Assertion: wafer bonding | /r/HasProperty | a packaging technology
Facets:
value: for the fabrication of microelectromechanical systems
type: PURPOSE
value: on wafer-level
type: OTHER
Source sentences:
text: Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation.