Patent application 13309311 (US), filed 2011-12-01
Publication number: US20130143361A1
Title: PACKAGING PROCESS TOOLS AND SYSTEMS, AND PACKAGING METHODS FOR SEMICONDUCTOR DEVICES
CPC codes: H10P  72/74
H10W  72/354
H10W  72/01238
H10W  72/07178
H10W  74/15
H10W  72/073
H10W  72/241
H10W  72/923
H10W  72/932
H10W  72/952
H10W  72/072
H10W  72/07236
H10W  72/951
H10W  74/012
H10W  72/07231
H10W  72/07232
H10W  72/222
H10W  99/00
H10W  74/00
H10W  74/014
H10W  72/0198
H10W  72/07204
H10W  90/724
H10W  72/248
H10W  72/29
H10W  72/9415
H10W  72/07227
H10W  90/734
H10P  72/7436
H10W  72/01235
H10W  74/117
H10W  72/0711
H10W  42/121
H10W  72/252
Office action: rejection, dated 2015-10-16
Rejection reasons: indefiniteness_112
Final disposition: granted (2015-10-16)