Patent application EP19182532A (EP), filed 2019-06-26
Publication number: EP3757248A1
Title: NISI SPUTTERING TARGET WITH IMPROVED GRAIN STRUCTURE
Abstract: [0001]    The present invention relates to a sputtering target comprising a NiSi alloy comprising from 2 to 8 weight% Si, and to a process for forming said sputtering target.
IPC codes: C22C  19/    03            A I
C23C  14/    14            A I
C23C  14/    34            A I
H01J  37/    34            A I
C22C  19/    00            A I
Claims: number: 1
text: Sputtering target comprising a NiSi alloy comprising from 2 to 8 weight% Si, having an average grain size of 150 to 400 µm and a grain size variation of lower than 30%.
number: 2
text: Sputtering target according to claim one wherein the NiSi alloy comprises from 2.5 to 7.5 weight% Si.
number: 3
text: Sputtering target according to claim one or two wherein the NiSi alloy comprises from 2.75 to 6.5 weight% Si.
number: 4
text: Sputtering target according to any one of the preceding claims wherein the NiSi alloy comprises from 3 to 6 weight% Si.
number: 5
text: Sputtering target according to any one of the preceding claims wherein the NiSi alloy is having an average grain size of 175 to 375 µm.
number: 6
text: Sputtering target according to any one of the preceding claims wherein the NiSi alloy is having an average grain size of 200 to 350 µm.
number: 7
text: Sputtering target according to any one of the preceding claims wherein the alloy has been produced by melting Ni and Si and using Ni with a purity of at least 99.9% (3N).
number: 8
text: Process for forming sputtering target wherein an NiSi alloy comprising 2 to 8 weight% Si is rolled and annealed at a temperature in the range of from of 750 to 975 °C.
number: 9
text: Process according to claim 8 wherein annealing is performed at a temperature in the range of from 800 to 950 °C.
number: 10
text: Process according to claim 9, wherein annealing is performed at a temperature in the range of from 825 to 940 °C.
number: 11
text: Process according to any one of claims 8 to 10, wherein rolling is performed at a temperature of from 1,000 to 1,250 °C.
number: 12
text: Process according to any one of claims 8 to 11 wherein rolling is performed so that a total thickness reduction of 60 to 90 % is obtained.
Office action: search_report, dated 2020-12-30
Prior art cited: ref_id: US2008138974A1
ref_type: patent
severity: background
ref_id: US6780295B2
ref_type: patent
severity: background
ref_id: US2006118407A1
ref_type: patent
severity: background
ref_id: US6780295B2
ref_type: patent
severity: background
ref_id: - SPIEKERMANN P: "Legierungen - ein besonderes patentrechtliches Problem?", MITTEILUNGEN DER DEUTSCHEN PATENTANWAELTE, HEYMANN, KOLN, DE, vol. 34, 1 January 1993 (1993-01-01), pages 178 - 190, XP002152326, ISSN: 0026-6884
ref_type: npl
severity: background
ref_id: US6780295
ref_type: patent
severity: background
ref_id: US2006118407
ref_type: patent
severity: background
ref_id: - SPIEKERMANN P, "Legierungen - ein besonderes patentrechtliches Problem?", MITTEILUNGEN DER DEUTSCHEN PATENTANWAELTE, HEYMANN, KOLN, DE, (19930101), vol. 34, ISSN 0026-6884, pages 178 - 190, XP002152326 [T] * the whole document *
ref_type: npl
severity: background
Final disposition: pending (2020-12-30)