baber/WOPTO huggingface dataset:
Patent JP-H08120162-A (JP)
Title: Heat-resistant dropwise impregnation resin
Inventor: OKIYOKOTA MASAO
IPC: C08G59/42
Filed: 1994-10-20
Abstract: PURPOSE: To obtain the subject composition excellent in mechanical strength, etc., and useful as an insulating material, by adding a curing agent and a curing accelerator to a main agent comprising a bisphenol type epoxy resin, a cresol novolak type epoxy resin, an alicyclic epoxy resin and ε-caprolactam. CONSTITUTION: This resin is produced by adding (B) 0.8-1.2 moles of a curing agent, preferably tetrahydrophthalic anhydride, and 0.5-5wt.% of a curing accelerator, preferably 4,4'-methylene-bis-(2-ethyl-5-methylimidazole), to (A) a main agent comprising a bisphenol type epoxy resin, preferably in an amount of 40-75wt.%, a cresol novolak type epoxy resin, preferably in an amount of 10-40wt.%, an alicyclic epoxy resin, preferably in an amount of 10-40wt.%, and ε-caprolactam, preferably in an amount of 5-30wt.%, and subsequently heating and stirring the mixture. The curing agent and the curing accelerator are preferably used as their mixture of 1:1 weight ratio.
Patent JP-H10100523-A (JP)
Title: Cinnabar seal-ink case with skid-proof part for seal
Inventor: WATASE SHIN
IPC: B41K1/54
Filed: 1996-09-26
Abstract: PROBLEM TO BE SOLVED: To prevent a seal from falling into a cover by keeping stability without making the seal slide even when the seal is placed by abutting against an edge of an inner face of a cinnabar ink-pad case cover when the seal is used. SOLUTION: A cinnabar seal-ink case with a skid-proof seal is composed of a main body 4 for storing the cinnabar seal-ink, and a cover 1 for covering the main body. A difference in level 2 is provided to an inner face of the cover 1 keeping a specific distance from the edge by conforming to various kinds of sizes of the cinnabar seal-ink case cover.
Patent JP-H0196178-A (JP)
Title: Recovery of trimellitic anhydride
Inventor: KODAMA MASAHIRO
IPC: C07D307/89
Filed: 1987-10-08
Abstract: PURPOSE:To recover trimellitic anhydride by feeding a reaction solution of pseudocumene air oxidation using a solvent of acetic acid to crystallizing tanks to give trimellitic acid-containing slurry, filtering the slurry to give cake, melting the cake and sending vapor containing trimellitic anhydride to the crystallizing tank. CONSTITUTION:Pseudocumene is oxidized with air by using a solvent of acetic acid in a batch reactors 1 and 2, the reaction solution is fed to a first crystallizing tank 7 and then to a second crystallizing tank 9 to give trimellitic acid- containing slurry. The slurry is sent to a vacuum filter 11 to give trimellitic acid-containing cake, which is heated in a melting tank 13 and trimellitic acid is made into trimellitic anhydride. Trimellitic anhydride-containing vapor generated in the tank 13 is sent to the second crystallizing tank 9 so that trimellitic anhydride in the vapor is reacted with water in the tank 9 to give trimellitic acid. By this method, since trimellitic anhydride is not recovered by condensation, neither adhesion of slurry to a condenser nor clogging of piping will occur.
Patent JP-H03117280-A (JP)
Title: Generating circuit for optional picture magnification signal
Inventor: MATSUI NOBUYUKI
IPC: H04N5/262
Filed: 1989-09-29
Abstract: PURPOSE:To attain picture magnification to an optional shape by controlling a read clock stop timing data and a current read clock with an AND gate to stop the read clock of an FIFO memory. CONSTITUTION:A video signal outputted from a video source 5 is converted by an A/D converter 6 and written in a FIFO 7. When the data in the FIFO 7 is read, a current read clock (c) outputted from a clock generating circuit 4 and a readout data (b) of a 1-bit plane memory 2 are given to an AND gate 9 to control the read clock of the FIFO in response to the magnification for each line. In this case, the read clock (a) is generated from a read timing generating circuit 3 is generated for the synchronization with the readout side and the timing data (b) is revised to obtain an optional magnification picture data easily.
Patent JP-2000086179-A (JP)
Title: Lift truck
Inventor: FUJITA TSUTOMU
IPC: B66F11/04
Filed: 1998-09-09
Abstract: PROBLEM TO BE SOLVED: To efficiently perform picking work. SOLUTION: A pair of a right and a left workpiece lifting forks 10 are protruded from a lifter 9 provided on a car body 1 to be capable of elevation through masts 7, 8, a hollow workpiece lifting fork 18 protruded from a lower surface of a picking work base 11 is engaged with the fork 10, and a driving operation device 13 having a lifter operation part 5 to elevate the lifter 9 and a car body operation part 20 to run a car body 1 are provided on the lifter 9.
Patent JP-H0972964-A (JP)
Title: Seismoscope
Inventor: NUKUI KAZUMITSU
IPC: G01F3/22
Filed: 1995-09-06
Abstract: PROBLEM TO BE SOLVED: To enable stable detection of the magnitude of an earthquake for a long time. SOLUTION: This seismoscope is provided with a seismic sensing section 10 which senses vibration as caused by an earthquake to convert the vibration to changes in the pressure of a gas, a pressure change sensor section 30 to convert the pressure change into an electrical signal and a signal processing section 40 which processes a signal outputted from the pressure change sensor section 30 to judge the presence and the magnitude of the earthquake. With the rotation of a ball body 15 caused by the vibration, an oscillation body 17 moves vertically so that the pressure varies within a gas chamber 32 of the pressure change sensor section 30. An piezo-electric thin film 34 vibrates according to the changes in the pressure to induce a fine voltage.  The fine voltage is amplified by an amplifier 41 of the signal processing section 40 and converted into digital from analog by an input-output port 42 to be inputted into a microprocessor 43. The microprocessor 43 compares a pattern of a signal obtained with a specified signal pattern to judge whether the change in the pressure is attributed to the vibration of the earthquake or not and also the magnitude of quake of an earthquake.
Patent JP-H0896344-A (JP)
Title: Biaxially oriented polyethylene terephthalate film
Inventor: MIYAKE TORU
IPC: B29C55/12
Filed: 1994-09-21
Abstract: PURPOSE: To obtain a low-cost film having high cutting resistance in a producing process and in VTR and optimum for use as the base film of a magnetic tape for digital video having satisfactory electromagnetic transducing characteristics and dropout characteristics. CONSTITUTION: This film is made of polyester contg. >=85mol% ethylene terephthalate in the repeating units and has 3-8μm total thickness, 300-700kg/mm<2> modulus (A) of elasticity in the longitudinal direction, 200kg/mm<2> difference (B-A) between the modulus (B) of elasticity in the transverse direction and the modulus (A) and 0.1-5nm surface roughness Ra of at least one side. This film is used as the substrate of a coating type magnetic recording medium for digital video having <=2μm total thickness of coating layers.
Patent JP-H08326781-A (JP)
Title: Electromagnetic connection device
Inventor: KIMURA TAKASHI
IPC: F16D27/14
Filed: 1995-09-06
Abstract: PURPOSE: To improve durability of a damper rubber on which compressive stress or shearing stress acts by repeating movement by opening a chamber wall of a damper cover part on the boss side on the tension side of the damper rubber. CONSTITUTION: A stopper plate 9 is formed with circular-arc-like peripheral walls 9h cut off by virtual lines R connecting together the center point P of a rotary shaft and the center points Q of torque pins 10, and the chamber wall 9d of a damper cover part 9e is opened on the boss side on the tension side of a damper rubber 11 against the virtual line R (anti-rotation T side). Consequently, the compression side of the damper rubber 11 (rotation T side) is fully press-fitted in the chamber wall 9d of the damper cover part 9e. Hereby, large elastic deformation of the damper rubber due to compressive stress at the opened part of the damper cover part on the boss part side is prevented, and durability of the damper rubber is improved.
Patent JP-S63109374-A (JP)
Title: Sensor
Inventor: KUSHIDA TAKEO
IPC: G01C9/10
Filed: 1986-10-28
Abstract: PURPOSE:To enhance a detection accuracy, by a method wherein a magnetic sphere is received in a cylindrical bobbin, and a magnetic field generating member for attracting the magnetic sphere to a desired position and a detection coil for magnetically detecting the position of the magnetic sphere are arranged to the outside of the bobbin. CONSTITUTION:A magnetic sphere, for example, an iron sphere 5 is received in the housing space 4 of a cylindrical bobbin 1 formed of a non-magnetic material and a detection coil 10 is provided to the outer periphery of the bobbin 1 in the state wound around a frame 11 and a ring-shaped permanent magnet (magnetic field generating member) 15 is provided to the outside of the coil 10. When a moving body is accelerated in either one of the left and right directions, the iron sphere 5 receives inertial force in the direction opposite to the acceleration direction and moves against the magnetic force of the magnet 15. The self-inductance of the coil 10 changes by the positional change of the iron sphere 5 and differential output is generated. As a result, acceleration is digitally displayed on a display device 27 as a positive or negative value. By this method, detection accuracy can be enhanced.
Patent JP-H01130157-A (JP)
Title: Non-rinsing photographic processing and stabilization bath used therefor
Inventor: HAINTSU METSUKURU
IPC: G03C7/30
Filed: 1988-10-12
Abstract: PURPOSE: To obtain images having high quality even in the case of long-term use by incorporating an effective amt. of specific pyrazole into the bath. CONSTITUTION: The effective amt. of the pyrazole which is expressed by formula I and is in the form of its possible one tautomer is incorporated into the stabilizing bath used in a stabilization stage of a non-single washing photographic processing method for forming the color photographic images. In the formula I, X denotes OH or NH2 ; R1 denotes alkyl, substd. alkyl, aryl, substd. aryl or carboxyl, R2 denotes hydrogen, alkyl or substd. alkyl; R3 denotes hydrogen, alkyl, substd. alkyl, aryl or substd. aryl. As a result, the highly satisfactory image quality is obtd.
Patent JP-H0786611-A (JP)
Title: Manufacture of semiconductor device for display element substrate
Inventor: KANETANI YASUHIRO
IPC: H01L29/78
Filed: 1993-09-17
Abstract: PURPOSE:To conduct alignment in a photolithographic process only at one time by using only a first photo-mask forming a transistor gate pattern and a second photo-mask simultaneously forming a pixel electrode and a wiring electrode. CONSTITUTION:An electrode film, an insulating film and a semiconductor thin- film are shaped onto an insulating substrate 0. A transistor gate pattern containing a gate electrode 9, a gate insulating film 10 and a thin-film semiconductor region 11 is formed by using a first photo-mask. A conductive film is formed onto the gate pattern. Lastly, the conductive film is patterned by employing a second photo-mask aligned with the gate pattern. Consequently, a drain electrode (a pixel electrode) 15B and a source electrode (a wiring electrode) 15A in the semiconductor region 11 are shaped. Inter-electrode insulating films 14 are formed onto the insulating substrate 0 so as to surround and bury the side end sections of the gate electrode 9 in the process.
Patent JP-2001074657-A (JP)
Title: Photometric method and apparatus
Inventor: KIMURA TOSHIHITO
IPC: G01N21/64
Filed: 1999-09-09
Abstract: PROBLEM TO BE SOLVED: To detect the fluorescence generated from a specimen in a high S/N ratio, in a photometric method and apparatus, by reducing the incidence of the fluorescence generated from matter other than the specimen becoming a measuring object on a detector. SOLUTION: The fluorescence Ke generated from a specimen spot Ksp by the irradiation with the exciting light Le generated from a laser beam source 40 is converted to a parallel beam by a first condensing lens 51 and the beam of the central part of this parallel beam is cut off by a central beam shading plate 60 and only the beam in the peripheral part of the parallel beam is condensed to a pinhole Ph by a second condensing lens 52 and the fluorescence passed through this pinhole Ph is detected by a detector 70.
Patent JP-H08101725-A (JP)
Title: Computer
Inventor: HANAOKA MASAAKI
IPC: G06F1/00
Filed: 1995-09-06
Abstract: PURPOSE: To continuously use a system by storing the state of the system when a request to interrupt a processing is made in an external storage device, and reading it out and continuing the process when it is judged that the processing can be restarted. CONSTITUTION: When a saving processing start detecting means 11 detects the request to interrupt the processing of the computer, a system state saving means 12 interrupts the processing and outputs the system state required to continue the processing to an external nonvolatile storage device. When the restart of the processing is requested, a system state restoring means 15 reads the state of the system out of the external storage device and restores the computer to the state at the time of the interruption of the processing and a restoration postprocessing means 16 continues the processing through the processing of a storage means 16-1 previously stored with the processing after the restoration to the state at the time of the interruption.  Therefore, the need to back up a program and data on the memory by a battery is eliminated and the processing after the restoration can be performed according to a previously stored desired procedure.
Patent JP-H07108010-A (JP)
Title: Brush and manufacture thereof
Inventor: HATTORI SHOHEI
IPC: A46B3/22
Filed: 1993-10-13
Abstract: PURPOSE:To provide a brush which can dispense with a molding die during curing of an adhesive with which the base of a bundle of filaments is impregnated, and which can simplify the structure of attachment of the filament part to a handle, and to provide a method of manufacturing thereof. CONSTITUTION:An adhesive is charged into a filament bundle insertion cylinder 2 which is made of a rigid material and in which the base part of a bundle 1 of filaments are fitted, and is then cured. Accordingly, the base part is secured in the filament bundle insertion cylinder 2. Thus, the filament part can be formed without using a molding die. Further, a fitting part 5 provided at the proximal end of the cylinder 2, is fitted onto a part 7 to be fitted, provided at the front end of a handle B, thereby it is possible to simply complete the assembly of the brush.
Patent JP-S61135623-A (JP)
Inventor: SUZUKI TOSHIAKI
IPC: A47J43/10
Filed: 1984-12-04
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H03116914-A (JP)
Title: Winding device
Inventor: SHIGEKIYO HIDEAKI
IPC: H01F41/06
Filed: 1989-09-29
Abstract: PURPOSE:To facilitate a temporary winding back operation, and to contrive improvement in the quality of a coil by a method wherein, when a pancake coil is wound back from its temporary bobbin, the bent coil is extended by applying tension. CONSTITUTION:When the pancake coil 51, which was wound around the temporary bobbin 1 provided on a temporary winding surface plate 2, is wound back to the bobbin 3 provided on a surface plate 4, tension is added to the pancake coil 51. To be more precise, tension is given by a frictional tension part 7 to the lower pancake coil 51, which is wound on the surface plate 4 through a bobbin 3 and to the upper pancake coil 51 which is temporary wound on a temporary winding surface plate 2 through a temporary winding core 1. At the same time, a guide rail 9 is shifted by a wire 10 through the intermediary of a roller 8, and the upper pancake 51 is obtained by conducting a temporary winding back operation while it is stretched out. As a result, the coil can easily and accurately be stretched out, and the improvement of quality of coil can be accomplished.
Patent JP-H0199971-A (JP)
Title: Built-up box
Inventor: WATABE KATSUAKI
IPC: B65D55/02
Filed: 1987-10-09
Abstract: PURPOSE:To allow the joints to be attached and dettached by the part of deformation due to the heating shapability of low-temperature thermoplastic resin, by a method wherein the title base consists of a couple of a box comprising inorganic material, high-temperature thermoplastic resin, and thermosetting resin with a cap using low-temperature thermosetting resin. CONSTITUTION:A combinational box consists of a couple of a box comprising inorganic material, high-temperature thermosetting resin, and thermosetting resin or their composite with a cap using low-temperature thermoplastic resin used at least for a part. The joints of the two members have the structure of attachment and detachment by the part of deformation due to the heating shapability of low-temperature thermoplastic resin. The thermoplastic resin softening at low temperature used for the cap is polylactone resin, transpolyisoprene resin, and the blend of these with other resins. The low- temperature thermoplastic resin user as the cap material is characterized by softening at 50-80 deg.C of the temperature of hot water or warm water, and by solidification at room temperature with no further deformation.
Patent JP-H0790457-A (JP)
Title: Al alloy clad material having excellent pitting corrosion resistance even after brazing heating treatment
Inventor: ITAGAKI TAKESHI
IPC: C22C21/00
Filed: 1993-09-20
Abstract: PURPOSE:To obtain an Al allay clad material showing excellent pitting corrosion resistance even if being subjected to brazing heating treatment. CONSTITUTION:In an Al alloy clad material obtd. by cladding one side or both sides of the core material with a sacrificial anode material and in an Al alloy clad material obtd. by cladding one side of the core material with a sacrificial anode material and the other side with an Al-Si alloy brazing filler metal, the core material is constituted of an Al alloy contg., by weight, 0.5 to 2% Mn and 0.2 to 1% Fe and contg., at need, one or more kinds among 0.3 to 1.2% Si, 0.05 to 5% Mg, 0.05 to 0.25% Cr, 0.05 to O.25% Zr, 0.02 to 0.25% Ti and 0.05 to 0.25% V. The sacrificial anode material is constituted of an Al alloy contg. 0.01 to 0.15% Sn, 0.05 to 1% Zn and 0.002 to 0.15% Fe and contg., at need, 0.1 to 4.5% Mg.
Patent JP-S61136613-A (JP)
Title: Vacuum decarburization method of molten steel
Inventor: KATAYAMA HIROYUKI
IPC: C21C7/10
Filed: 1984-12-06
Abstract: PURPOSE:To decarburize efficiently a molten steel and to produce economically the low-carbon molten steel by evacuating the inside of an immersion pipe immersed into the molten steel and blowing gaseous oxygen and powder contg. iron oxide, etc., from a top blowing lance to the molten steel risen in the pipe. CONSTITUTION:The immersion pipe 2 which has the inside diameter of preferably about >=30% of the inside diameter of a ladle 1 contg. the molten steel A such as rough molten high-chrome steel subjected to primary decarburization under atmospheric pressure and is coated with refractories on the inside surface is inserted into said ladle 1 and is partly immersed into the molten steel A. The pipe 2 is connected to a vacuum pump and the inside thereof is evacuated to suck up the molten steel A, at the same time, the powder 6. contg. iron oxide such as iron ore powder or nickel oxide such as NiO powder is blown together with the gaseous oxygen by the top blowing lance 4 into the molten steel A in the pipe. Gaseous Ar is further blown through a bottom blowing porous plug 3 provided in the bottom of the ladle 1 to stir the molten steel A. The molten steel A is thus efficiently decarburized and refined.
Patent JP-2000087470-A (JP)
Title: Composite board
Inventor: OKUYAMA SENICHI
IPC: E04F13/08
Filed: 1998-09-10
Abstract: PROBLEM TO BE SOLVED: To provide a composite board usable as exterior or interior wall member, roof, ceiling, flooring, partition member, or fire door of a building and having both fire protection and heat insulation properties. SOLUTION: A composite board A is formed of a thin-plate-shaped surface member 1, a fire protection layer 4 placed on the back of the surface member 1, and a foam layer 2 placed on the back of the fire protection layer 4. The fire protection layer 4 comprises aggregate 5 composed chiefly of vermiculite and bonded to the back of the surface member 1 with a bonding agent comprising a mixture of an acrylic synthetic resin and vinyl acetate. The foam layer 2 comprises synthetic resin foam foamed on the back of the fire protection layer 4 to constitute the composite board A.
Patent JP-H10144395-A (JP)
Title: Interface card and network element
Inventor: SOCHACKI JOHAN W
IPC: H04M7/00
Filed: 1997-09-22
Abstract: PROBLEM TO BE SOLVED: To easily remove a plug without damaging a pin connector by providing a face plate connected to a circuit pack one face with an eject mechanism for removing a plug of a cable assembly when the plug is mounted on the face plate. SOLUTION: A face plate 16 is connected to one face of a circuit pack 15 of a line card 4, and a plug 22 of a cable assembly 24 is inserted via an opening 18 of this face plate 16 and mounted on a pin of a connector 20. At this time, the face plate 16 is provided with an eject mechanism 26 made of a slide member having an end face parallel to a pair of similar side walls. When a certain force is applied to an end face 58 of this slide member 54 in a direction indicated by an arrow A, a finger is deformed, the slide member moved in A direction, a tilt surface contacts with an adjacent surface, and the plug 22 is separated from a pin 46. Thereby, the plug 22 can be removed without imparting bending or other damage to the pin 46.
Patent JP-H0198238-A (JP)
Title: Method of mounting semiconductor device
Inventor: NAKAMURA YUKIO
IPC: H01L21/603
Filed: 1987-10-12
Abstract: PURPOSE:To simplify manufacture by transferring an Au bump to a semiconductor element from a bump preparing substrate and thermocompression-bonding the Au bump onto the substrate. CONSTITUTION:A Ti film 5 is formed onto a bump preparing substrate 4 composed of glass, etc., through sputtering evaporation, and a Pt film 6 is shaped onto the film 5, and used as an electrode for plating. Au bumps 3 are formed onto the film 6. A semiconductor element 1 is aligned and superposed from the upper sections of the Au bumps 3 while patterns surfaces are directed downward. When the semiconductor element 1 is thermocompression-bonded with solder coatings 11 in approximately 10mum shaped onto land patterns 10 consisting of Cu foils on a mounting substrate 9 by a hold-down jig 8 from an upper section while the semiconductor element 1 is directed downward so that the Au bumps 3 are conformed, the Au bumps 3 and the solder coatings 11 are alloyed and joined. Lastly, the whole surface is resin-coated for protecting the IC chip 1.
Patent JP-2000091801-A (JP)
Title: Connection line substrate
Inventor: NAKAMURA TOSHIAKI
IPC: H01P3/08
Filed: 1998-09-10
Abstract: PROBLEM TO BE SOLVED: To provide a small connection line substrate with low loss, which connects a plurality of high frequency circuits where mutual fitting faces form angles and are arranged, by installing a dielectric substrate, a strip conductor and a ground conductor and forming the ground conductor to be narrower than first and second flat areas in a bend area. SOLUTION: The ground conductor 16 with a thickness of 30 μm is adhered to the back 17 of a dielectric substrate 10 by making it face a strip conductor 15. The ground conductors 16 are formed on the whole back faces of flat areas 12 and 13 in width W. The width W of a bend area is narrowed and it is narrower than the flat areas but is formed to be wider than the strip conductor 15. Since the width W of the ground conductor 16 at the back of the bend area is formed to be wide, a curvature is made to be large in the bend area and the connection line substrate can be bent at a large angle. Thus, the connection line substrate can be connected to peripheral high frequency circuit elements making the angles on the close fitting faces.