yusuke1997/dblp-id-title huggingface dataset:
Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films
Dielectric reliability of stacked Al 2 O 3 -HfO 2 MIS capacitors with cylinder type for improving DRAM data retention characteristics
ESD robust high-voltage active clamps
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill
Heat dissipation design and analysis of high power LED array using the finite element method
Effects of uni-axial mechanical stress on IGBT characteristics
Pin-pin ESD protection for electro-explosive device under severe human body ESD
Design and development of MEMS-based structures for in-situ characterization of thermo-mechanical behaviour of thin metal films
NBTI degradation in STI-based LDMOSFETs
PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization
Temperature accelerated discharging processes through the bulk of PECVD silicon nitride films for MEMS capacitive switches
Optimization of WSi 2 by SiH 4 CVD: impact on oxide quality
Effects of electron beam generated in vacuum photo-thermal processing on metal-silicon contacts
CAD navigation system, for backside waveform probing of CMOS devices
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI)
Degradation of vertical GaN-on-GaN fin transistors: Step-stress and constant voltage experiments
Hot carrier and soft breakdown effects on LNA performance for ultra wideband communications
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method
Degradation Based Long-Term Reliability Assessment for Electronic Components in Submarine Applications
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices
Thermodynamic study on the corrosion mechanism of copper wire bonding
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
Using error tolerance of target application for efficient reliability improvement of digital circuits
LDMOSFET with drain potential suppression for 100 V Power IC technology
Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography
Progress in power semiconductor devices
Asymmetric resistive switching behaviour in a Au/a-C: Co/Au planar structure
Influence of local thermal dissipation on electromigration in an Al thin-film line
Using S-parameter measurements to determine the threshold voltage, gain factor, and mobility degradation factor for microwave bulk-MOSFETs
Concurrent PBTI and hot carrier degradation in n-channel MuGFETs
Effect of nano-Al 2 O 3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints
A Novel Application of C-AFM: Deep Sub-micron Single Probing for IC Failure Analysis
Temperature effects on the ruggedness of SiC Schottky diodes under surge current
An approximate solution for electrolyte concentration distribution in physics-based lithium-ion cell models
DC-DC's total ionizing dose hardness decrease in passive reserve mode
Qualification extension of automotive smart power and digital ICs to harsh aerospace mission profiles: Gaps and opportunities
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests
Influence of nitradation in ultra-thin oxide on the gate current degradation of N and PMOS devices
Backside spectroscopic photon emission microscopy using intensified silicon CCD
Scalability comparison between raised- and embedded-SiGe source/drain structures for Si 0.55 Ge 0.45 implant free quantum well pFET
System-on-package: a broad perspective from system design to technology development
Reliability assessment of 1.55-µm vertical cavity surface emitting lasers with tunnel junction using high-temperature aging tests
LVTSCR structures for latch-up free ESD protection of BiCMOS RF circuits
The effect of small-signal AC voltages on C-V characterization and parameter extraction of SiO 2 thin films
Reliability Physics and Engineering: Time-to-Failure Modeling, J.W. McPherson. Springer (2010). 318 pp., ISBN: 978-1-4419-6347-5
On the data interpretation of the C-AFM measurements in the characterization of thin insulating layers
Reliability assessment of CMOS differential cross-coupled LC oscillators and a novel on chip self-healing approach against aging phenomena
High cycle fatigue testing of thermosonic ball bonds
CEDAR: Modeling impact of component error derating and read frequency on system-level vulnerability in high-performance processors
Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics
Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors
Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy
Low-capacitance ESD protection design for high-speed I/O interfaces in a 130-nm CMOS process
Single-event transient effects on dynamic comparator in 28 nm FDSOI CMOS technology
Negative bias temperature instability (NBTI) recovery with bake
Reliability evaluation for single event crosstalk via probabilistic transfer matrix
Fast wafer level reliability monitoring as a tool to achieve automotive quality for a wafer process
Improvement of signal to noise ratio in electro optical probing technique by wavelets filtering
High stability and robustness of a developed novel laser acupuncture theranostic device
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications
Origin of 1/f noise in lateral PNP bipolar transistors
Evaluation of radiation-induced soft error in majority voters designed in 7 nm FinFET technology
High-K dielectric deposition in 3D architectures: The case of Ta 2 O 5 deposited with metal-organic precursor TBTDET
A holistic comparison of the different resampling algorithms for particle filter based prognosis using lithium ion batteries as a case study
End of life and acceleration modelling for power diodes under high temperature reverse bias stress
Issues concerning charged device model ESD verification modules - the need to move to alumina
Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique
Thin film joining for high-temperature performance of power semi-conductor devices
Study of current saturation behaviors in dual direction SCR for ESD applications
A fast moisture sensitivity level qualification method
Trade-off analysis of the p-base doping on ruggedness of SiC MOSFETs
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration
Improving the reliability of electronic paper display using FMEA and Taguchi methods: A case study
FD MOS SOI circuit to enhance the ratio of illuminated to dark current of a co-integrated a-Si: H photodiode
New degradation mechanism observed for AlGaN/GaN HEMTs with sub 100 nm scale unpassivated regions around the gate periphery
Analogue electronic circuit diagnosis based on ANNs
La 2 O 3 gate dielectrics for AlGaN/GaN HEMT
Simulation of migration effects in nanoscaled copper metallizations
A review of board level solder joints for mobile applications
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA
The impact of static and dynamic degradation on SOI "smart-cut" floating body MOSFETs
Spin polarization in a two-dimensional electron gas modulated by ferromagnetic and Schottky metal stripes
Fabrication and characterization of microscale heat sinks
Chemical and physical limits on the performance of metal silicate high-k gate dielectrics
Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application
Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components
Electron transport in implant isolation GaAs layers
Overview on ESD protection design for mixed-voltage I/O interfaces with high-voltage-tolerant power-rail ESD clamp circuits in low-voltage thin-oxide CMOS technology
Parametric defect localization on integrated circuits - From static laser stimulation to real-time variation mapping (RTVM)
pH sensing reliability of flexible ITO/PET electrodes on EGFETs prepared by a roll-to-roll process
Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module
The coherence of the gate and drain noise in stressed AlGaAs-InAlGaAs PHEMTs
Reliability assessment of power conditioner considering maintenance in a PEM fuel cell system
Low-voltage CMOS log companding analog design; Francisco Sera-Graells, Andoracion Rueda, Jose L. Huertas. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 192, plus XXV, 117 euro. ISBN 1-4020-7445-X
Algorithm for automatic alignment in 2D space by object transformation
Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme
Uncertainty analysis of solder alloy material parameters estimation based on model calibration method
Degradation and recovery of variability due to BTI
Thermal management and reliability of multi-chip power modules
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures
Effect of Ag on oxidation of Cu-base leadframe
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps
Wire width dependence of hot carrier degradation in silicon nanowire gate-all-around MOSFETs
Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test
Thermal damage in SiC Schottky diodes induced by SE heavy ions
Failure and failure characterization of QFP package interconnect structure under random vibration condition
Diffusivity variation in Electromigration failure
Stress Mechanism about Field Lightning Surge of High Voltage BJT Based Line Driver for ADSL System
Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K
Data communication
Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials
High performance of CNT-interconnects by the multi-layer structure
Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes
Book review: Effective FMEAs
Total-ionizing-dose effects and reliability of carbon nanotube FET devices
Investigations of impact ionization phenomena in advanced transistors and speed-power improvement of BiMOS SRAM cells based on reverse base current effect
New method of qualification applied to optical amplifier with electronics
Comparison of metal gate electrodes on MOCVD HfO 2
A prediction method for discharge voltage of lithium-ion batteries under unknown dynamic loads
Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers
Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull
Degradation transformation in spinel-type functional thick-film ceramic materials
Exploring design diversity redundancy to improve resilience in mixed-signal systems
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers
A note on "using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly"
Electromigration in width transition copper interconnect
Mechanical stress effects on electrical breakdown of freestanding GaN thin films
A study on 1/f noise spectrum generation in nonlinear transmission media and biomedical systems
Study on the performance of sub 100 nm LACLATI MOSFETs for digital application
Modeling gallium arsenide heterojunction bipolar transistor ledge variations for insight into device reliability
Identifying the spatial position and properties of traps in GaN HEMTs using current transient spectroscopy
Mechanical Reliability of MEMS-structures under shock load
BTI and HCI first-order aging estimation for early use in standard cell technology mapping
Numerical study of ductile failure morphology in solder joints under fast loading conditions
Foreword to the special issue on 20th IEEE international symposium on design and diagnostics of electronic circuits and systems (DDECS2017)
High temperature storage reliability investigation of the Al-Cu wire bond interface
Assessment of sense measurement duration on BTI degradation in MG/HK CMOS technologies using a novel stacked transistor test structure
Degradation of pMOSFETs due to hot electron induced punchthrough
OBIRCH analysis of electrically stressed advanced graphic ICs
Lifetime estimation of modular cascaded H-bridge MLPVI for grid-connected PV systems considering mission profile
Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties
The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs
Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps
Identification of foreign particles in packages of failed products by application of our modified failure analysis flow
Temperature, humidity, and bias acceleration model for a GaAs pHEMT process
Compact conduction band model for transition-metal dichalcogenide alloys
The influence of packaging materials on RF performance
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node
Reliability modeling on a MOSFET power package based on embedded die technology
A new thermal model for power MOSFET devices accounting for the behavior in unclamped inductive switching
Thermal characterization and modeling of power hybrid converters for distributed power systems
Temperature dependent electrical and dielectric properties of Sn/p-Si metal-semiconductor (MS) structures
Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors
Use of scanning capacitance microscopy for controlling wafer processing
A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO 2 and nitride-oxide dielectrics
A low-level software-based fault tolerance approach to detect SEUs in GPUs' register files
Improving reliability of beveled power semiconductor devices passivated by SIPOS
Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules
Characterisation of the Al 2 O 3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H-SiC devices
A new health estimation model for CNC machine tool based on infinite irrelevance and belief rule base
Reliability of TCT and HH/HT test performed in chips and flex substrates assembled by thermosonic flip-chip bonding process
Functional delay test generation based on software prototype
Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
Defect-related degradation of Deep-UV-LEDs
Design and simulation of micromechanical thermal converter for RF power sensor microsystem
Synergistic effects of NPN transistors caused by combined proton irradiations with different energies
Influence of the manufacturing process on the electrical properties of thin (k stacks observed with CAFM
Die repackaging for failure analysis
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
Highly reliable and low-power magnetic full-adder designs for nanoscale technologies
Direct temperature measurement of integrated microelectronic devices by thermally induced leakage currents
Impact of substituting SiO 2 ILD by low k materials into AlCu RIE metallization
Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners
Encapsulation of naked dies for bulk silicon etching with TMAH
Optimization of the Cu wire bonding process for IC assembly using Taguchi methods
A prognostic method for predicting failure of dc/dc converter
Effect of autoclave test on anisotropic conductive joints
Subsurface analysis of semiconductor structures with helium ion microscopy
Fast thermal fatigue on top metal layer of power devices
Improved step stress accelerated life testing method for electronic product
Moisture diffusion modeling - A critical review
A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging
Reliability investigations on HBV using pulsed electrical stress
Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model
Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method
AlN capping layer inserted between Cu and SiCN dielectric barrier layer for enhancing reliability of 28 nm technological node and beyond
Gate dielectric breakdown in the time-scale of ESD events
An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors
ESD Susceptibility of Submicron Air Gaps
Study of RF N - LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF
Experimental study of bump void formation according to process conditions
Reliability and wearout characterisation of LEDs
Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE
Investigation of geometry dependence on MOSFET linearity in the impact ionization region using Volterra series
Multiscale modelling of multilayer substrates
Impact of hot carrier injection on switching time evolution for power RF LDMOS after accelerated tests
Reliability issues of e-Cubes heterogeneous system integration
A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain
Research on fault diagnosis of airborne fuel pump based on EMD and probabilistic neural networks
A time error model for time-based PWM pixel with correlated double sample in the circumstance of nonlinear response
Failure analysis and detection methodology for capacitive RF-MEMS switches based on BEOL BiCMOS process
Analysis of Cu/low-k bond pad delamination by using a novel failure index
Experimental and simulation studies of resistivity in nanoscale copper films
Dynamic responses and solder joint reliability under board level drop test
Effects of stair case gate bias stress in IGZO/Al 2 O 3 flexible TFTs
STEM role in failure analysis
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core
A self-consistent extraction procedure for source/drain resistance in MOSFETs
Effects of zirconium doping on the characteristics of tin oxide thin film transistors
A 3000 hours DC Life Test on AlGaN/GaN HEMT for RF and microwave applications
Study of passivation defects by electroluminescence in AlGaN/GaN HEMTS on SiC
Environmental Effects on Interfacial Adhesion
Integrating thick copper/Black Diamond TM layer in CMOS interconnect process for RF passive components
A plug-and-play wideband RF circuit ESD protection methodology: T-diodes
ESD protection structure with reduced capacitance and overshoot voltage for high speed interface applications
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints
SEU sensitivity of Junctionless Single-Gate SOI MOSFETs-based 6T SRAM cells investigated by 3D TCAD simulation
Mechanism of gate dielectric degradation by hydrogen migration from the cathode interface
Mission profile resolution impacts on the thermal stress and reliability of power devices in PV inverters
Robust Electromigration reliability through engineering optimization
Impacts of the recovery phenomena on the worst-case of damage in DC/AC stressed ultra-thin NO gate-oxide MOSFETs
Degradation of double-gate polycrystalline silicon TFTs due to hot carrier stress
Low voltage SILC and P- and N-MOSFET gate oxide reliability
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria
Sample tilting technique for preventing electrostatic discharge during high-current FIB gas-assisted etching with XeF 2
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection
Protective coatings of electronics under harsh thermal shock
A fast, flexible, and easy-to-develop FPGA-based fault injection technique
Investigations on electro-optical and thermal performances degradation of high power density GaAs-based laser diode in vacuum environment
Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam
Drain currents and their excess noise in triple gate bulk p-channel FinFETs of different geometry
Hydrogen transport in doped and undoped polycrystalline silicon
Experimental observation of gate geometry dependent characteristic degradations of the multi-finger MOSFETs
Aging sensors for on-chip metallization of integrated LDMOS transistors under cyclic thermo-mechanical stress
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology
An optical characterization technique for hygroscopic expansion of polymers and plastic packages
Open contact analysis of single bit failure in 0.18 mum technology
A new compact model for external latchup
Degradation of static and dynamic behavior of CMOS inverters during constant and pulsed voltage stress
Improving an LDMOST by variation of lateral doping on epitaxial-layer drift region
On-line testable data path synthesis for minimizing testing time
Oxide and interface trap densities estimation in ultrathin W/La 2 O 3 /Si MOS capacitors
A study on the improved programming characteristics of flash memory with Si 3 N 4 /SiO 2 stacked tunneling dielectric
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation
Statistical nature of hard breakdown recovery in high-κ dielectric stacks studied using ramped voltage stress
The effect of gate overlap lightly doped drains on low temperature poly-Si thin film transistors
Comparative study of low-frequency noise in 0.18 μm and 0.35 μm gate-length nMOSFETs with gate area of 1.1 μm 2
Modeling of SET seasoning effects in Phase Change Memory arrays
Methodology for predicting solder joint reliability in semiconductor packages
Fabrication and advanced electrical and stability characterization of laser-shaped thick-film and LTCC microresistors for high temperature applications
Carrier trapping in thin N 2 O-grown oxynitride/oxide di-layer for PowerMOSFET devices
Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling