baber/WOPTO huggingface dataset:
Patent JP-2008287181-A (JP)
Title: Projection lens and projection type display device using the same
Inventor: YAMAMOTO TSUTOMU
IPC: G02B13/00
Filed: 2007-05-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a projection lens which has a wide angle and high projection performance while securing a long back focus, and where an inexpensive light reflection mirror is used as a light reflection element for bending an optical path.  <P>SOLUTION: The projection lens is constituted by arranging a first lens group G<SB>1</SB>having negative refractive power and a second lens group G<SB>2</SB>having positive refractive power in order from an enlargement side, and its reduction side is made nearly telecentric. A three-lens cemented lens L<SB>10</SB>- L<SB>12</SB>obtained by cementing three lenses is arranged in the second lens group G<SB>2</SB>, and space between the first lens group G<SB>1</SB>and the second lens group G<SB>2</SB>is set to a maximum adjacent lens spacing (maximum distance) so that the reflection mirror 4 can be inserted. Furthermore, the projection lens satisfies eight conditional expressions.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007214598-A (JP)
Title: Bonded semiconductor substrate and semiconductor light emitting element
Inventor: FURUKAWA KAZUYOSHI
IPC: H01L33/30
Filed: 2007-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a bonded semiconductor substrate which is stably brought into close contact with an epitaxial growth layer formed on a semiconductor substrate directly and over the entire surface, and to provide a semiconductor light emitting element.  <P>SOLUTION: A method of manufacturing the semiconductor light emitting element comprises processes of: epitaxially growing an alloy In<SB>x</SB>(Ga<SB>1-y</SB>Al<SB>y</SB>)<SB>1-x</SB>P compound semiconductor on a GaAs substrate 12 to fabricate an epitaxial wafer having an n-type clad layer 14 (0.45<x<0.50, 0≤y≤1), active layer 15, p-type clad layer 16, and cover layer 17; removing the cover layer 17 by etching to expose the surface of the p-type clad layer 16; placing a mirror-finished GaP substrate 11 on the p-type clad layer 16 in such a manner that the mirror-finished face may be in contact with the p-type clad layer 16, and then integrally joining it to p-type clad layer 16 at room temperature; conducting a heat treatment; carrying out etching from the GaAs substrate 12 side to expose the n-type clad layer 14; and forming electrodes 19 on the front face of the n-type clad layer 14 and on the rear face of the GaP substrate 11, respectively.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008290287-A (JP)
Title: Liquid droplet discharge apparatus
Inventor: MURAYAMA KOICHI
IPC: B05C5/00
Filed: 2007-05-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid droplet discharge apparatus which can confirm histories of a used liquid.  <P>SOLUTION: An inkjet printer 11 has a printing part 13 which carries out printing to a printing paper, and a cleaning part 14 which cleans by sucking an ink 31 in an ink nozzle 32. Moreover, the inkjet printer 11 has an ink collecting part 15 which collects the ink 31 by discharging the ink 31 to a chromatographic sheet 33, and a storing part 16 which stores the chromatographic sheet 33 on which the ink 31 is collected. The ink collecting part 15 carries out collection of the ink 31, for example, when an ink cartridge is replaced. When the ink nozzle 32 clogs, the stored chromatographic sheet 33 is taken out, and a color material of the ink 31 is separated by making it into contact with a developing liquid, whereby the kind of the used ink 31 is specified.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008290306-A (JP)
Title: Heat-sensitive recording material
Inventor: TSUGAWA HIROAKI
IPC: C08G59/62
Filed: 2007-05-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat-sensitive recording material which shows excellent color developing properties and color-developed image shelf stability and also, is almost free from texture fogging to the dry heat and heat/humidity of an undeveloped color part (an unused part).  <P>SOLUTION: This heat-sensitive recording material has a heat-sensitive color developing layer containing a normally colorless or pale-color developing compound and a developing compound which thermally makes the color developing compound develop a color, formed on a support. In this recording material, the heat-sensitive color developing layer contains a specific bisphenol compound as a developing compound and an epoxy compound shown by formula (4), provided, however, that in the formula (4), "n" is an integer of 1 to 25.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008291906-A (JP)
Title: Tank
Inventor: IIDA YASUYUKI
IPC: F17C13/00
Filed: 2007-05-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tank in which a magnitude of an external impact can be detected.  <P>SOLUTION: The tank 100 is used for storing a gas, and a thermal storage material layer 12 is provided on the outer surface of a tank body 10. Then an impact-recording layer is provided on the outer surface of the thermal storage material layer 12. The impact-recording layer is provided on the outermost layer of the tank 100 and consists of a heat-insulator layer 14 having a heat insulating function which retains or records deformation caused by an impact.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008290355-A (JP)
Title: Printing apparatus
Inventor: TAKASHIMA SHIRO
IPC: H01S5/0683
Filed: 2007-05-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printing apparatus capable of improving printing quality.  <P>SOLUTION: Characteristics of a laser unit is grasped by means of a laser output adjusted at the time of shipment from a factory and a monitor current of the laser output, which enables desired setting of a laser output to be continuously switched, thereby performing control with a desired laser output.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007298524-A (JP)
Title: Method for evaluating emulsified composition
Inventor: KIDO HIROTSUGU
IPC: G01N3/00
Filed: 2007-05-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for evaluating an emulsified composition which is made general-purpose, safe, moderate on human bodies, is easy to disperse and more superior in emulsification stabilizing effects, and has no unnecessary foaming in its homogenizing operation.  <P>SOLUTION: In the method for evaluating the emulsified composition, the emulsified composition is expanded on a water surface, the collapse pressure of the emulsified composition is measured, which is defined as a surface pressure value, when a solid membrane collapses on a π-A isothermal line obtained by compressing it from outside, and an emulsification capability of the emulsified composition is determined from the measured value. If the measured value of the collapse pressure is in the range of 50-58 mN/m, it can be determined that the emulsified composition has preferred emulsification performance.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007210348-A (JP)
Title: Ink drop injection apparatus
Inventor: KITAMI AKIKO
IPC: B41J2/045
Filed: 2007-05-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ink drop injection apparatus which make each sub-drop coalesce certainly in flight to form a target super-drop without complicating a driving circuit or complicating control.  <P>SOLUTION: The ink drop injection apparatus, wherein a first pulse enlarging a volume of an ink channel, a second impulse reducing a volume of the ink channel following the first pulse, a driving pulse consisting of a period of a null voltage following the second impulse are impressed to an electricity/machine conversion means of an ink drop injection apparatus including an ink channel, an electricity/machine conversion means changing a volume of the ink channel, and a nozzle delivering an ink to make an ink drop fly, wherein the driving pulse in which a width of the first pulse is substantially set in AL (a half of an acoustic resonance period) of the ink channel is continuously impressed one of the ink channels, thereby many ink drops are continuously discharged so that a flight speed of an ink drop discharged out from the nozzle after may be faster than a flight speed of an ink drop dischaged out on ahead to form a high-concentration image, and wherein a period of the null voltage is substantially longer than the AL and is substantially shorter than 2 AL, and a width of the second impulse is substantially shorter than two times of the AL.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008298883-A (JP)
Title: Image forming apparatus, image holder, and image holder unit
Inventor: AOYANAGI KEIICHI
IPC: G03G21/00
Filed: 2007-05-29
Abstract: <P>PROBLEM TO BE SOLVED: To protect the surface of a photoreceptor from external light with a simple configuration.  <P>SOLUTION: An image forming apparatus (U) includes: cleaners (CLy-CLk) for cleaning image holders (Py-Pk) by removing shading layers (1, 4, 11, 21) of the surface of the image holders (Py-Pk) covering an exposure face exposed to the outside by the shading layers (1, 4, 11, 21) comprising a shading material (3); development units (GY-GK, Gy-Gk) for developing latent images on visual images formed by latent image forming apparatuses (ROSy-ROSk) on the surface of the image holders (Py-Pk) charged with charging units (CCy-CCk, CRy-CRk) for charging the surface of the image holders (Py-Pk) removing the shading layers (1, 4, 11, 21); and transfer units (T1y-T1k) for transferring the visual images of the image holders (Py-Pk) on a medium.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008300460-A (JP)
Title: Optical semiconductor device
Inventor: OTSUKA KAZUAKI
IPC: H01L33/32
Filed: 2007-05-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which a plurality of phosphors are made to efficiently emit light and which little deteriorates a package by emitted light.  <P>SOLUTION: The optical semiconductor device is provide with a semiconductor light-emitting element 11, the package 13 having a recess 12 and storing the semiconductor light-emitting element 11 in the recess 12, a first phosphor layer 14 which is formed on an opening-side of the recess 12 of the semiconductor light-emitting element 11, is excited by light from the semiconductor light-emitting element 11 and emits fluorescence of a first wavelength longer than a light-emitting wavelength of the semiconductor light-emitting element 11, a second phosphor layer 15 which is formed on a base side of the recess 12 of the semiconductor light-emitting element 11, is excited by light from the semiconductor light-emitting element 11 and emits fluorescence of a second wavelength longer than the first wavelength, and a third phosphor layer 16 which is formed on a side of the semiconductor light-emitting element 11, is excited by light from the semiconductor light-emitting element 11 and emits fluorescence of a third wavelength longer than the first wavelength.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008297373-A (JP)
Title: Underfill material comprising liquid epoxy resin composition, and flip chip type semiconductor device
Inventor: OGAWA YASUSHI
IPC: C08L63/02
Filed: 2007-05-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an underfill material having low viscosity, excellent in workability and forming a cured material excellent in close adhesion with the surface of a silicon chip, especially with a photosensitive polyimide resin or silicon nitride film, and a flip chip type semiconductor device encapsulated with the underfill material.  <P>SOLUTION: This underfill material comprises (A) a bisphenol A type epoxy resin having 40 to 60°C melting point and also having <360 weight-average molecular weight, (B) an aromatic amine-based curing agent, (C) an inorganic filler treated with a silane-coupling agent, and (D) a liquid epoxy resin composition containing a stress relaxation agent, and has 0.1 to 0.3 Pa s viscosity at 90°C.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008295658-A (JP)
Title: Sprinkler fire extinguishing equipment
Inventor: ABE MASAO
IPC: A62C35/68
Filed: 2007-05-30
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate water in a secondary side pipe or to close it to eliminate water loss when a sprinkler head malfunctions.  <P>SOLUTION: The sprinkler fire extinguishing equipment of a pre-action type is provided with: a pre-action valve for supplying water for extinguishing fire from a water source via a primary side pipe; a closed-type sprinkler head provided for the secondary side pipe from the pre-action valve, and is further provided with: a three way type switch valve equipped for the pre-action valve to drain water for extinguishing fire; and a water draining mechanism which is branched from the secondary side pipe, is provided for a down conduit to install a closed type sprinkler head, and drains the water for extinguishing fire through the down conduit. When the closed type sprinkler head malfunctions, there is little water loss.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008300561-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: HATAE MASAHIRO
IPC: H01L23/36
Filed: 2007-05-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which the thickness of a heat radiating resin can be controlled with high precision.  <P>SOLUTION: The manufacturing method of the semiconductor device includes a step for flip-chip bonding a semiconductor chip 22 to a wiring board 10. The wiring board 10 where the semiconductor chip 22 is flip-chip bonded is mounted on a table 51, and a heat spreader 32 is supported by a bonding head 52. A first displacement gage 57 at a constant height from the table 51 measures a difference (a) in height between the first displacement gage 57 and the heat spreader 32. A second displacement gage 58 at a constant height from the bonding head 52 measures a difference (b) in height between the second displacement gage 58 and the reverse surface of the semiconductor chip 22. The reverse surface of the semiconductor chip 22 is coated with the heat radiating resin 31. The heat spreader 32 is bonded to the reverse surface of the semiconductor chip 22 with the heat radiating resin 31 interposed by lowering the bonding head 52 by a+b-c-d, where (c) is the difference in height between the first displacement gage 57 and the second displacement gage 58 and (d) is a target thickness of the heat radiating resin 31.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008253978-A (JP)
Title: Production method and application by catalyst which contains nano gold and is loaded on manganese oxide / iron oxide
Inventor: CHIN IKUBUN
IPC: B01J37/02
Filed: 2007-06-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a production method and application by a catalyst which contains nano gold and is loaded on manganese oxide / iron oxide.  <P>SOLUTION: The manganese oxide and the iron oxide are mixed in a different element ratio and a gold particle is not more than 5 nano. Carbon monoxide is selectively oxidized and a carbon monoxide concentration in a hydrogen stream is reduced to 100 ppm by a gold-containing manganese oxide / iron oxide catalyst in the presence of the carbon monoxide, oxygen, hydrogen, and helium in a molecular ratio of 0.5-2 of the hydrogen / the carbon monoxide using a continuous-type packing bed reactor. Accordingly, toxification due to the carbon monoxide of the electrode of a fuel cell is avoided.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008298247-A (JP)
Title: Damper
Inventor: SAKAI SHIZUKA
IPC: F16F9/32
Filed: 2007-06-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a damper capable of enhancing the flexibility in design.  <P>SOLUTION: The damper D is equipped with a cylinder 1, a piston 2 to partition the cylinder 1 into two pressure chambers A and B, and a swirl generating means 3 to swirl the fluid in the pressure chamber A/B enlarging when the operation is started, in which the damping force is generated not through such a process as giving a resistance to the fluid in passage using a damping valve and producing a differential pressure between the two pressure chambers, but through a process to generate a swirl in the fluid in the pressure chamber which enlarges when the operation is started and produce a differential pressure between the two pressure chambers, so that a designer can have a choice other than adopting a damping valve as a damping force generating element, which enhances the flexibility in designing the damper.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008305295-A (JP)
Title: Security protective device, security protecting method, security protection program and security protection integrated circuit
Inventor: KATO KAZUTOMI
IPC: G06F21/12
Filed: 2007-06-11
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem that additional processing affects a program operation speed and memory consumption when the additional processing is required for confirming that no rewriting occurs in order to prevent an illegal instruction code by buffer overflow from being executed for the protection of program operation.  <P>SOLUTION: An address space composed of an address including a termination character to be used to determine a processing end is properly generated on the basis of hardware information of a computer, and an address of a system function to be protected from illegal use is allocated to the address space to thereby prevent rewriting by buffer overflow and maintain security without deteriorating speed performance and increasing memory consumption.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007335867-A (JP)
Title: Method of limiting vacancy diffusion in heterostructure
Inventor: HEBRAS XAVIER
IPC: H01L21/02
Filed: 2007-06-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a heterostructure comprising at least a first layer (102), made of a semiconductor material on a second layer (101) made of another material different from the material of the first layer, and to prevent the elements of the semiconductor material from diffusing into the first layer (102) or into neighboring layers due to vacancy mechanism.  <P>SOLUTION: The method includes a step (S2) of enriching interstitial defects (105a) of the first layer (102), in order to limit the elements of the first layer from vacancy diffusion.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008309591-A (JP)
Title: Resistance type humidity sensor
Inventor: OZAKI SHINJI
IPC: G01N27/12
Filed: 2007-06-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a resistance type humidity sensor capable of easily converting output of the resistance type humidity sensor to relative humidity while cutting a corresponding map.  <P>SOLUTION: A resistance type humidity sensor 1 is provided with a humidity sensor element 20 of which the impedance changes according to relative humidity and a processing circuit for processing the output of the humidity sensor element 20. The processing circuit comprises: a first magnifying circuit 90 magnifying the output of the humidity sensor 20 at a first magnification rate for detecting relative humidity which is higher than predetermined relative humidity (for example 30%RH); a second magnifying circuit 80 for magnifying the output of the humidity sensor element 20 at a second magnification rate for detecting relative humidity which is lower than predetermined relative humidity; and a transistor 70 for switching the first and the second magnifying circuits 80, 81.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008286511-A (JP)
Title: Solar energy water heater
Inventor: ENAMI TOMOTADA
IPC: F24S90/00
Filed: 2007-05-18
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem that global warming has been promoted by increase of carbon dioxide in the atmosphere causing abnormal weather, and usage of metal hydrade as a new energy source is being paid attention to, but hot water is required to obtain metal hydrade, and energy is required therefor.  <P>SOLUTION: Sunlight is collected to make hot water, and power is generated by the steam, while at the same time, metal hydrade is collected by the boiled water.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007234620-A (JP)
Title: Charged particle beam device
Inventor: OSE YOICHI
IPC: H01J37/147
Filed: 2007-06-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a charged particle beam device with little deterioration of resolution capability even if beams are inclined to a test piece.  <P>SOLUTION: A means is provide in which the orbit of primary beams 4 is made to pass through the outside of axis by a deflector or a movable stop against a plurality of lenses 6, 7 and, by controlling the outside-of-axis orbit, the aberration generated by the objective lens 7 at the time of beam inclination is canceled by the aberration of other lens 6.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008307859-A (JP)
Title: Method for producing sandwich panel
Inventor: SEGI YASUHIRO
IPC: B29C39/18
Filed: 2007-06-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a sandwich panel in which a belt-shaped face-material is formed by connecting a plurality of rectangular plate face-materials easily and surely, and consecutive foaming is possible even when a panel is produced by using the rectangular plate face-materials.  <P>SOLUTION: The method includes a process in which the rectangular plate face-materials are installed in turn so that the downstream side edge 1d of the rectangular plate face-material 1 installed successively is laid on the upstream side edge 1c of the rectangular plate face-material 1 installed precedently on a conveyer 3, a process in which an adhesive 2 is applied on the upper surface side of the upstream side edge 1c of the rectangular plate face-material 1 installed precedently and/or on the lower surface side of the downstream side edge 1d of the rectangular plate face-material 1 installed successively, and the rectangular plate face-material 1 is joined to the upstream side edge 1c of the rectangular plate face-material 1 installed precedently by its own weight to form a belt-shaped lower face-material 8, a process for supplying a belt-shaped upper face-material 4, a process in which a polyurethane foam foaming stock solution composition is supplied from a mixing head 9 on the lower face-material 8 and foamed/cured between the upper and lower face-materials to form a belt-shaped panel, and a process for cutting the belt-shaped panel in a prescribed length.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009000867-A (JP)
Title: Liquid discharging device and liquid discharging method
Inventor: TAKAHASHI TORU
IPC: B41J2/01
Filed: 2007-06-20
Abstract: <P>PROBLEM TO BE SOLVED: To extend the life of a head on the whole by averaging a load on the whole nozzle.  <P>SOLUTION: This liquid discharging device comprises a first nozzle row with a plurality of nozzles for discharging liquid drops on a medium to form dots on the medium, arranged at the predetermined nozzle pitch in a direction which intersects a moving direction relative to the medium; a second nozzle row with a plurality of nozzles for discharging liquid drops on the medium to form dots on the medium, arranged at the predetermined nozzle pitch in a direction which intersects a moving direction relative to the medium, and shifted in the arranged direction of the nozzles with respect to the position of the first nozzle row; and a controller which selects partial nozzles out of the plurality of nozzles in the first nozzle row and second nozzle row, controls the discharge of liquid drops from the selected nozzles to form dot rows in the arranged direction of the nozzles, and forms the dot row while changing the selected partial nozzles.  <P>COPYRIGHT: (C)2009,JPO&INPIT