yusuke1997/dblp-id-title huggingface dataset:
Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding
Field Failure Mechanism Investigation of GaAs based HBT Power Amplifier Mmodule (PAM)
A novel power-clamp assisted complementary MOSFET for robust ESD protection
A 5000 h RF life test on 330 W RF-LDMOS transistors for radars applications
Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications
Purpose, potential and realization of chip-attached micro-pin fin heat sinks
Interactive and non-destructive verification of sram-descrambling with laser
Uneven temperature effect evaluation in high-power IGBT inverter legs and relative test platform design
Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL test
Optimization of inter-gate-dielectrics in hybrid float gate devices to reduce window instability during memory operations
A hydrogen sensor based on a metamorphic high electron mobility transistor (MHEMT)
Influence of lamination parameters on mechanical properties of low temperature co-fired ceramic tapes
Supercapacitor ageing at constant temperature and constant voltage and thermal shock
Reliability evaluation for Blu-Ray laser diodes
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging
Failure investigation on copper-plated blind vias in PCB
An Extrapolation Model for Lifetime Prediction for Off-State - Degradation of MOS-FETs
Erratum to "An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators" [Microelectronics Reliability 2003;43: 495-502]
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits
Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules
Hardening silicon-on-insulator nMOSFETs by multiple-step Si + implantation
Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technology
Coupling damage and reliability modeling for creep and fatigue of solder joint
Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations
Experimental investigation on the evolution of a conducted-EMI buck converter after thermal aging tests of the MOSFET
From Static Thermal and Photoelectric Laser Stimulation (TLS/PLS) to Dynamic Laser Testing
On designing an efficient numerical-based forbidden pattern free crosstalk avoidance codec for reliable data transfer of NoCs
Reliability of 70 nm metamorphic HEMTs
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles
A 0.18 μm CMOS ring VCO for clock and data recovery applications
Problem of dynamic change of tags location in anticollision RFID systems
Balancing temperature dependence of on-wafer SOS inductors
Long-term degradation mechanisms of mid-power LEDs for lighting applications
Single-event-transient effects in Junctionless Double-Gate MOSFETs with Dual-Material Gate investigated by 3D simulation
Useful lifetime analysis for high-power white LEDs
Characteristics of pH sensors fabricated by using protein-mediated CdSe/ZnS quantum dots
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Residual stresses in microelectronics induced by thermoset packaging materials during cure
Improved reliability of large-sized a-Si thin-film-transistor by back channel treatment in H 2
Cross-layer custom instruction selection to address PVTA variations and soft error
Dynamic void formation in a DD-copper-structure with different metallization geometry
Infrared response of vanadium oxide (VO x )/SiN x /reduced graphene oxide (rGO) composite microbolometer
Fast identification of true critical paths in sequential circuits
Initial detection of potential-induced degradation using dark I-V characteristics of crystalline silicon photovoltaic modules in the outdoors
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology
PMOSFET anti-fuse using GIDL-induced-HEIP mechanism
Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Reliability of High-K Dielectrics and Its Dependence on Gate Electrode and Interfacial / High-K Bi-Layer Structure
Influence of air pollutants on the lifetime of LEDs and analysis of degradation effects
Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules
Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity
The effect of external stress on the properties of AlGaAs/GaAs single quantum well laser diodes
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth
Evaluation of scanning capacitance microscopy sample preparation by focused ion beam
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Robustness of 1.2 kV SiC MOSFET devices
Statistical variability in FinFET devices with intrinsic parameter fluctuations
The effects of buffer thickness on GaAs MESFET characteristics: channel-substrate current, drain breakdown, and reliability
Auxiliary power unit failure prediction using quantified generalized renewal process
Statistical modeling of reliability in logic devices
Determination of the orthotropic material properties of individual layers of printed circuit boards
Cu diffusion in Ag-plated Cu leadframe packages
Study of total ionizing dose induced read bit errors in magneto-resistive random access memory
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness
Influence of channel layer and passivation layer on the stability of amorphous InGaZnO thin film transistors
The post-damage behavior of a MOS tunnel emitter transistor
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect
Experimental identification of LED compact thermal model element values
High-k praseodymium oxide passivated AlGaN/GaN MOSFETs using P 2 S 5 /(NH 4 ) 2 S X + UV interface treatment
Negative bias illumination stress instability in amorphous InGaZnO thin film transistors with transparent source and drain
Low Power Electronics Design, Christian Pignet, Editor, CRC Press, Boca Raton, 2005, Hardcover, pp 854, plus 18, ISBN 0-8493-1941-2
Suppression of Ge-O and Ge-N bonding at Ge-HfO 2 and Ge-TiO 2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices
Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect
Failure and reliability analysis of STT-MRAM
Exploring the feasibility of selective hardening for combinational logic
Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink
Numerical analysis of localised charges impact on static and dynamic performance of nanoscale cylindrical surrounding gate MOSFET based CMOS inverter
The effect of a post processing thermal anneal on pre-existing and stress induced electrically active defects in ultra-thin SiON dielectric layers
Field failure mechanism and reproduction due to moisture for low-voltage ZnO varistors
Wafer-level LED-SiP based mobile flash module and characterization
ESD protection solutions for high voltage technologies
DC-to-RF dispersion effects in GaAs- and GaN-based heterostructure FETs: performance and reliability issues
Methodology for improvement of data retention in floating gate flash memory using leakage current estimation
Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish
Effective scan chain failure analysis method
Advanced structural similarity rules for the BGA package family
Developing a Simplified Analytical Thermal Model of Multi-chip Power Module
Zinc oxide-praseodymia semiconducting varistors having a powerful surge suppression capability
Catastrophic flip-chip failures at thermal cycles caused by micro-cracks in passivation layer, present only in the spacing between minimum width stripes of last metal level
Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase
Comparative analysis of accelerated ageing effects on power RF LDMOS reliability
Thermal resistance investigations on new leadframe-based LED packages and boards
Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing
Influence of the thermo-mechanical residual state on the power assembly modellization
Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions
Reliability modelling for packages in flexible end-products
N.G. Jacobson, The In-System Configuration Handbook: A Designer's Guide to ISC, Kluwer Academic Publishers, Boston, 2004, ISBN 1-4020-7655-X. Hardcover, pp 201, plus XVII
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding
Isothermal bending fatigue response of solder joints in high power semiconductor test structures
Via high resistance failure analysis of LSI devices induced by multiple factors related to process and design
Thermal modeling of planar transformer for switching power converters
Wafer scale and reliability investigation of thin HfO 2 ·AlGaN/GaN MIS-HEMTs
A self-test and dynamics characterization circuit for MEMS electrostatic actuators
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model
Die degradation effect on aging rate in accelerated cycling tests of SiC power MOSFET modules
The IEEE standards on reliability program and reliability prediction methods for electronic equipment
Subthreshold performance of gate engineered FinFET devices and circuit with high-k dielectrics
Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives
Improvement of SiO 2 /4H-SiC Interface properties by post-metallization annealing
Investigation of power Trench MOSFETs with retrograde body profile
Thin dielectric reliability assessment for DRAM technology with deep trench storage node
Manufacturing process-based storage degradation modelling and reliability assessment
A double snapback SCR ESD protection scheme for 28 nm CMOS process
Determination of temperature change inside IC packages during laser ablation of molding compound
A review of gate tunneling current in MOS devices
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5
Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy
Investigation of double barrier MOS tunnel diodes with PECVD silicon quantum well
The variation of the leakage current characteristics of W/Ta 2 O 5 /W MIM capacitors with the thickness of the bottom W electrode
Constant voltage stress characterization of nFinFET transistor during total ionizing dose experiment
Evaluation of performance-reliability trade-offs in a Si-Ge BiCMOS process using fast wafer level techniques
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method
On the role of holes in oxide breakdown mechanism in inverted nMOSFETs
A modified boost rectifier for elimination of circulating current in power factor correction applications
Impact of gate metal work-function engineering for enhancement of subthreshold analog/RF performance of underlap dual material gate DG-FET
Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO 2 composite solders
Reliability of MEMS shallow arches based actuator under the combined effect of mechanical shock and electric loads
Life margin assessment with Physics of Failure Tools application to BGA packages
Impact of modularity and redundancy in optimising the reliability of power systems that include a large number of power converters
Prediction of dielectric reliability from I-V characteristics: Poole-Frenkel conduction mechanism leading to sqrt(E) model for silicon nitride MIM capacitor
Impact of NBTI and HCI on PMOSFET threshold voltage drift
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective
Single- and double-heterostructure GaN-HEMTs devices for power switching applications
Modeling of high-frequency characteristics for epoxy-sealed micro vacuum capacitors
X-ray ion mobility spectrometer
Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
Electro-thermal short pulsed simulation for SOI technology
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications
Application of forward gated-diode R-G current method in extracting F-N stress-induced interface traps in SOI NMOSFETs
Fundamental frequency region-based thermal control of power electronics modules in high power motor drive
Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors
Electrical qualification of new ultrathin integration techniques
Accelerated lifetime test of RF-MEMS switches under ESD stress
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
Partial Discharge Failure Analysis of AIN Substrates for IGBT Modules
Metal migration in epoxy encapsulated ECL devices
Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments
The ESD protection characteristic and low-frequency noise analysis of GaN Schottky barrier diode with fluorine-based plasma treatment
Intrinsic bonding defects in transition metal elemental oxides
Circuit simulation of workload-dependent RTN and BTI based on trap kinetics
Electrical characterization and reliability study of HEMTs on composite substrates under high electric fields
Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency
Degradation of thermal interface materials for high-temperature power electronics applications
Clamp voltage and ideality factor in laser diodes
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs
Characterization of a 0.13 mum CMOS Link Chip using Time Resolved Emission (TRE)
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates
Stable reduced order modeling of piezoelectric energy harvesting modules using implicit Schur complement
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA
Gate oxide breakdown in FET devices and circuits: From nanoscale physics to system-level reliability
Ensure an original and safe "fail-to-open" mode in planar and trench power SiC MOSFET devices in extreme short-circuit operation
Compact thermal modeling of spin transfer torque magnetic tunnel junction
Reliability improvement of fluorescent lamp using grey forecasting model
Fodel microresistors-processing and basic electrical properties
Characterization and modeling of dynamic variability induced by BTI in nano-scaled transistors
Near-field detection of photon emission from silicon with 30 nm spatial resolution
Novel simulation approach for transient analysis and reliable thermal management of power devices
Reliability assessment on new reprogrammable non-volatile memory devices based on SiCr-O
Endurance behavior of conductive yarns
Detection of DR violations in ASIC components using photon emission techniques
Effect of high temperature aging on reliability of automotive electronics
Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration
Louis Scheffer, Luciano Lavagno and Grant Martin, Editors, Electronic Design Automation for Integrated Circuits Handbook Vols. I and II, CRC, imprint of Taylor and Francis Group, Boca Raton (2006) ISBN 0-8493-3096-3 Hardcover, 1095 pp., plus XLVIII
OFF-state degradation and correlated gate dielectric breakdown in high voltage drain extended transistors: A review
The impact of process-induced mechanical stress in narrow width devices and variable-taper CMOS buffer design
Dielectric thin films for MEMS-based optical sensors
Aging comparative analysis of high-performance FinFET and CMOS flip-flops
CCGA packages for space applications
Using active thermography for defects inspection of flip chip
Ageing of SiC JFET transistors under repetitive current limitation conditions
Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO 2 and HfO 2 /SiO 2 gate dielectric stacks
The Computer Engineering Handbook; Vojin Oklobdzija. CRC Press, Boca Raton, 2002. Hardcover, pp 1338, ISBN 0-8493-0885-2
Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique
MIMC reliability and electrical behavior defined by a physical layer property of the dielectric
Analysis of an ESD failure mechanism on a SiC MESFET
Activation energy of drain-current degradation in GaN HEMTs under high-power DC stress
Lead-free plastic area array BGAs and polymer stud grid arrays TM package reliability
Performance analysis of long Ge channel double gate (DG) p MOSFETs with high-k gate dielectrics based on carrier concentration formulation
Micro Ceramic Cell Analyzer (MCCA) - Preliminary results
High power LED package with vertical structure
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
High-power silicon P-i-N diode with cathode shorts: The impact of electron irradiation
A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFET
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability
Multi-Poisson process analysis of real-time soft-error rate measurements in bulk 65 nm and 40 nm SRAMs
Accurate determination of flat band voltage in advanced MOS structure
Carrier injection efficiency for the reliability study of 3.5-1.2 nm thick gate-oxide CMOS technologies
Backside Localization of Current Leakage Faults Using Thermal Laser Stimulation
The Reliability of New Generation Power MOSFETs in Radiation Environment
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
Reliability of Diode-Integrated SiC Power MOSFET(DioMOS)
A CMOS circuit for evaluating the NBTI over a wide frequency range
A thorough investigation of hot-carrier-induced gate oxide breakdown in partially depleted N- and P-channel SIMOX MOSFETs
Impact of interface and bulk trapped charges on transistor reliability
On the short-circuit and avalanche ruggedness reliability assessment of SiC MOSFET modules
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
CADless laser assisted methodologies for failure analysis and device reliability
Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints
Experimental and simulation study of the correlation between displacement damage and incident proton energy for GaAs devices
NBTI model development with regression analysis
Reliability of power transistors against application driven temperature swings
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
Selecting an appropriate ESD protection for discrete RF power LDMOSTs
Explanation of impact load curve in ball impact test in relation to thermal aging
A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters
Back-end soft and hard defect monitoring using a single test chip
Parameter driven monitoring for a flip-chip LED module under power cycling condition
Transient fracturing of solder joints subjected to displacement-controlled impact loads
Thermal impedance measurement of integrated inductors on bulk silicon substrate
Lead-free 0201 manufacturing, assembly and reliability test results
Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown
Stress induced leakage current at low field in ultra thin oxides
Experimental investigation of Zener diode reliability under pulsed Electrical Overstress (EOS)
Reliability characteristics of high-k dielectrics
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps
Measurement considerations for evaluating BTI effects in SiC MOSFETs
A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices
Charge-based model for symmetric double-gate MOSFETs with inclusion of channel doping effect
Progress in reliability research in the micro and nano region
On the defects introduced by AC and DC hot carrier stress in SOI PD MOSFETs
Charge trapping and reliability characteristics of ultra-thin HfYO x films on n-GaAs substrates
Analysis of the effects of voltage pulses on P3HT: PCBM polymeric solar cells by means of TLP technique
Physical phenomena affecting performance and reliability of 4H-SiC bipolar junction transistors
A new procedure for eliminating the geometric component from charge pumping: Application for NBTI and radiation issues
Failure analysis and reliability on system level
A simple method for sub-100 nm pattern generation with I-line double-patterning technique
SET and noise fault tolerant circuit design techniques: Application to 7 nm FinFET
To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'15
Hopping conduction distance of bipolar switching GdOx resistance random access memory thin films devices modified by different constant compliance current
High-resolution in-situ of gold electromigration: test time reduction
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm
Impact of active thermal management on power electronics design
The characterization of electrically conductive silver ink patterns on flexible substrates
Effects of device passivation materials on solderable metallization of IGBTs
Temperature dependence of current-voltage characteristics of MoS 2 /Si devices prepared by the chemical vapor deposition method
An approach of numerical multi-objective optimization in stacked packaging