baber/WOPTO huggingface dataset:
Patent TW-200818298-A (TW)
Title: Manufacture of semiconductor device with CMP
Inventor: IDANI NAOKI
IPC: H01L21/304
Filed: 2005-10-21
Abstract: A manufacture method for a semiconductor device, includes the steps of: in CMP for forming STI, (a) polishing the surface of a film formed on a semiconductor substrate until the surface of the film is planarized, by using first abrasive containing cerium dioxide abrasive grains and additive of interfacial active agent; (b) after the step (a), polishing the surface of the film is polished by using second abrasive having a physical polishing function; and (c) after the step (b), polishing the surface of the film by using third abrasive containing cerium dioxide abrasive grains, additive of interfacial active agent, and diluent. The manufacture method further includes the steps of: (p) forming wirings above the semiconductor substrate; (q) depositing a first insulating film by HDP CVD, the first insulating film burying the wirings; (r) depositing a second insulating film above the first insulating film by a deposition method different from HDP-CVD; and (s) planarizing the second insulating film by chemical mechanical polishing using abrasive containing cerium dioxide abrasive grains. It is possible to solve an issue of a left film after polishing newly found from a large size substrate and to suppress a distribution of thicknesses of an interlayer insulating film at a wafer level.
Patent TW-200819482-A (TW)
Title: Heat-shrinable polyester-based film, and production method thereof, packaged body
Inventor: HARUTA MASAYUKI
IPC: B29C55/02
Filed: 2007-08-29
Abstract: The present invention provides a heat-shrinkable polyester-based film having excellent properties of dotted hole-containing easy-to-open performance and high productivity. The said polyester-based film is composed of a polyester-based resin comprises an ethylene terephthalate as a major constitutional component, and no less than 15 mol% of at least one monomer component to be an amorphous component in the overall polyester resin component, and exhibits specific heat-shrinkable performance and physical properties after heat-shrinkable treatment.
Patent TW-200831558-A (TW)
Title: Polycarbonate having plant-derived component and method for producing the same
Inventor: KITAZONO EIICHI
IPC: C08G64/02
Filed: 2007-08-29
Abstract: Disclosed is a polycarbonate having a plant-derived component, which is improved in hue. Also disclosed is a method for producing such a polycarbonate. Such a polycarbonate can be obtained by reducing inorganic impurities in a polymer raw material and thereby reducing inorganic impurities in the polymer product accordingly.
Patent TW-200819872-A (TW)
Title: Liquid crystal alignment agent and liquid crystal display element
Inventor: YASUDA HIROYUKI
IPC: G02F1/13363
Filed: 2007-09-10
Abstract: The present invention provides a liquid crystal alignment agent to form a liquid crystal alignment film which is difficult to be scratched by rubbing. The liquid crystal alignment agent comprises an aromatic amine compound as shown in following formula (1), (Wherein, A is a aromatic group having three valence bonds, R1-R6 are aromatic groups and R1-R6 are the same or different each other.)
Patent TW-200828608-A (TW)
Title: Improved interconnect for thin film photovoltaic modules
Inventor: BORDEN PETER G
IPC: H01L31/05
Filed: 2007-09-28
Abstract: The present invention relates to configuring and wiring together cells in TF PV modules. According to one aspect, cells within the module are adjusted in size to compensate for known process non-uniformity. According to another aspect, the module is divided into a number of smaller series-connected sub-modules that are then wired in parallel. According to another aspect, the module and/or sub-module may have a non-rectangular shape. According to another aspect, lithography and etch processes are preferably used to form interconnects. In another embodiment, contact pads are formed using photolithographic processes, which may be used to mount protect diodes to minimize the risk of damage due to shading or non-uniformity.
Patent TW-200916759-A (TW)
Title: Positioning method and apparatus for inspection equipment
Inventor: JENG DING-SHAN
IPC: G01N21/84
Filed: 2007-10-05
Abstract: The invention relates to a positioning method and apparatus, especially applicable for inspection equipment. It is to select a plurality of positioning objects from the object to be inspected and use a scale platform to get at least an estimated positioning value of coordinate of the first positioning object on the inspected object by eye measurement method. Once the estimated coordinate is inputted, an optical module is quickly driven to roughly reach the position of the coordinate, then sequentially capture image of each positioning object. The images are analyzed so as to be compensated and matched with a plurality of reference objects corresponding to each positioning object. By this way, not only the positioning time for the inspected objects can be shortened, but also the inspection efficiency is enhanced.
Patent TW-200917431-A (TW)
Title: Stacked-type chip package structure and method of fabricating the same
Inventor: SHEN CHI-CHIH
IPC: H01L25/04
Filed: 2007-10-05
Abstract: A stacked-type chip package structure including a first package structure, a second package structure, and a first molding compound is provided. The first package structure includes a first substrate, and a first chip stacked on and electrically connected to the first substrate. The second package structure is stacked on the first package structure, and includes a second substrate, a second chip, and a plurality of solder blocks. The second chip is electrically connected to the second substrate, and the second substrate is electrically connected to the first substrate. The second chip is fixed on the first chip through an adhesive layer. The solder blocks are disposed on the back of the second substrate. The first molding compound is disposed on the first substrate and encapsulates the first package structure and the second package structure. The first molding compound has a recess for exposing the solder blocks.
Patent TW-200917911-A (TW)
Title: Printed circuit board and fabrication method thereof
Inventor: SHIH CHAO-WEN
IPC: H05K3/46
Filed: 2007-10-09
Abstract: A printed circuit board is disclosed, including a core board having a core circuit layer formed on at least one surface thereof, the core circuit layer having a plurality of contact pads formed thereon; a first dielectric layer disposed on the core board and formed with a plurality of first dielectric layer blind vias for exposing those contact pads; a first coupling layer and a plurality of first coupling layer blind vias disposed on the first dielectric layer and the first dielectric layer blind vias; and a first circuit layer and a plurality of first conductive blind vias disposed on the first coupling layer and the first coupling layer blind vias respectivley for electrically connecting those contact pads, thereby providing better bonding between the first circuit layer and the first dielectric layer by connecting the first coupling layer with the first circuit layer and first dielectric layer to prevent detachment and delamination as encountered in the prior art. The invention further provides a method of fabricating the PCB described above.
Patent TW-200918732-A (TW)
Title: Micro emission exhaust gas processing device
Inventor: Zhang yu-guang
IPC: B01D53/92
Filed: 2007-10-22
Abstract: The present invention discloses a micro emission waste gas processing device. The device includes a container with an input port. In the container, at least two exchanging sections are arranged next to the input port in sequence, and an air chamber is arranged therebetween at a location where the two exchanging sections communicates with each other. The exchanging air chamber of the first stage exchanging section is provided with a through hole communicated with the atmosphere. By using such a structure, when the waste gas enters the exchanging section and then is jetted inwardly, extremely strong whirling and sucking effect is generated for evacuating the air chamber and pumping oxygen from the through hole. Such high pressure gas facilitates fierce combustion of combustible gas in the next air chamber. When the rest of waste gas entered is pumped into the next stage exchanging section, the waste gas is spinned at high speed, and momentum transferring is resulted. As negative pressure is higher, more gas is engulfed, thereby achieving few emission effect and even non emission effect.
Patent TW-200919562-A (TW)
Title: Removing residues from substrate processing components
Inventor: WEST BRIAN T
IPC: H01L21/306
Filed: 2007-10-22
Abstract: Residues are removed from a surface of a substrate processing component which has a polymer coating below the residues. In one version, the component surfaces are contacted with an organic solvent to remove the residues without damaging or removing the polymer coating. The residues can be process residues or adhesive residues. The cleaning process can be conducted as part of a refurbishment process. In another version, the residues are ablated by scanning a laser across the component surface. In yet another version, the residues are vaporized by scanning a plasma cutter across the surface of the component.
Patent TW-200923784-A (TW)
Title: Electronic device and method for resuming from suspend-to-ram state thereof
Inventor: KAO TING-KUO
IPC: G06F9/46
Filed: 2007-11-16
Abstract: An electronic device and a method for resuming from a suspend-to-ram (S3) state thereof are provided. The electronic device comprises a detecting circuit, a storage unit and a booting module. The detecting circuit outputs a state change value when detecting a state variation of any non-hot plug device. The storage unit is used for storing the state change value outputted by the detecting circuit. When the electronic device is resuming from the S3 state to the working state, a normal booting procedure is performed on the electronic device if the state change value is detected by the booting module.
Patent TW-200840725-A (TW)
Title: Printed matter and fabrication method thereof
Inventor: CHEN CHIEN-CHAO
IPC: B41M5/50
Filed: 2007-11-27
Abstract: A printed matter including a substrate and a printed pattern layer disposed on the substrate. The printed pattern layer includes printing ink and a plurality of photocatalytic powders. The printing ink is disposed on the substrate. The photocatalytic powders are dispersed in the printing ink. A fabrication method of a printed matter including following steps is also provided. First, a substrate is provided. Next, a printed pattern layer is printed on the substrate. The printed pattern layer has printing ink disposed on the substrate and a plurality of photocatalytic powders dispersed in the printing ink. As irradiated by ambient light, the photocataiytic powders of the printed matter may eliminate filth and bacteria. The fabrication method of a printed matter does not increase the cost of fabrication equipments.
Patent TW-200925954-A (TW)
Title: Hybrid touch panel and method making thereof
Inventor: YEH YU-CHOU
IPC: G06F3/041
Filed: 2007-12-12
Abstract: The present invention provides a hybrid touch panel, which comprises a first conductive module, a second conductive module, and a spacer layer. The first conductive module has a first conductive layer having at least a first resistive touching area, and at least a capacitive touching area. The second conductive module has a second conductive layer having at least a second resistive touching area corresponding to corresponding to the first resistive touching area respectively. The spacer layer coupled to the first resistive touching area and the second resistive touching area has spacer dots disposed therebetween. The present invention further provides a method for making the hybrid touch panel, wherein the first resistive touching area and the capacitive touching area are formed on the first conductive layer simultaneously so as to integrate the resistive control and capacitive control on the same touch panel for increasing the diversity of the touching control.
Patent TW-200841433-A (TW)
Title: Physical alignment features on integrated circuit devices for accurate die-in-substrate embedding
Inventor: LAM KEN M
IPC: H01L23/31
Filed: 2007-12-14
Abstract: A method of packaging an integrated circuit die including forming a mask window having a first aperture with a first set of alignment edges and forming an alignment feature on an uppermost surface of the integrated circuit die where the alignment feature has a second set of alignment edges. The alignment feature is inserted into the first aperture. The integrated circuit die is mechanically biased until the first and second set of alignment edges are in physical contact with one another and the alignment feature is secured into the mask window, thus forming an integrated circuit die assembly.
Patent TW-200849259-A (TW)
Title: NAND flash memory cell array and method with adaptive memory state partitioning
Inventor: MOOGAT FAROOKH
IPC: G11C16/06
Filed: 2007-12-20
Abstract: A NAND type flash memory is organized into NAND strings with each being a chain of memory cells in series and connected via select transistors on both ends of the string to either a bit line or a source line. The memory cells adjacent both ends of a NAND string are particularly susceptible to errors due to program disturb. An adaptive memory-state partitioning scheme is employed to overcome the errors, in which each memory cells are generally partitioned to store multiple bits of data, except for the ones adjacent both ends where relatively less bits are stored. In this way, the storage of relatively less bits in the memory cells adjacent both ends of a NAND string affords sufficient margin to overcome the errors. For example, in a memory designed to store 2-bit data, the cells adjacent both ends of a NAND string would each be configured to store one bit of the 2-bit data.
Patent TW-200929398-A (TW)
Title: Method for repairing bumps of a flip chip package
Inventor: LIAO GUO-CHENG
IPC: H01L21/60
Filed: 2007-12-21
Abstract: A method for repairing bumps of a flip package includes the following steps of: providing a electrically-failed flip package including a chip, a substrate and a plurality of bumps, wherein the bumps are adapted to electrically connect the chip to the substrate, and each bump includes an inter-metallic compound adjacent to the substrate; and re-working the flip package by using a temperature rise/drop process with trapezoid profile, wherein the temperature rise/drop process includes the steps of heating the chip from a first temperature to a second temperature at the rate of temperature rise, keeping the second temperature to a predetermined time, and cooling the chip from the second temperature to a third temperature at the rate of temperature drop.
Patent TW-200929181-A (TW)
Title: Dock for moveable storage device
Inventor: YANG JING
IPC: G11B33/04
Filed: 2007-12-26
Abstract: A dock, mounted in a computer, is configured to receive a moveable storage device and electrically connect the moveable storage device and the computer. Means is set in the dock to achieve that when the moveable storage device is pushed into the dock, it can be inserted in the dock, and then, when the moveable storage device is pressed, the moveable storage device can be sprung out from the dock to be taken away. The moveable storage device is convenient to be pushed into, received in and taken from the present invention of dock.
Patent TW-200901086-A (TW)
Title: Image interpolation apparatus and method as well as image reading apparatus
Inventor: YAMANAKA SATOSHI
IPC: G06T1/00
Filed: 2008-02-15
Abstract: This invention provides an image interpolation apparatus and method as well as an image reading appratus. The image interpolation apparatus of the present invention comprises a data storage section (2) which stores the data neighboring a missing pixel, a filter interpolation section (3) which performs a product summary operation with respect to the data output by the data storage section, a limit processing section (4) which restricts the data output by the filter interpolation section within the range of the data storage section, and an interpolation data inserting section which interpolates the data output by the limit processing section to the position corresponding to the missing pixcel of the data output by the data storage section. An interpolation precision of the missing pixcel, especially the interpolation precision in the case of interpolating the data read from the manuscript containing the periodic data, can be increased.
Patent TW-200939574-A (TW)
Title: Electrical adapter
Inventor: TSAI TZU-CHING
IPC: H01R11/00
Filed: 2008-03-03
Abstract: An electrical adapter includes a first electrical connector, a second electrical connector and a connecting module for joining the two electrical connectors. The first and second electrical connector defines an insulative housing, a number of contacts and a shell, respectively. The shell of the first electrical connector surrounds a mating frame, one side of the mating frame is struck out folding sheets extending from front end to rear end. The insulative housing of the second electrical connector has an engage portion. The connecting module connects the jointing portion of contacts. The electrical adapter would electrical connect with the said connectors having different interface.
Patent TW-200900747-A (TW)
Title: Optical sheet combination structure, surface emitting device, and liquid crystal device
Inventor: MIZUNO HIROSHI
IPC: G02B5/04
Filed: 2008-03-10
Abstract: An optical sheet combination structure disposed between a polarizer and a surface emitting unit, includes a first optical sheet having a number of columnar cubic structures of curing resin arrayed on a transparent base, a valley portion between adjacent cubic structures contacting a surface of the transparent base, and a second optical sheet disposed nearer to the side of the polarizer than the first optical sheet, having a number of columnar cubit structures arrayed on a surface, and a refractive index of the cubic structures along an extension direction thereof being different from a refractive index of the cubic structures along an array direction thereof.
Patent TW-200940936-A (TW)
Title: Manufacturing method for flattening the heating section of heat dissipation device having heat pipe, and product thereof
Inventor: LIN GUO-REN
IPC: F28D15/02
Filed: 2008-03-19
Abstract: The present invention provides a manufacturing method for flattening the heating section of a heat dissipation device having heat pipe and a product thereof, at least one heat pipe and a base for thermally conducting with the heat pipe are provided, and trenches are installed on the bottom surface of the base for embedding the heat pipes; a portion of each heat pipes, which is defined as a heating section, is disposed in the trenches of the base; and an extruding operation is processed on the heating sections of the heat pipes, so that the heating sections of the heat pipes are pressed into the trenches, and an non-flat heating surface protruding out of the bottom surface the base is formed on each of the heating sections of the heat pipes; lastly, the non-flat heating surfaces are flattened with a polishing means.
Patent TW-200943327-A (TW)
Title: Thin film resistor structure and fabrication method thereof
Inventor: CHEN YU-CHUNG
IPC: H01C7/00
Filed: 2008-04-10
Abstract: A thin film resistor structure is disclosed. The structure comprises a resistor layer comprising a copper oxide layer and a plurality of metal islands thereon. The surface of the copper oxide layer has a plurality of nodule-shaped recess regions adjacent to each other, in which vacancies are formed between the nodule-shaped recess regions and arranged in reticulate distribution. The plurality of metal islands is respectively disposed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed. The thin film resistor structure can effectively improve the sheet resistance while maintaining a lower temperature coefficient of resistance (TCR).
Patent TW-200945067-A (TW)
Title: System for searching a static data transformed from a dynamic data and a method thereof
Inventor: CHIU CHAU-CER
IPC: G06F17/30
Filed: 2008-04-17
Abstract: A system for searching a static data transformed from a dynamic data and a method thereof are provided. By storing a target file from a target data, searching a representative string which is corresponding to a received query string, and finding the target file which is corresponding to the representative string out, the system and the method can therefore solve the problem that searching the non-dynamic data in a database occupies the time used to search the dynamic data in the prior art, and further achieve the effect of reducing the search loading of the database.
Patent TW-200952155-A (TW)
Title: Capacitor over bit line structure and manufacturing method for the same
Inventor: CHANG CHOU-CHIN
IPC: H01L27/108
Filed: 2008-06-03
Abstract: A method for manufacturing capacitor over bit line (COB) is disclosed. The method is forming a protecting layer on the sidewall of a storage node window to cover and protect the sidewall of the storage node window prior to barrier metal layer deposition. The method prevents capacitor from bridge and forming leakage.
Patent TW-200915769-A (TW)
Title: System and method for scheduling and transferring data through a transmission system
Inventor: PEKONEN HARRI J
IPC: H04L27/26
Filed: 2008-06-04
Abstract: A system and method for dynamically dividing the capacity of a fixed time division multiplexing (TDM) frame between physical channels for data transmission. According to various embodiments, a time frequency frame is divided into a plurality of subframes, and each of the plurality of subframes are divided into a plurality of corresponding slots. The plurality of slots are then selectively time shifted such that a defined time shift exists between corresponding slots in each subframe within the time frequency frame. For any slots or slot portions which have been selectively shifted beyond the end of the time frequency frame, such slots or slot portions are cyclically shifted to the beginning of the frame. Service data is then written into the slots of the time frequency frame, and the frame containing the service data can then be transmitted. Initialization and service access processes for a receiver are also provided.
Patent TW-201001228-A (TW)
Title: Inputting apparatus
Inventor: YAO JUNG-YING
IPC: G06F3/01
Filed: 2008-06-18
Abstract: The invention provides an inputting apparatus. The inputting apparatus comprises a sensing module, a receiving module, and a displaying module. The receiving module is used for receiving an external signal according to a real time protocol. When a force applied on the sensing module, the sensing module generates a sensing signal. The displaying module receives the sensing signal and the external signal and selectively displays the external signal.
Patent TW-200929538-A (TW)
Title: Semiconductor device and method for manufacturing the same
Inventor: YOON YEO-CHO
IPC: H01L29/68
Filed: 2008-06-27
Abstract: A semiconductor device and a method for manufacturing the same are provided. An n-well region can be formed on a semiconductor substrate, and a base contact region can be formed on the n-well region. An emitter contact region, a collector contact region, and a p-base region can also be formed on the n-well. The emitter and collector contact regions can include n-type ions, and the base contact region and the p-base region can include p-type ions. Thus, the semiconductor device can include an n-channel metal oxide semiconductor transistor and an NPN bipolar transistor.