baber/WOPTO huggingface dataset:
Patent TW-388001-B (TW)
Title: Liquid crystal display
Inventor: UCHIDA TATSUO
IPC: G09G3/36
Filed: 1997-10-15
Granted: 2000-04-21
Abstract: The object of this invention is to provide a liquid crystal display that is able to realize a sequential color illumination method.I.e. that can advantageously achieve a high resolution full color display with no need of any color filters. For the purpose of attaining the object above, this invention provides a liquid crystal display characterized by being provided with a display panel in which a phase compensation plate is disposed in front of a bend oriented liquid crystal cell with a cell gap 7 mu m, said cell and phase compensation plate being inserted between two cross polarizers between. A TFT active matrix driving each image element by dividing said display panel into elements in a matrix array. And a surface light source sequentially illuminating three color lights of red. Green and blue on the rear face of the display panel.
Patent TW-341655-B (TW)
Title: Process for producing a polyester film or polyamide film having a lusterless surface and used as the coating layer of a tape measure the invention relates to a process for producing a polyester film or polyamide film having a lusterless surface, which comprises grinding one surface of the film with sand of different coarseness.
Inventor: LII SHY-TONG
IPC: G01B3/10
Filed: 1998-01-23
Granted: 1998-10-01
Abstract: A process for producing a polyester film or polyamide film having a lusterless surface and used as the coating layer of a tape measure, which comprises drawing a polyester film or polyamide film having a glossy surface on both sides from a polyester film roll or polyamide film roll, feeding the film into a grinding device to be ground by coarse sand in order to remove one glossy surface on the polyester film or polyamide film, further grinding the film by sand with a medium coarseness, then grinding the film by sand with a fine coarseness; feeding the ground polyester film or polyamide film into a dust removal device to remove the grinding dust, and winding the film into a roll to form a polyester film or polyamide film having a lusterless surface on one side.
Patent TW-591041-B (TW)
Title: Method of olefin polymerization utilizing hydrogen pulsing
Inventor: SHAMSHOUM EDWAR S
IPC: C08F110/06
Filed: 1998-02-06
Granted: 2004-06-11
Abstract: An olefin polymerization process in which at least two introductions of hydrogen are made during the olefin polymerization reaction. Suitable catalysts include metallocenes of the general formula (Cp)mTiXn wherein Cp is a substituted or unsubstituted cyclopentadienyl ring, X is a halogen, m=1-2, n=2-3, and wherein m+n=4, and conventional Ziegler-Natta catalysts blended with or modified by such metallocenes.
Patent TW-363025-B (TW)
Title: Motorcycle of scooter type
Inventor: ITAJIKI SHUNICHI
IPC: B62K11/10
Filed: 1998-02-13
Granted: 1999-07-01
Abstract: A kind of motorcycle of scooter type which is to firmly hold the assembly of front cover and head light and to divide the front cover in the head axis in order to make the cover wall lighter and improve the appearance. The head light cover is used to cover the front face plate and with the installation portion for the front leg weathering board at the chassis. The invention can make good assembly of head light cover and head light and make the thin wall of front face plate lighter without supporting the head light.
Patent TW-380108-B (TW)
Title: Meter cover for a motorcycle mounting structure
Inventor: IWANAGA SADAMU
IPC: B60K35/00
Filed: 1998-03-04
Granted: 2000-01-21
Abstract: The invention is to reduce the screws and installation chassis for metter cover installation that it can save the component cost and reduce the screw heads exposed on the metter cover surface to keep a good appearance of metter cover. The metter cover for keeping the instrument status is mounted on top of the oil tank of motorcycle just like the oil filler point surrounding the oil tank which employs hooks and screws for combination. The hooks are fixed on top of the oil tank for fixing the metter cover on the tank and seated at the covered portion by the cover. The screws are mounted on the inner side of the cap of oil filler point.
Patent TW-363282-B (TW)
Title: Light-emitting device and recording device using the same
Inventor: CHOSA YOSHIHIKO
IPC: H01L33/56
Filed: 1998-03-05
Granted: 1999-07-01
Abstract: A kind of light-emitting device which includes: a first plate provided a conductor pattern thereon; a plurality of light-emitting elements disposed at predetermined portions on the first plate, respectively; and a plurality of light-passing structures provided so as to respectively correspond to the plurality of light-emitting elements. The invention relates to a kind of light-emitting device which is best used for the image writing apparatus, for example, the photo exposure type printer.
Patent TW-396682-B (TW)
Title: Hybrid circuit
Inventor: RUEGSEGGER STEFAN
IPC: H04B1/40
Filed: 1998-04-01
Granted: 2000-07-01
Abstract: The hybrid circuit, which serves to connect a transmitter unit (TX) and a receiver unit (RX) to a bifilar transmission circuit, demonstrates a bridge circuit with four bridge branches, each of which has two resistors (R1t, R2t; R1r, R2r; R3r, Rqr; R3t, Rqt), which are measured and connect the two terminals (txa1, txa2) of the transmitter unit (TX) and the two inputs (rxel, rxe2) of the receiver (RX) in such a manner that the components of the transmitting signal appearing at the input of the receiving unit (RX) cancel each other out, whereby the transmission circuit - if appropriate using an intermediate circuit of a transformer (TF) - is connected with the transmitter (TX) via the first resistors (Rqt and Rqr) of the third and fourth bridge branches (R3r, Rqr; R3t, Rqt) and with the receiver (RX) via the second resistors (R3t and R3r) of the third and fourth bridge branches (R3r, Rqr; R3t, Rqt). The resistors (R1t, R2t, R3t, Rqr or R1r, R2r, R3t, Rqt) of the four bridge branches are chosen in accordance with the invention in such a manner that a generally foreseeable impedance (Zb), designed to compensate for the impedance (ZI) of the transmission line takes on such a high value, that the error tolerance, required for the hybrid circuit, is observed, even without the inclusion of this impedance (Zb). The hybrid circuit is preferably connected with the input of the receiver unit (RX) via a filter (FR), which serves to compensate for the attenuation distortion of the signals, which are transmitted via the copper cable (SL1, SL2).
Patent TW-455731-B (TW)
Title: Liquid crystal display device and the manufacturing method of the same
Inventor: TATENO AKIHIKO
IPC: G02F1/1339
Filed: 1998-06-15
Granted: 2001-09-21
Abstract: The purpose of the present invention is to provide a liquid crystal display exhibiting excellent display quality having good contrast, whose quality is not influenced by the light leakage resulting from the spacers due to the fact that most of the spacers are arranged under a black matrix. This invention is a liquid crystal display having a liquid crystal injected into a gap between two substrates arranged to oppose each other through spacers. Its feature is that at least one of said two substrates is a substrate on which a black matrix is formed; at least one of the two substrates is a substrate constituted by aligning a plurality of transparent electrodes; not less than 50% of the spacers are arranged just under a position of the black matrix; and the spacers arranged just under the position of the black matrix are arranged along the transparent electrodes.
Patent TW-376582-B (TW)
Title: Method of forming COB DRAM with self-aligned pole and bitline contact plug
Inventor: LUO HONG-YI
IPC: H01L27/108
Filed: 1998-06-26
Granted: 1999-12-11
Abstract: In a BPSG layer where a plug is formed between a gate structure and a word line, a poly layer, a tungsten silicide layer and a silicon oxide layer are sequentially formed on the BPSG layer. Next, a multi-layer structure is etched to the surface of the BPSG layer. The BPSG layer is slightly etched to expose a poly plug. An oxide spacer is formed on the sidewall of a film layer. A silicon nitride layer is formed on the bit line, the oxide spacer and the poly plug. An oxide layer is formed on the silicon nitride layer. The oxide layer is etched to form an electrode contact hole. A first conductive layer is formed along the surface of the oxide layer by etching the silicon nitride layer. A portion of the top end of the first conductive layer is removed. The oxide layer is removed to expose the silicon nitride layer. A dielectric film is deposited along the surface of the first conductive layer. Finally, a second conductive layer is formed on the dielectric film.
Patent TW-390984-B (TW)
Title: The USB bridge connection apparatus for host to host
Inventor: SHIU SHUO-YANG
IPC: G06F1/18
Filed: 1998-07-01
Granted: 2000-05-21
Abstract: A USB bridge connection apparatus for host to host is used for the data remote transmission between two host computers. A register is included in the apparatus to register data transmission control command and buffer application. At least a pair of first in first out (FIFO) control command transmitters are connected between two serial interface engines. The serial interface engines individually provide the connection between the USB interface of two host computers such that data transmission control command can be sent by either side of the host computers. At least a pair of FIFO bulk data transmitters are also connected between two serial interface engines and provide the USB bulk data transmission between two host computers such that data transmission control command can be sent remotely by either side of the host computers. Consequently, the USB bulk data transmission between two host computers is executed automatically so as to form a bridge connection structure of USB data transmission between host computers.
Patent TW-408348-B (TW)
Title: Method of maximizing chip yield for semiconductor wafers
Inventor: PREIN FRANK
IPC: H01L21/66
Filed: 1998-08-01
Granted: 2000-10-11
Abstract: A method of fabricating semiconductor chips includes the steps of optimizing a number of chips that geometrically fit on a wafer and maximizing chip yield for the wafer by considering chips located in a normally rejectable location and utilizing yield probability data for the chip in the normally rejectable locations to weight the probability of an acceptable chip such that if the probability is above a threshold value the chips are not rejected. This results in an increased chip yield for semiconductor wafers.
Patent TW-432197-B (TW)
Title: System and method for increasing the durability of a sapphire window in high stress environments
Inventor: GOTTLIEB JAMES H
IPC: B64G1/36
Filed: 1998-11-03
Granted: 2001-05-01
Abstract: A dome assembly (50) adapted for use with a missile (32) having a longitudinal axis (42) parallel to a thrust vector thereof. The inventive dome (50) includes a sapphire crystal (30) having a crystallographic structure that includes positive n-planes (12), positive r-planes (14) and a c-plane (16). A surface around a missile sensor provides a place for mounting the crystal (30, 50) such that one of said positive r-planes faces leeward with respect to wind flow (36) that impinges on said missile (32) during missile flight. The projection of one of the positive r-plane normals onto the wind flow vector (36) points aft. By design at nominal conditions, an r-plane (14) is approximately bisected by a plane formed by the normal of the c-plane (16) and a wind flow vector (36). In the illustrative embodiment, the dome assembly (50) includes an x-ray device for locating the r-planes planes within the sensor dome (50). A turntable (not shown) orients the sensor dome (50) so that a first r-plane (14) faces leeward of impinging air flow (36). An r-plane normal (38) of a second r-plane forms an angle of approximately 60 degrees with respect to impinging airflow (36). The turntable includes a motor (not shown) for strategically orienting the lattice planes (12, 14, 16) of the dome (50) so as to maximize the strength of the dome (50) with respect to applied stresses.
Patent TW-392174-B (TW)
Title: Semiconductor integrated circuit device
Inventor: MAESAKO TAKETO
IPC: G11C8/12
Filed: 1998-09-09
Granted: 2000-06-01
Abstract: A semiconductor integrated circuit device comprises a main memory portion constituted with memory cells arranged in a plurality of rows and in a plurality of columns and a sub memory portion constituted with memory cells arranged in a plurality of rows and in a plurality of columns, wherein at least one of address input terminals assigning rows or columns of the main memory portion and at least one of address input terminals assigning rows or columns of the sub memory portion are commonly used and a total number of address input terminals is equal to or smaller than the number of address input terminals assigning rows or columns of the main memory portion. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Patent TW-441142-B (TW)
Title: Membrane electrode assembly
Inventor: DEBE MARK KEVITT
IPC: C25B9/19
Filed: 1998-10-02
Granted: 2001-06-16
Abstract: A membrane electrode assembly is provided comprising an ion conducting membrane and one or more electrode layers that comprise nanostructured elements, wherein the nanostructured elements are in incomplete contact with the ion conducting membrane. This invention also provides methods to make the membrane electrode assembly of the invention. The membrane electrode assembly of this invention is suitable for use in electrochemical devices, including proton exchange membrane fuel cells, electrolyzers, chlor-alkali separation membranes, and the like.
Patent TW-400304-B (TW)
Title: Method and apparatus for winding fiber on a spool
Inventor: BEDNARCZYK DAVID ANDRED
IPC: B65H54/34
Filed: 1998-10-24
Granted: 2000-08-01
Abstract: A continuous length of fiber from a fiber supply is wound onto first and second sections of a spool by an apparatus and method that collect a first portion of the continuous length of fiber from the fiber supply, wind the collected first portion onto the first section of the spool, and wind a second portion of the continuous length of fiber onto the second of the spool.
Patent TW-422980-B (TW)
Title: Synchronous dram semiconductor device having standby current reducing function
Inventor: JO SEONG-KUE
IPC: G11C11/407
Filed: 1998-11-27
Granted: 2001-02-21
Abstract: A synchronous DRAM semiconductor device having a standby current reducing function includes a clock enable input buffer, a controller, a clock signal detector, an input/output buffer and a logic circuit. The clock enable input buffer converts the voltage of an externally input clock enable signal to be suitable as an internal signal. The controller receives the output of the clock enable input buffer and a power-down signal and generates a power-down mode signal in response to the power-down signal. The clock signal detector receives a clock signal and enables an output signal when the clock signal is maintained at a constant voltage for a predetermined time. The input/output buffer converts the voltages of input/output signals. The logic circuit receives the power-down mode signal and the output of the clock signal detector, supplies an output to the input/output buffer, and makes the input/output buffer enter a power-down mode if the power-down mode signal is enabled or the output of the clock signal detector is enabled.
Patent TW-410265-B (TW)
Title: Furnace-top preheating equipment
Inventor: NOMURA TAMOTSU
IPC: F27D99/00
Filed: 1998-12-07
Granted: 2000-11-01
Abstract: The present invention relates to a furnace top preheating equipment; that is, the present invention provides a furnace top preheating equipment, which can prevent the phenomenon of metallic scraps being sucked into the exhaust gas duct of the furnace-top preheating device, and, even if part of the metallic scraps being sucked into the exhaust gas duct of the furnace-top preheating device, such metallic scraps can be captured on the uppermost flow portion of the exhaust gas treatment device, and, the phenomenon, so called metallic scraps being deposited in the exhaust gas duct of the lower flow portion, or the metallic wastes being carried into the deodorizing tower, the cooler, or even the dust collecting device, will not occurred. Therefore, the furnace-top preheating equipment can maintain the exhaust gas to flow smoothly, and meanwhile, retain the functions of the deodorizing tower, the cooler, or even the dust collecting device. The furnace-top preheating equipment of the present invention comprises the devices stated below: a preheating device, mounted on the top of melting furnace; and an exhaust gas treatment device, connected to the said preheating device. Furthermore, the furnace-top preheating equipment forms a preheating chamber in the shaft of the furnace top, or forms at least two preheating chambers along the upward and downward directions, meanwhile, the exhaust gas duct provided with a damping device is respectively connected to the upper portion of each shaft wall forming each preheating chamber, and the shaft wall of the lower portion of the lowermost preheating chamber.
Patent TW-429464-B (TW)
Title: Sample separating apparatus and method, and substrate manufacturing method
Inventor: YANAGITA KAZUTAKA
IPC: H01L21/68
Filed: 1998-12-16
Granted: 2001-04-11
Abstract: This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
Patent TW-421723-B (TW)
Title: Optical waveguide substrate mounted structure and method of mounting thereof
Inventor: MOGI HIROSHI
IPC: G02B6/12
Filed: 1998-12-21
Granted: 2001-02-11
Abstract: There is disclosed a mounted structure comprising an optical waveguide substrate mounted on an electric circuit substrate wherein the optical waveguide substrate is mounted on the electric circuit substrate by adhering the optical waveguide substrate on the electric circuit substrate with a liquid silicone rubber. According to the present invention, there is provided an optical waveguide substrate mounted structure and a method of mounting thereof characterized in using an adhesive which has a high heat conductivity and does not extremely change a warp degree in the optical waveguide substrate before and after adhesion when the optical waveguide substrate is adhered on the electric circuit substrate.
Patent TW-519704-B (TW)
Title: Flip chip assembling method and device
Inventor: TANAKA YUJI
IPC: H01L21/60
Filed: 1999-01-28
Granted: 2003-02-01
Abstract: Flip chip assembling method and device are provided. So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate 70 composed of a transparent sheet member and a precision confirmation chip 90 composed of a transparent sheet member are used; and a precision confirmation substrate positioning component 50 for positioning and fixing the precision confirmation substrate is provided on a bonding station 20, the precision confirmation chip 90 is held by suction to a tool and disposed above the precision confirmation substrate 70, images of the precision confirmation substrate 70 and precision confirmation chip 90 are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip 90 is then placed on the precision confirmation substrate 70, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.
Patent TW-409298-B (TW)
Title: Gate structure of semiconductor device and manufacture method thereof
Inventor: HUNG TZUNG-YUAN
IPC: H01L21/28
Filed: 1999-02-05
Granted: 2000-10-21
Abstract: A gate structure of semiconductor device and manufacture method thereof used in the manufacture process with auto-alignment metal silicide, wherein the gate structure comprises a semiconductor substrate; a gate structure placed upon the semiconductor substrate, and the gate structure further comprising a gate oxide layer and a gate electrode which are formed on the semiconductor substrate; a lining oxide layer being adjacent to the lateral side of the gate structure; a spacer being adjacent to the other lateral side of the lining oxide layer, in which the top of the spacer is higher than the top of the gate structure, and a groove structure being formed on the spacer and the gate structure; and a self-aligned silicide layer being placed on the gate structure and filled in the groove structure.
Patent TW-420787-B (TW)
Title: Electronic connection unit, for a personal computer, including a connector for a smart card
Inventor: BRICAUD HERVE
IPC: H01R24/62
Filed: 1997-04-15
Granted: 2001-02-01
Abstract: The invention proposes an electronic connection unit (30), in particular for a personal computer, in the general form of a card of the type comprising a shell (32, 34) with upper (32) and lower (34) parallel and opposite plane main walls (44, 46), which, between them, delimit a cavity (48) inside which an intermediate printed-circuit board is arranged, and of the type in which the unit (30) is associated with a connector (64), for connecting a contact card (C) with integrated circuit(s) to the unit, characterized in that the support (66) of the connector is arranged on the upper face (37) of the intermediate board (36), and in that the shell (32) has a slot (80) for insertion or extraction of the card (C) into or from the unit, and in that, when inserted, the card (C) is arranged entirely inside the unit (30).