Patent application 13485307 (US), filed 2012-05-31
Publication number: US20130207306A1
Title: Methods for Molding Integrated Circuits
CPC codes: B29C  43/18
H10W  90/732
H10W  74/114
H10W  74/15
H10W  72/0198
H10W  90/724
H10W  90/722
H10W  90/734
H10W  74/016
Office action: rejection, dated 2015-10-15
Rejection reasons: obviousness_103
Prior art cited: ref_id: 20110127694
ref_type: patent
severity: obviousness
ref_id: 20070275507
ref_type: patent
severity: obviousness
ref_id: 5338497
ref_type: patent
severity: obviousness
Final disposition: granted (2015-10-15)