Development of a New ComputerAided Algorithm for ThreeLayered Seale Wire Strand Geometric Design A new computeraided algorithm used for the geometric design of threelayered Seale wire strands is developed in this paper. The biggest advantage of the new algorithm is that it can easily formulate a onedimensional problem which applied to determinate the diameter ratio of each layer wires of the threelayered Seale strand. Compared to conventional mathematical method, i.e. gradual approaching method, the new presented algorithm does not need a large amount of iterations to be implemented to achieve a good accuracy. Furthermore, the necessary computational condition that adjacent wires in the same strand layer should contact with each other in the conventional algorithm does not also needed. Threelayered 19wire Seale strand was chosen to verify the newly developed algorithm. Numerical results show better agreement with those derived from the conventional methods. Furthermore, the new algorithm has a good computational efficiency and it can provide the exact coordinate values of the contact point between the 2nd layer wires and the 3rd layer wires.

MultiThread Assembling for Fast FEM Power Delivery DC Integrity Analysis Power integrity analysis is of great significance in the field of circuit design, especially the design of modern high speed circuit system. For the high performance printed circuit boards (PCBs) and IC design, power delivery network DC integrity checks play an important role. However, the element assembling process in finite element method (FEM) can take significant portion of total computing time. In this paper, a fast finite element assembling method for power network DC integrity checks of PCBs is proposed. We divided the mesh into a serious of bins and elements in different bins could be assembled in parallel. Further more, a dynamic circle shape approximation method is introduced to further control the number of elements due to vias and circular objectives. As a result, the new solver can easily perform progressive trade off between speed and accuracy. Experimental results of two PCB examples on a 3.6GHz Intel i7 Dualcore CPU show that the proposed multithread assembling method can achieve 2X speedup over existing singlethread assembling methods. A dynamic circle shape approximation method is introduced to further control the number of elements and speed up the solver process. The resulting FEM solver leads to 3X speed over a commercial power integrity solver with no more than 0.7% errors.