[Samsung Galaxy Tab S8] JohnTheFarm3r:
This might not be useful for many, but if anyone wondered why their TAB performs "bad" under heavy usage (gaming, benchmarks, etc...)

S8 series (all of them) have almost next to none existent "cooling" solution. Here is the S8 Ultra for example:

View attachment 5738327

View attachment 5738329

View attachment 5738331

View attachment 5738333

As you can see on these photos (my own S8 Ultra), this is what Samsung is doing in their Flagship devices, this is their ultimate "cooling solution".

Anyone who understands a bit more about how cooling SHOULD be done, heat transfer/dissipation, thermal paste, copper vs aluminum, etc... won't need much of an explanation, these photos will be enough for them. lol

This is my OWN S8 Ultra which I opened after I got tired from the heavy thermal throttling. Keep in mind that NOTHING will save you from thermal throttling, not a custom ROM, not a custom KERNEL, nothing, this is not a software (code) issue, this is simply a SOC that consumes up to 20W and Samsung decided to troll us by implementing actually nothing but garbage "cooling" inside and obviously added GOS to limit the s*** out of the SOC to prevent from heating too much.

SD8 Gen 1 is a very power-hungry and inefficient SOC made by Qualcomm (one of the worse), and even phones which actually have copper heat pipes or vapor chambers (copper) still struggle with this SOC, now imagine what is happening to the S8 lineup with this kind of "cooling solution" and why is the TAB thermal throttling so heavily.

And here is my "simple" thermal MOD I did and the results after the mod (partially, I don't have all the screenshots/photos anymore).

View attachment 5738335

View attachment 5738349

View attachment 5738339

If you're wondering what I did...Well, here are a few things:

Removed the Aluminium foil which was on the CHIP (SOC) itself, replacing it with a 0.2mm copper shim, and instead of using a thermal paste between the copper shim and CHIP, I added a thermal pad.

On the TAB frame itself, I removed the 0.01$ worth of "premium" thermal pad added by Samsung to our "flagship" "QUALITY" device, added a "longer" copper plate (0.2mm), pushed it under that plastic frame which is on the aluminum frame attached (holds the screws from the cover over the logic board) and added a thermal paste between the TAB frame and that copper plate since thermal pad was too thick and I didn't have much space to play with since I wouldn't be able to attach the logic board properly and the screen panel wouldn't be able to "fit" "flat" on top (it would be probably pushed, and potentially damaged by the logic board apply pressure on it).

I added the long copper plate there and used thermal paste between the frame for ONE and a very GOOD reason. The frame of the tab is FULL aluminum, basically, the WHOLE frame, and the copper plate through the thermal paste will transfer the heat to the frame of the tab, increasing the chance of better heat dissipation through the frame itself vs the stock mode was barely covering by those 2 small thermal pads concentrating the heat on a small area.

Now the heat on the back of the TAB is actually spreading over a MUCH larger (basically half of the back frame) area and this obviously results in far better heat dissipation and increases the cooling CAPACITY.

Between this copper plate and the actual SOC with the copper plate, I used again a thermal pad.

Wonder about the results? Sure. (I don't have all the screenshots or photos, but you can compare your results with mine, that will tell you "enough").

View attachment 5738341

View attachment 5738343

View attachment 5738345

View attachment 5738347

If you have any further questions, feel free to ask. Happy to help in any way possible.

(Ermm, removing the display was not a happy experience, FYI, it was difficult and the panel is VERY THIN, PROCEED WITH CAUTION, assuming that you have the necessary equipment/tools and experience)

Have fun modding. (Not my first thermal mod though). :)