baber/WOPTO huggingface dataset:
Patent JP-2010087867-A (JP)
Title: Frame frequency conversion apparatus, frame frequency conversion method, program for achieving the method, computer readable recording medium recording the program, motion vector detection apparatus, and prediction coefficient generation apparatus
Inventor: TAKEDA NAOKI
IPC: G09G3/20
Filed: 2008-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To select an optimum one of a plurality of candidate vectors, and correctly detect a motion vector on a boundary of an object in an image.  <P>SOLUTION: A motion estimation section 3 estimates a plurality of candidate vectors by representative point matching. A pixel generation section 4 performs product-sum operation on taps of frames determined from the candidate vectors and prediction coefficients stored in advance, to generate a predicted pixel of a predicted frame corresponding to an existing frame. A motion allocation section 5 determines the absolute value of a difference between each predicted pixel of the predicted frame input from the pixel generation section 4, and a pixel of the existing frame. The motion allocation section 5 selects a candidate vector in a predicted pixel having a minimum absolute difference. As a result, the optimum candidate vector can be selected from the plurality of candidate vectors.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010085833-A (JP)
Title: Blue resist composition
Inventor: UDAKA KOJUN
IPC: G02B5/20
Filed: 2008-10-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a highly sensitive resist composition to be exposed and cured by using yttrium alminum garnet (YAG) laser, wherein blue pixels for a color filter can be obtained by using the YAG laser.  <P>SOLUTION: A blue resist composition is cured by using the YAG laser, wherein the blue resist composition comprises: a clear resist (a); a blue pigment (b); a fluorochemical surfactant (c); at least one compound (z) selected from compounds expressed by respective chemical formulae (1) (2) and (3); and a YAG laser polymerization initiator (d) containing an activated energy line photopolymerization initiator.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010083836-A (JP)
Title: Method for producing epoxy compound, and catalyst
Inventor: NAKANISHI MASATAKA
IPC: B01J27/24
Filed: 2008-10-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a suitable oxidation catalyst which is easily removable and also suitable for the oxidation reaction in a method for producing an epoxy compound by the oxidation of a carbon-carbon double bond.  <P>SOLUTION: This method for producing the epoxy compound is characterized by oxidizing the compound having the carbon-carbon double bond by using tungstic acid, a quaternary ammonium salt, buffer solution and hydrogen peroxide, then precipitating the catalyst containing the tungstic acids and quaternary ammonium salt, and separating it from reaction liquid.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010090745-A (JP)
Title: Fuel tank for automobile
Inventor: KAMIO JUNICHI
IPC: F02M37/00
Filed: 2008-10-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a simply-structured fuel tank used for gasoline-alcohol mixed fuel.  <P>SOLUTION: This fuel tank 1 provided with a main tank 2, a water tank 3, and a separation tank 4 includes a mixed fuel supply means 6 supplying mixed fuel to the separation tank 4, a water supply means 14 supplying water to the separation tank 4, and a circulation means 17 circulating gasoline to the main tank 2 in association with a rise in an alcohol-water mixed liquid level in the separation tank 4. The fuel tank may be provided with a first supply means 6 supplying mixed fuel to an engine and a second supply means 21 supplying separated alcohol-water mixed liquid to the engine. The separated gasoline may be stored in a gasoline tank 32 before being circulated to the main tank 2. Further, the fuel tank may be provided with stop means 9 stopping the mixed fuel supply means 6 and water supply means 14. Furthermore, the fuel tank may be provided with an alcohol concentration detection means 11 and a means 9 for controlling water volume to be supplied.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010089126-A (JP)
Title: Apparatus for manufacturing expand metal for fuel cell
Inventor: TANAKA TAKUMI
IPC: H01M8/02
Filed: 2008-10-08
Abstract: <P>PROBLEM TO BE SOLVED: To stabilize the shape accuracy of meshes which are formed with a die by preventing the progress of wear of the die for forming the meshes on a planar material.  <P>SOLUTION: An apparatus for manufacturing an expand metal for a fuel cell is provided with: a die 50 including die 34, a lower receiving blade 38 which is adjacent to the downstream side in the FD (forwarding direction) direction to the die 34 and an upper blade 40 which is paired with the lower receiving blade 38; and a clearance holding means 52. A predetermined clearance S is imparted over the whole of the FD direction between the cutting parts of the upper blade 40 and the lower receiving blade 38 in the die clamping state. Accordingly, when the meshes 22 are formed by notching a plate material 42 step by step with the die 50 while feeding the plate material 42, the upper blade 40 and the lower receiving blade 38 do not collide with each other directly or via the sheet material 42 and the progress of the wear of the upper blade 40 and the lower receiving blade 38 is suppressed.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010088359-A (JP)
Title: Manufacturing method of fungus seed of microorganism optimized as catalyst of concurrent multiple mineralization reaction
Inventor: SHINOHARA MAKOTO
IPC: C05G5/00
Filed: 2008-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method in which time for completing mineralization reaction of an organic material into a nitrate nitrogen can be significantly reduced, a great deal of the organic material can be added at a time, high concentration of the nitrate nitrogen can be therefore efficiently generated, and an amount of the added microorganism source can be significantly reduced, in concurrent multiple mineralization to generate the nitrate nitrogen that is an inorganic fertilizer component from the organic material.  <P>SOLUTION: In the manufacturing method of a fungus seed, a container which can store water is filled with water, to which microorganisms conducting the concurrent multiple mineralization is inoculated, an environment that allows progression of the concurrent multiple mineralization in the water is maintained, thereby the microorganisms conducting the concurrent multiple mineralization are cultured, a biofilm is formed on a solid surface in contact with the water, subsequently the biofilm is collected, and the collected biofilm is used as the fungus seed of the microorganisms optimized as a catalyst of the concurrent multiple mineralization.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010091079-A (JP)
Title: Hinge mechanism
Inventor: KIKUMA TOSHIO
IPC: F16C11/10
Filed: 2008-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hinge mechanism capable of reducing the number of components, so as to simplify constitution, capable of securing precision of an operation, capable of saving a space, and capable of reducing manufacturing processes and a manufacturing expense.  <P>SOLUTION: This hinge mechanism 10 includes an opening and closing body 12 rotated around an opening and closing shaft 11 as the center, and a support body for journaling the opening and closing shaft 11. An outer circumferential face of the opening and closing body 12 is formed with a receiving part 13 comprising a plane along the opening and closing shaft 11, and a protrusion 14 adjacent to the receiving part 13 around the opening and closing shaft 11, and set with a distance up to the opening and closing shaft 11 getting longer than a distance from the receiving part 13 to the opening and closing shaft 11. The support body is formed with a support face abutting on the outer circumferential face, and is provided with the first energizing means for energizing the opening and closing shaft 11 and the support face to be approached each other, and of allowing approach and separation due to an elastic deformation.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009065183-A (JP)
Title: Electronic apparatus and its manufacturing process
Inventor: KURITA YOICHIRO
IPC: H01L25/065
Filed: 2008-10-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a densely-integrated highly functional electronic apparatus capable of increasing the productivity with reduced constraint in designing IC chips and packages and facilitating general versatility.  <P>SOLUTION: The present invention relates to a method of manufacturing an electronic apparatus comprising a process for forming an adhesive material layer 5 on a child chip so as to cover all the faces of an electrode forming surface of the child chip, that is, a second electronic apparatus mounted on a first electronic apparatus, that is, a parent chip 2 having metallic bump electrodes or Au stud bumps 1 and provided with an electrode connected to the Au stud bumps 1 of the parent chip; and a process of mounting the child chip 3 on the parent chip 2. In the process of mounting the child chip 3 on the parent chip 2, the Au stud bumps 1 of the parent chip 2 are electrically connected to the electrodes on the child chip 3 through the adhesive layer 5 and the space between the parent chip 2 and the child chip 3 is sealed with the adhesive layer 5.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010098406-A (JP)
Title: Strip line filter
Inventor: NAKAMURA SOICHI
IPC: H01P1/205
Filed: 2008-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a strip line filter capable of increasing mutual capacity to control coupling between resonators, while line spacing is secured.  <P>SOLUTION: A dielectric substrate 2 of the strip line filter 1 has the shape of a rectangle plate. A ground electrode 25 is formed at the lower surface of the substrate 2. A first resonant line and a second resonant line are associated with the ground electrode 25 via the substrate 2, respectively. Input/output electrodes 26A and 26B are coupled to either of the resonant lines. The first resonant line includes an upper face line 20A, a connecting line 30A, and an upper face line 20C. The upper face line 20A is formed at the upper face of the substrate 2, and passes along a position adjacent to the side of the left side face of an upper face line 20B. The connecting line 30A and the upper face line 20C are branched from the upper face line 20A, and pass along a position adjacent to the side of the right side face of the upper face line 20B.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010095458-A (JP)
Title: NEW TRANSITION METAL COMPOUND, CATALYST FOR OLEFIN POLYMERIZATION USING THE SAME, AND POLYMERIZATION OR COPOLYMERIZATION METHOD OF alpha-OLEFIN
Inventor: KATO TOMOHIRO
IPC: C08F10/00
Filed: 2008-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a new metallocene-based catalyst for forming a high-molecular weight α-olefin copolymer.  <P>SOLUTION: The transition metal compound is exemplified by the formula.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010095348-A (JP)
Title: Winding core for aluminum coil, aluminum coil, and aluminum coil manufacturing method
Inventor: Osanai takuji
IPC: B65H75/10
Filed: 2008-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a winding core for an aluminum coil, which does not cause abrasion with a period of a coil outer periphery even when the outside diameter of a coil is made large, an aluminum coil, and an aluminum coil manufacturing method.  <P>SOLUTION: This winding core 1 for an aluminum coil is made of a paper pipe 2 formed by plainly winding a paper sheet in a cylindrical shape, and comprises one end 5 which serves as a winding start of a sheet 3 on an inner peripheral side of the paper pipe 2, and the other end 7 which serves as a winding end of the sheet 3 on an outer peripheral side of the paper pipe 2. Height H1(mm) from an inner periphery 4 of the paper pipe 2 at the end 5 is 0.5 mm or less, and height H2(mm) from an outer periphery 6 of the paper pipe 2 at the end 7 satisfies the relationship H2-0.2≤T+t≤H2+0.2 between a thickness T(mm) of an aluminum plate 9 and a thickness t(mm) of an adhesive tape 8, when an end of the aluminum plate 9 is fixed opposite to the end 7 via the adhesive tape 8.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009122658-A (JP)
Title: Electrophotographic photoreceptor, image forming device, and electrophotographic cartridge
Inventor: WADA MITSUHISA
IPC: G03G9/08
Filed: 2008-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrophotographic photoreceptor which is highly sensitive to exposure light of a relatively short wavelength of 380-500 nm, and of which sensitivity variation due to a variation in the exposure wavelength is small, an electrophotographic cartridge having the electrophotographic photoreceptor, and an image forming device having exposure light of the wavelength range and capable of stably forming an image at a high resolution.  <P>SOLUTION: The electrophotographic photoreceptor is used in an image forming device for forming an electrostatic latent image by exposing the electrophotographic photoreceptor with the monochromatic light of a wavelength of 380-500 nm. The electrophotographic photoreceptor has a photosensitive layer on a conductive support, and the photosensitive layer includes two or more kinds of phthalocyanine compounds.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010098180-A (JP)
Title: Device and method for con-contact carrying wiring board
Inventor: MORITA YOSUKE
IPC: H05K3/34
Filed: 2008-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a non-contact carrying device for wiring board capable of conveying the wiring board, in a state where the attitude is stabilized, even at high-speed conveyance.  <P>SOLUTION: The non-contact carrying device includes a suction section 20. The suction section 20 includes a recess 73 provided on a suction surface 21, and an air blow-out hole 81 that opens to the inner-peripheral surface of the recess 73. The non-contact carrying device sucks and holds a substrate main surface 120 of the wiring board 110 to the suction surface 21 for conveyance by negative pressure, generated by air jetted along the inner-peripheral surface of the recess 73 from the air blow-out hole 81. Also, at the suction section 20, a vacuum suction hole 45 for drawing a vacuum is arranged, while opening to the outside region of the recess 73.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010098253-A (JP)
Title: Semiconductor substrate, method of manufacturing the same, and method of manufacturing semiconductor device
Inventor: SASAKI MAKOTO
IPC: H01L21/02
Filed: 2008-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide: a semiconductor substrate capable of performing positioning of the semiconductor substrate with high precision when a semiconductor element, etc. is formed on the semiconductor substrate; a method of manufacturing the semiconductor substrate; and a method of manufacturing the semiconductor device using the semiconductor substrate.  <P>SOLUTION: In order to control a position (angle) for forming the semiconductor element on the principal surface of the semiconductor substrate 1 with high precision (to precisely perform positioning), the semiconductor substrate includes a stacking fault 2 to be used as a mark for correctly indicating crystal orientation on the principal surface of the semiconductor substrate 1.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010094729-A (JP)
Title: Analysis method for gravity casting, and analysis system for the gravity casting
Inventor: SAKUMA DAISUKE
IPC: B22D46/00
Filed: 2008-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an analysis method capable of performing with high accuracy, the analysis of gravity casting in response to an actual gravity casting method.  <P>SOLUTION: The analysis method for gravity casting includes a step of generating a first analysis mesh 21 of a cavity 11 to make store in a storage means; a step of generating a second analysis mesh 22 of the cavity 11 to also make store in the storage means; a first analysis step of performing the analyses of molten metal flow and of solidification by using each mesh in the first analysis mesh 21; a casting data converting step of converting a first casting data obtained by the first analysis step into a second casting data in the mesh corresponding to the second analysis mesh 22; and a second analysis step of performing a solidification analysis using each mesh in the second analysis mesh as well as the second casting data.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009105404-A (JP)
Title: Exposure apparatus and exposure method, and device manufacturing method
Inventor: SHIBAZAKI YUICHI
IPC: H01L21/027
Filed: 2008-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To prevent reflecting surfaces (reflecting surfaces of a Z interferometer) arranged on the side surface of stages from getting wetted with a liquid, in a liquid immersion area.  <P>SOLUTION: When a transition is performed, from a state where one wafer stage WST1 is positioned in a region, including a liquid immersion area 14 to a state where another wafer stage WST2 is positioned in the area, including the liquid immersion area, waves sections 23a, 23b arranged in both wafer stages are to be engaged, to make a proximity or a contact state in the X-axis direction; and both stages WST1, WST2 are simultaneously driven in the X-axis direction, while maintaining the state. In this manner, the liquid immersion region 14 moves back and forth, between the two stages via the eaves sections. This can restrain leakage of the liquid via a gap between both wafer stages, and further, liquid leakage to the reflection surfaces 27e, 27f arranged on the side surface of both wafer stages can be restrained. Furthermore, the interference between the reflection surfaces arranged in both wafer stages can be avoided.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010103213-A (JP)
Title: Method of arranging heat-generating components of electronic circuit board
Inventor: KASAKAWA TATSUYA
IPC: H05K1/18
Filed: 2008-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To suppress influence of heat on soldering parts of a body of electronic circuit board and electronic components on the electronic circuit board.  <P>SOLUTION: The purpose that the soldering parts of the electronic circuit board and electronic components mounted on the circuit board must be freed from influence of heat generated by the electronic components has been achieved within a small mounting area through scattering of heat generating sources by selecting heat generating components to be arranged on the electronic circuit board in accordance with heat generating time period and alternately arranging one by one the components having comparatively longer heat generating time period and the components having comparatively shorter heat generating time period.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010103008-A (JP)
Title: Solid cable
Inventor: HIROSE MASAYUKI
IPC: H01B9/06
Filed: 2008-10-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solid cable, capable of ensuring high insulating characteristics while reducing the insulating oil quantity in an insulating layer to some degree, and also ensuring fitness between adjacent composite papers.  <P>SOLUTION: The solid cable includes the insulating layer 30 impregnated with insulating oil, at least a part of the insulating layer 30 being constituted by winding a composite paper having an insulating paper and a plastic layer. As the composite paper, a calendered composite paper A and a composite paper B different from the composite paper A are used in combination. The composite paper B is at least one of a composite paper b1 calendered in a condition different from that of the composite paper A and a composite paper b2 free from calendering. A cushioning function in the insulating layer 30 can be assigned mainly to the composite paper B, and an electric charge sharing function can be mainly assigned to the composite paper A.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009278608-A (JP)
Title: Monitoring system using wireless sensor for underground power zone cable connection box surface temperature
Inventor: KIM YONG IL
IPC: H04Q9/00
Filed: 2008-10-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a surface temperature monitoring system for always monitoring surface temperature measurement data of a wireless node mounted on a connection box in an office via a wireless network instead of monitoring the data with a manual method by a visitational checker in order to secure stability for the connection box.  <P>SOLUTION: This monitoring system using a wireless sensor is composed by including: a surface temperature measurement node measuring the surface temperature of an underground power zone cable connection box; relay nodes measuring the atmosphere temperature by receiving the surface temperature data; and a collection node transmitting the data of the relay node over the Internet.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010107634-A (JP)
Title: Plasma display device
Inventor: SHIOKAWA AKIRA
IPC: G09G3/20
Filed: 2008-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a stable, large and highly-accurate plasma display device in which a data electrode is divided into at least two data electrode groups, which are driven in order from the one located closer to a scanning electrode, while a data voltage on the side farther from the scanning electrode is increased, thereby stabilizing writing discharge and hence decreasing display mistakes.  <P>SOLUTION: The plasma display device uses a plasma display panel 50. In the plasma display panel 50, a pair of maintaining electrodes composed of a maintaining electrode and the scanning electrode which are formed on one substrate, are covered with dielectrics. In addition, a protective film is formed on each of the dielectrics. Further, a data electrode for selecting a display cell, a dielectric covering this electrode, a partition, and a fluorescence layer are formed on another substrate. The pair of maintaining electrodes has a length exceeding 3 m. The plasma display device includes a driving circuit 44 that divides the data electrode D into the two or more data electrode groups and drives them. The drive circuit 44 applies address voltages in order from the address electrode group located closer to the drawing portion of the scanning electrode SC.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010106500-A (JP)
Title: Structure for mounting cylinder lock
Inventor: KOJIMA RYUICHI
IPC: E05B9/08
Filed: 2008-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To improve the general-purpose property of a cylinder lock with a rotary piece by enabling the cylinder lock with the rotary piece to be mounted in a lock case mounting recess with an inner screw.  <P>SOLUTION: In this structure for mounting the cylinder lock, a lock body having the rotary piece 13 protruded on a back end surface is screwed into the mounting recess with the inner screw for the lock case in which an input member engaged with the rotary piece 13 is arranged on a bottom surface. The structure for mounting the cylinder lock includes: a cylinder into which the lock body is to be inserted from a back end; a C-ring 33 which is attached to the cylinder so as to inhibit the movement of the lock body; a decorative ring 29 which is externally inserted to the cylinder so as to become turnable; a screw cylinder 31 which has an outer screw 73 externally inserted to the cylinder and screwed into the inner screw which has a peripheral groove on an inner surface, and is turned integrally with the decorative ring 29; a locking pin which makes an entry into the peripheral groove so as to inhibit the axial movement of the screw cylinder 31; a turning regulation rod which is provided in the lock case and moved in a direction orthogonal to the axis line of the cylinder; and a through-hole 37 and a cutting surface 39 which are formed in the screw cylinder 31 and the cylinder, and subjected to the insertion and abutment of the tip of the turning regulation rod.  <P>COPYRIGHT: (C)2010,JPO&INPIT