Assertion: package | /r/HasAspect | area
Facets:
value: in order to qualify
type: PURPOSE
Source sentences:
text: According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.