baber/WOPTO huggingface dataset:
Patent TW-571410-B (TW)
Title: BGA package with the same power ballout assignment for wire bonding packaging and flip chip packaging
Inventor: CHANG NAI-SHUNG
IPC: H01L23/498
Filed: 2002-12-24
Granted: 2004-01-11
Abstract: The present invention provides a wire bonding ball grid array (BGA) package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the inner side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by flip chip packaging instead of wire bonding packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the wire bonding BGA package. In addition, the present invention provides a flip chip BGA package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the outer side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by wire bonding packaging instead of flip chip packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the flip chip BGA package.
Patent TW-I221373-B (TW)
Title: Data transfer device
Inventor: MIZUMOTO KATSUYA
IPC: G06F1/04
Filed: 2003-01-21
Granted: 2004-09-21
Abstract: The number of pulses of a clock signal CLK-A is circularly counted in a count range from ""0"" to ""7"", and count signals indicating count values are produced. A clock signal CLK-B having a frequency lower than that of the clock signal CLK-A is produced from count signals of ""3"" and ""7"", and data transfer between a high speed operating block operated in synchronization with the clock signal CLK-A and a low speed operating block operated in synchronization with the clock signal CLK-B is performed in synchronization with the clock signal CLK-B to receive input serial data or transmit output serial data. When a stuff bit of universal Serial Bus is detected in the input serial data or is inserted in the output serial data, a cycle of the clock signal CLK-B is lengthened by one cycle of the clock signal CLK-A.
Patent TW-I261466-B (TW)
Title: Device, method and recording medium for monitoring a zone of an elevator installation by means of a 3-D sensor
Inventor: DEPLAZES ROMEO
IPC: B66B5/00
Filed: 2003-03-10
Granted: 2006-09-01
Abstract: A device to monitor a lift-region with a 3-D semiconductor-sensor (79) to detect 3-dimensional image-information is provided. The semiconductor-sensor (79) includes a light-source, which is mounted so that the monitoring lift-region exists in the lighting region of the light-source; a sensor-group, which is mounted so that it receives the reflected light; and a processing chip to convert the electrical signals into image-information. The device has another processing-device (80), which is connected with the semiconductor-sensor (79), in order to make the 3-dimensional image-information usable. The processing-device (80) processes the image-information, in order to obtain the state-information, which represents the state of the monitoring lift-region.
Patent TW-594106-B (TW)
Title: Thin direct-type backlight module
Inventor: FAN KUO-SHU
IPC: G02F1/00
Filed: 2003-03-27
Granted: 2004-06-21
Abstract: A direct-type backlight module is disclosed, which at least comprises: a lamp tube, a reflective plate, diffusion plate, reflective layer. The reflective plate is installed below the lamp tube. The diffusion plate is installed above the lamp tube, which comprises a first region and a second region. The first region is corresponding to the upper surface of the lamp tube, the second region is adjacent to the first region. The reflective layer covers the upper surface of the lamp tube locally to shield part of the light emitted from the shielded part, so that the light is reflected onto the reflective plate, and is reflected again onto the second region by the reflective plate.
Patent TW-I224809-B (TW)
Title: Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus
Inventor: KOYAMA MINORU
IPC: H01L21/00
Filed: 2003-04-11
Granted: 2004-12-01
Abstract: A plurality of unit areas (bit) B are set on a base board (S). A liquid drop made of a liquid member is ejected to the unit area B from a liquid drop ejecting head (34) so as to form a layer on the base board (S). A first pattern is formed by a first nozzle group Na in nozzles N which are formed in the liquid drop ejecting head (34). A second pattern is formed by a second nozzle group Nb which is different from the first nozzle group Na. By doing this, it is possible to maintain a stable ejection operation so as to form a pattern in preferable accuracy when patterns having different features are formed on the base board by using the liquid drop ejecting apparatus.
Patent TW-I266612-B (TW)
Title: Actuating device for spinning reel
Inventor: TAKIKURA KOUJI
IPC: A01K89/01
Filed: 2003-04-25
Granted: 2006-11-21
Abstract: An actuating device is used in a rotor control device of a spinning reel for preventing the occurrence of filament entanglement in the gap between two operating members without increasing the cost of the spinning reel. A rod latch mechanism 6 of a spinning reel is used to latch the rotation of a rotor in a line release direction, and comprises: a latch part 16, a latch rod 17, a latch specifying part 21, an auxiliary rod 18, a notch part 17e, and a sealing member 35. The latch part is linked to the rotation of the rotor in the line release direction. The latch rod is used for stopping the rotor. The latch specifying part is used to switch the rotation status of the rotor in the line release direction into a latch-released status and specify the latch status. The auxiliary rod is used to switch to a specified latch status for the latch part. The notch part forms a shape on the latch rod for encompassing the auxiliary rod from three directions towards the opening of the rotor. The sealing member is mounted on the opening part of the notch part and encompassing the periphery of another rod together with the notch part.
Patent TW-I222410-B (TW)
Title: Thermal printer and method for transferring dyes on multiple dye blocks onto media
Inventor: CHIEN HSU-CHU
IPC: B41J2/36
Filed: 2003-05-15
Granted: 2004-10-21
Abstract: A thermal printer and method for transferring dyes on multiple dye blocks onto media. The printer includes a thermal printer head, a transfer ribbon, a logic unit, and a control circuit. The printer transfers same color dyes on multiple dye blocks onto the same media for increasing saturation and dynamic range of colors.
Patent TW-I229801-B (TW)
Title: Information transmission/reception apparatus, apparatus and method of information transmission, apparatus and method of information reception, apparatus and method of information processing, management apparatus and method of information transmission, ma
Inventor: ENDO YUKA
IPC: G06F13/00
Filed: 2003-05-30
Granted: 2005-03-21
Abstract: The subject of the present invention is to have the information transmission/reception apparatus, apparatus and method of information processing, management apparatus of information transmission/reception and method, recording medium and program where even more suitable communication is obtained. The electronic mail transmitted from personal computer 22 contains the main text data inputted by the user through the use of the corresponding personal computer 22 to identify the action ID by performing the action through the best friend character displayed on the computer of the transmitted destination. In the personal computer for receiving the electronic mail, in cooperation with displaying the main text contained in the electronic mail inside the dialogue frame of the best friend character, the action of best friend character is controlled according to the obtained action data (picture data) corresponding to the action ID of the main text. The present invention can be used in each kind of machine having communication function and display function such as personal computer and so on.
Patent TW-I258514-B (TW)
Title: Silver alloy sputtering target and process for producing the same
Inventor: MATSUZAKI HITOSHI
IPC: C23C14/14
Filed: 2003-06-23
Granted: 2006-07-21
Abstract: This invention relates to a silver alloy sputtering target useful for formation of a silver alloy thin film of especially uniform thickness according to sputtering technique, in which, when crystal orientation intensities are determined at four arbitrary points according to X-ray diffractometry, the direction exhibiting the highest crystal orientation intensity (Xa) is identical at the four measuring points and further the dispersion of intensity ratio (Xb/Xa) between highest crystal orientation intensity (Xa) and second highest crystal orientation intensity (Xb) at each of the measuring points is 20% or less.
Patent TW-I224423-B (TW)
Title: Gate driving circuit in power module
Inventor: MOCHIZUKI KOUICHI
IPC: H01L21/822
Filed: 2003-06-27
Granted: 2004-11-21
Abstract: This invention provides a gate driving circuit containing a power module using IGBT and capable of suppressing an over current due to such instance as a short circuit at the load side of the power module so as to prevent the IGBT within the power module form failure due to heat. A coil section 18 formed as a portion of a gate wire 16 of an IGBT 10 is wound around and electrically insulated from a main current circuit wire 17. One end of the coil section is connected to a gate terminal 12, while the other end thereof is connected to a gate bias power source 15 to induce an electromotive force based only on a main current of the IGBT. Thus, a gate bias is controlled by utilizing the electromotive force produced on the coil section according to a time variation of the main current, thereby suppressing an over-current in a power module.
Patent TW-I298919-B (TW)
Title: A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine
Inventor: BRUNO GHYSELEN
IPC: H01L21/66
Filed: 2003-08-12
Granted: 2008-07-11
Abstract: The invention relates to a method of preparing a thin layer of semiconductor material, the method including a step (1050') of correcting the thickness of the layer, said step of correcting thickness of the layer itself comprising the following operations: acquiring a measured thickness profile of the layer; deducing thickness correction specifications from the measured thickness profile; and correcting the thickness of the layer in accordance with said specifications; the method being  characterized in that  thickness correction implements a technique which simultaneously treats the entire surface of the layer, while locally and selectively adapt layer thickness in different regions of the layer surface. The invention also relates to an associated machine.
Patent TW-I249784-B (TW)
Title: Apparatus and method for preparing and supplying slurry for CMP machine
Inventor: KAWASAKI MASATO
IPC: G05B13/02
Filed: 2003-09-09
Granted: 2006-02-21
Abstract: Disclosed is an apparatus for preparing and supplying a slurry to a chemical mechanical polishing machine (17). The slurry contains liquid components at a predetermined mixing ratio. The apparatus includes draw ports (3) for separately drawing there through the liquid components, and a discharge port (18) for supplying the slurry to the machine (17). Feed pumps (5) are arranged on feed lines for the liquid components, respectively, said feed lines extending from the individual draw ports (3) to the discharge port (18), such that the feed pumps (5) can draw the corresponding liquid components in specific amounts to give the mixing ratio and can deliver the thus-drawn liquid components toward the discharge port (18), respectively. Dampers (6) and pressurization valves (7) are arranged in combinations on the respective feed lines on delivery sides of the feed pumps (5). Flowmeters (8) are arranged on downstream sides of the corresponding combinations of the dampers (6) and pressurization valves (7). The apparatus is also provided with a programmable logic controller (16) for controlling delivery rates of the individual feed pumps (5) by using measurement values from the flowmeters (8). A slurry preparing and supplying method making use of a plurality of such apparatuses is also disclosed.
Patent TW-I224374-B (TW)
Title: Method for forming a backside encapsulating layer on flip-chip type wafer
Inventor: TSAI YU-PEN
IPC: H01L21/44
Filed: 2003-09-26
Granted: 2004-11-21
Abstract: A method for forming a backside encapsulating layer on flip-chip type wafer is performed firstly to provide a wafer. The wafer has an active surface with bumps and a corresponding back surface. Keeping the back surface upwardly, a thermosetting pellet is provided on the back surface. A flat mold is heated and presses the thermosetting pellet, so that the thermosetting pellet is smoothly distributed over the back surface of the wafer so as to form a flip-chip wafer with a backside encapsulating layer.
Patent TW-I272736-B (TW)
Title: Charging and discharging control circuit and charging type power supply unit
Inventor: ZHANG WEI
IPC: H02J7/00
Filed: 2003-09-26
Granted: 2007-02-01
Abstract: The invention provides; a charging and discharging control circuit which includes a charging and discharging control terminal having a test function as well and which is capable of conducting switch over among a normal application state, a charging and discharging prohibition state, and a test state; and a charging type power supply unit. Any one of a level ""L"", ""H"", or ""M"" of a voltage inputted to a charging and discharging control terminal is selected using the charging and discharging control terminal and a test fuse to allow switch over to the normal application state, the charging and discharging prohibition state, or the test state. In the test state, two modes for shortening a test delay time are realized depending on whether or not the test fuse is cut.
Patent TW-I300727-B (TW)
Title: VERFAHREN UND ANLAGE ZUM WALZEN UND ANSCHLIEβENDEN HASPELN VON METALLBAND, INSBESONDERE VON STAHLBAND
Inventor: PETER MARTIN
IPC: B21B38/00
Filed: 2003-12-22
Granted: 2008-09-11
Abstract: Steel strip issues continuously from a downstream end of a rolling line and can be wound up there on a coiler. An inspection table downstream of the rolling line has a surface aligned with the downstream end and the strip emerging therefrom. The coiler is below a plane of the table surface. During normal rolling the strip is deflected downward to the coiler and reeled up. For inspection of the strip, the strip is cut transversely to produce a new leading end and is fed starting at this end toward the table without substantial deflection. Then the strip is cut again upstream of the new leading end to form a strip sample separate from the strip emerging from the rolling line, which sample is fed to the table and arrested and inspected while strip emerging from the line is deflected back down to the coiler to continue coiling it up.
Patent TW-I247072-B (TW)
Title: Curtain made of curtain slabs and screen nets and method for making same
Inventor: HUANG SHIAN-DE
IPC: E06B9/264
Filed: 2004-03-15
Granted: 2006-01-11
Abstract: A curtain made of curtain slabs and screen nets and method for making same, particular one capable of shielding light and preventing insect entrance, where plural curved curtain slabs and screen nets are alternatively provided such that the curtain slabs stagger each other and the screen nets are provided on an opposite direction thereby causing the screen nets and the curtain slabs to construct a single unit to prevent insects from passing through the curtain.
Patent TW-I227047-B (TW)
Title: Tungsten-copper interconnect and method for fabricating the same
Inventor: YU CHEN-HUA
IPC: H01L21/768
Filed: 2004-03-26
Granted: 2005-01-21
Abstract: An interconnect structure utilizing a silicon carbon-containing film as an interlayer between dielectrics. A semiconductor substrate having a conductor thereon is provided, and an insulating layer overlies the semiconductor substrate. The insulating layer has an opening therein to expose the conductor. A conductive plug, e.g. a tungsten plug, substantially fills the opening and electrically connects the underlying conductor. A silicon carbon-containing film and a low k dielectric layer overlie the insulating layer and the conductive plug, and have a trench therein exposing the conductive plug. A copper or copper alloy conductor substantially fills the trench.
Patent TW-I244688-B (TW)
Title: Separating and assembling semiconductor strips
Inventor: WONG PAUL CHARLES
IPC: H01L21/68
Filed: 2004-05-07
Granted: 2005-12-01
Abstract: A method and an apparatus for separating elongated semiconductor strips from a wafer of semiconductor material are disclosed. Vacuum is applied to the face of each elongated semiconductor strip forming an edge of the wafer or being adjacent to the edge. The wafer and a source of the vacuum are displaced to separate each elongated semiconductor strip from the wafer. Further, a method and an apparatus for assembling elongated semiconductor strips separated from a wafer of semiconductor material into an array of the strips are disclosed. Still further, methods, apparatuses, and systems for assembling an array of elongated semiconductor strips on a substrate are disclosed.
Patent TW-I272028-B (TW)
Title: Mode control method for mobile wireless communication apparatus
Inventor: CHEN LIANG-FANG
IPC: H04W48/04
Filed: 2004-05-10
Granted: 2007-01-21
Abstract: The present invention discloses a mode control method for used in a mobile wireless communication apparatus containing a first communication mode and a second communication mode. The disclosed mode controlling method includes the following steps: (a) calculating a moving speed of the mobile wireless communication apparatus, (b) controlling the communication mode of the mobile wireless communication apparatus according to the moving speed. Wherein when the moving speed is not greater than a first speed, the method controls the mobile wireless communication apparatus to use the first communication mode; when the moving speed is not smaller than a second speed, the method controls the mobile wireless communication apparatus to use the second communication mode.
Patent TW-I235650-B (TW)
Title: Open type disposable diaper
Inventor: MITSUI KOUICHIRO
IPC: A61F5/44
Filed: 2004-05-26
Granted: 2005-07-11
Abstract: The object of the present invention is to provide an open type disposable diaper that has side flaps of front and rear waist regions overlapping each other that do not shift during wearing and prevent the diaper from slipping down from the wearing position. The solution of the present invention is an open type disposable diaper 1, comprising a body fluid absorbing zone 5 extending over a crotch region 3 further into front and rear waist regions 2, 4, side flaps 6, 7, 8 extending in a longitudinal direction outside transversely opposite side edges of the zone 5, and end flaps 9, 10 extending in a transverse direction outside longitudinally opposite ends of the zone 5. In the diaper 1, the side flaps 6 in the front waist region 2 are formed from a composite non-woven fabric 17 composed of a first fibrous non-woven fabric located on a non-skin-contact side and a second fibrous non-woven fabric located on skin-contact side that are laminated with each other. The first fibrous non-woven fabric has a kinetic friction coefficient higher than a kinetic friction coefficient of the second fibrous non-woven fabric.
Patent TW-I289818-B (TW)
Title: Optoelectronic device and electronic machine providing the device
Inventor: MURADE MASAO
IPC: G02F1/1362
Filed: 2004-06-01
Granted: 2007-11-11
Abstract: There are provided a plurality of connection terminals for external circuit over the peripheral area surrounding the image display area on the component substrate, multiple wires connected to each one end of the multiple connection terminals of the external circuit, and peripheral driving circuits connected to another end of the main wire to drive the pixel part based on the electrical signal provided through the connection terminal of the external circuit and the main wire. Moreover, the multiple main wires are distributed on the plane within the peripheral area in order not to cross each other upon being formed from the identical conductive film.
Patent TW-I273995-B (TW)
Title: Heat dissipating structure for a controller of an electromotive scooter
Inventor: LIN CHUN-MOUN
IPC: A61G5/04
Filed: 2004-06-03
Granted: 2007-02-21
Abstract: This invention relates to a heat dissipating structure for a controller of an electromotive scooter. The electromotive scooter is provided with a driving portion beneath its seat cushion. The driving portion is covered by a scooter body case. The scooter body case is provided therein with at least one battery, an electromotive motor, a differential gear, a scooter frame, a damper, a controller and a protection lid. The controller is installed in the protection lid via a heat dissipating plate. The protection lid is installed on the scooter frame. The bottom end of the heat dissipating plate is in contact with the scooter frame for increasing the heat dissipating area that contacts air, due to the area of the heat dissipating plate. The scooter frame also serves as a medium for dissipating heat due to the contact between the heat dissipating plate and the scooter frame. Therefore, the heat of the controller can be quickly dissipated into the air via the heat dissipating plate and the scooter frame, thereby enhancing the heat dissipation effect of the controller, so as to allow steady power transmission, while overcoming the defects of poor heat dissipation found in prior art that may affect the overall operation performance.
Patent TW-I236051-B (TW)
Title: A novel method of trimming technology
Inventor: TAO HUN-JAN
IPC: H01L21/3213
Filed: 2004-08-13
Granted: 2005-07-11
Abstract: A process for trimming a photoresist layer during the fabrication of a gate electrode in a MOSFET is described. A bilayer stack with a top photoresist layer on a thicker organic underlayer is patternwise exposed with 193 nm or 157 nm radiation to form a feature having a width w1 in the top layer. A pattern transfer through the underlayer is performed with an anisotropic etch based on H2/N2 and SO2 chemistry. The feature formed in the bilayer stack is trimmed by 10 nm or more to a width w2 by a HBr/02/Cl2 plasma etch. The pattern transfer through an underlayer gate layer is performed with a third etch based on HBr/02/Cl2 chemistry. The underlayer is stripped by an O2 ashing with no damage to the gate electrode. Excellent profile control of the gate electrode is achieved and a larger (w1-w2) is possible than in prior art methods.
Patent TW-I240420-B (TW)
Title: Semiconductor device
Inventor: TAKEDA YASUHIRO
IPC: H01L29/49
Filed: 2004-09-06
Granted: 2005-09-21
Abstract: This invention provides a semiconductor device which is a low temperature silicon TFT capable of withstanding a large current by suppressing as much as possible the deterioration of performance because of its own heating when driven with a large current. The semiconductor device of this invention includes a glass substrate (10), an active layer (12), a gate electrode (14) formed above the gate electrode (14) with a gate insulate on layer (13) interposed therebetween to form a TFT (thin film transistor). It is characterized in providing a heat dissipating bottom metal layer BM underneath a channel region (12c) or the entire active layer (12), the bottom metal layer BM being capable of dissipating outwards a Joule heat generated by the channel region (12c) when the TFT is driven. Moreover, the bottom layer BM is connected to the gate electrode (14) or a source region (12s) of the active layer (12).