baber/WOPTO huggingface dataset:
Patent TW-512461-B (TW)
Title: Single-substrate-heat-processing apparatus and method for performing reformation and crystallization
Inventor: JINRIKI HIROSHI
IPC: C23C16/56
Filed: 1999-08-17
Granted: 2002-12-01
Abstract: A semiconductor wafer W is formed with insulative films from first and second tantalum oxide layers (20, 22). While the first layer (20) in a non-crystalline form is being deposited via chemical vapor deposition, a modifying treatment is conducted to remove organic impurities contained in the first layer (20). Then, the second layer (22) in a non-crystalline form is deposited on the first layer (20) via chemical vapor deposition. Subsequently, an ozone-containing processing gas is supplied to a processing room (34), and the wafer W is heated at the same time to a temperature lower than a crystallization temperature for a certain period so as to remove organic impurities contained in the second layer (22). Afterwards, the wafer W is further heated in the same processing room (34) to a second temperature higher than the crystallization temperature and then cooled to a temperature lower than the crystallization temperature so that the first and second layers (20, 22) are crystallized at the same time.
Patent TW-432734-B (TW)
Title: Secondary battery
Inventor: IWAIZONO YOSHINORI
IPC: H01M10/05
Filed: 1999-08-25
Granted: 2001-05-01
Abstract: Under the condition that power generation unit (51) is accepted in battery case (15), a protection circuit that has an electronic circuit (11) constituted on circuit board (10) is installed inside the sealing portion (8), which is used for sealing an opening end of battery case (15). A circuit board (10) is installed at outside terminal of the sealing portion. A positive terminal plate (16) of positive terminal for battery served as the secondary battery and a S terminal plate (14) that controls action of electronic circuit (11) by using externally connecting manner are installed at outside face of circuit board (10). By using this structure, a protection circuit with the capability of preventing over-discharging and over charging is installed inside sealing portion. Under the condition without forming assembly battery, the secondary battery with protection circuit is constituted.
Patent TW-426551-B (TW)
Title: Method and apparatus for ejecting liquid in fixed amount
Inventor: IKUSHIMA KAZUMASA
IPC: B05C11/10
Filed: 1999-10-21
Granted: 2001-03-21
Abstract: The invention provide a liquid ejecting method and apparatus by which an ejection port of an ejection valve is mechanically opened and closed, and which can more positively shut off the liquid at the time of stopping the ejection of a liquid and can securely avoid a leakage of the liquid without a risk of breaking fillers. When ejecting the liquid in a fixed amount from a liquid reservoir through the ejection valve, a pressure of the liquid supplied from the liquid reservoir to the ejection valve is controlled depending on the liquid pressure near the ejection port of the ejection valve, and the ejection port is mechanically opened and closed. Further, in an apparatus for ejecting a liquid in a fixed amount from a liquid reservoir through an ejection valve, the liquid reservoir of the apparatus includes means for pressurizing the liquid in the liquid reservoir under a pressure depending on viscosity of the stored liquid, and the ejection valve communicating with the liquid reservoir has an ejection port mechanically opened and closed.
Patent TW-430911-B (TW)
Title: BGA type semiconductor device package
Inventor: KIMURA NAOTO
IPC: H01L23/12
Filed: 1999-11-03
Granted: 2001-04-21
Abstract: A BGA type semiconductor device package, include a semiconductor chip, a plurality of electrode pads formed on the semiconductor chip, a group of leads, connection wires and a resin mold. The group of leads includes a group of first leads and a group of second leads. Each of the first leads is electrically connected with at least one of the second leads at a lead connecting portion. The first leads are arranged 2-dimensionally and the group of first leads and the group of second leads are arranged 3-dimensionally. The connection wires electrically connects the first leads with the plurality of electrode pads. The resin mold seals the semiconductor chip, the plurality of electrode pads, the group of leads and the connection wires such that the second leads have exposed surface portions for solder balls by concave portions of the resin mold.
Patent TW-476668-B (TW)
Title: A catalyst useful for the production of vinyl acetate n a fluid bed reactor and method to produce the same
Inventor: BAKER MICHAEL JAMES
IPC: B01J33/00
Filed: 1999-12-03
Granted: 2002-02-21
Abstract: A catalytically active material useful to prepare vinyl acetate monomer from ethylene, acetic acid, and an oxygen-containing gas under fluid bed conditions comprises a porous microspheroidal support containing catalytically active palladium crystallites finely dispersed within the support. This catalyst material does not require incorporation of gold to maintain activity and selectivity. A process to produce a vinyl acetate fluid bed catalyst in which catalytically active small palladium crystallites are finely dispersed within the support comprises dispersing selected metal species within the support which have an affinity to palladium to form very fine crystallites of palladium. The affinity metal species may be dispersed by impregnation onto a preformed microspheroidal support or may be intimately incorporated within the support before impregnation with a soluble palladium species.
Patent TW-I251468-B (TW)
Title: A hypoallergenic composition containing tolerogenic peptides inducing oral tolerance
Inventor: RODOLPHE FRITSCHE
IPC: A61K38/01
Filed: 2000-01-12
Granted: 2006-03-21
Abstract: A hypoallergenic composition for the induction of protein tolerance in at risk individuals of protein allergy, consisting of (i) a ""non allergenic"" protein extensively hydrolysed basis and/or of (ii) a free amino acid basis, said composition comprising as the active ingredient at least one tolerogenic peptide of the allergenic protein.
Patent TW-469422-B (TW)
Title: System and method for automatic audio content analysis for word spotting, indexing, classification and retrieval
Inventor: PETKOVIC DRAGUTIN
IPC: G10L17/26
Filed: 2000-01-12
Granted: 2001-12-21
Abstract: A system and method for indexing an audio stream for subsequent information retrieval and for skimming, gisting, and summarizing the audio stream includes using special audio prefiltering such that only relevant speech segments that are generated by a speech recognition engine are indexed. Specific indexing features are disclosed that improve the precision and recall of an information retrieval system used after indexing for word spotting. The invention includes rendering the audio stream into intervals, with each interval including one or more segments. For each segment of an interval it is determined whether the segment exhibits one or more predetermined audio features such as a particular range of zero crossing rates, a particular range of energy, and a particular range of spectral energy concentration. The audio features are heuristically determined to represent respective audio events including silence, music, speech, and speech on music. Also, it is determined whether a group of intervals matches a heuristically predefined meta pattern such as continuous uninterrupted speech, concluding ideas, hesitations and emphases in speech, and so on, and the audio stream is then indexed based on the interval classification and meta pattern matching, with only relevant features being indexed to improve subsequent precision of information retrieval. Also, alternatives for longer terms generated by the speech recognition engine are indexed along with respective weights, to improve subsequent recall.
Patent TW-477739-B (TW)
Title: Device and method for supplying adhesive labels with punched holes
Inventor: WANG JR-MING
IPC: B26D5/20
Filed: 2000-04-26
Granted: 2002-03-01
Abstract: This invention provides a device and method for supplying adhesive labels with punched holes, relating to the method and device of supplying an adhesive label with punched holes, which label being a belt-shaped adhesive belt with a belt-shaped release layer with punched holes, under a state where the release layer is partly separated. The device provides at least one optical sensor detector that detects whether the plurality of adhesive labels with punched holes that are partly separated are formed with punched holes, so as to turn on/off the detecting circuit whereby a control circuit is activated to drive a hydraulic cylinder valve, and to drive a driving rubber roller. A stamping mold coupled and located beneath the hydraulic cylinder stamps the belt-shaped adhesive label. The driving rubber roller subjects the stamps belt-shaped adhesive label to move forwards so as to allow continuous supply of adhesive labels with punched holes, and to form a supplying device for adhesive labels with punched holes.
Patent TW-501917-B (TW)
Title: Molded surface fastener, and molding apparatus and molding method therefor
Inventor: MURAZAKI RYUICHI
IPC: A44B18/00
Filed: 2000-06-26
Granted: 2002-09-11
Abstract: A peripheral face of a cooling drum (111) to be driven and rotated in one direction has a predetermined gap relative to an extruding die (101) of an extruder. An extrusion nozzle (105) which communicates with a resin flow path is provided at an end of the extruding die (101) in the die wheel rotation direction, and has a plurality of engaging-element-molding openings (105b) spaced at equal pitches in a width direction thereof. Molten resin extruded from the extruding die (101) onto the peripheral face of the cooling drum (111) is cooled when passing through the resin flow path, and when it is extruded from the extrusion nozzle (105) in half molten state. Simultaneously an up/down vibrating means (106) which vibrates vertically opens or closes the engaging-element-molding openings (105b) to mold engaging elements (12) successively, each having a thickness in the molding direction increasing gradually as it goes downward. By change of pressure in the extrusion nozzle (105) by the opening or closing of the up/down vibrating means (106), the engaging element (12) in which lateral widths of front and rear faces (W1, W2) thereof in the molding direction thereof are different is obtained. Therefore, it is possible to obtain a molded surface fastener in which the engaging elements (12) having diversified dimensions and shapes and excellent physical property are molded integrally, and a molding apparatus and molding method based on a novel molding mechanism, which facilitates maintenance control, ensures a high productivity and is capable of molding the engaging elements (12) having novel shapes and physical property on the substrate (11) easily.
Patent TW-476823-B (TW)
Title: Yarn feeder with feeler barrier
Inventor: LEINS EBERHARD
IPC: D04B35/14
Filed: 2000-07-11
Granted: 2002-02-21
Abstract: The yarn feeder of the invention has one or two yarn feeler levers, which monitor the yarn. In order to be able to prevent the monitoring if needed, a feeler barrier is provided. Its actuating device (handle) is disposed on an outer end of the basic body or of the yarn feeder, so that it is readily accessible to operators. The position set can also easily be seen from the position of the handle.
Patent TW-492246-B (TW)
Title: Automatic intelligent recording system and method for monitoring broken wafer image
Inventor: CHEN TING-KOU
IPC: G01N21/88
Filed: 2000-09-08
Granted: 2002-06-21
Abstract: An automatic intelligent recording system and method for monitoring broken wafer image are provided. The invention primarily provides multiple camera systems capable of simultaneously monitoring the grinding state of wafer, multiple image transmitters for transmitting the taken image signals of the camera systems, multiple image receivers for combining the received captured images in the same screen, and a personal computer (PC) capable of receiving the transmitted image signals from the multiple image receivers over the input terminal of the internal image catching card, and receiving the signal of wafer in and out the grinding equipment from signal transmission device and signal of broken wafer. It enables the engineer to conveniently make decisions, diagnostics, real cause verification or engineering improvement management.
Patent TW-459430-B (TW)
Title: Connector for module
Inventor: YASUFUKU KAORI
IPC: H05K1/14
Filed: 2000-10-11
Granted: 2001-10-11
Abstract: The present invention relates to a connector for module, especially relates to a connector (200) for module in which the board plane of the module (100) is approximately parallel to the printed circuit board (300). This connector (200) for module comprises: a connector body (210) having a receiving part (211) that extends along the front side (111) of a module (100) being in the connection position and is provided in the rear face thereof with a groove (211a) into which the front side (111) of the module (100) is to be inserted; a contact (212a or 212b) that is provided in the groove (211a) of the receiving part (211) and contact a conductive pad (130) while allowing it to shift in the direction of insertion/withdrawal when the module (100) is in the insertion/withdrawal position in which the rear side is raised; and a supporting part (213) that extend rearward from the receiving part (211) to support both the left and right sides (112)(113) and the bottom (114) of the module (100) being in the connection position; and a metallic cover (220) having an engaged connector body (210) and covering it, and sandwich the module (100) between itself and the supporting part (213) and keep the module in the connection position. This connector (200) for module prevents defective connection and disconnection of the modules (100) due to thermal load and elastic deformation, and also reduces the effects of electromagnetic waves, etc. on the connector (200) for module and the module (100) to stably maintain the operation of the circuit.
Patent TW-454316-B (TW)
Title: Multi-chip package module
Inventor: PAI TSUNG-MING
IPC: H01L23/28
Filed: 2000-10-13
Granted: 2001-09-11
Abstract: A kind of multi-chip package module mainly contains two semiconductor chips, which are mutually stacked and mounted on a baseboard. The multi-chip package module is featured with having a dummy chip sandwiched between these two semiconductor chips. The size of this dummy chip is smaller than the lower semiconductor chip such that any part of dummy chip will not block the vertically upward region of the chip bonding-pad for the lower chip to avoid blocking its wire bonding process. In addition, the dummy chip has a preset thickness that is enough to provide the required clearance for bonding wires of the lower chip bonding-pad so as to prevent the bonding wires of the lower chip from being damaged by the upper chip.
Patent TW-512584-B (TW)
Title: Method and apparatus for synchronizing PWM sinusoidal drive to a DC motor
Inventor: WHITE BERTRAM J
IPC: H02P6/10
Filed: 2001-05-09
Granted: 2002-12-01
Abstract: A method and circuit for operating a polyphase DC motor in which discontinuous sinusoidal drive voltages are applied to the windings of the motor in predetermined phases. The discontinuous portion of the sinusoid is timed with the bemf zero crossings. Bemf zero crossings are detected, and phases of the drive voltages are adjusted to have zero crossings substantially in the discontinuities of the drive voltages. The method and circuit result in motor operation with significantly reduced acoustic motor noise.
Patent TW-I242496-B (TW)
Title: Packaging bag
Inventor: FUTAGAWA TAKASHI
IPC: B65D65/40
Filed: 1998-09-07
Granted: 2005-11-01
Abstract: A packaging bag comprises a heat-sealed, unstretched laminated film comprising: (A) as an outermost layer, a blended resin layer comprising a polyester resin containing not less than 70 mol % of polyethylene naphthalate-forming units and a polyester resin containing not less than 70 mol % of polyethylene terephthalate-forming units, or a polyester resin layer containing not less than 70 mol % of polybutylene terephthalate-forming units; (B) a gas-barrier resin layer; and (C) as an innermost layer, a heat-sealable resin layer, said resin layers (A) to (C) being disposed in this order. Such a packaging bag shows excellent label adhesion strength and pinhole resistance.
Patent TW-525014-B (TW)
Title: Liquid-crystal display device
Inventor: UMEMOTO SEIJI
IPC: G02F1/13363
Filed: 2000-12-20
Granted: 2003-03-21
Abstract: There is provided a liquid-crystal display device having a transmission type liquid-crystal display panel including a liquid-crystal cell, a light source disposed on at least one side surface of the liquid-crystal display panel, and an optical path changing sheet disposed on a back side opposite to a visual side of the liquid-crystal display panel and having optical path changing slopes. Incident light from the light source is reflected toward the visual side of the liquid-crystal display device.
Patent TW-504444-B (TW)
Title: Device for manufacturing plastic items, particularly caps for closing containers
Inventor: ZUFFA ZENO
IPC: B29L31/56
Filed: 2001-01-18
Granted: 2002-10-01
Abstract: A device for manufacturing, in particular, plastic caps for closing containers, comprising molding units (1, 2), each of which is composed of a male mold part (1) and of a female mold part (2), The male mold part (1) has a punch (13) which is directly provided with compressed air which exits through ports (23a), so as to cause the separation of the cap (A) from the punch (13) and facilitate the removal of the cap (A).
Patent TW-I228552-B (TW)
Title: Process for producing a silicon melt
Inventor: HOLDER JOHN D
IPC: C30B15/00
Filed: 2001-02-27
Granted: 2005-03-01
Abstract: A process for controlling the amount of insoluble gas trapped by a silicon melt is disclosed. After a crucible is charged with polycrystalline silicon, a gas comprising at least about 10% of a gas having a high solubility in silicon is used as the purging gas for a period of time during melting. After the polycrystalline silicon charge has completely melted, the purge gas may be switched to a conventional argon purge. Utilizing a purge gas highly soluble in silicon for a period of time during the melting process reduces the amount of insoluble gases trapped in the charge and, hence, the amount of insoluble gases grown into the crystal that form defects on sliced wafers.
Patent TW-494077-B (TW)
Title: Traffic jam detector of the rail car for a warehouse delivery system
Inventor: JUNG SHIN-HUNG
IPC: G08B21/20
Filed: 2001-03-22
Granted: 2002-07-11
Abstract: A traffic jam detector of the rail car for a kind of warehouse delivery system includes three circuits: counting circuit, receiving detector circuit, and the main circuit. By using the region detectors on the rail, the present invention is led to the self-designed circuit and is monitored by the self-designed circuit. In addition, it is capable of monitoring whether the rail car operates normally or not according to the designed counting time. When the rail car operates abnormally, the present invention is capable of sending an alarm signal to notify the related person to handle the situation, so as to maintain the normal delivery operation of the rail car.
Patent TW-501349-B (TW)
Title: Digital-to-analog converter
Inventor: TODA AKIHIKO
IPC: H03M1/74
Filed: 2001-03-28
Granted: 2002-09-01
Abstract: A digital-to-analog-converter is provided which allows a use to set the reference voltage as desired and therefore has improved flexibility. A more significant bit data conversion section converts more significant bit data of digital data into a more significant analog signal corresponding to the more significant, bit data by using a reference voltage inputted from outside. A less significant 'bit data conversion section converts less significant bit data of the digital data into a less significant analog signal corresponding to the less significant bit data. A controller controls the less significant bit data conversion section in such a manner as to output the less significant analog signal according to the reference voltage. An adder adds the more significant analog signal and the less significant analog signal, thereby outputting an analog signal corresponding to the digital data.
Patent TW-503311-B (TW)
Title: Infrared radiation thermometer with variable probe head
Inventor: KRAUS BERNHARD
IPC: G01K13/00
Filed: 2001-04-12
Granted: 2002-09-21
Abstract: The invention is directed to an infrared radiation thermometer, in particular an ear thermometer, having a probe head (10) whose outer diameter and/or shape is variable by an elastic arrangement (4, 14, 24). This enables the probe head to conform itself automatically to the size and/or contour of the body cavity or to be conformed manually. The thermometer is therefore equally well suited for both children and adults, although their ear canals differ in diameter.
Patent TW-503278-B (TW)
Title: Device for drawing non-woven cloth and operation method thereof
Inventor: CHEN RUNG-JUNG
IPC: D04H1/70
Filed: 2001-05-18
Granted: 2002-09-21
Abstract: The present invention relates to a device for drawing a non-woven cloth and its operation method. The method comprises: using a slant unfolding thread to perform a drawing unfolding; using a slant pulling force applied on a non-woven cloth by the slant unfolding thread to increase the longitudinal tension on the non-woven cloth so that the non-woven cloth has a uniform tension along the longitudinal direction and the transversal direction. Thus, the non-woven cloth can have a uniform quality. The slant unfolding thread enables the non-woven cloth to have a smooth drawing without the occurrence of machine breakdown.
Patent TW-486841-B (TW)
Title: Method for automatically assembling feeding pin on microstrip antenna
Inventor: CHEN CHING-CHIAN
IPC: H01Q1/12
Filed: 2001-05-25
Granted: 2002-05-11
Abstract: The present invention provides a method for automatically assembling feeding pin on microstrip antenna. The method comprises placing a semi-finished product of microstrip antenna performed with silver-glue screen-printing burning operation on a tool, and placing the tool on a first transmission device, so as to print the tin paste coated on a steel plate to the semi-finished product by steel plate printing for mounting to the periphery of a mounting hole the feeding pin; then, transferring the tool to the position of an adjacent feeding pin inserting device by the first transmission device; inserting the feeding pin into the mounting hole by the feeding pin inserting device and pressing the same into the mounting hole so that one end of the feeding pin just contacts with the tin paste on the periphery of the mounting hole; then, transferring the tool into a reflow furnace by the transmission device for performing a melt-soldering process, thereby soldering and fixing the feeding pins in the mounting holes via the tin paste. Accordingly, it is able to automatically complete the assembling operation of the feeding pins on the microstrip antenna with requiring manual labor, thereby greatly decreasing the manufacturing cost of the microstrip antenna and easily achieving the purpose of mass production of microstrip antenna.
Patent TW-493103-B (TW)
Title: Digital camera with auxiliary light source and the light compensation method
Inventor: JANG TSUNG-YUAN
IPC: G03B21/00
Filed: 2001-05-29
Granted: 2002-07-01
Abstract: A digital camera with auxiliary light source and the light compensation method, which uses an auxiliary light source for continuous light source during the continuous capturing on the digital camera, so as to compensate for the light without continuous flashing. Thus, during the continuous capturing, the better pictures can be obtained and the situation of insufficient picture lightness will not occur.