baber/WOPTO huggingface dataset:
Patent TW-202217976-A (TW)
Inventor: CHEN CHUN-YUAN
IPC: H01L21/336
Filed: 2021-08-02
Abstract: 在此提供半導體裝置及其形成方法。依據本發明實施例的一實施形態，一種半導體裝置包括：第一閘極結構設置於第一背面介電部件之上；第二閘極結構設置於第二背面介電部件之上；閘極切割部件從上述第一閘極結構與上述第二閘極結構之間連續地延伸到上述第一背面介電部件與上述第二背面介電部件之間；以及襯層，設置於上述閘極切割部件與上述第一背面介電部件之間並且設置於上述閘極切割部件與上述第二背面介電部件之間。
Patent TW-202211343-A (TW)
Title: Particle detector, particle detection apparatus, and particle detection method
Inventor: YAMANE TAKESHI
IPC: H01J37/244
Filed: 2021-08-02
Abstract: A particle detector comprising: a plurality of superconductive lines each including a superconductive material, the plurality of superconductive lines extending in a first direction and being arranged in a second direction intersecting the first direction; a plurality of conductive lines each including a conductive material, the plurality of conductive lines extending in a third direction different from the first direction and being arranged in a fourth direction intersecting the third direction; insulating films each being interposed at an intersection point between one of the plurality of superconductive lines and one of the plurality of conductive lines.
Patent TW-202222110-A (TW)
Title: Flexible printed circuit board and display apparatus having the same
Inventor: LIU HSUAN-CHING
IPC: G02F1/133
Filed: 2021-09-02
Abstract: A flexible printed circuit (FPC) board includes a base film, a pair of traces and a chip. The traces are disposed on the base film, and each trace has opposite first and second terminals. The chip is disposed on the base film and has pins that are respectively coupled to the first terminals of the traces. When the FPC board is bonded to a panel through the second terminals of the traces that are shorted to each other, the chip is configured to transmit a detection signal through one of the pins and receive a reception signal through the other of the pins, and to determine whether the FPC board works normally with the panel depending on the reception signal.
Patent TW-202147547-A (TW)
Inventor: HSU JUN-CHUNG
IPC: H01L23/498
Filed: 2020-04-30
Abstract: Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof.
Patent TW-202312076-A (TW)
Title: Feeder line connecting-to-grid capacity calculation method to calculate a connecting-to-grid capacity result of a bus of the feeder line
Inventor: Zhang wen-qi
IPC: G06Q50/06
Filed: 2021-09-14
Abstract: A feeder line connecting-to-grid capacity calculation method comprises: (A) determining whether a difference between a wholesale capacity of a feeder line and a sum of multiple capacity parameters is greater than zero; (B) in response to determining that the difference is greater than zero, initializing a connecting-to-grid capacity of a bus to be calculated of the feeder line to be the difference; (C) obtaining a voltage change rate corresponding to each bus of the feeder line based on a load flow analysis; (D) determining whether a maximum voltage change rate of all buses is within a preset range, (E) in response to determining the maximum voltage change rate is within a preset range, determining whether a sum of the connecting-to-grid capacity and the capacity parameters is greater than the wholesale capacity; and (F) in response to determining that the sum is not greater than the wholesale capacity, using the connecting-to-grid capacity as a connecting-to-grid capacity result of the bus to be calculated.
Patent TW-202224120-A (TW)
Inventor: UEDA SHINJI
IPC: H01L21/56
Filed: 2021-10-05
Abstract: 提供一種具有可薄型化之新構造之裝置。
        裝置10係包括第1密封構件20、第2密封構件30、第1電路構件40及第2電路構件50。第1密封構件20係包括作為基座之由薄膜所組成之第1薄膜。在裝置10形成有密封空間18。密封空間18係被第1密封構件20及第2密封構件30所包圍，遮斷與裝置10外部之相通。第1電路構件40及第2電路構件50係被密封於密封空間18的內部。第1電路構件401係包括第1接點48。第2電路構件50係包括第2接點58。第1接點48與第2接點58係彼此接觸。在第2密封構件30設有凹凸部62。凹凸部62係接觸到第2電路構件50，而且，其覆蓋對應於第2接點58之既定領域19。
Patent TW-202214400-A (TW)
Title: Drive tool
Inventor: FURUICHI KAZUYA
IPC: B23D49/10
Filed: 2021-10-05
Abstract: This driving tool comprises: a main shaft (18) that is rotationally driven to rotate about an axial line (J); an eccentric part (25) that is provided to the main shaft (18) and that has a center offset from the axial line (J); a movable body (38) which has a long hole (35) having inserted thereto the eccentric part (25), which linearly reciprocates in an X direction orthogonal to the axial line (J) when the eccentric part (25) rotationally moves around the axial line (J) according to the rotation of the main shaft (18) while being in contact with the long hole (35), and to which a leading-end tool can be attached; a counter weight (32) disposed so as to linearly reciprocate in the X direction; and a transmission mechanism (49) that transmits moving force, generated when the movable body (38) is linearly reciprocating, to the counter weight (32) to cause the counter weight (32) to linearly reciprocate in a direction reverse to the movable body (38) in the X direction. The counter weight (32) is disposed on the axial line (J).
Patent TW-202318176-A (TW)
Title: Service system for synchronizing "virtual audio and video at distributed sites" by utilizing actions of central control physical personnel capable of performing seamless switching between AI service and human service
Inventor: LAI JIN-DE
IPC: G06F3/048
Filed: 2021-10-15
Abstract: The present invention provides a service system for synchronizing "virtual audio and video at distributed sites" by utilizing actions of central control physical personnel, which includes a plurality of front-end equipment and a back-end equipment that are connected to each other by telecommunications, whereby the requirement of service manpower allocation can be effectively reduced through the concept of virtual-real integration to allow customers to obtain an excellent user experience. After the front-end equipment captures the audio and video of a customer, a glass information station is used to display the dynamic picture of virtual characters, and AI technology is used to automatically generate a synthetic human voice. The back-end equipment is provided for the service personnel to operate the real-time audio and video for the customer, and a voice-tuning transmitter is used to modulate artificial response information to generate modulated human voice for output to the front-end equipment, while the behavior of the service personnel is dynamically captured to drive the dynamic picture of virtual characters to act in a consistent manner. The synthesized human voice and the modulated human voice have the same timbre and audio frequency range, which can perform seamless switching between AI service and human service, thereby enhancing the application intensity of virtual-real integration technology.
Patent TW-202319121-A (TW)
Title: Electrospray atomizing assembly device including a syringe set and an electrode set
Inventor: TSAI CHIH-HONG
IPC: B05B5/025
Filed: 2021-11-05
Abstract: An electrospray atomizing assembly device includes a syringe set and an electrode set. The syringe set is equipped with a conductive needle tube on the top of an insulating syringe, and contains a liquid and a piston in a chamber. The electrode set is radially provided with a partition inside an insulating cylinder holder to separate and form the spray space and the relative mounting space, and then respectively provided with a first electrode and a second electrode to insert the top of the insulating syringe into the mounting space of the insulating cylinder holder. The conductive needle tube is connected through the first electrode and the partition. The piston is used to push the liquid through the conductive needle tube to spray and form charged ion mist. In addition, the charged ion mist column sprays outward through the second electrode body and the insulating cylinder holder so that the mist electrospray is nano-sprayed on the human skin.
Patent TW-202217409-A (TW)
Title: Device For Combining Light Beams Which Interact With Adjacently Arranged Pixels Of A Light Modulator
Inventor: LEISTER NORBERT
IPC: G03H1/22
Filed: 2017-09-29
Abstract: The present invention relates to a device for combining light beams which interact with adjacently arranged pixels of a light modulator. The present invention furthermore relates to a device for beam combination and to a spatial light modulation device for complex-valued modulation. The invention relates to a device for beam combination, and to an optical arrangement of polarization-sensitive component parts which allows complex-valued modulation of a light field by means of a phase-modulating light modulator and a beam combiner, which is insensitive to changes in the incidence direction of the illumination wave. This document furthermore also relates to various arrangements of reflectively operating light modulators.
Patent TW-202221942-A (TW)
Title: Semiconductor structure and method for fabrication thereof, and light-emitting device and method for fabrication thereof
Inventor: Zhang li-yang
IPC: H01L51/56
Filed: 2021-11-09
Abstract: Provided by the present application are a semiconductor structure and method for fabrication thereof, and a light-emitting device and method for fabrication thereof. The semiconductor structure comprises: a substrate, a first semiconductor layer, a barrier layer, an active layer, a second semiconductor layer, a first electrode, and a second electrode; the second semiconductor layer is a conductive distributed Bragg reflector (DBR) structure; the first semiconductor layer comprises a flat part, first projections, and second projections stacked sequentially in the vertical direction, the second projections correspond one-to-one to first through-holes, and the second projections are arranged at intervals, the side faces of the second projections being inclined faces; the active layer, second semiconductor layer, and a first electrode are arranged stacked in sequence on the second projections of the first semiconductor layer; the barrier layer is provided with a second through-hole, and a second electrode is formed in the second through-hole. The light-emitting device comprises the semiconductor structure. In the present application, the second semiconductor layer is arranged as a conductive DBR structure, and the side walls of the epitaxial structure are arranged as inclined faces, improving the luminous efficiency of the semiconductor device.
Patent TW-202225235-A (TW)
Title: Thermoplastic polyurethane, resin composition containing the same, and molded product obtained therefrom
Inventor: SUZUKI YASUYUKI
IPC: C08G18/66
Filed: 2021-11-23
Abstract: A thermoplastic polyurethane as a reaction product was obtained from components including (A) an aliphatic polyisocyanate, (B) an aliphatic polyol having at least one side chain, and (C) chain extenders. The aliphatic polyol (B) is a polycarbonate diol of formula (1): wherein n is 4 to 40, and n+1 Rs are composed of a linear alkylene and an alkylene having at least one side chain so as to have the molar ratio of the linear alkylene to the alkylene having at least one side chain in the range of 0: 100 to 95: 5, and. The chain extender (C) is a combination of 1,4-butanediol with 1,3-propanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol or ethylene glycol, and the amount of 1,4-butanediol is set to be 50% by mass or more based on the total amount of the chain extenders (C). A resin composition containing the thermoplastic polyurethane, and the molded product were also obtained.
Patent TW-202321162-A (TW)
Title: Pressure balancing system for two sides of an edr film stack
Inventor: DING ALLEN FEI
IPC: C02F1/469
Filed: 2021-11-26
Abstract: The present invention relates to a pressure balancing system for two sides of an electrodialysis reversal (EDR) film stack. The pressure balancing system includes a first source water inlet, a second source water inlet, an EDR film stack, a first pressure sensor, a second pressure sensor, a third pressure sensor, a fourth pressure sensor, a variable speed pump, a one-way valve, a clean water outlet, a waste water outlet, and a control system module. With the four pressure sensor detecting water pressures at four ports on two sides of the EDR film stack and with the variable speed pump and the control system module adjusting water pressure at the waste water outlet, water pressure at the clean water outlet is equivalent to the water pressure at the waste water outlet. Accordingly, the water pressures on the two sides of the EDR film stack can be balanced, and service life and water purification efficiency of the EDR film stack can be improved.
Patent TW-202247048-A (TW)
Title: Digital output mechanisms for analog neural memory in a deep learning artificial neural network
Inventor: TRAN HIEU VAN
IPC: G11C16/02
Filed: 2021-12-06
Abstract: Numerous embodiments for reading or verifying a value stored in a selected non-volatile memory cell in a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. The embodiments comprise various designs of input blocks for applying inputs to the VMM array during a read or verify operation and various designs of output blocks for receiving outputs from the VMM array during the read or verify operation.
Patent TW-202324285-A (TW)
Inventor: TANG JING-JOU
IPC: G06Q50/28
Filed: 2021-12-07
Abstract: The present invention relates to a container truck management method and system. A truck tractor is provided with a processing unit, a driver recognition module, a first pairing module, a first locking module, and a second locking module. The first locking module is connected to an engine of the truck tractor, and the second locking module is connected to a trailer coupling mechanism of the truck tractor. A truck trailer is provided with a second paring module. When the driver recognition module receives an incorrect driver recognition message, the processing unit actuates the first locking module to lock the engine. When the first pairing module is not paired with the second pairing module, the processing unit actuates the second locking module to lock the trailer coupling mechanism so that the truck trailer is unable to be coupled therewith. In this way, the containers on the truck trailer can be transported only in the situation that the driver identity, the truck tractor, and the truck trailer are all matched correctly.
Patent TW-202230156-A (TW)
Inventor: VAREKAMP CHRISTIAAN
IPC: G06F16/10
Filed: 2021-12-10
Abstract: 一種用於在電腦儲存系統上儲存代表虛擬物件之資料的方法。該方法包含儲存對應於該等虛擬物件之物理性質的常數資料，該常數資料將在該資料經讀取時維持恆定。該常數資料包含代表該等虛擬物件之一或多者的物理性質的一或多個常數元素。該方法亦包含儲存對應於該等虛擬物件之物理性質的可變資料，該可變資料在儲存該資料時係不確定的。該可變資料包含代表該等虛擬物件之一或多者之不確定的物理性質的一或多個可變元素，且其中各可變元素包含一值範圍及該值範圍的一機率函數。
Patent TW-202235265-A (TW)
Title: Gas barrier multilayer body and packaging material
Inventor: HARADA TOMOAKI
IPC: B32B27/18
Filed: 2021-12-20
Abstract: The purpose of the present invention is to provide a gas barrier multilayer body which is able to be produced by a simple process, while achieving stable gas barrier properties even in a high humidity environment. The inventors have achieved the above by means of a gas barrier multilayer body which is obtained by stacking a metal layer (A) that is formed by a vapor-phase thin film formation method and a layer (B) that is formed from a compound which has a carboxy group in the structure, thereby achieving a gas barrier multilayer body which is able to be produced by a simple process, while having stable gas barrier properties even in a high humidity environment.
Patent TW-202237744-A (TW)
Title: Flame-retardant polyamide resin composition and molded article comprising same
Inventor: IWAMURA KAZUKI
IPC: C08K5/524
Filed: 2022-01-17
Abstract: To provide a flame-retardant polyamide resin composition having little bleed-out of flame retardant and exceptional thermal discoloration resistance, moldability, snap fit of parts, etc., while having flame retardancy at the UL 94V-0 level over a wide range of thickness. A flame-retardant polyamide resin composition characterized by: containing a polyamide resin (A) and melamine cyanurate (B); containing 90-98 parts by mass of the polyamide resin (A) and 2-10 parts by mass of the melamine cyanurate (B) relative to a total of 100 parts by mass of the components (A) and (B); being such that the proportion of a polyamide 66 resin (A1) in the polyamide resin (A) is 55-85 mass%, and the proportion of a polyamide 6 resin (A2) in the polyamide resin (A) is 15-45 mass%; and containing 0.01-1 part by mass of a phosphorus-based antioxidant (C), 0.01-1 part by mass of a hindered-phenol-based antioxidant (D), and 0.1-1 part by mass of a C22 or lower fatty acid metal-salt-based lubricant (E) relative to a total of 100 parts by mass of the components (A) and (B).
Patent TW-202238926-A (TW)
Inventor: CHEN WAN-TE
IPC: H01L27/04
Filed: 2022-01-18
Abstract: An integrated circuit structure includes a semiconductor substrate, a bottom electrode routing, a capacitor structure, a top electrode routing. The bottom electrode routing is over the semiconductor substrate. The capacitor structure is over the bottom electrode routing. The capacitor structure includes a bottom metal layer, a middle metal layer above the bottom metal layer, and a top metal layer above the middle metal layer. When viewed in a plan view, the top metal layer has opposite straight edges extending along a first direction and opposite square wave-shaped edges connecting the opposite straight edges, the square wave-shaped edges each comprise alternating first and second segments extending along a second direction perpendicular to the first direction, and third segments each connecting adjacent two of the first and second segments, wherein the third segments extend along the first direction.
Patent TW-202239982-A (TW)
Title: Al bonding wire for semiconductor devices
Inventor: OYAMADA TETSUYA
IPC: H01L21/60
Filed: 2022-01-27
Abstract: The present invention provides an Al bonding wire for semiconductor devices, which makes it possible to stably provide satisfactory bonding strength at a 2nd bonding part. Provided is an Al bonding wire for semiconductor devices, which contains at least one element selected from Sc, Zr and Mg in a total amount of 0.01% by mass or more and less than 0.8% by mass, and has a property such that, when the crystal orientation of a cross-section that includes a wire axis of the bonding wire and is parallel to the direction of the wire axis is measured, the orientation ratio of <100> crystal orientation having an angle difference relative to the direction of the wire axis of 15 degrees or less is 30% to 90% inclusive.
Patent TW-202331182-A (TW)
Title: Thermal module structure
Inventor: LIN SHENG-HUANG
IPC: F28F3/02
Filed: 2022-01-28
Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.
Patent TW-202302511-A (TW)
Title: Acetal compound, additive containing said compound, and resist composition containing said compound
Inventor: MASUKAWA Tomohiro
IPC: C07C67/29
Filed: 2022-02-24
Abstract: To provide: a composition which is for thick film resist and with which cracks in a resist film are suppressed and a pattern with a favorable surface condition can be formed; and an acetal compound from which the same can be formed. Provided are: an acetal compound represented by formula (1) (in the formula, R1 represents a C1-C12 alkyl group, a C5-C12 cycloalkyl group, or a C1-C12 acyl group, n is an integer of 1-5, m represents an integer of 2-4, and Ar is a residue obtained by removing hydrogen atoms from hydroxyl groups in a m-valent polyhydric phenol); and a composition which is for thick film resist and contains the same.
Patent TW-202240034-A (TW)
Title: Method for producing silicon wafer, and silicon wafer
Inventor: MAEDA SUSUMU
IPC: H01L21/324
Filed: 2022-02-25
Abstract: According to the present invention, there is produced a clean silicon wafer which has less heavy metal contamination on the wafer surface, while being provided with a DZ layer in a device active region in the surface of the silicon wafer that has been subjected to a heat treatment, the DZ layer being free from a micro defect, and also being provided with an IG layer that has a high gettering ability in a bulk layer. A method for producing a silicon wafer, wherein a silicon wafer is subjected to a rapid temperature raising/lowering heat treatment in a furnace. With respect to a thermal budget of the temperature and time, if the thermal budget with which a heat treatment having a maximum temperature of 1350 DEG C is maintained for a predetermined maximum period of time is taken as 100%, the rapid temperature raising/lowering heat treatment is carried out with 53% to 65% of the thermal budget.
Patent TW-202234984-A (TW)
Title: Inverter device, motor module and vehicle an inverter device, comprising: a power module, a driving circuit board and mask plate
Inventor: AMANUMA TSUBASA
IPC: H05K9/00
Filed: 2022-02-25
Abstract: An inverter device, characterized in comprising: a power module having at least one switching element for converting direct current into alternating current; a driving circuit board arranged to overlap with the power module and driving the switching element; a control circuit board, which is arranged to overlap with the driving circuit board, is electrically connected to the driving circuit board, and controls on/off of the switching element; and a mask plate, which is arranged between the driving and the control circuit board by covering on the driving circuit board, and shields the electromagnetic noise generated from the driving circuit board, the power module has at least two first dowel pins protruding vertically toward the driving circuit board and the mask plate, the driving circuit board and the mask plate each has at least two through holes respectively engaged with the first dowel pins.
Patent TW-202312424-A (TW)
Title: Semiconductor device
Inventor: CHANG JEN-YUAN
IPC: H01L23/31
Filed: 2022-03-07
Abstract: A semiconductor device includes a first semiconductor die mounted on a substrate, a second semiconductor die mounted on the substrate and separated from the first semiconductor die, a first dielectric material between the first semiconductor die and the second semiconductor die and having a first density, and a column of second dielectric material in the first dielectric material, the second dielectric material having a second density different than the first density, and the second dielectric material including a void region.
Patent TW-202306025-A (TW)
Title: Semiconductor structure
Inventor: SU YI-NIEN
IPC: H01L21/76
Filed: 2022-04-07
Abstract: A semiconductor structure and method for forming a semiconductor structure includes formation of a recess in a metal layer during the fabrication process to provide process improvements and a conductive via with reduced contact resistance. The semiconductor structure includes a dielectric layer, a metal layer, an etch stop layer, and a conductive via. The top surface of the dielectric layer extends above a top surface of the metal layer, and a bottom surface of the conductive via extends below the top surface of the dielectric layer.