Title: Results of tests of three-dimensionally integrated chips bonded to sensors
Authors: Grzegorz W. Deptuch, Gabriella Carini, Terence Collier, PawełGryboś, PiotrKmon, Ronald Lipton, PiotrMaj, David P. Siddons, Robert Szczygieł, Raymond Yarema
Journal: IEEE Transaction on Nuclear Science
Publication type: article
DOI: 10.1109/TNS.2014.2378784