Results of tests of three-dimensionally integrated chips bonded to sensors
Authors: Deptuch, G.W., Carini, G., Collier, T. , Grybos, P. , Kmon, P. , Lipton, R. , Maj, P. , Trimpl, M. , Siddons, D.P. , Szczygiel, R. , Yarema, R.
Published in: 2013 IEEE NSS/MIC: Nuclear Science Symposium & Medical Imaging Conference, Seul, Korea, Wydawca:IEEE
Publication type: conference