Patent SG-11201408125T-A (SG)
Title: Adhesive composition or underfill composition
Inventor: OHASHI TAKUYA
IPC: C08G14/073
Filed: 2013-06-05
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» SI^HIB 2013# 12 fll2 0(12.12.2013) w , PO tpCT (10) WO 2013/183679 A1 (51) C08L 61/34 (2006.01) C08G14/073 (2006.01) (21) (22) (25) (26) HI®4>§f]CDl r=E. I DP • C09J179/04 (2006.01) PCT/JP2013/065611 2013 ^6^5 0(05.06.2013) (30) fiBfefix — £: 4#Jg| 2012-127829 2012 ^6^ 5 0 (05.06.2012) JP (71) ttiJiA: Hjflb^lSI^^£tt(NISSAN CHEMIC­ AL INDUSTRIES, LTD.) [JP/JP]; T 1010054 @ 7 #±t!l 1 Tokyo(JP). (72) ffi^(OHASHI, Takuya); T 9392792 6 3 5 HUbfll Toyama (JP). * H? ^.(ENOMOTO, Tomoyuki); T 9392792 a Uj R a lUrfT«H'®rffi*6 3 5 1E^ W^4EJf5EFJTl*3 Toyama (JP). (74) ftIIA: ^ $5^, ^(HANABUSA, Tsuneo cl al.); T 1010062 Ki?vflW-tH|x#!Eai£>5J-& 3TI2 #ite_ «f®3K/TK7-/^> h'J-x-r smfr ¥^PJTI^ Tokyo (JP). (8i) (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). - 21 ^(3)) (54) Title: ADHESIVE COMPOSITION OR UNDERFILL COMPOSITION = (54)i ^ Mmm 0) 0\ m oo i-H cn i-H o CJ O £ u h+vi? n 140X141 (57) Abstract: [Problem] To provide novel adhesive composition a or un­ derfill composition. [Solution] An adhesive composition or underfill com­ position comprising an organic solvent and a polymer in which repeating units, excluding the terminals, solely comprise at least one structural unit represented by formula (1) (in formula (1), R 1 and R 2 independently repres­ ent a hydrogen or methyl, represents X a sulfonyl group or a divalent organic group represented by formula (2) (in formula (2), R 3 and R A independently represent a hydrogen or methyl, at least one of the hydrogens in the methyl optionally being substituted by halogen, a and m is 0 or 1), and represents Y a divalent organic group represented by formula (3) or formula (4) (in for­ mulae (3) and (4), Z represents a single bond, methylene, sulfonyl, or -O-, or a divalent organic group represented by formula (2) in which m is 0; R 5 rep­ resents hydrogen, a methyl, ethyl, or methoxy; R 6 represents a methyl, vinyl, allyl, or phenyl; and n is 0 or 1)). (57)®$: [ISffi] 4 )\, 5fc4B£i»<iisyisuiift (1) 1 1— b ft 3 t fcftSajffljS&X I4T > *- Htl] {a*. R 'RUR B05£ (2) : lit 2 ] (j£tK R iil-> L> (D'pt£< 1 , mlioxii 1 &£to ) Y liTIBie (3) Xlise (4) : Ht3] (a£tK z li JMS ^ -O-mRiZmftOZmt flutes (2) R li7K^J! 5 : L> RMiy^^US, 7'JJIsMX.It7^=JlsM&m