Title: Impact of microstructure on the thermoelectric properties of the ternary compound Ce3Cu3Sb4
Authors: P. Witas, J. Goraus, P. Zajdel, K. Balin, J. Koperski, J. Lelątko, A. Ślebarski
Journal: Materials Characterization
Publication type: article
DOI: 10.1016/j.matchar.2016.11.031