baber/WOPTO huggingface dataset:
Patent TW-202044588-A (TW)
Title: Semiconductor structure
Inventor: LIN SHIN-CHENG
IPC: H01L29/41
Filed: 2019-05-20
Abstract: A semiconductor structure includes a substrate, a gate structure disposed on the substrate, a source structure and a drain structure disposed at the opposite sides of the gate structure, and a first dielectric layer. The gate structure includes a gate electrode disposed on the substrate and a gate metal layer which electrically connects the gate electrode and serves as a gate field plate. The source structure includes a source electrode disposed on the substrate and a first source metal layer which electrically connects the source electrode and extends in the direction from the gate electrode to the drain structure. The first dielectric layer is disposed on the gate metal layer. The electric potential of the first source metal layer is different from that of the gate metal layer. The first source metal layer exposes at least a portion of the first dielectric layer directly above the gate metal layer.
Patent TW-202013475-A (TW)
Title: Back surface adhesion film and dicing tape-combined back surface adhesion film
Inventor: SATO SATOSHI
IPC: H01L21/301
Filed: 2019-05-21
Abstract: An objective of the present invention is to provide a back-surface adhesion film appropriate for performing a chip test by infrared microscope observation from the back surface of a corresponding chip while attached to the back surface of a semiconductor chip while securing good infrared shield and laser marking properties. Also, the present invention provides a dicing tape-combined back surface adhesion film including the same. According to the present invention, a film (10), which is a back surface adhesion film, comprises a plurality of light absorption properties in which the absorption of each different wavelength in the ranges of visible and near infrared wavelengths is at its peak. The ratio value of the total light transmittance of a light with a wavelength of 1,000 nm measured with respect to a film sample piece with a thickness of 25 [mu]m prepared from the film (10) to the total light transmittance of a light with a wavelength of 1,800 nm measured with respect to the same sample piece is 1.2 or more. The dicing tape-combined back surface adhesion film (X) comprises a dicing tape (20) and film (10) detachably attached to the adhesive layer (22) of the dicing tape (20).
Patent TW-202002121-A (TW)
Title: Information processing apparatus, judgement method, program, lithography system, and manufacturing method of article
Inventor: TAKARADA YOSUKE
IPC: G03F7/20
Filed: 2019-05-27
Abstract: An information processing apparatus includes an acquisition unit configured to acquire a plurality of pieces of collected data collected in a state where lithographic processing is executed by a lithography apparatus for forming a pattern by applying a plurality of processing conditions, a classification unit configured to classify the acquired data based on the processing conditions, a judgement unit configured to judge that an abnormality has occurred in the acquired collected data by judging whether the collected data falls within an allowable range specified based on the processing conditions.
Patent TW-202045281-A (TW)
Title: Improved linear sliding block machining process capable of simplifying the complexity of processing and enhancing production capacity
Inventor: CHEN RU-TAN
IPC: F16C29/04
Filed: 2019-06-04
Abstract: An improved linear sliding block machining process manufactures a linear sliding block within three processing steps through a host system incorporated with different types of machining jigs and formed machining tools. The merchants only needs to prepare the same machine system and replace different types of machining jigs and machining tools to perform processing, and thereby simplifying the complexity of processing.
Patent TW-202103449-A (TW)
Title: Time calibration circuit and time calibration method thereof
Inventor: YEH CHUNG-WEN
IPC: H03M1/10
Filed: 2019-07-01
Abstract: A time calibration circuit and a time calibration method thereof are provided. The time calibration circuit includes a frequency divider, a time counter and an operation circuit. The frequency divider receives a clock signal and a frequency dividing value, and generates a divided clock signal according to the frequency dividing value. The time counter performs a counting operation according to the divided clock signal to generate an output time. The operation circuit adjusts the frequency dividing value according to a time difference value of the output time and a system time.
Patent TW-202005930-A (TW)
Title: Asymmetric ion-exchange methods of making strengthened articles with asymmetric surfaces
Inventor: HOU JUN
IPC: C03C21/00
Filed: 2019-07-05
Abstract: A method of making strengthened articles that includes: providing articles each having a first primary surface and a second primary surface, the first and second primary surfaces having one or more asymmetric surface features; providing a first ion-exchange bath; and performing an ion-exchange step by submersing the articles in the first ion-exchange bath to form strengthened articles. The articles are arranged in the first ion-exchange bath with the first primary surface of each facing the first primary surface of another of the articles at a first predetermined distance, and the second primary surface of each is facing the second primary surface of another of the articles at a second predetermined distance. The first predetermined distance and the second predetermined distance are selected such that the plurality of strengthened articles have a first strengthened surface with a convex surface, and a second strengthened surface with a concave surface.
Patent TW-202034498-A (TW)
Title: Semiconductor memory device and manufacturing method thereof wherein the device includes a first laminated body, a second laminated body, a semiconductor film, charge storage layers and a separation structure
Inventor: SAKATA KOICHI
IPC: G11C11/34
Filed: 2019-07-11
Abstract: Embodiments provide a semiconductor memory device that can suppress an increase of an area of a memory region or an enlargement of a semiconductor memory device and a manufacturing method thereof. A semiconductor memory device of one embodiment includes a first laminated body including a plurality of first electrode layers laminated in a first direction and extended in a second direction and a third direction; a second laminated body including a plurality of second electrode layers laminated in the first direction in the first laminated body and extended in the second direction and the third direction; a semiconductor film that extends in the first direction in the first laminated body and the second laminated body; charge storage layers respectively disposed between the plurality of first electrode layers and the semiconductor film, and between the plurality of second electrode layers and the semiconductor film; and a separation structure which extends in the first direction and the second direction, and separates the first laminated body from the second laminated body in the third direction. The separation structure includes a first separation membrane that extends in the first direction and separates the first laminated body in the third direction; a second separation membrane which has a different position from the first separation membrane in the third direction and extends in the first direction to separate the second laminated body in the third direction; and a film provided on the first separation membrane and including the same material as the first separation membrane that extends in the first direction.
Patent TW-202103022-A (TW)
Title: Scene model construction system and scene model constructing method
Inventor: CHEN KUAN-WEN
IPC: G06F16/75
Filed: 2019-07-11
Abstract: A scene model constructing method includes the following steps. According to multiple position parameters in multiple scene materials, classifying the scene materials into multiple position groups. According to scene similarities between the scene materials, classifying the scene materials into multiple first similar image sub-groups and multiple second similar image sub-groups. Establishing a first similar image sub-model and a second similar image sub-model respectively according to the first similar image sub-group and the second similar image sub-group. Combining a first similar image sub-model to a first position model, and combining a second similar image sub-model to a second position model. Finally, combining the first location model and the second similar image submodel to a scene model.
Patent TW-202018624-A (TW)
Title: Mobile payment method and device and electronic device
Inventor: ZHANG HONG
IPC: G06Q20/32
Filed: 2019-08-13
Abstract: The embodiment of the invention provides a mobile payment method and device and an electronic device. The method comprises: a micro-control unit identifying collection equipment supporting range-limited communication through an alternating magnetic field module, through the alternating magnetic field, transmitting equipment information and 2.4 G communication link parameters of the collection equipment; a micro-control unit setting the 2.4 G communication module based on the 2.4 G communication link parameters, so that the 2.4 G communication module establishes a 2.4 G communication link with the collection equipment; the micro-control unit receives a transaction timestamp sent by the collection device based on the 2.4 G communication link; the micro-control unit generating a payment code according to the equipment information, the code factor and the transaction timestamp based on a payment code generation algorithm in the security chip; and the micro-control unit sending the payment code to the collection equipment through the 2.4 G communication link, so that the collection equipment completes the payment transaction corresponding to the payment code through the reverse code scanning payment link.
Patent TW-202022449-A (TW)
Title: 顯示裝置
Inventor: LIAO CHIEN-TING
IPC: G02F1/1333
Filed: 2019-08-14
Abstract: 本發明提出一種顯示裝置，其包含背板、框架、顯示面板、以及膠帶。背板包含底板及沿著底板之周緣延伸之槽壁，且具有第一側邊及與第一側邊相交之第二側邊。在該第一側邊，背板進一步具有延伸朝向背板之內部突出之遮擋板。框架沿著底板之周緣設置，且具有側牆部及自側牆部朝向背板之內部突出之承載部。在該第二側邊，側牆部之底面設置於槽壁之頂面上，且側牆部之外側面與槽壁之外側面為共平面。顯示面板由該承載部所支承而設置於該背板之上。膠帶在第二側邊自槽壁之外側面延伸經側牆部之外側面而抵至顯示面板之上。
Patent TW-202019861-A (TW)
Title: Materials for organic electroluminescent devices
Inventor: RODRIGUEZ LARA-ISABEL
IPC: C07C15/20
Filed: 2019-09-10
Abstract: The present invention relates to organic electroluminescent devices comprising a sterically hindered fluorescent perylene emitter compound and a sensitizer compound and to sterically hindered fluorescent perylene emitter compounds.
Patent TW-202111953-A (TW)
Title: 薄膜電晶體裝置及其製造方法
Inventor: HSU SHIH-HUA
IPC: H01L29/78
Filed: 2019-09-12
Abstract: 一種薄膜電晶體裝置，包括基板、源極、汲極、材料層、遮光層以及閘極。源極以及汲極位於基板上。材料層位於源極以及汲極上。材料層包括圖案化的半導體層以及圖案化的絕緣層。圖案化的半導體層接觸源極以及汲極。圖案化的絕緣層位於圖案化的半導體層周圍。遮光層位於圖案化的半導體層上。遮光層與圖案化的半導體層具有相同的圖案。閘極位於遮光層上。
Patent TW-202112098-A (TW)
Title: Digital signature method with hierarchical mechanism and hardware wallet device suitable therefore
Inventor: LIN YU-TE
IPC: H04L9/14
Filed: 2019-09-12
Abstract: A digital signature method with hierarchical mechanism and hardware wallet device suitable therefore is disclosed. By generating a plurality of initialization messages through a server, and making the server and at least one hardware wallet device to obtain different initialization messages for generating corresponding polynomials, and setting a hierarchical value within the initialization messages as a degree of differentiation of the polynomial. So that to calculate a plurality of polynomial values that matches a shares number, and then to perform a secure multi-party computing to swap the polynomial values for generating a share with a level. When performing a signature operation, a number of the shares that needs to meet a threshold value and these shares have enough level to be able to calculate a correct signature message. The mechanism is help to improve the security of the signature.
Patent TW-202030744-A (TW)
Title: Cable
Inventor: PATRICK R CASHER
IPC: H01B7/02
Filed: 2019-09-20
Abstract: A cable comprising includes a pair of wires each with a core conductor enclosed in a primary insulator, an insulative inner tape spirally wrapping the pair of wires, a shielding tape longitudinally wrapping the inner tape with an insulative inner layer and a conductive outer layer thereof, a drain wire positioned outside of the shielding tape and at a centerline between the pair of wires, and an insulative outer taper spirally wrapping both the shielding tape and the drain wire.
Patent TW-202019124-A (TW)
Title: 管理使用者憑證系統、方法及媒介
Inventor: PHAM THIEN VAN
IPC: H04L9/32
Filed: 2019-09-25
Abstract: 接收一第一使用者帳戶（FAU）的一第一使用者名稱和一使用者的一生物簽章（BS）；回應於確定BS與FAU的一儲存的簽章相匹配，呈現一組可用服務（GAS）的指示；接收GAS的一服務的一選擇；傳輸被選擇的服務（SS）的一識別符；接收SS的一第二使用者帳戶（SAU）的一加密使用者名稱（EU）和一加密的密碼（EP）；解密EU和EP；打開對應於SS的一登入頁面（LP）的一第一頁面；發起在LP上識別一使用者名稱進入欄位（UEF）和一密碼進入欄位（PEF）的一腳本；在UEF中寫入該解密的使用者名稱（DU）和在PEF中寫入該解密後的密碼（DP）；以及在LP之中選擇一提交按鈕（SB），其中選擇將被選擇的SB導致SAU使用DU和DP而被驗證。
Patent TW-202020177-A (TW)
Title: additively fabricated fire-proof metal part, process for additively producing, and powder
Inventor: LEITZ KARL-HEINZ
IPC: B33Y70/00
Filed: 2019-10-15
Abstract: The invention relates to a component (8) having a solid structure, manufactured by a laser or electron beam in an additive manufacturing process, from at least one material selected from a group comprising molybdenum, a molybdenum-based alloy, tungsten, or a tungsten-based alloy, and relates to a component (8) having a solid structure, manufactured by a laser or electron beam in an additive manufacturing process, from at least one material selected from a group comprising molybdenum, a molybdenum-based alloy, tungsten, a tungsten-based alloy and a molybdenum-tungsten based alloy, said component (8) having one or more alloying element(s) which has or have in the case of molybdenum and the molybdenum-based alloy a reductive action on MoO2 and/or MoO3, in the case of tungsten and the tungsten-based alloy a reductive action on WO2 and/or WO3, and in the case of the molybdenum-tungsten based alloy a reductive action on at least one oxide of the group containing MoO2 and/or MoO3, WO2 and WO3, at least in the temperature range ≥ 1500 DEG C, the alloying element or at least one of the alloying elements being present both in at least partially non-oxidised form and oxidised form.
Patent TW-202105052-A (TW)
Title: Method, computer program product and system for semi-automated design of integrated circuit
Inventor: LIU HSIAN-FENG
IPC: G03F1/70
Filed: 2019-10-25
Abstract: A method, computer program product and system for a semi-automated design of an integrated circuit are provided, wherein the integrated circuit includes a first partial circuit and a second partial circuit. The method includes: directly using a set of predetermined circuit information that is designed in advance to act as circuit information of the first partial circuit; and generating circuit information of the second partial circuit through an automated design procedure.
Patent TW-202036002-A (TW)
Inventor: TAKAHASHI TARO
IPC: B24B49/10
Filed: 2019-11-05
Abstract: An eddy current detection device having a stronger magnetic field formed on an object to be polished and a polishing device using the same are provided. According to the present invention, the eddy current detection device (50) which can be disposed in the vicinity of a semiconductor wafer on which a conductive film is formed has a plurality of eddy current sensors (56). The plurality of eddy current sensors (56) are disposed near each other. Each of the plurality of eddy current sensors (56) has a port core (60), an excitation coil disposed on the port core (60) and capable of forming an eddy current on the conductive film, and a detection coil disposed on the port core (60) and capable of detecting the eddy current formed on the conductive film.
Patent TW-202121637-A (TW)
Title: Fan-out package and packaging method thereof
Inventor: CHEN TZU-MIN
IPC: H01L23/538
Filed: 2019-11-20
Abstract: The present invention relates to a fan-out package and packaging method thereof. In the method, multiple chips are mounted on a carrier and sides of multiple metal bumps on each of the chips are encapsulated by an insulation layer. An RDL layer is formed on the chips. In a step of forming the RDL, multiple openings are formed through a first dielectric insulation layer of the RDL and the metal bumps of each of the chips are exposed in the air through the corresponding openings. Since a size of the opening is larger than that of a conventional opening corresponding to the metal bump, the metal bumps are exposed without a precision alignment. Therefore, in a next step of forming metal pillar, a touch area between the metal pillar and the metal bump is increased and quality of electrical connection between the RDL and chips is increased, too.
Patent TW-202006969-A (TW)
Title: Method of separating light emitting devices formed on a substrate wafer
Inventor: ILIEVSKI FILIP
IPC: H01L33/20
Filed: 2014-07-22
Abstract: A method according to embodiments of the invention includes growing on a first surface of a sapphire substrate a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is formed into a plurality of LEDs. Cracks are formed in the sapphire substrate. The cracks extend from the first surface of the sapphire substrate and do not penetrate an entire thickness of the sapphire substrate. After forming cracks in the sapphire substrate, the sapphire substrate is thinned from a second surface of the sapphire substrate. The second surface is opposite the first surface.
Patent TW-202102689-A (TW)
Title: Multi-gene combined detection reagent
Inventor: WU XIAO-LIN
IPC: C12Q1/6886
Filed: 2019-11-28
Abstract: The invention belongs to the field of biological medicines, and particularly relates to a tumor marker, a methylation detection reagent, a kit and application of the tumor marker, the methylation detection reagent and the kit. Research finds that colorectal cancer specimens can be well distinguished from excrement specimens by detecting the methylation levels of SDC2, COL4A1/COL4A2 and ITGA4 genecombined promoter regions. According to the invention, the colorectal cancer is detected by using the methylation detection reagent containing the gene combination, and the detection sensitivity and specificity to the colorectal cancer are very high and can reach 90% or above.
Patent TW-202028407-A (TW)
Title: UV curable silicone adhesive composition and cured product thereof
Inventor: OTAKE KOHEI
IPC: C09J183/07
Filed: 2019-11-29
Abstract: This UV curable silicone composition contains (A) an organopolysiloxane represented by general formula (1) [R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an aromatic group, X represents a group represented by formula (2), a, m, and n respectively represent numbers in the ranges of 1 ≤ a ≤ 3, 1 ≤ m ≤ 2,000, 1 ≤ n ≤ 2,000, and m/(n+m) ≥ 0.01 is satisfied. (R1 is as defined above. R3 represents an oxygen atom or an alkylene group having 1-20 carbon atoms, R4 represents an acryloyloxyalkyl group, a methacryloyloxyalkyl group, an acryloyloxyalkyloxy group, or a methacryloyloxyalkyloxy group, p represents a number in the range of 0 ≤ p ≤ 10, and c represents a number in the range of 1 ≤ c ≤ 3.)], (B) a mono-functional (meth)acrylate compound not containing a siloxane structure, and (C) a photopolymerization initiator, and provides, as a temporary fixing material, a cured product having excellent adhesiveness and rubber strength.
Patent TW-202046051-A (TW)
Title: Electronic device
Inventor: PENG MING-CHUNG
IPC: F16C11/04
Filed: 2019-12-02
Abstract: An electronic device includes a first body, a second body, two hinges and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and located between the two hinges.
Patent TW-202122826-A (TW)
Inventor: CHANG I-PING
IPC: G01C25/00
Filed: 2019-12-06
Abstract: 本揭露提供一種測距裝置。上述測距裝置包括一校正電路和一測距電路。校正電路會接收一通道狀態資訊(CSI)，以及根據上述通道狀態資訊，取得一訊號路徑功率以及一雜訊路徑功率，並執行運算將上述訊號路徑功率除以上述雜訊路徑功率取得一訊號功率校正值。測距電路耦接上述校正電路，接收一接收訊號強度指示(RSSI)和上述訊號功率校正值，根據上述接收訊號強度指示和上述訊號功率校正值取得一路徑衰減指數，以及根據上述訊號功率校正值和上述路徑衰減指數取得一距離估測值。
Patent TW-202101577-A (TW)
Title: Methods to reshape spacer profiles in self-aligned multiple patterning
Inventor: KO AKITERU
IPC: H01L21/3205
Filed: 2019-12-09
Abstract: Embodiments are described herein to reshape spacer profiles to improve spacer uniformity and thereby improve etch uniformity during pattern transfer associated with self-aligned multiple-patterning (SAMP) processes. For disclosed embodiments, cores are formed on a material layer for a substrate of a microelectronic workpiece. A spacer material layer is then formed over the cores. Symmetric spacers are then formed adjacent the cores by reshaping the spacer material layer using one or more directional deposition processes to deposit additional spacer material and using one or more etch process steps. For one example embodiment, one or more oblique physical vapor deposition (PVD) processes are used to deposit the additional spacer material for the spacer profile reshaping. This reshaping of the spacer profiles allows for symmetric spacers to be formed thereby improving etch uniformity during subsequent pattern transfer processes.
Patent TW-202041357-A (TW)
Inventor: BUONO SEAN MICHAEL
IPC: B29C63/00
Filed: 2019-12-13
Abstract: Systems and methods of applying a screen protector to a surface, including aligning a first mating surface with a second mating surface within a chamber, creating a vacuum within the chamber, inflating an airbag arranged within the chamber, contacting the first mating surface with the airbag, inflating the airbag to extend towards the perimeter of the first mating surface and second mating surface, and removing all air trapped between the first mating surface and the second mating surface.
Patent TW-202124112-A (TW)
Title: Mold for drilling a tape-type flexible circuit board
Inventor: TSAI CHIN-PAO
IPC: B26D1/14
Filed: 2019-12-17
Abstract: A mold for drilling a tape-type flexible circuit board includes a material conveying board, two needle row units, a stopper board including at least one latch groove, and at least one movable latch. Each needle row unit includes at least one pin spaced in a row, at least one adjustment pin, at least one fixing pin, and an elastic member connected to the at least one adjustment pin. The tip of the fixing pin protrudes beyond the material conveying board by a length. The at least one movable latch is horizontally movably mounted in the at least one latch groove, such that the at least one movable latch abuts the at least one adjustment pin at an abutment position to thereby cause the tip of the at least one adjustment pin to protrude beyond the material conveying board by the length.
Patent TW-202130082-A (TW)
Title: Electrostatic discharge blocking circuits
Inventor: JOU YEH-NING
IPC: H01L23/60
Filed: 2020-01-15
Abstract: An electrostatic discharge blocking circuit including an internal circuit, a schottky diode and an electrostatic discharge (ESD) releasing element is provided. The schottky diode is coupled between a specific node and the internal circuit. The ESD releasing element is coupled between the specific circuit and a power terminal. When an ESD event occurs, the ESD releasing element is turned on to release an ESD current from the specific node to the power terminal.