yusuke1997/dblp-id-title huggingface dataset:
Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling
Direct observation of changes in the effective minority-carrier lifetime of SiN x -passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests
Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps
Observation of halo implant from the drain side reaching the source side and vice versa in extremely short p-channel transistors
Wide range control of the sustaining voltage of electrostatic discharge protection elements realized in a smart power technology
Effect of pulse risetime on trigger homogeneity in single finger grounded gate nMOSFET electrostatic discharge protection devices
Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling
Influence of polysilicon film thickness on radiation response of advanced excimer laser annealed polycrystalline silicon thin film transistors
Cross-sectional nanoprobing fault isolation technique on submicron devices
On-chip electrostatic discharge ESD
Volatility and vapourisation characterisation of new precursors
Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability
Mechanical and thermal reliability of printed organic thin-film transistor
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints
Degradation behavior of Ta 2 O 5 stacks and its dependence on the gate electrode
Solving 28 nm I/O circuit reliability issue due to IC design weakness
A procedure for assessing the reliability of short circuited concentration photovoltaic systems in outdoor degradation conditions
Design of CMOS logic gates with enhanced robustness against aging degradation
Design issues of a thin-film p-channel SOI power MOSFET for high-temperature applications
The effect of transition region on the direct tunneling current and Fowler-Nordheim tunneling current oscillations in ultrathin MOS structures
Study of the impact of electromigration on integrated circuit performance and reliability at design level
Solderless bonding with nanoporous copper as interlayer for high-temperature applications
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling
Characterization of the self-heating of AlGaN/GaN HEMTs during an electrical stress by using Raman spectroscopy
Analysis of dielectric breakdown in CoFeB/MgO/CoFeB magnetic tunnel junction
KITO tool: A fault injection environment in Linux kernel data structures
Investigation of surface pretreatments on GaAs and memory characteristics of MOS capacitors embedded with Au nano-particles
Threshold voltage shift prediction for gate bias stress on amorphous InGaZnO thin film transistors
Richard Zurawski, editor. Embedded Systems Handbook, Hardcover, pp 1112, CRC Press, Taylor & Francis Group, 2006, ISBN 0-8493-2824-1
Angular dependency on heavy-ion-induced single-event multiple transients (SEMT) in 65 nm twin-well and triple-well CMOS technology
Employing vertical dielectric layers to improve the operation performance of flash memory devices
Surface roughness effect on copper-alumina adhesion
EMA remaining useful life prediction with weighted bagging GPR algorithm
GaN transistors efficient cooling by graphene foam
Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs
Behaviour of anisotropic conductive joints under mechanical loading
Electron transport mechanism of tungsten trioxide powder thin film studied by investigating effect of annealing on resistivity
Study of bending reliability and electrical properties of platinum lines on flexible polyimide substrates
Extracting the relative dielectric constant for "high-kappa layers" from CV measurements - Errors and error propagation
Electrical properties of carbon nanotube via interconnects for 30 nm linewidth and beyond
TCAD investigation on hot-electron injection in new-generation technologies
Lumen maintenance predictions for LED packages
Generation-recombination noise in bipolar transistors
Border traps and bias-temperature instabilities in MOS devices
A 0.18 μm CMOS linear-in-dB AGC post-amplifier for optical communications
MEMS reliability from a failure mechanisms perspective
Assessment of ultra-thin Si wafer thickness in 3D wafer stacking
Reliability of high-power LED packaging and assembly
Clock aligner based on delay locked loop with double edge synchronization
Charging control on high energy implanters: A process requirement demonstrated by plasma damage monitoring
Distributed collaborative design of IP components in the TRMS environment
ElectroStatic Discharge Fault Localization by Laser Probing
The effect of annealing temperature on the electronic parameters and carrier transport mechanism of Pt/n-type Ge Schottky diode
Modeling of the diffusion phenomenon in a lithium-ion cell using frequency or time domain identification
TLP Characterization of large gate width devices
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
The degradation of multi-crystalline silicon solar cells after damp heat tests
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability
Vadim Ivanov, Igor Filanovsky, Operational Amplifier Speed and Accuracy Improvement: Analog Circuit Design with Structural Methodology, Kluwer Academic Publishers, Boston, 2004, Hardcover, pp 194, plus XIV, ISBN 1-4020-7772-6
Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al-matrix composite fabricated by SPS
Thermal transient measurement and modelling of a power cycled flip-chip LED module
Lifetime predictions of LED-based light bars by accelerated degradation test
Single-pulse avalanche mode operation of 10-kV/10-A SiC MOSFET
Resistive switching behavior of a CeO 2 based ReRAM cell incorporated with Si buffer layer
Advances in SiC power MOSFET technology
The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process
Electric field unbalance for robust floating ring termination
Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
Coupled measurement-simulation procedure for very high power fast recovery - Soft behavior diode design and testing
Deep trap-induced dynamic on-resistance degradation in GaN-on-Si power MISHEMTs
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach
A novel partial-SOI LDMOSFET (>800 V) with n-type floating buried layer in substrate
Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC
Embedded packaging and assembly; Reliability and supply chain implications
Improved reliability in small multichip ball grid arrays
Light degradation test and design of thermal performance for high-power light-emitting diodes
Passivation issues in active pixel CMOS image sensors
System-level design optimization of reliable and low power multiprocessor system-on-chip
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor
Out-of-band disturbance of mm-wave EMI on RF front-ends
High current effects in InP/GaAsSb/InP DHBT: Physical mechanisms and parasitic effects
Single Event Transient acquisition and mapping for space device Characterization
Reliability studies of barrier layers for Cu/PAE low-k interconnects
Experimental observations of temperature-dependent flat band voltage transients on high-k dielectrics
Including spatial correlations of channel length and threshold voltage variation in circuit simulations
An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system
A reliability study for a submarine compression application
Random telegraph noise in SiGe HBTs: Reliability analysis close to SOA limit
Solder joint fatigue life prediction using peridynamic approach
Controversial issues in negative bias temperature instability
ACF-COG interconnection conductivity inspection system using conductive area
Distributed electro-thermal model of IGBT chip - Application to top-metal ageing effects in short circuit conditions
Impression creep behavior of Zn-4Al-3Mg-xSn high-temperature lead-free solders
Non-destructive estimation method on cosmic ray ruggedness of power semiconductors using repetitive monitoring technique
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations
N 2 O treatment enhancement-mode InAlN/GaN HEMTs with HfZrO 2 High-k insulator
Effects of underfill materials on the reliability of low-K flip-chip packaging
High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
MESFET DC model parameter extraction using Quantum Particle Swarm Optimization
A reliable integrative autocorrelator device for particle fluctuation rate monitoring
Silicon Thinning and Polishing on Packaged Devices
Protective nanometer films for reliable Cu-Cu connections
Temperature-dependent reverse-bias stress of normally-off GaN power FETs
Effect of selectively passivated layer on foldable low temperature polycrystalline silicon thin film transistor characteristics under dynamic mechanical stress
Data-driven hybrid remaining useful life estimation approach for spacecraft lithium-ion battery
Extending the lifetime of power electronic assemblies by increased cooling temperatures
ESD sensitivity investigation on a wide range of high density embedded capacitors
Measuring process capability based on C PK with gauge measurement errors
Supercapacitors aging diagnosis using least square algorithm
Dielectric charging phenomena in diamond films used in RF MEMS capacitive switches: The effect of film thickness
SCR-based ESD protection in nanometer SOI technologies
Impact and damage on deep sub-micron CMOS technology induced by substrate current due to ESD stress
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests
Conductive filament evolution in HfO 2 resistive RAM device during constant voltage stress
Reliability issues of double gate dielectric stacks based on hafnium dioxide (HfO 2 ) layers for non-volatile semiconductor memory (NVSM) applications
State of charge estimation for electric vehicle batteries using unscented kalman filtering
On the influence of substrate cleaning method and rapid thermal annealing conditions on the electrical characteristics of Al/SiN x /SiO 2 /Si fabricated by ECR-CVD
Durability study of a fluorescent optical memory in glass studied by luminescence spectroscopy
Wafer-level Cu-Cu bonding technology
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions
Off-state degradation with ac bias in PMOSFET
Single event transient effects on charge redistribution SAR ADCs
The right way to assess electronic system reliability: FIDES
Unstructured tetrahedric meshes for the description of complex three-dimensional sample geometries in Monte Carlo simulation of scanning electron microscopy images for metrology applications
Negative bias temperature stress on low voltage p-channel DMOS transistors and the role of nitrogen
Impact of random dopant fluctuations on trap-assisted tunnelling in nanoscale MOSFETs
Upscreening of LED COTS for space science applications
Efficient parametric yield optimization of VLSI circuit by uniform design sampling method
Analytical analysis of nanoscale multiple gate MOSFETs including effects of hot-carrier induced interface charges
Ge based nanostructures for electronic and photonic devices
Joining and package technology for 175 °C Tj increasing reliability in automotive applications
ESD protection strategies in advanced CMOS SOI ICs
Strain investigation around shallow trench isolations : a LACBED Study
Comparison of TID response in core, input/output and high voltage transistors for flash memory
Fast, Efficient and Predictable Memory Access: Optimization Algorithms for Memory Architecture Aware Compilation, Lars Wehmeyer, Peter Marwedel. Springer, Dordercht, The Netherlands (2006). 257pp., Hardcover, plus XI, ISBN: 1-4020-4821-1
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure
Analysis of errors in estimating wearout characteristics of time-dependent dielectric breakdown using system-level accelerated life test
DC-bias-voltage dependence of degradation of aluminum electrolytic capacitors
Optimization of on-chip ESD protection structures for minimal parasitic capacitance
Electrical analysis on implantation-related defect by nanoprobing methodology
Yield enhancement techniques for 3-dimensional random access memories
Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers
Failure Analysis enhancement by evaluating the Photoelectric Laser Stimulation impact on mixed-mode ICs
XEBIC at the Dual Beam
Determining constant voltage lifetimes for silicon nitride capacitors in a GaAs IC process by a step stress method
Effects of electric field and bias voltage on corrosion behavior of tin under a thin electrolyte layer
Richard Zurawski, Editor, Integration Technologies for Industrial Automated Systems, CRC Taylor and Francis Group, Boca Raton (2007) ISBN 0-8493-9262-4 Plus XX 552 pp., Hardcover
An analytical threshold voltage model of NMOSFETs with hot-carrier induced interface charge effect
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging
Direct tunnelling models for circuit simulation
Taxonomies for the Development and Verification of Digital Systems, Brian Bailey, Grant Martin, Thomas Anderson (Editors). Springer, New York (2005). 179pp., Hardcover, ISBN: 0-387-24019-5
Electrical reliability aspects of HfO 2 high-k gate dielectrics with TaN metal gate electrodes under constant voltage stress
Simulator-independent compact modeling of vertical npn transistors for ESD and RF circuit simulation
Application of adhesive bonding techniques in hard disk drive head assembly
Dynamic electro-thermal modeling for power device assemblies
Electroluminescence spectroscopy for reliability investigations of 1.55 mum bulk semiconductor optical amplifier
Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators
Comparing the degradation effect of a 'two-cell' Supercapacitor-module with and without voltage equalization circuit(s) under experimental self-discharge and load cycling tests
Reliability improvement of high value doped polysilicon-based resistors
Improved and accurate physics-of-failure (PoF) methodology for qualification and lifetime assessment of electronic systems
Precise nanofabrication with multiple ion beams for advanced circuit edit
Local stress analysis on semiconductor devices by combined experimental-numerical procedure
Defects induced anomalous breakdown kinetics in Pr 2 O 3 by micro- and nano-characterization
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing
A Custom-designed automatic measurement system for acquisition and management of reliability data
Modeling the threshold voltage instability in SiC MOSFETs by multiphonon-assisted tunneling
RF device package method using Au to Au direct bonding technology
3D electro-thermal simulations of wide area power devices operating in avalanche condition
Power amplifier resilient design for process, voltage, and temperature variations
How future automotive functional safety requirements will impact microprocessors design
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
Fault tolerant encoders for Single Error Correction and Double Adjacent Error Correction codes
Localization and physical analysis of a complex SRAM failure in 90nm technology
Reservoir effect in SiCN capped copper/SiO 2 interconnects
Low temperature bonding technology for 3D integration
Effects of burn-in stressing on post-irradiation annealing response of power VDMOSFETs
Local thickness and composition analysis of TEM lamellae in the FIB
Uncertainty analysis of capacitor reliability prediction due to uneven thermal loading in photovoltaic applications
Durability evaluation of hexagonal WO 3 electrode for lithium ion secondary batteries
A new photoimageable platinum conductor
Effect of Pre-Existing Defects on Reliability Assessment of High-K Gate Dielectrics
Experimental study and numerical investigation on the formation of single event gate damages induced on medium voltage power MOSFET
Intermittent-contact capacitance spectroscopy - A new method for determining C(V) curves with sub-micron lateral resolution
Nanotribological properties of ALD-processed bilayer TiO 2 /ZnO films
Impact of work function of the silicon bottom-gates on electrical instability in InGaZnO thin film transistors
Degradation of RuO 2 thin films in hydrogen atmosphere at temperatures between 150 and 250 degreeC
MISFET structures with barium titanate as a dielectric layer for application in memory cells
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding
SRAM cell defect isolation methodology by sub micron probing technique
Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs
A novel approach for fabricating light-emitting porous polysilicon films
Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy
Chemical rate phenomenon approach applied to lithium battery capacity fade estimation
Testing semiconductor devices at extremely high operating temperatures
Study of the optimal layout of cooling fins in forced convection cooling
Under-gate defect formation in Ni-gate AlGaN/GaN high electron mobility transistors
Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown
Stress analysis of CMOS-MEMS microphone under shock loading by Taguchi method
Plasma FIB: Enlarge your field of view and your field of applications
Modulation method for measuring thermal impedance components of semiconductor devices
Fault detection in resistive ladder network with minimal measurements
Reliability study of Power RF LDMOS for Radar Application
Mechanical stress field assisted charge de-trapping in carbon doped oxides
Nvidia's GPU failures: A case for prognostics and health management
Ultrathin barrier GaN-on-Silicon devices for millimeter wave applications
Parallel color space converters for JPEG image compression
Self-repairing radix-2 signed-digit adder with multiple error detection, correction, and fault localization
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
On the avalanche ruggedness of optimized termination structure for 600 V punch-through IGBTs
The impact of PMOST bias-temperature degradation on logic circuit reliability performance
Trades-off between lithography line edge roughness and error-correcting codes requirements for NAND Flash memories
Water-enhanced negative bias temperature instability in p-type low temperature polycrystalline silicon thin film transistors
PMOS NBTI-induced circuit mismatch in advanced technologies
MIM capacitor-related early-stage field failures
Part average analysis - A tool for reducing failure rates in automotive electronics
Energy-Delay-FIT Product to compare processors and algorithm implementations
Long-term degradation of InGaN-based laser diodes: Role of defects
Barrier layer thickness analysis for reliable copper plug process in CMOS technology
Analyses of electromagnetic vibration-based generators fabricated with LTCC multilayer and silver spring-inducer
Erratum to "On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies" [MR 51/9-11 (2011) 1810-1818]
Charge accumulation in the dielectric of the nanocluster NVM MOS structures under anti- and unipolar W/E window formation
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
A physical model and analysis for whisker growth caused by chemical intermetallic reaction
Intrinsic reliability of a 12 V field plate pHEMT
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint
Mixture of negative bias temperature instability and hot-carrier driven threshold voltage degradation of 130 nm technology p-channel transistors
Photovoltaic plant maintainability optimization and degradation detection: Modelling and characterization
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution
An accurate closed-expression model for FinFETs parasitic resistance
Advanced electronic prognostics through system telemetry and pattern recognition methods
A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design
Design of SET tolerant LC oscillators using distributed bias circuitry
Stabilized emission from micro-field emitter for electron microscopy
Multiple quantum well PIN optoelectronic devices and a method of restoring failed device characteristics
Iterative algorithm for automatic alignment by object transformation
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse
Systematic evaluation of thermal interface materials - a case study in high power amplifier design
Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps
Epitaxial growth of LaAlO 3 on Si(0 0 1) using interface engineering
Reliability of microBGA assembly using no-flow underfill
Optimizing the fabrication process for high performance graphene field effect transistors
Study of electrical and optical properties of CN x thin films deposited by reactive magnetron sputtering
Investigation of the effects of constant voltage stress on thin SiO 2 layers using dynamic measurement protocols
Determining factors affecting ESD failure voltage using DOE
Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events
Quantitative oxide charge determination by photocurrent analysis
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles
Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods
Bond strain and defects at interfaces in high-k gate stacks
Simplification of sub-gap density of states extraction method for amorphous In-Ga-Zn-O thin-film transistors by a single capacitance-voltage curve
Carbon Nanotubes: Science and Applications, M. Meyyappan (Ed.). CRC Press LLC (2005), 289 pp., $103.13, Hardcover, ISBN: 0-8493-2111-5
High-temperature performance of state-of-the-art triple-gate transistors
Post-breakdown leakage resistance and its dependence on device area
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
Real-world printed circuit board ESD failures
Study of gate dielectric permittivity variation with different equivalent oxide thickness on channel engineered deep sub-micrometer n-MOSFET device for mixed signal applications
Pushing toward the limits of acceleration: Example on wire-bond assemblies