Granted: 2007-04-21
Abstract: A digital video signal encoder and method for detecting and encoding noise is disclosed. In a frame in a video signal, the variance of at least four macroblock luminance blocks is calculated. The Log2 of the minimum of these variances is determined. A running sum of the Log2 calculations is calculated and compared to a noise threshold to determine whether or not the frame contains noise. In one embodiment, a frame is determined to contain noise if the running sum is greater than a noise threshold and encodes the remaining portion of the frame as noise. In another embodiment, a current frame is determined to contain noise and is encoded as noise if the previous frame contained noise. The present invention may encode noise by overriding the original bit rate quantiser scale and/or removing at least one high frequency from a noise block using a DOC filter.
Patent TW-I279861-B (TW)
Title: Carbon-doped-Si oxide etch using H2 additive in fluorocarbon etch chemistry
Inventor: GU BINXI
IPC: H01L21/302
Filed: 2005-05-10
Granted: 2007-04-21
Abstract: Certain embodiments include an etching method including providing an etch material, applying a gas mixture including hydrogen, forming a plasma, and etching the etch material. The etch material can include a low-k dielectric material. The gas mixture can include a hydrogen gas, a hydrogen-free fluorocarbon, and a nitrogen gas, and further include one or more of a hydrofluorocarbon gas, an inert gas, and/or a carbon monoxide gas. The hydrogen gas can be a diatomic hydrogen, a hydrocarbon, a silane and/or a fluorine-free hydrogen gas, including H2, CH4, C2H4, NH3, and/or H2O gases. The hydrogen-free fluorocarbon gas can be a CxFy gas (where x >= 1 and Y >= 1) and the hydrofluorocarbon gas can be a CxHyFz gas (where x >= 1, y >= 1 and z >= 1). The gas mixture can be free of oxygen. Embodiments can include reduced pressures, reduced hydrogen flow rates and one or more plasma frequencies.
Patent TW-I254361-B (TW)
Title: Metal surface protection structure against metal oxidization and manufacturing method thereof
Inventor: LIN YAN-SHAN
IPC: H01L21/20
Filed: 2005-05-10
Granted: 2006-05-01
Abstract: This invention relates to a metal surface protection structure against metal oxidization. It comprises a substrate, a conductive thin-film layer, a metal thin-film layer, and a conductive metal oxide layer or a conductive metal silicide layer. The conductive thin-film layer is formed on the substrate. The metal thin-film layer is formed on the conductive thin-film layer. The conductive metal oxide layer or the conductive metal silicide layer are formed on the metal thin-film layer. The conductive metal oxide layer is a metal oxide selected from a group containing In2O3, SnO2, ZnO, CdO, CdIn2O4, Cd2SnO4, Zn2SnO4, In2O3-ZnO, ITO or IZO, and the conductive metal silicide layer is a metal silicide selected from a group containing WSi2, Mosi2, TiSi2 or Cosi2. By means of this way, through the conductive metal oxide layer or the conductive metal silicide layer, the protection not only provides conductivity, but also prevents metal surface from being oxidized in the post processes.
Patent TW-I277128-B (TW)
Title: Low stress semiconductor device coating and method of forming thereof
Inventor: JENG SHIN-PUN
IPC: H01L21/00
Filed: 2005-07-25
Granted: 2007-03-21
Abstract: A low stress, protective coating for a semiconductor device and a method for its manufacture. A preferred embodiment comprises coating a surface of a semiconductor die with polyimide except for corner regions of the die. Not having corners in the polyimide protective overcoat generally reduces shear stresses in the die. Reducing stress, in turn, generally reduces the occurrence of problems such as fracture, delamination, or cracking in the die. A low stress coating may be particularly advantageous in semiconductor devices having low-k insulating materials, which are generally of low mechanical strength.
Patent TW-I262283-B (TW)
Title: Air supply device for the protective clothing
Inventor: LEE SEN-YUNG
IPC: F24F3/16
Filed: 2005-08-08
Granted: 2006-09-21
Abstract: The present invention relates to a kind of air supply device for the protective clothing. It comprises a box, a filter set (2) and a fan set (31). The box includes upper cover (11) and base (12). A muffler (4) with a connection pipe (5) can be mounted on the top of the upper cover (11). The base (12) with a through hole (122) and a containing room (123) can contain the fan set (31). The filter set (2) is connected with the through hole (122) of the box. The filter set (2) comprises the intake passage (21) and at least one set of filter (23, 24) and washer (22, 25). One end of the intake passage (21) has the first ring stage (212) for the embedding of the filter and washer, and the other end of the intake passage (21) has the second ring stage for the embedding of another filter and washer. The fan set (31) is arranged and fixed inside the box and is driven by the motor (32) powered by the electric power device (34). By the filter set (2) of the air supply device, the impurities and virus in the air can be filtered. It is also handier for users to change the filter set (2). Moreover, the fan set (31) of the air supply device can be equipped with the centrifugal type fan to provide sufficient air flow capacity to maintain the positive pressure inside the protective clothing to prevent the outside virus from entering the protective clothing. It also provides the cool air conditioning effect inside the protective clothing. Besides, the air supply device is small in size to be carried easily and can be powered by AC or DC power depending on the situation.
Patent TW-I277557-B (TW)
Title: Bicycle suspension assembly
Inventor: FUKUI SEIJI
IPC: B62K19/30
Filed: 2005-09-06
Granted: 2007-04-01
Abstract: A bicycle suspension assembly elastically supports a first frame member to a second frame member. The suspension assembly preferably forms a bottom bracket unit that allows the rear frame member to pivot about the axis of the bicycle crank axle without any adverse affects to the drive train assembly. Preferably, the suspension assembly includes a first suspension member, a second suspension member, a first bearing unit, and a shock-absorbing structure. The first bearing unit is operatively disposed between the first and second suspension members to movably support the first suspension member for rotation relative to the second suspension member about a center pivot axis. In the preferred embodiment, each of the shock-absorbing structure includes a plurality of biasing members. Preferably, the suspension assembly includes a second bearing unit that is axially spaced from the first bearing unit along the center pivot axis.
Patent TW-I286783-B (TW)
Title: Integrated circuit chip and manufacturing process thereof
Inventor: YU YU-LUNG
IPC: H01L21/00
Filed: 2005-09-06
Granted: 2007-09-11
Abstract: An integrated circuit chip includes a substrate, a device layer, an interconnection layer, a sealing base layer and a sealing ring stack layer. In this case, the substrate has a sealing region and a chip region. The sealing region is disposed around the chip region. The device layer is disposed within the chip region. The interconnection layer is disposed over and connected with the device layer. The sealing base layer is disposed within the sealing region. The sealing ring stack layer is disposed over and connected with the sealing base layer. A manufacturing process of the integrated circuit chip is also disclosed.
Patent TW-I284037-B (TW)
Title: Angle adjustable massage device
Inventor: HSIEH WEN-HSU
IPC: A61H21/00
Filed: 2005-10-11
Granted: 2007-07-21
Abstract: The present invention related to an angle adjustable massage device which id device on massage armchair which could provide body's head lean with support, and it is comprised by a support of bolster, the side of bolster with pocket, the side of bolster is consociated with support of bolster ambilateral and the pocket allocate to the side of bolster within, and the bulge and crinkle tip for side of bolster by the pocket inflation and deflated, which that bulge and crinkle of side of bolster tip massage armchair make the body with support the bolster waver, therefore, the user could adjust best suitable side of bolster waver angle with locality through controlling the pocket bulge and crinkle that let user's head can be able to feel suitable and easily lean without ache and uncomfortably phenomena on head and cervical occurring, therefore, the present invention can suitable by each user and accordance to their demand.
Patent TW-I285976-B (TW)
Title: Battery
Inventor: FUKUSHIMA YUZURU
IPC: H01M4/62
Filed: 2005-10-19
Granted: 2007-08-21
Abstract: A battery capable of improving the energy density and cycle characteristics is provided. A cathode active material layer contains a complex oxide containing Li and Co as a cathode active material. An anode active material layer contains a CoSnC containing material containing Sn, Co, and C as an element, in which the content of C is from 16.8 wt% to 24.8 wt%, and the ratio of Co to the total of Sn and Co is from 30 wt% to 45 wt% as an anode active material. The surface density ratio of the cathode active material layer to the anode active material layer (surface density of the cathode active material layer/surface density of the anode active material layer) is from 2.77 to 3.90.
Patent TW-I280521-B (TW)
Title: System for updating composite object for on board unit (OBU) and method thereof
Inventor: LEE BILL
IPC: G08C17/00
Filed: 2005-11-25
Granted: 2007-05-01
Abstract: The present invention provides a system for updating a composite object for an on board unit (OBU). When an on board unit (OBU) is connected to an updating download server through mobile communication means, the updating download server inspects the difference of rate version for each object in the OBU, and then performs integration and adjustment by comparing the dependency relationship of the data in each object unit; and using a key encryption method to transmit an updating composite object in packets to the OBU for performing data updating.
Patent TW-I290870-B (TW)
Title: Solder scrap recycling device for solder pot
Inventor: SHIU GUO-CHING
IPC: B23K3/08
Filed: 2006-05-30
Granted: 2007-12-11
Abstract: This invention provides a solder scrap recycling device for a solder pot, by further adding to the currently available solder tank, at opposing oblique faces of the port of each solder spraying device with receiving tabs along the direction to which the solder is injected. Each receiving tab is raised upwards at an edge and indented at a center to form a flowing channel. The wall face of the receiving tab is provided with plural filtering holes, where one end thereof is connected to an inner wall face of the solder tank, and another end thereof to a solder scrap filtering tank. The solder scrap filtering tank has a bottom being communicated to the solder tank and provided with a filter. When liquid solder falls upon being injected from the port, non-oxidized liquid solder could flow through the filtering hole located at the bottom of the receiving tab and return to the solder pot for recycling, and solder scrap can flow into the solder scrap filtering tank along the receiving tab. The filtering effect provided by the bottom filter of the solder scrap tank, this invention prevents solder scrap from being fed into the solder spraying device by means of pumping. Furthermore, there is no need for additional filtering upon recycling the solder scrap to allow easier recycling.
Patent TW-I414411-B (TW)
Title: Co-injection nozzle assembly
Inventor: SERES JR
IPC: B29C44/02
Filed: 2007-02-26
Granted: 2013-11-11
Abstract: A gate adapter for use in a hot runner co-injection molding system includes a hollow gate adapter body defining a gate outlet at a free end thereof. At least a pair of nozzle assemblies is disposed in the adapter body, each of nozzle assemblies having an inlet end in fluid communication with a source of liquid extruded material and an outlet end in the adapter body. At least a pair of nozzle passages is formed in the adapter body and extends from the outlet of the nozzle assemblies to a passage outlet adjacent the gate outlet. A valve stem is disposed adjacent each of the passage outlets and is operable to selectively allow flow from the passage outlets to the gate outlet. The nozzle passages extend for a short predetermined distance within the adapter body to minimize heat transfer.
Patent TW-I326610-B (TW)
Inventor: ASHIDA HIROYUKI
IPC: A63F13/32
Filed: 2007-07-24
Granted: 2010-07-01
Abstract: The present invention provides a game system 100, a game terminal 10, and a server device 40. Game system 100 allows players to play a game in a unit of a group constituting one game terminal 10 that has been selected as a parent node and game terminals 10 that have been selected as child nodes. The parent node is capable of communicating with each node, and each child node is capable of communicating with the parent node. The selection of the parent node is performed by server device 40. A parent node is selected based on bandwidth notified from each game terminal 10.
Patent TW-I415477-B (TW)
Title: Alternate stream signaling for adaptive stream selection
Inventor: WESTERINK PETER HANS
IPC: H04N21/24
Filed: 2007-08-03
Granted: 2013-11-11
Abstract: A signal stream is transmitted when an available transmission bandwidth becomes reduced by providing alternate signal streams of different bit rates from the same source. The alternate signal streams are sub-sampled to form frames that have particular identifiers added thereto. The server is informed in advance, before actually providing the frames, of the identifiers. Because the server knows the current bandwidth limitations and knows the identifiers of the frames, the server can pass for transmission only those frames of the alternate signal stream that can fit within the transmission bandwidth that is available.
Patent TW-I413571-B (TW)
IPC: B24B37/005
Filed: 2007-10-24
Granted: 2013-11-01
Abstract: The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.
Patent TW-I456420-B (TW)
Title: Method and computer-readable storage medium for determining an improved process model by modeling mask corner rounding effects
Inventor: HUANG JENSHENG
IPC: G03F1/36
Filed: 2007-12-27
Granted: 2014-10-11
Abstract: An embodiment provides systems and techniques for determining an improved process model which models mask corner rounding (MCR) effects. During operation, the system may receive a mask layout and process data which was generated by applying a photolithography process to the mask layout. The system may also receive an uncalibrated process model which may contain a set of MCR components. Next, the system may identify a set of corners in the mask layout. The system may then determine a set of mask layers, wherein at least some of the mask layers correspond to the MCR components. Next, the system may determine an improved process model by calibrating the uncalibrated process model using the set of mask layers, and the process data.
Patent TW-I410401-B (TW)
Title: Process for preparing 2,4-dihydroxyphenyl 4-methoxybenzyl ketones
Inventor: PAZENOK SERGII
IPC: C07C49/82
Filed: 2008-02-25
Granted: 2013-10-01
Abstract: Preparation of 2,4-dihydroxyphenyl-4-methoxybenzyl-ketone compounds (I) comprises reacting phenyl acetic acid derivatives (II) with phenol derivatives (III) with hydrogen fluoride. Preparation of 2,4-dihydroxyphenyl-4-methoxybenzyl-ketone compounds of formula (I) comprises reacting phenyl acetic acid derivatives of formula (II) with phenol derivatives of formula (III) with hydrogen fluoride. R 1>, R 2>H, Cl, F, Br, I, CF 3, CH 3, optionally substituted alkoxy, -OCF 3, -C(CH 3) 3, -CH 2(CH 3) 2 or -CH(CH 3) 2 (preferably H, Cl, F, Br, I, CF 3, CH 3, 1-4C alkoxy, -C(CH 3) 3, -CH 2(CH 3) 2 or -CH(CH 3) 2 ); R 3>H, Cl, F, Br, optionally substituted alkyl, optionally substituted alkoxy, -C(CH 3) 3 (preferably H, Cl, F, Br, 1-6C alkyl, 1-4C alkoxy or -C(CH 3) 3); and X : OH, F, Cl or optionally substituted alkoxy (preferably OH, F, Cl, 1-4C alkoxy). [Image]
Patent TW-I413295-B (TW)
Title: Substrate, communication module, and communication apparatus
Inventor: TSUTSUMI JUN
IPC: H03H7/38
Filed: 2009-02-04
Granted: 2013-10-21
Abstract: A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line.
Patent TW-I407778-B (TW)
Title: Circuit and method for processing image abnormality caused by power supply
Inventor: HUNG MIN HUI
IPC: H04N5/21
Filed: 2009-03-05
Granted: 2013-09-01
Abstract: A method for processing an image abnormality caused by power supply is provided, which is used in a digital image-capturing apparatus. The method can be described as follows. First, power of the digital image-capturing apparatus is turned on. Next, a line data of an image being captured is started to be transmitted, wherein the line data has a dummy pixel region and an effective pixel region, and the dummy pixel region is first transmitted, and then a plurality of pixel data of the effective pixel region is transmitted. Next, a horizontal driving current to be input to a horizontal driver is processed, so that the horizontal driving current substantially approaches a stable state before the effective pixel region is output. Finally, the above steps are repeated for continually transmitting a next line data of the image being captured until the image of the digital image-capturing apparatus is completely transmitted.