baber/WOPTO huggingface dataset:
Patent TW-200625039-A (TW)
Title: Method for implementing an electric installation
Inventor: SAUER THOMAS
IPC: G05B19/12
Filed: 2005-11-03
Abstract: The method involves an electric installation, especially an air condition installation, with spatially distributed electromechanical functional units (1) which are arranged on specific constructional positions. The functional units are controlled in an individual manner by a network address (7) which is stored in an electronic form via a signal transfer network from a central control unit (3). Each functional unit (1) is provided with a first optical, electromagnetic and/or mechanical identification code (6) which can be read from the outside and which is allocated to the device-specific internal address. Each functional unit also has a second optical, electromagnetic and or mechanical additional recognition code (8) which contains specific information and which can also be read from the outside. Both codes (6, 8) are detected in pairs and electronically stored and are transferred to the control unit (3) for further processing using optical, electromagnetic and or mechanic reader.
Patent TW-200637718-A (TW)
Title: Process for production of a film composed of thermoplastic, film, and use of the film
Inventor: GUENANTEN CLAUDE
IPC: B29C48/08
Filed: 2005-11-30
Abstract: The invention relates to a process for production of a film composed of thermoplastic, where the thermoplastic is melted in an extrusion system, comprising an extruder, an extrusion die with a discharge orifice in the form of a slot, and a chill roll secured to a roll frame, and is conveyed onward, and emerges in the form of a sheet-like melt web from the discharge orifice of the extrusion die, and the melt web is applied to the chill roll and is cooled, characterized in that the distance between the discharge orifice of the extrusion die and the surface of the cooled roll (chill roll) in the extrusion system used varies by not more than +/-50 μm as a function of time in the operating condition. The invention further relates to the film itself, and also to its uses.
Patent TW-200634548-A (TW)
Title: System and method for selectively installing an operating system to be remotely booted within a storage area network
Inventor: ARENDT JAMES WENDELL
Filed: 2005-12-02
Abstract: A management computer controlling operations of computer system in a number of positions within a chassis is programmed to receive a signal including that one of the computer systems has been installed and to determine whether it has been installed in a previously unoccupied position, installed in a previously occupied position, or moved from one position to another. If it has been installed in a previously unoccupied position, an operating system is installed for remote booting; if it has been installed in a previously occupied position, it is allowed to continue booting the operating system used by the computer it replaced; if it has been moved from one position to another, it is allowed to continued booting as before.
Patent TW-200700486-A (TW)
Title: Thermoplastic resin composition
Inventor: TERADA TORU
IPC: C08L51/00
Filed: 2005-12-13
Abstract: Disclosed is a novel thermoplastic resin composition having high impact resistance without deteriorating weather resistance even when only a small amount of impact resistance modifier is blended therein. Specifically disclosed is a thermoplastic resin composition containing 100 parts by weight of a thermoplastic resin (a) and 0.5-20 parts by weight of an impact resistance modifier (b) containing a graft copolymer (b-1) having at least one or more soft polymer phases of a (meth)acrylate and an outermost hard polymer phase, a water-soluble polymer compound (b-2) having a property of forming a physical gel, and a gelatinizer (b-3). This thermoplastic resin composition is characterized in that the water-soluble polymer compound (b-2) is contained in an amount of 0.01-3.0 parts by weight per 100 parts by weight of the graft copolymer (b-1), and the ratio of the outermost hard polymer phase in the graft copolymer (b-1) is 0.5-10% by weight.
Patent TW-200636937-A (TW)
Title: Method of manufacturing semiconductor device, semiconductor device, stacked semiconductor device, circuit board and electronic instrument
Inventor: FUKAZAWA MOTOHIKO
IPC: H01L23/12
Filed: 2005-12-21
Abstract: A method of manufacturing a semiconductor device includes: preparing a semiconductor wafer; forming a conductive portion by forming holes in an active surface, forming an insulating film, and embedding a conductive material; forming a first groove; bonding the semiconductor water and a support body via an adhesive layer; thinning the semiconductor wafer by grinding a rear surface while maintaining the insulating film not exposed; forming a second groove; separating each of the semiconductor element sections to make a plurality of semiconductor chips, by isotropic etching so as to expose the insulating film; exposing the conductive portion from the insulating film by etching from the rear surface, to form feedthrough electrodes; and separating the semiconductor element sections into individual pieces by peeling semiconductor chips off from the support body.
Patent TW-200634882-A (TW)
Title: Display apparatus
Inventor: SUZUKI KEIJI
IPC: H01J31/15
Filed: 2005-12-23
Abstract: An SED is formed by arranging a front substrate and a back substrate opposite to each other and sealing the peripheral portions of the substrates against each other. The front substrate comprises a plurality of phosphor layers and a metal back (14), and the back substrate comprises a plurality of electron emitters and wiring thereof. The metal back (14) is electrically divided into a plurality of island-like regions (14a) and connected to a common electrode (20) which is arranged around the metal back. The common electrode (20) has a plurality of electrode films (24) spaced apart from one another in the longitudinal direction, and an annular resistive film (22). The annular resistive film (22) is superposed on the electrode films (24) so that the electrode films (24) are electrically connected, and is connected to the peripheral portion of the metal back (14).
Patent TW-200643459-A (TW)
Title: Optical film having a surface with rounded structures
Inventor: KO BYUNG-SOO
IPC: G02F1/1335
Filed: 2005-12-29
Abstract: The present disclosure is directed to optical devices including a light source and an optical film having a first surface disposed to receive light from the light source and a second surface facing away from the light source. The second surface includes a two-dimensional array of closely packed substantially hemispherically-shaped structures. In some implementations of the present disclosure, the optical film further includes a substrate portion having an optical characteristic different from optical characteristics of the second surface comprising the two dimensional array.
Patent TW-200725379-A (TW)
Title: Touch location determination using vibration wave packet dispersion
Inventor: PECHMAN ROBERT JOHN
IPC: G06F3/043
Filed: 2005-12-30
Abstract: Methods and devices provide for determination of the location of a touch on a touch plate by sensing dispersive vibrations at each of a number of vibration sensors coupled to a touch plate, the vibrations caused by the touch on the touch plate. An amount of dispersion in the dispersive vibrations sensed at each of the vibration sensors is determined. A distance between the touch and each of the vibration sensors corresponding to the amount of dispersion in the dispersive vibrations sensed at each of the vibration sensors is calculated. The touch location is determined using some or all of the calculated distances.
Patent TW-200633045-A (TW)
Title: Method of polishing GaN substrate
Inventor: MATSUMOTO NAOKI
IPC: B24B37/04
Filed: 2006-01-03
Abstract: A method for polishing a GaN substrate which comprises a first polishing step of polishing the GaN substrate using a surface plate (101) and an abrasive fluid (27) containing an abrasive material (23) and a lubricating agent (25), while the abrasive fluid (27) is supplied onto the surface plate (101), and a second polishing step of polishing the GaN substrate using a surface plate (101) having an abrasive material (29) embedded therein, while supplying a lubricating agent (31) onto the surface plate (101) having an abrasive material (29) embedded therein.
Patent TW-200701394-A (TW)
Title: Closed loop cesl high performance cmos devices
Inventor: CHEN SHANG-CHIH
IPC: H01L21/768
Filed: 2006-01-10
Abstract: An N-MOS and/or P-MOS device having enhanced performance such as an FET suitable for use in a CMOS circuit. The device comprises both an "L-like" shaped layer or spacer on the side walls of a gate structure as well as a CESL (contact-etch stop layer) that covers the gate structure and surrounding substrate to induce increase tensile stresses in the N-MOS device and increased compressive stresses in the P-MOS device.
Patent TW-200729082-A (TW)
Title: Apparatus and method for adjusting sharpness of image
Inventor: KAO HSU-PIN
IPC: G06T5/10
Filed: 2006-01-27
Abstract: A method for adjusting a target gray level of a targel pixel based on a spatial mask is provided. The target pixel is surrounded with N adjacent pixels; each of the N adjacent pixels respectively has an adjacent gray level. The method first multiplies the target gray level with a sharpness index to generate an amplified target gray level and respectively multiplies each of the adjacent gray level with an adjacent index to generate N modified adjaccent gray levels. Then, the amplified target gray level and the N modified adjacent gray levels are added up to generate a first gray levle sum. The method multiplies the first gray level sum with a multiplying parameter to generate a second gray level sum. At last, the method divides the second gray level sum by a dividing parameter to generate an adjusted gray level for the target pixel.
Patent TW-200729056-A (TW)
Title: A method for tracking component part data
Inventor: LEE YING-PEI
IPC: G06Q10/00
Filed: 2006-01-27
Abstract: A method for tracking component part data is disclosed, which includes the steps of: making different data labels on different component parts; during assembling a product, reading the data labels on the component parts; integrating and storing the read component part data into a database; adhering a serial number onto the product, wherein the serial number is correspondent to the integrated component part data.
Patent TW-200730946-A (TW)
Title: Light focusing film and backlight module using the same
Inventor: JANG JIA-YIN
IPC: G02F1/13357
Filed: 2006-02-07
Abstract: This invention relates to a light focusing film and backlight module using the same. The light focusing film is made of a polymeric material. It comprises a top surface, and a bottom surface. Plural strip-like light focusing bodies are formed to the top and bottom surfaces of the light focusing film. Wherein, light focusing bodies on the top and bottom surfaces are allocated such that they are not in parallel to each other. It focuses all viewable angle of the light source. Eventually, it achieves the effects of concentrating the light source, and increasing the brightness illuminated by the backlight module.
Patent TW-200636970-A (TW)
Title: High input voltage tolerant input/output circuit being free from electrostatic discharge voltage
Inventor: KWON BONG-JAE
IPC: H01L23/60
Filed: 2006-02-13
Abstract: A high input voltage tolerant input/output circuit includes a pad, a clamping circuit clamping a high voltage applied to the pad to generate a clamping signal, and a buffer unit transmitting an input signal received by the pad to an internal circuit and outputting data of the internal circuit to the pad in response to the clamping signal. The buffer unit includes stacked NMOS transistors. When a high voltage higher than a power supply voltage is applied to the pad, the stacked NMOS transistors are turned on, and the stacked NMOS transistors are prevented from being destroyed by the high voltage. When an electrostatic discharge voltage is applied to the pad, the stacked NMOS transistors are turned off, and the stacked NMOS transistors are prevented from being destroyed by electrostatic discharge current.
Patent TW-200632112-A (TW)
Title: Ultra-low-carbon steel sheet excellent in surface property, workability and formability and method for producing ultra-low-carbon cast slab
Inventor: SASAI KATSUHIRO
Filed: 2006-02-17
Abstract: Method for producing ultra-low-carbon cast slab, characterized by the steps of; decarburizing to ≤ 0.005 mass% C in a molten steel, adding Cu, Nb and B to the molten steel, keeping concentration of dissolved oxygen between not less than 0.01 mass% and not more than 0.06 mass%, and casting the molten steel, and ultra-low-carbon steel sheet characterized by; comprising C of not more than 0.005 mass%, acid-soluble Al of not more than 0.005 mass%, Cu, Nb and B, and including dispersed fine oxides of not less than 1000/cm2 and not more than 1000000/cm2 having a diameter of not less 0.5 μ m and not more than 30 μ m.
Patent TW-200639826-A (TW)
Title: Optical recording method and optical recoridng regeneration device
Inventor: TSUKAHARA OSAMU
IPC: G11B7/125
Filed: 2006-02-22
Abstract: An optical recording method and optical recording/regeneration device using multipulse type write strategy for optical recording, comprising the steps of: reading the peak level of the signal corresponding to the space of the recorded signal (S152-S153); comparing the peak level of the signal corresponding to the read space, according to the length difference of the pattern with respect to the mark right before the space (S156); and correcting the pulse width of multipulse of write strategy (S157-S159). Then, adjusting to optimize the pulse width of multipulse of write strategy, and the optimum recording to an optical disk can be carried out.
Patent TW-200730603-A (TW)
Title: Member for semiconductor light-emitting device, method for producing the same, and semiconductor light-emitting device using the same
Inventor: KATO HANAKO
IPC: C09K11/00
Filed: 2006-02-23
Abstract: A semiconductor light-emitting device member excellent in transparency, light resistance, and heat resistance and capable of sealing a semiconductor light-emitting device without causing cracks and peeling even after a long-time use is provided. Therefore, a semiconductor light-emitting device member that comprises (1) in a solid Si-nuclear magnetic resonance spectrum, at least one peak selected from a group consisting of (i) peaks whose peak top position is in an area of a chemical shift of -40 ppmto 0 ppm inclusive, and whose full width at half maximum is 0. 3 ppm to 3. 0 ppm inclusive, and (ii) peaks whose peak top position is in an area of the chemical shift of -80 ppm or more and less than -40 ppm, and whose full width at half maximum is 0.3 ppm to 5.0 ppm inclusive, wherein (2) silicon content is 20 weight % or more and (3) silanol content is 0.1 weight % to 10 weight % inclusive is used.
Patent TW-200701909-A (TW)
Title: Eyelash perm rod
Inventor: Qian miao-ling
IPC: A45D2/48
Filed: 2006-02-24
Abstract: An eyelash perm rod for use in eyelash perking in which lashes bent upward to form a curled state are temporarily stuck onto the rod and a permanent wave lotion is applied thereto for producing permanent-treated, curled eyelashes. The eyelash perm rod of the invention has a solid body having an eyelash-setting surface which is a curved surface and an eyelid contact surface which is a flat surface. The solid body has a wing-shaped cross section, wherein a first portion of the area at which the eyelash-setting surface meets the eyelid contact surface is thin, and a second portion which is opposite to the first portion is thick.
Patent TW-200731985-A (TW)
Title: A composition for wound healing and use thereof
Inventor: WU HUA-LIN
IPC: A61K38/18
Filed: 2006-03-07
Abstract: The invention relates to a composition for the use of accelerating wound healing, comprising a polypeptide comprising amino acid sequence or a conservative variant thereof having EGF-like domain of thrombomodulin.
Patent TW-200632118-A (TW)
Title: Multiple vacuum evaporation coating device and method for controlling the same
Inventor: LEE SUNG-HO
IPC: C23C14/24
Filed: 2006-03-08
Abstract: A multiple vacuum evaporation coating device and a method for controlling the same. The vacuum evaporation coating device includes a plurality of evaporation sources, a rotating part adapted to rotate the plurality of evaporation sources and a coating block plate adapted to block all but one of said plurality of evaporation sources at any time, each of the plurality of evaporation sources comprises a case, a melting pot arranged within said case, an evaporation material arranged within the melting pot, a heating device arranged outside the melting pot and adapted to heat and evaporate the evaporation material, and a cooling device adapted to block heat generated by the heating device from transferring to an outside.
Patent TW-200738102-A (TW)
Title: Fastening structure and thermal module using the same
Inventor: HWANG CHING-BAI
IPC: H05K7/12
Filed: 2006-03-17
Abstract: A thermal module includes fins, a heat pipe, and a fastening structure. The fastening structure includes an integrative plate for thermally connecting with a heat generating electronic component and a spring component securing the heat pipe to the plate. The heat pipe is capable of transferring heat from the plate to the fins. One of the spring component and the plate defines two through-holes, and the other one has two bulges corresponding to the through-holes. The making process of the plate is very simple, thereby improving the producing speed and decreasing the cost of the thermal module.
Patent TW-200739765-A (TW)
Title: Package structure and method of optical display
Inventor: WANG CHIH-YUAN
IPC: H01L21/60
Filed: 2006-04-12
Abstract: The present invention provides a package structure and method of optical display, which comprises plural flip-chip bumps disposed on the substrate and plural bump pads disposed on the IC chips corresponding to the substrate. The bump pads contact with the flip-chip bumps, and are reacted by the bonding pressure and the thermal-pressure of the bonding temperature simultaneously, so that the bump pads and the flip-chip bumps form eutectic soldering to conduct the substrate and the IC chips.
Patent TW-200741165-A (TW)
Title: Heat pipe
Inventor: LIU TAY-JIAN
IPC: F28D15/04
Filed: 2006-04-21
Abstract: A heat pipe includes a heat-transferred sealed container and a pair of heat-collected sealed cases disposed on the container. The container includes an evaporating portion, a condensing portion and an adiabatic portion arranged between the evaporating and the condensing portions in a length direction of the container. The container defines a plurality of capillary structures in an inner wall thereof and is filled with a working liquid therein. The cases are respectively disposed on outer walls of the evaporating and condensing portions of the container. Heat dissipation efficiency of the heat pipe is greatly improved by big heat-absorbing and heat-dissipating areas of outsides of the heat-collected cases and a difference in temperature between the evaporating portion and the condensing portion of the heat pipe becomes smaller.
Patent TW-200742647-A (TW)
Title: Turbine cylinder of pneumatic tool
Inventor: LIN FREDDY
IPC: F16J10/00
Filed: 2006-05-09
Abstract: The present invention relates to a turbine cylinder of pneumatic tool, comprising: a front turbine, a reverse wheel that rotates unidirectionally and a rear turbine, all of the three components mentioned above are installed on a rotating shaft of the cylinder. The reverse wheel is provided between the front and the rear turbines; the peripheries of the turbines and the reverse wheel are provided with a plurality of blades, wherein the direction of the blades of the reverse wheel is opposite to that of the turbines. When the turbines rotate, they rotate synchronizingly with the rotating shaft at the same direction, and the reverse wheel rotates in the opposite direction. Accordingly, the efficiency of the turbine cylinder is increased; and when the cylinder is in operation, twist movement can be prevented.
Patent TW-200742789-A (TW)
Title: Manufacturing method of cement brick and manufacturing mold thereof
Inventor: XIANG SU-RONG
IPC: E04C1/40
Filed: 2006-05-15
Abstract: A manufacturing method of cement brick and manufacturing mold thereof is disclosed, the method includes the steps of: mixing, pouring, pressurizing, keeping, replenishing and mold-releasing; the mixing step is that recycled waste sludge is scattered then mixed with cement so a sludge material is formed then the sludge material is poured into a manufacturing mold, the pressurizing step is that the manufacturing mold is pressurized so water in the sludge material in the manufacturing mold is drained, then the keeping step is proceeded to keep the sludge material inside the mold, and the replenishing step is that additional sludge material is replenished into the mold, lastly the releasing step is that the sludge material is formed and removed from the mold, so a product of cement brick is obtained; a frame of the manufacturing mold includes an inner sheet, a filtering material, and an outer sheet, the inner sheet is provided with a plurality of through dehydrating holes, the filtering material is provided to the outer end of the inner sheet and the outer sheet is provided to the outer end of the filtering material, the inner end of the outer sheet is provided with a plurality of water guiding slots, the outer end of the outer sheet is provided with a plurality of draining holes with respect to the locations of the water guiding slots; the water in the sludge material is discharged from the dehydrating holes of the inner sheet, the sludge material is kept by the filtering material, then the water dehydrated from sludge material is filtered and exhausted by the water guiding slots and the draining holes, so a manufacturing mold of cement brick having a dehydrating function is obtained.
Patent TW-200702136-A (TW)
Title: Mold for disc molding, mirror plate, and process for producing mold for disc molding
Inventor: INADA YUICHI
IPC: B29C33/38
Filed: 2006-05-19
Abstract: A mold which can have improved durability to reduce the mold cost. The mold comprises a first mold and a second mold which faces the first mold and has been disposed so as to be freely movable forward/backward. One of the first and second molds comprises a base whose surface has undergone a roughening treatment and a coating layer formed by subjecting the surface of the base to a coating treatment. A stamper attachment side is formed on the surface of the coating layer. Since the coating layer is formed by subjecting to a coating treatment the base surface which has undergone a surface-roughening treatment, the base/coating layer contact area can be increased. The adhesion between the base and the coating layer can hence be increased. Consequently, the coating layer is less apt to peel off and the mold can have improved durability. A reduction in mold cost can hence be attained.
Patent TW-200745687-A (TW)
Title: Back light module and display apparatus using the same
Inventor: LEE YUAN-TSAN
IPC: G02F1/1335
Filed: 2006-06-09
Abstract: A back light module and a display apparatus using the same are provided. The back light module for providing a display panel with the back light comprises a optical film, alight guide body, and a light source. The light guide body comprises a bottom plate and an extending portion, meanwhile the bottom plate comprises a carrier portion, and the optical film is disposed on abottom surface of the carrier portion. The extending portion disposed at an outer rim of the bottom plate comprises at least a containing space. The light source disposed within the containing space is for generating a light, and the light is guided toward the display panel through the bottom plate of the light guide body and the optical film in order.