Patent SG-11201901263Q-A (SG)
Title: Wafer-like substrate processing method, apparatus and use thereof
Inventor: RAUENBUSCH RALPH
IPC: H01L21/683
Filed: 2017-09-14
Abstract: 12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 19 April 2018 (19.04.2018) WIP0 1 PCT 01E101°1a °nolo ollioluiolim mil °nom oimIE (10) International Publication Number WO 2018/068983 Al (51) International Patent Classification: C25D 17/00 (2006.01) C25F 1/00 (2006.01) C25D 17/06 (2006.01) C23C 18/16 (2006.01) HOlL 21/677 (2006.01) C23F 1/00 (2006.01) HO1L 21/683 (2006.01) (21) International Application Number: PCT/EP2017/073190 (22) International Filing Date: 14 September 2017 (14.09.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 16193990.5 14 October 2016 (14.10.2016) EP (71) Applicant: ATOTECH DEUTSCHLAND GMBH [DE/DE]; ErasmusstraBe 20, 10553 Berlin (DE). (72) Inventors: RAUENBUSCH, Ralph; c/o Atotech Deutsch- land GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). BUSSENIUS, Tobias; c/o Atotech Deutsch- land GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). BUCHBERGER, Daniel; c/o Atotech Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). WEINHOLD, Ray; c/o Atotech Deutschland GmbH, Patent Management, ErasmustraBe 20, 10553 Berlin (DE). (74) Agent: SCHULZ, Hendrik; c/o Atotech Deutschland GmbH, Patent Management, ErasmusstraBe 20, 10553 Berlin (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (54) Title: WAFER-LIKE SUBSTRATE PROCESSING METHOD, APPARATUS AND USE THEREOF Fig. 1 7 1-1 00 01 00 SO (57) : The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate. o [Continued on next page] WO 2018/068983 Al MIDEDIM11110111101111101111111111111111111011110111111111110111111111111111111111 GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))