baber/WOPTO huggingface dataset:
Patent TW-202110023-A (TW)
Title: Electrical grid related methods and uses and a energy farm for executing the electrical grid related methods
Inventor: JOHNSON HOWARD PHILIP
IPC: H02J3/38
Filed: 2020-03-13
Abstract: A method for black-starting an electrical grid(2), the method comprises disconnecting an energy farm (1) from the grid at a first location, said first location being located between the electrical grid(2) and the energy storage (16) with the associated converter (17),providing a synchronous condenser (24), energizing the AC export cable (12) using said energy storage (16) and the associated converter (17), energizing at least one part of the energy farm electrical infrastructure via said AC export cable (12) using said energy storage (16) and the associated converter (17), re-establishing energy supply to said energy farm electrical infrastructure by said electric generators (3, 4),energizing said synchronous condenser (24), and reconnecting the energy farm (1) to said electrical grid(2) at said first location.
Patent TW-202100655-A (TW)
Title: Actuator assembly for a camera module
Inventor: KIM YOUNG SHIN
IPC: H05K13/04
Filed: 2020-03-19
Abstract: A camera module that includes a housing which which a lens module is positioned that contains one or more lenses and an actuator assembly that is configured to drive the lens module in an optical axis direction is provided. The actuator assembly includes a guide unit that is positioned between the housing and the lens module. The guide unit comprises a polymer composition that includes a polymer matrix containing an aromatic polymer, wherein the polymer composition exhibits a flexural modulus of about 7,000 MPa or more as determined in accordance with ISO Test No. 178:2010 at 23℃ and a Rockwell surface hardness of about 25 or more as determined in accordance with ASTM D785-08 (Scale M).
Patent TW-202139487-A (TW)
Title: UVC LED package structure preventing adhesive layer from cracking caused by long-term irradiation to extend service life of UVC LED
Inventor: YE ZHI-TING
IPC: H01L33/60
Filed: 2020-04-07
Abstract: The present invention relates to a UVC LED package structure, which includes an insulation substrate disposed below an insulation bump, a UVC LED flip chip disposed above the insulation bump, and a quartz package member packaged on the UVC LED flip chip. A spacer layer is disposed between the insulation substrate and the quartz package member. A protruded portion is disposed around the joint of the insulation substrate and the quartz package member, wherein the protruded portion is disposed in the spacer layer. Through the structure of the protruded portion, the present invention may avoid the cracking of an adhesive layer caused by irradiating the UVC LED flip chip by light for a long time.
Patent TW-202105677-A (TW)
Title: Film substrate, circuit substrate, display device and electronic machine
Inventor: WAKISAKA YUSUKE
IPC: H01L51/50
Filed: 2020-04-15
Abstract: This invention relates to an electronic machine using COF (chip on film) technology. such as an LCD TV. The circuit substrate of the present invention includes a substrate, a first metal layer and a second metal layer on the substrate, an adhesive and a first connection portion formed on the first metal layer, and the adhesive and a second connection portion formed on the second metal layer, and a coating layer formed on the adhesive; in opening portions of the adhesive and the coating layer, the first metal layer is connected to an integrated circuit via the first connection portion, and the second metal layer is connected to the integrated circuit via the second connection portion; the coating layer is a film containing polyimide; and the first metal layer and the second metal layer are provided for the neutral axis to pass through.
Patent TW-202040678-A (TW)
Title: Device chip manufacturing method
Inventor: WEI FRANK
IPC: B23K26/38
Filed: 2020-04-23
Abstract: A device chip manufacturing method includes an attaching a wafer to the first surface of a semiconductor ingot, separating the semiconductor ingot into a subject part and a remaining part after attachment, the subject part being attached to the wafer to form a laminated wafer having a front side as an exposed surface of the subject part and a back side as an exposed surface of the wafer, setting a plurality of crossing division lines on the front side of the laminated wafer to thereby define a plurality of separate regions after separation, and next forming a plurality of devices in the respective separate regions, and then dividing the laminated wafer along the division lines after forming the devices, thereby forming the plural device chips including the respective devices.
Patent TW-202142402-A (TW)
Inventor: KO CHUN-MIN
IPC: B32B27/08
Filed: 2020-05-12
Abstract: A wavelength-converting device according to theinvention includes an upper barrier layer, a lower barrier layer and a wavelength-converting layer bonded between the upper barrier layer and the lower barrier layer. The upper barrier laye includes a transparent first polymer substrate, a transparent inorganic material barrier film, a traneparent polymer barrier film, a transparent second polymer substrate and a transparent polymer adhesive film. The inorganic material barrier film and the polymer barrier film are overlaid between the first polymer substrate and the second polymer substrate. The polymer adhesive film is overlaid on a lower surface of the first polymer substrate. The upper barrier layer is adhered via the polymer adhesive film on the wavelength-converting layer. A water vapor transmission rate (WVTR) of the upper barrier laye has a range of from 0.01 to 0.5 g/m 2 
•day. The structure of the lower barrier laye is idental to that of the upper barrier laye.
Patent TW-202145393-A (TW)
Inventor: TSAI CHUN-YEN
IPC: G06K9/62
Filed: 2020-05-18
Abstract: A testing system of a chip package includes a transport module, an image capturing module and a processor. The transport module is configured to transport a plurality of chip package along a transport path, so that the plurality of chip packages pass through a picturing region and a testing region. The image capturing module is disposed at the picturing region and configured to move within the picturing region to capture a plurality of images of at least adjacent two of the chip packages located in the picturing region. The testing module is disposed at the testing region to perform chip testing on the plurality of chip packages. The processor is coupled to the image capturing module and the testing module to decide whether to perform the chip testing on at least the adjacent two of the chip packages simultaneously. A testing method is also provided.
Patent TW-202202426-A (TW)
Inventor: CHOI BYUNG-IL
IPC: H05K3/00
Filed: 2020-06-30
Abstract: The present invention provides an apparatus for automatically separating copper plates, which includes: a copper plate stacking table for stacking a plurality of copper plate attachment assemblies formed by an upper copper plate and a lower copper plate attached in a state where an intermediate plate is formed by intervening in the middle; a copper plate assembly lifting part for lifting the uppermost copper plate attachment assembly among the plurality of copper plate attachment assemblies toward the upper side; an upper plate separation module installed adjacent to the copper plate assembly lifting part; a lower plate separation module installed adjacent to the upper plate separation module for separating the lower copper plate from the copper plate attachment assembly that separates the upper copper plate; a copper plate movement part installed on the side of the upper plate separation module and the lower plate separation module; and a bending correction module installed adjacent to the lower plate separation module.
Patent TW-202108799-A (TW)
Title: Pulsed dc sputtering systems and methods
Inventor: ANDOSCA ROBERT GEORGE
IPC: H05H1/46
Filed: 2020-07-27
Abstract: Systems and methods for are disclosed. One method includes providing at least a first electrode, a second electrode, and a third electrode and using each of at least two, separate and different, target materials in connection with the three electrodes to enable sputtering. The method also includes applying a first voltage at the first electrode that alternates between positive and negative relative to the second electrode during each of multiple cycles and applying a second voltage to the third electrode that alternates between positive and negative relative to the second electrode during each of the multiple cycles.
Patent TW-202206885-A (TW)
Title: 成像鏡頭、取像裝置及電子裝置
Inventor: LAI YU-CHEN
IPC: G02B13/18
Filed: 2020-08-12
Abstract: 一種成像鏡頭，具有光軸，包含環狀結構，位於成像鏡頭的物側並環繞光軸，且包含第一通孔、第二通孔、第一錐面、第二錐面及第三錐面。第一通孔設置於環狀結構的物側。第二通孔與第一錐面設置於第一通孔的像側。第一錐面由第一通孔往第二通孔並遠離光軸的方向延伸。第二錐面設置於第二通孔的物側。第三錐面設置於第二通孔的像側。第一錐面與第二錐面往遠離光軸的方向漸縮靠近。第二錐面與第三錐面往第二通孔漸縮。第二通孔為尖端開孔。藉此，可增加光陷阱結構的效果以提升成像品質。
Patent TW-202146991-A (TW)
Title: 顯示模組
Inventor: LU SHUANG-LONG
IPC: G02F1/1335
Filed: 2020-08-21
Abstract: 顯示模組包括顯示面板、背光單元以及第一遮光層。背光單元位於顯示面板之一側且包括背板以及膠框。背板具有開孔，開孔具有半徑R。膠框具有至少一凹槽。背板的反射率大於膠框的反射率。開孔的圓心與膠框的內緣之間具有最短距離H，凹槽的至少一部分位於通過開孔的圓心且垂直於膠框的內緣的線段往兩側延伸長度L的範圍內，且長度L等於 。
Patent TW-202117898-A (TW)
Title: Method for cleaning substrate processing device, and substrate processing system
Inventor: FUKUI SHOGO
IPC: B08B3/08
Filed: 2020-08-31
Abstract: An object of the invention is to provide a method for cleaning a substrate processing device and a substrate processing system that are capable of suppressing the adhesion of particles to a substrate when performing drying processing using a supercritical fluid.
A method for cleaning a substrate processing device in which drying processing that dries a substrate is conducted by bringing a supercritical fluid into contact with the substrate in a state where the substrate surface has been wet by a liquid, the method including a step of spreading through the interior of the substrate processing device a cleaning fluid prepared by mixing a supercritical fluid and a solvent that contains polar molecules and has a lower boiling point than the aforementioned liquid, and a step, performed after the spreading of the cleaning fluid, of discharging the cleaning fluid from the interior of the substrate processing device.
Patent TW-202210718-A (TW)
Inventor: KAO SHIN-MIN
IPC: F04B49/08
Filed: 2020-08-31
Abstract: An airstream regulating device of fluid mechanical having a case body, a guide vane member and an actuator is provided. The case body has a cavity inside, an air outlet and a through hole connected to the cavity are arranged on the case body. The guide vane member is disposed in the cavity and has a fixed ring, a rotating ring and a plurality of connecting rods, the fixed ring is connected to the case body and arranged around the air outlet. A plurality of vanes is mounted onto the fixed ring. The rotating ring is rotatably sleeved on the fixed ring. Each connecting rod is set between each vane and the rotating ring. The actuator is arranged on the case body and has a telescopic rod that disposed in the through hole and reciprocated and retracted in the axial direction, and the end of the telescopic rod is connected to one of the connecting rods or the rotating ring.
Patent TW-202128138-A (TW)
Title: Process for the preparation of a nanoparticulate active ingredient
Inventor: Cai qing-bai
IPC: A61K9/51
Filed: 2020-10-07
Abstract: A process for the preparation of a nanoparticulate active ingredient comprises the steps of: a) providing a solvent, a pharmaceutical active ingredient dissolved in the solvent, a liquid antisolvent and a stabilizer which is dissolved in the solvent or in the antisolvent and wherein the antisolvent is miscible in the solvent; b) mixing the solvent, the active ingredient, the antisolvent and the stabilizer in a micromixer, thereby obtaining a suspension comprising a precipitate of the active ingredient, the solvent and the antisolvent. The active ingredient precipitate is present in the form of nanoparticles having an average particle size of ≥ 10 nm to ≤ 999 nm and a particle size distribution, determined by dynamic light scattering (DLS) according to ISO 22412:2017, having a polydispersity index of ≤ 0.2.
Patent TW-202124299-A (TW)
Title: Apparatus and method for processing a molten material, making an electrically heated vessel, or making glass
Inventor: ANGELIS GILBERT DE
IPC: C03B7/07
Filed: 2016-10-21
Abstract: Disclosed is an apparatus and method of making molten glass. The apparatus includes a vessel for conveying the molten glass and at least one flange configured to supply an electric current to the vessel through the flange, the flange including a first ring extending completely around the vessel in a closed loop, the first ring comprising a first portion including a first thickness and a second portion including a second thickness different from the first thickness, wherein the first portion and the second portion overlap in a plane of the flange such that at least a portion of the first portion is positioned between at least a portion of the second portion and the vessel wall, and neither the first portion nor the second portion extends completely around the vessel. Also disclosed is a method of making glass using the disclosed flange.
Patent TW-202125061-A (TW)
Title: Liquid crystal display device
Inventor: SATO AYUMU
IPC: G02F1/1343
Filed: 2020-10-15
Abstract: This liquid crystal display device comprises: a liquid crystal layer 12 that is sandwiched between first and second substrates and is vertically aligned (VA) when there is no electric field; a switching element 13 provided on a substrate 10; a connection electrode 18 connected to the switching element 13; a reflective film 20-1 provided above the switching element 13; pixel electrodes 22-1, 22-2 provided above the reflective film 20-1; contacts 23-1, 23-2 that connect the pixel electrodes 22-1, 22-2 and the connection electrode 18; a film thickness adjustment layer 25-1 provided on a substrate 11; a common electrode 26 provided on the substrate 11 and the film thickness adjustment layer 25-1; and protrusions 27-1, 27-2 provided on the common electrode 26. The protrusion 27-1 is disposed to be offset from the center of the pixel electrode 22-1 in a first direction toward the film thickness adjustment layer 25-1.
Patent TW-202218157-A (TW)
Title: Semiconductor device and forming method of semiconductor structure
Inventor: HSIN YUE-MING
IPC: H01L29/778
Filed: 2020-10-19
Abstract: A semiconductor device includes a substrate, a buffer layer disposed on the substrate, a barrier layer disposed on the buffer layer, a source, a drain, and a gate stack. The source, the drain, and the gate stack are disposed on the barrier layer. The gate stack includes a first epitaxial layer on the barrier layer, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer on the second epitaxial layer. The semiconductor device further includes a gate disposed on the gate stack.
Patent TW-202217221-A (TW)
Title: Bow and arrow apparatus capable of having a longer stroke under the same length of the gun body
Inventor: Liu ji-chang
IPC: F41B5/12
Filed: 2020-10-22
Abstract: This invention relates to a bow and arrow apparatus, including a gun body provided with a slideway section and a head section which are connected with each other, wherein the head section is provided with a main part connected with the slideway section, and two sides of the main part are respectively extended to form extension parts; pulleys respectively pivoted to the tail ends of the extension parts; bow arms respectively provided with a body connecting end and a string connecting end which are away from each other, wherein the body connecting ends are respectively connected to two sides of the slideway section, and both of the string connecting ends are closer to the head section than the corresponding body connecting ends; a primary string of which two ends are respectively connected to the two pulleys; and two secondary strings respectively connected to each pulley and the string connecting end of the corresponding bow arm, so that the disposing position of the primary string in this invention is closer to the front than a known product, a longer stroke may be achieved under the same length of the gun body, and the structure of a known crossbow is really improved.
Patent TW-202218252-A (TW)
Title: Socket structure
Inventor: CHEN WEI-YAO
IPC: H01R13/514
Filed: 2020-10-23
Abstract: The present invention provides a socket structure including: a circuit board, an insulation base, a pin and a conductive component. The insulation base is disposed on the circuit board and includes a first surface and a second surface opposite to each other. The pins are arranged between the first surface and the second surface. The conductive component is connected between the circuit board and the insulation base, and includes a first arm, a second arm and a connection end. The first arm and the second arm are connected to each other through the connection end. The first arm is fixed on the second surface of the insulation base and connected with the pin, and has a first fixed end passing through the circuit board. The second arm has a second fixed end passing through the circuit board.
Patent TW-202219769-A (TW)
Inventor: HUANG TSUNG-CHU
IPC: G06F119/04
Filed: 2020-11-04
Abstract: A circuit aging monitoring system for monitoring a circuit under test includes a single-aging factor-enhanced sub-circuit, a neural-network-based classifier and a single-aging factor-enhanced ring array. The single-aging factor-enhanced sub-circuit outputs a sensing result. The neural-network-based classifier is electrically connected to the single-aging factor-enhanced sub-circuit. The neural-network-based classifier includes a neural network model, and the neural network model receives the sensing result. The single-aging factor-enhanced ring array is electrically connected to the neural-network-based classifier and includes a plurality of single-aging factor-enhanced rings. The single-aging factor-enhanced ring array generates at least one annotation via the single-aging factor-enhanced rings and transmits the at least one annotation to the neural-network-based classifier. The neural network model is trained based on the sensing result and the at least one annotation, and the neural-network-based classifier monitors the circuit under test to generate an aging signal. Therefore, the present disclosure can utilize co-learning of the single-aging factor-enhanced shadow trees and the single-aging factor-enhanced rings, thereby improving the perception accuracy.
Patent TW-202136575-A (TW)
Title: Method and apparatus for controlling a shape of a pattern over a substrate
Inventor: KATSUNUMA TAKAYUKI
IPC: C23C16/52
Filed: 2020-11-26
Abstract: An apparatus and method process a substrate in a first session and a second session. In the first session, a hybrid gas application cycle is performed in a chamber that holds the substrate. A first gas is introduced for a first time period so components of the first gas adsorb onto the substrate. Subsequently, a second gas is introduced for a second time period so the second gas reacts with the components of the first gas to provide a protective layer on sidewalls of a pattern of the substrate, and the second gas etches a bottom portion of the pattern, a ratio of the first time period to the second time period being a use-ratio. Then, in a second session, the hybrid gas application cycle is repeated with a different use-ratio that corresponds with a vertical dimension of the pattern.
Patent TW-202130878-A (TW)
Title: Pile fabric and manufacturing method therefor
Inventor: HIRAI YUSUKE
IPC: D06C11/00
Filed: 2020-12-16
Abstract: The present invention relates to a pile fabric wherein the difference between the average length of a long pile section and the average length of a short pile section is 2mm or greater, the long pile section and the short pile section each include 60 wt% or more of crimped polyester fibers, the crimp removal temperature of the polyester fibers used in the long pile section is lower than the crimp removal temperature of the polyester fibers used in the short pile section, the crimp removal temperature of the polyester fibers used in the short pile section is greater than or equal to 90 DEG C and less than or equal to 120 DEG C, and this crimp removal temperature is the minimum temperature that satisfies a particular relationship. The present invention is thus able to provide a pile fabric that has a long pile section and a short pile section, is provided with a good external appearance, feeling of volume, and packing recovery property, and furthermore has a superior crimp removal property, as well as a manufacturing method therefor.
Patent TW-202133621-A (TW)
Title: Residual coding to support both lossy and lossless coding
Inventor: KARCZEWICZ MARTA
IPC: H04N19/60
Filed: 2020-12-23
Abstract: An example device includes memory configured to store video data and one or more processors implemented in circuitry and coupled to the memory. The one or more processors are configured to determine whether transform skip mode is used for a current block of the video data. The one or more processors are configured to disable level mapping for residual coding based on transform skip mode being used for the current block. The one or more processors are configured to code the current block without applying level mapping.
Patent TW-202221547-A (TW)
Title: Method for calculating liquid-solid interface morphology during growth of ingot
Inventor: ZHAO YAN
IPC: C30B35/00
Filed: 2021-01-27
Abstract: The present invention provides a method for calculating the liquid-solid interface morphology during growth of the ingot. The method comprises providing a wafer, selecting plural sampling locations on the wafer and detecting electrical resistivity at the plural sampling locations, calculating height differences between the sampling locations based on the detected electrical resistivity, and illustrating the morphology of the liquid-solid interface based on the calculated height differences. The method of the invention has advantages including easy operation and low cost.
Patent TW-202232749-A (TW)
Title: Micro light emitting diode chip and micro light emitting diode display
Inventor: Sun sheng-yuan
IPC: H01L33/10
Filed: 2021-02-04
Abstract: A micro light emitting diode chip includes an epitaxy structure, an electrode, a transparent structure, and a reflective layer. The epitaxy structure has a light exit surface, a back surface opposite to the light exit surface, and a side wall surface. The side wall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxy structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the side wall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflective layer direct contacts the outer surface. A micro light emitting diode display is also provided.
Patent TW-202136370-A (TW)
Title: Light stabilizer mixture
Inventor: WEYLAND TANIA
IPC: C08G73/06
Filed: 2021-02-09
Abstract: A stabilizer mixture comprising a sterically hindered amine light stabilizer, a triazine UV absorber and a benzophenone UV absorber.