baber/WOPTO huggingface dataset:
Patent TW-202202586-A (TW)
Title: Die-bonding film and dicing die-bonding film
Inventor: HATAKEYAMA YOSHIHARU
IPC: C09J7/30
Filed: 2021-05-14
Abstract: A dicing die bond film according to the present invention is a die bond film including an acrylic resin, a phenol resin, and a filler, wherein the filler has a specific surface area of 5 m2/g or more and 100 m2/g or less, and a content mass ratio of the filler to the acrylic resin is more than 0 and 1.50 or less.
Patent TW-202222599-A (TW)
Title: Additive printing method for printing a functional print pattern on a surface of a three-dimensional object, associated computer program and computer-readable medium
Inventor: STADNIK ALAN PAUL
IPC: B41J3/407
Filed: 2021-06-17
Abstract: The present invention relates to an additive printing method for printing a functional print pattern on a surface of a three-dimensional object 100, an associated computer program and computer-readable medium having stored there on the computer program. The method comprises the steps of (i) providing a three-dimensional object 100 on a planar surface 10; (ii) providing a print head 200A having a plurality of print nozzles 200A1-200An, the plurality of print nozzles 200A1-200An defining at least one print nozzle plane 20, the print nozzle plane 20 being non-parallel to the planar surface 10; (iii) generating three-dimensional geometrical surface data of an exposed surface of the object 100 on the planar surface 10; (iv) generating two-dimensional geometrical surface data of the exposed surface of the object 100 on the planar surface 10 on the basis of the three-dimensional geometrical surface data; (v) determining an amount of printing fluid to be discharged at a discharge time from each of the plurality of print nozzles 200A1-200An; (vi) generating a relative movement between the object 100 and the print head 200A; and (vii) printing a print pattern on at least one portion of the exposed surface of the object 100 during the relative movement. The step of generating the two-dimensional geometrical surface data includes the step of projecting the two-dimensional geometrical surface data into the print nozzle plane 20 to correct distortions present in the two-dimensional geometrical surface data due to the print nozzle plane 20 being non-parallel with the planar surface 10, thereby obtaining two-dimensional print nozzle plane data of the object 100.
Patent TW-202304138-A (TW)
Title: Sweep voltage generator and display panel
Inventor: KAO CHENG-KAI
IPC: H03K4/08
Filed: 2021-07-02
Abstract: A sweep generator circuit including a ramp generation 
circuit and a buffer stage is provided. The ramp generation circuit receives a reset signal, a first scan signal and a second scan signal which is inverted from the first scan signal, to provide a sweep reference voltage. The buffer stage receives the sweep reference voltage to provide a sweep signal in response to the sweep reference voltage. When the reset signal is disabled, the sweep signal drops from a preparation level to a stop level with time, and the first scan signal and the second scan signal determine the slope of the sweep signal.
Patent TW-202221153-A (TW)
Title: Method of forming metal pattern and method of manufacturing metal mask for vapor deposition
Inventor: ISHIZAKA SOJI
IPC: C23C14/04
Filed: 2021-07-07
Abstract: Provided is a method for forming a metal pattern, said method including: a step for preparing a layered body having a negative photosensitive resin layer on a substrate; a step for radiating light from the side of the negative photosensitive resin layer that is opposite the side on which the substrate is provided, the light having a component that is obliquely incident to the thickness direction of an exposure mask, and conducting pattern exposure of the negative photosensitive resin layer via the exposure mask; a step for developing the pattern-exposed negative photosensitive resin layer and forming a resin pattern having a tapered shape; and a step for forming a metal pattern having a tapered shape corresponding to the shape of the resin pattern. Also provided is a method for manufacturing a deposition metal mask having a metal pattern obtained through the above method for forming a metal pattern.
Patent TW-202305075-A (TW)
Title: Forming method for airtight structure of electroacoustic device and airtight structure thereof providing an automatic dispensing device for dispensing and pre-curing one of the two semi-housings
Inventor: WU TAN-CHIH
IPC: H04R31/00
Filed: 2021-07-23
Abstract: Provided are a forming method for an airtight structure of an electroacoustic device and an airtight structure thereof. The electroacoustic device is provided with a housing, and the housing is composed of at least two semi-housings and is provided with at least one airtight area. While performing the method, an automatic dispensing device is provided for dispensing and pre-curing one of the two semi-housings, a dispensing head of the automatic dispensing device moves on a tank in the airtight area of the semi-housing and provides a photocurable adhesive for the tank, a pre-curing head of the automatic dispensing device moves along a trajectory of the dispensing head and provides a curing ray, and the curing ray is temporarily irradiated. Then, the semi-housing is put into a photocuring device, the photocurable adhesive is completely converted into a solid-state elastomer for combining the semi-housing with the other semi-housing, and a pressing wall of the other semi-housing presses against the elastomer in the tank, so that the airtight structure of the electroacoustic device is achieved.
Patent TW-202232079-A (TW)
Inventor: ANDRES SEBASTIAN
IPC: G01N23/2252
Filed: 2021-11-02
Abstract: 一種用於對半導體晶圓表面上的未知顆粒進行分類的方法，包括：將具有已知化學組成和不同尺寸的顆粒施加至測試晶圓，確定多個具有已知化學組成的顆粒的尺寸，並且記錄多個具有已知化學組成的顆粒的能量色散X射線光譜儀的光譜，隨後由這些光譜分別確定實質含量，並擬合具有已知化學組成的顆粒的尺寸和實質含量的最佳擬合曲線；此外，確定未知顆粒的顆粒尺寸並記錄未知顆粒的能量色散X射線光譜儀的光譜，並由此確定半導體晶圓上的未知顆粒的實質含量，以及根據將未知顆粒的實質含量和尺寸與最佳擬合曲線比較的結果，將未知顆粒分類。
Patent TW-202233597-A (TW)
Title: A stable crystalline hydrate of clazosentan disodium salt
Inventor: RAGER TIMO
IPC: A61K31/506
Filed: 2021-11-04
Abstract: The present invention relates to a stable hydrate of clazosentan disodium salt, pharmaceutical formulations manufactured using the same and their use as medicaments.
Patent TW-202230175-A (TW)
Inventor: Zhuang shi-jie
IPC: G06F21/44
Filed: 2021-11-10
Abstract: 本發明關於一種授權認證、軟體開發套件生成方法、電子設備及電腦可讀儲存介質，其中，該授權認證方法包括：回應於目標應用對軟體開發套件的啟動指令，獲取目標應用的標識資訊；基於目標應用的標識資訊和授權應用的標識資訊進行授權認證，得到認證結果；向軟體開發套件中的至少兩個目標開發工具發送認證結果，以使至少兩個目標開發工具在認證結果為認證通過的情況下，針對目標應用啟動調用功能。利用本發明實施例提供的技術方案可以降低授權認證的性能損耗和認證維護成本。
Patent TW-202325384-A (TW)
Title: Tail gas treatment equipment capable of reducing concentration of nitrogen oxide byproducts including a waste gas delivery pipe, a hydrogen peroxide nozzle and a heating portion
Inventor: LI JIAN-LIN
IPC: B01D53/56
Filed: 2021-12-23
Abstract: Disclosed is tail gas treatment equipment capable of reducing the concentration of nitrogen oxide byproducts, which is suitable for treating waste gases and includes a waste gas delivery pipe for delivering waste gases, a hydrogen peroxide nozzle arranged on the waste gas delivery pipe and spraying hydrogen peroxide into the waste gas delivery pipe to mix the hydrogen peroxide with the waste gases, and a heating portion in fluid communication with the waste gas delivery pipe and making the waste gas undergo a pyrolysis reaction to produce nitrogen oxide byproducts, wherein the hydrogen peroxide promotes the water solubility of the nitrogen oxide byproducts to reduce the concentration of the nitrogen oxide byproducts.
Patent TW-202327433-A (TW)
Title: Structure of uniform temperature heat dissipation device
Inventor: CHANG CHIN-FENG
IPC: H05K7/20
Filed: 2021-12-28
Abstract: The present invention provides a structure of uniform temperature heat dissipation device. A heating element is arranged on one of a substrate, a heat conducting sheet is correspondingly arranged on one of the heating elements, and a heat conducting element is correspondingly arranged on one of the heat conducting sheets. Above, and the heat-conducting component includes an outer casing and a heat-conducting casing. The outer casing is disposed above one of the heat-conducting sheets, the heat-conducting casing is disposed inside one of the outer casings, and an inner side of the heat-conducting casing the heat-dissipating fluid uses the heat-dissipating fluid to flow on the inner side of the heat-conducting shell to quickly conduct heat from the heating element, and then a first heat-dissipating element and a limiting groove are used to cover the outer shell.
Patent TW-202235683-A (TW)
Title: Wet etching solution and wet etching method
Inventor: TANIGUCHI TAKAHISA
IPC: H01L21/306
Filed: 2022-01-07
Abstract: A wet etching solution according to the present disclosure is used, with respect to a semiconductor substrate which includes both a first metal layer that comprises a tungsten-based material and a second metal layer that comprises cobalt and/or a bronze-based material and in which an oxide layer is formed at least on the surface layer of the cobalt and/or the bronze-based material, for selectively removing the second metal layer while suppressing etching of the first metal layer. The etching solution comprises a solution obtained by dissolving into an organic solution a [beta]-diketone in which a trifluoromethyl group and a carbonyl group are bonded.
Patent TW-202331973-A (TW)
Title: Semiconductor package device capable of improving side solderability and manufacturing method thereof capable of improving the soldering quality between the semiconductor package device and the circuit board
Inventor: HE ZHONG-XIONG
IPC: H01L23/498
Filed: 2022-01-21
Abstract: Provided is a semiconductor package device capable of improving side solderability, which includes a chip, a plastic sealing layer covering the chip, and a conductive layer formed on a part of the plastic sealing layer. The distribution position of the conductive layer is designed according to the pin positions of the chip, wherein the completed conductive layer is electrically connected to the signal contacts of the chip so as to constitute the pins of the semiconductor package device, and each pin is exposed to the plastic sealing layer and forms a recessed-inwardly stepped surface. The shape of the stepped surface is determined according to a first photoresist layer and a second photoresist layer overlapped in the manufacturing process. When the semiconductor package device is to be soldered on a circuit board, the stepped surface of each pin can be used for solder adsorbing and filling, thereby improving the soldering quality between the semiconductor package device and the circuit board, and allowing an optical detection device to determine the soldering status of each pin.
Patent TW-202331491-A (TW)
Title: 電子裝置及其操作方法
Inventor: CHEN CHUN-HUNG
IPC: G06F3/048
Filed: 2022-01-25
Abstract: 一種電子裝置及其操作方法，用以調整功能鍵的組態設定。此操作方法包括下列步驟。按下一設定鍵，讀取一第一功能鍵設定檔，第一功能鍵設定檔用以儲存第一組態，以供顯示第一組態的功能鍵的提示畫面。按下設定鍵及一切換鍵，讀取一第二功能鍵設定檔，第二功能鍵設定檔用以儲存與第一組態不同的第二組態，以供顯示第二組態的功能鍵的提示畫面。
Patent TW-202331188-A (TW)
Title: Manufacturing method of thermal module
Inventor: LIN SHENG-HUANG
IPC: F28F9/18
Filed: 2022-01-28
Abstract: A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the problem of the conventional manufacturing method of thermal module that the aluminum heat conduction component can be hardly welded and connected with other heat conduction components made of heterogeneous materials and the same material is improved.
Patent TW-202337097-A (TW)
Inventor: CHEN YING-CHUNG
IPC: H01R13/6469
Filed: 2022-03-11
Abstract: An electrical connector and its manufacturing method and an upper-layer oblique insertion assembly stand and its an assembly method thereof. The provided electrical connector and the upper-layer oblique insertion assembly stand can provide shielding to conductive terminals through a shielding body to reduce the interference of the signal transmission of the conductive terminals, and achieve electrical connection between some conductive terminals on the electrical connector, and suppress the coupled crosstalk interference when transmitting high-speed signals. Therefore, the electrical connector and the upper-layer oblique insertion assembly stand of the present application can meet the customized requirements of the electrical connector for transmitting high-speed signals. In addition, the components of the electrical connector of the present application are assembled by oblique insertion, which can reduce the height dimension of the electrical connector, thereby reducing the internal space occupied by the electrical connector of the electronic device, so that the electronic device can continue to develop in the direction of light, thin and short.
Patent TW-202336717-A (TW)
Inventor: HSIA Kuang-Te
IPC: G09F9/30
Filed: 2022-03-14
Abstract: 一種顯示裝置包含顯示基板、電路板、至少一導電墊、至少一第一雙面膠帶、至少一導電泡棉膠帶以及蓋板。顯示基板具有彼此鄰接之第一區域以及至少一第二區域。電路板至少部分設置於第一區域。導電墊設置於電路板背向顯示基板之第一表面。第一雙面膠帶設置於第二區域。導電泡棉膠帶設置於第一雙面膠帶及導電墊上。蓋板包含透光基板以及至少一導電層。透光基板包含朝向顯示基板的第二表面。導電層至少部分覆蓋第二表面。導電泡棉膠帶電性連接導電層與導電墊。
Patent TW-202331510-A (TW)
Inventor: YANG MING-HSUN
IPC: G06F9/445
Filed: 2022-04-07
Abstract: This invention provides an IHS, a method for deploying the IHS, and a computer implemented method for enabling an information handling system to be operated with multiple environments. File system attributes in the virtual image files are included in the EFI bootloader to check if a child virtual image file is failed before the operating system in the child virtual image file is loaded.
Patent TW-202301432-A (TW)
Title: Molding apparatus, molding method, and product manufacturing method
Inventor: OTA SHUNSUKE
IPC: G11B5/84
Filed: 2022-05-23
Abstract: Curing processing for curing a curable composite is performed in a state where a mold held by a mold holding unit and a substrate held by a substrate holding unit are in contact with each other through a curable composite, and mold release processing of the mold from the substrate is performed after the curing processing. In a case where the mold release processing fails, additional curing processing is performed. This enables releasing the mold even without performing recovery processing by an operator, thereby making it possible to provide a molding apparatus that is beneficial in productivity.
Patent TW-202326938-A (TW)
Title: Method of manufacturing semiconductor structure
Inventor: MIN WEI-LUN
IPC: H01L21/762
Filed: 2022-06-29
Abstract: A method includes providing a substrate including a first semiconductor layer over a dielectric layer, thinning the first semiconductor layer, forming a stack of alternating second semiconductor layers and third semiconductor layers over the thinned first semiconductor layer, forming a fin active region protruding from the substrate including a portion of the thinned first semiconductor layer and the stack of alternating second semiconductor layers and third semiconductor layers, forming isolation features over an exposed portion of the dielectric layer, forming a dummy gate stack over the fin active region, forming a source/drain (S/D) recess in the fin active region adjacent to the dummy gate stack, forming an epitaxial S/D feature in the S/D recess, removing the second semiconductor layers to form openings between the third semiconductor layers, and forming a metal gate stack in the openings and in place of the dummy gate stack.
Patent TW-202319831-A (TW)
Title: Substrate processing device and substrate processing method
Inventor: NAKAZAWA TAKASHI
IPC: G03F1/22
Filed: 2022-07-05
Abstract: This substrate processing device comprises an ultraviolet irradiation unit, a holding part, and a liquid supply part. The ultraviolet irradiation unit radiates ultraviolet radiation onto a surface of a substrate having a tungsten film and a titanium nitride film formed on said surface, thereby forming an oxide film on the surface of the substrate. The holding part holds the substrate. The liquid supply part supplies a chemical solution to the surface of the substrate held by the holding part, removes the oxide film by using the chemical solution, and selectively etches the titanium nitride film with respect to the tungsten film by using the chemical solution.
Patent TW-202307941-A (TW)
Title: Inspecting apparatus
Inventor: KIMURA NOBUYUKI
IPC: B23K26/00
Filed: 2022-07-19
Abstract: An inspecting apparatus includes a table for supporting a workpiece thereon, a light applying unit for applying light to the workpiece supported on the table, and a light detector for detecting light reflected from the workpiece. The light detector includes a camera and a diffusion plate disposed between the table and the camera.
Patent TW-202246798-A (TW)
Title: Optical sensing apparatus
Inventor: GOH TECK-CHAI
IPC: G01S17/02
Filed: 2020-06-22
Abstract: An optical sensing apparatus is provided and includes a circuit board, a signal emitter and a signal receiver are disposed on the circuit board, respectively. A package structure covers the signal emitter and the signal receiver and divided thereof by a first opening, and provided a second opening on top of the signal receiver. The scattering path of the light generated by the signal emitter is changed by the first opening and the second opening to decrease probabilities that the light generated by the signal emitter is directly transmitted to the signal receiver. The sensing accuracy of the optical sensing apparatus is increased to reduce the effect of the crosstalk.
Patent TW-202314960-A (TW)
Inventor: PETERSON BRENNAN
IPC: H01L21/762
Filed: 2022-08-25
Abstract: 本發明係關於一種微製造之方法，其包括在一基體上提供一第一浮雕圖案，在該第一浮雕圖案上形成含碳側壁間隔件，移除該第一浮雕圖案，以及用一溶解度轉變劑塗佈該等含碳側壁間隔件。接著，該方法包括在該等含碳側壁間隔件上沈積一第一聚合物填充物；使該溶解度轉變劑擴散一預定距離至該第一聚合物填充物中以提供該第一聚合物填充物之一溶解度轉變區，其中該第一聚合物填充物之該溶解度轉變區與該等含碳側壁間隔件接界；以及對該第一聚合物填充物進行顯影，使得該溶解度轉變區經溶解，從而在該等含碳側壁間隔件與該第一聚合物填充物之間提供溝槽，在該等溝槽中該基體之一部分經暴露。
Patent TW-202312104-A (TW)
Inventor: CHEN HSING-YU
IPC: G06T1/20
Filed: 2022-09-14
Abstract: A video processing method for detecting location(s), pixels, and skeleton(s) of one or more objects and an associated video processing circuit are provided. The video processing method may include: utilizing a backbone network in a predetermined model of a single deep learning network to receive and convert input image data having the object(s) into at least one feature map; and utilizing at least one instance head and a pixel head in the predetermined model of the single deep learning network to receive and convert the aforementioned at least one feature map into one or more object detection results, one or more instance segmentation results and one or more pose estimation results of the object(s).
Patent TW-202314454-A (TW)
Inventor: DING WEI
IPC: G06F3/03
Filed: 2022-09-21
Abstract: 本發明揭示一種輸入裝置，其包括一觸控板和一安裝托架，該托架由導電材料製成，並配置成將該觸控板固定在一電子系統中。該輸入裝置更包括一近場通訊(NFC)控制器、及一電介接該NFC控制器的天線。該天線包括一由該安裝托架的一部分形成之導電條。
Patent TW-202319650-A (TW)
Inventor: CAVAREC PIERRE-EMMANUEL
IPC: F04D19/04
Filed: 2022-09-22
Abstract: 渦輪分子真空泵(1)包含至少一個加熱棒(20)，加熱棒(20)具有至少一個固持零件(20a)及加熱零件(20b)及當加熱棒(20)通電時利用焦耳效應之加熱零件(20b)，此固持零件(20a)形成用於至加熱零件(20b)的電源線之包皮，至少一個連接管道(21)係至少部分地配置在用於固持零件(20a)的通過之真空泵(1)的高壓定子(19)中，加熱零件(20b)係沿著高壓定子(19)的至少一個螺旋溝槽(14)收容。
Patent TW-202323042-A (TW)
Title: Surface modification layer, surface modification sheet, multilayer body, surface-modified member, coated article, method for producing surface-modified member, and method for producing coated article
Inventor: NAKAO ERIKO
IPC: B32B27/00
Filed: 2022-09-29
Abstract: The present invention provides: a surface modification layer which contains one or more polar group-containing polymers and one or more unsaturated hydrocarbon group-containing polymers; a surface modification sheet which comprises this surface modification layer and a mold release sheet; a multilayer body; a surface-modified member and a coated article, each of which uses this surface modification sheet; a method for producing a surface-modified member; and a method for producing a coated article.
Patent TW-202328345-A (TW)
Title: Thermoplastic resin composition, molded article, and method for producing and method for improving transmittance of thermoplastic resin composition
Inventor: KATO NORIYUKI
IPC: C08L101/00
Filed: 2022-10-19
Abstract: Provided are a thermoplastic resin composition and the like that enable suppression of a change in transmittance such as when an additive is added, in particular, a change in transmittance in the short wavelength range. This thermoplastic resin composition contains a compound agent represented by general formula (1). (In general formula (1), R1-R5 each independently represent a hydrogen atom, an alkyl group or an alkoxy group having a total of 1-20 carbon atoms and optionally having a substituent group, or a structural formula of general formula (1-1). However, at least one of R1-R5 represents the structural formula of general formula (1-1), R6-R9 each independently represent a hydrogen atom, or an alkyl group or an alkoxy group having a total of 1-20 carbon atoms and optionally having a substituent group, and R10 represents a hydrogen atom or an alkyl group having a total of 1-5 carbon atoms.) (In general formula (1-1), R11-R18, R20, L, *, and ** are each described in the description of the present application.).
Patent TW-202329600-A (TW)
Title: Synchronous full-bridge rectifier circuit and rectifier switch controller thereof
Inventor: YANG TA-YUNG
IPC: H02M7/219
Filed: 2022-11-03
Abstract: A synchronous full-bridge rectifier circuit includes: a first high-side transistor, a first low-side transistor, a second high-side transistor and a second low-side transistor which are configured to generate a DC power source from an AC power source, wherein the first high-side transistor and the first low-side transistor are coupled to a live wire of the AC power source, and the second high-side transistor and the second low-side transistor are coupled to a neutral wire of the AC power source; a first detection transistor, coupled to the live wire and configured to generate a first detection signal; and a second detection transistor, coupled to the neutral wire configured to generate a second detection signal; wherein the first low-side transistor is turned on after the body-diode of the first low-side transistor is turned on; the second low-side transistor is turned on after the body-diode of the second low-side transistor is turned on.
Patent TW-202335159-A (TW)
Inventor: INOUE SEIYA
IPC: H01L21/683
Filed: 2022-11-17
Abstract: A member 10 for semiconductor manufacturing apparatus includes: a ceramic plate 20; a metal joining layer 40 and a cooling plate 30 (conductive substrate) provided at a lower surface of the ceramic plate 20; a first hole 24 penetrating the ceramic plate 20 in an up-down direction; and a through-hole 42 and a gas hole 34 (second hole) penetrating the conductive substrate in an up-down direction, and communicating with the first hole 24. A dense insulating case 60 has a bottomed hole 64 opened in a lower surface, and is disposed in the first hole 24 and the second hole. A plurality of microholes penetrates a bottom of the bottomed hole 64 in an up-down direction. A porous plug 50 is disposed in the bottomed hole 64 and in contact with the bottom.