d. Talks, Abstracts, and Other Professional Papers Presented Articles 1. “Critical Requirement for Next Generation Modeling”, Printed Circuit Design & Manufacture, , June 2007. Refereed Conference Proceedings and Presentations [2015] 2015-1 “A New In-Situ Warpage Measurement of a Wafer with Speckle-Free Digital Image Correlation (DIC) Method,” Yuling Niu, Seungbae Park, and Hohyung Lee, Proc. of 65th ECTC, May 2015. 2015-2 “A Fracture Mechanics Parametric Study of the Cu-Cu Direct Thermo-Compression Bonded Interface Using 2D and 3D Finite Element Method,” Ah-Young Park, Seungbae Park, and Satish Chaparala, Proc. of 65th ECTC, May 2015. [2014] 2014-1 “Comparative Study of Analytical Models to predict Warpage in Microelectronics Packages,” Charandeep Singh, Yeonsung Kim, and Seungbae Park, Proc. of the IMECE 2014, November 2014.. 2014-2 “Validation of Material Constants for Low-Cycle Fatigue Modeling,” Quang Nguyen, Seungbae Park, and Tung Nguyen, Proc. of the IMECE 2014, November 2014. 2014-3 “Characterizations of behavior of actual lead free solder joint for modeling,” Hohyung Lee, Ruiyang Liu, Seungbae Park, and Jae Kwak, Proc. of the IMECE 2014, November 2014. [2013] 2013-1 “TSV and Cu-Cu Direct Bond Wafer and Package-Level Reliability,” K. Hummler, B. Sapp, I. Ali, J.R. Lloyd, S. Kruger and S. Olson, S.B. Park, B. Murray, D. Jung, S. Cain, A. Park, and D. Ferrone, Proc. of 63rd ECTC, June 2013. 2013-2 “Methodology to Evaluate Pre-Applied Underfill Materials with Concurrent Flux Capability for Ultra-Fine Pitch Solder-Based Interconnects,” Sunoo Kim, Seth Kruger, Brian Sapp, and Sitaram Arkalgud, Ho Hyung Lee, and Seungbae Park, Proc. of 63rd ECTC, June 2013.
15. "Effect of Substrate CTE on Solder Ball Reliability of Flip Chip PBGA Package Assembly", B. Han, M. Chopra, S. Park, L. Li, and K. Verma, Surface Mount International Conference, San Jose, CA, September 1996. Invited Talks, etc. “Warpage as an indicator of Reliability”, Key Note Speech, North Atlantic Test Workshop 2015. “Challenges of Packaging When We Move from Ceramic to Organic,” Invited talk, IMAPS Regional Meeting, IBM T.J. Watson Research Center, Yorktown Heights, NY, October 26, 2006. “Grain Formation and Failure of Pb-Free Solders under Thermal Cycling“, Invited talk, International Electronics Packaging Symposium, GE Global Research, Niskayuna, NY, October 23-24, 2006. “Reliability of Pb-Free Solder Interconnects” Invited Seminar Series, Intel, , July 10, 2006. “3D Digital Image Correlation for the Investigation of SAC Solder Grain Stresses“, Invited Seminar, , April 19, 2005. “Reliability Assessment of MEMS and MOEMS Package”, invited seminar, Analog Device, , May 25, 2004. “Shadow Moire vs. Three Dimensional Digital Image Correlation for In-situ Warpage Measurement” JEDEC 14-1 Reliability Committee, Web Conference, December 3, 2003 “Packaging Solution in High Power Laser Application”, Invited Seminar, Corning Inc., , October 1, 2003. “Reliability Impacts of Pb-Free Solders in Chip Interconnects”, invited seminar, , August 19, 2003. “Systematic Reliability Assessment on Electronic Packaging”, Invited Seminar, Teradyne Inc., , August 5, 2003. Panelist for of Technology in Yield Learning Conference, IBM Headquarter, 1998. Invited seminar for Engineering Seminar Series, , , October 1996. Tutorial “Optomechanics Tools for Packaging and Reliability,” ASME InterPACK Conference, July 2011. “Photomechanics in Microelectronics, MEMS, and MOEMS Packaging” in ASME ITHERM Conference 2006, May 2006.
PI, Large Format Digital Correlation Metrology System, simulation & modeling and their Application to Electronic Components including Wafers, Advanced Semiconductor Engineering, 04/13–03/14, $50,000 (100%) PI, Advanced Package and Material Research, Analog Device, 09/13–12/13, $16,500 (100%) PI, Abnormal Signal for MEMS Oscillator, Sands9, 06/12–04/13, $79,500 (100%) PI, Advanced Package and Material Research, Analog Device, 06/12–04/13, $69,500 (100%) PI, Chip-Package Interactions on 3D-IC Learning Vehicle, SEMATECH, 06/12–04/13, $225,025 (34%), Co-PI: B. Murray, B. Sammakia PI, Underfill and Thermal Management, SEMATECH, 06/12–12/12, $75,026 (50%), Co-PI: B. Sammakia Co-PI, Investigations on Direct Copper Bonding as Method of Interconnection for Chip / Wafer Stacking, SEMATECH, 05/12–12/12, $74,004 (33%) PI: J. Cho PI, Impact Response of Substrate, Corning, 11/10–03/12, $74,004 (100%) PI, Investigating Temperature and Time Dependent Stress Relaxation Behavior of MEMS Packages and Packaging Materials, Analog Device, 10/10–11/11, $73,321 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 02/09–01/10, $67,600 (100%) PI, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung, 02/08–11/08, $70,000 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 01/08–12/08, $59,269 (100%) PI, Viscoplastic Material Characterization for MEMS, Analog Device, 09/06–08/07, $59,269 (100%) PI, Development of an Automated, In-situ, and 3-D Nano-Characterization System Using Digital Image Correlation, Intel Corporation, 06/06 – 03/07, $125,000, (100%)