SEMI M74 — Specification for 450 mm Diameter Mechanical Handling Polished Wafers SEMI is developing a Standard for 450 mm Wafer Shipping System intended to be used in conjunction with this Document. ISO ISO 4287 — Geometrical Product Specifications (GPS) – Surface Texture: Profile Method – Terms, Definitions and Surface Texture Parameters ISO/IEC 16022 — Information Technology – International Symbology Specification – Data Matrix Other Documents SEMI AUX016 — List of Carrier Maker Identification Codes NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Terminology Abbreviations and Acronyms 2D — two dimensional BP — bilateral plane CL — center line EE — end effector FOSB — front-opening shipping box FP — facial plane HP — horizontal plane KC — kinematic coupling KCP — kinematic coupling pin OHT — overhead hoist transport RFID — radio frequency identification TIR — total indicator runout Definitions 2D code — a code identifying elements such as maker, model, version and serial number of a 450 FOSB, by using a data matrix ECC200 symbol according to ISO/IEC 16022. 2D code placement area — an area on the door and another area on top of the shell, where a 2D code can be placed. 450 FOSB — used generally as a ‘term’ only within this document to identify the front opening shipping box. Unless otherwise specified, the word ‘shipping box’ or ‘carrier’ used herein means 450 FOSB. bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP), coincident with nominal location of the rear primary kinematic coupling pin (KCP), and midway between the nominal location of the front primary KCPs. [SEMI E154] Carrier-Related Definitions box — a protective portable container for a cassette and/or substrate(s). [SEMI E1.9] carrier — any cassette, box, or pod that is used to transport and store substrates. cassette — an open structure that holds one or more substrates. [SEMI E1.9] pod — a box having a standardized mechanical interface. [SEMI E19]
The info pads and lockout features are end user selectable. See Related Information 1, ¶ R1-3 for an example of how they may be specified. Presence, Placement, Info-Pads and RFID Tag Placement Sensor Pad and Hole Cross-Section Requirement for Radio Frequency Identification (RFID) Tag Placement Volume The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15. SEMI E144 provides specifications for the required elements of RFID tags. RFID Tag Placement Volume Requirement for Carrier Hold-Down Features The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front KCPs. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces at HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z7 joins (with a small but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 and 17. This configuration provides the load port with several options for holding the carrier in place not limited to the following: A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the sloping plane with or without contacting the incline. See Figure 18. Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation. Door opening and closing shall operate correctly with a force of f002 applied to either (each) feature. The carrier must withstand this force without impact on its intended function. The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their carrier design when designing the carrier’s hold down feature. Hold-Down Feature Locations