Assertion: thin film circuit board | /r/CapableOf | remove second insulator layer
Facets:
value: excluding a prescribed portion
type: OTHER
value: by etching
type: MANNER
value: selectively
type: MANNER
Source sentences:
text: The thin film circuit board according to the second embodiment the present invention can be manufactured by a method including: forming a barrier layer on an insulator layer having a relatively high dielectric constant; forming a second insulator layer at a prescribed thickness on the barrier layer; arranging a conductor layer on the second insulator layer; selectively removing the second insulator layer, excluding a prescribed portion located beneath the conductor layer, by etching; forming an insulator portion composed of the second insulator that supports the conductor layer in the undercut state; forming an insulator layer having a relatively low dielectric constant so as to surround the entire conductor layer; and, forming an insulator layer having a relatively high dielectric constant on top of the insulator layer having a relatively low dielectric constant so as to surround said entire insulator layer having a relatively low dielectric constant.