Search query: more than moore

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abstract: More than Moore (MtM) technologies and associated practices are currently not clearly defined it is more of a concept for continued miniaturization of electronic systems than a tight definition of established practices and requirements. The technology direction is probably still best described by the concept chart published in 2005 edition of ITRS (International Technology Roadmap for Semiconductors 2005) and illustrated in Fig. 2.1. There is plenty of discussion ongoing in the industry for example under the umbrella of the ITRS 2.0 and its successors to define the scope and requirements for this class of technologies (Gargini 2016; International Technology Roadmap for Semiconductors 2.
author_names: Riko Radojcic
title: More than Moore Technology Opportunities: 2.5D SiP
year: 2019

abstract: Silicon circuits with increased functionality and device density can be created by directly integrating amorphous oxide semiconductor devices on top of them.
author_names: Hendrik Faber

Thomas D Anthopoulos
title: Adding a new layer to 'more than Moore'
venue: Nature Electronics
year: 2019

abstract: As the materials that the wafer dicing process need to singulate become more complex a diverging current Process of Record (PoR) dicing technologies are not able to meet the quality and or cost requirements. Laser provides the solution to dice all these different materials but has the challenge to achieve the die strength level specified. In this paper we will elaborate on the advances made to apply a laser full cut process while achieving the required die strength.
author_names: Jeroen van Borkulo

R Rogier Evertsen

Richard van der Stam
title: A More Than Moore Enabling Wafer Dicing Technology
venue: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
year: 2019

abstract: For Moore's law technology qualifications, the Back End of Line (BEOL) reliability focuses on electromigration, stress migration, Time Dependent Dielectric Breakdown (TDDB) and Chip Package Interaction (CPI) For More Than Moore technology qualifications, some additional BEOL reliability tests are often required. Power semiconductors used in automotive applications are exposed to higher temperatures and higher currents than devices used in consumer products. Hence, the BEOL reliability includes power temperature cycling stresses, high current pulsed stresses, high temperature storage above 200degC, and unique package connections such as 2mil Cu wirebonds or Cu clips.
author_names: Jeff P Gambino
title: BEOL Reliability for More Than Moore Devices
venue: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
year: 2018

abstract: Lithography requirements for Advanced Packaging MEMS are very different compared to mainstream semiconductor industries' needs. Even if the market entry barrier is much lower in the "More than Moore" market, customer adoptions needs are higher in the packaging area with respect to resolution, overlay, sidewall angle, and depth of focus (DOF) wafer handling for wafer bow and backside alignment. Key technical trends, requirements and challenges regarding the lithography technologies will be addressed in this paper. In addition, more insights on the current and emerging lithography methods for More than Moore devices will be included, as well as market forecast, competitive landscape of the major equipment suppliers addressing these fields.
author_names: Amandine Pizzagalli
title: Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices
venue: European Mask and Lithography Conference
year: 2018

abstract: The genomics community has frequently compared advances in sequencing to advances in microelectronics. Lately there have been many claims, including by the National Human Genome Research Institute (NHGRI) that genomics is outpacing developments in computing as measured by Moore's law the notion that computers double in processing capability per dollar spent every 18 24 months. Celebrations of the "$1000 genome" and other speed related sequencing milestones might be dismissed as a distraction from genomics' slowness in delivering clinical breakthroughs, but the fact that such celebrations have been persistently encouraged by the NHGRI reveals a great deal about the priorities and expectations of the American general public, the intended audience of the genomics computing comparison. By delving into the history of speculative thinking about sequencing and computing, this article demonstrates just how much more receptive to high risk/high payoff ventures the NIH and the general public have become. The article also provides access to some of the roots and consequences of the association of "innovation talk" with genomics, and the means to look past that association to the less glamorous (but arguably much more important) contributions of the NHGRI to building the field of genomics.
author_names: Joseph A November
title: More than Moore's Mores: Computers, Genomics, and the Embrace of Innovation
venue: Journal of the history of biology
year: 2018

abstract: As the planarization technology for multilayers develops to advance the miniaturization of the semiconductor devices, the market of chemical mechanical planarization (CMP) equipment/materials continues to expand in pursuit of "More Moore." In particular, the demand of for CMP technology for the miniaturization has increased owing to the upgrading of lithography technology, and the market has expanded. We consider that CMP market size correlates with developments in lithography. Among lithography generation changes, the advances in miniaturization, multilayer device packaging, and mounting boards are remarkable. In the future, more advanced packaging technology is required for Big Data, the Internet of Things (IoT) 5G communication, artificial intelligence (AI) and autonomous driving. To achieve the miniaturization of packaging technology, the crucial points are as follows: (i) it is necessary to use a stepper for lithography technology, and (ii) the stacking substrate must be accurately connected with a narrow pitch. We investigate the necessity of CMP technology on the basis of trends and future predictions.
author_names: Yasuhiko Takeno

Kazuya Okamoto
title: New market trend in CMP equipment/material for the "More than Moore" era
venue: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP IAAC)
year: 2018

abstract: Silicon nanowires (SiNW) are in the spotlight for a few years in the research community as a good candidate for biosensing applications. This is attributed to their small dimensions in nanometer sc
author_names: Ganesh Jayakumar
title: Silicon nanowire based devices for More than Moore Applications
year: 2018

abstract: Microelectronics is fundamentally a question of electronics chips and of the way to reduce their dimensions improving their performances. Trying to understand the route done in this field, we can mention that 50 years ago a small company called Intel released the 4004, its first ever microprocessor. This chip was immediately perceived as a sort of the eighth wonder of the world considering that the chip, measuring 12 mm 2 contained 2300 transistors. The distance between each transistor was around 10 mm. This is quite small, but always "thinkable" from a human point of view considering that with a small microscope they could be visible. Now if we take into account the transistors on one of the last Intel architecture, the Skylake chips, released by Intel in 2015, we observe that the chips themselves are 10 times the size of the 4004, but considering that the space between them is only 14 nm, definitively their transistors are invisible for common nonsophisticated measurement technique considering that these are around five times bigger than DNA molecules. This short history shows how the paradigm shift from micro to nano has strongly influenced electronics and the way to conceive it. This last has been forecast, up to now, by the Moore's law. But what is indeed the Moore's law and why it is so often quoted? Gordon Moore was the cofounder of Fairchild Semiconductor and Intel, whose 1965 seminal paper described a doubling every year in the number of components per integrated circuit and projected that this rate of growth would continue for at least another decade. This projection was "corrected" 10 years later in 1975; slowing the pace, he revised the forecast to doubling every 2 years.
author_names: Paolo Bondavalli
title: 6 Graphene, Microelectronics/Nanoelectronics, and More Than Moore
year: 2018

abstract: This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moores Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must read for any IC product team that is considering getting off the Moores Law track, and leveraging some of the More than Moore technology options for their next microelectronic product.
author_names: Riko Radojcic
title: More than Moore 2.5D and 3D SiP Integration
year: 2017