baber/WOPTO huggingface dataset:
Patent JP-H04128125-A (JP)
Title: Heat insulating packing box
Inventor: FUKUDA SHIRO
IPC: B65D5/24
Filed: 1990-09-12
Abstract: PURPOSE:To enable assembly by bending and to store the box in flat state when not used, and to improve thermal insulation, resistance against shock and duration by a method wherein an original board having a three-layer structure of a foamed resin sheet and two boards which sandwich the foamed resin sheet from both sides is used, a connecting part is formed between four peripheral walls which rise up from four sides of a bottom part. CONSTITUTION:An original board 20 has a three-layer structure of a foamed resin sheet 20A and two boards 20B and 20C which sandwich the foamed resin sheet. Four peripheral walls 2 to 5 are raised, diagonal lines 6A to 9A are bent, and connecting parts 6 to 9 are contacted intimately with outer surfaces of the peripheral walls 2 and 3. After contacting intimately connecting parts 8 and 9 with the peripheral wall 3, a small width part 12 is bent outward to sandwich the connecting parts 6 and 7. Next, an upper lid part 10 is bent, covering parts 14 to 16 are bent inward respectively and inserting parts 17 to 19 are also bent respectively to enter inside of small width parts 11 to 13. Spaces formed between the connecting parts 8 and 9 and the small width part form holds for carrying.
Patent JP-H03104126-A (JP)
Title: Compound semiconductor device
Inventor: MIMINO YUTAKA
IPC: H01L21/338
Filed: 1989-09-18
Abstract: PURPOSE:To make it difficult for electrodes to flow in a gate electrode from an electron feeding layer and to improve breakdown strength of the gate by a method wherein a high-resistance layer having an electron affinity smaller than that of the electron feeding layer is provided between the gate electrode and the electron feeding layer. CONSTITUTION:A buffer layer 2, a first compound semiconductor layer 3, a second compound semiconductor layer 4 and a third compound semiconductor layer 5 are laminated on a compound semiconductor substrate 1. The electron affinity of the layer 4 which is an electron feeding layer is smaller than that of the layer 3, which is an electron travelling layer, and the electron affinity of the layer 5 which is a high-resistance layer is smaller than that of the layer 4. A resist pattern for forming a gate electrode 6 is formed on the layer 5 to deposit an Al film and the electrode 6 is formed. Then, the layer 5 is removed using the electrode 6 as a mask, source and drain electrodes (source and drain layers) 7 and 8 are formed on the layer 4 on both sides of the electrode 6 and an impurity is made to diffuse up to the interior of the layer 3 by a diffusion heat treatment to form alloy layers. Electrons are fed from the layer 4 to the layer 3 and a two-dimensional electron gas layer is formed. Thereby, a source-drain resistance is made low and a gate breakdown strength can be made high.
Patent JP-H0287626-A (JP)
Title: Manufacture of semiconductor device
Inventor: HIRAKAWA KATSUNORI
IPC: H01L21/3205
Filed: 1988-09-26
Abstract: PURPOSE:To eliminate a skirt-trailed shape of end parts of a photoresist pattern and to prevent a photoresist from being retreated during an etching operation by a method wherein a photoresist film patterned to be a required pattern is heat-treated and its shape is changed in such a way that the end parts of the pattern become thick. CONSTITUTION:A polycrystalline silicon film 3 is formed on a silicon oxide film 2 on the surface of a semiconductor substrate 1; in addition, its upper part is coated with a positive-type photoresist 4; the photoresist is exposed to light and developed; a mask is formed. Then, this assembly is heat-treated, e.g., at 150 deg.C for 40 seconds; a shape is changed in such a way that end parts of a pattern of the photoresist film 4 become thick. Thereby, a skirt-trailed shape which has been formed at the end parts of the photoresist film is eliminated. Then, when the polycrystalline silicon film 3 is etched anisotropically by using the photoresist film 4 as a mask, the photoresist is not retreated since the end parts are thick; a required pattern can be obtained.
Patent JP-S60133737-A (JP)
Title: Semiconductor device mounting structure
Inventor: IINUMA YOSHIO
IPC: H01L23/28
Filed: 1983-12-21
Abstract: PURPOSE:To correct an improper portion by pressing an elastic member through a conductive rubber on a substrate and a semiconductor device. CONSTITUTION:In order to place an IC5 and a conductive rubber connector 7 at the prescribed positions on glass substrates 1, 2, a guide frame 6 is previously secured onto the substrates 1, 2. A retainer spring 8 presses substantially the center of the IC5. The pressing of approx. 3gr per bump is sufficient, and no influence is recognized to the IC5. If an improper portion is presented after inspecting the assembling, the spring 8 is removed to exchange the connector 7, and the IC5. When the completely good device is confirmed as a liquid crystal indicator, epoxy resin is molded at the periphery of the IC5 to protect the IC5.
Patent JP-H0580289-A (JP)
Title: Polarization direction switch
Inventor: INOUE YASUYUKI
IPC: G02F1/13
Filed: 1991-09-20
Abstract: PURPOSE:To rotate a linearly polarized wave without any high-speed mechanical operation nor loss variation. CONSTITUTION:While a liquid crystal cell 5 wherein a polarizer 4 and nematic liquid crystal are charged is sandwiched, collimator lenses 6A and 6B to which polarization maintaining fibers 7A and 7B are connected respectively are arranged opposite each other while having their optical axes aligned with each other; and an external electrode terminal 9 is connected to a liquid crystal cell 5 through an AC/DC converting IC 8 and the collimator lenses 6A and 6B, polarizer 4, liquid crystal cell 5, IC 8, and external electrode terminal 9 are fixed on the same substrate 1.
Patent JP-S6398325-A (JP)
Inventor: TEZUKA YASUHIRO
IPC: A01G9/10
Filed: 1986-10-14
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S60133863-A (JP)
Title: Production of rapidly solving food product
Inventor: NAKANO MASAO
IPC: A23L3/34
Filed: 1983-12-23
Abstract: PURPOSE:Hydrophobic fine particles of a food additive are mixed with polyglycerol fatty acid ester to give humectant properties to organic acids hard soluble in water, thus giving food products readily soluble in water. CONSTITUTION:For example, (A) hydrophobic particles of food additive such as particles of 200 mesh under selected from adipic, benzoic, sorbic, dehydroacetic and fumaric acids are soaked in a solution of (B) a polyglycerol fatty acid ester, e.g., an ester from polyglycerol of 3 or more polymerization degree and a fatty acid of 5-17 carbon atoms with a HLB of 7-18 so that the ester is included by 0.005-2wt%. Then, the product is dried, preferably at 50-120 deg.C to obtain the objective food product.
Patent JP-H1161667-A (JP)
Title: Pc strand having rust proof coat and its production and apparatus
Inventor: CHIGIRI KAZUYOSHI
IPC: D07B1/10
Filed: 1997-08-23
Abstract: PROBLEM TO BE SOLVED: To obtain PC strand capable of completely embedding space between center wire and each side wire with a rust proof material and coating the outer layer of side wire by using an extruder and provide a method and an apparatus for producing the PC strand. SOLUTION: This method for producing PC strand having rust proof coat comprises closely forming a rust proof coat layer on the circumference of a center wire and each side wire of PC strand by a process for applying a primer to a PC strand obtained by laying plural side wires on the outer periphery of the center wire and then, heating the PC strand, a process for passing the PC strand through spiral die along twist of the PC strand provided in cross head introduction opening part of the extruder 5 having a heater, making a thermoplastic synthetic resin material in melt state pressurized by a pressure auxiliary head part 7 to flow back to a cross head introduction opening part, packing the thermoplastic synthetic resin material therein and further,  extruding the resin material from a molding die 8 at the tip of pressure auxiliary head part 7 and a process for applying a thermoplastic synthetic resin material onto the outer periphery of the side wire by a secondary extruder 25 while squeezing the resin material with a secondary molding auxiliary dice 24.
Patent JP-H05192220-A (JP)
Title: Depilating device
Inventor: HERUMAN JIYORUDARU
IPC: A45D26/00
Filed: 1992-09-10
Abstract: PURPOSE: To provide an unhairing device excluding the bending torque generated on punch disks with a compression member, further increasing the pinching force between the pinch disks, and having a good operation. CONSTITUTION: Pinch disks are connected to a drive shaft 11, the pinch disks are directed in the crossing direction to the drive shaft 11 against the adjacent pinch disks, the pinch disks are rotated around the rotary axis 113 determined by two rotary studs 41, 55, and the pinch surfaces of the adjacent pin disks reach the pinch positions where their pinch forces are added near an unhairing opening in this unhairing device. Each pinch disk located at the pinch position related to one of two adjacent pinch disks is supported by a force transmission stud 59 of the other adjacent pinch disk near the related pinch surface.
Patent JP-H0965241-A (JP)
Title: Caption moving device
Inventor: FUJISAKI EIJI
IPC: G09G5/22
Filed: 1995-08-28
Abstract: PROBLEM TO BE SOLVED: To provide the caption moving device in which movement of only a caption is realized and identification of the caption after magnification is excellent. SOLUTION: A video signal received at an input terminal 1 is separated into a luminance signal and a chrominance signal by a Y/C separator section 2. A pulse signal generating section 4 generates, e.g. a high level pulse signal only in the state of a color where color information is included in the color signal. A 1st gate 3 provides an output of the luminance signal from the separator section 2 only when a low level pulse signal is given from the generating section 4. A caption discrimination section 5 compares the luminance signal with the reference level and generates a high level discrimination signal in the case of excess of the level only. The discrimination signal is inverted by an inverter 6. A 2nd gate 7 provides an output of the luminance signal from the separator section 2 only when the high level inversion signal is received from the inverter 6.  An adder 10 adds the discrimination signal via the memory 8 and the luminance signal from the 2nd gate 7 to generate a display luminance signal.
Patent JP-H08105519-A (JP)
Title: Pulley support structure
Inventor: HAYASHI HIDEKAZU
IPC: F16H55/36
Filed: 1994-10-06
Abstract: PURPOSE: To make a pulley mounting operation simple, and enhance operating efficiency by pushing the inner diameter section of a pulley into a shaft with a groove so as to be inserted therein, letting the end section of a taper shaped step section be engaged with the groove section of the shaft, and thereby mounting the pulley onto the shaft. CONSTITUTION: A pulley 56 has a support member 74 pressed in its inner diameter section via a bearing 72, and a taper shaped step section 74A is formed in the circumferential surface of the inner diameter section of the support member 74 in the vicinity of its tip end section. Meanwhile, a stationary shaft 70 has a groove section 70A formed in the circumferential surface in the vicinity of its tip end section, and concurrently a taper 70B is formed in the circumferential surface of its tip end section. The end section of the taper shaped step section 74A is engaged with the groove section 70A of the stationary shaft 70 so as to allow the pulley 56 to be mounted onto the stationary shaft 70 by pushing and inserting the inner diameter section of the pulley 56 thereto along the stationary shaft with a groove 70.  By this constitution, the pulley 56 can thereby be upheld by the stationary shaft 70 without falling off in one operation that the pulley 56 is pushed in the stationary shaft 70.
Patent JP-2001061772-A (JP)
Title: Fluid controller for endoscope
Inventor: KOMI SHUJI
IPC: A61B1/00
Filed: 1999-08-30
Abstract: PROBLEM TO BE SOLVED: To enable the smooth operation of an operation button with light force by the hands and fingers with a fluid controller which operates to change over flow passages by pressing the operation buttons connected to the front end of a valve stem by connecting the operation buttons to the valve stem relatively immovably in its axial direction and freely rotatably. SOLUTION: A main body operation part of the endoscope is provided with the plural operation buttons on the front surface on its base end side and is provided with, for example, the suction button 7 and the air feed button. A control valve 10 for suction operated by the suction button 7 is mounted within a housing 9 of the main body operation part. A cylindrical valve element 14 is freely vertically movably mounted at a valve casing 11 of this control valve 10 and a guide part 14a within a large-diameter part 16a of a partition wall 16 of the valve element 14 is successively provided with the valve stem 14b. The valve stem 14b projects upward from the housing 9 constituting the main body operation part 1 and the control valve 10 is changed over by making operation to push the suction button 7 connected to the projecting part.
Patent JP-S60133787-A (JP)
Inventor: MATSUURA SHIYUUICHI
IPC: H05K1/03
Filed: 1983-12-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000071217-A (JP)
Title: Segment molding form
Inventor: TANIGUCHI YASUSHI
IPC: B28B1/08
Filed: 1998-08-28
Abstract: PROBLEM TO BE SOLVED: To remove foams just by providing slits formed on a cover form and control the generation of pockmarks without using an air permeable finishing material by forming a number of vertically long slits in the longitudinal direction on a bending protruded face of the cover form. SOLUTION: Assembled reinforcing bars and fitments are disposed in a main body form, and an upper face opening of the main body form is set in the closed state by using a cover form 2 and highly fluidized concrete is filled from a concrete filling opening 3 into the main body by using an introduction hopper. At that time, the highly fluidized concrete is filled to the degree beyond the concrete filling opening 3 to form an excessive heat portion. Then a press cover as a pressurizing means is pressed into a filling guide, and excessive heap portion concrete is pressed into the main body form and pressurized therein. The formation of unfilled sections and residual foams likely to be generated on the periphery of the concrete filling opening 3 can be avoided by heaping excessively, pressing in and pressurizing, and also the excessive water in concrete can be discharged out of slits 4.
Patent JP-S60134277-A (JP)
Inventor: SEKIDO MUTSUHIRO
IPC: H05B33/12
Filed: 1983-12-22
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000072393-A (JP)
Title: Three-wheel type forklift truck
Inventor: ITO YOSHIHARU
IPC: B60B35/14
Filed: 1998-08-28
Abstract: PROBLEM TO BE SOLVED: To improve the traveling stability without extending a gangway width for rectangular stowage by constituting steering wheels juxtaposed in the rear part of a machine base in such a manner that the treads thereof can be regulated. SOLUTION: A hydraulic cylinder 11 is fixed to a rear accelerator 10, axle parts 21, 21 are provided on each tip of piston rods 20, 20 inserted thereto in such a manner as to be expansible and contractible and bilaterally extended, and steering wheels 22, 22 are mounted thereon. The cap side 12 and head side 13 of the hydraulic cylinder 11 are connected to a pressure pipe line A and to a hydraulic valve 30 through a pressure pipe line B, respectively, and switched by manual operation to selectively allow the hydraulic pump 31 to communicate with the hydraulic cylinder 11. Accordingly, the hydraulic valve 30 is operated during traveling and switched to a position (a), the pressure oil is carried into the cap side 12 of the hydraulic cylinder 11 through the pipe line A to promote the extension of both the piston rods 20, 20, whereby the treads of the steering wheels 22 are extended.  According to this, the stable angle in the center-of-gravity position is incidentally increased to improve the stability of the vehicle.
Patent JP-S62104849-A (JP)
Title: Composition for rubber having high hardness
Inventor: ARIYOSHI TAKASHI
IPC: C08L11/00
Filed: 1985-10-31
Abstract: PURPOSE:The titled composition, obtained by incorporating a powdery rubber, having a specific Mooney viscosity and prepared by a chemical method with a filler for rubber having high hardness, having excellent kneading property and pressurizing moldability and capable of producing rubber products having high hardness at a low cost. CONSTITUTION:A composition obtained by incorporating (A) 100pts.wt. powdery rubber which is prepared by mixing a chemical method, preferably mixing an anionic or nonionic rubber latex with an anionic water-soluble high polymer and mixing the resultant mixture with a cationic high polymer, cationic surfactant, etc., capable of causing coacervation with the above-mentioned high polymer, separating the rubber particles from the rubber latex, adding and mixing a synthetic resin emulsion and dehydrating and drying the mixture and having 5-30 Mooney viscosity with (B) 80-800pts.wt., preferably 90-600pts.wt. filler for rubber having high hardness, e.g. carbon black, inorganic reinforcing agent, inorganic filler, etc., in a powder mixer.
Patent JP-2001067521-A (JP)
Title: Electronic instrument
Inventor: KIDERA KINICHI
IPC: G07D9/00
Filed: 1999-08-30
Abstract: PROBLEM TO BE SOLVED: To protect data of a personal computer based on the detection of the abnormality of an AC input power at an early stage by installing an independent personal compute power control means which is apart from a main power control means and controls the power of the personal computer and installing power abnormality detection means that individually detect the abnormality of AC input power in both power control means. SOLUTION: AC voltage detection circuits 45 and 49 which individually detect the abnormality of AC input power are installed in a main power part 39 controlling the whole power of an instrument and the independent PC power part 33 of a personal computer, which is apart from the main power part 39. The circuits are set so that they separately detect the power abnormality. When the abnormality occurs in the AC input power, abnormality detection signals are detected by a main power part 39side and a PC power part 33-side. The PC power part 33-side can preferentially detect the abnormality detection signal of an earlier detection time side of the AC voltage detection circuit 45 or 49.
Patent JP-H0288625-A (JP)
Title: One-pack type epoxy resin composition and method for application thereof
Inventor: YAMAMOTO HIROSHI
IPC: C08G59/40
Filed: 1988-09-27
Abstract: PURPOSE:To obtain the subject composition, containing an epoxy resin which is a liquid at ordinary temperature, ketimine-based curing agent and curing agent for not curing and excellent in showering resistance without scattering or falling off by showers in washing steps. CONSTITUTION:The objective composition containing (A) 100 pts.wt. epoxy resin which is a liquid at ordinary temperature (preferably having >=2 epoxy groups in one molecule and 50-400 epoxy equiv.), (B) 3-30 pts. wt. ketimine-based curing agent and (C) preferably 3-15 pts. wt. curing agent for not curing (e.g., dicyandiamide). The above-mentioned composition is applied to an adherend to cure the ketimine-based caring agent with moisture or water to increase the viscosity of the above-mentioned composition, which is then cured by heating.
Patent JP-S61122687-A (JP)
Inventor: OOTA MAKOTO
IPC: G09F9/40
Filed: 1984-11-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001066659-A (JP)
Title: Shutter device for camera
Inventor: KONO TAKANORI
IPC: G03B9/08
Filed: 1999-08-30
Abstract: PROBLEM TO BE SOLVED: To provide a shutter device for a camera constituted so that both of a diaphragm aperture plate and a shutter blade can be driven by a single driving source. SOLUTION: The diaphragm aperture plate 2 of this shutter device for a camera is set at one out of an initial position inside a lens aperture 1A and a retreat position outside the aperture 1A. The plate 2 is normally pressed to the initial position but it can be moved toward the retreat position from the initial position by interlocking with the shutter blade 3. The blade 3 can travel in an open direction toward a full open position from a full close position through an intermediate position according to driving force from the driving source 4. At the full close position, the blade 3 fully closes the aperture 1A. At the intermediate position, the blade 3 is started to be interlocked with the plate 2. At the full open position, the interlocking between the blade 3 and the plate 2 is finished and the blade 3 fully opens the aperture 1A.  Besides, a control part controls the driving force outputted from the driving source 4 so as to switch it according whether the plate 2 is used or not based on photographing information. Then, when the plate 2 is used, it is made to stay at the initial position by evading the interlocking with the blade 3. When the plate 2 is not used, it is interlocked with the blade 3 and moved to the retreat position.
Patent JP-S61123160-A (JP)
Title: Welding method for pin of package for semiconductor device
Inventor: HARADA SHIGEKI
IPC: H01L23/50
Filed: 1984-11-20
Abstract: PURPOSE:To prevent the application of thermal stress to the whole semiconductor-device package owing to the partial heating only of connecting sections, to narrow the intervals of connecting pins and to connect the connecting pins positively to an electrode pad for the package by electrically welding the connecting pins to the electrode pad. CONSTITUTION:When a connecting pin 6 is connected to a semiconductor package 1 in which the connecting pin 6 is fitted onto the base of a pin-grid-array type, etc., the upper section of an electrode pad 2 connected to a section 5 for outer-circumferece plating through a via hole 3 and inner-layer putters 4, 4 in the package 1 is coated with a Ni layer as a welding intermediate layer 7, a connecting pin 6, which consists of a Fe alloy containing 42% Ni or a Fe alloy containing 29% Ni and 17% Co or the like and takes a plate shape and a lower end section thereof takes a conical shape, is pushed, and the upper end of the pin 6 and the terminal 5 for plating are connected and welded to an external power supply. Accordingly, only a welding section may be heated partially, thus positively welding the connecting pin to the electrode pad without applying thermal stress to the whole package.