baber/WOPTO huggingface dataset:
Patent JP-H08300114-A (JP)
Title: Nozzle for twin belt type continuous casting machine
Inventor: KOMORI TOSHIYA
IPC: B22D11/06
Filed: 1995-05-08
Abstract: PURPOSE: To effectively attenuate spouting jet flow and to prevent the longitudinal crack on a cast slab by forming the cross section of a nozzle in a flat cylindrical shape and the lower end corner parts of a spouting hole of the nozzle in a curved shape and providing a partition wall inside the center of the nozzle. CONSTITUTION: The cross section of the nozzle for a twin belt type continuous cast machine is formed in a straight type flat shape of the flat cylinder over the whole length. The curved shape is given to the short wall side of a mold on the lower end corner parts 5 of spouting hole of this nozzle. further, a partion wall 4 is arranged in the inner part at the center of the nozzle in the depth direction of the nozzle. Then, the depth of the notch provided at the lower end corner parts 5 of spouting hole of the nozzle is made to be about 40-60mm from the lower end. By this constitution, the spouting flow just below the flat nozzle is restrained and the molten steel flow rate is uniformized in the width direction and the uniformity of solidification at the initial stage is attained.  Further, the molten steel from the spouting hole 9 arranged at both sides is divided into two flows from the tip end part of the nozzle with the partion wall 4.
Patent JP-2000317355-A (JP)
Title: Powder coating apparatus and powder coating method for automotive body
Inventor: HAJIMA MASAYUKI
IPC: B05D7/14
Filed: 1999-05-13
Abstract: PROBLEM TO BE SOLVED: To provide a powder coating apparatus and a powder coating method capable of improving the finishing appearance of coated face of an automotive body. SOLUTION: A carrier truck 13 supporting an automotive body 12 comprises a mounting stand 15 and a transporting mechanism 17 provided with wheels. The mounting stand 15 can mount an automotive body while slantingly keeping the whole object face of an automotive body to be coated in the horizontal direction. The inclination angle of the mounting stand is made changeable by a posture adjusting mechanism 16 comprising a hydraulic cylinder 18 and a cylinder rod 19. Coating robots 25 each comprising an arm 26 provided with an electrostatic powder coating gun 28 at the tip end are installed in both ends of the carrier truck 13.
Patent JP-H01304349-A (JP)
Title: Thermal analysis apparatus
Inventor: SENDA TETSUYA
IPC: G01N25/20
Filed: 1988-06-01
Abstract: PURPOSE:To decrease measurement errors by axisymmetrically forming sample supporting bases for mounting a sample and standard sample on a sample mounting section and connecting thermocouple wires respectively to the sample supporting bases. CONSTITUTION:A heat sensitive plate 2 consisting of a platinum-rhodium alloy is horizontally disposed in a furnace body 1. A sample vessel 5 and a standard sample vessel 6 are mounted on the supporting bases 3, 4 which are axisymmetrically formed to the central part of the heat sensitive plate 2 and the ends of thermocouple wires 7, 8 consisting of the gold-palladium alloy are respectively attached to the rear surfaces of the bases 3, 4. These thermocoupler wires 7, 8 are connected to a differential temp. detector 9. The platinum-rhodium thermocouple wire 10 connected to the base 3 on which the vessel 5 is placed and the thermocouple wire 7 are connected to a detector 11 for the sample temp. The furnace body 1 is hermetically closed by a cap body 12 and the furnace body 1 is housed in an electric heater and is gradually increased in temp. at a prescribed rate, by which the differential temps. between the sample and the standard sample at the respective temps. are detected.
Patent JP-H09321394-A (JP)
Title: Wiring board
Inventor: TSUKAMOTO KATSUHIDE
IPC: H05K3/34
Filed: 1996-05-28
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board excellent in connection reliability by preventing the exfoliation and breakage caused by bending and warp of the wiring board, at connected parts of a semiconductor device with a wiring board, especially a flexible wiring board, for mounting various kinds of surface-mount electronic parts to constitute an electronic circuit. SOLUTION: The mechanical strength of a wiring board 15 is increased since reinforcing material 65 having holes 6 are fixed to the positions of a group of electrode pads 4 of a board 1 on which wiring patterns 2 etc., are formed, and surface mount semiconductor device fitting parts are reinforced with the reinforcing materials 5. And the wiring board 15 neither bend nor warp. And it becomes possible to prevent the exfoliation and breakage of the junctions of the electrode terminals of the semiconductor devices to the group of electrode pads 4, and it is effective for increasing the reliability of semiconductor devices and electronic apparatuses.
Patent JP-S63295075-A (JP)
Title: Production of composite electrode tip for resistance welding
Inventor: HAMAMOTO HIROSHI
IPC: B23K35/40
Filed: 1987-05-27
Abstract: PURPOSE:To obtain an electrode tip having a long life at a low cost with good workability by packing dispersion strengthened copper alloy and pure copper or copper alloy powder in the form of lamination into a metallic mold, subjecting the powders to compression molding and molding the same to the electrode by cold working after hot forging. CONSTITUTION:The dispersion strengthened copper alloy powder and the pure copper powder are packed into the metallic mold for powder molding and are molded under the prescribed pressure to obtain a preform A1 for the compression-molded electrode tip consisting of the two layers of the dispersion strengthened copper ally part 1 and the pure copper part 2. This preform A1 is heated and is then subjected to the hot forging under pressurization by using a forging die and a punch having a spherical part in the front end part in such a manner that the spherical part side consists of the dispersion strengthened copper alloy part 1 to obtain a forging A2. This forging A2 is subjected to cold forging to form a water cooled end part in the pure copper part 2, by which the electrode tip A is obtd. The composite electrode tip for resistance welding having a long life is thereby obtd. with the good workability.
Patent JP-S61293300-A (JP)
Inventor: TANAKA YOSHIO
IPC: C11D9/02
Filed: 1985-06-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10306730-A (JP)
Title: Outboard engine
Inventor: KASHIMA YUKINORI
IPC: F02B61/04
Filed: 1997-05-08
Abstract: PROBLEM TO BE SOLVED: To provide an outboard engine capable of preventing water droplets from entering from a starter rope to an air inlet without increasing the number of component parts. SOLUTION: An outboard engine comprises: cowlings 1, 2 having an engine chamber inside; a manual starter 78 which is disposed above an engine and rotates a crankshaft; a starter case 76 covering the upper portion of the manual starter 78; a starter rope 79 being wound around the manual starter 78 and having a tip extending forward through the starter case 76 and the cowlings 1, 2; and a silencer 48 for sucking air inside the engine chamber through an air inlet. An extension part 77 formed integrally with the starter case 76 extends forward beyond the air inlet of the silencer 48 under the starter rope 79.
Patent JP-S5658990-A (JP)
Title: Surface treating method of titanium and titanium alloy
Inventor: EKOSHI YOSHIAKI
IPC: C25D11/26
Filed: 1979-10-15
Abstract: PURPOSE: To obtain titanium of superior abrasion resistance by subjecting the surface finished titanium to Tiduran treatment then surface treating the same under specific anodic oxidation conditions.  
     CONSTITUTION: The object to be treated which is surface finished titanium and titanium alloy is surface treated by the Tiduran method to have higher surface hardness. It is cleaned and while maintaining the surface hardness, it is surface treated by an anodic oxidation method. The anodic oxidation is carried out under the conditions such as mixed liquid of 12W30% sufuric acid and water for the treating liquid, 14W20V voltage, 5W60min holding time, 16W25°C treating liquid temperatures, and the surface is colored to a blue or water color. Titanium is used for anode and silver, platinum or titanium for cathode. Thereby, the titanium or titanium alloy of superior abrasion resistance and uniform and beautiful surfaces is obtained. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-S63298276-A (JP)
Inventor: YOKOI KENYA
IPC: G09F9/00
Filed: 1987-05-28
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S62292648-A (JP)
Title: Production of optical fiber base material
Inventor: ONO RYOICHI
IPC: G02B6/00
Filed: 1986-06-09
Abstract: PURPOSE:To produce the title optical fiber base material having a precisely controlled refractive index distribution by sintering a fine glass particle aggregate obtained by forming the glass component of SiO2 on the outer peripheral part of a dopant at the central part, deforming the material, and then clearly vitrifying the material. CONSTITUTION:SiCl4 as the glass material is supplied from a synthesis torch 8 in a protective vessel 10 provided with an exhaust controller 13, GeH4 as the dopant material and gaseous H2 and O2 for flaming are supplied, and SiCl4 as the glass material and gaseous H2 and O2 for flaming are supplied from a synthesis torch 9. The respective materials are hydrolyzed and thermally oxidized by the oxyhydrogen flame, and the fine glass particles of SiO2 and the dopant of GeO2 are synthesized. Consequently, a fine glass particle aggregate 11 consisting of the core part obtained by depositing fine SiO2 particles contg. GeO2 at the central part and the clad part obtained by depositing fine SiO2 particles on the outer peripheral part is formed on a starting member 12. The aggregate 11 is sintered and clearly vitrified to obtain an excellent optical fiber base material.
Patent JP-H0372-A (JP)
Title: Exchange method for container for medical treatment
Inventor: SUZUKI KENSUKE
IPC: A61M1/10
Filed: 1989-05-26
Abstract: PURPOSE:To reliably maintain a sterile state in a tube by a method wherein the first connector of the tube is connected to a second connector mounted to the tip of a container tube to effect medical treatment, the container tube is closed, the tube is cut in a position on the container side of the blocked part. CONSTITUTION:After first and second connectors 4 and 9 are interconnected, an injection liquid bag 5 is suspended from an elevated place. Dialyzing liquid is injected in an abdominal cavity 20 through a bag tube 6, a transfer tube 3, and an abdominal cavity catheter 1. After injection of liquid, the transfer tube 3 is closed by means of a clamp 31 to block the reverse flow of dialyzing liquid. The bag tube 6 is closed to form closed parts 61 and 62, and by cutting the bag tube 6 in a position on the bag 5 side of the blocked part 61 located in the vicinity of the second connector 9, the bag 5 is separated. A short tube 63 being a part of the bag tube and the second connector 9 engaged therewith are left on the second connector 9 side, and a remaining part is utilized as an antibacterial protecting apparatus 7.
Patent JP-S5358295-A (JP)
Title: Gas detector
Inventor: KUBOTA KAZUNARI
IPC: G01N27/16
Filed: 1976-11-06
Abstract: PURPOSE: To make inactivation effect perfect and stable with time, simplify production and make possible volume production by depositing silver to carriers carried on platinum filaments. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-H02310679-A (JP)
Title: Semiconductor shape processing device
Inventor: TANAKA KATSUHIKO
IPC: G06T19/00
Filed: 1989-05-25
Abstract: PURPOSE:To represent an optional semiconductor shape, and in addition, to easily transform it by using a representing method for a three-dimensional semiconductor shape by triangle-pole-division. CONSTITUTION:Optional polyhedron-approximated semiconductor element structure can be represented by a data structure group shown in a table 1 by dividing each solid into triangles. The data structure 1 is for searching the solid made of, for instance, Si or Al, the data structure 2 is for investigating the material of the solid, the data structure 3 is for retrieving a neighboring state between the solids and a surface set constituting an interface between the neighboring solids, the data structure 4 is for retrieving a triangle pole group to constitute the solid, and the data structure 5 is for investigating the solid to which the triangle pole belongs. In the case of data update on account of the change of the shape, at first, the solid number of an uppermost layer made of an air layer is searched from the data structure 1. Next, the interface with the solid made of Si is obtained from the data structure 3, and the material of the neighboring solid is known from the data structure 2. The position of the interface can be investigated from the data structures 8 to 10. The transformation of the shape can be represented by moving the interface vertically.
Patent JP-H09314532-A (JP)
Title: Inorganic cured body and its manufacture
Inventor: KUBO MASAAKI
IPC: B28B3/02
Filed: 1996-05-28
Abstract: PROBLEM TO BE SOLVED: To enable the creation of an appearance from which a feeling of nature overflows by a method in which a green sheet made from aqueous slurry and coating concrete which is laminated on the green sheet are formed, and they are integrated by compression. SOLUTION: An inorganic cured body is obtained since coating concrete 1 and a green sheet 7 are integrated by compression. The strength of the inorganic cured body obtained by being cured with the green sheet 7 made from aqueous slurry 3 can be kept higher than an ordinary value, while the cured body produced by being cured with the coating concrete 1 laminated on the green sheet 7 can create an appearance from which a feeling of artificiality and imitation is excluded. In other words, the inorganic cured body and its production method can create an appearance from which a feeling of nature overflows.
Patent JP-S5467890-A (JP)
Title: Neutron detector
Inventor: KUBO TOORU
IPC: G21C17/10
Filed: 1977-11-09
Abstract: PURPOSE: To set the inserting position of neutron flux detector simply, by means of cutting the screw engaging with a regulating ring for micro-regulating at the outer circumference of a transfering wheel which is screwed with a rotation axis, and of setting up a groove at the regulating ring.  
     CONSTITUTION: For effecting the setting, a lock pin 30 is first taken out, and a rod 19 for rotation stopping is drawn out, and a neutron flux detector is allowed to be stopped to the upper limit or the lower limit in a state that a tranfering wheel 18 may be not rotated along with a rotation axis 22 and be moved at left and right. Then, after the rough regulating by means of allowing the transfering wheel 18 to be rotated, and of allowing a micro-switch 27 of the upper limit or the lower limit to be moved near at the operating position, the rod 19 for rotation stopping is inserted. Next, the neutron flux detector is allowed to be stopped at the position of the upper limit or the lower limit, and loosen a setscrew 28 of the regulating ring 20, and regulate by the regulating ring 20 so as that the micro-switch 27 of lower limit or upper limit may be operated, and the regulating ring 20 is fixed by  the setscrew 28 in the optimum groove of the transfering wheel 18. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-H11320707-A (JP)
Title: Production of shoes having reinforced parts and shoes thus produced
Inventor: ODA NORIO
IPC: B29D35/00
Filed: 1998-05-15
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing shoes having partially reinforced parts in toe parts, heel parts, and others and shoes produced by the method. SOLUTION: In a method for producing shoes having reinforced parts 28 between vamp 12 and back leather 14, before/after the vamp 12 and the back leather 14 being sewn together, a liquid reinforcing material 26, which can be solidified, is applied by spraying on a place corresponding to at least one reinforced part of the vamp or the back leather, the vamp 12 and the back leather 14 are laminated and hung into an insole 44. After that, the reinforcing material is solidified to form the reinforced parts 28.
Patent JP-H06323928-A (JP)
Title: Wireless high-temperature sensor
Inventor: OSHIMA TAKESHI
IPC: G01K1/02
Filed: 1993-05-12
Abstract: PURPOSE:To perform a temperature measurement up to a specific temperature by a method wherein a wireless high-temperature sensor is constituted of a vibrating body, a base, an airtight case and an adhesive which are made of materials adapted to a temperature to be measured. CONSTITUTION:When a temperature up to about 500 to 700 deg.C is measured, the base part of a quartz tuning fork-type electrodeless vibrator 2 is bonded and fixed to the plane of a nickel, stainless-steel or titanium base 1 by using a Kovar glass or a ceramic adhesive 3, a cap 4 whose material is the same as that of the base 1 is pressed into the base in a vacuum or in an Me atmosphere, and the outer circumference of a bonded part is seam-welded or welded by an electron beam. When a heating operation exceeding 700 deg.C and a cooling operation are repeated, the physical property of the quartz vibrator is changed. When titanium or platinum is selected as the material for the base 1 and the cap 4 instead of a sapphire single crystal 2', it is possible to easily measure a temperature up to about 1000 deg.C.
Patent JP-S61290047-A (JP)
Inventor: NEGI TAICHI
IPC: B32B27/28
Filed: 1985-06-18
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10326965-A (JP)
Title: Manufacture of multilayered wiring board
Inventor: TAKEUCHI KATSUYUKI
IPC: H05K3/34
Filed: 1997-05-23
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayered wiring board, wherein an electronic component such as a semiconductor element and a capacitance element can be rigidly connected with a bonding pad without changing the characteristics. SOLUTION: Organic resin insulating layers and thin film wiring conductor layers 3 are alternately laminated on a board, and the thin film wiring conductor layers 3 positioned in the upper part and the lower part are electrically connected via a through hole conductor formed on the organic resin insulating layers. A bonding pad 11 which is electrically connected with the thin film wiring conductor layer 3, and with which an electrode of an external electronic component is connected is formed in a hole 10 formed on an organic resin insulating layer 2a of the uppermost layer. A copper layer 13 is stuck on the bonding pad 11. Nonelectrolytic solder plating wherein solder is substituted for copper is performed to the copper layer 13, and the copper layer 13 is changed to a first solder layer 15. Finally, a second solder layer 16 is stuck on the first solder layer 15 by using an electrolytic plating method, and a solder bump is formed.
Patent JP-S5359378-A (JP)
Title: Semiconductor unit
Inventor: WADA YASUO
IPC: H01L27/04
Filed: 1976-11-10
Abstract: PURPOSE: To improve reliability with protecting an Al film from corrosion to avoid disconnection, by putting a polycrystal Si layer-which is not polluted by alkaline metals and has a good contact with Al-between a PSG film and Al wiring. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-H087332-A (JP)
Title: Information recording medium and reading device
Inventor: TAKAHASHI KOICHI
IPC: G11B7/24079
Filed: 1994-06-16
Abstract: PURPOSE:To prevent the deterioration of the printing quality of patterns due to abrasion and at the same time to reduce the influence of dust and scratches upon the reading of patterns. CONSTITUTION:An optically almost-transparent protective film 14 provided on the surface of an information recording medium 10 on which dot patterns 12 are printed prevents the deterioration of the printing quality of the dot patterns 12 due to abrasion. Further, the protective film 14 is formed so as to have such an optical thickness that the contrast of the dot patterns 12 is lowered by a predetermined quantity. Thereby, dust 30 which adheres onto the protective film 14 and scratches make an out-of-focus image on the surface 22 of an image pick-up element, so that the influence of dust and scratches upon the reading of the dot patterns 12 my be reduced.
Patent JP-S63299021-A (JP)
Title: Sensor leaf switch
Inventor: MIYATA TOMOYOSHI
IPC: H01H3/46
Filed: 1987-05-29
Abstract: PURPOSE:To make it possible to lower a detection probe accurately vertically by setting four nodes on contact point springs so as to form a parallelogram from the outer circumference of which the detection probe is extended and by linking a part of the inner circumference of the parallelogram to a movable contact point spring. CONSTITUTION:Forming a parallelogram B by connecting nodes (a)-(d) set on contact point spring pieces 2a, 2b to each other, a detector probe 3 is extended from the outer circumference of the parallelogram and a part of the inner circumference of the parallelogram is linked 4 with the movable contact point pieces 2a, 2b. With this constitution, the detection prove 3 can be lowered vertically while the parallelogram B is mainstaining its parallelism as each side deflects about its node when a downward load P is applied. At the same time, the movable contact point spring pieces 2a, 2b linked to the parallelogram deflect to open/close the contact point.
Patent JP-S62290251-A (JP)
Title: Handfree telephone set
Inventor: TOMIOKA YASUHIRO
IPC: H04M1/60
Filed: 1986-06-10
Abstract: PURPOSE:To prevent a side tone, and a howling, by generating an offset current having the negative phase of a transmission/reception current based on the latter, and overlapping it on the transmission/reception current, in a telephone set in which a transmission/reception is performed by a microphone, and a speaker provided on a telephone set main body. CONSTITUTION:By inputting a sound from a microphone 10, a sound signal is phase-advanced by a phase advancing circuit 30, and is amplified at a positive inversion amplifier 50, and a positive(continuous line) sound signal is outputted toward a point C, and a negative (dotted line) sound signal, toward a point B. Simultaneously, a phase-advanced sound signal is changed to the one with the negative phase (dotted line) by an inversion amplifier 60, and it is overlapped on, the positive sound signal at a point D, thereby, the side tone is prevented. Prior to the above, the phase-advanced sound signal is level-controlled by the negative sound signal fedback at a point A, and its gain is adjusted so that an offset effect between the positive and the negative phases arrives at a prescribed level. As a result, the sound outputted from a speaker 20 is decreased to a micro level, and the howling can be prevented. Also, the sound signal between the points B and C is sent out onto a line. telephone line.
Patent JP-2000031440-A (JP)
Title: Manufacture of soi wafer
Inventor: BARLOCCHI GABRIELE
IPC: H01L21/762
Filed: 1999-05-14
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a SOI wafer with a complete single-crystal substrate, having advantages inherent in conventional technology, at a competitive price and complying with present standards. SOLUTION: A method for manufacturing a SOI wafer has a step for forming a doped region 18 on a single-crystal substrate 2, a step for growing an epitaxial layer, a step for forming grooves 25 in the epitaxial layer regarding the doped region 18, a step for forming porous silicon region by anodizing the doped regions 18 in an electrochemical electrolytic cell, a step for oxidizing the porous silicon regions, a step for forming embedded air gaps by eliminating the oxidized porous silicon regions, a step for growing oxide regions from walls of the embedded air gaps and grooves 25 until the wafer 15 is oxidized through heating and the air gaps and the grooves 25 themselves are completely filled.