baber/WOPTO huggingface dataset:
Patent TW-200424505-A (TW)
Title: Knock sensor mounting structure for internal combustion engine
Inventor: KIKUCHI KAZUNORI
IPC: F02D45/00
Filed: 2004-03-19
Abstract: To improve detection accuracy in a knock sensor by selecting the sensor mounting position of the cylinder in an internal combustion engine. In a compressor, a boss part CB6 is provided in a side face CB5 of a cylinder, and the knock sensor Ks is mounted on the boss part CB6. The boss part CB6 is placed relatively close to the crankcase C of the cylinder. Furthermore, it is kept off an air intake/exhaust side, and positioned in a side part of the cylinder opposite to the mounting side of a timing chain Tc or a water pump Wp. Thus, the sensor Ks can be mounted at a position apart from the drive source of the chain Tc with positive distances or auxiliaries without any thermal influence such as exhaust gas.
Patent TW-200419457-A (TW)
Title: BCA code extraction method and related device
Inventor: YEN CHUNG-TIEN
IPC: G11B27/24
Filed: 2004-03-23
Abstract: A method for extracting information in a data signal stored on an optical disc. The method includes initializing a recovery period of a recovery clock to a predetermined value expressed in cycles of a first clock; sampling the data signal with the first clock; obtaining a leading edge time period expressed in cycles of the first clock of a pattern of bits from the sampled data in which at least a first bit has a first binary value, followed by a plurality of bits having a second binary value, and ending with a last bit having the first binary value, wherein the first and second binary values are not equal; updating the recovery period of the recovery clock to be equal to a new maximum period that is the leading edge time period divided by a division factor; extracting the information in the data signal based on the newest recovery period of the recovery clock; and detecting a predetermined code in the data signal.
Patent TW-200518986-A (TW)
Title: Bicycle control cable fixing device
Inventor: SHAHANA SATOSHI
IPC: B62M9/1246
Filed: 2004-03-24
Abstract: A control cable fixing device is coupled to a bicycle component such as a rear derailleur in order to secure an inner wire of a control cable to the bicycle component. The control cable fixing device includes a support member with a first engagement surface and a cable fixing member with a second engagement surface. The cable fixing member is rotatable relative to the support member. The cable fixing member and the support member secure the inner wire between the engagement surfaces in response to rotational movement of the cable fixing member to a cable fixing position. The cable fixing member preferably includes a cam portion and a lever portion that is manually operable to rotate the cable fixing member.
Patent TW-200422136-A (TW)
Title: Main shaft device and machine tool with the same
Inventor: SUGITA SUMIO
IPC: F16C25/08
Filed: 2004-03-31
Abstract: The object of the present invention is to provide a main shaft device whose mounting and dismounting in maintenance is facilitated and low cost. In the present invention, the diameter is reduced in the sequence of the inner diameter of an outer tube (3), the inner diameter of a stator (4), and the outer diameter of a bearing sleeve (11). A semi-assembled body (2) constituted of a front housing (8), a rotating shaft (6), and the bearing sleeve (11) is demountable from the outer tube (3). The diameter of a rotating body measured at any cross-section in the region rearward of the bearing sleeve (11) is made smaller than the minimum diameter of a non-rotating body measured between the rear end of the bearing sleeve (11) and the cross-section.
Patent TW-200535672-A (TW)
Title: A method for switching input and an electronic device therefor
Inventor: LAN SEN-HAO
IPC: G06F3/00
Filed: 2004-04-29
Abstract: A method for switching input. The inventive method switches input modes and input manners in an electronic device. The method switches the input modes if a first button is pushed. The method switches the input manners in a certain input mode if a second button is pushed.
Patent TW-200510359-A (TW)
Title: Oxetane compounds containing styrenic functionality
Inventor: MUSA OSAMA M
IPC: C07D305/06
Filed: 2004-05-05
Abstract: These compounds contain an oxetane functionality and a styrenic functionality. The oxetane functionality is homopolymerizable in reactions that undergo cationic or anionic ring opening, and the styrenic is polymerizable with compounds such as electron acceptor compounds. The dual functionality allows for dual cure processing. The compounds will have the structure, , in which R1 is a methyl or ethyl group; R2 and R3 are H or a methyl or ethyl group; R4 is a direct bond or a divalent hydrocarbon; X and Y are independently a direct bond or an ether, ester, amide, or carbamate group, provided both X and Y are not a direct bond; Q is a divalent hydrocarbon (which may contain heteroatoms of N, O, or S); and G is -OR1, -SR1, or -N(R2)(R3), in which R1, R2 and R3 are as described above.
Patent TW-200538494-A (TW)
Title: Process for producing polybutylene terephthalate film
Inventor: KAGAWA SEIJI
IPC: C08J5/18
Filed: 2004-05-20
Abstract: The invention provides process for producing polybutylene terephthalate (PBT) film, and is characterized in that the said PBT resin is melt extruded from T-die to form a film, and the said film produced is annealed at substantially undrawn state to allow the said PBT resin crystallized, and then is drawn to produce crystallized PBT film.
Patent TW-200426245-A (TW)
Title: Method of mass production of silicon nanowire with low cost
Inventor: HUANG BOHR-RAN
Filed: 2004-05-24
Abstract: This invention provides a method of mass production of silicon nanowire with low cost, which comprises performing catalysis treatment on a silicon substrate with a sensitization solution and an activation solution to make reactive metal atoms adsorbed onto the silicon substrate surface; soaking the treated silicon substrate into an electroless acidic plating solution to perform electroless deposition to deposit a metal layer containing catalytic metal micro particles on the silicon substrate; placing the silicon substrate into a high temperature furnace to form liquid silicide alloy by melting the catalytic metal micro particles and the silicon atoms on the silicon substrate surface at the metal/silicon substrate interface; and using a solid-liquid-solid (SLS) chemical synthesis process through temperature gradient variation to promote recombination of silicon-silicon bonds by catalysis effect to stack into silicon nanowires.
Patent TW-200509747-A (TW)
Title: Laminated structure, its manufacturing method, display device, and display unit
Inventor: YOKOYAMA SEIICHI
IPC: H01L51/50
Filed: 2004-05-26
Abstract: The invention provides a laminated structure which can reduce defect by preventing deposition failure or holes of an insulating film, its manufacturing method, and a display unit. The laminated structure as an anode for organic light-emitting devices is provided on a flat surface of a substrate. In the laminated structure, an adhesive layer made of ITO, a reflective layer made of silver or an alloy containing silver, and a barrier layer made of ITO are layered in this order from the substrate side. A cross sectional shape of the laminated structure in the laminated direction is a forward tapered shape. A sidewall face of the adhesive layer, the reflective layer, and the barrier layer is totally covered by an insulating film, and deposition failure or holes of the insulating film is prevented. A taper angle made by the sidewall face and the flat surface is preferably from 10 DEG to 70 DEG. The laminated structure can be used as a reflective electrode, a reflective film, or a wiring for a liquid crystal display.
Patent TW-200502984-A (TW)
Title: Cmos bandgap current and voltage generator
Inventor: MARINCA STEFAN
IPC: G05F3/30
Filed: 2004-06-28
Abstract: The present invention provides an improved reference source. The reference source has reduced sensitivity to the input offset voltage of the amplifier components in the reference circuit. This is achieved by subtracting two currents at the reference output node such that the combined offset sensitivity is less than the corresponding offset sensitivity for only one current.
Patent TW-200510459-A (TW)
Title: RG1 antibodies and uses thereof
Inventor: HARKINS RICHARD
IPC: C12Q1/68
Filed: 2004-07-20
Abstract: The present invention relates to antibodies, and antigen-binding antibody fragments, directed against an RG1 polypeptide. The invention further relates to methods for utilizing the antibodies, and antibody fragments, for diagnostic and therapeutic applications.
Patent TW-200510779-A (TW)
Title: Anti-glare optical film and process for preparing the same
Inventor: NAMIOKA MAKOTO
IPC: G02B1/11
Filed: 2004-07-30
Abstract: An object of the present invention is to provide an anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film having irregularities on the surface, wherein a ratio of areas of the surface having an inclination angle of 1 DEG or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5 DEG or more is 20% or less, and a standard deviation of a height of the surface is 0.2 μm or less. There is also provided a process for preparing an anti-glare optical film, comprising the steps of contacting a glass with an aqueous solution containing hydrogen fluoride to obtain a template which comprises the glass having the surface on which a fine irregular shape is formed so that approximately spherical concave shapes are arranged to be substantially compact, and transferring the irregular shape of the surface of the template onto the surface of a resin film.
Patent TW-200607337-A (TW)
Title: Image wipe method and device
Inventor: HSIUNG JACKIE
Filed: 2004-08-04
Abstract: An image wipe method includes the steps of defining at least a first reference point to divide a screen area into several sub-areas according to the first reference points, selecting at least one sub-area, and performing a first image process on the selected sub-area. In addition, an image wipe device for executing the method is provided.
Patent TW-200511831-A (TW)
Title: Device and method for compressing digital images
Inventor: THOREAU DOMINIQUE
IPC: H04N1/41
Filed: 2004-08-06
Abstract: The present invention relates to a device (210) for compressing a source image by means of a base layer, coding a base image, and of an enhancement layer, coding a residual existing between the source image and the base image, the source image and the base image being structured as blocks of pixels. According to the invention, such a device is characterized in that it comprises means (250) for generating the enhancement layer of a block as a function of the quality of restitution of this block, determined by comparing the coding of this block in the source image with the coding of this block in the base image, and/or as a function of information coded by this block of pixels.
Patent TW-200607366-A (TW)
Title: Method and system for selecting an access network in a heterogeneous network environment
Inventor: CHOU LI-DER
IPC: H04W84/08
Filed: 2004-08-06
Abstract: The present invention provides a method and system for selecting an access network in a heterogeneous network environment, in which user's configuration information is recorded in a mobile device. The mobile device collects and records current status information of each access network. The mobile device then determines a network stability coefficient for each access network based on the user's configuration information and current network status information. Finally, the mobile device selects an access network with a maximum network stability coefficient and establishes a connection with this access network.
Patent TW-200507042-A (TW)
Title: Process for fabricating electronic components using liquid injection molding
Inventor: CHENG TAMMY
IPC: H01L23/31
Filed: 2004-08-06
Abstract: A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: (i) placing the semiconductor device in an open mold, (ii) closing the mold to form a mold cavity, (iii) heating the mold cavity, (iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, (v) opening the mold and removing the product of step (iv), and optionally (vi) post-curing the product of step (v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
Patent TW-200530648-A (TW)
Title: Device for gripping optical fibers
Inventor: CARPENTER JAMES BRADLEY
IPC: G02B6/38
Filed: 2004-08-12
Abstract: An optical fiber gripping device comprises first and second members hingedly attached at a first end of each of the members. A gripping region is also provided and includes first and second gripping portions disposed on first and second inner portions of each of the members. The gripping portions can be adapted to apply a substantially even distribution of force to an outer perimeter of an optical fiber disposed therein. The sheet of material can further include at least one slot to define separate clamping zones along a length of the gripping region. The gripping device provides a mechanical splicing tool for splicing, gripping, and/or connecting optical fibers, including protective coated fibers and conventional fibers.
Patent TW-200608516-A (TW)
Title: Substrate structure underlying a pad and pad structure
Inventor: CHEN SHENG-YOW
IPC: H01L29/40
Filed: 2004-08-26
Abstract: A substrate structure under a pad and a pad structure including the substrate. The substrate structure includes a substrate of a first semiconductor type having a pad area and a noise prevention structure at least around the pad area. The pad structure includes the substrate structure, a pad, and a dielectric layer there between.
Patent TW-200518675-A (TW)
Title: Agricultural/horticultural insecticide and method for using the same
Inventor: YOSHIDA KEI
IPC: A01P7/04
Filed: 2004-08-26
Abstract: An object of the present invention is to provide insecticides having high effectiveness. The present invention provides compounds represented by formula (1): Wherein A1﹑A2﹑A3﹑and A4 independently represent a carbon atom, a nitrogen atom, or an oxidized nitrogen atom; R1 represents a C1-C6 alkyl group which may be substituted, a phenyl group which may be substituted, or a heterocyclic group which may be substituted; R2 and R3 independently represent a hydrogen atom, a C1-C4 alkyl group which which may be substituted, or a C1-C4 alkylcarbanyl group which may be substituted; G1﹑G2 and G3 independently represent an oxygen atom or a sulfur atom; Xs may be the same or ddifferent and each represent a hydrogen atom, a halogen atom, a C1-C4 alkylcarbanyl group which may be substituted, or an amino group which may be substituted; n represents an integer of 0 to 4; Q represents a phenyl group which may be substituted, a naphthyl group which may be substituted, a tetrahydronaphthyl group which may be substituted, or a heterocyclic group which may be substituted, insecticides containing the compounds as active ingredients, and a method for producing the compounds. The compounds represented by formula (1) exhibit an excellent pest control effect as insecticides and also exhibit an excellent pest control effect when veing combined with another insecticide, an acaricide, a nematocide, a fungicide, a herbicide a plant growth regulator, or a biological pesticide.
Patent TW-200512793-A (TW)
Title: Substrate heating apparatus and multi-chamber substrate processing system
Inventor: ISHIHARA MASAHITO
IPC: H01L21/677
Filed: 2004-08-27
Abstract: This application discloses a substrate heating apparatus comprising a partition separating the inside of a load-lock chamber into two areas. An inside opening provided in the partition is closed by a partition valve, while the second area in which a substrate is transferred is evacuated at a vacuum pressure by a pumping line. After the partition valve is opened, a carrier carries the substrate through the inside opening, thereby contacting the substrate onto a heat body disposed in the first area. Otherwise, after the partition valve is opened, a carrier carries a heat body through the inside opening, thereby contacting the substrate onto the heat body in the second area. This application also discloses a substrate processing system comprising a transfer chamber, and a load-lock chamber and a process chamber both provided on the periphery of the transfer chamber.
Patent TW-200524017-A (TW)
Title: A method of manufacturing a semiconductor device
Inventor: YAMAGUCHI YOSHIHIKO
IPC: H01L23/495
Filed: 2004-09-08
Abstract: A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.
Patent TW-200514553-A (TW)
Title: Therapeutic agent for hepatitis C
Inventor: SHIMOTONO KUNITADA
IPC: A61P31/12
Filed: 2004-10-05
Abstract: This invention provides a prophylactic agent and/or therapeutic agent for hepatitis C, which comprises a compound of formula (I) or a salt thereof as an active ingredient.
Patent TW-200611874-A (TW)
Title: Process of producing hydrogen using Au/ZrO2 catalysts
Inventor: CHANG FEG-WEN
IPC: B01J23/48
Filed: 2004-10-08
Abstract: This invention declares the application to produce hydrogen using Au/ZrO2 catalysts. This application improves purity of hydrogen and to reduce CO content. The gold crystallites appear to be spherical in shape. They are distributed homogeneously over the support and exhibited a narrow size (0.5-5nm) distribution over Au/ZrO2 prepared by DP method. HAuCl4 solution was heated to 70 DEG C and adjusted to pH 7 with 0.1M Na2CO3. It was added rapidly with vigorous stirring to 5g of ZrO2 suspended. The final solid was filtered, dried at 100 DEG C and then calcined in air at 300~600 DEG C for 4h. Zirconium oxide supported Au catalysts was tested by the partial methanoi oxidation reaction (POM) at 230~290 DEG C. The reaction results indicate that the optimal preparation method and operating conditions are deposition precipitation method, 2 wt% in Au loading, 300 DEG C in calcination temperature, and 290 DEG C in reaction temperature. During these reactions, carbon monoxide is not detected by GC from the effusion gas.
Patent TW-200533692-A (TW)
Title: Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
Inventor: SAKATA YUKO
IPC: C09D11/10
Filed: 2004-11-02
Abstract: There are provided a novel curable polyester, a cured product thereof, and a process for preparing the same, as well as a resist composition and a jet Printing ink composition comprising the curable polyester, curing methods and uses thereof. The curable polyester of the present invention has a polyester skeleton as a main chain and also has an oxetanyl group at the molecular end. The curable polyester of the present invention is excellent in curability and has excellent flexibility, adhesion and mechanical strength, and also exhibits high safety to the human. The resist composition containing a novel curable polyester having an oxetanyl group at the molecular end of the present invention is suitable for a solder resist for forming a pattern with high accuracy or an interlayer insulation film because neither bleeding after screen printing nor sagging upon heat curing occurs, and the jet printing ink composition containing a novel curable polyester having an oxetanyl group at the molecular end of the present invention is suitable for a solder resist or an interlayer insulation film, which is excellent in line width retention of a thin line pattern because neither bleeding nor sagging upon heat curing occurs.
Patent TW-200523475-A (TW)
Title: Vacuum pump
Inventor: CHATFIELD FRANCIS PHILLIP
IPC: F04B37/14
Filed: 2004-11-12
Abstract: A vacuum pump is provided comprising a pumping mechanism, a drive shaft for driving the pumping mechanism and a gear box connected to the drive shaft for rotating the drive shaft. Pressure control means are provided to define a path to allow fluid to flow from the pumping mechanism to the gear box in order to reduce the pressure difference therebetween. A reservoir is located within this path for collecting oil passing along the drive shaft from the gear box towards the pumping mechanism. In use, this enables pressurised fluid flowing from the pumping mechanism towards the gear box to urge oil which has collected in the reservoir, towards the gear box.
Patent TW-200522825-A (TW)
Title: Method for making a hybrid integrated circuit device
Inventor: KANAKUBO MASARU
IPC: H05K3/28
Filed: 2004-11-25
Abstract: This invention provides a method for making a hybrid integrated circuit device capable of assuring an accurate shape dimension of a circuit board having a surface on which an electric circuit is formed. The method includes the steps of: forming a plurality of units (32) each comprising a conductive pattern (18) on the surface of a metallic board (19B) made of metal, forming grooves (20) at boundaries of each unit (32), electrically connecting a circuit element (14) to the conductive pattern (18) of each unit (32), separating the circuit boards (16) by cutting the metallic board (19B) along each groove (20), and planarizing the side surfaces of each circuit board by pressing the side surfaces.
Patent TW-200528592-A (TW)
Title: Method for manufacturing single crystal semiconductor
Inventor: INAGAKI HIROSHI
IPC: C30B15/30
Filed: 2004-12-14
Abstract: To reduce the nonuniformity of the impurity concentration in the plane of a semiconductor wafer and to improve the flatness of the wafer by allowing impurities to be uniformly taken in the single crystal semiconductor in the process for growing the single crystal semiconductor by pulling it from a melt. In the process of pulling up the single crystal semiconductor (6), the impurity concentration nonuniformity within the single crystal semiconductor (6) is reduced by suppressing the fluctuation of a pulling up velocity. Especially, a velocity fluctuation range ΔV in 10 seconds is adjusted to smaller than 0.025mm/min. Furthermore, at the time of adjusting the pulling up velocity so as to make the diameter of the single crystal semiconductor (6) as desired, a magnetic field having a strength of 1,500 gauss or more is applied to the melt (5).