Patent SG-11201909474X-A (SG)
Title: Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
Inventor: LI TONG
IPC: H01L21/02
Filed: 2018-04-12
Abstract: HIGHTHROUGHPUT LOW MAUNAL HANDLING Single-Platen Polish Process versus Conventional P+2P (Two-Platen) Polish Process Figure 1. Single > \" * 4 4*113:1 411 4* Polls 1 V' Manual W O 20 18/ 19 1485 Al Single Platen Polish 1 , Manual Transfer EMS K OUT MI r> 1 4E> P1 Polishing P2 Polishing 04* ' 1211 Atianual Transfer lit DISK Pol D I\" Manuel 2. fttlenual Transfer Transfer OUT CONVENTIONAL (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 18 October 2018 (18.10.2018) WI P0 I PC T omit VIII °nolo mu VIII Eno oimIE (10) International Publication Number WO 2018/191485 Al (51) International Patent Classification: H01L 21/321 (2006.01) H01L 21/02 (2006.01) H01L 21/304 (2006.01) (21) International Application Number: PCT/US2018/027281 (22) International Filing Date: 12 April 2018 (12.04.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/485,444 14 April 2017 (14.04.2017) US (71) Applicant: CABOT MICROELECTRONICS CORPO- RATION [US/US]; 870 North Commons Drive, Aurora, Illinois 60504 (US). (72) Inventors: LI, Tong; Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US). LAU, Hon Wu; Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US). (74) Agent: OMHOLT, Thomas; Cabot Microelectronics Cor- poration, 870 North Commons Drive, Aurora, Illinois 60504 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4. 1 700) (54) Title: CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE = SURFACE (57) : Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel phosphorus (NiP) surfaces for hard disk applications. SINGLE PLATEN POLISH Single Platen Polish Single Platen Polish [Continued on next page] WO 2018/191485 Al MIDEDIMOMMIDEFIEDMOMMOIDIFIROMEMOIS Published: — with international search report (Art. 21(3))