baber/WOPTO huggingface dataset:
Patent JP-S5966103-A (JP)
Title: Preparation of macromolecular compound rare-earth magnet
Inventor: SATOU TADAKUNI
IPC: H01F1/08
Filed: 1982-10-08
Abstract: PURPOSE:To improve magnetic characteristics such as a maximum energy product by a method wherein powder of crushed ingot is molded first in a magnetic field and sintered subsequently, and then powder obtained by crushing the sintered substance again is mixed with macromolecular resin and molded under pressure. CONSTITUTION:Material arranged so that it comprises Sm of 26.0wt%, Fe of 19.3wt%, Cu of 4.8wt%, Zr of 2.4wt% and Co of the remainder is melted by high-frequency heating in an ambience of argon, and thereby ingot is obtained. After this ingot is roughly crushed, it is crushed into powder of fine particles, and this powder is molded under pressure in a parallel or perpendicular magnetic field. Then, the molded powder is sintered in the ambience of argon and subjected to solution treatment. A substance thus obtained is crushed again into magnet powder, and this powder is mixed with epoxy resin and then molded under pressure and in a magnetic field. By this method, magnetic characteristics are improved sharply.
Patent JP-S6332175-A (JP)
Title: Fluid conveying device
Inventor: INOUE KIYOSHI
IPC: F04B53/14
Filed: 1986-07-25
Abstract: PURPOSE:To improve pumping efficiency by forming a labyrinth treated face in which a number of projected and recessed craters are formed on the meeting and sliding face or faces of one or both of a fixed body and a movable body. CONSTITUTION:Projected and recessed craters 21 are formed on the surface sliding face of a cylinder 2, forming a labyrinth. The projected and recessed craters 2 are formed by means of machine work and blasting. A piston 1 is made slide opposite to the labyrinth formed surface, to effect lubrication. Thereby, a working fluid can be retained to stay in the craters, increasing the sealing and lubricating properties of the sliding gap between the fixed body and the movable body, and improving pumping efficiency.
Patent JP-H1018874-A (JP)
Title: Cylinder suspending control device of engine
Inventor: NONAKA KIMIHIRO
IPC: F02D17/02
Filed: 1996-07-05
Abstract: PROBLEM TO BE SOLVED: To prevent switching of the number of operating cylinder from repeating by setting a throttle opening to a new switching setting value when the switching setting value of engine speed exceeds at the time of raising of the speed in the case where the number of operating cylinder is changed by the switching setting value of the throttle opening and the engine speed. SOLUTION: During operation of an outboard engine, detecting signals of a throttle opening and engine speed are inputted to a control device, it is judged whether switching setting value θ1 , θ2 , of the throttle opening pass or not on load curves P1 , P2 . In the case where the switching setting value θ1 , θ2 are passed such as the point A of the load curves P1 , P2 , the number of cylinders is switched between five cylinders operation and four cylinders operation, and four cylinders operation and six cylinders operation. In the case where the switching setting value θ1 , θ2 are not passed on the load curves P2 , P3 , operation is switched from four cylinder operation to six cylinders operation, and from five cylinders operation to four cylinders operation.  And the throttle opening at the time of pass is memorized as the switching setting value of the throttle opening.
Patent JP-H0338884-A (JP)
Title: Light shielding structure for semiconductor device
Inventor: HIROHASHI OSAMU
IPC: H01L23/02
Filed: 1989-07-06
Abstract: PURPOSE:To prevent a light from being incident to a part except a photodetector by forming a shielding film on a region except a light passing route to the photodetector of the inner face of a package of a light transmitter, and setting the reflectivity of the inner face of the package to a predetermined value or less. CONSTITUTION:Other part than a slender rectangular region 7a extending longitudinally at the center of a glass cover 34 is so covered with a shielding film 7 in which the reflectivity of the inner face of a package is set to a predetermined value or less, and the region 7a is disposed directly above a photodetector 4 formed on a chip 2. Accordingly, an external light is passed only through the region 7a of the cover 34 with no film 7 into the package, and radiated only to the part of the photodetector 7 on the chip 2 sealed therein. Thus, the incident light is not radiated to an integrated circuit therearound. Since the film 7 is of black paint formed on the inner face of the cover 34, the reflectivity of the surface is substantially zero, and the incident light is not reflected in the package.
Patent JP-H11354529-A (JP)
Title: Heat treatment method of silicon wafer and silicon wafer
Inventor: KOBAYASHI NORIHIRO
IPC: G01Q60/00
Filed: 1998-06-09
Abstract: PROBLEM TO BE SOLVED: To reduce the concentration of crystal failure, micro roughness and haze on the surface of a silicon wafer and improve the electric characteristics such as breakdown strength of oxide film, mobility of carrier, etc., by separating the heat treatment conditions of quick heating and cooling in a reductive atmosphere into plural steps. SOLUTION: A silicon wafer is set to a quick heating/quick cooling device (RTA) in a reductive atmosphere containing a hidrogen, and it is heated at a desired temperature of 1200-1350 deg.C for example and the temperature is kept. Next, after the silicon wafer is cooled in a water-cooling chamber, it is heated quickly at 1200-1350 deg.C and it is cooled down to a temperature range of 900-1200 deg.C within a few seconds after the specified time is passed, and it is left as it is for the specified time (1 to 300 seconds) and then it is heat-treated at a low temperature for the halting time. If it is heat-treated continuously by multiple steps, COPs (crystal defect) can be eliminated surely than individual heat treatment of each step, and the micro roughness and haze (surface roughness) can be reduced at the same time.
Patent JP-S5969453-A (JP)
Inventor: MATSUMURA HIROYUKI
IPC: C04B28/14
Filed: 1982-10-06
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H1021508-A (JP)
Title: Magnetic head and its production
Inventor: KATAKURA TORU
IPC: G11B5/39
Filed: 1996-07-05
Abstract: PROBLEM TO BE SOLVED: To provide a magnetic head in which a lower pole and an upper pole are exactly positioned, the exact regulation of track width is made possible and recording and reproducing are exactly executed, and a process for producing the same. SOLUTION: In the thin-film magnetic head 4 of an induction type having the upper layer core 11 and the lower layer core 10 and thin-film coils 15 formed respectively by magnetic thin films, a lower pole 13 having the width size corresponding to the track width facing a surface for sliding with a magnetic recording medium is formed on the lower layer core 10 in such a manner that this pole projects toward the upper layer core 11. On the upper layer core 11, an upper pole 12 broader than the lower pole 13 is formed so as to face the surface for sliding with the magnetic recording medium in such a manner that the pole projects toward the lower layer core 10. A magnetic gap is formed between the opposite surfaces of the lower pole 13 and the upper pole 12.
Patent JP-S6333865-A (JP)
Title: Manufacture of semiconductor device
Inventor: NISHII KATSUNORI
IPC: H01L29/41
Filed: 1986-07-28
Abstract: PURPOSE:To form a via hole technique tying a substrate surface electrode and a rear electrode easily from a substrate surface by shaping a recessed pattern reaching a metallic film on the rear, forming an insulating film on the whole surface of the rear of a substrate, selectively plating a recessed section in the recessed pattern with a metallic film and removing the insulating film on the rear. CONSTITUTION:A first insulating film 12 such as an silicon nitride film is shaped onto a semiconductor substrate 11 such as a GaAs substrate, and the first insulating film 12 is formed to a desired pattern. A first metallic film 13 such as Ti/Au is shaped onto the rear of the semiconductor substrate 11. The GaAs substrate is etched until the first metallic film 13 on the rear is exposed, using the first insulating film 12 as a mask to form recessed pattern opening sections 14, and a second insulating film 15 such as an silicon nitride film is shaped onto the first metal 13 on the rear. Second metals 16 such as gold are formed selectively up to the surface of the substrate through plating in the recessed pattern opening sections. The second insulating film 15 on the rear is removed, the first metallic film 13 on the rear is exposed, and the surface of the substrate and the rear are tied and the substrate is employed as a grounding electrode.
Patent JP-H0615606-A (JP)
Title: Log carriage
Inventor: OISHI SENJU
IPC: B27B29/10
Filed: 1992-07-03
Abstract: PURPOSE:To provide log carriage, which automatically performs the rotation and pitching of log. CONSTITUTION:In the carriage concerned, a pair of clamping units 2 and 3, which are arranged to the longitudinal direction of logs made attachable and detachable in response to the length of the logs 7, are provided. In the respective units, fixing clamps 21, 22..., 31, 32... allowing to move between the actuating position, at which the log is clamped, and the retreating position, at which the log is released, and rotating and pitching clamps 25 and 35 rotatable about the center axis of the bundle of the logs under the condition being pinched similarly and horizontally movable normal to the center axis are provided. Accordingly, the logs 7 can always be held with the fixing clamps or the rotating and pitching clamps. Further, since the rotation and pitching of the log are performed by rotating and horizontally moving the rotating and pitching clamps 25 and 35, the easy patterning of a series of actions is possible by memorizing the coordinates of the initial centering of the logs, resulting in making the unmanned operation of a carriage and the efficient conversion sawing of the log possible.
Patent JP-S6153984-A (JP)
Inventor: WATANABE HIRAMASU
IPC: E06B9/68
Filed: 1984-08-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001002224-A (JP)
Title: Article feeder for filling machine
Inventor: TERAMOTO KON
IPC: B65B3/06
Filed: 1999-06-23
Abstract: PROBLEM TO BE SOLVED: To provide an article feeder for filling machines that, when practiced in filling devices for filling bags and the like with sticky, less fluid articles, minimizes remaining adhesion of the articles to the filling-device funnel parts, improves quantification in the filling, and is easy to wash. SOLUTION: A rotary disk 4 is slidingly rotatable along the upper external edge of a funnel 1, and a screw 7 is secured at one end to the rotary disk 4. The screw 7 is in the shape of a spiral coiling from the upper feed port to lower discharge port of the funnel 1 along the inner cone surface. For article introduction into bags or the like, the rotary disk 4 and screw 7 are turned by driving means along the upper external edge of the funnel 1 so that no articles remain in or adhere to the funnel 1. For its easy cleaning after that operation among others, the screw 7 is pulled, together with the rotary disk 4, out of the funnel 1 so as to be washed separately from the funnel 1.
Patent JP-H0464893-A (JP)
Title: Heat exchanger
Inventor: KONAKAWA KATSUZO
IPC: F25B41/00
Filed: 1990-07-03
Abstract: PURPOSE:To prevent the producing of a gap between a heat transfer bulkhead and a refrigerant passage member and improve heat exchanging efficiency by a method wherein a high-temperature gas flow regulating member is provided with a rear wall, connecting rear rims of side walls to each other, and heat transfer fins between the side walls while a pitch between the heat transfer fins at the upper side of a heat exchanger is made smaller than the same at the lower side of the same. CONSTITUTION:A high-temperature gas passage 4 is constituted of high-temperature gas flow regulating members 10, 11, made of the extruded profile of aluminum, left and right side walls 10a, 11a, rear walls 10b, 11b, connecting the rear rims of the side walls to each other, intermediate walls 10c, 11c, first heat transfer fins 10d, 11d and second heat transfer fins 10e, 11e. High-temperature combustion exhaust gas flows through spaces between neighboring heat transfer fins 10d, 10e, 11d, 11e and passages 12, 13 between both heat transfer fins 10d, 10e, 11d, 11e of both left and right ends and left and right side walls 10a, 11a. A pitch between the neighboring heat transfer fins 10d, 10e of the high-temperature gas flow regulating member 10 at the upper side of a heat exchanger is made smaller than the pitch of the heat transfer fins of the same member 11 at the lower side of the same and the number of the fins are larger to increase the heat transfer area of the same fins.
Patent JP-S57102566-A (JP)
Title: Ignition unit for internal combustion engine
Inventor: ISHIKAWA YASUTAKE
IPC: F02P5/155
Filed: 1980-12-17
Abstract: PURPOSE:To prevent the generation of mismatching discharge, even when a discharge starting voltage is lowered, by providing a closed loop which is formed for a large capacity of capacitor and its charging and discharging per air cylinder in a plasma ignition unit. CONSTITUTION:From a plasma ignition power source circuit 7, a charging current flows into and charges large capacity of capacitors 8a-8d through diodes 12a-12d and 14a-14d. A spark ignition circuit allows ignition plugs 6a-6d to discharge sparks in serial order. When an ignition timing control circuit 15 supplies a trigger pulse to thyristors 13a-13d respectively, the thyristors 13a-13d are turned on consecutively. A closed loop produced by the turned on thyristors allows the electric current to flow, thereby discahrging plasma. The thyristors 13a-13d are synchronized with only plugs which discharge sparks at a high pressure pulse Vig durig discharging and are triggered, thereby producing a conductivity condition. Therefore, mismatching discharge can be prevented.
Patent JP-S6423744-A (JP)
Title: Fixing method for brush assembly
Inventor: KISHI NOBUO
IPC: H02K13/00
Filed: 1987-07-16
Abstract: PURPOSE:To fit a printed board with a brush without making said brush dirty by arranging a terminal strip on a copper leaf pattern and by fixing said strip through resistance welding. CONSTITUTION:A flat spring 1 is equipped with a brush 7 and is fixed to a terminal strip 2a obtained by tinning of a steel plate, through resistance welding 6a. A rubber vibration insulator 3 is attached to the flat spring 1. A printed board 4 is provided with a printed wiring, and the terminal strip 2a is arranged on the copper leaf pattern 5 of said printed board 4 and electrically bonded through resistance welding 6a. Thus, the terminal strip 2a of a brush assembly is arranged on the copper leaf pattern of the printed board 4 and said terminal strip 2a and the copper leaf pattern 5 are fixed through resistance welding so that the brush can be attached to the printed board 4 without becoming dirty.
Patent JP-S6421513-A (JP)
Title: Humidity adjusting signal output device
Inventor: MORI KEIJIRO
IPC: G05D22/00
Filed: 1987-07-16
Abstract: PURPOSE:To prevent the generation of dew condensation on walls, ceiling or the like, to suppress the generation of mold and to prevent the generation of influenza due to the reduction of humidity by outputting a control signal for adjusting relative humidity in accordance with an outside air temperature and a room temperature. CONSTITUTION:A room temperature, room relative humidity and an outdoor temperature are respectively detected by a room temperature detecting means 1, a room relative humidity detecting means 2 and an outside air temperature detecting means 3 and their signals are inputted to an arithmetic and control means 10. The means 10 calculates the surface temperature of a wall, a ceiling or the like and the surface relative humidity of the wall, ceiling or the like and compares these data with the temperature and humidity in a mold increasing area to control a humidity adjusting apparatus 5 by an output signal indicating the compared result. Since the surface humidity of a wall, a ceiling or the like in a room is adjusted so as to be close to the outside of the mold increasing area, the generation of dirt, bad smell and asthma can be prevented and the infection of influenza can be also suppressed.
Patent JP-H0712524-A (JP)
Title: Film thickness measuring device
Inventor: YOSHIGIWA JIYUN
IPC: G01B11/06
Filed: 1993-06-24
Abstract: PURPOSE:To accurately measure the film thickness of silicon oxide film formed on silicon substrate. CONSTITUTION:In the device for measuring the film thickness of silicon oxide film formed on silicon substrate 2 using light, the film thickness of the silicon oxide film is measured, HCl gas is introduced into a treatment chamber 1, film thickness is measured similarly after eliminating the silicon oxide film by heating in HCl gas atmosphere, and then 0-point calibration of the film thickness measurement value is performed using the result.
Patent JP-H0228269-A (JP)
Title: Coating composition for freeze-resistant and chipping-resistant treatment
Inventor: TAHIRA NOBUHIRO
IPC: C09D109/00
Filed: 1988-07-16
Abstract: PURPOSE:To obtain a chipping-resistant coating composition effective in coating a surface of a metallic article and protecting the article from chipping under cold condition by using a specific styrene-butadiene-acrylate copolymer as a base resin and adding a filler and a pigment to the resin. CONSTITUTION:The objective composition contains (A) a base resin composed of a copolymer of styrene, butadiene and an acrylic monomer, having a glass transition point of <=0 deg.C, containing 5-50 pts.wt. of butadiene per 100 pts.wt. of the base resin and produced in an emulsion system, (B) a filler and (C) a pigment.
Patent JP-H05338233-A (JP)
Title: Thermal head
Inventor: SUZUKI KAZUHIRO
IPC: B41J2/335
Filed: 1992-06-11
Abstract: PURPOSE:To provide a thermal head capable of forming a wear resistant film having thin film thickness even when glass paste of low viscosity is used. CONSTITUTION:Partial under-glazes 2a, 2b are formed under an IC 8 for driving and a heat generation resistor 4 on an insulated substrate 1. The edge of a pad part 9 for bonding a wire in the end part of an individual electrode 3 is formed so as to be nearly equal to the edge of the partial under-glaze 2b. The heat generation resistor 4 and a common electrode 5 are formed and thereafter glass paste of low viscosity is printed so that it does not ride on the partial under-glaze 2b and burned to form a wear resistant film 6. The printed glass paste does not flow on the pad part 9 for bonding the wire by the step in level of the partial under-glaze 2b. The IC 8 for driving is mounted on the partial under-glaze 2b and connected by performing bonding.
Patent JP-2000007262-A (JP)
Title: Bearing removing bracket for driving roller gear on passenger conveyor
Inventor: NAKAMOTO TAKASHI
IPC: B66B23/04
Filed: 1998-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a bearing removing bracket for a driving roller gear on a passenger conveyor capable of easily removing from a shaft a bearing for a gear bolted to a driving roller, if left on the shaft when the driving roller is removed from the shaft. SOLUTION: A bracket comprising a plate arranged in front of a bearing for a gear 28 fixed to a driving roller for a moving handrail driver 24 with a bolt 29, a pair of engagements engaged with the outer periphery of the bearing integrally formed at both ends of the plate, a screw hole opposed to the end face of a shaft for the moving handrail driver 24 and a thrusting bolt threaded to the screw hole for thrusting the end face of the shaft to the axial direction is used to remove the bearing fitted to the shaft from the shaft.
Patent JP-H0226714-A (JP)
Title: Mold for slush molding
Inventor: UMEZAWA HAJIME
IPC: B29C41/18
Filed: 1988-07-16
Abstract: PURPOSE:To make it possible to form a skin material having a complicated shape without leakage of a raw material by getting rid of elevating temp. at unnecessary parts of a mold in such a way that the raw material is welded on a necessary face for molding. CONSTITUTION:A mold 1 is heated in a fluidized bed oven 10 by bringing the mold into contact with a heat medium sand 11, and for example, vinyl chloride powder raw material is fed in the mold 1 the temp. of which is elevated at 220 deg.C. The fed vinyl chloride powder raw material is melted and welded on the mold, but welding of the powder raw material 3 does not occur on the parts where welding is unnecessary. This is brought about by the reasons that air stays in a recessed space 6 surrounded with a heating-preventing plate a and the mold 1 to prevent penetration of the heat medium sand 11 and the mold temp. on the parts where welding is unnecessary and that heat is hardly transferred to the raw material 3 by placing an heat insulating plate 9 made of a bakelite. A skin material of a required shape can be obtd. by cooling and solidifying the welded layer 12.
Patent JP-S57100072-A (JP)
Title: Drying device for printing paper
Inventor: HIRANO KATSUYA
IPC: B41F23/04
Filed: 1980-12-16
Abstract: PURPOSE: To prevent the production of a tire wrinkle due to a difference in a drying process between a printing surface and a non-printing surface, by a method wherein a drying chamber is divided into a front and a rear chamber, and the front chamber forms a heating chamber heated by a high-temperature blast and the rear chamber forms a heating chamber heated by a low-temperature blast containing steam.  
     CONSTITUTION: In a front drying hood 4, hot blast, heated to about 250W280°C, is blown from the upper and the lower from a high-temperature air feed fan 9 through nozzles 6a and 6b, which are alternated with each other along a running path of a printing paper 3, of a hot blast injection unit. Then, the printing paper 3 enters a rear drying hood 5 where a hot blast, heated to about 180W 200°C and fed from a low-temperature air feed fan 14, and steam from a steam generator 18 are blown in a mixture manner against the upper and the lower surface of a paper through nozzles 7b of a humidified hot blast injection unit 7. This permits the reduction in the production of fire wrinkle due to a drying time leg. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-S5967645-A (JP)
Title: Remedial device for defect of semiconductor
Inventor: KAWANABE TAKAO
IPC: G01R31/26
Filed: 1982-10-12
Abstract: PURPOSE:To remedy whole semiconductor device from defects by connecting a wiring path changeover means to a wafer probe and changing over one part of a circuit in the semiconductor device to a spare circuit. CONSTITUTION:A wafer probe 7 executes a test, through which a contact with a predetermined electrode pad of a probe needle is made sure, a test regarding the presence of leakage currents, the propriety of currents consumed and the propriety of an output level and a test through which the display of prescribed functions of each of bit circuit groups is inspected. A controller 12 controls a mirror 10 and a lens 11, etc. in order to irradiate a laser from a light source 9 to a predetermined position for changing over a defective bit circuit in a pellet under measurement and the spare redundancy bit circuit on the basis of a defective signal as results of the tests, and executes the irradiation of the laser. According to the irradiation, the defective bit circuit is changed over to the spare bit circuit, and the whole pellet is remodelled into an acceptable.