[T-Mobile Samsung Galaxy Note 3] connexion2005:
[MENTION=4959296]ecs87[/MENTION]

Hi there,

I talked quite a bit with Mohud on the situation and attempts of repair with this device for you guys but it seems you would have been the better candidate to discuss that with as he stated on our call moments ago. At the time the repairs were started, the unbrick method had not been solved otherwise those are certainly the first points of repair any shop/technician would take. The reason we were asking about what caused the brick is to help aid with the study of what zone would have the problem. You see, people send in phones for JTAG for just about any reason. I've received phones in that were literally water damaged or just died randomly which are not areas in which JTAG would aid. Therefore it is important we get a description when possible to quickly deduce those issues. Also, with all of the MCU fusing Qualcomm has brought to the table, we stress only repairing damaged zones so as to not fuse newer bootloaders to a device if it may be unnecessary to allow our customers to use the oldest set of bootloaders possible which have the best chances of running unlocked or strapped methods of custom ROM's and recoveries. JTAG was proving to cause a difficult time with connectivity so the eMMC chip was actually removed from the board and programmed with a special 3rd party tool. It was at that time observed the mmcblk0p3 was completely blanked out. Using the programmer, we wrote in the proper information and re-installed the chip to the unit. After these efforts, QHUSB was no longer visible. In regards to "frying" the battery terminal, it was a bit warped from the heating process involved to reflow the chip. The battery terminal plastic is not really meant to withstand the heat required to reflow BGA components. Due to its' proximity to the eMMC, it did become a bit warped on the non-visible inner side. However, it is purely aesthetic and did not hinder the functionality of the terminal. It is important not determine any damages caused to BGA components based on a slight warping of any neighboring plastic component as it is simply very difficult to preserve total shape to them when reflowing areas. In any event the attempts were truly in the best interest of the repair at the time of effort. I was trying to go the extra mile for free to produce the repair and worked with the unit for around 2 hours during those tests. We use eMMC programming exclusively as a repair alternative when JTAG is not possible on many models such as Tegra or OMAP MCU's. We did indeed refund you in accordance with the refund policy although I'm not sure you had received that at the time of your post so I can understand some initial concern regarding a refund.

In any event, we have a great reputation based on our skill set but more importantly customer care. I would love to talk with you about the project a bit more and possibly even see if we can replace the logic board if in any event the unit could have been damaged during the repair attempts FREE OF CHARGE. We would never purposely ignore any damage caused to a unit while under our care. Doing over 5,000 repairs annually can prompt for these types of issues from time to time when you are constantly on the verge of offering the "next big repair" which is what we considered this at the time of the attempts. We don't give ourselves a free pass however for any type of hardware problems that can be caused during BETA or early production repairs. Please give me a call at 657-444-JTAG during business hours and I can go over more detail and some options. Just remember, if you ever have any issues with any order or something we have done, just give me a call! I'd love to help out or find out what I can do to remedy a situation. I value the chance to make something right above any level of profit or gain.

Thanks so much!

-Josh

657-444-JTAG