Demonstration of 2µm RDL wiring using dry film photoresists and 5µm RDL via by projection lithography for low-cost 2.5D panel-based glass and organic interposers
25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV