baber/WOPTO huggingface dataset:
Patent JP-S53123444-A (JP)
Title: Adhesive tape or sheet
Inventor: YOSHIDA SHIROU
IPC: C09J7/02
Filed: 1977-04-02
Abstract: PURPOSE: A layer of a specific vinyl addition polymer and an adhesive layer are provided on the surface of polyvinyl fluoride layer to produce said adhesive tape or sheet with high weathering resistance for long period. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-H11203013-A (JP)
Title: Bookmark news window
Inventor: TAKASE ISAMU
IPC: G06F3/048
Filed: 1998-01-13
Abstract: PROBLEM TO BE SOLVED: To improve utilization in comparison with the conventional window of a single bookmark function or single news display function by integrating the bookmark function and the news display function into one window. SOLUTION: One window is composed of a part for registering and displaying a bookmark and a part for displaying news. Any arbitrary bookmark can be registered and displayed at the bookmark part. By clicking the relevant part of the registered bookmark, a home page or information linked with it can be displayed and watched on the window. Besides, the new part can display the news to be periodically or nonregularly updated. By clicking or scrolling the relevant part of the displayed news, the further detailed contents of the news or the other news can be displayed and read on the window.
Patent JP-H06245656-A (JP)
Title: Mulch film laying system
Inventor: SUMITA YOSHIO
IPC: A01G13/00
Filed: 1993-02-26
Abstract: PURPOSE:To provide a mulch film laying system so designed that peg cases for holding and delivering pegs to be hammered on a mulch film by a relevant device to fix it on the soil surface are made compact, thereby facilitating peg delivery and hammering. CONSTITUTION:Pegs 2 to be hammered, through a mulch film 1, on the soil surface are arranged in a peg case 5 communicating from a vertical case 3 to a longitudinal case 4 so as to be holdable, and the delivery port 6 at the end of the longitudinal case 4 is faced from the front side on a peg hammering device 7.
Patent JP-H09226245-A (JP)
Title: Image forming apparatus
Inventor: IWAO NAOTO
IPC: B41J2/325
Filed: 1996-02-26
Abstract: PROBLEM TO BE SOLVED: To make it possible to use up ink without waste by providing a heating melting means having means for absorbing and holding heated and melted ink, and a means for selectively heating the ink holding means to melt the heated partial ink and to transfer to form an ink image on a recording medium. SOLUTION: Ink 10 is heated by the operation of a heater 20, the heated part of the ink 10 is melted, and once dispersively held in an ink holder 30. Then, a thermal head 50 is heated in response to an image signal, the ink dispersively held in the holder 30 is heated to be melted by the thermal energy, transferred to a recording medium 40 such as a sheet, and an ink image responsive to the signal is formed on the medium 40. The melted ink from the ink 10 is supplied to the holder 30, and thermally melted ink is always dispersively held in the holder 30 conveyed to an image forming position near the head 50. The ink 10 is uniformly melted at the periphery and can be all used up.
Patent JP-H10310768-A (JP)
Title: Ultraviolet-shielding ultra-water repellent, modified formed cement material coated with the repellent and modified woven or knit fabric post-processed with the repellent
Inventor: SAITO KENJI
IPC: C04B41/64
Filed: 1998-02-20
Abstract: PROBLEM TO BE SOLVED: To obtain the subject ultra-water repellent capable of imparting excellent weatherability, etc., by stirring and mixing a silicone compound, a coupling agent, etc., in an organic solvent in a manner controlled to get a prescribed physical property. SOLUTION: This ultra-water repellent is produced by stirring and mixing (A) a silicone compound, (B) a coupling agent, (C) a modifier, (D) an ultraviolet shielding agent and optionally (E) a catalyst in an organic solvent. The film produced by coating a glass plate with the ultra-water repellent has an extremely high water-repellency characterized by the contact angle of >=125 deg. and shields >=85% of ultraviolet rays having wavelength of 280-400 nm. The preferable ratios of the components (in terms of solid) are 3-50 pts.wt. for the component B, 2-80 pts.wt. for the component C, 1-40 pts.wt. for the component D and 2.5-35 pts.wt. of the component E as an optional, component based on 100 pts.wt. of the component A.  The ultra-water repellent is applied to the surface of a formed cement to give a modified formed cement or applied to a woven or knit fabric by post-processing to give a modified woven or knit fabric.
Patent JP-H02218202-A (JP)
Title: Window glass antenna for vehicle
Inventor: SHINNAI MASAO
IPC: B60R11/02
Filed: 1989-02-20
Abstract: PURPOSE:To improve a reception gain in a frequency band over a wide range by arranging more than three horizontal wires, of which a length is in a specified range, in vertical direction at prescribed intervals at least in the lower side part area of an window glass. CONSTITUTION:In the lower side part area of the window glass, more than three horizontal wires 4, of which the length is 80-150mm, are arranged in the vertical direction at the prescribed intervals at least. Thus, the high gain can be obtained to the low band and high band of a VHF band and to all the bands of a UHF band. In the inside of plate glass 1 in a vehicle, an antenna 3 suitable for receiving AM and FM radio broadcasting waves is formed together with a clouding-proof heating wire 2 in the upper margin part of the heating wire 2 and an antenna 4 for TV is formed by screen-printing and burning conducting paste, for example, in the lower margin part of the heating wire respectively. For the antenna for TV in a figure, the four horizontal wires 4 are arranged and the both ends of those wires are connected by vertical wires. Then, the antenna is formed together with a feeding point 5.
Patent JP-S59165336-A (JP)
Title: Helix type delayed wave circuit
Inventor: HORIGOME TOSHINORI
IPC: H01P9/02
Filed: 1983-03-09
Abstract: PURPOSE:To obtain a thermally strong helix type delayed wave circuit by tightly providing a pipe made of a material with low coefficien of thermal expansion such as molybdenum etc., outside a cylindrical waveguide tube made of copper. CONSTITUTION:A cylindrical pipe 6 made of a material with low coefficient of thermal expansion, such as molybdenum is provided outside a cylindrical waveguide tube 1 under exceedingly good engagement conditions. When a helix 2 reaches a high temperature and is expanded, the heat is transferred to the cylindrical waveguide tube 1 through a dielectric rod 3 and is going to expand the cylindrical waveguide tube 1. However, since the cylindrical pipe 6 with low coefficient of thermal expansion is provided outside, expansion is suppressed. In other words, since outward force is actuated from the inside by expansion and the expansion is suppressed by the outer pipe 6 with lower coefficient of expansion, the contact between the helix 2 and dielectric rod 3 and between the dielectric rod 3 and cylindrical tube 1 is improved and the heat diffusion from the helix 2 is improved.
Patent JP-H09255353-A (JP)
Title: Lead-free crown flint glass
Inventor: MARUKU KUREMENTO
IPC: C03C3/093
Filed: 1997-02-07
Abstract: PROBLEM TO BE SOLVED: To obtain a lead-free crown flint glass showing excellent solubility and workability, capable of economical production and having a specific refractive index and abbe number by using a specific glass composition.  
     SOLUTION: The lead-free crown flint glass has a following composition of the oxide base. That is by weight ratio, >70-81% SiO 2 , 0-5% Al 2 O 3 , 0-15% K 2 O, 0-15% Cs 2 O, 2-8% TiO 2 , 0-6% ZrO 2 , 0-<5% B 2 O 3 , 6-15% Na 2 O, 0-3% Li 2 O, 0-8% Nb 2 O 5 , 0-<5% ZnO, 8-30% Li 2 O+Na 2 O+K 2 O+Cs 2 O and 2-10% TiO 2 + ZrO 2 +Nb 2 O 5 . The glass contains, if necessary, the ordinary quantity of a clarifying agent and has the refractive index n d  of 1.50-1.55 and the abbe number ν d  of 50-55. Further the glass contains no arsenic oxide and fluoride except the inevitable impurities. 
     COPYRIGHT: (C)1997,JPO
Patent JP-H11238985-A (JP)
Title: Cooling structure for printed circuit board mounting component
Inventor: FUJITATE YUKITAKA
IPC: H05K7/20
Filed: 1998-02-20
Abstract: PROBLEM TO BE SOLVED: To provide the cooling structure for printed circuit board mounting components for easily eliminating the fluctuations of the height dimensions mounting components, being mounted on the printed circuit board and a soldering part, and at same time for reducing a load for pressing a heat sink when cooling plurality of electrical heating elements by transferring heat to the single heat sink via a cooling sheat. SOLUTION: In the cooling structure for printed circuit board mounting components for pressing a single heat sink 1 to a plurality of electrical hating elements 6 which are mounted on a printed circuit board 5 via a cooling sheet 4 and for cooling the electrical heating elements 6, a contact piece 2 with an arbitrary oblique angle is provided on a surface where the heat sink 1 is brought into contact with the cooling sheet 4, thus making the contact surface inclined between the heat sink 1 and the cooling sheet 4, and hence easily eliminating the fluctuations of the height dimensions of mouthing components mounted on a printed circuit board 5 and a soldering part. Furthermore, by having the heat sink 1 bite into the cooling sheet 4, the deviation of the heat sink 1 is prevented, thereby improving the assembly property of the cooling structure.
Patent JP-S62197242-A (JP)
Title: Casting mold block and production of casting using such mold block
Inventor: SAITO SHIGERU
IPC: B22C9/20
Filed: 1986-02-24
Abstract: PURPOSE:To safely and efficiently produce many products by closing all molten metal discharge ports with plugs made of refractories then supplying a prescribed amt. of the molten metal to a pouring basin then removing the plugs and introducing the molten metal into the cavities of a casting mold. CONSTITUTION:The molten metal discharge ports 4, 4' are closed with the plugs 6, 6' consisting of a refractory material. After the prescribed amt. of the molten metal 7 is put into the pouring basin 5, either one of the two plugs 6, 6' is removed and the molten metal 7 is introduced through a runner into the cavities 1. The introducing passages to the cavities 1 are selected from the size, shape, material quality, etc., of the products. The breakdown of the casting mold is prevented and the production is safely and efficiently executed by the above-mentioned method.
Patent JP-S57152369-A (JP)
Title: Method and device for small electric current plasma arc welding
Inventor: KIKUCHI HITOSHI
IPC: B23K10/00
Filed: 1981-03-17
Abstract: PURPOSE:To hold the small electric current plasma arc stably and to facilitate the automation of sheet welding by generating a plasma jet with a prescribed flow rate of a working gas thence inducing the plasma arc with an instantaneously large flow rate and returning the same to the prescribed flow rate. CONSTITUTION:A three-way valve 12 is operated to communicate a pipeline 11 with a pipeline 13 in which a prescribed flow rate of a working gas flows, whereby the prescribed flow rate of the working gas is supplied into a chamber 4 in a nozzle tip 2. Thence, potential is applied between an electrode 1 and the tip 2 by an auxiliary electric power source e, whereby a plasma jet 8 is generated, but no plasma arc 7 is generated because the flow rate of the working gas is small. Next, the valve 12 is operated to communicate the pipeline 11 with a pipeline 14 to supply the gas at the flow rate larger than the steady flow rate, at which this gas is ejected through a nozzle port 5 to arrive at base metals 6, whereby electric current is induced between the base metals 6 and the electrode 1 in the tip 2 and the arm 7 is generated. Immediately the flow rate of the working gas is changed over to the prescribed flow rate by the valve 12, but once the plasma arc 7 is generated, the arc 7 is maintained stably even at the small flow rate.
Patent JP-H11238828-A (JP)
Title: Semiconductor device of bga type package and its manufacture and packaging equipment
Inventor: HOSOMI HIDEKAZU
IPC: H01L21/60
Filed: 1998-02-20
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device of a thin BGA type package in which the pressing amount of a cover plate is little, in a flip chip connection system connecting an active element surface of a chip toward a base substrate, and its manufacturing method and packaging equipment. SOLUTION: A flip chip pad 8 and a ball pad 9 are formed on one surface of a base substrate 3. Solder balls 4 are formed on the ball pad 9. A chip 5 is mounted on the flip chip pad 8, via bumps 6. The solder balls 4 are protruded from the chip 5, on the solder ball 4 side. The other surface of the base substrate 3 is covered with a cover plate 1. Thereby the height of a package can be reduced, and flatness of the cover plate 1 can be ensured by excluding the pressing of the cover plate 1 or reducing it.
Patent JP-H01214015-A (JP)
Title: Method and apparatus for vapor growth
Inventor: KOMURA YUKIO
IPC: H01L21/205
Filed: 1988-02-22
Abstract: PURPOSE:To execute a crystal growth operation without being affected adversely by an impurity to be produced during a baking operation by a method wherein the baking operation of a substrate is executed prior to the crystal growth operation inside a chamber other than a main reactor after the baking operation the substrate is shifted into the main reactor without being exposed to the air and the crystal growth operation is executed. CONSTITUTION:In a vapor growth method used to execute a crystal growth operation inside a main reactor 1 while a substrate is placed on a susceptor 6, the substrate is baked inside a chamber other than the main reactor before the crystal growth operation is executed; after the substrate has been baked, the substrate is shifted into the main reactor 1 without being exposed to the air, and the crystal growth operation is executed. For example, an apparatus is constituted as follows: a sub- reactor 19 and an auxiliary prechamber 24 are installed separately from a main reactor 1 and a main prechamber 4; the auxiliary prechamber 24 and the main prechamber 4 are interconnected by a prechamber mutual interconnection port 31; the prechamber mutual interconnection port 31 is opened and shut by using a prechamber gate valve 32. By using the apparatus of this structure, the substrate and a susceptor 6 supporting it are baked inside the subreactor 19 which is independent of the main reactor 1.
Patent JP-H06251334-A (JP)
Title: Manufacture of floating thin film magnetic head
Inventor: TAKEUCHI SHIGEKI
IPC: C23F1/28
Filed: 1993-03-01
Abstract: PURPOSE:To make possible etching while ensuring pattern accuracy by employing spray chemical etching in the removal of underlying electrode film during the plating process. CONSTITUTION:A substrate 1 formed with a first conductor layer 71 is set on the substrate holder 9 of a spin coater 10. The conductor layer 71 is formed of an electrolytic plating film of copper and the underlying electrode film 75 is formed by sputtering the copper. When the substrate 1 is set, the substrate holder 9 rotates and etching liquid 2 is pressure sprayed from above by pressurized gas 6 through a nozzle 3. Upon finish of etching for a predetermined time, the nozzle 3 retracts and pure rinse water 5 is pressure sprayed through a nozzle 8. When the etching liquid 2 is pressure sprayed from above the substrate, etching rate in the advancing direction the liquid is increased significantly as compared with that in the normal direction. Consequently, etching time required for removing the underlying electrode film can be shortened.
Patent JP-2000244146-A (JP)
Title: Computer system and display
Inventor: OBA HARUO
IPC: G09F9/00
Filed: 1999-02-17
Abstract: PROBLEM TO BE SOLVED: To improve user-friendliness by selecting a cable drawing means among a plurality of them and drawing out an inside cable in the direction suitable for the outside situation through the selected cable drawing means. SOLUTION: With one end conductively connected to each circuit inside a panel section 22, a display cable 12 is led in into the inside of a stand 20 from the inside of the panel section 22 through the inside of an arm 21. At the center in a lower edge of a side wall 20B in the back of the stand 20 defined by an arrow (d), a first drawing section 30 is formed. Meanwhile, third drawing sections 32 are formed in a lower edge toward the back of a right-side side wall 20C and of a left-side side wall 20D of the stand 30 respectively. The cable 12 is drawn outside over the deck through the third drawing sections 32 so as to crawl on the desk.
Patent JP-S61198569-A (JP)
Title: Manufacture of solid electrolyte fuel cell
Inventor: NISHI TOSHIRO
IPC: H01M8/12
Filed: 1985-02-28
Abstract: PURPOSE:To obtain a solid electrolyte fuel cell at low cost without use of large scale equipment by mixing and crushing oxide powder of starting raw material, and bonding the oxide powder to a fuel cell substrate with a thermal spray process. CONSTITUTION:Cerium oxide or zirconium oxide powder and two or three valent metal oxide powder of alkali earth metals or rare earth elements are separately heated, then mixed. The mixture is crushed and particle size is adjusted to produce solid electrolyte raw material for thermal spray. After a fuel electrode 2 is formed on the surface of a substrate 1, electrolyte raw material having a particle size of 5mum is thermal-sprayed to form an electrolyte thin film 3 then an oxygen electrode 4 is formed thereon the produce a fuel cell. Thereby, a high performance solid electrolyte fuel cell is manufactured at low cost without use of large scale equipment.
Patent JP-H05235203-A (JP)
Title: Semiconductor device
Inventor: BABA TERUYOSHI
IPC: H01L23/14
Filed: 1992-02-26
Abstract: PURPOSE:To obtain a semiconductor device having an electromagnetic shielding layer which can be formed and mounted easily by forming the electromagnetic shielding layer formed of conductive resin on the surface of the semiconductor device for grounding the semiconductor device electrically. CONSTITUTION:Conductive resin paste 6 is applied in the uniform thickness to the whole surface of a semiconductor device 1 and is thermoset to form an electromagnetic shielding layer. In order to connect a grounding section 7 and the electromagnetic shielding layer electrically, the conductive resin 6 is applied to cover the grounding section 7. However, since a conductive pattern 21 is led out from the semiconductor device 1, at least a part of the surface of the conductive pattern 21 with which the conductive resin 6 is to be brought into contact must be protected by insulator. In the conductive resin 6, the material which has a high permeability and a high conductivity, such as silver- containing epoxy resin which is used for bonding a semiconductor chip, is used. Therefore, the electromagnetic shielding layer formed of the conductive resin 6 hardly transmits electromagnetic waves and thereby the semiconductor device 1 can be protected from electromagnetic waves.
Patent JP-S61203135-A (JP)
Title: Manufacture of organopolysilazane and organopoly(disilyl)silazane having improved thermal behaviorand use for ceramic precursor particularly
Inventor: JIYAN JIYATSUKU RUBURAN
IPC: C08G77/62
Filed: 1986-02-26
Abstract: The present invention relates to a process for the treatment of polysilazane in a homogeneous phase with a catalytically effective quantity of an acid catalyst selected from HClO4 and CF3SO3H. The polysilazane is preferably selected from the group consisting of organopolysilazane, organopoly(disilyl)silazane and mixtures thereof. The organic radicals bonded to the silicon atoms are preferably saturated or aromatic hydrocarbon radicals and the silicon atoms of the polysilazane are substantially free from any hydrogen atom bonded directly to the silicon atoms. The polysilazanes treated in this manner have good thermal behavior and, are particularly useful as precursors of ceramic products.
Patent JP-H11237818-A (JP)
Title: Image forming device
Inventor: SAKO KIYOSHI
IPC: G03G21/10
Filed: 1998-02-20
Abstract: PROBLEM TO BE SOLVED: To provide an image forming device capable of easily separating a sealing member from a housing and surely preventing toner from being leaped to the outside of the housing. SOLUTION: The sealing member 100 is connected to the housing 62 by fitting a dovetail 114 formed at an end part into a dovetail groove 118 formed at the housing 62, and displacement to the housing 62 is prevented by entering a vertical wall 92 and a lateral wall 94 to a vertical groove 102 and a lateral groove 104 formed on the backside of the sealing member 100. Also, a cleaning lade 70 is fixed to the hosing 62, and the sealing member 100 is held between the cleaning blade 70 and the housing 62, so that the sealing member 100 is more firmly held. Thus, the sealing member 100 is fixed to the housing 62 without using an adhesive or the like, so that it is easily separated from the housing 62. Also, the displacement of the sealing member 100 is prevented, so that the leakage of the toner is surely prevented.
Patent JP-H10235467-A (JP)
Title: Remover for organic self-hardened molding sand
Inventor: YAMAMOTO TETSUYA
IPC: B22D29/00
Filed: 1997-02-24
Abstract: PROBLEM TO BE SOLVED: To scarcely develop troubles on the working circumference and on the treatment without developing offensive order at the time of collapsing binder by containing a specific quantity of easily-water-soluble and basic amino group compound to water-soluble molding sand remover used at the time of removing the molding sand stuck to a kneader, molding machine, etc. SOLUTION: The used amino group compound is selected to one or more among group of methoxy propylamine, ethyoxy propylamine, dimethyl formamide, iminobis propylamine, dimethyl acrylamide, methylpyrolidone, pyrolidine, bengylamine, cyclohorylamine and tetramethyl diamino propane. This content is 0.1-80wt.% standard at the time of using the remover and further, it is desirable to add interface activator of alkyl betain, etc., and a thickner of liquid polyethylene glycol, etc.
Patent JP-H04255999-A (JP)
Title: Semiconductor storage device
Inventor: TANAKA SHINJI
IPC: G11C29/00
Filed: 1991-02-07
Abstract: PURPOSE:To enable to replace a bad selection line with a spare selection line by confirming whether there exists a failure or not on the spare selection line prior to externally execute a program. CONSTITUTION:A decoding circuit 5 makes a decoder 3a or 3b operative by a selection signal Xs of a spare selection line and address signals X0 and X1 and selects one line from a spare selection lines L5 or L6. After that, a memory test is performed for the spare selection lines L5 and L6.