baber/WOPTO huggingface dataset:
Patent TW-201321501-A (TW)
Title: Beer-taste beverage containing saponin
Inventor: TERANISHI TAKESHI
IPC: C09K23/56
Filed: 2012-08-31
Abstract: The present invention is capable of whitening the foam head of a beer-taste beverage containing a colorant. According to the present invention, more specifically, saponin is added to a beer-taste beverage that contains a colorant.
Patent TW-201409382-A (TW)
Title: Intelligent switch and intelligent home system using the same
Inventor: CHEN TE-SHENG
IPC: H02J13/00
Filed: 2012-09-04
Abstract: An intelligent switch used for connecting at least one electrical device to a power supply is provided. The intelligent switch includes a storage unit storing a tariff calculation formula, a display unit, a power detection unit, a communication unit and a processor. The power detection unit is configured to detect the real-time electricity information of the electrical device connecting to the intelligent switch. The processor includes a control module and a calculation module. The control module controls the display unit to display the real-time electricity information of the electrical device. The calculation module calculates the total electricity consumption of the electrical device according to the real-time electricity information of the electrical device. The calculation module also controls the display unit to display the total electricity consumption of the electrical device. The communication unit connects the intelligent switch to a gateway. An intelligent home system using the intelligent switch is also provided.
Patent TW-201415777-A (TW)
Title: Isolated interleaved DC converter
Inventor: PAN CHING-TSAI
IPC: H02M1/44
Filed: 2012-10-12
Abstract: An isolated interleaved DC converter has a main circuit architecture integrating a transformer, a dual-phase interleaved step-up circuit, a voltage type auto charge pump circuit with a double-voltage rectifier circuit. The circuit of the invention integrates with the transformer, and combines the dual-phase interleaved boost circuit and the voltage type auto charge pump circuit at a primary side of the transformer, with the dual-phase interleaved step-up circuit to reduce the input current ripple. At a secondary side of the transformer, the circuit of the invention further combines the double-voltage rectifier circuit. By means of the design of circuit parameters and the action of the LC resonant circuit, the step-up ratio of the converter can be increased. Taking the advantages of characteristics of automatically changing the circuit architecture, the active switching elements can be further integrated in the dual-phase interleaved boost circuit to realize the soft switching technology while reducing EMI and the switching loss and increasing the circuit conversion efficiency.
Patent TW-201333421-A (TW)
Title: Tire shape inspection method and tire shape inspection device
Inventor: TAKAHASHI EIJI
IPC: G01B21/20
Filed: 2012-10-16
Abstract: An objective of the present invention is to subtract only the difference between bulge and dent mark heights and compute and acquire only the heights of bulges and dents even when bulges and dents are present so as to overlap in the bulge and dent marks. Provided is a tire shape inspection method for inspecting sidewall surface shape defects in inspected tires using an image of a sample tire having sidewall surfaces on which bulge and dent marks are formed. The method executes the following steps: first, as a teaching operation step, boundary lines of the bulge and dent marks are detected in a sample source image of a sample tire, a mask image is generated which denotes the boundary lines, regions are removed from the sample source image which correspond to the boundary lines which are denoted in the mask image, and a height offset image is generated which represents the heights of the remaining regions with one or more offset values. Next, as an inspection operation step, the height offset image is subtracted from an inspection image of the inspected tire, the boundary regions which the mask image represents are removed, and, on the basis of the obtained bulge/dent removal image, shape defects of the sidewall surfaces of the inspected tire are inspected.
Patent TW-201334060-A (TW)
Title: Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
Inventor: CHHATRE RISH
IPC: H01L21/3065
Filed: 2012-10-24
Abstract: An improved gas injection assembly for mounting in a central bore of a dielectric window of an inductively coupled plasma chamber includes a window having a central bore and cylindrical recess configured to receive an annular insert having a bayonet opening. The gas injector assembly includes a gas injector, an RF shield surrounding the gas injector, and a faceplate surrounding the RF shield, the faceplate including projections at the bottom thereof for engaging the bayonet opening in the annular insert. The window and gas injection assembly are designed to avoid chipping of the window which is typically made of quartz and in prior mounting arrangements the window has a bayonet opening machined therein. Due to the brittle nature of the quartz material, the machined bayonet opening was subject to chipping when the gas injector assembly was inserted into the bayonet opening.
Patent TW-201327744-A (TW)
Title: Semiconductor device and method of forming extended semiconductor device with fan-out interconnect structure to reduce complexity of substrate
Inventor: PENDSE RAJENDRA D
IPC: H01L21/60
Filed: 2012-10-25
Abstract: A semiconductor device has a semiconductor wafer with a plurality of semiconductor die. Contact pads are formed on a surface of the semiconductor die. The semiconductor die are separated to form a peripheral region around the semiconductor die. An encapsulant or insulating material is deposited in the peripheral region around the semiconductor die. An interconnect structure is formed over the semiconductor die and insulating material. The interconnect structure has an I/O density less than an I/O density of the contact pads on the semiconductor die. A substrate has an I/O density consistent with the I/O density of the interconnect structure. The semiconductor die is mounted to the substrate with the interconnect structure electrically connecting the contact pads of the semiconductor die to the first conductive layer of the substrate. A plurality of semiconductor die each with the interconnect structure can be mounted over the substrate.
Patent TW-201336094-A (TW)
Title: Backside protective sheet for solar cell modules, and solar cell module
Inventor: MARUYAMA SHINSUKE
IPC: H01L31/042
Filed: 2012-11-02
Abstract: This backside protective sheet for solar cell modules comprises a black resin layer which contains a black pigment that is formed of a complex oxide containing Fe, Co, Al and one or more metal elements that are selected from among Li, Mg, Ca, Sr, Ba, Ti, Mn, Zn, Sn, Zr, Si and Cu. Consequently, this backside protective sheet for solar cell modules is capable of efficiently reflecting infrared light incident on a solar cell module.
Patent TW-201333547-A (TW)
Title: Method of making polarizing beam splitters providing high resolution images and systems utilizing such beam splitters
Inventor: CARLS JOSEPH CLARK
IPC: G02B5/30
Filed: 2012-11-27
Abstract: Polarizing beam splitters, methods of making such beam splitters, and systems incorporating such beam splitters are described. More specifically, polarizing beam splitters, methods of making such beams splitters, and systems with such beam splitters that incorporate multilayer optical films and reflect imaged light towards a viewer or viewing screen with high effective resolution are described.
Patent TW-201313742-A (TW)
Title: Compositions and methods for producing a composition
Inventor: LEISTER KIRK J
IPC: C07K16/28
Filed: 2006-12-19
Abstract: The invention provides for mammalian cells capable of producing recombinant CTLA4-Ig and variants thereof. The invention also pr ovides for compositions comprising CTLA4-Ig and formulations thereof. The invention further provides for methods for mass-producing CTLA4-Ig from mammalian cells capable of producing this recombinant protein, and for purifying the CTLA4-Ig.
Patent TW-201424657-A (TW)
Title: Snore-stopping pillow structure featuring automatic adjustment and health-warning functions
Inventor: JI JIE-CONG
IPC: A47G9/10
Filed: 2012-12-21
Abstract: A snore-stopping pillow structure featuring automatic adjustment and health-warning functions, which includes: a pillow, a control panel fittingly covering the pillow underside, wherein the control panel is provided with a wave-frequency sensor correspondingly at both sides of the pillow, the control panel also has a control box, and the control panel is connected to the wave frequency sensor through the control box; in addition, the control box is also connected with a display board and a power switch; a driving machine is assembled on the control panel, and the driving machine is linked to a balance plate with the shaft; when the wave-frequency sensor detects the existence of snoring sound, the driving machine drives the balance plate to generate swing for three to five minutes, and automatically return to the position prior to the swing, thereby eliminating the occurrence of user's snore, further achieving the usage efficacy of the health warning through the control box recording the number of user's snore.
Patent TW-201429677-A (TW)
Title: System and method for controlling thickness of optical film
Inventor: HSU CHIA-LING
IPC: B29L11/00
Filed: 2013-01-24
Abstract: The present disclosure relates to a system for controlling thickness of optical film. The system is used in a roll to roll device. The roll to roll includes a pressing roller and a forming roller. The optical film is sandwiched the pressing roller and the forming roller. The system comprises a detecting unit, a processing unit, and a regulating unit. The detecting unit detects a current thickness of the optical film. The current thickness is compared with the target thickness in the processing unit and a pressure of the pressing roller and the forming roller is obtained according to relation between the current thickness and the target thickness. The regulating unit controlled by the processing unit is configured for regulating the pressure. The invention also relates to a method for controlling thickness of optical film.
Patent TW-201432117-A (TW)
Title: Lightweight composite floor
Inventor: Xie ying-jun
IPC: E04B5/02
Filed: 2013-02-04
Abstract: The present invention relates to a lightweight composite floor. The floor includes a plate, a structural body, an anti-cracking net, and connecting members. The anti-cracking net is embedded in the structural body and integrated with the structural body. The structural body is set on the plate. The plate and the structural body are connected together through the connecting members. The lightweight composite floor according to this invention features no grout leakage, no deformation, no cracking occurring in an actual installation process, while providing an excellent property of water resistance.
Patent TW-201345433-A (TW)
Title: Aroma and/or flavor imparting composition, foodstuff, and production method for said foodstuff
Inventor: ASO YUIHAKU
IPC: A23L27/00
Filed: 2013-02-06
Abstract: The present invention addresses the problem of providing: a composition capable of imparting to a foodstuff a desirable aroma and/or flavor inherent in a brewed or fermented food or in a seafood extract; a foodstuff having the aroma and/or flavor inherent in a brewed or fermented food or in a seafood extract; and a production method for said foodstuff. The production method for the foodstuff includes a step in which a 1-octen-3-ol and/or a 1-octen-3-one, a lower fatty acid, and a methional are added to the foodstuff, such that the additive concentration of the 1-octen-3-ol and/or a 1-octen-3-one is 0.00006-0.065 ppm by weight, the additive concentration of the lower fatty acid is 0.0006-0.7 ppm by weight, and the additive concentration of the methional is 0.2-230 ppm by weight.
Patent TW-201434052-A (TW)
Title: Silver alloy soldering lead for semiconductor packaging
Inventor: Huang wei-zhi
IPC: H01B1/02
Filed: 2013-02-21
Abstract: A silver alloy soldering lead for semiconductor packaging, comprising a silver alloy composition, including silver, palladium, a first additive, and a second additive, based on 100wt%of the silver alloy composition t , weight percentage of palladium is greater than 0 and less than 2wt%, weight percentage of the first additive is not less than 0. 001wt%, and is not greater than 2wt%, weight percentage of the second additive is not less than 0. 001wt%, and is not greater than 2wt%, the first additive is selected from indium, gallium, tin, phosphorus, and a combination thereof, the second additive is selected from platinum, gold, yttrium, and a combination thereof. The silver alloy soldering leads of present invention can still possess excellent reliability after being soldered and bonded to an aluminum pad without requiring high concentration of palladium content.
Patent TW-201348207-A (TW)
Title: Pest control composition including novel iminopyridine derivative
Inventor: HORIKOSHI RYO
IPC: C07D213/74
Filed: 2013-02-27
Abstract: Provided is a pest control composition containing a novel iminopyridine derivative and other pest control agents. Provided is a pest control composition containing an iminopyridine derivative represented by the following Formula (I) and at least one of other pest control agents: [Chemical Formula 1] [in the formula, Ar represents a 5- to 6-membered heterocycle which may be substituted, A represents a heterocycle having a 5- to 10-membered unsaturated bond including one or more nitrogen atoms, and has an imino group substituted with an R group at a position adjacent to the nitrogen atom present on the cycle, Y represents hydrogen, halogen and the like, and R represents any one of groups represented by the following Formulae (a) to (e), (y) or (z)].
Patent TW-201325325-A (TW)
Title: Plasma processing apparatus and lid assembly
Inventor: CARDUCCI JAMES D
IPC: H01L21/67
Filed: 2012-09-20
Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
Patent TW-201435409-A (TW)
Title: Device for assembling optical communication module
Inventor: LAI CHIH-CHEN
IPC: G02B6/26
Filed: 2013-03-07
Abstract: A device for assembling optical communication module is configured for coating glue onto a substrate locating electric components. The device comprises at least an image sensor and a pinhead. The pinhead is configured for coating glue onto the substrate. The image sensor obtains the quantity of the glue outputted from the pinhead.
Patent TW-201401104-A (TW)
Title: Controlling a media program based on a media reaction
Inventor: HULTEN GEOFFREY J
IPC: H04N21/47
Filed: 2013-03-25
Abstract: This document describes techniques and apparatuses for controlling a media program based on a media reaction. In some embodiments, the techniques pause, mute, or stop a media program when a user leaves the room, when a user in the room is talking or is otherwise not paying attention to the program, or when a child walks into the room.
Patent TW-201349946-A (TW)
Title: Multi-radiofrequency impedance control for plasma uniformity tuning
Inventor: MARAKHTANOV ALEXEI
IPC: H05H7/02
Filed: 2013-03-28
Abstract: Circuits, methods, chambers, systems, and computer programs are presented for processing wafers. A wafer processing apparatus includes top and bottom electrodes inside a processing chamber; a first, second, third, and fourth radio frequency (RF) power sources; and one or more resonant circuits. The first, second, and third RF power sources are coupled to the bottom electrode. The top electrode may be coupled to the fourth RF power source, to electrical ground, or to the one or more resonant circuits. Each of the one or more resonant circuits, which are coupled between the top electrode and electrical ground, include a tune-in element operable to vary a frequency-dependent impedance presented by the resonant circuit. The wafer processing apparatus is configurable to select the RF power sources for wafer processing operations, as well as the connections to the top electrode in order to provide plasma and etching uniformity for the wafer.
Patent TW-201436751-A (TW)
Title: Golden egg rotator
Inventor: LIAO HSIEN-CHUN
IPC: A47J43/04
Filed: 2013-04-01
Abstract: A power-worked device which comprises a motor, a shaft and a food fixer. When the motor is working, the device would occur vibration or rotate with centrifugal force to mix the fixed food. For example, now we consider the food we fixed as an egg. After rotating and shocking, the part of yolk and egg white inside of the egg will mix with complete eggshell. Then we can cook the egg as a golden egg.
Patent TW-201403503-A (TW)
Title: Techniques for augmented social networking
Inventor: RATCLIFF JOSHUA J
IPC: H04W4/029
Filed: 2013-04-10
Abstract: Techniques for augmented social networking may includereceiving an image. After receiving an image, in real time, an identity of a person in the image may be determined. Association information for the person based on the identity and one or more defined parameters may be determined. The defined parameters may represent electronic communication. Location information of the person may be determined. The association information may be presented proximate to the person in an augmented reality view using the location information.Other embodiments are described and claimed.
Patent TW-201409093-A (TW)
Title: Scattering-type polarizer and liquid crystal display including the same
Inventor: MUTA TAKATOSHI
IPC: G02F1/1335
Filed: 2013-04-24
Abstract: The present invention provides a scattering-type polarizer, which has higher mechanical strength and polarized light transmission property and is preferably used as a brightness-enhancing film. The scattering-type polarizer of the present invention, which contains at least two kinds of thermoplastic resins and is composed of a film aligned in a uniaxial direction having a sea-island structure formed of a continuous phase (I) and a disperse phase (II), is characterized in that: the absolute value of the difference in refractive index between the continuous phase (I) and the disperse phase (II) is greater than 0.05 in the axis (S axis) parallel to the alignment direction and is greater than 0.05 in the axis (P axis) perpendicular to the alignment direction and parallel to the surface of the film, the dispersion diameter of the disperse phase (II) in the P axis direction is 10 nm or more and 200 nm or less, the average polarized light transmittance in the P axis direction measured at a wavelength of 400-700 nm is 80% or more, and the tear strength in the P axis direction determined according to JIS K7128-3 is 600 N/cm or more.
Patent TW-201442130-A (TW)
Title: Method for increasing ball mounting yield of integrated circuit substrate
Inventor: CHEN ZHAO-SHANG
IPC: H01L21/60
Filed: 2013-04-29
Abstract: The present invention provides a method for increasing ball mounting yield of integrated circuit substrate, and particularly a method for mounting a ball guiding plate on top of a ball sucking fixture; during ball placing, the solder ball will be first passed through a ball guiding hole of the ball guiding plate and then placed into the ball slot of the ball sucking fixture. Therefore, even the ball slot of the ball sucking fixture is made to be shallower, the solder ball can still be completely placed on the ball sucking fixture without occurring with ball scratching problem. Thus, during ball mounting, the raising height of substrate may be more easily controlled, and there will no occurrence of soldering flux adherence with ball sucking fixture or solder ball spreading.
Patent TW-201349487-A (TW)
Title: Semiconductor device
Inventor: YEH JEN-HAO
IPC: H01L29/40
Filed: 2013-05-08
Abstract: A semiconductor device includes a buried well region and a first high voltage well (HVW) region of a first conductivity, and an insulation region over the first HVW region. A drain region of the first conductivity type is disposed on a first side of the insulation region and in a top surface region of the first HVW region. A first well region and a second well region of a second conductivity type opposite to the first conductivity type are on the second side of the insulation region. A second HVW region of the first conductivity type is disposed between the first and second well regions, wherein the second HVW region is connected to the buried well region. A source region of the first conductivity is in a top surface region of the second HVW region, wherein the source region, the drain region, and the buried well region form a JFET.
Patent TW-201401700-A (TW)
Title: Adapter for vacuum insulated cables
Inventor: BLESS MARTIN
IPC: H02G15/00
Filed: 2013-05-09
Abstract: A vacuum adapter for carrying a vacuum-insulated cable from the ambient atmosphere into a vacuum processing system comprises an intermediate space one side of which is connected with at least one insulated space of the vacuum-insulated cable and the other side is connected with a vacuum pump. The pump power is used at least part of time to evacuate an insulation space of coolant cables (22, 23).
Patent TW-201423218-A (TW)
Title: Window for display device and display device including the window
Inventor: HONGO YUKI
IPC: B32B37/14
Filed: 2013-05-09
Abstract: Disclosed is a window for a display device that includes a first plastic substrate, a second plastic substrate disposed on one side of the first plastic substrate, and a bonding layer disposed between the first plastic substrate and second plastic substrate and bonding the first plastic substrate and the second plastic substrate, wherein the bonding layer has protrusions and depressions on a side in contact with the first plastic substrate.
Patent TW-201445785-A (TW)
Title: Heat dissipation plate
Inventor: CHEN CHING-SHENG
IPC: H01L33/64
Filed: 2013-05-21
Abstract: A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer comprises ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.
Patent TW-201441421-A (TW)
Title: Blacken reagent and method for manufacturing printed circuit board
Inventor: HSU MAO-FENG
IPC: C23C22/63
Filed: 2013-05-22
Abstract: A blacken reagent includes sodium hydroxide, sodium bromate or sodium bromite, and trisodium phosphate anhydrous. The content of the sodium hydroxide is 4g/L to 16g/L. The content of the sodium bromate or sodium bromite is 20g/L to 60g/ L. The content of the trisodium phosphate anhydrous is 3g/L to 9g/L. A method for manufacturing a printed circuit board is also provided in the present disclosure. The method comprises a following step. A copper surface of the printed circuit board is blackened by the blacken reagent before lamination process or laser process.