Patent application 13640540 (US), filed 2012-11-15
Publication number: US20130056686A1
Title: CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM
CPC codes: C08G  59/42
C09J   7/30
C08F 220/1802
H10W  72/884
H10W  74/15
H10W  72/07554
H10W  72/20
H10W  72/547
C08F 220/18
C08F 222/04
C08L  33/068
C08L  63/00
C09J   9/02
C09J 163/00
C08F 220/325
Office action: rejection, dated 2015-10-19
Rejection reasons: anticipation_102
obviousness_103
Prior art cited: ref_id: 20120193666
ref_type: patent
severity: novelty_destroying
ref_id: WO 2011030621
ref_type: patent
severity: novelty_destroying
ref_id: 20070181902
ref_type: patent
severity: novelty_destroying
ref_id: 20110108878
ref_type: patent
severity: novelty_destroying
ref_id: 20080139722
ref_type: patent
severity: novelty_destroying
ref_id: WO 2010007817
ref_type: patent
severity: novelty_destroying
Final disposition: rejected (2015-10-19)