yusuke1997/dblp-id-title huggingface dataset:
High field stress at and above room temperature in 2.3 nm thick oxides
Integration-based approach to evaluate the sub-threshold slope of MOSFETs
Calendar and cycling ageing of activated carbon supercapacitor for automotive application
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film
Fabrication and stress analysis of annular-trench-isolated TSV
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies
Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
Particle Monte Carlo modeling of single-event transient current and charge collection in integrated circuits
Molybdenum and low-temperature annealing of a silicon power P-i-N diode
Parameters extraction of hafnium based gate oxide capacitors
Modeling and characterization of molding compound properties during cure
Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model
A physical model on electron mobility in InGaAs nMOSFETs with stacked gate dielectric
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system
Effect of annealing on the properties of low-k nanoporous SiO 2 films prepared by sol-gel method with catalyst HF
Considerations in printing conductive traces for high pulsed power applications
Evaluation of thick-film resistor structural parameters based on noise index measurements
Contribution of oxide traps on defect creation and LVSILC conduction in ultra thin gate oxide devices
Internal processes in power semiconductors at virtual junction temperature measurement
PMOS-based power-rail ESD clamp circuit with adjustable holding voltage controlled by ESD detection circuit
Study on thermomechanical reliability of a tunable light modulator
Failure analysis from the back side of a die
Development of a lifetime prediction model for lithium thionyl chloride batteries based on an accelerated degradation test
Flexible stop and double-cascaded stop to improve shock reliability of MEMS accelerometer
Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates
Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors
The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET
Microelectronic materials and structures characterization by impedance spectroscopy
Study of the impact of hot carrier injection to immunity of MOSFET to electromagnetic interferences
Failure analysis and improvement of 60 V power UMOSFET
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration
Reliable power electronics for automotive applications
Moisture absorption and desorption in wafer level chip scale packages
Single pulse energy capability and failure modes of n- and p-channel LDMOS with thick copper metallization
Life Cycle Reliability Engineering, Guangbin Yang. John Wiley & Sons, Inc. (2007), p. 517. ISBN: 978-0-471-71529-0
Dynamic avalanche in bipolar power devices
Calendar and cycling ageing combination of batteries in electric vehicles
Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp 462, plus XII, ISBN 0-7803-1000-4
Towards reliability enhancement of graphene FET biosensor in complex analyte: Artificial neural network approach
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
Analysis of semiconductor fault using DS (damped sinusoidal) HPEM injection
Electric passivation of interface traps at drain junction space charge region in p-MOS transistors
Novel concepts for reliability technology
Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application
High temperature gate-bias and reverse-bias tests on SiC MOSFETs
Effect of IC layout on the reliability of CMOS amplifiers
On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi 1% chip metallization of a power semiconductor device
Mechanism of breakdown voltage wavering in power MOSFET induced by silicon crystalline defect
Thermal modeling of localized laser heating in multi-level interconnects
Simulation of the thermal stress induced by CW 1340 nm laser on 28 nm advanced technologies
Three-dimensional structuration of zero-shrinkage LTCC ceramics for microfluidic applications
Inserting a low-temperature n-GaN underlying layer to separate nonradiative recombination centers improves the luminescence efficiency of blue InGaN/GaN LEDs
Sintered silver finite element modelling and reliability based design optimisation in power electronic module
Investigation of defect on copper bond pad surface in copper/low k process integration
Study of the operation and SET robustness of a CMOS pulse stretching circuit
Improved Stability of Large Area Excimer Laser Crstallised Polysilicon Thin Film Transistors under DC and AC Operating
Triple junction InGaP/InGaAs/Ge solar cells for high concentration photovoltaics application: Degradation tests of solar receivers
Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices
The performance and fracture mechanism of solder joints under mechanical reliability test
Impact of Al-, Ni-, TiN-, and Mo-metal gates on MOCVD-grown HfO 2 and ZrO 2 high-kappa dielectrics
Building-up of system level ESD modeling: Impact of a decoupling capacitance on ESD propagation
Influence of gate oxides with high thermal conductivity on the failure distribution of InGaAs-based MOS stacks
The influence of liners with Ti, Ta or Ru finish on thin Cu films
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes
Spin-transfer torque RAM technology: Review and prospect
Scanning Microwave Microscopy for Electronic Device Analysis on Nanometre Scale
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications
Experimental study and life prediction on high cycle vibration fatigue in BGA packages
The impact of moisture in mold compound preforms on the warpage of PBGA packages
Worn-out oxide MOSFET characteristics: Role of gate current and device parameters on a current mirror
Solder joint reliability under realistic service conditions
Effect of NBTI/PBTI aging and process variations on write failures in MOSFET and FinFET flip-flops
The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers
Microstructural considerations for ultrafine lead free solder joints
Static fault localization of subtle metallization defects using near infrared photon emission microscopy
Investigation of MBE grown inverted GaAs quantum dots
A high fault coverage test approach for communication channels in network on chip
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling
Characteristics degradation of the SiGe HBT under electromagnetic field stress
Thermal imaging of smart power DMOS transistors in the thermally unstable regime using a compact transient interferometric mapping system
Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure
Impact of inside spacer process on fully self-aligned 250 GHz SiGe: C HBTs reliability performances: a-Si vs. nitride
Quantitative selection of sensor data based on improved permutation entropy for system remaining useful life prediction
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates
Analyzing the impact of radiation-induced failures in flash-based APSoC with and without fault tolerance techniques at CERN environment
Study of a dipping method for flip-chip flux coating
Crosstalk bandwidth and stability analysis in graphene nanoribbon interconnects
Opcode vector: An efficient scheme to detect soft errors in instructions
Bias dependence of TID radiation responses of 0.13 μm partially depleted SOI NMOSFETs
Eyring acceleration model in thick nitride/oxide dielectrics
Physically based models of electromigration: From Black's equation to modern TCAD models
Reliable N sleep shuffled phase damping design for ground bouncing noise mitigation
Emerging memory technologies: Trends, challenges, and modeling methods
Electrical characterization of metal-oxide-high-k dielectric-oxide-semiconductor (MOHOS) structures for memory applications
An efficient tool for reliability improvement based on TMR
An SEU resilient, SET filterable and cost effective latch in presence of PVT variations
Synthesis and characterization of sub-micron sized copper-ruthenium-tantalum composites for interconnection application
Improvement of MOSFET matching characterization with calibrated multiplexed test structure
Modeling of dielectric charging in electrostatic MEMS switches
Defects evolution involving interface dispersion approaches in high-k/metal-gate deep-submicron CMOS
Electrically induced physical damage (EIPD) cases study: From electrical overstress (EOS) to product defects
Impact and mitigation of SRAM read path aging
Charging-discharging characteristics of a wound aluminum polymer capacitor
3D Flash Memories
Heat stress exposing performance of deep-nano HK/MG nMOSFETs using DPN or PDA treatment
Potential remedies for the V T /V fb -shift problem of Hf/polysilicon-based gate stacks: a solution-based survey
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits
An in depth analysis of pull-up capacitance-voltage characteristic for dielectric charging assessment of MEMS capacitive switches
Test structures for dielectric spectroscopy of thin films at microwave frequencies
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies
Fault detection using thermal image based on soft computing methods: Comparative study
Failure mechanisms in advanced BCD technology during reliability qualification
Nickel-palladium bond pads for copper wire bonding
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
An ensemble model for predicting the remaining useful performance of lithium-ion batteries
Physics-of-Failure (PoF) methodology for qualification and lifetime assessment of supercapacitors for industrial applications
NBTI related degradation and lifetime estimation in p-channel power VDMOSFETs under the static and pulsed NBT stress conditions
Enabling technologies for sustainable battery: Advances in battery reliability
"Design for EMI" approach on power PiN diode reverse recovery
Acoustic detection of micro-cracks in small electronic devices
Current similarity based open-circuit fault diagnosis for induction motor drives with discrete wavelet transform
FIB-induced electro-optical alterations in a DFB InP laser diode
Sn whisker evaluations in 3D microbumped structures
Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model
Control of droplet formation for low viscosity fluid by double waveforms applied to a piezoelectric inkjet nozzle
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages
A novel photodiode based on Ruthenium(II) complex containing polydentate pyridine as photocatalyst
Arithmetic and Logic in Computer Systems, Mi Lu. John Wiley & Sons, Inc., Hoboken, NJ (2004), ISBN: 0-471-46945-9
Investigation of flicker noise in silicon diodes under reverse bias
Vacuum quality evaluation for uncooled micro bolometer thermal imager sensors
On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives
Electrical properties in low temperature range (5K-300K) of Tantalum Oxide dielectric MIM capacitors
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process
Prediction of proton cross sections for SEU in SRAMs and SDRAMs using the METIS engineer tool
Al surface morphology effect on flip-chip solder bump shear strength
Analysis of ESD failure mechanism in 65nm bulk CMOS ESD NMOSFETs with ESD implant
Stability of solid electrolyte based thick-film CO 2 sensors
Field plate related reliability improvements in GaN-on-Si HEMTs
Mechanisms of spontaneous recovery in positive gate bias stressed power VDMOSFETs
Comparison of deposition models for a TEOS LPCVD process
Transistor open-circuit fault diagnosis in two-level three-phase inverter based on similarity measurement
Lifetime tests of 600-V GaN-on-Si power switches and HEMTs
Lifetime estimation of IGBT modules for MMC-HVDC application
Simulation study of Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for high temperature applications
Ageing monitoring of lithium-ion cell during power cycling tests
Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application
Choice of granularity for reliable circuit design using dynamic reconfiguration
Investigation of deep traps in silicon-germanium epitaxial base bipolar transistors with a single polysilicon quasi self-aligned architecture
Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses
Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line
Physics-of-failure assessment methodology for power electronic systems
The Hi-NOON neural simulator and its applications
Empirical prediction model for Li/SOCl 2 cells based on the accelerated degradation test
High-field step-stress and long term stability of PHEMTs with different gate and recess lengths
The interpretation of the DC characteristics of LED and laser diodes to address their failure analysis
Use of preliminary ultraviolet and infrared illumination for diagnostics of MOS and bipolar devices radiation response
Reliability of the doping concentration in an ultra-thin body and buried oxide silicon on insulator (SOI) and comparison with a partially depleted SOI
Conductive adhesives for through holes and blind vias metallization
Improving retention properties by thermal imidization for polyimide-based nonvolatile resistive random access memories
Impact of the forming conditions and electrode metals on read disturb in HfO 2 -based RRAM
Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors
SEU reduction effectiveness of common centroid layout in differential latch at 130-nm CMOS technology
Impacts of plasma process-induced damage on MOSFET parameter variability and reliability
Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible process
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach
Strain estimation in III-V materials by analysis of the degree of polarization of luminescence
Study of the self-alignment of no-flow underfill for micro-BGA assembly
Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
Effects of stress-loading test methods on the degradation of light-emitting diode modules
Device decapsulated (and/or depassivated) - Retest ok - What happened?
Reliability analysis of a mini-instrument for simultaneous monitoring water content, deep tissue temperature, and hemodynamic parameters
Low latency radiation tolerant self-repair reconfigurable SRAM architecture
Susceptibility of flash ADCs to electromagnetic interference
Comparative analysis of parameter extraction techniques for AlGaN/GaN HEMT on silicon/sapphire substrate
Characterization and model of temperature effect on the conducted immunity of Op-Amp
Lifetime investigation and prediction of metallized polypropylene film capacitors
Evidence that N 2 O is a stronger oxidizing agent than O 2 for both Ta 2 O 5 and bare Si below 1000degreeC and temperature for minimum low-K interfacial oxide for high-K dielectric on Si
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
Solder interconnection failure time estimation based on the embedded precursor behaviour modelling
Enhanced degradation of n-MOSFETs with high-k/metal gate stacks under channel hot-carrier/gate-induced drain leakage alternating stress
Lifetime modeling and simulation of power modules for hybrid electrical/electrical vehicles
Growth competition between layer-type and porous-type Cu 3 Sn in microbumps
MEMS packaging reliability assessment: Residual Gas Analysis of gaseous species trapped inside MEMS cavities
The robustness of series-connected high power IGBT modules
Evaluation of solder joint strengths under ball impact test
A thermal modeling methodology for power semiconductor modules
Study of Al-Cu compounds as soldering bond pad for high-power device packaging
Reliability study of fiber-coupled photodiode module for operation at 4 K
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices
Identification of the generation/rupture mechanism of filamentary conductive paths in ReRAM devices using oxide failure analysis
Yield challenges in wafer stacking technology
Assessment of long term reliability of photovoltaic glass-glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis
Experimental and 3D simulation correlation of a gg-nMOS transistor under high current pulse
Reliability evaluation of IGCT from accelerated testing, quality monitoring and field return analysis
Effect of ytterbium doping on the optical and electrical properties of intrinsic In 2 O 3 thin films
Physical properties and electrical characteristics of H 2 O-based and O 3 -based HfO 2 films deposited by ALD
Warpage analysis of layered structures connected by direct brazing
1/f noise as a reliability indicator for subsurface Zener diodes
Insights on trap generation and breakdown in ultra thin SiO 2 and SiON dielectrics from low voltage stress-induced leakage current measurements
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Interfacial layer quality effects on low-frequency noise (1/f) in p-MOSFETs with advanced gate stacks
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments
Reliability enhancement with the aid of transient infrared thermal analysis of smart Power MOSFETs during short circuit operation
Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints
Unit capacitor array based SAR ADC
Failure analysis of video processor defined as No Fault Found (NFF): Reproduction in system level and advanced analysis technique in IC level
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17
Low-frequency noise in hot-carrier degraded nMOSFETs
Methodology of reliability enhancement for high power LED driver
Charge storage and data retention characteristics of forming gas-annealed Gd 2 O 3 -nanocrystal nonvolatile memory cell
Adhesive die attach for power application: Performance and reliability in plastic package
Failure modes on low voltage power MOSFETs under high temperature application
An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells
High temperature pulsed-gate robustness testing of SiC power MOSFETs
The correlation between the low-frequency electrical noise of high-power quantum well lasers and devices surface non-radiative current
Analysis of high-power devices using proton beam induced charge microscopy
Electrical steering of vehicles - fault-tolerant analysis and design
Investigation of artificial neural network algorithm based IGBT online condition monitoring
Measurement and analysis of substrate leakage current of RF mems capacitive switches
Failure mechanisms in blue InGaN/GaN LEDs for high power operation
An automated approach for locating multiple faulty LUTs in an FPGA
The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing
Compound semiconductor activation energy in humidity
On endurance and performance of erasure codes in SSD-based storage systems
Instable mechanisms during unclamped operation of high power IGBT modules
Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element
Electrical field mapping in InGaP HEMTs and GaAs terahertz emitters using backside infrared OBIC technique
Performance trends of Si-based RF transistors
Potentiality of healing techniques in hot-carrier damaged 28 nm FDSOI CMOS nodes
Remaining storage life prediction for an electromagnetic relay by a particle filtering-based method
Electromagnetic susceptibility characterization of double SOI device
Mechanical analysis of wafer testing with FEM simulations
Field- and current-driven degradation of GaN-based power HEMTs with p-GaN gate: Dependence on Mg-doping level
Dynamic voltage stress effects on nMOS varactor
Anomalous narrow width effect in p-channel metal-oxide-semiconductor surface channel transistors using shallow trench isolation technology
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
Development and application of the Oxide Stress Separation technique for the measurement of ONO leakage currents at low electric fields in 40 nm floating gate embedded-flash memory
A straightforward analytical method for extraction of semiconductor device transient thermal parameters
Dependency of thermal spreading resistance on convective heat transfer coefficient
LDO regulator DC characteristic and susceptibility prediction after electrical stress ageing
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
On the series resistance in staggered amorphous thin film transistors
SOI design challenges
PCB drop test lifetime assessment based on simulations and cyclic bend tests
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards
An efficient technique to select logic nodes for single event transient pulse-width reduction
Performance improvement of Si-CCD detector based backside reflected light and photon emission microscopy by FIB ultimate substrate thinning
Prediction of pad cratering fracture at the copper pad - Printed circuit board interface
InGaAs submonolayer quantum-dot photonic-crystal LEDs for fiber-optic communications
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization
Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applications
Thermal and electrostatic reliability characterization in RF MEMS switches
Advantages and new development of direct bonded copper substrates
A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress
Modeling and simulation of an active restoring mechanism for high reliability switches in RF-MEMS technology