Patent application 14084854 (US), filed 2013-11-20
Publication number: US20140077126A1
Title: METHOD OF ETCHING A HIGH ASPECT RATIO CONTACT
CPC codes: H10P  50/283
C09K  13/00
Office action: rejection, dated 2015-10-16
Rejection reasons: obviousness_103
Prior art cited: ref_id: 20040175925
ref_type: patent
severity: obviousness
ref_id: 7074723
ref_type: patent
severity: obviousness
ref_id: 20030196989
ref_type: patent
severity: obviousness
ref_id: 7169695
ref_type: patent
severity: obviousness
ref_id: 2407419
ref_type: patent
severity: obviousness
ref_id: 20030045114
ref_type: patent
severity: obviousness
ref_id: EP 0246514
ref_type: patent
severity: obviousness
Final disposition: pending (2015-10-16)