baber/WOPTO huggingface dataset:
Patent TW-448608-B (TW)
Title: Motor control system
Inventor: ELY DAVID THOMAS ELIOT
IPC: H02P7/00
Filed: 1998-12-15
Granted: 2001-08-01
Abstract: An electric motor is described in which a position sensor is provided which generates a plurality of output signals each dependent upon the relative position of the rotor and the stator. These signals are processed to generate a set of commutation control signals for controlling the commutation of the drive current to the stator coils. In one embodiment, a phase shift can be electronically applied to each of the position sensor coils to adjust the timing of the switching in accordance with the motor's current speed and load demands. In another embodiment, these signals are also used in a servo-control loop, in order to control, for example, the speed and/or output torque of the motor.
Patent TW-434647-B (TW)
Title: Semiconductor device manufacturing method
Inventor: SAITO KAZUMI
IPC: H01L21/302
Filed: 1998-12-17
Granted: 2001-05-16
Abstract: In a semiconductor device manufacturing method, a gate insulating film is formed on a silicon substrate, a conductive film made of a conductive material is formed on an insulating film, an anti-reflection coating made of an organic material is formed on the conductive film, a photosensitive resist film is formed on the anti-reflection coating, a predetermined optical image on the photoresist film is developed by exposure to form a resist pattern, the anti-reflection coating is then selectively removed by dry etching using a plasma of a gas mixture containing oxygen gas, a reactive gas, and an inert gas, while using the photoresist pattern as a mask, thereby forming an anti-reflection pattern, and the conductive film is etched by using the resist pattern as a mask, thereby forming an electrode.
Patent TW-I246886-B (TW)
Title: Fungicidal mixtures based on amide compounds and morpholine or piperidine derivatives
Inventor: SCHELBERGER KLAUS
IPC: A01N1/00
Filed: 1998-12-18
Granted: 2006-01-11
Abstract: Fungicidal mixtures comprise as active components (a) an amide compound of the formula I: A-CO-NR1R2, in which A, R1 and R2 are as defined in the description, and (b) dimethomorph or flumetover, and/or (c) a valinamide of the formula III, in which, R13 is C3-C4-alkyl and R14 is naphthyl or phenyl, where the phenyl radical is substituted in the 4-position by a halogen atom, a C1-C4-alkyl or C1-C4-alkoxy group, and/or (d) benalaxyl, ofurace, metalaxyl, furalaxyl or oxydixyl, and/or (e) 1-(2-cyano-2-methoxyiminoacetyl)-3-ethylurea in a synergistically effective amount.
Patent TW-409379-B (TW)
Title: A semiconductor package and method for forming same
Inventor: CHEW CHEE HIONG
IPC: H01L23/495
Filed: 1999-01-15
Granted: 2000-10-21
Abstract: A flag frame (3) with support portions (5) and flag portions (7), and a clip frame (15) with support portions (17) and lead portions (19) are laser welded together at the support portions (5) and (17) in a predetermined alignment to each other, such that semiconductor dies (30) placed on the flag portions (7) are disposed between the flag portions (7) and the lead portions (19). A single reflow process conveniently causes solder paste between the semiconductor dies (30) and the flag portions (7), and between the semiconductor dies (30) and the lead portions (19), to form solder joints thereat.
Patent TW-497144-B (TW)
Title: Apparatus for monitoring photo resist stripper
Inventor: SHEN YUN-HUNG
IPC: H01L21/027
Filed: 1999-02-01
Granted: 2002-08-01
Abstract: The present invention provides an apparatus for synchronously monitoring the state of a photoresist stripper. In a wet stripping method, the photoresist is structurally destroyed by the photoresist stripper and broken into small particles dispersing in the solution so as to complete the photoresist stripping, and the solution can be reused after being processed by a filter. The apparatus in the present invention is thus applicable for synchronously monitoring the state of the filtered solution by an infrared detector to avoid the solution from being seriously contaminated due to the collapse of the filter which is not immediately recognized. The contamination will lead to the redeposition of the photoresist on the wafer surface and further the wafer defects.
Patent TW-407427-B (TW)
Title: Single-chip color cmos image sensor with two or more line reading structure and high-sensitivity interlace color structure
Inventor: CHEN DA-TONG
IPC: G06K7/10
Filed: 1999-02-08
Granted: 2000-10-01
Abstract: The present invention is directed to a single-chip color CMOS image sensor with a novel two or more line reading structure which is compatible with MOS fabrication technology. The invention allows the simultaneous reading of line signals from two rows of pixels so that combinations of signals from pixels in different rows may be obtained without the use of an external delay line device. The sensor includes a pixel array having superimposed thereon a color filter pattern and a two or more line reading structure. The reading structure includes sets of storage capacitors on which the pixel signals are stored, and a means for reading the signals from the capacitors in such a way that signals from pixels in different rows may be combined. The reading structure is external to the pixel array but may still be fabricated on the same CMOS chip as the pixel array. By using a high-sensitivity interlace color structure that allows complementary sets of every other row to be read during alternating even and odd fields, the sensitivity of the device as a whole can be effectively doubled.
Patent TW-410366-B (TW)
Title: Cleaning method and apparatus
Inventor: MOMOTAKE HIRONOBU
IPC: H01L21/00
Filed: 1999-04-15
Granted: 2000-11-01
Abstract: Cleaning liquid supply nozzles 32 are provided within a processing tank 30 for cleaning semiconductor wafers W. A distilled water source 31 and the cleaning liquid supply nozzles 32 are connected via a distilled water supply pipeline 33 and a chemical supply tank 36 and the cleaning liquid supply nozzles 32 are connected via a chemical supply pipeline 35. A flow-rate adjustment valve 37 is provided in the distilled water supply pipeline 33, and the supply of distilled water from the distilled water supply pipeline 33  to the processing tank 30 and the supply of a chemical from the chemical supply pipeline 35 to the processing tank 30 are switched by a switching valve 34. A temperature sensor 39 is disposed within the processing tank 30 for detecting the temperature of a processing liquid (the chemical or rinse liquid) therein and a CPU 40 controls the flow-rate adjustment valve 37 and the switching valve 34 on the basis of a temperature signal from the temperature sensor 39, so that the time required for the processing can be determined from the temperature of the cleaning liquid, thus improving the cleaning capability and cleaning precision.
Patent TW-412700-B (TW)
Title: Method of forming metal spring for thin pushbutton
Inventor: TSAI FU-YUAN
IPC: G06F3/023
Filed: 1999-04-23
Granted: 2000-11-21
Abstract: The present invention relates to a method of forming a metal spring for a thin pushbutton, which comprises: a gas withdrawing structure on a mold for a metal spring so that the gas withdrawing structure can adsorb and transport the metal spring after the metal spring is pressed by the mold; adhering the metal spring on a carrier by the gas withdrawing structure; closing the gas withdrawal of the gas withdrawing structure so that the metal spring can be adhered on a precise predetermined position on the carrier thereby accurately positioning the metal spring in order to reduce the probability  of a poor metal spring that can not meet the specification and reduce the overall production cost of the metal spring.
Patent TW-397764-B (TW)
Title: Manufacturing equipment for synchronously producing multiple faces and pieces of flat-type honeycomb paper core
Inventor: JANG JR-JIE
IPC: B31D3/02
Filed: 1999-04-30
Granted: 2000-07-11
Abstract: This is the manufacturing equipment for synchronously producing multiple faces and pieces of flat-type honeycomb paper core. It mainly consists of a machine base, a paper collecting device, and a trimming device. A tensile sensor is equipped with an original paper bracket at the output end of the original paper to precisely control the output tension. A glue collecting blade, which is equipped at the appropriate position of the glue-applying machine, precisely controls the glue amount. The paper collecting equipment has a paper-winding reel with a polygonal design such that the paper core prototypes formed by bonding two together can match the actions among an oscillation wheel, a retractile axle and a tension spring to obtain a tighter and firmer bonding during winding. Finally, a high quality supply requirement with a 100% good yield rate can be reached. A paper clamping device, which is on the paper winding reel plane, and some grooves on the adjacent faces are equipped. Thus, the paper prototype will be positioned precisely before trimming. The multiple faces and pieces of the paper prototype can be formed after completing the trimming operation.
Patent TW-440889-B (TW)
Title: Memory device and block writing method thereof
Inventor: HSU HUI-MIN
IPC: H01L21/00
Filed: 1999-05-19
Granted: 2001-06-16
Abstract: A memory device and a block write method thereof can simultaneously perform a block write operation to memory blocks of continuous 2n columns. According to this block write operation, firstly a memory device is provided. The memory device is consisted of a plurality of memory blocks. Each memory block separately has 2n columns (usually obtained by omitting n least significant bits of the column address of the memory device), and can perform a block write operation through a same data bus. Then, the data bus is cut into a plurality of sub-buses so that the 2n columns of each memory block can be evenly distributed to each sub-bus. Therefore, when each memory block needs to perform a block write operation through these sub-buses, the capacitance load that each sub-bus needs to withstand is much lower than a conventional data bus.
Patent TW-405191-B (TW)
Title: Wafer level packaging method and device formed
Inventor: KUNG LING-CHEN
IPC: H01L21/56
Filed: 1999-05-24
Granted: 2000-09-11
Abstract: This invention provides a wafer level packaging method and device which is capable of simultaneously packaging all dies in the wafer and separating each die by slicing from the wafer to reduce the cost of packaging. According to the technology of this invention, a top surface is provided to form a silicon wafer having a plurality of integrated circuit dies wherein each die has at least one peripheral I/O bond pad on the insulating layer, and then a metal conductive post is formed on the forgoing I/O bond pad, and coat an elastic layer with sufficiently elasticity and insulation onto the surface of the foregoing wafer; and deposit and form a metal wire on the elastic layer, and then produce an I/O bond pad with matrix array at the corresponding end of the metal wire. Finally, a solder ball is formed on the foregoing solder bump on the I/O bond pad, wherein the foregoing elastic layer acts as a stress buffering layer to produce a highly reliable integrated circuit having low-cost integrated circuit device by the wafer level packaging.
Patent TW-414971-B (TW)
Title: Semiconductor process chamber electrode and method for making the same
Inventor: KUTHI ANDRAS
IPC: H05H1/46
Filed: 1999-06-16
Granted: 2000-12-11
Abstract: Disclosed is a system for processing a semiconductor wafer through plasma etching operations. The system has a process chamber that includes a support chuck for holding the semiconductor wafer and a pair of RF power sources. In another case, the system can be configured such that the electrode is grounded and the pair of RF frequencies are fed to the support chuck (bottom electrode). The system therefore includes an electrode that is positioned within the system and over the semiconductor wafer. The electrode has a center region, a first surface and a second surface. The first surface is configured to receive processing gases from a source that is external to the system and flow the processing gases into the center region. The second surface has a plurality of gas feed holes that are continuously coupled to a corresponding plurality of electrode openings that have electrode opening diameters that are greater than gas feed hole diameters of the plurality of gas feed holes. The plurality of electrode openings are configured to define an electrode surface that is defined over a wafer surface of the semiconductor wafer. The electrode surface assists in increasing an electrode plasma sheath area in order to cause a shift in bias voltage onto the wafer surface, thereby increasing the ion bombardment energy over the wafer without increasing the plasma density.
Patent TW-424133-B (TW)
Title: Pipe coupling
Inventor: KATZ ODED
IPC: F16L19/08
Filed: 1999-08-23
Granted: 2001-03-01
Abstract: A pipe coupling includes a body member formed with a bore for receiving one end of a pipe to be coupled; a sealing ring and a compression sleeve recelvable within the bore; a radially-deformable gripping ring having one end abuttable against the compression sleeve; a securing nut threaded on the body member and engageable with the gripping ring to move the gripping ring axially and to effect a seallng action via the compression sleeve and the sealing ring, and also to compress the gripping ring radially to effect a gripping action of the pipe received in the bore; and an axially-extending limit element between the gripping ring and the body member effective to cause the nut, when tightened: (a) in an initial stage, to move the gripping ring and the compression sleeve until the limit element prevents further axial movement of the gripping ring; and (b) in a final stage, to radially deform the gripping ring to produce the gripping action, and then to compress the sealing ring against the internal annular shoulder of the body member to produce the sealing action.
Patent TW-470711-B (TW)
Title: Vibration proof device
Inventor: AKIMOTO MASAO
IPC: B60G13/02
Filed: 1999-11-20
Granted: 2002-01-01
Abstract: A vibration proof device, with simple structure, of present invention is provided, in which a damping force is effectively utilized through wheels and axles, thereby a specific damping device is not necessary. Moreover, the size of this device can be made smaller with a approximate-rolling structure. The device is suitable for supported means for low load to high load range. A vibration proof device is mounted between support means and supported means. The device comprises: lower rails in depressed form and fixedly mounted on said support means with the central part being formed as the lowest part; lower wheels engaged with said lower rails; lower axles by which said lower wheels can be rotably supported; upper rails in depressed form and fixedly mounted on said supported means with the central part being formed as highest part and being arranged in the opposite direction of upper side of said lower rails; upper wheels engaged with said upper rails; upper axles parallel to said lower axles, by which said upper wheels can be rotably supported; a housing with a support member by which said lower axles and said upper axles can be integrally connected with each other. Under vibration condition, each individual wheel can rotate about each individual axle independently and can be rotably displaced along individual rail so as to avoid any vibration.
Patent TW-449774-B (TW)
Title: Apparatus and method for processing substrate
Inventor: POKORNY JOACHIM
IPC: H01L21/00
Filed: 1999-12-04
Granted: 2001-08-11
Abstract: The present invention is about the apparatus and method for processing substrate, and is used for the purpose of decreasing the consumed amount of medium and decreasing the processing time. At least one first nozzle, which is installed approximately concentric with substrate, is use to introduce a fluid to the surface of substrate to be processed. And, multiple second nozzles, which can be individually controlled relative to the first nozzle, are used to introduce a fluid to the surface of substrate to be processed.
Patent TW-460903-B (TW)
Title: An apparatus for transporting die
Inventor: ONDRICEK DOUGLAS S
IPC: G01R31/01
Filed: 1999-12-03
Granted: 2001-10-21
Abstract: An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test board for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon.
Patent TW-448653-B (TW)
Title: Sever structure supporting client's terminal equipment
Inventor: CHIOU CHIUAN-CHENG
IPC: H04L12/00
Filed: 1999-12-21
Granted: 2001-08-01
Abstract: The invention discloses a server structure realizing supporting program execution for a portable workstation. The server structure at least includes a storage module storing multiple application programs controlled by the portable workstation; a communication module capable of converting a function operation to a data packet; a transmission module responsible for transmitting the data packet forwarded by the communication module via a network system to the portable workstation; and the driver of the simulation equipment that is located in between the application programs and communication module and is used to intercept the function operation of the application program controlled by the portable workstation for further sending the function operation to communication module. Moreover, the driver of the simulation equipment is also used to receive the control signal transmitted from the portable workstation and through the communication module, making the application program to acquire a correct input action.
Patent TW-463132-B (TW)
Title: Document analysis system and method
Inventor: SIMSKE STEVEN J
IPC: G06V30/40
Filed: 2000-01-12
Granted: 2001-11-11
Abstract: Disclosed is a document analysis system (100) and method. The document analysis system (100) includes an interim analyzer configured to perform an interim document analysis (433) to identify a number of interim regions (233) on a digital document (229) at an interim pixels-per-inch (PPI). The document analysis system (100) also includes a complete analyzer configured to perform a complete analysis (506) on at least one of the interim regions (233) at a second PPI, thereby generating at least one complete region therefrom. The document analysis system (100) and method provides significant flexibility to the user with a number of options relative to the analysis of the regions of information of interest in a digital document (229) and to limit analysis to such preferred regions.
Patent TW-425479-B (TW)
Title: Dynamically balanced microelectromechanical devices
Inventor: WEINBERG MARC S
IPC: G01C19/5719
Filed: 2000-05-30
Granted: 2001-03-11
Abstract: Dynamic balancing reduces quadrature bias in microfabricated vibrating instruments such as tuning fork gyros and other similarly functioning miniaturized mechanical structures so that a purity of motion is achieved in the absence of any angular rate inputs. Balancing is achieved by ablating or depositing onto support structures for tuning fork gyros rather than the proof mass itself a by melting and moving material on a tuning fork beam. Such adjusting is advantageously done during actual operation of the gyro by laser beam application through an encapsulating transparent cover which can be either part of the chip die or an external backage.
Patent TW-465204-B (TW)
Title: Delay code tracking loop employing multiple timing references
Inventor: CHEN YUN-YEN
IPC: H04B1/7085
Filed: 2000-04-07
Granted: 2001-11-21
Abstract: A code tracking system and method especially for use in direct sequence code division multiple access (DS-CDMA) communication systems employs multiple timing references within a chip by tracking the multiple timing references relative to the exact midpoint of the chip, then adjusting the timing references to the exact midpoint of the chip, and outputting an error tracking signal in accordance with the minimum error associated with the multiple timing references. The system performs effective code tracking with low lock-loss rate even when the noise of a receiving path interferes with detection of some of the timing references. The system uses multiple delay-locked loops for the different timing references.
Patent TW-447185-B (TW)
Title: Semiconductor laser device and method of producing same
Inventor: SHIMA AKIHIRO
IPC: H01S5/042
Filed: 2000-04-27
Granted: 2001-07-21
Abstract: A semiconductor laser device is of current blocking structure having a diode arranged in the reverse direction, wherein a high resistance layer is interposed between an electrode and a contact layer so as to generate a parasitic capacitance in series with that of the diode and get a rapid response by causing electric current not to flow through the contact layer in the direction laterally thereof. The semiconductor laser device includes (1) a substrate of a first conductive semiconductor, (2) a first cladding layer of the first conductive semiconductor formed on the substrate, (3) an active layer formed on the first cladding layer, and (4) a second cladding layer of a second conductive semiconductor formed on the active layer. The second cladding layer (4) includes a first and a second portion. The first portion is mesa-shaped in section and extends in a direction of an axis of a resonator to form an emitting stripe. The second portions extend on both sides of the first portion. The semiconductor laser further includes (5) a current block layer for blocking electrical current of the first conductive semiconductor which is adjacent to both sides of the first portion and (6) a second conductive first semiconductor layer on the current block layer. The current block layer forms a diode arranged in the reverse direction together with the second portion in the cladding layer. The semiconductor laser further includes (7) a first high resistance portion, (8) a second high resistance portion, and (9) an electrode layer. The first high resistance portion (7) is opposed to the current block layer at the bottom of the first semiconductor layer or adjacent to the first semiconductor layer and extends in a width narrower than that of the current block layer. The first high resistance portion (7) has an aperture for blocking current and blocks a lateral flow electric current in the first semiconductor layer. The second high resistance portion (8) is formed on the first semiconductor layer and is farther away from the current block layer than from the first high resistance portion. A capacitor is formed between the second high resistance portion and an electrode. The electrode layer (9) contacts with the first semiconductor layer through the aperture in the first high resistance portion.