yashsingh1/xdaforums huggingface dataset:
[Galaxy S III Q&A, Help & Troubleshooting] LiquidXS:
I think you can use a paperclip to make a contact with the button.
[Galaxy S III Q&A, Help & Troubleshooting] diegarum:
same situation here

My case is a second hand S3 GT-i9300 (my guess it s the international one). Vol up and down not working , flashin like an ace dumb... first bootloop and now i cant do sh@t. Just tryed with adb and fastboot... same message than you... next will be update drivers for "adb usb driver"

from inside the phones OS i was able to enter download mode by installing "Terminal Emulator" ( from jack Palevich) and typing reboot download

If the driver thang doesnt do the magic i ll sale my soul for some S3 mainboard schematics.
[Galaxy S III Q&A, Help & Troubleshooting] shivadow:
genius! Didnt think of that..

I wish I stole my HTC M9.
[Galaxy S III Q&A, Help & Troubleshooting] Oxizee:
Hmm i have this for my tablet, nice tip.
[G3 Q&A, Help & Troubleshooting] Blurr26:
Does anyone know of any non-stock ROMs that support BLE? So far my search hasn't found any except for some people having trouble connecting BLE devices. Would really like to find a ROM that supports it. Either way, since using custom ROMs I don't see myself going back to stock, but, then again...

Thank you for any help you can provide. :)
[G4 Q&A, Help & Troubleshooting] Almighty1:
I recall reading on forums that someone did a LG G4 Thermal Compound mod, did it help with the temperatures? Does anyone have a link to the youtube video for it? This is the only thing I can find when searching:

http://imgur.com/a/P5BtT
[G4 Q&A, Help & Troubleshooting] smknutson:
Interesting. Looks pretty straight forward, though I wonder about the difference in thickness between thermal tape and grease, I think it would be pretty easy to do. Although, you'd have to replace the thermal pad if the grease wasn't as effective
[G4 Q&A, Help & Troubleshooting] Knowbody42:
The Snapdragon CPU is underneath the tape they put on. It doesn't conduct heat very well.

I bought some Alphacool Eisschicht 0.5mm 14W/mK thermal pads, and cut out a square for the CPU. It seems to have significantly reduced the amount of heat I can feel when doing demanding things.

I think it's also responsible for an increased score in Antutu, due to less throttling (I just got a score of 50834, up from around 46-47k)
[G4 Q&A, Help & Troubleshooting] nitrous²:
Is this a joke? How is putting thermal paste onto EM-Shielding going to help dissipate heat?! If anything, it'll isolate and therefore the phone won't "feel" that warm anymore but may infact operate warmer than ususal due to it. Thermal compounds are meant to be used to "conduct" heat to a heatsink by,

and this is important

, filling out irregularities on the heat source's and heatsink's surface. Without it, the irregularities are filled with air and we all know air is not goog at conducting kinetic energy. Thermal compound has no cooling properties!

That's what I usually get. A difference of a couple thousand points has little to no significance.
[G4 Q&A, Help & Troubleshooting] darioampuy:
a heatsink is a piece of heat conductive element that has a bigger surface compared to the object it want to dissipate heat from. the EM shield has that bigger surface compared to the processor so it's a candidate for heatsink. the thermal compound is used to transfer the heat from the processor to the heatsink. in the theory the mod is solid.
[G4 Q&A, Help & Troubleshooting] donkanmcklaus:
here's the video

https://www.youtube.com/watch?v=QijWruGXqX8
[G4 Q&A, Help & Troubleshooting] nitrous²:
Of course, not denying that. Apart from what a heatsink is, you have to know how a heatsink works.

Let's just forget for a second that EM-Shields are not meant to be used as heatsinks. How is putting thermal paste ontop of the EM-Shielding logical in any way? Heat from the IC's on the logic board will dissipate heat to the EM-Shielding. It's going to help a little with cooling, but not significantly. What you do now is, you isolate the EM-Shielding with Thermal compound causing heat to build up even more underneath it. Since you isolated so good, you won't feel the phone heating up so much in your hand. Have you ever built a pc? I do that for a living. It's like putting thermal compound ontop of your heatsink instead of in between CPU and Heatsink. Please look at this majestic MS Paint graphic I just made. I hope it helps to understand how thermal compound works, and is meant to be used. I may not be a professional and I'm asking to be corrected! Seriously. But I'm also positive that OP's method is not how you work with thermal compound.
[G4 Q&A, Help & Troubleshooting] darioampuy:
KUDOS for the awersome paint skills :P

i think lg already applied thermal compound between the processor and the em-shield (because it's logic that they transfer the heat to the em-shield instead of pocketing it inside it) so the aditional thermal compound outside the em-shield is to help transfer it to a even larger surface
[G4 Q&A, Help & Troubleshooting] KingFatty:
What is the even larger surface outside the shield?

If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.

If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.

The heat doesn't just disappear, it has to go somewhere.
[G4 Q&A, Help & Troubleshooting] nitrous²:
Exactly! Listen to this guy OP! You can't just break Thermodynamics...
[G4 Q&A, Help & Troubleshooting] Knowbody42:
It has some kind of sticker which goes over the CPU (there's a square cutout in the EM shield where the CPU is), which I guess is supposed to transfer heat, but it doesn't do a particularly good job of it.

It doesn't dissapear, it dissipates/radiates.

That's what a heatsink does; it provides a larger surface area to increase the amount of dissipation/radiation that happens, rather than remaining where it is and accumulating.

If the heat stays where it is, it'll feel warmer within a smaller, localised area. Specifically, at the top back of the phone, where the CPU is - you'll get a larger amount of heat radiated per cm² (hence it will feel hotter), but a smaller amount of heat radiated in total due to the smaller amount of area the heat can be radiated from..

If you're saying that it doesn't prove it made a difference in cooling, I did run the benchmark multiple times, before and after.
[G4 Q&A, Help & Troubleshooting] KingFatty:
Based on reviewing the pictures and video, it looks like this mod will improve the heat transfer from the chips to the frame, allowing the chips to run cooler.

The images appear to miss out on putting thermal compound right over where (I think) the main CPU is. At least, if you watch the video, the guy in the video says something in a language I can't understand, and rubs his finger right around the central part and says "blah blah blah CPU" while rubbing that area (at timestamp 4:31) which makes me think that's where the CPU is located. No idea why the person adding the compound fails to put the compound right there, in the 5th spot?

You can see here, the thermal compound goes at least in the four general areas shown, interfacing between the frame and the shields. But notice the image does not put thermal paste in the fifth central location (unlike the video):

So the extra fifth area, that looks like dark tape in the image here, doesn't get any compound, unlike the video:

But compare that to the technique in the video, showing all 5 areas getting compound (this link positions the video to the 5:34 mark where you can really see all 5 spots you put the compound):

[YOUTUBE]https://youtu.be/QijWruGXqX8?t=334[/YOUTUBE]

Edit: hmm not sure this website understands links with the timestamp within the url, if you use the Youtube insertion button. Here it is using the generic URL insertion:

https://youtu.be/QijWruGXqX8?t=290

See how the very first spot he puts the thermal compound is exactly where it's missing from in the Imgur album.

In the video, I think he is putting the compound on top of the tape, without removing the tape? Is that thermal tape? This might actually work better if so, because if there is tape, and you pull it off to substitute with thermal compound alone, then you won't get enough compression to make a good thermal contact. Ideally you could shim it with a copper shim and put thermal compound, but the tape+compound may be the next best thing (better than compound alone).

---------- Post added at 05:47 PM ---------- Previous post was at 05:36 PM ----------

In your scenario, what is acting as the heatsink that provides larger surface area?

In my scenario, the frame is the heatsink. Currently, there are inefficiencies preventing heat from transferring into the frame/heatsink. That prevents the frame/heatsink from receiving as much heat as it could under better conditions, so the frame remains cooler. By adding thermal compound, you allow better heat transfer from the chips to the frame, so the frame gets warmer. I guess because the frame is at the inner portion of the phone, away from the front or back, it would be harder to feel the heat from the frame. Because the chips run cooler, you won't feel that localized heat at the CPU as much, and the heat would be spread out throughout the inside of the phone, along a taller area. But then again, it could be moot and the phone may feel just as hot, if the chips remain at max temp due to throttling, just that the phone could perform better with the thermal compound because you could push the chips harder before it throttles.
[G4 Q&A, Help & Troubleshooting] Knowbody42:
It's using the metal frame.

I took all the the tape off, then used this in place of them:

https://www.pccasegear.com/products/32433

Unlike thermal paste, thermal pads will make up the thickness needed. That's what they're designed for.
[G4 Q&A, Help & Troubleshooting] smknutson:
Take the tape off, check cpu temp.

Put thermal paste on, check CPU temp.

Is there a difference?
[G4 Q&A, Help & Troubleshooting] Almighty1:
Thanks for the youtube link to the video as I tried using LG G4 Thermal Mod and the only thing I found was for the G3. The video is in the Chinese Cantonese language. What he was saying is the CPU area needs a little dot only where the black tape is but the other areas, he doesn't really know what it's for but it wouldn't hurt to put some there. He mentions that there is a known Taiwanese video with someone using a shim instead which is better than his method. My question is if he only puts a dot in one area, wouldn't that mean that the other area where the tape is would not all make contact with the CPU. Besides, is that even the CPU because according to this in step 7, the CPU is actually below the memory:

https://www.ifixit.com/Teardown/LG+G4+Teardown/42705

The only thing with taking off the tape is it will oid the memory while if you applied the paste with the tape still there, you can basically reverse it should you need warranty on the device.
[G4 Q&A, Help & Troubleshooting] nitrous²:
This has been done on so many devices, the first I can recall being the Nexus 4 around release time, and always turned out to be placebo at best. Unless you can provide solid evidence, with before and after data, I'm calling BS. My reasoning, among other things, goes like this:

While designing the hardware architecture of a Smartphone, a big team of hardware engineers gather and create a project. These guys have studied and worked their whole life with this. If they think there was no need for thermal compound, then I'd rather not use it.

Just look at this guy. You think you know more than him? :laugh: :laugh: ....

EDIT: I just realized, my post sounds kinda *****y and offensive. That's NOT my intention! I mean it.
[G4 Q&A, Help & Troubleshooting] Knowbody42:
You know manufacturers often leave things out to save on cost, right?

Like using cheap Chinese capacitors instead of more expensive, high quality ones that are less likely to die.

The manufacturer decides it's not worth paying more for the more optimal solution, because they figure the number of devices that die won't be that much more than the extra units sold if they have a cheaper product than their competitors.

I think that's the reason they didn't use good thermal paste or thermal pads here. Because it would cost more to add them, and is unlikely to get them any more sales. It's not about who knows more.
[G4 Q&A, Help & Troubleshooting] LKNim:
Hey guys, I'm the YouTube video owner and is considering if there is necessity to add English CC subtitles for more people to understand what I did and why.

Firstly, the language I spoke in the video is Cantonese(Hong Kong).

- What I did is just a trial version of thermal mod, there is better version from a Taiwanese, he could even take off the metal shield which I apply the compound on it

- There were testings for applying thermal compound on desktop PC, one spot could perform better than a thin layer because a compressed spot gives thinnest layer. A full coverage of thin layer is already too thick for thermal conduction(the thinner the better). This theory might not apply on G4 since we're not putting a heatsink on the CPU and don't have that much of force acting on it. Therefore I was just trying and might have further test on it

- Thermal pad could be added on the opposite side of the motherboard to transfer heat to the phone frame more quickly. I'll have further test on it once I can get some thermal pads

- The phone body temperature get hotter in my test with respect to the feeling of my hands, the CPU had less throttle down and the phone got less lag when playing games with slimport cable connected

(My personal opinion) The manufacturers might consider

When the phone don't have the problem of overheat(99% of the user won't face lagging due to overheat and throttle down except the one who use slimport to record gaming videos like me)

- Better thermal conduction = warmer phone body = customer think the phone is hot and bad(not optimized)

- Less material = lower cost = lower price = more competitive

There should be some wording mistakes since English isn't my native tongue
[G4 Q&A, Help & Troubleshooting] darioampuy:
better thermal conduction to a wider surface means lower average temperature on that surface. the phone feels warmer because the heat doesn't propagate from the source (the processor) to a heatsink. with the thermal mod the wide area of the frame can take more of that heat before getting warm, and since those processors generate little heat the frame doesn't get warmer. in other phones you feel the heat irradiated from the processor directly, and because their frames are made from plastic so they can't be used as a headsink
[G4 Q&A, Help & Troubleshooting] LKNim:
I think what I said wasn't detail enough.

Where I felt hotter is the specific area of the touch screen where the cpu located, it's actually VERY HOT(I've also flashed the CTT mod v4 to keep the cpu less throttling)

Lower average temperature only apply to constant power source

In the situation of my phone, it's average temperature before it was throttling is lower. However, the cpu will hence get more time on higher clock to consume more power and produce more heat. As a result the average power is higher. Then the average temperature depends on the speed of heat dissipation which is bad on glass and plastic.

Below I'm going to describe how the heat energy are transferred, from hotter component -> colder component

Leather cover <- interior frame <- (thermal pad not yet added) <- motherboard <<- cpu ->> metal frame -> em shield -> thermal compound -> black plastic tape -> interior frame -> outer frame/touch screen

Every components listed above are counted as the heatpipe and heatsink of the cpu, heat won't be disappeared and must be transferred through them and dissipated to the air from leather cover/plastic frame/touch screen

What my thermal mod did is to speed up the heat transfer from em shield to the plastic tape, a lower temperature em shield can absorb more heat from metal frame and hence the cpu, then the cpu get cooler

I got lots of experience of desktop computer thermal solution and realize the basic theories could apply on mobile phones too. Correct me if any of the statement was wrong:p
[G4 Q&A, Help & Troubleshooting] Almighty1:
[MENTION=3671093]LKNim[/MENTION] - Still did a good video regardless and good thing I'm Cantonese as well so I understood what you were saying. On the LG G4, the charging slows down after it charges to 80% or so as the increase in temp because of the CPU throttle would slow down charging when the CPU is in use or the screen is on. I still wonder how Motorola managed to get the CPU running at full speed on the Droid Turbo 2. Just curious, what is a slimport cable because that's a new term, is it the MicroUSB cable? As for complete layer versus just a grain which was done in tests with Arctic Silver 5 for the past 10+ years, I think it depends on the size of the CPU since normally when you squish the thermal compound with a dot, it will spread to a thin layer for complete coverage on it's own as you can slide the Heatsink on top of the CPU without any problems but in the case of the G4, a lot of the surface would not even have any thermal compound on top as you can't move the parts while it is mounted. I use to use a thermal compound called Nanotherm PCM+ which is liquid when there is heat and when the computer is off, it turns back into solid. Arctic Silver acquired the company.

http://www.geek.com/xyzcomputing/nanotherm-pcm-aqua-thermal-compound-571132/

I'm using CTT mod v2.1, the revised v2 that came out after v4 that people seem to like, it seems like my G4 (VS986 Verizon Wireless) is cooler than it used to be which was 105C!
[G4 Q&A, Help & Troubleshooting] LKNim:
Actually, I have the AS5 compound and why I use the noctua one is I can't find it in my room on that day lol

Will add more AS5 into my phone to see if it'll throttle lesser

Slimport is similar to MHL, we can have HDMI output with these cable and of course supported device. Then I use a HDMI capture card to record my phone's screen
[G4 Q&A, Help & Troubleshooting] Almighty1:
For some reason, I thought the Noctua would be better than the AS5 since it seems lots of the new thermal compound performs better than AS5 according to reviews. I just ordered some Thermal Grizzly Kryonaut which should hopefully be here in the new few days. I still have 12 tubes of AS5 from 8 years ago and it's separating inside as it's watery at the beginning.

Thanks, I haven't been keeping up with things and I know MHL is basically HDMI but didn't know the MicroUSB port had something to do video, that explains why phones no longer have a MiniHDMI port.
[G4 Q&A, Help & Troubleshooting] undercover:
Test your gps. When i done this mode on N4 it messed up my gps reception badly, I guess due to interference although I used non conductive paste.
[G4 Q&A, Help & Troubleshooting] KingFatty:
This video appears to prove that the thermal grease approach doesn't much help with lowering temperatures. He puts the thermal compound on, and plays the games and the phone still gets up to 70 degrees or higher after a gaming session, after watching the video to see it happen.

So, has anyone tried the thermal tape (0.5 mm thickness) and seen improvements? Someone mentioned some tape that has 14 watt dissipation which is much better than silicone thermal tape, but that good tape is about $30 to buy some, but any suggestions for good tape that is not as expensive? Maybe around 10 watt dissipation?

---------- Post added at 12:46 PM ---------- Previous post was at 12:33 PM ----------

I found this thermal pad tape which might work, but wonder if there are better options. Preferably one that doesn't contain metal, because I'm worried it might interfere with the antennas:

https://www.pccasegear.com/products/33336/thermal-grizzly-minus-pad-8-20x120x0-5mm-thermal-pad-two-pack
[G4 Q&A, Help & Troubleshooting] vapore0n:
Mine got into the bootloop some time last week. Contacted sprint and they informed me I had to send it in to LG.

I contacted LG, they immediately sent me a shipping label.

I sent a receipt of the purchase, which was a used Swappa phone. LG still fixed it under warranty.

Arrived this past Sat, phone works great, and was quality tested by LG (paper included)
[G4 Q&A, Help & Troubleshooting] bitemark01:
Thanks for your video, and for responding here! Your English is quite good! :)

In the video, you mentioned you might try adding copper, did you end up doing this? Do you have a link to the video of the other person who did this?

I may try this myself, my phone is in for repair, looks similar to the boot loop issue others are having. I'm convinced overheating plays a big part in this.
[G4 Q&A, Help & Troubleshooting] TheMadScientist:
Im one of the orig therm compound mod i wrote the guide on the sprint varients

---------- Post added at 03:31 PM ---------- Previous post was at 03:25 PM ----------

Im not gonna go throught this hole thread.

To clarify i put arctic silver on all my flat type prossecsor chips. All on both sides of the mother board under the shielding. I have noticed now heat dissapation rises more through the screen but my cpu temps always stay under 45 celsius. The screen gets warmer but the paste is doing its job i took loads of screenshots in the sprint thread

http://xdaforums.com/sprint-g4/general/disassemble4-g4-testin-harware-cooling-t3327640

---------- Post added at 03:33 PM ---------- Previous post was at 03:31 PM ----------

I myself have wonderd if the ilapo is partially due to the big cores overheating my g4 is on 5 months now no issues. Other than litrerly just changing the glass 10 min ago

---------- Post added at 03:34 PM ---------- Previous post was at 03:33 PM ----------

Now heres the issue everyone.

DO NOT DO THIS IF URE UNDER WARRANTY. If u do go into ilapo kiss your warranty good bye. Lg will not fix for free. Only option will be buying a motherboard for roughly 200 dollars american
[G4 Q&A, Help & Troubleshooting] kentek:
Thermal paste

IS MEANT ONLY TO EVEN OUT THE SURFACES BETWEEN THE 2 PLATES FIRST

quality of the paste and its ability to transfer heat in the areas that are on the uneven surfaces is the bases for changing it out and compound breakdown we all have seen what happens to compound breakdown and poor thermal conductivity on game consoles people think its a manufacturing flaw I don't think so more like a replacement guaranty if i blog or say the g5 has fixed the heat issue on this model then the flaw is hidden somewhere else like the battery or like the g3 they just fry and die and now you need a new phone marketing >cents<

Besides your not cool without the latest phone right
[G4 Q&A, Help & Troubleshooting] ante1234:
Help

Hi, so mine G4 is overheating (i am a causal user, no gaming or heavy video watching).

I've rooted the phone and underclocked the CPU but still i get overheating message and then restart, but less frequently. Most of the restarts happen while charging regardless of the charger used.

I have 2 batteries, the phone is operating the same with both of them. The last option is opening the phone and try to resolder the SOC.

At this point im not sure what to do, can anyone give me a solid advice i would be very grateful !
[General Topics] kalyanamitras:
Hi:

I have the Samsung Galaxy Note IIs on Verizon running Android 4.1.2. I want to upgrade but have several questions. Mainly, I want to keep verizon as my carrier but want easy root capability and I have been sorely disappointed with the Samsung camera and those annoying blue dots i low light.

Currently, I understand there is no root if I upgrade my Note2 to the most recent version through Verizon, so the field is wide open for suggestions.

Things that are important to me.

I use my phone as a camera so I want a decent one.

I use my phone for navigation, both on land and water so GPS/battery is important

I use my phone as a hotspot using Foxfi. (I have the old VErizon unlimited dataplan and don't want to lose that.

Thanks!