Nitrogen trifluoride
Nitrogen trifluoride () is an inorganic, colorless, non-flammable, toxic gas with a slightly musty odor. It finds increasing use within the manufacturing of flat-panel displays, photovoltaics, LEDs and other microelectronics. Nitrogen trifluoride is also an extremely strong and long-lived greenhouse gas. Its atmospheric burden exceeded 2 parts per trillion during 2019 and has doubled every five years since the late 20th century. Synthesis and reactivity. Nitrogen trifluoride did not exist in significant quantities on Earth prior to its synthesis by man. It is a rare example of a binary fluoride that can be prepared directly from  the elements only at very uncommon conditions, such as an electric discharge. After first attempting the synthesis in 1903, Otto Ruff prepared nitrogen trifluoride by the electrolysis of a molten mixture of ammonium fluoride and hydrogen fluoride. It proved to be far less reactive than the other nitrogen trihalides nitrogen trichloride, nitrogen tribromide and nitrogen triiodide, all of which are explosive. Alone among the nitrogen trihalides it has a negative enthalpy of formation. It is prepared in modern times both by direct reaction of ammonia and fluorine and by a variation of Ruff's method. It is supplied in pressurized  cylinders. It oxidizes hydrogen chloride to chlorine: It is compatible with steel and Monel, as well as several plastics. It converts to tetrafluorohydrazine upon contact with metals, but only at high temperatures: NF reacts with fluorine and antimony pentafluoride to give the tetrafluoroammonium salt: Applications. Nitrogen trifluoride is primarily used to remove silicon and silicon-compounds during the manufacturing of semiconductor devices such as LCD displays, some thin-film solar cells, and other microelectronics. In these applications is initially broken down within a plasma. The resulting fluorine radicals are the active agents that attack polysilicon, silicon nitride and silicon oxide . They can be used as well to remove tungsten silicide, tungsten, and certain other metals. In addition to serving as an etchant in device fabrication, is also widely used to clean PECVD chambers. The utilization efficiency of the chemicals applied in plasma processes varies widely between equipment and applications. A sizeable fraction of the reactants are wasted into the exhaust stream and can ultimately be emitted into Earth's atmosphere. Modern abatement systems can substantially decrease atmospheric emissions. has not been subject to significant use restrictions. The annual reporting of production, consumption, and waste emissions by large manufacturers has been  required in many industrialized countries as a response to the observed atmospheric growth and the international Kyoto Protocol. Highly toxic fluorine gas (F, diatomic fluorine) is a climate neutral replacement for nitrogen trifluoride in some manufacturing applications. It requires more stringent handling and safety precautions, especially to protect manufacturing personnel. Nitrogen trifluoride is also used in hydrogen fluoride and deuterium fluoride lasers, which are types of chemical lasers. There it is also preferred to fluorine gas due to its more convenient handling properties Greenhouse gas. is a greenhouse gas, with a global warming potential (GWP) 17,200 times greater than that  of when compared over a 100-year period. Its GWP place it second only to in the group of Kyoto-recognised greenhouse gases, and was included in that grouping with effect from 2013 and the commencement of the second commitment period of the Kyoto Protocol. It has an estimated atmospheric lifetime of 740 years, although other work suggests a slightly shorter lifetime of 550 years (and a corresponding GWP of 16,800). Although has a high GWP, for a long time its radiative forcing in the Earth's atmosphere has been assumed to be small, spuriously presuming that only small quantities  are released into the atmosphere. Industrial applications of routinely break it down, while in the past previously used regulated compounds such as and PFCs were often released. Research has questioned the previous assumptions. High-volume applications such as DRAM computer memory production, the manufacturing of flat panel displays and the large-scale production of thin-film solar cells use . Since 1992, when less than 100 tons were produced, production has grown to an estimated 4000 tons in 2007 and is projected to increase significantly. World production of NF is expected to reach 8000 tons a year by 2010. By far  the world's largest producer of is the US industrial gas and chemical company Air Products & Chemicals. An estimated 2% of produced is released into the atmosphere. Robson projected that the maximum atmospheric concentration is less than 0.16 parts per trillion (ppt) by volume, which will provide less than 0.001 Wm of IR forcing. The mean global tropospheric concentration of NF has risen from about 0.02 ppt (parts per trillion, dry air mole fraction) in 1980, to 0.86 ppt in 2011, with a rate of increase of 0.095 ppt yr, or about 11% per year, and an interhemispheric gradient that  is consistent with emissions occurring overwhelmingly in the Northern Hemisphere, as expected. This rise rate in 2011 corresponds to about 1200 metric tons/y NF emissions globally, or about 10% of the NF global production estimates. This is a significantly higher percentage than has been estimated by industry, and thus strengthens the case for inventorying NF production and for regulating its emissions. One study co-authored by industry representatives suggests that the contribution of the NF emissions to the overall greenhouse gas budget of thin-film Si-solar cell manufacturing is clear. The UNFCCC, within the context of the Kyoto  Protocol, decided to include nitrogen trifluoride in the second Kyoto Protocol compliance period, which begins in 2012 and ends in either 2017 or 2020. Following suit, the WBCSD/WRI GHG Protocol is amending all of its standards (corporate, product and Scope 3) to also cover NF. Safety. Skin contact with is not hazardous, and it is a relatively minor irritant to mucous membranes and eyes. It is a pulmonary irritant with a toxicity considerably lower than nitrogen oxides, and overexposure via inhalation causes the conversion of hemoglobin in blood to methemoglobin, which can lead to the condition methemoglobinemia. The National  Institute for Occupational Safety and Health (NIOSH) specifies that the concentration that is immediately dangerous to life or health (IDLH value) is 1,000 ppm.