Assertion: quad flat package | /r/HasProperty | qfp
Facets:
Source sentences:
text: 304-pin plastic quad flat package (QFP) with exposed thermal pad (TP)
text: The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
text: For example, under accelerated thermal cycling conditions between -40°C to 125°C, various Quad Flat Package (QFP) components can last over 10,000 thermal cycles whereas QFN components tend to fail at around 1,000-3,000 cycles.