baber/WOPTO huggingface dataset:
Patent TW-202233393-A (TW)
Title: Apparatus and method for manufacturing optically anisotropic polymer thin films
Inventor: OUDERKIRK ANDREW JOHN
IPC: B29C55/12
Filed: 2021-10-05
Abstract: A method includes attaching a clip array to opposing edges of a polymer thin film, the clip array having a plurality of first clips slidably disposed on a first track located proximate to a first edge of the polymer thin film and a plurality of second clips slidably disposed on a second track located proximate to a second edge of the polymer thin film, applying a positive in-plane strain to the polymer thin film along a transverse direction by increasing a distance between the first and second clips, and decreasing an inter-clip spacing amongst the first clips and amongst the second clips along a machine direction while applying the in-plane strain to form an optically anisotropic polymer thin film. During stretching, a strain rate of the thin film may be decreased and/or a temperature of the thin film may be increased.
Patent TW-202222492-A (TW)
Title: Polishing pad, double-side polishing device, and double-side polishing method for wafer
Inventor: UENO JUNICHI
IPC: C09K3/14
Filed: 2021-10-13
Abstract: The present invention is a polishing pad comprising a polishing layer for polishing a surface of a wafer, and a double-sided tape for attaching the polishing layer to an upper surface plate of a double-side polishing device. A 90 DEG peeling adhesive force A of the double-sided tape is 2000 g/cm or more, and a ratio A/B between the 90 DEG peeling adhesive force A and a 180 DEG peeling adhesive force B is 1.05 or greater. The double-sided tape has a base material, a polishing layer side adhesive layer on a side to be attached to the polishing layer, and an upper surface plate side adhesive layer on a side to be attached to the upper surface plate. The total thickness of the polishing layer side adhesive layer and the upper surface plate side adhesive layer is 80 [mu]m or less. Thus, the polishing pad capable of reducing deterioration of the flatness of a wafer when double-side polishing the wafer is provided.
Patent TW-202314140-A (TW)
Title: Strain wave gear device
Inventor: IMAGAWA YUTAKA
IPC: F16H1/32
Filed: 2021-10-18
Abstract: This strain wave gear device comprises: a flex gear part (20) having an internal gear part, a strain wave generating part, and an outer gear; and an output part (40) that rotates together with the flex gear part (20). The flex gear part (20) has a first annular part (22) integrally formed with the outer gear from the same material. The output part (40) has a second annular part (41) opposing the first annular part (22) in the radial direction centered on an axis (AX). Transmission teeth (6a) projecting along the radial direction are provided on the second annular part (41), and recesses (6b) into which the transmission teeth (6a) are inserted are provided in the first annular part (22). The width of each recess (6b) along the circumferential direction is wider than the width of each transmission tooth (6a), and the recesses (6b) allow relative displacement of the flex gear part (20) and the output part (40) in the circumferential direction. A plurality of transmission pairs, which are each a pair comprising a transmission tooth (6a) and a recess (6b), are arranged in the circumferential direction.
Patent TW-202225131-A (TW)
Title: Method for purifying organic solvent
Inventor: TAKADA NORIKO
IPC: B01J45/00
Filed: 2021-10-21
Abstract: A method for purifying an organic solvent, the method including: an ion exchange treatment step of bringing an organic solvent to be treated into contact with an ion exchange resin, and a distillation step of distilling the treated liquid from the ion exchange processing step. According to the invention, a method for purifying an organic solvent can be provided that exhibits excellent removability of metal impurities and moisture from the organic solvent.
Patent TW-202224234-A (TW)
Title: LED chip assembly, display panel and preparation methods of LED chip assembly and display panel
Inventor: YEN CHIA-HUANG
IPC: H01L51/56
Filed: 2021-10-27
Abstract: The invention relates to an LED chip assembly, a display panel and preparation methods of the LED chip assembly and the display panel . The LED chip assembly comprises a substrate, a plurality of LED chips and at least two mark basic parts, the LED chips and the mark basic parts are located on the substrate, the mark basic parts and the LED chips are formed on the same growth substrate, and the mark basic parts and the LED chips can be transferred to a transient substrate along with the LED chips and are used for playing a role in positioning in the transfer process of the LED chips. According to the LED chip assembly, a new scheme for arranging the alignment marks on the transient substrate is provided, the transfer process of the LED chips and the transfer process of the mark basic parts can be achieved at the same time, the problem that after the mark basic parts are arranged on the substrate except the growth substrate, the mark basic parts and the LED chips need to be transferred to the transient substrate is solved, the setting efficiency of the alignment marks on the transient substrate is improved, and the mass transfer efficiency can be improved favourably.
Patent TW-202229666-A (TW)
Title: Improved furnace apparatus for crystal production
Inventor: CERAN KAGAN
IPC: C30B29/36
Filed: 2021-11-19
Abstract: The present invention refers to a furnace apparatus (100), in particular a furnace apparatus (100) for growing crystals, in particular for growing SiC crystals. The furnace apparatus comprises
        a furnace unit (102),
        wherein the furnace unit (102) comprises a furnace housing (108)
        at least one crucible unit (106)
        wherein the crucible unit (106) is arranged inside the furnace housing (108),
        wherein the crucible unit (106) comprises a crucible housing (110),
        wherein the housing (110) has an outer surface (112) and an inner surface (114), wherein the inner surface (114) at least partially defines a crucible volume (116),
        wherein a receiving space (118) for receiving a source material (120) is arranged or formed inside the crucible volume (116),
        wherein a seed holder unit (122) for holding a defined seed wafer (18) is arranged inside the crucible volume (116),
        and
        at least one heating unit (124) for heating the source material (120),
        wherein the receiving space (118) for receiving the source material (120) is at least in parts arranged between the heating unit (124) and the seed holder unit (122).
Patent TW-202231274-A (TW)
Title: Dihydrofuropyridine derivatives as rho- kinase inhibitors
Inventor: RANCATI FABIO
IPC: C07D471/04
Filed: 2021-12-13
Abstract: The invention relates to compounds of formula (I) inhibiting Rho Kinase that are dihydrofuropyridine derivatives, methods of preparing such compounds, pharmaceutical compositions containing them and therapeutic use thereof. Particularly the compounds of the invention may be useful in the treatment of many disorders associated with ROCK enzymes mechanisms, such as pulmonary diseases including asthma, chronic obstructive pulmonary disease (COPD), idiopathic pulmonary fibrosis (IPF) and pulmonary arterial hypertension (PAH).
Patent TW-202229403-A (TW)
Title: Cross-linked polyaryletherketones
Inventor: SCHAUBER THOMAS
IPC: C09K3/10
Filed: 2021-12-16
Abstract: The present invention relates to a molded body comprising a polymer matrix that contains a cross-linked polyaryletherketone and to a method for producing such a molded body. The invention also relates to sealing articles, stop discs, back-up rings, valves, connectors, insulators, snap-in hooks, bearings, bushings, films, powders, coatings, fibers, sealing rings and O rings, pipes and lines, cables, coverings and casings, as well as housings of an electrical or chemical application, which comprise such a molded body or consist of such a molded body.
Patent TW-202238842-A (TW)
Inventor: CHANG JEN-YUAN
IPC: H01L21/60
Filed: 2021-12-22
Abstract: A die includes a semiconductor substrate, a dielectric structure, an interconnect structure, a through-silicon via (TSV) structure and a TSV barrier structure. The semiconductor substrate has a front side and an opposing backside. The dielectric structure includes a substrate oxide layer disposed on the front side of the semiconductor substrate and interlayer dielectric layers disposed on the substrate oxide layer. The interconnect structure is disposed in the dielectric structure. The TSV structure extends in a vertical direction from the backside of the semiconductor substrate through the front side of the semiconductor substrate, such that a first end of the TSV structure is disposed in the interconnect structure. The TSV barrier structure includes a barrier line contacting the first end of the TSV structure, and a first seal ring disposed in the substrate oxide layer and that surrounds the TSV structure in a lateral direction perpendicular to the vertical direction.
Patent TW-202316130-A (TW)
Inventor: CHEN YI-JU
IPC: G01R31/26
Filed: 2021-12-29
Abstract: 本揭露提供一種半導體晶圓、一種嵌設在一半導體晶圓上的基準測試裝置，以及一種嵌設在一半導體晶圓上的基準測試裝置的操作方法。該半導體晶圓包括一基準測試裝置，設置在該半導體晶圓的一切割線內。該基準測試裝置包括一電晶體；一二極體；以及一斷開連接開關，電性連接到該電晶體與該二極體，其中該斷開連接開關經配置以在一第一階段形成一導電路徑在該電晶體與該二極體之間，以及在一第二階段將該電晶體與該二極體電性絕緣。
Patent TW-202310255-A (TW)
Title: Semiconductor package and semiconductor device
Inventor: TSENG SHU-JUNG
IPC: H01L23/48
Filed: 2022-01-07
Abstract: Disclosed are semiconductor packages and semiconductor devices. In one embodiment, a semiconductor package includes a package, a first integrated passive device, and a second integrated passive device. The first integrated passive device is disposed below the package. The second integrated passive device is disposed between the package and the first integrated passive device. The first integrated passive device is electrically connected to the package through the second integrated passive device.
Patent TW-202332327-A (TW)
Title: Circuit board structure and manufacturing method thereof
Inventor: LIN WEN-YU
IPC: H05K1/02
Filed: 2022-01-24
Abstract: A circuit board structure includes a circuit substrate, a redistribution structure, and a dielectric structure. The circuit substrate has a first side and a second side opposite to each other and comprises a first circuitry layer disposed at the first side and a second circuitry layer disposed at the second side. The redistribution structure is disposed at the first side of the circuit substrate and electrically coupled to the circuit substrate. The redistribution structure comprises a first leveling dielectric layer covering the first circuitry layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuitry layer. Materials of the first thin-film dielectric layer and the first leveling dielectric layer are different. The dielectric structure is disposed at the second side of the circuit substrate and comprises a second leveling dielectric layer disposed below the second circuitry layer of the circuit substrate.
Patent TW-202239952-A (TW)
Title: Process for making bright stock base oil products
Inventor: TREVINO HORACIO
IPC: C10G65/12
Filed: 2022-01-26
Abstract: An improved process for making a bright stock base oil from a base oil feedstream comprising an atmospheric resid feedstock, and, optionally, a base oil feedstock, via hydroprocessing. The process generally involves subjecting a base oil feedstream comprising the atmospheric resid to hydrocracking and dewaxing steps, and optionally to hydrofinishing, to produce base oil product(s) including a bright stock grade base oil product having a viscosity of at least about 22 cSt at 100℃. The invention is useful to make heavy grade base oil products such as bright stock, as well as Group II and/or Group III/III+ base oils.
Patent TW-202239802-A (TW)
Title: Curable composition containing cyclic multifunctional monomer
Inventor: SHIMIZU YASUTOMO
IPC: C08G18/65
Filed: 2022-01-28
Abstract: This curable composition contains (A) a side-chain-containing cyclic molecule that contains three or more side chains having a group that has an active hydrogen at the terminal, (B) a urethane prepolymer that has an iso (thio)cyanate on both terminals of the molecule, (C) a diol, and (D) an amino group-containing monomer. The present invention makes it possible to provide a curable composition that forms a cured body that has high abrasion resistance and that exhibits excellent mechanical properties, and in particular a curable composition that forms a cured body that can favorably be used in a polishing pad.
Patent TW-202323476-A (TW)
Inventor: KIMOTO REI
IPC: C09J7/22
Filed: 2022-02-22
Abstract: In order to provide a thermal release adhesive tape which is well suited to use in thermal processing at high temperatures, exhibits adhesiveness of the adhesive layer that is markedly reduced by heating at an even a higher temperature after use in the thermal processing, allowing easy release from the adherend without leaving residue, and which exhibits excellent conformance to the surface texture of the adherend, a thermal release adhesive tape of the invention comprises a thermal release adhesive layer on at least one surface side of a backing material, wherein (a) the tensile strength of the backing material at 100% elongation is 0.9 MPa or less, (b) the compressive stress of the backing material at 50% compression is 2.0 MPa or less, and (c) the value of tan δ at the maximum temperature when using the adhesive tape at a temperature of 100°C or higher, obtained by dynamic viscoelastic measurement performed at a frequency of 10 Hz, is 0.80 or less. The thermal release adhesive layer 2 contains heat expanding microspheres, for which the foaming start temperature is at least 15°C higher than the maximum temperature during use, in an amount of at least 6 parts by mass but not more than 50 parts by mass per 100 parts by mass of the adhesive component that forms the thermal release adhesive layer.
Patent TW-202244086-A (TW)
Title: Photocurable liquid composition, cured product, and method for producing cured product
Inventor: IJIMA YOICHIRO
IPC: C08K5/18
Filed: 2022-02-24
Abstract: Provided are: a photocurable liquid composition that is capable of forming a cured product in which localization of metal oxide nanoparticles is suppressed; a cured product of the photocurable liquid composition; and a method for producing the cured product using the photocurable liquid composition. The photocurable liquid composition comprising a photopolymerizable monomer (A), metal oxide nanoparticles (B), and a photopolymerization initiator (C) contains, as a nitrogen-containing compound (D), at least one compound selected from the group consisting of an amine compound (D1) having a specific structure and an imine compound (D2) having a specific structure.
Patent TW-202333619-A (TW)
Inventor: LIN CHIA-CHING
IPC: A61B5/02
Filed: 2022-02-24
Abstract: The present invention provides an electronic device, including the following. A first member has a first inner side surface and a first outer side surface opposite to the first inner side surface. An optical sensor is located on the first inner surface and is used to contact the user's first position, and the optical sensor is used to obtain the user's first physiological signal. A first electrode group includes at least one electrode located on the first inner surface for contacting the first position of the user. A second electrode group includes at least one electrode located on the first outer surface for contacting a second position of the user, and the first electrode group and the second electrode group are used to obtain the second physiological signal of the user. A controller, located in the first member, coupled to the optical sensor, the first electrode group, and the second electrode group, the controller obtains the third physiological signal of the user according to the first physiological signal and the second physiological signal.
Patent TW-202235280-A (TW)
Title: Encapsulant for compound having non-stoichiometric composition and method for producing same
Inventor: TAKEYA JUNICHI
IPC: B32B9/00
Filed: 2022-02-25
Abstract: The present disclosure provides an encapsulant which is suitable for a compound having a non-stoichiometric composition. The present disclosure pertains to an encapsulant for a compound having a non-stoichiometric composition, the encapsulant containing a polymer layer and an inorganic oxide insulator layer, and the polymer layer containing a first polymer layer that contains an organic solvent-soluble polymer.
Patent TW-202244078-A (TW)
Title: Photosensitive resin composition, photosensitive element and method for producing layered body
Inventor: WATANABE YUSAKU
IPC: G03F7/038
Filed: 2022-03-17
Abstract: A photosensitive resin composition which contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator and a hydrogen donor, wherein the photopolymerizable compound contains a compound having a ditrimethylolpropane skeleton. A photosensitive element 1 equipped with a support body 2 and a photosensitive resin layer 3 positioned on the support body 2, wherein the photosensitive resin layer 3 contains the aforementioned photosensitive resin composition.
Patent TW-202245932-A (TW)
Title: Non-oriented electrical steel sheet, method for punching non-oriented electrical steel sheet, and die for punching non-oriented electrical steel sheet
Inventor: WAKISAKA TAKEAKI
IPC: B21D28/14
Filed: 2022-03-30
Abstract: This non-oriented electrical steel sheet comprises a silicon steel plate as a base material. The silicon steel plate has a predetermined mechanical property according to a direction with respect to a rolling direction, and the difference between a maximum value and a minimum value of the diameter of a circular hole after punching the silicon steel plate with a substantially circular die is 0.20% or less of the average value of the maximum value and the minimum value.
Patent TW-202247323-A (TW)
Inventor: CONG ZHEPENG
IPC: H01L21/67
Filed: 2022-04-07
Abstract: 於此揭露的實施例通常提供對處理腔室中的氣流的改進控制。在至少一個實施例中，一種用於處理腔室的襯墊包括：環形主體，具有側壁；及排氣件，形成在環形主體中，用於將氣體從環形主體的內側排放到外側。排氣件包含穿過側壁設置的一個或多個排氣孔。襯墊進一步包括在環形主體中用於基板裝載和卸載的開口。
Patent TW-202314143-A (TW)
Title: Speed reducer
Inventor: CHUNG CHI-WEN
IPC: F16H1/32
Filed: 2022-06-13
Abstract: A speed reducer includes an input shaft, an input gear, a fixing gear and an output gear. The input shaft includes an eccentric structure. The input gear is disposed on the eccentric structure and includes first teeth of which each with a first contact portion and a second contact portion. The fixing gear and the output gear are disposed corresponding to the input gear, wherein the fixing gear includes second teeth, and the second teeth are in contact with the first contact portions, wherein the output gear includes third teeth, and the third teeth are in contact with the second contact portions. A first tooth number difference between the first teeth and the second teeth is different from a second tooth number difference between the first teeth and the third teeth.
Patent TW-202313338-A (TW)
Title: Thermally conductive sheet product and method for producing same
Inventor: KOSHIKAWA HIDENORI
IPC: B32B27/00
Filed: 2022-07-12
Abstract: The present invention provides: a thermally conductive sheet product wherein both surfaces of a fluorine rubber-based thermally conductive sheet are protected from foreign substances and the like, and excellent setting workability is achieved between a heat generation member and a heat dissipation member; and a method for producing this thermally conductive sheet product. A thermally conductive sheet product which is obtained by bonding electrically insulating films to both surfaces of a thermally conductive sheet that is formed of a cured product of a thermally conductive fluorine-containing curable composition containing (A) a linear polyfluoro compound which comprises two or more alkenyl groups in each molecule, while having a perfluoro polyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane which comprises a perfluoroalkyl group or a perfluorooxyalkyl group in each molecule, or alternatively comprises a perfluoroalkylene group or a perfluorooxyalkylene group, while additionally containing two or more groups (SiH groups), wherein a hydrogen atom is directly bonded to a silicon atom, in each molecule, and which does not comprise an alkoxy group that is directly bonded to a silicon atom in the molecule, (C) a platinum group metal-based catalyst and (D) a specific amount of a thermally conductive filler.
Patent TW-202307241-A (TW)
Inventor: CEN XI
IPC: C23C14/14
Filed: 2022-07-13
Abstract: 本文提供用於填充基板中的特徵的方法及相關設備的實施例。在一些實施例中，一種填充基板中的特徵的方法包括：經由物理氣相沉積(PVD)處理在特徵中沉積氮化鎢的晶種層；經由PVD處理在特徵中的氮化鎢的晶種層上沉積鎢的襯墊層；及隨後經由化學氣相沉積(CVD)處理以鎢整體填充來填充特徵。
Patent TW-202320906-A (TW)
Title: Polyamide porous membrane and method for producing polyamide porous membrane
Inventor: ANDO HIDEHITO
IPC: B01D71/56
Filed: 2022-08-08
Abstract: The purpose of the present invention is to provide a polyamide porous membrane that makes it possible to improve liquid permeability while suppressing deterioration of membrane separation performance. A polyamide porous membrane according to the present invention is formed from a polyamide resin, wherein in structural analysis by X-ray diffraction, the ratio of [gamma] crystals with respect to the total amount of [alpha] crystals and [gamma] crystals is not less than 38%.
Patent TW-202321120-A (TW)
Title: Glass plate packaging body, method for transporting glass plate packaging body, and pallet
Inventor: TESHIMA HIROO
IPC: B65D19/44
Filed: 2022-08-09
Abstract: A glass plate packaging body 1 provided with a pallet 3 having a glass plate stacked body 2 including a plurality of stacked glass plates G, a rear surface supporting part 4 that supports a rear surface part of the longitudinally-mounted glass plate stacked body 2, a bottom surface supporting part 6 that supports a bottom surface part of the glass plate stacked body 2, and a base part 8 on which the rear surface supporting part 4 and the bottom surface supporting part 6 are provided, characterized in that the pallet 3 is provided with an insertion part 9 into which a claw 10 of a forklift is insertable on a lateral side 31 thereof, and the insertion part 9 is provided with a first insertion part 91 and a second insertion part 92. Thus, even when the dimension of a mounted glass plate is changed, the glass plate packaging body can be transported in a stabilized posture.
Patent TW-202321202-A (TW)
Inventor: GANIER JEROME
IPC: C07D239/26
Filed: 2022-08-24
Abstract: The present invention relates to an organic light emitting diode comprising an anode, a cathode, a first emission layer, a second emission layer, a first charge generation layer and a first electron transport layer stack; and to a display device or lighting device comprising the same.
Patent TW-202327008-A (TW)
Title: 半導體封裝結構及其製造方法
Inventor: CHANG JEN-YUAN
IPC: H01L23/535
Filed: 2022-09-01
Abstract: 本揭露有關積體電路（IC）晶片封裝及其製造方法。IC晶片封裝包括在一相同的表面水平上的第一及第二內連接基底、分別設置在第一及第二內連接基底上的第一及第二積體電路（IC）晶片、設置在第一及第二內連接基底上的一IC晶片耦合器並且配置為提供一訊號傳輸路徑在第一及第二IC晶片之間、以及設置在第一及第二IC晶片以及IC晶片耦合器上的一重佈結構。IC晶片耦合器包括與第一內連接基底重疊的一第一耦合器區域、與第二內連接基底重疊的一第二耦合器區域、與第一及第二內連接基底之間的一間隔重疊的一第三耦合器區域、以及具導電線及導電孔的一內連接結構。
Patent TW-202305167-A (TW)
Inventor: BLOMBERG TOM E
IPC: C23C16/455
Filed: 2015-04-14
Abstract: 本發明提供一種氟化物薄膜以及用於形成所述薄膜的原子層沈積方法。用於在基板上沈積含氟薄膜之原子層沈積（ALD）方法可包含多個超循環。各超循環可包含金屬氟化物子循環及還原子循環。所述金屬氟化物子循環可包含使所述基板與金屬氟化物接觸。所述還原子循環可包含交替且依序使所述基板與還原劑及氮反應物接觸。
Patent TW-202328138-A (TW)
Inventor: Shang ting-ting
IPC: C07D487/08
Filed: 2022-09-16
Abstract: 本公開涉及一種稠合二環類衍生物的可藥用鹽、晶型及其製備方法。具體而言，本公開提供了式I化合物的鹽酸鹽、甲磺酸鹽、醋酸鹽、酒石酸鹽及其製備方法，以及結晶形式。