baber/WOPTO huggingface dataset:
Patent TW-200510352-A (TW)
Title: Cycloalkyl substituted amino acid derivatives, processes for their freparation and their use as pharmaceuticals
Inventor: GRETZKE DIRK
IPC: A61P9/10
Filed: 2004-02-25
Abstract: The invention relates to cycloalkyl-substituted amino acid derivatives and to their physiologically acceptable salts and physiologically functional derivatives. What is described are compounds of the formula I, in which the radicals are as defined, and their physiologically acceptable salts and processes for their preparation. The compounds are suitable, for example, for the treatment and/or prevention of disorders of fatty acid metabolism and glucose utilization disorders, and also of disorders in which insulin resistance is involved.
Patent TW-200529438-A (TW)
Title: Thin film transistor and fabrication method thereof
Inventor: CHEN SHIH-LUNG
IPC: H01L29/786
Filed: 2004-02-26
Abstract: A thin film transistor and fabrication thereof. The thin film transistor comprises a polysilicon layer, a gate insulator layer on the polysilicon layer, and a gate layer on the gate insulator layer. The polysilicon layer comprises a channel region, a first doped region and a second doped region. The gate comprises a first region and a second region, wherein the thickness of first region is larger than that of the second region, where, the channel region is covered by the first region, the first doped region is covered by the second region, and the second doped region is not covered by the gate.
Patent TW-200425204-A (TW)
Title: Dielectric barrier discharge type low-pressure discharge lamp
Inventor: HIRAO TOMOMASA
IPC: H01J1/62
Filed: 2004-03-01
Abstract: The present invention provides a dielectric barrier discharge type low-pressure discharge lamp. A tubular glass lamp vessel 10 composing a dielectric barrier discharge type low-pressure discharge lamp is provided with electrically conductive layers 31, 36 as electrodes on an outer surface of at least one end of the tubular glass lamp vessel. The electrically conductive layers 31, 36 are formed on the surface of the tubular glass lamp vessel 10 by solder material. A metal strip 106 for electric supply is fixed by soldering on the electrically conductive layers 31, 36.
Patent TW-200428369-A (TW)
Title: Sliding member
Inventor: IIDA HIROYUKI
IPC: G11B33/02
Filed: 2004-04-06
Abstract: A sliding member comprising a slidable substrate and a pressure-sensitive adhesive layer provided on one side thereof, wherein the slidable substrate is a porous form comprising a plastic, and a barrier layer is provided between the slidable substrate and the pressure-sensitive adhesive layer. The sliding member has good sliding property and even when a load is applied thereto over a long period of time, can suppress exudation of the pressure-sensitive adhesive.
Patent TW-200533520-A (TW)
Title: Workpiece steady for a decorating machine
Inventor: TWEEDY MARK R
Filed: 2004-04-09
Abstract: A reduction to the traveling motion of bottles along a delivery conveyor in an intermittent motion decorating machine is provided by one of a pair of workpiece feed cams rotatably supported in a side-by-side relation to rotate about spaced horizontal axes lying in a common horizontal plane. The workpiece feed cams have feed cam tracks for receiving cam followers of each of plurality of vertical bottle carriers. One of the feed cam tracks reduces the speed of the bottle carriers from a relatively high entry speed corresponding to the through put speed in the decorating machine to the speed of the deliver conveyor for more densely populating the delivery conveyor with workpieces. Carrier transfer members at each of opposite ends of the workpiece feed cams transfer the bottle carriers from one to the other of the workpiece feed cams. A drive rotates the workpiece feed cams, carrier return cams and carrier transfer members. The decorating machine is provided with a registration station preceding spaced apart decorating stations. The registration station includes a drive to reduce the clamping pressure by chucks on a workpiece while establishing a predetermined orientation of each workpiece relative to the decorating stations.
Patent TW-200512325-A (TW)
Title: Sea-and-island type of deeply dyeable polyester conjugated fiber and method of producing the same
Inventor: YANG SEOUNG-CHEOL
IPC: D06M11/38
Filed: 2004-04-19
Abstract: Disclosed is a sea-and-island type of polyester conjugated fiber, in which an island component is reformed so as to enable the sea-and-island type of polyester conjugated fiber to be deeply dyed, and a method of producing the same. The sea-and-island type of polyester conjugated fiber includes a deeply dyeable copolyester polymer acting an island component. At this time, the copolyester polymer is copolymerized with 1 to 10 mole% of cyclohexane 1, 4-dimethanol based on a glycol component of the copolyester polymer. Furthermore, the sea-and-island type of polyester conjugated fiber is advantageous in that it can be produced using devices for producing a traditional sea-and-island type of polyester conjugated fiber, and a ultra-fine yarn produced using the island component is more deeply dyed than a traditional sea-and-island type of polyester conjugated fiber and has the excellent color fastness.
Patent TW-200423827-A (TW)
Title: Removal of surface oxides by electron attachment for wafer bumping applications
Inventor: DONG CHUN CHRISTINE
IPC: C25F1/02
Filed: 2004-04-26
Abstract: The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
Patent TW-200426773-A (TW)
Title: Display apparatus and method of adjusting display settings thereof
Inventor: LEE KYUNG-SHIK
IPC: G02F1/133
Filed: 2004-04-30
Abstract: A method to provide a convenient user interface to change a display setting of a picture area of a display apparatus, which is communicated with an external device, the method including: displaying a main window including a step start button to initiate a sequence of at least first and second display setting adjustment windows in which first and second display setting adjustments are made; displaying sequentially the display setting adjustment windows corresponding to a selection of the step start button; adjusting the display setting through the displayed display setting adjustment windows; issuing a command from the external device in correspondence to adjusting the displayed display setting adjustment windows; and setting the display setting in correspondence to the command. With this configuration, the present invention provides a convenient user interface to adjust a plurality of display settings of a picture area.`
Patent TW-200539789-A (TW)
Title: Heat conductive base plate device
Inventor: Zhou ming-qing
IPC: H05K7/20
Filed: 2004-05-28
Abstract: The present invention relates to a heat conductive base plate device, mainly including a circuit layer, an insulative layer, and a metal plate. The metal plate has a high thermal conductivity with one surface end thereof installed with a row of embedded grooves for reducing thermal resistance and increasing the surface area of heat conduction. This metal plate is also installed with an insulative layer joined to the base of the circuit layer so that heat produced by an electronic component is transmitted to the base end of the metal plate to achieve the effect of rapid heat dissipation. The heat conductive base plate is mounted on a conventional heat dissipative device to increase the overall heat dissipation capacity. Meanwhile, the embedded grooves of the metal plate can effectively reduce the deformation caused by assembly stress in order to reduce the total heat resistance and non-uniform contact heat resistance, while providing versatile pattern, good heat dissipation power, and rapid formation for the heat conductive base plate device such that the whole part is endowed with innovation and usefulness.
Patent TW-200504280-A (TW)
Title: Recoil starter
Inventor: TOHYAMA ISAO
IPC: F02D11/00
Filed: 2004-06-01
Abstract: A damper spring having a torsion coil spring-like shape is placed on outer peripheries of bosses respectively formed on a rope reel and a cam. The ends of the damper spring are engaged with the rope reel and the cam, respectively, so that the rope reel and the cam are rotatingly coupled with each other. A wire member constituting the damper spring is formed so as to have a section shape in which at least one side is linearly formed, and the damper spring is formed by winding the wire member into a coil-like shape so that the linear portion of the wire member is placed on an inner peripheral side, thereby enabling the inner side face of the damper spring to be tightly wound in a wide area around outer peripheral faces of the bosses.
Patent TW-200540745-A (TW)
Title: Light emitting diode driver using depletion transistor as current source
Inventor: LIU JING-MENG
IPC: B41J2/47
Filed: 2004-06-14
Abstract: There is provided a light emitting diode driver using depletion transistor as current source, in which the source and the gate of the depletion transistor are connected to a common point. The depletion transistor is self-biased to generate current for being supplied to a light emitting diode. Thus, there is no need to have additional control circuit for controlling the depletion transistor. Moreover, the current is not related to the voltage of battery. Accordingly, no additional voltage regulator is required and the circuit size can be further reduced and the cost can be lowered.
Patent TW-200513522-A (TW)
Title: Polishing composition
Inventor: FUJII SHIGEO
IPC: B24B37/00
Filed: 2004-06-18
Abstract: A polishing composition containing an α-alumina, an intermediate alumina, an oxidizing agent and water; a method for reducing waviness of a substrate to be polished, including the step of applying the polishing composition to the substrate to be polished; and a method for manufacturing a substrate, including the step of polishing a substrate to be polished with the polishing composition. The polishing composition is suitable for polishing substrates for precision parts such as substrates for magnetic recording media for magnetic discs, optical discs, opto-magnetic discs, and the like; photomask substrates; glass for liquid crystals; optical lenses; optical mirrors; optical prisms; and semiconductor substrates.
Patent TW-200527625-A (TW)
Title: Wafer-level chip scale package and method for fabricating and using the same
Inventor: JOSHI RAJEEV
IPC: H01L21/60
Filed: 2004-07-09
Abstract: First, second, and third packaged semiconductor devices (a wafer-level chip scale package) are described. The first packaged semiconductor device contains no UBM between a chip pad and an RDL pattern. The first device contains only a single non-polymeric insulation layer between the RDL pattern and the solder bump, where the insulation layer does not need high temperature curing processes and so does not induce thermal stresses into the device. Manufacturing costs for the first device are diminished by eliminating the UBM between the chip pad and the RDL pattern. The second packaged semiconductor device (a second wafer-level chip scale package) contains an adhesive film containing conductive particles sandwiched between a chip with Cu-based stud bumps and a substrate containing a bond pad. Some conductive particles are sandwiched between the stud bump and bond pad to create a conductive path. The second device is manufactured without the steps of dispensing solder and reflowing the solder and can optionally eliminate the use of a redistribution trace. Using such a configuration increases the reliability of the second wafer-level chip scale package. The third packaged semiconductor device (a third wafer-level chip scale package) contains a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.
Patent TW-200602752-A (TW)
Title: Wire mount and backlight module utilizing the same
Inventor: LIN WEN-HSIN
IPC: G02F1/1335
Filed: 2004-07-15
Abstract: An assembly for holding a wire. The assembly includes a base and a wire mount. The base includes a surface and a protrusion formed on the surface. A through hole is formed between the protrusion and the surface. The wire mount is disposed on the surface of the base in a manner such that it passes through the through hole. The wire mount serves to fix the wire.
Patent TW-200509290-A (TW)
Title: Cleaning and drying apparatus for substrate holder chuck and method thereof
Inventor: OHTSUKA HIROMI
IPC: B08B3/02
Filed: 2004-07-28
Abstract: The present invention provides a cleaning and drying apparatus for a substrate holder chuck equipped with a holding members 31 (32, 33) having a plurality of holding grooves 31a for holding a plurality of wafers W respectively. The apparatus includes: a dual-fluid-supplying nozzle 50 for spraying N2-gas and deionized water to the holding grooves 31a of the holding member 31 of the chuck 30; a cleaning-liquid-supplying nozzle 60 for spraying deionized water to a side face 31b of the holding member 31; and an air-pressure cylinder 300 for causing the relative movement between the dual-fluid-supplying nozzle 50/the cleaning-liquid-supplying nozzle 60 and the holding member 31 of the chuck 30, along the longitudinal direction of the holding member 31 and horizontally. Due to driving of the air cylinder 300, the dual-fluid-supplying nozzle 50 is constructed so as to spray N2-gas and deionized water to the holding grooves 31a of the holding member 31 in advance of the cleaning-liquid nozzle 60. Accordingly, it is possible to shorten a cleaning-and-drying time for the substrate holder chuck and also possible to improve a throughput of the whole apparatus.
Patent TW-200607737-A (TW)
Title: Device and method for fetching and supplying sheet material
Inventor: UETSUJI HIROSHI
Filed: 2004-08-31
Abstract: A sheet material fetching and supplying device for fetching an uppermost sheet material from a stacked sheet material bundle in a sheet material storage part liftably driven by a lifting means and transferring the sheet material to a sheet material conveying part, comprising a sheet material separating means for separating the uppermost sheet material from the lower sheet materials by blowing air between the sheet materials, a sucking and carrying means with a sucking port, sucking, by the sucking port, the uppermost sheet material floated by the blowing of the air, and transferring the sheet material to the sheet material carrying part, and a control means comprehensively controlling these means. The sheet material separating means further comprises injection holes vertically arranged in multiple rows, and is characterized in that the sheet material is preliminarily separated by the lower injection holes while the sheet material of the stacked sheet material bundle rises to the uppermost position.
Patent TW-200515644-A (TW)
Title: Anisotropic conductive film, production method thereof and method of use thereof
Inventor: ASAI FUMITERU
IPC: H01R13/24
Filed: 2004-09-09
Abstract: The present invention provides an anisotropic conductive film for testing an electronic component, which comprises a film substrate comprising an insulating resin and plural conductive paths insulated from each other and penetrating the film substrate in the thickness direction, preferably, an anisotropic conductive film wherein the plural conductive paths are disposed in a houndstooth check pattern and the distance between conductive paths between adjacent rows of conductive paths is smaller than the distance between conductive paths within a row of conductive paths. In another preferable embodiment, the insulating resin comprises a naphthalene skeleton epoxy resin crosslinked with a phenol resin and an acrylic rubber, and both ends of the plural conductive paths are exposed on both the front and the back surfaces of the film substrate.
Patent TW-200608811-A (TW)
Title: Image processing device, image processing method and image display device
Inventor: SOMEYA JUN
Filed: 2004-10-28
Abstract: The present invention is to provide an image processing device, image processing method and image device for achieving high image quality by improving definition of outlines of an image. In order to achieve the above objective, the image processing device of the present invention comprises a magnification controlling means for detecting an outline section of the image data and generating magnification controlling quantity based on the detected outline width of the outline section; an outline width modifying means for performing interpolation process on the image data based on the magnification controlling quantity and modifying the outline width; an emphasis quantity calculation means for detecting high frequency component in the modified image data of the outline width and calculating emphasizing quantity for emphasizing the outline section of the image data based on the detected high frequency component; and an outline emphasizing means for emphasizing the outlines of the image data by adding the emphasizing quantity to the modified outline width of the image data.
Patent TW-200523917-A (TW)
Title: Optical recording medium
Inventor: WADA YUTAKA
IPC: G11B7/0045
Filed: 2004-10-29
Abstract: An optical recording medium comprises a transmission substrate (1) and a recording layer (2) formed on the transmission substrate (1), the recording layer (2) containing at least a dye material expressed by a general formula shown at the following chemical formula (in the chemical formula 1, R1 represents alkyl group having carbon numbers 1 to 4, R2, R3 represent alkyl group having carbon numbers 1 to 4, benzyl group or groups combined to form 3 to 6 rings, Y1 and Y2 independently represent organic groups and X represent ClO 4, BF 4, PF 6, SbF 6) and a dye material expressed by a general formula represented by the following chemical formula 2(in the chemical formula 2, R1 and R2 represent alkyl groups having carbon numbers 1 to 4, benzyl groups or groups combined to form 3 to 6 rings, Y1, Y2 independently represent organic groups and X represent ClO 4, BF 4, PF 6, SbF 6 ): In a write once type optical recording medium such as DVD-R and DVD+R, satisfactory recording characteristics can be obtained from low-speed recording to high-speed recording.
Patent TW-200527540-A (TW)
Title: High K dielectric film
Inventor: DROOPAD RAVINDRANATH
Filed: 2004-11-01
Abstract: A dielectric layer (14, 22, 24, 32) comprised of lanthanum, lutetium, and oxygen that is formed between two conductors or a conductor (14, 20, 34) and a substrate (12, 26. 30). In one embodiment, the dielectric layer is formed over the substrate without the need for an additional interfacial layer. In another embodiment, the dielectric layer (22, 42, 46) is graded with respect to the lanthanum or lutetium content or in the alternative, may include aluminum. In yet another embodiment, an insulating layer is formed between the conductor or substrate and the dielectric layer or between both the conductor and substrate and the dielectric layer. The dielectric layer is preferably formed by molecular beam epitaxy, but can also be formed by atomic layer chemical vapor deposition, physical vapor deposition, organometallic chemical vapor deposition or pulsed laser deposition.
Patent TW-200615892-A (TW)
Title: Display controlling device and controlling method
Inventor: CHOU YU-PIN
IPC: G09G3/36
Filed: 2004-11-04
Abstract: A display controlling method is applied to a display controller and can make the display controller compatible with various display panels by adjusting the pulse cycles of the vertical synchronous display signal or the horizontal synchronous display signal of the display controller. The present invention further provides a display controlling device.
Patent TW-200538232-A (TW)
Title: Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
Inventor: WU KUO-CHUN
IPC: B24B37/04
Filed: 2004-11-17
Abstract: A Chemical Mechanical polishing method (CMP) is disclosed in which a new polishing pad is broken-in and conditioned into a steady operating state while using a silica (SiO2) based CMP slurry and where the broken-in and conditioned pad is afterwards used for polishing patterned work pieces (e.g., semiconductor wafers) with a ceria (CeO2) based CMP slurry. The Approach shortens break-in time and appears to eliminate a first wafer effect usually seen following break with ceria-based CMP slurries.
Patent TW-200528766-A (TW)
Title: Color filter and electro-optical device
Inventor: KIGUCHI HIROSHI
IPC: H01J11/12
Filed: 2002-06-03
Abstract: A color filter (200) comprises pixels (13) separated from each other by partitions (14) formed on a substrate (12) so as to have a plurality of color elements of ink. Dummy pixels (13') are formed outside the area in which the pixels (13) are formed. The amount of ink applied to each of said pixels and the amount of ink applied to each of said dummy pixels are substantially equal. A protective film (21) covering said pixels (13) is formed so as to also cover said dummy pixels (13').
Patent TW-200525885-A (TW)
Title: Current transfer logic
Inventor: PRADHAN PRAVAS
IPC: H04L25/02
Filed: 2004-11-24
Abstract: A current mode transfer logic system suitable for driving transmission lines is disclosed. In one embodiment a twisted pair transmission line is terminated in its characteristic line impedance. A signal is formed of two unequal currents, preferably of different polarities as well as magnitudes, that are driven down the two lines. The unequal currents are selectively switched between the two lines creating a logic signal of a differential current drive of unequal current magnitudes. The unequal currents are received and shunted from the distal end of each line via diode connected MOS transistors. The MOS transistors are biased to present a low impedance, but an impedance higher than the terminating resistor. The currents are amplified and converted to useable CMOS voltage levels. In anther embodiment the twisted pair is replaced by two parallel transmission lines which are terminated in one resistor, equal to the sum of the characteristic impedances of each line. The terminating resistor is connected between the distal signal carrying conductors of each transmission line. The shields or return paths for each line are tied together at the distal and at the proximate (drive) ends of the line.
Patent TW-200602988-A (TW)
Title: Non-contact IC tag system
Inventor: HASHIMOTO SHIGERU
IPC: G06K19/00
Filed: 2004-12-17
Abstract: A non-contact IC tag system includes a plurality of non-contact IC tags, each of which includes identification information and a memory for storing a predetermined amount of data; and a reader/writer that sends an operation command via radio to each of the non-contact IC tags. The non-contact IC tags include a plurality of slave IC tags and a master IC tag. The master IC tag holds memory configuration information that is used when building a memory space with a memory area of the memory of each of the slave IC tags and a memory area of the memory of the master IC tag.