Results of tests of three-dimensionally integrated chips bonded to sensors
Authors: Grzegorz W. Deptuch, Gabriella Carini, Terence Collier, PawełGryboś, PiotrKmon, Ronald Lipton, PiotrMaj, David P. Siddons, Robert Szczygieł, Raymond Yarema
Published in: IEEE Transaction on Nuclear Science
Publication type: article
Subject areas: Energy; Engineering; Physics and Astronomy
SJR best quartile: Q2