baber/WOPTO huggingface dataset:
Patent TW-202040921-A (TW)
Inventor: DHARMALINGGAM RAWINDER
IPC: H02M1/32
Filed: 2019-12-20
Abstract: An improved power converter produces power through a power switch in response to an activation signal that has an on-time and a switching frequency. An on-time signal has a constant on-time and controls the on-time of the activation signal. An error signal indicates that the switching frequency is not equal to a reference frequency. A step up signal and a step down signal are based on the error signal. A count signal is increased in response to the step up signal and decreased in response to the step down signal. An on-time pulse has a duration that is related to a value of the count signal. The on-time pulse controls the constant on-time of the on-time signal and maintains the switching frequency at about the reference frequency.
Patent TW-202033481-A (TW)
Title: Cyclobutene production method
Inventor: ETOU YUUSUKE
IPC: C07C17/25
Filed: 2019-12-25
Abstract: The purpose of the present invention is to produce cyclobutene containing a halogen atom with a high conversion ratio (yield) and high selectivity. This method, for producing the cyclobutene represented in general formula (1) (in the formula, X1, X2, X3 and X4 are the same or different, and represent a hydrogen atom, a halogen atom, or a perfluoroalkyl group. Y represents a halogen atom), involves a step for subjecting the cyclobutane represented by general formula (2) (in the formula, X1, X2, X3, X4 and Y are as described above. X5 and X6 are the same or different and represent a hydrogen atom, a halogen atom, or a perfluoroalkyl group) to a desorption reaction, wherein the desorption reaction step is performed in the presence of a base, in a closed reaction system, or, the desorption reaction step is performed with the reaction temperature greater than or equal to 20 DEG C, the reaction pressure greater than or equal to 0 kPa, and in the presence of a base.
Patent TW-202026610-A (TW)
Inventor: CHU HSIU-FENG
IPC: G01L3/22
Filed: 2019-01-10
Abstract: A torque sensing and transmitting device is provided. The device comprises a transmission body, two inner casings, two outer casings, a first circuit board module and a battery module. The two inner casings are disposed on a shaft of the transmission body, and a vibration damping member is disposed between the inner casing and the shaft. The first circuit board module is disposed on one of the two inner casings, and the first circuit board module is covered by a vibration damping layer. The battery module is disposed on the other inner casing, and the battery module is covered by a vibration damping layer. By the arrangement of the vibration damping member and the vibration damping layer, the device improves the problem that electronic components of the first circuit board module and the battery module are damaged caused by vibration.
Patent TW-202127046-A (TW)
Title: Electronic component inspection method and electronic component inspection device capable of inspecting the appearance of each surface of the electronic component without turning over the electronic component
Inventor: Chen rui-ming
IPC: G01R31/01
Filed: 2019-12-31
Abstract: An electronic component inspection method is used for inspecting electronic components on a carrier plate. The electronic component has a first surface, a second surface and a side peripheral surface. The inspection method includes: providing a conveying flow path for conveying the carrier plate carrying the electronic component along a conveying direction; providing an inspection mechanism including a first inspection unit, a second inspection unit and a third inspection unit for inspecting the electronic component; and conveying the carrier plate which carries the electronic component with the first surface facing upward in the conveying flow path, and using the first, second, and third inspection units to perform inspection on the first, second and side peripheral surfaces of the electronic component. In the present invention, the appearance of each surface of the electronic component can be inspected without turning over the electronic component. The present invention further provides an inspection device for inspecting electronic components.
Patent TW-202021016-A (TW)
Title: Load port and EFEM
Inventor: OCHIAI MITSUTOSHI
IPC: H01L21/677
Filed: 2014-11-11
Abstract: The purpose of the present invention is to provide a load port capable of increasing airtightness inside an EFEM, reducing the supplied amount of gas used for the EFEM and improving the quality of a wafer. The load port is installed near a wafer conveying chamber (2) to conduct the entry and exit of a wafer (W) between the wafer conveying chamber (2) and an FOUP (7). The load port comprises: a panel (31) constituting a part of the wall surface of the wafer conveying chamber (2) and having an opening (42) formed to open the wafer conveying chamber (2); a door part (61) for opening and closing the opening (42); a loading stand (34) for loading an FOUP (7) to be able to move to and from the panel (31) so that a cover part (72) for opening and closing an inner space (Sf) can face the door part (61); an O-ring (44) installed at the side of the loading stand (34) of the panel (31) along the periphery of the opening (42), wherein the O-ring (44) is in elastic contact with the vicinity of the cover part (72) in the FOUP (7) by moving the loading stand (34) toward the panel (31).
Patent TW-202129641-A (TW)
Title: Serial data processing device and data offset calibration method
Inventor: LIN KUO-CHAO
IPC: H04B1/40
Filed: 2020-01-21
Abstract: A serial data processing device includes an offset detector circuit and an offset calibration circuit. The offset detector circuit is configured to store tokens, and to receive a first data signal from a host device and to detect an offset of the received first data signal according to the tokens to generate an amendment signal, in which each of the tokens includes at least one predetermined logic value, and a number of the at least one predetermined logic value in each of the tokens are different from each other. The offset calibration circuit is configured to correct the received first data signal according to the amendment signal, in order to generate a second data signal.
Patent TW-202031824-A (TW)
Inventor: SHI XIAOBO
IPC: C09K3/14
Filed: 2020-01-22
Abstract: Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic metal oxide particles, such as ceria-coated silica; and dual chemical additives for providing the tunable oxide film removal rates and tunable SiN film removal rates. Chemical additives comprise at least one nitrogen-containing aromatic heterocyclic compound and at least one non-ionic organic molecule having more than one hydroxyl functional group organic.
Patent TW-202111932-A (TW)
Title: Semiconductor memory device and method of manufacturing the same
Inventor: OTA KENSUKE
IPC: H01L27/1157
Filed: 2020-02-03
Abstract: A semiconductor memory device comprising: a substrate; a plurality of conductive layers which are disposed in a first direction intersecting the substrate and extend in a second direction intersecting the first direction; a first semiconductor layer which extends in the first direction and faces the plurality of conductive layers; a memory portion which is provided between the first semiconductor layer and the plurality of conductive layers; and a drive circuit which drives the memory cell, wherein the plurality of conductive layers are provided in a first region where a plurality of the memory cells are disposed, a second region provided closer to an end portion of the plurality of conductive layers than the first region in the second direction, and a third region different from the first region and the second region, a portion positioned in the third region of the plurality of conductive layers is insulated from portions positioned in the first region and the second region of the plurality of conductive layers, the drive circuit is provided in the third region, and includes a second semiconductor layer which extends through the plurality of conductive layers in the first direction, and an insulating layer provided between the second semiconductor layer and the plurality of conductive layers, and one end of the second semiconductor layer is connected to the plurality of conductive layers in the second region through a wiring and the other end of the second semiconductor layer is connected to the substrate.
Patent TW-202130460-A (TW)
Title: Base seat used in polishing pad conditioning apparatus
Inventor: LEE CHIEN-SHU
IPC: H01L21/67
Filed: 2020-02-10
Abstract: The invention discloses a base seat used in a polishing pad conditioning apparatus including a flat annular conditioning device. The base seat includes a main disk, a secondary disk and an annular peripheral device. The main disk is formed of a first ceramic. The secondary disk is formed of a second ceramic. The annular peripheral device is formed of a polymer, and molded on a first circumferential edge of the main disk by an injection overmolding process. A first portion of the secondary disk is fitted and bonded inside a circular recess of the main disk. A second circumferential edge of the secondary disk, an inner wall of the annular peripheral device, and an upper surface of the main disk constitute an annular groove. A second portion of the flat annular conditioning device is capable of being fitted and bonded inside the annular groove.
Patent TW-202043455-A (TW)
Title: Enhancer of beneficial intestinal bacteria growth and organic acid production
Inventor: MAEDA AYAKO
IPC: A61P1/00
Filed: 2020-03-13
Abstract: The present invention addresses the problem of providing an agent that contains a novel Bifidobacterium longum and enhances beneficial intestinal bacteria growth and organic acid productivity. This problem is solved by an enhancer of beneficial intestinal bacteria growth and organic acid production, the enhancer being characterized by comprising Bifidobacterium longum.
Patent TW-202137813-A (TW)
Title: Driving device of light-emitting diode including a control unit, a first switch unit, and a first driving unit
Inventor: HUANG PING-KAI
IPC: H05B45/00
Filed: 2020-03-26
Abstract: A driving device includes a control unit, a first switch unit, and a first driving unit. The control unit generates a grayscale signal output and a synchronization signal. The first switch unit is electrically connected to a first light-emitting diode array, and is controlled by a first switching signal output to be turned on or off. The first driving unit receives the grayscale signal output and the synchronization signal, generates the first switching signal output according to an internal first clock signal and the synchronization signal, generates a plurality of first driving signal outputs according to the first clock signal, the grayscale signal output, and the synchronization signal, transmits the first switching signal output to the first switching unit, and transmits the first driving signal output to the first light-emitting diode array to drive the first light-emitting diode array.
Patent TW-202136673-A (TW)
Title: 具有遮擋板之裝置
Inventor: CHEN WEI-CHIEH
IPC: G06F1/16
Filed: 2020-03-30
Abstract: 一種具有遮擋板之裝置，包含一裝置殼體以及一遮擋板。裝置殼體包含一開孔。遮擋板包含一卡合件以及一鎖定件。鎖定件可於一鎖定位置以及一解鎖位置之間移動。當卡合件卡合於開孔中，且鎖定件位於鎖定位置時，鎖定件之一端部抵接於開孔之一邊緣，使得遮擋板固定於裝置殼體上。當鎖定件位於解鎖位置時，鎖定件之端部脫離開孔，使得遮擋板可帶動卡合件脫離開孔。
Patent TW-202045389-A (TW)
Title: Traveling vehicle system
Inventor: FUJIWARA HIDETOSHI
IPC: B61B13/00
Filed: 2020-04-01
Abstract: A traveling vehicle system (1) wherein a traveling vehicle (6) travels on a travel track (4), the travel track (4) having: a rail body part (40) which accommodates a traveling part (50) of the traveling vehicle (6) and extends along a travel route of the traveling vehicle (6); and a power supply part (40E) provided along the extending direction of the rail body part (40) to supply power to the traveling part (50). The traveling vehicle system (1) includes: a work track (41) which is provided so as to be continuous with the travel track (4), forms an open part (47) for exposing at least a part of the traveling part (50), and is not provided with a power supply part; and a moving mechanism (60) for moving the traveling vehicle (6) along the work track (41).
Patent TW-202105232-A (TW)
Title: Integrated circuit and method of generating the integrated circuit
Inventor: LI JIAN-SING
IPC: G06F30/392
Filed: 2020-04-10
Abstract: An integrated circuit includes a first cell and a second cell. The first cell with a first cell height along a first direction includes a first active region and a second active region that extend in a second direction different from the first direction. The first active region overlaps the second active region in a layout view. The second cell with a second cell height includes a first plurality of active regions and a second plurality of active regions. The first plurality of active regions and the second plurality of active regions extend in the second direction and the first plurality of active regions overlap the second plurality of active regions, respectively, in the layout view. The first cell abuts the second cell, and the first active region is aligned with one of the first plurality of active regions in the layout view.
Patent TW-202132777-A (TW)
Title: System and method for semiconductor wafer surface topography measurement
Inventor: Wang si-cong
IPC: G01Q30/04
Filed: 2020-04-14
Abstract: Examples of systems and methods for measuring the surface topography of semiconductor wafers are disclosed. In one example, a method for measuring the surface topography of a semiconductor wafer is disclosed. Multiple interference signals are received by at least one processor, and each interference signal corresponds to one corresponding position of multiple positions on the surface of the semiconductor wafer. Multiple interference signals are converted into multiple spectral signals by at least one processor, and each spectral signal corresponds to one corresponding position of multiple positions on the surface of the semiconductor wafer. A model is used by at least one processor to classify the spectral signals into multiple categories. Each of these categories corresponds to an area on the surface of the semiconductor wafer of the same material. The surface baseline and surface height offset of at least one of these categories is determined by at least one processor at least partially based on a calibration signal associated with an area of at least one category corresponding to the at least one of these categories. The surface topography of the semiconductor wafer is characterized by at least one processor at least partially based on the surface height offset and interference signals.
Patent TW-202143343-A (TW)
Title: Semiconductor package structure and manufacturing method thereof
Inventor: WANG JEFFREY ZHONG-QI
IPC: H01L21/60
Filed: 2020-04-30
Abstract: A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.
Patent TW-202142758-A (TW)
Title: Auxiliary for dyeing, manufacturing method thereof and dyeing process using the same capable of increasing the dyeing rate of the fabric during the dyeing process and reducing the dye residual rate in the subsequent produced wastewater
Inventor: Huang mao-quan
IPC: C07K14/78
Filed: 2020-05-11
Abstract: The present invention provides an auxiliary for dyeing, a manufacturing method thereof and a dyeing process using the same. Gelatin, tartaric acid, epichlorohydrin and sodium bisulfite are used as raw materials to react to synthesize a surfactant for hydrolyzed gelatin derivatives. By using the agglutinating properties of the auxiliary, the dye in the dyeing and finishing wastewater can be captured and brought into a cellulose fabric, in order to increase the dyeing rate of the fabric during the dyeing process and reduce the dye residual rate in the subsequent produced wastewater.
Patent TW-202121436-A (TW)
Inventor: MARKHAM KENNETH WADE
IPC: G21C5/10
Filed: 2020-05-15
Abstract: A securing device is installable on an outer circumferential surface of a nuclear reactor core shroud and in contact with an inner circumferential surface of a pressure vessel. The securing device includes a base configured for contacting the outer circumferential surface of the nuclear reactor core shroud. The securing device also includes a radial extender including an actuator, a stationary support section fixed to the base and a movable contact section. The radial extender is configured such that the movable contact section is movable along the stationary support section by the actuator to force the movable contact section radially into the inner circumferential surface of the pressure vessel.
Patent TW-202144130-A (TW)
Title: Dustproof structure of hand tool which not only prevents dust from entering the hand tool, but also allows access to the internal components of the hand tool without having to remove any component of the dustproof structure
Inventor: HSIEH CHIH-CHING
IPC: F16J15/34
Filed: 2020-05-20
Abstract: Provided is a dustproof structure of a hand tool, which includes: a tool body having a shank recessed therein with a through hole at a predetermined position of the shank; a dustproof component having flexibility and disposed at the through hole of the shank for being opened and closed, wherein the dustproof component closes the through hole when not subjected to an applied force and is elastically deformed to render the through hole into an open state when subjected to an applied force. Therefore, in normal conditions, the dustproof component may block foreign matter from entering the through hole. When the user desires to perform a lubricating or adjusting operation on the inside of the through hole of the hand tool, the operation may be carried out after directly applying a force to deform the dustproof portion without removing the dustproof component.
Patent TW-202147935-A (TW)
Title: Manufacturing method for continuous anisotropic conductive adhesive characterized in that the purpose of the conductive particle disposition based on the arrangement of the irradiation blocking point can be achieved
Inventor: Zhong cheng-lin
IPC: H05K1/18
Filed: 2020-06-11
Abstract: The present invention relates to a manufacturing method for continuous anisotropic conductive adhesive, which includes: the step of setting the release adhesive, the step of setting a grating, the step of irradiating ultraviolet light, the step of spreading the conductive particles, the step of removing surplus conductive particles, the step of adhering non-conductive adhesive film, the step of irradiating another UV light, the step of stripping the release adhesive and the step of adhering another non-conductive adhesive film, thereby manufacturing the continuous anisotropic conductivity adhesive. The grating including several irradiation blocking points is irradiated by the UV light; and the release adhesive with stickiness is irradiated by the UV light not blocked by the irradiation blocking points, so as to form an irradiation zone. The irradiation zone loses the stickiness after reaction time, and the remaining zone still has stickiness to adhere the conductive particles. Thereby, the purpose of the conductive particle disposition based on the arrangement of the irradiation blocking point can be achieved, and the continuous anisotropic conductivity adhesive can be formed and is very suitable for mass production.
Patent TW-202101664-A (TW)
Title: Processing device prevents the chuck platform from being installed incorrectly
Inventor: ARAKIDA HISASHI
IPC: H01L21/687
Filed: 2020-06-19
Abstract: The present invention provides a processing device that prevents the chuck platform from being installed incorrectly. The processing device (1) includes a chuck platform (10), a platform base (20), a processing unit (30), and a platform determining unit (40). The chuck platform (10) has a holding surface (13) for supporting the workpiece (100), and is detachably fixed to the platform base (20). The IC tag (17) that records the inherent information of the chuck platform (10) is fixed at the position on the chuck platform (10), at which position the IC tag (17) faces the reader (41) if the chuck platform (10) is installed on the platform base (20).The processing unit (30) processes the workpiece (100) supported on the chuck platform (10). The platform determination unit (40) is equipped with a reader (41) on the platform base (20) to read the inherent information of the chuck platform (10) from the IC tag (17), and determines the type of the chuck platform (10).
Patent TW-202111103-A (TW)
Title: Composition for removing metal residue and method for manufacturing a semiconductor device using the same
Inventor: YU JIN-HO
IPC: H01L21/02
Filed: 2020-06-30
Abstract: Provided are a detergent composition for removing metal residues and a method for manufacturing a semiconductor device using the same. According to the present invention, the detergent composition may provide excellent detergency for not only the metal residues but also surface contaminants of an object to be cleaned, and simultaneously, does not cause damage to the object to be cleaned, thereby improving process efficiency, and thus, a highly reliable semiconductor device may be provided by a very economical method.
Patent TW-202107646-A (TW)
Title: Semiconductor package structure
Inventor: Chi Yen-Yao
IPC: H01L23/36
Filed: 2020-07-31
Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an antenna device and semiconductor package. The antenna device includes a conductive pattern layer including a first antenna element, formed in an insulating substrate and adjacent to a first surface of the insulating substrate. The antenna device also includes a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The semiconductor package includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer. The semiconductor package also includes a first semiconductor die electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first semiconductor die.
Patent TW-202127306-A (TW)
Title: Apparatus and method for improved biometric sensing
Inventor: Lu yi-peng
IPC: C25D11/24
Filed: 2020-08-11
Abstract: A device and method for improved sensing with a biometric sensor assembly such as an ultrasound fingerprint sensor using an anti-fingerprint, oleophobic, or hydrophobic coating applied to a surface above the biometric sensor assembly. The coating improves the mechanical coupling of a human finger to the surface, helping to reduce acoustic loss through the finger to surface interface, improving at least the false-rejection ratio.