Patent GB-1336417-A (GB)
Title: Machine for attaching the connecting wires to the connection points of a semiconductor component and of the housing accommodating the semiconductor component
IPC: H01L21/00
Filed: 1972-03-08
Abstract: 1336417 Machine for attaching wires to semi-conductor connection points TEXAS INSTRUMENTS Inc 8 March 1972 [25 March 1971] 10736/72 Heading B3A  A machine for attaching connecting wires to connection points of a semi-conductor component and to connection points of a housing accommodating the semi-conductor component comprises a wire guide member 5 which is vertically adjustable with respect to the semiconductor component and the housing, an adjustable support member 10 being adjustable in a plane parallel to the plane of the semiconductor component and housing and having a driver member 26 including a guide member 30, Fig. 2, fixed thereto, and a programme carrier having a plurality of guide members 25 complementary to and engageable with the guide member 30 and being advanceable step-by-step into successive detent positions. The machine comprises a frame 1, a table 2, Fig. 1, and a mounting 3 on which the housing and component may be fixed. The wire guide member 5 is mounted on a support 8 pivoted about an axis 9 mounted on a compound table 10. The programme carrier comprises a perforated disc 16 with detent pins 17 adapted to engage a notch (18) Fig. 3 (not shown) in a stop member 19 mounted on an adjustable leaf spring (20). The disc 16 is rotated by an indexing mechanism 21 which comprises a push member 22 and a resilient metal strip 23 driven by mechanism 24 either pneumatically, hydraulically, or electromagnetically. The disc 16 is provided with a plurality of conical bores 25 which act as guide members for associated detent pins 17. A rocker 26 mounted on table 10 and pivotable about an axis 27 is actuable by drive cylinder (28) and comprises a guide cone 30 positioned above the exact location which is assumed by the conical bore 25 in a working position. The distances of the bores 25 from the centre of the disc 16 are dimensioned for a given component to be fabricated such that they correspond to the location of the connection points for the connecting wires, Fig. 4 (not shown). Operation:-Using drive cylinder (28), guide cone 30 is introduced into the first conical bore 25 of a disc 16 when the component and housing are mounted in the prescribed location. The table 10 and capillary 6 are thereby displaced corresponding to the location of the bore. When the cone is centrally aligned to the wire guide moves downwardly enabling welding to take place, e.g. thermo-compressive or ultrasonically, and the wire, gold or aluminium, can also be severed by tearing or burning off. Rocker 26 is then pivoted upwardly and the disc is indexed one step until the next detent pin 17 engages in notch 18 and the guide cone then centres in the next conical bore 25 and bonding can again be carried out. In an alternative embodiment the leaf spring (20) may be acted on by a push member 32 and thus become bent a certain amount to displace stop member 19 so as to turn disc 16 a slight amount to enable welding at closely adjacent points. In order to operate the machine automatically a compound table 34 is disposed below table 10 and connected to a manipulator 36 so that actuation of the latter brings the table into any desired position. A brake 37 is provided to lock the table 34 and a light-spot projector 43 to be directed on to the component. A conical bore 45 co-operates with a guide cone 46 of the rocker 26 to dispose the capillary 6 over the projected light spot which may be observed using a stereomicroscope 4. The table 34 is then locked and bonding can occur. The rocker 26 is then pivoted upwardly and cone 46 enters bore 45 and when centrally aligned the capillary 6 is again above the light spot and the disc is indexed one step. Alternatively, a second perforated disc (49) with bores (51) may be utilized instead of the projector and individual operations of the machine can be controlled by a programme switching mechanism. This controls the time cycle of the discs, actuation of the rocker, reciprocal movement of the capillary, welding and severing operations &c. Linearly displaceable programme carriers may be used instead of perforated disc, and alternative types of co-operating guide members may be used.