yusuke1997/dblp-id-title huggingface dataset:
Determination of energy and spatial distribution of oxide border traps in In 0.53 Ga 0.47 As MOS capacitors from capacitance-voltage characteristics measured at various temperatures
Electrothermal analysis of the self-excited push-pull DC-DC converter
Passive optical components: from degradation data to reliability assessment - preliminary results
Resistive switching properties of a thin SiO 2 layer with CeO x buffer layer on n + and p + Si bottom electrodes
A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages
Oxygen vacancy formation and the induced defect states in HfO 2 and Hf-silicates - A first principles hybrid functional study
Empirical BEOL-TDDB evaluation based on I(t)-trace analysis
Limitations to photon-emission microscopy when applied to "hot" devices
Life time comparison of LED package and the self-ballasted LED lamps by simple linear regression analysis
Investigation of a new method for dopant characterization
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate
Measuring structure functions of power devices in inverters
Defect detection and modelling using pulsed electrical stress for reliability investigations of InGaP HBT
SIMS study of silicon oxynitride prepared by oxidation of silicon-rich silicon nitride layer
Torsion test applied for reballing and solder paste volume evaluation
Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Implementation of high-k and metal gate materials for the 45nm node and beyond: gate patterning development
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages
Transient junction temperature estimation of IGBT using improved thermal model
Progressive module redundancy for fault-tolerant designs in nanoelectronics
Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders
An improved modeling for life prediction of high-power white LED based on Weibull right approximation method
Introduction to special section on selected papers from EOS/ESD Symposium 2004
Study on reliability of PQFP assembly with lead free solder joints under random vibration test
Fault model for on-chip communication and joint equalization and special spacing rules for on-chip bus design
Preliminary, space focused, reliability tests on European GaN HEMTs
Tin whisker analysis of an automotive engine control unit
A new test methodology for an exhaustive study of single-event-effects on power MOSFETs
Investigation on the degradation indicators of short-circuit tests in 1.2 kV SiC MOSFET power modules
Applying the fWLR concept to Stress induced leakage current in non-volatile memory processes
Practical optical gain by an extended Hakki-Paoli method
Semiconductor material analysis based on microcalorimeter EDS
Heavy-ion irradiation study in SOI-based and bulk-based junctionless FinFETs using 3D-TCAD simulation
Failure causes generating aluminium protrusion/extrusion
Thermal-aware design and fault analysis of a DC/DC parallel resonant converter
Water absorption characterisation, electrical reliability and mechanical testing of a submerged laminated a-Si thin film photovoltaic (PV) cells
Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects
Prediction and verification of process induced warpage of electronic packages
On the current conduction mechanisms of CeO 2 /La 2 O 3 stacked gate dielectric
Reliability studies of two flip-chip BGA packages using power cycling test
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
A dual-rail compact defect-tolerant multiplexer
Hot-carrier-induced degradation of drain current hysteresis and transients in thin gate oxide floating body partially depleted SOI nMOSFETs
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor
Transient voltage overshoot in TLP testing - Real or artifact?
Process Control and Failure Analysis Implementation for THz Schottky-based components
Accelerated Life Test of high luminosity blue LEDs
Reliability of adhesive joined thinned chips on flexible substrates under humid conditions
An image system for fast positioning and accuracy inspection of ball grid array boards
Analysis and design of amplifiers and comparators in CMOS 0.35 mum technology
Progressive breakdown in ultrathin SiON dielectrics and its effect on transistor performance
Tunneling component suppression in charge pumping measurement and reliability study for high-k gated MOSFETs
Noise properties of thick-film resistors in extended temperature range
Interface states and traps in thin N 2 O-grown oxynitride/oxide di-layer for PowerMOSFET devices
Timing analysis of scan design integrated circuits using stimulation by an infrared diode laser in externally triggered pulsing condition
Multiple-time-instant 2D thermal mapping during a single ESD event
Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology
Optimization of the thermal contact resistance within press pack IGBTs
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints
Symmetrical ESD trigger and pull-up using BIMOS transistor in advanced CMOS technology
A review of ULSI failure analysis techniques for DRAMs. Part II: Defect isolation and visualization
Robust FinFET SRAM design based on dynamic back-gate voltage adjustment
Corrosion behavior of crystalline silicon solar cells
A first-order kinetics ageing model for the hot-carrier stress of high-voltage MOSFETs
Improved electrical characteristics and reliability of amorphous InGaZnO metal-insulator-semiconductor capacitor with high kappa HfO x N y gate dielectric
Applications of the pulsed current-voltage (I-V) and capacitance-voltage (C-V) techniques for high-resistive gates in MOSFETs
Influence of gold pick up on the hardness of copper free air ball
Creeping corrosion of copper on printed circuit board assemblies
Impact of component placement in solder joint reliability
Degradation of high-K LA 2 O 3 gate dielectrics using progressive electrical stress
Drop simulation/experimental verification and shock resistance improvement of TFT-LCD monitors
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure
Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding
Digital image correlation for solder joint fatigue reliability in microelectronics packages
Feedback of MEMS reliability study on the design stage: a step toward Reliability Aided Design (RAD)
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package
Integrated modeling of Self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern integrated circuits
Physical-to-Logical Mapping of Emission Data using Place-and-Route
An exploration for the degradation behavior of 2-D electrostatic microscanners by accelerated lifetime test
Characterization of self-heating effects in semiconductor resistors during transmission line pulses
Electro-ultrasonic spectroscopy of polymer-based thick film layers
A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Inversion phenomenon as a result of junction damages in neutron irradiated silicon detectors
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
Smart SiC MOSFET accelerated lifetime testing
Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation
Modeling dose effects in electronics devices: Dose and temperature dependence of power MOSFET
A fault-tolerant cache architecture based on binary set partitioning
Construction of a cost-effective failure analysis service network--microelectronic failure analysis service in Japan
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review
Second order sigma-delta control of charge trapping for MOS capacitors
Study of the power capability of LDMOS and the improved methods
Technology scaling implications for BTI reliability
Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device
Transfer matrix model of multilayer graphene nanoribbon interconnects
Characterization and modeling of flicker noise in junction field-effect transistor with source and drain trench isolation
RF-driving of acoustic-optical tunable filters; design, realization and qualification of analog and digital modules for ESA
A new method to estimate the state of charge of the green battery
Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)
True dose rate physical mechanism of ELDRS effect in bipolar devices
Finite element analysis of thermal stress for different Cu interconnects structure
Numerical prediction of failure paths at a roughened metal/polymer interface
Cross-cell interference variability aware model of fully planar NAND Flash memory including line edge roughness
Optimizing the hot carrier reliability of N-LDMOS transistor arrays
A Novel Automatic Polishing Technique for Micro-Controllers with 45° off Si <100> Rotation
Fabrication of TiO 2 compact layer precursor at various reaction times for dye sensitized solar cells
Cu wire bond microstructure analysis and failure mechanism
Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler-Nordheim electron injection
Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules
Comparative evaluation of the short-circuit withstand capability of 1.2 kV silicon carbide (SiC) power transistors in real life applications
Development of chip-on-flex using SBB flip-chip technology
Repetitive high peak current pulsed discharge film-capacitor reliability testing
Evaluation of heavy-ion impact in bulk and FDSOI devices under ZTC condition
NBTI and irradiation related degradation mechanisms in power VDMOS transistors
Electromigration of Cu/low dielectric constant interconnects
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist
Characterization and reliability of nMOSFETs on flexible substrates under mechanical strain
Highly reliable processes for embedding discrete passive components into organic substrates
The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs
DRAM reliability
Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment
Interdiffusion at the interface between Sn-based solders and Cu substrate
Online computation of IGBT on-state resistance for off-shelf three-phase two-level power converter systems
Practical quantitative scanning microwave impedance microscopy
Fine pitch copper wire bonding in high volume production
Ultra-low-voltage boosted driver for self-powered systems
Simulation, characterization and implementation of a new SCR-based device with a turn-off capability for EOS-immune ESD power supply clamps in advanced CMOS technology nodes
Thermally induced deformation of solder joints in real packages: Measurement and analysis
Design optimization of SiGe BiCMOS Silicon Controlled Rectifier for Charged Device Model (CDM) protection applications
Geometric design for ultra-long needle probe card for digital light processing wafer testing
Electrical characterization of multiple leakage current paths in HfO 2 /Al 2 O 3 -based nanolaminates
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling
High-energy neutrons effect on strained and non-strained SOI MuGFETs and planar MOSFETs
Considerations for evaluating hot-electron reliability of strained Si n-channel MOSFETs
On-state voltage drop based derating/uprating on a MW converter to improve reliability
1.8 V-3 GHz CMOS limiting amplifier with efficient frequency compensation
Influence of charge balance on the robustness of trench-based super junction diodes
Gate voltage and oxide thickness dependence of progressive wear-out of ultra-thin gate oxides
A fast mechanical test technique for life time estimation of micro-joints
On discrete random dopant modeling in drift-diffusion simulations: physical meaning of 'atomistic' dopants
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method
Positive and negative threshold voltage instabilities in GaN-based transistors
Optimization of HfSiON using a design of experiment (DOE) approach on 0.45 V V t Ni-FUSI CMOS transistors
On the InGaP/In x Ga 1-x As pseudomorphic high electron-mobility transistors for high-temperature operations
Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon
Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling
Fatigue analysis of high-speed photodiode submodule by using FEM
Setting stress conditions that qualify application expectations
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Failure mechanism analysis of off-state drain-to-source leakage current failure of a commercial 650 V discrete GaN-on-Si HEMT power device by accelerated power cycling test
Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules
Quantification of lead-free solder fatigue by EBSD analysis
Simulation study of single event effects in the SiC LDMOS with a step compound drift region
Do ESD fails in systems correlate with IC ESD robustness?
NBTI and hot-carrier effects in accumulation-mode Pi-gate pMOSFETs
BTI mitigation by anti-ageing software patterns
In situ steam generation (ISSG) versus standard steam technology: impact on oxide reliability
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Failure mechanism of COF based Line Driver IC for Flat Panel Display by contamination
Effect of trace platinum additions on the interfacial morphology of Sn-3.8Ag-0.7Cu alloy aged for long hours
Flexible metal-insulator-metal capacitor using plasma enhanced binary hafnium-zirconium-oxide as gate dielectric layer
Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock
Interfacial thermal stresses in solder joints of leadless chip resistors
A concise study of neutron irradiation effects on power MOSFETs and IGBTs
Luminescence properties of mechanically nanoindented ZnSe
Proton-induced displacement damage in ZnO thin film transistors: Impact of damage location
Direct correlation between reliability and pH changes of phosphors for white light-emitting diodes
Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, pp 294, plus IX, ISBN 1-4020-7671-1
On the need for a new ESD verification methodology to improve the reliability of ICs in advanced 28nm UTBB FD-SOI technology
Comparison of lithium-ion battery performance at beginning-of-life and end-of-life
Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices
Dielectric charging in silicon nitride films for MEMS capacitive switches: Effect of film thickness and deposition conditions
Inversion of degradation direction of n-channel MOS-FETs in off-state operation
Characterization of MIS structures and thin film transistors using RF-sputtered HfO 2 /HIZO layers
Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology
Dielectric properties of two phases of crystalline lutetium oxide
Ga contamination in silicon by Focused Ion Beam milling: Dynamic model simulation and Atom Probe Tomography experiment
A surface potential and quasi-Fermi potential based drain current model for pocket-implanted MOS transistors in subthreshold regime
Novel ESD strategy for high voltage non-volatile programming pin application
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects
Low-temperature low-pressure die attach with hybrid silver particle paste
IMAPS Poland 2007 - Guest Editorial
Implementing Double Error Correction Orthogonal Latin Squares Codes in SRAM-based FPGAs
Light Emission to Time Resolved Emission For IC Debug and Failure Analysis
Solder-joint reliability of HVQFN-packages subjected to thermal cycling
Next generation of Deep Trench Isolation for Smart Power technologies with 120 V high-voltage devices
A MOSFET power supply clamp with feedback enhanced triggering for ESD protection in advanced CMOS technologies
Determination of electrical and mechanical parameters in capacitive MEMS accelerometers using electrical measurements
RF CMOS reliability simulations
Identification and analysis of power substrates degradations subjected to severe aging tests
Reliability of photovoltaic systems using seasonal mission profiles and the FIDES methodology
Low temperature fabricated conductive lines on flexible substrate by inkjet printing
A novel vertical SCR for ESD protection in 40 V HV bipolar process
Testing and improvement of micro-optical-switch dynamics
Characterization of interface state density of three-dimensional Si nanostructure by charge pumping measurement
Edge current induced failure of semiconductor PN junction during operation in the breakdown region of electrical characteristic
Reliability study of the electroless Ni-P layer against solder alloy
Specification analysis of the deteriorating sensor for required lifetime prognostic performance
Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3
New trends in the application of Scanning Probe Techniques in Failure Analysis
Lattice Boltzmann method study of bga bump arrangements on void formation
Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection
Selected failure mechanisms of modern power modules
Device simulation studies on latch-up effects in CMOS inverters induced by microwave pulse
The Impact of CMOS technology scaling on MOSFETs second breakdown: Evaluation of ESD robustness
Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application
Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile
Process optimization of RTA on the characteristics of ITO-coated GaN-based LEDs
Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress
Formation of coupled-cavities in quantum cascade lasers using focused ion beam milling
Drain current model for short-channel triple gate junctionless nanowire transistors
Douglas L. Perry, Harry D. Foster, Applied Formal Verification. Hardcover, pp 237, Plus XIV. New York: McGraw Hill; 2005, ISBN 0-07-144372-X
Economic design of the mean prognostic distance for canary-equipped electronic systems
Reliability studies and design improvement of mirror image CSP assembly
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers
Stress-induced degradation of p- and n-type organic thin-film-transistors in the ON and OFF states
Detectability of automotive power MOSFET on-resistance failure at high current induced by Wafer Fab process excursion
The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD diamond plastic packages
Reliability and performance limitations in SiC power devices
A fault-tolerant control strategy for switched reluctance motor drive for electric vehicles under short-fault condition
Methodology of semiconductor devices classification into groups of differentiated quality
Humidity study of a-Si PV cell
A low power MEMS gas sensor based on nanocrystalline ZnO thin films for sensing methane
Fracture strength characterization and failure analysis of silicon dies
Verification of empirical warp-based design criteria of space electronic boards
Analysis of the effect of the gate oxide breakdown on SRAM stability
Initial stage of silver electrochemical migration degradation
On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC)
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
Backside Hot Spot Detection Using Liquid Crystal Microscopy
Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices
A gold-free fully copper metalized AlGaN/GaN power HEMTs on Si substrate
High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp 247, plus XIII, ISBN 1-4020-7255-4
A generalized modular redundancy scheme for enhancing fault tolerance of combinational circuits
Failure modes and mechanism analysis of SiC MOSFET under short-circuit conditions
The effect of water on the mechanical properties of native oxide coated silicon structure in MEMS
Detectability of dynamic photon emission in static Si CCD for signal path determination in integrated circuits
Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components
Channel hot carrier effects in n-MOSFET devices of advanced submicron CMOS technologies
Commercial-off-the-shelf algan/gan hemt device reliability study after exposure to heavy ion radiation
Low gate interface traps AlGaN/GaN HEMTs using a lattice matched ZrZnO transparent gate design
Investigation of DNA sequencing droplet trajectory observation and analysis
Reduction of self-heating effect on SOIM devices
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device
Impact of gate stack process on conduction and reliability of 0.18 mum PMOSFET
Problems of PCB microvias filling by conductive paste
Improved bending fatigue life of single crystal silicon micro-beam by phosphorus doping
Influence of mobile ion in organic material used in semiconductor devices
Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation
Reliability evaluation of a silicon-on-silicon MCM-D package
Increasing the reliability of solid state lighting systems via self-healing approaches: A review
Maintenance strategy optimization using a continuous-state partially observable semi-Markov decision process
A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects
Mechanical problems of novel back contact solar modules
Mapping the failure envelope of board-level solder joints
Influence of fin number on hot-carrier injection stress induced degradation in bulk FinFETs
Charge trapping and degradation in Ge + ion implanted SiO 2 layers during high-field electron injection
A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs
Modeling the charge transport mechanism in amorphous Al 2 O 3 with multiphonon trap ionization effect
Characterizing a RISC-V SRAM-based FPGA implementation against Single Event Upsets using fault injection