baber/WOPTO huggingface dataset:
Patent JP-S6467761-A (JP)
Title: Auto-level sound recorder
Inventor: ISHIGAKI TADASHI
IPC: G11B20/04
Filed: 1987-09-08
Abstract: PURPOSE:To eliminate a need for control data determined by the maximum peak level of a detected signal by detecting sound recording signals generated by attenuating consecutive signals in the maximum peak level by means of a voltage controlled attenuator, and determining attenuation amount by deciding if the level of said recording signal is higher or lower than or equal to a prescribed level. CONSTITUTION:Instead of detecting the maximum peak level of a program source signal reproduced by a program source reproducing device 15, an address approximate to the maximum peak level signal of a program source signal is detected by a peak level address detection part 17. And an instruction is supplied to the reproducing device 15 so that it repeatedly reproduces the approximate address and outputs the maximum peak level signal to the voltage controlled attenuator 14. The sound recording level on the output side of the attenuator 14 is detected, and is decided if it is higher or lower than, or equal to the prescribed sound recording level is decided. Thus the attenuation amount by the voltage controlled attenuator 14 is controlled. As a result, the control data determined by the maximum peak level is made unnecessary.
Patent JP-H0665781-A (JP)
Title: Al alloy coated metallic material
Inventor: UCHIDA JUNICHI
IPC: C23C30/00
Filed: 1992-08-24
Abstract: PURPOSE:To maintain glossiness and to improve design characteristics of an Al alloy coated metallic material and to harden the same. CONSTITUTION:The Al-Mn-X alloy coated layer described hereunder contg. 30 to 50wt.% Mn is provided on the surface of the metallic material. The Al- Mn-X alloy contains 0. 005 to 10 atomic % X when X is Cu, Ag, Fe, Co or Ni; and/or 0.002 to 3 atomic % X when X is Mg, Ca, Sr, Ba, Zn, Cd, In, Tl, Si, Ge, Sn, Pb, As, Sb or Bi; and/or 0.005 to 5 atomic % X when X is Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W or Re.
Patent JP-2000054820-A (JP)
Title: Wet sump lubricating four-cycle engine unit
Inventor: FUJITA YASUSHI
IPC: F01M11/00
Filed: 1998-08-07
Abstract: PROBLEM TO BE SOLVED: To stably supply lubricating oil to each part even when an oil pan is vertically inclined. SOLUTION: In a wet sump lubricating four cycle engine unit, a crank shaft 16 is substantially horizontally supported by means of bearings 21A, 21B formed on a crank 'case 11. Lubricating oil is supplied to each parts of an engine main body 10 from an oil pan 22 formed on a lower portion of the crank case 11 by means of a supply pump 61. After lubrication, the lubricating oil is collected in the oil pan 22. In such a case, the oil pan 22 is integrated with the crank case 11. A suctioning passage 23 is extended along an axis of the crank shaft 1t on the axially center side of the crank shaft 16 for suctioning the lubricating oil from the oil pan 22 to the supply pump 61, and integrated with a bottom of the oil pan 22.
Patent JP-H04258281-A (JP)
Title: Smoker's article
Inventor: SERRANO MARK A
IPC: A24D1/22
Filed: 1991-08-09
Abstract: PURPOSE: To provide a smoking article composed of specified constitution and having the appearance and feeling of a cigarette for efficiently heating a flavor imparting aerosol radioactive material by heat gas and radiation generated by the air passing through a carbonaceous heat source. CONSTITUTION: On an end on an opposite side for communicating fluid with the mouthpiece end of this smoking article, an active element 11 composed of a non-combustible cylindrical hollow sleeve 22, a heat source 20 provided with a fluid passage 206, a flavor floor 21 and a spacer means 101 for supporting the flavor floor 21 is provided. At the time, the heat source 20 is provided on the end on the opposite side of the mouthpiece end inside the sleeve 22 and the flavor floor 21 is supported by the spacer means 101 with an interval from the heat source 20 in the inside on a mouthpiece end side. Further, the part adjacent to the heat source 20 of the sleeve 22 is made air permeable so as to support the combustion of the heat source and at least a part is made of metal.  Also, the part adjacent to the flavor floor 21 of the sleeve 22 is made air non-permeable so as to prevent the combustion of a material in the flavor floor 21.
Patent JP-2001050600-A (JP)
Title: Refrigerating apparatus
Inventor: NISHIZAWA KAZUO
IPC: F25B1/00
Filed: 1999-08-09
Abstract: PROBLEM TO BE SOLVED: To prevent the deterioration of an energy-saving effect due to sticking of a hard scale contained in tap water to a condenser, in a refrigerating apparatus having an evaporation type condenser. SOLUTION: Drain water condensing on the surface of an evaporator 50 is collected in a drain pan 74. When an outdoor air temperature becomes high, for instance, power consumption of an apparatus may exceed an allowable range in an ordinary operation. A high-pressure pressure switch 70 detects this case from the fact that a high-pressure-side pressure of a compressor 52 exceeds a set value, and the drain water collected in the drain pan 74 is sent out to the condenser 54 side by a drain pump 82. This drain water is sprayed over the condenser 54 from a spray unit 88 through the intermediary of a solenoid valve 90 which is put in an open state, interlocking with the high-pressure pressure switch 70.
Patent JP-H0390283-A (JP)
Title: Method for detecting rear groove information of one-side automatic welding
Inventor: KAMEI HIROMASA
IPC: B23K9/127
Filed: 1989-08-31
Abstract: PURPOSE:To perform welding without necessitating welding repair by detecting the groove gap quantity, the groove dislocation quantity and the groove central position by the change of the voltage obtained by traversing a laser displacement sensor on the groove face. CONSTITUTION:The groove gap quantity G and the groove dislocation quantity H exist in a groove 2 of a butt joint of an iron pipe 1 to by subjected to one- side welding. A welding carriage 4 supporting a welding torch 3 in opposition to the groove 2 travels along a weld line one the pipe interior. A rear side carriage 6 provided with backing material 5 travels in synchronization with the welding carriage 4 on the pipe exterior side. The laser displacement sensor 8 is fitted and traversed on an X axis traverse shaft 9 to cross the groove rear 2a at the position opposite to the rear 2a of the groove 2 on the rear side carriage 6. The sensor 8 outputs the voltage in proportion to the distance L with the groove rear 2. This is converted into the groove gap quantity, the groove dislocation quantity and the groove central position and control is carried out by a rear side controller 12 and a welding controller 13 so that optimum welding is performed.
Patent JP-H0386658-A (JP)
Title: Inspection result informing device for automobile
Inventor: OGUMA NOBORU
IPC: G08B3/10
Filed: 1989-08-31
Abstract: PURPOSE:To inform the inspection result to a customer for refueling surely, correctly, and intelligibly on the site, by providing an insection result talking means for informing the inspection result vocally. CONSTITUTION:The signal corresponding to the result of inspection inputted by an inspection result inputting means 11 is transmitted to a talking means 12. Then, the inspection result is informed vocally by the talking means 12. When an inspection completion button 13 is pushed and the inspection result is announced, and the customer is absent in the vicinity, the inspection result is announced again when the returning customer pushes a re-start button 18 before a reset button 19 is pushed. When the announcement is unnecessary because of the customer absence, talking is prevented if a talking prevention button 17 is pushed before the inspection completion button 13 is pushed. In a POS 16, the inspection data is memorized together with the card data of the customer for refueling, and the inspection result data can be compared and inspected, by the printing-out of the inspection data together with the data in the past.
Patent JP-2000055935-A (JP)
Title: Contact probe
Inventor: ISHII TOSHINORI
IPC: H01L21/66
Filed: 1998-08-07
Abstract: PROBLEM TO BE SOLVED: To enable a contact probe to be applied to a semiconductor chip, etc., in which electrodes are unequally arranged at the four sides and to be adopted to upsizing. SOLUTION: In a contact probe 10, a plurality of pattern wires 12 are formed on a film, and the end parts of the pattern wires are each arranged in a state protruded from the film to be contact pins 16. The contact probe 10 is constituted of both a contact probe main body 13 in which the main pattern wires 12 are formed and a branch wiring board 15 partially connected to the contact probe main body 13. Branch pattern wires 14 connected to the main pattern wires 12 are formed in the branch wiring board 15, and pin parts 14a for connection each protruded in a pin shape are formed at the tip of the branch pattern wires 14. Through holes 13a for connection into which the pin parts 14a for connection are inserted are formed in the contact probe main body 13, and the through holes 13a for connection are partially a pattern wire wall part constituted of parts of the main pattern wires 12.
Patent JP-S6323335-A (JP)
Inventor: GRAHAM SCOTT O
IPC: H01L21/762
Filed: 1986-09-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S60115403-A (JP)
Inventor: OKAMOTO KIYOSHI
IPC: B27K5/02
Filed: 1983-11-28
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S60115323-A (JP)
Title: Manufacture of branch pipe
Inventor: KOJIMA MASAYASU
IPC: B21C37/29
Filed: 1983-11-28
Abstract: PURPOSE:To manufacture a start crotch T-joint from a pipe material by executing a rising work for forming a branch pipe by inserting a mandrel provided with a plug into a base pipe, and pushing its plug into the inside surface of the pipe by applying an external pressure to the base pipe. CONSTITUTION:A tool which has attached a plug 20 to a mandrel 21 in its vertical direction is inserted into a flat pipe body 19', and the plug 20 is positioned on the inside surface side of the pipe of a branching prearranged part of the pipe body 19'. In this state, the pipe body 19' is pressed in the long diameter direction so that a circular section is formed by a pair of upper and lower dies 12, 12' having the same inside shape as the outside shape of the base pipe and the branch pipe, also the plug 20 is pushed into a thickness direction from the inside surface of the pipe through the mandrel 21, a shearing deformation is generated between a plug shoulder 20' and a die hole inlet shoulder 10' of the branching prearranged part, the branching prearranged part is made to rise on the outside surface side of the pipe, and a rising part 3' which becomes a branch pipe is formed.
Patent JP-S61102093-A (JP)
Inventor: AKETO AKIHIRO
IPC: H05K3/20
Filed: 1984-10-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0389611-A (JP)
Title: Amplifier
Inventor: UMEDA KAORU
IPC: H03G1/00
Filed: 1989-08-31
Abstract: PURPOSE:To enable a user to immediately judge the adjusting state by displaying an arbitrary character, pattern, or the like set in advance at the time of setting the stored adjusting state. CONSTITUTION:Character data of a maximum of 8 characters or the like can be stored in a memory 3 with respect to each pair of control data. That is, character data selected by the operation of an operation key 2 is stored in the memory 3 with respect to each of 10 pairs of control data by the control of a CPU 1. Stored character data is read out simultaneously and is supplied to a display control part 7 when control data of a pertinent command number is read out and is supplied to an equalizer control circuit 4, a surround control circuit 5, and a dynamics control circuits 6. The display control part 7 controls the display on a display panel 8 consisting of a fluorescent display tube or the like arranged on the front panel of an amplifying device.
Patent JP-S60117761-A (JP)
Title: Lead frame for semiconductor device
Inventor: UEDA YUUJI
IPC: H01L23/495
Filed: 1983-11-30
Abstract: PURPOSE:To obtain a frame, which does not use an expensive gold plated layer or a silver plated layer, and has sufficient soldering and bonding properties, by forming an electroless plated layer of a nickel and boron alloy on the surface. CONSTITUTION:An electroless plated layer of a nickel boron alloy is formed on the surface of a frame. The electroless plated layer of the nickel and boron layer can be formed on the entire surface of the lead frame, or the layer can be selectively formed only on a part, where excellent bonding property is required. For example, a ribbon shaped plate material comprising alloy 194 (Fe/Cu alloy) is blanked, and the shape as shown in the Figure is formed. Then, the electroless plating of the nickel and boron alloy is selectively applied to the hatched part, and the lead frame for a semiconductor device is obtained.
Patent JP-H0389700-A (JP)
Title: Sound image location method
Inventor: IIDA KAZUHIRO
IPC: H04S1/00
Filed: 1989-08-31
Abstract: PURPOSE:To make the direction of location of a sound image coincident with the direction of a sound source without causing the separation of the sound image by deciding the amplification factor of an amplifier and an addition distributer from a delay time based on a sound image separation chart obtained from an acoustic psychological experiment. CONSTITUTION:A preceding sound radiates from a speaker 12 arranged in front of a listener 11 and a delayed sound radiates from a speaker 13. A delay time required for a delay sound is decided depending on the positional relation between a speaker group installed on a playing area and a sound receiving point group in a viewing area. Succeedingly, the attenuation required for the delay sound is decided from a permissible ratio of the sound image separation. Then an adjustment controller is provided with a map based on the sound image separation chart in this way, and the amplification factor of the amplifier and the addition distributer is decided based on the delay time of the delay device decided by the rule of a 1st have front. Thus, the direction of the sound source at the position and the direction of the sound image radiating from the speaker group are made coincident with each other without sound image separation.
Patent JP-S6381924-A (JP)
Title: Heat treatment device
Inventor: AMADA HARUO
IPC: H01L21/324
Filed: 1986-09-26
Abstract: PURPOSE:To perform heat treatment under a large degree of purification and to improve yield, by maintaining an optimum distance, where invasion of an air current does not occur in a processing space, on a main surface of a table and juxtaposing such an air current controller of flat plate structure that a gas is made to uniformly blow out. CONSTITUTION:An air current controller 7 is juxtaposed on the upper side of a main flat surface of a table 2 where a wafer 1 is mounted. A gap (g) between the table 2 and the air current controller 7 is made e.g., 5 mm so that a turbulent flow and an eddy current do not occur due to heat. If the whole region of the table 2 is kept at a uniform temperature at that time, uniform heat treatment is performed over the whole region of the wafer 1. When a purified purge gas is made to flow in so small an amount that the eddy current does not occur inside the processing space 4, the purge gas can be made to pass as it is without the occurrence of the eddy current above the wafer. Therefore, the processing space 4 is not invaded by the gas from the outside, and foreign matters together with the gas are not brought into the processing space 4, and so the foreign matters do not adhere to the wafer 1.
Patent JP-S6381934-A (JP)
Title: Wafer and manufacture thereof
Inventor: SHIMURA TAKASHI
IPC: H01L21/304
Filed: 1986-09-26
Abstract: PURPOSE:To manufacture a wafer having a high gettering effect with high quality by grinding the wafer sliced from an ingot, forming grinding strain to the rear and a chamfering section and performing light etching of the wafer. CONSTITUTION:A wafer 3 is sliced from an ingot consisting of an Si single crystal, and ground, and a chamfering section 3a is formed to the outer periphery of the wafer. It is preferable that the depth of working strain through grinding extends over a value such as approximately 2-5mum at that time. Grinding is executed to both the surface and rear of the wafer 3 as shown in 3b in the figure (b). Grinding to the rear of the wafer 3 is conducted in the same manner as mentioned above. The wafer 3 is light-etched extending over the whole surface as shown in a broken line 3c in the figure (c). Light etching must be performed within a range in which grinding strain shaped does not disappear as the conditions of light etching at that time, and light etching in approximately 1mum per one surface is preferable. The circuit forming surface side of the wafer 3 is worked by means of a mirror working device not shown as shown in a broken line 3d in the figure (d).
Patent JP-H0870519-A (JP)
Title: Connecting method for plastic power cable
Inventor: INOUE YOSHIYUKI
IPC: H02G1/14
Filed: 1994-08-26
Abstract: PURPOSE: To provide connections for plastic power cables having good bonding between insulation blocks and cable insulators and having no peeling-off at the interface or no corona discharge at that portion. CONSTITUTION: A cylindrical insulation block is attached to a conductor connecting portion and an end of a cable insulator to be connected, and the insulation block is heated, pressed and melted with the cable insulator as one united body in a connecting method for plastic power cable; in this case, a mean residual shrinkage length of the inner diameter of the insulation block formed and processed in advance should be more than 1.5 times the difference of outer diameter after removing an external semi-conductive layer of the cable insulator to be connected to the inner diameter of the insulation block before shrinkage and the insulation block should have a ratio of more than 4% to the inner diameter of the insulation block before shrinkage.
Patent JP-H04107056-A (JP)
Title: Picture recorder
Inventor: SAITO HITOSHI
IPC: G06F3/12
Filed: 1990-08-27
Abstract: PURPOSE:To decode and record pictures at a high speed by transferring the pictures stored in a picture memory on a CPU bus to a decoding circuit, storing the decoded picture data in a page buffer in the form of raw data, and transferring them to a printer. CONSTITUTION:A decoding circuit 8 operates the encoding of each one line per one time of encoding commands issued by a CPU 1. After that, a DMA controller 6 transfers the data from a picture memory 5 to a decoding circuit 8 by each one bite according to a data request outputted by the decoding circuit 8. The circuit 8 transmits a data transferring request to the controller 6 when receiving the decoding command, and decodes the transferred data. The raw data outputted by the circuit 8 is stored in a page buffer 7 by a printer controlling circuit 9. The circuit 9 completes the data transfer when completing the transfer till a set final address. When the setting of the circuit 9 is completed, the circuit 9 outputs a print requesting signal to a page printer 10, and waits a vertical synchronizing signal from the printer 10. The printer 10 starts a print operation.
Patent JP-2000059586-A (JP)
Title: Picture filing system, picture filing method, recording medium recording picture filing program and picture output device for picture filing system
Inventor: HONDA TSUTOMU
IPC: H04N1/21
Filed: 1998-08-10
Abstract: PROBLEM TO BE SOLVED: To attain improvement of convenience by switching possibility/ impossibility of change in an aspect ratio as the time of displaying a fetched photographed picture by the aspect ratio. SOLUTION: An aspect ratio decision means 123 decides an aspect ratio of a picture stored in a reception picture storage part 132. When the aspect ratio is larger than 1.5 and smaller than 2.0, aspect ratio data of photographing information is set to be hi-vision size and, when the ratio is outside the range, the photographing information is made to record that change of the aspect ratio is disabled. A file display control means 124 displays a photographed image together with an aspect ratio selection icon when the photographing image has aspect ratio data, and changes the aspect ratio when an icon is specified by an operation part 13. When there are no aspect ratio data in the photographing information or it is informed that the change is impossible, changing of the aspect ratio is prohibited by not displaying the aspect ratio selection icon.
Patent JP-2001047400-A (JP)
Title: Punching die, punching method, plate material for shaping process, and manufacture of plates
Inventor: KASHIMOTO TAKAHISA
IPC: B26F1/00
Filed: 1999-08-10
Abstract: PROBLEM TO BE SOLVED: To provide a punching die for cutting a synthetic resin material of hard nature, a punching method for synthetic resin material of hard nature, and a plate material for molding a rotational symmetrical piece, and offer a method of manufacturing plates. SOLUTION: A punching die is structured so that cutters 11 and 12 in the form of oblong circle are fitted by pressure to an upper 3 and a lower base board 4 made of wood and arranged opposing as protruding 1-10 mm from the boards. When a synthetic resin plate 20 of hard nature is to be punched off, the maximum amount of sideways dislocation of the opposing tips of cutters 11 and 12 is made 0.02-0.3 mm while the drive-in depth of the tips is made 0.05-0.4 mm. A plate material for molding a rotational symmetrical piece made of synthetic resin of hard nature has a thickness of 0.2-6 mm and a shape of oblong circle and is formed using the above-mentioned die.
Patent JP-H0388122-A (JP)
Title: Polishing tape for magnetic disk
Inventor: YOSHIDA EIKICHI
IPC: G11B5/84
Filed: 1989-08-30
Abstract: PURPOSE:To reduce the dispersion in surface roughness by providing a polyshing layer consisting of the fine particles of a polyshing material and a binder on one surface of a long-sized base material and providing a backing layer consisting of conductive particles and a binder on the rear surface of the polishing layer of the long-sized base material. CONSTITUTION:The polishing layer consisting of the fine particles of the polishing material and the binder is provided on one surface of the long-sized base material. The backing layer consisting of conductive film particles and the binder is provided on the rear surface of the polishing layer of the long-sized base material. The conductive fine particles are preferably a carbon black having 30 to 140cc/100g oil absorption. The conductive fine particles are preferably conductive titanium having <=50OMEGAcm powder resistance when made into the compressed powder of 100kg/cm<2>. The magnetic disk subjected to the surface polishing by using this polishing tape is reduced in the dispersion of the surface roughness. The good reproduced output envelope when signal are actually written is obtd.
Patent JP-H1068274-A (JP)
Title: Frame member coupling device
Inventor: KURASAKI TOSHIMITSU
IPC: E06B3/964
Filed: 1996-08-28
Abstract: PROBLEM TO BE SOLVED: To couple frame members for supporting a wall panel, with one another with a good external appearance. SOLUTION: A groove 9 in which an end part of a wall panel 1 is defined by a fixing piece 6, a projection support piece 7 and a front face panel 8, and an insertion recess 10 is formed in the inner surface part of the front face panel 7 so as to constitute a frame member 3. Meanwhile, a fitting piece 12 is projected from a joint member 11 so as to form a corner member 5, and the fitting piece 12 of the corner member 5 is fitted in the recess 10 of the front face panel 8 so as to couple the frame members 3 in a rectangular shape.