Assertion: semiconductor | /r/HasProperty | module
Facets:
Source sentences:
text: Thus, the metal member for placing the semiconductor elements need not be provided separately, so that an effect of realizing downsizing of the semiconductor device (module) can be obtained.
text: Accordingly, in the related configuration A, increasing in size of the semiconductor device (module), complication of a manufacturing process of the relevant semiconductor device, distribution of heat generation portions, and the like are problems.