yusuke1997/dblp-id-title huggingface dataset:
Uncertainty quantification in nanowire growth modeling - A precursor to quality semiconductor nanomanufacturing
Modeling of ESR in metallized film capacitors and its implication on pulse handling capability
Characteristic of copper wire and transient analysis on wirebonding process
Copper induced synthesis of graphene using amorphous carbon
dc-Conduction mechanism in lanthanum-manganese oxide films grown on p-Si substrate
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys
Full-band tunneling in high-kappa dielectric MOS structures
A reliability comparison of InGaP/GaAs HBTs with and without passivation ledge
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints
Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
Stress intensities at the triple junction of a multilevel thin film package
Analysis of temperature dependence of linearity for SiGe HBTs in the avalanche region using Volterra series
Voltage-based fault path tracing by transistor operating point analysis
Impact of high frequency current ripple on supercapacitors ageing through floating ageing tests
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry
Analyses on NVM Circuitry Delay Induced by Source & Drain BF 2 Implant
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure
Corrosion protection of anisotropically conductive adhesive joined flip chips
Thermoelectrical modelling and simulation of devices based on VO 2
Modeling Thermal Laser Stimulation
Performance drifts of N-MOSFETs under pulsed RF life test
Opens localization on silicon level in a Chip Scale Package using space domain reflectometry
Phase-shift imaging ellipsometer for measuring thin-film thickness
Bipolar mechanisms present in short channel SOI-MOSFET transistors
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives
Lifetime-aware scheduling in high level synthesis
Statistical analysis for test lands positioning and PCB deformation during electrical testing
GaAs P-HEMT MMIC processes behavior under multiple heavy ion radiation stress conditions combined with DC and RF biasing
Characteristics of random telegraph signal noise in time delay integration CMOS image sensor
ANN based CMOS ASIC design for improved temperature-drift compensation of piezoresistive micro-machined high resolution pressure sensor
Physical model for the power-law voltage and current acceleration of TDDB
Analysis of deep level defects in bipolar junction transistors irradiated by 2 MeV electrons
Robustness of MW-Level IGBT modules against gate oscillations under short circuit events
Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices
Growth nature of in-situ Cu 6 Sn 5 -phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity
Experimental and simulated dc degradation of GaN HEMTs by means of gate-drain and gate-source reverse bias stress
Performance of commercial foundry-level AlGaN/GaN HEMTs after hot electron stressing
Reliability of optoelectronics components: towards new qualification practices
Failure analysis techniques for a 3D world
Determination of transistor infant failure probability in InGaP/GaAs heterojunction bipolar technology
Impact of total dose on heavy-ion upsets in floating gate arrays
Single event double node upset tolerance in MOS/spintronic sequential and combinational logic circuits
Techniques for dynamic analysis of bonding wire
Correlation of carbon doping variations with the vertical breakdown of GaN-on-Si for power electronics
Impacts of NBTI/PBTI on performance of domino logic circuits with high-k metal-gate devices in nanoscale CMOS
Study of nanocrystal memory integration in a Flash-like NOR device
Reliability for Recessed Channel Structure n-MOSFET
Modeling study of thermosonic flip chip bonding process
A two-dimensional analytical subthreshold behavior model for short-channel AlGaAs/GaAs HFETs
Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature
Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability
Accelerated life test of high power white light emitting diodes based on package failure mechanisms
Correlation considerations: Real HBM to TLP and HBM testers
High optical strength GaAs-based laser structures
A new meshing criterion for the equivalent thermal analysis of GaAs PHEMT MMICs
Topologies for inverter like operation of power cycling tests
The role of a tensile stress bias for a sensitive silicon mechanical stress sensor based on a change in gate-induced-drain leakage current
Case study of a technology transfer causing ESD problems
Resistive RAM variability monitoring using a ring oscillator based test chip
Performance-reliability trade-offs in short range RF power amplifier design
Stacked PMOS clamps for high voltage power supply protection
Switching times variation of power MOSFET devices after electrical stress
An explicit multi-exponential model for semiconductor junctions with series and shunt resistances
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
Monitoring of power dissipated in microelectronic structures
Integration of an SCR in an active clamp
Influence of dicing damages on the thermo-mechanical reliability of bare-chip assemblies
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations
Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages
Failure predictive model of capacitive RF-MEMS
Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD
The mechanical stress resistance capability of stress buffer structures in analog devices
Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn
Testing Static Random Access Memories: Defects, Fault Models and Test Patterns, Said Hamdioui, Kluwer Academic Publishers, Boston, 2004, Hardcover, pp 221, plus XX, ISBN 1-4020-7752-1
Chip-packaging interaction: a critical concern for Cu/low k packaging
Microstructure and morphology of interfacial intermetallic compound CoSn 3 in Sn-Pb/Co-P solder joints
An 8-level 3-bit cell programming technique in NOR-type nano-scaled SONOS memory devices
A potential gas sensor device based on Pd/RGO/TiO 2 nanotube ternary hybrid junction
Extend orthogonal Latin square codes for 32-bit data protection in memory applications
Reliability of ESD protection devices designed in a 3D technology
On the configuration- and frequency-dependent linearity characteristics of SiGe HBTs under different impedance matching conditions
Thermal stress reduction of quasi-Z source inverter drive by model predictive control
Study on power cycling test with different control strategies
Use of signal processing imaging for the study of a 3D package in harsh environment
Effects of hydrogen transport and reactions on microelectronics radiation response and reliability
Tuneable electrical properties of hafnium aluminate gate dielectrics deposited by metal organic chemical vapour deposition
An improved isothermal electromigration test for Cu-damascene characterization
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition
Whisker growth on tin finishes of different electrolytes
An introduction to fast wafer level reliability monitoring for integrated circuit mass production
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling
Impact of silicon nitride CESL on NLDEMOS transistor reliability
Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys
Shear properties of In-Bi alloy joints with Cu substrates during thermal aging
Embedding a feedforward controller into the IGBT gate driver for turn-on transient improvement
Gate leakage-current analysis and modelling of planar and trench power SiC MOSFET devices in extreme short-circuit operation
Isothermal aging characteristics of Sn-Pb micro solder bumps
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials
Magnetic field measurements for Non Destructive Failure Analysis
Temperature dependence of the electrical characteristics up to 370 K of amorphous In-Ga-ZnO thin film transistors
Effect of moisture condensation on long-term reliability of crystalline silicon photovoltaic modules
Compact failure modeling for devices subject to electrostatic discharge stresses - A review pertinent to CMOS reliability simulation
Real-time failure imaging system under power stress for power semiconductors using Scanning Acoustic Tomography (SAT)
Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles
Orthogonal fault-tolerant systolic arrays for matrix multiplication
Gate metal interdiffusion induced degradation in space-qualified GaAs PHEMTs
Anomalous latchup failure induced by on-chip ESD protection circuit in a high-voltage CMOS IC product
A Built-In Self-Test (BIST) system with non-intrusive TPG and ORA for FPGA test and diagnosis
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Investigations on electrical characteristics and reliability properties of MOS capacitors using HfAlO x on n-GaAs substrates
Multiple impact characterization of wafer level packaging (WLP)
Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP
Experimental study on the influence of junction temperature on the relationship between IGBT switching energy loss and device current
Breakdown characterization of gate oxides in 35 and 70 Å BCD8 smart power technology
Advances in scanning SQUID microscopy for die-level and package-level fault isolation
A survey of SiC power MOSFETs short-circuit robustness and failure mode analysis
Electrostatic Effects on Semiconductor Tools
Micromechanical analysis of copper trace in printed circuit boards
PCB dual-switch fuse with energetic materials embedded: Application for new fail-safe and fault-tolerant converters
Electrical parameters degradation of power RF LDMOS device after accelerated ageing tests
A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages
Prediction of supercapacitors floating ageing with surface electrode interface based ageing law
The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation
Hybrid reliability assessment for packaging prototyping
Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation
System Design with System C; Thorsten Grotker, Stan Liao, Grant Martin, Stuart Swan. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 217, plus X, ISBN 1-4020-7027-1
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling
Front Side and Backside OBIT Mappings applied to Single Event Transient Testing
An optimal structural design to improve the reliability of Al 2 O 3 -DBC substrates under thermal cycling
Multi-valued logic mapping of resistive short and open delay-fault testing in deep sub-micron technologies
Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications
Fabrication and reliability of dye solar cells: A resonance Raman scattering study
Polarity asymmetry of stress and charge trapping behavior of thin Hf- and Zr-silicate layers
Analysis and validation of neural network approach for extraction of small-signal model parameters of microwave transistors
The effect of tin grain structure on whisker growth
Effective and reliable heat management for power devices exposed to cyclic short overload pulses
Automated setup for thermal imaging and electrical degradation study of power DMOS devices
Development of embedded piezoelectric acoustic sensor array architecture
Recent research advances in Pb-free solders
Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability
Temperature-dependent light-emitting characteristics of InGaN/GaN diodes
Probing negative bias temperature instability using a continuum numerical framework: Physics to real world operation
Through silicon in-circuit logic analysis for localizing logic pattern failures
Gate-lag effects in AlGaAs/GaAs power HFET's
TEM sample preparation of a SEM cross section using electron beam induced deposition of carbon
HCI and NBTI induced degradation in gate-all-around silicon nanowire transistors
Reversible dielectric breakdown in ultrathin Hf based high-k stacks under current-limited stresses
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects
Vibration reliability test and finite element analysis for flip chip solder joints
Electromigration Performance of Multi-level Damascene Copper Interconnects
Failure analysis of 650 V enhancement mode GaN HEMT after short circuit tests
Peculiarities of hole trapping in Al 2 O 3 -SiO 2 gate dielectric stack
Degradation behavior by DC-accelerated and pulse-current stress in Co/Cr/Y/Al/Ni co-doped ZnO-PrO 1.83 -based varistors
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink
Effects of electrical stressing in power VDMOSFETs
Aluminum bond-wire properties after 1 billion mechanical cycles
Characterization and FE analysis on the shear test of electronic materials
Effect of normal forces on fretting corrosion of tin-coated electrical contacts
Elemental characterisation of sub 20 nm structures in devices using new SEM-EDS technology
Effects of different drop test conditions on board-level reliability of chip-scale packages
Voltage dependent degradation of HfSiON/SiO 2 nMOSFETs under positive bias temperature instability
Locally delineating of junctions and defects by local cross-section electron-beam-induced-current technique
Gate defects analysis in AlGaN/GaN devices by mean of accurate extraction of the Schottky Barrier Height, electrical modelling, T-CAD simulations and TEM imaging
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Conduction band states of transition metal (TM) high-k gate dielectrics as determined from X-ray absorption spectra
Unusual defects, generated by wafer sawing: An update, including pick&place processing
Thermal cycling impacts on supercapacitor performances during calendar ageing
Modelling the effect of uneven PWB surface on stencil bending during stencil printing process
High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates
Impact of NBTI induced variations on delay locked loop multi-phase clock generator
A fully digital feedback control of gate driver for current balancing of parallel connected power devices
Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences
Vapour pressure measurement of low volatility precursors
Die crack failure mechanism investigations depending on the time of failure
Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys
A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects
Simple-structured efficient white organic light emitting diode via solution process
Structural health monitoring of solder joints in QFN package
Physically-based evaluation of aging contributions in HC/FN-programmed 40 nm NOR Flash technology
High-resolution transmission electron microscopy on aged InP HBTs
Hot-carrier reliability of 20V MOS transistors in 0.13 mum CMOS technology
Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses
Analysis of traps effect on AlGaN/GaN HEMT by luminescence techniques
The die-to-die calibrated combined model of negative bias temperature instability and gate oxide breakdown from device to system
Interconnect crosstalk noise evaluation in deep-submicron technologies
Study of hafnium oxide deposited using Dense Plasma Focus machine for film structure and electrical properties as a MOS device
Reservoir effect and maximum allowed VIA misalignment for AlCu interconnect with tungsten VIA plug
High temperature long term stability of SiC Schottky diodes
ESD protection for thin gate oxides in 65 nm
Stability evaluation of Au-free Ohmic contacts on AlGaN/GaN HEMTs under a constant current stress
Backside failure analysis application of light scattering for active silicon defect detection
Study of reliability-efficiency tradeoff of active thermal control for power electronic systems
High-electric-field effects and degradation of AlGaAs/GaAs power HFETs: a numerical study
Scanning spreading resistance microscopy for failure analysis of nLDMOS devices with decreased breakdown voltage
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages
Evidence and modelling current dependence of defect generation probability and its impact on charge to breakdown
Semiconductor package qualification based on the swelling temperature
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints
Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly
A novel simulation technique for testing analog ICs
Pseudo Time-Variant parameters in centrifugal compressor availability studies by means of Markov models
Channel-carrier mobility parameters for 4H SiC MOSFETs
ESD SPICE model and measurements for a hard disk drive
Generating sub-1V reference voltages from a resistorless CMOS bandgap reference circuit by using a piecewise curvature temperature compensation technique
The optimization design of bump interconnections in flip chip packages from the electrical standpoint
Adaptive static and dynamic noise margin improvement in minimum-sized 6T-SRAM cells
Degradation estimation using feature increment stepwise linear regression for PWM Inverter of Electro-Mechanical Actuator
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects
Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement
Reliability Defect Monitoring with Thermal Laser Stimulation: Biased Versus Unbiased
Energy monitoring of high dose ion implantation in semiconductors via photocurrent measurement
Infrared Thermography application to functional and failure analysis of electron devices and circuits
Using Boolean satisfiability for computing soft error rates in early design stages
Lateral punch-through TVS devices for on-chip protection in low-voltage applications
Advanced Local Lifetime Control for Higher Reliability of Power Devices
GaN-based HEMTs tested under high temperature storage test
Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors
Dynamic laser stimulation techniques for advanced failure analysis and design debug applications
Aging characteristics of ZnO-V 2 O 5 -based varistors for surge protection reliability
Reliability investigations on LTG-GaAs photomixers for THz generation based on optical heterodyning
New trim configurations for laser trimmed thick-film resistors - theoretical analysis, numerical simulation and experimental verification
Technologies and reliability of modern embedded flash cells
Techniques to study the reliability of metal RF MEMS capacitive switches
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
Investigation on marginal failure characteristics and related defects analysed by soft defect localization
Electrical properties of MIS capacitor using low temperature electron beam gun - evaporated HfAlO dielectrics
Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads
Low-complexity Concurrent Error Detection for convolution with Fast Fourier Transforms
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys
Failure analysis of a thin-film nitride MEMS package
Mutual and self-aging effects of power semiconductors on the thermal behaviour of DC-DC boost power converter
A new method for the analysis of high-resolution SILC data
How to study delamination in plastic encapsulated devices
Evaluation of temperature distribution of LED module
Analysis of low isolation problem in HMC using Ishikawa model: A case study
Influence of solder bump arrangements on molded IC encapsulation
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach
Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC
Method to estimate profile of threshold voltage degradation in MOSFETs due to electrical stress
Characterization of various insulators for possible use as low-k dielectrics deposited at temperatures below 200degreeC
A low energy FIB processing, repair, and test system
Exploitation of Laser Voltage techniques for identification and complete characterization of a scan chain transition fail issue using the second harmonic approach
A yield improvement technique in severe process, voltage, and temperature variations and extreme voltage scaling
Electro- and thermomigration induced Cu 3 Sn and Cu 6 Sn 5 formation in SnAg 3.0 Cu 0.5 bumps
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line
CDM tests on interface test chips for the verification of ESD protection concepts
Reliability of ultra-thin oxides in CMOS circuits
Exploiting component dependency for accurate and efficient soft error analysis via Probabilistic Graphical Models
Optimization of contact metallizations for reliable wafer level AuSn bonds
Nitrogen-Vacancy centers in diamond for current imaging at the redistributive layer level of Integrated Circuits
High fluence 1.8 MeV proton irradiation effects on n-type MOS capacitors
Study of the electrolyte-insulator-semiconductor field-effect transistor (EISFET) with applications in biosensor design
Short-circuit robustness test and in depth microstructural analysis study of SiC MOSFET
An automated ultrasonic inspection approach for flip chip solder joint assessment
Plasma process induced damage detection by fast wafer level reliability monitoring for automotive applications
Low frequency noise in field-plate multigate AlGaN/GaN single-pole-single-throw RF switches on silicon substrate
Reliability of Low-Cost PCB Interconnections for Telecommunication Applications
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via
Exploiting reliable features of asynchronous circuits for designing low-voltage components in FD-SOI technology
Fault-tolerant TMR and DMR circuits with latchup protection switches
Magnetic imaging for resistive, capacitive and inductive devices; from theory to piezo actuator failure localization
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
Thermal impedance plots of micro-scaled devices
Functional fault models for non-scan sequential circuits