baber/WOPTO huggingface dataset:
Patent JP-2011215501-A (JP)
Title: Method of manufacturing panel for color display type information
Inventor: YAMAZAKI HIROTAKA
IPC: G09F9/30
Filed: 2010-04-01
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a panel for color display type information to accurately form a color filter without spreading ink.SOLUTION: The method of manufacturing a panel for color display type information is provided so that the panel is constituted so as to seal a display medium in an inter-substrate space in which an observation side substrate and a back side substrate are oppositely disposed, to reflect light emitted from the observation side, and to recognize as color information through a color filter of each color provided to the observation side substrate, wherein the color filter has a smaller area than a pixel and the observation side substrate is formed in a laminated structure. The method includes: a recessed portion forming process to remove part of a transparent resist layer and to form a first recess depending on a place for installing the color filter after disposing the resist layer outside a first transparent sheet which forms the laminated structure and is disposed closely to the display medium substrate; and a color filter forming process to form the color filter by filling predetermined ink depending on the color filter of each color in the first recess using a printing method.
Patent JP-2010158057-A (JP)
Title: Image processing method and apparatus
Inventor: YAMAZOE MANABU
IPC: G06T1/00
Filed: 2010-04-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image processing method for performing color cast correction on respective pixels of a source image and image signal conversion for a printer on corrected image data.  <P>SOLUTION: RGB image data are converted into luminance Y and chromaticity C1, C2 and the highlight point and the shadow point thereof are determined, thereby obtaining an axis 1 of a color solid connecting these points. Transformation characteristics for the rotation and parallel movement are calculated so that the axis becomes parallel to a luminance axis Y and a pixel of bottom luminance is matched with an origin, color cast is corrected in accordance with the transformation characteristics, and image signal conversion for a printer is performed on the corrected image data.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011224832-A (JP)
Title: Image formation device
Inventor: HIRANO MASAYUKI
IPC: G03G21/14
Filed: 2010-04-16
Abstract: PROBLEM TO BE SOLVED: To solve a problem wherein a rotating speed of a photoreceptor is not uniform when looked at strictly, and when the rotating speed varies, correction data corresponding to a position exposed by a light beam may not be read.SOLUTION: A first mark 301 and a second mark 302 are formed on a photoreceptor drum 104, and the marks are detected by a rotation reference position sensor 206. A counter is reset by a detection signal corresponding to the first mark, and counted up by a detection signal corresponding to the second mark. A CPU 201 corrects exposure intensity based on light amount correction data read from a memory 203 in accordance with a count value.
Patent JP-2011228430-A (JP)
Title: Semiconductor module cooling device
Inventor: ISHIKAWA KEITARO
IPC: H01L23/36
Filed: 2010-04-19
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor module cooling device capable of improving cooling performance to cool the semiconductor module with a simple configuration.SOLUTION: A cooling device 10 comprises: a housing 14 that accommodates a semiconductor module 12; a cooling tube 16 that is provided on the inner surface of the housing 14 and cools the semiconductor module 12; and a heat radiating member 18 that is provided between the semiconductor module 12 and the cooling tube 16 and radiates heat of the semiconductor module 12 to the cooling pipe 16. The cooling device 10 can improve cooling performance to cool the semiconductor module 12 with such a simple configuration.
Patent JP-2011223927-A (JP)
Title: Automatic feeding device
Inventor: ANDO MASAO
IPC: A01K5/02
Filed: 2010-04-20
Abstract: PROBLEM TO BE SOLVED: To provide an automatic feeding device which gives a feeding time, when a timer is operated, and discharges a feed, when a pedal or the like is stepped at the time, and does not discharge the feed, even when the pedal or the like is stepped in a timer-non-operated state.SOLUTION: The automatic feeding device 10 has a casing portion 12 having an opening for charging a feed in the upper portion, and a lid portion 14 for covering the upper opening. A portion of the peripheral wall of the casing portion 12 is notched, and a tray 20 having a feed-saving portion 16 at the tip, and a pedal 18 to be stepped by a leg of a domestic dog 8 are extended on the outside of the casing portion 12. A timer 22 for setting a feeding time for supplying the feed to the tray 20, and a supplied feed quantity-setting portion 24 for setting the quantity of the feed to be supplied for one meal are disposed on the peripheral wall of the casing portion 12. A basket not supplying the feed, until the timer 22 does not reach a feeding time, and an opening or closing portion for opening the discharging portion of the basket, when the pedal 18 is stepped, are disposed in the casing portion 12.
Patent JP-2011229039-A (JP)
Title: Mobile communication device and illumination light control method for the same
Inventor: MATSUMURA TAKAKAZU
IPC: H04N5/238
Filed: 2010-04-22
Abstract: PROBLEM TO BE SOLVED: To provide a mobile communication device and an illumination light control method for the same which facilitate an adjustment of an imaging direction with a simple structure and control.SOLUTION: The mobile communication device such as a cellular phone comprises: a camera unit (14) disposed at a casing (12) of the mobile communication device; a light unit (15) which emits illumination light in a direction parallel to the light axis (14a) of the camera unit (14); and an illumination light/guide light switching unit (16) which is disposed on the light unit (15) and switches illumination light (15b) from the light unit (15) to guide light (15a) which forms an optical mark on the surface to be imaged (18a) of the subject (18).
Patent JP-2011230734-A (JP)
Title: Airbag device for motorcycle
Inventor: HAYAKAWA KENJI
IPC: B60R21/215
Filed: 2010-04-30
Abstract: PROBLEM TO BE SOLVED: To provide an airbag device for a motorcycle capable of preventing interference between a door part and a support member that moves upward during action, even with a configuration in which the door part of an airbag cover is so arranged as to cover the upper part of the support member and the airbag.SOLUTION: An airbag device M for a motorcycle includes an airbag 23, and a support member 59 capable of supporting the front side of the airbag 23 when swelling completes. The support member 59 can move upward as high as a support position capable of supporting the airbag 23 at the time of development and swelling of the airbag 23. An airbag cover 68 that covers the upper part of the support member 59 and the collapsed airbag 23 includes a door part 76 which is pushed and opened by the airbag 23. An interference suppressing means CM is arranged which can suppress interference between the door part 76 and the support member 59 that rises at the time of action. The interference suppressing means CM is so configured as to delay starting of movement of the support member 59 upward than starting of swelling of the airbag 23.
Patent JP-2011230743-A (JP)
Title: Floor mat for driver's seat
Inventor: YOSHIDA KENJI
IPC: B60N3/04
Filed: 2010-04-30
Abstract: PROBLEM TO BE SOLVED: To provide a floor mat for driver's seat that exhibits superior non-slip effect on a carpet on a floor in a vehicle, and prevents a situation where an accelerator pedal cannot return to an initial position even when the mat overlaps the accelerator pedal accidentally.SOLUTION: The floor mat for driver's seat includes a front-side carpet and a back-side carpet to be adhered on the back side of the front-side carpet. The front-side carpet includes a front-side base fabric and front-side pile threads implanted on the front-side base fabric. The back-side carpet includes a back-side base fabric and back-side pile threads implanted on the back-side base fabric. The back-side carpet has a first area near the accelerator pedal in a vehicle and a second area far from the accelerator pedal. Each of the back-side pile threads in the second area has an engagement area for increasing the non-slip effect at its tip. Each of the back-side pile threads in the first area has no engagement area at its tip.
Patent JP-2011234825-A (JP)
Title: Game machine
Inventor: KAWAI RIKIYA
IPC: A63F5/04
Filed: 2010-05-07
Abstract: PROBLEM TO BE SOLVED: To reduce a load on reels and a stepping motor.SOLUTION: In a slot machine 10 determining stop symbols to be displayed at prescribed positions on an effective line when the reels 61 are stopped when a stop command for the rotating reels 61 (61L, 61M, 61R) is outputted, selecting one stop condition between the first stop condition for stopping the reels 61 after decelerating (slow-down) the reels 61 till the stop symbols reach the prescribed positions, based on relation between determined stop planned symbols and the prescribed positions on the effective line and the second stop condition for stopping the reels 61 without decelerating the reels 61, and then, stopping the reels 61 on the selected stop condition, the first stop condition is selected when the stop symbols can be stopped and displayed at the prescribed positions on the effective line when the reels are stopped on the first stop condition.
Patent JP-2010199611-A (JP)
Title: Semiconductor device
Inventor: SUGINO MITSUO
IPC: H01L25/065
Filed: 2010-05-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing a warpage of a substrate in package-on-package (POP) structure, and capable of restraining a connection reliability from getting low, and a method of manufacturing the semiconductor device.  <P>SOLUTION: This semiconductor device 100 includes the first resin substrate 101 mounted with the first semiconductor chip 125 on a surface, the second resin substrate 111 mounted with the second semiconductor chip 131 on a surface, and a resin base material 109 joined to the surface of the first resin substrate 101 and a reverse face of the second resin substrate 111, and connecting those electrically. The resin base material 109 is arranged in an outer circumference of the first resin substrate 101 on the surface of the first resin substrate 101. The first semiconductor chip 125 is arranged in a cavity part provided among the first resin substrate 101, the second resin substrate 111 and the resin base material 109, on the surface of the first resin substrate 101.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011239189-A (JP)
Title: Pulse modulation apparatus and pulse modulation method
Inventor: KUDO MIYUKI
IPC: G01S7/282
Filed: 2010-05-11
Abstract: PROBLEM TO BE SOLVED: To prevent generation of a jitter when a signal rises and falls after pulse modulation.SOLUTION: The pulse modulation apparatus is provided with an N frequency division circuit 3 which divides the frequency of an input signal into 1/N, a modulation pulse generating circuit 4 which generates a modulation pulse signal in synchronization with a signal from the N frequency division circuit 3, and a pulse modulation circuit 5 which performs pulse modulation on an input signal in synchronization with the modulation pulse signal.
Patent JP-2011014879-A (JP)
Title: Semiconductor device
Inventor: MASUDA MASACHIKA
IPC: H01L23/00
Filed: 2010-05-14
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing a semiconductor chip from being damaged by cutting burrs of a metallic shielding plate.SOLUTION: The semiconductor device 50 includes a semiconductor chip 51 and a metallic shielding plate 40 provided on a circuit surface 51A of the semiconductor chip 51. The metallic shielding plate 40 is disposed in such a manner that a second surface 41B of a shielding plate 41 is directed towards the circuit surface 51A of the semiconductor chip 51, and burrs 42 are positioned contiguous to the second surface 41B of the shielding plate 41. At distal ends of the burrs 42, cutting burrs 43 are formed in a direction orthogonal to the second surface 41B. The cutting burrs 43 extend in a direction opposite to the semiconductor chip 51, so that the cutting burrs 43 are prevented from damaging the circuit surface 51A of the semiconductor chip 51.
Patent JP-2011242285-A (JP)
Title: Positioning support device and positioning support method
Inventor: SUZUKI TAKASHI
IPC: G01S19/12
Filed: 2010-05-19
Abstract: PROBLEM TO BE SOLVED: To transmit approximate position information of high precision to a communication terminal.SOLUTION: Approximate position information which is used for positioning operation in a communication terminal 60 and indicates a position of a cell C1 visited by the communication terminal 60 and a cell ID identifying the cell C1 are stored in an approximate position information DB23 of an SUPL server 20 in association with each other. The SUPL server 20 acquires approximate position information stored in the approximate position information DB23 on the basis of a positioning information transmission request transmitted from the communication terminal 60 and including the cell ID and transmits the approximate position information to the communication terminal 60 from a communication unit 21. Thereafter, the SUPL server 20 receives positioning result information transmitted from the communication terminal 60 and updates the approximate position information stored in the approximate position information DB23 on the basis of the positioning result information by a control part 22. If positioning operation in the communication terminal 60 fails, the SUPL server 20 determines whether the approximate position information transmitted to the communication terminal 60 is defective or not on the basis of an error code and number-of-satellites information included in the positioning result information from the communication terminal 60 and initializes the approximate position information on the basis of the determination result.
Patent JP-2011243845-A (JP)
Title: Silicon epitaxial wafer and method of manufacturing the same
Inventor: SHIGA YUTAKA
IPC: C30B29/06
Filed: 2010-05-20
Abstract: PROBLEM TO BE SOLVED: To provide a silicon epitaxial wafer using a (110) substrate in which surface quality such as haze, surface roughness, or the like, is improved, and to provide a method of manufacturing the same.SOLUTION: The method of manufacturing a silicon epitaxial wafer where a silicon homoepitaxial layer is grown on a surface of a silicon single crystal wafer includes, at least, a step for preparing a silicon single crystal wafer having a plane direction determined by inclining the (110) plane in the <112> direction in a range of 0.1-8°, and a step for growing a silicon homoepitaxial layer on the surface of the silicon single crystal wafer thus prepared.
Patent JP-2011248420-A (JP)
Title: Protection panel and electronic device
Inventor: TAKAI YUICHIRO
IPC: H01H13/52
Filed: 2010-05-24
Abstract: PROBLEM TO BE SOLVED: To provide a protection panel having a switch section on a surface-side substrate which does not become concave with time to prevent deterioration of appearance, while ensuring durability of a contact point, and to provide an electronic device.SOLUTION: The protection panel includes a pressure-sensitive conductive member 25 that is in contact with an upper electrode 6G for peripheral switch and a lower electrode 5G for peripheral switch and located in a through-hole 10 of a substrate adhesive layer 17. A force acting on a peripheral switch 12 is transmitted to the pressure-sensitive member through upper and lower electrode substrates, to supply current for electrically connecting the upper and lower electrodes.
Patent JP-2011247704-A (JP)
Title: Semiconductor integrated circuit device
Inventor: CHUKO TAKAHISA
IPC: H01L21/822
Filed: 2010-05-26
Abstract: PROBLEM TO BE SOLVED: To more reduce the current consumption of a user circuit.SOLUTION: A semiconductor integrated circuit device includes a user circuit 13, a scan flip flop circuits FF11 to FF1n holding data relating to a scan test of the user circuit 13, and a gate circuit (AND10 and AND11 to AND1n) outputting one of an output value of the scan flip flop circuits FF11 to FF1n and a fixed logical value to the user circuit 13 and controls the gate circuit (AND10 and AND11 to AND1n) so as to output the fixed logical value to the user circuit 13 in a sequence relating to the scan test.
Patent JP-2011253744-A (JP)
Title: Circuit breaker capable of detecting poor contact
Inventor: YOSHIDA ATSUSHI
IPC: H01H83/20
Filed: 2010-06-03
Abstract: PROBLEM TO BE SOLVED: To provide a circuit breaker which can detect poor contact of a power supply side terminal and a load side terminal with one sensor circuit.SOLUTION: A feeder line 7 and a detection line 8 are wired in parallel between a power supply side terminal 3 and a load side terminal 4. A main contact 9 is provided on the feeder line 7, and a sensor circuit 11 and a switch 12 are provided in series on the detection line 8. Based on the output from the sensor circuit 11, a control circuit 14 determines poor contact of terminal components 5 and 6, and outputs a trip command to a trip coil 20. The trip coil 20 is connected to a manual handle 23 and a switch open/close mechanism 21 by a linkage member 22. When the trip coil 20 trips the main contact 9, the open/close mechanism 21 opens the switch 12 and interrupts a current flowing to the detection line 8.
Patent JP-2011257924-A (JP)
Title: Testing device and test method
Inventor: IDE TAKETOSHI
IPC: G06F11/28
Filed: 2010-06-08
Abstract: PROBLEM TO BE SOLVED: To facilitate detection of a path which has not been passed through by tracing a jump result of a conditional instruction of a program while writing the result in RAM.SOLUTION: The following improvements have been made on the basis of the conventional micro program tracer disclosed in Patent Application Publication No. H5-224990: For a RAM1, a 1c of the RAM1 has been added, which stores flag information indicating that a jump has been performed to a branch destination of a branch instruction if a branch has been established in the branch instruction. A signal 20 indicating that a branch has been established and an address for a branch destination has been determined is output from a branch control 5 to a buffer register 7 and is also connected to the 1c of the RAM1 as a write enable signal. A signal line 21 is output from the buffer register 7 and connected to the 1c of the RAM1. The 1c added to the RAM1 can be read from a signal line 18 which reads contents of the RAM1. Furthermore, detection of a path which has not been passed through is performed from RAM1 information including a RAM which has been added to the RAM1.
Patent JP-2012001508-A (JP)
Title: Method for producing olefin chlorohydrin compound
Inventor: SHIMADA MASANORI
IPC: C07C29/03
Filed: 2010-06-18
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing an olefin chlorohydrin compound, efficiently utilizable of byproduct hydrogen chloride for producing an end product without using a neutralizing agent irrelevant to the production of the end product while using a neutralizing agent that can be utilized to the maximum extent for producing the end product.SOLUTION: The method for producing an olefin chlorohydrin compound, including a reaction step of producing an olefin chlorohydrin compound by allowing hypochlorous acid obtained by dissolving chlorine into water to react with an olefin compound, is characterized by controlling the pH of the reaction system in a range of 2 to 7 by virtue of a hypochlorite.
Patent JP-2012009220-A (JP)
Title: Backlight device, liquid crystal display
Inventor: MATSUHISA KOICHIRO
IPC: G02B6/00
Filed: 2010-06-23
Abstract: PROBLEM TO BE SOLVED: To provide a backlight device while capable of minimizing the connecting wire materials as few as possible which are arranged to a plurality of LED substrates corresponding to at least one edge of a liquid crystal panel, and also capable of preventing unevenness in brightness in a nearby region of the connecting portion of the LED substrate, and to provide a liquid crystal display having the same.SOLUTION: Two neighboring LED substrates 13, 14 are separated in a direction perpendicular to substrate surfaces of the LED substrates 13, 14, and connector connection terminals 23a, 23b are arranged to be overlapped in a direction perpendicular to the substrate surfaces of the LED substrates 13, 14. In such a state, by mounting a connector 23 on through-holes 24a, 24b of the connector connection terminals 23a, 23b in a direction parallel to transverse direction of the substrate surfaces of the LED substrates 13, 14, all the LEDs 13a to 13e, and 14a to 14e are arranged with evenly spaced intervals d1 over the two LED substrates 13, 14.
Patent JP-2012006038-A (JP)
Title: Draw bead test method and press forming analyzing method using physical property value determined by the same test method
Inventor: SHIRAGAMI SATOSHI
IPC: G01N19/02
Filed: 2010-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a draw bead test method by which physical property values, which are necessary when designing a press forming die having the draw bead, other than the coefficient of friction of a die between a press forming die and a metal sheet in a draw bead part, is determined without performing the draw bead test a plurality of times; and to provide highly accurate numerical analyzing method using the physical property values determined by that draw bead test method.SOLUTION: By continuously measuring the variation of pressing load which is applied to a pair of tool dies, the variation of drawing load which is applied to one end of the metal sheet and the variation of an interval between the pair of tool dies between which the metal sheet is held when drawing the metal sheet which is held with the pair of the tool dies having the draw bead, the pressing load when the interval is suddenly started to increase from within a prescribed range is taken as lift-up force when the metal sheet pushes the tool dies open and the lift-up force is taken as one of the boundary conditions of a finite element method.
Patent JP-2011109059-A (JP)
Title: Method of forming electronic device
Inventor: BAE YOUNG CHEOL
IPC: G03F7/26
Filed: 2010-06-25
Abstract: <P>PROBLEM TO BE SOLVED: To enable a controlled increase, decrease or maintenance in size of a resist pattern to be formed.  <P>SOLUTION: A method of forming an electronic device includes: (a) providing a semiconductor substrate including one or more layers to be patterned; (b) applying a first layer of a photosensitive composition over one or more layers to be patterned; (c) exposing the first layer to activating radiation through a patterned photomask; (d) developing the first layer to form a resist pattern; (e) heat-treating the resist pattern in a hard bake process; (f) treating the resist pattern with a material effective to make the surface of the resist pattern alkaline; (g) applying a second layer of a photosensitive composition to come into contact with the alkaline surface of the resist pattern; (h) heating the second layer of the thermally sensitive composition to a temperature effective for a thermal acid generating agent to generate an acid; (i) and developing the heated second layer.  <P>COPYRIGHT: (C)2011,JPO&INPIT