Patent application 13636087 (US), filed 2013-02-04
Publication number: US20130316082A1
Title: METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
CPC codes: C23C  18/16
C23C  18/208
C23C  18/54
C23C  18/1651
C23C  18/1653
C23C  18/285
C23C  18/30
C23C  18/31
C23C  18/34
C23C  18/36
C23C  18/40
C23C  18/44
C23C  18/52
C25D  11/00
Office action: rejection, dated 2015-10-16
Rejection reasons: obviousness_103
indefiniteness_112
Prior art cited: ref_id: 7220296
ref_type: patent
severity: obviousness
ref_id: 4209331
ref_type: patent
severity: obviousness
ref_id: Japan 02-145771
ref_type: patent
severity: obviousness
ref_id: 20030047458
ref_type: patent
severity: obviousness
ref_id: 4349421
ref_type: patent
severity: obviousness
ref_id: 4751106
ref_type: patent
severity: obviousness
ref_id: 6193789
ref_type: patent
severity: obviousness
Final disposition: granted (2015-10-16)