yusuke1997/dblp-id-title huggingface dataset:
Influence of substrate thickness on thermal impedance of microelectronic structures
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis
Reliability challenges in the nanoelectronics era
Experimental study of filling behaviors in the underfill encapsulation of a flip-chip
Delamination of polyimide/Cu films under mixed mode loading
Recovery behaviors in n-channel LTPS-TFTs under DC stress
Prognostics of Li(NiMnCo)O 2 -based lithium-ion batteries using a novel battery degradation model
Electromechanical controlled phased array dumbbell EBG beam steerer
Exploration of robustness limits and ESD EMI impact in a protection device for advanced CMOS technology
IGBT chip current imaging system by scanning local magnetic field
Degradation mechanism understanding of NLDEMOS SOI in RF applications
Modeling and analysis of crosstalk induced overshoot/undershoot effects in multilayer graphene nanoribbon interconnects and its impact on gate oxide reliability
Hydrogen passivation effects under negative bias temperature instability stress in metal/silicon-oxide/silicon-nitride/silicon-oxide/silicon capacitors for flash memories
Determination of GaN HEMT reliability by monitoring I DSS
Design and optimization of LDMOS-SCR devices with improved ESD protection performance
A pragmatic methodology for the monitoring of the electronic components ageing: The case of power thyristors at EDF
Degradation behavior in upstream/downstream via test structures
Temperature dependence of neutron-induced soft errors in SRAMs
Oxide reliability below 3 nm for advanced CMOS: Issues, characterization, and solutions
Perspective of flash memory realized on vertical Si nanowires
Towards the CFD model of flow rate dependent enzyme-substrate reactions in nanoparticle filled flow microreactors
Subthreshold parameters of radio-frequency multi-finger nanometer MOS transistors
Multichannel mixed-mode IC for digital readout of silicon strip detectors
The effects of 12 MeV electron irradiation on the electrical characteristics of the Au/Aniline blue/p-Si/Al device
Investigation of relation between intermetallic and tin whisker growths under ambient condition
Test generation for technology-specific multi-faults based on detectable perturbations
Adaptive fault-tolerant DVFS with dynamic online AVF prediction
PVT variations aware low leakage INDEP approach for nanoscale CMOS circuits
Influence of gate length on ESD-performance for deep submicron CMOS technology
Development of highly accelerated electromigration test
Damage effects on low noise amplifiers with microwave pulses
Optical characterization of Si-rich silicon nitride films prepared by low pressure chemical vapor deposition
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion
Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
Prediction of LIN communication robustness against EFT events using dedicated failure models
Body diode reliability investigation of SiC power MOSFETs
Reliability concerns from the gray market
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact
AlGaN/GaN HEMT device reliability and degradation evolution: Importance of diffusion processes
Effects of the compositional ratios of sputtering target on the device performance and instability in amorphous InGaZnO thin film transistors
A fusion prognostics-based qualification test methodology for microelectronic products
A new structure to monitor electrical transients during programming of EEPROM memory cells
Low frequency noise as a tool to study optocouplers with phototransistors
Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics
Diagnosis of fully differential circuits based on a fault dictionary implemented in the microcontroller systems
Determination of the ESD Failure Cause Through its Signature
Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue
Electrical and thermal failure modes of 600 V p-gate GaN HEMTs
[131] Experimental study of the short-circuit robustness of 600 V E-mode GaN transistors
Silicon integrated photonics begins to revolutionize
Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards
Analysis of quantum conductance, read disturb and switching statistics in HfO 2 RRAM using conductive AFM
Stability of the warpage in a PBGA package subjected to hygro-thermal loading
Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis
Comprehensive reliability and aging analysis on SRAMs within microprocessor systems
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Thermal measurements and analyses of low-cost high-power LED packages and their modules
Reliability and defectivity comparison of n- and p-channel SLS ELA polysilicon TFTs fabricated with a novel crystallization technique
Off-state breakdown and leakage current transport analysis of AlGaN/GaN high electron mobility transistors
Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation
Designing for reliability using a new Wafer Level Package structure
Fabrication process simulation and reliability improvement of high-brightness LEDs
Microcontroller susceptibility variations to EFT burst during accelerated aging
Investigation of Tunnel-Regenerated Multi-Active-Region Light-Emitting Diodes (TRMAR LED) by Scanning Thermal Microscopy (STHM)
Defect-centric perspective of time-dependent BTI variability
Dielectric breakdown distributions for void containing silicon substrates
Joseph D. Dumas II, Computer Architecture: Fundamentals and Principles of Computer Design , CRC Press an imprint of Taylor & Francis Group, Boca Raton (2006) ISBN 0-849-32749-0 Hardcover, pp 372, plus XVI
Implementation of direct Chip junction temperature measurement in high power IGBT module in operation - Railway traction converter
Laser Seebeck Effect Imaging (SEI) and Peltier Effect Imaging (PEI): complementary investigation methods
Optimized parallel decoding of difference set codes for high speed memories
Temperature dependence of electrical parameters of SMD ferrite components for EMI suppression
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method
Symmetrical ESD protection for advanced CMOS technology dedicated to 100 GHz RF application
Introduction to special section on electronic systems prognostics and health management
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging
Reliability improvement of automotive electronics based on environmental stress screen methodology
Charging of radiation induced defects in RF MEMS dielectric films
Comparison of analytic distribution function models for hot-carrier degradation modeling in nLDMOSFETs
Size and constraint effects on interfacial fracture behavior of microscale solder interconnects
Ruggedness of 1200 V SiC MPS diodes
Experimental tests and reliability assessment of electronic ballast system
Failure analysis of micro-heating elements suspended on thin membranes
Evaluating the reliability of a GPU pipeline to SEU and the impacts of software-based and hardware-based fault tolerance techniques
Characterisation and modelling of parasitic effects and failure mechanisms in AlGaN/GaN HEMTs
Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition
Correlation between X-ray micro-diffraction and a developed analytical model to measure the residual stresses in suspended structures in MEMS
Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
On improving training time of neural networks in mixed signal circuit fault diagnosis applications
Reading distance degradation mechanisms of near-field RFID devices
Reliability of SnPb and Pb-free flip-chips under different test conditions
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications
Improving the deflection of wire bonds in stacked chip scale package (CSP)
Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions
Evaluation of gate oxide breakdown effect on cascode class E power amplifier performance
Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods
CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing
Microchannel fabrication process in LTCC ceramics
The use of Mahalanobis-Taguchi System to improve flip-chip bumping height inspection efficiency
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics
Measurement of high electrical current density effects in solder joints
Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses
Life cycle cost impact of using prognostic health management (PHM) for helicopter avionics
A study of metamorphic HEMT technological improvements: Impact on parasitic effect electrical models
Statistical aspects of reliability in bulk MOSFETs with multiple defect states and random discrete dopants
Flip-chip packaging solution for CMOS image sensor device
A reverse hysteresis effect of graphene transistors with amorphous silicon gate dielectric
Transient interferometric mapping of carrier plasma during external transient latch-up phenomena in latch-up test structures and I/O cells processed in CMOS technology
Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests
Switch-level emulation of strength-base soft error detection
Operation of SiC normally-off JFET at the edges of its safe operating area
A calculation method to estimate single event upset cross section
The reliability of component boards studied with different shock impact repetition frequencies
Reliability results of HBTs with an InGaP emitter
100 mum Pitch flip chip on foil assemblies with adhesive interconnections
Signal noise perturbation on automotive mixed-mode semiconductor device generated by graded substrate defect
Elimination of surface state induced edge transistors in high voltage NMOSFETs for flash memory devices
On the temperature and voltage dependence of short-term negative bias temperature stress
The influence of p-polysilicon gate doping on the dielectric breakdown of PMOS devices
Impact of PVT variability on 20 nm FinFET standard cells
Fatigue life and resistance analysis of COG assemblies under hygrothermal aging
Prediction of Delamination Related IC & Packaging Reliability Problems
Modeling bimodal electromigration failure distributions
High-precision Berenger modes of dual-layer micro-waveguides terminated with a perfectly matched layer for on-chip optical interconnections
New considerations for MOSFET power clamps
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies
10th Electron Technology ELTE 2010 and 34th International Microelectronics and Packaging IMAPS/CPMT Poland Joint Conference - Guest Editorial
Structural advantages of rectangular-like channel cross-section on electrical characteristics of silicon nanowire field-effect transistors
Impact of gate oxide nitridation process on 1/f noise in 0.18 mum CMOS
Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5-2 nm thick gate-oxides
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging
Determining DC/RF survivability limits of GaAs semiconductor circuits
Reliability Investigation of Gallium Nitride HEMT
A highly reliable NBTI Resilient 6T SRAM cell
Influence of rapid thermal annealing temperature on structure and electrical properties of high permittivity HfTiO thin film used in MOSFET
Effect of microwave annealing on SOI MOSFETs: Post-metal annealing with low thermal budget
Reliability study of package-on-package stacking assembly under vibration loading
Exact analytical model of single electron transistor for practical IC design
Influence of the surrounding ambient on the reliability of the electrical characterization of thin oxide layers using an atomic force microscope
A lightweight write-assist scheme for reduced RRAM variability and power
A new technique for contactless current contrast imaging of high frequency signals
Erratum to "Determining factors affecting ESD failure voltage using DOE" [Microelectron. Reliability 46 (2006) 1228-1237]
Forensic characterization of thin film resistor degradation
Advances in ESD protection for ICs
Quantitative correlation between Flash and equivalent transistor for endurance electrical parameters extraction
Detection of failure mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera
Module packaging effects on MEMS airbag sensor performance for automobiles
Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
Subthreshold analog/RF performance of underlap DG FETs with asymmetric source/drain extensions
Effects of thermal and electrical stress on DH4T-based organic thin-film-transistors with PMMA gate dielectrics
A methodology for accelerated testing by mechanical actuation of MEMS devices
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation
Experimental study of WL-CSP reliability subjected to a four-point bend-test
Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu
High Electric Field Induced Degradation of the DC Characteristics in Si/SiGe HEMT's
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies
Modeling and simulation of the charge trapping component of BTI and RTS
Interface traps effect on the charge transport mechanisms in metal oxide semiconductor structures based on silicon nanocrystals
Compliance analysis of multi-path fan-shaped interconnects
Compact modeling and simulation of Random Telegraph Noise under non-stationary conditions in the presence of random dopants
Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks
Long Term Stability of InGaAs/AlInAs/GaAs Methamorphic HEMTs
Novel digitally programmable multiphase voltage controlled oscillator and its stability discussion
Testing process performance based on the yield: an application to the liquid-crystal display module
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system
The sensitivity of radiation-induced leakage to STI topology and sidewall doping
Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease
New concepts of worst-case delay and yield estimation in asynchronous VLSI circuits
Impact of device geometry and doping strategy on linearity and RF performance in Si/SiGe MODFETs
Electro-thermal simulation of current sharing in silicon and silicon carbide power modules under short circuit condition of types I and II
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
Single-event multiple transients in guard-ring hardened inverter chains of different layout designs
A fringing-capacitance model for deep-submicron MOSFET with high-k gate dielectric
Secondary ESD clamp circuit for CDM protection of over 6 Gbit/s SerDes application in 40 nm CMOS
Battery remaining useful life prediction at different discharge rates
Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply
Safe operating area of GaAs MESFET and PHEMT for amplification in overdrive operating conditions
Thickness-dependent non-Fickian moisture absorption in epoxy molding compounds
Influence of different carbon doping on the performance and reliability of InAlN/GaN HEMTs
Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing
Annihilation of electrical trap effects by irradiating AlGaN/GaN HEMTs with low thermal neutrons radiation fluence
Approach of a physically based lifetime model for solder layers in power modules
Monte Carlo simulation of electronic characteristics in short channel δ-doped AlInAs/GaInAs HEMTs
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy
RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour
Multiphysics modeling approach for micro electro-thermo-mechanical actuator: Failure mechanisms coupled analysis
Signal probability for reliability evaluation of logic circuits
Virtual prototyping in a Design-for-Reliability approach
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
Modeling the sensitivity of CMOS circuits to radiation induced single event transients
Electrostatic micromotor and its reliability
Isotropic conductive adhesives: Future trends, possibilities and risks
Novel radiation hardened latch design considering process, voltage and temperature variations for nanoscale CMOS technology
Process capability indices and product reliability
Impact of local structural and electrical properties of grain boundaries in polycrystalline HfO 2 on reliability of SiO x interfacial layer
Design of multi-finger HBTs with a thermal-electrical model
Applications of TEM imaging, analysis and electron holography to III-nitride HEMT devices
Conducted and radiated EMI evolution of power RF N-LDMOS after accelerated ageing tests
Enhanced power cycling capability of SiC Schottky diodes using press pack contacts
Evaluating the abrasive wear of Zn 1- x Mn x O heteroepitaxial layers using a nanoscratch technique
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model
High-resolution SILC measurements of thin SiO 2 at ultra low voltages
Study of thinned Si wafer warpage in 3D stacked wafers
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system
Acceleration factors for THB induced degradation of AlGaAs/InGaAs pHEMT devices
Dynamic stress-induced high-frequency noise degradations in nMOSFETs
Wirebonding at higher ultrasonic frequencies: reliability and process implications
Sajjan G. Shiva, Advanced Computer Architectures , CRC Press, Francis & Taylor Group, Boca Raton (2006) ISBN 0-8493-3758-5 Hardcover. pp 335, plus XIV
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
Electrical conduction mechanisms in the temperature-dependent current-voltage characteristics of poly(3-hexylthiophene)/n-type Si devices
Envelope probability and EFAST-based sensitivity analysis method for electronic prognostic uncertainty quantification
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth
Modelling mutual thermal interactions between power LEDs in SPICE
Experimental study of Single Event Effects induced by heavy ion irradiation in enhancement mode GaN power HEMT
Methods of reducing defects in GaAs ICs
Effective work-function control technique applicable to p-type FinFET high-k/metal gate devices
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid
Wafer level packaging having bump-on-polymer structure
Device Simulation and Backside Laser Interferometry--Powerful Tools for ESD Protection Development
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers
Gate leakage properties of MOS devices with tri-layer high-k gate dielectric
Degradation of InGaN laser diodes caused by temperature- and current-driven diffusion processes
Study of non-contact nano-probing technique using FIB
A multi-scale approach for investigation of interfacial delamination in electronic packages
Reliability of platinum electrodes and heating elements on SiO 2 insulation layers and membranes
Hole tunneling from valence band and hot-carrier induced hysteresis effect in 0.13 μm partially depleted silicon-on-insulator n-MOSFETs
IR confocal laser microscopy for MEMS Technological Evaluation
Thermal reliability prediction and analysis for high-density electronic systems based on the Markov process
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Latent gate oxide defects case studies
Mechanism of wire bond shear testing
In-depth investigation of metallization aging in power MOSFETs
Stability of the J-V characteristics of (BEHP-PPV)-co-(MEH-PPV) based light-emitting diodes
Gate stress effect on low temperature data retention characteristics of split-gate flash memories
Experimental and numerical analysis of current flow homogeneity in low voltage SOI multi-finger gg-NMOS and NPN ESD protection devices
Long-term Electro-Magnetic Robustness of Integrated Circuits: EMRIC research project
Transient thermal analysis of multilayered structures using Green's functions
Experimental studies of: Laminate composition, drill bit wear out, and chloride ion concentration as factors affecting CAF formation rate
Reliability analysis of InGaN Blu-Ray laser diode
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices
RF characteristics of proton radiated large-area SiGe HBTs at extreme temperatures
A novel gate-suppression technique for ESD protection
On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package
Electrical model of an inverter body-biased structure in triple-well technology under pulsed photoelectric laser stimulation
Electro thermal modeling of the power diode using Pspice
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
2D Dopant Profiling on 4H Silicon Carbide P + N Junction by Scanning Capacitance and Scanning Electron Microscopy
The influence of hydrogen and nitrogen on the formation of Si nanoclusters embedded in sub-stoichiometric silicon oxide layers
Electrothermal characterization of silicon-on-glass VDMOSFETs
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO 2 interface using molecular modelling
Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs
Reliability study of LED driver - A case study of black box testing
Analysis of the gate capacitance measurement technique and its application for the evaluation of hot-carrier degradation in submicrometer MOSFETs
Electronic prognostics for switched mode power supplies
Health monitoring of electronic products based on Mahalanobis distance and Weibull decision metrics
Young's modulus of a sintered Cu joint and its influence on thermal stress
Remaining useful life prediction of lithium-ion battery with unscented particle filter technique
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
Charging induced damage by photoconduction through thick inter metal dielectrics
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps