baber/WOPTO huggingface dataset:
Patent TW-457791-B (TW)
Title: A transmission system for voice and/ or video signals, its transmitting device and receiving device
Inventor: UTSUNOMIYA HIROSHI
IPC: H04N21/488
Filed: 2000-03-22
Granted: 2001-10-01
Abstract: The technical issue of this invention is to effectively display the data of signal generating devices or the signal forms through images. The solution provided by this invention is the following: the output signals from the analog signal generators 11, 21 are fed to the analog signal processing circuits 34, 35 through the interfaces 14, 24, signal lines 15, 25, and interfaces 31, 33. The output signals from the digital signal generators 12, 22 and the output signals from the data generating circuits 13, 23 are combined by the multiplexer 16, 26, and then fed to de-multiplexer 37 through interfaces 17, 27, convergence rows 18, 28, and interface 32. The signals from the separated generators 12, 22 are fed to the digital signal processing circuit 38 for processing. The signals from the separated generating circuits 13, 23 are fed to the data processing circuit 39, and then become the images of the corresponding data representing the individual devices and/or the output signal forms. The images are combined with the signals from the signal processing circuits 34, 35, 38, and then are fed to the monitor 40.
Patent TW-423975-B (TW)
Title: A clamping type buffer mechanism adapted for exercising apparatus
Inventor: WANG GUO-LIANG
IPC: A63B22/02
Filed: 2000-06-09
Granted: 2001-03-01
Abstract: The present invention relates to a clamping type buffer mechanism adapted for exercising facility, which is installed between the connection pivot axis, where is located at the proper lower position of main body of exercising facility, and the ground or support parts. The clamping type buffer mechanism comprises a pair of catch blocks with corresponding shape each other so that a setting space is then formed in between that of catch clamps, which is made on the top end of each catch block, to be provided a buffer soft pad tightly inserted therein, and each catch block is provided with two rolling axles located at proper position of each outer sides end. Thus, when main body of the exercising facility is forced and pressed downward the stress force is then transmitted to the pair of catch blocks by way of the connection pivot axis, and at this moment the pair of catch blocks, resulted from whose respective central pivot hole of each is forced, will be simultaneously moved and directed downward so that the rolling axle of each outer sides end of catch block, resulted from in contact with the ground or support parts, is exerted to a reacting force directed to upward, and the catch clamps are therefore caused to be relatively clamped each other directed to inside so as to obtain an excellent buffer effect.
Patent TW-527393-B (TW)
Title: Polymethylacrylate molding material having modified flow property with modified impact resistance
Inventor: HOB WERNER
IPC: C08L33/12
Filed: 2000-06-14
Granted: 2003-04-11
Abstract: The invention relates a polymethylacrylate molding material with modified impact resistance, which is characterized in that the Vicat melting temperature is up to 90 DEG C according to ISO 306(B50), the notch impact resistance KSZ(Charpy) at 23 DEG C is at least 3.0 kJ/m<2> according to ISO 179/1eA and, the flow property MNR (230 DEG C/3.8 kg) is at least 11 m<3>/min according to ISO 1133, the preparation of which is carried out by melting and mixing (a) 80-98 wt% polymethylacrylate molding material with modified impact resistance with (b) 20-2 wt% polymethylacrylate molding material with low molecular weight; wherein the molding material with modified impact resistance comprise 70-99 wt% matrix, methylacrylate monomer containing 80-100 wt% free groups for polymerization, optional additional methylacrylate monomer containing 0-20 wt% free groups for polymerization and 1-30 wt% impact resistance modifier, the viscosity (eta sp/c) of both methylacrylate monomer containing 80-100 wt% free groups for polymerization and optional additional methylacrylate monomer containing 0-20 wt% free groups for polymerization are between 25-35 ml/g in chloroform according to ISO 1628 Chapter 6.
Patent TW-526477-B (TW)
Title: A/V data recording device and method, and the disk recording with the same
Inventor: NAKAMURA TADASHI
IPC: G11B27/36
Filed: 2000-07-29
Granted: 2003-04-01
Abstract: The present invention provides an A/V data recording device and method, which can reduce the searching operation to the minimum even using UDF file system. The A/V data recording method has the file management information, which treats the continuous blocks on the disk as the extent for management, and groups the extents as files for management. The present invention is characterized by creating new directories on the disk, and protecting the distributed extents as the reserved regions for recording file management information.
Patent TW-463048-B (TW)
Title: Determination of actual defect size in cathode sputter targets subjected to ultrasonic inspection
Inventor: GILMAN PAUL S
IPC: H01L21/203
Filed: 2001-02-20
Granted: 2001-11-11
Abstract: A method for determining actual size of internal target defects by ultrasonic inspection is provided in which the amplitude of signals generated by ultrasonic inspection are compared to metallurgical size measurements obtained through the use of optical microscopes or scanning electron microscopes. From this comparison, a correlation factor may be obtained to determine the accuracy of the ultrasonic measurements. For a particular sputter target material, defect sizes obtained by ultrasonic inspection may then be multiplied by the correlation factor to determine the actual defect size for that defect. The use of actual defect sizes to determine defect sizes from ultrasonic inspection provides a more accurate determination of defect sizes than prior methods and provides a reliable means for accepting or rejecting targets for critical circuit manufacturing operations.
Patent TW-478024-B (TW)
Title: Die Bonder or Wire Bonder with a suction device for pulling flat and holding down a curved substrate
Inventor: BEHLER STEFAN
IPC: H05K13/00
Filed: 2000-12-06
Granted: 2002-03-01
Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate (3) equipped with or to be equipped with a semiconductor chip onto a supporting surface (2) of a plate (1). The plate (1) contains at least one cavity (7) open towards the supporting surface (2) in which there is a vacuum gripper (8.1; 8.2; 8.3; 8.4) made out of flexible material, whereby the vacuum gripper (8.1; 8.2; 8.3; 8.4) is lowerable into the cavity (7) during transport of the substrate (3) and which is raisable above the level of the supporting surface (2) to apply suction to the substrate (3).
Patent TW-486827-B (TW)
Title: Method for manufacturing non-volatile semiconductor memory and non-volatile semiconductor memory manufactured thereby
Inventor: IIJIMA MITSUTERU
IPC: H01L27/115
Filed: 2000-12-14
Granted: 2002-05-11
Abstract: The present invention is a method for manufacturing a non-volatile semiconductor memory cell of a structure provided with a trap gate between a word line serving as a control gate, and a channel region of a substrate, the trap gate is constructed of an insulating layer and capable of trapping a carrier. The trap gate constructed of the insulating layer can change a threshold of a transistor locally because the carriers injected and trapped inside do not move in the gate. As associated with it, the trap gate does not need to be separated between adjacent memory cells. In addition, the insulating layers for electrical isolation need to be formed on and under the trap gate constructed of the insulating layer. However, the gate insulating layer of the three-layers structure can be formed very thin and highly reliably compared with the conventional floating gate structure. According to the present invention, the manufacturing method comprises the steps of forming a striped pattern extending in the word line direction; depositing an insulating film on the striped pattern and then forming a side wall insulating film on both side walls of the striped pattern by etching the surface throughout; selectively removing the striped pattern and then depositing a gate insulating film including a trap gate insulating film on an exposed substrate; and depositing a conductive layer throughout on the surface and removing the upper part of the conductive layer except for a region between the side wall insulating films. Consequently, the conductive layer between the side wall insulating films becomes the word line.
Patent TW-521527-B (TW)
Title: Four-fiber ring optical cross-connect system using 4x4 switch matrices
Inventor: LI MING-JUN
IPC: H04B10/275
Filed: 2001-03-26
Granted: 2003-02-21
Abstract: An optical cross-connect system provides 4x4 switching matrices and self-healing from any single point of failure. The switching matrices route working traffic and redundant protection traffic between a plurality of client network elements and an optical ring. The system also has a client interface for transporting the working traffic and the protection traffic between the switching matrices and the client network elements. The optical cross-connect system further includes a ring interface for transporting the working traffic and the protection traffic between the switching matrices and the optical ring. The switching matrices are structured so that protection is provided from single point failures by electrical switching at the client network element location. This significantly reduces the need for optical switching within the matrices.
Patent TW-484150-B (TW)
Title: Multilayer capacitor
Inventor: AHIKO TAISUKE
IPC: H01G4/232
Filed: 2000-12-27
Granted: 2002-04-21
Abstract: A multilayer capacitor comprised of a capacitor body, a first internal electrode arranged therein, and a second internal electrode arranged below the first internal electrode separated by a ceramic layer. The capacitor body is provided with a first through-hole electrode passing through the second non-contact hole of the second internal electrode and electrically connected to the first internal electrode and a second through-hole electrode passing through the first non-contact hole of the first internal electrode and electrically connected to the second internal electrode in columnar shapes extending to intersect the internal electrodes. The first through-hole electrode is electrically connected to the first external electrodes arranged in island shapes at the upper and lower flat portions. The second through-hole electrode is electrically connected to the second external electrodes arranged in island shapes at the surfaces of the capacitor body.
Patent TW-470982-B (TW)
Title: Multilayer electronic device and method for producing same
Inventor: TOGASHI MASAAKI
IPC: H01G4/30
Filed: 2000-12-28
Granted: 2002-01-01
Abstract: A multilayer electronic device comprised of a capacitor body in which a plurality of internal electrodes are separately arranged in a plurality of blocks via ceramic layers. At least one lead is led out from each internal electrode. The terminal electrodes connected to each lead is arranged at the side faces of the capacitor body. The polarities of the voltages supplied to the nearby terminal electrodes in the same side face differ.
Patent TW-502222-B (TW)
Title: A PC card having an antenna unit
Inventor: KOMIYA KOJI
IPC: G06F1/16
Filed: 2001-01-03
Granted: 2002-09-11
Abstract: To offer a small and thin PC card having an antenna unit. An antenna storage part 22c is provided on a thin board or plate-like main body 2 of the PC card 1 which most part of the top and bottom is covered by the radio wave shield material 10. 12. The extendible antenna unit 3 is inserted in this storage part of the antenna unit. In time of using, at least the antenna part 32a of the antenna unit 3 is expanded outside of the radio wave shield material of the main body 2 and retained in the expanded position to receive and send the radio wave. In time of not using, the antenna unit 3 is stored and retained in the stored position where the substantially entire antenna unit 3 is stored in the main body 2.
Patent TW-503199-B (TW)
Title: Motor-driven bicycle
Inventor: SAKAGAMI KOJI
IPC: B62M6/45
Filed: 2001-02-26
Granted: 2002-09-21
Abstract: To provide a motor-driven bicycle, including a drive motor for generating a self-running power in response to an operated amount of a self-running operation by a driver, capable of achieving a self-running function matched to a walking speed and obtaining an optimum acceleration irrespective of a road condition or a variation in load such as a deadweight. A motor-driven bicycle, which includes a drive motor for generating a self-running power in response to an operated amount of a self-running operation by a driver, is provided with an acceleration detecting portion 203 for detecting an acceleration, and a rapid acceleration suppressing control portion 205 for controlling the self-running power on the basis of the detected acceleration. If the detected acceleration is more than a specific reference acceleration, the rapid acceleration suppressing control portion 205 gradually reduces the self-running power to be supplied to a drive motor M from a reference value determined in response to the amount of the self-running operation, and thereafter, if the acceleration is less than the reference acceleration, the control portion 205 gradually increases the self-running power to be supplied to the drive motor M up to the reference value determined in response to the amount of the self-running operation. The bicycle is further provided with a hand-pushing drive control portion 211 for making the drive motor M generate a self- running power corresponding to a walking speed in response to a self-running operation inputted from self-running operation inputting means (throttle lever). If it is decided that the self-running operation by the throttle lever is in the driver's non-riding state, the hand-pushing drive control portion 211 makes the drive motor M generate the self-running power corresponding to the walking speed.
Patent TW-536711-B (TW)
Title: Semiconductor integrated circuit
Inventor: KANNO YUSUKE
IPC: H01L27/108
Filed: 2001-03-28
Granted: 2003-06-11
Abstract: A semiconductor integrated circuit is disclosed, in which a memory is activated at high speed in commensurate with a high-speed logic circuit mounted with the memory in order to reduce the cost using a DRAM of a 3-transistor cell requiring no capacitor. A pair of data lines connected with a plurality of memory cells having the amplification function are set to different precharge voltage values, thereby eliminating the need of a dummy cell. The elimination of the need of the dummy cell reduces both the required space and the production cost, which is different from the conventional DRAM circuit using a gain cell. Also, a DRAM circuit can be fabricated through a fabrication process matched with an ordinary logic element.
Patent TW-528633-B (TW)
Title: Method for conveying screw with reduced screw thread damage and conveyance device for performing the method
Inventor: JANG YUN-DE
IPC: B23G11/00
Filed: 2001-05-02
Granted: 2003-04-21
Abstract: The present invention provides a method for conveying screws with reduced screw thread damage during the conveying process, as well as a conveyance device for carrying out the method, which is practiced generally by modifying one conveyor belt of the conveyance device to make the conveyor belt comprised of a receiving section for receiving screws, a uprising section that ascends gradually, and a down-moving section that gradually descends wherein the receiving section is located within a previous processing tank, while the down-moving section is located above a next processing tank. By means of the down-moving section, screws that are conveyed are moved toward the next processing tank in a gradually descending manner and then falls from a very close height thereby damages to the screw threads caused by hitting and impacting each other due to a great falling distance of the conveying process can be eliminated.
Patent TW-511409-B (TW)
Title: Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
Inventor: NAKAMURA YASUAKI
IPC: H01L23/057
Filed: 2001-05-14
Granted: 2002-11-21
Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7'), in particular within a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity (20), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard (40).
Patent TW-I235689-B (TW)
Title: Multi-chamber carrier head with a flexible membrane
Inventor: CHEN HUNG-CHIH
IPC: H01L21/304
Filed: 2001-05-25
Granted: 2005-07-11
Abstract: A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portion and secured to the base assembly. The volume between the base assembly and the flexible membrane forming a plurality of pressurizable chambers.
Patent TW-483112-B (TW)
Title: Method to reduce junction leakage current of borderless contact silicon nitride
Inventor: CHEN MIIN-MING
IPC: H01L21/768
Filed: 2001-07-02
Granted: 2002-04-11
Abstract: This invention provides a method to reduce junction leakage current of borderless contact silicon nitride. A semiconductor substrate is provides and a gate oxide layer and at least two polysilicon gate structures are formed in order on the substrate. Then, at least a spacer is formed on the at least two polysilicon gate structures and the gate oxide layer between the at least two polysilicon gate structures is removed to expose the semiconductor substrate. A silicon dioxide layer is formed on the surface of the semiconductor substrate between the two polysilicon gate structures through thermal oxidation process. A conformal silicon nitride layer is deposited on the silicon dioxide layer, the two polysilicon gate structures and the spacer to function as a borderless etching stop layer. Finally, an inner dielectric layer is formed on the conformal silicon nitride layer.
Patent TW-522440-B (TW)
Title: A single crystal, dual wafer, tunneling sensor or switch with substrate protrusion and a method of making same
Inventor: KUBENA RANDALL L
IPC: G01C19/5663
Filed: 2001-07-04
Granted: 2003-03-01
Abstract: A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. At least one of the mating structures includes a protrusion extending from a major surface of at least one of said substrates. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of first substrate is moved into a contronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer is removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.
Patent TW-499547-B (TW)
Title: Pneumatic type air dewatering device
Inventor: CHEN BO-HUEI
IPC: B01D5/00
Filed: 2001-07-16
Granted: 2002-08-21
Abstract: The present invention relates to a pneumatic type air dewatering device, comprising mainly a high pressure container sustainable to high pressure, provided with several chambers and a zigzag type separating and upward-guiding channel. By changing the angle, volume and flow rate of the air flow utilizing the chambers and the zigzag type separating and upward-guiding channel, moisture of the air can be effectively separated, condensed, and removed. This provides a pneumatic air dewatering device which has a simple structure, does not require additional energy, and has a extremely high dewatering efficiency.
Patent TW-I222535-B (TW)
Title: Improved diffusion layer of backlight module
Inventor: TSENG CHIH-CHIANG
IPC: G02F1/1335
Filed: 2001-07-31
Granted: 2004-10-21
Abstract: An improved diffusion layer of backlight module is disclosed, which comprises a transmitting substrate layer, its bottom surface has a transparent back adhesive layer for pasting onto the surface of the applied object. The top surface of the transmitting substrate has a middle diffusion layer associated, so as to uniformly diffuse the light. Its surface has several series of stripes and concave slits rolled by the working way of rolling stripe, so that its whole surface is atomized uniformly. Also, a transparent protection film is associated on the diffusion layer, so as to protect the surface of middle diffusion layer.
Patent TW-543082-B (TW)
Title: Electronic device having controllable conductance
Inventor: AONO MASAKAZU
IPC: H01L49/00
Filed: 2001-08-31
Granted: 2003-07-21
Abstract: The present invention provides a method for constructing an electric bridge that contains fine lines or point contact causing quantification of conductance. In addition, the present invention also provides an easy method for conducting conductance control of the electric bridge. The purpose of the invention is to provide a kind of electronic device used in the conductance control of the electric bridge, fine line, point contact built in between the electrodes. The invented electronic device is composed of the first electrode, which is formed by the mixed conductive material having ionic conduction and electronic conduction, and the second electrode, which is formed by the conductive material such that it is capable of controlling the conductance in between the electrodes. For the best results, Ag2S, Ag2Se, Cu2S, or Cu2Se can be used as the mixed conductive material. In the invention, a voltage is applied in between the aforementioned electrodes so as to make the second electrode have a negative voltage relative to the first electrode and make the mobile ions move from the first electrode toward the second electrode. Thus, the electronic device of the electric bridge is formed in between the electrodes. Furthermore, the invention relates to a control method of conductance in between the electrodes and includes at least one of the following two steps: the step of forming electric bridge in between electrodes by adding a voltage in between the electrodes so as to make the second electrode have a negative voltage relative to the first electrode and make the mobile ions move from the first electrode toward the second electrode; and the step of making the electric bridge fine or cutting off the electric bridge by inversing the polarity of voltage in between the electrodes. In particular, the invention is featured with having the quantification of conductance in between the electrodes.