yusuke1997/dblp-id-title huggingface dataset:
A PCH strong tracking control strategy for power coordinated allocation of Li-SC HESS
Improving FPGA repair under real-time constraints
Reliability of optical connectors - Humidity behavior of the adhesive
Resistive bridge defect detection enhancement under parameter variations combining Low V DD and body bias in a delay based test
IGBT module failure analysis in railway applications
Reliability and performance scaling of very high speed SiGe HBTs
Logarithmic distributions in reliability analysis
Competition between the buckling-driven delamination and wrinkling in compressed thin coatings
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
Turn-off instabilities in large area IGBTs
A reliable course of Scanning Capacitance Microscopy analysis applied for 2D-Dopant Profilings of Power MOSFET Devices
Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applications
Intrinsic and extrinsic reliability of a serial connection of capacitors
Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects
Corrosion-induced degradation of GaAs PHEMTs under operation in high humidity conditions
An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuits
RPATS - Reliable power aware time synchronization protocol
Challenges of Ta 2 O 5 as high-k dielectric for nanoscale DRAMs
Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating
An assessment of the value of added screening of electronic components for commercial aerospace applications
Amorphous silicon technology for large area digital X-ray and optical imaging
Wafer-level bonding/stacking technology for 3D integration
Possible failure modes in Press-Pack IGBTs
Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications
Stability of low ohmic thick-film resistors under pulsed operation
Strength determination of high-power LED die using point-load and line-load tests
Intermittent contact scanning capacitance microscopy-An improved method for 2D doping profiling
Dc and low frequency noise analysis of hot-carrier induced degradation of low complexity 0.13 mum CMOS bipolar transistors
New optimized Dual-Material (DM) gate design to improve the submicron GaN-MESFETs reliability in subthreshold regime
Operating limits for RF power amplifiers at high junction temperatures
Resilient routing implementation in 2D mesh NoC
Fast and rigorous use of thermal time constant to characterize back end of the line test structure in advanced technology
Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Critical dimension control in photolithography based on the yield by a simulation program
Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging
High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC
Impact of dynamic voltage scaling and thermal factors on SRAM reliability
A new hermetic sealing method for ceramic package using nanosilver sintering technology
Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue
Non-homogenous gamma process: Application to SiC MOSFET threshold voltage instability
Mechanisms of power module source metal degradation during electro-thermal aging
Gadolinium-based metal oxide for nonvolatile memory applications
Reliability of high temperature solder alternatives
Deformation analysis in microstructures and micro-devices
Investigation on SCR-based ESD protection device for biomedical integrated circuits in a 0.18-μm CMOS process
Investigation of high performance Edge Lifted Capacitors reliability for GaAs and GaN MMIC technology
Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints
Development of a capacitive sensing technology for the measurement of perpendicularity in the narrow, deep slot-walls of micromolds
Statistical modeling of MOS devices for parametric yield prediction
Life prediction of LED-based recess downlight cooled by synthetic jet
Impact life prediction modeling of TFBGA packages under board level drop test
Failure of the negative voltage regulator in medium-photon-energy X radiation fields
A challenging case study resolved by using the Dynamic Laser Stimulation technique
Temperature dependent electrical and dielectric properties of Au/polyvinyl alcohol (Ni, Zn-doped)/n-Si Schottky diodes
A new multi-finger SCR-based structure for efficient on-chip ESD protection
BIST architecture for oscillation test of analog ICs and investigation of test hardware influence
William C. Dunn, Introduction to Instrumentation, Sensor, and Process Control , Artech House, Boston (2005) ISBN 1-58053-011-7 332 pp., Hardcover, plus XIII
Fatigue and thermal fatigue damage analysis of thin metal films
Automated Diagnosis and Probing Flow for Fast Fault Localization in IC
Silicon based system in package: Improvement of passive integration process to avoid TBMS failure
Measurement and analysis of SiC-MOSFET threshold voltage shift
Accelerated life test of high luminosity AlGaInP LEDs
Magnetic field and current density imaging using off-line lock-in analysis
Error propagation analysis using FPGA-based SEU-fault injection
Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution
Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics
Electrical characterisation and reliability of HfO 2 and Al 2 O 3 -HfO 2 MIM capacitors
Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications
Impact of aluminum wire and ribbon bonding technologies on D 2 PAK package reliability during thermal cycling applications
Chip package interaction for LED packages
Customized glass sealant for ceramic substrates for high temperature electronic application
High-performance FCBGA based on multi-layer thin-substrate packaging technology
Characterization and analysis of electrical trap related effects on the reliability of AlInN/GaN HEMTs
New expression for base transit time in a bipolar transistor for all levels of injection
U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
Failure analysis on recovering low resistive via in mixed-mode device
Effect of surface finish material on printed circuit board for electrochemical migration
Characterising gate dielectrics in high mobility devices using novel nanoscale techniques
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions
Failure Analysis-assisted FMEA
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
Reverse short channel effects in high-k gated nMOSFETs
Modeling read SNM considering both soft oxide breakdown and negative bias temperature instability
Reliability testing of integrated low-temperature PVD PZT films
The surface energies of β-Sn - A new concept for corrosion and whisker mitigation
Test methodology for durability estimation of surface mount interconnects under drop testing conditions
Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive
Temperature dependent time-to-breakdown (T BD ) of TiN/HfO 2 n-channel MOS devices in inversion
Assembly reliability assessment and life estimation for a stacked area array device
Characterization and Modelling of Moisture Driven Interface Failures
Numerical investigation of the effects of phosphorus on the mechanical responses of [1 1 0]-oriented silicon nano-wires
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
Evaluation of board-level reliability of electronic packages under consecutive drops
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA
The wire sag problem in wire bonding technology for semiconductor packaging
Drainage ratio impact on void creation in gold interconnect
A study on MIS Schottky diode based hydrogen sensor using La 2 O 3 as gate insulator
Power electronics packaging
Health-monitoring method of note PC for cooling performance degradation and load assessment
New triggering-speed-characterization method for diode-triggered SCR using TLP
Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, interface delamination and thermal conductivity
Effects of high electric field and elevated-temperature bias stressing on radiation response in power VDMOSFETs
A method to eliminate the event accumulation problem from a memory affected by multiple bit upsets
Latchup Analysis Using Emission Microscopy
Conduction mechanisms in MOS gate dielectric films
Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading
Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique
Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications
Exploratory analysis of the breakdown spots spatial distribution in metal gate/high-K/III-V stacks using functional summary statistics
New threshold voltage definition for undoped symmetrical DG MOSFET
Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method
Sidewall defects of AlGaN/GaN HEMTs evaluated by low frequency noise analysis
An affordable experimental technique for SRAM write margin characterization for nanometer CMOS technologies
All-digital thermal distribution measurement on field programmable gate array using ring oscillators
Threshold voltage instabilities in p-channel power VDMOSFETs under pulsed NBT stress
A simple estimation of transverse response of high-g accelerometers by a free-drop-bar method
On-wafer RF stress and trapping kinetics of Fe-doped AlGaN/GaN HEMTs
In-situ transistor reliability measurements through nanoprobing
R. Jacob Baker, CMOS Circuit Design, Layout, and Simulation (second ed.), Wiley Interscience & IEEE Press (2005) ISBN 0-471-70055-X Hardcover, pp 1039, plus XXXIII
Characterisation and passivation of interface defects in (1 0 0)-Si/SiO 2 /HfO 2 /TiN gate stacks
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications
An example of fault site localization on a 0.18 mum CMOS device with combination of front and backside techniques
Bipolar SCR ESD devices
Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment
Local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy
A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation
Low frequency noise in 0.12 mum partially and fully depleted SOI technology
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures
Solder joint reliability of a polymer reinforced wafer level package
Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494]
Operational frequency degradation induced trapping in scaled GaN HEMTs
Investigation of high voltage SCR-LDMOS ESD device for 150 V SOI BCD process
Charging mechanisms in Y 2 O 3 dielectric films for MEMS capacitive switches
Impact of defect on I(V) instabilities observed on Ti/4H-SiC high voltage Schottky diodes
Investigation on the CPU nanofluid cooling
Silver pick up during tail formation in thermosonic wire bonding process
Statistical analysis of tin whisker growth
Defect detection in multilayer ceramic capacitors
Angle-resolved photoelectron spectroscopy on gate insulators
Analysis of the reservoir effect on electromigration reliability
Fail / recover / fail (F/R/F) failure mechanisms new trend
Analysis of the role of the parasitic BJT of Super-Junction power MOSFET under TLP stress
Intrinsic stress fracture energy measurements for PECVD thin films in the SiO x C y N z : H system
Context aware slope based transistor-level aging model
High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune IC operation
3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package
Reliability aspects of a radiation detector fabricated by post-processing a standard CMOS chip
Leakage current, active power, and delay analysis of dynamic dual V t CMOS circuits under P-V-T fluctuations
Experimental characterization of temperature distribution on Power MOS devices during Unclamped Inductive Switching
Thermal investigation of LED lighting module
A fritless copper conductor system for power electronic applications
Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards
Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system
Reliability issues of silicon LSIs facing 100-nm technology node
Degradation of polycrystalline silicon TFTs due to alpha particles irradiation stress
Estimating effective dielectric thickness for capacitors with extrinsic defects by a statistical method
Transient IR imaging of light and flexible microelectronic devices
Local current fluctuations before and after breakdown of thin SiO 2 films observed with conductive atomic force microscope
Reliability challenges in 3D IC packaging technology
RF modeling approach to determining end-of-life reliability for InP-based HBTs
Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses
Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation
High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications
Evaluation method for the control of process induced defect in deep sub-micron device fabrication
System-level reliability enhancement of DC/DC stage in a single-phase PV inverter
Thermal characterization of high power LED with ceramic particles filled thermal paste for effective heat dissipation
A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator
Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology
Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology
Alfredo Benso, Paolo Prinetto, editors, Fault injection techniques and tools for embedded systems reliability and evaluation, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 241, plus XIV, ISBN 1-4020-7589-8
Analytical model for threshold voltage of double gate bilayer graphene field effect transistors
Crystallographic-orientation-dependent GIDL current in Tri-gate MOSFETs under hot carrier stress
Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations
Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder
1/f Noise in GaN HEMTs grown under Ga-rich, N-rich, and NH 3 -rich conditions
Global fault localization using induced voltage alteration
Fabrication and characterization of low-cost ultrathin flexible polyimide interposer
Gate length dependence of bias temperature instability behavior in short channel SOI MOSFETs
A model for residual life prediction based on Brownian motion with an adaptive drift
Impact of sidewall etching on the dynamic performance of GaN-on-Si E-mode transistors
Study on fatigue life and electrical property of COG assembly under thermal-electric-mechanical coupled loads
Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor
Seebeck Effect Detection on Biased Device without OBIRCH Distortion Using FET Readout
Accurate extraction of the mechanical properties of thin films by nanoindentation for the design of reliable MEMS
Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature
Statistical simulation of gate dielectric wearout, leakage, and breakdown
FDSOI and Bulk CMOS SRAM Cell Resilience to Radiation Effects
ESD design challenges in state-of-the-art analog technologies
Study of layout influence on ruggedness of NPT-IGBT devices by physical modelling
Role of carrier depletion effects and material properties in advanced microscale thermal modeling of N-GaInP-Si/p-GaAs-C heterojunction bipolar transistor (HBT) devices
On the injection methods in a top-series-injection-locked frequency divider
Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna
Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling
Tiny-scale "stealth" current sensor to probe power semiconductor device failure
Negative bias temperature instabilities in sequentially stressed and annealed p-channel power VDMOSFETs
Degradation of TiAlNiAu as ohmic contact metal for GaN HEMTs
Reliability of III-V concentrator solar cells
Tin whisker growth on bulk Sn-Pb eutectic doping with Nd
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress
Red polymer light-emitting devices based on dye-dispersed poly (9, 9-dioctylfluorene-alt-benzothiadiazole)
Jitter analysis of PLL-generated clock propagation using Jitter Mitigation techniques with laser voltage probing
Frequency domain scanning acoustic microscopy for power electronics: Physics-based feature identification and selectivity
An unusual mechanical failure mode in gold ballbonds at 50mum pitch due to degradation at the Au-Au 4 Al interface during ageing in air at 175degreeC
Study of hot-carrier effects on power RF LDMOS device reliability
Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects
Study and validation of a power-rail ESD clamp in BiCMOS process with a reduced temperature dependency of its leakage current
Lithium-ion battery state of health estimation with short-term current pulse test and support vector machine
Impact of gate insulator on the dc and dynamic performance of AlGaN/GaN MIS-HEMTs
Test generation at the algorithm-level for gate-level fault coverage
Hot-carrier reliability and breakdown characteristics of multi-finger RF MOS transistors
Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads
Low cost fault tolerance against k c -cycle and k m -unit transient for loop based control data flow graphs during physically aware high level synthesis
T.S. Rathore, Digital Measurement Techniques (2nd ed.), Alpha Science International Ltd., Pangbourne, England (2003) ISBN 0-8493-1709-6 309 pp., Hardcover, plus XIX
The effects of etching and deposition on the performance and stress evolution of open through silicon vias
Reliability assessment of ultra-short gate length AlGaN/GaN HEMTs on Si substrate by on-state step stress
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
ESD degradation and robustness of RGB LEDs and modules: An investigation based on combined electrical and optical measurements
Probing stress effects in HfO 2 gate stacks with time dependent measurements
A new built-in screening methodology to achieve zero defects in the automotive environment
Reliability aspects of gate oxide under ESD pulse stress
Mechanisms of metallization degradation in high power diodes
Vibration lifetime modelling of PCB assemblies using steinberg model
Robustness test and failure analysis of IGBT modules during turn-off
The effect of model building on the accuracy of fatigue life predictions in electronic packages
Simulation and modelling of long term reliability of digital circuits implemented in FPGA
Failure modes and mechanisms of InP-based and metamorphic high electron mobility transistors
Chip on flex attachment with thermoplastic ACF for RFID applications
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach
Stress analysis and bending tests for GaAs wafers
Packaging influences on the reliability of MEMS resonators
Design strategy of localized halo profile for achieving sub-50 nm bulk MOSFET
Improving the ability of Bulk Built-In Current Sensors to detect Single Event Effects by using triple-well CMOS
Dynamic NBTI characteristics of PMOSFETs with PE-SiN capping
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices
Microstructures and properties of Bi10Ag high temperature solder doped with Cu element
Design of a novel chip on glass package solution for CMOS image sensor device
Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions
Bulk built in current sensors for single event transient detection in deep-submicron technologies
Mechanical behavior of solder joints under dynamic four-point impact bending
Investigation of a constant behavior of aliasing errors in signature analysis due to the use of different ordered test-patterns in LFSR based testing techniques
A journey towards reliability improvement of TiO 2 based Resistive Random Access Memory: A review
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant
Maintenance of stable light emission in high power LEDs
Investigation of the dynamic on-state resistance of AlGaN/GaN HEMTs
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters
Silicon nanocrystal non-volatile memory for embedded memory scaling
Comparison of reliability impacts of two active power curtailment methods for PV micro-inverters
Impact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTs
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application
Revisiting MOSFET threshold voltage extraction methods
Ageing monitoring in IGBT module under sinusoidal loading
Simulation-based evaluation of probing attacks to arbiter PUFs using a time-resolved emission microscope
Direct gold and copper wires bonding on copper
Reliability of aluminum-bearing ohmic contacts to SiC under high current density
Investigation and impact of LDD variations on the drain disturb in normally-on SONOS NOR flash device
Modeling the impact of well contacts on SEE response with bias-dependent Single-Event compact model
Time-dependent-dielectric-breakdown characteristics of Hf-doped Ta 2 O 5 /SiO 2 stack