Search query: Technology Trends toward a System-in-a-Module in Power Electronics

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abstract: Currently, assemblies of power semiconductor switches and their associated drive circuitry are available in modules. From a few 100 watts downward, one finds silicon monolithic technology as the integration vehicle, while upward into the multi kilowatt range, mixed mode module construction is used. This incorporates monolithic, hybrid, surface mount and wirebond technology. However, a close examination of the applications in motor drives and power supplies indicates that there has been no dramatic volume reduction of the subsystem. The power semiconductor modules have shrunk the power switching part of the converter, but the bulk of the subsystem volume still comprises the associated control, sensing, electromagnetic power passives and interconnect structures. The paper addresses the improvement of power processing technology through advanced integration of power electronics. The goal of a subsystem in a module necessitates this advanced integration. The central philosophy of this technology development research is to advance the state of the art by providing the concept of integrated power electronics modules (IPEMs) The technology underpinning such an IPEM approach is discussed. The fundamental functions in electronic power processing, the materials, processes and integration approaches and future concepts are explained.
author_names: Fred C Lee

Jacobus Daniel van Wyk

Dushan Boroyevich

Guo-Quan Lu

Zhenxian Liang

Peter M Barbosa
title: Technology Trends toward a System in a Module in Power Electronics Technology Trends toward a System in a Module in Power Electronics
year: 2002

title: Trends toward a System ina Module in Power Electronics 4 Implementation Approaches for the Advanced Encryption Standard Algorithm 24 Systems and Circuits

abstract: Two factors, technology scaling and battery life in portable electronics, are accelerating the reduction in the supply voltage used for CMOS VLSI circuits beyond what might be expected from historical trends. While the scaling of transistor dimensions results in dramatic increases in both the speed and density of digital circuits, it also results in a corresponding increase in the electric fields within the device if the supply voltage is held constant. Breakdown considerations thus make it increasingly difficult to sustain the constant supply voltage that has characterized the past two decades of advances in CMOS technology. Moreover, lowering the supply voltage significantly reduces the energy consumed per operation in a digital system.
author_names: Shahriar Rabii

Bruce A Wooley
title: Trends Toward Low Voltage Power Supplies
year: 1999

abstract: With current trends toward increased power in smaller devices and packages, the search continues for high performance thermal management solutions for MOSFETs, high electron mobility transistors, and other power electronics. Microjet impingement cooling has been shown to produce high heat transfer capabilities for electronics cooling. In this paper, microjets based on well studied geometries were embedded within the substrate of a heat producing device, removing several layers of thermal resistance typically found in advanced packages. In contrast with competing liquid cooling solutions that use expensive materials and processes, industry standard silicon microfabrication techniques were used to build a low cost microjet cooler. Numerical analysis of the embedded microjet device showed average heat transfer coefficients greater than 250 kW/ \text {m}{2}\cdot \text {K} and low peak temperature rises in high power density devices. Using an innovative micro Raman thermography technique, experimental measurements with a 1 \mu \text{m} spatial resolution were taken, supporting the numerically predicted heat transfer coefficients on a device with a heat flux of over 5 kW/cm2 and a temperature rise of 46 degC. As devices continue to become miniaturized, both low cost embedded microjet cooling technology and micro Raman thermography may play a vital role in the design, operation, and evaluation of advanced high power density electronics.
author_names: Stephen Michael Ensign Walsh

Bernard A Malouin

Eric A Browne

Kevin R Bagnall

Evelyn N Wang

James P Smith
title: Embedded Microjets for Thermal Management of High Power Density Electronic Devices
venue: IEEE Transactions on Components, Packaging and Manufacturing Technology
year: 2019

abstract: Batteries are widely applied to the energy storage and power supply in portable electronics, transportation, power systems, communication networks, etc. They are particularly demanded in the emerging technologies of vehicle electrification and renewable energy integration for a green and sustainable society. To meet various voltage, power, and energy requirements in large scale applications, multiple battery cells have to be connected in series and/or parallel. While battery technology has advanced significantly in the past decade, existing battery management systems (BMSs) mainly focus on state monitoring and control of battery systems packed in fixed configurations. In fixed configurations, though, the battery system performance is in principle limited by the weakest cells, which can leave large parts severely underutilized. Allowing dynamic reconfiguration of battery cells, on the other hand, allows individual and flexible manipulation of the battery system at cell, module, and pack levels, which may open up a new paradigm for battery management. Following this trend, this paper provides an overview of next generation BMSs featuring dynamic reconfiguration. Motivated by numerous potential benefits of reconfigurable battery systems (RBSs) the hardware designs, management principles, and optimization algorithms for RBSs are sequentially and systematically discussed. Theoretical and practical challenges during the design and implementation of RBSs are highlighted in the end to stimulate future research and development.
author_names: Weiji Han

Torsten Wik

Anton Kersten

Guangzhong Dong

Changfu Zou
title: Next Generation Battery Management Systems: Dynamic Reconfiguration
year: 2020

abstract: The power electronics research community is balancing on the edge of a game changing technological innovation: as traditionally silicon (Si) based power semiconductors approach their material limitations, next generation wide bandgap (WBG) power semiconductors are poised to overtake them. Promising WBG materials are silicon carbide (SiC) gallium nitride (GaN) diamond (C) gallium oxide (Ga 2 O 3 and aluminum nitride (AlN) They can operate at higher voltages, temperatures, and switching frequencies with greater efficiencies compared to existing Si, in power electronics. These characteristics can reduce energy consumption, which is critical for national economic, health, and security interests. However, increased voltage blocking capability and trend toward more compact packaging technology for high power density WBG devices can enhance the local electric field that may become large enough to raise partial discharges (PDs) within the module. High activity of PDs damages the insulating silicone gel, lead to electrical insulation failure and reduce the reliability of the module. Among WBG devices, electrical insulation weaknesses in WBG based Insulated Gate Bipolar Transistor (IGBT) have been more investigated. The chapter deals with (a) current standards for evaluation of the insulation systems of power electronics modules, (b) simulation and modeling of the electric field stress inside modules, (c) diagnostic tests on modules, and (d) PD control methods in modules.
author_names: Mona Ghassemi
title: Electrical Insulation Weaknesses in Wide Bandgap Devices
year: 2018

abstract: The enabling of ac microgrids in distribution networks allows delivering distributed power and providing grid support services during regular operation of the grid, as well as powering isolated islands in case of faults and contingencies, thus increasing the performance and reliability of the electrical system. The high penetration of distributed generators, linked to the grid through highly controllable power processors based on power electronics, together with the incorporation of electrical energy storage systems, communication technologies, and controllable loads, opens new horizons to the effective expansion of microgrid applications integrated into electrical power systems. This paper carries out an overview about microgrid structures and control techniques at different hierarchical levels. At the power converter level, a detailed analysis of the main operation modes and control structures for power converters belonging to microgrids is carried out, focusing mainly on grid forming, grid feeding, and grid supporting configurations. This analysis is extended as well toward the hierarchical control scheme of microgrids, which, based on the primary, secondary, and tertiary control layer division, is devoted to minimize the operation cost, coordinating support services, meanwhile maximizing the reliability and the controllability of microgrids. Finally, the main grid services that microgrids can offer to the main network, as well as the future trends in the development of their operation and control for the next future, are presented and discussed.
author_names: Joan Rocabert

Alvaro Luna

Frede Blaabjerg

Pedro Rodriguez
title: Control of Power Converters in AC Microgrids
venue: IEEE Transactions on Power Electronics
year: 2012

abstract: Summary form only given. The energy efficiency of electronic circuits has dramatically improved over the past two decades. At the same time, computation, storage, and communication demands continue to grow with emerging wireless multimedia devices. In this inaugural Plenary Technology Roundtable event, experts will discuss the opportunities to achieve the next order of magnitude reduction in energy consumption across various domains, including analog, digital, RF, and memory. The line between analog and digital continues to blur, as analog circuits are enhanced by applying digital corrections to compensate for increased analog component variability with process scaling. As well, digital will incorporate more analog to become more adaptive; for example, to optimize operating voltages at a fine grain to match workloads and process variations. Memory circuits will need to use a system level approach which requires bit cell optimization, low voltage operation with integrated regulators, 3D Through Silicon Vias (TSV) and process optimization. RF transceivers will continue to trend toward highly digital architectures. The role of process technology innovation and CAD tools will also be discussed. Future process technology will deliver new transistor structures and higher mobility channel materials for low voltage digital circuits. TSVs will be important in reducing I/O power and the length of on chip interconnects. For RF, integrated inductors and transformers with significantly lower resistance will be the challenge. Future CAD tools optimizing energy will focus on co design of packaging, architecture, power sources, and antenna to provide the best system solution. Domain experts will challenge the distinguished panelists to suggest directions and help create a roadmap for next generation energy efficient electronics.
author_names: Jan M Rabaey

Hugo De Man

Mark Horowitz

Takayasu Sakurai

Jack Y -C Sun

Daniel W Dobberpuhl

Kiyoo Itoh

Philippe Magarshack

Asad A Abidi

Hermann Eul
title: Beyond the horizon: The next 10x reduction in power Challenges and solutions
venue: ISSCC
year: 2011

abstract: About the Editors. List of Contributors. Preface to the 2nd Edition. 1 Achievements and Challenges of Solar Electricity from Photovoltaics (Steven Hegedus and Antonio Luque) 1.1 The Big Picture. 1.2 What is Photovoltaics? 1.3 Photovoltaics Today. 1.4 The Great Challenge. 1.5 Trends in Technology. 1.6 Conclusions. 2 The Role of Policy in PV Industry Growth: Past, Present and Future (John Byrne and Lado Kurdgelashvili) 2.1 Introduction. 2.2 Policy Review of Selected Countries. 2.3 Policy Impact on PV Market Development. 2.4 Future PV Market Growth Scenarios. 2.5 Toward a Sustainable Future. 3 The Physics of the Solar Cell (Jeffery L. Gray) 3.1 Introduction. 3.2 Fundamental Properties of Semiconductors. 3.3 Solar Cell Fundamentals. 3.4 Additional Topics. 3.5 Summary. 4 Theoretical Limits of Photovoltaic Conversion and New generation Solar Cells (Antonio Luque and Antonio Marti) 4.1 Introduction. 4.2 Thermodynamic Background. 4.3 Photovoltaic Converters. 4.4 The Technical Efficiency Limit for Solar Converters. 4.5 Very high efficiency Concepts. 4.6 Conclusions. 5 Solar Grade Silicon Feedstock (Bruno Ceccaroli and Otto Lohne) 5.1 Introduction. 5.2 Silicon. 5.3 Production of Silicon Metal/Metallurgical Grade Silicon. 5.4 Production of Polysilicon/Silicon of Electronic and Photovoltaic Grade. 5.5 Current Silicon Feedstock to Solar Cells. 5.6 Requirements of Silicon for Crystalline Solar Cells. 5.7 Routes to Solar Grade Silicon. 5.8 Conclusions. 6 Bulk Crystal Growth and Wafering for PV (Hugo Rodriguez, Ismael Guerrero, Wolfgang Koch, Arthur L. Endros, Dieter Franke, Christian Hassler, Juris P. Kalejs and H. J. Moller) 6.1 Introduction. 6.2 Bulk Monocrystalline Material. 6.3 Bulk Multicrystalline Silicon. 6.4 Wafering. 6.5 Silicon Ribbon and Foil Production. 6.6 Numerical Simulations of Crystal Growth Techniques. 6.7 Conclusions. 7 Crystalline Silicon Solar Cells and Modules (Ignacio Tobias, Carlos del Ca"nizo and Jesus Alonso) 7.1 Introduction. 7.2 Crystalline Silicon as a Photovoltaic Material. 7.3 Crystalline Silicon Solar Cells. 7.4 Manufacturing Process. 7.5 Variations to the Basic Process. 7.6 Other Industrial Approaches. 7.7 Crystalline Silicon Photovoltaic Modules. 7.8 Electrical and Optical Performance of Modules. 7.9 Field Performance of Modules. 7.10 Conclusions. 8 High efficiency III V Multijunction Solar Cells (D. J. Friedman, J. M. Olson and Sarah Kurtz) 8.1 Introduction. 8.2 Applications. 8.3 Physics of III V Multijunction and Single junction Solar Cells. 8.4 Cell Configuration. 8.5 Computation of Series connected Device Performance. 8.6 Materials Issues Related to GaInP/GaAs/Ge Solar Cells. 8.7 Epilayer Characterization and Other Diagnostic Techniques. 8.8 Reliability and Degradation. 8.9 Future generation Solar Cells. 8.10 Summary. 9 Space Solar Cells and Arrays (Sheila Bailey and Ryne Raffaelle) 9.1 The History of Space Solar Cells. 9.2 The Challenge for Space Solar Cells. 9.3 Silicon Solar Cells. 9.4 III V Solar Cells. 9.5 Space Solar Arrays. 9.6 Future Cell and Array Possibilities. 9.7 Power System Figures of Merit. 9.8 Summary. 10 Photovoltaic Concentrators (Gabriel Sala and Ignacio Anton) 10.1 What is the Aim of Photovoltaic Concentration and What Does it Do? 10.2 Objectives, Limitations and Opportunities. 10.3 Typical Concentrators: an Attempt at Classification. 10.4 Concentration Optics: Thermodynamic Limits. 10.5 Factors of Merit for Concentrators in Relation to the Optics. 10.6 Photovoltaic Concentration Modules and Assemblies. 10.7 Tracking for Concentrator Systems. 10.8 Measurements of Cells, Modules and Photovoltaic Systems in Concentration. 10.9 Summary. 11 Crystalline Silicon Thin Film Solar Cells via High temperature and Intermediate temperature Approaches (Armin G. Aberle and Per I. Widenborg) 11.1 Introduction. 11.2 Modelling. 11.4 Crystalline Silicon Thin Film Solar Cells on Intermediate T Foreign Supporting Materials. 11.5 Conclusions. 12 Amorphous Silicon based Solar Cells (Eric A. Schiff, Steven Hegedus and Xunming Deng) 12.1 Overview. 12.2 Atomic and Electronic Structure of Hydrogenated Amorphous Silicon. 12.3 Depositing Amorphous Silicon. 12.4 Understanding a Si pin Cells. 12.5 Multijunction Solar Cells. 12.6 Module Manufacturing. 12.7 Conclusions and Future Projections. 13 Cu(InGa)Se2 Solar Cells (William N. Shafarman, Susanne Siebentritt and Lars Stolt) 13.1 Introduction. 13.2 Material Properties. 13.3 Deposition Methods. 13.4 Junction and Device Formation. 13.5 Device Operation. 13.6 Manufacturing Issues. 13.7 The Cu(InGa)Se2 Outlook. 14 Cadmium Telluride Solar Cells (Brian E. McCandless and James R. Sites) 14.1 Introduction. 14.2 Historical Development. 14.3 CdTe Properties. 14.4 CdTe Film Deposition. 14.5 CdTe Thin Film Solar Cells. 14.6 CdTe Modules. 14.7 Future of CdTe based Solar Cells. 15 Dye sensitized Solar Cells (Kohjiro Hara and Shogo Mori) 15.1 Introduction. 15.2 Operating Mechanism of DSSC. 15.3 Materials. 15.4 Performance of Highly Efficient DSSCs. 15.5 Electron transfer Processes. 15.6 New Materials. 15.7 Stability. 15.8 Approach to Commercialization. 15.9 Summary and Prospects. 16 Sunlight Energy Conversion Via Organics (Sam Shajing Sun and Hugh O'Neill) 16.1 Principles of Organic and Polymeric Photovoltaics. 16.2 Evolution and Types of Organic and Polymeric Solar Cells. 16.3 Organic and Polymeric Solar Cell Fabrication and Characterization. 16.4 Natural Photosynthetic Sunlight Energy Conversion Systems. 16.5 Artificial Photosynthetic Systems. 16.6 Artificial Reaction Centers. 16.7 Towards Device Architectures. 16.8 Summary and Future Perspectives. 17 Transparent Conducting Oxides for Photovoltaics (Alan E. Delahoy and Sheyu Guo) 17.1 Introduction. 17.2 Survey of Materials. 17.3 Deposition Methods. 17.4 TCO Theory and Modeling: Electrical and Optical Properties and their Impact on Module Performance. 17.5 Principal Materials and Issues for Thin Film and Wafer based PV. 17.6 Textured Films. 17.7 Measurements and Characterization Methods. 17.8 TCO Stability. 17.9 Recent Developments and Prospects. 18 Measurement and Characterization of Solar Cells and Modules (Keith Emery) 18.1 Introduction. 18.2 Rating PV Performance. 18.3 Current Voltage Measurements. 18.4 Spectral Responsivity Measurements. 18.5 Module Qualification and Certification. 18.6 Summary. 19 PV Systems (Charles M. Whitaker, Timothy U. Townsend, Anat Razon, Raymond M. Hudson and Xavier Vallve) 19.1 Introduction: There is gold at the end of the rainbow. 19.2 System Types. 19.3 Exemplary PV Systems. 19.4 Ratings. 19.5 Key System Components. 19.6 System Design Considerations. 19.7 System Design. 19.8 Installation. 19.9 Operation and Maintenance/Monitoring. 19.10 Removal, Recycling and Remediation. 19.11 Examples. 20 Electrochemical Storage for Photovoltaics (Dirk Uwe Sauer) 20.1 Introduction. 20.2 General Concept of Electrochemical Batteries. 20.3 Typical Operation Conditions of Batteries in PV Applications. 20.4 Secondary Electrochemical Accumulators with Internal Storage. 20.5 Secondary Electrochemical Battery Systems with External Storage. 20.6 Investment and Lifetime Cost Considerations. 20.7 Conclusion. 21 Power Conditioning for Photovoltaic Power Systems (Heribert Schmidt, Bruno Burger and Jurgen Schmid) 21.1 Charge Controllers and Monitoring Systems for Batteries in PV Power Systems. 21.2 Inverters. 22 Energy Collected and Delivered by PV Modules (Eduardo Lorenzo) 22.1 Introduction. 22.2 Movement between Sun and Earth. 22.3 Solar Radiation Components. 22.4 Solar Radiation Data and Uncertainty. 22.5 Radiation on Inclined Surfaces. 22.6 Diurnal Variations of the Ambient Temperature. 22.7 Effects of the Angle of Incidence and of Dirt. 22.8 Some Calculation Tools. 22.9 Irradiation on Most Widely Studied Surfaces. 22.10 PV Generator Behaviour Under Real Operation Conditions. 22.11 Reliability and Sizing of Stand alone PV Systems. 22.12 The Case of Solar Home Systems. 22.13 Energy Yield of Grid connected PV Systems. 22.14 Conclusions. 23 PV in Architecture (Tjerk H. Reijenga and Henk F. Kaan) 23.1 Introduction. 23.2 PV in Architecture. 23.3 BIPV Basics. 23.4 Steps in the Design Process with PV. 23.5 Concluding Remarks. 24 Photovoltaics and Development (Jorge M. Huacuz, Jaime Agredano and Lalith Gunaratne) 24.1 Electricity and Development. 24.2 Breaking the Chains of Underdevelopment. 24.3 The PV Alternative. 24.4 Examples of PV Rural Electrification. 24.5 Toward a New Paradigm for Rural Electrification. References. Index.
author_names: Antonio Luque

Steven Hegedus
title: Handbook of photovoltaic science and engineering
year: 2011

abstract: With high bandwidth and on demand applications continuing to emerge, next generation core optical networks will require significant improvements in capacity, configurability, and resiliency. These advancements need to be achieved with architectures and technologies that are scalable with respect to network cost, size, and power requirements. To investigate the limitations of extending today's solutions to meet these goals, a North American backbone network with a tenfold growth in traffic is modeled. The results of this paper illuminate at least three areas that will potentially require innovative solutions, namely 1) transmission modulation formats, 2) switching granularity, and 3) edge traffic grooming. In addition to probing issues related to increased capacity, configurability is also examined, mainly in the context of switching architectures. Advanced network protection is discussed as well, at a high level. A central theme is how to harness the trend of optics scaling better than electronics. Throughout this paper, potential advancements in architecture and technology are enumerated to serve as a foundation for the research needed to attain the goals of next generation core networks
author_names: Adel A M Saleh

Jane M Simmons
title: Evolution toward the next generation core optical network
venue: Journal of Lightwave Technology
year: 2006