Patent application 13808051 (US), filed 2013-02-26
Publication number: US20130236622A1
Title: METHOD AND APPARATUS FOR MAKING A LOW DENSITY WAFER PRODUCT
CPC codes: A21D   8/025
A21D  13/00
A21D  13/45
A21D  13/50
A21C   5/006
A21D   2/188
A21D   2/262
A21D   2/263
A21D   2/265
A21D   6/00
Office action: rejection, dated 2015-10-15
Rejection reasons: obviousness_103
indefiniteness_112
Prior art cited: ref_id: 20110027415
ref_type: patent
severity: obviousness
ref_id: EP 2105051
ref_type: patent
severity: obviousness
ref_id: 3970763
ref_type: patent
severity: obviousness
ref_id: 20030003213
ref_type: patent
severity: obviousness
Final disposition: pending (2015-10-15)