Assertion: heating element | /r/HasProperty | provided
Facets:
Source sentences:
text: In a general implementation, one or more heating elements, fabricated separately from or as part of the transistor circuitry or part of the MEMS die, are provided to heat the MEMS component to a temperature higher than an ambient temperature range in which the IC package is intended to operate—in effect, heating the MEMS component and optionally the related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.).