baber/WOPTO huggingface dataset:
Patent TW-201432871-A (TW)
Title: Package structure and methods of forming the same
Inventor: CHOU BRUCE ZHENG-SAN
IPC: H01L23/52
Filed: 2014-01-16
Abstract: A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.
Patent TW-201532050-A (TW)
Title: Method for writing data into flash memory and associated memory device and flash memory
Inventor: YANG TSUNG-CHIEH
IPC: G11C16/08
Filed: 2014-02-10
Abstract: The present invention provides a method for writing data into a flash memory, where the flash memory is a triple-level cell (TLC) flash memory, each storage unit of the flash memory is implemented by a floating gate transistor, and each storage unit supports eight write voltage levels. The method includes: adjusting the data bit by bit to generate a pseudo-random bit sequence; and utilizing only two specific write voltage levels of the eight write voltage levels to write the pseudo-random bit sequence into the flash memory.
Patent TW-201436186-A (TW)
Title: Solid-state image-pickup device, method for producing same, and electronic equipment
Inventor: NOUDO SHINICHIRO
IPC: H04N5/335
Filed: 2014-02-19
Abstract: The present technique pertains to a solid-state image-pickup device configured so that oblique incidence light properties of image pickup pixels and AF properties of phase difference detection pixels can be made excellent, to a method for producing the same, and to electronic equipment. A solid-state image-pickup device includes: a plurality of image pickup pixels arranged two-dimensionally in matrix; and phase difference detection pixels that are scattered among the image pickup pixels. The solid-state image-pickup device further includes: first microlenses that are formed so as to correspond to the image pickup pixels, respectively; a flattening film that is formed on the first microlenses and has a refractive index lower than that of the first microlenses; and second microlenses that are formed on the flattening film, only at positions above the phase difference detection pixels. The present technique can be applied to, for example, a CMOS solid-state image-pickup device.
Patent TW-201511588-A (TW)
Title: Method and apparatus for focused data communications
Inventor: ZEINE HATEM I
IPC: H04W16/24
Filed: 2014-02-21
Abstract: A method and apparatus for focused communication is disclosed. The method includes a base transmitter array in communication with at least one client device at the same frequency. The base transmitter array provides a focused data communication to the client device.
Patent TW-201445680-A (TW)
Title: Microelectronic unit and package with positional reversal
Inventor: CRISP RICHARD DEWITT
IPC: H01L23/48
Filed: 2014-02-26
Abstract: A semiconductor unit includes a chip having left and right columns of contacts at its front surface. Interconnect pads are provided overlying the front surface of the chip and connected to at least some of the contacts as, for example, by traces or by arrangements including wire bonds. The interconnect pads alone, or the interconnect pads and some of the contacts, provide an array of external connection elements. This array includes some reversal pairs of external connection elements in which the external connection element connected to or incorporating the right contact is disposed to the left of the external connection element incorporating or connected to the left contact. Such a unit may be used in a multi-chip package such as a two-chip package having a first chip facing upwardly and a second chip facing downwardly towards a package substrate, disposed below the chips. The reversed connections simplify routing, particularly where corresponding contacts of the two chips are to be connected to common terminals on the package substrate.
Patent TW-201530294-A (TW)
Title: Electronic device
Inventor: WU HWA-FENG
IPC: G06F1/16
Filed: 2014-03-05
Abstract: An electronic device including a first cover, a second cover, a battery, an operating circuit and a water electrolysis circuit is provided. The first cover and the second cover enclose a first space and a second space communicating the first space. The battery is disposed in the first space. The operating circuit is disposed in the first space and connected in parallel with the battery. The water electrolysis circuit is disposed at least in the second space, connected in parallel with the battery and connected in parallel with the operating circuit.
Patent TW-201444951-A (TW)
Title: Luminescent material and organic optoelectric device and display device
Inventor: LEE HAN-ILL
IPC: H01L51/50
Filed: 2014-03-14
Abstract: Disclosed are a luminescent material for an organic optoelectronic device represented by Chemical Formula 1, an organic optoelectronic device including the luminescent material for an organic optoelectronic device, and a display device including the organic optoelectronic device.
Patent TW-201446597-A (TW)
Title: Portion-container compression device
Inventor: MARUYAMA TAKAHIRO
IPC: B65D23/04
Filed: 2014-03-14
Abstract: To provide a portion-container compression device that can prevent a portion container from being placed incorrectly and allow the portion container to be safely used so that the periphery is not soiled even when the portion container is incorrectly placed. A portion-container compression device for pushing out the contents of a portion container (8) by disposing the portion container (8) in the receiving part (51) of a mouthpiece assembly (10), which is the device assembly, and applying a crushing action, wherein: the receiving part (51) positions the portion container (8) at an incline; an easy-to-open detachment guiding part (65) in disposed on the front side of the portion container (8); the portion container (8) has a longitudinally asymmetric shape; and the receiving part (51) is provided with a central pressing pawl (53) for allowing the front side of the portion container (8) to be positioned in conformity with the receiving part (51) and preventing the rear side of the portion container (8) from being positioned in conformity with the receiving part (51). Discharge from an incorrectly placed portion container (8) is therefore prevented by the central pressing pawl (53), the effect obtained with a correct placement is not obtained in an incorrect placement, and the user can therefore be made aware of an incorrect placement to prevent the incorrect placement.
Patent TW-201436820-A (TW)
Title: Method for preparing Herba Dendrobii wall-breaking dosage form
Inventor: Cheng jin-le
IPC: A61K36/8984
Filed: 2014-03-19
Abstract: The present invention relates to a Chinese medicine dosage form and relates specifically to a method for preparing a Herba Dendrobii wall-breaking dosage form. The present invention pulverizes Herba Dendrobii into wall-broken powder, which is subjected to an alcohol-water wetting process granulation through quality control of alcohol solution and the wall-broken powder and is also subjected to extrusion forming under a predetermined rotational speed and then dried. The granulation rate of the present inventive process is high and the Herba Dendrobii wall-breaking dosage form so manufactured has an increased bioavailability and the doesage form has improved stability and good disintegrability. The method comprises the following steps: (1) performing ultrafine wall-breaking pulverization to Herba Dendrobii to obtain ultrafine wall-broken powder; (2) mixing alcohol-water solution and the ultrafine wall-broken powder at a weight ratio of 1-1.6:1 to form a soft material; and (3) extruding to form wet granules, which is then dried to form the dosage form.
Patent TW-201446820-A (TW)
Title: End group conversion method and terminal stabilizing method
Inventor: ABE TAKEFUMI
IPC: C08F8/18
Filed: 2014-03-26
Abstract: Provided are an end group conversion method and a terminal stabilizing method which are capable of converting an unstable end group in a fluorine-containing polymer into a carboxylic acid fluoride group with a high conversion rate. In the presence of 50 mol or more of molecular oxygen with respect to 1 mol of an unstable end group of a fluorine-containing polymer, the fluorine-containing polymer is heated for one hour or more at 200-400 DEG C while the fluorine-containing polymer is in contact with the molecular oxygen and 50-100 mol% of the unstable end group is converted into a carboxylic acid fluoride group.
Patent TW-201443146-A (TW)
Title: Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and method for manufacturing layered semiconductor device
Inventor: SUGIYAMA MASAYA
IPC: C08L63/00
Filed: 2014-03-28
Abstract: Provided is a composition capable of forming an interlayer filler layer for a layered semiconductor device, said interlayer filler layer having a high K1c value, a high glass transition temperature and a low viscosity and assuring a stable bonding even if the surrounding environment varies. The composition comprises an epoxy compound (A) having a viscosity of 50 Pas or lower at 25 DEG C, an amine compound (B) having a melting point or softening point of 80 DEG C or higher, and another amine compound (C) having a melting point or softening point of lower than 80 DEG C, wherein the amount of the amine compound (C) is 1 part by weight or more and less than 40 parts by weight per 100 parts by weight of the sum of the amine compound (B) and the amine compound (C).
Patent TW-201540585-A (TW)
Title: Protective device of motorcycle guide wire
Inventor: Zhu pei-ming
IPC: B62J23/00
Filed: 2014-04-17
Abstract: A protective device of a motorcycle guide wire is disposed on a motorcycle. The motorcycle comprises a direction changing bar, a triangular base disposed below the direction changing bar, two shock absorber disposed at two sides of the triangular base and a guide wire disposed on the triangular base and one of the shock absorber. The protective device comprises the first connection element disposed on the triangular base, the second connection element disposed on the shock absorber at the same side with the first connection element and a protection sleeve disposed at the first connection element. The guide wire is positioned by the first connection element and the second connection element. The first connection element comprises a main body and a lug extended from the main body. One edge of the protection sleeve is disposed at the lug to close the other edge and maintain a space from the guide wire to reduce the chance of accumulating mud in the space.
Patent TW-201518736-A (TW)
Title: Vector network power meter
Inventor: ZIOMEK CHRISTOPHER DENNIS
IPC: G01R21/01
Filed: 2014-05-06
Abstract: System and method for implementing a Vector Network Power Meter (VNPM) as a new class of electronic test instrument that uses a novel topology based upon a reflectometer to combine the functionality of a Power Meter with that of a Vector Network Analyzer (VNA). The VNPM overcomes application limitations of the two existing classes of test instruments, including parallel and simultaneous measurement capability, in-circuit operation, and improved accuracy and repeatability by eliminating the calibration of interconnecting cabling. Also provided are alternate implementations of a correlator for the reflectometer which reduce the size and complexity of the correlator while extending its frequency range without limit.
Patent TW-201543687-A (TW)
Title: Termination structure of semiconductor device and method for manufacturing thereof
Inventor: YEH CHUN-YING
IPC: H01L21/28
Filed: 2014-05-13
Abstract: The present disclosure provides a termination structure of a semiconductor device and method for manufacturing thereof. The semiconductor device includes an active area and a termination area adjacent to the active area, wherein the termination area has the termination structure. The termination structure includes a substrate, an epitaxy layer, a dielectric layer, a conductive material layer and a conductive layer. The epitaxy layer is positioned on the substrate and has a voltage-sustaining region. The voltage-sustaining region has a plurality of trenches being parallel to each other. The dielectric layer is positioned in the trenches and on part of the epitaxy layer. The conductive material layer is positioned on the dielectric layer in the trenches. The conductive layer covers the trenches, contacts the conductive material layer and part of the epitaxy layer, and is electrically connected between the active area and the termination area.
Patent TW-201440142-A (TW)
Title: Annular baffle
Inventor: HOFFMAN DANIEL J
IPC: H01L21/3065
Filed: 2008-04-25
Abstract: A baffle assembly for an etching apparatus is disclosed. The baffle assembly comprises a ring and a lower baffle portion having a curved wall extending between a flange portion and a lower frame portion. A heating assembly may be present within the lower frame portion to control the temperature of the baffle. The baffle assembly may help confine the plasma within the processing space in the chamber. The ring may comprise silicon carbide and the lower baffle portion may comprise aluminum.
Patent TW-201509363-A (TW)
Title: Reconstruction of images from an in vivo multi-camera capsule
Inventor: WANG KANG-HUAI
IPC: A61B1/31
Filed: 2014-05-27
Abstract: Method and apparatus of reconstruction of images from an in vivo multi-camera capsule are disclosed. In one embodiment of the present invention, the capsule comprises two cameras with overlapped fields of view (FOVs). Intra-image based pose estimation is applied to the sub-images associated with the overlapped area to improve the pose estimation for the capsule device. In another embodiment, two images corresponding to the two FOVs are fused by using disparity-adjusted, linear weighted sum of the overlapped sub-images. In yet another embodiment, the images from the multi-camera capsule are stitched for time-space representation.
Patent TW-201544369-A (TW)
Title: Heat dissipation structure of motorcycle engine
Inventor: LIANG WEN-SHENG
IPC: B62J23/00
Filed: 2014-05-30
Abstract: The presented invention relates to a heat dissipation structure of motorcycle engine, the motorcycle has a frame unit, the frame unit has a side frame unit connected to a power unit, an accommodation box is mounted at the upper side of the power unit, a seat is arranged at the upper side of the accommodation box for riding use, a vehicle body cover unit is located beneath the seat and encloses the outside of the accommodation box, the vehicle body cover unit is opened with a heat dissipation hole for discharging high-temperature heat generated by the power unit, the heat dissipation hole is located above the side frame unit; by disposing a heat dissipation hole at the side cover or central cover of the vehicle body cover unit, and through the heat dissipation hole to discharge high-temperature heat generated by the power unit, it is possible to prevent high-temperature heat generated by the power unit from being accumulated on the bottom and outer edge of the accommodation box, thus avoiding the high temperature generation in the accommodation box. Accordingly, the need of setting insulation members, for blocking high temperature heat produced by the power unit, at the bottom and outer edges of both sides can be reduced or eliminated, thereby to enhance the effectiveness of the motorcycle.
Patent TW-201523829-A (TW)
Title: Semiconductor device and method of manufacturing semiconductor device
Inventor: SHIBUYA KATSUNORI
IPC: H01L23/552
Filed: 2014-06-19
Abstract: A semiconductor device includes a conductive shield layer that has a first portion covering a surface of a sealing resin layer and a second portion covering side surfaces of the sealing resin layer and side surfaces of the substrate. Portions of wiring layers, including a grounding wire, on or in the substrate have cut planes which are exposed to the side surfaces of the substrate and spread out in a thickness direction of the substrate. A cut plane of the grounding wire is electrically connected to the shield layer. An area of the cut plane of the grounding wire is larger than an area of a cross section of the grounding wire parallel to, and inward of the substrate from, the cut plane of the grounding wire.
Patent TW-201437664-A (TW)
Title: Locating a device using a reference point to align location information
Inventor: EDGE STEPHEN WILLIAM
IPC: G01S5/02
Filed: 2011-10-03
Abstract: In a particular embodiment, a method includes receiving a first set of location data and a second set of location data at a mobile device. The method includes locating a first reference point identifier that is included in the first set of location data and a second reference point identifier that is included in the second set of location data. The first reference point identifier field and the second reference point identifier field identify a common reference point. The method includes identifying first information in the first set of location data that is associated with the common reference point. The method also includes identifying second information in the second set of location data that is associated with the common reference point and spatially aligning the first set of location data with the second set of location data based on the common reference point to associate the first information with the second information.
Patent TW-201601685-A (TW)
Title: Biometric detection module with denoising function and biometric detection method thereof
Inventor: CHUANG CHIH-YUAN
IPC: A61B5/1455
Filed: 2014-07-08
Abstract: A biometric detection module including a light source module, a detection region and a control module is provided. The light source module is configured to emit green light, red light and IR light in a time division manner to illuminate a skin surface. The detection region is configured to detect penetration light emitted from the light source module for illuminating the skin surface and passing though body tissues to correspondingly generate a green light signal, a red light signal and an IR light signal. The control module is configured to determine a filtering parameter according to the green light signal to accordingly filter the red light signal and the IR light signal, and calculate a biometric characteristic according to at least one of the green light signal, a filtered red light signal and a filtered IR light signal.
Patent TW-201600456-A (TW)
Title: Method for making carbon nanotube composite wire
Inventor: Lin xiao-yang
IPC: B32B9/00
Filed: 2014-07-09
Abstract: A method for making a carbon nanotube composite wire includes providing at least one carbon nanotube film. A graphite film is grown on a surface of a substrate. The at least one carbon nanotube film is composited with the graphite film and the substrate is removed, to form a carbon nanotube/graphite composite film. The carbon nanotube/graphite composite film is rolled up and twisted to form the carbon nanotube composite wire.
Patent TW-201605560-A (TW)
Title: Method for bonding cooling aluminum case, cooling fins and pins
Inventor: Chen xin-wei
IPC: B21K25/00
Filed: 2014-08-05
Abstract: The present invention discloses a method for bonding cooling aluminum case, cooling fins and pins, comprising the steps of: placing a metal box strip on a first carrier platform of a punching machine; placing a pin strip on a second carrier platform of the punching machine; placing a patch strip on a third carrier platform of the punching machine; and using a die of the punching machine to stamp the metal box strip, the pin strip and the patch strip, so that one pin on the pin strip and one patch on the patch strip are respectively bonded onto one metal box of the metal box strip. By the above method, the two processes of punching and riveting may be simplified into a process of stamping and bonding at the same time, so as to reduce the manufacturing steps and reduce manufacturing costs.
Patent TW-201514768-A (TW)
Title: Projective computing system
Inventor: SUGGS BRADLEY NEAL
IPC: G06F3/03
Filed: 2014-08-21
Abstract: In one example in accordance with the present disclosure, a method conducted by a projective computing system is provided. The method includes capturing, by a camera of the projective computing system, an image including an object and a background element. The method further includes projecting, by a projector assembly of the projective computing system, an image of the object on top of the object with an artificial shadow adjacent to at least a portion of the image of the object.
Patent TW-201535394-A (TW)
Title: Semiconductor memory device and memory cell array
Inventor: DOUZAKA TOSHIAKI
IPC: H01L21/8247
Filed: 2014-09-19
Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array in which memory cells are disposed in a matrix, each memory cell being connectable to any one of a plurality of bit lines, and a capacitance that suppresses coupling noise among the plurality of bit lines, the capacitance being added to at least one of the plurality of bit lines.
Patent TW-201613338-A (TW)
Title: Method for generating image bokeh effect and image capturing device
Inventor: LEI SU IAN ALIAS EUGENE
IPC: G06T5/00
Filed: 2014-09-25
Abstract: An image capturing device and a method for creating an image Bokeh effect are provided. The method includes the following steps. An image including a current input pixel is captured. Next, blurring processes are performed on the image by using a first image blur filter and a second image blur filter so as to generate a plurality of first blur images and second blur images corresponding to different blur levels. A distance between the current input pixel and a focal plane is calculated to obtain a current distance. A first current blur image and a second current blur image are respectively selected from the first blur images and the second blur images according to the current distance. Next, a first current blur pixel of the first current blur image and a second current blur pixel of the second current blur image are combined to generate a current output pixel.
Patent TW-201615070-A (TW)
Title: Positioning jig for electronic components
Inventor: LIAO YOU-ZHI
IPC: H05K3/30
Filed: 2014-10-15
Abstract: A positioning jig for electronic components comprises a carrier plate and an adjustment plate. The top surface of the carrier plate is processed to have a plurality of positioning slots to receive each electronic component. The adjustment plate is movably arranged on the carrier plate and has a plurality of positioning holes corresponding to the positioning slots; when the electronic components are received in the positioning slots of the carrier plate, the electronic components are protruded outside the top surface of the adjustment plate. Thus, when solder paste is going to be spread on the electronic components, the adjustment plate can be moved first to move the electronic components toward the same direction and have them positioned in the positioning slots, and then the solder paste is spread, so as to regularly position the electronic components and inhibit random shift of the electronic components during the spread of solder paste.