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ET8EE6-AS - Toshiba Camera Module datasheet

SYSTEM CATALOG

Mobile Solutions

Toshiba Semiconductor Devices for Mobile Applications

Mobile communications via cellular phones and PDAs are changing the way we live. Toshibas semiconductor technology supports the hardware of mobile handsets. We are committed to ensuring the highest quality in both design and production so you can put our best-in-class IC capability to work for you as smoothly as possible. Pushing the limits of what is possible in mobile electronics, we are seeking a new paradigm of communications. Applications

CMOS Area Image Sensor

CONTENTS

CMOS Area Image Sensors

2M3.2M5M8M Dynastron CSCM (Chip Scale Camera Module)

Multimedia Engines Designed for Cellular Phone Applications

RF System

RF Analog ICs

Single-chip transceiver ICs for triple-band W-CDMA

RF Receiver TxRx Switch RF Transmitter RFIF

Terrestrial Digital TV Receiver IC

Ultra-Compact SurfaceMount Photointerrupter

TLP848 Ultra-compact surface-mount package

Multimedia Engines Designed for Cellular Phone Applications

Peripheral ICs

Audio IC Headphone

Terrestrial Digital TV Receiver IC

(ISDB-T One-Segment OFDM Demodulator IC) ETC90521JBTC90521 Reduces the size of one-segment cellular phones.

Mobile Memories NAND Flash Memory

RF Devices

Power amplifiers Buffer amplifiers LNA transistors Variable capacitance diodes Antenna switches

VCO PLL Baseband Signal Processing

Application Processor

CMOS Image Sensor

Memory: Multi-Chip Packages

NAND Flash Storage

Multimedia 3D Graphics Engine

TC352980XBG T5GE FWVGA video playbackrecord using H.264

Single-Chip Transceiver IC for Triple-Band W-CDMA 13

Speaker Mic. Magnetic Sensor

Digital-Output Magnetic Sensor Series TCS10 and TCS11 Series

Ideal for applications with openclose contacts Memory (MCP)

Power Supply IC

Ambient Light Sensor

LCD Module

LCD Driver Backlight LED

TC35711XBG TG2 High-performance 3D graphics engine

Digital TV Receiver IC Compact SMD Type LED Lamps White LED Drivers Power Supply ICs for Cellular Phone (CDMA) Power Amps Surface-Mount Photo-IC for Ambient Light Sensor: TPS856 Ultra-Compact Surface-Mount Photointerrupter: TLP848

Peripheral ICs

Battery Charger Memory Card IF Memory (MCP) Backlight LED

High-speed serial image transmission and general capabilities for controlling peripheral functions MDDI Display Buffer TC358720XBG, etc. MIPI Display Buffer TC358730XBG, etc. IO Expander TC35890XBG, etc.

TCS1011 Digital-Output Magnetic Sensor 17 Series Ultra-Small, Low ON-Resistance Analog Switches ESD Protection Diodes 18

Power Supply System

Discrete Devices for Power Supply Systems

Power MOSFETs for power management Power MOSFETs for lithium-ion battery protection

Devices for Small Power Supplies : MOSFETs and CMOS LDO Regulators

General-Purpose

Triple switch for power supplies Power supply ICs with low standby current Photocouplers

Memory

Memory: Multi-Chip Packages

mobileLBA-NAND, a high-density NAND flash series, ideal for cellular phone applications

Display

SD Memory Cards

microSD cards

Backlighting and Key Lighting

Small and high-brightness LED lamps Schottky barrier diodes Zener diodes Level shifters Ambient light sensors

White LED Drivers

Switching-regulated drivers Charge-pumped drivers DCDC converters Non-upconvert constant-current drivers

Surface-Mount Photo ICs for Ambient Light Sensors

TPS850 Series Best suited for use in automatic brightness control of LCD monitors and key backlighting

Power Supply ICs for Power Amps (for CDMA)

The microSD logo is a trademark.

Note: The system and product names mentioned herein may be trademarks or registered trademarks of respective companies.

Small Package, Low Power Consumption and High Resolution

CMOS Area Image Sensor

In its pursuit of further miniaturization and higher performance, Toshiba offers a new Dynastron CMOS image sensor with a pixel pitch of 1.75 m, reduced from 2.2 m. The new image sensor is available in pixel counts ranging from 2.0 M to 8 M. The Dynastron technology provides high-quality imaging, thanks to the use of a microlens and an optimized array of photodiodes. The new image sensor opens up new possibilities for mobile handsets such as camera phones.

: Dynastron is a trademark of Toshiba Corporation.

ET8EN2-AS

2-Megapixel DynastronTM: ET8EM0 (under development) 3.2-Megapixel DynastronTM: ET8EM1 5-Megapixel DynastronTM: ET8EM2 (under development) 8-Megapixel DynastronTM: ET8EN2 (under development)

Features

Dynastron The

technology provides world-class image quality.

integrated PLL provides great flexibility in the selection of input clocks. blemish correction, gain control, etc. controlled via the I2C bus.

Offers

Command

General Specifications

Item Part Number Optical Format Pixel Count Cell Size Output Signaling Frame Rate Control Bus ISP Specification

ET8EN2

12.6 inch Approx. 8 M (3, 280 (H) x 2, 464 (V)) 1.75 m x 1.75 m RAW 7.5 fps at full resolution I2C

ET8EM2

13.2 inch Approx. 5 M (2, 584 (H) x 1, 960 (V)) 1.75 m x 1.75 m RAW 12 fps at full resolution I2C

ET8EM1

14 inch Approx. 3.2 M (2, 060 (H) x 1, 548 (V)) 1.75 m x 1.75 m RAW 15 fps at full resolution I2C

ET8EM0

15 inch Approx. 2 M (1, 616 (H) x 1, 216 (V)) 1.75 m x 1.75 m YUVRGBRAW UXGA15 fps VGA30 fps I2C

Integrated

ISP: Image Signal Processor

Dynastron Roadmap

Shown in round boxes are optical formats.

ET8EN2 12.6" 12.5" ET8EM2 13.2" ET8EM1 14" ET8EM0 15"

Resolution

0.33 M

17" 3.3 m

18" 2.7 m

110" 2.2 m 1.75 m

Finer pitch

Pixel Count

CSCM (Chip Scale Camera Module)

The first camera modules manufactured using Through-Chip Via (TCV) technology

Toshiba now offers a family of chip scale camera module (CSCM1) with a Dynastron CMOS image sensor. They are the first2 to use TCV3 technology. In the last few years, cellular phones and other mobile devices are coming in smaller and smaller form factors. This is driving the need for smaller, yet higher-quality camera modules to be able to incorporate digital camera functionality into these space-critical applications. TCV technology uses a chip structure with built-in pass-through electrodes and allows the mounting and assembly of camera modules in the semiconductor wafer. With solder balls on the bottom of the substrate, the CSCM requires no wire bonding space, delivering a 64 reduction4 in module size compared to Toshibas conventional camera modules manufactured with the same VGA sensors. The use of heat-resistant lenses and solder balls permits reflow soldering5 and thus simplifies the pc board mounting of camera modules. This contributes to a reduction in Comparison Between the Conventional and CSCM Camera Modules the manufacturing process of (Conventional Technology) surface-mount pc boards.

Optical lens

1 The chip scale camera module is a ultra-small camera module that allows the mounting and assembly of camera module components at the wafer level. 2 As of October 1, 2007, according to a survey by Toshiba. 3 Through-Chip Via, for cutting holes and running electrodes through the wafer. 4 Comparison with Toshibas conventional camera modules manufactured with the same sensor chip. 5 Surface-mount assembly process in which components are temporarily mounted on the pc board using solder paste, after which the board is passed through a temperature-controlled oven in order to solder the joint.

Lens holder

IR cut filter

Wire bonding Board Sensor die

(CSCM Technology)

Lens holder

Optical lens IR cut filter

Glass Through-Chip Via (TCV) Sensor die

Balls of solder

General Specifications

Part Number Module Size Total Pixel Count Cell Size Output Signaling Output Format Frame Rate Control Signal Part Number Module Size Total Pixel Count Cell Size Output Signaling Output Format Frame Rate Control Signal 648 (H) x 492 (V) (VGA) 2.2 m (H) x 2.2 m (V) YUVRAW 8-bit parallel 30 frames per second (VGA output) I2C bus TCM9200MD 6.31 mm (X) x 6.41 mm (Y) x 4.35 mm (H) 1, 648 (H) x 1, 216 (V) (UXGA) 2.2 m (H) x 2.2 m (V) YUVRGBRAW 8-bit parallel 15 frames per second (UXGA output) 30 frames per second (VGA output) I2C bus TCM9000MD 4.00 mm (X) x 4.00 mm (Y) x 2.27 mm (H)

For detailed information, contact your nearest Toshiba sales representative. The specifications of the products being developed are subject to change.

High-Performance Sound, Video and Image Processing Capabilities

Multimedia Engines Designed for Cellular Phone Applications

Toshiba has launched a new multimedia engine specifically designed for cellular phone applications. Designated as the T5GE, the new multimedia engine is a successor to the T5G and contains three hardware accelerators-a video codec, a 3D graphics accelerator and a JPEG codec-for faster execution of video or still image shooting, one-segment TV reception, 3D games and the like. The video codec supports H.264 and MPEG-4 (FWVGA) encodingdecoding. The powerful 3D graphics accelerator expands the possibilities for games and other applications of cellular phones. The JPEG codec supports the shooting of still images having up to 5 megapixels in order to satisfy a demand for a higher resolution it also offers fast processing that enables continuous shooting. Additionally, the T5GE incorporates an LCD controller that supports LCD display at resolutions up to FWVGA (864 x 480).

T5GE TC352980XBG

Features

Video codec H.264 codec: Supports FWVGA-size (864 x 480) encoding and decoding at a frame rate of 30 fps. MPEG-4 codec: Supports up to FWVGA-size (864 x 480) encoding and decoding at a frame rate of 30 fps. H.263 video codec, camera input (filtering, zoom-out and rotation) and video output (filtering, zoom-out, zoom-in and rotation). Audio codec AMR-compliant ITU-T G.726-compliant MP3 audio encodingdecoding WMA audio encodingdecoding PCM inputoutput MP4 demultiplexing bitstream inputoutput video phone (ITU-T H.223) MPEG2-TS (ITU-T H.222.0) 2D3D graphics JPEG codec JFIF-compliant and JPEG Baseline-compliant JPEG PART 2-compliant (ISOIEC 10918-2) YUV 4:4:4, YUV 4:2:2 and YUV 4:2:0 input formats LCD controller FWVGA resolution support for two LCD panels RGB and YUV output formats composition of up to four layers synchronous and asynchronous interfaces simultaneous display of FWVGA and TV frame storage Camera interface: Direct connections with two cameras YUV 4:2:2 camera input On-chip memories: Graphics eDRAM and mobile DDR SDRAM

General Specifications

Item Process Power Supply Package Dimensions 90 nm 1.2 V (core) 2.5 V (core) 1.8 to 3.0 V (IO) 11 mm x 11 mm (358 pins) Specification

TG2 TC35711XBG

Features

The integrated 3D graphics processor delivers 3D rendering performance of 100 mega-polygons (800 megapixels) a second. Contains three processors to realize graphics performance equivalent to tabletop game consoles: a high-performance 3D graphics processor, a MeP (Media Embedded Processor) suitable for multimedia processing and an ARM1176JZF-S CPU core designed specifically for mobile handsets. Compatible with programmable shaders, which bring realistic shading and reflectivity to mobile handsets. Incorporates an LCD controller that supports LCD display of WVGA size (480 x 800) and can display WVGA and TV through the video encoder independently and simultaneously. Integrates a 512-Mbit DDR memory in a stack-up configuration in an SiP package. Different types of external interfaces are available: SD card, serial IO, NAND flash memory, DDR memory controller and UART.

General Specifications

Item Process Functions Power Supply Package Dimensions 90 nm Specification

Peak performance of the graphics core

CPU 3D graphics LCD interface SD card interface serial IO UART DDR memory controller 1.2 V (core) 1.8 to 3.3 V (IO) 13 mm x 13 mm, 449-pin BGA

Toshiba MOBILETURBO Application Engine Road Map

Multimedia Engines Designed for Cellular Phone Applications

Specific Product Line

Over 30 times the graphics performance of the predecessor device

TG2 T6G

Programmable Shader 3D Graphics (Equivalent to Open GL-ES) H.264 720pEncDec 3D Graphics (Open GL-ES 2.0)

Recording and playback of high-quality VGA video at 30 fps

FWVGA H.264 EncDec 3D Graphics VGA MPEG4 EncDec 3D Graphics

T4G T4

QVGA MPEG4 EncDec 3D Graphics QVGAQCIF

High Performance Line

Reception of 1-segment broadcasting, audio playback, and low power consumption

QVGAVGA Low Power Audio 3D Graphics QVGA Low Power Audio Low Power Audio

Cost Performance Line

Key Technologies and Multimedia Performance

100-Hour Playback

Multimedia Engine

Music Audio Video Graphics Video Image Game GPS 3D Maps User Interfaces 1080p Low-Power Video

3D Games

Suitable for High-End Cellular Phones

Peripheral ICs

Toshiba offers peripheral ICs that provide flexible connections between the baseband or application processor in a cellular-phone system and various peripheral devices.

Display Camera

MDDI Display Buffer TC358720XBG TC358721XBG TC358722XBG TC358723XBG

MIPI Display Buffer TC358730XBG TC358731XBG

Bridge Hub Bridge

Baseband (Application) Processor

TV Output Buffer

Keyboard LED

IO Expander TC35890XBG TC35892XBG TC35893XBG TC35894XBG

Examples of Display Buffer Solutions

High-Speed Serial (MDDI)

LCD Controller RAM VGAFWVGA

Parallel (1824-bit RGB)

Driver

Display Up to FWVGA 24-bit RGB

Connect parallel-based display modules by using new high-speed serial interface.

Parallel Interface MIPI (DBI-B, DPI, DBI-C)

LCD Controller RAM VGA

High-Speed Serial

Driver

Display VGA 24-bit RGB

Reuse old BB platform and connect to VGA display with wide color depth.

High-Speed Serial (MIPI DSI)

LCD Controller RAM VGA

Parallel (1824-bit RGB)

Driver

Display VGA 24-bit RGB

Connect parallel-based display modules by using new high-speed serial interface.

IO Expander Example

Vibrator LED PWM Keyboard GPIO

I C (2-wire) Interrupt

IO Expander

The IO Expander allows various IO functions such as keypads, LED controls and timers to be added to the existing cellular-phone designs. This enables cellular phone manufacturers to quickly launch spin-off models and other variations.

Cellular phones, both clamshell and sliding styles, will continue to evolve with a variety of user interfaces. To address their mechanical and electrical challenges, Toshiba offers a family of highly integrated peripheral ICs: the TC358720XBG and TC358721XBG MDDI-based VEGAMagiq display buffers the TC358730XBG and TC358731XBG MIPI-based display buffers and the TC35890XBG, TC35892XBG, TC35893XBG and TC35894XBG IO Expanders. The IO Expander allows typical baseband or application processor packages to be kept at a minimum pin count by enabling IO pin expansion at the location where needed. Display buffers support not only high-speed serial interfaces for image data transmission but also traditional interfaces for peripheral device control. MDDI Display Buffer: VEGAMagiq TC358720XBG, TC358721XBG Features

MDDI Client interface with data rates of up to 400 Mbps Support for a VGA-sized primary LCD panel and a QCIF+-sized

MIPI Display Buffer TC358730XBG Features

Support for two interfaces: MIPI DBI Type B and MIPI DPI High-speed serial output interface (T-HSSI: Toshiba High-Speed

secondary LCD panel Traditional peripheral interfaces: I2C, SPI, GPIO and PWM Input clock frequency range between 32.768 kHz and 20 MHz LCD video transfer rate: VGA at 60 fps

Serial Interface)

Full frame buffering of VGA resolution PWM for backlight control Input clock frequency range between 32.768 kHz and 19.2 MHz

General Specifications

Item Process Power Supply Package Dimensions 130 nm 1.5 V (core) 2.6 V (eDRAM) 1.8 to 3.3 V (IO) 1.5 V 1.8 V (MDDI IO) 6 mm x 6 mm (81 pins) Specification

General Specifications

Item Process Power Supply Package Dimensions 90 nm 1.8 V (core) 1.8 V (IO) 2.5 V (eDRAM) 5 mm x 5 mm (64 pins) Specification

MDDI Display Buffer: VEGAMagiq-W TC358722XBG, TC358723XBG Features

MDDI Client interface with data rates of up to 400-Mbps Support for a FWVGA-sized primary LCD panel and

MIPI Display Buffer TC358731XBG Features

Baseband processor interfaces: MIPI DBI Type B, MIPI DPI

and MIPI DBI Type C

High-speed serial input interface (MIPI DSI) Full frame buffering of VGA resolution PWM for peripheral device control Input clock frequency range between 32.768 kHz and 19.2 MHz

a QCIF+-sized secondary LCD panel Traditional peripheral interfaces: I2C, SPI, GPIO and PWM

Input clock frequency range between 32.768 kHz and 20 MHz

LCD video transfer rate: FWVGA at 60 fps

General Specifications

Item Process Power Supply Package Dimensions 130 nm 1.5 V (core) 2.6 V (eDRAM) 1.8 to 3.3 V (IO) 1.5 V 1.8 V (MDDI IO) 6 mm x 6 mm (100 pins) Specification

General Specifications

Item Process Power Supply Package Dimensions 90 nm 1.8 V (core) 1.8 V (IO) 2.5 V (other) 5 mm x 5 mm (64 pins) Specification

IO Expander TC35890XBG, TC35892BG, TC35893XBG, TC35894XBG Features

Low-power operation I2C interface 2 x 2 to 8 x 12 keypad PWM timers general-purpose IO pins (GPIO) Up to 24 general-purpose IO pins

General Specifications

Item Features Power Supply Package Dimensions Package

TC35890XBG

Up to 24 GPIO pins crystal oscillation support for dual power supplies 1.7 to 3.6 V 5 mm x 5 mm (36 pins)

TC35892XBG

Up to 24 GPIO pins on-chip RC oscillation crystal oscillation 1.62 to 2.7 V 3.5 mm x 3.5 mm (36 pins)

TC35893XBG

Up to 20 GPIO pins on-chip RC oscillation 1.62 to 2.7 V 3.0 mm x 3.0 mm (25 pins)

TC35894XBG

Up to 24 GPIO pins on-chip RC oscillation crystal oscillation 1.62 to 2.7 V 3.5 mm x 3.5 mm (36 pins)

Wide Variety of Memories from Embedded Memories to Memory Cards

Mobile Memories

Well-proven NAND flash Invented by Toshiba, NAND flash has gained popularity in the cellular phone market. Toshiba manufactures all of its NAND flash products in Japan, which are renowned for their quality and reliability. Available in space-saving configurations like MCP packages and microSD cards Several memory chips are stacked up vertically in MCP packages to get the maximum space-saving advantage possible. Also, ultra-small microSD cards are designed specifically for cellular phones to allow size reduction. These flash memory products contribute to enabling form-factor miniaturization and feature-rich cellular phones. Wide variety of memory solutions Embedded memories in MCP packages and microSD cards, especially multi-level cell (MLC) NAND flash products, provide total memory solutions for cellular phone applications.

SDRAM PSRAM

(XIP, Code Shadowing)

NOR SLC NAND MLC NAND Flash with MMC Interface Flash with SD Interface GB-NAND Flash with NAND Interface mobileLBA-NAND

Memory Cards Embedded Memories

NAND Flash

microSD

eMMCTM-compliant. eMMC is a trademark of MultiMediaCard Association (MMCA). GB-NAND is a trademark of Toshiba Corporation.

XIP (eXecute-In-Place): A method of executing programs directly from NOR flash memory. Primarily used in GPRS cellular phones in China and Europe. Code shadowing: A method of copying program code at boot-up from the SLC NAND flash to synchronous dynamic RAM (SDRAM) to run applications. Widely used in high-end cellular phones in Japan and South Korea.

NAND Flash Memory

To meet the rapidly growing demand for high-capacity storage, Toshiba offers the industrys largest 16-Gbit and 32-Gbit NAND flash memories fabricated with the advanced 43-nm process technology. Features

Advanced 43-nm process and multi-level cell technologies have enabled the product to have a capacity of 16 and 32 Gbits in the same

package size as before.

The new NAND flash memory provides faster write performance by increasing the page size and optimizing the memory cell control system. Stacked-die packaging technologies allow large-capacity memory cards.

Roadmap for NAND Flash Memory Chips and Cards

NAND Flash Memory

SD Memory Card

microSD Memory Card

USB Memory

Memory: Multi-Chip Packages

More and more features are being added to mobile devices like cellular phones, such as the storing and playback of still pictures, videos and music, and game playing capabilities. This is driving the need for processing large amounts of data at high speeds. On the other hand, multi-chip packages (MCPs) are becoming increasingly popular for die stacking to save board space. Features

Various types of memory can be combined in a single package. Up to nine layers can be stacked up (including inter-die spacers) in a package with a thickness of 1.4 mm. Up to five layers can be stacked up in a package with a thickness of 1.0 mm. Samples of high-density mobileLBA NAND flash memories are now available. The new mobileLBA NAND flash memories reduce the workload of a host controller. Manufacturers can, on the same chip, define an SLC area best suited for high-speed reads and writes, separately from an MLC area optimized for storage of a large amount of data. The 2-Gbit, 4-Gbit and 8-Gbit versions allow their full capacity to be allocated as SLC, while the 16-Gbit and 32-Gbit versions can support up to 8 Gbits of SLC.

NAND type flash electrically erasable read only memory that is suited for large file storage like image or music data. NOR type flash electrically erasable read only memory that is suited for program code storage. Random access memory that uses DRAM memory cells but doesnt require external refresh control. DRAM: Low-power-consumption dynamic random access memory suited for mobile phones.

Pseudo SRAM Low-Power Synchronous DRAM Controller

Component that controls the behavior of NAND flash.

Stacking up a greater number of larger-capacity memories in a thinner package by using state-of-the-art assembly technology

Toshiba MCP Roadmap

mobileLBA MCP

10 x 13.5 1.2 1.4 0.8 mm pitch 11 x 14 1.2 1.4 0.65 mm pitch POP

GB-MCP(MCP + GB-NAND)

12 x 18 1.2 1.4 0.8 mm pitch 512LPSD + 1GN + 1GB 64PS + 128NOR + 1GB 11 x 14 1.2 1.4 0.65 mm pitch

POP(package on package)

Memory size Integration

12 x 12 0.5 mm pitch

0.65 mm pitch

SDRAM + NAND

10 x 13.5 1.2 1.4 512LPSD + 1GN

x32 SDRAM + NAND

11 x 14 1.2 1.4

ADQ Mux deMux Burst 3 StMCP

9 x 12 1.2 1.4 0.65 mm pitch 3-x16 Data Bus Line

0.65 mm pitch 3-x16 Data Bus Line

512LPSD + 1GN 128PS + 256NOR + 1GN

64PS + 256NOR + 1GN

3 StMCP PSRAM + NOR + NAND

9 x 12 1.4 1.6 32PS + 128NOR + 1GN 32PS + 128NOR + 512N

2 StMCP PSRAM + NOR

9 x 12 1.4 0.8 mm pitch

Size: mm M: Mega bit, G: Giga-bit, GB: Giga-byte NAND Flash N: NAND Flash, NOR: NOR Flash, PS: Pseudo SRAM LPSD: Low Power Synchronous DRAM The above combinations are examples.

NAND Flash Storage

SD Memory Card Family

Multipurpose SD Memory Cards also provide high-level copyright protection.

SD Memory Cards

Ultra high-speed

SD Memory Cards

High-speed

SDHC Memory Cards use the FAT32 filesystem to address large memory space.

SDHC Memory Cards

Ultra high-speed

SDHC Memory Cards

High-speed

microSD Memory Cards are the smallest SD Memory Cards.

As digital devices become more sophisticated, they need more data storage capacity.

microSD Memory Cards

High-speed

microSDHC Memory Cards

High-speed

SD Speed Class

The SD Speed Class indicates the minimum readwrite data transfer rate for the SD Memory Card based on the SD Card Association standards. The minimum data transfer rate of Class 2, Class 4 and Class 6 cards is 2 MBs, 4 MBs and 6 MBs respectively.

USB Flash Memory

Just plug it into a USB port and it is automatically recognized. Whether moving data around the office or sharing photos with a friend, this compact, highly portable USB Flash Memory is your data link.

U2K Series (standard models) U2G Series (high-capacity model)

Solid State Drive (SSD)

High-speed, high capacity Serial ATA interface Product offerings: Module, 1.8-inch, 2.5-inch types Capacity: 32 GB, 64 GB, 128 GB

Module type

1.8-inch type

Reduces the Size of and Expands the Overseas Roaming Service Areas of Cellular Phones

Single-Chip Transceiver IC for Triple-Band W-CDMA

The market of W-CDMA cellular phones has been rapidly expanding, promoting a movement for greater versatility and use of a wider frequency band. This trend also demands more highly-integrated, smaller RF-LSI chips. The new RF-LSI chip, TB31345WLG, combines the two previous chips, the TB31341FTG low noise amplifier (LNA) and the TB31342XLG transceiver (TRX). Additionally, the TB31345WLG is housed in the industrys smallest-class wafer-level chip size package (WCSP). The TB31345WLG covers the BAND V (800-MHz) area in addition to the BAND I (2-GHz) area for roaming services. The receivers built-in lowpass filter (LPF) provides excellent characteristics for reducing the GSM and CDMA2000 interference noise. The SiGe BiCMOS technology enables the TB31345WLG to operate with low power consumption and low error vector magnitude (EVM), thus providing long standby and talk times.

TB31341FTG

TB31342XLG

Single-Chip Integration

Top View

Bottom View

TB31345WLG

Features

: WCSP: Wafer-Level Chip Size Package

RF-LSI Block Diagram

TB31345WLG

800 MHz PA BPF 2 GHz ANT DPX SW DPX DPX 1.7 GHz QDEM LNA 2 GHz LNA 800 MHz LNA BPF BPF BPF 1.7 GHz PA BPF VCO Loop F F-PLL PA BPF DrAMP VCO Analog Baseband IC Loop F DrAMP F-PLL DrAMP QMOD LPF LPF

LPFVGA

QDEM SBI

TB31341FTG

TB31342XLG

ISDB-T 1-Segment OFDM Demodulation IC for Mobile Receivers

Digital TV Receiver IC

Designated the ETC90521 in bare-die form and JBTC90521 in solder-bumped form, an OFDM demodulation IC is available in production quantities, which is specifically designed for the ISDB-T 1-segment of Japanese digital TV broadcasting for mobile receivers. Features

receive terrestrial digital broadcasting and ISDB-T 1-segment broadcasting. using the 90-nm technology and offered in package-less forms (bare-die or solder-bumped) to minimize system size. Contains all hardware necessary for OFDM demodulation such as memory and an AD converter, eliminating the need for external components. The self-contained ETC90521JBTC90521 can run on its own (except for initialization, channel selection, etc.), reducing the workload of the host CPU. Provides improved mobile reception performance and channel switching times than the predecessor, TC90501FLG.

Fabricated

The successor to this IC is now being developed: TC90541 (single chip RF-CMOS 1-segment receiver tuner).

Offers High Brightness with Low Current Drive

Compact SMD Type LED Lamps

Features

dimensions: 1.6 (L) x 0.8 (W) x 0.45 (H) mm (Including lead length) LED chip structure achieving high-brightness and low-current drive (TLxV1022 Series). Can be used as a replacement for the predecessor high-brightness LED (TLxV1022 Series). ROHS compatible

New Package

TLV1022

Package Dimensions

Unit: mm

LED Chip (cathode side)

Product Offerings

Min Typ.

Available Bins

TLRV1022(T14, F)(T15, F) TLRMV1022(T14, F)(T15, F) TLSV1022(T14, F)(T15, F) TLV Series (InGaA P) TLOV1022(T14, F)(T15, F) TLAV1022(T14, F)(T15, F) TLYV1022(T14, F)(T15, F) TLGV1022(T14, F)(T15, F) TLPGV1022(T14, F)(T15, F)

Red Red Red Orange

Amber

Yellow Green Pure green

: Sealed in a moisture-proof bag. : For the available luminous intensity bins and further details, contact your nearest Toshiba sales representative.

Drives White LEDs for LCD Backlight at High Efficiency

White LED Drivers

The family of white LED drivers features high brightness with low power consumption, helping to reduce product size. It is ideal for LCD backlight and secondary camera flash applications. Both switching and charge-pump DCDC converters are available.

Features

Small