baber/WOPTO huggingface dataset:
Patent TW-201827219-A (TW)
Title: Photosensitive dry film and uses of the same
Inventor: TSAI TSUNG-HSIU
IPC: G03F7/032
Filed: 2017-01-26
Abstract: A photosensitive dry film and a method using the same are provided. The photosensitive dry film comprises a supporting substrate and a photosensitive resin layer disposed on the supporting substrate, wherein the supporting substrate has a first surface in contact with the photosensitive resin layer and a second surface opposite to the first surface, and the first surface has a non-smooth structure.
Patent TW-201735198-A (TW)
Title: Semiconductor device and manufacturing method of the same comprising wiring substrate, a first and second resin part, and device part
Inventor: MAEDA TAKEORI
IPC: H01L23/28
Filed: 2017-02-06
Abstract: Embodiments of the invention provides a semiconductor device and a manufacturing method of the same capable of reducing warpage. Embodiments of semiconductor device comprise a wiring substrate, first and second resin parts, and a device part. The first resin part has a first filler content. The device part is set between a portion of the wiring substrate and a portion of the first resin part. The device part comprises a first semiconductor element and a second semiconductor element which is set between the first semiconductor element and a portion of wiring substrate. The second resin part comprises a portion set at region between the first semiconductor element and the second semiconductor element, and a portion set at peripheral region between another part of wiring substrate and another part of the first resin part. The second resin part has a second filler content lower than the first filler content. The filler content in the region set between a part of peripheral region and another part of the first resin part continuously rises along a direction from a part set at peripheral region toward another part of the first resin part.
Patent TW-201743484-A (TW)
Title: Organic electroluminescence display device
Inventor: HAMADA YUKI
IPC: H01L51/50
Filed: 2017-02-23
Abstract: An organic electroluminescence display device has a barrier structure that is placed on an upper electrode. The barrier structure has a first organic sealing layer disposed between a first inorganic sealing layer and a second inorganic sealing layer. The first organic sealing layer is divided by the second inorganic sealing layer with respect to each of a plurality of partial areas that form a display area in a plan view and is thicker than a bank having a shape that rises upward.
Patent TW-201735799-A (TW)
Title: Method and apparatus for producing instant fried noodle
Inventor: KITANO SHO
IPC: A23L7/113
Filed: 2017-03-07
Abstract: The present invention relates to an instant fried noodle which does not undergo unevenness in density and is evenly fried. In the present invention, in addition to a two-stage frying procedure in which a retainer is immersed in a frying oil at a certain immersion rate and subsequently the whole body of the retainer is immersed in the frying oil, the control of the flow volume of a frying oil to be supplied from the upstream and the downstream of a frying oil bath and the oil level in the frying oil is carried out. In this manner, it becomes possible to prevent a mass of noodles from being detached and floating from the bottom of the retainer by the action of the pressure of the frying oil and therefore prevent the misshaping of the mass of noodles before the shape of the mass of noodles is fixed. Consequently, the frying efficiency or production efficiency can be improved. In addition, it also becomes possible to steadily produce a mass of noodles which has extremely small unevenness in the distribution of noodle strips. It is desirable that the difference between the density of noodle strips in the upper half of a dried mass of noodles and that in the lower half of the dried mass of noodles is at least 13% or less.
Patent TW-201734349-A (TW)
Title: Tap connector wit flow stabilization
Inventor: RENNER THOMAS
IPC: E03C1/086
Filed: 2017-03-07
Abstract: The invention relates to a tap connector comprising a first coupling portion (2) adapted to couple the tap connector (1) with a tap (10) and a second coupling portion (3) adapted to receive a hose connector, wherein the second coupling portion (3) comprises a fluid channel (4) for guiding a fluid received from the tap (10) to a fluid outlet (5), characterized in that the fluid channel (4) comprises one or more ribs (6) protruding from a wall (4.1) of the fluid channel into the fluid channel (4) and the one or more ribs (6) are integrally formed at the wall (4.1) of the fluid channel (4).
Patent TW-201737682-A (TW)
Title: Method and apparatus for establishing association between terminal equipment
Inventor: Zeng yuan-qing
IPC: H04L29/12
Filed: 2017-03-31
Abstract: Provided in the present invention are a method and apparatus for establishing association between terminal apparatuses. The method comprises: a first terminal apparatus sends terminal capability information to a network-side apparatus, the terminal capability information being used to indicate data receiving and forwarding capabilities provided in the first terminal apparatus; the first terminal apparatus receives confirmation information sent by the network-side apparatus and used to confirm that the first terminal apparatus has data receiving and forwarding capabilities; and the first terminal apparatus establishes, according to the confirmation information, association with a second terminal apparatus. In this way, the present invention enables, on the basis of an existing LTE communication system, establishing association between a terminal apparatus and another terminal apparatus and transmitting data, thus saving power for the terminal apparatuses and reducing costs for communication between the terminal apparatuses.
Patent TW-201901110-A (TW)
Title: Packaging device of chip and heat dissipater thereof and manufacturing method of heat dissipater wherein the plastic material can be formed with a rivet-like appearance and provided with a riveting effect, so that a combination maintaining force between the heat dissipater and the substrate can be enhanced
Inventor: CHEN YUN-XI
IPC: H01L23/34
Filed: 2017-05-24
Abstract: A heat dissipater is adhered on an adhesive layer of a substrate, and an accommodation space is defined by the substrate and the heat dissipater, the accommodation space allowing a chip electrically connected to the substrate to be accommodated. The heat dissipater includes: a base wall facing the chip and spaced from the chip with an interval, and a surround wall connected at a periphery of the base wall. The surround wall has a plurality of dish holes allowing a plastic material to permeate. Each of dish holes has a first hole segment arranged close to the substrate, a second hole segment arranged away from the first hole segment, and an engaging segment used for connecting the first hole segment and the second hole segment and having a smallest diameter, and the engaging segment allows the plastic material to cover thereon. Accordingly, with the design of the engaging segments, a surface area can be enlarged while an adhering operation being processed, the plastic material permeating into the dish holes and covering the engaging segments can be formed with a rivet-like appearance and provided with a riveting effect, so that a combination maintaining force between the heat dissipater and the substrate can be enhanced, and the combination strength can be further increased.
Patent TW-201743549-A (TW)
Title: Method and circuitry to soft start high power charge pumps
Inventor: SOLIE ERIC MAGNE
IPC: H02M3/07
Filed: 2017-05-26
Abstract: A method to soft start a charge pump circuit according to embodiments includes enabling switching for a plurality of power transistors, selecting a first switching control signal from a plurality of switching control signals for the selected plurality of power transistors, slowly ramping up a plurality of bootstrap supply voltages associated with the selected plurality of power transistors, driving a gate-to-source voltage of each power transistor of the selected plurality of power transistors at a first predefined level, and determining if the plurality of bootstrap supply voltages are less than a second predefined level. If the plurality of bootstrap supply voltages are less than the second predefined level, the method further includes toggling and thereby selecting a second switching control signal from the plurality of switching control signals for a second selected plurality of power transistors.
Patent TW-201904841-A (TW)
Inventor: Wu jun-xin
IPC: H05K13/02
Filed: 2017-06-14
Abstract: The present invention relates to a conveyance mechanism and a transportation method and device using the conveyance mechanism, comprising: a primary rail base, which is mounted on a machine table surface of a parts supplying machine table and is provided thereon with a driving member capable of driving a slidable seat to do horizontal displacement in an X axis direction on the rail base; a conveyance head, which comprises a secondary rail base that is arranged in a Z axis direction, mounted on the slidable seat of the primary rail base, and capable of being driven by the driving member of the primary rail base to do reciprocally leftward and rightward displacement in the X axis direction; the conveyance head is arranged on a slidable seat on the secondary rail base and capable of being driven by a driving member on the secondary rail base to do reciprocal upward and downward displacement in the Z axis direction; the conveyance head comprises three pick-up heads that are arranged linearly and separated from eath with an equal space, each of the pick-up heads carries out picks and drops by means of negative pressure, thereby conveying and transporting individual independent parts to supply the parts to a host processing machine.
Patent TW-201905570-A (TW)
Title: Dual-lens element and electronic devices having dual-lens element
Inventor: CHEN YU-PING
IPC: G03B19/22
Filed: 2017-06-16
Abstract: The invention relates to a dual-lens element. The dual-lens element includes a rotating disk, a dual-lens module, and a gravity sensor. The dual-lens module is positioned on the rotating disk. The gravity sensor detects a rotation direction and a rotation angle of the main body when the main body is rotated relative to a horizontal plane and the rotating disk rotates about the rotation angle by way of compensation, thereby maintaining the horizontal aspect of the dual-lens module. The invention relates to an electronic device having the dual-lens element.
Patent TW-201904735-A (TW)
Title: Passive Device of Gravity Compensation with Load Adjustable
Inventor: CHENG KUEI-JEN
IPC: B25J13/08
Filed: 2017-06-22
Abstract: A passive device is provided for gravity compensation. Its load is adjustable. A cylinder with variable internal pressure is used. With appropriate profile of cam, connecting rod, or the above, the passive device obtains the nature of linear elastomer with variable elasticity. Hence, through the passive device with variable internal pressure and the appropriate profile of cam, connecting rod, or the above, the linear elastomer with variable elasticity is formed with the pressure of the cylinder adjustable. Effectively and passively, the gravity of the body itself and its load are compensated fully or partially. Thus, the passive device with variable internal pressure for gravity compensation can be applied to different load conditions without changing its geometric configuration.
Patent TW-201904498-A (TW)
Title: Beverage temperature adjusting device capable of enhancing heat exchange effect
Inventor: WU SEN-CHAN
IPC: A47J36/26
Filed: 2017-06-27
Abstract: The present invention discloses a beverage temperature adjusting device for quickly adjusting the beverage temperature of various liquids, which comprises a container, a heat exchanger, and a thermal conduction rod. One end of the thermal conduction rod is connected with the heat exchanger and extended into the interior of the container, and the other end is connected to the beverage, so the beverage may conduct the heat exchange with the fluid inside the container by the thermal conduction effect of the thermal conduction rod, wherein the thermal conduction rod has a plurality of protrusions that are protruded out of the outer surface of the thermal conduction rod. Thus, the present invention employs the protrusions to increase the contact area between the outer surface of the thermal conduction rod and the beverage and thus enhance the heat exchange effect.
Patent TW-201812892-A (TW)
Title: Grinding apparatus including a grinding means for grinding a wafer held on a holding table, a Y-direction moving means for positioning the holding table, and a control means
Inventor: MIYAMOTO HIROKI
IPC: H01L21/304
Filed: 2017-07-06
Abstract: The present invention is to efficiently perform grinding processing on a wafer. A grinding device (1) includes a grinding means for grinding a wafer (W) held on a holding table (10), a Y-direction moving means (13) for positioning the holding table (10) at a moving in/out position (P1) and a grinding position (P2), and a control means (70). The grinding means includes a first rotating means (20) provided with a rough grinding wheel (26) configured to be rotatable; a first grinding feeding means (40) for feeding the first rotating means (20) along a Z-direction for grinding; a second rotating means (30) provided with a final grinding wheel (36) configured to be rotatable; a second grinding feeding means (50) for feeding the second rotating means (30) along the Z-direction for grinding; and an X-direction moving means (60) for moving the first grinding feeding means (40) and the second grinding feeding means (50) together along the X-direction. While grinding the wafer (W) on one side of a rough grinding whetstone (27) or a final grinding whetstone (37), a grinding preparation, such as trimming, can be performed at the other side which has not been ground, so as to grind the wafer (W) efficiently.
Patent TW-201843802-A (TW)
Title: High voltage electrostatic discharge (ESD) protection apparatus, circuit and manufacturing method thereof
Inventor: HUNG TZU-YI
IPC: H02H9/00
Filed: 2017-07-19
Abstract: Methods, circuits, devices, and systems for high voltage electrostatic discharge (ESD) protection are provided. An example ESD protection device includes: a base well of a first dopant type on a substrate, a first well of the first dopant type in the base well, a second well of a second dopant type in the base well, a first highly doped region of the first dopant type and a second highly doped region of the second dopant type in the first well, a third highly doped region of the second dopant type in the second well, and a fourth highly doped region of the first dopant type in the third highly doped region. The first highly doped region and the second highly doped region are coupled to a first voltage terminal, and the third highly doped region and the fourth highly doped region are coupled to a second voltage terminal.
Patent TW-201812992-A (TW)
Title: Semiconductor manufacturing device and manufacturing method of semiconductor device being provided with the jacking unit and a chuck
Inventor: OKAMOTO NAOKI
IPC: H01L21/687
Filed: 2017-07-20
Abstract: This invention aims at providing a semiconductor manufacturing device which can be matched with a variety to easily change a jacking unit. The solution of this invention is that the semiconductor manufacturing device is provided with the jacking unit and a chuck; the jacking unit is used for jacking a crystal grain from the downside of a cutting tape; and the chuck is used for sucking the crystal grain. The jacking unit is provided with a plurality of pins and a variety conversion unit; the plurality of pins are used for jacking the cutting tape; and the variety conversion unit selectively abuts against and connects a pin, corresponding to the crystal grain in size, in the plurality of pins.
Patent TW-201911113-A (TW)
Inventor: LI ZONG-KUAN
IPC: G06K9/36
Filed: 2017-07-27
Abstract: A fingerprint identification method includes updating required parameters for sensing fingerprint while the sensed fingerprint identification is unsuccessful; and repeatedly executing the fingerprint sensing and identification according to updated parameters until a certain number of times and time are reached. Thereby, when the identification is unsuccessful, the required parameters for sensing fingerprint are dynamically adjusted according to the image acquired in the previous instance, so that the acquisition quality of the fingerprint image can be improved and the unlocking success rate can be increased.
Patent TW-201820129-A (TW)
Title: Methods and apparatuses for configuring message
Inventor: YE JUN
IPC: G06F9/44
Filed: 2017-08-02
Abstract: The present application provides methods and apparatuses for configuring properties of messages transmitted in a networking communications system. In one embodiment, the method comprises: identifying message content in an input box of a communication session page of a communication application; recording an implementation degree of a trigger operation for a preset dimension in response to detecting the trigger operation; and sending the message content and the implementation degree to a peer device, wherein the implementation degree causes the peer device to configure a display attribute of the message content, such that the display attribute of the message content matches a predefined display attribute corresponding to the implementation degree. In the disclosed embodiments, a display attribute of message content can be quickly set, and the amount of data transmitted and the amount of space occupied can be reduced, and communication efficiency can be improved.
Patent TW-201833987-A (TW)
Title: Method for fabricating substrate structure
Inventor: LEE HO-JIN
IPC: H01L21/48
Filed: 2017-08-08
Abstract: There is provided a method for fabricating a substrate structure capable of enhancing process reproducibility and process stability by trimming a bevel region of a substrate using a wafer level process. The method includes providing a first substrate including first and second surfaces opposite each other and a first device region formed at the first surface, providing a second substrate including third and fourth surfaces opposite each other and a second device region at the third surface, bonding the first substrate and the second substrate to electrically connect the first device region and the second device region, and forming a trimmed substrate. The forming the trimmed substrate includes etching an edge region of the second substrate bonded to the first substrate.
Patent TW-201910644-A (TW)
Title: Cooling fan structure with rotational cylindrical fan vanes
Inventor: CHANG BOR-HAW
IPC: F04D25/08
Filed: 2017-08-10
Abstract: A cooling fan structure with rotational cylindrical fan vanes includes a rotary body and multiple rotational cylindrical bodies. The rotary body includes a rotor assembly and a stator assembly corresponding to the rotor assembly for driving the rotor assembly to rotate. The rotor assembly includes a hub. The hub has a top section and a circumferential section. The rotational cylindrical bodies are rotatably disposed on the top section or the circumferential section of the hub. When the rotary body rotates, the rotational cylindrical bodies are driven by the rotary body to self-rotate.
Patent TW-201911488-A (TW)
Title: Metallized structure and manufacturing method thereof
Inventor: WU CHENG-HUI
IPC: H01L23/15
Filed: 2017-08-10
Abstract: A metallized structure includes an insulating structure, a first seed layer, a second seed layer, a metal layer and at least one buffer layer. The first seed layer is disposed on the insulating structure. The second seed layer is disposed on the first seed layer. The metal layer is disposed on the second seed layer. The at least one buffer layer is disposed between the second seed layer and the insulating structure.
Patent TW-201913906-A (TW)
Title: Electronic package, its package substrate and the manufacture thereof
Inventor: MI HSUAN-HAO
IPC: H01L23/12
Filed: 2017-08-22
Abstract: The invention provides an electronic package and a method of fabricating the same, the method comprising providing a circuit portion having an insulating part and connected to the insulating part, and a packing substrate disposed on a supporting member formed on the insulating portion, the supporting member having an opening for exposing parts of the circuit portion so as to allow an inspect device to detect electricity of the circuit portion prior to performing chip-mounting and packaging processes, thereby preventing good chips from being mounted on defective package substrates.
Patent TW-201742640-A (TW)
Title: Bone cement composition and kit thereof
Inventor: SHAO WEI XING
IPC: A61L27/40
Filed: 2017-08-24
Abstract: The present invention provides a bone cement composition. The bone cement composition includes a bone matrix and a bone cement matrix formed by an acrylic polymer and an acrylic monomer, wherein the ratio of the bone matrix and the bone cement matrix is in a range from about 1:2 (g/g) to about 1:1000 (g/g). The present invention further provides a bone cement composition kit. The bone cement composition kit includes a bone matrix component, a powder component and a liquid component stored in separate containers, respectively, wherein the bone matrix component includes a bone matrix, the powder component includes an acrylic polymer, and the liquid component includes an acrylic monomer. The powder component and the liquid component are mixed to form a bone cement matrix component. A ratio of the bone matrix component and the bone cement matrix component is in a range from about 1:2 (mL/mL) to about 1:50 (mL/mL).
Patent TW-201817230-A (TW)
Title: Semiconductor device, moving image processing system, method of controlling semiconductor device
Inventor: AKIE KAZUSHI
IPC: H04N19/136
Filed: 2017-09-06
Abstract: A display area can be smoothly moved. A semiconductor device sequentially receives a plurality of whole images, each of which includes a plurality of small screen images and which are temporally continuous and form a moving image, and decodes a received whole image. Here, the semiconductor device includes a reception unit that receives the whole image including the small screen images, a determination unit that determines a decoding area which includes a small screen image to be decoded and which is included in the whole image, and a decoding unit that decodes the small screen image in the decoding area which is determined by the determination unit and which is included in the whole image. The determination unit determines a new decoding area when a small screen image of intra frame appears in the decoding area.
Patent TW-201822912-A (TW)
Title: Mold manufacturing method
Inventor: TAKAGAWA YUSAKU
IPC: B22C1/00
Filed: 2017-09-07
Abstract: A mold manufacturing method having: a reaction amount calculation step for a binder that forms self-hardening sand; a room-temperature compression strength calculation step for a specimen; a room-temperature compression strength prediction step for a mold; and a room-temperature compression strength derivation step for the mold. When an actual mold is manufactured, the mold is removed immediately after the elapse of a time t1, which is a mold manufacturing condition parameter satisfying the room-temperature compression strength [delta]ce ([Theta], t) derived in the room-temperature compression strength derivation step for the mold.