Patent SG-11201807193U-A (SG)
Title: Floor and ceiling panel for slab-free floor system of a building
Inventor: COLLINS ARLAN
IPC: F24D3/14
Filed: 2017-03-07
Abstract: Filing Language: (26) Publication Language: (30) Priority Data: 62/304,857 7 March 2016 (07.03.2016) US ( 84 ) (71) Applicant: INNOVATIVE BUILDING TECHNOLO- GIES, LLC [US/US]; 710 Second Avenue Suite 1400, Seattle, WA 98104 (US). (72) Inventors: COLLINS, Arlan; 710 Second Avenue Suite 1400, Seattle, WA 98104 (US). WOERMAN, Mark; 710 Second Avenue Suite 1400, Seattle, WA 98104 (US). 7 March 2017 (07.03.2017) English English FIG. 3 220 264 214 231 230 262 260 223 228 262 264 222 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/156006 Al 14 September 2017 (14.09.2017) WIPO I PCT 1111111111111101110101011111010111110 0111111111001111111011111111111111110111111 W O 20 17 / 15 6006 Al (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (74) Agents: DORSEY & WHITNEY LLP et al.; 701 Fifth Avenue Suite 6100, Seattle, Washington 98104 (US). Published: — with international search report (Art. 21(3)) (51) International Patent Classification: F24D 3/14 (2006.01) E04C 2/52 (2006.01) E04B 5/48 (2006.01) (21) International Application Number: PCT/US2017/021168 (22) International Filing Date: = (54) Title: FLOOR AND CEILING PANEL FOR SLAB-FREE FLOOR SYSTEM OF A BUILDING (57) : Floor and ceiling panels and methods of constructing a floor system for a building are described. In some embodi- ments, a panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, a ceiling substrate disposed below and attached to the plurality of joists, and an in-floor radiant heat member disposed between the corrugated form deck and the ceiling substrate. In some embodiments, the panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, and a sound dampener disposed between the corrugated form deck and the plurality of joists. In some embodiments, the method includes attaching a pre-assembled panel to a frame of the building and pouring concrete onto the panel so that a radiant heat member is separated from the concrete by a corrugated form deck of the panel.