Thermal and mechanical properties of lead-free SnZn-xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process
Authors: T. Gancarz, P. Bobrowski, J. Pstrus, S. Pawlak
Published in: J. Alloy Compd.
Publication type: article
Subject areas: Engineering; Materials Science
SJR best quartile: Q1