yusuke1997/dblp-id-title huggingface dataset:
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging
Current transport mechanisms and trap state investigations in (Ni/Au)-AlN/GaN Schottky barrier diodes
Thermal modeling and design of power converters with tight thermal constraints
Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test
Electrochemical corrosion behaviour of copper under periodic wet-dry cycle condition
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online)
Investigation methods and approaches for alleviating charge trapping phenomena in ohmic RF-MEMS switches submitted to cycling test
Evaluating board level solder interconnects reliability using vibration test methods
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly
Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling
Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations
A new electro-optical transmission-line measurement-method revealing a possible contribution of source and drain contact resistances to GaN HEMT dynamic on-resistance
Influence of thermal contact resistance on thermal impedance of microelectronic structures
Effects of Bi segregation on the tensile properties of Cu/Cu 3 Sn(1 0 0) interface
Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs
Design and process related MIM cap reliability improvement
Stability of thin film resistors - Prediction and differences base on time-dependent Arrhenius law
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis
True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines
Enhanced finite element modelling of Cu electromigration using ANSYS and matlab
Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications (2017), Springer, ISBN: ISBN 978-3-319-29744-6 (Print) ISBN 978-3-319-29746-0 (Online)
Application of RPN analysis to parameter optimization of passive components
Efficient statistical capacitance extraction of nanometer interconnects considering the on-chip line edge roughness
Gate tunneling leakage current behavior of 40 nm PD SOI NMOS device considering the floating body effect
A new finite element approach to stress analysis in microfabrication technology
Investigation of moisture-induced failures of stacked-die package
Dynamic behavior of resistive faults in nanometer technology
Bias-HAST on tape ball grid array (TBGA) test pattern
In the memory of Georges Charitat
An introduction to Cu electromigration
Electrical modeling of the photoelectric effect induced by a pulsed laser applied to an SRAM cell
Numerical approach to characterization of thermally conductive adhesives
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures
Mechanical stress-induced degradation model of amorphous InGaZnO thin film transistors by strain-initiated defect generation
A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation
Transition voltage of AlGaN/GaN heterostructure MSM varactor with two-dimensional electron gas
Influence of various process steps on the reliability of PMOSFETs submitted to negative bias temperature instabilities
Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
Application of time resolved emission techniques within the failure analysis flow
Processing and recognition of the thermal images using wavelet transforms
Coupled electro-magnetic field & Lorentz force effects in silicon and metal for ESD investigation in transient and harmonic regimes
Effect of annealing treatment and nanomechanical properties for multilayer Si 0.8 Ge 0.2 -Si films
Testing the effects of temperature cycling on tantalum capacitors
Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system
Vertically high-density interconnection for mobile application
Failure mechanism study and immunity modeling of an embedded analog-to-digital converter based on immunity measurements
Reliability/energy trade-off in Bluetooth error control schemes
On the Use of Neural Networks to Solve the Reverse Modelling Problem for the Quantification of Dopant Profiles Extracted by Scanning Probe Microscopy Techniques
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition
Reliability modeling and analysis of flicker noise for pore structure in amorphous chalcogenide-based phase-change memory devices
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages
On-chip circuit to monitor long-term NBTI and PBTI degradation
Thermal distribution calculations for block level placement in embedded systems
Influence of underfill materials on the reliability of coreless flip chip package
Performance properties in thick film silicate dielectric layers using molecular modeling
Real-time imaging of temperature distribution inside a power device under a power cycling test
Liquid crystal electrography: Electric field mapping and detection of peak electric field strength in AlGaN/GaN high electron mobility transistors
Assessment of temperature and voltage accelerating factors for 2.3-3.2 nm SiO 2 thin oxides stressed to hard breakdown
Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs
Influence of carrier lifetime distribution on the current filament in high voltage diode
Atomic-layer-deposited silicon-nitride/SiO 2 stack--a highly potential gate dielectrics for advanced CMOS technology
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line
Interface delamination analysis of TQFP package during solder reflow
Influence of a low field with opposite polarity to the stress on the degradation of 4.5 nm thick SiO 2 films
Temperature dependent optoelectronic properties of a non-intentionally created cleaved-coupled-cavity laser
Pattern image enhancement by extended depth of field
Failure signature analysis of power-opens in DDR3 SDRAMs
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
Towards the use of the conformal-evaporated-film-by-rotation technique in fabricating microelectronic circuits and microsystems
RF CMOS technology for MMIC
Thermal stability of back side metallization multilayer for power device application
Integration of analytical techniques in stochastic optimization of microsystem reliability
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors
Reliability analysis of pHEMT power amplifier with an on-chip linearizer
Modelling the impact of refinishing processes on COTS components for use in aerospace applications
Statistics of soft and hard breakdown in thin SiO 2 gate oxides
Impact of finger numbers on the performance of proton-radiated SiGe power HBTs at room and cryogenic temperatures
Fatigue life evaluation of aluminum bonding wire in silicone gel under random vibration testing
Tools for contactless testing and simulation of CMOS circuits
Dynamic compact thermal model of high power light emitting diode
Hotspots and performance evaluation of crystalline-silicon and thin-film photovoltaic modules
High reliable high power diode for welding applications
Reliability of planar, Super-Junction and trench low voltage power MOSFETs
Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices
Sensitivity tuning of a bulk built-in current sensor for optimal transient-fault detection
Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs)
The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly
Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops: Effect of packaging
Residual compression in area array packages induced by underfill shrinkage
Effect of 805 nm on reliability of 735/805/850-nm LED involved near-infrared spectroscopy biomedical device
Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy
LVI detection on passive structure in advance CMOS technology: New opportunities for device analysis
Non-linear width scaling of ESD protection devices and link with p-well implant in BCD-processes
An experimental study of the thermally activated processes in polycrystalline silicon thin film transistors
Dependence of Post-Breakdown Conduction on Gate Oxide Thickness
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates
Laser-assisted decapsulation of plastic-encapsulated devices
Physical degradation of GaN HEMT devices under high drain bias reliability testing
Analysis and resolution of a thermally accelerated early life failure mechanism in a 40 V GaN FET
Near-field EMC study to improve electronic component reliability
Evaluation of hot-electron effects on critical parameter drifts in power RF LDMOS transistors
Impact of load pulse duration on power cycling lifetime of Al wire bonds
A modified two dimensional analytical model for short-channel fully depleted SOI MESFET's
Testing process capability for one-sided specification limit with application to the voltage level translator
A thermal cycling reliability study of ultrasonically bonded copper wires
Procedure for design optimization of a T-cap flip chip package
SiLK TM etch optimization and electrical characterization for 0.13 mum interconnects
A shapeshifting evolvable hardware mechanism based on reconfigurable memFETs crossbar architecture
A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers
Initial and PBTI-induced traps and charges in Hf-based oxides/TiN stacks
Reliability test of a RF MEMS varactor based on a double actuation mechanism
A New Versatile Testing Interface for Failure Analysis in Integrated Circuits
Life-time estimation of high-power blue light-emitting diode chips
Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system
Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts
Radiation-induced single event transients modeling and testing on nanometric flash-based technologies
High speed test interface module using MEMS technology
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement
Avoiding flex cracks in ceramic capacitors: Analytical tool for a reliable failure analysis and guideline for positioning cercaps on PCBs
Cyclic endurance reliability of stretchable electronic substrates
Low temperature FIB cross section: Application to indium micro bumps
Design and control of RF power amplifier; Alireza Shirvani, Bruce Wooley. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 149, plus XVI, 127 euro. ISBN 1-4020-7562-6
Backside failure analysis case study: Implementation of innovative Local Backside Deprocessing technique
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
Effect of nano Al 2 O 3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads
A strategy for characterization and evaluation of ESD robustness of CMOS semiconductor technologies
Reliability analysis of temperature step-stress tests on III-V high concentrator solar cells
Pb-free high temperature solders for power device packaging
Deformation measurement of RF MEMS switches by optical interference
Defects in Microelectronic Materials and Devices, Daniel M. Fleetwood, Sokrates T. Pantelides, Ronald D. Schrimpf (Eds.). Taylor and Francis Group LLC, Boca Raton, FL, USA
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process
Stress immunity enhancement of the SiN uniaxial strained n-channel metal-oxide-semiconductor field-effect-transistor by channel fluorine implantation
Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation
Gate-controlled field-effect diodes and silicon-controlled rectifier for charged-device model ESD protection in advanced SOI technology
Time dependent dielectric breakdown physics - Models revisited
An aqueous developable photoimageable silver conductor composition for high density electronic packaging
Pattern image enhancement by automatic focus correction
Variability model for forming process in oxygen vacancy modulated high-κ based resistive switching memory devices
Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation
Flat band voltage shift and oxide properties after rapid thermal annealing
Fabrication of Au/PEDOT stacked electrodes for organic thin film transistors by imprinting technology
MIM capacitance variation under electrical stress
Improvement of TDDB reliability, characteristics of HfO 2 high-k/metal gate MOSFET device with oxygen post deposition annealing
Scan chain failure analysis using laser voltage imaging
Verification of CDM circuit simulation using an ESD evaluation circuit
Reliability determination of aluminium electrolytic capacitors by the mean of various methods. Application to the protection system of the LHC
MPSoC application resilience by hardware-assisted communication virtualization
A new approach to the modeling of oxide breakdown on CMOS circuits
Passivation schemes to improve power devices HAST robustness
Reliability analysis of a newly developed detector for monitoring spine health
Modelling of initial fast charge loss mechanism for logic embedded non-volatile memories
Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire
Operating-waveform analysis based reliability evaluation of power MOSFETs used for a leg short-circuit initial charge method
Long term storage reliability of antifuse field programmable gate arrays
Inverted high frequency Scanning Acoustic Microscopy inspection of power semiconductor devices
Statistical aspects of the degradation of LDD nMOSFETs
Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality
Influence of temperature and dose rate on the degradation of BiCMOS operational amplifiers during total ionizing dose testing
Advanced backside failure analysis in 65 nm CMOS technology
Impact of O-Si-O bond angle fluctuations on the Si-O bond-breakage rate
Main degradation mechanism in AsTeGeSiN threshold switching devices
Thermal and electrical investigation of the reverse bias degradation of silicon solar cells
Characterization and SPICE modeling of the CHC related time-dependent variability in strained and unstrained pMOSFETs
Through Silicon Via (TSV) defect investigations using lateral emission microscopy
Fast reliability qualification of SiP products
Exceptional operative gate voltage induces negative bias temperature instability (NBTI) on n-type trench DMOS transistors
Conductive filament formation at grain boundary locations in polycrystalline HfO 2 -based MIM stacks: Computational and physical insight
Degradation mechanisms induced by thermal and bias stresses in InP HEMTs
Effect of doping concentration on avalanche multiplication and excess noise factor in submicron APD
Recent progress on electro-mechanical system prognostics and health management
Combined experimental and numerical approach to study electro-mechanical resonant phenomena in GaN-on-Si heterostructures
Study of the ESD defects impact on ICs reliability
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging
Effects of combined NO and forming gas annealing on interfacial properties and oxide reliability of 4H-SiC MOS structures
Indirect techniques for channel temperature estimation of HEMT microwave transistors: Comparison and limits
Failure analysis of vertical cavity surface emission laser diodes
Charge and energy deposition in thick silicon depletion layers by environmental ionizing radiation and terrestrial cosmic rays
Issues in electromagnetic compatibility of integrated circuits: emission and susceptibility
Boris Murmann, Bernhard Boser, Digitally Assisted Pipeline ADCs: Theory and Implementation, Kluwer Academic Publishers, Boston, 2004, ISBN 1-4020-7839-0. Hardcover, pp 155, plus XX
Voltage acceleration and t63.2 of 1.6-10 nm gate oxides
UIS test of high-voltage GaN-HEMTs with p-type gate structure
Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation
Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs
A procedure for reliability control and optimization of mixed-signal smart power CMOS pocesses
A unified multiple stress reliability model for microelectronic devices - Application to 1.55 μm DFB laser diode module for space validation
Characterization of cyclic delamination behavior of thin film multilayers
Identifying electrical mechanisms responsible for functional failures during harsh external ESD and EMC aggression
Finite element modeling of capacitive coupling voltage contrast
Constitutive modeling of solder alloys for drop-impact applications
Influence of mobility model on extraction of stress dependent source-drain series resistance
Diamond layout style impact on SOI MOSFET in high temperature environment
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
Time-zero-variability and BTI impact on advanced FinFET device and circuit reliability
Reliability of submicron InGaAs/InP DHBT under thermal and electrical stresses
Investigating SiC MOSFET body diode's light emission as temperature-sensitive electrical parameter
SiO 2 tunneling and Si 3 N 4 /HfO 2 trapping layers formed with low temperature processes on gate-all-around junctionless charge-trapping flash memory devices
Trap generation and breakdown processes in very thin gate oxides
Trench insulated gate bipolar transistors submitted to high temperature bias stress
Threshold voltage instability in high-k based flash memories
Similarities of lag phenomena and current collapse in field-plate AlGaN/GaN HEMTs with different types of buffer layers
Remaining useful life prediction of lithium-ion battery using an improved UPF method based on MCMC
Improved resolution method to study at 3D the conduction phenomena inside GaAs PIN photodiode
Optical semiconductor device reliability
SCRAP: Sequential circuits reliability analysis program
Modified Engelmaier's model taking account of different stress levels
Lifetime evaluation of a multifunctional PV single-phase inverter during harmonic current compensation
Breakdown behaviour of high-voltage GaN-HEMTs
Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern
Modeling nonlinear moisture diffusion in inhomogeneous media
Light Emission From Small Technologies. Are Silicon Based Detectors Reaching Their Limits?
Realizing high breakdown voltage for a novel interface charges islands structure based on partial-SOI substrate
Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique
Numerical study of microbump failure in 3D microelectronic structures
Quantum size impacts on the threshold voltage in nanocrystalline silicon thin film transistors
Thermal stability of SiC Schottky diode anode and cathode metalisations after 1000 h at 350 °C
Thermal stress effects on Dye-Sensitized Solar Cells (DSSCs)
Microstructural evolution of sintered silver at elevated temperatures
Modeling of noise for p-channel DG-FinFETs
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process
Pitfalls for CDM calibration procedures
A full characterization of single pitch IO ESD protection based on silicon controlled rectifier and dynamic trigger circuit in CMOS 32 nm node
Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues
Thermally Induced Voltage Alteration (TIVA) applied to ESD induced failures
The effect of solder paste composition on the reliability of SnAgCu joints
Integrated thin film heater-thermocouple systems
Improved thermal management of low voltage power devices with optimized bond wire positions
Optimization on configuration of surface conduction electron-emitters
Design for reliability of power electronics modules
Efficiently analyzing the impact of aging effects on large integrated circuits
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages
Reliability investigation of AlGaN/GaN high electron mobility transistors under reverse-bias stress
Electro-thermal simulation of microsystems with mixed abstraction modelling
Temperature and voltage aging effects on electrical conduction mechanism in epoxy-BaTiO 3 composite dielectric used in embedded capacitors
Field failure due to creep corrosion on components with palladium pre-plated leadframes
BTI reliability of ultra-thin EOT MOSFETs for sub-threshold logic
Effects of single vacancy defect position on the stability of carbon nanotubes
Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications
Effect of oval defects in GaAs on the reliability of SiN x metal-insulator-metal capacitors
Node-to-node error sensitivity analysis using a graph based approach for VLSI logic circuits
Localization of Marginal Circuits for Yield Diagnostics Utilizing a Dynamic Laser Stimulation Probing System
Simplified terrain identification and component fatigue damage estimation model for use in a health and usage monitoring system
Automatic data mining for telemetry database of computer systems
Improved etching recipe for exposing Cu wire allowing reliable stitch pull
Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18 μm CMOS
Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
Interface traps density-of-states as a vital component for hot-carrier degradation modeling