Patent DE-102009053903-B3 (DE)
Title: Coating substrate in vacuum chamber having rotating magnetron, comprises guiding past the substrate to the magnetron in substrate transport direction, and coating the substrate by material extracted from target connected with the magnetron
Inventor: LINS VOLKER
IPC: C23C14/35
Filed: 2009-11-20
Granted: 2011-06-16
Abstract: The method for coating a substrate (5) in a vacuum chamber (1) having two rotating magnetrons (7), comprises guiding past the substrate to the magnetron in a substrate transport direction, and coating the substrate by a material extracted from a target connected with the magnetron and optionally under a reaction of the materials with the reactive gases present in the vacuum chamber, carrying out a regulation of the operating points of the coating process, in which a target voltage is applied to a tube magnetron with a rotating target and a counter electrode. The method for coating a substrate (5) in a vacuum chamber (1) having two rotating magnetrons (7), comprises guiding past the substrate to the magnetron in a substrate transport direction, and coating the substrate by a material extracted from a target connected with the magnetron and optionally under a reaction of the materials with the reactive gases present in the vacuum chamber, carrying out a regulation of the operating points of the coating process, in which a target voltage is applied to a tube magnetron with a rotating target and a counter electrode, so that a period change of a first process parameter induced by a target rotation is regulated by a periodic change of a second process parameter with a determined amount. The period change of the first process parameter induced by the target rotation is regulated to +delta U to -delta U by the periodic change of the target voltage (second process parameter), where the amount of the change delta U is less than the amount of the target voltage U, where the first parameter is the intensity of a significant line of an optical emission spectrogram and is the reactive gas partial pressure. The target voltage is DC voltage or AC voltage. The periodic duration of the change of the target voltage U corresponds to the target rotation. The target voltage is changed in sine-form, and is changed in a form deviated from the sine form. The target voltage is applied as a voltage regulated by a voltage regulation and the power received from the tube magnetron is constantly held by a regulation of the reactive gas flow. The periodic voltage change is created by varying at the control input of the voltage regulation. The period change of the first process parameter induced by the target rotation is regulated by a periodic change of a total pressure (second process parameter). The period change of the first process parameter induced by the target rotation and/or a third process parameter are regulated by the periodic change of the second process parameter and/or a fourth process parameter with a determined amount. The first or third parameter is the partial pressure of the reactive gases, the intensity of the significant line of the optical emission spectrogram or the intensity of the two lines of an optical emission spectrogram. The second or fourth parameter is the voltage or total pressure. The magnetrons are driven at different speeds to each other, and are driven in rotation directions opposite to each other.