Patent application 13744335 (US), filed 2013-01-17
Publication number: US20140197037A1
Title: TREATMENT METHOD OF ELECTRODEPOSITED COPPER FOR WAFER-LEVEL-PACKAGING PROCESS FLOW
CPC codes: H10P  72/0476
H10W  70/662
C25D   3/38
C25D   5/611
H10W  72/01225
H10W  90/701
H10W  72/2528
H10W  95/00
H10W  72/922
H10W  72/952
H10W  72/00
H10W  72/90
H10W  72/07255
H10W  72/20
H10P  14/47
H10W  72/0198
H10W  72/29
H10W  72/01257
H10W  20/49
H10W  72/019
H10W  72/01935
H10W  72/252
C25D   3/60
C25D   5/10
C25D   5/50
C25D  17/00
Office action: rejection, dated 2015-10-15
Rejection reasons: indefiniteness_112
Final disposition: granted (2015-10-15)