baber/WOPTO huggingface dataset:
Patent TW-453959-B (TW)
Title: Method of manufacturing a surface acoustic wave element
Inventor: SKLENAR PETER
IPC: B61F1/14
Filed: 2000-04-11
Granted: 2001-09-11
Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
Patent TW-463472-B (TW)
Title: Dual band receiver
Inventor: PHANG WAYNE M
IPC: H04B1/40
Filed: 2000-04-27
Granted: 2001-11-11
Abstract: A receiver (100) provides dual band features by providing two signal paths (106, 108) off an antenna (102), one for UHF operation (106) and one for VHF operation (108). The two signals paths (106, 108) feed into a single broadband input (124) of a direct conversion receiver (114). The UHF path (106) utilizes UHF front end circuitry (110) while the VHF path (108) is implemented with a loading/isolator circuit (120) and a matching circuit (122). The loading/isolator circuit (120) loads the antenna (102) and isolates UHF signals while the matching circuit (122) provides a match between the loading isolator circuit (120) an the direct conversion recover (114). Selectable matching circuitry (126, 128) and selectable VCO circuitry (132, 134) configures the direct conversion receiver for the UHF or VHF mode of operation.
Patent TW-449524-B (TW)
Title: Flux for brazing difficult to wet metallic materials
Inventor: KOCH JURGEN DR
IPC: B23K35/363
Filed: 2000-05-03
Granted: 2001-08-11
Abstract: The invention relates to a flux based on inorganic boron and/or halogen compounds for brazing difficult to wet metallic materials with silver- and copper-based solders, which is characterised in that it contains, as an activating addition, based on the total amount of the flux, 0.01-10 wt.% of elemental boron and 0.01-10 wt.% of at least one of the elements Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of elements, alloys or compounds. The activating addition brings about a substantial increase in the wettability by the solder, particularly in the case of difficult to wet parent materials.
Patent TW-I248932-B (TW)
Title: Respiratory syncytial virus replication inhibitors
Inventor: JANSSENS FRANS EDUARD
IPC: A61K31/00
Filed: 2000-06-26
Granted: 2006-02-11
Abstract: This invention concerns the use of compounds of formula, prodrugs, N-oxides, addition salts, quaternary amines, metal complexes or stereochemically isomeric forms thereof wherein -a1=a2-a3=a4- is a radical of formula -CH=CH-CH=CH-, -N=CH-CH=CH-, -CH=N-CH=CH-, -CH=CH-N=CH-, -CH=CH-CH=N- wherein each hydrogen atom may optionally be substituted; Q is a radical of formula, wherein Alk is C1-6alkanediyl; Y1 is a bivalent radical of formula -NR2- or -CH(NR2R4)-; X1 is NR4, S, S(=O), S(=O)2, O, CH2, C(=O), CH(=CH2), CH(OH), CH(CH3), CH(OCH3), CH(SCH3), CH(NR5aR5b), CH2-NR4 or NR4-CH2; X2 is a direct bond, CH2, C(=O), NR4, C1-4alkyl-NR4, NR4-C1-4alkyl; t is 2 to 5; u is 1 to 5; v is 2 or 3; and whereby each hydrogen in Alk and in (b-3), (b-4), (b-5), (b-6), (b-7) and (b-8), may optionally be replaced by R3; provided that when R3 is hydroxy or C1-6alkyloxy, then R3 can not replace a hydrogen atom in the a position relative to a nitrogen atom; G is a direct bond or C1-10alkanediyl; R1 is an optionally substituted monocyclic heterocycle; R2 is hydrogen, formyl, pyrrolidinyl, piperidinyl, homopiperidinyl, C3-7cycloalkyl or C1-10alkyl substituted with N(R6)2 and optionally with another substituent; R3 is hydrogen, hydroxy, C1-6alkyl, C1-6alkyloxy, arylC1-6alkyl or arylC1-6alkyloxy; R4 is hydrogen, C1-6alkyl or arylC1-6alkyl; R5a, R5b, R5c and R5d each independently are hydrogen or C1-6alkyl; or R5a and R5b, or R5c and R5d taken together from a bivalent radical of formula -(CH2)s- wherein s is 4 or 5; R6 is hydrogen, C1-4alkyl, formyl, hydroxyC1-6alkyl, C1-6alkylcarbonyl or C1-6alkyloxycarbonyl; aryl is optionally substituted phenyl; for the manufacture of a medicament for the treatment of viral infections, in particular RSV infections.
Patent TW-477089-B (TW)
Title: Dielectric resonator and dielectric filter
Inventor: FURUTA ATSUSHI
IPC: H01P1/213
Filed: 2000-08-21
Granted: 2002-02-21
Abstract: A dielectric resonator (10) of the present invention has three surfaces formed by chamfering three ridged portions sharing an apex of a dielectric block, in which each of the chamfered surfaces and the adjacent surfaces thereto offers an angle of 45 degrees, and an area ratio of the chamfered surfaces with respect to the adjacent surfaces, which is 45%, is mounted in a generally rectangular hollowed shielding box (21) for feeding probe (24) and (25), thereby composing a dielectric filter.
Patent TW-470689-B (TW)
Title: Apparatus and methods for recovering abrasive from an abrasive-laden fluid
Inventor: HOPKINS JORDAN J
IPC: B26F3/00
Filed: 2000-08-25
Granted: 2002-01-01
Abstract: An improved apparatus and methods for recovering abrasive from an abrasive-laden fluid are shown and described. An abrasive-laden fluid handling device is coupled to a catcher tank to collect abrasive-laden fluid and transport it to a hydro-classifier. Wet recovered abrasive is discharged from the hydro-classifier and transferred to a de-watering device. The de-watering device removes water from the abrasive by decanting fluid and via use of an air eduction system. De-watered abrasive is then ejected from the de-watering device to a dryer unit, to be further dried and processed for reuse.
Patent TW-502539-B (TW)
Title: Image encoding device
Inventor: KAGECHI KENSAKU
IPC: H04N19/85
Filed: 2000-09-15
Granted: 2002-09-11
Abstract: An image encoding device for encoding an image having a predetermined level or more of visual quality of image at a maximum compression ratio and a decoding device are disclosed. The image encoding device comprises a characteristic pixel extracting section (0309) for encoding an input image by an irreversible compression scheme capable of processing the input image in units of small segments, decoding the created coded data, and extracting a characteristic pixel by using the decoded image after the decoding and the input image, a characteristic distortion calculating section (0311) for calculating the characteristic distortion of the image created by decoding the input image by using the characteristic pixel, and an encoding parameter control section (0312) for controlling the parameter value for determining the degree of data compression according to the magnitude of the characteristic distortion. The data in the area maintaining the visual quality of image of which is at a predetermined level or higher is all compressed by an image compression method of high compression efficiency, thereby achieving a maximum compression ratio.
Patent TW-529299-B (TW)
Title: Digital to analog converter with adjustable code corresponding to the reference voltage
Inventor: LIAW MING-JIUN
IPC: H04N5/14
Filed: 2000-10-05
Granted: 2003-04-21
Abstract: The present invention relates to a digital to analog converter with adjustable code corresponding to the reference voltage, which can be applied to a nonlinear characteristic conversion in a general digital to analog converter, wherein not only the provided reference voltage is adjustable but also the code corresponding to the reference voltage can be adjusted and changed accordingly, thereby obtaining a maximum freedom to implement the function characteristic of code-voltage transfer. Furthermore, the circuit design of the digital to analog converter is simplified and not complicated.
Patent TW-508771-B (TW)
Title: Packing for a semiconductor-chip
Inventor: KAHLISCH KNUT
IPC: H01L23/13
Filed: 2001-02-06
Granted: 2002-11-01
Abstract: This invention relates to a packing for a semiconductor-chip (10), in which on the holding-plate (1) on the side of the Nubbins (8) a frame (9). Which directly surrounds the slot (5), is provided, said frame (9) has the same height as the Nubbins (8), and at least one part of both the slot (5) and the frame (9), which surrounds the slot (5), is filled with casting compound, which is preferably adaptive to the thermal expansion coefficient of the semiconductor-chip (10).
Patent TW-486876-B (TW)
Title: Digital-to-analog converter
Inventor: TODA AKIHIKO
IPC: H03M1/76
Filed: 2000-11-28
Granted: 2002-05-11
Abstract: There is provided a resistor string D/A converter that is capable of obtaining multiple bit data having an increased number of bits from data for conversion without using an increased number of resistors. The four more significant bits of data for conversion are applied to a decoder 1 while the four less significant bits of the data are applied to a decoder 3 via an inverter circuit 2. The decoder 1 decodes the four more significant bits and then turns on any one of FET's F0 to F15, based on the result of the decoding. As a result, one of voltages at respective junctions of a string of serially connected resistors r0 to rl5 is selected to be applied to an operational amplifier 6. Similarly, a voltage corresponding to the four less significant bits is applied to an operational amplifier 7. Then, an output voltage from the operational amplifier 7 is reduced to 1/16 thereof by resistors ra, rb. The reduced voltage is added to the voltage applied to the operational amplifier 6, whereby an analog voltage corresponding to data for conversion is obtained.
Patent TW-480201-B (TW)
Title: Method of welding high nitrogen containing stainless steel and welding material therefor
Inventor: OGAWA MAKOTO
IPC: B23K9/23
Filed: 2001-01-08
Granted: 2002-03-21
Abstract: On a method of welding a high nitrogen containing stainless steel using, as a base metal, a high nitrogen stainless steel containing nitrogen at or above a solubility equilibrated with N2 at 1 atm when melted, a novel welding method keeping a weld metal composition form supersaturation of N in a molten state, having a sufficient corrosion resistance in an average composition of the weld metal under sea water circumstance and capable of maintaining mechanical characteristics and corrosion resistance comparable with those of a base metal is provided, wherein welding is conducted while setting a composition of a welding material and a dilution rate to be defined latter so as to satisfy the following two relations (A) and (B): (A) %NPxD ≤ 0.028x(%CrPxD+%CrFx(1-D))+0.014(%MoPxD+%MoFx(1-D))-0.0060x(%NipxD+%NiFx(1-D))-0.26; (B) (%CrPxD+%CrF(1-D))+3x(%MoPxD+%MoFx(1-D))+8x%NPxD ≥ 38, wherein the dilution rate D is defined as a ratio of a cross sectional area of a base metal melted portion to a cross sectional area of a weld metal on every one pass of welding, the concentration of Cr, Ni, Mo and N (on the weight basis) of the base metal are difined as %CrP, %NiP, %MoP and concentrations (on the weight basis) of Cr, Ni and Mo of the weld material are defined %CrF, %NiF and %MoF.
Patent TW-472332-B (TW)
Title: Grid array package to increase the grounding plane electrical connection and the packaging method thereof
Inventor: CHANG WEN-YUAN
IPC: H01L23/498
Filed: 2001-01-12
Granted: 2002-01-11
Abstract: The present invention provides a grid array package and the packaging method thereof. This package comprises: a substrate which has an upper surface and a bottom surface; plural contact pads disposed under the substrate, which can be divided into three groups according to the way and position of arrangement: a central array of contact pads, wherein two nearest contact pads are spaced with the first distance; an outer array of contact pads, wherein two nearest contact pads are spaced with the second distance; and a middle group of contact pads, which comprises at least a ground contact pad to provide the electrical connection path of the package to ground. The relationship among these three contact pads is: the middle contact pad group is disposed between the middle array and outer array; the middle contact pad group is spaced with the middle array by the third distance; the outer contact pad group is spaced with the middle contact pad by the fourth distance; and the third and fourth distance are larger than the first and second distance.
Patent TW-484153-B (TW)
Title: Depressible device
Inventor: YOU TSUNG-MOU
IPC: H01H13/32
Filed: 2001-01-19
Granted: 2002-04-21
Abstract: The present invention relates to a depressible device comprising a main body, an actuating member and a driving member pivotally mounted to and under the actuating member. The main body has an inside surface forming a slide track comprised of a plurality of arc and intercrossing grooves. The slide groove forms upper and lower positioning points. The driving member moves along the slide track and can be located in the upper or lower positioning point to switch the driving member between the two different positioning points thereby achieving position change by means of driving forces in different directions.
Patent TW-479381-B (TW)
Title: Metal-air fuel cell batter (FCB) system for generating electrical power and method of producing electrical power therefrom
Inventor: FARIS SADEG M
IPC: H01M8/00
Filed: 1998-10-06
Granted: 2002-03-11
Abstract: In an air-metal fuel cell battery (FCB) system, wherein metal-fuel tape, the ionically-conductive medium and the cathode structures are transported at substantially the same velocity at the locus of points at which the ionically-conductive medium contacts the moving cathode structure and the moving metal-fuel tape during discharging and recharging modes of operation. In a first generalized embodiment of the present invention, the ionically-conductive medium is realized as an ionically-conductive belt, and the metal-fuel tape, ionically-conductive belt, and movable cathode structure arc transported at substantially the same velocity at locus of points which the ionically-conducing belt contacts the metal-fuel tape and the cathode structure during system operation. In a second generalized embodiment of the present invention, the ionically-conductive medium is realized as a solid-state (e.g. gel-like) film layer integrated with the metal-fuel tape, and the metal-fuel tape, ionically-conductive film layer and movable cathode structure are transported at substantially the same velocity at the locus of points which the ionically-conducing film layer contacts the metal-fuel tape and the cathode structure during system operation. In a third generalized embodiment of the present invention, the ionically-conductive medium is realized as a solid-state film layer integrated with the movable cathode structure, and the metal-fuel tape, ionically-conductive film layer and movable cathode structure are transported at substantially the same velocity at the locus of points which the ionically-conducting film layer contacts the metal-fuel tape and the cathode structure during system operation. By transporting the movable cathode structure, ionically contacting medium and metal-fuel tape within the system as described above, generation of frictional forces among such structures are minimized during system operation, and thus the damage to the cathode structure and metal-fuel tape is substantially reduced.
Patent TW-592948-B (TW)
Title: Metal foil with carrier foil and its manufacturing method
Inventor: OBATA SHINICHI
IPC: C25D1/04
Filed: 2001-02-19
Granted: 2004-06-21
Abstract: An object of the present invention is to provide a technology for preventing wrinkles on metal foils such as nickel, tin, cobalt, chromium and iron from being generated in order to facilitate their handling. The object is accomplished by using a carrier foil manufactured by bonding a carrier foil layer with a metal foil layer via an organic adhesive interface layer, wherein the metal foil layer comprises an alloy of a combination of one or more than two metals selected from nickel, tin, cobalt, chromium, lead, iron and zinc.
Patent TW-I229141-B (TW)
Title: ITO sputtering target
Inventor: OHHASHI TATEO
IPC: C23C14/08
Filed: 2001-02-22
Granted: 2005-03-11
Abstract: An ITO sputtering target, characterized in that it contains SnO2 in an amount ranging from 8.80 to 9.40 wt%. The sputtering target is a target for forming an ITO film having a reduced electrical resistance which can suppress the occurrence of microarc during sputtering and also reduce nodules being produced, and thus allows the stable sputtering operation under constant conditions over the whole life thereof.
Patent TW-526683-B (TW)
Title: Printed-wiring substrate and method for fabricating the same
Inventor: IBA MASAHIRO
IPC: H05K3/00
Filed: 2001-03-20
Granted: 2003-04-01
Abstract: A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.
Patent TW-501225-B (TW)
Title: Element with at least two adjacent isolation-layers and its production method
Inventor: LOWACK KLAUS
IPC: H01L21/768
Filed: 2001-03-27
Granted: 2002-09-01
Abstract: This invention relates to an element with two adjacent isolation-layers and its production method. The element has an activated isolation-layer, which can be converted to a conductive layer by means of metallization.
Patent TW-542989-B (TW)
Title: System and method to reduce bond program errors of integrated circuit bonders
Inventor: KODURI SREENIVASAN K
IPC: G05B19/4093
Filed: 2001-05-03
Granted: 2003-07-21
Abstract: A computerized system and method for reducing bond program errors in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit, by first collecting, on a master bonder, input data concerning bond x-y locations, alignment reference x-y locations, and alignment reference images from a master integrated circuit, then analyzing these data to construct a network of relationships between reference images and bond locations, and store data and relationships in a master file. Secondly, on a slave bonder, all this information is automatically retrieved and compared by a computer with input data concerning alignment reference images from a slave circuit. Thirdly, any discrepancy found is corrected by a computer to identify the new bond locations on the slave circuit. Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.
Patent TW-I243829-B (TW)
Title: Oligopeptides and the pharmaceutical composition containing said oligopeptides as hair-growth-enhancing agents
Inventor: OKA YUMIKO
IPC: A61K38/08
Filed: 2001-06-04
Granted: 2005-11-21
Abstract: A pharmaceutical effective component for hair-growth-enhancing agents is an effective oligopeptide represented by amino acid sequence (I): Lys-Ser-Ile-Glu-Gln-Ser-Cys-Asp-Glu-Asp-Glu, this oligopeptide with amino acids changed, or this oligopeptide modified by biotin etc., or their salts.
Patent TW-548113-B (TW)
Title: Method for joining head of golf club
Inventor: CHEN CHING-CHI
IPC: A63B53/04
Filed: 2001-06-12
Granted: 2003-08-21
Abstract: A method for joining a head of a golf club comprising the steps of: preparing a first metallic component, a second component, and a coil component, in which the shapes of the first component and the second component match each to approximately form the shape of the head of a golf club, the first and second components are made of different metallic materials, and the shape of the coil component corresponds to the outer contour of one side of the first component matching with the second component and is made of a material identical to the second component; thereafter, heating the coil component to slightly expand the coil component in order to fit over the outer edge part of the first component such that the coil component tightly restrain the first component after cooling; abutting the second component on the first component; and welding an annular join part between the second component and the coil component, thereby forming the head of a golf club.
Patent TW-502561-B (TW)
Title: Plasma treatment apparatus
Inventor: ISHII NOBUO
IPC: H01L21/205
Filed: 2001-07-11
Granted: 2002-09-11
Abstract: The present invention is provided to improve the distribution of plasma produced by a high-frequency electromagnetic field. The plasma treatment apparatus has first conducting plates 31A, constituting the radiating surface of a slot antenna 30A, slanted to first dielectric members 13 arranged in opposition to the radiating surface of the antenna 30A.
Patent TW-535361-B (TW)
Title: PLL circuit
Inventor: KAMIYA HIROSHI
IPC: H02H3/44
Filed: 2001-10-11
Granted: 2003-06-01
Abstract: A PLL circuit comprises a circuit (4, 5) which issues an alarm when fluctuation of the potential of a DC power source connected to the PLL circuit exceeds a predefined range. A first potential generation circuit (22) generates a first potential higher than a steady-state potential of the DC power source. A second potential generation circuit (24) generates a second potential lower than the steady-state potential of the DC power source. A first comparator circuit (23) compares a local maximum potential of the DC power source with the first potential. A second comparator circuit (25) compares a local minimum potential of the DC power source with the second potential. A supply circuit (26, 27, 29) supplies a drive voltage to an alarm issuer (5), in a case where the local maximum potential is higher than the first potential, and/or the local minimum potential is lower than the second potential, based on the comparison results.
Patent TW-564578-B (TW)
Title: Socket apparatus and method for removably mounting an electronic package
Inventor: IKEYA KIYOKAZU
IPC: H01R13/15
Filed: 2001-10-24
Granted: 2003-12-01
Abstract: A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).
Patent TW-500839-B (TW)
Title: System and method for growing single crystal by rotary unidirectional setting
Inventor: LAN CHUNG-WEN
IPC: C30B11/00
Filed: 2001-10-30
Granted: 2002-09-01
Abstract: The present invention provides a system for growing a single crystal by a rotary unidirectional setting, which comprises a furnace, a crucible, and a rotary support device. In the present invention, the furnace is installed vertically and comprises a high temperature part and a low temperature part. The crucible has a seed well and a growth region where a seed crystal and a raw material are separately mounted, respectively. The crucible moves relative to the furnace from the high temperature part to the low temperature part. The rotary support device supports and rotates the crucible. The tangential speed of the rotating crucible is no less than 5 π/3 cm/sec.