baber/WOPTO huggingface dataset:
Patent JP-S57172849-A (JP)
Title: Search eye device around vehicle
Inventor: KAWASAKI TERUO
IPC: G01S15/931
Filed: 1981-04-15
Abstract: PURPOSE:To prevent mis-detection of ranges for a device in which the range to an obstacle is detected by ultrasonic wave pulses by detecting smaller one out of ranges based on the time difference between transmission and reception of ultrasonic wave pulses and based on running ranges. CONSTITUTION:When a car moves backward approaching an obstacle D and the range between the car and the obstacle D reaches the first reference range, a passing pulse is sent from a reference range passing pulse generator 7. Then, a counter 9 counts running ranges of the car based on range signals from a running range sensor 8. An addition-subtraction circuit 10 subtracts the range data of the counter 9 from the first reference range, and sends the output to a range selection circuit 11, which compares the output from the addition-subtraction circuit 10 with the range data to the obstacle which are output from a range detector 29 of a range detection circuit 2, and it outputs the smaller range data out of the two to actuate a range indicator 3 and a warning unit 4.
Patent JP-S51130959-A (JP)
Title: Device for mixing plural liquids of the liquid chromotograph
Inventor: KIMURA SHIGEYUKI
IPC: G01N30/34
Filed: 1975-05-09
Abstract: PURPOSE:To supply supersonic waves into the mixing tube in which the plural liquids are to be mixed so as to accelerate and ensure the mixing.
Patent JP-H02233747-A (JP)
Title: Adhesive composition for hemming part of automotive body
Inventor: SHIBATA SEISHI
IPC: C09J127/06
Filed: 1989-03-08
Abstract: PURPOSE:To obtain the subject adhesive composition, excellent in flexibility, bonding durability, rust preventing properties, etc., and useful for hemming parts of automotive bodies by blending a vinyl chloride-based polymer with a plasticizer, epoxy resin, latent amine adduct type curing agent, latent curing agent and filler at a specific ratio. CONSTITUTION:An adhesive composition, consisting of (A) 100pts.wt. vinyl chloride-based polymer with (B) 20-100pts.wt., preferably 30-80pts.wt. plasticizer (e.g. di-2-ethylhexyl phthalate), (C) 20-300pts.wt., preferably 30-200pts.wt. epoxy resin, (D) 2-50pts.wt., preferably 3-40pts.wt. latent amine adduct type curing agent, (E) 3-60pts.wt., preferably 4-50pts.wt. latent curing agent (e.g. dicyandiamide) and (F) 30-200pts.wt. filler and obtained by preferably finely dispersing the total amount of the components (D), (E) and (F) in 20wt.% component (B) and the total amount of the component (C), then kneading and blending the resultant dispersion with a plastisol consisting of the total amount of the component (A) and the residual component (B).
Patent JP-2000246502-A (JP)
Title: Fine cutting method and device
Inventor: NAGATA MASANARI
IPC: B23H5/08
Filed: 1999-03-03
Abstract: PROBLEM TO BE SOLVED: To form a stable passive state film on a work piece without applying increased electrolytic voltage, and shorten time required for cutting. SOLUTION: This device is provided with an electrolytic power supply part 11 applying electrolytic voltage between a workpiece 4 and an electrode 5, a contact condition detecting part 12 capable of detecting the contact of the workpiece 4 with a fine cutting tool 6 based on fine current caused by the contact of the workpiece 4 with the fine cutting tool 6, and with a fine cutting device 1 having a main control part 13 controlling the respective parts of fine cutting device 1.
Patent JP-S57169988-A (JP)
Title: Working set managing system
Inventor: OONO NAOYA
IPC: G06F12/12
Filed: 1981-04-14
Abstract: PURPOSE:To reduce the overhead for working set re-evaluation by avoiding the re-evaluating to a set frame where the maximum number and the minimum number of the number of pages permitted to the working set frame are coincident. CONSTITUTION:Each frame of a working set (WS) frame block 1 is provided with a field storing the maximum and minimum numbers (MXi and MNi) of the page number, and the WS re-evaluation is skipped for the WS frame where the numbers MXi and MNi are coincident at a comparison circuit 7. Thus, the overhead for the WS re-evaluation can be reduced in the WS managing system.
Patent JP-S63221688-A (JP)
Title: Semiconductor laser array
Inventor: TAKAHASHI MASANOBU
IPC: H01S5/06
Filed: 1987-03-10
Abstract: PURPOSE:To stabilize the light intensity distribution of an oscillation laser light by introducing laser light phase-shifted by a phase shifter to a laser oscillation region to oscillate laser light of the same wavelength, and providing a second semiconductor laser which does not generate a phase synchronization to control the phase of the oscillation laser light. CONSTITUTION:The light irradiated from a first semiconductor laser 7 is converted by a lens 8 to a parallel beam, then passed through an optical isolator 13, branched by partial transmission mirrors 9a, 9b, 9c and a total-reflection mirror 10a, and introduced to phase shifters 11a, 11b, 11c, 11d. It is phase-shifted by the shifters 11a-11d, reflected by total-reflection mirrors 10b-10e, and introduced through a condenser lens 12 to laser oscillation regions 6a-6d. Accordingly, the phase shifting amounts of the phase shifters 11a-11d are adjusted, and the wave surfaces of the laser lights irradiated from the regions 6a-6d are adjusted to stabilize the light intensity distribution of the irradiated light.
Patent JP-S59183185-A (JP)
Inventor: ISHIHARA TOSHIHARU
IPC: E04H5/02
Filed: 1983-03-31
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H07260446-A (JP)
Title: Image processor
Inventor: HASEGAWA JUN
IPC: G06T7/00
Filed: 1994-03-25
Abstract: PURPOSE:To provide an image processor in which the profile of an object can be estimated, error of the estimated profile can be grasped, and the reliability of estimated profile can be evaluated. CONSTITUTION:In addition to a CPU and the like, an image processing means 47 comprises means 50 for detecting same positions on a plurality of images of one object picked up at a plurality of points, means 51 for estimating the position of each image pickup means based on the same position on each image, means 52 for estimating the three-dimensional profile of the object based on the same positions detected by the position detecting means 50 and the position (movement) of each image pickup means estimated by the position estimating means, and means 53 for classifying a plurality of images of one object into several sets to produce three-dimensional profiles and then averaging the three- dimensional profiles to obtain one profile. The image processing means further comprises means 54 for estimating the error in the estimated three-dimensional profile of the object caused by positional detection miss, and means 55 for synthesizing the estimated three-dimensional profile of the object and the error thereof.
Patent JP-H07267015-A (JP)
Title: Manufacture of molding
Inventor: YADA YUKIHIKO
IPC: B44C5/00
Filed: 1995-03-15
Abstract: PURPOSE:To enable bending work by joining a main body to a single surface of a metallic foil sheet layer in the nondecorative surface part, and joining leg parts of ionomer resin to the other surface of the metallic foil sheet layer. CONSTITUTION:For example, a bumper molding 1 is composed of a main body 2 and leg parts 5 having a grip action. This main body 2 is molded by soft synthetic resin such as PVC, and a decorative surface 3 is formed on an outside surface. The leg parts 5 are molded by ionomer resin, and the tip sides are formed as two pieces having a spring action, and are used as a grip. The base part 6 is slightly embedded in the reverse 4 of the main body 2, and is joined by a joining part 7. This joining part 7 is formed through a metallic foil sheet layer 8. That is, for example, the main body 2 is adhered to a single surface of aluminium foil 8 having a thickness of about 100mu in a part except the decorative surface 3 through an adhesive layer 10. The leg parts 5 are adhered to the other surface of the aluminium foil 8 by heating melting.
Patent JP-H10255504-A (JP)
Title: Vehicular lighting fixture
Inventor: HONDA HIDEHIRO
IPC: F21V7/00
Filed: 1997-03-11
Abstract: PROBLEM TO BE SOLVED: To improve the appearance and mounting operation of a vehicular lamp. SOLUTION: A wraparound part 120 corresponding to a dummy reflecting surface 6 on which direct light from the light source bulb 5 of a lamp housing 1 is unlikely to be incident has a thicker wall thickness that other parts. Alternatively, a heat insulating material is provided on the back of the wraparound part 120 corresponding to the dummy reflecting surface on which direct light from the light source bulb of the lamp housing is unlikely to be incident. As a result, the temperature difference between the wraparound part 120 and other parts can be reduced and formation of water droplets (fog) on the dummy reflecting surface 6 can be prevented, leading to improved appearance.  Moreover, since the wall thickness of the wraparound part 120 is increased for increased strength and the heat insulating material having the cushioning property is provided, damage to the wraparound part 120 can be prevented even when it collides against the body of vehicle at the installation of a lighting fixture on the body of the vehicle.
Patent JP-H06133460-A (JP)
Title: Stability monitoring apparatus for electric power system
Inventor: SUZUKI MAMORU
IPC: H02J3/24
Filed: 1993-02-22
Abstract: PURPOSE:To monitor stability accurately by computing the fixed value and the intrinsic vector, which indicate the fluctuating state based on the system constitution and the operating state inputted from an electric power system. CONSTITUTION:A first operating means 1 selects a mode for monitoring the operation of an electric power system 5 beforehand and obtains the fixed value and the intrinsic vector of the selected mode. A second operating means 3 obtains the fixed value and the intrinsic vector, which indicate the fluctuating state when the electric power system 5 is operated. A display part 4 obtains to which mode of the already obtained results operated by the first operating means 1 the result operated by the second operating means 3 is approximate and outputs the result. Thus, the stability of the electric power system 5 can be monitored readily and accurately at the time of on-line or off-line operation.
Patent JP-H11253483-A (JP)
Title: Disposable diaper
Inventor: KUWABARA RIE
IPC: A61F13/15
Filed: 1998-03-09
Abstract: PROBLEM TO BE SOLVED: To prevent exretion from being left on a surface sheet by removing the same from a plurality of openings, which are formed by adhering a side edge of an outer side with the central portion of a hip part of a disposable diaper positioned as the center thereof, and forming overlapped pleats with a dide edge of an inner side made as a free edge. SOLUTION: This disposable daiper has a surface sheet 1 comprises a a plurality of first surface sheets 13 arranged in an overlapped manenr in the longitudinal direction, and a plurality of second surface sheets 14 arranged in a mutually overlapped manner in the widthwise direction between opposed end regions. A side edge 17 positioned outside with a portion 16 positioned at a hip central part made as the center thereof is adhered to an adhering part on a surface of an absorbing body 3 so that the side edge positioned at an inner side of the disposable diaper formes a free edge and pleates are formed by the free edge at the overlapped poritions of the adjacent sheets. A front and rear double-face sheet is extended at the outside of widthwise opposed sides of the absorbing body 3 to form a side flap 19.
Patent JP-H11255528-A (JP)
Title: Molding apparatus for optical element
Inventor: KOBAYASHI TAKASHI
IPC: C03B11/12
Filed: 1998-03-09
Abstract: PROBLEM TO BE SOLVED: To reduce a temperature distribution occurring in the interior of an optical element obtained by extrusion molding, by heating a pair of molding molds to different temperatures. SOLUTION: In this optical element molding apparatus in which an optical element material is molded by a pair of molding molds in a cylindrical sleeve, the apparatus is equipped with the cylindrical sleeve 9 having holes 11 formed from both the end parts in the axial direction, infrared ray lamps 16a and 16b which are inserted into the holes 11 to heat an upper mold 7, a lower mold 8 and the optical element material 1 and a control apparatus for individually controlling the infrared ray lamps 16a and 16b to make a difference in temperature between the upper mold 7 and the lower mold 8.
Patent JP-H04291520-A (JP)
Title: Signal processing unit
Inventor: OCHI ATSUO
IPC: H04B1/62
Filed: 1991-03-20
Abstract: PURPOSE:To enhance the waveform reproducibility without reducing an emphasis quantity by providing a preshoot and an overshoot to the waveform. CONSTITUTION:An input signal is inputted to a transmission circuit 2 whose transfer characteristic is G, and its output has a waveform having an overshoot when the circuit 2 is an emphasis circuit and is distributed into two series, and they are inputted to storage means 3, 5. An input signal to the means 3 is read in a reverse time series to a time series at the storage and inputted to a transmission circuit 4 whose transfer characteristic is G. Thus, an overshoot and a preshoot are formed to both leading and trailing edges. Furthermore, the input signal to the means 5 is stored with a delay by only M/2 from a timing stored in the means 3 and the time axis is inverted for each period M. A switch 7 selects an output signal of the circuit 4 or 6 and the selected signal is outputted. Moreover, an emphasis waveform having a preshoot and an overshoot with respect to the input signal is obtained by inverting the time axis for each period M at a storage means 8.
Patent JP-S62213645-A (JP)
Title: Heater
Inventor: TACHIBANA TETSUYA
IPC: F24H1/00
Filed: 1986-03-14
Abstract: PURPOSE:To provide the titled heater with general-purpose properties and permit the heater to effect hot-water heating simply by employing various warm-air heating machines as a heat source by a method wherein a heat exchanging unit is designed so as to be attachable easily to and detachable easily from the warm-air heating machine easily. CONSTITUTION:The whole or the front panel 1a of a case 1A constituting a warm-air heating machine 1 is constituted of an iron member or like while a magnet 3 is fixed to a proper position on the back surface 2a of a case 2A constituting a heat exchanging unit 2. Accordingly, the heat exchanging unit 2 can be attached to or detached from the front panel 1a of the warm-air heating machine 1 easily by the magnet 3. The warm-air heating machine 1 sucks atmosphere and combustion gas in a combustion tube 5 is discharged to the outside of the machine 1 again from a warm-air blow-off port 1b. Heat exchange with indoor air is effected in a heat exchanger 4 during this period to effect room heating. In this case, the heat exchanging unit 2 is arranged in the warm-air blow-off port 1b of the machine 1, therefore, heat medium, such as hot-water, is heated by depriving heat from the warm-air and room heating may be effected.
Patent JP-S55150426-A (JP)
Title: Gas pressure regulator with backfire preventive unit
Inventor: NISHIKAWA SHIGEO
IPC: F23D14/82
Filed: 1979-05-09
Abstract: PURPOSE: To completely shut off the backfire when occurring the backfire and exactly prevent the explosion by integrally assembling a check valve unit for shutting off the gas flow passage by the high pressure of the backfire and a flame extinguisher with the body of a gas pressure regulator.  
     CONSTITUTION: Gas is normally introduced from an entrance passage 6 through a rear portion of a cylinder 5 and the supply passage 9 in a valve casing 7 to push a check valve 12 to open it into an insertion chamber 14 and sequentially through a hole 15, a guide chamber 1i, a flame extinguishing filter 20 and an exhaust passage 19. When a backfire occurs during welding work or the like, it is extinguished during passage of the filter 20, and the valve 12 is closed by the high pressure introduced into the chamber 14. Further, the valve casing 7 is urged backwardly to allow the safety port 10 to urge against a spring 11 so that the casing 7 is moved backwardly to shut off the gas due to the contact between the shut- off valve 8a and the valve seat 8b. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S53141369-A (JP)
Title: Treatment of article with thermosetting resin
Inventor: TAMAOKI AKINOBU
IPC: B05D7/00
Filed: 1977-05-16
Abstract: PURPOSE: To prevent the crack formation of a resin layer and the peeling phenomena between an article and the resin layer, by providing a primer layer and stress-relation layer on the surface of the article, in a coating or bonding process of a thermosetting resin on said surface. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-H08226831-A (JP)
Title: Connecting device of water meter
Inventor: YODA AKIRA
IPC: E03B7/00
Filed: 1995-02-20
Abstract: PURPOSE: To provide a connecting device by which the replacement operation of a water meter can be performed without stopping a water supply and by which the convenience and the operating efficiency of a water supply user are enhanced. CONSTITUTION: A connecting device is provided with one pair of connection parts 3, 4 which are faced via a base part 2. An upstream-side connection water conduit part 3s which is provided with an upstream-side outer end port 3o to which an upstream-side water pipe is connected at the outside and with an upstream-side inner end port 3i to which one end of a water meter M is connected at the inside is installed at the connection part 3 on one side. A downstream-side connection water conduit part 4s which is provided with a downstream-side outer end port 4o to which a downstream-side water pipe is connected at the outside and with a downstream-side inner end port 4i to which the other end of the water meter M is connected at the inside is installed at the connection part 4 on the other side.  In addition, the connecting device is provided with a bypass water conduit part 5 which communicates with the upstream-side connection water conduit part 3s and the downstream-side water conduit part 4s and with a changeover valve 6 which selectively changes over the upstream-side inner end port 3i or the bypass water conduit part 5 with reference to the upstream-side end port 3o.
Patent JP-H07247622-A (JP)
Title: Hollow, lightweight, hardened gypsum body
Inventor: MURATA YOSHIHIKO
IPC: B32B13/04
Filed: 1994-03-03
Abstract: PURPOSE:To promote drying during manufacturing and to enable wiring to be passed inside of a wall. CONSTITUTION:A hollow, lightweight, hardened gypsum body 1 has solid gypsum layers 2, 2 on both sides of its foam gypsum layer 3 inside which are hollow parts 4 each made by an air-permeable member 5. The gypsum body has at least one hollow part or more which extends the overall length of the gypsum body. The hollow part has a selected shape out of circular, elliptical, square, rectangular, pentagonal, and hexagonal cross sections and has a bore of 10 to 50mm. The air-permeable member is made of paper.
Patent JP-H06270336-A (JP)
Title: Ceramics/ceramics joined object and joining method
Inventor: FUJII TOMOYUKI
IPC: B32B18/00
Filed: 1993-03-17
Abstract: PURPOSE:To provide a ceramics/ceramics joined object enhanced in strength and having a joining interface excellent in airtightness. CONSTITUTION:In a joined object of an alpha-alumina member and an insert material, a reaction layer containing at least one of a spinnel, alumina, magnesia, aluminum and oxygen is formed to the joining interface of the alpha-alumina member and the insert material. This joined object is produced by bringing the insert material composed of which at least the surface of the part to be joined to the alpha-alumina member is composed of an Mg-containing alloy layer into contact with the surface of the alpha-alumina member and heating the alpha-alumina member and the insert material to temp. equal to or lower than the solid phase line of the alloy layer in this state to form an Mg conc. layer or MgO layer on the surface of a metal to bond both of them under pressure.
Patent JP-H04292618-A (JP)
Title: Epoxy resin composition
Inventor: NAKADA YOSHIHIRO
IPC: C08L63/00
Filed: 1991-03-20
Abstract: PURPOSE:To obtain the subject composition having excellent heat-resistance, flexibility, crack resistance, mold-releasing property, adhesiveness and hydrophobicity by compounding an epoxy resin with a specific phenolic novolak resin, a polyallylphenol, a polyglycidylphenylsiloxane, etc. CONSTITUTION:The objective resin composition can be produced by using (A) an epoxy resin as a base resin and compounding with (B) a phenolic novolak resin of formula I, (C) a curing agent consisting of a polyallylphenol having 3-10 recurring units of formula II, (D) a polyglycidylphenylsiloxane of formula III, (E) a modifier consisting of a polydimethylsilphenylenesiloxane/ polydiglycidylsiloxane copolymer of formula IV and preferably further (F) a modifier consisting of a maleimide resin of formula V.
Patent JP-H02237053-A (JP)
Title: Packaging of semiconductor chip
Inventor: TANIGUCHI MASAHITO
IPC: H05K9/00
Filed: 1989-03-09
Abstract: PURPOSE:To prevent electromagnetic interference between semiconductor chips, a crosstalk in a signal, oscillation phenomenon and the radiation of electromagnetic waves to the outside of a semiconductor device and to contrive the facilitation of a bonding work by a method wherein a recessed part is provided in a dielectric substrate and the chips packaged desirably by a wave absorber are packaged in such a way that they are buried in this recessed part. CONSTITUTION:Semiconductor chips 5 are inserted in a hole for chip use of a tape carrier 25, leads 27 are bonded on electrodes to correspond to the leads 27 to mount the chips 5 on the carrier 25 and after the chips 5 are mounted on a wave absorber package 10, the package 10 is fitted in a recessed part 20 of a dielectric substrate 3 and the package 10 is fixed in the recessed part 20 with a bonding agent 23. Moreover, the and part of each lead 27 of the carrier 25 is superposed on the terminal of each pattern 8, which corresponds to each lead 27, on the surface of the substrate 3 and each lead 27 and each pattern 8 are connected to each other. Then, a wave absorber cap 15 is fitted into the upper parts of 4 spacing pillars of the package 10 and is fixed with a bonding agent or the like to cap the cap 15. Thereby, a bonding work is facilitated, each semiconductor chip 5 is electromagnetically shielded and electromagnetic interference is prevented.
Patent JP-H03257656-A (JP)
Title: Connection switching device for multiprocessor
Inventor: NAKAMOTO HIKO
IPC: G06F15/16
Filed: 1990-03-08
Abstract: PURPOSE:To couple multiprocessors in the optimum state by executing a processing for applied work in a series of procedures while using a (p) pieces of processors out of an (n) pieces of processors. CONSTITUTION:The (n) pieces of processors are composed of a first processor 1, second processor 2... the (n)th processor 4. The signals of connecting lines 20-22 in the respective processors and of a connecting line 28 in an external control means 6 are taken into a connecting line switching means 5 and respective control signal 24-26 from the respective processors 1-4 and a control signal 27 from the control means 6 are inputted to a sequencer 7 to generate a switch signal 29 for switching the connecting line of a connecting line switching means 5. For a signal to couple the respective processors and to switch connection with the external control means 6, the switch signal 29 is generated from the sequencer 7 and the respective processors are switched while executing entire synchronization. Thus, the multiprocessors are coupled while executing optimization.