yusuke1997/dblp-id-title huggingface dataset:
Electron beam induced carbon deposition using hydrocarbon contamination for XTEM analysis
Aging characteristics of ZnO-PrO 1.83 -based semiconducting varistors for surge protection reliability
Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body
On-Chip ESD
Thermal and free carrier laser interferometric mapping and failure analysis of anti-serial smart power ESD protection structures
Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree
Long-term stresses on linear micromirrors for pico projector application
Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP
An empirical model for thermal interface materials based on experimental characterizations under realistic conditions
Mitigation of permanent faults in adaptive equalizers
Failures on DC-DC modules following a change of wire bonding material from gold to copper
Proton induced trapping effect on space compatible GaN HEMTs
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
Optimal placement of electronic devices in forced convective cooling conditions
Locating hot carrier injection in n-type DeMOS transistors by Charge Pumping and 2D device simulations
A novel current-limiting circuit based on resistive-type SFCL for fault in DC power system
HMM-TLP correlation for system-efficient ESD design
Analysis of the gate current as a suitable indicator for FET degradation under nonlinear dynamic regime
Full-Chip Reliability Simulation for VDSM Integrated Circuits
Yale N. Patt and Sanjay J. Patel, Introduction to Computing Systems: From Bits and Gates to C and Beyond Second edition, McGraw-Hill Higher Education, Boston (2004) ISBN 0-07-121503-4 Softcover, pp 632, plus XXIV
Two-thermal-states model predictive control for IGBT in three-phase inverter
Quantitative 3D reconstruction from BS imaging
Modeling of copper wire bonding process on high power LEDs
Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Impact of bias condition on 1/f noise of dual-gate depletion type MOSFET in linear region and consequences for noise diagnostic application and modelling
Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with ITO local conducting buried layer
A voltage calibration technique of electro-optic probing for characterization internal to IC's chip
ACF particle distribution in COG process
Experimental and numerical approach on junction temperature of high-power LED
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Effects of device layout on the drain breakdown voltages in MuGFETs
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Stress evolution in the metal layers of TSVs with Bosch scallops
A MAIC approach to TFT-LCD panel quality improvement
Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO 2 film as gate dielectric with improved reliability
Discovering and reducing defects in MIM capacitors
Intrinsic stress analysis of tungsten-lined open TSVs
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
Characterisation of defects generated during constant current InGaN-on-silicon LED operation
Deep level defects involved in MOS device instabilities
Vertical natural convection models and their effect on failure analysis in electro-thermal simulation of large-surface OLEDs
Investigation of interface, shallow and deep oxide traps under NBTI stress using charge pumping technique
Effect of gate barrier and channel buffer layer on electric properties and transparence of the a-IGZO thin film transistor
Soft errors in floating gate memory cells: A review
Reliability management - The central enabler for advanced Technologies in Automotive
Cory L. Clark, LabVIEW Digital Signal Processing and Digital Communications , McGraw Hill, New York (2005) ISBN 0-07-144492-0 205 pp, Hardcover, plus XIII
The total ionizing dose response of a DSOI 4Kb SRAM
Reliability of polysilicon microstructures: in situ test benches
A newly developed rapid uniform thermal cycle test system for electronic components
Modular sensor chip design for package stress evaluation and reliability characterisation
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
Determination of bulk discharge current in the dielectric film of MEMS capacitive switches
Influence of multi-finger layout on the subthreshold behavior of nanometer MOS transistors
In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM)
Failure analyses for debug and ramp-up of modern IC's
Robustness improvement of VDMOS transistors in Bipolar/CMOS/DMOS technology
Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects
Temperature dependent subthreshold model of long channel GAA MOSFET including localized charges to study variations in its temperature sensitivity
A review of reliability prediction methods for electronic devices
Thermal and electrical stress effects of electrical and optical characteristics of Alq3/NPD OLED
Carrier separation analysis for clarifying carrier conduction and degradation mechanisms in high-k stack gate dielectrics
A very unusual transistor failure, caused by a solenoid
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing
Safe cell, safe battery? Battery fire investigation using FMEA, FTA and practical experiments
Analysis of current collapse effect in AlGaN/GaN HEMT: Experiments and numerical simulations
An infrastructure for debug using clusters of assertion-checkers
Reliability Problems of Passive Optical Devices and Modules after Mechanical, Thermal and Humidity Testing
Observation of the internal waveforms in high-speed high-density LSIs using an EOS prober
Lifetime estimation of analog circuits from the electrical characteristics of stressed MOSFETs
3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment
Structuration of the low temperature co-fired ceramics (LTCC) using novel sacrificial graphite paste with PVA-propylene glycol-glycerol-water vehicle
Design and simulation of hybrid CMOS-SET circuits
Device instability of amorphous InGaZnO thin film transistors with transparent source and drain
Test response compaction method with improved detection and diagnostic abilities
Study of stress-induced leakage current (SILC) in HfO 2 /Dy 2 O 3 high-kappa gate stacks on germanium
Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode
Color shift acceleration on mid-power LED packages
Device characterization of 16/14 nm FinFETs for reliability assessment with infrared emission spectra
Density functional theory of high-k dielectric gate stacks
A design tool to study the impact of mission-profile on the reliability of SiC-based PV-inverter devices
Stability analysis in multiwall carbon nanotube bundle interconnects
Effects of constant voltage and constant current stress in PCBM: P3HT solar cells
Effect of OFF-state stress on reliability of nMOSFET in SWD circuits of DRAM
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
Investigations on double-diffused MOS transistors under ESD zap conditions
Improving SiC lateral DMOSFET reliability under high field stress
Defect signatures in degraded high power laser diodes
Cooling performance and characteristics of metal piezoelectric fans in a heat sink-equipped handheld projector
Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints
N-MOSFET oxide trap characterization induced by nitridation process using RTS noise analysis
Two-dimensional transient simulations of the self-heating effects in GaN-based HEMTs
Gate oxide Reliability assessment optimization
Characterisation of series resistance degradation through charge pumping technique
Study of swing potential on deep submicron on-chip interconnect
Low frequency noise in thin gate oxide MOSFETs
MOS-IGBT power devices for high-temperature operation in smart power SOI technology
Negative bias temperature instability modeling for high-voltage oxides at different stress temperatures
Built-in self-test for bias temperature instability, hot-carrier injection, and gate oxide breakdown in embedded DRAMs
Trends in automotive power semiconductor packaging
Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide
Studies of the quality of GdSiO-Si interface
Thermal analysis of dual piezoelectric fans for cooling multi-LED packages
Degradation mechanism analysis in temperature stress tests on III-V ultra-high concentrator solar cells using a 3D distributed model
Ultra-thin dielectric breakdown in devices and circuits: A brief review
Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures
Effects of electromagnetic near-field stress on SiGe HBT's reliability
Improved on-chip self-triggered single-event transient measurement circuit design and applications
A collector current model for InAlAs/InGaAsSb/InGaAs double heterojunction bipolar transistors with non-ideal effects
Thermal overstress of Cu wire under pulsed current condition
A study on the electrical characteristics of InGaZnO thin-film transistor with HfLaO gate dielectric annealed in different gases
Dependence of the Au/SnO x /n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperature
An improved autoregressive model by particle swarm optimization for prognostics of lithium-ion batteries
An application of DMADV methodology for increasing the yield rate of surveillance cameras
Deposition of aerosol ("hygroscopic dust") on electronics - Mechanism and risk
Negative bias temperature instabilities in HfSiO(N)-based MOSFETs: Electrical characterization and modeling
Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip
Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method
Impact of irregular geometries on low-k dielectric breakdown
Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices
Stacked solder bumping technology for improved solder joint reliability
Charge trapping in SiO2/HfO2/TiN gate stack
Experimental and Numerical investigation about SEB/SEGR of Power MOSFET
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging
A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs
Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology
Operability diagram of drop formation and its response to temperature variation in a piezoelectric inkjet nozzle
Trend of CMOS downsizing and its reliability
A study of nanoparticles in Sn-Ag based lead free solders
Two-stage hot-carrier degradation behavior of 0.18 µm 18 V n-type DEMOS and its recovery effect
Effect of aging on mechanical properties of high temperature Pb-rich solder joints
Charge-trapping characteristics of BaTiO 3 with and without nitridation for nonvolatile memory applications
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
Science-based MEMS reliability methodology
Metallized polymer film capacitors ageing law based on capacitance degradation
Optical losses in single-mode laser diodes
Effects of annealing on the electric noise in semiconductor lasers
Reliability of Computer Systems and Networks: Fault Tolerance, Analysis and Design; Martin L. Shooman. John Wiley and Sons Inc., New York; 2002. Hardcover, pp 528, plus XXII
A deep learning-based recognition method for degradation monitoring of ball screw with multi-sensor data fusion
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits
Extraction of the lateral distribution of interface traps in MOSFETs by a novel combined gated-diode technique
Transport and noise properties of CdTe(Cl) crystals
Transient effects on high voltage diode stack under reverse bias
A brief review of selected aspects of the materials science of ball bonding
Optical and electrical characterization of hafnium oxide deposited by liquid injection atomic layer deposition
Modelling and IR measurement of the electronic substrate thermal conductivity
Implant dose monitoring by MOS C-V measurement
The device characteristics of missing LDD implantation via nanoprobing techniques for localized failure analysis
Reliability improvement in microstructures by reducing the impact velocity through electrostatic force modulation
Characterization of Low Drop-Out during ageing and design for yield
Electrical properties of thin RF sputtered Ta 2 O 5 films after constant current stress
Characterization of defects in flexible circuits with ultrasonic atomic force microscopy
Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodes
Low cost and highly reliable hardened latch design for nanoscale CMOS technology
Design of 2.4-GHz T/R switch with embedded ESD protection devices in CMOS process
Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown
Reliability analysis of hybrid spin transfer torque magnetic tunnel junction/CMOS majority voters
Comparative study of electrical instabilities in InGaZnO thin film transistors with gate dielectrics
Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis
Electrical characterization of the hafnium oxide prepared by direct sputtering of Hf in oxygen with rapid thermal annealing
Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test
Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM
Net integrity checking by optical localization techniques
Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials
Multi-physics reliability simulation for solid state lighting drivers
Thermo-mechanical characterization of passive stress sensors in Si interposer
Scaling the bulk-driven MOSFET into deca-nanometer bulk CMOS processes
A nonlinear degradation path dependent end-of-life estimation framework from noisy observations
Digital design and computer architecture; Hassan A. Farhat. CRC Press, Boca Raton: 2004. Hardcover, 487pp, plus XXII. ISBN 0-8493-1191-8
Effect of physical defect on shmoos in CMOS DSM technologies
Formation of Cu 6 Sn 5 phase by cold homogenization in nanocrystalline Cu-Sn bilayers at room temperature
Extended Sensor Reliability Evaluation Method in multi-sensor control systems
Advanced thermal failure analysis and reliability investigations - Industrial demands and related limitations
A cross-layer aging-aware task scheduling approach for multiprocessor embedded systems
Analytical model for multi-junction solar cells prediction in space environment
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling
60 Co gamma radiation total ionizing dose combined with conducted electromagnetic interference studies in BJTs
Reliability of non-hermetic pressure contact IGBT modules
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
Extraction of noise spectral densities(intrinsic and irradiation contributions) of a charge preamplifier based on JFET
Characterization of MIS structures and PTFTs using TiOx deposited by spin-coating
Electronic counterfeit detection based on the measurement of electromagnetic fingerprint
Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias
Threshold energies in the light emission characteristics of silicon MOS tunnel diodes
An on-chip sensor to measure and compensate static NBTI-induced degradation in analog circuits
Phosphors for LED-based light sources: Thermal properties and reliability issues
Reliability studies on GaN HEMTs with sputtered Iridium gate module
A study of large area die bonding materials and their corresponding mechanical and thermal properties
Photon emission as a characterization tool for bipolar parasitics in FinFET technology
Structure dependent charging process in RF MEMS capacitive switches
A new high-voltage tolerant I/O for improving ESD robustness
Investigation and comparison of analog figures-of-merit for TFET and FinFET considering work-function variation
Temperature-dependent resistive switching characteristics for Au/n-type CuAlO x /heavily doped p-type Si devices
An efficient temperature dependent hot carrier injection reliability simulation flow
The TDDB power-law model - Physics and experimental evidences
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications
Investigation on BIST assisted failure analysis on digital integrated circuits
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs
A case study of defects due to process marginalities in deep sub-micron technology
Sensitivity analysis of simplified Printed Circuit Board finite element models
Laser THz emission microscope as a novel tool for LSI failure analysis
Void-free and high-speed filling of through ceramic holes by copper electroplating
A carrier-mobility model for high-k gate-dielectric Ge MOSFETs with metal gate electrode
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer
Degradation of n-channel a-Si: H/nc-Si: H bilayer thin-film transistors under DC electrical stress
Post-breakdown characterization in thin gate oxides
Optical and electrical characterization of the electron beam gun evaporated TiO 2 film
Reliability estimation with uncertainties consideration for high power IGBTs in 2.3 MW wind turbine converter system
Failures in ultrathin oxides: Stored energy or carrier energy driven?
Predicting conducting yarn failure in woven electronic textiles
NBTI degradation: From physical mechanisms to modelling
Exploration of baking temperature effects on 28 nm BEOL reliability
Observations on the recovery of hot carrier degradation of hydrogen/deuterium passivated nMOSFETs
Impact of field-plate geometry on the reliability of GaN-on-SiC HEMTs
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
Cycle life estimation of lithium-ion polymer batteries using artificial neural network and support vector machine with time-resolved thermography
Two-dimensional dopant profiling in semiconductor devices by electron holography and chemical etching delineation techniques with the same specimen
Impact of dislocations on DLTS spectra and degradation of InGaN-based laser diodes
Conditional time resolved photoemission for debugging ICs with intermittent faults
Advanced power cycler with intelligent monitoring strategy of IGBT module under test
Constitutive modelling on the whole-life uniaxial ratcheting behavior of sintered nano-scale silver paste at room and high temperatures
Substrate current and degradation of n-channel polycrystalline silicon thin-film transistors
Electrical characterization of zirconium silicate films obtained from novel MOCVD precursors
Reliability and routability consideration for MCM placement
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration
S. Sutherland, S. Davidman and P. Flake, System Verilog for Design: A Guide to Using System Verilog for Hardware Design and Modeling Hardcover, Kluwer Academic Publishers, Norwell, MA (2004) ISBN 1-4020-7530-8 pp 374, plus XXVIII, euro 119
Evaluation of AlGaInP LEDs reliability based on accelerated tests
Correlating gate sinking and electrical performance of pseudomorphic high electron mobility transistors
Statistical analysis of the impact of refinishing process on leaded components
A comprehensive model for PMOS NBTI degradation: Recent progress
A TCAD comparative study of power rectifiers: modified P-i-N vs. modified mosaic contact P-i-N diode
Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Reliability of visible GaN LEDs in plastic package
Accelerated testing for failures of tantalum capacitors
Window for better reliability of nitride heterostructure field effect transistors
PMOS breakdown effects on digital circuits - Modeling and analysis
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations
Physical analysis of Schottky contact on power AlGaN/GaN HEMT after pulsed-RF life test
High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization
Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles
The combinational or selective usage of the laser SQUID microscope, the non-bias laser terahertz emission microscope, and fault simulations in non-electrical-contact fault localization
The influence of inhomogeneous trap distribution on results of DLTS study
On the profile of frequency dependent dielectric properties of (Ni/Au)/GaN/Al 0.3 Ga 0.7 N heterostructures
Characteristics of ESD protection devices operated under elevated temperatures
Investigation on NMOS-based power-rail ESD clamp circuits with gate-driven mechanism in a 0.13-µm CMOS technology
A finite state machine based fault tolerance technique for sequential circuits
A statistical study to identify the effects of packaging structures on lumen reliability of LEDs
Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles
Modelling of the shoot-through phenomenon introduced by the next generation IGBT in inverter applications
Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects
Failure mechanisms and qualification testing of passive components
Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii, Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA, 2002. Hard cover, pp 144 plus XI, ISBN 0-7923-7690-0
Time Resolved Photoemission (PICA) - From the Physics to Practical Considerations
Investigation of the heel crack mechanism in Al connections for power electronics modules
The time-voltage trade-off for ESD damage threshold in amorphous silicon hydrogenated thin-film transistors
Ionization coefficient of monolayer graphene nanoribbon
Reliability of spring pressure contacts under environmental stress
Voltage acceleration of time dependent breakdown of ultra-thin NO and NON dielectrics
BTI, HCI and TDDB aging impact in flip-flops
Doped Ta 2 O 5 and mixed HfO 2 -Ta 2 O 5 films for dynamic memories applications at the nanoscale
Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory
Experimental study of power MOSFET's gate damage in radiation environment
Reliability enhancement of electronic packages by design of optimal parameters
Peridynamic wetness approach for moisture concentration analysis in electronic packages
Reliability improvement by the suppression of keyhole generation in W-plug vias