Patent application 14088421 (US), filed 2013-11-24
Publication number: US20150148453A1
Title: HALOGEN-FREE EPOXY RESIN COMPOSITION FOR INTEGRATED CIRCUIT PACKAGING
CPC codes: C08L  63/00
C08L  85/02
C08G  59/4071
C08L2201/02
C08L2201/08
C08L2203/20
C08L  79/04
Office action: rejection, dated 2015-10-14
Rejection reasons: obviousness_103
indefiniteness_112
double_patenting
Prior art cited: ref_id: 20080254300
ref_type: patent
severity: obviousness
ref_id: 20130316155
ref_type: patent
severity: obviousness
ref_id: 20090001139
ref_type: patent
severity: obviousness
ref_id: 20120129978
ref_type: patent
severity: obviousness
Final disposition: rejected (2015-10-14)