Title: Thermal and mechanical properties of lead-free SnZn-xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process
Authors: T. Gancarz, P. Bobrowski, J. Pstrus, S. Pawlak
Journal: J. Alloy Compd.
Publication type: article
DOI: 10.1016/j.jallcom.2016.04.040