baber/WOPTO huggingface dataset:
Patent JP-H10154650-A (JP)
Title: Coating liquid applying method
Inventor: SANADA MASAKAZU
IPC: B05D1/40
Filed: 1996-11-25
Abstract: PROBLEM TO BE SOLVED: To maintain a good uniformity of film thickness on a large-size substrate and to enlarge an area in which the film thickness can be controlled. SOLUTION: A coating film of a desired thickness is formed by supplying a coating liquid to a substrate. Supply of coating liquid around the center of the surface of the substrate is started at the time tS when the number of revolutions of the substrate is started to increase to the number of revolutions for supply R3 which is relatively high. Supply of coating liquid is stopped at the time tE when the number of revolutions of the substrate reaches R3. The substrate is rotated at the number of rotations for film forming R4 between t3 and t4 to form a coating film. In order to control the film thickness, the number of rotations is not adjusted by a large amount but the time of rotation without supply TH is adjusted during which the substrate is rotated at R3.
Patent JP-H10151563-A (JP)
Title: Chemical machine grinding device
Inventor: TAKAOKA YUJI
IPC: B24B53/017
Filed: 1996-11-25
Abstract: PROBLEM TO BE SOLVED: To provide a chemical machine grinding device capable of reducing dispersion concerning recovery of a pad surface by dressing and precisely and stably recovering the pad surface. SOLUTION: A grinding pad 107 is adhered on an upper surface of a platen 101, and a wafer carrier 111 to hold a wafer 109 to be ground against a pad surface 107a is provided above this polishing pad 107. This wafer carrier 111 is constituted free to make the wafer 109 precisely contact with the pad surface 107a. A dresser part 113 to recover the pad surface 107a is provided on the wafer carrier 111, and this dresser part 113 is constituted to vertically move. A ring shape dresser is provided on a lower part of the dresser part 113. Consequently, it is possible to reduce dispersion concerning recovery of the pad surface by dressing and to precisely and stably recover the pad surface.
Patent JP-2000146775-A (JP)
Title: Apparatus for automatically injecting sample
Inventor: TOMITA MASAMI
IPC: G01N1/00
Filed: 1998-11-04
Abstract: PROBLEM TO BE SOLVED: To adjust without using a special jig or the like the relative positional relationship between a rack capable of mounting a plurality of sample containers and a sampling needle relatively moving in horizontal and vertical directions to the rack. SOLUTION: A small hole 5 and/or a cross line 6 as adjustment reference points necessary in adjusting a relative positional relationship between a sampling needle 2 and a rack 1 is set beforehand on the rack. It is accordingly not necessary to prepare an expensive jig for the adjustment, and the labor of storing and managing the jig not to be lost is saved. Moreover, even in a state in which a jig is not prepared at a use spot of an analytical instrument, the relationship can be correctly and easily adjusted.
Patent JP-H03173488-A (JP)
Title: Semiconductor laser element
Inventor: KANEIWA SHINJI
IPC: H01S5/00
Filed: 1989-12-01
Abstract: PURPOSE:To improve heat dissipation to a heat sink without exerting adverse influence upon laser characteristics, by constituting a clad layer in such a way that the heat sink side part has a composition whose thermal conductivity is higher than the active layer side. CONSTITUTION:A semiconductor laser element has an active layer 13 and a clad layer 9 in a chip in contact with a heat sink 20, which clad layer is adjacent to the heat sink 20 side of the active layer 13. The clad layer 9 is constituted of a first clad layer 21 formed on the active layer 13 side and a second clad layer 22 formed on the heat sink 20 side. The thermal conductivity of a second clad layer 22 is higher than that of the first clad layer 21. The above active layer 13, the active layer side part 21 of the clad layer 9, and the heat sink 20 side part 22 of the clad layer 9 are composed of the following, respectively; Ga1-xAlxAs, Ga1-yAlyAs, and Ga1-zAlzAs, where x<z<=y.
Patent JP-H09153575-A (JP)
Title: Manufacture of semiconductor device
Inventor: TSUTSUI HIROAKI
IPC: H01L23/34
Filed: 1995-12-01
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device, in which warp or deformation in bonding face without using a complex manufacturing step. SOLUTION: In a semiconductor device in a plated heat sink(PHS) structure, an Au layer, 8 is plated on a rear face of a GaAs substrate 1. After the Au layer 8 aligned in the (111) direction is formed in the plating step, the Au layer 8 is subjected to heat treatment in a way that the Au layer 8 has (200) orientation before the GaAs substrate 1 is fabricated in a package 9 with solder. The heat treatment step may be carried out to the GaAs substrate 1 just after the Au layer 8 is formed, or may be carried out concurrently when the GaAs substrate 1 with the plated Au layer 8 is mounted on the package 9 in a soldering step.
Patent JP-2001132193-A (JP)
Title: Building material
Inventor: MATSUSHIMA SEIYA
IPC: F24F1/02
Filed: 1999-11-04
Abstract: PROBLEM TO BE SOLVED: To provide a building material exerting a heat insulating effect and a heating/cooling function by a part itself by arranging a building part storing a Peltier module in a heat insulation gap. SOLUTION: The Peltier module 2 heating or cooling at least one of an inside plate 3 and an outside plate 4 is arranged in the heat insulation gap 7 formed by the inside plate 3 and the outside plate 4 face to face at the prescribed interval for use as a building part P for an outer wall forming material or a window forming material in this building material.
Patent JP-H06147120-A (JP)
Title: Regeneration method of cryo-pump
Inventor: NOMURA KAZUO
IPC: F04B37/08
Filed: 1992-10-29
Abstract: PURPOSE:To provide a regeneration method by which gas discharge ability can be recovered in a short time. CONSTITUTION:H2 gas of a low boiling point that is about the same as that of a refrigerant is first poured into a vacuum chamber (S53), and then, N2 gas of a middle boiling point that is higher than the above poured in (S57). Accordingly, neither the low boiling point gas first injected not the middle boiling point gas injected next is condensed or congealed in the vacuum chamber, and the internal pressure of the chamber rises up and the rate of heat conduction in the chamber is improved, and cryo-panel is effectively heated by means of heat from a heating means or the like provided at the outer periphery portion of the chamber (S58), so gas condensed or the like at the panel is evaporated in a short time and exhausted, and the gas discharge ability of a cryo-pump is recovered.
Patent JP-2000140745-A (JP)
Title: Method and device for film formation
Inventor: TADANO FUMIO
IPC: B05D5/00
Filed: 1998-11-05
Abstract: PROBLEM TO BE SOLVED: To provide a thick film which has a film thickness enough to give a shock resistance and is excellent in the smoothness of the film surface, a method for forming a colored thick film, and a device therefor. SOLUTION: This film formation method involves an adhesion process where a coating liquid to be a coating film is sprayed on the surface 12a of a substrate 12, on which the coating film is formed, to be stuck to the surface, and a film formation process where the substrate 12 is axially rotated around the almost central part of the surface to form the coating film comprising the coating liquid. When the coating film is formed by a spray method, the atomization pressure of the coating liquid is preferably set to 1.5-5 kg/cm2, the discharge rate of the coating liquid is desirably to 3-10 cc/min, and the distance from the discharge part, for example, a tip end of a spray nozzle, of the coating liquid to the surface of the film formation is preferably set to 30-100 mm.
Patent JP-H01157926-A (JP)
Title: Novel bisphenols and production thereof
Inventor: SAKAMOTO HIDEJI
IPC: C08G63/18
Filed: 1987-12-14
Abstract: NEW MATERIAL:Bisphenols expressed by the formula (n is 4-12). EXAMPLE:1,1-Bis(3-phenyl-4-hydroxyphenyl)cyclohexane. USE:Useful as a raw material for high polymers, such as polycarbonates, aromatic polyesters, epoxy resins and polysulfones. PREPARATION:o-Phenylphenol in an amount of 2.2-6mol is reacted with 1mol ketones, such as a 5-13C cycloalkyl ketone (e.g., cyclopentanone or cyclohexanone), in the presence of an acidic catalyst in or without a solvent at 20-150 deg.C to afford the aimed compounds expressed by the formula.
Patent JP-H11132943-A (JP)
Title: Gas analyzer
Inventor: KAWAGUCHI TAKEO
IPC: G01N21/35
Filed: 1997-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a gas analyzer in which the reliability of a measured result can be enhanced. SOLUTION: A gas analyzer 124 is featured so as to be provided with a sample cell 128 into which a sample gas with intermingled<12> CO2 and<13> CO2 is filled and which is arranged in such a way that infrared light L1 and infrared light L2 from a light source 126 are passed through the sample gas, with a changeover means 130 which is arranged in such a way that infrared light L3 and infrared light L4 from the sample cell 128 are passed alternately and with a Golay cell 110 which detects changes in a pressure inside an absorption chamber alternately when a gas, for detection,  in which only the<12> CO2 and the<13> CO2 are mixed in a prescribed existence ratio is sealed in an absorption chamber and when the infrared light L3 in a<12> CO2 absorption band is incident on the absorption chamber as well as when the infrared light L4 in a<13> CO2 absorption band is incident on the absorption chamber and in which the changes are output as intensity information of the infrared light L3 and the infrared light L4 which are incident on the absorption chamber are output.
Patent JP-H03176654-A (JP)
Title: Method and device for inspecting solder zone
Inventor: SUZUKI TAKAYUKI
IPC: G01N21/956
Filed: 1989-12-05
Abstract: PURPOSE:To easily, speedily, and securely detect a defect by measuring infrared rays emitted by the solder zone and deciding whether or not there is the defect, irradiating the solder zone with infrared rays, and measuring the quantity of its reflected infrared rays and deciding the state of the defect. CONSTITUTION:A heating means 12 heats a circuit board 1 uniformly at constant temperature. The heated board 1 is taken out of a heating tank, fixed on an X-Y-Z stage 14, and set at a specific position, an infrared ray measuring means 16 measures the distribution of the quantity of infrared rays, and the output signal of the means 16 is processed 10. Then an irradiation means 15 irradiates the solder zone with infrared rays and its reflected infrared rays are measured 16 to perform data processing. In the data processing, the information from the means 16 is A/D converted and sent to an arithmetic circuit, which performs various arithmetic processes (calculation of maximum and minimum values, etc.) and sends the results to a comparing circuit. The comparing circuit extracts information on the distribution of the quantity of infrared rays of a good article under the same conditions with an object of inspection inputted to a storage means and compares the information with the information from the arithmetic circuit to extract the features of various solder defects, thus detecting the soldering defect.
Patent JP-2000140827-A (JP)
Title: Method for recovering material in water or soil with high water content and adsorptive composition used in aforementioned method
Inventor: INOUE HITOSHI
IPC: B09C1/02
Filed: 1998-11-05
Abstract: PROBLEM TO BE SOLVED: To recover a material from a large amt. of water or the soil with a high water content without need for special equipment. SOLUTION: An absorptive composition consisting of a large number of magnetic grains and enabled to absorbing a specified material is infiltrated into water or soil contg. the specified material to be recovered to absorb the material in the water or soil. Then the composition having absorbed the specified material is separated and recovered from the water or soil using a magnet.
Patent JP-H01155983-A (JP)
Title: Ac electrode utilizing dielectric
Inventor: NAGANO YOSHINORI
IPC: C02F1/04
Filed: 1987-12-12
Abstract: PURPOSE:To increase the purity of a concd. soln. and thermal efficiency by coating the conductor of an electrode with a dielectric and making the electrode waterproof. CONSTITUTION:The conductor 3 of an AC electrode 7 is coated with a dielectric 2 and the obliquely lined part of the dielectric 2 is adhered to make the electrode waterproof. A pair of such waterproof electrodes are fitted to an apparatus for concentrating an electrolytic soln. and the electrodes are connected in series with the electrolytic soln. Since each of the conductors 3 is connected to the electrolytic soln. through the dielectric 2, the emission of electrons from the conductors 3 is prevented, electric power is not consumed and the electrolytic soln. is effectively heated and concentrated.
Patent JP-2001128539-A (JP)
Title: Combine
Inventor: MATSUZAWA HIROKI
IPC: A01F12/48
Filed: 1999-11-05
Abstract: PROBLEM TO BE SOLVED: To suppress the increase, etc., of husked rice even performing a wet threshing work. SOLUTION: This combine having a threshing part for performing a threshing of reaped cereal culms and a sorting part for performing a sorting of the thresh- treated materials, and capable of automatically changing a winnower position for adjusting the wind of the winnower as a sort-controlling means at a prescribed dial-setting position, is provided by holding the rotation of an engine on working at a lower state than the prescribed value on setting the winnower- adjusting dial at the strongest position.
Patent JP-H10154794-A (JP)
Title: Semiconductor integrated circuit device
Inventor: INAO TAKUJI
IPC: H01L27/04
Filed: 1996-11-26
Abstract: PROBLEM TO BE SOLVED: To make it possible to alter the characteristics of a circuit element and to make it possible to evaluate the characteristics of an intrinsic circuit operation without performing a fuse blow treatment by a method wherein the semiconductor integrated circuit device is provided with a single characteristic evaluation adjusting pad, which is used for an evaluation of the characteristics of the circuit element and an adjustment of the characteristics of the intrinsic circuit operation. SOLUTION: The main part of a semiconductor integrated circuit device is constituted of a characteristic evaluation adjusting pad (special pad) 1, inner-element pads 2 and 3, N-MOS and P-MOS transistors 4 and 5 which are elements for characteristics evaluation use, a control circuit 6 and a potential fixing circuit 7. In the state of the normal use of the circuit element, a potential in the pad 1 is fixed on a supply voltage by the circuit 7. When the potential in the pad 1 is fixed on a ground potential, an adjustment of an increase in the pulse width of a reference clock signal at the time when an access operation and a write operation are executed is made possible without cutting a fuse circuit.  Moreover, when the potential in the pad 1 is fixed to the ground potential and potentials in the inner-element pads 2 and 3 are fixed to the power potential, the evaluation of the characteristics of the transistor 4 or the like can be made.
Patent JP-H04268511-A (JP)
Title: Manufacture of optical coupler for macromolecular optical fiber
Inventor: ANDOREASU BUROTSUKUMAIYAA
IPC: C03B37/15
Filed: 1991-11-28
Abstract: PURPOSE: To enable easy, inexpensive and relatively rapid production of a mechanically stable coupler. CONSTITUTION: An optical fiber 2 is warmed to 50 to 250 deg.C for 0.2 to 3 hours, prior a process for producing the optical coupler for the high-polymer optical fiber by using ultrasonic welding. This high-polymer optical fiber 2 is introduced into a plastic pipe 3. Both the plastic pipe 3 and the optical fiber 2 are melted to form an integral object at the time of the welding operation. In a separate embodiment, a connector bar having the same refractive index as the refractive index of the core material of the high-polymer optical fiber 2 is inserted into the plastic pipe. The high-polymer optical fiber 2 is then brought into contact with the connector bar. The plastic pipe 3, the connector bar and the optical fiber are welded to each other, under the effect of ultrasonic waves.
Patent JP-H09140027-A (JP)
Title: Cover for board
Inventor: WATANABE MASAYUKI
IPC: H02G3/12
Filed: 1995-11-09
Abstract: PROBLEM TO BE SOLVED: To increase the work efficiency in an electric installation work and reduce the construction cost by locating claw sections which have female screw holes behind the edge of a hole made at the center by the space enough to keep the edge of a blade of an electric cutter away from the claw sections. SOLUTION: At the center of a cover face 2 of a cover 1 for one piece of a nearly square-shaped and flat board, a hole 3 is formed for installing a plug socket, various switches, various kinds of electric apparatuses, etc. On the upper and the lower edge of the hole 3, claw sections 6 which have female screw holes 5 are integrated with the cover 1. Each claw section 6 consists of a vertical section 6a which is bent vertically from the edge of the hole 3 and a parallel section 6b with the female screw hole 5 which, being extended from the vertical section 6a, is bent parallelly to the edge of the hole 3. The parallel section 6b is located behind the cover face 2 by the space S enought to keep it from the edge of a blade of an electric cutter, that is, it is located in the back of the edge of the hole 3.
Patent JP-H05147537-A (JP)
Title: Steering wheel
Inventor: NAGATA ATSUSHI
IPC: B62D1/11
Filed: 1991-11-28
Abstract: PURPOSE:To provide a steering wheel in which ring section formed surface does not move in normal use even if the formed surface of the ring section is positioned so that it nears horizontal and a part of the core metal is deformed plastically when an impulsive force is applied to the ring section from the horizontal to enable absorption of the impulsive force. CONSTITUTION:A spoke section core metal 4 is connected to a boss section core metal 8 through a deformed piece 6 capable of deforming plastically. The deformed piece 6 is provided with a connecting section 61 connected to the boss section core metal 8 and extending to a ring section R side in parallel with the spoke section core metal 4, a curved section 62 curved from the top end of a connecting end 61 and extending to the ring section R side, and a connecting section 63 curved from the top end of the curved section 62 and extending in parallel with the spoke section core metal 4. The curved section 62 is provided with a notched recess 64. The spoke section core metal 4 is inserted into the recess 64, made in contact with the connecting section 61, and fixed to the connecting section 63.
Patent JP-H06169811-A (JP)
Title: Electric nail file
Inventor: KOBAYASHI AKIRA
IPC: A45D29/05
Filed: 1992-10-13
Abstract: PURPOSE:To prevent the damage of fingers or the deep shaving of nails and safely arrange long nails by turning on the switch of a power source with the file of an electric nail file or an electric vibrator kept in contact with a nail, and rotating or vibrating the file fitted to each shaft to file it. CONSTITUTION:A switch 3 fitted on a battery chamber 2 is wired and connected between a battery and an electric motor 1. A file 7 is fitted to a rotary shaft 5, and the rotary shaft 5 is fixed to the electric motor 1. The file 7 is fitted to a transmission shaft 6, and the transmission shaft 6 is fixed to an electric vibrator 4. When the switch 3 of the electric motor 1 is turned on, the electric motor 1 is rotated, the rotation is transmitted to the file 7 via the rotary shaft 5, and the rotating file 7 is brought into contact with a nail to file it. When the switch 3 of the electric vibrator 4 is turned on, its vibration is transmitted to the file 7 via the transmission shaft 6 to vibrate it. When the vibrating file 7 is brought into contact with a nail, the nail is filed little by little.
Patent JP-H08141016-A (JP)
Title: Legless chair
Inventor: WATANABE TAKESHI
IPC: A47C3/20
Filed: 1994-11-26
Abstract: PURPOSE: To improve comfortability for the use of a legless chair by setting a freely running carriage frame part by a wheel freely movably in a vertical direction and forming a footboard member so as to protrude/retract at a position in front of the carriage frame part following the vertical motion of the carriage frame part. CONSTITUTION: When the retracting operation of an electric cylinder 14 is performed, a turning cylinder 12 is turned in a counterclockwise direction, and a synchronous link 16 turns an operating link 15 in a clockwise direction. Thereby, a cross link 6 and a turning cylinder 11 are turned, respectively, and also, the position of the electric cylinder 14 is moved, which locates a seat carriage frame part 3 in a lifted position. Adversely, the seat carriage frame part 3 is descended by the protruding operation of the electric cylinder 14. When the seat carriage frame part 3 is lifted, a roller shaft 7b is slid forward in an elongated hole 1c. Therefore, the footboard member 17 performs the protruding operation as making a spring receiving frame 17 slide via the connecting shaft 20 of a connecting part 7d.  When a user rides on the footboard member 17, the footboard member 17 is rocked downward centering about the connecting shaft 20, which facilitates the alighting and boarding. Adversely, when the seat carriage frame part 3 is descended, the footboard member 17 is retracted.
Patent JP-H05211195-A (JP)
Title: Wire bonding apparatus
Inventor: SATO HIDEAKI
IPC: H01L21/60
Filed: 1991-11-29
Abstract: PURPOSE:To enable a bonding wire to be fed smoothly, by providing a cleaner for cleaning a tool kept in the ready state capable of bonding operations, and by removing automatically the peeled pieces of the covering material of a covered wire, etc., generated in the tool by the bonding operations. CONSTITUTION:On a bonding head 2 provided on an X-Y table 1, a horn 3 at whose end a tool 4 is provided is mounted elevatably, and a bonding stage 6a is provided below the tool 4. On the bonding stage 6a, a cleaning vessel 7 filled with a cleaning liquid 8 and a drier 9 by which the tool 4 after cleaning is dried are provided respectively. When bondings are performed about fifty thousand times, the tool 4 is dipped in the cleaning liquid 8 of alcohol, etc., in the cleaning vessel 7, keeping the state intact, wherein a covered wire is passed through the tool 4 and its bonding is possible. Then, by applying ultrasonic vibration to the tool 4, peeled pieces, etc., left in the tool 4 are removed The tool 4 after cleaning is dried by the drier 9.
Patent JP-H03175120-A (JP)
Title: Running controller for vehicle
Inventor: TACHIBANA AKIHIDE
IPC: F02D17/02
Filed: 1989-12-05
Abstract: PURPOSE:To properly control running of a vehicle under emergent condition by varying the number of cylinders to be actuated according to an aimed rate of opening of a throttle valve and the rate of opening of the throttle valve in its inoperative state when the throttle valve becomes inoperative. CONSTITUTION:In a throttle control ECU 20, the rate of opening of a throttle valve 12 is controlled to an aimed rate of opening by a driving motor 10 to adjust the amount of air supplied to an engine 2, and also the rate of opening of the throttle valve 12 is detected by a throttle valve opening rate sensor 14. The condition of the throttle valve 12 is detected to determine whether or not the throttle valve 12 becomes inoperative. When the throttle valve 12 is diagnosed as inoperative, the number of cylinders of the engine 2 to be actuated is adjusted by an engine control ECU 18 according to the aimed rate of opening of the throttle valve 12 and the rate of opening of the throttle valve 12 in its inoperative state so as to control the output of the engine 2 to control running of a vehicle. Running of the vehicle is properly controlled under emergent condition.
Patent JP-S63163242-A (JP)
Inventor: YAN OU NORUDOBAARU
IPC: G01L1/12
Filed: 1987-12-14
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。