Patent application 14171707 (US), filed 2014-02-03
Publication number: US20140148557A1
Title: THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS
CPC codes: H10W  74/012
H10W  76/47
H10W  72/856
H10W  72/877
H10W  74/017
H10W  74/15
H10W  74/00
H10W  90/724
H10W  72/30
H10W  90/734
C08G  73/10
C08L  79/08
C08L2203/20
C08L2205/02
Office action: rejection, dated 2015-10-16
Rejection reasons: obviousness_103
indefiniteness_112
Prior art cited: ref_id: 6653433
ref_type: patent
severity: obviousness
Final disposition: pending (2015-10-16)