baber/WOPTO huggingface dataset:
Patent JP-H08194796-A (JP)
Title: Two-dimensional code card system
Inventor: ISHIKAWA YASUO
IPC: B42D15/10
Filed: 1995-01-18
Abstract: PURPOSE: To provide a two-dimensional code card system capable of preventing itself from being suffered from such as an illegally laminated card using the initial code area by improving the security. CONSTITUTION: The two-dimensional code card system reads by a card reading means a two-dimensional code card 1 in which prescribed numerals and characters, etc., expressed by a two-dimensional graphic code are written by a card writing means and executes processing by judging instruction contents inputted by a user.  The system is provided with the two-dimensional code card 1 recorcing information by setting the magnetic pattern 2 characteristic to a card which is shown by a detection line at the prescribed position of the card base paper which is magnetized by filling a magnetic powder member at random to be a password, and the card reading means reading the password from the prescribed detection line and collating it at the time of reading the card to decode recorded information to execute processing at the time of coincidence and to judge the card to be an unauthorized card to stop its processing at the time of non-coincidence.
Patent JP-H03225976-A (JP)
Title: Manufacture of magnetic-to-electric conversion element
Inventor: KONDO MASAHARU
IPC: H01L43/14
Filed: 1990-01-31
Abstract: PURPOSE:To prevent the pattern of an InSb film from being deformed and to prevent an increase in an unbalanced voltage V0 by a method wherein a patterned compound semiconductor layer is covered with a resist layer in such a way that also its side face is covered and, in this state, an oxidizing compound which has been applied to the surface of an oxidizing insulating film is removed. CONSTITUTION:An InSb film (13) is deposited, by a vacuum vapor-deposition method, on the surface of a single-crystal silicon semiconductor substrate (12) where a silicon oxide film (11) has been formed; it is patterned by a photoresist (14). The resist (14) used to pattern the InSb film (13) is removed once; a photoresist is spin-coated again; it is exposed to light; it is developed. Thereby, a second resist layer (16) is formed in such a way that also sidewalls of the InSb film (13) are covered. Sidewalls (15) on the silicon oxide film (11) in a covered state are removed by an etchant of hydrochloric acid (HCl). Since the InSb film (13) is protected by the resist layer (16), a patterned shape appears as it is.
Patent JP-H06234231-A (JP)
Title: Manufacture of thermal head
Inventor: SASAGAWA HIDEO
IPC: B41J2/335
Filed: 1993-02-10
Abstract: PURPOSE:To restrain a voltage drop due to the resistance of a conductive body and permit the heat generation of a heat generating element to a predetermined temperature thereby restraining the variability in printing density. CONSTITUTION:A substrate 11 is coated by a material having a high electric resistance to form a resistance body thin film layer 12 and common electrode as well as a lead electrode are constituted on the resistance body thin film layer 12 respectively to form conductive bodies 14, 15 while a heat generating element 13 is formed between both of the conductive bodies 14, 15. The conductive bodies 14, 15 are provided with at least one constituent, diffused by applying aneal treatment. Aneal treatment is applied on only an area, set so as to include a heat generating element 13 in the conductive elements 14, 15 to form a metallic layer 22 on the conductive bodies 14, 15 by diffusing at least one constituent in the conductive bodies 14, 15 whereby insulative protecting layer 21 is formed on the metallic layer 22. The metallic layer 22 reacted upon the insulative protecting film 21 whereby bondability is improved.
Patent JP-S59148959-A (JP)
Title: Debugging device
Inventor: TAKAGI HARUO
IPC: G06F11/28
Filed: 1983-02-14
Abstract: PURPOSE:To improve the reliability of debugging by mounting a memory corresponding to respective addresses of a mounted memory, addressing the memory in parallel with the mounted memory and displaying a writing miss of a program. CONSTITUTION:A bit map memory 4 in the debugging device B has a memory space completely corresponding to the mounted memory 2 and includes a one- bit data area. A multiplexer 6 switches access by the CPU5 or addressing parallel with the memory 2 by an address signal from the mounted CPU1. At the time of debugging in the run mode of the mounted CPU1, the memory 4 is addressed by the CPU1 simultaneously with the mounted memory 2. If data are to be written in the mounted memory 2 when the output of the memory 4 is in write inhibition similar to the mounted memory 2, an FF9 is set up, the output is inverted 10 to inhibit INH the writing and the output of the inverter 11 drives a light emitting diode 12. Thus, the writing miss of debugging can be easily prevented.
Patent JP-H03227506-A (JP)
Title: Normal mode choke coil
Inventor: HASHIMOTO SHUNJI
IPC: H01F37/00
Filed: 1990-02-01
Abstract: PURPOSE:To improve a high frequency characteristic by using one U-type open magnetic path magnetic core whose leg parts are wound about with a winding respectively to make two coils in order that these two coils may constitute respective normal mode choke coils for each line. CONSTITUTION:The leg parts 3 of a U-type open magnetic path magnetic core 5 are wound about by a small coil diameter winding 6 and a large coil diameter winding 7 in two layers, while the other leg part 4 of the magnetic core 5 is similarly wound about by a small coil diameter winding 8 and a large diameter winding 9, and the small coil diameter winding 6 and the other small coil diameter winding 8 are made with one piece of wire so as to be a first coil, similarly, the large coil diameter winding 7 and the other large diameter winding 9 are made of one piece of wire so as to be a second coil 2. Thereby, coils used to be wound by two layers before can be made with one layer alignment winding so that distributed capacitance is reduced and a high frequency characteristic can be improved.
Patent JP-S60166695-A (JP)
Title: Oligonucleotide derivative and its preparation
Inventor: MIYOSHI KENICHI
IPC: C07H21/04
Filed: 1984-02-09
Abstract: NEW MATERIAL:A compound shown by the formula I (p is natural number; R<1> is bifunctional hydrocarbon residue; B is nucleotide constituent base). USE:An intermediate for preparing a resin for affinity chromatography and for a nonradioactive affinity probe. PREPARATION:All protecting groups at group R<2> of 3'-end group extension, at group R<3> of 5'-end group, at a basic part and at a phosphoric part of a compound shown by the formula II (R<0> is phosphoric-protecting group; R<2> is H, or amino-protecting group; R<3> is H, or 5'-hydroxy-protecting group of nucleotide; B' is nucleotide constituent base which may be protected; with the proviso that at least one of R<0>, R<2>, R<3>, and B is protected) are eliminated.
Patent JP-H02204753-A (JP)
Title: Magenta toner
Inventor: MORIMOTO REIKO
IPC: G03G9/09
Filed: 1989-02-02
Abstract: PURPOSE:To improve the color mixability, transparency, fixability, etc., of the toner by specifying the mol. wt. distribution of the toner contg. a magenta coloring agent. CONSTITUTION:The magenta coloring agent is incorporated into this toner and the toner is so formed that the mol. wt. distribution by GPC has >=1 peaks at 700 to 2,000 and 8,000 to 80,000mol.wt. distribution. This toner can be produced by a suspension polymn. method. A magenta pigment which has no property to shift to an aq. phase and property hinder polymn., vinyl monomer, such as styrene (deriv.), paraffin wax having the m. p. within a desired range, copolymer having a polar group, polymn. initiator, crosslinking agent, etc., can be incorporated into the monomer compsn. used for the suspension polymn.
Patent JP-H07235558-A (JP)
Title: Due bonding method of led chip to lead frame
Inventor: YAMADA MOTOKAZU
IPC: H01L21/52
Filed: 1994-02-21
Abstract: PURPOSE:To provide a quick and accurate die bonding method wherein chip deviation is not generated when an LED chip is bonded to a lead frame. CONSTITUTION:In a method for die-bonding an LED chip 3, which is formed by laminating a gallium nitride based compound semiconductor layer 2 on the surface of a sapphire substrate 1, to a lead frame 10 via adhesive agent 4, resin which is cured by ultraviolet rays irradiation is used as the adhesive agent 4.
Patent JP-H08214959-A (JP)
Title: Clothes housing device
Inventor: FUKUDA MORINORI
IPC: A01N31/06
Filed: 1995-02-10
Abstract: PURPOSE: To inexpensively impart antibacterial, antifungal, and mothproof effects, without causing shrunk or damage to dried clothes during storing thereof in a clothes housing device imparting antibacterial, antifungal and mothproof treatments to clothes by vaporizing a chemical having antibacterial, antifungal and mothproof properties. CONSTITUTION: A chemical supplying device 5 is disposed within a housing body 1 for housing clothes 7, and a chemical having antibacterial, antifungal and mothproof actions is adsorbed to the clothes 7 within the housing body 1.
Patent JP-S54115572-A (JP)
Title: Lighting fixture
Inventor: ASAMI KOUICHI
IPC: H05B35/00
Filed: 1978-02-28
Abstract: PURPOSE: To simplify a lighting-change by pulling a common string of two switches one of which is for changing light-sorts of the incandescent and fluorescent lamps and the other of which is for changing light-quantity of the selected lamp.  
     CONSTITUTION: A multiplicity of incandescent lamps and fluorescent lamps, the light-sorts changing switch 5 and the light-quantity changing switch 7 are incorporated in the fixture proper. Lighting of only the incandescent lamp or of only the fluorescent lamp can be selected by pulling the knob 11 for the light-sorts changing switch provided to the one side of the common string 6, the process of two lamps, one lamp, all-night lamp lightings and lighting-out can be repeated by pulling the changing knob 12. When the lighting of two incandescent lamps is desired to change to the lighting of one fluorescent lamp, the common knob 10 can be pulled because the light-sorts changing switch 5 and light-quantity changing switch 7 are operated at the same time. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S60169531-A (JP)
Title: Subsidiary material for refining crude copper
Inventor: YAMAMOTO SATOMI
IPC: C22B15/14
Filed: 1984-02-13
Abstract: PURPOSE:To reduce the loss of copper in a refining stage by adding copper compounds in slag after refining as a subsidiary material to an alkaline earth metallic chloride or the like. CONSTITUTION:Crude copper is subjected to slag refining with CaCl2 as an alkaline earth metallic chloride or a mixture of CaCl2 with CaO as an alkaline earth metallic oxide, and formed slag is dissolved in water. Copper is separated and recovered from the undissolved matter mainly in the form of copper compounds, and the recovered copper is dried and added to slag for refining as powder, so copper in the formed slag is charged again as recovered copper. Copper is circulated between the refining and recovering stages, and operation with no loss of copper is carried out in the following stages. By this method the loss of copper in the refining stage is reduced.
Patent JP-S57137618-A (JP)
Title: Intake device of internal combustion engine
Inventor: YAMADA TOSHIO
IPC: F02B31/00
Filed: 1981-02-20
Abstract: PURPOSE:To reduce a rate of fuel consumption at idling operation, by opening the outlet of a bypass passage, bypassing a throttle valve, on the internal wall surface of an intake port at the side apart from a cylinder axial line. CONSTITUTION:A bypass passage 31 branches from an intake passage in the upstream of a throttle valve 24, and intake air is sucked by a flow control valve 32 at idling operation of an engine. A bypass passage outlet 30 is opened on the internal wall surface of an intake port 6 at the side separated from a cylinder axial line. In this way, since strong turbulence can be caused in a combustion chamber 4 at idling operation of the engine, a low idling speed of the engine can be obtained, and stable combustion can be ensured even for use of lean mixture gas.
Patent JP-H06212837-A (JP)
Title: Method of constructing indefinite shape multistoried building
Inventor: NAGATA YOSHIO
IPC: E04G21/14
Filed: 1993-01-19
Abstract: PURPOSE:To obtain a method of constructing an indefinite shape multistoried building imitating a Buddhist image, etc., in view of a religion. CONSTITUTION:Main frames 10 as a building body are assembled and erected by a crane, and each backing steel-frame block constituting a round slicing- shaped backing structure at a main-body lowermost stage in the building is built up as a backing. Indefinite shape covering bodies are mounted previously on the backing steel-frame blocks 24 and suspended by the crane, and the structure is constructed by a curtain wall form, in which the indefinite skin bodies are installed onto the outer circumferential section of the main frames 10 at every stage. Accordingly, no external scaffold is required, and the indefinite shape multistoried building can be built efficiently and safely.
Patent JP-H04263457-A (JP)
Title: Semiconductor device
Inventor: HARADA SHIGEKI
IPC: H01L23/40
Filed: 1991-02-18
Abstract: PURPOSE:To make it possible to make a semiconductor device capable of coping with semiconductor chips whose thicknesses are different from one another, by a method wherein in the device having a plurality of the chips, heat generated from the chips can be directly dissipated from the chips to the outsides of caps. CONSTITUTION:A semiconductor device is provided with a plurality of semiconductor chips (12) mounted on a board (10), caps (16), which are mounted on said substrate and respectively have one of opening parts (20) to correspond to the arrangement of the chips (12), and heat dissipation members (22), which are respectively mounted on one of the caps (16), respectively have heat dissipation fins (24) on their external sides and respectively have one of legs (26), which can be inserted in the opening parts, on their internal sides and is formed into a constitution, wherein the leg parts (26) of said heat dissipation members are inserted in said opening parts (20) and the leg parts (26) are bonded on the chips (12).
Patent JP-H02203374-A (JP)
Title: Cleaning blade
Inventor: SUZUKI YASUHITO
IPC: G03G21/00
Filed: 1989-01-31
Abstract: PURPOSE:To improve edge durability by using a specific prepolymer consisting of isocyanate and polyol to form the edge part of a planar blade member and forming the other part of a material softer than the material of the edge part. CONSTITUTION:This cleaning blade consists of the planar blade member 10 consisting of a hard part 8 formed in the edge part of the blade and a soft part 9 which is the other part and a planar holding member 11. The hard part 8 of the planar blade member 10 is constituted of a material obtd. by using the prepolymer having 2.02 to 2.5 number of functional groups and a hardener. The soft part 9 is constituted by using rubber, resins, etc., exclusive of urethane, if the material is softer than the hard part 8. The cleaning blade having the excellent edge durability is obtd. while the low creep property and fine vibration absorptivity are maintained.
Patent JP-2000223616-A (JP)
Title: Mount substrate and semiconductor mounting device
Inventor: SHIGETA HIROYUKI
IPC: H01L23/12
Filed: 1999-02-01
Abstract: PROBLEM TO BE SOLVED: To prevent the generation of thermal stress in the solder for a joint due to a difference in a coefficient of linear expansion between a rigid substrate and a semiconductor package or a semiconductor chip and the consequent generation of cracks in the solder when joining the rigid substrate and the semiconductor package or the semiconductor chip with the solder. SOLUTION: A rigid substrate 1 and a flexible substrate 7 are stacked through a buffer 6 made of anisotripic conductive material of a low elasticity so that an electrical connection between a wiring film of the rigid substrate 1 and that of the flexible substrate 7 may be established by the buffer 6 itself, to form a mount substrate. The mount substrate is mounted and joined with a semiconductor package or a semiconductor chip 2 with solder 3 to fabricate a semiconductor mounted device.
Patent JP-H02204214-A (JP)
Title: Face material handling installation
Inventor: NAKAMURA ATSUSHI
IPC: B65G59/04
Filed: 1989-01-31
Abstract: PURPOSE:To ensure improved supply efficiency and productivity by making stock stands freely rotatable and making provisions so that face materials and stocked on transfer devices at right angles to the direction in which the stock stands are placed parallel to each other when they are delivered to face material installation position and the stands are placed in parallel position when face materials are supplied, on a building panel production line. CONSTITUTION:Three stock stands 3A where face materials a1 are stocked and a stock stand 3B where face materials a2 are stocked are made up of transfer devices 16 which deliver face materials in a direction at right angles to the direction in which they are placed in parallel. Stock stands 3C where face materials a3, a4 are stocked are made up of a pair of transfer devices 22A, 22B installed in parallel and symmetri cally on a rotary plate 21 which rotates horizontally on a vertical axis. The face materials a1-a4, which are stocked as illustrated, are delivered to an installation posi tion Q by means of a conveying device 7. When face materials are supplied to the stock stands 3C, the transfer devices 22A, 22B are positioned at right angles to their positions illustrated. After face materials have been supplied, the stock stands 22A, 22B are re-positioned just as illustrated. This arrangement ensures improved operational efficiency.
Patent JP-H07210520-A (JP)
Title: Memory access mechanism
Inventor: FUJII KEIMEI
IPC: G06F12/02
Filed: 1994-01-25
Abstract: PURPOSE:To enlarge usable memory capacity as an entire parallel computer as needed and to effectively utilize an address space without wasting it. CONSTITUTION:A global (G)/local(L) distribution field 301 of a variable length is provided at a fixed length address designated by each processor (PU), when the field 301 is L, an address is defined as the address of an L area peculiar for a present memory referred to by each PU, when the field 301 is G, remaining addresses are defined as a logical PU number (converted to a physical PU number) field to designate which PU the G area belongs to among the G areas of a memory to be owned and mutually referred to by several PU and an offset field to designate the address on the memory owned by the PU indicated by this logical PU number field, and a memory access interface is provided to execute access to the L or G area of the memory at the present PU or access to the G area of the memory at the other PU corresponding to this address.
Patent JP-H06218492-A (JP)
Title: Shell mold
Inventor: OSUGI TOSHIYUKI
IPC: B22C13/08
Filed: 1993-01-19
Abstract: PURPOSE:To obtain a shell mold which can form a cavity by joining both molds with adhesive. CONSTITUTION:In the shell mold 1 forming the cavity 4 by joining two molds 2, 3, projecting parts 6 and recessed parts 7 for joining molds are provided on the joining surface of respective molds 2, 3 and the groove width in this recessed part 7 is made slightly larger than the width of the projecting part 6 to form a gap 8 at the time of fitting. Then the gap 8 is formed at the side far from the cavity 4 or a runner 5, and in the joining surface of the projecting part 6 and the recessed part 7 where the gap 8 is not formed, small grooves 9 are formed along the longitudinal direction.
Patent JP-H08214615-A (JP)
Title: Seeder for flat seed
Inventor: OMAE KENSUKE
IPC: A01C7/04
Filed: 1995-02-13
Abstract: PURPOSE: To provide a seeder for flat seeds, comprising a suction nozzle capable of sucking the seeds lined up with a seed lining up device, transporting the seeds to a position of a tray and releasing the suction, capable of sowing the flat seeds in a posture in a prescribed direction, good in mechanical grafting operations, excellent in operating efficiency and useful for sowing the flat seeds such as a pumpkin. CONSTITUTION: This seeder for flat seeds is constituted of a seed hopper, a seed lining up device G capable of receiving the feed of the seeds from a seed hopper and lining up the seeds in the major axis direction and a suction nozzle capable of sucking the seeds lined up with the seed lining up device G, transporting the seeds to a position of a tray and releasing the suction. Furthermore, the seed lining up device G comprises a vibrating unit 4 vibrated with a vibrator and the vibrating unit 4 is preferably constituted of a tapered guide part 6 connected to the seed hopper, a tunnellike lining up part 8 installed connectedly to the guide part 6 and a suction nozzle inserting port 9 opened to the upper side of the tunnellike lining up part 8.
Patent JP-H08221853-A (JP)
Title: Tape traveling guide shaft
Inventor: YAMAMOTO TAKEHIKO
IPC: G11B15/60
Filed: 1995-02-13
Abstract: PURPOSE: To solve a problem in a machining process by using brass or aluminum of easy machinability without detriment to a function as a guide shaft, such as hardness and smoothness of the shaft surface. CONSTITUTION: This guide shaft arranged in a recording and reproducing device 1 for recording a magnetic tape 3 or reproducing the magnetic tape 3 is for guiding the magnetic tape 3 in contact for its traveling. A guide shaft main body is made by machining brass or aluminum, and electroless Ni-plating is applied to this surface, and also form rolling is performed on the electroless Ni-plated surface, thus giving a smoothing effect.
Patent JP-H11210208-A (JP)
Title: Laying body for floor reform
Inventor: NOZOE HIROSHI
IPC: E04F15/02
Filed: 1998-01-20
Abstract: PROBLEM TO BE SOLVED: To facilitate handling of a laying body for floor reform and efficiently perform execution by providing a specific depth on the lower face of a square carpet body in a planar view, sticking a resin plate having a downward opening- like communicating line groove continued from one side face to the other side face. SOLUTION: A resin plate 3 forming a repeeling adhesive layer 4 on the lower end face is stuck on the lower face of a square carpet body 1 in a planar view, and a laying body R for floor reform is constituted. The resin plate 3 comprises foaming resin of low foaming ratio, the outside diameter is the same as the carpet body 1 in the planar view in the form of a downward opening continued from one side face to the other side face, having a communication line groove 2 of 8-30 mm depth. If the laying body for the floor reform R is laid on while a cable or wiring is inserted in the communicating line groove 2, simple and efficient reform can be performed.  In addition, floating and position shift of the laying body R are prevented by the repeeling adhesive layer 4, addition and modification of the wiring can be facilitated, since the whole laying body R is lightweight, carrying is easy and is not bulky at the time of transport and keeping.