baber/WOPTO huggingface dataset:
Patent TW-201109139-A (TW)
Title: Robot arm assebly and robot using the same
Inventor: LONG BO
IPC: B25J18/00
Filed: 2009-09-08
Abstract: A robot arm assembly includes a first arm, a second arm rotatably connected to the first arm, and a harmonic driver including a wave generator, a flex spline fitting tightly over the wave generator, and a circular spline. The wave generator and flex spline are placed inside the circular spline, meshing the teeth of the flex spline and circular spline. One of the flex spline and circular spline is fixed to the first arm, and the other one is used to drive the second arm and support the second arm at only one end along a rotating axis thereof. The robot arm assembly described above has a simple structure and can be assembled easily as the second arm is supported in the manner of a cantilever. In addition, the damage of the second arm and the harmonic driver caused by the positional tolerance because of supporting the second arm at two opposite ends can be avoid. The second arm is capable of moving stably via the high torque capability and rigidity of the harmonic driver. A robot employing the robot arm assembly described above is also provided.
Patent TW-201020692-A (TW)
Title: Device for damping vibrations in projection exposure apparatuses for semiconductor lithography
Inventor: KLOESCH PETER
IPC: G03F7/20
Filed: 2009-09-16
Abstract: The invention relates to a changeable assembly for a projection exposure apparatus for semiconductor lithography, which contains at least one damping element. Furthermore, the invention relates to a projection exposure apparatus for semiconductor lithography and to a measuring assembly for a projection exposure apparatus for semiconductor lithography comprising at least one sensor for detecting parameters and vibrations of the projection exposure apparatus, wherein the measuring assembly is embodied in such a way that it can be inserted into an exchange opening, provided for an optical element, in the projection exposure apparatus.
Patent TW-201114645-A (TW)
Title: Standpipe upper cover and manufacturing method thereof
Inventor: Zhang shi-jie
IPC: B21K1/14
Filed: 2009-10-20
Abstract: The invention is an integrated standpipe upper cover which is provided with a fitting cylinder with a smaller diameter at a lower portion of a cover main body so that a circular shoulder that is outwardly expanded is formed at a top of the fitting cylinder while a cylinder is downwardly extended from a bottom of the fitting cylinder. The cylinder has a downward sink hole with hollow. A screw head hole coaxially communicated with the sink hole passes through the cover main body, and a cross-section cavity is disposed on the cylinder to form a wedge portion. Its manufacturing steps comprises: (A) preparing a metal rod material with a predetermined shape and weight; (B) cold-forging a sink hole at a center of the bottom of the rod material; (C) gradually shaping the diameter and the depth of the sink hole through continuous cold-forging to form a downward cylinder with hollow and cold-forging the wedge portion at the cylinder in order; (D) shaping the sink hole, the wedge portion and recessing an auxiliary hole with reduced neck at the top of the sink hole and shaping the fitting cylinder and the circular shoulder; and (E) cold-forging a screw head hole at the top of the cover main body to cover the auxiliary hole coaxially passing through the sink hole. The standpipe upper cover is automatically manufactured through the gradual cold-forging. Its whole precision, mechanical property and the assembly strength are quite excellent, and the feature of reducing production cost can be achieved.
Patent TW-201113942-A (TW)
Title: Wafer back side grinding process
Inventor: CHEN JEN-CHUNG
IPC: H01L21/304
Filed: 2009-11-16
Abstract: A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. The first and second assemblies are bounded together with at least one hot melt adhesive layer between active surface of the first and second semiconductor wafers. A first back side of the first semiconductor wafer is grinded by using the second assembly as a carrier. Thereafter, a second back side of the second semiconductor wafer is grinded.
Patent TW-201025073-A (TW)
Title: Image-based human iteractive proofs
Inventor: CHICKERING DAVID M
IPC: G06F21/24
Filed: 2009-11-18
Abstract: This document describes image-based human interactive proofs (HIPs). In some cases these proofs may be used when a browser at a client is used to access resources from a web server. Before access to the resources is enabled, the client can be challenged by the web server with an image-based puzzle. The image-based puzzle is configured to enable distinctions to be made between human input and non-human input. Input to answer the image-based puzzle can be formed via the client and communicated to the web server. The web server receives the input from the client and selectively enables client access to the resources based upon the input. In at least some embodiments, the web server can make use of a community database that stores client answers to image-based puzzles to assist in distinguishing between human input and non-human input.
Patent TW-201034689-A (TW)
Title: CA-IX specific radiopharmaceuticals for the treatment and imaging of cancer
Inventor: BABICH JOHN W
IPC: A61K103/32
Filed: 2009-12-04
Abstract: A compound that recognizes and binds to the CA-IX protein has Formula I, II, III, or IV. The compounds may include a radioactive element for radioimaging or therapeutic applications. Thus, pharmaceutical compositions may be prepared with one or more of the compounds of Formula I, II, III, or IV.
Patent TW-201129967-A (TW)
Title: Method and apparatus for compression or decompression of digital signals
Inventor: RYU SANG-UK
IPC: G10L19/00
Filed: 2010-01-22
Abstract: The subject matter disclosed herein relates generally to a system and method for linear prediction of sample values.
Patent TW-201101713-A (TW)
Title: Adjustable receive filter
Inventor: RAJKOTIA AMOL
IPC: H04B1/00
Filed: 2010-02-04
Abstract: An adjustable filter is responsive to a control signal to change a frequency response of the adjustable filter based on at least one of a geographic location, frequency spectrum information, and a status of a secondary internal radio. The control signal may shift a center of the pass band from a first center frequency to a second center frequency and/or change a pass band bandwidth from a first bandwidth to a second bandwidth. A receiver includes an adjustable filter responsive to a control signal and controller configured to select a frequency response of the adjustable filter by generating the control signal based on a geographical location. In one aspect the geographical location indicates a region of operation of the receiver and the frequency response is selected in accordance with the region.
Patent TW-201032328-A (TW)
Title: Gallium nitride heterojunction schottky diode
Inventor: ZHU TINGGANG
IPC: H01L29/872
Filed: 2010-02-10
Abstract: A gallium nitride based semiconductor diode includes a substrate, a GaN layer formed on the substrate, an AlGaN layer formed on the GaN layer where the GaN layer and the AlGaN layer forms a cathode region of the diode, a metal layer formed on the AlGaN layer forming a Schottky junction therewith where the metal layer forms an anode electrode of the diode, and a high barrier region formed in the top surface of the AlGaN layer and positioned under an edge of the metal layer. The high barrier region has a higher bandgap energy than the AlGaN layer or being more resistive than the AlGaN layer.
Patent TW-201131326-A (TW)
Title: Machine authorization system by dynamically control rule setting
Inventor: HUANG SHIH-CHANG
IPC: G05B19/418
Filed: 2010-03-01
Abstract: A machine authorization system by dynamically control rule setting comprises a recipe management system (RMS), a web GUI and a plurality of machine control interfaces. The RMS includes an application server for transferring recipe files and a database in which plural kinds of control conditions are stored, wherein the control conditions are stored in the form of rule basic elements. The web GUI is configured for remotely and dynamically setting modular control rules to save in the database where each modular control rule is a combination consisting of two or more rule basic elements. Additionally, the application server select corresponding recipe files according to the modular control rules and authorize the machine control interfaces in keeping with the rules to control machines. Accordingly, user can dynamically set control rules exclusive for machines according to product property.
Patent TW-201104743-A (TW)
Title: Substrate processing method
Inventor: KONDO TAKASHI
IPC: H01L21/3065
Filed: 2010-03-04
Abstract: A substrate processing method is provided to process a substrate having a structure in which a lower photoresist layer, a hard mask layer containing silicon, and an upper photoresist layer are sequentially formed on a target layer to be processed. The substrate processing method includes reducing by using a plasma a width of a first opening formed in the upper photoresist layer, so that the hard mask layer is exposed; reducing by using a plasma a width of a second opening formed in the hard mask layer through the first opening having the reduced width so that the lower photoresist layer is exposed; forming a third opening through the second opening having the reduced width so that the target layer is exposed; and a third width reducing step of reducing a width of the third opening by using a plasma.
Patent TW-201131144-A (TW)
Title: Optical sensing device with rotating type shading assembly
Inventor: FENG CHUNG-PING
IPC: G01C9/00
Filed: 2010-03-05
Abstract: An optical sensing device comprises a shell, at least one light emitting member, a rotating type shading assembly and at least one optical sensing member. The shell is formed with a black-body condition space having a light emitting chamber, a shading chamber and at least one optical sensing chamber. The light emitting member projects a light beam. The rotating type shading assembly comprises a pivot and a shading member. The shading member is pivotally connected to the pivot in the shading chamber, and has a weight center offset from the pivot center. When the optical sensing device is tilted, the shading member is rotated to make the weight center located in a lowering azimuth with respect to the pivot. The optical sensing member is arranged in the optical sensing chamber, and senses the light beam to accordingly send out a sensing signal.
Patent TW-201042400-A (TW)
Title: Optical integrator, optical lighting system, exposure device, and device production method
Inventor: KAWABE YOSHIO
IPC: G03F7/20
Filed: 2010-03-10
Abstract: An optical integrator used in an optical lighting system, which illuminates illuminated surfaces with light from a light source, includes a first fly-eye optical system having several first optical components (61a, 61b, 61c) arranged in parallel at a position optically conjugated with the illuminated surfaces on optical routes between the light source and the illuminated surfaces; and a second fly-eye optical system having several second optical components arranged in parallel so as to correspond to the several first optical components on the optical routes between the first fly-eye optical system and the illuminated surfaces. At least one first optical component of the several first optical components and other first optical components that are different from the at least one first optical component have different optical axes in the optical lighting system and different postures around an axis parallel to the optical axes.
Patent TW-201041918-A (TW)
Title: Polymer, an organic thin film using such polymer, and an organic thin film element having such organic thin film
Inventor: IE YUTAKA
IPC: H01L51/42
Filed: 2010-03-11
Abstract: This invention provides a polymer which exhibits a low LUMO and a high electron transmission, and which also exhibits a high solubility in solvents, the polymer having a repeating unit represented by the following formula (1): wherein Ar0 represents and aryl ring which may have a substituent, or a heterocyclic ring which may have a substituent; X1 and X2 may be the same or different, and represent an oxygen atom or a sulfur atom.
Patent TW-201137640-A (TW)
Title: Text classification method and system
Inventor: SUN XIANG
IPC: G06F17/30
Filed: 2010-04-23
Abstract: The present invention discloses a text classification method and system for realizing classification of text and improving accuracy of classification and simplification of process. The method comprises: performing term separation on received text contents to obtain a plurality of vocabularies; identifying vocabulary vector sum of the plurality of vocabularies obtained in a first level vector space of a vector space group, wherein the vector space is formed directly from child categories of non-leaf categories of a tree-shaped category structure, the vector space group is composed of the vector spaces, the first-level vector space is constituted by the topmost level category of the tree-shaped category structure, and the vocabulary vector comprises term frequency vectors of vocabulary in all categories of the vector space; and classifying the text to the category corresponding to the shortest distance of the distances of all categories in the vocabulary vector and first-level vector space. The present invention also discloses a system for performing the method.
Patent TW-201136585-A (TW)
Title: A compound series is used for enhancing the activities of estrogen-related receptor α (ERR α ) and the use thereof
Inventor: HUANG CHIEN-FU
IPC: C07D307/77
Filed: 2010-04-26
Abstract: A compound series is used for enhancing the activities of estrogen-related receptor α (ERR α). A use of the compound series provides a preparation of the drugs for the treatments of osteoporosis, which are highly potential to moderate the osteoporosis in post-menopausal women.
Patent TW-201140704-A (TW)
Title: Molding method of semiconductor chips
Inventor: YANG KUO-RONG
IPC: H01L21/56
Filed: 2010-05-03
Abstract: Disclosed is a molding method of semiconductor chips. A bottom molding plate having a substrate-accommodating cavity is provided. A substrate carrying with a plurality of chips is placed in the cavity. Granular resin is formed in the cavity by powder spraying. The granular resin is pressed by a leveling plate so that the granular resin has an even and level upper surface but the granular resin is not melted. After removing the leveling plate, the bottom molding plate is transferred into an oven. The granular resin is heated in level state, with no extra pressure and not covering the cavity, so that the granular resin is cured to become a molding compound encapsulating the chips. Accordingly, there can be prevented the occurrences of wire sweep and surface void to improve bad product appearance. Furthermore, production yield is promoted.
Patent TW-201043586-A (TW)
Title: Glass member with sealing material layer, electronic device using same, and manufacturing method thereof
Inventor: KAWANAMI SOHEI
IPC: C03C8/24
Filed: 2010-05-07
Abstract: The purpose of the present invention is to suppress cracking and breaking of a glass substrate and to suppress separation of a thin film that is formed on the surface of the glass substrate, when the glass substrate is subjected to local heat sealing such as laser sealing. Specifically, a glass substrate (3) has a sealing region. The sealing region is provided with a sealing material layer (5) which is composed of a fired layer of a sealing glass material that contains a sealing glass, a low expansion filler and an electromagnetic wave absorbing material. The sealing material layer (5) contains 10-30% by volume of air bubbles, while containing 50-200 ppm by mass of carbon. The glass substrate (3) and a glass substrate (2), which has an element formation region that is provided with an electronic element, are laminated, and then the space between the glass substrates (2, 3) is sealed by melting the sealing material layer (5) by irradiating the sealing material layer (5) with an electromagnetic wave (6) such as laser light.
Patent TW-201143144-A (TW)
Title: Light emitting diode
Inventor: WU PENG-YI
IPC: H01L33/42
Filed: 2010-05-21
Abstract: A light emitting diode (LED) includes a substrate, a buffer layer formed on a surface of the substrate, a N type semiconductor layer formed on the buffer layer, an active layer formed on the N type semiconductor layer, a P type semiconductor layer formed on the active layer, a transparent conductive layer formed on the P type semiconductor layer, a P type contact formed on the transparent conductive layer, and a N type contact formed on the N type semiconductor layer. The P type contact comprises a first P type contact and a second transparent P type contact.
Patent TW-201109249-A (TW)
Title: Film-accommodating cassette for dirtied article
Inventor: OHNISHI ICHIRO
IPC: B65F1/06
Filed: 2010-07-19
Abstract: This invention provides a film-accommodating cassette which can be easily set in a dirtied article treating device and is capable of preventing falling from the device member, the film-accommodating cassette can be made with a reduced cost. The film-accommodating cassette (54) is to be detouchably assembled to a film fixing portion (12) formed on an upper part of a dirtied treating device (41) which accommodates disposed articles. The film-accommodating cassette (54) has a cylindrical tubular core portion (57) which has an upper end forming an opening (16) for dropping dirtied articles, a lower flange (57f) extending radially outwardly from a lower end of the tubular core portion (57) and an upper flange (59) extending radially outwardly from an upper end of the tubular core portion (57) wherein the lower flange (57f) engages with the film fixing portion (12) and has a cassette side fixing portion for connecting the film-accommodating cassette (54) with the film fixing portion (12).
Patent TW-201117691-A (TW)
Title: High impedance electrical connection via
Inventor: WYLAND CHRISTOPHER P
IPC: H03H7/38
Filed: 2010-08-10
Abstract: Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.
Patent TW-201208607-A (TW)
Title: Protection thin film and manufacturing method thereof
Inventor: Chen yu-xiang
IPC: A45D44/22
Filed: 2010-08-18
Abstract: A protection thin film and a manufacturing method thereof are disclosed, the method comprising the steps of: blending a bridging agent and a ceramic powder mainly composed of far infrared-emitting material into a silicon gel; using a compounding process to uniformly blend the ceramic powder into the silicon gel; molding the mixture of the ceramic powder and the silicon gel in a mold so as to bridge the ceramic powder and the silicon gel; and at last removing the resulted thin film formed in the mold to form a protection thin film. Accordingly, in the manufacturing process, the protection thin film can have a reduced defective rate, and production efficiency of the protection thin film can be effectively enhanced. Further, the protection thin film can be repeatedly used and particularly have a far infrared-emitting material up to 15-45% and a preferred far infrared-emitting rate over than 0.8, thereby providing a far-infrared silicon-gel protection thin film with a temperature raise effect better than conventional protection thin films to further obtain an enhanced transdermal transmission performance.
Patent TW-201108571-A (TW)
Title: Motor
Inventor: IIZAWA TAKESHI
IPC: H02K13/00
Filed: 2010-08-31
Abstract: A blush assembly (45) applied to a motor (1) includes a body portion (46) attachable to a lower case (21), and an external connection substrate (50). A pair of brush pieces (47) protrude from a front end of the body portion (46) so as to be in contact with brush slide portions (38a) of commutator segments (38). The external connection substrate (50) has a pair of terminals (48) exposed from a housing (19) and capable of being connected to spring terminals of an apparatus by crimping. The terminals (48) are provided at a rear end of the external connection substrate (50), and protrude from the housing (19) in the radial direction. First connecting portions (51) electrically connected to the brush pieces (47) are provided at a rear end of the body portion (46), and a pair of right and left second connecting portions (52) are provided at a front end of the external connection substrate (50) formed by a flexible substrate.
Patent TW-201133066-A (TW)
Title: Proximity sensing panel
Inventor: CHEN YI-TA
IPC: G06F3/044
Filed: 2010-09-03
Abstract: The disclosure is a proximity sensing panel, which includes a substrate, one or more proximity sensor unit and one or more sensor circuit. The proximity sensor unit is formed on a substrate and outputs the control signal without touching panel for moving object. The proximity sensor unit generates a sense signal for sensing an object. The sense circuit receives the sense signal to generate a control signal.
Patent TW-201211964-A (TW)
Title: Pixel array
Inventor: HSU HUI-TING
IPC: G09F9/30
Filed: 2010-09-08
Abstract: A pixel array having a plurality of pixel sets is provided, and each pixel set includes a first scan line and a second scan line parallel to each other and on a substrate; a data line disposed without parallel to the first and second scan lines; a first active device electrically connected to the first scan line and the data line; a second active device electrically connected to the second scan line and the data line; a first pixel electrode electrically connected to the first active device; a second pixel electrode electrically connected to the second active device, and a gap is between the first pixel electrode and the second pixel electrode; and an auxiliary electrode pattern. The auxiliary electrode pattern has a connecting portion, a first branch portion and a second branch portion. The connecting portion is disposed underneath the gap between the first pixel electrode and the second pixel electrode and overlaps with a portion of the first pixel electrode and a portion of the second pixel electrode. The first portion is connected to the connecting portion and overlaps with a portion of the first pixel electrode. The second portion is connected to the connecting portion and overlaps with a portion of the second pixel electrode.
Patent TW-201120332-A (TW)
Title: Device and method for manufacturing an air spring
Inventor: SLOTS ANTONIE
IPC: B60G11/27
Filed: 2010-09-10
Abstract: Device for manufacturing an air spring on a building drum. The air spring comprises the following components: a first ply, a second ply, an outer cover, and an inner liner. The device comprises: a main conveyor having a drive and a first end oriented towards the building drum and a second end oriented away from the building drum, a first ply unit for placing the first ply on a first ply position on the main conveyor; a second ply unit for placing the second ply on a second ply position on the main conveyor; an outer cover unit for placing the outer cover on an outer cover position on the main conveyor; an inner liner unit for placing the inner liner on an inner liner position on the main conveyor. The distance to the first end of the main conveyor increases in the following order: first ply position, second ply position, outer cover position and inner liner position. A control unit controls the operation of the parts.