yusuke1997/dblp-id-title huggingface dataset:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability
Repairing bonding wire connections using a microsoldering unit inside an SEM
Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding
Analysis and optimisation through innovative driving strategy of high power IGBT performances/EMI reduction trade-off for converter systems in railway applications
Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders and Cu substrate
Corrigendum to "An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors" [Microelectron. Reliability 53 (4) (2013) 540-543]
Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
A power-constrained design strategy for CMOS tuned low noise amplifiers
The promising multi-bit/level programming operations for nano-scaled SONOS memory
Thermal aging model of InP/InGaAs/InP DHBT
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis
3D failure analysis in depth profiles of sequentially made FIB cuts
LOCOS induced stress effects on SOI bipolar devices
Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
Test structure assembly for bump bond yield measurement on high density flip chip technologies
First-principles study of the effects of oxygen vacancy on hole tunneling current
On chip-package stress interaction
ATPG scan logic failure analysis: a case study of logic ICs - fault isolation, defect mechanism identification and yield improvement
Numerical investigation of liquid cooling cold plate for power control unit in fuel cell vehicle
Copper Wire Bonding
Thermo-mechanical effects in Majorana type quantum devices
Improvement in the moisture stability of CaS: Eu phosphor applied in light-emitting diodes by titania surface coating
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry
Prognostics of aluminum electrolytic capacitors using artificial neural network approach
Simulation study on the lifetime of electrochemical capacitors using the accelerated degradation test under temperature and voltage stresses
Lifetime of electret microphones by thermal degradation analysis via electroacoustic measurements
An FPGA-based dynamically reconfigurable platform for emulation of permanent faults in ASICs
Electrical characteristics measurement of transistors by 4 tips-0.2 micron probing technique in Semiconductor Failure Analysis
PBGA packaging reliability assessments under random vibrations for space applications
Modeling of the I-V characteristics of high-field stressed MOS structures using a Fowler-Nordheim-type tunneling expression
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions
Variability and reliability analysis of CNFET technology: Impact of manufacturing imperfections
RTN distribution comparison for bulk, FDSOI and FinFETs devices
Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs
Very wide current-regime operation of an InP/InGaAs tunneling emitter bipolar transistor (TEBT)
Tunnel oxide degradation under pulsed stress
In-process verification of MLC substrates
Low frequency noise and reliability properties pf 0.12 mum CMOS devices with Ta 2 O 5 as gate dielectrics
Effect of polyimide baking on bump resistance in flip-chip solder joints
Mechanisms of positive gate bias stress induced instabilities in power VDMOSFETs
Exploring the thermal limit of GaN power devices under extreme overload conditions
Study of body and oxide thickness variation on analog and RF performance of underlap DG-MOSFETs
Thermal stability performance of anisotropic conductive film at different bonding temperatures
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing
Effect of additions of ZrO 2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads
The need for multi-scale approaches in Cu/low-k reliability issues
An SEM/STM based nanoprobing and TEM study of breakdown locations in HfO 2 /SiO x dielectric stacks for failure analysis
Stress induced gate-drain leakage current in ultra-thin gate oxide
Improving the reliability of the Benes network for use in large-scale systems
Integrated vehicle health management: An approach to dealing with lifetime prediction considerations on relays
On-chip reliability monitors for measuring circuit degradation
High-throughput and full automatic DBC-module screening tester for high power IGBT
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer
Reliability studies of vertical GaN devices based on bulk GaN substrates
Relevant metrics for evaluation of concurrent error detection schemes
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Immunity against temperature variability and bias point invariability in double gate tunnel field effect transistor
TCAD simulation of current filamentation in adjacent IGBT cells under turn-on and turn-off short circuit condition
The impact of BTI aging on the reliability of level shifters in nano-scale CMOS technology
How supercapacitors reach end of life criteria during calendar life and power cycling tests
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging
Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging
Stability of miniaturized non-trimmed thick- and thin-film resistors
Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection
Understanding chromaticity shifts in LED devices through analytical models
Numerical analysis and comparative study of short circuit stress in IGBTs devices (IR, IXYS)
Lifetime acceleration model for HAST tests of a pHEMT process
A practical metric for soft error vulnerability analysis of combinational circuits
Electrical analysis of DRAM cell transistors for the root-cause addressing of the tRDL time-delay failure
Comparative analysis of RF LDMOS capacitance reliability under accelerated ageing tests
An efficient EDAC approach for handling multiple bit upsets in memory array
Comparison of thermal runaway limits under different test conditions based on a 4.5 kV IGBT
Analysis of the layout impact on electric fields in interconnect structures using finite element method
Design and analysis of noise margin, write ability and read stability of organic and hybrid 6-T SRAM cell
Characteristics of size dependent conductivity of the CNT-interconnects formed by low temperature process
Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
Hysteresis effect in bottom-gate polymorphous silicon thin-film transistors
Application of an MOS tunnel transistor for measurements of the tunneling parameters and of the parameters of electron energy relaxation in silicon
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides
Low and high temperature device reliability investigations of buried p-channel MOSFETs of a 0.17 mum technology
Multi-level storage in a nano-floating gate MOS capacitor using a stepped control oxide
Examination and evaluation of La 2 O 3 as gate dielectric for sub-100nm CMOS and DRAM technology
SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging
Planar copper-tin inter-metallic film formation on strained substrates
Localization of sensitive areas of power AC switch under thermal laser stimulation
Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint
Solar Cell Analysis with Light Emission and OBIC Techniques
Fault isolation at P/N junction by nanoprober
High-temperature performance of AlGaN/GaN HFETs and MOSHFETs
Reliability-oriented environmental thermal stress analysis of fuses in power electronics
Reliability and performance of a true enhancement mode HIGFET for wireless applications
Self-triggered stacked silicon-controlled rectifier structure (STSSCR) for on-chip electrostatic discharge (ESD) protection
A high-linear wide-tunable CMOS transconductor for video frequency applications
Comparing drop impact test method using strain gauge measurements
Analysis of ageing effects on ARTIX7 XILINX FPGA
Degradation analysis and current collapse imaging of AlGaN/GaN HEMTs by measurement of electric field-induced optical second-harmonic generation
Impact of elevated temperature applied during low dose rate irradiation on the degradation of BiCMOS operational amplifiers
Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions
Evaluation methodology of thin dielectrics for non-volatile memory application
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
Negative bias temperature instability in n-channel power VDMOSFETs
Detection of localized UIS failure on IGBTs with the aid of lock-in thermography
Diffusion growth of Cu 3 Sn phase in the bump and thin film Cu/Sn structures
Effects of inhomogeneous negative bias temperature stress on p-channel MOSFETs of analog and RF circuits
Stephen Brown Zvonko Vranesic, Fundamental of Digital Logic with Verilog Design, McGraw Hill, Boston, 2004, Hardcover, pp 844, plus XX, ISBN 0-07-121359-7
Realistic climatic profiles and their effect on condensation in encapsulated test structures representing power modules
The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline silicon
MTF test system with AC based dynamic joule correction for electromigration tests on interconnects
Crystal size and direction dependence of the elastic properties of Cu 3 Sn through molecular dynamics simulation and nanoindentation testing
Determination of passive SiO 2 -Au microstructure resonant frequencies
Surface and interface characterization of oxygen plasma activated anodic bonding of glass-ceramics to stainless steel
Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications
A dynamic partial reconfigurable system with combined task allocation method to improve the reliability of FPGA
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration
3D simulation of single-event-transient effects in symmetrical dual-material double-gate MOSFETs
Trend of the development of metal-based heat dissipative materials
Large-area die-attachment by silver stress migration bonding for power device applications
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging
Design and implementation of reliable flash ADC for microwave applications
An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method
Normalized differential conductance to study current conduction mechanisms in MOS structures
Controlling of conduction mechanism and electronic parameters of silicon-metal junction by mixed Methylene Blue/2′-7′-dichlorofluorescein
Comparison of FET electro-optical modulation for 1300 nm and 1064 nm laser sources
On-line solder layer degradation measurement for SiC-MOSFET modules under accelerated power cycling condition
Accuracy of simplified printed circuit board finite element models
300-V class power n-channel LDMOS transistor implemented in 0.18-μm silicon-on-insulator (SOI) technology
A way to implement the electro-optical technique to inertial MEMS
Optimum control of microprocessor throughput under thermal and energy saving constraints
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs
Modeling of terminal ring structures for high-voltage power MOSFETs
Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay
Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties
TIM, EMMI and 3D TCAD analysis of discrete-technology SCRs
RF ESD protection strategies: Codesign vs. low-C protection
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC
Investigation of degradation mechanisms in low-voltage p-channel power MOSFETs under High Temperature Gate Bias stress
Electrothermal compact macromodel of monolithic switching voltage regulator MC34063A
Comparison of interfaces states density through their energy distribution and LVSILC induced by uniform and localized injections in 2.3nm thick oxides
Investigations of the influence of dicing techniques on the strength properties of thin silicon
Improved upper contacts PMMA on P3HT PTFTS using photolithographic processes
Intermediate wafer level bonding and interface behavior
A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages
Modeling charge variation during data retention of MLC Flash memories
Electrical characteristics of MOSFETs with La 2 O 3 /Y 2 O 3 gate stack
Investigation of optical and chemical bond properties of hydrogenated amorphous silicon nitride for optoelectronics applications
Refined metastability characterization using a time-to-digital converter
Dynamic Near-Field Scanning Thermal Microscopy on thin films
Dynamic Fowler-Nordheim injection in EEPROM tunnel oxides at realistic time scales
More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects
Read static noise margin aging model considering SBD and BTI effects for FinFET SRAMs
Impact of ESD protection device trigger transient on the reliability of ultra-thin gate oxide
Use of a silicon drift detector for cathodoluminescence detection
Characterization of ESD induced defects using Photovoltaic Laser Stimulation (PLS)
Modelling of current sharing in paralleled current limiting superjunction MOSFETs with common gate drives
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints
Experimental study of microrectangular groove structure covered with multi mesh layers on performance of flat plate heat pipe for LED lighting module
New substrate-triggered ESD protection structures in a 0.18-µm CMOS process without extra mask
Electronic device encapsulation using red phosphorus flame retardants
Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics
Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Reduction of test effort. Looking for more acceleration for reliable components for automotive applications
Bond reliability under humid environment for coated copper wire and bare copper wire
Image alignment for 3D reconstruction in a SEM
Novel ESD protection solution for single-ended mixer in GaAs pHEMT technology
Characterization of charge trapping in SiO 2 /Al 2 O 3 dielectric stacks by pulsed C-V technique
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages
Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
Oxide reliability: influence of interface roughness, structure layout, and depletion layer formation
Design and optimization of thermo-mechanical reliability in wafer level packaging
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions
Investigations and detections on a new BEOL dielectric failure mechanism at advanced technologies
Avalanche breakdown capability of Power DMOS Transistors and the Wunsch-Bell relation
John P. Hayes, Computer Architecture and Organization, Third ed., McGraw-Hill Book Company, Inc., Boston, 1988, Softcover, pp 604, plus XIV, ISBN 0-07-115997-5
Feasible approach for processes integration of CMOS transistor gate/side-wall spacer patterning fabrication
Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Stress in three-dimensionally integrated sensor systems
Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique
3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET
Design and simulation of MOSCNT with band engineered source and drain regions
Finite element model verification for packaged printed circuit board by experimental modal analysis
Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism
Unsupervised learning for signal mapping in dynamic photon emission
The FMEDA approach to improve the safety assessment according to the IEC61508
Fabrication and enhanced field emission properties of novel silicon nanostructures
Effects of electron and gamma-ray irradiation on CMOS analog image sensors
A model for length of saturation velocity region in double-gate Graphene nanoribbon transistors
Reliability impact due to high current, lattice and hot carriers temperatures on β (2×2) matrix ESD power devices for advanced CMOS technologies
Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire
Modeling of organic thin film field-effect transistors based on pentacene in saturation regime: Effect of light illumination
ShadowStack: A new approach for secure program execution
Effect of DC/AC stress on the reliability of cell capacitor in DRAM
ESD testing of devices, ICs and systems
MEMS reliability
MAGFET based current sensing for power integrated circuit
SCR operation mode of diode strings for ESD protection
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
Reliable data transfer Rendezvous protocol in wireless sensor networks using 2D-SEC-DED encoding technique
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction
Alan Clements. Principles of Computer Hardware, fourth edition, Oxford University Press; (2006), Paperbound, pp 656, plus XV, ISBN: 0-19-927313-8
Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies
Effect of gate trench fabrication technology on reliability of AlGaN/GaN heterojunction field effect transistors
Reliability design of battery management system for power battery
Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range
Real time degradation monitoring system for high power IGBT module under power cycling test
Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment
RoHS compliance in safety and reliability critical electronics
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs
Thermal stress concentration factors for defects in plated-through-vias
Support excitation scheme for transient analysis of JEDEC board-level drop test
Robustness measurement of integrated circuits and its adaptation to aging effects
Detection of cracks in multilayer ceramic capacitors by X-ray imaging
Analysis and test procedures for NOR flash memory defects
Study of proton irradiation effects on AlGaN/GaN high electron mobility transistors
Resistive switching properties of alkaline earth oxide-based memory devices
Effect of wafer thinning methods towards fracture strength and topography of silicon die
Rigorous modeling of high-speed semiconductor devices
Using statistical design of experiment to investigate the effect of firing parameters on the electrical and magnetic properties of Mn-Zn ferrite
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits
On the effects of temperature on the drop reliability of electronic component boards
Accelerated life time testing and optical degradation of remote phosphor plates
On the origin of dynamic R on in commercial GaN-on-Si HEMTs
Significance of the failure criterion on transmission line pulse testing
Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures
Anomaly detection for satellite power subsystem with associated rules based on Kernel Principal Component Analysis
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
Impact of negative bias temperature instability on digital circuit reliability
Damped transient power clamps for improved ESD protection of CMOS
A junction characterization for microelectronic devices quality and reliability
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads
Evidence of relationship between mechanical stress and leakage current in AlGaN/GaN transistor after storage test
Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation
Genetic algorithms for defect detection of flip chips
Numerical analysis of the warpage problem in TSOP
Reduction of annealed-induced wafer defects in dual-damascene copper interconnects
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
Effects of 1064 nm laser on MOS capacitor
Statistical analysis during the reliability simulation
Power cycling results for different control strategies
Impact of nitrogen incorporation on interface states in (100)Si/HfO 2
An ultra-low dark-count and jitter, superconducting, single-photon detector for emission timing analysis of integrated circuits
Growth process and chemical characterization of an ultrathin phosphate film grafted onto Al-alloy metallization surfaces relevant to microelectronic devices reliability
Characterising the surface roughness of AFM grown SiO 2 on Si
Multilevel logic and thermal co-simulation
Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies