baber/WOPTO huggingface dataset:
Patent JP-S5985964-A (JP)
Title: Frequency measuring circuit
Inventor: HAMADA YOSHIO
IPC: G01R23/175
Filed: 1982-11-08
Abstract: PURPOSE:To enable an accurate measurement of input RF signals as two synchronous waves without errors both in the two waves by providing a dispersion type delay line for delay signals differently when two synchronous waves are inputted at the front state of a phase discrimination circuit. CONSTITUTION:When RF signals f1 and f2 are inputted as two synchronous waves into an input signal distribution circuit 9 through an input terminal 1, they are detected with a synchronous detection circuit 10 and the output of the detection circuit 10 activates a changeover circuit 11 to close a dispersion type delay line 12 between an input signal distribution circuit 9 and a phase discrimination circuit 8. The dispersion type delay line 12 causes inputted signals to be delayed differently according to the frequency of the signals and hence, separates the synchronous RF signals f1 and f2 on the time axis by passing them through the dispersion type delay line 12. The input signals f1 and f2 thus dispersed undergo a phase synthesization and detection with the phase discrimination circuit 8 separately and differentially amplified with differential amplification circuits 6 and 6' to be converted into two outputs of I=Kcostheta and Q=Ksintheta.
Patent JP-S6089093-A (JP)
Inventor: KISHIMOTO YOSHIO
IPC: H05B3/56
Filed: 1983-10-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6257222-A (JP)
Title: Manufacture of semiconductor device
Inventor: OOTA MIKIO
IPC: H01L21/306
Filed: 1985-09-06
Abstract: PURPOSE:To equalize the density of a wiring pattern and to reduce etching in the lateral direction in forming the wiring pattern, by providing a dummy pattern on a mask and on a resist pattern, which is formed by using the mask. CONSTITUTION:Resist is exposed by using a mask 104, in which a wiring pattern and a dummy pattern are formed. Then, the exposed resist pattern is developed, and the wiring pattern is formed. Thus, resist 107 for forming the wiring pattern as well as resist 108 for forming the dummy pattern are formed. By using a reacting gas under this state, etching is performed. By simultaneously forming the dummy pattern at a part, where the density of the wiring pattern is thin, the concentration of the reacting gas at the side wall of conducting wirings during the etching is alleviated. The etching in the lateral direction is suppressed. The etching is equalized as a whole.
Patent JP-S5989030-A (JP)
Title: Semiconductor electronic circuit
Inventor: SUZUKI MASAYOSHI
IPC: H03K3/02
Filed: 1982-11-12
Abstract: PURPOSE:To reduce the loss of electric power by providing a switch to a power supply terminal and opening and closing the switch synchronously with an input signal. CONSTITUTION:A switching transistor 14 is connected to a power supply terminal of a pulse generating circuit consisting of a transistor TR1. A TR14 does not conduct unless its base is not set at a high potential. Therefore, the TR1 has no actuation. When the TR14 is cut off, no output signal is produced even though an input signal is applied to a terminal 4. Then the TR14 conducts synchronously with the input signal. Thus it is possible to prevent the useless loss of electric power while no input signal exists.
Patent JP-H0733548-A (JP)
Title: Production of ceramic filter
Inventor: UMEYA KAORU
IPC: B28B3/02
Filed: 1993-07-16
Abstract: PURPOSE:To obtain a ceramic filter having large strength and excellent in filtering ability by drying a slurry obtained by subjecting ceramic powder to wet mixing with a dispersing medium, a dispersant, a primary binder and carbon to form granules, subjecting the granules to pressure forming and baking the formed body. CONSTITUTION:A dispersing medium, a dispersant and a primary binder are added to ceramic powder and these components are subjected to wet mixing by a ball mill. Then, carbon is added to this mixture and these components are subjected to wet mixing under reducing ball amount in the ball mill to form slurry. Then, the slurry is spray-dried to form granules and the granules are subjected to pressure-forming into desired shape and the formed product is baked at 1200-1350 deg.C under blowing air.
Patent JP-S6353080-A (JP)
Title: Paper inverter for printer
Inventor: YOKOI TAKESHI
IPC: B41J15/04
Filed: 1986-08-22
Abstract: PURPOSE:To facilitate handling of paper, by discharging continuous form printing paper fed toward a paper-discharging part to the side of a paper-supplying part in an inverted state under the condition where an inverting guide plate is placed in an inverting action position. CONSTITUTION:On the side of a paper-discharging part 6, an inverting guide plate 14 consisting of a transparent plate is fitted at lower ends on both sides thereof onto a main body 1 of a printer by hinges 15 so that it can be turned about an axis parallel to a printing line on a platen 2. In this printer, with the inverting guide plate 14 placed in an inverting action position, continuous form printing paper P1 which has been printed is discharged to the side of a paper-supplying part 5 in the state of being inverted by the inverting guide plate 14 at the paper-discharging part 6. Accordingly, the printed printing paper P1 can be placed on the rear side of the main body 1 adjacently to a printing paper P1 contained in a containing space 8, and both the printing paper P1 yet to be printed and the printed printing paper P1 can be easily handled on one side of the main body 1 of the printer.
Patent JP-H1039172-A (JP)
Title: Semiconductor laser module
Inventor: YUKAWA YUJI
IPC: G02B6/42
Filed: 1996-07-26
Abstract: PROBLEM TO BE SOLVED: To make the noise lower and the conversion efficiency higher in a semiconductor laser module by setting the distance between a semiconductor laser end face and an optical fiber end face at a prescribed range. SOLUTION: The semiconductor laser 47 with a spot size conversion region and the optical fiber 44 are fixed onto a substrate 11. The distance between the exit end face of the semiconductor laser 47 with spot size conversion region and the incident end face of the optical fiber 44 is set at the range of 50 to 100 times the working wavelength. The semiconductor laser 47 with spot size conversion region is used in such a manner that a prescribed spacing is disposed between the exit end face of the semiconductor laser 47 and the incident end face of the optical fiber 44 or an optical waveguide. The noise characteristic equiv. to the noise characteristic of the condition under which the reflected return light does not exist is obtainable even under the condition under which this light exists by setting the distance between the laser end face and the optical fiber end face at 70 (about 50 wavelength) to 150μm (about 100 wavelength), Even more, the high coupling efficiency by using the semiconductor laser 47 with the spot size conversion region can be effectively utilized as it is in this range.
Patent JP-H0729891-A (JP)
Title: Phase fine adjusting mechanism for lep power supply
Inventor: SASAMURA YOSHITAKA
IPC: H01L21/302
Filed: 1993-07-14
Abstract: PURPOSE:To increase a plasma generating efficiency and perform a highly anisotropic dry etching having a high performance, by inserting phase fine adjusting devices respectively into the preceding stages of respective phase shifters to give voltages to respective LEP electrodes, and by controlling strictly the phases of the voltages given to the respective LEP electrodes. CONSTITUTION:An oscillator/distributor 1 comprises a high-frequency oscillator for generating a desired high-frequency signal and a distributor for dividing the high-frequency signal into n signals having the same high frequency. The output signals of the distributor are respectively passed through n phase fine adjusting devices 22a, 22b, 22c,.... The high-frequency signals outputted from the devices 22a, 22b, 22c,... are given to respective LEP electrodes present in a chamber via phase shifters 2a, 2b, 2c,..., and via power amplifiers 3a, 3b, 3c,..., and via automatic matching devices 4a, 4b, 4c,.... By the phase shifters 2, the delays of 2pi/n, n=1, 2,... are given to the respective high-frequency signals, and these operations are performed, e.g. by passings the high-frequency signals through coaxial cables having different lengths from each other. The power amplifiers 3 amplify the powers of the respective high-frequency signals, and the automatic matching devices 4 match respectively the output impedances of the respective high-frequency power supplies with the impedances of the respective load electrode parts 5, and further, the outputs of the automatic matching devices 4 produce respectively plasmas among the respective electrodes 5.
Patent JP-H0484370-A (JP)
Title: Picture forming device
Inventor: SAKAI MASAHIKO
IPC: G06T1/00
Filed: 1990-07-27
Abstract: PURPOSE:To reduce the number of circuit elements used in the title device and reduce the cost of the device by commonly using a logical operation circuit which performs logical operation when picture data are written in a storing means by plural memories. CONSTITUTION:The 1st and 2nd frame memories 5 and 6 expand picture data including patterned characters and store dot images to be transferred to a recording section 9. A logical operation circuit 7 performs such local operation a bit shifting and overwriting (OR writing) on already written data when data are written in the frame memories 5 and 6. A parallel-to-serial converting section 8 converts parallel data read out from the memories 5 and 6 into serial data. Therefore, the number of circuit elements used in this picture forming device and the cost of the device can be reduced, because the one logical operation circuit 7 can be used commonly by the plural frame memories 5 and 6.
Patent JP-H1037826-A (JP)
Title: Solenoid type fuel injection valve
Inventor: NAKAMURA MASAHITO
IPC: F02M61/16
Filed: 1996-07-26
Abstract: PROBLEM TO BE SOLVED: To ensure rotation locking to the housing of an injector cap even in the case where caulking force is small by forming a flange part, being attached tight to an injector body by means of a caulking end, in this injector cap, and installing a locating groove, making this caulking end bite into this flange part, as well. SOLUTION: An injector cap 17, or a press molding, consists of a cylindrical part 171 to be fitted in an injector body 16, an end wall part 172 provided with a pair of nozzles 27, and a funnel-formed ring flange part 173 coming into contact with a ring shoulder part 164 of an upper half part of the injector body 16 at an upper end of the cylindrical part 171 , and in time of molding, the flange part 173 is blanked with a locating groove 26. In this constitution, this locating groove 26 and a coupler half body 25 are placed with a fixed space with each other, and thereby the lower end of a housing 11 is caulked so as to be attached tight to the ring shoulder part 164 of the injector body 16, and thus caulking end 28 is made up. At this time this caulking end 28 is bitten into a position groove 26, thus locking the injection cap to a home position of the housing 11.
Patent JP-S6091560-A (JP)
Title: Manufacture of porous gas diffusion electrode
Inventor: UENO SANJI
IPC: H01M8/02
Filed: 1983-10-25
Abstract: PURPOSE:To certainly shield the flow of gas at the end part of base material and assure electrical insulation by engaging the copolymer of tetrafluoroethylenebarfloroalkylvinyl formed previously in the shape of end portion with the end portion of base material and then forming the sealed part by thermal bonding. CONSTITUTION:A film co-polymer material 15 in the thickness of about 0.1- 0.2mm. of U-shaped tetrafluoroethylenebarfluoroalkylvinylether copolymer is deposited on the end part which is parallel to the reaction gas supply path of porous base material 10 which forms the electrode. This material is put in a female die 12 of metal dies made of aluminium or aluminium alloy which is previously coated with fluorine oil separation agent 14. Next, a surface pressure of about 20-40kg/cm<2> is applied from the vertical direction A, B with a male die 13 which is also coated with the separation agent 14 as described above. The material is then heated for 15-30min at a temperature of 340-380 deg.C and then annealed for about an hour at a temperature of 80-90 deg.C for thermal bonding. Thereby, the sealed portion which insulates gas and electricity can be formed.
Patent JP-S6259716-A (JP)
Title: Launching of great-draft structure
Inventor: KAWAI CHIAKI
IPC: E02B17/00
Filed: 1985-09-10
Abstract: PURPOSE:To make the launching of a great-draft structure easier by a method in which skid rails in a dock are connected with skid rails on a semi-diving barge, the structure is moved onto the barge and towed, and the barge is sunk into sea and the structure is floated up. CONSTITUTION:A structure 100 is built up on skid rails 3a and 3b provided in a dock 1, and water is charged into the dock 1 to remove a gate ship 6. A semi-diving barge 2 is sunk into a pond 7, skid rails 4a and 4b are set on the seal portion 6a of a gate ship 6, and the rails 3a and 3b are joined with skid rails 5a and 5b on the barge 2. Jacks 8a and 8b are moved onto the rails 5a and 5b and the structure 100 is pulled by the jacks 8a and 8b to the barge 2 side. The barge 2 is floated and towed to the offing and again sunk into sea to float up the structure 100.
Patent JP-H0862633-A (JP)
Title: Liquid crystal display device
Inventor: TANI ISAO
IPC: G02F1/1343
Filed: 1994-08-23
Abstract: PURPOSE: To prevent the deterioration or breakdown of a thin film transistor element due to electrostatic charges by forming a transparent semiconducting thin film on the surface of a glass substrate and then forming the thin film transistor element on the semiconducting thin film. CONSTITUTION: A thin film transistor is formed on a semiconducting thin film 11. This thin film transistor consists of a transistor gate electrode 4, gate insulating film 5, amorphous silicon film 6, drain electrode 7, source electrode 8, pixel electrode 9 and protective film 10. The transparent semiconducting thin film 11 is, 6 for example, an ITO film having 10<6> Ω surface resistance. Before the thin film transistor element is formed, a thin film 11 is formed on the surface and sides of the glass substrate 1 by sputtering, and further a thin film 11 is also formed on the back surface by sputtering.  Therefore, by forming the semiconducting thin film on the glass substrate 1 for the thin film transistor array substrate, the wave height of the discharge current caused by transfer of accumulated charges decreases when the array substrate is brought into contact with the ground. Thus, deterioration or breakdown of the element can be prevented.
Patent JP-H0515770-A (JP)
Title: Production of microcapsule
Inventor: ISHIGURO MAMORU
IPC: B41M5/165
Filed: 1991-07-12
Abstract: PURPOSE:To produce a microcapsule having a film rich in fastness at the time of usual handling but capable of being efficiently broken when an encapsulated substance is desired to be taken out, in microencapsulation using yeast fungi, by rapidly introducing a large amount of a hydrophobic liquid into a unit fungal cell. CONSTITUTION:In preparing a microcapsule by including a hydrophobic liquid in yeast cells by stirring yeast fungi and the hydrophobic liquid by a stirrer having stirring blades, the peripheral speed of the leading ends of the stirring blades is set to 3-30 m/sec to produce the microcapsule under stirring. As the form of the stirring blade part, a high shearing type one consisting of a rotatable turbine part and the stator part fixed thereto is pref.
Patent JP-S6089951-A (JP)
Title: Manufacture of flip chip ic
Inventor: MURAKAMI MASAHIDE
IPC: H01L21/60
Filed: 1983-10-24
Abstract: PURPOSE:To easily form a bump which is suited to production in small lot of various kinds by forming a bump to be formed on the electrode pad of semiconductor pellet by the wire bonding method. CONSTITUTION:An Au or Al bump 4 is formed with Au or Al ball 3 by repeating two times the nail head bonding on the electrode pad 2 of a semiconductor pellet 1. A flip chip IC5 manufactured by this method is coupled on a circuit pattern formed with a thin film 6 by the ultrasonic wave bonding method. By forming a bump 4 of IC5 with such a method, the flip chip IC which is suited to production in small lot of various kinds can be manufactured easily at low cost.
Patent JP-H0790319-A (JP)
Title: Production of honeycomb calcined body
Inventor: ONO HARUSUKE
IPC: B22F3/11
Filed: 1993-06-25
Abstract: PURPOSE:To prevent the generation of irregular cracking in a production stage and to improve the yield of a product by making a notch at regular intervals on the edge part of the honeycomb formed body consisting of ceramic, etc., and mitigating the stress remaining inside of the formed body. CONSTITUTION:A starting material composition is prepared by compounding a binder or water into metal and/or ceramic powder. This composition is formed to the honeycomb shape having plural cells, and after drying, dewaxed and fired. In this case, notches 2 are formed immediately after forming on the honeycomb 1. Then, the interval L between the notches 2 is made <=1.5c (where, (c) is a diagonal line length of a honeycomb section), and the product is formed by cutting at the notch 2 part.
Patent JP-S6258239-A (JP)
Title: Silver halide photographic emulsion
Inventor: OKAZAKI MASAKI
IPC: C07D277/84
Filed: 1985-09-09
Abstract: PURPOSE:To improve the spectral sensitivity by adding a dye having a specified group as a substituent. CONSTITUTION:A dye having a group represented by formula I as a substituent is added. In the formula I, each of alpha and beta is an integer of 2-5. A cyanine or merocyanine dye is especially useful as the dye added. The cyanine dye is preferably represented by formula A and the merocyanine dye by formula B.
Patent JP-H0944458-A (JP)
Title: Network queuing device
Inventor: ORIYAMA HIDENORI
IPC: G06F15/177
Filed: 1995-08-03
Abstract: PROBLEM TO BE SOLVED: To provide a network queuing device for not executing a program at the point of time when spooling is incompleted even when the events of retrieval and the spooling of the program are simultaneously generated. SOLUTION: This device is provided with a queue control part 3 for controlling respective functions for a queue 1, a queue management file 4 for describing the management information of the queue, a spooling execution part 7 for spooling the program 2 to the queue by a spooling request from a queuing request part 5, a program execution part 9 for executing the program retrieved by a queue retrieval part 8 from the queue and a spooling control part 10 for monitoring the end of the spooling and tentatively changing the program name of the program during the spooling only until the spooling is completed.
Patent JP-S6177358-A (JP)
Title: Semiconductor memory device
Inventor: MIYAO KAZUTOSHI
IPC: H01L23/525
Filed: 1984-09-21
Abstract: PURPOSE:To contrive to increase the integration and reliability by reducing the fusing power for writing by enabling microstructure by a method wherein the title device has a conductive layer adhered to the stepwise difference pat of the insulation layer formed on a substrate and memorizes information by disconnecting the conductive layer. CONSTITUTION:The first polycrystalline Si layer of 2,000-5,000Angstrom  thickness is adhered on the stepwise difference pat of the first insulation layer formed on the substrate, and then patterned into the first fusion pat 3A and the first electrical connection part 3B. This pat 3B is provided with the first electricity lead-out 3C so that the part 3A may have a polycrystalline Si layer remaining only at the stepwise difference pat. Further, the second insulation layer is adhered thereon, and the second polycrystalline Si layer of 2000-5000Angstrom  thickness is adhered by covering the stepwise difference part of the second insulation layer; then, they are patterned into the second fusion part 5A and the second electrical connection part 5B. This part 5B is provided with the second electricity lead-out 5C so that the part 5A may have a polycrystalline Si layer remaining only at the stepwise difference part.
Patent JP-S6176058-A (JP)
Title: Linear actuator
Inventor: ARIGA TAKAHARU
IPC: H02K33/16
Filed: 1984-09-20
Abstract: PURPOSE:To improve the reliability of a drive power supply system by disposing magnetic movable units through an air gap on a magnetic stationary unit so that opposite electrodes are opposed and making a current flow through a winding coil. CONSTITUTION:A linear actuator has a lower stationary yoke 32, a pair of permanent magnets 33 secured onto the yoke, a support plate 35, and a flat winding coil 34 secured onto the magnets 33 to form a magnetic stationary unit 31. A magnetic movable unit 35 in which a pair of permanent magnets 38 are secured to an upper movable yoke 37 is secured through a pair of roller bearing guides 39 on the unit 31 to form a magnetic circuit. Further, movable position detectors 40, 41 of the unit 36 are further provided. When the prescribed current is made to flow through the coil 34, the unit 36 on the unit 31 rectilinearly moves in a direction of an arrow X in the state that the prescribed pressure is applied in advance by magnetic attraction forces therebetween.
Patent JP-H0540061-A (JP)
Title: Display device of colorimeter
Inventor: YAMADA KAZUAKI
IPC: G01J3/50
Filed: 1991-08-08
Abstract: PURPOSE:To obtain a display device of a colorimeter which enables degree of color such as conditions of a plurality of test lights for one reference light to be recognized at once simply and at a glance. CONSTITUTION:A title item consists of a means 1 for calculating a color index of color conditions of a plurality of test lights for one reference light, a means 4a for setting a coordinate axis in a diameter direction of a circle by shifting a specified angle for each test light, and a means 4b for displaying the color index such as conditions for the reference light of the test light corresponding to the set coordinate axis on the set coordinate axis. Also, a means 4c for setting a position of each test on an X coordinate axis by shifting a specified distance is provided instead of the means 4b for setting the coordinate axis in the diameter direction of the circle by shifting the specified angle for each test light, thus enabling the color index such as conditions for the reference light of the test light according to the set position to be displayed on the set position. This kind of configuration allows the color index such as conditions for the reference light of the test to be displayed graphically and hence the degree of color such as conditions of a plurality of test lights for one reference light to be recognized at once simply and at a glance.