baber/WOPTO huggingface dataset:
Patent JP-H0195215-A (JP)
Title: Gas air purging machine for working gas conduit pipe
Inventor: ITO SHINICHI
IPC: F23K5/00
Filed: 1987-10-05
Abstract: PURPOSE:To prevent a harmful gas from being ejected by disposing a burner for combustion of a purge gas in the proximity of a burner for forced combustion so that a combustion gas is discharged within the combustion atmosphere of the burner for the forced combustion. CONSTITUTION:A burner A1 for forced combustion is disposed at a position where a flame is formed at a connecting part of a perpendicular tube part 11a and an inclined tube part 11b. When a switch is turned on, a blower 7 operates and solenoid valves 3 and 4 are opened, and a spark is generated in an ignition spark rod 14. Thus, a mixed gas of a propane gas from a bomb C and combustion air from the blower 7 is burnt by the burner A1 for forced combustion to form a flame. At the same time, combustion air flows along an pipeline B3 for combustion of purge gas and a residual gas in a conduit pipe D and a gas therein are sucked up and ejected through the burner B1 for combustion of purge gas and burns. The residual gas is diluted by air and does not burn, and flammable components are ejected through the burner B1 for combustion of the purge gas, and are completely burnt by the flame of the burner A1 for forced combustion and discharged. Consequently, the ejection of unburnt harmful gas can be prevented.
Patent JP-H04135057-A (JP)
Title: Method and apparatus for continuous solder coating
Inventor: KOJIMA NAOKATSU
IPC: H01L23/50
Filed: 1990-09-25
Abstract: PURPOSE:To surely applying a solder by applying the molten solder rising in the slit for capillary just after removing oxide with flux. CONSTITUTION:The oxide on the surface of a metallic part in a lead frame 1 is removed with the flux in a flux vessel 6 and just after activating, lead frame 1 is sent to a block body 41. At the time of passing through the passage, the molten solder, which fills up the passage by rising in the fine width of the slit for capillary arranged toward lower face dipping in a molten solder vessel 25 from the passage in the block body 41 is applied on the upper and lower surfaces of the lead part. Quantity of the coating molten solder is quickly supplemented in the passage with accompanying action developed by shifting the lead frame 1. By this method, consumption of the solder can be held to the min. necessary quantity.
Patent JP-H1178845-A (JP)
Title: Antiskid controller
Inventor: MATSUMOTO SHINJI
IPC: B60T8/66
Filed: 1997-09-17
Abstract: PROBLEM TO BE SOLVED: To improve antiskid control performance while increasing brake reducing speed by estimating the error of an estimated car speed to a large side and, correcting it so as to increase the changing amount of the car speed estimated value according to the judgment of the estimation. SOLUTION: The changing of a target slip rate is performed by a target slip rate changing means (d) according to the judgment of a wheel speed converging state judging means (c). On the other hand, car body speed estimation is performed by a car speed estimation error judging means (i) for estimating the error of estimated car body speed to a large side, and according to the judgment, by an estimated car speed changing amount correcting means (j), correction is made so as to increase the changing amount of a car body speed estimated value in the car speed estimating means (b) to correct the changing amount of a car body speed such that a reduction in a brake liquid pressure is suppressed to prevent a speed reduction shortage when the upper shifting of the estimated car body speed is detected.
Patent JP-S60136223-A (JP)
Title: Manufacture of silicon carbide semiconductor element
Inventor: SUZUKI AKIRA
IPC: H01L21/04
Filed: 1983-12-23
Abstract: PURPOSE:To enable manufacture of silicon carbide semiconductor elements suitable for mass production on an industrial scale with considering productivity by using a silicon carbide single crystal film grown on a silicon single crystal substrate. CONSTITUTION:An n type silicon carbide single crystal film 2 and a p type silicon carbide single crystal film 3 are grown on an n type silicon single crystal substrate 1 by CVD method and mesa etching is done to remove the peripheral part. Ni is stuck as an ohmic electrode 4 by plating and Al-Si alloy is vapor- deposited as an ohmic electrode 5. Lead wires are connected to the electrodes 4 and 5 to fabricate a p-n junction diode.
Patent JP-H03116270-A (JP)
Title: Stock control system and method
Inventor: NAKAMURA TAKAMICHI
IPC: G06Q50/00
Filed: 1989-09-29
Abstract: PURPOSE:To attain a stock control system original to each of users at a low cost by granting the write of the stock information to a portable storage medium only when the affirmative result of collation is obtained via an identification code collation means. CONSTITUTION:An identification code collation means 101 performs the collation of the identification codes stored in a portable storage medium 250. When it is decided that the collated identification code is equal to an identification code that is previously registered in a disk storage means 106, the write of the stock information is granted to the medium 250 for the first time. Therefore a warehouse user can read out the stock information written into the medium 250 via an information processor 300 set at an office of the user. Thus no on-line connection is required to a shared stock control system 100 set at the warehouse side. In addition, the system 100 is not required to prepare a large capacity storage to store the stock information. Thus the system installation cost can be reduced.
Patent JP-H0194756-A (JP)
Title: Voice multiple address system
Inventor: TANAKA KIMIO
IPC: H04M11/00
Filed: 1987-10-06
Abstract: PURPOSE:To simplify and ensure the response completion confirmation of the operator of a voice multiple address operating board by displaying response conditions to an automatic incoming call from a terminal equipment through a telephone line and informing of the response completion of all pieces of the terminal equipment. CONSTITUTION:When the switch of a broadcasting requesting input part 16 at a broadcasting board 1 is turned on a broadcasting requesting signal (e) is supplied to network control parts 211, 212,... in a voice multiple address controller 2, and a corresponding terminal equipment is called through the telephone line. A response signal (a), which goes through a terminal response monitoring part 23, from the terminal equipment to respond to this automatic incoming call, is supplied to a terminal response identifying part 11 at the broadcasting board 1, and terminal equipment response condition is displayed by corresponding terminal response displaying parts 121, 122,... through the identifying part 11. On the other hand, when all the terminal equipments respond, an alarm is generated from an all-terminal response informing part 14 through an AND circuit 13, and the response confirmation of the operator of the voice multiple address operating board is executed simply and securely.
Patent JP-H0997755-A (JP)
Title: Mirror-surface wafer bonding method and device
Inventor: FUKAMI MASAO
IPC: H01L21/02
Filed: 1995-09-29
Abstract: PROBLEM TO BE SOLVED: To enable two mirror-surface wafers to be bonded together through a comparatively simple method without using a complicated and large device by a method wherein the mirror-surface wafers are placed on a sloping support, and the chamfered corner of the wafer is pressed under prescribed conditions. SOLUTION: When two mirror-surface wafers W1 and W2 of the same shape are bonded together making their mirror surfaces confront each other, the wafer W1 is rested on a support 4 which is previously fixed as tilted forming an angle of 70 deg. to 90 deg. with a horizontal direction and making its mirror surface face upwards, and the wafer W2 is made to gently overlap the wafer W1 making the mirror surfaces of the wafers W1 and W2 confront each other so as not to impose a load larger than the component force of its own weight on the wafer W1 . Then, the ridge of a convex curved-surface pressing member 7 of plastic body is made to bear against the one end of the chamfered corner 10 of the wafer W2 and slightly pressed against it, and the pressing member 7 is made to start bonding the wafers W1 and W2 together.  By this setup, two mirror-surface wafers are bonded together through a comparatively simple device preventing voids from occurring in a bonded surface without the manual operation of a skilled operator.
Patent JP-S61133479-A (JP)
Title: Forming system of face diagram
Inventor: ISHIMARU TOMOYUKI
IPC: G06F3/153
Filed: 1984-12-01
Abstract: PURPOSE:To improve remarkably the operation effciency by not using a basic graph comprising lines but extracting a profile of a closed smeared graph in forming a face diagram. CONSTITUTION:A processor unit 3 forms a smeared closed diagram on a bit map memory 1 in order to form, e.g., a road map. Then the bit map memory 1 is scanned in order from the upper part and processed in order from the left. In the process of scanning repetition, a flag (IN is set to 'false'. When two consecutive black areas are found out in the bit map memory 1, the flag (IN) is set to 'true'. Then the scanning is proceeded to the right. The scannings inverted (black to white level) until a white level is found not in the diagram. When the white point is found out, it is discriminated that he scanning point is at the outside of the diagram, then the flag (IN) is set to 'false' and the final black point remains not inverted. Thus, the profile of the closed diagram is extracted.
Patent JP-H0889816-A (JP)
Title: Catalyst for processing of hydrogenation
Inventor: HAYASHI IKUTAKA
IPC: B01J35/10
Filed: 1994-09-21
Abstract: PURPOSE: To improve desulfurization activity by preparing a catalyst wherein at least one hydrogenation active metal component is carried on a silica-alumina carrier in such a way that the vol. of pores with diameters in a specified range measured by means of a mercury pressing method is made to be a specified ratio. CONSTITUTION: In a catalyst for processing of hydrogenation wherein at least one hydrogenation active metal component is carried on a carrier consisting of silica-alumina contg. 2-40wt.% silica, the specific surface area is 200-400<2> m/g, the total pore vol. is 0.40-0.55ml/g and the vol. of pores with a diameter of 0-300 angstrom (hereinbelow abbreviated as Å) is at least 75% of the vol. of pores with a diameter of 40Å or larger. In addition, the mean pore diameter of the pores with a diameter of 0-300Å is 40-90Å and the vol. of pores with a diameter of 300-150,000Å is 0.01-0.25ml/g. In addition, the vol. of pores with a diameter of 300-600Å is at least 40% of the vol. of pores with a diameter of 300-150,000Å.
Patent JP-H0194718-A (JP)
Title: Cmos logical circuit device
Inventor: YOSHIDA KOICHI
IPC: H03K19/00
Filed: 1987-10-07
Abstract: PURPOSE:To change an input switching level with a software by connecting the serial circuit of P and NMOS transistors to an output edge and a power source or a ground point and giving an input signal and a switching signal to respective gates. CONSTITUTION:An NMOS transistor (n) 1 adjusts the current to one side PMOS transistor (P)2 to constitute a CMOS logical gate while a gate potential is fixed at Vcc and in an turn on condition, to an n3. On the other hand, p4 adjusts a current to flow from other n3 to constitute the CMOS logical gate while the gate potential is grounded and in the turn on condition, to p2 aud keeps always constantly an input switching level (L). When a signal input edge N3 is a high level, a level L is not changed, when it is set to a low level, p6 is turned on, the potential of n5 gives an influence to an output signal edge N2 and the level L is lowered. The input edge N3 can be changed by the software and the universal applicability of the hardware can be increased.
Patent JP-2001075630-A (JP)
Title: Stockpile product production planning system
Inventor: HARADA YUKIHIKO
IPC: G06F19/00
Filed: 1999-09-07
Abstract: PROBLEM TO BE SOLVED: To attain production planning so that one kind of products is obtained by as one time production as possible without making any arrangement several times within a predetermined unit period, and to reduce the possibility of the generation of stock shortage. SOLUTION: This system is provided with a periodic production managing part for managing periodic production in a unit period, an ordered amount shortage judging part for judging whether or not actual stock amounts are less than ordered amounts, an article shortage time predicting part for predicting an article shortage time from shipping predicted amounts and the actual stock amounts for the articles whose actual stock amounts are less than the ordered amounts, and a production judging part for judging when and which articles should be produced based on a production time equivalent to a production cycle planned by the period production managing part and the article shortage predicted time predicted by the article shortage time predicting part for the articles whose actual stock amounts are less than the ordered amounts.
Patent JP-H1196108-A (JP)
Title: Computer system and bus control device
Inventor: HIRAI TOMONORI
IPC: G06F13/362
Filed: 1997-09-18
Abstract: PROBLEM TO BE SOLVED: To dynamically execute priority control for data transfer and to optimize the transfer processing. SOLUTION: Respective queue parts 11 to 14 formed in every one of master device ports P1 to P4 respectively store transfer request packets applied from respective master devices 1 to 4 as queues, and at the completion of data transfer, a system queue part 15 inputs and stores the transfer request packet having the highest priority out of respective transfer request packets stored in respective queue parts 11 to 14. At the start of succeeding data transfer, the system queue part 15 sends the transfer request packet of the highest priority out of respective transfer request packets stored in itself and a transfer control part 16 controls data transfer based on the transfer request packet sent from the queue part 15.
Patent JP-H02101055-A (JP)
Title: Amide compound
Inventor: KISHINO HIROKO
IPC: C07D211/16
Filed: 1988-10-06
Abstract: NEW MATERIAL:A compound shown by formula I (R1 is 1-10C saturated hydrocarbon, 1-10C haloalkyl, 2-10C alkenyl, etc.; R2 is 2-10C saturated hydrocarbon group or alkoxyalkyl having 2-10 total carbons, etc.; R1 and R2 may form alkylene chain or alkenylene chain). EXAMPLE:N,N-Diethyl-4-methyl-3-cyclohexene-1-carboxamide. USE:A repellent for insect pests showing excellent repelling effects on insect pests such as mosquitoes, cockroaches and acarids and high residual effects. PREPARATION:A compound shown by formula II is reacted with an amine shown by formula III in a solventless state or in a solvent (e.g., toluene) optionally in the presence of a base (e.g., pyridine) at 0-120 deg.C for 0.1-24 hours to give a compound shown by formula I.
Patent JP-H1191764-A (JP)
Title: Packaging carton
Inventor: OIZUMI SHINYA
IPC: B65D5/50
Filed: 1997-09-18
Abstract: PROBLEM TO BE SOLVED: To reduce cost, and facilitate recycling readily by decreasing the number of members. SOLUTION: The carton includes a main body part 3 forming a sleeve part by being folded therein, and interior wall parts 14 contiguously formed at both ends of the main body and disposed substantially in parallel with exterior walls at distances by being folded therein, in which end support parts having a support hole 18 for fixture supporting the end parts of an enclosure 21 in the interior walls are formed integrally, and lock parts 14a are made at the end peripheries of the interior walls of the end support parts, thereby inserting the lock parts into slits 19 made in the main body part.
Patent JP-H0673361-A (JP)
Title: Hot-melt adhesive for temporary bonding of padding
Inventor: FUKUDA MASAO
IPC: C08G63/19
Filed: 1992-08-27
Abstract: PURPOSE:To obtain a hot-melt adhesive which enables thermal press adhesion at a low temp. and causes the adhesion once obtd. therewith to be nullified when heated again by using a polyester having specified glass transition point and softening point. CONSTITUTION:This adhesive is made from a polyester (pref. an arom. polyester having a wt.-average mol. wt. of 3,000-60,000) having a glass transition point of 45-70C deg. and a softening point of 85-120C deg.. Padding cloths impregnated with the adhesive are laid one on top of another and bonded to each other by thermal pressing at 70-120C deg.. After the resulting padding is sewn, it is heated to 90-160C deg. to nullify the adhesion. Thus, washing with water or a solvent and drying after washing are made unnecessary, the simplification of process is made possible, and a high-quality sewing product is obtd. without causing any change in the dimension of a surface cloth or a padding due to washing with water.
Patent JP-H03116820-A (JP)
Title: Misfit transposition control method
Inventor: MIKI KATSUHIKO
IPC: H01L21/20
Filed: 1989-09-29
Abstract: PURPOSE:To effectively control the misfit transposition generated in the vicinity of the interface between a semiconductor substrate and an epitaxial layer, and to contrive to put the getting action against the epitaxial layer into practical use by a method wherein the amount of external strain on the rear of a semiconductor substrate, before formation of the epitaxial layer, is controlled properly. CONSTITUTION:An epitaxial wafer 1 is formed by providing a P-type epitaxial layer 1b on one main surface of a P<+> type semiconductor substrate 1a. At this point, the impurity density of the semiconductor substrate 1a is made higher than the impurity density of the epitaxial layer 1b. When a misfit transposition is generated, SiO2 fine particles are jetted to the rear of the wafer on the semiconductor substrate 1a using a sand-blasting method before the P-type epitaxial layer 1b is formed, and an external strain (extrinsic strain) layer 1c is introduced. As a result, the spontaneously generating misfit transposition, which is immanent in the epitaxial wafer, is increased further, and it can be brought into a controllable state.
Patent JP-H05255403-A (JP)
Title: Dietary fiber-containing dextrin
IPC: C08B30/18
Filed: 1992-08-28
Abstract: PURPOSE:To provide a dextrin having a specific glucose residue, containing dietary fibers, and suitable as a raw material for functional foods free from colors and irritating smells by adding hydrochloric acid to corn starch. CONSTITUTION:The dextrin is obtained by adding hydrochloric acid to corn starch and subsequently heating the mixture with a twin-screw extruder at 120-200 deg.C, has a 1-4 glycoside bond-having glucose residue content of <=50% and has a dietary fiber content of >=12%. the dietary fiber content having a fluctuation range of <=+ or -5% from a numeric value determined from the relation of formulas Y=-80.7+3.448.X1, Y=46.5--0.713.X2, etc., wherein Y is the content (X) of the dietary fibers; X1 is the content (%) of the non-reducing terminal glucose residues; X2 is the content (X) of the glucose residues having the 1-4 glycoside bonds. The heating is preferably performed at >=140 deg.C.
Patent JP-2000073051-A (JP)
Title: Production of high-speed excitable, high luminant and low attenuating luminescent material
Inventor: KAKU KEIRYU
IPC: C09K11/80
Filed: 1999-09-08
Abstract: PROBLEM TO BE SOLVED: To provide a production method of a high-speed excitable, high luminant and low attenuating luminescent material having high-speed excitability and high initial luminance. SOLUTION: This production method comprises following steps; raw materials are each a strontium compound or calcium compound, α-Al2O3, γ-Al2O3, a boron compound, an europium compound and at least one compound selected from a bismuth compound, a magnesium compound or a manganese compound, these raw materials are pulverized, at least one raw material is treated with an acid, all raw materials are mixed, the resultant mixture is burnt by increasing slowly from 400 deg.C to 1,600 deg.C for 7-10 h, heated at 1,250-1,600 deg.C for 3-5 h, then cooled to 200 deg.C for 7-10 h, pulverized and classified.
Patent JP-H1094884-A (JP)
Title: Spot welding machine
Inventor: HORIUCHI SHOZO
IPC: H02M9/00
Filed: 1996-09-26
Abstract: PROBLEM TO BE SOLVED: To immediately start the charging after the discharge command is turned off by charging the input voltage of a welding machine in a capacitor through the full-wave rectification, and turning on/off a power element having the high-speed switching speed to control the discharge from the capacitor. SOLUTION: A rectification and voltage control part 10 of a spot welding machine comprises a full-wave rectification circuit 11, an insulation gate type bipolar transistor IGBT0, and a current-limiting 'resistance R. The full-wave rectification circuit 11 comprises diodes D1-D6. The insulation gate type bipolar transistor IGBT0 receives the charging command from a control circuit 12 and controls the charging. IGBT has both the high-speed switching characteristic and the voltage drive characteristic of MOS FET, and the low-ON voltage characteristic of a bipolar transistor. When the charging command is tuned off, a power element is immediately turned off, and the delay time is unnecessary.
Patent JP-H02192920-A (JP)
Title: Injection-molded vessel for food and its manufacture
Inventor: NAKAMICHI MASAHIRO
IPC: B29C45/14
Filed: 1989-09-29
Abstract: PURPOSE:To enable the title vessel to be used suitably even in the case of heating by an electronic oven, which is superior in characteristics such as heat resistance, oil resistance and mechanical strength and can be molded into an arbitrary form, by injection-molding a specific resin composition. CONSTITUTION:The title vessel is of an injection-molded vessel for food com prised by injection-molding a polyallylene sulfide resin composition containing a glass fiber or the glass fiber and the other inorganic filler at the rate of 20-70wt.%. Then the polyallylene sulfide resin composition containing the glass fiber or the glass fiber and the other inorganic filler at the rate of 20-70wt.% is injection-molded under a condition of a mold temperature of 130-180 deg.C by making use of a mold whose surface roughness is not exceeding 5mum. A halogenated aromatic compound and a sulphur source such as an alkaline metal sulfide are polymerized in, for example, a polar solvent at the resulting com pound is used as the polyarylene sulfide resin. The inorganic filler other than the glass fiber, whose particle diameter or a fiber diameter is preferably 0.1-15mm, such as silica, calcium carbonate, talc, titanium white, carbon black, a carbon fiber, and a boron fiber can be mentioned as the inorganic filler.
Patent JP-S62115504-A (JP)
Title: Three-dimensional working system
Inventor: YAJIMA TAKASHI
IPC: G05B13/02
Filed: 1985-11-15
Abstract: PURPOSE:To easily perform a PTP working on an object having a free curved surface by holding each model of a working object and a working tool represented with a Badieu curved surface within a data base, and finding the working locus of the working tool with these models. CONSTITUTION:The working object on which a modeling by a regulated curved surface and the Badieu curved surface is applied and a working point on the model are stored at a working object and working point data base 200. The data base 200 within a three-dimensional working system 1 sends the model and the working point to a semi-optimum tool locus deciding device 400. The device 400 approximates said curved surface with a polyhedron, and by finding the shortest path between two working points on the polyhedron, a quasi-shortest path along said curved surface between working points is found and is sent to a working device control quantity deciding device 500. The device 500 decides the control parameter of the working device base on the working tool locus given from the device 400 and a working device model read from a working device model data base 300, and sends it to a working device controller 600.