yusuke1997/dblp-id-title huggingface dataset:
Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects
Time-dependent dielectric breakdown (TDDB) distribution in n-MOSFET with HfSiON gate dielectrics under DC and AC stressing
Operating channel temperature in GaN HEMTs: DC versus RF accelerated life testing
Representation of the SiGe HBT's thermal impedance by linear and recursive networks
Corrosion behaviour of sintered silver under maritime environmental conditions
Tin whisker formation of lead-free plated leadframes
Plasma Charging Damage Reduction in IC Processing by A Self-balancing Interconnect
On the importance of the V g, max -V th parameter on LTPS TFT stressing behavior
Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs
Evolution of LF noise in Power PHEMT's submitted to RF and DC Step Stresses
Single band electronic conduction in hafnium oxide prepared by atomic layer deposition
Comparison study on performances and robustness between SiC MOSFET & JFET devices - Abilities for aeronautics application
Analytical investigation of dead space effect under near-breakdown conditions in GaInP/GaAs composite double heterojunction bipolar transistors
Multi-vibrational hydrogen release: Physical origin of T bd , Q bd power-law voltage dependence of oxide breakdown in ultra-thin gate oxides
Importance of electric resistance monitoring in shear test
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy
Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging
Thermal performance analysis of GaN nanowire and fin-shaped power transistors based on self-consistent electrothermal simulations
Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery
Hot carrier aging degradation phenomena in GaN based MESFETs
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process
FinFET and MOSFET preliminary comparison of gate oxide reliability
Fabrication of suspended thin film resonator for application of RF bandpass filter
Robust prognostics for state of health estimation of lithium-ion batteries based on an improved PSO-SVR model
2 MeV electron irradiation effects on the electrical characteristics of MOS capacitors with ALD Al 2 O 3 dielectrics of different thickness
Standard and C-AFM tests to study the post-BD gate oxide conduction of MOS devices after current limited stresses
Failure mechanism and reliability test method for USB interface circuitry on CPUs for mobile devices
On the profile of frequency and voltage dependent interface states and series resistance in (Ni/Au)/Al 0.22 Ga 0.78 N/AlN/GaN heterostructures by using current-voltage (I-V) and admittance spectroscopy methods
Enhancement of light-emitting diode reliability using silicone microsphere in encapsulant
Investigation of SEU sensitivity of Xilinx Virtex II FPGA by pulsed laser fault injections
Drop impact reliability of edge-bonded lead-free chip scale packages
Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors
A methodology for projecting SiO 2 thick gate oxide reliability on trench power MOSFETs and its application on MOSFETs V GS rating
Investigations on immunity of interfaces between intelligent media processor and DDR3 SDRAM memory
Low frequency drain noise comparison of AlGaN/GaN HEMT's grown on silicon, SiC and sapphire substrates
Epitaxial, high-K dielectrics on silicon: the example of praseodymium oxide
New defect detection approach using near electromagnetic field probing of high density PCBAs
GaAsSb/InGaAs tunnel field effect transistor with a pocket layer
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages
Resilience Articulation Point (RAP): Cross-layer dependability modeling for nanometer system-on-chip resilience
Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging
A process-variation-resilient methodology of circuit design by using asymmetrical forward body bias in 28 nm FDSOI
Reliability analysis of CMOS MEMS structures obtained by Front Side Bulk Micromachining
Induced charging phenomena on SiN x dielectric films used in RF MEMS capacitive switches
From diffusive in-plane to ballistic out-of-plane heat transport in thin non-crystalline films
Conduction mechanisms in thermal nitride and dry gate oxides grown on 4H-SiC
Characteristics and aging of PCB embedded power electronics
A transient noise simulation model for the analysis of the optimal number of stages of the analog accumulator in TDI CMOS image sensors
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation
Analysis of a vibration-induced micro-generator with a helical micro-spring and induction coil
Surge protection design with surge-to-digital converter for microelectronic circuits and systems
Electrical characterization and quantum modeling of MOS capacitors with ultra-thin oxides (1.4-3 nm)
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
Field and hot electron-induced degradation in GaN-based power MIS-HEMTs
The reliability of wire bonding using Ag and Al
Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation
Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions
Robert B. Northrop, Introduction to Instrumentation and Measurement, 2/e , CRC Press, Taylor & Francis Group, Boca Raton (2005) ISBN 0-8493-3773-9 743 pp., Hardcover, plus XXI
Understanding spatial resolution of laser voltage imaging
Moisture induced degradation of multilayer ceramic capacitors
ESD protection design for CMOS RF integrated circuits using polysilicon diodes
Single and dual gate OTFT based robust organic digital design
A relation model of gate oxide yield and reliability
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
Experimental measurements and 3D simulation of the parasitic lateral bipolar transistor triggering within a single finger gg-nMOS under ESD
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high T g ACFs in fine-pitch chip-on-glass applications
Observation and characterization of defects in HfO 2 high-K gate dielectric layers
Influence of P3HT: PCBM blend preparation on the active layer morphology and cell degradation
Dispersion study of DC and Low Frequency Noise in SiGe: C Heterojunction Bipolar Transistors used for mm-Wave to Terahertz applications
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems
Characterization and modeling of power MOSFET switching times variations under constant electrical stress
From component to system failure analysis - The future challenge within work-sharing supply chains
Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors
Investigation on the effect of annealing process parameters on AuGeNi ohmic contact to n-GaAs using microstructural characteristics
Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting
A 2-D analytical threshold-voltage model for GeOI/GeON MOSFET with high-k gate dielectric
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter
Influences of silicon-rich shallow trench isolation on total ionizing dose hardening and gate oxide integrity in a 130 nm partially depleted SOI CMOS technology
The improvement of HEIP immunity using STI engineering at DRAM
Analysis and mitigation of BTI aging in register file: An application driven approach
Reliability Object Model Tree (ROM-Tree): A system design-for-reliability method
Thermal storage effects on AlGaN/GaN HEMT
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Influence of the SiO 2 layer thickness on the degradation of HfO 2 /SiO 2 stacks subjected to static and dynamic stress conditions
New qualification approach for optoelectronic components
A new prognostics method for state of health estimation of lithium-ion batteries based on a mixture of Gaussian process models and particle filter
A thorough investigation of MOSFETs NBTI degradation
Monitoring chip fatigue in an IGBT module based on grey relational analysis
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading
Comparative study of sensitive volume and triggering criteria of SEB in 600 V planar and trench IGBTs
Effect of moisture swelling on MEMS packaging and integrated sensors
Formation mechanism of concave by dielectric breakdown on silicon carbide metal-oxide-semiconductor capacitor
Reaction of NiO film on flexible substrates with buffer solutions and application to flexible arrayed lactate biosensor
Very small snapback silicon-controlled rectifier for electrostatic discharge protection in 28 nm processing
The self-formatting barrier characteristics of Cu-Mg/SiO 2 and Cu-Ru/SiO 2 films for Cu interconnects
A prognostic approach for non-punch through and field stop IGBTs
On the shape formation of the droplet epitaxial quantum dots
Multiple high-voltage pulse stressing of conventional thick-film resistors
A dual-beam Michelson interferometer for investigation of trigger dynamics in ESD protection devices under very fast TLP stress
Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films
A study of an abnormal ESD failure mechanism and threshold voltage caused by ESD current zapping sequence
Estimation of SiC JFET temperature during short-circuit operations
A designer's guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 319, plus XVI, ISBN 1-4020-7050-0
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages
Reliability of low current electrical spring contacts in power modules
Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy
Static logic state analysis by TLS on powered logic circuits: Three case studies for suspected stuck-at failure modes
Risk of tin whiskers in the nuclear industry
Fast power cycling protocols implemented in an automated test bench dedicated to IGBT module ageing
Dynamic voltage and frequency scaling algorithm for fault-tolerant real-time systems
Long-term reliability of silicon bipolar transistors subjected to low constraints
Base transit time of an epitaxial n + pn - n + bipolar transistor considering Kirk effect
Reliability issues in GaN-based light-emitting diodes: Effect of dc and PWM stress
A novel method to improve cell endurance window in source-side injection split gate flash memory
Towards an efficient SEU effects emulation on SRAM-based FPGAs
Induced degradation on c-Si solar cells for concentration terrestrial applications
Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model
Integrating physical level design and high level synthesis for simultaneous multi-cycle transient and multiple transient fault resiliency of application specific datapath processors
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
IV, noise and electroluminescence analysis of stress-induced percolation paths in AlGaN/GaN high electron mobility transistors
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization
Effect of H/Ar treatment on ZnO: B transparent conducting oxide for flexible a-Si: H/μc-Si: H photovoltaic modules under damp heat stress
Failure mechanisms of adhesive flip chip joints
Heavy ion impact on narrow band cascoded low noise amplifier
Junction temperature management of IGBT module in power electronic converters
A method to recover critical bits under a double error in SEC-DED protected memories
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects
Physically based analytical model of the blocking I-V curve of Trench IGBTs
Reliability of Cu wire bonds in microelectronic packages
Qualification of GaN microwave transistors for the European Space Agency Biomass mission
The effect of solar cell shunt resistance change on the bus voltage ripple in spacecraft power system
Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits
Temperature influence on energy losses in MOSFET capacitors
Technologies for Heterogeneous Integration - Challenges and chances for fault isolation
A review of NBTI mechanisms and models
Reliability challenges of automotive power electronics
Comparison between BSIM4.X and HSPICE flicker noise models in NMOS and PMOS transistors in all operating regions
TCAD for reliability
Analysis of Cu-wire pull and shear test failure modes under ageing cycles and finite element modelling of Si-crack propagation
Failure analysis of power devices based on real-time monitoring
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection
Cycling copper flip chip interconnects
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Descrambling and data reading techniques for flash-EEPROM memories. Application to smart cards
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
Load characterization during transportation
Soft error rate comparison of 6T and 8T SRAM ICs using mono-energetic proton and neutron irradiation sources
The "trouble not identified" phenomenon in automotive electronics
Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysis
Time dependent modeling of single particle displacement damage in silicon devices
Influence of substrate temperature to prepare (1 0 3) oriented AlN films
The influence of humidity on the high voltage blocking reliability of power IGBT modules and means of protection
Modeling of NBTI saturation effect and its impact on electric field dependence of the lifetime
Low temperature direct bonding: An attractive technique for heterostructures build-up
Reduction of boron penetration through thin silicon oxide with a nitrogen doped silicon layer
Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions
Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects
Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Correlation between chemistry of polymer building blocks and microelectronics reliability
SrO capping effect for La 2 O 3 /Ce-silicate gate dielectrics
Modern IC packaging trends and their reliability implications
Development of a fast method for optimization of Au ball bond process
Radiation hardened by design techniques to reduce single event transient pulse width based on the physical mechanism
Automatic process for time-frequency scan of VLSI
SiC power devices packaging with a short-circuit failure mode capability
ESD robustness of thin-film devices with different layout structures in LTPS technology
Improvement of emission efficiency and color rendering of high-power LED by controlling size of phosphor particles and utilization of different phosphors
Performance improvement of self-aligned HfO 2 /TaN and SiON/TaN nMOS transistors
Capacitive RF MEMS analytical predictive reliability and lifetime characterization
Voltage scaling and aging effects on soft error rate in SRAM-based FPGAs
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
Hybrid-cell register files design for improving NBTI reliability
An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies
Adaptive and robust prediction for the remaining useful life of electrolytic capacitors
Structural health monitoring based on continuous ACO method
An investigation of the mechanical behavior of conductive elastomer interconnects
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications
IGBT junction and coolant temperature estimation by thermal model
NBTI product level reliability for a low-power SRAM technology
Noise and transport characterisation of tantalum capacitors
Extraction of interface states at emitter-base heterojunctions in AlGaAs/GaAs heterostructure bipolar transistors using sub-bandgap photonic excitation
The radiation test based assessment of process quality and reliability for conventional 65-nm CMOS technology
Assessing body built-in current sensors for detection of multiple transient faults
On the use of high-impedance power supplies to reduce the substrate switching noise in system-on-chips
Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws
Silicon nitride etch characteristics in SF 6 /O 2 and C 3 F 6 O/O 2 plasmas and evaluation of their global warming effects
Permanent and single event transient faults reliability evaluation EDA tool
Optimal Reliability Design: Fundamentals and Applications; Way Kuo, Rajendra Prasad, Frank A. Tillman, Ching-Lai Mwang. Cambridge University Press, Cambridge, 2001, 389+XXI pp. ISBN: 0-521-78127-2 (hardbound)
A novel correlative model of failure mechanisms for evaluating MEMS devices reliability
QALT study of scintillating material in digital flat panels for medical imaging
Strength violation effect on soft-error detection in sub-micron technology
Impact of interface nature on deep sub-micron Al-plug resistance
Simulation of the influence of TiAl 3 layers on the thermal-electrical and mechanical behaviour of Al metallizations
DIRT latch: A novel low cost double node upset tolerant latch
Dynamic modeling for resin self-alignment mechanism
Reliable study of time- and frequency-domain EMI-induced noise in Wien bridge oscillator
Short-circuit protection for an IGBT with detecting the gate voltage and gate charge
Total ionizing dose and single event effects of 1 Mb HfO 2 -based resistive-random-access memory
Corrigendum to "Junction temperature management of IGBT module in power electronic converters" [Microelectron. Reliab. 54 (2014) 2788-2795]
Estimation of warpage and thermal stress of IVHs in flip-chip ball grid arrays package by FEM
Finite element modeling on electromigration of solder joints in wafer level packages
Mechanism of nitrogen-enhanced negative bias temperature instability in pMOSFET
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability
Hot carrier effect on a single SiGe HBT's EMI response
A hybrid approach for UAV flight data estimation and prediction based on flight mode recognition
Statistics of retention failure in the low resistance state for hafnium oxide RRAM using a Kinetic Monte Carlo approach
Physical analysis of hard and soft breakdown failures in ultrathin gate oxides
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
SEL-UP: A CAD tool for the sensitivity analysis of radiation-induced Single Event Latch-Up
Design and implementation of a low cost test bench to assess the reliability of FPGA
Prediction of thermo-mechanical integrity of wafer backend processes
Failure Analysis of RuO 2 Thick Film Chip Resistors
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current
Dynamic NBTI lifetime model for inverter-like waveform
Optical source reliability in recent optical fiber transmission systems and consumer electronics
Electrical Overstress of Integrated Circuits
Dependability of Engineering Systems: J.M. Nahman, Springer-Verlag, Berlin, Heidelberg, New York, 2002, 192 pages
Gregory A. Matson, Tony R. Taylor, Julie N. Villar, Elements of STIL: Principles and Applications of IEEE Std. 1450, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp 291, plus XIX, ISBN 1-4020-7637-1
Improvement of multicores throughput based on environmental conditions
Improved performance of GeON as charge storage layer in flash memory by optimal annealing
Phase separation-suppressed and strain-modulated improvement of crystalline quality of AlGaN epitaxial layer grown by MOCVD
Threshold voltage instability characteristics of HfO 2 dielectrics n-MOSFETs
Evaluation of SiGe: C HBT intrinsic reliability using conventional and step stress methodologies
A review of latchup and electrostatic discharge (ESD) in BiCMOS RF silicon germanium technologies: Part I - ESD
High-performance Energy-efficient Microprocessor Design, Vojin Oklobdzija, Ram K. Krishnamurthy (Eds.), Dordrecht, The Netherlands, Springer (2006), 338 pp., Hardcover, ISBN: 0-387-28594-6
Determination of contact parameters of Ni/n-GaP Schottky contacts
Analysis of triggering behaviour of high voltage CMOS LDMOS clamps and SCRs during ESD induced latch-up
Integrated process capability analysis with an application in backlight module
High temperature storage reliability of palladium coated copper wire in different EFO current settings
High temperature performances of normally-off p-GaN gate AlGaN/GaN HEMTs on SiC and Si substrates for power applications
Comprehensive 2D-carrier profiling of low-doping region by high-sensitivity scanning spreading resistance microscopy (SSRM) for power device applications
A new method to quantify retention-failed cells of an EEPROM CAST
A frequency-domain approach to interconnect crosstalk simulation and minimization
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow
"Hot-plugging" of LED modules: Electrical characterization and device degradation
Modelling mobility degradation due to remote Coulomb scattering from dielectric charges and its impact on MOS device performance
Electromigration lifetimes and void growth at low cumulative failure probability
Noise and reliability in simulated thin metal films
Burnout properties of microwave pulse injected on GaAs PHEMT
Power grid redundant path contribution in system on chip (SoC) robustness against electromigration
Reliability investigation and characterization of failure modes in Schottky diodes
A bottom-up approach for System-On-Chip reliability
Numerical and experimental analysis of EMI effects on circuits with MESFET devices
A Novel Power Module Design and Technology for Improved Power Cycling Capability
Impact of probing procedure on flip chip reliability
A temperature study of photosensitivity in SLS polycrystalline silicon TFTs
ESD on GaN-based LEDs: An analysis based on dynamic electroluminescence measurements and current waveforms
Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, ISBN 1-4020-7671-1, pp 294, plus IX
Photoacoustic inspection of thermal properties of layered structure with pulse excitations