Patent GB-1376939-A (GB)
Title: Integrated circuit mounting and connection systems
IPC: H01R12/70
Filed: 1971-11-26
Abstract: 1376939 Printed circuit component assemblies; semi-conductor circuits TEXAS INSTRUMENTS Inc 26 Nov 1971 [28 Dec 1970] 58581/73 Headings H1R and H1K [Also in Division H2]  A panelboard system for supporting an integrated circuit package 10 comprises (Figs. 1, 2, 3), a rigid dielectric, e.g. ceramic card 12, on which is a metal pad 14 and plural conductive printed circuit paths 16 extending from locations peripheral of the pad to spaced contacts along edge 12.1; an, e.g. logic integrated circuit chip 18 of Si being mounted on pad 14 with leads 20 interconnecting its terminals 22 to paths 16. A metal ground plane 17 is formed on the opposite side of the card to provide controlled impedances in the paths 16 and metallized shielding paths 19 are interposed on the card between paths 16. The cards may be pressed of Al or Be oxide powder mixed with epoxy binder and baked; after which a surface is masked to define pad 14, plane 17, and paths 16 and 19 which are formed by a liquid suspension of conductive W metal; and the card is again baked to remove the mask and produce adherent metal coatings at, e.g. 14.1, 16.1, 17.1 and 19.1. A liquid glaze 24 is applied to the surface, leaving pad 14, the ends of paths 16 and 19 and an edge of plane 17 exposed, and a ceramic ring 26 with annular W coating 26.1 is applied to the glaze to surround pad 14 and the adjacent ends of paths 16 and 19. Further baking affixes the ring and hardens the glaze, after which a noble metal is electrolessly plated on pad 14, the end of paths 16, 19 the edge of plane 17 and the ring 26, at, e.g. 14.2, 16.2, 19.2, 17.2 and 26.2. The chip 18 is affixed to the pad and its lead wires connected thereto and to the ends of paths 16 by thermocompression bonding; while a metal cover 28 is similarly sealedly attached to plating 26.2 of the ring 26. Connectors 30 of a mounting (Fig. 4), are formed of halves 32, 34 (Fig. 6), of, e.g. glass reinforced nylon, bonded together to define recesses 38, 40 on opposite sides of the connector and to retain a contact assembly 42 between the halves; which includes an elongated dielectric spacer 44 with thereupon metallized areas 46 (Fig. 5), spaced similarly to the circuit paths 16. A metallized ground plane 48 is provided on the opposite side of the spacer. The assembly has leaf portions 50.1, 52.1 and terminal portions 50.2, 52.2 with an additional contact portion 50.3 off-setting 50.2 from leaf portion 50.1. Contacts 50, 52 are, e.g. soldered to metallized areas 46, 48, of the spacer in alternation along opposite sides, so that the terminal portions extend in staggered rows. The contacts are of, e.g. Be-Cu or P-bronze. The system incorporates a panelboard 54 with a layer 56 of, e.g. glass reinforced epoxy coated with conductive Cu on opposite sides thereof to form conventional circuit path and ground plane layers 58, 60, and the board is provided with staggered apertures 62 in plural staggered rows to receive the contact terminals, and these may be plated though at, e.g. 64, 66, to connect circuit paths and ground plane to selected terminals. Recess 38 receives an edge of ceramic card 12 supporting an integrated circuit package 10 (Fig. 4), and the connector contacts 50, 52 detachably engage the ends of respective circuit paths 16 and the ground plane 48. Impedance matching is achieved between the integrated circuit package and the connector to provide controlled impedance connections to the circuit chip, and the connections of the panel board system are similarly matched to provide controlled impedance connections throughout. In a modification (Figs. 8 to 10, not shown), integrated circuit packages are carried by ceramic cards bonded to opposite sides of a metal ground plane therebetween; the opposite faces of the cards carrying pads and circuit paths and the assembly fitting into a doublesided connector assembly. Plural integrated circuit chips may be assembled on each card.