Patent EP-4125120-A3 (EP)
Inventor: CHI JEN-HAI
IPC: H01L23/498
Filed: 2022-06-24
Abstract: An electronic apparatus (100a,100b,100c,100d,100e,100f,100g,100h) includes a substrate (110), a plurality of bonding pads (115,115g,160), an electronic device (120), and a first spacer (130a,130b,130c,130d,130e,130f,130h). The electronic device (120) is disposed on the substrate (110) and electrically connected to the substrate (110) through the first bonding pads (115), in particular, flip-chip bonded thereto. The first spacer (130a,130b,130c,130d,130e,130f,130h) is disposed between the electronic device (120) and the substrate (110). The bonding pads may be first bonding pads (115,115g) disposed on the substrate (110). The first spacer (130a) may be disposed between the first bonding pads (115), wherein a second spacer (140a) may further be disposed between the first bonding pads (115). Alternatively, the first bonding pads (115) may be disposed between the first spacer (130b) and a second spacer (140b). The spacers (130a, 130b, 140a, 140b) may be rectangular. Four first spacers (130c) (for instance, ball-shaped) may be respectively arranged around the first bonding pads (115), at positions corresponding to corners of the electronic device (120). The first spacer (130d,130e) may surround the first bonding pads (115), in particular, it may have an H shape in top view and surround three side surfaces of the first bonding pads (115). A plurality of second bonding pads (125,125g) may be disposed on the electronic device (120), wherein the first spacer (130f) may be disposed between the second bonding pads (125) and the first bonding pads (115) on the substrate (110), wherein the first spacer (130f) may further comprise a solder ball. The first bonding pads (115,115g) and the second bonding pads (125g,125g) may be structurally and electrically connected through a plurality of solder materials (150), wherein a shape of the first spacer (130e) may be rectangular, the first spacer (130e) having two openings (132), the first bonding pads (115), the solder materials (150), and the second bonding pads (125) being located in the two openings (132) and the first spacer (130e) surrounding the first bonding pads (115). The first bonding pads (115g) and the second bonding pads (125g) may have an L shape in top view. The electronic apparatus (100h) may comprise a plurality of spacers (130h), disposed on one of the electronic device (120) and the substrate (110), and a plurality of bonding pads (160), disposed on the other of the electronic device (120) and the substrate (110), wherein the substrate (110) and the electronic device (120) are electrically connected through the spacers (130h) and the bonding pads (160), wherein a solder material (150h) may be located between the spacers (130h) and the bonding pads (160).The spacer (130a,130b,130c,130d,130e,130f,130h,140a,140b) allows for effectively controlling a height and uniformity of a gap between the electronic device (120) and the substrate (110), so as to prevent the electronic device (120) from being tilted during solder reflow and ensure the electronic apparatus (100a,100b,100c,100d,100e,100f,100g,100h) to have a favorable structural reliability.