baber/WOPTO huggingface dataset:
Patent JP-2014200157-A (JP)
Title: Jacket material for wire harness
Inventor: OTANI TSUTOMU
IPC: H02G3/04
Filed: 2013-03-29
Abstract: PROBLEM TO BE SOLVED: To reduce abnormal noise generation when a caterpillar type protector used for a jacket material of a wire harness is slide-contacting a case peripheral wall and such.SOLUTION: A plurality of bent lines extending in a lengthwise direction are folded and assembled in a cylindrical shape on a band form resin substrate. Notches are formed at an interval in the lengthwise direction by leaving a part of coupling part in a widthwise direction. The coupling part side is not bent and a part where the notches are formed is made bendable. A rib as a projection for slide-contacting is provided at an external surface of at least one side in an assembled state, or triangular or pentagonal sides or arc-like sides formed by projecting an apex to be a projection for slide-contacting toward outside are provided.
Patent JP-2014201027-A (JP)
Title: Decorative cover substrate for touch panel and method for manufacturing the same
Inventor: MORI FUJIO
IPC: B29C63/02
Filed: 2013-04-08
Abstract: PROBLEM TO BE SOLVED: To provide, as a decorative cover substrate for a touch panel, a cover substrate light in weight and unaccompanied by cracking, etc.; a decorative cover substrate for a touch panel producible in a favorable productivity by forming thereon a decorative layer roll-to-roll based on a transfer scheme, etc.; and a method for manufacturing the same.SOLUTION: A decorative cover substrate 10 for a touch panel provided by the first embodiment is a decorative cover substrate for a touch panel scheduled to be bonded directly to a hard display panel or laminated on a flexible display panel. A decorative layer 3 is formed as at least the outer frame of a display screen on a transparent cover substrate 1 consisting of a plastic film obtained by forming, within a matrix 6 of an organic polymer consisting of a transparent resin and having a thickness of 0.02-0.35 mm, inorganic particles 7 having an average diameter of 0.5-20 nm in an island-shaped pattern.
Patent JP-2013216890-A (JP)
Title: Polymer powder with adapted melting behavior
Inventor: DIEKMANN WOLFGANG
IPC: C08G69/26
Filed: 2013-04-11
Abstract: PROBLEM TO BE SOLVED: To provide a polymer powder based on an AABB polyamide having an excellent surface to be used for all processing methods worked in a laminating manner, having a mechanical property adapted to a requirement, and enabling production of a molding to the designed dimension as much as possible with accurate details.SOLUTION: A polymer powder is based on an AABB-type polyamide obtained by reprecipitating polyamide obtained by polycondensing diamine and dicarboxylic acid, wherein the polyamide is at least partially dissolved and the solution is subsequently cooled to below a precipitation temperature.
Patent JP-2013179321-A (JP)
Title: Deposition method and deposition device
Inventor: MATSUNAGA MASANOBU
IPC: H01L21/31
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To provide a deposition method for forming a silicon nitride film with successful film quality than in the conventional case by ALD.SOLUTION: In a deposition method for forming a product film consisting of a silicon nitride film in a processing container which can be held in a vacuum, ALC deposition processing is repeated for a plurality of times by using Si source gas and nitride gas, cleaning processing is performed, coating processing is performed, and then, the deposition processing is performed again. The coating processing is performed by thermal ALD for supplying the Si source gas and the nitride gas without making them into plasma.
Patent JP-2014205222-A (JP)
Title: Speed-change attachment for power tool
Inventor: OKAMURA HIDESUMI
IPC: B25F5/02
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To provide a speed-change attachment for a power tool which can be used while being installed to a chuck portion of a portable power tool, and can rotate a tip end tool at speed exceeding the performance of the power tool.SOLUTION: A speed-change attachment 11 used while being installed to a portable electric tool having a grip portion includes: an input shaft 28 which can be installed to a chuck portion of the electric tool; a speed-change mechanism portion 21 for changing (for example, increasing) the speed of rotations of the input shaft 28; and a chuck portion 14 for outputting rotations whose speed is changed by the speed-change mechanism portion 21. A tip end tool used by the electric tool is detachably installed to the chuck portion 14.
Patent JP-2014207389-A (JP)
Title: Semiconductor package
Inventor: TAKAGI KAZUTAKA
IPC: H01L23/02
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor package which has reduced warpage and strain, a stable junction layer formed between parts without complicating manufacturing steps, and good airtightness.SOLUTION: When parts forming a semiconductor package are bonded to each other, they are bonded in a temperature range which suppresses generations of warpage and strain of parts by using a bonding layer containing 98 wt.% or more of one metal element with melting point 400°C or higher, such as Ag. After bonding, it is possible to obtain high melting point, and each part is configured so that all surfaces of each of bonding layers to be bonding surfaces are parallel, thereby all thickness directions of bonding layers are aligned with one another in the same direction and a pressurizing direction during formation of bonding layers are one of lamination directions of each part.
Patent JP-2014207621-A (JP)
Title: Troublesome call monitoring device, mobile phone having troublesome call monitoring function, troublesome call monitoring method, and computer program used for troublesome call monitoring device
Inventor: TERAO HIROYUKI
IPC: H04M1/00
Filed: 2013-04-15
Abstract: PROBLEM TO BE SOLVED: To make it possible to always monitor whether or not an incoming call origination source identifier is a troublesome identifier, by previously storing the troublesome identifier obtained from a server unit in a troublesome call monitoring device.SOLUTION: When a troublesome call monitoring device 3 receives an incoming call origination source identifier of a call from a call origination side telephone set 6 to a call incoming side telephone set 1, in a situation where a troublesome identifier is obtained from a server unit 14 through a radio communication carrier network 15 and the Internet 13 and stored in the troublesome call monitoring device 3; the troublesome call monitoring device 3 holds an incoming call from the call origination side telephone set 6 to the call incoming side telephone set 1 and performs display so that display in the case that the incoming call from the call origination side telephone set 6 to the call incoming side telephone set 1 is a troublesome call and display in the case that the incoming call is a call to be rejected are performed in display modes differing from each other when the incoming call origination source identifier is stored in the troublesome call monitoring device 3 as a troublesome identifier, and permits the incoming call from the call origination side telephone set 6 to the call incoming side telephone set 1 when the incoming call origination source identifier from the call origination side telephone set 6 to the troublesome call monitoring device 3 is not stored in the troublesome call monitoring device 3 as the troublesome identifier or rejection identifier.
Patent JP-2014204930-A (JP)
Title: Massage machine
Inventor: INADA NICHIMU
IPC: A61H7/00
Filed: 2013-04-16
Abstract: PROBLEM TO BE SOLVED: To provide a massage machine for enabling a user himself/herself to select a desired massage course with referring to a present body condition determined by the massage machine.SOLUTION: A massage machine includes: massage parts 8, a1-a4 for performing massage operations with respect to the treated regions of a user; control means 15 configured to perform multiple kinds of massage courses where the massage parts 8, a1-a4 are operated by a predetermined procedure; a body condition determination unit 15d for determining the body condition of the user; a notification unit 15e for notifying the user of a determination result by the body condition determination unit 15d; and a selection unit 80 for allowing the user to select a desired massage course from at least two or more massage courses among the multiple massage courses on the basis of the determination result.
Patent JP-2014210857-A (JP)
Title: Thermally conductive sheet
Inventor: NARA TOMOYUKI
IPC: C09K5/08
Filed: 2013-04-18
Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive sheet which has high thermal conductivity, has a thin thickness of the sheet, and is particularly suitable as a heat dissipation member for an electronic component.SOLUTION: In a thermally conductive sheet, a thickness of a resin composition which contains 40-60 vol.% of a thermally conductive filler having the maximum particle size of 20-40 μm, and 40-60 vol.% of a silicone resin having a tensile strength of 0.1-0.8 MPa is 50-250 μm, and the silicone resin is an addition reaction type silicone resin. A heat dissipation member for an electronic component uses the thermally conductive sheet.
Patent JP-2014212251-A (JP)
Title: Compression resin sealing method and compression resin sealing device of electronic component
Inventor: TAKASE SHINJI
IPC: B29C43/14
Filed: 2013-04-19
Abstract: PROBLEM TO BE SOLVED: To enhance the accuracy of thickness of a package by pressing a molten resin material 80a in a lower mold cavity 33a, when resin sealing an electronic component 71 on a large board 70 collectively in the package.SOLUTION: A compression resin sealing method of an electronic component includes: a first pressing step for supplying a sheet-like resin 80 via a mold release film 60 to a lower mold cavity 33a and thermally fusing the sheet-like resin, and then pressing the molten resin material 80a in the lower mold cavity 33a at a low speed with a low pressure; a second pressing step for immersing the electronic component 71 into the molten resin material 80a in a state where the molten resin material 80a touches the electronic component 71 mounting surface side of the large board 70 by continuing the first pressing step; a surplus resin inflow stopping step for stopping surplus resin inflow into a surplus resin housing section 33b after the second pressing step; and a third pressing step for moving upward to a height position where the bottom surface of the lower mold cavity 33a is equal to the interval of a package thickness 33c for resin sealing the electronic component 71 of the large board 70, after the surplus resin inflow stopping step.
Patent JP-2014214415-A (JP)
Title: Protective fence support
Inventor: NAGAISHI MITSURU
IPC: E01F15/04
Filed: 2013-04-22
Abstract: PROBLEM TO BE SOLVED: To provide a protective fence support capable of preventing a weld zone between a brace and a base plate from being broken without breaking the brace, improving the bearing capacity of the weld zone, and preventing the weld zone from being corroded.SOLUTION: A plurality of protective fence supports 1 are installed in a constant interval along a road. The protective fence support 1 functions as a guard fence by supporting lateral beam members B1, B2 via brackets Br1, Br2, which become mounting members, at a central part and an upper end part in the height direction of a brace 3. The brace 3 is provided with a reinforcement plate 31 as a reinforcement part material in a rise-up direction near a joint part between an inside base plate 2 and the brace 3. The reinforcement plate 31 is erected along a load direction given to the brace 3 when the brace 3 is installed on a mounting object G.
Patent JP-2014217032-A (JP)
Title: Image processing apparatus, image processing method and program
Inventor: SAKAI YUSUKE
IPC: G06F3/0488
Filed: 2013-04-30
Abstract: PROBLEM TO BE SOLVED: To allow for enhancement of the operability of image clipping operation.SOLUTION: A clipping frame setting section sets a clipping frame for clipping a part of an image to be edited, an image editing section edits an image in the clipping frame superposed on the image to be edited, depending on an instruction from a user, and a clipping image generating section generates a clipping image by clipping the image in the clipping frame from the image to be edited. The technique is applicable to a tablet type electronic apparatus having a touch panel.
Patent JP-2013147670-A (JP)
Title: Polyimide film made of multicomponent polyimide, and method for producing the same
Inventor: YOSHINAGA TOSHIMUNE
IPC: C08L79/08
Filed: 2013-05-07
Abstract: PROBLEM TO BE SOLVED: To provide a multicomponent polyimide film which has modified film surface properties or film mechanical properties, as compared to a polyimide film in which raw material components are bonded at random, and a method for producing the same.SOLUTION: The polyimide film is made of a multicomponent polyimide consisting of two or more different polyimide components, e.g., a multicomponent polyimide consisting of: raw material components of a polyimide A and/or a polyimidation reaction product of the raw material components (polyimide component A); and raw material components of a polyimide B and/or a polyimidation reaction product of the raw material components (polyimide component B), in which the absolute difference between solubility parameter SPof the polyimide A and solubility parameter SPof the polyimide B, |SP-SP|, is 0.5 MPaor more. The polyimide film has markedly modified surface properties as compared to a polyimide film in which raw material components of all polyimides forming the film are randomly bonded to one another.
Patent JP-2014128545-A (JP)
Title: Game system, program, and object
Inventor: SARUDATE OSAMU
IPC: A63F13/20
Filed: 2013-05-09
Abstract: PROBLEM TO BE SOLVED: To suitably and identifiably display a character in a game utilizing a plurality of characters.SOLUTION: Specifically, a game system device replaces a character with an alternative pattern and disposes it on a field to display it during execution of a game, and correlates detailed information for identifying the character corresponding to the alternative pattern with the alternative pattern to display the information concerning a designated alternative pattern, and an alternative pattern corresponding to the character having control of a predetermined item. In this case, when the number of alternative patterns for displaying the detailed information by designation of a new alternative pattern is equal to or more than a predetermined number, no detailed information is displayed concerning an alternate pattern designated first other than an alternative pattern corresponding to the character having the control of the predetermined item from among alternative patterns already displaying the detailed information.
Patent JP-2014222714-A (JP)
Title: Evaluation system and evaluation method of semiconductor wafer
Inventor: SAGARA KAZUHIRO
IPC: H01L21/66
Filed: 2013-05-13
Abstract: PROBLEM TO BE SOLVED: To provide an evaluation device and a wafer evaluation method, which evaluate a fracture strength of a semiconductor wafer and identify a defective part of the semiconductor wafer.SOLUTION: In a semiconductor wafer evaluation system having a fracture device which fractures a semiconductor wafer by applying a load to the semiconductor wafer and a microscope for monitoring a fracture surface of the semiconductor wafer, the fracture device includes a support jig for supporting the semiconductor wafer on which one groove is processed in a diameter direction and loading means for applying a load in a direction along the groove of the semiconductor wafer supported by the support jig, in which by monitoring the fracture surface of the semiconductor wafer by the microscope after fracturing the semiconductor wafer by applying a load by the loading means from a surface of the semiconductor wafer on the side opposite to the surface where the groove is processed and in a direction along the groove, a fracture strength of the semiconductor wafer is measured and a defective part of the semiconductor wafer is specified thereby to enable evaluation of the semiconductor wafer.
Patent JP-2014223708-A (JP)
Title: Processing device
Inventor: SEKIYA KAZUMA
IPC: B23Q17/00
Filed: 2013-05-17
Abstract: PROBLEM TO BE SOLVED: To provide a processing device capable of securely performing processing with a processing condition corresponding to the kind of a workpiece.SOLUTION: The processing device includes: workpiece holding means for holding a workpiece; processing means for processing the workpiece held by the workpiece holding means; and imaging means for imaging the workpiece held by the workpiece holding means. The processing device also has control means for setting a processing condition on the basis of an image signal from the imaging means. The control means has memory for storing multiple processing conditions depending on kinds of workpieces, and multiple feature patterns corresponding to the kinds of the workpieces. The control means checks an image signal of a feature pattern of the workpiece imaged by the imaging means against the multiple feature patterns stored in the memory, identifies a feature pattern identical to the image signal, and determines a processing condition of a workpiece corresponding to the identified feature pattern, as a processing condition for the workpiece to be processed.
Patent JP-2014226811-A (JP)
Title: Ink jet recording device
Inventor: TOKIMATSU HIROYUKI
IPC: B41J2/175
Filed: 2013-05-20
Abstract: PROBLEM TO BE SOLVED: To provide an ink jet recording device which maintains a temperature of a recording head at a more proper temperature and smoothly discharges an ink.SOLUTION: An ink jet recording device includes: a recording head 241 having multiple nozzles N; a storage part (a first storage part 242 and a second storage part 243) which stores an ink; a first supply passage 3011 in which the ink from the first storage part 242 flows; a second supply passage 3012 which guides the ink of the first supply passage 3011 to the recording head 241; multiple heating parts 401 to 405 which respectively change temperatures of these components; detection parts 411 to 415 which respectively detect the temperatures of these components; and a control part 40 which controls the operations of the heating parts 401 to 405. A setting temperature of the storage part is higher than a setting temperature of the recording head 241, and a setting temperature of the first supply passage 3011 and a setting temperature of the second supply passage 3012 are lower than the setting temperature of the recording head 241. The setting temperature of the second supply passage 3012 is higher than the setting temperature of the first supply passage 3011.
Patent JP-2014226218-A (JP)
Title: Lid opening/closing state detection structure
Inventor: KONO KIMIHIRO
IPC: A47J27/21
Filed: 2013-05-20
Abstract: PROBLEM TO BE SOLVED: To provide a lid opening/closing state detection structure in which the detection operation of a detection part of lid opening/closing detection means performed by users etc. with fingers etc. in a lid opening state of a lid body can be suppressed well by a simple and easy configuration, and thereby the false detection due to a manual operation of the detection part can be suppressed well.SOLUTION: A lid opening/closing state detection structure B is configured such that: a lid body 3 for opening and closing the opening part is pivotally connected in a freely swingable manner to a body with an opening part by a hinge mechanism 13; and an opposing part in a lid-closing state between the body and the lid body 3 is provided with a detection part E of lid opening/closing detection means D for detecting an open or closed state of the lid body 3, and an operation part F for making the detection part E perform detection operation in a detection operation position. An obstruction part G is provided for obstructing the operation of the detection operation by an inapplicable operation body to a detection operation airspace P between the operation part F and the detection part E, when the lid body 3 is in a lid-opening state.
Patent JP-2014228726-A (JP)
Title: Music evaluating device
Inventor: KAWABATA TARO
IPC: G09B15/00
Filed: 2013-05-23
Abstract: PROBLEM TO BE SOLVED: To comprehensively evaluate difficulty in view of expression and modulation of a music piece.SOLUTION: Section evaluating means 12 evaluates section difficulty. The section difficulty indicates difficulty of performing a section (e.g., a predetermined number of bars), which is a part of a music piece. The section evaluating means 12 divides a music piece into a plurality of sections, and evaluates the section difficulty for each of the plurality of sections. The section difficulty is evaluated according to a predetermined algorithm. Music evaluating means 13 evaluates music difficulty. The music difficulty indicates difficulty of performing the entire music piece. The music evaluating means 13 evaluates the music difficulty of the music piece depending on variations in the section difficulty of the music piece.
Patent JP-2014082185-A (JP)
Title: Backlight unit for display device and driving method thereof
Inventor: PARK YOUNG-MIN
IPC: F21S2/00
Filed: 2013-05-28
Abstract: PROBLEM TO BE SOLVED: To provide a backlight unit for a display device which permits a light beam spread angle to be regulated while mitigating limitation in design such as the size and arrangement of a light source module, without increasing the width of a peripheral region of the display device.SOLUTION: The present invention relates to a backlight unit for a display device and a driving method thereof. A backlight unit for a display device includes: a light source module; a light guiding plate which guides the light incident from the light source module toward a front surface; and a light beam spread angle regulating sheet which is disposed between the light source module and a lateral surface of the light guiding plate and regulates a light beam spread angle of the light incident from the light source module.
Patent JP-2014232023-A (JP)
Title: Analysis chip
Inventor: YAMAMOTO YOSHIRO
IPC: G01N37/00
Filed: 2013-05-28
Abstract: PROBLEM TO BE SOLVED: To provide an analysis chip which facilitates an analysis of a plurality of items.SOLUTION: An analysis chip (300) according to the present invention has a first chip (100), and a second chip (200) connected to the first chip. The first chip has a specimen injection part (1) and a connection part (5). The second chip has an introduction path (7) and a reagent holding part (8).
Patent JP-2014233033-A (JP)
Title: Device and method for transmission path coding
Inventor: SHIBATA YUICHI
IPC: H04J11/00
Filed: 2013-05-30
Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for transmission path coding to enable a receiver to correctly perform reception/presentation processing of one-segment area broadcasting.SOLUTION: The transmission path coding device includes: a synchronous signal generator unit for generating and outputting a synchronous signal to be a criterion for OFDM symbol generation timing; a signal level converter unit for alternately converting the signal levels of a transmission control signal group in a segment, other than one segment at the center in one frequency channel, into two different signal levels; and an OFDM frame configuration unit for configuring an OFDM frame from the transmission control signal group, output from the signal level converter unit, and a signal for one segment at the center. The signal level converter unit determines the two different signal levels in such a manner that one signal level out of the two different signal levels comes to be a first predetermined level or higher, and a time average of the two different signal levels comes to be a second predetermined level or lower.