baber/WOPTO huggingface dataset:
Patent TW-202231099-A (TW)
Title: Life footprint tracking system and method thereof in which mobile data of a mobile device of a user is received by a plurality of base stations in order to outline a living activity of the user
Inventor: RAO CHUNG-HWA
IPC: H04W64/00
Filed: 2021-01-15
Abstract: Disclosed is a life footprint tracking system and a method thereof, comprising a user status module using a plurality of base stations to receive mobile data of a mobile device of a user, calculating at least a fuzzy position of the mobile device and then determining if the status of the user is moving or staying; using a user position module to mark the at least one fuzzy position as a same position and identifying the position if the status of the user is consecutively determined as staying, and using a user moving mode module to identify a moving mode of the user if the status of the user is determined as moving; using a user moving path module to calculate a moving path of the user according to the mobile data, and using a summarizing module to receive outputs of the above modules for summarizing as a life footprint. The present invention can find out a traveling fashion of the user and places where he stays more often, outline living activities of the user, and further improve the network quality.
Patent TW-202229123-A (TW)
Inventor: HSU TSANG-HUANG
IPC: B01D53/14
Filed: 2021-01-19
Abstract: 本發明係有關於一種具吸濕功能的彈性伸縮罩，其主要係令罩體為軟性之彈性材質所製作，讓罩體能結合於容器之開口處，令容置腔對應設置於罩體之中間位置處，於容置腔底端開設有數吸濕氣孔，於容置腔內設置有吸濕件，並於該容置腔頂端設有濕度顯示件；藉此，可供應用於經常遭受丟棄的各式不同大小的空罐容器，不僅能對該類空罐容器開口進行封蓋，且同時能對呈封閉狀態之容器內部進行吸濕作業，將容器內部所殘留的濕氣吸收，令容器內部保持乾燥狀態，防止容器內部所儲放的物品受濕氣影響有變質、發霉之情況發生，以更便於進行物品之儲放，達到空罐容器再利用之環保效果，並可讓使用者得知吸收濕氣的飽和程度，方便對吸濕件進行更換或還原，而在其整體施行使用上更增實用功效特性者。
Patent TW-202230698-A (TW)
Title: Packaging structure for dual transistors including a substrate which is provided therein with first, second, third, and fourth conductive portions that extend to the front and back sides of the substrate to form contacts
Inventor: Yan zong-xian
IPC: H01L23/535
Filed: 2021-01-27
Abstract: A packaging structure for dual transistors comprises a substrate, wherein the substrate is provided with first, second, third, and fourth conductive portions inside. The first conductive portion extends to the front side of the substrate to form a first contact, and extends to the back side of the substrate to form a drain output contact; the second conductive portion extends to the front side of the substrate to form a second contact, extends to the front side of the substrate to form a third contact, and extends to the back side of the substrate to form a source output contact; the third conductive portion extends to the front side of the substrate to form a fourth contact, and extends to the back side of the substrate to form a gate output contact. A first transistor has its drain connected to the first contact, its gate connected to the second contact, and its source connected to the fourth conductive portion. A second transistor has its source connected to the third contact, its gate connected to the fourth contact, and its drain connected to the fourth conductive portion.
Patent TW-202132812-A (TW)
Title: Method of phase contrast imaging
Inventor: CAO PEI-YAN
IPC: G01T1/17
Filed: 2021-01-29
Abstract: Disclosed herein is a method, comprising: for i = 1, ..., M, sending a pencil radiation beam (i) toward an image sensor, wherein the pencil radiation beam (i) is incident on an incident region (i) on the image sensor, wherein the pencil radiation beam (i) is aimed at a target region (i) on the image sensor, wherein M is a positive integer, wherein the image sensor comprises active areas spatially discontinuous from each other, and wherein the incident regions (i), i = 1, ..., M and the target regions (i), i = 1, ..., M are on the active areas; and for i = 1, ..., M, determining an offset (i) between the incident region (i) and the target region (i).
Patent TW-202234363-A (TW)
Inventor: LIN FENG-SHENG
IPC: G09G3/20
Filed: 2021-02-23
Abstract: A driving circuit is disclosed. The driving circuit includes a pixel driving circuit, a gate node driving circuit, a driving capacitor, a control node driving circuit and a multiplexer circuit. The pixel driving circuit includes a driving transistor. The driving transistor is coupled to the light-emitting element and the control end of the driving transistor is coupled to the gate node. The gate node driving circuit is coupled to the gate node and is used to pull down the voltage of the gate node. The driving capacitor is disposed between the gate node and the control node. The control node driving circuit is coupled to the control node and is used to pull up the voltage of the gate node. The multiplexer circuit includes a data transistor and a data line capacitor. The first end of the data transistor is coupled to the control node and the second end of the data transistor is coupled to the data line capacitor.
Patent TW-202139270-A (TW)
Title: A method of forming semiconductor structure
Inventor: CHANG CHIA-HAO
IPC: H01L27/11585
Filed: 2021-02-23
Abstract: A method includes providing a structure having a substrate, gate stacks and source/drain (S/D) features over the substrate, S/D contacts over the S/D features, one or more dielectric layers over the gate stacks and the S/D contacts, and a via structure penetrating the one or more dielectric layers and electrically connecting to one of the gate stacks and the S/D contacts. The method further includes forming a ferroelectric (FE) stack over the structure, wherein the FE stack includes an FE layer and a top electrode layer over the FE layer, wherein the FE stack directly contacts the via structure; and patterning the FE stack, resulting in a patterned FE stack including a patterned FE feature and a patterned top electrode over the patterned FE feature.
Patent TW-202136857-A (TW)
Title: Beam splitting device and splitting ratio adjustment method
Inventor: ENNYU NAOAKI
IPC: G02B27/14
Filed: 2021-02-26
Abstract: According to the present invention, a first reflective mirror, a second reflective mirror, and a third reflective mirror are disposed in order in the propagation direction of a laser beam on the path of the laser beam to be incident on a polarization beam splitter. The first reflective mirror is supported in a tilt-adjustable manner by a first adjusting mechanism in a direction in which an angle between the polarization surface of the incident beam to the first reflective mirror and the optical axis of a reflective beam reflected by the first reflective mirror is changed. When the orientation of the first reflective mirror has been changed by the first adjusting mechanism, the second reflective mirror is supported by a second adjusting mechanism so as to be tilt-adjustable and movable in a direction in which the state in which a reflective beam from the first reflective mirror is incident on the second reflective mirror and the state in which a reflective beam from the second reflective mirror is incident on the third reflective mirror can be maintained. Thus, it is possible to slightly adjust the polarization direction of a laser beam incident onto the polarization beam splitter without increasing the number of optical components introduced in the path of the laser beam.
Patent TW-202201703-A (TW)
Inventor: NOH HYUN-JUN
IPC: H01L23/538
Filed: 2021-03-10
Abstract: A semiconductor package includes a package substrate including a first substrate channel pad and a second substrate channel pad, a chip stack including a plurality of semiconductor chips stacked on the package substrate to be offset in a first direction, wherein first semiconductor chips located on odd layers from among the plurality of semiconductor chips and second semiconductor chips located on even layers from among the plurality of semiconductor chips are offset in a second direction perpendicular to the first direction, each of the first semiconductor chips includes a first chip channel pad, and each of the second semiconductor chips includes a second chip channel pad, first inter-chip connection wires configured to electrically connect the first chip channel pads of the first semiconductor chips to one another, second inter-chip connection wires configured to electrically connect the second chip channel pads of the second semiconductor chips to one another.
Patent TW-202242786-A (TW)
Title: Delivery route planning system and delivery route planning method
Inventor: TSENG WEI-HAN
IPC: G06Q50/28
Filed: 2021-04-21
Abstract: A delivery route planning system includes an order module, a meal time calculation module, an integration module, and a route planning module. The order module receives plural order information, the plural order information comes from plural client mobile devices, and the plural order information includes plural restaurant locations, plural meals, and plural customer locations. The meal time calculation module generates the scheduled completion time of each meal based on the order information. The integration module integrates multiple restaurant locations to generate restaurant coordinate information, and integrates multiple customer locations of each order information to generate customer coordinate information. The route planning module plans a suggested meal route based on the restaurant coordinate information, the scheduled completion time of each meal, and the customer coordinate information, where the suggested meal route includes the meal information corresponding to the location of each restaurant.
Patent TW-202241741-A (TW)
Inventor: CHUNG MING-AN
IPC: B60W50/02
Filed: 2021-04-22
Abstract: 本發明係一種車輛駕駛安全提升裝置及其方法，係包括原始運算單元、升級連接單元，其中升級連接單元連接在原始運算單元與車輛控制單元之間，由原始運算單元接收及傳送車輛的所有操作訊號及控制命令，或者升級連接單元連接在原始運算單元與安全運算單元之間，再由安全運算單元連接到車輛控制單元，使得原始運算單元接收及傳送車輛的所有操作訊號及控制命令，先被傳送到安全運算單元進行安全風險管控及自動駕駛運算，再傳送到車輛控制單元，進行自動駕駛，達到至少可以提高車輛安全完整性等級標準，甚至進一步可以實現自動駕駛又可以提升到較高的安全等級之目的。
Patent TW-202143812-A (TW)
Title: Beveled overburden for vias and method of making the same
Inventor: JOSHI DHANANJAY
IPC: H05K3/10
Filed: 2021-04-30
Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.
Patent TW-202145146-A (TW)
Inventor: XIE SHUAI-NING
IPC: G06T7/33
Filed: 2021-05-03
Abstract: The embodiments of the present disclosure provide an image registration method and related model training methods, an equipment and a computer readable storage medium. The method includes: acquiring a real two-dimensional image and a reference two-dimensional image, using the virtual image feature extraction network of the image registration model to perform feature extraction on the reference two-dimensional image to obtain a first virtual feature image; wherein, the image registration model has been pre-trained with virtual images, and the virtual image feature extraction network has participated in the pre-training, and the virtual images are generated based on the virtual target. the real image feature extraction network of the image registration model is used to perform feature extraction on the real two-dimensional image to obtain the first real feature image; Among them, the real image feature extraction network is not involved in pre-training; use the difference between the first real feature image and the first virtual feature image to adjust the network parameters of the real image feature extraction network.
Patent TW-202136134-A (TW)
Title: Raw material supply device, device for processing electronic and electrical device part scraps, and method for processing electronic and electrical device part scraps
Inventor: AOKI KATSUSHI
IPC: B65G47/19
Filed: 2019-10-31
Abstract: Provided are a raw material supply device that can control the drop location of raw materials that include materials of different shapes and specific gravities, a device for processing electronic and electronic device part scraps, and a method for processing electronic and electric device part scraps employing said devices. The raw material supply device 4 is provided with an accommodating part 41 that supplies raw material 100 to a location determined in advance, further provided with a receiving port 43 that is on the top face of the accommodating part 41 and that is provided with a first opening 433 for receiving the raw material 100, a discharge port 42 that is on the bottom face of the accommodating part 41 and that is provided with a second opening 422 for discharging the raw material 100, said second opening 422 having a smaller cross-sectional area than the first opening 433, a first guiding face 412 that is on the forward side of a side face of the accommodating part 41 and extends vertically beyond the discharge port 42 from the receiving port 43 so as to contact the raw material 100 dropped forward from a transport means 2 and guide the raw material 100 downward, and a second guiding face 411 that is on a face opposing the first guiding face 412 on the side face of the accommodating part 41 and that is provided with an inclined face 411a that is continuous with the discharge port 42 and is inclined with respect to the horizontal plane, wherein the first guiding face 412 extends so that the bottommost end of the first guiding face 412 is located below the intersection P of the first guiding face 412 and an extension line of the second guiding face 411 along the incline direction.
Patent TW-202144556-A (TW)
Title: Cleaning solution, method for cleaning semiconductor substrate
Inventor: KAMIMURA TETSUYA
IPC: C11D7/08
Filed: 2021-05-13
Abstract: The present invention provides: a cleaning solution which is for a semiconductor substrate subjected to CMP and has excellent selectivity of RuO2 removing performance; and a method for cleaning a semiconductor substrate subjected to CMP. A cleaning solution according to the present invention is for a semiconductor substrate subjected to a chemical mechanical polishing treatment, and contains perhalogen acid and halogen acid.
Patent TW-202212403-A (TW)
Title: Transparent adhesive composition, film-like transparent adhesive, method for manufacturing transparent adhesive cured layer-provided member, and electronic component and method for manufacturing same
Inventor: MORITA MINORU
IPC: C09J7/00
Filed: 2021-05-28
Abstract: The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a film-like transparent adhesive obtained by processing said composition; and a method for manufacturing a transparent adhesive cured layer-provided member, a method for manufacturing an electronic component, and an electronic component, all of which using said film-like transparent adhesive. (1) Being a powder and having a particle diameter (d90) at a cumulative distribution frequency of 90% of 2.0 [mu]m or less. (2) Having a solubility of 0.1 g or less with respect to 100 g of methyl ethyl ketone at 25 DEG C.
Patent TW-202301106-A (TW)
Title: Single generation circuit, microcontroller, and control method
Inventor: Lai yun-kai
IPC: G06F9/22
Filed: 2021-06-18
Abstract: A signal generating circuit including a first control circuit, a second control circuit, an arbiter circuit, and a digital-to-analog converter (ADC) is provided. The first control circuit stores a first data string. When a first event occurs, the first control circuit asserts a first trigger signal. The second control circuit stores a second data string. When a second event occurs, the second control circuit asserts a second trigger signal. When the first and second trigger signals are asserted, the arbiter circuit accesses one of the first and second control circuits according to a priority order to serve the first or second data string as a digital input. The ADC converts the digital input to generate an analog output.
Patent TW-202215437-A (TW)
Inventor: TRAN MICHAEL NICOLAS ALBERT
IPC: G06T1/00
Filed: 2021-06-21
Abstract: 提出用於執行類神經網路之記憶體內計算推理的非揮發性記憶體結構。一種記憶體陣列係根據在各交叉點接點處具有一記憶體單元的一交叉點架構形成。該等多階記憶體單元(MLC)係由藉由金屬層分開的多個超薄介電層形成，其中該記憶體單元的程式化係藉由選擇該寫入電壓位準選擇性地使該等介電層中的一或多者崩潰來完成。在一組替代實施例中，該等記憶體單元係形成為反熔絲。
Patent TW-202206508-A (TW)
Title: (meth)acryloyl-functionalized amide-containing oligomers
Inventor: MCGRAIL BRENDAN
IPC: C08F290/06
Filed: 2021-06-30
Abstract: Oligomeric substances which contain one or more (meth)acrylic functional groups as well as two or more amide functional groups are useful as components of compositions which may be cured using actinic irradiation to provide polymeric articles.
Patent TW-202220313-A (TW)
Inventor: ROMAN MATTHEW
IPC: H02K11/40
Filed: 2021-07-01
Abstract: Systems and methods to mitigate electrical voltage on a rotating shaft in an oil rich environment exposed to a viscous fluid or immersed in oil are disclosed. An example grounding brush assembly includes a plurality of conductive filaments configured to extend through the viscous medium surrounding the rotating shaft to be in electrical contact with the rotating shaft when the brush assembly is disposed proximate the shaft.
Patent TW-202223942-A (TW)
Title: Manufacturing method of inductor
Inventor: OKUMURA KEISUKE
IPC: H01F41/14
Filed: 2021-07-26
Abstract: To manufacture an inductor in which a melt-solidified material is reduced. A manufacturing method of an inductor 1 successively includes a first step and a second step. In the first step, a magnetic laminate 20 comprising a wire 2 and a magnetic layer 3 in which the wire 2 is embedded and which contains magnetic particles is produced. The magnetic layer 3 includes: a first principal surface 6 which is disposed while being spaced apart from the wire 2 to one side in a thickness direction; and a second principal surface 7 which is spaced apart from the first principal surface 6 and disposed at an opposite side of the first principal surface 6 with respect to the wire 2. In the second step, a via 10 which is recessed from the first principal surface 6 toward the second principal surface 7 is formed in the magnetic layer 3 by a blast method.
Patent TW-202212410-A (TW)
Title: Curable composition, heat storage material, and article
Inventor: MORIMOTO TSUYOSHI
IPC: F28D20/00
Filed: 2021-07-28
Abstract: A curable composition containing a compound represented by formula (1) and at least one polyalkylene glycol ether selected from the group consisting of polyalkylene glycol monoethers and polyalkylene glycol diethers. In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain.
Patent TW-202228677-A (TW)
Title: Use of complex of angiotensin ii receptor antagonist metabolite and nep inhibitor in treatment of heart failure
Inventor: SUN JING-CHAO
IPC: C07D403/10
Filed: 2021-08-16
Abstract: Disclosed is the use of a complex of an angiotensin II receptor antagonist metabolite and an NEP inhibitor in the treatment of heart failure, specifically relating to the use of the complex in the preparation of a drug for treating heart failure with mid-range ejection fraction (HFmrEF).
Patent TW-202223542-A (TW)
Title: Composition for forming euv resist underlayer film
Inventor: SHIMIZU Shou
IPC: C08G59/26
Filed: 2021-08-20
Abstract: Provided are: a composition for forming a resist underlayer film that enables formation of an intended resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses said composition for forming a resist underlayer film. Provided is a composition for forming an EUV resist underlayer film, said composition comprising: a compound represented by formula (1); a polymer; and an organic solvent. (In formula (1), Y1 represents a single bond, an oxygen atom, a sulfur atom, a halogen atom, or a C1-10 alkylene group which may be substituted with a C6-40 aryl group, or a sulfonyl group, T1 and T2 each represent a C1-10 alkyl group, R1 and R2 each independently represent a C1-10 alkyl group which is substituted with at least one hydroxy group, and n1 and n2 each independently represent an integer of 0-4).
Patent TW-202239092-A (TW)
Title: Vertical-cavity surface-emitting laser and method for forming the same
Inventor: TU MIN-CHANG
IPC: H01S5/187
Filed: 2021-08-25
Abstract: A vertical cavity surface emitting laser includes an active area, an inner trench, an outer trench, and a first implantation region. The active area includes a first mirror, an active region, a second mirror, and an etch stop layer. The first mirror is formed over a substrate. The active region is formed over the first mirror. The second mirror is formed over the active region. The etch stop layer with an aperture is formed between the active region and the second mirror. The inner trench surrounds the active area in a top view. The outer trench if formed beside the inner trench. The first implantation region is formed below the inner trench.
Patent TW-202311351-A (TW)
Title: Inorganic filler dispersion stabilizer, inorganic filler-containing resin composition, molded product and additive capable of reducing the viscosity and storage stability of a composition containing the inorganic filler
Inventor: YAMAMOTO JUNKO
IPC: C08K9/04
Filed: 2021-09-02
Abstract: The present invention provides an inorganic filler dispersion stabilizer, which can reduce the viscosity of a composition containing the inorganic filler and improve the storage stability of the composition containing the inorganic filler, wherein the inorganic filler is one or more selected from the group consisting of calcium carbonate, silicon dioxide, aluminum oxide, aluminum hydroxide, talc, barium titanate, boron nitride, and aluminum nitride. Specifically, an inorganic filler dispersion stabilizer is provided, which is a polyester having carboxyl groups at both ends.
Patent TW-202200725-A (TW)
Title: UV-curable acrylic adhesive composition, UV-curable acrylic adhesive layer, polarizing film attached with adhesive layer, method for manufacturing UV-curable acrylic adhesive layer, and image display device in which the composition can be formed by a polymerization method of irradiating an adhesive layer having UV absorption function with UV rays
Inventor: YAMAMOTO SHINYA
IPC: C09J7/20
Filed: 2016-06-15
Abstract: The object of this invention is to provide a UV-curable acrylic adhesive composition, the composition can be formed by a polymerization method of irradiating an adhesive layer having UV absorption function with UV rays. Moreover, this invention also aims at providing a UV-curable acrylic adhesive layer formed from the UV-curable acrylic adhesive composition, a polarizing film provided with the adhesive layer of the UV-curable acrylic adhesive layer, a method for manufacturing the UV-curable acrylic adhesive layer and an image display device. a UV-curable acrylic adhesive composition for forming an adhesive layer located on covered glass or between a covered plastics and a polarizing film in the image display device and is characterized in that the adhesive composition contains a monomer component containing alkyl (meth) acrylate and/or a part of a polymer of the monomer component, a UV absorbent, a photopolymerization initiator (A) having an absorption band at a wavelength of 400 nm or more and a photopolymerization initiator (B) having an absorption band at a wavelength less than 400 nm. The transmittance of the adhesive layer formed from the adhesive composition at a wavelength of 380 nm is 40% or less, and the transmittance at a wavelength of 400 nm is 30% or more.