Occupation: Semiconductor Processors
Task: Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.

Scale: Frequency of Task (Categories 1-7)
Category: 1
Value: 0 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 2
Value: 0.05 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 3
Value: 0.17 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 4
Value: 8.19 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 5
Value: 32 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 6
Value: 22.41 (N=40)
Source: Incumbent, 12/2006

Scale: Frequency of Task (Categories 1-7)
Category: 7
Value: 37.17 (N=40)
Source: Incumbent, 12/2006

Scale: Importance
Value: 4.39 (N=40)
Source: Incumbent, 12/2006

Scale: Relevance of Task
Value: 44.54 (N=89)
Source: Incumbent, 12/2006