baber/WOPTO huggingface dataset:
Patent JP-2001189405-A (JP)
Title: High-frequency input/output terminal and package housing high-frequency semiconductor device
Inventor: MORIOKA SHIGEO
IPC: H01P3/02
Filed: 1999-12-27
Abstract: PROBLEM TO BE SOLVED: To provide a high-frequency input/output terminal having less loss over a wide frequency band of tens of GHz which is satisfactory in transmission characteristics. SOLUTION: There are provided a dielectric substrate 1, where there is a recess 3 on the lower surface and a ground conductor 4 is formed on the lower surface around the recess 3, dielectrics so bonded on the upper surface of the dielectric substrate 1 as to face the central part of the recess 3 or a wall member 2 comprising the dielectrics, a pair of line conductors 5 and 5 formed to be in a straight to each other on both sides of the wall member 2 on the upper surface of the dielectrics substrate 1, which each of tip parts face each other at both side parts of the recess 3, a ground conductor 6 in identical plane formed on both sides of the line conductors 5 and 5, and a lower surface side line conductor 8 which is so formed on the bottom surface of the recess 3 of the dielectric substrate 1 as straight with the pair of line conductors 5 and 5,  while being in parallel and connected electrically to the each tip part of the pair of line conductors 5 and 5 by both ends with through-conductors 7 and 7.
Patent JP-2000192202-A (JP)
Title: High corrosion resistance and nonmagnetic stainless free- cutting steel and its production
Inventor: TAKANO KOJI
IPC: C21D8/02
Filed: 1998-12-28
Abstract: PROBLEM TO BE SOLVED: To inexpensively provide high corrosion resistance free-cutting steel in which, particularly, the generation of hydrogen sulfide causing the reduction of the service life of the inside of apparatus in precision machined parts is suppressed. SOLUTION: This steel is the one having a compsn. contg., by weight, 0.02 to 0.12% C, 0.1 to 1.0% Si, 0.3 to 0.9% Mn, 0.15 to 0.35% S, 0.015 to 0.06% P, 8.0 to 10.0% Ni, 18.0 to 21.0% Cr and 0.005 to 0.05% N, in which, also, F value (%) shown by the formula of F(%)=3Cr+4.5Si+6.6Ti-2.8Ni-1.4Mn-1.4 Cu-84C-84N-23 is -6.0 to 0.0%, Cr/Mn>=25, and C+N: 0.07 to 0.13% are satisfied, and the balance Fe and inevitable impurities, in which the concn. of Mn in sulfide is 20 to 50%.
Patent JP-2001190011-A (JP)
Title: Coupling structure of an electric connection box
Inventor: IKENO MASAYUKI
IPC: H02G3/08
Filed: 1999-12-28
Abstract: PROBLEM TO BE SOLVED: To provide a coupling structure of an electric connection box which assures compact coupling of a plurality of electric connection boxes to realize space saving for installation. SOLUTION: An arm portion 20 is provided to a first side surface 19a of a relay box to form a space 21 for allocating a fuse box 2, the fuse box 2 is coupled to the relay box 1 with a coupling portion 17 to obtain a coupling box 18, the coupling box 18 is fitted to a body 5 through a bracket 39 for fitting to the body, and the coupling box 18 is covered with only one cover. Since a plurality of boxes (relay box 1 and fuse box 2) are covered with only one cover, the number of parts and the working space A for opening and closing the cover can be saved to realize space saving in comparison with the related art wherein the covers are provided for respective boxes. Since a plurality of boxes are fitted to the body 5 as the coupling boxes 18, the number of parts can also be reduced in comparison with the case where individual boxes are fitted.
Patent JP-2001187940-A (JP)
Title: Vibration-isolating support device
Inventor: MATSUMOTO AKIO
IPC: B62M7/02
Filed: 1999-12-28
Abstract: PROBLEM TO BE SOLVED: To lower the cost and weight of a support bracket, avoid stress concentration on the support bracket, and maintain appreciable vibration-isolating performance by suppressing axial movement of the support bracket relative to a vibration-isolating member. SOLUTION: Fitting portions 33c of a support bracket 33 onto a vibration- isolating member 34 are formed into a plurality of plates that have a plane direction perpendicular to the axis direction of the vibration-isolating member 34 and are parallel interspaced in the axis direction of the vibration-isolating member 34. Fitting holes 33d coaxially punched in the fitting portions 33c house, with a fit, the periphery of the vibration-isolating member 34 (middle cylinder portion 34a). The vibration-isolating member 34 has peripheral flanges 34b at both axial ends. The fitting portions 33c are fitted round the vibration- isolating member 34 so as to just adjoin the peripheral flanges 34b from the inside.
Patent JP-2000139616-A (JP)
Title: Armrest device for chair
Inventor: KUBO HIROTSUGU
IPC: A47C7/54
Filed: 1999-12-28
Abstract: PROBLEM TO BE SOLVED: To adjust the positions of elbow covers according to the physical constitution of a seated person by providing the elbow covers slidingly displaceable nearly on the horizontal plane at the upper end sections of elbow frames erected on both sides of the seat section of a chair. SOLUTION: An armrest device 4 is provided with an elbow frame 5 erected on the side section of a seat section 1 and an elbow cover 6 supported by the elbow frame 5, and the elbow cover 6 is fitted to the upper end section of the elbow frame 5 movably laterally. The base section of the elbow frame 5 is fixed to the lower face of the seat section 1. When the elbow covers 6 of both the right and left armrest devices 4 are moved to the center side of the seat section 1, the interval between both the right and left elbow covers 6 is W1. When both the right and left elbow covers 6 are slidingly displaced to the outermost side, the interval between both elbow covers 6 is W2.  The interval between both elbow covers 6 can be adjusted within a wide range from W1 to W2 according to the physical constitution of a seated person, particularly shoulder breadth, and a chair excellent in human engineering is obtained.
Patent JP-2000195866-A (JP)
Title: Bonding pad structure of semiconductor element and its manufacture
Inventor: LEE SOO-CHEOL
IPC: H01L23/52
Filed: 1999-12-28
Abstract: PROBLEM TO BE SOLVED: To minimize cracks within an insulating film between wirings at chip classification or wire bonding by electrically coupling the first conductive film and the second conductive film with each other by a third conductive film, and surrounding a plurality of fist island-shaped insulators with the third conductive film. SOLUTION: An interlayer insulating film 910 is made on a semiconductor substrate 900, and a bonding pad structure composed of the three layer wiring of a lower wiring 920, middle wiring 940, and uppermost wiring 960 is made on this interlayer insulating film 910. Then, a conductive plug 950 as a third conductive film is arranged between the topside of the middle wiring 940 as the first conductive film and the downside of the uppermost wiring 960 as the second conductive film, and the uppermost wiring 960 and the middle wiring 940 are electrically coupled with each other. Furthermore, the sidewalls of the plural pieces of first island-shaped insulators 945I are completely surrounded with the conductive plugs 950, and besides the top and bottom are surrounded with the uppermost wiring 960 and the middle wiring 940.
Patent JP-2001152797-A (JP)
Title: Method for assembling underground buried pipeline using metallic or plastic segment
Inventor: ISHII MITSUHIKO
IPC: E21D11/04
Filed: 1999-11-25
Abstract: PROBLEM TO BE SOLVED: To prevent the occurrence of water leakage due to the deformation of a metallic or plastic segment in a method for assembling a sewage pipeline, a water stream pipe such as an underground river pipeline, a shield tunnel for cable, and various underground buried pipeline using the metallic segment made of steel or the plastic segment made of FRP. SOLUTION: A plurality of metallic or plastic segments B formed into a box shape by providing a main beam 11 and a side beam 12 on upper and lower sides and both side sides of a slightly curved square skin plate 10, respectively, are mutually joined by tightening join faces 13, 13 of the main beam 11 mutually and join faces 14, 14 of the side beam 12 mutually by joint bolts 15 to assemble the underground buried pipeline A. Water inflating rubber layers are formed on the join faces of the main beam 11 and the side beam 12 in such a way that a bolt hole of the joint bolt 15 enters a region of the water inflating rubber layer to tighten the join faces.
Patent JP-2000184878-A (JP)
Title: Production of liquors and sweet food
Inventor: TABATA SATORU
IPC: C12G3/02
Filed: 1998-12-19
Abstract: PROBLEM TO BE SOLVED: To enable the regulation of contents of flavor ingredients and produce the subject foods by subjecting at least one flavor ingredient or ingredients participating in a reaction of the flavor ingredient to an adsorption carrier treatment, an immobilized enzyme treatment, a photoreacting treatment and a low-temperature vacuum distillation treatment, a glucide raw material to a pressurized solvent extraction, a washing treatment with a supercritical gas or a heat treatment with an oxygen free gas and at least the one flavor ingredient or ingredients participating the reaction of the flavor ingredient to an ion replacement treatment. SOLUTION: The foods are produced by carrying out a treatment for adsorbing at least one flavor ingredient or ingredients participating in a reaction of the flavor ingredient by an ionic or a physical adsorption carrier, a treatment for conducting an enzyme reaction of at least the one flavor ingredient or the ingredients participating in the reaction of the flavor ingredient with an immobilized enzyme, a treatment for modifying at least the one flavor ingredient or the ingredients participating in the reaction of the flavor ingredient by a photoreaction and a treatment for separating at least the one ingredient or the ingredients participating in the reaction of the flavor ingredient by a low-temperature vacuum distillation, a pressurized solvent extraction,  a washing treatment with a supercritical gas or a heat treatment with an oxygen free gas of a glucide raw material and an ion replacement treatment of at least the one ingredient or the ingredients participating in the reaction of the flavor ingredient with an ionic ingredient-containing carrier in a production process for liquors and a sweet food obtained by brewing the glucide raw material.
Patent JP-2000189070-A (JP)
Title: Fried food and its production
Inventor: AIKAWA TOSHIO
IPC: A23L19/18
Filed: 1998-12-28
Abstract: PROBLEM TO BE SOLVED: To provide a fried food where the appearance of the fried food is improved and the content is recognizable. SOLUTION: This fried food is produced by including a core ingredient in an intermediate one so as to become multilayered in such a way that at least a part of the core ingredient is exposed from the intermediate one and then by frying them in a state that the intermediate ingredient is partially coated. The method for producing the fried food comprises the above procedures. The adhesion of a batter liquid and/or a coating food material to exposed portions is prevented by being sprinkled with separating powder. A potato, a pumpkin or the like in a steamed and mashed state is used as the intermediate ingredient, and corn, spinach or the like is used as the core ingredient.
Patent JP-H04208889-A (JP)
Title: Active sonar device
Inventor: SHIMIZU TOSHIO
IPC: G01S15/58
Filed: 1990-12-03
Abstract: PURPOSE:To avoid overlap of receiving bands in the same band width even in the case using a plurality of transmission signals by correcting in advance the transmission signal for the Doppler frequency displacement due to the movement of the self-ship and sending it. CONSTITUTION:A transmission signal of square wave and the like with a determined pulse width which is generated in a transmission source signal generation circuit 1 is given to a self-Doppler elimination circuit 2. The self-Doppler elimination circuit 2 converts the frequency of the input transmission signal to a transmission signal shifted in advance for the self-Doppler frequency displacement due to the movement of self-ship. And a receiving self-Doppler frequency displacement of the same degree as the transmitting self-Doppler frequency displacement is added to eliminate the self-Doppler frequency displacement caused during transmitting and receiving. The relation between the target of receiving wave and transmitter and receiver is only 10 seconds even taking into account the elapsing time corresponding to the interval between transmission and reception. Therefore, the receiving self-Doppler frequency displacement can be processed by regarding it almost the same as the transmitting self-Doppler frequency displacement.
Patent JP-H04209162-A (JP)
Title: Regular size feeding device
Inventor: MIURA KENICHI
IPC: B65H41/00
Filed: 1990-12-03
Abstract: PURPOSE:To grasp a part of a flexible member easily by sensing the member with a sensor allowing a part thereof to hop out from the bent part and tearing the part of the member off from the tape at the bent part. CONSTITUTION:A photoelectric sensor 32 is provided to sense a flexible member 3, and if the flexible member 3 is not there, a feed motor 20 is driven to draw out a tape 4. When the sensor 32 senses the tip of the flexible member 3, the motor 20 is driven for a certain period of time to draw out a certain amount of tape 4. A bent part 6b is provided to bend the tape 4, and the flexible member 3 having passed this bent part 6b is torn off from the tape 4 by its own resilience. When the motor 20 is driven for a certain while and stopped, part of the flexible member 3 takes an attitude as hopping out from the bent part 6b.
Patent JP-H04209550-A (JP)
Title: Measuring method for base resistance of transistor
Inventor: ONISHI HIROAKI
IPC: H01L21/66
Filed: 1990-12-05
Abstract: PURPOSE:To accurately measure by obtaining a voltage Vebo to be directly applied to a barrier layer between emitter bases from an emitter-base voltage Veb when a base current is '0', and obtaining a base resistance Rb in a predetermined order from a difference between the voltage Veb and the voltage Vebo. CONSTITUTION:A variable power source 12 is connected to a collector electrode 3, and an ammeter 9 for measuring a base current (Ib) is connected to a base electrode 2. A constant-current source 10 for holding an emitter current constant and a voltmeter 11 for measuring a voltage (Beb) between an emitter and a base are connected to an emitter electrode 1. The Veb is the sum of a voltage Vebo to be applied directly to an insulating layer 5 of a barrier layer between the emitter and the base and a voltage drop  Vb generated via a base resistance Rb. Accordingly, when a power source 12 is regulated so that the Ib becomes '0' and the Veb is measured by the voltmeter 11, Veb=Vebo is obtained, and the resistance Rb is obtained from Vb=Veb-Vebo and the resistance Rb= Vb/Ib. Thus, an accurate base resistance can be measured.
Patent JP-H04213639-A (JP)
Title: Piller and beam connection part structure
Inventor: OKAWA YASUO
IPC: E04B1/58
Filed: 1990-12-12
Abstract: PURPOSE:To facilitate laying of a floor form by laying connection metal pieces larger than the dimension of a pillar mutually across perpendicularly and fixing a connection metal piece connected to the flange part of a beam to the flange part, and connecting them together by means of a bolts. CONSTITUTION:Connection metal pieces 3 laid across perpendicularly within a pillar 1 and connection metal pieces 4 set on flanges of a steel-frame beam 2 are connected together with bolts. The connection metal pieces 3 are made in the form of a rod of a length spanning the side faces of the pillar 1, and male screw parts 3a, 3b are formed on both ends and a flat part 3b is formed in the middle. The flat parts 3b are laid across mutually perpendicular directions within the pillar 1. The connection metal piece 4 is formed in a flat plate part 4a having plural bolt holes, and a bolt 4b. The flat plate part 4a is secured to the flange part of the steel-frame beam 2 by means of bolt 6. Then, the connection metal piece 3 and the connection metal piece 4 are connected together through a coupler 5. The work of laying a floor form can thus be facilitated.
Patent JP-H04216660-A (JP)
Title: Lead frame for semiconductor element
Inventor: IKENAGA CHIKAO
IPC: H01L23/50
Filed: 1990-12-17
Abstract: PURPOSE:To prevent the strain and the deformation of a die pad and a pad for an insulative film which are to be generated at the time of depressing. CONSTITUTION:Four slit holes 12 stretching along the sides of a die pad 2 are dug at a boundary part between the central part of the die pad 2 and a pad 7 for an insulating film. The strain generated when the die pad 2 is depressed is absorbed by the slit holes 12. Hence the strain and the deformation are scarcely generated in the semiconductor element mounting part of a central recess part 2a of the die pad 2, and the pad 7 for an insulative film.
Patent JP-H04224424-A (JP)
Title: Shift lever detention device of tractor, etc.
Inventor: KAWAGUCHI HIROMICHI
IPC: F16H59/04
Filed: 1990-12-25
Abstract: PURPOSE:To detain each shift position properly with a shift lever and provide sharp sense of speed change by coupling a detent rod in a detaining mechanism to detain each shift position with the shift lever or an arm on the lever shaft formed in a single piece with the shift lever. CONSTITUTION:An engine 8 is mounted in the front part of a truck body 7. and a belt 12 is set interlockingly from a drive shaft 9 at the bottom of the engine 8 to the input shaft 11 on the rear-side transmission case 10. A transmission device 1 is accommodated in the transmission case 10 and is operated by a main shift lever 2 and aux. shift lever 16 located on one side of a steering wheel 15. A detaining mechanism 5 is installed on a bracket 20 of a steering post 17 so as to detain each shift position of the main shift lever 2. A detent rod 6 to perform this operation is coupled with an arm 4 through a lever shaft 3 formed in a single piece with the main shift lever 2.
Patent JP-H04221656-A (JP)
Title: Thermal transfer recording device
Inventor: YOSHIDA TAKEHIRO
IPC: B41J29/00
Filed: 1990-12-25
Abstract: PURPOSE:To obtain a thermal transfer recording device capable of preventing an ink sheet from sticking to a recording sheet as well as damage to the ink sheet by removing a sag in the ink sheet prior to recording. CONSTITUTION:An ink sheet 14 is taken up by a specified amount prior to recording and it is checked whether the transport of the ink sheet has been confirmed, using a photointerrupter 36. If the transport of the ink sheet 14 is confirmed, it is made possible to allow a recording action, interpreting that no sag is present in the ink sheet 14. Subsequently, it is possible to prevent the ink sheet 14 from sticking to a recording sheet 11, and damage on the ink sheet 14 and the contamination of the recording sheet 11.
Patent JP-H04228800-A (JP)
Title: Concrete segment
Inventor: TSUZUKI JUNICHI
IPC: E21D11/08
Filed: 1990-12-27
Abstract: PURPOSE:To obtain concrete segments which can be easily produced at a low cost and to secure the sufficient strength of the segments and combining strength among them. CONSTITUTION:Plural high rigid main steel frames 4 formed by uniting two main steel frames 2 provided in parallel at adjacent positions through connecting metal fittings which are provided at both the longitudinal ends of the steel frames 2 and mutually connect them are arrangedly provided inside a concrete segment as its reinforcing aggregate. The concrete segment can be easily and inexpensively produced by simple work for setting the existing high rigid main steel frame 4 integrally produced through the connecting metal fittings, and the main steel frame 4 gives sufficient strength to the concrete segment, and the connecting metal fittings 3 to form a part of the main steel frame 4 strengthen the connection of the concrete segment.
Patent JP-H0671618-A (JP)
Title: Edge cutting control method in material wood barker and device therefor
Inventor: TAKAHASHI KOJI
IPC: B27L1/10
Filed: 1990-12-17
Abstract: PURPOSE:To prevent an excessively oblique cut from occurring when a residual part is cut off at both end edges of a material wood by a method wherein the material wood is horizontally supported and rotated in a circumferential direction, and a bark or the like is cut off by transversely and axially moving the material wood with cutter rolls abutted on the peripheral part thereof. CONSTITUTION:In a material wood barker, a material wood 1 cut to a predetermined dimension is carried on a pair of right and left material wood drive rolls 3a, 3b by a roll conveyor or the like and rotated by the peripheral drive of the rolls. On the other hand, above the peripherally driven material wood 1, cutter rolls 5a, 5b with a large number of blades implanted are disposed so as to retract from or abut on the peripheral part of the material wood 1 by retracting/abutting mechanisms 8a, 8b consisting of fluid cylinders 6a, 6b using a hydraulic system or the like and a foldable link or the like. A transverse travel mechanism 12 is provided to move the cutter rolls 5a, 5b and the retracting/abutting mechanisms 8a, 8b transversely in the axial direction of the material wood 1. The peripheral part of the material wood is spirally cut off to be barked by the transverse travel of the cutter rolls and the rotation of the material wood rolls 3a, 3b.
Patent JP-H04242582-A (JP)
Title: Packaging device
Inventor: SUZUKI YASUHIKO
IPC: B65D85/00
Filed: 1990-12-19
Abstract: PURPOSE:To use a single product commonly for an upper side cushioning body and lower side cushioning body, which contain an object to be packaged under a pinched condition by constituting the upper and lower cushioning bodies by the same shape and dimension to be fitted under a mutually reversed condition. CONSTITUTION:For this invention, an upper side cushioning body 3 and a lower side cushioning body 2, which contain an object to be packaged 1 under a pinched condition, are constituted by a single product with the same shape and dimension, which consists of an internal U-shaped fitting protuberant wall which is provided on a base plate and a peripheral edge part on the half surface, and is divided in two under a right and left confronted condition, and an external U-shaped fitting protuberant wall which is adjacent to the outside of the internal U-shaped fitting protuberant wall, and those two walls are fitted under a top and bottom reversed condition. By this method, the packaging device can use a combination of the single product, and the die manufacture cost also can be saved.
Patent JP-H04221188-A (JP)
Title: Boring device
Inventor: HARA KATSUHIRO
IPC: E02D3/12
Filed: 1990-12-20
Abstract: PURPOSE:To improve the workability of a boring device and reduce the execution cost by installing penetration devices on both the sides of a frame and installing a rotary device on the frame and spreading the diameter of a precedingly drilled hole. CONSTITUTION:A boring device is constituted of a frame 1, rotary supporting device 10, and penetrating devices 20a and 20b which are installed on both the sides of the frame 1. The penetration device 20a is constituted of a swivel head body 2 fixed on a slide frame 3 which is freely raised and lowered on the frame 1, hydraulic cylinders 4 and 4 installed on both the sides of the swivel head body 2, and a hydraulic chuck 6 for holding a boring rod. After the preceding drilling by using the first boring rod, the frame 1 is revolved by the rotary device 10, and the second boring rod is inserted into the preceding drilled hole, and the diameter is spread. Accordingly, after the first drilling, the diameter spreading drilling work can be executed in succession by one device.