yusuke1997/dblp-id-title huggingface dataset:
The importance of standardizing CDM ESD test head parameters to obtain data correlation
MEMS packaging and reliability: An undividable couple
Impact of single pMOSFET dielectric degradation on NAND circuit performance
Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics
Microsystems elements based on free-standing thick-films made with a new sacrificial layer process
Study of micro-BGA solder joint reliability
Photoelectric Laser Stimulation applied to Latch-Up phenomenon and localization of parasitic transistors in an industrial failure analysis laboratory
Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests
A comparative study of self-heating effect of nMOSFETs fabricated on SGOI and SGSOAN substrates
Reduced Hot Carrier Effects in Self-Aligned Ground-Plane FDSOI MOSFET's
On the reliability of ZrO 2 films for VLSI applications
Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate
Front-end of line and middle-of-line time-dependent dielectric breakdown reliability simulator for logic circuits
William C.Y. Lee, Wireless & Cellular Telecommunications (third ed.), McGraw Hill, New York (2006) ISBN 0-07-143686-3 Hardcover, 822 pp., plus XXIII
Simulated SAM A-scans on multilayer MEMS components
Design for built-in FPGA reliability via fine-grained 2-D error correction codes
Access resistor modelling for EEPROM's retention test vehicle
A case study of ESD failures at random levels: analysis, explanation and solution
Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity
Design, evaluation and fault-tolerance analysis of stochastic FIR filters
Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications
Reliability odometer for real-time and in situ lifetime measurement of power devices
Hot carrier effect on the bipolar transistors' response to electromagnetic interference
Substrate Engineering to Improve Soft-Error-Rate Immunity for SRAM Technologies
Progressive drain damage in SiC power MOSFETs exposed to ionizing radiation
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors
Distribution and generation of traps in SiO 2 /Al 2 O 3 gate stacks
Degradation in polysilicon thin film transistors related to the quality of the polysilicon material
Channel width dependence of mechanical stress effects induced by shallow trench isolation on device performance of nanoscale nMOSFETs
Investigation of the power dissipation during IGBT turn-off using a new physics-based IGBT compact model
SNaP: A novel hybrid method for circuit reliability assessment under multiple faults
Topological variation on sub-20 nm double-gate inversion and Junctionless-FinFET based 6T-SRAM circuits and its SEU radiation performance
Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy
Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (0 0 1) Si
Active ESD protection circuit design against charged-device-model ESD event in CMOS integrated circuits
A prognostics and health management roadmap for information and electronics-rich systems
Robust, versatile, direct low-frequency noise characterization method for material/process quality control using cross-shaped 4-terminal devices
Characterisation of emitter/base leakage currents in SiGe HBTs produced using selective epitaxy
Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation
An area-efficient LDMOS-SCR ESD protection device for the I/O of power IC application
Oxide charge measurements in EEPROM devices
Investigation and simulation on the dynamic shock response performance of packaged high-g MEMS accelerometer versus the impurity concentration of the piezoresistor
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
Positive bias temperature instabilities on sub-nanometer EOT FinFETs
Time gating imaging through thick silicon substrate: a new step towards backside characterisation
Comments on "Extend orthogonal Latin square codes for 32-bit data protection in memory applications" Microelectron. Reliab. 63 278-283 (2016)
Effects of thermal cycling on aluminum metallization of power diodes
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP
Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface
Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications by conductive particles and adhesives
Modeling current transport in ultra-scaled field-effect transistors
The effect of moisture on the degradation mechanism of multi-crystalline silicon photovoltaic module
Impact of aging on the soft error rate of 6T SRAM for planar and bulk technologies
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers
Investigating the TDDB lifetime growth mechanism caused by proton irradiation in partially depleted SOI devices
Empirical correlation between package-level ball impact test and board-level drop reliability
Prognostics of Lithium-ion batteries based on state space modeling with heterogeneous noise variances
A dynamic partial reconfiguration design flow for permanent faults mitigation in FPGAs
MEMS reliability: Where are we now?
Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing
Probabilistic analysis of CMOS physical defects in VLSI circuits for test coverage improvement
A compact model for NBTI degradation and recovery under use-profile variations and its application to aging analysis of digital integrated circuits
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources
Light emission from Si/SiO 2 superlattices fabricated by RPECVD
Application of various optical techniques for ESD defect localization
Degradation of GaN-on-GaN vertical diodes submitted to high current stress
FFT analysis of temperature modulated semiconductor gas sensor response for the prediction of ammonia concentration under humidity interference
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis
Evaluation of the drop response of handheld electronic products
Circuit simulation assisting Physical Fault Isolation for effective root cause analysis
Effects of bonding force on contact pressure and frictional energy in wire bonding
Thermal analysis of LED spot lighting device operating in external natural or forced heat convection
Study of CDM specific effects for a smart power input protection structure
Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
Influence of medical sterilization on ACA flip chip joints using conformal coating
High performance, FPGA-based test apparatus for unclamped inductive switching of IGBTs
Process reliability screening in situ
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules
Nitrogen implantations for rapid thermal oxinitride layers
Converter monitoring in a wind turbine application
Anomalous drain voltage dependence in bias temperature instability measurements on high-κ field effect transistors
Effects of low gate bias annealing in NBT stressed p-channel power VDMOSFETs
No-fault-found and intermittent failures in electronic products
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions
Recent advances of nanolead-free solder material for low processing temperature interconnect applications
Magnetic Field Imaging for non destructive 3D IC testing
SPICE modelling of hot-carrier degradation in Si 1- x Ge x S/D and HfSiON based pMOS transistors
Study of the leakage current suppression for hybrid-Schottky/ohmic drain AlGaN/GaN HEMT
Modeling of drain current, capacitance and transconductance in thin film undoped symmetric DG MOSFETs including quantum effects
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface
Reliability of Pb(Mg, Nb)O 3 -Pb(Zr, Ti)O 3 multilayer ceramic piezoelectric actuators by Weibull method
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs
Optimization of gate poly TAB size and reliability on short channel pMOSFET
Laterally inhomogeneous barrier analysis of identically prepared Cd/CdS/n-Si/Au-Sb structures by SILAR method
A novel hetero-junction Tunnel-FET using Semiconducting silicide-Silicon contact and its scalability
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO 2 nano-reinforced lead free solder at different weighted percentages
Fast and accurate statistical characterization of standard cell libraries
Degradation of thin oxides during electrical stress
Challenges for dielectric materials in future integrated circuit technologies
Single Event Upset rate determination for 65 nm SRAM bit-cell in LEO radiation environments
Maximum error modeling for fault-tolerant computation using maximum a posteriori (MAP) hypothesis
IMAPS-CPMT Poland 2008 - Guest Editorial
Analysis of ultracapacitors ageing in automotive application
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages
Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement
Reliability assessment for traction power supply system based on Quantification of Margins and Uncertainties
Trapped charge and stress induced leakage current (SILC) in tunnel SiO 2 layers of de-processed MOS non-volatile memory devices observed at the nanoscale
A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions
Low cost flex substrates for miniaturized electronic assemblies
Study of mechanical stress impact on the I-V characteristics of a power VDMOS device using 2D FEM simulations
The role of the optical trans-characteristics in laser diode analysis
Asynchronous circuits as alternative for mitigation of long-duration transient faults in deep-submicron technologies
Reliability of erasing operation in NOR-Flash memories
Defining the safe operating area for HBTs with an InGaP emitter across temperature and current density
New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy
Voltage stress-induced hot carrier effects on SiGe HBT VCO
Stability and performance analysis of a SiC-based cascode switch and an alternative solution
Computationally efficient and stable order reduction methods for a large-scale model of MEMS piezoelectric energy harvester
Thermal resistance assessment in multi-trenched power devices
Characterisation of IC packaging interfaces and loading effects
Life expectancy and characterization of capacitive RF MEMS switches
Performances and limitations analyses of PHEMT and MHEMT for applications in high bit rate fiber-optic systems
Ionising radiation effects on MOSFET drain current
Fatigue life prediction model for accelerated testing of electronic components under non-Gaussian random vibration excitations
Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Electrical conduction mechanism in high-dielectric-constant ZrO 2 thin films
High-lead flip chip bump cracking on the thin organic substrate in a module package
Development of a matrix test board for capacitor reliability testing
Void detection in solder bumps with deep learning
The ROCS Workshop and 25 years of compound semiconductor reliability
Random telegraph signal: A sensitive and nondestructive tool for gate oxide single trap characterization
Effects of device aging on microelectronics radiation response and reliability
Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM
Adaptive accelerated aging for 28 nm HKMG technology
Power semiconductor module using a bonding film with anisotropic thermal conduction
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
Breakdown mechanisms in MgO based magnetic tunnel junctions and correlation with low frequency noise
Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire
Characterization of solder interfaces using laser flash metrology
Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities
Dependence of copper interconnect electromigration phenomenon on barrier metal materials
Reliability challenges for copper interconnects
Heuristic Kalman optimized particle filter for remaining useful life prediction of lithium-ion battery
The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules
Cross-layer investigation of continuous-time sigma-delta modulator under aging effects
Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions
Thermal stability of sectorial split-drain magnetic field-effect transistors
Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation
Towards AND/XOR balanced synthesis: Logic circuits rewriting with XOR
Improving carrier mobility with vanadium doping of transparent conducting CdO
A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators
Strength of Ta-Si interfaces by molecular dynamics
EBSD measurements of elastic strain fields in a GaN/sapphire structure
Reliability considerations for ESD protection under wire bonding pads
Contoured device sample preparation technique for ±5 μm remaining silicon thicknesses that meets solid immersion lens requirements
Influence of the surface roughness of the bottom electrode on the resistive-switching characteristics of Al/Al 2 O 3 /Al and Al/Al 2 O 3 /W structures fabricated on glass at 300 °C
Single event upset mitigation by means of a sequential circuit state freeze
Bondability window and power input for wire bonding
Experimental investigations and model study of moisture behaviors in polymeric materials
Bias temperature instability in scaled CMOS technologies: A circuit perspective
Impacts of NBTI and PBTI on SRAM static/dynamic noise margins and cell failure probability
Thermal cycle reliability of Cu-nanoparticle joint
Sub-1 ns characterization methodology for transistor electrical parameter extraction
Finite difference modelling of moisture diffusion in printed circuit boards with ground planes
Power Distribution Networks in High Speed Integrated Circuits; Andrey Mezhiba, Eby Friedman. Kluwer Academic Publishers, Boston; 2004. Hardcover, 280pp, plus XXIII, ISBN 1-4020-7534-0
Semiconductors in high temperature applications - a future trend in automotive industry
A review on the humidity reliability of high power white light LEDs
A return on investment analysis of applying health monitoring to LED lighting systems
Adhesion strength of die attach film for thin electronic package at elevated temperature
Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis
Reliability of Metamorphic HEMTs for Power Applications
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer
1/f noise analysis of InP/InGaAs DHBTs submitted to bias and thermal stresses
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure
Innovative packaging technique for backside optical testing of wire-bonded chips
Electrical properties of highly reliable 32Mb FRAM with advanced capacitor technology
Effect of short-circuit stress on the degradation of the SiO 2 dielectric in SiC power MOSFETs
Spherical aberration correction in aplanatic solid immersion lens imaging using a MEMS deformable mirror
ICMAT 2011 - Reliability and variability of semiconductor devices and ICs
TCAD study of DLC coatings for large-area high-power diodes
Direct measurement of residual stress in integrated circuit interconnect features
Characterization of bump arrays at RF/microwave frequencies
Simulation of ESD protection devices in an advanced CMOS technology using a TCAD workbench based on an ESD calibration methodology
Electron transport in two dimensional electron gas formed at the heterojunction of Al x Ga (1- x ) N/GaN at microwave frequencies
Wim Claes, Willy Sansen and Robert Puers, Design of Wireless Autonomous Data-Logger ICs , Springer, Dordrecht (2006) ISBN 1-4020-3208-0 pp 199, Hardcover, plus XVI
Whisker mitigation measures for Sn-plated Cu for different stress tests
Effects of atmospheric neutrons on devices, at sea level and in avionics embedded systems
Quantitative Scanning Microwave Microscopy: A calibration flow
Improved sensing characteristics of MISiC Schottky-diode hydrogen sensor by using HfO 2 as gate insulator
An extension of the Curie-von Schweidler law for the leakage current decay in MIS structures including progressive breakdown
Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET's (n-DTMOSFET) measured by gated-diode configuration
UHV CAFM characterization of high-k dielectrics: Effect of the technique resolution on the pre- and post-breakdown electrical measurements
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Book Review: Fundamentals of Bias Temperature Instability in MOS Transistors. Springer (2016)
Failure analysis of contact probe pins for SnPb and Sn applications
Aging of the over-voltage protection elements caused by over-voltages
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)
Parametric FE-approach to flip-chip reliability under various loading conditions
The effects of curing parameters on the properties development of an epoxy encapsulant material
Some aspects on ruggedness of SiC power devices
Comparison of different flex materials in high density flip chip on flex applications
Hot electron induced degradation of undoped AlGaN/GaN HFETs
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation
Electrical characterization of HfO 2 films obtained by UV assisted injection MOCVD
Characterization of ageing failures on power MOSFET devices by electron and ion microscopies
Coaxial Ion-Photon System
Investigation into sand mura effects of a-IGZO TFT LCDs
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly
Statistical analysis of characteristic of ageing precursor of IGBT based on synthetic effect of multi-physical fields
Investigation on the origin of the anomalous tail bits on nitrided charge trap flash memory
Harsh environment application of electronics - Reliability of copper wiring and testability thereof
A new lifetime prediction method for hot-carrier degradation in n-MOSFETs with ultrathin gate oxides under V g =V d
Effects of thermal annealing on the charge localization characteristics of HfO 2 /Au/HfO 2 stack
Fabrication of advanced probes for atomic force microscopy using focused ion beam
Statistical model of NBTI and reliability simulation for analogue circuits
Potentiality of trap charge effects and SiON induced interface defects in a-Si 3 N 4 /SiON based MIS structure for resistive NVM device
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
Materials characterization of the effect of mechanical bending on area array package interconnects
VSP - A gate stack analyzer
Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board
Reconfigurable digital controller for a buck converter based on FPGA
Design and characterization of ESD solutions with EMC robustness for automotive applications
Fault localization at high voltage devices using thermally induced voltage alteration (TIVA)
A Modelisation of the temperature dependence of the Fowler-Nordheim current in EEPROM memories
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Whiskering behaviour of immersion tin surface coating
Soft error mechanisms, modeling and mitigation. Springer (2016)
Performance deterioration of p-type single crystalline silicon solar modules affected by potential induced degradation in photovoltaic power plant
A generalized degradation model based on Gaussian process
Fast diffusers in a thermal gradient (solder ball)
High performance SOI CMOS pixel sensor with surrounding N+ trench electrode
A new approach for making electrically conductive interconnections between small contacts in failure analysis
Diffusion barrier performance of Zr-N/Zr bilayered film in Cu/Si contact system
Defects in silicon oxynitride gate dielectric films
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
A hybrid prognostics approach for MEMS: From real measurements to remaining useful life estimation
Capacitively coupled transmission line pulsing cc-TLP--a traceable and reproducible stress method in the CDM-domain
Modular fault tolerant processor architecture on a SoC for space
Simulation and fabrication of magnetic rotary microgenerator with multipolar Nd/Fe/B magnet
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles
Small signal parameter extraction of MESFET using quantum particle swarm optimization
Field enhancement of omega-shaped-gated poly-Si TFT SONOS memory fabricated by a simple sidewall spacer formation
Improvement of the P/E window in nanocrystal memories by the use of high-k materials in the control dielectric
Fractal description of dendrite growth during electrochemical migration
Design of approximate-TMR using approximate library and heuristic approaches
Reliability optimization of analog integrated circuits considering the trade-off between lifetime and area
Application of transient interferometric mapping method for ESD and latch-up analysis
Understanding the effects of NIR laser stimulation on NMOS transistor
Analytical model for the transient analysis of electronic assemblies subjected to impact loading
Variation-resilient quantifiable plasma process induced damage monitoring
Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis
Transient stress characterization of AlGaN/GaN HEMTs due to electrical and thermal effects
Reliable real-time task scheduler based on Rocket Queue architecture