yusuke1997/dblp-id-title huggingface dataset:
Novel analysis model for investigation of contact force and scrub length for design of probe card
Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test
The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
Study of process induced variability of germanium-pTFET in analog and RF domain
Templates for LaAlO 3 epitaxy on silicon
Two-photon laser-assisted device alteration in CMOS integrated circuits using linearly, circularly and radially polarized light
Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method
Positive charge generation due to species of hydrogen during NBTI phenomenon in pMOSFETs with ultra-thin SiON gate dielectrics
A comprehensive study of stress induced leakage current using a floating gate structure for direct applications in EEPROM memories
MOS current divider based PGA
Process improvement of 0.13mum Cu/Low K (Black Diamond TM ) dual damascene interconnection
Evaluation of the generation mechanisms at surface and in the bulk of the silicon by current transient technique
Low-frequency noise study in electron devices: review and update
Ambipolar field-effect transistor based on alpha, omega-dihexylquaterthiophene and alpha, omega-diperfluoroquaterthiophene vertical heterojunction
A numerical procedure for simulating delamination growth on interfaces of interconnect structures
Component Reliability Importance assessment on complex systems using Credible Improvement Potential
Monitoring extent of curing and thermal-mechanical property study of printed circuit board substrates
A fully on-chip ESD protection UWB-band low noise amplifier using GaAs enhancement-mode dual-gate pHEMT technology
Investigation on hot-carrier-induced degradation of SOI NLIGBT
Field degradation prediction of potential induced degradation of the crystalline silicon photovoltaic modules based on accelerated test and climatic data
Non destructive control of flip chip packages for space applications
Fault isolation in a case study of failure analysis on Metal-Insulator-Metal capacitor structures
Radiation Hardened by Design Latches - A Review and SEU Fault Simulations
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis
Influence of bias humidity testing and application on time-dependent, Arrhenius-law-based stability predictions for thin film resistors
A reversible first-order dispersive model of parametric instability
DSP based overcurrent relay using fuzzy bang-bang controller
A wavelet analysis of 1/f and white noise in microwave transistors
ESD protection structures for 20 V and 40 V power supply suitable for BCD6 smart power technology
Study of GHz-SAM sensitivity to delamination in BEOL layers
Creep lifetime prediction of solder joint for heat sink assembly
Analysis of Harmonic distortion in asymmetric underlap DG-MOSFET with high-k spacer
Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling
Study of aluminum thermomigration as a low thermal budget technique for innovative power devices
Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate
A new two-dimensional subthreshold behavior model for the short-channel asymmetrical dual-material double-gate (ADMDG) MOSFET's
Coupled electro-thermal simulation of a DC/DC converter
MOS power transistor model for Electromagnetic Susceptibility analysis
An optimal evaluating method for uncertainty metrics in reliability based on uncertain data envelopment analysis
A new model of subthreshold swing for sub-100 nm MOSFETs
Single event transient effects in a voltage reference
Compact modeling of short-channel effects in symmetric and asymmetric 3-T/4-T double gate MOSFETs
Review of add-on process modules for high-frequency silicon technology
The effect of surface modification and catalytic metal contact on methane sensing performance of nano-ZnO-Si heterojunction sensor
A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II - Latchup
Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling
Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation
On the SILC mechanism in MOSFET's with ultrathin oxides
Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue
Investigation of the surface silica layer on porous poly-Si thin films
Field-effect control of breakdown paths in HfO 2 based MIM structures
The threshold voltage degradation model of N Channel VDMOSFETs under PBT stress
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
Power cycling fatigue and lifetime prediction of power electronic devices in space applications
DRES: Data recovery for condition monitoring to enhance system reliability
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Promoting of charged-device model/electrostatic discharge immunity in the dicing saw process
High temperature reliability testing of aluminum and tantalum electrolytic capacitors
Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
Damp Heat test on LiNbO optical modulators
Feasibility study of the application of voltage contrast to printed circuit board
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C
The Failure Analysis of High Voltage Tolerance IO Buffer under ESD
Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
A step-accurate model for the trapping and release of charge carriers suitable for the transient simulation of analog circuits
The frequency-dependent electrical characteristics of interfaces in the Sn/p-Si metal semiconductor structures
An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators
Unclamped repetitive stress on 1200 V normally-off SiC JFETs
Charge storage peculiarities in poly-Si-SiO 2 -Si memory devices with Si nanocrystals rich SiO 2
Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations
Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices
Effect of oxide breakdown on RS latches
Electro-thermal characterization of AlGaN/GaN HEMT on Silicon Microstrip Technology
Single-equation model for low and high voltage soft breakdown conduction
Defect and microstructural evolution in thermally cycled Cu through-silicon vias
Photon emission microscopy of inter/intra chip device performance variations
Reliability of advanced high-k/metal-gate n-FET devices
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging
Modelling RTN and BTI in nanoscale MOSFETs from device to circuit: A review
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
A study of advanced layout verification to prevent leakage current failure during power down mode operation
A compact test structure for characterisation of leakage currents in sub-micron CMOS technologies
Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage
Device and circuit level suppression techniques for random-dopant-induced static noise margin fluctuation in 16-nm-gate SRAM cell
Why hot carrier emission based timing probes will work for 50 nm, 1V CMOS technologies
Performance comparison of channel engineered deep sub-micrometer pseudo SOI n-MOSFETs
Performance vs. reliability adaptive body bias scheme in 28 nm & 14 nm UTBB FDSOI nodes
Peculiarities of electron tunnel injection to the drain of EEPROMs
Layout and bias options for maximizing V t1 in cascoded NMOS output buffers
Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters
Multistage performance deterioration in n-type crystalline silicon photovoltaic modules undergoing potential-induced degradation
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices
Accelerated degradation data of SiC MOSFETs for lifetime and Remaining Useful Life assessment
The distributed thermal model of fin field effect transistor
High thermal stability AlGaAs/InGaAs enhancement-mode pHEMT using palladium-gate technology
Evaluation of variability using Schmitt trigger on full adders layout
Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus
Dynamic avalanche and reliability of high voltage diodes
Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range
Adhesion of arbitrary-shaped thin-film microstructures
Study on non-contact current path formation using charged particle beams
Dielectric charging effects in floating electrode MEMS capacitive switches
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density
Prospects on Mn-doped ZnGeP 2 for spintronics
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
Thermal analysis and design of a 75-W hybrid-type DC-DC converter for space applications
Variations in junction capacitance and doping activation associated with electrical stress of InGaN/GaN laser diodes
Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs
Design of metal interconnects for stretchable electronic circuits
Scanning probe microscopy in semiconductor failure analysis
Scaling DC lifetests on GaN HEMT to RF conditions
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
Oxynitride gate dielectric prepared by thermal oxidation of low-pressure chemical vapor deposition silicon-rich silicon nitride
Reliability impacts of high-speed 3-bit/cell Schottky barrier nanowire charge-trapping memories
The effect of downscaling the dimensions of solder interconnects on their creep properties
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages
Mechanism of anomalous recovery in advanced SiGe bipolar transistors after low dose rate irradiation for very high total doses
AC analysis of nanoscale GME-TRC MOSFET for microwave and RF applications
Unified view on energy and electrical failure of the short-circuit operation of IGBTs
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Organic thin film transistors with HfO 2 high-k gate dielectric grown by anodic oxidation or deposited by sol-gel
Impact of circuit resistance on the breakdown voltage of tantalum chip capacitors
GaN HEMT reliability
Impact of back gate biases on hot carrier effects in multiple gate junctionless transistors
Design for reliability of solid state lighting systems
Experimental study of multilayer SiCN barrier film in 45/40 nm technological node and beyond
Overview of catastrophic failures of freewheeling diodes in power electronic circuits
Gate oxide breakdown characterization on 0.13mum CMOS technology
Adding a self-reset feature to the Bulk-BICS with dynamic storage cell
Reliability studies on integrated GaAs power-sensor structures using pulsed electrical stress
An embedded trace FCCSP substrate without glass cloth
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process
High thermal stability and low hysteresis dispersion AlGaN/GaN MOS-HEMTs with zirconia film design
Reliability of AlGaN/GaN HEMTs: Permanent leakage current increase and output current drop
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
Power module thermal cycling tester for in-situ ageing detection
Effects of La 2 O 3 incorporation in HfO 2 gated nMOSFETs on low-frequency noise
Short defect characterization based on TCR parameter extraction
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology
New developments of THERMOS 3 , a tool for 3D electro-thermal simulation of smart power MOSFETs
Temperature stability of electro-thermally and piezoelectrically actuated silicon carbide MEMS resonators
A review of lead-free solders for electronics applications
InGaP/GaAs heterojunction bipolar transistor and RF power amplifier reliability
Investigation and application of vertical NPN devices for RF ESD protection in BiCMOS technology
Failure mechanisms and precautions in plug connectors and relays
Drain current model for undoped Gate Stack Double Gate (GSDG) MOSFETs including the hot-carrier degradation effects
A simplified procedure for the analysis of Safety Instrumented Systems in the process industry application
An analytical approach for physical modeling of hot-carrier induced degradation
Cu pumping in TSVs: Effect of pre-CMP thermal budget
Using GA-SVM for defect inspection of flip chips based on vibration signals
Power p-i-n diodes for snubberless application: H + irradiation for soft and reliable reverse recovery
Compliance current dominates evolution of NiSi 2 defect size in Ni/dielectric/Si RRAM devices
Low frequency noise as a reliability diagnostic tool in compound semiconductor transistors
Reliability analysis of AlGaN/GaN HEMT on SopSiC composite substrate under long-term DC-life test
The temperature and oxygen vacancy effects on the diffusion coefficient and ionic conductivity in ferroelectric BaTiO 3 nanowires; A molecular dynamics study
A row hammer pattern analysis of DDR2 SDRAM
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristics
Interconnecting and Computing over Satellite Networks; Yongguang Zhang (Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 262, plus XXII, ISBN 1-4020-7424-7
Electro-thermal simulation in the time domain of GaN HEMT for RF switch-mode amplifier
SiC power MOSFETs performance, robustness and technology maturity
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
Separating HBT wearout from defects during early life operation
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies
Design, modeling and analysis of highly reliable capacitive microaccelerometer based on circular stepped-plate and small-area touch mode
RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology
Mechanism of O 2 -anneal induced V fb shifts of Ru gated stacks
Signal integrity in capacitive and piezoresistive single- and multi-axis MEMS gyroscopes under vibrations
Modeling of retention time degradation due to inelastic trap-assisted tunneling in EEPROM devices
Interface reliability and lifetime prediction of heavy aluminum wire bonds
Thermo-mechanical finite element analysis in a multichip build up substrate based package design
Influence of sidewall spacer on threshold voltage of MOSFET with high-k gate dielectric
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops
Flux effect on void quantity and size in soldered joints
High temperature degradation of palladium coated copper bond wires
Improving ESD protection of 5V NMOSFET large array device in 0.4μm BCD process
Failure analysis of RFIC amplifiers
Crack-guided effect on dynamic mechanical stress for foldable low temperature polycrystalline silicon thin film transistors
Thermomechanical degradation of single and multiple quantum well AlGaAs/GaAs laser diodes
Entropy-based sensor selection for condition monitoring and prognostics of aircraft engine
Trends in Failure Analysis
No-flow underfill flip chip assembly--an experimental and modeling analysis
Performance of nonvolatile memory by using band-engineered SrTiO 3 /HfON stack as charge-trapping layer
Pump chip and phosphor reliability of broadband light-emitting diodes
Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies
Applying Bayesian mixtures-of-experts models to statistical description of smart power semiconductor reliability
Improved performance of trench power MOSFET with SiGeC-based channel
A three-parameter Weibull-like fitting function for flip-chip die strength data
High quality gate insulator film formation on SiC using by microwave-excited high-density plasma
Requirements in power cycling for precise lifetime estimation
Stability of pentacene transistors under concomitant influence of water vapor and bias stress
RF small signal avalanche for bipolar transistor circuit design: Characterization, modeling and repercussions
Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures
Improving the FE simulation of molded packages using warpage measurements
Lifetime estimation for IGBT modules in wind turbine power converter system considering ambient temperature
A method of thermal testing of microsystems
Controlling of electrical and interface state density properties of ZnO: Co/p-silicon diode structures by compositional fraction of cobalt dopant
Characterisation method for chip card ESD events causing terminal failures
Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl
Fast wafer level reliability: methods and experiences
Evaluation of effective stress times and stress levels from mission profiles for semiconductor reliability
The influence of solder composition on the impact strength of lead-free solder ball grid array joints
Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing
Effect of power cycling tests on traps under the gate of Al 2 O 3 /AlGaN/GaN normally-ON devices
Pressure-induced tin whisker formation
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications
The influence of technology variation on ggNMOSTs and SCRs against CDM BSD stress
Cell array reconfigurable architecture for high-efficiency AES system
Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes
Improved physical understanding of intermittent failure in continuous monitoring method
Thermoreflectance mapping observation of Power MOSFET under UIS avalanche breakdown condition
Issues in accelerated electromigration of solder bumps
Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-Technology
Low temperature nanointegration for emerging biomedical applications
Temperature dependent dynamic on-state resistance in GaN-on-Si based normally-off HFETs
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method
Temperature effects on BTI and soft errors in modern logic circuits
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses
Impedance and barrier capacitance of silicon diodes implanted with high-energy Xe ions
Conductive adhesive joint for extreme temperature applications
Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes
A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards
Surface leakage current related failure of power silicon devices operated at high junction temperature
Non-destructive high temperature characterisation of high-voltage IGBTs
Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
A body built-in cell for detecting transient faults and dynamically biasing subcircuits of integrated systems
8T vs. 6T SRAM cell radiation robustness: A comparative analysis
ESR and capacitance monitoring of a dc-link capacitor used in a three-phase PWM inverter with a front-end diode rectifier
Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications
A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples
The effect of ionization and displacement damage on minority carrier lifetime
Degradation mechanisms of high-power white LEDs activated by current and temperature
Design optimization of RF-MEMS switch considering thermally induced residual stress and process uncertainties
Current induced degradation study on state of the art DUV LEDs
Investigation of high-performance sub-50 nm junctionless nanowire transistors
High-current stressing of organic light-emitting diodes with different electron-transport materials
Statistics and localisation of vertical breakdown in AlGaN/GaN HEMTs on SiC and Si substrates for power applications
Characterization of the viscoelastic properties of an epoxy molding compound during cure
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages
Impact of Hf content on positive bias temperature instability reliability of HfSiON gate dielectrics
A novel fault-tolerant control for battery-energy-storage system based on cascaded multilevel converter with battery/BMS failure
Mission profile-based assessment of semiconductor technologies for automotive applications
Extraction of bias-dependent parasitic source/drain resistance in MOSFETs with an advanced mobility model
Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations
Eliminating infant mortality in metallized film capacitors by defect detection
A power cycling degradation inspector of power semiconductor devices
Organic inverter: Theoretical analysis using load matching technique
Post deposition UV-induced O 2 annealing of HfO 2 thin films
Impact of the electron, proton and helium irradiation on the forward I-V characteristics of high-power P-i-N diode
Micro-Raman spectroscopy applied in crystal structure analysis on the ESD failure mechanism of SiC JBS diodes
A fast reliability assessment method for Si MEMS based microcantilever beams
An improved multilevel cell programming technique for 4-bits/cell localized trapping SONOS memory devices
Temperature impact on inductance and resistance values of a coreless inductor (Cu/Al 2 O 3 )
Reliability study of new SnZnAl lead-free solders used in CSP packages
Weibull characteristics of n-MOSFET's with ultrathin gate oxides under FN stress and lifetime prediction
Adhesion work analysis through molecular modeling and wetting angle measurement
Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method
MOS characteristics of NO-grown oxynitrides on n-type 6H-SiC
Temperature dependent Young's modulus and quality factor of CMOS-MEMS resonator: Modelling and experimental approach
Reliability functions estimated from commonly used yield models
Influence of temperature on the actuation voltage of RF-MEMS switches