Assertion: oxide film adhesiveness | /r/HasProperty | desired in recent years
Facets:
Source sentences:
text: With a Cu—Fe—P system copper alloy plate disclosed in Patent Literatures 1 and 2 however, it is impossible to materialize a higher level of oxide film adhesiveness which has been desired in recent years.
text: An object of the present invention is to provide a Cu—Fe—P system copper alloy plate having both a higher strength and a higher level of oxide film adhesiveness which has been desired in recent years in a composition substantially having a reduced Fe content of 0.5 mass % or less.
text: Further, by regulating an area ratio of fine crystal grains when the surface of a copper alloy plate according to the present invention is observed by EBSD analysis and C1s/Cu2p of the surface obtained by XPS analysis to 0.35 or less, it is possible to materialize a higher level of oxide film adhesiveness that has been desired in recent years.