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Chip Quik Solder Paste in jar 250g (T3) SAC305 no clean
Description Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Alloy Flux Type Synthetic No-Clean Flux Classification REL0 Metal Content 88.5% metal by weight. Particle Size T3 (25-45 microns) Melting Point Size 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C >4 hours @ 50-70% RH 22-28C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage

Price is $55.00

Price: $54.95