yusuke1997/dblp-id-title huggingface dataset:
Bridging the business model gap between the semiconductor industry and the automotive industry with respect to quality and reliability
Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues
FPGA-based design of advanced BMS implementing SoC/SoH estimators
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations
Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys
Experimental extraction of degradation parameters after constant voltage stress and substrate hot electron injection on ultrathin oxides
Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part I
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders
Leakage current and defect characterization of p + n-source/drain diodes
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2-2.3nm) oxides
Fault diagnosis for the motor drive system of urban transit based on improved Hidden Markov Model
Suppression of boron penetration through thin gate oxides by nitrogen implantation into the gate electrode in PMOS devices
Total ionizing dose reliability of thin SiO 2 in PowerMOSFET devices
Research on lumen depreciation related to LED packages by in-situ measurement method
Low cost soft error hardened latch designs for nano-scale CMOS technology in presence of process variation
Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage
Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime
Advances in non-volatile memory technology
Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
Reliability of ultra thin ZrO 2 films on strained-Si
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures
Contact resistivity instability in embedded SRAM memory
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application
Algorithm transformation methods to reduce the overhead of software-based fault tolerance techniques
NBTI: Experimental investigation, physical modelling, circuit aging simulations and verification
Investigation on damaged planar-oxide of 1200 V SiC power MOSFETs in non-destructive short-circuit operation
Emulation-based fault analysis on RFID tags for robustness and security evaluation
Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application
Evidence of chlorine ion penetration in InP/InAsP quantum well structures during dry etching processes and effects of induced-defects on the electronic and structural behaviour
Simulation of failure time distributions of metal lines under electromigration
Size effects on the DC characteristics and low frequency noise of double polysilicon NPN bipolar transistors
Electrical characterization of inorganic-on-organic diode based InP and poly(3, 4-ethylenedioxithiophene)/poly(styrenesulfonate) (PEDOT: PSS)
Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off
Complex system maintainability verification with limited samples
Mechanical reliability challenges for MEMS packages: Capping
A distributed minority and majority voting based redundancy scheme
Impact of meteorological variations on the lifetime of grid-connected PV inverters
Investigation of dynamic disturbance quantities in piezoresistive silicon sensors
Polysilicon oxide quality optimization at Wafer level of a Bipolar/CMOS/DMOS technology
Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters
TCAD simulation capabilities towards gate leakage current analysis of advanced AlGaN/GaN HEMT devices
A design for robust wide metal tracks
Analysis of deep submicron VLSI technological risks: A new qualification process for professional electronics
Properties of solders and their fatigue in power modules
Reliability issues in power electronics
Experimental study about gate oxide damages in patterned MOS capacitor irradiated with heavy ions
Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts
Magnetic emission mapping for passive integrated components characterisation
Comparative soft error evaluation of layout cells in FinFET technology
Thermal stress probing the channel-length modulation effect of nano n-type FinFETs
Self-testing of fully differential multistage circuits using common-mode excitation
Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann-Arrhenius-Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models
HKMG CMOS technology qualification: The PBTI reliability challenge
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy
FPGA LUT delay degradation due to HCI: Experiment and simulation results
Low Frequency Noise Measurements for ESD Latent Defect Detection in High Reliability Applications
Efficient error detection in Double Error Correction BCH codes for memory applications
Assessing the value of a lead-free solder control plan using cost-based FMEA
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
Failure Analysis Issues in Microelectromechanical Systems (MEMS)
Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
Reliability of 80 mum pitch flip chip attachment on flex
Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology
Hysteresis effect on traps of Si 3 N 4 sensing membranes for pH difference sensitivity
Destructive events in NAND Flash memories irradiated with heavy ions
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
Condition multi-classification and evaluation of system degradation process using an improved support vector machine
LPCVD-silicon oxynitride films: interface properties
Tunnel FET technology: A reliability perspective
Impact of NBTI/PBTIon SRAMs within microprocessor systems: Modeling, simulation, and analysis
Virtual qualification of moisture induced failures of advanced packages
A new processing method for accelerated degradation data based on quantile regression and pseudo-failure lifetime
Memory architecture exploration for programmable embedded systems; Peter Grun, Nikil Dutt, Alexandru Nicolau. Kluwer Academic Publishers, Boston. 2003. Hardcover, pp 128, plus XVII, ISBN 1-4020-7324-0
Improving the ESD self-protection capability of 60 V HV p-channel LDMOS large array device in 0.25 μm BCD process
What is Electrical Overstress? - Analysis and Conclusions
μ-Raman spectroscopy for stress analysis in high power silicon devices
Determination of safe reliability region over temperature and current density for through wafer vias
Effects of PCBM concentration on the electrical properties of the Au/P3HT: PCBM/n-Si (MPS) Schottky barrier diodes
RTA effects on the formation process of embedded luminescent Si nanocrystals in SiO 2
An efficient BTX sensor based on p-type nanoporous titania thin films
Study of radiation hardness of HfO 2 -based resistive switching memory at nanoscale by conductive atomic force microscopy
Characteristics of metal-oxide-semiconductor (MOS) device with Er metal gate on SiO 2 film
Analysis of 6 T SRAM cell in sub-45 nm CMOS and FinFET technologies
System ESD robustness by co-design of on-chip and on-board protection measures
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
A thermo-mechanical study on the electrical resistance of aluminum wire conductors
Design and implementation of flexible and stretchable systems
Validation of TSV thermo-mechanical simulation by stress measurement
Review of silver nanoparticle based die attach materials for high power/temperature applications
An investigation of drain pulse induced hot carrier degradation in n-type low temperature polycrystalline silicon thin film transistors
Anode hole generation mechanisms
Characterization and analysis of trap-related effects in AlGaN-GaN HEMTs
Fatigue testing method for fine bond wires in an LQFP package
Active defects in MOS devices on 4H-SiC: A critical review
A new erase method for scaled NAND flash memory device
Robust snubberless soft-switching power converter using SiC power MOSFETs and bespoke thermal design
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter
Evidence for source side injection hot carrier effects on lateral DMOS transistors
RCD snubber design based on reliability consideration: A case study for thermal balancing in power electronic converters
HBM tester waveforms, equivalent circuits, and socket capacitance
A brief overview of gate oxide defect properties and their relation to MOSFET instabilities and device and circuit time-dependent variability
Effects of gamma-ray irradiation on polycrystalline silicon thin-film transistors
Fault-tolerant carry look-ahead adder architectures robust to multiple simultaneous errors
Gate delay variability estimation method for parametric yield improvement in nanometer CMOS technology
Properties of contactless and contacted charging in MEMS capacitive switches
Design of Energy-Efficient Application-Specific Instruction Set Processors (ASIPs), Tilman Glokler, Heinrich Meyr, Kluwer Academic Publishers, Boston, 2004, ISBN 1-4020-7730-0, Hardcover, pp 234, plus XX
Design, development and reliability testing of a low power bridge-type micromachined hotplate
Thermal optimization of GaN-on-Si HEMTs with plastic package
Behavior of power MOSFETs during heavy ions irradiation performed after γ-rays exposure
Interacting multiple model particle filter for prognostics of lithium-ion batteries
Hydrogen-related reliability issues for advanced microelectronics
Modeling of the spectral response of PIN photodetectors Impact of exposed zone thickness, surface recombination velocity and trap concentration
Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account
Study on the degradation induced by donor interface state in deep-sub-micron grooved-gate P-channel MOSFET's
Introduction of InP high speed electronics into optical fiber transmission systems and current technological limits
Thermal investigations of integrated circuits and systems, THERMINIC'16
Benefits of field failure distribution modeling to the failure analysis
TSV by 355 UV laser for 4G component packaging with micro-electroforming
Major factors to the solder joint strength of ENIG layer in FC BGA package
Analysis of neutron-induced single-event burnout in SiC power MOSFETs
Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth
Dislocation assisted diffusion: A mechanism for growth of intermetallic compounds in copper ball bonds
Nanoscale and device level electrical behavior of annealed ALD Hf-based gate oxide stacks grown with different precursors
Mechanical reliability in electronic packaging
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method
A fast and efficient technique to apply Selective TMR through optimization
S. Sitharama Iyengar, Richards R. Brooks, Eds., Distributed Sensor Networks, Hardcover, pp 1123, Chapman & Hall/CRC Press, 2005, ISBN 1-58488-383-9
Investigation of the reliability of 4H-SiC MOS devices for high temperature applications
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
A simplified yield modeling method for design rule trade-off in interconnection substrates
Foreword - On-Chip ESD
Magnetic microscopy for ground plane current detection: a fast and reliable technique for current leakage localization by means of magnetic simulations
High-accurate computation of wave propagation in complex waveguides for microchip optical interconnections
Time Resolved Photon Emission Processing Flow for IC Analysis
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
The total ionizing dose response of leading-edge FDSOI MOSFETs
Trends of power semiconductor wafer level packaging
Nitrogen bonding configurations near the oxynitride/silicon interface after oxynitridation in N 2 O ambient of a thin SiO 2 gate
Compare of SOI and SOS LIGBT structure for the thermal conductivity and self-heating characteristics
Dynamic defect localization using FPGA to monitor digital values
Study of anisotropic conductive adhesive joint behavior under 3-point bending
Universal mechanisms of Al metallization ageing in power MOSFET devices
Effect of binding force between silver paste and silicon on power degradation of crystalline silicon solar module
Improving the yield and reliability of the bulk-silicon HV-CMOS by adding a P-well
Correlation between infrared transmission spectra and the interface trap density of SiO 2 films
Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet
Electrical characterization of hafnium oxide and hafnium-rich silicate films grown by atomic layer deposition
A theoretical model for calculating the effects of carrier heating with nonequilibrium hot phonons on semiconductor devices and the current-voltage relations
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
Ferroelectric of HfO 2 dielectric layer sputtered with TiN or ZrN for sandwich-like metal-insulator-metal capacitors
Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3, 4-ethylenedioxythiophene)
A novel soldering method to evaluate PCB pad cratering for pin-pull testing
Exact 3D simulation of Scanning Electron Microscopy images of semiconductor devices in the presence of electric and magnetic fields
Study of intrinsic characteristics of ESD protection diodes for high-speed I/O applications
Monte Carlo Static Timing Analysis with statistical sampling
High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for high-speed RF switch applications
Impact of module and inverter failures on the performance of central-, string-, and micro-inverter PV systems
Thermal reliability of VCO using InGaP/GaAs HBTs
Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates
Pseudopotential study of PrO 2 and HfO 2 in fluorite phase
Remote carrier trapping in FinFETs with ONO buried layer: Temperature effects
A novel method of reliability-centered process optimization for additive manufacturing
Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators
Study on specific effects of high frequency ripple currents and temperature on supercapacitors ageing
Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms
Robustness Validation - A physics of failure based approach to qualification
CMOS logic gate performance variability related to transistor network arrangements
A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors
Board level investigation of BGA solder joint deformation strength
A single event upset tolerant latch design
Advanced analysis on board trace reliability of WLCSP under drop impact
Use of golden samples for the assessment of the quality and reproducibility of scanning acoustic microscopy images of electronics samples
Device reliability study of AlGaN/GaN high electron mobility transistors under high gate and channel electric fields via low frequency noise spectroscopy
A novel UIS test system with Crowbar feedback for reduced failure energy in power devices testing
Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)
Yield Evaluation of Gold Sensor Electrodes Used for Fully Electronic DNA Detection Arrays on CMOS
Effect of trench edge on pMOSFET reliability
Temperature-dependent hole transport for pentacene thin-film transistors with a SiO 2 gate dielectric modified by (NH 4 ) 2 S x treatment
Correlation between EOS customer return failure cases and Over Voltage Stress (OVS) test method
Kelvin probe force microscopy - An appropriate tool for the electrical characterisation of LED heterostructures
Properties of low temperature Sn-Ag-Bi-In solder systems
Biaxial initial stress characterization of bilayer gold RF-switches
Sub-100 nm CMOS circuit performance with high-K gate dielectrics
In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens
Module allocation with idle-time utilization for on-line testability
Creep fatigue models of solder joints: A critical review
Improved inductive-system-level IEC ESD performance for automotive applications using mutual ballasted ESD protection technique
Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure
Evaluation of test methods for silicon die strength
A cloud model-based method for the analysis of accelerated life test data
A review of electrostatic discharge (ESD) in advanced semiconductor technology
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing
Estimation of the degradation rate of multi-crystalline silicon photovoltaic module under thermal cycling stress
Characterization and modeling of hot carrier injection in LDMOS for L-band radar application
Degradation and recovery of AlGaAs/GaAs p-HEMT irradiated by high-energy particle
F. Mayer-Linderberg, Dedicated Digital Processors: Methods in Hardware/Software System Design, John Wiley & Sons, Ltd., Chichester (2004) ISBN 0-470-84444-2 Hardcover, pp 302, plus XI
Development of an EB/FIB Integrated Test System
Estimation of RF performance from LF measurements: Towards the design for reliability in RF-MEMS
Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system
Modeling of hetero-interface potential and threshold voltage for tied and separate nanoscale InAlAs-InGaAs symmetric double-gate HEMT
A 0.11 mum CMOS technology featuring copper and very low k interconnects with high performance and reliability
Importance of multi-temp testing in automotive qualification and zero defects program
Temperature behavior and modeling of ohmic contacts to Si + implanted n-type GaN
Low power resistive switching memory using Cu metallic filament in Ge 0.2 Se 0.8 solid-electrolyte
Traps localization and analysis in GaN HEMTs
Ultra-thick gate oxides: charge generation and its impact on reliability
Laser Voltage Probing (LVP) - Its value and the race against scaling
Case study: Failure analysis for metal corrosion induced by pressure pot test
Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules
The degradation mechanisms in high voltage pLEDMOS transistor with thick gate oxide
Development of high-temperature solders: Review
Lifetime estimation of high-temperature high-voltage polymer film capacitor based on capacitance loss
Simultaneous mechanical and electrical straining of conventional thick-film resistors
RF functional-based complete FA flow
Application of the defect clustering model for forming, SET and RESET statistics in RRAM devices
Predictive evaluation of electrical characteristics of sub-22 nm FinFET technologies under device geometry variations
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
Noise as a tool for non-destructive testing of single-crystal silicon solar cells
Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes
A Dedicated TLP Set-Up to Investigate the ESD Robustness of RF Elements and Circuits
Investigation on copper diffusion depth in copper wire bonding
Special Issue on Prognostics and Health Management
Determination of Dielectric Breakdown Weibull Distribution Parameters Confidence Bounds for Accurate Ultrathin Oxide Reliability Predictions
Ferroelectric characteristic of group IV elements added SrBi 2 Ta 2 O 9 thin films
Electronic structure of transition metal/rare earth alternative high-K gate dielectrics: interfacial band alignments and intrinsic defects
An accurate model for soft error rate estimation considering dynamic voltage and frequency scaling effects
Pseudomorphic high electron mobility transistor monolithic microwave integrated circuits reliability study
Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests
Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2
Backside Flip-Chip testing by means of high-bandwidth luminescence detection
New distributed model of NPT IGBT dedicated to power circuits design
Failure causes and mechanisms of retrofit LED lamps
The role of electronic energy loss in SHI irradiated Ni/oxide/n-GaP Schottky diode
Investigation of IGBT turn-on failure under high applied voltage operation
Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint
Investigation of dynamic color deviation mechanisms of high power light-emitting diode
Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode
ESD protection structure qualification - a new approach for release for automotive applications
Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions
FESeR: A data-driven framework to enhance sensor reliability for the system condition monitoring
Scanning Thermal Microscopy in Microsystem Reliability Analysis
Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Effects of constant voltage stress on p- and n-type organic thin film transistors with poly(methyl methacrylate) gate dielectric
Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections
Investigation of BTI characteristics and its behavior on 10 nm SRAM with high-k/metal gate FinFET technology having multi-V T gate stack
Reliability of gate dielectrics and metal-insulator-metal capacitors
Foundry workflow for dynamic-EFA-based yield ramp
General linearized model use for High Power Reliability Assessment test results: Conditions, procedure and case study
Gate oxide failures due to anomalous stress from HBM ESD testers
Methods of sequential test optimization in dynamic environment
Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications
IMAPS Poland 2004 - Guest Editorial
Analysis of humidity effects on the degradation of high-power white LEDs
Changes in the characteristics of CuInGaSe 2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method
Soft breakdown and hard breakdown in ultra-thin oxides
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics
Stress analyses of high spatial resolution on TSV and BEoL structures
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints
Mechanisms and solutions to the brittle solder joint in electroless Ni plating