baber/WOPTO huggingface dataset:
Patent TW-I228465-B (TW)
Title: Transport system
Inventor: YAMADA SABURO
IPC: B61C13/04
Filed: 2003-10-06
Granted: 2005-03-01
Abstract: A transport system for increasing the clip force (contact press) of driving wheel to rail, transport the object to be transported safely and efficiently is provided. The transport system has a main rail, a truck embark the driving wheel rotating on the main rail and a driving device to drive the driving wheel, an adjacent device is joined to the truck by one end and joined to the object to be transported by another end, an auxiliary rail is disposed under the main rail at the incline area of the main rail, an auxiliary wheel rotating on the auxiliary rail which is supported by the adjacent device and is not contact to the main wheel, an elasticity loading device offer the elastic force at the direction pushing the auxiliary wheel to the auxiliary rail.
Patent TW-I230445-B (TW)
Title: Circuit board and its manufacturing method, transfer chip, transfer source substrate, optoelectronic apparatus, and electronic machine
Inventor: KIMURA MUTSUMI
IPC: H05B33/10
Filed: 2003-10-06
Granted: 2005-04-01
Abstract: The subject of the present invention is to provide technology such that excellent conducting state can be secured in electrically connecting a body to be transferred and a substrate of transfer destination by providing a pad electrode between both of them. The invented transfer chip is formed on the first substrate as a transfer unit including: at least a thin film circuit formed by laminated films and a plurality of pad electrodes for connecting the thin film circuit and the other circuit, and is transferred onto the second substrate formed with the wiring from the first substrate. Plural pad electrodes (56d, 56f) are arranged on the whole of one face of the transfer chip, the respective pad electrodes (56d and 56f) are formed to cover a thin film element or thin film electric wiring that constitutes the thin film electric circuit presented under the respective pad electrodes, and the heights of the highest parts (56d, 56f) of a protrusion and recess generated on the surface by forming respective pad electrodes (56d and 56f) are substantially equal to one another.
Patent TW-I245119-B (TW)
Title: Structure and manufacturing process of electrochemical sensor strip
Inventor: HUANG CHUN-MU
IPC: G01N27/26
Filed: 2003-11-05
Granted: 2005-12-11
Abstract: A structure of an electrochemical sensor strip and the manufacturing process thereof are provided. The electrochemical sensor strip includes an isolating sheet having at least a cavity, a cover partially covering the cavity, a reaction layer located in the cavity, and an electrode device disposed in the cavity for detection and transmission. In which, the cavity and the isolating sheet are formed integrally, and there is a side wall with a width ranged from 0.1 to 0.3 mm between the cavity and an edge of the isolating sheet. In addition, the cover further includes at least an opening.
Patent TW-I246593-B (TW)
Title: Method and substrate for biochips by using single-step manufacturing process
Inventor: YIN LI-TE
IPC: C12Q1/68
Filed: 2003-11-12
Granted: 2006-01-01
Abstract: The present invention provides a method and a substrate for biochips by using single-step manufacturing process, whereby compound A and compound B are mixed for coating onto a substrate to form a reaction layer, wherein said compound A is selected from a group consisting of nitrocellulose (NC), PSMA, PS, PDMF and mixture thereof; and compound B is selected from a group consisting of GPTS, 3APTS and mixture thereof such that biomolecules are immobilized by such reaction layer. The present invention simplifies the conventional process for manufacturing biochips substrates without adversely affecting detection functions of biochips, a result that provides a speedy and effective manufacturing method for biochips.
Patent TW-I238546-B (TW)
Title: Light emitting diode utilizing a photonic crystal and device made from the same
Inventor: LIN CHUNG-HSIANG
IPC: H01L33/06
Filed: 2004-01-08
Granted: 2005-08-21
Abstract: A light emitting diode utilizing a photonic crystal comprises a substrate, a light emitting crystal having a light outgoing portion connecting to the substrate and a back light portion that is far from the light outgoing portion, and a metallic reflective layer. The light emitting crystal has a plurality of posts which are projected from the back light portion toward a direction that is opposite to the light outgoing portion are displace apart from each other. Each of the post has a first base wall, a second base wall that is relative to the first base wall far from the light outgoing portion, and surrounding wall connecting the first base wall and the second base wall. The posts confine a plurality of channels, and make the light emitting crystal has a planar lattice. The metallic reflective layer forms on the first base walls and the surrounding walls, and confines a plurality of reflective metal grids. The light emitting crystal was confined a photonic crystal having a two dimensional periodic structure by the planar lattice and the reflective metal grids.
Patent TW-I235203-B (TW)
Title: Screw compressor
Inventor: OSUMIMOTO HIROKI
IPC: F04C18/16
Filed: 2004-01-30
Granted: 2005-07-01
Abstract: The objective of the present invention is to provide a screw compressor having a reduced size with simple construction and improved workability at overhaul work. The solution of the present invention is that an oil separator 24 and an oil reservoir 19 are formed integral with a main case. Besides, an opening 15 communicating with the oil reservoir is formed in a part of a lower portion of an oil separation space 4 of the oil separator. The opening is preferably formed so that its width increases as it approaches an outer peripheral side of the oil separation space from a center thereof. In addition, a safety valve is installed such that a line connecting the safety valve 22 and the center of the oil separator is made substantially in parallel to the axis of the screw rotors.
Patent TW-I255052-B (TW)
Title: Method to produce a number of semiconductor-bodies and electronic semiconductor-bodies
Inventor: BADER STEFAN
IPC: H01L33/00
Filed: 2004-02-11
Granted: 2006-05-11
Abstract: This invention relates to a method to produce a number of semiconductor-bodies, especially on the basis of the nitride-compound semiconductor material, which includes at least the following steps: (a) forming a mask-layer (3) over a substrate (1) or over an initial-layer (2), which has several windows (4) to the substrate (1) or to the initial-layer (2) and on which a semiconductor-material (5), which will grow on the substrate (1) at a later step, can not or compared to the substrate (1) much worse grows, (b) back-etching the substrate (1) or the initial-layer (2) in the windows (4), so that outgoing from them some grooves (41) are formed in the substrate or in the initial-layer (2), (c) growing the semiconductor-material (5) on the substrate (1) or on the initial-layer (2), so that the lateral growth is facilitated and the semiconductor-material at 1st grows from the sides (43) of the grooves (41) towards their middles (42), so that the defects in the substrate (1) or in the initial-layer (2), which hit on the sides (43) of the grooves (41), bend in the semiconductor-material towards the middle of the grooves (41) and then outgoing from the windows (4) the substrate-material grows over the mask-layer (3) and grows together respectively between the adjacent windows (4) over the mask-layer (3) and forms other coalescence-region (62) there, (d) growing a component-layer-sequence (8) on the semiconductor-material (5).
Patent TW-I286512-B (TW)
Title: Chip-on-film use copper foil
Inventor: YOSHIHARA YASUHISA
IPC: C25D7/06
Filed: 2004-02-17
Granted: 2007-09-11
Abstract: The chip-on-film use copper foil provides a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns in the resin, free from a drop in bond strength between the copper foil and resin substrate due to the processing for formation of solder balls, excellent in visibility, and excellent in mounting of ICs on fine patterns, and characterized by comprising a copper foil on at least one surface of which is provided an alloy fine roughening particle layer comprised of a copper-cobalt-nickel alloy with contents of cobalt and nickel equal to or greater than that of copper, specifically a copper foil on the surface of the copper foil for bonding with the resin substrate of which is provided an alloy fine roughening particle layer comprised of 5 to 12 mg/dm<2> copper, 6 to 13 mg/dm<2> cobalt, and 5 to 12 mg/dm<2> nickel. Preferably, the alloy fine roughening particle layer may be treated for stain proof. In addition, the alloy fine roughening particle layer may be treated by a silane coupling agent.
Patent TW-I242873-B (TW)
Title: Integrated circuit packaging method and structure for redistributing configuration thereof
Inventor: LIN CHIH-HSIANG
IPC: H01L23/50
Filed: 2004-04-23
Granted: 2005-11-01
Abstract: A packaging method and structure for altering the configuration of an integrated circuit are disclosed. The packaging structure includes a die, a redistribution layer, a lead frame, and a passivation layer. The die has a plurality of first pads and the lead frame has a plurality of lead pads. The coupling between the first pads and the lead pads define correspondingly a first configuration. The redistribution layer includes a plurality of second pads and a plurality of wires. The wires selectively connect the first pads and the second pads, thus the couplings between the second pads and the lead pads define correspondingly a second configuration. Then the second pads wire-bonds respectively to the lead pads in accordance with the second configuration.
Patent TW-I272404-B (TW)
Title: Miniature image pick-up lens system
Inventor: WANG ZHUO
Filed: 2004-06-18
Granted: 2007-02-01
Abstract: A miniature image pick-up lens system comprises an aperture stop; a biconvex first lens; and a meniscus-shaped second lens having a concave surface on a side of an object. The stop, the first lens and the second lens are aligned in an order from the object side to an image side. Each of the lenses has at least one aspheric surface and at least one of the two lenses is made of glass. The system satisfies the following condition: (1) 1 < T/f < 1.6; wherein f indicates a focal length of all system, and T indicates a length from the aperture stop to an image pick-up surface.
Patent TW-I266529-B (TW)
Title: Fixing frame structure of plasma TV
Inventor: HUNG SUNG-LIN
IPC: H04N5/655
Filed: 2004-06-30
Granted: 2006-11-11
Abstract: The present invention is related to a kind of fixing frame structure of plasma TV. The invention includes a fixing base fixed on the wall surface, in which an insertion sheet is provided at the top edge of the fixing base. Two protruded sheets are provided at both sides of the bottom edge, and two through holes are arranged opposite to each other on these two protruded sheets. Plural fixing arms are fixed at the rear side face of the plasma TV. In addition, one side of the fixing arm is provided with the insertion slot for inserting the insertion sheet of the fixing base. The positioning slot hole is provided at the position corresponding to through hole on the fixing arm. A stopping section is provided at one end of the locking shaft while the other end of the locking shaft sequentially passes the through hole of the protruded sheet at one side of the fixing base and the positioning slot hole of each fixing arm such that it is protruded and exposed outside the through hole of the protruded sheet at the other side. A lock hole is provided at the protruded end for setting the lock implement. By using the invented structure, the effects with convenience of mounting and locking can be achieved.
Patent TW-I242098-B (TW)
Title: Flip-chip bonding structure for use in liquid crystal display device
Inventor: LIOU MENG-CHI
IPC: G02F1/1345
Filed: 2004-06-30
Granted: 2005-10-21
Abstract: A flip chip bonding structure for use in a liquid crystal display device, including: a substrate, a laminating layer, plural bow-shaped bonding pads, a conductive film and a driving chip. The substrate surface has plural electrodes. The driving chip is formed on a surface thereof with plural metal protrusions. The driving chip is connected to the substrate through the metal protrusion, conductive film, bowl-shaped bonding pads and electrodes. The laminating layer is bulged around the electrodes for a height greater than the total thickness of the bowl-shaped bonding pads and electrodes, so as to provide the bowl-shaped bonding pads with self-alignment function during bonding. Such a layout design of the substrate improves the alignment precision and stability in bonding the flip chip, so as to improve the yield rate of thermal-pressing process.
Patent TW-I251135-B (TW)
Title: Automatic programming method and device
Inventor: KAMIYA TAKASHI
IPC: B23Q15/00
Filed: 2004-07-02
Granted: 2006-03-11
Abstract: Dimensional data of raw material data registered in a raw material data base is compared with the dimensional data of a product model to select a minimum (smallest) raw material data including the product shape from the raw material data base. A raw material model is generated according to the selected raw material data and the minimum raw material data including the product shape is automatically selected from the raw material data base.
Patent TW-I242330-B (TW)
Title: Digital analog converter and the driving method thereof
Inventor: WANG CHUN-FU
IPC: H03M1/68
Filed: 2004-07-14
Granted: 2005-10-21
Abstract: The present invention provides a circuit and driving method for a digital analog converter to convert an (m+n) bits digital signal to an analog signal. The method comprises the following steps. First, separate the (m+n) bits digital signal into a first set of m first bits and a second set of n second bits. Then, according to the first set of m first bits, a reference voltage range is determined from a plurality of reference voltages. Finally, according to the second set of n second bits, a voltage is determined from the reference voltage range.
Patent TW-I290852-B (TW)
Title: Spray drying processes for forming solid amorphous dispersions of drugs and polymers
Inventor: BEYERINCK RONALD ARTHUR
IPC: A61K9/50
Filed: 2004-08-03
Granted: 2007-12-11
Abstract: Spray drying processes are used to form pharmaceutical compositions comprising a solid amorphous dispersion of a drug and a polymer.
Patent TW-I256633-B (TW)
Title: Optical component set used in pick up head
Inventor: LEE YEN-CHIH
IPC: G11B7/135
Filed: 2004-08-20
Granted: 2006-06-11
Abstract: The present invention provides an optical component set used in a pick up head. The optical component set comprises a plurality of optical components in an optical path, wherein at least two of the optical components are provided with optical coatings to change the polarization of a light beam and make the light beam circularly polarized. The circularly polarized beam is projected on an optical storage medium and becomes a signal beam received by an optical detector. A quarter wavelength plate (QWP) is not included in the optical component set.
Patent TW-I239665-B (TW)
Title: Structure of gallium-nitride based (GaN-based) light-emitting diode with high luminance
Inventor: WU LIANG-WEN
IPC: H01L33/00
Filed: 2004-09-06
Granted: 2005-09-11
Abstract: A structure of GaN-based light-emitting diode (LED) with high luminance is disclosed, which can efficiently enhance the luminance effect and the brightness of LED. The structure of GaN-based light-emitting diode disclosed in this invention differs from the conventional method of manufacturing GaN-based light-emitting diode by adopting one of the following three methods: utilizing silicon nitride (SiN), utilizing a structure of short-period supper-lattice formed by SiN and undoped InGaN, or utilizing a structure of short-period supper-lattice formed by SiN and undoped AlInGaN, so as to form a thin layer on the P type contact layer. On the said thin layer, because of the growth of the silicon nitride material, the surface of the GaN-based light-emitting diode is micro-roughened, therefore prevents the total internal reflection resulting from a higher refractive index of the GaN-based light-emitting diode compared to air, and thus achieves a better external quantum efficiency and light-emitting efficiency of the GaN-based light-emitting diode.
Patent TW-I353129-B (TW)
Title: Incremental redundancy transmission in a mimo comm
Inventor: KADOUS TAMER
IPC: H04W28/22
Filed: 2004-09-09
Granted: 2011-11-21
Abstract: For an incremental redundancy (IR) transmission in a MIMO system, a transmitter processes (e.g., encodes, partitions, interleaves, and modulates) a data packet based on a selected rate to obtain multiple data symbol blocks. The transmitter transmits one data symbol block at a time until a receiver correctly recovers the data packet or all blocks are transmitted. Whenever a data symbol block is received from the transmitter, the receiver detects a received symbol block to obtain a detected symbol block, processes (e.g., demodulates, deinterleaves, re-assembles, and decodes) all detected symbol blocks obtained for the data packet, and provides a decoded packet. If the decoded packet is in error, then the receiver repeats the processing when another data symbol block is received for the data packet. The receiver may also perform iterative detection and decoding on the received symbol blocks for the data packet multiple times to obtain the decoded packet.
Patent TW-I251978-B (TW)
Title: Apparatus and method of switching control circuit having off-time modulation
Inventor: YANG TA-YUNG
IPC: G05F1/10
Filed: 2004-09-23
Granted: 2006-03-21
Abstract: The invention presents a switching control circuit for a primary-side controlled power supply. A voltage-waveform detector produces a voltage-feedback signal and a discharge-time signal by multiply sampling a voltage signal of a transformer. The discharge-time signal represents the discharge-time of a secondary-side switching current. A voltage-loop error amplifier amplifies the voltage-feedback signal and generates a control signal. An off-time modulator correspondingly generates a discharge-current signal and a standby signal in response to the control signal and an under-voltage signal. The under-voltage signal indicates a low supply voltage of the control circuit. An oscillator produces a pulse signal in response to the discharge-current signal. The pulse signal determines the off-time of the switching signal. APWM circuit generates the switching signal in response to the pulse signal and the standby signal. The standby signal further controls the off-time of the switching signal and maintains a minimum switching frequency. The switching signal is used for switching the switching device and regulating the outputs of the power supply.
Patent TW-I246784-B (TW)
Title: Light emitting diode and manufacturing method thereof
Inventor: LIU CHENG-YI
IPC: H01L33/00
Filed: 2004-12-29
Granted: 2006-01-01
Abstract: A method for fabricating a light emitting diode (LED) is provided. A first type doped semiconductor layer, an emitting layer, and a second type doped semiconductor layer are formed on an epitaxy substrate sequentially. Then, a gold layer is formed on the second type doped semiconductor layer. Next, a silicon substrate is provided, and a wafer bonding process is performed between the silicon substrate and the gold layer. Then, the epitaxy substrate is removed. As mentioned above, a LED with better reliability and performance is manufactured according to the method. Moreover, a LED is also described.
Patent TW-I240400-B (TW)
Title: Method for fabricating a packaging substrate
Inventor: WENG YI-TANG
IPC: H01L23/492
Filed: 2005-01-04
Granted: 2005-09-21
Abstract: A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.
Patent TW-I359165-B (TW)
Title: Rare earth aggregate formulation using di-block co
Inventor: YOKOTA KAZUHIKO
IPC: C09K23/52
Filed: 2005-01-28
Granted: 2012-03-01
Abstract: The present invention is directed to controlling aggregation of rare earth particles using block copolymers and rare earth base particles. More particularly, invention is also directed to forming stable complexes of rare earth aggregates by complexing rare earth base particles with oppositely charged-neutral di-block copolymers. Even more particularly, invention is also directed to forming stable complexes of rare earth nanoparticles by complexing rare earth ultrafine particles with oppositely charged-neutral di-block copolymers.
Patent TW-I260668-B (TW)
Title: Image display device and its manufacturing method
Inventor: OYAIZU TSUYOSHI
IPC: H01J9/39
Filed: 2005-02-21
Granted: 2006-08-21
Abstract: This invention is to provide an image display device capable of displaying an image of high luminance and high quality, because withstand voltage characteristics are substantially improved, and an electron emitting element and a fluorescent screen are prevented from being broken and deteriorated by abnormal discharge. This image display device has an electrically parted portion in which a metal back layer is formed so as to have a prescribed pattern, and in this parted portion, a coating layer 12 containing a component to dissolve or oxidize a metal (Al) composing the metal back layer, and heat resistant particulates such as silica particulates, and having recessed and projecting parts caused by the heat resistant particulates on its surface is formed. In addition, a getter layer 3 parted by the coating layer is formed like a film on the metal back layer. The portion of a light absorbing layer 9 located in the lower layer of the parted portion of the metal back layer preferably has surface resistance of 1x10<5> to 10<12> Omega/square.
Patent TW-I260875-B (TW)
Title: A base station, a mobile station, a radio communications system, and a radio transmission method using spread spectrum and chip repetition
Inventor: GOTO YOSHIKAZU
IPC: H04W16/28
Filed: 2005-03-04
Granted: 2006-08-21
Abstract: A base station, a mobile station, a radio communications system, and a radio transmission method are disclosed. The base station includes a control information determining unit configured to determine control information that includes a spreading factor, the number of chip repetitions, and a phase unique to the mobile station, based on at least one of information about the type of cell environments in which the mobile station is present, information about the number of mobile stations that are present in the cell, information about information rate required by the mobile station, information about a type of traffic, information about a radio parameter of the mobile station, information about a propagation path condition, and information about interference from an adjacent cell, and configured to transmit the spreading factor, the number of chip repetitions, and the unique phase of the mobile station that is determined to the mobile station.
Patent TW-I259469-B (TW)
Title: Using method and refresh method of non-volatile memory
Inventor: HSU CHENG-HSING
IPC: G11C16/02
Filed: 2005-05-05
Granted: 2006-08-01
Abstract: A method of using a non-volatile memory that utilizes a charge-trapping layer for data storage is described. A refresh step is performed, after the non-volatile memory is subject to multiple write/erase cycles causing hard-to-erase electrons in the charge-trapping layer, to eliminate the hard-to-erase electrons. After the refresh step, the non-volatile memory is used again.