[Galaxy Note 4 Q&A, Help & Troubleshooting] MateusElias:
While playing some games I noticed my phone(N910H/Exynos) has a very hard time keeping framerates once it heats up, I downloaded 3D mark and a frequency/temp monitor app and discovered that during Physics test my phone throttles at 92°C and keeps frequency at 1500MHz(simply can't sustain the 1900 supposed max) to prevent burning, how can the CPU reach 90° while my hands are barely any hot?. Then I watched some disassembly videos and turns out theres no thermal pad/paste between the CPU and "heatsink"(these older phones don't really cared for cooling,it sinks heat to the frame).I re-did the benchmark while applying slight pressure over the CPU area and my physics score went from 1500 to 1600, still reaching 90°C but taking a little bit more time to do so, so it kept 1900MHz for longer.

So I though about doing the experiment of applying thermal paste over the CPU, but i'm scared I may brake the phone on the disassembly, so I'd like to ask if someone is willing to do the test to see if it's worth it. Maybe we can unlock gaming potential we didn't know was there, thank you guys.

[Update] So I did the test

TL;DR: There's already a thermal pad there, so it's not like the results are shocking, it does make a difference but it's not worth disassembling your phone just for it.

BUT there's an additional experiment I'm gonna make sooo things could change.

WARNING: if you're thinking of disassembling your phone for any reason be warned that the spen digitizer connector is a little bit hard to connect so it happens pretty often that it won't work, so test the spen before reassembling everything.

Long version:

Anan did not publish the OC kernel yet but I was too curious and did the thing anyway, you don't need to remove the screen from the mainframe so the procedure is not really that risky.

Turns out that pinky thing I saw on the images are thermal pads (as anyone not stupid as me would already know), not copper as I originally thought, anyway since thermal pads are worse than thermal paste(even the 2w/mk ****ty one I used) I did replace it, I had to use a generous amount to make contact, after all it's replacing a thermal pad(0,5mm i think).

Overall CPU temps got like 5-10°C lower, but the benchmark results are pretty boring since they don't thermal throttle the CPU much, geekbench got 100-200 average more on multi core (no difference on single core) and antutu went from 99251 to 103408 ,CPU multi-score went from 26136 to 27971. The stress test basically achieves the same temps, only taking a few seconds more to throttle.

However,gaming performance did get a considerable boost,since they offer a constant heat output. Minecraft( yes it thermal throttles the cpu a lot) almost doesn't see throttles anymore granting a SIGNIFCANT better performance, Free fire also does perform better but stupid me did not pay attention to temps before the mod.

Heat on the phone also feels WAY less concentrated on the CPU area.

Now if you know a little bit about this stuff you know that thermal pads are usually used when the heat source is not touching the heatsink, which is the case here. I am 100% sure the results would not be this boring if the CPU actually touched the midframe, so I'm going to do another test sometime putting a 0,5 mm copper pad(401 W/mK vs the 2 from my thermal paste) to see the actual result I was expecting.

I know all this sound pretty stupid and pointless but I'm going to use this phone for another year or two so I want to make the most of it, also I really like this stuff.

If you want to know WTF is even going on you can watch this video/read the article: https://www.gamersnexus.net/guides/2137-thermalpaste-types-conductivity-and-more