baber/WOPTO huggingface dataset:
Patent TW-201713150-A (TW)
Title: Methods and apparatus for reducing handover signaling during wireless communication procedures
Inventor: SHUKAIR MUTAZ ZUHIER AFIF
IPC: H04W74/08
Filed: 2016-08-19
Abstract: Methods and apparatuses for wireless communications are disclosed. For example, one method includes detecting a procedure and determining the procedure is a qualifying procedure. The method further includes detecting one or more handover events indicative of handover procedures, where the handover procedures interfere with the execution of the qualifying procedure. The method also includes comparing a radio frequency condition of the communication between a user equipment and a source access point with a threshold value based on the radio frequency condition and delaying handover procedures for a predefined time based on the comparison, wherein the delaying of the handover procedures occurs when the detected procedure is the qualifying procedure and when the radio frequency condition satisfies a threshold that is based on the threshold value.
Patent TW-201807510-A (TW)
Title: Double-layered micro-lens array optical device which generally comprises a substrate having a surface on which a plurality of pinhole structures arranged in an array and two surfaces of the substrate are each provided with an optical micro-lens array
Inventor: Li yong-chun
IPC: G02B27/46
Filed: 2016-08-25
Abstract: The present invention relates to a double-layered micro-lens array optical device, which generally comprises a substrate having a surface on which a plurality of pinhole structures arranged in an array and two surfaces of the substrate are each provided with an optical micro-lens array. The micro-lens arrays both comprise a plurality aspheric micro-lenses respectively corresponding, in position, to the pinhole structures. To use the double-layered micro-lens array optical device of the present invention, ultraviolet light refracted by a Digital Mirror Device (DMD) chip are focused onto the position of each pinhole structure by the plurality aspheric micro-lenses of the optical micro-lens array on one surface of the substrate to form a tiny light spot. The light spot passes through the pinhole structure and diverge. Then, the plurality of aspheric micro-lenses of the optical micro-lens array on the other surface of the substrate again makes the light beam on a focus plane to obtain a light spot of an extremely small circular point that approaches physical diffraction limit. A light spot array so formed is applicable to mask-free scanning or direct writing exposure photolithographic processes.
Patent TW-201728028-A (TW)
Title: Connector detachment prevention device
Inventor: WATANABE SHINTARO
IPC: F16L3/08
Filed: 2016-09-07
Abstract: To provide a connector detachment prevention device which prevents detachment of a cable having no auxiliary mechanism when the cable is connected to an electronic device. The connector detachment prevention device includes: a base on which an electronic device is mounted; a support portion disposed in a direction substantially perpendicular to a placement surface of the base on which the electronic device is mounted; holding means slidably provided at the support portion for holding a cable connected to the electronic device in a state of maintaining the insertion/removal direction thereof; and fixing means for fixing the holding means at a predetermined position on the support portion.
Patent TW-201727718-A (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: NAKANISHI SHO
IPC: H01L21/28
Filed: 2016-09-30
Abstract: A performance of a semiconductor device including an RC-IGBT is improved. An AlNiSi layer (a layer containing aluminum (Al), nickel (Ni), and silicon (Si)) is formed between a back surface of a semiconductor substrate and a back surface electrode. Thus, a favorable ohmic junction can be obtained between the back surface electrode and an N+-type layer constituting a cathode region in an embedded diode, and a favorable ohmic junction can be obtained between the back surface electrode and a P-type layer constituting a collector region in an IGBT. The AlNiSi layer contains 10 at % or more of each of the aluminum (Al), the nickel (Ni), and the silicon (Si).
Patent TW-201725050-A (TW)
Title: Anti-cancer vaccine combination
Inventor: LEE HUEI
IPC: A61K35/74
Filed: 2016-10-11
Abstract: The invention relates to an anti-cancer vaccine combination. Particularly, the invention relates to a pharmaceutical combination comprising a PD-L1/PD-1 expression inhibitor in combination with a viral antigen-associated vaccine.
Patent TW-201722446-A (TW)
Title: Antiallergic agent for infants
Inventor: KOSHIDA Shigeki
IPC: A61K35/745
Filed: 2016-10-19
Abstract: The present invention provides an antiallergic agent which has no side effects, and which improves allergic diseases of infants, particularly newly born infants. The present invention is related to an antiallergic agent for infants which includes bifidobacteria.
Patent TW-201730970-A (TW)
Title: Low-defect graphene-based devices & interconnects
Inventor: ZIMMERMAN PAUL
IPC: H01L21/331
Filed: 2016-11-10
Abstract: Molecular Graphene (MG) of a physical size and bonding character that render the molecule suitable as a channel material in an electronic device, such as a tunnel field effect transistor (TFET). The molecular graphene may be a large polycyclic aromatic hydrocarbon (PAH) employed as a discrete element, or as a repeat unit, within an active or passive electronic device. In some embodiments, a functionalized PAH is disposed over a substrate surface and extending between a plurality of through-substrate vias. Heterogeneous surfaces on the substrate are employed to direct deposition of the functionalized PAH molecule to surface sites interstitial to the array of vias. Vias may be backfilled with conductive material as self-aligned source/drain contacts. Directed self-assembly techniques may be employed to form local interconnect lines coupled to the conductive via material. In some embodiments, graphene-based interconnects comprising a linear array of PAH molecules are formed over a substrate.
Patent TW-201732549-A (TW)
Title: Instruction and logic for compression and rotation
Inventor: OULD-AHMED-VALL ELMOUSTAPHA
IPC: G06F9/30
Filed: 2016-11-17
Abstract: A processor includes an execution unit to execute an instruction. The execution unit includes logic to compress a plurality of masked elements from a source vector to a destination vector. The execution unit also includes logic to place the masked elements into the destination vector at a rotatable index within the destination vector. The rotatable index is to indicate an offset created by elements previously entered into the destination vector. The execution unit further includes logic to determine whether compression of the plurality of masked elements will cause the rotatable index to exceed a size of the destination vector. The execution unit also includes logic to reset the rotatable index with respect to the beginning of the destination vector to compress at least one of the plurality of masked elements relative to the beginning of the destination vector.
Patent TW-201731166-A (TW)
Title: Helical antenna for wireless microphone and method for the same
Inventor: ZACHARA CHRISTOPHER
IPC: H04B7/005
Filed: 2016-11-18
Abstract: Embodiments include an antenna assembly for a wireless microphone, comprising a helical antenna including a feed point and at least one contact pin coupling the feed point to the wireless microphone. The helical antenna is configured for operation in first and second frequency bands. Embodiments also include a wireless microphone comprising a main body having top and bottom ends and an antenna assembly coupled to the bottom end. The antenna assembly comprises a helical antenna configured to transmit and receive wireless signals, an inner core configured to support the helical antenna on an outer surface of the inner core, and an outer shell formed over the inner core and the helical antenna. Embodiments further include a method of manufacturing an antenna assembly for a wireless microphone using a first manufacturing process to form a core unit of the antenna assembly and a second manufacturing process to form an overmold.
Patent TW-201740623-A (TW)
Title: Anisotropic conductive film
Inventor: SHINOHARA SEIICHIRO
IPC: G01N21/892
Filed: 2016-11-24
Abstract: An anisotropic conductive film (1A) having a conductive particle dispersed layer (4), in which conductive particles (3) are dispersed in an insulating adhesive (2) in a prescribed dispersed state, is provided with a defective portion presentation means (mark Q) for presenting positional information about a defective portion (P) of the conductive particles (3) in the dispersed state. In a method for sticking the anisotropic conductive film (1A) to an electronic component (100), a nondefective portion of the anisotropic conductive film (1A) is stuck to an area where a terminal or a terminal row is present in the electronic component to be connected in an anisotropically conductive manner, on the basis of the positional information about the defective portion (P) obtained from the defective portion presentation means (mark Q).
Patent TW-201819974-A (TW)
Title: Photographing lens assembly, image capturing unit and electronic device
Inventor: TSENG YU-TAI
IPC: G02B9/60
Filed: 2016-11-24
Abstract: A photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has an object-side surface being concave in a paraxial region thereof. The third lens element has an object-side surface being convex in a paraxial region thereof. The fourth lens element has an object-side surface being concave in a paraxial region thereof, wherein the object-side surface and an image-side surface thereof are both aspheric. The fifth lens element has an object-side surface and an image-side surface being both aspheric. The photographing lens assembly has a total of five lens elements. Among all surfaces of the lens elements of the photographing lens assembly, at least one surface has at least one inflection point. When specific conditions are satisfied, the photographing lens assembly is favorable for satisfying the requirements of compact size, telephoto characteristic and high image quality, simultaneously.
Patent TW-201724300-A (TW)
Title: Semiconductor structures and manufacturing methods and apparatus thereof
Inventor: LIN HSIANG-WEI
IPC: H01L23/522
Filed: 2016-12-22
Abstract: The present disclosure provides a method of fabricating a semiconductor structure in accordance with some embodiments. The method includes forming a first low-k dielectric layer over a substrate; forming a first and second metal features in the first low-k dielectric layer; forming a first trench in the first low-k dielectric layer, the first trench spanning between the first and second metal features; performing a ultraviolet (UV) treatment to sidewalls of the first low-k dielectric layer in the first trench; forming a first etch stop layer in the first trench; and depositing a second low-k dielectric layer on the first etch stop layer, thereby forming an air gap in the first trench.
Patent TW-201824199-A (TW)
Title: Intelligent monitoring system for school bus security
Inventor: TSENG CHIEN-HSUN
IPC: G08B25/01
Filed: 2016-12-28
Abstract: The invention relates to an intelligent monitoring system for school bus security. Primarily, a vehicle loading system is equipped within a school bus. A user identification unit is carried by a school child. The user identification unit can be wirelessly sensed by a vehicle identification unit of the vehicle loading system. A first camera is used for shooting the driving condition of a driver on the driver's seat. A second camera is used for shooting the condition within the vehicle. A global position system (GPS) is used for conducting satellite positioning on the driving route of the school bus. An environmental sensing module is used for detecting possible hazards in the school bus and issuing an alarm in advance. An intelligent terminal device is used for connecting with a wireless signal transceiver unit of the vehicle loading system to obtain the information of the vehicle loading system. Thereby it can not only effectively monitor the condition that the school children go on and get off the school bus but also clearly learn the condition within the school bus and the driving route. Accordingly, the process that school children go on and get off the school bus can be more secure. Thus parents are more at ease, so as to increase the practicality and efficiency for the whole implementation.
Patent TW-201800865-A (TW)
Title: Mask manufacturing apparatus
Inventor: YONEZAWA MAKOTO
IPC: G03F7/20
Filed: 2017-03-01
Abstract: To prevent deflection of a mask held in a horizontal direction, and move the mask in the horizontal direction without changing the height of the mask. A mask is mounted on a first plane of a mask holding part 41 having a horizontal first plane on which a plurality of air holes discharging air upward are two-dimensionally arrayed. The planar part is mounted on a plurality of first rails having the same height which are fixed on a top face of a surface plate 11 along a first direction, and forms an air layer between the planar part and the first rails by discharging air toward the first rails. The planar part moves in the first direction along top faces of the first rails. The mask holding part is mounted on a plurality of second rails having the same height which are fixed on a top face of the planar part along a second direction, and forms an air layer between the mask holding part and the second rails by discharging air toward the second rails. The mask holding part moves in the second direction along the top face of the second rails.
Patent TW-201802391-A (TW)
Title: Planar light emitting module and lighting device
Inventor: KINOSHITA SEIJI
IPC: F21Y115/10
Filed: 2017-03-07
Abstract: The present invention suppresses glare occurring in a planar light-emitting module provided with a side-surface-light-receiving-type light guide body. The present invention is a planar light-emitting module provided with a light guide body (20) and light sources (30a-d). The light guide body 20 forms a plate shape having a light-receiving surface (21a), a deflection surface (22), and a light-emitting surface (23). The light sources (30a-d) form rows at a prescribed interval in a direction parallel to the deflection surface. The deflection surface has a plurality of grooves (25a-d) that run parallel to each other. The grooves (25a-d) are disposed in sequence in a direction moving from near the light-receiving surface to farther away from the light-receiving surface. The grooves (25a-d) meander smoothly when the plate shape is viewed in plan view. The phases of the meandering between the plurality of grooves (25a-d) are irregularly displaced from each other. In a cross-section that is parallel to the normal line of the light-receiving surface and the normal line of a reference plane (27) in which the plate shape widens, the inclination angle formed by the tangent of the contour line of the grooves (25a-d) in relation to the reference plane (27) becomes smaller monotonically as the depths within the grooves (25a-d) increase. The inclination angle changes smoothly in accordance with the depth.
Patent TW-201833385-A (TW)
Title: Flexible light-emitting apparatus and method of fabricating the same
Inventor: HO HSIN-CHENG
IPC: H05K3/34
Filed: 2017-03-09
Abstract: The invention discloses a flexible light-emitting apparatus and a method of fabricating the same. The flexible light-emitting apparatus according to the invention includes a polymer substrate, a circuit and at least one packed light-emitting diode device. The circuit includes a chemical-plating catalytic oil layer overlaid on a deposition area and a first metal layer which is deposited on the chemical plating catalytic oil layer. The circuit includes at least one pair of leads. Each packed light-emitting diode device corresponds one of the at least one pair of leads, and includes a pair of pins. Each packed light-emitting diode is mounted on the polymer substrate, is via the pair of pins thereof electrically connected to the corresponding pair of leads.
Patent TW-201828427-A (TW)
Title: Conductive connection structure
Inventor: LIN PO-CHUN
IPC: H01L23/42
Filed: 2017-03-09
Abstract: A conductive connection structure includes a semiconductor substrate, a conductive pillar, and a stress buffer layer. The conductive pillar is in the semiconductor substrate. The stress buffer layer is between the semiconductor substrate and the conductive pillar. The conductive pillar has a protruding portion penetrating through the stress buffer layer.
Patent TW-201737670-A (TW)
Title: Driver circuit
Inventor: ALI TAMER MOHAMMED
IPC: H04L25/02
Filed: 2017-03-14
Abstract: The present invention provides a driver circuit comprising a first transistor, a second transistor, a third transistor, a fourth transistor, a first driving stage and a second driving stage. The first transistor has a first control terminal and a first output terminal, and the second transistor has a second control terminal and a second output terminal, and the third transistor has a third output terminal coupled to the first output terminal, and the fourth transistor has a fourth output terminal coupled to the second output terminal. The first driving stage is connected to the first control terminal, and the first driving stage comprises a first driver having a first speed and a second driver having a second speed slower than the first speed. The second driving stage is connected to the second control terminal, and the second driving stage comprises a third driver and a fourth driver, wherein the third driver has a third speed and a fourth driver has a fourth speed slower than the third speed.
Patent TW-201835729-A (TW)
Title: Mouse
Inventor: Zhang shi-jie
IPC: G06F3/0354
Filed: 2017-03-24
Abstract: The present invention discloses a mouse includes a housing, a circuit board, a first sensing module, a second sensing module and a switch module. The circuit board is disposed in the housing, the first sensing module and the second sensing module are disposed on the circuit board and exposed to the housing partly. The switch module is exposed partly to a base of the housing, and makes at least one of the first sensing module and the second sensing module be exposed to the base such that the DPI of the mouse can be changed. The switch module is formed with simple mechanism, such that the DPI of the mouse can be changed by simple operation of the switch module.
Patent TW-201826364-A (TW)
Title: Adhesive film for processing semiconductor wafer
Inventor: KURIHARA HIROYOSHI
IPC: H01L21/66
Filed: 2017-03-24
Abstract: This adhesive film for semiconductor wafer processing is provided with a base material layer and a UV curable adhesive resin layer on one side of the base material layer, and is used in order to protect the surface of a semiconductor wafer or to fix the semiconductor wafer. Further, in this adhesive film, the adhesive resin layer includes a UV curable adhesive resin, and, after UV curing, has a 2.0 kV or lower saturated charge voltage V1, measured by the method below. A high-pressure mercury lamp in a 25 DEG C environment is used to irradiate and optically cure the adhesive resin layer with UV rays having a dominant wavelength of 365 nm, an irradiation intensity of 100 mW/cm2 and a UV dose of 1080 mJ/cm2. Subsequently, a voltage is applied to the surface of the adhesive resin layer for 30 seconds under the conditions of a 10 kV applied voltage, a 20 mm distance between the sample and electrode, 25 DEG C, and 50% RH, and the saturated charge voltage of the surface of the adhesive resin layer is calculated in conformity with JIS L1094.
Patent TW-201733753-A (TW)
Title: Linear extension and retraction mechanism, and robot arm mechanism
Inventor: YOON WOO-KEUN
IPC: B25J17/02
Filed: 2017-03-29
Abstract: The present invention improves the durability of a hinge part that couples together, in a bendable manner, pieces of a linear extension/retraction mechanism and a robot arm mechanism. The linear extension/retraction mechanism comprises: a plurality of first pieces (53) each of which has a plate-like shape and which are coupled together in a bendable manner through a first hinge part (300); and a plurality of second pieces (54) each of which has a U-shaped cross section or a rectangular cross section and which are coupled together, at the bottom surface side, in a bendable manner through a second hinge part (400). The first hinge part (300) includes: a cylindrical shaft (60); a shaft bearing part (533) provided at the rear or front end of each of the first pieces so as to protrude backward or forward; and a shaft support part (532) provided at the front or rear end of each of the first pieces so as to protrude forward or backward. The bearing part is provided with needle roller bearings (538-1, 538-2).
Patent TW-201816859-A (TW)
Title: Semiconductor device and method of forming the same
Inventor: LIAO CHIH-TENG
IPC: H01L21/283
Filed: 2017-04-20
Abstract: A method includes forming a dummy gate stack over a semiconductor region, forming a gate spacer on a sidewall of the dummy gate stack, removing the dummy gate stack to form an opening, forming a replacement gate stack in the opening, recessing the replacement gate stack to form a recess, filling the recess with a conductive material, and performing a planarization to remove excess portions of the conductive material over the gate spacer. A remaining portion of the conductive material forms a gate contact plug. A top portion of the gate contact plug is at a same level as a top portion of the first gate spacer.
Patent TW-201738517-A (TW)
Title: Refrigerator
Inventor: HAYASHI HIDETAKE
IPC: F25D13/00
Filed: 2017-04-24
Abstract: In this refrigerator 1, heat exchange of a refrigeration cycle 21 is carried out using a multiflow-type condenser 12 which comprises a flat pipe 14, which is formed in a flat shape and in which multiple flow paths are internally formed for circulating a refrigerant, and a header 13, which is the refrigerant inlet or the outlet into the flat pipe 14.
Patent TW-201839453-A (TW)
Title: Fixed focus lens
Inventor: LEE YEN-TE
IPC: G02B13/18
Filed: 2017-04-27
Abstract: A fixed focus lens comprising two lens groups separated by an aperture, the lens group close to the magnifying end comprising three lenses, the lens group close to the minifying end having four lenses. While in focusing process, the interval between the first lens group, the aperture and the second lens group is fixed and moves relative to the light valve along the optical axis as a whole. The first lens group and the second lens group has an aspherical lens respectively. The ratio of the back focal length (BFL equivalent in air) to the effective focal length of the fixed focus lens is greater than or equal to 1.3.
Patent TW-201729366-A (TW)
Title: Exposed, solderable heat spreader for integrated circuit packages
Inventor: OLSEN EDWARD WILLIAM
IPC: H01L23/34
Filed: 2015-07-24
Abstract: An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.