baber/WOPTO huggingface dataset:
Patent JP-S61105840-A (JP)
Title: Manufacture of semiconductor element
Inventor: TANIGUCHI HITOSHI
IPC: G03F7/20
Filed: 1984-10-30
Abstract: PURPOSE:To enable to indicate the data of manufacture, the lot number of manufacture and the like by a method wherein a photoetching is performed by rotating a mask successively at the unit of 90 deg. and by assembling each pattern on which a corner mark is shifted, and a semiconductor element is formed. CONSTITUTION:The corner pattern 41, to be used for indication of type of semiconductor element, and an aperture on the insulating film of the expected base region forming part are formed by the first photoetching process. The corner pattern 42 to be used for indication of the month of manufacture and an aperture on the expected emitter region forming part are formed by performing the second photoetching process. The aperture, to be used for formation of emitter and base electrodes, and the corner pattern 43 are formed simultaneously by performing the third photoetching process. Then, an emitter electrode 7E, a base electrode 7B and the like and the corer pattern 44 to be used to indicate the month of manufacture are formed by performing another photoetching process. As above-mentioned, the semiconductor elements are manufactured for a month, for example, using the corner patterns 41-44, and the corner pattern is changed to 45 next month by rotating the mask of the fourth photoetching, thereby enabling to indicate the time of manufacture by month.
Patent JP-H0896771-A (JP)
Title: Light source device, manuscript-reading irradiation device using this device, and heating device
Inventor: KINOSHITA TAKESHI
IPC: H01K1/40
Filed: 1994-09-21
Abstract: PURPOSE: To provide a light source in which internal stress does not generate in a sealing part even if shock or vibration is applied and a bulb is thermally expanded, and damage such as breakage is prevented, and provide a manuscript reading-use irradiation device using this light source device, and a heating device. CONSTITUTION: In a light source in which a fixing fixture 2 is connected to an external lead-in wire 16a introduced from the end of a tubular bulb 10, and the fixing fixture 2 is fixed to a supporting member 4 by a linkage hole 21, a bent part 22 capable of elastically deforming is formed on the way of the fixing fixture 2. Even when shock or vibration is applied to the tubular light source, it is thermally expanded, the bent part of the fixing fixture is elastically deformed to absorb the shock or vibration, and allows the elongation of the bulb. Thereby, internal stress does not generate in a sealing part, and damage such as breakage is prevented.
Patent JP-S6286752-A (JP)
Title: Manufacture of semiconductor integrated circuit
Inventor: MATSUO ICHIRO
IPC: H01L27/088
Filed: 1985-10-11
Abstract: PURPOSE:To reduce base resistance by forming an emitter layer, an emitter electrode and an external base layer with one photomask in a self-alignment manner. CONSTITUTION:After layers 2 and 2' are formed in a P-type silicon substrate 1, a field oxide film 3 and a gate oxide film 4 are formed. Then boron iis implanted with a photoresist film 20 as a mask to form a P<+> type active base layer 81 of an NPN type bipolar transistor. Then the oxide film 4 is removed and an N<+> type polycrystalline silicon film 51 and an oxide film 22 are formed over the whole surface. Then the oxide fim 22 and the silicon film 51 are re moved to form a gate 52 and an electrode 53. Then phosphorus ions are implanted to form N<-> type source and drain layers 71 and an oxide film 24 is formed over the whole surface. Then the whole surface of the substrate is vertically etched and spacers 241 and 242 are formed on the side walls of the gate 52 and the electrode 53. Then arsenic ions are implanted to form layers 72 and 101 and the impurity in the electrode 43 is diffused to form a layer 91. Then boron ions are implanted to form layers 61 and 82. With this constitu tion, a semiconductor integrated circuit with very small base resistance and suitable for high speed operation is obtained.
Patent JP-H0954024-A (JP)
Title: Sampling device
Inventor: SHIROMARU ISAO
IPC: G01N1/02
Filed: 1995-08-12
Abstract: PROBLEM TO BE SOLVED: To provide such a sampling device as being capable of continuously separating and removing dust from combustion exhaust gas sampled as sample gas and continuously supplying the sample gas to a gas analyzer of high response. SOLUTION: In a sample gas supply passage 3 connecting a gas sampling part 2 and a gas analyzer 4, cyclones 10, 11 to separate dust and smoke from combustion exhaust gas G as sample gas S sampled by the gas sampling part 2 and a pump 21 connected in series thereto to suck the sample gas S are provided. A part of the sample gas S passing through the cyclones 10, 11 is supplied as utility gas U to ejectors 13, 14, provided in the cyclones 10, 11, via the pump 21.
Patent JP-H0565643-A (JP)
Title: Method for preventing peeling of adhered film for inline type sputtering device and device therefor
Inventor: ITANO TSUTOMU
IPC: C23C14/56
Filed: 1991-09-06
Abstract: PURPOSE:To provide a method for preventing the peeling of a film of a dielectric film forming chamber in which the using periods of a shutter and an adhesion preventing sheet or the like are prolonged and the improvement of mass- productivity is attained and to provide the dielectric film forming chamber. CONSTITUTION:The peeling of a dielectric film form a shutter 106 and an adhesion preventing sheet 14 is suppressed with a metallic film. For this purpose, in addition to a main sputtering electrode 103, a sub-sputtering electrode 115 is provided. The sub-sputtering electrode 115 is provided at a position in which metallic sputtering can be executed to the shutter 106 and the adhesion preventing sheet 114. Furthermore, a sub-shutter 118 is provided so as to prevent the staining of a target 104 of the main sputtering electrode 103 at the time of executing sputtering from the sub-sputtering electrode 115.
Patent JP-H0675480-A (JP)
Title: Wet developing device
Inventor: MIYAKI KAZUYUKI
IPC: G03G15/10
Filed: 1992-08-26
Abstract: PURPOSE:To provide a wet developing device in which a distance between a photosensitive body holding drum and a developing electrode is kept constant so as to obtain an output image with constant density. CONSTITUTION:Ring-shaped magnets 9 are installed on the outer peripheries of both side surfaces of the photosensitive body holding drum 4, and further the developing electrode 1 curved to be concave corresponding to the peripheral surface of the drum 4 is installed under the drum 4. Then, a magnet 10 is attached to a position opposed to the magnet 9 installed in the drum 4 so that it may repulse to the magnet 9 in the developing electrode 1. The electrode 1 is pushed up by a compression coil spring 7, and held to be constant in a non-contact state with the drum 4 when the repulsive force between the magnets 9 and 10 is well-balanced with the pushing-up force of the compression coil sping.
Patent JP-H04109521-A (JP)
Title: Switch
Inventor: UENO SATORU
IPC: H01H23/00
Filed: 1990-08-28
Abstract: PURPOSE:To commonly use many component parts so as to reduce a cost by disposing a dressed handle in a reversing handle via a disposing means, and carrying out an oscillating operation of the dressed handle by the use of ribs. CONSTITUTION:A pair of locking pieces 69 are projected nearly in the center of a back surface of a dressed handle 68 disposed in a reversing handle 62. The locking pieces 69 are insertingly locked in locking holes 67 of the handle 62 so that the handle 68 is detachably disposed in the handle 62. A disposing means comprises the holes 67 and the locking pieces 69. Semicircular ribs 70 are formed in the upper and lower portions of the back surface of the handle 68. The ribs 70 are brought into contact with the front surface of a fixing frame 2, and accordingly, the handle 68 is oscillatably operated. Therefore, a switch of an arbitrary type, e.g. a piano type and an oscillation type can be constituted by commonly using many component parts.
Patent JP-S60119617-A (JP)
Title: Method of biasing mr head
Inventor: YAMAUCHI TOMOHITO
IPC: G11B5/02
Filed: 1983-11-30
Abstract: PURPOSE:To reduce power consumption by driving a switching device that lets current flow to a conductor by a part of reproducing output of an MR head. CONSTITUTION:When the MR head 20 slides on a part of a magnetic tape on which recording is not made, the bias magnetic field is ''O'', and resistance R ofa MR thin film pattern 4 is constant. Accordingly, constant low output level is taken out from a terminal 27 through an output amplifer 22. When, application of a magnetic field H is started from the magnetic tape and a waveform curve 29 acts on the MR thin film pattern 4, output that follows the output waveform curve 30 appears in the terminal 27, and at the same time, inputted to the gate terminal of an FET 24 through a voltage feedback circuit 26 as a specified output level. That is, gate source voltage above threshold level is applied to conduct the FET 24. Desired bias magnetic field Ho is generated by appling fixed drain current to a conductor film 9.
Patent JP-H04106459-A (JP)
Title: Inspecting apparatus of printed state of solder paste
Inventor: NAITO TAKESHI
IPC: H05K3/34
Filed: 1990-08-28
Abstract: PURPOSE:To enable inspection of a printer state of solder paste with high precision and in a short time by a method wherein a laser beam passed through a reference mask is applied onto a printed circuit board and the quantity of light reflected therefrom is detected. CONSTITUTION:A laser beam scanning device 2 applies a laser beam for main scanning onto a printed circuit board 10 through a reference mask 3. Besides, the printed circuit board 10 and the reference mask 3 are moved synchronously by a board-mask moving device 1 and subjected to sub-scanning. As the result, the laser beam scans the whole surfaces of the printed circuit board 10 and the reference mask 3 sequentially. On the occasion, the light intensity of the beam applied onto the printed circuit board becomes high when the beam passes through the part of high transmittance of the reference mask 3, and it lowers when the beam passes through the part of low transmittance thereof. The laser beam is reflected on the board 10 and sensed by a light-sensing device 5. Subsequently, a change in the intensity of the light sensed by the light-sensing device 5 is detected in a determining means and thereby the quality of a printed state of solder paste 10a of the board, which is an object of inspection, can be determined.
Patent JP-S59120595-A (JP)
Title: Speed control apparatus for outboard motor
Inventor: IWAI TOMIO
IPC: F02D31/00
Filed: 1982-12-28
Abstract: PURPOSE:To control automatically the rotational speed of an engine by control a throttle valve in the closing direction for controlling the rotational speed of the engine to the highest allowable one when said rotational speed exceeds the highest allowable one according to the throttle operation. CONSTITUTION:The rotational speed of a flywheel magnet 42 of an engine body 10 is detected by an engine-rotational-speed sensor 43 so that the detection signal is sent to a frequency-voltage converter 45 which converts the detection signal to the detection value Vx of voltage. And the detection value Vx is compared with the set value Vs of the highest allowable rotational speed of a setter 46 in a comparator 47. When the detection value Vx exceeds the set value Vs as a result of the comparison, a drive motor 38 is driven by the output signal of the comparator 47 so that a throttle valve of the engine is controlled in the closing direction until the rotational speed of the engine reaches the set value Vs.
Patent JP-H0391958-A (JP)
Title: Photodiode monolithically formed with bipolar cmos device
Inventor: MIHARA TAKASHI
IPC: H01L27/14
Filed: 1989-09-04
Abstract: PURPOSE:To easily obtain a photodiode possessed of required spectral characteristics to blue light through near infrared by a method wherein the photodiode is composed of an anode layer formed of a P-type diffusion layer, an N-type epitaxial layer, and an N-type buried layer. CONSTITUTION:A photodiode is built integrally in a bipolar CMOS device whose analog characteristics are important. The photodiode has an anode of a 0.2-0.4mum deep P-type diffused layer formed together with a source/drain layer 22 of a PMOS transistor, a 1-3mum thick N-type epitaxial layer 10 which forms the collector region of a bipolar NPN transistor, and a cathode layer of a 5mum or deeper diffused N<+>-type buried layer 3. By this setup, a photodiode, which is sensitive to blue light 400nm or below in wavelength through red light 700nm or above in wavelength and has a quantum efficiency of 0.3 or above, can be obtained as monolithically built in a bipolar CMOS device.
Patent JP-2000044764-A (JP)
Title: Flame retardant thermoplastic resin composition
Inventor: TABUSE KOICHI
IPC: C08K5/41
Filed: 1998-07-27
Abstract: PROBLEM TO BE SOLVED: To obtain a flame retardant thermoplastic resin composition excellent in not only molding processibility and mechanical characteristics but also appearance of a molded product therefrom. SOLUTION: This resin composition comprises 100 pts.wt. of a composition comprising 95-10 wt.% of a rubber-reinforced styrenic resin (A) and 5-90 wt.% of a polyamide resin (B), 10-40 pts.wt. of ammonium polyphosphate (C), 0.5-10 pts.wt. of melamine sulfate and/or ammonium sulfate (D) and 0.01-3.0 pts.wt. of a polytetrafluoroethylene (E).
Patent JP-H0781769-A (JP)
Title: Method and device for managing receipt of raw material
Inventor: YANO YOZO
IPC: B65G65/30
Filed: 1993-09-14
Abstract: PURPOSE:To prevent mixture of a different material and erroneous input of cargo information, in an auxiliary material receipt managing system to receive various kinds of auxiliary materials in a large quantity at a steel mill and the like. CONSTITUTION:A raw material receipt managing device comprises a device 1 to produce a card 2 where cargo information is stored during shipment; and a device 5 to read and display information from the card 2 on the receipt side. By automatically and reliably transmitting information, mixture of a different material during receipt of a raw material and erroneous input of management information, such as weight, a component, and a brand, are prevented from occurring.
Patent JP-S6289822-A (JP)
Title: Roll contact type cooling apparatus for metal strip
Inventor: FUKUDA SHUZO
IPC: C21D9/573
Filed: 1985-10-15
Abstract: PURPOSE:To easily and safety control thermal stress caused in a strip according to sheet passing condition, by arranging plural pairs of cooling rolls of different cooling capacities in the line direction, and making movement of both rolls of each pair in the arranged direction possible. CONSTITUTION:Cooling rolls are arranged between deflector rolls at inlet and outlet sides of apparatus. Low and high cooling capacities rolls 18A, 18B are made to one set in cooling roll land plural sets of the roll pair R are arranged in the line direction. The rolls 18A and 18B are opposed at a space, the arranging direction of both rolls in the pair R is orthogonal to the line direction and the rolls are movable in the arranged direction. The strip X can be inserted to the space between both rolls and it is selectively brought into contact with either one cooling roll as shown in a figure and cooled. Thereby, strip can be cooled while preventing drawing by carrying out the exchanging according to strip passing condition.
Patent JP-H1168633-A (JP)
Title: Method and system for frequency diversity reception
Inventor: NOZAWA TAIZO
IPC: H04B7/08
Filed: 1997-08-25
Abstract: PROBLEM TO BE SOLVED: To attain an effective diversity with less error by not using analog informant that might be less reliable depending on a modulation system and a state of space as diversity discrimination information but by using digital information after demodulation with higher accuracy as the diversity discrimination information. SOLUTION: A modulation signal that is modulated with the same data with an error check code added to them and transmitted is received by receivers 1, 2, and given to demodulation circuits 11, 12 as reception waves A, B, where they are demodulated. The demodulated data are given to an error code check circuit 20, which detects the number of errors of the demodulation data. A diversity circuit 30 counts the number of detected errors by each byte, compares the numbers and selects a receiver which provides less number of errors.
Patent JP-H0274323-A (JP)
Title: Preparation of tubular film
Inventor: HIRONAGA KATSUOKI
IPC: B29C65/02
Filed: 1988-09-12
Abstract: PURPOSE:To prevent the slippage of films on the occasion when they are rounded in the shape of a tube and the opposite edge parts thereof are fusion-bonded by high frequency induction heating, by laminating two films firmly by bonding in the central parts thereof while laminating them by a bonding agent in the opposite edge parts so that they can be fusion-bonded therein to each other. CONSTITUTION:As for films, PVDC or any other arbitrary one may be used. As for a bonding agent, any bonding agent for dry laminate put on the market may be used, and it is applied little at the opposite edges and much in the central part. For instance, it is applied in the shape of dots whose application area is small at the opposite edges A and large in the central part B. The amount of application thereof at the opposite edges A is 0.5g/m<2> or below, or preferably 0.3g/m<2> or below, and the amount of application thereof in the central part B is desirably 0.55g/m<2> or above. The films can be stuck on each other by an ordinary method. A laminate film thus obtained is rounded in the shape of a tube, and the opposite edges A are superposed on each other and fusion-bonded by a high-frequency electric field between electrodes. On the occasion, four films at the opposite edges of the films 11 and 12 are integrated by fusion-bonding and therefore no slippage takes placed.
Patent JP-H1069872-A (JP)
Title: Electron microscope
Inventor: MYOCHIN KENICHI
IPC: H01J37/22
Filed: 1996-08-29
Abstract: PROBLEM TO BE SOLVED: To increase the accuracy and ease of focus adjustment by enlarging an image for observation, using an optical lens attached to a TV camera, and displaying it on a monitor. SOLUTION: The distance traveled by a camera is stored in a travel control part 14 in advance so that magnification at which focus adjustment becomes easy is attained. A variation in the focusing of an optical lens 9 due to the travel is also stored in a focus control part 13. By pressing, e.g. a start button, the camera is made to travel by an actuator 17 by the certain distance D stored in the travel control part 14, and focusing of the optical lens 9 is varied by the focus control part 13. An enlarged image for observation is thereby displayed on a monitor. Focus adjustment is carried out according to the image.
Patent JP-H0972896-A (JP)
Title: Creep life evaluating method for heat resistant material welded part
Inventor: KOYAMA TERUO
IPC: G01B11/28
Filed: 1995-09-05
Abstract: PROBLEM TO BE SOLVED: To enhance the accuracy of evaluating the duration of the creep life by plotting the relation of a distance from the boundary (bond) between the quantitative value of cavities and welding metal, drawing a regression line, obtaining the maximum value of the quantitative value in a welded head affected part, and estimating the damage ratio from the relationship between the previously obtained quantitative value and the creep damage ratio. SOLUTION: The distance from a bond and a cavity area ratio are plotted to obtain a regression curve, and the maximum value in a welded heat affected part is estimated. A testpiece that the affected part is previously reproduced is formed, a creep test is conducted, the relationship between the cavity area ratio and the creep damage ratio is obtained, the maximum value of the cavity area ratio is applied, and the creep damage ratio of a welding joint is estimated. When the damage ratio is a specific value or less, the area ratio is 0%. In this case, this is caused by the setting of the damage ratio as the value of the safety side. Thus, the welding joint life for string the most creep damage can be accurately estimated by the cavity, and hence the damage can be prevented.
Patent JP-H0761868-A (JP)
Title: Joined body
Inventor: MORI SEIJI
IPC: C04B37/02
Filed: 1993-08-20
Abstract: PURPOSE:To uniformize the joining strength of a joined body joined in the same plane, e.g. a joined body of ceramics and a metal by reducing dispersion of strength of each joined body used in a state where shear stress acts from a specific direction while highly keeping joining strength of the joined body. CONSTITUTION:For example, in a rocker arm 10 as a joined body of ceramics and a metal, a ceramic sliding part 12 is joined to an arm body 11 made of a metal on same plane by brazing. A joined face 12a of the ceramic sliding part 12 is ground on plane surface in perpendicular direction to shear stress vector produced based on sliding to a valve driving cam 13 or in a direction of an angle within + or -30 deg. to right angle to the shear stress vector and in a range of surface roughness (Ra) of 0.05-0.1mum.
Patent JP-S6286853-A (JP)
Title: Manufacture of semiconductor device
Inventor: INOUE FUMIHIKO
IPC: H01L27/108
Filed: 1985-10-14
Abstract: PURPOSE:To hold large capacity of a capacitor and to alleviate the step of a contacting hole by allowing a contact forming region to remain due to the selective growth of a high melting point metal layer as it is. CONSTITUTION:A semiconductor substrate 1 is formed of a p-type Si substrate, an oxide film 2 is formed of an SiO2 layer, a gate 3 is formed of a polysilicon layer, and the first insulating layer 4 is formed of an SiO2 layer. Then, high melting point metal layers 5 are selectively grown in holes for forming a capacitor and a contact. Then, an SiO2 layer 6 is grown on the entire substrate, and coated with a spin ON glass layer 7 thereon. Then, a polysilicon layer 8 to become a lower electrode of the capacitor, an SiO2 layer or an Si3N4 layer 9 to become a dielectric layer of the capacitor, and a polysilicon layer 10 to become the opposed electrode of the capacitor are grown to form a capacitor of a stack structure. Thereafter, a PSG layer 11 is grown as the second insulating layer to insulate between the layers, the entire substrate is coated with an aluminum layer, patterned to form an aluminum layer 12 as a wiring layer.
Patent JP-H05347383-A (JP)
Title: Manufacture of integrated circuit
Inventor: RIIOU AA PIOTOROUSUKI
IPC: H01L29/732
Filed: 1991-05-27
Abstract: PURPOSE: To manufacture the bipolar transistor of high voltage and high performance by ensuring the continuous formation of a gate oxide, a gate structure, the contact part of a second level and a mutual connection part and deciding the density of impurities, a temperature and cycle time, so that a specified impurity density region and specified connection depth are generated. CONSTITUTION: P-conductive type impurity 1×10<15> carriers/cm<3> are guided into N-conductive type substrate regions 12, 14 and 16. N-conductive type impurity 3×10<18> carriers/cm<3> are guided to a PNP collector region 28, an NPN base region 30, an N-MOS main body 32 and selected parts 10 and 18 forming a contact region in the N-conductive type substrate regions. P-conductive type impurity 5×10<18> carriers/cm<3> are guided to the N-conductive type substrate regions 10 and 18. P-conductive type impurity 2×10<20> carriers/cm<3> are guided to a PNP-base region 36 and the selected part for forming the contact region in a P-conductive type region. Then, N-conductive type impurity 1×10<21> carriers/cm<3> are guided to an NPN-base region 48 and the contact region, forming part of the N-conductive type region.