baber/WOPTO huggingface dataset:
Patent TW-530431-B (TW)
Title: Connection structure between battery cells, and connection method
Inventor: HIRANO FUJIO
IPC: H01M50/529
Filed: 2001-12-11
Granted: 2003-05-01
Abstract: The present invention provides a connection structure between cells, and connection method, capable of easily and reliably carrying out a projection welding operation, always securing a good welding quality, and eliminating solution leakage problem between adjacent cells. To solve the problem, a plurality of projections (29, 30) for projection welding are formed respectively on the opposite sides of a connector (27). The electrode plate (22) of the sealing member (20) of one of two adjacent cells (Ba1) is bonded and connected by projection welding to a side of the connector (27) by way of the projections (29), while the cell case (19) of the other cell (Ba2) is bonded and connected by projection welding to the other side of the connector (27) by way of the projections (30). In this way, a plurality of cells (Ba1-Ba2) are connected in series.
Patent TW-533114-B (TW)
Title: Friction stirring and joining method and hollow shape work for friction stirring and joining
Inventor: EZUMI MASAKUNI
IPC: B23K20/12
Filed: 2001-12-27
Granted: 2003-05-21
Abstract: This invention relates to a friction stirring and joining method and hollow shape works adapted to the same The object of the present invention is to provide a friction stirring and joining method capable of performing light and excellent joining. The solution of the present invention is that face plates 11, 12 of a hollow shape work 10 and face plates 21, 22 of a hollow shape work 20 are butted to each other. Projecting parts 28 of the face plates 21, 22 are inserted in grooves 18 of the face plates 11, 12 of the butted parts. A connection plate 14 is orthogonal to the face plates 11, 12. No connection plate orthogonal to the face plates 21, 22 is provided on an end of the hollow shape work 20. The face plate 21 (22) is tried to move in the thickness direction of the hollow shape works 10, 20 by the heat caused by the friction stirring and joining, but the movement is suppressed by the grooves 18 and the projecting parts 28. Thus, the butted parts can be joined flat with each other. Any connection plate corresponding to the connection plate 14 can be omitted, and the weight of the hollow shape work 20 can be reduced.
Patent TW-548665-B (TW)
Title: Multilayer ceramic capacitor and manufacturing method thereof
Inventor: NISHINO TAKAYUKI
IPC: C04B35/46
Filed: 2001-12-31
Granted: 2003-08-21
Abstract: A multilayer ceramic capacitor comprises a sintered ceramic compact including primary crystalline phases and secondary phases. The primary crystalline phases mainly contain CaTiO3 and CaZrO3. The secondary phases mainly contain Si and Ca. The containing ratio of Ca in the secondary phase is 30 mol % or less.
Patent TW-521401-B (TW)
Title: Flash memory cell structure and its manufacturing method
Inventor: CHU KUO-WEI
IPC: H01L21/8244
Filed: 2002-02-06
Granted: 2003-02-21
Abstract: Flash memory cell structure and its manufacturing method are disclosed, characterized in that: the floating gate and select gate are formed by self-aligned etching except the control gate that is defined by photolithography process. The process is simplified and the integrity is increased. Besides, the isolation spacer is formed on the sidewalls of the select, floating and control gates and thus the bridge of source and select gate can be prevented.
Patent TW-569167-B (TW)
Title: LCD-module
Inventor: FAUST BERNHARD
IPC: G02F1/13
Filed: 2002-02-08
Granted: 2004-01-01
Abstract: This invention relates to a LCD-module, which has at least one LCD, a supporter for the LCD, a key arranged on a side of the module, and a contact-foil to realize a key-function, where the contact-foil is arranged directly on the supporter.
Patent TW-I254539-B (TW)
Title: Channel-based internet network for a satellite system
Inventor: NOBAKHT LIDA
IPC: G06Q30/06
Filed: 2002-03-18
Granted: 2006-05-01
Abstract: A channel-based Internet access system is implemented using a satellite system. In one embodiment, upstream data transfer from a user terminal to the Internet is provided by a terrestrial communication system, and downstream data transfer from the Internet to the user terminal is provided by a satellite system. In another embodiment, both upstream and downstream data transfer between a user terminal and the Internet are provided by a satellite system. In both embodiments, channel table information (including a plurality of Internet addresses with corresponding channel numbers and channel names) is downloaded from the Internet to the user terminal by the satellite system.
Patent TW-571596-B (TW)
Title: Method and apparatus for channel management for point-to-multipoint services in a communication system
Inventor: CHEN TAO
IPC: H04B7/005
Filed: 2002-03-28
Granted: 2004-01-11
Abstract: To enable both point-to-multipoint and point-to-point communication services in an existing cellular communication system infrastructure, a apparatus and system for channel management and overhead functions associated with use of the assigned channels for point-to-multipoint services in the cellular communication system infrastructure are described.
Patent TW-546797-B (TW)
Title: Multi-chip and flip-chip module with dual-sided package
Inventor: JANG CHIAN-WEI
IPC: H01L23/28
Filed: 2002-06-19
Granted: 2003-08-11
Abstract: The present invention provides a multi-chip and flip-chip module with dual-sided package, which is characterized in pre-providing and pressing the pre-solder for packaging chip on the bump pads on two sides of the module. This method is able to provide a higher chip package density and reduce the flowchart steps of packaging chip, thereby increasing the productivity. Furthermore, the pressed pre-solder can provide larger bonding area and co-planarity to the bump pad of the flip chip, so as to solve the difficulty of precise alignment in packaging and the problem in easy slide, thereby greatly increasing the package yield rate of flip chip.
Patent TW-556317-B (TW)
Title: Field effect transistor formed on an insulative substrate and integrated circuit thereof
Inventor: HAYASHI YUTAKA
IPC: H01L29/786
Filed: 2002-08-27
Granted: 2003-10-01
Abstract: The present invention relates to a field effect transistor formed on a semiconductor thin film formed on an insulating substrate, and to an integrated circuit thereof. Provided is a structure such that a maximum allowable voltage in an output voltage is improved and a bipolar transistor is attained. A field effect transistor according to the present invention employs a structure in which a body contact region is interposed between source regions in order to realize a higher maximum allowable voltage with a smaller area. In order to realize the bipolar transistor with an increased channel width without external wirings for fixing a body potential, a structure of a transistor is also formed in which a drain/source region, a first gate electrode, a portion where a body contact region is arranged with a second region having a first conductivity type, a second gate electrode, and a source/drain region are arranged. With the structure, a transistor capable of operating at both of positive and negative potentials with respect to a conventional body potential is provided.
Patent TW-569226-B (TW)
Title: Memory device
Inventor: FUNABA SEIJI
IPC: G11C7/10
Filed: 2002-09-05
Granted: 2004-01-01
Abstract: In a memory device having a controller and multiple memory modules both of which are mounted together on a motherboard, a high-speed operation is executed by suppressing waveform distortion caused by signal reflection. Since signal reflection occurs when a controller performs the writing/reading of data relative to memory units on memory modules, active terminator units are included in the controller and the memory units. These active terminator units are provided for a data bus and/or a clock bus in order to terminate these buses in memory units. The active terminator units provided for the controller and the memory units may be put into an inactive state when data is to be received.
Patent TW-591325-B (TW)
Title: A photomask of the hypershot exposure mode and a monitoring method with the same
Inventor: HUANG SHUI
IPC: G03F1/00
Filed: 2002-09-12
Granted: 2004-06-11
Abstract: A photomask of the hypershot exposure mode and a monitoring method with the same is provided. The photomask is for the hypershot exposure mode and used to form a panel pattern on a liquid crystal display. The photomasks are set a mark on the side of the target at the overlap. The marks are then showed on both side of the target after linkage the photomasks. After exposure and development, the distance between the definition edge of marks that exposed by using the photomasks of hypershot exposure mode is utilized to judge the overlapping condition of the photomasks.
Patent TW-586192-B (TW)
Title: A method of fabricating a semiconductor package
Inventor: HE XIPING
IPC: H01L21/44
Filed: 2002-10-18
Granted: 2004-05-01
Abstract: Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.
Patent TW-571409-B (TW)
Title: Optical device and packaging method thereof
Inventor: TAO SU
IPC: H01L27/146
Filed: 2002-12-03
Granted: 2004-01-11
Abstract: An optical device. The optical device includes a substrate, an optical sensor, a plurality of spacers, a plurality of wires, and a transparent molding compound. The optical sensor is attached to the substrate, wherein a surface of the optical sensor for receiving an optical signal is the far side from the substrate. The spacers are distributed over between the substrate and optical sensor. The wires electrically connect the substrate and optical sensor, respectively. The transparent molding compound covers the optical sensor. In this case, the diameter of each of the spacers is equal to the thickness of the transparent molding compound minus the thickness of the optical sensor and the distance between where the optical signal enter the transparent molding compound and where the optical signal is retrieved. Furthermore, this invention also discloses a packaging method for the optical device.
Patent TW-I220582-B (TW)
Title: Plug for speaker connection wire and speaker terminal and related speaker connector
Inventor: KIKUCHI EIJI
IPC: H01R12/79
Filed: 2002-12-05
Granted: 2004-08-21
Abstract: The present invention provides a connection wire plug; a speaker terminal such as amplifier in connection with the plug; and a connector using the said plug and terminal, wherein speaker terminals such as a speaker and an amplifier can be connected with the connection wire easily and correctly without incorrect connection for a multi-channel stereo system with various large and small speakers like those in a home theater. Its front side has a terminal insertion hole 2 for positive and negative poles and Its back side has the corresponding connection wire insertion hole 3 of the said two poles, in which the two terminal holding springy legs 5a, 5b for holding the inserted speaker terminal to the terminal insertion hole 2 are installed inside the hollow plug body 1; meanwhile two flexible connection wire holding legs 6a, 6b are installed for holding lead w2 of connection inserted into the said connection wire insertion holes 3, which are connected with the legs 5a, 5b; the connection wire holding legs 6a,6b employ operation plate 7 outside the plug body 1 to control the open/close of the connection wire holding part.
Patent TW-I226321-B (TW)
Title: System for recycling organic waste material
Inventor: LI YUAN-FENG
IPC: C05F9/04
Filed: 2002-12-20
Granted: 2005-01-11
Abstract: A system for recycling organic waste material includes mixing microorganisms in organic kitchen refuse rich in nutrition in order to breed beneficial microorganisms by the nutrient of the organic refuse, while using the bacterium species advantages to eliminate blight in the organic refuse; separating solid from liquid from the organic refuse and separately performing a fermentation operation thereon in order to decompose the proteins, fats, nucleic acids, and polysaccharides in the kitchen refuse into natural amino acids, fatty acids, nucleotides, and glucose, etc. needed by plants for growth, thereby producing a solid organic fertilizer and a liquid organic fertilizer.
Patent TW-586015-B (TW)
Title: Micro-mirror structure, its manufacturing method, spatial light modulator and its manufacturing method
Inventor: YEH CHIH-CHIEH
IPC: G02B26/08
Filed: 2003-01-29
Granted: 2004-05-01
Abstract: The present invention provides a micro-mirror structure, its manufacturing method, spatial light modulator and its manufacturing method. The inventive micro-mirror structure includes: a transparent substrate; a supporting structure connected to partial surface of the transparent substrate; a deflectable element supported by the supporting structure, and deflected and coupled to the transparent substrate, wherein the deflectable element is composed of a first oxidization layer, an aluminum-containing metal layer, a titanium-containing metal film and a second oxidization layer. In accordance with the present invention, it is able to effectively prevent defects, such as metal hillock and void, from generating on the surface of the aluminum-containing metal layer.
Patent TW-I225385-B (TW)
Title: High-speed router backplane
Inventor: GOERGEN JOEL R
IPC: H05K1/00
Filed: 2003-02-06
Granted: 2004-12-11
Abstract: A high-speed router backplane is disclosed. The disclosed construction and layout techniques enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that use signaling across the backplane at trace speeds of 2.5 Gbps or greater. Specific ranges of differential trace geometry characteristics, with significant single-ended coupling to adjacent ground planes, have been found to provide the parameters needed for such signaling. New trace routing and layering techniques also help in the realization of a backplane embodiment containing roughly 600 operable high-speed differential pairs, while also providing sufficient electromagnetic interference management to allow power distribution to occur within the same backplane.
Patent TW-588396-B (TW)
Title: Panel assembly for PDP and manufacturing method thereof
Inventor: KIFUNE MOTONARI
IPC: H01J11/36
Filed: 2003-02-07
Granted: 2004-05-21
Abstract: A panel assembly for a PDP having ribs of partitioning a discharge space on a substrate includes grooves each formed between adjacent ribs. Each of the grooves has deeper groove regions to be luminous areas and shallower groove regions to be non-luminous areas. Black material layers are formed on the shallower groove regions.
Patent TW-I250110-B (TW)
Title: Procedure and device for sticking
Inventor: WILD HANS-PETER
IPC: B31B50/94
Filed: 2003-03-17
Granted: 2006-03-01
Abstract: The invention relates to a method for sticking, a container, a pocket tape, a method for the production of a pocket tape, a device for the production of a pocket tape, a method for the production of an adhesive tape, an adhesive tape and a device for the production of an adhesive tape. The invention is characterized in that adhesive zones are spaced from the one another by non-adhesive zones.
Patent TW-I235737-B (TW)
Title: Manufacturing method of carbon black
Inventor: SHIEH DONG-YUAN
IPC: C01B31/02
Filed: 2003-03-14
Granted: 2005-07-11
Abstract: A kind of manufacturing method of carbon black comprises following processes: (1) performing an incomplete combustion for a hydrocarbon feed-in oil to form carbon black particles and combustible gases; (2) quenching the flue gas containing the carbon black particles and combustible gases to terminate the reaction; (3) dividing the flue gas into two streams; (4) decreasing the temperature of one of the gas streams after flue gas division, which is followed by transporting through a primary filter to separate the carbon black particles from the side product tail gas; (5) transporting the separated carbon black particles to a granulating area to mix with water and then make into wet carbon black pellets; and (6) brining the wet carbon black pellets in contact with the divided another stream of the flue gases in a dryer for drying so that carbon black can be produced. Therefore, the manufacturing method can effectively conserve energy, reduce water consumption and thus reduce production cost.
Patent TW-I223971-B (TW)
Title: Quadruple fluorescent lamp and lighting circuit device
Inventor: LIN TIAN-FU
IPC: H05B41/14
Filed: 2003-04-21
Granted: 2004-11-11
Abstract: A quadruple fluorescent lamp and lighting circuit device are disclosed, wherein the fluorescent lamp has a quadruple fluorescent lamp tube with four filaments. Each filament has two conductive wires to connect to the positive and negative electrodes of the electrical power. The operation of each filament is controlled by a transistor. A pair of capacitors are used to adjust the switching current of a pair of transistors. The base of each transistor is connected to the corresponding diode set through a current-limiting resistor. Each transistor is connected to a diode set. Four diodes are connected in series to form a circuit, the two terminals of the circuit are connected to both ends of the AC power. Thus, a lighting circuit for quadruple fluorescent lamp using DC alternative voltage is formed.
Patent TW-574129-B (TW)
Title: Method of making microstructure unit and microstructure unit
Inventor: MI XIAOYU
IPC: G02B6/35
Filed: 2003-04-29
Granted: 2004-02-01
Abstract: A method of making a microstructure unit having a thin/thick portion (T1 to T3) is disclosed, which comprises: an engineering to form the pre-thin/thick portion, which is to proceed a first etching processing from the edge side of the first conductor layer (11) and the second conductor layer (12) onto the material substrate having the lamination structure, so as to form a pre-thin/thick portion (T1' to T3') on the second conductor layer (12), the pre-thin/thick portion having one pair of side surfaces isolated toward the in-plane direction of the second conductor layer (12), so as to bond the first conductor layer (11), wherein the second conductor layer (12) has the a thickness approximately equal to that of the (T1 to T3); and engineering to form the thin/thick portion, which is to proceed a second etching processing on the edge side of the first conductor layer (11) to form the thin/thick portion by removing the portion of the first conductor layer (N) at the position bonded to the pre-thin/thick portion (T1' to T3').
Patent TW-I223408-B (TW)
Title: Trench type capacitor formation method
Inventor: CHOU SHIH-CHUNG
IPC: H01L21/20
Filed: 2003-05-09
Granted: 2004-11-01
Abstract: A trench type capacitor formation method is provided. First, provide a semiconductor substrate on which deep trenches and deep trench capacitor are formed. The deep trench capacitor has a node dielectric layer and a storage node. The storage node is filled into the deep trench to a designated depth. The node dielectric layer is formed between the deep trench and deep trench capacitor. Then, execute ion implantation on the top opening of the deep trench along a specific direction, so as to form an ion implantation region on a single sidewall on top of the deep trench and on the deep-trench capacitor. Execute oxidation process to form an oxide layer on the ion implanted area. Use the oxide layer as a mask to make a semiconductor sidewall on the other sidewall of the top opening of the deep trench. After removing the oxide layer, conformally form barrier layer on the surface of the deep trench opening and fill a conduction layer into the deep trench.
Patent TW-I231244-B (TW)
Title: Clamping element with an integrated force sensor
Inventor: ONDA NICOLINO
IPC: H01L21/00
Filed: 2003-05-28
Granted: 2005-04-21
Abstract: A clamping element for the transport of a substrate in a predefined transport direction comprises a first and a second leg (2, 3) with a first and second clamping jaw (6; 7) for clamping a substrate (8). Each of the two clamping jaws (6; 7) has a clamping plate (14) which is movable in transport direction relative to the corresponding leg (2 or 3). A sensor measures the deflection of the first clamping plate (14) relative to the first leg (2). As soon as the measured deflection exceeds a predefined threshold value, the clamping element is opened.
Patent TW-I288964-B (TW)
Title: Method of manufacturing CMOS devices by the implantation of N-and P-type cluster ions and negative ions
Inventor: HORSKY THOMAS N
IPC: H01L27/092
Filed: 2003-06-25
Granted: 2007-10-21
Abstract: A system and method of implanting both negative and positive ions are generated and implanted. A method of manufacturing a semiconductor device is also described, wherein clusters of N- and P-type dopants are implanted to form the transistor structures in CMOS devices. For example, As4Hx+ clusters and either B10Hx- or B10Hx+ clusters are used as sources of As and B doping, respectively. during the implants. An ion implantation system is described for the implantation of cluster ions into semiconductor substrates for semiconductor device manufacturing. A method of producing higher-order cluster ions of As, P, and B is presented, and a novel electron-impact ion source is described which favors the formation of cluster ions of both positive and negative charge states. The use of cluster ion implantation, and even more so the implantation of negative cluster ions, can significantly reduce or eliminate wafer charging, thus increasing device yields. A method of manufacturing a semiconductor device is further described, comprising the steps of: providing a supply of dopant atoms or molecules into an ionization chamber, combining the dopant atoms or molecules into clusters containing a plurality of dopant atoms, ionizing the dopant clusters into dopant cluster ions, extracting and accelerating the dopant cluster ions with an electric field, selecting the desired cluster ion by mass analysis, modifying the final implant energy of the cluster ion through post-analysis ion optics, and implanting the dopant cluster ions into a semiconductor substrate. In general, dopant clusters contain n dopant atoms where n can be 2, 3, 4 or any integer number. This method provides the advantages of increasing the dopant dose rate to n times the implantation current with an equivalent per dopant atom energy of l/n times the cluster implantation energy. This is an effective method for making shallow transistor junctions, where it is desired to implant with a low energy per dopant atom.
Patent TW-I234633-B (TW)
Title: Light guide device and display device
Inventor: IWAUCHI KENICHI
IPC: G02B6/42
Filed: 2003-07-11
Granted: 2005-06-21
Abstract: The present invention provides a light guide device (40). The light guide device (40) as backlight is provided behind a liquid crystal display panel (92). The light guide device (40) comprises: an LED group (13) as a light source, a light guide plate (41) for color mixing, a light guide plate (42) having a light output face, a triangular prism (12) for guiding light rays from the LED group (13) to one end face of the light guide plate (41), and triangular prisms (12A, 12B) for guiding light rays from the other end face of the light guide plate (41) to one end face of the light guide plate (42), and gas layers are interposed between each of the optical members of the individual light guide plates (41, 42) and triangular prisms (12A, 12B). This enables to reduce irregularity in luminance and color when plural light sources are used and to efficiently change the traveling direction of the light.