Assertion: direct bonding | /r/HasProperty | flexible
Facets:
value: in processing numerous materials
type: TEMPORAL
value: highly
type: DEGREE
Source sentences:
text: Even though direct bonding is highly flexible in processing numerous materials, the mismatch of CTE (coefficient of thermal expansion) using different materials is a substantial restriction for wafer level bonding, especially the high annealing temperatures of direct bonding.