环氧塑封料
参考

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↑  WO patent 2015045422A1,「Epoxy resin composition for use in sealing of semiconductors, and semiconductor-packaged structure and method for producing same」
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1 2 3  WO patent 2010079831A1,「Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition」
↑  WO patent WO2021049645A1,「Sealing material for compression molding and electronic component device」
↑  Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sungwoo; Lee, Jin Hee; Lee, Woong-Sun; Kim, Taek-Soo. . Polymer Testing. 2023-08-01, 125. ISSN 0142-9418. doi:10.1016/j.polymertesting.2023.108140.
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