baber/WOPTO huggingface dataset:
Patent JP-S57212393-A (JP)
Title: Rotary compressor
Inventor: TOMITA MASAKAZU
IPC: F01C21/08
Filed: 1981-06-22
Abstract: PURPOSE:To reduce leakage of gas in a rotary compressor, by using two vane plates superposed on each other for constituting a sliding vane unit which separates a suction chamber and a compression chamber from each other, dividing at least one of the two vane plates, and applying a force to the divided surfaces of said one of the vane plate for urging the end faces of the vane plate into contact with fixed wall surfaces. CONSTITUTION:Two sliding vane plates 40, 41 urged into contact with the outer surface of a piston 17 by the force of a spring 23 for separating a suction chamber 27 and a compression chamber 28 from each other, are superposed on each other in a relatively movable manner. Here, one (41) of the two sliding vane plates is divided axially into two parts 41a, 41b, and a force is applied to the two parts 41a, 41b of the sliding vane plate 41 by means of a compression plate spring 42 so that the end faces of the two parts 41a, 41b are respectively forced into contact with fixed wall surfaces of a front case and a rear block (both not shown in the drawing) defining the suction chamber 27 and compression chamber 28. By thus reducing the gaps almost to zero, it is enabled to reduce leakage of gas considerably.
Patent JP-S5428558-A (JP)
Title: Pulse shaping circuit
Inventor: AKUTAGAWA TETSUO
IPC: H03K4/00
Filed: 1977-08-06
Abstract: PURPOSE: To obtain the output pulse by contracting only the pulse duration without giving the attenuation or the change to the amplitude, by inserting the resistor and the concentrated time constant type delay circuit of T-type connection of the coil and the capacity in series between an optional intermediate point of the circuit which connects the positive polarity input terminal of the pulse transmission circuit and the opposing negative polarity circuit. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-H10290201-A (JP)
Title: Terminal monitor and monitor system using it
Inventor: SUGAI CHIHARU
IPC: H04B17/00
Filed: 1997-04-14
Abstract: PROBLEM TO BE SOLVED: To obtain the terminal monitor and the monitor system including it where occurrence of a fault is surely reported to a person in charge of the equipment or a maintenance personnel. SOLUTION: On the occurrence of a fault (11), a monitor of a terminal monitor sends a fault alarm signal to a CPU. Upon the receipt of the fault alarm at the CPU, a name of a maintenance personnel and the like is retrieved and a contact to the maintenance personnel or the like is prepared (12). After the end of retrieval of the maintenance personnel and the like, fault information is transmitted to a pager of the maintenance personnel and the like (13). The maintenance personnel and the like accesses the CPU to enter personal information and the like of the maintenance personnel and the like and then the reception is acknowledged (14). When no reception acknowledgement comes from the maintenance personnel or the like within a set time after the transmission of the fault information (14), the CPU retrieves the maintenance personnel and the like (reservation).
Patent JP-H06238061-A (JP)
Title: Game device
Inventor: SAITO SHINYA
IPC: A63F13/00
Filed: 1993-03-29
Abstract: PURPOSE:To provide a game device with display never limiting the number of participating players and having a promising game content by providing a game sheet on which a pattern corresponding to the game is displayed and a plurality of switch boards corresponding to patterns, and inputting the signal from the switch board to execute a program. CONSTITUTION:An input device 52 connected to a computer 1 through a connection board 4 have X-directional conductors x1-xn and Y-directional conductors y1-yn formed on the upper surface of a rectangular board 7, switches sw1-swn are arranged in matrix in intersections of the respective conductors, and each switch sw1-swn is connected to a connector pin 10 through a decoder 8 on the end part of the X-directional conductors and a scanning circuit 9 on the end part of the Y-directional conductors. A game sheet 13 showing the content to be inputted to the computer 1 by the pressing of the switch is described in the position corresponding to each switch on the upper surface of a protective sheet 11 on the upper surface of the switch group, a game board is pushed to turn ON a determined switch, and the progressing state of the board game is inputted to the computer 1.
Patent JP-2000289877-A (JP)
Title: Paper feed device
Inventor: KANO KUNIHIKO
IPC: B65H3/56
Filed: 1999-04-01
Abstract: PROBLEM TO BE SOLVED: To surely separate paper sheet one by one and carry it by small carrying force quickly and smoothly by movably providing a claw means supporting the moving means side of the extreme end of a paper sheet bundle between a first position positioned at feeding the paper sheet and a second position positioned at setting the paper sheets. SOLUTION: This paper feed device is constituted of an extreme end regulation member 303, a moving roller 304, a pressure connection plate 305, a presser plate 306, and a supporting claw 307, and the supporting claw 307 is arranged so as to contact with the angle part of the extreme end of documents. Further the supporting claw 307 is provided so as to support the underside of the extreme end part of a document bundle 302 on a tray 301, and in this case, the supporting claw 307 is movably provided between a first position and a second position, and at feeding the document, the supporting claw 307 is set on the first position, and the lowermost document of the document bundle 302 is pulled out from the supporting claw 307 by the moving roller 304 to carry it.  Meanwhile, at setting the documents, the supporting claw 307 is set on the second position, and the documents inserted in the arrow mark are easily put in the supporting claw 307.
Patent JP-S60239775-A (JP)
Title: Developer recovering device
Inventor: ICHIKAWA HIDEO
IPC: G03G15/08
Filed: 1984-05-15
Abstract: PURPOSE:To store a dropped developer in a recovering bottle easily by providing a catch pan, which has a width larger than a developer discharge exit of a developing device and has a recessed inclined receiving surface and has the peripheral edge part of the receiving surface contricted toward one position, and a developer recovering vessel which has an aperture part larger than the terminal of the constricted part. CONSTITUTION:A recovering bottlle 4 is so placed that its mouth is matched with the constricted terminal part of a catch pan 3, and a developing machine 1 is moved to a recovery position and is set, and a developer discharge exit 2 in the lower part of the machine 1 is opened. The developer discharged from the discharge exit 2 is dropped temporarily on a receiving surface 7 of the catch pan 3 and is slid on the receiving surface 7 toward the constricted part and is dropped into the recovering bottle 4 from an aperture 5 of the constricted terminal part of the receiving surface 7. The developer dropped onto the center part of the receiving surface 7 is slid toward the constricted part as it is, and the developer dropped onto the peripheral part is slid along the edge of the receiving surface 7. Thus, all of the developer dropped onto the receiving surface 7 is gathered to the constricted terminal part and is stored from the aperture 5 into the recovering bottle 4.
Patent JP-S5620789-A (JP)
Title: Gear pump
Inventor: KIMOTO TADAO
IPC: F04C2/14
Filed: 1979-07-26
Abstract: PURPOSE: To prevent fluid from being leaked from an excision surface and improve pump efficiency by introducing the exhaust fluid to a gap between a reverse part of the excision surfaces in which a pair of metal peripheries are excised to each other and press-welding a pair of metals to each other.  
     CONSTITUTION: A pair of metals 5 and 6 form each cylindrical peripheral surface and a part of these peripheries are excised by the surface which is parallel to an axial center. Those excision surfaces 9 and 10 are made contact to each other and fit in the metal fitting holes 12 and 13 of a casing 11. Gears 1 and 2 revolve toward an arrow and fluid is sent to an exhaust outlet 15 from a suction inlet 14. Gaps 5 and 6 are provided between the reverse parts 18a and 19a of the excision surfaces 9 and 10 for the peripheries 18 and 19 of the metals 5 and 6 and the walls for the metal fitting holes 12 and 13 of the casing 11. By making the discharge fluid flow in these gaps 16 and 17, the metals 5 and 6 are pushed to each other and the fluid is prevented from being leaked from the excision surfaces 9 and 10. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-S6122173-A (JP)
Inventor: KURARENSU SHII KURAAKU
IPC: F25D21/08
Filed: 1985-05-07
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H02273917-A (JP)
Title: Method of growing crystal of carbon doped iii-v compound semiconductor
Inventor: HOSHINO MASATAKA
IPC: H01L21/205
Filed: 1989-04-14
Abstract: PURPOSE:To enable the stable carbon doping process not affected by reaction temperature to be performed by a method wherein a material of a methylated group V element coupled with a group III element is used as an impurity source to perform an organic metal vapor growth process. CONSTITUTION:The organic metallic vapor deposition process is performed using a material 3 of a methylated group V element coupled with a group III element as an impurity source. In an OMVPE of III-V compound semiconductor, when carbon doping is performed using trimethylarsine(TMAs) only as an impurity, if the deposition temperature is raised, TMAs is thermal-cracked to discharge the methyl group as the source of carbon mixation resultantly reducing the doping amount rapidly. However, when a coordination compound produced by mixing TMAs triethyl gallium(TEG) is used, a material containing methyl group stable up to relatively high temperature is produced. Through these procedures, by using such a material, the stable carbon doping process wherein the doping amount is not affected by the change in the deposition temperature can be performed.
Patent JP-H02273961-A (JP)
Title: Lead frame and hybrid integrated circuit using same
Inventor: TOSHIMA HIROAKI
IPC: H01L23/50
Filed: 1989-04-14
Abstract: PURPOSE:To simply connect conductor wiring of both sides of a circuit chip without using through holes, by providing a lead frame with lead inner terminals. CONSTITUTION:For a lead frame 3, a copper alloy thin plate of, e.g. 0.1mm in thickness is used. A lead inner terminal 4 has an H-type shape wherein two adjacent inner lead terminals 4a, 4b are shorted by a short bar different from a tie bar 5. A stages 6 is used for the die bonding of a circuit chip 1, and divided into four segments in order to avoid the contact of mounting parts of the rear. In this case, conductor wirings 8 on both sides are connected by using two bonding wires 7 and the lead inner terminal 4 of the lead frame, so that it is not necessary to form through holes.
Patent JP-H05160577-A (JP)
Title: Case in which printed board is mounted
Inventor: TAKANO MISAO
IPC: H05K5/02
Filed: 1991-04-25
Abstract: PURPOSE:To prevent reduction in the reliability of a case with a mounting printed board incorporated therein and reduction in the productivity of the case due to the identification error of the product in the case where the mounting printed board, which is incorporated in the interior of the case, differs slight from others, but the case is entirely the same as the other cases and can not be identified apparently. CONSTITUTION:A piece of goods 10 is manufactured by mounting electronic parts 22 on a printed board 21 and incorporating a mounting printed board 20 with model-identification marks 23, 24, 25 in a case 11. A window 11a for viewing the mark 23 is provided in the case at a place facing the mark 23 so as to view the mark 23.
Patent JP-S59221351-A (JP)
Title: Phenolic resin molding material
Inventor: NAGATA TSUTOMU
IPC: C08L61/04
Filed: 1983-06-01
Abstract: PURPOSE:To obtain the titled molding material having improved and balanced heat resistance, mechanical strength, abrasion resistance, and electrical characteristics, by compounding glass fiber, natural organic fiber and boron nitride to a resin. CONSTITUTION:(A) A resin selected from phenolic resin, xylene resin and xylene- modified phenolic resin is compounded with (B) 5-40wt%, preferably 15- 25wt%, based on the whole material, of glass fiber, (C) 5-30wt%, preferably 8- 20wt% of natural organic fiber, and (D) 1-30wt% of boron nitride.
Patent JP-S57211258-A (JP)
Title: Cooling device for semiconductor device
Inventor: NISHIMURA ISAO
IPC: H05K7/20
Filed: 1981-06-23
Abstract: PURPOSE:To obtain sufficient cooling effect without giving concentrated stress by a  method wherein the bottom face of the bag type container with sealed liquid type  refrigerant is partially formed by the material which can be formed into a rigid body,  and the rigid part is contacted to the back side of chips. CONSTITUTION:Small plates 7a, which were hardened by mixing Al powder with Si rubber, are arranged on a rest D, the clearance between the plates is buried by pouring Si rubber into it, the plates are peeled off the rest D after hardening, they are  pressed to the prescribed thickness, and a film 5b is formed. Si rubber film 5a is superposed on the above, and the bag type container 5 is formed by adhering the circumference, and a copper pipe 8 is arranged in such a manner that it makes a zigzag line  in the bag. The circumference of the bag 5 is pinched between Al frames 11 and 12,  tightened by a bolt 13 and the bag 5 is covered from above a substrate 1. When a  proper quantity of pure water 6 is poured 10 into the bag and the bag is maintained in a freely transformable state, the bag 5 hangs down due to the weight of the pure  water, the rigid body 7 comes in contact with the corresponding chips 2 lightly and  uniformly under the prescribed pressure without allowing the generation of transformation and the concentrated stress. Also, since the thermal resistance can be maintained  at a sufficiently low level, a satisfactory cooling effect can be obtained without characteristic deterioration and breakdown on the semiconductor device.
Patent JP-S62259667-A (JP)
Title: Soldering device
Inventor: HONMA KAZUYA
IPC: H05K3/34
Filed: 1986-04-24
Abstract: PURPOSE:To reduce the production cost of a product by providing the soldering mechanism of the body to be joined and arranging the monitoring mechanism to form the video of the soldering part by enlarging it. CONSTITUTION:A soldering device is composed of the monitor 12 as the video display means of the device main body 10 and soldering part, and the right and left robots 11A, 11B movable in X axial direction are arranged on a panel face step part 10B. A soldering mechanism 44 and TV camera 46 for image pickup are then arranged on the subarm of the robot 11A side and a joining body transportation and holding mechanism 48 is equipped on the sub-arm of the robot 11B side. The mechanism 48 moves based on the program, carrying a parts (joining body) 112 to the prescribed position of a substrate (the body to be joined) 114 and performing a soldering automatically with the mechanism 44 with monitoring by the picture face of the monitor 12. In this way the waste of the working time, material etc., can be eliminated and the production cost of the product is reduced.
Patent JP-S60239808-A (JP)
Title: Displaying method of hole shape
Inventor: KISHI HAJIME
IPC: G05B19/4069
Filed: 1984-05-14
Abstract: PURPOSE:To grasp the advancing degree of hole working visually by displaying a hole working shape worked before a working process and the one worked in the working process on the same display area so as to discriminate them. CONSTITUTION:When a center drilling work process is specified and a center drill to be used and the depth of the hole are inputted, the shape of the center drill, the hole working shape worked up to the preworking process, the working hole shape to be worked and a hole working shape worked up to the working process are displayed in areas DA2, DA3, DA4 respectively as the whole pattern. When a drilling work process is specified and the drill and the depth of a hole are inputted, the drill shape, a whole working shape due to the center drill, a hole working shape worked by the drill, and a hole working shape worked by the center drill and drilling are respectively displayed on the areas DA1-DA4.
Patent JP-H09256617-A (JP)
Title: Structure of closet
Inventor: OITA SHOICHI
IPC: E04F19/08
Filed: 1996-03-25
Abstract: PROBLEM TO BE SOLVED: To quickly and easily install a household Buddhist atlar in a closet without newly installing a Buddhist altar room at another place, and also by only moving back and forth a fixing intermediate shelf. SOLUTION: A closet is provided with a surrounding wall surface part 4 consisting of an upper horizontal board part 1, a pair of right and left vertical wall parts 2, 2, and a floor part 3; a fixed intermediate shelf 6 whose one end 5 has been fixed to the vertical wall part 2 on one side and which has a width dimension A nearly equal to the half of the width dimension W of the closet; a movable intermediate shelf 8 that has been fitted to the other end 7 of the fixed intermediate shelf 6 so as to be vertically and horizontally movable, and that is detachably supported by the vertical wall part 2 on the other side; and closet parts 9, 9 that have been formed so as to be partitioned by the surrounding wall surface part 4, the fixed intermediate shelf 6, and the movable intermediate shelf 8.  In the vertical condition of the movable intermediate shelf 8, the movable intermediate shelf 8 becomes the partition wall part, and also the closet parts 9, 9 are partitioned by the partition wall part to form a household Buddhist altar housing recessed part.
Patent JP-H08269655-A (JP)
Title: Hydrogen storage alloy and hydrogen storage alloy electrode
Inventor: TSUKAHARA MAKOTO
IPC: C22C27/02
Filed: 1995-03-28
Abstract: PURPOSE: To produce a hydrogen storage alloy having superior hydrogen occluding characteristics, excellent in corrosion resistance and having high durability and to obtain a hydrogen storage alloy electrode contg. the superior hydrogen storage alloy. CONSTITUTION: A Ti-V solid soln. alloy is produced by depositing a 2nd phase consisting essentially of Ti and Ni and having a three-dimensional network structure in a matrix having hydrogen occluding function. The alloy is then heated preferably at 700-1,250 deg.C.
Patent JP-H0636835-A (JP)
Title: Electric connector
Inventor: YOHAN HENDORITSUKU PAURU BAUKU
IPC: H01R12/72
Filed: 1993-04-22
Abstract: PURPOSE: To facilitate positioning of connector connection pins for protecting them by preventing move of a body extended between the connection pins at more than one parts of the body. CONSTITUTION: Connection ends 10 of connection pins 6-9 are connected to a terminal pad 24 of a printed circuit board 21 through an aperture 20 by a solder joint 23. A holding pin 12 of a housing 1 is inserted into a through aperture 26, and a fixing head 25 is upset. At this time, a body 15 is pushed in directions of the pins 6-9, and a bottom part 6 is held apart from the board 21 by spacers 27, 28. With the body 15, the connection ends 10 are held at a pitch corresponding to a mutual pitch distance of the apertures 22 in the board 21. Assemblage on the board 21 is thus simplified.
Patent JP-H0692275-A (JP)
Title: Method and device for mounting molding material to edge of vehicle body frame
Inventor: JIERAARU MESUNERU
IPC: B60J10/00
Filed: 1991-04-02
Abstract: PURPOSE: To attach a U-shaped profile comprising a nonductile metal reinforcement which is covered with elastic covering material and undeformable over time under the stress of the elastic covering material. CONSTITUTION: A profile 1 whose length is approximately equal to that of a body frame 2 to which the profile 1 is attached. The predetermined and possibly marked part of the profile is initially fastened in position at a predetermined and possibly marked location 4 of the rim of the body frame. Subsequently, with the aid of a vibrating flexible-headed mallet 7 driven in alternating striking movement, the profile is applied continuously against the rim of the body frame starting from the predetermined location 4 as far as one end of the profile and then, starting from the predetermined location, as far as the other end of the profile.
Patent JP-H10278926-A (JP)
Title: Manufacture of packaging container
Inventor: KASAKURA YOSHIMASA
IPC: B65D5/56
Filed: 1997-04-01
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a packaging container wherein a water-impermeable film can be extremely easily brought into tight contact with an internal face of a paper container. SOLUTION: A blank is formed by punching a paperboard into a predetermined shape, or a container of a predetermined shape is formed by pulp molding, and the blank is tightly placed in a mold. Then a film 19 is placed on an upper face of the blank placed in the mold. The film 19 is sucked by a vacuum pump 18 from below the mold, and an end rim of the film 19 attached to a surface of the blank is treated.
Patent JP-S5321903-A (JP)
Title: Preparation of magnetic disc substrate
Inventor: HAYASHI TADAO
IPC: G11B5/73
Filed: 1976-08-11
Abstract: PURPOSE: To improve flatness of a magnetic film, using an almite treated substrate, by filling cavities present on the almite treated surface with a resin. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-S62254443-A (JP)
Title: Probing unit for semiconductor device
Inventor: BABA TAKAYUKI
IPC: H01L21/66
Filed: 1986-04-28
Abstract: PURPOSE:To perform a uniform heating by a method wherein a plate material having a light-screening property and electrical conductivity is used as a material-placing stand, an inflared-ray emitting heat source provided with a reflection plate is arranged on the rear surface of the material stand leaving a prescribed distance, and the mate rial stand is heated up. CONSTITUTION:A material stand 3 is provided in a fixed manner on the measuring part 1 of a probing device through the intermediary of an insulating material 2, a wafer 4 is placed on the material-placing stand 3, a measuring head 5 is shifted along the surface of the wafer 4, a measuring needle 6 is contacted to the prescribed part of the device, and a measurement is conducted. A heater case 7 is provided on the rear side of the surface, where the wafer 4 is placed, of the material stand 3, the electric heater such as a halogen lamp 8 and the like which emits inflared rays and the like is provided, and a reflection plate 9 formed in a paraboloid is provided. As the radiant quantity of the inflared rays of the halogen lamp 8 can be controlled at an arbitrary level by increasing or decreasing the voltage to be applied, the surface temperature of the material-placing stand 3 can be maintained at the desired value. As a result, the effect of the electrical noise for the characteristic measuring value of the semiconductor device can be reduced.
Patent JP-S58211439-A (JP)
Inventor: OOTA HIDEO
IPC: B31B21/60
Filed: 1982-06-03
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H04325853-A (JP)
Title: Rotor of ac generator for vehicle
Inventor: CHIBA MICHIHARU
IPC: H02K5/24
Filed: 1991-04-26
Abstract: PURPOSE:To provide a rotor of an AC generator for a vehicle at a low cost which exhibits excellent vibro-isolating effect for the pawl-shaped magnetic pole of a pole core. CONSTITUTION:A rotor is constituted of a pair of pole cores 2, 3 having a pawl-shaped magnetic pole, field coil 6 wound on a bobbin 5 and a vibro- isolating member 7, having permeability of varnish, closely attached by providing a tightening margine between an internal side of the pawl-shaped magnetic pole and an external periphery of the field coil 6. The pawl-shaped magnetic pole, vibro-isolating member and the field coil are firmly secured by the varnish. Accordingly, a noise generated by resonance can be reduced.