Patent application 14424782 (US), filed 2015-02-27
Publication number: US20150224677A1
Title: ENCAPSULATION MOLD
CPC codes: B29C  33/20
B29C  45/14377
B29C  45/14434
B29C  45/14778
B29L2031/3052
Office action: rejection, dated 2015-10-15
Rejection reasons: anticipation_102
obviousness_103
Prior art cited: ref_id: 4830804
ref_type: patent
severity: novelty_destroying
ref_id: 4584155
ref_type: patent
severity: novelty_destroying
ref_id: 4830804
ref_type: patent
severity: novelty_destroying
Final disposition: pending (2015-10-15)