The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer
Authors: Paweł Malinowski, Tomasz Wandowski, Wiesław Ostachowicz
Published in: Structural Health Monitoring(tom: 14(4), strony: 332-344), Wydawca:SAGE Publications
Publication type: article
Subject areas: Biochemistry, Genetics and Molecular Biology; Engineering
SJR best quartile: Q1