Patent EP-2299324-A1 (EP)
Inventor: LANDIS STEFAN
IPC: G03F7/00
Filed: 2010-09-14
Abstract: Heating mold for thermal nanoimprint lithography comprises: (a) a substrate (21) having a first principal surface and a second principal surface; (b) a thermally conducting layer (33); (c) an insulating layer (30) disposed beneath the thermally conducting mechanical support layer; (d) heating means (34) disposed on a second side of the second membrane in a zone of the second membrane above the second orifice; (e) an electrically and thermally insulating layer; (f) imprint patterns (37); and (g) means for supplying an electric current to the heating means. Heating mold for thermal nanoimprint lithography comprises: (a) a substrate having a first principal surface and a second principal surface, and a through-cavity extending from a first orifice in the first principal surface up to a second orifice in the second principal surface, the first principal surface being at least partially covered by a first membrane, and the second orifice being completely closed off by a second electrically and thermally insulating membrane with a first disposed in contact with the second principal surface and at least partially covering the second surface; (b) a thermally conducting layer that mechanically supports the second membrane on the first side of the second membrane above the second orifice; (c) an insulating layer disposed beneath the thermally conducting mechanical support layer; (d) heating means disposed on a second side of the second membrane in a zone of the second membrane above the second orifice; (e) an electrically and thermally insulating layer which covers the heating means and, at least partially, the second membrane; (f) imprint patterns disposed on the electrically and thermally insulating layer in a zone of the electrically and thermally insulating layer above the second orifice; and (g) means for supplying an electric current to the heating means. Independent claims are: (1) a process for producing mold comprising: (a) forming a thermally conducting and mechanical support layer in a zone of a first principal surface of a substrate; (b) depositing a first membrane on a second principal surface of the substrate; (c) depositing a second electrically and thermally insulating membrane on the first principal surface; (d) depositing an electrically resistive heating layer on a zone of the second membrane above the thermally conducting and mechanical support layer; (e) shaping the electrically resistive heating layer; (f) depositing an electrically and thermally insulating layer on the shaped, electrically resistive heating layer and onto the second membrane; (g) producing imprint patterns on the electrically and thermally insulating layer; (h) forming at least one lead for supplying electric current to the electrically resistive heating layer; and (i) etching the first membrane, then forming a cavity in the substrate from a first orifice in the second principal surface up to the thermally conducting mechanical support layer, in a zone of the first principal surface; and (2) a process for producing a substrate comprising a nanostructured surface by thermal nanoimprint lithography, where the mold is employed.