baber/WOPTO huggingface dataset:
Patent TW-202238405-A (TW)
Title: Semiconductor storage device
Inventor: TAKAHASHI MASAAKI
IPC: G06F1/16
Filed: 2021-05-28
Abstract: According to one embodiment, a semiconductor storage device includes: a casing, a first board, a second board, a semiconductor memory component, a connector, and a flexible conductive part. The first board is in the casing. The second board is in the casing. The semiconductor memory component is in the casing. The semiconductor memory component is on the first board. The connector is connectable to a host device. The connector is mounted on the second board, the connector protruding from the casing. The flexible conductive part is between the first board and the second board. The flexible conductive part electrically connects the first board and the second board. The flexible conductive part is bendable.
Patent TW-202200086-A (TW)
Title: Dentition corrective device
Inventor: ISHIGAME MASARU
IPC: A61N1/08
Filed: 2021-06-04
Abstract: A dentition corrective device (10) which has a significantly simplified structure and can promote movement of teeth is worn to cover the gum (7) at least at portions (9a) between dental roots of maxillary teeth (3). The dentition corrective device (10) is provided with permanent magnets (12) at portions corresponding to the gum (7) at least at the portions (9a) between dental roots. Additionally, the dentition corrective device (10) may be configured to be attachable to a mouthpiece (1) which is worn to cover the maxillary teeth (3) and straighten the maxillary teeth (3).
Patent TW-202228183-A (TW)
Title: Apparatus, system and method for processing station impedance adjustment
Inventor: KIM GIYOUL
IPC: H01J37/32
Filed: 2021-06-21
Abstract: The invention relates to an apparatus, system and method for processing station impedance adjustment. The apparatus for impedance adjustment of a single processing station may include a heating tray including a first ground grid and a second ground grid, the first ground grid and the second ground grid covering different regions of the heating tray; a first tuner connected to the first grounding grid and comprising a first adjustable capacitor and a first sensor for detecting current; and a second tuner connected to the second grounding grid and comprising a second adjustable capacitor and a second sensor for detecting current.
Patent TW-202219648-A (TW)
Inventor: KONO MICHIO
IPC: G02B19/00
Filed: 2021-06-29
Abstract: 成像光學系統包括調整器，用於藉由向每一反射表面的後表面施加力來調整至少兩個反射表面中的每一者的形狀。藉由將調整器的力作用點投射在相對於反射面界定的光軸方向上而獲得的點被界定為校正點，作用點被設置為使得當從物件平面上的一個點發射出的光通量中的第一和第二光線時物件平面被第一反射表面和第二反射表面反射時，第一光線撞擊第一反射表面的校正點但沒有撞擊第二反射表面的校正點，第二光線沒有撞擊第一反射表面的校正點但撞擊第二反射表面的校正點。
Patent TW-202220172-A (TW)
Title: Semiconductor memory element
Inventor: KIM YOUNG-KWAN
IPC: H01L27/108
Filed: 2021-07-15
Abstract: A semiconductor memory element is provided. The semiconductor memory element includes a substrate including a memory cell region and a peripheral circuit region, an active region located in the memory cell region, a gate pattern buried in the active region, a conductive line disposed on the gate pattern, a first region including a plurality of peripheral elements placed in the peripheral circuit region, a dummy pattern buried in the peripheral circuit region, and a second region which includes the dummy pattern and does not overlap the first region.
Patent TW-202208288-A (TW)
Title: Safety devices, glass melting equipment, and glass products wherein the safety device is for accommodating a glass melting tank suitable for preparing, processing and/or holding a glass melt
Inventor: SCHMITT STEFAN
IPC: C03B7/02
Filed: 2021-07-30
Abstract: The present invention relates to a safety device for accommodating a glass melting tank suitable for preparing, processing and/or holding a glass melt. The present invention also relates to a glass melting equipment comprising the safety device and a glass melting tank for preparing, processing and/or holding a glass melt. The present invention also relates to a glass product which is or can be made with the glass melting equipment.
Patent TW-202240336-A (TW)
Inventor: LIN CHIA-LIANG
IPC: G06F1/06
Filed: 2021-08-03
Abstract: A quadrature clock generator includes a variable delay clock generator configured to receive a first clock and a third clock and output a second clock and a fourth clock in accordance with a control signal, wherein the first clock and the third clock are substantially the same but offset in timing by one half of the period; a quadrature phase error detector configured to receive the first clock, the second clock, the third clock, and the fourth clock and output a first phase detection signal and a second phase detection signal, wherein the first phase detection signal represents a relative timing between the first clock and the second clock and the second phase detection signal represents a relative timing between the second clock and the third clock; and an amplifier configured to amplify a difference between the first phase detection signal and the second phase detection signal into the control signal.
Patent TW-202211412-A (TW)
Inventor: PARK SANG-CHEON
IPC: H01L23/31
Filed: 2021-09-01
Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.
Patent TW-202236799-A (TW)
Title: Power amplifier circuit
Inventor: KONDO MASAO
IPC: H03F3/24
Filed: 2021-09-08
Abstract: A power amplifier circuit includes an amplification unit, a heating unit, and a control circuit. The amplification unit is configured to amplify a radio-frequency signal. The heating unit is provided adjacent to the amplification unit. The heating unit includes one or more transistors configured to generate heat that increases as the passing current increases. The control circuit is coupled to the one or more transistors. The control circuit is configured to increase the passing current when the environmental temperature is a predetermined threshold or lower.
Patent TW-202315304-A (TW)
Inventor: WANG WEI-YU
IPC: H03F1/30
Filed: 2021-09-16
Abstract: 本發明提供一種電壓比較器的及其操作方法。電壓比較器包括放大電路、參考電流源以及暫態電流源。放大電路的第一輸入端與第二輸入端分別接收目標電壓所對應的第一對應電壓與參考電壓。參考電流源耦接至放大電路，以提供參考電流。暫態電流源耦接至放大電路，以選擇性地提供暫態電流。暫態電流源偵測目標電壓所對應的第二對應電壓的轉態，以動態調整暫態電流。因此，在目標電壓發生電壓驟升時，暫態電流源可以暫時性的加大放大電路的電流，進而加速放大電路的反應速度。
Patent TW-202224778-A (TW)
Inventor: OGATA NOBUHIRO
IPC: B05B1/30
Filed: 2021-09-30
Abstract: 本發明提供一種可於液體處理之中提昇去除目標物的去除效率之技術。本發明之基板處理裝置，具備流體供給部、處理液供給部、噴嘴。流體供給部，供給含有受加壓之純水的蒸氣或霧滴之流體。處理液供給部，供給至少含有硫酸之處理液。噴嘴具備第一噴吐口、第二噴吐口、導出通道。第一噴吐口，噴吐由流體供給部供給之流體。第二噴吐口，噴吐由處理液供給部供給之處理液。導出通道，連通至第一噴吐口及第二噴吐口，並導出由第一噴吐口噴吐之流體與由第二噴吐口噴吐之處理液之混合流體。又，導出通道的剖面積大於第一噴吐口的剖面積。
Patent TW-202247395-A (TW)
Inventor: HUANG TSE-YAO
IPC: H01L23/528
Filed: 2021-10-05
Abstract: 本揭露提供一種具有錐形輪廓接觸點的半導體元件及其製備方法。該半導體元件具有一基底，包括一第一區與一第二區；一第一閘極結構，設置在該第一區上；以及一第二閘極結構，設置在該第二區上；一第一接觸點，包括一第一下部以及一第二上部，該第一下部設置在該第一閘極結構的一上表面上，該第一上部設置在該第一下部上；以及一第二接觸點，包括一第二下部以及一第二上部，該第二下部設置在該第二閘極結構的一上表面上以及在該第二閘極結構的一側壁上，該第二上部設置在該第二下部上。該第一下部的各側壁呈錐形，且該第二下部的各側壁大致呈垂直。
Patent TW-202315674-A (TW)
Title: Plasma fine bubble liquid generating device
Inventor: WU JONG-SHINN
IPC: C02F1/68
Filed: 2021-10-08
Abstract: A plasma fine bubble liquid generating device includes a fine bubble producer, a gas supplying source, a first plasma producer, a second plasma producer, a power supply and a control module. The fine bubble producer is configured to produce fine bubbles in a liquid. The gas supply is configured to supply a working gas. The first plasma producer is configured to produce a first plasma gas from the working gas. The second plasma producer is configured to produce a second plasma gas from the working gas. The power supply is configured to supply electricity to the first and the second plasma producers. The control module is configured to adjust power-supplying conditions of the power supply to the first and the second plasma producers. The first and the second plasma gases are guided to the liquid.
Patent TW-202229253-A (TW)
Title: Tlr7/8 antagonists and uses thereof
Inventor: SHERER BRIAN A
IPC: A61K31/4985
Filed: 2016-12-19
Abstract: The present invention relates to compounds of Formula I and pharmaceutically acceptable compositions thereof, useful as TLR7/8 antagonists.
Patent TW-202318439-A (TW)
Inventor: LIAO CHIEN-HUNG
IPC: G16H50/20
Filed: 2021-10-18
Abstract: 本發明揭露一種前後骨盆放射影像分析方法及系統，分析方法包含以下步驟：輸入複數個骨盆訓練影像；進行複數個骨盆訓練影像的髖關節重點區域運算，標示複數個骨盆影像當中的重點區域影像；進行重點區域影像的髖關節分類運算，檢測對應重點區域影像的影像分類；建立前後骨盆放射影像分析模型；輸入前後骨盆放射影像，進行髖關節重點區域運算及髖關節分類運算，取得對應的重點區域影像及影像分類；以及將分類結果輸出。
Patent TW-202223454-A (TW)
Title: Film for manufacturing optical film, and method for manufacturing optical film
Inventor: NAKATANI MASAKI
IPC: C08F16/06
Filed: 2021-10-25
Abstract: Provided are a film for manufacturing an optical film, the film having good yield and enabling an optical film having excellent optical performance to be obtained, and a method for manufacturing an optical film through use of such a film for manufacturing an optical film. The present invention is a film for manufacturing an optical film, the film including polyvinyl alcohol, wherein the ratio Rt ([eta]* 1(30)/[eta]* 1(80)) of the complex viscosity [eta]* 1(30) and the complex viscosity [eta]* 1(80) is 4.5-50 in measurement of the dynamic viscosity of a solution in which the film for manufacturing an optical film is dissolved so that the concentration of the polyvinyl alcohol is 12 mass%. [The complex viscosity [eta]* 1(30) is the complex viscosity at an angular frequency of 1 rad/second obtained from dynamic viscoelasticity measurement of the solution at 30 DEG C, and the complex viscosity [eta]* 1(80) is the complex viscosity at an angular frequency of 1 rad/second obtained from dynamic viscoelasticity measurement of the solution at 80 DEG C.].
Patent TW-202319669-A (TW)
Title: Self-closing apparatus for gas in pipeline including an apparatus body having adjacent gas passages, a pressure chamber and an assembly hole
Inventor: ZHUANG JIA-SONG
IPC: F16K17/04
Filed: 2021-11-02
Abstract: A self-closing apparatus for gas in a pipeline includes an apparatus body having gas passages, a pressure-bearing chamber and an assembly hole adjacent to each other. The burning gas passage is provided with an automatic valve, a control mechanism is disposed on a side opposite to the pressure-bearing chamber, and the assembly hole is provided with a reset mechanism extending outside the apparatus body. When the pressure of the burning gas is within a preset pressure range, the automatic valve is kept in the open position by the control mechanism, so as to maintain the gas passage unblocked. When the pressure of the burning gas is lower or higher than a preset pressure, the control mechanism releases the automatic valve, causing the automatic valve to be closed to block the burning gas passage. At the same time, the automatic valve is interlocked with the control mechanism and abutted against the reset mechanism. After confirming that the pressure of the burning gas has returned to normal, the reset mechanism is manually operated, and the automatic valve will return to the open positions to restore the flow of the gas.
Patent TW-202320408-A (TW)
Title: 電子裝置及其製造方法
Inventor: PAN YING-CHIEH
IPC: H01Q1/22
Filed: 2021-11-04
Abstract: 一種電子裝置，其製造方法係於一具有反射件之電路板上藉由複數導電元件堆疊一承載結構，且於該承載結構之相對兩側分別配置微帶線及一通訊連接該反射件之天線層，並於該承載結構上設置天線間隔件，再以封裝層包覆該天線間隔件，之後於該封裝層上形成一通訊連接該天線層之天線部，藉由將該微帶線設於該承載結構之底層及將該天線層設於該承載結構之頂層，以獲取較佳的天線效能。
Patent TW-202221829-A (TW)
Title: Semiconductor strip dicing and sorting equipment, package body drying device and delivery device that effectively removes moisture left on a packaging body
Inventor: LEE YOUNG-HWAN
IPC: F26B23/00
Filed: 2021-11-16
Abstract: An embodiment of the present invention provides semiconductor strip dicing and sorting equipment, a package body drying device and a delivery device. An air spraying device according to the embodiment of the present invention for use in the semiconductor strip dicing and sorting equipment to dry an individualized package body includes: a housing; an air inlet formed in one side of the housing; a heater arranged in the housing at a periphery of the air inlet; a heat conduction film transmitting thermal energy produced by the heater; and an air outlet formed in an opposite side of the housing. According to the embodiment of the present invention, air having thermal energy is sprayed onto the package body via the heater and the heat conduction film, so as to effectively remove moisture left on the package body.
Patent TW-202325938-A (TW)
Title: Flower plate structure and weaving method thereof capable of producing different weaving patterns
Inventor: LIN WEI-FU
IPC: D04B27/00
Filed: 2021-12-17
Abstract: The invention relates to a flower plate structure and a weaving method thereof. The flower plate structure is mainly composed of a first flower plate, a first driving mechanism, a second flower plate, a second driving mechanism, a third flower plate, a third driving mechanism, a fourth flower plate, a fourth driving mechanism and a fixing member. By using the outer periphery of the first flower plate provided with protrusions and indentations with different heights, the outer periphery of the second flower plate provided with protrusions and indentations with different heights, the outer periphery of the third flower plate provided with protrusions and indentations with different heights and the outer periphery of the fourth flower plate provided with protrusions and indentations with different heights to perform weaving, it is able to achieve the effect of producing different weaving patterns.
Patent TW-202328749-A (TW)
Inventor: CHANG CHIEN-PANG
IPC: G02B15/14
Filed: 2022-01-14
Abstract: An imaging lens has an optical axis and includes a lens element, a light blocking sheet, and a lens barrel accommodating the lens element and the light blocking sheet. The optical axis passes through the lens element. The light blocking sheet includes a first object-side surface, a first image-side surface, a first inner ring surface, a first microstructure, and a nanostructure layer. The first object-side surface is disposed opposite to the first image-side surface and is in physical contact with the lens element. The first inner ring surface is connected to and located between the first object-side surface and the first image-side surface and surrounds the optical axis to define a first aperture. The first microstructure is at least disposed on the first object-side surface or the first image-side surface. The first microstructure has a plurality of protrusions. The first nanostructure layer is at least disposed on the first inner ring surface. A material of the first nanostructure layer includes aluminium oxide, and the first nanostructure layer has a plurality of ridge-like protrusions extending non-directionally.
Patent TW-202244988-A (TW)
Title: Selective silicon trim by thermal etching
Inventor: MUSSELWHITE Nathan
IPC: H01L21/311
Filed: 2022-01-24
Abstract: Methods and apparatuses for precise trimming of silicon-containing materials are provided. Methods involve oxidizing silicon-containing materials and thermally removing the oxidized silicon-containing materials at particular temperatures for a self-limiting etch process. Methods also involve a surface reaction limited process using a halogen source and modulated temperature and exposure duration to etch small amounts of silicon-containing materials. Apparatuses are capable of flowing multiple oxidizers at particular temperature ranges to precisely etch substrates.
Patent TW-202248911-A (TW)
Title: Compact silicon qubit cell with embedded readout
Inventor: GONZALEZ-ZALBA MIGUEL FERNANDO
IPC: G06N10/00
Filed: 2022-02-23
Abstract: A quantum device is disclosed having an LC resonator circuit for performing qubit measurement or readout. The device comprises a silicon layer 601, a dielectric layer 603 disposed upon and forming a functional interface with the silicon layer 601, a first metallic region 614 disposed upon the dielectric layer 603, and a second metallic region 624 disposed upon the dielectric layer 603 and laterally separated from the first metallic region 614. The first and second metallic regions 614, 624 are arranged to be electrically connected such that a double quantum dot, forming a qubit having a first state and a second state, can be induced beneath the first and second metallic regions 614, 624 at the functional interface. The double quantum dot provides a capacitor C1 in the LC resonator circuit and the capacitance of the double quantum dot is dependent on the state of the qubit. The first metallic region 614 provides an inductor L1 in the LC resonator circuit, and the resonant frequency of the LC resonator circuit is dependent on the state of the qubit such that the state of the qubit can be measured or inferred.
Patent TW-202303769-A (TW)
Title: Semiconductor device and method for forming the same
Inventor: HO YI-CHEN
IPC: H01L21/76
Filed: 2022-04-11
Abstract: In an embodiment, a device includes: an isolation region on a substrate; a first semiconductor fin protruding above the isolation region; a second semiconductor fin protruding above the isolation region; and a dielectric fin between the first semiconductor fin and the second semiconductor fin, the dielectric fin protruding above the isolation region, the dielectric fin including: a first layer including a first dielectric material having a first carbon concentration; and a second layer on the first layer, the second layer including a second dielectric material having a second carbon concentration, the second carbon concentration greater than the first carbon concentration.
Patent TW-202305150-A (TW)
Title: Beta enhanced titanium alloys and methods for manufacturing beta enhanced titanium alloys
Inventor: SIMONE MATTHEW W
IPC: C22C14/00
Filed: 2022-05-19
Abstract: An α-β titanium alloy, comprising aluminum, vanadium, and molybdenum. The α-β titanium alloy comprises between 5.0wt% and 8.0wt% aluminum (Al), between 1.0wt% and 5.5wt% Vanadium (V), and between 0.75wt% and 2.5wt% molybdenum (Mo). The α-β titanium alloy having a density between 4.35 g/cc and 4.50 g/cc.
Patent TW-202303407-A (TW)
Inventor: KAKKIRENI PRASHANTH KUMAR
IPC: G06F11/30
Filed: 2022-05-30
Abstract: 各個實施例可以包括用於片上系統（SoC）內的多個芯粒的電源管理的方法和系統。各個系統可以包括：電源管理積體電路（PMIC），其被配置為跨共享電源軌向第一芯粒和第二芯粒供應電力。第一芯粒可以被配置為遍及第一芯粒來獲得第一感知資訊。第二芯粒可以被配置為遍及第二芯粒來獲得第二感知資訊，以及可以被配置為基於第二感知資訊來向第一芯粒發送電壓改變訊息。第一芯粒可以被配置為基於第一感知資訊和電壓改變訊息來向PMIC發送電源軌調整訊息。PMIC可以被配置為調整第一芯粒和第二芯粒中的至少一者的電壓。
Patent TW-202331149-A (TW)
Title: Cylindrical heating unit and exhaust gas processing device comprising cylindrical heating unit
Inventor: OHMAE HIDEHARU
IPC: F23G7/06
Filed: 2022-05-30
Abstract: A cylindrical heating unit 14 of an exhaust gas processing device 1 is installed in a reactor 10. The cylindrical heating unit 14 has an exhaust gas introduction port 15 at an insertion base and a heated exhaust gas outlet 16 at an insertion end. The cylindrical heating unit 14 is formed from a hollow cylinder 20, insulators 30, an electric heater H, and a holding member 40. The hollow cylinder 20 has a two-layered structure that is formed from an inner cylinder 21 and an outer cylinder 22 that are metal. The insulators 30 are provided at intervals in a heater installation space P that is between the inner cylinder 21 and the outer cylinder 22 and surround the inner cylinder 21. The electric heater H is mounted on the insulators 30. The holding member 40 is attached to one or both of the inner cylinder 21 and the outer cylinder 22 and holds the insulators 30 in the heater installation space P.
Patent TW-202327110-A (TW)
Title: Sensor package structure
Inventor: CHANG CHIA-SHUAI
IPC: H01L31/0203
Filed: 2022-06-15
Abstract: The present invention provides a sensor package structure, which includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer having a ring shape and disposed on an inner surface of the light-permeable layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds an outer side of a sensing region of the sensor chip. A portion of the shielding layer in contact with the light-curing layer defines a ring-shaped distribution region having at least one light-permeable slot. The sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer therefrom.
Patent TW-202241620-A (TW)
Title: Electrode pressurizing mechanism of impedance welding machine, impedance welding machine, welding method and manufacturing method for electromagnetic shutter device control pressurizing force
Inventor: MATSUI AKIO
IPC: H01F7/00
Filed: 2021-03-24
Abstract: A purpose of the disclosure is to provide a pressurizing mechanism of impedance welding machine capable of controlling pressurizing force of the workpiece without influence of pressurizing force of the impedance welding machine body. The upper electrode (2) is upwardly and downwardly moved by means of the pressurizing mechanism of the impedance welding machine body. The electrode pressurizing mechanism of the impedance welding machine for pressurizing and welding a pair of workpieces (30, 31) configured between the upper electrode (2) and a lower electrode (5) comprises: a load bearing component (6) disposed at the lower electrode (5), being in contact with the upper electrode (2) to take the pressurizing force applied by the impedance welding machine body.
Patent TW-202314234-A (TW)
Title: Low contrast non-referential defect detection
Inventor: BASISTYY ROMAN S
IPC: G01N21/956
Filed: 2022-07-19
Abstract: Disclosed herein are examples of defect detection techniques for inspecting semiconductor devices, such as CMOS image sensors, during the manufacturing process. The defects can include common defects, such as scratches, dirt, etc., as well as low-contrast defects, such as watermarks. The detection technique may use a supervised machine learning network.
Patent TW-202322685-A (TW)
Title: Metal resin composite electromagnetic shielding material
Inventor: YAMAMOTO YUKITO
IPC: H05K9/00
Filed: 2022-07-20
Abstract: The present invention provides a metal resin composite electromagnetic shielding material which is obtained by stacking N-number of metal layers (N represents an integer of 1 or more) and M-number of resin layers (M represents an integer of 1 or more), with adhesive layers being interposed therebetween, wherein an adhesive layer that is closest to the outer surface of the metal resin composite electromagnetic shielding material has an air bubble proportion of 4.5% or less when the adhesive layer is observed from the resin layer side.