Assertion: oxide film adhesiveness | /r/HasProperty | obtained
Facets:
Source sentences:
text: The copper alloy plate is used for an electric/electronic component such as a semiconductor lead frame and, on that occasion, a C1s/Cu2p ratio on a plate surface reduces to 0.35 or less and an excellent oxide film adhesiveness can be obtained by applying treatment including alkali cathode electrolytic cleaning as pretreatment of plating.