baber/WOPTO huggingface dataset:
Patent JP-2001055742-A (JP)
Title: Preliminary evaluation device for design of structure, and information storage medium
Inventor: ISEMOTO NORIAKI
IPC: E02D27/00
Filed: 1999-08-17
Abstract: PROBLEM TO BE SOLVED: To provide a preliminary evaluation device for designing structure, by which whether or not a spread foundation can be adopted is decide while and adoptable spread-foundation work plan is selected and its cost can be calculated at the design stage of the object structure. SOLUTION: The preliminary evaluation device for designing the structure contains a foundation-work plan selection means 12, in which whether or not a spread foundation can be adopted for the object structure is decided on the basis of data for designing the object structure comprising data indicating the conditions of a site and a ground, on which the object structure is built, and building condition data required for the object structure and a spread-foundation work plan adoptable for the object structure in which a spread foundation can be adopted is selected, and a cost calculation means 14 in which the cost of the object structure adopting the foundation work plan is calculated on the basis of data for calculating the cost of the selected spread-foundation work plan and the data for designing.
Patent JP-H1187414-A (JP)
Title: Semiconductor device and manufacturing method therefor
Inventor: AKIYAMA YUKIHARU
IPC: H01L23/495
Filed: 1997-08-27
Abstract: PROBLEM TO BE SOLVED: To attain reduction in cost and improving the sealing property of a chip-size semiconductor device. SOLUTION: This device comprises of an elastormer 3 which is provided on a major surface 1a of a semiconductor chip 1 by exposing an electrode pad 1b and of a substrate body 4a on which a wiring 4d, a terminal of which is electrically connected with the electrode pad 1b of the semiconductor chip 1 via a lead 4c and other terminal of which is connected electrically with a bump electrode 2 is provided. Further an opening 4e for exposing the electrode pad 1b and the device comprising a thin-film wiring substrate 4 which is provided with a substrate projecting part 4b projecting to the outsides of the opening 4e and the semiconductor chip 1 and of a sealing part 5 which seals the electrode pad 1b of the semiconductor chip 1 and the lead 4c of the thin-film wiring substrate 4.  As a result, means the substrate body 4a and the substrate projecting part 4b on the thin film wiring substrate 4 are formed in a single body.
Patent JP-H1174558-A (JP)
Title: Gallium nitride group compound semiconductor element and its manufacture
Inventor: NOZAKI CHIHARU
IPC: H01S5/00
Filed: 1997-08-27
Abstract: PROBLEM TO BE SOLVED: To lower a contact resistor arising between a p-side electrode and a p-side contact layer, while low threshold value or low operation voltage does not cause degradation, but obtain improved reliability. SOLUTION: Relating to the GaN group semiconductor laser, an n-GaN contact layer 3, an n-AlGaN clad layer 4, a GaN waveguide layer 5, an MQW active layer 6, a GaN wave-guide layer 6, a p-AlGaN clad layer 8, and a p-GaN contact layer 9, each of which is single crystal, are grown on a sapphire substrate 1, and p-side electrodes 11 and 12 of Pt/Au are formed on a part of the contact layer 9, and a part of such range from the contact layer 9 to the clad layer 4 is etched, and, on an exposed contact layer 3, an n-side electrode 13 of Ti/Au is formed. Here, between the contact layer 9 and the p-side electrodes 11 and 12, a polycrystal GaN layer 10 wherein, being 10 nm or less in thickness, carrier concentration is 1×10<17> cm<-3> or more, is inserted.
Patent JP-H0279383-A (JP)
Title: Apparatus for fitting wire in connector
Inventor: TANNO SHOGO
IPC: H01R43/00
Filed: 1988-09-14
Abstract: PURPOSE:To carry out fitting wire in a connector highly efficiently and automatically by moving a wire to a horizontal direction and pushing and rotating right and left leg parts of the wire to a horizontal state when the middle part reaches the most upper part. CONSTITUTION:Wires 21 are elevated one by one by an elevating means 32 while the middle parts of the wires are held to be able to rotate, and just before the elevation a direction changing means 46 is set back by a cylinder, etc., or an elastic part 42 of a crevice part 41 is set back by resilience caused by means wherein the middle part of a wire is contacted with a declining plane of its crevice part 41. When the middle part of a wire reaches to the most upper part, the right and left leg parts of the wire is pushed by a cylinder, etc., and the wire rotates on the middle part as a center and becomes in horizontal state and mounts on the upper plane of the crevice part 41. Then, when a pushing part 47 is moved forward, the wire, while keeping the horizontal state, is moved forward, inset in a wire fitting sliding part of a connector held by a holder 59, and fitted. By this method, wires are fitted automatically and highly efficiently and precisely in a connector for wire harness.
Patent JP-H0395656-A (JP)
Title: Bit width variable information processor
Inventor: TANABE NOBORU
IPC: G06F13/16
Filed: 1989-09-08
Abstract: PURPOSE:To secure the working of a memory having the small bit width by connecting a bus cutting mechanism and selecting a memory bank corresponding to the address value via a decoder when a bus master having the access right has the small bit width. CONSTITUTION:The memory banks 11 and 12 are provided in this example and connected to each other via a bus transceiver. The data bus of the 1st bank 11 is led directly to an 8-bit processor and a 16-bit processor. At the same time, the data bus of the 2nd bank 12 is connected to the 8-bit processor via a bus transceiver 13. The transceiver 13 is set in an enable state via a decoder 14 only when a bus master having the access right is equal to the 8-bit processor and has an access to the address corresponding to the bank 12. In such a constitution, each processor can have accesses to a memory with no consciousness of the fluctuation of the bit width as long as an access is granted by an arbitration circuit to the memory.
Patent JP-H0978200-A (JP)
Title: Hard stainless steel containing mo and mn
Inventor: SAITO YOSHIYUKI
IPC: C22C38/58
Filed: 1995-09-08
Abstract: PROBLEM TO BE SOLVED: To provide a hard stainless steel excellent in wear resistance without incorporating Co by specifying respective contents of Si, Cr, Mo, (C+N), and (Ni+Mn). SOLUTION: The hard stainless steel has a composition consisting of, by weight, 0.3-2% of (C+N) (which can be replaced by C in the range of 0.3-2% C and 0-1.7% N), 8-20% of (Ni+Mn) (which can be replaced by Mn in the range of 5-17% Mn and 3-15% Ni), 0-2.5% Si, 15-28% Cr, 6-13% Mo, and the balance Fe. This hard stainless steel, containing Mo and Mn, has excellent wear resistance in the temp. range from room temp. to about 700 deg.C and, particularly, is superior to conventional Co-base alloys in wear resistance in the vicinity of 300 deg.C.
Patent JP-H0784958-A (JP)
Title: On-line subsystem execution system
Inventor: NOYORI SATOKI
IPC: G06F15/00
Filed: 1993-09-17
Abstract: PURPOSE:To localize the influence range of an on-line down by executing transactions which are some of on-line processes that can be executed by a subsystem even in case of the on-line down if the on-line down occurs to a main system. CONSTITUTION:The main system holds a subsystem information table 1. The subsystem information table 1 manages respective subsystems 1-(n) with serial numbers, and also holds information indicating that the subsystems currently operate or end normally or abnormally, file code information on files constituting a subordinate data base 6, and information showing whether or not there is a batch transaction to be executed at the on-line startup in a batch input file 5 at the same time. If the on-line down occurs to the main system which performs the on-line processes, the subsystems 1-(n) executes the transactions which are some of the on-line processes that can be executed by the subsystems 1-(n) even in case of the on-line down.
Patent JP-H1074797-A (JP)
Title: Semiconductor package and lead frame
Inventor: OSAWA KENJI
IPC: H01L23/12
Filed: 1996-09-02
Abstract: PROBLEM TO BE SOLVED: To make it possible to inject resin easily from the rear face side of a chip even if the size of an outer ring is reduced by forming, in an irmer face of the outer ring which surrounds the semiconductor chip, an expanded section which expands towards outside, at the rear face side of the chip. SOLUTION: In an inner face lla of an outer ring 11, an expanded section 13 which expands outwards is formed at the rear face side of a semiconductor chip 2. The expanded section 13 is so formed that am angle H formed by the expanded section 13 and the inner face lla of the outer ring u! b 30 to 45'. By forming the expanded section 13, the space between the semiconductor chip and the outer ring 11 can be made larger than G at the rear face side of the chip. Therefore, a large port can be secured for injecting seal ing resin 12 even if the size of the outer ring 11 is reduced and thereby the package size can be lessened.
Patent JP-H0685425-A (JP)
Title: Board for mounting electronic part thereon
Inventor: KATO ARIMITSU
IPC: H05K3/40
Filed: 1992-08-31
Abstract: PURPOSE:To provide an electronic part mounting board on which an electronic part can be detachably mounted easily. CONSTITUTION:A conductor plate 5, which is connected to the wiring 3 of a board 4, is provided in such a manner that it is extended to the through hole 2 perforated on the board 4 for insertion of an electronic part. As a result, when the terminal 1 of the electronic part is inserted into the through hole 2, both of them are brought into contact with each other completely by press- bending the conductor plate 5 by the terminal of the electronic part. As a result, the terminal 1 of the electronic part and the wiring on the board can be electrically connected.
Patent JP-H1073910-A (JP)
Title: Photographic material processing device
Inventor: HASHIMOTO HIROYUKI
IPC: G03D5/04
Filed: 1996-09-02
Abstract: PROBLEM TO BE SOLVED: To miniaturize a device and save the area of the setting space by performing all processings of a color photographic material with a processing solution in a processing carrying passage formed only of a descending carrying passage, an ascending carrying passage, and a connecting carrying passage therefor. SOLUTION: A processing tank 1 internally has a processing carrying passage formed of one descending carrying passage for carrying a photosensitive material downward, one ascending carrying passage for carrying the photographic material upward. and a curved carrying passage 8 which is a connecting carrying passage for mutually connecting both the carrying passages. The descending carrying passage has a color development part 2 and a bleaching part 3, the ascending carrying passage has a fixed part 4 and a stabilizing part 5, and the curved carrying passage 8 has no processing part.  Namely, all processing parts except a drying part 6 are provided in the processing carrying passage formed of one descending carrying passage, one ascending carrying passage and one connecting carrying passage with in the processings tank 1 of pseudo sealed stricture, where in all processings of the photographic material with processing solution are performed.
Patent JP-S60122727-A (JP)
Title: Manufacture of fine powder of hexagonal ferrite
Inventor: SASAKI ISAMU
IPC: H01F1/11
Filed: 1983-12-08
Abstract: PURPOSE:To obtain the titled fine powder which is remarkably fine and isolated hexagonal lamellar with a simple process by heating a freeze-dried material of a soln. contg. an amorphous coprecipitated material which is obtained by adding an alkali aq. soln. to an aq. soln. of specified Ba, Sr and Pb salts and iron salt. CONSTITUTION:At least one kind of chloride of Ba or Sr and nitrate of Ba, Sr or Pb, and an aq. soln. of chloride or nitrate of Fe and an aq. alkali soln. of hydroxide and carbonate of Na, K or NH4 which is equivalent to former metallic elements are mixed to obtain the soln. contg. an amorhpous coprecipitated material. Fine powder wherein amorhpous powder and neutralized salt are mixed uniformly is obtained by freez-drying the soln. after said soln. is aged for several hours. When the dried material is heated at 700-1,000 deg.C in the air, the amorphous powder is crystallized to magneto plumboferrite type hexagonal ferrite. Next, objective fine powder can be obtained by washing with water and drying to remove the neutralized salt.
Patent JP-H1076406-A (JP)
Title: Cemented carbide cutting tool covered with hard covering layer excellent in anti-chipping property
Inventor: OSADA AKIRA
IPC: C23C16/30
Filed: 1996-09-02
Abstract: PROBLEM TO BE SOLVED: To eliminate an occurrence of chipping of a cutting edge even in high speed/ feed cutting work on cast iron or steel, which is subjected to severe cutting condition, and to give excellent cutting property for a long period by taking advantage of the fact that a columnar Al2 O3 layer has higher strength and higher ductility compared with a granular Al2 O3 layer. SOLUTION: A cemented carbide cutting tool covered with a hard covering layer is formed by chemically/physically vapor-depositing both one or more out of Ti- compound layers consisting of hard covering layers containing an Al2 O3 layer, e.g. Ti-C layer, Ti-N layer, Ti-CN layer, Ti-O2 layer, Ti-CO layer, Ti-NO layer, and Ti- CNO layer, and a hard covering layer consisting of an Al2 O3 layer on the surface of a WC-group cemented carbide substrate to the mean thickness of 2 to 20μm.  In this case, Al2 O3 layer constituting the hard covering layer should be such that the main body of Al2 O3 is of an α-type crystal structure, the crystalline structure of the upper side part is different from that of the lower side part (substrate side), the upper side part is constituted of the columnar Al2 O3 layer having the crystalline structure in which columnar grains are arranged in parallel in the longitudinal direction, and the lower side part is constituted of the granular Al2 O3 layer having the granular crystalline structure.
Patent JP-H1157707-A (JP)
Title: Method and device for controlling resistivity of ultrapure water
Inventor: SAKAI KAZUNARI
IPC: C02F1/44
Filed: 1997-08-28
Abstract: PROBLEM TO BE SOLVED: To make the device easy to be handled with an extremely simplified member and without need of a special control mechanism by specifying the volume occupied by the membrane in the housing of a hollow-fiber membrane module in a low-density range and keeping the pressure of of carbon dioxide constant by a pressure regulating valve. SOLUTION: This hollow-fiber membrane module is of an externally irrigated type. Namely, ultrapure water is passed through the space between the outside of a hollow fiber 5 and a housing 4, and carbon dioxide is supplied to the inside of the hollow fiber 5. Plural hollow fibers 5 are bundled and set in the housing 4 so that the volume occupied by the hollow fibers 5 is controlled to 1-30% of the content volume of the housing 4. The pressure of the carbon dioxide to be supplied to the membrane module is kept constant. Since the volume of the hollow fibers 5 is controlled to <=30% of the content volume of the housing 4. most of the ultrapure water flowing in the housing 4 is not brought into effective contact with the outer surface of the hollow fiber 5. The carbon dioxide is dissolved in the ultrapure water in contact with the outer surface of the hollow fiber 5 in high concn.
Patent JP-S6291429-A (JP)
Title: Production of glass
Inventor: TAKEUCHI TETSUHIKO
IPC: C03B8/02
Filed: 1985-10-18
Abstract: PURPOSE:To make a concentration process smooth and to make mass production of glass easy in a producing method of glass due to a sol-gel process by subjecting the dispersed liquid of a fine grain of silica which is obtained by hydrolyzing alkylsilicate with a basic catalyst to ultrafiltration and concentration. CONSTITUTION:In a method producing glass by a sol-gel process wherein alkylsilicate is used as an essential raw material, the dispersion liquid of a fine grain of silica which is obtained by hydrolyzing alkylsilicate with a basic catalyst is concentrated by an ultrafiltration membrane. The concentration process of the dispersion liquid of the fine grain of silica wherein a long period is necessitated and it is inefficient and also the loss of an available component is caused in the conventional technique can efficiently and effectively be performed and the mass production is made easy. Furthermore obtained quartz glass is inexpensive in cost and the purification is possible and the mass production of high-quality quartz glass is made easy because the raw materials are wholly liquid.
Patent JP-S6291299-A (JP)
Title: Method for flocculating and dehydrating sludge in belt press type dehydrator
Inventor: SUGAWARA MASATAKA
IPC: B01D33/04
Filed: 1985-10-17
Abstract: PURPOSE:To enhance handling safety, by mounting a two-stage flocculation process consisting of a pre-flocculation process and a post-flocculation process. CONSTITUTION:A secondary flocculation part 4' is provided to the terminal part of a primary gravitational dehydration part 6 and the injection of a flocculant forming a part of a sludge post-flocculation process is performed to the secondary flocculation part 4' through piping 25. The secondary flocculation part 4' is equipped with a stirring tank 4a' in which sludge subjected to primary gravitational dehydration is thrown and the mixing of the sludge with injected sodium sulfate is performed under stirring in the stirring tank 4a'. Flocculated sludge again advanced in flocculative reaction is sent to a press dehydration process with a secondary filter cloth belt apparatus 5. By this method, the increase in amount of sludge solid can be suppressed.
Patent JP-S6474723-A (JP)
Title: Formation of flat resist film
Inventor: NISHIO MIKIO
IPC: G03F7/30
Filed: 1987-09-17
Abstract: PURPOSE:To improve flatness for making uniform film thickness, by forming the first resist thin film on a substrate having an uneven pattern on one surface followed by removing the first resist thin film by etching back by a desired amount for forming the second resist thin film thereon. CONSTITUTION:A resist pattern 12 (for instance, film thickness of 1mum) is formed in the broad recessed part (for instance, a recessed part to become more than two mum wide) on a substrate 11, wherein an uneven pattern (for instance, to the depth of 1mum) in formed, by using mask exposure or the like in order to make the groove width of all recessed parts under the prescribed width (for instance, 1mum). Next, a resist film 13 (for instance, film width about 1mum) as the first resist thin film is formed. Then, all of the resist film on the raised part is removed by etching back. Further, a resist film 14 (for instance, film width about 1mum) as the second resist thin film is formed. Thereby, a recessed quanty of the resist film 14 on the groove part is also remarkably reduced (under 1mum) while hardly causing a change of film width due to the groove part density.
Patent JP-H1077960-A (JP)
Title: Pump and liquid discharge method utilizing the pump
Inventor: OGAWA KENJI
IPC: F04B7/02
Filed: 1996-09-03
Abstract: PROBLEM TO BE SOLVED: To provide a pump with a simple structure and by which a liquid can be jetted by a high speed and high pressure accurately and a liquid discharge method utilizing the pump. SOLUTION: A discharge port opening/closing valve 10 for opening/closing a discharge port 7A is arranged inside the vessel 5 having the discharge port 7A and a member 9 for discharging a liquid is arranged concentrically outside the discharge port opening/closing valve 10 and these discharge port opening/ closing valve 10 and the member 9 for discharging are driven by a drive mechanism 13, 14 respectively and a liquid supply part 7B communicated with the discharge port 7A can be opened/closed by this member 9 for discharging and also the liquid in the liquid supply part 7B is pressurized and discharged.
Patent JP-H0281579-A (JP)
Title: Automatic focus regulating device
Inventor: HIRASAWA KATAHIDE
IPC: H04N5/232
Filed: 1988-09-18
Abstract: PURPOSE:To prevent the generation of a malfunction such as step out due to the excessive driving power of an actuator by applying restriction to the driving speed of the actuator, and altering a focus modulating cycle, namely an oscillating cycle, when the actuator amounts to the speed of a driving power limit. CONSTITUTION:A locus 302 is that of a lens at the time of monotonously moving along a central locus 301 of the oscillation of an F lens by means of a pulse motor, and a pattern 304 is the oscillating pattern at the time of adding only a modulating signal amplitude to the lens for focus modulation by the pulse motor. A patern 401 is the driving pattern obtained by synthesizing the locus 302 and the oscillating pattern 304 by taking into consideration the maximum allowable driving speed of the pulse motor. To take into consideration the maximum allowable driving speed of the pulse motor and not to change the amplitude of the modulating signal, a modulating cycle is altered and largely obtained in the driving pattern 401 after synthesizing. Thus, the step out of the driving speed of the pulse motor can be prevented.
Patent JP-S6387987-A (JP)
Title: Production of acetic acid
Inventor: INOUE KOICHI
IPC: C12P7/54
Filed: 1986-10-02
Abstract: PURPOSE:To obtain acetic acid useful as a food or an industrial raw material using a fermentation technique, by culturing a novel bacterial strain belonging the Clostridium genus in a sugar-containing nutrient medium under anaerobic condition. CONSTITUTION:Clostridium sp No.S-1 (FERM P-8852) which is a Gram-negative bacillus belonging to Clostridium genus and having peripheral flagellum is cultured in a nutrient medium containing carbon source, nitrogen source and optionally inorganic salts, vitamins, etc., under anaerobic condition to obtain acetin acid. The culture is carried out in a culture vessel sealed with a rubber stopping in laboratory scale or using a fermentation tank, etc., substituting oxygen gas in the tank with an inert gas such as nitrogen in the case of a relatively large scale production.
Patent JP-H0965486-A (JP)
Title: Lead terminal connection structure for electroacoustic transducer
Inventor: SONE TAKAHIRO
IPC: H04R13/00
Filed: 1995-08-18
Abstract: PROBLEM TO BE SOLVED: To provide a lead terminal connection structure for electroacoustic transducer in which the position deviation of lead terminals is prevented, an excellent connection state is obtained in the case of installation thereby improving the reliability. SOLUTION: A couple of lead terminals placed on a board face of a device on which the electroacoustic transducer is mounted and having solder face are integrated to form the lead terminal member, which is fitted to the board of the electroacoustic transducer via a bridge piece. Furthermore, the bridge piece is cut off to make a couple of lead terminals independent.