Patent SG-11201901193U-A (SG)
Title: Wafer-level package with enhanced performance
Inventor: HATCHER JR
IPC: H01L23/31
Filed: 2017-08-14
Abstract: 2 • 0., 44( 0,1a ck44(1 ;OM 44(1 ), - 0 0 ig 8 * ti 52(2) 48 50 50 I I 52(2) 50 50 FIG. 'I ( 10 :in 41011 42 46 1-1 O cc O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 15 February 2018 (15.02.2018) WIP0 I PCT o n °nolo III ll VIII Immo mnio oimIE (10) International Publication Number WO 2018/031994 Al (51) International Patent Classification: H01L 23/31 (2006.01) H01L 21/60 (2006.01) H01L 21/56 (2006.01) (21) International Application Number: PCT/US2017/046744 (22) International Filing Date: 14 August 2017 (14.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/374,304 12 August 2016 (12.08.2016) US (71) Applicant: QORVO US, INC. [US/US]; 7628 Thorndike Road, Greensboro, North Carolina 27409 (US). (72) Inventors: HATCHER, JR., Merrill, Albert; 5607 Old Fox Trail, Greensboro, North Carolina 27407 (US). HAM- MOND, Jonathan, Hale; 5808 Autumn Gate Drive, Oak Ridge, North Carolina 27310 (US). CHADWICK, Jon; 1907 Efland Drive, Greensboro, North Carolina 27408 (US). COSTA, Julio, C.; 6601 Ashton Park Drive, Oak Ridge, North Carolina 27310 (US). VANDEMEER, Jan, Edward; 279 Weatherfield Lane, Kernersville, North Car- olina 27284 (US). (74) Agent: WITHROW, Benjamin, S.; Withrow & Terrano- va, P.L.L.C., 106 Pinedale Springs Way, Cary, North Car- olina 27511 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (54) Title: WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE (57) : The present disclosure relates to a wafer-level package that includes a first thinned die (12), a multilayer redistribution structure (18), a first mold compound (20), and a second mold compound (22). The first thinned die resides over a top surface of the multilayer redistribution structure. The multilayer redistribution structure includes at least one support pad (52(1)) that is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first thinned die. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening (54) within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die. [Continued on next page] WO 2018/031994 Al 1111111111111111111010101111101111101111111111110111111111111111111111111110111111111111 OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) with amended claims and statement (Art. 19(1))