Title: Assesment of (Mn,Co)3O4 powders for possible coating material for SOFC/SOEC interconnects
Authors: D. Szymczewska, S. Molin, V. Venkatachalam, M. Chen, P. Jasinski and P.V. Hendriksen
Journal: 39th International Microelectronics and Packaging IMAPS Poland 2015 Conference
Publication type: conference
DOI: 10.1088/1757-899X/104/1/012017