Patent GB-688173-A (GB)
Title: Adhesive compositions
IPC: C09J121/00
Filed: 1951-05-28
Abstract: An adhesive composition particularly suitable for bonding polythene film comprises (1) a normally liquid organic solvent having a boiling-point below 150 DEG  C. of the class consisting of dialkyl ethers, alkyl esters of alkanoic acids, and dialkyl ketones; (2) a dispersed polymer of the class consisting of natural and synthetic rubbers and rubber-like polymers; (3) a dissolved polymer of the class consisting of natural and synthetic rubbers and rubber-like polymers; and (4) a tackifier comprising wood rosin, hydrogenated wood rosin, a diethylene glycol ester of polymerized wood rosin, a polycyclic aromatic hydrocarbon having a molecular weight of 500 to 2,000, a maleic anhydride-modified ester gum or a coumarone indene resin.  The solvents preferably have a B.P. below 120 DEG  C. and may be methyl formate, ethyl acetate, methyl prof pionate, propyl acetate, acetone, diethyl ketones ethyl methyl ketone, n-butyl ether, or isopropyether.  The dispersed and dissolved polymers may be the same material, the state of solubility depending on the method of preparation of the polymer including the degree of polymerization. The polymers may be chloropolythene, ethylenevinyl ester interpolymers, crepe rubber, reclaimed rubber, neoprene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer, polythene, or polybutene.  Other substances which may be added are high boiling esters of aliphatic or aromatic acids with C4-C9 alcohols such as dinonyl diglycolate, dioctylphthalate, dinonyl adipate, pentamethylene glycol oleate; hydro-abietyl alcohol, dibasic lead phosphite, phenyl glycidyl ether, dibutyl tin maleate, diglycidyl ether of bis-phenol, lead salts of organic or inorganic acids, barium or cadmium salts of naphthenic or ricinoleic acid, hydroquinone, lecithin, propyl gallate, lauryl thiodipropionate, 2,3 - dimethyl - 1,4 - di - (3,4 - dihydroxyphenyl) - butane, butylated hydroxy anisole, diphenylamine, alpha-phenyl naphthylamine or betaphenyl naphthylamine.  Preferably 10-25 parts of the dispersed polymer, 3-15 parts of the dissolved polymer, and 25-50 parts of the tackifier is used per 100 parts of organic solvent.  The adhesive may be applied to a polythene film and the surfaces lightly pressed together, the solvent being removed by standing at room temperature for 3-14 days, or by heating at 50 DEG  C. for a few hours.ALSO:An adhesive composition particularly suitable for bonding polythene film comprises (1) a normally liquid organic solvent having a boiling point below 150 DEG  C. of the class consisting of dialkyl ethers, alkyl esters of alkanoic acids, and dialkyl ketones; (2) a dispersed polymer of the class consisting of natural and synthetic rubbers and rubber-like polymers; (3) a dissolved polymer of the class consisting of natural and synthetic rubbers and rubber-like polymers; and (4) a tackifier comprising wood rosin, hydrogenated wood rosin, a diethylene glycol ester of polymerised wood rosin, a polycyclic aromatic hydrocarbon having a molecular weight of 500 to 2,000, a maleic anhydride-modified ester gum or a coumarone indene resin.  The solvents preferably have a B.P. below 120 DEG  C. and may be methyl formate, ethyl acetate, methyl propionate, propyl acetate, acetone, diethyl ketone, ethyl methyl ketone, n. butyl ether, or isopropyl ether. The dispersed and dissolved polymers may be the same material the state of solubility depending on the method of preparation of the polymer including the degree of polymerisation.  The polymers may be chloropolythene, ethylene-vinyl ester interpolymers, cr<\>zepe rubber, reclaimed rubber, neoprene, butadienestyrene copolymer, butadiene-acrylonitrile copolymer, polythene, or polybutene. Other substances which may be added are high boiling esters of aliphatic or aromatic acids, with C4-C9 alcohols such as dinonyl diglycolate, dioctylphthalate, dinonyl adipate, pentamethylene glycol oleate; hydro-abietyl alcohol, dibasic lead phosphite, phenyl glycidyl ether, dibutyl tin maleate, diglycidyl ether of bis-phenol, lead salts or organic or inorganic acids, barium or cadmium salts of naphthenic or ricinoleic acid, hydroquinone, lecithin, propyl gallate, lauryl thiodipropionate, 2,3 dimethyl-1,4 di(3,4-dihydroxyphenyl) butane, butylated hydroxy anisole, diphenylamine, alpha phenyl naphthylamine or beta phenyl naphthylamine.  Preferably 10-25 parts of the dispersed polymer, 3-15 parts of the dissolved polymer, and 25-50 parts of the tackifier are used per 100 parts of organic solvent. The adhesive may be applied to a polythene film and the surfaces lightly pressed together, the solvent being removed by standing at room temperature for 3-14 days, or by heating at 50 DEG  C. for a few hours.