yusuke1997/dblp-id-title huggingface dataset:
Junction temperature estimation method for a 600 V, 30A IGBT module during converter operation
Reliability in automotive electronics: a case study applied to diesel engine control
A mid-value select voter
T pattern fuse construction in segment metallized film capacitors based on self-healing characteristics
Real-time soft-error rate measurements: A review
Radiation damages of polycrystalline silicon films and npn Si transistors by high-energy particle irradiation
Time resolved imaging using synchronous picosecond Photoelectric Laser Stimulation
Electrical characterization of aluminium oxide-aluminium thin film composites by impedance spectroscopy
A new approach to the dynamic thermal modelling of semiconductor packages
Metallization of microvias by sputter-deposition
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability
Modeling and simulation of resistivity of nanometer scale copper
Proportional difference estimate method of determining characteristic parameters of normal and log-normal distributions
Study of temperature dependent properties of organic substrate materials
Exploring the use of approximate TMR to mask transient faults in logic with low area overhead
The critical impact of temperature gradients on Pt filament failure
Comparison Between the Behaviour of Punch-Through and Non-Punch-Through Insulated Gate Bipolar Transistors Under High Temperature Reverse Bias Stress
Reliability screening through electrical testing for press-fit alternator power diode in automotive application
Bias-temperature stress of Al on porous low-k dielectrics
A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM Cell
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation
Investigation of diode geometry and metal line pattern for robust ESD protection applications
Some features of degradation in bipolar transistors at different test conditions for total ionizing dose effect
High temperature ageing of microelectronics assemblies with SAC solder joints
Influence of the organic pollution on the reliability of HE9 connectors
Review of bias-temperature instabilities at the III-N/dielectric interface
Vibration fatigue experiments of SMT solder joint
Correlation studies for component level ball impact shear test and board level drop test
System efficient ESD design
Partition-based approach to parametric dynamic compact thermal modeling
Reliability of polycrystalline silicon thin film resistors
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
Carbon-related defects in microelectronics
Microscopic aspects of defect generation in SiO 2
Design and implementation of configurable ESD protection cell for 60-GHz RF circuits in a 65-nm CMOS process
Investigation of STI edge effect on programming disturb in localized charge trapping SONOS flash memory cells
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization
Negative bias temperature instability: What do we understand?
Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP)
Improving the power cycling performance of IGBT modules by plating the emitter contact
Improved low frequency noise characteristics of sub-micron MOSFETs with TaSiN/TiN gate on ALD HfO 2 dielectric
Studying the effects of intermittent faults on a microcontroller
A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles
Asymmetric channel doping profile and temperature reduction influence on the performance of current mirrors implemented with FD SOI nMOSFETs
Simulation of electrical characteristics of InP double-heterojunction bipolar transistors with InGaAsSb base
Time resolved temperature profiles of high power HEMTs by photocurrent spectral analysis
The impact of device width on the variability of post-irradiation leakage currents in 90 and 65 nm CMOS technologies
Reliability aspects of Hf-based capacitors: Breakdown and trapping effects
Efficient algorithms to accurately compute derating factors of digital circuits
Enhancing bondability with coated copper bonding wire
Influence of the lightly doped drain resistance on the worst-case hot-carrier stress condition for NMOS devices
Challenges and opportunity in performance, variability and reliability in sub-45 nm CMOS technologies
Capacitor loss analysis method for power electronics converters
Current conduction mechanism of MIS devices using multidimensional minimization system program
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation
n-Al0.15Ga0.85 N/p-6H-SiC heterostructure and based bipolar transistor
Stress effects of epoxy adhesives on ceramic substrates and magnetics
Lifetime and manufacturability of integrated power electronics
A 2-bit highly scalable nonvolatile memory cell with two electrically isolated charge trapping sites
Accurate modeling of the influence of back gate bias and interface roughness on the threshold voltage of nanoscale DG MOSFETs
Identification of the physical signatures of CDM induced latent defects into a DC-DC converter using low frequency noise measurements
Energy distribution of positive charges in high-k dielectric
Application of simulation-based decision making in product development of an RF module
High performance thermography with InGaAs photon counting camera
Optimisation of silver paste for flexography printing on LTCC substrate
Effect of interface traps for ultra-thin high-k gate dielectric based MIS devices on the capacitance-voltage characteristics
Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules
Swarm intelligence driven design space exploration of optimal k-cycle transient fault secured datapath during high level synthesis based on user power-delay budget
Finite element simulation of package stress in transfer molded MEMS pressure sensors
In the memory of Yisong Dai
Degradation study of single poly radiation sensors by monitoring charge trapping
The effect of image potential on electron transmission and electric current in the direct tunneling regime of ultra-thin MOS structures
Migration issues in sintered-silver die attaches operating at high temperature
Board level reliability of a stacked CSP subjected to cyclic bending
Effect of potting materials on LED bulb's driver temperature
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment
Transient detection in COTS processors using software approach
Thermally driven reliability issues in microelectronic systems: status-quo and challenges
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling
Modeling the behavior of amorphous oxide thin film transistors before and after bias stress
Insulated Cu wire free air ball characterization
Impact of board and component metallizations on microstructure and reliability of lead-free solder joints
Understanding the degradation processes of GaN based LEDs submitted to extremely high current density
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling
Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization
Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices
Analysis of reliability and optimization of ESD protection devices supported by modeling and simulation
High performance electronics in long lifetime, continuous operation, industrial products: The art of balancing conflicting interests
Performance increase of tandem amorphous/microcrystalline Si PV devices under variable illumination and temperature conditions
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags
Microwave Engineering: Concepts and Fundamentals, Ahmad Shahid Khan. CRC Press Taylor & Francis Group, Boca Raton (2014). 800 p., Hardcover, ISBN: 9781466591417
Effect of crystallographic defects on the reverse performance of 4H-SiC JBS diodes
Transient latch-up: experimental analysis and device simulation
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption
Improved performance of nanoscale junctionless transistor based on gate engineering approach
NBT stress-induced degradation and lifetime estimation in p-channel power VDMOSFETs
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions
Impact of gate-to-source/drain misalignments on source-side injection Schottky barrier charge-trapping memory cells evaluated using numerical programming-trapping iterations
Dynamic flow measurements of capillary underfill through a bump array in flip chip package
First principles calculations study of crystallographic orientation effects on SiC/Ti and SiC/Cr interfaces
Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions
To the understanding of the formation of the III-V based droplet epitxial nanorings
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology
Ramped current stress for fast and reliable wafer level reliability monitoring of thin gate oxide reliability
Monolithic integrable capacitive humidity sensing method for material characterization of dielectric thin films
Rail to rail radiation hardened operational amplifier in standard CMOS technology with standard layout techniques
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride
Further improvements of an extended Hakki-Paoli method
Engineering buried oxide in dopant-segregated Schottky barrier SOI MOSFET for nanoscale CMOS circuits
Analysis of etched cantilevers
Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations
Transistor network restructuring against NBTI degradation
A defect-tolerant area-efficient multiplexer for basic blocks in SRAM-based FPGAs
Gallium Artefacts on FIB-milled Silicon Samples
Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters
Package and solder joint reliability analysed by FEM simulation and experiments
Gate charge behaviors in N-channel power VDMOSFETs during HEF and PBT stresses
Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions
An easy-implemented confidence filter for signal processing in the complex electromagnetic environment
Charge induced by ionizing radiation understood as a disturbance in a sliding mode control of dielectric charge
Statistical distributions of row-hammering induced failures in DDR3 components
Efficient implementation of error correction codes in hash tables
Localization of FET Device Performance with Thermal Laser Stimulation
Reliability of vacuum packaged MEMS gyroscopes
Characterization of interface defects related to negative-bias temperature instability in ultrathin plasma-nitrided SiON/Si<1 0 0> systems
Rapid design space exploration by hybrid fuzzy search approach for optimal architecture determination of multi objective computing systems
Novel GaAs enhancement-mode/depletion-mode pHEMTs technology using high-k praseodymium oxide interlayer
A new two-dimensional TCAD model for threshold instability in silicon carbide MOSFETs
The advent of MEMS in space
New structure with SiO 2 -gate-dielectric select gates in vertical-channel three-dimensional (3D) NAND flash memory
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation
Advances in Electronic Testing: Challenges and Methodologies, Dimitris Gizopoulos (Ed.). Springer, Dordrecht (2006), 412 pp., plus XXVI, Hardcover, ISBN: 0-387-29408-2
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests
Study on the RF Sputtered hydrogenated amorphous silicon-germanium thin films
Physical and electrical characteristics of the high-k Nd 2 O 3 polyoxide deposited on polycrystalline silicon
Challenges and developments of copper wire bonding technology
Analysis and modeling of passive device degradation for a long-term electromagnetic emission study of a DC-DC converter
Prototyping of a reliable 3D flexible IC cube package by laser micromachining
Characterisation of embedded filters in advanced printed wiring boards
Deformation and damage of a solder-copper joint
Monitoring fading rate of ultracapacitors using online characterization during power cycling
Thermal simulation of joints with high thermal conductivities for power electronic devices
Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture
Crested barrier in the tunnel stack of non-volatile memories
Effect of wire diameter on the thermosonic bond reliability
Reliability enhancement of digital combinational circuits based on evolutionary approach
Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy
Searching for appropriate humidity accelerated migration reliability tests methods
The roles of dendritic spacings and Ag 3 Sn intermetallics on hardness of the SAC307 solder alloy
Electronic prognostics - A case study using global positioning system (GPS)
Effect of substrate flexibility on solder joint reliability
Reliability comparison of 28V-50V GaN-on-SiC S-band and X-band technologies
From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application
Radiation sensitivity of junctionless double-gate 6T SRAM cells investigated by 3-D numerical simulation
Quality assessment of ZnO-based varistors by 1/f noise
ESD-Induced Circuit Performance Degradation in RFICs
Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study
Effect of electron irradiation on morphological, compositional and electrical properties of nanocluster carbon thin films grown using room temperature based cathodic arc process for large area microelectronics
Long-term reliability of Ti-Pt-Au metallization system for Schottky contact and first-level metallization on SiC MESFET
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes
Microwave effects of UV light exposure of a GaN HEMT: Measurements and model extraction
FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D
Negative bias temperature instability mechanisms in p-channel power VDMOSFETs
Influence of copper on the diffusion length of the minority carriers in devices based on n-type Si/SiO 2
Predicting bond failure after 1.5 ms of bonding, an initial study
Method to extract parameters of power law for nano-scale SiON pMOSFETs under negative bias temperature instability
Effects of hot carrier stress on the RF performance in SOI MOSFETs
Investigation of read disturb in split-gate memory and its feasible solution
AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors
Reliability aware design of low power continuous-time sigma-delta modulator
Developments of new concept analytical instruments for failure analyses of sub-100 nm devices
A testing method for assessing solder joint reliability of FCBGA packages
FPGA-based switch-level fault emulation using module-based dynamic partial reconfiguration
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs
PVTA-aware approximate custom instruction extension technique: A cross-layer approach
SPICE level implementation of physics of filamentation in ESD protection devices
Study on electrostatic discharge (ESD) reliability improvement of ZnO-based multilayered chip varistor(MLV)
A graph based approach for reliability analysis of nano-scale VLSI logic circuits
Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy
Circuit level prediction of device performance degradation due to negative bias temperature stress
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy
High-K dielectrics for inter-poly application in non volatile memories
Integrated power transistor size optimisation
Ball grid array (BGA) solder joint intermittency real-time detection
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
Determination of self-heating and thermal resistance in polycrystalline and bulk silicon resistors by DC measurements
Degradation induced by 2-MeV alpha particles on AlGaN/GaN high electron mobility transistors
Prognostic methodology for remaining useful life estimation of retention loss in nanoscale resistive switching memory
Creation and thermal annealing of interface states induced by uniform or localized injection in 2.3nm thick oxides
Handling of transient and permanent faults in dynamically scheduled super-scalar processors
Electro Optical Terahertz Pulse Reflectometry, a non destructive technique to localize defects on various type of package
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging
Deteriorated radiation effects impact on the characteristics of MOS transistors with multi-finger configuration
CSAM: A clock skew-aware aging mitigation technique
Temperature dependence of the interface state distribution due to hot carrier effect in FinFET device
A percolation study of RTS noise amplitudes in nano-MOSFETs by Monte Carlo simulation
Response surface models for efficient, modular estimation of solder joint reliability in area array packages
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
An efficient adaptive software-implemented technique to detect control-flow errors in multi-core architectures
A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies
Thermo-fluid simulation for the thermal design of the IGBT module in the power conversion system
A gas micropreconcentrator for low level acetone measurements
Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire
Force and collapsed shape of a liquid solder bump under load
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2
Ultra-high-density interconnection technology of three-dimensional packaging
Multi-frequency weak signal detection based on multi-segment cascaded stochastic resonance for rolling bearings
FPGA-based Monte Carlo simulation for fault tree analysis
Failure analysis defect location on a real case 55 nm memory using dynamic power supply emulation
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review
1/f gamma Noise separated from white noise with wavelet denoising
Synthesis creep behavior of Sn63Pb37 under the applied stress and electric current
Drain breakdown voltage: A comparison between junctionless and inversion mode p-channel MOSFETs
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages
Electromigration performance of Through Silicon Via (TSV) - A modeling approach
Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC process
Experience in HBM ESD testing of high pin count devices
Bias temperature instability assessment of n- and p-channel MOS transistors using a polysilicon resistive heated scribe lane test structure
Nanoscale observations of resistive switching high and low conductivity states on TiN/HfO 2 /Pt structures
Transient interferometric mapping of smart power SOI ESD protection devices under TLP and vf-TLP stress
A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs
Recombination current measurements in the space charge region of MOS field-induced pn junctions
On the failure path in shear-tested solder joints
Advanced electrical analysis of embedded memory cells using atomic force probing
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables
Electrical properties of hafnium silicate films obtained from a single-source MOCVD precursor
Extraction of the trap distribution responsible for SILCs in MOS structures from the measurements and simulations of DC and noise properties
3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs
An enhanced MOSFET threshold voltage model for the 6-300 K temperature range
Alloying modification of Sn-Ag-Cu solders by manganese and titanium
Electromigration failure distributions of dual damascene Cu /low - k interconnects
Anisotropic conductive film flip chip joining using thin chips
New conductive thick-film paste based on silver nanopowder for high power and high temperature applications
Influence factors analysis of rail potential in urban rail transit
Assessment methodology of the lateral migration component in data retention of 3D SONOS memories
Strategy for enhancing reliability and lifetime of DC-AC inverters used for wind turbines
Pre-breakdown leakage current fluctuations of thin gate oxide
Dynamic performance of graded channel DG FD SOI n-MOSFETs for minimizing the gate misalignment effect
Analysis of intermittent timing fault vulnerability
Optimization and performance of Al 2 O 3 /GaN metal-oxide-semiconductor structures
Creep as a reliability problem in MEMS
A new two-dimensional analytical subthreshold behavior model for short-channel tri-material gate-stack SOI MOSFET's
Influence of γ-ray total dose radiation effect on the hot carrier gate current of the uniaxial strained Si nano-scale NMOSFET
Investigation on ESD-stressed GaN/InGaN-on-sapphire blue LEDs
Delay fault testing using partial multiple scan chains
Facile chemical method of etching polyimide films for failure analysis (FA) applications and its etching mechanism studies
Assessment of acceleration models used for BGA solder joint reliability studies
Comparative study of reliability degradation behaviors of LDMOS and LDMOS-SCR ESD protection devices
Exciton wavefunction coupled surface plasmon resonance for In-rich InGaN film with perforated aluminum cylindrical micropillar arrays
Analysis of PowerMOSFET chips failed in thermal instability
Read disturb on flash memories: Study on temperature annealing effect
The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems
High temperature bias-stress-induced instability in power trench-gated MOSFETs
Corrigendum to "A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors" [Microelectron. Reliab. 60 (2016) 67-69]
Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact
Study for the non-contact characterization of metallization ageing of power electronic semiconductor devices using the eddy current technique
Impact of the substrate and buffer design on the performance of GaN on Si power HEMTs
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts
Current imaging, EBIC/EBAC, and electrical probing combined for fast and reliable in situ electrical fault isolation
Role of stress voltage on structural degradation of GaN high-electron-mobility transistors