baber/WOPTO huggingface dataset:
Patent TW-202123759-A (TW)
Title: Frequency domain correlation feedback for enhanced frequency domain partial reciprocity downlink
Inventor: MANOLAKOS ALEXANDROS
IPC: H04W72/04
Filed: 2020-10-23
Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit a sounding reference signal (SRS) on a first set of sub-bands. The UE may report channel state information (CSI) associated with a second set of sub-bands. The first set of sub-bands may be different from the second set of sub-bands. The CSI may include information that identifies one or more frequency domain correlations among the first set of sub-bands and the second set of sub-bands. Numerous other aspects are described.
Patent TW-202136195-A (TW)
Title: Novel compounds
Inventor: COOKE MICHAEL LIAM
IPC: C07C69/593
Filed: 2020-10-27
Abstract: The invention relates to compounds of formula (I) and to their use in treating or preventing an inflammatory disease or a disease associated with an undesirable immune response: 
 
     
       
         
       
     
     wherein R A , R B , R C  and R D  are as defined herein
Patent TW-202123294-A (TW)
Title: Substrate processing system and substrate processing method
Inventor: RENAU ANTHONY
IPC: H01J37/30
Filed: 2020-11-16
Abstract: A system may include a substrate stage to support a substrate, and a plurality of beam sources. The plurality of beam sources may include an ion beam source, the ion beam source arranged to direct an ion beam to the substrate, and a radical beam source, the radical beam source arranged to direct a radical beam to the substrate. The system may include a controller configured to control the ion beam source and the radical beam source to operate independently of one another, in at least one aspect, wherein the at least one aspect includes beam composition, beam angle of incidence, and relative scanning of a beam source with respect to the substrate.
Patent TW-202220941-A (TW)
Title: Glass material with low dielectric constant and low fiberizing temperature
Inventor: LIN JIA-YOU
IPC: C03C13/00
Filed: 2020-11-16
Abstract: A glass material with a low dielectric constant and a low fiberizing temperature includes silicon dioxide, boron trioxide, aluminum oxide, calcium oxide, phosphorus pentoxide and zinc oxide. The silicon dioxide makes up 45%-52% by weight of the glass material. The boron trioxide makes up 25%-30% by weight of the glass material. The aluminum oxide makes up 10%-14% by weight of the glass material. The calcium oxide makes up 1%-4% by weight of the glass material. The phosphorus pentoxide makes up 0-3% by weight of the glass material. The zinc oxide makes up 1%-5% by weight of the glass material. The reduced silicon dioxide content and calcium oxide content and addition of phosphorus pentoxide and zinc oxide in the glass material lower the dielectric constant and fiberizing temperature of the glass material.
Patent TW-202215435-A (TW)
Inventor: ELKANOVICH IGOR
IPC: G11C8/16
Filed: 2020-12-04
Abstract: A semiconductor device with an interface includes a master device and a plurality of slave devices. The master device includes a master interface. The slave devices are stacked on the master device one after one as a three-dimension (3D) stack. Each of the slave devices includes a slave interface and a managing circuit, the master interface and the slave interfaces form the interface for passing signals in communication between the master device and the slave devices. The managing circuit of a current one of the slave devices drives a next one of the slave devices. An operation command received at the current one of the slave devices is just passed to the next one of the slave devices through the interface. A response from the current one of the slave devices is passed back to the master device through the interface.
Patent TW-202223186-A (TW)
Title: Multi-color layer hybrid yarn component having multi-layered and gradient multi-color layer color-changing effect
Inventor: Zhang xin-jian
IPC: D03D1/02
Filed: 2020-12-11
Abstract: A multi-color layer hybrid yarn component includes a first yarn body and a second yarn body. The first yarn body enters a processing nozzle at a first feeding speed, and the second yarn body enters the processing nozzle at a second feeding speed for being wound and combined with the first yarn body, so as to form a hybrid yarn body with a preset tincture. The color of the second yarn body is different from the color of the first yarn body. The second feeding speed and the first feeding speed are interactively changed, so as to adjust the color of the hybrid yarn body with the preset tincture, so that the hybrid yarn body has a multi-layered and gradient multi-color layer color-changing effect.
Patent TW-202130181-A (TW)
Title: Stream decompression circuit
Inventor: WU CHIH-LIANG
IPC: H04N19/157
Filed: 2020-12-22
Abstract: A stream decompression circuit is disclosed. The stream decompression circuit includes a code length first-in-first-out (FIFO) and a calculation circuit. The code length FIFO is coupled to a variable length coding (VLC) circuit and used to store a code length that the VLC circuit codes sub-streams and output a specific number of bits when the code length accumulates over the specific number of bits. The calculation circuit is coupled between the code length FIFO and a multiplexer circuit and used to calculate a number of bits required for decompression and output an output multiplex control signal to the multiplexer circuit to control the multiplexer circuit to output the sub-streams according to a specific order.
Patent TW-202226349-A (TW)
Title: Method for reducing mismatch of semiconductor element patterns
Inventor: LIEN HUNG-KANG
IPC: H01L21/304
Filed: 2020-12-23
Abstract: The invention provides a method for reducing mismatch of semiconductor device patterns, which comprises the following steps: defining an initial lithography region which partially overlaps a target gate structure, a first gate structure and a second gate structure; if a length and a width of the target gate structure are smaller than a preset length and a preset width respectively, adjusting and reducing the area of the initial lithography region to define a second lithography region. The second lithography region partially overlaps with the target gate structure but does not overlap with the first gate structure and the second gate structure, and the second lithography region is defined as the active area.
Patent TW-202126051-A (TW)
Title: Dynamic control of fingerprinting rate to facilitate time-accurate revision of media content
Inventor: THIELEN KURT R
IPC: H04N21/45
Filed: 2019-06-28
Abstract: A computing system identifies a media stream being received by a client, based on fingerprint matching conducted with query fingerprints generated by the client at a frame rate. The computing system then causes the client to increase the frame rate, in order to facilitate establishment by the computing system of synchronous lock between true time within the media stream and client time according to an clock of the client. The computing system then uses the established synchronous lock as a basis to map a true-time point at which a content revision should be performed in the media stream to a client-time point at which the client should perform the content revision. And the computing system causes the client to perform the content revision at the determined client-time point.
Patent TW-202217597-A (TW)
Inventor: Liu kai-jian
IPC: G06F16/55
Filed: 2020-12-28
Abstract: The present disclosure provides an image incremental clustering method, an electronic equipment, a computer storage medium, wherein the method obtains a first cluster of a first image data set; divides the first cluster into M the first sub-clusters, and obtains the first cluster center corresponding to each first sub-cluster in the M first sub-clusters; the M is an integer greater than or equal to 1; the second image data set is obtained, and the first cluster center merges the second image data set with the first cluster.
Patent TW-202202746-A (TW)
Title: Buckle assembly
Inventor: CHENG MAN-QUN
IPC: F16B45/04
Filed: 2021-01-26
Abstract: A buckle assembly includes a first buckle component, a second buckle component and an operating component. The first buckle component includes a locked portion. The second buckle component includes a locking portion. The locking portion engages with the locked portion along a lateral direction of the buckle assembly when the second buckle is mated with the first buckle component along a mating direction. The operating component is partially embedded in and partially exposed out of the second buckle component. The operating component is slidable relative to the second buckle component. The operating component drives the locking portion to move away from the locked portion for disengaging the locking portion from the locked portion during a sliding movement of the operating component relative to the second buckle component. The present invention has advantage of saving labor and easy operation.
Patent TW-202137464-A (TW)
Title: Semiconductor device and method for preparing the same
Inventor: HUANG TSE-YAO
IPC: H01L23/522
Filed: 2021-02-03
Abstract: The present disclosure provides a semiconductor device and a method for preparing the semiconductor device. The semiconductor device includes an interconnect structure disposed over a first semiconductor die. The first semiconductor die includes a semiconductor substrate and a first conductive pad disposed over the semiconductor substrate, and the first conductive pad is covered by the interconnect structure. The semiconductor device also includes dielectric spacers surrounding the interconnect structure. An interface between the dielectric spacers and the interconnect structure is curved. The semiconductor device further includes a dielectric layer surrounding the dielectric spacers, and a second semiconductor die bonded to the dielectric layer and the interconnect structure. The second semiconductor die includes a second conductive pad, and the interconnect structure is covered by the second conductive pad.
Patent TW-202137317-A (TW)
Title: Processing method and processing device
Inventor: SAKAUE TAKASHI
IPC: B24B41/047
Filed: 2021-02-04
Abstract: A method for processing a substrate in a processing device, the method including: subjecting the substrate to first grinding processing in a first grinding section, subjecting the substrate to second grinding processing in a second grinding section, subjecting the substrate to first re-grinding processing in the first grinding section, and subjecting the substrate to second re-grinding processing in the second grinding section, wherein the substrate is subjected to finishing grinding to its final finished thickness in the second re-grinding processing.
Patent TW-202132399-A (TW)
Title: Active ester resin, epoxy resin composition, cured product thereof, prepreg, laminated board, and build-up film
Inventor: SOH MASAHIRO
IPC: C08J5/24
Filed: 2021-02-09
Abstract: Provided are an epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board uses, and an active ester resin that gives the epoxy resin composition. An active ester resin characterized by having a polyaryloxy unit containing a dicyclopentenyl group represented by formula (1), and a polyarylcarbonyl unit. Here, R1 represents a C1-8 hydrocarbon group, R2 represents a hydrogen atom, formula (1a), or formula (1b), and at least one R2 is formula (1a) or formula (1b). n represents a number of repetitions of 1-5.
Patent TW-202143843-A (TW)
Inventor: WAGH PRADEEP
IPC: A01N43/78
Filed: 2021-02-17
Abstract: The present invention relates to an agrochemical composition comprising: a) a neonicotinoid or a 3-pyridine carboxamide insecticide; and b) a crystal growth inhibiting system wherein the crystal growth inhibiting system is a combination of a mineral oil and a surfactant mixture. The present invention further provides process, method, use and kit thereof.
Patent TW-202127133-A (TW)
Inventor: HSIAO MING-HSIANG
IPC: G02B7/02
Filed: 2017-07-13
Abstract: 用於裝配光學模塊的裝配裝置具有被驅動以向上和向下移動，以便將透鏡裝配到筒中的筒支撐器，將不同的階段的力施加到筒支撐架上。此外，可以收集測試圖像以進一步調整筒和支撐器，其可以是具有相機的行動電話或其他的組件。
Patent TW-202234957-A (TW)
Title: 雙面及多層fpc用基板及其加工方法
Inventor: TSAI SUI-HO
IPC: H05K3/00
Filed: 2021-02-22
Abstract: 本發明關於基板加工技術領域，尤其關於一種雙面及多層FPC用基板及其加工方法，包括：基材，基材上開設有複數沿厚度方向貫穿的斜孔；濺射層，濺射層附著在基材和斜孔的表面；導電部，導電部設于斜孔內，並與濺射層相連；複數線路銅層，複數線路銅層位於基材的上下表面，並與濺射層相連，複數線路銅層之間通過導電部相連。本發明能夠降低生產成本，降低鑽孔難度、方便孔內表面濺射並使得濺射離子濺射在孔內表面，避免濺射到對向的滾輪上。
Patent TW-202202427-A (TW)
Title: 具有腔室對接系統之移動搬運車上的協同機器人系統
Inventor: BRAND VITALI
IPC: H01L21/677
Filed: 2021-03-03
Abstract: 一種服務半導體設備用的機器人系統包含搬運車框架。臂支撐框架係固定至搬運車框架且係耦合至機器人手臂。臂框架係藉由鉸鏈而在第一端連接至臂支撐框架並在第二端連接至固定件連接介面。固定件連接介面連接至半導體設備的對接固定件。臂鎖機構係附接至臂支撐框架，臂支撐框架係用以在臂框架旋轉至延伸位置或折疊位置時鎖定臂框架。固定件連接介面在臂框架被鎖定至延伸位置中時將搬運車框架連接至半導體設備。
Patent TW-202236159-A (TW)
Title: Method and system for predicting defects of holes in strip product
Inventor: YANG YUNG-YI
IPC: G06K9/62
Filed: 2021-03-03
Abstract: A method and a system for predicting defects of holes in a strip product are provided. The system includes a defect database, a model building unit, an image capture unit, a defect marking unit, a classification unit, and a model evaluation unit. The hole prediction ability of strip products is improved through the early warning mechanism of the defect model of holes.
Patent TW-202201579-A (TW)
Title: Element array pressurizing device, manufacturing device, and manufacturing method
Inventor: KOIZUMI HIROSHI
IPC: H01L21/60
Filed: 2021-03-04
Abstract: To provide an element array pressurizing device that can stabilize an element array that can be manufactured on a mounting substrate. An element array pressurizing device 10 has a pressurizing plate 11 having a pressurizing unit 12 that pressurizes an element array 40 comprising a plurality of elements 40a-40c disposed on a mounting substrate 30. The pressurizing unit 12 has a plate-shaped hard material 13 for which a surface precision is higher than that of a surface of the pressurizing plate 11.
Patent TW-202139392-A (TW)
Inventor: SU HSIN-WEN
IPC: H01L23/48
Filed: 2021-03-23
Abstract: 半導體裝置包括形成在第一主動區上方的第一字元線。在一些實施例中，第一金屬線設置在第一字元線上方且垂直於第一字元線，其中第一金屬線使用第一導電通孔電性連接至第一字元線，並且第一導電通孔設置在第一主動區上方。在一些示例中，半導體裝置更包括第二金屬線和第三金屬線，第二金屬線和第三金屬線兩者平行於第一金屬線且設置在第一金屬線的兩側上，其中第二金屬線使用第二導電通孔電性連接至第一主動區的源極/汲極區，並且第淵金屬線使用第三導電通孔電性連接至第一主動區的源極/汲極區。
Patent TW-202141943-A (TW)
Inventor: MESHKATI FARHAD
IPC: H04B7/0404
Filed: 2021-04-06
Abstract: Wireless communications systems and methods related to wireless communications in a system are provided. A user equipment (UE) may determine a plurality of antenna configurations for a plurality of channel frequencies. The UE may determine a set of signal strengths for at least one beam received at one or more antenna configurations of the plurality of antenna configurations for at least one of the channel frequencies. The UE may select, based on the set of signal strengths, a first antenna configuration of the plurality of antenna configurations. After selection of the first antenna configuration, the UE may communicate with a base station, in one or more channel frequencies based on the first antenna configuration.
Patent TW-202211013-A (TW)
Title: 生物辨識感測之溫度及超音波感測器融合
Inventor: LIANG YUE
IPC: G06F3/041
Filed: 2021-04-20
Abstract: 一種示例操作方法可包括：基於來自一個或多個第一類型的感測器的感測器資料來檢測第一區域中的用戶觸摸，響應於該檢測而喚醒被配置成跨第一區域的一些或全部進行測量的一個或多個第二類型的感測器，從一個或多個第二類型的感測器獲取附加的感測器資料，以及部分地基於來自一個或多個第二類型的感測器的感測器資料來確定與用戶觸摸相關聯的位置。
Patent TW-202147699-A (TW)
Title: Electrical Connector
Inventor: YU WANG-I
IPC: H01R12/65
Filed: 2020-06-04
Abstract: The present invention relates to an electrical connector, which comprises an insulative housing, a plurality of contact sets and a cover. The insulative housing defines a plurality of receiving slots along a front-and-back direction, and the receiving slots are opened to one side in a height direction perpendicular to the front-and-back direction. Each contact set comprises a first power contact and a second power contact, each one of the first power contact and the second power contact has a retaining portion, at least one contacting portion extending forwards from one end of the retaining portion and at least one soldering leg extending from the other end of the retaining portion. The retaining portions of the first power contact and the second power contact are arranged in the height direction, the contacting portions of the first power contact and the second power contact are arranged in a transverse direction, and the solder legs are arranged in the front-and-back direction. The cover is provided at the opening position of the receiving slots along the height direction, and the first power contact and the second power contact are fixed between the cover and an inner bottom wall of the relative receiving slot opposite to the cover.
Patent TW-202142187-A (TW)
Title: A swab
Inventor: YEN CHING-CHIUAN
IPC: A61B10/02
Filed: 2021-05-04
Abstract: Described is a tip for a swab for collecting a specimen from a subject, the tip being shaped for insertion into, and collection of the specimen from, a body cavity of the subject, and comprising a plurality of curved blades defining an internal reservoir for receiving the specimen, the tip being attached or attachable to a rod.
Patent TW-202244786-A (TW)
Inventor: XIE WAN-YUN
IPC: G06K9/66
Filed: 2021-05-05
Abstract: 本發明提供一種廚餘辨識系統及其辨識方法，該廚餘辨識系統包括有圖像擷取模組、菜餚辨識模組、像素計算模組、重量計算模組、資料庫模組以及廚餘計算模組。該圖像擷取模組擷取圖像。該菜餚辨識模組接收該圖像，將該圖像切割為子圖像，辨識出該圖像中包含之菜餚類別。該像素計算模組計算出相同該菜餚類別之子圖像之像素值。該重量計算模組接收該像素值，運算後輸出該菜餚類別之重量值。該資料庫模組用以儲存該菜餚辨識模組、該像素計算模組以及該重量計算模組所輸出之資料。該廚餘計算模組根據該資料庫模組之資料進行廚餘數量計算，得到廚餘數量值。藉由上述，讓業者能根據客人的喜好準備菜色菜單，以有效減少食材的浪費。
Patent TW-202144266-A (TW)
Title: Substrate storage container
Inventor: KUBOTA KOUJI
IPC: B65G49/07
Filed: 2021-05-17
Abstract: A substrate storage container according to the present invention is configured such that: a substrate W slides with respect to a second contact surface 601 at least when transitioning from a state in which an container body opening is not closed by a lid to a state in which the container body opening is closed by the lid, or when transitioning from a state in which the container body opening is closed by the lid to a state in which the container body opening is not closed by the lid; and an inner-side substrate support part 6 is composed of an alloy resin mainly containing a polycarbonate resin and polybutylene terephthalate resin, with the mass of the polybutylene terephthalate resin being greater than the mass of the polycarbonate resin.
Patent TW-202246070-A (TW)
Title: Method of making a mesh-free screen plate by obtaining a plurality of position points on a meridian from the starting point
Inventor: Huang zi-you
IPC: B41F15/34
Filed: 2021-05-25
Abstract: A method of making a mesh-free screen plate is disclosed, which comprises the following steps: finding a pattern starting point of at least one finger-shaped electrode pattern on a screen plate; starting from the pattern starting point, along the direction parallel to the finger-shaped electrode pattern, searching meridians on the screen plate from a site in the vicinity to a remote site within a search distance on the X axis; obtaining the meridian closest to the starting point of the pattern within the search distance, and setting a starting point of the meridian; from the starting point, obtaining a plurality of position points on the meridian; obtaining an X-axis distance difference between the starting point and each of the plurality of position points and the starting point of the pattern, and judging if the X-axis distance difference satisfy the first Formula: 0 ≤ |X-axis distance difference| ≤ pattern width/2 or satisfy the second formula: X-axis distance difference > pattern width/2.
Patent TW-202211082-A (TW)
Title: Crowd overdensity prediction method, apparatus, electronic device and storage medium
Inventor: YANG KUN-LIN
IPC: G07C9/00
Filed: 2021-06-07
Abstract: The present disclosure provides a crowd overdensity prediction method and apparatus. The method includes: acquiring a plurality of images of a bayonet of a to-be-tested area; determining a number of people already accommodated in the to-be-tested area and a person's net inflow speed of the to-be-tested area based on the plurality of images of the bayonet of the to-be-tested area; determining crowd overdensity time for the to-be-tested area based on the number of people already accommodated in the to-be-tested area, a number of people that can be accommodated in the to-be-tested area and the person's net inflow speed of the to-be-tested area.
Patent TW-202214307-A (TW)
Inventor: BINDER WHITNEY
IPC: A61P35/00
Filed: 2021-06-11
Abstract: 本發明概言之涉及包含至少一種多肽之奈米脂蛋白顆粒結合物及包含至少一種長度介於 20 至 60 個胺基酸之間的短肽的奈米脂蛋白顆粒結合物。亦提供相關組成物及系統以及其製備及使用方法。特定而言，提供具有抗原結合片段 (Fab) 之奈米脂蛋白顆粒 (NLP) 結合物，其中該 NLP 包含由支架蛋白質環繞之成膜脂質的雙層，且該等 Fab 結合至一個或兩個雙層表面。在一些實施例中，該等 (NLP) 結合物進一步包含長度為 20 至 60 個胺基酸之短肽。該等結合物以及相關組成物及系統通常展現良好的穩定性及可製造性，保留抗原結合活性，且可增強抗原結合效力，從而提供用於遞送 Fab 及基於 Fab 之治療劑及診斷劑之多功能平臺且提供用於遞送其他治療劑及/或診斷劑的穩定平臺。
Patent TW-202214399-A (TW)
Title: Method for assembling fastener structure on plate body which can quickly assemble the fastener structure on the plate body
Inventor: WANG TING-JUI
IPC: B25B27/14
Filed: 2020-10-12
Abstract: The present invention provides a method for assembling a fastener structure on a plate body. The fastener structure has a body and a buckle. The body is provided with a solderable layer and the solderable layer is welded to the plate body. The buckle is movably combined with the body and has a head part and a buckle part. The body, the buckle, or the body and the buckle are picked up by a tool and then placed on the plate body for welding so that the body and the plate body are combined. Further, the body, the buckle, or the body and the buckle are simultaneously assembled with an auxiliary pick-up unit so that the fastener structure is picked up by the tool through the auxiliary pick-up unit and then placed on the plate body for welding to combine the body with the plate body. Therefore, the present invention can quickly assemble the fastener structure on the plate body. The method for assembling a fastener structure on a plate body includes the steps of providing a tool to pick up the fastener structure, enabling the tool to move the fastener structure to a preset height on the assembly location of the plate body, and making the tool release or loosen the fastener structure so that the fastener structure is dropped to the assembly location of the plate body. The body of the fastener structure has a material holding space and the assembly location of the plate body has an opening. After the material holding space of the fastener structure is dropped to the opening of the plate body, the fastener structure is pressed by an external force and the periphery of the opening is pressed by the body to make the material of the plate body flow into the material holding space.
Patent TW-202211399-A (TW)
Title: Substrate bonding apparatus and method of manufacturing a semiconductor device
Inventor: KAWADAHARA SHO
IPC: H01L21/683
Filed: 2021-07-30
Abstract: According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.