[T-Mobile Samsung Galaxy S II SGH-T989] dougroundup:
water damage and no audio

Help Please! Q. Basically where is the actual microphone element and related contacts? The full descriptive problem- To avoid damaging my phone at construction jobsite I placed it, with other personal belongings inside my lunch bag. (polyethelene grocery sack). Enclosed inside the bag was a tall can of Arizona Iced Tea brand, Sweet Tea beverage. Mysteriously the can had burst or punctured and the phone was found fully submerged 100% in the sugary liquid on the bottom of the bag. I removed rear cover and the battery. Both the battery and the inside compartment were fairly dry. *The moisture indicator labels were both bright red, indicative of warranty voided moisture exposure. The headphone jack and charge port were both completely breached and had allowed fluid into the mainboard and camera sub assembly boards. I completely disassembled the phone by removing the six screws and disconnecting the various flexcable connectors . The parts were thoroughly rinsed with a bottle sprayer filled with Anhydrous Isopropyl Alcohol, all parts were then blotted dry with absorbant paper. Final procedure included placing all components into a preheated coffee can filled completly full of silica gel dessicant. Everthing remained buried within the media and left to dehydrate for 12 continuious hour @ 105°F before final reassembly. The phone has been restored to 99% full functionality and all sensors and and rf subsections appear to funtion including GPS ,ACCELEROMETERS, MAGNEMOMETER, COMPASS, WIFI BLUETOOTH, CHARGING SYSTEM, DIGITIZER, *SPEAKER DISPLAY, BOTH CAMERAS FULLY FUNCTION AND METER EXPOSURE CORRECTLY.... I CAN PLACE . AND RECIEVE PHONECALLS BUT NOBODY CAN RECIEVE MY AUDIO THROUGH MY MICROPHONE NOR CAN I RECORD ANY AUDIO ON MY MEDIA APLLICATIONS. BASICALLY *I CANT TALK ON MY PHONE!!! ( thats why im yelling!!!) I have dissasmbled and reassmbled several times , taking care to seat all connectors and have even applied "De-Oxit" brand contact cleaner to all connectors including the spring pressure pads on the outer housing . I RETENSIONED THE GOLD SPRING PRESSURE PADS TO INSURE CONTACT WITH THE CORROSPONDING MATING SURFACES. I BELIEVE THAT THE LOWER LEFT CONTACTS (righthand side when observed from the rear) MATES TO A CONDUCTIVE RUBBER CONTACT ALONG THE LOWER OUTER BACK FRAME. Is this where the condenser mic element reside? Is this avail as replacement part and would this likely be damaged by liquid or ensuing treatment??? Perhaps the alcohol solvent damaged conductive carbon rubber pad? *I am not a tech especially a cellphone tech. I AM JUST A PLUMBER! But I am very technically inclined and am better equiped then most with a higher end DVMM, Audio signal generator, freq counter and even a basic crt 10 meg scope. (my multimeter has a serial port and software bundle for a better virtual digital sampling scope than the crt) MY PHONE IS 100% STOCK AND UNROOTED W/ LATEST TMOBILE FIRMWARE. I AM FULLY CAPABLE BUT JUST NEED SOME ADANCED HELP AND DIRECTION FOR WHAT IS SIMPLE REPAIRABLE MALFUNCTION. Can someone knowledgeable about this type of micro surfacemount technology please hold my hand and guide me with some "sound" advice.!