baber/WOPTO huggingface dataset:
Patent TW-503155-B (TW)
Title: Method for cleaning a polishing pad conditioner and apparatus for performing the same
Inventor: YANG MIN-SOO
IPC: H01L21/302
Filed: 2001-02-14
Granted: 2002-09-21
Abstract: A polishing pad conditioner cleaning method and an apparatus for performing the method effectively remove particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in the cleaning bath. An inert gas is injected into the cleaning liquid from the bottom of the cleaning bath. The cleaning liquid is supplied into the cleaning bath. The inert gas is injected for bubbling the cleaning liquid. By the bubbling of the cleaning liquid, the particles sticking to the polishing pad conditioner are removed and the removed particles are overflowed from the cleaning bath. The polishing pad conditioner is effectively cleaned, so the particles and the scratches formed on the wafer are reduced while the polishing process is being carried out by the polishing pad conditioner.
Patent TW-I248658-B (TW)
Title: Trench isolation method
Inventor: LEE HAN-SIN
IPC: H01L21/762
Filed: 2001-03-06
Granted: 2006-02-01
Abstract: In a trench isolation method, an etching mask pattern for forming a trench is formed on a semiconductor substrate. The substrate is etched to form a trench. An insulating layer is formed to fill the trench, and then a material layer is formed on the insulating layer. In this case, the material layer is made of material formed at a high temperature to density the insulating layer. The material layer and the insulating layer are planarly etched and the etching mask pattern is removed, so that a trench isolation layer is completed. Accordingly, although a densification process is avoided, it is possible to form a device isolation layer having a favorable surface profile.
Patent TW-591978-B (TW)
Title: Laminated electronic components
Inventor: URIU KAZUHIDE
IPC: H01P1/203
Filed: 2001-03-14
Granted: 2004-06-11
Abstract: A laminated filter comprises a first dielectric layer 2101a, on one side of a major wall thereof a first shield electrode being disposed; a second dielectric layer 2101b, on one side of a major wall thereof a resonance electrode being disposed; a third dielectric layer 2101c including a connecting electrode disposed opposite to a portion of the resonance electrode; a fourth dielectric layer 2101d, on one side of a major wall thereof a second shield electrode is disposed; a fifth dielectric layer 2101e having at least one side of a major wall exposed to outside; and a grounding electrode 2108 disposed on the other side of said major wall of the first dielectric layer and/or on said one side of a major wall of the fifth dielectric layer. The first grounding electrode and the first shield electrode are electrically connected by means of a via hole 2109 disposed in the first dielectric layer.
Patent TW-492209-B (TW)
Title: Battery having pressure-sensitive circuit breaker mechanism and its manufacturing method
Inventor: AZEMA TADAMITSU
IPC: H01M10/05
Filed: 2001-04-25
Granted: 2002-06-21
Abstract: The invention provides a battery having pressure-sensitive circuit breaker mechanism which is thin, delicate and easy to install utilizing the concept in housing the power generating part of exterior packing inside to form the thinner free space of enclosed part in the exterior packing. The activating member 6 and the fixed member comprises an activating piece portion 6a, which is the end portion located at the outer package body sealing portion 4 side, and an opposing portion 7b of the sealing portion. The thickness of the plate of the activating piece portion 6a and the opposing portion 7b is made thicker than other end portions 6d, 7a located at the outside face of the outer package body 1 having the generating body built-in. Thus, the displacement of one end portion 6d can be transmitted steadily to the other end of the activating piece portion 6a and a high performance pressure- sensitive circuit breaker mechanism is provided.
Patent TW-544875-B (TW)
Title: Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic machine
Inventor: SAKURAI KAZUNORI
IPC: H01L21/60
Filed: 2001-05-01
Granted: 2003-08-01
Abstract: The subject of the present invention is to provide a bump formation method for easily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening 16 in an insulating film 15, which exposes at least a part of a pad 12; and forming the bump 12 so as to be connected to the pad. A resist layer 20 of the through hole 22, which overlaps at least a part of the pad 12 on the plane, is formed. An opening portion 16 is formed on the insulation film 15. A metal layer is formed to connect to the pad 12 exposed from the opening portion 16.
Patent TW-499723-B (TW)
Title: Semiconductor device and its manufacturing method
Inventor: SATO KOJI
IPC: H01L23/495
Filed: 2001-09-10
Granted: 2002-08-21
Abstract: The present invention is used to prevent slip or falling-off between the leading pin and bump so as to make a semiconductor device be miniaturized further and increase the yield. Through the guiding slant 10c of the recess portion 10a on the bump 10 and the effect of the guided slant 6b at the leading foot 6, the leading foot 6 is guided to face toward the center of the bump 10 and have the same posture of the corrected leading-foot 6 so as to prevent it from falling off from the top of the bump 10.
Patent TW-521187-B (TW)
Title: Signal compensation circuit of bus
Inventor: LIN I-MING
IPC: H04L1/24
Filed: 2001-10-05
Granted: 2003-02-21
Abstract: A kind of bus signal compensation circuit capable of coupling tested sample into the bus and detecting signal peak value on the bus for comparing with the reference voltage to obtain the magnitude of surge is disclosed in the present invention. Based on the magnitude of surge, suitable damping resistance is selected to serially connect with the bus for absorbing the surge energy to elaborate the effect of damping. In the design, the tested sample can be coupled into the bus repeatedly by the system to continuously correct the damping resistance value for reaching the optimum compensation effect. In practical application, the circuit related to the aforementioned operation can be built inside the chip, for example, built in the south bridge circuit to avoid the occupation of valuable external space and save extra cost as well as research/development time.
Patent TW-I235342-B (TW)
Title: Geographic information system demonstrating 3D virtual reality
Inventor: JOU TIAN-YING
IPC: G06T17/00
Filed: 2001-11-02
Granted: 2005-07-01
Abstract: A geographic information system (GIS) structure demonstrating 3D virtual reality integrates a GIS, a virtual reality modeling language (VRML) and a database management system to convert a 2D plane data into a picture file format capable of being browsed in internet using a self-designed computer computation method. The converted picture has the GIS attributes capable of being further integrated with the back-end database system to provide a total 3D virtual reality GIS solution, making 3D virtual reality not only a beautiful demonstration but also a versatile application.
Patent TW-I250278-B (TW)
Title: Audio-frequency ion trap single-particle mass spectrometer
Inventor: JANG HUAN-JENG
IPC: G01N24/00
Filed: 2001-12-31
Granted: 2006-03-01
Abstract: This invention provides a single-particle mass spectrometer for measuring particles having dimensions ranging from 102 to 103 nm, such as biological molecules, nanometer materials, and micro particles in the air. The single-particle mass spectrometer uses an audio-frequency ion trap in cooperation with electro spray ionization to generate charged particles that are confined in the trap. The particles as trapped can be sequentially ejected by scanning the well voltage. Particles passing through laser beam for inspection will generate scattered light signals. Information about the mass-to-charge ratio of the particles, that is, the so-called single-particle mass spectrometer, will be obtained by collecting the variations in the scattered light signals throughout the time. This invention further discloses a method for calibrating such mass spectrometer, by observing the motion track of a single particle within the ion trip to measure its secular frequency thereby obtaining the standard value of the mass-to-charge ratio.
Patent TW-557540-B (TW)
Title: Aggregate dielectric layer to reduce nitride consumption
Inventor: MUKAI KEVIN
IPC: H01L21/316
Filed: 2002-02-06
Granted: 2003-10-11
Abstract: A method including over a substrate, forming an aggregate comprising a barrier layer between a first dielectric layer comprising nitrogen and a second dielectric layer comprising phosphorous, and after forming the aggregate, thermally treating the substrate. An apparatus including a substrate and an aggregate formed over the substrate including a barrier layer between a first dielectric layer comprising nitrogen and a second dielectric layer comprising phosphorous.
Patent TW-I243854-B (TW)
Title: Experimental model and method for evaluation of therapeutic agents against asthenopia
Inventor: KATSUYAMA IWAO
IPC: A61K45/00
Filed: 2002-03-29
Granted: 2005-11-21
Abstract: This invention provides a experimental model and method for evaluating and screening drugs or quasi-drugs against asthenopia, including accommodative asthenopia, by preparing a ciliary muscle sample enucleated from a non-human animal, inducing contraction by one or more of contraction stimulants, measuring the contraction rate of the ciliary muscle, treating it with a test formulation and measuring the contraction rate of the ciliary muscle after such treatment.
Patent TW-540140-B (TW)
Title: Self-aligned process for manufacturing discrete type NROM memory cell
Inventor: LAI ERH-KUN
IPC: H01L27/115
Filed: 2002-04-01
Granted: 2003-07-01
Abstract: A self-aligned process for manufacturing discrete type NROM memory cell is disclosed. First, provide a substrate and form an ONO layer on the substrate. The ONO layer consists of a top oxide layer, nitride layer and bottom oxide layer. Then define the top oxide layer and then define several disposable spacers. Second, use self-alignment process to implant memory cell blocks or buried bit lines. Then define the nitride layer through these disposable spacers. Third, define the bottom oxide layer according to the discrete nitride layer and form several discrete pillars to make a channel between two discrete pillars. Fourth, form several channel oxide on the channel and then form oxide layer on these discrete channel oxide and nitride layer. The tough issue of electron trapped by nitride layer can be resolved and the common position of the implant substance and ONO layer also can be exactly controlled.
Patent TW-550916-B (TW)
Title: Access point with varied wireless network standards
Inventor: HSU CHENG-YI
IPC: H04L12/00
Filed: 2002-04-04
Granted: 2003-09-01
Abstract: An access point with varied wireless network standards for building a wireless network which has a system backbone and a plurality of mobile terminals with a first and a second transmission standards. The access point comprises a central processor, an Ethernet port, a first slot, a second slot, and a dual band antenna. The central processor is used for performing the controlling and operating of the data in the wireless network. The Ethernet port is connected to the system backbone to allow the central processor to receive or transfer data packets. The first slot is used to connect a first wireless transmission module to the central processor so as to provide the first transmission standard. The second slot is used to connect a second wireless transmission module to the central processor so as to provide the second transmission standard. The dual band antenna provides varied operation bands for the first wireless transmission module and the second wireless transmission module so as to connect the mobile terminals with the first and second transmission standards.
Patent TW-590884-B (TW)
Title: Polymeric membranes functionalized with EGTA ligands
Inventor: BRUENING RONALD L
IPC: C01B31/16
Filed: 2002-04-18
Granted: 2004-06-11
Abstract: Compositions and methods for selectively binding specific metal ions, such as Ca2+ and Cd2+, contained in a source solution are disclosed and described. This is accomplished by the use of a composition comprised of an EGTA ligand covalently bonded to a membrane support. The composition formula of the present invention is M-B-L where M is a membrane having a hydrophilic, partially hydrophilic or a composite membrane with a hydrophilic surface, B is a covalent linkage, and L is an EGTA ligand. The separation is accomplished by passing a source solution containing the ions to be separated through a device containing the membrane-ligand composition, causing the selected ions to be complexed to the EGTA ligands and subsequently removing the selected ions from the device by passing an aqueous receiving solution through the device and quantitatively stripping the selected ions from the EGTA ligand.
Patent TW-I222425-B (TW)
Title: A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS
Inventor: IVES THOMAS W
IPC: B81B3/00
Filed: 2002-06-28
Granted: 2004-10-21
Abstract: A microelectromechanical device (MEMD) (100, 200, 500) defined within a substrate (116, 216, 416, 516) of a MEMS includes a mass element (112, 212, 412, 512) defining an area of interest (514). The device also includes a support beam (120, 220, 240, 320, 340, 420, 440, 520, 540) supporting the mass element in spaced-apart relationship from the substrate. The support beam includes a first beam member (124, 224, 244, 324, 344, 424, 444, 524, 544) defined by a first fixed end (123, 223, 441, 521, 541) connected to the substrate, and a first free end (127, 227, 443, 525, 545) connected to the mass element. The support beam further includes a second beam member (126, 226, 246, 326, 426, 446, 526, 546) defined by a second fixed end (125, 225, 523, 543) connected to the substrate, and a second free end (129, 229, 527, 547) connected to the mass element. The beam members are in spaced-apart relationship from one another. A first cross member (128, 228, 248, 328, 348, 428, 44:3, 528, 548) connects the first beam member and the second beam member. Preferably, the support beam includes a plurality of cross members. Two such support beams (520, 540) can be used to support a mass element (512) in a MEMD (500) in a bridge configuration.
Patent TW-567098-B (TW)
Title: Rolling mill and method for operating same
Inventor: YAMAMOTO MIKIO
IPC: B21B31/02
Filed: 2002-07-03
Granted: 2003-12-21
Abstract: Hydraulic cylinders are provided in a housing so as to be opposed to work rolls and backup rolls. Before a front end portion of a rollable material is engaged between the work rolls, the working oil pressure of the hydraulic cylinders is set at a high pressure value to make a pressing force on roll chocks high. After the rollable material is completely engaged between the work rolls, the working oil pressure of the hydraulic cylinders is set at a low pressure value to make the pressing force on the roll chocks low.
Patent TW-I285903-B (TW)
Title: Touch-controlled flat display apparatus with fastening hook
Inventor: TSAI SHANG-KUNG
IPC: G12B9/00
Filed: 2002-07-03
Granted: 2007-08-21
Abstract: The present invention is related to a kind of flat display apparatus having touch-controlled function, at least including a flat display panel, a touch-controlled panel, which is stacked on the surface of the flat display panel and is provided with at least one signal flat-cable or power source flat-cable; and a housing body, which is provided with a cavity room for accommodating the flat display panel and at least one fastening hook for fixing or accommodating the signal flat-cable or power source flat-cable. The fastening hook is located at the surface of the housing body, but not at the interior wall of the cavity room of the housing body.
Patent TW-565491-B (TW)
Title: A method for moving a substrate to a predetermined location and an apparatus used therefor
Inventor: HOSEK MARTIN
IPC: B65G49/07
Filed: 2002-07-15
Granted: 2003-12-11
Abstract: A method for moving a substrate to a predetermined location with a specified orientation with a robotic manipulator, the robotic manipulator having a plurality of joint actuators and an end-effector for holding the substrate, wherein the end-effector is independently rotatable with respect to the remaining robotic manipulator. The method comprises selecting a reference point on the end-effector for determining a position of the end-effector, wherein the reference point is offset from a wrist of the robotic manipulator and generating a motion profile for movement of the end-effector of the robotic arm along a predetermined transfer path. A joint motion profile is determined for each of the joint actutors of the robotic manipulator for implementing the motion profile for movement of the end-effector to the predetermined location with the specified orientation.
Patent TW-554601-B (TW)
Title: Semiconductor laser device and method for fabricating the same
Inventor: ONISHI TOSHIKAZU
IPC: H01S5/16
Filed: 2002-07-25
Granted: 2003-09-21
Abstract: A semiconductor laser device according to the present invention has a semiconductor substrate, an active layer formed on the semiconductor substrate and made of a compound semiconductor containing phosphorus, a guide layer formed on the active layer and made of a compound semiconductor, a dopant diffusion preventing layer formed on the guide layer and made of a semiconductor compound containing arsenic, and a clad layer formed on the dopant diffusion preventing layer and made of a compound semiconductor containing a dopant.
Patent TW-I221135-B (TW)
Title: Assisting apparatus for changing speeds in a bicycle transmission
Inventor: KAWAKAMI TATSUYA
IPC: B62M9/1344
Filed: 2002-08-30
Granted: 2004-09-21
Abstract: One embodiment of an assisting apparatus for using power from a rotating member to assist the operation of a bicycle transmission includes a mounting unit and an input transmission member coupled to the mounting unit, wherein the input transmission member moves to at least a first input position, a second input position and a third input position. An output transmission member is coupled to the mounting unit, wherein the output transmission member moves to at least a first output position, a second output position, and a third output position corresponding to the first input position, the second input position and the third input position of the input transmission member, respectively. A rotating member engaging member moves between a rotating member engaging position and a rotating member disengaging position, and a motion transmitting mechanism is provided for transmitting motion from the rotating member engaging member to the output transmission member. A switching mechanism is provided for moving the rotating member engaging member to the rotating member engaging position when the input transmission member is in one of the first input position, second input position or third input position and the output transmission member is not in the corresponding first output position, second output position, or third output position, and for moving the rotating member engaging member to the rotating member disengaging position when the input transmission member is in one of the first input position, second input position or third input position and the output transmission member is in the corresponding first output position, second output position, or third output position.
Patent TW-571434-B (TW)
Title: Semiconductor device and the manufacturing method of the same
Inventor: YOSHIMURA ATSUSHI
IPC: H01L25/065
Filed: 2002-09-24
Granted: 2004-01-11
Abstract: The present invention provides a semiconductor device and the manufacturing method of the same, which comprises: preparing a first substrate (10), which includes an integrated circuit chip (12), the first connection terminals electrically connected to the terminals of the integrated circuit chip, and the first connection portions (16a, 17a) separated from the first connection terminals; preparing a second substrate, which includes the second connection terminals electrically connected to the first connection terminals, and the second connection portions (23a, 24a) separated from the second connection terminals; the metal material portion (30) for adhesion configured on the first connection portion or the second connection portion; and, using the metal material portion to thermally press the first connection portion and the second connection portion to laminate the first substrate and the second substrate.
Patent TW-I222201-B (TW)
Title: Method of producing multilayered circuit board for semiconductor device
Inventor: NAKAMURA JYUNICHI
IPC: H01L21/48
Filed: 2002-10-30
Granted: 2004-10-11
Abstract: A method of producing a multilayered circuit board for a semiconductor device, which comprises using a combined metal sheet in which two metal sheets are integrated, forming, on both sides of the combined metal sheet, pads for the connection with a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulation layer having openings which expose the pads, forming a wiring layer on the insulation layer, the wiring layer being connected to said pads and having pads to be connected another wiring layer which is formed later, subsequently fabricating a multilayered circuit board body by alternately forming a necessary number of insulation layers and wiring layers, forming, on the outermost insulation layer of the multilayered circuit board body, an insulation layer provided with through-holes exposing pads for external connection terminals located on the outermost insulation layer, then separating the combined metal sheet to obtain intermediates provided on one side of the metal sheet with the multilayered circuit board body, and etching the metal sheet at the region for the mounting of a semiconductor element and removing the metal material at this region, to thereby for a frame surrounding the region for the mounting of a semiconductor device.
Patent TW-I221103-B (TW)
Title: Drill head retaining unit of device for cutting edge portion of drill tip
Inventor: WAKUI HIDEO
IPC: B24B3/24
Filed: 2002-11-06
Granted: 2004-09-21
Abstract: To machine the cutting edge portion of a drill tip with a small diameter and high diameter-length ration with highly and precisely controlled configuration. This invention includes: a hammer portion (9) provided at a lengthy direction of a rotating driven shaft (3), which is closer to a rotating driving shaft (4) as compared to two pairs of adjusting bolts (6b, 6c) as compared to a position adjustment portion (5).
Patent TW-552461-B (TW)
Title: Method and apparatus for cooling control
Inventor: LAI CHIH-MIN
IPC: G05D23/19
Filed: 2002-11-15
Granted: 2003-09-11
Abstract: The present invention provides a method and apparatus for adjusting cooling period according to a current condition of a system. The system includes an electronic device and a cooling device. The system has a predetermined temperature T and a first temperature value T1. In the present invention, a second temperature value T2 is detected. Then, a difference X is obtained by subtracting the second temperature value T2 from the first temperature value T1. The present invention compares the difference X with the predetermined temperature T. When the difference X is greater than the predetermined temperature T, the present invention stops the cooling operation. Otherwise, the present invention calculates a time value K based on the difference X, and proceeds cooling for time K.