Patent SG-11201407839P-A (SG)
Title: Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
Inventor: LEFEVRE PAUL ANDRE
IPC: B24D18/00
Filed: 2013-05-29
Abstract: (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 December 2013 (12.12.2013) WIPOIPCT (10) International Publication Number WO 2013/184465 A1 (51) International Patent Classification: B24B 37/20 (2012.01) B24D 11/00 (2006.01) B24B 37/22 (2012.01) B24D 18/00 (2006.01) B24B 37/26 (2012.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: (30) Priority Data: 13/488,149 4 June 2012 (04.06.2012) (71) Applicant: NEXPLANAR CORPORATION [US/US]; 7175 NW Evergreen Parkway, Suite 200, Hillsboro, Ore­ gon 97124 (US). (74) Agents: BERNADICOU, Michael A. et al.; Blakely Sokoloff Taylor & Zafman LLP, 1279 Oakmead Parkway, Sunnyvale, California 94085 (US). PCT/US2013/043126 29 May 2013 (29.05.2013) English (72) Inventors: LEFEVRE, Paul Andre; 1030 SW Jefferson Street, Portland, Oregon 97201 (US). ALLISON, William C.; 4243 NW Chaparral Terrace, Beaverton, Oregon 97006 (US). LACASSE, James P.; 9576 NW Marvin Lane, Port­ land, Oregon 97229 (US). SCOTT, Diane; 3140 NE Bryce Street, Portland, Oregon 97212 (US). SIMPSON, Alexan­ der William; 2515 NW Overlook Drive, Apt. 323, Hills­ boro, Oregon 97124 (US). HUANG, Ping; 1765 NW 173rd Avenue, Apt. 703, Beaverton, Oregon 97006 (US). CHARNS, Leslie M.; 23 SW 111th Terrace, Portland, Oregon 97225 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, English ()M, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, us TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) (54) Title: POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER •t 00 i-H en i-H o CJ O £ FIG. 3A (57) Abstract: Polishing pads with a polishing surface layer having an aperture or opening above transparent a foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having global a top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and back a surface. An aperture is disposed in the polishing pad from the back surface through to the polish­ ing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polish - ing pads are also described.