baber/WOPTO huggingface dataset:
Patent JP-H03132812-A (JP)
Title: Bipolar/cmos regulator circuit
Inventor: TSUEN UEN GIYUO
IPC: H01L27/06
Filed: 1990-09-27
Abstract: PURPOSE: To comprehensively and precisely control MOS transistor current by using bipolar/CMOS(complimentary MOS) elements so that CMOS gate control voltage which conveniently changes with a temperature, power voltage and a process corner. CONSTITUTION: A current mirror part 18 containing first and second P channel MOS transistors P1 and P2 and a current source part 20 constituted of a first bipolar transistor Q1 and an emitter resistor R1 are provided. Furthermore, an output part 22 formed by a diode D1, a first N channel MOS transistor N1, a second bipolar transistor Q2 and a second N channel MOS transistor N2 is provided. Then, CMOS gate control voltage which conveniently changes with the temperature and the process corner is generated. Thus, manufacture/ assembly can comparatively simply and economically be executed and MOS current can precisely be controlled in the same way as the current of a bipolar circuit.
Patent JP-H0976519-A (JP)
Title: Capping device for ink jet recording head
Inventor: HAYAKAWA HITOSHI
IPC: B41J2/165
Filed: 1995-09-13
Abstract: PROBLEM TO BE SOLVED: To certainly seal a recording head by weak energizing force even at the beginning of use. SOLUTION: Close contact layers 40, 41 are provided to the contact surfaces 13a, 14a with a recording head of the cap members 13, 14 made of an elastic material provided to the slider moving toward the recording head so as to follow the movement of a carriage in the state energized toward the recording head by a spring to elastically come into contact with the recording head and, even when the cap members 13, 14 do not develop flexibility at the initial stage of use having no affinity to ink, the cap members come into contact with the recording head through the close contact layers 40, 41 to keep airtightness.
Patent JP-H01131785-A (JP)
Title: Method and device for controlling submarine blow-off preventive device
Inventor: JIEIMUSU EMU MAKUMAHAN JIYUNIA
IPC: E21B33/06
Filed: 1988-10-18
Abstract: PURPOSE: To reduce cost and quicken the operation of a seabottom BOP function by constituting so that selected important functions only are controlled by an electric line, or seabottom electric power can be transmitted through existing two hydraulic connecting lines. CONSTITUTION: This system is constituted so that control pod 70 or the like is provided with hydraulic pilot valves 81-87 and eight solenoid SOL 1-8 connected to an ESV valve 88, the selected important functions of a seabottom BOP system are controlled by an electric line, and the other functions are controlled by hydraulic lines. A hydraulic pump 133 operates a hydraulic operator 113 to open a BOP 110, and in the case of reaction or jet, a switch 131 is closed to send an electric signal to a pilot valve 112 through boxes 121, 119, and the like having electrodes and conductive hydraulic lines 114, 115 filled with weak electrolytic solution, so as to quickly close the BOP 110.
Patent JP-S63190774-A (JP)
Title: Hydrophobic inorganic structure
Inventor: EIBURAHAMU ARAYA
IPC: C04B38/00
Filed: 1987-10-15
Abstract: Three dimensional hydrophobic substantially inorganic porous structure comprises a myriad of cavities interconnected by holes in which the diameters of the cavities are in the range of from 0.5 to 100 mu m and the diameters of the holes are in the range of from 0.1 to 20 mu m the porosity of the structure having a narrow pore size distribution with the cavities having a pore volume of at least 2 cc/g for a predetermined 10 mu m range of sizes. The structure is preferably an inorganic oxide selected from the group comprising alumina, silica, titania, zirconia and mixtures thereof. The structure is preferably made from an oil-in-water emulsion with a silylating agent in the internal phase so as to render the structure hydrophobic.
Patent JP-S61140153-A (JP)
Title: Semiconductor device
Inventor: OTANI HIDEYA
IPC: H01L23/14
Filed: 1984-12-12
Abstract: PURPOSE:To prevent the infiltration of moisture and the like into a cavity by a method wherein a moisture-impermeable material is adhered to the inner surface of a cavity bored at a required part of a pellet mount cap plate made of fiber-reinforced resin. CONSTITUTION:The package substrate 1 is formed out of glass epoxy, one of fiber-reinforced resin, and a cavity 2 which is the recess is bored nearly at the center of the substrate 1. A through-hole 3, the perforated part, is formed around it, and a wiring 6 to electrically connect a wiring 4 produced by print- forming copper or the like on the substrate top with the back electrode 5 is formed on the wall surface of the through-hole. A pellet 7 is installed in the cavity 2 with adhesive 8, and said pellet 7 is electrically connected to the above- mentioned wiring 4 with wires 9 of Au or the like and then potted with silicon gel 10. The cavity inner surface is coated with an epoxy resin. one of moisture- impermeable material.
Patent JP-H02109352-A (JP)
Title: Resin sealing material for hybrid ic
Inventor: NISHIOKA KATSUNORI
IPC: H05K3/28
Filed: 1988-10-18
Abstract: PURPOSE:To absorb conductive noise and undesired radiation noise by preparing a resin sealing material for ICs from the mixture of synthetic resin such as epoxy resin, phenol resin, Si resin and ferrite powder as a filler. CONSTITUTION:The quantity of epoxy resin, a hardening agent, and a hardening promoting agent is measured so as to obtain a specified compound composition. A predetermined wt.% of Ferrite powder is mixed as a filler in a ratio of solid parts to a liquefied epoxy resin obtained by dissolving these and kneaded. Next, using an obtained resin sealing material, a hybrid IC is sealed by dipping. After the resin is sealed, it is heated at a given temperature for a given time and hardened. A lead frame 3 is cut off from the resin and a SIP type hybrid IC for controlling power is obtained. Thus, circuits and devices of hybrid IC can be protected and insulated, and noise generated in a hybrid IC can be reduced.
Patent JP-H05102064-A (JP)
Title: Manufacture of semiconductor device
Inventor: MUKAI RYOICHI
IPC: H01L23/52
Filed: 1991-10-09
Abstract: PURPOSE:To provide a method for forming a metal plug by reducing an aggregation intrinsic for metal, forming a thin continuous film of metal on the sidewall of a viahole, and laser-melting it in the method for forming the plug in the viahole of a semiconductor device and particularly in the method for forming the plug by using a laser melting technique. CONSTITUTION:The method for manufacturing a semiconductor device comprises the steps of forming a base film 6 made of a material having a thickness of 50nm or less and high 'wettability' before depositing a plug forming metal thin film, and depositing 4 a plug forming metal material at 100 deg.C or lower of a substrate temperature.
Patent JP-H05299493-A (JP)
Title: Ceramic electrostatic wafer chuck
Inventor: MAIKERU SUKOTSUTO BAANZU
IPC: H01L21/683
Filed: 1992-09-30
Abstract: PURPOSE: To obtain a chuck which is operable in a wide temp. and pressure ranges, economically manufacturable and usable, even in a one- or two-polar potential mode by making it from mutually welded laminate boards and providing a plurality of openings which form passages for liq. coolant which extend to the top face. CONSTITUTION: Laminated boards 15, 16 are mutually welded to form a support 12. One of the laminated boards 16 has a backside metal electrode pattern 22 for generating an electrostatic power which holds a semiconductor wafer on a top face 14. The other laminated board 15 has a backside metal electrode pattern 24 to be connected to a power source on the outer surface of the support 12. Vias 26 are provided for electrically connecting the pattern 22, formed in the laminated board 16, to the pattern 24. Openings 18 are provided for forming passages for liq. coolant, which are formed in the laminate boards 16 and positioned in the support 12 and extend from the outer surface of the support 12 to the top face 14.
Patent JP-H06112741-A (JP)
Title: Common amplifier
Inventor: INOUE TAKETOSHI
IPC: H03F3/68
Filed: 1992-09-30
Abstract: PURPOSE:To change the number of packaged linear amplifiers without stopping the operation of a common device. CONSTITUTION:Packaging detectors 31-3n are arranged corresponding to the linear amplifiers 41-4n respectively and detect packaging states of these amplifiers according to whether packaging detector terminal (c) is grounded or not to control switches 11-1n and 21-2n. A signal distributor 1 can distribute the input signals Si, and the switches 11-1n are connected to the output terminals respectively. A signal synthesizer 2 can synthesize the outputs of (n) pieces of linear amplifiers, and the switches 21-2n are connected to the input terminals respectively. When the amplifiers 41-4n are packaged, the detectors 31-3n turn on the corresponding switches 11-1n and 21-2n to set the amplifiers 41-4n in the connection states. If these amplifiers are not packaged, the switches 11-1n and 21-2n are turned off. Then the output terminal corresponding to the distributor 1 and the input terminal corresponding to the synthesizer 2 are opened.
Patent JP-H03123049-A (JP)
Title: Electrode body
Inventor: IKEDA TORU
IPC: G01R31/26
Filed: 1989-10-05
Abstract: PURPOSE:To improve an electrode body in reliability and reproducibility by a method wherein a film of conductive material is formed on the sharp tip of a crystal, which is formed taking advantage of an etching rate that differs to crystal axes, to form an electrode provided with a sharp tip. CONSTITUTION:For instance, a crystal thin plate 2 is cut out of a quartz crystal 1 in a direction which forms a prescribed angle of theta with a Z direction, and further more a small piece 3 is cut along a plane shown by a dotted line. Then, corrosion resistant resist is applied onto the plane (shaded part) of the small piece 3 which includes a Y axis, forming a pointed part whose apex angle is a prescribed angle of 4 the same as the angle of theta, and furthermore the resist is applied onto the whole opposed rear of the piece 3. Then, the small piece 3 is subjected to a wet etching by an etching device, at this point, the small piece 3 is hardly etched in the directions (X, Y direction) of the plane of the thin plate 2 while etching proceeds in the thicknesswise direction of the thin plate 2, so that a micro part of a small quartz piece provided with a pointed part 12 can be obtained. Then, the crystal micro part is coated with metal to form a conductive pointed end.
Patent JP-H08101876-A (JP)
Title: Multiplication circuit
Inventor: KOTOBUKI KOKURIYOU
IPC: G06G7/16
Filed: 1994-09-30
Abstract: PURPOSE: To output the mutually multiplied result of digital data as analog data by setting the weight of capacity coupling to an analog input voltage based on the digital data. CONSTITUTION: This multiplication circuit is provided with plural first opening/ closing means SW11-SW14, and a first capacity coupler CP 1 is connected to each output. The capacity coupler CP1 is constituted by parallelly connecting capacitances C11-C15, one terminal of each of capacitances C11-C14 is connected to each of opening/closing means SW11-SW14, and one terminal of the capacitance C15 is grounded. Further, the output of the capacity coupler CP1 is inputted to an inverted amplifier INV1 composed of three stages of MOS inverters I1-I3, and the output of the inverted amplifier INV1 is connected through a feedback capacitance Cf1 to its input.  Thus, this multiplication circuit weighs the prescribed analog input voltage more than two stages with the capacity coupler CP1, and the weight of this capacity coupler CP1 is set by controlling the opening/closing means based on the digital data.
Patent JP-H0568692-A (JP)
Title: Adhesive plaster
Inventor: CHIKAMORI YOSHIHIRO
IPC: A61F13/02
Filed: 1991-09-12
Abstract: PURPOSE:To provide the adhesive plaster having stretchability together with waterproofness, air permeability and moisture permeability. CONSTITUTION:This adhesive plaster is formed by partially bonding an air permeable sheet 1 to the surface of the hydrophilic resin film 3 of a porous fluororesin film 2 formed with the hydrophilic resin film 3 on one surface, providing a tacky adhesive layer 4 to the part of the other surface of the porous fluororesin film 2 on the side opposite thereof exclusive of the part which is formed in the central part and comes into contact with a wound and attaching a cover film 5 freely attachably and detachably to the front surface of this tacky adhesive layer 4 including the part in contact with the wound.
Patent JP-H09105517-A (JP)
Title: Manufacture of furnace wall block of boiler opening
Inventor: MAEHARA SEIJI
IPC: F23M5/00
Filed: 1995-10-09
Abstract: PROBLEM TO BE SOLVED: To obtain a method for manufacturing the furnace wall block of a boiler opening to manufacture the block provided with the opening at the wall to provide a soot blower. SOLUTION: The method for manufacturing the furnace wall block of a boiler opening comprises the steps of bending a thinner tube 1 than a furnace wall tube to meet the shape of a furnace wall block 6 to form a furnace wall tube shape, disposing the tube 1 formed with the wall tube shape in a sand casting mold formed to match the shape of the block 6, casting to enclose it by a cast steel 4 to form the block 6, and hot hydrostatically pressurizing the formed block 6. Thus, the manufacturing man-hour of the block 6 can be largely reduced, the material cost can be decreased, and the low-cost block 6 can be manufactured. No defect occurs between the tube 1 and the steel 4, and the material performance such as the quality of heat resistant and pressure resistant member and fatigue strength can be improved.
Patent JP-H03162928-A (JP)
Title: Cylindrical opening part of preform and method of molding bottom
Inventor: NAKAZATO SHINSAKU
IPC: B29B11/10
Filed: 1989-10-06
Abstract: PURPOSE:To enable the cylindrical opening part and bottom of preform to be molded correctly by molding a multi-layered structure on the cylindrical body and thereafter heating one end and the other end of the cylindrical body and further pressing respectively each mold and cylindrical body in a cylindrical opening female mold and bottom forming female mold in the axial direction of the cylindrical body. CONSTITUTION:One end part 2 of a cylindrical body 1 in the multi-layered structure where layers comprising thermoplastic polyester having ethylene terephthalate as a main repeating unit or polyester are a main body heated and softened is at the temperature of a glass transi tion point or higher and at the temperature of crystallization or lower. The heated and thus softened one end part 2 of the cylindrical body 1 is inserted into a cylindrical opening female mold 10 provided with molding resessions 11 such as screws, flanges, and the like in its inner surface and formed as a split mold and in the cylindrical body 1, a cylindrical opening female mold 12 is inserted and then the other end part 3 of the cylindrical body 1 is pressed by means of a cylindrical body pressing tool 13 in the axial direction of the cylindrical body 1. Thereby, at the outside of the one end part 2, screws, flanges, and the like formed on the cylindrical opening mold 10 are molded correctly and at the inside of the one end part 2, a cylindrical opening part 30 formed according to the outer surface of top end of the cylindrical opening female mold 12 is molded.
Patent JP-H07123791-A (JP)
Title: Motor driver
Inventor: NAKAEGAWA TOMOHIDE
IPC: H02P8/14
Filed: 1993-10-19
Abstract: PURPOSE:To reduce the number of wirings for connecting a transmitter circuit to a receiver circuit. CONSTITUTION:The motor driver comprises a switching element 11 for interrupting an output of a power source 12 in a pulselike state under the control of a controller 10, a controller 13 for outputting a coil control signal for one step when a power source output is lowered, and a power output circuit 14 for so conducting coils 3, 4 as to rotate by one step a rotor 2. Capacitors C1, C2 to be charged through diodes D1, D2 from the power source output are provided to supply power to the controller 13 and the circuit 14 while the power source voltage becomes '0'.
Patent JP-H07114289-A (JP)
Title: Temperature controller for fixing device
Inventor: AIKAWA YUKIHIRO
IPC: G05D23/19
Filed: 1993-10-19
Abstract: PURPOSE:To prevent the occurrence of a high temp. offset and creases which are easy to occur in the top end part side of sheets of paper and the occurrence of a fixing fault which is easy to occur in the rear end side by setting a first off temp. lower than a control temp. in a regular control part. CONSTITUTION:Since the first off temp. T2 is set lower than the control temp. TC by the regular control part, an overshoot amount to a temp. rise side is reduced. Thus, the overshoot to a temp. fall side after the first off of the energizing to a heater is suppressed. Moreover, since the intermittent control based on a lapse time and the temp. control is performed, in a first copying time, the temp. is controlled in the state that a high temp. offset area and a fixing fault area are avoided. In particular, for the copying in a moving stage from a warming-up time to a regular control time when the temp. change is easy to become violent, the avoidance of the high temp. offsets in the top end parts of the sheets of paper and the avoidance of the fixing faults in the rear end parts of the sheets of paper are attained also. Further, for a comparison, the temp. change in the case when no first off temp. is lowered is shown by a chain line.
Patent JP-2000090615-A (JP)
Title: Disc storage apparatus and method applied to the apparatus for measuring head flying height
Inventor: FURUSAWA TAKAKI
IPC: G11B21/21
Filed: 1998-09-16
Abstract: PROBLEM TO BE SOLVED: To realize a function of particularly monitoring a change in flying height by measuring the flying height of a head independently of a normal data record reproduction operation after a drive is assembled. SOLUTION: The apparatus is an HDD using a disc 1 having a measurement area with projecting parts of different heights of six levels as well as a data area for recording data. A CPU 10 measures the flying height of a head 2 on the basis of a collision state of the head 2 sought to the measurement area with each projecting part at a time other than a normal data record reproduction operation, and monitors generation of an abnormal change in the flying height.
Patent JP-H06108908-A (JP)
Title: Fuel injection device of engine
Inventor: KANBARA SHINJI
IPC: F02M69/00
Filed: 1992-09-30
Abstract: PURPOSE:To promote gasification and atomization of fuel by injecting fuel from an upstream side fuel injection valve in an intake passage at the time of the low load of an engine and cold environment, and also suppress output reduction following transport delay of fuel by injecting fuel from a downstream side fuel injection valve at the time of a low load and hot environment. CONSTITUTION:In an intake passage 2 between the combustion chamber of an engine 1 and a surge tank 6, a first fuel injection valve 10 is arranged on the downstream side thereof, and a second fuel injection valve 11 is arranged on the upstream side thereof. Both fuel injection valves 10, 11 are controlled respectively by a control unit 20 on the basis of respective output signals of an air flow sensor 4, a water temperature sensor 12, a crank angle sensor 13 and a starter switch 14. Namely, fuel is selectively injected respectively by the second fuel injection valve 11 at the time of the low load of the engine 1 and cold environment, by the first fuel injection valve 10 at the time of the low load and hot environment, and by both fuel injection valves 10, 11 at the time of the high load. It is thus possible to suppress output reduction of the engine 1 caused by transport delay of fuel while promoting gasification and atomization of fuel.
Patent JP-H09103801-A (JP)
Title: Method for rolling angles
Inventor: SUGIMOTO YASUHIRO
IPC: B21B1/08
Filed: 1995-10-09
Abstract: PROBLEM TO BE SOLVED: To provide a method for rolling angles, by which rough surface on a leg tip part are prevented by setting the synchronization point of the peripheral speeds of upper and lower rolls rolling a stock to an angle steel on the leg tip part side, and reducing a difference in the peripheral speeds of the leg tip parts. SOLUTION: In a method for rolling angles, by which a billet is rolled and formed to an angle steel by upper roll 6 and lower roll 7, the positions of work diameters ϕA and ϕB of the upper roll 6 and the lower roll 7, are set on the leg tip part side of a work 8 to be rolled and formed from the position G of center of gravity of both rolls 6 and 7. Consequently, the slip phenomenon of the rear leg tip part of the work 8, occurring caused by a difference in peripheral speeds, is prevented, and slip-shaped rough surface is prevented.
Patent JP-H02108955-A (JP)
Title: Method and device for density measurement
Inventor: YAMAGUCHI HIDEICHIRO
IPC: G01N27/48
Filed: 1988-10-19
Abstract: PURPOSE:To enable continuous measurement without requiring calibration and to measure the concentration of an unknown material by dipping an extremely small electrode, a reference electrode, and a counter electrode in a solution to be measured and measuring a diffusion limit current by pulse electrolysis. CONSTITUTION:The extremely fine electrode 10, reference electrode 11, and counter electrode 12 are connected to a three-electrode type pulse electrolysis device 13, the solution to be measured in a solution 24 is electrolysed with voltage pulses 30 supplied from a pulse generator 14, and the electrolysis current 31 is measured and stored in a RAM 16. Then it is decided whether or not the measurement of the electrolysis current is finished and when not, the operation is repeated from the start. When it is decided that the measurement ends, a timing circuit 20 is stopped and the measurement is stopped. Then the measurement result begins to be processed to calculate the diffusion coefficient and concentration C, which are outputted on a display 21 or printer 22. Consequently, the continuous measurement is enable without requiring calibration and the concentration of the unknown material can be measured.
Patent JP-S61140133-A (JP)
Title: Manufacture of semiconductor device
Inventor: NAKADA RENPEI
IPC: H01L21/28
Filed: 1984-12-13
Abstract: PURPOSE:To increase the resistance of an ohmic contact between the wiring layer and the diffused layer, and to enhance the reliability without deteriorating the junction characteristic even to a semiconductor layer having a fine and shallow p-n jnction, by a method wherein an epitaxial Si film is selectively formed on the Si in an aperture by using the mask of an insulating film. CONSTITUTION:First, an Si oxide film is deposited as the insulation film 33 over the whole surface of an n<+> type Si diffused layer 32 of p-n junction formed in the p-type Si substrate 31 by As ion implantation. A contact window is bored in that film by photolithographic etching or another method. Next, an SiH2Cl2- H2 series gas and HCl are introduced to the substrate heated under pressure reduction, thus forming a 200Angstrom  epitaxial film 34 selectively on the diffused layer 32. Then, a 400Angstrom  W film 35 is selectively formed on the epitaxial Si film 34 by a pressure reduction vapor phase growth using WF6. Successively, a wiring metallic layer 36 such as aluminum is adhered to a 1mum thickness and finally selectively etched into an electrode wiring pattern of desired shape.