baber/WOPTO huggingface dataset:
Patent JP-2002370373-A (JP)
Title: Ink-jet recording apparatus
Inventor: NISHIHATA NOZOMI
IPC: B41J2/175
Filed: 2001-06-18
Abstract: PROBLEM TO BE SOLVED: To provide an ink-jet recording apparatus having a carriage configuration capable of detaching an ink tank easily and quickly even with a recording head attached at the time of using a replaceable head cartridge without the need of enlargement of the apparatus or increase of the number of parts. SOLUTION: By providing an elastically replaceable cartridge fixing member 21 in a carriage 20 and rotating a set lever 35 supported by the carriage, a head cartridge 100 is taken into the carriage 20 for positioning and fixation while pushing away the cartridge fixing member.
Patent JP-2003001253-A (JP)
Title: Apparatus for producing water and method therefor
Inventor: HORIE MASATOSHI
IPC: B01D61/02
Filed: 2001-06-19
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing water, that can attain a higher recovery ratio when raw water is subjected to membrane treatment to obtain permeate and to provide an apparatus therefor. SOLUTION: The apparatus has a freezing means to freeze raw water, a thawing means to thaw frozen raw water, a membrane separation means with a reverse osmosis membrane and/or a nanofiltration membrane for treating thawed water and a pump for pressurizing thawed water and supplying it to the reverse osmosis membrane and/or nanofiltration membrane. Raw water is frozen and thawed using the equipment to selectively draw thawed water having a lower concentration of impurities than the raw water and the thawed water is treated the reverse osmosis membrane and/or nanofiltration membrane to obtain treated water having a lower concentration of impurities than the thawed water.
Patent JP-2003003234-A (JP)
Title: Free-cutting steel for plastic molding die having excellent machinability
Inventor: URITA TATSUMI
IPC: C22C38/38
Filed: 2001-06-19
Abstract: PROBLEM TO BE SOLVED: To provide free-cutting steel in which desired machinability can always be obtained in steel for a plastic molding die, particurly, in the one of a prehardened type. SOLUTION: In the steel having an alloy composition containing, by weight, 0.1 to 0.6% C, 0.02 to 1.0% Si, 0.5 to 2.0% Mn, 0.005 to 0.10% S, 0.2 to 2.5% Cr, 0.05 to 0.15% V, 0.001 to 0.020% Al, 0.0005 to 0.02% Ca and 0.0005 to 0.010% O, and in which the content of P is controlled to <=0.03%, B to <=0.002%, and N to <=0.04%, and the balance Fe, the occupancy ratio of sulfide inclusions present in contact with oxide inclusions having a CaO content of 8 to 62% is 2.0×10<-4> m<2> or higher per field area of 3.5 mm<2> .
Patent JP-2003007694-A (JP)
Title: Single-wafer processing type heat treatment apparatus
Inventor: KAKIMOTO AKINAGA
IPC: C23C16/46
Filed: 2001-06-19
Abstract: PROBLEM TO BE SOLVED: To provide a single-wafer processing type heat treatment apparatus, capable of greatly improving uniformity of the heat treatment in a surface of a treated body by carrying out a slight temperature compensation in the peripheral region of the body to be treated. SOLUTION: In this single-wafer processing type heat treatment apparatus, a mount base support table 36 is installed in a treatment vessel 32, which can be evacuated, so that it is supported by the bottom part or the side wall of the treatment vessel and the peripheral part of the mount base is supported by the mount base support table, and a predetermined heat treatment is carried out, while heating the body W to be treated mounted on the mount base by the heat from heating means 76. A circular-ring shaped micro-heat conduction plate 50 is provided so that it extends from the inner peripheral part of the mount base support table to the upper side of the peripheral part of the mount base 44 inwardly, in the radial direction and the inner peripheral end thereof approaches the outer peripheral end of the treated body.  Thus, by carrying out slight temperature compensation in the peripheral region of the treated body, the uniformity of the heat treatment in the surface of the treated body is improved greatly.
Patent JP-2003001076-A (JP)
Title: Apparatus and method of evaporating liquid and mixing with gas
Inventor: KATO HIDEHARU
IPC: B01F23/10
Filed: 2001-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a shell-and-tube heat exchange type apparatus for evaporating a liquid and mixing with a gas, in which a required quantity of a liquid is uniformly distributed to each heat transfer pipe in a wide load range and the maintenance for the clogging or the damage of an orifice hole is dispensed with, and a method thereof. SOLUTION: In the shell-and-tube heat exchange type apparatus for evaporating the liquid and mixing with the gas, a plurality of gas introducing short pipes each inserted to a heat exchanger tube 2 from a liquid supply chamber A side and extending at least to a higher position than the free surface of the liquid flowing in the heat exchanger tube 2 from the liquid supply chamber A and a gas supply means 3 composed of a gas supply distribution member 5 to which a plurality of the gas introducing short pipes 4 are connected are provided.
Patent JP-2003000826-A (JP)
Title: Game machine
Inventor: SUGIJIMA KISHIO
IPC: A63F7/02
Filed: 2001-06-22
Abstract: PROBLEM TO BE SOLVED: To provide a game machine capable of supplying the minimum current necessary to operate a second game-related member in occurrence of power interruption. SOLUTION: The game machine is provided with a power source means 65 for generating a power source necessary for operation by a main power source to be supplied from outside, a power interruption detecting means 67 for outputting a power interruption reporting signal when the voltage of the main power source drops to prescribed voltage for a prescribed period, a first game-related member 71 to share the power source for operation of the same voltage generated by the means 65, and a second game-related member 72 for detecting the game state of the game machine. According to the power interruption signal from the means 67, the current reduction adjustment means 70 reduces or interrupts current flowing through the first game-related member 71 and minimizes the reduction of a current value flowing through the second game-related member 72.
Patent JP-2003005837-A (JP)
Title: Method for detecting position or method for controlling stop position by pulse encoder
Inventor: TOYODA TOSHIHISA
IPC: G05D3/12
Filed: 2001-06-26
Abstract: PROBLEM TO BE SOLVED: To facilitate position detection by avoiding the discontinuity of position data around the origin even though a pulse encoder in which the number of pulses is not 2N is used. SOLUTION: A value obtained by dividing the value of n-th power of 2 by a prescribed number times as many as a value of the number of one-rotation output pulses of a pulse encoder is defined as a conversion constant. The prescribed number times as many as a value of the number of output pulses of the pulse encoder connected to a spindle is counted, and OR operation results between a value obtained by multiplying the counted value by the conversion constant and mask data obtained by subtracting one from a hexadecimal conversion value of the value of n-th power of 2 are defined as the current position data of the spindle.  A deviation between the obtained current position data and a value obtained by multiplying a separately set stop position set value by the conversion constant is also calculated, and the spindle is stopped at a stop position set position by a control action that makes this deviation value to be zero. The conversion constant determines the N value so that a value obtained by subtracting one from the value of n-th power of 2 can be larger than the prescribed number times as many as a value of the number of one-rotation output pulses of the pulse encoder.
Patent JP-2003009137-A (JP)
Title: Supervising system
Inventor: HIRAMOTO TSUNEO
IPC: G08B25/08
Filed: 2001-06-26
Abstract: PROBLEM TO BE SOLVED: To provide a supervising system which can supervise a security zone without operator and which preserves an image of entering/exiting person by deciding the number of entering/exiting persons. SOLUTION: The supervising system comprises a tape sensor 15 which is installed in an inlet of a gate 12 and which has a plurality of tape sensor elements disposed in a lattice state, a sensor unit 17 for converting parallel data of positions of legs of the entering/exiting persons detected by the sensor 15 into serial data, a central controller 13 for obtaining a position of a point of a center of gravity by processing output data of the unit 17, predicting a range in which the point of the center of gravity is then moved, and deciding the number of the entering/exiting persons by repeating detection of the point of the center of gravity in the predicted range; and a supervising camera 14 for imaging the entering/exiting persons from the inlet of a gate 12 by a detection signal for detecting the persons and recording the image data.
Patent JP-2003017829-A (JP)
Title: Multiple allocation wiring board cutting pressing jig and method of manufacturing wiring board by use thereof the same
Inventor: FUJIWARA TADASHI
IPC: H05K3/00
Filed: 2001-06-28
Abstract: PROBLEM TO BE SOLVED: To prevent conductor bumps formed on the surface of a multiple allocation cutting wiring board from being deformed, to surely bond the conductor bumps to the electrodes of an electronic part when the multiple-cutting board is cut off, and to provide a multiple allocation wiring board cutting pressing jig which can be repeatedly used. SOLUTION: A multiple-cutting wiring board 9, in which a large number of wiring board regions 8 with conductor bumps 10 are arranged on its main surface, is sandwiched in between a first jig 2 and a second jig 3 which are formed of resin board. A multiple allocation wiring board cutting pressing jig 1 is composed of the first jig 2, provided with slits 4 which guide the cutting edges that cut the wiring board regions 8 separately and the second jig 3 provided with grooves 5, that confront the slits 4. The first jig 2 or the second jig 3, confronting the conductor bumps 10, is equipped with a buffer 7 whose hardness is 10 to 30 in accordance with JIS-A and compressive permanent distortion is 5% or below on its surface opposed to the conductive bumps 10.
Patent JP-2003015085-A (JP)
Title: Depolarization plate and spectroscope
Inventor: YAMAMOTO TOMOKAZU
IPC: G01J3/02
Filed: 2001-06-28
Abstract: PROBLEM TO BE SOLVED: To improve a spectral characteristic by eliminating the polarization dependability of a diffraction grating being a spectral element with respect to optional polarized incident light and measuring a spectrum with a true center wavelength. SOLUTION: In this depolarization plate 1, a quartz plate 1B whose thickness continuously changes in 45 deg. direction with respect to an optical axis 12 stuck to a quartz plate 1C whose thickness continuously changes, 45 deg. angle is made between the optical axis 12 of the quartz plate 1B and the optical axis 13 of the quartz plate 1C, and the reducing direction of the thickness of the quartz plate 1B is reverse to the reducing direction of the thickness of the quarts plate 1C. The depolarization plate 1 is used for a spectroscope as shown in a diagram 3. In such a case, the direction in which the thickness of the quartz plate 1B continuously changes is made to be perpendicular to the dispersion direction of the diffraction grating 5.
Patent JP-2002345700-A (JP)
Title: Dust collecting filter for electric vacuum cleaner
Inventor: MITSUFUJI KEN
IPC: A47L9/14
Filed: 2001-05-25
Abstract: PROBLEM TO BE SOLVED: To provide a form providable at a low cost while generally a disposable dust collecting filter for an electric vacuum cleaner is composed of a paper bag and a supporting member. SOLUTION: The dust collecting filter is in a structure in which a disposable filter is made cylindrical, a filter composed of foamed urethane or the like is provided on the outer side and the outer periphery of the foamed urethane filter is fixed by a supporting member provided with grooves to insert the upper and lower ends of the foamed urethane filter and an outer peripheral part connecting upper and lower supporting member outer peripheries. Thus, it is provided at a low cost. Also, when the electric vacuum cleaner is operated, the disposable filter and a supporting member inner wall are brought into close contact and sealing is surely performed.
Patent JP-2003010565-A (JP)
Title: Sectional toy
Inventor: MURAZAKI KEIICHI
IPC: A63H33/10
Filed: 2001-06-29
Abstract: PROBLEM TO BE SOLVED: To provide a sectional toy which reproduces sounds in addition to motions, and also, express a walking motion of the sectional toy, and realize a forward walking only in order to express a natural walking motion. SOLUTION: This sectional toy comprises a plurality of block pieces, a connecting member, an electric drill for assembling, and an electric drill loading body on which the electric drill can be loaded, and also, which is equipped with a movable section, which operates while being connected with the rotating section of the electric drill. In such a sectional toy, an anti-reverse roller is provided on a leg section for walking which constitutes the block pieces, and thus, the walking motion is expressed. Also, a sound outputting means which performs a sound output, a storage means which stores a plurality of sounds, a sound selecting means which performs the reproduction by selecting the plurality of sounds are provided on the electric drill or the electric drill loading body, and thus, the reproduction of sounds is performed.
Patent JP-2003016942-A (JP)
Title: Method and device for inspecting caulking state
Inventor: IIZUKA SATORU
IPC: H01J61/10
Filed: 2001-06-29
Abstract: PROBLEM TO BE SOLVED: To positively inspect a caulking state in caulking a metal ring to a bent part of a support metal wire. SOLUTION: A stem 2 of a mount 1 is held by a holding means 71, placing the metal ring 4 side down or up. The caulking part of the metal ring 4 and a support metal wire 22 in this state is photographed by a CCD camera 73. A backlighting system 72 is installed in a position on the opposite side to the CCD camera 73 to the metal ring. An inspection processor 74 measures and analyzes an image photographed by the CCD camera 73 to measure the positive relation between the support metal wire 22 and metal ring 4 and the height and width of a projecting part of the support metal wire 22 from the end face of the metal ring 4, thus determining the caulking state of a wire bent part 30.
Patent JP-2003017531-A (JP)
Title: Semiconductor device
Inventor: HONMA SOICHI
IPC: H01L21/60
Filed: 2001-07-02
Abstract: PROBLEM TO BE SOLVED: To improve the reliability of a connection part in a semiconductor device where a semiconductor element is connected to a wiring substrate by flip chip. SOLUTION: In the semiconductor device of the present invention, an electrode terminal of the semiconductor element and the wiring layer of the wiring substrate are connected to each other via a bump by two or more kinds of connection forms. As the connection forms via the bump, two or more kinds of connection forms that are selected from the connection by melting solders each other, the connection by melting the solder and metal getting wet thereto, the connection by mutually diffusing or pressing the same kind or different kinds of metals, and the connection by contacting conductive particles can be applied.
Patent JP-2003014573-A (JP)
Title: Water leak detection method in water-cooled reaction vessel
Inventor: YAMAMOTO KENJI
IPC: G01N21/35
Filed: 2001-07-03
Abstract: PROBLEM TO BE SOLVED: To sensitively discover a water leak in a water-cooled reaction vessel having a means for introducing reactive gas reacting with water to generate hydrogen chloride into the reaction vessel, and discharging the internal gas in the reaction vessel to the outside like a CDV reaction furnace used for manufacturing polycrystalline silicon. SOLUTION: Exhaust gas is sampled from the outlet piping 3 of the water- cooled reaction vessel, and the concentration of hydrogen chloride in the sampled exhaust gas is measured by infrared spectral analysis. The water leak into the water-cooled reaction vessel is detected from a sudden rise of the measured value.
Patent JP-2003015447-A (JP)
Title: Image forming method and device
Inventor: ADACHI KEIICHI
IPC: B41J2/01
Filed: 2001-07-04
Abstract: PROBLEM TO BE SOLVED: To provide a simple and inexpensive image forming method by which temperature fall and faulty fixing at the center part from the leading edge of material to be recorded can be eliminated. SOLUTION: In this image forming method in which the material to be recorded to which the image is applied is thermally fixed in a state where the material to be recorded is attached to a cylinder 8 by using the image forming device having image applying stages (5 to 7) to apply the image on the material to be recorded and a thermal fixing stage (11) to thermally fix the material to be recorded to which the image is applied. A heat roller 21 to perform pressuring while performing heating is provided in the stage (11), and the image is fixed after the heat roller 21 is brought into contact with a preliminary contact member.
Patent JP-2003021850-A (JP)
Title: Waveguide type optical control device and its manufacturing method
Inventor: WATABE MASAO
IPC: G02B6/13
Filed: 2001-07-05
Abstract: PROBLEM TO BE SOLVED: To provide a waveguide type optical control device in which switching voltage is lowered without increasing the light transmission loss in an optical waveguide and to provide its manufacturing method. SOLUTION: The waveguide type optical control device is provided with at least an optical waveguide made of a ferroelectric body having an electrooptic effect and a control electrode provided in contact with the optical waveguide. The control electrode is constructed by stacking an upper conductive layer having an extinction coefficient of <2000 and a light-transmitting lower conductive layer which does not form an electric barrier on the interface with the ferroelectric optical waveguide. The method for manufacturing the waveguide type optical control device forms the upper and lower conductive layers by sputtering using a target having >=90% density.
Patent JP-2003011350-A (JP)
Title: Three-dimensional imaging system and method
Inventor: SONEHARA TOMIO
IPC: G03B35/00
Filed: 2001-07-05
Abstract: PROBLEM TO BE SOLVED: To provide three-dimensional imaging system and method in which a lens and a parallax image can be aligned accurately and a high resolution three-dimensional image sheet can be produced while dealing with increasing size thereof. SOLUTION: The three-dimensional imaging system comprises a recording head 11a for recording a parallax image 60c by ejecting ink to a specified position of a recording member 60 while moving in the main scanning direction, means for moving the recording head, a resin ejection head 11b for forming a plurality of lenses by ejecting resin to a position of the recording member 60 corresponding to the parallax image 60c, means for moving the resin ejection head, and means for moving the recording member 60 in the sub-scanning direction.
Patent JP-2003020055-A (JP)
Title: Package with measure cup for liquid agricultural chemical or liquid fertilizer
Inventor: KOBAYASHI AKIO
IPC: B65D41/26
Filed: 2001-07-09
Abstract: PROBLEM TO BE SOLVED: To provide a package for a liquid agricultural chemical or a liquid fertilizer with a measure cup for the chemical or the fertilizer to be diluted for use wherein the cup can be housed without washing it each time it is used. SOLUTION: The package includes a container (1) filled with a liquid agricultural chemical or a liquid fertilizer and a lid (2) to be screwed with a mouth cylinder (14) of the container (1) for mounting. A second cylinder (7) comprising a threaded cylinder (6) having a thread on an inner peripheral surface which is made to extend upward beyond a top plate (5) is provided, and a fixing means for holding a measure cup (3) on an inner peripheral surface of the second cylinder (7) is provided.
Patent JP-2002064200-A (JP)
Title: Semiconductor device
Inventor: MATSUDA HIDEO
IPC: H01L29/744
Filed: 2001-07-09
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device where a fine control when patterning third and fourth layers is allowed to eliminate variations in characteristics. SOLUTION: The device is provided with a first conductive type substrate 21, a second-conductive-type first layer 22 formed on surface of the first conductive type substrate 21, a first-conductive-type second layer 23 formed on the second-conductive-type first layer 22, a first-conductive-type third layer 24 selectively formed on the other surface of the first conductive type substrate 21, a second-conductive-type fourth layer 25 formed on the other surface of the first-conductive-type substrate 21 to a thickness 5-20 μm, and an electrode formed by a deposition method with no wax material used for the third layer 24 and a fourth layer 25. The first layer 22 and the third layer 24 are thicker than the fourth layer 25.
Patent JP-2003021819-A (JP)
Title: Wiping device for liquid crystal panel, pressure sealing device for liquid crystal panel and method for wiping liquid crystal panel
Inventor: SOYAMA MITSUYOSHI
IPC: G02F1/13
Filed: 2001-07-09
Abstract: PROBLEM TO BE SOLVED: To provide a wiping device for a liquid crystal panel, capable of efficiently wiping off an excessive liquid crystal on a liquid crystal panel surface to be wiped always with a clean wiper, a pressure sealing device for the liquid crystal panel and a method for wiping the liquid crystal panel. SOLUTION: While a tape-like Bencotton(R) 430 suspended between and extended over two rolls 420a, b of a wiping device 125 is rewound, for example, by transferring the Bencotton 430 in contact with the surface 440 to be wiped of the liquid crystal panel 310 the clean Bencotton 430 is always brought into contact with the surface 440 to be wiped of the liquid crystal panel.
Patent JP-2003023117-A (JP)
Title: Method for manufacturing semiconductor integrated circuit device
Inventor: WATANABE KEIZO
IPC: H01L27/115
Filed: 2001-07-10
Abstract: PROBLEM TO BE SOLVED: To improve a yield of manufacturing steps of a flash memory by increasing a process margin in a SAC technique. SOLUTION: A method for manufacturing a semiconductor integrated circuit device comprises steps of coating an overhanging shape of a silicon nitride film 7 on a two-layer gate of a laminated structure having a conductor film 2 for a floating gate formed on a main surface of a semiconductor substrate 1 and a conductor film 3 for a control gate, and subsequently depositing an insulating film 8 made of a silicon oxide on the substrate 1. The method further comprises steps of perforating a contact hole CONT in the insulating film 8 with the silicon nitride film 7 as an etching stopper layer, then removing the exposed silicon nitride film 7, and then exposing an n-type semiconductor region D for forming a drain.