yusuke1997/dblp-id-title huggingface dataset:
Simulation and modelling of VDMOSFET self protection under TLP-stress
TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology
Measuring seam/crack formation in interconnect metallization
Numerical modeling of warpage induced in QFN array molding process
Microstructure evolution of the Sn-Ag-y%Cu interconnect
Hot carrier degradation modeling of short-channel n-FinFETs suitable for circuit simulators
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
Lifetime prediction of aluminum electrolytic capacitors in LED drivers considering parameter shifts
Low frequency noise in nMOSFETs with subnanometer EOT hafnium-based gate dielectrics
Characterization of flip chip bonded structure with Cu ABL power bumps
Enabling robust automotive electronic components in advanced CMOS nodes
Electro- and thermomigration-induced IMC formation in SnAg 3.0 Cu 0.5 solder joints on nickel gold pads
Envelop tracking based embedded current measurement for monitoring of IGBT and power converter system
Recovery and universality in NBTI
An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability
Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size
Effects of channel thickness variation on bias stress instability of InGaZnO thin-film transistors
Total ionizing dose effects in elementary devices for 180-nm flash technologies
Copper metallization influence on power MOS reliability
Temperature dependences of threshold voltage and drain-induced barrier lowering in 60 nm gate length MOS transistors
Investigation on LDMOS-SCR with high holding current for high voltage ESD protection
The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis
Transient-induced latch-up test setup for wafer-level and package-level
Radiation and COTS at ground level
Reliability of rail transit traction drive system-A review
Improved performances of a two-step passivated heterojunction bipolar transistor
ESD protection structures for BCD5 smart power technologies
Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact
Markov process based reliability model for laser diodes in space radiation environment
The degradation mechanism of flexible a-Si: H/μc-Si: H photovoltaic modules
Electrical characteristics of high-energy proton irradiated ultra-thin gate oxides
Thermal heating within SOI
Clamp type built-in current sensor using PCB in high-voltage power modules
Flexible active cycle stress testing of smart power switches
Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures
Studies on the reliability of power packages based on strength and fracture criteria
Out of plane vs in plane flexural behaviour of thin polysilicon films: Mechanical characterization and application of the Weibull approach
Reliability aspects of microsensors and micromechatronic actuators for automotive applications
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers
Investigation of defects introduced by static and dynamic hot carrier stress on SOI partially depleted body-contact MOSFETs
Saline soak tests to determine the short-term reliability of an in situ thin film resistance temperature detector
Design optimization of ESD protection and latchup prevention for a serial I/O IC
Classification of high-voltage varistors into groups of differentiated quality
Extraction of 3D parasitic capacitances in 90 nm and 22 nm NAND flash memories
Experimental study of electroluminescence and temperature distribution in high-power AlGaInN LEDs & LED arrays
Failure analysis of projected capacitance touch panel liquid crystal displays - Two case studies
A prognostic methodology for power MOSFETs under thermal stress using echo state network and particle filter
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding
Amr M. Fahim, Clock Generators for SoC Processors: Circuit and Architectures , Kluwer Academic Publishers, Boston (2005) ISBN 1-4020-8079-4 244 pp., Hardcover, plus XVIII
Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes
Determination of the thermal resistance and current exponent of heterojunction bipolar transistors for reliability evaluation
Electrical characteristics of nMOSFETs fabricated on hybrid orientation substrate with amorphization/templated recrystallization method
Non-linear thermal simulation at system level: Compact modelling and experimental validation
Threshold-voltage variability analysis and modeling for junctionless double-gate transistors
System-level variation-aware aging simulator using a unified novel gate-delay model for bias temperature instability, hot carrier injection, and gate oxide breakdown
Impact of the As dose in 0.35 mum EEPROM technology: characterization and modeling
The effect of gate overlap on the device degradation in IGZO thin film transistors
Increased hot carrier effects in Gate-All-Around SOI nMOSFET's
Investigation of the electrical transport mechanism in VO x thin films
A review of recent MOSFET threshold voltage extraction methods
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
IGBT modules robustness during turn-off commutation
Metal defect localization of GaAs or Si based ICs by dynamic emission microscopy
Single-bit failure analysis at a nanometer resolution by conductive atomic force microscopy
Facetting of the self-assembled droplet epitaxial GaAs quantum dot
A study of electrical characteristic changes in MOSFET by electron beam irradiation
Ultra-high voltage electron microscopy investigation of irradiation induced displacement defects on AlGaN/GaN HEMTs
Simultaneous IC-internal voltage and current measurements via a multi lever Scanning Force Microscope
Simulation model and parameter extraction of Field-Stop (FS) IGBT
Impact of gate drive voltage on avalanche robustness of trench IGBTs
Behrouz A. Forouzan, Data Communications and Networking Third edition, McGraw-Hill Higher Education, Boston (2003) ISBN 0-07-251584-8 Softcover, pp 973, plus XXXIV
Neutron-induced 10 B fission as a major source of soft errors in high density SRAMs
Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED
Reliability predictions in electronic industrial applications
A fault detection strategy using the enhancement ensemble empirical mode decomposition and random decrement technique
Optimization of high voltage LDMOSFETs with complex multiple-resistivity drift region and field plate
High temperature electro-optical degradation of InGaN/GaN HBLEDs
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders
Improvement of integrated circuit testing reliability by using the defect based approach
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method
The influence of assisted ion beam bombardment on structure and electrical characteristics of HfSiO dielectric synthesized by DIBSD
Temperature rise measurement for power-loss comparison of an aluminum electrolytic capacitor between sinusoidal and square-wave current injections
Status and trends of silicon RF technology
Fast reliability analysis of combinatorial logic circuits using conditional probabilities
Chip and package-related degradation of high power white LEDs
Location of defective cells in HBT power amplifier arrays using IR emission microscopy
Mössbauer studies of β → α phase transition in Sn-rich solder alloys
Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses
Comparative study of AlGaN/GaN HEMTs robustness versus buffer design variations by applying Electroluminescence and electrical measurements
Accurate negative bias temperature instability lifetime prediction based on hole injection
On the influence of the variation of measurement conditions on the FNT characteristics of stressed thin silicon oxides
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer
Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Free convective heat transfer coefficient for high powered and tilted QFN64 electronic device
Temperature-dependent breakdown and hot carrier stress of PHEMTs
An approach to statistical analysis of gate oxide breakdown mechanisms
Substrate potential shift due to parasitic minority carrier injection in smart-power ICs: measurements and full-chip 3D device simulation
Critical factors influencing the voltage robustness of AlGaN/GaN HEMTs
3-D thermal models calibration by parametric dynamic compact thermal models
Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology
Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling
Bias temperature instability and condition monitoring in SiC power MOSFETs
Investigation on a new silver photoimageable conductor
MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network
Direct observation of the generation of breakdown spots in MIM structures under constant voltage stress
Assessment of read disturb immunity in conducting bridge memory devices - A thermodynamic perspective
Degradation of AlInGaP red LEDs under drive current and temperature accelerated life tests
Sequential environmental stresses tests qualification for automotive components
Applications of finite element methods for reliability study of ULSI interconnections
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
Catastrophic optical damage of high power InGaAs/AlGaAs laser diodes
Address generators for linear systolic array
Holding voltage investigation of advanced SCR-based protection structures for CMOS technology
SEM-based nanoprobing on 32 and 28 nm CMOS devices challenges for semiconductor failure analysis
Electro-thermal stress effect on InGaP/GaAs heterojunction bipolar low-noise amplifier performance
Analysis of punch-through breakdown in bulk silicon RF power LDMOS transistors
Pre-breakdown noise in electrically stressed thin SiO 2 layers of MOS devices observed with C-AFM
Investigation of the hot carrier degradation in power LDMOS transistors with customized thick oxide
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology
Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections
Phase displacement study in MOSFET based ring VCOs due to heavy-ion irradiation using 3D-TCAD and circuit simulation
Defect detection of flip-chip solder joints using modal analysis
Operand Width Aware Hardware Reuse: A low cost fault-tolerant approach to ALU design in embedded processors
Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics
Temperature effects on DC and small signal RF performance of AlGaAs/GaAs HEMTs
Bidirectional electromigration failure
Failure mechanisms of discrete protection device subjected to repetitive electrostatic discharges (ESD)
New insights into board level drop impact
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging
Development and characterisation of nanowire-based FETs
Impact of different transistor arrangements on gate variability
Analysis of hot carrier effects in a 0.35 µm high voltage n-channel LDMOS transistor
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump
FeRAM technology for high density applications
Lot reliability issues in commercial off the shelf (COTS) microelectronic devices
Development of a standard for transient measurement of junction-to-case thermal resistance
Optical and electrical characterization of hafnium oxide deposited by MOCVD
A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength
All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime
ESD tests on 850 nm GaAs-based VCSELs
A physical based model to predict performance degradation of FinFET accounting for interface state distribution effect due to hot carrier injection
Analytical long-term NBTI recovery model with slowing diffusivity and locking effect of hydrogen considered
On the impact of substrate electron injection on dynamic Ron in GaN-on-Si HEMTs
WL-CSP reliability with various solder alloys and die thicknesses
Electrical aging behavioral modeling for reliability analyses of ionizing dose effects on an n-MOS simple current mirror
Statistical RTS model for digital circuits
Optimizing the controller IC for micro HDD process based on Taguchi methods
Sample preparation techniques for physical analysis of VLSIs
Reliability- and process-variation aware design of integrated circuits
Verification and reduction of surface charging during high/medium current implantations by implementing plasma damage monitoring
Effect of temperature on the electrophysical properties of Si-polymer composite varistors
Investigations on the EFT immunity of microcontrollers with different architectures
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints
Enhanced reliability for low-temperature gate dielectric of MOS devices by N 2 O or NO plasma nitridation
Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown
Impact of the lateral straggle on the Analog and RF performance of TFET
An overview of the reliability prediction related aspects of high power IGBTs in wind power applications
Performance variation of dark current density-voltage characteristics for PID-affected monocrystalline silicon solar modules from the field
Soft error estimation and mitigation of digital circuits by characterizing input patterns of logic gates
Effects of latent damage of recrystallization on lead free solder joints
Modeling of data retention statistics of phase-change memory with confined- and mushroom-type cells
Application of multi-output Gaussian process regression for remaining useful life prediction of light emitting diodes
Degradation of InGaN-based LEDs related to charge diffusion and build-up
Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx film
Implications of thermal instability on HBT power amplifier reliability
Process variation dependence of total ionizing dose effects in bulk nFinFETs
A low-cost built-in error correction circuit design for STT-MRAM reliability improvement
A comprehensive model for oxide degradation
Mohamed Ilyas, Imad Mahgoud, Handbook of Sensor Networks: Compact Wireless and Wired Sensing Systems, Hardcover, pp 864, CRC Press, 2005, ISBN 0-8493-1968-4
Reliability matrix solution to multiple mechanism prediction
Thermal Ta 2 O 5 --alternative to SiO 2 for storage capacitor application
Estimating the Single-Event Upset sensitivity of a memory array using simulation
Reliable ultra-low-voltage low-power probabilistic-based noise-tolerant latch design
RF measurements to pinpoint defects in inkjet-printed, thermally and mechanically stressed coplanar waveguides
Moisture diffusion in BCB resins used for MEMS packaging
Analysis and modeling of the gate leakage current in advanced nMOSFET devices with severe gate-to-drain dielectric breakdown
Statistical simulation of random dopant induced threshold voltage fluctuations for 35 nm channel length MOSFET
Interfacial thermal stresses in ACF bonding assembly
Thermal stress in through-silicon-vias: Theory-of-elasticity approach
Test methodology of a new upset mechanism induced by protons in deep sub-micron devices
Comparison of the performances of an InAlN/GaN HEMT with a Mo/Au gate or a Ni/Pt/Au gate
Qualification of 50 V GaN on SiC technology for RF power amplifiers
Feature extraction and damage-precursors for prognostication of lead-free electronics
Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages
Voltage and temperature effect on dielectric charging for RF-MEMS capacitive switches reliability investigation
On the reliability of instruments for environmental monitoring: some practical considerations
Correlation between P3HT inter-chain structure and J sc of P3HT: PC [70] BM blends for solar cells
Compared deep class-AB and class-B ageing on AlGaN/GaN HEMT in S-Band pulsed-RF operating life
In situ crystallisation in ZrO 2 thin films during high temperature X-ray diffraction
Investigation of MOSFET failure in soft-switching conditions
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique
A bitstream readback-based automatic functional test and diagnosis method for Xilinx FPGAs
Space Domain Reflectometry for opens detection location in microbumps
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints
Time Resolved Imaging: From logical states to events, a new and efficient pattern matching method for VLSI analysis
Reliability of ICA attachment of SMDs on inkjet-printed substrates
Improved understanding of metal ion reservoirs within barrier-metal systems
Improvement of lumen efficiency in white light-emitting diodes with air-gap embedded package
Influence of test techniques on soft breakdown detection in ultra-thin oxides
Texture of electrodeposited tin layers and its influence on their corrosion behavior
Device linearity and intermodulation distortion comparison of dual material gate and conventional AlGaN/GaN high electron mobility transistor
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
Design of 2xVDD-tolerant mixed-voltage I/O buffer against gate-oxide reliability and hot-carrier degradation
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)
An automated lifetest equipment for optical emitters
An analytical model for read static noise margin including soft oxide breakdown, negative and positive bias temperature instabilities
20 GHz on-chip measurement of ESD waveform for system level analysis
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps
The device characteristics of Ir- and Ti-based Schottky gates AlSb/InAs high electron mobility transistors
A thermodynamic limit for digital electronics
Monolithic active pixel sensor realized in SOI technology - concept and verification
The resistive switching characteristics of a Ti/Gd 2 O 3 /Pt RRAM device
ESD-RF co-design methodology for the state of the art RF-CMOS blocks
Lithium-ion batteries remaining useful life prediction based on a mixture of empirical mode decomposition and ARIMA model
Self-consistent design issues for high frequency Cu interconnect reliability incorporating skin effect
Dual-resonance concurrent oscillator
Simple and effective open switch fault diagnosis of single-phase PWM rectifier
Application of three-parameter lognormal distribution in EM data analysis
Nb-doped Ga 2 O 3 as charge-trapping layer for nonvolatile memory applications
Low temperature fabrication of Ni-P metallic patterns on ITO substrates utilizing inkjet printing
Description of supercapacitor performance degradation rate during thermal cycling under constant voltage ageing test
Methods to improve reliability of bulge test technique to extract mechanical properties of thin films
Ionising radiation and electrical stress on nanocrystal memory cell array
Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method
Reliability of Wafer Level Chip Scale Packages
Crosstalk in monolithic GaN-on-Silicon power electronic devices
Temperature effects on the bulk discharge current of dielectric films of MEMS capacitive switches
Reliability testing of flexible printed circuit-based RF MEMS capacitive switches
Vacuum effect on the void formation of the molded underfill process in flip chip packaging
Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp 183, plus XIX, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8
Study of metal adhesion on porous low-k dielectric using telephone cord buckling
Improving reliability of thick film initiators for automotive applications based on FE-analyses
VDMOSFET HEF degradation modelling considering turn-around phenomenon
Automatic characterisation method for statistical evaluation of tin whisker growth
Process integration and nanometer-scale electrical characterization of crystalline high-k gate dielectrics
Breakdown spots of ultra-thin (EOT<1.5nm) HfO 2 /SiO 2 stacks observed with enhanced - CAFM
A novel co-design and evaluation methodology for ESD protection in RFIC
Application of MEMS behavioral simulation to Physics of Failure (PoF) modeling
Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing
Mechanical characterization of Sn-Ag-based lead-free solders
Reliability of MEMS - a methodical approach
A reliable speed controller for suppressing low frequency concussion of electric vehicle
Modern IGBT gate driving methods for enhancing reliability of high-power converters - An overview
Health assessment and management of wind turbine blade based on the fatigue test data
The challenges of virtual prototyping and qualification for future microelectronics
Laser modulation mapping on an unmodified laser scanning microscope
Electro- and thermo-migration induced failure mechanisms in Package on Package
A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds
Implementation of TRE systems into Emission Microscopes
Effect of the drop impact on BGA/CSP package reliability
Generic simulator for faulty IC
Inkjettable conductive adhesive for use in microelectronics and microsystems technology
Experimental study of carrier transport in multi-layered structures
The phenomenon of tin pest: A review
System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 283, plus IX, ISBN 1-4020-7046-2
Laser diode COFD analysis by thermoreflectance microscopy
Electrical and structural properties of hafnium silicate thin films
Gate leakage current in GaN-based mesa- and planar-type heterostructure field-effect transistors
Solder fatigue failures in a new designed power module under Power Cycling
Some practical considerations for effective and efficient wafer-level reliability control
Online condition monitoring of IGBT modules using voltage change rate identification
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies
Effect of temperature on the capacitance-frequency and conductance-voltage characteristics of polyaniline/p-Si/Al MIS device at high frequencies
Transient dual interface measurement of junction-to-case thermal resistance in AlGaN/GaN HEMT utilizing an improved infrared microscope
Special Section on Reliability of Passive Components
Radiation-induced shallow trench isolation leakage in 180-nm flash memory technology