baber/WOPTO huggingface dataset:
Patent JP-2020170305-A (JP)
Title: Coin processor, automated transaction device, and coin processing method
Inventor: Iwao yuta
IPC: G07D1/00
Filed: 2019-04-02
Abstract: To improve operational efficiency.SOLUTION: An automatic teller machine 1 includes: a response unit 3 that accepts user operations; a cylinder storage unit 56 having a plurality of tubular coin accumulation space SPCs capable of stacking and accumulating coins; a stage 67 having a coin accumulation surface 67pS that is movable in the coin accumulation space SPC and allows the coins to be accumulated; abnormality detection sensor 90 that detects abnormality in the coin accumulation space SPC; and a coin control unit 12 that determines whether or not abnormality has occurred in the coin accumulation space SPC based on the detection result of the abnormality detection sensor 90. The coin control unit 12 performs control so as to accumulate or deliver the coins only using other coin accumulation space SPCs different from some coin accumulation space SPCs when it is determined that abnormality has occurred in some of the coin accumulation space SPCs among the plurality of coin accumulation space SPCs, based on the detection result of the abnormality detection sensor 90.SELECTED DRAWING: Figure 10
Patent JP-2020169514-A (JP)
Title: Joint structure
Inventor: SHIDA TSUBASA
IPC: E04G21/12
Filed: 2019-04-04
Abstract: To provide a joint structure capable of reliably transmitting force between an existing skeleton and a new skeleton.SOLUTION: A joint structure 50 is a joint structure for joining a first existing wall 11 and a new pile 20 formed separately from the first existing wall 11, comprising a concrete body 60 provided between the first existing wall 11 and the new pile 20 and a first connecting member 70 inserted through the concrete body 60 and for connecting the first existing wall 11 and the new pile 20.SELECTED DRAWING: Figure 3
Patent JP-2019107550-A (JP)
Title: Game machine
Inventor: ICHIHARA TAKAAKI
IPC: A63F7/02
Filed: 2019-04-10
Abstract: To provide a game machine capable of maintaining game amusement.SOLUTION: A Pachinko machine 1 includes start pockets capable of receiving a game ball driven onto a game area 5a. When a game ball enters a start pocket, determination processing for winning is performed. Then, variation display corresponding to the determination processing result is started, and a winning game is played when a winning pattern is displayed in the variation display. In this regard, in the Pachinko machine 1, a performance relating to operation is executed before occurrence of a performance reception period when operation to an operation button is received.SELECTED DRAWING: Figure 60
Patent JP-2020174140-A (JP)
Title: Semiconductor integrated optical device and method of fabricating semiconductor integrated optical device
Inventor: Hiratani Takuo
IPC: H01S5/026
Filed: 2019-04-11
Abstract: To provide a semiconductor integrated optical device having a structure capable of reducing additional optical loss.SOLUTION: A semiconductor integrated optical device includes: a waveguide mesa 15 having a first multilayer including the first core layer 21a of a first element, a second multilayer including second core layer 23a of a second element and a butt-joint interface BJ between the first core layer and the second core layer; a support 13 having a first region 13a, a second region 13b, and a third region 13c; and a buried semiconductor region provided on the support. The first multilayer extends from the butt-joint interface to the first region, and the second multilayer extends from the butt-joint interface to the second region. On the third region, the second multilayer has a portion having a third mesa width smaller than a first mesa width of the first region and a second mesa width of the second region, and a side surface of the portion is buried in the buried semiconductor region. The second core layer has a waveguide core thickness on the second region. The second core layer has a core portion on a third region, and the core portion has a thickness different from the waveguide core thickness at a position away from the butt-joint interface.SELECTED DRAWING: Figure 1
Patent JP-2020013546-A (JP)
Title: Short channel effect based random bit generator
Inventor: JO SEISHO
IPC: G09C1/00
Filed: 2019-04-11
Abstract: To provide a random bit generator or the like on the basis of a short channel effect.SOLUTION: A random bit generator includes a voltage source, a bit data cell, and a sensing control circuit. The voltage source provides a scan voltage during enroll operation. The data cell includes a first transistor and a second transistor. The first transistor has a first terminal coupled to a first bit line, a second terminal coupled to the voltage source, and a control terminal. The second transistor has the first terminal coupled to a second bit line, the second terminal coupled to the voltage source, and the control terminal. The sensing control circuit is coupled to the first bit line and the second bit line and outputs random bit data according to currents generated through the first transistor and the second transistor during the enroll operation of the bit data cell.SELECTED DRAWING: Figure 1
Patent JP-2020172817-A (JP)
Title: Position adjustment device, and position adjustment method of underground piled column
Inventor: FUJIO NAOTO
IPC: E02D29/05
Filed: 2019-04-12
Abstract: To provide a position adjustment device adjusting a building-in position of an underground piled column and a position adjustment method of the underground piled column capable of being used in enlarging a cross section of the underground piled column while utilizing an underground hole having an existing cross section diameter.SOLUTION: A position adjustment device adjusts a building-in position of an underground piled column having a rectangular cross section which is inserted into an underground hole. The position adjustment device comprises: a pressing device positioned between the underground piled column and a hole wall of the underground hole and pressing the hole wall; a pressing device support member supporting the pressing device; and a reactive force receiving member whose front face side is in contact with the pressing device and whose rear face side is in contact with the underground piled column. The pressing device is disposed at a projected corner of the underground piled column, and the pressing device support member is installed in the underground piled column.SELECTED DRAWING: Figure 4
Patent JP-2020175757-A (JP)
Title: Engine sound device
Inventor: TORII KENJI
IPC: B60R11/02
Filed: 2019-04-18
Abstract: To provide an engine sound device which can propagate desired vibration of an internal combustion engine to a vehicle cabin with a simple structure.SOLUTION: An engine sound device 6 of the invention includes: an internal combustion engine 4 installed at a power source room 2 of a vehicle 1; a panel-like member 5 forming a part of a vehicle cabin 3; and a linear member 7 in which one end side is attached to the internal combustion engine 4 and the other end side is attached to the panel-like member 5.SELECTED DRAWING: Figure 2
Patent JP-2020178038-A (JP)
Title: Semiconductor device stem and semiconductor device
Inventor: KIMURA YASUYUKI
IPC: H01S5/022
Filed: 2019-04-18
Abstract: To provide a semiconductor device stem and a semiconductor device that can improve the frequency of a signal that can be transmitted well.SOLUTION: A semiconductor device stem includes a main body with a dent on the top surface, a heat radiating portion erected on the upper surface of the main body, and a wiring board provided in a recess, and the wiring board includes a substrate having a first main surface and a second main surface opposite to the first main surface, a first conductor pattern provided on the first main surface and having a mounting portion on which a semiconductor element is mounted, and a second conductor pattern provided on the second main surface and joined to the inner wall surface of the recess and the heat radiating portion, and when viewed from the thickness direction of the wiring board, a part of the first conductor pattern protrudes from the heat radiating portion.SELECTED DRAWING: Figure 1
Patent JP-2020180168-A (JP)
Title: Emulsion type anionic electrodeposition coating, and method for producing the same
Inventor: ODA KATSUYUKI
IPC: C09D5/02
Filed: 2019-04-23
Abstract: To provide an emulsion type anionic electrodeposition coating which is less likely to cause fumes during a curing step and can form a cured coating film excellent in hardness, adhesion to a base material, water resistance, durability and the like by curing.SOLUTION: There is provided an emulsion type anionic electrodeposition coating containing an acrylic emulsion obtained by polymerizing a monomer component (b) containing an acrylic monomer (b1) having an amide group and not containing an acrylic monomer having a carboxy group in an aqueous medium in the presence of an acrylic polymer (A) obtained by polymerizing a monomer component (a) essentially containing an acrylic monomer (a1) having a carboxy group. A mass ratio of the monomer component (a) which was subjected to polymerization of the polymer (A) and the monomer component (b) is (a):(b)=10-60:90-40. The emulsion type anionic electrodeposition coating contains 0 to 20 pts. mass of a curing agent (C) based on total 100 pts.mass of the monomer component (a) and the monomer component (b).SELECTED DRAWING: None
Patent JP-2020181269-A (JP)
Title: Information processing system
Inventor: NAKAYAMA YUJI
IPC: G06F13/14
Filed: 2019-04-23
Abstract: To make data communication between processing devices efficient in an information processing system implementing a distributed computer.SOLUTION: The information processing system disclosed in this application includes: a plurality of information processing devices each of which comprises a processor, and which include a main information processing device and a plurality of sub-information processing devices; and a relay device which relays communication between the plurality of information processing devices connected via a plurality of connectors arranged at buses. At least one of the plurality of sub-information processing devices includes: a storage which stores connection information indicating in units of the connectors whether to assign the main information processing device or each of the other sub-information processing devices to a communication object; and a communication controller which communicates with at least either one of the plurality of information processing devices on the basis of the connection information.SELECTED DRAWING: Figure 5
Patent JP-2020127349-A (JP)
Title: Testing apparatus and method for wireless charging module of vehicle
Inventor: ZHUANG SHENG-JING
IPC: H02J7/00
Filed: 2019-04-24
Abstract: To provide an inspection apparatus and method for a wireless charging module for a vehicle in which a charging module alignment device calibrates the positions of a power transmission plate and a power reception plate such that the plates are perfectly aligned, and then performs the inspection, and during the inspection, the position shift amount of the power transmission plate and the power reception plate is adjusted by a multi-axis stage, and the power transfer efficiency for each position shift amount is calculated, and therefore, the measurement position can be calibrated with high accuracy, a highly accurate inspection result is obtained, semi-automatic inspection or fully automatic inspection is provided, the time and labor are saved, and the inspection efficiency can be greatly improved.SELECTED DRAWING: Figure 1
Patent JP-2020182138-A (JP)
Title: High frequency circuit and communication device
Inventor: DEGUCHI KAZUSUKE
IPC: H04B1/00
Filed: 2019-04-26
Abstract: To provide a small high frequency circuit capable of high-precision impedance matching for each of two types of high-frequency signals whose frequency bands are close to each other or overlap.SOLUTION: A high frequency circuit 1 includes a transmission terminal 110 and a transmission/reception terminal 141, a power amplifier 11 that amplifies a high-frequency signal input from the transmission terminal 110 and outputs the signal to the transmission/reception terminal 141, and an output matching circuit arranged in a signal path connecting the power amplifier 11 and the transmission/reception terminal 141 to optimize the output load impedance of the power amplifier 11, and the output matching circuit includes a matching circuit 21 connected to the output terminal of the power amplifier 11, a matching circuit 22, and a switch 13 that switches the connection between the matching circuit 21 and 22, and the power amplifier 11 and the switch 13 are formed in one semiconductor IC 10, and the matching circuits 21 and 22 are formed outside the semiconductor IC 10.SELECTED DRAWING: Figure 1
Patent JP-2019196481-A (JP)
Title: Decorative adhesive sheet for door
Inventor: SEKI MASASHI
IPC: B32B27/00
Filed: 2019-05-07
Abstract: To provide a decorative adhesive sheet for door having reworkability.SOLUTION: A decorative adhesive sheet 1 for door has a decorative layer 10 and an adhesive layer 13 laminated on the rear face side of the decorative layer 10, in which the adhesive layer 13 has a plurality of recessed shapes 13a on both surfaces thereof. The adhesive layer 13 is obtained by curing a liquid resin composition containing air bubbles, and the plurality of recessed shapes 13a based on the air bubbles are formed on both surfaces thereof. The recessed shapes 13a act like a sucker, re-sticking is easily performed, and accordingly reworkability is good.SELECTED DRAWING: Figure 1
Patent JP-2019167624-A (JP)
Title: Multipurpose heat treatable aluminum alloy, related method and use
Inventor: GUPTA ALOK KUMAR
IPC: C22F1/047
Filed: 2019-05-07
Abstract: To provide a method for manufacturing a metal component containing aluminum alloy such as a panel of automobiles.SOLUTION: A semi-continuous casted alloy ingot is homogenized at over 500°C for 2 hr. or more, hot rolled to intermediate thickness at coiling temperature of 280 to 400°C, passed through one or a plurality of cold rolling to final thickness, applied to surface finish with rolling or optimized crepe processed finish, solved at over 480°C at a strip shape in a continuous annealing line, quickly cooled, and coiled at 50°C to 120°C. A high temperature coiling process is optionally selected, reactivity of coating galling of the alloy is improved by using the same. In a part of cases, dissolved coil may be washed before press processing, pretreated, and coated with a lubricant.SELECTED DRAWING: Figure 1
Patent JP-2020187386-A (JP)
Title: Report preparation apparatus and report preparation method
Inventor: KAWARABAYASHI NAOYA
IPC: G06Q50/06
Filed: 2019-05-09
Abstract: To provide a report preparation apparatus and a report preparation method capable of presenting an actual value of a reduction amount related to water treatment in a target period to a customer.SOLUTION: A report preparation apparatus includes: a reduction amount derivation unit that acquires data on a standard treatment amount which is a treatment amount related to water treatment measured in advance before a target period and data on an amount of treatment within a period which is a treatment amount related to the water treatment measured in the target period, derives a standard amount which is an amount according to a standard treatment amount and an amount in a period according to the treatment amount in the period, and derives a reduction amount of the amount in the period against the standard amount; and a preparation unit that prepares a report representing the derived reduction amount.SELECTED DRAWING: Figure 1
Patent JP-2020186932-A (JP)
Title: Electronic component evaluation method, electronic component evaluation device and electronic component evaluation program
Inventor: MORITA JUNJI
IPC: G01B11/00
Filed: 2019-05-10
Abstract: To provide an electronic component evaluation method with which it is possible to inspect all pieces of component with a small load pertaining to measurement, without directly touching electronic components.SOLUTION: Provided is an electronic component evaluation method for evaluating the shape of an electronic component 100 provided with a lower base part 32D that is the side facing a mounting substrate 110, an upper base part 31D having a flat principal side and a plurality of mounting terminals 50 used for mounting on the mounting substrate 110. This method is executed by a reference plane creation step for creating a reference plane that is in contact with at least three of the mounting terminals 50 from terminal position information relating to the positions of the mounting terminals 50, and an information detection step for detecting height information relating to the height of the lower side and/or upper side of the electronic component, with the reference plane as a point of reference.SELECTED DRAWING: Figure 6
Patent JP-2020187418-A (JP)
Title: Light emission touch panel
Inventor: KIDA YOSHITOSHI
IPC: G09G3/34
Filed: 2019-05-10
Abstract: To aim at simplifying a light emission touch panel structure with a light source and at making its control easy.SOLUTION: A light emission touch panel comprises a reflective layer 16 and a first electrode layer adjacent to the reflective layer 16. The first electrode layer is provided with a strip-shaped RX electrode 28 and a strip-shaped cathode 18 overlaid on the reflective layer 16, where the strip-shaped cathode is aligned with the RX electrode 28 while aligning the extending direction. The light emission touch panel comprises an insulator layer 20 adjacent to the first electrode layer and an OLED layer 22 adjacent to the insulator layer 20. The light emission touch panel penetrates the insulator layer 20, comprises cathode contact holes 40 connecting the cathode 18 and the OLED layer 22, and moreover, comprises a second electrode layer adjacent to the OLED layer 22. The second electrode layer is provided with a strip-shaped TX electrode 30 crossing the RX electrode 28 and with an anode 24 in contact with the OLED layer 22, where the anode is aligned with the TX electrode 30 while aligning the extending direction.SELECTED DRAWING: Figure 1
Patent JP-2020187632-A (JP)
Title: Touch-panel controller and program
Inventor: ICHIKAWA DAISUKE
IPC: G06F3/0488
Filed: 2019-05-16
Abstract: To provide a touch-panel controller configured to prevent an input error for touch operation, and a program.SOLUTION: A controller 2 detects a touch position, touch-on and touch-off operations (S1, S3), acquires an operation level on an object corresponding to the touch position (S4), outputs coordinate information of a position having a predetermined relationship between the current operation level and the previous operation level, as touch-off coordinate information, to a CPU 6 (S10), and does not output coordinate information of detected touch positions to the CPU 6 until touch-off is detected (YES in S1 → YES in S2 → S1).SELECTED DRAWING: Figure 5
Patent JP-2020185278-A (JP)
Title: Game machine
Inventor: SUGIZAKI MASANORI
IPC: A63F7/02
Filed: 2019-05-16
Abstract: To provide a game machine which prevents a player's interest in a game from lowering.SOLUTION: A game machine that comprises display means (a performance display device, as an example) capable of displaying a variable game based on a winning lottery and can display various information related to the variable game includes: operation means (an operation unit, as an example) that a player can operate; and control means (a sub-control CPU, as an example) that can at least control to display the various information. The control means can perform specific control to change the brightness when displaying predetermined information based on a change operation. In the specific control, the brightness of the part displaying specific identification information (the fourth and fifth symbols, as an example) is not changed, while the brightness of the part displaying normal identification information (the first to third symbols, as an example) is changed.SELECTED DRAWING: Figure 9
Patent JP-2020187101-A (JP)
Title: Adhesion evaluation method
Inventor: KODAMA SHOICHI
IPC: G01N19/04
Filed: 2019-05-17
Abstract: To make it possible to accurately evaluate the adhesion of a boundary surface.SOLUTION: An adhesion evaluation method includes: a reforming layer formation step ST1 of irradiating at least either one substrate of a first substrate or a second substrate with a laser beam having a wavelength having transmittance while locating a focus point inside the substrate to form a reforming layer; a supporting step ST2 of facing the substrate on which the reforming layer is formed against a pair of supporting parts separated from each other, and supporting a composite substrate with the supporting parts so as to sandwich a break line formed by the reforming layer; a pressing step ST3 of relatively moving the supporting parts and a pair of pressing parts arranged above the composite substrate and separated from each other at an interval smaller than that of the supporting parts, and pressing the composite substrate with the pressing parts; and a measuring step ST4 of measuring the amount of displacement of the pressing parts and a load applied to the composite substrate. The adhesion between the first substrate and the second substrate is evaluated based on the load applied to the composite substrate when the substrate is divided along the break line.SELECTED DRAWING: Figure 3
Patent JP-2020190514-A (JP)
Title: Article inspection device and article inspection method
Inventor: TANIMOTO TAKAO
IPC: G01N21/23
Filed: 2019-05-23
Abstract: To provide an article inspection device and an article inspection method that are in a simple and inexpensive configuration using universal optical components without any rotating mechanisms and can speedily inspect distribution of a birefringence phase difference in an object to be inspected having birefringence.SOLUTION: An article inspection device includes: an irradiation optical system 12 for applying luminous fluxes of circularly polarized light to an object W to be inspected; a 1/4-wavelength plate 14 for imparting a phase difference of a 1/4-wavelength to luminous fluxes through the object W to be inspected; an analyzer 15 for passing a predetermined polarized light component of luminous fluxes through the 1/4-wavelength plate 14; a first image sensor 16 for outputting an intensity signal corresponding to the quantity of light of luminous fluxes through the analyzer 15; a birefringence phase difference distribution calculation part 43 for calculating distribution of a birefringence phase difference of the object W to be inspected from an intensity signal outputted from the first image sensor 16; and a determination part 44 for determining whether the object W to be inspected is conforming or not on the basis of comparison of the distribution of a birefringence phase difference calculated by the birefringence phase difference distribution calculation part 43 and the distribution of a desired birefringence phase difference.SELECTED DRAWING: Figure 1
Patent JP-2019188474-A (JP)
Title: Lead-free solder paste and production method of the same
Inventor: ASHUTOSH SHARMA
IPC: B23K35/22
Filed: 2019-05-29
Abstract: To provide a lead-free solder alloy composition and a production method of the lead-free solder alloy where a substrate and an electronic component used for micro electron packaging have excellent wettability and spreadability and a solder alloy particularly harmless to a human environment can be produced.SOLUTION: In a lead-free solder alloy composition and a production method of the lead-free solder alloy, the lead-free solder alloy composition is made by adding ceramic powders to a lead-free solder consisting of Sn-(0.1-2) wt.% Cu, Sn-(0.5-5) wt.% Ag or Sn-(0.1-2) wt.% Cu-(0.5-5) wt.% Ag. The new lead-free solder alloy composition acting as a substitute to a conventional lead-free solder (lead-free-solder) has more excellent effects in spreadability, wettability and mechanical properties than a conventional solder.SELECTED DRAWING: Figure 2a