Search query: Physical Failure Analysis OR Scanning Electron Microscopy

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abstract: Abstract This chapter addresses the issues of the electron beam radiation damage that are commonly encountered during physical failure analysis (PFA) in the modern semiconductor industry by scanning electron microscopy, focus ion beam, and transmission electron microscopy. We discussed the effects of electron beam radiation on the phase, microstructure, and compositions of some typical electron beam sensitive materials used in semiconductor devices, such as low k and ultralow k dielectrics, silicon nitrides, and CoFeB ferromagnetic materials. Based on the detailed case study and analysis, we elaborated on the underlying mechanisms associated with the electron radiation of different materials. Meanwhile, comprehensive technical solutions were proposed to minimize the electron beam radiation damages during the PFA of these special types of materials.
author_names: Binghai Liu

Xiaomin Li

Younan Hua

Nan Cho

Zhili Dong

Yuzhe Zhao

Kenny Ong

Zhiqiang Mo
title: Electron beam radiation and its impacts to failure analysis in semiconductor industry
year: 2020

abstract: In view of the external thread fracture during casing running in a well in Xinjiang Oilfield, the failure reasons of thread fracture were analyzed by combining the theory with experiment, and the casing safe service window with harsh working conditions was given. The operation of the failed casing and determined the actual working conditions of the casing threaded joints during the running process were investigated in this paper. According to the theoretical method, the boundary conditions and load conditions of the fracture casing joint in service were determined. With the aid of full scale physical simulation test device, as well as the above boundary conditions and load conditions, the same batch casing tensile bearing characteristics were determined. Through nondestructive testing, the metallographic observation, scanning electron microscopy, spectral analysis and up and down test, the main controlling factors of casing thread fracture were determined. By the finite element analysis, the casing threads service state under axial tension and bending loads was established, the safety performance of threads under ideal working conditions was studied, and the fatigue mechanism of threads was revealed. Combined with the analysis results, the corresponding relationship between the casing tensile bearing characteristics and safety factor was given, which provides technical support for the safe service selection of casing body and thread under harsh conditions, saving cost and shortening the well construction period.
author_names: Rong Li Nan

Xin Sun

Bo Zhao Shu

Hang Wang

Shang-yu Yang

Cai Hong Lu

Li Hong Han
title: Threaded Failure Analysis for Three Dimensional Horizontal Wells Casing
year: 2020

abstract: Friction and wear take place on two solid surfaces in sliding contact as a result of the mechanical, thermal, and chemical interactions with the participation of environmental species. These interactions lead to the formation of a tribo layer or tribofilm, which attaches on the worn surfaces, and consequently, contributes to the variation of the friction and wear behaviour. Electron microscopy and the associated spectroscopic analyses are powerful in probing these matters in spatial resolutions from micro to atomic scale. This article provides a review of the author's work in the wear and friction mechanisms of physical vapour deposition (PVD) hard coatings, in which various scanning electron microscope (SEM)and transmission electron microscope (TEM) based microscopic and spectroscopic techniques were employed. Understanding on the failure mechanisms and the origin of self adaptive friction has been improved to the nano scale. Other related issues are also discussed, such as sample preparation techniques for cross sectional electron microscopy, energy dispersive X ray spectroscopy, and electron energy loss spectroscopy.
author_names: Quanshun Luo
title: Electron Microscopy and Spectroscopy in the Analysis of Friction and Wear Mechanisms
year: 2018

abstract: Friction and wear take place on two solid surfaces in sliding contact as a result of the mechanical, thermal, and chemical interactions with the participation of environmental species. These interactions lead to the formation of a tribo layer or tribofilm, which attaches on the worn surfaces, and consequently, contributes to the variation of the friction and wear behaviour. Electron microscopy and the associated spectroscopic analyses are powerful in probing these matters in spatial resolutions from micro to atomic scale. This article provides a review of the author's work in the wear and friction mechanisms of physical vapour deposition (PVD) hard coatings, in which various scanning electron microscope (SEM) and transmission electron microscope (TEM) based microscopic and spectroscopic techniques were employed. Understanding on the failure mechanisms and the origin of self adaptive friction has been improved to the nano scale. Other related issues are also discussed, such as sample preparation techniques for cross sectional electron microscopy, energy dispersive X ray spectroscopy, and electron energy loss spectroscopy.
author_names: Quanshun Luo
title: Electron Microscopy and Spectroscopy in the Analysis of Friction and Wear Mechanisms
year: 2018

abstract: The elbow plays a crucial role in changing the flow direction of the medium in pipeline system and is one of the most commonly used pipeline components in the oil and gas transportation. This paper focuses on the corrosive failure mechanism of the elbow of regeneration tower of LPG desulfurization unit in a refinery. Aiming at the failure elbow, based on the macro and micro perspectives, the physical laws of the inner layer of the elbow, including the distribution of corrosion holes and wall thickness, are summarized and analyzed. The further characterization methods were used to study the corrosion mechanism, including mechanical properties, metallographic examination, X ray diffraction analysis (XRD) scanning electron microscopy (SEM) and energy spectrum analysis (EDS) Taking the thief hole as center, the elbow was divided into 4 rows. It is found that the maximum diameter was 21.1 mm while the minimum was 7.76 mm, and the vast majority of holes were 16 19 mm. The average size of the middle section was larger, meanwhile, possessed most holes over 19 mm. The corrosion thickness first increased then decreased along the flow direction and reached the maximum in completely destroyed area of the 1st and 2nd row. The corrosion thickness increased gradually along the flow direction of the 3rd and 4th row. Erosion corrosion is the main cause of elbow failure. Fluid erosion plays a dominant role in the failure process while electrochemical corrosion plays a dominant role in the formation of corrosion holes. Besides, the presence of heat stable salts (HSS) also aggravates the corrosion of elbow.
author_names: Zou Jianwen

Shao Guoqing

Wang Chuan-sheng
title: Corrosion Failure Analysis of Elbow in LPG Desulfurization Unit
year: 2019

abstract: This tutorial will describe the novel technique of using leading edge 3D X Ray Microscopy (XRM) technology to complement physical cross section in Failure Analysis (FA) and 3DIC package development workflows. Contrary to popular believe that "3D X Ray" is too slow, we explain how XRM, a new 3D X Ray variant technique differs from conventional 3D X Ray Micro Computed Tomography (MicroCT) and can be optimized to provide non destructive, near SEM imaging of a sample within 10300min throughput time (TPT) depending on its physical properties material composition, critical feature dimensions, and sample size. The specifics of the inspection technique itself and how X rays interact with the sample to achieve high quality images will be discussed. Example images comparing and correlating optical and Scanning Electron Microscope (SEM) images taken from a physical crosssection and a virtual cross section images taken from XRM scans will be shown (Figures 1 and 2)
author_names: Luke Hunter
title: Non Destructive 3D X Ray Microscopy to Complement Physical Cross Section in the Failure Analysis and Package Development Workflows
year: 2013

abstract: With the development of IC manufacturing industry, plastic encapsulated MOS components have been widely applied. Since higher performance requirement from users, the research on the reliability of plastic encapsulated MOS components is especially important. Through researching the common failure mechanism of plastic encapsulated MOS component, the physical and chemical processes of each failure mechanism are analyzed. In addition, some researches on the relationship among EOS (Electrical Over Stress) EM(Electro migration) and ESD(Electrostatic discharge) have been completed. By study about the methods of failure analysis of plastic encapsulated MOS component, SAM (Scanning Acoustic Microscope) and SEM(Scanning Electron Microscope) are identified as the most important methods in failure analysis. According to the achievement of these researches, the procedure of failure analysis has been optimized by adding microscopy sample preparation. This improvement makes the analysis in chip surface extend to chip section. In the case study, with this new procedure, a plastic encapsulated MOSFET has been analyzed. As a result, this failure is caused by the source drain breakdown. Combining with the mechanism of EOS and EM, the direction of current in PN junction which is breakdown has been identified.
author_names: Yang Yang

Liangxue Cai

Peng Li

Haotian Lu
title: Failure analysis of plastic encapsulated MOS component from chip section
venue: 2017 Second International Conference on Reliability Systems Engineering (ICRSE)
year: 2017

abstract: Abstract In the recent years, localization of subtle defects has required device electrical data. Nanoprobing systems based on scanning electron microscopy (SEM) or atomic force microscopy (AFM) have become a significant tool for device measurement in failure analysis (FA) Labs. Failure Analysts can use electrical characteristics to isolate failure location in the metal oxide semiconductor field effect transistor (MOSFET) The missing lightly doped drain (LDD) implant is an example of a critical failure mechanism for the MOSFET and cell in the SRAM which is localized using nanoprobing. In this article, device data analysis and theoretical deductions are discussed related to missing LDD doping. Device data is used to propose a full set of characteristic for missing LDD. The simulation from a mature tool is able to support the electrical characteristics. The capability and challenge of the following physical FA to reveal the defect are also discussed.
author_names: Li-Lung Lai

Xiaojing Wu
title: The device characteristics of missing LDD implantation via nanoprobing techniques for localized failure analysis
venue: Microelectron. Reliab.
year: 2015

abstract: The automobile power steering pump failure was an accident caused by multiple parts fracture coexistence.Means such as chemical compositions analysis,hardness test,macro and micro analysis,scanning electron microscopy and energy spectrum analysis,as well as other approaches were used to analyze the failure causes of an automobile power steering pump.According to the results obtained from physical testing and chemical analysis,and considering the functions and load capacity of each part when the pump was in operation,it was found out that the blade was the primary fracture part,and the reason for the blade fracture was that there were severe long string shape inclusion defect in the blade.
author_names: Dunlop Da

Cnr Grou
title: Failure Analysis on an Automobile Power Steering Pump
year: 2015

abstract: This paper presents an investigation into the reliability and physical degradation mechanisms associated with the loss of battery performance. Cells from two different manufactures underwent cycle life testing until failure (defined as a 20% decrease in nominal capacity) Designated samples from each battery type were subjected to one of two different discharge methods, one at a constant discharge rate of 1C and the other at a constant discharge rate of 0.5C. A third group of batteries were collected and examined after undergoing catastrophic failure in field applications. The tape pull test (to test adhesion/cohesion of electrode material to current collectors) is introduced for the first time in battery literature. Other analysis techniques such as x ray imaging and environmental scanning electron microscopy were used to investigate the structural and chemical degradation of all the samples. Statistical analysis was performed on the cycle life data to evaluate battery reliability.
author_names: Nicholas Dane Williard

Michael D Osterman

Michael G Pecht
title: Reliability and failure analysis of Lithium Ion batteries for electronic systems
venue: 2012 13th International Conference on Electronic Packaging Technology High Density Packaging
year: 2012