baber/WOPTO huggingface dataset:
Patent JP-2005134426-A (JP)
Title: Fixing device
Inventor: HIROSE KAZUO
IPC: G03G15/20
Filed: 2003-10-28
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate sliding resistance between an endless belt and a pressure member and to apply sufficient distortion to a fixing roller employing a compact design.  <P>SOLUTION: The pressure member is formed by a round shaped shaft 8 which is arranged in parallel with a fixing roller 1 so that an endless belt 3 is pressed from its back surface side to the fixing roller 1 at a nip section 5. The back surface side of the shaft 8 is supported by a pair of parallel roller members 11, whose both ends of the shaft sections are supported by a holder 10, in a freely rotative manner. Thus, sliding resistance to the endless belt 3 is eliminated and sufficient distortion is added to the fixing roller 1 employing the compact design.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005135038-A (JP)
Title: System and method for application reception and exclusive application form
Inventor: KANAYAMA YUKIO
IPC: G06Q50/00
Filed: 2003-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a system and a method for application reception and an exclusive application form that lighten the burden of cashing of expenses for articles etc., on a trader side.  <P>SOLUTION: A purchaser of a magazine etc., obtains a code number imparted to each issue and uses the code number to apply for an article present on a WEB site. The WEB site side after collating the inputted code number generates a barcode 3d based upon the code number and information on the applicant to create an exclusive application form file including applicant information 3a, and application ticket sticking field 3b and 3c. A terminal of the applicant obtains and prints out the exclusive application form file to obtain an exclusive application form and thus the actual application is completed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005133228-A (JP)
Title: Mobile coordinate service method, mobile coordinate service system, and matching program used therefor
Inventor: SUZUKI MASASHI
IPC: G06Q50/00
Filed: 2003-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mobile coordinate service method which enables the coordination of user's apparel with an ornament to inspect the coordinated whole image.  <P>SOLUTION: This mobile coordinate service method comprises up-loading the data of the apparel and the ornament of a user 10 in the DB (data base) of an apparel maker or the private information DB4 of the server system 6 of a service agency 1 from the portable information communication terminal 9 or information communication terminal 11 of the user 10, accessing to the DB, reading out the image of the possessed apparel or the ornament, and collecting the apparel image or ornament image of the apparel maker, a retail store or EC (electronic commerce) site by key work retrieval. The server system 6 (matching software 5) coordinates the image of the user's apparel or the ornament with the apparel image or ornament image of the apparel maker, retail shop or EC site, and downloads the image in the portable information communication terminal or the information communication terminal.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005136587-A (JP)
Title: Antenna apparatus
Inventor: HARANO SHINYA
IPC: H01Q1/46
Filed: 2003-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an antenna apparatus integrated with an earphone which reduces the fluctuation of the impedance and gain of an antenna to the utmost and can obtain a satisfactory antenna characteristic when the earphone is used.  <P>SOLUTION: A branch part 12 is disposed in an intermediate position of earphone signal lines 19 and 15 for transmitting a sound signal from a connector part 11 to a reception part 13, and does not transmit the respective high frequency signals of a plurality of earphone signal lines but transmits the sound signal. The branch part 12 takes out an antenna reception signal received by an antenna element between the intermediate position and the reception part. A coaxial line 14 transmits the antenna reception signal taken out at the branch part to the connector part 11 by using a core wire 14.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005136283-A (JP)
Title: Tape carrier and manufacturing method therefor
Inventor: TAKAHASHI AKIHISA
IPC: H01L21/60
Filed: 2003-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tape carrier and a manufacturing method thereof, wherein in conventional methods for producing a via (opening) by using a punching process, a solder constriction phenomenon and a ball-dropping phenomenon can be decreased.  <P>SOLUTION: A tape carrier 100 comprises an insulating substrate 10 and the via (opening) 33 of a staircase structure on one face, and the insulating substrate 10 is obtained by laminating an insulating base film 11, having the opening 31 of an opening diameter R<SB>1</SB>and an insulating base film 12 having the opening 32 of an opening diameter R<SB>2</SB>, and is formed with a ball land 41a and a wiring layer on the other face. Further, a tape carrier 200 is formed with a solder resist layer 51 on the ball land 41a and the wiring layer of the tape carrier 100, and nickel and a gold membrane on the ball land in the via (opening) 33 of the staircase structure.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005131232-A (JP)
Title: Game apparatus and game method
Inventor: NODA MASATAKA
IPC: A63F13/71
Filed: 2003-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a game entertaining a beginner by the application of a dart game and having a higher game performance.  <P>SOLUTION: A game apparatus (GM1) is provided with a target (TG), a CRT (312), a card reader (CD), and a cash box (CB) on the front surface. A player inserts his/her ID card into the card reader (CD). The CRT displays information on the game, and is served as a game screen when a game making use of the dart is played. The target (TG) is hit with an arrow and also used as a tool so that a player obtains a point, area, numeral value, or the like by dart game. The game apparatus (GM1) is provided with a button (PB) used for input of a player change in the dart game, and further the button (PB) is used as an operation input switch for a control unit (100).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005133042-A (JP)
Title: Rubber composition, method for producing the same and rubber member
Inventor: NAKAZONO TAKEO
IPC: C08K3/00
Filed: 2003-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a rubber composition excellent in abrasion resistance, tensile strength and tearing strength, and a member for preventing the double-feeding of papers and paper-feeding roller consisting of the rubber composition.  <P>SOLUTION: This rubber composition contains a rubber containing an olefinic copolymer rubber and no double bonds, a filler containing a metallic ion and methacrylic acid or its ionic compound. A methacrylic acid is partially crosslinked to a main chain of the rubber while ionically bonded to the filler. The rubber compound has ≥80 and ≤95 Shore A hardness, ≥8 Mpa tensile strength and ≥10 N/mm tearing strength.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005140824-A (JP)
Title: Lens device
Inventor: HIRAKAWA AKINOBU
IPC: G02B7/02
Filed: 2003-11-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lens device preventing the nick of the straight advance groove of a fixed barrel caused by a guide roller.  <P>SOLUTION: A lens holding frame 40 is constituted by coating the guide roller 54 provided at a position where its displacement becomes maximum due to the shake of the frame 40, that is, a position where impact force to the straight advance groove 72 becomes maximum with cushioning material 56. Thus, the impact force given to the groove 72 by the roller 54 is softened by the material 56, whereby the nick of the groove 72 caused by the roller 54 is prevented.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005142258-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: HIRANO NAOHIKO
IPC: H01L23/29
Filed: 2003-11-05
Abstract: <P>PROBLEM TO BE SOLVED: To uniformly form solvent content resin on a semiconductor device in a manufacturing method of the device, with which substantially the device is molded with molded resin, after solvent content resin has been applied to the device where a pair of heatsinks are arranged on both faces of a semiconductor chip.  <P>SOLUTION: A method includes processes, wherein solvent content resin is dried by heating the device 100 by using a thermostatic oven and a drier to eliminate a temperature slope between a pair of heatsinks 20 and 30, after a process of applying a solvent content resin prior to the process of performing molding by molded resin 60.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005137501-A (JP)
Title: Game machine
Inventor: UGAWA SHOHACHI
IPC: A63F7/02
Filed: 2003-11-05
Abstract: <P>PROBLEM TO BE SOLVED: To improve the efficiency of games and an expectation for a variable display result by the participation of a player.  <P>SOLUTION: When information read from a display result storage area shows a big win display result and an order of storing the information is a predetermined order or later, a CPU of a performance control board determines whether or not executing a predetermined specific performance. When the CPU determines to execute the specific performance, a main board side determines a big win performance pattern corresponding to the order of storing numerical value data corresponding to specific determination value data in a special symbol retention/storage area and, when detecting the operation of an operating button within a button operation receiving period in the special symbol game to be executed later, this game machine performs a shortened control of shortening the variable display period of the special symbol and executes a performance, for example, of outputting sounds from speakers 8L and 8R according to the big win performance pattern.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005142411-A (JP)
Title: Method for packaging semiconductor component
Inventor: NIIMI HIDEKI
IPC: H01L21/60
Filed: 2003-11-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor component which can secure a high reliability by applying resin onto four corners of a region for packaging of the semiconductor component on a circuit substrate.  <P>SOLUTION: A resin film 6b is applied onto a region for mounting the semiconductor component 1 of a circuit substrate 3, and resin paste 6a is applied onto four corners of the region for packaging of the semiconductor component 1 of the circuit substrate 3. Thus, when the resin film 6b and the resin paste 6a are thermally set, the resin paste 6a can be stably filled at the four corners of the region of the semiconductor component 1 between the semiconductor component 1 and the circuit substrate 3 with a high reliability.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005139527-A (JP)
Title: Apparatus and method for electrodeposition coating
Inventor: NISHIO SHOICHI
IPC: C25D13/00
Filed: 2003-11-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrodeposition coating apparatus for electrodeposition-coating an arbitrary part of an article to be coated, and to provide an electrodeposition coating method therefor.  <P>SOLUTION: The electrodeposition coating apparatus 1 comprises an electrodeposition tank 9 for accommodating an electrodeposition coating liquid 7; an electrodeposition coating liquid-introducing device 26 for introducing the electrodeposition coating liquid 7 into the electrodeposition tank 9; a power source 51 for electrodepositing a paint in the electrodeposition coating liquid 7 onto the surface of the constant velocity joint 3 by passing an electric current between a constant velocity joint 3 immersed in the electrodeposition coating liquid 7 and the electrodeposition coating liquid 7 of the electrodeposition tank 9; a mask member for adhering to one part of the constant velocity joint 3 immersed in the electrodeposition coating liquid 7 in the electrodeposition tank 9 so as not to make the one part of the surface of the joint substantially contact with the electrodeposition coating liquid 7; and an air pressure-adjusting device 35 for making the mask member adhere to the one part of the surface of the constant velocity joint 3 at least while the power source 51 is passing the current, and for releasing the adhesion of the mask member to the one part of the surface of the constant velocity joint 3 while the power source 51 stops passing the current.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005146318-A (JP)
Title: Hot-rolled steel plate superior in chemical conversion treatability, and manufacturing method therefor
Inventor: HAYASHIDA TERUKI
IPC: C22C38/06
Filed: 2003-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To solve a problem that rust occurs even in a site in which a chemical conversion coating consisting of fine chemically formed crystal grains is formed, when a high-strength hot-rolled steel plate containing more Si is conversion coated as an undercoat for painting, without special constraints in a hot-rolling line.  <P>SOLUTION: This steel plate includes, by mass%, 0.03-0.15% C, 0.8-3.0% Si, 0.5-3.0% Mn, 0.07% or less P, 0.01% or less S, 0.015-0.1% Al, 0.001-0.008% N, and Ti and Nb as needed; has a mean roughness Ra of 3.0 μm or less; and has 5 or less pits due to pickling by average in each divided block of 10 μm square on the surface of the steel plate. The manufacturing method includes immersing the hot-rolled steel plate in a pickling liquid of 7-15% HCl at a solution temperature of 80 to 95°C for such a period of time as to make HCl concentration (mass%)×immersion time (second) into the range between 270 and 500.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005143751-A (JP)
Title: Optional member fitting structure and fixture
Inventor: MATSUSATO HISAAKI
IPC: A47B13/00
Filed: 2003-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optional member fitting structure and a fixture providing an optional member with wide versatility while retaining the external appearance.  <P>SOLUTION: The optional member 4 and the fixture 5 constitute a first engagement part A horizontally slidably engaged and a second engagement part B engaged in a front/rear directional swinging range allowed by the first engagement part A, the vertical direction is positioned by engaging the first engagement member A and the horizontal direction is positioned by engaging the second engagement B.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005145336-A (JP)
Title: Device for prevention of lane departure
Inventor: OZAKI SHINKO
IPC: B60R1/00
Filed: 2003-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To perform control for prevention of lane departure in the optimum way.  <P>SOLUTION: In this device for prevention of lane departure, superelevation of a driving passage is detected (step S3), and tendency of departure of the own vehicle from the driving lane is determined (step S4). Start timing for control for avoiding departure is set based on the superelevation of the driving passage, and in a case where the vehicle has tendency of departure from the driving lane, control for avoiding departure is started at above start timing for avoiding departure (steps S6-S9).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004291089-A (JP)
Title: Molten metal supply device for die-casting machine and molten metal supply method and ladle therefor
Inventor: ONUMA ISAMU
IPC: B22D17/20
Filed: 2003-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the life of a sleeve for a die-casting machine from being shortened due to the local heating of the sleeve.  <P>SOLUTION: The molten metal supply device for a die-casting machine has a ladle 2 equipped with a storing section which stores molten metal and a conveying device which conveys the ladle 2 to a given supply position of the sleeve 104 and tilts the ladle so that the molten metal drawn into the ladle is poured into the sleeve 104. The molten metal is poured into the sleeve 104 while the position of the tip 2e of the ladle lip against the sleeve 104 is varied according to variation in the posture of the ladle 2.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004297762-A (JP)
Title: Common-mode feedback circuit and differential operational amplifier circuit
Inventor: KUDO MASAHIRO
IPC: H03F3/45
Filed: 2003-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To solve a conventional problem that the stability of a common-mode feedback system is lowered as a high-speed operation in a differential mode is disturbed when a resistance value of an impedance element used for voltage division is set to be large although high input impedance is required for a common-mode feedback circuit.  <P>SOLUTION: A common-mode feedback circuit 1 for outputting a control voltage that specifies an operating point of a fully differential amplifier 2 in a common mode is provided with a voltage dividing circuit 3 for dividing a voltage into two output terminals OP, OM of the fully differential amplifier and a differential amplifier 4 for inputting an output voltage (NP) of the voltage dividing circuit and a reference voltage Vref (NM), and the output voltage of the differential amplifier is defined as the control voltage of the fully differential amplifier.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005118978-A (JP)
Title: Super-abrasive electrodeposited abrasive having structure of super-abrasive electrodeposited substrate and structure of patterned electrodeposited surface
Inventor: NAKAGAWA MASAYUKI
IPC: B24D3/00
Filed: 2003-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To solve the following problems: (1) a conventional substrate of a super-abrasive electrodeposited abrasive is formed of a metallic steel having the shape of a grindstone or the like, which is electrodeposited with a super-abrasive or the like, as an electrodeposited substrate, but the resultant substrate does not exert elasticity at all at the time of grinding and has only a coarse grinding surface, resulting in production of abnormally large noise at the time of the grinding, to thereby bring about heavy fatigue to the operator during the grinding; (2) when an electrodeposited thin metal plate is bent, an electrobonded metal has high rigidity, and therefore the metal plate is broken at an electrodeposited surface: and to provide a super-abrasive electrodeposited abrasive which has a glass fiber laminate coated with foil of a metal such as copper as the electrodeposited substrate, and a structure having a pattern on the electrodeposited surface.  <P>SOLUTION: The super-abrasive electrodeposited abrasive is produced by electrodepositing the glass fiber laminate coated with foil of a metal such as copper, with the super-abrasive, as the electrodeposited substrate, and patterning the electrodeposited surface. As a result, the electrodeposited substrate exerts elasticity and has a fine grinding surface, leading to reduction in noise during the grinding. Further by thinning the thickness of the electrodeposited substrate, and patterning the electrodeposited surface, bending work is facilitated, to thereby expand the range of application of the abrasive.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004168064-A (JP)
Title: Manufacturing method for molded body fixed and bonded to roughened or structured molded skin, and device for carrying out the method
Inventor: GERKEN ANDREAS
IPC: B29C44/14
Filed: 2003-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a molded body fixed and bonded to a molded skin which can be economically manufactured by using tools as few as possible.  <P>SOLUTION: The manufacturing method for the molded body fixed and bonded to a roughened or structured molded skin (15) comprises a process of (a) inserting an elastic skin (3) having the surface-roughening or structuring in an inner side (3a) into a receiving mold (7), a process of (b) giving a liquid plastic film to the inner side (3a) of the elastic skin (3) subjected to surface-roughening and structuring, a process of (c) curing the liquid plastic film, a process of (d) foam-molding back to back with the molded skin (15) and a hard bonding between the molded body and the molded skin, a process of (e) removing the whole assembly consisting of the elastic skin (3), the molded skin and the molded body from the receiving mold (7) located at the bottom of the tool and a process of (f) separating the elastic skin from the molded skin.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005157454-A (JP)
Title: One-chip microcomputer and method for manufacturing one-chip microcomputer
Inventor: YAMADA JUN
IPC: G06F15/78
Filed: 2003-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a one-chip microcomputer for reducing a loss even at the time of changing the quantity of production in the course of a manufacturing process.  <P>SOLUTION: A one-chip microcomputer 1 is provided with a decoder circuit 6 for controlling at least one partial region of an ROM 3 in which a program executed by a CPU 2 is stored to be selected by different memory addresses. The partial wiring of the decoder circuit 6 is wired by a manufacturing process posterior to a process for storing a program in the ROM 3, and at least one of regions accessible from the CPU 2 in the ROM 3 is decided.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005155033-A (JP)
Title: Pool floor
Inventor: OZAWA HIDEO
IPC: E04H4/06
Filed: 2003-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a simply constituted pool floor for easily developing and folding up respective legs, firmly supporting the legs so that a position is not dislocated even if the legs are placed only on a pool floor surface in use, and performing infiltration of water in sinking and dripping of water when taken out of a pool, even if there is a creeping-in preventive plate, needles to say to prevent a child from creeping under a floor plate by the creeping-in preventive plate.  <P>SOLUTION: At least two legs 200 are juxtaposed in the same direction, and the creeping-in preventive plate 70 is installed on a leg plate or an extracting leg plate for constituting these respective legs 200.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005154519-A (JP)
Title: Resin composition and its molded product
Inventor: INOUE NORIHIDE
IPC: D06N7/00
Filed: 2003-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a foamed resin sheet and a resin composition suitable for manufacturing a wall paper laminated on a paper substrate.  <P>SOLUTION: The resin composition is composed of 1-100 wt.% ethylene-α-olefin copolymer (A) having an MFR(I<SB>2</SB>) and an MFR(I<SB>10</SB>) measured with a load of 10 kg which meet the formula: -2.2×ln(I<SB>2</SB>)+20≥I<SB>10</SB>/I<SB>2</SB>≥-2.2×ln(I<SB>2</SB>)+10 melt tension (MTa, unit mN) and the I<SB>2</SB>which meet the formula: 500×(I<SB>2</SB>)<SP>-0.86</SP>≥MTa≥40×(I<SB>2</SB>)<SP>-0.86</SP>, and a density of 0.860-0.895 g/cm<SP>3</SP>, 99-0 wt.% ethylene-α-olefin copolymer (B) having a density of 0.850-0.940, and 0-50 wt.% low density polyethylene (C) [provided that the sum of (A), (B), and (C) is 100 wt.%] and, in addition, 10-200 pts. wt., based 100 pts. wt. sum of the above (A), (B), and (C), inorganic filler (D), and is used for the foamed resin sheet.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005153278-A (JP)
Title: Warmth-sensitive member and its manufacturing method
Inventor: SUGIOKA YOSHIHIKO
IPC: E03C1/20
Filed: 2003-11-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a warmth-sensitive member excellent in antistaining properties and abrasion resistance without applying troublesomeness to a user.  <P>SOLUTION: The waterproof pan for a bathroom is equipped with a base part 1 and a heat insulating part 5, which has voids 3a, 3b, 4a and 4b integrally provided on the base part 1 on the surface side thereof. In this waterproof pan, the voids 3a and 3b on the surface side of the heat insulating part 5 have a diameter smaller than that of the voids 4a and 4b on the deep side of the heat insulating part 5.  <P>COPYRIGHT: (C)2005,JPO&NCIPI