baber/WOPTO huggingface dataset:
Patent TW-517368-B (TW)
Title: Manufacturing method of the passivation metal on the surface of integrated circuit
Inventor: KUNG MORISS
IPC: H01L23/552
Filed: 2002-01-22
Granted: 2003-01-11
Abstract: A manufacturing method of the passivation metal on the surface of integrated circuit is disclosed, which provides an integrated circuit constitution comprising a substrate and more than one chip on it, a chip capable of being coupled to the substrate by plural ways such as wire-bonding or flip-chip, and an encapsulant to be at least passivated on the chip and the adjacent substrate. A metal spray layer passivated on the surface of part of the non-conductive region is formed by spraying thereby forming the integrated circuit in the way of metal spray. Before spraying the metal layer, a protection film can be added selectively for protection. The thickness of the metal spray layer can be controlled for varying easily, which can achieve good heat dissipation and EMI prevention effect, so as to maintain the normal operation of the integrated circuit chip.
Patent TW-560133-B (TW)
Title: Media converter and transmission system using the same
Inventor: TANAKA KAZUYASU
IPC: H04L12/26
Filed: 2002-01-22
Granted: 2003-11-01
Abstract: A transmission system allowing a response test to be activated from cable side and easy detection of occurrence of a failure is disclosed. In a transmission system for transmitting data between a first communication point and a second communication point along a link, a test manager transmits a trigger signal to a media converter on the link, and determines a location of a failure depending on whether a response block of data is received from a corresponding media converter within a predetermined time period. When a media converter has received the trigger signal, a response packet corresponding to the trigger signal is transmitted back to a source that has transmitted the trigger signal. A packet buffer is preferably provided in a media converter so that when one link is disconnected, the other link can be used to transmit packets, allowing a link test.
Patent TW-I223940-B (TW)
Title: Method and apparatus for data rate control in a communication system
Inventor: BENDER PAUL E
IPC: H04B1/707
Filed: 2002-03-01
Granted: 2004-11-11
Abstract: In a wireless communication system (10) a method and apparatus for inhibiting data transmissions during a data service outage at the access terminal (16). The access terminal (16) transmits an outage indicator to the access network (12) prior to the outage. A data service outage may be due to a page monitor of the voice portion of the system, or to frequency searching during which the access terminal (AT) is not available to receive data. The access network (12) does not transmit data during the outage. In one embodiment, the indicator is a DRC null cover. In an alternate embodiment, the indicator is a DRC having a zero data rate.
Patent TW-565475-B (TW)
Title: Constructional panel
Inventor: SECCOMBE CAMPBELL JOHN
IPC: E04D3/361
Filed: 2002-03-07
Granted: 2003-12-11
Abstract: The present invention relates generally to a constructional panel in the form of a metal roof panel 10 being elongate and having four longitudinally and equally spaced apart rib formations 12/14/16/18. Adjacent pairs of the longitudinal rib formations such as 12 and 14 are interconnected by a pan 20. The pans 20 each include a plurality of transversely extending and spaced apart micro flutes 22. The micro flutes are in the form of groove and rib formations such as 23 and 25, respectively. The micro flutes are designed for stiffening the otherwise unstable pan 20 and also for aesthetic reasons to provide an attractive and ""natural"" appearance. It has also been found that the micro flutes have the effect of eliminating ""oil canning"" where the surface of the material is distorted by stretching of the sheet metal in traditional roll forming.
Patent TW-583231-B (TW)
Title: Porous para-oriented aromatic polyamide film, method of producing same, and prepreg
Inventor: SHINOHARA YASUO
IPC: C08L77/10
Filed: 2002-03-25
Granted: 2004-04-11
Abstract: Provided is a porous para-oriented aromatic polyamide film which contains fine particles composed of a heat-resistant resin in an amount of 10 to 400 parts by weight based on 100 parts by weight of a pare-oriented aromatic polyamide and has a linear thermal expansion coefficient at 200 to 300 DEG C of from -50x10<-6>/DEG C to +50x10<-6>/DEG C. The porous para-oriented aromatic polyamide film shows excellent tear propagation resistance and has light weight and low linear thermal expansion coefficient, and is suitable as a prepreg material used for a base substrate for printed circuit board.
Patent TW-509769-B (TW)
Title: Device for filling and activating hydrogen storage tank
Inventor: JENG YAU-TZUNG
IPC: F17C11/00
Filed: 2002-04-15
Granted: 2002-11-11
Abstract: A device for filling and activating a hydrogen storage tank comprises: a hydrogen storage tank storage body installed with a plurality of housing spaces for mounting a plurality of hydrogen storage tanks therein; the interior of the hydrogen storage tank storage body is installed with a plurality of hydrogen storage tank engaging seats for engaging the mounted hydrogen storage tank; a cool water tank; a warm water tank; and a vacuum pump for drawing gas from the hydrogen storage tank during activating operation of the hydrogen storage tank. When the device is performing a hydrogen filling operation, the hydrogen storage tank storage body supplies hydrogen from the hydrogen storage tank in coordinate with the cooling by the cool water tank and through each hydrogen storage tank engaging seat of the hydrogen storage tank storage body, fills into each hydrogen storage tank.
Patent TW-546408-B (TW)
Title: Displacement gold plating solution
Inventor: HAYASHI KATSUNORI
IPC: H05K3/18
Filed: 2002-04-16
Granted: 2003-08-11
Abstract: The present invention provides a non-cyanide displacement gold plating solution with which even an electroless nickel-boron plated or electrolytic nickel plated substrate can be subjected to displacement gold plating with good adhesion properties and high solderability. The displacement gold plating solution in accordance with the present invention contains 0.01 to 1.0 g/L (expressed in terms of gold concentration) of sodium gold sulfite or ethylene diamine complex of sodium gold sulfite, 10 to 100 g/L of sulfite, 5 to 50 g/L of organic carboxylic acid or salt thereof, and 5 to 50 g/L of ethylene diamine tetraacetic acid or salt thereof, and has a pH value in the weak acid range of 4.5 to 6.
Patent TW-528753-B (TW)
Title: Process for producing propylene oxide
Inventor: OKU NORIAKI
IPC: C07D301/32
Filed: 2002-04-22
Granted: 2003-04-21
Abstract: A process for producing propylene oxide comprises a step of reacting propylene with cumene hydroperoxide in the presence of a catalyst, to form propylene oxide, and a step of subjecting the reaction product of the above reaction step to a distillation and recovering unreacted propylene from the top of a distillation column, in which the bottom temperature of the distillation column is set at 200 DEG C or lower.
Patent TW-564169-B (TW)
Title: Top plate for X-ray camera and method for producing the same
Inventor: NISHI YASUYUKI
IPC: B29C70/06
Filed: 2002-06-03
Granted: 2003-12-01
Abstract: The present invention provides a top plate for X-ray camera and a method for producing the same. The present invention provides a top plate with a strength higher than that of a conventional one and having a lower content of carbon fiber. The method includes mounting a surface plate 2 and a lining plate 3 corresponding to each other in which the two ends thereof in the width direction form an interconnection construction. At least the warp yarns of the surface plate and the lining plate are formed of a fiber reinforced resin using carbon fiber fabric as the main reinforcing material. The warp yarns are oriented separately parallel to the longitudinal direction of the surface plate and the lining plate with a linearity R of more than 90%. At least the warp yarn is made of carbon fiber, and the carbon fiber fabric is formed by impregnating carbon fiber with un-cured resin and receiving a continuous drawing by a drawing device of a forming mold and heated for curing.
Patent TW-531619-B (TW)
Title: Improved method for manufacturing gate plate of gate valve
Inventor: WU LE-RUEI
IPC: F16K5/06
Filed: 2002-06-19
Granted: 2003-05-11
Abstract: An improved method for manufacturing a gate of a gate valve is disclosed. Firstly a circular rod having proper diameter is cut and directly forged to integrally form a blank for a flat circular gate body with pivots located respectively at the upper and lower ends of the gate body, the pivots of the gate capable of being engaged and pivoted at the inside the gate valve. The blank is then punched to punch down the burrs from peripheral edge of the blank to form a finished product of gate body. The pivot bottom surface of the lower end of the body is formed to be a friction welding surface, and a shaft with a diameter equivalent to the pivot is butted and welded by friction welding process. Therefore, the gate plate can be formed firstly a integrally formed gate body by forging, and then an existing straight shaft is friction welded to the lower end of the pivot of the gate body, so that the mold volume of forging mold can be reduced and the consumption of the material for manufacturing the gate can be also reduced.
Patent TW-583673-B (TW)
Title: A control gate decoder for twin MONOS memory with two bit erase capability
Inventor: OGURA TOMOKO
IPC: G11C16/04
Filed: 2002-07-05
Granted: 2004-04-11
Abstract: The present invention is a decoder for control gate lines of a twin MONOS flash memory array. Decoder units connected to each control gate line of the memory are controlled to provide select, override and unselect voltages to perform read, program and erase operations. The decoder units are divided into odd and even addressing where separate voltages can be applied control gates of to adjacent memory cells. Override voltages, which prevent operations of a selected cell from affecting adjacent memory cell storage sites, can be applied to the control gates of immediate neighboring cells of the selected sell. Unselected voltages can be applied to beyond the immediate neighboring cells to further prevent disturb conditions in remote cells.
Patent TW-I242108-B (TW)
Title: Colored photosensitive resin composition
Inventor: ICHIKAWA KOJI
IPC: G02B5/20
Filed: 2002-07-16
Granted: 2005-10-21
Abstract: This invention is to provide a colored photosensitive resin composition capable of giving a colored pattern which generates little sublimate in heating after development even when 2-methyl-2-morpholino-1-(4-methylthiophenyl)propan-1-one or 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one is contained as a photopolymerization initiator. The colored photosensitive resin composition comprises (A) a colorant, (B) a binder polymer, (C) a photopolymerizable compound, (D) at least one photopolymerization initiator selected from the group comprising 2-methyl-2-morpholino-1-(4-methylthiophenyl)propan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one and (E) at least one compound selected from the group comprising epoxy compounds and oxetane compounds. (a) A layer (4) of the colored photosensitive resin composition is formed onto a substrate (2), (b) the layer is exposed and developed, and (c) a colored pattern is formed by heating treatment to obtain a color filter.
Patent TW-I268604-B (TW)
Title: Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
Inventor: JOHNSON MARK G
IPC: H01L27/115
Filed: 2002-07-31
Granted: 2006-12-11
Abstract: A three-dimensional, field-programmable, non-volatile memory includes multiple layers of first and second crossing conductors. Pillars are self-aligned at the intersection of adjacent first and second crossing conductors, and each pillar includes at least an anti-fuse layer. The pillars form memory cells with the adjacent conductors, and each memory cell includes first and second diode components separated by the anti-fuse layer. The diode components form a diode only after the anti-fuse layer is disrupted.
Patent TW-544995-B (TW)
Title: Flash A/D converter with new autozeroing and interpolation possessing negative impedance compensation
Inventor: HSU CHUN-WEI
IPC: H03M1/12
Filed: 2002-08-09
Granted: 2003-08-01
Abstract: A flash A/D converter with new autozeroing and interpolation possessing negative impedance compensation technique is disclosed to simultaneously solve autozeroing problems and the drawback of too many preamplifiers in the high-speed flash ADC. In this invention, a switching preamplifier is provided to avoid using non-overlap control signals required by comparators and to eliminate the interference, caused by the high-speed autozeroing operation, at input nodes. Hence, the autozeroing and comparison operation can be completed in a small clock period. Capacitor interpolation is used to obtain interpolated signals for the data conversion. In addition, negative impedance compensation technique is provided to overcome the speed limitation of the interpolation technique so that the A/D converter can operate at the high-speed condition. This present invention can be applied to implement high-speed autozeroing flash A/D converter or other parallel architectures of A/D converters.
Patent TW-546218-B (TW)
Title: Spare tire cover
Inventor: CHIKU SHIGENOBU
IPC: B62D43/02
Filed: 2002-08-12
Granted: 2003-08-11
Abstract: A spare tire cover comprising a patch plate (4) with a plurality of stop holes (40a, 40b), a rear cover (2) including a slide fastener (3) and having the patch plate (4) attached, a top cover with a plurality of projections (10a, 10b) disposed on its inner surface, the stop holes (40a, 40b) and the projections (10a, 10b) being fittingly joined, thereby fixedly attaching the patch plate (4) to the inner surface of the top cover (1), the sewn portions of the slide fastener (3) and rear cover (2) being rolled and held inwardly of the top cover (1) by the patch plate (4) so as to mount the rear cover (2) integrally with the top cover (1), which means that the spare tire cover can be constructed in a simple operation omitting the operation of sewing other members to the hard top cover, which is large and bulky, and that the rear cover can be mounted integrally with the top cover by a rugged construction; thus, the spare tire cover is easy to mount and dismount and looks good.
Patent TW-I237721-B (TW)
Title: Light guide plate and liquid crystal display having the same
Inventor: KIM MAN-SOO
IPC: G02F1/13357
Filed: 2002-10-30
Granted: 2005-08-11
Abstract: Disclosed is a light guide plate for improving front visual angle characteristics. Either a pyramidal recession having at least three sidewalls and a predetermined depth or a pyramidal protrusion having at least three sidewalls and a predetermined height is formed on a light emitting surface of the light guide plate. Accordingly, it is possible to increase the brightness of the front visual angle without using a prism and diffusion sheets or with a reduced number of prism sheets. Also, an LCD apparatus using the light guide plate has a reduced weight and volume compared with conventional LCDs.
Patent TW-I263090-B (TW)
Title: Liquid crystal display apparatus
Inventor: KIM YONG-IL
IPC: G02F1/1333
Filed: 2002-11-12
Granted: 2006-10-01
Abstract: Disclosed is an LCD apparatus having a reduced size and weight. The LCD apparatus includes a bottom chassis having a bottom surface and first to fourth sidewalls. The sidewall of the bottom chassis includes a supporting member for preventing a light guiding plate from being moved and a fixing boss for fixing an optical sheet. The bottom chassis includes a lamp insertion portion for receiving a lamp unit, which is disposed on the third and fourth sidewalls of the bottom chassis. The bottom chassis receives a reflecting plate, the light guiding plate and the optical sheet. A mold frame is coupled to the bottom chassis to fix the reflecting plate, the light guiding plate and the optical sheet to the bottom chassis. A display unit disposed on the mold frame is fixed to the mold frame by a top chassis coupled to the mold frame. Accordingly, a bottom mold frame for receiving a backlight assembly is removed, so that it is able to reduce a cost of the LCD apparatus and a weight thereof.
Patent TW-I283906-B (TW)
Title: Pick-up tool for mounting semiconductor chips
Inventor: SCHNETZLER DANIEL
IPC: H01L21/68
Filed: 2002-11-22
Granted: 2007-07-11
Abstract: With a pick-up tool (1) with a suction organ (4) made of elastically deformable material, a surface (6) for picking the semiconductor chip (2) is formed convex. On placing the semiconductor chip (2) onto an already mounted semiconductor chip (14) the centre of the semiconductor chip (2) impacts first. The convex surface (6) is increasingly deformed as a result of the pressure build-up until it and the picked semiconductor chip (2) are flat. The pressure builds up from the centre of the suction organ (4) outwards. In doing so, the semiconductor chip (2) is rolled onto the lower semiconductor chip (14), whereby the air can continuously escape.
Patent TW-594850-B (TW)
Title: Chemical amplification type photoresist composition, method for producing a semiconductor device using the composition, and semiconductor substrate
Inventor: NAGAHARA SEIJI
IPC: G03F7/38
Filed: 2002-12-03
Granted: 2004-06-21
Abstract: To provide a chemical amplification type positive photoresist composition suited to resist patterning of a substrate presenting surface step differences, a method for manufacturing the semiconductor device employing this composition, and a semiconductor substrate. In a method for manufacturing a semiconductor device, a resist film is formed using a chemical amplification type positive photoresist composition, comprised of a base resin and a basic compound added to the base resin at a rate of 1 to 100 mmol to 100 g of the base resin, on a substrate halving surface step differences and into which the organic removing solution is deposited or oozed, and a predetermined area of the resist film is exposed to light to form a resist pattern.
Patent TW-I278273-B (TW)
Title: Heat dissipation device for electronic component
Inventor: CHIOU JERING
IPC: G06F1/20
Filed: 2002-12-13
Granted: 2007-04-01
Abstract: A heat dissipation device is employed to lower the temperature of an electronic component. The dissipation device comprises a first blower, a second blower, and three heat dissipation fins. The first heat dissipation fins connected to the electronic component via a heat pipe is cooled by the first blower. The second heat dissipation fins connected to the electronic component via a heat pipe is cooled by the second blower. The third heat dissipation fins connected to the electronic component closely is cooled by the first and second blower serially.
Patent TW-I256318-B (TW)
Title: Catalyst for producing bisphenol A and method of using the same
Inventor: IWAHARA MASAHIRO
IPC: C07B61/00
Filed: 2002-12-20
Granted: 2006-06-11
Abstract: This invention provides a catalyst with high activity, heavy mass resistance and alcohol resistance for producing bisphenol and a method of using the same to produce bisphenol; a sulfonic type cation exchange resin is modified with (a) pyrimidine chain alkyl mercaptan (b) amino chain alkyl mercaptan or thiazolidine to from catalyst for producing bisphenol, the method for producing bisphenol is obtained from reacting phenol with acetone in the presence of the catalyst for producing bisphenol.
Patent TW-I232556-B (TW)
Title: Thin film transistor array and its manufacturing method, liquid crystal display apparatus using thin film transistor
Inventor: MORITA HIROMASA
IPC: H01L21/28
Filed: 2003-03-21
Granted: 2005-05-11
Abstract: The purpose of the present invention is to provide a kind of TFT (thin film transistor) array substrate, which is capable of suppressing the characteristic deterioration caused by light irradiation, its manufacturing method, and the liquid crystal display (LCD) apparatus using the substrate. The invented manufacturing method of TFT array includes the following steps: forming gate insulation film 3, the semiconductor layer 4a, the ohmic contact layer 4b and the metal film 16 on the substrate formed with the gate wiring 1; using photoengraving to form photoresist pattern 17 on the metal film 16 so as to make the film thickness of the semiconductor active layer 8 thinner than the other portions; etching the metal film 16 to form source wiring 6, source electrode 5 and drain electrode 7; removing the ohmic contact layer 4b and the semiconductor layer 4a after PR after the semiconductor active layer 8 is removed; removing the metal film 16; and removing the ohmic contact layer 4b.
Patent TW-I283746-B (TW)
Title: Novel integrated circuit chip for bioassays
Inventor: LAI DERHSING
IPC: G01N33/543
Filed: 2003-03-26
Granted: 2007-07-11
Abstract: The invention is directed to novel IC chips containing substances used particularly in bioassays. Furthermore, the invention is directed to assay methods and kits using these chips. An integrated circuit chip for use in an assay of a substance comprising: (a) a transponder encoded with information which is transmitted to a receiver in response to a radio signal and (b) at least one substance attached to said transponder.
Patent TW-I221823-B (TW)
Title: Container for a substance to be sprayed, cap for such container and method for manufacturing such container
Inventor: ZIGMANS JOHANNES ANTONIUS GERA
IPC: B65D83/14
Filed: 2003-04-16
Granted: 2004-10-11
Abstract: A container for a substance to be sprayed, wherein the container comprises a reservoir for the substance, wherein the container is provided with operable spraying means connected to the reservoir for spraying the substance, wherein the spraying means (3, 4, 13, 14) are provided with at least two spaced apart outflow openings (7, 8; 17, 18, 18') which can be brought into fluid communication (2; 12) with the reservoir (1; 11) for spraying the substance in at least two spray beams (B1, B2; B11, B11', B12) to surroundings. The invention further relates to a cap, evidently destined for such a container. Additionally, the invention relates to a method for manufacturing such a container.
Patent TW-588450-B (TW)
Title: Uniform turn-on design on multiple-finger MOSFET for ESD protection application
Inventor: KER MING-DOU
IPC: H01L23/60
Filed: 2003-04-22
Granted: 2004-05-21
Abstract: An electrostatic discharge protection circuit. The electrostatic discharge (ESD) circuit utilizes inductors and resistors added to sources of multiple fingers of the NMOS transistor, which is triggered by some feedback circuit uniformly. When under an ESD zapping, a finger MOS transistor is trigger initially to snapback region owing to its layout or other causes, a voltage drop across the inductor or the resistor connected to the source of the finger MOS transistor is occurred and presented to gates of the other finger MOS transistors by the feedback circuit. Thus, other finger MOS transistors are turned on.