yusuke1997/dblp-id-title huggingface dataset:
Transient device simulation of neutron-induced failure in IGBT: A first step for developing a compact predictive model
The analysis of I-V characteristics of Schottky diodes by thermionic emission with a Gaussian distribution of barrier height
Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 178, plus XI, ISBN 1-4020-7235-X
Experimental and modeling study on viscosity of encapsulant for electronic packaging
A defect-oriented test approach using on-Chip current sensors for resistive defects in FinFET SRAMs
In memory of D. Stewart Peck
New assembling technique for BGA packages without thermal processes
Dielectric charging induced drift in micro device reliability-a review
Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs
Impact of strained-channel n-MOSFETs with a SiGe virtual substrate on dielectric interface quality evaluated by low frequency noise measurements
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices
Geometry optimization of a Lorentz force, resonating MEMS magnetometer
Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction
Novel accelerated testing method for III-V concentrator solar cells
Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS
Influences of the moisture absorption on PBGA package's warpage during IR reflow process
Low frequency noise and technology induced mechanical stress in MOSFETs
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis
How to quantify and predict long term multiple stress operation: Application to Normally-Off Power GaN transistor technologies
Reliability physics of compound semiconductor transistors for microwave applications
An investigation of surface state capture cross-sections for metal-oxide-semiconductor field-effect transistors using HfO 2 gate dielectrics
An ESD test reduction method for complex devices
Methodology for predicting off-state reliability in GaN power transistors
Failure limits and electro-optical characteristics of GaN-based LEDs under electrical overstress
The role of surface barrier oxidation on AlGaN/GaN HEMTs reliability
Effect of microwave preheating on the bonding performance of flip chip on flex joint
Progress in device isolation technology
Reliability issues for flip-chip packages
Non Contact Surface Potential Measurements for Charging Reduction During Manufacturing of Metal-Insulator-Metal Capacitors
Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic systems
Impact of gate poly doping and oxide thickness on the N- and PBTI in MOSFETs
Design optimization of an eddy current sensor using the finite-elements method
ESD sensitivity of AlGaAs and InGaAsP based Fabry-Perot laser diodes
Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints
An investigation of electrical and structural properties of Ni-germanosilicided Schottky diode
Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Conducted EMI evolution of power SiC MOSFET in a Buck converter after short-circuit aging tests
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method
Fault prognostic of electronics based on optimal multi-order particle filter
Method of junction temperature estimation and over temperature protection used for electric vehicle's IGBT power modules
High resolution physical analysis of ohmic contact formation at GaN-HEMT devices
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
ELDRS in SiGe transistors for room and low-temperature irradiation
An alternative approach to measure alpha-particle-induced SEU cross-section for flip-chip packaged SRAM devices: High energy alpha backside irradiation
Effects of Ag addition and Ag 3 Sn formation on the mechanical reliability of Ni/Sn solder joints
Reliability assessment of integrated power transistors: Lateral DMOS versus vertical DMOS
Thermoelectrical degradation processes in NTC thermistors for in-rush current protection of electronic circuits
Reliability oriented design of power supplies for high energy physics applications
Analysis of retention tail distribution induced by scaled shallow trench isolation for high densityDRAMs
Simulation and evaluation of the peak temperature in LED light bulb heatsink
A multi-attribute classification fusion system for insulated gate bipolar transistor diagnostics
Reliability of micro-interconnects in 3D IC packages
Development of the green plastic encapsulation for high density wirebonded leaded packages
Thermal stresses in a multilayered thin film thermoelectric structure
Improvement of thermal management of high-power GaN-based light-emitting diodes
MEMS reliability modelling methodology: application to wobble micromotor failure analysis
A perspective of the IPC report on lead-free electronics in military/aerospace applications
Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method
Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops
Oversampled delta-sigma modulators: analysis applications and novel topologies; Mücahit Kozak, Izzet Kale. Kluwer Academic Publishers, Boston. 2003. Hardcover, pp 226, plus XII, ISBN 1-4020-7420-4
Silicon integrated circuit technology from past to future
Random vibration reliability of BGA lead-free solder joint
Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies
Thermal cycling analysis of high temperature die-attach materials
An analytical circuit based nonlinear thermal model for capacitor banks
Experimental study on optical-thermal associated characteristics of LED car lamps under the action of ionic wind
ESD characterization of multi-finger RF nMOSFET transistors by TLP and transient interferometric mapping technique
Study of a failure mechanism during UIS switching of planar PT-IGBT with current sense cell
A complete RF power technology assessment for military applications
Dynamic responses of PCB under product-level free drop impact
Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling
Towards understanding recovery of hot-carrier induced degradation
Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress
Ensuring the reliability of power electronic devices with regard to terrestrial cosmic radiation
An accurate MOSFET aging model for 28 nm integrated circuit simulation
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology
Reliability analysis of power MOSFET's with the help of compact models and circuit simulation
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices
Quality testing methods of foil-based capacitors
Erratum to "The effect of image potential on electron transmission and electric current in the direct tunneling regime of ultra-thin MOS structures" [Microelectronics Reliability 2001;41: 927-931]
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
Increasing the cycle life of lithium ion cells by partial state of charge cycling
A comprehensive model of PMOS NBTI degradation
Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO 2 reduction
Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
Performance evaluation for a novel optoelectronic device for noninvasive monitoring thrombosis
Measurement and simulation of interfacial adhesion strength between SiO 2 thin film and III-V material
Investigation and modeling of stressed thermal oxides
Temperature dependent drain current model for Gate Stack Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for wide operating temperature range
Thermal stability investigations of AlGaN/GaN HEMTs with various high work function gate metal designs
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
A proposed DG-FinFET based SRAM cell design with RadHard capabilities
Investigation of temperature variations on analog/RF and linearity performance of stacked gate GEWE-SiNW MOSFET for improved device reliability
Automated detection of counterfeit ICs using machine learning
Evaluation of compatibility of thick-film PTC thermistors and LTCC structures
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
Improvement of charge/discharge performance for lithium ion batteries with tungsten trioxide electrodes
Anomaly detection for IGBTs using Mahalanobis distance
Charged device model metrology: limitations and problems
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors
Reliability investigation of light-emitting diodes via low frequency noise characteristics
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability
The temperature dependence of mixed mode degradation in bipolar transistors
Lifetime modeling of intrinsic gate oxide breakdown at high temperature
Temperature dependent model for threshold voltage and subthreshold slope of strained-Si channel MOSFETs with a polysilicon gate
Reliability/Uniformity improvement induced by an ultrathin TiO 2 insertion in Ti/HfO 2 /Pt resistive switching memories
An analytical two dimensional subthreshold behavior model to study the nanoscale GCGS DG Si MOSFET including interfacial trap effects
A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Study of gate leakage mechanism in advanced charge-coupled MOSFET (CC-MOSFET) technology
Reliability evaluation of logic circuits using probabilistic gate models
Design-in-reliability: From library modeling and optimization to gate-level verification
Investigations on junction temperature estimation based on junction voltage measurements
An artificial neural network approach for wafer dicing saw quality prediction
Impact of non-linear capacitances on transient waveforms during system level ESD stress
Inventory of silicon signatures induced by CDM event on deep sub-micronic CMOS-BICMOS technologies
Diffusion and absorption of corrosive gases in electronic encapsulants
Interfacial microstructures and glass strengthening in anodic-bonded Al sheet/glass and sputtered Al film/glass
Electrical probing of deep sub-micron integrated circuits using scanning probes
A robust asynchronous 16 × 16-bit subthreshold multiplier using SAPTL technique
A novel crowdsourcing platform for microelectronics counterfeit defect detection
Assessment of dielectric charging in electrostatically driven MEMS devices: A comparison of available characterization techniques
Guidebook for Managing Silicon Chip Reliability; Michael G. Pecht, Riko Radojcic, Gopal Rao. CRC Press LLC, Boca Raton, 1999, 224 pp. ISBN: 0-8493-9624-7
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy
Constant current stress-induced leakage current in mixed HfO 2 -Ta 2 O 5 stacks
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
Analysis of thermal stresses in metal interconnects with multilevel structures
High-power broad-area InGaNAs/GaAs quantum-well lasers in the 1200 nm range
Effects of hydrogenation on the performance and stability of p-channel polycrystalline silicon thin-film transistors
Ball-grid-array solder joint model for assembly-level impact reliability prediction
Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview
Study of the stability of e-mode GaN HEMTs with p-GaN gate based on combined DC and optical analysis
Improved single-pass approach for reliability analysis of digital combinational circuits
Dynamic Laser Stimulation Case Studies
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing
Quality assessment of thin oxides using constant and ramped stress measurements
Reliability prediction with MTOL
Preliminary reliability assessment and failure physical analysis on AlGaN/GaN HEMTs COTS
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
Reliability screening of high-k dielectrics based on voltage ramp stress
Effects of salt spray test on lead-free solder alloy
Thermal resistance modelling and design optimization of PCB vias
Formation of Ohmic contacts in AlGaN/GaN HEMT structures at 500 degreeC by Ohmic contact recess etching
Development of an RF IV waveform based stress test procedure for use on GaN HFETs
Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy
Backend dielectric breakdown dependence on linewidth and pattern density
Leakage current study and relevant defect localization in integrated circuit failure analysis
Displacement current sensor for contact and intermittent contact scanning capacitance microscopy
Warpage mechanism analyses of strip panel type PBGA chip packaging
AlGaN/GaN HEMT Reliability Assessment by means of Low Frequency Noise Measurements
Measuring time-dependent deformations in metallic MEMS
Fixed-point multiplication: A probabilistic bit-pattern view
Lock-in thermal IR imaging using a solid immersion lens
Characterisation of power modules ceramic substrates for reliability aspects
Correlation between predicted cause of SRAM failures and in-line defect data
Analysis of ESD discharge current distribution and area optimization of VDMOS gate protection structure
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products
High temperature CoSb 3 -Cu junctions
Thermal characteristics and fabrication of silicon sub-mount based LED package
Compact model of magnetic tunnel junction with stochastic spin transfer torque switching for reliability analyses
ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness
Drop-shock reliability improvement of embedded chip resistor packages through via structure modification
Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs
Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules
Degradation mechanisms of GaAs PHEMTs in high humidity conditions
Analysis of electrically conductive silver ink on stretchable substrates under tensile load
Failure analysis and solutions to overcome latchup failure event of a power controller IC in bulk CMOS technology
Auger electron spectroscopy characterization of Ti/NiV/Ag multilayer back-metal for monitoring of Ni migration on Ag surface
A process for high yield and high performance carbon nanotube field effect transistors
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
Analysis of interconnect capacitance for sub nano CMOS technology using the low dielectric material
Low frequency noise characterization in 0.13 mum p-MOSFETs. Impact of scaled-down 0.25, 0.18 and 0.13 mum technologies on 1/f noise
A note on trap recombination in high voltage device structures
Report on 4H-SiC JTE Schottky diodes
Framework for thermal-aware verification of digital and mixed signal systems
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Process dependence of BTI reliability in advanced HK MG stacks
The effect of electro-thermal parameters on IGBT junction temperature with the aging of module
Failure mode analysis of MEMS suspended inductors under mechanical shock
Localization and physical analysis of dielectric weaknesses for state-of-the-art deep trench based DRAM products
Impact of interface state trap density on the performance characteristics of different III-V MOSFET architectures
Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature
The effect of electroplating parameters and substrate material on tin whisker formation
Assessing the risk of "Kirkendall voiding" in Cu 3 Sn
The radiation sensitivity mapping of ICs using an IR pulsed laser system
Reliability Challenges with Ultra-Low k Interlevel Dielectrics
Interconnect reliability dependence on fast diffusivity paths
A new design technique of TFT-LCD display for avionics application
Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications
A methodological approach for predictive reliability: Practical case studies
Stress impact of moisture diffusion measured with the stress chip
BCB-to-oxide bonding technology for 3D integration
Neural net analysis of integrated circuit yield dependence on CMOS process control parameters
A review of HVI technology
Planar and three-dimensional thick-film thermoelectric microgenerators
Scanning probe microscopy based electrical characterization of thin dielectric and organic semiconductor films
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality
Enhancing reliability with thermal transient testing
A novel SIMS based approach to the characterization of the channel doping profile of a trench MOSFET
Economical design of H-bridge multilevel inverter drive controlled by modified fast algorithm
An adaptive Cu trace fatigue model based on average cross-section strain
Overview of wire bonding using copper wire or insulated wire
Design, manufacture and test for reliable 3D printed electronics packaging
Experimental characterization of the predictive thermal behaviour model of a surface-mounted soft magnetic composite inductor
Degradation mechanisms of AlGaN/GaN HEMTs under 800 MeV Bi ions irradiation
S.V. Nagaraj, Web Caching and its Applications, Kluwer Academic Publishers, Boston/Dordrecht/London, (The Kluwer International Series in Engineering and Computer Science, Vol 772), Hardcover (May 1, 2004), $105.00, pp 236, ISBN 1-4020-8049-2
Heat dissipation effect of Al plate embedded substrate in network system
On state breakdown in PHEMTs and its temperature dependence
Effect of glue on reliability of flip chip BGA packages under thermal cycling
Trends and challenges to ESD and Latch-up designs for nanometer CMOS technologies
Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer
A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction
Correlation between forward-reverse low-frequency noise and atypical I-V signatures in 980 nm high-power laser diodes
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive
Experimental study of the instabilities observed in 650 V enhancement mode GaN HEMT during short circuit
Relevance of contact reliability in HBM-ESD test equipment
Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration
Backside Failure Analysis of GaAs ICs after ESD tests
Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs
A simple and fundamental design rule for resisting delamination in bimaterial structures
High-resolution wide-band LC-VCO for reliable operation in phase-locked loops
A low-noise, process-variation-tolerant double-gate FinFET based sense amplifier
Comparison between positive and negative constant current stress on dye-sensitized solar cells
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs
Electronic circuit reliability modeling
Remaining useful life prediction for lithium-ion batteries based on an integrated health indicator
Design guideline of a thin film SOI power MOSFET for high thermal stability
Evaluating nanotribological behavior of annealing Si 0.8 Ge 0.2 /Si films
Low magnetic field Impact on NBTI degradation
Evaluation of a micropackaging analysis technique by highfrequency microwaves
Backside Defect Localizations and Revelations Techniques on Gallium Arsenide (GaAs) Devices
FIB/TEM analysis supported by μ-probing approach to identify via marginality
Variation tolerant on-chip degradation sensors for dynamic reliability management systems
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process
Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory
Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
Smart MEMS concept for high secure RF and millimeterwave communications
Reduction of the acquisition time for CMOS time-resolved photon emission by optimized IR detection
Navabi Zainalabedin, Verilog Digital System Design: Register Transfer Level Synthesis, Testbench, & Verification (second ed.), McGraw Hill, New York (2006) ISBN 0-07-144564-1 Hardcover, pp 384, plus XVI
Investigation of charge trapping/de-trapping induced operation lifetime degradation in triple SuperFlash ® memory cell
Hydrogen in MOSFETs - A primary agent of reliability issues
Degradation mechanisms of heterogeneous III-V/Silicon loop-mirror laser diodes for photonic integrated circuits
Parameter selection for health monitoring of electronic products
Current crowding in faulty MOSFET: optical and electrical investigation
Electromigration in WLCSP solder bumps
High-κ dielectric breakdown in nanoscale logic devices - Scientific insight and technology impact
Design methodologies for reliability of SSL LED boards
Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al 2 O 3 particles
Investigation on stress induced hump phenomenon in IGZO thin film transistors under negative bias stress and illumination
A/D converter based on a new memory cell implemented using the switched current technique
Impact of the space environmental conditions on the reliability of a MEMS COTS based system
Prognostics for state of health estimation of lithium-ion batteries based on combination Gaussian process functional regression
Complex automotive ICs defect localization driven by quiescent power supply current: Three cases study
AVERT: An elaborate model for simulating variable retention time in DRAMs
Microstructural evolution of ultrasonic-bonded aluminum wires
Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
Burn-in and thermal cyclic tests to determine the short-term reliability of a thin film resistance temperature detector
Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs
Testing the effects of reflow on tantalum capacitors
Numerical investigation of characteristics of wick structure and working fluid of U-shape heat pipe for CPU cooling
FIFA: A fault-injection-fault-analysis-based tool for reliability assessment at RTL level