baber/WOPTO huggingface dataset:
Patent TW-201917864-A (TW)
Title: Semiconductor package
Inventor: KIM HAN
IPC: H01L23/58
Filed: 2018-02-22
Abstract: A semiconductor package includes a connection member and a supporting member. The connection member has first and second surfaces opposing each other and a redistribution layer. The supporting member is disposed on the first surface of the connection member, has a first through-hole and a second through-hole spaced apart from each other, and has a blocking layer disposed on at least an inner surface of the second through-hole. A semiconductor chip is disposed in the first through-hole and has connection pads connected to the redistribution layer. At least one passive component is disposed in the second through-hole and has connection terminals connected to the redistribution layer. An encapsulant encapsulates the semiconductor chip and the at least one passive component in the first and second through-holes, respectively. An electromagnetic band-gap (EBG) structure is embedded in the supporting member.
Patent TW-201837795-A (TW)
Title: Remote operating system
Inventor: OWADA MASATO
IPC: G06Q30/06
Filed: 2018-02-27
Abstract: The present invention addresses the problem of providing a remote operating system which makes it possible to operate a device to be operated by means of a remote operating device in a simple and reliable manner even if the device to be operated is not equipped with a communication function, or if displayed contents on a monitor screen of the device to be operated are not recognized on the remote operating device side. A remote operating system 100 is provided with: a screen acquisition unit 121; an image determination unit 122; a state providing unit 123; an operation reception unit 131; an operating signal output unit 132; a correct/incorrect operation determination unit 133; and a state database DB. The remote operating system 100 is further provided with a capture device 141 for capturing an image of a monitor X1 of a device X of interest, and a control interface 142 connected to a keyboard X2 of the object X to be controlled in a superimposed manner.
Patent TW-201837145-A (TW)
Title: High performance photocurable optically clear adhesive
Inventor: LIU LAN HONG
IPC: C09J129/14
Filed: 2018-03-02
Abstract: The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPA,s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.
Patent TW-201939208-A (TW)
Title: Bridge-variable cooling module and electrical device using the same
Inventor: LAI KUN-HUI
IPC: G06F1/20
Filed: 2018-03-15
Abstract: A bridge-variable cooling module includes a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate has a plurality of heat dissipation fins and a bonding surface respectively located on two opposite surfaces, and a plurality of first bridge trenches are located between the heat dissipation fins. The second dissipation plate has a plurality of fins and a bridge surface respectively located on two opposite surfaces. A plurality of second bridge trenches and a plurality of die bonding plates are located on the bridge surface.
Patent TW-201941185-A (TW)
Title: Artificial intelligence voice interaction method, computer program product, and near-end electronic device thereof
Inventor: LI JIAN-YING
IPC: G10L17/22
Filed: 2018-03-21
Abstract: An artificial intelligence voice interaction method and a near-end electronic device thereof are disclosed. The method includes the following steps: receiving a voice input by a user; transmitting the voice to a remote artificial intelligence server; determining whether the voice has ended; when determining that the voice has ended and has not received a stop recording signal transmitted by the remote artificial intelligence server, it stops transmitting the voice to the remote artificial intelligence server; before determining that the voice has finished, and has received the stop recording signal from the remote artificial intelligence server, it stops transmitting the voice to the remote artificial intelligence server; and receiving a response signal send back from the remote artificial intelligence server.
Patent TW-201927800-A (TW)
Title: Phosphorus-containing silicon active ester, process for producing the same, flame retardant resin composition, prepreg and a metal foil-clad laminate for achieving a flame retardant effect of UL94 V-0 at a low phosphorus content
Inventor: FAN HUA-YONG
IPC: C07F9/28
Filed: 2018-03-21
Abstract: The present invention provides a phosphorus-containing silicon active ester, a process for producing the same, a flame retardant resin composition, a prepreg, and a metal foil-clad laminate. The phosphorus-containing silicon active ester of the present invention has a structure represented by formula (I), which is capable of simultaneously functioning as an active ester curing agent and a halogen-free flame retardant, and achieving a flame retardant effect of UL94 V-0 at a low phosphorus content.
Patent TW-201943328-A (TW)
Title: Indoor telecommunication equipment cabinet frame device capable of preventing airflow from returning and exhausted waste hot air from being sucked in again to achieve excellent heat dissipation efficiency
Inventor: CHUNG JUNG-TUNG
IPC: H05K7/20
Filed: 2018-03-31
Abstract: An indoor telecommunication equipment cabinet frame device comprises a shell, a rack plate set, a fan set, and an upper guiding set and a lower guiding set respectively disposed on the upper side and the lower side of the shell. The shell comprises two side plates, a rear plate and a front upper plate connected to the top of the front side of the side plates. The rack plate set comprises a first rack plate, a second rack plate and a third rack plate that are sequentially disposed between the side plates with intervals from top to bottom in between the side plates, which mayo sequentially define an upper buffer space, an installation space, a fan space in which the fan set is installed, and a lower buffer space. The upper guiding set comprises an upper guiding plate with a first upper guiding end corresponding to one of the front upper plate and the rear plate and separated from the shell. The lower guiding set comprises a lower guiding plate with a first lower guiding end opposite to one side of the first upper guiding end and separated from the shell, so that the airflow will not return and the exhausted hot air will not be sucked in again.
Patent TW-201901255-A (TW)
Inventor: SEKIYA KAZUMA
IPC: G02F1/133
Filed: 2018-04-12
Abstract: The issue of the present invention is to provide a manufacturing method of LED display panel, which is capable of manufacturing the LED display panel with an excellent efficiency. To solve the problem, the present invention provides a manufacturing method of LED display panel, which is a method for manufacturing an LED display panel. The method comprises: an LED wafer preparation step for preparing an LED wafer, wherein the LED wafer is partitioned by a predetermined dividing line, and a plurality of LEDs are provided on the surface of an epitaxial substrate through a buffer layer; a display substrate preparation step for preparing a display substrate having a plurality of electrodes arranged in rows and columns; an LED wafer positioning step for positioning the LED wafers facing to each other corresponding to the electrodes of the display substrate; an electrode connecting step for irradiating the display substrates or the display LED wafers facing to each other positioned by the LED wafer positioning step so as to have a laser beam with a permeable wavelength to connect the LED electrodes and the electrodes of the display substrate corresponding to the LED electrodes; and an LED arrangement step for irradiating the buffer layer of the LED positioned on the display substrate with the laser beam with a wavelength that is permeable to the display substrate or the LED wafers so as to destroy the buffer layer, whereby the LEDs are peeled off from the epitaxial substrate and disposed on the display substrate.
Patent TW-201902858-A (TW)
Inventor: JO DONG-WAN
IPC: H01L21/67
Filed: 2018-04-27
Abstract: The present invention relates to carbon material having, on the base material, a coating layer comprising tantalum carbide (TaC), and a method for producing the carbon material, the carbon material, which has a coating layer comprising TaC, according to the present invention comprising: base material; and a coating layer, on the surface of the base material, comprising TaC having average crystal grain size of 10-50 [mu].
Patent TW-201909454-A (TW)
Inventor: KANG HYUN-JI
IPC: H01L33/56
Filed: 2018-06-12
Abstract: The present invention provides a curable silicone composition for forming a cured product which inhibits the discoloration of silver electrodes or a silver-plated substrate in an optical semiconductor device due to a sulfur-containing gas, wherein the composition comprises at least one type of a crown compound. In addition, the present invention provides an optical semiconductor device having excellent reliability after a sulfur resistance test, in which an optical semiconductor device on silver electrodes or a silver-plated substrate is sealed, covered, or adhered with a cured product of the composition.
Patent TW-201909373-A (TW)
Inventor: PENG YUE-LIN
IPC: H01L23/544
Filed: 2018-06-21
Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.
Patent TW-201905167-A (TW)
Inventor: DUAN LIAN
IPC: H01L27/32
Filed: 2018-06-27
Abstract: The present application relates to the field of display technology, and specifically discloses an organic light-emitting diode device. The organic light-emitting diode device is provided with a first electrode, a second electrode, and an organic functional layer. The organic functional layer includes a light-emitting layer, wherein the light-emitting layer includes at least a subject material and an object material. The subject material includes an exciplex composed of a donor molecule and an acceptor molecule, wherein the donor molecule and/or acceptor molecule contains a substituent group X with a large steric hindrance for increasing the spacing between the donor molecule and the acceptor molecule, thereby enhancing Foster energy transfer to the object material molecule, increasing device efficiency, suppressing triplet-polaron annihilation (TPA), and prolonging device lifetime.
Patent TW-202006663-A (TW)
Title: Image synthesizing method and system
Inventor: CHANG YAO-TSUNG
IPC: G06T7/55
Filed: 2018-07-02
Abstract: An image synthesizing method and system include capturing a first image using a first aperture, which corresponds to a first depth of field (DOF); capturing a second image using a second aperture, which corresponds to a second DOF and is different from the first aperture; and receiving the first image and the second image, on which an image processing is performed to obtain a synthesized image, which has a DOF being between the first DOF and the second DOF.
Patent TW-201836166-A (TW)
Title: Semiconductor nanocrystals, methods for making same, compositions and products thereof
Inventor: LIU WENHAO
IPC: H01L33/02
Filed: 2012-11-21
Abstract: A semiconductor nanocrystal characterized by having a solid state photoluminescence external quantum efficiency at a temperature of 90 DEG C or above that is at least 95% of the solid state photoluminescence external quantum efficiency of the semiconductor nanocrystal at 25 DEG C is disclosed. A semiconductor nanocrystal having a multiple LO phonon assisted charge thermal escape activation energy of at least 0.5eV is also disclosed. A semiconductor nanocrystal capable of emitting light with a maximum peak emission at a wavelength in a range from 590 nm to 650 nm characterized by an absorption spectrum, wherein the absorption ratio of OD at 325 nm to OD at 450 nm is greater than 5.5. A semiconductor nanocrystal capable of emitting light with a maximum peak emission at a wavelength in a range from 545 nm to 590 nm characterized by an absorption spectrum, wherein the absorption ratio of OD at 325 nm to OD at 450 nm is greater than 7. A semiconductor nanocrystal capable of emitting light with a maximum peak emission at a wavelength in a range from 495 nm to 545 nm characterized by an absorption spectrum, wherein the absorption ratio of OD at 325 nm to OD at 450 nm is greater than 10. A composition comprising a plurality of semiconductor nanocrystals wherein the solid state photoluminescence efficiency of the composition at a temperature of 90DEGC or above is at least 95% of the solid state photoluminescence efficiency of the composition 25 DEG C is further disclosed. A method for preparing semiconductor nanocrystals comprises introducing one or more first shell chalcogenide precursors and one or more first shell metal precursors to a reaction mixture including semiconductor nanocrystal cores, wherein the first shell chalcogenide precursors are added in an amount greater than the first shell metal precursors by a factor of at least about 2 molar equivalents and reacting the first shell precursors at a first reaction temperature of at least 300 DEG C to form a first shell on the semiconductor nanocrystal cores. Populations, compositions, components and other products including semiconductor nanocrystals of the invention are disclosed. Populations, compositions, components and other products including semiconductor nanocrystals made in accordance with any method of the invention is also disclosed.
Patent TW-202008513-A (TW)
Title: Non-volatile memory device and method for manufacturing the same
Inventor: CHEN CHIEN-TING
IPC: H01L27/105
Filed: 2018-07-24
Abstract: A non-volatile memory device and its manufacturing method are provided. The method includes the following steps. A plurality of isolation structures are formed in a substrate. A first poly silicon layer is formed in the substrate and between two adjacent isolation structures. A first implantation process is performed to implanting a first dopant into the first poly silicon layer and the isolation structures. A portion of each of the isolation structures is partially removed, and a remaining portion of each of the isolation structures has a substantially flat top surface. An annealing process is performed after partially removing the isolation structures to diffusing the first dopant in the first poly silicon layer uniformly. A dielectric layer is formed on the first poly silicon layer, and a second poly silicon layer is formed on the dielectric layer.
Patent TW-201916005-A (TW)
Title: Interaction method and device
Inventor: Jia zi-yun
IPC: G10L17/22
Filed: 2018-08-06
Abstract: Embodiments of the present invention provide an interaction method and device. The method comprises: playing back live content selected by a user; obtaining emotional information of the user when viewing the live content; sending the emotional information to a host end corresponding to the live content; and playing back interactive content, sent from the host end, corresponding to the emotional information. For example, when it is found that a user seems boring, the live content is adjusted to singing a song, performing a dance, or playing a small game. By means of the present solution, live content is provided for a user in a live mode, and the emotion of the user during viewing of the live content is sensed for interaction with the user; live technology is combined with sensing technology, and according to the viewing emotion of the user, the content viewed by the user is adjusted in a timely manner, so as to implement effective interaction between a content providing end and a content viewing end.
Patent TW-201930029-A (TW)
Title: Carrier for robot and robot having the same
Inventor: CHEN SHENG-CHIA
IPC: B25J5/00
Filed: 2018-08-17
Abstract: The present disclosure relates to a robot, comprising: a movable base; and a torso arranged on the base. The torso comprises a first potion mounted to the base; a second portion installed to the first portion, wherein the second portion could be moved relative to the first portion; and a support substantially connected to the second portion.
Patent TW-202011069-A (TW)
Title: 光學成像鏡頭
Inventor: HSIEH TIEN-LIANG
IPC: G02B9/60
Filed: 2018-08-31
Abstract: 一種光學成像鏡頭，從物側至像側沿一光軸依序包括一光圈、一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡及一第五透鏡。光學成像鏡頭中具有屈光度的透鏡只有上述五片透鏡。 第一透鏡至第五透鏡的屈光度依序為正、負、負、負、正。第一透鏡的物側面為凸面。第二透鏡的物側面為凸面，且第二透鏡的像側面為凹面。第三透鏡的像側面為凹面。第四透鏡的物側面為凹面。
Patent TW-201916293-A (TW)
Title: Substrate for semiconductor elements and semiconductor device
Inventor: KANEKO KENTARO
IPC: H01L23/50
Filed: 2018-09-14
Abstract: A substrate for semiconductor elements includes a terminal part including a first surface, a second surface opposite to the first surface, and side surfaces joining the first surface and the second surface, and a resin part covering the side surfaces and exposing the first surface of the terminal part. The resin part has a multi-layer structure including a first resin and a second resin, and the first resin is provided in contact with the side surfaces of the terminal part. The first resin and the second resin include a filler, and an amount of the filler included in the first resin is smaller than an amount of the filler included in the second resin.
Patent TW-202013851-A (TW)
Title: Hybrid grid power energy storage circuit and method thereof
Inventor: Wang wei-xu
IPC: H02J7/35
Filed: 2018-09-21
Abstract: This disclosure is related to a hybrid-grid power energy storage circuit and method thereof. The hybrid-grid power energy storage circuit comprising a plurality of bridge circuitry with switching elements, a plurality of inductors and a plurality of capacitors. The present disclosure also has a photovoltaic terminal, a battery terminal, an utility terminal and a load terminal, thereby the hybrid-grid power energy storage circuit connecting different sources of power energy. Further the photovoltaic terminal, the battery terminal, the mains terminal and the load terminal perform different operation modes of power energy transmission with each other by through a lot of different control methods of the grid-connected energy storage circuit in the present disclosure. This disclosure can not only improve the integration degree of the whole circuit and the utilization ratio of the electric elements, but also effectively reduce the cost of the circuitry. Moreover, a seamless switching operation between the grid-tid working mode and the off-grid working mode is achieved, and the application range of the overall circuit is improved.
Patent TW-201946244-A (TW)
Title: Semiconductor packages having EMI shielding layers
Inventor: CHOI BOK-KYU
IPC: H01L23/60
Filed: 2018-11-06
Abstract: A semiconductor package may include a chip disposed on a substrate, a conductive structure disposed on the substrate to include a conductive structure frame including a side surface facing at least one side surface of the chip and to include conductive structure fingers extending from the conductive structure frame toward an edge of the substrate, and an electromagnetic interference (EMI) shielding layer covering the chip and the conductive structure and contacting a side surface of an end of one or more of the conductive structure fingers.
Patent TW-201936993-A (TW)
Title: Composite copper foil
Inventor: SATO MAKIKO
IPC: H05K3/38
Filed: 2018-11-09
Abstract: The purpose of the present invention is to provide a novel composite copper foil. A composite copper foil in which a metal layer comprising a metal layer other than copper is formed on at least part of the surface of a copper foil, wherein: projections are formed on at least part of the surface of the composite copper foil; and in a cross-section of the composite copper foil, the height of the projections is 10-1000 nm, inclusive.
Patent TW-202020392-A (TW)
Title: Method for manufacturing vapor chamber and vapor chamber structure
Inventor: CHIU CHUI-HUNG
IPC: F28D15/04
Filed: 2018-11-16
Abstract: A method for manufacturing a vapor chamber includes steps as follows. A first metal board and a second metal board are provided. A capillary structure is disposed on at least one of the first metal board and the second metal board. A supporting structure is disposed between the first metal board and the second metal board. The first metal board and the second metal board are covered correspondingly, and are welded together by high-frequency ultrasonic waves with frequency between 20 KHz to 80 KHz. Finally, a vacuuming process is processed and working fluid is filled. Therefore, the method does not need a process of sinter furnace, and the combining process is quick to increase production capacity and reduce cost.
Patent TW-201935218-A (TW)
Title: Method and device for optically representing electronic semiconductor components
Inventor: FIEDLER JENS
IPC: H01L25/16
Filed: 2018-11-21
Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.
Patent TW-201925405-A (TW)
Title: Process for producing pressure-sensitive reactive adhesive tapes
Inventor: SCHUH CHRISTIAN
IPC: B29C41/00
Filed: 2018-11-23
Abstract: The invention relates to a process for producing pressure-sensitive adhesive compositions which comprise at least one elastomer component and at least one reactive adhesive, comprising one or more reactive resins, at least one of the reactive resins being an epoxy resin, and at least one curing agent for epoxy resins, starting from one or more non-thermoplastic elastomers. The invention is characterized in that the non-thermoplastic elastomers are broken up in a planetary roller extruder with at least some of the epoxy resins.