baber/WOPTO huggingface dataset:
Patent JP-5347153-B2 (JP)
IPC: B62D1/06
Filed: 2005-07-29
Granted: 2013-11-20
Abstract: The present invention concerns a steering control for vehicles such as automobiles or motorcycles in the form of a steering wheel or of a handlebar, with a gripping zone presenting an elastically variable geometry deformable under the action of the hand or the hands of the driver gripping the steering control fast and forcefully in case of danger, and thus of panic, in such a manner that a hydraulic or pneumatic sensor located inside the gripping zone is activated.  According to the present invention the sensor (8,, 16) extends over essentially the whole zone of the steering control (1) that can be gripped by at least one hand of the driver, and consists of a tube (9, 17) of elastic material, filled with a liquid, and embedded entirely in a foamed plastic material (6).  The advantages of the present invention are seen in the high effectiveness and reliability of the safety device, in the elimination of potential danger caused by mistaken reactions of the driver, and in the economic feasibility of the inventive device.
Patent JP-4719540-B2 (JP)
IPC: H04L12/14
Filed: 2005-09-15
Granted: 2011-07-06
Abstract: The present invention discloses a method and device for detecting connectivity termination in an IPv6 access network based on a DHCP service model. The method for detecting connectivity termination according to the invention comprises the steps of: creating an entry of the subscriber connectivity cache list corresponding to the subscriber terminal in the access node when the IPv6 connectivity between the subscriber terminal and the access node is established successfully; querying the entry of the neighbor cache list corresponding to the subscriber terminal based on the polling time set in the entry of the subscriber connectivity cache list; deciding whether the connectivity of the subscriber terminal is normal based on the entry information corresponding to the subscriber terminal of the subscriber connectivity cache list and neighbor cache list; and performing termination processing on the connectivity of the subscriber terminal logging off abnormally.
Patent JP-4872291-B2 (JP)
IPC: H05K3/32
Filed: 2005-09-27
Granted: 2012-02-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrode connection method and an electrode connection device capable of improving connection reliability between electrodes when connecting the electrodes formed on each of a plurality of members to be joined, by performing heating/pressurizing processing via an adhesive among the plurality of the members to be joined.  <P>SOLUTION: In an electrode connection method where there are connected first and second circuit electrodes 5, 6 therebetween, the electrodes are formed on a rigid wiring board 14 and the flexible wiring board 2, respectively, by performing heating/pressurizing processing with a head 4 via an anisotropic conductive adhesive 3 between the rigid wiring board 14 and the flexible wiring board 2, and a deformable resin sheet 9 is interposed between the head 4 and the flexible wiring board 2 for the heating/pressurizing processing by the head 4.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-4720438-B2 (JP)
IPC: H01L21/607
Filed: 2005-11-01
Granted: 2011-07-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor bump connection structure wherein appropriate connection can be ensured without using flux, the contact area of a solder bump with an electrode of an electronic part can be controlled to be specified at all times, and no shortcircuiting among the bumps occurs during reflow and of which a connection portion is superior in reliability, and to provide its manufacturing method.  <P>SOLUTION: In a flip-chip connection structure wherein an electrode 2 of a first electronic part and an electrode 6 of a second electronic part are connected by a solder bump 3, metal compound layers 4 and 7 are formed on a bonding boundary between the electrodes 2 and 6 of the solder bump 3, and a narrow part 10 is formed on the side surface of the solder bump 3, namely, on a host-phase side adjacent to an intermetallic compound layer in at least one bonding part on the sides of the first and second electronic parts. The narrow part 10 reduces stress generating due to the difference of thermal expansion coefficients, on the side of the solder host phase.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-4081489-B2 (JP)
IPC: C12P21/08
Filed: 2003-11-12
Granted: 2008-04-23
Abstract: The present invention provides an antibody prepared using a peptide as an antigen, the peptide having 8 to 30 amino acid residues selected from an amino acid sequence at positions 1 to 68 of human high-molecular-weight CD14, or an antibody that binds to a peptide having a specific amino acid sequence at a position among the positions 1 to 68. An assay kit for human low-molecular-weight CD14 using the antibody and an assay method of the present invention, preferably a sandwich method, are able to quantitatively or qualitatively determine human low-molecular-weight CD14 with high sensitivity and specificity in a simple manner, so that they are useful for the diagnosis of a patient suffering from sepsis.
Patent JP-4493599-B2 (JP)
IPC: A61B17/58
Filed: 2003-10-14
Granted: 2010-06-30
Abstract: The immobilization device for a connecting rod (2) in an osseous anchoring element (3) of a rachidian implant (4) comprises an osseous anchoring implant (3) comprising retaining means (14, 15) adapted to deform elastically under a pressure force F and a blocking element (5) comprising on the one hand lugs (33, 34) which coact with the retaining means (14, 15) to permit the securement of the blocking element (5) on the osseous anchoring element (3), and on the other hand, a tightening screw (31) permitting immobilizing in rotation and in translation the connecting rod (2) between the osseous anchoring element (3) and the blocking element (5).
Patent JP-4765673-B2 (JP)
IPC: H01L21/60
Filed: 2006-03-02
Granted: 2011-09-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic device which is low-profile and is stably manufactured without damaging its IC chip, and to provide its manufacturing method.  <P>SOLUTION: The electronic device is composed of an IC chip 14 which has a pad 16 on the component side on its top and is arranged on a package base 20, a pad 26 on the base side which is arranged on the package base 20, a conductive bump 40 which is arranged on the pad 26 on the base side, and a wire 42 which is arranged between the pad 16 on the component side and the bump 40 for conduction of electricity between them. Further, when the bump 40 is multitiered, the lowermost bump 40 on the pad 26 on the base side can be bonded to the pad 26 on the base side more firmly than the other bumps 40.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-5021224-B2 (JP)
IPC: B63B29/02
Filed: 2006-03-20
Granted: 2012-09-05
Abstract: Passenger ship, in particular a cruise ship, which extends over several decks (1, 2) equipped with a plurality of cabins (3) and fitted out with service rooms and premises for public use. The cabins (3) are structurally connected in pairs in the form of assemblies (4) provided with two parallel side walls (5) and a dividing wall (6) arranged so as to separate the two cabins (3) and having at least two non-aligned sections (7, 8) substantially parallel to the side walls (5) and each facing a bed (L) of a corresponding cabin (3) and at least partially offset with respect to a mid-plane (M) of the assembly (4), parallel to the two side walls (5). By so doing the volume of one cabin penetrates inside the volume of the other cabin, allowing a reduction in the overall width of the cabins. The assemblies (4) are arranged on each deck along the two flanks of the ship with the side walls (5) alongside each other.
Patent JP-4697068-B2 (JP)
IPC: H04W88/06
Filed: 2006-06-27
Granted: 2011-06-08
Abstract: A wireless communication system includes a first communication station configured to operate according to a first communication protocol, and a second communication station capable of operating according to both the first communication protocol and a second communication protocol. When the second communication station transmits a packet according to the second communication protocol, at least a first signal field compliant with the first communication protocol and a second signal field compliant with the second communication protocol are attached to a header of the packet, and the first signal field includes a parity bit. When the second communication station receives a packet from another communication station, the second communication station performs a parity check on the first signal field of the packet, and when no parity error is detected, the second communication station further checks whether content of the first signal field is compliant with the first communication protocol.
Patent JP-5154036-B2 (JP)
IPC: C09D5/00
Filed: 2006-07-18
Granted: 2013-02-27
Abstract: Preparing metal compound of an azo compound optionally containing a guest compound comprises preparation taking place in the presence of seed crystals. Preparing metal compound of an azo compound of formula (I) optionally containing a guest compound comprises preparation taking place in the presence of seed crystals. Rings X and Y may each carry one or two substituents including =O, =S, =NR 7, -NR 6R 7, -OR 6, -SR 6, -COOR 6, -CN, -CONR 6R 7, -SO 2R 8, -N(R 6)-CN, (cyclo)alkyl, aryl, and aralkyl. The sum of the endocyclic and exocyclic double bonds for each of rings X and Y is 3. R 6H, (cyclo)alkyl, aryl, or aralkyl; R 7H, cyano, (cyclo)alkyl, aryl, aralkyl, or acyl; R 8(cyclo)alkyl, aryl or aralkyl; R 1-R 4H, (cyclo)alkyl, aryl, or aralkyl which may form 5- or 6-membered rings, to which further rings may be fused; R 5-OH, -NR 6R 7, (cyclo)alkyl, aryl, or aralkyl; and m, n, o, p : 1 or 0 (when double bonds start from the ring N atoms on which R 1-R 4 are located). In the substituents for R 1-R 8 that contain CH groups, the hydrogen atoms in the CH groups may be substituted. Independent claims are also included for: (1) metal compounds of the azo compound of formula (I) or its host-guest compound of further different compound(s), having a Brunauer-Emmett-Teller (BET) specific surface area of >=180 m 2>/g; (2) photoresist comprising photocurable monomer(s), photoinitiator(s) and metal compound(s) or host-guest compound(s); (3) color filter comprising metal compound(s) or host-guest compound(s); (4) liquid crystal display comprising color filter(s); (5) process for producing color filters in liquid crystal displays comprising the use of the metal compounds or host-guest compounds; (6) process for preparing pigment formulations comprising mixing metal compound or host-guest compound and dispersant; (7) a process for preparing printing inks, distempers or binder colors, for the mass coloring of synthetic, semi-synthetic or natural macromolecular substances, for the spin dyeing of natural, regenerated or artificial fibers, and also for printing textiles and paper comprising using the metal compound, host-guest compound or pigment formulations; and (8) a process for manufacturing laminates, color filters in liquid crystal displays, or inkjet printing comprising applying metal compounds, host-guest compounds or the pigment formulations. [Image].
Patent JP-5125060-B2 (JP)
IPC: H01L33/62
Filed: 2006-11-02
Granted: 2013-01-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high performance and highly reliable light-emitting device by achieving both effects, i.e., enhancement of light intensity and high precision mounting of a light-emitting element without alignment deviation as to the trade-off relation between the reduction of light loss caused by an insulating substrate and the prevention of alignment deviation.  <P>SOLUTION: This light-emitting device comprises a light-emitting element 3 having a metal film formed on its bottom, and a metal member 2 on which the light-emitting element 3 is mounted and which surrounds the periphery of the light-emitting element 3. The metal member 2 and the metal film of the light emitting element 3 are bonded together with a die bond member consisting of metal. A region (exposure region) 1b having wettability to the die bond member lower than that to the bonding region of the die bond member is arranged under the light-emitting element 3 and in the periphery of the die bond member.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-5140996-B2 (JP)
IPC: C09J9/02
Filed: 2006-11-13
Granted: 2013-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide an adhesive composition which allows a fairly rapid curing at a low temperature and stably yields properties such as bonding strength and connection resistance and a circuit connection material, a connection structure of circuit members and a semiconductor device using the adhesive composition.  <P>SOLUTION: The adhesive composition comprises a compound having a carbon-carbon double bond in the molecule, a compound having not less than 2 mercapto groups in the molecule and a radical polymerization initiator.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-5039365-B2 (JP)
IPC: B66C13/08
Filed: 2006-11-17
Granted: 2012-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a skew swing stopping device of a crane capable of quickly stopping the swing of a lifted load by suppressing hunching.  <P>SOLUTION: This skew swing stopping device of the crane comprises mechanical swing stopping ropes 25a-25d having one end secured to a spreader 16 and the other end guided by a trolley 13 for suspending the spreader 16, and wound up by a swing stopping rope drum 26 installed on the trolley 13, a swing stopping rope length adjusting device 29 for suppressing the skew of the spreader 16 by adjusting the lengths of the swing stopping ropes 25a-25d, and a control part for controlling the swing stopping rope length adjusting device 29 according to conditions of a suspended cargo lifted by the spreader 16. The control part calculates the frequency of the skew swing of the suspended cargo from the skew displacement of the suspended cargo, and generates a control signal for the swing stopping rope length adjusting device 29 according to the frequency.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-5054359-B2 (JP)
IPC: H01L21/8234
Filed: 2006-12-01
Granted: 2012-10-24
Abstract: A semiconductor integrated circuit relating to one aspect of the present invention includes a power transistor, at least one or more of first metal patterns functioning as a first electrode of the power transistor and at least one or more of second metal patterns functioning as a second electrode of the power transistor formed in an interlayer insulation film on the transistor, at least one or more of first busses electrically connected to a corresponding first metal pattern of the at least one or more of the first metal patterns, a single second bus electrically connected to the at least one or more of second metal patterns, and a contact pad provided to each of the at least one or more of first busses and the single second bus.
Patent JP-5335189-B2 (JP)
IPC: B21B3/00
Filed: 2006-12-08
Granted: 2013-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide an aluminum alloy sheet for a cap, which can prevent the cap from popping out from a bottle type can even when the bottle type can is filled with hot drink and is heated.  <P>SOLUTION: This aluminum alloy sheet comprises, by mass%, 1.61 to 1.9% Mg, 0.05% or less Cu, 0.1% or less Mn, 0.05% or less Cr, 0.2% or less Zn, 0.3% or less Si, 0.05 to 0.4% Fe, and 0.2% or less Ti. The base aluminum alloy sheet has a tensile strength of 202 to 235 MPa, a yield strength of 171 to 200 MPa, and an elongation of 7 to 12%. The ear formed at an opening part of a cup made by a deep drawing test is a hexagonal ear having ears in six parts in 0° directions and 45° directions with respect to a rolling direction, or an octagon ear having ears in eight parts in 0° directions, 45° directions and 90° directions with respect to the rolling direction; and shows an earing rate of 1.5% or less when a drawing ratio is 1.97. The aluminum alloy sheet shows a tensile strength of 202 to 235 MPa, a yield strength of 160 to 195 MPa and an elongation of 7 to 12%, after having been baked.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-4477624-B2 (JP)
IPC: A61F2/958
Filed: 2004-03-17
Granted: 2010-06-09
Abstract: A self-inflating, intragastric balloon device (1) is activated by addition of an activating liquid into an acid or water soluble receptacle (b) located within the bladder (2). After an approximately pre-determined time period post-activation, the activating liquid breaches the receptacle wall and causes contact between an acid in liquid form and an emissive substance within the bladder, causing it to inflate. The device is conveniently provided to medical personnel as part of a kit that further contains a syringe and the activating liquid. The device also can have acid or pepsin degradable portions that cause it to deflate after residing in the stomach for a prolonged period of time during which it imparts a feeling of satiety in the patient.
Patent JP-4745224-B2 (JP)
IPC: C12N1/19
Filed: 2004-06-23
Granted: 2011-08-10
Abstract: A polypeptide dimer (I) comprises two soluble glycoprotein (gp) 130 molecules, where at least one of the gp130 molecules is covalently linked to polyethylene glycol (PEG). Independent claims are also included for: (1) a polynucleotide (II) encoding (I) or a monomer of (I); (2) an expression vector (III) containing (II); (3) a host cell (IV) containing (III); (4) producing (I); and (5) pharmaceutical composition (V) containing (I). ACTIVITY : Osteopathic; Cardiovascular-Gen.; CNS-Gen.; Gastrointestinal-Gen.; Immunomodulator; Cytostatic; Immunosuppressive; Antiinflammatory; Antibacterial; Virucide. MECHANISM OF ACTION : Calcium antagonist; Inhibitor of interleukin-6 (IL-6)/soluble IL-6 receptor (sIL6R) complex. Lamina propria mononuclear cells (LPMC) were cultured in complete medium consisting of RPMI-1640 with 3 mM L-glutamine, 10 mM HEPES buffer, 10 Microg/ml gentamycin, 100 U/ml penicillin, 100 U/ml streptomycin, 50 MicroM 2-mercaptoethanol and 10% heat-inactivated FCS. Cells were stimulated with 10 Microg/ml C reactive protein, 50 ng/ml phorbol-12-myristate-13-acetate (PMA) and 10 Microg/ml phytohaemagglutinin (PHA) in the presence or absence of sgp130Fc, neutralizing IL-6R specific antibody or sgp130PEG. After 48 hours cells were stained with Annexin V and propidium iodide and analyzed by fluorescence activated cell sorting (FACS). Unreacted samples contained approximately 60% apoptotic cells whereas treatment with anti-IL-6 antibody, sgp130Fc or sgp130PEG resulted in an increase of apoptotic cells between 11-16%. Similarly, the ability of sgp130PEG to inhibit IL-6/IL-6R dependent proliferation of BAF/3 cells and IL-6 induced signal transducer and activator of transcription (STAT3) activation in BAF/gp130 cells was studied. The results showed that the sgp130PEG treatment inhibited IL-6/IL-6R dependent proliferation of BAF/3 cells at a factor of 1.5-3 compared to sgp130Fc, and reduced the STAT3 activity with approximately 2-3 fold higher efficiency than sgp130Fc.
Patent JP-4848272-B2 (JP)
IPC: G06F3/06
Filed: 2004-06-17
Granted: 2011-12-28
Abstract: An arrangement of apparatus for safely writing data and parity to multiply-redundant storage comprises a first storage component operable to store at least a first mark in a storage device to index uniquely a pattern to be written by at least a data write; a write component operable to perform the at least data write; a further storage component operable to overwrite a mark in the storage device with at least a further mark to index uniquely a pattern to be written by a parity write; and a further write component operable to perform the parity write. Preferably, the first storage component comprises a second storage component operable to overwrite said at least first mark in said storage device with a second mark to index a pattern to be written by a first parity write; and the write component is further operable to perform the first parity write.
Patent JP-4498356-B2 (JP)
IPC: G06F12/08
Filed: 2004-07-23
Granted: 2010-07-07
Abstract: An advanced telecommunications processor comprises a plurality of multithreaded processor cores each having a data cache and instruction cache. A data switch interconnect is coupled to each of the processor cores and configured to pass information among the processor cores. A messaging network is coupled to each of the processor cores and a plurality of communication ports. In one aspect of the invention, the data switch interconnect is coupled to each of the processor cores by its respective data cache, and the messaging network is coupled to each of the processor cores by its respective instruction cache. Advantages of the invention include the ability to provide high bandwidth communications between computer systems and memory in an efficient and cost-effective manner.
Patent JP-5230939-B2 (JP)
IPC: B23Q11/10
Filed: 2004-10-21
Granted: 2013-07-10
Abstract: A device for producing an aerosol, comprising a liquid line for a liquid flow and a transport gas line for a transport gas flow, comprising at least one injector unit wherein the liquid flow and transport gas flow can be mixed to form an aerosol, also comprising an aerosol line leading to an aerosol discharge arranged in the region of a tool, is known per se. According to the invention, the injector unit comprises flow guiding means for the transport gas flow which define a pressure loss for the transport gas flow, which is lower than the minimum possible pressure loss at the aerosol discharge, by increasing the flow speed and reducing the volume flow. The invention can be used to supply lubricating agents to machine tools.
Patent JP-4448145-B2 (JP)
IPC: E04F13/08
Filed: 2004-12-30
Granted: 2010-04-07
Abstract: The panels are electronic circuit boards (4), with their tracks facing the exterior. They include holes for component attachment, and an epoxy resin substrate. The panels may be populated with light emitting diodes.
Patent JP-5087287-B2 (JP)
IPC: B41J2/44
Filed: 2007-01-19
Granted: 2012-12-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus which can easily and surely regulate an interval between a photo-conductor and a writing head without adjustment by a positioning mechanism between related parts by a simple constitution.  <P>SOLUTION: On the bottom surface of a writing head holder 7, an input terminal 91a and an output terminal 91b which are respectively made of a conductive member are installed on both ends. In the meantime, at locations corresponding to the input terminal 91a and the output terminal 91b on the top surface of the writing head 6, a second terminal 9b made of a conductive member is installed. When a main body cover 2 is properly closed, the input terminal 91a and the output terminal 91b come into contact with the second terminal 9b, and the input terminal 91a and the output terminal 91b are electrically connected through the second terminal 9b. At the same time, the writing head 6 comes into contact with the photo-conductor contact member 10, and the interval between the photo-conductor 4 and the writing head 6 is properly maintained. Thus, the writing of a latent image to the photo-conductor 4 under a focal state becomes possible.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-5352872-B2 (JP)
IPC: B24B37/00
Filed: 2007-03-15
Granted: 2013-11-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a polishing composite particle, which efficiently produces a polishing composite particle stably supporting an abrasive grain on the surface of a carrier particle.  <P>SOLUTION: The method for producing a polishing composite particle comprises feeding a carrier particle and an abrasive grain to a chamber (11) forming a thermal plasma (21) and supporting one or more kinds of abrasive grains on the surface of the carrier particle.  <P>COPYRIGHT: (C)2008,JPO&INPIT