baber/WOPTO huggingface dataset:
Patent TW-469330-B (TW)
Title: Method of manufacturing balls used in a ball plug-valve, structure of the ball and a ball plug-valve product utilizing the same
Inventor: LIOU JUNG-MING
IPC: F16K5/06
Filed: 2000-09-11
Granted: 2001-12-21
Abstract: The present invention relates to a method of manufacturing balls used in a ball plug-valve, structure of the ball and a ball plug-valve product utilizing the same, which is characterized in that: first preparing a tubular material with two end-opening passages as a base material of the ball; forming the external surface of the base material into a plurality sections of junction with unequal outer diameter and annular cascade distribution in the axial direction of the base material, and forming a plurality of collars made of a wear-resistant material adapted to corresponding width and outer diameter of the plurality sections of junction, so that each of the collar can be fitted onto corresponding junction; then monolithically grinding the outer portion of each collar covered on the external surface of the base material into a spherical surface, and using a wear-resistant material to form a sleeve adapted to the inner diameter of the base material and fitted into the tube of the base material by attaching to the inner surface of the base material, so that the ball has a tubular base material therein and is covered with the wear-resistant material; and incorporating two ball seats made of a wear-resistant material to achieve a product with a feature of high wear resistance.
Patent TW-495935-B (TW)
Title: Manufacturing method of solid state image device with color filters only and CMOS, CCD image sensor
Inventor: FAN YANG-TUNG
IPC: H01L23/28
Filed: 2000-09-28
Granted: 2002-07-21
Abstract: The present invention provides a manufacturing method of solid state image device with color filters only, wherein a planar, high transmittance material layer with its refractive index close to that of the color filter is passivated on the color filter after forming the color filter and before dicing and packaging procedure, so as to reduce the degree of scattering during the incident light passing through the color filter interface, and makes the remaining particles to be removed easily by cleaning processing during the dicing and packaging process. The present invention also provides the manufacturing method of CMOS and CCD image sensor.
Patent TW-I249078-B (TW)
Title: Photoimageable composition comprising photopolymerizable binder oligomer having tetra-acrylate functionality
Inventor: ERAMO LINCOLN JR
IPC: C08G59/50
Filed: 2000-10-16
Granted: 2006-02-11
Abstract: An oligomer is provided having tetraacrylate functionality as well as carboxylic acid functionality. The oligomer is useful as a photopolymerizable binder in photoresists for forming printed circuitry. Particular advantages of the oligomer are found in solder mask-forming compositions which must withstand the conditions of nickel/gold plating.
Patent TW-479214-B (TW)
Title: Patterned substrate and liquid crystal display provided therewith
Inventor: OGURA MASAFUMI
IPC: G02F1/1343
Filed: 2000-10-26
Granted: 2002-03-11
Abstract: A TFT 43 is formed on an insulating substrate 42, and a photosensitive resin 44 film as an interlayer insulating film is formed so as to cover the TFT 43. A first photomask and a second photomask provided with scattered circular light-shielding portions are used to perform two exposure so that contact holes 66 are formed in the photosensitive resin 44 and smooth concave and convex portions in regions other than the TFT 43. Further, an MoN film 45 and a reflective electrode 46 are successively laminated on the photosensitive resin 44. The N2 content in the MoN film 45 is made between 5 atomic % and 30 atomic % inclusive so that the MoN film 45 can obtain strong adhesion to the photosensitive resin 44 and prevent decrease in the etching rate.
Patent TW-448276-B (TW)
Title: Gas regulator
Inventor: MIZUTANI KEIICHI
IPC: F23N1/00
Filed: 2000-12-06
Granted: 2001-08-01
Abstract: Disclosed is a compact and low-cost gas regulator without using membrane. The gas inlet space 60 surrounded by a box 62 connects the gas outlet space 61 with a rectangular shape opening valve 62a in the axial direction. A cylindrical valve body 63 which allows the gas in the gas inlet space 60 to flow in is installed inside the box 62 and moves freely along the axial direction. When the valve body moves away along the axial direction from the box 62, the overlapped area between the box valve opening 62a and the cylindrical body valve opening 63a will reduce; that is the opening area of the box valve opening 62a will reduce. The external ends of the valve body along the axial direction are closed. The gas pressure difference between the first gas pressure P1 and the second gas pressure P2 applies a resultant force toward one side of the valve body 63 on the inner surface of the closed end 63b along the axial direction. Therefore, a spring 67 is provided on the other side to generate an elastic force in another direction such that the valve body 63 has a displacement when the resultant force generated from the gas pressure difference and the spring elastic force reach equilibrium.
Patent TW-559732-B (TW)
Title: Method and apparatus for maintaining processor ordering
Inventor: CHOWDHURY MUNTAQUIM F
IPC: G06F9/38
Filed: 2001-02-13
Granted: 2003-11-01
Abstract: According to one aspect of the invention, a method is provided in which store addresses of store instructions dispatched during a last predetermined number of cycles are maintained in a first data structure of a first processor. It is determined whether a load address of a first load instruction matches one of the store addresses in the first data structure. The first load instruction is replayed if the load address of the first load instruction matches one of the store addresses in the first data structure.
Patent TW-494448-B (TW)
Title: A video bus for high speed multi-resolution imagers and method thereof
Inventor: ZARNOWSKI JEFFREY
IPC: H04N3/15
Filed: 2001-01-29
Granted: 2002-07-11
Abstract: A bus system and an imager for transferring signals from a plurality of signal streams to cm output includes a plurality of signal buses in parallel and a control system. The control system multiplexes the signals from two or more of the plurality of signal streams onto two or more of the plurality of signal buses and allows the signals to substantially charge each of the two or more of the plurality of signal buses before demultiplexing the signals to the output. A method for transferring signals includes multiplexing signals on to two or more of a plurality of signal buses and allowing the signals to substantially charge each of the two or more of the plurality of signal buses before demultiplexing the signals to an output.
Patent TW-483084-B (TW)
Title: Computerized in-situ real-time monitoring system
Inventor: LUO JIUN-GUANG
IPC: G01N30/02
Filed: 2001-02-02
Granted: 2002-04-11
Abstract: The present invention provides a real-time monitoring system to monitor the contaminating substances in the environmental air of the high-tech semiconductor factory. The contaminating substances it can monitor comprises the polar and non-polar compounds, it has a sample preprocess apparatus (SPA) to process the gas sample of the contaminating substances in the environment in real time at room temperature; a sample separation device to separate the gas sample; a sample analyzing device to analyze the distribution and the amount of the object compound; and a data processing device to automatically process the data from the distribution of the object compound and the amount, so as to complete the setup of the real-time monitoring system.
Patent TW-I281909-B (TW)
Title: Diphenyl ether compounds useful in therapy
Inventor: ANDREWS MARK DAVID
IPC: C07D205/04
Filed: 2001-12-06
Granted: 2007-06-01
Abstract: A compound of general formula (I), or pharmaceutically acceptable salts, solvates or polymorphs thereof; wherein; R1 and R2, which may be the same or different, are hydrogen, C1-C6 alkyl, (CH2)m(C3-C6 cycloalkyl) wherein m=0, 1, 2 or 3, or R1 and R2 together with the nitrogen to which they are attached form an azetidine ring; each R3 is independently CF3, OCF3, C1-4 alkylthio or C1-C4 alkoxy; n is 1, 2 or 3; and R4 and R5, which may be the same or different, are: A-X, wherein A=-CH=CH- or -(CH2)p- where p is 0, 1 or 2; X is hydrogen, F, Cl, Br, I, CONR6R7, SO2NR6R7, SO2NHC(=O)R6, OH, C1-4 alkoxy, NR8SO2R9, NO2, NR6R11, CN, CO2R10, CHO, SR10, S(O)R9 or SO2R10; R6, R7, R8 and R10 which may be the same or different, are hydrogen or C1-6 alkyl optionally substituted independently by one or more R12; R9 is C1-6 alkyl optionally substituted independently by one or more R12; R11 is hydrogen, C1-6 alkyl optionally substituted independently by one or more R12 C(O)R6, CO2R9, C(O)NHR6 or SO2NR6R7; R12 is F, OH, CO2H, C3-6 cycloalkyl, NH2, CONH2, C1-6 alkoxy, C1-6 alkoxycarbonyl or a 5- or 6-membered heterocyclic ring containing 1, 2 or 3 heteroatoms selected from N, S and O optionally substituted independently by one or more R13; or R6 and R7, together with the nitrogen to which they are attached, form a 4-, 5- or 6-membered heterocyclic ring optionally substituted independently by one or more R13; or a 5- or 6-membered heterocyclic ring containing 1, 2 or 3 heteroatoms selected from N, S and O, optionally substituted independently by one or more R13; wherein R13 is hydroxy, C1-C4 alkoxy, F, C1-C6 alkyl, haloalkyl, haloalkoxy, -NH2, -NH(C1-C6 alkyl) or -N(C1-C6 alkyl)2; wherein when R1 and R2 are methyl, R4 and R5 are hydrogen and n is 1, R3 is not a -SMe group para to the ether linkage linking rings A and B.
Patent TW-467846-B (TW)
Title: Automatic operation process of vacuum inert gas packing machine
Inventor: WANG LI-YAN
IPC: B65B55/00
Filed: 2001-02-20
Granted: 2001-12-11
Abstract: This invention relates to an automatic operation process of a vacuum inert gas packing machine, comprising: (a) using a set of clamping-type chains to introduce a box film roll into a box mold unit; (b) forming the film, which has been introduced into the mold unit, by a vacuum hot press forming manner to form a desired packing box; (c) loading a material to be packed into the packing box; (d) printing on an upper cover film; (e) covering the upper cover film on the packing box; (f) generating vacuum; (g) filling with inert gas; (h) sealing the box; (i) transversely cutting the packing box; (j) longitudinally cutting the packing box; (k) recovering the waste material after cutting the packing box; (l) sending out the product. A full automation of packing process can be achieved through the arrangement of abovementioned operation process.
Patent TW-548731-B (TW)
Title: Polishing apparatus
Inventor: HOMMA YOSHIO
IPC: B24B37/30
Filed: 2001-03-19
Granted: 2003-08-21
Abstract: This invention provides a polishing apparatus having a cover body with fluid pressing mechanism, in which, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to be less than force needed for wafer polishing with rotation of the cover body.
Patent TW-I247329-B (TW)
Title: Method of integrated master production scheduling (MPS) system with material capacity planning system
Inventor: CHEN SHOU-JUNG
IPC: H01L21/00
Filed: 2001-04-24
Granted: 2006-01-11
Abstract: This invention relates to a method of merging the master production (MP) scheduling system with a material capacity planning (MCP) scheduling system method. It is suitable for a wafer foundry service firm. Wherein, the master production scheduling system is used for planning the supplies chain. The plant production scheduling system is used for planning the schedule of wafer foundry. Let the ith production step manufacture time of planning specific-manufacture in the schedule be PT (I). It presets the plant production scheduling system for entire specific-manufacture with ideal system manufacturing cycle time CT. This method prior calculates of leading time LT of ith production steps (I), its value is LT(I)=(PT(I)/SigmaPT(I))xCT. Further, it divides into n groups during leading time LT, and finds its summation respectively. The n parameters thus obtained provide the master production scheduling system to carry out the plan. Finally, the planning result of the master production scheduling system plan transfers to the plant production scheduling system to carry out the verification.
Patent TW-495417-B (TW)
Title: Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
Inventor: WENSKI GUIDO
IPC: B24B41/06
Filed: 2001-05-10
Granted: 2002-07-21
Abstract: The invention relates to a process for the double-side polishing of semiconductor wafers between two polishing plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 μm of semiconductor material is abraded, the semiconductor wafers lying in plastic-linded cutouts in a set of a plurality of planar carriers which are made from steel and the mean thickness of which is 2 to 20 μm smaller than the mean thickness of the fully polished semiconductor wafers, wherein the set comprises only those carriers whose difference in thickness is at most 5 μm, and each carrier belonging to the set has at least one unambiguous identification feature which assigns it to the set, and an item of information contained in the identification feature is used in order for the plastic linings to be exchanged at fixed intervals and to ensure that the semiconductor wafers remain in the same order after the polishing as before the polishing. The invention also relates to a carrier which is suitable for carrying out the process.
Patent TW-578418-B (TW)
Title: Method and device for mobile units to directly exchange information
Inventor: TENG CHUN-LIN
IPC: H04M1/00
Filed: 2001-07-06
Granted: 2004-03-01
Abstract: A method and device for mobile units to directly exchange information utilizes the directive transmitter/receiver of mobile unit to directly exchange regular data, which can directly exchange specific data by following the specific communication channel designated in accordance with regular data to adjust communication frequency without having to go through the radio communication network and base station to transmit those data. Moreover, the mobile unit can connect with PC and exchange those data by virtue of a link unit. The mobile unit not only performs its functions but also provides inexpensive and convenient data transmission function.
Patent TW-576846-B (TW)
Title: Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
Inventor: UHARA KENJI
IPC: C08J5/18
Filed: 2001-08-24
Granted: 2004-02-21
Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4'-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Patent TW-527796-B (TW)
Title: ATM communication system for improving UTOPIA communication interface and method therefor
Inventor: CHEN YI-CHIUN
IPC: H04L12/54
Filed: 2001-08-30
Granted: 2003-04-11
Abstract: The invention relates to a pseudo-UTOPIA interface, which needs to upgrade standard UTOPIA interface in ATM equipment to pseudo-UTOPIA interface only under ATM communication such that the interface enables a high speed transmission medium interface between ATM equipment and PHY equipment without requiring additional device and obtains a most efficient (minimum transmission delay) transmission effect. The pseudo-UTOPIA interface can utilize a working mode used in level 2 and level 1 of UTOPIA, thereby requiring no additional device and effectively reducing cost.
Patent TW-550434-B (TW)
Title: Focus monitoring method, focus monitoring apparatus, and method of manufacturing semiconductor device
Inventor: NAKAO SHUJI
IPC: G02B7/04
Filed: 2001-09-27
Granted: 2003-09-01
Abstract: Non-telecentric illuminating light obtained by controlling the shape of an opening of an illumination aperture is directed onto a photomask, and a characteristic such that an image of a pattern of the photomask formed by the non-telecentric illumination moves in the direction perpendicular to an optical axis when an image-forming plane is moved in the direction of the optical axis, to perform focus monitoring. This eliminates the need for a special photomask, so that inexpensive and highly precise focus monitoring method, focus monitoring apparatus, and a method of manufacturing a semiconductor device can be obtained.
Patent TW-567475-B (TW)
Title: Method and apparatus for enabling cold temperature performance of a disk
Inventor: SMITH GORDON JAMES
IPC: G11B25/04
Filed: 2001-11-12
Granted: 2003-12-21
Abstract: In cold weather, the higher torque required for normal spinning operation of a spindle motor assembly in a direct access storage device due to the increased viscosity of the grease, is overcome by localizing the heating to the spindle motor assembly to reduce the viscosity of the grease, and then let a disk driven self heat during and after spin-up of the spindle motor assembly.
Patent TW-508810-B (TW)
Title: Method for forming embedded non-volatile memory
Inventor: KUO TUNG-CHENG
IPC: H01L27/112
Filed: 2001-11-29
Granted: 2002-11-01
Abstract: A method for forming a non-volatile memory is disclosed. The method comprises the substrate is divided into at least a memory array area and a logic device area. An oxide/nitride/oxide (ONO) layer is firstly formed on the substrate, and a photoresist layer is formed on the ONO layer by bit line photo process and a bit line ion implant process is performed on the substrate to form the bit line. Then, a first polysilicon layer is deposited to form word line structure by word line photo condition. Such that the complementary metal oxide semiconductor (CMOS) ONO layer is used to store charge and the ONO layer is only touched the photoresist layer once. Furthermore, the separated adjust photo condition of memory array area and logic device area can create a safe oxide thickness that the problem of leakage path between the bit line to bit line in using self-aligned silicide process can be solved.
Patent TW-I276230-B (TW)
Title: Structure and manufacturing method of light emitting diode
Inventor: CHEN SHI-MING
IPC: H01L21/28
Filed: 2001-12-04
Granted: 2007-03-11
Abstract: This invention relates to a structure and a manufacturing method of a light emitting diode, at least including: providing a substrate, forming on the substrate a buffer layer, a first clad layer, an active layer, a second clad layer, and a window layer sequentially; a first metal electrode is formed under the substrate; a second metal electrode is formed on the window layer and a Schottky contact formed between the second metal electrode and the window layer; a third metal electrode having a high melting point is formed over the second metal electrode; a fourth metal electrode is formed upon the third metal electrode and an Ohmic contact is formed between the fourth metal electrode and the window layer; a fifth metal electrode is formed over the fourth metal electrode and has good adhesion to a metal wire; when the substrate, the buffer layer, and the first interlayer are of either the n-type or p-type conductivity, the second clad layer and the window layer will have the opposite conductivity type. Movement of injection carriers can be effectively blocked by the Schottky contact between the third metal electrode and the window layer. Moreover, diffusion of composition of the fourth metal electrode is avoided by the high melting point of the third metal electrode which separates the second metal electrode and the fourth metal electrode, as well as avoids affecting the Schottky contact between the second metal electrode and the window layer having a the second conductivity, thereby increasing the light-emitting efficiency of light emitting diode.
Patent TW-I285469-B (TW)
Title: Wireless controller and power supply method thereof
Inventor: TANAKA MAKOTO
IPC: G10L15/00
Filed: 2002-01-23
Granted: 2007-08-11
Abstract: A wireless controller is provided with at least two batteries. The internal components of the controller are classified into at least two groups in accordance with the degrees of functional importance or the power consumptions of the components. The batteries supply electric power separately to the respective groups of the components. Thus the power supply for components with high degrees of functional importance or low power consumptions is ensured for a long time.
Patent TW-I249820-B (TW)
Title: Semiconductor integrated circuit configured to supply sufficient internal current
Inventor: SUZUKI KENJI
IPC: G06F17/50
Filed: 2002-02-04
Granted: 2006-02-21
Abstract: A semiconductor integrated circuit includes pads, a first power supply I/O cell which is connected to an external pin through a corresponding one of the pads, and a second power supply I/O cell which is not connected to an external pin through a corresponding one of the pads, but receives power supply from the first power supply I/O cell.
Patent TW-I303262-B (TW)
Title: Azo dyestuffs
Inventor: OBERHOLZER MARTIN
IPC: C09B29/42
Filed: 2002-02-07
Granted: 2008-11-21
Abstract: Compounds of formula (I) wherein all substituents have the meanings as defined in the Specification, their production and their use.
Patent TW-579306-B (TW)
Title: Substrate processing equipment
Inventor: NIIYAMA KISABURO
IPC: H05K3/18
Filed: 2002-03-08
Granted: 2004-03-11
Abstract: A substrate processing equipment is provided, in which the following events can be realized, firstly, a damage can be prevented with respect to a formation-face of a circuit, secondly, the attachment of garbage etc. can be prevented, thirdly, a uniform processing can be realized by a sprayed processing liquid, fourthly, it can be realized simply, easily, actually and automatically. Said substrate processing equipment 1 is used in a manufacturing process of a printed circuit board, the printed circuit board-material E is maintained by a conveyor 2 having a wheel group 5 of up/down trench type, said equipment 1 is transported in a state without contacting with the formation-face J of said circuit, and various processings are performed. Therefore, as for the wheel group 5 of up/down trench type, the up/down distance can be set variably; as for the left/right spray-nozzle section 3, it can be oppositely located into left/right symmetry, it can also be set variably in a standing-up posture and in an inclined posture, and the spray-angle can be set variably in a right-angle position Q and in an offset position.
Patent TW-536775-B (TW)
Title: Manufacturing method of shallow trench isolation structure
Inventor: HO TZU-EN
IPC: H01L21/311
Filed: 2002-04-18
Granted: 2003-06-11
Abstract: A manufacturing method of shallow trench isolation structure suitable for use in semiconductor silicon substrate is disclosed in the present invention. The invention includes the following steps: forming a shallow trench on a semiconductor silicon substrate; forming a liner oxide layer in the shallow trench; forming a liner silicon nitride layer on the liner oxide layer; using high density plasma chemical vapor deposition (HDPCVD) method to deposit the first oxide layer in the shallow trench; wet spray etching the first oxide layer to a determined depth, in which the etching solution composition ratio of the spray etching is HF/H2SO4=0.3 to 0.4; and using HDPCVD method to deposit the second oxide layer to completely fill up the shallow trench to form a shallow trench isolation structure.