yusuke1997/dblp-id-title huggingface dataset:
Dielectric thinning model applied to metal insulator metal capacitors with Al 2 O 3 dielectric
Phase-change immersion cooling high power light emitting diodes and heat transfer improvement
Effect of nitridation on the reliability of thick gate oxides
Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts
Novel fully silicided ballasting and MFT design techniques for ESD protection in advanced deep sub-micron CMOS technologies
Qualification procedure for moisture in embedded capacitors
Indirect fitting procedure to separate the effects of mobility degradation and source-and-drain resistance in MOSFET parameter extraction
Lock-in thermography for defect localization and thermal characterization for space application
Optimum Si thickness for backside detection of photon emission using Si-CCD
Reliability analysis of UHF RFID tags under long-term mechanical cycling
Failure signatures on 0.25 μm GaN HEMTs for high-power RF applications
High frequency characterization and modelling of the parasitic RC performance of two terminal ESD CMOS protection devices
Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology
Developing the stress-strain curve to failure using mesoscale models parameterized from molecular models
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques
Gate oxide degradation of SiC MOSFET under short-circuit aging tests
Definition of curve fitting parameter to study tunneling and trapping of electrons in Si/ultra-thin SiO 2 /metal structures
A portable high-density absolute-measure NIRS imager for detecting prefrontal lobe activity under fatigue driving
The effect of encapsulant discoloration and delamination on the electrical characteristics of photovoltaic module
Improved charge injection in Si nanocrystal non-volatile memories
Manufacturing capability control for multiple power-distribution switch processes based on modified C pk MPPAC
Thermal impedance measurements under non-equilibrium conditions. How to extend its validity
Physical origin of current collapse in Au-free AlGaN/GaN Schottky Barrier Diodes
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip
Pentacene bottom-contact thin film transistors with solution-processed BZT gate dielectrics
Basic Principles for Managing Foundry Programs
3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
Electromigration reliability of open TSV structures
Design considerations and strategies for high-reliable STT-MRAM
Bias voltage criteria of gate shielding effect for protecting IGBTs from shoot-through phenomena
Effective work function of NiSi/HfO 2 gate stacks measured with X-ray photoelectron spectroscopy
Oxide conductivity increase during the progressive-breakdown of SiO2 gate oxides observed with C-AFM
Quantitative evaluation of bending reliability for a flexible near-field communication tag
Evidence for causality between GaN RF HEMT degradation and the E C -0.57 eV trap in GaN
The coupled effects of salt-spray corrosion, electrical current and mechanical load on the electrical and fatigue properties of COG assembly
Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb
Estimating dynamic power consumption for memristor-based CiM architecture
Impact of substrate resistance and layout on passivation etch-induced wafer arcing and reliability
Characterization of the transient behavior of gated/STI diodes and their associated BJT in the CDM time domain
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
Mechanical loading of flip chip joints before underfill: the impact on yield and reliability
Prediction of cure induced warpage of micro-electronic products
A 3-D Circuit Model to evaluate CDM performance of ICs
Impact of resistive paths on NVM array reliability: Application to Flash & ReRAM memories
Reliability assessment of RFID reader through prognostics and health management
Reliability validation of compound semiconductor foundry processes
Lateral base design rules for optimized low-frequency noise of differentially grown SiGe heterojunction bipolar transistors
Low cost sensor network for obstacle avoidance in share-controlled smart wheelchairs under daily scenarios
Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints
High-voltage pulse stressing of thick-film resistors and noise
A study of ageing effect at elevated temperature of flexible silicon diodes integrated using conductive adhesives
Influence of device geometry on SOI single-hole transistor characteristics
Formation of high resistivity phases of nickel silicide at small area
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments
Thermal management for high-power photonic crystal light emitting diodes
Destruction failure analysis and international reliability test standard for power devices
ZrO 2 insulator modified by a thin Al 2 O 3 film to enhance the performance of InGaZnO thin-film transistor
Degradation testing and failure analysis of DC film capacitors under high humidity conditions
Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading
Electrical properties of SiN x films with embedded CNTs for MEMS capacitive switches
Reliability investigation of large area solder joints in power electronics modules and its simulative representation
Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices
Ageing defect detection on IGBT power modules by artificial training methods based on pattern recognition
Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability
An explanation of the dependence of the effective saturation velocity on gate voltage in sub-0.1 µm metal-oxide-semiconductor transistors by quasi-ballistic transport theory
Transient thermal analysis for accelerated reliability testing of LEDs
Thermal characterization of multicolor LED luminaire
Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments
Particle filter approach to lifetime prediction for microelectronic devices and systems with multiple failure mechanisms
Modeling facet heating in ridge lasers
The transient analysis of latch-up in CMOS transmission gate induced by laser
Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer
Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging
Contact degradation due to material transfer in MEM switches
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
Interfacial fracture toughness of Pb-free solders
HCS degradation of 5 nm oxide high-voltage PLDMOS
A detailed study of current-voltage characteristics in Au/SiO 2 /n-GaAs in wide temperature range
Application of Scanning Probe Microscopy techniques in Semiconductor Failure Analysis
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers
Study of light-induced annealing effects in a-Si: H thin films
A maintenance planning and business case development model for the application of prognostics and health management (PHM) to electronic systems
NBTI degradation effect on advanced-process 45 nm high-k PMOSFETs with geometric and process variations
Effects of the metal gate on the stress-induced traps in Ta 2 O 5 /SiO 2 stacks
Berkovich nanoindentation on single SiGe epitaxial films
Impact of on- and off-chip protection on the transient-induced latch-up sensitivity of CMOS IC
A novel test structure for OxRRAM process variability evaluation
NIR laser stimulation for dynamic timing analysis
Is the power-law model applicable beyond the direct tunneling regime?
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment
Ageing of InGaN-based LEDs: Effects on internal quantum efficiency and role of defects
Electronic properties of a dual-gated GNR-FET under uniaxial tensile strain
Study of Area Scaling Effect on Integrated Circuit Reliability Based on Yield Models
Design space exploration of non-uniform cache access for soft-error vulnerability mitigation
16-Channel micro magnetic flux sensor array for IGBT current distribution measurement
When adequate and predictable reliability is imperative
Hydrogen-related influence of the metallization stack on characteristics and reliability of a trench gate oxide
Power saving modes in modern microcontroller design, diagnostics and reliability
The influence of electroless metallization process parameters on basic electric properties of Ni-P alloy
Effect of solder creep on the reliability of large area die attachment
The impact on power semiconductor device operation due to local electric field alterations in the planar junction termination
Investigation of layout effects in diode-triggered SCRs under very-fast TLP stress through full-size, calibrated 3D TCAD simulation
Simulation of flicker noise in gate-all-around Silicon Nanowire MOSFETs including interface traps
Experimental and comparative study of gamma radiation effects on Si-IGBT and SiC-JFET
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner
Integrated SMD pressure/flow/temperature multisensor for compressed air in LTCC technology: Thermal flow and temperature sensing
DSP based fuzzy and conventional overcurrent relay controller comparisons
Investigation of novel attributes of single halo dual-material double gate MOSFETs for analog/RF applications
Characteristics analysis and optimization design of a new ESD power clamp circuit
Bias temperature instabilities in 4H SiC metal oxide semiconductor field effect transistors: Insight provided by electrically detected magnetic resonance
Nanoelectronic Devices, B.-G. Park, S.W. Hwang, Y.J. Park. Pan Stanford Publishing Pte. Ltd., Singapore (2012). 406 p., ISBN: 978-981-4364-00-3
Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements
Nanoscale structural characteristics and electron field emission properties of transition metal-fullerene compound TiC 60 films
Alpha particle radiation effects in RF MEMS capacitive switches
3D thermal model to investigate component displacement phenomenon during reflow soldering
Integration technology for ferroelectric memory devices
Hot-carrier degradation analysis based on ring oscillators
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations
Improved performance by using TaON/SiO 2 as dual tunnel layer in Charge-Trapping nonvolatile memory
Compact MOS-triggered SCR with faster turn-on speed for ESD protection
Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part II
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
Reducing arbitrary choices in model building for prognostics: An approach by applying parsimony principle on an evolving neuro-fuzzy system
AlGaN/GaN High Electron Mobility Transistor degradation under on- and off-state stress
Investigation of ESD protection strategy in high voltage Bipolar-CMOS-DMOS process
An overview of hot-carrier induced degradation in 0.25 mum Partially and Fully Depleted SOI N-MOSFET's
Simulation based analysis of secondary effects on solder fatigue
Numerical analysis and experimental tests for solder joints power cycling optimization
LED degradation: From component to system
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride
Performance assessment of the NIRS-based medical system of evaluating therapeutic effect
Experimental analysis of electro-thermal instability in SiC Power MOSFETs
Dynamical IMC-growth calculation
A New sub-micro probing technique for failure analysis in integrated circuits
Experimental investigation on the performance of CPU coolers: Effect of heat pipe inclination angle and the use of nanofluids
Determination of the stress level for voltage screen of integrated circuits
Reliability and optical properties of LED lens plates under high temperature stress
Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment
Optimization of ESD protection structures suitable for BCD6 smart power technology
Simulation of transient thermal states in layered electronic microstructures
Refined NBTI characterization of arbitrarily stressed PMOS devices at ultra-low and unique temperatures
Quasi hermetic packaging for new generation of spaceborn microwave equipment
Metal gates and gate-deposition-induced defects in Ta 2 O 5 stack capacitors
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses
Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology
A fast fault injection platform of multiple SEUs for SRAM-based FPGAs
Modelling negative bias temperature instabilities in advanced p-MOSFETs
Physically-based extraction methodology for accurate MOSFET degradation assessment
Enhanced thermal characterization method of microscale heatsink structures
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures
Extraction of dynamic avalanche during IGBT turn off
Microscale temperature sensing using novel reliable silicon vertical microprobe array: Computation and experiment
Impact of the gate driver voltage on temperature sensitive electrical parameters for condition monitoring of SiC power MOSFETs
Optical interaction in active analog circuit elements
A closed-form trapped-charge-included drain current compact model for amorphous oxide semiconductor thin-film transistors
Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications
Saint-Venant's principle and the minimum length of a dual-coated optical fiber specimen in reliability (proof) testing
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test
Failure-mechanism analysis for vertical high-power LEDs under external pressure
The effect of die attach voiding on the thermal resistance of chip level packages
Theoretical Investigation of an Equivalent Laser LET
Impact of endurance degradation on the programming efficiency and the energy consumption of NOR flash memories
A domain decomposition method for the simulation of fracture in polysilicon MEMS
Time dependent dielectric breakdown in a low-k interlevel dielectric
New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au 4 Al
Thermal simulation of UV laser ablation of polyimide
Long-term NBTI degradation under real-use conditions in IBM microprocessors
Effects of finger dimension on low-frequency noise and optoelectronic properties of Ge metal-semiconductor-metal photodetectors with interdigitated Pt finger electrodes
Influence of ISSG tunnel oxide with decoupled plasma nitridation on erase characteristic of NOR-type floating-gate flash memories
Low-voltage triggering SCRs for ESD protection in a 0.35 μm SiGe BiCMOS process
The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
Optimized semi-sphere lens design for high power LED package
Advanced X-ray analysis techniques to investigate aging of micromachined silicon actuators for space application
Thermal resistance of side by side multi-chip package: Thermal mode analysis
Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses
W doping effect on the dielectric properties of amorphous Ga 2 O 3 films grown on Si substrate for low-k applications
Leaky modes of optical waveguides with varied refractive index for microchip optical interconnect applications - Asymptotic solutions
Power estimation and optimization for VLIW-based embedded systems; Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano. Hardcover, pp 203, plus XXIV, Kluwer Academic Publishers, Boston, 2003. ISBN 1-4020-7377-1
Voltage stress effect on class AB power amplifier and mixed-signal sample-hold circuit
Junction leakage current degradation under high temperature reverse-bias stress induced by band-defect-band tunnelling in power VDMOS
Single contact beam induced current phenomenon for microelectronic failure analysis
Intermittent-contact scanning capacitance microscopy versus contact mode SCM applied to 2D dopant profiling
A new on-chip test structure for real time fatigue analysis in polysilicon MEMS
Reliability tests on WDM filters
Adaptive error correction in Orthogonal Latin Square Codes for low-power, resilient on-chip interconnection network
Study of the UBM to copper interface robustness of solder bumps in flip chip packages
Miniaturised multi-MEMS sensor development
Thickness and temperature dependence of the leakage current in hafnium-based Si SOI MOSFETs
Analysis of interior degradation of a laser waveguide using an OBIC monitor
Novel wire bond material for advanced power module packages
Behavior of Cu(In, Ga)Se 2 solar cells under light/damp heat over time
Reliability of ultrathin nitrided oxides grown in low pressure N 2 O ambient
On-chip system level protection of FM antenna pin with improved linearity
Reliability enhancement of zinc oxide varistors using sputtered silver electrodes
A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verification
Prognostics implementation of electronics under vibration loading
Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects
A review of pulsed NBTI in P-channel power VDMOSFETs
Reliable CMOS adaptive equalizer for short-haul optical networks
On the reliability assessment of trench fieldstop IGBT under atmospheric neutron spectrum
Feasibility study of non-conductive film (NCF) for plasma display panel (PDP) application
Degradation of InGaN-based MQW solar cells under 405 nm laser excitation
A generalized model for the lifetime of microelectronic components, applied to storage conditions
SCR-based transient detection circuit for on-chip protection design against system-level electrical transient disturbance
Using EWMA control schemes for monitoring wafer quality in negative binomial process
Investigation on CDM ESD events at core circuits in a 65-nm CMOS process
A novel method to measure the internal pressure of MEMS thin-film packages
Kelvin probe microscopy for reliability investigation of RF-MEMS capacitive switches
Networks on Chip; Axel Jantsch, Hannu Tenhunen (Eds.). Kluwer Academic Publishers, Boston; 2003. Hardcover, pp 303, plus VIII, ISBN 1-4020-7392-5
Overcoming Fault Test Coverage with Time-Resolved Emission (TRE) Probing
Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions
Chemical vapor deposition of tantalum nitride films for metal gate application using TBTDET and novel single-source MOCVD precursors
Using a new bathtub curve to correlate quality and reliability
Acoustic analysis of an assembly: Structural identification by signal processing (wavelets)
Implications of electron beam irradiation on Al/n-Si Schottky junction properties
Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors
Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module
An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires
Hot carrier and PBTI induced degradation in silicon nanowire gate-all-around SONOS MOSFETs
Radiation effects in nitride read-only memories
Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources
Field failure mechanism and improvement of EOS failure of integrated IGBT inverter modules
Monitoring of aging in integrated circuits by identifying possible critical paths
Testing method for measuring corrosion resistance of surface mount chip resistors
Identification of an RF degradation mechanism in GaN based HEMTs triggered by midgap traps
Electrical characterization of MS and MIS structures on AlGaN/AlN/GaN heterostructures
Molecular simulation on the material/interfacial strength of the low-dielectric materials
Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules
A method to protect Cuckoo filters from soft errors
Effect of contact-etch-stop-layer and Si 1-x Ge x channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays
Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language
The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics
Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast
Using neural networks as a fault detection mechanism in MEMS devices
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs
Application of Scanning Microwave Microscopy nano-C-V to investigate dopant defect under a poly gate device
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
Reliability of Medium Blocking Voltage Power VDMOSFET in Radiation Environment
Time-dependent dielectric breakdown of SiO 2 films in a wide electric field range
New dynamic electro-thermo-optical model of power LEDs
Piezoelectric polymer films as power converters for human powered electronics
Reliability estimation of aeronautic component by accelerated tests
Backend dielectric reliability simulator for microprocessor system
Early life field failures in modern automotive electronics - An overview; root causes and precautions
Total ionizing dose sensitivity of function blocks in FRAM
Forecasting electronic part procurement lifetimes to enable the management of DMSMS obsolescence
Photosensitivity n-channel ZnO phototransistor for optoelectronic applications: Modeling of ZnO TFT
Novel techniques for dopant contrast analysis on real IC structures
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys
A complete methodology for assessing GaN behaviour for military applications
Modeling and analysis of gate-all-around silicon nanowire FET
X-ray and UV controlled adjustment of MOS VLSI circuits threshold voltages
An investigation on the influence of electromagnetic interference induced in conducting wire of universal LEDs
Electrical properties of metal-HfO 2 -silicon system measured from metal-insulator-semiconductor capacitors and metal-insulator-semiconductor field-effect transistors using HfO 2 gate dielectric
A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors
Fault localization of a switched mode power supply based on extended integer-coded dictionary method
TLP analysis of 0.125 mum CMOS ESD input protection circuit
Protrusion of electroplated copper filled in through silicon vias during annealing process
A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation
Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses