Patent application 13651496 (US), filed 2012-10-15
Publication number: US20140103495A1
Title: WAFER AND METHOD FOR PROCESSING A WAFER
CPC codes: H10P  74/277
H10P  72/742
H10P  72/7402
Office action: rejection, dated 2015-10-16
Rejection reasons: obviousness_103
Prior art cited: ref_id: 20080265378
ref_type: patent
severity: obviousness
ref_id: 20120126228
ref_type: patent
severity: obviousness
ref_id: 20120217643
ref_type: patent
severity: obviousness
Final disposition: granted (2015-10-16)