yusuke1997/dblp-id-title huggingface dataset:
Trench MOS barrier Schottky rectifier formed by counter-doping trench-bottom implantation
Real-time fault-tolerance with hot-standby topology for conditional sum adder
Evaluation of conductive-to-resistive layers interaction in thick-film resistors
Reliability improvements in passive components
A methodology for microcontroller signal frequency stress prediction
Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices
Implementation, analysis and performance evaluation of the IRP replacement policy
Online test method of FPGA solder joint resistance with low power consumption
Parallel algorithm for finding modules of large-scale coherent fault trees
A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
Analysis of burn-in time using the general law of reliability
NBTI and hot carrier effect of Schottky-barrier p-MOSFETs
Using instruction result locality and re-execution to mitigate silent data corruptions
Thermal deformation measurements and predictions of MAP-BGA electronic packages
Accelerated testing for time dependent dielectric breakdown (TDDB) evaluation of embedded DRAM capacitors using tantalum pentoxide
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
PTM-based hybrid error-detection architecture for ARM microprocessors
Photo-CVD process for ultra thin SiO 2 films
A high level synthesis design flow with a novel approach for efficient design space exploration in case of multi-parametric optimization objective
Joseph Cavanagh, Sequential Logic: Analysis and Synthesis , CRC Taylor and Francis Group, Boca Raton (2007) ISBN 0-8493-7564-9 Hardcover, pp 896, plus XIII
Thermal instability during short circuit of normally-off AlGaN/GaN HFETs
Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements
Power capability limits of power MOSFET devices
Decreasing variation in paste printing using statistical process control
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Acceleration factor for ageing measurement of dye solar cells
A symbolic approach to design centering of analog circuits
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
Soft-errors induced by terrestrial neutrons and natural alpha-particle emitters in advanced memory circuits at ground level
Passivation and packaging of positive bevelled edge termination and related electrical stability
A novel analytical method for defect tolerance assessment
Study of front-side connected chemical field effect transistor for water analysis
Estimation of power MOSFET junction temperature during avalanche mode: Experimental tests and modelling
Blazed diffraction gratings fabricated using X-ray lithography: fabrication, modeling and simulation
AVD ® technology for deposition of next generation devices
Total ionizing dose effect in 0.2 μm PDSOI NMOSFETs with shallow trench isolation
Thermomechanical modeling and simulation of a silicone gel for power electronic devices
Power cycling tests for accelerated ageing of ultracapacitors
Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment
Recent developments in silicon optoelectronic devices
An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applications
Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels -An explanation and die protection strategy
ESR concerns in tantalum chip capacitors exposed to non-oxygen-containing environments
Key reliability concerns with lead-free connectors
Fatigue and resistance analysis of COG modules using electro-mechanical coupling method
Study of glass frit induced stiction using a micromirror array
The synergetic effects of high temperature gate bias and total ionization dose on 1.2 kV SiC devices
Low cost and highly reliable radiation hardened latch design in 65 nm CMOS technology
Hot electrons induced degradation in lattice-matched InAlN/GaN high electron mobility transistors
Improving the short circuit ruggedness of IGBTs
Impact of gate placement on RF power degradation in GaN high electron mobility transistors
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires
Identification of the degradation state for condition-based maintenance of insulated gate bipolar transistors: A self-organizing map approach
A novel mechanical diced trench structure for warpage reduction in wafer level packaging process
A study on the performance and reliability of magnetostatic actuated RF MEMS switches
Dynamic study of the thermal laser stimulation response on advanced technology structures
Effects of HPEM stress on GaAs low-noise amplifier from circuit to component scale
Reliability of metamorphic HEMTs on GaAs substrates
Device to circuit reliability correlations for metal gate/high-k transistors in scaled CMOS technologies
Fast electromigration wafer mapping for wafer fab process monitoring and improvement
Electro-thermal simulation of metal interconnections under high current flow
A novel impact test system for more efficient reliability testing
AlGaN/GaN Schottky barrier diodes on silicon substrates with various Fe doping concentrations in the buffer layers
Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La-Al-O gate dielectrics
A study on the tensile fracture mechanism of 15 μm copper wire after EFO process
Thermal analysis of InGaN/GaN (GaN substrate) laser diodes using transient interferometric mapping
High resolution observation of defects at SiO 2 /4H-SiC interfaces using time-resolved scanning nonlinear dielectric microscopy
ESD characterization of multi-chip RGB LEDs
A Wiener process model for accelerated degradation analysis considering measurement errors
Sub-threshold behavior of long channel undoped cylindrical surrounding-gate MOSFETs
Sequential combined thermal cycling and vibration test and simulation of printed circuit board
Alberto Leon-Garcia, Indra Widjaja, Communication Networks: Fundamental Concepts and Key Architectures, Second edition, McGraw Hill Higher Education, Boston, 2004, ISBN 0-07-119848-2. Hardcover, pp 900, plus XXVII
Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy
Estimating activation energies for multi-mode failures
Development of gold based solder candidates for flip chip assembly
The influence of microwave pulse width on the thermal burnout effect of an LNA constructed by a GaAs PHEMT
Capacitive effects in IGBTs limiting their reliability under short circuit
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses
The influence of electron-beam irradiation on electrical characteristics of metal-insulator-semiconductor capacitors based on a high-k dielectric stack of HfTiSiO(N) and HfTiO(N) layers
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
VLSI functional analysis by dynamic emission microscopy
A comparative study of charge pumping circuits for flash memory applications
NBTI reliability of Ni FUSI/HfSiON gates: Effect of silicide phase
Rohit Kapur, CTL for Test Information of Digital ICs Hardcover. Kluwer Academic Publisher, Boston, 2003. pp 173, plus XI, ISBN 1-4020-7293-7
Tim Kogel, Rainer Leupers and Heinrich Meyr, Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processors Platforms , Springer, Dordercht (2006) ISBN 1-4020-4825-4 Hardcover, 199 pp., plus XIV
Admittance spectroscopy of traps at the interfaces of (100)Si with Al 2 O 3 , ZrO 2 , and HfO 2
Comparison of Si < 100 > and < 110 > crystal orientation nanowire transistor reliability using Poisson-Schrödinger and classical simulations
ESD sensitivity of a GaAs MMIC microwave power amplifier
Observation of impurity diffusion defect in IGBT using a laser terahertz emission microscope technique
Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction
Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys
Voltage acceleration of time-dependent breakdown of ultra-thin gate dielectrics
Deep neural networks-based rolling bearing fault diagnosis
Automotive IC reliability: Elements of the battle towards zero defects
Body effect induced wear-out acceleration in ultra-thin oxides
A new electrothermal average model of the diode-transistor switch
Analysis of aging effects - From transistor to system level
Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines
Effects of impurity concentration, hydrogen plasma process and crystallization temperature on poly-crystalline films obtained from PECVD a-Si: H layers
Annealing and thickness related performance and degradation of polymer solar cells
Effects of buffer compensation strategies on the electrical performance and RF reliability of AlGaN/GaN HEMTs
Electrical characteristics of a-IGZO transistors along the in-plane axis during outward bending
Comparison of low-temperature electrical characteristics of gate-all-around nanowire FETs, Fin FETs and fully-depleted SOI FETs
Comphy - A compact-physics framework for unified modeling of BTI
Two-dimensional numerical simulations of 1/f noise by GR mechanisms in thin film transistors: Effects of induced defect technology
A study on IGBT junction temperature (Tj) online estimation using gate-emitter voltage (Vge) at turn-off
Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integration
High injection effects on noise characteristics of Si BJTs and SiGe HBTs
A methodology to extract failure rates for low-k dielectric breakdown with multiple geometries and in the presence of die-to-die linewidth variation
Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test
2-Step algorithm for automatic alignment in wafer dicing process
Physics-based modeling of TID induced global static leakage in different CMOS circuits
Impact on the back gate degradation in partially depleted SOI n-MOSFETs by 2-MeV electron irradiation
Signal characteristic and test exploitation for intermittent nanometer-scale cracks
Femtosecond Laser Ablation for Backside Silicon Thinning
Characterization and modelling of single event transients in LDMOS-SOI FETs
Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines
Trench DMOS interface trap characterization by three-terminal charge pumping measurement
Unified soft breakdown MOSFETs compact model: From experiments to circuit simulation
Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness
On the calculation of gate tunneling currents in ultra-thin metal-insulator-semiconductor capacitors
Crossbar array of selector-less TaO x /TiO 2 bilayer RRAM
Accurate lifetime prediction for channel hot carrier stress on sub-1 nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer
LTCC package for high temperature applications
In memory of Pierre Rossel
Comparison between trap and self-heating induced mobility degradation in AlGaN/GaN HEMTs
Modification of porous ultra-low K dielectric by electron-beam curing
Pre- and post-BD electrical conduction of stressed HfO 2 /SiO 2 MOS gate stacks observed at the nanoscale
Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties
Fully-differential transimpedance amplifier for reliable wireless communications
Investigation of enhanced low dose rate sensitivity in SiGe HBTs by 60 Co γ irradiation under different biases
Wafer Level Accelerated test for ionic contamination control on VDMOS transistors in Bipolar/CMOS/DMOS
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method
Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures
Designing in reliability in advanced CMOS technologies
Die-attachment solutions for SiC power devices
Extraction of VBIC model parameters for InGaAsSb DHBTs
Volume impacts on GaAs reliability improvement
Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading
A model for the critical voltage for electrical degradation of GaN high electron mobility transistors
Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures
Reverse current thermal activation of AlGaN/GaN HEMTs on Si(1 1 1)
The quest for optimum technology of power semiconductor devices
The model parameter extraction and simulation for the effects of gamma irradiation on the DC characteristics of InGaP/GaAs single heterojunction bipolar transistors
Power cycling analysis method for high-voltage SiC diodes
Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC
Frequency mapping in dynamic light emission with wavelet transform
Glucose biosensor of ruthenium-doped TiO 2 sensing electrode by co-sputtering system
SHARC: An efficient metric for selective protection of software against soft errors
Ultra wide voltage range consideration of reliability-aware STT magnetic flip-flop in 28 nm FDSOI technology
Influence of temperature of storage, write and read operations on multiple level cells NAND flash memories
Comparison of hydrothermal performance between plate fins and plate-pin fins subject to nanofluid-cooled corrugated miniature heat sinks
Early reliability assessment by using deep censoring
Charge carrier recombination and generation analysis in materials and devices by electron and optical beam microscopy
Systems-in-foil - Devices, fabrication processes and reliability issues
A CORDIC-based digital protective relay and its architecture
Chemical and diffusion-controlled curing kinetics of an underfill material
Effects of RF power on the structural, optical and electrical properties of Al-doped zinc oxide films
New insight on negative bias temperature instability degradation with drain bias of 28 nm High-K Metal Gate p-MOSFET devices
Prediction of crack growth in IC passivation layers
Characterization and modeling of laser-induced single-event burn-out in SiC power diodes
Acoustic emission for detecting deterioration of capacitors under aging
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
High reliability level demonstrated on 980nm laser diode
Observation and mechanism explanation of the parasitic charge pumping current
Failure mechanism of Ag nanowire-coated conductive transparent electrode for wearable devices under folding and torsional fatigue condition
Reliability of Contacts for Press-Pack High-Power Devices
A physical large-signal model for GaN HEMTS including self-heating and trap-related dispersion
New methodology for the assessment of the thermal resistance of laser diodes and light emitting diodes
Random vibration analysis of 3-Arc-Fan compliant interconnects
Impact of negative bias temperature instability on the single-event upset threshold of a 65 nm SRAM cell
Performance and reliability improvement of flash device by a novel programming method
A unified look at the use of successive differentiation and integration in MOSFET model parameter extraction
Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation
Effects of the sputtering deposition process of metal gate electrode on the gate dielectric characteristics
Shuvra S. Bhattacharyya, E.F. Deprettere, Jurgen Teich, (Eds.), Domain-Specific Processors: Systems, Architectures, Modeling, and Simulation, Hardcover, pp 261, plus XV, Marcel Dekker, Inc., New York, 2004, ISBN 0-8427-4711-9
The influence of microwave pulse repetition frequency on the thermal burnout effect of a PIN diode limiting-amplifying system
Comprehensive separate extraction of parasitic resistances in MOSFETs considering the gate bias-dependence and the asymmetric overlap length
Characterization of crystalline MOCVD SrTiO 3 films on SiO 2 /Si(100)
Influence of the annealing temperature on the IR properties of SiO 2 films grown from SiH 4 +O 2
Reliability and reliability investigation of wide-bandgap power devices
Experimental evidence of "latent gate oxide damages" in medium voltage power MOSFET as a result of heavy ions exposure
Reliability of large periphery GaN-on-Si HFETs
Flip-chip structure transient thermal model
Effect of reverse substrate bias on ultra-thin gate oxide n-MOSFET degradation under different stress modes
Monte Carlo simulation of emission site, angular and energy distributions of secondary electrons in silicon at low beam energies
Design optimization of gate-silicided ESD NMOSFETs in a 45 nm bulk CMOS technology
Introducing a scale structure to correlate quality and reliability
A novel accelerated test technique for assessment of mechanical reliability of solder interconnects
Dimitris Gizopoulos, Antonis Paschalis and Yervant Zorian, Embedded Processor-Based Self Test , Kluwer Academic Publishers, Dordrecht (2004) ISBN 1-4020-2785-0 217 pp., Hardcover, plus XV
Low-distortion 4th order programmable Butterworth filter
Effect of enhanced-mobility current path on the mobility of AOS TFT
Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder
Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
Electromagnetic immunity model of an ADC for microcontroller's reliability improvement
Hot carrier reliability of RF N- LDMOS for S Band radar application
A study of field emission process in electrostatically actuated MEMS switches
A novel prediction method based on the support vector regression for the remaining useful life of lithium-ion batteries
A cross-layer SER analysis in the presence of PVTA variations
UV LEDs reliability tests for fluoro-sensing sensor application
Modeling of enhancement factor of hole mobility for strained silicon under low stress intensity
Natural radiation events in CCD imagers at ground level
Reliability aspects of semiconductor devices in high temperature applications
Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure
Could electronics reliability be predicted, quantified and assured?
The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability
Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles
Oxidation of Au 4 Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175degreeC
Model for life prediction of fatigue-creep interaction
Experimental and statistical study in adhesion features of bonded interfaces of IC packages
Device characteristics of AlGaN/GaN MIS-HEMTs with high-k Hf x Zr 1 - x O 2 (x = 0.66, 0.47, 0.15) insulator layer
A study of the effects of tunneling currents and reliability of sub-2 nm gate oxides on scaled n-MOSFETs
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding
Improvement of high-voltage junction termination extension (JTE) by an optimized profile of lateral doping (VLD)
Chromatic and spherical aberration correction for silicon aplanatic solid immersion lens for fault isolation and photon emission microscopy of integrated circuits
Injection Mechanisms and Lifetime Prediction with the Substrate Voltage in 0.15mum Channel-Length N-MOSFETs
Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas
A 0.35 µm CMOS divide-by-2 quadrature injection-locked frequency divider based on voltage-current feedback topology
The influence of ferroelectric-electrode interface layer on the electrical characteristics of negative-capacitance ferroelectric double-gate field-effect transistors
Electrical degradation and recovery of dielectrics in n ++ -poly-Si/SiO x /SiO 2 /p-sub structures designed for application in low-voltage non-volatile memories
Analysis and design of thin film resonator ladder filters
Probability calculation of read failures in nano-scaled SRAM cells under process variations
Characterization and fatigue damage simulation in SAC solder joints
Investigation of Sensitivity Improvement on Passive Voltage Contrast for Defect Isolation
The characterization of retention properties of metal-ferroelectric (PbZr 0.53 Ti 0.47 O 3 )-insulator (Dy 2 O 3 , Y 2 O 3 )-semiconductor devices
Experimental analysis of Ga 2 O 3 : Ti films grown on Si and glass substrates
Reliability evaluation of Si-dies due to assembly issues
Novel high performance CMOS current conveyor
Thermal impedance spectroscopy of power modules
High abstraction level permutational ESD concept analysis
Source electrode evolution of a low voltage power MOSFET under avalanche cycling
A 2D compact model for lightly doped DG MOSFETs (P-DGFETs) including negative bias temperature instability (NBTI) and short channel effects (SCEs)
A wafer-level approach to device lifetesting
Defect analysis concerning variation in characteristics of PIN diode for Hybrid Vehicles
Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter
Power cycling issues and challenges of SiC-MOSFET power modules in high temperature conditions
Reliability of amorphous InGaZnO TFTs with ITO local conducting buried layer for BEOL power transistors
Role of process parameters on bondability and pad damage indicators in copper ball bonding
Backside interferometric methods for localization of ESD-induced leakage current and metal shorts
Voltage oscillations during surge pulses induced by self-extinguishing non-destructive second breakdown in pn-junction diodes
Morphology changes in solder joints--experimental evidence and physical understanding
Influence of copper diffusion on the shape of whiskers grown on bright tin layers
Leakage paths identification in NVM using biased data retention
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications
Polymer film deposition with fine pitch openings by stencil printing
Silicon oxynitride integrated waveguide for on-chip optical interconnects applications
2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Case study of failure analysis in thin film silicon solar cell
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings
Study of proton radiation effect to row hammer fault in DDR4 SDRAMs
A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
Effect of bump size on current density and temperature distributions in flip-chip solder joints
A new statistical methodology predicting chip failure probability considering electromigration
A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications
Estimating the average junction temperature of AlGaInP LED arrays by spectral analysis
Probabilistic analysis of dynamic and temporal fault trees using accurate stochastic logic gates