Search query: semiconductor inspection survey

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abstract: Abstract Automated visual inspection is an image processing technique for quality control and production line automation. This paper reviews various optical inspection approaches in the semiconductor industry and categorize the previous literatures by the inspection algorithm and inspected products. The vision based algorithms that had been adopted in the visual inspection systems include projection methods, filtering based approaches, learning based approaches, and hybrid methods. To discuss about the practical applications, the semiconductor industry covers the manufacturing and production of wafer, thin film transistor liquid crystal displays, and light emitting diodes. To improve the yield rate and reduce manufacturing costs, the inspection devices are widely installed in the design, layout, fabrication, assembly, and testing processes of production lines. To achieve a high robustness and computational efficiency of automated visual inspection, interdisciplinary knowledge between precision manufacturing and advanced image processing techniques is required in the novel system design. This paper reviews multiple defect types of various inspected products which can be referenced for further implementations and improvements.
author_names: Szu-Hao Huang

Ying-Cheng Pan
title: Automated visual inspection in the semiconductor industry: A survey
venue: Comput. Ind.
year: 2015

abstract: The effective decision of continuous increase of technological level and the economic efficiency of semiconductor manufacturing demands the adequate statistical models describing distribution of defects and yield. In the paper, motivated by semiconductor manufacturing, we study a problem of data association of condition of technological process.This work presents a yield analysis method using basic operating defect information to statistically define essential original causes of yield loss in semiconductor manufacturing. Using simple statistics on yield loss percent, this method provides the process list on influence of yield loss. This tool is also applied to selection of the most effective inspection tool. Complete understanding of the inspection equipment is not required for its statement. Analysis by sizes and types of defects provides decision and elimination of defects.The paper aspires to offer the model of yield loss percent distributions in semiconductor manufacturing based on estimations of operator technologists directly in the IC manufacturing. A wide range of alternative modeling approaches has been carried out up to now. Also the large variety of criteria and tests has been used to estimate of the forecast accuracy on various volume of dataset. Results offer a robust comparative tools if we have a full source of the information for process. The described method could be especially useful tool for the persons making decision. Besides, models allow to receive valuable forecasts for turning points when various improvements implemented into technological process. It allows to predict somewhat result of process and to catch a trend. This model may be extended for the yield forecasting using a similar approach.
author_names: Oleg V Stukach

Raushan Zh Aimagambetova
title: Model of the Yield Loss Factors Based on Survey Analysis for the Integrated Circuits Manufacturing
venue: 2019 International Seminar on Electron Devices Design and Production (SED)
year: 2019

abstract: The present invention provides a method of manufacturing a semiconductor device inspection apparatus, the inspection system, inspection methods, and inspection of the semiconductor device is completed, the inspection apparatus of the semiconductor device to the output signal of the semiconductor inspection apparatus, comprising: monitor means, that performs signal detection on the monitor line; a plurality of test circuits that are connected to the monitor line. Each test circuit includes: a support member of the semiconductor device, which semiconductor device can be provided, having a signal terminal and a signal input from the semiconductor device provided; a first resistor which is connected between the signal terminal and the monitor circuit; selector terminals; a first diode, which is the terminal side of the selector serves as a cathode is connected between the signal terminal and the selector terminal.
title: The method of producing a semiconductor device testing apparatus, the test system, test method, and a semiconductor device of the completion of the survey
year: 2012

abstract: In many industrial, medical and scientific image processing applications, various feature and pattern recognition techniques are used to match specific features in an image with a known template. Despite the capabilities of these techniques, some applications require simultaneous analysis of multiple, complex, and irregular features within an image as in semiconductor wafer inspection. In wafer inspection discovered defects are often complex and irregular and demand more human like inspection techniques to recognize irregularities. By incorporating neural network techniques such image processing systems with much number of images can be trained until the system eventually learns to recognize irregularities. The aim of this project is to develop aframework of a machine learning system that can produce caption to accurately describe images. Such a system finds application in semiconductor industry, biomedical field where microscopy for identifying different cell types and analysis of tumour growth etc. Also such systems help visually impaired people in understanding pictures. They can be used for providing alternate text for images in parts of the world where mobile connections are slow and making it easier for everyone to search on Google for images are also possible.
author_names: Gnana Sheela
title: Survey on Feature Extraction of Images for Appropriate Caption Generation
year: 2016

abstract: Optically Pumped Semiconductor Lasers OPSLs have been introduced in 2001. Their unique features such as power scalability and wavelength flexibility, their excellent beam parameters, power stability and reliability opened this pioneering technology access to a wide range of applications such as flow cytometry, confocal microscopy, sequencing, medical diagnosis and therapy, semiconductor inspection, graphic arts, forensic, metrology. This talk will introduce the OPSL principles and compare them with ion, diode and standard solid state lasers. It will revue the first 10 years of this exciting technology, its current state and trends. In particular currently accessible wavelengths and power ranges, frequency doubling, ultra narrow linewidth possibilities will be discussed. A survey of key applications will be given.
author_names: Christian Kannengiesser

Vasiliy G Ostroumov

Volker Pfeufer

Wolf Seelert

Christoph Simon

Rudiger von Elm

Andreas Zuck
title: Ten years optically pumped semiconductor lasers: review, state of the art, and future developments
venue: LASE
year: 2010

abstract: This paper presents some of the techniques used to introduce simulation of semiconductor fabrication processes to undergraduate electrical engineering students at the American University of Sharjah. Students use Silvaco Athena process simulator and Atlas device simulator to perform experiments on semiconductor fabrication processes. Simulation results are compared with the theoretically expected results. As semiconductor process simulation tools can respond to user initiated actions in real time, breaking the process at any point of time permits the visual inspection of the intermediate and final results. Therefore, these tools are found to be effective in the learning process. A survey is conducted at the end of each semester to assess the ability of the students to perform semiconductor process simulation. Experience indicates that there is considerable increase in the confidence level of the students in terms of their understanding of semiconductor processes and devices.
author_names: M Narayanan

Hasan Al-Nashash
title: Introducing undergraduate students to simulation of semiconductor doping techniques
venue: Comput. Electr. Eng.
year: 2009

abstract: A cross sectional survey of semiconductor factories was conducted to identify the ergonomic risk factors in the work processes, the prevalence of body pain among workers, and the relationship between body pain and work processes. A total of 906 women semiconductor workers took part in the study. In wafer preparation and polishing, a combination of lifting weights and prolonged standing might have led to high pain prevalences in the low back (35.0% wafer preparation, 41.7% wafer polishing) and lower limbs (90.0% wafer preparation, 66.7% wafer polishing) Semiconductor front of line workers, who mostly walked around to operate machines in clean rooms, had the lowest prevalences of body pain. Semiconductor assembly middle of line workers, especially the molding workers, who did frequent lifting, had high pain prevalences in the neck/shoulders (54.8% and upper back (43.5 In the semiconductor assembly end of line work section, chip inspection workers who were exposed to prolonged sitting without back support had high prevalences of neck/shoulder (62.2% and upper back pain (50.0% while chip testing workers who had to climb steps to load units had a high prevalence of lower limb pain (68.0% Workers in the assembly of electronic components, carrying out repetitive tasks with hands and fingers, and standing in awkward postures had high pain prevalences in the neck/shoulders (61.5% arms (38.5% and hands/wrists (30.8%
author_names: Heng Leng Chee

Krishna Gopal Rampal

Abherhame Chandrasakaran
title: Ergonomic risk factors of work processes in the semiconductor industry in Peninsular Malaysia.
venue: Industrial health
year: 2004

abstract: In todays Semiconductor Manufacturing Industry it is becoming more difficult to utilize the human operator as the visual process control vehicle so as to cost effectively achieve statistical process defect goals. Machine vision continues to make inroads cost effectively improving manufacturing visual inspection requirements driving and sustaining desired process control capabilities. This paper will attempt to survey the attributes of automatic visual process monitoring within the Motorola Semiconductor Assembly Manufacturing environment. Such factors as defect control objectives inspection requirements vision engine platform application engineering and long term application maintenance all of which contribute to the costeffectiveness of the automatic visual inspection task.
author_names: Christopher J LeBeau
title: Machine vision platform requirements for successful implementation and support in the semiconductor assembly manufacturing environment
venue: Other Conferences
year: 1991

abstract: Abstract A study was undertaken to determine the feasibility of obtaining high reliability devices for long term space missions and military applications by imposing and monitoring additional process quality controls and screening procedures on standard commercial production lines. A survey of more than a dozen semiconductor manufacturers indicated that the following reliability areas are not adequately controlled: metallization, wire bonding, loose conductive particles and ceramic packages sealed by low melting point glasses. Wide variations were found in the manner in which the bond strength test is carried out. Methods were studied to institute SEM inspection and a more rigorous bond strength test on the production lines, coupled with wafer and bonder traceability. This report surveys reliability problems caused by defects in semiconductor devices and their control.
author_names: Alan G Stanley
title: Procurement of Reliable Semiconductor Devices for Military Space Applications
year: 1972

abstract: To be productive and profitable in a modern semiconductor fabrication environment, large amounts of manufacturing data must be collected, analyzed, and maintained. This data is increasingly being used to design new processes, control and maintain tools, and to provide the information needed for rapid yield learning and prediction. Towards this end, a significant level of investment has been made over the past decade to bring to maturity viable technologies for Automatic Defect Classification (ADC) as a means of automating the recognition and analysis of defect imagery captured during in line inspection and off line review. ADC has been developed to provide automation of the tedious manual inspection processes associated with defect review. Although significant advances have been achieved in the capabilities of ADC systems today, concerns continue to persist regarding effective integration, maintenance, and usability of commercial ADC technologies. During the summer of 2001, the Oak Ridge National Laboratory and International SEMATECH performed an industry survey of eight major semiconductor device manufacturers to address the issues of ADC integration, usability, and maintenance for the various in line inspection and review applications available today. The purpose of the survey was to determine and prioritize those issues that inhibit the effective adoption, integration, and application of ADC technology in today's fabrication environment. In this paper, we will review the various ADC technologies available to the semiconductor industry today and discus the result of the survey.
author_names: Kenneth W Tobin

Fred Lakhani

Thomas P Karnowski
title: Industry survey of automatic defect classification technologies, methods, and performance
venue: SPIE Advanced Lithography
year: 2002