yusuke1997/dblp-id-title huggingface dataset:
Characterization of moisture properties of polymers for IC packaging
Evaluation of lead-free soldering for automotive applications
An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact
Boundary element analysis of thermal fatigue effects on high power IGBT modules
Ultra-thin oxides on silicon fabricated using ultra-slow multicharged ion beams
Influence of channel length and high-K oxide thickness on subthreshold analog/RF performance of graded channel and gate stack DG-MOSFETs
A study of the interface-trap activation kinetics in the Negative Bias Temperature Instability
Quantum coupling effects on charging dynamics of nanocrystalline memory devices
Characteristics optimization of N 2 O annealing on tungsten nanocrystal with W/Si dual-sputtered method for nonvolatile memory application
Experimental verification of the usefulness of the nth power law MOSFET model under hot carrier wearout
Comprehensive physical analysis of bond wire interfaces in power modules
Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method
High voltage transistor degradation in NVM pump application
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Improved device variability in scaled MOSFETs with deeply retrograde channel profile
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module
Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator
Time resolved determination of electrical field distributions within dynamically biased power devices by spectral EBIC investigations
Advances in Wafer Level Packaging (WLP)
Off-state drain breakdown mechanisms of VDMOS with anti-JFET implantation
Reliability and lifetime modeling of wireless sensor nodes
Determination of doping type by calibrated capacitance scanning microwave microscopy
Facing the challenge of designing for Cu/low-k reliability
RF Packaging for Space Applications: from Micropackage to SOP - "System On a Package"
IETM centered intelligent maintenance system integrating fuzzy semantic inference and data fusion
Microvaristors in thick-film and LTCC circuits
Analysis of flicker and thermal noise in p-channel Underlap DG FinFET
Nanoporous gold bumps for low temperature bonding
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages
Optimization of a MOS-IGBT-SCR ESD protection component in smart power SOI technology
Room temperature observation of point defect on gold surface using thermovoltage mapping
Investigation of the optimum oscillation frequency value towards increasing the efficiency of OBIST approach
Reliability of via-in-pad structures in mechanical cycling fatigue
Charge-related phenomena and reliability of non-volatile memories
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates
ESD issues in advanced CMOS bulk and FinFET technologies: Processing, protection devices and circuit strategies
Failure analysis on 14 nm FinFET devices with ESD CDM failure
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E
Diagnosis of a soft short and local variations of parameters occurring simultaneously in analog CMOS circuits
On-line fault diagnosis model for locomotive traction inverter based on wavelet transform and support vector machine
Reliability of HTO based high-voltage gate stacks for flash memories
Estimating the SEU failure rate of designs implemented in FPGAs in presence of MCUs
On-wafer measurement of the reverse-recovery time of integrated diodes by Transmission-Line-Pulsing (TLP)
Measurement of the hot carrier damage profile in LDMOS devices stressed at high drain voltage
Long time reliability study of soldered flip chips on flexible substrates
Advantage of further scaling in gate dielectrics below 0.5 nm of equivalent oxide thickness with La 2 O 3 gate dielectrics
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch
Contactless current and voltage measurements in integrated circuits by using a needle sensor
Substrate-engineered GGNMOS for low trigger voltage ESD in 65 nm CMOS process
Effect of aluminum concentration on the microstructure and mechanical properties of Sn-Cu-Al solder alloy
Study of performance degradations in DC-DC converter due to hot carrier stress by simulation
Cooling-controlled and reliable driving module for low-level light therapy LED helmet
Reliability of Cu nanoparticle joint for high temperature power electronics
On the prediction of radiation-induced SETs in flash-based FPGAs
On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors
On thermo-mechanical reliability of plated-through-hole (PTH)
Present problems of power module packaging technology
Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions
Improved analysis of low frequency noise in dynamic threshold MOS/SOI transistors
Lifetime prediction on the base of mission profiles
Resistive switching like-behavior in MOSFETs with ultra-thin HfSiON dielectric gate stack: pMOS and nMOS comparison and reliability implications
Effect of short circuit aging on safe operating area of SiC MOSFET
MEMS technology integrated in the CMOS back end
Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints
On-wafer low frequency noise measurements of SiGe HBTs: Impact of technological improvements on 1/f noise
Power amplifier resilient design for process and temperature variations using an on-chip PLL sensing signal
Characterization of fatigued Al lines by means of SThM and XRD: Analysis using fast Fourier transform
Relation between UIS withstanding capability and I-V characteristics in high-voltage GaN-HEMTs
Nanometer-scale leakage measurements in high vacuum on de-processed high-k capacitors
Optimization of convectively cooled heat sinks
A critical analysis of the bulk current injection immunity test based on common-mode and differential-mode
Implementation of diode and bipolar triggered SCRs for CDM robust ESD protection in 90 nm CMOS ASICs
Control technique for power device electro-thermal stress minimisation in non-linear load variable-frequency resonant power converters
Seu and Sefi error detection and correction on a ddr3 memory system
Improving thermal performance of miniature heat pipe for notebook PC cooling
The high frequency behaviour of high voltage and current IGBT modules
Assessment of the Trench IGBT reliability: low temperature experimental characterization
New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assembly
Ultra sensitive measurement of dielectric current under pulsed stress conditions
On the analysis of radiation-induced Single Event Transients on SRAM-based FPGAs
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
Application of multiplicative dimensional reduction method for uncertainty quantification and sensitivity analysis of MEMS electrostatic actuators
77 GHz automotive RADAR in eWLB package: From consumer to automotive packaging
Reliability of key technologies in 3D integration
A review of the use of electro-thermal simulations for the analysis of heterostructure FETs
An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded
Analog IP blocks
Measuring the through-plane elastic modulus of thin polymer films in situ
A quantitative study of Phosphorous implantation damage on the thick gate oxide of the 28 nm node
A compact model for early electromigration failures of copper dual-damascene interconnects
Unique and Practical IC Timing Analysis Tool Utilizing Intrinsic Photon Emission
Three-dimensional finite-element thermal simulation of GaN-based HEMTs
TCAD modeling for reliability
Evaluation of potential-induced degradation in crystalline Si solar cells using Na fault injection
V TH subthreshold hysteresis technology and temperature dependence in commercial 4H-SiC MOSFETs
A comprehensive study of the application of the EOP techniques on bipolar devices
Compact modeling of the non-linear post-breakdown current in thin gate oxides using the generalized diode equation
CMOS Telecom Data converters; Angel Rodriguez-Vazquez, Fernando Medeiro, Edmond Janssens, editors. Kluwer Academic Publishers, Boston; 2003. Hardcover, 588pp, plus XXXIII, 128 euro. ISBN 1-4020-7546-4
Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP
Analysis of critical-length data from Electromigration failure studies
Single event effects sensitivity of low energy proton in Xilinx Zynq-7010 system-on chip
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages
Nanomechanical properties of Ag solder bumps doped with Pd and Au
Impact of semiconductors material on IR Laser Stimulation signal
Anomalous gate oxide conduction on isolation edges: analysis and process optimization
High-kappa related reliability issues in advanced non-volatile memories
Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness
Total Ionizing Dose, Random Dopant Fluctuations, and its combined effect in the 45 nm PDSOI node
Wide band gap semiconductor reliability : Status and trends
In-situ X-ray μLaue diffraction study of copper through-silicon vias
Degradation of electrical performance and floating body effect in ultra thin gate oxide FD-SOI n-MOSFETs by 7.5-MeV proton irradiation
Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices
Reliability assessment of the metallized film capacitors from degradation data
Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation
Editorial: IEDMS 2016
Efficient reliability evaluation methodologies for combinational circuits
Estimation of reliability of mobile handsets using Cox-proportional hazard model
Low-frequency noise in single-poly bipolar transistors at low base current density
Ultra-shallow n + p junction formed by PH 3 and AsH 3 plasma immersion ion implantation
High temperature reliability of μtrench Phase-Change Memory devices
The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces
Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN
Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications
A synthesis methodology for AMS/RF circuit reliability: Application to a DCO design
Microstructure and elevated-temperature shear strength of Zn-4Al-3Mg-xSn high-temperature lead-free solders
Alternative CMOS or alternative to CMOS?
Breakdown and latent damage of ultra-thin gate oxides under ESD stress conditions
Integrating testability with design space exploration
Degradation of AlGaN/GaN HEMTs under elevated temperature lifetesting
Integrated thermo-mechanical design and qualification of wafer backend structures
Development of a novel stack package to fabricate high density memory modules for high-end application
Simulative prediction of the resistance change due to electromigration induced void evolution
Effects of package and process variation on 2.4GHz analog integrated circuits
Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue
Prediction of transmission line lifetimes over temperature and current density
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages
Drain current saturation at high drain voltage due to pinch off instead of velocity saturation in sub-100 nm metal-oxide-semiconductor transistors
Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection
Efficient test pattern generators based on specific cellular automata structures
Stacked zener trigger SCR for HV IC ESD protection
Comparison of electrical characteristics between AlGaN/GaN and lattice-matched InAlN/GaN heterostructure Schottky barrier diodes
Functional fluid jetting performance optimization
Process and temperature robust voltage multiplier design for RF energy harvesting
Determination of migration effects in Cu-via structures with respect to process-induced stress
Degradation mechanism of concentrator solar receivers without protection layer
Building the electrical model of the Photoelectric Laser Stimulation of a PMOS transistor in 90 nm technology
Determination of trap cross-section in a-Si: H p-i-n diodes parameters using simulation and parameter extraction
Electrical noise and RTS fluctuations in advanced CMOS devices
Design for reliability of generic sensor interface circuits
Evaluation of RF electrostatic discharge (ESD) protection in 0.18-µm CMOS technology
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package
The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation
ESD circuit model based protection network optimisation for extended-voltage NMOS drivers
Total ionizing dose effects in shallow trench isolation oxides
Avalanche ruggedness of parallel SiC power MOSFETs
Dynamic simulation of octahedron slotted metal structures
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model
CDMA bus-based on-chip interconnect infrastructure
A technique for transparent fault injection and simulation in VHDL
Ultra-fast CAD scan chain highlighting for failure analysis assistance
The effect of electrode material on the electrical conduction of metal-Pb(Zr 0.53 Ti 0.47 )O 3 -metal thin film capacitors
Void formation at the interface in Sn/Cu solder joints
Practical compact modeling approaches and options for sub-0.1 mum CMOS technologies
Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variations
Editorial ESD reliability special section
A novel single-event-hardened charge pump using cascode voltage switch logic gates
Drain current model for double-gate tunnel field-effect transistor with hetero-gate-dielectric and source-pocket
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases
Effects of SiO 2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures
ESD protection for negative charge pump (CP) using CP internal switches
Implications of gate-edge electric field in AlGaN/GaN high electron mobility transistors during OFF-state degradation
Single-trap-induced random telegraph noise for FinFET, Si/Ge Nanowire FET, Tunnel FET, SRAM and logic circuits
Electrical and reliability characteristics of GaAs MOSHEMTs utilizing high-k IIIB and IVB oxide layers
A novel fast and versatile temperature measurement system for LDMOS transistors
Thermal and voltage instabilities of hafnium oxide films prepared by sputtering technique
The effect of various concentrations of PVDF-HFP polymer gel electrolyte for dye-sensitized solar cell
An athermal measurement technique for long time constants traps characterization in GaN HEMT transistors
Electrical characterization and reliability of submicron SOI CMOS technology in the extended temperature range (to 300 °C)
Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy
Digitally programmable CMOS transconductor for very high frequency
Flip chip attachment on flexible LCP substrate using an ACF
Self-repairing adder using fault localization
Low-power fault-tolerant interconnect method based on LCDMA and duplication
A partial-SOI LDMOSFET with triangular buried-oxide for breakdown voltage improvement
Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis
Experimental observation of TDDB-like behavior in reverse-biased green InGaN LEDs
Life consumption of a MMC-STATCOM supporting wind power plants: Impact of the modulation strategies
New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure
Comparative analysis of yield optimized pulsed flip-flops
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test
Investigation of dependence between time-zero and time-dependent variability in high-κ NMOS transistors
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures
A novel stability and process sensitivity driven model for optimal sized FinFET based SRAM
High power reliability aspects on RF MEMS varactor design
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure
Reliability and failure in single crystal silicon MEMS devices
Rapid power cycling of flip-chip and CSP components on ceramic substrates
A study of deposition conditions on charging properties of PECVD silicon nitride films for MEMS capacitive switches
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Negative bias temperature instability on three oxide thicknesses (1.4/2.2/5.2 nm) with nitridation variations and deuteration
Experimental study of charge generation mechanisms in power MOSFETs due to energetic particle impact ,
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging
A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors
Advances in the drop-impact reliability of solder joints for mobile applications
Highly variable Sn-Cu diffusion soldering process for high performance power electronics
Wide frequency range ac electrical characterization of thick-film microvaristors
Predictive modeling of board level shock-impact reliability of the HVQFN-family
Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions
Variability aware low leakage reliable SRAM cell design technique
Conduction and Breakdown Behaviour of Atomic Force Microscopy Grown SiO 2 Gate Oxide on MOS Structures
Characterization and reliability of a switch matrix based on MOEMS technology
Enhancement of breakdown voltage for Ni-SiC Schottky diodes utilizing field plate edge termination
A cross layer approach for efficient thermal management in 3D stacked SoCs
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Conduction instability of amorphous InGaZnO thin-film transistors under constant drain current stress
Analysis of dependence of short-channel effects in double-gate MOSFETs on channel thickness
Total ionizing dose response of fluorine implanted Silicon-On-Insulator buried oxide
Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe
Overload robust IGBT design for SSCB application
Analysis of the charge sharing effect in the SET sensitivity of bulk 45 nm standard cell layouts under heavy ions
Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
Improved electrical properties using SrTiO 3 /Y 2 O 3 bilayer dielectrics for MIM capacitor applications
Using RBF networks for detection and prediction of flip chip with missing bumps
Lifetime estimation of LED lamp using gamma process model
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection
Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
Analysis of electrical parameters of InGaN-based LED packages with aging
Continuous time-domain RF waveforms monitoring under overdrive stress condition of AlGaN/GaN HEMTs
Ultra-Thinning of C4 Integrated Circuits for Backside Analysis during First Silicon Debug
IC security and quality improvement by protection of chip backside against hardware attacks
Characteristics of the intrinsic defects in unintentionally doped 4H-SiC after thermal annealing
Reliability methods and standards
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant
Location resolved transient thermal analysis to investigate crack growth in solder joints
Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
High-speed video analysis for kink formation in a bond wire looping
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
Pulse plated silver metallization on porosified LTCC substrates for high frequency applications
Optimization of the bistability property for flexible display by an integrated approach using Taguchi methods, neural networks and genetic algorithms
High voltage degradation of GaN High Electron Mobility Transistors on silicon substrate
Conduction mechanisms and an evidence for phonon-assisted conduction process in thin high-k Hf x Ti y Si z O films
Percolation theory applied to PZT thin films capacitors breakdown mechanisms
Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load
Effect of a trace of water vapor on Ohmic contact formation for AlGaN/GaN epitaxial wafers
Structural pattern extraction from asynchronous two-photon laser fault injection using spectral analysis
Direct power control of three-level NPC grid-connected system combined with fault-tolerant technology
Improved interfacial quality of GaAs metal-oxide-semiconductor device with NH 3 -plasma treated yittrium-oxynitride as interfacial passivation layer
Reliability considerations in pulsed power resonant conversion
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO 2 composite solder on flexible ball grid array substrates
Transient current mechanism of lead zirconate titanate capacitors sputtered on La 0.65 Sr 0.35 MnO 3
Equivalent circuit modeling of the bistable conduction characteristics in electroformed thin dielectric films
Effects of radiation and charge trapping on the reliability of high-kappa gate dielectrics
Characterization of stress degradation effects and thermal properties of AlGaN/GaN HEMTs with photon emission spectral signatures
Study on low-Ag content Sn-Ag-Zn/Cu solder joints
Improved reliability of copper-cored solder joints under a harsh thermal cycling condition
Bias dependence of TID induced single transistor latch for 0.13 μm partially depleted SOI input/output NMOSFETs
Performance and reliability trade-offs for high-κ RRAM
Latchup in voltage tolerant circuits: a new phenomenon
A run-time built-in approach of TID test in SRAM based FPGAs
Compact model for single event transients and total dose effects at high temperatures for partially depleted SOI MOSFETs
Life test of an X-band MMIC multi-function chip for active phased array radar applications