Patent application 14173976 (US), filed 2014-02-06
Publication number: US20140151867A1
Title: SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
CPC codes: H10W  70/60
H05K   1/111
Y02P  70/50
H10D   1/00
H10W  72/942
H10W  90/701
H10W  70/687
H10W  74/15
H10W  72/241
H10W  72/923
H10W  72/952
H10W  72/01938
H10W  72/072
H10W  72/07236
H10W  70/635
H10W  72/90
H10W  72/20
H10W  72/222
H10W  99/00
H10W  90/724
H10W  72/29
H10W  72/01257
H10W  72/30
H10W  70/6565
H10W  72/9415
H10W  90/734
H10W  70/421
H10W  72/244
H10W  72/01235
H10W  72/01935
H10W  72/252
H05K   3/3436
H05K2201/0376
H05K2201/09472
H05K2201/10674
Office action: rejection, dated 2015-10-15
Rejection reasons: anticipation_102
obviousness_103
Prior art cited: ref_id: 20110101526
ref_type: patent
severity: novelty_destroying
ref_id: 6093972
ref_type: patent
severity: novelty_destroying
ref_id: 20110101526
ref_type: patent
severity: novelty_destroying
Final disposition: pending (2015-10-15)