Please select the most similar patent number from A, B, C and D. Which number is?
A diamond single wire electric spark composite machining device, comprising a wire roller drive motor (1); one end of the wire roller drive motor is provided with a wire roller (2), the front end of the wire roller is provided with a pulse power supply (3), the lower end of the wire roller is provided with a cutting head frame (4), the outer surface of the wire roller is provided with a diamond wire (5), the lower end of the cutting head frame is provided with a silicon rod (6), and the lower end of the silicon rod (6) is provided with rod holders (11). Further disclosed is a diamond single wire electric spark composite machining method. By means of providing the pulse power supply, a positive lead wire (13), a negative lead wire (14), and an electric brush (12), traditional electric spark machining and diamond wire cutting techniques are combined to implement electric spark diamond wire composite machining on semiconductor crystalline silicon. On the basis of diamond wire single wire cutting, electric discharge machining is added to improve the machined surface. In addition, pits on the machined surface produced by electric spark machining are beneficial in reducing the work intensity of a subsequent texturing process.
A: A diamond grinding wheel drive mechanism for use in rotary cutting, comprising a base plate (1); the base plate (1) is provided thereon with a first fixing plate (3) and a second fixing plate (4); the first fixing plate (3) is provided with a first mounting plate (5) at a front portion thereof, and the first mounting plate (5) is provided with a first limiting plate (6) at a position on an outer sidewall thereof; the second fixing plate (4) is provided with a second mounting plate (7) at a front portion thereof, and the second mounting plate (7) is provided with a second limiting plate (8) at a position on an outer sidewall thereof; a fixed chassis (11) is provided between the first mounting plate (5) and the second mounting plate (7); a drive motor (12) is provided at a position on one side of the fixed chassis (11), a drive wheel (13) is provided at a position on the other side of the fixed chassis (11); the drive wheel (13) is connected to the drive motor (12) by means of a drive shaft (14), the drive shaft (14) passing through the fixed chassis (11). By means of the drive shaft, the drive motor may control the drive wheel to rotate; and by sleeving a diamond grinding wheel over an outer circumferential surface the drive wheel, it is possible to conveniently drive and control the diamond grinding wheel.
B: Disclosed is a gang saw using a saw blade to cut granite and quartz stone slantwise, comprising a gang saw (1), an electric motor I(3), an electric motor II(4), a stone material rack (5), a base platform (7), wherein the stone material rack (5) is placed in the base platform (7), and the electric motor II(4) rotating clockwise is provided on a front end of the base platform (7); the gang saw (1) is provided above the stone material rack (5), a diamond cutter bit is provided on each saw blade, and the electric motor I(3) is provided on the front end of the gang saw (1); a drain pipe (2) is provided above the gang saw (1). By setting the tilt angle of the gang saw, a huge cutting impact force is generated to facilitate the cutting of rocks with high hardness, and it is convenient to use a large volume of water to timely wash out the debris generated when cutting the stone materials.
C: A machining apparatus for integrated grinding and polishing of diamond, comprising a rack, a base device (1) and a grinding and polishing device (2); the base device (1) comprises a slide base capable of being fed along a Y-axis with respect to the rack and a base (11) capable of being rotatably connected to the slide base around a Z-axis, wherein a clamp (12) capable of clamping diamond (3) is mounted on the base (11); the grinding and polishing device (2) comprises a main shaft arranged along the Z-axis, wherein an inner ring grinding wheel (21) and an outer ring polishing wheel (22) are sleeved on the main shaft, and when the main shaft rotates, the inner ring grinding wheel (21) and the outer ring polishing wheel (22) can be driven to rotate together; and the diamond (3) is ground and polished by means of rotation of the inner ring grinding wheel (21) and the outer ring polishing wheel (22), feeding of the slide base and rotation of the base (11). The machining apparatus can integrate the grinding and polishing of diamond into one process of machining, and the diamond has less surface scratch damage and uniform surface quality. Also provided is a machining method.
D: Disclosed is a method for cutting a silicon rod, comprising: adjusting, during a cutting process, the wire-supply amount and/or feed rate of new wire at different positions of a crystal cross-section, or using a cooling tube (4) to supply cutting fluid to diamond wires and using all the diamond wires to cut a silicon rod (3). A distance between the supply position of the cutting fluid and the edge of the silicon rod is 10-20 mm. Also disclosed is a diamond multi-wire cutting device. The method for cutting silicon rods ensures that the silicon wafers obtained by cutting are of high quality.
Answer: D