Patent application 14117258 (US), filed 2013-11-12
Publication number: US20140341242A1
Title: RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
CPC codes: H10W  74/111
C08K   3/10
C09J   9/02
C09J  11/04
H01S   5/0236
H10H  20/857
H10H  20/858
H10W  72/536
H10W  72/884
H10W  70/417
H10W  72/5363
H10W  90/756
H10W  72/071
H10W  90/736
C08K   7/18
C08K2003/0806
C08K2201/001
C08K2201/005
C09J 163/00
C09J 201/00
Office action: rejection, dated 2015-10-16
Rejection reasons: anticipation_102
obviousness_103
indefiniteness_112
Prior art cited: ref_id: 20060154078
ref_type: patent
severity: novelty_destroying
ref_id: 20090050850
ref_type: patent
severity: novelty_destroying
ref_id: 20040004209
ref_type: patent
severity: novelty_destroying
ref_id: 5457149
ref_type: patent
severity: novelty_destroying
ref_id: 6733695
ref_type: patent
severity: novelty_destroying
Final disposition: rejected (2015-10-16)