Patent SG-11201908310X-A (SG)
Title: Cartridge with laminated manifold
Inventor: SEGALE DARREN
IPC: B01L3/00
Filed: 2019-01-31
Abstract: 109 110 108 FIG. 1 N N kin O (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 08 August 2019 (08.08.2019) WIPO I PCT 1111111111111101111111111111111011111010111111111111101111111111111111111111011110111111 (10) International Publication Number WO 2019/152677 Al (51) International Patent Classification: BOIL 3/00 (2006.01) (21) International Application Number: PCT/US2019/016097 (22) International Filing Date: 31 January 2019 (31.01.2019) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/626,022 03 February 2018 (03.02.2018) US 2020616 19 March 2018(19.03.2018) NL (71) Applicant: ILLUMINA, INC. [US/US]; 5200 Illumina Way, San Diego, CA 92122 (US). (72) Inventors: SEGALE, Darren; c/o Illumina Inc., 5200 Il- lumina Way, San Diego, CA 92122 (US). TRAN, Hai; c/ o Illumina Inc., 5200 Illumina Way, San Diego, CA 92122 (US). CRIVELLI, Paul; c/o Illumina Inc., 5200 Illumina Way, San Diego, CA 92122 (US). (74) Agent: MIKRUT, Jeffrey, J. et al.; Illumina, Inc., 5200 Illumina Way, San Diego, CA 92122 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: CARTRIDGE WITH LAMINATED MANIFOLD (57) : A circuit with electrical interconnect for external electronic connection and sensor (s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor (s). The laminated manifold includes fluidic channel (s), an interface between the die and the fluidic channel (s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel (s), attaching sensor (s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel (s). [Continued on next page] W() 2019/152677 Al I 11111 0111E0 11101 111 11111M0101110111110HREHHIMEMMOHE (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(ii)) Published: — with international search report (Art. 21(3))