baber/WOPTO huggingface dataset:
Patent TW-202004171-A (TW)
Title: Shape metric based scoring of wafer locations
Inventor: BANERJEE SAIBAL
IPC: G01N21/95
Filed: 2019-04-12
Abstract: Methods and systems for shape metric based scoring of wafer locations are provided. One method includes selecting shape based grouping (SBG) rules for at least two locations on a wafer. For one of the wafer locations, the selecting step includes modifying distances between geometric primitives in a design for the wafer with metrology data for the one location and determining metrical complexity (MC) scores for SBG rules associated with the geometric primitives in a field of view centered on the one location based on the distances. The selecting step also includes selecting one of the SBG rules for the one location based on the MC scores. The method also includes sorting the at least two locations on the wafer based on the SBG rule selected for the at least two locations.
Patent TW-201943111-A (TW)
Title: Light-emitting device, electronic device, and lighting device
Inventor: SEO HIROMI
IPC: C09K11/06
Filed: 2014-04-25
Abstract: Provided is a light-emitting element with high emission efficiency. The light-emitting element including a first electrode, a second electrode, and a layer containing an organic compound between the first electrode and the second electrode. The layer containing the organic compound includes a light-emitting layer at least containing a first organic compound, a second organic compound, and a fluorescent substance. The first organic compound has an electron-transport property. The second organic compound has a hole-transport property. The second organic compound has a triarylamine skeleton. At least one of three aryl groups in the triarylamine skeleton is a group including a p-biphenyl skeleton.
Patent TW-201943666-A (TW)
Title: Kit, particle mixture, paste and methods
Inventor: CURRIE EDWIN PETER KENNEDY
IPC: C03C27/06
Filed: 2019-04-17
Abstract: A particle mixture comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises ≥ 10 to ≤ 25 mol. % BaO; and ≥ 0 to ≤ 10 mol.% Bi2O3; and wherein the second glass frit comprises: ≥ 35 to ≤ 55 mol.% Bi2O3; ≥ 2 to ≤ 20 mol.% ZnO; and ≥ 10 to ≤ 40 mol.% B2O3.
Patent TW-202040143-A (TW)
Title: Structure for detecting position of inertia axis of defective quartz hemisphere shell and method therefor achieving a goal of eliminating frequency difference of the hemisphere shell
Inventor: CHANG CHIA-OU
IPC: G01R19/04
Filed: 2019-04-19
Abstract: Disclosed is a structure for detecting position of inertia axis of defective quartz hemisphere shell and a method therefor. The disclosed structure is mainly to: arrange locally the central support pillar of a hemisphere shell to the connective part of a central hole in a sensing element; sweep frequency in coordination with the electrode base and the sensing element for detecting the bifurcate frequency of the hemisphere shell; input alternating current to resonate the hemisphere shell; enable constant voltage to transfer from excitation sheets of a first and second electrode that are 45 degrees apart to a lateral edge in an opening of the hemisphere shell, thereby enabling the hemisphere shell to produce a first displacement and a second displacement; calculate two solutions of a low frequency inertia axial angle through an algorithm module; then rotate once the electrode base and repeat the aforementioned steps, so that a unique solution can be obtained by intersecting two operations on the inertia axial angle by means of the algorithm module; finally, mark a low frequency inertia axis and an imaginary vertical line that are mutually perpendicular to each other by using the inertia axial angle, and further to define positions for removal of mass representing four positioning points of the hemisphere shell mass ablation on the intersection at the opening bottom of the hemisphere shell, so that a goal of eliminating frequency difference of the hemisphere shell can be achieved.
Patent TW-202040322-A (TW)
Inventor: YEH SHU-WEI
IPC: G06F3/023
Filed: 2019-04-25
Abstract: A method for hiding typing biometric and a computer system using the same are provided. The method for hiding the typing biometric includes the following steps. A plurality of keyboard signals are received to obtain a plurality of keyboard key codes respectively. A random time is generated corresponding to each of the keyboard key codes. Each of the keyboard key codes is delayed and sequentially sent according to each of the random times.
Patent TW-202041247-A (TW)
Inventor: CHIANG KUO-CHING
IPC: A62B7/10
Filed: 2019-05-13
Abstract: The present invention discloses a face mask including a first anti-UV layer, a second anti-UV layer formed adjacent to first anti-UV layer, a filtering layer and a inner layer formed adjacent to the second anti-UV layer.
Patent TW-202002548-A (TW)
Inventor: HWANG CHIEN-HWA
IPC: H04W72/04
Filed: 2019-05-21
Abstract: 本發明的一方面提供一種使用者設備及其無線通訊方法，所述方法可以包括：在一下行鏈路上接收一指示，其中所述指示用來指示預定時間單元的一第一數量以用於在一個時隙中接收資料之後延遲發送一確認訊息；基於所述第一數量，獲得一個或複數個條件，其中所述一個或複數個條件影響用於處理在所述時隙中接收到的所述資料所需要的時間，以及影響所述預定時間單元的一持續時間；確定是否滿足所述一個或複數個條件中的至少一個；以及當所述一個或複數個條件中的至少一個滿足時，在所述時隙中接收所述資料之後，根據所述第一數量的預定時間單元在一上行鏈路上發送所述確認訊息。
Patent TW-202002074-A (TW)
Title: Etching method and plasma treatment device
Inventor: SHIMIZU YUSUKE
IPC: H05H1/46
Filed: 2019-06-14
Abstract: A method according to a representative embodiment of the present invention comprises: a step for preparing an object for processing, said object comprising a silicon film and a mask provided on the silicon film; a step for etching the silicon film, using the mask, by means of a plasma of a gas containing first halogen atoms; a step for modifying a surface of the silicon film into an oxidized layer by means of a plasma of a gas containing oxygen atoms, hydrogen atoms, and second halogen atoms, and said oxidized layer comprises a first region, which is extended along a side wall surface of the mask, and a second region, which is extended on the silicon film; a step for etching the oxidized layer so as to remove the second region while leaving the first region; and a step for etching the silicon film, using the oxidized layer which comprises the mask and the first region, by means of a plasma of a gas containing third halogen atoms.
Patent TW-202000691-A (TW)
Inventor: EMTAGE PETER
IPC: C07K14/54
Filed: 2019-06-21
Abstract: Provided herein are chimeric transmembrane proteins and proteins, nucleic acids encoding these chimeric transmembrane proteins or proteins, and mammalian cells containing these nucleic acids, and methods of making and using these mammalian cells.
Patent TW-202103235-A (TW)
Title: Method for fabricating tensile dielectric layer
Inventor: CHEN HSIN-JUNG
IPC: H01L21/322
Filed: 2019-07-08
Abstract: A method for fabricating a tensile dielectric layer comprises steps as follows: A first dielectric layer is firstly formed on a substrate. The first dielectric layer is subjected to an ultraviolet light (UV) within an argon atmosphere having a pressure ranging from 4 to 12 torr. A tensile stress of the tensile dielectric layer can be adjusted by manipulating the pressure of the argon atmosphere.
.
Patent TW-202012810-A (TW)
Title: Unit-type strain wave gearing
Inventor: KIYOSAWA YOSHIHIDE
IPC: F16H1/32
Filed: 2019-07-15
Abstract: In a unit type wave gear device (1), a rotation-side member (B) is relatively rotatably supported with respect to a stationary-side member (A) through a first slide bearing (8) and a second slide bearing (9), the rotation-side member being equipped with a second internal gear (4) and an output shaft (5) and the stationary-side member being equipped with a unit housing (2) and a first internal gear (3). Sliding bearing surfaces (8b, 8c) of the first slide bearing (8) and sliding bearing surfaces (9b, 9c) of the second slide bearing (9) are defined by conical surfaces centered on a center axis (1a). Compared to using roller bearings, it is possible to realize a unit type wave gear device that is advantageous from the standpoint of reducing weight and achieving a compact size. Also, since radial slide bearings without an interval adjustment function are no longer needed, it is easier to adjust the interval of the sliding surfaces.
Patent TW-202105922-A (TW)
Title: Flash memory controller, storage device and reading method thereof
Inventor: KUO SHIUAN-HAO
IPC: H03M13/47
Filed: 2019-07-29
Abstract: A flash memory controller used to access a flash memory includes a Read Only Memory (ROM), a processor and an Error Correcting Codes (ECC) unit. The ROM is used to store a code. The processor executes the code to control the access to the flash memory. The ECC unit includes a control module and a decoder. The control module separately calculates a first correlation between a plurality of trapping sets of a plurality of preset low-density parity-check codes (LDPC codes) with an innate bad column information, and assigns one of the LDPC codes with the lowest first correlation to be a selected LDPC code. The decoder decodes reading information obtained from the flash memory by using the selected LDPC code.
Patent TW-202106594-A (TW)
Title: Substrate intermediate bearing and transferring system in which a substrate-type cassette is regularly placed at the location of a first bearing port
Inventor: Sun jian-zhong
IPC: H01L21/677
Filed: 2019-08-08
Abstract: The present invention relates to a substrate intermediate bearing and transferring system, including a casing, wherein a bearing and transferring body is arranged inside the casing, the bearing and transferring body includes a pivot, the pivot extends outwardly into a first bearing port and a second bearing port spaced from each other so as to regularly place a substrate-type cassette at the location of the first bearing port. In addition to the first bearing port, the present invention is also designed with the second bearing port, the second bearing port performs wafers and other substrates reclaiming tasks, and the first bearing port waits and prepares to perform switching tasks when an external conveying device (or manual operation) reclaims and unloads material or the second bearing port is empty, so that the time required by the external conveying device to reclaim and unload materials can be saved.
Patent TW-202025397-A (TW)
Title: Manufacturing method of semiconductor device
Inventor: INOUE TAKESHI
IPC: H01L27/06
Filed: 2019-08-12
Abstract: To form a high-resistance region for improving the properties of an inductor element. A manufacturing method of a semiconductor device 10 comprises steps of: preparing the semiconductor device 10 provided with a semiconductor substrate 12, and a wiring layer 14 including an inductor element 28 formed on a surface 18 of the semiconductor substrate 12; irradiating the substrate with ions from above the wiring layer 14 so as to form a high-resistance region 30, which has resistance higher than that before the ion irradiation, in the semiconductor substrate 12 directly below the inductor element 28; and heating the semiconductor device 10 at a treatment temperature ranging from 250 to 300 DEG C after the ion irradiation. The ion irradiation includes irradiation with hydrogen ions at energy of 4 MeV or higher and a dosage of 4*10cm or higher.
Patent TW-202108267-A (TW)
Title: ER tool length setting auxiliary device capable of easily setting a tool length only by using a fastening screw to fasten a movable bolt
Inventor: CHANG HSIN-TIEN
IPC: B23B25/06
Filed: 2019-08-23
Abstract: The present invention is a tool length setting auxiliary device, which mainly includes a main body. One end of the main body is provided with a taper rod which can be directly sleeved on an end surface of a tool holder and fastened by a nut. The other end of the main body is provided with an accommodating hole. Two sides of the accommodating hole are provided with internal screw holes so as to be respectively screwed with a positioning screw and a fastening screw. A movable bolt can be accommodated in the accommodating hole of the main body. Two sides of the movable bolt are provided with corresponding elongated grooves. The elongated grooves are respectively configured to accommodate and insert the positioning screw and the fastening screw, and limit the range of telescopic movement of the movable bolt in the accommodating hole. One end of the movable bolt is provided with an inner hole for accommodating an elastic element. The other end of the elastic element abuts against the accommodating hole of the main body for pushing the movable bolt to extend toward the outer end of the accommodating hole, and the range of telescopic movement of the movable bolt is limited by the elongated groove.
Patent TW-202016095-A (TW)
Title: Organic compound, organic light-emitting diode and organic light-emitting device containing the compound
Inventor: SHIN IN-AE
IPC: C07D413/14
Filed: 2019-09-06
Abstract: An organic compound having a fused heteroaromatic moiety as an electron donor and a tri-pyrimidine moiety sharing an arylene group as an electron acceptor bonded to the fused heteroaromatic moiety, an organic light-emitting diode and an organic light-emitting device including the organic compound are disclosed, where the organic compound leads to enhanced luminous efficiency and lower driving voltages.
Patent TW-202115211-A (TW)
Title: Thermal strippable pressure-sensitive adhesive sheet for wet and high temperature process which includes a polyimide base material, and a thermal expandable pressure-sensitive adhesive layer containing a heat-resistant adhesive and a thermal expandable sphere distributed in the heat-resistant adhesive
Inventor: HSU CHUN-CHI
IPC: C09J133/00
Filed: 2019-10-03
Abstract: The present invention relates to a thermal strippable pressure-sensitive adhesive sheet for wet and high temperature process, in particular to an adhesive sheet used for sticking to an adherend that requires wet and high temperature process, and includes: a polyimide base material, and a thermal expandable pressure-sensitive adhesive layer which is coated on at least one side of the polyimide base material, wherein the thermal expandable pressure-sensitive adhesive layer contains a heat-resistant adhesive and a thermal expandable sphere distributed in the heat-resistant adhesive. The total volume of the thermal expandable sphere accounts for 5-10 vol% of the adhesive layer, and the thickness of the thermal expandable pressure-sensitive adhesive layer needs to be greater than or equal to the diameter of the thermal expandable sphere, so that after the thermal strippable pressure-sensitive adhesive sheet is subjected to a wet and high temperature process, the adhesive force between the adherend and the thermal strippable pressure-sensitive adhesive layer is less than 0.1 gf/inch.
Patent TW-202023976-A (TW)
Inventor: BANDO KAZUAKI
IPC: C03B33/02
Filed: 2019-10-15
Abstract: A cutting/breaking machine 1 for a glass plate 2 having a possible cut line 221 formed as a cut line on an upper surface, which is one surface, thereof is provided with a supporting mechanism 15 for supporting the glass plate 2 on a lower surface, which is the other surface, of the glass plate 2 and a pushing/cracking device 9 and 9a which can push and crack the glass plate 2 along the possible cut line 221, wherein the pushing/cracking device 9 and 9a is provided with a pressing body 83 which can simultaneously press a plurality of sites 81 and 82 which are positioned along the possible cut line 221 on the upper surface of the glass plate 2 in the pressing/cracking of the glass plate 2 along the possible cut line 221 at each of pressing/cracking positions P1, P2, P3, P4 and P5 on the glass plate 2.
Patent TW-202119739-A (TW)
Title: Power conversion device
Inventor: CHIU JUNG-CHING
IPC: H02M1/14
Filed: 2019-10-31
Abstract: A power conversion device is provided. The power conversion device includes a path module and a control module. The path module includes a first path and a second path. The control module generates a first control signal for controlling the first path and a second control signal for controlling the second path. When the input voltage value received by the path module is lower than the first threshold and a boosting operation is performed for the first time, the control module generates a first control signal to interrupts the first path to stops outputting the input power, and adjusts a duty cycle of the second control signal to the first duty cycle according to an input current value and an input voltage value, so as to stabilize the output voltage value.
Patent TW-202029597-A (TW)
Title: Coaxial right-angle pcb to cable
Inventor: BURRIS DONALD ANDREW
IPC: H01R12/70
Filed: 2019-11-19
Abstract: A connector assembly includes housing for storing components of the connector assembly. The connector assembly further includes a cable including a cable center conductor, wherein the cable center conductor is configured as a signal conductor. The connector assembly also includes a first dielectric and an alignment dielectric. Each of the first dielectric and the alignment dielectric includes a path to guide the cable center conductor through an angle to a printed circuit board as the cable is axially inserted into the housing.
Patent TW-202030274-A (TW)
Title: Colored photosensitive composition, film, color filter, solid state image sensing element, and image display device
Inventor: MAKINO MASAOMI
IPC: G02B5/20
Filed: 2019-11-25
Abstract: Provided is a colored photosensitive composition including: a pigment derivative A1 having a maximum molar extinction coefficient of 3,000 L.mol-1 .cm-1 or less in a wavelength range of 400-700 nm; a pigment derivative A2 having a maximum molar extinction coefficient of greater than 3,000 L.mol-1 .cm-1 in a wavelength range of 400-700 nm; a pigment; a polymerizable compound; and a photopolymerization initiator. Also provided are a film, a color filter, a solid-state image sensing element, and an image display device which are formed from said colored photosensitive composition.
Patent TW-202037883-A (TW)
Title: Mounting device
Inventor: NAKAMURA TOMONORI
IPC: G01B11/24
Filed: 2019-12-02
Abstract: This mounting device is for mounting a chip component on a substrate via a paste and includes: an application unit (16) that applies a paste on a substrate under predetermined application conditions to form an application body; a bonding unit (18) that forms a mounted body which is the substrate having a chip component mounted thereon under predetermined mounting conditions via the application body; a first imaging unit (38) that images the application body after applying the paste and before mounting the chip component to obtain first image information; a second imaging unit (42) that images the mounted body after the mounting to obtain second image information; and a control unit (22) that controls the application unit (16), the bonding unit (18), and the first and second imaging units (38), (42) and determines a three-dimensional shape of the application body from the first image information as a first shape and calculates a three-dimensional shape of the mounted body from the second image information as a second shape, wherein the control unit (22) evaluates the application or the mounting on the basis of the first shape and the second shape.
Patent TW-202038311-A (TW)
Inventor: OLSON JOSEPH C
IPC: H01L21/67
Filed: 2019-12-12
Abstract: Embodiments of the disclosure relate to systems and methods for forming devices on a substrate. For example, a method for forming devices on a substrate can include projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of a substrate and projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of a substrate. In these embodiments, the first surface and the second surface are on opposite sides of the substrate. Therefore, the ion beams can form the devices on both sides of the substrate.
Patent TW-202038464-A (TW)
Title: Photodiode arrays
Inventor: FICHET GUILLAUME
IPC: H01L51/42
Filed: 2019-12-19
Abstract: A method comprising: forming on a support film a first stack of layers defining an array of photodiodes; forming over said first stack of layers in situ on said support film a second stack of layers defining electrical circuitry by which the photoresponse of each photodiode is independently detectable via an array of conductors outside the array of photodiodes; wherein forming said first stack of layers comprises depositing an organic semiconductor material over a first electrode, and depositing a second electrode over said organic semiconductor material, wherein said electrical circuitry comprises transistors including photosensitive semiconductor channels, and said second electrode also functions to substantially block the incidence of light on the photosensitive semiconductor channels from the direction of the support film.
Patent TW-202125187-A (TW)
Title: Touchscreen having conductive gel-based optical adhesive layer
Inventor: CHOU JUI-SHU
IPC: B32B37/12
Filed: 2019-12-27
Abstract: The present invention relates to touchscreen, which is assembled via an optical bonding process, comprising: a liquid crystal module comprising a corner situated on where a frame and a display surface meet each other; a touch panel configured above the liquid crystal module and receiving a touch input; a first gel-based adhesive pre-cured prior to an implementation of the optical 
bonding process; and a second gel-based adhesive pre-cured prior to the implementation of the optical bonding process, having a second conductivity, covering a part of the corner and the frame, and sandwiched between the touch panel and the liquid crystal module with the first gel-based adhesive so as to bond both the touch panel and the liquid crystal module.
Patent TW-202101063-A (TW)
Title: Process flow for hybrid tft-based micro display projector
Inventor: FABIEN CHLOE ASTRID MARIE
IPC: H01L27/12
Filed: 2020-02-05
Abstract: Disclosed herein are techniques for forming a thin-film circuit layer on an array of light-emitting diodes (LEDs). LEDs in the array of LEDs can be singulated by various processes, such as etching and ion implantation. Singulating LEDs can be performed before or after forming the thin-film circuit layer on the array of LEDs. The array of LEDs can be bonded to a transparent or non-transparent substrate.
Patent TW-202042252-A (TW)
Title: Electroconductive paste, electronic component, and laminated ceramic capacitor
Inventor: TACHI YUJI
IPC: H01G4/30
Filed: 2020-02-07
Abstract: Provided is an electroconductive paste in which an electroconductive powder is highly dispersed, superior viscosity stability is obtained, and little gas is produced at low temperatures when firing starts. This electroconductive paste contains an electroconductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent, wherein the dispersant contains an amino-acid-based dispersant, an amine-based dispersant, and a phosphoric acid alkyl ester compound, and specifically contains 0.03-0.3 mass% inclusive of the amino-acid-based dispersant, at least 0.2 mass% of the amine-based dispersant, and at least 0.05 mass% of the phosphoric acid alkyl ester compound. The total amino-acid-based dispersant and amine-based dispersant content is no greater than 0.5 mass%, and the total amino-acid-based dispersant, amine-based dispersant, and phosphoric acid alkyl ester compound content is no greater than 0.7 mass%.