Spreadsheet: 113500d1309377436-cannot-solve-vlookup-mid-function-problem-autodecode
Sheet: Sheet2

(1) Memory Module(M) |  |  |  | (1) Memory Module(M)
M | Memory module |  |  | M | Memory Module
(2) Module Configuration |  |  |  | (2) Module Configuration
3 : 4/8 Byte DIMM
4 : 4/8 Byte SODIMM
(3)~(4) Data bit |  |  |  | (3)~(4) Data bit
11 : x72 184 pins VLP Registered DIMM
12 : x72 184pin 1U Register DIMM
28 : x72 208pin Register DIMM
32 : x32 160pin U-DIMM
37 : x72 240pin Non-JEDEC Registered DIMM
38 : x72 276pin Register DIMM of Socket Type
46 : x72 294pin Register DIMM with PLL
47 : x72 294pin Register DIMM with PLL
(512MB DIR2)
48 : x72 276pin Register DIMM of Socket Type
Tall DIMM
58 : x72 276pin Register DIMM(Low profile)
63 : x64 172pin U-DIMM
64 : x64 160pin U-DIMM
68 : x64 184pin U-DIMM
70 : x64 200pin SODIMM
71 : x64 204pin SODIMM
72 : x64 200pin VLP Unbuffered SODIMM
73 : x64 204pin VLP Unbuffered SODIMM
74 : x72 ECC SODIMM
78 : x64 240pin U-DIMM
79 : x64 240pin VLP Unbuffered DIMM
81 : x72 184pin U-DIMM
83 : x72 184pin Register DIMM
85 : x72 200pin U-DIMM
86 : x72 240pin LR-DIMM
87 : x72 240pin VLP LR-DIMM
88 : x72 200pin Register DIMM
90 : x72 240pin VLP U-DIMM
91 : x72 240pin U-DIMM
92 : x72 Very Low Profile(VLP)
93 : x72 240pin Register DIMM
94 : x72 [NAME]
95 : x72 240pin FB-DIMM
96 : x72 276pin Custom Buffered DIMM
97 : x72 276pin D/W Custom Buffered DIMM
98 : x72 276pin Register DIMM of Pin Type
※ VLP : Very Low Profile |  |  |  | ※ VLP : Very Low Profile
(5) Feature,Voltage |  |  |  | (5) Feature,Voltage
A : DDR4 SDRAM,1.2V
B : [NAME] SDRAM,1.5V
C : Network-DRAM,2.5V
L : DDR SDRAM,2.5V
T : DDR-Ⅱ,1.8V
(6)~(7) Depth |  |  |  | (6)~(7) Depth
09 : 8M(for 128Mb/512Mb)
17 : 16M(for 128Mb/512Mb)
2K : 2G(for 2Gb)
29 : 128M(for 128Mb/512Mb)
33 : 32M(for 128Mb/512Mb)
52 : 512M(512M(for 512Mb/2Gb)
57 : 256M(for 512Mb/2Gb)
65 : 64M(for 128Mb/512Mb)
1K : 1G(for 2Gb)
4G : 4G
8K : 8G(for 8Gb)
16 : 16M
2G : 2G
28 : 128M
32 : 32M
51 : 512M
56 : 256M
64 : 64M
1G : 1G
8G : 8G
4K : 4G(for 2Gb)
(8) # of bank in Comp.,Interface,[NAME] |  |  |  | (8) # of bank in Comp.,Interface,[NAME]
1 : 4bank,[NAME])
2 : 4bank,SSTL_2,64m/8K Refresh(7.8us)
3 : 8bank,POD(1.2V,1.2V,2.5V),64ms/8K(7.8us)
4 : 16bank,POD(1.2V,1.2V,2.5V),64ms/8K(7.8us)
5 : 4bank,SSTL(1.8V,1.8V),64ms/8K(7.8us)
6 : 8bank,SSTL(1.8V,1.8V),64ms/8K(7.8us)
7 : 8bank,SSTL(1.5V,1.5V),64ms/8K(7.8us)
V : 4bank,SSTL(1.8V,1.8V),64ms/8K(7.8us) JP向
W : 8bank,SSTL(1.8V,1.8V),64ms/8K(7.8us) JP向
(9) Composition Component |  |  |  | (9) Composition Component
0 : x4
3 : x8
4 : x16
6 : [NAME] (83+56 DSP)
7 : x8 Stack (83+56 DSP)
8 : [NAME])
9 : x8 Stack(Flexframe)
(10) Component Generation |  |  |  | (10) Component Generation
M : 1st Generation
A : 2nd Generation
B : 3rd Generation
C : 4th Generation
D : 5th Generation
E : 6th Generation
F : 7th Genation
G : 8th Generation
H : 9th Generation
I : 10th Generation
J : 11th Generation
K : 12th Generation
N : 14th Generation
O : 15th Generation
P : 16th Generation
Q : 17th Generation
R : 18th Generation
S : 19th Generation
(11) Package |  |  |  | (11) Package
2 : FBGA(LF,HF,2High TSV)
4 : FBGA(LF,HF,4High TSV)
6 : STSOP2(LF,HF)
A : BOC(HF,LF,Special)
B : FBGA(LF,HF)
D : BOC(LF,L)
E : BOC(HF,LF,QDP)
F : FCoM(LF,HF)
G : μBGA® packages
H : BOC(HF,LF)
J : FBGA(LF,DDP)
K : TSOP2-400(DDP)
L : TSOP2(LF,HF)
M : FBGA(HF,LF,DDP)
N : STSOP2
P : POC
Q : FBGA(LF,QDP)
R : FCoM
S : BOC(Smaller)
T : TSOP2-400
U : TSOP2-400(LF)
V : STSOP2(LF)
Y : BOC(LF,Smaller)
Z : BOC(LF)
※ 모듈을구성하는부품의유해물질유무를포함함 |  |  |  | ※ 모듈을구성하는부품의유해물질유무를포함함
HF : Halogen Free, LF : Lead Free |  |  |  | HF : Halogen Free, LF : Lead Free
※ Notes :μBGA® packages are registered |  |  |  | ※ Notes :μBGA® packages are registered
trademarks of Tessera. |  |  |  | trademarks of Tessera.
. PKG Option (M)→Mirror, (LF)→Lead Free |  |  |  | . PKG Option (M)→Mirror, (LF)→Lead Free
(12) PCB Revision &Type |  |  |  | (12) PCB Revision &Type
0 : None
1 : 1st Rev.
2 : 2nd Rev.
3 : 3rd Rev.
4 : 4th Rev.
A : Parity DIMM
B : Non Heat Spreader
C : Brand Business Module
D : Custom HS
E : Embedded PCB Design
H : DIMM with HS
L : Low Cost
M : New PC2700
N : Non ECC U-DIMM PCB
P : Custom PCB
Q : Custom PCB(OSP+Dummy Pad)
R : Custom PCB(RTT)
S : Reduced PCB Layer
T : Tall DIMM
U : 0.72 INCH PCB DIMM
W : Thermal Sensor on DIMM
(13) "-" |  |  |  | (13) "-"
(14) Power |  |  |  | (14) Power
B : Normal,Ultra Low Voltage
C : Normal, [NAME].
L : Low, [NAME].
K : Reduced,SelfRef.
Y : Commercial,Low Voltage
(15)~(16) Speed |  |  |  | (15)~(16) Speed
A0 : 10ns@CL2
A2 : 7.5ns@CL2
AA : 7.5ns@CL2,TRCD2,TRP2
B0 : 7.5ns@CL2.5
B3 : 6ns@CL2.5
B4 : 5ns@CL2.5
C4 : 5ns@CL3
C5 : 3.75ns@CL3
CC : 5ns@CL3,TRCD3,TRP3
CD : 4ns@CL3
CF : 3.75ns@CL3(1.9V)
D3 : 6ns@CL4
D4 : 5ns@CL4
D5 : 3.75ns@CL4
D6 : 3ns@CL4
D7 : 2.5ns@CL4
DA : 5.5ns@CL4
DH : 3ns@CL4(1.9V)
E5 : 3.75ns@CL5
E6 : 3.0ns@CL5
E7 : 2.5ns@CL5
E8 : 1.875ns@CL6
F0 : 1.5ns@CL9(1.25ns@CL7 O/C)
F7 : 2.5ns@CL6
F8 : 1.875ns@CL7
F9 : 1.5ns@CL7
G0 : 1.25ns@CL8
G7 : 2.5ns@CL7
G8 : 1.875ns@CL8
G9 : 1.5ns@CL8
H0 : 1.25ns@CL9
H9 : 1.5ns@CL9
J0 : 1.25ns@CL10
J9 : 1.5ns@CL10
K0 : 1.25ns@CL11
L0 : 1.25ns@CL12
[NAME] : 1.07ns@CL13
NA : 1.071ns@CL14
PB : 0.938ns@CL15
QB : 0.938ns@CL16
RC : 0.833ns@CL17
SC : 0.833ns@CL18
TD : 0.75ns@CL19
UD : 0.75ns@CL20
WE : 0.625ns@CL22
YE : 0.625ns@CL24
(17)~(18) Customer (Special Handling) |  |  |  | (17)~(18) Customer (Special Handling)
Customer List Reference |  |  |  | Customer List Reference