Title: Development of a four-side buttable X-ray detection module with low dead area using the UFXC32k chips with TSVs
Authors: K. Kasiński, P. Gryboś, P. Kmon, P. Maj, R. Szczygieł, K. Zoschke
Journal: IEEE Transactions on Nuclear Science
Publication type: article
DOI: 10.1109/ECTC.2017.278