Patent DE-10038581-A1 (DE)
Title: Thermoplastic foaming materials, useful as fillers in molding materials and for production of molded bodies, films, foams and fibers of increased stiffness and decreased density, contain microporous organometallic compound
Inventor: SERVAY THOMAS
IPC: C08K5/00
Filed: 2000-08-03
Abstract: Thermoplastic foaming materials contain: (A) at least one thermoplastic polymer, and (B) at least one organometallic compound B of microporous structure, obtained by reaction of at least one metal salt and a corresponding counter-ion with at least one organic ligand containing: (i) up to 20C alkyl substructure, (ii) at least one aryl substructure, and (iii) at least one alkyl or arylamine substructure, containing 1-20C in the alkyl and 1-8 phenyl rings in the aryl groups. Thermoplastic foaming materials contain (wt.%): (A) at least one thermoplastic polymer A (50-99), and (B) at least one organometallic compound B of microporous structure (1-50), obtained by reaction of at least one metal salt cation selected from: Mg<2>+, Ca<2+>, Se<2+>, Ba<2>, Sc<3+>, Y<3+>, Ti<4+>, Zr<4+>, Hf<4+>, V<4+>, V<3+>, V<2+>, Nb<3+>, Ta<3+>, Cr<3+>, Mo<3+>, W<3+>, Mn<3+>, Mn<2+>, Re<3+>, Fe<3+>, Fe<2+>, Ru<3+>, Ru<2+>, Os<3+>, Os<2+>, Co<3+>, Co<2+>, Rh<2+>, Rh<+>, Ir<2+>, Ir<+>, Ni<2+>, Ni<+>, Pd<2+>, Pd<+>, Pt<2+>, Pt<+>, Cu<2+>, Cu<+>, Ag<+>, Au<+>, Zn<2+>, Cd<2+>, Hg<2+>, Al<3+>, Ga<3+>, In<3+>, Tl<3+>, Si<4+>, Si<2+>, Ge<4+>, Ge<2+>, Sn<4+>, Sn<2+>, Pb<4+>, Pb<2+>, As<5+>, As<3+>, As<+>, Sb<5+>, Sb<5+>, Sb<3+>, Sb<+>, Bi<5+>, Bi<3+>, Bi<+> and a corresponding counter-ion with at least one organic ligand containing: (i) up to 20C alkyl substructure, (ii) at least one aryl substructure with 1-8 phenyl rings, and (iii) at least one alkyl or arylamine substructure, containing 1-20C in the alkyl and 1-8 phenyl rings in the aryl groups, and at least one multidentate functional group X covalently bonded to the substructure, in the presence of a matrix agent (sic) selected from: (a) alkyl amines containing linear, branched, or cyclic aliphatic 1-20C groups and the corresponding alkylammonium salts; (b) 1-5 phenyl arylamines and the corresponding ammonium salts; (c) alkyl phosphonium salts, containing linear, branched, or cyclic 1-20C cyclic aliphatic groups; (d) aryl phosphonium salts with 1 to 5 phenyl rings; (e) alkylorganic acids containing linear, branched, or cyclic 1-20C cyclic aliphatic groups; (f) araylorganic acids with 1-5 phenyl rings and the corresponding aryl organic anions and salts; (g) aliphatic alcohols containing 1-20C linear, branched, or cyclic aliphatic groups; (h) aryl alcohols with 1-5 phenyl rings; (i) the inorganic anions: sulfate, nitrate, nitrite, sulfite, hydrogen sulfite, phosphate, hydrogen phosphate, dihydrogen phosphate, diphosphate, triphosphate, phosphite, chloride, chlorate, bromide bromate, iodide, iodate, carbonate or hydrogen carbonate, and the corresponding acids and salts of these inorganic anions; (j) ammonia, carbon dioxide, methane, oxygen, argon, nitrogen, ethylene, hexane, benzene, toluene, xylene, ethanol, chlorobenzene, nitrobenzene, naphthalene, thiophene, pyridine, acetone, 1,2-dichloroethane, trichloroethane, methylene chloride, tetrahydrofuran, ethanolamine, triethylamine, dimethyl formamide, N-methylpyrrolidone, N,N-dimethylacetamide, and trifluoromethylsulfonic acid. X = COOH, CSSH, NO2, SO3H, Si(OH)3, Ge(OH)3, Sn(OH)3, Si(SH)3, Ge(SH)3, Sn(SH)3, PO3H, AsO3H, AsO4H, P(S)3, As(SH)3, CH(RSH)2, C(RSH)3, CH(RNH2)2, C(RNH2)3,CH(ROH)2, C(ROH)3, CH(RCN)2, C(RCN)3, CH(SH)2, C(SH)3, CH(NH2)2, C(NH2)3, CH(OH)2, C(OH)3, CH(CN)2, or C(CN)3; and R = 1-5C alkyl or aryl with 1-2 phenyl rings. Independent claims are included for: (1) increasing the stiffness of the foaming materials by addition of an organometallic compound B of microporous structure; (2) decreasing the density of the filled thermoplastic molding materials without affecting their stiffness by the use of a filler comprising an organometallic compound B of microporous structure; and (3) molded bodies, films, foams, and fibers obtained from the thermoplastsic molding materials.