baber/WOPTO huggingface dataset:
Patent JP-2009276346-A (JP)
Title: Conductive film structure, its manufacturing method, and conductive film type integrated circuit probe device
Inventor: SHU BINKETSU
IPC: G01R1/067
Filed: 2009-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a conductive film structure, its manufacturing method and a conductive film type integrated circuit probe device.  <P>SOLUTION: The manufacturing method of the conductive film structure includes a step providing a flexible insulation substrate, a step of forming a conductive film on the flexible insulation substrate, a step of forming a plurality of fine conductive wires which are parallel each other in a long axis direction by patterning the conductive film on the flexible insulation substrate, a step of forming an insulation layer on the flexible insulation substrate and the fine conductive wire, and a step of forming a conductive block which is made by rolling or folding the flexible insulation substrate on the long axis direction center of the fine conductive wire.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010257387-A (JP)
Title: Failure prediction device
Inventor: ICHIMURA SHINJI
IPC: G05B23/02
Filed: 2009-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a failure prediction device for reliably and easily predicting a failure in a drive mechanism by very simple control and performing a minimum function as a product by stopping an object at a position where safety and convenience are not damaged.  <P>SOLUTION: A control means 60 calculates a moving distance of a toilet on the basis of a pulse signal output by a displacement detection means 50, integrates a moving distance every time an actuator 30 operates, compares a life distance defined by converting a durability of the actuator 30 into the moving distance of the toilet with the integrated value, determines that the actuator 30 is in the state in which a failure is predicted when the integrated value reaches the life distance, and performs warning to this effect. After warning, operation of the actuator 30 by input operation of an operation part 70 is regulated only downward.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010261060-A (JP)
Title: Method for producing hot-dip metal-coated steel sheet
Inventor: SUGIYAMA SEIJI
IPC: C23C2/20
Filed: 2009-04-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for effectively suppressing the occurrence of edge over-coat even in the heavy coating weight when adjusting the deposition by blowing gas from a wiping nozzle and an auxiliary nozzle to a surface of a steel sheet pulled up from a hot dip coating bath, and wiping any excessive coating metal.  <P>SOLUTION: An auxiliary nozzle is installed on an inclined surface on the upper side of an end of a wiping nozzle so that the distance between a fore end of the wiping nozzle and a steel sheet is 5-30 mm. Gas is blown from each nozzle so that the flow rate V1 is 50-200 Nm/s, and V2/V1 is 0.2-0.85, where V1 denotes the flow rate of gas to be blown from the wiping nozzle and V2 denotes the flow rate of gas to be blown from the auxiliary nozzle.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009272637-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: HUANG SHIH CHENG
IPC: H01L33/32
Filed: 2009-05-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, which is capable of solving the problem of the degradation in quality of film layers due to lattice difference and the problem of cracks due to stress generated by lattice mismatching between a sapphire substrate and a group III nitride grown on the sapphire substrate in an LED.  <P>SOLUTION: The manufacturing method of a semiconductor device comprises the steps of: providing a substrate; forming a plurality of grooves on a surface of the substrate by photolithograph etching or laser engraving, wherein the plurality of grooves divide the surface of the substrate into a plurality of mesa structures and makes a patterned substrate of the substrate; and growing a semiconductor device (e.g. photo-electronic device or LED) on the surface of the patterned substrate. The semiconductor device comprises at least one layer, and a first layer in contact with the patterned substrate is divided to a plurality of regions separate from each other by the grooves.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009176752-A (JP)
Title: Negative electrode active substance and its manufacturing method, nonaqueous electrolyte battery, and battery pack
Inventor: INAGAKI HIROTAKA
IPC: H01M4/36
Filed: 2009-05-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide an active substance for a negative electrode superior in large current characteristic and charge discharge cycle characteristic, its manufacturing method, a nonaqueous electrolyte battery and battery pack.  <P>SOLUTION: The manufacturing method of the active substance for a negative electrode is characterised by having: a process for applying a wet pulverization in which a lithium titanium compound oxide powder having a lithium titanium oxide having a spinel structure as a major configuration phase coexists with a liquid pulverization assistant comprising water, ethanol, ethylene glycol, benzene or hexane; and a process for applying a baking at temperatures of 250-900°C for 1 minute to 10 hours to the obtained pulverized substance.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010266310-A (JP)
Title: H2 sensor
Inventor: SASAKI TAKANORI
IPC: G01N27/26
Filed: 2009-05-14
Abstract: <P>PROBLEM TO BE SOLVED: To detect the concentration of H<SB>2</SB>more accurately, even in a transient state.  <P>SOLUTION: This H<SB>2</SB>sensor is constituted so as to detect the concentration of H<SB>2</SB>, from a value which is calculated by subtracting the output value of a second cell 102 from the output value of a first cell 101 under the condition that a detection target component is contained in a gas to be detected and is equipped with a correction means 40 for correcting the output value of the second cell 102, by multiplying the output value of the second cell 102 by a value which is calculated by dividing the rate of change of the output value of the first cell 101 by the rate of change of the output value of the second cell 102, when the rate of change of the output value of the first cell 101 is larger than a first predetermined value and the rate of change of the output value of the second cell 102 is larger than a second predetermined value.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010267502-A (JP)
Title: Probe for socket, socket for integrated circuit, and electronic device
Inventor: KIRIKI NOBUAKI
IPC: H01L23/36
Filed: 2009-05-15
Abstract: <P>PROBLEM TO BE SOLVED: To cool a probe which electrically connects an integrated circuit to a circuit board in a socket mounted with the integrated circuit and connected with the circuit board.  <P>SOLUTION: The probe (1) provided on the socket (3) mounted with the integrated circuit (6) to electrically connect the circuit board (2) to the integrated circuit (6) is hollowly constituted. According to this, refrigerant which is heated by taking heat of the probe (1) when passing through the center of the probe (1) from the circuit board (2) can be discharged in the side direction of the socket. Accordingly, the probe can be directly cooled, and an increase in resistance value of the probe by heating of the probe can be suppressed. Consequently the current value which can be carried to the integrated circuit can be increased.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010271868-A (JP)
Title: Slide type input device
Inventor: OBARA KEIJI
IPC: G06F3/0354
Filed: 2009-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a compact slide type input device with good operation feeling.  <P>SOLUTION: A holding member 6 holding an operation member 5 so as to be vertically moved is slid integrally with the operation member 5 and an operating member 7 while being guided by a guide groove 3b of a case 3. The operation member 5 is always elastically biased upward by a leaf spring 8 provided between the members 5, 6. The operating member 7 is always elastically biased downward. When the operation member 5 is slid, the operating member 7 moves on a drive body 11 and moves upward to the holding member 6. A pressurization part 11b of the drive body 11 depressed by the operating member 7 applies a depression load to a pressure-sensitive electroconductive rubber 12. The amount of depression of the drive body 11 increases according to a slide movement amount. When the slid operation member 5 is depressed, a biasing force of the leaf spring 8 to the operating member 7 increases, so that the amount of depression of the drive body 11 furthermore increases, and the depression load applied to the pressure-sensitive electroconductive rubber 12 also increases.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010274817-A (JP)
Title: Pneumatic tire for motorcycle
Inventor: MURAMATSU NAOYA
IPC: B60C9/20
Filed: 2009-05-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pneumatic tire for a motorcycle capable of enhancing steering stability performance and durability during high speed and particularly improving traction performance during acceleration from tight cornering time for largely tilting a vehicle body and stability during vehicle body tilting.  <P>SOLUTION: This pneumatic tire includes a spiral belt layer having a width which is 0.8 to 1.1 times as wide as that of a tread part 1. The spiral belt layer 6 is composed of a rubber-steel cord complex, and the spiral belt layer 6 is divided into three regions of a central part region 7 and both side part regions 8. The steel cords embedded in both the side part regions 8 have lower elasticity than that of steel cord embedded in the central part region 7. The steel cords in both the side regions 8 are formed by bundling a plurality of steel linear elements shaped substantially in the same pitch without twisting approximately in the same phase and by spirally shaping. Each of the steel linear elements is a steel filament.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010283076-A (JP)
Title: Method for heat treatment of silicon wafer
Inventor: SENDA TAKESHI
IPC: H01L21/324
Filed: 2009-06-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat treatment method of a silicon wafer, capable of largely reducing a void defect in regions of a surface and a surface layer of a device active layer even if rapid-heating/rapid-cooling heat treatment which takes place as second-time-scale heat treatment is used.  <P>SOLUTION: The heat treatment method is provided for heat treatment on a silicon wafer W sliced from a silicon monocrystal ingot grown by the Czochralski method. The heat treatment method includes the steps of: supplying an inert gas into a first space 20a with which a surface W1 of the silicon wafer W with a semiconductor device formed comes into contact; and supplying an oxidizing gas into a second space 20b with which a rear face W2 of the silicon wafer W comes into contact, so as to make rapid-heating/rapid-cooling heat treatment with the ultimate temperature of ≥1,300°C and ≤1,400°C.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010280420-A (JP)
Title: Apparatus and method for applying sheet
Inventor: DANJO AKIRA
IPC: B65C9/36
Filed: 2009-06-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for applying a sheet which are capable of suppressing consumption of wasteful energy, retaining an adhesive sheet at a precise position, and pasting the adhesive sheet onto a precise position.  <P>SOLUTION: The apparatus 10 includes feeding means 11 for feeding an original fabric R in which the adhesive sheet S is temporaly attached to a strip peeling sheet RL, a peel plate 12 for peeling off the adhesive sheet S from the peeling sheet RL, pressing means 15 for retaining the peeled adhesive sheet S and pressing the sheet against an adherend W so as to paste the sheet thereon, and feed supporting means 16 for supporting feeding of the adhesive sheet S while in contact with an adhesive agent of the peeled adhesive sheet S and causing the sheet to be retained by a sheet retention unit 31A.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010284046-A (JP)
Title: Step-up/down dc-dc converter
Inventor: SHIOZU FUMITADA
IPC: H02M3/155
Filed: 2009-06-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a step-up/down DC-DC converter which controls the output voltage to be reliably held at a fixed level for an input voltage fluctuation.  <P>SOLUTION: The step-up/down DC-DC converter 1 includes a step-down unit 2 having a step-down switch SW1 and delivering an output voltage lower than the input voltage, a step-up unit 3 having a step-up switch SW2 and delivering an output voltage higher than the input voltage, a step-up/down mode switching unit 30 which performs switching between a step-down mode for delivering an output voltage lower than the input voltage and a step-up mode for delivering an output voltage higher than the input voltage, and a control unit 4 which performs on/off control of the step-down switch SW1 by keeping the step-up switch SW2 off during the step-down mode, and performs on/off control of the step-up switch SW2 by keeping the step-down switch SW1 on during the step-up mode. The control unit 4 presets the maximum value of on period when the step-down switch SW1 is switched during the step-down mode, and presets the minimum value of on period when the step-up switch SW2 is switched during the step-up mode.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010287356-A (JP)
Title: Connector
Inventor: KIRYU KOICHI
IPC: H01R13/533
Filed: 2009-06-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connector capable of reliably maintaining connection under an environment where vibration or the like occurs.  <P>SOLUTION: A first connector 20 includes a contact part 30 with first and second contact terminals 31 and 32 electrically connected by a connection part 34, the second contact terminal 32 being bent such that a space between the first and second contact terminals 31 and 32 becomes narrower. A second connector 60 includes a contact part 70 with third and fourth contact terminals 71 and 72 electrically connected by a connection part 74, the fourth contact terminal 72 being bent such that a space between the third and fourth contact terminals 71 and 72 becomes wider. When the two connectors are in an engaged state, the first and second contact terminals 31 and 32 of the first connector 20 are connected, holding therebetween the third and fourth connection terminals 71 and 74 of the second connector 60.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010271294-A (JP)
Title: Contact-pressure measuring method of air filling type
Inventor: KOMINAMI YUKIYA
IPC: G01L5/00
Filed: 2009-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a measuring method that at low cost and readily measures contact pressure, such as, compression of clothes and the body pressure of a chair or bed at two or more places with one pressure gauge having one built-in pressure sensor, and intermittently measures the changes due to passage of time, without disturbing routine movements.  <P>SOLUTION: The contact pressure measuring method includes a pressure sensing sensor that senses the contact pressure and where a tube 2 is attached to a bag 1 made of a soft film of non-elasticity; a cylinder 8 that has an exhaust hole 14 in a cylindrical side surface of volume A and where a piston valve 9 operated with a compression spring 12 is while blocking the opening of the hollow tube 7; and a pressure gauge 6 for measuring the differential pressure from the atmosphere. The cylinder 8, the pressure gauge 6, and a connection hole 5 for connecting the tube 2 are interconnected through piping. When the tube 2 of the bag 1 between a measuring surface D and a non-measuring object C is connected to the connection hole 5, a cock 13 is pulled; the cock is released; the piston valve 9 presses out the air of volume A; and the pressure is measured by the pressure gauge 6.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010284697-A (JP)
Title: Method for welding tube to circumferential curved surface
Inventor: INOUE HIROYUKI
IPC: F22B37/22
Filed: 2009-06-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a welding technology which enables back-bead one-pass welding without requiring any beveling angle in the fillet welding to a circumferential surface of an end of a tube.  <P>SOLUTION: A tube welding method includes: a step of working a circumferential surface part of a drum or the like forming a welding part to an end of a tube to be welded in a horizontal surface; a step of executing the temporary welding after the tube with its end being worked at a right angle is butted to a horizontally worked portion of the drum or the like and positioned thereto; a step of applying a deep penetration activator on a surface of the welding part, and a step of executing the back-bead welding of the welding part in one pass by the automatic TIG welding.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2009298598-A (JP)
Title: Image forming device
Inventor: HACHIMAN ISAO
IPC: B65H31/00
Filed: 2009-06-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technology for enhancing the convenience of a discharge tray in an image forming device.  <P>SOLUTION: The image forming device includes an image reading section which is disposed on the upper side of the device and reads the image of a document; the discharge tray which is disposed under the image reading section and receives the sheet discharged through the discharge port of the device body; and a moving mechanism for moving the discharge tray between a receiving position for receiving the sheets discharged from the discharge port and a projecting position where at least a part of the discharge tray projects from the front side-surface of the device body.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011002544-A (JP)
Title: Condensing element, condensing optical system, and projector
Inventor: NAKAJIMA YASUHARU
IPC: G02B5/10
Filed: 2009-06-17
Abstract: PROBLEM TO BE SOLVED: To provide a condensing element that efficiently irradiates a light valve with an illumination light from a light source, a condensing optical system and a projector using the condensing optical system.SOLUTION: The condensing optical system 40 used for the projector 100 and irradiating the light valve 70 with the light from the light source 10 are constituted of the condensing element 20, having a first reflecting surface 22, being a concave surface having a focus at the light source 10 and reflecting the light from the light source 10 and changing it into substantially parallel beams; an aperture 24 making a part of the parallel beams pass to be emitted, and a second reflection surface 23 reflecting the rest of the parallel beams and guiding it to the light source 10; and an integrator 30 uniformizing the parallel beams emitted from the condensing element 20.
Patent JP-2011000793-A (JP)
Title: Cleaning device, liquid jetting device, and cleaning method for liquid jetting device
Inventor: AKAHA FUJIO
IPC: B41J2/165
Filed: 2009-06-18
Abstract: PROBLEM TO BE SOLVED: To provide a cleaning device surely removing air bubbles formed in a liquid channel leading to a nozzle of a liquid jetting head from a liquid supply source while ensuring filling speed of a liquid with which the liquid channel is filled, and to provide a liquid jetting device and a cleaning method for the liquid jetting device.SOLUTION: The cleaning device includes: a cap 50 forming hermetically sealed space by abutting on a nozzle forming surface 48 to surround a nozzle 47; a suction pump 52 sucking a space area; a gas-permeable filter 51 arranged in the cap and allowing permeation of air, while regulating permeation of ink; and an elevating mechanism 53 moving the cap between an abutting position where the cap abuts on the nozzle-forming surface and a retreat position where it separates from the nozzle-forming surface. The elevating mechanism moves the cap between a first abutting position where the cap abuts on the nozzle-forming surface in such a state that the gas-permeable filter separates from the nozzle-forming surface, and a second abutting position where it abuts on the nozzle-forming surface in such a state that the gas-permeable filter comes into contact with the nozzle-forming surface to seal the nozzle.
Patent JP-2011002666-A (JP)
Title: Image display device and method for controlling the same
Inventor: OTSUKA MASANORI
IPC: G09G5/00
Filed: 2009-06-18
Abstract: PROBLEM TO BE SOLVED: To improve gradation and contrast, using a plurality of projectors.SOLUTION: A projector 100 projects a 0 to 255 gradation areas at this gradation and clips a more than 255 gradation area at 255, with respect to a 10-bit gradation input image. A projector 200 clips a 255 or less gradation area at zero, projects a 256 to 511 gradation areas at 0 to 255 gradation and clips a more than 511 gradation areas at 255, with respect to the 10-bit gradation input image. A projector 300 clips a 512 or less gradation areas at zero, projects a 512 to 767 gradation areas at 0 to 255 gradation and clips a more than 767 gradation areas at 255, with respect to the 10-bit gradation input image. A projector 400 clips a 767 or less gradation areas at zero and projects a 768 to 1,023 gradation areas at 0 to 255 gradation.
Patent JP-2011002713-A (JP)
Title: Method of manufacturing conductive polyimide belt
Inventor: WATANABE YOSHINOBU
IPC: G03G15/16
Filed: 2009-06-19
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a conductive polyimide belt to obtain a conductive polyimide belt ensuring good dispersion of carbon black and small variations in an electric resistance value and having a desired electric resistance (surface resistance) even with a small additive amount of carbon black, and which suppresses reduction in the mechanical strength of the belt itself because an additive amount of carbon black can be made small.SOLUTION: The method of manufacturing the conductive polyimide belt uses, as a starting material, a carbon black dispersed polyamic acid solution prepared by dissolving and polymerizing a tetracarboxylic acid dianhydride or a derivative thereof and a diamine component in a dispersion prepared by dispersing carbon black in a solvent, wherein when the dispersion is prepared, the carbon black is dispersed in the presence of a cationic or amphoteric surfactant and a content of the surfactant in the dispersion is ≥2.5 wt.%.
Patent JP-2011002192-A (JP)
Title: Waste liquid treating device
Inventor: IZUMI HISAO
IPC: F23G7/04
Filed: 2009-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a waste liquid treating device inhibiting excessive power for operation without using a complex system configuration and excelling in thermal efficiency.SOLUTION: The waste liquid treating device includes: a combustion chamber 1 burning-treating waste liquid by a burner jet; an exhaust pipe 2 taking in exhaust gas after burning treatment from the combustion chamber; a flue 3 communicating with the exhaust pipe and discharging the exhaust gas to the outside; a concentration tank 4 covering the peripheries of the combustion chamber and exhaust pipe, heating and condensing treated waste liquid stored in the tank; and a vapor waste liquid pipe 51 sending treated vapor waste liquid evaporated from the concentration tank into the combustion chamber. An exhaust chamber 20 is interposed in the middle of a pipe line from the combustion chamber 1 of the exhaust pipe 2 to the flue 3 and the vapor waste liquid pipe 51 passes through the inside of the exhaust chamber 20. The vapor waste liquid is sent into the combustion chamber in a state of being heated by heat exchange from the exhaust chamber 20.