I have dealt with the tin whisker problem in the context of aerospace applications (both space-borne and terrestrial flight), including extensive consulting with subject matter experts from NASA.

The bottom line is quite simple:

Tin whisker growth onset is a stochastic process. We cannot predict when it will start and we cannot prevent it.

Once they start growing it is almost impossible to contain them. They will poke through conformal coatings such as parylene and arathane. If they don't, they will buckle (coil-up) under the coating.

While buckling sounds like a desirable outcome, this could lead to shorting of adjacent contacts in todays fine pitch integrated circuits and components.

Growth rate can be in the order of 10 mm per year. This means that adjacent leads of something as mundane as a SOIC-16 package can be shorted by a tin whisker in 28 days or less.

The take away is: There's nothing we can do about tin whiskers that is 100% guaranteed to prevent growth or slow it down by a non-trivial amount. The only path that prevents their growth is to use lead-based solder. This is why, as an example, we would do such things as send out BGA's with RoHS compliant solder balls to be re-balled with leaded solder.

Time for a bit of a rant: All my work in this area led me to look at the RoHS initiative as yet another example of something that, while well intentioned, it will likely have precisely the opposite effect from what was intended.

The fact that lead-free solder is susceptible to tin whisker growth means that 100% of all consumer electronic products are ticking time bombs when it comes to failures. This means that all kinds of consumer, commercial and industrial electronic products will fail over time in ways we might not be able to explain. The reason for this is that nobody does deep forensics when products fail. There is no reporting from the likes of Apple, Samsung, LG, Visio, Sony and myriad other manufacturers on failure rates and causes. In fact, they might not even have this data as consumer, commercial and industrial users simply replace the devices as they fail and move on.

In other words, it is likely RoHS has caused --or will cause-- massively more garbage in landfills. As a simple data point, my 40 year old HP-41 calculator still works perfectly fine. It is impossible to imagine a RoHS-compliant calculator not ending up in a landfill way earlier than 40 years.

There was a bit of a movement to roll back RoHS around the time it was being enacted. Going up against many nations and politicians using "save the planet" to get elected proved impossible for those who rightly brought-up that the transition to lead-free solder required far more research before we fully understood the potential consequences.

It wasn't about not wanting to go lead-free, it was about making the move when the science and math indicated that it would not create the massive problem we now likely have on our hands. The data on electronics waste due to tin whiskers is probably impossible to find. It might not even exist. Which is a tragedy.

If you want to learn more about this, here are a couple of good links:

https://nepp.nasa.gov/whisker./background/index.htm

https://nepp.nasa.gov/whisker/reference/tech_papers/kadesch2...

https://www.google.com/search?q=tin+whisker&hl=en&tbm=isch

https://web.calce.umd.edu/tin-whiskers/