Assertion: thermosonic bonding | /r/HasProperty | hot work ultrasonic bonding
Facets:
value: by alexander coucoulas
type: OTHER
Source sentences:
text: Thermosonic bonding, initially referred to as Hot Work Ultrasonic Bonding by Alexander Coucoulas, was found to bond a wide range of conductive metals such as aluminum and copper wires to tantalum and palladium thin films deposited on aluminum oxide and glass substrates all of which simulated the metallized silicon chip.