yusuke1997/dblp-id-title huggingface dataset:
Refined electrical analysis of two charge states transition characteristic of "borderless" silicon nitride
Correlation of gate oxide reliability and product tests on leading edge DRAM technology
Characteristics of current crowding in flip-chip solder bumps
Evaluating the radiation sensitivity of GPGPU caches: New algorithms and experimental results
Quantum circuit's reliability assessment with VHDL-based simulated fault injection
Failure criteria of flip chip joints during accelerated testing
Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules
Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique
Experimental evaluation of hot electron reliability on differential Clapp-VCO
Failure analysis of ESD-stressed SiC MESFET
A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs
Reliability improvements in 50 nm MLC NAND flash memory using short voltage programming pulses
Investigation of delamination control in plastic package
Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer
Richard Zurawski, ed., The Industrial Information Technology Handbook, Hardcover, CRC Press, 2005, pp 1936, ISBN 0-8493-1985-4
Single pulse avalanche robustness and repetitive stress ageing of SiC power MOSFETs
Effect of negative bias temperature instability induced by a low stress voltage on nanoscale high-k/metal gate pMOSFETs
High efficiency p-i-n organic light-emitting diodes with a novel n-doping layer
New insights into the change of voltage acceleration and temperature activation of oxide breakdown
Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop
A reliability-driven placement procedure based on thermal-force model
Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits
Experimental investigation of temperature and relative humidity effects on resonance frequency and quality factor of CMOS-MEMS paddle resonator
Hardware/firmware co-design in an 8-bits microcontroller to solve the system-level ESD issue on keyboard
Matching degradation of threshold voltage and gate voltage of NMOSFET after Hot Carrier Injection stress
Service reliability modeling and evaluation of active-active cloud data center based on the IT infrastructure
Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET's
Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications
Control of the electromagnetic compatibility: An issue for IC reliability
Implementation and evaluation of 2D SEC-DED forward error correction scheme in wireless sensor networks
Voltage and current stress induced variations in TiN/HfSi x O y /TiN MIM capacitors
Effect of a buffer layer in the epi-substrate region to boost the avalanche capability of a 100V Schottky diode
Single resistance controlled oscillator using unity gain cells
A probe-based SEU detection method for SRAM-based FPGAs
Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface
Development of SnAg-based lead free solders in electronics packaging
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials
Threshold voltage instability of nanoscale charge trapping non-volatile memory at steady phase
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact
Degradation kinetics of ultrathin HfO 2 layers on Si(1 0 0) during vacuum annealing monitored with in situ XPS/LEIS and ex situ AFM
Minimizing equivalent series resistance measurement errors
Low-power MicroV rms noise neural spike detector for implantable interface microsystem device
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond
Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs - A review
The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints
A new multitime programmable non-volatile memory cell using high voltage NMOS
The impact of process-induced mechanical stress on CMOS buffer design using multi-fingered devices
Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
Evaluation of parasitic capacitances for interconnection buses crossing in different layers
Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization
Effect of SiO 2 /Si interface roughness on gate current
Experiment study of dynamic looping process for thermosonic wire bonding
Modeling of the breakdown mechanisms for porous copper/low-k process flows
Effect of body bias and temperature on low-frequency noise in 40-nm nMOSFETs
Non-destructive tester for single event burnout of power diodes
Effects of Ti content and wet-N 2 anneal on Ge MOS capacitors with HfTiO gate dielectric
Effect of source and drain asymmetry on hot carrier degradation in vertical nanowire MOSFETs
Improving performance and reliability of NOR-Flash arrays by using pulsed operation
On the temperature dependence of NBTI recovery
Failure mechanism of trench IGBT under short-circuit after turn-off
Correlation between transient evolutions of the gate and drain currents in AlGaN/GaN technologies
Reliability of thin-film resistors: impact of third harmonic screenings
Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers
Advanced packaging yields higher performance and reliability in power electronics
Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process
A review on discoloration and high accelerated testing of optical materials in LED based-products
Accelerated assessment of fine-grain AVF in NoC using a Multi-Cell Upsets considered fault injection
Effect of voids on the reliability of BGA/CSP solder joints
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation
Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders
Testing of Ultra Low Voltage VLSI Chips using the Superconducting Single-Photon Detector (SSPD)
NBTI reliability on high-k metal-gate SiGe transistor and circuit performances
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser
Optimization of low temperature silicon nitride processes for improvement of device performance
Investigation of hot carrier degradation in asymmetric nDeMOS transistors
Novel transient-fault detection circuit featuring enhanced bulk built-in current sensor with low-power sleep-mode
Recovery behavior in negative bias temperature instability
Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column
Study of the actuation speed, bounces occurrences, and contact reliability of ohmic RF-MEMS switches
Laser processing for microelectronics packaging applications
Comprehensive nanostructural study of SSRM nanocontact on silicon
An improved reliability model for Si and GaN power FET
Multi-functional systolic array with reconfigurable micro-power processing elements
Circuit implications of gate oxide breakdown
Structure optimization of multi-finger power SiGe HBTs for thermal stability improvement
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies
Improved current filament control during Zener diode zapping
Two effective methods to mitigate soft error effects in SRAM-based FPGAs
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver
Numerical simulations of N-type CdSe poly-TFT electrical characteristics with trap density models of Atlas/Silvaco
Design issues of a three-dimensional packaging scheme for power modules
A methodology for the calculation of stress migration in die-level interconnects
Analysis of Schottky gate degradation evolution in AlGaN/GaN HEMTs during HTRB stress
Microstructure, tensile and electrical properties of gold-coated silver bonding wire
Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages
Empirical derivation of upper and lower bounds of NBTI aging for embedded cores
Electrical characteristics and reliability properties of metal-oxide-semiconductor capacitors with HfZrLaO gate dielectrics
Conduction mechanisms of silicon oxide/titanium oxide MOS stack structures
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
Reliability of power electronic devices against cosmic radiation-induced failure
On-chip measurement to analyze failure mechanisms of ICs under system level ESD stress
Acceleration of the growth of Cu 3 Sn voids in solder joints
Heat management for power converters in sealed enclosures: A numerical study
Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy
Electrical modeling of the effect of beam profile for pulsed laser fault injection
Study of EM void nucleation and mechanic relaxation effects
Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress
Degradation properties of MOVPE-grown GaInP/GaAs HBTs under combined temperature and current stressing
Effect of roughness on electrical contact performance of electronic components
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
Charge trapping characterization of MOCVD HfO 2 /p-Si interfaces at cryogenic temperatures
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q eta
Impact of bias conditions on performance degradation in SiGe HBTs irradiated by 10 MeV Br ion
Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips
Historical review of compound semiconductor reliability
Effect of additive N 2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning
IGBT RBSOA non-destructive testing methods: Analysis and discussion
NAND flash memory technology utilizing fringing electric field
Creep of thermally aged SnAgCu-solder joints
New insights on the PBTI phenomena in SiON pMOSFETs
Evolution of oxide charge trapping under bias temperature stressing
Thermal instability effects in SiC Power MOSFETs
Reliability study of AlGaN/GaN HEMT under electromagnetic, RF and DC stress
Investigation of open bond wires in MEMS devices
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Synthesis and characterisation of curcumin-M (M = B, Fe and Cu) films grown on p-Si substrate for dielectric applications
Study of the electrical cycling stressed large area Schottky diodes using I-V and noise measurements
Reliability of sintered Ag 80 -Al 20 die attach nanopaste for high temperature applications on SiC power devices
An improved unscented particle filter approach for lithium-ion battery remaining useful life prediction
Analytical threshold voltage model for cylindrical surrounding-gate MOSFET with electrically induced source/drain extensions
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect
Improved performance of ITO/TiO 2 /HfO 2 /Pt random resistive accessory memory by nitrogen annealing treatment
Enhancement of RF-MEMS switch reliability through an active anti-stiction heat-based mechanism
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Reverse-bias stress of high electron mobility transistors: Correlation between leakage current, current collapse and trap characteristics
Degradation of InGaN lasers: Role of non-radiative recombination and injection efficiency
Facing the defect characterization and localization challenges of bridge defects on a submicronic technology (45 nm and below)
The optimum fin width in p-MuGFETs with the consideration of NBTI and hot carrier degradation
Compact distributed multi-finger MOSFET model for circuit-level ESD simulation
Impact of ambient temperature set point deviation on Arrhenius estimates
A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds
Circuit design and experimental test of a high power IGBT non-destructive tester
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
Simulation and experimental comparison of GGNMOS and LVTSCR protection cells under ElectroStatic Discharges
A hierarchical approach to large circuit symbolic simulation
Subthreshold behavior models for short-channel junctionless tri-material cylindrical surrounding-gate MOSFET
Probabilistic insight to possibility of new metal filament nucleation during repeated cycling of conducting bridge memory
Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding
Equivalent mechanical properties of through silicon via interposers - A unit model approach
Architectural design of a programmable cell for the implementation of a filter bank on FPGA
The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate
Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs)
Characteristic study of anisotropic-conductive film for chip-on-film packaging
An in-line process monitoring method using electron beam induced substrate current
A function-fit model for the hard breakdown I-V characteristics of ultra-thin oxides in MOS structures
Temperature stability of a piezoresistive MEMS resonator including self-heating
Design of a novel fault-tolerant voter circuit for TMR implementation to improve reliability in digital circuits
Layout-mixed-signal
Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection
Effect of nano Al 2 O 3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints
Static and dynamic hot carrier accelerated TDDB: Influencing factors and impact on product lifetime
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards
Effects of temperature and span amplitude on fretting corrosion behavior of tin-plated electrical contacts
Optimization of SiN X : H films deposited by PECVD for reliability of electronic, microsystems and optical applications
Reliability study of TaON capacitors: From leakage current characterization to ESD robustness prediction
Analytical stress characterization after different chip separation methods
Non-ideal effects improvement of SF 6 plasma treated hafnium oxide film based on electrolyte-insulator-semiconductor structure for pH-sensor application
Radiation source dependence of performance degradation in thin gate oxide fully-depleted SOI n-MOSFETs
Characterization method of thermomechanical parameters for microelectronic materials
Modelling the self-alignment of passive chip components during reflow soldering
Leakage currents and dielectric breakdown of Si 1-x-y Ge x C y thermal oxides
A specimen-current branching approach for FA of long Electromigration test lines
Investigation on X-ray irradiation on nanoscale nitride based charge trapping flash memory devices
Constructing IP cores' transparency paths for SoC test access using greedy search
Effect of fin shape of tapered FinFETs on the device performance in 5-nm node CMOS technology
Application of Machine Model ESD tester to high volume capacitor reliability testing
Plasma charging damage mechanisms and impact on new technologies
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
Analysis of optical properties of fundamental-mode in waveguide tapered fibers
DMR +: An efficient alternative to TMR to protect registers in Xilinx FPGAs
Circuit level interconnect reliability study using 3D circuit model
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
Vertical InGaN light-emitting diodes with Ag paste as bonding layer
FinFET-based product performance: Modeling and evaluation of standard cells in FinFET technologies
On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices
Study for pulse stress NBTI characteristics degradation stress
Structure of the oxide damage under progressive breakdown
Improvement of reliability for high-ohmic Cr-Si thin film resistors in a heat and humid environment: Removing moisture source by electrocatalytic decomposition of water
Erratum to "Reliability results of HBTs with an InGaP emitter" [Microelectron. Reliability 46 (2006) 1261-1271]
Single event burnout in power diodes: Mechanisms and models
Modelling the temperature influence on dc characteristics of the IGBT
Study of package warp behavior for high-performance flip-chip BGA
Metal-layer capacitors in the 65 nm CMOS process and the application for low-leakage power-rail ESD clamp circuit
Micropower fully integrated CMOS readout interface for neural recording application
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions
Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET
New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices
Humidity robustness for high voltage power modules: Limiting mechanisms and improvement of lifetime
Time-To-Latch-Up investigation of SCR devices as ESD protection structures on 65 nm technology platform
Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly
A novel approach to characterization of progressive breakdown in high-k/metal gate stacks
A reliability of different metal contacts with amorphous carbon
Electrical characterization of crystalline Gd 2 O 3 gate dielectric MOSFETs fabricated by damascene metal gate technology
Characterization of HTRB stress effects on SiC MOSFETs using photon emission spectral signatures
Fabrication and electrical characteristics of Perylene-3, 4, 9, 10-tetracarboxylic dianhydride/p-GaAs diode structure
Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package
TCAD simulation of radiation-induced leakage current in 1T1C SDRAM
Origin of hot carrier degradation in advanced nMOSFET devices
Fast and stable computation of optical propagation in micro-waveguides with loss
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
Effect of electrical and thermal stress on low-frequency noise characteristics of laser diodes
Evaluation new corner stress relief structure layout for high robust metallization
The Role of the Parasitic BJT Parameters on the Reliability of New Generation Power MOSFET during Heavy Ion Exposure
A 3D analysis technique for detecting trace metal contamination
Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti
Examination of hot carrier effects of the AlGaAs/InGaAs pHEMT through device simulation
Electron transport through broken down ultra-thin SiO 2 layers in MOS devices
Effect of negative potential on the extent of PID degradation in photovoltaic power plant in a real operation mode
Failure rate estimation of known failure mechanisms of electronic packages
Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems
Reliability of thin ZrO 2 gate dielectric layers
Preliminary results of storage accelerated aging test on InP/InGaAs DHBT
Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-gate and SAG-gate technology
Dynamic stress method for accurate NVM oxide robustness evaluation for automotive applications
Static and low frequency noise characterization of surface- and buried-mode 0.1 mum P and N MOSFETs
The electron irradiation effects on silicon gate dioxide used for power MOS devices
Physical and electrical properties of low dielectric constant self-assembled mesoporous silica thin films
Microscopic scale characterization and modeling of transistor degradation under HC stress
An analytical avalanche breakdown model for double gate MOSFET
Measure of high frequency input impedance to study the instability of power devices in short circuit
Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles
Reliability investigation of the degradation of the surface passivation of InAlN/GaN HEMTs using a dual gate structure
Electromigration reliability of interconnections in RF low noise amplifier circuit
Editorial: ESREF 2016
Comparison of experimental, analytical and simulation methods to estimate substrate material properties for warpage reliability analysis
Detection and identification of power switch failures for fault-tolerant operation of flying capacitor Buck-boost converters
Single contact optical beam induced currents
A comparative study on device degradation under a positive gate stress and hot carrier stress in InGaZnO thin film transistors
Effects of the electrical stress on the conduction characteristics of metal gate/MgO/InP stacks
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages
Ageing mechanisms in Deep Trench Termination (DT 2 ) Diode
CMOS micro-heater design for direct integration of carbon nanotubes
The negative bias temperature instability in MOS devices: A review
Electrical characterization of single cell in microfluidic device
Viscoplastic properties of pressure-less sintered silver materials using indentation
Temperature-dependent noise characterization and modeling of on-wafer microwave transistors
Failure modes of tantalum capacitors made by different technologies
Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
Impact of strain on hot electron reliability of dual-band power amplifier and integrated LNA-mixer RF performances
NBTI and hot carrier effect of SOI p-MOSFETs fabricated in strained Si SOI wafer
Thermal resistance analysis and validation of flip chip PBGA packages
Modelling methodology for thermal analysis of hot solder dip process
An active heat-based restoring mechanism for improving the reliability of RF-MEMS switches
Doping compensation for increased robustness of fast recovery silicon diodes
Digital Computer Arithmetic Datapath Design Using Verilog HDL, James E. Stine, Kluwer Academic Publishers, Boston, 2004, ISBN 1-4020-7710-6. Hardcover, pp 180, plus XI
Accurate natural convection modelling for magnetic components
Carl Hamacher, Zvonko Vranesic, Safwat Zaky, Computer Organization, Fifth edition, 2004, ISBN 0-07-112214-4. Hardcover, pp 805, plus XX