Patent SG-11201909037T-A (SG)
Title: Substrate cleaning apparatus
Inventor: WANG HUI
IPC: B08B7/04
Filed: 2017-03-30
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 04 October 2018 (04.10.2018) W I PO I ~~ll~~~~~~~~ 011101010VIIIOH olo olo milo111111 mom ow (10) International Publication Number WO 2018/176306 Al PCT 1-1 O Cr) 1-1 00 O C 1-1 (51) International Patent Classification: BO8B 1/04 (2006.01) BO8B 7/04 (2006.01) BO8B 3/02 (2006.01) H01L 21/304 (2006.01) (21) International Application Number: PCT/CN2017/078732 (22) International Filing Date: 30 March 2017 (30.03.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- tech Park, Shanghai 201203 (CN). (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). WU, Jun; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). CHENG, Cheng; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). WANG, Xi; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). CHU, Zhenming; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). (74) Agent: SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, (54) Title: SUBSTRATE CLEANING APPARATUS Fig 1 (57) : A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process. [Continued on next page] WO 2018/176306 Al IMEDIMOM0101011MENOMMEN0111001101 110INVOIMIE SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))