Patent application 13798592 (US), filed 2013-03-13
Publication number: US20130187252A1
Title: BONDPAD INTEGRATED THERMOELECTRIC COOLER
CPC codes: H10W  40/28
H10N  19/00
H10W  72/9232
H10W  72/29
H10W  72/59
F25B  21/02
F25B2321/021
Office action: rejection, dated 2015-10-15
Rejection reasons: anticipation_102
obviousness_103
indefiniteness_112
Prior art cited: ref_id: 6774450
ref_type: patent
severity: novelty_destroying
ref_id: 6207887
ref_type: patent
severity: novelty_destroying
ref_id: 6774450
ref_type: patent
severity: novelty_destroying
ref_id: 20080173537
ref_type: patent
severity: novelty_destroying
ref_id: 6476508
ref_type: patent
severity: novelty_destroying
Final disposition: pending (2015-10-15)