baber/WOPTO huggingface dataset:
Patent JP-H09226591-A (JP)
Title: Unmanned carrier equipped with overhang bearing balancer
Inventor: MITA HIDEKI
IPC: B62B3/00
Filed: 1996-02-23
Abstract: PROBLEM TO BE SOLVED: To prevent the appearance of an effect on a work cycle time, and provide a simple mechanical system for lifting up a cargo at a position off the center of the truck of an unmanned carrier with a shuttle device, and receiving or delivering the cargo. SOLUTION: Regarding an unmanned carrier having driving wheels 2a and 2b provided at the center part of a truck 1 along a travel direction and arrayed along a lengthwise direction, and further having spring-fitted caster wheels 8 at both sides of the truck 1, overhang bearing balancers A for supporting the eccentric load of the truck 1 are installed in the vicinity of the sides of a truck lower part. Also, a graded plate 13 for the overhang bearing balancers A to run on is provided on the road at a position for the truck 1 to receive or delivery a cargo, so as to correspond to the overhand bearing balancers A.  In this case, the overhang bearing balancers A are formed out of a bracket 14 fixed to the lower side of the truck 1, a lever 15 connected to the lower part of the bracket 14 in such a state as capable of oscillating, and a pair of wheels 16 rotatably fitted to both ends of the lever 15. Also, the lower surface of the wheels 16 is normally positioned on travel surface at a gap equal to the height of the graded plate 13.
Patent JP-S63203765-A (JP)
Title: Lightweight member having high function
Inventor: NISHIHARA SEIICHIRO
IPC: B32B15/08
Filed: 1987-02-19
Abstract: PURPOSE:To improve the resistance of a lightweight member to wear, corrosion, liq. permeation and UV by forming an amorphous coating film on the surface of an FRP substrate by sputtering. CONSTITUTION:A substrate is made of plastics reinforced with fibers of carbon, 'Kevlar(R)', glass or the like and a coating film of an amorphous metal is formed on the substrate by sputtering. The compsn. of the amorphous metal used is not especially restricted. Since the coating film is formed by sputtering, the film having superior characteristics can be formed with high adhesion. The thickness of the coating film is decided within the range of about 5-60mum according to the purpose for which the film is used.
Patent JP-H03239228-A (JP)
Title: Active matrix type display panel and production thereof
Inventor: WATABE JUNICHI
IPC: G02F1/1343
Filed: 1990-02-16
Abstract: PURPOSE:To prevent the receiving of damages in a post stage by specifying the compsn. ratio of the aluminum in an aluminum-silicon alloy layer. CONSTITUTION:The compsn. ratio of the Al in the Al-Si alloy film 24 of the active matrix type display panel installed the constitution superposing a metallic film 7 to form another wiring conductor via an insulating film 6 on the Al-Si alloy film 24 to form a wiring conductor is specified to 8 to 12wt.%. The deterioration in the properties of the Al-Si alloy film 24 is prevented in this way even if the Al-Si alloy film 24 is exposed to plasma at the time of forming the gate insulating film, etc., by a plasma chemical vapor growth method (P-CVD) method in the post stage. The generation of a shorting between the upper and lower metallic films is substantially prevented.
Patent JP-S51113802-A (JP)
Title: Process for preraration of cis-unsaturated aldehydes
Inventor: ICHIKAWA YATAROU
IPC: C07C47/52
Filed: 1975-03-28
Abstract: PURPOSE: Trans-unsaturated aldehydes are converted in high conversion and selectivity into their cis-isomers at particular reaction temperature and time in the presence of strong acid. 
     COPYRIGHT: (C)1976,JPO&Japio
Patent JP-H06252189-A (JP)
Title: Die device for resin-encapsulating ic device
Inventor: SHIRAISHI ATSUSHI
IPC: B29C45/40
Filed: 1993-02-25
Abstract: PURPOSE:To provide a die device which can be recovered after the mold release without causing warp, cracks, etc., on the surface of a package by providing a bore in the bottom of the generating face on the female mold side and arranging an ejector block which is movable vertically in the bore. CONSTITUTION:A resin-molding die device is provided with a male mold 4 and a female mold 3 provided with cavities 4a and 3a which can store a lead frame mounted with a chip, at least the female mold 3 of the male mold 4 and the female mold 3 is movable vertically, and molten resin is injected into the cavities 4a and 3a for molding. A bore 3b is provided in the bottom of the generating face on the side of the female mold 3 of the resin-molding die device and an ejector block 6 is arranged vertically movably in the bore 3b. Then, the ejector block 6 is connected with a shifter 5b, which absolutely stops regardless of the ascend/descend of the female mold 3, and the ejector block 6 allows the formation of a generating face that continuous from the surface of the cavity 3b at the time of joining the male mold 3 and the female mold 4.
Patent JP-S61196544-A (JP)
Title: Die-bonding for semiconductor chip
Inventor: INOUE TETSUKAZU
IPC: H01L21/58
Filed: 1985-02-25
Abstract: PURPOSE:To contrive the improvement of junction strength of a semiconductor chip and a member to be die-bonded in a less number of frequencies of scrubbing by a method wherein the operation to make the bonding member and the member to be die-bonded to relatively shift holding a solder material between the semiconductor chip and the bonding member and fine vibrations are used in combination. CONSTITUTION:A member 2 to be die-bonded is placed on the upper surface of a movable heater block 10 and is plane-supported and after a gold tape 4 is pasted on the prescribed position of a bonding surface 2a, a heating is performed at the prescribed temperature. A semiconductor chip 3 is vacuum-attracted in the recessed part 21 of a collect 20 and is supported by the collect 20 and the semiconductor chip 3 is carried to a position in the upper direction of the member 2 to be die-bonded by the collect 20. The semiconductor chip 3 is pressed to the gold tape 4 on the member 2 to be die-bonded, an arm 24 and the movable heater block 10 are made to relatively shift while fine vibrations are added by a second vibration source 40, a gold- silicon eutectic alloy is formed between the gold tape 4 and the silicon constituting the semiconductor chip 3 and the semiconductor chip 3 is fixed on the bonding surface 2a.
Patent JP-S61196295-A (JP)
Inventor: MOMOSHIMA YUKICHI
IPC: G10H1/043
Filed: 1985-02-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H01211887-A (JP)
Title: Plane heater made of carbon fiber/carbon composite
Inventor: HANAWA HITOSHI
IPC: H05B3/20
Filed: 1988-02-19
Abstract: PURPOSE:To reduce the dispersion on the heating surface and obtain a heater with large mechanical strength and good workability by making the alignment pattern of carbon fibers viewed from the vertical direction to the heating surface equal between portions at any portion of the heating surface. CONSTITUTION:A carbonizable material is impregnated in a circular fabric of carbon fibers stacked for artificial isotropy or an unwoven mat of one- direction aligned materials or carbon fibers, and it is baked to form a planar heater 1. When the fabric or the like of carbon fibers corresponding to the shape of the heater 1 is used, carbon fibers have the same alignment at any portion when viewed from the vertical direction to the heater 1, the heat quan tity is made equal. The dispersion of the heating surface is small, the heater with large mechanical strength and various shapes is obtained.
Patent JP-H06249786-A (JP)
Title: Inspection method for pellet edge
Inventor: YAGINUMA YOSHITAKA
IPC: G01N21/88
Filed: 1993-02-25
Abstract: PURPOSE:To inspect the edge of a pellet at high speed by a method wherein a histogram for the brightness of the image, of the edge in a pellet, which has been picked up is formed, a feature value is extracted and the feature value is compared with a statistical feature value in a histogram which has been extracted from many standard pellets in advance. CONSTITUTION:Rays of light from a fiber light source 220 are converged through a plano-concave lens 223d, and they are changed to parallel rays. The parallel rays are passed through a perforated lens 223e and a half mirror, and both edges of a pellet P are irradiated with the parallel rays. The rays which are passed through the central opening part and the peripheral edge part of the lens 223e are changed respectively to parallel rays and converged rays, and a recessed part PA at the edge of the pellet P is irradiated at uniform brightness. The image of the recessed part PA which has been picked up by a CCD camera 232 does not cause a shadow, and only a flaw appears as black. The image is taken into an image processor. A histogram for the brightness of inspection regions is formed. Its feature value is compared with a statistical feature value, for many normal products and defective products, which has been extracted in advance. Whether they are good or not and whether they are to be held are decided. Thereby, the image is processed easily, and the recessed part PA can be inspected quickly.
Patent JP-2000236176-A (JP)
Title: Motor attaching apparatus
Inventor: TSUNEKAWA MICHIHIKO
IPC: G11B33/12
Filed: 1999-02-16
Abstract: PROBLEM TO BE SOLVED: To provide a motor attaching apparatus without increasing the number of its part, items wherein the attached motor to it can be returned surely to the normal operation thereof when the locking state of the driven mechanism of the motor is released to restart the motor. SOLUTION: A motor attaching apparatus has a motor holder 2, a motor attached to the motor holder 2, a motor worm gear 4 attached to the shaft of the foregoing motor, a gear portion 6 engaged with the motor worm gear 4 for making its shaft orthogonal to the shaft of the motor, a relay gear 5 having on both its sides the gear portion 6 and a worm gear portion 7, and a gear engaged with the worm gear portion 7 of the relay gear 5. Furthermore, both the ends of the relay gear 5 are held by the wall portion of the motor holder 2. In this motor attaching apparatus, a protrusion 8 facing opposite the side surface of the intermediate portion of the relay gear 5 is provided integrally with the motor holder 2.
Patent JP-H05234951-A (JP)
Title: Plasma etching system
Inventor: KOSHIO ATSUSHI
IPC: H01L21/302
Filed: 1992-02-25
Abstract: PURPOSE:To make the plasma potential at the surface of an electrode for placing a semiconductor substrate uniform and improve the uniformity of the etched amount of the semiconductor substrate by forming the electrode to have the same shape as that the semiconductor substrate have. CONSTITUTION:A semiconductor substrate 3 is subjected to plasma etching on an electrode 1 by introducing a reactive gas into the space between the electrode 1 and another electrode 2 facing each other and generating plasma discharge between the electrodes 1 and 2. In such single wafer processing type plasma etching system, the electrode 1 for placing the substrate 3 is formed to have the same shape as that the substrate 3 has. For example, an insulator ring 4 for positioning the substrate 3 is provided on the cathode 1 and part of the circular shape of the cathode 1 is cut off similar to the substrate 3. Then the substrate 3 to be etched is subjected to plasma etching after the substrate 3 is placed on the cathode 1 and earthing the cathode 1 through an impedance matching box 11 constituted of a capacitor and high-frequency power source 10 of 13.56MHz in frequency.
Patent JP-H01214053-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: TANAKA KATSUYUKI
IPC: H01L23/40
Filed: 1988-02-22
Abstract: PURPOSE:To obtain a semiconductor device which can be used at a high temperature, whose thermal conduction at a bonded part is good, can be obtained by bonding a heat sink to a carrier and is composed of a chip, the heat sink and the carrier by a method wherein the heat sink and the carrier are bonded by a thermal pressure bonding method using gold as a bonding material. CONSTITUTION:In a semiconductor device where a chip is united with a carrier 2 via a heat sink 1, the heat sink 1 and the carrier 2 are bonded by a thermal pressure bonding operation using gold as a bonding material. For example, a three-layer coating composed of a titanium layer 3 (600Angstrom  thick), a platinum layer 4 (800Angstrom  thick) and a gold layer 6 (1mum thick) is formed on the surface of a diamond heat sink 10.55mm square by an evaporation method under conditions of a pressure of 5X10<-6> Torr, at a substrate temperature of 200 deg.C and at a speed of 10Angstrom /sec. A two-layer coating composed of a nickel layer 5 (3mum) and a gold layer 7 (3mum) is formed on the surface of oxygen-free copper of a carrier 2 by an electrolytic plating operation. After that, a thin gold piece 8 with a thickness of 50mum is inserted between the heat sink 1 and the carrier 2; both are heated to 270 deg.C; after that, they are pressurized by a force of 1000gf and a thermal pressure-bonding operation is executed.
Patent JP-H02218566-A (JP)
Title: Operation type manipulator
Inventor: TSUDA KIICHIRO
IPC: G05D3/12
Filed: 1989-02-17
Abstract: PURPOSE:To almost completely prevent the deterioration of the operability caused by the delay in the wasteful time and response of a command signal by providing a compensation part for compensating the delay motion of the manipulator at the side to be operated. CONSTITUTION:In the case that a time corresponding to a time constant of a delay in response is T while a wasteful time on a delay between a command signal fed from a manipulator 1 of an operation side and operation of a manipulator 9 of a side to be operated, is L, this command signal is input to a compensation part 17, whenever the value related to this speed is varied only while the time (L + T) from the start time of each variation thereof is made double the variation part of this value at each starting time, the variation part of this value is left as it is after the time (L + T) and these are output by adding with the time lapse. Consequently, the delayed operation of the manipulator 9 of the side to be operated can be compensated.
Patent JP-H04339886-A (JP)
Title: Sealing agent for preventing leakage of oil from transformer, etc., and method for preventing leakage of oil
Inventor: UEMATSU KAZUYOSHI
IPC: C08G59/50
Filed: 1991-03-05
Abstract: PURPOSE:To provide a sealing agent for preventing a leakage of oil from, e.g. a transformer, which can prevent a leakage of oil enclosed in the transformer with certainty at a joint of two members of a housing thereof, and a method for preventing a leakage of oil, by which repair of a transformer from which oil is leaking can be performed simply and quickly. CONSTITUTION:Foreign material is removed from the surfaces of the joints 1, 5, 6 of two members of a housing 1 of, e.g. a transformer T. Thereafter a first sealing agent obtained by mixing a liquid A composed mainly of an epoxy resin with a liquid B composed mainly of a liquid polymercaptan is applied to the joints, and a second sealing agent obtained by mixing a liquid C composed mainly of an epoxy resin with a liquid D composed mainly of a liquid modified polyamine is then applied thereon. By this method, a leakage of oil enclosed in the transformer can be prevented with certainty, and repair of the transformer from which oil is leaking can be performed simply and quickly.
Patent JP-H03239983-A (JP)
Title: Light reflection type sensor
Inventor: ICHIKAWA MASAMITSU
IPC: G01S17/02
Filed: 1990-02-19
Abstract: PURPOSE:To detect a detected substance with high accuracy by forming plural optical paths which intersect in a V-shape on a case, providing a light emitting element at one end of the optical path and a light receiving element at the other end thereof and providing a passage for the detected substance which intersects with the optical path. CONSTITUTION:The plural V-shaped optical paths 14 and 16 which direct to one point each other are cut through on the case 10 of a sensor 12, and the light emitting element 18 is provided at one end of the optical path 14 and the light receiving element 20 is provided at one end of the optical path 16. The circuit part of the sensor 12 is constituted so that a substance detection signal may be outputted by previously setting the output level or under of the element 20 at the time of shielding either of detecting points A and B by the detected substance 28 as a substance detection level. A light beam from the element 18 passes through the optical path 14 and reaches a light reflector 24. Then, it is reflected and passes through the optical path 16 to be received by the element 20. When the detected substance 28 passes the passage 26, it successively and simultaneously shields the light beams of the detecting points A and B. At such a time, the light quantity received by the element 20 is changed and the substance detection signal is outputted.
Patent JP-S63205732-A (JP)
Title: Information processor
Inventor: HABATA SHINICHI
IPC: G06F9/38
Filed: 1987-02-23
Abstract: PURPOSE:To prevent a pipeline processing effect from deteriorating due to execution of a branch instruction and to obtain the titled processor having a high performance, by executing a fixed length instruction being equal to data with of a memory, leading in a bypass of an instruction prefetch use register and an instruction read-out path, and realizing a pipeline processing control by one control unit. CONSTITUTION:A fixed length instruction being equal to data width of a memory 30 is set as an object to be executed, and a bypass is prepared for a prefetch instruction register 34 for prefetching an instruction and an instruction read-out path, by which one execution control unit realizes a pipeline processing mechanism 33 of a small hardware scale, for controlling read-out of the instruction, and decoding and execution of an operating code part. Also, by preparing a branch address register 43, a branch instruction calculates only a branch destination address, and an actual branch realizes a delay branch instruction being readable to a programmer which is executed after executing arbitrary pieces of instructions which follow the branch instruction. In such a way, disorder of the pipeline caused by the branch instruction is obviated, and a miniature and high performance information processor is obtained.
Patent JP-H03243173-A (JP)
Title: Inverter circuit output current detecting circuit
Inventor: FURUHATA SHOICHI
IPC: H02M7/48
Filed: 1990-02-19
Abstract: PURPOSE:To detect and control an AC output current by a method wherein current, conducted through each arms, is enabled to be detected by connecting a shunt resistor, for example, in series to each arms of an inverter circuit while the currents of each arms are compounded to obtain the value of the AC output current. CONSTITUTION:Shunt resistors 9 detects respective currents IU-IW of respective arms constituting a single-phase or 3-phase inverter circuit 1 converting a DC voltage into an AC voltage. A waveform compound circuit 8 compounds the detecting values of each arm currents employing signals 13U-13W driving switching elements constituting an inverter circuit 1 or transistors 2 and obtains the detecting values of AC output current iU-iW. According to this method, the AC output current of the inverter can be detected without employing any current transformer and it contributes to the miniaturization of an inverter device largely.
Patent JP-H11218764-A (JP)
Title: Manufacture of liquid crystal display device
Inventor: HASHIMOTO KENJI
IPC: G02F1/1337
Filed: 1998-02-04
Abstract: PROBLEM TO BE SOLVED: To improve the field angle and to prevent display unevenness by irradiating an alignment film material partially with infrared rays and uniformly drying the alignment film material and generating more than one pretilt angle in one pixel when the alignment film material applied to a substrate is dried. SOLUTION: The substrate 2 coated with the alignment film material 1 is mounted on a support base 3. The alignment film material 1 is dried by being irradiated with the infrared rays from an infrared-ray lamp 4 through holes 6 of a filter 5 made of white plate glass. In this case, the holes 6 are provided in quantities at reduced intervals and then the alignment film material 1 is uniformly dried to eliminate drying unevenness, thereby preventing display unevenness. Thus, the drying becomes uniform and the partially irradiated parts are dried faster than other parts, so the parts irradiated directly with the infrared rays and their peripheries are different in surface state. Consequently, areas having different pretilt angles can be formed in each of pixels arranged in matrix to improve the field angle.
Patent JP-H11216808-A (JP)
Title: Decorative board
Inventor: NAKAGAWA HITOSHI
IPC: B32B21/06
Filed: 1998-02-03
Abstract: PROBLEM TO BE SOLVED: To provide a decorative board which is not warped due to absorption or desorption of moisture in outdoor air when being stored or used for a long period of time and which can be easily processed by a method of high productivity such as a high-frequency heating when it is bonded to a core material or a frame material. SOLUTION: In the decorative board 1 wherein a decorative sheet 3 is superposed on one side of a wood base material 2 and a moistureproof sheet 4 comprising two paper layers 42, 43 bonded to each other through an extruded coating layer of thermoplastic resin 41 is bonded to the other side of the wood base material, an anchor coat layer 44 is provided on at least one of the sides of the extruded coating layer for contact with the paper layers 42, 43 of the sheet 4.
Patent JP-H03239966-A (JP)
Title: Peak hold circuit
Inventor: FUKUDA SHINICHI
IPC: H03D1/00
Filed: 1990-02-19
Abstract: PURPOSE:To attain compatibility of a ripple reduction and a followup ability to a level change by temporarily releasing a peak holding operation so that the hold time for peak value does not exceed a specified time when a signal level falls down. CONSTITUTION:When the peak value hold time of an input signal S1 of peak holding part 3 in a hold time detecting part 5 exceeds the specified time, a signal Pr for temporarily releasing the holding operation of peak holding part 3 is sent out. A discharge time constant of a hold capacitor is set larger, and a ripple width of the output voltage V0 is smaller and peak points of waveform are smoothly stood in a row. But, when the hold time for peak value is prolonged and exceeds the specified time, the level of peak value falls down and the release signal Pr is generated from the hold time detecting part 5, then the holding operation of peak holding part 3 is temporarily released, thereby the followup to the next input signal is made possible.
Patent JP-H06249600-A (JP)
Title: Expert system of blasting control
Inventor: MINAMIDE HIDEO
IPC: E21D9/00
Filed: 1993-02-26
Abstract: PURPOSE:To decrease noise or vibration coexisting with a blasting work by taking in an information when a blasting is executed and a measurement information when a blasting is executed, and by providing a construction and measurement data input portion executing a filing of this as an information on and after next time. CONSTITUTION:A construction and measurement input part 6, when an input of a charge quantity (an electric detonator, an explosive kind, an explosive diameter, an explosive envelope weight, a charge quantity per a holes number and so on) used in construction, is executed, when an input of a measurement result (vibration speed, a sound pressure level, a low frequency sound level and so on) responding a stage number in the case wherein a construction site measurement is done, is executed, and when an input of such contents as a wrong condition at a blasting at this time and a countermeasure to a blasting at next time and so on, are executed, a function taking in these and a function preserving these respective informations after filing thereof are provided. And, when an input of an information about a charge quantity used in a construction and so on or an information about a measurement result and so on, is executed, this is taken in and a filing thereof is executed as data for a blasting on and after next time.