Intel Core i3 是「Core i 品牌」四個子系列之一。

從 Sandy Bridge 微架構開始，Intel 把微架構和代號改成相同名字。



桌上型處理器

Westmere 微架構

"Clarkdale" (32 nm)

Sandy Bridge 微架構

"Sandy Bridge" (32 nm)

Ivy Bridge 微架構

"Ivy Bridge" (22 nm)

Haswell 微架構

"Haswell-DT" (22 nm)

Skylake 微架構

"Skylake-S" (14 nm)

Kaby Lake 微架構

"Kaby Lake-S" (14 nm)

Coffee Lake 微架構

"Coffee Lake-S" (14 nm)

"Coffee Lake-H" (14 nm)

Comet Lake 微架構



移動型處理器

Westmere 微架構（第一代）

"Arrandale" (MCP, 32 nm)


* 所有型號支援: _MMX,SSE,SSE2, SSE3,SSSE3,SSE4.1, SSE4.2, EIST, Intel 64, XD bit, Intel VT-x, 超執行緒，Smart Cache._

* 整合 Intel HD Graphics

Sandy Bridge microarchitecture (2nd generation)

"Sandy Bridge" (32 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider._

* Core i3-2310E, Core i3-2340UE have support for ECC memory.

* Core i3-2310E, Core i3-2330E and Core i3-2340UE do not have support for _Intel Insider_

* Transistors: 624 million

* Die size: 149 mm²

Ivy Bridge microarchitecture (3rd generation)

"Ivy Bridge" (22 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider._

* Core i3-3120ME, i3-3217UE have support for ECC memory.

* Core i3-3120ME, i3-3217UE do not have support for _Intel Insider._

* Core i3-3229Y supports _AES-NI_.

* Die size: 94 mm²

Haswell microarchitecture (4th generation)

"Haswell-MB" (22 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache._

"Haswell-ULT" (SiP, 22 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache._

* Core i3-4010U and higher also support _Intel VT-d_

* Transistors: 1.3 billion

* Die size: 181 mm²

"Haswell-ULX" (SiP, 22 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache._

* Transistors: 1.3 billion

* Die size: 181 mm²

"Haswell-H" (22 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache._

* Transistors: 1.3 billion

* Die size: 181 mm²

* Embedded models support ECC memory

Broadwell microarchitecture (5th generation)

"Broadwell-U" (14 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache_, and configurable TDP (cTDP) down

Skylake microarchitecture (6th generation)

"Skylake-H" (14 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache._

* Transistors: TBD

* Die size: TBD

* Embedded models support ECC memory

"Skylake-U" (14 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache_, and configurable TDP (cTDP) down (except 6006U)

Kaby Lake microarchitecture (7th generation)

"Kaby Lake-H" (14 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache._

* Transistors: TBD

* Die size: TBD

* Embedded models support ECC memory

"Kaby Lake-U" (14 nm)


* 全系列支援指令: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache_, and configurable TDP (cTDP) down.

Ice Lake microarchitecture (10th generation)

Comet Lake microarchitecture (10th generation)

"Comet Lake-U" (dual-core, 14 nm)

"Comet Lake-Y" (dual-core, 14 nm)

Ice Lake 微架構

"Ice Lake-U" (dual-core, 10 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX 指令集， AVX-512, FMA 指令集，英特爾軟體防護擴展，SpeedStep (SST), X86-64, XD bit (an NX 位元 implementation), Intel VT-x, X86 虛擬化，Intel 睿頻加速，超執行緒，AES 指令集，CPU 緩存，深度學習_, and 熱設計功耗 (cTDP).

"Ice Lake-Y" (dual-core, 10 nm)


* All models support: _MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX 指令集， AVX-512, FMA 指令集，英特爾軟體防護擴展，SpeedStep (SST), X86-64, XD bit (an NX 位元 implementation), Intel VT-x, X86 虛擬化，Intel 睿頻加速，超執行緒，AES 指令集，CPU 緩存，深度學習_, and 熱設計功耗 (cTDP) (except 1000NG4).

Willow Cove microarchitecture (11th generation)

"Tiger Lake-UP3" (10 nm SuperFin)


* All models support: _SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane_ memory_, GNA 2.0, IPU6_ (except SRK08)_, TB4_, and configurable TDP (cTDP).

* -RE models support ECC memory.

"Tiger Lake-UP4" (10 nm SuperFin)


* All models support: _SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane_ memory_, GNA 2.0, IPU6, TB4_, and configurable TDP (cTDP).



外部連結


* Intel 產品規格資料庫（頁面存檔備份，存於網際網路檔案館）