yusuke1997/dblp-id-title huggingface dataset:
Effect of electron-electron scattering at an elevated temperature on device lifetime of nanoscale nMOSFETs
Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing
An extensible stability analysis method in time domain for cascaded DC-DC converters in electrical vehicles
Physical fundamentals of external transient latch-up and corrective actions
Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
Laser moiré interferometry for fatigue life prediction of lead-free solders
Material property effects on solder failure analyses
A reliable technology concept for active power cycling to extreme temperatures
Novel heatsink for power semiconductor module using high thermal conductivity graphite
Numerical prototyping methods in microsystem accelerometers design
Experimental and simulation analysis of a BCD ESD protection element under the DC and TLP stress conditions
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance
Reliability growth modeling for in-service electronic systems considering latent failure modes
Board level reliability of PBGA using flex substrate
Isolating failing sites in IC packages using time domain reflectometry: Case studies
Effects of length scaling on electromigration in dual-damascene copper interconnects
Towards high-sensitive built-in current sensors enabling detection of radiation-induced soft errors
Effect of interface charge on the dc bias stress-induced deformation and shift of the transfer characteristic of amorphous oxide thin-film transistors
New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges
A CAD assisted design and optimisation methodology for over-voltage ESD protection circuits
Impact of bilayer character on High K gate stack dielectrics breakdown obtained by conductive atomic force microscopy
Layout analysis as supporting tool for failure localization: Basic principles and case studies
Ageing effect on electromagnetic susceptibility of a phase locked loop
Advanced rail clamp networks for ESD protection
Emitter-metal-related degradation in InP-based HBTs operating at high current density and its suppression by refractory metal
Risk and reliability assessment about a manufacturing issue in a power MOSFET for automotive applications
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates
Semiconductor Power Devices, Physics, Characteristics, Reliability, by Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, and Rik De Doncker, Springer-Verlag, Berlin Heidelberg (2011). ISBN 978-3-642-11124-2
Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly
An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices
High-temperature reliability of Flip Chip assemblies
K-band capacitive MEMS switches on GaAs substrate: Design, fabrication, and reliability
Advanced 2D/3D ESD device simulation - a powerful tool already used in a pre-Si phase
A study of through package vias in a glass interposer for multifunctional and miniaturized systems
FTIR spectroscopy for the hermeticity assessment of micro-cavities
Development of reliable low temperature wafer level hermetic bonding using composite seal joint
Fabrication, characterisation and modelling of integrated on-silicon inductors
Scanning SQUID microscopy for current imaging
Thermally-activated degradation of InGaN-based laser diodes: Effect on threshold current and forward voltage
A new drain current model for short-channel MOSFETs
Trap detection in electrically stressed AlGaN/GaN HEMTs using optical pumping
Improvement on sheet resistance uniformity of nickel silicide by optimization of silicidation conditions
Electromigration failure in a copper dual-damascene structure with a through silicon via
Effects of continuously applied stress on tin whisker growth
NBTI on smart power technologies: A detailed analysis of two concurrent effects using a re-examined on-the-fly technique
The impact of high-frequency characteristics induced by intrinsic parameter fluctuations in nano-MOSFET device and circuit
Electrostatic discharge failure analysis of capacitive RF MEMS switches
Focused ion beam contact to non-volatile memory cells
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Source engineering on ruggedness and RF performance of n-channel RFLDMOS
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs)
Extending the fatigue life of Pb-free SAC solder joints under thermal cycling
Electrical characterization and analysis techniques for the high-kappa era
Thermosonic flip-chip bonding for SAW filter
Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle
Degradation of 0.25 μm GaN HEMTs under high temperature stress test
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise
Degradation behaviors of GaN light-emitting diodes under high-temperature and high-current stressing
Reliability of lead-free solder in power module with stochastic uncertainty
2D-simulation and analysis of lateral SiC N-emitter SiGe P-base Schottky metal-collector (NPM) HBT on SOI
Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors
Comprehensive failure analysis of leakage faults in bipolar transistors
Power MOSFET active power cycling for medical system reliability assessment
Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis
On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors
An approach to "Design for Reliability" in solid state lighting systems at high temperatures
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization
Inverse Gaussian distribution based timing analysis of Sub-threshold CMOS circuits
Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance
Interfacial properties and reliability of SiO 2 grown on 6H-SiC in dry O 2 plus trichloroethylene
Analytical compact modeling and statistical variability study of LDMOS
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
Hierarchical test generation for combinational circuits with real defects coverage
Cohesive zone modeling for structural integrity analysis of IC interconnects
Investigating the impact of the defect dynamic characteristics on the PBTI in the high-κ gate device
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution
Numerical study of destruction phenomena for punch-through IGBTs under unclamped inductive switching
A physical approach on SCOBIC investigation in VLSI
Multi-gate non-volatile memories with nanowires as charge storage material
Evolutionary derivation of optimal test sets for neural network based analog and mixed signal circuits fault diagnosis approach
Special Section on IMAPS-Europe 2002
Hot hole-induced device degradation by drain junction reverse current
Synthesis of Au-Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures
An investigation of Sn pest in pure Sn and Sn-based solders
Virtual reliability assessment of integrated power switches based on multi-domain simulation approach
Reliability study of dye-sensitized solar cells by means of solar simulator and white LED
A closed-loop IGBT non-destructive tester
Modelling and experimental verification of the impact of negative bias temperature instability on CMOS inverter
The influence of microwave pulse width on the thermal burnout effect of a PIN diode limiting-amplifying system
Configuration errors analysis in SRAM-based FPGAs: Software tool and practical results
Characterization on acceleration-factor equation for packaging-solder joint reliability
Highly accelerated lifetesting of base-metal-electrode ceramic chip capacitors
Light emitting diodes reliability review
Evaluation of MUMPS polysilicon structures for thermal flow sensors
Ka-band InP high electron mobility transistor monolithic microwave integrated circuit reliability
Mission-profile-based stress analysis of bond-wires in SiC power modules
Series resistance degradation due to NBTI in PMOSFET
The evaluation for the chromatic characteristics of LED module under electrical and thermal coupling analysis
Avalanche robustness of SiC Schottky diode
A new MagFET-based integrated current sensor highly immune to EMI
S-parameter performance degradation in power RF N-LDMOS devices due to hot carrier effects
As-grown-generation (AG) model of NBTI: A shift from fitting test data to prediction
Wide Bandgap Materials for Semiconductor Devices
Cyclic bending reliability of wafer-level chip-scale packages
Investigation of the threshold voltage turn-around effect in long-channel n-MOSFETs due to hot-carrier stress
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?
Sulfur-contamination of high power white LED
Tradeoffs in multichip module yield and cost with known good die probability and repair
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force
Life prediction methodology of system-in-package based on physics of failure
A comparison of the effects of cobalt-60 γ ray irradiation on DPSA bipolar transistors at high and low injection levels
Fault diagnosis technology based on transistor behavior analysis for physical analysis
Characterization of thin and ultra-thin SiO 2 films and SiO 2 /Si interfaces with combined conducting and topographic atomic force microscopy
Chip warpage model for reliability prediction of delamination failures
An efficient reliability testing method combined with thermal performance monitoring
Characterizing, modeling, and analyzing soft error propagation in asynchronous and synchronous digital circuits
Specification and use of pulsed current profiles for ultracapacitors power cycling
Erik Larson, Introduction to Advanced System-on-Chip Test Design and Optimization , Springer, Dordrecht (2005) ISBN 1-4020-3207-2 388 pp., Hardcover, plus XVIII
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
Reliability of semiconductor lasers used in current communication systems and sensing equipment
Effect of localized traps on the anomalous behavior of the transconductance in nanocrystalline TFTs
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations
A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects
Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory
Adaptive reliability satisfaction in wireless sensor networks through controlling the number of active routing paths
Conclusion of the accelerated stress conditions affecting phosphor-converted LEDs using the fractional factorial design method
Structure variation effects on device reliability of single photon avalanche diodes
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)
Experimental investigation of the dielectric-semiconductor interface with scanning capacitance microscopy
Design and fabrication of neurostimulator implants - selected problems
Characterisation of dopants distribution using electron holography and FIB-based lift-off preparation
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives
Enhanced power cycling performance of IGBT modules with a reinforced emitter contact
Bert Haskell, Portable Electronics Product Design and Development , McGraw Hill, New York (2004) ISBN 0-07-141639-0 Hardcover, pp 372, plus XII
Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique
High electrical performance liquid-phase HBr oxidation gate insulator of InAlAs/InGaAs metamorphic MOS-mHEMT
Influence of oxide breakdown position and device aspect ratio on MOSFET's output characteristics
Investigation on seal-ring rules for IC product reliability in 0.25-mum CMOS technology
The stability of the CuInSe 2 solar mini-module I-V characteristics under continuous and light/dark irradiation cycle tests
Reflow discoloration formation on pure tin (Sn) surface finish
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
Effect of Joule heating on the reliability of solder joints under power cycling conditions
Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach
Analysis and modeling of a digital CMOS circuit operation and reliability after gate oxide breakdown: a case study
Thermal design and experimental validation for optical transmitters
Investigation on the thermal behavior of 0.15 μm gate-length In 0.4 Al 0.6 As/In 0.4 Ga 0.6 As MHEMT
Condition assessment and fault prognostics of microelectromechanical systems
Thermo-mechanical simulation of PCB with embedded components
An anti-snapback circuit technique for inhibiting parasitic bipolar conduction during EOS/ESD events
Comprehensive ESD protection for RF inputs
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages
Decrease in on-state gate current of AlGaN/GaN HEMTs by recombination-enhanced defect reaction of generated hot carriers investigated by TCAD simulation
Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability
Failure rate calculation method for high power devices in space applications at low earth orbit
Obtaining FPGA soft error rate in high performance information systems
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
Correlation between localized strain and damage in shear-loaded Pb-free solders
Bump formation for flip chip and CSP by solder paste printing
1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe
Process influence on product CDM ESD performance
Precise SPICE macromodel applied to high-voltage power MOSFET
High brightness GaN LEDs degradation during dc and pulsed stress
Investigation of the fluid/structure interaction phenomenon in IC packaging
Modeling secondary electron images for linewidth measurement by critical dimension scanning electron microscopy
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies
Experimental study of bias dependence of pulsed laser-induced single-event transient in SiGe HBT
Staggered heat sinks with aerodynamic cooling fins
Self-protection capability of integrated NLDMOS power arrays in ESD pulse regimes
Modular, portable, and easily simulated ESD protection networks for advanced CMOS technologies
A fault tolerant implementation of the Goertzel algorithm
Applications of DCIV method to NBTI characterization
Reliability considerations for recent Infineon SiC diode releases
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution
Reliability aspects of copper metallization and interconnect technology for power devices
High voltage applications and NBTI effects of DT-pMOSFETS with reverse Schottky substrate contacts
Non-linear average electrothermal models of buck and boost converters for SPICE
A new creep-fatigue life model of lead-free solder joint
Measurement of the transient junction temperature in MOSFET devices under operating conditions
Reliability analysis of spin transfer torque based look up tables under process variations and NBTI aging
Coupling capacitances in the planar conductive path system of the hybrid circuit with dielectric layer
Gaussian process regression approach for robust design and yield enhancement of self-assembled nanostructures
Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development
VCO phase noise improvement through direct passive component modification in the FIB
Dynamic active cooling for improved power system reliability
Lifetime estimation of SiC MOSFETs under high temperature reverse bias test
Comparative studies of Pt and Ir schottky contacts on undoped Al 0.36 Ga 0.64 N
Effect of residual stress on the electrical activity of dislocations in GaN light emitting diodes
ILP method for memory mapping in high-level synthesis
Low-cost backside laser test method to pre-characterize the COTS IC's sensitivity to Single Event Effects
On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET's
Evaluation of the ESD performance of local protections based on SCR or bi-SCR with dynamic or static trigger circuit in 32 nm
Effects of hot carriers in offset gated polysilicon thin-film transistors
A statistical approach to characterizing the reliability of systems utilizing HBT devices
Similarity approach for reducing qualification tests of electronic components
Improving cooling effectiveness by use of chamfers on the top of electronic components
A new method for estimating the conductive filament temperature in OxRAM devices based on escape rate theory
Analysis and optimization of lateral thin-film Silicon-on-insulator (SOI) MOSFET transistors
Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs - Concepts, constraints and solutions
Workload and temperature dependent evaluation of BTI-induced lifetime degradation in digital circuits
Electromigration challenges for advanced on-chip Cu interconnects
Soft error recovery in simplex and triplex memory systems
Thermal properties of diamond/copper composite material
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test
RF stress effects on CMOS LC-loaded VCO reliability evaluated by experiments
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method
An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
Characterization and modelling of ageing failures on power MOSFET devices
Investigation of low temperature SRAM and ROM failures to enable the replacement of cold test insertion by room temperature test
Field returns, a source of natural failure mechanisms
Reliability challenges for copper low-k dielectrics and copper diffusion barriers
A study of SiC Power BJT performance and robustness
Characterizations of high resistivity TiN x O y thin films for applications in thin film resistors
Revisiting power cycling test for better life-time prediction in traction
Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires
vfTLP-V TH : A new method for quantifying the effectiveness of ESD protection for the CDM classification test
Reliability Evaluation and Redesign of LNA
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions
Highly reliable spot-size converter integrated laser diodes over a wide temperature range for access network systems
Method for evaluation of transient-fault detection techniques
Concept of smart integrated life consumption monitoring system for electronics
Laser induced impact ionization effect in MOSFET during 1064 nm laser stimulation
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height
Performance analysis of S-parameter in N-MOSFET devices after thermal accelerated tests
Measuring stress next to Au ball bond during high temperature aging
Radiation induced transconductance overshoot in the 130 nm partially-depleted SOI MOSFETs
A MEMS-based wireless multisensor module for environmental monitoring
Effects of different test profiles of temperature cycling tests on the reliability of RFID tags
Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy
Prediction of the epoxy moulding compound aging effect on package reliability
Shock impact reliability characterization of a handheld product in accelerated tests and use environment
Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects
New ESD challenges in RFID manufacturing
Sensor system optimization to meet reliability targets
Study of hot electrons in AlGaN/GaN HEMTs under RF Class B and Class J operation using electroluminescence
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
Instability of oxide thin film transistor under electrical-mechanical hybrid stress for foldable display
Splitter plate application on the circular and square pin fin heat sinks
Tensile CESL-induced strain dependence on impact ionization efficiency in nMOSFETs
Impact of neutron irradiation on the RF properties of oxidized high-resistivity silicon substrates with and without a trap-rich passivation layer
Development of substrate-pumped nMOS protection for a 0.13 mum technology
High reliability power VDMOS Transistors in Bipolar/CMOS/DMOS technology
Enhanced permanent degradation of organic TFT under electrical stress and visible light exposure
A comparison of early stage hot carrier degradation behaviour in 5 and 3 V sub-micron low doped drain metal oxide semiconductor field effect transistors
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder
200 V Fast Recovery Epitaxial Diode with superior ESD capability
ESD characterization of a 190V LIGBT SOI ESD power clamp structure for plasma display panel applications
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
Non-destructive Testing Technique for MOSFET's Characterisation during Soft-Switching ZVS Operations
Wear-out, breakdown occurrence and failure detection in 18-25 Å ultrathin oxides
High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material
Evaluate the orderings of risk for failure problems using a more general RPN methodology
ESD failure signature in capacitive RF MEMS switches
DMOS FET parameter drift kinetics from microscopic modeling
Observer based dynamic adaptive cooling system for power modules
Moisture effect on the dielectric and structure of BaTiO 3 -based devices
A methodologic project to characterize and model COTS component reliability
The fundamentals of thermal-mass diffusion analogy
Mechanical analysis of press-pack IGBTs
Read disturb in flash memories: reliability case
A low-frequency noise model for advanced gate-stack MOSFETs
Leakage current mechanism and effect of Y 2 O 3 doped with Zr high-K gate dielectrics