Q104 Qualification Test Plan Automotive Grade Level = MSL = Supplier Name: General Specification: AEC-Q104 Rev. - Supplier Code: Supplier Wafer Fabrication: Supplier Part Number: Supplier Wafer Test: Supplier Contact: Supplier Assembly Site: Supplier Family Type: Supplier Final Test Site: Device Description: Supplier Reliability Signature: PPAP Submission Date: Customer Test ID: Reason for Qualification: Customer Part Number: Prepared by Signature: Date: Customer Approval Signature: Date: Test # Reference Test Conditions Lots S.S. Total Results Lot/Pass/Fail Comments: (N/A =Not Applicable) Test Group A – Accelerated Environment Stress Tests PC A1 JESD22 A113 J-STD-020 Preconditioning: (Test @ Rm) SMD only; Moisture Preconditioning for THB/HAST, AC/UHST, TC, & PTC; Peak Reflow Temp = Min. MSL = 3 MSL = THB or HAST A2 JESD22 A101 JESD22 A110 Temperature Humidity Bias: (Test @ Rm/Hot) Highly Accelerated Stress Test: (Test @ Rm/Hot/) of AC or UHST or TH A3 JESD22 A102 JESD22 A118 or JESD22-A101 Autoclave: (Test @ Rm) Unbiased Highly Accelerated Stress Test: (Test @ Rm) Temperature Humidity without Bias: (Test @ Rm) of TC A4 JESD22 A104 Temperature Cycle: (Test @ Hot) of PTC A5 JESD22 A105 Power Temperature Cycle: (Test @ Rm/Hot) of HTSL A6 JESD22 A103 High Temperature Storage Life: (Test @ Rm/Hot) of
Test Group B – Accelerated lifetime simulation tests HTOL B1 JESD22 A108 High Temp Operating Life: (Test @ Rm/Cold/Hot) of ELFR B2 AEC-Q104 Appendix 2 Early Life Failure Rate: (Test @ Rm/Hot) of EDR B3 AEC-Q100-005 NVM Endurance & Data Retention Test: (Test @ Rm/Hot) of TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS WBS C1 AEC-Q100-001 AEC-Q003 Wire Bond Shear Test: (Cpk > 1.67) 30 bonds 5 MCMs Min. bonds of WBP C2 Mil-STD-883, Method 2011 AEC-Q003 Wire Bond Pull: (Cpk > 1.67); Each bonder used 30 bonds 5 MCMs Min. bonds of SD C3 JESD22 B102 JSTD-002D Solderability: (>95% coverage) 8hr steam aging prior to testing of PD C4 JESD22 B100, JESD22 B108 AEC-Q003 Physical Dimensions: (Cpk > 1.67) of SBS C5 AEC-Q100-010 AEC-Q003 Solder Ball Shear: (Cpk > 1.67); 5 balls from min. of 10 MCMs balls balls of LI C6 JESD22 B105 Lead Integrity: (No lead cracking or breaking); only; 10 leads from each of 5 MCMs leads leads of XRAY C7 X-ray: AM C8 Acoustic Microscopy: TEST GROUP D – DIE FABRICATION RELIABILITY TESTS EM D1 JEP001 Electromigration: - - - Data Available TDDB D2 JEP001 Time Dependant Dielectric Breakdown: - - - Data Available
HCI D3 JEP001 Hot Carrier Injection: - - - Data Available NBTI D4 JEP001 Negative Bias Temperature Instability: - - - Data Available SM D5 JEP001 Stress Migration: - - - Data Available TEST GROUP E- ELECTRICAL VERIFICATION TEST E1 User/Supplier Specification Pre and Post Stress Electrical Test: All All All of HBM E2 AEC-Q100-002 ANSI/ESDA/JEDEC JS-001 Electrostatic Discharge, Human Body Model: (Test @ Rm/Hot); (1KV HBM / Class 1C or better) of ESD Level = CDM E3 AEC-Q100-011 ANSI/ESDA/JEDEC JS-002 Electrostatic Discharge, Charged Device Model: (Test @ Rm/Hot); (500V / Class C4A or better) of ESD Level = LU E4 AEC-Q100-004 Latch-Up: (Test @ Rm/Hot) of ED E5 AEC-Q100-009 AEC-Q003 Electrical Distributions: (Test @ Rm/Hot/Cold) (where applicable, Cpk >1.67) of FG E6 AEC-Q100-007 Fault Grading: - - - Fault Grade CHAR E7 AEC-Q003 Characterization: (Test @ Rm/Hot/Cold) - - - EMC E8 SAE J1752/3 Electromagnetic Compatibility (Radiated Emissions) SER E9 JESD89-1 JESD89-2 JESD89-3 Soft Error Rate LF E10 AEC-Q005 Lead (Pb) Free: (see AEC-Q005) - - -
TEST GROUP F – DEFECT SCREENING TESTS PAT F1 AEC-Q001 Process Average Testing: (see AEC-Q001) All All All Reject units outside Avg. SBA F2 AEC-Q002 Statistical Bin/Yield Analysis: (see AEC-Q002) All All All Reject units outside criteria TEST GROUP G – CAVITY MODULE INTEGRITY TESTS MS G1 JESD22 B110 Mechanical Shock: (Test @ Rm) of VFV G2 JESD22 B103 Variable Frequency Vibration: (Test @ Rm) of CA G3 MIL-STD-883 Method 2001 Constant Acceleration: (Test @ Rm) of GFL G4 MIL-STD-883 Method 1014 Gross and Fine Leak: of DROP G5 JESD22-B110 Mechanical Shock Cavity Drop Test: (Test @ Rm) of LT G6 MIL-STD-883 Method 2024 Lid Torque: of DS G7 MIL-STD-883 Method 2019 Die Shear: of IWV G8 MIL-STD-883 Method 1018 Internal Water Vapor: of TEST GROUP H – MODULE SPECIFIC TESTS BLR H1 IPC-9701 Board Level Reliability: of LTSL H2 JESD22 A119 Low Temperature Storage Life: (Test @ Rm/Hot/Cold) of
STEP H3 ISO 16750-4 Start Up and Temperature Steps: of MCM DROP H4 JESD22-B111 MCM Drop Test: of DPA H5 MIL-STD-1580 Destructive Physical Analysis: XRAY H6 X-ray: AM H7 Acoustic Microscopy: