[Galaxy Note 10.1 (2014 Edition) Q&A, Help & Troubl] partial_engineer:
Hallo there :)

Well I just did the job. I have also made a short manual and would like to share it with you. But first some things about me and my tablet.

I bought a used galaxy note 10.1 2014 edition SM-P600 couple months ago. I was really disappointed about the device performance. Switching from stock android 5.1 to [ROM][7.1.2]Resurrection Remix N for SM-P600 (n1awifi) [5.8.5][UNOFFICIAL][NIGHTLY] did some improvements in performance. But since I am a very heavy web surfer I was still not satisfied with the performance. I have also tried [P600][Touchwiz] Marshmallow Rom 20170622 and went back to RR because I can play around with the CPU governors and all that deathy audiutor stuff. Between very nice work Exynos Team and all the other developers...

Soon I realized that the SM-P600 becomes fairly hot in the backside. I took a look at the ifixit pictures. There was no other way finding good resolution pictures of the inside.

I ended up installing cool tool app. Well is there any other good app for monitoring temps, clock and load in overly?

Well so I added frequency, load, battery temp and cpu temp. You need to add cpu temp manually. I guess it is Label ->

custom label -> enable- Then you have to go fine tuning -> custom label -> path:/sys/class/thermal/thermal_zone0/temp. leace everything as it is. regex is (\d+)\d{3} and add postfix °C and prefix cpu:

.

So I went along and analysed heat and temps in the galaxy 10.1 2014 edition. Especially frequency-temp-ratio. And I can tell you this buddy is everything else than cool. Temps jump up so fast I can't tell you. Even some fast scrolling on ebay, facebook desktop web page in browser treated the Temperature to the hight 80s and soon the high 90s. I have also seen the things franzli mentioned before. Even light work put so much heat to the processor. Watching the frequency and temperature bounce was a pain. I could feel the pain that little Exynos 5420 must suffer of all the time.Throttling is the only ways this little buddy can survive :rolleyes: To make it short I decided to do the cooling mod...

So lets see what I found on my journey :cowboy: ... I can tell you that's a big surprise

I opened the case very easily. You can find tons of videos on youtube or use ifixit.

Well I have to mention I am an electronics hardware engineer. So doing this stuff is nothing unique for me. And I have years of professional PCB manufacturing, repair experience.

Opening the case, adding some tape and this is what you get...

[IMG="opened_shielding_case"]https://image.ibb.co/cNYWim/first.png[/IMG]

[IMG="flux_remains"]https://image.ibb.co/cDnz3m/second.png[/IMG]

As you can see there is a little thermal pad applied to the aluminium shielding. And boooom there you are :(. Do you see all thet flux solder remains? How come samsung? Seriously? :confused:

[IMG="shielding_close_up"]https://image.ibb.co/dTNhOm/three_kapton.png[/IMG]

This is the shielding close up with that thermal pad.

As you can see the FBGA package is covered with flux from soldering. So it is naturally, that the cooling in the galaxy is a pain. There can't bee any good heat flow.

So let's check that thermal pad.

[IMG="thermal_pad_size"]https://image.ibb.co/icda9R/four_thermal_pad_1.png[/IMG]

woops :eek: that little buddy is kinda to small. I am sad to see this.

Well I cleaned the surface as good as I can with ethanol. After this I applied a new Thermal pad.

After that it looked like this.

[IMG="new_thermal"]https://image.ibb.co/goSwG6/five_thermal_pad_2.png[/IMG]

Then I closed the shielding case and cleaned it.

[IMG="closed_shielding"]https://image.ibb.co/emF0b6/six_shielding_closed.png[/IMG]

So next comes the actual cooling mod. I added a big thermal pad.

[IMG="second_thermal"]https://image.ibb.co/hqW1im/seven_sec_thermal_pad.png[/IMG]

I had to cut that little hook in the back plate. So that the 100mmx100mm copper layer will fit in shape.

[IMG="back_plate_cut"]https://image.ibb.co/bEQKKR/eight_back_case_cut.png[/IMG]

And this is it done.

[IMG="finish"]https://image.ibb.co/nyeJDm/finish_copper_layer.png[/IMG]

So what about the results :laugh:

The back plate fits perfectly. If you know there is a thin layer of copper you can feel it. But it is so less. I had no problem closing the case. Ahh yeah I had to tage it with double sided tape, so it is pressed down to the thermal. The back plate will do the rest pressure.

And really don't worry about the wifi interference. There is no worry. Because the copper layer is located on top of the bettery pack and shielding case. Why should there be any interference? I have tried. Reaching same wifi performance as always. No worries:good:

So what about heating. Well my galaxy note stays pretty cool:cool:.

I need to mention this is all mesured with the [ROM][7.1.2]Resurrection Remix N for SM-P600 (n1awifi) [5.8.5][UNOFFICIAL][NIGHTLY] I mentioned before.

I used interactive governor.

I reach in Antutu v6.2.7 about 57000 to 58000

In futuremark work 2.0 I get 4000

Here some pics

[IMG="antutu"]https://image.ibb.co/kFX8eR/Screenshot_20180128_201255.png[/IMG]

[IMG="work2.0"]https://image.ibb.co/h8G1zR/Screenshot_20180128_202632.png[/IMG]

I am sorry for that high resolution pics. But I wanted best of (bad) quality. I used my redmi note 4 for taking pictures. If you can't read all in the pics, just open in new window.

There isn't any more throttling at all. It is hard to push to 85°C or above now. Just with synthetic GPU and CPU load on all four cores at once. And it takes a couple of minutes. But in real world you will never get it. With only load on one core my maximum is 69 to 72°C. The tablet fells pretty nice now. The warming in the back plate is reduced to a very large surface. So sometimes it fells as if your hands warm up the case.

Can you suggest me any ROm with a good overclocking potential? I have already tried this ROM. I really don't know why, but it keeps crashing all the time at 2GHz or 2.1 GHz. Even with no load at all. I guess the used kernel is bad.

Do you have any ROM suggestion for me.

If you have any quastions and things you want me to test write me.

Just wanted to share my experience with you. I didn't expect a dirty PCB, BGA and thermal pad like this. So what do you think about this.