Patent application 13648496 (US), filed 2012-10-10
Publication number: US20130033820A1
Title: COOLING A MULTI-CHIP ELECTRONIC MODULE
CPC codes: H10W  40/43
H10W  40/70
H10W  40/10
Office action: rejection, dated 2015-10-19
Rejection reasons: anticipation_102
obviousness_103
Prior art cited: ref_id: 5021924
ref_type: patent
severity: novelty_destroying
ref_id: 4485429
ref_type: patent
severity: novelty_destroying
ref_id: 20090147481
ref_type: patent
severity: novelty_destroying
ref_id: 4494171
ref_type: patent
severity: novelty_destroying
Final disposition: pending (2015-10-19)