Title: The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer
Authors: Paweł Malinowski, Tomasz Wandowski, Wiesław Ostachowicz
Journal: Structural Health Monitoring(tom: 14(4), strony: 332-344), Wydawca:SAGE Publications
Publication type: article
DOI: 10.1177/1475921715586625