baber/WOPTO huggingface dataset:
Patent JP-2003239922-A (JP)
Title: Attaching structure for film like member
Inventor: HASHIZUME TORU
IPC: F16B5/12
Filed: 2002-02-15
Abstract: <P>PROBLEM TO BE SOLVED: To easily carry out attachment and detachment of a film like member to a base material by manual work or manual work using a simple tool without requiring a special facility or jig, and also to present a clean rim without additionally using a frame or the like for decoration.  <P>SOLUTION: The film like member 2 is attached to the base material 1 and it is supported with tension by providing an elastically deformable resin cord 6 on a circumferential rim of the film like member 2, forming a groove 5 for fitting the resin cord 6 on the base material 1, fitting the resin cord 6 of the circumferential rim of the film like member 2 in the groove 5 of the base material 1, applying tension to the film like member 2 and fixing a circumferential rim part to the base material 1. The groove 5 is preferably provided in a physical relationship forming a folded back area 9 wrapping a rim 4a of the base material 1 by the circumferential rim of the film like member 2 when the resin cord 6 of the circumferential rim of the film like member 2 is fitted in the groove 5 of the base material 1.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003154415-A (JP)
Title: Metal member forming method, metal member, and metal member forming device
Inventor: WATANABE HARUO
IPC: B21D26/041
Filed: 2002-02-20
Abstract: PROBLEM TO BE SOLVED: To provide a metal member forming method, a metal member, and a metal member forming device for achieving the forming property and higher strength of the metal member. SOLUTION: The cylindrical metal member 1 having a hollow chamber 10 and a forming die 3 having a forming die face 31 are used. The metal member 1 is heated to a quench-strengthening temperature zone (e.g. A1 transformation temperature or above). By increasing the internal pressure of the gas in the hollow chamber 10 of the heated metal member 1, a wall 1a of the metal member 1 is swollen (plastically deformed), and the swollen wall 1a of the metal member 1 is brought into close contact with the forming die face 31 of the forming die 3 to perform the forming and the quench-strengthening. The wall 1a of the metal member 1 is hardened, and the strength of the metal member 1 is increased thereby.
Patent JP-2003243456-A (JP)
Title: Tape carrier for semiconductor device and method of manufacturing the same
Inventor: SATO MANABU
IPC: H01L21/60
Filed: 2002-02-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device in which the number of wires disposed between lands can be increased without making a wiring process complicated.  <P>SOLUTION: Copper plating 4 is applied in a VIA hole 3 such that an insulation film 1 and a land 2a are connected by the copper plating 4, thus improving bonding strength between the insulation film 1 and the land 2. The width of the land 2a is reduced by the amount of the improvement of bonding strength, thus widening the area between the lands 2a where wiring is carried out.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003249364-A (JP)
Title: Organic electroluminescent image display device and its manufacturing method
Inventor: KUBOTA HIROSHI
IPC: H01L51/50
Filed: 2002-02-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organic electroluminescent image display device with a transparent electrode layer free from breaking and an organic electroluminescence cell layer for developing stable luminescence leading to high quality image display, and its manufacturing method enabling simple manufacturing of the device.  <P>SOLUTION: The organic electroluminescent image display device comprises a color filter layer, a color change fluorescent material layer, a transparent protecting layer, the transparent electrode layer, the organic electroluminescence cell layer, and a back electrode layer provided in sequence on a transparent substrate. The color change fluorescent material layer has a plurality of band patterns arranged in parallel and each band pattern has an end formed as a protruded portion protruded in the longitudinal direction of the pattern. The transparent protecting layer is provided on the transparent substrate to cover the protruded portions and the color change fluorescent material layer. The transparent electrode layer is arranged on the transparent protecting layer in such a band form that it rides over a range from the transparent substrate to the color change fluorescent material layer where the protruded portions are formed.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003250073-A (JP)
Title: Electronic camera and mobile terminal
Inventor: ISHIYAMA EIJI
IPC: H04N5/225
Filed: 2002-02-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic camera and a mobile terminal whereby an image is easily registered for wall paper of a display means of the mobile terminal by applying image conversion to a picked-up image in response to display capability of the mobile terminal and transmitting the resulting image to the mobile terminal.  <P>SOLUTION: The electronic camera is provided with: an imaging means 150 for imaging an object image to acquire an image; a reception means (transmission/reception means 157) for receiving the number of display pixels and as required the number of displayed colors or the like of the mobile terminal 40; a display means 168 for displaying the imaged image and a frame lie on the basis of the number of display pixels of the received image; an image conversion means (an information processing means 180 or a signal processing means 170) for executing image conversion such as the number of pixels and as required conversion of the number of displayed colors of the image acquired by the imaging means 150 so as to be adaptive to the received display information; and a transmission means (a transmission/reception means 157) for transmitting the converted image to the mobile terminal 40.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003249189-A (JP)
Title: Ion implantation method
Inventor: MIKAMI HITOSHI
IPC: H01L21/265
Filed: 2002-02-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ion implantation method which blocks ion implantation in a state without satisfying a required condition for other parts of a semiconductor substrate in the ion implantation into the semiconductor substrate.  <P>SOLUTION: A shield with an aperture in slit shape is placed before a front surface of a semiconductor substrate to be ion implanted. If a distance from an ion beam deflection position to a slit is set to L, a width of the slit is made 0.017 L or less. The semiconductor substrate to be ion implanted is sequentially moved in parallel in horizontal direction at the ion implantation or after the ion implantation. This realizes sequential ion implantation into parts being blocked from the ion implantation by the shield.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003250663-A (JP)
Title: Multipurpose bed
Inventor: NISHIMOTO NORIKO
IPC: A47C17/42
Filed: 2002-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multipurpose bed enabling work to be always performed properly and adeptly without being restricted by direction of work.  <P>SOLUTION: A bed body 11 is turnably supported on a base 12 through a support shaft 13. A recessed part 14 is provided in a corner part on either of right and left sides of the bed body 11, and an axial line 13a of the support shaft 13 is set along the longitudinal direction of the bed body 11. The recessed parts 14 are formed in both end parts in the longitudinal direction of the bed body 11. The support shaft 13 is arranged and constituted on a rear surface of the bed body 11 close to the recessed part 14. A spring means 29 for energizing the bed body 11 onto a storage position side and a damper device 32 for buffering turn operation of the bed body 11 are provided. A space for allowing a caretaker to stand is ensured by the recessed part 14 so that he/she can perform work from any side of the right and left sides for the multipurpose bed.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2002326952-A (JP)
Title: Fungus infection treating agent containing new compound f-15078
Inventor: INUKAI MASATOSHI
IPC: A61K38/00
Filed: 2002-02-28
Abstract: PROBLEM TO BE SOLVED: To provide a fungus infection treating agent containing a new compound as an active ingredient. SOLUTION: A medicine containing a compound expressed by the formula (I) or its salt as an active ingredient.
Patent JP-2003258743-A (JP)
Title: Communication system
Inventor: YAMADA HIDEJI
IPC: H04W24/04
Filed: 2002-02-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a communication system in which a time for maintenance or test can be shortened by improving efficiency in the maintenance or the evaluation test in the communication system provided with a communication control unit, a base station device, a terminal device and attached devices.  <P>SOLUTION: The communication control unit is provided with a control means for switching the active and standby base station devices when a switching request command is received from any one of the terminal devices and the attached devices, and the active and standby devices can be switched from the terminal device or the attached device. Besides, the communication control unit is provided with a control means for stopping the prescribed base station device when a stop command is received from the terminal device or the like, and the prescribed base station device is stopped and started from the terminal device to perform a line test.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003258142-A (JP)
Title: Semiconductor device
Inventor: KIKUCHI HIROSHI
IPC: H01L23/12
Filed: 2002-02-28
Abstract: <P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor device.  <P>SOLUTION: There are provided a package substrate 4 having a microstrip line 4g, composed of a signal surface layer wiring 4c and a GND layer 4f, a high-frequency semiconductor chip 2 mounted on a principal surface 4a of the package 4 via flip-chip connection, a coaxial cable 7 having a core wire 7a electrically connected to a signal surface layer wiring 4c, and underfilled resin 6 for protecting the flip-chip connection portion of the semiconductor chip 2, a plurality of ball electrodes 3 each being disposed in a back surface 4b of the package substrate 4, and a coaxial connector 11 provided on a frame member 8 mounted on the package substrate 4. A high-frequency signal from the coaxial cable 7 can be transmitted to the entire surface layer of the package substrate 4. The package is miniaturized, by arranging all of the plurality of the ball electrodes 3 in an array configuration, on the back surface 4b of the package substrate 4.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003257102-A (JP)
Title: Cassette loading device and information recording and reproducing apparatus
Inventor: SUZUKI KAZUYOSHI
IPC: G11B15/675
Filed: 2002-03-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cassette loading device and an information recording and reproducing apparatus advantageous to miniaturization without damaging the case of a tape cassette.  <P>SOLUTION: In the state where a tape cassette housing part 16 is positioned at a recording/reproduction position from a tape cassette standby position, a second cover plate opening/holding mechanism 24 abuts on the lower part of a first cover plate 204 of a tape cassette 2 which is opened. Thereby, the first and second cover plates 204 and 206 are moved further in an opening direction, and are maintained in a full open state.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003258177-A (JP)
Title: Method of manufacturing semiconductor device, and semiconductor device
Inventor: SATO TAKASHI
IPC: H01L23/48
Filed: 2002-03-04
Abstract: <P>PROBLEM TO BE SOLVED: To make the package size of a semiconductor device small.  <P>SOLUTION: The rear electrode of a pellet 2, where a diode element is disposed inside, a bump electrode 4 which is electrically connected to the anode side of the diode element is arranged on the main face and the rear electrode, which is electrically connected to the cathode side of the diode element is formed on a rear face, is bonded to the recessed part of a frame 1 whose cross section is made into an uneven shape. The pallet 2 and the frame 1 are sealed by a sealing material 3 and the frame 1 and the sealing material 3 are cut along a cutting region. Thus, the semiconductor device is manufactured.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003259101-A (JP)
Title: Facsimile communication method and facsimile apparatus
Inventor: MORITA YOSHIO
IPC: H04N1/32
Filed: 2002-03-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a facsimile communication method and a facsimile apparatus which charge a transmission side of polling transmission for communication when a polling reception is requested.  <P>SOLUTION: A facsimile apparatus B when receiving CIG and DTC signals sent from a facsimile apparatus A and confirming the request for polling reception sends a DCN signal to disconnect a line and then dials the telephone number of the facsimile apparatus A recognized with the CIG to establish communication with the facsimile apparatus A. Then image data of a document that the facsimile apparatus A requests are transmitted.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003258984-A (JP)
Title: Call controller, method for controlling call, and call control program
Inventor: ABE MITSUNOBU
IPC: H04W88/02
Filed: 2002-03-05
Abstract: <P>PROBLEM TO BE SOLVED: To execute communication control matching a communication state, including the start of a service offer for a communicating party by executing a recall restriction release process meeting the communication state, including the start of the service offer for the communicating party.  <P>SOLUTION: A regulation comparing section 6 of a cellular telephone 1 detects a fact that a dialing destination party supports no requested service. A call regulation control section 4 stores the telephone number of the party and the service on a call regulation storage section 5 to regulate the calling of the telephone number and the service registered on the call regulation storage section 5. Consequently, no calling process is done. When a regulation release comparing section 10 detects a fact that the telephone number and the service stored on the call regulation storage means 5 are terminated, a call regulation release control section 9 releases the call regulation state.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003251485-A (JP)
Title: Laser beam machining method and device
Inventor: MURASE EIJU
IPC: B23K26/10
Filed: 2002-03-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and device having the ability to machine only the thin film of the upper layer among laminated thin films selectively into a desired shape by laser beam machining.  <P>SOLUTION: In this method, a laser beam is emitted in a prescribed pattern to a second thin film 20 of a workpiece 210 having a first thin film 15 and the second thin film 20 which is laminated on the surface of the first thin film 15 and formed with a material different from that of the first. With the workpiece 210 cooled on a cooled stage 208, a laser beam is emitted to the second thin film 20, only the second thin film 20 is machined in a specific shape.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2002355301-A (JP)
Title: Photocatalyst unit and air conditioner loaded therewith
Inventor: WATASE TOMOAKI
IPC: F24F1/00
Filed: 2002-03-05
Abstract: PROBLEM TO BE SOLVED: To provide a photocatalyst unit having good institution properties and maintenance properties. SOLUTION: In the photocatalyst unit consisting of at least a photocatalyst element, a lamp for supplying light to the photocatalyst element and a housing for holding the photocatalyst element and the lamp, a structure capable of disassembling the photocatalyst unit into the photocatalyst part and the lamp part is used or a relay connector is provided to a lamp electric wire part to enhance the maintenance properties of the photocatalyst unit. further, power input parts are provided to the photocatalyst unit at two or more places or a feed plug is attached to the photocatalyst unit to enhance the institution properties of the photocatalyst unit.
Patent JP-2003262826-A (JP)
Title: Three-dimensional display using light emitting diode
Inventor: YAMAMOTO HIROTSUGU
IPC: G03B35/00
Filed: 2002-03-07
Abstract: <P>PROBLEM TO BE SOLVED: To perform a three-dimensional display without using looking glasses by making a depth shallow.  <P>SOLUTION: In a three-dimensional display, a lenticular lens 3 is disposed in parallel to an LED flat display 1 on the front face of the LED flat display 1 on which a lot of RGB light emitting diodes are arranged in a plane. Further, in the three-dimensional display, an auxiliary lenticular lens 4 which focuses an image by decreasing the picture element pitch of the LED flat display 1 is disposed between the lenticular lens 3 and the LED flat display 1, and an image focused by the auxiliary lenticular lens 4 is again focused by the lenticular lens 3 on the eye position of an observer.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003260556-A (JP)
Title: Member for light alloy injection molding machine
Inventor: HIRAKAWA SHIGERU
IPC: C23C12/00
Filed: 2002-03-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a member for a light alloy injection molding machine excellent in wear resistance, gnawing resistance, melting loss resistance and heat resistance, and also reduced in production costs.  <P>SOLUTION: The member for a light alloy injection molding machine is used by the injection molding machine for injection molding molten light alloy, wherein the base material comprises iron group alloy steel and a cured film is formed at a part where the base material comes in contact with a molten metal. The member is specialized in that the cured film comprising at least one of a nitrided layer, a sulfonitrided layer and a nitrided chrome layer, and/or a combination of at least two or more of these layers are formed at the part where the base material comes in contact with the molten metal.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003264211-A (JP)
Title: Carrier mounting device
Inventor: OZAWA GIICHI
IPC: H01L21/68
Filed: 2002-03-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a carrier mounting device that can handle both of a 200 mm wafer carrier and a 300 mm wafer carrier easily without using a special member such as an attachment or the like and without using a special carrier.  <P>SOLUTION: The carrier mounting device 1 is provided with a carrier holding means 6 holding a carrier 4 storing a semiconductor wafer on a mounting part 3. The holding means 6 is provided with an engaging part 61 engaged with a hook 42 formed on the bottom of the center of the carrier 4. The engaging part is composed so as to be projected or retracted from the flat mounting face 31 of the mounting part depending on the case. In a carrier whose bottom is flat, the engaging part is retracted downward from the mounting face and stored, and the mounting face is used having a flat surface.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003272977-A (JP)
Title: Dismantling jig of member and of electrolytic capacitor
Inventor: NAKAMURA HIDEKAZU
IPC: H01G13/00
Filed: 2002-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To cut and open a dismantling member from inside to outside in a radiation form and to prevent generation of dust, noises, and the like.  <P>SOLUTION: A jig 100 for dismantling an electrolytic capacitor 50 includes a vise 10 for fixing the electrolytic capacitor 50 at a prescribed position, a cutter 30 for dismantling the electrolytic capacitor 50 positioned by the vise 10, and an air cylinder 23 for propelling the top of the cutter 30 to a prescribed part of the positioned electrolytic capacitor 50. The cutter 30 has a sharp top with a radiating shape from the top to the other part. Then, the outer container of the electrolytic capacitor 50 can be cut and opened from inside to outside, and an electrode can be taken out from the inside of the outer container easily.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003270458-A (JP)
Title: Photonic crystal member and photonic crystal waveguide
Inventor: TOMARU TATSUYA
IPC: G02B1/113
Filed: 2002-03-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technology for reducing input/output loss of a photonic crystal.  <P>SOLUTION: An antireflection layer composed of the photonic crystal is arranged at input and output parts of the photonic crystal. A photonic crystal 100 having an effective refractive index n<SB>1</SB>which satisfies the relation n<SB>1</SB><n<SB>2</SB>is arranged at the input part of a photonic crystal 200 having an effective refractive index n<SB>2</SB>, and a total reflection loss at the input part is decreased by controlling the thickness of the photonic crystal 100 so that the components reflected from boundary faces 210 and 110 are cancelled by an interference. The output part is composed in the same way.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003273278-A (JP)
Title: Package type semiconductor device
Inventor: KAMI SHINJI
IPC: H01L25/16
Filed: 2002-03-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a package type semiconductor device having excellent heat sink characteristics without impairing electrical characteristics in a high frequency, efficient package design at mounting or the like and a low manufacturing cost.  <P>SOLUTION: The package type semiconductor device comprises a deformable insulating flexible film 1, first and second conductor layers 2, 3 formed on both surfaces of the film 1 for constituting a wiring pattern, an LSI 4 mounted on the layer 1, a conductor for connecting the pattern formed on the film 1 formed in a hole 9 formed in the film to a wiring pattern formed on the layer 2, a stiffener 6, and a heat spreader 7. Part of the patterns formed of the layers 2, 3 is wiring for a high speed signal and of which the characteristic impedance is calculated, and a connector to the board 20 is formed at the end of the wiring.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003274090-A (JP)
Title: Image forming apparatus
Inventor: SAWADA MASAICHI
IPC: B41J29/38
Filed: 2002-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus for allowing a maintenance personnel to easily locate a cause to a fault with low reproducibility and accurately repair the fault when the maintenance personnel maintains the image forming apparatus on the occurrence of the fault.  <P>SOLUTION: The image forming apparatus 10 is provided with: an operation management means 108 for managing an operation of the image forming apparatus 10 at its execution; a first operating information storage means 106c for storing operating information with respect to the operation managed by the operation management means 108 in time series; and an external output means 109 for referencing the result of storage stored in the first operating information storage means 106c to output externally the operating information in response to the result of storage.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2003280453-A (JP)
Title: Image forming apparatus
Inventor: NAKAYAMA TOSHINORI
IPC: G03G15/20
Filed: 2002-03-22
Abstract: <P>PROBLEM TO BE SOLVED: To make one's own file easy to find from a pile of files on a paper ejecting tray which is outputted by a plurality of users, furthermore, to facilititate document management of outputted files.  <P>SOLUTION: A user can put an arbitrary color on a back cover or a front cover of the outputted file. The file is entered into a fixing device so that a colored end is the back-end.  <P>COPYRIGHT: (C)2004,JPO