baber/WOPTO huggingface dataset:
Patent TW-550883-B (TW)
Title: Matrix switch device high in isolation between terminals thereof, small in size, and low in manufacturing cost
Inventor: NAGANO NOBUO
IPC: H01P1/15
Filed: 2002-07-04
Granted: 2003-09-01
Abstract: A matrix switch device comprises a semiconductor integrated circuit chip comprising a 2x2 matrix switch having two input terminals and two output terminals and an SPDT switch at a stage subsequent to the 2x2 matrix switch, the SPDT switch having two input terminals and one output terminal, wherein electrical connection is performed between one of the output terminals of the 2x2 matrix switch and one of the input terminals of the SPDT switch, and wherein the two input terminals and the other of said output terminals of the 2x2 matrix switch, and the other input terminal and the output terminal of the SPDT switch are led out of the semiconductor integrated circuit chip.
Patent TW-I251039-B (TW)
Title: Semi-pure monocrystalline silicon wafers, pure monocrystalline silicon wafers and a Czochralski puller
Inventor: PARK JAE-GUN
IPC: C30B15/20
Filed: 1998-02-06
Granted: 2006-03-11
Abstract: A silicon ingot is manufactured in a hot zone furnace by pulling the ingot from a silicon melt in the hot zone furnace in an axial direction, at a pull rate profile of the ingot from the silicon melt in the hot zone furnace that is sufficiently high so as to prevent interstitial agglomerates but is sufficiently low so as to confine vacancy agglomerates to a vacancy rich region at the axis of the ingot. The ingot so pulled is sliced into a plurality of semi-pure wafers each having a vacancy rich region at the center thereof that includes vacancy agglomerates and a pure region between the vacancy rich region and the wafer edge that is free of vacancy agglomerates and interstitial agglomerates. According to another aspect of the present invention, the ingot is pulled from the silicon melt in the hot zone furnace at a pull rate profile of the ingot from the silicon melt in the hot zone furnace that is sufficiently high so as to prevent interstitial agglomerates, but is also sufficiently low as to prevent vacancy agglomerates. Accordingly, when this ingot is sliced into wafers, the wafers are pure silicon wafers that may include point defects but that are free of vacancy agglomerates and interstitial agglomerates.
Patent TW-563322-B (TW)
Title: Wireless on-line multimedia IC card pay phone
Inventor: SHIE WEN-BIN
IPC: H04L12/28
Filed: 2002-07-15
Granted: 2003-11-21
Abstract: A wireless on-line multimedia IC card pay phone facilitates general public to have wireless on-line and on-demand services and advertisement promotion and so forth in public occasion. Within the communication range of wireless local area network (WLAN) allowed in the invention, user can utilize personal portable notebook/palm computer or communication equipment to have wireless on-line and send/receive e-mail. Besides, the invention is equipped with a LCD screen display for playing regular commercial advertisement during normal hours and user only needs to plug in IC card accepted by the invention to simply use the keyboard of the invention to select the service contents.
Patent TW-541762-B (TW)
Title: Dual-band monopole antenna
Inventor: FANG SHYH-TIRNG
IPC: H01Q5/371
Filed: 2002-07-24
Granted: 2003-07-11
Abstract: A dual-band monopole antenna comprises a microwave base, a radiating component and a transmission line. The radiating component can be grouped by central radiator and few radiating arms, in which the central radiator is used to generate a resonant mode and the radiating arm is used to generate another resonant mode, thereby allowing dual-band monopole antenna to be able to be operated at two different frequencies. In practical application, each radiating arm can be symmetrically installed against both sides of the central radiator, generating excellent impedance matching by virtue of the electromagnetic coupling effect between radiating arm and central radiator. In addition, installation of multiple radiating arms can strengthen the radiating characteristics of antenna and achieve the goal of increasing the antenna gain.
Patent TW-I239450-B (TW)
Title: Apparatus, computer readable recording medium, and method for yielding to a processor within a logically partitioned data processing system
Inventor: ARMSTRONG WILLIAM JOSEPH
IPC: G06F9/00
Filed: 2002-08-20
Granted: 2005-09-11
Abstract: An apparatus, program product and method for coordinating the distribution of CPUs as among logically-partitioned virtual processors. A virtual processor may yield a CPU to precipitate an occurrence upon which its own execution may be predicated. As such, program code may dispatch the surrendered CPU to a designated virtual processor.
Patent TW-565839-B (TW)
Title: Nonvolatile semiconductor memory device
Inventor: TANZAWA TORU
IPC: G11C16/34
Filed: 2002-09-05
Granted: 2003-12-11
Abstract: In the present invention, the first column address is distributed as the first address of nonvolatile semiconductor memory device. And, the first row address is distributed as the second address, which has higher level than the first address. In addition, the second column address is distributed as the third address that has higher level than the second address.
Patent TW-561633-B (TW)
Title: LED light-emitting device
Inventor: LI RUNG-TAI
IPC: H01L33/00
Filed: 2002-09-13
Granted: 2003-11-11
Abstract: An LED light-emitting device is disclosed, which is to dispose an LED chip on the substrate. The LED chip is bonded to the electrode circuit through a gold wire, and a resin protection cover containing fluorescent agent is placed on the LED chip. The device is characterized in that: a colored lens is disposed on the LED chip packaged by resin containing fluorescent agent, and the colored lens is made by injection formation of the material mixed by PC plastic material with little amount of ultraviolet light absorbent, yellow master, green master, red master, blue master, etc. The assembly of the structure can convert the light generated from LED into the light source having color temperature of 2000 to 5000 DEG K.
Patent TW-I227637-B (TW)
Title: Image print feeding apparatus and edit processing method and background processing method
Inventor: SHIRAI MAKOTO
IPC: G06T5/50
Filed: 2002-09-16
Granted: 2005-02-01
Abstract: To provide an image print feeding apparatus which can prepare image data with realistic sensation and virtual reality, and to provide image data that a plurality of users can enjoy and in which write-in is easily carried out. It has a light source information memory part which stores light source information relating to combination variation and light intensity of lights which are turned on among the plurality of lights, an exposure information memory part which stores appropriate exposure information (of a camera on the occasion of shoot) with respect to each light source information stored in the light source information memory unit, a light intensity adjusting unit which can adjust light intensity of lights which were turned on based upon the light source information, and an exposure correcting unit which can correct exposure based upon the exposure information.
Patent TW-I272398-B (TW)
Title: Adapter method and apparatus for interfacing a tester with a device under test
Inventor: BUCZKOWSKI JONATHAN ERNEST
IPC: G01R1/073
Filed: 2002-10-08
Granted: 2007-02-01
Abstract: A fixture assembly (100, 102) is presented. The fixture assembly includes a device assembly (102) for mating with a device under test and a tester interface assembly (100) for mating with the device assembly (102) on one side and a tester on a second side. In the method and apparatus of the present invention, the device assembly (102) includes a probe field specific to a device under test and may be changed to accommodate a different device, without changing the tester interface assembly. The tester interface assembly (100) includes a frame (304) used for alignment and structural support. The frame interfaces with a probe plate (310) on one side and a load plate (302) on the other side. The probe plate (310) holds a plurality of probes in place while the load plate (302) provides a plurality of holes for the probes to extend downward through the load plate (302). A printed circuit board (PCB) (300) is positioned below the load plate (302) and makes contact with the ends of the probes. The entire tester interface assembly (100) is positioned on top of an electronic tester and maps points of contact in the tester with the probe field of the device assembly (102).
Patent TW-581995-B (TW)
Title: A backlight apparatus, and a liquid crystal display (LCD) therewith
Inventor: NITTO EIJI
IPC: F21V29/15
Filed: 2002-11-27
Granted: 2004-04-01
Abstract: Dissipation of heat generated by a luminescent source, such as a fluorescent lamp, of a backlight apparatus and an LCD therewith is enhanced by providing a proximity section in a holder, making the hottest part the closest to the holder for efficient heat conduction.
Patent TW-587369-B (TW)
Title: Method, circuit, and system for driving a signal using switchable on-die termination
Inventor: YUFFE MARCELO
IPC: H04L25/02
Filed: 2002-12-09
Granted: 2004-05-11
Abstract: A circuit for driving and receiving signals on a bus line includes a pull-up switch and a pull-down switch. The pull-up switch has an impedance that matches the characteristic impedance of the bus line. The pull-down switch has an impedance of about half of the characteristic impedance of the bus line. When the circuit is receiving a signal or driving a logic high signal on the bus line, the pull-up switch is enabled so that the bus line voltage is pulled up, while the pull-down switch is disabled to prevent the pull-down switch from pulling down the bus line voltage. When the circuit is driving a logic low signal on the bus line, the pull-down switch is enabled so that the bus line voltage is pulled down, while the pull-up switch is disabled to prevent the pull-up switch from pulling up the bus line voltage.
Patent TW-578272-B (TW)
Title: Manufacturing method of bottle shaped trench
Inventor: HUANG TUNG-WANG
IPC: H01L21/8242
Filed: 2002-12-11
Granted: 2004-03-01
Abstract: This invention provides a manufacturing method of bottle shaped trench, which comprises: firstly, providing a semiconductor substrate with a hardmask layer, which has a trench formed thereon; conformally forming a first liner layer, a second liner layer, a conductive layer and a third liner layer sequentially on the semiconductor substrate and the STI surface, in which the first liner layer and the second liner layer are different; then, filling up a predetermined depth of the trench with a sacrificial layer which is used as an etching hardmask to remove the third liner layer, and removing the sacrificial layer; performing oxidation step to the conductive layer to form an oxide layer which is used as an etching hardmask to sequentially remove the third liner layer, the conductive layer, the second liner layer and the first liner layer to expose the surface of the semiconductor substrate on the bottom of the trench; and using the oxide as a hardmask to etch the semiconductor substrate to form a bottle shaped trench.
Patent TW-I272722-B (TW)
Title: Semiconductor device and manufacturing method therefor
Inventor: KOKUBO CHIHO
IPC: H01L27/12
Filed: 2002-12-18
Granted: 2007-02-01
Abstract: To provide a method of efficiently configuring a circuit requiring high inter-device consistency by using thin-film transistors. A semiconductor layer is formed on a substrate and is patterned into desired shapes to form first semiconductor islands. The first semiconductor islands are uniformly crystallized by laser irradiation within the surface areas thereof. Thereafter, the semiconductor layers are patterned into desired shapes to become active layers of the thin-film transistors layer. Active layers of all of thin-film transistors constituting one unitary circuit are formed of one of the first semiconductor islands in this case. Thus, the TFTs mutually realize high consistency.
Patent TW-I247296-B (TW)
Title: Optical pickup actuator
Inventor: JANG DAE-JONG
IPC: G11B7/1387
Filed: 2002-12-20
Granted: 2006-01-11
Abstract: Provided is an optical pickup actuator including a bobbin, support members, and a pair of magnetic circuits. The bobbin mounts an objective lens. The support members have ends that are fixed on sides of the bobbin on a base and the other ends that are fixed to a holder placed on a portion of the base so as to move the bobbin. The pair of magnetic circuits is installed to be opposite to each other on two sides of the bobbin and on the base. The magnetic includes a tracking coil which moves the bobbin in a tracking direction, a plurality of focusing/tilling coils which move the bobbin in at least one direction of a focusing direction and a tilting direction including a focusing direction, and a magnet which faces the plurality of focusing/tilting coils and the tracking coil, and have polarized structures to move the bobbin in at least one direction of a focusing direction and a tilting direction, including a focusing direction and in the tracking direction. Accordingly, an optical pickup actuator, which is capable of securing a tracking capacity and can be made more slimmed, can be obtained using a magnetic circuit including magnets having improved polarized structures, a single tracking coil, and a plurality of focusing/tilting coils.
Patent TW-595080-B (TW)
Title: Embedded internet integrated chip controlled valve actuator
Inventor: GU JIA-LIN
IPC: F16K37/00
Filed: 2002-12-30
Granted: 2004-06-21
Abstract: The present invention provides a controlled valve actuator, including an embedded Internet integrated chip coupled to the Internet, a circuit coupled to the embedded Internet integrated chip, a A/D and D/A control circuit, a motor control circuit, a gear box connected to the motor, a medial axis connected to the gear box, a transmission mechanism, a position sensor coupled to the medial axis, an input or output circuit of the position sensor coupled to the position sensor, a torque sensor coupled to the medial axis, and an input or output circuit of the torque sensor coupled to the torque sensor. The controlled valve actuator can be connected to Internet directly in order to achieve the object of dispersed control which cannot be provided by the prior art single chip.
Patent TW-I225223-B (TW)
Title: Image input apparatus
Inventor: HASHIMOTO SEIJI
IPC: G06V40/13
Filed: 2003-02-19
Granted: 2004-12-11
Abstract: An image input apparatus for sequentially obtaining a plurality of partial images which are portions of an image of an object, by relatively moving the object and a sensor having a plurality of pixel circuit units, including a drive circuit which effects control so as to store photoelectric charge en bloc at photoelectric conversion units respectively included in the plurality of pixel circuit units, then blanket-transfer optical signals of the photoelectric conversion units respectively included in the plurality of pixels to memory units included in the corresponding pixel circuit units, and then read the photoelectric signals, and noise signals generated in the pixel circuit units in this order from the pixel circuit units.
Patent TW-580456-B (TW)
Title: Thermo-sensitive recording medium and printed object
Inventor: MONJU TAKUYA
IPC: B41M7/00
Filed: 2003-03-05
Granted: 2004-03-21
Abstract: A thermo-sensitive recording medium 1 of the present invention can acquire a rigidly adhered printed object between image data and protection film without any space, and has a melting-type copying portion 161 which consists of a melting-type base print layer 181 and a melting-type ink layer 171. The main component of the melting-type base print layer 181 comprises styrene-vinylacetate copolymer. Because styrene-vinylacetate copolymer is softened or melted due to being heated, and thus the mechanical strength is weaker, it is very easy to copy from a substrate 11 to the melting-type copying portion 161, so as to form a printing layer 47. Surface of the printing layer 47 is exposed from residual resin 49 which is made of material of the melting-type base print layer 181. However, the thermoplastic resin of styrene-vinylacetate copolymer and a protection portion 251 surface portion has a high adhesive property, so space is not produced between the protection portion 251 and the printing layer 47.
Patent TW-I228812-B (TW)
Title: Semiconductor chip module, and the heat dissipation assembly
Inventor: LIN WEI
IPC: H01L23/36
Filed: 2003-04-18
Granted: 2005-03-01
Abstract: The present invention provides a semiconductor chip module, and the heat dissipation assembly, which includes a substrate, a chip, and an integrated heat spreader, in which the chip is configured on a substrate; the integrated heat spreader is configured on a substrate by overlapping the chip and has a plurality notches, in which the notches are formed on the edges of the integrated heat spreader, respectively, and extended toward the center of the integrated heat spreader for dissipating the heat generated by the chip to the outside of the integrated heat spreader from the notches. The second aspect of the present invention discloses a heat dissipation assembly for improving the heat dissipation of semiconductor chip module, which includes an integrated heat spreader and an encapsulation, in which the integrated heat spreader is configured on the semiconductor chip module and has a plurality of notches, wherein the notches are formed on the edges of the integrated heat spreader and extended toward the center of the integrated heat spreader for dissipating the heat generated by the semiconductor chip module to the outside of the integrated heat spreader from the notches, and the encapsulation is configured between the integrated heat spreader and the semiconductor chip module.
Patent TW-I225705-B (TW)
Title: Electrostatic discharge protection device and manufacturing method thereof
Inventor: SHIH AN
IPC: H01L27/12
Filed: 2003-05-02
Granted: 2004-12-21
Abstract: An electrostatic discharge protection device at least includes: a source terminal, a drain terminal, and a gate terminal, wherein the portion of the source terminal and the portion of the drain terminal are overlapped the gate terminal to enhance the couple capacitance, and further turn on the electrostatic discharge protection device rapidly.
Patent TW-I280429-B (TW)
Title: Apparatus comprising an optical input device and at least one further optical device having a common radiation source
Inventor: DUIJVE RENE
IPC: G06F3/033
Filed: 2003-05-14
Granted: 2007-05-01
Abstract: In an apparatus comprising an optical input device (220) controlled by a moving object and also comprising at least one further optical device (230, 240) to be provided with electromagnetic radiation (225, 226), wherein the input device comprises at least one diode laser (222) for supplying at least one measuring beam to a window (221) of the input device, the rear side of at least one of the ne diode lasers of the input device is optically coupled to at least one of the other optical devices so as to supply such a device with radiation. In this way, space and cost can be saved, which makes the apparatus very suitable for small and battery-powered mobile apparatus, like a mobile phone, a hand-held computer, a laptop computer, etc.
Patent TW-I268897-B (TW)
Title: A method and unit load for distributing articles
Inventor: DICKNER ALLAN
IPC: B65D71/00
Filed: 2003-05-27
Granted: 2006-12-21
Abstract: In a method of distributing articles in a palletized form from a supplier (11) of the articles, these are placed at the supplier on two or more loading ledges (1) to form a unit load, which is transported to a receiver (13, 14) of the articles. Each loading ledge (1) comprises an L-shaped profile having projections (3) for supporting the unit load at a certain distance over its support.
Patent TW-I243346-B (TW)
Title: Product state display system and storage medium for product state display system
Inventor: KAMIYA TSUYOSHI
IPC: B60R16/023
Filed: 2003-05-29
Granted: 2005-11-11
Abstract: To make a state of an industrial product understood by a viewer at a glance in expressing the state of the industrial product by displaying an artificial living body. Since an artificial living body displayed on a display device exhibits an ""aging state"" (61 or 62) corresponding to the ""progress state of aging deterioration"" of an industrial product within its service life and a facial expression (a or b) corresponding to a ""temporary state"" of the industrial product, it is possible to allow a viewer to understand two states (progress state and temporary state) of the industrial product at a glance.
Patent TW-576914-B (TW)
Title: Light gun for pistol and rifle
Inventor: GOKO JUNICHI
IPC: F41A33/02
Filed: 2003-06-06
Granted: 2004-02-21
Abstract: A light gun includes a trigger unit; a grip coupled to the trigger apparatus; and a barrel unit coupled with the trigger apparatus. The trigger unit has a trigger and a hammer, and the barrel unit includes a light emitting unit which emits a light bullet in response to generation of an impact by the hammer when a trigger operation is carried out by pulling the trigger.
Patent TW-I251092-B (TW)
Title: Method and apparatus for controlling objective lens to prevent disc from being scratched by the objective lens
Inventor: CHOI BYOUNG-HO
IPC: G11B7/121
Filed: 2003-07-28
Granted: 2006-03-11
Abstract: A method and apparatus preventing a disc from being scratched by an objective lens. A focus pull-in operation is performed. If a level of a pull-in signal remains lower than a predetermined critical level for a predetermined critical period of time or more, the objective lens is controlled so as to move away from the disc.
Patent TW-I261921-B (TW)
Title: Semiconductor chip using both polysilicon and metal gate devices
Inventor: CLEVENGER LAWRENCE A
IPC: H01L29/43
Filed: 2003-07-30
Granted: 2006-09-11
Abstract: A semiconductor structure (and method for forming) having transistors having both metal gates and polysilicon gates on a single substrate in a single process is disclosed. The method forms a gate dielectric layer on the substrate and forms the metal seed layer on the gate oxide layer. The method patterns the metal seed layer to leave metal seed material in metal gate seed areas above the substrate. Next, the method patterns a polysilicon layer into polysilicon structures above the substrate. Some of the polysilicon structures comprise sacrificial polysilicon structures on the metal gate seed areas and the remaining ones of the polysilicon structures comprise the polysilicon gates. The patterning of the polysilicon gates forms the sacrificial gates above all the metal gate seed areas. Following that, the invention forms sidewall spacers, and source and drain regions adjacent the polysilicon structures. Then, the invention protects the polysilicon gates, removes the sacrificial polysilicon structures, and plates the metal gate seed areas to form the metal gates. The sidewall spacers self-align the metal gates. The plating process forms the metal gates of pure metal. All thermal processing that raises the temperature above a damage threshold for the metal is performed before the plating process.
Patent TW-I266393-B (TW)
Title: Substrate based unmolded package
Inventor: JOSHI RAJEEV
IPC: H01L23/498
Filed: 2003-08-13
Granted: 2006-11-11
Abstract: A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.