Patent SG-11201909897X-A (SG)
Title: Wafer scale bonded active photonics interposer
Inventor: COOLBAUGH DOUGLAS
IPC: H01L21/762
Filed: 2018-02-09
Abstract: 334 334 326 I 300 126 118 508 502 504 510 512 10 240 224 210 r„,..,„Antawarmx_ OkA , ADZ 11111.`1\t1=1Val=11=111-11=41===11 206 320 306 324 / —II r 120 /122/ 118 \116 ,,, 510 508 \116 \ 512 FIG. 1 100 122 120 112 O O O 00 O O (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 01 November 2018 (01.11.2018) WIPO I PCT ill~~~~~~~~ 011101010VIIIOH olo Holoilmon ono iflo oimIE (10) International Publication Number WO 2018/200059 Al (51) International Patent Classification: GO2B 6/12 (2006.01) GO2B 6/134 (2006.01) HO1L 21/18 (2006.01) GO2B 6/136 (2006.01) GO2B 6/42 (2006.01) HOlL 23/498 (2006.01) GO2B 6/122 (2006.01) HOlL 21/762 (2006.01) GO2B 6/13 (2006.01) HOlL 27/12 (2006.01) GO2B 6/132 (2006.01) (21) International Application Number: PCT/US2018/017558 (22) International Filing Date: 09 February 2018 (09.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/490,665 27 April 2017 (27.04.2017) US 15/891,847 08 February 2018 (08.02.2018) US (71) Applicant: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK [US/US]; 35 State Street, Albany, New York 12207 (US). (72) Inventors: COOLBAUGH, Douglas; 255 Fuller Road, Al- bany, New York 12203 (US). LA TULIPE, JR., Douglas; 255 Fuller Road, Albany, New York 12203 (US). LEAKE, Gerald; 255 Fuller Road, Albany, New York 12203 (US). (74) Agent: BLASIAK, George; 5 Columbia Circle, Albany, New York 12203 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (54) Title: WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER (57) : There is set forth herein a method including building an interposer base structure on a first wafer having a first substrate, wherein the building an interposer base structure includes fabricating a plurality of through vias that extend through the first substrate and fabricating within an interposer base dielectric stack formed on the first substrate one or more metallization layer; building a photonics structure on a second wafer having a second substrate, wherein the building a photonics structure includes fabricating within a photonics device dielectric stack formed on the second substrate one or more photonics device; and bonding the photonics structure to the interposer base structure to define an interposer having the interposer base structure and one or more photonics device fabricated within the photonics device dielectric stack. [Continued on next page] WO 2018/200059 Al MIDEDIMOMOIDEIRDERI0010101111MINHIMEMOIMIE OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))