Patent application 14147316 (US), filed 2014-01-03
Publication number: US20150115464A1
Title: Chip on Package Structure and Method
CPC codes: H10W  90/00
H10W  70/095
H10P  72/7416
H10W  72/01225
H10W  72/01251
H10W  72/877
H10P  54/00
H10W  74/019
H10W  90/701
H10W  90/732
H10W  70/099
H10W  72/5445
H10P  72/744
H10W  72/01255
H10W  72/823
H10W  72/884
H10P  76/204
H10W  74/15
H10W  72/073
H10W  72/07307
H10W  90/10
H10W  90/28
H10W  20/057
H10W  72/241
H10W  72/551
H10W  72/923
H10W  72/952
H10W  72/072
H10W  90/26
H10W  70/093
H10W  70/635
H10W  70/65
H10W  20/20
H10P  74/207
H10W  72/07232
H10W  74/142
H10W  72/20
H10W  72/50
H10P  72/7402
H10W  74/00
H10W  74/014
H10P  14/47
H10W  72/0198
H10W  90/22
H10W  90/271
H10W  90/297
H10W  90/724
H10W  72/29
H10W  90/754
H10W  70/614
H10P  72/74
H10W  72/874
H10W  72/9413
H10W  72/07207
H10W  72/5366
H10W  74/111
H10W  80/314
H10W  20/023
H10W  90/721
H10W  90/722
H10W  90/734
H10W  20/062
H10W  70/09
H10W  70/60
H10P  72/7436
H10W  72/01235
H10P  52/403
H10W  74/016
H10W  72/252
H10W  70/611
Office action: rejection, dated 2015-10-15
Rejection reasons: anticipation_102
Final disposition: granted (2015-10-15)