Patent SG-11201908018P-A (SG)
Title: Cutting method for polymer resin mold compound based substrates and system thereof
Inventor: CHAINUR SARDJONO
IPC: H01L21/78
Filed: 2018-09-13
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 21 March 2019 (21.03.2019) WIPO I PCT 1111111111111101111111111111111011111010011111111111111111111111111111111111011110111111 (10) International Publication Number WO 2019/054945 Al (51) International Patent Classification: B23K 26/02 (2014.01) B23K 26/60 (2014.01) B23K 26/70 (2014.01) HOlL 21/78 (2006.01) B23K 26/14 (2014.01) B28D 5/00 (2006.01) (21) International Application Number: PCT/SG2018/050467 (22) International Filing Date: 13 September 2018 (13 09 2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/557,891 13 September 2017 (13.09.2017) US (71) Applicant: GENUINE SOLUTIONS PTE. LTD. [SG/SG]; 80 Ubi Avenue 4, #03-06, Singapore 408831 (SG). (72) Inventors: CHAINUR, Sardjono; 618 Ang Mo Kio Ave 4, #05-1061, Singapore 408831 (SG). WANG, Zhongke; 276A Jurong West Street 25, #09-47, Singapore 641276 (SG). (74) Agent: NG, Kim Tean; NANYANG LAW LLC, P.O. Box 1861, Robinson Road Post Office, Singapore 903711 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. = (54) Title: CUTTING METHOD FOR POLYMER RESIN MOLD COMPOUND BASED SUBSTRATES AND SYSTEM THEREOF FIG. 1 (57) : The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be used in the cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed. [Continued on next page] WO 2019/054945 Al I 11111 0111E0 11101 111 1010 001 11111 IMINIMUMMINIEME (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: with international search report (Art. 21(3)) in black and white; the international application as filed contained color or greyscale and is available for download from PATENTSCOPE