baber/WOPTO huggingface dataset:
Patent TW-202222388-A (TW)
Title: Golf club head comprising a ball head, a first column body, a collision-blocking member, a second column body and a seismic isolation member
Inventor: ZENG WEN-ZHENG
IPC: A63B53/04
Filed: 2020-12-02
Abstract: The present invention relates to a golf club head having a main body. The main body is a hollow shell and internally provided with a first column body, a seismic isolation member and a second column body, all of which are connected in sequence. One side of the main body is combined and fixed with the second column body. The striking plate on the other side abuts against the collision-blocking member installed in the first column body. The seismic isolation member is installed between the first column body and the second column body. When the shock wave generated as the user swings and impacts the ball is transmitted to the second column body through the wall surface of the main body, it is effectively blocked by the seismic isolation member to be transmitted to the first column body. The shock wave can be blocked by the seismic isolation member but not absorbed by the collision-blocking member so that the shock wave of the residual impact force generated when the striking plate hits the ball can be fully absorbed by the collision-blocking member. The first column body is a hollow cylinder, one end of which is a large pipe diameter section and the other end of which is a small pipe diameter section. Two different pipe diameter sections are connected with each other. A stepped surface is formed between the different pipe diameter sections, and there is a binding hole arranged inside the small pipe diameter section. The collision-blocking member is a long cylinder, one end of which is necked down to form a binding site, and there is a stop face formed around the outside between the long cylinder and the binding site. The collision-blocking member is placed in the first column body. The binding site and the binding hole of the first column body are combined and fixed with each other.
Patent TW-202222416-A (TW)
Title: Anti-fouling filtering membrance and manufacturing method thereof
Inventor: LI WAN-LING
IPC: C08G73/10
Filed: 2020-12-10
Abstract: The present disclosure provides an anti-fouling filtering membrane which is manufactured by the following reagents including a polyetherimide represented by formula (1) and a polyetheramine crosslinking agent represented by formula (2)., formula (1), in which n is an integer, and 50 ≤ n ≤ 70., formula (2), in which a, b, and c are integers, and (a+c) ≤ b.
Patent TW-202128471-A (TW)
Title: Straddled vehicle
Inventor: HINO HARUYOSHI
IPC: B60W10/26
Filed: 2020-12-11
Abstract: The purpose of the present invention is to provide a straddled vehicle that makes it possible to achieve a compact vehicle body while minimizing decreases in the performance of a permanent magnet-type motor generator provided to one end of a crankshaft. This straddled vehicle is provided with wheels, an engine, a permanent magnet-type motor generator, a first power storage unit, a second power storage unit, an inverter, and a current maintenance circuit. The first power storage unit is a battery having a maximum rated voltage of at least 12V. The second power storage unit is normally connected in series with the first power storage unit and has a maximum charging rate greater than two times the maximum charging rate of the first power storage unit. When starting or assisting the engine, the current maintenance circuit causes current to be output via the inverter from the first power storage unit and the second power storage unit connected in series to the permanent magnet-type motor generator and, during charging, maintains a state in which the second power storage unit is not electrically disconnected and charging current flows to the first power storage unit such that the voltage applied to the second power storage unit does not surpass an upper limit voltage set therein.
Patent TW-202121699-A (TW)
Title: Solar cell and method for manufacturing solar cell
Inventor: KAMISAKO KOICHI
IPC: H01L31/042
Filed: 2019-10-25
Abstract: The present invention relates to a solar cell and a method for manufacturing the solar cell, and aims to improve the efficiency of the solar cell by reducing the series resistance component and increasing the parallel resistance component. 
 
     The composition of the present invention is as follow: a finger electrode containing silver and lead on an insulating film 
is formed; after firing, an insulating fixed bar is formed on the insulating film with the finger electrode part or the marginal part as an opening; by the action of silver and lead contained in the finger electrode during firing, an electrically conductive passage is formed between the region and the finger electrode through the insulating film that is a film below the finger electrode; further, at the same time as firing, by the action of the insulating fixed bar or the glass material contained in the fixed bar, an insulating fixed bar with good adhesion and soldering is formed on the insulating film.
Patent TW-202143293-A (TW)
Title: 用於接合兩個半導體底材的方法
Inventor: GAUDIN GWELTAZ
IPC: H01L21/762
Filed: 2020-12-16
Abstract: 本發明係涉及一種用於透過分子黏附接合兩個半導體底材之方法，該方法包括：使第一底材(1)及第二底材(2)緊密接觸之步驟a)，以形成具有一鍵合界面(4)之一組合件；在高於一預定第一溫度之第一溫度下對該鍵合界面(4)進行反應回火之步驟b)，步驟b)在該接合界面處產生氣泡；在該鍵合界面(4)處至少部分剝離該兩個底材之步驟c)，以去除所述氣泡；及使該第一底材(1)及該第二底材(2)在該鍵合界面(4)處重新緊密接觸之步驟d)，以形成該組合件。
Patent TW-202226238-A (TW)
Inventor: MORI KAORU
IPC: G11C7/04
Filed: 2020-12-25
Abstract: 提供半導體記憶裝置，可根據使用時之環境(例如，電源電壓和溫度等)之變化，適當地控制操作時序。一種半導體記憶裝置，包括偵測半導體記憶裝置之溫度的溫度感測器18、偵測半導體記憶裝置之電源電壓的電壓偵測部(環形振盪器14和計數器15)，以及根據電源接通後藉由溫度感測器18所偵測之溫度，以及電源接通後藉由電壓偵測部所偵測之電源電壓，控制半導體記憶裝置內之操作時序，以滿足特定條件的控制部10。
Patent TW-202127604-A (TW)
Title: Semiconductor device package and method for manufacturing the same
Inventor: CHIANG YI-WEN
IPC: H01L31/0203
Filed: 2020-12-28
Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.
Patent TW-202230087-A (TW)
Inventor: HU CHIH-CHIEN
IPC: G06F3/01
Filed: 2021-01-22
Abstract: 本揭示內容提供一種故事展演系統，其包含處理器及機器人。處理器包含輸入端、資料庫、編輯模組及指令部署模組。輸入端用以接收故事資訊。資料庫訊號連接於輸入端，並用以解析並儲存故事資訊的複數故事要件資訊。編輯模組訊號連接於資料庫，並用以調整故事要件資訊並輸出故事內容資訊。指令部署模組訊號連接於資料庫與編輯模組，並用以依據故事內容資訊產生複數指令，其中複數指令包含音訊資訊、影像資訊及動作指令。機器人訊號連接於處理器，執行指令。藉此，可依據使用者需求彈性調整故事內容資訊並以機器人實體展演故事內容資訊。
Patent TW-202127609-A (TW)
Title: Method for fabricating semiconductor package and semiconductor package using the same
Inventor: LEE SEUNG-WOO
IPC: H01L21/311
Filed: 2016-06-22
Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process. In one embodiment, the method for fabricating a semiconductor package includes forming a frame on a carrier, forming a first pattern layer on the frame, first encapsulating the frame and the first pattern layer using a first encapsulant, forming conductive vias electrically connected to the first pattern layer while passing through the first encapsulant, forming a second pattern layer electrically connected to the conductive vias on the first encapsulant, forming a first solder mask formed on the first encapsulant and exposing a portion of the second pattern layer to the outside, removing the frame by an etching process and etching a portion of the first pattern layer, and attaching a semiconductor die to the first pattern layer.
Patent TW-202146352-A (TW)
Title: Etching of glass surfaces to reduce electrostatic charging during processing
Inventor: FU HSUEH-HUNG
IPC: C03C15/00
Filed: 2021-02-18
Abstract: A method of treating a glass substrate including heating the glass substrate, directing a first flow of air through a first plurality of apertures disposed in an aperture plate to a first side of the heated glass substrate, and exposing a second side of the heated glass substrate to a treatment fluid including HF while directing the first flow of air, the treatment fluid etching the second side of the glass substrate to form a treated glass substrate.
Patent TW-202139652-A (TW)
Title: Computer system and network slice management method
Inventor: KITA SHINYA
IPC: H04L12/26
Filed: 2021-02-25
Abstract: A network operating system (NOS 12) acquires, for a plurality of network functions each realizing a network slice constructed on a mobile radio communication network, information about the operation of each network function, which has been measured on one or more apparatuses which provide at least a part of the plurality of network functions. The NOS 12 derives evaluation index values of the plurality of network functions on the basis of the information about the operations of the plurality of network functions, and derives evaluation index values of the network slices on the basis of the evaluation index values of the plurality of network functions.
Patent TW-202237035-A (TW)
Title: Electroencephalogram measurement structure capable of solving the problems of complicated wiring and inconvenience in wearing at the same time
Inventor: HUANG CHUN-MING
IPC: A61B5/31
Filed: 2021-03-23
Abstract: The present invention provides an electroencephalogram measurement structure, which is formed by an ear-hanging structure and a second circuit board. The ear-hanging structure includes a main body, and an ear-hanging member disposed at an extension of the main body that can be worn on the ear via the ear-hanging member. In addition, a first reference electrode and a second reference electrode are disposed on the main body and coupled to a first circuit board. The first circuit board is coupled to an electrical socket, and the second circuit board is coupled to the electrical socket via an electrical plug. As a result, the electroencephalogram measurement can be performed simply by wearing the ear-hanging member on the ear of the person under test. Therefore, the problems of complicated wiring and inconvenience in wearing can be solved at the same time.
Patent TW-202138819-A (TW)
Title: Probe and electrical connection device
Inventor: FUKUSHI TERUO
IPC: H01L21/66
Filed: 2021-03-30
Abstract: An objective of the present invention is to provide a probe capable of reducing degradation of measurement quality and an electrical connection device. 
 
     A probe of the present invention includes: a rod-shaped central conductor; an intermediate insulating film surrounding a side surface of the central conductor; and an outer conductive film covering a surface of the intermediate insulating film. The center guide is exposed at a front end of the probe, which is to be in contact with an object to be inspected.
Patent TW-202241238-A (TW)
Inventor: LAI CHIH-FENG
IPC: H05K7/14
Filed: 2021-03-31
Abstract: The present invention provides a wearable device for a mobile phone, which includes an upper cover, a mobile phone case, a base and a tightening device. The upper cover covers the upper part of the mobile phone case and has a detachable connection structure with the base for further fixing the mobile phone case; The mobile phone case is located above the base and is connected to the base by magnetic attraction for storing the mobile phone, including a storage slot, a mobile phone storage assembly, and a first magnet array. A mobile phone storage assembly is arranged in the storage slot, and a first magnet array is arranged at the lower part of the storage slot; The base is used for receiving the mobile phone case, a groove is set above the base for accommodating the mobile phone case, and an accommodating cavity is set inside the base for placing electronic equipment for the mobile phone. A connection structure is set below the base for connecting with the tightening device； The tightening device is used to equip the device to a certain part of the body. This device not only realizes the convenience and functional diversity in mobile phone applications, but also realizes the application flexibility and versatility of the device.
Patent TW-202230187-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: XIAN HUAI-XIN
IPC: G11C11/00
Filed: 2021-04-09
Abstract: A device includes a master latch, a slave latch and a retention latch coupled to each other. The retention latch includes first and second active areas, first and second gate structures. The first and second active areas extend in a first direction. The first gate structure extends in a second direction, the first gate structure including first and second portions that are separated from each other. The first portion is arranged over the first active area, and the second portion is arranged over the second active area. The second gate structure extends in the second direction, and is arranged over the first active area. The second gate structure is separated from the second active area and the first gate structure in a layout view. An end potion of the second active area is between the first gate structure and the second gate structure.
Patent TW-202145319-A (TW)
Title: Semiconductor device and method for manufacturing the same
Inventor: LIN SHIH-YAO
IPC: H01L21/28
Filed: 2021-04-28
Abstract: The disclosure is directed towards semiconductor devices and methods of manufacturing the semiconductor devices. The methods include forming fins in a device region and forming other fins in a multilayer stack of semiconductor materials in a multi-channel device region. A topmost nanostructure may be exposed in the multi-channel device region by removing a sacrificial layer from the top of the multilayer stack. Once removed, a stack of nanostructures are formed from the multilayer stack. A native oxide layer is formed to a first thickness over the topmost nanostructure and to a second thickness over the remaining nanostructures of the stack, the first thickness being greater than the second thickness. A gate dielectric is formed over the fins in the device region. A gate electrode is formed over the gate dielectric in the device region and surrounding the native oxide layer in the multi-channel device region.
Patent TW-202207314-A (TW)
Title: Semiconductor devices having multi-channel active regions
Inventor: KIM MUN-HYEON
IPC: H01L21/336
Filed: 2021-05-11
Abstract: A multi-channel semiconductor-on-insulator (SOI) transistor includes a substrate having an electrically insulating layer thereon and a semiconductor active layer on the electrically insulating layer. A vertical stack of spaced-apart insulated gate electrodes, which are buried within the semiconductor active layer, is also provided. This vertical stack includes a first insulated gate electrode extending adjacent the electrically insulating layer and an (N-1)th insulated gate electrode that is spaced from a surface of the semiconductor active layer, where N is a positive integer greater than two. An Nth insulated gate electrode is provided on the surface of the semiconductor active layer. A pair of source/drain regions is provided within the semiconductor active layer. These source/drain regions extend adjacent opposing sides of the vertical stack of spaced-apart insulated gate electrodes. In some of these aspects, the semiconductor active layer extends between the pair of source/drain regions and the electrically insulating layer, whereas the first insulated gate electrode contacts the electrically insulating layer.
Patent TW-202247550-A (TW)
Title: Smart socket and system thereof
Inventor: HSU TE-FU
IPC: H01R13/70
Filed: 2021-05-19
Abstract: A smart socket includes at least one socket structure, a processing module, at least one safety module, a recording module, a first wireless communication module and a second wireless communication module. The recording module is used to record power consumption information of each socket structure. The at least one safety module is used to perform overheating or/and overload protection. When the processing module determines that there is a host or/and another smart socket in a first range, the first wireless communication module automatically connects with the host or/and another smart socket through the first wireless communication method. When the processing module determines that there is an external communication device in a second range, the second wireless communication module automatically connects with the external communication device through the second wireless communication method.
Patent TW-202247858-A (TW)
Title: Heater being provided with a body in which a gas storage unit, a control unit and a heating unit are disposed
Inventor: Xu yu-wei
IPC: A61L9/02
Filed: 2021-06-01
Abstract: Provided is a heater having a body in which a gas storage unit, a control unit and a heating unit are disposed. A cover body with hollow holes is disposed above the body. The control unit is provided with a switch protruding out of the body and an adjusting knob. The switch is operated to deliver a gas in the gas storage unit to a nozzle of the heating unit by virtue of a control valve, then, an electronic igniter is operated to ignite the gas to generate a flame to heat a heating plate of the heating unit. A gas outlet end of the nozzle is provided with a catalyst, and a metal net is disposed around the nozzle, so that heat can be uniformly dispersed. An incense can be on the heating plate, and generated heat and smell can be dispersed through the hollow holes of the cover body.
Patent TW-202212088-A (TW)
Title: Method of manufacturing polymer molded product including pretreatment by heating
Inventor: MAEHARA AKIRA
IPC: B29B9/16
Filed: 2021-06-02
Abstract: The present invention addresses the problem of providing a method of manufacturing a polymer molded product, the method enabling the temperature range available for partial melting to be broadened. The present invention provides a method for manufacturing a polymer molded product, the method comprising: heat-treating a crystalline polyhydroxyalkanoate at or above the glass transition temperature; and melt-casting the polyhydroxyalkanoate which was obtained by said heat-treating and which contains lamellar crystals having different lamella thicknesses, the melt-casting being conducted at a temperature range in which a portion of the lamellar crystals are melted and fluidized whereas the remainder of the lamellar crystals remain without being melted.
Patent TW-202248949-A (TW)
Inventor: WEI YI-PIN
IPC: G06Q50/28
Filed: 2021-06-08
Abstract: 本發明提供一種物流載具補貨方法，其包含小型物流載具送貨步驟、小型物流載具補貨確認步驟、補貨規劃步驟以及解鎖補貨步驟。於小型物流載具送貨步驟中，使小型物流載具進行送貨；於小型物流載具補貨確認步驟中，取得小型物流載具的可用容積，若可用容積大於或等於補貨閾值，送出補貨需求訊號。於補貨規劃步驟中，當中大型物流載具或遠端控制中心收到補貨需求訊號，進行補貨規劃，且中大型物流載具移至補貨地點。於解鎖補貨步驟中，對小型物流載具進行解鎖，允許中大型物流載具提供複數新貨物至小型物流載具。藉此提升配貨效率。
Patent TW-202232692-A (TW)
Inventor: JUNG GYO-YOUNG
IPC: H01L23/64
Filed: 2021-06-29
Abstract: 可提供一種半導體封裝，所述半導體封裝包括：核心基板；半導體晶片，位於核心基板中且具有晶片接墊；重佈線配線層，覆蓋核心基板的下表面且包括電性連接至晶片接墊的重佈線配線及一對電容器接墊，所述晶片接墊及所述一對電容器接墊自重佈線配線層的外表面暴露出；導電膏，分別位於電容器接墊上；以及電容器，藉由導電膏分別位於電容器接墊上且具有位於電容器接墊上的第一外電極及第二外電極。電容器接墊中的每一者包括：接墊圖案，自重佈線配線層的外表面暴露出；以及至少一個通孔圖案，位於接墊圖案的下部分處且電性連接至重佈線配線中的至少一者。通孔圖案相對於接墊圖案的中心線偏心一距離。
Patent TW-202302600-A (TW)
Title: Macrocycles as cftr modulators
Inventor: BOLLI MARTIN
IPC: C07D498/14
Filed: 2021-07-12
Abstract: The present invention relates to macrocyclic compounds of Formula (I) Formula (I) wherein Ar1, Ar2, R1, R2, R3, R4, and X are as described in the description, their preparation, to pharmaceutically acceptable salts thereof, and to their use as pharmaceuticals, to pharmaceutical compositions containing one or more compounds of Formula (I), and especially to their use as modulators of CFTR.
Patent TW-202226470-A (TW)
Title: Semiconductor devices and methods of manufacturing semiconductor devices
Inventor: KIM TAE-KI
IPC: H01L23/31
Filed: 2021-07-28
Abstract: In one example, an electronic device includes a substrate having a conductive structure. The conductive structure includes a substrate inward terminal at a first side of the substrate and a substrate outward terminal at a second side of the substrate. The substrate includes a dielectric structure with a first opening is at the second side. An electronic component is at the first side of the substrate and is electrically coupled to the substrate inward terminal, and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises one of a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the first opening a pad dielectric via interposed between the pad conductive vias in the first opening and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via. The multi-stage terminal includes a pad base within the first opening having a pad base top side recessed below an upper surface the first dielectric and a pad head coupled to the pad base within the first opening, the pad head having a pad head top side with a micro dimple. Other examples and related methods are also disclosed herein.
Patent TW-202216898-A (TW)
Inventor: TAI TETSURO
IPC: C08L67/02
Filed: 2021-07-30
Abstract: 一種熱塑性樹脂發泡體，係含有熱塑性樹脂，其中，前述熱塑性樹脂含有聚酯系樹脂及聚醯亞胺系樹脂，並且玻璃轉移溫度為單一。前述熱塑性樹脂之玻璃轉移溫度較佳為80至130℃，由在加熱速度10℃/分鐘的熱通量示差掃描熱量測定所求得之吸熱量與發熱量的差之絕對值較佳為3至35J/g。
Patent TW-202310703-A (TW)
Inventor: WANG TING-YI
IPC: H05K7/14
Filed: 2021-08-18
Abstract: 一種擋板及包含其之擴充卡與電子裝置，其中擴充卡適於電子裝置之一機箱，且包括一電路板以及前述之擋板，而擋板包括一擋板部與一組裝部，擋板部固定於電路板，組裝部可拆卸地卡合於擋板部且適於與機箱結合，以使擴充卡透過組裝部組裝於電子裝置。
Patent TW-202201965-A (TW)
Inventor: YE YAN
IPC: H04N19/60
Filed: 2013-01-10
Abstract: Improved method and apparatus for signaling of reference pictures used for temporal prediction. The signaling schemes and construction process for different reference picture lists in HEVC Working Draft 5 (WD5) are improved.
Patent TW-202216254-A (TW)
Inventor: MILLEMAN TRAVIS D
IPC: A63B53/04
Filed: 2021-09-10
Abstract: Present invention is directed to a fairway-type golf club head combing (or comprising) features selected from the group consisting of lightweight crown inserts, main body of weight reducing features, a high density sole insert, a movable rear weight assembly, or a combination thereof to enable a low center of gravity of the club head thereby increasing forgiveness, reducing spin, and positioning the center of gravity at or near the force line impact point axis of the fairway type golf club head.
Patent TW-202212517-A (TW)
Title: Acrylic-based adhesive composition with ethylene-based polymer
Inventor: BINDER JOSEPH B
IPC: C09J133/08
Filed: 2021-09-11
Abstract: The present disclosure is directed to a water-based pressure-sensitive adhesive composition. In an embodiment, the water-based pressure-sensitive adhesive composition includes (A) an acrylic dispersion composed of particles of (i) an acrylic-based polymer with a glass transition temperature (Tg) less than -20°C, and (ii) a surfactant. The water-based pressure-sensitive adhesive composition also includes (B) an ethylene-based polymer dispersion comprising an ethylene and vinyl acetate copolymer and an ethylene acid copolymer. Further disclosed are articles with the water-based pressure-sensitive adhesive composition.
Patent TW-202217483-A (TW)
Title: 用以偵測和校正實時產品基板的強化處理和硬體架構
Inventor: SANTHANAM KARTIK
IPC: G05B13/00
Filed: 2021-10-15
Abstract: 本文所揭示的實施例包括一種用於半導體處理的處理工具。在一實施例中，處理工具包括腔室及與該腔室整合的複數個見證感測器。在一實施例中，處理工具進一步包括漂移偵測模組。在一實施例中，將來自複數個見證感測器的資料提供至漂移偵測模組作為輸入資料。在一實施例中，處理工具進一步包括儀表板，該儀表板用於顯示來自漂移偵測模組的輸出資料。