baber/WOPTO huggingface dataset:
Patent JP-2007019076-A (JP)
Title: Exposure apparatus and exposure method
Inventor: SAKAI MOTOYUKI
IPC: H01L21/027
Filed: 2005-07-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an exposure apparatus and an exposure method of further improving high efficiency of a photolithograpy process.  <P>SOLUTION: The exposure apparatus 1 is provided with: an exposure pattern forming means forming an exposure pattern by operation control; a control section 12 for controlling the operation of the exposure pattern forming means for causing the forming means to form a desired exposure pattern; and a galvanometer mirror 9 as a deviation reflection means for scanning the exposure pattern on a substrate. In this apparatus, a reflection type diffraction optical element is formed which branches the exposure pattern into a plurality of exposure patterns each the same as the exposure pattern on a mirror surface of the galvanometer mirror 9, and exposes the substrate simultaneously using the plurality of branched exposure patterns.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007016268-A (JP)
Title: Method for manufacturing steel sheet to be excellently degreased, and the steel sheet
Inventor: OTSUKA SHINJI
IPC: C23C28/00
Filed: 2005-07-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for stably manufacturing a steel sheet which is satisfactorily degreased in an alkaline degreasing treatment that is conducted before chemical conversion treatment, and is satisfactorily chemical-conversion-treated, and to provide the steel sheet.  <P>SOLUTION: This method for manufacturing the steel sheet to be excellently degreased comprises the steps of: making a steel sheet contact with an aqueous solution containing P; and applying oil to the surface. The manufacturing method also comprises the steps of: plating a steel sheet with a Ni-based metal, or making a steel sheet contact with an aqueous solution containing a S compound in an amount of 1 to 1,000 ppm by S concentration; and making the treated sheet contact with the aqueous solution containing P. It is preferable that the aqueous solution containing P contains 0.5 to 5,000 ppm P and has a pH of 4.0 to 12.0.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007016883-A (JP)
Title: Block joint for piping interior
Inventor: TOYODA YASUHIRO
IPC: F16L55/12
Filed: 2005-07-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a block joint for a pipe interior capable of permanently exercising sealing performance and loosening prevention performance.  <P>SOLUTION: In the block joint, a loosening prevention ring 7 is circumferentially divided into two or more, it is formed with biting teeth 18 and a circumferential groove 19 on a outer circumference, and it is held like a ring capable of expanding and contracting by a snap ring 20. A pressing collar 8 is provided with a forward narrowing tapered face 22 capable of fitting in a rear end opening of a loosening prevention ring 7 inner circumference. When the block joint 1 is inserted into the pipe arrangement from a head 3, and a press nut 11 is tightened, the tapered face 22 of the press collar 8 is fitted in the rear end opening of the inner circumference of the loosening prevention ring 7, and by this, the loosening prevention ring 7 is diametrally expanded while being pushed toward a compression ring 6 side, the biting tooth 18 are engaged with an inner face of the pipe arrangement, the compression ring 6 is pressed against a secondary seal ring 5 to hold the secondary seal ring 5 with the head 3, and the secondary seal ring is diametrally expanded and adhered to the inner face of the pipe arrangement to block the pipe interior.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006192560-A (JP)
Title: Clamping mechanism for cutting insert, and cutting insert
Inventor: NAGAYA HIDEHIKO
IPC: B23B27/16
Filed: 2005-07-07
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a sufficient clamping force surely holding a cutting insert without forcing an operator to have additional labor, troublesome management for work tools, and clamping work.  <P>SOLUTION: A clamping mechanism for the cutting insert clamps the cutting insert by inserting and holding the cutting insert having a pair of contacted surfaces to respectively come in contact with the pair of contacting surfaces on the inserting mounting seat formed in a tip of a holder 1 having the pair of contacting surfaces facing each other. The tip of the holder 1 is provided with: a pair of jaws 3B and 3C that is formed with the pair of contacting surfaces, respectively, and that is capable of being elastically deformed relatively in a direction that the contacting surfaces come in contact with the contacted surfaces; and a clamping means 21 that elastically deforms the pair of jaws 3B and 3C to relatively make the pair of contacting surfaces approach each other and relatively separate them from each other in their abutting direction.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006349328-A (JP)
Title: Reheating type ventilation heat source heat pump unit
Inventor: MORITA YOSHIKO
IPC: F25B27/02
Filed: 2005-06-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat pump unit capable of enhancing a coefficient of performance (COP) in a heat pump in a snow-fall cold district, and capable of contributing to reduction of greenhouse effect gas as energy saving equipment.  <P>SOLUTION: A heat-absorbing water heat exchanger 3 is installed in the first heat exchanger in a heat source side (evaporation process), in the present invention, and a ventilating air heat exchanger 4 is connected in series to the second heat exchanger. An evaporation amount of a liquid refrigerant is increased by those systems, a heat pump COP is enhanced, and energy is saved.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007028707-A (JP)
Title: Electrical equipment box for water supply pump
Inventor: TOYODA KOJI
IPC: H02B1/28
Filed: 2005-07-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide electrical equipment box for water supply pump, in which a control circuit board can be protected against dielectric breakdown by preventing intrusion of a living thing, such as slugs or ants using a simple constitution.  <P>SOLUTION: In electrical equipment box for water supply pump, where a control circuit board 2 for controlling a water supply pump is contained in a case 1, and a portion 7 for mounting a connector 6 conducting with the control circuit board 2 is provided on the side of the case 1, a barrier 12 for covering the connector mounting portion 7 and hermetically sealing between the connector mounting portion 7 and the interior of the case 1 is provided on the inside of the case 1.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007021347-A (JP)
Title: Hardly decomposable substance-containing water treatment method
Inventor: MURAMOTO TAKAHISA
IPC: B01D65/02
Filed: 2005-07-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wastewater treatment method which enables a closed system where for the concentration and detoxification of the hardly decomposable substances adsorbed by solids are directly subjected to effective decomposition treatment without an operation such as desorption hardly decomposable substances, such as dioxins, contained in contaminated water, and a circulating on-site treatment method which eliminates the generation of waste by recycling adsorbent used for adsorptive separation of the hardly decomposable substances.  <P>SOLUTION: A hardly decomposable substance-containing water treatment method comprises (B) an adsorption process where adsorbent is added to the hardly decomposable substance-containing water to adsorb the hardly decomposable substances onto the adsorbent, (C) a membrane filtration process where permeate is separated by using a filtration membrane to concentrate the adsorbent on which the hardly decomposable substances have been adsorbed, (D) a hardly decomposable substance decomposition process where the concentrated hardly decomposable substances adsorbed by the adsorbent is decomposed, and (E) an adsorbent return process where the adsorbent after the decomposition of the hardly decomposable substances is returned to the adsorption process (B).  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007024382-A (JP)
Title: Liquid fuel combustor
Inventor: NOMIZU KOICHI
IPC: F23C99/00
Filed: 2005-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid fuel combustor effectively suppressing generation of NOx, and capable of also suppressing generation of CO.  <P>SOLUTION: A substantially L shaped secondary air inflow preventing plate 12 is provided for preventing inflow of secondary air to a burner port part 9 of a burner 3, and a space part 13 passing one part of air from a blower 2 is formed between the secondary air inflow preventing plate 12 and a front face of a combustion chamber 5. Accordingly, generation of NOx is suppressed by preventing a large amount of secondary air that has flowed into the combustion chamber 5 from flowing into the burner port part 9 of the burner 3, and since an appropriate amount of air having passed through a space part 13 is supplied to the burner port part 9 of the burner 3, generation of CO due to shortage of primary air can be suppressed also.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007026029-A (JP)
Title: Estimate distribution auxiliary system
Inventor: FURUKI TOSHIYUKI
IPC: G06Q30/06
Filed: 2005-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an estimate distribution auxiliary system for enabling an orderer to grasp the estimated unit price of merchandise to be provided by much more enterprises, and to advantageously advance price negotiation with an order receiver, and for enabling the order receiver to reduce his or her own expenses.  <P>SOLUTION: The consumption of each merchandise of an orderer in a prescribed period is extracted in an S1, and the purchase unit price of the orderer of each merchandise is extracted in an S2. The calculation processing of the purchase scale-categorized mean unit price of each merchandise is executed in an S3 and the calculation processing of the purchase scale-categorized mean unit price of each merchandise group is executed in an S4. The reading of exclusion object merchandise to be excluded from estimate distribution auxiliary processing is executed in an S5, and the arithmetic operation of a reduction impact is performed in an S6. Each merchandise is ranked in the order of a larger reduction impact, and the exclusion object merchandise is excluded, and the predetermined number of merchandise is selected from the among the residual merchandise in the order of the larger reduction impact in an S7. The reading processing of a transmission object order receiver is operated in an S8, and information relating to the selected merchandise is transmitted to the terminal of the transmission object order receiver in an S9.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007026079-A (JP)
Title: Printer, printing method, and program for executing printing method
Inventor: TOKASHIKI KIYOSHI
IPC: B41J29/42
Filed: 2005-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem of an increase in development load caused by the need to create a printer driver for each printer because print settings for a print job are usually done by a printer driver installed in a client PC.  <P>SOLUTION: A screen and a program for print settings are not carried by a printer driver installed in a client PC but sent from a print processor by means of JAVA(R) or the like and displayed on the client PC.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007026103-A (JP)
Title: Apparatus and method for determining face part
Inventor: IWAMOTO KINYA
IPC: G06T1/00
Filed: 2005-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for determining face parts capable of enhancing the accuracy of detecting face parts.  <P>SOLUTION: The apparatus 1 for determining face parts specifies candidates for face parts to be detected from a face image obtained by imaging a subject, and extracts microscopic images smaller than the face image based on the positions of the specified candidates for the face parts. Thereafter, the apparatus 1 equalizes the density conditions of the microscopic images extracted. The apparatus 1 equalizes the density conditions not for the entire face image but for the microscopic images. Thereafter, the apparatus 1 determines the face parts to be detected based on the microscopic images equalized.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007020884-A (JP)
Title: Game machine
Inventor: YOSHIDA KENICHI
IPC: A63F7/02
Filed: 2005-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a game machine capable of preventing the leak when an earthquake occurs.  <P>SOLUTION: The game machine comprises motors 400, buttons and sensors 500, a main circuit 71, a power supply device 210 for feeding electric power to the above, and a cabinet for storing the above. The game machine also has a P-wave sensor 15 for detecting the quake of the cabinet, a P-wave detecting part 232, an S-wave sensor 152, an S-wave detecting part 233, and a switch 220 and a power feeding stopping part 231 for determining whether an earthquake occurred or not based on the detected quake and stopping the power supply from the power feeding device 210 if it is determined that the earthquake occurred.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007027472-A (JP)
Title: Device incorporating component and manufacturing method therefor
Inventor: SUGA TADATOMO
IPC: H01L23/52
Filed: 2005-07-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a device incorporating components capable of arranging a via to easily penetrate both sides of a semiconductor IC chip in a dry process and incorporating even an electronic component other than a semiconductor, and to provide its manufacturing method.  <P>SOLUTION: The method is the one for manufacturing an electronic device where component chips 101 are embedded inside a substrate 103 made of an insulation resin and which is the device incorporating the components. A first through-hole 102 penetrating the both sides of the component chip 101 is arranged at least in one component chip 101; a second through-hole 104 penetrating the both sides of the substrate 103 passes through the first through-hole 102, and is arranged at a position not to contact the inner surface of the first through-hole 102 in the substrate 103; and electric circuit conductive bodies 106, 107 arranged on the both sides of the substrate 103 are conductively connected by a conductive body 108 which is disposed in the second through-hole 104.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007026197-A (JP)
Title: Data transmission system, data acquisition device, data acquisition method, data accumulation device, data transmission method, and program thereof
Inventor: MATSUO TAKASHI
IPC: G06K17/00
Filed: 2005-07-19
Abstract: <P>PROBLEM TO BE SOLVED: To increase data processing efficiency by restricting storage or acquisition of unnecessary data.  <P>SOLUTION: The data acquisition device 110 of the present invention comprises: an acquisition transmission part 214 which carries out wireless data communication with a data accumulation device 100 that accumulates data; a type registration part 216 in which types of necessary data are registered beforehand; a type comparison part 218 which compares the type of the data received through the acquisition transmission part with the data type registered in the type registration part; a data extraction part 220 which extracts only the data of which type conforms; and an acquisition holding part 222 which holds the extracted data.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2005340854-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: OCHIAI AKIRA
IPC: H01L21/56
Filed: 2005-07-21
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem that a conventional method of manufacturing the semiconductor device causes a mounting failure since microcrack is generated in a resin sealed body when a semiconductor device is separated from a lead frame, and since dust, such as resin burr, enters into a mounting substrate and a mounted surface of a semiconductor device at the time of mounting.  <P>SOLUTION: In the conventional method of manufacturing the semiconductor device, the injection of resin and exhaust of air in cavity and resin are performed through a first air vent 45 formed in a lead frame 41 so that periphery surface 30, which is formed so as to surround the side surface of the resin sealed body, become a flat surface. Thereafter, the flat surface of the periphery surface 30 is penetrated from the rear surface side of the resin sealed body 22 in the state that the flat surface is securely fixed by a support means 62. Thereby, generation of microcrack can be restrained. As a result, at the time of mounting of the semiconductor device, the generation of resin waste due to microcracks can be prevented and mounting failure can be prevented.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007028866-A (JP)
Title: Inverter apparatus for switched reluctance motor
Inventor: ENDO DAIGO
IPC: H02P25/08
Filed: 2005-07-21
Abstract: <P>PROBLEM TO BE SOLVED: To simplify the structure of an inverter apparatus, and efficiently perform the rotation control of a switched reluctance motor.  <P>SOLUTION: In the inverter apparatus 1, a first series circuit 22, a second series circuit 23, a third series circuit 24 and a fourth series circuit 25, each having two switching elements connected in series, are connected in parallel with each other. The center point of the first series circuit 22 is connected to the cross point m of the windings 9U, 9V, 9W of coils U, V, W wound in Y-connection, while the other ends of the windings 9U, 9V, 9W are connected one by one to the center point of from the second to fourth series circuits 23 to 25.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2005311401-A (JP)
Title: Semiconductor laser device
Inventor: HONDA MASAHARU
IPC: H01S5/022
Filed: 2005-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a frame package which has a simple structure and is superior in mass productivity.  <P>SOLUTION: In an semiconductor laser apparatus provided with a semiconductor laser element 4, a frame 6 on which the element is arranged, and a resin 5 contacting the frame, the frame includes an exposed element arrangement section 6a and the right- and left-wing sections 6c, 6d, and a resin connection hole 6i for connecting the resin from the front to the rear of the frame is formed between the element arrangement section and the left- and the right-wing sections.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007036363-A (JP)
Title: Imaging apparatus
Inventor: NOSE TAKAYOSHI
IPC: H04N5/232
Filed: 2005-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem wherein matching cannot be performed precisely by block matching, or the like when brightness, or the like differs remarkably for each image, while the positional misalignment among a plurality of images photographed under different photography conditions is detected for compositing to correct camera shake.  <P>SOLUTION: In an imaging apparatus, only a plurality of first images which have the same photography conditions, such as size and brightness are utilized for detecting the amount of motion for short time in the imaging apparatus itself, and the amount of camera shake between first and second images whose photography conditions are different is estimated from the detected amount of motion. The imaging apparatus utilizes the fact that the plurality of first and second images are photographed continuously in a short time, and the shake among respective images is nearly the same. By the estimated amount of shake between the first and second images, the first image is aligned to the second one, and luminance information, or the like can be corrected.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006038860-A (JP)
Title: Tribological debris analysis system
Inventor: KOLP JOSEPH P
IPC: G01N21/05
Filed: 2005-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tribological debris analysis system that alternately comprises a general-purpose computer, used in cooperation with an image forming device and an illumination transmitting system, and to provide a circuit board for integrating an embedded processor and an image-forming device used in cooperation with the illumination transmitting system.  <P>SOLUTION: The circuit board can be mounted on individual machines or connected to them. An illumination transmitting system 12 comprises a conduit pipe connected to a machine to be evaluated, an optical flowcell 24, a pump 22 for pumping fluid into the optical flowcell connected to a by-pass conduit pipe, and a laser 26 for illuminating the fluid flowing in the by-pass conduit pipe. The image-forming device 14 detects debris in the fluid illuminated by the laser. The debris is classified by size thereof, and the inclination related to the size of debris and imaged shape characteristics of the debris are produced. Then, the wear type of object is identified, based on the shape characteristics.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007031975-A (JP)
Title: Sliding door unit with door pocket
Inventor: TOKIWA KOJI
IPC: E06B3/46
Filed: 2005-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sliding door unit with a door pocket for inspecting a sliding door travel guiding part in the door pocket with excellent workability.  <P>SOLUTION: A door pocket wall body 10 is composed of a skeleton body of combining a plurality of vertical materials 11 and horizontal materials 12, and is fixedly arranged in a door frame 1 in a door pocket area in the door frame 1. An outside surface of its door pocket wall body 10 is covered with a door pocket wall surface panel 24 detachably supported by fitting an edge part in a groove part 22 arranged in the door frame 1. This door pocket wall surface panel 24 is pressed down and fixed from the door pocket port side by a mullion material 28 detachably installed in an edge part on the door pocket port side of the door pocket wall body 10.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007035751-A (JP)
Title: Inspection method of mount component
Inventor: HARADA MASANAO
IPC: H05K3/34
Filed: 2005-07-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a means for reliably inspecting a soldered state for a chip capacitor connected on a package substrate at the time of soldering it.  <P>SOLUTION: The soldered state of the chip capacitor 1 is inspected by bringing one of two probes into contact with a first electrode 1a of the chip capacitor 1, and the other probe with a first land 3a joined to the first electrode 1a by soldering and then measuring the electric resistance between the two probes by a measuring portion 7. This method provides the reliable inspection of the soldered state of the chip capacitor 1 connected to the lands 3a and 3b on the package substrate 2 at the time of soldering it.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007036512-A (JP)
Title: Unjust connection detector
Inventor: MIYAZAKI MASAHITO
IPC: H04B3/46
Filed: 2005-07-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an unjust connection detector capable of sufficiently ensuring the security of data flowing on a data line while being capable of reducing a workload for an administrator or the like, by informing the administrator or the like of the connection of an unjust device when the unjust device is connected to the data line.  <P>SOLUTION: The unjust connection detector 1 transmits the signal of a resonance frequency to the data line 5, and measures a voltage-drop level in this case. The voltage-drop level detected in this case is compared with the voltage-drop level in the case of a previous measurement, and is decided whether or not some changes occur in data-processing terminals 3 connected to the data line 5. When changes are decided in this case, alarms are output.  <P>COPYRIGHT: (C)2007,JPO&INPIT