baber/WOPTO huggingface dataset:
Patent JP-2011147507-A (JP)
Title: Folding table and bed device
Inventor: KATO ATSUSHI
IPC: A47B23/02
Filed: 2010-01-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an over table set to a bed device, such as a folding table, which matches with a plurality of standards of beds, has large space for things and is more convenient.  <P>SOLUTION: The folding table has side plates 5 and 7 prepared in both sides of a central plate 3 and connected with connection parts 10 so that they can fold towards the underside of the central plate 3, is put over and locked between both side fences of the bed and arranged so that it can cross over the bed mattress. Locking grooves 50 for locking and supporting on both the side fences of the bed are formed in the ends of the side plates 5 and 7 and the locking grooves are characterized by being formed in a longitudinal direction.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011147994-A (JP)
Title: Method for drawing brass-plated steel wire
Inventor: OSANAI KEITA
IPC: C10M137/04
Filed: 2010-01-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of drawing a brass-plated steel wire, in which degradation of lubricity when drawing the brass-plated steel wire and degradation of ductility of the brass-plated steel wire after the drawing are suppressed without impairing rustproofness of the brass-plated steel wire.  <P>SOLUTION: The method for drawing the brass-plated steel wire includes a drawing step of drawing the brass-plated steel wire by using aqueous lubricant. The aqueous lubricant contains no rust-inhibitor, and the rustproofing treatment is performed after the drawing step. The rustproofing treatment is preferably performed so that the surface treatment is applied with acid aqueous solution, and then, by using aqueous solution containing triazole compound. Further, the surface treatment through the super-critical treatment is also preferable, in which the triazole compound is mixed in the solvent for super-critical treatment.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011152234-A (JP)
Title: Chlorine dioxide gas generator
Inventor: SHIBUYA KOJI
IPC: B01J7/00
Filed: 2010-01-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a chlorine dioxide gas generator capable of reducing uncomfortable odor generated from a chlorine dioxide gas generating agent without impairing the sterilization and deodorizing effects of the chlorine dioxide gas by the effect of an aromatic substance.  <P>SOLUTION: The chlorine dioxide gas generating agent and the aromatic substance are stored in a container with an opening, and the chlorine dioxide gas generating agent and the aromatic substance are separate from each other. An aromatic component of the aromatic substance reduces the uncomfortable odor of the gas generated from the chlorine dioxide gas generating agent, but does not reduce the concentration of the chlorine dioxide in the gas phase. The fragrance component of the aromatic substance is selected from at least one of groups of mint-flavored compositions, grapefruit-flavored compositions and lavender-flavored compositions.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011152691-A (JP)
Title: Water repellent release film for manufacturing flexible flat cable (ffc)
Inventor: MATSUI SHIGEKI
IPC: H01B13/00
Filed: 2010-01-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a water repellent release film for manufacturing flexible flat cable (FFC), which has a water repellent continuous vapor deposition film of an organic silicon oxide containing an organic component.  <P>SOLUTION: Disclosed is the water repellent release film for manufacturing the flexible flat cable (FFC), obtained by forming a carbon-containing silicon compound on a plastic base material by a plasma chemical vapor growth method (PE-CVD method), wherein as a release layer, the organic silicon compound containing Si-O bond in a molecular is used as the vapor deposition material and the continuous vapor deposition film of the organic silicon oxide is formed so as to contain an organic component on the plastic base material, and the water repellency based on the organic component in the organic silicon compound is developed to give the releasing property.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011087903-A (JP)
Title: Hitting rod for buddhist ringing bowl
Inventor: KOIZUMI TOSHIHIRO
IPC: A47G33/00
Filed: 2010-01-27
Abstract: <P>PROBLEM TO BE SOLVED: To solve problems seen in a conventional hitting rod for Buddhist ritual use, such as the ill-balanced weight sitting position due to its limited design structure consisting of a grasping part on one end and a hitting part on the other, leading to the difficulty of staying down in a stable manner on a ringing bowl seat mat or a ringing bowl rest with its rod body horizontally laid especially in the case of a stand-type hitting rod which is extremely ill-balanced in weight, and a lack of hitting variations other than a simple, run-of-the-mill hitting method.  <P>SOLUTION: The hitting rod has a hitting portion at each end of a hitting rod body. At least one of the hitting portions of both ends is provided with a stand portion for stable upright standing, so that it can be stood up, saving on space, as a stand-type hitting rod. If given the stand portions at both ends, it can be stably erected upright with either side down.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011155209-A (JP)
Title: Method of manufacturing semiconductor chip with adhesive, and method of manufacturing semiconductor device
Inventor: KAWAMORI TAKASHI
IPC: H01L21/52
Filed: 2010-01-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip an adhesive protrusion of which is sufficiently reduced, and to provide a method of manufacturing a semiconductor device using the same.  <P>SOLUTION: The method of manufacturing the semiconductor chips with the adhesives includes steps of: preparing a laminate having a dicing tape, a positive photosensitive adhesive layer made of a positive photosensitive adhesive composition, and a semiconductor wafer laminated in this order; cutting the semiconductor wafer with a dicing blade from the side of the semiconductor wafer of the laminate to cut the semiconductor wafer into a plurality of semiconductor chips; irradiating the positive photosensitive adhesive layer with an energy beam from the side of the plurality of semiconductor chips, and then bringing a developer into contact with the positive photosensitive adhesive layer to pattern the positive photosensitive adhesive layer; and peeling the patterned photosensitive adhesive layer from the dicing tape to obtain the semiconductor chips with adhesives.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010287212-A (JP)
Title: Architecture connected directly from optional controller to optional controller by n-ways
Inventor: DEKONING RODNEY A
IPC: G06F13/10
Filed: 2010-01-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a storage PLT system and a storage PLT architecture.  <P>SOLUTION: Array controllers 110-113 includes respectively at least 2M-pieces of ports 115, 116, 117, 118 in a storage system architecture, where M is three or more of integer corresponding to the number of SAS areas or JBOD units in the system. The serial attached SCSI (SAS) areas or JBOD units 120-122 include respectively at least 2N-pieces of ports, where N corresponds to the number of the array controllers in the system. At least two of the 2N-pieces of the respective ports are directly connected to at least respective corresponding two of the 2M-pieces of respective ports of the N-pieces of the array controllers, and direct redundant connection is thereby established between each one of the N array controllers and each one of the M-pieces of the SAS areas or JBOD units.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010220200-A (JP)
Title: Conduction switching circuit, conduction switching circuit block, and operation method for conduction switching circuit
Inventor: OKASHITA TOMONORI
IPC: H03K17/693
Filed: 2010-01-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a conduction switching circuit, the operation method of the conduction switching circuit and a conduction switching circuit block for preventing the leakage of a high frequency signal without generating any insertion loss due to reactance.  <P>SOLUTION: A conduction switching circuit includes: a first MOSFET; a second MOSFET connected to the first MOSFET via a first node; and a first control terminal connected to the first node. The first MOSFET and the second MOSFET are provided so as to be electrically connected through the first node in series at ON state. The first control terminal is configured to apply a voltage to the first node so that capacitance of the first MOSFET and the second MOSFET is decreased when the first MOSFET and the second MOSFET are OFF state.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011160544-A (JP)
Title: Ultrasonic motor
Inventor: MATSUI AKIRA
IPC: H02N2/00
Filed: 2010-01-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultrasonic motor that has a simple structure and facilitates assembly.  <P>SOLUTION: The ultrasonic motor includes a vibrator 40 in which a cross section vertical to a central axis has a rectangular shape and elliptic vibration is generated by simultaneously exciting a longitudinal vibration resulting from expansion and contraction in the direction of the central axis and a torsional vibration resulting from the central axis as a twisting axis, wherein a length ratio between a short side T and a long side W forming the rectangular shape is set at a value at which a resonant frequency of the longitudinal vibration and a resonant frequency of the torsional vibration which are excited by the vibrator may substantially match. The vibrator 40 includes a first polarization unit 101L formed in a region corresponding to a node of the longitudinal vibration to excite a longitudinal vibration in the vibrator, and second polarization units 101A1, 101A2, 101A3, 101A4 and 101B1, 101B2, 101B3, 101B4 which are formed in regions corresponding to a ventral part of the torsional vibration and exciting the torsional vibration in the vibrator.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011156740-A (JP)
Title: Water-based image quality improvement liquid and method of manufacturing the same
Inventor: FUJIOKA MASAYA
IPC: B41J2/01
Filed: 2010-01-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a water-based image quality improvement liquid capable of improving an image quality without causing nozzle clogging and used in a thermal ink jet method, and a method of manufacturing the water-based image quality improvement liquid.  <P>SOLUTION: The water-based image quality improvement liquid is used for the thermal ink jet method and contains polyvalent metal ions and water, and a dissolved carbon dioxide concentration is 4 mg/L or lower. The method of manufacturing the water-based image quality improvement liquid includes a process of reducing the dissolved carbon dioxide concentration by at least one of heating treatment and deaeration treatment.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011158794-A (JP)
Title: Image display device and program
Inventor: KATAGAI SATOSHI
IPC: H04N5/93
Filed: 2010-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To selectively display different types of frames on the outer periphery of an image without requiring a user to perform troublesome work.  <P>SOLUTION: This image display device includes a photographing section 40 for acquiring a photographed image for photographing the periphery, an environmental determining section 11 for determining which of a plurality of predetermined use environments the present use environment corresponds to according to the contents about a subject of the photographed image, a frame setting section 13 for setting, as a using object, the frame image of the type matched with the use environment determined by the environmental determining section 11, and a display control section 14 for displaying, on the screen, the frame image of the type set as the using object and an ornamental image in the state where the frame image is arranged around the ornamental image. The frame image of the type corresponding to the present use environment is displayed automatically.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011158853-A (JP)
Title: Administration control apparatus and administration control method, for variable dispersion compensator
Inventor: OTSUKA HIROSHI
IPC: G02B26/00
Filed: 2010-02-04
Abstract: <P>PROBLEM TO BE SOLVED: To determine the service life of a virtual imaged phased array (VIPA) dispersion compensator, with respect to an administration control apparatus, and to provide an administration control method for a variable wavelength dispersion compensator, in a wavelength division multiplex system.  <P>SOLUTION: The present invention relates to the administration control apparatus and the administration control method for the VIPA type wavelength dispersion compensator 101 for compensating the wavelength dispersion of an optical signal, and the administration control apparatus includes: a means by which a three-dimensional mirror of the wavelength dispersion compensator 101 is moved and controlled, according to the determined result of the quality of the signal which is received and processed by performing a wavelength dispersion compensation of the optical signal with the wavelength dispersion compensator 101, and any one of or both of the moving distance and the moving speed of the three-dimensional mirror are calculated and stored in a memory 105, or the like; and a means, such as a durability administration part 14 which determines the durability of possible stable control of the moving and controlling structure of a three-dimensional mirror, on the basis of the accumulated value of the moving distance or the moving speed of the three-dimensional mirror and a comparing reference value. Any one of or both the moving distance and the moving speed are compared with the comparing reference value, and the possibility of stable control is determined.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010111952-A (JP)
Title: Hard film and method for forming the same
Inventor: YAMAMOTO KENJI
IPC: C23C14/06
Filed: 2010-02-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hard film which has oxidation resistance more excellent than that of a TiAlN film and a TiCrAlN film as the conventional hard films, and also has high hardness, and to provide a method for forming the same.  <P>SOLUTION: There is disclosed the hard film expressed by (1) [(Ti, Cr, V)<SB>a</SB>(Nb, Ta)<SB>b</SB>(Al, Si, B)<SB>c</SB>](C<SB>1-x</SB>N<SB>x</SB>), wherein, a+b+c=1, a<SB>Ti</SB>+a<SB>Cr</SB>+a<SB>V</SB>=a, b<SB>Nb</SB>+b<SB>Ta</SB>=b, c<SB>Al</SB>+c<SB>Si</SB>+c<SB>B</SB>=c, 0.05≤b, 0.5≤c≤0.73, 0≤c<SB>Si</SB>+c<SB>B</SB>≤0.15, a<SB>Ti</SB>>0, a<SB>Cr</SB>+a<SB>V</SB>+c<SB>Si</SB>+c<SB>B</SB>>0 and 0.4≤x≤1.0 are satisfied (in the equation, a<SB>Ti</SB>denotes the atomic ratio of Ti; a<SB>Cr</SB>denotes the atomic ratio of Cr; a<SB>V</SB>denotes the atomic ratio of V; b<SB>Nb</SB>denotes the atomic ratio of Nb; b<SB>Ta</SB>denotes the atomic ratio of Ta; c<SB>Al</SB>denotes the atomic ratio of Al; c<SB>Si</SB>denotes the atomic ratio of Si; c<SB>B</SB>denotes the atomic ratio of B; and x denotes the atomic ratio of N).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011165743-A (JP)
Title: Method of manufacturing semiconductor-device
Inventor: TERASAKI TADASHI
IPC: H01L21/8247
Filed: 2010-02-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor-device that achieves a charge-trap flash memory capable of executing high-speed processing and having high charge-retention characteristics.  <P>SOLUTION: The method of manufacturing semiconductor-device has: a silicon-oxide-film forming step for forming a silicon oxide film 140 by oxidizing the surface of a substrate 100; a nitride layer forming step for forming a nitride layer 141, whose nitrogen peak concentration is ≥20 atom% and ≤60 atom%, near the surface of the silicon oxide film 140 by supplying a nitrogen-containing gas in a plasma state to the silicon oxide film 140; a charge-retention-film forming step for forming a charge-retention film 150 on the silicon oxide film 140 formed with the nitride layer 141; and an electrode-film forming step for forming an insulating film 160 and an electrode film 170 on the charge-retention film 150.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011163930-A (JP)
Title: Position calibration method of underwater vessel
Inventor: SUDO HIROSHI
IPC: G01S5/28
Filed: 2010-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To improve the acoustic positioning accuracy by reducing the number of acoustic positionings required for calibration of inertial navigation position and energy consumption of an underwater vessel.  <P>SOLUTION: The underwater vessel 6 is stopped without relative position variation with respect to the seabed 21 by fixed point holding or arriving at the bottom. In this state, the acoustic positioning from a support ship 7 side is performed a plurality of times, the average of the latitude direction of measurement results and the average of the longitude direction of the measurement results are determined, and an acoustic positioning position having statistically correct latitude and longitude of the underwater vessel 6. Positioning based on inertial navigation by the underwater vessel 6 itself is performed, the latitude and longitude are compared with the latitude and longitude of the acoustic positioning position, the deviation between the latitude direction and the longitude direction is determined, and the data of latitude and longitude based on the inertial navigation by the underwater vehicle 6 self is calibrated by the determined deviation between the latitude direction and the longitude direction. The acoustic positioning accuracy is improved by holding the support ship 7 near the vertical line of the underwater vessel 6 stopped near the seabed during the acoustic positioning.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011166027-A (JP)
Title: Substrate processing method
Inventor: NIWA TAKAFUMI
IPC: H01L21/027
Filed: 2010-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a substrate processing method reducing variations in line widths of first and second resist patterns between substrates and in a substrate surface when forming minute resist patterns by double patterning.  <P>SOLUTION: The substrate processing method includes: first processing processes S13-S16 of exposing a substrate formed with a first resist film and forming a first resist pattern by a heating process and a development process; and second processing processes S17-S20 of forming a second resist film on the substrate formed with the first resist pattern, exposing the substrate formed with the second resist film, and forming a second resist pattern by the heating process and development process. A first processing condition of first processing processes S22-S25 is corrected based on a measurement value of the line width of the second resist pattern formed on one substrate, and a second processing condition of second processing processes S26-S29 is corrected based on a measurement value of the line width of the first resist pattern formed on one substrate.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011167854-A (JP)
Title: Liquid ejection head and liquid ejection apparatus
Inventor: KOBAYASHI YUTAKA
IPC: B41J2/045
Filed: 2010-02-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid ejection head which has no variation in liquid ejection characteristic within a nozzle array, and to provide a liquid ejection apparatus whereby a predetermined amount of liquid is ejected.  <P>SOLUTION: A first opening area S1 is larger than a second opening area S2, and therefore the flow rate of a first ink introducing port 231 becomes larger than the flow rate of a second ink introducing port 232. The pressure by ink introduction from the first ink introducing port 231 in a region on the opposite side in a gravity direction which is influenced small by head pressure P and low in pressure can be made larger than the pressure by ink introduction from the second ink introducing port 232 in a region in the gravity direction which is influenced large by the head pressure P and high in pressure, so that a difference of pressure applied to ink supply ports 223 can be made small. An ink-jet recording head 200 which can make a difference of pressure in pressure chambers 221 small, can make a difference in ink ejection characteristic between nozzle openings 211 small, and has a small variation in an ejection amount of ink when changing pressure in the pressure chambers 221 to eject the ink from the nozzle openings 211 can be obtained accordingly.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011171380-A (JP)
Title: Photoelectric conversion element
Inventor: YOSHIKAWA SUSUMU
IPC: H01L51/42
Filed: 2010-02-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion element which has high conversion efficiency and superior thermal stability.  <P>SOLUTION: The photoelectric conversion element has a photoelectric conversion layer E containing a conductive polymer compound (A) and an electron accepting compound (B), between two electrodes Y formed on a substrate T, and the conductive polymer compound (A) has a structural unit (a) represented by formula (1) in a molecule. Here, R<SP>1</SP>represents a single bond having no atom or a bivalent hydrocarbon group having the carbon number of 1 to 16, R<SP>2</SP>is a hydrogen atom, a hydroxyl group, a cyano group, a phosphono group, a sulfo group, or a halogen atom, X is an oxygen atom, a sulfur atom, a selenium atom, an imino group, or a silanediyl group, Fu is one kind of fullerene, * represents that two bonds each attached with * are bonded to other structural units constituting the (A), and when there are a plurality of 'R<SP>1</SP>'s, 'R<SP>2</SP>'s, 'Fu's or 'X's in one molecule, they may be identical or different.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011170671-A (JP)
Title: Information processing system, file storage device, control method of file storage device, and program
Inventor: SHINODA MASASHI
IPC: G06F13/00
Filed: 2010-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To prevent a careless mistake in file transmission, and to reduce a work man-hour of a user.  <P>SOLUTION: A communication system includes a file storage device that stores a transmitted file in a predetermined storage area, and an information processing device that transmits a file to be stored to the file storage device. The information processing device makes a request to the file storage device for a unique name in the storage area. The file storage device generates a storage file name which corresponds to the unique name in the storage area in response to a request from the information processing device, and transmits the generated storage file name to the information processing device. The information processing device receives the file storage name from the file storage device, compresses the file to be stored to generate a compressed file, gives the received storage file name to the compressed file, and transmits the file to the file storage device. The file storage device then receives the compressed file from the information processing device, and stores the compressed file in the storage area.  <P>COPYRIGHT: (C)2011,JPO&INPIT