baber/WOPTO huggingface dataset:
Patent JP-H04190644-A (JP)
Title: Slave station of remote supervisory controller for distribution system
Inventor: KAWAI MICHIO
IPC: H02J13/00
Filed: 1990-11-22
Abstract: PURPOSE:To prevent the entry of surges from lines and besides to cope with the power failure of a distribution line, by dividing a slave station into a heavy current section not electrically insulatable from a high-voltage distribution line and a light current section composed of an auxiliary power source and electronic circuits, and these sections with a transmission line using optical fibers. CONSTITUTION:A slave station is divided into a heavy current section Ko(S) and a light current section Ko(C), the heavy current section Ko(S) is put at a position near a distribution line DL, and the light current section Ko(C) is put on a transmission line side and at a position where working at a high place is unnecessary. And they are joined with optical fibers OF through the medium of electricity/light signal converting sections 112 and 113. As a result of this, the light current section Ko(C) of the slave station is completely insulated from electrical surges, instant interruption, higher harmonics, electric waves, etc., which might enter from the distribution line or a transmission line LK(O). Besides, at the time of power failure of the distribution line DL, the function of the heavy current section Ko(S) of the slave station stops, but the light current section Ko(C) of the slave station continues to operate by the auxiliary power source of the power source section 111.
Patent JP-H05184249-A (JP)
Title: Method for producing soil-free cultivation medium
Inventor: GURINTO SHIYU
IPC: A01G1/00
Filed: 1991-11-07
Abstract: PURPOSE: To produce a soil-free cultivating medium fit to cultivate crops. CONSTITUTION: Polyacrylonitrile fibers or polyester fibers are scoured with 2% scouring agent at 70 deg.C for 20-30min and successively subjected to oxidation bleaching with a mixture of 2g/1 sodium chlorite soln. with 0.8g/1 oxalic acid soln. at 70-98 deg.C for 30min and reduction bleaching with a hydrosulfite soln. at 40-80 deg.C for about 30min. They are then washed, dehydrated and dried to obtain the objective swollen dry granular cotton balls.
Patent JP-H08177648-A (JP)
Title: Flow regulating valve for exhaust gas recirculating device
Inventor: NARA HIROSHI
IPC: F02M25/07
Filed: 1994-12-22
Abstract: PURPOSE: To improve an accelerator response by operating a valve body so as to quickly close a circulating hole, in the case of increasing an output of an engine. CONSTITUTION: A flow path switching valve 44 has a function that a supply/ discharge hole 25, communicating with a pressure chamber 11, is made to communicate with either of a charge air port 53 or a discharge path 40. When a pressure in a part of the charge air port 53 is decreased, a switching valve body 51 of constituting the flow path switching valve 44 is lowered down, to feed compressed air in the pressure chamber 11 into a spring chamber 39. Consequently, a pressure difference between upper/lower surfaces of an opening piston 13 is quickly eliminated, and this opening piston 13 is quickly lowered down by elastic tension of a closing spring 31. A valve body 9, provided in an upper end part of a rod 10, closes an upper end opening of a circulating hole 8.
Patent JP-H05315126-A (JP)
Title: Mold coil and manufacture thereof
Inventor: MATSUI SATOYOSHI
IPC: H01F41/12
Filed: 1991-09-26
Abstract: PURPOSE:To integrally form and enhance mechanical strength by simultaneously reacting and hardening an internal liquid layer which is filled with a synthetic resin liquid of a low viscosity and is in pregnated therewith up to the gap within a coil of a mold resin layer and an external liquid layer which is surrounded by a synthetic resin mixing a filling agent thereof. CONSTITUTION:A coil 1 is set within a mold die 6 and is then dehumidified previously within a vacuum heating and drying furnace. Thereafter, an epoxy resin liquid 3' of a low viscosity is gradually supplied from a port 6b provided at the bottom surface within the mold die 6. Next, when the epoxy resin liquid 4' including a filling agent is supplied from an upper port 6a, the epoxy resin liquid 3' having a low viscosity is situated at the internal side around the coil 1 and the epoxy resin liquid 4' mixing the filling agent is situated at the external side thereof. Thereafter, the entire part is heated for simultaneous reaction and hardening. Thereby, molding work can be realized easily and excellent thermal and mechanical strength of the mold coil can be realized.
Patent JP-H03180734-A (JP)
Title: Airtightness inspection device
Inventor: AOYAMA KATSUMITSU
IPC: G01M3/06
Filed: 1989-12-08
Abstract: PURPOSE:To evade misinspection originating from confusion with air bubbles to be an object out of detection by turning over a work and removing air bubbles on the surface of the surface completely, and then starting inspection. CONSTITUTION:While the work W is turned over, water is pumped up by a vacuum pump 13 and then the air bubbles sticking on the work surface are removed, so that a suction and detection transparent pipe 10 is filled with the water. At this time, an ultrasonic wave vibrator 7 is operated simultaneously to remove the air bubbles early. Further, the work is inverted to remove air bubbles in a recessed part completely even if recessed part, etc., is present on the reverse surface of the work W. Then when the transparent pipe 10 contains no air bubble and is filled with only the water, the pump 13 is stopped and the inspection is carried out while ultrasonic wave vibration is applied, that is, when the fault part is present thereon, the air bubbles are produced and raised in the liquid to be stagnated in the projecting part 10a of the transparent pipe 10. At this time, the separation of air bubbles formed at a fault part is improved through the operation of a vibrator 7.
Patent JP-H01159821-A (JP)
Title: Magnetic head device
Inventor: KOGA KAZUHIKO
IPC: G11B5/53
Filed: 1987-12-17
Abstract: PURPOSE:To suppress a difference in frequency characteristics and to improve the pair characteristic of both heads by causing the gap lengths of a double- azimuth magnetic head and a single-azimuth magnetic head to be different. CONSTITUTION:A film thickness (gap length) g1 of a gap spacer 21 between first and second cores 13 and 14 of a second chip 3 of a double-azimuth magnetic head 1 is 0.36mum, and for a single-azimuth magnetic head 5, a film thickness g2 of a gap spacer 23 between third and fourth cores 17 and 18 of a third head chip 6 is 0.4mum. In such a way, the gap length of the double-azimuth magnetic head 1, whose frequency characteristic is bad with the gap length equal to the single-azimuth magnetic head 5, is composed to be small. Thus, for both magnetic heads 1 and 5, head characteristics such as an electric characteristic and a recording and reproducing characteristic are made equal, the pair characteristic can be improved, and flickers such as a flickering are hardly generated.
Patent JP-H06167617-A (JP)
Title: Light guide plate device
Inventor: ISODA HARUYA
IPC: G02B6/00
Filed: 1992-11-30
Abstract: PURPOSE:To easily manufacture a light guide plate device at low cost, to eliminate the possibility that foreign matter or dust enter the device, and to prevent light emission abnormality and the curvature and deflection of a light guide plate. CONSTITUTION:This device is constituted so that the light guide plate 11 which has a light emitting surface 12 as its one surface and a reflecting surface 13 as the other surface is provided, and irregular reflection parts 14 are dotted on the reflecting surface 13 of the light guide plate 11 and light which is made incident on the light guide plate 11 is reflected on the reflecting surface 13 and also irregularly reflected on the irregular reflection parts 14 to emit the light on the side of the light emitting surface 12. In the device, a film 15 is formed so as to cover the irregular reflection parts 14 by coating the reflecting surface 13 of the light guide plate 11 with ink whose refractive index is close to 1, and a coating film 16 for reflecting the light is formed on the film 15 on the side of the reflecting surface 13; and a film 19 is formed on the light emitting surface 12 of the light guide plate 11 by applying ink whose refractive index is nearly 1 and a diffusion film 20 is formed on the film 19 on the side of the light emitting surface 12 by applying ink for light diffusion.
Patent JP-H08236465-A (JP)
Title: Manufacture of compound semiconductor device
Inventor: EGAWA MITSURU
IPC: H01S5/30
Filed: 1995-12-08
Abstract: PURPOSE: To obtain a compound semiconductor layer having desired thickness or composition distribution by controlling the selective growth ratio of the semiconductor layer when the semiconductor layer is selectively grown with regard to a method for manufacturing the compound semiconductor device which includes a process for selectively growing the semiconductor layer in a prescribed area. CONSTITUTION: A method for manufacturing compound semiconductor device includes a process in which a first compound semiconductor layer is grown in an area not covered with selective growth masks M11 -M24 by setting the ratio of the average free stroke of a raw material species(s) to the thickness of a stagnating layer 20 of the raw material species (s) which occurs near the surface of a substrate 1 to a first value and another process in which a second compound semiconductor layer is selectively grown on the first compound semiconductor layer by changing the ratio to a second value.
Patent JP-H06168888-A (JP)
Title: Fabrication system for semiconductor device
Inventor: MAEDA KAZUO
IPC: H01L21/205
Filed: 1992-11-30
Abstract: PURPOSE:To realize a fabrication system for semiconductor device in which maintenance and inspection works can be carried out easily and efficiently by making a wafer stage mountable/demountable on/from a wafer holder. CONSTITUTION:Six susceptors (wafer stages) 22a to 22f are set demountably to a disc-like wafer holder 21. A gas diffuser 30 is provided with five gas dischargers 31a to 31e along a circle having a rotary shaft 27 as a center at an interval corresponding to the susceptors 22a to 22f. Unnecessary reaction gas discharged from the gas dischargers 31a to 31e is discharged from the peripheries of respective gas dischargers 31a to 31e. Furthermore, the wafer holder 21 is secured to the rotary shaft 27 such that a moving plane, sandwiched by the gas dischargers 31a to 31e and heaters 28a to 28f, rotates about the rotary shaft 27 under a state where the wafer holder 21 holds wafers 24a to 24f while being separated from the gas diffuser 30 and the heaters 28a to 28f.
Patent JP-H10161721-A (JP)
Title: Plastic model inverting system and its method
Inventor: SHIROTA KOJI
IPC: G05B19/4093
Filed: 1996-11-29
Abstract: PROBLEM TO BE SOLVED: To reduce a physical burden to an operator by releasing him from the work of moving an arm shaft in an unnatural posture even in transferring work concerning a representative point at the upper/lower parts of a half sur face model. SOLUTION: A three-dimensional measuring device 10 measures the positions of the plural representative positions on the half face model. A control part 50 obtains a corresponding point symetrical with a representative point and calculates a moving locus at the time of moving a bailing head unit 25 from a corresponding point to another corresponding point. When an operator B pressed the button of an operation remote controller 42, the part 50 moves the balling head unit according to a moving locus. The operator B opens a drill hole becoming a working mark at a work 5 by using the unit 25. This operation is repeated to successively add working marks to the work 5.
Patent JP-H01161593-A (JP)
Title: Ic card utilizing system
Inventor: FUJINAGA SHUJI
IPC: G07F7/08
Filed: 1987-12-18
Abstract: PURPOSE:To eliminate troublesome works for reissuing an IC card by providing a means which sets a waiting state for the re-input of an identification data against an unusable IC card and another means which makes an unusable card usable. CONSTITUTION:An IC card 20 which becomes unusable because wrong inputs are made about the card in excess of a limit is supplied to a card reader 50. A control section 57, to which the data read by the reader 50 are sent, requests the re-input of the identification data and is set to a identification data input waiting state. When the user of the card inputs the identification code by operating a key input section 43 thereafter, the control section 57 compares the identification data stored on the card 20 with the special data inputted by the user. When they coincide with each other, the section 57 clears the set of a card data input NG code and the card 20 is restored to a usable state from the unusable state.
Patent JP-H03181954-A (JP)
Title: Both-side image forming device
Inventor: ITSUKIDA MASAMI
IPC: G03G15/00
Filed: 1989-12-12
Abstract: PURPOSE:To excellently form images on both sides even in the case of a thick recording medium or a hard recording medium without inverting the recording medium by 180 deg. by providing a 1st transfer means for transferring the image to the 1st side of the recording medium and a 2nd transfer means for transferring the image to the 2nd side of the recording medium. CONSTITUTION:The both-side copying machine is provided with two transfer parts, and a transfer device 23 functioning as the 1st transfer part and a 1st destaticizing charger 26 functioning as the 2nd transfer part are arranged so that they form the angle of about 180 deg. with center at a drum 22. Therefore, both-side copying is performed by making a copying paper pass through a nearly linear conveyance path twice. In such a case, an acutely bent recording medium conveying system used only for the 2nd side copying is not necessitated. Thus, it is unnecessary to invert the recording medium by 180 deg. and the image is excellently formed on both sides without causing paper jamming even in the case of the thick recording medium or the hard recording medium.
Patent JP-H10138327-A (JP)
Title: Table driving apparatus of molding machine
Inventor: KONISHI HIROMICHI
IPC: F16H21/26
Filed: 1996-11-14
Abstract: PROBLEM TO BE SOLVED: To provide the table driving apparatus of a molding machine constituted so that the lower and upper dead points of upper and lower tables are altered to be capable of corresponding to the thickness alteration of a mold to easily take out the mold. SOLUTION: This table driving apparatus is provided to a molding machine moving one of or both of tables 2 up and down by toggle links 16 and equipped with the following shaft 17 fixing the toggle links 16 on a main body side, the expansion and contraction drive source 11 shaking the following shaft 17 and the shaking conversion means provided between the expansion and contraction drive source 11 and the following shaft 17 to shake the following shaft 17 and a dead point adjusting means 20 adjusting the dead point of the table 2. The dead point adjusting mechanism 20 of the table 2 supports the following shaft 17 at an offset position and consists of the worm wheel 24 supported on a main body frame l in a freely rotatable manner and the worm 23 connected to a motor 21 to be engaged with worm wheels 24, 44.
Patent JP-H04191931-A (JP)
Title: Electronic computer
Inventor: MURATANI HIROBUMI
IPC: G06F9/38
Filed: 1990-11-27
Abstract: PURPOSE:To efficiently execute an instruction sequence by delay-controlling a delay branching instruction according to the value of the delay slot length of the delay branching instruction. CONSTITUTION:A delay branching instruction to have variable delay slot length is titled as a brd (N) in the case of an unconditional branching instruction when the delay slot length is defined as (N), instruction sequences <ope1>, <ope2>,..., <opeN> continued after the delay branching instruction brd (N) of which delay slot length is the (N) are executed in order within a delay slot period set by the delay branching instruction brd (N) to the certain instruction sequence, for instance, and after that, an <ope> which is the instruction of the branching destination of the delay branching instruction brd (N) is executed at time of passing through the delay slot (N). Thus, the optimization of the instruction sequences can be attained simply and efficiently and instruction executing time is shortened without causing the waste of a clock.
Patent JP-H10163621-A (JP)
Title: Reflow soldering apparatus
Inventor: SAWABE HIROSHI
IPC: H05K3/34
Filed: 1996-12-02
Abstract: PROBLEM TO BE SOLVED: To uniformly heat sections of a printed wiring board to rise its temp., by switching the front and back surfaces of a reflective board to adjust the intensity characteristic depending on the frequency of infrared rays irradiated on the board. SOLUTION: The apparatus comprises a heater 21 for dominantly radiating infrared rays, a reflective board 22 for reflecting the dominantly radiated infrared rays on a printed wiring board 1 having a reflective plane 23 at one surface, and a far infrared radiant ceramic layer 25 radiating far infrared rays at the other surface when this surface is heated. The reflective board 22 is reversed to irradiate near infrared rays dominantly radiated from the heater 21, or reflective plane 23, or far infrared rays from the ceramic layer 25 on the wiring board 1.
Patent JP-H02165720-A (JP)
Title: Semiconductor integrated circuit
Inventor: KUROKI JUNJI
IPC: H03K3/037
Filed: 1988-12-19
Abstract: PURPOSE:To hold a data input signal successively by outputting a hold permission signal from a third flip-flop circuit by inputting first and second hold request signals to a first flip-flop circuit, and holding the data input signal at a holding circuit in the case of establishing logic between the first hold request signal and the hold permission signal. CONSTITUTION:When the second hold request signal Sc is inverted from (1) to (0), the output of the third flip-flop 12 is inverted to (1), and the logic between the first hold request signal S and the output of the third flip-flop circuit 12 is established when the first hold request signal SH goes to (1), then, the request signal goes to (1), and the holding circuit 1 holds data SD. In such a manner, it is possible to obtain a semiconductor integrated circuit possible to hold the level of the data input signal SD set at a state (1) at appropriate time outputted from the hold request signal SH even when the hold request signal SH goes to the state (1) for continuous plural number of times.
Patent JP-H01161347-A (JP)
Title: Image brightening device
Inventor: NAGATA SHOICHI
IPC: G03G21/00
Filed: 1987-12-18
Abstract: PURPOSE:To prevent the title device from generating offset and to obtain an image with high glossiness by providing a separation guide member forming a prescribed angle from a paper carrying face on the position of a peeling part roll. CONSTITUTION:Sheet on which a toner image or a colored image is formed is carried on a paper carrying part along a brightening belt 1. The temperature of the belt 1 is high at a heating part 2 and the sheet on which the toner image of the colored image is formed is heated by the heating part 2. The sheet is carried while being stuck to the belt 1 and the temperature of the belt 1 is dropped in accordance with the temperature drop of the belt 1. Then, the sheet is peeled from the belt 1 at the position of a peeling part roll 3. Since the separation guide member 6 forming a prescribed angle theta from the sheet carrying face is arranged, the sheet can be easily peeled along the member 6. Thus, the generation of offset can be prevented and an image with high glossiness can be obtained.
Patent JP-H11139103-A (JP)
Title: Roller
Inventor: YOKOYAMA TAKASHI
IPC: B60B25/02
Filed: 1997-11-07
Abstract: PROBLEM TO BE SOLVED: To provide a roller suitable for a baveling wheel of a mobile machine accompanied by severe abrasion deterioration or the like, capable of easily replacing only a deteriorated tire member of an outer wheel for shock absorbing even when the tire member is deteriorated with the lapse of time, and capable of maintaining quality of initial specification. SOLUTION: An anular tire fitting groove C for fitting a tire member 40 in an assembled condition is fomted by flange parts 12, 22 provided in the outer cicunferential parts of hub members 10, 20 in a pair of roller core bars of same shape dividable into two parts. Flange holes 13, 23 penetrated to a plate thickness direction are provided in the flange parts 12 22, and tire hole 41 penetrated to a tire width direction is also provided in the tire member 40 corresponding to the flange holes. A hollow pipe heat-radiating pin 50 is inserted and fixed to three holes of the flange holes 13, 23 and the tire hole 41 when the tire member 40 is fitted in to be attached to the tire fitting groove C, to radiate internal heat generated during rotation in the tire member 40 through the radiating pin 50.
Patent JP-H08181412-A (JP)
Title: Manufacture of metallic foil for printed wiring board
Inventor: URASAKI NAOYUKI
IPC: C25D3/56
Filed: 1994-12-26
Abstract: PURPOSE: To realize a metallic foil for a printed wiring board which restrains electrodeposition stress well by forming a nickel-phosphorus alloy layer of a specified thickness by using nickel-phosphorus plating solution and by forming a copper layer which becomes a circuit in a surface thereof. CONSTITUTION: Nickel-phosphorus plating solution is used, wherein concentration of naphthalene sulfonic acids, O-sulfobenzonic acid imide or alkali metal salt thereof is in the range of 2 to 20g/l and concentration of magnesium salt is in the range of 10 to 200g/l. A 0.04 to 1.5μm-thick nickel-phosphorus alloy layer is formed by electroplating by using the nickel-phosphorus plating solution in one side of a copper foil which becomes a carrier, and a copper layer to become a circuit is further formed in a surface thereof. Therefore, electrodeposition stress of a nickel-phosphorus alloy layer by nickel-phosphorus electroplating solution containing magnesium salt is greatly reduced and curling of a metallic foil provided with a copper layer for forming a circuit in a surface thereof can be eliminated.
Patent JP-H11145579-A (JP)
Title: Semiconductor manufacturing equipment
Inventor: SATO CHIEKO
IPC: H05K3/00
Filed: 1997-11-07
Abstract: PROBLEM TO BE SOLVED: To improve a product in reliability by a method, wherein a body clamp of a lead processing equipment which comes in direct contact with a molded package is made of flexible material, and a lead is processed by the lead processing equipment. SOLUTION: A molded package 1 is fed to a package receiver 4. The fed molded package 1 is supported with a body clamp 2. The leads of the molded package 1 fixed and supported are each formed by lead clamps 5. Lead forming units 6 are moved in both a lateral and a vertical directions as controlled by an electromoter, and the body clamp 2 is moved in a vertical direction by an electromoter. The leads of the molded package 1 are processed by the lead clamps 5 as the are, while keeping the molded package 1 clamped by the body clamp 2, and then the lead clomps 5 are lifted from the leads and separated. With this setup, pressure applied to a molded package becomes small, even when the molded package is clamped by a body clamp, so that the molded package can prevent crackings and deterioration in coplanarity.