Patent application 13740677 (US), filed 2013-01-14
Publication number: US20130292793A1
Title: LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT
CPC codes: H10D  62/115
H10W  42/121
H10W  74/134
H10W  76/40
H10W  74/121
H10W  10/20
H10W  10/021
Office action: rejection, dated 2015-10-15
Rejection reasons: obviousness_103
Prior art cited: ref_id: 7897512
ref_type: patent
severity: obviousness
ref_id: 20090026526
ref_type: patent
severity: obviousness
ref_id: 20100001377
ref_type: patent
severity: obviousness
Final disposition: granted (2015-10-15)