Please select the most similar patent number from A, B, C and D. Which number is?
A cooling and ventilation device (10), a cooling hat (20), a cooling shoe and a cooling backpack. The cooling and ventilation device (10) comprises: a housing (100), a ventilation assembly (200), a heat conduction frame (300) and a cooling assembly (400). Two ends of the housing (100) are respectively provided with an air inlet (110) and an air outlet (120). The ventilation assembly (200) is arranged at the position of the air inlet (110), and is used for bringing air into the housing (100). The heat conduction frame (300) is arranged within the housing (100). The cooling assembly (400) comprises semiconductor cooling plates (410) and heat conduction film layers (420), the semiconductor cooling plates (410) being arranged on the heat conduction frame (300), the heat conduction film layers (420) being attached to the side surfaces of the semiconductor cooling plates (410) away from the heat conduction frame (300). When the semiconductor cooling plates (410) are turned on, the sides of the semiconductor cooling plates (410) connected to the heat conduction film layers (420) are cooling ends, and heat in the air entering from the external environment can be absorbed by the heat conduction frame (300) in a rapid and timely manner. Thus, a cooling operation is performed on the air entering from the external environment in a rapid and timely manner, thereby ensuring that an airflow discharged from the air outlet (120) is a cold airflow.
A: A neck-mounted fan, comprising a neck-worn frame, a fan and a cooling component accommodated within the neck-worn frame. An air guiding element is provided within the neck-worn frame. The air guiding element divides the space within the neck-worn frame to form a first air duct and a second air duct. An air outlet is provided on a sidewall of the first air duct. The cooling component is arranged within the second air duct. The cooling component comprises a semiconductor cooling plate. A cold end of the semiconductor cooling plate is attached to a sidewall of the second air duct. The neck-worn frame is provided with cooling holes at the part corresponding to the second air duct. A portion of the airflow produced by the fan is introduced into the first air duct and then blown out from the air outlet, another portion is introduced into the second air duct and then blown out from the cooling holes carrying the heat generated by the cooling component while working.
B: A smart solar cooling and ventilation device, a smart solar cooling hat, a smart solar cooling backpack, and smart power-driven air circulating shoes. The smart solar cooling and ventilation device comprises a solar panel (14), electronic wires (111), a base (19), a cooling means, a bracket (18), and a fan (11). A container is provided on the base (19). A battery and electronic circuits (110) are provided on the bottom of the container, and the triangular bracket (18) is provided in the container. A cooling chamber (17) is provided within the bracket (18), and an electronic cooling part (16) is fixed outside of the bracket (18). A housing (12) is provided on the periphery of the fan (11), the base (19) is arranged at the bottom of the housing (12), and a fine-tunable turning structure (13) is provided at the joint of the housing (12) and the base (19). The cooling and ventilation device can be recharged by using solar energy in a timely manner, and has wide applications in daily life, thereby avoiding inconvenience caused by sweating in hot days.
C: A semiconductor refrigeration electronic icepack comprising an icepack main body (1). A thermally-conductive liquid is provided within the icepack main body (1). Also comprised is an external mobile refrigeration source box (4). The interior of the mobile refrigeration source box (4) is partitioned into a heat-dissipation area and an enclosed refrigeration area by a semiconductor refrigeration plate (7) and a connecting plate connected at two ends of the semiconductor refrigeration plate (7). A heat exchange water-cooling head (5) is arranged on the semiconductor refrigeration plate (7) at the refrigeration area. The thermally-conductive liquid in the icepack main body (1) is connected to the heat exchange water-cooling head (5) via a liquid inlet tube (3) and is connected to a water pump (9) and the heat exchange water-cooling head (5) via a liquid outlet tube (31). A heat sink (8) is arranged on the semiconductor refrigeration plate (7) at the heat-dissipation area. A ventilation hole (10) is provided on a sidewall of the mobile refrigeration source box (4) corresponding to the heat-dissipation area. The semiconductor refrigeration plate (7) and the water pump (9) are provided with a power supply connection cable. The mobile refrigeration source box (4) is convenient to carry. The semiconductor refrigeration plate (7) and the water pump (9) are powered up to allow the refrigeration source box to start working, thereby allowing the thermally-conductive liquid in the icepack main body (1) to exchange heat with the refrigeration plate (7) in the refrigeration source box, thus reducing the temperature of the electronic icepack.
D: An air conditioning indoor unit (10) having an outside air supply, the unit comprising a housing (100) and an outside air device (200). The outside air device (200) is provided at an end portion of a side of the housing (100), and comprises an air inlet module (210) and a fan module (220) in communication with the air inlet module (210). An air inlet cavity (2101) is defined within the air inlet module (210). An air inlet (211) is provided at the bottom and toward the rear of the air inlet module (210), and used to introduce outdoor air into the air inlet cavity (2101). An upper portion of the air inlet cavity (2101) is provided with a thermoelectric cooler (212). A cold side of the thermoelectric cooler (212) is embedded in the air inlet cavity (2101), and a hot side thereof is provided outside of the air inlet cavity (2101) and is connected to a heat sink device. The fan module (220) delivers outside air introduced by the air inlet module (210) into an indoor space. The outside air is cooled before being introduced into the indoor space by means of installing the thermoelectric cooler (212) within the outside air device (200), thereby effectively improving the cooling effect of an air conditioner, and increasing the comfort level of a user during use.
Answer: B