Elektron göçü
Konuyla ilgili yayınlar

Black, J.R. (Nisan 1969). "Electromigration - A Brief Survey and Some Recent Results". IEEE Trans. on Electron Devices. 16 (4). ss. 338-347. doi:10.1109/T-ED.1969.16754.
Black, J.R. (Eylül 1969). "Electromigration Failure Modes in Aluminium Metallization for Semiconductor Devices". Proc. of the IEEE. 57 (9). ss. 1587-94. doi:10.1109/PROC.1969.7340.
Ho, P.S. (1982). "Basic problems for Electromigration in VLSI applications". Proc. of the IEEE. ss. 288-291.
Ho, P.S., Kwok T. (1989). "Electromigration in metals". Rep. Prog. Phys. Cilt 52. ss. 301-348. Bibcode:1989RPPh...52..301H. doi:10.1088/0034-4885/52/3/002. KB1 bakım: Birden fazla ad: yazar listesi (link)
Gardner, D.S., Meindl, J.D.,  Saraswat, K.C. (Mart 1987). "Interconnection and Electromigration Scaling Theory". IEEE Trans. on Electron Devices. 34 (3). ss. 633-643. doi:10.1109/T-ED.1987.22974. KB1 bakım: Birden fazla ad: yazar listesi (link)
Christou, Aris: Electromigration and Electronic Device Degradation. John Wiley & Sons, 1994.
Ghate, P.B.: Electromigration-Induced Failures in VLSI Interconnects, IEEE Conference Publication, Vol. 20:p 292 299, March 1982.
B.D. Knowlton, C.V. Thompson (1998). "Simulation of temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects". Material Research Society. 13 (5).
Changsup Ryu; Kee-Won Kwon; Loke, A.L.S.; Haebum Lee; Nogami, T.; Dubin, V.M.; Kavari, R.A.; Ray, G.W.; Wong, S.S.; (Haziran 1999). "Microstructure and Reliability of Copper Interconnects". IEEE Transactions on Electron Devices. 46 (6). ss. 1113-9. Bibcode:1999ITED...46.1113R. doi:10.1109/16.766872. KB1 bakım: Birden fazla ad: yazar listesi (link)
H.C. Louie Liu, S.P. Murarka: "Modeling of Temperature Increase Due to Joule Heating During Elektromigration Measurements. Center for Integrated Electronics and Electronics Manufacturing", Materials Research Society Symposium Proceedings Vol. 427:p. 113 119.
K. Banerjee, A. Mehrotra: Global (Interconnect) Warming. Circuits and Devices, pp. 16 32, September 2001.
K.N. Tu (2003). "Recent advances on electromigration in very-large-scale-integration of interconnects". Journal of Applied Physics. 94 (9). Bibcode:2003JAP....94.5451T. doi:10.1063/1.1611263.
J. Lienig, G. Jerke: Current-Driven Wire Planning for Electromigration Avoidance in Analog Circuits, Proc. of the 8th Asia and South Pacific Design Automation Conference (ASP-DAC), 2003, pp. 783–788.
G. Jerke,  J. Lienig (Ocak 2004). "Hierarchical Current Density Verification in Arbitrarily Shaped Metallization Patterns of Analog Circuits". IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 23 (1). ss. 80-90. doi:10.1109/TCAD.2003.819899.
Tarik Omer Ogurtani, Ersin Emre Oren (Haziran 2005). "Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces". Int. J. Solids Struct. 42 (13). ss. 3918-52. doi:10.1016/j.ijsolstr.2004.11.013.
J. Lienig: "Introduction to Electromigration-Aware Physical Design", (Download paper) 24 Eylül 2015 tarihinde Wayback Machine sitesinde arşivlendi. Proc. of the Int. Symposium on Physical Design (ISPD) 2006, pp. 39–46, April 2006.
Luhua Xu, John H.L. Pang and K.N. Tu (2006). "Effect of electromigration-induced back stress gradient on nano-indentation marker movement in SnAgCu solder joints". Applied Physics Letters. Cilt 89. s. 221909. Bibcode:2006ApPhL..89v1909X. doi:10.1063/1.2397549.
Fei Ren, Jae-Woong Nah, K. N. Tu, Bingshou Xiong, Luhua Xu, and John H. L. Pang (2006). "Electromigration induced ductile-to-brittle transition in lead-free solder joints". Applied Physics Letters. Cilt 89. s. 141914. Bibcode:2006ApPhL..89n1914R. doi:10.1063/1.2358113. KB1 bakım: Birden fazla ad: yazar listesi (link)
C. Basaran, M. Lin, and H. Ye (2003). "A Thermodynamic Model for Electrical Current Induced Damage". Int. J. of Solids and Structures. Cilt 40. ss. 7315-27. doi:10.1016/j.ijsolstr.2003.08.018. KB1 bakım: Birden fazla ad: yazar listesi (link)
Cher Ming Tan, Arijit Roy (2007). "Electromigration in ULSI interconnects". Materials Science and Engineering: R: Reports. Cilt 58. ss. 1-75. doi:10.1016/j.mser.2007.04.002.
Arijit Roy, Cher Ming Tan (2008). "Very High Current Density Package Level Electromigration Test for Copper Interconnects". J. Appl. Phys. Cilt 103. s. 093707. Bibcode:2008JAP...103i3707R. doi:10.1063/1.2917065.
| --- | --- |
Otorite kontrolü :  GND: 4296761-2 
SEM image of a failure caused by electromigration in a copper interconnect. The passivation has been removed by reactive ion etching and hydrofluoric acid