Patent GB-1015868-A (GB)
Title: Improved adhesive compositions based on glycol acrylate esters
IPC: C09J4/00
Filed: 1964-03-18
Abstract: Adhesive compositions comprise a diester of acrylic acid or a substituted acrylic acid, e.g. methacrylic acid, and a water-soluble glycol in admixture with a fatty glyceride drying oil. Suitable glycols for forming the diester are 2,2 - dimethyl - 1,3 - propanediol (neopentyl glycol), tetraethylene glycol, triethylene glycol, ethylene glycol, diethylene glycol and the propylene and butylene homologues thereof. Drying oils specified are perilla, oiticica, linseed, tung and soybean oils.  The composition may also comprise a polymer which is soluble in the diester and in the interpolymer of the diester and drying oil, e.g. polystyrene, polymethyl methacrylate, styrene-maleic acid (or anhydride) copolymer, polydiallyl phthalate, chlorinated rubber and copolymers of ethyl or methyl acrylate or methacrylate with acrylonitrile; alternatively, the composition may comprise a corresponding monomer. Preferably, the diester, drying oil and additional monomer, if present, are partially interpolymerized. The compositions can be cured by adding thereto a polymerization initiator, e.g. a peroxide or hydroperoxide (several specified). A polymerization inhibitor may also be included, e.g. hydroquinone, pyrogallol, quinhydrone, or the monoethyl, monophenyl or monotertiary butyl ether of hydroquinone. The compositions are suitable for bonding nuts and bolts, and also for joining ends of pipes which would normally be welded or soldered together.  An example illustrates compositions based on tetraethylene glycol dimethacrylate and linseed oil, with or without polystyrene, and including as polymerization initiator a mixture of diisopropylbenzene hydroperoxide and methyl ethyl ketone peroxide.ALSO:Adhesive compositions comprise a diester of acrylic acid or a substituted acrylic acid, e.g. methacrylic acid, and a water-soluble glycol in admixture with a fatty glyceride drying oil. Suitable glycols for forming the diester are 2,2-dimethyl-1,3-propanediol (neopentyl glycol), tetraethylene glycol, triethylene glycol, ethylene glycol, diethylene glycol and the propylene and butylene homologues thereof.  Drying oils specified are perilla, oiticica, linseed, tung and soybean oils. The composition may also comprise a polymer which is soluble in the diester and in the interpolymer of the diester and drying oil, e.g. polystyrene, polymethyl methacrylate, styrene-maleic acid (or anhydride) copolymer, polydiallyl phthalate, chlorinated rubber and copolymers of ethyl or methyl acrylate or methacrylate with acrylonitrile; alternatively, the composition may comprise a corresponding monomer.  Preferably, the diester, drying oil and additional monomer, if present, are partially interpolymerized. The compositions can be cured by adding thereto a polymerization initiator, e.g. a peroxide or hydroperoxide (several specified). A polymerization inhibitor may also be included, e.g. hydroquinone, pyrogallol, quinhydrone, or the monoethyl, monophenyl or monotertiary butyl ether of hydroquinone.  The compositions are suitable for bonding nuts and bolts, and also for joining ends of pipes which would normally be welded or soldered together.  An example illustrates compositions based on tetraethylene glycol dimethacrylate and linseed oil, with or without polystyrene, and including as polymerization initiator a mixture of diisopropyl benzene hydroperoxide and methyl ethyl ketone peroxide.