Patent KR-102067091-B1 (KR)
Title: Manufacturing method of back cover for mobile communication device
Inventor: LEE HYUN CHUL
IPC: B32B17/06
Filed: 2018-09-20
Granted: 2020-01-15
Abstract: The present invention relates to a method for manufacturing a back cover which covers a rear surface of a portable communication device such as a smartphone in order to protect the portable communication device from an external impact and the like. According to the present invention, the method comprises: stacking a prepreg on an epoxy plate including reinforced glass fiber embedded in a thermoplastic or thermosetting resin, and heating and pressing the laminated material by a force of 5 to 20 kgf at the temperature of 100 to 200°C to perform integration so as to acquire a raw back cover plate; interposing a UV or thermosetting adhesive between the raw back cover plate and a cover film made of a PET material to perform pressing and UV irradiation or heating so as to adhere the cover film to the raw back cover plate; shaping the raw back cover plate having the cover film adhered thereto to acquire a plurality of half-finished back covers having a constant shape; and interposing the half-finished back cover between upper and lower plate molds forming a shaping space of a finished back cover, and heating and pressing the same by a force of 5 to 20 kgf at the temperature of 100 to 200°C within one minute so as to form a back cover with a constant 3D or planar shape. Accordingly, the method provides a back cover for a portable communication device, which has a thin thickness similar to that of a conventional metal or glass material, low manufacturing costs, and light weight, does not interfere wireless charging or communications, and provides excellent strength. The present invention relates to a method for manufacturing a back cover which covers a rear surface of a portable communication device such as a smartphone in order to protect the portable communication device from an external impact and the like. According to the present invention, the method comprises: stacking a prepreg on an epoxy plate including reinforced glass fiber embedded in a thermoplastic or thermosetting resin, and heating and pressing the laminated material by a force of 5 to 20 kgf at the temperature of 100 to 200°C to perform integration so as to acquire a raw back cover plate; interposing a UV or thermosetting adhesive between the raw back cover plate and a cover film made of a PET material to perform pressing and UV irradiation or heating so as to adhere the cover film to the raw back cover plate; shaping the raw back cover plate having the cover film adhered thereto to acquire a plurality of half-finished back covers having a constant shape; and interposing the half-finished back cover between upper and lower plate molds forming a shaping space of a finished back cover, and heating and pressing the same by a force of 5 to 20 kgf at the temperature of 100 to 200°C within one minute so as to form a back cover with a constant 3D or planar shape. Accordingly, the method provides a back cover for a portable communication device, which has a thin thickness similar to that of a conventional metal or glass material, low manufacturing costs, and light weight, does not interfere wireless charging or communications, and provides excellent strength.