{"title": "NAND Packaging Engineer", "summary": "Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! Apple's SEG Packaging team invents, designs, develops and integrates electronic packaging solutions for the Apple\u2019s internal and customized external components of hardware for its consumer electronic products. We are looking for a hard-working NAND Packaging Engineer to join our team. In this highly visible role, you will own and drive the memory package development in support of Apple's external memory vendors and steering their packaging design compatibility to Apple's system components.", "description": "As a NAND Packaging Engineer, your main focus will be on defining memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the system and product teams and overall program through the development and NPI cycle. - Define the memory package POR (plan of record): Package architecture, technology, process, form factor, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity. - Publish internal package specs for customized memory Establish trusting and collaborative relationships and communication channels, directly collaborating with vendors for memory package development and qualification. - Review, drive, and approve memory vendor DOEs, characterization plans, technology qualification. - Drive industry with sophisticated package design rules, processes, materials, and groundbreaking specifications. - About 10% international travel required.", "key_qualifications": "Experience in the packaging design and assembly process development for stacked-die memory packages. Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking. Hands on experience using packaging materials, substrate technology, and their mechanical and thermal behaviors. Proficient in assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling. Confirmed abilities working in package test and reliability, system-level downstream process interaction, and packaging inspection metrology. Excellent logic, critical thinking skills with strong engineering physics and data driven analysis. Strong written and verbal communication skills for working with internal multi-functional teams and OSATs.", "preferred_qualifications": "", "education_experience": "- BS and 10+ years of relevant industry experience.", "additional_requirements": "", "pay_benefits": "At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,800 and $312,200, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple\u2019s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple\u2019s Employee Stock Purchase Plan. You\u2019ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses \u2014 including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.", "company": "apple"}