baber/WOPTO huggingface dataset:
Patent TW-201518454-A (TW)
Title: Pressure-sensitive adhesive composition
Inventor: LEE MIN-KI
IPC: C09J5/00
Filed: 2014-06-19
Abstract: The present invention relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive optical member, a pressure-sensitive adhesive polarizing plate, and a display device. The pressure-sensitive adhesive composition of the present invention can form a pressure-sensitive adhesive having excellent durability and light leakage prevention property under severe conditions such as a high temperature condition, a high temperature and high humidity condition, or under a severe condition where a high temperature/high humidity and a normal temperature/low humidity are repeated.
Patent TW-201444726-A (TW)
Title: Cable for a vehicle
Inventor: WEN YUAN-HUNG
IPC: B62L1/02
Filed: 2014-07-01
Abstract: The present invention provides a cable for a vehicle. The holder has a first wire and second wire which are coiled as a tubular coil together. The second wire has a wedge-shape cross section. Thus, when the holder is bent, the second wire wedges into the coil of the first wire for preventing the first wire and the holder from recovery. The shape of the holder is then changed. The curve and the position of the holder can be adjusted easily.
Patent TW-201602442-A (TW)
Title: A thermosiphon type of roof heat dissipation device
Inventor: CHEN WEN-LIANG
IPC: E04B1/78
Filed: 2014-07-01
Abstract: A thermosiphon type of roof heat dissipation device includes a plurality of cooling units. Each cooling unit includes a first heat pipe, a second heat pipe, and a plurality of fins formed on the second heat pipe. The first and second heat pipe communicating with each other to form a cooling space and having a working fluid filled in the cooling space. When the roof is by the light and heat, the first heat pipe working fluid it will through the thermal energy transfer to the second heat pipe, and then through the plurality of heat radiating fins for heat exchange with air. The second heat pipe working fluid is condensed drips down to be a continuous evaporation of the condensation cycle in order to reduce the temperature of the roof.
Patent TW-201607416-A (TW)
Title: Server device
Inventor: JAU MAW-ZAN
IPC: H05K7/14
Filed: 2014-08-04
Abstract: A server device includes a chassis, a sliding tray, a storage module, a transmission flat cable and a cable protecting member. The sliding tray is slidably engaged with the chassis including a bottom-surface. The storage module is disposed on the sliding tray for sliding into or out of the chassis. The transmission flat cable is electrically connected to the storage module and is used to restrict the transmission flat cable. An end of the cable protecting member is connected to the sliding tray, and the other end is fixedly connected to the bottom-surface of the chassis. The cable protecting member has a plurality of connecting units pivotally connected with each other sequentially. The cable protecting member can be bent to form a first part and a second part in which orthographic projection of the first part on the bottom-surface partially overlap with orthographic projection of the second part.
Patent TW-201608575-A (TW)
Title: Test method and system for memory device
Inventor: TASHER NIR
IPC: G11C29/52
Filed: 2014-08-29
Abstract: A method in a memory device that operates in a testing mode, includes receiving a vector to be written to the memory device. The vector is written to the memory device only if the vector belongs to a predefined set of test vectors. If the vector does not belong to the set of test vectors, the vector is converted to one of the test vectors, and the converted vector is written to the memory device.
Patent TW-201611215-A (TW)
Title: Package structure and method of manufacture
Inventor: CHIU CHI-HSIN
IPC: H01L23/48
Filed: 2014-09-11
Abstract: The invention provides a package structure and a method of fabricating the same, the package structure including a frame body, a semiconductor chip, a dielectric layer and a circuit layer, the frame body having an opening formed thereon, the semiconductor chip being disposed in the opening of the frame body and having opposite active and non-active surfaces exposing the opening therefrom, the dielectric layer being formed in the opening for contacting and securing the semiconductor chip therein, the dielectric layer being flush with the frame body on the active surface side, the circuit layer being formed on the dielectric layer on the active surface side for electrically connecting to the active surface, thereby effectively reducing manufacturing costs and the thickness thereof.
Patent TW-201611595-A (TW)
Title: Method for synchronization of data display
Inventor: LEE WEI-HUAN
IPC: H04N21/65
Filed: 2014-09-12
Abstract: A method for synchronization of data display includes the following steps. A main device displays a first medium segment, and transmits the first medium segment to an exterior device. When the exterior device displays the first medium segment, the main device enables a voice-receiving unit or an image-capturing unit for receiving the first medium segment displayed by the exterior device. The main device calculates a time difference between the time when the main device displays the first medium segment and the time when the exterior device displays the first medium segment. The main device transmits a second medium segment to the exterior device. The main device and the exterior device display the second medium segment simultaneously according to the time difference.
Patent TW-201614745-A (TW)
Title: Bonding wire for power module package and method of manufacturing the same
Inventor: CHUANG TUNG-HAN
IPC: H01L21/60
Filed: 2014-10-08
Abstract: An interconnection structure for a power module package, whose material is selected from a group consisting of silver-gold alloy, silver-palladium alloy, and silver-gold-palladium alloy is provided. The bonding wires of interconnection are annealed to a hardness between 30 and 65 Hv. The bonding wires may be coated with one or more thin films selected from a group consisting of pure aluminum, approximately pure gold, approximately pure palladium, and gold-palladium alloy. The bonding wires contain slender grains and first equi-axial grains in the center and second equi-axial grains in the other locations thereof, wherein quantity of the grains comprising annealing twins is 30 percent or more of the total quantity of the grains in the bonding wires. The interconnection structure is manufactured through the ultrasonic bonding between an on-chip pad and an on-substrate pad.
Patent TW-201519418-A (TW)
Title: Display device and electronic device
Inventor: NAKADA MASATAKA
IPC: H01L27/12
Filed: 2014-10-09
Abstract: A novel display device capable of adjusting color purity is provided. A novel display device with improved adhesion of a color filter is provided. A novel display device capable of excellent reflective display is provided. The display device includes a transistor, a reflective electrode layer formed on the same surface as a source electrode layer or a drain electrode layer of the transistor, a first insulating layer over the reflective electrode layer, a coloring layer which is over the first insulating layer and overlaps with the reflective electrode layer, a second insulating layer over the coloring layer, and a pixel electrode layer over the second insulating layer. The coloring layer includes at least a first opening and a second opening. The pixel electrode layer is electrically connected to the transistor through the first opening. The second insulating layer is in contact with the first insulating layer in the second opening.
Patent TW-201617178-A (TW)
Title: Multi-size wrench structure
Inventor: CHEN SHU-MIN
IPC: B25B13/12
Filed: 2014-11-04
Abstract: The present invention relates to a multi-size wrench structure, which includes: a main body, two opposite action members, and a plurality of elastic elements. The main body is provided with a first receiving slot, a first edge surface and a second edge surface. One end of the main body is provided with a first end. A first engagement part is formed at two sides around an opening of the first end. The two opposite action members are correspondingly received in the first receiving slot. The length of the action members is larger than the length of the main body. Each action member has one end formed thereon with a first rotation part. The first rotation part has an inner side arranged thereon a first rotation surface. The first rotation surface is protruded out of the first end. The first rotation part is provided with a plurality of third engagement parts engaged with the first engagement part. The first engagement part is engaged with one of the third engagement parts of the action members. The two first rotation surfaces of the two action members constitute an opening wrench shape of a specification. The two action members can be moved at the same time in the first receiving slot so that the first engagement part is engaged with another one of third engagement parts thereby allowing the two first rotation surfaces of the two action members to constitute an opening wrench shape of another specification. The plurality of elastic elements are received in the first receiving slot. The elastic elements enable the third engagement parts to be engaged with the first engagement part thereby positioning the two action members.
Patent TW-201619939-A (TW)
Title: Driving circuit of display panel
Inventor: Su zhong-xin
IPC: G09G3/20
Filed: 2014-11-25
Abstract: The invention is a driving circuit of display panel that generates a plurality of driving signals for driving at least a scanning line. The driving circuit comprises a plurality of level conversion circuit, a decoding circuit and a plurality of output circuits. The decoding circuit comprises a first level control circuit and a second level control circuit. These level conversion circuits generate a plurality of controls signals. The first level control circuit receives the control signals to decide that at least a level of the decoded signals as a first level. The second level control circuits respectively receive one of the control signals to decide that the level of the decoded signals as a second level. Moreover, the output circuits generate the driving signals based upon the decoded signals. At least one of the driving signals has a driving level for driving at least one scanning line.
Patent TW-201525899-A (TW)
Title: Method of resetting payment password, terminal device and system thereof
Inventor: Huang can-hui
IPC: G06Q20/40
Filed: 2014-12-15
Abstract: A method of resetting payment password, terminal device and system thereof are provided. The terminal device responses the resetting instruction triggered by the client when the terminal device detects the resetting instruction of the payment password corresponding to the payment account number bound to the first bank card. The terminal device receives the property information of the added second bank card from the client and a new payment password of the second bank card configured by the client. The terminal device binds the new payment password, the payment account number and the second bank together. When the client triggers the payment operation based on the third party electronic payment platform, the terminal device is capable of resetting the payment account number of the international bank card to improve the intelligence of the terminal device.
Patent TW-201622598-A (TW)
Title: Wearable medical sensor system
Inventor: HARAIKAWA KOICHI
IPC: A41D27/00
Filed: 2014-12-16
Abstract: A wearable medical sensor system including a clothes and an elastic bounding layer attached in the clothes is provided in the present disclosure. The clothes is included of a main body symmetric according to a symmetric axis and a couple of sleeves symmetrically connected on both sides of the main body. At least a part of the main body is surrounded by the elastic bounding layer. First to Fifth electrodes are attached on the elastic bounding layer corresponding to the same surface of the clothes. The elastic bounding layer is more stretchable and more contractible than the clothes.
Patent TW-201624417-A (TW)
Title: A color balance algorithm based on estimation of adjusting ratios
Inventor: CHEN CHENG-LUN
IPC: G06T7/00
Filed: 2014-12-27
Abstract: A color balance algorithm, which is based on estimation of adjusting ratios, establishes fuzzy inference rules from a set of illuminants with known color temperature. In accordance with the inference rules, the algorithm seeks an adjusting ratio for each image pixel with unknown illuminant. The ratio is subsequently utilized to adjust the color of an original image with unknown illuminant to that of the same image with a standard illuminant. This invention comprises the following steps: 1. Input an original image with unknown illuminant; 2. Pass the image through a fuzzy inference system; 3. Perform data filtering and comparing to obtain adjusting ratios; 4. Perform a color balance algorithm. The main feature of the invention is: 1. Image compensation is based only on information in the original image with unknown illuminant; 2. The algorithm is applicable to various digital image capturing device; 3. The performance may be improved by adjusting the parameters of the fuzzy inference system.
Patent TW-201530408-A (TW)
Title: Transparent electrode layer, touch panel and electronic device
Inventor: NAITO SHUSAKU
IPC: G06F3/044
Filed: 2014-12-31
Abstract: A transparent electrode layer includes plural touch units. Each of the touch units includes a sensing part and a wiring part. The sensing part has at least one dummy slit. The wiring part is electrically connected to the sensing part, and includes at least one conductor line and at least one slit. The at least one conductor line and the at least one slit are alternately formed in the wiring part. A density ratio, in a range between 0.5 and 2, is determined by a sensing part density parameter and a wiring part density parameter.
Patent TW-201629912-A (TW)
Title: Coin pusher of coin provider
Inventor: HU CHIA-HUNG
IPC: G07D9/04
Filed: 2015-02-11
Abstract: A coin pusher of coin provider is disclosed. The main coin provider body has a coin collecting hopper with a receiving space for accommodating a plurality of coins. At the wall of the receiving space, a rotating disc is arranged to enable a power device to drive the rotation, and a coin outlet is formed penetratingly from the edge of rotating disc to the external of the coin provider body. A plurality of arched coin pushing plates are lined up and extended outwardly in a ring shape, which are provided with a wider inside and narrower outside, from the edge of the rotating disc bottom, and any two adjacent coin pushing plates form a coin retaining groove therebetween, respectively. When the rotating disc rotates, coins will be flipped and moved and fall into the coin retaining groove individually, and the edges of coins abut to a lean-on face formed by the inner walls of coin retaining groove, and when the pushing plates work in coordination with the coin retaining groove to push the coins to move to a coin bouncing mechanism of the coin outlet, the coins leave gradually the coin retaining groove along the lean-on face and a pushing face that converts at the lean-on face in an outward manner, and then a bouncing rod of the coin bouncing mechanism bounces back the coins so that the coins are rapidly bounced out one by one from the coin outlet, thereby completing the coin providing operation.
Patent TW-201543598-A (TW)
Title: Substrate processing device, substrate processing method, program, and computer storage medium
Inventor: NISHI TAKANORI
IPC: H01L21/324
Filed: 2015-02-17
Abstract: An object of the invention is to form a predetermined pattern in an appropriate manner on a substrate, during processing of a substrate using a block copolymer that contains a hydrophilic polymer and a hydrophobic polymer. A wafer W on which a predetermined resist pattern 402 has been formed is coated with a block copolymer, and the wafer W coated with the block copolymer is subjected to a heat treatment at a temperature equal to or greater than the volatilization temperature of the solvent in the block copolymer, thereby removing the solvent from the block copolymer. Following removal of the solvent, the wafer W is subjected to an annealing treatment in an atmosphere of another solvent that differs from the removed solvent, at a temperature lower than the volatilization temperature of the other solvent, thereby inducing phase separation of the block copolymer into a hydrophilic polymer 405 and a hydrophobic polymer 406.
Patent TW-201533921-A (TW)
Title: Silicon solar cells with epitaxial emitters
Inventor: GEE JAMES M
IPC: H01L31/18
Filed: 2015-02-25
Abstract: Embodiments of the disclosure generally relate to forming solar cells having epitaxial emitters. The emitters of the solar cells, as well as the bases of the solar cells, are epitaxially grown in a process chamber using a template substrate to form an epitaxial substrate. During the formation process of the epitaxial substrate, dopants can be introduced into the process chamber to dope the emitters and the bases with desired dopant profiles and concentrations. In one example, the epitaxial material is silicon and the dopants are n-type and p-type dopants.
Patent TW-201632672-A (TW)
Title: Method for knitting interchanged plating on single face of technical face for flat bed knitting machines
Inventor: LEE CHIH-CHIANG
IPC: D04B15/36
Filed: 2015-03-05
Abstract: A method for knitting interchanged plating on a single face of technical face for a flat bed knitting machine which includes at least one needle bed that has a plurality of latch needles, a plurality of sinkers and a carriage above the needle bed comprises the steps of: forming an indentation and a nose protrusion at a front end of each sinker; controlling the carriage so that the latch needle is moved in a staged stitching displacement which includes at least a first stitching section, a second stitching section and a delayed stitching section; feeding a first coloration yarn and a second coloration yarn at the same time to the flat bed knitting machine; pushing the yarns via the front edge of the nose protrusion while the sinker is at the second stitching section to knit a standard plating and continuing the knitting operation through the standard plating to form a single face fabric; and controlling the carriage to make the latch needle in movement to form an interchanged stitching displacement, and ordering the sinker during the interchanged stitching displacement to pick up the yarns through the junction of the rear edge of the nose protrusion and the indentation, then release the yarns to knit an interchanged plating.
Patent TW-201638721-A (TW)
Title: Input system and method
Inventor: CHIEN CHIH-FENG
IPC: G06F13/10
Filed: 2015-04-24
Abstract: The input system provided in the present invention includes a communication device and a first input device. The communication device includes a communication chip and a communication connecting port. The first input device includes a signal connecting port for connecting to the communication device. The first input device further includes a device connecting port for connecting to a second input device. In the input method provided in the present invention, a first pairing signal is firstly transmitted to the first input device by the communication device for accessing a first identification code and a connection stat of the first input device. Then, a first inquiring signal includes the first identification code is transmitted to the first input device by the communication device for accessing a first input signal. Further, a second pairing signal and a second inquiring signal are transmitted to the second input device for accessing a second input signal according to the connection stat by the communication device.
Patent TW-201544519-A (TW)
Title: Liquid encapsulation material, and electronic component using the same
Inventor: OGAWA HIDEAKI
IPC: C08K3/36
Filed: 2015-04-29
Abstract: This liquid sealing material has low thermal expansion and has injection properties for injection into gaps between a semiconductor element and a substrate; this electronic component is formed by sealing a sealing site using the liquid sealing material. This liquid sealing material is characterized by containing (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler with an average particle diameter of 7-50 nm, surface treated with 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane, and (D) a silica filler with an average particle diameter of 0.2-5[mu]m, wherein relative to a total of 100 parts by mass of all components of the liquid sealing material, the total of the silica filler of component (C) and the silica filler of the component (D) is 45-77 parts by mass, and the mixing ratio (mass ratio) of the silica filler of component (C) and the silica filler of component (D) is 1:10.2-1:559.
Patent TW-201609522-A (TW)
Title: Method of manufacturing a MEMS structure
Inventor: TORKKELI ALTTI
IPC: B81C1/00
Filed: 2015-05-15
Abstract: A method for creating MEMS structures comprises depositing and patterning a first mask (2) on a wafer (1) in order to define desired first areas to be etched in a first trench etching and to define desired second areas to be etched in a second trench etching. A first intermediate mask (15) is deposited and patterned on top of the first mask (2), Recession trenches (3c) are etched on parts of the wafer. After the first intermediate mask (15) is removed, first trenches (3a, 3b) are etched with further etching the recession trenches (3c). The first trenches (3a, 3b) and the recession trenches (3c) are filled with a deposit layer (4). Part of the deposit layer (4) is removed on second. A reminder is left on certain areas to function as a second mask (4"). A third mask (5) is deposited. The third mask (5) defines the final structure. The parts of the wafer (1) on the second areas are etched in the second trench etching. The masks (4") are then removed.
Patent TW-201547018-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: LIAO WEN-CHIA
IPC: H01L29/66
Filed: 2015-05-29
Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a first passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode and the drain electrode are disposed on the active layer. The p-type doped layer is disposed on the active layer and between the source electrode and the drain electrode. The p-type doped layer has a first thickness. The gate electrode is disposed on the p-type doped layer. The first passivation layer covers the gate electrode and the active layer. The field plate is disposed on the first passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The first passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.
Patent TW-201609720-A (TW)
Title: 1, 3, 4-thiadiazole compounds and their use in treating cancer
Inventor: EKWURU CHUKUEMEKA TENNYSON
IPC: A61K31/501
Filed: 2015-05-29
Abstract: The specification relates to compounds of Formula (I): and pharmaceutically acceptable salts thereof, where Q, R, R<SP>1</SP> and R<SP>2</SP> have any of the meanings defined herein. The specification also relates to the use of such compounds and salts thereof to treat or prevent GLS1 mediated disease, including cancer. The specification further relates to crystalline forms of compounds of Formula (I) and pharmaceutically acceptable salts thereof; pharmaceutical compositions comprising such compounds and salts; kits comprising such compounds and salts; methods of manufacture of such compounds and salts; intermediates useful in the manufacture of such compounds and salts; and to methods of treating GLS1 kinase mediated disease, including cancer, using such compounds and salts.