Patent application 13854583 (US), filed 2013-04-01
Publication number: US20140292930A1
Title: PROCESSING AND APPLICATION OF LIQUID EPOXY ADHESIVE FOR PRINTHEAD STRUCTURES INTERSTITIAL BONDING IN HIGH DENSITY PIEZO PRINTHEADS FABRICATION
CPC codes: B41J   2/04
B41J   2/14233
B29C  65/483
B29C  66/028
B29C  66/1122
B29C  66/71
B29C  66/742
B29L2031/767
B41J   2/161
B41J   2/1623
B41J2002/14403
B29K2079/08
Office action: rejection, dated 2015-10-15
Rejection reasons: obviousness_103
Prior art cited: ref_id: 5439956
ref_type: patent
severity: obviousness
ref_id: 20090115823
ref_type: patent
severity: obviousness
ref_id: 6358354
ref_type: patent
severity: obviousness
ref_id: 20100025322
ref_type: patent
severity: obviousness
Final disposition: rejected (2015-10-15)