baber/WOPTO huggingface dataset:
Patent TW-360883-B (TW)
Title: Variable-frequency preheating electric ballast
Inventor: HSIEH GUAN-CHYUN
IPC: H01F38/10
Filed: 1997-12-05
Granted: 1999-06-11
Abstract: A variable-frequency preheating electric ballast is disclosed, which varies the switching frequency of a switching transistor from a specific frequency to the resonant frequency of a ballast prior to starting a lamp, so that, when the switching frequency varies to a frequency close to the resonant frequency, the voltage between the two terminals of a lamp start-up capacitor will increase gradually and turn on the lamp. Meanwhile, when the switching frequency changes towards the resonant frequency and before the lamp is turned on, the AC current flowing through the lamp filament performs a preheating process thereto, thereby reducing the required voltage level for lighting the lamp, while avoiding burning out of the lamp and prolonging the operation life thereof.
Patent TW-366582-B (TW)
Title: Method for forming laser repair contact in semiconductor
Inventor: HUANG KUO-CHING
IPC: H01L23/58
Filed: 1998-01-13
Granted: 1999-08-11
Abstract: A method for forming laser repair contact in semiconductors by first forming fuse on the substrate. Covering the first dielectric layer and then forming the hard mask before forming the second dielectric layer. Forming the annular metal layers, inter-metal-layer dielectric layer and the annular metal plugs before forming the protective layer and then the photoresist coating. By using microfilm technology for exposing the area for forming fuse contact. Then proceed with the etching on the dielectric layers using said hard mask as etching final layer and then remove the hard mask. At this time, it is only the first dielectric layer of 2000 to 6000 Å in thickness above the fuse, for forming fuse protective layer.
Patent TW-430896-B (TW)
Title: Process for treating a polished semiconductor wafer immediately after the semiconductor wafer has been polished
Inventor: HENNHOEFER HEINRICH
IPC: H01L21/304
Filed: 1998-03-04
Granted: 2001-04-21
Abstract: The subject-matter of the invention is a process for treating a polished semiconductor wafer immediately after the semiconductor wafer has been polished. The semiconductor wafer is brought into contact with an aqueous treatment agent and its polished surface is oxidized by the action of the treatment agent.
Patent TW-452844-B (TW)
Title: Conductive feedthrough for a ceramic body and method of fabricating same
Inventor: BURKHART VINCE
IPC: H01L21/48
Filed: 1998-03-25
Granted: 2001-09-01
Abstract: A conductive feedthrough connector for conducting electrical current through a ceramic body. A ceramic body is generally fabricated by stacking a plurality of layers of ceramic material and then sintering the stack of layers to cure the layers into a unitary, solid ceramic body. In accordance with the present invention, as each layer is positioned, a portion of the layer is silk screened with conductive material prior to the next layer being positioned atop the silk screened layer. Each silk screen region is coaxially aligned along an axis through the ceramic body. The stack of silk screened layers are then sintered to form a solid ceramic body containing the plurality of stacked metal electrodes. A first conductor is then formed vertically into the ceramic body to interconnect the embedded electrodes. From the opposite side of the ceramic body, a second conductor is formed into the surface passing through and interconnecting one or more the layers of electrodes. As such, a conductive path is formed between the first conductor on one side of the ceramic body and the second conductor on the other side of the ceramic body.
Patent TW-390855-B (TW)
Title: Semiconductor device packaging system and method of packaging semiconductor device
Inventor: DUNCAN WILLIAM V
IPC: H05K13/00
Filed: 1998-03-27
Granted: 2000-05-21
Abstract: A packaging system (100) protects integrated circuit devices (106) from corrosion and mechanical damage. The devices are enclosed in a reel (102) having a hub (114) in which a cavity (116) is formed for retaining a molded desiccant (118). Aperture (120) between the cavity and the devices provide a vapor path for drawing moisture from the devices. A banding strip (108) for enclosing the devices within the reel has recessed areas (142) for housing pellets of desiccant (140). The reel is placed in an inflatable envelope (50) that includes view ports (56) for reading identifying information on the reel. A vacuum is drawn and the envelope is seaed. Air cells (52) in the inflatable envelope are inflated to cushion the devices from mechanical damage during shipment.
Patent TW-550418-B (TW)
Title: Active matrix substrate and method of forming a contact hole in the same, and a LCD using such substrate
Inventor: URA MASASHI
IPC: H01L21/311
Filed: 1998-04-07
Granted: 2003-09-01
Abstract: The present invention relates to a method of forming a contact hole in the active matrix substrate, which comprises the steps of: (1) forming an insulating film by covering a first electrode provided on a substrate and the substrate; (2) forming a contact hole by patterning said insulating film by means of dry etching; and (3) forming a second electrode, and contacting the second electrode with the first electrode. In the step (2) after forming a contact hole by dry etching, a surface treatment by a plasma etching mode or a reactive ion etching mode with oxygen gas under a condition in which a pressure P is in a range of 100 Pa to 400 Pa is performed.
Patent TW-464527-B (TW)
Title: Process for purifying an aqueous solution of hydrogen peroxide
Inventor: KAJIWARA SHOICHIRO
IPC: B01D15/04
Filed: 1998-04-23
Granted: 2001-11-21
Abstract: A process for purifying an aqueous solution of hydrogen peroxide comprising bringing the aqueous solution of hydrogen peroxide into contact with a cation exchange resin or an anion exchange resin, aging the obtained intermediately purified aqueous solution of hydrogen peroxide by standing alone for 1 hour or more, and bringing the aged aqueous solution of hydrogen peroxide into contact with an ion exchange resin of the same type. The process provides a high purity aqueous solution of hydrogen peroxide and can advantageously be used in the field of production of semiconductors.
Patent TW-466120-B (TW)
Title: Process for producing alumina material with high strength
Inventor: WEI WEN-CHENG
IPC: A61L27/10
Filed: 1998-05-06
Granted: 2001-12-01
Abstract: A process for producing an alumina material with high strength is disclosed. The process for producing an alumina material includes steps of (a) providing a solution containing a dispersing agent, (b) mixing a θ-alumina powder and an Α-alumina powder with the solution to form a slurry, (c) filtering the slurry to form a green part, (d) drying the green part, and (e) densifying the dried green part to form the alumina material. The produced alumina material has a density over 98.5%, an average strength over 450 Mpa, an average grain size less than 4 μm. The produced alumina material is applied for artificial skeleton.
Patent TW-415003-B (TW)
Title: Fabrication of mix-mode semiconductor device
Inventor: LIN JEN-BIN
IPC: H01L21/70
Filed: 1998-05-15
Granted: 2000-12-11
Abstract: A method of manufacturing a metal capacitor of a mix-mode semiconductor device. A substrate having a conductive layer and a lower electrode of a capacitor are formed thereon. A dielectric layer is deposited over the substrate. Two openings are formed within the dielectric layer to respectively expose the conductive layer and the lower electrode. A conductive plug and an upper electrode of the capacitor corresponding to the conductive layer and the lower electrode, respectively, are formed in these openings.
Patent TW-526274-B (TW)
Title: Corrosion-resistant member, wafer-supporting member, and method of manufacturing the same
Inventor: OHASHI TSUNEAKI
IPC: H01L21/205
Filed: 1998-06-05
Granted: 2003-04-01
Abstract: This invention relates to a corrosion-resistant member having a resistance to plasma of a halogen based corrosive gas, which comprises a main body and a corrosion-resistant layer formed on a surface of the main body and containing a fluoride of at least one element selected from the group consisting of rare earth elements and alkaline earth elements.
Patent TW-436692-B (TW)
Title: Method for preventing CMOS data from being lost
Inventor: LI SHI-CHIN
IPC: G06F12/16
Filed: 1998-08-31
Granted: 2001-05-28
Abstract: A method for preventing CMOS data from being lost is disclosed. The method utilizes the CMOS data previously backed up in part memory blocks of the system BIOS ROM. When the CMOS data is lost and the even the user forgets the original configuration, the system user still can use backup data to easily restore the original CMOS data thereby avoiding the unnecessary disturbance. The present method comprises the steps of: after the system is powered on, performing a general power on self test; when a CMOS data loss is detected, and selecting a first data (stored in the CMOS data backup of the system flash BIOS ROM) or a second data (the CMOS data predefined in the BIOS) by the user to be loaded into the CMOS; subsequently, continuing the rest of the power on self test. In addition, the user is able to select whether the current CMOS data is backed up to the system flash BIOS ROM.
Patent TW-410350-B (TW)
Title: Semiconductor memory having hierarchical bit line architecture with non-uniform local bit lines
Inventor: MUELLER GERHARD
IPC: H01L27/10
Filed: 1998-09-30
Granted: 2000-11-01
Abstract: Disclosed is a semiconductor memory (18, 20, 100, 200) having a hierarchical bit line architecture including local bit lines (LBL1, LBL2) on a lower fabrication layer, coupled to memory cells (MC), and master bit lines (MBL) on a higher fabrication layer, each coupled to an associated sense amplifier (SAi). Local bit lines disposed in any given column are coupled to different numbers of memory cells, i.e., the local bit lines have different lengths (L1, L2) over the memory cells. A hybrid configuration is preferably employed in which one local bit line (LBL1) in a column is directly coupled via a switch (251) to an associated sense amplifier, whereas  the other local bit lines in the column (LBL2-LBL4) are operatively coupled to the sense amplifier via the master bit line. The different local bit line lengths are preferably selected such that total bit line capacitance with respect to any of the memory cells is substantially equalized, thereby improving data retention time for the memory.
Patent TW-374721-B (TW)
Title: Absorbent article with visually and tactilely distinctive outer cover
Inventor: NIEMEYER JEAN FEYEN
IPC: A61F13/15
Filed: 1998-11-06
Granted: 1999-11-21
Abstract: An absorbent article, such as the shown diaper (10), has a front waistband portion (14), a back waistband portion (12) and an intermediate portion (16) interconnecting said front and back waistband portions. The article includes a backsheet member (30), a liquid permeable topsheet layer (28) and backsheet member (30). The backsheet member includes an air permeable, polymer sheet layer (96), and a first, outward nonwoven fibrous web (94) attached to or otherwise operatively joined with a major facing surface (78) of the polymer sheet layer (96) at a plurality of individual, spaced apart thermal bonds (98). The outward nonwoven web (94) includes a plurality of fibers having substantially unbounded lengths which extend substantially continuously between at least an adjacent pair of the bonds, and the substantially unbounded fiber lengths are arched away from an outward surface of the thermal bonds by arch heights (60) which provides a distinctive embossing element depth value. In addition, the fibers of the outward nonwoven web can have a selected denier, and the outward nonwoven web (94) can have a selected basis weight.
Patent TW-512508-B (TW)
Title: Integrated circuit die assembly and method for making same
Inventor: BOYLE JOHN J
IPC: H01L31/0203
Filed: 1998-12-03
Granted: 2002-12-01
Abstract: An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.
Patent TW-469228-B (TW)
Title: Method for producing multi-layer printed wiring boards having blind vias
Inventor: KUWAKO FUJIO
IPC: H05K3/00
Filed: 1999-01-11
Granted: 2001-12-21
Abstract: An alkaline refractory metal which is insoluble in alkaline etching solutions, is electrodeposited on the surface of copper foil, then a thermosetting resin is applied to the surface and semi-cured to obtain a coated copper foil. The coated copper foil is bonded to one or both faces of an inner layer board having wirings on one or both of its faces. Then, the copper foil on a surface of this laminate is removed by alkaline etching, while selectively leaving the alkaline refractory metal layer. A laser beam is used to form via holes in both the alkaline refractory metal layer and the thermosetting resin layer simultaneously. With the above method, via holes of the multi-layered printed wiring board can be easily formed using a laser, and adhesion between the outer wirings made from the plated copper and the insulating resin is improved.
Patent TW-411717-B (TW)
Title: Chip of image sensing device and image reading device of the chip
Inventor: SAWADA HIDEKI
IPC: H04N1/031
Filed: 1999-01-29
Granted: 2000-11-11
Abstract: Each read image pixel N of the chip of image sensing device (A) is set as N=n*k (but multiples of 16 are excluded), where n is taken as the number of one block of image signal during the offset adjustment of the plural image signals outputted by plural light receiving components (2) conducting on plural block units in one time. k is the least integer meeting the condition, 0<(n*k-<gamma>*p)<n, where <gamma> is the resolution of read image pixels per preset unit length, and p is the minimum difference of the requested plural read widths and the converted value by taking the unit length as the standard unit. When plural chips of image sensing device (A) are aligned up in a row for operation, the ratio of the length of the chip of the image sensing device (A) to the residual amount of the preset read width is a constant.
Patent TW-509703-B (TW)
Title: Inherently light- and heat-stabilized polyamide and method of making the same
Inventor: ILG OTTO
IPC: C08K5/3435
Filed: 1999-02-12
Granted: 2002-11-11
Abstract: An inherently light- and heat-stabilized polyamide is prepared by polymerizing polyamide-forming monomers in the presence of (a) an effective amount of at least one 4-carboxy-2,2,6,6-tetramethylpi-peridine compound represented by formula (1), wherein R1 is hydrogen, benzyl, or a C1-C20 alkyl, R2-R5 are each hydrogen or the same or a different C1-C6 alkyl, X has n free valance bonding sites and is an alkyl or substituted alkyl having from about 1 to about 30 carbon atoms or an aryl or substituted aryl having from about 6 to about 20 carbon atoms, m is 0 or 1, -C(O)-R6 is a group that can form an amide bond together with an amine, and n is equal to 1, 2, or 3 and (b) an effective amount of at least one 4-amino-2,2,6,6-tetramethylpiperidine compound represented by formula (II); wherein R7 is hydrogen, benzyl, or a C1-C20 alkyl. The inherently light- and beat-stabilized polyamide comprises at least, one radical of the at least one piperidine compound of formula (I) chemically bonded to the backbone polymer chain and at least one radical of the at least one 4-amino-2,2,6,6-tetramebhylpiperidine compound of formula (II) chemically bonded to the backbone polymer chain. The inherently light- and heat-stabilized polyamide may be used to form articles such as, for example, fibers, carpets, yarns, and textile fabrics.
Patent TW-393369-B (TW)
Title: A wafer processing machine and a processing method thereby
Inventor: HAKOMORI SHUNJI
IPC: B24B37/08
Filed: 1999-02-20
Granted: 2000-06-11
Abstract: This invention relates to a sheet feeding type wafer polishing machine which processes both surfaces of wafer and outermost periphery of wafer (edge part) in series, having two platens stuck with a polishing pad or a grinding stone and holding a wafer therebetween.  The surface of said wafer is processed by rotating at least one of said two platens and wafer, wherein the diameter of said platens are bigger than the radius of said wafer and smaller than the diameter of said wafer, and said wafer is supported by at least three guide rollers which contact to the outermost periphery of said wafer.  Further, the present invention provides an edge polishing and a surface polishing method by said wafer processing machine.
Patent TW-525290-B (TW)
Title: High dielectric constant capacitor
Inventor: SHR WANG-CHENG
IPC: H01L27/04
Filed: 1999-03-05
Granted: 2003-03-21
Abstract: A high dielectric constant capacitor is provided, which has a structure made by forming a silicon nitride layer on a polysilicon layer, forming a high dielectric constant film on the silicon nitride layer, and depositing a metal layer, in which the high dielectric constant film is made by chemical vapor deposition and is composed of mixture of tantalum oxide and titanium oxide with a tantalum-to-titanium ration ranging from 2.8 to 8.8 atom percents. After the high dielectric constant film is deposited, an adequate treatment is performed to greatly reduce its leakage current and thus the requirement of the capacitor element can be achieved.
Patent TW-415086-B (TW)
Title: Double crown-shaped capacitor with high dielectric parameter materials
Inventor: WU SHIE-LIN
IPC: H01L27/108
Filed: 1999-04-06
Granted: 2000-12-11
Abstract: The invention relates to a double crown-shaped capacitor with high dielectric parameter materials, in which the first dielectric layer is formed on the substrate and the silicon oxide layer is formed on the first dielectric layer. The first crown metal region is formed on top of the substrate. The first crown metal region is connected to the substrate via the hole in the first dielectric layer and silicon oxide layer, while a conducting plug is formed inside the hole. The second crown metal region is formed on the silicon oxide layer. The inner side wall of the second crown metal region is connected to the outer side wall of the first crown metal region and the second crown metal region is higher than the first crown metal region. The second dielectric layer covers the surface of the first crown metal region and the second crown metal region. The conducting layer is formed on the second dielectric layer.
Patent TW-444188-B (TW)
Title: Recording medium for storing real time recording/reproduction information, method and apparatus for recording and reproducing in real time and file operating method using the same
Inventor: CHUNG HYUN-KWON
IPC: G11B27/02
Filed: 1999-04-30
Granted: 2001-07-01
Abstract: A recording medium for storing real time recording/reproduction information, a real time recording and reproducing method and apparatus, and a file operating method using the information, are provided. Real time recording/reproduction information for ensuring real time recording/reproduction is stored in a file control information area, in each real time file, or in a sperate file, and real time recording/reproduction attributes are assigned to the file. Thus, real time recorded files can be continuously reproduced without interruption. Also, methods of creating a file to which real time recording/reproduction attributes are assigned, extending a data area, and recording and reproducing the file to which real time recording/reproduction attributes are assigned, are provided.
Patent TW-460379-B (TW)
Title: Method of making resin fiber into a roll
Inventor: CHEN TZUNG-HUANG
IPC: B29D99/00
Filed: 1999-05-17
Granted: 2001-10-21
Abstract: Disclosed is a method of making carbon fiber reinforced resin into a roll that can be widely implemented in manufacturing of fiber reinforced resin into a roll, comprising the steps of: drawing a plastic material into resin fibers; binding the bundled resin fibers with rubber bands at appropriate locations; cutting the bundled resin fibers to appropriate length taking where the rubber band is strapped as a central reference, characterized in that: placing a plurality of bundled resin fibers on a compressing device; lowering the compressing lid above the compressing device to contact and cover above the resin fibers so as to prevent the resin fibers from jolting; activating the compressing device to press against the bundled resin fibers for compressing the resin fibers into a resilient roll; and retaining a tray to the top and the periphery of the roll body.
Patent TW-417239-B (TW)
Title: The method of forming the landing pad in the device of ULSI
Inventor: CHEN YUAN-FENG
IPC: H01L21/768
Filed: 1999-05-17
Granted: 2001-01-01
Abstract: A kind of method of increasing the area of landing pad comprises the following steps: deposit the poly-silicon layer on the surface of memory unit upon the semiconductor device; depositing a photoresist layer on the poly-silicon and then to cover the landing pad of polysilicon layer using lithographic process; and then deposit a high molecule layer on the whole surface of the above-mentioned semiconductor structure. Next utilizing the photoresist and the polymer spacer as the photomask to etch the poly-silicon layer so that only the poly-silicon sited below the photomask is remained. The usage of the polymer spacer will protect the poly-silicon underneath from without etching damage and further amplifies the area of the landing pad formed. Finally remove the photoresist and the polymer spacer with traditional O2 plasma method to form the amplified landing pad on the contact via under the condition of reducing the micro particle pollution.
Patent TW-436613-B (TW)
Title: Apparatus for taking measurements in the ear
Inventor: KRAUS BERNHARD
IPC: G01K13/00
Filed: 1999-06-17
Granted: 2001-05-28
Abstract: The invention is directed to an apparatus for taking measurements in the ear, having a positioning aid enabling a probe head (10) of the apparatus to be properly aligned in a user's auditory canal (12). The apparatus of the present invention comprises a source of radiation (24) emitting energy particularly in the visible region, a photodetector (30) suitable for sensing this radiation, and an associated evaluation unit and, where applicable, an indicating unit for representing the alignment of the probe head in the auditory canal (12). This canal receives the radiation from the radiation source (24), with part of the radiation being scattered back into the probe head (10) and sensed by the photodetector (30). In this arrangement, the radiant power sensed is dependent on the mean distance between the reflecting tissue and the probe head (10), with a minimum radiant power corresponding to a correct alignment of the probe head (10) to the rear auditory canal (12) and hence to the tympanic membrane (38). The output signal of the photodetector (30) preferably controls the frequency and/or volume of an audible signal informing the user of the optimal alignment of the probe head (10), so that the repeat accuracy of the measurement results is improved.