Patent CA-3079667-A1 (CA)
Inventor: WHYTE DOUGLAS ALEXANDER
IPC: C09D151/08
Filed: 2020-04-28
Abstract: PATENT ABSTRACT NanoElectronic Activated Circuit Board Metals 1.    Field of the invention The field is electrical and electronic bare printed circuit boards (PCB's), electrical connectors, and quantum nanoconductive polymers. 2.    A broad description of the invention Abstract 2.1        PCEG / QSP / QSG Analysis Electrical connector and contact surfaces are traditionally designed to have as smooth a contact surface area as is reasonably possible. The intent is to maximize metal-to-metal contact area, thus improving and stabilizing the connection to whatever inherent level it is capable of. However, the findings of work with our nanoconductive polymer coating materials suggest that it may in fact be advantageous to design and build connectors from exactly the opposite approach to maximize the gel's function. Introduction of a Pastre-Cristini electroless porous gold film contact surface that displays a theoretically maximum possible surface on micron scales, followed by PreCoat penetration of the metal, followed by GelCoat infusion allows us to achieve electrical contact with a theoretically maximum amount of surface area of metal, thereby potentially improving the connection further than is otherwise possible. Measurements and analysis shows a connector with a surface area of over 500 times the actual surface. 3.    Objectives of the invention (that is, its main practical advantages over existing practices or products) Existing PCBs and Electrical Connectors are simply supplied to the end-user manufacturer as bare metal contact surfaces. Circuit manufacturers have developed various processes to attempt to protect the completed contacts in an after-the-fact basis, but these conductive metal surfaces are subject to wear, corrosion, and a variety of intermittent random failure modes. This patent describes a method whereby the pure contact metal is enhanced beyond its basic properties and protected from the moment of being applied, resulting in finished electrical and electronic circuits that display superior performance and longevity in the field. Date Recue/Date Received 2020-04-28 4.    The preferred practice (that is, the most appropriate use) of your invention, with details of at least one practical application The preferred practice would be to build the fully impregnated PCEG contact surface under defined, controlled conditions during the initial manufacture of the bare board or connector before the copper or other metal of the contact surfaces has had any time to degrade in any way from exposure to environmental conditions. A practical application of this process is the creation of an advanced family of electrical connectors displaying improved properties. 5.    Features of the invention that are new and distinct from what has come before, whether these features are patented or not This method of improving the conductivity and life of printed circuit boards and connectors has never existed before. 6.    The scope of the invention¨for example, the materials, compositions, conditions, etc. used to obtain good results A Pastre-Cristini electroless porous gold film contact surface is combined with two PEG-6-PPG-6-PEG dimethacrylates of the family of chemicals patented previously by Doug Whyte. 7.    The invention's limitations¨for example, if good results can be obtained throughout the given range of the invention, or if there are exceptions There are no exceptions. Consistent results can be obtained utilizing the prescribed materials and application process. 8.    The results of laboratory or commercial tests showing your patent's preferred practice (item 4, above) and the conditions under which poor or dangerous results could be expected Extended life tests performed by ACAMP, the Alberta Center for Advanced Micro and Nano Products shows that the QS PreCoat material penetrates and bonds with the gold resulting in a 31 to 49% improvement in conductivity. This is the opposite of the typical degradation of connectors and circuit boards over their lifetime in the field.  Similar testing of the final HyperNano Gold is yet to be done. 9.    Lists of relevant patents or technical articles already found in any literature search, including full details such as: name of the inventor, number of the patent, country and date of issue or name of the periodical and its date with a list of the similarities and differences of practices or products that are relevant to your invention None found in patent search 10.    Any disclosure you have made (for example, people you may have told about your invention) Date Recue/Date Received 2020-04-28 None 11.    Your name, address and citizenship Douglas Alexander Whyte 11, 4731 Terwillegar Common NW Edmonton, Alberta, Canada Citizenship: Canadian 12.    All countries in which you would like to file for a patent All countries manufacturing bare PCBs. Date Recue/Date Received 2020-04-28