baber/WOPTO huggingface dataset:
Patent JP-2002293684-A (JP)
Title: Coated granular fertilizer
Inventor: FUKUMOTO DARUMA
IPC: B05D7/00
Filed: 2001-12-25
Abstract: PROBLEM TO BE SOLVED: To provide a coated granular fertilizer which is coated with a film containing straight chain hydrocarbon having a branch chain content of <=10 wt.% and a weight average molecular weight of >=300 and further the coated granular fertilizer which is coated with the outer layer film containing a biodegradable resin and/or water-soluble resin. SOLUTION: The elution of fertilizer components is controlled in the fertilized environment and the film which is the coating material is biodegraded and therefore the load on the peripheral environment is lessened. The mechanical strength of the film is excellent and part of the film is not subjected to damage, such as peeling and chipping during compounding with other fertilizers and during transportation or mechanical fertilization. In addition, the fertilizer does not affect the elution controllability.
Patent JP-2003197048-A (JP)
Title: Dislocated superconductive tape unit and superconductive application apparatus using it
Inventor: GOTO KENJI
IPC: H01B12/08
Filed: 2001-12-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a dislocated superconductive tape unit capable of maintaining a dislocated standing structure even when bending distortion is applied by a wire winding process or the like, reducing an alternating current loss in energization of an alternating current, and suppressing drift, and a superconductive application apparatus using the dislocated superconductive tape unit.  <P>SOLUTION: The dislocated superconductive tape unit 15 is composed by arranging laminated bodies 18a and 18a of a plurality of tape-like superconductors 18 in parallel and stranding the plurality of tape-like superconductors 18 composing the laminated bodies 18a and 18a in a dislocated state. A tape 30 for maintaining the dislocated stranding structure is wound with play around the dislocated superconductive tape unit, and one portion of the tape 30 for maintaining the dislocated stranding structure is interposed between the laminated bodies of the plurality of the tape-like superconductors. The superconductive application apparatus uses the dislocated superconductive tape unit 15.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003155532-A (JP)
Title: Cage rotor
Inventor: SHINABE SHINJI
IPC: B22D21/04
Filed: 2001-12-27
Abstract: PROBLEM TO BE SOLVED: To obtain a cage rotor consisting of an aluminum alloy cast having tensile strength of >=10 kgf/mm<2> at 150 deg.C and electroconductivity of 50% IACS or higher at room temperature. SOLUTION: The cage rotor is obtained by subjecting an aluminum alloy obtained by adding at least one kind selected from, by weight, 0.02 to 0.1% Sn, 0.2 to 2.0% Cr, 0.02 to 0.15% In and 0.02 to 0.1% Ag to an aluminum alloy containing 0.2 to 1.0% Zr and 0.05 to 1.0% Si, or an aluminum alloy containing 0.2 to 1.5% Hf and 0.05 to 1.0% Si to casting into a mold of the cage rotor, and thereafter performing aging treatment in the range of 300 to 450 deg.C. Before the aging treatment, solution treatment at 550 to 640 deg.C, and the subsequent rapid cooling treatment can be performed. Alternatively, before the aging treatment, low temperature aging treatment can be performed at 50 to 150 deg.C.
Patent JP-2003203328-A (JP)
Title: Glass substrate for magnetic disk and its manufacturing method
Inventor: KONDO TAKAHISA
IPC: C03B11/00
Filed: 2001-12-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a molded glass substrate for magnetic disk which has a free surface comprising a projecting part in the center part on one and/or the other side and an outer peripheral part in the mirror surface state and which can be coupled to a rotation driving part with position control of high precision or positioned to a spacer for a multilayer structure of molded glass substrates by using the projecting part and to provide a method for manufacturing the glass substrate by pressure molding which doesn't bring about industrial waste.  <P>SOLUTION: With respect to the glass substrate for magnetic disk provided with upper and lower principal surfaces which has a magnetic medium formed on a worked plane of a work member, flanges connectable to a rotation driving shaft are joined and fixed to the center of the principal surfaces.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003196784-A (JP)
Title: Device, method and program for processing information
Inventor: KANAYAMA KENJI
IPC: G08G1/00
Filed: 2001-12-28
Abstract: <P>PROBLEM TO BE SOLVED: To accurately calculate a traffic amount while protecting privacy.  <P>SOLUTION: A road side controller installed on a road transmits a data string including a spot dynamic code 75 to vehicles existing in the communication area of the road side controller. The spot dynamic code 75 includes an N position code consisting of an area code showing the position at which the road side controller is installed and a count value counted by a counter. The N position code is transmitted and received between the road side controller and the vehicle, and traffic volume, speed, congestion occupancy ratio, special density, travel time, etc., are calculated by using the period of time when the N position code is transmitted and received.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003501994-A (JP)
Title: 同期機
IPC: F03D9/25
Filed: 2000-03-03
Abstract: (57)【要約】
【課題】  構造が簡単であり、かつ、短絡時に発生する短絡トルクが小さい同期機を提供する。
【解決手段】  本発明による同期機は、回転子と固定子とを有し、風力発電装置等に用いられる。その固定子は、電気的および／または空間的に、互いに隔離された少なくとも２つの独立交流（三相電流）巻線を有する。
Patent JP-2003502799-A (JP)
Title: ランプ
IPC: H01J5/50
Filed: 2000-05-29
Abstract: (57)【要約】
ランプ（１）に、絶縁部材（１２Ａ）を収容する貫通孔（１５）を有する端部（１１）が設けられ、前記絶縁部材が、ランプ（１）からこの絶縁部材中の孔（１７、１８）を通ってそれぞれ延在する少なくとも２本の導体（１３、１４）によりランプ（１）に固定されている。前記絶縁部材（１２Ａ）及び貫通孔（１５）は、この絶縁部材（１２Ａ）がランプ（１）に対して回転も横方向変位もしないように保持されるような形状となっている。前記絶縁部材（１２Ａ）は、その端部から離れて、好ましくは中央部分に、最も好ましくは方形形状の部分（２０）により連結された２つのほぼ八角形の部分（１６）を有するように切抜き部分（Ｂ）を有し、これら切抜き部分（Ｂ）を通して貫通孔（１５）の下側の材料が露出されているようにする。
Patent JP-2003516605-A (JP)
Title: プラズマディスプレイ・パネル
IPC: H01J17/49
Filed: 1999-10-10
Abstract: (57)【要約】
【課題】  グリッド・メッシュ板式電極を共同電極とし、相互に直交する電極組をマトリックス・アドレシングとスキャニング電極とする新型構造のプラズマディスプレイ・パネルを提供する。
【解決手段】  前基板と、後基板と、前基板と後基の間に挟まれ設置され前、後基板を支えるための、メッシュ孔アレイを含む導電グリッド・メッシュ板とを備えるプラズマディスプレイ・パネルにおいて、グリッド・メッシュ板におけるグリッド・メッシュ孔は、後基板におけるアドレシング電極と前基板におけるスキャニング電極と共に、ディスプレイ・パネルにおける放電単元を形成し、また前記グリッド・メッシュ板は、その表面における隣接のメッシュ孔同士の間に気体案内溝を設置されている。従来のプラズマディスプレイ・パネルと比べ、より高い分解能と発光輝度を有し、より高い光透過率、より低い動作電圧を有し、歩留まりは高く製造コストは低い。
Patent JP-2003507863-A (JP)
Title: 冷陰極およびその製造方法
IPC: H01J1/304
Filed: 1998-06-23
Abstract: (57)【要約】
本発明は電界効果電子放出装置のための効率の高いフィルムの製造に関し、前記フィルムは、フラットディスプレー、電子顕微鏡、マイクロ波電子工学装置、光源、およびその他の様々な用途の装置を製造するために用いることができる。さらに詳細には、本発明は炭素フィルムを上に有する基板を含む冷陰極に関する。炭素フィルムは、基板の表面に対して垂直に配向していて０.０１〜１ミクロンの典型的なサイズと０.１〜１０μｍ -2 の分布密度を有する炭素のマイクロ-リッジおよび／またはマイクロ-スレッドからなる不規則な構造を有する。本発明はまた、冷陰極を製造する方法に関し、前記方法は、水素と炭素含有添加物の混合物中でＤＣ電流放電を発生させる工程と、陽極に置かれた基板の上へ炭素相を堆積させる工程を含む。この方法は、放電が０.１５〜０.５Ａ/cm 2 の電流密度において行われることを特徴とする。堆積工程は、水素とエチルアルコールまたはメタンの蒸気を含む混合物中で５０〜３００Torrの全体圧力および６００〜９００℃の基板温度において実施される。エチルアルコールの蒸気の濃度は５〜１０％であり、メタンの蒸気の濃度は１５〜３０％である。この方法はまた、冷陰極を製造するための別の方法に関し、前記方法は、１００〜１０００Ｗの入力においてマイクロ波放電を発生させることを含む。この放電は、０.８〜１.２の比率の濃度のガス状二酸化炭素とメタンを含む混合物中で１０〜２００Torrの圧力下で発生され、炭素相が基板上に堆積する。この方法は、堆積工程が５００〜７００℃の基板表面の温度において実施されることを特徴とする。
Patent JP-2003509908-A (JP)
Title: 通信システムおよびそれに用いる受信機
IPC: H04L27/14
Filed: 2000-09-06
Abstract: (57)【要約】
角度変調信号は、通信システムにおいて、一定間隔をもって転送データ（ｄ k ）に挿入され、転送データ（ｄ k ）と共に位相変調された符号化情報と共に、転送される。この符号化は、パルス波形整形に用いられ、これにより、受信機（２７）は、デジタル転送データ（ｄ k ）を、実行するのに複雑さは少なく、かつ、搬送位相制御をすることなく、適切な信号工程により復元できる。
Patent JP-2003512588-A (JP)
Title: 外圧に耐えるねじ付パイプコネクタ
IPC: E21B17/042
Filed: 2000-10-17
Abstract: (57)【要約】
特に石油及びガス産業用に設計されたジョイントから作られる管用のねじ付きジョイント及び管組立体である。ジョイントは、第１管（３）の端部に配置された雄型要素（１）と第２管（４）の端部に配置された雌型要素（２）とを備える。雄型要素には外側のテーパーねじが設けられ、雌型要素にはその雄型要素のねじに対応する内側のテーパーねじが設けられている。雄型ベアリング面及び雌型ベアリング面によって形成された中央シール手段（９）が互いに押し合い、それぞれが雄ねじ部分及び雌ねじ部分のねじ部が中断されている領域に配置されていて、ジョイントが組み立てられたときにシール状態を確保する。ジョイント及びそのジョイントによって形成された管は特に外部からの高圧に対抗するシール性能の点から有用である。
Patent JP-2003518187-A (JP)
Title: 熱衝撃抵抗性を有する封入剤組成物
IPC: H01L23/31
Filed: 2000-11-14
Abstract: (57)【要約】
０℃より低いガラス転移温度を有し、反応性官能価を有する柔軟炭化水素主鎖を有する非シリコーンオリゴマーと、定着剤４０重量％までと、任意の粘度調整成分と、を含有する、電子部品の無溶剤の疎水性樹脂封入のための熱機械衝撃抵抗性硬化組成物。
Patent JP-2003524779-A (JP)
Title: 近接場光学方法で生物対象を分析する装置
IPC: G01N21/01
Filed: 2000-01-20
Abstract: (57)【要約】
本発明は、極めて多数の細胞を、その分子反応体との反応状態に関して測定及び評価する過程で、近接場光学条件下で判定することができる装置に関する。試料ステージは、試料ステージ内に、ナノ乃至マイクロ領域内の種々の孔径の光源を装入することによって特徴付けられる。２Ｄナノ光源アレイは、走査パターン状に並置されていて、共通に、又は、順次に励起される多数の近接場光源によって構成される。坦体材料として、半導体材料が使われる。
Patent JP-2003534834-A (JP)
Title: 投与量設定リミッター
IPC: A61M1/36
Filed: 2001-01-18
Abstract: (57)【要約】
【課題】投与量設定リミッター
【解決手段】薬液を含むアンプルを収容するハウジングと、ハウジングに対し回転し、それによって投与量が設定される投与量設定回転ノブと、作動されたとき設定された投与量を押し出す射出用ボタンとを備えるタイプの医用注射器用の投与量設定リミッターであって、ハウジングに接続された固定第１部分と、回転投与量設定ノブの上方に適合される第２の部分とからなり、第２の部分は、投与量を設定するとき投与量設定ノブと一緒に回転することができ、第２の部分は、第１の部分に対して回転することができ、第１の部分と第２の部分の間に、第３の部分が配置され、第３の部分は、投与量を設定するための第２の部分の手段と協働する手段を備える。
Patent JP-2003523625-A (JP)
Title: シリコン含有材料をエッチングするための自浄方法
IPC: H01L21/3065
Filed: 2001-02-14
Abstract: (57)【要約】
本発明は、処理チャンバ内に基板を配置するステップと、基板をフッ素含有ガス、塩素含有ガス、及び側壁不活性ガスを含む活性ガスに曝すステップを含む基板上のシリコン含有材料をエッチングする方法に関する。基板上のシリコン含有材料は、異なる組成を有する領域を備え、フッ素含有ガス、塩素含有ガス、及び側壁不活性ガスの体積流量率は、組成的に異なる領域を実質的に同じエッチング速度でエッチングするように選択されている。
Patent JP-2003523680-A (JP)
Title: 差動パルス符号変調システム
IPC: G10L19/00
Filed: 2001-02-16
Abstract: (57)【要約】
ＡＤＰＣＭ環境の予測器係数の適応が高速にかつ計算的に効率よく収束する、ディジタルオーディオ信号を処理する改善された技術が提供される。この技術（図２）は、極に基づく予測器（２１０）の予測係数を更新し又は、適応させるのに使用されるフィルタされた再構成された信号（２２０）を発生するために白色化フィルタ（２１８）を採用する。
Patent JP-2003527438-A (JP)
IPC: A61K38/095
Filed: 2001-03-16
Abstract: The present invention is related to a method for modulating the immune system of a mammal patient towards an allergen, which comprises the step of inducing a pre-sensitisation of the immune system of said patient towards an immunogen carrying at least one T cell epitope homologous and functionally similar to an epitope present on said allergen and deriving from a naturally-occurring antigen in order to modify the response of said patient to a further sensitisation to said allergen, allowing that the immune response towards the allergen is modulated and that no allergy towards said allergen will be developed in said patient.
Patent JP-2003530797-A (JP)
Title: 通信システムにおける情報の搬送
IPC: H04L12/56
Filed: 2001-04-10
Abstract: (57)【要約】
本発明は、通信システムのノード間で情報を搬送することに係る。情報は、第１の搬送エンティティにより第１ノードから第２ノードへそして第２の搬送エンティティにより第２ノードから送信される。第１搬送エンティティに対して許容搬送遅延が定義され、この許容搬送遅延に基づいて第１搬送エンティティが搬送クラスへと分配される。第１ノードから搬送されるべき搬送エンティティに対して、その搬送クラスの情報と、所与の時間に第２ノードから搬送されるべき搬送エンティティの情報とに基づいて指示子が指定される。その搬送が第２ノードにおいて受信された後に、そこに含まれた情報が、第２の搬送エンティティに挿入され、その選択は、指示子に基づいて行われる。
Patent JP-2003202987-A (JP)
Title: Installer for driver of network device
Inventor: SUGIURA TAKAYUKI
IPC: G06F9/445
Filed: 2002-01-07
Abstract: <P>PROBLEM TO BE SOLVED: To realize an installer file structure for automatically setting setting information in a device driver.  <P>SOLUTION: An installation execution file (200) includes a program (202) operable so as to install the driver (250) of a certain device connected to a network into an information processor connected to the network, and the area (210) of the setting information of the driver. The installation execution file is operable so as to execute a step for installing the driver and a step for writing the setting information in the installed driver.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003200489-A (JP)
Title: Method for treating end of interior finishing material for vehicle
Inventor: SHIMOMUKAI MASAYUKI
IPC: B60R13/02
Filed: 2002-01-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for treating an end of an interior finishing material for a vehicle in which the interior finishing material for the vehicle having a light weight and good appearance can be inexpensively provided by allowing a terminating treatment to be conducted in a short time without using an adhesive, a tacker or the like.  <P>SOLUTION: The method for treating the end of the interior finishing material for the vehicle comprises the steps of molding a folding thin part 10 at a part near an edge of a base layer 2 when a molding 9 for the interior finishing material laminated on a front surface of the base layer 2 of a skin material 1 made of a thermoplastic synthetic resin is integrally molded by using the mold, folding back the part 10 to a rear side while the skin material 1 remains laminated on the front surface after the molding is released from the mold, and fusion bonding to integrate the thin part 10 to a rear surface of the layer 2.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003204360-A (JP)
Title: Data readout device
Inventor: SHIODA YOSHIAKI
IPC: H04L12/70
Filed: 2002-01-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a data readout device for reading out data stored in a memory on a basis of a predetermined data width capable of reading out the data from the location coincident with an integer multiple of the data width, even when the start location of the stored data is not coincident with an integer multiple of the data width.  <P>SOLUTION: From a non-illustrated packet memory having a data width of four bytes, totally four byte data are input to a data converter 127 on a per byte basis, as a first to a fourth memory data 131-134. The input data are then supplied to a first to a fourth data shifter 141-144. These data shifters 141-144 select among the four types of input data each corresponding to each displacement of the top location of the data in the packet memory. The data shifters 141-144 determine whether the selected data are to be output as byte data 161-164, or to be latched until the next readout timing. Thus, the displacement of the top location can be corrected in the output byte data 161-164.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003200146-A (JP)
Title: Apparatus for discarding solid
Inventor: YAMADA SHINGO
IPC: F26B17/08
Filed: 2002-01-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a compact apparatus which reduces the volume of solid waste.  <P>SOLUTION: The apparatus for treating solid waste is composed of a crusher 2 for crushing the solid waste, a washer 3 for washing crushed waste produced by the crusher 2, a dryer for drying the washed waste t and p, a volume reduction apparatus for reducing the volume of crushed plastic refuse, and pipe conveyers for connecting the washer with the dryer, the dryer with the volume reduction apparatus, and the volume reduction apparatus with the washer.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003207759-A (JP)
Title: Wiring board, method for manufacturing the same, method for manufacturing electro-optical device, and electro- optical device
Inventor: TANAKA KAZUHIRO
IPC: G02F1/133
Filed: 2002-01-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring board preventing breakdown of elements and insulator films due to static electricity, the manufacturing method of the wiring board, the manufacturing method of an electro-optical device and an electro- optical device.  <P>SOLUTION: Each wiring board 300 has data lines 314, protective elements 20a, 20b each of which is connected to one end part of the data line 14 and has laminated films of a first conductive film, an insulator layer and a second conductive film and a first short circuit wiring 16 each of which is electrically connected to the first conductive film and a second short circuit wiring 17 each of which is electrically connected to the second conductive film 15.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003205815-A (JP)
Title: Mounting structure of side air bag
Inventor: KUSHIYAMA TOMOYA
IPC: B60R21/207
Filed: 2002-01-16
Abstract: <P>PROBLEM TO BE SOLVED: To prevent wrinkles from occurring to a back trim part.  <P>SOLUTION: A mounting part C is provided with a seat back frame 2 having a protrusion strip fixing hole 2d and a fastening part 2c, and a side air bag 10 is provided with a protrusion piece 14 inserted in the protrusion piece fixing hole 2d and a fixing part 13 fixed at the fastening part 2c. The protrusion piece 14 is inserted in the protrusion piece fixing hole 2d through two protrusion piece fixing holes (25) formed in the corresponding portion of each of the back trim and a module cover 20, and fixed in a positioning state and the fixing part 13 is fixed at the fastening part 2c by means of a bolt 15 inserted through two through-holes (23) formed in the corresponding portion of the fastening part 2c of each of the back trim and the module cover 20.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003213414-A (JP)
Title: Method and apparatus for film deposition, and method for manufacturing color filter
Inventor: NAMETAKE TORU
IPC: G02F1/1335
Filed: 2002-01-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for film deposition by which the stop of the apparatus over a long period of time and deterioration in an operating ratio are prevented by detecting the bad mounting of a substrate, etc., on a transport carrier in advance when forming a film on the substrate, and to provide a method for manufacturing a color filter using the method and the apparatus.  <P>SOLUTION: In the method for film deposition comprising (a) a workpiece mounting process for mounting a workpiece 20 consisting of the substrate, a mask, and a mask holder to hold the substrate on a carrier plate 7, (b) a workpiece holding process for relatively approaching a plate support frame 9 and the carrier plate 7 to each other at the mounting side of the workpiece 20 of the carrier plate 7 to hold the workpiece 20, and (c) a film deposition process for carrying the workpiece 20 in a film forming chamber and depositing a predetermined material on the surface of the substrate, (d) a retroreflection sheet 15 stuck to the mask holder is irradiated with the light of a laser sensor 17 before the workpiece holding process, thereby the existence/non-existence of reflected light from the retroreflection sheet 15 is detected.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003211232-A (JP)
Title: Hydraulic forming device and its method of structural part
Inventor: NAKAGAWA NARIYUKI
IPC: B21D26/021
Filed: 2002-01-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hydraulic forming device which prevents generation of wrinkle within a bent part, at a time of hydraulic forming of the hollow shaped structural parts with a curved shape.  <P>SOLUTION: Overlapping plates 8 are pressurized and are restrained by an upper and a lower die 11 and 12. The overlapping plate materials 8 are expanded and deformed by feeding a liquid state forming medium between an upper and a lower plates 2 and 3 from filling hole parts which are formed in one end of the overlapping plate materials 8 which are formed as predetermined shape of structural parts. In that case portions to become bent parts 6 among the overlapping materials 8 are pressed in the plate width reduction direction via penetrators 14 from both sides by a deformation enforcing means 13. In an initial forming stage expanded parts 15 are formed by expanding and deforming portions corresponding to the bent parts 6 prior to non-bent parts 9.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003211049-A (JP)
Title: Liquid coater
Inventor: HIRATA MITSURU
IPC: B05C5/02
Filed: 2002-01-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid coater capable of providing a coating film of uniform film thickness with less dispersion (coating irregularities) of the film thickness to the end part of the coating film.  <P>SOLUTION: In a coating head 20 provided with a slot 27 for making a liquid flow out in fixed thickness, both wall surfaces facing each other of the tip opening part 28 of the slot 27 are formed as slopes 21c and 22c inclined mutually in the opposite directions, the slopes 21c and 22c are made of a hydrophilic surface material and the lower end face of the coating head 20 continued on the outer side of the slopes 21c and 22c is made of a water repellent surface material. On either one or both of the wall surfaces facing each other of the tip opening part 28 of the slot 27, a linear scar in the width direction of the coating head 20 is formed. The slopes 21c and 22c can be constituted of convex or concave curved surfaces, respectively.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003218283-A (JP)
Title: Semiconductor device and method for manufacturing the same
Inventor: SUGIYAMA TAKUYA
IPC: H01L25/18
Filed: 2002-01-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a protruding electrode whose full height can be reduced, and whose productivity and reliability can be improved, and to provide a method for manufacturing the semiconductor device.  <P>SOLUTION: A pad 2 for connection is formed on a board 10 on the same surface as a projecting sealing member 6 resin-sealing a semiconductor chip 4. Films 8a and 8b melting at not more than the melting point of a protruding electrode 9 are laminated on the board 10 to cover the sealing member 6. Openings corresponding to the pad 2 for connection formed in the films 8a and 8b are filled with solder paste 11. The solder paste 11 is hardened by heating so that the protruding electrode 9 in contact with the pad 2 for connection can be formed, and the films 8a and 8b are melted so that the clearance of a semiconductor device 20 can be filled.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003219539-A (JP)
Title: Cover-attaching structure of waterproof box
Inventor: SATO HIDETOSHI
IPC: H02G3/10
Filed: 2002-01-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cover attaching structure of a waterproof box capable of completely ensuring waterproofing.  <P>SOLUTION: This cover attaching structure of the waterproof box attaches a cover 3 onto a container body 2 by inserting the inner and outer recessed sections 28, 27, respectively into a double-wall opening of which the inner wall 21 of the container body 2 protrudes from an outer wall 20. A guide section 33, for guiding a wall section 30, or an inner wall section 30 forming the outer recessed section 27, in between the outer wall 20 inserted into an outer recessed section 27 formed by the wall section 30 and the inner wall 21, is provided on the wall section 30 facing the wall section 30 brought into contact with an outer surface protruding from the outer wall 20 of the inner wall 21.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003218753-A (JP)
Title: Method of suppressing leakage electromagnetic field and method and device for suppressed leakage electromagnetic field communication
Inventor: KAKO TAKASHI
IPC: H04L25/02
Filed: 2002-01-24
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the occurrence of a large leakage field wave caused by a large current from a reflection wave at a branch point of power line or interference between codes in a method and device for suppressed leakage electromagnetic field communication in power-line carrier communication.  <P>SOLUTION: An impulse for indicating a signal point corresponding to a transmission signal SD is generated with at a distance of an impulse responding width of a power line by a signal point generating unit 3-1 to prevent an interference between a reflective wave and a code. The transmission signal is subjected to orthogonal-frequency division multiplexing by a reverse fast Fourier transform unit 6-1, and a guard interval is added by a guard time adding unit 6-2. After a zero point is inserted between signals by a zero point inserting unit 3-2, the transmission signal is passed through a low-off filter ROF1 and a modulating unit MOD, a reflective wave is reduced by a multi-pass equalizing unit 5-1 and passed through a D/A conversion unit and a low-pass filter LPF, and the transmission signal is carried into a communication line TX-line of the power line. The multi-pass equalizing unit 5-1 is composed of a filter that becomes an inverse function against a transfer function of the power line generating the reflective wave at the branch point for reducing the reflective wave.  <P>COPYRIGHT: (C)2003,JPO