baber/WOPTO huggingface dataset:
Patent TW-515085-B (TW)
Title: Semiconductor device, method of manufacturing the same and resistor
Inventor: IPPOSHI TAKASHI
IPC: H01L27/08
Filed: 2001-05-21
Granted: 2002-12-21
Abstract: Formed on an insulator (9) are an N- type semiconductor layer (10) having a partial isolator formed on its surface and a P- type semiconductor layer (20) having a partial isolator formed on its surface. Source/drain (11, 12) being P+ type semiconductor layers are provided on the semiconductor layer (10) to form a PMOS transistor (1). Source/drain (21, 22) being N+ type semiconductor layers are provided on the semiconductor layer (20) to form an NMOS transistor (2). A pn junction (J5) formed by the semiconductor layers (10, 20) is provided in a CMOS transistor (100) made up of the transistors (1, 2). The pn junction (J5) is positioned separately from the partial isolators (41, 42), where the crystal defect is thus very small. Therefore, the leakage current is very low at the pn junction (J5).
Patent TW-492935-B (TW)
Title: Packaging machine
Inventor: KAWAI OSATOMI
IPC: B65B13/04
Filed: 2001-06-19
Granted: 2002-07-01
Abstract: The invention relates to the structure of a packaging machine which is characterized in that the packaging is comprised of a main body, a vertical table 3 extending along an item to be packaged placed on a pallet, a band guide 7 which can be moved in a horizontal direction below the vertical table 3, a supporting mechanism for slidably supporting the band guide 7 within the main body, and wheels 17 arranged at the main body; wherein the main body is provided with a band feeding mechanism, a band bonding mechanism and a band cutting mechanism and the band guide 7 slides above the ground contacting surfaces of the wheels 17.
Patent TW-548664-B (TW)
Title: Split magnetic lens for controlling a charged particle beam
Inventor: RUBIN ALLAN I
IPC: H01J37/14
Filed: 2001-08-21
Granted: 2003-08-21
Abstract: A magnetic lens focuses a charged particle beam generated by an instrument to a very small spot for deriving characteristics of a sample. The magnetic flux pattern is created by splitting the winding coil into a primary coil and a secondary coil. This enables faster adjustment of the magnetic flux, and with improved resolution.
Patent TW-543261-B (TW)
Title: Refuelable and rechargeable metal-air fuel cell battery power supply unit for integration into an appliance
Inventor: FARIS SADEG M
IPC: H01M8/04
Filed: 2001-10-23
Granted: 2003-07-21
Abstract: A refuelable and rechargable metal-air FCB based power supply unit for integration into a device/system for generating and providing electrical power to at least one electrical-energy-consuming load device disposed therein. An external power source is used to recharge the metal-air FCB subsystems embodied therein. A control subsystem automatically transitions between discharging mode (wherein at least one metal-air FCB subsystem supplies electrical power to the electrical power-consuming load device) and a recharging mode (wherein the external power source is electrically coupled to at least one metal-air FCB subsystem to thereby recharge the metal-air FCB subsystem(s). The metal-air FCB subsystem(s) are refueled by manually loading and unloading metal-fuel from the metal-air FCB subsystem(s). Preferably, electrical power provided to the at least one electrical power-consuming load device is supplied solely by electrical power generated by discharging metal-fuel in the metal-air fuel cell battery subsystem(s). In addition, the metal-air FCB subsystem(s) preferably has a modular architecture that enable flexible and user-friendly operations in loading of metal-fuel, unloading of consumed metal-fuel, replacement of the ionic-conducting medium, and replacement of the cathode.
Patent TW-497014-B (TW)
Title: Mask structure and the manufacturing method thereof
Inventor: GAU JIAN-FU
IPC: G03F1/00
Filed: 2001-11-19
Granted: 2002-08-01
Abstract: A mask structure is disclosed, which comprises at least a transparent substrate, a light-blocking layer located on the transparent substrate, and a transparent conductive film covering the light-blocking layer and transparent substrate, wherein the light-blocking layer has an exposure pattern. Furthermore, the manufacturing method of this mask is to form a light-blocking layer having exposure pattern on the transparent substrate, and a transparent conductive film covering the light-blocking layer and transparent substrate.
Patent TW-519716-B (TW)
Title: Wafer bias drive for a plasma source
Inventor: LONG MAOLIN
IPC: H01J37/32
Filed: 2001-12-06
Granted: 2003-02-01
Abstract: A segmented chuck provides uniform processing of a workpiece (e.g., a wafer) with a plasma in a process chamber. The segmented chuck includes a segmented electrode having a plurality of sub-electrodes where the sub-electrodes are electrically isolated from one another by insulating connections and the segmented electrode defines a process surface that is adapted to receive the workpiece. The segmented chuck also includes a plurality of RF drivers for driving the sub-electrodes with RF biases, where the RF biases couple the workpiece with the plasma in the process chamber. By allowing the workpiece to be placed on the chuck, the coupling between the plasma and the workpiece is enhanced. By allowing the sub-electrodes to be independently driven by RF drivers, more uniform processing can be achieved with larger workpieces.
Patent TW-I231188-B (TW)
Title: Manufacturing method and apparatus of brush
Inventor: SATO HISAO
IPC: A46B3/02
Filed: 2001-12-18
Granted: 2005-04-21
Abstract: The object of the present invention is to provide a manufacturing method and apparatus of brush. The manufacturing method of a brush 6 includes inserting bristles 2 into a bristles insertion hole 55, and thereafter implanting the bristles in a resin base plate, which is characterized in preparing each individual sleeve 60 in correspondence to cross sectional shapes and cross sectional areas in the bristles insertion hole 55, introducing the bristles 2 to the sleeves 60, and inserting each of the bristle 2 in the sleeves 60 to the corresponding bristles insertion holes 55 by an extrusion pin 71.
Patent TW-591241-B (TW)
Title: Improved positioning and data integrating method and system thereof
Inventor: LIN CHING-FANG
IPC: G01S5/00
Filed: 2002-01-23
Granted: 2004-06-11
Abstract: An improved positioning and data integrating process and system can substantially solve the problems encountered in system integration for personal hand-held applications, air, land, and water vehicles, wherein an integrated global positioning system/inertial measurement unit, enhanced with optional other devices to derive user position, velocity, attitude, and body acceleration and rotation information, and distributes these data to other onboard systems, for example, in case of aircraft application, flight management system, flight control system, automatic dependent surveillance, cockpit display, enhanced ground proximity warning system, weather radar, and satellite communication system.
Patent TW-541680-B (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: NAKAOKA YUKIKO
IPC: H01L21/56
Filed: 2002-02-22
Granted: 2003-07-11
Abstract: A semiconductor device includes a first semiconductor chip provided with a first electrode on a first main surface and a second semiconductor chip provided with a second electrode on a second main surface. The first and the second semiconductor chips are integrated so that the first and second main surfaces are opposed to one another and the first and second electrodes are electrically connected. The second semiconductor chip is polished from the opposite side of the second main surface so that the second semiconductor chip has a thickness smaller than the thickness of the first semiconductor chip.
Patent TW-I260994-B (TW)
Title: Process for sulfur removal from hydrocarbon liquids
Inventor: SCHMIDT STEPHEN RAYMOND
IPC: B01J38/62
Filed: 2002-04-08
Granted: 2006-09-01
Abstract: The present invention is directed to a method of desulfurization of a sulfur laden hydrocarbon liquids that comprises contacting the liquid with a sponge nickel metal alloy, removing the sulfur free liquid, regeneration of the alloy by contact with an aqueous solution of an oxidant and reusing the alloy for further desulfurization of additional sulfur laden liquid.
Patent TW-591233-B (TW)
Title: Measurement of the coefficient of restitution of a golf club
Inventor: ERICKSON MATTHEW J
IPC: A63B59/00
Filed: 2002-04-09
Granted: 2004-06-11
Abstract: A method (100) and system (20) for predicting the coefficient of restitution of a golf club (30) or golf club head (36) is disclosed herein. The system (20) and method (100) are able to predict the COR in a non-destructive manner for a particular golf ball and impact speed. The system (20) and method (100) utilize a vibration sensor (24) attached to the face (34) of a golf club (30). The vibration sensor (24) is excited with an excitation device (26), and data is transmitted to an analyzer (22). A mathematical model of the golf club (30) is created allowing for the coefficient of restitution to be predicted without destroying the golf club (30).
Patent TW-I220177-B (TW)
Title: Wavelength division multiplexer with low sensitivity to temperature
Inventor: HWANG YU-WEN
IPC: G02B6/34
Filed: 2002-05-02
Granted: 2004-08-11
Abstract: There is provided a wavelength division multiplexer with low sensitivity to temperature. A hollow spacer ring is adhered between optical devices, and the optical devices are bonded by heating and curing epoxy resin or by using ultraviolet to cure bonding agent such as epoxy resin. The invention is characterized in compensating the temperature shift effect of the band-pass center wavelength caused by thermal stress on a filter by controlling the thermal expansion coefficient of the hollow spacer ring in a specific range, thereby obtaining a stable wavelength division multiplexer.
Patent TW-543234-B (TW)
Title: Electromagnetically coupled interconnect system architecture
Inventor: MILLER CHARLES A
IPC: H04B5/02
Filed: 2002-05-07
Granted: 2003-07-21
Abstract: An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.
Patent TW-589479-B (TW)
Title: Pixel structure
Inventor: SUEN WEN-TANG
IPC: G02F1/133
Filed: 2002-05-30
Granted: 2004-06-01
Abstract: A pixel structure of the present invention is formed of a thin-film transistor, a pixel electrode and plural storage capacitors allocated under the pixel electrode. Each storage capacitor is formed of an upper electrode, dielectric layer and a lower electrode. Both ends of the lower electrode of each storage capacitor are connected to a common line, so that each lower electrode arranged in parallel is in the state of parallel connection. Each upper electrode is electrically connected to the pixel electrode on top of it.
Patent TW-I278872-B (TW)
Title: Premises cable with glass fiber reinforcement
Inventor: PRIEST JAMES R
IPC: C03C25/26
Filed: 2002-05-31
Granted: 2007-04-11
Abstract: A premises cable (10) having a plurality of inorganic fibers (14) for protecting and suspending a plurality of optical fibers (12) within a polymer jacket (16). The inorganic fibers, preferably glass fibers, do not generate smoke or fire and thus offer an improvement over traditional polyaramid fibers used as reinforcement materials in premises cables. A sizing composition is applied to the inorganic fibers to prevent ribbonization of the inorganic fibers, thereby preventing attenuation of the optical fibers caused by such a ribbonization and also allowing a uniform distribution of glass fibers around the optical fibers to further protect the optical fibers.
Patent TW-I222536-B (TW)
Title: Flat-panel optical apparatus using tapered waveguide
Inventor: TRAVIS ADRIAN ROBERT LEIGH
IPC: G09F13/18
Filed: 2002-07-29
Granted: 2004-10-21
Abstract: A tapered-waveguide display apparatus includes an input waveguide 2 in the form of a slab, into one end of which light can be injected from a projector 6 so that it bounces along the waveguide and exits at the other end, and a tapered output waveguide 1 adapted to receive light from the input waveguide at its blunt end, that then bounces at ever steeper angles until it reaches the critical angle, at which point it is emitted from the face of the taper. In order to eliminate dark gaps in the display the tapered waveguide's thickness profile is varied so that light bounces the same number of times in total before leaving the tapered waveguide.
Patent TW-548196-B (TW)
Title: Safety cap for fluid dispensing cartridges
Inventor: ANTAL KEITH E SR
IPC: B41F31/08
Filed: 2002-08-15
Granted: 2003-08-21
Abstract: A removable safety cap (10) for use with an ink cartridge or other fluid holding container having a nozzle (34) extending from the dispensing end. The safety cap (10) prevents the flow of ink out of the cartridge or, if ink escapes past the dispensing nozzle seal, prevents the flow of ink outside the cap (10). The cap (10) also enables the ink cartridge to be set upright with the dispensing end down without the need for a nest or fixture to help support the cartridge.
Patent TW-571425-B (TW)
Title: Semiconductor module
Inventor: MATSUURA TETSUYA
IPC: H05K7/02
Filed: 2002-10-09
Granted: 2004-01-11
Abstract: A semiconductor module includes a substrate having a pad electrode on a surface, a lower layer semiconductor package mounted on the substrate, and an upper layer semiconductor package mounted on the substrate while arranged in a position substantially overlying the former. The pad electrodes connected to the leads of these semiconductor packages are arranged alternately. The lead has a dambar residual portion. An inner surface of a lead downward portion of the upper layer semiconductor package is positioned outside an outer surface of a lead downward portion of the lower layer semiconductor package.
Patent TW-584812-B (TW)
Title: Video artifact identification and counting
Inventor: LIN CHIEN-HSIN
IPC: H04N19/86
Filed: 2002-10-17
Granted: 2004-04-21
Abstract: Artifact detection and counting is enhanced using looping in both the horizontal and vertical direction is enhanced via a reduced bandwidth for accumulation of count values into count table entries. According to an example embodiment of the present invention, first and second loops are made for horizontal and vertical count table entries. Quotient and remainder values of a detected artifact value are used for increasing count table entries in the first looping pass, and the count table entries are increased using the quotient value in the second loop. The table increase in the first loop is limited to the length of the remainder value, and the table increase in the second loop is limited to the length of the row or column in the count table being used. In this manner, latency for additions to the count table and the bandwidth for making the additions are reduced, relative to conventional applications. In addition, each entry into the table can be reduced to one addition.
Patent TW-569416-B (TW)
Title: High density multi-chip module structure and manufacturing method thereof
Inventor: HO KWUN-YAO
IPC: H01L23/538
Filed: 2002-12-19
Granted: 2004-01-01
Abstract: The invention discloses a high density multi-chip module structure and the manufacturing method thereof. First of all, an insulating layer and a multilevel interconnect structure are formed on an integrated circuit substrate, wherein the multilevel interconnect structure has a first surface comprising a plurality of first bonding pads and a second surface comprising a plurality of second bonding pads. Then the integrated circuit substrate is thinned by a polishing process, and the integrated circuit substrate and the insulating layer are etched through to form a plurality of holes by etching processes and expose the second bonding pads. Next a metal material is filled in the holes to form conductive plugs and a plurality of third bonding pads are formed on the conductive plugs. Finally, at least one chip can be electrically connected to the third bonding pads and a flip-chip package process is performed to complete the multi-chip module structure of the invention.
Patent TW-I222622-B (TW)
Title: Robotic vision-audition system
Inventor: NAKADAI KAZUHIRO
IPC: G10L21/0208
Filed: 2003-02-17
Granted: 2004-10-21
Abstract: A robotic vision-audition system includes an audition module (20), a face module (30), a stereo module (37), a motor control module (40), and an association module (50) for controlling each module. The audition module (20) includes an active direction passing type filter (23a) having a pass range which varies, according to correct information of sound source direction from the association module (50), such that the pass range is minimum at a front direction and is enlarged with the enlargement of the angles in right and left directions, to perform a sound source separation by collecting subbands having an inter-ears phase difference (IPD) or an inter-ears intensity difference (IID) and re-constructing the wave forms of the rounds from source. The audition module (20) further performs a recognition of sounds separated from the sounds from the source, by recognising sound signals separated by a plurality of audio models (27d), consolidating the results of sound recognitions of each audio module by selector (27e), and determining the most reliable sound recognition result from these sound recognition results.
Patent TW-I293728-B (TW)
Title: Network!ai/o processors!aadaptors and operation methods thereof
Inventor: HULBBERT SMITH
IPC: G06F12/00
Filed: 2003-02-18
Granted: 2008-02-21
Abstract: A network in which one embodiment of the present invention may be practiced may include first and second network nodes coupled together via a network communications link, and first and second sets of mass storage devices associated with the first and second network nodes, respectively. The first and second network nodes may comprise first and second input/output (I/O) processors, respectively. The first I/O processor may cause, in response to a first request, both the execution of a first data storage-related operation associated with the first set of mass storage devices and the issuance of a second request from the first network node to the second network node via the link to cause the second I/O processor to perform, in response to the second request, a second data storage-related operation associated with the second set of mass storage devices.
Patent TW-I254650-B (TW)
Title: Method and device for manufacturing hollow fiber film module
Inventor: IDE MASARU
IPC: B01D63/02
Filed: 2003-02-24
Granted: 2006-05-11
Abstract: A centrifugal manufacturing device 1 is provided for manufacturing hollow fiber film module by a centrifugal force, wherein a module case and at least one end of the hollow fiber film received inside the module case are attached with potting resin. A potting part 3 at one end of the hollow fiber film module 2 is supported by a fixing fitment 4. A centrifugal machine 11 is driven to provide a centrifugal force. The fixing fitment 4 is provided with a heating unit 8 and a temperature-detecting unit 8. The temperature of the fixing fitment 4 is controlled according to the temperature difference between a preset temperature and the temperature of the fixing fitment 4 that is detected by the temperature-detecting unit 8, and the temperature difference is controlled within 4 Centigrade. During adding centrifugal force, a pressure-reducing machine 17 reduces the pressure of the potting part 3. The leak of the potting resin can be further prevented.
Patent TW-I230102-B (TW)
Title: Component mounting method, component mounting apparatus, and ultrasonic bonding head
Inventor: MINAMITANI SHOZO
IPC: B23K20/10
Filed: 2003-03-10
Granted: 2005-04-01
Abstract: The component mounting apparatus of the present invention includes: a component feeder (20) that feeds a component (2) with its bump electrodes facing down; a mounting head (5) that mounts the component onto a substrate (3); a supporting base (8) that secures the substrate; and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes: an ultrasonic vibration generator (24); an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as the vibration parallel thereto; a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto; and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is performed with high reliability even if the component has a number of bump electrodes (2a) on its surface.
Patent TW-I223892-B (TW)
Title: Semiconductor device having integrated capacitor structure and its manufacturing method
Inventor: BENETIK THOMAS
IPC: H01L21/822
Filed: 2003-03-14
Granted: 2004-11-11
Abstract: The present invention is related to a semiconductor device. On the intrinsic semiconductor substrate, an insulation layer is formed, and a capacitor structure (K) is formed in the insulation layer. The capacitor structure (K) at least has two metal layers (1--7), which are disposed parallel to each other and are respectively connected to one connection line. At least one conduction region (1a--1j, 2a--2j, 31a--36a, 41a--46a, 5a--5f) for forming capacitor surface is disposed between the metal layers (1--7), and the conduction region (1a--1j, 2a--2j, 31a--36a, 41a--46a, 5a--5f) forms an electrically conductive connection with only one metal layer of the metal layers (1--7).
Patent TW-I225676-B (TW)
Title: Substrate treatment device
Inventor: YOSHITANI MITSUAKI
IPC: B08B3/00
Filed: 2003-03-27
Granted: 2004-12-21
Abstract: The present invention provides a device capable of preventing a carriage roller or the internal wall face of a treatment tank from being contaminated by a treatment solution containing solidification components at the time of treating a substrate by carrying the substrate in the treatment tank, and supplying the treatment solution to the substrate. A solution storage container 12 is disposed immediately under a carriage roller 10 brought into contact with the lower face side of a substrate 1 for supporting and carrying the substrate. A developing solution is supplied to the solution storage container. The solution storage container is constantly filled with the developing solution 14. A part of the peripheral face of the carriage roller is immersed in the developing solution filled in the solution storage container.
Patent TW-I237999-B (TW)
Title: Dc level control method, clamp circuit, and imaging apparatus
Inventor: HISAMATSU YASUAKI
IPC: H04N5/357
Filed: 2003-05-30
Granted: 2005-08-11
Abstract: A dc level control method for holding a dc level of a clamp portion in an electric signal to be a prescribed value is disclosed, wherein the method comprises the steps of: comparing a dc level of a sampling interval in said electric signal with a predetermined reference value to obtain a difference between said dc level and said reference value using an A/D converting section for dc level comparison which has a lower bit resolution than an A/D converting section for digital signal processing of said electric signal; and feeding back a clamp signal to said electric signal so that said obtained difference between said dc level and said reference value substantially becomes zero. This method is suitable for applying to a signal processing system for a solid state imaging apparatus.