Patent SG-11201408122R-A (SG)
Title: Bonding apparatus and method of manufacturing semiconductor device
Inventor: TANI DAISUKE
IPC: H01L21/60
Filed: 2013-06-05
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» allium 2013# 12 fll9 0(19.12.2013) w , PO tpCT (10) WO 2013/187292 A1 (51) H01L 21/60 (2006.01) (21) PCT/JP2013/065575 (22) 2013^6^ 5 0(05.06.2013) (25) (26) @U8&M©Wi§: (30) fiBfcftf '— 1 £: 2012-131510 2012 ^6^ 11 0(11.06.2012) JP 4#M 2013-061589 2013 ^ 3 ^ 25 0(25.03.2013) JP (71) ttiHA: ^S#l±irJII (SHINKAWA LTD.) [JP/JP]; T2088585 Uj TfT W- 2 T g 5 1 #±feG) 1 Tokyo (JP). (72) £ A$i(TAM, Daisuke); T 2088585 ai3£ittttUUrfi#£¥ 2TI51 #ifea> 1 folR ^a«fjl|_rt Tokyo (JP). fit /p — (TAKAHASHI, Koichi); T 2088585 HjfvtRjKUfa Uj 2 T I 5 1 iifeffl 1 Tokyo (JP). ^ (74) i-tmx-. (YKI PATENT ATTORNEYS); T 1800004 5 [mn%] (54) Title: BONDING DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE S (54) fgE0)€ffc : 7tOxV (57) Abstract: A flip-chip bonding device (500) for layer-bonding second- a layer semiconductor chip (30), on which a second through electrode is provided, to a first-layer semiconductor chip (20), on which first a through electrode is provided, at a position corresponding to the first through elec­ trode, and equipped with a control unit (50), and double-view a camera (16) for capturing images of the semiconductor chips (20, 30), wherein the control unit (50) is provided with relative-position detection a program (53) for de­ tecting the relative positions of the semiconductor chips (20, 30) in the layer- bonded layers, on the basis of an image of the first through electrode on the surface of the first-layer semiconductor chip (20) captured by the double- view camera (16) prior to the layer-bonding, and an image of the second through electrode on the surface of the second-layer semiconductor chip (30) captured by the double-view camera (16) after the layer-bonding. Con­ sequently, through electrodes can be accurately connected by using a simple method. (57) Wlfo: — TvZ? (2 0) (3 0) £ 81 Jf 7|? V V 4 > ( 5 OO) (2 0) , (3 0) (DW&Z =j (16) t, mmu (50) t, (5 0) It. = (16) lc«fcoTSHftLf=£-a>Jia>3M»f*f ; (2 0) HJi>•? L (16) (3 0) Xf (20) , (3 0) (5 3) I — cfe U ^ - \" ^ mm g -& o o £ iKSrrfr^^Br — T @ 3 4# 1 2.^ Tokyo (JP). (8i) (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3- — V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). WO 2013/187292 A11 lllll llllllll II llllll III lllll lllll III III III lllll lllll llll llll lllll lllll lllll lllllll llll llll