baber/WOPTO huggingface dataset:
Patent JP-S59165574-A (JP)
Title: Switching device of video signal
Inventor: SATOU MASAAKI
IPC: H04N5/262
Filed: 1983-03-10
Abstract: PURPOSE:To avoid the disturbance of video signals generated in a switching mode by putting the inserting signals having a fixed level and different frequencies of synchronizing signals between video signals obtained before and after the switching mode. CONSTITUTION:A switching device is provided with an inserting video signal generating circuit 10 and an analog switch 20 which delivers alternatively an inserting video signal VDZ and video signals VDA and VDB which are delivered from image pickup devices 1 and 2 to a TV receiver 4. When a switch signal SEL is supplied during a display of the signal VDA, a coincidence detection signal RST is delivered when the coincidence is obtained between the vertical synchronizing signal VA of the signal VDA and the vertical synchronizing signal VZ of the signal VDZ. Then a control circuit 30 switches the switch 20 to the side of the signal VDZ. Then the coincidence is detected between signals VB and VZ, and the switch 20 is switched to the side of the signal VDB.
Patent JP-H04277428-A (JP)
Title: Electromagnetic relay
Inventor: SEKIGUCHI AKIRA
IPC: H01H50/22
Filed: 1991-03-06
Abstract: PURPOSE:To lessen the height by dividing the core of an electromagnetic relay according to the present invention into two pieces, and converting the attracting motion of the core to a lateral motion parallel to the base. CONSTITUTION:A spool 2 with a winding 3 wound round is installed inside of a U-form york 4 placed on a base 1. No.1 core 5 whose one end is caulked fast to the york 4 and No.2 core 6, to whose one end a movable spring 9 is secured, are arranged separately in a through hole formed in this spool 2, No.2 core 6, and a repulsive coil spring 7 is installed between the other ends of these two cores 5, 6. When current is fed to the winding 3, the No.2 core 6 contracts this coil spring 7, and attraction is made to the No.1 core 5. Thereby a movable contact fixed to the tip of the movable spring 9 makes contact and separation between stationary terminals 10A, 10B.
Patent JP-H03243761-A (JP)
Title: Sputtering device
Inventor: NAKADA JUNJI
IPC: C23C14/35
Filed: 1990-02-22
Abstract: PURPOSE:To provide the sputtering device formed to avert the intrusion of impurities into formed thin films by constituting the magnetic shielding members provided between adjacent cathodes of superconducting members into which a refrigerant is introduced to be kept at the critical temp. or below. CONSTITUTION:An inert gas, such as gaseous Ar, is introduced into a sputtering chamber 20 of the above-mentioned sputtering device. Substrates 100 are mounted to substrate holders 37 while sputtering powers are adequately added to respective targets 1, 2a, 2b. The plural holders 37 mounted with the substrates 100 are continuously transferred into a chamber 20 and the thin films are formed on the substrates 100. The passage of magnetic lines of force between the magnetic poles of the adjacent targets is effectively prevented by the effect of the magnetic shielding members 15, 16 at the time of formation of these thin films. Since the generation of the confinement of the charge particles by the magnetic lines of force passing above the members 15, 16 like heretofore is thereby obviated, the splashing of the sputtering particles of, for example, Al, etc., constituting the members 15, 16 is effectively prevented and the intrusion of the materials, exclusive of the target materials into the thin films as impurities is effectively averted.
Patent JP-H0520806-A (JP)
Title: Actuator structure of magnetic disk apparatus
Inventor: MATSUSHITA TOSHIO
IPC: G11B21/02
Filed: 1991-03-06
Abstract: PURPOSE:To provide the actuator structure of a magnetic disk device, wherein an actuator for the magnetic disk device is molded integrally by using a nonmetal-based lightweight member and can be formed with good assembly accuracy. CONSTITUTION:An actuator 1 is molded integrally by using a nonmetal-based lightweight material, e.g. a plastic resin. A sheet-metal member 6 to which a load spring member 7 is attached and a collar member 5 which is used to mount a bearing 4 are buried in advance in and molded integrally to the actuator 1.
Patent JP-S53124437-A (JP)
Title: Image former having computer
Inventor: KAWAMO YOSHINORI
IPC: G03G15/22
Filed: 1977-04-06
Abstract: PURPOSE:To facilitate timing controlling and yet make possible the implementation of quick safety measures by connecting a process sate detection circuit in image forming process to the interruption port of a computer.
Patent JP-H0846019-A (JP)
Title: Electrostatic chuck
Inventor: SEMIYON SHIYAASUTEINSUKII
IPC: H01L21/683
Filed: 1995-02-28
Abstract: PURPOSE: To extend an effective product life, by cooling an entire wafer surface, especially edges, efficiently, and improving the fixing operation at the edges and contacting operator of wafer. CONSTITUTION: An electrostatic chuck for fixing a semiconductor wafer on a pedestal 34 has a plurality of openings 46 for introducing a cooling gas below the wafer. A plurality of openings 46 reduce overheating near the wafer edge and, at the same time, reduce the temperature gradient at both edges of the wafer. The wafer is retained by an electrostatic force for the lamination plate of an electrode layer that is sandwiched by two dielectric layers, so that a lamination plate 12 indicates a flat surface for the wafer regarding an essential distance from the outer edge of the electrode layer.  The lamination structure makes positive the contact state between a large wafer surface and the lamination plate 12 over the outer edge of the electrode to minimize the leakage of a cooling gas near the edges, and increases the length of the path of a dielectric material between the electrode layer and a harmful plasma material that surrounds a chuck.
Patent JP-S61199079-A (JP)
Title: Magnetic field generating apparatus in surface treating apparatus
Inventor: KIN KIYOUSHIYOKU
IPC: H01J37/32
Filed: 1985-02-28
Abstract: PURPOSE:To protect electric source circuit and to supply AC stably, by providing a specified short-circuiting means to a magnetic field generator, in a surface treating apparatus in which plasma generated in a vacuum vessel is highly densified by magnetic field. CONSTITUTION:A pair of coils 16, 17 are provided at both outer sides of the vacuum vessel 11, and a control circuit (a) is connected with the coils, a rectangular wave AC is supplied to the coils 16, 17 to generate magnetic field and plasma generated in the vessel 11 is highly densified. Film piling, etching, sputtering, cleaning, etc., are applied to the surface of material to be treated by said plasma. If rectangular wave AC is supplied to the coils 16, 17, the inverse electromotive force is generated at the ends of the coils 16, 17 when polarity of the current is changed. Then a means 23 for short-circuiting the inverse electromotive force is provided, and a controller 20 is connected thereto. Hereupon when changeover signal is outputted to changeover switches 21, 22, the signal is also transmitted to the means 3 to actuate it.
Patent JP-H0613442-A (JP)
Title: Method and apparatus for performing test, burn-in and/or programming of integrated circuit chip and mounting of solder bump thereon
Inventor: NIKORASU JII KUUPUMAN
IPC: G01R31/26
Filed: 1993-03-01
Abstract: PURPOSE: To make it possible to perform the burn-in and the test of a solder bump chip, without adverse effects on the reliability and the integration degree of a solder bump by dissolving sacrificial conductor layers into the bump and removing the chip from a temporary substrate, after connecting an integrated circuit chip to the temporary substrate through the solder bump. CONSTITUTION: Sacrificial conductor layers 22a and 22b are formed on a temporary substrate 20 having temporary substrate pads 21a and 21b at positions corresponding to input/output pads 12a and 12b on an integrated circuit chip 11. Neighboring solder bumps 15a and 15b are provided at the sacrificial conductor layers 22a and 22b on the integrated circuit chip 11. Then, the solder bumps 15a and 15b are heated. The solid-state mechanical and electrical connections are formed between the input/output pads 12a and 12b and the temporary substrate pads 21a and 21b. The integrated circuit chip 11 on the temporary substrate 20 is tested. Thereafter, the sacrificial conductor layers 22a and 22b are dissolved into the solder bumps 15a and 15b by heating, and the integrated chip 11, including the solder bumps 15a and 15b, is removed from the temporary substrate 20.
Patent JP-H02218749-A (JP)
Title: Resin composition
Inventor: NAKAJIMA TAKASHI
IPC: C08L67/00
Filed: 1989-02-20
Abstract: PURPOSE:To obtain a resin composition having excellent moldability, mechanical properties, chemical resistance and heat-resistance by compounding a polyphenylene ether resin with a thermoplastic polyester and/or an aromatic polyamide and a specific amount of a specific aromatic polycarbonate. CONSTITUTION:The objective composition is produced by compounding (A) 15-90wt.% of a polyphenylene ether resin produced by the oxidative polymerization of one or more kinds of monohydric phenolic compounds of formula (R1-R5 are H, halogen, etc.) with (B) 5-60wt.% of a thermoplastic polyester (e.g. polyethylene terephthalate) and/or an aromatic polyamide, (C) 5-80wt.% of a polycarbonate having an average molecular weight of 9,500-34,000 and containing 25-100wt.% (based on the whole carbonate bond-constituent unit) of a carbonate bond unit having one or more suspended aromatic groups and preferably (D) 0.5-80 pts.wt. of a styrene polymer based on 100 pts.wt. of A+B+C.
Patent JP-S63207458-A (JP)
Title: Preheating apparatus for submerged nozzle
Inventor: ISHIHARA SOSUKE
IPC: B22D41/60
Filed: 1987-02-25
Abstract: PURPOSE:To raise the repeatability of good preheating condition and to enable the stably preheating by burning after mixing air sending from a damper and gas sending a gas flowing controller and preheating a submerged nozzle in a preheating furnace. CONSTITUTION:A nozzle-mixing-burner 11 is set at the lower position of side part of the preheating furnace 6 and mixing with the air sending from a fan 7 through the damper 8 and the gas sending from the gas flowing controller 10 and burnt to preheat the submerged nozzle 5 in the preheating furnace 6. In the case of wanting to rapidly raise the temp. in the preheating furnace 6, all routes 13, 14, 15 are opened to send the gas, and to the contrary, in case of selecting optionally several among the above three routes, the gas quantity is relatively reduced and also the prescribed temp. is easily maintained.
Patent JP-H01266059-A (JP)
Title: Railway rolling stock
Inventor: ROI II SUMISU
IPC: B61F5/38
Filed: 1989-02-20
Abstract: PURPOSE: To smoothly run on curved rails by connecting together front and rear rolling stock main body parts through a connecting joint on a frame, and oscillatably operating the frame and the axles of respective rolling stock main body parts through links. CONSTITUTION: A connecting joint 16 is provided on the middle part of a frame 20 oscillatably provided with first and second axles 22, 24 positioned front and rear around shafts 26, 28, and first and second main body parts 12, 14 arranged in front and rear of the frame 20 are oscillatably connected together through the connecting joint 16. Third and fourth axles 30, 34 are oscillatably connected to the respective main body parts 12, 14. The first main body part 12 and the first axle 22, the second main body part 14 and the second axle 24, are respectively connected together through first and second links 40, 50. Further, the first main part 12 and the frame 20 and the third axle 30, the second main body part 14 and the frame 20 and the fourth axle 34, are respectively connected together through third and fourth links 60, 70 and bell cranks 64, 74.
Patent JP-H05283475-A (JP)
Title: Mounting method for flip chip
IPC: H01L21/60
Filed: 1992-01-30
Abstract: PURPOSE:To enhance the reliability of solder junction parts by a method wherein an IC chip adhered to a substrate with flux through the intermediary of solder bumps is processed by reflow keeping the IC downwards. CONSTITUTION:An IC chip 1 adhered on a substrate 4 through the intermediary of solder bumps 3 with flux 11 is made reflow with the IC downwards. Thus, the solder junction parts are pulled downwards by the deadweight of the IC chip 1 itself thereby extending the solder bumps 3 to the extent of the surface tention limit of the solder bumps 3. Accordingly, the solder bumps 3 without expanding sideways can avoid the bridge development even if the interval pitch between leads 5 is small. Besides, the life of solder junction parts for thermal cycle can be lengthened by the increased thickness of the solder junction parts due to the extended solder bumps 3. Furthermore, the solder bumps 3 can be made reflow at the temperature to be completely melted down due to the solder junction parts without expanding sideways. Through these procedures, the reliability of the solder junction parts can be enhanced.
Patent JP-H10308809-A (JP)
Title: Telecommunication equipment provided with magnetic device for peripheral equipment recognition
Inventor: POIREL ALAIN
IPC: H04M1/21
Filed: 1998-02-23
Abstract: PROBLEM TO BE SOLVED: To directly recognize the type of each peripheral equipment from known types in a signal step of connection of peripheral equipment to a main unit by directly generating a peripheral equipment identification signal in connecting the peripheral equipment to the main unit. SOLUTION: A ball effect sensor is installed on a main unit 10 and a miniaturized magnet is installed on a peripheral equipment 12. When two devices 10 and 12 are connected by a connector, the magnet is automatically installed facing the sensor and a magnetic transmitter pair is constituted. Once the N pole of the magnet has been installed facing the hall effect sensor, this sensor detects the magnetic field of the magnet and generates an output. Therefore, the sensor transmits a binary state (excited or non-excited) onto the respective outputs of a demultiplexer or a micro-processor for information processing. Thus, the type of peripheral equipment 12 is directly recognized from various known types in a single step of connection of peripheral equipment 12 to the main unit 10.
Patent JP-H01215246-A (JP)
Title: Substitute milk composition for material cattle and method for breeding material cattle
Inventor: IWASAKI TETSUHARU
IPC: A23K1/18
Filed: 1988-02-23
Abstract: PURPOSE:To obtain the title composition, consisting essentially of skim milk powder or soybean meal and containing triglyceride of a specific medium-chain fatty acid and absorbable as an energy source without loading maternal cattle due to a high absorption rate. CONSTITUTION:The objective composition, containing skim milk powder or soybean meal as a principal ingredient and obtained by blending >=0.5wt.%, preferably 0.5-20wt.% triglyceride of a 6-10C medium-chain fatty acid (fatty acid composition; 50-100wt.% 8C caprylic acid, 0-50wt.% 10C capric acid and a very small amount of other fatty acids). Furthermore, the composition is used for supplying nutriments to maternal cattle in the latter period of gestation and after delivery and an illness.
Patent JP-H05218187-A (JP)
Title: Fabrication of semiconductor substrate
Inventor: SAMEJIMA HIROYUKI
IPC: H01L21/336
Filed: 1992-01-30
Abstract: PURPOSE:To easily control formation of an insulating isolation region formed by epitaxial growth of a junction isolation substrate. CONSTITUTION:A fabrication process comprises the steps of forming an oxide film 3 on a region which a VDMOS of an n<+> semiconductor substrate 1, forming a p type semiconductor region 2 and a polycrystalline silicon layer 4 by epitaxial growth, and forming a second epitaxial growth region 7 which is an n type semiconductor region. With the fabrication method, there is eliminated the need of a phosphorus region in a VDMOS formation region which is continuously required for making the n<+> type semiconductor substrate 1 contact with the second n type epitaxial growth region 7. Thus, there can be solved a problem with autodoping.
Patent JP-H07248967-A (JP)
Title: Memory control system
Inventor: TANAKA KAZUHIKO
IPC: G06F12/08
Filed: 1994-03-11
Abstract: PURPOSE:To use many cache memories for a processor which is carrying out the processing of higher priority in a multiprocessor system by changing dynamically the capacity of the cache memory that is allocated to the processor in accordance with the priority of the processing which is carried out by the processor. CONSTITUTION:The priority of a processor 10 and that of a processor 11 are set at '3' and '1' respectively on a priority table contained in a cache controller 30. Under such conditions, a cache memory 40 is preferentially allocated to the processor 10. Then the numbers of cach entries available to both processors 10 and 11 are set at '3' per set for the processor 10 and at '1' per set for the processor 11 respectively. The numbers of cache blocks available to both processors 10 and 11 are proportional to the cache entry numbers. Therefore 3/4 entire capacity of the memory 40 is allocated to the processor 10, and remaining 1/4 capacity is allocated to the processor 11.
Patent JP-H07247390-A (JP)
Title: Nucleating agent for styrene resin and styrene resin composition
Inventor: NEGISHI YOSHIKAZU
IPC: C08K5/3417
Filed: 1994-03-11
Abstract: PURPOSE:To obtain a molding which has high crystallinity and a good appearance even in the case of molding using a low-temp. mold by using a styrene resin, having a syndiotactic structure, comprising a particular compd. CONSTITUTION:Halogenated phthalic anhydrides and various organic diamines are thermally dehydrated in an aprotic polar solvent, such as an arom. compd., subjected to nuclear substitution with a functional group inert to amino and carboxyl groups, or dimethylformamide. Alternatively, a potassium salt of a halogenated phthalimide and a hydrocarbon and an aryl compd. each substituted with two halogen atoms are heated in a polar solvent (Gabriel synthesis). Thus, a compd. of the formula, wherein >N-R-N< represents hydrazine or an org. diamine residue, X represents a halogen and n is 0 to 4, is obtd. This compd. is added in an amt. of 0.001 to 5wt.% to a styrene resin having syndiotacticity, and the resin compsn. is molded at 260 to 340 deg.C by press molding, injection molding or the like to prepare a molding.
Patent JP-H01216969-A (JP)
Title: Purification of n-substituted maleimides
Inventor: FUJITA TAKESHI
IPC: C07D207/448
Filed: 1988-02-25
Abstract: PURPOSE:To sufficiently remove impurities, prevent the simultaneous polymerization of a reaction mixture when distilled and thereby provide the subject compound having a high purity in a high yield, by washing the reaction mixture containing an N-substituted maleimide with a diluted alkali aqueous solution, rewashing the washed mixture with a diluted acid aqueous solution and subsequently distilling the rewashed mixture. CONSTITUTION:Maleic anhydride is reacted with an aromatic or aliphatic primary amine. The reaction mixture containing the obtained N-substituted maleimide is washed with a diluted alkali aqueous solution (e.g., NaOH) and the organic layer obtained from the washed mixture is again washed with a diluted acid aqueous solution (e.g., sulfuric acid or phosphoric acid), followed by distilling the rewashed mixture to provide the N-substituted maleimide (e.g., N-phenylmaleimide). The method can highly improve the yield of the distillation, prevent the simultaneous polymerization of the mixture during the distillation and greatly reduce the amount of distillation residues after the distillation.
Patent JP-H02220501-A (JP)
Title: Filter branching device
Inventor: TOGAMI NOBUHIRO
IPC: H01P1/213
Filed: 1989-02-21
Abstract: PURPOSE:To decrease a change in a characteristic by providing plural hand pass filters and leading out respective input/output terminals onto a board having a prescribed dielectric constant via a connection pin. CONSTITUTION:A low pass filter 14 and a band pass filter 20 are arranged between an antenna terminal 11 and a reception signal output terminal 12 in a case 10 and a band pass filter 15 is arranged so as to be located symmetrically to the band pass filter 20. The input and output terminals of the filters 15, 20 are led out via a connection pin 40 and the connection pin 40 is formed to interconnect printed circuit boards 30-33 each having a prescribed dielectric constant. Each printed circuit board (30-33) is formed by forming a prescribed pattern of conductive layer on a board and circuit components are connected to adjacent other circuit components via an input and output capacitor. Then the input and output terminal of the filters 15, 20 is able to be arranged on the side face, and a stable characteristic is obtained through the provision of the printed circuit boards 30-33.
Patent JP-H10234224-A (JP)
Title: Grain storage device
Inventor: MIZUSHIMA ATSUSHI
IPC: A01F12/60
Filed: 1997-02-25
Abstract: PROBLEM TO BE SOLVED: To provide a grain storage device capable of preventing the generation of a phenomenon obstructing the normal storage and discharge after the storage of grains inside the grain storage device and quickly discharging the grains. SOLUTION: For the grain tank 11 of this grain storage device, an auxiliary helical conveyor 40 is disposed other than a lower part helical conveyor 14. The auxiliary helical conveyor 40 is driven to rotate along with a tank lower part helical conveyor 14 and the transportation direction of the auxiliary helical conveyor 40 is made to function so as to transport the grains in a direction opposite to the tank lower part helical conveyor 14 and separate the grains turned to a lump shape. A bridge phenomenon inside the grain storage device often generated for obstructing the efficiency of grain discharge is prevented and the grains strongly stuck to a tank wall surface are smoothly discharged as well.
Patent JP-S55134795-A (JP)
Title: Pump
Inventor: YAMANAKA MASAHIDE
IPC: F04D29/22
Filed: 1979-04-06
Abstract: PURPOSE: To insure considerable reduction of cavitation by expanding the portion extremely small in sectional area of a communication passage with the inlet side portion of the blades of a vane made higher than its outlet side portion.  
     CONSTITUTION: A single-face open vane 1 is fastened on a rotary shaft. The open face 3 of the vane 1 is formed orthogonal with the shaft 2, and the relative wall face 4 opposite thereto positions parallel to the open face 3. The clearance (a) of the open face (3) and the wall face 4 is very narrow, i.e. corresponds to less than 10% of the diameter dϕ of the eye end of the vane 1. The relation between the height h 1  the inlet side 5 and that h 2  of the outlet side 6 of the vane 1 is such that h 1 >h 2 . Thereby, the very small portion in sectional area of a communication passage is expanded and cavitation is considerably reduced. Further, if h 2  is equalized to the height of conventional blades, cavitation can be reduced without lowering pumping characteristic. 
     COPYRIGHT: (C)1980,JPO&Japio