Search query: signal integrity design and analysis of differential

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abstract: In this paper, we, for the first time, designed and analyzed differential high speed serial links of the silicon interposer including differential through silicon via (TSV) channels for a high bandwidth memory (HBM) graphic module. The meshed ground plane and various parameters were considered in designing the silicon interposer. In addition, superior designs were proposed to improve signal integrity (SI) for the differential channels in the redistribution layer, TSVs, and the meshed ground. SI of the silicon interposer was successfully analyzed, and the corresponding results were verified based on a full 3 D electromagnetic solver and circuit simulations. A number of RLGC parameters were extracted and calculated, then adopted to verify the simulation results. The simulation results for the differential characteristic impedance and insertion loss were compared with those of the equivalent circuit. A mixed mode conversion matrix was utilized to analyze differential mode transmission. Moreover, a model for differential TSV channels was proposed to precisely analyze the electrical characteristics. The eye diagram simulation was conducted to evaluate SI of the proposed designs in terms of an eye opening voltage and timing jitter. The eye opening voltage of the proposed design was 0.594 V, which is 45.69% of a peak to peak voltage of the assumed peripheral component interconnect (PCI) express 4.0 interfaces. It is expected that the analysis and design methodologies of differential high speed serial links for a silicon interposer could be widely adopted in the semiconductor industry.
author_names: Kyungjun Cho

Youngwoo Kim

Hyunsuk Lee

Jinwook Song

Junyong Park

Seongsoo Lee

Subin Kim

Gapyeol Park

Kyungjune Son

Joungho Kim
title: Signal Integrity Design and Analysis of Differential High Speed Serial Links in Silicon Interposer With Through Silicon Via
venue: IEEE Transactions on Components, Packaging and Manufacturing Technology
year: 2019

abstract: Precise regulation of the formation, maintenance, and remodeling of the vasculature is required for normal development, tissue response to injury, and tumor progression. How specific microRNAs intersect with and modulate angiogenic signaling cascades is unknown. Here, we identified microRNAs that were enriched in endothelial cells derived from mouse embryonic stem (ES) cells and in developing mouse embryos. We found that miR 126 regulated the response of endothelial cells to VEGF. Additionally, knockdown of miR 126 in zebrafish resulted in loss of vascular integrity and hemorrhage during embryonic development. miR 126 functioned in part by directly repressing negative regulators of the VEGF pathway, including the Sprouty related protein SPRED1 and phosphoinositol 3 kinase regulatory subunit 2 (PIK3R2/p85 beta) Increased expression of Spred1 or inhibition of VEGF signaling in zebrafish resulted in defects similar to miR 126 knockdown. These findings illustrate that a single miRNA can regulate vascular integrity and angiogenesis, providing a new target for modulating vascular formation and function.
author_names: Jason E Fish

Massimo Mattia Santoro

Sarah U Morton

Sangho Yu

Ru-Fang Yeh

Joshua D Wythe

Kathryn Nicole Ivey

Benoit G Bruneau

Didier Y R Stainier

Deepak Srivastava
title: miR 126 regulates angiogenic signaling and vascular integrity.
venue: Developmental cell
year: 2008

abstract: As data communication speed increases beyond 10 Gbps, designing for optimal signal integrity becomes critical to ensure reliable data. In the high speed board/package design, designers are trying to eliminate or minimize all the impedance mismatches along the high speed signal path. When multilayer board is used to increase the signal density, via structures are unavoidable to connect the signal, ground and power supply traces on different layers. High speed via transitions usually bring impedance discontinuities with them which will cause signal reflections and distortions compromising signal integrity. The deterioration of signal integrity will generate additional jitter and decrease the data eye opening ultimately jeopardizing the reliability of the data. This paper addresses designing for signal integrity at 10 Gbps by comparing the signal integrity of single ended and differential through hole vias for the designer. In each case, the impedance mismatch at the via transition can be minimized by optimizing a few parameters such as pitch size, via diameter, via height, excess via stub, antipad size and ground via locations. The impacts of these parameters are investigated with the help for a full wave electromagnetic simulation and verified by measurements.
author_names: Zuowei Shen

Jian Tong
title: Signal Integrity Analysis of High Speed Single Ended and Differential Vias
venue: 2008 10th Electronics Packaging Technology Conference
year: 2008

abstract: In September 1996 Boneh, Demillo, and Lipton from Bellcore announced a new type of cryptanalytic attack which exploits computational errors to find cryptographic keys. Their attack is based on algebraic properties of modular arithmetic, and thus it is applicable only to public key cryptosystems such as RSA, and not to secret key algorithms such as the Data Encryption Standard (DES)
author_names: Eli Biham

Adi Shamir
title: Differential Fault Analysis of Secret Key Cryptosystems
venue: CRYPTO
year: 1997

abstract: Signal integrity has become the key issue in most high performance digital designs. Now, from the foremost experts in the field, this book leverages theory and techniques from non related fields such as applied physics, communications, and microwave engineering and applies them to the field of high speed digital design. This approach creates an optimal combination of theory and practice that is meaningful to practicing engineers and graduate students alike.
author_names: Stephen H Hall

Howard Heck
title: Advanced Signal Integrity for High Speed Digital Designs
year: 2009

abstract: From the Publisher: The complete guide to understanding and designing for signal integrity Suitable for even non specialists, Signal Integrity Simplified offers a comprehensive, easy to follow look at how physical interconnects affect electrical performance. World class engineer Eric Bogatin expertly reviews the root causes of the four families of signal integrity problems and offers solutions to design them out early in the design cycle. Coverage includes: An introduction to signal integrity and physical design A fundamental understanding of what bandwidth, inductance, and characteristic impedance really mean Analysis of resistance, capacitance, inductance, and impedance The four important practical tools used to solve signal integrity problems: rules of thumb, analytic approximations, numerical simulation, and measurements The effect of the physical design of interconnects on signal integrity Solutions that do not hide behind mathematical derivations Recommendations for design guidelines to improve signal integrity, and much more Unlike related books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Specially designed for everyone in the electronics industry, from electrical engineers to product managers, Signal Integrity Simplified will prove itself an invaluable resource for helping you find and fix signal integrity problems before they become problems. ABOUT THE AUTHOR ERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.
author_names: Eric Bogatin
title: Signal Integrity Simplified
year: 2003

abstract: This paper reviews recent progress and future directions of signal integrity design for high speed digital circuits, focusing on four areas: signal propagation on transmission lines, discontinuity modeling and characterization, measurement techniques, and link path design and analysis.
author_names: Jun Fan

Xiaoning Ye

Jingook Kim

Bruce Archambeault

Antonio Orlandi
title: Signal Integrity Design for High Speed Digital Circuits: Progress and Directions
venue: IEEE Transactions on Electromagnetic Compatibility
year: 2010

abstract: This is a textbook on the structural analysis and design of highway pavements. It presents the theory of pavement design and reviews the methods developed by several organizations, such as the American Association of State Highway and Transportation Officials (AASHTO) the Asphalt Institute (AI) and the Portland Cement Association (PCA) It can be used for an undergraduate course by skipping the appendices or as an advanced graduate course by including them. The book is organized in 13 chapters. Chapter 1 introduces the historical development of pavement design, the major road tests, the various design factors, and the differences in design concepts among highway pavements, airport pavements, and railroad trackbeds. Chapter 2 discusses stresses and strains in flexible pavements. Chapter 3 presents the KENLAYER computer program, based on Burmister's layered theory, including theoretical developments, program description, comparison with available solutions, and sensitivity analysis on the effect of various factors on pavement responses. Chapter 4 discusses stresses and deflections in rigid pavements due to curling, loading, and friction, as well as the design of dowels and joints. Influence charts for determining stresses and deflections are also presented. Chapter 5 presents the KENSLABS computer program, based on the finite element method, including theoretical developments, program description, comparison with available solutions, and sensitivity analysis. Chapter 6 discusses the concept of equivalent single wheel and single axle loads and the prediction of traffic. Chapter 7 describes the material characterization for mechanistic empirical methods of pavement design including the determination of resilient modulus, fatigue and permanent deformation properties, and the modulus of subgrade reaction. Chapter 8 outlines the subdrainage design including general principles, drainage materials, and design procedures. Chapter 9 discusses pavement performance including distress, serviceability, skid resistance, nondestructive testing, and the evaluation of pavement performance. Chapter 10 illustrates the reliability concept of pavement design in which the variabilities of traffic, material, and geometric parameters are all taken into consideration. A probabilistic procedure, developed by Rosenblueth, is described and two probabilistic computer programs including VESYS for flexible pavements and PMRPD for rigid pavements are discussed. Chapter 11 outlines an idealistic mechanistic method of flexible pavement design and presents in detail the AI method and the AASHTO method, as well as the design of flexible pavement shoulders. Chapter 12 outlines an idealistic mechanistic method of rigid pavement design and presents in detail the PCA method and the AASHTO method. The design of continuous reinforced concrete pavements and rigid pavement shoulders is also included. Chapter 13 outlines the design of overlay on both flexible and rigid pavements including the AASHTO, AI, and PCA procedures. An Author Index and a Subject Index are provided.
author_names: Yang H Huang
title: Pavement analysis and design
year: 1992

abstract: The #1 Practical Guide to Signal Integrity DesignNow Updated with Extensive New Coverage!This book brings together up to the minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This editions extensive new content includes a brand new chapter on S parameters in signal integrity applications, and another on power integrity and power distribution network designtopics at the forefront of contemporary electronics design.Coverage includesA fully up to date introduction to signal integrity and physical designHow design and technology selection can make or break the performance of the power distribution networkExploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductancePractical techniques for analyzing resistance, capacitance, inductance, and impedanceSolving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurementUnderstanding how interconnect physical design impacts signal integrityManaging differential pairs and lossesHarnessing the full power of S parameters in high speed serial link applicationsEnsuring power integrity throughout the entire power distribution pathRealistic design guidelines for improving signal integrity, and much moreUnlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
author_names: Eric Bogatin
title: Signal and Power Integrity Simplified
year: 2009

abstract: In modern electronic systems, data rate is keeping increase, and Gbps becomes common, designing for reliable signal integrity becomes more and more important. In the high speed borad/package design, discontinuities are big concerns of signal integrity. A variety of sources lead to discontinuities and every source ought to be carefully treated. The signal via is one source of discontinuity that should not be overlooked. Vias can add jitter and reduce eye openings that can cause data misinterpretation by the receiver. This paper detail the antipad, pad and excess via stub effect on the vias. In each case, the impedance mismatch at the via transition can be minimized by optimizing a few parameters such as antipad radius, pad radius and excess via stub. The impacts of these parameters are investigated with the help for a full wave 3D electromagnetic simulator.
author_names: Ling Bao Zhao

Qing Hua Chen
title: Signal Integrity Analysis of High Speed Differential Vias
year: 2014