baber/WOPTO huggingface dataset:
Patent TW-202226216-A (TW)
Title: Data drive circuit, clock recovery method of the same, and display drive device having the same
Inventor: PARK JONG-HWI
IPC: G02F1/133
Filed: 2021-12-10
Abstract: The present disclosure relates to a data drive circuit capable of increasing clock and data recovery stability by generating a clock synchronized with input data, a clock recovery method thereof, and a display drive device having the same, and the data drive circuit according to an aspect includes a receiver including a clock and data recovery part configured to recover a test data pattern from input data using an internal clock, and a data comparator configured to compare the recovered test data pattern with a predetermined reference data pattern to generate a control signal according to a degree of asynchronicity between the recovered test data pattern and the reference data pattern, wherein the clock and data recovery part recovers a clock synchronized with the input data according to the control signal, and recovers control information and image data from the input data using the recovered clock.
Patent TW-202325206-A (TW)
Title: Multi-layer cutting board wherein the worn cutting board pieces can be peeled off sequentially from top to bottom to allow the cutting board piece in use to be always kept as new
Inventor: CHEN ZHONG-RONG
IPC: A47J47/00
Filed: 2021-12-17
Abstract: A multi-layer cutting board includes a main body with a plurality of cutting board pieces stacked one above the other. These cutting board pieces have several through holes, each of which penetrates the cutting board pieces in the vertical direction, and each of the through holes is respectively embedded with a connecting bar. Each of the connecting bars connects the cutting board pieces in series, and the peripheral of the main body is wrapped with a cladding layer, thereby fixing the peripheries of the cutting board pieces. When the present invention is used for cutting vegetables, the worn cutting board pieces can be peeled off sequentially from top to bottom, so that the cutting board piece in use can always be kept as new. In addition, by using vertical connecting bars to connect adjacent cutting board pieces in series, when the knife chops the ingredients, the cutting board pieces will not be squeezed to have deformation or gaps formed, which can ensure that the surface of the main body is smooth and has a better feel for cutting vegetables.
Patent TW-202224275-A (TW)
Title: Connector with current-diverging structure and connector assembly with the same
Inventor: CHEN SUNG-YU
IPC: H01R12/72
Filed: 2021-02-26
Abstract: A connector, having a shunt structure, comprises an insulating housing, a plurality of electrical terminals, a shunt socket and a plurality of signal terminals. The insulating housing has a first side surface and a second side surface. The first side surface has a power input interface provided for insertion of a power supply component and a signal input interface for receiving input signals. The second side surface has a power output interface and a signal output interface. Each of the electrical terminals has a contact portions and a leg. Each of the contact portions extends into the power input interface, and each of the legs extends to the power output interface. Each of the signal terminals has a signal contact portions and a signal legs. Each of the signal contact portions extends into the signal input interface, and each of the signal legs extends to the signal output interface. The shunt socket is located on a third side surface of the insulating housing. The shunt socket includes a positioning member. When the shunt connector is inserted into the shunt socket and positioned on the shunt socket, a terminal of the shunt connector electrically contacts through physical contact at least one terminal of the electrical terminals. The present disclosure also provides a connector assembly.
Patent TW-202246375-A (TW)
Title: curable resin composition
Inventor: ENDO TAKESHI
IPC: C08G59/20
Filed: 2022-01-27
Abstract: The purpose of the present invention is to provide a curable resin composition having an excellent balance between curability and storage stability. The curable resin composition according to the present invention contains: (A) an epoxy resin; (B) a curing agent; and (C) at least one selected from imide compounds represented by formulae (1-1), (1-2), and (1-3). In the formulae, R11 represents an alkyl group or the like having 1-10 carbon atom and optionally having a substituent group, R1-R4 each independently represent a hydrogen atom, an alkyl group having 1-10 carbon atoms, or the like, and R12 and R13 each independently represent a hydrogen atom, an alkyl group having 1-10 carbon atoms and optionally having a substituent group, or the like.
Patent TW-202334986-A (TW)
Inventor: YEN YUNG-CHIEH
IPC: G16H50/20
Filed: 2022-02-15
Abstract: 一種自殺風險評估系統與方法。自殺風險評估系統包含記憶體和處理器。處理器電性連接至記憶體，以載入記憶體中的指令來進行自殺風險評估方法。自殺風險評估方法包含：提供複數筆歷史病歷資料，並對其中的數值資訊、狀態資訊以及文字資訊分別進行正規化處理、編碼處理以及詞嵌入（Word embedding）處理；利用處理後的歷史病歷資料與相應之歷史自殺風險評估分數來訓練類神經網路模型，以獲得自殺風險評估模型；以及將待診斷病人之病歷資料的數值資訊、狀態資訊以及文字資訊輸入至自殺風險評估模型，以利用自殺風險評估模型來評估待診斷病人的自殺風險。
Patent TW-202249074-A (TW)
Title: Substrate processing method and substrate processing apparatus
Inventor: SHIBATA SHUICHI
IPC: H01L21/304
Filed: 2022-02-15
Abstract: This substrate processing method comprises a holding step, a liquid supply step, a film thickness measurement step, and a plasma step. In the holding step, a substrate-holding part holes a substrate. In the liquid supply step, a processing liquid is supplied from a nozzle to a main surface of the substrate held by the substrate-holding part. In the film thickness measurement step, a sensor measures the film thickness of the processing liquid on the main surface of the substrate. In the plasma step, at least one of the distance between a plasma source and the substrate, the output voltage being applied to the plasma source, and the flow rate of a processing gas supplied between the plasma source and the substrate is changed on the basis of a measured film thickness, which is the film thickness measured by the sensor, and an active species produced from the plasma generated by the plasma source is supplied to a liquid film.
Patent TW-202333759-A (TW)
Inventor: YANG MING-JIE
IPC: A61K9/16
Filed: 2022-02-18
Abstract: An extract of a fruiting body of Cordyceps militaris, a food composition including the same, and a pharmaceutical composition including the same are provided. The extract of the fruiting body of Cordyceps militaris includes 4-35 mg/g of cordycepin and 1.4-2.8 mg/g of adenosine. A high performance liquid chromatography spectra of the extract of the fruiting body of Cordyceps militaris shows characteristic peak signals at 2.6-2.9 min, 3.1-3.4 min, and 6.8-7.1 min.
Patent TW-202243152-A (TW)
Title: Semiconductor package
Inventor: YAMAMOTO Syusaku
IPC: H01L23/60
Filed: 2022-03-11
Abstract: Provided are: a device with which it is possible to perform, in a compact size and at a device level, pulse protection from a pulse having a sharp rise such as an electromagnetic pulse; and a semiconductor package to which the device is mounted. The semiconductor package (1, 2, 3) comprises: a substrate (12, 60, 70); an IC chip (21) disposed on the substrate (12, 60, 70); a plurality of connection parts (30) for connecting the IC chip (21) to the outside; a plurality of bonding wires (40) for connecting the IC chip (21) to the corresponding plurality of connection parts; and a mechanism for bypassing surge current having been applied to any one of the plurality of connection parts (30), from the connection part (30) to a ground potential through a path different from the plurality of bonding wires (40).
Patent TW-202238805-A (TW)
Title: Processing device and substrate transport method
Inventor: OBIKANE TADASHI
IPC: H01L21/683
Filed: 2022-03-21
Abstract: A processing device according to one embodiment of the present disclosure comprises: a pick that holds and transports a substrate; a first suction pad disposed at a position so as to come into contact with the substrate flexed into a concave shape in the pick; a second suction pad disposed at a position so as to come into contact with the substrate flexed into a convex shape in the pick; a pressure sensor that detects the pressure in a first suction path connected to the first suction pad and the pressure in a second suction path connected to the second suction pad; and a control unit that controls suction actions performed by the first suction pad and the second suction pad on the basis of detection values from the pressure sensor.
Patent TW-202302675-A (TW)
Title: Dicing die bonding film and method for producing semiconductor device
Inventor: FUKUI AKIHIRO
IPC: C08F220/58
Filed: 2022-04-18
Abstract: Provided is a dicing die bonding film or the like including: a dicing tape including a base layer and an adhesive layer laminated on the base layer; and a die bonding sheet laminated on the dicing tape. The adhesive layer includes an acrylic copolymer having, as monomer units, at least an alkyl (meth)acrylate unit and a crosslinkable group containing (meth)acrylate unit in a molecule. In the acrylic copolymer, the crosslinkable group containing (meth)acrylate unit partially has a radically polymerizable carbon-carbon double bond. The acrylic copolymer includes 30 parts or more and 60 parts or less by mole of the crosslinkable group containing (meth)acrylate unit based on 100 parts by mole of the alkyl (meth)acrylate unit, and 50% or more and 95% or less by mole of the crosslinkable group containing (meth)acrylate unit includes the radially polymerizable carbon-carbon double bond.
Patent TW-202303457-A (TW)
Inventor: LICHTENAU CEDRIC
IPC: G06N20/00
Filed: 2022-04-19
Abstract: 一第一選擇維度之一張量經重新格式化以提供一第二選擇維度之一或多個子張量。該重新格式化包括判定待用以表示該張量之子張量之一數目。該重新格式化進一步包括創建該數目個子張量，其中一子張量待在一記憶體單元之一邊界上開始。重新配置該張量之資料以適應該數目個子張量。
Patent TW-202248424-A (TW)
Title: Electric furnace and steelmaking method
Inventor: OGASAWARA FUTOSHI
IPC: C21C5/52
Filed: 2022-04-27
Abstract: Provided is a technique for melting a cold iron source using a heat source having reduced CO2 emissions. Provided is an electric furnace in which a burner is arranged so as to face the furnace contents, the burner being equipped with a powder supply pipe, an injection hole for ejecting fuel, and an injection hole for ejecting combustible gas, and being configured such that hydrogen gas or a hydrogen-enriched gaseous fuel is injected as fuel to form a burner flame, a powdery or powdered auxiliary raw material is injected from the powder supply pipe, and the auxiliary raw material passes through the burner flame. Also provided is a steelmaking method in which: an injection hole for ejecting fuel and an injection hole for ejecting a combustible gas are provided in an electric furnace; a burner is arranged, the burner injecting a flame from the injection hole into the furnace; hydrogen gas or a hydrogen-enriched gaseous fuel is used as burner fuel during at least part of one heating operation of the electric furnace; and a powdery or powdered auxiliary raw material is blown in so as to pass through the flame formed by the burner.
Patent TW-202306774-A (TW)
Inventor: NADA TAKAYUKI
IPC: B32B7/023
Filed: 2022-05-11
Abstract: 本發明之課題在於提供一種正面方向的穿透性優異，並且降低斜向之光吸收特性的方向異向性而使來自斜向之防窺視效果變得優異之積層體、以及包含該積層體之顯示裝置。
 
     
     
       本發明之解決手段為一種積層體，係依序包含：
 
       光吸收異向性膜，係由含有雙色性色素及液晶化合物之液晶組成物的硬化物所構成之光吸收異向性膜，在以膜面內之任意的位置方向為x軸，以膜面內與x軸正交之方向為y軸，以與x軸及y軸正交之膜厚方向為z軸時，滿足下述式(1)至(3)：
 
       Az>(Ax+Ay)/2   (1) 
 
       Ax(z=60°)/Ax>5   (2) 
 
       Ay(z=60°)/Ay>5   (3)
 
       式(1)至(3)中，Ax、Ay、Az、Ax(z=60°)及Ay(z=60°)皆為前述光吸收異向性膜中的前述雙色性色素於極大吸收波長時之吸光度，Ax表示在x軸方向振動之直線偏光的吸光度，Ay表示在y軸方向振動之直線偏光的吸光度，Az表示在z軸方向振動之直線偏光的吸光度，Ax(z=60°)表示以y軸為旋轉軸使前述膜旋轉60°時在x軸方向振動之直線偏光的吸光度，
Ay(z=60°)表示以x軸為旋轉軸使前述膜旋轉60°時在y軸方向振動之直線偏光的吸光度；
 
       水平配向相位差膜i，係滿足下述式(4)：
 
       70nm≦Re i (550)≦170nm   (4)
 
       式(4)中，Re i (λ)表示於波長λnm時之水平配向相位差膜i的面內相位差值；
 
       偏光片；以及
 
       水平配向相位差膜ii，係滿足下述式(5)：
 
       120nm≦Re ii (550)≦160nm   (5)
 
       式(5)中，Re ii (λ)表示於波長λnm時之水平配向相位差膜ii的面內相位差值。
Patent TW-202314224-A (TW)
Inventor: LAPLATINE LOIC
IPC: G01N21/45
Filed: 2022-06-10
Abstract: 本發明關於一種干涉系統（1），用於偵測存在流體樣本中的分析物，包含：週期性地及矩形地佈置的馬赫-陳爾德干涉儀（20）的矩陣陣列，以及具有長寬比等於1呈螺旋形及/或蛇形的多個臂（22）；多個感測區域（30）的矩陣陣列，該些感測區域（30）的每一者由受體形成，其中分析物能夠透過吸收/解吸與所述受體交互作用，且該些感測區域（30）被週期性地及六邊形地佈置。
Patent TW-202323982-A (TW)
Title: Layered body, method for manufacturing layered body, and method for forming pattern
Inventor: HAYASHI KUMIKO
IPC: G03F7/004
Filed: 2022-06-29
Abstract: The present invention is a layered body that is obtained using a semiconductor substrate by forming a photosensitive resin layer on said semiconductor substrate, and is characterized in that the photosensitive resin layer includes a silicone backbone-including resin or an acrylic resin, the semiconductor substrate has a stepped surface on one side, a recessed section of the stepped surface is filled with a prewetting solution, and the photosensitive resin layer is formed thereon. Thus, the present invention provides a layered body wherein a photosensitive composition including a silicone backbone-including resin or an acrylic resin is used, a recessed section in a stepped surface of a stepped substrate is sufficiently filled in with said resin, and a level photosensitive resin film can be provided, and the present invention also provides a method for manufacturing said layered body with little material loss, and a method for forming a pattern wherein said layered body is used.
Patent TW-202325107-A (TW)
Inventor: HUNG TSUNG-YI
IPC: H05K1/11
Filed: 2022-07-08
Abstract: An electronic device includes a substrate, an upper conductive layer, and a lower conductive layer. The substrate has a plurality of inner vias and has an upper surface and a lower surface. The upper conductive layer includes an upper ground trace and an upper signal pad disposed on the upper surface. The upper ground trace is electrically connected to the ground vias and has an upper hollow portion exposing a part of the upper surface. The upper signal pad is disposed on the part of the upper surface exposed by the upper hollow portion and electrically connected to the signal via. The lower conductive layer includes a lower ground trace and a lower signal pad disposed on the lower surface. The lower conductive trace is electrically connected to the ground vias and has a lower hollow portion exposing a part of the lower surface. The lower signal pad is disposed on the part of the lower surface exposed by the lower hollow portion and electrically connected to the signal via.
Patent TW-202317538-A (TW)
Inventor: VANDYCK KOEN
IPC: C07D401/12
Filed: 2022-07-08
Abstract: Provided herein are compounds of Formula (I), or pharmaceutically acceptable salts thereof, pharmaceutical compositions that include a compound described herein (including pharmaceutically acceptable salts of a compound described herein) and methods of synthesizing the same. Also provided herein are methods of treating diseases and/or conditions with a compound of Formula (I), or a pharmaceutically acceptable salt thereof.
Patent TW-202315345-A (TW)
Title: Signal power splitter/combiner with resistance and impedance transformer loading
Inventor: KIM JONGHAE
IPC: H04B1/40
Filed: 2022-07-15
Abstract: An aspect relates to a signal power splitter/combiner including a first signal port; a first resistor; a first impedance transformer coupled in series with the first resistor between the first signal port and a first intermediate node; a second impedance transformer coupled between the first intermediate node and a second signal port; a third impedance transformer coupled between the first intermediate node and a third signal port; and a second resistor coupled between the second and third signal ports. The signal power splitter/combiner may further include a fourth impedance transformer coupled between the second impedance transformer and the second signal port, a fifth impedance transformer coupled between the third impedance transformer and the third signal port; and a third resistor coupled between a third intermediate nod.
Patent TW-202318484-A (TW)
Title: Production method for frame with film and production method for protective cap
Inventor: MASHIMA RYOTA
IPC: H01L21/203
Filed: 2022-07-28
Abstract: A production method for a frame with a film, said frame comprising a glass frame portion 5 having a through portion H, and a film 7 formed on one end surface 5b of the frame portion 5, wherein the production method includes a preparation step in which the frame portion 5 is prepared, and a film formation step S11 in which the film 7 is formed on the one end surface 5b of the frame portion 5 by sputtering a target 11 inside a chamber 10. In the film formation step S11, the pressure inside the chamber 10 during film forming is 0.1 to 1.0 Pa.
Patent TW-202331588-A (TW)
Title: 指紋感測裝置和信號處理方法
Inventor: HUANG MIN
IPC: G06F3/041
Filed: 2022-08-23
Abstract: 一種指紋感測裝置及信號處理方法。指紋感測裝置包含第一類比前端電路、補償電路、校正電路以及輸出電路。第一類比前端電路根據從指紋感測器的多個列讀取到的指紋資料生成第一影像信號。校正電路接收通過讀取指紋感測器的多個列當中的至少一列而生成的第一輸出數位代碼，且根據第一輸出數位代碼計算亮度校正值和相對照度校正值。補償電路根據亮度校正值和相對照度校正值修改第一影像信號以生成第二影像信號。輸出電路配置成根據第二影像信號生成第二輸出數位代碼。
Patent TW-202329100-A (TW)
Inventor: KIM HO-YOUN
IPC: G11C8/20
Filed: 2022-09-21
Abstract: A row hammer control method and a memory device are provided. The memory device monitors the row hammer address(es) having the number of accesses equal to or more than a predetermined number of times or having a higher number of accesses as compared with other access addresses during the first row hammer monitoring time frame and malicious row hammer address(es) accessed at random sampling time points during the second row hammer monitoring time frame and being the same as the row hammer address(es), notifies a memory controller of the malicious row hammer address(es) when the number of malicious row hammer addresses exceeds a threshold value, and causes a target refresh a memory cell row physically adjacent to a memory cell row corresponding to the malicious row hammer address(es) to be performed.
Patent TW-202303550-A (TW)
Title: Display device and manufacturing method thereof
Inventor: NAKAMURA DAIKI
IPC: G09F9/46
Filed: 2018-03-27
Abstract: When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an environmental change such as temperature due to difference in linear expansion coefficient before and after a thermal shock. A buffer plate that is thin enough to be bent is provided between the base film used in a flexible display panel and the resin member. With the use of heat dissipation effect and heat equalization effect of the buffer plate, a structure around the panel capable of resisting the environmental change can be provided.
Patent TW-202325901-A (TW)
Inventor: SEO JUNG-WOO
IPC: C25D5/10
Filed: 2022-10-20
Abstract: 揭示一種經表面處理之銅箔，其具有長期高溫可靠性且由於低傳輸損失而適合用於高頻電路，其中經表面處理之銅箔具有表面處理層，表面處理層包括：一級粒子層，其含有形成在原始銅箔之至少一表面上的Cu或Cu合金粒子；及二級粒子層，其含有形成在一級粒子層上的Zn粒子，二級粒子層係由藉由聚集複數個Zn粒子所形成的粒子叢集組成。
Patent TW-202324461-A (TW)
Title: Laminated core and rotating electrical machine
Inventor: HIRAYAMA RYU
IPC: H01F41/02
Filed: 2022-10-25
Abstract: According to the present invention, an electromagnetic steel sheet includes an annular body. At least one adhesive layer (41) among a plurality of adhesive layers (41) is a first adhesive layer. In one electromagnetic steel sheet among two electromagnetic steel sheets sandwiching the first adhesive layer in the lamination direction, when a virtual line intersecting the central axis of the annular body and extending in the easy-magnetization direction is defined as the L axis, a virtual line intersecting the central axis and intersecting the L axis is defined as the C axis, and when the electromagnetic steel sheet is partitioned into a plurality of segments (S) in the circumferential direction of the annular body by the L axis and the C axis, at least one segment (S) among the plurality of segments (S) is a first segment. In the first segment, the area of the first adhesive layer at a first portion (P1) of the electromagnetic steel sheet where a main flux is generated in the L axis direction is smaller than the area of the first adhesive layer at a section portion (P2) of the electromagnetic steel sheet where the main flux is generated in the C axis direction.
Patent TW-202312783-A (TW)
Title: Blessing lantern controlling module without a manpowered information inquiry and a writing on the lantern when the blessing lantern is damaged
Inventor: YU SHU-ROU
IPC: G06F3/147
Filed: 2021-09-07
Abstract: A blessing lantern controlling module is mounted in a blessing lantern and includes: a lamp main board having an output port and an input port, a microcontroller unit provided on the lamp main board, a light module electrically connected to the lamp main board and controlled by the microcontroller unit to emit light, and a display panel electrically connected to the lamp main board and controlled by the microcontroller unit to display the blessing information. The display panel can receive and display the blessing information, and therefore the displayed content can be updated in response to different festival occasions. When the blessing lantern is damaged, a new blessing lantern is only needed to replace it, a blessing lantern controlling module is mounted and then the blessing information is transmitted from the input port. After that, the display panel can re-display the original information without needing the manpowered information inquiry and the writing on the lantern, thereby the maintenance of the blessing lantern is simple and convenient.
Patent TW-202332082-A (TW)
Title: Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element
Inventor: NIWA NORITAKA
IPC: H01L33/44
Filed: 2022-11-09
Abstract: A semiconductor light-emitting element has an n-type semiconductor layer arranged on a base layer, and is made of an n-type AlGaN-based semiconductor material; an active layer arranged on the n-type semiconductor layer, and is made of an AlGaN-based semiconductor material; a p-type semiconductor layer arranged on the active layer; a p-side contact electrode that contacts the top face of the p-type semiconductor layer; a dielectric protective layer that covers the p-side contact electrode, contacts the top face of the p-type semiconductor layer, and is made of SiO2; and a dielectric cover layer that contacts the individual side faces of the active layer and the p-type semiconductor layer, contacts the top face of the p-type semiconductor layer, covers the dielectric protective layer, and is made of Al2O3.
Patent TW-202325319-A (TW)
Title: Production of exosomes and uses thereof
Inventor: CHEN YI-WEN
IPC: A61K35/12
Filed: 2022-12-02
Abstract: The present invention provides a method for producing exosomes in a large-scale by using a cyclic tensile bioreactor to stimulate cells to release exosomes. In addition, the present invention also provides an exosome having an anti-HLA-G protein specific for cancer which is used as a delivery vehicle to deliver therapeutic agents for treating cancer.