IPC - Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance
Autor: Marcelo Chirai | Publicado: 2017-01-19T21:26:00-02:00


Feed: IPC Blog
Posted on: sexta-feira, 20 de novembro de 2015 12:58
Author: IPC
Subject: IPC Standards Committee Reports — Printed Board Design, Cleaning &amp; Coating, Testing, Process Control, Product Assurance






IPC Standards Committee Reports

These
 standards committee reports from the 2015 Fall Standards Committee 
Meetings have been compiled to help keep you up to date on IPC standards
 committee activities. This is the first in the series of
 reports

Printed Board Design

The
 1-10c Test Coupon and Artwork Generation Task Group met to review the 
newly developed Users Guide for the IPC-2221B Gerber Coupon Generator 
that will be released for use by the industry in late 2015.&nbsp;
 The Generator allows for the creation of Gerber files for test coupon 
designs found in Appendix A of
IPC-2221B, Generic Standard on Printed Board Design.&nbsp; The group also reviewed a demo for a modification to the Gerber Coupon Generator for a propagated “D”
 coupon.

Cleaning and Coating

The 5-31g Stencil Cleaning Task Group met to work on IPC-7526,
Stencil and Misprinted Board Cleaning Handbook.
 Sections 1 and 2 were revised. Material compatibility, snapback, dry vs
 wet wipe, nano-coating stencils, and small openings were among the 
subjects
 discussed.

The
 5-31j Cleaning Compatibility Task Group met to discuss how to begin 
verification testing. They want to create acceptability levels for OEM 
and CM companies. Confirmation testing and test materials were
 discussed. Comments on document to be reviewed after the end of the 
year

The
 5-32a Ionic Conductivity Task Group discussed the status of several 
ongoing projects involving Ion Chromatography. This includes: method 
detection limit round robin testing, IC Webinar for the SMART group
 from Doug Pauls, Rockwell Collins, updating WP-008, extract correlation
 study, localized extraction, and the J-STD-001 ROSE effort.

The
 5-32b SIR and Electrochemical Migration Task Group met to discuss the 
statuses of several ongoing projects regarding SIR testing including: 
Round Robin study for hard wire vs test rack testing, discussion
 of several test methods, High Voltage SIR testing, and review of 
IPC-9203, B-52 Test Coupon User’s Guide.

The
 5-32c Bare Board Cleanliness Assessment Task Group met to finalize the 
decisions made regarding five Test methods. A study was initiated to 
support the update of IPC-5704,
Cleanliness Requirements for Unpopulated Boards in hopes of adding it as a requirement in IPC-6012,
Performance of Rigid Printed Boards.

The 5-32e Conductive Anodic Filament (CAF) Task Group continued the revision of IPC-9691,
User
 Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament 
(CAF) Resistance Test (Electrochemical Migration Testing)


The 5-33a Conformal Coating Task Group met to work on Revision C of

IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies.
 DWV/MIR white paper was presented and decisions were made regarding 
what to include
 in CC-830C. The new Test Coupon, B-54, was presented. 5-33AWG also met 
to work on the CC-830 Handbook. Plexus presented pictures for use by the
 committee and Electrolube UK showed presentation on coating 
performance.

The 5-33g Low Pressure Molding Task Group continues to address the Draft of IPC-7621,
Guideline
 for Design, Material Selection and General Application of Encapsulation
 of Electronic Circuit Assembly by Low Pressure Molding with 
Thermoplastics.

Testing

The
 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, 
StandS Group, for using XRF to determine phosphorous content in ENIG. 
There was a discussion of a Validation Process and Method Review
 for IPC methods. They proposed that the TAEC review all released Test 
Methods, new and revised. Also proposed that IPC could potentially 
provide validation for Test Method operators and auditing to ensure 
proper testing.

The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241,
Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F,
Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed.

The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM 2.6.7.2,
Thermal Shock and 2.6.27,
Thermal Stress. A PIN is to be drafted and discussed at the next teleconference.

Process Control

The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111,
Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review.

Product Assurance

The
 7-30 Product Assurance Committee reviewed the status of the projects in
 its scope and started planning for the meetings to be held in APEX 
2016.

The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610,
Acceptability for Electronic Assemblies.&nbsp;
The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610,
Acceptability for Electronic Assemblies, and IPC J-STD-001,
Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1.

The
 7-31bc Telecom Addendum Task Group met to continue discussions on the 
revision of the document. The Task Group plans to update the addendum 
using Revision F of IPC-A-610,
Acceptability for Electronic Assemblies as the base document.

The 7-31f Task Group responsible for IPC-A-620,
Requirements and Acceptance for Cable and Wire Harness Assemblies,
met to continue revision work on the document.

The 7-31j Task Group met to continue revising IPC-A-630,
Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures.&nbsp;
The Task Group also discussed and approved a new title for the standard that will be introduced with the revision.

The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620,
Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620,
Handbook and Guide to Supplement IPC-A-620.

The
 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the 
working draft IPC-A-640 into separate standards for design (IPC-D-640) 
and acceptance (IPC-A-640). Because most of the content for the
 design document is already on hand, the group will focus first on 
IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on 
IPC-A-640 near that time, with a goal to publish later in 2016.

The
 7-32c Electrical Continuity Task Group met to review industry responses
 to a survey on adjacency testing for bare printed board electrical 
test.&nbsp; Additional input on the need to specify a minimum retention
 period for electrical test data and clarification on when electrical 
testing for Class 3 product can be agreed upon between user and supplier
 drove the group to determine that a “B” revision to the IPC-9252,
Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release.

The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21,
Rework, Modification and Repair of Electronic Assemblies.



Filed under: Boards, 
Committees, IPC, 
Materials, Standards, 
Technical Tagged: cleaning and coating,
IPC standards committee reports,
printed board design,
process control, 
product assurance, testing 






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