Assertion: solder's flux | /r/CapableOf | remove oxide
Facets:
value: on the surface of the metal
type: LOCATION
value: mainly
type: DEGREE
value: from the area of the joint
type: LOCATION
value: quickly
type: MANNER
value: on heating
type: TEMPORAL
Source sentences:
text: The basic operational steps are as follows: (1) thorough cleaning of the metal to be joined by abrasive or chemical means, (2) application of a flux to remove oxides on heating and promote spreading and wetting of the solder, (3) alignment of parts to produce a controlled gap of 0.025 to 0.125 mm (0.001 to 0.005 inch), (4) application of heat, (5) feeding solder to the joint, (6) cooling without movement, and (7) removal of corrosive flux residues.
text: Flux removes all the oxides on the surface of the metal that would interfere with the molecular bonding, allowing the solder to flow into the joint smoothly.
text: Flux is an acidic mixture that helps remove oxides from the area of the joint and therefore helps the solder flow easily over the joint and form a good bond.
text: Ideally, flux flows easily when hot, removes oxides quickly, and helps to remove foreign particles from the surface of the metal being soldered.
text: Flux removes oxides and other unwanted impurities form the surface of the copper tracks of the board and from the component lead surface.
text: Flux mainly removes dirt and oxides on the surface of the metal.