Patent application 14285079 (US), filed 2014-05-22
Publication number: US20140252570A1
Title: LEAD-FRAME CIRCUIT PACKAGE
CPC codes: H10W  70/468
H10W  72/07251
H10W  90/753
H10W  70/685
H10W  72/884
H10W  90/811
H10W  44/226
H10W  72/20
H10W  90/756
H10W  70/682
H10W  74/00
H10W  44/00
H10W  72/5522
H10W  72/352
H10W  72/5449
H10W  90/726
H10W  90/736
Office action: rejection, dated 2015-10-15
Rejection reasons: anticipation_102
obviousness_103
indefiniteness_112
Prior art cited: ref_id: 20040232982
ref_type: patent
severity: novelty_destroying
ref_id: 20030076659
ref_type: patent
severity: novelty_destroying
ref_id: 20020140075
ref_type: patent
severity: novelty_destroying
ref_id: 20040241913
ref_type: patent
severity: novelty_destroying
ref_id: 5536906
ref_type: patent
severity: novelty_destroying
Final disposition: pending (2015-10-15)