baber/WOPTO huggingface dataset:
Patent JP-2018111032-A (JP)
Title: Game machine
Inventor: KAWAMURA RYUICHIRO
IPC: A63F7/02
Filed: 2018-04-26
Abstract: PROBLEM TO BE SOLVED: To provide a game machine capable of properly suppressing generation of a disadvantage for a player.SOLUTION: A left route of a game area PE is branched at its midway position thereby to form a first guide passage 271 and a second guide passage 272. The first guide passage 271 is so constituted that a ball entry probability into an operation port 83a may be higher than that of the second guide passage 272. The second guide passage 272 is provided with an operation unit 320 for operating by receiving game balls and a guide unit 310 for operating by following the operation unit 320. The guide unit 310 can move to a position where it protrudes into an open part formed in the first guide passage 271, and a standby position where the protrusion is avoided. The operation unit 320 operates so that the guide unit 310 moves from the standby position to the protrusion position. By this, the probability for game balls flowing down the first guide passage 271 to reach the operation port 83a becomes high.SELECTED DRAWING: Figure 6
Patent JP-2018166506-A (JP)
Title: Anti-cxcr3 antibodies
Inventor: MICHELE YOUD
IPC: C12N5/10
Filed: 2018-05-07
Abstract: To provide anti-CXCR3 antibodies and methods of using the antibodies to diagnose and/or treat CXCR3-associated disorders such as diabetes mellitus type I (T1D), particularly new-onset T1D.SOLUTION: There is provided an antibody or antigen binding fragment capable of binding to CXCR3. The antibody or antigen binding fragment comprises 6 complementarity determining regions (CDRs), namely, heavy chain variable domain (VH) CDR1, VH CDR2, VH CDR3, light chain variable domain (VL) CDR1, VL CDR2, and VL CDR3, each of which includes an amino acid sequence selected from a group consisting of specific amino acid sequences.SELECTED DRAWING: None
Patent JP-2019197797-A (JP)
Title: Printed wiring board
Inventor: SAKAMOTO HAJIME
IPC: H01L23/12
Filed: 2018-05-09
Abstract: To provide a printed wiring board with high connection reliability.SOLUTION: A printed wiring board according to an embodiment includes a first buildup layer 50F, a second buildup layer 60 formed on the first buildup layer 50F, and a third buildup layer 70 formed on the second buildup layer 60. The thermal expansion coefficient of a first resin insulation layer 150F forming the first buildup layer 50F is lower than the thermal expansion coefficient of a third resin insulation layer 170F forming the third buildup layer 70. The thickness of the first resin insulation layer 150F forming the first buildup layer 50F is smaller than the thickness of the third resin insulation layer 170F forming the third buildup layer 70.SELECTED DRAWING: Figure 2
Patent JP-2018152884-A (JP)
Title: Image coding apparatus, image coding method and program, image decoding apparatus, image decoding method, and program
Inventor: KOBAYASHI MASAAKI
IPC: H04N19/136
Filed: 2018-05-09
Abstract: PROBLEM TO BE SOLVED: To provide an image encoding/decoding method which makes it possible to control image quality in an appropriate block unit and makes the boundary of the blocks inconspicuous by reducing a boundary of blocks small.SOLUTION: When a first block in a block group having a plurality of blocks smaller than the minimum block size related to a quantization parameter does not have a coefficient which is not zero, in a process of the first block, a difference value related to the shared quantization parameter is not decoded by decoding means. When the difference value related to the shared quantization parameter is not decoded in the process of the first block, and when the block processed after the first block has a nonzero coefficient, in a processing of the block having the coefficient other than zero, a difference value related to the shared quantization parameter is decoded.SELECTED DRAWING: Figure 2
Patent JP-2019197858-A (JP)
Title: Chip manufacturing method
Inventor: YODO YOSHIAKI
IPC: B23K26/53
Filed: 2018-05-11
Abstract: To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.SOLUTION: A chip manufacturing method includes a first laser processing step, a second laser processing step, and a dividing step. The first laser processing step forms a first modified layer along division schedule lines of a chip region by irradiating only the chip region with a laser beam of a wavelength having permeability to a silicon wafer along the division schedule lines. The second laser processing step forms a second modified layer along a boundary between the chip region and an outer peripheral excess region by irradiating the silicon wafer with a laser beam of a wavelength having permeability to the silicon wafer along the boundary. The dividing step divides the silicon wafer into individual chips by applying force to the silicon wafer via heating and cooling.SELECTED DRAWING: Figure 7
Patent JP-2018118173-A (JP)
Title: Game machine
Inventor: ICHIHARA TAKAAKI
IPC: A63F7/02
Filed: 2018-05-14
Abstract: PROBLEM TO BE SOLVED: To provide a game machine capable of maintaining game amusement.SOLUTION: A Pachinko machine 1 includes start pockets capable of receiving a game ball driven onto a game area 5a. When a game ball enters a start pocket, determination processing for winning is performed. Then, variation display corresponding to the determination processing result is started, and a winning game is played when a winning pattern is displayed in the variation display. In this respect, the Pachinko machine 1 can generate the same performance as that when operation is performed even if operation is not performed within a performance reception period to an operation button.SELECTED DRAWING: Figure 60
Patent JP-2018121090-A (JP)
Title: Semiconductor device and method of manufacturing the same
Inventor: NARUSAWA TAKUO
IPC: H01L27/04
Filed: 2018-05-15
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of increasing electrostatic capacitance and suppressing deterioration in withstanding voltage, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device comprises: a lower layer electrode (202); a first insulating film (203) formed on the lower layer electrode (202); an upper layer electrode (204) formed on a part of a surface of the first insulating film (203); and a second insulating film (205) that covers the upper layer electrode (204), the surface, and the lower layer electrode (202).SELECTED DRAWING: Figure 7
Patent JP-2019201472-A (JP)
Title: Electric power tool
Inventor: NAITO AKIRA
IPC: H02K11/215
Filed: 2018-05-15
Abstract: To provide an electric power tool comprising a motor which can reduce the number of components or steps of assembly while achieving more compactification.SOLUTION: A driver drill includes a brushless motor formed by a stator 21 and a rotor, the stator 21 being wound with a plurality of coils 26 via a front insulator 24 and a rear insulator 25, which are positioned on front and rear sides of an axial direction. Short-circuit metal fittings 36A to 36C that short-circuit between certain crossover wires 53, 53 with fusing terminals 38A to 38C electrically connected to the crossover wire 53 of coils 26, 26 are inserted and formed in the front insulator 24.SELECTED DRAWING: Figure 6
Patent JP-2019203267-A (JP)
Title: Joint device between rotation transmission shaft and drilling shaft in drilling device
Inventor: KOMAZAWA TATSUYA
IPC: E21B7/00
Filed: 2018-05-21
Abstract: To provide a joint device between a rotation transmission shaft and a drilling shaft in a drilling device which performs connection between the rotation transmission shaft and the drilling shaft by a mechanical operation, and avoids risks.SOLUTION: A female joint member 12 which is provided to a rotation transmission shaft 10, and where a polygonal hole 22 is formed, and a male joint member 13 which is provided to the upper end of a drilling shaft 31, and where a polygonal shaft part fitted in the polygonal hole 22 is provided, and actuation cylinders which are provided to the rotation transmission shaft 10 are comprised. A pair of lock member 24 of which a lower end portion inserts into and extracts from the polygonal hole 22, and pushing members 28 which push the lock members 24 so that the lower end portions thereof retreat from the polygonal hole 22, and a ring member 29 which is fitted to surround both lock members 24, and makes the lower end portions of the lock members 24 retreat from the polygonal hole 22 by releasing pushing force of the pushing members 28 at a rising position by an actuation of the actuation cylinder, and makes the lower end portions of the lock members 24 go into the polygonal hole 22 at a descending position are provided in the female joint member 12. A groove 34 to which the lower end portions of the lock members 24 connect is formed to the polygonal shaft part of the male joint member 13.SELECTED DRAWING: Figure 2
Patent JP-2019203153-A (JP)
Title: Aluminum alloy-made heat exchanger
Inventor: KOMICHI TOMOHIRO
IPC: C22C21/00
Filed: 2018-05-21
Abstract: To provide an aluminum alloy-made heat exchanger having an outer surface excellent in corrosion resistance under environment in which the air side of the heat exchanger is dilute chloride ion environment.SOLUTION: The aluminum alloy-made heat exchanger is provided that comprises: a core material composes of an aluminum alloy containing 0.6 to 2.0 mass% of Mn and 1.0 mass% or less of Cu, and the balance aluminum and inevitable impurities; and a sacrificial anode material composed of an aluminum alloy containing 2.5 to 10.0 mass% of Zn, and the balance aluminum with inevitable impurities. In the aluminum alloy-made heat exchanger, pitting potential in 5% NaCl solution of the sacrificial anode material surface of a tube of the aluminum heat exchanger is -800 (mV vs Ag/AgCl) or less, and pitting potential in 5% NaCl solution of an aluminum fin of the aluminum alloy-made heat exchanger is less than pitting potential in 5% NaCl solution of the sacrificial anode material surface of a tube of the aluminum alloy-made heat exchanger, the aluminum alloy-made heat exchanger is used under dilute chloride ion environment with 1000 ppm or less in an air side.SELECTED DRAWING: Figure 1
Patent JP-2019204925-A (JP)
Title: Semiconductor device
Inventor: EMA TAIJI
IPC: H01L27/11568
Filed: 2018-05-25
Abstract: To provide a semiconductor device capable of further reducing power consumption.SOLUTION: A semiconductor device 100 comprises: a first semiconductor region 114s having lower concentration than a source region 115s and including a first conductivity type impurity; a second semiconductor region 114d in which concentration of the first conductivity type impurity is lower than a drain region 115d; a channel region 113 provided between the first semiconductor region 114s and the second semiconductor region 114d; and a third semiconductor region 112 provided below the channel region 113 and including a second conductivity type impurity having higher concentration than the channel region 113. When an electric charge is injected into a sidewall insulation film 120d, a semiconductor substrate 101 is grounded, a first voltage higher than a ground potential is applied to a gate electrode 117, a second voltage hither than the ground potential is applied to the drain region 115d, and a third voltage higher than the ground potential and lower than the first voltage and the second voltage is applied to the source region 115s.SELECTED DRAWING: Figure 1
Patent JP-2019204449-A (JP)
Title: Server device and program
Inventor: OTA TAKESHI
IPC: G07G1/12
Filed: 2018-05-25
Abstract: To provide a server device and a program with which it is possible to add the sales of commodities sold on-line to the sales of commodities sold in stores.SOLUTION: The server device comprises: acquisition means for acquiring, from an order acceptance server that accepts an order for a commodity on-line that is sold in a store, first sales registration data that includes at least the sales amount of a commodity to be purchased by the order; determination means for determining whether or not the data formant of the first sales registration data acquired by the acquisition means conforms to the data format of second sales registration data including at least the sales amount of a commodity sold in the store that is generated by a commodity sales data processing device of the store; and calculation means for calculating the sales amount of the store on the basis of the first sales registration data conforming to the data format of the second sales registration data and the second sales registration data.SELECTED DRAWING: Figure 5
Patent JP-2018159166-A (JP)
Title: clothing
Inventor: NOMURA HIROKI
IPC: A41H27/00
Filed: 2018-05-29
Abstract: PROBLEM TO BE SOLVED: To provide a method of bonding clothing where no damage is caused to fabric pieces and employment for three dimensional junction is possible, and to provide clothing.SOLUTION: A plurality of fabric pieces 2, 4 are bonded with adhesives in this method of bonding clothing. The fabric pieces 2, 4, comprised of weft-knitted fabric with heat distortion yarn knitted thereinto, have applied on their bonding parts adhesion 30 mainly comprised of either resin of lower softening temperature than the heat distortion temperature of the heat distortion yarn or a compound of lower melting point than the heat distortion temperature of the heat distortion yarn, and are bonded by heat treatment at a lower temperature than the heat distortion temperature of the heat distortion yarn.SELECTED DRAWING: Figure 4
Patent JP-2019206385-A (JP)
Title: Boxing device
Inventor: HASHIMOTO TAKESHI
IPC: B25J15/00
Filed: 2018-05-30
Abstract: To provide a boxing device capable of efficiently performing a work of expanding a large box and placing a plurality of middle boxes therein with a single device.SOLUTION: The boxing device comprises a first arm 3, a first hand 5 and a control part. The first hand 5 includes a hand base 51, a gripping mechanism 52 provided on the hand base 51 and having a gripping part for gripping upper ends of flap parts B1R and B1L of a large box B1, and a holding mechanism provided on the hand base 51 and having a holding part for holding a middle box B2. The control part controls operations of the first arm and the first hand so that the gripping part of the gripping mechanism 52 performs an expansion operation of moving in a horizontal plane to expand the large box B1 while holding the upper ends of the flap parts B1R and B1L of the folded large box B1, and the holding part of the holding mechanism performs a storage operation for storing the middle box B2 in the expanded large box B1 while holding the middle box B2.SELECTED DRAWING: Figure 1
Patent JP-2018148232-A (JP)
Title: Semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L29/786
Filed: 2018-06-04
Abstract: PROBLEM TO BE SOLVED: To provide a structure related to an insulated gate transistor using an oxide semiconductor, which can suppress a short channel effect as much as possible.SOLUTION: In an insulated gate transistor, by using for an oxide semiconductor layer where a channel region is formed, an intrinsic or substantially intrinsic semiconductor with a carrier concentration of less than 1×10/cmobtained by performing a step of dehydration or dehydrogenation and a step of adding oxygen, and by forming the oxide semiconductor layer having a thickness not less than 15 nm and not more than 30 nm and a gate insulation layer having a thickness not less than 20 nm and not more than 50 nm, or by forming the oxide semiconductor layer having a thickness not less than 15 nm and not more than 100 nm and the gate insulation film having a thickness not less than 10 nm and not more than 20 nm in the case where a length of the channel formed in the oxide semiconductor layer is not less than 0.2 μm and not more than 3.0 μm, a short channel effect can be suppressed and a fluctuation amount of a threshold value within a range of the above-described channel length can be less than 0.5 V.SELECTED DRAWING: Figure 1
Patent JP-2019211968-A (JP)
Title: Two-dimensional position attitude estimation device and two-dimensional position attitude estimation method
Inventor: YAMANAKA MASANOBU
IPC: G06T7/70
Filed: 2018-06-04
Abstract: To provide a two-dimensional position attitude estimation device and a two-dimensional position attitude estimation method, capable of detecting a position attitude of an object on an image without using a template.SOLUTION: A two-dimensional position attitude estimation device comprises: an image acquisition unit 301 which acquires an image; a region extraction unit 302 which extracts an object region, which is a region indicating an object being a target, from the image acquired by the image acquisition unit 301; and a position attitude estimation unit which estimates a position of an object based on a unique point with reproducibility and an attitude of the object based on a unique direction with reproducibility from a region based on the object region extracted by the region extraction unit 302.SELECTED DRAWING: Figure 2
Patent JP-2019213626-A (JP)
Title: Portable baby bed
Inventor: YOSHIOKA HIROMI
IPC: A47D13/04
Filed: 2018-06-11
Abstract: To provide a portable baby bed that facilitates carrying as a bag by compactly folding it.SOLUTION: The portable baby bed can be spread out to use as a baby bed as well as being folded to carry as a bag. The baby bed has a nearly rectangular bottom part 1 which is composed of a sheet-like material having freely deformable flexibility and a side wall 2 which surrounds the upper space of the bottom part 1 and which uses a hard material that is hardly bendable. The side wall 2 includes: a pair of short walls 21, 23 that are each connected to a pair of short sides of the bottom part 1; and a pair of long walls 22, 24 that are each connected to a pair of long sides of the bottom part 1. One pair group of the short walls 21, 23 or the long walls 22, 24 is provided with odd numbered bent lines 201-203 that vertically extend, and the side wall 2 is formed in a freely bendable manner in the wall connection lines for connecting the short walls 21, 23 and the long walls 22, 24 and in the bent lines 201-203.SELECTED DRAWING: Figure 7
Patent JP-2019215775-A (JP)
Title: Moving entity assist system and moving entity assist method
Inventor: SAKAGAMI YOSHIAKI
IPC: G08G1/16
Filed: 2018-06-14
Abstract: To provide a moving entity assist system and method capable of implementing helpful traveling assist by utilizing traveling information concerning plural moving entities.SOLUTION: A moving entity assist system 10 produces map information (experience sharing map information 96) representing a map, which describes a travelable area 120 of a moving entity, on the basis of traveling information 60 concerning plural moving entities (vehicles 16), calculates a traveling pattern 128, which is used to pass a point of interest 122 while traveling within the travelable area 120, on the basis of the map information, and designates a moving entity, which is about to pass the point of interest 122, as an assist object which is assisted in traveling along the calculated traveling pattern 128.SELECTED DRAWING: Figure 10
Patent JP-2018139232-A (JP)
Title: Power storage device
Inventor: TAJIMA RYOTA
IPC: H01M4/134
Filed: 2018-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a power storage device which has high charge/discharge capacity, can perform charge/discharge at high speed, and has less deterioration in battery characteristics due to charge/discharge.SOLUTION: A power storage device includes a negative electrode including a current collector and an active material layer provided on the current collector. The active material layer includes a plurality of protrusions protruding from the current collector and a graphene provided on the plurality of protrusions. Axes of the plurality of protrusions are oriented in the same direction. A common portion may be provided between the current collector and the plurality of protrusions.SELECTED DRAWING: Figure 1
Patent JP-2019219226-A (JP)
Title: Sensor device
Inventor: YAMADA TATSUJI
IPC: G01R25/00
Filed: 2018-06-18
Abstract: To measure a differential AC voltage with good accuracy.SOLUTION: A conversion unit of a sensor device converts an inputted AC or DC voltage into other energy. A conversion amount measurement unit measures the amount of energy converted by the conversion unit. A differential voltage calculation unit corrects the voltage value of a reference voltage and thereby calculates the voltage value of a differential voltage using the amount of energy measured by the conversion amount measurement unit when a differential voltage between a first AC voltage and a second AC voltage is inputted to the conversion unit and the amount of energy measured by the conversion amount measurement unit when a single-end reference voltage is inputted to the conversion unit.SELECTED DRAWING: Figure 1
Patent JP-2019220619-A (JP)
Title: Method of manufacturing semiconductor device, and adhesive for semiconductor used therefor
Inventor: UENO KEIKO
IPC: H01L25/07
Filed: 2018-06-21
Abstract: To suppress a void of a semiconductor device and to easily secure excellent connection reliability while employing a method comprising obtaining a temporary contact-bonded body by heating and pressing a member such as a semiconductor chip at a temperature lower than the fusion point of a connection part thereof when manufacturing the semiconductor device in an FC connection manner.SOLUTION: There is disclosed a method of manufacturing a semiconductor device that comprises the processes of: obtaining a temporary contact-bonded body having a connection part of a first member and a connection part of a second member arranged opposite each other; and pressing the temporary contact-bonded body while heating it so as to obtain a contact-bonded body having the connection part of the first member and the connection part of the second member joined together. The first member and second member are semiconductor chips, etc. An adhesive contains epoxy resin, a hardener, and a flux agent, and has a minimum fusion viscosity of 1,500-3,500 Pa s or less and a gel time of 10-30 seconds or less at 200°C.SELECTED DRAWING: Figure 1
Patent JP-2019218126-A (JP)
Title: Packaging bag
Inventor: ITO TOMOHIKO
IPC: B65D33/00
Filed: 2018-06-22
Abstract: To provide a packaging bag capable of suppressing damage to a stored article when the packaging bag is cut and opened.SOLUTION: A sheet material X includes a pair of sheet material first regions X1 extending from one end to the other end in one direction, and a sheet material second region X2 that constitutes one end in one direction and extends in the other direction and has both ends overlapping the one end in the one direction of the pair of sheet material first regions, a bag-shaped body part includes an annular end part 3 in which the sheet material second region is formed in an annular shape, and a belt-shaped overlapping part 4 in which a pair of sheet material first regions are separably overlapped from one end to the other end in one direction and overlap so that one surface side of the sheet material faces each other, and includes a facing end 6 that both ends of the sheet material second area are formed to overlap and that constitutes one end in one direction of the belt-shaped overlapping part, and a notch 10 extending in one direction formed by cutting a position facing the facing end.SELECTED DRAWING: Figure 2